Texas Instruments | TPS6280x 1.8-V to 5.5-V, 0.6A / 1-A, 2.3-µA IQ Step Down Converter 6-Pin, 0.35-mm Pitch WCSP Package (Rev. E) | Datasheet | Texas Instruments TPS6280x 1.8-V to 5.5-V, 0.6A / 1-A, 2.3-µA IQ Step Down Converter 6-Pin, 0.35-mm Pitch WCSP Package (Rev. E) Datasheet

Texas Instruments TPS6280x 1.8-V to 5.5-V, 0.6A / 1-A, 2.3-µA IQ Step Down Converter 6-Pin, 0.35-mm Pitch WCSP Package (Rev. E) Datasheet
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TPS62800, TPS62801, TPS62802, TPS62806, TPS62807, TPS62808
SLVSDD1E – DECEMBER 2017 – REVISED JANUARY 2019
TPS6280x 1.8-V to 5.5-V, 0.6A / 1-A, 2.3-µA IQ Step Down Converter
6-Pin, 0.35-mm Pitch WCSP Package
1 Features
3 Description
•
•
•
•
•
•
•
•
The TPS6280x device family is a step down
converter with 2.3-µA typical quiescent current
featuring highest efficiency and smallest solution size.
TI's DCS-Control™ topology enables the device to
operate with tiny inductors and capacitors with a
switching frequency up to 4MHz. At light load
conditions, it seamlessly enters Power Save Mode to
reduce switching cycles and maintain high efficiency.
1
•
•
•
•
•
•
•
•
Input Voltage Range from 1.8 V to 5.5 V
2.3-µA Operating Quiescent Current
Up to 4 MHz Switching Frequency
Output Current 0.6 A / 1 A
1% Output Voltage Accuracy
Selectable Power Save / Forced PWM Mode
R2D converter for flexible VOUT setting
16 Selectable + 1 Fixed Output Voltages
– TPS62800 (4 MHz): 0.4 V to 0.775 V
– TPS62801 (4 MHz): 0.8 V to 1.55 V
– TPS62802 (4 MHz): 1.8 V to 3.3 V
– TPS62806 (1.5 MHz): 0.4 V to 0.775 V
– TPS62807 (1.5 MHz): 0.8 V to 1.55 V
– TPS62808 (1.5 MHz): 1.8 V to 3.3 V
Smart Enable Pin
Optimized Pinout to Support 0201 Components
DCS-Control™ Topology
Output Discharge
100% Duty Cycle Operation
Tiny 6-pin, 0.35 mm Pitch WCSP package
Supports < 0.6 mm Solution Height
Supports < 5 mm2 Solution Size
Connecting the VSEL/MODE pin to GND selects a
fixed output voltage. With only one external resistor
connected to VSEL/MODE pin, 16 internally set
output voltages can be selected. An integrated R2D
(resistor to digital) converter reads out the external
resistor and sets the output voltage. The same device
part number can be used for different applications
and voltage rails just by changing a single resistor.
Furthermore, the internally set output voltage
provides better accuracy compared to a traditional
external resistor divider network. Once the device has
started up, the DC/DC converter enters Forced PWM
Mode by applying a high level at the VSEL/MODE
pin. In this operating mode, the device runs at a
typical 4-MHz or 1.5-MHz switching frequency,
enabling lowest output voltage ripple and highest
efficiency. The TPS6280x device series comes in a
tiny 6-pin WCSP package with 0.35-mm pitch.
Device Information(1)
PART NUMBER
2 Applications
•
•
•
Wearable Electronics, IoT Applications
2xAA Battery Powered Applications
Smart Phones
TPS6280x
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
sp
L=
0.47mH
1.2V VOUT fixed
COUT
10mF
Efficiency vs. IOUT at 1.2VOUT
95
90
85
80
Efficiency %
VIN
TPS62801
1.8V - 5.5V
VIN
SW
CIN
VOS
4.7mF
GND VSEL
/MODE
ON
OFF
EN
BODY SIZE (NOM)
1.05 mm × 0.70 mm x
0.4mm
DSBGA (6)
Typical Application
L=
16 selectable VOUT
VIN
TPS62801
0.47mH 0.8V - 1.55V
1.8V - 5.5V
VIN
SW
CIN
COUT
VOS
PWM
4.7mF
10mF
VSEL
GND
PFM
/MODE
ON
RVSEL
OFF
EN
PACKAGE
75
70
65
60
VIN = 1.8V
VIN = 2.5V
VIN = 3.3V
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
55
50
45
40
0.001
0.01
0.1
1
IOUT [mA ]
10
100
1000
SLVS
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. UNLESS OTHERWISE NOTED, this document contains PRODUCTION
DATA.
TPS62800, TPS62801, TPS62802, TPS62806, TPS62807, TPS62808
SLVSDD1E – DECEMBER 2017 – REVISED JANUARY 2019
www.ti.com
Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Device Comparison Table.....................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
3
5
7.1
7.2
7.3
7.4
7.5
7.6
5
5
5
6
6
8
Absolute Maximum Ratings .....................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Typical Characteristics ..............................................
Detailed Description ............................................ 10
8.1
8.2
8.3
8.4
Overview .................................................................
Functional Block Diagram .......................................
Feature Description.................................................
Device Functional Modes........................................
10
10
10
13
9
Application and Implementation ........................ 14
9.1 Application Information............................................ 14
9.2 Typical Application ................................................. 14
9.3 System Examples ................................................... 25
10 Power Supply Recommendations ..................... 27
11 Layout................................................................... 27
11.1 Layout Guidelines ................................................. 27
11.2 Layout Example .................................................... 27
12 Device and Documentation Support ................. 28
12.1
12.2
12.3
12.4
12.5
12.6
12.7
Device Support......................................................
Custom Design With WEBENCH® Tools .............
Related Links ........................................................
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
28
28
28
28
29
29
29
13 Mechanical, Packaging, and Orderable
Information ........................................................... 29
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision D (July 2018) to Revision E
•
Page
Added devices TPS62807 and TPS62808 throughout data sheet......................................................................................... 1
Changes from Revision C (June 2018) to Revision D
Page
•
Added device TPS62800 to the data sheet ........................................................................................................................... 1
•
Changed the ILIMF High side and Low side values in the Electrical Characteristics table ..................................................... 6
Changes from Revision B (May 2018) to Revision C
Page
•
Changed TPS62802 From: Advanced Information To: Production data ................................................................................ 1
•
Changed the YKA pinout image appearance ........................................................................................................................ 3
•
Added the Optimized Transient Performance from PWM to PFM Mode Operation section ............................................... 13
•
Added Figure 52 to Figure 56 .............................................................................................................................................. 22
•
Changed Figure 63 .............................................................................................................................................................. 27
Changes from Revision A (March 2018) to Revision B
•
Page
Added TPS62802 application curves. ................................................................................................................................. 17
Changes from Original (December 2017) to Revision A
•
2
Page
Production Data release ........................................................................................................................................................ 1
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SLVSDD1E – DECEMBER 2017 – REVISED JANUARY 2019
5 Device Comparison Table
Device
Function
VSEL/MODE
Fixed
VOUT
Selectable
Output
Voltages
with RVSEL
fSW
[MHz]
IOUT
[A]
Soft
Start tSS
Output
Discharge
TPS62800
VSEL + MODE
0.7V (VSEL / MODE = GND)
0.4V - 0.775V
in 25mV steps
4
1
125 µs
Yes
TPS62801
VSEL + MODE
1.20V (VSEL / MODE = GND)
0.8V - 1.55V
in 50mV steps
4
1
125 µs
Yes
TPS62802
VSEL + MODE
1.8V (VSEL / MODE = GND)
1.8V - 3.3V
in 100mV steps
4
1
400 µs
Yes
TPS62806
VSEL + MODE
0.7V (VSEL / MODE = GND)
0.4V - 0.775V
in 25mV steps
1.5
0.6
125 µs
Yes
TPS62807
VSEL + MODE
1.20V (VSEL / MODE = GND)
0.8V - 1.55V
in 50mV steps
1.5
0.6
125 µs
Yes
TPS62808
VSEL + MODE
1.8V (VSEL / MODE = GND)
1.8V - 3.3V
in 100mV steps
1.5
0.6
125 µs
Yes
6 Pin Configuration and Functions
YKA Package (Top View)
6-Pin DSBGA
1
2
A
GND
VOS
B
VIN
SW
C
VSEL/MODE
EN
Not to scale
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Pin Functions
PIN
I/O
DESCRIPTION
NAME
NO.
