Texas Instruments | TPS63036 High-Efficiency Buck-Boost Converter in Tiny Wafer Chip Scale Package (Rev. B) | Datasheet | Texas Instruments TPS63036 High-Efficiency Buck-Boost Converter in Tiny Wafer Chip Scale Package (Rev. B) Datasheet

Texas Instruments TPS63036 High-Efficiency Buck-Boost Converter in Tiny Wafer Chip Scale Package (Rev. B) Datasheet
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TPS63036
SLVSB76B – AUGUST 2012 – REVISED AUGUST 2019
TPS63036 High-Efficiency Buck-Boost Converter in Tiny Wafer Chip Scale Package
1 Features
3 Description
•
The TPS63036 is a non-inverting buck-boost
converter able to provide a regulated output voltage
from an input supply that can be higher or lower than
the output voltage. The buck-boost converter is based
on a fixed frequency, pulse width modulation (PWM)
controller using synchronous rectification to obtain
maximum efficiency. At low load currents, the
converter enters power save mode to maintain high
efficiency over a wide load current range. The power
save mode can be disabled, forcing the converter to
operate at a fixed switching frequency.
1
•
•
•
•
•
Input voltage range: 1.8 V to 5.5 V
(>2 V for device start-up)
Adjustable output voltage range: 1.2 V to 5.5 V
High efficiency over the entire load range
– Operating quiescent current: 25 µA
– Power save mode with seamless transition
Average current mode buck-boost architecture
– Automatic transition between modes
– Fixed frequency operation at 2.4 MHz
– Synchronization to external clock possible
Safety and robust operation features
– Overtemperature, overvoltage protection
– Load disconnect during shutdown
Tiny 8-pin wafer chip scale package (WCSP):
1.814 mm × 1.076 mm
The maximum average current in the switches is
limited to a typical value of 1000 mA. The output
voltage is programmable using an external resistor
divider.
The converter can be disabled to minimize battery
drain. During shutdown, the load is disconnected from
the supply.
Device Information(1)
2 Applications
•
•
•
Battery voltage regulation (headsets and earbuds,
cameras, augmented reality glasses, electronic
and robotic toys, personal medical products)
Wi-Fi® or Bluetooth® module supply (IP network
camera, wireless access point, single board
computer, portable POS, wireless sensors)
LED/Laser supply (barcode scanner, laser
distance meter)
PART NUMBER
PACKAGE
TPS63036
WCSP (8)
BODY SIZE (NOM)
1.814 mm × 1.076 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Typical Application Schematic
Efficiency vs Output Current
L1
1.5 µH
100
VIN =3.6V VOUT=3.3V
90
L2
VIN
C1
10 µF
TPS63036
R1
287 NŸ
EN
FB
PS/SYNC
GND
80
VOUT
3.3 V
VOUT
R2
51.1 NŸ
C2
3×10 µF
Efficiency- %
L1
VIN
1.8 V to 5.5 V
70
VIN =2.4V VOUT=3.3V
60
50
40
30
20
10
0
0.1
1
10
100
1000
Output Current - mA
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS63036
SLVSB76B – AUGUST 2012 – REVISED AUGUST 2019
www.ti.com
Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
3
6.1
6.2
6.3
6.4
6.5
6.6
3
3
3
4
4
5
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Typical Characteristics ..............................................
Detailed Description .............................................. 6
7.1 Overview ................................................................... 6
7.2 Functional Block Diagram ......................................... 6
7.3 Feature Description................................................... 6
7.4 Device Functional Modes.......................................... 7
8
Application and Implementation ........................ 10
8.1 Application Information............................................ 10
8.2 Typical Application ................................................. 10
9 Power Supply Recommendations...................... 17
10 Layout................................................................... 17
10.1 Layout Guidelines ................................................. 17
10.2 Layout Example .................................................... 17
10.3 Thermal Considerations ........................................ 17
11 Device and Documentation Support ................. 18
11.1
11.2
11.3
11.4
11.5
Device Support......................................................
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
18
18
18
18
18
12 Mechanical, Packaging, and Orderable
Information ........................................................... 18
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (August 2015) to Revision B
Page
•
Updated Features and Applications ....................................................................................................................................... 1
•
Corrected the body size in Features and the Device Information table ................................................................................. 1
•
Corrected efficiency graph ..................................................................................................................................................... 1
•
Removed hints to fixed output voltage versions (for example, in the Pin Functions table).................................................... 3
Changes from Original (August 2012) to Revision A
Page
•
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section ................................................................................................. 1
•
Removed Available Output Voltage Options table ................................................................................................................. 3
•
Removed Packaging Information section ............................................................................................................................ 17
2
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5 Pin Configuration and Functions
YFG Package
8-Pin WCSP
Top View
A2
B2
C2
D2
A1
B1
C1
D1
Pin Functions
PIN
NAME
TYPE
NO.
