Texas Instruments | TMS320C6655 and TMS320C6657 Fixed and Floating-Point Digital Signal Processor (Rev. D) | Datasheet | Texas Instruments TMS320C6655 and TMS320C6657 Fixed and Floating-Point Digital Signal Processor (Rev. D) Datasheet

Texas Instruments TMS320C6655 and TMS320C6657 Fixed and Floating-Point Digital Signal Processor (Rev. D) Datasheet
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TMS320C6655, TMS320C6657
SPRS814D – MARCH 2012 – REVISED OCTOBER 2019
TMS320C6655 and TMS320C6657 Fixed and Floating-Point Digital Signal Processor
1 Device Overview
1.1
Features
1
• One (C6655) or Two (C6657) TMS320C66x™
DSP Core Subsystems (CorePacs), Each With
– 850 MHz (C6657 only), 1.0 GHz, or 1.25 GHz
C66x Fixed- and Floating-Point CPU Core
– 40 GMAC per Core for Fixed Point @ 1.25
GHz
– 20 GFLOP per Core for Floating Point @
1.25 GHz
• Multicore Shared Memory Controller (MSMC)
– 1024KB MSM SRAM Memory
(Shared by Two DSP C66x CorePacs for
C6657)
– Memory Protection Unit for Both MSM SRAM
and DDR3_EMIF
• Multicore Navigator
– 8192 Multipurpose Hardware Queues with
Queue Manager
– Packet-Based DMA for Zero-Overhead
Transfers
• Hardware Accelerators
– Two Viterbi Coprocessors
– One Turbo Coprocessor Decoder
• Peripherals
– Four Lanes of SRIO 2.1
– 1.24, 2.5, 3.125, and 5 GBaud Operation
Supported Per Lane
– Supports Direct I/O, Message Passing
– Supports Four 1×, Two 2×, One 4×, and Two
1× + One 2× Link Configurations
– PCIe Gen2
– Single Port Supporting 1 or 2 Lanes
1.2
•
•
•
Applications
Power Protection Systems
Avionics and Defense
Currency Inspection and Machine Vision
1.3
– Supports up to 5 GBaud Per Lane
– HyperLink
– Supports Connections to Other KeyStone
Architecture Devices Providing Resource
Scalability
– Supports up to 40 Gbaud
– Gigabit Ethernet (GbE) Subsystem
– One SGMII Port
– Supports 10-, 100-, and 1000-Mbps
Operation
– 32-Bit DDR3 Interface
– DDR3-1333
– 4GB of Addressable Memory Space
– 16-Bit EMIF
– Universal Parallel Port
– Two Channels of 8 Bits or 16 Bits Each
– Supports SDR and DDR Transfers
– Two UART Interfaces
– Two Multichannel Buffered Serial Ports
(McBSPs)
– I2C Interface
– 32 GPIO Pins
– SPI Interface
– Semaphore Module
– Up to Eight 64-Bit Timers
– Two On-Chip PLLs
• Commercial Temperature:
– 0°C to 85°C
• Extended Temperature:
– –40°C to 100°C
•
•
•
Medical Imaging
Other Embedded Systems
Industrial Transportation Systems
Description
The C665x are high performance fixed- and floating-point DSPs that are based on TI's KeyStone multicore
architecture. Incorporating the new and innovative C66x DSP core, this device can run at a core speed of
up to 1.25 GHz. For developers of a broad range of applications, both C665x DSPs enable a platform that
is power-efficient and easy to use. In addition, the C665x DSPs are fully backward compatible with all
existing C6000™ family of fixed- and floating-point DSPs.
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TMS320C6655, TMS320C6657
SPRS814D – MARCH 2012 – REVISED OCTOBER 2019
www.ti.com
TI's KeyStone architecture provides a programmable platform integrating various subsystems (C66x cores,
memory subsystem, peripherals, and accelerators) and uses several innovative components and
techniques to maximize intradevice and interdevice communication that lets the various DSP resources
operate efficiently and seamlessly. Central to this architecture are key components such as Multicore
Navigator that allows for efficient data management between the various device components. The TeraNet
is a nonblocking switch fabric enabling fast and contention-free internal data movement. The multicore
shared memory controller allows access to shared and external memory directly without drawing from
switch fabric capacity.
For fixed-point use, the C66x core has 4× the multiply accumulate (MAC) capability of C64x+ cores. In
addition, the C66x core integrates floating-point capability and the per-core raw computational
performance is an industry-leading 40 GMACS per core and 20 GFLOPS per core (@1.25 GHz operating
frequency). The C66x core can execute 8 single precision floating-point MAC operations per cycle and
can perform double- and mixed-precision operations and is IEEE 754 compliant. The C66x core
incorporates 90 new instructions (compared to the C64x+ core) targeted for floating-point and vector math
oriented processing. These enhancements yield sizeable performance improvements in popular DSP
kernels used in signal processing, mathematical, and image acquisition functions. The C66x core is
backward code-compatible with TI's previous generation C6000 fixed- and floating-point DSP cores,
ensuring software portability and shortened software development cycles for applications migrating to
faster hardware.
The C665x DSP integrates a large amount of on-chip memory. In addition to 32KB of L1 program and
data cache, 1024KB of dedicated memory can be configured as mapped RAM or cache. The device also
integrates 1024KB of Multicore Shared Memory that can be used as a shared L2 SRAM and/or shared L3
SRAM. All L2 memories incorporate error detection and error correction. For fast access to external
memory, this device includes a 32-bit DDR-3 external memory interface (EMIF) running at a rate of 1333
MHz and has ECC DRAM support.
This family supports a number of high-speed standard interfaces including RapidIO ver 2, PCI Express
Gen2, and Gigabit Ethernet. This family of DSPs also includes I2C, UART, Multichannel Buffered Serial
Port (McBSP), Universal Parallel Port (uPP), and a 16-bit asynchronous EMIF, along with general-purpose
CMOS IO. For high throughput, low latency communication between devices or with an FPGA, a 40Gbaud full-duplex interface called HyperLink is included.
The C665x devices have a complete set of development tools, which includes: an enhanced C compiler,
an assembly optimizer to simplify programming and scheduling, and a Windows® debugger interface for
visibility into source code execution.
TI’s KeyStone Multicore Architecture provides a high performance structure for integrating RISC and DSP
cores with application-specific coprocessors and I/O. The KeyStone architecture is the first of its kind that
provides adequate internal bandwidth for nonblocking access to all processing cores, peripherals,
coprocessors, and I/O. This internal bandwidth is achieved with four main hardware elements: Multicore
Navigator, TeraNet, Multicore Shared Memory Controller, and HyperLink.
Multicore Navigator is an innovative packet-based manager that controls 8192 queues. When tasks are
allocated to the queues, Multicore Navigator provides hardware-accelerated dispatch that directs tasks to
the appropriate available hardware. The packet-based system on a chip (SoC) uses the two Tbps capacity
of the TeraNet switched central resource to move packets. The Multicore Shared Memory Controller lets
processing cores access shared memory directly without drawing from the capacity of TeraNet, so packet
movement cannot be blocked by memory access.
HyperLink provides a 40-Gbaud chip-level interconnect that lets SoCs work in tandem. The low-protocol
overhead and high throughput of HyperLink make an ideal interface for chip-to-chip interconnections.
Working with Multicore Navigator, HyperLink dispatches tasks to tandem devices transparently and
executes tasks as if they are running on local resources.
2
Device Overview
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SPRS814D – MARCH 2012 – REVISED OCTOBER 2019
Device Information (1)
PART NUMBER
TMS320C6655
TMS320C6657
(1)
PACKAGE
BODY SIZE
GZH (625)
21 mm × 21 mm
CZH (625)
21 mm × 21 mm
GZH (625)
21 mm × 21 mm
CZH (625)
21 mm × 21 mm
For more information, see Section 11, Mechanical Packaging and Orderable Information.
Copyright © 2012–2019, Texas Instruments Incorporated
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Device Overview
3
TMS320C6655, TMS320C6657
SPRS814D – MARCH 2012 – REVISED OCTOBER 2019
1.4
www.ti.com
Functional Block Diagram
Figure 1-1 shows the functional block diagrams of the device.
TCI6655/57
Memory Subsystem
1MB
MSM
SRAM
32-Bit
DDR3 EMIF
MSMC
Debug and Trace
Boot ROM
2nd core, C6657 only
Semaphore
C66x
CorePac
Timers
Coprocessors
Power
Management
32KB L1
P-Cache
PLL
32KB L1
D-Cache
TCP3d
1024KB L2 Cache
´2
VCP2
EDMA
1 or 2 Cores @ up to 1.25 GHz
´2
TeraNet
HyperLink
Multicore Navigator
SRIO ´4
PCIe ´2
McBSP ´2
SPI
UART ´2
I2C
UPP
GPIO
EMIF16
Queue
Manager
Packet
DMA
Ethernet
MAC
SGMII
Copyright © 2016, Texas Instruments Incorporated
Figure 1-1. Functional Block Diagram
4
Device Overview
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SPRS814D – MARCH 2012 – REVISED OCTOBER 2019
Table of Contents
1
2
3
Device Overview ......................................... 1
6.19
Multichannel Buffered Serial Port (McBSP)........ 156
1.1
Features .............................................. 1
6.20
Universal Parallel Port (uPP)
1.2
Applications ........................................... 1
6.21
Serial RapidIO (SRIO) Port ........................ 158
1.3
Description ............................................ 1
6.22
Turbo Decoder Coprocessor (TCP3d) ............. 159
1.4
Functional Block Diagram ............................ 4
6.23
Enhanced Viterbi-Decoder Coprocessor (VCP2) .. 159
Revision History ........................................ 6
Device Comparison ..................................... 7
6.24
Emulation Features and Capability ................ 159
6.25
DSP Core Description
Device Comparison................................... 7
6.26
Memory Map Summary ............................ 163
3.1
4
Terminal Configuration and Functions .............. 8
.......................................... 8
4.2
Terminal Functions .................................. 13
Specifications ........................................... 36
5.1
Absolute Maximum Ratings ......................... 36
5.2
ESD Ratings ........................................ 36
5.3
Recommended Operating Conditions ............... 37
5.4
Power Consumption Summary...................... 37
5.5
Electrical Characteristics ............................ 38
4.1
5
6
Pin Diagram
5.6
Thermal Resistance Characteristics for [CZH/GZH]
Package ............................................. 38
5.7
Timing and Switching Characteristics ............... 39
Detailed Description ................................... 67
6.1
Recommended Clock and Control Signal Transition
Behavior ............................................. 67
6.2
Power Supplies
6.3
6.4
6.5
6.6
6.7
6.8
.....................................
