Texas Instruments | REF30xx 50-ppm/°C Max, 50-μA, CMOS Voltage Reference in SOT-23-3 (Rev. H) | Datasheet | Texas Instruments REF30xx 50-ppm/°C Max, 50-μA, CMOS Voltage Reference in SOT-23-3 (Rev. H) Datasheet

Texas Instruments REF30xx 50-ppm/°C Max, 50-μA, CMOS Voltage Reference in SOT-23-3 (Rev. H) Datasheet
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SBVS032H – MARCH 2002 – REVISED FEBRUARY 2018
REF30xx 50-ppm/°C Max, 50-μA, CMOS Voltage Reference in SOT-23-3
1 Features
3 Description
•
•
•
•
•
•
The REF30xx is a precision, low-power, low-dropout
voltage, reference family available in a tiny 3-pin
SOT-23 package. The REF30xx offers excellent
temperature drift and initial accuracy while operating
at a quiescent current of 42 µA (typical).
1
microSize Package: SOT-23-3
Low Dropout: 1 mV
High Output Current: 25 mA
High Accuracy: 0.2%
Low IQ: 42 µA (Typical)
Excellent Specified Drift Performance:
– 50 ppm/°C (Maximum) From 0°C to 70°C
– 75 ppm/°C (Maximum) From –40°C to +125°C
2 Applications
•
•
•
•
•
Temperature and Pressure Transmitters
Portable, Battery-Powered Equipment
Data Acquisition Systems
Medical Equipment
Handheld Test Equipment
The low power consumption and the relatively high
precision make the REF30xx very attractive for looppowered industrial applications such as pressure and
temperature transmitter applications. The REF30xx is
easy to use in intrinsically safe and explosion-proof
applications because it does not require a load
capacitor to be stable. The REF30xx is specified over
the extended industrial temperature range of –40°C
to +125°C.
The REF30xx operates with supplies within 1 mV of
output voltage under zero-load conditions. Engineers
can use the low dropout, small size, and low power
consumption of the REF30xx in portable and batterypowered applications.
Device Information
PART NUMBER
REF30xx
Typical Application
REF3033
ADS7822
+In
CS
–In
DOUT
GND
300
1 μF to 10 μF
Microcontroller
Dropout Voltage (mV)
VIN
VS
+
2.92 mm × 1.30 mm
V+
GND
+ 1 μF to
10 μF
VCC
SOT-23 (3)
Dropout Voltage vs Load Current
5Ω
VREF
BODY SIZE (NOM)
350
3.3 V
0.1 μF
PACKAGE
250
200
150
100
50
DCLOCK
0
Copyright © 2016, Texas Instruments Incorporated
0
5
10
15
20
25
30
Load Current (mA)
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
REF3012, REF3020, REF3025, REF3030, REF3033, REF3040
SBVS032H – MARCH 2002 – REVISED FEBRUARY 2018
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Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Device Comparison Table.....................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
3
4
7.1
7.2
7.3
7.4
7.5
7.6
4
4
4
4
5
7
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Typical Characteristics ..............................................
Detailed Description ............................................ 11
8.1 Overview ................................................................. 11
8.2 Functional Block Diagram ....................................... 11
8.3 Feature Description................................................. 11
8.4 Device Functional Modes........................................ 13
9
Application and Implementation ........................ 15
9.1 Application Information............................................ 15
9.2 Typical Application .................................................. 15
10 Power Supply Recommendations ..................... 17
11 Layout................................................................... 17
11.1 Layout Guidelines ................................................. 17
11.2 Layout Example .................................................... 17
12 Device and Documentation Support ................. 18
12.1
12.2
12.3
12.4
12.5
12.6
12.7
Documentation Support ........................................
Related Links ........................................................
