Texas Instruments | TPS6224X-Q1 Automotive 2.25MHz 300mA Step-Down Converter in TSOT23 Package | Datasheet | Texas Instruments TPS6224X-Q1 Automotive 2.25MHz 300mA Step-Down Converter in TSOT23 Package Datasheet

Texas Instruments TPS6224X-Q1 Automotive 2.25MHz 300mA Step-Down Converter in TSOT23 Package Datasheet
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TPS62243-Q1, TPS62244-Q1
SLVSEK3 – MARCH 2018
TPS6224X-Q1 Automotive 2.25MHz 300mA Step-Down Converter in TSOT23 Package
1 Features
3 Description
•
The TPS6224x-Q1 devices are high-efficiency
synchronous DC/DC step-down converters providing
a fixed output voltage and up to 300 mA of output
current. They offer low power consumption for
battery-powered/always-on automotive applications
like Remote Keyless Entry (RKE) or Passive Entry
Passive Start (PEPS) key fobs and base stations.
With an input voltage range of 2 V to 6 V, the devices
support applications powered by Li-MnO2 coin cell
batteries, Li-Ion batteries, two- (2S) and three-cell
(3S) alkaline, 3.3-V and 5-V input voltage rails. The
TPS6224x-Q1 operate at a 2.25-MHz fixed switching
frequency at high load current and enters the powersave mode operation at light load currents to maintain
high efficiency and low power consumption over the
entire load current range. The power-save mode is
optimized for low output-voltage ripple. In the
shutdown mode, the current consumption is reduced
to less than 1 μA. The TPS6224x-Q1 allow the use of
small inductors and capacitors to achieve a small
solution size, and is available in a 5-pin TSOT23
package.
1
•
•
•
•
•
•
•
•
•
AEC-Q100 Qualified with following results:
– Device Temperature Grade 1: -40°C to 125°C
Operating Junction Temeperature Range
Output Current Up to 300 mA
VIN Range From 2 V to 6 V
2.25-MHz Fixed-Frequency Operation in PWM
Mode
Power-Save Mode at Light Load Currents
Output Voltage Accuracy in PWM Mode ±1.5%
Fixed Output Voltages
– 1.80V TPS62243-Q1
– 1.25V TPS62244-Q1
15-μA Typical Quiescent Current
100% Duty Cycle for Lowest Dropout
Available in a TSOT 23 (5) 2.90-mm × 1.60-mm
Package
2 Applications
•
•
•
Remote Keyless Entry (RKE)
Passive Entry Passive Start (PEPS)
Advanced Driver Assistance Systems (ADAS)
– Front Camera, Surround View, and Park Assist
Device Information(1)
PART NUMBER
TPS6224X-Q1
TPS62244-Q1
CIN
4.7µF
ON
OFF
SW
VOUT 1.25V
Up to 300mA
COUT
10 µF
EN
GND
Efficiency vs Output Current
FB
Efficiency %
VIN
L1
2.2µH
BODY SIZE (NOM)
2.90 mm × 1.60 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Typical Application Schematic
VIN 2.0V to 6.0V
PACKAGE
TSOT (5)
95
90
VOUT = 1.25V
85
80
75
70
65
60
55
50
45
40
35
30
0.01
0.1
VIN = 2.3V
VIN = 2.7V
VIN = 3.0V
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
1
IOUT [mA ]
10
100
300
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS62243-Q1, TPS62244-Q1
SLVSEK3 – MARCH 2018
www.ti.com
Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Device Comparison Table.....................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
3
3
7.1
7.2
7.3
7.4
7.5
7.6
3
4
4
4
5
6
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Typical Characteristics ..............................................
8.4 Device Functional Modes.......................................... 8
9
Application and Implementation ........................ 10
9.1 Application Information............................................ 10
9.2 Typical Application .................................................. 10
10 Power Supply Recommendations ..................... 14
11 Layout................................................................... 15
11.1 Layout Guidelines ................................................. 15
11.2 Layout Example .................................................... 15
12 Device and Documentation Support ................. 16
12.1
12.2
12.3
12.4
12.5
12.6
Detailed Description .............................................. 7
8.1 Overview ................................................................... 7
8.2 Functional Block Diagram ......................................... 7
8.3 Feature Description................................................... 8
Third-Party Products Disclaimer ...........................