Power Supply to Peripheral I/O Mapping ...........
Power Sleep Controller (PSC) ......................
Reset Controller .....................................
Main PLL and PLL Controller .......................
DDR3 PLL ...........................................
68
75
83
Interrupts ........................................... 103
6.10
Memory Protection Unit (MPU)
6.12
6.13
6.14
6.15
6.16
6.17
6.18
9
79
6.9
6.11
8
67
97
Enhanced Direct Memory Access (EDMA3)
Controller ............................................ 99
....................
DDR3 Memory Controller ..........................
I2C Peripheral ......................................
HyperLink Peripheral...............................
PCIe Peripheral ....................................
Ethernet Media Access Controller (EMAC) .......
Management Data Input/Output (MDIO) ...........
Timers ..............................................
Semaphore2 .......................................
7
127
142
143
145
147
148
154
155
155
10
......................
.............................
....................................
.........
6.29 PLL Boot Configuration Settings...................
6.30 Second-Level Bootloaders .........................
C66x CorePac..........................................
7.1
Memory Architecture ...............................
7.2
Memory Protection .................................
7.3
Bandwidth Management ...........................
7.4
Power-Down Control ...............................
7.5
C66x CorePac Revision ...........................
7.6
C66x CorePac Register Descriptions ..............
Device Configuration.................................
8.1
Device Configuration at Device Reset .............
8.2
Peripheral Selection After Device Reset...........
8.3
Device State Control Registers ....................
8.4
Pullup and Pulldown Resistors ....................
System Interconnect .................................
9.1
Internal Buses and Switch Fabrics ................
9.2
Switch Fabric Connections Matrix .................
9.3
TeraNet Switch Fabric Connections ...............
9.4
Bus Priorities .......................................
Device and Documentation Support ..............
10.1 Device Nomenclature ..............................
10.2 Tools and Software ................................
10.3 Documentation Support ............................
10.4 Related Links ......................................
10.5 Support Resources ................................
10.6 Trademarks ........................................
10.7 Electrostatic Discharge Caution ...................
10.8 Glossary............................................
157
160
6.27
Boot Sequence
167
6.28
Boot Modes Supported and PLL Settings
168
192
192
193
194
197
198
198
199
199
200
200
201
201
228
229
229
229
232
235
237
237
238
239
240
240
240
240
240
11 Mechanical Packaging and Orderable
Information ............................................. 241
11.1
Packaging Information ............................. 241
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Table of Contents
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www.ti.com
2 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from May 30, 2016 to October 31, 2019
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
6
Page
Section 1.1 (Features): Updated/Changed Addressable Memory Space from "8" to "4" GB ............................... 1
Section 1.1: Added "Up to" to the Eight 64-Bit Timers bullet ................................................................... 1
Figure 4-3 (Upper Left Quadrant — A): Updated/Changed the pin function name on ball AD13 from "RSV28" to
"SGMIICLKP" .......................................................................................................................... 9
Figure 4-4 (Upper Right Quadrant — B): Updated/Changed the pin function names on balls AE14, AD20, W21,
and V21 ............................................................................................................................... 10
Table 5-25 (McBSP Switching Characteristics): Added associated "CLKRP = CLKXP = FSRP = FSXP = 0 ..."
footnote ............................................................................................................................... 60
Section 6.19 (Multichannel Buffered Serial Port (McBSP)): Added new paragraph on GPIO option not supported 156
Table 6-63 (Memory Map Summary): Updated/Changed the LOGICAL and PHYSICAL ending address locations
from "0C1FFFFF" to "0C0FFFFF" ............................................................................................... 165
Table 6-63: Updated/Changed the extended DDR3 memory space access specified in the footnote from "8" to
"4" GB ............................................................................................................................... 167
Table 6-68 (EMIF16 Boot Configuration Field Descriptions): Added "(Default)" to the 0 = CS2 option of the Chip
Select field ......................................................................................................................... 172
Table 6-68: Added a Note to the Chip Select Description.................................................................... 172
Table 6-74 (I2C Master Mode Device Configuration Field Descriptions): Updated/Changed the Parameter Index
field value range from "0 to 31" to "0 to 63" in the Description .............................................................. 177
Table 6-76 (SPI Device Configuration Field Descriptions): Updated/Changed the Description for the Chip Select
field .................................................................................................................................. 179
Table 6-76: Updated/Changed the Description for the Parameter Table Index field ..................................... 179
Table 6-78 (Boot Parameter Table Common Values): Added additional text to Description of the Checksum field . 181
Section 7.1.4 (MSM SRAM): Updated/Changed the extension of external addresses bullet from "... up to 8GB"
to "... up to 4GB" ................................................................................................................... 197
Table 8-1 (C665x Device Configuration Pins): Updated/Changed the BOOTMODE[12:0] PIN NO. from "R3" to
"R23" ................................................................................................................................ 200
Figure 8-1 (Device Status Register): Added associated Legend footnote reference to "x" definition .................. 205
Revision History
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3 Device Comparison
3.1
Device Comparison
Table 3-1. Characteristics of the C665x Processor
HARDWARE FEATURES
TMS320C6655
DDR3 Memory Controller (32-bit bus width) [1.5 V I/O]
(clock source = DDRREFCLKN|P)
1
DDR3 Maximum Data Rate
Peripheral
1333
EDMA3 (64 independent channels) [DSP/3 clock rate]
1
High-speed 1×/2×/4× Serial RapidIO Port (four lanes)
1
PCIe (two lanes)
1
10/100/1000 Ethernet
1
Management Data Input/Output (MDIO)
1
HyperLink
1
EMIF16
1
McBSP
2
SPI
1
UART
2
uPP
1
2
I C
1
64-Bit Timers (configurable) (internal clock source =
CPU/6 clock frequency)
Encoder/Decoder
Coprocessors
8 (each configurable as two 32-bit timers)
General-Purpose Input/Output port (GPIO)
32
VCP2 (clock source = CPU/3 clock frequency)
2
TCP3d (clock source = CPU/2 clock frequency)
CorePac Memory
On-Chip Memory
1
32KB L1 Program Memory [SRAM/Cache]
32KB L1 Data Memory [SRAM/Cache]
1024KB L2 Unified Memory/Cache
ROM Memory
128KB L3 ROM
Multicore Shared Memory
C66x CorePac
Revision ID
CorePac Revision ID Register
(address location: 0181 2000h)
JTAG BSDL_ID
JTAGID register (address location: 0262 0018h)
Frequency
MHz
Cycle Time
ns
See Section 7.5.
See Section 8.3.3.
0.8 (1.25 GHz)
–40ºC to 100ºC
Core (V)
–40ºC to 100ºC
SmartReflex™ variable supply
I/O (V)
1.0 V, 1.5 V, and 1.8 V
Process Technology
µm
BGA Package
21 mm × 21 mm, 0.80 mm pitch
Product Status (1)
Production Data (PD)
(1)
1024KB MSM SRAM
1250 (1.25 GHz)
Extended Case Temp
Voltage
TMS320C6657
0.040 µm
625-Pin Flip-Chip Plastic BGA (CZH or GZH)
PD
PD
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
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Device Comparison
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4 Terminal Configuration and Functions
4.1
Pin Diagram
Figure 4-1 shows the C665x CZH and GZH ball grid area (BGA) packages (bottom view).
AE
AD
AC
AB
AA
Y
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
3
1
2
5
4
9
7
6
8
11 13 15 17 19 21 23 25
10 12 14 16 18 20 22 24
Figure 4-1. CZH and GZH 625-Pin BGA Package (Bottom View)
Figure 4-2 shows pin quadrants and Figure 4-3, Figure 4-4, Figure 4-5, and Figure 4-6 show the C665x
pin assignments in four quadrants (A, B, C, and D).
