Texas Instruments | LM337-N 3-Terminal Adjustable Negative Regulators | Datasheet | Texas Instruments LM337-N 3-Terminal Adjustable Negative Regulators Datasheet

Texas Instruments LM337-N 3-Terminal Adjustable Negative Regulators Datasheet
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LM337-N-MIL
SNVSAX3 – JUNE 2017
LM337-N 3-Terminal Adjustable Negative Regulators
1 Features
3 Description
•
•
•
•
•
•
•
The LM337-N-MIL is an adjustable 3-terminal
negative voltage regulator capable of supplying
−1.5 A or more currents over an output voltage range
of −1.25 V to −37 V. It requires only two external
resistors to set the output voltage and one output
capacitor for frequency compensation. The circuit
design has been optimized for excellent regulation
and low thermal transients. Further, the LM337-N-MIL
features internal current limiting, thermal shutdown
and safe-area compensation, making it virtually
blowout-proof against overloads.
1
1.5-A Output Current
Line Regulation 0.01%/V (Typical)
Load Regulation 0.3% (Typical)
77-dB Ripple Rejection
50 ppm/°C Temperature Coefficient
Thermal Overload Protection
Internal Short-Circuit Current Limiting Protections
2 Applications
•
•
•
•
•
•
•
•
The LM337-N-MIL is an ideal complement to the
LM117 and LM317 adjustable positive regulators.
Industrial Power Supplies
Factory Automation Systems
Building Automation Systems
PLC Systems
Instrumentation
IGBT Drive Negative Gate Supplies
Networking
Set-Top Boxes
Device Information(1)
PART NUMBER
LM337-N-MIL
PACKAGE
BODY SIZE (NOM)
SOT-223 (4)
3.50 mm × 6.50 mm
TO (3)
8.255 mm × 8.255 mm
TO-220 (3)
10.16 mm × 14.986 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet. The LF01 is a lead formed (bent)
version of the TO-220 package.
Adjustable Negative Voltage Regulator
TI DEVICE
Full output current not available at high input-output voltages
R2 ö
æ
-VOUT = -1.25V ç 1 +
÷ + (-I ADJ ´ R 2 )
è 120 ø
†C1 = 1-μF solid tantalum or 10-μF aluminum electrolytic required for stability
*C2 = 1-μF solid tantalum is required only if regulator is more than 4″ from power-supply filter capacitor
Output capacitors in the range of 1-μF to 1000-μF of aluminum or tantalum electrolytic are commonly used to provide
improved output impedance and rejection of transients
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM337-N-MIL
SNVSAX3 – JUNE 2017
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Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
6.5
6.6
4
4
4
4
5
6
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Typical Characteristics ..............................................
7.4 Device Functional Modes.......................................... 9
8
Application and Implementation ........................ 10
8.1 Application Information............................................ 10
8.2 Typical Applications ................................................ 10
9 Power Supply Recommendations...................... 14
10 Layout................................................................... 14
10.1 Layout Guidelines ................................................. 14
10.2 Layout Example .................................................... 14
10.3 Thermal Considerations ........................................ 15
11 Device and Documentation Support ................. 16
11.1
11.2
11.3
11.4
11.5
Detailed Description .............................................. 8
7.1 Overview ................................................................... 8
7.2 Functional Block Diagram ......................................... 8
7.3 Feature Description................................................... 8
Documentation Support ........................................
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
16
16
16
16
16
12 Mechanical, Packaging, and Orderable
Information ........................................................... 16
4 Revision History
2
DATE
REVISION
NOTES
June 2017
*
Initial release.
