Texas Instruments | TPS6213xA-Q1 3-V to 17-V 3-A Step-Down Converter with DCS-Control™ (Rev. D) | Datasheet | Texas Instruments TPS6213xA-Q1 3-V to 17-V 3-A Step-Down Converter with DCS-Control™ (Rev. D) Datasheet

Texas Instruments TPS6213xA-Q1 3-V to 17-V 3-A Step-Down Converter with DCS-Control™ (Rev. D) Datasheet
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TPS62130A-Q1, TPS62133A-Q1, TPS6213013A-Q1
SLVSCC2D – MAY 2014 – REVISED JANUARY 2018
TPS6213xA-Q1 3-V to 17-V 3-A Step-Down Converter with DCS-Control™
1 Features
3 Description
•
•
•
The TPS6213XA-Q1 devices are easy-to-use
synchronous step-down DC-DC converters optimized
for applications with high power density. A high
switching frequency of typically 2.5 MHz allows the
use of small inductors and provides fast transient
response as well as high output-voltage accuracy
through the use of the DCS-Control™ topology.
1
•
•
•
•
•
•
•
•
•
•
•
•
•
•
DCS-Control™ Topology
Qualified for Automotive Applications
AEC-Q100 Qualified With the Following Results:
– Device Temperature Grade: –40°C to 125°C
Operating Junction Temperature Range
– Device HBM ESD Classification Level 2
– Device CDM ESD Classification Level C4B
Input Voltage Range: 3 to 17V
Adjustable Output Voltage from 0.9 to 6V
Pin-Selectable Output Voltage (nominal, + 5%)
Programmable Soft Start and Tracking
Seamless Power Save Mode Transition
Quiescent Current of 17µA (typ.)
Selectable Operating Frequency
Power Good Output
100% Duty Cycle Mode
Short Circuit Protection
Over Temperature Protection
Pin to Pin Compatible with TPS62150A-Q1
Available in a 3 × 3 mm, VQFN-16 Package
Create a Custom Design Using the TPS62130AQ1 with the WEBENCH® Power Designer
With a wide operating input-voltage range of 3 to 17
V, the devices are ideally suited for systems powered
from intermediate bus power rails. The devices
support up to 3-A continuous output current at output
voltages between 0.9 V and 6 V (with 100% duty
cycle mode). The output-voltage startup ramp is
controlled by the soft-start pin, which allows operation
as either a standalone power supply or in tracking
configurations. Power sequencing is also possible by
configuring the enable and open-drain power-good
pins.
In power save mode, the devices show quiescent
current of about 17 μA from VIN. Power save mode
which is entered automatically and seamlessly if the
load is small, maintains high efficiency over the entire
load range. In shutdown mode, the devices are
turned off and shutdown current consumption is less
than 2 μA. The devices are packaged in a 16-pin
VQFN package measuring 3 × 3 mm (RGT).
Device Information(1)
2 Applications
•
•
•
•
PART NUMBER
PACKAGE
BODY SIZE (NOM)
TPS62130A-Q1
Automotive POL supply
Infotainment, CAN-, USB- power supply
Embedded Systems,
LDO Replacement
TPS62133A-Q1
VQFN (16)
3.00 mm x 3.00 mm
TPS6213013A-Q1
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
space
space
Typical Application Schematic
space
space
space
Efficiency vs Output Current
space
100
90
3.3V / 1A
2.2µH
10uF
PVIN
SW
AVIN
VOS
PG
EN
0.1uF
100k
1.21M
22uF
TPS62130A-Q1
VOUT
FSW
FB
SS/TR
AGND
DEF
PGND
383k
Efficiency (%)
12V
VIN=5V
80
VIN=12V
VIN=17V
70
60
3.3nF
50
Copyright © 2017, Texas Instruments Incorporated
40
0.0
VOUT=3.3V
fsw=1.25MHz
0.5
1.0
1.5
2.0
Output Current (A)
2.5
3.0
G001
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS62130A-Q1, TPS62133A-Q1, TPS6213013A-Q1
SLVSCC2D – MAY 2014 – REVISED JANUARY 2018
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Table of Contents
1
2
3
4
5
6
7
8
9
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Device Comparison Table.....................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
4
4
5
7.1
7.2
7.3
7.4
7.5
7.6
5
5
5
5
6
7
Absolute Maximum Ratings ......................................
ESD Ratings ............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Typical Characteristics ..............................................
Parameter Measurement Information .................. 8
Detailed Description .............................................. 9
9.1 Overview ................................................................... 9
9.2 Functional Block Diagram ......................................... 9
9.3 Feature Description................................................. 10
9.4 Device Functional Modes........................................ 13
10 Application and Implementation........................ 15
10.1 Application Information.......................................... 15
10.2 Typical Application ............................................... 15
10.3 System Examples ................................................. 27
11 Power Supply Recommendations ..................... 31
12 Layout................................................................... 32
12.1 Layout Guidelines ................................................. 32
12.2 Layout Example .................................................... 32
13 Device and Documentation Support ................. 33
13.1
13.2
13.3
13.4
13.5
13.6
13.7
Device Support......................................................
Related Links ........................................................
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
33
33
33
33
33
33
33
14 Mechanical, Packaging, and Orderable
Information ........................................................... 34
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision C (July 2017) to Revision D
Page
•
Changed pin 7 from "LOG" to "FSW" in the Pin Functions table for clarification .................................................................. 4
•
Deleted extra text string "..or 1.25 MHz, selectable with the FSW" after 1st paragraph of Pulse Width Modulation
(PWM) Operation section. .................................................................................................................................................... 10
•
Deleted extra text "..with FSW=Low" preceding Equation 1. ............................................................................................... 11
Changes from Revision B (October 2016) to Revision C
Page
•
Added WEBENCH® links throughout document ................................................................................................................... 1
•
Changed "LOG" pin to "FSW" pin on the Pin Configuration drawing, and added FSW description throughout the
document. .............................................................................................................................................................................. 4
•
Added SW (AC) spec to the Absolute Maximum Ratings (1) table. ........................................................................................ 5
•
Added Power Good Pin Logic Table table and Frequency Selection (FSW) section regarding pin control. ....................... 13
Changes from Revision A (October 2016) to Revision B
Page
•
Deleted "Product Preview " status from TPS6213013A-Q1 device ...................................................................................... 1
•
Added text to Frequency Selection (FSW) section regarding pin control............................................................................. 13
•
Added Receiving Notification of Documentation Updates and Community Resources sections ......................................... 33
2
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SLVSCC2D – MAY 2014 – REVISED JANUARY 2018
Changes from Original (May 2014) to Revision A
Page
•
Added TPS6213013A-Q1 device .......................................................................................................................................... 1
•
Added TPS6213013A-Q1 to Device Comparison Table ....................................................................................................... 4
•
Moved Storage temperature spec., Tstg to Absolute Maximum Ratings table, and re-named Handling Ratings table
to ESD Ratings ...................................................................................................................................................................... 5
•
Corrected Thermal Information table ..................................................................................................................................... 5
•
Added Figure 27, Figure 28, Figure 31, and Figure 32 ....................................................................................................... 23
•
Added Figure 33, Figure 34 ................................................................................................................................................. 24
•
Added Figure 52 .................................................................................................................................................................. 30
•
Changed Figure 55 .............................................................................................................................................................. 32
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5 Device Comparison Table
PART NUMBER
OUTPUT VOLTAGE
TPS62130A-Q1
adjustable
PACKAGE MARKING
PA6IQ
TPS62133A-Q1
5V
PA6JQ
TPS6213013A-Q1
1.3 V
13013Q
6 Pin Configuration and Functions
SW
3
PG
4
PGND
VOS
EN
13
Exposed
Thermal Pad
5
6
7
8
DEF
2
14
FSW
SW
15
AGND
1
16
FB
SW
PGND
RGT Package
16-Pin VQFN
Top View
12
PVIN
11
PVIN
10
AVIN
9
SS/TR
Pin Functions
PIN (1)
NO.
