Texas Instruments | TPS6216x 3-V to 17-V, 1-A Step-Down Converters with DCS-Control™ (Rev. E) | Datasheet | Texas Instruments TPS6216x 3-V to 17-V, 1-A Step-Down Converters with DCS-Control™ (Rev. E) Datasheet

Texas Instruments TPS6216x 3-V to 17-V, 1-A Step-Down Converters with DCS-Control™ (Rev. E) Datasheet
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TPS6216x 3-V to 17-V, 1-A Step-Down Converters with DCS-Control™
1 Features
3 Description
•
•
•
•
•
•
•
•
•
•
•
•
The TPS6216x device family are easy to use
synchronous step-down DC/DC converters optimized
for applications with high power density. A high
switching frequency of typically 2.25 MHz allows the
use of small inductors and provides fast transient
response as well as high output voltage accuracy by
utilization of the DCS-Control™ topology.
1
•
•
DCS-Control™ Topology
Input Voltage Range from 3 V to 17 V
Up to 1-A Output Current
Adjustable Output Voltage From 0.9 V to 6 V
Fixed Output Voltage Versions
Seamless Power Save Mode Transition
Typically 17-µA Quiescent Current
Power Good Output
100% Duty Cycle Mode
Short Circuit Protection
Over Temperature Protection
Pin to Pin Compatible With TPS62170 and
TPS62125
Available in 3.00 mm x 3.00 mm 8-Pin VSSOP
and 2.00 mm × 2.00 mm 8-Pin WSON Packages
Create a Custom Design using the TPS62160 with
the WEBENCH® Power Designer
2 Applications
•
•
•
•
•
•
Standard 12-V Rail Supplies
POL Supply From Single or Multiple Li-Ion Battery
LDO Replacement
Embedded Systems
Digital Still Camera, Video
Mobile PCs, Tablet-PCs, Modems
With its wide operating input voltage range of 3 V to
17 V, the devices are ideally suited for systems
powered from either a Li-Ion or other battery as well
as from 12-V intermediate power rails. It supports up
to 1-A continuous output current at output voltages
between 0.9 V and 6 V (with 100% duty cycle mode).
Power sequencing is also possible by configuring the
enable and open-drain power good pins.
In power save mode, the devices show quiescent
current of about 17 μA from VIN. Power save mode,
entered automatically and seamlessly if the load is
small, maintains high efficiency over the entire load
range. In shutdown mode, the device is turned off
and shutdown current consumption is less than 2 μA.
The device, available in adjustable and fixed output
voltage versions, is packaged in an 8-pin WSON
package measuring 2.00 mm × 2.00 mm (DSG) or 8pin VSSOP package measuring 3.00 mm x 3.00 mm
(DGK).
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
TPS6216x
WSON (8)
2.00 mm x 2.00 mm
TPS62160
VSSOP (8)
3.00 mm x 3.00 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Typical Application Schematic
(3 .. 17)V
1.8V / 1A
2.2µH
VIN
SW
EN
10uF
Efficiency vs Output Current
VOS
TPS62161
AGND
PG
PGND
FB
100k
22uF
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS62160, TPS62161, TPS62162, TPS62163
SLVSAM2E – NOVEMBER 2011 – REVISED MAY 2017
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Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Device Voltage Options.........................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
4
4
5
7.1
7.2
7.3
7.4
7.5
7.6
5
5
5
5
6
7
Detailed Description .............................................. 8
8.1
8.2
8.3
8.4
9
Absolute Maximum Ratings ......................................
ESD Ratings ............................................................
Recommended Operating Conditions.......................
Thermal Information .................................................
Electrical Characteristics...........................................
Typical Characteristics ..............................................
Overview ................................................................... 8
Functional Block Diagrams ....................................... 8
Feature Description................................................... 9
Device Functional Modes........................................ 11
Application and Implementation ........................ 13
9.1 Application Information............................................ 13
9.2 Typical Application ................................................. 13
9.3 System Examples ................................................... 23
10 Power Supply Recommendations ..................... 25
11 Layout................................................................... 26
11.1 Layout Guidelines ................................................. 26
11.2 Layout Example .................................................... 26
11.3 Thermal Considerations ........................................ 27
12 Device and Documentation Support ................. 28
12.1
12.2
12.3
12.4
12.5
12.6
12.7
12.8
Custom Design With WEBENCH® Tools .............
Device Support ....................................................
Documentation Support ........................................
Related Links ........................................................
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
28
28
28
28
28
29
29
29
13 Mechanical, Packaging, and Orderable
Information ........................................................... 29
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision D (October 2014) to Revision E
Page
•
Added link to WEBENCH® Designer .................................................................................................................................... 1
•
Added "SW (AC), less than 10ns" specification to Absolute Maximum Ratings table ........................................................... 5
•
Changed TJ MAX spec from "125" to "150" ........................................................................................................................... 5
•
Added IQ and ISD specifications .............................................................................................................................................. 6
•
Added 125°C plot line in Figure 1 and Figure 4 Typical Characteristics graphic entities. .................................................... 7
Changes from Revision C (September 2013) to Revision D
•
Page
Added Device Information and ESD Ratings tables, Feature Description section, Device Functional Modes,
Application and Implementation section, Power Supply Recommendations section, Layout section, Device and
Documentation Support section, and Mechanical, Packaging, and Orderable Information section....................................... 1
Changes from Revision B (August 2013) to Revision C
•
Page
Changed 50mV/μs to 50mV/s in Enable / Shutdown (EN) section ....................................................................................... 9
Changes from Revision A (March 2012) to Revision B
Page
•
Added note to Terminal Functions.......................................................................................................................................... 4
•
Changed Equation 13........................................................................................................................................................... 25
•
Added diode to Figure 41 ..................................................................................................................................................... 25
2
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Changes from Original (November 2011) to Revision A
Page
•
Changed data sheet from mixed status to production data.................................................................................................... 1
•
Added VSSOP-8 package to Features................................................................................................................................... 1
•
Added 8-pin VSSOP package to Description ......................................................................................................................... 1
•
Added DGK package pinout ................................................................................................................................................... 4
•
Added DGK package to Thermal Information ....................................................................................................................... 5
•
Changed Table 2 .................................................................................................................................................................. 14
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5 Device Voltage Options
(1)
OUTPUT VOLTAGE (1)
PART NUMBER
adjustable
TPS62160
1.8 V
TPS62161
3.3 V
TPS62162
5.0 V
TPS62163
adjustable
TPS62160
PACKAGE
WSON (8)
VSSOP (8)
Contact the factory to check availability of other fixed output voltage versions.
