Texas Instruments | TLV61046A 28-V Output Voltage Boost Converter with Power Diode and Isolation Switch (Rev. A) | Datasheet | Texas Instruments TLV61046A 28-V Output Voltage Boost Converter with Power Diode and Isolation Switch (Rev. A) Datasheet

Texas Instruments TLV61046A 28-V Output Voltage Boost Converter with Power Diode and Isolation Switch (Rev. A) Datasheet
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TLV61046A
SLVSD82A – APRIL 2017 – REVISED APRIL 2017
TLV61046A 28-V Output Voltage Boost Converter with Power Diode and Isolation Switch
1 Features
3 Description
•
The TLV61046A is a highly integrated boost
converter designed for applications such as PMOLED
panel, LCD bias supply and sensor module. The
TLV61046A integrates a 30-V power switch, an input
to output isolation switch, and a rectifier diode. It can
output up to 28 V from input of a Li+ battery or two
alkaline batteries in series.
1
•
•
•
•
•
•
•
•
•
•
•
•
Input Voltage Range: 1.8 V to 5.5 V, down to 1.6
V after Startup
Output Voltage Up to 28 V
Integrated Power Diode and Isolation Switch
980-mA (typical) Switch Current
Up to 85% Efficiency at 3.6-V Input and 12-V
Output
±2.5% Output Voltage Accuracy
Power Save Operation Mode at Light Load
Internal 7-ms Soft Start Time
True Disconnection between Input and Output
during Shutdown
Output Short Circuit Protection
Output Over-Voltage Protection
Thermal Shutdown Protection
3-mm × 3-mm SOT23-6 Package
The TLV61046A operates with a switching frequency
at 1.0 MHz. This allows the use of small external
components. The TLV61046A has an internal default
12-V output voltage setting by connecting the FB pin
to the VIN pin. Thus it only needs three external
components to get 12-V output voltage. The
TLV61046A has typical 980-mA switch current limit. It
has 7-ms built-in soft start time to reduce the inrush
current. When the TLV61046A is in shutdown mode,
the isolation switch disconnects the output from input
to minimize the leakage current. The TLV61046A also
implements output short circuit protection, output
over-voltage protection and thermal shutdown.
The TLV61046A is available in a 6-pin 3-mm x 3-mm
SOT23-6 package.
2 Applications
•
•
•
•
•
PMOLED Power Supply
LCD Panel
Wearable Devices
Portable Medical Equipment
Sensor Power Supply
Device Information(1)
PART NUMBER
TLV61046A
PACKAGE
SOT23-6 (6)
BODY SIZE (NOM)
2.9 mm x 1.6 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Simplified Schematic
L1
1.8 V ~ 5.5 V
C1
VIN
SW
4.5 V ~ 28 V
GND
VOUT
C2
ON
R1
OFF
EN
FB
R2
Copyright © 2017, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TLV61046A
SLVSD82A – APRIL 2017 – REVISED APRIL 2017
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Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
6.5
6.6
4
4
4
4
5
6
Absolute Maximum Ratings ......................................
ESD Ratings ............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Typical Characteristics ..............................................
Detailed Description .............................................. 8
7.1
7.2
7.3
7.4
Overview ...................................................................
Functional Block Diagram .........................................
Feature Description...................................................
Device Functional Modes..........................................
8
8
9
9
8
Application and Implementation ........................ 11
8.1 Application Information............................................ 11
8.2 Typical Application - 12-V Output Boost Converter 11
8.3 System Examples ................................................... 15
9 Power Supply Recommendations...................... 16
10 Layout................................................................... 17
10.1 Layout Guidelines ................................................. 17
10.2 Layout Example .................................................... 17
11 Device and Documentation Support ................. 18
11.1
11.2
11.3
11.4
11.5
11.6
Device Support ....................................................
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
18
18
18
18
18
18
12 Mechanical, Packaging, and Orderable
Information ........................................................... 18
4 Revision History
Changes from Original (April 2017) to Revision A
•
2
Page
Changed to Production Data .................................................................................................................................................. 1
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5 Pin Configuration and Functions
DBV Package
6-Pin SOT23
Top View
VIN
SW
VOUT
GND
EN
FB
Pin Functions
PIN
NAME
NUMBER
TYPE
DESCRIPTION
SW
1
PWR
The switch pin of the converter. It is connected to the drain of the internal power MOSFET.