GND
A1
PWR
GND supply pin. Connect this pin close to the GND terminal of the input and output
capacitor.
VIN
B1
PWR
VIN power supply pin. Connect the input capacitor close to this pin for best noise and voltage
spike suppression. A ceramic capacitor is required.
VSEL/MODE
C1
IN
Connecting a resistor to GND selects a pre-defined output voltage. Once the device has
started up, the R2D converter is disabled and the pin operates as an input. Applying a high
level selects forced PWM mode operation and a low level power save mode operation.
VOS
A2
IN
Output voltage sense pin for the internal feedback divider network and regulation loop. This
pin also discharges VOUT by an internal MOSFET, when the converter is disabled. Connect
this pin directly to the output capacitor with a short trace.
SW
B2
OUT
The switch pin is connected to the internal MOSFET switches. Connect the inductor to this
terminal.
EN
C2
IN
A high level enables the devices, and a low level turns the device off. The pin features an
internal pulldown resistor, which is disabled once the device has started up.
Table 1. Output Voltage Setting (VSEL/MODE Pin)
Output voltage setting VOUT [V]
4
VSEL
TPS62800
TPS62806
TPS62801
TPS62807
TPS62802
TPS62808
RVSELResistance [kΩ], E96 Resistor Series,
1% Accuracy, Temperature Coefficient better or equal
than ±200 ppm/°C
0
0.700
1.2
1.8
Connected to GND (no resistor needed)
1
0.400
0.8
1.8
10.0
2
0.425
0.85
1.9
12.1
3
0.450
0.9
2.0
15.4
4
0.475
0.95
2.1
18.7
5
0.500
1.0
2.2
23.7
6
0.525
1.05
2.3
28.7
7
0.550
1.1
2.4
36.5
8
0.575
1.15
2.5
44.2
9
0.600
1.2
2.6
56.2
10
0.625
1.25
2.7
68.1
11
0.650
1.3
2.8
86.6
12
0.675
1.35
2.9
105.0
13
0.700
1.4
3.0
133.0
14
0.725
1.45
3.1
162.0
15
0.750
1.5
3.2
205.0
16
0.775
1.55
3.3
249.0 or larger
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SLVSDD1E – DECEMBER 2017 – REVISED JANUARY 2019
7 Specifications
7.1 Absolute Maximum Ratings (1)
MIN
MAX
UNIT
VIN
–0.3
6
V
SW
–0.3
VIN +0.3V
V
SW (AC), less than 10ns, while switching
–2.5
9
V
EN, VSEL/MODE
–0.3
6
V
VOS
–0.3
5
V
Operating junction temperature, TJ
–40
150
°C
Storage temperature, Tstg
–65
150
°C
Pin voltage (2)
(1)
(2)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
All voltage values are with respect to network ground terminal GND.
7.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
pins (1)
±2000
Charged device model (CDM), per JEDEC specification
JESD22-C101, all pins (2)
±500
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. The human body
model is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each pin.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
MIN NOM MAX
VIN
Supply voltage VIN
IOUT
Output current VIN >= 2.3V, TPS62800, TPS62801, TPS62802
IOUT
Output current VIN < 2.3V, TPS62800, TPS62801, TPS62802
IOUT
Output current TPS62806, TPS62807, TPS62808
L
Effective inductance TPS62800, TPS62801, TPS62802
COUT
Effective output capacitance, TPS62800, TPS62801, TPS62802
L
Effective inductance TPS62806, TPS62807, TPS62808
COUT
Effective output capacitance TPS62806, TPS62807, TPS62808
CIN
Effective input capacitance
CVSEL/
External parasitic capacitance at VSEL/MODE pin
1.8
0.33
V
1
A
0.7
A
0.6
A
0.82
µH
26
µF
1.0
1.2
µH
26
µF
3
0.5
5.5
0.47
2
0.7
UNIT
4.7
µF
30
pF
249
kΩ
MODE
Resistance range for external resistor at VSEL/MODE pin (E96 1% resistor values)
RVSEL
E96 resistor series temperature coefficient (TCR)
TJ
10
External resistor tolerance E96 series at VSEL/MODE pin
Operating junction temperature range
Copyright © 2017–2019, Texas Instruments Incorporated
1%
-200
+200
ppm/°
C
-40
125
°C
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7.4 Thermal Information
THERMAL METRIC (1)
YKA (DSBGA) 6
PINS
UNIT
RθJA
Junction-to-ambient thermal resistance
147.7
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
1.7
°C/W
RθJB
Junction-to-board thermal resistance
47.5
°C/W
ψJT
Junction-to-top characterization parameter
0.5
°C/W
ψJB
Junction-to-board characterization parameter
47.6
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
–
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
7.5 Electrical Characteristics
VIN = 3.6 V, TJ = –40°C to 125°C typical values are at TJ = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
4
UNIT
SUPPLY
Operating quiescent
current
(Power Save Mode)
EN = VIN, IOUT = 0µA, VOUT = 1.2 V
device not switching, TJ = -40°C to +85°C
2.3
EN = VIN, IOUT = 0µA, VOUT = 1.2 V, device switching
2.5
µA
Operating quiescent
current (PWM Mode)
EN = VIN, VSEL/MODE = VIN (after power up)
device switching, IOUT = 0mA, VOUT = 1.2V
8
mA
ISD
Shutdown current
EN = GND, shutdown current into VIN
VSEL/MODE = GND, TJ = -40°C to +85°C
120
250
nA
VTH_UVLO+
Undervoltage lockout
threshold
Rising VIN
1.65
1.8
V
Falling VIN
1.56
1.7
V
IQ
VTH_UVLO–
µA
INPUT EN
VIH
High level input voltage
TH
0.8
VIL TH
Low level input voltage
IIN
Input bias current
TJ = -40°C to +85°C, EN = high
RPD
Internal pulldown
resistance
EN = low
V
10
0.4
V
25
nA
500
kΩ
INPUT VSEL/MODE
VIH
High level input voltage
(digital input)
TH
0.8
VIL TH
Low level input voltage
(digital input)
IIN
Input bias current
EN = high
Leakage current into
SW pin
VSW = 1.2V, TJ = -40°C to +85°C
High side MOSFET
on-resistance
V
0.4
V
10
25
nA
10
25
nA
IOUT = 500 mA
120
170
mΩ
Low side MOSFET
on-resistance
IOUT = 500 mA
80
115
mΩ
ILIMF
High side MOSFET
switch current limit
TPS62806, TPS62807, TPS62808
0.95
1.1
1.2
A
ILIMF
Low side MOSFET
switch current limit
TPS62806, TPS62807, TPS62808
0.85
1
1.1
A
ILIMF
High side MOSFET
switch current limit
TPS62800, TPS62801
1.3
1.45
1.55
A
TPS62802
1.4
1.55
1.65
A
ILIMF
Low side MOSFET
switch current limit
TPS62800, TPS62801
1.2
1.35
1.45
A
TPS62802
1.3
1.45
1.55
A
7
11
Ω
100
400
nA
POWER SWITCHES
ILKG_SW
RDS(ON)
OUTPUT VOLTAGE DISCHARGE
RDSCH_VOS
MOSFET on-resistance
EN = GND, IVOS = –10 mA into VOS pin
TJ = -40°C to +85°C
IIN_VOS
Bias current into
VOS pin
EN = VIN, VOUT = 1.2 V (internal 12MΩ resistor divider),
TJ = -40°C to +85°C
6
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SLVSDD1E – DECEMBER 2017 – REVISED JANUARY 2019
Electrical Characteristics (continued)
VIN = 3.6 V, TJ = –40°C to 125°C typical values are at TJ = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
THERMAL PROTECTION
TSD
Thermal shutdown
temperature
Rising Junction Temperature, PWM mode
Thermal shutdown
hysteresis
160
°C
20
°C
OUTPUT
VOUT
Output voltage range
TPS62800, TPS62806, 25mV steps
0.4
0.775
V
VOUT
Output voltage range
TPS62801, TPS62807, 50mV steps
0.8
1.55
V
VOUT
Output voltage range
TPS62802, TPS62808, 100mV steps
1.8
3.3
V
VOUT
Output voltage
accuracy
Power Save Mode
VOUT
Output voltage
accuracy
PWM Mode IOUT = 0 mA, TJ = 25°C to +85°C
-1%
0%
1%
VOUT
Output voltage
accuracy
PWM Mode IOUT = 0 mA, TJ = -40°C to +125°C
-2%
0%
1.7%
fSW
Switching frequency
VIN = 3.6V, VOUT =1.2V, PWM operation
4
MHz
fSW
Switching frequency
TPS62806
VIN = 3.6V, VOUT = 0.7V, PWM operation
1.5
MHz
fSW
Switching frequency
TPS62807
VIN = 3.6V, VOUT = 1.2V, PWM operation
1.5
MHz
fSW
Switching frequency