6 Pin Configuration and Functions
DSG Package
8-Pin WSON With Exposed Thermal Pad
Top View
PGND
VIN
1
8
2
EN
3
AGND
4
Exposed
Thermal
Pad
7
DGK Package
8-Pin VSSOP
Top View
PG
PGND
1
8
PG
VIN
2
7
SW
EN
3
6
VOS
AGND
4
5
FB
SW
6
VOS
5
FB
SPACE
Pin Functions
PIN
(1)
NAME
NO.
I/O
DESCRIPTION
PGND
1
—
Power ground
VIN
2
I
Supply voltage
EN
3
I
Enable input (High = enabled, Low = disabled)
AGND
4
—
FB
5
I
Voltage feedback of adjustable version. Connect resistive voltage divider to this pin. It is recommended to
connect FB to AGND on fixed output voltage versions for improved thermal performance.
VOS
6
I
Output voltage sense pin and connection for the control loop circuitry.
SW
7
O
Switch node, which is connected to the internal MOSFET switches. Connect inductor between SW and
output capacitor.
PG
8
O
Exposed
Thermal Pad (2)
(1)
(2)
4
—
Analog ground
Output power good (High = VOUT ready, Low = VOUT below nominal regulation); open drain (requires
pull-up resistor; goes high impedance, when device is switched off)
Must be connected to AGND. Must be soldered to achieve appropriate power dissipation and mechanical
reliability.
For more information about connecting pins, see Detailed Description and Application Information sections.
The exposed thermal pad is available with the DSG package only, not with DGK package.
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7 Specifications
7.1 Absolute Maximum Ratings (1)
Pin voltage range (2)
MIN
MAX
UNIT
VIN
–0.3
20
V
EN, SW (DC)
–0.3
VIN + 0.3
–2
24.5
SW (AC), less than 10ns (3)
FB, PG, VOS
Power good sink current
–0.3
PG
V
7
V
10
mA
Operating junction temperature, TJ
–40
150
°C
Storage temperature, Tstg
–65
150
°C
(1)
(2)
(3)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to network ground terminal.
While switching.
7.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1)
±2000
Charged device model (CDM), per JEDEC specification JESD22-C101,
all pins (2)
±500
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
MIN
NOM MAX
3
17
Supply Voltage, VIN
UNIT
V
Output Voltage, VOUT
0.9
6
V
Operating junction temperature, TJ
–40
125
°C
7.4 Thermal Information
TPS6216X
THERMAL METRIC (1)
DSG (WSON)
DGK (VSSOP)
UNIT
8 PINS
8 PINS
RθJA
Junction-to-ambient thermal resistance
61.8
184.3
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
61.3
74.6
°C/W
RθJB
Junction-to-board thermal resistance
15.5
105.8
°C/W
ψJT
Junction-to-top characterization parameter
0.4
13.3
°C/W
ψJB
Junction-to-board characterization parameter
15.4
104.2
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
8.6
—
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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7.5 Electrical Characteristics
Over junction temperature range (TJ = –40°C to +125°C), typical values at VIN = 12 V and TJ = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
SUPPLY
Input voltage range (1)
VIN
3
Operating quiescent current
EN = High, IOUT = 0 mA,
device not switching
Shutdown current (2)
EN = Low
VUVLO
Undervoltage lockout
threshold
Falling input voltage
TSD
Thermal shutdown
temperature
IQ
ISD
TJ = -40°C to +85°C
TJ = -40°C to +85°C
2.6
17
17
30
17
25
1.5
25
1.5
4
2.7
2.82
Hysteresis
180
Rising temperature
160
Thermal shutdown hysteresis Falling temperature
20
V
µA
µA
V
mV
°C
CONTROL (EN, PG)
VEN_H
High level input threshold
voltage (EN)
VEN_L
Low level input threshold
voltage (EN)
ILKG_EN
Input leakage current (EN)
EN = VIN or GND
VTH_PG
Power good threshold
voltage
Rising (%VOUT)
92%
Falling (%VOUT)
87%
90%
93%
VOL_PG
Power good output low
voltage
IPG = –2 mA
0.07
0.3
V
ILKG_PG
Input leakage current (PG)
VPG = 1.8 V
1
400
nA
600
0.9
0.6
0.56
V
0.3
V
0.01
1
µA
95%
98%
POWER SWITCH
High-side MOSFET ONresistance
VIN ≥ 6 V
300
VIN = 3 V
430
Low-side MOSFET ONresistance
VIN ≥ 6 V
120
VIN = 3 V
165
High-side MOSFET forward
current limit (3)
VIN = 12 V, TJ = 25°C
RDS(ON)
ILIMF
1.45
1.95
200
2.45
mΩ
mΩ
A
OUTPUT
VREF
Internal reference voltage (4)
ILKG_FB
Pin leakage current (FB)
TPS62160, VFB = 1.2 V
Output voltage range
(TPS62160)
VIN ≥ VOUT
VOUT
(1)
(2)
(3)
(4)
(5)
(6)
6
0.8
5
PWM mode operation, VIN ≥ VOUT + 1 V
Initial output voltage
accuracy (5)
Power save mode operation, COUT = 22 µF
V
400
nA
0.9
6.0
V
–3%
3%
–3.5%
4%
DC output voltage load
regulation (6)
VIN = 12 V, VOUT = 3.3 V, PWM mode operation
0.05
%/A
DC output voltage line
regulation (6)
3 V ≤ VIN ≤ 17 V, VOUT = 3.3 V, IOUT = 0.5 A, PWM mode
operation
0.02
%/V
The device is still functional down to under voltage lockout (see parameter VUVLO).
Current into VIN pin.
This is the static current limit. It can be temporarily higher in applications due to internal propagation delay (see Current Limit and Short
Circuit Protection section).
This is the voltage regulated at the FB pin.
This is the accuracy provided by the device itself (line and load regulation effects are not included). For fixed voltage versions, the
(internal) resistive feedback divider is included.
Line and load regulation are depending on external component selection and layout (see Figure 18 and Figure 19).
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7.6 Typical Characteristics
100.0
50.0
0.0
3.0
Figure 2. Shutdown Current
250.0
225.0
125°C
85°C
RDSon Low−Side (mΩ)
RDSon High−Side (mΩ)
Figure 1. Quiescent Current
600.0
550.0
500.0
450.0
400.0
350.0
300.0
250.0
200.0
150.0
25°C
−20°C
−40°C
125°C
200.0
175.0
85°C
150.0
25°C
125.0
−20°C
100.0
75.0
−40°C
50.0
25.0
6.0
9.0
12.0
Input Voltage (V)
Figure 3. High-Side Switch
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15.0
18.0
G001
0.0
3.0
6.0
9.0
12.0
15.0
Input Voltage (V)
18.0
20.0
G001
Figure 4. Low-Side Switch
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8 Detailed Description
8.1 Overview
The TPS6216x synchronous step-down DC/DC converters are based on DCS-Control™ (Direct Control with
Seamless transition into power save mode), an advanced regulation topology, that combines the advantages of
hysteretic, voltage mode and current mode control including an AC loop directly associated to the output voltage.
