Texas Instruments | BQ33100 Super Capacitor Manager (Rev. C) | Datasheet | Texas Instruments BQ33100 Super Capacitor Manager (Rev. C) Datasheet

Texas Instruments BQ33100 Super Capacitor Manager (Rev. C) Datasheet
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BQ33100
SLUS987C – JANUARY 2011 – REVISED DECEMBER 2019
BQ33100 Super Capacitor Manager
1 Features
2 Applications
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Fully integrated 2-, 3-, 4-, and 5-series Super
Capacitor Manager
Can be used with up to 9-series capacitors
without individual integrated capacitor monitoring
and balancing
Active capacitor voltage balancing
– Prevents super capacitor overvoltage during
charging
Capacitor health monitoring
– Capacitance learning
– ESR measurement
– Operation status
– State-of-charge
– State-of-health
– Charging voltage and current reports
– Safety alerts with optional pin indication
Integrated protection monitoring and control
– Overvoltage
– Short circuit
– Excessive temperature
– Excessive capacitor leakage
2-wire SMBus serial communications
High-accuracy 16-bit delta-sigma ADC with a 16channel multiplexer for measurement
– Used for voltage, current, and temperature
Low power consumption
– < 660 µA in NORMAL operating mode
– < 1 µA in SHUTDOWN mode
Wide operating temperature: –40°C to +85°C
RAID systems
Server blade cards
UPS
Medical and test equipment
Portable instruments
3 Description
The Texas Instruments BQ33100 Super Capacitor
Manager is a fully integrated, single-chip solution that
provides a rich array of features for charge control,
monitoring, and protection for either 2-, 3-, 4-, or 5series super capacitors with individual capacitor
monitoring and balancing or up to 9-series capacitors
with only the stack voltage being measured. With a
small footprint of 7.8 mm × 6.4 mm in a compact 24pin TSSOP package, the BQ33100 maximizes
functionality and safety while dramatically increasing
ease of use and cutting the solution cost and size for
super capacitor applications.
Device Information(1)
PART NUMBER
BQ33100
PACKAGE
TSSOP (24)
BODY SIZE (NOM)
7.80 mm × 4.40 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Simplified Schematic
PWR
DC INPUT
Main Pwr Rail
PWR
System Load
Memory, CPU, etc...
bq24640
Supercap Charger
CHGLVL0,1
SuperCap
Pack
2s...9s
CHG
PWR
bq33100
Supercap Monitor
PWR
V, I and T
Measurements
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
BQ33100
SLUS987C – JANUARY 2011 – REVISED DECEMBER 2019
www.ti.com
Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Description (Continued) ........................................
Pin Configuration and Functions .........................
Specifications.........................................................
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
7.10
7.11
7.12
7.13
7.14
7.15
7.16
7.17
7.18
1
1
1
2
4
4
5
Absolute Maximum Ratings ...................................... 5
ESD Ratings.............................................................. 5
Recommended Operating Conditions....................... 6
Thermal Information .................................................. 6
Electrical Characteristics: General Purpose I/O........ 6
Supply Current .......................................................... 7
REG27 LDO .............................................................. 7
Coulomb Counter ...................................................... 7
ADC........................................................................... 7
External Capacitor Voltage Balance Drive.............. 8
Capacitor Voltage Monitor ...................................... 8
Internal Temperature Sensor .................................. 8
Thermistor Measurement Support .......................... 8
Internal Thermal Shutdown..................................... 8
High-Frequency Oscillator....................................... 8
Low-Frequency Oscillator ....................................... 9
RAM Backup ........................................................... 9
Flash ....................................................................... 9
7.19
7.20
7.21
7.22
8
10
10
11
12
Detailed Description ............................................ 12
8.1
8.2
8.3
8.4
8.5
9
Current Protection Thresholds ..............................
Current Protection Timing .....................................
Timing Requirements: SMBus ..............................
Typical Characteristics ..........................................
Overview .................................................................
Functional Block Diagram .......................................
Feature Description.................................................
Device Functional Modes........................................
Programming...........................................................
12
14
14
29
30
Application and Implementation ........................ 52
9.1 Application Information............................................ 52
9.2 Typical Application ................................................. 53
10 Power Supply Recommendations ..................... 55
11 Layout................................................................... 55
11.1 Layout Guidelines ................................................. 55
11.2 Layout Example .................................................... 56
12 Device and Documentation Support ................. 59
12.1
12.2
12.3
12.4
12.5
Documentation Support .......................................
Support Resources ...............................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
59
59
59
59
59
13 Mechanical, Packaging, and Orderable
Information ........................................................... 59
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision B (December 2015) to Revision C
Page
•
Changed Recommended Operating Conditions .................................................................................................................... 6
•
Changed OC Dsg ................................................................................................................................................................ 43
•
Changed OC Dsg Time ....................................................................................................................................................... 44
•
Changed SC Dsg Cfg .......................................................................................................................................................... 45
•
Changed SC Chg Cfg .......................................................................................................................................................... 46
•
Changed Initial 1st Capacitance .......................................................................................................................................... 47
•
Changed Capacitance ......................................................................................................................................................... 47
•
Changed Measurement Margin % ....................................................................................................................................... 50
•
Changed Max Dsg Time ...................................................................................................................................................... 51
•
Changed V Chg Nominal ..................................................................................................................................................... 51
•
Changed V Chg A ................................................................................................................................................................ 51
•
Changed V Chg B ................................................................................................................................................................ 51
•
Changed V Chg Max ........................................................................................................................................................... 51
•
Changed Min Voltage ........................................................................................................................................................... 51
•
Changed Learning Frequency ............................................................................................................................................. 52
2
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Changes from Revision A (March 2011) to Revision B
Page
•
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section .................................................................................................. 1
•
OperationStatus() register bit 9 change from RSVD to CHGOR.......................................................................................... 38
Changes from Original (January 2011) to Revision A
Page
•
Changed SYSTEM PARTITIONING DIAGRAM................................................................................................................... 14
•
Changed Voltage as Current During Learning graphic. ....................................................................................................... 15
•
Changed equation 1 denominator from (V[D] - [C]) to (V[C] - V[D])..................................................................................... 15
•
Changed Application Reference Schematic. ........................................................................................................................ 53
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5 Description (Continued)
Using its integrated high-performance analog peripherals, the BQ33100 battery manager measures and
maintains an accurate record of available capacitance, state-of-health, voltage, current, temperature, and other
critical parameters in super capacitors, and reports the information to the system host controller over a 2-wire
SMBus 1.1 compatible interface.
The BQ33100 provides firmware-controlled protection on overvoltage, overtemperature, and overcharge, along
with hardware-controlled protection for overcurrent in discharge and short circuit protection during charge and
discharge.
6 Pin Configuration and Functions
PW Package
24-Pin TSSOP
Top View
VCCPACK
1
24
VCC
NC
2
23
CHG
VC1
3
22
NC
VC2
4
21
CHGOR
VC3
5
20
REG27
VC4
6
19
GND
SRP
7
18
RBI
SRN
8
17
LLEN
TS
9
16
SCL
VC5
10
15
FAULT
CHGLVL0
11
14
SDA
CHGLVL1
12
13
VC5BAL
Not to scale
Pin Functions
PIN
NAME
NO.
TYPE (1)
DESCRIPTION
CHG
23
O
P-Channel FET drive for controlling charge
CHGLVL0
11
O
Charge Control Output 0
CHGLVL1
12
O
Charge Control Output 1
CHGOR
21
I
CHG override input. If not used, connect to VSS.
FAULT
15
O
Active high output to indicate fault condition
GND
19
P
Ground
LLEN
17
O
Learn Load Enable Output
NC
2
O
Not used and must be connected to VCC
NC
22
—
No connect. Leave the NC pin floating.
RBI
18
P
RAM backup pin to provide backup potential to the internal DATA RAM if power is momentarily lost by using
a capacitor attached between RBI and GND.
REG27
20
P
Internal power supply 2.7-V bias output
SCL
16
I/OD
Serial clock input: Clocks data on SDA
SDA
14
I/OD
Serial data: transmits and receives data
SRN
8
IA
Analog input pin connected to the internal ADC peripheral for measuring a small voltage between SRP and
SRN where SRN is the bottom of the sense resistor.
SRP
7
IA
Analog input pin connected to the internal ADC peripheral for measuring a small voltage between SRP and
SRN where SRP is the top of the sense resistor.
TS
9
IA
Thermistor input
VC1
3
IA
Sense voltage input terminal and external capacitor voltage balancing drive output for the 5th-series
capacitor, and stack measurement input. See Series Capacitor Configuration for systems with less than 5
series.
(1)
4
I = Input, O = Output, P = Power, IA = Analog Input, OD = Open Drain
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Pin Functions (continued)
PIN
NAME
NO.
TYPE (1)
DESCRIPTION
VC2
4
IA
Sense voltage input terminal and external capacitor voltage balancing drive output for the 4th-series
capacitor. See Series Capacitor Configuration for systems with less than 5 series.
VC3
5
IA
Sense voltage input terminal and external capacitor voltage balancing drive output for the 3rd-series
capacitor. See Series Capacitor Configuration for systems with less than 5 series.
VC4
6
IA
Sense voltage input terminal and external capacitor voltage balancing drive output for the 2nd-series
capacitor. See Series Capacitor Configuration for systems with less than 5 series.
VC5
10
IA
Sense voltage input terminal and external capacitor voltage balancing drive output for the 1st capacitor. See
Series Capacitor Configuration for systems with less than 5 series.
VC5BAL
13
O
Cell balance control output for the least positive capacitor (only used in a 5-series capacitor configuration)
VCCPACK
1
P
Power supply from the super capacitors. The top of the super capacitor stack must be connected to this pin.
VCC
24
P
Positive input from power supply
7 Specifications
7.1 Absolute Maximum Ratings
Over operating free-air temperature range (unless otherwise noted) (1)
VMAX
Supply voltage
VCC w.r.t. GND
MIN
MAX
UNIT
–0.3
34
V
VVC2 – 0.3
VVC2 + 8.5 or
34, whichever
is lower
V
VC1, VCC
VIN
Input voltage
VO
Output voltage
VC2
VVC3 – 0.3
VVC3 + 8.5
V
VC3
VVC4 – 0.3
VVC4 + 8.5
V
VC4
VSRP – 0.3
VSRP + 8.5
V
SRP, SRN
–0.3
VREG27
V
SDA, SCL
–0.3
6.0
V
CHGOR
–0.3
VCC
V
TS, VC5, CHGLVL0, CHGLVL1, FAULT
–0.3
VREG27 + 0.3
V
CHG
–0.3
VCC
V
VC5BAL
–0.3
VREG27 + 0.3
V
RBI, REG27
–0.3
2.75
V
ISS
Maximum combined sink current for input pins
50
mA
TFUNC
Functional temperature
–40
110
°C
Tstg
Storage temperature
–65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±2000
Charged-device model (CDM), per JEDEC specification JESD22-C101 (2)
±500
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
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7.3 Recommended Operating Conditions
Over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage
25
VCC
3.8
VSTARTUP
Start up voltage at VCC
VSHUTDOWN
VCC or VCCPACK, whichever is higher
VIN
NOM
Input voltage
VVC2 + 5
3
5.5
V
3.2
3.3
V
VC1, VCC
VVC2
VVC2 + 5
VC2
VVC3
VVC3 + 5
VC3
VVC4
VVC4 + 5
VC4
VSRP
VSRP + 5
VCn – VC(n + 1), (n=1, 2, 3, 4 )
0
5
VC5
0
1
0
VCC – 0.3
–0.3
1
SRP to SRN
TOPR
Operating temperature
V
25
CHGOR
External 2.7-V REG capacitor
V
5.2
VCC
CREG27
UNIT
1
V
V
µF
–40
85
°C
7.4 Thermal Information
BQ33100
THERMAL METRIC (1)
PW (TSSOP)
UNIT
24 PINS
RθJA
Junction-to-ambient thermal resistance
83.6
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
16.5
°C/W
RθJB
Junction-to-board thermal resistance
39.4
°C/W
ψJT
Junction-to-top characterization parameter
0.4
°C/W
ψJB
Junction-to-board characterization parameter
38.8
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
—
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report (SPRA953).
7.5 Electrical Characteristics: General Purpose I/O
Typical values stated where TA = 25°C and VCC = VCC = 14.4 V, minimum and maximum values stated where TA = –40°C to
85°C and VCC = VCC = 3.8 V to 25 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
VIH
High-level input voltage
SDA, SCL, TS, VC5
VIL
Low-level input voltage
SDA, SCL, TS, VC5
VOH
Output voltage high
SDA, SCL, VC5BAL, CHGLVL0, CHGLVL1, LLEN,
FAULT, IL = –0.5 mA
VOL
Low-level output voltage
SDA, SCL, VC5BAL, CHGLVL0, CHGLVL1, LLEN,
FAULT, IL = 7 mA
CIN
Input capacitance
MAX
VREG27 – 0.5
VCHGOR
CHG override active high
RPD(SMBx)
SDA and SCL pulldown
TA = –40°C to 100°C
RPAD
Pad resistance
TS
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V
V
0.4
5
Input leakage current
UNIT
V
0.8
SDA, SCL, TS, VC5, CHGLVL0, CHGLVL1, LLEN,
FAULT
SDA and SCL pulldown disabled
Ilkg
6
TYP
2
V
pF
1
µA
0.8
2
3.2
V
600
950
1300
kΩ
87
110
Ω
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7.6 Supply Current
Typical values stated where TA = 25°C and VCC = VCC = 14.4 V, minimum and maximum values stated where TA = –40°C to
85°C and VCC = VCC = 3.8 V to 25 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
ICC
NORMAL mode
Firmware running, no flash writes
660
ISHUTDOWN
SHUTDOWN mode
TA = –40°C to 110°C
0.5
MAX
UNIT
µA
1
µA
7.7 REG27 LDO
Typical values stated where TA = 25°C and VCC = VCC = 14.4 V, minimum and maximum values stated where TA = –40°C to
85°C and VCC = VCC = 3.8 V to 25 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
2.5
2.7
2.75
V
At REG27
2.22
2.35
2.34
V
At REG27
2.25
2.5
2.6
V
±2
±4
mV
±20
±40
mV
50
mA
VREG–
Regulator output voltage
IREG27 = 10 mA
VREG27IT–
Negative-going POR voltage
VREG27IT+
Positive-going POR voltage
ΔV(REGTEMP)
Regulator output change with
IREG = 10 mA
temperature
ΔV(REGLINE)
Line regulation
IREG = 10 mA
ΔV(REGLOAD)
Load regulation
IREG = 0.2 to 10 mA
I(REGMAX)
Current limit
TA = –40°C to 85°C
TA = –40°C to 85°C
±0.5%
25
7.8 Coulomb Counter
Typical values stated where TA = 25°C and VCC = VCC = 14.4 V, minimum and maximum values stated where TA = –40°C to
85°C and VCC = VCC = 3.8 V to 25 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
Input voltage range
TYP
–0.2
UNIT
0.25
Conversion time
Single conversion
Effective resolution
Single conversion
Integral nonlinearity
TA = –25°C to 85°C
±0.007%
Offset error (1)
TA = –25°C to 85°C
10
V
250
ms
15
Bits
Offset error drift
Full-scale error (2)
–0.8%
±0.034%
FSR
µV
0.3
0.5
0.2%
0.8%
Full-scale error drift
µV/°C
150 PPM/°C
Effective input resistance
(1)
(2)
MAX
2.5
MΩ
Post calibration performance
Uncalibrated performance. This gain error can be eliminated with external calibration.
7.9 ADC
Typical values stated where TA = 25°C and VCC = VCC = 14.4 V, minimum and maximum values stated where TA = –40°C to
85°C and VCC = VCC = 3.8 V to 25 V (unless otherwise noted)
PARAMETER
Input voltage range
TEST CONDITION
MIN
TS, VC5
TYP
–0.2
Conversion time
16
Effective resolution
14
V
ms
Bits
15
Integral nonlinearity
Bits
±0.02%
Offset error (1)
70
Offset error drift
FSR
160
µV
1
VIN = 1 V
–0.8%
Full-scale error drift
±0.2%
µV/°C
0.4%
150
Effective input resistance
(1)
UNIT
31.5
Resolution (no missing codes)
Full-scale error
MAX
0.8 × VREG27
PPM/°C
8
MΩ
Channel to channel offset
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7.10 External Capacitor Voltage Balance Drive
Typical values stated where TA = 25°C and VCC = VCC = 14.4 V, minimum and maximum values stated where TA = –40°C to
85°C and VCC = VCC = 3.8 V to 25 V (unless otherwise noted)
PARAMETER
RBAL_drive
Internal pulldown
resistance for
external capacitor
voltage balance
TEST CONDITIONS
MIN
TYP
Capacitor voltage balance ON for VC1,
VCi – VCi + 1 = 4 V, where i = 1 to approximately 4
5.7
Capacitor voltage balance ON for VC2,
VCi – VCi + 1 = 4 V, where = i = 1 to approximately 4
3.7
Capacitor voltage balance ON for VC3,
VCi – VCi + 1 = 4 V, where = i = 1 to approximately 4
1.75
Capacitor voltage balance ON for VC4,
VCi – VCi + 1 = 4 V, where = i = 1 to approximately 4
0.85
MAX
UNIT
kΩ
7.11 Capacitor Voltage Monitor
Typical values stated where TA = 25°C and VCC = VCC = 14.4 V, minimum and maximum values stated where TA = –40°C to
85°C and VCC = VCC = 3.8 V to 25 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
CAPACITOR Voltage Measurement Accuracy
TYP
MAX
TA = –10°C to 60°C
MIN
±10
±20
TA = –40°C to 85°C
±10
±35
UNIT
mV
7.12 Internal Temperature Sensor
Typical values stated where TA = 25°C and VCC = VCC = 14.4 V, minimum and maximum values stated where TA = –40°C to
85°C and VCC = VCC = 3.8 V to 25 V (unless otherwise noted)
PARAMETER
T(TEMP)
TEST CONDITIONS
MIN
Temperature sensor accuracy
TYP
MAX
UNIT
±3%
°C
7.13 Thermistor Measurement Support
Typical values stated where TA = 25°C and VCC = VCC = 14.4 V, minimum and maximum values stated where TA = –40°C to
85°C and VCC = VCC = 3.8 V to 25 V (unless otherwise noted)
PARAMETER
RERR
Internal resistor drift
R
Internal resistor
TEST CONDITIONS
MIN
TYP
MAX
–230
TS
UNIT
ppm/°C
17
20
kΩ
7.14 Internal Thermal Shutdown
Typical values stated where TA = 25°C and VCC = VCC = 14.4 V, minimum and maximum values stated where TA = –40°C to
85°C and VCC = VCC = 3.8 V to 25 V (unless otherwise noted)
PARAMETER (1)
TMAX
Maximum REG27 temperature
TRECOVER
Recovery hysteresis temperature
(1)
TEST CONDITIONS
MIN
TYP
125
MAX
UNIT
175
°C
10
°C
Parameters assured by design. Not production tested
7.15 High-Frequency Oscillator
Typical values stated where TA = 25°C and VCC = VCC = 14.4 V, minimum and maximum values stated where TA = –40°C to
85°C and VCC = VCC = 3.8 V to 25 V (unless otherwise noted)
PARAMETER
f(OSC)
Frequency error (1)
t(SXO)
Start-up time (2)
8
MIN
TYP
TA = –20°C to 70°C
–2%
±0.25%
2%
TA = –40°C to 85°C
–3%
±0.25%
3%
3
6
Operating frequency of CPU clock
f(EIO)
(1)
(2)
TEST CONDITIONS
MAX
2.097
TA = –25°C to 85°C
UNIT
MHz
ms
The frequency drift is included and measured from the trimmed frequency at VCC = VCC = 14.4 V, TA = 25°C.