NAME
DESCRIPTION
1,2,3
SW
O
Switch node, which is connected to the internal MOSFET switches. Connect inductor between SW and
output capacitor.
4
PG
O
Output power good (High = VOUT ready, Low = VOUT below nominal regulation) ; open drain (requires pullup resistor)
5
FB
I
Voltage feedback of adjustable version. Connect resistive voltage divider to this pin. It is recommended to
connect FB to AGND on fixed output voltage versions for improved thermal performance.
6
AGND
7
FSW
I
Switching Frequency Select (Low=2.5MHz, High=1.25MHz for typical operation) (2)
8
DEF
I
Output Voltage Scaling (Low = nominal, High = nominal + 5%) (2)
9
SS/TR
I
Soft-Start / Tracking Pin. An external capacitor connected to this pin sets the internal voltage reference rise
time. It can be used for tracking and sequencing.
10
AVIN
I
Supply voltage for control circuitry. Connect to same source as PVIN.
11,12
PVIN
I
Supply voltage for power stage. Connect to same source as AVIN.
13
EN
I
Enable input (High = enabled, Low = disabled) (2)
14
VOS
I
Output voltage sense pin and connection for the control loop circuitry.
15,16
(1)
(2)
(3)
Analog Ground. Must be connected directly to the Exposed Thermal Pad and common ground plane.
PGND
Exposed Thermal Pad
4
I/O
Power Ground. Must be connected directly to the Exposed Thermal Pad and common ground plane.
–
Must be connected to AGND (pin 6), PGND (pin 15,16) and common ground plane (3). Must be soldered to
achieve appropriate power dissipation and mechanical reliability.
For more information about connecting pins, see Detailed Description and Application and Implementation sections.
An internal pull-down resistor keeps logic level low, if pin is floating.
See Figure 55.
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SLVSCC2D – MAY 2014 – REVISED JANUARY 2018
7 Specifications
7.1 Absolute Maximum Ratings (1)
Pin voltage
(2)
MIN
MAX
AVIN, PVIN
–0.3
20
EN, SS/TR, SW (DC)
–0.3
VIN+0.3
–2
24.5
SW (AC), less than 10ns (3)
DEF, FSW, FB, PG, VOS
–0.3
Power Good sink current PG
UNIT
V
7
V
10
mA
Temperature
Operating junction temperature, TJ
–40
150
°C
Storage temperature
Tstg
–65
150
°C
(1)
(2)
(3)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to network ground terminal.
While switching.
7.2 ESD Ratings
VALUE
V(ESD) (1)
(1)
(2)
Electrostatic
discharge
Human body model (HBM), per AEC Q100-002 (2)
±2000
Charged device model (CDM), per AEC Q100-011
±500
UNIT
V
Electrostatic discharge (ESD) measures device sensitivity and immunity to damage caused by assembly line electrostatic discharges
into the device.
AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
7.3 Recommended Operating Conditions
VIN
Supply Voltage
at AVIN and PVIN
VOUT
Output Voltage Range
TPS62130A-Q1
TJ
Operating junction temperature
MIN
TYP MAX
3
17
UNIT
V
0.9
6
V
–40
125
°C
7.4 Thermal Information
TPS6213xA-Q1
THERMAL METRIC (1)
RGT
UNIT
16 PINS
RθJA
Junction-to-ambient thermal resistance
45
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
53.6
°C/W
RθJB
Junction-to-board thermal resistance
17.4
°C/W
ψJT
Junction-to-top characterization parameter
1.1
°C/W
ψJB
Junction-to-board characterization parameter
17.4
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
4.5
°C/W
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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7.5 Electrical Characteristics
over junction temperature range (TJ = –40°C to +125°C), typical values at VIN = 12V and TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP MAX
UNIT
SUPPLY
VIN
Input voltage range
17
V
IQ
Operating quiescent current
EN=High, IOUT=0mA, device not switching
17
30
µA
ISD
Shutdown current (1)
EN=Low
1.5
25
µA
2.7
2.8
VUVLO
3
Undervoltage lockout threshold
TSD
Falling Input Voltage (PWM mode operation)
2.6
Hysteresis
200
Thermal shutdown temperature
160
Thermal shutdown hysteresis
V
mV
°C
20
CONTROL (EN, DEF, FSW, SS/TR, PG)
VH
High level input threshold voltage (EN,
DEF, FSW)
VL
Low level input threshold voltage (EN,
DEF, FSW)
ILKG
Input leakage current (EN, DEF, FSW)
VTH_PG
Power good threshold voltage
VOL_PG
Power good output low
IPG=–2mA
ILKG_PG
Input leakage current (PG)
VPG=1.8V
ISS/TR
SS/TR pin source current
0.9
EN=VIN or GND; DEF, FSW=GND
V
0.3
V
0.01
1
µA
Rising (%VOUT)
92%
95%
98%
Falling (%VOUT)
87%
90%
94%
0.07
0.3
V
1
400
nA
2.5
2.7
µA
VIN≥6V
90
170
VIN=3V
120
VIN≥6V
40
VIN=3V
50
2.3
POWER SWITCH
High-side MOSFET ON-resistance
RDS(ON)
Low-side MOSFET ON-resistance
ILIMF
High-side MOSFET forward current limit
VIN =12V, TA= 25°C
3.6
70
4.2
4.9
mΩ
mΩ
A
OUTPUT
VREF
Internal reference voltage
ILKG_FB
Input leakage current (FB)
VFB=0.8V
Output voltage range (TPS62130A-Q1)
VIN ≥ VOUT
DEF (Output voltage programming)
DEF=0 (GND)
VOUT
DEF=1 (VOUT)
VOUT+5%
VOUT
(1)
(2)
6
Output voltage accuracy (2)
0.8
V
1
0.9
PWM mode operation, VIN ≥ VOUT +1V
–1.8%
Power Save Mode operation, COUT=22µF
–2.3%
100
nA
6.0
V
1.8%
2.8%
Load regulation
VIN=12V, VOUT=3.3V, PWM mode operation
0.05
%/A
Line regulation
3V ≤ VIN ≤ 17V, VOUT=3.3V, IOUT= 1A, PWM
mode operation
0.02
%/V
Current into AVIN+PVIN pin.
This is the regulation accuracy of the voltage at the FB pin (adjustable version) and of the output voltage (fixed version).
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SLVSCC2D – MAY 2014 – REVISED JANUARY 2018
7.6 Typical Characteristics
Figure 1. Quiescent Current
Figure 2. Shutdown Current
Figure 3. High-side Switch Resistance
Figure 4. Low-Side Switch Resistance
Figure 5. Maximum Output Current
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8 Parameter Measurement Information
Table 1. List of Components
REFERENCE
DESCRIPTION
IC
17V, 3A Step-Down Converter, QFN
MANUFACTURER
L1
2.2µH, 0.165 x 0.165 in
C1
10µF, 25V, Ceramic, 1210
Standard
C3
22µF, 6.3V, Ceramic, 0805
Standard
C5
3300pF, 25V, Ceramic, 0603
Standard
C7
0.1µF, 25V, Ceramic, 0603
Standard
R1
depending on VOUT
R2
depending on VOUT
R3
100kΩ, Chip, 0603, 1/16W, 1%
TPS62130AQRGT, Texas Instruments
XFL4020-222MEB, Coilcraft
Standard
space
L1
VIN
C1
PVIN
SW
AVIN
VOS
VOUT
R3
PG
FB
TPS62130A-Q1
FB
SS/TR
PG
R1
DEF
AGND
R2
FSW
PGND
EN
C7
C5
C3
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Figure 6. Measurement Setup (High Switching Frequency)
spacing
VIN
L1
C1
PVIN
SW
AVIN
VOS
C5
VOUT
R3
PG
FB
TPS62130A-Q1
SS/TR
FB
PG
R1
DEF
AGND
R2
FSW
PGND
EN
C7
VOUT
C3
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Figure 7. Measurement Setup (Low Switching Frequency)
spacing
8
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9 Detailed Description
9.1 Overview
The TPS6213xA-Q1 synchronous switched mode power converters are based on DCS-Control™ (Direct Control
with Seamless Transition into Power Save Mode), an advanced regulation topology, that combines the
advantages of hysteretic, voltage mode and current mode control including an AC loop directly associated to the
output voltage. This control loop takes information about output voltage changes and feeds it directly to a fast
comparator stage. It sets the switching frequency, which is constant for steady state operating conditions, and
provides immediate response to dynamic load changes. To get accurate DC load regulation, a voltage feedback
loop is used. The internally compensated regulation network achieves fast and stable operation with small
external components and low ESR capacitors.
