Texas Instruments | LM385-1.2-MIL Micropower Voltage References | Datasheet | Texas Instruments LM385-1.2-MIL Micropower Voltage References Datasheet

Texas Instruments LM385-1.2-MIL Micropower Voltage References Datasheet
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LM385-1.2-MIL
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LM385-1.2-MIL Micropower Voltage References
1 Features
3 Description
•
These micropower, two-terminal, band-gap voltage
references operate over a 10-μA to 20-mA current
range and feature exceptionally low dynamic
impedance and good temperature stability. On-chip
trimming provides tight voltage tolerance. The bandgap reference for these devices has low noise and
long-term stability.
1
•
•
•
•
Operating Current Range
– LM385-1.2-MIL: 15 μA to 20 mA
1% and 2% Initial Voltage Tolerance
Reference Impedance
– LM385-1.2-MIL: 1 Ω maximum at 25°C
– All devices: 1.5 Ω maximum over Full
Temperature Range
Very Low Power Consumption
Interchangeable with Industry Standard
LM385-1.2-MIL
2 Applications
•
•
•
•
•
Portable Meter References
Portable Test Instruments
Battery-Operated Systems
Current-Loop Instrumentation
Panel Meters
The design makes these devices exceptionally
tolerant of capacitive loading and, thus, easier to use
in most reference applications. The wide dynamic
operating temperature range accommodates varying
current supplies, with excellent regulation.
The extremely low power drain of this series makes
them useful for micropower circuitry. These voltage
references can be used to make portable meters,
regulators, or general-purpose analog circuitry, with
battery life approaching shelf life. The wide operating
current range allows them to replace older references
with tighter-tolerance parts.
Device Information(1)
PART NUMBER
LM385-1.2-MIL
PACKAGE (PIN)
BODY SIZE (NOM)
SOIC (8)
4.90 mm × 3.91 mm
SOP (8)
6.20 mm × 5.30 mm
TSSOP (8)
3.00 mm × 4.40 mm
TO-226 (3)
4.30 mm × 4.30 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Simplified Schematic
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM385-1.2-MIL
SLVSE73 – JUNE 2017
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Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
6.5
6.6
4
4
4
4
5
6
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Typical Characteristics ..............................................
8
8.1 Application Information.............................................. 9
8.2 Typical Application ................................................... 9
8.3 System Examples ................................................... 11
9 Power Supply Recommendations...................... 12
10 Layout................................................................... 12
10.1 Layout Guidelines ................................................. 12
10.2 Layout Example .................................................... 12
11 Device and Documentation Support ................. 13
11.1
11.2
11.3
11.4
11.5
11.6
Detailed Description .............................................. 8
7.1
7.2
7.3
7.4
Overview ...................................................................
Functional Block Diagram .........................................
Feature Description...................................................
Device Functional Modes..........................................
Application and Implementation .......................... 9
8
8
8
8
Documentation Support .......................................
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
13
13
13
13
13
13
12 Mechanical, Packaging, and Orderable
Information ........................................................... 14
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
2
DATE
REVISION
NOTES
June 2017
*
Initial release.
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5 Pin Configuration and Functions
D, PS, PW or LP
8-Pin SOIC,SOP,TSSOP or TO-226
Top View
(TOP VIEW)
Pin Functions
PIN
NAME
LP
D, PS or PW
ANODE
1
4
CATHODE
2
NC
3
TYPE
DESCRIPTION
I
Shunt Current/Voltage input
8
O
Common pin, normally connected to ground
1, 2, 3, 5, 6, 7
—
No internal connection
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN
IR
Reverse current
IF
Forward current
TJ
Operating virtual junction temperature
Tstg
Storage temeprature
(1)
MAX
–65
UNIT
30
mA
10
mA
150
°C
150
°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1)
±2000
Charged device model (CDM), per JEDEC specification JESD22-C101,
all pins (2)
±1000
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
IZZ
Reference current
TA
Operating free-air temperature
MIN
MAX
0.01
20
UNIT
mA
0
70
°C
6.4 Thermal Information
LMx85-1.2-MIL
THERMAL METRIC (1)
RθJA
(1)
4
Junction-to-ambient thermal resistance
D
LP
PS
PW
8 PINS
3 PINS
8 PINS
8 PINS
97
140
95
149
UNIT
°C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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6.5 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
VZ
Reference voltage
αVZ
Average temperature coefficient of
reference voltage (3)
TEST CONDITIONS
IZ = I(min) to 20 mA
25°C
IZ = I(min) to 20 mA
(2)
Full range
IZ = I(min) to 1 mA (2)
Change in reference voltage with
current
ΔVZ
IZ = I(min) to 20 mA
ΔVZ/Δt
Long-term change in reference
voltage
IZ(min)
Minimum reference current
IZ = 100 µA
Reference impedance
IZ = 100 µA, f = 25 Hz
Vn
Broadband noise voltage
IZ = 100 µA, f = 10 Hz to 10 kHz
MIN
1.21
TYP
MAX
1.235
UNIT
1.26
±20
25°C
1
1.5
25°C
20
Full range
30
25°C
25°C
±20
mV
ppm/khr
8
15
0.4
1
Full range
25°C
V
ppm/°C
Full range
Full range
ZZ
(1)
(2)
(3)
TA (1)
(2)
1.5
60
µA
Ω
µV
Full range is −40°C to 85°C for the LM385-1.2-MIL.
I(min) = 15 μA for the LM385-1.2-MIL.
The average temperature coefficient of reference voltage is defined as the total change in reference voltage divided by the specified
temperature range.