GND
2
PWR
Ground
FB
3
I
Voltage feedback of adjustable output voltage. Connected to the center tap of a resistor divider to
program the output voltage. When it is connected to the VIN pin, the output voltage is set to 12 V by an
internal feedback.
EN
4
I
Enable logic input. Logic high voltage enables the device. Logic low voltage disables the device and turns
it into shutdown mode.
VOUT
5
PWR
VIN
6
I
Output of the boost converter
IC power supply input
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
Voltage range at terminals
(2)
(1)
MIN
MAX
UNIT
VIN, EN, FB
– 0.3
6
V
SW, VOUT
–0.3
32
V
Operating junction temperature range, TJ
–40
150
°C
Storage temperature range, Tstg
–65
150
°C
(1)
(2)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to network ground terminal.
6.2 ESD Ratings
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins
V(ESD)
(1)
(2)
(3)
(1)
Electrostatic discharge
(2)
Charged device model (CDM), per JEDEC specification JESD22-C101,
all pins (3)
VALUE
UNIT
±2000
V
±500
V
Electrostatic discharge (ESD) to measure device sensitivity and immunity to damage caused by assembly line electrostatic discharges in
to the device.
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
TYP
MAX
UNIT
VIN
Input voltage range
1.8
5.5
V
VOUT
Output voltage range
3.3
28
V
L
Effective inductance range
2.2×0.7
10
CIN
Effective input capacitance range
0.22
1.0
COUT
Effective output capacitance range
0.22
1.0
TJ
Operating junction temperature
–40
22×1.3
µH
µF
10
µF
125
°C
6.4 Thermal Information
TLV61046A
THERMAL METRIC
(1)
DBV (SOT23)
UNIT
6 PINS
RθJA
Junction-to-ambient thermal resistance
177.7
RθJC(top)
Junction-to-case (top) thermal resistance
120.6
RθJB
Junction-to-board thermal resistance
33.2
ψJT
Junction-to-top characterization parameter
21.5
ψJB
Junction-to-board characterization parameter
32.6
RθJC(bot)
Junction-to-case (bottom) thermal resistance
n/a
(1)
4
°C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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6.5 Electrical Characteristics
TA = –40°C to 85°C, VIN = 3.6 V and VOUT = 12 V. Typical values are at TA = 25°C, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
POWER SUPPLY
VIN
Input voltage range
VIN_UVLO
Under voltage lockout threshold
VIN_HYS
VIN UVLO hysteresis
1.8
5.5
VIN rising
1.75
1.8
VIN falling
1.55
1.6
200
IQ_VIN
Quiescent current into VIN pin
IC enabled, no load, no switching, VIN = 1.8 V to 5.5 V,
VOUT = 12 V
ISD
Shutdown current into VIN pin
IC disabled, VIN = 1.8 V to 5.5 V, TA = 25°C
V
V
mV
110
200
µA
0.1
1.0
µA
28
V
11.7
12.1
12.4
V
PWM mode, TA=25°C
0.783
0.795
0.807
V
PWM mode, TJ=-40°C to 125°C
0.775
0.795
0.815
V
OUTPUT
VOUT
Output voltage range
VOUT_12V
12-V output voltage accuracy
VREF
Feedback voltage
3.3
FB pin connected to VIN pin, TJ=0°C to 125°C
PFM mode, TA=25°C
VOVP
Output overvoltage protection threshold
VOVP_HYS
Over voltage protection hysteresis
IFB_LKG
Leakage current into FB pin
ISW_LKG
Leakage current into SW pin
0.803
28
29.2
V
30.4
V
TA = 25°C
200
nA
IC disabled, TA = 25°C
500
nA
0.9
V
POWER SWITCH
Isolation MOSFET on resistance
VOUT = 12 V
850
Low-side MOSFET on resistance
VOUT = 12 V
450
fSW
Switching frequency
VIN = 3.6 V, VOUT = 12 V, PWM mode
tON_min
Minimal switch on time
RDS(on)
850
VIN = 3.6 V, VOUT = 12 V
680
VIN = 2.4 V, VOUT = 3.3 V
20
ILIM_SW
Peak switch current limit
ILIM_CHG
Pre-charge current
VIN = 3.6 V, VOUT = 0 V
tSTARTUP
Startup time
VOUT from VIN to 12 V, COUT_effective = 2.2 µF, IOUT = 0 A
2
mΩ
1050
1250
150
250
kHz
ns
980
1250
mA
30
50
mA
5
mA
ms
LOGIC INTERFACE
VEN_H
EN Logic high threshold
VEN_L
EN Logic Low threshold
1.2
0.4
V
V
PROTECTION
TSD
Thermal shutdown threshold
TJ rising
TSD_HYS
Thermal shutdown hysteresis
TJ falling below TSD
150
°C
20
°C
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6.6 Typical Characteristics
100
100
90
90
80
80
70
70
Efficency (%)
Efficiency (%)
VIN = 3.6 V, VOUT = 12 V, TA = 25°C, unless otherwise noted.