This control loop takes information about output voltage changes and feeds it directly to a fast comparator stage.
It sets the switching frequency, which is constant for steady state operating conditions, and provides immediate
response to dynamic load changes. To get accurate DC load regulation, a voltage feedback loop is used. The
internally compensated regulation network achieves fast and stable operation with small external components
and low ESR capacitors.
The DCS-ControlTM topology supports pulse width modulation (PWM) mode for medium and heavy load
conditions and a power save mode at light loads. During PWM mode, it operates at its nominal switching
frequency in continuous conduction mode. This frequency is typically about 2.25 MHz with a controlled frequency
variation depending on the input voltage. If the load current decreases, the converter enters power save mode to
sustain high efficiency down to very light loads. In power save mode, the switching frequency decreases linearly
with the load current. Since DCS-ControlTM supports both operation modes within one single building block, the
transition from PWM to power save mode is seamless without effects on the output voltage.
Fixed output voltage versions provide smallest solution size and lowest current consumption, requiring only 3
external components. An internal current limit supports nominal output currents of up to 1 A.
The TPS6216x family offers both excellent DC voltage and superior load transient regulation, combined with very
low output voltage ripple, minimizing interference with RF circuits.
8.2 Functional Block Diagrams
PG
Soft
start
Thermal
Shtdwn
UVLO
VIN
PG control
HS lim
comp
power
control
control logic
EN*
gate
drive
SW
comp
LS lim
VOS
direct control
&
compensation
ramp
_
FB
comparator
+
timer tON
error
amplifier
DCS - ControlTM
*
This pin is connected to a pull down resistor internally
(see Detailed Description section).
AGND
PGND
Figure 5. TPS62160 (Adjustable Output Voltage)
8
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Functional Block Diagrams (continued)
PG
Soft
start
Thermal
Shtdwn
UVLO
VIN
PG control
HS lim
comp
power
control
control logic
EN*
gate
drive
SW
comp
LS lim
VOS
direct control
&
compensation
ramp
_
FB*
comparator
+
timer tON
error
amplifier
DCS - ControlTM
*
This pin is connected to a pull down resistor internally
(see Detailed Description section).
AGND
PGND
Figure 6. TPS62161/TPS62162/TPS62163 (Fixed Output Voltage)
8.3 Feature Description
8.3.1 Enable and Shutdown (EN)
When enable (EN) is set high, the device starts operation.
Shutdown is forced if EN is pulled low with a shutdown current of typically 1.5 µA. During shutdown, the internal
power MOSFETs as well as the entire control circuitry are turned off. The internal resistive divider pulls down the
output voltage smoothly. If the EN pin is low, an internal pull-down resistor of about 400 kΩ is connected and
keeps it low, to avoid bouncing.
Connecting the EN pin to an appropriate output signal of another power rail provides sequencing of multiple
power rails.
8.3.2 Current Limit and Short Circuit Protection
The TPS6216x devices are protected against heavy load and short circuit events. At heavy loads, the current
limit determines the maximum output current. If the current limit is reached, the high-side FET is turned off.
Avoiding shoot through current, the low-side FET is switched on to allow the inductor current to decrease. The
high-side FET turns on again, only if the current in the low-side FET decreases below the low-side current limit
threshold of typically 1.2 A.
The output current of the device is limited by the current limit (see Electrical Characteristics). Due to internal
propagation delay, the actual current can exceed the static current limit during that time. The dynamic current
limit is calculated as follows:
space
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Feature Description (continued)
I peak ( typ ) = I LIMF +
VL
× t PD
L
where
•
•
•
•
ILIMF is the static current limit, specified in Electrical Characteristics
L is the inductor value
VL is the voltage across the inductor
tPD is the internal propagation delay
(1)
space
The dynamic high-side switch peak current is calculated as follows:
space
I peak (typ ) = I LIMF +
(VIN - VOUT )× 30ns
L
(2)
space
Take care with the current limit, if the input voltage is high and very small inductances are used.
8.3.3 Power Good (PG)
The TPS6216x has a built in power good (PG) function to indicate whether the output voltage has reached its
appropriate level or not. The PG signal can be used for startup sequencing of multiple rails. The PG pin is an
open-drain output that requires a pull-up resistor (to any voltage below 7 V). It can sink 2 mA of current and
maintain its specified logic low level. It is high impedance when the device is turned off due to EN, UVLO or
thermal shutdown. If not used, the PG pin should be connected to GND but may be left floating.
space
Table 1. Power Good Pin Logic Table
PG Logic Status
Device State
High Impedance
VFB ≥ VTH_PG
Enable (EN=High)
Low
√
VFB ≤ VTH_PG
√
√
Shutdown (EN=Low)
UVLO
Thermal Shutdown
Power Supply Removal
0.7 V < VIN < VUVLO
√
TJ > TSD
√
VIN < 0.7 V
√
space
8.3.4 Undervoltage Lockout (UVLO)
If the input voltage drops, the under voltage lockout prevents misoperation of the device by switching off both the
power FETs. The under voltage lockout threshold is set typically to 2.7 V. The device is fully operational for
voltages above the UVLO threshold and turns off if the input voltage trips the threshold. The converter starts
operation again once the input voltage exceeds the threshold by a hysteresis of typically 180 mV.
8.3.5 Thermal Shutdown
The junction temperature (TJ) of the device is monitored by an internal temperature sensor. If TJ exceeds 160°C
(typical), the device goes into thermal shut down. Both the high-side and low-side power FETs are turned off and
PG goes high impedance. When TJ decreases below the hysteresis amount, the converter resumes normal
operation, beginning with soft start. To avoid unstable conditions, a hysteresis of typically 20°C is implemented
on the thermal shut down temperature.
10
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8.4 Device Functional Modes
8.4.1 Soft Start
The internal soft start circuitry controls the output voltage slope during startup. This avoids excessive inrush
current and ensures a controlled output voltage rise time. It also prevents unwanted voltage drops from highimpedance power sources or batteries. When EN is set to start device operation, the device starts switching after
a delay of about 50 µs and VOUT rises with a slope of about 25 mV/µs. See Figure 30 and Figure 31 for typical
startup operation.
The TPS6216x can start into a pre-biased output. During monotonic pre-biased startup, the low-side MOSFET is
not allowed to turn on until the device's internal ramp sets an output voltage above the pre-bias voltage.
