Texas Instruments | TPS6126x 0.8-V Input Synchronous Boost Converters with 100-mA Output Current (Rev. C) | Datasheet | Texas Instruments TPS6126x 0.8-V Input Synchronous Boost Converters with 100-mA Output Current (Rev. C) Datasheet

Texas Instruments TPS6126x 0.8-V Input Synchronous Boost Converters with 100-mA Output Current (Rev. C) Datasheet
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TPS61260, TPS61261
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TPS6126x 0.8-V Input Synchronous Boost Converters with 100-mA Output Current
1 Features
3 Description
•
•
•
•
The TPS6126x devices provide a power supply
solution for products powered by either single or dual
cell alkaline, NiCd, or NiMH batteries. Its unique
advanced softstart makes it also suitable for products
powered by high output impedance battery types, like
coin cells. Output currents can go as high as 100 mA
while using a single cell alkaline battery, and
discharge it down to 0.8 V or lower.
1
•
•
•
•
•
•
•
•
•
•
Input Voltage Range from 0.8 V to 4.0 V
Up to 95% Efficiency
100 mA Output Current at 3.3 Vout (VIN > 1 V)
Fixed and Adjustable Output Voltage Options from
1.8 V to 4.0 V
Programmable Average Output Current from 10
mA to 100 mA
Adjustable Output Current Limit for Smallest
Inductor
Power Save Mode for Improved Efficiency at Low
Output Power
29-µA Quiescent Current
Advanced Softstart
Quasi Fixed Frequency Operation at 2.5 MHz
Output Overvoltage Protection
Load Disconnect During Shutdown
Undervoltage Lockout
Available in a 2.00 × 2.00 mm, 6-Pin WSON
Package
The boost converter is based on a quasi fixed
frequency, pulse-width-modulation (PWM) controller
using synchronous rectification to obtain maximum
efficiency. At low load currents, the converter enters
Power Save Mode to ensure high efficiency over a
wide load current range. The maximum average
current in the switches is limited to a programmable
value which can go as high as 700 mA. The output
voltage is programmable using an external resistor
divider, or is fixed internally on the chip. In addition,
the average output current can be programmed as
well. The converter then regulates the programmed
output voltage or the programmed output current,
which ever demands lower output power. The
converter can be disabled to minimize battery drain.
During shutdown, the load is disconnected from the
battery. The device is packaged in a 6-pin WSON
(DRV) package.
2 Applications
•
•
•
•
•
•
•
All Single or Dual Cell Alkaline, NiCd or NiMH
Battery Powered Products
High Output Impedance Battery (Coin Cells)
Powered Products
Personal Medical Products
LED Driver
Laser Pointer
Wireless Headsets
Industrial Metering Equipment
Device Information(1)
PART NUMBER
TPS61260
PACKAGE
WSON (6)
TPS61261
BODY SIZE (NOM)
2.00 mm × 2.00 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
L1
4.7 µH
VIN
0.8 V to 4.0 V
VOUT
L
R1
VIN
C1
10 µF
FB
C2
10µF
VOUT
R2
EN
GND
RI
R3
TPS61260
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS61260, TPS61261
SLVSA99C – MAY 2011 – REVISED APRIL 2018
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Table of Contents
1
2
3
4
5
6
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
6.5
6.6
4
4
4
4
5
6
Absolute Maximum Ratings ......................................
Handling Ratings ......................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Typical Characteristics ..............................................
7
Parameter Measurement Information .................. 8
8
Detailed Description ............................................ 10
7.1 Schematic and List of Components .......................... 8
8.1 Overview ................................................................. 10
8.2 Functional Block Diagrams ..................................... 10
8.3 Feature Description................................................. 11
8.4 Device Functional Modes........................................ 12
8.5 Programming .......................................................... 13
9
Application and Implementation ........................ 14
9.1 Application Information............................................ 14
9.2 Typical Applications ................................................ 14
10 Power Supply Recommendations ..................... 17
11 Layout................................................................... 17
11.1 Layout Guidelines ................................................. 17
11.2 Layout Example .................................................... 18
11.3 Thermal Considerations ........................................ 18
12 Device and Documentation Support ................. 19
12.1
12.2
12.3
12.4
12.5
12.6
Device Support ....................................................
Documentation Support .......................................
