Texas Instruments | DPI Evaluation TPS65310A | Application notes | Texas Instruments DPI Evaluation TPS65310A Application notes

Texas Instruments DPI Evaluation TPS65310A Application notes
Application Report
SLVA586 – June 2013
DPI Evaluation TPS65310-Q1
Michael Wendt
Mixed Signal Automotive-Catalog
ABSTRACT
The TPS65310A-Q1 is a power management unit, meeting the requirements of DSP
controlled automotive systems (e.g. Advanced Driver Assistance Systems). With its
integration of commonly used features it helps to significantly reduce board space and
system costs.
The device includes one high voltage buck controller for pre-regulation combined with two
buck and one boost converter for post regulation. A further integrated LDO rounds up the
power supply concept and offers a flexible system design with in total five independent
voltage rails. The device offers a low power state LPM0 with all rails off to reduce current
consumption in case the system is constantly connected to the battery line. All outputs are
protected against overload and over temperature.
An external PMOS makes the device capable of sustaining voltage transients up to 80 V
(protection feature). This external PMOS can also be used in safety critical applications to
protect the system in case one of the rails shows a malfunction (under-/overvoltage, over
current).
Internal Soft start ensures controlled start up for all supplies. Each power supply output
has adjustable output voltage based on the external resistor network settings.
The DPI (Direct Power Injection) evaluation will show the robustness of the TPS65310
device during HF Power injection at Global Pins. This test cannot replace other customer
tests like BCI (Bulk Current Injection), but it gives a first indication how the device behave
under HF stress.
1
SLVA586
1
2
3
4
5
6
7
8
9
Contents
DPI test TPS65310 ........................................................................................................................ 3
DPI set up...................................................................................................................................... 4
The Test Flow ............................................................................................................................... 5
Equipment used for the DPI test ................................................................................................. 6
Application data ........................................................................................................................... 6
Nodes Stressed with DPI in Application Circuit TPS65310 ...................................................... 7
Observed Signal During DPI Stress ............................................................................................ 7
Test Results .................................................................................................................................. 8
8.1 J26, VSSENSE, CW, Load ..................................................................................................... 8
8.2 J26, VSSENSE, AM, Load ...................................................................................................... 9
8.3 J25, VIN, CW, Load .............................................................................................................. 10
8.4 J25, VIN, AM, Load .............................................................................................................. 11
8.5 J21, WAKE, CW, Load ......................................................................................................... 12
8.6 J21, WAKE, AM, Load .......................................................................................................... 13
8.7 J10, HSSENSE, CW, Load ................................................................................................... 14
8.8 J10, HSSENSE, AM, Load.................................................................................................... 15
8.9 J11, HSCTRL, CW, Load ...................................................................................................... 16
8.10 J11, HSCTRL, AM, Load ...................................................................................................... 17
8.11 J20, LDO, CW, Load............................................................................................................. 18
8.12 J20, LDO, AM, Load ............................................................................................................. 19
8.13 J19, VBOOST, CW, Load ..................................................................................................... 20
8.14 J19, VBOOST, AM, Load ...................................................................................................... 21
8.15 J19, VBOOST, AM, Load ...................................................................................................... 22
8.16 J22, VSUP2, CW, Load ........................................................................................................ 23
8.17 J22, VSUP2, AM, Load ......................................................................................................... 24
8.18 J24, S1_Buck, CW, Load ...................................................................................................... 25
8.19 J24, S1_Buck, AM, Load ...................................................................................................... 26
8.20 J3, VSENSE1, CW, load....................................................................................................... 26
8.21 J7, VSENSE2, CW, load....................................................................................................... 26
8.22 J5, VSENSE3, CW, load....................................................................................................... 26
8.23 J25, VIN, CW, No Load ........................................................................................................ 27
8.24 J25, VIN, CW, Load .............................................................................................................. 28
DPI Test Summary...................................................................................................................... 29
Figure 1.
Figure 2.
2
Figures
DPI Set Up ........................................................................................................................ 4
Test Flow .......................................................................................................................... 5
DPI EvaluationTPS65310-Q1
SLVA586
1
DPI test TPS65310
To ensure the EMC performance of the TPS65310, a BCI test in the real application is needed.
•
The BCI (Bulk Current injection) test is difficult in an early phase of the system development
since ECU is not available yet.
•
Without BCI test results failures might be detected too late in the development flow.
•
The DPI test is one way to detect EMC weakness of the device even if it does not ensure
the pass of the BCI test.
•
For the DPI test the TPS65310 is used on standard EVM at room temperature (about 25oC).
The DUT (Device under Test) is soldered on the board.
