Texas Instruments | LM66100 5.5-V, 1.5-A 79-mΩ, Low IQ Ideal Diode With Input Polarity Protection (Rev. A) | Datasheet | Texas Instruments LM66100 5.5-V, 1.5-A 79-mΩ, Low IQ Ideal Diode With Input Polarity Protection (Rev. A) Datasheet

Texas Instruments LM66100 5.5-V, 1.5-A 79-mΩ, Low IQ Ideal Diode With Input Polarity Protection (Rev. A) Datasheet
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LM66100
SLVSEZ8A – MARCH 2019 – REVISED JUNE 2019
LM66100 5.5-V, 1.5-A 79-mΩ, Low IQ Ideal Diode With Input Polarity Protection
1 Features
•
•
1
•
•
•
•
•
Wide operating voltage range: 1.5 V – 5.5 V
Reverse voltage standoff on VIN:
–6-V absolute maximum
Maximum continuous current (IMAX): 1.5 A
On-Resistance (RON):
– 5-V VIN = 79-mΩ (typical)
– 3.6-V VIN = 91-mΩ (typical)
– 1.8-V VIN = 141-mΩ (typical)
Comparator chip enable (CE)
Channel status indication (ST)
Low current consumption:
– 3.6-V VIN Shutdown current (ISD,VIN): 120-nA
(typical)
– 3.6-V VIN Quiescent current (IQ, VIN): 150-nA
(typical)
The chip enable works by comparing the CE pin
voltage to the input voltage. When the CE pin voltage
is higher than VIN, the device is disabled and the
MOSFET is off. When the CE pin voltage is lower,
the MOSFET is on. The LM66100 also comes with
reverse polarity protection (RPP) that can protect the
device from a miswired input, such as a reversed
battery.
Two LM66100 devices can be used in an ORing
configuration similar to a dual diode ORing
implementation. In this configuration, the devices
pass the highest input voltage to the output while
blocking reverse current flow into the input supplies.
These devices can compare input and output
voltages to make sure that reverse current is blocked
through an internal voltage comparator.
The LM66100 is available in a standard SC-70
package characterized for operation over a junction
temperature range of –40°C to 125°C.
Device Information(1)
2 Applications
•
•
•
•
Smart meters
Building automation
GPS and tracking
Primary and backup batteries
PART NUMBER
LM66100
PACKAGE
SC-70 (6)
BODY SIZE (NOM)
2.1 mm x 2.0 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Typical Application
3 Description
The LM66100 is a Single-Input, Single-Output (SISO)
integrated ideal diode that is well suited for a variety
of applications. The device contains a P-channel
MOSFET that can operate over an input voltage
range of 1.5 V to 5.5 V and can support a maximum
continuous current of 1.5 A.
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM66100
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Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
6.5
6.6
6.7
4
4
4
4
5
5
6
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Switching Characteristics ..........................................
Typical Characteristics ..............................................
Parameter Measurement Information .................. 7
Detailed Description .............................................. 8
8.1 Overview ................................................................... 8
8.2 Functional Block Diagram ......................................... 8
8.3 Feature Description................................................... 9
8.4 Device Functional Modes........................................ 10
9
Application and Implementation ........................ 10
9.1 Application Information............................................ 10
9.2 Typical Applications ................................................ 10
10 Power Supply Recommendations ..................... 13
11 Layout................................................................... 14
11.1 Layout Guidelines ................................................. 14
11.2 Layout Example .................................................... 14
12 Device and Documentation Support ................. 15
12.1
12.2
12.3
12.4
12.5
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
15
15
15
15
15
13 Mechanical, Packaging, and Orderable
Information ........................................................... 15
4 Revision History
Changes from Original (March 2019) to Revision A
•
2
Page
Changed from Advance Information to Production Data ....................................................................................................... 1
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5 Pin Configuration and Functions
DCK Package
6-Pin SC-70
Top View
Pin Functions
PIN
NO.
NAME
I/O
DESCRIPTION
1
VIN
I
Device input
2
GND
-
Device ground
3
CE
I
Active-low chip enable. Can be connected to VOUT for reverse current protection. Do not
leave floating.