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6.6 Typical Characteristics
6
Figure 1. Reverse Current vs Reverse Voltage
Figure 2. Reference Voltage Change vs Reverse Current
Figure 3. Forward Voltage vs Forward Current
Figure 4. Reference Voltage vs Free-Air Temperature
Figure 5. Reference Impedance vs Reference Current
Figure 6. Noise Voltage vs Frequency
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Typical Characteristics (continued)
Figure 7. Output Noise Voltage vs Cutoff Frequency
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7 Detailed Description
7.1 Overview
The LM385-1.2-MIL device is micropower, two-terminal, band-gap voltage references which operate over a 10μA to 20-mA current range. On-chip trimming provides tight voltage tolerance. The band-gap reference for these
devices has low noise and long-term stability.
The design makes these devices exceptionally tolerant of capacitive loading and, thus, easier to use in most
reference applications. The wide dynamic operating temperature range accommodates varying current supplies,
with excellent regulation.
The extremely low power drain of this series makes them useful for micropower circuitry. These voltage
references can be used to make portable meters, regulators, or general-purpose analog circuitry, with battery life
approaching shelf life.
7.2 Functional Block Diagram
A.
Component values shown are nominal.
7.3 Feature Description
A band gap voltage reference controls high gain amplifier and shunt pass element to maintain a nearly constant
voltage between cathode and anode. Regulation occurs after a minimum current is provided to power the voltage
divider and amplifier. Internal frequency compensation provides a stable loop for all capacitor loads. Floating
shunt design is useful for both positive and negative regulation applications.
7.4 Device Functional Modes
The LM385-1.2-MIL device operates in one mode, which is as a fixed voltage reference that cannot be adjusted.
In order for a proper Reverse Voltage to be developed, current must be sourced into the cathode of LM285. The
minimum current needed for proper regulation is denoted in Electrical Characteristics as IZ,min.
8
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The LM385-1.2-MIL device creates a voltage reference for to be used for a variety of applications including
amplifiers, power supplies, and current-sensing circuits. The following application shows how to use these
devices to establish a voltage reference.
8.2 Typical Application
5V
36 k
1.2 V
LM385-1.2-MIL
Figure 8. Generating Reference Voltage With a Resistive Current Source
8.2.1 Design Requirements
The key design requirement when using this device as a voltage reference is to supply the LM385 with a
minimum Cathode Current (IZ), as indicated in Electrical Characteristics.
8.2.2 Detailed Design Procedure
In order to generate a constant and stable reference voltage, a current greater than IZ(MIN) must be sourced into
the cathode of this device. This can be accomplished using a current regulating device such as LM334 or a
simple resistor. For a resistor, its value should be equal to or greater than (Vsupply - Vreference) ÷ IZ(MIN) .
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Typical Application (continued)
8.2.3 Application Curve
Figure 9. Transient Response
10
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8.3 System Examples
8.3.1 Thermocouple Cold-Junction Compensator
IO ~
~ 58 μA
V+
5.1 kΩ
Mercury Cell
1.345 V
100 kΩ ± 1%
2.00 kΩ ± 1%
LM334
cw
cw
V500 Ω
10 kΩ
LM385-1.2-MIL
412 Ω
± 1%
953 Ω
± 1%
Type K
Meter
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Figure 10. Thermocouple Cold-Junction Compensator
8.3.2 Generating Reference Voltage with a Constant Current Source
2.3 V < V+ < 30 V
V+
LM334
R
V-
2.74 kΩ
1.2 V
LM385-1.2-MIL
Copyright © 2016, Texas Instruments Incorporated
Figure 11. Generating Reference Voltage With a Constant Current Source Device
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9 Power Supply Recommendations
In order to not exceed the maximum cathode current, be sure that the supply voltage is current limited.
For applications shunting high currents (30 mA max), pay attention to the cathode and anode trace lengths,
adjusting the width of the traces to have the proper current density.
10 Layout
10.1 Layout Guidelines
Figure 12 shows an example of a PCB layout of LM385x-1.2-MIL. Some key Vref niose considerations are:
• Connect a low-ESR, 0.1-μF (CL) ceramic bypass capacitor on the cathode pin node.
• Decouple other active devices in the system per the device specifications.
• Using a solid ground plane helps distribute heat and reduces electromagnetic interference (EMI) noise pickup.
• Place the external components as close to the device as possible. This configuration prevents parasitic errors
(such as the Seebeck effect) from occurring.
• Do not run sensitive analog traces in parallel with digital traces. Avoid crossing digital and analog traces if
possible and only make perpendicular crossings when absolutely necessary.
10.2 Layout Example
Rsup
NC 1
NC 2
NC 3
8
CATHODE
7
6
4
5
NC
NC
NC
ANODE
GND
Vsup
CL
GND
Figure 12. Layout Diagram
12
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11 Device and Documentation Support
11.1 Documentation Support
11.1.1 Related Documentation
For related documentation see the following:
• AN-715 LM385 Feedback Provides Regulator Isolation
• AN-284 Single-Supply Applications of CMOS MICRODACs
• AN-777 LM2577 Three Output, Isolated Flyback Regulator
11.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
11.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
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12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
14
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PACKAGE OPTION ADDENDUM
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29-Jun-2017
PACKAGING INFORMATION
Orderable Device
Status
(1)
LM385-1.2-MWC
ACTIVE
Package Type Package Pins Package
Drawing
Qty
WAFERSALE
YS
0
1
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Green (RoHS
& no Sb/Br)
Call TI
Level-1-NA-UNLIM
Op Temp (°C)
Device Marking
(4/5)
-40 to 85
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
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