The start-up time is defined as the time it takes for the oscillator output frequency to be ±3% when the device is already powered.
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7.16 Low-Frequency Oscillator
Typical values stated where TA = 25°C and VCC = VCC = 14.4 V, minimum and maximum values stated where TA = –40°C to
85°C and VCC = VCC = 3.8 V to 25 V (unless otherwise noted)
PARAMETER
f(LOSC)
Operating frequency
f(LEIO)
Frequency error (1)
t(LSXO)
Start-up time (2)
(1)
(2)
TEST CONDITIONS
MIN
TYP
MAX
UNIT
32.768
MHz
TA = –20°C to 70°C
–1.5%
±0.25%
1.5%
TA = –40°C to 85°C
–2.5%
±0.25%
2.5%
TA = –25°C to 85°C
100
ms
The frequency drift is included and measured from the trimmed frequency at VCC = VCC = 14.4 V, TA = 25°C.
The start-up time is defined as the time it takes for the oscillator output frequency to be ±3%.
7.17 RAM Backup
Typical values stated where TA = 25°C and VCC = VCC = 14.4 V, minimum and maximum values stated where TA = –40°C to
85°C and VCC = VCC = 3.8 V to 25 V (unless otherwise noted)
PARAMETER
I(RBI)
V(RBI)
(1)
RBI data-retention input current
TEST CONDITIONS
MIN
VRBI > V(RBI)MIN, VREG27 < VREG27IT-,
TA = 70°C to 110°C
TYP
MAX
20
1500
UNIT
nA
VRBI > V(RBI)MIN, VREG27 < VREG27IT-,
TA = –40°C to 70°C
500
RBI data-retention voltage (1)
1
V
Specified by design. Not production tested
7.18 Flash
Typical values stated where TA = 25°C and VCC = VCC = 14.4 V, minimum and maximum values stated where TA = –40°C to
85°C and VCC = VCC = 3.8 V to 25 V (unless otherwise noted)
PARAMETER (1)
TEST CONDITIONS
Data retention
Row programming time
t(MASSERASE)
t(PAGEERASE)
ICC(PROG)
Flash-write supply current
ICC(ERASE)
Flash-erase supply current
(1)
TYP
MAX
10
Flash programming write-cycles
t(ROWPROG)
MIN
UNIT
Years
20k
Cycles
2
ms
Mass-erase time
250
ms
Page-erase time
25
ms
4
6
mA
TA = –40°C to 0°C
8
22
TA = 0°C to 85°C
3
15
mA
Specified by design. Not production tested
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7.19 Current Protection Thresholds
Typical values stated where TA = 25°C and VCC = VCC = 14.4 V, minimum and maximum values stated where TA = –40°C to
85°C and VCC = VCC = 3.8 V to 25 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
V(OCD)
OCD detection threshold voltage range, typical
ΔV(OCDT)
OCD detection threshold voltage program step
V(SCCT)
SCC detection threshold voltage range, typical
ΔV(SCCT)
SCC detection threshold voltage program step
V(SCDT)
SCD detection threshold voltage range, typical
ΔV(SCDT)
SCD detection threshold voltage program step
V(OFFSET)
SCD, SCC and OCD offset
V(Scale_Err)
SCD, SCC and OCD scale error
MIN
TYP
MAX
RSNS = 0
50
200
RSNS = 1
25
100
RSNS = 0
10
RSNS = 1
5
RSNS = 0
RSNS = 1
RSNS = 0
RSNS is set in
STATE_CTL
register
–300
–50
–225
–50
RSNS = 0
100
450
RSNS = 1
50
225
50
RSNS = 1
25
mV
mV
–25
RSNS = 0
mV
mV
–100
RSNS = 1
UNIT
mV
mV
–10
10
–10%
10%
mV
7.20 Current Protection Timing
Typical values stated where TA = 25°C and VCC = VCC = 14.4 V, minimum and maximum values stated where TA = –40°C to
85°C and VCC = VCC = 3.8 V to 25 V (unless otherwise noted)
MIN
t(OCDD)
Overcurrent in discharge delay
t(OCDD_STEP)
OCDD step options
t(SCDD)
Short circuit in discharge delay
t(SCDD_STEP)
SCDD step options
t(SCCD)
Short circuit in charge delay
t(SCCD_STEP)
SCCD step options
t(DETECT)
Current fault detect time
tACC
Overcurrent and short circuit
delay time accuracy
10
NOM
1
MAX
31
2
0
915
AFE.STATE_CNTL[SCDDx2] = 1
0
1830
61
AFE.STATE_CNTL[SCDDx2] = 1
122
0
915
35
µs
µs
160
Accuracy of typical delay time with WDI active
–20%
20%
Accuracy of typical delay time with no WDI
input
–50%
50%
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µs
µs
61
VSRP-SRN = VTHRESH + 12.5 mV,
TA = –40°C to 85°C
ms
ms
AFE.STATE_CNTL[SCDDx2] = 0
AFE.STATE_CNTL[SCDDx2] = 0
UNIT
µs
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7.21 Timing Requirements: SMBus
Typical values stated where TA = 25°C and VCC = VCC = 14.4 V, minimum and maximum values stated where TA = –40°C to
85°C and VCC = VCC = 3.8 V to 25 V (unless otherwise noted)
MIN
fSMB
SMBus operating frequency
Slave mode, SCL 50% duty cycle
fMAS
SMBus master clock frequency
Master mode, no clock low slave extend
tBUF
Bus free time between start and stop
tHD:STA
Hold time after (repeated) start
tSU:STA
Repeated start setup time
tSU:STO
Stop setup time
tHD:DAT
Data hold time
tSU:DAT
Data setup time
tTIMEOUT
Error signal and detect
tLOW
Clock low period
NOM
10
MAX
UNIT
100
kHz
51.2
kHz
4.7
µs
4
µs
4.7
µs
4
µs
Receive mode
0
Transmit mode
300
ns
250
See
(1)
ns
25
35
4.7
ms
µs
tHIGH
Clock high period
See
(2)
50
µs
tLOW:SEXT
Cumulative clock low slave extend
time
See
(3)
25
ms
tLOW:MEXT
Cumulative clock low master extend
time
See
(4)
10
ms
300
ns
1000
ns
tF
Clock and data fall time
See
(5)
tR
Clock and data rise time
See
(6)
(1)
(2)
(3)
(4)
(5)
(6)
4
The BQ33100 times out when any clock low exceeds tTIMEOUT.
tHIGH maximum is the minimum bus idle time. SCL = SDA = 1 for t > 50 µs causes reset of any transaction involving BQ33100 that is in
progress.
tLOW:SEXT is the cumulative time a slave device is allowed to extend the clock cycles in one message from initial start to the stop.
tLOW:MEXT is the cumulative time a master device is allowed to extend the clock cycles in one message from initial start to the stop.
Rise time tR = VILMAX – 0.15) to (VIHMIN + 0.15)
Fall time tF = 0.9 VDD to (VILMAX – 0.15)
t LOW
tR
tF
t HD:STA
SCL
t SU:STA
t HIGH
t HD:STA
t HD:DAT
t SU:STO
t SU:DAT
SDATA
t BUF
P
S
S
P
Figure 1. SMBus Timing
Start
Stop
t LOW:SEXT
t LOW:MEXT
SCLACK
1
t LOW:MEXT
SCLACK
1
t LOW:MEXT
SCL
SDATA
Figure 2. SMBus tTIMEOUT
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33.4
2.735
33.2
2.730
33
2.725
32.8
2.720
VCC
kHz
7.22 Typical Characteristics
32.6
1
7
13
19
25
2
8
14
20
26
3
9
15
21
27
4
10
16
22
28
5
11
17
23
29
6
12
18
24
30
2.715
2.710
32.4
32.2
32
31.8
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
10
±40
2.705
2.700
2.695
60
110
10
±40
Temperature (ƒC)
60
110
Temperature (ƒC)
C001
Figure 3. Low Frequency Oscillator (LFO) Value Across
Temperature With REG27 = 2.5 V
C002
Figure 4. REG27 Output Voltage Variation Across
Temperature With a Nominal Load of 2 mA
8 Detailed Description
8.1 Overview
The BQ33100 is a super capacitor monitor, balancing controller, and overall system manager. The device can
individually monitor up to five series capacitors and up to nine when monitoring the total stack.
The device can also interact with an external charging solution to provide capacitance and effective series
resistance (ESR) data on the stack.
NOTE
The following notation is used in this document if SBS commands and data flash values
are mentioned within a text block:
• SBS commands are set in italic, for example: Voltage
• SBS bits and flags are capitalized, set in italic and enclosed with square brackets, for
example: [SS]
• Data flash values are set in bold italic, for example: OV Threshold
• All data flash bits and flags are capitalized, set in bold italic, and enclosed with square
brackets, for example: [OV]
All SBS commands, data flash values and flags mentioned in a chapter are listed at the
beginning of each chapter for reference.
The reference format for SBS commands is:
SBS:Command Name(Command No.):Manufacturer Access(MA No.)[Flag], for example:
SBS:Voltage(0x09), or SBS:ManufacterAccess(0x00):Seal Device(0x0020)
8.1.1 Super Capacitor Measurements
The BQ33100 measures the series capacitor voltages or stack voltage, current, and temperature using a deltasigma analog-to-digital converter (ADC). The BQ33100 uses this measured data and advanced algorithms to
determine the state-of-health (SOH) and available capacitance of the super capacitor.
8.1.1.1 Voltage
The BQ33100 has two separate modes, NORMAL mode and STACK mode, where measurements are taken and
managed differently. Setting Operation Cfg [STACK] to 1 enables STACK mode; otherwise, the BQ33100
operates in NORMAL mode.
12
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Overview (continued)
The BQ33100 updates the individual series capacitor voltages and stack voltage at one (1) second intervals
when in NORMAL mode and measures the stack voltage at one (1) second intervals when in STACK mode. The
internal ADC of the BQ33100 measures the voltage, scales, and offsets, and calibrates it appropriately. To
ensure an accurate differential voltage sensing, the IC ground must be connected directly to the most negative
terminal of the super capacitor stack, not to the positive side of the sense resistor. This minimizes the voltage
drop across the PCB trace.
8.1.1.2 Current, Charge, and Discharge Counting
The delta-sigma ADC measures the system current of the super capacitor by measuring the voltage drop across
a small-value sense resistor (typically 5 mΩ to 20 mΩ typical) between the SRP and SRN pins. The ADC
measures bipolar signals from –0.20 V to 0.25 V.
8.1.1.3 Device Calibration
The BQ33100 requires voltage calibration to maximize accuracy of the monitoring system, and the BQ33100
evaluation software can perform this calibration. The external filter resistors, connected from each capacitor to
the VCx input of the BQ33100, are required to be 1 kΩ.
For maximum capacitor voltage measurement accuracy, the BQ33100 can automatically calibrate its offset
between the A-to-D converter and the input of the high-voltage translation circuit during normal operation.
8.1.1.4 Temperature
The BQ33100 has an internal temperature sensor and input for an external temperature sensor input, TS. The
external input is used in conjunction with an NTC thermistor (default is Semitec 103AT) to sense the super
capacitor temperature. The BQ33100 can be configured to use internal or external temperature sensors.
8.1.1.5 Series Capacitor Configuration
The BQ33100 can monitor two, three, four, or five capacitors in series. Table 1 shows the appropriate
connectivity for the different options.
Table 1. Series Capacitor Connectivity
BQ33100
PIN
5-SERIES
4-SERIES
3-SERIES
2-SERIES
VC1
P of Top (5th) Cap
P of 4th Cap
Short to VC2
Short to VC2
VC2
P of 4th Cap, N of 5th Cap
P of 3rd Cap, N of 4th
Cap
P of 3rd Cap
Short to VC3
VC3
P of 3rd Cap, N of 4th Cap
P of 2nd Cap, N of 3rd
Cap
P of 2nd Cap, N of 3rd Cap
P of 2nd Cap
VC4
P of 2nd Cap, N of 3rd Cap
P of Bottom (1st) Cap, N P of Bottom (1st) Cap, N of 2nd
of 2nd Cap
Cap
P of Bottom (1st) Cap, N of 2nd
Cap
VC5
P of Bottom (1st) Cap, N of
2nd Cap
N of Bottom Cap (1st)
N of Bottom Cap (1st)
N of Bottom Cap (1st)
VSS
N of Bottom Cap (1st)
Short to VC5
Short to VC5
Short to VC5
SPACE
NOTE
The CC0...CC2 bits in Operation Cfg must be programmed to match the corresponding
configuration.
When in STACK mode (Operation Cfg [STACK] =1), VC1 must be connected to VC2 and VC3 connected to
VC4. Additionally, a divide-by-2 resistor divider must connect between the top and bottom of the capacitor array
with VC1,2 being the top, VC3,4 being the middle, and VSS being the bottom. In this configuration, pins VC5 and
VC5BAL are not used and must be connected to VSS.
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8.2 Functional Block Diagram
SDA
SCL
CHG
LVL1
CHG
LVL0
LLEN
CHG
REG27
CHGOR
VCC
VCCPACK
RBI
Regulator
Power Mode
Control
FET Drive
GND
Serial Communications
VC1
System Control
AFE HW Control
Watchdog
Oscillator
VC2
Data Flash Memory
Charging Algorithm
Overtemperature
Protection
Over- & UnderVoltage
Protection
Voltage
Measurement
Cell Voltage Mux &
Translation
SuperCap
Management
External Cell Balancing
Driver
VC4
Temperature
Measurement
Overcurrent
Protection
Coulomb Counter
HW Overcurrent &
Short Circuit
Protection
VC5
VC5BAL
TS
SRN
SRP
8.3 Feature Description
8.3.1 Capacitance Monitoring and Learning
8.3.1.1 Monitoring and Control Operational Overview
The BQ33100 periodically determines the capacitance and equivalent series resistance (ESR) of the super
capacitor array during normal operation. The Learning Frequency is a register that sets the time between
automatic learning cycles of the super capacitor, which can also be manually executed by issuing a Learn
command. The BQ33100 uses the learning cycles to update the Capacitance and ESR registers accordingly, and
both are accessible through the SMBus interface.
The learning process is a multi-step procedure fully controlled by the BQ33100 that will perform the following
sequence to learn capacitance and ESR:
1. Charge to V Learn Max.
2. Discharge using constant current load to a minimum voltage of the present charging voltage and internally
record voltage and time.
3. Charge to V Learn Max.
4. Discharge using constant current load and internally record current and time.
5. Calculate capacitance and ESR based on recorded voltage and current.
6. Determine the new charging voltage.
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Feature Description (continued)
V
Idle
Charging
Full Charge
Constant Current Discharge
A
Learning
ESR
Delta V
Vbat
B
Linear
Regression
C
Capacita
nce
Delta V
D
Charging
t
Capacita
nce
Delta T
Linear
Regressi
on Base
I
Current
500mA
t
-500mA
Figure 5. Voltage as Current During Learning
where:
C = I × (t[D]–t[C])/(V[C]–V[D])
(1)
ESR = (V[A]–V[B])/I
(2)
and
8.3.1.2 Main Monitoring Registers
Capacitance represents the total capacitance in the capacitor array and presents the value in units of F (Farads)
to 1 decimal place.
On initialization, the BQ33100 sets Capacitance to the data flash value stored in Initial Capacitance. During
subsequent learning cycles, the BQ33100 updates Capacitance with the last measured capacitance of the
capacitor array. Once updated, the BQ33100 writes the new Capacitance value to data flash to Capacitance.
Capacitance represents the full super capacitor reference for relative state-of-charge calculations.
InitialCapacitance—This is the first updated value of super capacitor capacitance and represented in units of F.
RelativeStateOfCharge (RSOC)—This represents the % of available energy. Use Equation 3 to calculate the
RSOC.
(Voltage – Min voltage) / (Charging Voltage – Min voltage)
(3)
Learning Frequency—The Learning Frequency register sets the time between automatic learning cycles of the
super capacitor, which can also be manually executed by issuing a ManufacturerAccess Learn command. The
BQ33100 uses the learning cycles to measure the super capacitor capacitance and update the Capacitance
register accordingly. When the BQ33100 is in UNSEALED mode then a value of 250 is used to set the learning
Frequency to 10 minutes for test purposes.
