Texas Instruments | TPS61256xC 3.5-MHz High Efficiency Step-Up Converter In Chip Scale Pac (Rev. A) | Datasheet | Texas Instruments TPS61256xC 3.5-MHz High Efficiency Step-Up Converter In Chip Scale Pac (Rev. A) Datasheet

Texas Instruments TPS61256xC 3.5-MHz High Efficiency Step-Up Converter In Chip Scale Pac (Rev. A) Datasheet
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TPS61256C
SLVSDQ1A – FEBRUARY 2017 – REVISED JUNE 2017
TPS61256xC 3.5-MHz High Efficiency Step-Up Converter In Chip Scale Packaging
1 Features
•
•
•
•
•
•
•
•
•
1
•
•
With a wide input voltage range of 2.3 V to 5.5 V, the
device supports applications powered by Li-Ion
batteries with extended voltage range. Different fixed
voltage output versions are available from 3.15 V to
5.0 V.
93% Efficiency at 3.5-MHz Operation
37-µA Quiescent Current in Normal Operation
Wide VIN Range From 2.3 V to 5.5 V
Support VIN ≥ VOUT Operation
±2% Total DC Voltage Accuracy
Light-Load PFM Mode
Pass-through Mode by Pulling EN Low
Thermal Shutdown and Overload Protection
Only Three Surface-Mount External Components
Required
Total Solution Size < 25 mm2
9-Pin NanoFree™ (CSP) Packaging
The TPS61256xC operates at a regulated 3.5-MHz
switching frequency and enters power-save mode
operation at light load currents to maintain high
efficiency over the entire load current range. The
PFM mode extends the battery life by reducing the
quiescent current to 37 μA (typ) during light load
operation.
In addition, the TPS61256xC device can also support
the pass-through mode by pulling EN to low. In this
mode, the output voltage follows the input voltage
with a voltage drop by the resistance of the inductor
and high-side FET.
2 Applications
•
•
•
•
The TPS61256xC offers a very small solution size
due to minimum amount of external components. It
allows the use of small inductors and input capacitors
to achieve a small solution size.
NFC PA Supply
Cell Phones, Smart Phones
Mono and Stereo APA Applications
USB Charging Ports
Device Information(1)
PART NUMBER
3 Description
TPS61256xC
The TPS61256xC device provides a power supply
solution for battery-powered portable applications.
Intended
for
low-power
applications,
the
TPS61256xC supports up to 800-mA load current
from a battery discharged as low as 2.65 V and
allows the use of low cost chip inductor and
capacitors.
PACKAGE
DSBGA (9)
BODY SIZE (NOM)
1.206 mm × 1.306 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Efficiency vs Load Current
VO = 5.0 V
100
90
80
Efficiency - %
70
60
50
40
.
30
20
utp
IO
50.1
25.1
12.6
6.2
3.2
1.6
0.8
0.4
0.2
3.0
V
2 .7
.
0.1
ge -
3.6
Volt
a
3.3
4.2
V I Inp
ut
3.9
4.8
4.5
5.4
5.1
0
ent
urr
C
ut
100.1
199.6
398.1
794.3
10
A
-m
-O
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS61256C
SLVSDQ1A – FEBRUARY 2017 – REVISED JUNE 2017
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Table of Contents
1
2
3
4
5
6
7
8
9
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Device Options.......................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
3
4
7.1
7.2
7.3
7.4
7.5
7.6
4
4
4
4
5
6
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Typical Characteristics ..............................................
Parameter Measurement Information .................. 7
Detailed Description .............................................. 8
9.1
9.2
9.3
9.4
Overview ................................................................... 8
Functional Block Diagram ......................................... 8
Feature Description................................................... 9
Device Functional Modes........................................ 10
10 Application and Implementation........................ 12
10.1 Application Information.......................................... 12
10.2 Typical Application ................................................ 12
11 Power Supply Recommendations ..................... 18
12 Layout................................................................... 18
12.1 Layout Guidelines ................................................. 18
12.2 Layout Example .................................................... 18
12.3 Thermal Considerations ........................................ 19
13 Device and Documentation Support ................. 20
13.1
13.2
13.3
13.4
13.5
13.6
Device Support......................................................
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
20
20
20
20
20
20
14 Mechanical, Packaging, and Orderable
Information ........................................................... 21
14.1 Package Summary................................................ 21
14.2 Package Option Addendum .................................. 22
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (February 2017) to Revision A
•
2
Page
Added device numbers TPS612562C and TPS612564C ..................................................................................................... 3
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5 Device Options
(1)
TA
PART NUMBER (1)
OUTPUT
VOLTAGE
DEVICE
SPECIFIC FEATURES
–40°C to 85°C
TPS61256C
5.0 V
Supports 5 V / 900 mA loading
down to 3.3 V input voltage
–40°C to 85°C
TPS612562C
5.2 V
Supports 5.2 V / 900 mA loading
down to 3.3 V input voltage
–40°C to 85°C
TPS612564C
5.4 V
Supports 5.4 V / 900 mA loading
down to 3.3 V input voltage
For all available packages, see the orderable addendum at the end of the datasheet.
