Texas Instruments | TPS61322 6.5-µA Quiescent current, 1.8-A switch current boost converter (Rev. D) | Datasheet | Texas Instruments TPS61322 6.5-µA Quiescent current, 1.8-A switch current boost converter (Rev. D) Datasheet

Texas Instruments TPS61322 6.5-µA Quiescent current, 1.8-A switch current boost converter (Rev. D) Datasheet
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TPS61322
SLVSDY5D – JANUARY 2018 – REVISED FEBRUARY 2019
TPS61322 6.5-µA Quiescent current, 1.8-A switch current boost converter
1 Features
3 Description
•
•
•
•
•
The TPS61322 is a synchronous boost converter with
only 6.5-µA quiescent current. The TPS61322
provides a power-supply solution for products
powered by alkaline battery, NiMH rechargeable
battery, or one-cell Li-ion battery. The boost converter
is based on a hysteretic control topology using
synchronous rectification to obtain maximum
efficiency at minimal quiescent current. The
TPS61322 also allows the use of small external
inductor and capacitors. Higher than 90% efficiency is
achieved at 10-mA load from 1.5-V input to 2.2-V
output conversion.
1
•
•
•
•
Operating input voltage range: 0.9 V to 5.5 V
Output voltage range: 1.8 V to 5.5 V
6.5-µA Quiescent current into VOUT pin
±3% Output voltage accuracy over temperature
Minimum switch peak-current limit:
– 0.42 A for TPS613223A
– 0.5 A for TPS61322
– 0.75 A for TPS613221A and TPS613226A
– 1.10 A for TPS613222A
Higher than 90% efficiency at 10-mA load from
1.5-V to 2.2-V conversion
Thermal shutdown protection
2.9-mm × 1.3-mm 3-pin SOT package and 2.9mm × 1.6-mm 5-pin SOT package
Create a custom design using the TPS61322 with
the WEBENCH® Power Designer
2 Applications
•
•
•
•
•
1-cell to 3-cell Alkaline or NiMH battery-powered
applications
Gaming control
Tablet
Portable electronics
Medical equipment
The TPS61322 can also support high output current
applications with an external schottky diode. The
TPS613222A provides higher than 500-mA output
current capability at 3-V input voltage to 5-V output
voltage conversion with an external Schottky diode in
parallel with the internal rectifier FET.
The output voltage is set internally to a fixed output
voltage from 1.8 V to 5.5 V in increments of 0.1 V.
Thus, it only needs two external components to get
the desired output voltage. The TPS61322 also
implements thermal shutdown protection function.
The TPS61322 is available in a 2.9-mm × 1.3-mm 3pin SOT package or a 2.9-mm × 1.6-mm 5-pin SOT
package.
Device Information(1)
PART NUMBER
TPS61322
PACKAGE
BODY SIZE (NOM)
SOT-23 (3)
2.90 mm × 1.30 mm
SOT-23 (5)
2.90 mm × 1.60 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Typical Application Circuit
SW
Battery
VOUT
VOUT
L1
C1
TPS61322xx
GND
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS61322
SLVSDY5D – JANUARY 2018 – REVISED FEBRUARY 2019
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Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Device Comparison Table.....................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
3
4
7.1
7.2
7.3
7.4
7.5
7.6
4
4
4
4
5
6
Absolute Maximum Ratings ......................................
ESD Ratings ............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Typical Characteristics ..............................................
Detailed Description .............................................. 9
8.1 Overview ................................................................... 9
8.2 Functional Block Diagram ......................................... 9
8.3 Feature Description................................................... 9
9
Application and Implementation ........................ 11
9.1 Application Information............................................ 11
9.2 Typical Application ................................................. 11
9.3 System Examples ................................................... 19
10 Power Supply Recommendations ..................... 20
11 Layout................................................................... 21
11.1 Layout Guidelines ................................................. 21
11.2 Layout Examples................................................... 22
12 Device and Documentation Support ................. 23
12.1
12.2
12.3
12.4
12.5
12.6
12.7
Device Support ....................................................
Documentation Support .......................................
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
23
23
23
23
23
24
24
13 Mechanical, Packaging, and Orderable
Information ........................................................... 24
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision C (May 2018) to Revision D
Page
•
Deleted quasi-GPNs from TPS61322 title and changed "TPS61322xx" to "TPS61322" ....................................................... 1
•
Added links for WEBENCH ................................................................................................................................................... 1
•
Changed the NFET symbol in Functional Block Diagram ...................................................................................................... 9
•
Added Device Functional Modes.......................................................................................................................................... 10
Changes from Revision B (April 2018) to Revision C
Page
•
Deleted Cross Reference to Device Comparison Table and the Electrical Characteristics table footnotes regarding
device TPS61223A, that was Product Preview device in the SLVSDY5B revision. .............................................................. 3
•
Added graphs pertaining to TPS613223A device to the Typical Characteristics matrix. ...................................................... 6
Changes from Revision A (January 2018) to Revision B
Page
•
Deleted Cross Reference to Device Comparison Table and the Electrical Characteristics table footnotes regarding
devices TPS61221A, TPS61222A, and TPS61226A that were Product Preview devices in the SLVSDY5A revision. ........ 3
•
Added Figure 3, Figure 4 and Figure 5 .................................................................................................................................. 6
•
Added Figure 7, Figure 8, and Figure 11 ............................................................................................................................... 8
Changes from Original (September 2017) to Revision A
•
2
Page
Production Data release January 2018. ................................................................................................................................ 1
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5 Device Comparison Table
OUTPUT VOLTAGE
TYPICAL CURRENT LIMIT
TPS61322
PART NUMBER
2.2 V
0.75A
TPS613221A
3.3 V
1.2 A
TPS613222A
5V
1.8 A
TPS613223A
2V
0.75 A
TPS613224A (1)
2.5 V
0.75 A
TPS613225A (1)
3V
1.2 A
3.6 V
1.2 A
TPS613226A
(1)
Product Preview. Contact TI factory for more information.