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Feature Description (continued)
8.3.1.3 Initial Capacitance at Device Reset
The BQ33100 estimates the initial capacitance of a device reset, which is the case when the capacitors are first
attached to the application circuit. This gives a reasonably accurate capacitance and RSOC value; however,
super capacitor capacitance learning is required to improve the accuracy of capacitance and RSOC.
8.3.1.4 Qualified Capacitance Learning
The BQ33100 updates capacitance with an amount based on the value learned during a qualified learning cycle.
Once updated, the BQ33100 writes the new Capacitance value to data flash to Capacitance.
The BQ33100 sets [CL] = 1 and clears [LPASS] in OperationStatus() when a qualified capacitance learning cycle
begins. The period of time that the learning takes is set by CL Time, although the first learning cycle after a
device reset will not occur until after an elapsed time of Learning Frequency. When a qualified learn has
occurred, [LPASS] in OperationStatus() is set.
During the learning process, there are specific timeouts to protect from overcharge or overdischarge of the super
capacitor array. At the beginning of each phase of charge and discharge, a timer is started. If the timer exceeds
Max Discharge Time during the discharging phase, then OperationStatus() [LDTO] is set. If the timer exceeds
Max Charge Time for the charging phase, then OperationStatus() [LCTO] is set. The flags are cleared upon the
beginning of the next learning cycle.
8.3.1.5 Health Determination
The BQ33100 uses Equation 4 to determine the relative health of the capacitor:
Health = (Capacitance / InitialCapacitance)
(4)
The BQ33100 will determine a new ChargingVoltage() at end of the learning cycle based on the newly learned
Capacitance. The following warnings will be set based on the changes in ChargingVoltage() and the capacitor's
ability to provide the minimum power needs.
ChargingVoltage() = V Chg Nominal, then SafetyStatus[HLOW], [HWARN] and [HFAIL] are cleared.
If ChargingVoltage() is set to V Chg A or V Chg B, then SafetyStatus[HLOW] is set.
If ChargingVoltage() is set to V Chg Max then SafetyStatus [HWARN] is set.
If ChargingVoltage() is set to V Chg Max and the BQ33100 determines that the newly learned Capacitance
cannot provide the minimum power requirements then SafetyStatus [HFAIL] is set.
The minimum power requirements is determined by the Min Power, Required Time and Min Voltage data flash
values.
If the corresponding [HLOW], [HWARN] or [HFAIL] bits are set in FAULT when the SafetyStatus[HLOW] or
[HWARN] bit is set then the FAULT pin is set.
8.3.1.6 ESR Measurement
The BQ33100 measures the voltage on the capacitor stack when the LLEN pin (pin 17) is high with the initial
learned value stored in Initial ESR, which is only updated once. The LLEN pin is controlled by firmware to
enable a circuit that presents a constant current load to the full capacitor stack. With the known voltage and
known current the ESR of the capacitor array can be determined. The final reported value of ESR is also
adjusted by the data flash value of ESR Offset. The original value of the capacitor array ESR is stored in Design
ESR but is not used by the BQ33100.
The final value of ESR can be read from the BQ33100 through ESR, which is in mΩ.
8.3.1.7 Monitor Operating Modes
Entry and exit of each mode is controlled by data flash parameters. In DISCHARGE mode, the [DSG] flag in
OperationStatus() is set. DISCHARGE mode is entered when Current goes below (–)Dsg Current Threshold.
DISCHARGE mode is exited when Current goes above Chg Current Threshold threshold for more than 1
second.
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Feature Description (continued)
CHARGE mode is entered when Current goes above Chg Current Threshold. CHARGE mode is exited when
Current goes below Dsg Current Threshold for more than 1 second.
8.3.2 Capacitor Voltage Balancing
Capacitor voltage balancing in the BQ33100 is accomplished by connecting an external parallel bypass load to
each capacitor, and enabling the bypass load depending on each individual capacitors voltage level. The bypass
load is typically formed by a P-CH MOSFET and a resistor connected in series across each capacitor. The filter
resistors that connect the capacitor tabs to VC1 to approximately VC4 pins of the BQ33100 are required to be 1
k ohms to support this function on all capacitors other than the lowest. The lowest capacitor bypass is enabled
through the VC5BAL pin. Capacitor Voltage Balancing is only operational after the ManufacturerAccess Lifetime
and Capacitor Balancing Enable (0x21) command is sent to the BQ33100.
Using this circuit, the BQ33100 balances the capacitors during charge and after charge termination by
discharging those capacitors with voltage above the threshold set in CB Threshold and if the ΔV in capacitor
voltages exceeds the value programmed in CB Min. During capacitor voltage balancing, the BQ33100 measures
the capacitor voltages periodically (during which time the voltage balancing circuit is turned off) and based on the
capacitor voltages, the BQ33100 selects the appropriate capacitor to discharge. When ΔV of
CapacitorVoltage5...1 < CB Min then capacitor voltage balancing stops. Capacitor voltage balancing restarts
when ΔV of CapacitorVoltage5...1 ≥ CB Restart to avoid balancing start-stop oscillations.
Capacitor voltage balancing only occurs when:
•
•
•
Charging current is detected (Current > Chg Current Threshold OR
The [FC] flag in OperationStatus has been set AND
ΔCapacitorVoltage5...1 ≥ CB Restart.
Capacitor voltage balancing stops when:
•
•
ΔCapacitorVoltage5...1 < CB Min
Discharging current detected (Current > Dsg Current Threshold)
This feature is disabled when in STACK mode, when Operation Cfg [STACK ] = 1.
8.3.3 Charge Control
The BQ33100 supports two main charge control architectures: discrete control and smart control. In a discrete
charge control implementation, the CHGLVL0 and CHGLVL1 pins can be used to adjust the charging voltage of
an external supply (see the reference schematic).
As the super capacitors age a higher charging voltage can be configured to offset the deteriorating super
capacitor ESR and Capacitance due to aging. With the discrete control method there are 4 levels of charging
voltages that can be chosen, V Chg Nominal, V Chg A, V Chg B and V Chg Max. The setting of the charging
voltage is determined by the value of the latest determined required Charging Voltage.
The CHGLVL0 and CHGLVL1 pin states are defined by the V Chg X parameters selected per Table 2:
Table 2. ChargingVoltage() Parameters
CHARGINGVOLTAGE
CHGLVL1 (PIN 12)
CHGLVL0 (PIN11)
V Chg Nominal
0
0
V Chg A
0
1
V Chg B
1
0
V Chg Max
1
1
In a smart control architecture the BQ33100 makes the appropriate maximum charging current and charging
voltage per the charging algorithm available through the ChargingCurrent and ChargingVoltage() SMBus
commands respectively. This enables either an SMBus master or smart charger to manage the charging of the
super capacitor pack.
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8.3.3.1 Charge Termination
The BQ33100 determines charge termination if:
•
•
The average charge current < Taper Current during 2 consecutive Current Taper Window time periods,
AND
Voltage + Taper Voltage ≥ ChargingVoltage()
NOTE
To make sure that the charge terminates properly, TI recommends that Taper Current be
set to a value greater than the maximum charger voltage inaccuracy. In other words, the
charger taper current must be set to a lower value than the taper current programmed in
the dataflash to ensure proper charge termination and the FC bit gets set.
The BQ33100 sets the [FC] flag in OperationStatus() when a valid charge termination occurs and cleared when
RelativeStateOfCharge is less than FC Clear %.
The taper voltage must be set to a value less than the OV threshold. This prevents an over voltage condition
from occuring after the CL bit clears upon learning completion.
The BQ33100 can also determine charge termination if the RSOC is at a value equal to or greater than FC
set %. If this is not the desired means of charge termination, FC set % must be set to -1%.
8.3.3.2 CHG Override Control
During the normal operation of the BQ33100 the CHG output of the BQ33100 is typically controlled automatically
but can be overridden through the CHGOR pin (pin 21). On a low-to-high transition the CHG output is released
turning off the external CHG FET and on a high-to-low transition the CHG output is pulled low after a
programmable delay CHG Enable Delay. If CHG Enable Delay is programmed to 0 the delay is a maximum of
250 ms. If the CHG override function is not needed, then the CHGOR pin must connect to VSS.
8.3.4 Lifetime Data Gathering
8.3.4.1 Lifetime Maximum Temperature
During the operation lifetime of the BQ33100 it gathers temperature data. During this time the BQ33100 can be
enabled to record the maximum value that the measured temperature reached. If the [LTE] flag is set in
OperationStatus, Lifetime Max Temp value is updated if one of the following conditions are met:
• Internal measurement temperature – Lifetime Max Temp > 1°C.
• Internal measurement temperature > Lifetime Max Temp for a period > 60 seconds.
• Internal measurement temperature > Lifetime Max Temp AND any other lifetime value is updated.
Table 3. Lifetime Maximum Temperature
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
NAME
FORMAT
SIZE IN
BYTES
MIN
VALUE
MAX
VALUE
DEFAULT
VALUE
UNIT
59
Lifetime Data
0
Lifetime Max
Temp
Integer
2
0
1400
350
0.1°C
8.3.4.2 Lifetime Minimum Temperature
During the operation lifetime of the BQ33100 it gathers temperature data. During this time the BQ33100 can be
enabled to record the minimum value that the measured temperature reached. If the [LTE] flag is set, Lifetime
Min Temp is updated if one of the following conditions are met:
• Lifetime Min Temp – internal measurement temperature > 1°C.
• Lifetime Min Temp > internal measurement temperature for a period > 60 seconds.
• Lifetime Min Temp > internal measurement temperature > AND any other lifetime value is updated.
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Table 4. Lifetime Minimum Temperature
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
NAME
FORMAT
SIZE IN
BYTES
MIN
VALUE
MAX
VALUE
DEFAULT
VALUE
UNIT
59
Lifetime Data
2
Lifetime Min
Temp
Integer
2
–600
1400
50
0.1°C
8.3.4.3 Lifetime Maximum Capacitor Voltage
During the operation lifetime of the BQ33100, it gathers voltage data . During this time, the BQ33100 can be
enabled to record the maximum value that the measured voltage reached. If the [LTE] flag is set, Lifetime Max
Capacitor Voltage is updated if one of the following conditions are met:
• Any internally measured capacitor voltage – Lifetime Max Capacitor Voltage > 25 mV.
• Aany internally measured capacitor voltage > Lifetime Max Capacitor Voltage for a period > 60 seconds.
• Any internally measured capacitor voltage Lifetime Max Capacitor Voltage AND any other lifetime value is
updated.
Table 5. Lifetime Max Capacitor Voltage
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
NAME
FORMAT
SIZE IN
BYTES
MIN
VALUE
MAX
VALUE
DEFAULT
VALUE
UNIT
59
Lifetime Data
4
Lifetime Max
Capacitor
Voltage
Integer
2
0
32767
0
mV
8.3.5 Safety Detection Features
The BQ33100 supports a wide range of super capacitor and system safety detection and protection features that
are easily configured or enabled through the integrated data flash. These features are intended, through various
configuration options, to provide a level of safety from external influences causing damage to components with
the power path; for example, limiting the period of time the CHG FET is exposed to high current pulse charge
conditions.
8.3.5.1 Capacitor Overvoltage (OV)
The BQ33100 can detect capacitor overvoltage condition and protect capacitors from damage. When any
CapacitorVoltage5...1 exceeds (ChargingVoltage() / number of capacitors (see Operation Cfg [CC2,1,0] ) + OV
Threshold) the [OV] flag in SafetyAlert is set.
When any CapacitorVoltage5...1 exceeds (ChargingVoltage() / number of capacitors (see Operation Cfg
[CC2,1,0] ) + OV Threshold) for a period greater than OV Time the [OV] flag in SafetyStatus is set.
When the BQ33100 is configured for PACK mode, when Operation Cfg [STACK] =1, then a fault is detected
when Voltage exceeds (ChargingVoltage() + OV Threshold) the [OV] flag in SafetyAlert is set.
When the BQ33100 is configured for PACK mode, when Operation Cfg [STACK] =1, then a fault is detected
when Voltage exceeds (ChargingVoltage() + OV Threshold) for a period greater than OV Time the [OV] flag in
SafetyStatus is set.
This function is disabled if OV Time is set to 0.
In an overvoltage condition charging is disabled and the CHG FET is turned off, ChargingCurrent and
ChargingVoltage() are set to 0.
The BQ33100 recovers from a capacitor overvoltage condition if all CapacitorVoltages5..1 are equal to or lower
than (ChargingVoltage() / number of capacitors (see Operation Cfg [CC2,1,0] ) + OV Recovery. If the BQ33100
is configured for PACK mode, then the recover occurs when Voltage is equal to or lower than (ChargingVoltage()
+ OV Recovery.
On recovery the [OV] flag is reset, and ChargingCurrent and ChargingVoltage() are set back to appropriate
values per the charging algorithm.
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NOTE
When ChargingVoltage() has been set to 0 due to a detected condition then the capacitor
overvoltage function is suspended.
8.3.5.2 Capacitor Voltage Imbalance (CIM)
The BQ33100 starts capacitor voltage imbalance detection when Current is less than or equal to CIM Current
AND ALL CapacitorVoltage5..1 > Min CIM Check Voltage.
When the difference between highest capacitor voltage and lowest capacitor voltage exceeds CIM Fail Voltage
the [CIM] flag in SafetyAlert is set.
When the difference between highest capacitor voltage and lowest capacitor voltage exceeds CIM Fail Voltage
for a period greater than CIM Time the [CIM] flag in SafetyStatus is set and ChargingCurrent and
ChargingVoltage() are set to 0 and the CHG FET is turned off. SafetyStatus() [CIM] is cleared and CHG FET is
allowed to turn ON when the differences between the highest capacitor voltage and lowest capacitor voltage is
less than CIM Recovery.
This function is disabled if CIM Time is set to 0.
The capacitor voltage imbalance detection is cleared when the difference between highest capacitor voltage and
lowest capacitor voltage is less than CIM Fail Voltage. When this is detected then the CHG FET is allowed to be
turned on, if other safety and configuration states permit, ChargingCurrent and ChargingVoltage() are set to the
appropriate value per the charging algorithm, and the [CIM] flag in SafetyStatus is reset.
8.3.5.3 Weak Capacitor (CLBAD)
When the capacitor array has been fully charged (indicated by OperationStatus [FC] being set) then it is
monitored for excessive leakage.
When Current exceeds CLBAD Current the [CLBAD] flag in SafetyAlert is set.
When Current exceeds CLBAD for a period greater than CLBAD Time the [CLBAD] flag in SafetyStatus is set.
This function is disabled if CLBAD Time is set to 0.
In a weak capacitor condition, charging is disabled and the CHG FET is turned off, ChargingCurrent and
ChargingVoltage() are set to 0.
The weak capacitor fault is cleared when Current falls equal to or below the CLBAD Recovery limit. When the
recovery condition is detected, then the CHG FET is allowed to be turned on, if other safety and configuration
states permit, ChargingCurrent and ChargingVoltage() are set to the appropriate value per the charging
algorithm, and the [CLBAD] flag in SafetyStatus is reset.
8.3.5.4 Overtemperature (OT)
The BQ33100 has overtemperature protection to prevent charging at excessive temperatures.
When Temperature exceeds OT Chg the [OT] flag in SafetyAlert is set.
When Temperature exceeds OT Chg for a period greater than OT Chg Time the [OT] flag in SafetyStatus is set.
This function is disabled if OT Chg Time is set to 0.
In an overtemperature condition, charging is disabled and the CHG FET is turned off, ChargingCurrent and
ChargingVoltage() are set to 0.
The overtemperature fault is cleared when Temperature falls equal to or below the OT Chg Recovery limit.
When the recovery condition is detected, then the CHG FET is allowed to be turned on, if other safety and
configuration states permit, ChargingCurrent and ChargingVoltage() are set to the appropriate value per the
charging algorithm, and the [OT] flag in SafetyStatus is reset.
8.3.5.5 Overcurrent During Charging (OC Chg)
The BQ33100 has an independent level of recoverable overcurrent protection during charging.
When Current exceeds OC Chg the [OCC] flag in SafetyAlert is set.
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When Current exceeds OC Chg for a period greater than OC Chg Time the [OCC] flag in SafetyStatus is set
and ChargingCurrent and ChargingVoltage() are set to 0.
This function is disabled if OC Chg Time is set to 0.
The overcurrent fault is cleared when Current falls below OC Chg Recovery. When a charging-fault recovery
condition is detected, then the CHG FET is allowed to be turned on, if other safety and configuration states
permit, ChargingCurrent and ChargingVoltage() are set to the appropriate value per the charging algorithm, and
the [OCC] flag in SafetyStatus is reset.
8.3.5.6 Overcurrent During Discharging (OC Dsg)
The BQ33100 overcurrent is discharge detection executed by the integrated AFE is configured by the BQ33100
data flash OC Dsg and OC Dsg Time registers.
When the integrated AFE detects a overcurrent in discharge condition the charge FET is turned off and the
[OCD] flag in SafetyStatus is set, the internal current recovery timer is reset and ChargingCurrent and
ChargingVoltage() are set to 0.
The recovery is controlled by the BQ33100 and requires that Current be ≤ OC Dsg Recovery threshold and that
the internal AFE current recovery timer ≥ Current Recovery Time.
When the recovery condition is detected, ChargingCurrent and ChargingVoltage() are set to the appropriate
value per the charging algorithm, and the [OCD] flag inSafetyStatus is reset.
8.3.5.7 Short-Circuit During Charging (SC Chg)
The BQ33100 short-circuit during charging protection is executed by the integrated AFE is configured by the
BQ33100 data flash SC Chg Cfg register.
When the integrated AFE detects a short circuit fault the charge FET is turned off and the [SCC] flag in
SafetyStatus is set, the internal current recovery timer is reset and ChargingCurrent and ChargingVoltage() are
set to 0.