4
N/C
-
Not internally connected, can be tied to GND or left floating.
5
ST
O
Active-low open-drain output, pulled low when the chip is disabled. Hi-Z when the chip is
enabled. Connect to GND if not required.
6
VOUT
O
Device output
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
–6
6
V
Maximum Output Voltage Range
–0.3
6
V
Maximum CE Pin Voltage
–0.3
6
V
Maximum ST Pin Voltage
–0.3
6
V
VIN
Maximum Input Voltage Range
VOUT
VCE
VST
UNIT
ISW,
MAX
Maximum Continuous Switch Current
1.5
A
ISW,
PLS
Maximum Pulsed Switch Current (≤120 ms, 2% Duty Cycle)
2.5
A
ID, PLS
Maximum Pulsed Body Diode Current (≤0.1 ms, 0.2% Duty Cycle)
2.5
A
ICE
Maximum CE Pin Current
–1
IST
Maximum ST Pin Current
–1
TJ
Junction temperature
–40
125
°C
TSTG
Storage temperature
–65
150
°C
TLEAD
Maximum Lead Temperature (10 s soldering time)
300
°C
(1)
mA
mA
Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human body model (HBM), per
ANSI/ESDA/JEDEC JS-001, allpins (1)
±2000
Charged device model (CDM), per JEDEC
specificationJESD22-C101, all pins (2)
±500
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with
less is possible with the necessary precautions. Pins listed may actually have higher performance.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
VIN
Input Voltage Range
VOUT
TYP
MAX
UNIT
1.5
5.5
V
Output Voltage Range
1
5.5
V
VCE
CE Pin Voltage Range
0
5.5
V
VST
ST Pin Voltage Range
0
5.5
V
6.4 Thermal Information
LM66100
THERMAL METRIC (1)
DCK (SC-70)
UNIT
6 PINS
RθJA
Junction-to-ambient thermal resistance
192
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
124
°C/W
RθJB
Junction-to-board thermal resistance
52
°C/W
ΨJT
Junction-to-top characterization parameter
34
°C/W
ΨJB
Junction-to-board characterization parameter
52
°C/W
(1)
4
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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6.5 Electrical Characteristics
Typical values are at 25°C with an input voltage of 3.6V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP MAX UNIT
Input Supply (VIN)
VIN Shutdown Current
VOUT = VIN
VCE > VIN + 80mV
IOUT = 0 A (VOUT = open)
25°C
ISD,VIN
VIN Quiescent Current
VOUT = VIN
VCE < VIN - 250mV
IOUT = 0 A (VOUT = open)
25°C
IQ,VIN
0.12
0.3
µA
0.3
µA
0.3
µA
0.3
µA
0.5
µA
2.7
µA
8
µA
VOUT - VIN ≤ 4.5 V
VCE > VIN + 80mV
-40°C to 85°C
1.7
µA
-40°C to 105°C
5.1
µA
VOUT - VIN ≤ 1.0 V
VCE > VIN + 80mV
-40°C to 85°C
0.7
µA
-40°C to 105°C
2.1
µA
-40°C to 105°C
0.15
-40°C to 105°C
25°C
VOUT - VIN ≤ 5.5 V
VCE > VIN + 80mV
0.2
-40°C to 85°C
-40°C to 105°C
IOUT,
OFF
OUT to IN Leakage Current
(Current out of VIN)
ON-Resistance (RON)
25°C
RON
ON-State Resistance
IOUT = -200 mA
VIN = 5 V
79
-40°C to 85°C
-40°C to 125°C
ON-State Resistance
IOUT = -200 mA
VIN = 3.6 V
91
ON-State Resistance
IOUT = -200 mA
VIN = 1.8 V
110
-40°C to 85°C
125
-40°C to 125°C
140
25°C
RON
mΩ
120
25°C
RON
95
110
141
mΩ
180
-40°C to 85°C
210
-40°C to 125°C
230
mΩ
Comparator Chip Enable (CE)
VON
Turn ON Threshold
VCE - VIN
-40°C to 125°C
–80
mV
VOFF
Turn OFF Threshold
VCE - VIN
-40°C to 125°C
–250 –150
0
35
80
mV
ICE
CE Pin Leakage Current
VCE < VIN - 250mV
-40°C to 125°C
0
160
300
nA
ICE
CE Pin Leakage Current
VCE > VIN + 80mV
-40°C to 125°C
0
400
610
nA
0.5
1
A
0.5
1.1
V