Related Links ........................................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
19
19
19
19
19
19
13 Mechanical, Packaging, and Orderable
Information ........................................................... 19
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision B (November 2014) to Revision C
•
Page
Changed term from µs to (µH) in Equation 3. ..................................................................................................................... 14
Changes from Revision A (February 2013) to Revision B
Page
•
Added Handling Rating table, Feature Description section, Device Functional Modes, Application and
Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation
Support section, and Mechanical, Packaging, and Orderable Information section................................................................ 1
•
Changed Minimum input voltage for startup, -40°C < TJ < 105°C, Max from 0.8 V to 1.2 V ................................................. 5
•
Added VEN = 0 V, VIN = 1.2 V, TA = 25°C Test Condition and values to Shutdown current................................................... 5
Changes from Original (May 2011) to Revision A
Page
•
Changed Supply voltage to Input supply in RECOMMENDED OPERATING CONDITIONS ................................................ 4
•
Changed ELECTRICAL CHARACTERISTICS ....................................................................................................................... 5
•
Changed Synchronous Boost Operation section.................................................................................................................. 11
•
Deleted Dynamic Current Limit section ................................................................................................................................ 12
•
Changed Inductor Selection section..................................................................................................................................... 14
•
Changed Capacitor Selection section .................................................................................................................................. 15
•
Changed PowerPAD™ to Exposed Thermal Pad ................................................................................................................ 18
2
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5 Pin Configuration and Functions
6-Pin WSON
DRV Package
(Top View)
RI
EN
FB
1
2
3
GND
Exposed
Thermal
Pad
GND
6
5
4
VIN
L
VOUT
Pin Functions
PIN
NAME
NUMBER
I/O
DESCRIPTION
EN
2
I
Enable input. (High = enabled, Low = disabled). Do not leave floating.
FB
3
I
Voltage feedback of adjustable versions. Must be connected to VOUT on fixed output voltage
versions.
GND
Exposed
Thermal Pad
Must be soldered to achieve appropriate power dissipation and mechanical reliability. Must be
connected to GND.
L
5
I
Connection for inductor
RI
1
I
Average output current programming input. A resistor with a value between 2 kΩ and 20 kΩ must be
connected between the RI pin and GND.
VIN
6
I
Supply voltage for control stage
VOUT
4
O
Boost converter output
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
Voltage range (2)
(1)
MIN
MAX
UNIT
VIN, L, VOUT, EN, FB
–0.3
5.0
V
RI
–0.3
3.6
V
–40
150
°C
Operating junction temperature range, TJ
(1)
(2)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to network ground terminal.
6.2 Handling Ratings
Tstg
Storage temperature range
VESD
(1)
(2)
(3)
Electrostatic discharge
(1)
MIN
MAX
UNIT
–65
150
°C
2
kV
0.5
kV
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
pins (2)
Charged device model (CDM), per JEDEC specification JESD22C101, all pins (3)
ESD testing is performed according to the respective JESD22 JEDEC standard.
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
Input supply voltage at VIN
0.8
4.0
V
Operating free air temperature range, TA
–40
85
°C
Operating junction temperature range, TJ
–40
125
°C
6.4 Thermal Information
TPS61260, TPS61261
THERMAL METRIC (1)
DRV (6 PINS)
RθJA
Junction-to-ambient thermal resistance
89
RθJC(top)
Junction-to-case (top) thermal resistance
100
RθJB
Junction-to-board thermal resistance
35
ψJT
Junction-to-top characterization parameter
2
ψJB
Junction-to-board characterization parameter
36
RθJC(bot)