The recovery is controlled by the BQ33100 and requires that AverageCurrent be ≤ SC Recovery threshold and
that the internal AFE current recovery timer ≥ Current Recovery Time.
When the recovery condition is detected, ChargingCurrent and ChargingVoltage() are set to the appropriate
value per the charging algorithm, and the [SCC] flag inSafetyStatus is reset.
8.3.5.8 Short-Circuit During Discharging (SC Dsg)
The BQ33100 short-circuit during discharging detection is executed by the integrated AFE is configured by the
BQ33100 data flash SC Dsg Cfg register.
When the integrated AFE detects a short circuit fault the charge FET is turned off and the [SCD] flag in
SafetyStatus is set, the internal current recovery timer is reset and ChargingCurrent and ChargingVoltage() are
set to 0.
The recovery is controlled by the BQ33100 and requires that Current be ≤ SC Recovery threshold and that the
internal AFE current recovery timer ≥ Current Recovery Time.
When the recovery condition is detected, ChargingCurrent and ChargingVoltage() are set to the appropriate
value per the charging algorithm, and the [SCD] flag inSafetyStatus is reset.
8.3.5.9 AFE Watchdog (WDF)
The integrated AFE automatically turns off the CHG FET and sets the [WDF] flag in SafetyStatus if the integrated
AFE does not receive the appropriate frequency on the internal watchdog input (WDI) signal.
8.3.5.10 Integrated AFE Communication Fault (AFE_C)
After a full reset the BQ33100 and the AFE offset and gain values are read twice and compared. The AFE Init
Limit sets the maximum difference in A/D counts of two successful readings of offset and gain, which the device
still considers as the same value. If the gain and offset values are still not considered the same after AFE Init
Retry Limit comparison retries, the device reports a permanent failure error by setting SafetyStatus() [AFE_C].
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Additionally, the BQ33100 periodically validates its read and write communications with the integrated AFE. If
either a read or write verify fails, an internal AFE_Fail_Counter is incremented. If the AFE_Fail_Counter reaches
AFE Fail Limit, the BQ33100 sets the [AFE_C] flag in SafetyStatus. An AFE communication fault condition can
also be declared if, after a full reset, the initial gain and offset values read from the AFE cannot be verified.
These values are A to D readings of the integrated AFE VCx signal. The integrated AFE offset values are verified
by reading the values twice and confirming that the readings are within acceptable limits. The maximum number
of read retries, if offset and gain value verification fails and [AFE_C] fault is declared, is set in AFE Fail Limit If
the AFE Fail Limit is set to 0, this feature is disabled.
8.3.5.11 Data Flash Fault (DFF)
The BQ33100 can detect if the data flash is not operating correctly. A permanent failure is reported when either:
(i) After a full reset the instruction flash checksum does not verify; (ii) if any data flash write does not verify; or (iii)
if any data flash erase does not verify
When a data flash fault is detected then the [DFF] flag in SafetyStatus is set.
8.3.5.12 FAULT Indication (FAULT Pin)
The BQ33100 provides the status of the safety detection through SafetyStatus. To provide an extra indication of
a fault state ( SafetyStatus ≠ 0x00) the BQ33100 will set the FAULT pin (pin 15) if the corresponding
SafetyStatus bit is set in Fault.
8.3.6 Communications
The BQ33100 uses SMBus v1.1 for host communications although an SMBus slave can be communicated with
through an I2C master.
8.3.6.1 SMBus On and Off State
The BQ33100 detects a SMBus off state when SCL and SDA are logic-low for ≥ 2 seconds. Clearing this state
requires either SCL or SDA to transition high. Within 1 ms, the communication bus is available.
8.3.7 Security (Enables and Disables Features)
There are two levels of secured operation within the BQ33100, Sealed and Unsealed. To switch between the
levels, different operations are needed with different codes.
1.Unsealed to Sealed — The use of the Seal command instructs the BQ33100 to limit access to the SBS
functions and data flash space and sets the [SS] flag. In SEALED mode, available standard SBS functions have
access per the Smart Battery Data Specification (SBS). Extended SBS Functions and data flash are not
accessible. Once in SEALED mode, the part can never permanently return to UNSEALED mode.
2. Sealed to Unsealed — Instructs the BQ33100 to extend access to the SBS and data flash space and clears
the [SS] flag. In UNSEALED mode, all data, SBS, and DF have read and write access. Unsealing is a 2 step
command performed by writing the 1st word of the UnSealKey to ManufacturerAccess followed by the second
word of the UnSealKey to ManufacturerAccess. The unseal key can be read and changed through the extended
SBS block command UnSealKey when in UNSEALED mode. To return to the SEALED mode, either a hardware
reset is needed, or the ManufacturerAccess Seal command is needed.
8.3.8 Measurement System Calibration
The BQ33100 does not require calibration, but can be calibrated for improved measurement accuracy.
8.3.8.1 Coulomb Counter Deadband
The BQ33100 does not accumulate charge or discharge for monitoring when the current input is below the
Deadband threshold which must be set sufficiently high to prevent false signal detection with no charge or
discharge flowing through the sense resistor.
8.3.8.2 Auto Calibration
The BQ33100 provides an auto-calibration feature to cancel the voltage offset error across SRP and SRN for
maximum charge measurement accuracy. The BQ33100 performs auto-calibration when the SMBus lines stay
low continuously for a minimum of 5 s and Temperature is within bounds of 5°C and 45°C.
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8.3.8.3 Current Gain
Current Gain sets the mA current scale factor for the coulomb counter. Use calibration routines to set this value.
Table 6. Current Gain
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
NAME
FORMAT
SIZE IN
BYTES
MIN
VALUE
MAX
VALUE
DEFAULT
VALUE
UNIT
104
Data
0
Current Gain
Floating point
4
1.0E-01
4.0E+00
0.9419
mΩ
8.3.8.4 CC Delta
CC Delta sets the mF capacitance scale factor for the coulomb counter. Use calibration routines to set this value.
Table 7. CC Delta
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
NAME
FORMAT
SIZE IN
BYTES
MIN VALUE
MAX VALUE
DEFAULT
VALUE
UNIT
104
Data
4
CC Delta
Floating point
4
2.9826E+04
1.193046E+06
280932.825
mΩ
8.3.8.5 Cap1 K-factor
This register value stores the ADC voltage translation factor for the top capacitor (Capacitor 1), which is
connected between the VC1 and VC2 pins. By default, this value is not used and the factory calibration are in
effect. This value overrides the factory calibration when the K-factor Override Flag is set to 0x9669 by the
software calibration process. The calibration routine sets this value, however the value can be manually modified
according to Equation 5:
New StackVoltageKfactor = Existing StackVoltageKfactor × Actual Applied Voltage / Reported Voltage
(5)
Table 8. Cap1 K-factor
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
NAME
FORMAT
SIZE IN
BYTES
MIN
VALUE
MAX
VALUE
DEFAULT
VALUE
104
Data
8
Cap1 Kfactor
Integer
2
0
32767
20500
UNIT
8.3.8.6 Cap2 K-factor
This register value stores the ADC voltage translation factor for Capacitor 2, which is connected between the
VC2 and VC3 pins. By default, this value is not used and the factory calibration are in effect. This value overrides
the factory calibration when the K-factor Override Flag is set to 0x9669 by the software calibration process. The
calibration routine sets this value, however the value can be manually modified according to Equation 6:
New StackVoltageKfactor = Existing StackVoltageKfactor × Actual Applied Voltage / Reported Voltage
(6)
Table 9. Cap2 K-factor
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
NAME
FORMAT
SIZE IN
BYTES
MIN
VALUE
MAX
VALUE
DEFAULT
VALUE
104
Data
10
Cap2 Kfactor
Integer
2
0
32767
20500
UNIT
8.3.8.7 Cap3 K-factor
This register value stores the ADC voltage translation factor for Capacitor 3, which is connected between the
VC3 and VC4 pins. By default, this value is not used and the factory calibration are in effect. This value overrides
the factory calibration when the K-factor Override Flag is set to 0x9669 by the software calibration process. The
calibration routine sets this value, however the value can be manually modified according to Equation 7:
New StackVoltageKfactor = Existing StackVoltageKfactor × Actual Applied Voltage / Reported Voltage
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Table 10. Cap3 K-factor
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
NAME
FORMAT
SIZE IN
BYTES
MIN
VALUE
MAX
VALUE
DEFAULT
VALUE
104
Data
12
Cap3 Kfactor
Integer
2
0
32767
20500
UNIT
8.3.8.8 Cap4 K-factor
This register value stores the ADC voltage translation factor for Capacitor 4, which is connected between the
VC4 and VC5 pins. By default, this value is not used and the factory calibration are in effect. This value overrides
the factory calibration when the K-factor Override Flag is set to 0x9669 by the software calibration process. The
calibration routine sets this value, however the value can be manually modified according to Equation 8:
New StackVoltageKfactor = Existing StackVoltageKfactor × Actual Applied Voltage / Reported Voltage
(8)
Table 11. Cap4 K-factor
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
NAME
FORMAT
SIZE IN
BYTES
MIN
VALUE
MAX
VALUE
DEFAULT
VALUE
104
Data
14
Cap4 Kfactor
Integer
2
0
32767
20500
UNIT
8.3.8.9 Cap5 K-factor
This register value stores the ADC voltage translation factor for the bottom capacitor (Capacitor 5), which is
connected between the VC5 and VSS pins. The calibration routine sets this value, however the value can be
manually modified according to Equation 9:
New StackVoltageKfactor = Existing StackVoltageKfactor × Actual Applied Voltage / Reported Voltage
(9)
Table 12. Cap5 K-factor
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
NAME
FORMAT
SIZE IN
BYTES
MIN
VALUE
MAX
VALUE
DEFAULT
VALUE
104
Data
16
Cap5 Kfactor
Integer
2
0
32767
20500
UNIT
8.3.8.10 K-factor Override Flag
This register value is by default 0, indicating that the factory calibrated K-factors are being used. If this register is
set to 0x9669, Cap1 to approximately Cap5 K-factors in the data flash are used for voltage translation.
Table 13. K-factor Override Flag
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
NAME
FORMAT
SIZE IN
BYTES
MIN
VALUE
MAX
VALUE
DEFAULT
VALUE
104
Data
18
K-factor
Override Flag
Hex
2
0x0
0xffff
0x0
UNIT
8.3.8.11 System Voltage K-factor
This register value stores the scale factor for the PackVoltage, voltage measured at the VCCPACK pin of the
BQ33100. The calibration routine sets this value, however the value can be manually modified according to
Equation 10:
New StackVoltageKfactor = Existing StackVoltageKfactor × Actual Applied Voltage / Reported Voltage
(10)
Table 14. System Voltage K-factor
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
NAME
FORMAT
SIZE IN
BYTES
MIN
VALUE
MAX
VALUE
DEFAULT
VALUE
104
Data
20
System
Voltage Kfactor
Integer
2
0
32767
24500
24
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8.3.8.12 Stack Voltage K-factor
This register value stores the scale factor for the Stack Voltage, voltage measured at the VCC pin of the
BQ33100. The calibration routine sets this value, however the value can be manually modified according to
Equation 11:
New StackVoltageKfactor = Existing StackVoltageKfactor × Actual Applied Voltage / Reported Voltage
(11)
Table 15. Stack Voltage K-factor
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
NAME
FORMAT
SIZE IN
BYTES
MIN
VALUE
MAX
VALUE
DEFAULT
VALUE
104
Data
22
Stack
Voltage Kfactor
Integer
2
0
32767
24500
UNIT
8.3.8.13 K-factor Stack Override Flag
This register value is by default 0, indicating that the factory calibrated stack K-factor is being used. If this
register is set to 0x9669, Stack Voltage K-factor in the data flash are used for stack voltage translation.
Table 16. K-factor Stack Override Flag
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
NAME
FORMAT
SIZE IN
BYTES
MIN
VALUE
MAX
VALUE
DEFAULT
VALUE
104
Data
24
K-factor stack
Override Flag
Hex
2
0x0
0xffff
0x0
UNIT
8.3.8.14 CC Offset
This register value stores the coulomb counter offset compensation. It is set during CC Offset calibration, or by
automatic calibration of the BQ33100 before the gauge enters shutdown. TI does not recommend to manually
change this value.
Table 17. CC Offset
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
NAME
FORMAT
SIZE IN
BYTES
MIN
VALUE
MAX
VALUE
DEFAULT
VALUE
UNIT
104
Data
20
CC Offset
Integer
2
–32768
32767
–7744
(mV)
8.3.8.15 Board Offset
This register value stores the compensation for the PCB dependant coulomb counter offset. TI recommends to
use characterization data of the actual PCB to set this value.
Table 18. Board Offset
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
NAME
FORMAT
SIZE IN
BYTES
MIN
VALUE
MAX
VALUE
DEFAULT
VALUE
UNIT
104
Data
22
Board Offset
Integer
2
–32767
32767
0
uV
8.3.8.16 Int Temp Offset
This register value stores the internal temperature sensor offset compensation. Use calibration routines to set
this value
Table 19. Int Temp Offset
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
NAME
FORMAT
SIZE IN
BYTES
MIN
VALUE
MAX
VALUE
DEFAULT
VALUE
UNIT
104
Data
24
Int Temp
Offset
Integer
1
–128
127
0
0.1ºC
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8.3.8.17 Ext1 Temp Offset
This register value stores the temperature sensor offset compensation for the external temperature sensor 1
connected at the TS pin of the BQ33100. Use calibration routines to set this value
Table 20. Ext1 Temp Offset
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
NAME
FORMAT
SIZE IN
BYTES
MIN
VALUE
MAX
VALUE
DEFAULT
VALUE
UNIT
104
Data
25
Ext1 Temp
Offset
Integer
1
–128
127
0
0.1ºC
8.3.8.18 CC Current
This value sets the current used for the CC calibration when in CALIBRATION mode.
Table 21. CC Current
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
NAME
FORMAT
SIZE IN
BYTES
MIN
VALUE
MAX
VALUE
DEFAULT
VALUE
UNIT
105
Config
0
CC Current
Integer
2
0
32767
3000
mA
8.3.8.19 Voltage Signal
This value sets the voltage used for calibration when in CALIBRATION mode.
Table 22. Voltage Signal
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
NAME
FORMAT
SIZE IN
BYTES
MIN
VALUE
MAX
VALUE
DEFAULT
VALUE
UNIT
105
Config
2
Voltage
Signal
Integer
2
0
32767
12600
mV
8.3.8.20 Temp Signal
This value sets the temperature used for the temperature calibration in CALIBRATION mode.
Table 23. Temp Signal
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
NAME
FORMAT
SIZE IN
BYTES
MIN
VALUE
MAX
VALUE
DEFAULT
VALUE
UNIT
105
Config
4
Temp Signal
Integer
2
0
32767
298
0.1ºK
8.3.8.21 CC Offset Time
This value sets the time used for the CC Offset calibration in CALIBRATION mode. More time means more
accuracy. The legitimate values for this constant are integer multiples of 250. Numbers less than 250 will cause a
CC Offset calibration error. Numbers greater than 250 will be rounded down to the nearest multiple of 250.
Table 24. CC Offset Time
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
NAME
FORMAT
SIZE IN
BYTES
MIN
VALUE
MAX
VALUE
DEFAULT
VALUE
UNIT
105
Config
6
CC Offset
Time
Unsigned
Integer
2
0
65535
250
s (ms)
8.3.8.22 ADC Offset Time
This constant defines the time for the ADC Offset calibration in CALIBRATION mode. More time means more
accuracy. The legitimate values for this constant are integer multiples of 32. Numbers less than 32 will cause an
ADC offset calibration error. Numbers greater than 32 will be rounded down to the nearest multiple of 32.
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Table 25. ADC Offset Time
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
NAME
FORMAT
SIZE IN
BYTES
MIN
VALUE
MAX
VALUE
DEFAULT
VALUE
UNIT
105
Config
8
ADC Offset
Time
Unsigned
Integer
2
0
65535
32
ms
8.3.8.23 Current Gain Time
This constant defines the time for the Current Gain calibration in CALIBRATION mode. More time means more
accuracy. The legitimate values for this constant are integer multiples of 250. Numbers less than 250 will cause a
Current gain calibration error. Numbers greater than 250 will be rounded down to the nearest multiple of 250.
Table 26. Current Gain Time
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
NAME
FORMAT
SIZE IN
BYTES
MIN
VALUE
MAX
VALUE
DEFAULT
VALUE
UNIT
105
Config
10
Current Gain
Time
Unsigned
Integer
2
0
65535
250
ms
8.3.8.24 Voltage Time
This constant defines the time for the voltage calibration in CALIBRATION mode. More time means more
accuracy. The legitimate values for this constant are integer multiples of 1984. Numbers less than 1984 will
cause a voltage calibration error. Numbers greater than 1984 will be rounded down to the nearest multiple of
1984.
Table 27. Voltage Time
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
NAME
FORMAT
SIZE IN
BYTES
MIN
VALUE
MAX
VALUE
DEFAULT
VALUE
UNIT
105
Config
12
Voltage Time
Unsigned
Integer
2
0
65535
1888
ms
8.3.8.25 Temperature Time
This constant defines the time for the temperature calibration in CALIBRATION mode. More time means more
accuracy. The legitimate values for this constant are integer multiples of 32. Numbers less than 32 will cause a
temperature calibration error. Numbers greater than 32 will be rounded down to the nearest multiple of 32.
Table 28. Temperature Time
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
NAME
FORMAT
SIZE IN
BYTES
MIN
VALUE
MAX
VALUE
DEFAULT
VALUE
UNIT
105
Config
14
Temperature
Time
Unsigned
Integer
2
0
65535
32
ms
8.3.8.26 Cal Mode Timeout
The BQ33100 will exit CALIBRATION mode automatically after a Cal Mode Timeout period.