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
16
16
16
16
16
16
13 Mechanical, Packaging, and Orderable
Information ........................................................... 16
13.1 Package Option Addendum .................................. 17
4 Revision History
2
DATE
REVISION
NOTES
March 2018
*
Initial release.
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5 Device Comparison Table
(1)
PART NUMBER (1)
FIXED OUTPUT VOLTAGES [V]
OPERATING MODE
TPS62243-Q1
1.80 V
PFM/PWM with automatic transition
TPS62244-Q1
1.25 V
PFM/PWM with automatic transition
For all available packages, see the orderable addendum at the end of the data sheet.
6 Pin Configuration and Functions
DDC Package
5-Pin SOT
Top View
VIN
1
GND
2
EN
3
5
SW
4
FB
Not to scale
Pin Functions
PIN
NAME
I/O
NO.
DESCRIPTION
EN
3
I
This is the enable pin of the device. Pulling this pin to low forces the device into shutdown mode. Pulling
this pin to high enables the device. This pin must be terminated.
FB
4
I
Feedback Pin for the internal regulation loop. Connect the external resistor divider to this pin. In case of
fixed output voltage option, connect this pin directly to the output capacitor.
GND
2
PWR
SW
5
O
VIN
1
PWR
GND supply pin.
This is the switch pin and is connected to the internal MOSFET switches. Connect the inductor to this
terminal.
VIN power supply pin.
7 Specifications
7.1 Absolute Maximum Ratings (1)
MIN
VI
Input voltage
(2)
MAX
UNIT
–0.3
7
V
Voltage at EN
–0.3
VIN + 0.3, ≤7
V
Voltage on SW
–0.3
7
V
Peak output current
Internally limited
A
TJ
Maximum operating junction temperature
–40
150
°C
Tstg
Storage temperature
–65
150
°C
(1)
(2)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to network ground terminal.
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7.2 ESD Ratings
VALUE
Electrostatic
discharge
V(ESD)
(1)
Human-body model (HBM), per AEC Q100-002 (1)
±2000
Charged-device model (CDM), per AEC Q100-011
±750
UNIT
V
AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
VI
MIN
MAX
2
6
Supply voltage, VIN
IOUT
L
UNIT
V
Output current, 2.3V < VIN < 6V
300
mA
Output current, 2V ≤ VIN ≤ 2.3V
150
mA
Inductance
1.5
4.7
µH
COUT Output capacitance
4.7
10
µF
TJ
–40
125
°C
Operating junction temperature
7.4 Thermal Information
TPS6224X-Q1
THERMAL METRIC (1)
DDC (TSOT 23)
UNIT
5 PINS
RθJA
Junction-to-ambient thermal resistance
193.7
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
40.7
°C/W
RθJB
Junction-to-board thermal resistance
35
°C/W
ψJT
Junction-to-top characterization parameter
0.9
°C/W
ψJB
Junction-to-board characterization parameter
34.7
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
°C/W
(1)
4
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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7.5 Electrical Characteristics
TJ = -40°C to 125°C, typical values are at TJ = 25°C, unless otherwise noted. Specifications apply for condition VIN = 3.6 V.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
SUPPLY
IQ
IOUT = 0 mA. Pulse frequency modulation (PFM)
mode enabled, device not switching
Operating quiescent current
ISD
Shutdown current
UVLO