DESCRIPTION
EN
A2
Input
Enable input (1 enabled, 0 disabled)
FB
D2
Input
Voltage feedback pin
GND
C2
—
Control/logic ground
PS/SYNC
B2
Input
Enable/disable power-save mode (1 disabled, 0 enabled, clock signal for synchronization)
L1
B1
Input
Connection for inductor
L2
C1
Input
Connection for inductor
VIN
A1
Input
Supply voltage for power stage
VOUT
D1
Output
Buck-boost converter output
6 Specifications
6.1 Absolute Maximum Ratings
Over operating free-air temperature range (unless otherwise noted) (1)
MIN
MAX
UNIT
Input voltage on VIN, L1, L2, VOUT, PS/SYNC, EN, FB
–0.3
7
V
Operating virtual junction temperature, TJ
–40
150
°C
Storage temperature, Tstg
–65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability.
6.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±2000
Charged-device model (CDM), per JEDEC specification JESD22C101 (2)
±1000
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
MIN
MAX
Supply voltage at VIN
1.8
5.5
UNIT
V
Operating free air temperature, TA
–40
85
°C
Operating virtual junction temperature, TJ
–40
125
°C
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6.4 Thermal Information
TPS63036
THERMAL METRIC (1)
YFG (WCSP)
UNIT
8 PINS
RθJA
Junction-to-ambient thermal resistance
84
°C/W
RθJC(top)
RθJB
Junction-to-case (top) thermal resistance
0.7
°C/W
Junction-to-board thermal resistance
43.9
°C/W
ψJT
Junction-to-top characterization parameter
2.9
°C/W
ψJB
Junction-to-board characterization parameter
43.7
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
—
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.5 Electrical Characteristics
Over recommended free-air temperature range and over recommended input voltage range (typical at an ambient
temperature range of 25°C) unless otherwise noted.
PARAMETER
VIN
Input voltage range
VOUT
Output voltage range
TEST CONDITIONS
MIN
Duty cycle in step-down conversion
VFB
VFB
f
ISW
TYP
MAX
UNIT
1.8 (1)
5.5
V
1.2
5.5
V
505
mV
20%
Feedback voltage
PS/SYNC = VIN IOUT < 5 mA
495
Feedback voltage
PS/SYNC = GND referenced to 500 mV
IOUT < 5 mA
-3%
Load regulation
PS/SYNC = GND
500
+6%
0.008
%/mA
Oscillator frequency
1800
2000
2200
kHz
Frequency range for synchronization
2200
2400
2600
kHz
(2)
Average input current limit
VIN = 3.6 V, TA = 25°C
1000
mA
High-side switch ON-resistance
VIN = 3.6 V
200
mΩ
Low-side switch ON-resistance
VIN = 3.6 V
200
mΩ
Line regulation
0.5%
VIN
Iq
Quiescent
current
IS
Shutdown current
VOUT
IOUT= 0 mA, VEN = VIN = 3.6 V,
VOUT = 3.3 V
25
35
μA
4
6
μA
VEN = 0 V, VIN = 3.6 V
0.1
0.9
μA
CONTROL STAGE
VUVLO
Undervoltage lockout threshold falling
1.4
1.5
1.6
V
Undervoltage lockout threshold raising
1.6
1.8
2.0
V
0.4
V
0.1
μA
VIL
EN, PS/SYNC input low voltage
VIH
EN, PS/SYNC input high voltage
EN, PS/SYNC input current
(1)
(2)
4
1.2
Clamped on GND or VIN
V
0.01
Overtemperature protection
140
°C
Overtemperature hysteresis
20
°C
The typical required supply voltage for start-up is 2 V. The part is functional down to 1.8 V.
For the minimum specified average input current limit at VOUT = 2.5 V, 3.3 V and 4.5 V refer to curve in Figure 1. For the maximum
specified average input current limit at VOUT = 2.5 V, 3.3 V and 4.5 V refer to curve in Figure 2.