Table 29. Cal Mode Timeout
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
NAME
FORMAT
SIZE IN
BYTES
MIN VALUE
MAX VALUE
DEFAULT
VALUE
UNIT
105
Config
17
Cal Mode
Timeout
Unsigned Integer
2
0
65535
38400
1/128 s (s)
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8.3.8.27 Ext Coef a1..a5, b1..b4, Ext rc0, Ext adc0
These values characterize the external thermistor connected to the TS pin of the BQ33100. The default values
characterize the Semitec 103AT NTC thermistor. Do not modify these values without consulting TI.
Table 30. Ext Coef a1..a5, b1..b4, Ext rc0, Ext adc0
SUBCLASS
ID
106
SUBCLASS
NAME
Temp Model
FORMAT
SIZE IN
BYTES
MIN
VALUE
MAX
VALUE
DEFAULT
VALUE
OFFSET
NAME
0
Ext Coef a1
–11130
2
Ext Coef a2
19142
4
Ext Coef a3
–19262
6
Ext Coef a4
28203
8
Ext Coef a5
10
Ext Coef b1
12
Ext Coef b2
–605
14
Ext Coef b3
–2443
16
Ext Coef b4
4696
18
Ext rc0
11703
20
Ext adc0
11338
UNIT
892
Integer
2
–32768
32767
328
num
8.3.8.28 Rpad
This value characterizes the pad resistance of the BQ33100. Do not modify without consulting TI.
Table 31. Rpad
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
NAME
FORMAT
SIZE IN
BYTES
MIN
VALUE
MAX
VALUE
DEFAULT
VALUE
UNIT
106
Temp Model
22
Rpad
Integer
2
–32768
32767
87
Ω
8.3.8.29 Rint
This value characterizes the internal resistance of the BQ33100. Do not modify without consulting TI.
Table 32. Rint
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
NAME
FORMAT
SIZE IN
BYTES
MIN
VALUE
MAX
VALUE
DEFAULT
VALUE
UNIT
106
Temp Model
24
Rint
Integer
2
–32768
32767
17740
Ω
8.3.8.30 Int Coef 1..4, Int Min AD, Int Max Temp
These values characterize the internal thermistor of the BQ33100. Do not modify these values without consulting
TI.
Table 33. Int Coef 1..4, Int Min AD, Int Max Temp
SUBCLASS
ID
106
28
SUBCLASS
NAME
Temp Model
FORMAT
SIZE IN
BYTES
MIN
VALUE
MAX
VALUE
DEFAULT
VALUE
OFFSET
NAME
26
Int Coef 1
28
Int Coef 2
0
30
Int Coef 3
–12263
32
Int Coef 4
34
Int Min AD
0
36
Int Max Temp
6106
UNIT
0
Integer
2
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–32768
32767
s
6106
0.1°K
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8.3.8.31 Filter
Filter defines the filter constant used in the AverageCurrent calculation, Equation 12:
AverageCurrent new = a x AverageCurrent old + (1 – a) x Current
where
•
a = <Filter> / 256; the time constant = 1 sec/ln(1/a) (default 14.5 sec)
(12)
Table 34. Filter
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
NAME
FORMAT
SIZE IN
BYTES
MIN
VALUE
MAX
VALUE
DEFAULT
VALUE
107
Current
0
Filter
Unsigned
Integer
1
0
255
239
UNIT
8.3.8.32 Deadband
Any current within ±DeadBand will be reported as 0 mA by the Current function.
Table 35. Deadband
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
NAME
FORMAT
SIZE IN
BYTES
MIN
VALUE
MAX
VALUE
DEFAULT
VALUE
UNIT
107
Current
1
Deadband
Unsigned
Integer
1
0
255
0
mA
8.3.8.33 CC Deadband
This constant defines the deadband voltage for the measured voltage between the SR1 and SR2 pins used for
capacitance accumulation in units of 294 nV. Any voltages within ±CC Deadband do not contribute to
capacitance accumulation.
Table 36. CC Deadband
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
NAME
FORMAT
SIZE IN
BYTES
MIN
VALUE
MAX
VALUE
DEFAULT
VALUE
UNIT
107
Current
2
Deadband
Unsigned
Integer
1
0
255
10
294 nV
8.4 Device Functional Modes
The BQ33100 supports two power modes:
•
•
In NORMAL mode, the BQ33100 performs measurements, calculations, protection decisions, and data
updates in 1 second intervals. Between these intervals, the BQ33100 is in a reduced power mode.
In SHUTDOWN mode, the BQ33100 is powered down with only a voltage based wake function operating.
8.4.1 Operating Power Modes
The BQ33100 has two operating power modes, NORMAL and SHUTDOWN mode.
NORMAL mode—During normal operation, the BQ33100 takes Current, Voltage, and Temperature
measurements, performs calculations, updates SBS data, and makes protection and status decisions at onesecond intervals. Between these periods of activity, the BQ33100 is in a reduced power state.
SHUTDOWN mode—The BQ33100 enters SHUTDOWN mode if the following conditions are met:
•
•
VVCC ≤ Minimum operating voltage
ManufacturerAccess: Shutdown command received AND Current = 0 AND Voltage < Shutdown Voltage
threshold.
Upon initial power up or a reset of the BQ33100, application of a voltage > VSTARTUP must be applied to the
VCCPACK pin. The BQ33100 will then power up and enter NORMAL mode.
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8.5 Programming
8.5.1 Communications
The BQ33100 uses SMBus v1.1 with optional packet error checking (PEC) per the SMBus specification.
8.5.1.1 BQ33100 Slave Address
The BQ33100 uses the address 0x16 on SMBus for communication.
8.5.1.2 SMBus On and Off State
The BQ33100 detects an SMBus off state when SCL and SDA are logic-low for ≥ 2 seconds. Clearing this state
requires either SCL or SDA to transition high. Within 1 ms, the communication bus is available.
8.5.1.3 Packet Error Checking
The BQ33100 can receive data with or without PEC. In the write-word protocol, the BQ33100 receives the PEC
after the last byte of data from the host. If the host does not support PEC, the last byte of data is followed by a
stop condition. After receipt of the PEC, the BQ33100 compares the value to its calculation. If the PEC is correct,
the BQ33100 responds with an ACKNOWLEDGE. If it is not correct, the BQ33100 responds with a NOT
ACKNOWLEDGE.
8.5.2 SBS Commands
All SBS Values are updated in 1-second intervals. The extended SBS commands are only available when the
BQ33100 device is in UNSEALED mode.
8.5.2.1 SBS Command Summary
Table 37. SBS Commands
SIZE IN
BYTES
MIN
VALUE
MAX
VALUE
DEFAULT VALUE
hex
2
unsigned int
2
0x0000
0xffff
—
0
65535
Voltage
unsigned int
—
0.1ºK
2
0
65535
—
mV
R
Current
R
ESR
signed int
2
–32768
32767
—
mA
unsigned int
2
0
65535
—
mΩ
0x0D
R
0x0E
R
RelativeStateOfCharge
unsigned int
1
0
100
—
%
Health
unsigned int
1
0
100
—
%
0x10
0x14
R
Capacitance
unsigned int
2
0
65535
—
F
R
ChargingCurrent
unsigned int
2
0
65534
—
mA
0x15
R
ChargingVoltage
unsigned int
2
0
65534
—
mV
SBS CMD
MODE
NAME
0x00
R/W
ManufacturerAccess
0x08
R
Temperature
0x09
R
0x0A
0x0B
FORMAT
UNIT
0x3B
R
CapacitorVoltage5
unsigned int
2
0
65534
—
mV
0x3C
R
CapacitorVoltage4
unsigned int
2
0
65535
—
mV
0x3D
R
CapacitorVoltage3
unsigned int
2
0
65535
—
mV
0x3e
R
CapacitorVoltage2
unsigned int
2
0
65535
—
mV
0x3F
R
CapacitorVoltage1
unsigned int
2
0
65535
—
mV
Table 38. Extended SBS Commands
SBS CMD
MOD
E
0x46
R/W
FETControl
0x50
R
SafetyAlert
0x51
R
0x54
0x5a
30
SIZE IN
BYTES
MIN VALUE
MAX VALUE
DEFAULT
VALUE
Hex
2
0x0000
0xffff
—
Hex
2
0x0000
0xffff
—
SafetyStatus
Hex
2
0x0000
0xffff
—
R
OperationStatus
Hex
2
0x0000
0xf7f7
—
R
SystemVoltage
unsigned int
2
0
65535
—
NAME
FORMAT
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UNIT
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Table 38. Extended SBS Commands (continued)
SBS CMD
MOD
E
0x60
R/W
UnSealKey
Hex
0x70
R/W
ManufurerInfo
String
NAME
FORMAT
SIZE IN
BYTES
MIN VALUE
MAX VALUE
DEFAULT
VALUE
4
0x00000000
0xffffffff
—
31+1
—
—
—
UNIT
8.5.2.2 SBS Command Details
The following provides detailed descriptions of the SBS commands.
8.5.2.2.1 ManufacturerAccess (0x00)
This read- or write-word function provides super capacitor data to system along with access to BQ33100 controls
and security features.
Table 39. ManufacturerAccess
SBS
CMD
MODE
NAME
FORMAT
SIZE IN
BYTES
MIN VALUE
MAX VALUE
DEFAULT
VALUE
0x00
R/W
ManufacturerAccess
hex
2
0x0000
0xffff
—
UNIT
Table 40. MAC Command Summary Table
SBS CMD
MODE
NAME
DESCRIPTION
0x0001
R
Device Type
0x0002
R
Firmware Version
Returns the firmware version.
0x0003
R
Hardware Version
Returns the hardware version
0x0004
R
DF Checksum
0x0020
W
Seal
Enters SEALED mode with limited access to the extended SBS functions and data
flash space
0x0021
R/W
Lifetime and Capacitor
Balancing Enable
0 = Disables logging of lifetime data to non-volatile memory and disables capacitor
balancing
1 = Enables logging of lifetime data to non-volatile memory and enables capacitor
balancing
0x0022
R
IF Checksum
0x0023
W
Learn
0x0024
W
Learn Value Reset
This write function instructs the BQ33100 to reset the capacitance learned values
(capacitance) to initial default values.
0x0025
W
Learn Initialization
This write function instructs the BQ33100 to enter a capacitance learning
cycle(capacitance update) and update initial values for capacitance and ESR.
0x0030
W
FAULT Activation
Drives the FAULT pin high
0x0031
W
FAULT Clear
0x0032
W
Charge Level Nominal
0x0033
W
Charge Level A
Drives the CHGLVL0,1 pins high, low
0x0034
W
Charge Level B
Drives the CHGLVL0,1 pins low, high
0x0035
W
Charge Level Max
Drives the CHGLVL0,1 pins high
0x0036
R
Read AD Current
Read A-to-D converter current measurement
0x0037
W
Learn Load Activation
0x0038
W
Learn Load Clear
Sets the LLEN pin low
0x0040
W
Calibration Mode
Places BQ33100 into CALIBRATION mode
0x0041
W
Reset
Unseal
Key
W
Unseal Device
Enables access to SBS and DF space
Extended
SBS
R/W
Extended SBS
Commands
Access to Extended SBS commands
Returns the IC part number.
Generates a checksum of the full Data Flash (DF) array
Returns the value of the Instruction Flash (IF) checksum
This write function instructs the BQ33100 to enter a capacitance learning
cycle(capacitance update).
Sets FAULT pin low
Drives the CHGLVL0,1 pins low
Drives the LLEN pin high (does not activate actual learning algorithm, see 0x0023)
BQ33100 undergoes complete reset
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8.5.2.2.1.1 Device Type (0x0001)
Returns the IC part number
Table 41. Device Type
SBS
CMD
MODE
NAME
FORMAT
SIZE IN
BYTES
MIN VALUE
MAX VALUE
DEFAULT
VALUE
0x0001
R
Device Type
Hex
2
—
—
—
UNIT
8.5.2.2.1.2 Firmware Version (0x0002)
Returns the firmware version. The format is most-significant byte (MSB) = Decimal integer, and the leastsignificant byte (LSB) = subdecimal integer, for example: 0x0120 = version 01.20.
Table 42. Firmware Version
SBS
CMD
MODE
NAME
FORMAT
SIZE IN
BYTES
MIN VALUE
MAX VALUE
DEFAULT
VALUE
0x0002
R
Firmware Version
Hex
2
—
—
—
UNIT
8.5.2.2.1.3 Hardware Version (0x0003)
Returns the hardware version stored in a single byte of reserved data flash, for example: 0x00A7 = Version A7.
Table 43. Hardware Version
SBS
CMD
MODE
NAME
FORMAT
SIZE IN
BYTES
MIN VALUE
MAX VALUE
DEFAULT
VALUE
0x00
R
Hardware Version
Hex
2
—
—
—
8.5.2.2.1.4
UNIT
DF Checksum (0x0004)
This function is only available when the BQ33100 is in UNSEALED mode, indicated by the [SS] OperationStatus
flag. A write to this command forces the BQ33100 to generate a checksum of the full data flash (DF) array. The
generated checksum is then returned within 45 ms.
NOTE
If another SMBus command is received while the checksum is being generated, the DF
checksum is generated but the response may time out.
Table 44. DF Checksum
SBS
CMD
MODE
NAME
FORMAT
SIZE IN
BYTES
MIN VALUE
MAX VALUE
DEFAULT
VALUE
0x0004
R
DF Checksum
Hex
2
—
—
—
8.5.2.2.1.5
UNIT
Seal Device (0x0020)
Instructs the BQ33100 to limit access to the extended SBS functions and data flash space, sets the [SS] flag.
This command is only available when the BQ33100 is in UNSEALED mode. See Security (Enables and Disables
Features) for detailed information.
8.5.2.2.1.6 Lifetime and Capacitor Balancing Enable (0x0021)
Enables and Disables the logging of lifetime data to non-volatile memory and capacitor balancing
8.5.2.2.1.7
FAULT Activation (0x0030)
This command drives the FAULT pin high. This command is only available when the BQ33100 is in UNSEALED
mode.
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FAULT Clear (0x0031)
This command sets the FAULT pin back to low. This command is only available when the BQ33100 is in
UNSEALED mode.
8.5.2.2.1.9
CHGLVL0 Activation (0x0032)
This command drives the CHGLVL0 pin high. This command is only available when the BQ33100 is in
UNSEALED mode.
8.5.2.2.1.10
CHGLVL0 Clear (0x0033)
This command sets the CHGLVL0 pin back to low. This command is only available when the BQ33100 is in
UNSEALED mode.
8.5.2.2.1.11
CHGLVL1 Activation (0x0033)
This command drives the CHGLVL0 pin high. This command is only available when the BQ33100 is in
UNSEALED mode.
8.5.2.2.1.12
CHGLVL1 Clear (0x0034)
This command sets the CHGLVL0 pin back to low. This command is only available when the BQ33100 is in
UNSEALED mode.
8.5.2.2.1.13
Learn Load Activation (0x0037)
This command drives the LLEN pin high. This command is only available when the BQ33100 is in UNSEALED
mode.
8.5.2.2.1.14
Learn Load Clear (0x0038)
This command sets the LLEN pin back to low. This command is only available when the BQ33100 is in
UNSEALED mode.
8.5.2.2.1.15 Calibration Mode (0x0040)
Places the BQ33100 into CALIBRATION mode. This command is only available when the BQ33100 is in
UNSEALED mode.
8.5.2.2.1.16 Reset (0x0041)
The BQ33100 undergoes a full reset. The BQ33100 holds the clock line down for a few milliseconds to complete
the reset. If ChargingVoltage() < Voltage after a reset, then the pack is discharged using the capacitor voltage
balancing circuitry. This command is only available when the BQ33100 is in UNSEALED mode.
8.5.2.2.1.17 Unseal Device (UnsealKey)
Instructs the BQ33100 to enable access to the SBS functions and data flash space and clear the [SS] flag. This
two-step command needs to be written to ManufacturerAccess in the following order: 1st word of the UnSealKey
followed by the 2nd word of the UnSealKey. If the command fails 4 seconds must pass before the command can
be reissued. This command is only available when the BQ33100 is in SEALED mode. See Security (Enables and
Disables Features) for detailed information.
8.5.2.2.1.18 Extended SBS Commands
Also available through ManufacturerAccess in UNSEALED mode are some of the extended SBS commands. The
result of these commands need to be read from ManufacturerAccess after a write to ManufacturerAccess.
8.5.2.2.2 Temperature (0x08)
This read-word function returns an unsigned integer value of the temperature in units of 0.1°K, as measured by
the BQ33100. It has a range of 0 to 6553.5°K. The source of the measured temperature is configured by the
[TEMP1] and [TEMP0] bits in the Operation Cfg register.
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Table 45. Temperature
SBS
CMD
MODE
NAME
FORMAT
SIZE IN
BYTES
MIN VALUE
MAX VALUE
DEFAULT
VALUE
UNIT
0x08
R
Temperature
Unsigned
Integer
2
0
65535
—
0.1°K
8.5.2.2.3 Voltage (0x09)
This read-word function returns an unsigned integer value of the capacitor stack array (voltage at the VC1 input)
in mV with a range of 0 to 20000 mV.
Table 46. Voltage
SBS
CMD
MODE
NAME
FORMAT
SIZE IN
BYTES
MIN VALUE
MAX VALUE
DEFAULT
VALUE
UNIT
0x09
R
Voltage
Unsigned
Integer
2
0
20000
—
mV
8.5.2.2.4 Current (0x0A)
This read-word function returns a signed integer value of the measured current being supplied (or accepted) by
the super capacitor pack in mA, with a range of –32768 to 32767. A positive value indicates charge current and a
negative value indicates discharge.
Any current value within the Deadband will be reported as 0 mA by the Current function.
Table 47. Current
SBS
CMD
MODE
NAME
FORMAT
SIZE IN
BYTES
MIN VALUE
MAX VALUE
DEFAULT
VALUE
UNIT
0x0A
R
Current
Unsigned
Integer
2
–32768
32767
—
mA
8.5.2.2.5 ESR (0x0B)
This read-word function returns an unsigned integer value of the Super Capacitor array total ESR in mΩ with a
range of 0 to 65535 mΩ.