Undervoltage lockout threshold
15
μA
IOUT = 0 mA. PFM mode enabled, device switching,
VOUT = 1.25 V
18.5
EN = GND, TJ = 25°C
0.1
EN = GND
1
10
Falling
1.85
Rising
1.95
μA
V
ENABLE, MODE
VIH
High-level input voltage, EN
2 V ≤ VIN ≤ 6 V
1
VIL
Low-level input voltage, EN
2 V ≤ VIN ≤ 6 V,
0
IIN
Input bias current, EN
EN, MODE = GND or VIN
VIN
V
0.35
V
0.01
1
μA
240
480
180
380
POWER SWITCH
RDS(on)
ILIMF
TSD
High-side MOSFET ON-resistance
Low-side MOSFET ON-resistance
VIN = VGS = 3.6 V, TJ = 25°C
mΩ
Forward current limit MOSFET highside and low-side
VIN = VGS = 3.6 V,
Thermal shutdown
Increasing junction temperature
140
°C
Thermal shutdown hysteresis
Decreasing junction temperature
20
°C
0.54
0.95
A
OSCILLATOR
Oscillator frequency
2 V ≤ VIN ≤ 6 V, PWM Mode
VOUT
Output voltage
TPS62244 Q1 (fixed VOUT)
1.25
TPS62243 Q1 (fixed VOUT)
1.80
V
VREF
Internal reference voltage
600
mV
ƒSW
2
2.25
2.5
MHz
OUTPUT
Feedback voltage
VFB
PWM operation, 2 V ≤ VIN ≤ 6 V, in fixed output
voltage versions VFB = VOUT, See (1) ,TJ = 25°C
–1.5%
PWM operation, 2 V ≤ VIN ≤ 6 V, in fixed output
voltage versions VFB = VOUT, See (1)
–1.5%
Feedback voltage PFM mode
Device in PFM mode
0%
V
1.5%
2.5%
0%
Load regulation
PWM mode
–0.5
%/A
tStart up
Start-up time
Time from active EN to reach 95% of VOUT nominal
500
μs
tRamp
VOUT ramp UP time
Time to ramp from 5% to 95% of VOUT
250
μs
Leakage current into SW pin
VIN = 3.6 V, VIN = VOUT = VSW, EN = GND, TJ =
25°C (2)
Ilkg
VIN = 3.6 V, VIN = VOUT = VSW, EN = GND,
(1)
(2)
(2)
0.1
1
μA
10
For VIN = VO+ 0.6
The internal resistor divider network is disconnected from FB pin.
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7.6 Typical Characteristics
Table 1. Table of Graphs
FIGURE
Shutdown Current into VIN
vs Input Voltage
Figure 1
Quiescent Current
vs Input Voltage
Figure 2
Static Drain-Source On-State Resistance
vs Input Voltage
Figure 3
Figure 4
20
10
TJ = -40°C
TJ = 0°C
TJ = 25°C
TJ = 85°C
TJ = 115°C
TJ = 125°C
18
IQ - Quiescent Current − mA
ISD [PA]
1
0.1
0.01
0.001
2
2.5
3
3.5
4
VIN [V]
4.5
5
5.5
MODE = GND,
EN = VIN,
Device Not Switching
o
TJ = 85 C
16
o
TJ = 25 C
14
12
o
TJ = -40 C
10
6
SLVS
8
2
2.5
3
3.5
4
4.5
5
5.5
6
VIN − Input Voltage − V
500
TJ = -40°C
TJ = 25°C
TJ = 85°C
TJ = 125°C
450
400
350
300
250
200
150
100
50
0
2
2.5
3
3.5
4
VIN [V]
4.5
5
5.5
6
Figure 3. High Side Switch Static Drain-Source
On-State Resistance vs Input Voltage
6
Figure 2. Quiescent Current vs Input Voltage
RDS(ON) - Static Drain Source Resistance [mW]:
RDS(ON) - Static Drain Source Resistance [mW]:
Figure 1. Shutdown Current vs Input Voltage
400
TJ = -40°C
TJ = 25°C
TJ = 85°C
TJ = 125°C
350
300
250
200
150
100
50
0
2
2.5
3
3.5
4
VIN [V]
4.5
5
5.5
6
Figure 4. Low Side Switch Static Drain-Source
On-State Resistance vs Input Voltage
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8 Detailed Description
8.1 Overview
The TPS6224X-Q1 step-down converter typically operates with 2.25-MHz fixed-frequency pulse width modulation
(PWM) at moderate to heavy load currents. At light load currents, the converter can automatically enter power
save mode and then operates in PFM mode.