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
18
18
18
18
18
18
18
13 Mechanical, Packaging, and Orderable
Information ........................................................... 19
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision G (November 2015) to Revision H
Page
•
Changed section header From: REF33xx (REF3312, REF3318, REF3320, REF3325, REF3330, REF3333) To:
REF30xx (REF3012, REF3020, REF3025, REF3030, REF30333, REF3040) in the Electrical Characteristics.................... 6
•
Added turnon settling time TYP value of 120 µs (deleted by mistake in the previous revision) ........................................... 6
•
Added NOTE to the Application and Implementation section ............................................................................................. 15
Changes from Revision F (August 2008) to Revision G
Page
•
Added Device Information, ESD Ratings, Recommended Operating Conditions, and Thermal Information tables. ............. 1
•
Added Detailed Description, Applications and Implementation, Power-Supply Recommendations, Layout, Device
and Documentation Support, and Mechanical, Packaging, and Orderable Information sections .......................................... 1
•
Changed text in Description section ...................................................................................................................................... 1
•
Deleted thermal resistance parameter in Electrical Characteristics; see new Thermal Information table ............................. 6
•
Moved temperature parameters from Electrical Characteristics to Recommended Operating Conditions ............................ 6
2
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SBVS032H – MARCH 2002 – REVISED FEBRUARY 2018
5 Device Comparison Table
PART NUMBER
VOLTAGE (V)
REF3012
1.25
REF3020
2.048
REF3025
2.5
REF3030
3.0
REF3033
3.3
REF3040
4.096
6 Pin Configuration and Functions
DBZ Package
3-Pin SOT-23
Top View
IN
1
3
OUT
GND
2
Not to scale
Pin Functions
PIN
NO.
1
NAME
I/O
IN
Input
2
OUT
Output
3
GND
—
DESCRIPTION
Input supply voltage
Reference output voltage
Ground
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN
Supply voltage, V+ to V–
Output short-circuit current
(2)
–40
Junction temperature
Storage temperature, Tstg
(2)
UNIT
7.0
V
Continuous
Operating temperature
(1)
MAX
–65
125
°C
150
°C
150
°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Short circuit to ground.
7.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±4000
Charged-device model (CDM), per JEDEC specification JESD22-C101 (2)
±1500
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
at TA = 25°C, VIN = 5 V, and ILOAD = 0 mA (unless otherwise noted)
MIN
VIN
Input voltage
ILOAD
Load current
TA
Operating temperature
(1)
VREF + 0.05
NOM
MAX
(1)
–40
UNIT
5.5
V
25
mA
125
°C
For IL > 0, see Typical Characteristics. Minimum supply voltage for REF3012 is 1.8 V .
7.4 Thermal Information
REF30xx
THERMAL METRIC
(1)
DBZ (SOT-23)
UNIT
3 PINS
RθJA
Junction-to-ambient thermal resistance
297.3
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
128.5
°C/W
RθJB
Junction-to-board thermal resistance
91.7
°C/W
ψJT
Junction-to-top characterization parameter
12.8
°C/W
ψJB
Junction-to-board characterization parameter
90.3
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
°C/W
(1)
4
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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7.5 Electrical Characteristics
at TA = 25°C, VIN = 5 V, and ILOAD = 0 mA (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
1.2475
1.25
1.2525
UNIT
REF3012 (1.25 V) (1)
VOUT
Output voltage
Initial accuracy
V
0.2%
Output voltage noise
Line regulation
f = 0.1 Hz to 10 Hz
14
μVPP
f = 10 Hz to 10 kHz
42
µVrms
1.8 V ≤ VIN ≤ 5.5 V
60
190
2.048
2.052
µV/V
REF3020 (2.048 V)
VOUT
Output voltage
2.044
Initial accuracy
V
0.2%
Output voltage noise
f = 0.1 Hz to 10 Hz
23
f = 10 Hz to 10 kHz
65
VREF + 50 mV ≤ VIN ≤ 5.5 V
Line regulation
μVPP
µVrms
110
290
2.50
2.505
µV/V
REF3025 (2.5 V)
VOUT
Output voltage
2.495
Initial accuracy
V
0.2%
Output voltage noise
f = 0.1 Hz to 10 Hz
28
μVPP
f = 10 Hz to 10 kHz
80
µVrms
VREF + 50 mV ≤ VIN ≤ 5.5 V
Line regulation
120
325
3.0
3.006
µV/V
REF3030 (3.0 V)
VOUT
Output voltage
2.994
Initial accuracy
V
0.2%
Output voltage noise
f = 0.1 Hz to 10 Hz
33
μVPP
f = 10 Hz to 10 kHz
94
µVrms
VREF + 50 mV ≤ VIN ≤ 5.5 V
Line regulation
120
375
3.30
3.306
µV/V
REF3033 (3.3 V)
VOUT
Output voltage
3.294
Initial accuracy
V
0.2%
Output voltage noise
Line regulation
f = 0.1 Hz to 10 Hz
36
μVPP
f = 10 Hz to 10 kHz
105
µVrms
VREF + 50 mV ≤ VIN ≤ 5.5 V
130
400
4.096
4.104
µV/V
REF3040 (4.096 V)
VOUT
Output voltage
4.088
Initial accuracy
Output voltage noise
Line regulation
(1)
V
0.2%
f = 0.1 Hz to 10 Hz
45
μVPP
f = 10 Hz to 10 kHz
128
µVrms
VREF + 50 mV ≤ VIN ≤ 5.5 V
160
410
µV/V
The minimum supply voltage for the REF3012 is 1.8 V.