Junction-to-case (bottom) thermal resistance
8
(1)
4
UNIT
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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6.5 Electrical Characteristics
over recommended free-air temperature range and over recommended input voltage range (typical at an ambient temperature
range of 25°C) (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
DC/DC STAGE
VIN
Input voltage range
VIN
Minimum input voltage for startup
VOUT
TPS61260 output voltage range
VFB
TPS61260 feedback voltage
VOUT
TPS61261 output voltage
0.8
-40°C < TJ < 105°C
1.8
-40°C < TJ < 85°C
4.0
V
1.2
V
4.0
V
495
500
505
mV
3.27
3.3
3.33
V
7x
ILIM
Average switch current limit
RDS(on)
High side switch on resistance
VIN = 1.2 V, VOUT = 3.3 V
1000
mΩ
RDS(on)
Low side switch on resistance
VIN = 1.2 V, VOUT = 3.3 V
250
mΩ
Output voltage line regulation
PWM mode
Output voltage load regulation
PWM mode
IOUT
IQ
0.5%
0.5%
Average output current programming range
100
mA
Average output current
RI = 10 kΩ, TA = 25 °C, VIN < VOUT
19
20
21
mA
Average output current
RI = 10 kΩ, 0°C < TJ < 60°C, VIN < VOUT
18
20
22
mA
10
4
7
μA
25
40
Average output current line regulation
0.5%
Average output current load regulation
0.5%
Quiescent
current
VIN
IO = 0 mA, VEN = VIN = 1.2 V,
VOUT = 3.3 V, Device not switching
VOUT
TPS61261 FB pin input impedance
ISD
mA
IOUT
VEN = HIGH
Shutdown current
1
μA
MΩ
VEN = 0 V, VIN = 1.2 V
0.1
1.5
μA
VEN = 0 V, VIN = 1.2 V, TA = 25°C
0.1
0.3
μA
0.7
0.8
CONTROL STAGE
VUVLO
Under voltage lockout threshold
VUVLO
Under voltage lockout threshold hysteresis
Falling VIN
0.6
VIL
Low level input threshold voltage (EN)
VIN ≤ 1.8 V, -40°C < TJ < 85°C
0.2 ×
VIN
V
VIL
Low level input threshold voltage (EN)
VIN > 1.8 V, -40°C < TJ < 85°C
0.36
V
VIH
High level input threshold voltage (EN)
VIN ≤ 1.5 V
0.8 ×
VIN
VIH
High level input threshold voltage (EN)
VIN > 1.5 V
1.2
ILKG
Input leakage current (EN)
EN = GND or VIN
VOVP
Output overvoltage protection
200
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V
V
0.01
4.0
V
mV
0.1
μA
4.5
V
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6.6 Typical Characteristics
Table of Graphs
DESCRIPTION
FIGURE
vs Input voltage (TPS61260, VOUT = {1.8 V; 2.5 V; 4.0 V})
Figure 1
vs Input voltage (TPS61261, VOUT = 3.3 V)
Figure 2
vs Output current (TPS61260, VOUT = {1.8 V; 2.5 V; 4.0 V})
Figure 3
vs Output current (TPS61261, VOUT = 3.3 V)
Figure 4
vs Input voltage (TPS61260, VOUT = 1.8 V, IOUT = {10; 20; 50 mA})
Figure 5
vs Input voltage (TPS61260, VOUT = 2.5 V, IOUT = {10; 20; 50 mA})
Figure 6
vs Input voltage (TPS61260, VOUT = 4.0 V, IOUT = {10; 20; 50; 100 mA})
Figure 7
vs Input voltage (TPS61261, VOUT = 3.3V, IOUT = {10; 20; 50 mA})
Figure 8
Output current
vs Resistance at RI
Figure 9
Output voltage
vs Output current (TPS61260, VOUT = 1.8 V)
Figure 10
vs Output current (TPS61260, VOUT = 2.5 V)
Figure 11
vs Output current (TPS61260, VOUT = 4.0 V)
Figure 12
vs Output current (TPS61261, VOUT = 3.3 V)
Figure 13
vs Output voltage
Figure 14
Maximum output current
Efficiency
110
110
100
100
90
90
Output Current (mA)
Output Current (mA)
Output current
80
70
60
50
40
30
VOUT = 1.8 V
VOUT = 2.5 V
VOUT = 4.0 V
20
10
R3 = 2 kΩ
0
0.8
1.2
1.6
2.0
2.4
2.8
Input Voltage (V)
3.2
3.6
60
50
40
30
10
0
0.8
4.0
1.2
VOUT = 3.3 V
1.6
100
90
90
80
80
70
70
60
50
40
30
2.0
2.4
2.8
Input Voltage (V)
3.2
3.6
4.0
G000
Figure 2. Maximum Output Current vs Input Voltage
100
60
50
40
30
VOUT = 1.8 V
VOUT = 2.5 V
VOUT = 4.0 V
20
10
R3 = 2 kΩ
G000
Efficiency (%)
Efficiency (%)
70
20
Figure 1. Maximum Output Current vs Input Voltage
VIN = 1.2 V
0
0.01
0.1
1
Output Current (mA)
10
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20
10
100
VIN = 1.2 V
0
0.01
0.1
G000
Figure 3. Efficiency vs Output Current
6
80
VOUT =3.3 V
1
Output Current (mA)
10
100
G000
Figure 4. Efficiency vs Output Current
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100
100
90
90
80
80
70
70
Efficiency (%)
Efficiency (%)
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60
50
40
30
60
50
40
30
IOUT =10 mA
IOUT =20 mA
IOUT =50 mA
20
10
VOUT =1.8 V
0
0.8
1.0
1.2
1.4
1.6
1.8
Input Voltage (V)
2.0
2.2
10
2.4
Figure 5. Efficiency vs Input Voltage
1.0
1.2
100
100
90
90
80
80
70
70
60
50
40
10
1.6 1.8 2.0 2.2
