Texas Instruments | TPS653853-Q1 Multirail Power Supply for Microcontrollers in Safety-Relevant Applications (Rev. A) | Datasheet | Texas Instruments TPS653853-Q1 Multirail Power Supply for Microcontrollers in Safety-Relevant Applications (Rev. A) Datasheet

Texas Instruments TPS653853-Q1 Multirail Power Supply for Microcontrollers in Safety-Relevant Applications (Rev. A) Datasheet
Product
Folder
Order
Now
Technical
Documents
Tools &
Software
Support &
Community
Reference
Design
TPS653853-Q1
SLVSDC4A – DECEMBER 2016 – REVISED NOVEMBER 2017
TPS653853-Q1 Multirail Power Supply for Microcontrollers in Safety-Relevant Applications
1 Device Overview
1.1
Features
1
• Qualified for Automotive Applications
• AEC-Q100 Qualified With the Following Results:
– Device Temperature Grade 1: –40°C to +125°C
Ambient Operating Temperature
– Device HBM ESD Classification Level 2
– Device CDM ESD Classification Level C4B
• Input Voltage Range
– 7 to 36 V for Initial Battery Power Up
– 3.8- to 36-V Full Functionality After Initial Battery
Power Up
– Minimum 2.3 V During Operation After Wake-up
• Supply Rails
– 6-V Synchronous Buck-Boost Preregulator With
Internal FETs
– 5-V, 284-mA (CAN) LDO With Internal FET
– 3.3-V or 5-V, 350-mA (MCU IO) LDO With
Internal FET
– 2 Sensor Supply LDOs With Internal FETs
– 120 mA for Sensor Supply 1, 20 mA for
Sensor Supply 2
– Configurable Tracking Mode (Tracking Input
Pin), or 3.3-V or 5-V Fixed Output Voltage
– Short-to-Ground and Battery Protection
– Charge Pump: 6-V Minimum, 11-V Maximum
Above Battery Voltage
• Monitoring and Protection
– Independent Undervoltage and Overvoltage
Monitoring on All Regulator Outputs, Battery
Voltage, and Internal Supplies
– Voltage Monitoring Circuitry, Including
Independent Bandgap Reference, Supplied from
Separate Battery Voltage Input Pin
– Self-Check on All Voltage Monitoring (During
Power-Up and After Power-Up Initiated by
External MCU)
– All Supplies Protected With Current Limit and
Overtemperature Prewarning and Shutdown
1.2
•
Applications
Safety-Relevant Automotive Applications
1.3
• Steering-Angle Monitoring (SAM)
– 2 Signal Comparators for Position Sensor
Signals
– Rotation Counter
– Low-Power Mode With Periodically Sampling of
Position Sensor Signals
– Switches for Passing-Through Sensor Signals to
MCU
• Microcontroller Interface
– Open and Close Window or Question-Answer
Watchdog Function
– Lock-Step MCU Error-Signal Monitor
– DIAGNOSTIC state for Performing Device SelfTests and System Diagnostics
– SAFE State for Device and System Protection
upon Detected System Failure
– Clock Monitor for Internal Oscillator
– Analog and Logic Built-In Self-Test
– CRC on Non-Volatile Memory as well as Device
and System Configuration Registers and SPI
Communications
– Reset Circuit for MCU
– Diagnostic Output Pin
• SPI With CRC on Command Plus Data
• Error Reporting Through SPI Registers for Errors
on System Level and Device Level
• Enable-Drive Output for Disabling External PowerStages on Any Detected System Failure
• Wake-up through IGNITION Pin or CAN WAKUP
Pin
• 48-Pin HTSSOP PowerPAD™ IC Package
•
Industrial Safety-Relevant Applications
Description
The TPS653853-Q1 device is a multirail power supply designed to supply microcontrollers in safety
relevant applications, such as those found in the automotive industry. The device supports
microcontrollers with dual-core lockstep (LS) or loosely coupled architectures (LC).
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS653853-Q1
SLVSDC4A – DECEMBER 2016 – REVISED NOVEMBER 2017
www.ti.com
The TPS653853-Q1 device integrates multiple supply rails to power the MCU, CAN or FlexRay, and
external sensors. A buck-boost converter with internal FETs converts the input battery voltage between
2.3 V and 36 V to a 6-V preregulator output that supplies the other regulators. An integrated charge pump
provides an overdrive voltage for the internal regulators, and can also be used to drive an external NMOS
FET as reverse battery protection. The device supports wake-up from an ignition (IGN) signal or wake-up
from a CAN transceiver signal.
The device has a steering-angle monitoring (SAM) unit that allows the ECU to indirectly capture the
position of the steering wheel through the motor-position sensors. A dedicated low-power mode allows this
SAM unit to operate even when the ECU is in sleep mode. Integrated SAM-switches allow passingthrough of the Motor-Position Sensor signals to the MCU during normal operation, or decoupling the MCU
ADC inputs from the motor-position sensor signals when the ECU is in sleep mode.
An independent voltage monitoring unit inside the device monitors undervoltage and overvoltage on all
internal supply rails and regulator outputs of the battery supply. Regulator current limits and temperature
protections are also implemented. The TPS653853-Q1 device features a question-answer watchdog, MCU
error-signal monitor, clock monitoring on internal oscillator, self-check on clock monitor, cyclic redundancy
check (CRC) on non-volatile memory and SPI communication, a diagnostic output pin allowing MCU to
observe device internal analog and digital signals, a reset circuit for the MCU and an enable output to
disable external power-stages on any detected system-failure. A built-in self-test (BIST) allows for
monitoring the device functionality at start-up. A dedicated DIAGNOSTIC state allows the MCU to check
TPS653853-Q1 functionality.
The TPS653853-Q1 device also has an error reporting capability through the SPI register. The device has
separate status bits in the SPI register for each specific error on the system level or device level. When
the device detects a particular error condition, it sets the appropriate status bit and keeps this status bit
set until the MCU reads-out the SPI register in which this status bit was set. Based on which status bit
was set, the MCU can decide whether it must keep the system in a safe state or whether it can resume