Table 48. ESR
SBS
CMD
MODE
NAME
FORMAT
SIZE IN
BYTES
MIN VALUE
MAX VALUE
DEFAULT
VALUE
UNIT
0x0B
R
ESR
Unsigned
Integer
2
0
65535
—
mΩ
8.5.2.2.6 RelativeStateofCharge (0x0D)
This read-word function returns an unsigned integer value of the predicted remaining super capacitor
capacitance expressed as a percentage of Capacitance with a range of 0 to 100%, with fractions of % rounded
up.
If the [RSOCL] bit in Operation Cfg is set, then RelativeStateofCharge is held at 99% until primary charge
termination occurs and only displays 100% upon entering primary charge termination.
If the [RSOCL] bit inOperation Cfg is cleared, then RelativeStateofCharge is not held at 99% until primary
charge termination occurs. Fractions of % greater than 99% are rounded up to display 100%.
Table 49. RelativeStateofCharge
SBS
CMD
MODE
NAME
FORMAT
SIZE IN
BYTES
MIN VALUE
MAX VALUE
DEFAULT
VALUE
UNIT
0x0D
R
RelativeStateofCh
arge
Unsigned
Integer
1
0
100
—
%
34
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8.5.2.2.7 Health (0x0E)
This read-word function returns an unsigned integer value of the predicted health of the super capacitor pack
expressed as a percentage of Capacitance / InitialCapacitance with a range of 0 to 100%, with fractions of %
rounded up.
Table 50. Health
SBS
CMD
MODE
NAME
FORMAT
SIZE IN
BYTES
MIN VALUE
MAX VALUE
DEFAULT
VALUE
UNIT
0x0E
R
Health
Unsigned
Integer
1
0
100
—
%
8.5.2.2.8 Capacitance (0x10)
This read- or write-word function returns an unsigned integer value, with a range of 0 to 65535, of the predicted
full charge capacitance in the super capacitor pack. This value is expressed in F.
Table 51. Capacitance
SBS
CMD
MODE
NAME
FORMAT
SIZE IN
BYTES
MIN VALUE
MAX VALUE
DEFAULT
VALUE
UNIT
0x10
R/W
Capacitance
Unsigned
Integer
2
0
65534
—
F
8.5.2.2.9 ChargingCurrent (0x14)
This read-word function returns an unsigned integer value of the desired charging current, in mA, with a range of
0 to 65534.
Table 52. ChargingCurrent
SBS
CMD
MODE
NAME
FORMAT
SIZE IN
BYTES
MIN VALUE
MAX VALUE
DEFAULT
VALUE
UNIT
0x14
R
ChargingCurrent
Unsigned
Integer
2
0
65534
—
mA
8.5.2.2.10 ChargingVoltage (0x15)
This read-word function returns an unsigned integer value of the desired charging voltage, in mV, where the
range is 0 to 65534.
Table 53. ChargingVoltage
SBS
CMD
MODE
NAME
FORMAT
SIZE IN
BYTES
MIN VALUE
MAX VALUE
DEFAULT
VALUE
UNIT
0x15
R
ChargingVoltage
Unsigned
Integer
2
0
65534
—
mV
8.5.2.2.11 CapacitorVoltage5..1 (0x3B..0x3F)
These read-word functions return an unsigned value of the calculated individual capacitor voltages, in mV, with a
range of 0 to 65535. CapacitorVoltage1 corresponds to the bottom most series capacitor element, while
CapacitorVoltage5 corresponds to the top-most series capacitor element.
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Table 54. CapacitorVoltage5..1
SBS
CMD
MODE
NAME
0x3B
CapacitorVoltage
5
0x3C
CapacitorVoltage
4
0x3D
R
CapacitorVoltage
3
0x3E
CapacitorVoltage
2
0x3F
CapacitorVoltage
1
FORMAT
SIZE IN
BYTES
MIN VALUE
MAX VALUE
DEFAULT
VALUE
UNIT
Unsigned
Integer
2
0
65535
—
mV
8.5.2.2.12 Extended SBS Commands
Also available through ManufacturerAccess in SEALED mode are some of the extended SBS commands. The
commands available are listed below. The result of these commands needs to be read from ManufacturerAccess
after a write to ManufacturerAccess.
8.5.2.2.12.1 FETControl(0x46)
This write- and read-word function allows direct control of the CHG FET for test purposes. The BQ33100
overrides this command unless in NORMAL mode.
Table 55. FETControl
SBS
CMD
MODE
NAME
FORMAT
SIZE IN
BYTES
MIN VALUE
MAX VALUE
DEFAULT
VALUE
0x46
R
FETControl
hex
2
0x0000
0xffff
—
UNIT
Figure 6. FETControl Registers
15
RSVD
7
RSVD
14
RSVD
6
RSVD
13
RSVD
5
RSVD
12
RSVD
4
RSVD
11
RSVD
3
RSVD
10
RSVD
2
CHG
9
RSVD
1
RSVD
8
RSVD
0
RSVD
LEGEND: All values are read-only.
CHG—Charge (CHG) FET Control
0 = CHG FET is turned OFF.
1 = CHG FET is turned ON.
8.5.2.2.12.2 SafetyAlert (0x50)
This read-word function returns indications of pending safety issues, such as running safety timers, or fail
counters that are non-0, but have not reached the required time or value to trigger a SafetyStatus failure. These
flags do not cause the FAULT pin to be set.
Table 56. SafetyAlert
SBS
CMD
MODE
NAME
FORMAT
SIZE IN
BYTES
MIN VALUE
MAX VALUE
DEFAULT
VALUE
0x50
R
SafetyAlert
hex
2
0x0000
0xffff
—
36
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Figure 7. SafetyAlert Registers
15
CLBAD
7
RSVD
14
RSVD
6
RSVD
13
RSVD
5
RSVD
12
RSVD
4
RSVD
11
RSVD
3
OCC
10
OTC
2
OCD
9
CIM
1
SCC
8
OV
0
SCD
LEGEND: All values are read-only.
CLBAD
1 = Excessive capacitor leakage alert
OTC
1 = Charge overtemperature alert
CIM
1 = Capacitor voltage Imbalance permanent failure alert
OV
1 = Capacitor overvoltage alert
OCC
1 = Overcurrent during charge alert
OCD
1 = AFE overcurrent during discharge alert
SCC
1 = AFE short circuit during charge alert
SCD
1 = AFE short circuit during discharge alert
8.5.2.2.12.3 SafetyStatus (0x51)
This read-word function returns the status of the safety features. These flags do not cause the FAULT pin to be
set unless the corresponding bit in FAULT is set.
Table 57. SafetyStatus
SBS
CMD
MODE
NAME
FORMAT
SIZE IN
BYTES
MIN VALUE
MAX VALUE
DEFAULT
VALUE
0x51
R
SafetyStatus
hex
2
0x0000
0xffff
—
UNIT
Figure 8. SafetyStatus Registers
15
CLBAD
7
DFF
14
HFAIL
6
RSVD
13
HWARN
5
AFE_C
12
HLOW
4
WDF
11
RSVD
3
OCC
10
OT
2
OCD
9
CIM
1
SCC
8
OV
0
SCD
LEGEND: All values are read-only.
CLBAD
1 = Excessive capacitor leakage fault
HWARN
1 = Health low warning
HLOW
1 = Health low indication
HFAIL
1 = Health failure
OT
1 = Charge overtemperature fault
CIM
1 = Capacitor voltage Imbalance fault
OV
1 = Capacitor overvoltage fault
DFF
1 = Data flash fault permanent failure fault
AFE_C
1 = Permanent AFE Communications failure fault
WDF
1 = AFE watchdog fault
OCC
1= Overcurrent during charge fault
OCD
1= AFE overcurrent during discharge fault
SCC
1= AFE short circuit during charge fault
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SCD
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1= AFE short circuit during discharge fault
8.5.2.2.12.4 OperationStatus (0x54)
This read-word function returns the current operation status.
Table 58. OperationStatus
SBS
CMD
MODE
NAME
FORMAT
SIZE IN
BYTES
MIN VALUE
MAX VALUE
DEFAULT
VALUE
0x54
R
OperationStatus
hex
2
0x0000
0xf7f7
—
UNIT
Figure 9. OperationStatus Registers
15
RSVD
7
LDTO
14
DSG
6
LCTO
13
SS
5
LPASS
12
FC
4
CL
11
LTE
3
RSVD
10
RSVD
2
CFET
9
CHGOR
1
RSVD
8
CB
0
RSVD
DSG
Discharging
0 = BQ33100 is in CHARGING mode.
1 = BQ33100 is in DISCHARGING mode, RELAXATION mode, or a valid charge termination
has occurred.
SS
1 = Sealed security mode
FC
1 = Fully charged
LTE
1 = Lifetime data and CHG FET operation enabled
CHGOR
1 = Charge override enabled
CB
1 = Capacitor voltage balancing in progress
CL
1 = Capacitance learning in progress
LPASS
1 = Learning complete and successful
LCTO
1 = Learning charging phase time out
LDTO
1 = Learning discharging phase time out
8.5.2.2.12.5 SystemVoltage (0x5a)
This read-word function returns an unsigned integer value of the voltage at VCC (pin 24) in mV with a range of 0
mV to 20000 mV.
Table 59. SystemVoltage
SBS
CMD
MODE
NAME
FORMAT
SIZE IN
BYTES
MIN VALUE
MAX VALUE
DEFAULT
VALUE
UNIT
0x5a
R
SystemVoltage
Unsigned
Integer
2
0
20000
—
mV
8.5.2.2.12.6 UnSealKey(0x60)
This read- or write-block command allows the user to change the Unseal key for the Sealed-to-Unsealed
security-state transition. This function is only available when the BQ33100 is in the UNSEALED mode, indicated
by a cleared [SS] flag.
The order of the bytes, when entered in ManufacturerAccess, is the reverse of what is written to or read from the
part. For example, if the 1st and 2nd word of the UnSealKey block read returns 0x1234 and 0x5678, then in
ManufacturerAccess, 0x3412 and 0x7856 must be entered to unseal the part.
38
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Table 60. UnSealKey
SBS
CMD
MODE
NAME
FORMAT
SIZE IN
BYTES
MIN VALUE
MAX VALUE
DEFAULT
VALUE
0x60
R/W
UnSealKey
Hex
4
0x00000000
0xffffffff
—
UNIT
8.5.2.2.12.7 ManufacturerInfo(0x70)
This read and write block function returns the data stored in Manuf. Info where byte 0 is the MSB with a
maximum length of 31 data + 1 length byte. When the BQ33100 is in UNSEALED mode, this block is read and
write. When the BQ33100 is in SEALED mode, this block is read-only.
Table 61. ManufacturerInfo
SBS
CMD
MODE
NAME
FORMAT
SIZE IN
BYTES
MIN VALUE
MAX VALUE
DEFAULT
VALUE
0x70
R/W
ManufacturerInfo
String
31+1
—
—
—
UNIT
8.5.3 Data Flash
NOTE
Take care when mass programming the data flash space using previous versions of data
flash memory map files (such as *.gg files) to make sure that all public locations are
updated correctly.
Data flash can only be updated if Voltage ≥ Flash Update OK Voltage. Data flash reads and writes are verified
according to the method detailed in the Data Flash Fault (DFF) section of this data sheet.
8.5.3.1 Accessing Data Flash
In different security modes, the data flash access conditions change. See Security (Enables and Disables
Features) and ManufacturerAccess (0x00) sections for further details.
8.5.3.2 Data Flash Interface
The BQ33100 data flash is organized into subclasses where each data flash variable is assigned an offset within
its numbered subclass: for example, the OT Time location is defined as:
•
•
•
Class = Safety
SubClass = Temperature = 2
Offset = 2
NOTE
Data flash commands are NACKed if the BQ33100 is in SEALED mode ([SS] flag is set).
Each subclass can be addressed individually by using the DataFlashSubClassID (0x77) command, and the data
within each subclass is accessed by using the DataFlashSubClassPage1..8 (0x78...0x7f) commands. Reading
and writing subclass data are block operations which are each 32 bytes long. However, data can be written in
shorter block sizes. The final block in one subclass can be shorter than 32 bytes so take care not to write over
the subclass boundary. No values written are bounded by the BQ33100 and the values are not rejected by the
BQ33100. Writing an incorrect value may result in hardware failure due to firmware program interpretation of the
invalid data. The data written is persistent, so a power on reset does resolve the fault.
8.5.3.3 Data Flash Summary
The following notation is used in Table 62 with regards to the Data Type column:
The Alpha Character
• H = Hexadecimal value
• I = Integer value
• S = String
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U = Unsigned Integer value
The Numeric Value following the alpha character is the length of the data in bytes: for example, OT Time
Data Type = U1 = Unsigned Integer of 1 byte in length.
Table 62. Data Flash Values
40
CLASS
NAME
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
PARAMETE
R NAME
DATA
TYPE
Safety
0
Voltage
0
OV Threshold
Safety
0
Voltage
2
OV Recovery
Safety
0
Voltage
4
MIN
MAX
DEFAULT
UNITS
I2
0
1000
100
mV
I2
–500
1000
0
mV
OV Time
U1
0
255
2
s
I2
0
5000
550
mV
Safety
0
Voltage
5
CIM Fail
Voltage
Safety
0
Voltage
7
CIM Time
U1
0
240
10
s
I2
0
5000
500
mV
U2
0
65535
1000
mV
Safety
0
Voltage
8
CIM
Recovery
Safety
0
Voltage
10
Min CIM
Check
Voltage
Safety
1
Current
0
OC Chg
I2
0
5000
1000
mA
Safety
1
Current
2
OC Chg Time
U1
0
240
5
mA
I2
–1000
5000
900
mA
Safety
1
Current
3
OC Chg
Recovery
Safety
1
Current
5
CLBAD
Current
I2
0
30000
15
mA
Safety
1
Current
7
CLBAD Time
U1
0
240
60
s
I2
0
1000
10
mA
Safety
1
Current
8
CLBAD
Recovery
Safety
1
Current
10
Current
Recovery
Time
U1
0
240
5
s
Safety
1
Current
11
OC Dsg
H1
0
f
F
hex
Safety
1
Current
12
OC Dsg Time
H1
0
f
F
hex
I2
5
1000
5
mA
Safety
1
Current
13
OC Dsg
Recovery
Safety
1
Current
15
SC Chg Cfg
H1
0
f7
f4
hex
Safety
1
Current
16
SC Dsg Cfg
H1
0
f7
f7
hex
Safety
1
Current
17
SC Recovery
I2
0
200
1
mA
Safety
2
Temperature
0
OT Chg
I2
0
1200
680
0.1ºC
Safety
2
Temperature
2
OT Chg Time
U1
0
240
2
s
I2
0
1200
630
0.1ºC
Safety
2
Temperature
3
OT Chg
Recovery
Safety
3
AFE
Verification
1
AFE Fail Limit
U1
0
255
100
Counts
Safety
3
AFE
Verification
3
AFE Init Retry
Limit
U1
0
255
6
num
Safety
3
AFE
Verification
4
AFE Init Limit
U1
0
255
20
Counts
Charge
Control
34
Charge Cfg
0
Chg Voltage
I2
0
32767
8400
mV
Charge
Control
34
Charge Cfg
2
Chg Current
I2
0
20000
500
mA
Charge
Control
34
Charge Cfg
4
Chg Enable
Delay
U2
0
65000
0
ms
Charge
Control
35
Full Charge
Cfg
0
Taper Current
I2
0
1000
3
mA
Charge
Control
35
Full Charge
Cfg
2
Taper
Voltage
I2
0
1000
100
mVolt
Charge
Control
35
Full Charge
Cfg
4
Current Taper
Window
U1
0
240
2
s
Charge
Control
35
Full Charge
Cfg
5
FC Set %
I1
-1
100
–1
Percent
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Table 62. Data Flash Values (continued)
CLASS
NAME
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
PARAMETE
R NAME
DATA
TYPE
MIN
MAX
DEFAULT
UNITS
Charge
Control
35
Full Charge
Cfg
6
FC Clear %
I1
-1
100
98
Percent
Charge
Control
36
Capacitance
Balancing Cfg
0
CB Threshold
I2
0
5000
1500
mVolt
Charge
Control
36
Capacitance
Balancing Cfg
2
CB Min
U1
0
255
5
mVolt
Charge
Control
36
Capacitance
Balancing Cfg
3
CB Restart
U1
0
255
10
mVolt
System Data
48
Data
0
Design
Voltage
I2
0
18000
8400
mVolt
System Data
48
Data
2
Manuf Date
U2
0
65535
0
Day + Mo × 32 +
(Yr – 1980)
× 256
System Data
48
Data
4
Ser. Num.