A
B
D
C
Figure 4-2. Pin Map Quadrants (Bottom View)
8
Terminal Configuration and Functions
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1
2
3
4
AE
VSS
SGMII0
RXN
SGMII0
RXP
AD
VSS
VSS
VSS
AC
VSS
SGMII0
TXN
SGMII0
TXP
AB
EMIFD14
VSS
RSV19
AA
EMIFD13
EMIFD15
VDDR3
VSS
Y
EMIFD09
EMIFD11
DVDD18
W
EMIFD06
EMIFD08
V
EMIFD02
U
VSS
5
RIORXN2 RIORXP2
RIORXN3 RIORXP3
VSS
6
RIOTXN2
VSS
7
VSS
8
9
RIORXP0 RIORXN0
RIORXP1 RIORXN1
VSS
10
VSS
VSS
RIOTXP0
RIOTXN0
VSS
V SS
RIOTXN1
RIOTXP1
VSS
VDDR4
VSS
RSV17
VSS
VDDR2
VSS
RSV13
RSV12
VSS
VDDT2
VSS
VDDT2
VSS
EMIFD10
EMIFD12
DVDD18
VSS
VDDT2
EMIFD03
EMIFD04
EMIFD05
EMIFD07
VSS
DVDD18
EMIFA21
EMIFA22
EMIFA23
EMIFD00
EMIFD01
DVDD18
T
EMIFA19
VSS
DVDD18
EMIFA18
EMIFA20
R
EMIFA17
EMIFA16
EMIFA14
EMIFA15
P
EMIFA12
EMIFA11
EMIFA09
N
EMIFA10
EMIFA08
DVDD18
12
PCIERXP0 PCIERXN0
PCIERXN1 PCIERXP1
RIOTXP2
RIOTXN3 RIOTXP3
11
VSS
PCIETXP0 PCIETXN0
PCIETXP1 PCIETXN1
13
VSS
SGMII
CLKP
VSS
VSS
SPIDOUT
RSV18
SPISCS0
SPICLK
VSS
VDDT2
VSS
DVDD18
VSS
VDDT2
VSS
VDDT2
VSS
VSS
CVDD
VSS
CVDD
VSS
CVDD
VSS
CVDD1
VSS
CVDD
VSS
CVDD
VSS
VSS
DVDD18
VSS
CVDD1
VSS
CVDD
VSS
CVDD
EMIFA13
DVDD18
VSS
VSS
VSS
CVDD
VSS
CVDD
VSS
EMIFA05
EMIFA03
VSS
DVDD18
VSS
CVDD
VSS
CVDD
VSS
CVDD
VSS
EMIF
WAIT0
DVDD18
VSS
CVDD
VSS
CVDD
VSS
CVDD
VSS
A
Figure 4-3. Upper Left Quadrant — A (Bottom View)
Terminal Configuration and Functions
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14
SGMII
CLKN
15
16
PCIECLKN UARTCTS1
PCIECLKP UARTRTS1
VSS
UARTRXD1 UARTTXD1 DVDD18
www.ti.com
17
18
19
20
21
22
23
24
25
TDI
TMS
CORECLKN
TIMO1
TIMI1
DX1
FSX1
CLKX1
VSS
AE
TCK
CORECLKP
TDO
PCIESSEN
DR1
FSR1
CLKR1
FSR0
EMU16
AD
UARTCTS
RSV04
TIMO0
DVDD18
CLKS1
DX0
CLKS0
EMU17
EMU13
AC
RSV05
TRST
VSS
DR0
EMU15
DVDD18
VSS
EMU12
AB
SPIDIN
UARTRXD
MDIO
UARTRTS
SPISCS1
UARTTXD
MDCLK
SCL
SDA
SYSCLK
OUT
FSX0
CLKR0
RSV01
EMU14
EMU10
EMU11
AA
VSS
AVDDA1
VSS
DVDD18
POR
RSV08
CLKX0
EMU18
EMU09
EMU07
EMU06
EMU05
Y
DVDD18
VSS
DVDD18
VSS
DVDD18
VSS
DVDD18
PCIESS
MODE0
EMU08
EMU03
EMU04
EMU02
W
VSS
CVDD
VSS
CVDD
VSS
DVDD18
VSS
PCIESS
MODE1
GPIO13
GPIO10
EMU00
EMU01
V
CVDD
VSS
CVDD
VSS
CVDD1
VSS
DVDD18
GPIO11
GPIO08
GPIO09
GPIO05
GPIO03
U
VSS
CVDD
VSS
CVDD1
VSS
DVDD18
VSS
GPIO12
GPIO06
GPIO04
DVDD18
GPIO00
T
CVDD
VSS
CVDD
VSS
CVDD
VSS
DVDD18
GPIO07
VSS
GPIO02
VSS
GPIO01
R
VSS
CVDD
VSS
CVDD
VSS
CVDD
VSS
VSS
MCMTXN0
VSS
MCMRXN0
VSS
P
CVDD
VSS
CVDD
VSS
CVDD
VSS
VDDT1
MCMTXN1 MCMTXP0
VSS
MCMRXP0 MCMRXP1
N
B
Figure 4-4. Upper Right Quadrant—B (Bottom View)
10
Terminal Configuration and Functions
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C
VSS
CVDD
VSS
CVDD
VSS
VDDT1
VDDR1
MCM
TXP1
VSS
VSS
VSS
MCMRXN1
M
CVDD
VSS
CVDD
VSS
CVDD
VSS
VDDT1
VSS
MCMTXP2
VSS
MCMRXP3
VSS
L
VSS
CVDD
VSS
CVDD1
VSS
VDDT1
VSS
MCMTXP3 MCMTXN2
VSS
MCMRXN3 MCMRXP2
CVDD
VSS
CVDD
VSS
CVDD1
VSS
RSV16
MCMTXN3
VSS
VSS
VSS
MCMRXN2
J
VSS
CVDD
VSS
CVDD
VSS
DVDD18
VSS
VSS
RSV11
VSS
DVDD18
VSS
H
DVDD15
VSS
DVDD15
VSS
DVDD15
RSV0 A
RSV0B
RSV15
RSV10
VCNTL3
MCMTX
PMDAT
MCMREF
CLKOUTP
G
VSS
PTV15
VSS
DVDD15
VSS
DVDD15
AVDDA2
RSV14
RSV20
VCNTL2
MCMTX
PMCLK
MCMREF
CLKOUTN
F
DDRODT0
DDRA03
DDRA02
DDRA15
DDRA14
DDRA10
DDRA09
DVDD18
VCNTL0
VCNTL1
MCMRX
PMCLK
MCMTX
FLCLK
E
DDRCAS
DVDD15
DDRA00
DDRBA1
DDRA12
DVDD15
DDRA08
VSS
DDRSL
RATE1
RSV21
MCMRX
PMDAT
MCMTX
FLDAT
D
DDRCE1
VSS
DDRA06
DVDD15
DDRBA0
VSS
DDRA13
DVDD15
DDRSL
RATE0
RSV09
MCMRX
FLDAT
MCMCLKP
C
VSS
DDRA04
DDRBA2
DDRA11
DDRCLK
OUTN1
DDRCLKN
RSV06
MCMRX
FLCLK
MCMCLKN
B
A
DDRCLK
OUTN0
DDRCE0 DDRRESET
DDRCLK
OUTP0
DDRRAS
DDRCKE0
DDRA05
DDRA07
DDRA01
DDRCKE1
DDRCLK
OUTP1
DDRCLKP
RSV07
DVDD18
VSS
14
15
16
17
18
19
20
21
22
23
24
25
K
Figure 4-5. Lower Right Quadrant—C (Bottom View)
Terminal Configuration and Functions
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D
M
L
EMIFA07
EMIFA04
EMIFA06
EMIFA01 EMIFWAIT1 EMIFCE3
EMIFA02
EMIFBE1
EMIFOE
DVDD18
EMIFWE
K
EMIFA00
VSS
J
EMIFBE0
EMIFCE2
H
NMI
RSV03
G
EMIFCE1
HOUT
DVDD18
F
LRESET
NMIEN
DDRD25
VSS
E
DDRDQM3 DDRD24
VSS
DVDD18
VSS
CVDD
VSS
CVDD
VSS
CVDD
EMIF
RNW
DVDD18
VSS
CVDD
VSS
CVDD
VSS
CVDD
VSS
EMIFCE0
VSS
DVDD18
VSS
CVDD1
VSS
CVDD
VSS
VSS
CVDD1
VSS
CVDD
VSS
CVDD
VSS
DVDD18
VSS
CVDD
VSS
VSS
CVDD
VSS
DVDD15
VSS
DVDD15
VSS
DVDD15
VSS
VSS
DVDD15
VSS
DVDD15
VSS
DVDD15
VSS
DVDD15
VSS
RSV02 RESETFULLCORESEL0 DVDD18
BOOT
COMPLETE RESET
RESET
STAT
VSS
LRESET CORESEL1 DVDD18
DDRD18 DDRDQM2
DDRD31
DDRD19
DDRD16
DDRD08
DDR
DQM1
DDRD09
DDRD04
DDRD05
CVDD
CVDD
VREFSSTL DDRWE
D
DDRD28
DVDD15
DDRD29
DVDD15
DDRD23
DDRD12
DDRD14
DVDD15
DDRD02
DDR
DQS0P
DDRCB00 DDRODT1 DVDD15
C
DDRD27
VSS
DDRD30
VSS
DDRD22
DVDD15
DDRD13
VSS
DDRD01
DDR
DQS0N
DDRCB02 DDRDQM8
B
DDRD26
DDR
DQS3N
DDRD17
DDR
DQS2P
DDRD21
VSS
DDR
DQS1P
DDRD15
DDRD03
DVDD15
DDRD07
DDRCB01
DDR
DQS8P
A
VSS
DDR
DQS3P
DDRD20
DDR
DQS2N
DDRD11
DDRD10
DDR
DQS1N
DDR
DQM0
DDRD00
VSS
DDRD06
DDRCB03
DDR
DQS8N
1
2
3
4
5
6
7
8
9
10
11
12
13
VSS
Figure 4-6. Lower Left Quadrant—D (Bottom View)
12
Terminal Configuration and Functions
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4.2
SPRS814D – MARCH 2012 – REVISED OCTOBER 2019
Terminal Functions
The terminal functions table (Table 4-2) identifies the external signal names, the associated pin (ball)
numbers, the pin type (I, OZ, or IOZ), whether the pin has any internal pullup or pulldown resistors, and
gives functional pin descriptions. Table 4-2 is arranged by function. The power terminal functions table
(Table 4-3) lists the various power supply pins and ground pins and gives functional pin descriptions.
Table 4-4 shows all pins arranged by signal name. Table 4-5 shows all pins arranged by ball number.
Seventy-three pins have a secondary function as well as a primary function. The secondary function is
indicated with a dagger (†). One pin has a tertiary function as well as primary and secondary functions.
The tertiary function is indicated with a double dagger (‡).
For more detailed information on device configuration, peripheral selection, multiplexed/shared pins, and
pullup or pulldown resistors, see Section 8.4.
Use the symbol definitions in Table 4-1 when reading Table 4-2.
Table 4-1. I/O Functional Symbol Definitions
FUNCTIONAL
SYMBOL
DEFINITION
Table 4-2
COLUMN HEADING
IPD or IPU
Internal 100-µA pulldown or pullup is provided for this terminal. In most systems, a 1-kΩ
resistor can be used to oppose the IPD/IPU. For more detailed information on pulldown/pullup
resistors and situations in which external pulldown/pullup resistors are required, see Hardware
Design Guide for KeyStone Devices.
IPD/IPU
A
Analog signal
TYPE
Ground
TYPE
I
Input terminal
TYPE
O
Output terminal
TYPE
S
Supply voltage
TYPE
Z
Tri-state terminal or high impedance
TYPE
GND
Terminal Configuration and Functions
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Table 4-2. Terminal Functions — Signals and Control by Function
SIGNAL NAME
BALL
NO.