Reverse Current Blocking (RCB) and Body Diode Characteristics
IRCB
Reverse Activation Current
VCE = VOUT
-40°C to 125°C
VFWD
Body Diode Forward Voltage
IOUT = 10 mA
VCE > VIN + 80mV
-40°C to 125°C
0.1
Status Indication (ST)
VOL, ST
Output Low Voltage
IST = 1 mA
-40°C to 125°C
tST
Status Delay Time
VCE transitions from low to high
-40°C to 125°C
IST
ST Pin Leakage Current
VCE < VIN - 250mV
-40°C to 125°C
0.1
1
–20
V
µs
20
nA
6.6 Switching Characteristics
Unless otherwise noted, the typical characteristics in the following table applies over the entire recommended operating
voltage at an ambient temperature of 25°C and a load of CL = 100 nF and RL = 1kΩ
PARAMETER
tON
tOFF
Turn ON Time
Turn OFF Time
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VIN = 1.8 V
90
µs
VIN = 3.6 V
40
µs
VIN = 5 V
27
µs
VIN = 1.8 V
2
µs
VIN = 3.6 V
2
µs
VIN = 5 V
2
µs
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Switching Characteristics (continued)
Unless otherwise noted, the typical characteristics in the following table applies over the entire recommended operating
voltage at an ambient temperature of 25°C and a load of CL = 100 nF and RL = 1kΩ
PARAMETER
TEST CONDITIONS
MIN
VIN = 1.8 V
tFALL
Output Fall Time
TYP
MAX
UNIT
20
µs
VIN = 3.6 V
10
µs
VIN = 5 V
7.5
µs
6.7 Typical Characteristics
200
240
200
-40qC
25qC
85qC
105qC
180
Quiescent Current (nA)
Shutdown Current (nA)
220
180
160
140
120
100
100
80
60
40
20
1.5
2
2.5
3
3.5
4
Input Voltage (V)
4.5
5
5.5
4.5
5
5.5
D002
180
VOUT - VIN = 1V
VOUT - VIN = 4.5V
VOUT - VIN = 5.5V
160
600
400
VIN = 1.8V
VIN = 3.6V
VIN = 5V
140
120
100
80
200
-20
0
20
40
60
Temperature (qC)
80
100
60
-40
120
-20
0
D003
VCE > VIN
VCE < VIN
Figure 3. Reverse Leakage Current vs Junction Temperature
20
40
60
Temperature (qC)
80
100
120
D004
IOUT = 200mA
Figure 4. On-Resistance vs Junction Temperature
65
-50
-40qC
25qC
85qC
105qC
-40qC
25qC
85qC
105qC
60
Turn OFF Threshold (V)
-75
-100
-125
-150
-175
-200
1.5
3
3.5
4
Input Voltage (V)
Figure 2. Quiescent Current vs Input Voltage
800
0
-40
2.5
VCE < VIN
On-Resistance (m:)
1000
2
D001
1200
VOUT to VIN Leakage Current (nA)
120
60
1.5
Figure 1. Shutdown Current vs Input Voltage
Turn ON Threshold (V)
140
80
VCE > VIN
55
50
45
40
35
30
2
2.5
3
3.5
4
Input Voltage (V)
4.5
5
25
1.5
5.5
D007
Figure 5. Turn ON Threshold vs Input Voltage
6
160
-40qC
25qC
85qC
105qC
2
2.5
3
3.5
4
Input Voltage (V)
4.5
5
5.5
D008
Figure 6. Turn OFF Threshold vs Input Voltage
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0.6
120
0.5
100
Turn ON Time (Ps)
Forward Voltage (V)
Typical Characteristics (continued)
0.4
0.3
0.2
-40qC
25qC
85qC
105qC
0.1
0
1.5
2
2.5
VCE > VIN
3
3.5
4
Input Voltage (V)
4.5
5
VIN = 1.8V
VIN = 3.6V
VIN = 5V
80
60
40
20
0
-40
5.5
-20
0
D005
IOUT = 10mA
CL = 100nF
Figure 7. Body Diode Forward Voltage vs Input Voltage
20
40
60
80
Junction Temperature (qC)
120
D009
RL = 1kΩ
Figure 8. Turn ON Time vs Junction Temperature
10
22
VIN = 1.8V
VIN = 3.6V
VIN = 5V
20
18
Fall Time (Ps)
8
Turn OFF Time (Ps)
100
6
4
16
14
12
10
8
6
2
4
-40
0
-40
-20
CL = 100nF
0
20
40
60
80
Junction Temperature (qC)
RL = 1kΩ
100
-20
0
20
40
60
80
Junction Temperature (qC)
100
120
D011
120
D010
VIN = 1.8V to 5V
Figure 9. Turn OFF Time vs Junction Temperature
CL = 100nF
RL = 1kΩ