60
50
40
60
50
40
30
30
VIN = 1.8 V
VIN = 3 V
VIN = 3.6 V
VIN = 4.2 V
20
10
0
0.0001
0.001
0.01
Output Current (A)
0.1
20
VOUT = 5 V
VOUT = 12 V
VOUT = 24 V
10
0
0.0001
1
0.001
D001
VOUT = 12 V
1
D002
Figure 2. Efficiency vs Output Current
12.2
810
12.15
805
Reference Voltage (mV)
12-V Fixed Output Voltage (V)
0.1
VIN = 3.6 V
Figure 1. Efficiency vs Output Current
12.1
12.05
12
800
795
790
785
11.95
11.9
-40
0.01
Output Current (A)
-20
0
20
40
60
Temperature (qC)
80
100
780
-40
120
-20
0
20
40
60
Temperature (qC)
D003
VIN = 3.6 V, VOUT = 12 V, FB pin connected to VIN pin, PWM
mode
80
100
120
D004
VIN = 3.6 V, VOUT = 12 V, PWM mode
Figure 4. FB Reference Voltage vs Temperature
150
150
140
140
130
130
Quiescent Current (PA)
Quiescent Current (PA)
Figure 3. 12-V Fixed Output Voltage vs Temperature
120
110
100
90
80
70
-40
110
100
90
80
-20
0
20
40
60
Temperature (qC)
80
100
120
70
1.8
D005
VIN = 3.6 V, VOUT = 12 V, No switching
2.4
3
3.6
4.2
Input Voltage (V)
4.8
5.4
6
D001
VIN = 1.8 V ~ 6 V, VOUT = 12 V, No switching
Figure 5. Quiescent Current into VIN vs Temperature
6
120
Figure 6. Quiescent Current into VIN vs Input Voltage
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Typical Characteristics (continued)
0.3
1100
0.25
1000
Current Limit (mA)
Shutdown Current (PA)
VIN = 3.6 V, VOUT = 12 V, TA = 25°C, unless otherwise noted.
0.2
0.15
0.1
800
700
600
0.05
0
-40
900
-20
0
20
40
Temperature (qC)
60
500
-40
80
-20
0
20
40
60
Temperature (qC)
D007
VIN = 3.6 V
80
100
120
D008
VIN = 3.6 V, VOUT = 12 V
Figure 7. Shutdown Current vs Temperature
Figure 8. Current Limit vs Temperature
1100
Current Limit (mA)
1000
900
800
700
600
500
1.8
2.4
3
3.6
4.2
Input Voltage (V)
4.8
5.4
6
D009
VIN = 1.8 V ~ 6 V, VOUT = 12 V
Figure 9. Current Limit vs Input Voltage
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7 Detailed Description
7.1 Overview
The TLV61046A is a highly integrated boost converter designed for applications requiring high voltage and small
solution size such as PMOLED panel power supply and sensor module. The TLV61046A integrates a 30-V
power switch, an input to output isolation switch and a rectifier diode. It can output up to 28 V from input of a Li+
battery or two cell alkaline batteries in series.
One common issue with conventional boost regulators is the conduction path from input to output even when the
power switch is turned off. It creates three problems, which are inrush current during start-up, output leakage
current during shutdown and excessive over load current. In the TLV61046A, the isolation switch is turned off
under shutdown mode and over load conditions, thereby opening the current path. Thus the TLV61046A can
truely disconnect the load from the input voltage and minimize the leakage current during shutdown mode.