TPS62808
VIN = 3.6V, VOUT = 1.8V, PWM operation
1.5
MHz
tStartup_delay
Regulator start up
delay time
From transition EN = low to high until device starts
switching, VSEL = 16
500
1100
µs
tSS
Soft start time
TPS62801, from VOUT = 0V to 0.95% of VOUT nominal
125
170
µs
tSS
Soft start time
TPS62800, TPS62806, TPS62807, TPS62808
from VOUT = 0V to 0.95% of VOUT nominal
125
210
µs
tSS
Soft start time
TPS62802, from VOUT = 0V to 0.95% of VOUT nominal
400
500
µs
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7.6 Typical Characteristics
0.5
5
TJ = -40°C
TJ = -10°C
TJ = 30°C
0.45
0.4
TJ = 85°C
TJ = 125°C
4.5
4
3.5
0.3
IQ [mA]
ISD [mA]
0.35
0.25
3
2.5
0.2
2
0.15
1.5
0.1
1
0.05
0.5
0
1.5
2
2.5
3
3.5
VIN [V]
4
4.5
5
TJ = -40°C
TJ = -10°C
TJ = 30°C
0
1.5
5.5
2
2.5
EN = GND
4.5
5
5.5
Figure 2. Quiescent Current IQ
TJ = -40°C
TJ = 25°C
TJ = 85°C
TJ = -40°C
TJ = 25°C
TJ = 85°C
100
IQ [mA]
IQ [mA]
4
1000
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
10
1
0.1
0
0.5
1
1.5
VIN falling
EN = VIN
2
2.5 3
VIN [V]
3.5
4
4.5
5
0
5.5
Device switching, no load, VOUT = 1.2V
VSEL/MODE = GND
0.5
1.5
2
2.5 3
VIN [V]
3.5
4
4.5
5
5.5
Device switching, no load, VOUT = 1.2V
VSEL/MODE = GND
Figure 4. Operating Quiescent Current IQ
200
TJ = -40°C
TJ = -10°C
TJ = 30°C
TJ = 85°C
TJ = 125°C
TJ = -40°C
TJ = -10°C
TJ = 30°C
TJ = 85°C
TJ = 125°C
175
150
RDS(ON) [mW]:
350
325
300
275
250
225
200
175
150
125
100
75
50
25
0
1.5
1
VIN rising
EN = VIN
Figure 3. Operating Quiescent Current IQ
RDS(ON) [mW]:
3.5
VIN [V]
Device not switching
Figure 1. Shutdown Current ISD
125
100
75
50
25
2
2.5
3
3.5
VIN [V]
4
4.5
5
5.5
Figure 5. High Side Switch Drain Source Resistance RDS(ON)
8
3
TJ = 85°C
TJ = 125°C
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0
1.5
2
2.5
3
3.5
VIN [V]
4
4.5
5
5.5
Figure 6. Low Side Switch Drain Source Resistance RDS(ON)
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SLVSDD1E – DECEMBER 2017 – REVISED JANUARY 2019
Typical Characteristics (continued)
20
TJ = -40°C
TJ = -10°C
TJ = 30°C
TJ = 85°C
TJ = 125°C
18
16
RDSCH_VOS [W]
14
12
10
8
6
4
2
0
1.5
2
2.5
3
3.5
VIN [V]
4
4.5
5
5.5
Figure 7. VOS Discharge Switch Drain Source Resistance RDSCH_VOS
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8 Detailed Description
8.1 Overview
The TPS6280x is a high frequency synchronous step down converter with ultra low quiescent current
consumption. Using TI's DCS-Control™ topology, the device extends the high efficiency operation area down to
microamperes of load current during Power Save Mode Operation. TI's DCS-Control™ (Direct Control with
Seamless Transition into Power Save Mode) is an advanced regulation topology, which combines the
advantages of hysteretic and voltage mode control. Characteristics of DCS-Control™ are excellent AC load
regulation and transient response, low output ripple voltage and a seamless transition between PFM and PWM
mode operation. DCS-Control™ includes an AC loop which senses the output voltage (VOS pin) and directly
feeds the information to a fast comparator stage. This comparator sets the switching frequency, which is constant
for steady state operating conditions, and provides immediate response to dynamic load changes. In order to
achieve accurate DC load regulation, a voltage feedback loop is used. The internally compensated regulation
network achieves fast and stable operation with small external components and low ESR capacitors.
8.2 Functional Block Diagram
EN
Smart Enable
Pulldown Control
500kW
Input Buffer
VOS
R2D converter
VSEL/
MODE
Resistor to
Digital
Converter
VFB
Internal
feedback
divider
network
VIN
DCS Control
VOS
Ultra Low Power
0.4V VREF
UVLO
TON
VOS Timer
VOS
Thermal Shutdown
UVLO
EN
VOUT
Discharge
Control Logic
Power Save /
Forced PWM
Mode operation
Current
Limit Comparator
Limit
High Side
Power Stage
VIN
PMOS
Ramp
Gate Driver
Direct Control
SW
Startup Delay
VFB
VREF
Error
amplifier
Main
Comparator
Softstart Timing
Limit
Low Side
NMOS
Current
Limit Comparator
GND
Figure 8. Functional Block Diagram
8.3 Feature Description
8.3.1 Smart Enable and Shutdown (EN)
An internal 500kΩ resistor pulls the EN pin to GND and avoids the pin to be floating. This prevents an
uncontrolled startup of the device in case the EN pin cannot be driven to low level safely. With EN low, the
device is in shutdown mode. The device is turned on with EN set to a high level. The pulldown control circuit
disconnects the pulldown resistor on the EN pin once the internal control logic and the reference have been
powered up. With EN set to a low level, the device enters shutdown mode and the pulldown resistor is activated
again.
10
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Feature Description (continued)
8.3.2 Softstart
Once the device has been enabled with EN high, it initializes and powers up its internal circuits. This occurs
during the regulator startup delay time tStartup_delay. Once tStartup_delay expires, the internal soft start circuitry ramps
up the output voltage within the Soft start time tss, see Figure 9.
The startup delay time tStartup_delay varies depending on the selected VSEL value. It is shortest with VSEL = 0 and
longest with VSEL = 16. See Figure 52 to Figure 56.
EN
Device starts switching
and ramps VOUT
VOUT
tStartup_delay
tSS
Figure 9. Device Startup
8.3.3 VSEL/MODE Pin
This pin has two functions, output voltage selection during startup of the converter and operating mode selection.
See also Device Comparison Table .
8.3.3.1 Output Voltage Selection (R2D Converter)
The output voltage is set with a single external resistor connected between the VSEL/MODE pin and GND. Once
the device has been enabled and the control logic as well as the internal reference have been powered up, a
R2D (resistor to digital) conversion is started to detect the external resistor RVSEL within the regulator startup
delay time tStartup_delay. An internal current source applies current through the external resistor and an internal
ADC reads back the resulting voltage level. Depending on the level, an internal feedback divider network is
selected to set the correct output voltage. Once this R2D conversion is finished, the current source is turned off
to avoid current flow through the external resistor.
After power up, the pin is configured as an input for Mode Selection. Therefore, the output voltage is set only
once. If the Mode selection function is used in combination with the VSEL function, ensure that there is no
additional current path or capacitance greater than 30pF total to GND, during R2D conversion. Otherwise the
additional current to GND is interpreted as a lower resistor value and a false output voltage will be set. Table 1
lists the correct resistor values for RVSEL to set the appropriate output voltages. The R2D converter is designed to
operate with resistor values out of the E96 table and requires 1% resistor value accuracy. The external resistor
RVSEL is not a part of the regulator feedback loop and has therefore no impact on the output voltage accuracy.