6 Pin Configuration and Functions
DBZ Package
3-Pin SOT
Top View
VOUT
GND
TPS61322xA
TPS61322
GND
SW
VOUT
SW
DBV Package
5-Pin SOT
Top View
NC
VOUT
TPS61322xA
SW
GND
NC
Pin Functions
PIN
TPS61322
TPS61322xA
DBZ
DBZ
DBV
1
3
2
GND
PWR
Ground of the IC.
2
2
1
SW
PWR
The switch pin of the converter. It is connected to the inductor.
3
1
4
VOUT
PWR
Boost converter output.
-
-
3
NC
-
No connection inside the device.
-
-
5
NC
-
No connection inside the device.
NAME
TYPE
DESCRIPTION
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN
MAX
UNIT
–0.3
6.0
V
Operating Junction Temperature,TJ
–40
150
°C
Storage Temperature, Tstg
–65
150
°C
Voltage range at terminals (2)
(1)
(2)
SW, VOUT
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to network ground terminal.
7.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±2000
Charged-device model (CDM), per JEDEC specification JESD22C101 (2)
±500
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
5.5
UNIT
VIN
Input voltage range
0.9
V
VOUT
Output voltage range
1.8
5.5
V
L
Inductor (effective)
0.7
2.2
13
µH
COUT
Output capacitor (effective)
4.7
16
100
µF
TJ
Operating junction temperature
-40
125
°C
7.4 Thermal Information
TPS61322
THERMAL METRIC
(1)
DBZ (SOT-23)
DBV (SOT-23)
3-PIN
5-PIN
UNIT
RθJA
Junction-to-ambient thermal resistance
322.2
189.7
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
107.0
109.4
°C/W
RθJB
Junction-to-board thermal resistance
65.8
56.5
°C/W
ψJT
Junction-to-top characterization parameter
7.5
33.3
°C/W
ψJB
Junction-to-board characterization parameter
64.5
56.5
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
N/A
°C/W
(1)
4
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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7.5 Electrical Characteristics
TJ = –40°C to +125°C and VIN = 0.9 V to 5.5 V. Typical values are at VIN = 1.2 V, TJ = 25°C, unless otherwise noted
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
POWER SUPPLY
VIN
Input voltage range
VVOUT_START
Minimum voltage for
startup at VOUT pin
0.9
RLoad ≥ 250Ω ,TJ =-40°C to 85°C
IQ
Quiescent current into
VOUT pin
VOUT = 1.2×Target
5.5
V
0.83
0.87
V
6.5
10
uA
OUTPUT
VOUT
ISW_LKG
TPS61322
VIN < VOUT, TJ =-40°C to 125°C
2.134
2.2
2.266
V
TPS613221A
VIN < VOUT, TJ =-40°C to 125°C
3.2
3.3
3.4
V
TPS613222A
VIN < VOUT, TJ =-40°C to 125°C
4.85
5.0
5.15
V
TPS613223A
VIN < VOUT, TJ =-40°C to 125°C
1.94
2.0
2.06
V
TPS613226A
VIN < VOUT, TJ =-40°C to 125°C
3.49
3.6
3.71
V
Leakage current into
SW pin
VSW = VOUT = 1.2×Target
3.5
nA
TPS61322
300
mΩ
TPS613221A
200
mΩ
TPS613222A
150
mΩ
TPS613223A
400
mΩ
TPS613226A
190
mΩ
TPS61322
1300
mΩ
TPS613221A
1000
mΩ
TPS613222A
750
mΩ
TPS613223A
1680
mΩ
POWER SWITCH
RDS(on)_LS
RDS(on)_HS
Low side switch on
resistance
High side switch on
resistance
TPS613226A
ILIM
Peak switch current
limit
950
mΩ
TPS61322
0.50
0.75
1.20
A
TPS613221A
0.75
1.20
1.60
A
TPS613222A
1.10
1.80
2.50
A
TPS613223A
0.42
0.75
1.2
A
TPS613226A
0.75
1.20
1.60
A
Protection
TSD
Over-temperature
protection
TSD_HYS
Over-temperature
protection hysteresis
TJ rising
150
°C
20
°C
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7.6 Typical Characteristics
100
2.25
90
2.24
80
2.23
70
2.22
Output Voltage (V)
Efficiency (%)
TJ = 25°C unless otherwise noted.