6 Pin Configuration and Functions
YFF Package
9-Bump DSBGA
Top and Bottom Views
A1
A2
A3
A3
A2
A1
B1
B2
B3
B3
B2
B1
C1
C2
C3
C3
C2
C1
Pin Functions
PIN
NAME
NO.
EN
B3
GND
I/O
I
C1, C2, C3
DESCRIPTION
EN = high, the device works in the boost mode. EN = low, the device is in pass-through mode. This
pin must not be left floating and must be terminated.
Ground pin.
SW
B1, B2
I/O
VIN
A3
I
Power supply input.
A1, A2
O
Boost converter output.
VOUT
This is the switch pin of the converter and is connected to the drain of the internal Power MOSFETs.
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
Voltage at VIN (2), VOUT (2), SW (2), EN (2)
Input voltage
Continuous average current into SW
Input current
Peak current into SW
MIN
MAX
UNIT
–0.3
7
V
(3)
1.8
(4)
Power dissipation
Internally limited
Operating, TA
Temperature
(1)
(2)
(3)
(4)
(5)
A
3.5
(5)
–40
85
Operating virtual junction, TJ
–40
150
Storage, Tstg
–65
150
°C
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability.
All voltages are with respect to network ground terminal.
Limit the junction temperature to 105°C for continuous operation at maximum output power.
Limit the junction temperature to 125°C for 5% duty cycle operation.
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (TA(max)) is dependent on the maximum operating junction temperature (TJ(max)), the
maximum power dissipation of the device in the application (PD(max)), and the junction-to-ambient thermal resistance of the part/package
in the application (θJA), as given by the following equation: TA(max)= TJ(max)–(θJA X PD(max)). To achieve optimum performance, it is
recommended to operate the device with a maximum junction temperature of 105°C.
7.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±2000
Charged-device model (CDM), per JEDEC specification JESD22C101 (2)
±1000
Machine model (MM)
±200
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 500-V HBM is possible with the necessary precautions.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 250-V CDM is possible with the necessary precautions.
7.3 Recommended Operating Conditions
MIN
MAX
UNIT
4.85
V
1.0
2.9
µH
5
50
µF
–40
85
°C
–40
125
°C
VI
Input voltage range
TPS61256xC
RL
Minimum resistive load for start-up
TPS61256xC
L
Inductance
0.7
CO
Output capacitance
3.5
TA
Ambient temperature
TJ
Operating junction temperature
NOM
2.5
10
Ω
7.4 Thermal Information
TPS61256xC
THERMAL METRIC (1)
YFF
UNIT
9 PINS
RθJA
Junction-to-ambient thermal resistance
108.3
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
1.0
°C/W
RθJB
Junction-to-board thermal resistance
18
°C/W
ψJT
Junction-to-top characterization parameter
4.2
°C/W
ψJB
Junction-to-board characterization parameter
17.9
°C/W
(1)
4
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).
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7.5 Electrical Characteristics
Minimum and maximum values are at VIN = 2.3V to 5.5V, EN = 1.8V, TA = –40°C to 85°C; Circuit of Parameter Measurement
Information section (unless otherwise noted). Typical values are at VIN = 3.6V, EN = 1.8V, TA = 25°C (unless otherwise
noted).
PARAMETER
TEST CONDITIONS
MIN
TYP MAX
UNIT
SUPPLY CURRENT
IQ
VUVLO
Operating quiescent current
into VIN Operating quiescent current
into VOUT pass-through mode quiescent current
into VIN pass-through mode quiescent current
into VOUT
Under-voltage lockout threshold
IOUT = 0 mA, VIN = 3.6 V
EN = VIN
Device not switching
30
45
µA
7
15
µA
IOUT = 0 mA, VIN = VOUT = 3.6 V
EN = GND,
Device not switching
11
20
µA
9.5
15
µA
Falling
2.0
2.1
V
Hysteresis
0.1
V
ENABLE
VIL_EN
Low-level input voltage
VIH_EN
High-level input voltage
0.4
Ilkg_EN
Input leakage current
Input connected to GND or VIN
VOUT
Regulated DC output voltage-TPS61256C
2.3 V ≤ VIN ≤ 4.85 V, IOUT = 0 mA
PWM operation. Open Loop
4.92
VOUT
Regulated DC output voltage-TPS612562C
2.3 V ≤ VIN ≤ 4.85 V, IOUT = 0 mA
PWM operation. Open Loop
VOUT
Regulated DC output voltage-TPS612564C
2.3 V ≤ VIN ≤ 4.85 V, IOUT = 0 mA
PWM operation. Open Loop
ΔVOUT
Power-save mode output ripple voltage
PFM operation, IOUT = 1 mA
V
1.0
V
0.5
µA
5
5.08
V
5.12
5.2
5.28
V
5.31
5.4
5.49
V
OUTPUT
50
mVpk
POWER SWITCH
rDS(on)
ILIM
High-side MOSFET on resistance
170
Low-side MOSFET on resistance
100
Switch valley current limit
EN = VIN, Open Loop
Pre-charge / pass-through mode current limit
(linear mode)
TPS61256xC
1900
mΩ
2150 2400
mA
500
Overtemperature protection
140
°C
Overtemperature hysteresis
20
°C
VIN = 3.6 V, VOUT = 4.5 V
3.5
MHz
IOUT = 0 mA.