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6.6 Typical Characteristics
1.4
1.4
VOUT= 4.5V
1.2
1.2
1
1
Input Current - A
Input Current - A
VOUT= 4.5V
0.8
VOUT= 3.3V
0.6
VOUT= 2.5V
0.4
VOUT= 3.3V
0.6
VOUT= 2.5V
0.4
0.2
0.2
0
1.8
0.8
2.2
2.6
3
3.4
3.8
4.2
4.6
5
5.4
5.8
0
1.8
2.2
2.6
3
3.4
3.8
4.2
4.6
5
5.4
5.8
Input Voltage - V
Input Voltage - V
Figure 1. Minimum Input Current vs Input Voltage
Figure 2. Maximum Input Current vs Input Voltage
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7 Detailed Description
7.1 Overview
The controller circuit of the device is based on an average current mode topology. The controller also uses input
and output voltage feedforward. Changes of input and output voltage are monitored and immediately can change
the duty cycle in the modulator to achieve a fast response to those errors. The voltage error amplifier gets its
feedback input from the FB pin. A resistive voltage divider must be connected to that pin. The feedback voltage
will be compared with the internal reference voltage to generate a stable and accurate output voltage.
The device uses 4 internal N-channel MOSFETs to maintain synchronous power conversion at all possible
operating conditions. This enables the device to keep high efficiency over a wide input voltage and output power
range. Due to the 4-switch topology, the load is always disconnected from the input during shutdown of the
converter. To protect the device from overheating an internal temperature sensor is implemented.
7.2 Functional Block Diagram
L1
L2
VIN
VOUT
PWM
PWM
+
±
+
±
±
FB
A1
+
+
Boost
Ramp
±
A2
Buck
Ramp
Vref
Buck-Boost Overlap Control
GND
7.3 Feature Description
7.3.1 Device Enable
The device is put into operation when EN is set high. It is put into a shutdown mode when EN is set to GND. In
shutdown mode, the regulator stops switching, all internal control circuitry is switched off, and the load is
disconnected from the input. This means that the output voltage can drop below the input voltage during
shutdown. During start-up of the converter, the duty cycle and the peak current are limited in order to avoid high
peak currents flowing from the input.
6
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Feature Description (continued)
7.3.2 Overvoltage Protection
If, for any reason, the output voltage is not fed back properly to the input of the voltage amplifier, control of the
output voltage will not work anymore. Therefore overvoltage protection is implemented to avoid the output
voltage exceeding critical values for the device and possibly for the system it is supplying. The implemented
overvoltage protection circuit monitors the output voltage internally as well. In case it reaches the overvoltage
threshold the voltage amplifier regulates the output voltage to this value.
7.3.3 Undervoltage Lockout
An undervoltage lockout function prevents device start-up if the supply voltage at VIN is lower than approximately
its threshold (see Electrical Characteristics table). When in operation, the device automatically enters the
shutdown mode if the voltage at VIN drops below the undervoltage lockout threshold. The device automatically
restarts if the input voltage recovers to the minimum operating input voltage.
7.3.4 Overtemperature Protection
The device has a built-in temperature sensor which monitors the internal IC temperature. If the temperature
exceeds the programmed threshold (see Electrical Characteristics table) the device stops operating. As soon as
the IC temperature has decreased below the programmed threshold, it starts operating again. There is a built-in
hysteresis to avoid unstable operation at IC temperatures at the overtemperature threshold.
7.4 Device Functional Modes
7.4.1 Soft-Start and Short Circuit Protection
After being enabled, the device starts operating. The average input current limit ramps up from an initial 400 mA
following the output voltage increasing. At an output voltage of about 1.2 V, the current limit is at its nominal
value. If the output voltage does not increase, the current limit will also not increase. The device ramps up the
output voltage in a controlled manner even if a large capacitor is connected at the output. When the output
voltage does not increase above 1.2 V, the device assumes a short circuit at the output, and keeps the current
limit low to protect itself and the application. At a short on the output during operation, the current limit also is
decreased accordingly.
7.4.2 Buck-Boost Operation
To regulate the output voltage at all possible input voltage conditions, the device automatically switches from
step-down operation to boost operation and back as required by the configuration. It always uses one active
switch, one rectifying switch, one switch permanently on, and one switch permanently off. Therefore, it operates
as a step-down converter (buck) when the input voltage is higher than the output voltage, and as a boost
converter when the input voltage is lower than the output voltage. There is no mode of operation in which all 4
switches are permanently switching. Controlling the switches this way allows the converter to maintain high
efficiency at the most important point of operation, when input voltage is close to the output voltage. The RMS
current through the switches and the inductor is kept at a minimum, to minimize switching and conduction losses.