60
50
40
30
VIN = 0.9 V
VIN = 1.2 V
VIN = 1.5 V
VIN = 1.8 V
20
10
0
0.0001
0.001
TPS61322
2.21
2.2
2.19
2.18
VIN = 0.9 V
VIN = 1.2 V
VIN = 1.5 V
VIN = 1.8 V
2.17
2.16
0.01
Output Current (A)
0.1
2.15
0.0001
1
0.001
D005
L = 4.7 µH
TPS61322
Figure 1. Load Efficiency with Different Inputs
0.01
Output Current (A)
0.1
1
D006
L = 4.7 µH
Figure 2. Load Regulation
100
3.45
95
90
3.4
Output Voltage (V)
Efficiency (%)
85
80
75
70
Vin=0.9V
Vin=1.5V
Vin=2.5V
Vin=3.0V
Vin=3.3V
65
60
55
50
0.0001
0.001
TPS613221A
3.35
3.3
Vin=0.9V
Vin=1.5V
Vin=2.5V
Vin=3.0V
Vin=3.3V
3.25
0.01 0.02 0.05 0.1 0.2
Iout (A)
0.5
1
3.2
0.0001
0.001
D003
L = 2.2 µH
TPS613221A
Figure 3. Load Efficiency with Different Inputs
0.01 0.02 0.05 0.1 0.2
Iout (A)
0.5
1
D008
L = 2.2 µH
Figure 4. Load Regulation
5.15
100
95
90
5.1
Output Voltage (%)
Efficiency (%)
85
80
75
70
Vin=0.9V
Vin=1.5V
Vin=3.0V
Vin=3.6V
Vin=4.2V
65
60
55
50
0.0001
0.001
TPS613222A
5.05
5
4.95
0.01 0.02 0.05 0.1 0.2
Iout (A)
0.5
L = 2.2 µH
Figure 5. Load Efficiency with Different Inputs
1
D004
Vin=0.9V
Vin=1.5V
Vin=3.0V
Vin=3.6V
Vin=4.2V
4.9
0.0001
0.001
TPS613222A
0.01 0.02 0.05 0.1 0.2
Iout (A)
0.5
1
D007
L = 2.2 µH
Figure 6. Load Regulation
6
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Typical Characteristics (continued)
TJ = 25°C unless otherwise noted.
3.75
100
95
3.7
Output Voltage (V)
90
Efficiency (%)
85
80
75
70
Vin=0.9V
Vin=1.5V
Vin=2.5V
Vin=3.0V
Vin=3.3V
65
60
55
3.65
3.6
Vin=0.9V
Vin=1.5V
Vin=2.5V
Vin=3.0V
Vin=3.3V
3.55
3.5
0.0001
50
0.0001
0.001
TPS613226A
0.01 0.02 0.05 0.1 0.2
Iout (A)
0.5
0.001
0.01 0.02 0.05 0.1 0.2
Iout (A)
1
TPS613226A
D005
0.5
1
D006
L = 2.2 µH
L = 2.2 µH
Figure 8. Load Regulation
Figure 7. Load Efficiency with Different Inputs
2.15
100
Vin=0.9V
Vin=1.2V
Vin=1.5V
Vin=1.8V
95
90
Y Axis Title (Unit)
2.1
85
Efficiency (%)
80
75
70
2.05
2
65
60
Vin=0.9V
Vin=1.2V
Vin=1.5V
Vin=1.8V
55
50
0.0001
1.95
0.0001
0.001
TPS613223A
0.005
Iout (A)
0.02
0.05 0.1
0.001
0.02
0.05 0.1
0.2
D008
0.2
D020
TPS613223A
L = 4.7 µH
L = 4.7 µH
Figure 10. Load Regulation
Figure 9. Load Efficiency with Different Inputs
1500
2000
1400
1900
Current Limit (mA)
Current Limit (mA)
0.005
Iout (A)
1300
1200
1100
1800
1700
1600
1000
-50
-25
TPS613221A
0
25
50
Temperature (°C)
75
100
125
1500
-50
-25
D009
L = 2.2 µH
TPS613222A
Figure 11. Current Limit with Different Temperature
0
25
50
Temperature (°C)
75
100
125
D001
L = 2.2 µH
Figure 12. Current Limit with Different Temperature
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Typical Characteristics (continued)
1500
1
1400
0.9
Current Limit (A)
Current Limit (mA)
TJ = 25°C unless otherwise noted.
1300
1200
0.7
0.6
1100
1000
-50
-25
TPS613226A
0
25
50
Temperature (°C)
75
100
125
D001
L = 2.2 µH
Figure 13. Current Limit with Different Temperature
8
0.8
0.5
-60
-30
0
TPS613223A
30
60
Temperature (°C)
90
120
150
D022
L = 4.7 µH
Figure 14. Current Limit with Different Temperature
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8 Detailed Description
8.1 Overview
The TPS61322xx is a low quiescent current, high efficiency synchronous boost converter. The TPS61322xx uses
hysteretic current control scheme. The TPS61322xx is designed for systems powered by alkaline battery, NiMH
rechargeable battery, Li-ion battery or Li-polymer battery. The input voltage range is from 0.9 V to 5.5 V. After
start-up is completed, the TPS61322xx can work with the input voltage down to 0.4 V. The TPS61322xx
consumes only 6.5-µA quiescent current and achieves high efficiency under light load conditions. The
TPS61322xx is designed as an always-on power. Higher than 90% efficiency is achieved under 10-mA load from
1.5-V input voltage to 2.2-V output voltage conversion to extend battery lifetime. The TPS613222A can support
as high as 500-mA output current from 3-V input voltage to 5-V output voltage conversion with an external
schottky diode in parallel with internal high-side MOSFET.