Ensure that there is no other leakage path than the RVSEL resistor at the VSEL/MODE pin during an undervoltage
lockout event. Otherwise a false output voltage will be set.
Connecting VSEL/MODE to GND selects a pre-defined output voltage (TPS62800 = 0.7 V, TPS62801 = 1.2 V,
TPS62802 = 1.8 V, TPS62806 = 0.7 V, TPS62807 = 1.2 V, TPS62808 = 1.8 V). In this case, no external resistor
is needed which enables a smaller solution size.
8.3.3.2 Mode Selection: Power Save Mode / Forced PWM Operation
A low level at this pin selects Power Save Mode operation, and a high level selects forced PWM operation. The
Mode can be changed during operation after the device has been powered up. The Mode selection function is
only available after the R2D converter has read out the external resistor.
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Feature Description (continued)
8.3.4 Undervoltage Lockout (UVLO)
To avoid misoperation of the device at low input voltages, an undervoltage lockout (UVLO) comparator monitors
the supply voltage. The UVLO comparator shuts down the device at an input voltage of 1.7V (max) with falling
VIN. The device starts at an input voltage of 1.8V (max) rising VIN. Once the device re-enters operation out of an
undervoltage lockout condition, it behaves like being enabled. The internal control logic is powered up and the
external resistor at the VSEL/MODE pin is read out.
8.3.5 Switch Current Limit / Short Circuit Protection
The TPS6280x integrates a current limit on the high side, as well on the low side MOSFETs to protect the device
against overload or short circuit conditions. The current in the switches is monitored cycle by cycle. If the high
side MOSFET current limit ILIMF trips, the high side MOSFET is turned off and the low side MOSFET is turned on
to ramp down the inductor current. Once the inductor current through the low side switch decreases below the
low side MOSFET current limit ILIMF, the low side MOSFET is turned off and the high side MOSFET turns on
again.
8.3.6 Thermal Shutdown
The junction temperature (TJ) of the device is monitored by an internal temperature sensor. If TJ exceeds the
thermal shutdown temperature TSD of 160°C (typ), the device enters thermal shutdown. Both the high side and
low side power FETs are turned off. When TJ decreases below the hysteresis amount of typically 20°C, the
converter resumes operation, beginning with a soft start to the originally set VOUT (there is no R2D conversion of
RVSEL). The thermal shutdown is not active in Power Save Mode.
8.3.7 Output Voltage Discharge
The purpose of the output discharge function is to ensure a defined down-ramp of the output voltage when the
device is disabled and to keep the output voltage close to 0 V. The output discharge feature is only active once
the device has been enabled at least once since the supply voltage was applied. The output discharge function is
not active if the device is disabled and the supply voltage is applied the first time.
The internal discharge resistor is connected to the VOS pin. The discharge function is enabled as soon as the
device is disabled. The minimum supply voltage required to keep the discharge function active is VIN > VTH_UVLO-.
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8.4 Device Functional Modes
8.4.1 Power Save Mode Operation
The DCS-Control™ topology supports Power Save Mode operation. At light loads the device operates in PFM
(Pulse Frequency Modulation) mode that generates a single switching pulse to ramp up the inductor current and
recharge the output capacitor, followed by a sleep period where most of the internal circuits are shutdown to
achieve lowest operating quiescent current. During this time, the load current is supported by the output
capacitor. The duration of the sleep period depends on the load current and the inductor peak current. During the
sleep periods, the current consumption is reduced to typically 2.3 µA. This low quiescent current consumption is
achieved by an ultra low power voltage reference, an integrated high impedance feedback divider network and
an optimized Power Save Mode operation.
In PFM Mode, the switching frequency varies linearly with the load current. At medium and high load conditions,
the device enters automatically PWM (Pulse Width Modulation) mode and operates in continuous conduction
mode with a nominal switch frequency fsw of typically 4MHz or 1.5MHz. The switching frequency in PWM mode is
controlled and depends on VIN and VOUT. The boundary between PWM and PFM mode is when the inductor
current becomes discontinuous.
If the load current decreases, the converter seamlessly enters PFM mode to maintain high efficiency down to
very light loads. Since DCS-Control™ supports both operation modes within one single building block, the
transition from PWM to PFM Mode is seamless with minimum output voltage ripple.
8.4.2 Forced PWM Mode Operation
After the device has powered up and ramped up VOUT, the VSEL/MODE pin acts as an input. With a high level
on VSEL/MODE pin, the device enters forced PWM Mode and operates with a constant switching frequency over
the entire load range, even at very light loads. This reduces or eliminates interference with RF and noise
sensitive circuits, but lowers efficiency at light loads.
8.4.3 100% Mode Operation
The duty cycle of the buck converter operating in PWM mode is given as D = VOUT/VIN. The duty cycle increases
as the input voltage comes close to the output voltage. In 100% duty cycle mode, it keeps the high side switch
on continuously. The high side switch stays turned on as long as the output voltage is below the internal set
point. This allows the conversion of small input to output voltage differences.
8.4.4 Optimized Transient Performance from PWM to PFM Mode Operation
For most converters, the load transient response in PWM mode is improved compared to PFM mode, since the
converter reacts faster on the load step and actively sinks energy on the load release. Compare figure Figure 43
and Figure 42. As an additional feature, the TPS6280x automatically enters PWM mode for 16 cycles after a
heavy load release in order to bring the output voltage back to the regulation level faster. After 16 cycles of PWM
mode, it automatically returns to PFM mode (if VSEL/MODE is driven low). See Figure 10. Without this
optimization, the output voltage overshoot would be higher and would look like the VOUT' trace. This feature is
only active once the load is high enough and the converter operates in PWM mode.
VOUT‘
VOUT
16 PWM
Cycles
PWM
Mode
PFM Mode
Figure 10. Optimized Transient Performance from PWM to PFM Mode
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The following section discusses the design of the external components to complete the power supply design for
several input and output voltage options by using typical applications as a reference.
9.2 Typical Application
VIN
TPS62801
1.8V - 5.5V
VIN
SW
CIN
VOS
4.7mF
GND VSEL
/MODE
ON
OFF
EN
L=
16 selectable VOUT
0.47mH 0.8V - 1.55V
PWM
PFM
RVSEL
COUT
10mF
Figure 11. TPS62801 Adjustable VOUT Application Circuit
Additional circuits are shown in the System Examples section.
9.2.1 Design Requirements
Table 2 shows the list of components for the application circuit and the characteristic application curves
Table 2. Components for Application Characteristic Curves
Description
TPS62801 / 2
Step down converter
CIN
Ceramic capacitor,
GRM155R60J475ME47D
4.7 µF
0402 (1mm x 0.5mm x 0.6mm max.)
Murata
COUT
Ceramic capacitor,
GRM155R60J106ME15D
10 µF
0402 (1mm x 0.5mm x 0.65mm max.)
Murata
L
Inductor DFE18SANR47MG0L
0.47 µH
0603 (1.6mm x 0.8mm x 1.0mm max.)
Murata
(1)
See Third-party Products Disclaimer
14
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Value
Size [L x W X T]
Manufacturer (1)
Reference
1.05mm x 0.70mm x 0.4mm max.
Texas Instruments
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SLVSDD1E – DECEMBER 2017 – REVISED JANUARY 2019
9.2.2 Detailed Design Procedure
9.2.2.1 Custom Design With WEBENCH® Tools
Click here to create a custom design using the TPS62800 device with the WEBENCH® Power Designer.
Click here to create a custom design using the TPS62801 device with the WEBENCH® Power Designer.
Click here to create a custom design using the TPS62802 device with the WEBENCH® Power Designer.
Click here to create a custom design using the TPS62806 device with the WEBENCH® Power Designer.
Click here to create a custom design using the TPS62807 device with the WEBENCH® Power Designer.
Click here to create a custom design using the TPS62808 device with the WEBENCH® Power Designer.
1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements.
2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial.
3. Compare the generated design with other possible solutions from Texas Instruments.
The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time
pricing and component availability.
In most cases, these actions are available:
• Run electrical simulations to see important waveforms and circuit performance
• Run thermal simulations to understand board thermal performance
• Export customized schematic and layout into popular CAD formats
• Print PDF reports for the design, and share the design with colleagues
Get more information about WEBENCH tools at www.ti.com/WEBENCH.