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Electrical Characteristics (continued)
at TA = 25°C, VIN = 5 V, and ILOAD = 0 mA (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
0°C ≤ TA ≤ 70°C
20
50
–30°C ≤ TA ≤ +85°C
28
60
–40°C ≤ TA ≤ +85°C
30
65
–40°C ≤ TA ≤ +125°C
35
75
0000h to 1000h
24
1000h to 2000h
15
UNIT
REF30xx (REF3012, REF3020, REF3025, REF3030, REF30333, REF3040)
dVOUT/dT
Output voltage temperature drift (2)
Long-term stability
ΔVO(ΔIL)
Load regulation (3)
dT
Thermal hysteresis (4)
VIN – VOUT
Dropout voltage
ISC
Short-circuit current
Turnon settling time
0 mA < ILOAD < 25 mA, VIN = VREF +
500 mV (1)
To 0.1% with CL = 1 μF
ppm/°C
ppm
3
100
µV/mA
25
100
ppm
1
50
mV
45
mA
120
µs
POWER SUPPLY
IQ
(2)
(3)
(4)
6
Quiescent current
42
–40°C ≤ TA ≤ +125°C
50
59
μA
Box method used to determine over temperature drift.
Typical value of load regulation reflects measurements using a force and sense contacts; see Load Regulation section.
Thermal hysteresis procedure explained in more detail in Thermal Hysteresis section.
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7.6 Typical Characteristics
50
100
45
90
40
80
35
70
Number of Units
Number of Units
at TA = 25°C, VIN = 5 V, and REF3025 used for typical characteristics (unless otherwise noted)
30
25
20
15
60
50
40
30
10
20
5
10
0
0
5
10 15 20 25 30 35 40 45 50 55 60 65
5
10 15 20 25 30 35 40 45 50 55 60 65
Drift (ppm/°C)
Drift (ppm/°C)
0°C to 70°C
–40°C to +125°C
Figure 1. Temperature Drift
Figure 2. Temperature Drift
35
Maximum Load Current (mA)
2.502
Output Voltage (V)
2.500
2.498
2.496
2.494
2.492
2.490
30
25
20
15
10
5
-40
0
-20
20
40
60
80
100
120
140
-40
-20
0
Temperature (°C)
40
60
80
100
120
140
Temperature (°C)
Figure 3. Output Voltage vs Temperature
Figure 4. Maximum Load Current vs Temperature
6
60
5
50
4
40
IQ (μA)
Load Regulation (μV/mA)
20
3
30
2
20
1
10
0
0
-40
-20
0
20
40
60
80
100
120
Temperature (°C)
Figure 5. Load Regulation vs Temperature
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140
-40
-20
0
20
40
60
80
100
120
140
Temperature (°C)
Figure 6. Quiescent Current vs Temperature
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Typical Characteristics (continued)
at TA = 25°C, VIN = 5 V, and REF3025 used for typical characteristics (unless otherwise noted)
100
150
Output Impedance (dB)
Line Regulation (μV/V)
200
100
50
0
10
1
0.1
0.01
-50
-40
0
-20
20
40
60
80
100
120
1
140
10
100
10k
100k
Figure 8. Output Impedance vs Frequency
Figure 7. Line Regulation vs Temperature
2.500010
80
2.500000
70
2.499990
Output Voltage (V)
90
60
PSRR (dB)
1k
Frequency (Hz)
Temperature (°C)
50
40
30
2.499980
2.499970
2.499960
2.499950
20
2.499940
10
2.499930
2.499920
0
1
10
100
1k
10k
2.5
100k
3
3.5
4
4.5
5
5.5
6
Supply (V)
Frequency (Hz)
No Load
Figure 10. Output Voltage vs Supply Voltage
2.500010
2.500100
2.500000
2.500000
2.499990
Output Voltage (V)
Output Voltage (V)
Figure 9. Power-Supply Rejection Ratio vs Frequency
2.500200
2.499900
2.499800
2.499700
2.499600
2.499500
2.499980
2.499970
2.499960
2.499950
2.499940
2.499400
2.499930
2.499300
2.5
3
3.5
4
4.5
5
5.5
Supply (V)
6
0
5
10
15
20
25
30
Load Current (mA)
ILOAD = 25 mA
Figure 11. Output Voltage vs Supply Voltage
8
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Figure 12. Output Voltage vs Load Current
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Typical Characteristics (continued)
3 V/div
VIN
5 V/div
VIN
1 V/div
VOUT
1 V/div
at TA = 25°C, VIN = 5 V, and REF3025 used for typical characteristics (unless otherwise noted)
VOUT
40 ms/div
10 ms/div
CL = 0, 3-V startup
CL = 0, 5-V startup
Figure 14. Step Response
IL = 1 mA
VIN
IL = 0 mA
20 mV/div
50 mV/div
500 mV/div
Figure 13. Step Response
VOUT
VOUT
10 ms/div
10 ms/div
CL = 0
Figure 16. 0-mA to 1-mA Load Transient
Figure 15. Line Transient Response