The DCS-Control™ topology supports PWM (Pulse Width Modulation) mode for medium and heavy load
conditions and a Power Save Mode at light loads. During PWM, it operates at its nominal switching frequency in
continuous conduction mode. This frequency is typically about 2.5 MHz or 1.25MHz with a controlled frequency
variation depending on the input voltage. If the load current decreases, the converter enters Power Save Mode to
sustain high efficiency down to very light loads. In Power Save Mode the switching frequency decreases linearly
with the load current. Since DCS-Control™ supports both operation modes within one single building block, the
transition from PWM to Power Save Mode is seamless without effects on the output voltage.
9.2 Functional Block Diagram
PG
Soft
start
Thermal
Shtdwn
UVLO
AVIN
PVIN PVIN
PG control
HS lim
comp
EN*
SW
SS/TR
power
control
control logic
DEF
gate
drive
SW
*
SW
FSW
comp
LS lim
VOS
direct control
&
compensation
ramp
_
FB
comparator
+
timer tON
error
amplifier
DCS - ControlTM
*
This pin is connected to a pull down resistor internally
(see Feature Description section).
AGND
PGND PGND
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Figure 8. TPS62130A-Q1 (Adjustable Output Voltage)
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Functional Block Diagram (continued)
PG
Soft
start
Thermal
Shtdwn
UVLO
AVIN
PVIN PVIN
PG control
HS lim
comp
EN*
SW
SS/TR
power
control
control logic
gate
drive
SW
*
DEF
SW
FSW
comp
LS lim
VOS
direct control
&
compensation
ramp
_
FB*
comparator
+
timer tON
error
amplifier
DCS - ControlTM
*
This pin is connected to a pull down resistor internally
(see Feature Description section).
AGND
PGND PGND
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Figure 9. TPS6213013A-Q1 and TPS62133A-Q1 (Fixed output Voltage)
9.3 Feature Description
9.3.1 Pulse Width Modulation (PWM) Operation
The TPS6213xA-Q1 operate with pulse width modulation in continuous conduction mode (CCM) with a nominal
switching frequency of 2.5 MHz or 1.25 MHz, selectable with the FSW pin. The frequency variation in PWM is
controlled and depends on VIN, VOUT and the inductance. The device operates in PWM mode as long the output
current is higher than half the inductor's ripple current. To maintain high efficiency at light loads, the device
enters Power Save Mode at the boundary to discontinuous conduction mode (DCM). PSM operation occurs if the
output current becomes smaller than half the inductor's ripple current.
9.3.2 Power Save Mode Operation
The built in Power Save Mode of the TPS6213xA-Q1 is entered seamlessly, if the load current decreases. This
secures a high efficiency in light load operation. The device remains in Power Save Mode as long as the inductor
current is discontinuous.
In Power Save Mode, the switching frequency decreases linearly with the load current maintaining high
efficiency. The transition into and out of Power Save Mode happens within the entire regulation scheme and is
seamless in both directions.
10
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Feature Description (continued)
TPS6213xA-Q1 includes a fixed on-time circuitry. This on-time, in steady-state operation with FSW=Low, can be
estimated as:
space
t ON =
VOUT
× 400ns
V IN
(1)
space
For very small output voltages, an absolute minimum on-time of about 80ns is kept to limit switching losses. The
operating frequency is thereby reduced from its nominal value, keeping efficiency high. Also the off-time can
reach its minimum value at high duty cycles. The output voltage remains regulated in such case. Using tON, the
typical peak inductor current in Power Save Mode can be approximated by:
space
I LPSM ( peak ) =
(V IN - VOUT )
× t ON
L
(2)
space
When VIN decreases to typically 15% above VOUT, the TPS6213xA-Q1 does not enter Power Save Mode,
regardless of the load current. The device maintains output regulation in PWM mode.
9.3.3 100% Duty-Cycle Operation
The duty cycle of the buck converter is given by D=VOUT/VIN and increases as the input voltage comes close to
the output voltage. In this case, the device starts 100% duty cycle operation turning on the high-side switch
100% of the time. The high-side switch stays turned on as long as the output voltage is below the internal set
point. This allows the conversion of small input to output voltage differences, e.g. for longest operation time of
battery-powered applications. In 100% duty cycle mode, the low-side FET is switched off.
The minimum input voltage to maintain output voltage regulation, depending on the load current and the output
voltage level, can be calculated as:
spacing
VIN (min) = VOUT (min) + I OUT (RDS ( on ) + RL )
where:
•
•
•
IOUT is the output current,
RDS(on) is the RDS(on) of the high-side FET and
RL is the DC resistance of the inductor used.
(3)
space
9.3.4 Enable / Shutdown (EN)
When Enable (EN) is set High, the device starts operation. Shutdown is forced if EN is pulled Low with a
shutdown current of typically 1.5µA. During shutdown, the internal power MOSFETs as well as the entire control
circuitry are turned off. The internal resistive divider pulls down the output voltage smoothly. The EN signal must
be set externally to High or Low. The typical threshold values are 0.65V (rising) and 0.45V (falling). An internal
pull-down resistor of about 400kΩ is connected and keeps EN logic low, if Low is set initially and then the pin
gets floating. It is disconnected if the pin is set High.
Connecting the EN pin to an appropriate output signal of another power rail provides sequencing of multiple
power rails.
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Feature Description (continued)
9.3.5 Soft Start / Tracking (SS/TR)
The internal soft start circuitry controls the output voltage slope during startup, avoiding excessive inrush current
and ensures a controlled output voltage rise time. It also prevents unwanted voltage drops from high-impedance
power sources or batteries. When EN is set to start device operation, the device starts switching after a delay of
about 50µs and VOUT rises with a slope controlled by an external capacitor connected to the SS/TR pin. See
Figure 41 and Figure 42 for typical startup operation.
Using a very small capacitor (or leaving SS/TR pin un-connected) provides fastest startup behavior. The
TPS6213xA-Q1 can start into a pre-biased output. During monotonic pre-biased startup, both of the power
MOSFETs are not allowed to turn on until the device's internal ramp sets an output voltage above the pre-bias
voltage. As long as the output is below about 0.5V, a reduced current limit of typically 1.6A is set internally. If the
device is set to shutdown (EN=GND), undervoltage lockout or thermal shutdown, an internal resistor pulls the
SS/TR pin down to ensure a proper low level. Returning from those states causes a new startup sequence as set
by the SS/TR connection.
A voltage supplied to SS/TR can be used for tracking a master voltage. The output voltage will follow this voltage
in both directions up and down (see Application and Implementation).
9.3.6 Current Limit And Short Circuit Protection
The TPS6213xA-Q1 is protected against heavy load and short circuit events. If a short circuit is detected (VOUT
drops below 0.5V), the current limit is reduced to 1.6A typically. If the output voltage rises above 0.5V, the device
runs in normal operation again. At heavy loads, the current limit determines the maximum output current. If the
current limit is reached, the high-side FET turns off. Avoiding shoot through current, the low-side FET switches
on to allow the inductor current to decrease. The low-side current limit is typically 3.5A. The high-side FET turns
on again, only if the current in the low-side FET has decreased below the low-side current limit threshold.
The output current of the device is limited by the current limit (see Electrical Characteristics). Due to internal
propagation delay, the actual current can exceed the static current limit during that time. The dynamic current
limit can be calculated as follows:
I peak ( typ ) = I LIMF +
VL
× t PD
L
where
•
•
•
•
ILIMF is the static current limit, specified in the Electrical Characteristics,
L is the inductor value,
VL is the voltage across the inductor (VIN - VOUT) and
tPD is the internal propagation delay.