9.2.2.2 Inductor Selection
The inductor value affects the peak-to-peak ripple current, the PWM-to-PFM transition point, the output voltage
ripple and the efficiency. The selected inductor has to be rated for its DC resistance and saturation current. The
inductor ripple current (ΔIL) decreases with higher inductance and increases with higher VIN or VOUT and can be
estimated according to Equation 1.
Equation 2 calculates the maximum inductor current under static load conditions. The saturation current of the
inductor should be rated higher than the maximum inductor current, as calculated with Equation 2. This is
recommended because during a heavy load transient the inductor current rises above the calculated value. A
more conservative way is to select the inductor saturation current according to the high side MOSFET switch
current limit, ILIMF.
Vout
1Vin
D IL = Vout ´
L ´ ¦
(1)
ILmax = Ioutmax +
DIL
2
where
•
•
•
•
f = Switching Frequency
L = Inductor Value
ΔIL= Peak to Peak inductor ripple current
ILmax = Maximum Inductor current
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Table 3 shows a list of possible inductors.
Table 3. List of Possible Inductors (1)
INDUCTANCE [µH]
INDUCTOR SERIES
SIZE IMPERIAL
(METRIC)
0.47
DFE18SAN_G0
0603 (1608)
1.6mm x 0.8mm x 1.0mm max
Murata
0.47
HTEB16080F
0603 (1608)
1.6mm x 0.8mm x 0.6mm max.
Cyntec
0.47
HTET1005FE
0402 (1005)
1.0mm x 0.5mm x 0.65mm max.
Cyntec
0.47
TFM160808ALC
0603 (1608)
1.6mm x 0.8mm x 0.8mm max.
TDK
1.0
DFE201610E
0806 (201610)
2.0mm x 1.6mm x 1.0mm max
Murata
(1)
DIMENSIONS L x W X T
SUPPLIER (1)
See Third-party Products Disclaimer
9.2.2.3 Output Capacitor Selection
The DCS-Control™ scheme of the TPS6280x allows the use of tiny ceramic capacitors. Ceramic capacitors with
low ESR values have the lowest output voltage ripple and are recommended. The output capacitor requires
either an X7R or X5R dielectric. At light load currents, the converter operates in Power Save Mode and the
output voltage ripple is dependent on the output capacitor value. A larger output capacitors can be used reducing
the output voltage ripple.
The inductor and output capacitor together provide a low-pass filter. To simplify this process, Table 4 outlines
possible inductor and capacitor value combinations.
Table 4. Recommended LC Output Filter Combinations
(1)
(2)
(3)
Device
Nominal Inductor Value [µH]
TPS62800,
TPS62801
0.47 (1)
TPS62802
0.47 (1)
TPS62806,
TPS62807,
TPS62808
1.0 (3)
Nominal Output Capacitor Value [µF]
4.7µF
10µF
2 x 10µF
22µF
√
√ (2)
√
√
√ (2)
√
√
√ (2)
√
√
√
An effective inductance range of 0.33 µH to 0.82 µH is recommended. An effective capacitance range of 2 µF to 26µF is recommended.
Typical application configuration. Other check marks indicate alternative filter combinations.
An effective inductance range of 0.7 µH to 1.2 µH is recommended. An effective capacitance range of 3 µF to 26 µF is recommended.
9.2.2.4 Input Capacitor Selection
Because the buck converter has a pulsating input current, a low ESR ceramic input capacitor is required for best
input voltage filtering to minimize input voltage spikes. For most applications a 4.7-µF input capacitor is sufficient.
When operating from a high impedance source, like a coin cell, a larger input buffer capacitor ≥10uF is
recommended to avoid voltage drops during startup and load transients. The input capacitor can be increased
without any limit for better input voltage filtering. The leakage current of the input capacitor adds to the overall
current consumption.
Table 5 shows a selection of input and output capacitors.
Table 5. List of Possible Capacitors (1)
SUPPLIER (1)
CAPACITANCE [μF]
CAPACITOR PART NUMBER
SIZE IMPERIAL
(METRIC)
4.7
GRM155R60J475ME47D
0402 (1005)
1.0mm x 0.5mm x 0.6mm max.
Murata
4.7
GRM035R60J475ME15
0201 (0603)
0.6mm x 0.3mm x 0.55mm max
Murata
10
GRM155R60J106ME15D
0402 (1005)
1.0mm x 0.5mm x 0.65mm max.
Murata
(1)
See Third-party Products Disclaimer
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DIMENSIONS L x W X T
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9.2.3 Application Curves
85
80
75
70
65
60
55
50
45
40
35
30
25
20
0.01
VIN = 1.8V
VIN = 2.5V
VIN = 3.3V
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
0.1
1
TPS62800
10
IOUT [mA ]
100
1000
85
80
75
70
65
60
55
50
45
40
35
30
25
20
0.01
VIN = 1.8V
VIN = 2.5V
VIN = 3.3V
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
0.1
1
SLVS
RVSEL = 10 kΩ to GND
TPS62800
10
IOUT [mA ]
100
1000
SLVS
VSEL/MODE = GND
Figure 12. Efficiency Power Save Mode VOUT = 0.4 V
Figure 13. Efficiency Power Save Mode VOUT = 0.7 V
95
95
90
90
85
85
80
80
75
75
Efficiency %
Efficiency %
Efficiency %
Efficiency %
The conditions for the below application curves are VIN = 3.6 V, VOUT = 1.2 V and the components listed in
Table 2, unless otherwise noted.
70
65
60
VIN = 1.8V
VIN = 2.6V
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
55
50
45
40
0.001
0.01
0.1
TPS62801
1
IOUT [mA ]
10
100
70
65
60
VIN = 2.3V
VIN = 2.7V
VIN = 3.7V
VIN = 4.2V
VIN = 5.0V
55
50
45
40
0.001
1000
0.01
0.1
SLVS
RVSEL = 10 kΩ to GND
TPS62801
Figure 14. Efficiency Power Save Mode VOUT = 0.8 V
1
IOUT [mA]
10
100
1000
SLVS
RVSEL = 15.4 kΩ to GND
Figure 15. Efficiency Power Save Mode VOUT = 0.9 V
95
90
90
85
70
80
60
75
Efficiency %
Efficiency %
80
50
40
VIN = 1.8V
VIN = 2.5V
VIN = 3.3V
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
30
20
10
10
100
IOUT [mA ]
TPS62801
60
VIN = 1.8V
VIN = 2.5V
VIN = 3.3V
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
50
45
1000
40
0.001
0.01
SLVS
RVSEL = 56.2 kΩ,
VSEL/MODE pin = high after startup
Figure 16. Efficiency Forced PWM Mode VOUT = 1.2 V
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65
55
0
1
70
TPS62801
0.1
1
IOUT [mA ]
10
100
1000
SLVS
VSEL/MODE = GND
Figure 17. Efficiency Power Save Mode VOUT = 1.2 V
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90
100
85
95
80
90
75
85
Efficiency %
70
65
60
DFE18SAN_G0 R47 (1.6 x 1.6 x 1.0 mm)
HTEB16080F R47 (1.6 x 1.6 x 0.6 mm)
HTET1005FE R47 (1.0 x 0.5 x 0.65 mm)
TFM160808ALC R47 (1.6 x 1.6 x 0.8 mm)
55
50
80
75
70
65
60
VIN = 2.5V
VIN = 3.3V
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
55
45
50
45
40
0.01
0.1
TPS62801
1
10
IOUT [mA ]
100
1000
40
0.001
SLVS
Plot
0.01
VSEL/MODE = GND, VOUT = 1.2V
TPS62802
100
95
95
90
90
85
85
80
80
75
70
65
60
55
45
40
0.001
0.01
TPS62802
0.1
1
IOUT [mA ]
10
10
100
1000
SLVS
VSEL/MODE = GND
100
75
70
65
60
VIN = 1.8V
VIN = 2.5V