IL = 5 mA
IL = 6 mA
20 mV/div
20 mV/div
IL = 0 mA
VOUT
10 ms/div
CL = 0
Figure 17. 0-mA to 5-mA Load Transient
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IL = 0 mA
VOUT
40 ms/div
CL = 1 μF
Figure 18. 1-mA to 6-mA Load Transient
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Typical Characteristics (continued)
at TA = 25°C, VIN = 5 V, and REF3025 used for typical characteristics (unless otherwise noted)
IL = 25 mA
10 mV/div
20 mV/div
IL = 1 mA
VOUT
1.0 s/div
100 ms/div
CL = 1 μF
Figure 20. 0.1-Hz to 10-Hz Noise
Figure 19. 1-mA to 25-mA Load Transient
80
Absolute Output Voltage Drift (ppm)
Absolute Output Voltage Drift (ppm)
80
70
60
50
40
30
20
10
0
0
100
200
300
400
500
600
700
800
70
60
50
40
30
20
10
0
1000 1100 1200 1300 1400 1500 1600 1700 1800 1900 2000
900 1000
Time (hours)
Time (hours)
Figure 21. Long-Term Stability: 0 to 1000 Hours
Figure 22. Long-Term Stability: 1000 to 2000 Hours
Absolute Output Voltage Drift (ppm)
80
70
60
50
40
30
20
10
0
0
200
400
600
800 1000 1200 1400 1600 1800 2000
Time (hours)
Figure 23. Long-Term Stability: 0 to 2000 Hours
10
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8 Detailed Description
8.1 Overview
The REF30xx is a series, CMOS, precision bandgap voltage reference. Its basic topology is shown in the
Functional Block Diagram section. Transistors Q1 and Q2 are biased so that the current density of Q1 is greater
than that of Q2. The difference of the two base-emitter voltages, Vbe1 – Vbe2, has a positive temperature
coefficient and is forced across resistor R1. This voltage is gained up and added to the base-emitter voltage of
Q2, which has a negative coefficient. The resulting output voltage is virtually independent of temperature. The
curvature of the bandgap voltage, as shown in Figure 3, is due to the slightly nonlinear temperature coefficient of
the base-emitter voltage of Q2.
8.2 Functional Block Diagram
+
+
Vbe1 Vbe2
Q1
R1
Q2
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8.3 Feature Description
8.3.1 Supply Voltage
The REF30xx family of references features an extremely low dropout voltage. With the exception of the
REF3012, which has a minimum supply requirement of 1.8 V, the REF30xx can be operated with a supply of
only 1 mV above the output voltage in an unloaded condition. For loaded conditions, a typical dropout voltage
versus load is shown on the front page.
The REF30xx features a low quiescent current that is extremely stable over changes in both temperature and
supply. The typical room temperature quiescent current is 42 μA, and the maximum quiescent current over
temperature is just 59 μA. Additionally, the quiescent current typically changes less than 2.5 μA over the entire
supply range, as shown in Figure 24.
Supply voltages below the specified levels can cause the REF30xx to momentarily draw currents greater than
the typical quiescent current. Use a power supply with a fast rising edge and low output impedance to easily
prevent this issue.
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Feature Description (continued)
42.5
IQ (μA)
42.0
41.5
41.0
40.5
40.0
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
6
VIN (V)
Figure 24. Supply Current vs Supply Voltage
8.3.2 Thermal Hysteresis
Thermal hysteresis for the REF30xx is defined as the change in output voltage after operating the device at
25°C, cycling the device through the specified temperature range, and returning to 25°C, and can be expressed
as shown in Equation 1:
æ abs VPRE - VPOST ö
6
VHYST = ç
÷÷ • 10 (ppm)
ç
V
NOM
è
ø
where
•
•
•
VHYST = Calculated hysteresis
VPRE = Output voltage measured at 25°C pretemperature cycling
VPOST = Output voltage measured when device has been operated at 25°C, cycled through specified range of
–40°C to +125°C, and returned to operation at 25°C.