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5 Pin Configuration and Functions
TO Metal Can Package
3-Pin Package Number NDT0003A
Bottom View
TO-220 Plastic Package
Package Number NDE0003B
Front View
SOT-223
3-Lead Package Marked N02A
Front View
Pin Functions
PIN
NAME
TO-220
TO
SOT-223
I/O
DESCRIPTION
ADJ
1
1
1
—
VIN
2, TAB
3, CASE
2, 4
I
Input voltage pin for the regulator
3
2
3
O
Output voltage pin for the regulator
VOUT
Adjust pin
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6 Specifications
6.1 Absolute Maximum Ratings
MIN
Power dissipation
MAX
UNIT
Internally Limited
Input-output voltage differential
–0.3
40
V
Operating junction temperature
0
125
°C
–65
150
°C
Storage temperature, Tstg
6.2 ESD Ratings
V(ESD)
(1)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
VALUE
UNIT
±2000
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Pins listed as ±2000
V may actually have higher performance.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
0
125
°C
Operating junction temperature
6.4 Thermal Information
LM337-N-MIL
THERMAL METRIC (1)
NDT
(TO)
DCY
(SOT-223)
NDE OR NDG
(TO-220)
3 PINS
3 PINS
3 PINS
140 (2)
58.3
22.9
°C/W
UNIT
RθJA
Junction-to-ambient thermal resistance
RθJC(top)
Junction-to-case (top) thermal resistance
12
36.6
15.7
°C/W
RθJB
Junction-to-board thermal resistance
—
7.2
4.1
°C/W
ψJT
Junction-to-top characterization parameter
—
1.3
2.4
°C/W
ψJB
Junction-to-board characterization parameter
—
7
4.1
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
—
—
1
°C/W
(1)
(2)
4
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
No heat sink.
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6.5 Electrical Characteristics
Unless otherwise specified, these specifications apply: 0°C ≤ Tj ≤ 125°C for the LM337-N-MIL; VIN − VOUT = 5 V; and IOUT =
0.1 A for the TO package and IOUT = 0.5 A for the SOT-223 and TO-220 packages. Although power dissipation is internally
limited, these specifications are applicable for power dissipations of 2 W for the TO and SOT-223, and 20 W for the TO-220.
IMAX is 1.5 A for the SOT-223 and TO-220 packages, and 0.2 A for the TO package.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
0.01
0.04
%/V
Line regulation
TJ = 25°C, 3 V ≤ |VIN − VOUT| ≤ 40 V (1)
IL = 10 mA
Load regulation
TJ = 25°C, 10 mA ≤ IOUT ≤ IMAX
0.3%
1%
Thermal regulation
TJ = 25°C, 10-ms Pulse
0.003
0.04
%/W
65
100
μA
2
5
μA
−1.213
−1.25
−1.287
V
−1.2
−1.25
−1.3
V
0.02
0.07
%/V
0.3%
1.5%
Adjustment pin current
Adjustment pin current charge
10 mA ≤ IL ≤ IMAX
3 V ≤ |VIN − VOUT| ≤ 40 V,
TA = 25°C
Reference voltage
3 V ≤ |VIN − VOUT| ≤ 40 V, (2)
10 mA ≤ IOUT ≤ IMAX, P ≤ PMAX
Line regulation
3 V ≤ |VIN − VOUT| ≤ 40 V,
Load regulation
10 mA ≤ IOUT ≤ IMAX,
Temperature stability
TMIN ≤ Tj ≤ TMAX
Minimum load current
(1)
0.6%
|VIN − VOUT| ≤ 40 V
2.5
10
mA
|VIN − VOUT| ≤ 10 V
1.5
6
mA
Current limit
|VIN − VOUT| = 40 V, TJ = 25°C
Ripple rejection ratio
Long-term stability
(1)
(2)
(2)
−55°C ≤ TJ ≤ 150°C
(1)
|VIN − VOUT| ≤ 15 V
RMS output noise, % of VOUT
TJ = 25°C
K, DCY and NDE package
1.5
2.2
3.7
A
NDT package
0.5
0.8
1.9
A
0.15
0.4
A
0.1
0.17
A
K, DCY and NDE package
NDT package
Tj = 25°C, 10 Hz ≤ f ≤ 10 kHz
0.003%
VOUT = −10 V, f = 120 Hz
CADJ = 10 μF
60
66
TJ = 125°C, 1000 Hours
dB
77
0.3%
dB
1%
Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to
heating effects are covered under the specification for thermal regulation. Load regulation is measured on the output pin at a point ⅛ in.
below the base of the TO packages.
Selected devices with tightened tolerance reference voltage available.
