Texas Instruments | LM78M05-MIL Series 3-Terminal 500-mA Positive Voltage Regulator | Datasheet | Texas Instruments LM78M05-MIL Series 3-Terminal 500-mA Positive Voltage Regulator Datasheet

Texas Instruments LM78M05-MIL Series 3-Terminal 500-mA Positive Voltage Regulator Datasheet
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LM78M05-MIL
SNVSAX6 – JUNE 2017
LM78M05-MIL Series 3-Terminal 500-mA Positive Voltage Regulator
1 Features
3 Description
•
•
•
•
•
•
The LM78M05-MIL three-pin positive voltage
regulator employs built-in current limiting, thermal
shutdown, and safe-operating area protection, which
makes them virtually immune to damage from output
overloads.
1
•
Output Current in Excess of 0.5 A
No External Components
Internal Thermal Overload Protection
Internal Short Circuit Current-Limiting
Output Transistor Safe-Area Compensation
Available in 3-Pin TO-220, TO-252, and TO
packages
Output Voltage: 5 V
With adequate heat sinking, they can deliver in
excess of 0.5-A output current. Typical applications
would include local (on-card) regulators which can
eliminate the noise and degraded performance
associated with single-point regulation.
2 Applications
•
•
•
•
•
Device Information(1)
Electronic Point-of-Sale
Medical and Health Fitness Applications
Printers
Appliances and White Goods
TVs and Set-Top Boxes
PART NUMBER
LM78M05
BODY SIZE (NOM)
TO-220 (3)
10.16 mm × 14.986 mm
TO-252 (3)
6.10 mm × 6.58 mm
TO (3)
9.14 mm × 9.14 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Available Packages
Pin 1. Input
2. Ground
3. Output
Tab/Case is Ground
PACKAGE
Simplified Application
1
LM78M05-MIL
2
3
TO
TO-220
VIN
IN
OUT
VOUT
GND
1
2
3
TO-252
1
2
3
Copyright © 2017, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM78M05-MIL
SNVSAX6 – JUNE 2017
www.ti.com
Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
3
6.1
6.2
6.3
6.4
6.5
3
3
4
4
5
Absolute Maximum Ratings ......................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Typical Characteristics ..............................................
8
8.1 Application Information............................................ 10
8.2 Typical Application .................................................. 10
9 Power Supply Recommendations...................... 11
10 Layout................................................................... 11
10.1 Layout Guidelines ................................................. 11
10.2 Layout Example .................................................... 12
10.3 Thermal Considerations ........................................ 12
11 Device and Documentation Support ................. 15
11.1
11.2
11.3
11.4
11.5
11.6
Detailed Description .............................................. 7
7.1
7.2
7.3
7.4
Overview ...................................................................
Functional Block Diagram .........................................
Feature Description...................................................
Device Functional Modes..........................................
Application and Implementation ........................ 10
7
8
9
9
Documentation Support ........................................
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
15
15
15
15
15
15
12 Mechanical, Packaging, and Orderable
Information ........................................................... 15
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
2
DATE
REVISION
NOTES
June 2017
*
Initial release.
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5 Pin Configuration and Functions
NDE Package
3-Pin TO-220
Top View
NDP Package
3-Pin TO-252
Top View
NDT Package
3-Pin TO
Top View
Pin Functions
PIN
NAME
NO.