(1)
8.3.3 Temperature Drift
The REF30xx exhibits minimal drift error, defined as the change in output voltage over varying temperature.
Using the box method of drift measurement, the REF30xx features a typical drift coefficient of 20 ppm from 0°C
to 70°C, the primary temperature range of use for many applications. For industrial temperature ranges of –40°C
to +125°C, the REF30xx family drift increases to a typical value of 50 ppm.
8.3.4 Noise Performance
The REF30xx generates noise less than 50 μVPP between frequencies of 0.1 Hz to 10 Hz, and can be seen in
Figure 20 The noise voltage of the REF30xx increases with output voltage and operating temperature. Additional
filtering may be used to improve output noise levels; however, ensure the output impedance does not degrade
AC performance.
8.3.5 Long-Term Stability
Long-term stability refers to the change of the output voltage of a reference over a period of months or years.
This effect lessens as time progresses as is apparent by the long-term stability curves. The typical drift value for
the REF30xx is 24 ppm from 0 hours to 1000 hours, and 15 ppm from 1000 hours to 2000 hours. This parameter
is characterized by measuring 30 units at regular intervals for a period of 2000 hours.
12
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REF3012, REF3020, REF3025, REF3030, REF3033, REF3040
www.ti.com
SBVS032H – MARCH 2002 – REVISED FEBRUARY 2018
Feature Description (continued)
8.3.6 Load Regulation
Load regulation is defined as the change in output voltage as a result of changes in load current. Load regulation
for the REF30xx is measured using force and sense contacts as shown in Figure 25. The force and sense lines
tied to the contact area of the output pin reduce the impact of contact and trace resistance, resulting in accurate
measurement of the load regulation contributed solely by the REF30xx. For applications requiring improved load
regulation, use force and sense lines.
Output Pin
Contact and
Trace Resistance
+
VOUT
IL
Sense Line
Force Line
Load
Meter
Copyright © 2016, Texas Instruments Incorporated
Figure 25. Accurate Load Regulation of REF30xx
8.4 Device Functional Modes
8.4.1 Negative Reference Voltage
For applications requiring a negative and positive reference voltage, the OPA703 and REF30xx can be used to
provide a dual-supply reference from a ±5-V supply. Figure 26 shows the REF3025 used to provide a ±2.5-V
supply reference voltage. The low offset voltage and low drift of the OPA703 complement the low drift
performance of the REF30xx to provide an accurate solution for split-supply applications.
+5V
+2.5 V
REF3025
10 kW
10 kW
+5 V
OPA703
-2.5 V
-5 V
Copyright © 2016, Texas Instruments Incorporated
Figure 26. REF3025 Combined With OPA703 to Create Positive and Negative Reference Voltages.
Copyright © 2002–2018, Texas Instruments Incorporated
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13
REF3012, REF3020, REF3025, REF3030, REF3033, REF3040
SBVS032H – MARCH 2002 – REVISED FEBRUARY 2018
www.ti.com
Device Functional Modes (continued)
8.4.2 Data Acquisition
Often data acquisition systems require stable voltage references to maintain necessary accuracy. The REF30xx
family features stability and a wide range of voltages suitable for most microcontrollers and data converters.
Figure 27 and Figure 28 show two basic data acquisition systems.
3.3 V
REF3033
V+
GND
5Ω
+ 1 μF to
10 μF
VREF
0.1 μF
VCC
ADS7822
VIN
+In
CS
–In
DOUT
GND
VS
+
1 μF to 10 μF
Microcontroller
DCLOCK
Copyright © 2016, Texas Instruments Incorporated
Figure 27. Basic Data Acquisition System 1
2.5-V Supply
5Ω
2.5 V
+
VIN
REF3012
VOUT
1.25 V
VREF
VS
VCC
+
0.1 μF
ADS8324
1 μF to 10 μF
1 μF to 10 μF
GND
0 V to 1.25 V
+In
CS
–In
DOUT
GND
Microcontroller
DCLOCK
Copyright © 2016, Texas Instruments Incorporated
Figure 28. Basic Data Acquisition System 2
14
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Copyright © 2002–2018, Texas Instruments Incorporated
Product Folder Links: REF3012 REF3020 REF3025 REF3030 REF3033 REF3040
REF3012, REF3020, REF3025, REF3030, REF3033, REF3040
www.ti.com
SBVS032H – MARCH 2002 – REVISED FEBRUARY 2018
9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
For normal operation, the REF30xx does not require a capacitor on the output. If a capacitive load is connected,
take special care when using low equivalent series resistance (ESR) capacitors and high capacitance. This
precaution is especially true for low-output voltage devices; therefore, for the REF3012 use a low-ESR
capacitance of 10 μF or less. Figure 29 shows the typical connections required for operation of the REF30xx. A
supply bypass capacitor of 0.47 μF is always recommended.
