Texas Instruments | LMR36503-Q1 3 V–65 V, 0.3-A Buck Converter Optimized for Size and Light Load Efficiency | Datasheet | Texas Instruments LMR36503-Q1 3 V–65 V, 0.3-A Buck Converter Optimized for Size and Light Load Efficiency Datasheet

Texas Instruments LMR36503-Q1 3 V–65 V, 0.3-A Buck Converter Optimized for Size and Light Load Efficiency Datasheet
Order
Now
Product
Folder
Technical
Documents
Support &
Community
Tools &
Software
LMR36503-Q1
SNVSBK0 – SEPTEMBER 2019
1 Features
3 Description
•
The LMR36503-Q1 is the industry's smallest 65 V,
0.3 A synchronous step-down DC/DC converter in 2mm x 2-mm HotRod™ package. This robust and
highly reliable converter can handle input voltage
transients up to 70 V, provide excellent EMI
performance and support fixed 3.3 V, 5 V and other
adjustable output voltages with very few external
components and a simple PCB layout.
1
•
•
•
AEC-Q100-qualified for automotive applications:
– Device temperature grade 1: –40°C to +125°C,
TA
>70% efficiency at 5 mA
– 4 µA Iq (switching) at 24 VIN to 3.3 VOUT (fixed
output option)
Miniature solution size and low component cost:
– Ultra-small, 2-mm × 2-mm HotRod™ package
with wettable flanks
– Highest power density with internal
compensation and reduced external
component count
Designed for automotive applications:
– Junction temperature range –40°C to +150°C
– Optimized for CISPR 25 EMI standard with
spread spectrum frequency modulation
– Wide input voltage range: 3.0 V (falling
threshold) to 65 V
– Adjustable, 3.3-V and 5-V fixed output voltage
option available
– Synchronizable with MODE/SYNC pin variant
– PFM and Forced PWM selection with
MODE/SYNC pin variant
– Adjustable switching frequency: 200 kHz to 2.2
MHz with RT pin variant
– Pin compatible with the LMR36506-Q1 (65 V,
600 mA)
2 Applications
•
•
•
The LMR36503-Q1 uses the peak current mode
control architecture with internal compensation to
maintain stable operation with minimal output
capacitance over the wide switching frequency range
from 200 kHz to 2.2 MHz. The LMR36503-Q1
operates during input voltage dips as low as 3 V,
making it an excellent choice for a wide input
automotive power supply designed to withstand
severe cold crank start impulses. The open drain
PGOOD output in the LMR36503-Q1, with the glitch
filter and delayed release, provides a true indication
of the output voltage status, eliminating the
requirement for an external supervisor. A seamless
transition from FPWM to PFM, with a very low
standby quiescent current, enables high efficiency at
ultra low output loads. The compact solution size and
rich feature set of the LMR36503-Q1 are designed to
simplify implementation for a wide range of
automotive end equipment.
Device Information(1)
PART NUMBER
LMR36503-Q1
PACKAGE
VQFN-HR (9)
BODY SIZE (NOM)
2.00 mm × 2.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Advanced driver assistance systems (ADAS)
Body electronics and lighting
Infotainment and cluster
Simplified Schematic
BOOT
VIN
CIN
100
CBOOT
EN/
UVLO
SW
COUT
MODE/
SYNC
VCC
PGOOD
RFBT
CVCC
80
70
60
50
FB
GND
90
VOUT
LIND
Efficiency (%)
VIN
Efficiency vs Output Current
VOUT = 3.3 V (Fixed), 2.2 MHz
RFBB
40
30
0.001 0.002
VIN = 12V
VIN = 24V
0.005 0.01 0.02
0.05
Load Current (A)
0.1
0.2 0.3 0.5
D005
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. ADVANCE INFORMATION for pre-production products; subject to
change without notice.
ADVANCE INFORMATION
LMR36503-Q1 3 V–65 V, 0.3-A Buck Converter Optimized for Size and Light Load
Efficiency
LMR36503-Q1
SNVSBK0 – SEPTEMBER 2019
www.ti.com
4 Device and Documentation Support
4.1 Documentation Support
4.1.1 Related Documentation
ADVANCE INFORMATION
For related documentation see the following:
• Texas Instruments, Thermal Design by Insight not Hindsight Application Report
• Texas Instruments, A Guide to Board Layout for Best Thermal Resistance for Exposed Pad Packages
Application Report
• Texas Instruments, Semiconductor and IC Package Thermal Metrics Application Report
• Texas Instruments, Thermal Design Made Simple with LM43603 and LM43602 Application Report
• Texas Instruments, PowerPAD™ Thermally Enhanced Package Application Report
• Texas Instruments, PowerPAD Made Easy Application Report
• Texas Instruments, SBVA025 Using New Thermal Metrics Application Report
• Texas Instruments, Layout Guidelines for Switching Power Supplies Application Report
• Texas Instruments, Simple Switcher PCB Layout Guidelines Application Report
• Texas Instruments, Construction Your Power Supply- Layout Considerations Application Report
• Texas Instruments, Low Radiated EMI Layout Made Simple with LM4360x and LM4600x Application Report
4.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
4.3 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
4.4 Trademarks
HotRod, PowerPAD, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
4.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
4.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
5 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
2
Submit Documentation Feedback
Copyright © 2019, Texas Instruments Incorporated
Product Folder Links: LMR36503-Q1
PACKAGE OPTION ADDENDUM
www.ti.com
11-Sep-2019
PACKAGING INFORMATION
Orderable Device
Status
(1)
PMR36503MSCQRPETQ1
PREVIEW
Package Type Package Pins Package
Drawing
Qty
VQFN-HR
RPE
9
250
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
TBD
Call TI
Call TI
Op Temp (°C)
Device Marking
(4/5)
-40 to 150
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
permission to use these resources only for development of an application that uses the TI products described in the resource. Other
reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third
party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims,
damages, costs, losses, and liabilities arising out of your use of these resources.
TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on
ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable
warranties or warranty disclaimers for TI products.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2019, Texas Instruments Incorporated
Was this manual useful for you? yes no
Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Related manuals

Download PDF

advertising