TYPE
IPD/IPU
DESCRIPTION
LENDIAN †
T25
IOZ
Up
Endian configuration pin (Pin shared with GPIO[0])
BOOTMODE00 †
R25
IOZ
Down
BOOTMODE01†
R23
IOZ
Down
BOOTMODE02 †
U25
IOZ
Down
BOOTMODE03 †
T23
IOZ
Down
BOOTMODE04 †
U24
IOZ
Down
BOOTMODE05 †
T22
IOZ
Down
BOOTMODE06 †
R21
IOZ
Down
BOOTMODE07 †
U22
IOZ
Down
BOOTMODE08 †
U23
IOZ
Down
BOOTMODE09 †
V23
IOZ
Down
BOOTMODE10 †
U21
IOZ
Down
BOOTMODE11 †
T21
IOZ
Down
BOOTMODE12 †
V22
IOZ
Down
PCIESSMODE0 †
W21
IOZ
Down
PCIESSMODE1 †
V21
IOZ
Down
PCIESSEN ‡
AD20
I
Down
Boot Configuration Pins
See Section 6.28 for more details
(Pins shared with GPIO[1:13])
PCIe Mode selection pins (Pins shared with GPIO[14:15])
PCIe module enable (Pin shared with TIMI0 and GPIO16)
Clock / Reset
CORECLKP
AD18
I
CORECLKN
AE19
I
SRIOSGMIICLKP
AD13
I
SRIOSGMIICLKN
AE14
I
DDRCLKP
A22
I
DDRCLKN
B22
I
PCIECLKP
AD14
I
PCIECLKN
AE15
I
MCMCLKP
C25
I
MCMCLKN
B25
I
AVDDA1
Y15
P
SYS_CLK PLL Power Supply Pin
AVDDA2
F20
P
DDR_CLK PLL Power Supply Pin
SYSCLKOUT
AA19
OZ
Down
System Clock Output to be used as a general purpose output clock for debug
purposes
HOUT
G2
OZ
Up
Interrupt output pulse created by IPCGRH
NMI
H1
I
Up
Nonmaskable Interrupt
LRESET
G4
I
Up
Warm Reset
LRESETNMIEN
F1
I
Up
Enable for core selects
CORESEL0
J5
I
Down
CORESEL1
G5
I
Down
RESETFULL
J4
I
Up
Full Reset
RESET
H4
I
Up
Warm Reset of non isolated portion on the IC
POR
Y18
I
RESETSTAT
H5
O
Up
Reset Status Output
BOOTCOMPLETE
H3
OZ
Down
Boot progress indication output
PTV15
14
F15
Core Clock Input to main PLL.
RapidIO/SGMII Reference Clock to drive the RapidIO and SGMII SerDes
DDR Reference Clock Input to DDR PLL
PCIe Clock Input to drive PCIe SerDes
HyperLink Reference Clock to drive the HyperLink SerDes
Select for the target core for LRESET and NMI. For more details see Table 5-8.
Power-on Reset
PTV Compensation NMOS Reference Input. A precision resistor placed between the
PTV15 pin and ground is used to closely tune the output impedance of the DDR
interface drivers to 50 Ω. Presently, the recommended value for this 1% resistor is
45.3 Ω.
A
Terminal Configuration and Functions
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SPRS814D – MARCH 2012 – REVISED OCTOBER 2019
Table 4-2. Terminal Functions — Signals and Control by Function (continued)
SIGNAL NAME
BALL
NO.
TYPE
DDRDQM0
A8
OZ
DDRDQM1
E7
OZ
DDRDQM2
F5
OZ
DDRDQM3
E1
OZ
DDRDQM8
C12
OZ
DDRDQS0P
D10
IOZ
DDRDQS0N
C10
IOZ
DDRDQS1P
B7
IOZ
DDRDQS1N
A7
IOZ
DDRDQS2P
B4
IOZ
DDRDQS2N
A4
IOZ
DDRDQS3P
A2
IOZ
DDRDQS3N
B2
IOZ
DDRDQS8P
B13
IOZ
DDRDQS8N
A13
IOZ
DDRCB00
D11
IOZ
DDRCB01
B12
IOZ
DDRCB02
C11
IOZ
DDRCB03
A12
IOZ
DDRD00
A9
IOZ
DDRD01
C9
IOZ
DDRD02
D9
IOZ
DDRD03
B9
IOZ
DDRD04
E9
IOZ
DDRD05
E10
IOZ
DDRD06
A11
IOZ
DDRD07
B11
IOZ
DDRD08
E6
IOZ
DDRD09
E8
IOZ
DDRD10
A6
IOZ
DDRD11
A5
IOZ
DDRD12
D6
IOZ
DDRD13
C7
IOZ
DDRD14
D7
IOZ
DDRD15
B8
IOZ
DDRD16
E5
IOZ
DDRD17
B3
IOZ
DDRD18
F4
IOZ
DDRD19
E4
IOZ
DDRD20
A3
IOZ
IPD/IPU
DESCRIPTION
DDR
DDR EMIF Data Masks
DDR EMIF Data Strobe
DDR EMIF Check Bits
DDR EMIF Data Bus
Terminal Configuration and Functions
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Table 4-2. Terminal Functions — Signals and Control by Function (continued)
SIGNAL NAME
BALL
NO.
TYPE
DDRD21
B5
IOZ
DDRD22
C5
IOZ
DDRD23
D5
IOZ
DDRD24
E2
IOZ
DDRD25
F2
IOZ
DDRD26
B1
IOZ
DDRD27
C1
IOZ
DDRD28
D1
IOZ
DDRD29
D3
IOZ
DDRD30
C3
IOZ
DDRD31
E3
IOZ
DDRCE0
B15
OZ
DDRCE1
C14
OZ
DDRBA0
C18
OZ
DDRBA1
D17
OZ
DDRBA2
B19
OZ
DDRA00
D16
OZ
DDRA01
A19
OZ
DDRA02
E16
OZ
DDRA03
E15
OZ
DDRA04
B18
OZ
DDRA05
A17
OZ
DDRA06
C16
OZ
DDRA07
A18
OZ
DDRA08
D20
OZ
DDRA09
E20
OZ
DDRA10
E19
OZ
DDRA11
B20
OZ
DDRA12
D18
OZ
DDRA13
C20
OZ
DDRA14
E18
OZ
DDRA15
E17
OZ
DDRCAS
D14
OZ
DDR EMIF Column Address Strobe
DDRRAS
A15
OZ
DDR EMIF Row Address Strobe
DDRWE
E13
OZ
DDR EMIF Write Enable
DDRCKE0
A16
OZ
DDR EMIF Clock Enable
DDRCKE1
A20
OZ
DDR EMIF Clock Enable
DDRCLKOUTP0
A14
OZ
DDRCLKOUTN0
B14
OZ
DDRCLKOUTP1
A21
OZ
DDRCLKOUTN1
B21
OZ
DDRODT0
E14
OZ
DDR EMIF On Die Termination Outputs used to set termination on the SDRAMs
DDRODT1
D12
OZ
DDR EMIF On Die Termination Outputs used to set termination on the SDRAMs
DDRRESET
B16
OZ
DDRSLRATE0
C22
I
Down
DDRSLRATE1
D22
I
Down
VREFSSTL
E12
P
16
IPD/IPU
DESCRIPTION
DDR EMIF Data Bus
DDR EMIF Data Bus
DDR EMIF Chip Enables
DDR EMIF Bank Address
DDR EMIF Address Bus
DDR EMIF Output Clocks to drive SDRAMs (one clock pair per SDRAM)
DDR Reset signal
DDR Slew rate control
Reference Voltage Input for SSTL15 buffers used by DDR EMIF (VDDS15 ÷ 2)
Terminal Configuration and Functions
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SPRS814D – MARCH 2012 – REVISED OCTOBER 2019
Table 4-2. Terminal Functions — Signals and Control by Function (continued)
SIGNAL NAME
BALL
NO.
TYPE
IPD/IPU
EMIFRW
L5
OZ
Up
EMIFCE0
K5
OZ
Up
EMIFCE1
G1
OZ
Up
EMIFCE2
J2
OZ
Up
EMIFCE3
M5
OZ
Up
EMIFOE
L4
OZ
Up
EMIFWE
K4
OZ
Up
EMIFBE0
J1
OZ
Up
EMIFBE1
L3
OZ
Up
EMIFWAIT0
N5
I
Down
EMIFWAIT1
M4
I
EMIFA00
K1
OZ
Down
EMIFA01
M3
OZ
Down
EMIFA02
L2
OZ
Down
EMIFA03
P5
OZ
Down
EMIFA04
L1
OZ
Down
EMIFA05
P4
OZ
Down
EMIFA06
M2
OZ
Down
EMIFA07
M1
OZ
Down
EMIFA08
N2
OZ
Down
EMIFA09
P3
OZ
Down
EMIFA10
N1
OZ
Down
EMIFA11
P2
OZ
Down
EMIFA12
P1
OZ
Down
EMIFA13
R5
OZ
Down
EMIFA14
R3
OZ
Down
EMIFA15
R4
OZ
Down
EMIFA16
R2
OZ
Down
EMIFA17
R1
OZ
Down
EMIFA18
T4
OZ
Down
EMIFA19
T1
OZ
Down
EMIFA20
T5
OZ
Down
EMIFA21
U1
OZ
Down
EMIFA22
U2
OZ
Down
EMIFA23
U3
OZ
Down
DESCRIPTION
EMIF16
Down
EMIF16 Control Signals
EMIF16 Control Signal
This EMIF16 pin has a secondary function assigned to it as mentioned elsewhere in
this table (see uPP).
EMIF16 Address
These EMIF16 pins have secondary functions assigned to them as mentioned
elsewhere in this table (see uPP).
Terminal Configuration and Functions
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Table 4-2. Terminal Functions — Signals and Control by Function (continued)
SIGNAL NAME
BALL
NO.