8.2 Functional Block Diagram
SW 2
3
VOUT
VOUT
VOUT
UVLO
Gate Driver
Logic
PWM Control
Thermal
Shutdown
Gate Driver
Current
Sense
Soft Start &
Current Limit
Control
GND 1
EA
VREF
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8.3 Feature Description
8.3.1 Soft Start
When the input voltage is applied, the high side MOSFET is turned on. The input voltage charges the output
capacitors through the inductor and the high side MOSFET. When the output capacitors are charged to 0.83-V
typical value, the TPS61322xx starts switching at 1.6-MHz fixed frequency and the high-side MOSFET is turned
off. When the output voltage goes up to typical 1.6 V, an internal soft-start control circuit ramps the reference
voltage to 0.8 V within 2 ms. In this way, the soft-start function reduces the input inrush current. After the output
voltage reaches the target value, soft start ends, and the inductor peak current is determined by the output of an
internal error amplifier. After start-up, the TPS61322xx can work with the input voltage down to 0.4 V.
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Feature Description (continued)
8.3.2 Boost Controller Circuit
The TPS61322xx boost converter is controlled by a hysteretic current mode scheme. The TPS61322xx regulates
the output voltage by keeping the inductor ripple constant of 200-mA typical value and adjusting the offset of this
inductor current depending on the output load. If the required average input current is lower than average
inductor current defined by this constant ripple current, the inductor current becomes discontinuous to keep the
efficiency high under light load conditions. Figure 15 illustrates the hysteretic current operation.
The output voltage VOUT is monitored via the internal feedback network connected to a voltage error amplifier. To
regulate the output voltage, the voltage error amplifier compares this feedback voltage to the internal voltage
reference and adjusts the required offset of the inductor current accordingly.
IL
Continuous Current Operation
Discontinuous Current Operation
200mA
200mA
t
Figure 15. Hysteretic Current Operation
The TPS61322xx boost converter can increase the output load capacity by connecting an external schottky diode
from SW pin to VOUT pin. Higher than 500 mA output current is supported for 5-V output voltage applications
such as USB OTG and HDMI power supply. For such applications, an adaptive constant off time circuit will
generate the signal to turn off high-side FET. The inductor current ripple is greater than 200 mA if with this
external diode. A higher inductance can help reduce the inductor current ripple.
8.3.3 Undervoltage Lockout
An undervoltage lockout function stops operation of the converter if the input voltage drops below the typical
undervoltage lockout threshold of 0.4 V while the output voltage is still higher than 1.8 V. A hysteresis of 100 mV
is added so that the device does not switch again until the input voltage goes up to 0.5 V.
8.3.4 Current Limit Operation
The TPS61322xx employs cycle-by-cycle peak current limit operation. If the inductor peak current hits the peak
current limit ILIM, the low-side MOSFET is turned off and stops the further increase of the inductor current. In this
case the output voltage drops until power balance between the input side and output side is achieved. If the
output voltage drops below the input voltage, the inductor current will be clamped by the DCR of the inductor and
the on-resistance (Rds,on) of the high-side MOSFET.
8.3.5 Overtemperature Protection
The TPS61322xx has a built-in temperature sensor which monitors the internal junction temperature in boost
mode operation. If the junction temperature exceeds the threshold 150°C, the device stops operating. As soon as
the junction temperature drops below the shutdown temperature minus the hysteresis, typically 130°C, the device
starts operating again.
8.3.6 Device Functional Modes
• Boost Controller Circuit - Continuous and discontinuous current operation
• Protective mechanisms
– Current Limit Operation
– Undervoltage Lockout
– Overtemperature Protection
10
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The TPS61322xx is designed to operates at a wide input voltage range from 0.9-V to 5.5-V. The minimum peak
switch current limit is 0.5 A for TPS61322, with 0.75 A for TPS613221A and 1.1 A for TPS613222A. The
TPS61322xx supports output voltage from 1.8 V to 5.5 V with increment of 0.1 V, refer to Device Comparison
Table for device details to select the right device for the target applications. Use the following design procedure
to select component values for the TPS61322xx.
9.2 Typical Application
9.2.1 Boost without Schottky Diode
A typical application example is the wireless mouse, which normally requires 2.2-V voltage as its supply voltage
and consumes less than 50-mA current from one-cell alkaline battery. The following design procedure can be
used to select external component values for TPS61322xx.
4.7uH
SW
VOUT
VOUT
L1
Battery
C1
TPS61322xx
22uF
GND
Copyright © 2017, Texas Instruments Incorporated
Figure 16. Typical Application Circuit without Schottky Diode
9.2.1.1 Design Requirements
Table 1. Design Requirements
PARAMETERS
VALUES
Input voltage
0.9 V to 1.6 V
Output voltage
2.2 V
Output current
50 mA
Output voltage ripple
±10 mV
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9.2.1.2 Detailed Design Procedure
9.2.1.2.1 Custom Design With WEBENCH® Tools
Click here to create a custom design using the TPS61322 device with the WEBENCH® Power Designer.
1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements.
2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial.
3. Compare the generated design with other possible solutions from Texas Instruments.
The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time
pricing and component availability.
In most cases, these actions are available:
• Run electrical simulations to see important waveforms and circuit performance
• Run thermal simulations to understand board thermal performance
• Export customized schematic and layout into popular CAD formats
• Print PDF reports for the design, and share the design with colleagues
Get more information about WEBENCH tools at www.ti.com/WEBENCH.
9.2.1.2.2 Maximum Output Current
For boost converters, the maximum output current capability is determined by the input to output ratio, the
efficiency, the inductor current ripple and the current limit. The maximum output current can be estimated by
Equation 1
V IN u ( I LIM
I OUT
(max)
I LH
) uK
2
V OUT
where
•
•
•
ILIM is the peak inductor current limit
ILH is the inductor current ripple
η is the boost converter power convert efficiency
(1)
Minimum input voltage, maximum boost output voltage and minimum current limit should be used as the worst
case condition for the estimation.