For the remaining 2 switches, one is kept permanently on and the other is kept permanently off, thus causing no
switching losses.
7.4.3
Control Loop
The average inductor current is regulated by a fast current regulator loop which is controlled by a voltage control
loop. Figure 3 shows the control loop.
The noninverting input of the trans-conductance amplifier Gmv can be assumed to be constant. The output of
Gmv defines the average inductor current. The inductor current is reconstructed measuring the current through
the high-side buck MOSFET. This current corresponds exactly to the inductor current in boost mode. In buck
mode the current is measured during the ON-time of the same MOSFET. During the OFF-time the current is
reconstructed internally starting from the peak value reached at the end of the ON-time cycle. The average
current is then compared to the desired value and the difference, or current error, is amplified and compared to
the sawtooth ramp of either the buck or the boost.
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Device Functional Modes (continued)
The Buck-Boost Overlap Control makes sure that the classical buck-boost function, which would cause two
switches to be on every half a cycle, is avoided. Thanks to this block whenever all switches becomes active
during one clock cycle, the two ramps are shifted away from each other, on the other hand when there is no
switching activities because there is a gap between the ramps, the ramps are moved closer together. As a result
the number of classical buck-boost cycles or no switching is reduced to a minimum and high-efficiency values
have been achieved.
Slope compensation is not required to avoid subharmonic oscillation which are otherwise observed when working
with peak current mode control with D > 0.5.
Nevertheless the amplified inductor current downslope at one input of the PWM comparator must not exceed the
oscillator ramp slope at the other comparator input. This purpose is reached limiting the gain of the current
amplifier.
L1
L2
VIN
VOUT
PWM
PWM
+
±
+
±
±
+
Boost
Ramp
±
A2
Buck
Ramp
FB
A1
Vref
+
Buck-Boost Overlap Control
GND
Figure 3. Average Current Mode Control
7.4.4 Power-Save Mode and Synchronization
The PS/SYNC pin can be used to select different operation modes. Power-save mode is used to improve
efficiency at light load. To enable power-save mode, PS/SYNC must be set low. If PS/SYNC is set low then
power-save mode is entered when the average inductor current gets lower than about 100 mA. At this point the
converter operates with reduced switching frequency and with a minimum quiescent current to maintain high
efficiency.
8
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Device Functional Modes (continued)
During the power-save mode, the output voltage is monitored with a comparator by the threshold comp low and
comp high. When the device enters power-save mode, the converter stops operating and the output voltage
drops. The slope of the output voltage depends on the load and the value of output capacitance. As the output
voltage falls below the comp low threshold, the device ramps up the output voltage again, by starting operation
using a programmed average inductor current higher than required by the current load condition. Operation can
last one or several pulses. The converter continues these pulses until the comp high threshold is reached and
the average inductance current gets lower than about 100 mA. When the load increases above the minimum
forced inductor current of about 100 mA, the device will automatically switch to PWM mode.
The power-save mode can be disabled by programming high at the PS/SYNC. Connecting a clock signal at
PS/SYNC forces the device to synchronize to the connected clock frequency.
Synchronization is done by a phase-locked loop (PLL), so synchronizing to lower and higher frequencies
compared to the internal clock works without any issues. The PLL can also tolerate missing clock pulses without
the converter malfunctioning. The PS/SYNC input supports standard logic thresholds.
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The TPS63036 device is a noninverting buck-boost converter that is suitable for applications that need a
regulated output voltage from an input supply that can be higher or lower than the output voltage. The device
supports regulated output voltages from 1.2 V to 5.5 V.
8.2 Typical Application
L1
1.5µH
VIN
2.3 V to 5V
L1
VOUT
3.3V/100mA
L2
VIN
VOUT
EN
C1
10µF
R1
C3
10pF
287kΩ
PS/SYNC
C2
3X10µF
FB
R2
GND
51.1kΩ
TPS63036
Figure 4. Typical Operating Circuit
8.2.1 Design Requirements
The design guidelines provide a component selection to operate the adjustable device within the Recommended
Operating Conditions.
8.2.2 Detailed Design Procedure
The design guideline provides a component selection to operate the device within the recommended operating
conditions.
Table 1 shows the list of components for the Application Curves.