During PWM operation, the converter uses a unique fast-response voltage-mode control scheme with input
voltage feed-forward to achieve good line and load regulation, allowing the use of small ceramic input and output
capacitors. At the beginning of each clock cycle initiated by the clock signal, the high-side MOSFET switch is
turned on. The current then flows from the input capacitor through the high-side MOSFET switch through the
inductor to the output capacitor and load. During this phase, the current ramps up until the PWM comparator trips
and the control logic turns off the switch. The current limit comparator also turns off the switch if the current limit
of the high-side MOSFET switch is exceeded. After a dead time preventing shoot-through current, the low-side
MOSFET rectifier is turned on and the inductor current ramps down. The current then flows from the inductor to
the output capacitor and to the load. It returns back to the inductor through the low-side MOSFET rectifier.
The next cycle is initiated by the clock signal again turning off the low-side MOSFET rectifier and turning on the
high-side MOSFET switch.
8.2 Functional Block Diagram
VIN
Current
Limit Comparator
Thermal
Shutdown
VIN
Undervoltage
Lockout 1.8 V
Limit
EN
High Side
PFM Comparator
Reference
0.6 V VREF
FB
VREF
Control
Stage
Error Amplifier
Softstart
VOUT RAMP
CONTROL
Gate Driver
Anti-Shoot-Through
SW1
VREF
Integrator
FB
FB
Zero-Pole
AMP.
PWM
Comp.
Limit
RI 1
GND
Low Side
RI..N
R I3
Current
Limit Comparator
Sawtooth
Generator
2.25 MHz
Oscillator
Internal Resistor
Network
GND
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8.3 Feature Description
8.3.1 Undervoltage Lockout
The undervoltage lockout circuit prevents the device from malfunctioning at low input voltages and from
excessive discharge of the battery and disables the output stage of the converter. The undervoltage lockout
threshold is typically 1.85 V with falling VIN.
8.3.2 Enable
The device is enabled by setting the EN pin to high. During the start-up time (tStart up), the internal circuits are
settled and the soft-start circuit is activated. The EN input can be used to control power sequencing in a system
with various DC-DC converters. The EN pin can be connected to the output of another converter, to drive the EN
pin high and sequence supply rails. With EN pin = GND, the device enters shutdown mode in which all circuits
are disabled. In fixed-output voltage versions, the internal resistor divider network is then disconnected from FB
pin.
8.3.3 Thermal Shutdown
As soon as the junction temperature, TJ, exceeds 140°C (typical) the device goes into thermal shutdown. In this
mode, the high-side and low-side MOSFETs are turned off. The device continues its operation when the junction
temperature falls below the thermal shutdown hysteresis.
8.4 Device Functional Modes
8.4.1 Soft Start
The TPS6224X-Q1 device has an internal soft-start circuit that controls the ramp up of the output voltage. The
output voltage ramps up from 5% to 95% of its nominal value within typical 250 μs. This limits the inrush current
in the converter during ramp up and prevents possible input voltage drops when using a battery or high
impedance power source. The soft-start circuit is enabled within the start-up time, tStart up.
8.4.2 Power Save Mode
The power save mode is enabled. If the load current decreases, the converter enters power save mode operation
automatically. During power save mode, the converter skips switching and operates with reduced frequency in
PFM mode with a minimum-quiescent current to maintain high efficiency.
The transition from PWM mode to PFM mode occurs once the inductor current in the low-side MOSFET switch
becomes zero, which indicates discontinuous conduction mode.
During the power save mode, a PFM comparator monitors the output voltage. As the output voltage falls below
the PFM comparator threshold of VOUT nominal, the device starts a PFM current pulse. The high-side MOSFET
switch turns on, and the inductor current ramps up. After the on-time expires, the switch turns off and the lowside MOSFET switch turns on until the inductor current becomes zero.
The converter effectively delivers a current to the output capacitor and the load. If the load is below the delivered
current, the output voltage rises. If the output voltage is equal to or greater than the PFM comparator threshold,
the device stops switching and enters a sleep mode with typical 15-μA current consumption.
If the output voltage is still below the PFM comparator threshold, a sequence of further PFM current pulses are
generated until the PFM comparator threshold is reached. The converter starts switching again once the output
voltage drops below the PFM comparator threshold.