Figure 10. Fall Time vs Junction Temperature
7 Parameter Measurement Information
Figure 11. Timing Diagram
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8 Detailed Description
8.1 Overview
The LM66100 is a Single-Input, Single-Output (SISO) integrated ideal diode that is well suited for a variety of
applications. The device contains a P-channel MOSFET that can operate over an input voltage range of 1.5 V to
5.5 V and can support a maximum continuous current of 1.5 A.
The chip enable works by comparing the CE pin voltage to the input voltage. When the CE pin voltage is higher
than VIN by 80 mV, the device is disabled and the MOSFET is off. When the CE pin voltage is lower than VIN by
250 mV, the MOSFET is on. The LM66100 also comes with reverse polarity protection (RPP) that can protect the
device from a miswired input, such as a reversed battery.
8.2 Functional Block Diagram
8
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8.3 Feature Description
8.3.1 Reverse Polarity Protection (RPP)
In the event a negative input voltage is applied, the ideal diode will stay off and prevent current flow to protect the
system load. For a stand-alone, always on application, CE can be tied to GND so it will not go negative with
respect to GND see Figure 12.
Figure 12. RPP Protection Circuit
8.3.2 Always-ON Reverse Current Blocking (RCB)
By connecting the CE pin to VOUT, this allows the comparator to detect reverse current flow through the switch.
If the output is forced above the selected input by VOFF, the channel will switch off to stop the reverse current
IRCB within tOFF. Once the output falls to below VIN by VON, the device will turn back on.
Figure 13. RCB Circuit
Figure 14. RCB Waveforms
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8.4 Device Functional Modes
Table 1 summarizes the Device Functional Modes:
Table 1. Device Functional Modes
State
IN-to-OUT
Power Dissipation
OFF
Diode
IOUT x VFWD
ST State
L
ON
Switch
IOUT2 x RON
H
9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The LM66100 Ideal Diode can be used in a variety of stand-alone and multi-channel applications.
9.2 Typical Applications
9.2.1 Dual Ideal Diode ORing
Two LM66100 Ideal Diodes can be used together for ORing between two power supplies.
Figure 15. Dual Ideal Diode ORing
9.2.1.1 Design Requirements
Design a circuit that allows the highest input voltage to power a downstream system while providing reverse
current protection.
9.2.1.2 Detailed Design Procedure
This circuit ties the CE of each device to the opposite power source. In this configuration, the highest supply will
always be selected using a make-before-break logic. This prevents any reverse current flow between the
supplies and avoids the need of a dedicated reverse current blocking comparator. For ORing applications that
need RPP, it is recommended to use a series resistor (RCE) to limit the current into the CE pin during a negative
voltage event.
10
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Typical Applications (continued)
9.2.1.3 Application Curves
The below scope shot shows the output voltage (VOUT) being initially powered by VIN1. When VIN2 is applied, it
powers VOUT because it is a higher voltage. When VIN2 is removed, VOUT is once again powered by VIN1.