Table 1. List of Components
REFERENCE
10
DESCRIPTION
MANUFACTURER
TPS63036
Texas Instruments
L1
1.5 μH, 3 mm x 3 mm x
1.5 mm
Coilcraft, LPS3015152MLC
C1
10 μF 6.3V, 0603, X7R
ceramic
GRM188R60J106KME8
4D, Murata
C2
3 × 10 μF 6.3V, 0603,
X7R ceramic
GRM188R60J106KME8
4D, Murata
R1, R2
Depending on the
output voltage at
TPS63036
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The TPS63036 buck-boost converter has internal loop compensation. Therefore, the external L-C filter has to be
selected to work with the internal compensation. As a general rule of thumb, the product L × C should not move
over a wide range when selecting a different output filter. However, when selecting the output filter a low limit for
the inductor value exists to avoid sub-harmonic oscillation which could be caused by a far too fast ramp up of the
amplified inductor current. For the TPS63036 the minimum inductor value should be kept at 1 uH. To simplify this
process Table 1 outlines possible inductor and capacitor value combinations.
Table 2. Output Filter Selection (Average Inductance
Current up to 1 A)
OUTPUT CAPACITOR VALUE [µF] (2)
INDUCTOR
VALUE [µH] (1)
30
44
66
1.0
√
√
√
1.5
(3)
√
√
√
√
2.2
(1)
(2)
(3)
Inductor tolerance and current de-rating is anticipated. The effective
inductance can vary by 20% and –30%.
Capacitance tolerance and bias voltage de-rating is anticipated. The
effective capacitance can vary by 20% and –50%.
Typical application. Other check mark indicates recommended filter
combinations
8.2.2.1 Inductor Selection
For high efficiencies, the inductor should have a low DC resistance to minimize conduction losses. Especially at
high-switching frequencies the core material has a higher impact on efficiency. When using small chip inductors,
the efficiency is reduced mainly due to higher inductor core losses. This needs to be considered when selecting
the appropriate inductor. The inductor value determines the inductor ripple current. The larger the inductor value,
the smaller the inductor ripple current and the lower the conduction losses of the converter. Conversely, larger
inductor values cause a slower load transient response. To avoid saturation of the inductor, with the chosen
inductance value, the peak current for the inductor in steady-state operation can be calculated. Only the equation
which defines the switch current in boost mode is reported because this is providing the highest value of current
and represents the critical current value for selecting the right inductor.
Vout - Vin
Duty Cycle Boost
D=
Vout
(1)
I
= I
PEAK
SW_MAX +
Vin x D
2xfxL
where
•
•
•
•
•
D = Duty cycle in boost mode
f = Converter switching frequency (typical 2 MHz)
L = Selected inductor value
η = Estimated converter efficiency (use the number from the efficiency curves or 0.80 as an assumption)
ISW_MAX = Maximum average input current (Figure 6)
(2)
NOTE
The calculation must be done for the minimum input voltage which is possible to have in
boost mode.
Consider the load transients and error conditions that can cause higher inductor currents. Consider when
selecting an appropriate inductor. Please refer to Table 3 for typical inductors.
The size of the inductor can also affect the stability of the feedback loop. In particular the boost transfer function
exhibits a right half-plane zero, whose frequency is inverse proportional to the inductor value and the load
current. This means as higher the value of inductance and load current is the more possibilities has the right
plane zero to be moved at lower frequency. This could degrade the phase margin of the feedback loop. TI
recommends to choose the value of the inductor in order to have the frequency of the right half plane zero >400
kHz. The frequency of the RHPZ can be calculated using equation Equation 2.
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(1 - D)2 ´ Vout
2p ´ Iout ´ L
f RHPZ =
where
•
D =Duty cycle in boost mode
(3)
NOTE
The calculation must be done for the minimum input voltage which is possible to have in
boost mode.
Table 3. Inductor Selection
INDUCTOR VALUE
COMPONENT SUPPLIER
SIZE (LxWxH mm)
Isat/DCR
1 µH
TOKO 1286AS-H-1R0M
2x1.6x1.2
2.3A/78mΩ
1 µH
Coilcraft XFL4020-102
4 x 4 x 2.1
5.1A/10.8 mΩ
1 µH
Coilcraft XFL3012-102
3 x 3 x 1.2
2.2 A/35 mΩ
1.5µH
TOKO, 1286AS-H-1R5M
2 x 1.6 x 1.2
4.4A/ 14.40mΩ
1.5µH
Coilcraft, LPS3015-152MLC
3 x 3 x 1.5
2.1A/100mΩ
1.5µH
TOKO, 1269AS-H-1R5M
2.5 x 2 x 1
2.1A/108mΩ
2.2µH
TOKO D1286AS-H-2R2M
2 x 1.6 x 1.2
1.6A/192mΩ
8.2.2.2 Capacitor Selection
8.2.2.2.1
Input Capacitor
At least a 10-μF input capacitor is recommended to improve transient behavior of the regulator and EMI behavior
of the total power supply circuit. A ceramic capacitor placed as close as possible to the VIN and GND pins of the
IC is recommended.