I/O
DESCRIPTION
TO-220
TO-252
TO
2/TAB
2/TAB
3
INPUT
1
1
1
I
Input
OUTPUT
2
2
2
O
Output
GND
—
Tab is GND
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1) (2)
MIN
Input voltage
5 V ≤ VO ≤ 15 V
Power dissipation
Lead temperature (Soldering, 10 s)
MAX
UNIT
35
V
Internally limited
TO package (NDT)
300
TO-220 package (NDE)
260
°C
Operating junction temperature
–40
125
°C
Storage temperature, Tstg
–65
150
°C
(1)
(2)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
6.2 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
Input voltage
Output current
MIN
MAX
VOUT + 1.8
35
V
0.5
A
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UNIT
3
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6.3 Thermal Information
LM78M05
THERMAL METRIC
(1)
NDP
(TO-252)
NDT
(TO)
3 PINS
3 PINS
UNIT
RθJA
Junction-to-ambient thermal resistance
38
162.4
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
48.4
23.9
°C/W
RθJB
Junction-to-board thermal resistance
17.7
—
°C/W
ψJT
Junction-to-top characterization parameter
6.7
—
°C/W
ψJB
Junction-to-board characterization parameter
17.9
—
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
4.4
—
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.4 Electrical Characteristics
VIN = 10 V, CIN = 0.33 µF, CO = 0.1 µF, TJ = 25°C (unless otherwise noted). Limits are specified by production testing or
correlation techniques using standard Statistical Quality Control (SQC) methods.
PARAMETER
TEST CONDITIONS
IL = 500 mA
VO
VRLINE
Output voltage
Line regulation
5 mA ≤ IL ≤ 500 mA, PD ≤ 7.5 W,
7.5 V ≤ VIN ≤ 20 V, –40°C ≤ TJ ≤
125°C
7.2 V ≤ VIN ≤ 25 V
VRLOAD
Load regulation
IL = 5 mA to 500 mA
IQ
Quiescent current
IL = 500 mA
MIN
TYP
MAX
4.8
5
5.2
4.75
5
5.25
IL = 100
mA
50
IL = 500
mA
100
UNIT
V
mV
4
5 mA ≤ IL ≤ 500 mA,
100
mV
10
mA
0.5
ΔIQ
Quiescent current change
Vn
Output noise voltage
10 Hz ≤ f ≤ 100 kHz
40
µV
ΔVIN
Ripple rejection
f = 120 Hz, IL = 500 mA
78
dB
VIN
Input voltage required to maintain
line regulation
IL = 500 mA
ΔVO
Long-term stability
IL = 500 mA, –40°C ≤ TJ ≤ 125°C
4
7.5 V ≤ VIN ≤ 25 V, IL = 500 mA
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1
7.2
mA
V
20
mV/khrs
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6.5 Typical Characteristics
Figure 1. Peak Output Current
Figure 2. Ripple Rejection
Figure 3. Ripple Rejection
Figure 4. Dropout Voltage
Normalized to 1 V
TJ = 25°C
Figure 5. Output Voltage
Figure 6. Quiescent Current
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Typical Characteristics (continued)
6
Figure 7. Quiescent Current
Figure 8. Output Impedance
Figure 9. Line Transient Response
Figure 10. Load Transient Response
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7 Detailed Description
7.1 Overview
The LM78M05-MIL device is a fixed positive voltage regulators. It can accept up to 35 V at the input and regulate
it down to outputs of 5 V, 12 V, or 15 V. The device is capable of supplying up to 500 mA of output current,
although it is important to ensure an adequate amount of heat sinking to avoid exceeding thermal limits.
However, in the case of accidental overload the device has built in current limiting, thermal shutdown and safeoperating area protection to prevent damage from occurring.
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7.2 Functional Block Diagram
8
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7.3 Feature Description
The LM78M05-MIL fixed voltage regulator has built-in thermal overload protection which prevents the device
from being damaged due to excessive junction temperature.
The regulator also contains internal short-circuit protection which limits the maximum output current, and safearea protection for the pass transistor which reduces the short-circuit current as the voltage across the pass
transistor is increased.
Although the internal power dissipation is automatically limited, the maximum junction temperature of the device
must be maintained below 125°C to meet data sheet specifications. An adequate heat sink must be provided to
assure this limit is not exceeded under worst-case operating conditions (maximum input voltage and load
current) if reliable performance is to be obtained.
7.4 Device Functional Modes
7.4.1 Normal Operation
The device OUTPUT pin sources current necessary to make the voltage at the OUTPUT pin equal to the fixed
voltage level of the device.
7.4.2 Operation With Low Input Voltage
The device requires up to 2-V headroom (VIN – VOUT) to operate in regulation. With less headroom, the device
may drop out of regulation in which the OUTPUT voltage would equal INPUT voltage minus dropout voltage.