TYPE
IPD/IPU
EMIFD00
U4
IOZ
Down
EMIFD01
U5
IOZ
Down
EMIFD02
V1
IOZ
Down
EMIFD03
V2
IOZ
Down
EMIFD04
V3
IOZ
Down
EMIFD05
V4
IOZ
Down
EMIFD06
W1
IOZ
Down
EMIFD07
V5
IOZ
Down
EMIFD08
W2
IOZ
Down
EMIFD09
Y1
IOZ
Down
EMIFD10
W4
IOZ
Down
EMIFD11
Y2
IOZ
Down
EMIFD12
W5
IOZ
Down
EMIFD13
AA1
IOZ
Down
EMIFD14
AB1
IOZ
Down
EMIFD15
AA2
IOZ
Down
DESCRIPTION
EMIF16 Data
These EMIF16 pins have secondary functions assigned to them as mentioned
elsewhere in this table (see uPP).
uPP
Down
UPP_2XTXCLK †
M4
I
UPP_CH0_CLK †
R2
IOZ
UPP_CH0_START †
R1
IOZ
UPP_CH0_ENABLE † T4
IOZ
UPP_CH0_WAIT †
T1
IOZ
UPP_CH1_CLK †
T5
IOZ
UPP_CH1_START †
U1
IOZ
UPP_CH1_ENABLE † U2
IOZ
UPP_CH1_WAIT †
IOZ
This uPP pin has a primary function assigned to it as mentioned elsewhere in this
table (see EMIF16).
Down
uPP Channel 0 Start
This uPP pin has a primary function assigned to it as mentioned elsewhere in this
table (see EMIF16).
Down
uPP Channel 0 Enable
This uPP pin has a primary function assigned to it as mentioned elsewhere in this
table (see EMIF16).
Down
uPP Channel 0 Wait
This uPP pin has a primary function assigned to it as mentioned elsewhere in this
table (see EMIF16).
Down
uPP Channel 1 Clock
This uPP pin has a primary function assigned to it as mentioned elsewhere in this
table (see EMIF16).
Down
uPP Channel 1 Start
This uPP pin has a primary function assigned to it as mentioned elsewhere in this
table (see EMIF16).
Down
uPP Channel 1 Enable
This uPP pin has a primary function assigned to it as mentioned elsewhere in this
table (see EMIF16).
Down
18
uPP Channel 0 Clock
This uPP pin has a primary function assigned to it as mentioned elsewhere in this
table (see EMIF16).
Down
U3
uPP Transmit Reference Clock (2x Transmit Rate)
uPP Channel 1 Wait
This uPP pin has a primary function assigned to it as mentioned elsewhere in this
table (see EMIF16).
Terminal Configuration and Functions
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SPRS814D – MARCH 2012 – REVISED OCTOBER 2019
Table 4-2. Terminal Functions — Signals and Control by Function (continued)
SIGNAL NAME
BALL
NO.
TYPE
IPD/IPU
UPPD00 †
U4
IOZ
Down
UPPD01 †
U5
IOZ
Down
UPPD02 †
V1
IOZ
Down
UPPD03 †
V2
IOZ
Down
UPPD04 †
V3
IOZ
Down
UPPD05 †
V4
IOZ
Down
UPPD06 †
W1
IOZ
Down
UPPD07 †
V5
IOZ
Down
UPPD08 †
W2
IOZ
Down
UPPD09 †
Y1
IOZ
Down
UPPD10 †
W4
IOZ
Down
UPPD11 †
Y2
IOZ
Down
UPPD12 †
W5
IOZ
Down
UPPD13 †
AA1
IOZ
Down
UPPD14 †
AB1
IOZ
Down
UPPD15 †
AA2
IOZ
Down
UPPXD00 †
K1
IOZ
Down
UPPXD01 †
M3
IOZ
Down
UPPXD02 †
L2
IOZ
Down
UPPXD03 †
P5
IOZ
Down
UPPXD04 †
L1
IOZ
Down
UPPXD05 †
P4
IOZ
Down
UPPXD06 †
M2
IOZ
Down
UPPXD07 †
M1
IOZ
Down
UPPXD08 †
N2
IOZ
Down
UPPXD09 †
P3
IOZ
Down
UPPXD10 †
N1
IOZ
Down
UPPXD11 †
P2
IOZ
Down
UPPXD12 †
P1
IOZ
Down
UPPXD13 †
R5
IOZ
Down
UPPXD14 †
R3
IOZ
Down
UPPXD15 †
R4
IOZ
Down
DESCRIPTION
uPP Data
This uPP pin has a primary function assigned to it as mentioned elsewhere in this
table (see EMIF16).
uPP Extended Data
This uPP ppn has a primary function assigned to it as mentioned elsewhere in this
table (see EMIF16).
Terminal Configuration and Functions
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Table 4-2. Terminal Functions — Signals and Control by Function (continued)
SIGNAL NAME
BALL
NO.
TYPE
IPD/IPU
EMU00
V24
IOZ
Up
EMU01
V25
IOZ
Up
EMU02
W25
IOZ
Up
EMU03
W23
IOZ
Up
EMU04
W24
IOZ
Up
EMU05
Y25
IOZ
Up
EMU06
Y24
IOZ
Up
EMU07
Y23
IOZ
Up
EMU08
W22
IOZ
Up
EMU09
Y22
IOZ
Up
EMU10
AA24
IOZ
Up
EMU11
AA25
IOZ
Up
EMU12
AB25
IOZ
Up
EMU13
AC25
IOZ
Up
EMU14
AA23
IOZ
Up
EMU15
AB22
IOZ
Up
EMU16
AD25
IOZ
Up
EMU17
AC24
IOZ
Up
EMU18
Y21
IOZ
Up
GPIO00
T25
IOZ
Up
GPIO01
R25
IOZ
Down
GPIO02
R23
IOZ
Down
GPIO03
U25
IOZ
Down
GPIO04
T23
IOZ
Down
GPIO05
U24
IOZ
Down
GPIO06
T22
IOZ
Down
GPIO07
R21
IOZ
Down
GPIO08
U22
IOZ
Down
GPIO09
U23
IOZ
Down
GPIO10
V23
IOZ
Down
GPIO11
U21
IOZ
Down
GPIO12
T21
IOZ
Down
GPIO13
V22
IOZ
Down
GPIO14
W21
IOZ
Down
GPIO15
V21
IOZ
Down
DESCRIPTION
pEMU
Emulation and Trace Port
General-Purpose Input/Output (GPIO)
Down
General-Purpose Input/Output
These GPIO pins have secondary functions assigned to them as mentioned
elsewhere in this table (see Boot Configuration Pins).
General-Purpose Input/Output
This GPIO pin has a primary function assigned to it as mentioned elsewhere in this
table (see Timer) and a tertiary function assigned to it as mentioned elsewhere in this
table (see Boot Configuration Pins).
GPIO16 †
AD20
IOZ
GPIO17 †
AE21
IOZ
Down
General-Purpose Input/Output
GPIO18 †
AC19
IOZ
Down
GPIO19 †
AE20
IOZ
Down
These GPIO pins have primary functions assigned to them as mentioned elsewhere in
this table (see Timer).
20
Terminal Configuration and Functions
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Table 4-2. Terminal Functions — Signals and Control by Function (continued)
SIGNAL NAME
BALL
NO.
TYPE
IPD/IPU
GPIO20 †
AB15
IOZ
Down
GPIO21 †
AA15
IOZ
Down
GPIO22 †
AC17
IOZ
Down
GPIO23 †
AB17
IOZ
Down
GPIO24 †
AC14
IOZ
Down
GPIO25 †
AC15
IOZ
Down
GPIO26 †
AE16
IOZ
Down
GPIO27 †
AD15
IOZ
Down
GPIO28 †
AA12
IOZ
Up
GPIO29 †
AA14
IOZ
Up
GPIO30 †
AB14
IOZ
Down
GPIO31 †
AB13
IOZ
Down
DESCRIPTION
General-Purpose Input/Output
These GPIO pins have primary functions assigned to them as mentioned elsewhere in
this table (see UART).
General-Purpose Input/Output
These GPIO pins have primary functions assigned to them as mentioned elsewhere in
this table (see SPI).
HyperLink
MCMRXN0
P24
I
MCMRXP0
N24
I
MCMRXN1
M25
I
MCMRXP1
N25
I
MCMRXN2
J25
I
MCMRXP2
K25
I
MCMRXN3
K24
I
MCMRXP3
L24
I
MCMTXN0
P22
O
MCMTXP0
N22
O
MCMTXN1
N21
O
MCMTXP1
M21
O
MCMTXN2
K22
O
MCMTXP2
L22
O
MCMTXN3
J21
O
MCMTXP3
K21
O
MCMRXFLCLK
B24
O
Down
MCMRXFLDAT
C24
O
Down
MCMTXFLCLK
E25
I
Down
MCMTXFLDAT
D25
I
Down
MCMRXPMCLK
E24
I
Down
MCMRXPMDAT
D24
I
Down
MCMTXPMCLK
F24
O
Down
MCMTXPMDAT
G24
O
Down
MCMREFCLKOUTP
G25
O
MCMREFCLKOUTN
F25
O
Serial HyperLink Receive Data
Serial HyperLink Transmit Data
Serial HyperLink Sideband Signals
HyperLink Reference clock output for daisy chain connection
I2C
2
SCL
AA17
IOZ
I C Clock
SDA
AA18
IOZ
I2C Data
Terminal Configuration and Functions
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Table 4-2. Terminal Functions — Signals and Control by Function (continued)
SIGNAL NAME
BALL
NO.
TYPE
IPD/IPU
DESCRIPTION
TCK
AD17
I
Up
JTAG Clock Input
TDI
AE17
I
Up
JTAG Data Input
TDO
AD19
OZ
Up
JTAG Data Output
TMS
AE18
I
Up
JTAG Test Mode Input
TRST
AB19
I
Down
JTAG Reset
JTAG
McBSP
CLKR0
AA21
IOZ
Down
McBSP Receive Clock
CLKX0
Y20
IOZ
Down
McBSP Transmit Clock
CLKS0
AC23
IOZ
Down
McBSP Slow Clock
FSR0
AD24
IOZ
Down
McBSP Receive Frame Sync
FSX0
AA20
IOZ
Down
McBSP Transmit Frame Sync
DR0
AB21
I
Down
McBSP Receive Data
DX0
AC22
OZ
Down
McBSP Transmit Data
CLKR1
AD23
IOZ
Down
McBSP Receive Clock
CLKX1
AE24
IOZ
Down
McBSP Transmit Clock
CLKS1
AC21
IOZ
Down
McBSP Slow Clock
FSR1
AD22
IOZ
Down
McBSP Receive Frame Sync
FSX1
AE23
IOZ
Down
McBSP Transmit Frame Sync
DR1
AD21
I
Down
McBSP Receive Data
DX1
AE22
OZ
Down
McBSP Transmit Data
MDIO
AB16
IOZ
Up
MDIO Data
MDCLK
AA16
O
Down
MDIO Clock
PCIERXN0
AE12
I
PCIERXP0
AE11
I
PCIERXN1
AD10
I
PCIERXP1
AD11
I
PCIETXN0
AC12
O
PCIETXP0
AC11
O
PCIETXN1
AB11
O
PCIETXP1
AB10
O
RIORXN0
AE9
I
RIORXP0
AE8
I
RIORXN1
AD8
I
RIORXP1
AD7
I
RIORXN2
AE5
I
RIORXP2
AE6
I
RIORXN3
AD4
I
RIORXP3
AD5
I
MDIO
PCIe
PCIexpress Receive Data (2 links)
PCIexpress Transmit Data (2 links)
Serial RapidIO
22
Serial RapidIO Receive Data (4 links)
Terminal Configuration and Functions
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SPRS814D – MARCH 2012 – REVISED OCTOBER 2019
Table 4-2. Terminal Functions — Signals and Control by Function (continued)
SIGNAL NAME
BALL
NO.