Time from active EN to start switching
70
µs
400
µs
OSCILLATOR
fOSC
Oscillator frequency
TIMING
Start-up time
IOUT = 0 mA.
Time from active EN to VOUT
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7.6 Typical Characteristics
5.15
100
98
96
IO = 300 mA
94
VO - DC Output Voltage - V
92
Efficiency - %
90
IO = 10 mA
88
IO = 100 mA
86
84
82
IO = 800 mA
80
78
5.1
VI = 5 V
VI = 4.5 V
5.05
VI = 2.5 V
VI = 3.6 V
5
76
74
72
70
2.5 2.7 2.9 3.1 3.3 3.5 3.7 3.9 4.1 4.3 4.5 4.7 4.9 5.1 5.3 5.5
VI - Input Voltage - V
VO = 5 V
4.95
0.1
PFM/PWM Operation
VO = 5 V
Figure 1. Efficiency vs Input Voltage
1000
PFM/PWM Operation
60
VO - Peak-to-Peak Output Ripple Voltage - mV
5.45
VO - DC Output Voltage - V
100
Figure 2. DC Output Voltage vs Output Current
5.5
5.4
IO = 800 mA
5.35
IO = 500 mA
5.3
5.25
5.2
5.15
IO = 100 mA
IO = 10 mA
5.05
5
55
50
VO = 5 V
VI = 2.7 V
45
VI = 3.3 V
40
35
VI = 3.6 V
30
VI = 4.5 V
25
20
15
10
5
4.95
2.5 2.7 2.9 3.1 3.3 3.5 3.7 3.9 4.1 4.3 4.5 4.7 4.9 5.1 5.3 5.5
VI - Input Voltage - V
0
0
PFM/PWM
Operation
100 200 300 400 500 600 700 800 900 1000
IO - Output Current - mA
VO = 5 V
PFM/PWM Operation
CO = 22 µF 10 V (1210) X5R, muRata GRM32ER71A226K
Figure 3. DC Output Voltage vs Input Voltage
Figure 4. Peak-to-Peak Output Ripple Voltage vs Output
Current
200
80
75
180
70
160
RDS(on) - On-Resistance - mW
65
TA = 85°C
60
Supply Current - mA
10
IO - Output Current - mA
5.55
5.1
1
TA = 25°C
55
50
45
40
35
TA = -40°C
30
25
120
100
60
40
15
2.5 2.7 2.9 3.1 3.3 3.5 3.7 3.9 4.1 4.3 4.5 4.7 4.9
VI - Input Voltage - V
20
No Switching
Switch MOSFET
80
20
EN = High
Rectifier MOSFET
140
0
-30
-10
Figure 5. Supply Current vs Input Voltage
10
30
50
70
90
TJ - Junction Temperature - °C
110
130
VO = 5 V
Figure 6. MOSFET rDS(on) vs Temperature
6
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8 Parameter Measurement Information
TPS61256xC
L
1 μH
VIN
SW
VOUT
VOUT
VIN
CI
4.7 μF
EN
CO
10 μF
GND
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Figure 7. Parameter Measurement Schematic
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9 Detailed Description
9.1 Overview
The TPS61256xC synchronous step-up converter typically operates at a quasi-constant 3.5-MHz frequency pulse
width modulation (PWM) at moderate to heavy load currents. At light load currents, the TPS61256xC converter
operates in power-save mode with pulse frequency modulation (PFM).
During PWM operation, the converter uses a novel quasi-constant on-time valley current mode control scheme to
achieve excellent line/load regulation and allows the use of a small ceramic inductor and capacitors. Based on
the VIN/VOUT ratio, a simple circuit predicts the required on-time.
At the beginning of the switching cycle, the low-side N-MOS switch is turned-on and the inductor current ramps
up to a peak current that is defined by the on-time and the inductance. In the second phase, once the on-timer
has expired, the rectifier is turned-on and the inductor current decays to a preset valley current threshold. Finally,
the switching cycle repeats by setting the on timer again and activating the low-side N-MOS switch.