(4)
The current limit can exceed static values, especially if the input voltage is high and very small inductances are
used. The dynamic high side switch peak current can be calculated as follows:
spacing
I peak (typ ) = I LIMF +
(VIN - VOUT )× 30ns
L
(5)
9.3.7 Power Good (PG)
The TPS6213xA-Q1 has a built in power good (PG) function to indicate whether the output voltage has reached
its appropriate level or not. The PG signal can be used for startup sequencing of multiple rails. The PG pin is an
open-drain output that requires a pull-up resistor (to any voltage below 7V). It can sink 2mA of current and
maintain its specified logic low level. TPS6213xA-Q1 features PG=Low when the device is turned off due to EN,
UVLO or thermal shutdown and can be used to actively discharge VOUT (see Figure 46). VIN must remain present
for the PG pin to stay Low. If unused, the PG pin may be left floating.
space
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Feature Description (continued)
Table 2. Power Good Pin Logic Table
PG Logic Status
Device State
High Impedance
VFB ≥ VTH_PG
Enable (EN=High)
Low
√
VFB ≤ VTH_PG
√
√
Shutdown (EN=Low)
UVLO
0.7 V < VIN < VUVLO
√
TJ > TSD
√
Thermal Shutdown
Power Supply Removal
VIN < 0.7 V
√
space
9.3.8 Pin-Selectable Output Voltage (DEF)
The output voltage of the TPS6213xA-Q1 can be increased by 5% above the nominal voltage by setting the DEF
pin to High (1). When DEF is Low, the device regulates to the nominal output voltage. Increasing the nominal
voltage allows adapting the power supply voltage to the variations of the application hardware. More detailed
information on voltage margining using TPS6213xA-Q1 can be found in SLVA489. A pull down resistor of about
400kOhm is internally connected to the pin, to ensure a proper logic level if the pin is high impedance or floating
after initially set to Low. The resistor is disconnected if the pin is set High.
9.3.9 Frequency Selection (FSW)
To get high power density with very small solution size, a high switching frequency allows the use of small
external components for the output filter. However switching losses increase with the switching frequency. If
efficiency is the key parameter, more than solution size, the switching frequency can be set to half (1.25 MHz
typ.) by pulling FSW to High. Running with lower frequency a higher efficiency, but also a higher output voltage
ripple, is achieved. Pull FSW to Low for high frequency operation (2.5 MHz typ.). To get low ripple and full output
current at the lower switching frequency, it's recommended to use an inductor of at least 2.2uH. The switching
frequency can be changed during operation, if needed. A pull down resistor of about 400kOhm is internally
connected to the pin, acting the same way as at the DEF Pin (see above).
9.3.10 Under Voltage Lockout (UVLO)
If the input voltage drops, the under voltage lockout prevents misoperation of the device by switching off both the
power FETs. The under voltage lockout threshold is set typically to 2.7V. The device is fully operational for
voltages above the UVLO threshold and turns off if the input voltage trips the threshold. The converter starts
operation again once the input voltage exceeds the threshold by a hysteresis of typically 200mV.
9.3.11 Thermal Shutdown
The junction temperature (TJ) of the device is monitored by an internal temperature sensor. If TJ exceeds 160°C
(typ), the device goes into thermal shutdown. Both the high-side and low-side power FETs are turned off and PG
goes Low. When TJ decreases below the hysteresis amount, the converter resumes normal operation, beginning
with Soft Start. To avoid unstable conditions, a hysteresis of typically 20°C is implemented on the thermal
shutdown temperature.
9.4 Device Functional Modes
9.4.1 Operation Above TJ=125°C
The operating junction temperature of the device is specified up to 125°C. In power supplying circuits, the self
heating effect causes, that the junction temperature, TJ, is even higher than the ambient temperature TA (see
Figure 43). Depending on TA and the load current, the maximum operating TJ can be exceeded. However, the
electrical characteristics are specified up to a TJ of 125°C only. The device operates as long as thermal
shutdown threshold is not triggered.
(1)
Maximum allowed voltage is 7V. Therefore it's recommended to connect it to VOUT, not VIN.
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Device Functional Modes (continued)
9.4.2 Operation with VIN < 3V
The device is functional for supply voltages below 3V and above the UVLO threshold. Parameters may differ
from specified values. The minimum VIN value of 3V is not violated by UVLO threshold and hysteresis variations.
9.4.3 Operation with Separate EN Control
The EN pin can be connected to VIN or be controlled separately. While the EN control voltage level can be lower
than the actual VIN value, it must not exceed VIN to avoid damage of the device. This might happen at low VIN,
during startup or power sequencing.
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10 Application and Implementation
10.1 Application Information
TPS62130xA-Q1 are synchronous switch mode step-down converters, able to convert a 3V to 17V input voltage
into a lower, 0.9V to 6V, output voltage, providing up to 3A load current. The following section gives guidance on
choosing external components to complete the power supply design. Application Curves are included for the
typical application shown here.
10.2 Typical Application
space
10.2.1 TPS62130A-Q1 Point-Of-Load Step Down Converter
space
L1
2.2 µH
12V
C1
10uF
C7
0.1uF
C5
3.3nF
PVIN
SW
AVIN
VOS
EN
PG
TPS62130A-Q1
SS/TR
FB
DEF
AGND
FSW
PGND
3.3V / 3A
R3
100k
R1
1.21M
C3
22uF
R2
383k
Copyright © 2017, Texas Instruments Incorporated
Figure 10. Typical Schematic for 3.3 V Step-Down Converter
space
10.2.1.1 Design Requirements
The step-down converter design can be adapted to different output voltage and load current needs by choosing
external components appropriate. The following design procedure is adequate for whole VIN, VOUT and load
current range of TPS62130A-Q1. Using Table 3, the design procedure needs minimum effort.
10.2.1.2 Detailed Design Procedure
10.2.1.2.1 Custom Design With WEBENCH® Tools
Click here to create a custom design using the TPS62130A-Q1 device with the WEBENCH® Power Designer.
1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements.
2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial.
3. Compare the generated design with other possible solutions from Texas Instruments.
The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time
pricing and component availability.
In most cases, these actions are available:
• Run electrical simulations to see important waveforms and circuit performance
• Run thermal simulations to understand board thermal performance
• Export customized schematic and layout into popular CAD formats
• Print PDF reports for the design, and share the design with colleagues
Get more information about WEBENCH tools at www.ti.com/WEBENCH.
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Typical Application (continued)
10.2.1.2.2 Programming The Output Voltage
The TPS6213xA-Q1 can be programmed for output voltages from 0.9V to 6V by using a resistive divider from
VOUT to AGND. The voltage at the FB pin is regulated to 800mV. The value of the output voltage is set by the
selection of the resistive divider from Equation 6 (see Figure 10). It is recommended to choose resistor values
which allow a current of at least 2uA, meaning the value of R2 shouldn't exceed 400kΩ. Lower resistor values
are recommended for highest accuracy and most robust design. For applications requiring lowest current
consumption, the use of fixed output voltage versions is recommended.
space
ö
æV
R1 = R 2 ç OUT - 1÷
ø
è 0.8V
(6)
space
In case the FB pin gets opened, the device clamps the output voltage at the VOS pin internally to about 7.4V.
10.2.1.2.3 External Component Selection
The external components have to fulfill the needs of the application, but also the stability criteria of the device's
control loop. The TPS6213xA-Q1 is optimized to work within a range of external components. The LC output
filter's inductance and capacitance must be considered together, creating a double pole, responsible for the
corner frequency of the converter (see Output Filter And Loop Stability). Table 3 can be used to simplify the
output filter component selection.
Table 3. Recommended LC Output Filter Combinations (1)
4.7µF
10µF
22µF
47µF
100µF
200µF
√
√
√
√
(2)
√
√
√
√
√
√
400µF
0.47µH
1µH
2.2µH
√
3.3µH
√
√
4.7µH
(1)
(2)
The values in the table are nominal values.