The TLV61046A operates with a switching frequency at 1.0 MHz. This allows the use of small external
components. The TLV61046A has an internal default 12-V output voltage setting by connecting the FB pin to the
VIN pin. Thus it only needs three external components to get 12-V output voltage. The TLV61046A has typical
980-mA switch current limit. It has 7-ms built-in soft start time to minimize the inrush current. The TLV61046A
also implements output short circuit protection, output over-voltage protection and thermal shutdown.
7.2 Functional Block Diagram
VIN
SW
6
1
VIN
VOUT
UVLO
Thermal
Shutdown
4
Logic
VOUT
3
FB
Gate Driver
Gate Driver
EN
5
Pre-charge &
Short Circuit
Protection &
On/Off Control
EN
PWM / PFM
Control
1.2V
FB
GND
2
OVP REF
VOUT
Soft Start &
Current Limit Control
EA
REF
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7.3 Feature Description
7.3.1 Under-Voltage Lockout
An under-voltage lockout (UVLO) circuit stops the operation of the converter when the input voltage drops below
the typical UVLO threshold of 1.55 V. A hysteresis of 200 mV is added so that the device cannot be enabled
again until the input voltage goes up to 1.75 V. This function is implemented in order to prevent malfunctioning of
the device when the input voltage is between 1.55 V and 1.75 V.
7.3.2 Enable and Disable
When the input voltage is above maximal UVLO rising threshold of 1.8 V and the EN pin is pulled high, the
TLV61046A is enabled. When the EN pin is pulled low, the TLV61046A goes into shutdown mode. The device
stops switching and the isolation switch is turned off providing the isolation between input and output. In
shutdown mode, less than 1-µA input current is consumed.
7.3.3 Soft Start
The TLV61046A begins soft start when the EN pin is pulled high. at the beginning of the soft start period, the
isolation FET is turned on slowly to charge the output capacitor with 30-mA current for about 2 ms. This is called
the pre-charge phase. After the pre-charge phase, the TLV61046A starts switching. This is called switching soft
start phase. An internal soft start circuit limits the peak inductor current according to the output voltage. When the
output voltage is below 3 V, the peak inductor current is limited to 140 mA. Along with the output voltage going
up from 3 V to 5 V, the peak current limit is gradually increased to the normal value of 980 mA. The switching
soft start phase is about 5 ms typically. The soft start funciton reduces the inrush current during startup.
7.3.4 Over-voltage Protection
The TLV61046A has internal output over-voltage protection (OVP) function. When the output voltage exceeds
the OVP threshold of 29.2 V, the device stops switching. Once the output voltage falls 0.9 V below the OVP
threshold, the device resumes operation again.
7.3.5 Output Short Circuit Protection
The TLV61046A starts to limit the output current whenever the output voltage drops below 4 V. The lower output
voltage, the smaller output current limit. When the VOUT pin is shorted to ground, the output current is limited to
less than 200 mA. This function protects the device from being damaged when the output is shorted to ground.
7.3.6 Thermal Shutdown
The TLV61046A goes into thermal shutdown once the junction temperature exceeds the thermal shutdown
termperature threshold of 150°C typically. When the junction temperature drops below 130°C typically, the device
starts operating again.
7.4 Device Functional Modes
The TLV61046A has two operation modes, PWM mode and power save mode.
7.4.1 PWM Mode
The TLV61046A uses a quasi-constant 1.0-MHz frequency pulse width modulation (PWM) at moderate to heavy
load current. Based on the input voltage to output votlage ratio, a circuit predicts the required off-time. At the
beginning of the switching cycle, the NMOS switching FET, shown in the functional block diagram, is turned on.
The input voltage is applied across the inductor and the inductor current ramps up. In this phase, the output
capacitor is discharged by the load current. When the inductor current hits the current threshold that is set by the
output of the error amplifier, the PWM switch is turned off, and the power diode is forward-biased. The inductor
transfers its stored energy to replenish the output capacitor and supply the load. When the off-time is expired, the
next switching cycle starts again. The error amplifier compares the FB pin voltage with an internal reference
votlage, and its output determines the inductor peak current.
The TLV61046A has a built-in compensation circuit that can accommodate a wide range of input voltage, output
voltage, inductor value and output capacitor value for stable operation.