TYPE
RIOTXN0
AC9
O
RIOTXP0
AC8
O
RIOTXN1
AB7
O
RIOTXP1
AB8
O
RIOTXN2
AC5
O
RIOTXP2
AC6
O
RIOTXN3
AB4
O
RIOTXP3
AB5
O
SGMII0RXN
AE2
I
SGMII0RXP
AE3
I
SGMII0TXN
AC2
O
SGMII0TXP
AC3
O
VCNTL0
E22
OZ
VCNTL1
E23
OZ
VCNTL2
F23
OZ
VCNTL3
G23
OZ
IPD/IPU
DESCRIPTION
Serial RapidIO Receive Data (4 links)
SGMII
Ethernet MAC SGMII Receive Data
Ethernet MAC SGMII Transmit Data
SmartReflex
Voltage Control Outputs to variable core power supply. These are open-drain output
buffers.
SPI
SPI Interface Enable 0
SPISCS0
AA12
OZ
Up
SPISCS1
AA14
OZ
Up
This SPI pin has a secondary function assigned to it as mentioned elsewhere in this
table (see GPIO).
SPICLK
AA13
OZ
Down
SPI Clock
Down
SPI Data In
This SPI pin has a secondary function assigned to it as mentioned elsewhere in this
table (see GPIO).
SPI Interface Enable 1
SPIDIN
AB14
I
SPIDOUT
AB13
OZ
TIMI0
AD20
I
TIMI1
AE21
I
TIMO0
AC19
OZ
TIMO1
AE20
OZ
This SPI pin has a secondary function assigned to it as mentioned elsewhere in this
table (see GPIO).
Down
SPI Data Out
This SPI pin has a secondary function assigned to it as mentioned elsewhere in this
table (see GPIO).
Timer
Down
Timer Inputs
Down
This SPI pin has a secondary function assigned to it as mentioned elsewhere in this
table (see GPIO).
Down
Timer Outputs
Down
These Timer pins have secondary functions assigned to them as mentioned
elsewhere in this table
Down
UART Serial Data In
UART
UARTRXD
AB15
I
UARTTXD
AA15
OZ
This SPI pin has a secondary function assigned to it as mentioned elsewhere in this
table (see GPIO).
Down
UART Serial Data Out
This SPI pin has a secondary function assigned to it as mentioned elsewhere in this
table (see GPIO).
Terminal Configuration and Functions
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Table 4-2. Terminal Functions — Signals and Control by Function (continued)
SIGNAL NAME
BALL
NO.
TYPE
UARTCTS
AC17
I
UARTRTS
AB17
OZ
UARTRXD1
AC14
I
UARTTXD1
AC15
OZ
UARTCTS1
AE16
I
UARTRTS1
AD15
OZ
IPD/IPU
DESCRIPTION
Down
UART Clear To Send
This SPI pin has a secondary function assigned to it as mentioned elsewhere in this
table (see GPIO).
Down
UART Request To Send
This SPI pin has a secondary function assigned to it as mentioned elsewhere in this
table (see GPIO).
Down
UART Serial Data In
This SPI pin has a secondary function assigned to it as mentioned elsewhere in this
table (see GPIO).
Down
UART Serial Data Out
This SPI pin has a secondary function assigned to it as mentioned elsewhere in this
table (see GPIO).
Down
UART Clear To Send
This SPI pin has a secondary function assigned to it as mentioned elsewhere in this
table (see GPIO).
Down
UART Request To Send
This SPI pin has a secondary function assigned to it as mentioned elsewhere in this
table (see GPIO).
Reserved
RSV01
AA22
IOZ
Up
Reserved - pullup to DVDD18
RSV02
J3
OZ
Down
Reserved - leave unconnected
RSV03
H2
OZ
Down
Reserved - leave unconnected
RSV04
AC18
O
Reserved - leave unconnected
RSV05
AB18
O
Reserved - leave unconnected
RSV06
B23
O
Reserved - leave unconnected
RSV07
A23
O
RSV08
Y19
OZ
Down
Reserved - leave unconnected
RSV09
C23
OZ
Down
Reserved - leave unconnected
RSV10
G22
A
Reserved - connect to GND
RSV11
H22
A
Reserved - leave unconnected
RSV12
Y5
A
Reserved - leave unconnected
RSV13
Y4
A
Reserved - leave unconnected
RSV14
F21
A
Reserved - leave unconnected
RSV15
G21
A
Reserved - leave unconnected
RSV16
J20
A
Reserved - leave unconnected
RSV17
AA7
A
Reserved - leave unconnected
RSV18
AA11
A
Reserved - leave unconnected
RSV19
AB3
A
Reserved - leave unconnected
RSV20
F22
IOZ
Reserved - leave unconnected
RSV21
D23
IOZ
Reserved - leave unconnected
RSV0A
G19
A
Reserved - leave unconnected
RSV0B
G20
A
Reserved - leave unconnected
24
Reserved - leave unconnected
Terminal Configuration and Functions
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SPRS814D – MARCH 2012 – REVISED OCTOBER 2019
Table 4-3. Terminal Functions — Power and Ground
SUPPLY
BALL NO.
VOLTS
DESCRIPTION
AVDDA1
Y15
1.8
PLL Supply - CORE_PLL
AVDDA2
F20
1.8
PLL Supply - DDR3_PLL
CVDD
H9, H11, H13, H15, H17, J10, J12, J14, J16, K11, K13, K15, L8, L10, L12,
L14, L16, L18, M9, M11, M13, M15, M17, N8, N10, N12, N14, N16, N18, P9,
P11, P13, P15, P17, P19, R10, R12, R14, R16, R18, T11, T13, T15, U10,
U12, U14, U16, V9, V11, V13, V15, V17
0.85 to
1.1
SmartReflex core supply voltage
CVDD1
J8, J18, K9, K17, T9, T17, U8, U18
1.0
Fixed core supply voltage for
memory array
DVDD15
B10, C6, C17, C21, D2, D4, D8, D13, D15, D19, F7, F9, F11, F13, F17, F19,
G8, G10, G12, G14, G16, G18
1.5
DDR I/O supply
DVDD18
A24, E21, G3, G6, H7, H19, H24, J6, K3, K7, L6, M7, N3, N6, P7, R6, R20,
T3, T7, T19, T24, U6, U20, V7, V19, W6, W14, W16, W18, W20, Y3, Y13,
Y17, AB23, AC16, AC20
1.8
I/O supply
VDDR1
M20
1.5
HyperLink SerDes regulator
supply
VDDR2
AA9
1.5
PCIe SerDes regulator supply
VDDR3
AA3
1.5
SGMII SerDes regulator supply
VDDR4
AA5
1.5
SRIO SerDes regulator supply
VDDT1
K19, L20, M19, N20
1.0
HyperLink SerDes termination
supply
VDDT2
W8, W10, W12, Y7, Y9, Y11
1.0
SGMII/SRIO/PCIe SerDes
termination supply
VREFSSTL
E12
0.75
DDR3 reference voltage
VSS
A1, A10, A25, B6, B17, C2, C4, C8, C13, C15, C19, D21, E11, F3, F6, F8,
F10, F12, F14, F16, F18, G7, G9, G11, G13, G15, G17, H6, H8, H10, H12,
H14, H16, H18, H20, H21, H23, H25, J7, J9, J11, J13, J15, J17, J19, J22,
J23, J24, K2, K6, K8, K10, K12, K14, K16, K18, K20, K23, L7, L9, L11, L13,
L15, L17, L19, L21, L23, L25, M6, M8, M10, M12, M14, M16, M18, M22, M23,
M24, N4, N7, N9, N11, N13, N15, N17, N19, N23, P6, P8, P10, P12, P14,