In general, a dc/dc step-up converter can only operate in "true" boost mode, i.e. the output “boosted” by a certain
amount above the input voltage. The TPS61256xC device operates differently as it can smoothly transition in and
out of zero duty cycle operation. Therefore the output can be kept as close as possible to its regulation limits
even though the converter is subject to an input voltage that tends to be excessive. In this operation mode, the
output current capability of the regulator is limited to 500 mA (min.). Refer to Figure 3 for further details.
The current mode architecture with adaptive slope compensation provides excellent transient load response,
requiring minimal output filtering. Internal soft-start and loop compensation simplifies the design process while
minimizing the number of external components.
9.2 Functional Block Diagram
SW
VIN
NMOS
Valley
Current
Sense
Modulator
Softstart
EN
Control
Logic
Error
Amplifier
Gate Driver
VOUT
PMOS
VREF
Thermal
Shutdown
Undervoltage
Lockout
GND
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9.3 Feature Description
9.3.1 Current Limit Operation
The TPS61256xC device employs a valley current limit sensing scheme. Current limit detection occurs during the
off-time by sensing of the voltage drop across the synchronous rectifier.
The output voltage is reduced as the power stage of the device operates in a constant current mode. The
maximum continuous output current (IOUT(CL)), before entering current limit (CL) operation, can be defined by
Equation 1.
IOUT(CL) = (1 - D) g (IVALLEY +
1
DIL )
2
(1)
The duty cycle (D) can be estimated by Equation 2
V gh
D = 1 - IN
VOUT
(2)
and the peak-to-peak current ripple (ΔIL) is calculated by Equation 3
V
D
DIL = IN g
L
f
(3)
The output current, IOUT(DC), is the average of the rectifier ripple current waveform. When the load current is
increased such that the lower peak is above the current limit threshold, the off-time is increased to allow the
current to decrease to this threshold before the next on-time begins (so called frequency fold-back mechanism).
When the current limit is reached the output voltage decreases during further load increase.
Figure 8 illustrates the inductor and rectifier current waveforms during current limit operation.
IL
Current Limit
Threshold
Rectifier
Current
IPEAK
IVALLEY = ILIM
IOUT(CL)
DIL
IOUT(DC)
Increased
Load Current
IIN(DC)
f
Inductorr
Current
IIN(DC)
DIL
ΔI L =
V IN D
×
L f
Figure 8. Inductor/Rectifier Currents in Current Limit Operation
9.3.2 Enable
The TPS61256xC device starts operation when EN is set high and starts up with the soft-start sequence. For
proper operation, the EN pin must be terminated and must not be left floating.
Pulling the EN low and Vin above UVLO, the device is in the forced pass-through mode and the output voltage
follows the input voltage (with a voltage drop of the inductor DCR and Rdson of HS FET).
9.3.3 Softstart
The TPS61256xC device has an internal softstart circuit that limits the inrush current during start-up. The first
step in the start-up cycle is the pre-charge phase. During pre-charge, the rectifying switch is turned on until the
output capacitor is charged to a value close to the input voltage. The rectifying switch is current limited (500 mA
min.) during this phase. This mechanism is used to limit the output current under short-circuit condition.
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Feature Description (continued)
Once the output capacitor has been biased to the input voltage, the converter starts switching. The soft-start
system progressively increases the on-time as a function of the input-to-output voltage ratio. As soon as the
output voltage is reached, the regulation loop takes control and full current operation is permitted.
The TPS61256xC works in the pass-through mode when EN is low and Vin above UVLO, the device enters into
the boost switching phase directly when EN becomes high.
9.3.4 Undervoltage Lockout
The under voltage lockout circuit prevents the device from malfunctioning at low input voltages and the battery
from excessive discharge. It disables the output stage of the converter once the falling VIN trips the under-voltage
lockout threshold VUVLO which is typically 2.0V. The device starts operation once the rising VIN trips VUVLO
threshold plus its hysteresis of 100 mV at typically 2.1 V.
9.3.5 Thermal Regulation
The TPS61256xC device contains a thermal regulation loop that monitors the die temperature during the precharge phase. If the die temperature rises to high values of about 110 °C, the device automatically reduces the
current to prevent the die temperature from increasing further. Once the die temperature drops about 10 °C
below the threshold, the device automatically increases the current to the target value. This function also reduces
the current during a short-circuit condition.
9.3.6 Thermal Shutdown
As soon as the junction temperature, TJ, exceeds 140°C (typ.) the device goes into thermal shutdown. In this
mode, the high-side and low-side MOSFETs are turned-off. When the junction temperature falls below the
thermal shutdown minus its hysteresis, the device continuous the operation.
9.4 Device Functional Modes
9.4.1 Power Save Mode
The TPS61256xC integrates a power save mode to improve efficiency at light load. In power save mode the
converter only operates when the output voltage trips below a set threshold voltage.
The TPS61256xC ramps up the output voltage with several pulses and goes into power save mode once the
output voltage exceeds the set threshold voltage.
The PFM mode is exited and PWM mode entered when the output current can no longer be supported in PFM
mode.