H2
0
ffff
1
hex
I2
0
65535
250
F
F
System Data
48
Data
6
Design
Capacitance
System Data
48
Data
8
Init 1st
Capacitance
I2
0
65535
250
System Data
48
Data
10
Capacitance
I2
0
65535
250
F
System Data
48
Data
12
Design ESR
I2
0
65535
320
mΩ
System Data
48
Data
14
Initial ESR
I2
0
65535
320
mΩ
System Data
48
Data
16
ESR
I2
0
65535
320
mΩ
—
System Data
48
Data
18
Manuf Name
S12
x
x
Texas
Instruments
System Data
48
Data
30
Device Name
S8
x
x
BQ33100
—
H2
0
ffff
0
hex
System Data
48
Data
38
Init Safety
Status
System Data
56
Manufacturer
Data
0
Pack Lot
Code
H2
0
ffff
0
—
System Data
56
Manufacturer
Data
2
PCB Lot
Code
H2
0
ffff
0
—
System Data
56
H2
0
ffff
0
—
System Data
56
Manufacturer
Data
6
HardwareVer
sion
H2
0
ffff
0
—
System Data
58
Manufacturer
Info
0
Manuf. Info
S32
x
x
0123456789A
BCDEF01234
56789ABCDE
—
System Data
59
Lifetime Data
0
Lifetime Max
Temp
I2
0
1400
0
0.1ºC
System Data
59
Lifetime Data
2
Lifetime Min
Temp
I2
–600
1400
500
0.1ºC
System Data
59
Lifetime Data
4
Lifetime Max
Capacitor
Voltage
I2
0
32767
0
mVolt
Configuration
64
Registers
0
Operation Cfg
H2
0
FFFF
308
flags
Configuration
64
Registers
4
FET Action
H2
0
FFFF
0
flags
Configuration
64
Registers
8
Fault
H2
0
FFFF
0
flags
H1
0
ff
0
flags
Manufacturer
Data
4
Firmware
Version
Configuration
65
AFE
1
AFE
State_CTL
Configuration
67
Power
0
Flash Update
OK Voltage
I2
0
20000
4000
mVolt
Configuration
67
Power
2
Shutdown
Voltage
I2
0
5500
4000
mVolt
Monitoring
86
System
Requirement
0
Min Power
I2
0
16800
10
Watt/100
Monitoring
86
System
Requirement
2
Required
Time
I2
0
32767
60
s
Monitoring
86
System
Requirement
4
Min Voltage
I2
0
10000
4000
mVolt
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Table 62. Data Flash Values (continued)
CLASS
NAME
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
PARAMETE
R NAME
DATA
TYPE
MIN
MAX
DEFAULT
UNITS
Monitoring
87
Charging
Voltage
0
V Chg
Nominal
I2
0
32767
8400
mVolt
Monitoring
87
Charging
Voltage
2
V Chg A
I2
0
32767
8900
mVolt
Monitoring
87
Charging
Voltage
4
V Chg B
I2
0
32767
9500
mVolt
Monitoring
87
Charging
Voltage
6
V Chg Max
I2
0
32767
10000
mVolt
Monitoring
87
Charging
Voltage
8
V Learn Max
I2
0
32767
10000
mVolt
Monitoring
88
Learning
Configuration
0
Learning
Frequency
U1
0
255
2
week
Monitoring
88
Learning
Configuration
1
Measurement
Margin %
U1
0
100
10
Percent
Monitoring
88
Learning
Configuration
2
Max Chg
Time
I2
0
32767
300
s
Monitoring
88
Learning
Configuration
4
Max Dsg
Time
I2
0
32767
10
s
Monitoring
88
Learning
Configuration
6
Learn Delta
Voltage
I2
0
2000
500
mVolt
Monitoring
88
Learning
Configuration
8
Cap Start
Time
U2
0
65535
320
msec
Monitoring
81
Current
Thresholds
0
Dsg Current
Threshold
I2
0
2000
10
mA
Monitoring
81
Current
Thresholds
2
Chg Current
Threshold
I2
0
2000
0
mA
Calibration
104
Data
0
Current Gain
F4
1.00E – 01
4.00E + 00
0.47095
Number
Calibration
104
Data
4
CC Delta
F4
2.98E + 04
1.19E + 06
140466.3
Number
Calibration
104
Data
8
Cap1 K-factor
I2
0
32767
20500
—
Calibration
104
Data
10
Cap2 K-factor
I2
0
32767
20500
—
Calibration
104
Data
12
Cap3 K-factor
I2
0
32767
20500
—
Calibration
104
Data
14
Cap4 K-factor
I2
0
32767
20500
—
Calibration
104
Data
16
Cap5 K-factor
I2
0
32767
20500
—
H2
0
FFFF
0
num
Calibration
104
Data
18
K-factor cap
override flag
Calibration
104
Data
20
System
Voltage Kfactor
I2
0
32767
24500
—
Calibration
104
Data
22
Stack Voltage
K-factor
I2
0
32767
24500
—
Calibration
104
Data
24
K-factor stack
override flag
H2
0
FFFF
0
num
Calibration
104
Data
26
CC Offset
I2
–32768
32767
–7744
num
Calibration
104
Data
28
Board Offset
I2
–32767
32767
0
uV
I1
–128
127
0
0.1ºC
Calibration
104
Data
30
Int Temp
Offset
Calibration
104
Data
31
Ext1 Temp
Offset
I1
–128
127
0
0.1ºC
Calibration
104
Data
32
Ext2 Temp
Offset
I1
–128
127
0
0.1ºC
Calibration
104
Data
33
ESR Offset
I1
–128
127
0
mΩ
Calibration
105
Config
0
CC Current
I2
0
32767
3000
mA
Calibration
105
Config
2
Voltage
Signal
I2
0
32767
8400
mVolt
Calibration
105
Config
4
Temp Signal
I2
0
32767
2980
0.1ºK
U2
0
65535
250
s
U2
0
65535
32
s
Calibration
105
Config
6
CC Offset
Time
Calibration
105
Config
8
ADC Offset
Time
42
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Table 62. Data Flash Values (continued)
CLASS
NAME
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
PARAMETE
R NAME
DATA
TYPE
MIN
MAX
DEFAULT
UNITS
Calibration
105
Config
10
CC Gain
Time
U2
0
65535
250
s
Calibration
105
Config
12
Voltage Time
U2
0
65535
1984
ms
U2
0
65535
32
s
Calibration
105
Config
14
Temperature
Time
Calibration
105
Config
17
Cal Mode
Timeout
U2
0
65535
38400
s/128
Calibration
106
Temp Model
0
Ext Coef a1
I2
–32768
32767
–14812
num
Calibration
106
Temp Model
2
Ext Coef a2
I2
–32768
32767
24729
num
Calibration
106
Temp Model
4
Ext Coef a3
I2
–32768
32767
–21265
num
Calibration
106
Temp Model
6
Ext Coef a4
I2
–32768
32767
28353
num
Calibration
106
Temp Model
8
Ext Coef a5
I2
–32768
32767
759
num
Calibration
106
Temp Model
10
Ext Coef b1
I2
–32768
32767
–399
num
Calibration
106
Temp Model
12
Ext Coef b2
I2
–32768
32767
764
num
Calibration
106
Temp Model
14
Ext Coef b3
I2
–32768
32767
–3535
num
Calibration
106
Temp Model
16
Ext Coef b4
I2
–32768
32767
5059
num
Calibration
106
Temp Model
18
Ext rc0
I2
–32768
32767
11703
num
Calibration
106
Temp Model
20
Ext adc0
I2
–32768
32767
11813
num
Calibration
106
Temp Model
22
Rpad
I2
–32768
32767
87
Ω
Calibration
106
Temp Model
24
Rint
I2
–32768
32767
17740
Ω
Calibration
106
Temp Model
26
Int Coef 1
I2
–32768
32767
0
s
Calibration
106
Temp Model
28
Int Coef 2
I2
–32768
32767
0
s
Calibration
106
Temp Model
30
Int Coef 3
I2
–32768
32767
–12263
s
Calibration
106
Temp Model
32
Int Coef 4
I2
–32768
32767
6106
s
Calibration
106
Temp Model
34
Int Min AD
I2
–32768
32767
0
s
Calibration
106
Temp Model
36
Int Max Temp
I2
–32768
32767
6106
0.1ºK
Calibration
107
Current
0
Filter
U1
0
255
239
Number
Calibration
107
Current
1
Dead Band
U1
0
255
5
mA
2
CC
Deadband
U1
0
255
10
294 nV
Calibration
107
Current
8.5.3.4 Specific Data Flash Programming Details
In this section, the data flash values that are not detailed elsewhere in this data sheet are shown in detail and
others are summarized for easy reference.
8.5.3.4.1 OC Dsg
The OC Dsg is programmed into the OCDV register of the integrated AFE device. The OC Dsg sets the
overcurrent in discharging voltage threshold. Changes to this data flash value require a firmware full reset or a
power reset of the BQ33100 to take effect.
Table 63. OC Dsg
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
NAME
FORMAT
SIZE IN
BYTES
MIN
VALUE
MAX
VALUE
DEFAULT
VALUE
UNIT
1
Current
11
OC Dsg
Hex
1
0x00
0x0F
0x0F
—
Figure 10. OCDV Register
7
—
6
—
5
—
4
—
3
OCDV3
2
OCDV2
1
OCDV1
0
OCDV0
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0000 is the BQ33100 power on reset default.
OCDV3, OCDV2, OCDV1, OCDV0—Sets the overcurrent voltage threshold (VSRP-VSRN)) in discharging of the
integrated AFE.
0x0 – 0xf = sets the short circuit in discharging delay between 0 ms – 915-ms in 61-ms steps.
[RSNS] = 0, 0x0 – 0xf sets the voltage threshold between 50 mV and 200 mV in 10-mV steps.
[RSNS] = 1, 0x0 – 0xf sets the voltage threshold between 20 mV and 100 mV in 5-mV steps.
OCDV (b7...b4)—Not used
Table 64. OCDV (b2-b0) Configuration Bits with Corresponding Voltage Threshold When
STATE_CTL[RSNS] = 0
SETTING
THRESHOLD
SETTING
THRESHOLD
0x00
0.050 V
0x08
0.130 V
0x01
0.060 V
0x09
0.140 V
0x02
0.070 V
0x0A
0.150 V
0x03
0.080 V
0x0B
0.160 V
0x04
0.090 V
0x0C
0.170 V
0x05
0.100 V
0x0D
0.180 V
0x06
0.110 V
0x0E
0.190 V
0x07
0.120 V
0x0F
0.200 V
Table 65. OCDV (b2-b0) Configuration Bits with Corresponding Voltage Threshold When
STATE_CTL[RSNS] = 1
SETTING
THRESHOLD
SETTING
THRESHOLD
0x00
0.025 V
0x08
0.065 V
0x01
0.050 V
0x09
0.070V
0x02
0.035 V
0x0A
0.075 V
0x03
0.040 V
0x0B
0.080 V
0x04
0.045 V
0x0C
0.085 V
0x05
0.050 V
0x0D
0.090 V
0x06
0.055 V
0x0E
0.095V
0x07
0.060 V
0x0F
0.100 V
8.5.3.4.2 OC Dsg Time
The OC Dsg Time is programmed into the OCDD register of the integrated AFE device. The OC Dsg Time sets
the overcurrent in discharging delay. Changes to this data flash value require a firmware full reset or a power
reset of the BQ33100 to take effect.
Table 66. OC Dsg Time
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
NAME
FORMAT
SIZE IN
BYTES
MIN
VALUE
MAX
VALUE
DEFAULT
VALUE
UNIT
1
Current
12
OC Dsg Time
Hex
1
0x00
0x0F
0x0F
—
Figure 11. OCDD Register
7
—
44
6
—
5
—
4
—
3
OCDD3
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2
OCDD2
1
OCDD1
0
OCDD0
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0000 is the BQ33100 power on reset default.
OCDD3, OCDD2, OCDD1, OCDD0—Sets the overcurrent in discharging delay of the integrated AFE
0x0 – 0xf = sets the overvoltage trip delay between 1 ms to 31-ms in 2-ms steps
OCDD (b7...b4) —Not used
Table 67. OCDD (b7-b4) Configuration Bits With Corresponding Delay Time
SETTING
DELAY
SETTING
DELAY
SETTING
DELAY
SETTING
DELAY
0x00
1 ms
0x04
9 ms
0x08
17 ms
0x0C
25 ms
0x01
3 ms
0x05
11 ms
0x09
19 ms
0x0D
27 ms
0x02
5 ms
0x06
13 ms
0x0A
21 ms
0x0E
29 ms
0x03
7 ms
0x07
15 ms
0x0B
23 ms
0x0F
31 ms
8.5.3.4.3 SC Dsg Cfg
The SC Dsg Cfg is programmed into the SCD register of the integtrated AFE device. The SC Dsg Cfg sets the
short circuit in discharging voltage threshold and the short circuit in discharging delay. Changes to this data flash
value require a firmware full reset or a power reset of the BQ33100 to take effect.
Table 68. SC Dsg Cfg
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
NAME
FORMAT
SIZE IN
BYTES
MIN
VALUE
MAX
VALUE
DEFAULT
VALUE
UNIT
1
Current
16
SC Dsg Cfg
Hex
1
0x00
0x0F
0x0F
—
Figure 12. SCD Register
7
SCDD3
6
SCDD2
5
SCDD1
4
SCDD0
3
—
2
SCDV2
1
SCDV1
0
SCDV0
0000 is the BQ33100 power on reset default.
SCDD3, SCDD2, SCDD1, SCDD0—Sets the short circuit delay in discharging of the integrated AFE.
0x0 – 0xf = sets the short circuit in discharging delay between 0 ms to 915 ms in 61-ms steps.
If STATE_CTL[SCDDx2] is set, the delay time is double of that programmed in this register.
SCDV2, SCDV1, SCDV0—Sets the short circuit voltage threshold (VSRP-VSRN)) in discharging of the
integrated AFE
[RSNS] = 0, 0x0 – 0x7 sets the short circuit voltage threshold between 100 mV and 450 mV in 50-mV steps.
[RSNS] = 1, 0x0 – 0x7 sets the short circuit voltage threshold between 50 mV and 475 mV in 25-mV steps.
SCD (b3)—Not used
Table 69. SCDV (b2-b0) Configuration Bits with Corresponding Voltage Threshold When
STATE_CTL[RSNS] = 0
SETTING
THRESHOLD
SETTING
THRESHOLD
0x00
0.100 V
0x04
0.300 V
0x01
0.150 V
0x05
0.350 V
0x02
0.200 V
0x06
0.400 V
0x03
0.250 V
0x07
0.450 V
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Table 70. SCDV (b2-b0) Configuration Bits with Corresponding Voltage Threshold When
STATE_CTL[RSNS] = 1
SETTING
THRESHOLD
SETTING
THRESHOLD
0x00
0.050 V
0x04
0.150 V
0x01
0.075 V
0x05
0.175 V
0x02
0.100 V
0x06
0.200 V
0x03
0.125 V
0x07
0.225 V
Table 71. SCDD (b7-b4) Configuration Bits with Corresponding Delay Time
SETTING
DELAY
SETTING
DELAY
SETTING
DELAY
SETTING
DELAY
0x00
0 µs
0x04
244 µs
0x08
488 µs
0x0C
732 µs
0x01
61 µs
0x05
305 µs
0x09
549 µs
0x0D
793 µs
0x02
112 µs
0x06
366 µs
0x0A
610 µs
0x0E
854 µs
0x03
183 µs
0x07
427 µs
0x0B
671 µs
0x0F
915 µs
8.5.3.4.4 SC Chg Cfg
SC Chg Cfg is programmed into the SCC register of the integtrated AFE device. The SC Chg Cfg sets the short
circuit in charging voltage threshold and the short circuit in charging delay. Changes to this data flash value
require a firmware full reset or a power reset of the BQ33100 to take effect.
Table 72. SC Chg Cfg
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
NAME
FORMAT
SIZE IN
BYTES
MIN
VALUE
MAX
VALUE
DEFAULT
VALUE
UNIT
1
Current
15
SC Chg Cfg
Hex
1
0x00
0xF7
0xF7
—
Figure 13. SCC Register
7
SCCD3
6
SCCD2
5
SCCD1
4
SCCD0
3
—
2
SCCV2
1
SCCV1
0
SCCV0
0000 is the BQ33100 power on reset default.
SCCD3, SCCD2, SCCD1, SCCD0—Sets the short circuit delay in charging of the integrated AFE
0x0 – 0xf = Sets the short circuit in charging delay between 0 ms to 915 ms in 61-ms steps
If STATE_CTL[SCDDx2] is set, the delay time is double of that programmed in this register.
SCCV2, SCCV1, SCCV0—Sets the short circuit voltage threshold (VSRP-VSRN)) in charging of the integrated
AFE
[RSNS] = 0, 0x0 – 0x7 sets the short circuit voltage threshold between 100 mV and 450 mV in 50-mV steps.
[RSNS] = 1, 0x0 – 0x7 sets the short circuit voltage threshold between 50 mV and 475 mV in 25-mV steps.
SCC (b3)—Not used
Table 73. SCCV (b2-b0) Configuration Bits with Corresponding Voltage Threshold When
STATE_CTL[RSNS] = 0
46
SETTING
THRESHOLD
SETTING
THRESHOLD
0x00
–0.100 V
0x04
–0.300 V
0x01
–0.150 V
0x05
n/a
0x02
–0.200 V
0x06
n/a
0x03
–0.250 V
0x07
n/a
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Table 74. SCCV (b2-b0) Configuration Bits with Corresponding Voltage Threshold When
STATE_CTL[RSNS] = 1
SETTING
THRESHOLD
SETTING
THRESHOLD
0x00
–0.050 V
0x04
–0.150 V
0x01
–0.075 V
0x05
–0.175 V
0x02
–0.100 V
0x06
–0.200 V
0x03
–0.125 V
0x07
–0.225 V
Table 75. SCCD (b7-b4) Configuration Bits with Corresponding Delay Time
SETTING
DELAY
SETTING
DELAY
SETTING
DELAY
SETTING
DELAY
0x00
0 µs
0x04
244 µs
0x08
488 µs
0x0C
732 µs
0x01
61 µs
0x05
305 µs
0x09
549 µs
0x0D
793 µs
0x02
112 µs
0x06
366 µs
0x0A
610 µs
0x0E
854 µs
0x03
183 µs
0x07
427 µs
0x0B
671 µs
0x0F
915 µs
8.5.3.4.5 Initial 1st Capacitance
The value of Initial 1st Capacitance is used in the health and other calculations.
Table 76. Initial 1st Capacitance
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
NAME
FORMAT
SIZE IN
BYTES
MIN
VALUE
MAX
VALUE
DEFAULT
VALUE
UNIT
48
Data
8
Initial 1st
Capacitance
Integer
2
0
65535
250
F
8.5.3.4.6 Capacitance
This value is used as the Capacitance at device reset. This value is updated by the gauging algorithm when a
qualified learning cycle has completed.
Table 77. Capacitance
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
NAME
FORMAT
SIZE IN
BYTES
MIN
VALUE
MAX
VALUE
DEFAULT
VALUE
UNIT
48
Data
10
Capacitance
Integer
2
0
65535
250
F
8.5.3.4.7
Firmware Version
The ManufacturerAccess function reports Firmware Version as part of its return value.