8.2.2.2.2
Output Capacitor
For the output capacitor, use of a small ceramic capacitors placed as close as possible to the VOUT and GND
pins of the IC is recommended. If, for any reason, the application requires the use of large capacitors which can
not be placed close to the IC, use a smaller ceramic capacitor in parallel to the large capacitor. The small
capacitor should be placed as close as possible to the VOUT and GND pins of the IC. The recommended typical
output capacitor value is 30 µF.
There is also no upper limit for the output capacitance value. Larger capacitors will cause lower output voltage
ripple as well as lower output voltage drop during load transients.
When choosing input and output capacitors, it needs to be kept in mind, that the value of capacitance
experiences significant losses from their rated value depending on the operating temperature and the operating
DC voltage. It is not uncommon for a small surface mount ceramic capacitor to lose 50% and more of its rated
capacitance. For this reason it could be important to use a larger value of capacitance or a capacitor with higher
voltage rating in order to ensure the required capacitance at the full operating voltage.
8.2.2.3 Setting the Output Voltage
The output voltage of the TPS63036 is set by an external resistor divider. The resistor divider must be connected
between VOUT, FB and GND. When the output voltage is regulated, the typical value of the voltage at the FB pin
is 500 mV. The maximum recommended value for the output voltage is 5.5 V. The typical current into the FB pin
is 0.01 μA, and the voltage across the resistor between FB and GND, R2, is typically 500 mV. Based on these
two values, the recommended value for R2 should be lower than 100 kΩ, in order to set the divider current at 5
μA or higher. From that, the value of the resistor connected between VOUT and FB, R1, depending on the
needed output voltage (VOUT), can be calculated using Equation 4:
æV
ö
R1 = R2 × ç OUT - 1÷
V
è FB
ø
12
(4)
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A small capacitor C3 = 10 pF, in parallel with R1 needs to be placed when using the power-save mode, to
improve considerably the output voltage ripple.
8.2.2.4 Current Limit
To protect the device and the application, the average input current is limited internally on the IC. At nominal
operating conditions, this current limit is constant. The current limit value can be found in the Electrical
Characteristics table. The current limit varies depending on the input voltage. A curve of the input current varying
with the input voltage is shown in Figure 5 and Figure 6 respectively showing the minimum and the maximum
current limit expected depending on input and output voltage.
Given the average input current in Figure 5 is then possible to calculate the output current reached in boost
mode using Equation 5 and Equation 6 and in buck mode using Equation 7 and Equation 8.
Duty Cycle Boost
D=
V
-V
IN
OUT
V
OUT
Maximum Output Current Boost
Duty Cycle Buck
(5)
I
=hxI
x (1 - D)
OUT
SW
(6)
V
D = OUT
V
IN
Maximum Output Current Buck
(7)
0 x Isw
Iout=
D
where
•
•
•
•
η = Estimated converter efficiency (use the number from the efficiency curves or 0.80 as an assumption)
f = Converter switching frequency (typical 2 MHz)
L = Selected inductor value
ISW = Minimum average input current (Figure 5)
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8.2.3 Application Curves
100
100
VIN =3.6V VOUT=2.5V
VIN =3.6V VOUT=4.5V
90
80
80
70
70
60
Efficiency- %
Efficiency- %
VIN =2.4V VOUT=2.5V
90
VIN =3.6V VOUT=4.5V
50
VIN =2.4V VOUT=4.5V
40
60
40
30
20
20
10
10
1
10
100
VIN =3.6V VOUT=
=2.5V
50
30
0
0.1
VIN =
=2.4V VOUT=2.5V
VIN =2.