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Device Functional Modes (continued)
7.4.2 Power Save Mode
The TLV61046A implements a power save mode with pulse frequency modulation (PFM) to improve efficiency at
light load. When the load current decreases, the inductor peak current set by the output of the error amplifier
declines to regulate the output voltage. When the inductor peak current hits the low limit of 200 mA, the output
voltage will exceed the setting voltage as the load current decreases further. When the FB voltage hits the PFM
reference voltage, the TLV61046A goes into the power save mode. In the power save mode, when the FB
voltage rises and hits the PFM reference voltage, the device continues switching for several cycles because of
the delay time of the internal comparator. Then it stops switching. The load is supplied by the output capacitor
and the output voltage declines. When the FB voltage falls below the PFM reference voltage, after the delay time
of the comparator, the device starts switching again to ramp up the output voltage.
Output
Voltage
PFM mode at light load
1.01 x VOUT_NOM
VOUT_NOM
PWM mode at heavy load
Figure 10. Output Voltage in PWM Mode and PFM Mode
10
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The TLV61046A is a boost DC-DC converter integrating a power switch, an input to output isolation switch and a
rectifier diode. The device supports up to 28-V output with the input voltage range from 1.8 V to 5.5 V. The
TLV61046A adopts the current-mode control with adaptive constant off-time. The switching frequency is quasiconstant at 1.0 MHz. The isolation switch disconnects the output from the input during shutdown to minimize
leakage current.
The following design procedure can be used to select component values for the TLV61046A.
8.2 Typical Application - 12-V Output Boost Converter
spacing
L1
2.7 V ~ 4.2 V
10 µH
C1
1.0 µF
VIN
SW
12 V
VOUT
GND
C2
TLV61046A
ON
4.7 µF
R1
OFF
1.0 M
FB
EN
R2
71.5 k
Figure 11. 12-V Boost Converter
8.2.1 Design Requirements
Table 1. Design Requirements
PARAMETERS
VALUES
Input Voltage
2.7 V ~ 4.2 V
Output Voltage
12 V
Output Current
50 mA
Output Voltage Ripple
±50mV
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8.2.2 Detailed Design Procedure
8.2.2.1 Programming the Output Voltage
There are two ways to set the output voltage of the TLV61046A. When the FB pin is connected to the input
voltage, the output voltage is fixed to 12 V. This function makes the TLV61046A only need three external
components to minimize the solution size. The second way is to use an external resistor divider to set the
desired output voltage.
By selecting the external resistor divider R1 and R2, as shown in Equation 1, the output voltage is programmed
to the desired value. When the output voltage is regulated, the typical voltage at the FB pin is VREF of 795 mV.
§V
R1 ¨ OUT
© VREF
·
1¸ u R2
¹
where
•
•
VOUT is the desired output voltage
VREF is the internal reference voltage at the FB pin
(1)
For best accuracy, R2 should be kept smaller than 80 kΩ to ensure the current flowing through R2 is at least 100
times larger than the FB pin leakage current. Changing R2 towards a lower value increases the immunity against
noise injection. Changing the R2 towards a higher value reduces the quiescent current for achieving higher
efficiency at low load currents.
8.2.2.2 Inductor Selection
Because the selection of the inductor affects steady state operation, transient behavior, and loop stability, the
inductor is the most important component in power regulator design. There are three important inductor
specifications, inductor value, saturation current, and dc resistance (DCR).
The TLV61046A is designed to work with inductor values between 2.2 µH and 22 µH. Follow Equation 2 to
Equation 4 to calculate the inductor’s peak current for the application. To calculate the peak current in the worst
case, use the minimum input voltage, maximum output voltage, and maximum load current of the application. To
have enough design margin, choose the inductor value with -30% tolerance, and a low power-conversion
efficiency for the calculation.
In a boost regulator, the inductor dc current can be calculated with Equation 2.
VOUT u IOUT
IL(DC)
VIN u K
where
•
•
•
•
VOUT = output voltage
IOUT = output current
VIN = input voltage
η = power conversion efficiency, use 80% for most applications
(2)
The inductor ripple current is calculated with the Equation 3 for an asynchronous boost converter in continuous
conduction mode (CCM).
VIN u VOUT 0.8V VIN
'IL(P P)
L u fSW u VOUT 0.8V
where
•
•
•
•
•
ΔIL(P-P) = inductor ripple current
L = inductor value
fSW = switching frequency
VOUT = output voltage
VIN = input voltage
(3)
Therefore, the inductor peak current is calculated with Equation 4.