Table 78. Firmware Version
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
NAME
FORMAT
SIZE IN
BYTES
MIN
VALUE
MAX
VALUE
DEFAULT
VALUE
UNIT
56
Manufacturer
Data
4
Firmware
Version
Hex
2
0x0000
0xffff
0x00000
—
8.5.3.4.8
Hardware Version
The ManufacturerAccess function reports Hardware Version as part of its return value.
Table 79. Hardware Version
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
NAME
FORMAT
SIZE IN
BYTES
MIN
VALUE
MAX
VALUE
DEFAULT
VALUE
UNIT
56
Manufacturer
Data
6
Hardware
Version
Hex
2
0x0000
0xffff
0x0000
—
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Manuf. Info
The ManufacturerInfo function returns the string stored in Manuf. Info. The maximum text length is 31
characters.
Table 80. Manuf. Info
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
NAME
FORMAT
SIZE IN
BYTES
MIN
VALUE
MAX
VALUE
DEFAULT
VALUE
58
Manufacturer
Info
0
Manuf. Info
String
32
—
—
012345678
9ABCDEF0
123456789
ABCDE
UNIT
8.5.3.4.10 Operation Cfg
This register enables, disables, or configures various features of the BQ33100.
Table 81. Operation Cfg
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
NAME
FORMAT
SIZE IN
BYTES
MIN
VALUE
MAX
VALUE
DEFAULT
VALUE
64
Registers
0
Operation
Cfg
Hex
2
0x0000
0xffff
0x04a8
UNIT
Figure 14. Operation Cfg Register
15
RSVD
7
RSVD
14
RSVD
6
LT_EN
13
RSVD
5
RSVD
12
RSVD
4
TEMP1
11
RSVD
3
TEMP0
10
CC2
2
RSVD
9
CC1
1
RSVD
8
CC0
0
STACK
LEGEND: RSVD = Reserved and must be programmed to 0 unless otherwise specified.
CC2, CC1, CC0—These bits configure the BQ33100 for the number of series capacitors in the super
capacitor stack.
0,0,0 = Reserved
0,0,1 = 2 capacitors
0,1,0 = 3 capacitors (default)
0,1,1 = 4 capacitors
1,0,0 = 5 capacitors
LT_EN—Lifetime Data logging bit; this bit enables or disables Lifetime Data logging from occurring. This bit
can be directly set by the Lifetime Enable command.
0 = All Lifetime Data logging is prevented from occurring.
1 = All Lifetime Data logging is allowed.
TEMP1, TEMP0—These bits configure the source of the Temperature function.
0,0 = Internal Temperature Sensor
0,1 = TS Input (default)
STACK—This bit configure the BQ33100 to measure all series voltages up to 5-series cells or just the stack
voltage.
0 = Each series cell is measured and can be balanced up to 5-series capacitors.
1 = The capacitor stack is measured and Capacitor Balancing and Cell Imbalance Detection are disabled.
8.5.3.4.11 FET ACTION
The FET Action register enables the charge FET to turn off when a safety condition occurs. The charge FET
turns off when the a bit in the SafetyStatus register is set that corresponds to a set bit in the FET Action register.
48
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Table 82. FET Action
SUBCLASS SUBCLASS
ID
NAME
64
Registers
OFFSET
NAME
FORMAT
SIZE IN
BYTES
MIN VALUE
MAX
VALUE
DEFAULT
VALUE
4
FET Action
Hex
2
0x0000
0xffff
0x0000
UNIT
Figure 15. FET Action Register
15
CLBAD
77
DFF
14
HFAIL
6
RSVD
13
HWARN
5
AFE_C
12
HLOW
4
WDF
11
RSVD
3
OCC
10
OTC
2
OCD
9
CIM
1
SCC
8
OV
0
SCD
CLBAD: Weak capacitor condition
HFAIL: Health fault condition
HWARN: Health warning condition
HLOW: Health low condition
AFE_C: AFE Communications failure condition
CIM: Capacitor voltage imbalance condition
DFF: Data Flash Fault failure condition
OTC: Charge overtemperature condition
OV: Capacitor overvoltage condition
WDF: AFE Watchdog fault condition
OCC: Charge overcurrent condition
OCD: AFE overcurrent on discharge condition
SCC: AFE short circuit on charge condition
SCD: AFE short circuit on discharge condition
OV: Capacitor overvoltage condition
8.5.3.4.12 FAULT
The FAULT register enables or disables the use of the FAULT pin when the corresponding bit in SafetyStatus is
set.
Table 83. FAULT
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
NAME
FORMAT
SIZE IN
BYTES
MIN
VALUE
MAX
VALUE
DEFAULT
VALUE
64
Registers
8
FAULT
Hex
2
0x0000
0xffff
0x0000
UNIT
Figure 16. FAULT Register
15
CLBAD
7
DFF
14
HFAIL
6
RSVD
13
HWARN
5
AFE_C
12
HLOW
4
WDF
11
RSVD
3
OCC
10
OTC
2
OCD
9
CIM
1
SCC
8
OV
0
SCD
CLBAD: Weak capacitor condition
HFAIL: Health fault condition
HWARN: Health warning condition
HLOW: Health low condition
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AFE_C: AFE Communications failure condition
CIM: Capacitor voltage imbalance condition
DFF: Data Flash Fault failure condition
OTC: Charge overtemperature condition
OV: Capacitor overvoltage condition
WDF: AFE Watchdog fault condition
OCC: Charge overcurrent condition
OCD: AFE overcurrent on discharge condition
SCC: AFE short circuit on charge condition
SCD: AFE short circuit on discharge condition
8.5.3.4.13 AFE State_CTL
This register adjusts the AFE hardware overcurrent and short circuit detection thresholds and delay.
Table 84. AFE State_CTL
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
NAME
FORMAT
SIZE IN
BYTES
MIN
VALUE
MAX
VALUE
DEFAULT
VALUE
65
AFE
1
AFE
State_CTL
Hex
1
0x00
0xff
0x00
UNIT
Figure 17. AFE State_CTL Register
7
RSVD
6
RSVD
5
SCDDX2
4
RSNS
3
RSVD
2
RSVD
1
RSVD
0
RSVD
LEGEND: RSVD = Reserved and must be programmed to 0
SCDDX2—Set this bit to double the SCD delay periods 0 (default) = Short Circuit current protection delay is as
programmed.
1 = Short Circuit current protection delay is twice that programmed.
RSNS—This bit, if set, configures the SCD threshold into a range suitable for a low sense resistor value by
dividing the SCDV selected voltage threshold by 2 0 (default) = Current protection voltage thresholds as
programmed.
1 = Current protection voltage threshold divided by 2 as programmed
8.5.3.4.14 Measurement Margin %
Measurement Margin % provides any needed addition margin for measurement error or other error sources.
Table 85. Measurement Margin %
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
NAME
FORMAT
SIZE IN
BYTES
MIN
VALUE
MAX
VALUE
DEFAULT
VALUE
UNIT
88
Learning
Configuration
1
Measurement
Margin %
Unsigned
Integer
1
0
100
10
%
50
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8.5.3.4.15 Max Dsg Time
Max Dsg Time provides the maximum amount of time for a learning cycle to complete.
Table 86. Max Dsg Time
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
NAME
FORMAT
SIZE IN
BYTES
MIN
VALUE
MAX
VALUE
DEFAULT
VALUE
UNIT
88
Learning
Configuration
4
Max Dsg
Time
Integer
2
0
32767
10
s
8.5.3.4.16 V Chg Nominal
Nominal charging voltage(min) representing CHGLVL1 = Low (0) and CHGLVL0 = Low (0)
Table 87. V Chg Nominal
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
NAME
FORMAT
SIZE IN
BYTES
MIN
VALUE
MAX
VALUE
DEFAULT
VALUE
UNIT
88
Charging
Voltage
0
V Chg
Nominal
Integer
2
0
25000
10400
mV
8.5.3.4.17 V Chg A
Charging voltage representing CHGLVL1 = Low (0) and CHGLVL0 = High (1)
Table 88. V Chg A
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
NAME
FORMAT
SIZE IN
BYTES
MIN
VALUE
MAX
VALUE
DEFAULT
VALUE
UNIT
88
Charging
Voltage
2
V Chg A
Integer
2
0
25000
11125
mV
8.5.3.4.18
V Chg B
Charging voltage representing CHGLVL1 = High (1) and CHGLVL0 = Low (0)
Table 89. V Chg B
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
NAME
FORMAT
SIZE IN
BYTES
MIN
VALUE
MAX
VALUE
DEFAULT
VALUE
UNIT
88
Charging
Voltage
4
V Chg B
Integer
2
0
25000
11875
mV
8.5.3.4.19 V Chg Max
Charging voltage(max) representing CHGLVL1 = High (1) and CHGLVL0 = High (1)
Table 90. V Chg Max
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
NAME
FORMAT
SIZE IN
BYTES
MIN
VALUE
MAX
VALUE
DEFAULT
VALUE
UNIT
88
Charging
Voltage
6
V Chg Max
Integer
2
0
25000
125000
mV
8.5.3.4.20 Min Voltage
Min Voltage is the minimum voltage that the super capacitor must discharge. Min Voltage is used in
capacitance estimation, which defines the super capacitor usage range.
Table 91. Min Voltage
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
NAME
FORMAT
SIZE IN
BYTES
MIN
VALUE
MAX
VALUE
DEFAULT
VALUE
UNIT
88
System
Requirement
4
Min Voltage
Integer
2
0
10000
4000
mV
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8.5.3.4.21 Learning Frequency
Learning Frequency is the amount of time elapsed between automatic learning cycles.
NOTE
A value of 250 is used to set the Learning Frequency to 10 minutes for test purposes.
Table 92. Learning Frequency
Subclass
ID
Subclass
Name
Offset
Name
Format
Size in
Bytes
Min Value
Max Value
Default
Value
Unit
88
Learning
Configuration
0
Learning
Frequency
Unsigned
Integer
1
0
255
2
week
8.5.3.4.22 Dsg Current Threshold
The BQ33100 enters DISCHARGE mode from CHARGE mode if Current < (–)Dsg Current Threshold.
Table 93. Dsg Current Threshold
Subclass
ID
Subclass
Name
Offset
Name
Format
Size in
Bytes
Min Value
Max Value
Default
Value
Unit
81
Current
Thresholds
0
Dsg Current
Threshold
Integer
2
0
2000
10
mA
8.5.3.4.23 Chg Current Threshold
The BQ33100 enters CHARGE mode from DISCHARGE mode if Current > Chg Current Threshold.
Table 94. Chg Current Threshold
SUBCLASS
ID
SUBCLASS
NAME
OFFSET
NAME
FORMAT
SIZE IN
BYTES
MIN
VALUE
MAX
VALUE
DEFAULT
VALUE
UNIT
81
Current
Thresholds
2
Chg Current
Threshold
Integer
2
0
2000
0
mA
9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The BQ33100 is a super capacitor manager that can provide capacitance and ESR measurements for up to 9series capacitors and balancing for systems with up to 5-series capacitors. This section of the data sheet
provides practical applications information for hardware and systems engineers designing the BQ33100 into their
end equipment.
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9.2 Typical Application
Figure 18. Application Reference Schematic
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9.2.1 Design Requirements
The BQ33100 comes programmed to support 4-series capacitor systems with cell balancing enabled. Table 95
shows other key configuration defaults.
Table 95. Design Parameters
DESIGN PARAMETER
EXAMPLE VALUE
Number of Series Cells
4
Design Capacitance
250 F
Design ESR
320 mΩ
Cell Balancing
Enabled
V Chg Nominal
8400 mV
V CHG A
8900 mV
V CHG
9500 mV
V CHG MAX
10000 mV
Learn Frequency
2 weeks
Learn Delta Voltage
500 mV
Use the BQEVSW tool to update the settings to meet the specific application or pack configuration requirements.
9.2.2 Detailed Design Procedure
This section provides information on selecting key device configuration options. More information on these and
other configuration options is available in BQ33100 Super Capacitor Manager - Top 13 Design Considerations
(SLUA751).
9.2.2.1 Selecting Number of Series Capacitor Support
The BQ33100 can support 2- to 5-series capacitors when Operation Cfg [STACK] = 0 or 2 to 9 series
capacitors when [STACK] = 1. The main difference is that when [STACK] = 1, the BQ33100 will not perform cell
balancing.
9.2.2.2 Selecting Charging Voltage Values
The BQ33100 learning algorithm requires that the capacitors not be charged to their maximum charging value:
for example, 2.5 V, under normal conditions. This enables the BQ33100 to charge the capacitors a small amount
and then enable a discharge as part of the learning process. The value to which the capacitors must charge to is
configured in V Learn Max and is expected to be the maximum charging voltage as specified by the capacitor
manufacturer: for example, 2.5 V. This is typically also the V Chg MAX value, although some capacitor
manufacturers will allow a higher voltage for the short learning period compared to the DC value it is held at
during normal charging.
The nominal charging voltage must be selected to enable the capacitor array to provide the required amount of
energy from the capacitance at that voltage. This data is available from the capacitor manufacturer's data sheet.
The default value is 2.1 V per capacitor and as the device is configured as a 4-series system, then the
programmed value in V Chg Nominal is 8400 mV.
V Chg A and V Chg B must be selected to be evenly spread between V Chg Nominal and V Chg Max: for
example, V Chg A = 8900 mV (2.225 V per cap) and V Chg B = 9500 (2.375 V per cap).
9.2.2.3 Learning Frequency Selection
The default learning frequency of the BQ33100 is set to two weeks. The capacitance and ESR changes relatively
slowly over time so selecting a period such as two weeks or longer allows for a change to be detected.
Setting an automatic update to occur on a very slow rate, for two weeks, and then enabling the host system to
update at a faster rate—for example, each day, or synchronized to a host system event, and after a host system
reboot, is common.
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9.2.3 Application Curve
2700
Capacitor Voltage (mV)
2400
2100
1800
1500
Cap 1 Voltage
1200
Cap 2 Voltage
900
Cap 3 Voltage
600
Cap 4 Voltage
300
Cap 5 Voltage
0
1
28
55
82 109 136 163 190 217 244 271 298 325
Time (s)
C003
Figure 19. Voltage Convergence During Capacitor Balancing
10 Power Supply Recommendations
The device manages its supply voltage dynamically according to the operation conditions. Normally, the VCC
and PACK input is the primary power source to the device. The VCC and PACK pin must be connected to the
positive termination of the capacitor array. The input voltage for the VCC and PACK pin ranges from 3.8 V to 25
V. A 1-µF capacitor must be connected to the VCC and PACK as close to the device as possible for supply
decoupling.
11 Layout
11.1 Layout Guidelines
A capacitance monitor circuit board is a challenging environment due to the fundamental incompatibility of high
current traces and ultra-low current semiconductor devices. The best way to protect against unwanted trace-totrace coupling is with a component placement where the high-current section is on the opposite side of the board
from the electronic devices. Ensure to route high-current traces away from signal traces, which enter the
BQ33100 directly. IC references and registers can be disturbed and in rare cases damaged due to magnetic and
capacitive coupling from the high-current path.
NOTE
During surge current and ESD events, the high-current traces appear inductive and can
couple unwanted noise into sensitive nodes of the gas gauge electronics.
The learning load components can become heated depending on the component values selected. TI
recommends that any heat is dissipated away from the BQ33100 to ensure its maximum operating temperature
is not exceeded.
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11.2 Layout Example
bq33100
Learning load circuit
with extra copper for
heat dissipation
Figure 20. BQ33100 Board Layout
Charge Control
Monitoring
Learning Load
Figure 21. Top Layer
56
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Layout Example (continued)
Figure 22. Internal Layer 1
Figure 23. Internal Layer 2
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Layout Example (continued)
Figure 24. Bottom Layer
58
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12 Device and Documentation Support
12.1 Documentation Support
12.1.1 Related Documentation
For related documentation, see the following:
BQ33100 Super Capacitor Manager - Top 13 Design Considerations, SLUA751
12.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
12.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
www.ti.com
20-Nov-2019
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
BQ33100PW
ACTIVE
TSSOP
PW
24
60
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
33100
BQ33100PWR
ACTIVE
TSSOP
PW
24
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
33100
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
20-Nov-2019
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Nov-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
BQ33100PWR
Package Package Pins
Type Drawing
TSSOP
PW
24
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2000
330.0
16.4
Pack Materials-Page 1
6.95
B0
(mm)
K0
(mm)
P1
(mm)
8.3
1.6
8.0
W
Pin1
(mm) Quadrant
16.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Nov-2019
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
BQ33100PWR
TSSOP
PW
24
2000
367.0
367.0
38.0
Pack Materials-Page 2
PACKAGE OUTLINE
PW0024A
TSSOP - 1.2 mm max height
SCALE 2.000
SMALL OUTLINE PACKAGE
SEATING
PLANE
C
6.6
TYP
6.2
A
0.1 C
PIN 1 INDEX AREA
22X 0.65
24
1
2X
7.15
7.9
7.7
NOTE 3
12
13
B
0.30
0.19
0.1
C A B
24X
4.5
4.3
NOTE 4
1.2 MAX
0.25
GAGE PLANE
0.15
0.05
(0.15) TYP
SEE DETAIL A
0 -8
0.75
0.50
DETAIL A
A 20
TYPICAL
4220208/A 02/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153.
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EXAMPLE BOARD LAYOUT
PW0024A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
SYMM
24X (1.5)
(R0.05) TYP
1
24
24X (0.45)
22X (0.65)
SYMM
13
12
(5.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 10X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
EXPOSED METAL
EXPOSED METAL
0.05 MAX
ALL AROUND
NON-SOLDER MASK
DEFINED
(PREFERRED)
0.05 MIN
ALL AROUND
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
15.000
4220208/A 02/2017
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
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EXAMPLE STENCIL DESIGN
PW0024A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
24X (1.5)
SYMM
(R0.05) TYP
1
24
24X (0.45)
22X (0.65)
SYMM
12
13
(5.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 10X
4220208/A 02/2017
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
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