This LC combination is the standard value and recommended for most applications.
space
The TPS6213xA-Q1 can be run with an inductor as low as 1µH. FSW should be set Low in this case. However,
for applications running with the low frequency setting (FSW=High) or with low input voltages, 2.2µH is
recommended.
More detailed information on further LC combinations can be found in SLVA463.
10.2.1.2.4 Inductor Selection
The inductor selection is affected by several effects like inductor ripple current, output ripple voltage, PWM-toPSM transition point and efficiency. In addition, the inductor selected has to be rated for appropriate saturation
current and DC resistance (DCR). Equation 7 and Equation 8 calculate the maximum inductor current under
static load conditions.
spacing
I L(max) = I OUT (max) +
DI L(max)
2
(7)
spacing
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DI L(max) = VOUT
V
æ
ç 1 - OUT
ç V IN (max)
×ç
L
×f
ç (min) SW
ç
è
ö
÷
÷
÷
÷
÷
ø
where:
•
•
•
•
IL(max) is the maximum inductor current,
ΔIL is the Peak to Peak Inductor Ripple Current,
L(min) is the minimum effective inductor value and
fSW is the actual PWM Switching Frequency.
(8)
space
Calculating the maximum inductor current using the actual operating conditions gives the minimum saturation
current of the inductor needed. A margin of about 20% is recommended to add. A larger inductor value is also
useful to get lower ripple current, but increases the transient response time and solution size as well. The
following inductors have been used with the TPS6213xA-Q1 and are recommended for use:
Table 4. List of Inductors (1)
(1)
(2)
Type
Inductance [µH]
Current [A] (2)
Dimensions [LxBxH]
mm
MANUFACTURER
XFL4020-102ME_
1.0 µH, ±20%
4.7
4 x 4 x 2.1
Coilcraft
XFL4020-152ME_
1.5 µH, ±20%
4.2
4 x 4 x 2.1
Coilcraft
XFL4020-222ME_
2.2 µH, ±20%
3.8
4 x 4 x 2.1
Coilcraft
IHLP1212BZ-11
1.0 µH, ±20%
4.5
3 x 3.6 x 2
Vishay
IHLP1212BZ-11
2.2 µH, ±20%
3.0
3 x 3.6 x 2
Vishay
SRP4020-3R3M
3.3µH, ±20%
3.3
4.8 x 4 x 2
Bourns
VLC5045T-3R3N
3.3µH, ±30%
4.0
5 x 5 x 4.5
TDK
See Third-Party Products Disclaimer.
Lower of IRMS at 40°C rise or ISAT at 30% drop.
spacing
The inductor value also determines the load current at which Power Save Mode is entered:
I load ( PSM ) =
1
DI L
2
(9)
Using Equation 8, this current level can be adjusted by changing the inductor value.
10.2.1.2.5 Output Capacitor
The recommended value for the output capacitor is 22uF. The architecture of the TPS6213xA-Q1 allows the use
of tiny ceramic output capacitors with low equivalent series resistance (ESR). These capacitors provide low
output voltage ripple and are recommended. To keep its low resistance up to high frequencies and to get narrow
capacitance variation with temperature, it's recommended to use an X7R or X5R dielectric. Using a higher value
can have some advantages like smaller voltage ripple and a tighter DC output accuracy in Power Save Mode
(see SLVA463).
Note: In power save mode, the output voltage ripple depends on the output capacitance, its ESR and the peak
inductor current. Using ceramic capacitors provides small ESR and low ripple.
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10.2.1.2.6 Input Capacitor
For most applications, 10µF is sufficient and is recommended, though a larger value reduces input current ripple
further. The input capacitor buffers the input voltage during transient events and also decouples the converter
from the supply. A low ESR multilayer ceramic capacitor is recommended for best filtering and should be placed
between PVIN and PGND as close as possible to those pins. Even though AVIN and PVIN must be supplied
from the same input source, it's required to place a capacitance of 0.1uF from AVIN to AGND, to avoid potential
noise coupling. An RC, low-pass filter from PVIN to AVIN may be used but is not required.
10.2.1.2.7 Soft Start Capacitor
A capacitance connected between SS/TR pin and AGND allows a user programmable start-up slope of the
output voltage. A constant current source supports 2.5µA to charge the external capacitance. The capacitor
required for a given soft-start ramp time for the output voltage is given by:
space
C SS = t SS ×
2.5mA
1.25V
[F ]
where:
•
•
CSS is the capacitance (F) required at the SS/TR pin and
tSS is the desired soft-start ramp time (s).
(10)
spacing
space
NOTE
DC Bias effect: High capacitance ceramic capacitors have a DC Bias effect, which will
have a strong influence on the final effective capacitance. Therefore the right capacitor
value has to be chosen carefully. Package size and voltage rating in combination with
dielectric material are responsible for differences between the rated capacitor value and
the effective capacitance.
spacing
10.2.1.2.8 Tracking Function
If a tracking function is desired, the SS/TR pin can be used for this purpose by connecting it to an external
tracking voltage. The output voltage tracks that voltage. If the tracking voltage is between 50mV and 1.2V, the
FB pin tracks the SS/TR pin voltage as described in Equation 11 and shown in Figure 11.
spacing
VFB » 0.64 × VSS / TR
(11)
VSS/
TR [V]
1.2
0.8
0.4
0.2
0.4
0.6
0.8
VFB [V]
Figure 11. Voltage Tracking Relationship
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Once the SS/TR pin voltage reaches about 1.2V, the internal voltage is clamped to the internal feedback voltage
and device goes to normal regulation. This works for rising and falling tracking voltages with the same behavior,
as long as the input voltage is inside the recommended operating conditions. For decreasing SS/TR pin voltage,
the device doesn't sink current from the output. So, the resulting decrease of the output voltage may be slower
than the SS/TR pin voltage if the load is light. When driving the SS/TR pin with an external voltage, do not
exceed the voltage rating of the SS/TR pin which is VIN+0.3V.
If the input voltage drops into undervoltage lockout or even down to zero, the output voltage will go to zero,
independent of the tracking voltage. Figure 12 shows how to connect devices to get ratiometric and simultaneous
sequencing by using the tracking function.
spacing
VOUT1
PVIN
SW
AVIN
VOS
EN
PG
TPS62130A-Q1
FB
SS/TR
DEF
AGND
FSW
PGND
PVIN
SW
AVIN
VOS
VOUT2
R1
EN
R2
DEF
AGND
FSW
PGND
PG
TPS62130A-Q1
SS/TR
FB
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Figure 12. Sequence for Ratiometric and Simultaneous Startup
spacing
The resistive divider of R1 and R2 can be used to change the ramp rate of VOUT2 faster, slower or the same as
VOUT1.
A sequential startup is achieved by connecting the PG pin of VOUT1 to the EN pin of VOUT2. Ratiometric start
up sequence happens if both supplies are sharing the same soft start capacitor. Equation 10 calculates the soft
start time, though the SS/TR current has to be doubled. Details about these and other tracking and sequencing
circuits are found in SLVA470.
Note: If the voltage at the FB pin is below its typical value of 0.8V, the output voltage accuracy may have a wider
tolerance than specified.
10.2.1.2.9 Output Filter And Loop Stability
The devices of the TPS6213xA-Q1 family are internally compensated to be stable with L-C filter combinations
corresponding to a corner frequency to be calculated with Equation 12:
space
f LC =
1
2p L × C
(12)
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space
Proven nominal values for inductance and ceramic capacitance are given in Table 3 and are recommended for
use. Different values may work, but care has to be taken on the loop stability which is affected. More information
including a detailed LC stability matrix can be found in SLVA463.
The TPS6213xA-Q1 includes an internal 25pF feedforward capacitor, connected between the VOS and FB pins.