12
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IL P
IL DC
'IL P
P
2
(4)
Normally, it is advisable to work with an inductor peak-to-peak current of less than 40% of the average inductor
current for maximum output current. A smaller ripple from a larger valued inductor reduces the magnetic
hysteresis losses in the inductor, and EMI. But in the same way, load transient response time is increased.
Because the TLV61046A is for relatively small output current application, the inductor peak-to-peak current could
be as high as 200% of the average current with a small inductor value, which means the TLV61046A always
works in DCM mode.Table 2 lists the recommended inductors for the TLV61046A.
Table 2. Recommended Inductors for the TLV61046A
(1)
PART NUMBER
L(µH)
DCR MAX (mΩ)
FDSD0420-H-100M
10
CDRH3D23/HP
10
74438336100
VLS4012-4R7M
VENDOR (1)
SATURATION CURRENT (A)
SIZE (LxWxH)
200
2.5
4.2x4.2x2.0
Toko
198
1.02
4.0x4.0x2.5
Sumida
10
322
2.35
3.2x3.2x2.0
Wurth
4.7
132
1.1
4.0x4.0x1.2
TDK
See Third-party Products Disclaimer
8.2.2.3 Input and Output Capacitor Selection
The output capacitor is mainly selected to meet the requirements for output ripple and loop stability. This ripple
voltage is related to the capacitor’s capacitance and its equivalent series resistance (ESR). Assuming a ceramic
capacitor with zero ESR, the minimum capacitance needed for a given ripple can be calculated by:
IOUT u DMAX
COUT
fSW u VRIPPLE
where
•
•
DMAX = maximum switching duty cycle
VRIPPLE = peak to peak output voltage ripple
(5)
The ESR impact on the output ripple must be considered if tantalum or aluminum electrolytic capacitors are
used.
Care must be taken when evaluating a ceramic capacitor’s derating under dc bias, aging, and ac signal. For
example, the dc bias can significantly reduce capacitance. A ceramic capacitor can lose more than 50% of its
capacitance at its rated voltage. Therefore, always leave margin on the voltage rating to ensure adequate
capacitance at the required output voltage.
It is recommended to use the output capacitor with effective capacitance in the range of 0.47 μF to 10 μF. The
output capacitor affects loop stability of the boost regulator. If the output capacitor is below the range, the boost
regulator can potentially become unstable. Increasing the output capacitor makes the output voltage ripple
smaller in PWM mode.
For input capacitor, a ceramic capacitor with more than 1.0 µF is enough for most applications.
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8.2.3 Application Performance Curves
SW
10 V / div
SW
10 V / div
VOUT (AC)
30 mV / div
VOUT (AC)
10 mV / div
Inductor
Current
100 mA / div
Inductor
Current
100 mA / div
VIN = 3.6 V, VOUT = 12 V, IOUT = 18 mA
VIN = 3.6 V, VOUT = 12 V, IOUT = 50 mA
Figure 13. Switching Waveforms in PWM DCM Mode
Figure 12. Switching Waveforms in PWM CCM Mode
SW
10 V / div
EN
1 V / div
VOUT (AC)
50 mV / div
Inductor
Current
100 mA / div
VOUT
3 V / div
Inductor
Current
100 mA / div
VIN = 3.6 V, VOUT = 12 V, IOUT = 3 mA
VIN = 3.6 V, VOUT = 12 V, IOUT = 50 mA
Figure 14. Switching Waveforms in Power Save Mode
Figure 15. Soft Startup Waveforms
EN
1 V / div
VOUT (AC)
200 mV / div
VOUT (AC)
3 V / div
Inductor
Current
100 mA / div
Output Current
50 mA / div
VIN = 3.6 V, VOUT = 12 V
VIN = 3.6 V, VOUT = 12 V, IOUT = 50 mA
Figure 16. Shutdown Waveforms
14
Figure 17. 30-mA to 70-mA Load Transient Response
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VOUT (AC)
200 mV / div
VIN (3.3 V offset)
500 mV / div
VOUT = 12 V, IOUT = 50 mA
Figure 18. Input Voltage from 3.3-V to 4.2-V Line Transient Response
8.3 System Examples
8.3.1 Fixed 12-V Output Voltage with Three External Components
The TLV61046A can output fixed 12-V voltage by connecting the FB pin to the VIN pin to save the external
resistor divider. The Figure 19 shows the application circuit.