VIN = 3.3V
VIN = 3.8V
VIN = 4.5V
VIN = 5.0V
55
VIN = 3.6V
VIN = 3.8V
VIN = 4.2V
VIN = 5.0V
50
1
IOUT [mA ]
Figure 19. Efficiency Power Save Mode VOUT = 1.8 V
Efficiency %
Efficiency %
Figure 18. Inductor Comparison
0.1
50
45
40
0.01
1000
0.1
SLVS
3.3 V VOUT, VSEL/MODE = 249k
TPS62806
Figure 20. Efficiency Power Save Mode VOUT = 3.3 V
1
10
IOUT [mA ]
100
600
SLVS
VOUT = 0.7 V , VSEL/MODE = GND
L = 1 µH
DFE201610E
100
100
95
95
90
90
85
85
80
80
Efficiency [%]
Efficiency [%]
Figure 21. Efficiency Power Save Mode VOUT = 0.7 V
75
70
65
VIN=1.8V
VIN=2.7V
VIN=3.3V
VIN=3.6V
VIN=4.2V
VIN=4.8V
60
55
50
45
40
10P
100P
TPS62807
1m
10m
Load Current [A]
100m
65
VIN=2.1V
VIN=2.7V
VIN=3.3V
VIN=3.6V
VIN=4.2V
VIN=4.8V
60
50
45
40
10P
1
100P
Effi
VOUT = 1.2 V , VSEL/MODE = GND
L = 1 µH
DFE201610E
Submit Documentation Feedback
70
55
Figure 22. Efficiency Power Save Mode VOUT = 1.2 V
18
75
TPS62808
1m
10m
Load Current [A]
100m
1
Effi
VOUT = 1.8 V , VSEL/MODE = GND
L = 1 µH
DFE201610E
Figure 23. Efficiency Power Save Mode VOUT = 1.8 V
Copyright © 2017–2019, Texas Instruments Incorporated
Product Folder Links: TPS62800 TPS62801 TPS62802 TPS62806 TPS62807 TPS62808
TPS62800, TPS62801, TPS62802, TPS62806, TPS62807, TPS62808
www.ti.com
SLVSDD1E – DECEMBER 2017 – REVISED JANUARY 2019
1.248
1.248
TJ = -40°C
1.236
1.236
1.224
1.224
VOUT [V]
VOUT [V]
TJ = 25°C
1.212
1.200
1.188
1.212
1.200
1.188
VIN = 1.8V
VIN = 2.5V
VIN = 3.3V
1.176
1.164
0.01
0.1
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
1
TPS62801
VOUT = 1.2 V
10
IOUT [mA ]
VIN = 1.8V
VIN = 2.5V
VIN = 3.3V
1.176
100
1.164
0.01
1000
0.1
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
1
SLVS
VSEL/MODE = GND
PFM/PWM Mode
TJ = 25°C
TPS62801
VOUT = 1.2 V
10
IOUT [mA ]
100
1000
SLVS
VSEL/MODE = GND
PFM/PWM Mode
TJ = –40°C
Figure 25. Output Voltage vs. Output Current
Figure 24. Output Voltage vs. Output Current
1.248
1.212
TJ = 85°C
TJ = 25°C
1.236
VOUT [V]
VOUT [V]
1.224
1.212
1.200
1.200
1.188
VIN = 1.8V
VIN = 2.5V
VIN = 3.3V
1.176
1.164
0.01
0.1
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
1
TPS62801
VOUT = 1.2 V
10
IOUT [mA ]
VIN = 1.8V
VIN = 2.5V
VIN = 3.3V
100
1.188
0.01
1000
1
SLVS
VSEL/MODE = GND
PFM/PWM Mode
TJ = 85°C
TPS62801
VOUT = 1.2 V
Figure 26. Output Voltage vs. Output Current
10
IOUT [mA ]
100
1000
SLVS
VSEL/MODE = high after startup
Forced PWM Mode
TJ = 25°C
Figure 27. Output Voltage vs. Output Current
1.212
1.212
TJ = 85°C
VOUT [V]
TJ = -40°C
VOUT [V]
0.1
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
1.200
VIN = 1.8V
VIN = 2.5V
VIN = 3.3V
1.188
0.01
0.1
TPS62801
VOUT = 1.2 V
VIN = 1.8V
VIN = 2.5V
VIN = 3.3V
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
1
10
IOUT [mA ]
1.200
1.188
0.01
100
0.1
1000
SLVS
VSEL/MODE = high after startup
Forced PWM Mode
TJ = –40°C
TPS62801
VOUT = 1.2 V
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
1
10
IOUT [mA ]
100
1000
SLVS
VSEL/MODE = high after startup
Forced PWM Mode
TJ = 85°C
Figure 29. Output Voltage vs. Output Current
Figure 28. Output Voltage vs. Output Current
Copyright © 2017–2019, Texas Instruments Incorporated
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5000
100
4500
90
4000
80
Switching Frequency [kHz]
Switching Frequency [kHz]
SLVSDD1E – DECEMBER 2017 – REVISED JANUARY 2019
3500
3000
2500
2000
VIN = 1.8V
VIN = 2.5V
VIN = 3.3V
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
1500
1000
500
70
60
50
40
20
10
0
0
0
100
200
TPS62801
VOUT = 1.2 V
300
400 500 600
IOUT [mA]
700
800
0
900 1000
VSEL/MODE = GND
PFM/PWM Mode
TJ = 25°C
4500
4000
Switching Frequency [kHz]
4000
3500
3000
2500
2000
VIN = 1.8V
VIN = 2.5V
VIN = 3.3V
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
1500
1000
500
TPS62801
VOUT = 1.2 V
300
400 500 600
IOUT [mA]
4
700
800
5
6
IOUT [mA]
7
900 1000
SLVS
VSEL/MODE = high after startup
Forced PWM Mode
TJ = 25°C
Figure 32. Switching Frequency vs. Output Current
8
9
10
SLVS
VSEL/MODE = GND
PFM/PWM Mode
TJ = 25°C
3500
3000
2500
2000
1500
VIN = 1.8V
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
1000
500
0
200
3
Figure 31. Switching Frequency (zoom in)
4500
100
2
TPS62801
VOUT = 1.2 V
5000
0
1
SLVS
Figure 30. Switching Frequency vs. Output Current
Switching Frequency [kHz]
VIN = 1.8V
VIN = 2.5V
VIN = 3.3V
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
30
0
0
100
200
TPS62801
VOUT = 0.8 V
300
400 500 600
IOUT [mA]
700
800
900 1000
SLVS
VSEL/MODE = 10 kΩ to GND
PFM/PWM Mode
TJ = 25°C
Figure 33. Switching Frequency vs. Output Current
2000
Switching Frequency [kHz]
1800
1600
1400
1200
1000
800
VIN = 1.8V
VIN = 2.5V
VIN = 3.3V
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
600
400
200
0
0
60
120
TPS62806
VOUT = 0.7 V
180
240 300 360
IOUT [mA]
420
VSEL/MODE = GND
PFM/PWM Mode
480
540
600
SLVS
L = 1µH
TJ = 25°C
Figure 34. Switching Frequency vs. Output Current
20
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TPS62801
VOUT = 1.2 V
IOUT = 25 µA
VSEL/MODE = GND
PFM Mode
Figure 35. Typical Operation Power Save Mode
Copyright © 2017–2019, Texas Instruments Incorporated
Product Folder Links: TPS62800 TPS62801 TPS62802 TPS62806 TPS62807 TPS62808
TPS62800, TPS62801, TPS62802, TPS62806, TPS62807, TPS62808
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SLVSDD1E – DECEMBER 2017 – REVISED JANUARY 2019
TPS62801
VOUT = 1.2 V
IOUT = 10 mA
VSEL/MODE = GND
PFM Mode
Figure 36. Typical Operation Power Save Mode
TPS62806
VOUT = 0.7 V
VIN = 3.8 V
IOUT = 0 mA
VSEL/MODE = VIN
(after startup)
PFM Mode, L = 1µH
DFE201610E
Figure 38. TPS62806 typical forced PWM mode operation
(1.5MHz)
TPS62801
Forced PWM Mode
VOUT = 1.2 V
IOUT = 0 mA
VSEL/MODE = VIN (after startup)
Figure 40. Typical Operation Forced PWM Mode
Copyright © 2017–2019, Texas Instruments Incorporated
TPS62806
VIN = 3.8 V
VOUT = 0.7 V
IOUT = 10 mA
VSEL/MODE = GND
PFM Mode, L = 1µH
DFE201610E
Figure 37. TPS62806 Typical operation Power Save Mode
TPS62801
VOUT = 1.2 V
IOUT = 500 mA
VSEL/MODE = GND
PWM Mode
Figure 39. Typical Operation PWM Mode
TPS62801
rise / fall time < 1 µs
VOUT = 1.2 V
VSEL/MODE = GND
IOUT = 0 mA to 50 mA, PFM Mode
Figure 41. Load Transient Power Save Mode
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21
TPS62800, TPS62801, TPS62802, TPS62806, TPS62807, TPS62808
SLVSDD1E – DECEMBER 2017 – REVISED JANUARY 2019
TPS62801
VOUT = 1.2 V
rise / fall time < 1 µs
VSEL/MODE = GND
PFM / PWM Mode
IOUT = 5 mA to 500 mA
Figure 42. Load Transient Power Save Mode
TPS62801
VOUT = 1.2 V
IOUT = 1 mA to 1 A 1 kHz
