Texas Instruments | bq27510-G2 to bq27510-G3 Change List | Application notes | Texas Instruments bq27510-G2 to bq27510-G3 Change List Application notes

Texas Instruments bq27510-G2 to bq27510-G3 Change List Application notes
Application Report
SLUA686 – September 2014
bq27510-G2 to bq27510-G3 Change List
ABSTRACT
This document describes the changes made from bq27510-G2 to bq27510-G3. The latest ordering
information and data sheet is available on the Texas Instruments (TI) Web site.
NOTE: bq27510-G2 uses FW version 1.23 and the bq27510-G3 uses FW version 4.00.
bq27510-G2 ICs can be upgraded with bq27510-G3 firmware to achieve identical
functionality.
1
Introduction
bq27510-G3 firmware version 4.00 has been released to enable several feature additions and
performance improvements. The following new orderable part numbers have been released which ship
pre-programmed with this new version of firmware:
• bq27510DRZR-G3
• bq27510DRZT-G3
The latest version of the evaluation software is required to be able to read and write all locations of the
data flash configuration. The necessary GaugeStudio and the corresponding v4.00 SENC file can be
downloaded from the bq27510-G3 product folder on ti.com. Existing bq27510 (including EVMs) can be
upgraded to the latest firmware version by following the instructions in application note SLUA453A.
NOTE:
2
If a golden image created for another version of bq27510 is loaded into an IC running
firmware version 4.00, the IC becomes non-functional and must be replaced. Please ensure
all instructions in SLUA453A are followed if upgrading ICs or converting your production line
to bq27510-G3.
The best practice is to generate a new golden image (DFI file) for bq27510-G3.
Change Details
Table 1. Change Details
Change
bq27510-G2
bq27510-G3
Comments
Support for larger
capacity batteries
Support battery capacity up to 8 Ah.
Support battery capacities up to 14.5 Ah
using Des Energy Scale feature.
Design Energy and Avg Power Last Run
register units are mWh or cWh depending
on the setting of Des Energy Scale (1 or
10).
T Rise is also multiplied by Des Energy
Scale.
New feature
Reserve Capacity
register change
Reserve Capacity-mW label used.
Reserve Cap-m/cW label used because
units depend on setting of Des Energy
Scale.
New feature
User Rate register
change
User Rate-mW label used.
User Rate-m/cW label used because units
depend on setting of Des Energy Scale.
New feature
SLUA686 – September 2014
Submit Documentation Feedback
bq27510-G2 to bq27510-G3 Change List
Copyright © 2014, Texas Instruments Incorporated
1
Change Details
www.ti.com
Table 1. Change Details (continued)
Change
2
bq27510-G2
bq27510-G3
Comments
SOC Smoothing
SOC Smoothing feature not present.
SOC Smoothing added to facilitate smooth
transition of reported SOC during charge
and discharge.
Added register bits to new Operation
Configuration D register:
• [SMTHEN]
• [RCJUMPOK]
New feature
Fast Resistance
Scaling
Fast Resistance Scaling feature not
present.
Add Fast Resistance Scaling feature to
algorithm to improve accuracy of the
RemainingCapacity() calculations during
corner cases. This improvement is most
noticeable for high discharge rates (> C/2)
and low temperature as 0% is approached.
Added Fast Scale Start SOC register.
New feature
Change in Delta
Voltage Algorithm
Agnostic to load type.
Enhance Delta Voltage determination for
various system load conditions. Improve
gauging accuracy under spiky load
conditions.
New feature
Voltage Consistency Voltage Consistency feature not present.
Add Voltage Consistency feature to
algorithm to improve accuracy of
calculations during corner cases. This
improvement is most noticeable for low
temperatures as 0% is approached.
Added data flash register bit:
VconsEN in Pack Configuration B
New feature
SystemDown Set
Feature not present.
Added data flash registers:
SysDown Set Volt Threshold,
SysDown Set Volt Time,
SysDown Clear Volt.
New feature
Terminate Voltage
Valid Time
Feature not present.
Prevent SOC from jumping to 0% early
under spiky load conditions.
Added data flash register:
Terminate Valid Time
New feature
Battery insertion
detect
Feature not present.
Added data flash register bit:
New feature
[BIE] in Operation Configuration B and
BAT_INSERT and BAT_REMOVE Control( )
subcommands.
Remove maximum
load simulation
MaxLoadTimeToEmpty( ) standard
command and data flash register Initial
MaxLoad present.
Feature not available.
Feature removal
Change the SOC1
Feature uses mAh units.
and SOCF to %SOC
threshold values
Feature uses % unit
Feature change
Maximum and
minimum resolution
factors
Feature not present.
Improved the impedance update
performance.
Added data flash registers:
Max Res Factor and Min Res Factor.
