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Texas Instruments TPS92663-Q1 Features Datasheet
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TPS92663-Q1
SLUSD34 – JULY 2018
TPS92663-Q1 High-Brightness LED Matrix Manager for Automotive Headlight Systems
1 Features
•
1
•
•
•
•
•
•
•
•
The device includes two sub-strings of three seriesconnected integrated switches for bypassing
individual LEDs. The individual sub-strings allow the
device to accept either single or multiple current
sources. It also allows a parallel connection of two
switches to bypass high-current LEDs.
AEC-Q100 Qualified for Automotive Applications
– Device Temperature Grade 1: –40°C to 125°C,
TA
– Device HBM Classification Level: H1C
– Device CDM Classification Level: C5
Input Voltage Range: 4.5 V to 60 V
Six Integrated Bypass Switches
– Two Sub-Strings of Three Series Switches
– 20 V (Maximum) Across Switch
– 62 V (Maximum) Switch to GND
Multi-Drop UART Communication Interface
– Up to 16 Addressable Devices
– Integrates on same bus with the TPS92662
Compatible with CAN Physical Layer
– Minimum Number of Wires in Cable Harness
8-bit ADC with Two MUX Inputs
Crystal Oscillator Driver
Programmable 10-bit PWM Dimming
– Individual Phase Shift and Pulse Width
– Device-to-device Synchronization
LED Open and Short Detection and Protection
A master microcontroller may be used to control and
manage the TPS92663-Q1 devices via a multi-drop
universal asynchronous receiver transmitter (UART)
serial interface. The serial interface supports the use
of CAN transceivers for a more robust physical layer.
An application can use the TPS92663-Q1 device and
the TPS92662-Q1 device on the same bus.
An on-device, 8 bit ADC with two multiplexed inputs
can be used for system temperature compensation
and used to measure a binning value which allows for
LED binning and coding.
The internal charge pump rail supplies the gate drive
voltage for the LED bypass switches. The low onresistance (RDS(on)) of the bypass switch minimizes
conduction loss and power dissipation.
The phase shift and pulse width for each individual
LED in the string are programmable. The device uses
an internal register to adjust the PWM frequency.
Multiple devices can be synchronized. The switch
transitions during PWM dimming operation have a
programmable slew rate to mitigate EMI concerns.
2 Applications
•
•
•
The device features open LED protection with
programmable threshold. The serial interface reports
open LED and short LED faults.
Automotive headlight systems
High-Brightness LED Matrix Systems
ADB or Glare-Free High Beam
Device Information(1)
PART NUMBER
3 Description
TPS92663-Q1
The TPS92663-Q1 LED matrix manager device
enables fully dynamic adaptive lighting solutions by
providing individual pixel-level LED control.
PACKAGE
PWP (24)
BODY SIZE (NOM)
7.70 mm × 4.40 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Simplified Application
VBAT
Boost
Buck
VIN
XTALI
CPPx
TPS92663
XTALO
MCU
BIN
ADCx
UART
ECU
CAN
CAN
RX
TX
LEDx
VDD
GND
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS92663-Q1
SLUSD34 – JULY 2018
www.ti.com
Table of Contents
1
2
3
4
5
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Device and Documentation Support....................
5.2
5.3
5.4
5.5
1
1
1
2
3
6
5.1 Receiving Notification of Documentation Updates.... 3
Community Resources..............................................
Trademarks ...............................................................
Electrostatic Discharge Caution ................................
Glossary ....................................................................
3
3
3
3
Mechanical, Packaging, and Orderable
Information ............................................................. 4
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
2
DATE
REVISION
NOTES
July 2018
*
Initial release.
Submit Documentation Feedback
Copyright © 2018, Texas Instruments Incorporated
Product Folder Links: TPS92663-Q1
TPS92663-Q1
www.ti.com
SLUSD34 – JULY 2018
5 Device and Documentation Support
5.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
5.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
5.3 Trademarks
E2E is a trademark of Texas Instruments.