•
The TPS65310 was stressed with injected HF power at certain nodes and the reaction of
the device will be observed. Step by step the forward power will be increased up to 30 dBm
(1 W) maximum peak. This test was performed at certain frequencies.
•
Certain signals are observed in digital way and analog output voltages with a multimeter or
oscilloscope.
•
For each first failure the HF power and the type of failure was documented.
•
The same procedure will be performed for the next frequency.
•
The 16 suggested frequencies are: 1 MHz, 2 MHz, 3 MHz, 5 MHZ, 8 MHz, 10 MHz, 20
MHz, 30 MHz, 50 MHz, 80 MHz, 100 MHz, 200 MHz, 300 MHz, 500 MHz, 800 MHz, 1 GHz
•
DPI test signal is CW and AM 1 KHZ modulation and 80% modulation.
DPI EvaluationTPS65310-Q1
SLVA586
2
DPI set up
DC source
+ 13.8V
Power Amplifier BLWA
Bonn Elektronik
1MHz…1GHz
Pout max = 20W
MSPC73
Analog values
(output voltages)
Fwd. vs.
Reflected
Power
Reflected
Power
AC
coupling
Forward
Power
HF-Generator
9kHz…3GHz
R&S IMS,
MSPC71
-3dB
R&S
AVG Power Sensor
MSPC72
DPI test signal is
CW and
AM 1KHZ modulation, 80% modulation.
Figure 1.
4
DUT
Placed
At
EVM
board
DPI EvaluationTPS65310-Q1
DPI Set Up
Digital values(RESN)
SLVA586
3
The Test Flow
Start, f=fmin, P=Pmin
f = fn
P=P+1dBm
n=n+1
Watch voltages and RESN
Yes
Failure ?
No
Yes
P <= Pmax ?
No
Print Data
f >= fmax ?
No
Yes
End
Figure 2.
Test Flow
DPI EvaluationTPS65310-Q1
SLVA586
4
5
Equipment used for the DPI test
•
TPS65310_EMC Rev A, DPI population
•
Power Supply Statron, MSPC16
•
HF-Generator, Rohde & Schwarz, IMS, 9kHz-3GHz, MSPC71
•
HF Amplifier, Bonn Elektronik, BLWA 0110-20, 1 MHz–1 GHz, 20 W, MSPC72
•
Power Sensor, Rohde & Schwarz, NRP-Z91, MSPC72
•
Multimeter Fluke 175, MSPC57, MSPC83
•
Multimeter Keithley 2000, MSPC50
•
MultiMate Keithley 2100, MSPC94, MSPC95
•
Oscilloscope Le Croy 6100, MSPC9
Application data
Used board: TPS65310_EMC Rev A, DPI population. The device was stresses with standard load and
with no load condition.
•
Used board: TPS65310_EMC Rev A, DPI population
•
Vbat = 13.3 V
•
Buck1
•
•
•
•
–
3.8 V
–
No load
Buck2
–
3.3 V, 0.45 A
–
7.4 Ohm
Buck3
–
1.2 V, 0.4 A
–
2.7 Ohm
Boost
–
5.0 V, 0.4 A
–
12 Ohm
LDO
–
•
6
2.5 V, 0.06 A
40 Ohm
DPI EvaluationTPS65310-Q1
SLVA586
6
Nodes Stressed with DPI in Application Circuit TPS65310
•
•
7
Global Pins
–
VSSENSE
–
VIN
–
VINPROT(not tested, decision during EMC board development)
–
WAKE
–
HSSENSE
Local Pins
–
HSCTRL
–
LDO
–
VBOOST
–
VSUP2,3,4 = VBUCK1 connected together, only tested VSUP2 = J22
–
S1_BUCK1(S1,S2 together)
–
VMONx,VSENSEx, not testable
Observed Signal During DPI Stress
•
BUCK1
•
BUCK2
•
BUCK3
•
BOOST
•
LDO
•
SPI register failure
DPI EvaluationTPS65310-Q1
SLVA586
8
Test Results
8.1
J26, VSSENSE, CW, Load
1000.00000
29.929 d
33
32
TargetLevel
30
28
26
24
Imm Level-Pk in dBm
22
20
18
16
14
12
10
8
6
LDO turn off
4
2
0
1M
2M
3M
5M
10M
20
30
50
Frequency in Hz
8
DPI EvaluationTPS65310-Q1
100M
200
300
500
1G
SLVA586
J26, VSSENSE, AM, Load
1000.00000
30.012 d
33
32
TargetLevel
30
28
26
24
22
Imm Level-Pk in dBm
8.2
20
18
16
14