8.4.2 Pulse Width Modulation (PWM) Operation
The TPS6216x operates with pulse width modulation in continuous conduction mode (CCM) with a nominal
switching frequency of about 2.25 MHz. The frequency variation in PWM is controlled and depends on VIN, VOUT
and the inductance. The device operates in PWM mode as long the output current is higher than half the
inductor's ripple current. To maintain high efficiency at light loads, the device enters power save mode at the
boundary to discontinuous conduction mode (DCM). This happens if the output current becomes smaller than
half the inductor's ripple current.
8.4.3 Power Save Mode Operation
The TPS6216x's built in power save mode is entered seamlessly, if the load current decreases. This secures a
high efficiency in light load operation. The device remains in power save mode as long as the inductor current is
discontinuous.
In power save mode the switching frequency decreases linearly with the load current maintaining high efficiency.
The transition into and out of power save mode happens within the entire regulation scheme and is seamless in
both directions.
The TPS6216x includes a fixed on-time circuitry. This on-time, in steady-state operation, is estimated as:
space
t ON =
VOUT
× 420ns
VIN
(3)
space
For very small output voltages, the on-time increases beyond the result of Equation 3, to stay above an absolute
minimum on-time, tON(min), which is around 80 ns, to limit switching losses. The peak inductor current in PSM is
approximated by:
space
I LPSM ( peak ) =
(V IN - VOUT )
× t ON
L
(4)
space
When VIN decreases to typically 15% above VOUT, the TPS6216x does not enter power save mode, regardless of
the load current. The device maintains output regulation in PWM mode.
8.4.4 100% Duty-Cycle Operation
The duty cycle of the buck converter is given by D = VOUT/VIN and increases as the input voltage comes close to
the output voltage. In this case, the device starts 100% duty cycle operation turning on the high-side switch
100% of the time. The high-side switch stays turned on as long as the output voltage is below the internal
setpoint. This allows the conversion of small input to output voltage differences, such as for longest operation
time of battery-powered applications. In 100% duty cycle mode, the low-side FET is switched off.
The minimum input voltage to maintain output voltage regulation, depending on the load current and the output
voltage level, is calculated as:
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Device Functional Modes (continued)
space
VIN (min) = VOUT (min) + I OUT (RDS ( on ) + RL )
where
•
•
•
12
IOUT is the output current
RDS(on) is the RDS(on) of the high-side FET
RL is the DC resistance of the inductor used
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(5)
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The TPS6216x device family are easy to use synchronous step-down DC/DC converters optimized for
applications with high power density. A high switching frequency of typically 2.25 MHz allows the use of small
inductors and provides fast transient response as well as high output voltage accuracy by utilization of the DCSControl™ topology. With its wide operating input voltage range of 3 V to 17 V, the devices are ideally suited for
systems powered from either a Li-Ion or other battery as well as from 12-V intermediate power rails. It supports
up to 1-A continuous output current at output voltages between 0.9 V and 6 V (with 100% duty cycle mode).
9.2 Typical Application
SPACE
2.2µH
VIN
VIN
VOUT
SW
EN
VOS
R3
R1
TPS62160
C1
C2
AGND
PG
PGND
FB
R2
Figure 7. TPS62160 Adjustable Power Supply
space
9.2.1 Design Requirements
The design guideline provides a component selection to operate the device within the Recommended Operating
Conditions.
9.2.2 Detailed Design Procedure
9.2.2.1 Custom Design with WEBENCH® Tools
Click here to create a custom design using the TPS62160 device with the WEBENCH® Power Designer.
1. Start by entering your VIN, VOUT, and IOUT requirements.
2. Optimize your design for key parameters like efficiency, footprint and cost using the optimizer dial and
compare this design with other possible solutions from Texas Instruments.
3. The WEBENCH Power Designer provides you with a customized schematic along with a list of materials with
real time pricing and component availability.
4. In most cases, you will also be able to:
– Run electrical simulations to see important waveforms and circuit performance
– Run thermal simulations to understand the thermal performance of your board
– Export your customized schematic and layout into popular CAD formats
– Print PDF reports for the design, and share your design with colleagues
5. Get more information about WEBENCH tools at www.ti.com/WEBENCH.
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Typical Application (continued)
9.2.2.2 Programming the Output Voltage
While the output voltage of the TPS62160 is adjustable, the TPS62161/TPS62162/TPS62163 are programmed to
fixed output voltages. For fixed output versions, the FB pin is pulled down internally and may be left floating. It is
recommended to connect it to AGND to improve thermal resistance. The adjustable version can be programmed
for output voltages from 0.9 V to 6 V by using a resistive divider from VOUT to AGND. The voltage at the FB pin
is regulated to 800 mV. The value of the output voltage is set by the selection of the resistive divider from
Equation 6. It is recommended to choose resistor values which allow a current of at least 2 µA, meaning the
value of R2 should not exceed 400 kΩ. Lower resistor values are recommended for highest accuracy and most
robust design. For applications requiring lowest current consumption, the use of fixed output voltage versions is
recommended.
spacing
ö
æV
R1 = R 2 ç OUT - 1÷
0.8V
ø
è
(6)
spacing
If the FB pin becomes open, the device clamps the output voltage at the VOS pin to about 7.4 V.
9.2.2.3 External Component Selection
The external components have to fulfill the needs of the application, but also the stability criteria of the devices
control loop. The TPS6216x is optimized to work within a range of external components. The LC output filter's
inductance and capacitance have to be considered together, creating a double pole, responsible for the corner
frequency of the converter (see Output Filter and Loop Stability section). Table 2 can be used to simplify the
output filter component selection. Checked cells represent combinations that are proven for stability by simulation
and lab test. Further combinations should be checked for each individual application.
space
Table 2. Recommended LC Output Filter Combinations (1)
4.7µF
10µF
22µF
47µF
100µF
200µF
2.2µH
√
√ (2)
√
√
√
3.3µH
√
√
√
√
400µF
1µH
4.7µH
(1)
(2)
The values in the table are nominal values. Variations of typically ±20% due to tolerance, saturation and DC bias are assumed.
This LC combination is the standard value and recommended for most applications.
space
More detailed information on further LC combinations can be found in SLVA463.