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6.6 Typical Characteristics
(NDE Package)
6
Figure 1. Load Regulation
Figure 2. Current Limit
Figure 3. Adjustment Current
Figure 4. Dropout Voltage
Figure 5. Temperature Stability
Figure 6. Minimum Operating Current
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Typical Characteristics (continued)
(NDE Package)
Figure 7. Ripple Rejection
Figure 8. Ripple Rejection
Figure 9. Ripple Rejection
Figure 10. Output Impedance
Figure 11. Line Transient Response
Figure 12. Load Transient Response
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7 Detailed Description
7.1 Overview
In operation, the LM337-N-MIL develops a nominal −1.25-V reference voltage between the output and
adjustment terminal. The reference voltage is impressed across program resistor R1 (120 Ω for example) and,
because the voltage is constant, a constant current then flows through the output set resistor R2, giving an
output voltage calculated by Equation 1.
R2 ö
æ
-VOUT = -1.25V ç 1 +
÷ + (-I ADJ ´ R 2 )
è 120 ø
(1)
7.2 Functional Block Diagram
7.3 Feature Description
7.3.1 Thermal Regulation
When power is dissipated in an IC, a temperature gradient occurs across the IC chip affecting the individual IC
circuit components. With an IC regulator, this gradient can be especially severe because power dissipation is
large. Thermal regulation is the effect of these temperature gradients on output voltage (in percentage output
change) per Watt of power change in a specified time. Thermal regulation error is independent of electrical
regulation or temperature coefficient, and occurs within 5 ms to 50 ms after a change in power dissipation.
Thermal regulation depends on IC layout as well as electrical design. The thermal regulation of a voltage
regulator is defined as the percentage change of VOUT, per Watt, within the first 10 ms after a step of power is
applied.
8
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7.4 Device Functional Modes
7.4.1 Protection Diodes
When external capacitors are used with any IC regulator, it is sometimes necessary to add protection diodes to
prevent the capacitors from discharging through low current points into the regulator. Most 10-μF capacitors have
low enough internal series resistance to deliver 20-A spikes when shorted. Although the surge is short, there is
enough energy to damage parts of the IC.
When an output capacitor is connected to a negative output regulator and the input is shorted, the output
capacitor pulls current out of the output of the regulator. The current depends on the value of the capacitor, the
output voltage of the regulator, and the rate at which VIN is shorted to ground.
The bypass capacitor on the adjustment terminal can discharge through a low current junction. Discharge occurs
when either the input, or the output, is shorted. Figure 13 shows the placement of the protection diodes.
*When CL is larger than 20 μF, D1 protects the LM1337-N-MIL in case the input supply is shorted
**When C2 is larger than 10 μF and −VOUT is larger than −25V, D2 protects the LM1337-N-MIL in case the output is
shorted
Figure 13. Regulator With Protection Diodes
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The LM337-N-MIL is a versatile, high performance, negative output linear regulator with high accuracy and a
wide temperature range. An output capacitor can be added to further improve transient response, and the ADJ
pin can be bypassed to achieve very high ripple-rejection ratios. The functionality of the device can be utilized in
many different applications that require negative voltage supplies, such as bipolar amplifiers, operational
amplifiers, and constant current regulators.
8.2 Typical Applications
8.2.1 Adjustable Negative Voltage Regulator
The LM337-N-MIL can be used as a simple, negative output regulator to enable a variety of output voltages
needed for demanding applications. By using an adjustable R2 resistor, a variety of negative output voltages can
be made possible as shown in Figure 14.
TI DEVICE
Full output current not available at high input-output voltages
†C1 = 1-μF solid tantalum or 10-μF aluminum electrolytic required for stability
*C2 = 1-μF solid tantalum is required only if regulator is more than 4 inches from power-supply filter capacitor
Output capacitors in the range of 1 μF to 1000 μF of aluminum or tantalum electrolytic are commonly used to provide
improved output impedance and rejection of transients
Figure 14. Adjustable Negative Voltage Regulator
R2 ö
æ
-VOUT = -1.25V ç 1 +
÷ + (-I ADJ ´ R 2 )
120
è
ø
(2)
8.2.1.1 Design Requirements
The device component count is very minimal, employing two resistors as part of a voltage divider circuit and an
output capacitor for load regulation. An input capacitor is needed if the device is more than 4 inches from the
filter capacitors.