Figure 9. Power Save
10
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Device Functional Modes (continued)
9.4.2 Pass-Through Mode
When EN is pulled to low and Vin above UVLO, the device works in the pass-through mode and the output
voltage of TPS61256xC follows the input voltage level. In so called pass-through mode, the synchronous rectifier
is current limited to 500 mA (min.). The output voltage is slightly reduced due to voltage drop across the rectifier
MOSFET and the inductor DC resistance.
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10 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
10.1 Application Information
With a wide input voltage range of 2.3 V to 5.5 V, the TPS61256xC supports applications powered by Li-Ion
batteries with extended voltage range. Intended for low-power applications, it supports up to 800-mA load current
from a battery discharged as low as 2.65 V and allows the use of low cost chip inductor and capacitors. Different
fixed voltage output versions are available from 3.15 V to 5.0 V. The TPS61256xC offers a very small solution
size due to minimum amount of external components. The TPS6125xC allows the use of small inductors and
input capacitors to achieve a small solution size. During the pass-through mode, the output voltage is biased to
the input voltage.
10.2 Typical Application
This section details an application with TPS61256xC to output fixed 5.0 V.
L
1 μH
VIN
TPS61256xC
SW
VOUT
VOUT
VIN
CI
4.7 μF
EN
CO
10 μF
GND
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Figure 10. Smallest Solution Size Application
10.2.1 Design Requirements
In this example, TPS61256xC is used to design a 5-V power supply with up to 800-mA output current capability.
The TPS61256xC can be powered by one-cell Li-ion battery, and in this example the input voltage range is from
2.65 V to 4.85 V.
10.2.2 Detailed Design Procedure
Table 1. List of Components
REFERENCE
DESCRIPTION
PART NUMBER, MANUFACTURER (1)
L (2)
1.0 μH, 1.8 A, 48 mΩ, 3.2 x 2.5 x 1.0mm max. height
LQM32PN1R0MG0, muRata
CI
4.7 μF, 6.3 V, 0402, X5R ceramic
GRM155R60J475M, muRata
CO
10 μF, 6.3 V, 0603, X5R ceramic
GRM188R60J106ME84, muRata
(1)
(2)
See Third-Party Products Discalimer
Inductor used to characterize TPS61256xCYFF device.
10.2.2.1 Inductor Selection
A boost converter normally requires two main passive components for storing energy during the conversion, an
inductor and an output capacitor. TI advises selecting an inductor with a saturation current rating higher than the
possible peak current flowing through the power switches.
The inductor peak current varies as a function of the load, the input and output voltages and can be estimated
using Equation 4.
IOUT
VIN g D
V gh
IL(PEAK) =
+
with D = 1 - IN
2gfgL
(1 - D) g h
VOUT
(4)
12
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Selecting an inductor with insufficient saturation performance can lead to excessive peak current in the
converter. This could eventually harm the device and reduce its reliability.
When selecting the inductor, as well as the inductance, parameters of importance are: maximum current rating,
series resistance, and operating temperature. The inductor DC current rating should be greater (by some margin)
than the maximum input average current, refer to Equation 5 and Current Limit Operation section for more
details.
IL(DC) =
VOUT
1
g
g IOUT
VIN
h
(5)
The TPS61256xC series of step-up converters have been optimized to operate with a effective inductance in the
range of 0.7 µH to 2.9 µH and with output capacitors in the range of 10 µF to 47 µF. The internal compensation
is optimized for an output filter of L = 1 µH and CO = 10 µF. Larger or smaller inductor values can be used to
optimize the performance of the device for specific operating conditions. For more details, see the Checking
Loop Stability section.
In high-frequency converter applications, the efficiency is essentially affected by the inductor AC resistance (i.e.
quality factor) and to a smaller extent by the inductor DCR value. To achieve high efficiency operation, care
should be taken in selecting inductors featuring a quality factor above 25 at the switching frequency. Increasing
the inductor value produces lower RMS currents, but degrades transient response. For a given physical inductor
size, increased inductance usually results in an inductor with lower saturation current.
The total losses of the coil consist of both the losses in the DC resistance, R(DC) , and the following frequencydependent components:
• The losses in the core material (magnetic hysteresis loss, especially at high switching frequencies)
• Additional losses in the conductor from the skin effect (current displacement at high frequencies)
• Magnetic field losses of the neighboring windings (proximity effect)
• Radiation losses
The following inductor series from different suppliers have been used with the TPS61256xC converters.