Input Voltage (V)
2.4
2.6
2.8
3.0
G000
60
50
40
30
IOUT =10 mA
IOUT =20 mA
IOUT =50 mA
IOUT =100 mA
20
1.4
Figure 6. Efficiency vs Input Voltage
Efficiency (%)
Efficiency (%)
VOUT = 2.5 V
0
0.8
G000
30
IOUT =10 mA
IOUT =20 mA
IOUT =50 mA
20
IOUT =10 mA
IOUT =20 mA
IOUT =50 mA
20
10
VOUT = 4.0 V
0
0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0
Input Voltage (V)
G000
VOUT = 3.3 V
0
0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
Input Voltage (V)
G000
Figure 7. Efficiency vs Input Voltage
Figure 8. Efficiency vs Input Voltage
1.854
100
90
1.836
Output Voltage (V)
Output Current (mA)
80
70
60
50
40
30
20
1.818
1.8
1.782
1.764
10
0
2.0
4.0
6.0
8.0
10.0 12.0 14.0
Resistance (kΩ)
16.0
18.0
Figure 9. Output Current vs Resistance at RI
20.0
G000
VIN = 1.2 V, VOUT = 1.8 V, R3 = 2 kΩ
1.746
0.01
0.1
1
Output Current (mA)
10
100
G000
Figure 10. Output Voltage vs Output Current
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2.575
4.12
2.55
4.08
Output Voltage (V)
Output Voltage (V)
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2.525
2.5
2.475
2.45
4.04
4
3.96
3.92
VIN = 1.2 V, VOUT = 2.5 V, R3 = 2 kΩ
2.425
0.01
0.1
1
Output Current (mA)
10
VIN = 1.2 V, VOUT = 4.0 V, R3 = 2 kΩ
3.88
0.01
0.1
1
Output Current (mA)
100
G000
Figure 11. Output Voltage vs Output Current
100
G000
Figure 12. Output Voltage vs Output Current
3.399
22
21.5
Output Current (mA)
3.366
Output Voltage (V)
10
3.333
3.3
3.267
3.234
21
20.5
20
19.5
19
18.5
VIN = 1.2 V, VOUT = 3.3 V, R3 = 2 kΩ
3.201
0.01
0.1
VIN = 1.2 V, R3 = 10 kΩ
1
Output Current (mA)
10
18
1.8
100
2.0
2.2
G000
Figure 13. Output Voltage vs Output Current
2.4
2.6
2.8
Output Voltage (V)
3.0
3.2
G000
Figure 14. Output Current vs Output Voltage
7 Parameter Measurement Information
7.1 Schematic and List of Components
L1
VOUT
L
VOUT
C2
R1
VIN
VIN
FB
R2
C1
EN
GND
RI
R3
TPS61260
Table 1. List of Components
REFERENCE
8
DESCRIPTION
MANUFACTURER
TPS61260 / 1
Texas Instruments
L1
4.7 μH, 2.5 mm x 2 mm
LQM2HPN4R7MG0, Murata
C1
10 μF 6.3 V, 0603, X5R ceramic
GRM188R60J106KME84D, Murata
C2
10 μF 6.3 V, 0603, X5R ceramic
GRM188R60J106KME84D, Murata
R1
Depending on the output voltage at TPS61260. 0 Ω
at TPS61261
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Schematic and List of Components (continued)
Table 1. List of Components (continued)
REFERENCE
DESCRIPTION
R2
Depending on the output voltage at TPS61260. Not
used at TPS61261
R3
Depending on the output current
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MANUFACTURER
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8 Detailed Description
8.1 Overview
The TPS6126x is based on a quasi-fixed frequency, pulse-width-modulation (PWM) controller using synchronous
rectification to obtain maximum efficiency. At low load currents, the converter enters Power Save Mode to ensure
high efficiency over a wide load current range. The TPS6126x is based on a current mode topology. The inductor
current is regulated by a fast current regulator loop which is controlled by either a voltage control loop or a
reference current. The controller also uses input and output voltage feedforward. Changes of the input and
output voltages are monitored and immediately change the duty cycle in the modulator to achieve a fast
response to those errors. In addition, the average output current can be programmed as well. An external resistor
is used to program the average output current.
8.2 Functional Block Diagrams
L
VOUT
Current
Sensor
VIN
VOUT
Gate
Control
Modulator
_
+
_
+
+
-
VIN
EN
Device
Control
FB
VOUT
VFB
RI
GND
Figure 15. TPS61260
10
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Functional Block Diagrams (continued)
L
VOUT
Current
Sensor
VIN
VOUT
Gate
Control
Modulator
FB
_
+
_
+
VIN
EN
Device
Control
VOUT
+
-
VFB
RI
GND
Figure 16. TPS61261
8.3 Feature Description
8.3.1 Controller Circuit
The controlling circuit of the device is based on a current mode topology. The inductor current is regulated by a
fast current regulator loop which is controlled by either a voltage control loop or a reference current. The
controller also uses input and output voltage feedforward. Changes of the input and output voltages are
monitored and immediately change the duty cycle in the modulator to achieve a fast response to those errors.