Figure 16. Dual Ideal Diode ORing Behavior
9.2.2 Dual Ideal Diode ORing for Continuous Output Power
VOUT
VIN
VIN1 (5V)
+
-
Logic
CE
GND
ST
CL
VIN2 (3.3V)
+
-
RL
Logic
CE
GND
ST
Status
Indication
Figure 17. Dual Ideal Diode ORing for Continuous Output Power
9.2.2.1 Design Requirements
The shortcoming of the previous implementation happens when both input voltages are the same for a long
period of time, then both devices will completely turn off, powering down the output load. To avoid this case, the
status output from the priority supply and a pull up resistor can be used causing both devices to switchover at the
same time. For ORing applications that need RPP, it is recommended to use a series resistor (RCE) to limit the
current into the CE pin during a negative voltage event.
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Typical Applications (continued)
9.2.2.2 Application Curves
The figures below show the switchover performance between VIN1 and VIN2.
Figure 18. Switchover from VIN1 (5 V) to VIN2 (3.3 V)
Figure 19. Switchover from VIN2 (3.3V) to VIN1 (5V)
9.2.3 ORing with Discrete MOSFET
Figure 20. ORing with a Discrete MOSFET
9.2.3.1 Design Requirements
Similar to the Dual Ideal Diode circuit, the Status Output can also be used to control a discrete P-Channel
MOSFET. This can be useful in applications that want to minimize the leakage current on the secondary supply,
such as battery backup systems. This configuration can also be used on systems that require a lower RON on
the secondary rail, useful for higher current applications.
When the Ideal Diode path is enabled, the status will be Hi-Z and pull up the gate of the external PFET to keep it
off. When the main supply (VIN1) drops such that backup supply (VIN2) is higher than VIN1, the ideal diode will
be disabled and pull the ST pin and the PFET gate low to turn on the discrete MOSFET path.
12
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Typical Applications (continued)
9.2.3.2 Application Curves
The figures below show the switchover performance between VIN1 and VIN2.
Figure 21. Switchover from VIN1 5 V to VIN2 3.3 V
Figure 22. Switchover from VIN2 3.3 V to VIN1 5 V
10 Power Supply Recommendations
The device is designed to operate with a VIN range of 1.5 V to 5.5 V. The VIN power supply must be well
regulated and placed as close to the device terminal as possible. The power supply must be able to withstand all
transient load current steps. In most situations, using an input capacitance (CIN) of 1 μF is sufficient to prevent
the supply voltage from dipping when the switch is turned on. In cases where the power supply is slow to
respond to a large transient current or large load current step, additional bulk capacitance may be required on
the input.
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11 Layout
11.1 Layout Guidelines
For best performance, all traces must be as short as possible. To be most effective, the input and output
capacitors must be placed close to the device to minimize the effects that parasitic trace inductances may have
on normal operation. Using wide traces for VIN, VOUT and GND helps minimize the parasitic electrical effects.
11.2 Layout Example
Figure 23. LM66100 Layout Example
14
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12 Device and Documentation Support
12.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
12.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.3 Trademarks
E2E is a trademark of Texas Instruments.
12.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
12.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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Copyright © 2019, Texas Instruments Incorporated
Product Folder Links: LM66100
15
PACKAGE OPTION ADDENDUM
www.ti.com
25-Jun-2019
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM66100DCKR
ACTIVE
SC70
DCK
6
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 105
1CU
LM66100DCKT
ACTIVE
SC70
DCK
6
250
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 105
1CU
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
25-Jun-2019
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
13-Jun-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LM66100DCKR
SC70
DCK
6
3000
178.0
9.0
2.4
2.5
1.2
4.0
8.0
Q3
LM66100DCKT
SC70
DCK
6
250
178.0
9.0
2.4
2.5
1.2
4.0
8.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
13-Jun-2019
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM66100DCKR
SC70
DCK
6
3000
180.0
180.0
18.0
LM66100DCKT
SC70
DCK
6
250
180.0
180.0
18.0
Pack Materials-Page 2
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