This capacitor impacts the frequency behavior and sets a pole and zero in the control loop with the resistors of
the feedback divider, per equation Equation 13 and Equation 14:
spacing
f zero =
1
2p × R1 × 25 pF
(13)
spacing
f pole =
1
2p × 25 pF
æ 1
1 ö
÷÷
× çç
+
è R1 R 2 ø
(14)
spacing
Though the TPS6213xA-Q1 is stable without the pole and zero being in a particular location, adjusting their
location to the specific needs of the application can provide better performance in Power Save mode and/or
improved transient response. An external feedforward capacitor can also be added. A more detailed discussion
on the optimization for stability vs. transient response can be found in SLVA289 and SLVA466.
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10.2.1.3 Application Curves
100.0
100.0
90.0
90.0
80.0
80.0
70.0
60.0
Efficiency (%)
Efficiency (%)
At VIN=12V, VOUT=3.3V and TA=25°C, FSW=Low, (unless otherwise noted)
VIN=17V
50.0
VIN=12V
40.0
30.0
60.0
IOUT=10mA
50.0
IOUT=1mA
40.0
0.001
0.01
0.1
Output Current (A)
1
VOUT=5.0V
L=2.2uH (XFL4020)
Cout=22uF
20.0
VOUT=5.0V
L=2.2uH (XFL4020)
Cout=22uF
10.0
10.0
0.0
10
7
100.0
100.0
90.0
90.0
11
12
13
Input Voltage (V)
14
15
16
17
G001
80.0
70.0
VIN=12V
VIN=17V
Efficiency (%)
Efficiency (%)
10
Figure 14. Efficiency vs. Input Voltage
80.0
60.0
50.0
40.0
30.0
70.0
60.0
IOUT=10mA
50.0
IOUT=1mA
IOUT=1A
IOUT=100mA
40.0
30.0
20.0
0.001
0.01
0.1
Output Current (A)
1
VOUT=5.0V
L=2.2uH (XFL4020)
Cout=22uF
20.0
VOUT=5.0V
L=2.2uH (XFL4020)
Cout=22uF
10.0
10.0
0.0
10
7
9
10
11
12
13
Input Voltage (V)
14
15
16
17
G001
FSW = High
Figure 15. Efficiency vs. Output Current
Figure 16. Efficiency vs. Input Voltage
100.0
100.0
90.0
90.0
80.0
80.0
60.0
VIN=12V
Efficiency (%)
70.0
50.0
8
G001
FSW = High
Efficiency (%)
9
FSW = Low
Figure 13. Efficiency vs. Output Current
VIN=17V
VIN=5V
40.0
30.0
70.0
60.0
IOUT=100mA
50.0
IOUT=1mA
IOUT=10mA
IOUT=1A
40.0
30.0
20.0
0.001
0.01
0.1
Output Current (A)
1
FSW = Low
VOUT=3.3V
L=2.2uH (XFL4020)
Cout=22uF
20.0
VOUT=3.3V
L=2.2uH (XFL4020)
Cout=22uF
10.0
0.0
0.0001
8
G001
FSW = Low
0.0
0.0001
IOUT=1A
IOUT=100mA
30.0
20.0
0.0
0.0001
70.0
10.0
10
0.0
4
5
6
G001
7
8
9 10 11 12 13 14 15 16 17
Input Voltage (V)
G001
FSW = Low
Figure 17. Efficiency vs. Output Current
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Figure 18. Efficiency vs. Input Voltage
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100.0
100.0
90.0
90.0
80.0
70.0
VIN=12V
60.0
VIN=17V
Efficiency (%)
Efficiency (%)
80.0
VIN=5V
50.0
40.0
30.0
60.0
IOUT=1A IOUT=100mA
0.001
0.01
0.1
Output Current (A)
1
VOUT=3.3V
L=2.2uH (XFL4020)
Cout=22uF
10.0
0.0
10
4
7
8
9 10 11 12 13 14 15 16 17
Input Voltage (V)
G001
Figure 20. Efficiency vs. Input Voltage
100.0
100.0
90.0
90.0
80.0
80.0
70.0
VIN=12V
60.0
Efficiency (%)
Efficiency (%)
6
FSW = High
Figure 19. Efficiency vs. Output Current
50.0
5
G001
FSW = High
VIN=17V
VIN=5V
40.0
30.0
70.0
IOUT=1A
60.0
IOUT=100mA
50.0
IOUT=10mA
IOUT=1mA
40.0
30.0
20.0
0.001
0.01
0.1
Output Current (A)
1
FSW = High
VOUT=1.8V
L=2.2uH (XFL4020)
Cout=22uF
20.0
VOUT=1.8V
L=2.2uH (XFL4020)
Cout=22uF
10.0
10.0
10
0.0
3
4
5
G001
6
7
8 9 10 11 12 13 14 15 16 17
Input Voltage (V)
G001
FSW = High
Figure 21. Efficiency vs. Output Current
FSW = High
Figure 22. Efficiency vs. Input Voltage
FSW = High
Figure 23. Efficiency vs. Output Current
22
IOUT=1mA
40.0
20.0
VOUT=3.3V
L=2.2uH (XFL4020)
Cout=22uF
10.0
0.0
0.0001
IOUT=10mA
50.0
30.0
20.0
0.0
0.0001
70.0
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Figure 24. Efficiency vs. Input Voltage
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SLVSCC2D – MAY 2014 – REVISED JANUARY 2018
3.40
3.40
Output Voltage (V)
Output Voltage (V)
VIN=17V
3.35
VIN=12V
3.30
VIN=5V
3.25
VOUT=3.3V
L=2.2uH (XFL4020)
Cout=22uF
3.20
0.0001
0.001
0.01
0.1
Output Current (A)
1
IOUT=100mA
3.25
VOUT=3.3V
L=2.2uH (XFL4020)
Cout=22uF
4
7
10
13
Input Voltage (V)
COUT = 22 µH
L = 2.2 µH
(XFL4020)
Figure 25. Output Voltage Accuracy (Load Regulation)
16
G001
COUT = 22 µH
Figure 26. Output Voltage Accuracy (Line Regulation)
4
4
IOUT=2A
3.5
IOUT=3A
Switching Frequency (MHz)
3.5
Switching Frequency (MHz)
IOUT=1A
G001
L = 2.2 µH
(XFL4020)
3
2.5
2
IOUT=0.5A
IOUT=1A
1.5
1
0.5
0
3.30
3.20
10
IOUT=10mA
IOUT=1mA
3.35
3
2.5
2
1.5
1
0.5
6
8
10
VOUT = 5 V
12
14
Input Voltage (V)
16
0
18
0
0.5
1
G000
L = 2.2 µH
(XFL4020)
COUT = 22 µH
1.5
2
Output Current (A)
VOUT = 5 V
2.5
3
G000
L = 2.2 µH (XFL4020)
Figure 28. Switching Frequency vs. Output Current
Figure 27. Switching Frequency vs. Input Voltage
4
4
IOUT=2A
3.5
IOUT=3A
Switching Frequency (MHz)
Switching Frequency (MHz)
3.5
3
2.5
2
IOUT=0.5A
IOUT=1A
1.5
1
0.5
0
3
2.5
2
1.5
1
0.5
4
6
VOUT = 3.3 V
8
10
12
Input Voltage (V)
14
L = 2.2 µH
(XFL4020)
16
18
0
0
0.5
G000
COUT = 22 µH
1
1.5
2
Output Current (A)
VOUT = 3.3 V
2.5
3
G000
L = 2.2 µH (XFL4020)
Figure 30. Switching Frequency vs. Output Current
Figure 29. Switching Frequency vs. Input Voltage
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4
4
3.5
3.5
IOUT=2A
3
Switching Frequency (MHz)
Switching Frequency (MHz)
SLVSCC2D – MAY 2014 – REVISED JANUARY 2018
IOUT=3A
2.5
2
IOUT=0.5A
1.5
IOUT=1A
1
0.5
0
3
2.5
2
1.5
1
0.5
3
5
7
9
11
Input Voltage (V)
VOUT = 1.8 V
13
15
0
17
0
0.5
1
G000
L = 2.2 µH
(XFL4020)
COUT = 22 µH
1.5
2
Output Current (A)
VOUT = 1.8 V
2.5
3
G000
L = 2.2 µH (XFL4020)
Figure 32. Switching Frequency vs. Output Current
Figure 31. Switching Frequency vs. Input Voltage
3
2.5
IOUT=2A
Switching Frequency (MHz)
Switching Frequency (MHz)
3
IOUT=3A
2
1.5
IOUT=1A
1
IOUT=0.5A
0.5
0
3
5
VOUT = 1 V
7
9
11
Input Voltage (V)
L = 2.2 µH
(XFL4020)
13
15
17
2.5
2
1.5
1
0.5
0
0
0.5
G000
COUT = 22 µH
1
1.5
2
Output Current (A)
VOUT = 1 V
2.5
3
G000
L = 2.2 µH (XFL4020)
Figure 34. Switching Frequency vs. Output Current
Figure 33. Switching Frequency vs. Input Voltage
Figure 35. Typical Operation in PWM Mode (IOUT= 1 A)
24
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Figure 36. Typical Operation in Power Save Mode (IOUT=10
mA)
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SLVSCC2D – MAY 2014 – REVISED JANUARY 2018
Figure 37. PWM-PSM-Transition
Figure 38. Load Transient Response (0.5 to 3 to 0.5 A)