The voltage error amplifier gets its feedback input from the FB pin. For the adjustable output voltage version, a
resistive voltage divider must be connected to that pin. For the fixed output voltage version, the FB pin must be
connected to the output voltage to directly sense the voltage. Fixed output voltage versions use a trimmed
internal resistive divider. The feedback voltage is compared with the internal reference voltage to generate a
stable and accurate output voltage. The reference current for average output current control is programmed with
a resistor connected between the RI pin and GND.
The programming of the average output current also affects the maximum switch current in the main switch
which basically is the input current. The lower the average output current is programmed, the lower the maximum
input current. Now, maximum input power is controlled as well as the maximum peak current to achieve safe and
stable operation under all possible conditions. Smaller inductors with lower saturation current ratings can be
used, when lower average output currents are programmed.
8.3.2 Synchronous Boost Operation
The device uses 3 internal N-channel MOSFETs to maintain synchronous power conversion at all possible
operating conditions. This enables the device to keep high efficiency over a wide input voltage and output power
range. Using 2 rectifying switches also enables the device to control the output voltage and current during startup
conditions when the input voltage is higher than the output voltage. During startup, the rectifying switch works in
a linear mode until the output voltage is near the input voltage. Once in regulation, operating with the input
voltage greater than the output voltage may cause either the output voltage or current to exceed its regulation
value. Although this operating point is not recommended, the device will not be damaged by this as long as
absolute maximum ratings are not violated.
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Feature Description (continued)
As opposed to a standard boost converter, the implemented 3 switch topology enables the output to be
disconnected from the input during device shutdown when disabled. Current does not flow from output to input or
from input to output.
8.3.3 Power Save Mode
At normal load conditions with continuous inductor current, the device operates at a quasi fixed frequency. If the
load gets lower, the inductor current decreases and becomes discontinuous. If this happens and the load is
further decreased, the device lowers the switching frequency and turns off parts of the control to minimize
internal power consumption. The output voltage is controlled by a low power comparator at a level about 1%
higher than the nominal output voltage. If the output voltage reaches the nominal value or drops below it, device
control is turned on again to handle the new load condition. The boundary between power save mode and PWM
mode is when the inductor current becomes discontinuous.
Accurate average output current regulation requires continuous inductor current. This means that there is no
power save mode during current regulation.
8.3.4 Device Enable
The device is put into operation when EN is set high. It is put into a shutdown mode when EN is set to GND. In
shutdown mode, the regulator stops switching, all internal control circuitry is switched off, and the load is
disconnected from the input. This means that output voltage can drop below input voltage during shutdown.
8.3.5 Softstart and Short Circuit Protection
During startup of the converter, duty cycle and peak current are limited in order to avoid high peak currents
flowing from the input. After being enabled, the device starts operating. Until the output voltage reaches about
0.4 V, the average output current ramps up from zero to the programmed value, as the output voltage increases.
As soon as the output current has reached the programmed value, it stays regulated at that value until the load
conditions demand less current. This typically happens when the output capacitor is charged and the output
voltage is regulated.
During startup, the device can seamlessly change modes of operation. When the input voltage is higher than the
output voltage, the device operates in a linear mode using the rectifying switches for control. If the input voltage
is lower than the output voltage it operates in a standard boost conversion mode. Boost conversion is nonsynchronous when the output voltage is below approximately 1.8 V and it is synchronous if the output voltage is
higher than approximately 1.8 V.
At short circuit conditions at the output, the output current is limited to the programmed average current. If the
short at the output causes the output voltage to drop below 0.4 V, the average current decreases approximately
linearly with the output voltage down to zero.
The devices can monotonically start into a pre-bias on the output.
8.4 Device Functional Modes
8.4.1 Undervoltage Lockout
An undervoltage lockout function prevents device startup if the supply voltage on VIN is lower than the
undervoltage lockout threshold defined in the Electrical Characteristics. When in operation, the device
automatically shuts down the power stage if the voltage on VIN drops below the undervoltage lockout threshold.
The device automatically restarts if the input voltage recovers to the minimum operating input voltage.
8.4.2 Output Overvoltage Protection
If, for any reason, the output voltage of the device (as measured at the VOUT pin) exceeds its maximum
recommended value, the device stops operating. It continues operating as soon as the output voltage has
dropped below this threshold.