10
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Typical Applications (continued)
8.2.1.2 Detailed Design Procedure
The output voltage is set based on the selection of the two resistors, R1 and R2, as shown in Figure 14.
8.2.1.3 Application Curve
As shown in Figure 15, the maximum output current capability is limited by the input-output voltage differential,
package type, and junction temperature.
Figure 15. Current Limit
8.2.2 Adjustable Lab Voltage Regulator
The LM337-N-MIL can be combined with a positive regulator such as the LM317-N to provide both a positive and
negative voltage rail. This can be useful in applications that use bi-directional amplifiers and dual-supply
operational amplifiers.
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Typical Applications (continued)
TI DEVICE
TI DEVICE
Full output current not available at high input-output voltages
*The 10 μF capacitors are optional to improve ripple rejection
8.2.3 −5.2-V Regulator with Electronic Shutdown
The LM337-N-MIL can be used with a PNP transistor to provide shutdown control from a TTL control signal. The
PNP can short or open the ADJ pin to GND. When ADJ is shorted to GND by the PNP, the output is −1.3 V.
When ADJ is disconnected from GND by the PNP, then the LM337-N-MIL outputs the programmed output of
−5.2 V.
12
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Typical Applications (continued)
TI DEVICE
Minimum output ≃ −1.3 V when control input is low
8.2.4 High Stability −10-V Regulator
Using a high stability shunt voltage reference in the feedback path, such as the LM329, provides damping
necessary for a stable, low noise output.
TI DEVICE
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9 Power Supply Recommendations
The input supply to the LM337-N must be kept at a voltage level such that the maximum input to output
differential voltage rating is not exceeded. The minimum dropout voltage must also be met with extra headroom
when possible to keep the LM337-N-MIL in regulation. TI recommends an input capacitor, especially when the
input pin is placed more than 4 inches away from the power-supply filter capacitor.
10 Layout
10.1 Layout Guidelines
Some layout guidelines must be followed to ensure proper regulation of the output voltage with minimum noise.
Traces carrying the load current must be wide to reduce the amount of parasitic trace inductance and the
feedback loop from VOUT to ADJ must be kept as short as possible. To improve PSRR, a bypass capacitor can
be placed at the ADJ pin and must be placed as close as possible to the IC. In cases when VIN shorts to ground,
an external diode must be placed from VIN to VOUT to divert the surge current into the output capacitor and
protect the IC. Similarly, in cases when a large bypass capacitor is placed at the ADJ pin and VOUT shorts to
ground, an external diode must be placed from VOUT to ADJ to provide a path for the bypass capacitor to
discharge. These diodes must be placed close to the corresponding IC pins to increase their effectiveness.
10.2 Layout Example
Figure 16. Layout Example (SOT-223)
14
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10.3 Thermal Considerations
10.3.1 Heatsinking SOT-223 Package Parts
The SOT-223 DCY packages use a copper plane on the PCB and the PCB itself as a heatsink. To optimize the
heat sinking ability of the plane and PCB, solder the tab of the package to the plane.
Figure 17 and Figure 18 show the information for the SOT-223 package. Figure 18 assumes a θ(J−A) of 75°C/W
for 1 ounce copper and 51°C/W for 2 ounce copper and a maximum junction temperature of 125°C.
Figure 17. θ(J−A) vs Copper (2 ounce) Area for the SOT-223 Package
Figure 18. Maximum Power Dissipation vs TAMB for the SOT-223 Package
See AN-1028, SNVA036, for power enhancement techniques to be used with the SOT-223 package.
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11 Device and Documentation Support
11.1 Documentation Support
11.1.1 Related Documentation
For related documentation see the following:
AN-1028, SNVA036
11.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
16
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PACKAGE OPTION ADDENDUM
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21-Nov-2019
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM337H
ACTIVE
TO
NDT
3
500
Green (RoHS
& no Sb/Br)
AU
Level-1-NA-UNLIM
0 to 0
( LM337H, LM337H)
LM337H/NOPB
ACTIVE
TO
NDT
3
500
Green (RoHS
& no Sb/Br)
AU
Level-1-NA-UNLIM
0 to 0
( LM337H, LM337H)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
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MECHANICAL DATA
NDT0003A
H03A (Rev D)
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