with the operation of the system.
The TPS653853-Q1 device is available in a 48-pin HTSSOP PowerPAD IC package.
Device Information (1)
PART NUMBER
TPS653853-Q1
(1)
2
PACKAGE
BODY SIZE
HTSSOP (48)
12.50 mm × 6.10 mm
For more information, see Section 4, Mechanical Packaging and Orderable Information.
Device Overview
Copyright © 2016–2017, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: TPS653853-Q1
TPS653853-Q1
www.ti.com
1.4
SLVSDC4A – DECEMBER 2016 – REVISED NOVEMBER 2017
Typical Application Diagram
Battery Voltage
(2.3 V to 36 V)
TPS653853-Q1
5V
CAN Interface
CAN wakeup
Multirail Power Supply
Ignition
EN
FETs
Voltage Monitor
3.3 V / 5 V
DRVOFF
ENDRV
RESET
Error Signal
Monitor
6 × PWM
3 × HS
NRES
ERROR
Dual-Core Lock-Step
Microcontroller
Watchdog
SPI
DIAG_OUT
M
Motor-Driver
(DRV320x)
3 × LS
SPI
SPI
DIAG_OUT
Steering Angle
Monitor
3.3 V / 5 V
Sensor 1
Sensor 2
3.3 V / 5 V
Copyright © 2016, Texas Instruments Incorporated
Figure 1-1. Typical Application Diagram
Device Overview
Copyright © 2016–2017, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: TPS653853-Q1
3
TPS653853-Q1
SLVSDC4A – DECEMBER 2016 – REVISED NOVEMBER 2017
www.ti.com
Table of Contents
1
2
3
Device Overview ......................................... 1
3.1
Documentation Support
1.1
Features .............................................. 1
3.2
Receiving Notification of Documentation Updates ... 5
1.2
Applications ........................................... 1
3.3
Community Resources ............................... 5
1.3
Description ............................................ 1
3.4
Trademarks ........................................... 5
1.4
Typical Application Diagram .......................... 3
3.5
Electrostatic Discharge Caution ...................... 5
Revision History ......................................... 4
Device and Documentation Support ................. 5
3.6
Glossary .............................................. 5
4
..............................
5
Mechanical, Packaging, and Orderable
Information ................................................ 5
2 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (December 2016) to Revision A
•
4
Page
Changed 200 mA VDD5 output current to 284 mA in the Features section .................................................. 1
Revision History
Copyright © 2016–2017, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: TPS653853-Q1
TPS653853-Q1
www.ti.com
SLVSDC4A – DECEMBER 2016 – REVISED NOVEMBER 2017
3 Device and Documentation Support
3.1
3.1.1
Documentation Support
Related Documentation
For related documentation see the following:
• Texas instruments, DRV3201-Q1 3 Phase Motor Driver-IC for Automotive Safety Applications data
sheet
• Texas instruments, DRV3205-Q1 Three-Phase Automotive Gate Driver With Three Integrated Current
Shunt Amplifiers and Enhanced Protection, Diagnostics, and Monitoring data sheet
• Texas Instruments, Wide-VIN Supervised, Multi-Rail Power Supply With Low- Voltage MCU Core Rail
Reference Design Guide TI Design
3.2
Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the
upper right corner, click on Alert me to register and receive a weekly digest of any product information that
has changed. For change details, review the revision history included in any revised document.
3.3
Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the
respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views;
see TI's Terms of Use.
TI E2E™ Online Community The TI engineer-to-engineer (E2E) community was created to foster
collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge,
explore ideas and help solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools
and contact information for technical support.
3.4
Trademarks
PowerPAD, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
3.5
Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
3.6
Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
4 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the
most current data available for the designated devices. This data is subject to change without notice and
revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2016–2017, Texas Instruments Incorporated
Mechanical, Packaging, and Orderable Information
Submit Documentation Feedback
Product Folder Links: TPS653853-Q1
5
PACKAGE OPTION ADDENDUM
www.ti.com
12-Sep-2017
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
O3853QDCARQ1
ACTIVE
HTSSOP
DCA
48
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 125
O3853
O3853QDCATQ1
PREVIEW
HTSSOP
DCA
48
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 125
O3853
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
12-Sep-2017
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
23-May-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
O3853QDCARQ1
Package Package Pins
Type Drawing
SPQ
HTSSOP
2000
DCA
48
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
330.0
24.4
Pack Materials-Page 1
8.6
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
13.0
1.8
12.0
24.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
23-May-2019
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
O3853QDCARQ1
HTSSOP
DCA
48
2000
350.0
350.0
43.0
Pack Materials-Page 2
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
permission to use these resources only for development of an application that uses the TI products described in the resource. Other
reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third
party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims,
damages, costs, losses, and liabilities arising out of your use of these resources.
TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on
ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable
warranties or warranty disclaimers for TI products.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2019, Texas Instruments Incorporated
Was this manual useful for you? yes no
Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Related manuals

Download PDF

advertising