GND
P16, P18, P20, P21, P23, P25, R7, R8, R9, R11, R13, R15, R17, R19, R22,
R24, T2, T6, T8, T10, T12, T14, T16, T18, T20, U7, U9, U11, U13, U15, U17,
U19, V6, V8, V10, V12, V14, V16, V18, V20, W3, W7, W9, W11, W13, W15,
W17, W19, Y6, Y8, Y10, Y12, Y14, Y16, AA4, AA6, AA8, AA10, AB2, AB6,
AB9, AB12, AB20, AB24, AC1, AC4, AC7, AC10, AC13, AD1, AD2, AD3, AD6,
AD9, AD12, AD16, AE1, AE4, AE7, AE10, AE13, AE25
Ground
Terminal Configuration and Functions
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Table 4-4. Terminal Functions — By Signal Name
SIGNAL NAME
BALL NUMBER
SIGNAL NAME
BALL NUMBER
SIGNAL NAME
BALL NUMBER
AVDDA1
Y15
DDRA09
E20
DDRD22
C5
AVDDA2
F20
DDRA10
E19
DDRD23
D5
BOOTCOMPLETE
H3
DDRA11
B20
DDRD24
E2
BOOTMODE00 †
R25
DDRA12
D18
DDRD25
F2
BOOTMODE01 †
R23
DDRA13
C20
DDRD26
B1
BOOTMODE02 †
U25
DDRA14
E18
DDRD27
C1
BOOTMODE03 †
T23
DDRA15
E17
DDRD28
D1
BOOTMODE04 †
U24
DDRBA0
C18
DDRD29
D3
BOOTMODE05 †
T22
DDRBA1
D17
DDRD30
C3
BOOTMODE06 †
R21
DDRBA2
B19
DDRD31
E3
BOOTMODE07 †
U22
DDRCAS
D14
DDRDQM0
A8
BOOTMODE08 †
U23
DDRCB00
D11
DDRDQM1
E7
BOOTMODE09 †
V23
DDRCB01
B12
DDRDQM2
F5
BOOTMODE10 †
U21
DDRCB02
C11
DDRDQM3
E1
BOOTMODE11 †
T21
DDRCB03
A12
DDRDQM8
C12
BOOTMODE12 †
V22
DDRCE0
B15
DDRDQS0N
C10
CLKR0
AA21
DDRCE1
C14
DDRDQS0P
D10
CLKR1
AD23
DDRCKE0
A16
DDRDQS1N
A7
CLKS0
AC23
DDRCKE1
A20
DDRDQS1P
B7
CLKS1
AC21
DDRCLKN
B22
DDRDQS2N
A4
CLKX0
Y20
DDRCLKOUTN0
B14
DDRDQS2P
B4
CLKX1
AE24
DDRCLKOUTN1
B21
DDRDQS3N
B2
CORECLKN
AE19
DDRCLKOUTP0
A14
DDRDQS3P
A2
CORECLKP
AD18
DDRCLKOUTP1
A21
DDRDQS8N
A13
CORESEL0
J5
DDRCLKP
A22
DDRDQS8P
B13
CORESEL1
G5
DDRD00
A9
DDRODT0
E14
DDRD01
C9
DDRODT1
D12
DDRD02
D9
DDRRAS
A15
DDRD03
B9
DDRRESET
B16
DDRD04
E9
DDRSLRATE0
C22
CVDD
H9, H11, H13, H15,
H17, J10, J12, J14,
J16, K11, K13, K15,
L8, L10, L12, L14,
L16, L18, M9, M11,
M13, M15, M17, N8,
N10, N12, N14,
N16, N18, P9, P11,
P13, P15, P17, P19,
R10, R12, R14,
R16, R18, T11, T13,
T15, U10, U12, U14,
U16, V9, V11, V13,
V15, V17
DDRD05
E10
DDRSLRATE1
D22
DDRD06
A11
DDRWE
E13
DDRD07
B11
DR0
AB21
DDRD08
E6
DR1
AD21
DDRD09
E8
DDRD10
A6
CVDD1
J8, J18, K9, K17,
T9, T17, U8, U18
DDRD11
A5
DVDD15
DDRD12
D6
DDRA00
D16
DDRD13
C7
B10, C6, C17,
C21, D2, D4, D8,
D13, D15, D19,
F7, F9, F11, F13,
F17, F19, G8,
G10, G12, G14,
G16, G18
DDRA01
A19
DDRD14
D7
DDRA02
E16
DDRD15
B8
DDRA03
E15
DDRD16
E5
DDRA04
B18
DDRD17
B3
DDRA05
A17
DDRD18
F4
DVDD18
DDRA06
C16
DDRD19
E4
DDRA07
A18
DDRD20
A3
DDRA08
D20
DDRD21
B5
A24, E21, G3,
G6, H7, H19,
H24, J6, K3, K7,
L6, M7, N3, N6,
P7, R6, R20, T3,
T7, T19, T24, U6,
U20, V7, V19,
W6, W14, W16,
W18, W20, Y3,
Y13, Y17, AB23,
AC16, AC20
26
Terminal Configuration and Functions
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SPRS814D – MARCH 2012 – REVISED OCTOBER 2019
Table 4-4. Terminal Functions — By Signal Name (continued)
SIGNAL NAME
BALL NUMBER
SIGNAL NAME
BALL NUMBER
SIGNAL NAME
BALL NUMBER
DX0
AC22
EMIFD15
AA2
GPIO18 †
AC19
DX1
AE22
EMIFOE
L4
GPIO19 †
AE20
EMIFA00
K1
EMIFRNW
L5
GPIO20 †
AB15
EMIFA01
M3
EMIFWAIT0
N5
GPIO21 †
AA15
EMIFA02
L2
EMIFWAIT1
M4
GPIO22 †
AC17
EMIFA03
P5
EMIFWE
K4
GPIO23 †
AB17
EMIFA04
L1
EMU00
V24
GPIO24 †
AC14
EMIFA05
P4
EMU01
V25
GPIO25 †
AC15
EMIFA06
M2
EMU02
W25
GPIO26 †
AE16
EMIFA07
M1
EMU03
W23
GPIO27 †
AD15
EMIFA08
N2
EMU04
W24
GPIO28 †
AA12
EMIFA09
P3
EMU05
Y25
GPIO29 †
AA14
EMIFA10
N1
EMU06
Y24
GPIO30 †
AB14
EMIFA11
P2
EMU07
Y23
GPIO31 †
AB13
EMIFA12
P1
EMU08
W22
HOUT
G2
EMIFA13
R5
EMU09
Y22
LENDIAN †
T25
EMIFA14
R3
EMU10
AA24
LRESETNMIEN
F1
EMIFA15
R4
EMU11
AA25
LRESET
G4
EMIFA16
R2
EMU12
AB25
MCMCLKN
B25
EMIFA17
R1
EMU13
AC25
MCMCLKP
C25
EMIFA18
T4
EMU14
AA23
MCMREFCLKOUTN
F25
EMIFA19
T1
EMU15
AB22
MCMREFCLKOUTP
G25
EMIFA20
T5
EMU16
AD25
MCMRXFLCLK
B24
EMIFA21
U1
EMU17
AC24
MCMRXFLDAT
C24
EMIFA22
U2
EMU18
Y21
MCMRXN0
P24
EMIFA23
U3
FSR0
AD24
MCMRXN1
M25
EMIFBE0
J1
FSR1
AD22
MCMRXN2
J25
EMIFBE1
L3
FSX0
AA20
MCMRXN3
K24
EMIFCE0
K5
FSX1
AE23
MCMRXP0
N24
EMIFCE1
G1
GPIO00
T25
MCMRXP1
N25
EMIFCE2
J2
GPIO01
R25
MCMRXP2
K25
EMIFCE3
M5
GPIO02
R23
MCMRXP3
L24
EMIFD00
U4
GPIO03
U25
MCMRXPMCLK
E24
EMIFD01
U5
GPIO04
T23
MCMRXPMDAT
D24
EMIFD02
V1
GPIO05
U24
MCMTXFLCLK
E25
EMIFD03
V2
GPIO06
T22
MCMTXFLDAT
D25
EMIFD04
V3
GPIO07
R21
MCMTXN0
P22
EMIFD05
V4
GPIO08
U22
MCMTXN1
N21
EMIFD06
W1
GPIO09
U23
MCMTXN2
K22
EMIFD07
V5
GPIO10
V23
MCMTXN3
J21
EMIFD08
W2
GPIO11
U21
MCMTXP0
N22
EMIFD09
Y1
GPIO12
T21
MCMTXP1
M21
EMIFD10
W4
GPIO13
V22
MCMTXP2
L22
EMIFD11
Y2
GPIO14
W21
MCMTXP3
K21
EMIFD12
W5
GPIO15
V21
MCMTXPMCLK
F24
EMIFD13
AA1
GPIO16 †
AD20
MCMTXPMDAT
G24
EMIFD14
AB1
GPIO17 †
AE21
MDCLK
AA16
Terminal Configuration and Functions
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TMS320C6655, TMS320C6657
SPRS814D – MARCH 2012 – REVISED OCTOBER 2019
www.ti.com
Table 4-4. Terminal Functions — By Signal Name (continued)
SIGNAL NAME
BALL NUMBER
SIGNAL NAME
BALL NUMBER
SIGNAL NAME
BALL NUMBER
MDIO
AB16
RSV12
Y5
UPP_CH0_WAIT †
T1
NMI
H1
RSV13
Y4
UPP_CH1_CLK †
T5
PCIECLKN
AE15
RSV14
F21
UPP_CH1_ENABLE †
U2
PCIECLKP
AD14
RSV15
G21
UPP_CH1_START †
U1
PCIERXN0
AE12
RSV16
J20
UPP_CH1_WAIT †
U3
PCIERXN1
AD10
RSV17
AA7
UPPD00 †
U4
PCIERXP0
AE11
RSV18
AA11
UPPD01 †
U5
PCIERXP1
AD11
RSV19
AB3
UPPD02 †
V1
PCIESSEN ‡
AD20
RSV20
F22
UPPD03 †
V2
PCIETXN0
AC12
RSV21
D23
UPPD04 †
V3
PCIETXN1
AB11
SCL
AA17
UPPD05 †
V4
PCIETXP0
AC11
SDA
AA18
UPPD06 †
W1
PCIETXP1
AB10
SGMII0RXN
AE2
UPPD07 †
V5
POR
Y18
SGMII0RXP
AE3
UPPD08 †
W2
PTV15
F15
SGMII0TXN
AC2
UPPD09 †
Y1
RESETFULL
J4
SGMII0TXP
AC3
UPPD10 †
W4
RESETSTAT
H5
SPICLK
AA13
UPPD11 †
Y2
RESET
H4
SPIDIN
AB14
UPPD12 †
W5
RIORXN0
AE9
SPIDOUT