VIN
1
0.47 mF
VOUT
REF30xx
3
2
Copyright © 2016, Texas Instruments Incorporated
Figure 29. Typical Connections for Operating REF30xx
9.2 Typical Application
Figure 30 shows a low-power reference and conditioning circuit. This circuit attenuates and level-shifts a bipolar
input voltage within the proper input range of a single-supply low power 16-Bit ΔΣ ADC, such as the one inside
the MSP430 or other similar single-supply ADCs. Precision reference circuits are used to level-shift the input
signal, provide the ADC reference voltage and to create a well-regulated supply voltage for the low-power analog
circuitry. A low-power, zero-drift, op-amp circuit is used to attenuate and level-shift the input signal.
3.3 V
REF3030
IN
3.0 V
OUT
1.25 V
R2
20 k
R3
100 k
20 k
3.0 V
MSP430F2013
Launchpad
3.3 V
VOUT
+
VIN
±5 V
J1.2/A1+
OPA317
+
±
IN+
J1.3/A1±
R4
±
REF3012
SD_16
A-ADC
R5
10 k
100 k
3.0 V
IN±
VREF
+
R1
1.25 V
J1.5/VREF
IN OUT
R6
47 k
R7
47 k
0.625 V
C2
47 µF
Copyright © 2016, Texas Instruments Incorporated
Figure 30. Low-Power Reference and Bipolar Voltage Conditioning Circuit for Low-Power ADCs
Copyright © 2002–2018, Texas Instruments Incorporated
Submit Documentation Feedback
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15
REF3012, REF3020, REF3025, REF3030, REF3033, REF3040
SBVS032H – MARCH 2002 – REVISED FEBRUARY 2018
www.ti.com
Typical Application (continued)
9.2.1 Design Requirements
• Supply Voltage: 3.3 V
• Maximum Input Voltage: ±6 V
• Specified Input Voltage: ±5 V
• ADC Reference Voltage: 1.25 V
The goal for this design is to accurately condition a ±5-V bipolar input voltage into a voltage suitable for
conversion by a low-voltage ADC with a 1.25-V reference voltage, VREF, and an input voltage range of VREF / 2.
The circuit should function with reduced performance over a wider input range of at least ±6 V to allow for easier
protection of overvoltage conditions.
9.2.2 Detailed Design Procedure
Figure 30 depicts a simplified schematic for this design showing the MSP430 ADC inputs and full input
conditioning circuitry. The ADC is configured for a bipolar measurement where final conversion result is the
differential voltage between the voltage at the positive and negative ADC inputs. The bipolar, GND-referenced
input signal must be level-shifted and attenuated by the op amp so that the output is biased to VREF / 2 and has
a differential voltage that is within the ±VREF / 2 input range of the ADC.
1.25
-0.0001
1
-0.00015
Error Voltage (V)
Output Voltage (V)
9.2.3 Application Curves
0.75
0.5
0.25
-0.0002
-0.00025
-0.0003
0
-0.00035
±6
±5
±4
±3
±2
±1
0
1
2
3
4
5
Input Voltage (V)
6
±6
±5
±4
±3
±2
±1
0
1
Input Voltage (V)
C001
Figure 31. OPA317 Output Voltage vs Input Voltage
2
3
4
5
6
C00
Figure 32. OPA317 Output Voltage Error vs Input Voltage
Output Code Error (# of codes)
150
100
50
0
±50
±100
±150
±200
±6
±5
±4
±3
±2
±1
0
1
2
3
4
5
Input Voltage (V)
6
C003
Figure 33. Output Code Error vs Input Voltage
16
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Product Folder Links: REF3012 REF3020 REF3025 REF3030 REF3033 REF3040
REF3012, REF3020, REF3025, REF3030, REF3033, REF3040
www.ti.com
SBVS032H – MARCH 2002 – REVISED FEBRUARY 2018
10 Power Supply Recommendations
The REF30xx family of references feature an extremely low-dropout voltage. These references can be operated
with a supply of only 50 mV above the output voltage. For loaded reference conditions, a typical dropout voltage
versus load is shown in the front page plot, Dropout Voltage vs Load Current. Use a supply bypass capacitor
greater than 0.47 µF.