New feature
Maximum and
minimum simulation
rates
Feature not present.
Improve the algorithm performance in very
heavy or very light load.
Added data flash registers:
Max Sim Rate and Min Sim Rate.
New feature
Qmax update
condition
Feature not present.
User can change the Qmax update
condition.
Added data flash registers:
Min % Passed Chg for Qm, Qmax Filter,
and Max % Default Qmax.
New feature
Manufacturer Info
Block reduce
Manufacturer Info Block was 64 bytes.
Reduced size of Manufacturer Info Block
from 64 to 32 bytes
Feature change
bq27510-G2 to bq27510-G3 Change List
SLUA686 – September 2014
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Copyright © 2014, Texas Instruments Incorporated
Change Details
www.ti.com
Table 1. Change Details (continued)
Change
bq27510-G2
bq27510-G3
Comments
Calibration Mode
Changed.
Calibration algorithm performed by gauge. Calibration restructured so that bq27510-G3 Feature change
external PC software now performs most
computations for data flash Calibration class
parameters. This change was needed to free
up firmware code space for the other
algorithm improvements.
Improved
Overcharge
Handling
Possibility to get into overcharge condition
due to change in temperature after
charge termination or more accumulated
charge after charge termination.
DODatEOC is updated after charge
termination and not updated if a significant
temperature change occurs after charge
termination. Charge accumulation after
charge termination is tracked for a more
accurate calculation of DOD0.
Added data flash register bit:
[CHGDODEOC] in Operation
Configuration D.
Additional SOC_INT
configuration
flexibility
Some SOC_INT trigger events could not
be individually enabled or disabled.
Operation Configuration D register did
not exist.
New data flash register Operation
New feature
Configuration D contains configuration bits
to enable and disable individual SOC_INT
trigger events with more flexibility. This
includes separate enable and disable bits for
over-temperature interrupts, algorithm state
change interrupts, and data flash update
interrupts.
New configuration
registers
Pack Configuration C, Pack
Configuration D, and Pack
Configuration E data flash registers did
not exist.
Pack Configuration C, Pack Configuration New feature
D, and Pack Configuration E data flash
registers added for additional options.
New feature
Larger thresholds for SOC1 Set Threshold and SOC1 Clear
low battery warning Threshold are each 1 byte in size.
SOC1 Set Threshold and SOC1 Clear
Threshold are each 2 bytes in size to
support needs of larger capacity battery
packs.
Feature change
State Of Health
feature
Feature not available.
State Of Health added to indicate the health
of battery
Added SOH LoadI register and
StateOfCharge( ) standard command.
New feature
Wake from
HIBERNATE
Can possibly wake from HIBERNATE
upon rising edge of I2C bus.
Device will only wake from HIBERNATE if
I2C traffic is addressed to the fuel gauge.
Bug fix
Standard Command
removal
TimeToFull( ), MaxLoadCurrent( ),
MaxLoadTimeToEmpty( ),
AvailableEnergy( ), AveragePower( ), and
TTEatConstantPower( ) commands
present.
TimeToFull( ), MaxLoadCurrent( ),
Feature removal
MaxLoadTimeToEmpty( ),
AvailableEnergy( ), AveragePower( ), and
TTEatConstantPower( ) commands removed
to recover code space for new features.
Standard Command
updated
StateOfHealth( ), InstantaneousCurrent( ), Added StateOfHealth( ),
InternalTemperature( ),
InstantaneousCurrent( ),
ResistanceScale( ), and
InternalTemperature( ), ResistanceScale( ),
DesignCapacity( ) commands not
and DesignCapacity( ) commands.
available.
New feature
Standard Command
StandbyCurrent( ),
StandbyTimeToEmpty( ), CycleCount( ),
StateOfCharge( ) command addresses
are 0x1A and 0x1B, 0x1C and 0x1D,
0x2A and 0x2B, 0x2C and 0x2D,
respectively.
StandbyCurrent( ), StandbyTimeToEmpty( ),
CycleCount( ), StateOfCharge( ) command
addresses are 0x18 and 0x19, 0x1A and
0x1B, 0x1E and 0x1F, 0x20 and 0x21,
respectively.
Feature change
Subcommand
Update
HW_VERSION, DF_CHECKSUM,
BOARD_OFFSET, and CAL_MODE
Control( ) subcommands present.
HW_VERSION, DF_CHECKSUM,
BOARD_OFFSET, and CAL_MODE
Control( ) subcommands removed.
Added BAT_INSERT and BAT_REMOVE
Control( ) subcommands.
Feature change
SLUA686 – September 2014
Submit Documentation Feedback
bq27510-G2 to bq27510-G3 Change List
Copyright © 2014, Texas Instruments Incorporated
3
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