12
10
8
Total turn off
6
4
2
0
1M
2M
3M
5M
10M
20
30
50
100M
200
300
500
1G
Frequency in Hz
DPI EvaluationTPS65310-Q1
SLVA586
8.3
J25, VIN, CW, Load
1000.00000
30.072 d
33
32
TargetLevel
30
28
26
24
Imm Level-Pk in dBm
22
20
18
16
14
12
10
8
6
LDO turn off
4
2
0
1M
2M
3M
5M
10M
20
30
50
Frequency in Hz
10
DPI EvaluationTPS65310-Q1
100M
200
300
500
1G
SLVA586
J25, VIN, AM, Load
1000.00000
30.029 d
33
32
TargetLevel
30
28
26
24
22
Imm Level-Pk in dBm
8.4
20
18
16
14
12
10
8
Total turn off
6
4
2
0
1M
2M
3M
5M
10M
20
30
50
100M
200
300
500
1G
Frequency in Hz
DPI EvaluationTPS65310-Q1
SLVA586
8.5
J21, WAKE, CW, Load
1000.00000
30.041 d
33
32
TargetLevel
30
28
26
24
Imm Level-Pk in dBm
22
20
18
16
14
12
10
8
6
4
2
0
1M
2M
3M
5M
10M
20
30
50
Frequency in Hz
12
DPI EvaluationTPS65310-Q1
100M
200
300
500
1G
SLVA586
J21, WAKE, AM, Load
1000.00000
29.844 d
33
32
TargetLevel
30
28
26
24
22
Imm Level-Pk in dBm
8.6
20
18
16
14
12
10
8
6
LDO turn off
4
2
0
1M
2M
3M
5M
10M
20
30
50
100M
200
300
500
1G
Frequency in Hz
DPI EvaluationTPS65310-Q1
SLVA586
8.7
J10, HSSENSE, CW, Load
1000.00000
30.105 d
33
32
TargetLevel
30
28
26
24
Imm Level-Pk in dBm
22
20
18
16
14
12
10
8
6
4
2
0
1M
2M
3M
5M
10M
20
30
50
Frequency in Hz
14
DPI EvaluationTPS65310-Q1
100M
200
300
500
1G
SLVA586
J10, HSSENSE, AM, Load
1000.00000
30.009 d
33
32
TargetLevel
30
28
26
24
22
Imm Level-Pk in dBm
8.8
20
18
16
14
12
10
8
6
4
2
0
1M
2M
3M
5M
10M
20
30
50
100M
200
300
500
1G
Frequency in Hz
DPI EvaluationTPS65310-Q1
SLVA586
8.9
J11, HSCTRL, CW, Load
1000.00000
30.022 d
33
32
TargetLevel
30
28
26
24
Imm Level-Pk in dBm
22
20
18
16
14
12
10
8
6
4
2
0
1M
2M
3M
5M
10M
20
30
50
Frequency in Hz
16
DPI EvaluationTPS65310-Q1
100M
200
300
500
1G
SLVA586
8.10 J11, HSCTRL, AM, Load
1000.00000
30.015 d
33
32
TargetLevel
30
28
26
24
Imm Level-Pk in dBm
22
20
18
16
14
12
10
8
6
4
2
0
1M
2M
3M
5M
10M
20
30
50
100M
200
300
500
1G
Frequency in Hz
DPI EvaluationTPS65310-Q1
SLVA586
8.11 J20, LDO, CW, Load
33
32
TargetLevel
30
28
1000.00000
22.995 d
26
24
Imm Level-Pk in dBm
22
20
18
16
14
12
Total turn off, not
very stable,
Restart only with
disconnected HF
cable
10
8
6
4
2
0
1M
2M
3M
5M
10M
20
30
50
Frequency in Hz
18
DPI EvaluationTPS65310-Q1
100M
200
300
500
1G
SLVA586
8.12 J20, LDO, AM, Load
33
32
TargetLevel
30
28
1000.00000
24.090 d
26
24
Imm Level-Pk in dBm
22
20
18
16
14
Total turn off, not
very stable,
Restart only with
disconnected HF
cable
12
10
8
6
4
2
0
1M
2M
3M
5M
10M
20
30
50
100M
200
300
500
1G
Frequency in Hz
DPI EvaluationTPS65310-Q1
SLVA586
8.13 J19, VBOOST, CW, Load
33
32
1000.00000
28.992 d
TargetLevel
30
28
26
24
Total turn off
Imm Level-Pk in dBm
22
20
18
16
14
12
10
8
6
4
2
0
1M
2M
3M
5M
10M
20
30
50
Frequency in Hz
20
DPI EvaluationTPS65310-Q1
100M
200
300
500
1G
SLVA586
8.14 J19, VBOOST, AM, Load
33
32
1000.00000
29.003 d
TargetLevel
30
28
26
24
Total turn off
Imm Level-Pk in dBm
22
20
18
16
14
12
10
8
6
4
2
0
1M
2M
3M
5M
10M
20
30
50
100M
200
300
500
1G
Frequency in Hz
DPI EvaluationTPS65310-Q1
SLVA586
8.15 J19, VBOOST, AM, Load
33
32