With a fast single-threshold comparator, the output-voltage ripple during PFM mode operation can be kept to a
minimum. The PFM pulse is time controlled, allowing the user to modify the charge transferred to the output
capacitor by the value of the inductor. The resulting PFM output voltage ripple and PFM frequency both depend
on the size of the output capacitor and the inductor value. Increasing output capacitor values and inductor values
minimize the output ripple. The PFM frequency decreases with smaller inductor values and increases with larger
values.
If the output current cannot be supported in PFM mode, the device exits PFM mode and enters PWM mode.
8
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Device Functional Modes (continued)
Output voltage
VOUT nominal
PWM + PFM
moderate to heavy load
PWM Mode
Light load
PFM Mode
Figure 5. Power Save Mode
8.4.2.1 100% Duty Cycle Low Dropout Operation
The device starts to enter 100% duty-cycle mode once the input voltage comes close to the nominal output
voltage. To maintain the output voltage, the high-side MOSFET switch is turned on 100% for one or more cycles.
With further decreasing VIN the high-side MOSFET switch is turned on completely. In this case, the converter
offers a low input-to-output voltage difference. This is particularly useful in battery-powered applications to
achieve longest operation time by taking full advantage of the entire battery voltage range.
The minimum input voltage to maintain regulation depends on the load current and output voltage, and can be
calculated as:
VINmin = VOmax + IOmax (RDS(on)max + RL)
where
•
•
•
•
IOmax = maximum output current plus inductor ripple current
RDS(on)max = maximum P-channel switch RDS(on)
RL = DC resistance of the inductor
VOmax = nominal output voltage plus maximum output voltage tolerance
(1)
8.4.3 Short-Circuit Protection
The high-side and low-side MOSFET switches are short-circuit protected with maximum switch current equal to
ILIMF. The current in the switches is monitored by current limit comparators. Once the current in the high-side
MOSFET switch exceeds the threshold of its current limit comparator, it turns off and the low-side MOSFET
switch is activated to ramp down the current in the inductor and high-side MOSFET switch. The high-side
MOSFET switch can only turn on again once the current in the low-side MOSFET switch has decreased below
the threshold of its current limit comparator.
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The following section discusses the design of the external components to complete the power supply design by
using typical applications as a reference.
9.2 Typical Application
VIN 2.0V to 6.0V
TPS62244-Q1
VIN
CIN
4.7µF
ON
L1
2.2µH
Up to 300mA
SW
COUT
10 µF
EN
OFF
VOUT 1.25V
GND
FB
Figure 6. TPS62244Q1, Fixed 1.25 V VOUT
VIN 2.0V to 6.0V
TPS62243-Q1
VIN
CIN
4.7µF
ON
L1
2.2µH
Up to 300mA
SW
COUT
10 µF
EN
OFF
VOUT 1.80V
GND
FB
Figure 7. TPS62243Q1, Fixed 1.80 V VOUT
9.2.1 Design Requirements
The device operates over an input voltage range from 2 V to 6 V. The output voltage setting is fixed.
9.2.2 Detailed Design Procedure
Table 2 shows the list of components for the Application Curves. Users must verify and validate these
components for suitability with their application before using the components.
Table 2. List of Components
VALUE
COMPONENT REFERENCE
PART NUMBER
MANUFACTURER (1)
4.7 μF, 6.3 V. X5R Ceramic
CIN
GRM188R60J475K
Murata
10 μF, 6.3 V. X5R Ceramic
COUT
GRM188R60J106M
Murata
L1
LPS3015
Coilcraft
2.2 μH, 110 mΩ
(1)
See Third-party Products Disclaimer
10
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9.2.2.1 Output Filter Design (Inductor and Output Capacitor)
The TPS6224X-Q1 device is designed to operate with inductors in the range of 1.5 μH to 4.7 μH and with output
capacitors in the range of 4.7 μF to 22 μF. The device is optimized for operation with a 2.2-μH inductor and
10‑μF output capacitor.