L1
1.8 V ~ 5.5 V
C1
10PH
2.2PF
VIN
SW
12 V
FB
VOUT
C2
10PF
ON
OFF
EN
GND
Copyright © 2017, Texas Instruments Incorporated
Figure 19. Fixed 12-V Output Voltage by Connecting the FB Pin to VIN Pin
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9 Power Supply Recommendations
The device is designed to operate from an input voltage supply range between 1.8 V to 5.5 V. This input supply
must be well regulated. If the input supply is located more than a few inches from the converter, additional bulk
capacitance may be required in addition to the ceramic bypass capacitors. A typical choice is an electrolytic or
tantalum capacitor with a value of 47 µF. The input power supply’s output current needs to be rated according to
the supply voltage, output voltage and output current of the TLV61046A.
16
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10 Layout
10.1 Layout Guidelines
As for all switching power supplies, especially those running at high switching frequency and high currents,
layout is an important design step. If the layout is not carefully done, the regulator could suffer from instability
and noise problems. To maximize efficiency, switch rise and fall time are very fast. To prevent radiation of high
frequency noise (for example, EMI), proper layout of the high-frequency switching path is essential. Minimize the
length and area of all traces connected to the SW pin, and always use a ground plane under the switching
regulator to minimize interplane coupling. The input capacitor needs not only to be close to the VIN pin, but also
to the GND pin in order to reduce input supply ripple.
The most critical current path for all boost converters is from the switching FET, through the rectifier diode, then
the output capacitors, and back to ground of the switching FET. This high current path contains nanosecond rise
and fall time and should be kept as short as possible. Therefore, the output capacitors need not only to be close
to the VOUT pin, but also to the GND pin to reduce the overshoot at the SW pin and VOUT pin.
10.2 Layout Example
A large ground plane on the bottom layer connects the ground pins of the components on the top layer through
vias.
GND
VIN
VIN
VOUT
EN
VOUT
GND
SW
GND
FB
Figure 20. PCB Layout Example
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11 Device and Documentation Support
11.1 Device Support
11.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
11.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
11.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
18
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PACKAGE OPTION ADDENDUM
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5-May-2017
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TLV61046ADBVR
ACTIVE
SOT-23
DBV
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
1C4F
TLV61046ADBVT
ACTIVE
SOT-23
DBV
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
1C4F
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
5-May-2017
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
9-May-2017
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
TLV61046ADBVR
SOT-23
DBV
6
3000
180.0
8.4
TLV61046ADBVT
SOT-23
DBV
6
250
180.0
8.4
Pack Materials-Page 1
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
3.2
3.2
1.4
4.0
8.0
Q3
3.2
3.2
1.4
4.0
8.0
Q3
PACKAGE MATERIALS INFORMATION
www.ti.com
9-May-2017
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TLV61046ADBVR
SOT-23
DBV
6
3000
210.0
185.0
35.0
TLV61046ADBVT
SOT-23
DBV
6
250
210.0
185.0
35.0
Pack Materials-Page 2
PACKAGE OUTLINE
DBV0006A
SOT-23 - 1.45 mm max height
SCALE 4.000
SMALL OUTLINE TRANSISTOR
C
3.0
2.6
1.75
1.45
PIN 1
INDEX AREA
1
0.1 C
B
A
6
2X 0.95
1.9
1.45 MAX
3.05
2.75
5
2
4
0.50
6X
0.25
0.2
C A B
3
(1.1)
0.15
TYP
0.00
0.25
GAGE PLANE
8
TYP
0
0.22
TYP
0.08
0.6
TYP
0.3
SEATING PLANE
4214840/B 03/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.15 per side.
4. Leads 1,2,3 may be wider than leads 4,5,6 for package orientation.
5. Refernce JEDEC MO-178.
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EXAMPLE BOARD LAYOUT
DBV0006A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
6X (1.1)
1
6X (0.6)
6
SYMM
2
5
3
4
2X (0.95)
(R0.05) TYP
(2.6)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
EXPOSED METAL
EXPOSED METAL
0.07 MIN
ARROUND
0.07 MAX
ARROUND
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4214840/B 03/2018
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DBV0006A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
6X (1.1)
1
6X (0.6)
6
SYMM
2
5
3
4
2X(0.95)
(R0.05) TYP
(2.6)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
4214840/B 03/2018
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
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IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
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