11 Layout
11.1 Layout Guidelines
Figure 34 illustrates an example of a printed-circuit board (PCB) layout using the REF30xx. Some key
considerations are:
• Connect low-ESR, 0.1-μF ceramic bypass capacitors at VIN of the REF30xx
• Decouple other active devices in the system per the device specifications
• Use a solid ground plane to help distribute heat and reduces electromagnetic interference (EMI) noise pickup
• Place the external components as close to the device as possible. This configuration prevents parasitic errors
(such as the Seebeck effect) from occurring
• Minimize trace length between the reference and bias connections to the INA and ADC to reduce noise
pickup
• Do not run sensitive analog traces in parallel with digital traces. Avoid crossing digital and analog traces if
possible, and only make perpendicular crossings when absolutely necessary
11.2 Layout Example
To ADC
To Input Power Supply
IN
OUT
C
C
REF30xx
GND
Via to Ground Plane
Figure 34. Layout Example
Copyright © 2002–2018, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: REF3012 REF3020 REF3025 REF3030 REF3033 REF3040
17
REF3012, REF3020, REF3025, REF3030, REF3033, REF3040
SBVS032H – MARCH 2002 – REVISED FEBRUARY 2018
www.ti.com
12 Device and Documentation Support
12.1 Documentation Support
12.1.1 Related Documentation
CMOS, Rail-to-Rail, I/O Operational Amplifiers (SBOS180)
REF29xx 100 ppm/°C, 50 μA in 3-Pin SOT-23 CMOS Voltage Reference (SBVS033)
12.2 Related Links
Table 1 lists quick access links. Categories include technical documents, support and community resources,
tools and software, and quick access to sample or buy.
Table 1. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
REF3012
Click here
Click here
Click here
Click here
Click here
REF3020
Click here
Click here
Click here
Click here
Click here
REF3025
Click here
Click here
Click here
Click here
Click here
REF3030
Click here
Click here
Click here
Click here
Click here
REF3033
Click here
Click here
Click here
Click here
Click here
REF3040
Click here
Click here
Click here
Click here
Click here
12.3 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
12.4 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.5 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.6 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
12.7 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
18
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Copyright © 2002–2018, Texas Instruments Incorporated
Product Folder Links: REF3012 REF3020 REF3025 REF3030 REF3033 REF3040
REF3012, REF3020, REF3025, REF3030, REF3033, REF3040
www.ti.com
SBVS032H – MARCH 2002 – REVISED FEBRUARY 2018
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2002–2018, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: REF3012 REF3020 REF3025 REF3030 REF3033 REF3040
19
PACKAGE OPTION ADDENDUM
www.ti.com
7-Mar-2019
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
REF3012AIDBZR
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
R30A
REF3012AIDBZRG4
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
R30A
REF3012AIDBZT
ACTIVE
SOT-23
DBZ
3
250
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
R30A
REF3012AIDBZTG4
ACTIVE
SOT-23
DBZ
3
250
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
R30A
REF3020AIDBZR
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
R30B
REF3020AIDBZRG4
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
R30B
REF3020AIDBZT
ACTIVE
SOT-23
DBZ
3
250
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
R30B
REF3020AIDBZTG4
ACTIVE
SOT-23
DBZ
3
250
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
R30B
REF3025AIDBZR
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
R30C
REF3025AIDBZRG4
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
R30C
REF3025AIDBZT
ACTIVE
SOT-23
DBZ
3
250
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
R30C
REF3025AIDBZTG4
ACTIVE
SOT-23
DBZ
3
250
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
R30C
REF3030AIDBZR
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
R30F
REF3030AIDBZRG4