=2.4V VOUT=4.5V
0
0.1
1000
1
Output Current - mA
10
100
1000
Output Current - mA
VOUT = 2.5 V/ 4.5 V
VOUT = 2.5 V/ 4.5 V
Figure 5. Efficiency vs Output Current – Power-Save Mode
Enabled
100
Figure 6. Efficiency vs Output Current – Power-Save Mode
Disabled
100
90
80
80
70
VIN =2.4V VOUT=3.3V
60
50
40
60
VIN =2.4V VOUT=3.3V
50
40
30
30
20
20
10
10
0
0.1
1
10
100
VIN =3.6V VOUT=3.3V
70
Efficiency- %
Efficiency- %
VIN =3.6V VOUT=3.3V
90
0
0.1
1000
1
Output Current - mA
VOUT = 3.3 V
1000
Figure 8. Efficiency vs Output Current – Power-Save Mode
Disabled
100
100
VOUT= 2.5V
VOUT= 2.5V
IOUT= 100mA
80
IOUT= 500mA
90
90
80
IOUT=10mA
IOUT= 100mA
IOUT= 500mA
Efficiency - %
70
60
50
40
70
IOUT=10mA
60
50
40
30
30
20
20
10
10
Power Save Enabled
0
1.8
2.2
2.6
3
3.4
3.8
4.2
4.6
5
5.4
Power Save Disabled
0
1.8
5.8
2.2
2.6
3
3.4
3.8
4.2
4.6
5
5.4
5.8
Input Voltage - V
Input Voltage - V
VOUT = 2.5 V, IOUT = 10 mA/100 mA/500 mA
VOUT = 2.5 V, IOUT = 10 mA/100 mA/500 mA
Figure 9. Efficiency vs Input Voltage – Power-Save Mode
Enabled
14
100
VOUT = 3.3 V
Figure 7. Efficiency vs Output Current – Power-Save Mode
Enabled
Efficiency - %
10
Output Current - mA
Figure 10. Efficiency vs Input Voltage – Power-Save Mode
Disabled
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100
100
VOUT= 3.3V
VOUT= 3.3V
90 I = 100mA
OUT
90
70
IOUT= 100mA
80
IOUT=10mA
IOUT= 500mA
IOUT= 500mA
70
Efficiency - %
Efficiency - %
80
60
50
40
60
50
IOUT=10mA
40
30
30
20
20
10
10
Power Save Enabled
0
1.8
2.2
2.6
3
3.4
3.8
4.2
4.6
5
5.4
Power Save Disabled
0
1.8
5.8
2.2
2.6
Input Voltage - V
3.4
3.8
4.2
4.6
5
5.4
5.8
Input Voltage - V
VOUT = 3.3 V, IOUT = 10 mA/100 mA/500 mA
VOUT = 3.3 V, IOUT = 10 mA/100 mA/500 mA
Figure 11. Efficiency vs Input Voltage – Power-Save Mode
Enabled
Figure 12. Efficiency vs Input Voltage – Power-Save Mode
Disabled
100
100
VOUT= 4.5V
90
VOUT= 4.5V
IOUT= 100mA
90
80
IOUT= 500mA
80
IOUT= 500mA
70
Efficiency - %
Efficiency - %
3
60
IOUT=10mA
50
40
70
60
IOUT=10mA
40
30
30
20
20
10
IOUT= 100mA
50
10
Power Save Disabled
Power Save Enabled
0
1.8
2.2
2.6
3
3.4
3.8
4.2
4.6
5
5.4
0
1.8
5.8
2.2
2.6
Input Voltage - V
3
3.4
3.8
4.2
4.6
5
5.4
5.8
Input Voltage - V
VOUT = 4.5 V, IOUT = 10 mA/100 mA/500 mA
VOUT = 4.5 V, IOUT = 10 mA/100 mA/500 mA
Figure 13. Efficiency vs Input Voltage – Power-Save Mode
Enabled
Figure 14. Efficiency vs Input Voltage – Power-Save Mode
Disabled
3.432
2.575
VOUT= 2.5 V
VOUT= 3.3 V
VIN= 3.6 V
VIN= 3.6 V
2.55
Output Voltage - V
Output Voltage - V
3.399
2.525
2.5
2.475
3.366
3.333
3.3
2.45
Power Save Disabled
Power Save Disabled
3.267
2.425
1
10
100
1
1000
10
100
1000
Output Current - mA
Output Current - mA
VOUT = 3.3 V
VOUT = 2.5 V
Figure 15. Output Voltage vs Output Current
Figure 16. Output Voltage vs Output Current
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4.85
VOUT= 4.5 V
VIN= 3.6 V
VIN= 2.4 V, IOUT= 0A to 150mA
Output Voltage - V
4.76
Output Voltage
50mV/div, AC
4.67
4.58
4.49
Output Current
100mA/div
Power Save Disabled
4.4
1
10
100
1000
VOUT= 3.3 V
Output Current - mA
Time 1ms/Div
VOUT = 4.5 V
VIN < VOUT, Load Change from 0 mA to 150 mA
Figure 17. Output Voltage vs Output Current
Figure 18. Load Transient Response
VIN= 3 V to 3.6 V, IOUT= 150mA
VIN= 4.2 V, IOUT= 0A to 150mA
Input Voltage
500mV/div, AC
Output Voltage
50mV/div, AC
Output Voltage
20mV/div, AC
Output Current
100mA/div
VOUT= 3.3 V
VOUT= 3.3 V
Time 2ms/Div
Time 1ms/Div
VOUT = 3.3 V, IOUT = 150 mA
VIN > VOUT, Load Change from 0 mA to 150 mA
Figure 20. Line Transient Response
Figure 19. Load Transient Response
Enable Voltage
5V/div, DC
Enable Voltage
5V/div, DC
Output Voltage
1V/div, DC
Output Voltage
1V/div, DC
Inductor Current
200mA/div
Inductor Current
200mA/div
Voltage at L1
2V/div, DC
Voltage at L2
2V/div, DC
VOUT= 3.3 V
VIN= 2.4 V, RL= 33S
Time 100:s/Div
VOUT = 3.3 V, VIN = 2.4 V, RL = 33 Ω
VOUT = 3.3 V, VIN = 4.2 V, RL = 33 Ω