Table 2. List of Inductors
MANUFACTURER
(1)
SERIES
DIMENSIONS (in mm)
HITACHI METALS
KSLI-322512BL1-1R0
3.2 x 2.5 x 1.2 max. height
LQM32PN1R0MG0
3.2 x 2.5 x 1.0 max. height
MURATA
LQM2HPN1R0MG0
2.5 x 2.0 x 1.0 max. height
LQM21PN1R5MC0
2.0 x 1.2 x 0.55 max height
DFE322512C-1R0
3.2 x 2.5 x 1.2 max. height
MDT2012-CLR1R0AM
2.0 x 1.2 x 0.58 max height
TOKO
(1)
See Third-Party Products Disclaimer
10.2.2.2 Output Capacitor
For the output capacitor, TI recommends using small ceramic capacitors placed as close as possible to the
VOUT and GND pins of the IC. If, for any reason, the application requires the use of large capacitors which can
not be placed close to the IC, using a smaller ceramic capacitor in parallel to the large one is highly
recommended. This small capacitor should be placed as close as possible to the VOUT and GND pins of the IC.
To get an estimate of the recommended minimum output capacitance, Equation 6 can be used.
CMIN =
IOUT g (VOUT
-
VIN )
f g DV g VOUT
(6)
Where f is the switching frequency which is 3.5 MHz (typ.) and ΔV is the maximum allowed output ripple.
With a chosen ripple voltage of 20mV, a minimum effective capacitance of 9 μF is needed. The total ripple is
larger due to the ESR of the output capacitor. This additional component of the ripple can be calculated using
Equation 7
VESR = IOUT g RESR
(7)
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An MLCC capacitor with twice the value of the calculated minimum should be used due to DC bias effects. This
is required to maintain control loop stability. The output capacitor requires either an X7R or X5R dielectric. Y5V
and Z5U dielectric capacitors, aside from their wide variation in capacitance over temperature, become resistive
at high frequencies. There are no additional requirements regarding minimum ESR. Larger capacitors cause
lower output voltage ripple as well as lower output voltage drop during load transients but the total output
capacitance value should not exceed ca. 50µF.
DC bias effect: high cap. ceramic capacitors exhibit DC bias effects, which have a strong influence on the
device's effective capacitance. Therefore the right capacitor value has to be chosen very carefully. Package size
and voltage rating in combination with material are responsible for differences between the rated capacitor value
and it's effective capacitance. For instance, a 10-µF X5R 6.3-V 0603 MLCC capacitor would typically show an
effective capacitance of less than 4 µF (under 5 V bias condition, high temperature).
In applications featuring high pulsed load currents, it is recommended to run the converter with a reasonable
amount of effective output capacitance, for instance x2 10-µF X5R 6.3-V 0603 MLCC capacitors connected in
parallel.
10.2.2.3 Input Capacitor
Multilayer ceramic capacitors are an excellent choice for input decoupling of the step-up converter as they have
extremely low ESR and are available in small footprints. Input capacitors should be located as close as possible
to the device. While a 4.7-μF input capacitor is sufficient for most applications, larger values may be used to
reduce input current ripple without limitations.
Take care when using only ceramic input capacitors. When a ceramic capacitor is used at the input and the
power is being supplied through long wires, such as from a wall adapter, a load step at the output can induce
ringing at the VIN pin. This ringing can couple to the output and be mistaken as loop instability or could even
damage the part. Additional "bulk" capacitance (electrolytic or tantalum) should in this circumstance be placed
between CI and the power source lead to reduce ringing that can occur between the inductance of the power
source leads and CI.
10.2.2.4 Checking Loop Stability
The first step of circuit and stability evaluation is to look from a steady-state perspective at the following signals:
• Switching node, SW
• Inductor current, IL
• Output ripple voltage, VOUT(AC)
These are the basic signals that need to be measured when evaluating a switching converter. When the
switching waveform shows large duty cycle jitter or the output voltage or inductor current shows oscillations, the
regulation loop may be unstable. This is often a result of board layout and/or L-C combination.
As a next step in the evaluation of the regulation loop, the load transient response is tested. The time between
the application of the load transient and the turn on of the P-channel MOSFET, the output capacitor must supply
all of the current required by the load. VOUT immediately shifts by an amount equal to ΔI(LOAD) x ESR, where ESR
is the effective series resistance of COUT. ΔI(LOAD) begins to charge or discharge COUT generating a feedback
error signal used by the regulator to return VOUT to its steady-state value. The results are most easily interpreted
when the device operates in PWM mode.
During this recovery time, VOUT can be monitored for settling time, overshoot or ringing that helps judge the
converter’s stability. Without any ringing, the loop has usually more than 45° of phase margin. Because the
damping factor of the circuitry is directly related to several resistive parameters (e.g., MOSFET rDS(on)) that are
temperature dependant, the loop stability analysis has to be done over the input voltage range, load current
range, and temperature range.
