Texas Instruments | TPS65313-Q1 Wide-VIN Power-Management IC for Automotive Applications (Rev. A) | Datasheet | Texas Instruments TPS65313-Q1 Wide-VIN Power-Management IC for Automotive Applications (Rev. A) Datasheet

Texas Instruments TPS65313-Q1 Wide-VIN Power-Management IC for Automotive Applications (Rev. A) Datasheet
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TPS65313-Q1
SLDS252A – FEBRUARY 2018 – REVISED SEPTEMBER 2018
TPS65313-Q1 Wide-VIN Power-Management IC for Automotive Applications
1 Device Overview
1.1
Features
1
• AEC-Q100 Qualified for Automotive Applications:
– Device Temperature Grade 1: –40°C to +125°C,
TA
• Synchronous Buck Preregulator (BUCK1)
– Input Voltage Range from 4 V to 36 V
– Output Currents up to 3.1 A
– Factory-Selectable Output Voltage of 3.3 V or
3.6V
• Synchronous Buck Regulator (BUCK2)
– Fixed Input Voltage of 3.3 V or 3.6V
– Output Currents up to 2 A
– Factory-Selectable Output Voltage of 1.2 V,
1.25 V, 1.8 V, or 2.3 V
• Synchronous Boost Converter (BOOST)
– Fixed Input Voltage of 3.3 V or 3.6V
– Output Currents up to 600 mA
– Output Voltage of 5 V
• Phase-Locked Loop (PLL)
– Output Frequency Around 2.2 MHz.
– Supports Modulated or Unmodulated External
1.2
•
•
•
•
•
•
•
•
•
Applications
Automotive Radar and Camera Applications
Automotive Sensor Fusion Applications
1.3
•
Clock at SYNC_IN Pin
For All Regulators
– Soft-Start Feature
– Independent Voltage monitoring With
Diagnostics
– Overcurrent, Overload, Overvoltage,
Undervoltage, and Thermal Protection
– Internal Loop Compensation
Integrated Adaptively Randomized Spread
Spectrum (ARSS) modulation for regulator
switching clock
3-µA Quiescent Current in the OFF State
SPI for Control and Diagnostics
Two General-Purpose External-Voltage Monitors
Integrated Q&A Watchdog and Reset Supervisor
for MCU or DSP
Supports System-Level Functional Safety
Requirements up to ASIL-C (ISO 26262) / SIL-2
(IEC 61508)
Thermally Enhanced 40-Pin VQFNP Package With
0.5-mm Pitch
•
•
Industrial Radar Applications
Building and Factory Automation Applications
Description
The TPS65313-Q1 device is a power management IC (PMIC), meeting the requirements of MCUcontrolled or DSP-controlled automotive and industrial, machinery, or transportation systems. With the
integration of commonly used features, the device helps reduce board space and system cost.
The device includes one wide-VIN synchronous buck regulator (BUCK1) combined with one low-voltage
(LV) buck regulator (BUCK2) and one boost converter (BOOST) that are powered from the wide-VIN buck
regulator (BUCK1). The device features a low quiescent current in the OFF state to reduce current
consumption in case the system is permanently connected to the supply. All outputs are protected against
overvoltage, overload, and overtemperature conditions.
All regulated supply outputs with independent monitoring and protection functions can support up to
ASIL-C / SIL-2 system-level functional safety requirements, including mandatory and programmable
diagnostics (analog and logic built-in-self-test) to prevent latent faults. The device also integrates a
programmable supervisor, watchdog functions, and a MCU or DSP error pin monitor.
Device Information (1)
PART NUMBER
(1)
PACKAGE
BODY SIZE (NOM)
VQFNP (40)
6.00 mm × 6.00 mm
For all available packages, see the orderable addendum at the end of the data sheet.
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS65313-Q1
SLDS252A – FEBRUARY 2018 – REVISED SEPTEMBER 2018
1.3.1
www.ti.com
Functional Block Diagram
MCU_ERR
ENDRV/nIRQ
VBUCK1
VIO
NRES
WAKE
EXTSUP
VIN_SAFE
AVIN
VBAT
MCU Error
Signal Monitor
UV/OV
Monitor
Enable and
Interrupt
BG2
DVDD
UV/OV
Monitor
VREG
RESET
Supervisor
Wake-Up
Circuit
Loop Controller
SPI
SDI
SYNC_IN
VSENSE1
Voltage
Monitoring
Synchronous Buck Converter
BUCK2
(Low Voltage)
PLL
VBUCK1
Synchronous Boost Converter
BOOST
(Low Voltage)
PH3
VSENSE3
Voltage
Monitoring
Loop Controller
PGND3
VSUP2
Programmable
Voltage
Monitoring
VBUCK1
BOOT2
PH2
Loop Controller
BOOT3
VBUCK1
PGND1
PGND1A
(SYNC_OUT observed
through DIAG_OUT pin)
VBOOST
BOOT1
PH1
SCK
VBOOST
VIN
Digital
Core
NCS
DIAG_OUT
VREG
±
Synchronous Buck Converter
BUCK1
(High Voltage)
Q&A
Window
Watchdog
SDO
+ 5.8 V
VEXTSUP-TH
BG1
VBUCK2
PGND2
VSENSE2
Voltage
Monitoring
Voltage
Monitoring
Voltage
Monitoring
EXT_VSENSE1
EXT_VSENSE2
AGND
DGND
PBKG
Figure 1-1. Device Functional Block Diagram
2
Device Overview
Copyright © 2018, Texas Instruments Incorporated
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Product Folder Links: TPS65313-Q1
TPS65313-Q1
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SLDS252A – FEBRUARY 2018 – REVISED SEPTEMBER 2018
Table of Contents
1
2
3
4
Device Overview ......................................... 1
4.1
Receiving Notification of Documentation Updates ... 5
1.1
Features .............................................. 1
4.2
Community Resources ............................... 5
1.2
Applications ........................................... 1
4.3
Trademarks ........................................... 5
1.3