Larger or smaller inductor values can be used to optimize the performance of the device for specific operation
conditions. For stable operation, the L and C values of the output filter may not fall below 1-μH effective
Inductance and 3.5-μF effective capacitance.
9.2.2.1.1 Inductor Selection
The inductor value has a direct effect on the ripple current. The selected inductor must be rated for its DC
resistance and saturation current (Table 3). The inductor ripple current (ΔIL) decreases with higher inductance
and increases with higher VI or VO.
The inductor selection also has an impact on the output voltage ripple in the PFM mode. Higher inductor values
lead to lower-output voltage ripple and higher PFM frequency, and lower inductor values lead to a higher-output
voltage ripple with lower PFM frequency.
Equation 2 calculates the maximum inductor current in PWM mode under static load conditions. The saturation
current of the inductor should be rated higher than the maximum inductor current as calculated with Equation 3.
This is the recommendation because during heavy-load transients the inductor current rises above the calculated
value.
V
1 - OUT
VIN
DIL = VOUT ´
L´ƒ
(2)
ILmax = IOUTmax +
D IL
2
where
•
•
•
•
ƒ = Switching frequency (2.25-MHz typical)
L = Inductor value
ΔIL = Peak-to-Peak inductor ripple current
ILmax = Maximum inductor current
(3)
A more conservative approach is to select the inductor current rating just for the maximum switch current limit
ILIMF of the converter.
Accepting larger values of ripple current allows the use of low inductance values, but results in higher output
voltage ripple, greater core losses, and lower output current capability.
The total losses of the coil strongly impact the efficiency of the DC-DC conversion and consist of both the losses
in the DC resistance (R(DC)) and the following frequency-dependent components:
• The losses in the core material (magnetic hysteresis loss, especially at high switching frequencies)
• Additional losses in the conductor from the skin effect (current displacement at high frequencies)
• Magnetic field losses of the neighboring windings (proximity effect)
• Radiation losses
Table 3. List of Inductors
INDUCTANCE (μH)
(1)
DIMENSIONS (mm)
PART NUMBER
MANUFACTURER (1)
2
2.5 × 2 × 1
MIPS2520D2R2
FDK
2
2.5 × 2 × 1.2
MIPSA2520D2R2
FDK
2.2
2.5 × 2 × 1
KSLI-252010AG2R2
Hitachi Metals
2.2
2.5 × 2 × 1.2
LQM2HPN2R2MJ0L
Murata
2.2
3 × 3 × 1.4
LPS3015
Coilcraft
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9.2.2.1.2 Output Capacitor Selection
The advanced fast-response voltage-mode control scheme of the TPS6224X-Q1 device allows the use of tiny
ceramic capacitors. Ceramic capacitors with low-ESR values have the lowest-output voltage ripple and are
recommended. The output capacitor requires either an X7R or X5R dielectric. Y5V and Z5U dielectric capacitors,
aside from their wide variation in capacitance over temperature, become resistive at high frequencies.
At nominal load current, the device operates in PWM mode and the RMS ripple current is calculated as in
Equation 4:
V
1 - OUT
VIN
1
IRMSC OUT = VOUT ´
´
L´ƒ
2´ 3
(4)
At nominal load current, the device operates in PWM mode and the overall output voltage ripple is the sum of the
voltage spike caused by the output capacitor ESR plus the voltage ripple caused by charging and discharging the
output capacitor as in Equation 5:
V
1 - OUT
æ
ö
VIN
1
D VOUT = VOUT ´
´ç
+ ESR ÷
L´ƒ
è 8 ´ COUT ´ ƒ
ø
(5)
At light load currents, the converter operates in power save mode and the output voltage ripple depends on the
output capacitor and inductor value. Larger output capacitor and inductor values minimize the voltage ripple in
PFM mode and tighten DC output accuracy in PFM mode.
9.2.2.1.3 Input Capacitor Selection
The buck converter has a natural pulsating input current; therefore, a low-ESR input capacitor is required for best
input voltage filtering and minimizing the interference with other circuits caused by high-input voltage spikes. For
most applications, a 4.7-μF to 10-μF ceramic capacitor is recommended (Table 4). Because ceramic capacitors
lose up to 80% of their initial capacitance at 5 V, TI recommends using a 10-μF input capacitor for input voltages
greater than 4.5 V. The input capacitor can be increased without any limit for better input voltage filtering.