VSEL/MODE = GND
PFM/PWM Mode
Figure 44. AC Load Sweep Power Save Mode
TPS62801
VOUT = 1.2 V
rise / fall time = 10 µs
VIN = 3.6 V to 4.2 V
IOUT = 50 mA
Figure 46. Line Transient PFM Mode
22
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TPS62801
VOUT = 1.2 V
rise / fall time < 1 µs
Forced PWM Mode
VSEL/MODE = VIN
(after startup)
IOUT = 5 mA to 500 mA
Figure 43. Load Transient Forced PWM Mode
TPS62801
VOUT = 1.2 V
IOUT = 1 mA to 1 A, 1 kHz
VSEL/MODE = VIN
(after startup)
Forced PWM Mode
Figure 45. AC Load Sweep Forced PWM Mode
TPS62801
VOUT = 1.2 V
rise / fall time = 10 µs
VIN = 3.6 V to 4.2 V
IOUT = 500 mA
Figure 47. Line Transient PWM Mode
Copyright © 2017–2019, Texas Instruments Incorporated
Product Folder Links: TPS62800 TPS62801 TPS62802 TPS62806 TPS62807 TPS62808
TPS62800, TPS62801, TPS62802, TPS62806, TPS62807, TPS62808
www.ti.com
SLVSDD1E – DECEMBER 2017 – REVISED JANUARY 2019
TPS62801
VOUT = 0.8 V
RVSEL = 10 kΩ
VSEL/MODE = Low
(via RVSEL)
RLoad = 220 Ω
TPS62801
Figure 48. Startup VOUT = 0.8 V
TPS62801
VOUT = 1.55 V
RVSEL = 249 kΩ
VSEL/MODE = Low
(via RVSEL)
RLoad = 220 Ω
Figure 50. Startup VOUT = 1.55 V
tStartup_delay = 290ms
VOUT = 1.2 V
VSEL/MODE = GND
RLoad = 220 Ω
Figure 49. Startup VOUT = 1.2 V
TPS62801
VOUT = 1.2 V
EN = high to low
VSEL/MODE = VIN
No Load
Figure 51. Output Discharge
tStartup_delay = 300ms
VSEL/MODE = GND
Figure 52. Startup Delay Time, VSEL = 0
Copyright © 2017–2019, Texas Instruments Incorporated
RVSEL = 10kΩ
Figure 53. Startup Delay Time, VSEL = 1
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SLVSDD1E – DECEMBER 2017 – REVISED JANUARY 2019
www.ti.com
tStartup_delay = 427ms
tStartup_delay = 363ms
RVSEL = 36.5kΩ
Figure 54. Startup Delay Time, VSEL = 7
RVSEL = 44.2kΩ
Figure 55. Startup Delay Time, VSEL = 8
tStartup_delay = 500ms
RVSEL = 249kΩ
Figure 56. Startup Delay Time, VSEL = 16
24
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TPS62800, TPS62801, TPS62802, TPS62806, TPS62807, TPS62808
www.ti.com
SLVSDD1E – DECEMBER 2017 – REVISED JANUARY 2019
9.3 System Examples
This section shows additional circuits for various output voltages.
VIN
TPS62801
1.8V - 5.5V
VIN
SW
CIN
VOS
4.7mF
VSEL
GND
/MODE
ON
OFF
EN
L=
0.47mH
1.2V fixed
COUT
10mF
Copyright © 2017, Texas Instruments Incorporated
Figure 57. TPS62801 VSEL Connected to GND for 1.2V Fixed VOUT
VIN
TPS62801
1.8V - 5.5V
VIN
SW
CIN
VOS
4.7mF
GND VSEL
/MODE
ON
OFF
EN
L=
16 selectable VOUT
0.47mH 0.8V - 1.55V
COUT
10mF
PWM
PFM
RVSEL
Figure 58. TPS62801 Adjustable VOUT Application Circuit
VIN
TPS62802
up to 5.5V
VIN
SW
CIN
VOS
4.7mF
GND VSEL
/MODE
ON
OFF
EN
L=
0.47mH
VOUT = 3.3V
COUT =
2 x 10mF
PWM
PFM
RVSEL = 249K
Figure 59. TPS62802 Adjustable 3.3V VOUT Application Circuit
VIN
TPS62802
1.8V - 5.5V
VIN
SW
CIN
VOS
4.7mF
GND VSEL
/MODE
ON
OFF
EN
L=
0.47mH
1.8V fixed
COUT
10mF
Copyright © 2017, Texas Instruments Incorporated
Figure 60. TPS62802 VSEL Connected to GND for 1.8V Fixed VOUT
Copyright © 2017–2019, Texas Instruments Incorporated
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TPS62800, TPS62801, TPS62802, TPS62806, TPS62807, TPS62808
SLVSDD1E – DECEMBER 2017 – REVISED JANUARY 2019
www.ti.com
System Examples (continued)
VIN
TPS62806
1.8V - 5.5V
VIN
SW
CIN
VOS
4.7mF
GND VSEL
/Mode
ON
OFF
EN
L=
1mH
PWM
PSM
RVSEL
16 selectable VOUT
0.4V - 0.775V
IOUT up to 600mA
COUT
10mF
Figure 61. TPS62806 Adjustable VOUT Application Circuit
VIN
TPS62806
1.8V - 5.5V
VIN
SW
CIN
VOS
4.7mF
GND VSEL
/Mode
ON
OFF
L=
1mH
0.7V fixed VOUT
IOUT up to 600mA
COUT
10mF
EN
Figure 62. TPS62806 VSEL Connected to GND for 0.7V Fixed VOUT
26
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TPS62800, TPS62801, TPS62802, TPS62806, TPS62807, TPS62808
www.ti.com
SLVSDD1E – DECEMBER 2017 – REVISED JANUARY 2019
10 Power Supply Recommendations
The power supply must provide a current rating according to the supply voltage, output voltage and output
current of the TPS6280x.
11 Layout
11.1 Layout Guidelines
The pinout of TPS6280x has been optimized to enable a single top layer PCB routing of the IC and its critical
passive components such as CIN, COUT and L. Furthermore, this pin out allows to connect tiny components such
as 0201 (0603) size capacitors and 0402 (1005) size inductor. A solution size smaller than 5mm2 can be
achieved with a fixed output voltage.
• As for all switching power supplies, the layout is an important step in the design. Care must be taken in board
layout to get the specified performance.
• It is critical to provide a low inductance, low impedance ground path. Therefore, use wide and short traces for
the main current paths.
• The input capacitor should be placed as close as possible to the IC's VIN and GND pins. This is the most
critical component placement.
• The VOS line is a sensitive, high impedance line and should be connected to the output capacitor and routed
away from noisy components and traces (e.g. SW line) or other noise sources.
11.2 Layout Example
VOUT
GND
COUT
CIN
GND
VOS
VIN
SW
VSEL/
MODE
EN
L
RVSEL
VIN
GND
Figure 63. PCB Layout Example
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27
TPS62800, TPS62801, TPS62802, TPS62806, TPS62807, TPS62808
SLVSDD1E – DECEMBER 2017 – REVISED JANUARY 2019
www.ti.com
12 Device and Documentation Support
12.1 Device Support
12.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
12.2 Custom Design With WEBENCH® Tools
Click here to create a custom design using the TPS62800 device with the WEBENCH® Power Designer.
Click here to create a custom design using the TPS62801 device with the WEBENCH® Power Designer.
Click here to create a custom design using the TPS62802 device with the WEBENCH® Power Designer.
Click here to create a custom design using the TPS62806 device with the WEBENCH® Power Designer.
1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements.
2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial.
3. Compare the generated design with other possible solutions from Texas Instruments.
The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time
pricing and component availability.
In most cases, these actions are available:
• Run electrical simulations to see important waveforms and circuit performance
• Run thermal simulations to understand board thermal performance
• Export customized schematic and layout into popular CAD formats
• Print PDF reports for the design, and share the design with colleagues
Get more information about WEBENCH tools at www.ti.com/WEBENCH.