5.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
5.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
Submit Documentation Feedback
Copyright © 2018, Texas Instruments Incorporated
Product Folder Links: TPS92663-Q1
3
TPS92663-Q1
SLUSD34 – JULY 2018
www.ti.com
6 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
4
Submit Documentation Feedback
Copyright © 2018, Texas Instruments Incorporated
Product Folder Links: TPS92663-Q1
PACKAGE OPTION ADDENDUM
www.ti.com
13-Jul-2018
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TPS92663QPWPRQ1
ACTIVE
HTSSOP
PWP
24
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 125
TPS92663Q
TPS92663QPWPTQ1
ACTIVE
HTSSOP
PWP
24
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 125
TPS92663Q
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
13-Jul-2018
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Jun-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
TPS92663QPWPRQ1
HTSSOP
PWP
24
2000
330.0
16.4
TPS92663QPWPTQ1
HTSSOP
PWP
24
250
180.0
16.4
Pack Materials-Page 1
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
6.95
8.3
1.6
8.0
16.0
Q1
6.95
8.3
1.6
8.0
16.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Jun-2019
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPS92663QPWPRQ1
HTSSOP
PWP
24
2000
350.0
350.0
43.0
TPS92663QPWPTQ1
HTSSOP
PWP
24
250
213.0
191.0
55.0
Pack Materials-Page 2
GENERIC PACKAGE VIEW
TM
PWP 24
PowerPAD TSSOP - 1.2 mm max height
PLASTIC SMALL OUTLINE
4.4 x 7.6, 0.65 mm pitch
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4224742/B
www.ti.com
PACKAGE OUTLINE
PWP0024B
PowerPAD TM TSSOP - 1.2 mm max height
SCALE 2.200
PLASTIC SMALL OUTLINE
6.6
TYP
6.2
PIN 1 ID
AREA
A
SEATING PLANE
0.1 C
22X 0.65
24
1
C
2X
7.15
7.9
7.7
NOTE 3
12
B
13
24X
4.5
4.3
0.30
0.19
0.1
C A
B
(0.15) TYP
SEE DETAIL A
4X (0.2) MAX
NOTE 5
2X (0.95) MAX
NOTE 5
EXPOSED
THERMAL PAD
0.25
GAGE PLANE
5.16
4.12
0 -8
1.2 MAX
0.15
0.05
0.75
0.50
(1)
2.40
1.65
DETAIL A
TYPICAL
4222709/A 02/2016
PowerPAD is a trademark of Texas Instruments.
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. Reference JEDEC registration MO-153.
5. Features may not be present and may vary.
www.ti.com
EXAMPLE BOARD LAYOUT
PWP0024B
PowerPAD TM TSSOP - 1.2 mm max height
PLASTIC SMALL OUTLINE
(3.4)
NOTE 9
SOLDER MASK
DEFINED PAD
(2.4)
24X (1.5)
SYMM
SEE DETAILS
1
24
24X (0.45)
(R0.05)
TYP
(7.8)
NOTE 9
(1.1)
TYP
SYMM
(5.16)
22X (0.65)
( 0.2) TYP
VIA
12
13
(1) TYP
METAL COVERED
BY SOLDER MASK
(5.8)
LAND PATTERN EXAMPLE
SCALE:10X
SOLDER MASK
OPENING
METAL
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
0.05 MIN
ALL AROUND
0.05 MAX
ALL AROUND
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
PADS 1-24
4222709/A 02/2016
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
8. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
numbers SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).
9. Size of metal pad may vary due to creepage requirement.
www.ti.com
EXAMPLE STENCIL DESIGN
PWP0024B
PowerPAD TM TSSOP - 1.2 mm max height
PLASTIC SMALL OUTLINE
(2.4)
BASED ON
0.125 THICK
STENCIL
24X (1.5)
(R0.05) TYP
1
24
24X (0.45)
(5.16)
BASED ON
0.125 THICK
STENCIL
SYMM
22X (0.65)
13
12
SYMM
METAL COVERED
BY SOLDER MASK
(5.8)
SEE TABLE FOR
DIFFERENT OPENINGS
FOR OTHER STENCIL
THICKNESSES
SOLDER PASTE EXAMPLE
EXPOSED PAD
100% PRINTED SOLDER COVERAGE BY AREA
SCALE:10X
STENCIL
THICKNESS
SOLDER STENCIL
OPENING
0.1
0.125
0.15
0.175
2.68 X 5.77
2.4 X 5.16 (SHOWN)
2.19 X 4.71
2.03 X 4.36
4222709/A 02/2016
NOTES: (continued)
10. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
11. Board assembly site may have different recommendations for stencil design.
www.ti.com
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