1000.00000
29.003 d
TargetLevel
30
28
26
24
Total turn off
Imm Level-Pk in dBm
22
20
18
16
14
12
10
8
6
4
2
0
1M
2M
3M
5M
10M
20
30
50
Frequency in Hz
22
DPI EvaluationTPS65310-Q1
100M
200
300
500
1G
SLVA586
8.16 J22, VSUP2, CW, Load
1000.00000
29.998 d
33
32
TargetLevel
30
28
26
24
Imm Level-Pk in dBm
22
20
18
16
14
First LDO failure,
than total turn off
12
10
8
6
4
2
0
1M
2M
3M
5M
10M
20
30
50
100M
200
300
500
1G
Frequency in Hz
DPI EvaluationTPS65310-Q1
SLVA586
8.17 J22, VSUP2, AM, Load
1000.00000
29.937 d
33
32
TargetLevel
30
28
26
24
Imm Level-Pk in dBm
22
20
18
16
14
12
10
8
6
4
2
0
1M
2M
3M
5M
10M
20
30
50
Frequency in Hz
24
DPI EvaluationTPS65310-Q1
100M
200
300
500
1G
SLVA586
8.18 J24, S1_Buck, CW, Load
1000.00000
30.136 d
33
32
TargetLevel
30
28
26
24
Imm Level-Pk in dBm
22
20
18
16
14
12
10
8
6
4
2
0
1M
2M
3M
5M
10M
20
30
50
100M
200
300
500
1G
Frequency in Hz
DPI EvaluationTPS65310-Q1
SLVA586
8.19 J24, S1_Buck, AM, Load
1000.00000
30.055 d
33
32
TargetLevel
30
28
26
24
Imm Level-Pk in dBm
22
20
18
16
14
12
10
8
6
4
2
0
1M
2M
3M
5M
10M
20
30
50
100M
200
300
500
1G
Frequency in Hz
8.20 J3, VSENSE1, CW, load
By connecting the HF Amplifier to the EMC board J3, total failure observed even without HF
injection.
8.21 J7, VSENSE2, CW, load
By connecting the HF Amplifier to the EMC board J3, total failure observed even without HF
injection.
8.22 J5, VSENSE3, CW, load
By connecting the HF Amplifier the EMC board J5, device was operating without HF.
By turning on the HF amplifier, the device was broken and not starting anymore.
26
DPI EvaluationTPS65310-Q1
SLVA586
8.23 J25, VIN, CW, No Load
1000.00000
29.993 d
33
32
TargetLevel
30
28
26
24
Imm Level-Pk in dBm
22
20
18
16
14
BOOST_FAIL
first, than
Total fail
Not seen with
load
12
10
8
6
4
Total FAIL
2
0
1M
2M
3M
5M
10M
20
30
50
100M
200
300
500
1G
Frequency in Hz
DPI EvaluationTPS65310-Q1
SLVA586
8.24 J25, VIN, CW, Load
1000.00000
30.072 d
33
32
TargetLevel
30
28
26
24
Imm Level-Pk in dBm
22
20
18
16
14
12
10
8
6
LDO turn off
4
2
0
1M
2M
3M
5M
10M
20
30
50
Frequency in Hz
28
DPI EvaluationTPS65310-Q1
100M
200
300
500
1G
SLVA586
9
DPI Test Summary
•
•
•
DPI Tests global pins
–
VSSENSE: Minor influence above 300 MHz down to 20 dBm
–
VIN: Minor influence at 100 MHz 28 dBm, above 300 MHz down to 22 dBm
–
WAKE: Minor influence 100 MHz AM down to 29 dBm
–
HSSENSE: No influence
–
With no load condition a difference performance was observed at VI pin at lower
frequencies.
DPI Tests local pins
–
HSCTRL: No influence
–
LDO: Major influence starting at 80 MHz down to 9 dBm @ 300 MHz, not very
reproducible, since this is a local pin it might be not critical, verification on ECU level is
needed (CAS BCI test).
–
VBOOST: Minor influence above 500 MHz down to 28 dBm
–
VSUPx: Minor influence above 100 MHz, down to 22 dBm
–
S1_BUCK: No influence
DPI Tests at local pins, internal
–
VMON and VSENSE not testable due to influence of coupling network to normal
operation of the application
DPI EvaluationTPS65310-Q1
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