12.3 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to order now.
Table 6. Related Links
PARTS
PRODUCT FOLDER
ORDER NOW
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
TPS62800
Click here
Click here
Click here
Click here
Click here
TPS62801
Click here
Click here
Click here
Click here
Click here
TPS62802
Click here
Click here
Click here
Click here
Click here
TPS62806
Click here
Click here
Click here
Click here
Click here
TPS62807
Click here
Click here
Click here
Click here
Click here
TPS62808
Click here
Click here
Click here
Click here
Click here
12.4 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
28
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Copyright © 2017–2019, Texas Instruments Incorporated
Product Folder Links: TPS62800 TPS62801 TPS62802 TPS62806 TPS62807 TPS62808
TPS62800, TPS62801, TPS62802, TPS62806, TPS62807, TPS62808
www.ti.com
SLVSDD1E – DECEMBER 2017 – REVISED JANUARY 2019
Community Resources (continued)
contact information for technical support.
12.5 Trademarks
DCS-Control, E2E are trademarks of Texas Instruments.
Topology is a trademark of others.
All other trademarks are the property of their respective owners.
12.6 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.7 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2017–2019, Texas Instruments Incorporated
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29
PACKAGE OPTION ADDENDUM
www.ti.com
20-Jul-2019
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TPS62800YKAR
ACTIVE
DSBGA
YKA
6
3000
Green (RoHS
& no Sb/Br)
SAC396
Level-1-260C-UNLIM
-40 to 125
-
TPS62800YKAT
ACTIVE
DSBGA
YKA
6
250
Green (RoHS
& no Sb/Br)
SAC396
Level-1-260C-UNLIM
-40 to 125
-
TPS62801YKAR
ACTIVE
DSBGA
YKA
6
3000
Green (RoHS
& no Sb/Br)
SAC396
Level-1-260C-UNLIM
-40 to 125
+
TPS62801YKAT
ACTIVE
DSBGA
YKA
6
250
Green (RoHS
& no Sb/Br)
SAC396
Level-1-260C-UNLIM
-40 to 125
+
TPS62802YKAR
ACTIVE
DSBGA
YKA
6
3000
Green (RoHS
& no Sb/Br)
SAC396
Level-1-260C-UNLIM
-40 to 125
X
TPS62802YKAT
ACTIVE
DSBGA
YKA
6
250
Green (RoHS
& no Sb/Br)
SAC396
Level-1-260C-UNLIM
-40 to 125
X
TPS62806YKAR
ACTIVE
DSBGA
YKA
6
3000
Green (RoHS
& no Sb/Br)
SAC396
Level-1-260C-UNLIM
-40 to 125
J
TPS62806YKAT
ACTIVE
DSBGA
YKA
6
250
Green (RoHS
& no Sb/Br)
SAC396
Level-1-260C-UNLIM
-40 to 125
J
TPS62807YKAR
ACTIVE
DSBGA
YKA
6
3000
Green (RoHS
& no Sb/Br)
SAC396
Level-1-260C-UNLIM
-40 to 125
L
TPS62807YKAT
ACTIVE
DSBGA
YKA
6
250
Green (RoHS
& no Sb/Br)
SAC396
Level-1-260C-UNLIM
-40 to 125
L
TPS62808YKAR
ACTIVE
DSBGA
YKA
6
3000
Green (RoHS
& no Sb/Br)
SAC396
Level-1-260C-UNLIM
-40 to 125
V
TPS62808YKAT
ACTIVE
DSBGA
YKA
6
250
Green (RoHS
& no Sb/Br)
SAC396
Level-1-260C-UNLIM
-40 to 125
V
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
20-Jul-2019
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Jul-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
TPS62800YKAR
DSBGA
YKA
6
3000
178.0
8.4
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
0.81
1.16
0.46
4.0
8.0
Q1
TPS62800YKAT
DSBGA
YKA
6
250
178.0
8.4
0.81
1.16
0.46
4.0
8.0
Q1
TPS62801YKAR
DSBGA
YKA
6
3000
178.0
8.4
0.81
1.16
0.46
4.0
8.0
Q1
TPS62801YKAT
DSBGA
YKA
6
250
178.0
8.4
0.81
1.16
0.46
4.0
8.0
Q1
TPS62802YKAR
DSBGA
YKA
6
3000
178.0
8.4
0.81
1.16
0.46
4.0
8.0
Q1
TPS62806YKAR
DSBGA
YKA
6
3000
178.0
8.4
0.81
1.16
0.46
4.0
8.0
Q1
TPS62806YKAT
DSBGA
YKA
6
250
178.0
8.4
0.81
1.16
0.46
4.0
8.0
Q1
TPS62807YKAR
DSBGA
YKA
6
3000
178.0
8.4
0.81
1.16
0.46
4.0
8.0
Q1
TPS62807YKAT
DSBGA
YKA
6
250
178.0
8.4
0.81
1.16
0.46
4.0
8.0
Q1
TPS62808YKAR
DSBGA
YKA
6
3000
178.0
8.4
0.81
1.16
0.46
4.0
8.0
Q1
TPS62808YKAT
DSBGA
YKA
6
250
178.0
8.4
0.81
1.16
0.46
4.0
8.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Jul-2019
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPS62800YKAR
DSBGA
YKA
6
3000
220.0
220.0
35.0
TPS62800YKAT
DSBGA
YKA
6
250
220.0
220.0
35.0
TPS62801YKAR
DSBGA
YKA
6
3000
220.0
220.0
35.0
TPS62801YKAT
DSBGA
YKA
6
250
220.0
220.0
35.0
TPS62802YKAR
DSBGA
YKA
6
3000
220.0
220.0
35.0
TPS62806YKAR
DSBGA
YKA
6
3000
220.0
220.0
35.0
TPS62806YKAT
DSBGA
YKA
6
250
220.0
220.0
35.0
TPS62807YKAR
DSBGA
YKA
6
3000
220.0
220.0
35.0
TPS62807YKAT
DSBGA
YKA
6
250
220.0
220.0
35.0
TPS62808YKAR
DSBGA
YKA
6
3000
220.0
220.0
35.0
TPS62808YKAT
DSBGA
YKA
6
250
220.0
220.0
35.0
Pack Materials-Page 2
PACKAGE OUTLINE
YKA0006
DSBGA - 0.4 mm max height
SCALE 12.000
DIE SIZE BALL GRID ARRAY
B
A
E
BALL A1
INDEX AREA
D
0.4 MAX
C
SEATING PLANE
0.18
0.13
BALL
TYP
0.05 C
0.35 TYP
C
0.7
TYP
SYMM
D: Max = 1.084 mm, Min =1.024 mm
B
0.35
TYP
E: Max = 0.734 mm, Min =0.674 mm
A
0.24
0.19
0.015
C A B
6X
2
1
SYMM
4223607/A 03/2017
NanoFree Is a trademark of Texas Instruments.
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
TM
3. NanoFree package configuration.
www.ti.com
EXAMPLE BOARD LAYOUT
YKA0006
DSBGA - 0.4 mm max height
DIE SIZE BALL GRID ARRAY
(0.35) TYP
6X ( 0.2)
1
2
A
(0.35) TYP
SYMM
B
C
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:50X
( 0.2)
METAL
SOLDER MASK
OPENING
0.0325 MAX
EXSPOSED
METAL
METAL
UNDER
SOLDER MASK
0.0325 MIN
EXPOSED
METAL
NON-SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
( 0.2)
SOLDER MASK
OPENING
SOLDER MASK DETAILS
NOT TO SCALE
4223607/A 03/2017
NOTES: (continued)
4. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For more information, see Texas Instruments literature number SNVA009 (www.ti.com/lit/snva009).
www.ti.com
EXAMPLE STENCIL DESIGN
YKA0006
DSBGA - 0.4 mm max height
DIE SIZE BALL GRID ARRAY
(0.35) TYP
(R0.05) TYP
6X ( 0.21)
2
1
A
(0.35) TYP
SYMM
B
METAL
TYP
C
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.075 mm - 0.1 mm THICK STENCIL
SCALE:50X
4223607/A 03/2017
NOTES: (continued)
5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
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DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
permission to use these resources only for development of an application that uses the TI products described in the resource. Other
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warranties or warranty disclaimers for TI products.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2019, Texas Instruments Incorporated
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