Figure 39. Load Transient Response of Figure 38,
Rising Edge
Figure 40. Load Transient Response of Figure 38,
Falling Edge
Figure 41. Start Up into 100 mA
Figure 42. Start Up into 3 A
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125
Free−Air Temperature (°C)
115
105
95
85
75
65
55
0
0.5
1
1.5
2
2.5
Output Current (A)
3
3.5
G000
L = 2.2 µH (XFL4020)
TPS62130EVM
Figure 43. Maximum Ambient Temperature
26
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SLVSCC2D – MAY 2014 – REVISED JANUARY 2018
10.3 System Examples
10.3.1 Regulated Power LED Supply
The TPS62130A-Q1 can be used as a power supply for power LEDs. The FB pin can be easily set down to lower
values than nominal by using the SS/TR pin. With that, the voltage drop on the sense resistor is low, avoiding
excessive power loss. Since this pin provides 2.5µA, the feedback pin voltage can be adjusted by an external
resistor per Equation 15. This drop, proportional to the LED current, is used to regulate the output voltage (anode
voltage) to a proper level to drive the LED. Both analog and PWM dimming are supported with the TPS62130AQ1. Figure 44 shows an application circuit, tested with analog dimming:
space
(4 .. 17) V
10uF
1 µH
PVIN
SW
AVIN
VOS
EN
PG
TPS62130A-Q1
SS/TR
FB
0.1uF
ADIM
187k
DEF
AGND
FSW
PGND
22uF
0.1R
Copyright © 2017, Texas Instruments Incorporated
Figure 44. Single Power LED Supply
The resistor at SS/TR sets the FB voltage to a level of about 300mV and is calculated from Equation 15.
space
V FB = 0.64 × 2.5mA × R SS / TR
(15)
space
The device now supplies a constant current, set by the resistor at the FB pin, by regulating the output voltage
accordingly. The minimum input voltage has to be rated according the forward voltage needed by the LED used.
More information is available in the Application Note SLVA451.
10.3.2 Inverting Power Supply
The TPS62130A-Q1 can be used as inverting power supply by rearranging external circuitry as shown in
Figure 45.
spacing
10uF
2.2µH
(3 .. 13.7)V
PVIN
SW
AVIN
VOS
10uF
0.1uF
EN
PG
TPS62130A-Q1
SS/TR
FB
1.21M
22uF
3.3nF
DEF
AGND
FSW
PGND
383k
-3.3V
Copyright © 2017, Texas Instruments Incorporated
Figure 45. –3.3 V Inverting Power Supply
Copyright © 2014–2018, Texas Instruments Incorporated
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System Examples (continued)
As the former GND node now represents a voltage level below system ground, the voltage difference between
VIN and VOUT has to be limited for operation to the maximum supply voltage of 17V (see Equation 16).
spacing
VIN + VOUT £ VIN max
(16)
spacing
The transfer function of the inverting power supply configuration differs from the buck mode transfer function,
incorporating a Right Half Plane Zero additionally. The loop stability has to be adapted and an output
capacitance of at least 22µF is recommended. A detailed design example is given in SLVA469.
10.3.3 Active Output Discharge
The TPS6213xA-Q1 pulls the PG pin Low, when the device is shut down by EN, UVLO or thermal shutdown.
Connecting PG to VOUT through a resistor can be used to discharge VOUT in those cases (see Figure 46).
spacing
(3 .. 17)V
1 / 2.2 µH
10uF
0.1uF
3.3nF
PVIN
SW
AVIN
TPS62130A-Q1
VOS
EN
PG
SS/TR
FB
DEF
AGND
FSW
PGND
Vout / 3A
R3
R1
22uF
R2
Copyright © 2017, Texas Instruments Incorporated
Figure 46. Output Discharge using PG Pin
spacing
The discharge rate can be adjusted by R3, which is also used to pull up the PG pin in normal operation. For
reliability, keep the maximum current into the PG pin less than 10mA.
10.3.4 Various Output Voltages
spacing
(5 .. 17)V
10uF
5V / 3A
1 / 2.2 µH
PVIN
SW
AVIN
VOS
100k
0.1uF
EN
PG
22uF
TPS62133A-Q1
SS/TR
FB
3.3nF
DEF
AGND
FSW
PGND
Copyright © 2017, Texas Instruments Incorporated
Figure 47. 5 V Power Supply using TPS62133A-Q1 fixed VOUT version
spacing
28
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SLVSCC2D – MAY 2014 – REVISED JANUARY 2018
System Examples (continued)
1 / 2.2 µH
(3.3 .. 17)V
10uF
PVIN
SW
AVIN
VOS
3.3V / 3A
100k
0.1uF
EN
PG
470k
22uF
TPS62130A-Q1
FB
SS/TR
3.3nF
DEF
AGND
FSW
PGND
150k
Copyright © 2017, Texas Instruments Incorporated
Figure 48. 3.3 V/3 A Power Supply
spacing
1 / 2.2 µH
(3 .. 17)V
10uF
PVIN
SW
AVIN
VOS
2.5V / 3A
100k
0.1uF
EN
PG
510k
22uF
TPS62130A-Q1
FB
SS/TR
3.3nF
DEF
AGND
FSW
PGND
240k
Copyright © 2017, Texas Instruments Incorporated
Figure 49. 2.5 V/3 A Power Supply
spacing
1 / 2.2 µH
(3 .. 17)V
10uF
PVIN
SW
AVIN
VOS
1.8V / 3A
100k
0.1uF
EN
PG
360k
22uF
TPS62130A-Q1
FB
SS/TR
3.3nF
DEF
AGND
FSW
PGND
160k
Copyright © 2017, Texas Instruments Incorporated
Figure 50. 1.8 V/3 A Power Supply
spacing
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System Examples (continued)
1 / 2.2 µH
(3 .. 17)V
10uF
PVIN
SW
AVIN
VOS
1.5V / 3A
100k
0.1uF
EN
PG
130k
22uF
TPS62130A-Q1
SS/TR
FB
3.3nF
DEF
AGND
FSW
PGND
150k
Copyright © 2017, Texas Instruments Incorporated
Figure 51. 1.5 V/3 A Power Supply
spacing
(3 .. 17)V
1.3V / 3A
1 / 2.2 µH
10uF
PVIN
SW
AVIN
VOS
100k
0.1uF
EN
PG
22uF
TPS6213013A-Q1
SS/TR
FB
3.3nF
DEF
AGND
FSW
PGND
Copyright © 2017, Texas Instruments Incorporated
Figure 52. 1.3 V/3 A Power Supply using TPS6213013A-Q1 fixed VOUT version
spacing
1 / 2.2 µH
(3 .. 17)V
10uF
PVIN
SW
AVIN
VOS
1.2V / 3A
100k
0.1uF
EN
PG
TPS62130A-Q1
SS/TR
FB
75k
DEF
AGND
150k
FSW
PGND
22uF
3.3nF
Copyright © 2017, Texas Instruments Incorporated
Figure 53. 1.2 V/3 A Power Supply
spacing
30
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SLVSCC2D – MAY 2014 – REVISED JANUARY 2018
System Examples (continued)
1 / 2.2 µH
(3 .. 17)V
10uF
PVIN
SW
AVIN
VOS
1V / 3A
100k
0.1uF
EN
PG
51k
22uF
TPS62130A-Q1
FB
SS/TR
3.3nF
DEF
AGND
FSW
PGND
200k
Copyright © 2017, Texas Instruments Incorporated
Figure 54. 1 V/3 A Power Supply
11 Power Supply Recommendations
The TPS6213xA-Q1 devices are designed to operate from a 3 to 17V input voltage supply. To avoid insufficient
supply current due to line drop, ringing due to trace inductance at the VIN terminal or supply peak current
limitations, additional bulk capacitance may be required. In the case ringing that is caused by the interaction with
the ceramic input capacitors, an electrolytic or tantalum type capacitor may be needed for damping.