9.2.2.4 Inductor Selection
The inductor selection is affected by several effects like inductor ripple current, output ripple voltage, PWM-toPSM transition point and efficiency. In addition, the inductor selected has to be rated for appropriate saturation
current and DC resistance (DCR). Equation 7 and Equation 8 calculate the maximum inductor current under
static load conditions.
spacing
IL (m ax) = IO U T (m ax) +
D IL (m ax)
2
(7)
spacing
spacing
14
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DI L(max) = VOUT
V
æ
ç 1 - OUT
ç V IN (max)
×ç
L
×f
ç (min) SW
ç
è
ö
÷
÷
÷
÷
÷
ø
where
•
•
•
•
IL(max) is the maximum inductor current
ΔIL is the peak-to-peak inductor ripple current
L(min) is the minimum effective inductor value
fSW is the actual PWM switching frequency
(8)
spacing
Calculating the maximum inductor current using the actual operating conditions gives the minimum saturation
current of the inductor needed. A margin of about 20% is recommended to add. A larger inductor value is also
useful to get lower ripple current, but increases the transient response time and size as well. The following
inductors have been used with the TPS6216x and are recommended for use:
Table 3. List of Inductors (1)
(1)
(2)
Type
Inductance [µH]
Current [A] (2)
Dimensions [L x B x H] mm
Manufacturer
VLF3012ST-2R2M1R4
2.2 µH, ±20%
1.9 A
3.0 x 2.8 x 1.2
TDK
VLF302512MT-2R2M
2.2 µH, ±20%
1.9 A
3.0 x 2.5 x 1.2
TDK
VLS252012T-2R2M1R3
2.2 uH, ±20%
1.3 A
2.5 x 2.0 x 1.2
TDK
XFL3012-222MEC
2.2 µH, ±20%
1.9 A
3.0 x 3.0 x 1.2
Coilcraft
XFL3012-332MEC
3.3 µH, ±20%
1.6 A
3.0 x 3.0 x 1.2
Coilcraft
LPS3015-332ML_
3.3 uH, ±20%
1.4 A
3.0 x 3.0 x 1.4
Coilcraft
NR3015T-2R2M
2.2 uH, ±20%
1.5 A
3.0 x 3.0 x 1.5
Taiyo Yuden
744025003
3.3 uH, ±20%
1.5 A
2.8 x 2.8 x 2.8
Wuerth
PSI25201B-2R2MS
2.2 uH, ±20%
1.3 A
2.0 x 2.5 x 1.2
Cyntec
See the Third-Party Products Disclaimer.
IRMS at 40°C rise or ISAT at 30% drop.
The TPS6216x can operate with an inductor as low as 2.2 µH. However, for applications with low input voltages,
3.3 µH is recommended to allow the full output current. The inductor value also determines the load current at
which Power Save Mode is entered:
spacing
I load ( PSM ) =
1
DI L
2
(9)
spacing
Using Equation 8, this current level is adjusted by changing the inductor value.
9.2.2.5 Capacitor Selection
9.2.2.5.1 Output Capacitor
The recommended value for the output capacitor is 22 uF. The architecture of the TPS6216x allows the use of
tiny ceramic output capacitors with low equivalent series resistance (ESR). These capacitors provide low output
voltage ripple and are recommended. To keep its low resistance up to high frequencies and to get narrow
capacitance variation with temperature, it is recommended to use an X7R or X5R dielectric. Using a higher value
can have some advantages like smaller voltage ripple and a tighter DC output accuracy in power save mode
(see SLVA463).
Note: In power save mode, the output voltage ripple depends on the output capacitance, its ESR and the peak
inductor current. Using ceramic capacitors provides small ESR and low ripple.
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9.2.2.5.2 Input Capacitor
For most applications, 10 µF is sufficient and is recommended, though a larger value reduces input current ripple
further. The input capacitor buffers the input voltage for transient events and also decouples the converter from
the supply. A low ESR multilayer ceramic capacitor is recommended for best filtering and should be placed
between VIN and PGND as close as possible to those pins.
spacing
NOTE
DC bias effect: High capacitance ceramic capacitors have a DC bias effect, which has a
strong influence on the final effective capacitance. Therefore the right capacitor value has
to be chosen carefully. Package size and voltage rating in combination with dielectric
material are responsible for differences between the rated capacitor value and the
effective capacitance.
spacing
9.2.2.6 Output Filter and Loop Stability
The devices of the TPS6216x family are internally compensated to be stable with L-C filter combinations
corresponding to a corner frequency calculated with Equation 10:
spacing
f LC =
1
2p L × C
(10)
spacing
Proven nominal values for inductance and ceramic capacitance are given in Table 2 and are recommended for
use. Different values may work, but care has to be taken on the loop stability which is affected. More information
including a detailed L-C stability matrix is found in SLVA463.
The TPS6216X devices, both fixed and adjustable versions, include an internal 25 pF feed forward capacitor,
connected between the VOS and FB pins. This capacitor impacts the frequency behavior and sets a pole and
zero in the control loop with the resistors of the feedback divider, per Equation 11 and Equation 12:
spacing
f zero =
1
2p × R1 × 25 pF
(11)
spacing
spacing
f pole =
1
2p × 25 pF
æ 1
1 ö
÷÷
× çç
+
R
R
2 ø
è 1
(12)
spacing
Though the TPS6216x devices are stable without the pole and zero being in a particular location, adjusting their
location to the specific needs of the application can provide better performance in power save mode and/or
improved transient response. An external feed-forward capacitor can also be added. A more detailed discussion
on the optimization for stability versus transient response can be found in SLVA289 and SLVA466.
If using ceramic capacitors, the DC bias effect has to be considered. The DC bias effect results in a drop in
effective capacitance as the voltage across the capacitor increases (see NOTE in Input Capacitor section).
9.2.2.7 TPS6216x Components List
Table 4 shows the list of components for the Application Curves.