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
R30F
REF3030AIDBZT
ACTIVE
SOT-23
DBZ
3
250
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
R30F
REF3030AIDBZTG4
ACTIVE
SOT-23
DBZ
3
250
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
R30F
REF3033AIDBZR
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
R30D
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
7-Mar-2019
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
REF3033AIDBZRG4
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
R30D
REF3033AIDBZT
ACTIVE
SOT-23
DBZ
3
250
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
R30D
REF3033AIDBZTG4
ACTIVE
SOT-23
DBZ
3
250
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
R30D
REF3040AIDBZR
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
R30E
REF3040AIDBZT
ACTIVE
SOT-23
DBZ
3
250
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
R30E
REF3040AIDBZTG4
ACTIVE
SOT-23
DBZ
3
250
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
R30E
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
7-Mar-2019
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF REF3033 :
• Automotive: REF3033-Q1
NOTE: Qualified Version Definitions:
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
3-Aug-2017
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
REF3012AIDBZR
SOT-23
DBZ
3
3000
179.0
8.4
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
3.15
2.95
1.22
4.0
8.0
Q3
REF3012AIDBZT
SOT-23
DBZ
3
250
179.0
8.4
3.15
2.95
1.22
4.0
8.0
Q3
REF3020AIDBZR
SOT-23
DBZ
3
3000
179.0
8.4
3.15
2.95
1.22
4.0
8.0
Q3
REF3020AIDBZT
SOT-23
DBZ
3
250
179.0
8.4
3.15
2.95
1.22
4.0
8.0
Q3
REF3025AIDBZR
SOT-23
DBZ
3
3000
179.0
8.4
3.15
2.95
1.22
4.0
8.0
Q3
REF3025AIDBZT
SOT-23
DBZ
3
250
179.0
8.4
3.15
2.95
1.22
4.0
8.0
Q3
REF3030AIDBZR
SOT-23
DBZ
3
3000
179.0
8.4
3.15
2.95
1.22
4.0
8.0
Q3
REF3030AIDBZT
SOT-23
DBZ
3
250
179.0
8.4
3.15
2.95
1.22
4.0
8.0
Q3
REF3033AIDBZR
SOT-23
DBZ
3
3000
179.0
8.4
3.15
2.95
1.22
4.0
8.0
Q3
REF3033AIDBZT
SOT-23
DBZ
3
250
179.0
8.4
3.15
2.95
1.22
4.0
8.0
Q3
REF3040AIDBZR
SOT-23
DBZ
3
3000
179.0
8.4
3.15
2.95
1.22
4.0
8.0
Q3
REF3040AIDBZT
SOT-23
DBZ
3
250
179.0
8.4
3.15
2.95
1.22
4.0
8.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
3-Aug-2017
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
REF3012AIDBZR
SOT-23
DBZ
3
3000
203.0
203.0
35.0
REF3012AIDBZT
SOT-23
DBZ
3
250
203.0
203.0
35.0
REF3020AIDBZR
SOT-23
DBZ
3
3000
203.0
203.0
35.0
REF3020AIDBZT
SOT-23
DBZ
3
250
203.0
203.0
35.0
REF3025AIDBZR
SOT-23
DBZ
3
3000
203.0
203.0
35.0
REF3025AIDBZT
SOT-23
DBZ
3
250
203.0
203.0
35.0
REF3030AIDBZR
SOT-23
DBZ
3
3000
203.0
203.0
35.0
REF3030AIDBZT
SOT-23
DBZ
3
250
203.0
203.0
35.0
REF3033AIDBZR
SOT-23
DBZ
3
3000
203.0
203.0
35.0
REF3033AIDBZT
SOT-23
DBZ
3
250
203.0
203.0
35.0
REF3040AIDBZR
SOT-23
DBZ
3
3000
203.0
203.0
35.0
REF3040AIDBZT
SOT-23
DBZ
3
250
203.0
203.0
35.0
Pack Materials-Page 2
4203227/C
PACKAGE OUTLINE
DBZ0003A
SOT-23 - 1.12 mm max height
SCALE 4.000
SMALL OUTLINE TRANSISTOR
C
2.64
2.10
1.4
1.2
PIN 1
INDEX AREA
1.12 MAX
B
A
0.1 C
1
0.95
3.04
2.80
1.9
3X
3
0.5
0.3
0.2
2
(0.95)
C A B
0.25
GAGE PLANE
0 -8 TYP
0.10
TYP
0.01
0.20
TYP
0.08
0.6
TYP
0.2
SEATING PLANE
4214838/C 04/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-236, except minimum foot length.
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EXAMPLE BOARD LAYOUT
DBZ0003A
SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR
PKG
3X (1.3)
1
3X (0.6)
SYMM
3
2X (0.95)
2
(R0.05) TYP
(2.1)
LAND PATTERN EXAMPLE
SCALE:15X
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4214838/C 04/2017
NOTES: (continued)
4. Publication IPC-7351 may have alternate designs.
5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
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EXAMPLE STENCIL DESIGN
DBZ0003A
SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR
PKG
3X (1.3)
1
3X (0.6)
SYMM
3
2X(0.95)
2
(R0.05) TYP
(2.1)
SOLDER PASTE EXAMPLE
BASED ON 0.125 THICK STENCIL
SCALE:15X
4214838/C 04/2017
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
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