12
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8.5 Programming
8.5.1 Programming the Output Voltage
Within the TPS6126x family, there are fixed and adjustable output voltage versions available. To properly
configure the fixed output voltage devices, the FB pin is used to sense the output voltage. This means that it
must be connected directly to VOUT. For the adjustable output voltage version, an external resistor divider is
used to adjust the output voltage. The resistor divider must be connected between the VOUT, FB, and GND pins.
When the output voltage is regulated properly, the typical value of the voltage at the FB pin is 500 mV. The
maximum recommended value for the output voltage is 4.0 V. The current through the resistive divider should be
about 100 times greater than the current into the FB pin. The typical current into the FB pin is 0.01 μA, and the
voltage across the resistor between the FB and GND pins, R2, is typically 500 mV. Based on these two values,
the recommended value for R2 should be lower than 500 kΩ, in order to set the divider current at 1 μA or higher.
It is also recommended to keep the total value for the resistor divider, R1 + R2, in the range of 1 MΩ. From that,
the value of the resistor connected between VOUT and FB, R1, depending on the needed output voltage (VOUT),
can be calculated using Equation 1:
æV
ö
R1 = R2 × çç OUT - 1÷÷
è VFB
ø
(1)
L1
VOUT
L
VOUT
R1
VIN
VIN
C2
FB
R2
C1
EN
GND
RI
R3
TPS61260
Figure 17. Typical Application Circuit for Adjustable Output Voltage Option
8.5.2 Programming the Output Current
The devices of the TPS6126x family also support average output current regulation. An external resistor is used
to program the average output current. The resistor must be connected between the RI and GND pins. When the
average output current is regulated properly, the typical value of the voltage at the RI pin is 400 mV. The
maximum recommended value for the regulated average output current is 100 mA. The value of the resistor R3
should be between 2 kΩ and 20 kΩ. It can be calculated, depending on the needed average output current
(IOUT), using Equation 2:
R3 =
200 V
IOUT
(2)
Accurate regulation of the average output current only is possible if the inductor current is continuous. Please
check the Inductor Selection section to calculate the required parameters for selecting an appropriate inductor.
Copyright © 2011–2018, Texas Instruments Incorporated
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The devices are designed to operate from an input voltage supply range between 1.2 V (Vin falling UVLO is
0.8 V) and 4.0 V with a maximum output current of 100 mA. The devices operate in PWM mode for medium to
heavy load conditions and in power save mode at light load currents. In PWM mode the TPS61260 converter
operates with the nominal switching frequency of 2.5 MHz which provides a controlled frequency variation over
the input voltage range. As the load current decreases, the converter enters power save mode, reducing the
switching frequency and minimizing the IC quiescent current to achieve high efficiency over the entire load
current range. The WEBENCH software uses an iterative design procedure and accesses a comprehensive
database of components when generating a design.
9.2 Typical Applications
9.2.1 TPS61260 3.3-V Output Application
L1
VOUT
L
VOUT
C2
R1
VIN
VIN
FB
R2
C1
EN
GND
RI
R3
TPS61260
Figure 18. TPS61260 Typical Application Circuit
9.2.1.1 Design Requirements
Table 2. Design Parameters
DESIGN PARAMETER
EXAMPLE VALUE
Input voltage range
1.2 V to 4.0 V
Output voltage
3.3 V
Input ripple voltage
±200 mV
Output ripple voltage
±3% VOUT
Output current rating
100 mA
Operating frequency
2.5 MHz
9.2.1.2 Detailed Design Procedure
9.2.1.2.1 Inductor Selection
To properly configure the TPS6126x devices, an inductor must be connected between the VIN pin and the L pin.
Equation 3 is used to estimate the minimum inductance value for accurate average output current regulation; the
inductor current should be continuous.
LMIN =
14
V 2IN g (VOUT - VIN )
V 2OUT g IOUT
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g 0.2 (μH)
(3)
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SLVSA99C – MAY 2011 – REVISED APRIL 2018
In Equation 3, the minimum inductance value required for accurate average output current regulation is
calculated. VIN is the input voltage. For typical applications which require voltage regulation, the recommended
inductor value is 4.7 μH. Applications with higher inductance values have lower light load efficiency. The
recommended range for the inductor value is from 2.2 μH up to 22 μH. The current rating required for this
inductor is ILIM and depends on the programmed output current IOUT. Please refer to the Electrical
Characteristics. Table 3 contains a list of inductors recommended for the TPS6126x:
Table 3. List of Inductors
VENDOR
INDUCTOR SERIES
Murata
LQM2HP_G0
Toko
DFE252012C
Hitachi Metals
KSLI-252010AG
9.2.1.2.2 Capacitor Selection
9.2.1.2.2.1
Input Capacitor
At least a 4.7-μF input capacitor is recommended to improve transient behavior of the regulator and EMI
behavior of the total power supply circuit. An X5R or X7R ceramic capacitor placed as close as possible to the
VIN and GND pins of the IC is recommended.