In this example, assume the power efficiency is 70% at the minimum input voltage of 0.9 V. The calculated
maximum output current is 114 mA, which satisfies the application requirements.
9.2.1.2.3 Inductor Selection
Because the inductor affects steady state operation, transient behavior, and loop stability, the inductor is the
most important component in power regulator design. There are three important inductor specifications, inductor
value, saturation current, and dc resistance (DCR).
The TPS61322xx is optimized to work with inductor values between 0.7 µH and 13 µH. The inductor values
affect the switching frequency. The estimated switching frequency in continuous conduction mode(CCM) can be
calculated by Equation 2. The switching frequency ƒSW is not a constant value, which is determined by the
inductance, the inductor current ripple, the input voltage and the output voltage. The current ripple ILH is fixed to
200 mA typically, but it can be affected by the inductor value indirectly. Normally when a smaller inductor value is
applied, the inductor current ramps up and down more quickly. The current ripple becomes bigger because the
internal current comparator has delay to respond. If a smaller inductor peak current is required in applications, a
higher inductor value can be used. However, The inductor and output capacitor must be considered together for
the loop stability. The output capacitor and the inductance will influence the bandwidth and phase margin of the
converter. Consequently, with a larger inductor, a bigger capacitor normally must be used to ensure the same
L/C ratio for a stable loop. For best stability consideration, a 4.7-µH inductor is recommended for 2.2-V output
voltage application.
12
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VIN u (VOUT VIN uK)
L u I LH uVOUT
f SW
where
•
•
•
fSW is the switching frequency of the converter
ILH is the inductor current ripple
η is the boost converter power convert efficiency
(2)
Having selected the inductance value, follow Equation 3 to Equation 5 to calculate the inductor's peak current for
the application. Depending on different load conditions, the TPS61322xx works in continuous current mode or
discontinuous conduction mode(DCM). In different modes, the peak currents of the inductor are also different.
Equation 3 provides an easy way to estimate whether the device works in CCM or DCM. Equation 4 shows the
peak current when the device works in CCM and Equation 5 shows the peak current when the device works in
DCM.
VOUT u IOUT I LH
!
VIN uK
2
where
•
•
ILH is the inductor current ripple
η is the boost converter power convert efficiency
(3)
VOUTuIOUT ILH
VIN uK
2
IL,peak
where
•
•
•
I L , peak
IL,peak is the peak current of the inductor
ILH is the inductor current ripple
η is the boost converter power convert efficiency
(4)
I LH
where
•
•
IL,peak is the peak inductor.
ILH is the inductor current ripple
(5)
The saturation current of the inductor must be higher than the calculated peak inductor current, otherwise the
excessive peak current in the inductor harms the device and reduces the system reliability.
In this example, the maximum load for the boost converter is 50 mA, the minimum input voltage is 0.9 V, and the
efficiency under this condition can be estimated at 80%, so the boost converter works in continuous operation
mode by the calculation. The inductor peak current is calculated as 258 mA. To have some margin, a 4.7-µH
inductor with at least 300 mA saturation current is recommended for this application. A 10-µH inductor can be
used as well by increasing the output capacitance to higher than 22 µF to make the loop stable. Table 2 lists the
recommended inductors for TPS61322xx device.
Table 2. List of Inductors
INDUCTAN
CE [µH]
SATURATION CURRENT
[A]
DC
RESISTAN
CE [mΩ]
SIZE (L×W×H)(mm)
PART NUMBER
4.7
1.7
165
2.5 × 2 × 1.2
DFE252012P-4R7M=P2
4.7
1.5
141
3 × 3 × 1.5
74438335047
4.7
1.5
209
2.5 × 2 × 1.2
SDEM25201B-4R7MS
(1)
MANUFACTURER (1)
MURATA
Wurth
CYNTEC
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9.2.1.2.4 Capacitor Selection
For better output voltage filtering, TI recommends low ESR X5R or X7R ceramic capacitors.
For the output capacitor at the VOUT pin, TI recommends small ceramic capacitors. Place the capacitors as
close as possible to the VOUT and GND pins of the device. If, for any reason, the application requires the use of
large capacitors that cannot be placed close to the device, the use of a small ceramic capacitor with a
capacitance value of 1 μF in parallel to the large one is recommended. Place this small capacitor as close as
possible to the VOUT and GND pins of the device.
Considering loop stability, for inductance of 4.7 µH, the minimal output capacitor value is 10 μF (effective value).
Refer to Table 3 for inductor and capacitor combination. Increasing the output capacitor makes the output ripple
smaller.
When selecting capacitors, ceramic capacitor’s derating effect under DC bias voltage must be considered.
Choose the right nominal capacitance by checking capacitor's DC bias characteristics. In this example,
GRM188R60J106ME84D, which is a 10-µF ceramic capacitor with high effective capacitance value at DC biased
condition, is selected for VOUT rail. Two 10-μF capacitors in parallel are recommended to get the desired effective
capacitance.