16
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Table 4. List of Components
REFERENCE
DESCRIPTION
MANUFACTURER
IC
17 V, 1 A Step-Down Converter, WSON
TPS62160DSG, Texas Instruments
L1
2.2 µH, 1.4 A, 3 mm x 2.8 mm x 1.2 mm
VLF3012ST-2R2M1R4, TDK
C1
10 µF, 25 V, Ceramic, 0805
Standard
C2
22 µF, 6.3 V, Ceramic, 0805
Standard
R1
depending on VOUT
R2
depending on VOUT
R3
100 kΩ, Chip, 0603, 1/16 W, 1%
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Standard
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9.2.3 Application Curves
VIN=12 V, VOUT=3.3 V, TA=25°C, (unless otherwise noted)
100.0
100.0
90.0
90.0
80.0
70.0
VIN=17V
Efficiency (%)
Efficiency (%)
80.0
60.0
50.0
VIN=12V
40.0
30.0
70.0
40.0
20.0
10.0
10.0
0.01
Output Current (A)
0.1
0.0
1
7
8
11
12
13
14
Input Voltage (V)
15
16
17
G001
Figure 9. Efficiency vs Input Voltage
100.0
100.0
90.0
90.0
80.0
80.0
70.0
VIN=17V
60.0
Efficiency (%)
Efficiency (%)
10
VOUT = 6 V
Figure 8. Efficiency vs Output Current
VIN=12V
50.0
VIN=6V
40.0
30.0
70.0
IOUT=1mA
60.0
IOUT=100mA
IOUT=10mA
IOUT=1A
50.0
40.0
30.0
VOUT=5.0V
L=2.2uH (VLF3012ST)
Cout=22uF
20.0
10.0
0.0
0.0001
0.001
0.01
Output Current (A)
VOUT=5.0V
L=2.2uH (VLF3012ST)
Cout=22uF
20.0
10.0
0.1
0.0
1
7
8
11
12
13
Input Voltage (V)
14
15
16
17
G001
Figure 11. Efficiency vs Input Voltage
100.0
90.0
90.0
80.0
80.0
70.0
70.0
60.0
Efficiency (%)
100.0
VIN=17V
50.0
VIN=12V
VIN=5V
20.0
10.0
10.0
0.1
VOUT = 3.3 V
1
IOUT=10mA
IOUT=100mA
40.0
30.0
0.01
Output Current (A)
IOUT=1mA
50.0
20.0
0.001
IOUT=1A
60.0
30.0
0.0
0.0001
10
VOUT = 5 V
Figure 10. Efficiency vs Output Current
40.0
9
G001
VOUT = 5 V
Efficiency (%)
9
G001
VOUT = 6 V
0.0
4
5
6
G001
7
8
9 10 11 12 13 14 15 16 17
Input Voltage (V)
G001
VOUT = 3.3 V
Figure 12. Efficiency vs Output Current
18
IOUT=1A
30.0
VIN=6V
0.001
IOUT=100mA
IOUT=10mA
50.0
20.0
0.0
0.0001
IOUT=1mA
60.0
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Figure 13. Efficiency vs Input Voltage
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100.0
100.0
VIN=5V
80.0
80.0
70.0
70.0
60.0
VIN=17V
50.0
40.0
VIN=12V
60.0
20.0
20.0
10.0
10.0
0.01
Output Current (A)
0.1
0.0
1
IOUT=100mA
3
4
90.0
VIN=5V
70.0
60.0
50.0
VIN=17V
40.0
VIN=12V
30.0
IOUT=1A
60.0
50.0
IOUT=1mA
40.0
30.0
20.0
10.0
10.0
0.001
IOUT=100mA
70.0
20.0
0.0
0.0001
IOUT=10mA
80.0
Efficiency (%)
Efficiency (%)
8 9 10 11 12 13 14 15 16 17
Input Voltage (V)
G001
100.0
90.0
0.01
Output Current (A)
0.1
0.0
1
3
4
5
6
G001
VOUT = 0.9 V
7
8 9 10 11 12 13 14 15 16 17
Input Voltage (V)
G001
VOUT = 0.9 V
Figure 16. Efficiency vs Output Current
Figure 17. Efficiency vs Input Voltage
3.35
Output Voltage (V)
3.35
Output Voltage (V)
7
Figure 15. Efficiency vs Input Voltage
100.0
3.30
VIN=5V
VIN=12V
VIN=17V
3.25
3.20
0.0001
6
VOUT = 1.8 V
Figure 14. Efficiency vs Output Current
80.0
5
G001
VOUT = 1.8 V
IOUT=10mA
40.0
30.0
0.001
IOUT=1mA
50.0
30.0
0.0
0.0001
IOUT=500mA
90.0
Efficiency (%)
Efficiency (%)
90.0
0.001
0.01
Output Current (A)
0.1
1
G001
Figure 18. Output Voltage Accuracy (Load Regulation)
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IOUT=1mA
IOUT=10mA
IOUT=100mA
IOUT=1A
3.30
3.25
3.20
4
7
10
13
Input Voltage (V)
16
G001
Figure 19. Output Voltage Accuracy (Line Regulation)
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4
4
3.5
3.5
Switching Frequency (MHz)
Switching Frequency (MHz)
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3
2.5
2
1.5
1
0.5
0
3
IOUT=1A
2.5
2
IOUT=0.5A
1.5
1
0.5
0
0.1
0.2
0.3
0.4 0.5 0.6 0.7
Output Current (A)
0.8
0.9
0
1
4
6
8
VIN = 12 V
14
16
18
G000
VOUT = 3.3 V
Figure 20. Switching Frequency
Figure 21. Switching Frequency
0.05
3
2.5
0.04
VIN=17V
Output Current (A)
Output Voltage Ripple (V)
10
12
Input Voltage (V)
G000
0.03
0.02
VIN=12V
0.01
−40°C
2
25°C
1.5
1
85°C
0.5
VIN=5V
0
20
0
0.1
0.2
0.3
0.4 0.5 0.6 0.7
Output Current (A)
0.8
0.9
1
G000
0
4
5
6
7
8
9 10 11 12 13 14 15 16 17
Input Voltage (V)
G000
Figure 22. Output Voltage Ripple
Figure 23. Maximum Output Current
Figure 24. PWM to PSM Mode Transition
Figure 25. PSM to PWM Mode Transition
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Figure 26. Load Transient Response in PWM Mode
(500 mA to 1 A)
Figure 27. Load Transient Response from Power Save
Mode (100 mA to 500 mA)
Figure 28. Load Transient Response in PWM Mode
(500 mA to 1 A), Rising Edge
Figure 29. Load Transient Response in PWM Mode
(500 mA to 1 A), Falling Edge
Figure 30. Startup with IOUT = 100 mA
Figure 31. Startup with IOUT = 1 A
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IOUT = 1 A
IOUT = 66 mA
Figure 32. Typical Operation in Power Save Mode
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Figure 33. Typical Operation in PWM Mode
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9.3 System Examples
9.3.1 1-A Power Supply
The following example circuits show various TPS6216x devices and input voltages that provide a 1-A power
supply with output voltage options.
space
space
(5 .. 17)V
5V / 1A
2.2µH
VIN
SW
EN
VOS
10uF
100k
TPS62163
AGND
PG
PGND
FB
22uF
Figure 34. 5 V / 1 A Power Supply
space
space
(3.3 .. 17)V
3.3V / 1A
2.2µH
VIN
SW
EN
VOS
10uF
100k
TPS62162
AGND
PG
PGND
FB
22uF
Figure 35. 3.3 V / 1 A Power Supply
space
space
(3 .. 17)V
2.5V / 1A
2.2µH
VIN
SW
EN
10uF
VOS
100k
TPS62160
AGND
PG
PGND
FB
390k
22uF
180k
Figure 36. 2.5 V / 1 A Power Supply
space
space
(3 .. 17)V
1.8V / 1A
2.2µH
VIN
SW
EN
10uF
VOS
TPS62161
AGND
PG
PGND
FB
100k
22uF
Figure 37. 1.8 V / 1 A Power Supply
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System Examples (continued)
space
space
(3 .. 17)V
1.5V / 1A
2.2µH
VIN
SW
EN
10uF
VOS
100k
TPS62160
AGND
PG
PGND
FB
130k
22uF
150k
Figure 38. 1.5 V / 1 A Power Supply
space
space
(3 .. 17)V
1.2V / 1A
2.2µH
VIN
SW
EN
10uF
VOS
100k
TPS62160
AGND
PG
PGND
FB
75k
22uF
150k
Figure 39. 1.2 V / 1 A Power Supply
space
space
(3 .. 17)V
1V / 1A
2.2µH
VIN
SW
EN
10uF
VOS
TPS62160
AGND
PG
PGND
FB
100k
51k
22uF
200k
Figure 40. 1 V / 1 A Power Supply
24
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System Examples (continued)
9.3.2 Inverting Power Supply
The TPS6216x can be used as inverting power supply by rearranging external circuitry as shown in Figure 41.