9.2.1.2.2.2
Output Capacitor
For the output capacitor, use of a small X5R or X7R ceramic capacitor placed as close as possible to the VOUT
and GND pins of the IC is recommended. If, for any reason, the application requires the use of large capacitors
which cannot be placed close to the IC, use a smaller ceramic capacitor in parallel to the large capacitor. The
small capacitor should be placed as close as possible to the VOUT and GND pins of the IC.
The output capacitor should be at least 2.2 μF. There are no additional requirements regarding minimum ESR.
There is also no theoretical upper limit for the output capacitance value. The device has been tested with
capacitors up to 100 μF. In general, larger capacitors cause lower output voltage ripple as well as lower output
voltage drop during load transients. To improve control performance, especially when using high output
capacitance values, a feedforward capacitor in parallel to R1 is recommended. The value should be in the range
of the value calculated in Equation 4:
C ff = 0.3 × Ω ×
C2
R2
(4)
9.2.1.3 TPS61260 3.3-V Output Application Performance Plots
Input Voltage
1 V/div, DC
Output Current
20 mA/div, DC
Output Voltage
100 mV/div, AC
Output Voltage
100 mV/div, AC
Inductor Current
200 mA/div, DC
VIN = 1.2 V, VOUT = 3.3 V, IOUT = 5 mA to 45 mA
VIN = 1.0 V to 1.5 V, VOUT = 3.3 V, IOUT = 50 mA
Time 2 ms/div
Inductor Current
100 mA/div, DC
Time 2 ms/div
Figure 19. Load Transient Response
Figure 20. Line Transient Response
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Enable Voltage
1 V/div, DC
Enable Voltage
1 V/div, DC
Output Voltage
2 V/div, DC
Output Voltage
2 V/div, DC
Inductor Current
200 mA/div, DC
Inductor Current
200 mA/div, DC
Output Current
10 mA/div, DC
Output Current
10 mA/div, DC
VIN = 1.2 V, VOUT = 3.3 V
VIN = 2.5 V, VOUT = 3.3 V
Time 400 ms/div
Time 400 ms/div
Figure 21. Startup After Enable
Figure 22. Startup After Enable
9.2.2 TPS61261 Application as LED Driver
L1
4.7 mH
0.8V to 3V
U1
TPS61261DRV
VIN
5 L
VOUT 4
6 VIN
C1
10mF
PWM
10 mA to
FB 3
2 EN
100 mA
RI 1
7 PGND
C2
10mF
D1
R2
ADIM
Analog Dimming
760mV-400mV
2kW
2kW
R1
Figure 23. TPS61260 LED Driver Application Circuit
9.2.2.1 Design Requirements
Table 4. Design Parameters
DESIGN PARAMETER
EXAMPLE VALUE
Input voltage range
1.2 V to 3 V
Output current rating
10 mA -100 mA
Operating frequency
2.5 MHz
9.2.2.2 Detailed Design Procedure
Figure 23 shows the TPS61261 configured to drive an LED with analog and/or PWM dimming. This circuit
does not require an external current sensing resistor and so provides high efficiency, as shown in Figure 24.
This design is available as the TPS61261EVM-208.
16
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SLVSA99C – MAY 2011 – REVISED APRIL 2018
9.2.2.3 TPS61261 Application as LED Driver Performance Plots
100
90
80
Efficiency (%)
70
60
50
40
30
VIN=1.2V
VIN=1.8V
20
VIN=2.4V
VIN=3V
10
0
10
20
30
40
50
60
70
80
90
100
LED Current (mA)
Figure 24. LED Driver Efficiency
10 Power Supply Recommendations
The device is designed to operate from an input voltage supply range between 1.2 V and 4.0 V. This input supply
must be well regulated. If the input supply is located more than a few inches from the converter, additional bulk
capacitance may be required in addition to the ceramic bypass capacitors. An electrolytic or tantalum capacitor
with a value of 47 μF is a typical choice.
11 Layout
11.1 Layout Guidelines
•
•
For all switching power supplies, layout is an important step in the design, especially at high peak currents
and high switching frequencies. If the layout is not carefully done, the regulator could show stability problems
as well as EMI problems. Therefore, use wide and short traces for the main current path and for the power
ground tracks. The input capacitor, output capacitor, and the inductor should be placed as close as possible
to the IC. Use a common ground node for power ground and a different one for control ground to minimize
the effects of ground noise. Connect these ground nodes at any place close to the ground pin of the IC.