Table 3. List of Inductor and Capacitor
INDUCTAN
CE [µH]
CAPACITANCE [µF]
LOAD [mA]
PACKAGE
PART NUMBER
1.0
2 × 10
50
0603
GRM188R60J106ME84D
MURATA
2.2
2 × 10
50
0603
GRM188R60J106ME84D
MURATA
4.7
22
50
0805
GRM21BZ71A226ME15
MURATA
(1)
MANUFACTURER (1)
See Third-party Products Disclaimer
9.2.1.3 Application Curves
SW
1V/Div
SW
1V/Div
VOUT(2.2V Offset)
10mV/Div
VOUT(2.2V Offset)
10mV/Div
Inductor Current
50mA/Div
Inductor Current
200mA/Div
VIN = 1.2V
TPS61322
IOUT = 0.1 mA
Figure 17. Switching Waveform at Light Load
14
VIN = 1.2 V
TPS61322
IOUT = 50 mA
Figure 18. Switching Waveform at Heavy Load
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VIN
500mV/Div
VIN
1V/Div
SW
2V/Div
SW
1V/Div
VOUT(2.2V Offset)
10mV/Div
VOUT
1V/Div
Inductor Current
200mA/Div
Inductor Current
100mA/Div
VIN = 1.2 V
Rload = 250 Ω
TPS61322
VIN = 1.2 V to 1.5 V
Figure 19. Start-up by VIN
IOUT
50mA/Div
SW
2V/Div
SW
2V/Div
VOUT(2.2V Offset)
20mV/Div
VOUT(2.2V Offset)
50mV/Div
Inductor Current
200mA/Div
Inductor Current
200mA/Div
TPS61322
IOUT = 50 mA
Figure 20. Line Transient
IOUT
50mA/Div
VIN = 1.2 V
TPS61322
IOUT = 10 mA to 50 mA
VIN = 1.2 V
Figure 21. Load Transient
TPS61322
IOUT = 10 mA to 100 mA
Figure 22. Load Transient
100
95
90
Efficiency (%)
85
80
75
70
65
60
L = 2.2 PH
L = 4.7 PH
L = 10 PH
55
50
0.0001
Wurth Electronics, 74438335XXX family
0.001
0.01
Output Current (A)
2.2 µH, 4.7 µH, 10 µH
0.1
D007
VIN = 1.2 V
TPS61322
Figure 23. Efficiency with Different Inductance
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9.2.2 Boost with Schottky Diode
Another typical application example is the USB OTG which normally requires 5-V output as its supply voltage
and consumes as high as 500-mA current. The following design procedure can be used to select external
component values for this application.
R1
C2
D1
5.0V, 500mA
2.2uH
SW
VOUT
VOUT
L1
C1
Battery
22uF
TPS613222A
GND
Figure 24. Typical Application Circuit with Schottky Diode
9.2.2.1 Design Requirements
Table 4. Design Requirements
PARAMETERS
VALUES
Input voltage
3 V to 4.35 V
Output voltage
5V
Output vurrent
500 mA
Output voltage ripple
± 25 mV
9.2.2.2 Detailed Design Procedure
9.2.2.2.1 Inductor Selection
The peak current is calculated according to Equation 4 and Equation 5.The saturation current of the inductor
must be higher than the calculated peak inductor current.
In this example, the maximum load for the boost converter is 500 mA, and the minimum input voltage is 3 V.
Assuming the efficiency under this condition is 90%, and a typical 2.2-µH inductor is adopted in this application,
so the boost converter works in continuous operation mode by the calculation. The current ripple is 500mA and
the inductor peak current is calculated as 1.18 A. To leave some margin, a 2.2-µH inductor with at least 1.4-A
saturation current is recommended for this application.Table 5 lists the recommended inductors for TPS613222A
device.
Table 5. List of Inductors
INDUCTAN
CE [µH]
SATURATION CURRENT
[A]
DC
RESISTAN
CE [mΩ]
SIZE (L×W×H) (mm)
2.2
2.3
82
2.5 × 2 × 1.2
DFE252012F-2R2M
MURATA
2.2
2.4
89
2.5 × 2 × 1
HMLQ25201T-2R2MSR
CYNTEC
2.2
2.5
75
3.2 × 2.5 × 1.2
HMME32251B--2R2MS
CYNTEC
(1)
See Third-party Products Disclaimer
16
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MANUFACTURER (1)
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9.2.2.2.2 Schottky Diode Selection
The high switching frequency of TPS61322xx demands a high-speed rectifying switch for optimum efficiency.
Ensure that the average and peak current rating of the diode exceeds the average output current and peak
inductor current. In addition, the reverse breakdown voltage of the diode must exceed the maximum output
voltage of the converter. A snubber circuit consisting of a resistor R1 and a capacitor C2 is needed if the
Schottky diode D1 is soldered. The capacitance of C2 must be larger than triple times of the diode capacitance.
The typical value of the resistor R1 is 5 Ω, and the typical value of the capacitor C2 is 120 pF.
9.2.2.2.3 Capacitor Selection
Refer to Capacitor Selection for the detailed design steps.Table 6 lists the recommended inductor and capacitor
combination. Three 10-μF capacitors in parallel are recommended to get the desired effective capacitance.