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10.2.3 Application Curves
FIGURE
PFM operation
Figure 11
PWM operation
Figure 12
Combined line/load transient response
Figure 13
Load transient response
Figure 14, Figure 16
AC load transient response
Figure 15, Figure 17
Start-up
Figure 18, Figure 19
spacing
VI = 3.6 V
VO = 5 V
IO = 40 mA
VI = 3.6 V
Figure 11. Power-Save Mode Operation
VO = 5 V
50 to 500 mA Load
Step
3.3 V to 3.9 V Line
Step
Figure 13. Combined Line/Load Transient Response
VO = 5 V
IO = 200 mA
Figure 12. PWM Operation
VI = 3.6 V
VO = 5 V
50 to 500 mA Load Step
CO = 10 µF 6.3 V (0603) X5R, muRata
Figure 14. Load Transient Response in PFM/PWM
Operation
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VI = 3.6 V
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VO = 5 V
0 to 400 mA Load
CO = 10 µF 6.3 V (0603) X5R, muRata
Figure 15. AC Load Transient Response
VI = 3.6 V
VO = 5 V
0 to 400 mA Load
CO = 22 µF 10 V (1210) X5R, muRata
Figure 17. AC Load Transient Response
16
VI = 3.6 V
VO = 5 V
50 to 500 mA Load Step
CO = 22 µF 10 V (1210) X5R, muRata
Figure 16. Load Transient Response in PFM/PWM
Operation
VI = 3.6 V
VO = 5 V
IO = 0 mA
Figure 18. Pass-through to Boost by EN toggling
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VO = 5 V
IO = 0 mA
EN Connect to VIN
Figure 19. Start-Up by VIN
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11 Power Supply Recommendations
The power supply can be three-cell alkaline, NiCd or NiMH, or one-cell Li-Ion or Li-Polymer battery. The input
supply should be well regulated with the rating of TPS61256xC. If the input supply is located more than a few
inches from the device, additional bulk capacitance may be required in addition to the ceramic bypass capacitors.
An electrolytic or tantalum capacitor with a value of 47 µF is a typical choice.
12 Layout
12.1 Layout Guidelines
For all switching power supplies, the layout is an important step in the design, especially at high peak currents
and high switching frequencies. If the layout is not carefully done, the regulator could show stability problems as
well as EMI problems. Therefore, use wide and short traces for the main current path and for the power ground
tracks. The input capacitor, output capacitor, and the inductor should be placed as close as possible to the IC.
Use a common ground node for power ground and a different one for control ground to minimize the effects of
ground noise. Connect these ground nodes at any place close to the ground pins of the IC.
12.2 Layout Example
GND
EN
CIN
C3
U1
COUT
GND
VOUT
VIN
L1
Figure 20. Suggested Layout (Top View)
18
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12.3 Thermal Considerations
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added
heat sinks and convection surfaces, and the presence of other heat-generating components affect the powerdissipation limits of a given component.
Three basic approaches for enhancing thermal performance are listed below:
• Improving the power dissipation capability of the PCB design
• Improving the thermal coupling of the component to the PCB
• Introducing airflow in the system
As power demand in portable designs is more and more important, designers must figure the best trade-off
between efficiency, power dissipation and solution size. Due to integration and miniaturization, junction
temperature can increase significantly which could lead to bad application behaviors (i.e. premature thermal
shutdown or worst case reduce device reliability).
Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where
the high maximum power dissipation exists, special care must be paid to thermal dissipation issues in board
design. The device operating junction temperature (TJ) should be kept below 125°C.
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13 Device and Documentation Support
13.1 Device Support
13.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
13.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
13.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
13.4 Trademarks
NanoFree, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
13.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
13.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
20
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14 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
14.1 Package Summary
Chip Scale Package
(Bottom View)
D
A3
A2
A1
B3
B2
B1
C3
C2
C1
E
Chip Scale Package
(Top View)
YMS
CC
LLLL
A1
Code:
•
YM - 2 digit date code
•
S - assembly site code
•
CC - chip code (see ordering table)
•
LLLL - lot trace code
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14.2 Package Option Addendum
14.2.1 Packaging Information
(1)
(2)
(3)
(4)
(5)
(6)
Package
Type
Package
Drawing
Pins
Package
Qty
PREVIEW
DSBGA
YFF
9
3000
TPS612562CYFFT
PREVIEW
DSBGA
YFF
9
TPS612564CYFFR
PREVIEW
DSBGA
YFF
TPS612564CYFFT
PREVIEW
DSBGA
YFF
Orderable Device
Status
TPS612562CYFFR
(1)
Lead/Ball
Finish (3)
MSL Peak Temp
Green (RoHS
and no Sb/Br)
SNAGCU
250
Green (RoHS
and no Sb/Br)
9
3000
9
250
Op Temp (°C)
Device Marking (5) (6)
Level-1-260C-UNLIM
–40 to 85
16H
SNAGCU
Level-1-260C-UNLIM
–40 to 85
16H
Green (RoHS
and no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
–40 to 85
16I
Green (RoHS
and no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
–40 to 85
16I
Eco Plan
(2)
(4)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
space
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest
availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the
requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified
lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used
between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by
weight in homogeneous material)
space
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the
finish value exceeds the maximum column width.