Take care when using only small ceramic input capacitors. When a ceramic capacitor is used at the input, and
the power is being supplied through long wires, such as from a wall adapter, a load step at the output, or VIN step
on the input, can induce ringing at the VIN pin. The ringing can couple to the output and be mistaken as loop
instability, or could even damage the part by exceeding the maximum ratings.
Table 4. List of Capacitors
CAPACITANCE (µF)
(1)
12
DIMENSIONS (mm)
PART NUMBER
MANUFACTURER (1)
4.7
0603: 1.6 × 0.8 × 0.8
GRM188R60J475K
Murata
10
0603: 1.6 × 0.8 × 0.8
GRM188R60J106M69D
Murata
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9.2.3 Application Curves
95
90
VOUT = 1.25V
85
80
75
70
65
60
55
50
45
40
35
30
0.01
0.1
1.312
1.300
1.288
1.275
VOUT [V]
Efficiency %
The conditions for below application curves are VIN = 3.0V, VOUT= 1.25V and the components listed in Table 2,
unless otherwise noted.
VIN = 2.3V
VIN = 2.7V
VIN = 3.0V
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
1
IOUT [mA ]
10
100
1.238
1.212
VIN = 2.3V
VIN = 2.7V
VIN = 3.0V
1.200
1.188
0.001
300
0.01
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
0.1
1
IOUT [mA ]
10
100 300
Figure 9. Output Voltage vs Output Current 1.25V VOUT
1.890
1.872
1.854
1.836
VIN = 2.3V
VIN = 2.7V
VIN = 3.0V
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
0.1
1
IOUT [mA ]
10
100
300
Figure 10. Efficiency vs Output Current, VOUT = 1.8V
VIN = 3V
RLoad = 100Ω
Figure 12. Start-Up Timing
VOUT = 1.25V
VOUT [V]
Efficiency %
1.250
1.225
Figure 8. Efficiency vs Output Current, VOUT = 1.25V
95
90
85
80
75
70
65
60
55
50
45
40
35
30
0.01
1.262
1.818
1.800
1.782
1.764
1.746
VIN = 2.3V
VIN = 2.7V
VIN = 3.0V
1.728
1.710
0.001
0.01
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
0.1
1
IOUT [mA ]
10
100 300
Figure 11. Output Voltage vs Output Current, VOUT = 1.8V
VIN = 3V
IOUT = 150mA
VOUT = 1.25V
Figure 13. Typical PWM Mode Operation
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VIN = 3V
www.ti.com
IOUT = 25mA
VOUT = 1.25V
Figure 14. Typical PFM Mode Operation
VIN = 3V
IOUT = 5mA to 150mA to 5mA
Rise / Fall Time 1µs
VOUT = 1.25V
Figure 16. Load Transient PFM / PWM Mode
VIN = 3V
IOUT = 1mA to 25mA to 1mA
Rise / Fall Time 1µs
VOUT = 1.25V
Figure 15. Load Transient PFM Mode
VIN = 2.3V to 2.7V to 2.3V
Rise / Fall Time 10µs
IOUT = 25mA
VOUT = 1.25V
Figure 17. Line Transient PFM Mode
10 Power Supply Recommendations
The TPS6224X-Q1 device has no special requirements for its input power supply. The input power supply output
current must be rated according to the supply voltage, output voltage, and output current of the TPS6224X-Q1.
14
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SLVSEK3 – MARCH 2018
11 Layout
11.1 Layout Guidelines
As for all switching power supplies, the layout is an important step in the design. Proper function of the device
demands careful attention to PCB layout. To get the specified performance, the board layout must be carefully
done. If not carefully done, the regulator could show poor line or load regulation, and additional stability issues as
well as EMI problems. Figure 18 shows an example of layout design with the TLV62242-Q1 device.
• Providing a low-inductance, low-impedance ground path is critical. Therefore, use wide and short traces for
the main current paths. The input capacitor as well as the inductor and output capacitor must be placed as
close as possible to the IC pins.