Figure 21. Start-Up After Enable
16
VIN= 4.2 V, RL= 33S
VOUT= 3.3 V
Time 100:s/Div
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Figure 22. Start-Up After Enable
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9 Power Supply Recommendations
The TPS63036 device has no special requirements for its input power supply. The output current of the input
power supply needs to be rated according to the supply voltage, output voltage and output current of the
TPS63036.
10 Layout
10.1 Layout Guidelines
For all switching power supplies, the layout is an important step in the design, especially at high peak currents
and high switching frequencies. If the layout is not carefully done, the regulator could show stability problems as
well as EMI problems. Therefore, use wide and short traces for the main current path and for the ground tracks.
The input capacitor, output capacitor, and the inductor should be placed as close as possible to the IC.
The feedback divider should be placed as close as possible to the ground pin of the IC.
10.2 Layout Example
R1x1 R2x2
R1x2 R2x1
GND
R2
R1
VOUT
C3
L1
L1x2
C4
VOUT
C6x1
C2
L1x1
GND
C1x1
C1
C7x1 C7x2
C3x2
VIN
C5
GND
GND
Figure 23. Layout Recommendation
10.3 Thermal Considerations
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added
heat sinks and convection surfaces, and the presence of other heat-generating components affect the powerdissipation limits of a given component.
Three basic approaches for enhancing thermal performance are listed below.
1. Improving the power dissipation capability of the PCB design
2. Improving the thermal coupling of the component to the PCB by soldering all pins to traces as wide as
possible.
3. Introducing airflow in the system
The maximum recommended junction temperature (TJ ) of the TPS63036 device is 125°C. The thermal
resistance of this 8-pin chip-scale package (YFG) is RθJA = 84°C/W, if all pins are soldered. Specified regulator
operation is assured to a maximum ambient temperature TA of 85°C. Therefore, the maximum power dissipation
is about 476 mW, as calculated in Equation 9. More power can be dissipated if the maximum ambient
temperature of the application is lower.
TJ (MAX ) - TA 125 oC - 85 oC
=
= 476 mW
PD(MAX) =
RqJA
84 oC/W
(9)
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11 Device and Documentation Support
11.1 Device Support
11.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
11.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.3 Trademarks
E2E is a trademark of Texas Instruments.
Bluetooth is a registered trademark of Bluetooth SIG.
Wi-Fi is a registered trademark of Wi-Fi Alliance.
11.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
18
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PACKAGE OPTION ADDENDUM
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12-Aug-2019
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TPS63036YFGR
ACTIVE
DSBGA
YFG
8
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
S63036
TPS63036YFGT
ACTIVE
DSBGA
YFG
8
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
S63036
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
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12-Aug-2019
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Aug-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
TPS63036YFGR
DSBGA
YFG
8
3000
180.0
8.4
TPS63036YFGT
DSBGA
YFG
8
250
180.0
8.4
Pack Materials-Page 1
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
1.2
2.0
0.7
4.0
8.0
Q1
1.2
2.0
0.7
4.0
8.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Aug-2019
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPS63036YFGR
DSBGA
YFG
8
3000
182.0
182.0
20.0
TPS63036YFGT
DSBGA
YFG
8
250
182.0
182.0
20.0
Pack Materials-Page 2
D: Max = 1.844 mm, Min =1.784 mm
E: Max = 1.106 mm, Min =1.046 mm
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