As the former GND node now represents a voltage level below system ground, the voltage difference between
VIN and VOUT has to be limited for operation to the maximum supply voltage of 17 V (see Equation 13).
space
VIN + VOUT £ VIN max
(13)
space
10uF
2.2µH
(3 .. 12)V
VIN
SW
EN
10uF
VOS
TPS62160
AGND
PG
PGND
FB
100k
680k
22uF
130k
-5V
Figure 41. –5 V Inverting Power Supply
space
The transfer function of the inverting power supply configuration differs from the buck mode transfer function,
incorporating a right half plane zero additionally. The loop stability has to be adapted and an output capacitance
of at least 22 µF is recommended. A detailed design example is given in SLVA469.
space
10 Power Supply Recommendations
The TPS6216x device family has no special requirements for its input power supply. The input power supply' s
output current needs to be rated according to the supply voltage, output voltage, and output current of the
TPS6216x.
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TPS62160, TPS62161, TPS62162, TPS62163
SLVSAM2E – NOVEMBER 2011 – REVISED MAY 2017
www.ti.com
11 Layout
11.1 Layout Guidelines
A proper layout is critical for the operation of a switched mode power supply, even more at high switching
frequencies. Therefore the PCB layout of the TPS6216x demands careful attention to ensure operation and to
get the performance specified. A poor layout can lead to issues like poor regulation (both line and load), stability
and accuracy weaknesses, increased EMI radiation, and noise sensitivity.
Provide low inductive and resistive paths to ground for loops with high di/dt. Therefore paths conducting the
switched load current should be as short and wide as possible. Provide low capacitive paths, with respect to all
other nodes, for wires with high dv/dt. Therefore the input and output capacitance should be placed as close as
possible to the IC pins and parallel wiring over long distances as well as narrow traces should be avoided. Loops
which conduct an alternating current should outline an area as small as possible, as this area is proportional to
the energy radiated.
Also sensitive nodes like FB and VOS should be connected with short wires, not nearby high dv/dt signals, such
as SW. As they carry information about the output voltage, they should be connected as close as possible to the
actual output voltage (at the output capacitor). Signals not assigned to power transmission, such as the feedback
divider, should refer to the signal ground (AGND) and always be separated from the power ground (PGND).
In summary, the input capacitor should be placed as close as possible to the VIN and PGND pin of the IC. This
connections should be done with wide and short traces. The output capacitor should be placed such that its
ground is as close as possible to the IC's PGND pins - avoiding additional voltage drop in traces. This connection
should also be made short and wide. The inductor should be placed close to the SW pin and connect directly to
the output capacitor - minimizing the loop area between the SW pin, inductor, output capacitor and PGND pin.
The feedback resistors, R1 and R2, should be placed close to the IC and connect directly to the AGND and FB
pins. Those connections (including VOUT) to the resistors and especially to the VOS pin should stay away from
noise sources, such as the inductor. The VOS pin should connect in the shortest way to VOUT at the output
capacitor, while the VOUT connection to the feedback divider can connect at the load.
A single point grounding scheme should be implemented with all grounds (AGND, PGND and the thermal pad)
connecting at the IC's exposed thermal pad. See Figure 42 for the recommended layout of the TPS6216x. More
detailed information can be found in the EVM Users Guide, SLVU483.
The exposed thermal pad must be soldered to the circuit board for mechanical reliability and to achieve
appropriate power dissipation. Although the exposed thermal pad can be connected to a floating circuit board
trace, the device has better thermal performance if it is connected to a larger ground plane. The exposed thermal
pad is electrically connected to AGND.
11.2 Layout Example
GND
VOUT
C2
L1
C1
PGND
PG
VIN
SW
EN
VOS
AGND
FB
AGND
VIN
R2
R1
Figure 42. TPS6216x Board Layout
26
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Copyright © 2011–2017, Texas Instruments Incorporated
Product Folder Links: TPS62160 TPS62161 TPS62162 TPS62163
TPS62160, TPS62161, TPS62162, TPS62163
www.ti.com
SLVSAM2E – NOVEMBER 2011 – REVISED MAY 2017
11.3 Thermal Considerations
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added
heat sinks and convection surfaces, and the presence of other heat-generating components affect the powerdissipation limits of a given component.
Three basic approaches for enhancing thermal performance are listed below:
• Improving the power dissipation capability of the PCB design
• Improving the thermal coupling of the component to the PCB by soldering the exposed thermal pad
• Introducing airflow in the system
For more details on how to use the thermal parameters, see the application reports Thermal Characteristics of
Linear and Logic Packages Using JEDEC PCB Designs, SZZA017 and Semiconductor and IC Package Thermal
Metrics, SPRA953.
The TPS6216x is designed for a maximum operating junction temperature (TJ) of 125°C. Therefore the maximum
output power is limited by the power losses that can be dissipated over the actual thermal resistance, given by
the package and the surrounding PCB structures. If the thermal resistance of the package is given, the size of
the surrounding copper area and a proper thermal connection of the IC can reduce the thermal resistance. To
get an improved thermal behavior, TI recommends to use top layer metal to connect the device with wide and
thick metal lines. Internal ground layers can connect to vias directly under the IC for improved thermal
performance.
If short circuit or overload conditions are present, the device is protected by limiting internal power dissipation.
Copyright © 2011–2017, Texas Instruments Incorporated
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TPS62160, TPS62161, TPS62162, TPS62163
SLVSAM2E – NOVEMBER 2011 – REVISED MAY 2017
www.ti.com
12 Device and Documentation Support
12.1 Custom Design With WEBENCH® Tools
Click here to create a custom design using the TPS62160 device with the WEBENCH® Power Designer.
1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements.
2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial.
3. Compare the generated design with other possible solutions from Texas Instruments.
The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time
pricing and component availability.
In most cases, these actions are available:
• Run electrical simulations to see important waveforms and circuit performance
• Run thermal simulations to understand board thermal performance
• Export customized schematic and layout into popular CAD formats
• Print PDF reports for the design, and share the design with colleagues
Get more information about WEBENCH tools at www.ti.com/WEBENCH.