Table 6. List of Inductor and Capacitor
INDUCTAN
CE [µH]
CAPACITANCE [µF]
LOAD [mA]
PACKAGE
PART NUMBER
(1)
MANUFACTURER (1)
1
3 × 10
500
0603
GRM188R60J106ME84D
MURATA
2.2
3 × 10
500
0603
GRM188R60J106ME84D
MURATA
4.7
2 × 22
500
0805
GRM21BZ71A226ME15
MURATA
See Third-party Products Disclaimer
9.2.2.3 Application Curves
VIN = 3.6 V
TPS613222A
IOUT = 0.1 mA
Figure 25. Switching Waveform at Light Load
VIN = 3.6 V
TPS613222A
IOUT = 500 mA
VIN = 3.6 V
TPS613222A
IOUT = 100 mA
Figure 26. Switching Waveform at Heavy Load
VIN = 3.6 V
Figure 27. Switching Waveform at Heavy Load
TPS613222A
Rload = 250 Ω
Figure 28. Start-up by VIN
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VIN = 2.7 V to 4.3 V
TPS613222
A
www.ti.com
IOUT = 500 mA
VIN = 2.7 V to 4. V
TPS613222A
IOUT = 500 mA
Figure 30. Line Regulation
Figure 29. Line Transient
VIN = 3.6 V
TPS613222A
IOUT = 10 mA to 500 mA
VIN = 3.6 V
TPS613222A
Figure 32. Load Regulation
100
5.15
90
5.1
Output Voltage (V)
Efficiency (%)
Figure 31. Load Transient
80
70
VIN=1.5V
VIN=2.5V
VIN=3.0V
VIN=3.6V
VIN=4.2V
60
50
0.0001
0.001
TPS613222A
0.01 0.02 0.05 0.1 0.2
Iout (A)
L = 2.2 µH
0.5
5.05
5
4.95
1
4.9
0.0001
VIN=1.5V
VIN=2.5V
VIN=3.0V
VIN=3.6V
VIN=4.2V
0.001
D011
D1:ZLLS410TA
TPS613222A
Figure 33. Efficiency with Different Input Voltage
18
IOUT = 0 mA to 500 mA
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0.01 0.02 0.05 0.1 0.2
Iout (A)
L = 2.2 µH
0.5
1
D012
D1:ZLLS410TA
Figure 34. Load Regulation
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9.3 System Examples
TPS61322xx can be easily shut down with an external switch Q1 as shown in Figure 35. The switch can be
mechanical switch, a P-channel MOSFET, or a PNP transistor. For a mechanical switch, there is no control logic
circuit needed to turn on or turn off the switch.
D1
(optional for large current)
L1 2.2 µH
Q1
SW
VOUT
VOUT
C2
Battery
2.2 µF
C1
TPS6132xx
22 µF
GND
Copyright © 2017, Texas Instruments Incorporated
Figure 35. True Shutdown for TPS61322xx
9.3.1 Detail Design Schematics
The Figure 36 shows the application circuit when the power supply of the micro controller unit (MCU) is not less
than the battery voltage. The Figure 37 shows the application circuit when the power supply of the micro
controller unit (MCU) is less than the battery voltage
D1
D1
(optional for large current)
Q1
L1 2.2 µH
VOUT
C1
2.2 µF
V_MCU
GPIO
TPS6132xx
SW
VOUT
C2
R1
L1 2.2 µH
Q1
SW
Battery
(optional for large current)
22 µF
R1
C1
2.2 µF
V_MCU
GND
Q2
MCU
Copyright © 2017, Texas Instruments Incorporated
Figure 36. True Shutdown, V_MCU Voltage No Less than
Battery Voltage
VOUT
VOUT
C2
Battery
GPIO
TPS6132xx
22 µF
GND
MCU
Copyright © 2017, Texas Instruments Incorporated
Figure 37. True Shutdown, V_MCU Voltage Less than
Battery Voltage
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10 Power Supply Recommendations
The TPS61322xx is designed to operate from an input voltage supply range between 0.9 V to 5.5 V. The power
supply can be alkaline battery, NiMH rechargeable battery, Li-Mn battery or rechargeable Li-ion battery. The
input supply must be well regulated with the rating of the TPS61322xx.
20
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11 Layout
11.1 Layout Guidelines
As for all switching power supplies, the layout is an important step in the design, especially at high peak currents
and high switching frequencies. If the layout is not carefully done, the regulator could show stability problems as
well as EMI problems. Therefore, use wide and short traces for the main current path and for the power ground
paths. Place the output capacitor, as well as the inductor, as close as possible to the device.
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11.2 Layout Examples
A large ground plane on the top and bottom is good for thermal performance.
GND
VOUT
SW
GND
SW
TPS61322
VIN
VOUT
VOUT
TPS61322xA
VIN
VOUT
GND
GND
Figure 39. TPS61322xA DBZ Package Layout
Figure 38. TPS61322 Layout
GND
VIN
NC
VOUT
TPS61322xA
VOUT
SW
GND
NC
Figure 40. TPS61322xA DBV Package Layout
22
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12 Device and Documentation Support
12.1 Device Support
12.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
12.1.2 Development Support
12.1.2.1 Custom Design With WEBENCH® Tools
Click here to create a custom design using the TPS61322 device with the WEBENCH® Power Designer.
1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements.
2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial.
3. Compare the generated design with other possible solutions from Texas Instruments.
The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time
pricing and component availability.
In most cases, these actions are available:
• Run electrical simulations to see important waveforms and circuit performance
• Run thermal simulations to understand board thermal performance
• Export customized schematic and layout into popular CAD formats
• Print PDF reports for the design, and share the design with colleagues
Get more information about WEBENCH tools at www.ti.com/WEBENCH.
12.2 Documentation Support
12.2.1 Related Documentation
For related documentation see the following:
TPS61322-BMC001 Evaluation Module User's Guide
12.3 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
12.4 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.5 Trademarks
E2E is a trademark of Texas Instruments.