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12 Layout
12.1 Layout Guidelines
A proper layout is critical for the operation of a switched mode power supply, even more at high switching
frequencies. Therefore the PCB layout of the TPS6213xA-Q1 demands careful attention to ensure operation and
to get the performance specified. A poor layout can lead to issues like poor regulation (both line and load),
stability and accuracy weaknesses, increased EMI radiation and noise sensitivity. The layout also influences the
thermal performance of the solution by its power dissipation capabilities.
See Figure 55 for the recommended layout of the TPS62130A-Q1, which is designed for common external
ground connections. Therefore both AGND and PGND pins are directly connected to the Exposed Thermal Pad.
On the PCB, the direct common ground connection of AGND and PGND to the Exposed Thermal Pad and the
system ground (ground plane) is mandatory. Also connect the VOS pin in the shortest way to the VOUT potential
at the output capacitor.
Provide low inductive and resistive paths for loops with high di/dt. Therefore paths conducting the switched load
current should be as short and wide as possible. Provide low capacitive paths (with respect to all other nodes) for
wires with high dv/dt. Therefore the input and output capacitance should be placed as close as possible to the IC
pins and parallel wiring over long distances as well as narrow traces should be avoided. Loops which conduct an
alternating current should outline an area as small as possible, as this area is proportional to the energy radiated.
Sensitive nodes like FB and VOS need to be connected with short wires and not nearby high dv/dt signals (e.g.
SW). As they carry information about the output voltage, they should be connected as close as possible to the
actual output voltage (at the output capacitor). The capacitor on the SS/TR pin and on AVIN as well as the FB
resistors, R1 and R2, should be kept close to the IC and connect directly to those pins and the AGND pin.
The Exposed Thermal Pad must be soldered to the circuit board for mechanical reliability and to achieve
appropriate power dissipation.
The recommended layout is implemented on the EVM and shown in its Users Guide, SLVU437. Additionally, the
EVM Gerber data are available for download here, SLVC394.
12.2 Layout Example
space
AGND
C5
R1
C7
FB
AGND
DEF
SS/TR
PG
AVIN
SW
PGND
SW
PGND
SW
PVIN
EN
PVIN
VOS
VIN
FSW
R2
C3
C1
L1
VOUT
GND
Figure 55. Layout Example with TPS62130A-Q1
32
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SLVSCC2D – MAY 2014 – REVISED JANUARY 2018
13 Device and Documentation Support
13.1 Device Support
13.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
13.2 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 5. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
TPS62130A-Q1
Click here
Click here
Click here
Click here
Click here
TPS62133A-Q1
Click here
Click here
Click here
Click here
Click here
TPS6213013A-Q1
Click here
Click here
Click here
Click here
Click here
13.3 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
13.4 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
13.5 Trademarks
DCS-Control, E2E are trademarks of Texas Instruments.
WEBENCH is a registered trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
13.6 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
13.7 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
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www.ti.com
14 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
34
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www.ti.com
SLVSCC2D – MAY 2014 – REVISED JANUARY 2018
PACKAGE OUTLINE
RGT0016C
VQFN - 1 mm max height
SCALE 3.600
PLASTIC QUAD FLATPACK - NO LEAD
3.1
2.9
A
B
PIN 1 INDEX AREA
3.1
2.9
C
1 MAX
SEATING PLANE
0.05
0.00
0.08
1.68 0.07
(0.2) TYP
5
12X 0.5
8
EXPOSED
THERMAL PAD
4
9
4X
1.5
SYMM
1
12
16X
PIN 1 ID
(OPTIONAL)
13
16
0.1
0.05
SYMM
16X
0.30
0.18
C A B
0.5
0.3
4222419/B 11/2016
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
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EXAMPLE BOARD LAYOUT
RGT0016C
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
( 1.68)
SYMM
13
16
16X (0.6)
1
12
16X (0.24)
SYMM
(2.8)
(0.58)
TYP
12X (0.5)
9
4
( 0.2) TYP
VIA
5
(R0.05)
ALL PAD CORNERS
8
(0.58) TYP
(2.8)
LAND PATTERN EXAMPLE
SCALE:20X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4222419/B 11/2016
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
36
Submit Documentation Feedback
Copyright © 2014–2018, Texas Instruments Incorporated
Product Folder Links: TPS62130A-Q1 TPS62133A-Q1 TPS6213013A-Q1
TPS62130A-Q1, TPS62133A-Q1, TPS6213013A-Q1
www.ti.com
SLVSCC2D – MAY 2014 – REVISED JANUARY 2018
EXAMPLE STENCIL DESIGN
RGT0016C
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
( 1.55)
16
13
16X (0.6)
1
12
16X (0.24)
17
SYMM
(2.8)
12X (0.5)
9
4
METAL
ALL AROUND
5
SYMM
8
(R0.05) TYP
(2.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD 17:
85% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:25X
4222419/B 11/2016
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
Copyright © 2014–2018, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: TPS62130A-Q1 TPS62133A-Q1 TPS6213013A-Q1
37
PACKAGE OPTION ADDENDUM
www.ti.com
20-Jul-2019
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TPS6213013AQRGTRQ1
ACTIVE
VQFN
RGT
16
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
13013Q
TPS6213013AQRGTTQ1
ACTIVE
VQFN
RGT
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
13013Q
TPS62130AQRGTRQ1
ACTIVE
VQFN
RGT
16
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
PA6IQ
TPS62130AQRGTTQ1
ACTIVE
VQFN
RGT
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
PA6IQ
TPS62133AQRGTRQ1
ACTIVE
VQFN
RGT
16
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
PA6JQ
TPS62133AQRGTTQ1
ACTIVE
VQFN
RGT
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
PA6JQ
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
20-Jul-2019
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TPS62130A-Q1 :
• Catalog: TPS62130A
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Jul-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
TPS6213013AQRGTRQ1
VQFN
RGT
16
TPS6213013AQRGTTQ1
VQFN
RGT
TPS62130AQRGTRQ1
VQFN
RGT
TPS62130AQRGTTQ1
VQFN
TPS62133AQRGTRQ1
TPS62133AQRGTTQ1
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
3000
330.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
16
250
180.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
16
3000
330.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
RGT
16
250
180.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
VQFN
RGT
16
3000
330.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
VQFN
RGT
16
250
180.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Jul-2019
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPS6213013AQRGTRQ1
VQFN
RGT
16
3000
552.0
367.0
36.0
TPS6213013AQRGTTQ1
VQFN
RGT
16
250
552.0
185.0
36.0
TPS62130AQRGTRQ1
VQFN
RGT
16
3000
552.0
367.0
36.0
TPS62130AQRGTTQ1
VQFN
RGT
16
250
552.0
185.0
36.0
TPS62133AQRGTRQ1
VQFN
RGT
16
3000
552.0
367.0
36.0
TPS62133AQRGTTQ1
VQFN
RGT
16
250
552.0
185.0
36.0
Pack Materials-Page 2
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TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
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Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
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