Description ............................................ 1
4.4
Electrostatic Discharge Caution ...................... 5
Revision History ......................................... 3
Device Option Table..................................... 4
Device and Documentation Support ................. 5
4.5
Glossary .............................................. 5
5
Mechanical, Packaging, and Orderable
Information ................................................ 5
2 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (February 2018) to Revision A
•
Page
Changed the data sheet status from Advance Information to Production Data .............................................. 1
Revision History
Copyright © 2018, Texas Instruments Incorporated
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Product Folder Links: TPS65313-Q1
3
TPS65313-Q1
SLDS252A – FEBRUARY 2018 – REVISED SEPTEMBER 2018
www.ti.com
3 Device Option Table
OPTION PART NUMBER
O313B012QRWGRQ1
4
BUCK1
BUCK2
fSW MODULATION
EXT_VMON1 ENABLED AT
POWER-UP
EXT_VMON2 ENABLED AT
POWER-UP
3.3 V
1.25 V
Internal
NO
NO
Device Option Table
Copyright © 2018, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: TPS65313-Q1
TPS65313-Q1
www.ti.com
SLDS252A – FEBRUARY 2018 – REVISED SEPTEMBER 2018
4 Device and Documentation Support
4.1
Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the
upper right corner, click on Alert me to register and receive a weekly digest of any product information that
has changed. For change details, review the revision history included in any revised document.
4.2
Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the
respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views;
see TI's Terms of Use.
TI E2E™ Online Community The TI engineer-to-engineer (E2E) community was created to foster
collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge,
explore ideas and help solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools
and contact information for technical support.
4.3
Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
4.4
Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
4.5
Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
5 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the
most current data available for the designated devices. This data is subject to change without notice and
revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2018, Texas Instruments Incorporated
Mechanical, Packaging, and Orderable Information
Submit Documentation Feedback
Product Folder Links: TPS65313-Q1
5
TPS65313-Q1
SLDS252A – FEBRUARY 2018 – REVISED SEPTEMBER 2018
www.ti.com
PACKAGE OUTLINE
RWG0040B
VQFNP - 0.9 mm max height
SCALE 2.400
PLASTIC QUAD FLATPACK - NO LEAD
6.1
5.9
B
A
PIN 1 ID
6.1
5.9
(
5.75)
0.05
0.00
(0.09)
DETAIL A
TYPICAL
DETAIL A
SCALE 20.000
C
0.9 MAX
SEATING PLANE
0.08 C
SEE DETAIL A
(0.2)
4.4 0.1
SEE DETAIL B
SYMM
4X (45 X 0.6)
(0.15)
8X 0.495 0.1
11
10
(0.15)
21
EXPOSED
THERMAL PAD
1
30
36X 0.5
PIN 1 ID
(OPTIONAL)
DETAIL B
SCALE 20.000
TYPICAL
SYMM
41
4X
4.5
DETAIL B
40X
31
40
38X
0.6
0.4
0.30
0.18
0.1
0.05
C B A
C
4223780 /A 06/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
6
Mechanical, Packaging, and Orderable Information
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Product Folder Links: TPS65313-Q1
Copyright © 2018, Texas Instruments Incorporated
TPS65313-Q1
www.ti.com
SLDS252A – FEBRUARY 2018 – REVISED SEPTEMBER 2018
EXAMPLE BOARD LAYOUT
RWG0040B
VQFNP - 0.9 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
( 4.4)
4X (1.43)
4X (1.235)
40
31
40X (0.7)
1
30
40X (0.25)
4X
(1.235)
41
SYMM
4X
(1.43)
(5.7)
36X (0.5)
21
10
( 0.2) VIA
TYP
11
20
SYMM
(R0.05) TYP
(5.7)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
0.05 MIN
ALL AROUND
0.05 MAX
ALL AROUND
SOLDER MASK
OPENING
METAL
EXPOSED METAL
EXPOSED METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4223780 /A 06/2017
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
Copyright © 2018, Texas Instruments Incorporated
Mechanical, Packaging, and Orderable Information
Submit Documentation Feedback
Product Folder Links: TPS65313-Q1
7
TPS65313-Q1
SLDS252A – FEBRUARY 2018 – REVISED SEPTEMBER 2018
www.ti.com
EXAMPLE STENCIL DESIGN
RWG0040B
VQFNP - 0.9 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(1.43 TYP)
9X ( 1.23)
40
31
40X (0.7)
1
41
30
40X (0.25)
(1.43)
TYP
SYMM
(5.7)
36X (0.5)
21
10
METAL
TYP
11
(R0.05) TYP
SYMM
20
(5.7)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
PAD 41: 70%
SCALE:15X
4223780 /A 06/2017
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
8
Mechanical, Packaging, and Orderable Information
Submit Documentation Feedback
Product Folder Links: TPS65313-Q1
Copyright © 2018, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
15-Mar-2019
PACKAGING INFORMATION
Orderable Device
Status
(1)
PO313B014QRWGRQ1
ACTIVE
Package Type Package Pins Package
Drawing
Qty
VQFNP
RWG
40
2000
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
TBD
Call TI
Call TI
Op Temp (°C)
Device Marking
(4/5)
-40 to 125
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
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