The feedback divider should be placed as close as possible to the control ground connection. To lay out the
control ground, short traces are recommended as well, separated from the power ground traces. This avoids
ground shift problems, which can occur due to superimposition of power ground current and control ground
current. See Figure 25 for the recommended layout.
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www.ti.com
11.2 Layout Example
VIN
L1
VOUT
C2
C1
GND
R3
EN
GND
R2
R1
Figure 25. PCB Layout Suggestion
11.3 Thermal Considerations
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added
heat sinks and convection surfaces, and the presence of other heat-generating components affect the powerdissipation limits of a given component.
Three basic approaches for enhancing thermal performance are listed below.
• Improving the power dissipation capability of the PCB design
• Improving the thermal coupling of the component to the PCB by soldering the Exposed Thermal Pad
• Introducing airflow in the system
For more details on how to use the thermal parameters in the dissipation ratings table, please check the Thermal
Characteristics of Linear and Logic Packages Using JEDEC PCB Designs Application Report (SZZA017) and the
Semiconductor and IC Package Thermal Metrics Application Report (SPRA953).
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SLVSA99C – MAY 2011 – REVISED APRIL 2018
12 Device and Documentation Support
12.1 Device Support
12.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
12.2 Documentation Support
12.2.1 Related Documentation
TPS61261EVM-208 Evaluation Module User's Guide (SLVU851)
Thermal Characteristics of Linear and Logic Packages Using JEDEC PCB Designs Application Report
(SZZA017)
Semiconductor and IC Package Thermal Metrics Application Report (SPRA953)
12.3 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 5. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
TPS61260
Click here
Click here
Click here
Click here
Click here
TPS61261
Click here
Click here
Click here
Click here
Click here
12.4 Trademarks
All trademarks are the property of their respective owners.
12.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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23-Apr-2018
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TPS61260DRVR
ACTIVE
WSON
DRV
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
QWD
TPS61260DRVT
ACTIVE
WSON
DRV
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
QWD
TPS61261DRVR
ACTIVE
WSON
DRV
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
QWE
TPS61261DRVT
ACTIVE
WSON
DRV
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
QWE
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
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23-Apr-2018
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Apr-2018
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
TPS61260DRVR
WSON
DRV
6
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
3000
180.0
8.4
2.3
2.3
1.15
4.0
8.0
Q2
TPS61260DRVT
WSON
DRV
6
250
180.0
8.4
2.3
2.3
1.15
4.0
8.0
Q2
TPS61261DRVR
WSON
DRV
6
3000
180.0
8.4
2.3
2.3
1.15
4.0
8.0
Q2
TPS61261DRVT
WSON
DRV
6
250
180.0
12.4
2.3
2.3
1.15
4.0
8.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Apr-2018
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPS61260DRVR
WSON
DRV
6
3000
210.0
185.0
35.0
TPS61260DRVT
WSON
DRV
6
250
210.0
185.0
35.0
TPS61261DRVR
WSON
DRV
6
3000
210.0
185.0
35.0
TPS61261DRVT
WSON
DRV
6
250
210.0
185.0
35.0
Pack Materials-Page 2
GENERIC PACKAGE VIEW
DRV 6
WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
Images above are just a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4206925/F
PACKAGE OUTLINE
DRV0006A
WSON - 0.8 mm max height
SCALE 5.500
PLASTIC SMALL OUTLINE - NO LEAD
2.1
1.9
B
A
PIN 1 INDEX AREA
2.1
1.9
0.8
0.7
C
SEATING PLANE
0.08 C
(0.2) TYP
0.05
0.00
1 0.1
EXPOSED
THERMAL PAD
3
2X
1.3
4
7
1.6 0.1
6
1
4X 0.65
PIN 1 ID
(OPTIONAL)
6X
6X
0.3
0.2
0.35
0.25
0.1
0.05
C A
C
B
4222173/B 04/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
DRV0006A
WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
6X (0.45)
(1)
1
7
6
6X (0.3)
(1.6)
SYMM
(1.1)
4X (0.65)
4
3
SYMM
(R0.05) TYP
( 0.2) VIA
TYP
(1.95)
LAND PATTERN EXAMPLE
SCALE:25X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
SOLDER MASK
OPENING
METAL
METAL UNDER
SOLDER MASK
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
OPENING
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4222173/B 04/2018
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If some or all are implemented, recommended via locations are shown.
www.ti.com
EXAMPLE STENCIL DESIGN
DRV0006A
WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
6X (0.45)
1
SYMM
METAL
7
6
6X (0.3)
(0.45)
SYMM
4X (0.65)
(0.7)
4
3
(R0.05) TYP
(1)
(1.95)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD #7
88% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:30X
4222173/B 04/2018
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
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