12.2 Device Support
12.2.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
12.3 Documentation Support
12.3.1 Related Documentation
For related documentation see the following:
• Optimizing the TPS62130/40/50/60/70 Output Filter, SLVA463
• Optimizing Transient Response of Internally Compensated dc-dc Converters With Feedforward Capacitor,
SLVA289
• Using a Feedforward Capacitor to Improve Stability and Bandwidth of TPS62130/40/50/60/70, SLVA466
• Thermal Characteristics of Linear and Logic Packages Using JEDEC PCB Designs, SZZA017
12.4 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 5. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
TPS62160
Click here
Click here
Click here
Click here
Click here
TPS62161
Click here
Click here
Click here
Click here
Click here
TPS62162
Click here
Click here
Click here
Click here
Click here
TPS62163
Click here
Click here
Click here
Click here
Click here
12.5 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
28
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Copyright © 2011–2017, Texas Instruments Incorporated
Product Folder Links: TPS62160 TPS62161 TPS62162 TPS62163
TPS62160, TPS62161, TPS62162, TPS62163
www.ti.com
SLVSAM2E – NOVEMBER 2011 – REVISED MAY 2017
Community Resources (continued)
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.6 Trademarks
DCS-Control, E2E are trademarks of Texas Instruments.
WEBENCH is a registered trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.7 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.8 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2011–2017, Texas Instruments Incorporated
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Product Folder Links: TPS62160 TPS62161 TPS62162 TPS62163
29
PACKAGE OPTION ADDENDUM
www.ti.com
20-Jul-2019
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TPS62160DGKR
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
62160
TPS62160DGKT
ACTIVE
VSSOP
DGK
8
250
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
62160
TPS62160DSGR
ACTIVE
WSON
DSG
8
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
QTV
TPS62160DSGT
ACTIVE
WSON
DSG
8
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
QTV
TPS62161DSGR
ACTIVE
WSON
DSG
8
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
QUB
TPS62161DSGT
ACTIVE
WSON
DSG
8
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
QUB
TPS62162DSGR
ACTIVE
WSON
DSG
8
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
QUC
TPS62162DSGT
ACTIVE
WSON
DSG
8
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
QUC
TPS62163DSGR
ACTIVE
WSON
DSG
8
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
QUD
TPS62163DSGT
ACTIVE
WSON
DSG
8
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
QUD
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
(4)
20-Jul-2019
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TPS62160, TPS62162 :
• Automotive: TPS62160-Q1, TPS62162-Q1
NOTE: Qualified Version Definitions:
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Jul-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
TPS62160DGKR
VSSOP
DGK
8
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2500
330.0
12.4
5.3
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
3.4
1.4
8.0
12.0
Q1
TPS62160DGKT
VSSOP
DGK
8
250
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
TPS62160DSGR
WSON
DSG
8
3000
178.0
8.4
2.25
2.25
1.0
4.0
8.0
Q2
TPS62160DSGT
WSON
DSG
8
250
178.0
8.4
2.25
2.25
1.0
4.0
8.0
Q2
TPS62161DSGR
WSON
DSG
8
3000
180.0
8.4
2.3
2.3
1.15
4.0
8.0
Q2
TPS62161DSGT
WSON
DSG
8
250
180.0
8.4
2.3
2.3
1.15
4.0
8.0
Q2
TPS62162DSGR
WSON
DSG
8
3000
180.0
8.4
2.3
2.3
1.15
4.0
8.0
Q2
TPS62162DSGT
WSON
DSG
8
250
180.0
8.4
2.3
2.3
1.15
4.0
8.0
Q2
TPS62163DSGR
WSON
DSG
8
3000
180.0
8.4
2.3
2.3
1.15
4.0
8.0
Q2
TPS62163DSGT
WSON
DSG
8
250
180.0
8.4
2.3
2.3
1.15
4.0
8.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Jul-2019
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPS62160DGKR
VSSOP
DGK
8
2500
364.0
364.0
27.0
TPS62160DGKT
VSSOP
DGK
8
250
364.0
364.0
27.0
TPS62160DSGR
WSON
DSG
8
3000
205.0
200.0
33.0
TPS62160DSGT
WSON
DSG
8
250
205.0
200.0
33.0
TPS62161DSGR
WSON
DSG
8
3000
210.0
185.0
35.0
TPS62161DSGT
WSON
DSG
8
250
210.0
185.0
35.0
TPS62162DSGR
WSON
DSG
8
3000
210.0
185.0
35.0
TPS62162DSGT
WSON
DSG
8
250
210.0
185.0
35.0
TPS62163DSGR
WSON
DSG
8
3000
210.0
185.0
35.0
TPS62163DSGT
WSON
DSG
8
250
210.0
185.0
35.0
Pack Materials-Page 2
GENERIC PACKAGE VIEW
DSG 8
WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
2 x 2, 0.5 mm pitch
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4224783/A
www.ti.com
PACKAGE OUTLINE
DSG0008A
WSON - 0.8 mm max height
SCALE 5.500
PLASTIC SMALL OUTLINE - NO LEAD
2.1
1.9
A
B
PIN 1 INDEX AREA
2.1
1.9
0.32
0.18
0.4
0.2
OPTIONAL TERMINAL
TYPICAL
C
0.8 MAX
SEATING PLANE
0.05
0.00
0.08 C
EXPOSED
THERMAL PAD
(0.2) TYP
0.9 0.1
5
4
6X 0.5
2X
1.5
SEE OPTIONAL
TERMINAL
9
8
1
PIN 1 ID
1.6 0.1
8X
0.4
8X
0.2
0.32
0.18
0.1
0.05
C A B
C
4218900/C 04/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
DSG0008A
WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
(0.9)
8X (0.5)
( 0.2) VIA
TYP
1
8
8X (0.25)
(0.55)
SYMM
9
(1.6)
6X (0.5)
5
4
SYMM
(R0.05) TYP
(1.9)
LAND PATTERN EXAMPLE
SCALE:20X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
SOLDER MASK
OPENING
METAL
METAL UNDER
SOLDER MASK
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
OPENING
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4218900/C 04/2019
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
DSG0008A
WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
8X (0.5)
SYMM
METAL
1
8
8X (0.25)
(0.45)
SYMM
9
(0.7)
6X (0.5)
5
4
(R0.05) TYP
(0.9)
(1.9)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD 9:
87% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:25X
4218900/C 04/2019
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
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TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
permission to use these resources only for development of an application that uses the TI products described in the resource. Other
reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third
party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims,
damages, costs, losses, and liabilities arising out of your use of these resources.
TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on
ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable
warranties or warranty disclaimers for TI products.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2019, Texas Instruments Incorporated
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