space
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
space
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device
space
Multiple Device markings will be inside parentheses. Only on Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief
on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third
parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for
release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
22
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Orderable Device
(1)
(2)
(3)
(4)
(5)
(6)
SLVSDQ1A – FEBRUARY 2017 – REVISED JUNE 2017
Status
(1)
Package
Type
Package
Drawing
Pins
Package
Qty
Eco Plan
(2)
Lead/Ball
Finish (3)
MSL Peak Temp
(4)
Op Temp (°C)
Device Marking (5) (6)
TPS61256CYFFR
ACTIVE
DSBGA
YFF
9
3000
Green (RoHS
and no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
–40 to 85
15U
TPS61256CYFFT
ACTIVE
DSBGA
YFF
9
250
Green (RoHS
and no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
–40 to 85
15U
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
space
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest
availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the
requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified
lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used
between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by
weight in homogeneous material)
space
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the
finish value exceeds the maximum column width.
space
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
space
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device
space
Multiple Device markings will be inside parentheses. Only on Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief
on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third
parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for
release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
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14.2.2 Tape and Reel Information
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
B0 W
Reel
Diameter
Cavity
A0
B0
K0
W
P1
A0
Dimension designed to accommodate the component width
Dimension designed to accommodate the component length
Dimension designed to accommodate the component thickness
Overall width of the carrier tape
Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1
Q2
Q1
Q2
Q3
Q4
Q3
Q4
User Direction of Feed
Pocket Quadrants
24
Device
Package
Type
Package
Drawing
Pins
SPQ
Reel
Diameter
(mm)
Reel
Width W1
(mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
TPS612562CYFFR
DSBGA
YFF
9
3000
180.0
8.4
1.41
1.31
0.69
2.0
8.0
Q1
TPS612562CYFFT
DSBGA
YFF
9
250
180.0
8.4
1.41
1.31
0.69
2.0
8.0
Q1
TPS612564CYFFR
DSBGA
YFF
9
3000
180.0
8.4
1.41
1.31
0.69
2.0
8.0
Q1
TPS612564CYFFT
DSBGA
YFF
9
250
180.0
8.4
1.41
1.31
0.69
2.0
8.0
Q1
TPS61256CYFFR
DSBGA
YFF
9
3000
180.0
8.4
1.41
1.31
0.69
2.0
8.0
Q1
TPS61256CYFFT
DSBGA
YFF
9
250
180.0
8.4
1.41
1.31
0.69
2.0
8.0
Q1
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TAPE AND REEL BOX DIMENSIONS
Width (mm)
W
L
H
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPS612562CYFFR
DSBGA
YFF
9
3000
182.0
182.0
20.0
TPS612562CYFFT
DSBGA
YFF
9
250
182.0
182.0
20.0
TPS612564CYFFR
DSBGA
YFF
9
3000
182.0
182.0
20.0
TPS612564CYFFT
DSBGA
YFF
9
250
182.0
182.0
20.0
TPS61256CYFFR
DSBGA
YFF
9
3000
182.0
182.0
20.0
TPS61256CYFFT
DSBGA
YFF
9
250
182.0
182.0
20.0
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Copyright © 2017, Texas Instruments Incorporated
Product Folder Links: TPS61256C
25
PACKAGE OUTLINE
YFF0009
DSBGA - 0.625 mm max height
SCALE 10.000
DIE SIZE BALL GRID ARRAY
B
A
E
BALL A1
CORNER
D
0.625 MAX
C
SEATING PLANE
0.30
0.12
BALL TYP
0.05 C
0.8 TYP
C
0.8
TYP
SYMM
B
D: Max = 1.336 mm, Min =1.276 mm
0.4 TYP
E: Max = 1.236 mm, Min =1.176 mm
A
9X
0.015
0.3
0.2
C A B
1
2
3
SYMM
0.4 TYP
4219552/A 05/2016
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
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EXAMPLE BOARD LAYOUT
YFF0009
DSBGA - 0.625 mm max height
DIE SIZE BALL GRID ARRAY
(0.4) TYP
9X ( 0.23)
1
2
3
A
(0.4) TYP
SYMM
B
C
SYMM
LAND PATTERN EXAMPLE
SCALE:30X
0.05 MAX
( 0.23)
METAL
METAL UNDER
SOLDER MASK
0.05 MIN
( 0.23)
SOLDER MASK
OPENING
SOLDER MASK
OPENING
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
4219552/A 05/2016
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. For more information,
see Texas Instruments literature number SNVA009 (www.ti.com/lit/snva009).
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EXAMPLE STENCIL DESIGN
YFF0009
DSBGA - 0.625 mm max height
DIE SIZE BALL GRID ARRAY
(0.4) TYP
(R0.05) TYP
9X ( 0.25)
1
2
3
A
(0.4) TYP
SYMM
B
METAL
TYP
C
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE:30X
4219552/A 05/2016
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
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