7.4.3 Operation in Self Protection
When an overload occurs, the device shuts down Darlington NPN output stage or reduce the output current to
prevent device damage. The device automatically resets from the overload. The output may be reduced or
alternate between on and off until the overload is removed.
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The LM78M05-MIL device is a fixed voltage regulator that needs no external feedback resistors in order to set
the output voltage. Input. Output capacitors are not required for the device to be stable. However, input
capacitance helps filter noise from the supply and output capacitance improves the transient response.
8.2 Typical Application
LM78M05-MIL
IN
VIN
0.33 PF
OUT
GND
VOUT
0.1 PF
Copyright © 2017, Texas Instruments Incorporated
CIN required if regulator input is more than 4 inches from input filter capacitor (or if no input filter capacitor is used).
COUT is optional for improved transient response.
Figure 11. Typical Application
8.2.1 Design Requirements
For this design example, use the parameters listed in Table 1 as the input parameters.
Table 1. Design Parameters
PARAMETER
VALUE
CIN
0.33 µF
COUT
0.1 µF
8.2.2 Detailed Design Procedure
8.2.2.1 Input Voltage
Regardless of the output voltage option being used (5 V, 12 V, 15 V), the input voltage must be at least 2 V
greater to ensure proper regulation (7 V, 14 V, 17 V).
8.2.2.2 Output Current
Depending on the input-output voltage differential, the output current must be limited to ensure maximum power
dissipation is not exceeded. The graph in Figure 1 shows the appropriate current limit for a variety of conditions.
8.2.2.3 Input Capacitor
If no power supply filter capacitor is used or if the device is placed more than four inches away from the capacitor
of the power supply, an additional capacitor placed at the input pin of the device helps bypass noise.
10
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8.2.2.4 Output Capacitor
This device is designed to be stable with no output capacitance and can be omitted from the design if needed.
However if large changes in load are expected, an output capacitor is recommended to improve the transient
response.
8.2.3 Application Curves
Figure 12. RθJA vs 2-oz Copper Area for PFM
Figure 13. Maximum Allowable Power Dissipation
vs Ambient Temperature for PFM
Figure 14. Maximum Allowable Power Dissipation vs 2-oz Copper Area for PFM
9 Power Supply Recommendations
The LM78M05-MIL device is designed to operate from an input voltage supply range between VOUT + 2 V to 35
V. If the device is more than four inches from the power supply filter capacitors, an input bypass capacitor 0.1-µF
or greater of any type is recommended.
10 Layout
10.1 Layout Guidelines
Follow these layout guidelines to ensure proper regulation of the output voltage with minimum noise. TI
recommends that the input terminal be bypassed to ground with a bypass capacitor. The optimum placement is
closest to the input terminal of the device and the system GND. Take care to minimize the loop area formed by
the bypass-capacitor connection, the input terminal, and the system GND. Traces carrying the load current must
be wide to reduce the amount of parasitic trace inductance. In cases when VIN shorts to ground, an external
diode must be placed from VOUT to VIN to divert the surge current from the output capacitor and protect the
device. This diode must be placed close to the corresponding device pins to increase their effectiveness.
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10.2 Layout Example
Figure 15. Layout Recommendation
10.3 Thermal Considerations
When an integrated circuit operates with appreciable current, its junction temperature is elevated. It is important
to quantify its thermal limits to achieve acceptable performance and reliability. This limit is determined by
summing the individual parts consisting of a series of temperature rises from the semiconductor junction to the
operating environment. A one-dimension steady-state model of conduction heat transfer is demonstrated in
Figure 16. The heat generated at the device junction flows through the die to the die attach pad, through the lead
frame to the surrounding case material, to the printed-circuit board, and eventually to the ambient environment.
There are several variables that may affect the thermal resistance and in turn the need for a heat sink, which
includes the following.