• The FB line must be connected directly to the output capacitor and the FB line must be routed away from
noisy components and traces (for example, the SW line).
• Because of the small package of this converter and the overall small solution size, the thermal performance of
the PCB layout is important. For good thermal performance, PCB design of at least four layers is
recommended.
11.2 Layout Example
VIN
VIN
SW
U1
GND
EN
FB
GND
VOUT
Figure 18. Suggested Layout for Fixed Output Voltage
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www.ti.com
12 Device and Documentation Support
12.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
12.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
12.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.4 Trademarks
E2E is a trademark of Texas Instruments.
12.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
16
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SLVSEK3 – MARCH 2018
13.1 Package Option Addendum
13.1.1 Packaging Information
(1)
Package
Type
Package
Drawing
Pins
Package
Qty
TPS62243QDDCRQ1
PREVIEW
SOT-23THIN
DDC
5
3000
Green (RoHS & no
Sb/Br)
CU NIPDAU
TPS62244QDDCRQ1
PREVIEW
SOT-23THIN
DDC
5
3000
Green (RoHS & no
Sb/Br)
CU NIPDAU
Orderable Device
(1)
(2)
(3)
(4)
(5)
(6)
Status
Eco Plan
(2)
Lead/Ball
Finish (3)
Op Temp (°C)
Device Marking (5) (6)
Level-1-260C-UNLIM
–40 to 115
1I3Z
Level-1-260C-UNLIM
–40 to 115
1I2Z
MSL Peak Temp
(4)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
space
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest
availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the
requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified
lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used
between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by
weight in homogeneous material)
space
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the
finish value exceeds the maximum column width.
space
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
space
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device
space
Multiple Device markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief
on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third
parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for
release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Submit Documentation Feedback
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13.1.2 Tape and Reel Information
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
B0 W
Reel
Diameter
Cavity
A0
B0
K0
W
P1
A0
Dimension designed to accommodate the component width
Dimension designed to accommodate the component length
Dimension designed to accommodate the component thickness
Overall width of the carrier tape
Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1
Q2
Q1
Q2
Q3
Q4
Q3
Q4
User Direction of Feed
Pocket Quadrants
Device
Package
Type
Package
Drawing
Pins
SPQ
Reel
Diameter
(mm)
Reel
Width W1
(mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
TPS62243QDDCRQ1
SOT-23THIN
DDC
5
3000
179.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
TPS62244QDDCRQ1
SOT-23THIN
DDC
5
3000
179.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
18
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TPS62243-Q1, TPS62244-Q1
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SLVSEK3 – MARCH 2018
TAPE AND REEL BOX DIMENSIONS
Width (mm)
W
L
H
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPS62243QDDCRQ1
SOT-23-THIN
DDC
5
3000
203.0
2.3.0
35.0
TPS62244QDDCRQ1
SOT-23-THIN
DDC
5
3000
203.0
2.3.0
35.0
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19
PACKAGE OPTION ADDENDUM
www.ti.com
12-Mar-2018
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TPS62243QDDCRQ1
ACTIVE
SOT-23-THIN
DDC
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
1I3Z
TPS62244QDDCRQ1
ACTIVE
SOT-23-THIN
DDC
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
1I2Z
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
12-Mar-2018
OTHER QUALIFIED VERSIONS OF TPS62243-Q1 :
• Catalog: TPS62243
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
8-May-2018
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
TPS62243QDDCRQ1
SOT23-THIN
DDC
5
3000
180.0
8.4
TPS62244QDDCRQ1
SOT23-THIN
DDC
5
3000
180.0
8.4
Pack Materials-Page 1
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
3.2
3.2
1.4
4.0
8.0
Q3
3.2
3.2
1.4
4.0
8.0
Q3
PACKAGE MATERIALS INFORMATION
www.ti.com
8-May-2018
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPS62243QDDCRQ1
SOT-23-THIN
DDC
5
3000
195.0
200.0
45.0
TPS62244QDDCRQ1
SOT-23-THIN
DDC
5
3000
195.0
200.0
45.0
Pack Materials-Page 2
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