WEBENCH is a registered trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
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12.6 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
12.7 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
24
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PACKAGE OPTION ADDENDUM
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12-Feb-2019
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TPS613221ADBVR
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
1N4L
TPS613221ADBVT
ACTIVE
SOT-23
DBV
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
1N4L
TPS613222ADBVR
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
1N5L
TPS613222ADBVT
ACTIVE
SOT-23
DBV
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
1N5L
TPS613223ADBVR
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
1NRL
TPS613223ADBVT
ACTIVE
SOT-23
DBV
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
1NRL
TPS613226ADBVR
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
1N6L
TPS613226ADBVT
ACTIVE
SOT-23
DBV
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
1N6L
TPS61322DBZR
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
1EME
TPS61322DBZT
ACTIVE
SOT-23
DBZ
3
250
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
1EME
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
(4)
12-Feb-2019
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Feb-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
TPS613221ADBVR
SOT-23
DBV
5
3000
180.0
8.4
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
3.2
3.2
1.4
4.0
8.0
Q3
TPS613221ADBVT
SOT-23
DBV
5
250
180.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
TPS613222ADBVR
SOT-23
DBV
5
3000
180.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
TPS613222ADBVT
SOT-23
DBV
5
250
180.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
TPS613223ADBVR
SOT-23
DBV
5
3000
180.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
TPS613223ADBVT
SOT-23
DBV
5
250
180.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
TPS613226ADBVR
SOT-23
DBV
5
3000
180.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
TPS613226ADBVT
SOT-23
DBV
5
250
180.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
TPS61322DBZR
SOT-23
DBZ
3
3000
178.0
9.0
3.15
2.77
1.22
4.0
8.0
Q3
TPS61322DBZT
SOT-23
DBZ
3
250
178.0
9.0
3.15
2.77
1.22
4.0
8.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Feb-2019
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPS613221ADBVR
SOT-23
DBV
5
3000
210.0
185.0
35.0
TPS613221ADBVT
SOT-23
DBV
5
250
210.0
185.0
35.0
TPS613222ADBVR
SOT-23
DBV
5
3000
210.0
185.0
35.0
TPS613222ADBVT
SOT-23
DBV
5
250
210.0
185.0
35.0
TPS613223ADBVR
SOT-23
DBV
5
3000
210.0
185.0
35.0
TPS613223ADBVT
SOT-23
DBV
5
250
210.0
185.0
35.0
TPS613226ADBVR
SOT-23
DBV
5
3000
210.0
185.0
35.0
TPS613226ADBVT
SOT-23
DBV
5
250
210.0
185.0
35.0
TPS61322DBZR
SOT-23
DBZ
3
3000
180.0
180.0
18.0
TPS61322DBZT
SOT-23
DBZ
3
250
180.0
180.0
18.0
Pack Materials-Page 2
4203227/C
PACKAGE OUTLINE
DBZ0003A
SOT-23 - 1.12 mm max height
SCALE 4.000
SMALL OUTLINE TRANSISTOR
C
2.64
2.10
1.4
1.2
PIN 1
INDEX AREA
1.12 MAX
B
A
0.1 C
1
0.95
3.04
2.80
1.9
3X
3
0.5
0.3
0.2
2
(0.95)
C A B
0.25
GAGE PLANE
0 -8 TYP
0.10
TYP
0.01
0.20
TYP
0.08
0.6
TYP
0.2
SEATING PLANE
4214838/C 04/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-236, except minimum foot length.
www.ti.com
EXAMPLE BOARD LAYOUT
DBZ0003A
SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR
PKG
3X (1.3)
1
3X (0.6)
SYMM
3
2X (0.95)
2
(R0.05) TYP
(2.1)
LAND PATTERN EXAMPLE
SCALE:15X
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4214838/C 04/2017
NOTES: (continued)
4. Publication IPC-7351 may have alternate designs.
5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DBZ0003A
SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR
PKG
3X (1.3)
1
3X (0.6)
SYMM
3
2X(0.95)
2
(R0.05) TYP
(2.1)
SOLDER PASTE EXAMPLE
BASED ON 0.125 THICK STENCIL
SCALE:15X
4214838/C 04/2017
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
www.ti.com
PACKAGE OUTLINE
DBV0005A
SOT-23 - 1.45 mm max height
SCALE 4.000
SMALL OUTLINE TRANSISTOR
C
3.0
2.6
1.75
1.45
PIN 1
INDEX AREA
1
0.1 C
B
A
5
2X 0.95
1.9
1.45
0.90
3.05
2.75
1.9
2
4
0.5
5X
0.3
0.2
3
(1.1)
C A B
0.15
TYP
0.00
0.25
GAGE PLANE
8
TYP
0
0.22
TYP
0.08
0.6
TYP
0.3
SEATING PLANE
4214839/E 09/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Refernce JEDEC MO-178.
4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
www.ti.com
EXAMPLE BOARD LAYOUT
DBV0005A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
5X (1.1)
1
5
5X (0.6)
SYMM
(1.9)
2
2X (0.95)
3
4
(R0.05) TYP
(2.6)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
EXPOSED METAL
EXPOSED METAL
0.07 MIN
ARROUND
0.07 MAX
ARROUND
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4214839/E 09/2019
NOTES: (continued)
5. Publication IPC-7351 may have alternate designs.
6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DBV0005A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
5X (1.1)
1
5
5X (0.6)
SYMM
(1.9)
2
2X(0.95)
4
3
(R0.05) TYP
(2.6)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
4214839/E 09/2019
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.
www.ti.com
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IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
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