Component variables (RθJC)
• Leadframe size and material
• Number of conduction pins
• Die size
• Die attach material
• Molding compound size and material
Application variables (RθCA)
• Mounting pad size, material, and location
• Placement of mounting pad
• PCB size and material
• Traces length and width
• Adjacent heat sources
• Volume of air
• Ambient temperature
• Shape of mounting pad
The case temperature is measured at the point where the leads contact the mounting pad surface
Figure 16. Cross-Sectional View of Integrated Circuit Mounted on a Printed-Circuit Board
12
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Thermal Considerations (continued)
The LM78M05-MIL regulator has internal thermal shutdown to protect the device from overheating. Under all
possible operating conditions, the junction temperature of the device must be within the range of 0°C to 125°C. A
heat sink may be required depending on the maximum power dissipation and maximum ambient temperature of
the application. To determine if a heat sink is needed, the power dissipated by the regulator (PD) is calculated
using Equation 1.
IIN = IL + IG
PD = (VIN – VOUT) × IL + (VIN × IG)
(1)
(2)
Figure 17 shows the voltages and currents which are present in the circuit.
LM78M05-MIL
IIN
IN
VIN
VOUT
OUT
IL
GND
IG
Load
Copyright © 2017, Texas Instruments Incorporated
Figure 17. Power Dissipation Diagram
Use to calculate the maximum allowable temperature rise, TR(max).
TR(max) = TJ(max) – TA(max)
where
•
•
TJ(max) is the maximum allowable junction temperature (125°C)
TA(max) is the maximum ambient temperature encountered in the application
Using the calculated values for TR(max) and PD, the maximum allowable value for the junction-to-ambient thermal
resistance (RθJA) can be calculated with Equation 3.
RθJA = TR(max) / PD
(3)
As a design aid, Table 2 shows the value of the RθJA of TO-252 for different heat sink area. The copper patterns
that we used to measure these RθJA are shown at the end of AN–1028 Maximum Power Enhancement
Techniques for Power Packages (SNVA036). Figure 12 reflects the same test results as what are in the Table 2.
Figure 13 shows the maximum allowable power dissipation versus ambient temperature for the PFM device.
Figure 14 shows the maximum allowable power dissipation versus copper area (in2) for the TO-252 device. For
power enhancement techniques to be used with TO-252 package, see AN–1028 Maximum Power Enhancement
Techniques for Power Packages (SNVA036).
Table 2. RθJA Different Heat Sink Area
TOP SIDE (1)
BOTTOM SIDE
TO-252
0.0123
0
103
1
(1)
THERMAL RESISTANCE: RθJA
(°C/W)
COPPER AREA (in2)
LAYOUT
Tab of device is attached to topside copper.
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Thermal Considerations (continued)
Table 2. RθJA Different Heat Sink Area (continued)
14
THERMAL RESISTANCE: RθJA
(°C/W)
COPPER AREA (in2)
LAYOUT
TOP SIDE (1)
BOTTOM SIDE
TO-252
2
0.066
0
87
3
0.3
0
60
4
0.53
0
54
5
0.76
0
52
6
1
0
47
7
0
0.2
84
8
0
0.4
70
9
0
0.6
63
10
0
0.8
57
11
0
1
57
12
0.066
0.066
89
13
0.175
0.175
72
14
0.284
0.284
61
15
0.392
0.392
55
16
0.5
0.5
53
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11 Device and Documentation Support
11.1 Documentation Support
11.1.1 Related Documentation
For related documentation see the following:
AN–1028 Maximum Power Enhancement Techniques for Power Packages (SNVA036)
11.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
11.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM78M05CH
ACTIVE
TO
NDT
3
500
Green (RoHS
& no Sb/Br)
AU
Level-1-NA-UNLIM
-40 to 125
( LM78M05CH, LM78M
05CH)
LM78M05CH/NOPB
ACTIVE
TO
NDT
3
500
Green (RoHS
& no Sb/Br)
AU
Level-1-NA-UNLIM
-40 to 125
( LM78M05CH, LM78M
05CH)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
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Addendum-Page 2
MECHANICAL DATA
NDT0003A
H03A (Rev D)
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