AB13
UPPD13 †
AA1
RIORXN1
AD8
SPISCS0
AA12
UPPD14 †
AB1
RIORXN2
AE5
SPISCS1
AA14
UPPD15 †
AA2
RIORXN3
AD4
SRIOSGMIICLKN
AE14
UPPXD00 †
K1
RIORXP0
AE8
SRIOSGMIICLKP
AD13
UPPXD01 †
M3
RIORXP1
AD7
SYSCLKOUT
AA19
UPPXD02 †
L2
RIORXP2
AE6
TCK
AD17
UPPXD03 †
P5
RIORXP3
AD5
TDI
AE17
UPPXD04 †
L1
RIOTXN0
AC9
TDO
AD19
UPPXD05 †
P4
RIOTXN1
AB7
TIMI0
AD20
UPPXD06 †
M2
RIOTXN2
AC5
TIMI1
AE21
UPPXD07 †
M1
RIOTXN3
AB4
TIMO0
AC19
UPPXD08 †
N2
RIOTXP0
AC8
TIMO1
AE20
UPPXD09 †
P3
RIOTXP1
AB8
TMS
AE18
UPPXD10 †
N1
RIOTXP2
AC6
TRST
AB19
UPPXD11 †
P2
RIOTXP3
AB5
UARTCTS
AC17
UPPXD12 †
P1
RSV01
AA22
UARTCTS1
AE16
UPPXD13 †
R5
RSV02
J3
UARTRTS
AB17
UPPXD14 †
R3
RSV03
H2
UARTRTS1
AD15
UPPXD15 †
R4
RSV04
AC18
UARTRXD
AB15
VCNTL0
E22
RSV05
AB18
UARTRXD1
AC14
VCNTL1
E23
RSV06
B23
UARTTXD
AA15
VCNTL2
F23
RSV07
A23
UARTTXD1
AC15
VCNTL3
G23
RSV08
Y19
UPP_2XTXCLK †
M4
VDDR1
M20
RSV09
C23
UPP_CH0_CLK †
R2
VDDR2
AA9
RSV0A
G19
VDDR3
AA3
RSV0B
G20
VDDR4
AA5
RSV10
G22
RSV11
H22
VDDT1
K19, L20, M19,
N20
28
Terminal Configuration and Functions
UPP_CH0_
ENABLE †
T4
UPP_CH0_
START †
R1
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SPRS814D – MARCH 2012 – REVISED OCTOBER 2019
Table 4-4. Terminal Functions — By Signal Name (continued)
SIGNAL NAME
BALL NUMBER
VDDT2
W8, W10, W12, Y7,
Y9, Y11
VDDT1
N20
VDDT2
W10
VDDT2
W12
VDDT2
Y7
VDDT2
Y9
VDDT2
Y11
VREFSSTL
E12
VSS
A1, A10, A25, B6,
B17, C2, C4, C8,
C13, C15, C19,
D21, E11, F3, F6,
F8, F10, F12, F14,
F16, F18, G7, G9,
G11, G13, G15,
G17, H6, H8, H10,
H12, H14, H16,
H18, H20, H21,
H23, H25, J7, J9,
J11, J13, J15, J17,
J19, J22, J23, J24,
K2, K6, K8, K10,
K12, K14, K16, K18,
K20, K23, L7, L9,
L11, L13, L15, L17,
L19, L21, L23, L25,
M6, M8, M10, M12,
M14, M16, M18,
M22, M23, M24, N4,
N7, N9, N11, N13,
N15, N17, N19,
N23, P6, P8, P10,
P12, P14, P16, P18,
P20, P21, P23, P25,
R7, R8, R9, R11,
R13, R15, R17,
R19, R22, R24, T2,
T6, T8, T10, T12,
T14, T16, T18, T20,
U7, U9, U11, U13,
U15, U17, U19, V6,
V8, V10, V12, V14,
V16, V18, V20, W3,
W7, W9, W11, W13,
W15, W17, W19,
Y6, Y8, Y10, Y12,
Y14, Y16, AA4,
AA6, AA8, AA10,
AB2, AB6, AB9,
AB12, AB20, AB24,
AC1, AC4, AC7,
AC10, AC13, AD1,
AD2, AD3, AD6,
AD9, AD12, AD16,
AE1, AE4, AE7,
AE10, AE13, AE25
SIGNAL NAME
BALL NUMBER
SIGNAL NAME
BALL NUMBER
Terminal Configuration and Functions
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TMS320C6655, TMS320C6657
SPRS814D – MARCH 2012 – REVISED OCTOBER 2019
www.ti.com
Table 4-5. Terminal Functions — By Ball Number
BALL NUMBER
SIGNAL NAME
BALL NUMBER SIGNAL NAME
BALL NUMBER
SIGNAL NAME
A1
VSS
B23
RSV06
D20
DDRA08
A2
DDRDQS3P
B24
MCMRXFLCLK
D21
VSS
A3
DDRD20
B25
MCMCLKN
D22
DDRSLRATE1
A4
DDRDQS2N
C1
DDRD27
D23
RSV21
A5
DDRD11
C2
VSS
D24
MCMRXPMDAT
A6
DDRD10
C3
DDRD30
D25
MCMTXFLDAT
A7
DDRDQS1N
C4
VSS
E1
DDRDQM3
A8
DDRDQM0
C5
DDRD22
E2
DDRD24
A9
DDRD00
C6
DVDD15
E3
DDRD31
A10
VSS
C7
DDRD13
E4
DDRD19
A11
DDRD06
C8
VSS
E5
DDRD16
A12
DDRCB03
C9
DDRD01
E6
DDRD08
A13
DDRDQS8N
C10
DDRDQS0N
E7
DDRDQM1
A14
DDRCLKOUTP0
C11
DDRCB02
E8
DDRD09
A15
DDRRAS
C12
DDRDQM8
E9
DDRD04
A16
DDRCKE0
C13
VSS
E10
DDRD05
A17
DDRA05
C14
DDRCE1
E11
VSS
A18
DDRA07
C15
VSS
E12
VREFSSTL
A19
DDRA01
C16
DDRA06
E13
DDRWE
A20
DDRCKE1
C17
DVDD15
E14
DDRODT0
A21
DDRCLKOUTP1
C18
DDRBA0
E15
DDRA03
A22
DDRCLKP
C19
VSS
E16
DDRA02
A23
RSV07
C20
DDRA13
E17
DDRA15
A24
DVDD18
C21
DVDD15
E18
DDRA14
A25
VSS
C22
DDRSLRATE0
E19
DDRA10
B1
DDRD26
C23
RSV09
E20
DDRA09
B2
DDRDQS3N
C24
MCMRXFLDAT
E21
DVDD18
B3
DDRD17
C25
MCMCLKP
E22
VCNTL0
B4
DDRDQS2P
D1
DDRD28
E23
VCNTL1
B5
DDRD21
D2
DVDD15
E24
MCMRXPMCLK
B6
VSS
D3
DDRD29
E25
MCMTXFLCLK
B7
DDRDQS1P
D4
DVDD15
F1
LRESETNMIEN
B8
DDRD15
D5
DDRD23
F2
DDRD25
B9
DDRD03
D6
DDRD12
F3
VSS
B10
DVDD15
D7
DDRD14
F4
DDRD18
B11
DDRD07
D8
DVDD15
F5
DDRDQM2
B12
DDRCB01
D9
DDRD02
F6
VSS
B13
DDRDQS8P
D10
DDRDQS0P
F7
DVDD15
B14
DDRCLKOUTN0
D11
DDRCB00
F8
VSS
B15
DDRCE0
D12
DDRODT1
F9
DVDD15
B16
DDRRESET
D13
DVDD15
F10
VSS
B17
VSS
D14
DDRCAS
F11
DVDD15
B18
DDRA04
D15
DVDD15
F12
VSS
B19
DDRBA2
D16
DDRA00
F13
DVDD15
B20
DDRA11
D17
DDRBA1
F14
VSS
B21
DDRCLKOUTN1
D18
DDRA12
F15
PTV15
B22
DDRCLKN
D19
DVDD15
F16
VSS
30
Terminal Configuration and Functions
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SPRS814D – MARCH 2012 – REVISED OCTOBER 2019
Table 4-5. Terminal Functions — By Ball Number (continued)
BALL NUMBER
SIGNAL NAME
BALL NUMBER SIGNAL NAME
BALL NUMBER
SIGNAL NAME
F17
DVDD15
H14
VSS
K10
VSS
F18
VSS
H15
CVDD
K11
CVDD
F19
DVDD15
H16
VSS
K12
VSS
F20
AVDDA2
H17
CVDD
K13
CVDD
F21
RSV14
H18
VSS
K14
VSS
F22
RSV20
H19
DVDD18
K15
CVDD
F23
VCNTL2
H20
VSS
K16
VSS
F24
MCMTXPMCLK
H21
VSS
K17
CVDD1
F25
MCMREFCLKOUTN
H22
RSV11
K18
VSS
G1
EMIFCE1
H23
VSS
K19
VDDT1
G2
HOUT
H24
DVDD18
K20
VSS
G3
DVDD18
H25
VSS
K21
MCMTXP3
G4
LRESET
J1
EMIFBE0
K22
MCMTXN2
G5
CORESEL1
J2
EMIFCE2
K23
VSS
G6
DVDD18
J3
RSV02
K24
MCMRXN3
G7
VSS
J4
RESETFULL
K25
MCMRXP2
G8
DVDD15
J5
CORESEL0
L1
EMIFA04
G9
VSS
J6
DVDD18
L1
UPPXD04 †
G10
DVDD15
J7
VSS
L2
EMIFA02
G11
VSS
J8
CVDD1
L2
UPPXD02 †
G12
DVDD15
J9
VSS
L3
EMIFBE1
G13
VSS
J10
CVDD
L4
EMIFOE
G14
DVDD15
J11
VSS
L5
EMIFRNW
G15
VSS
J12
CVDD
L6
DVDD18
G16
DVDD15
J13
VSS
L7
VSS
G17
VSS
J14
CVDD
L8
CVDD
G18
DVDD15
J15
VSS
L9
VSS
G19
RSV0A
J16
CVDD
L10
CVDD
G20
RSV0B
J17
VSS
L11
VSS
G21
RSV15
J18
CVDD1
L12
CVDD
G22
RSV10
J19
VSS
L13
VSS
G23
VCNTL3
J20
RSV16
L14
CVDD
G24
MCMTXPMDAT
J21
MCMTXN3
L15
VSS
G25
MCMREFCLKOUTP
J22
VSS
L16
CVDD
H1
NMI
J23
VSS
L17
VSS
H2
RSV03
J24
VSS
L18
CVDD
H3
BOOTCOMPLETE
J25
MCMRXN2
L19
VSS
H4
RESET
K1
EMIFA00
L20
VDDT1
H5
RESETSTAT
K1
UPPXD00 †
L21
VSS
H6
VSS
K2
VSS
L22
MCMTXP2
H7
DVDD18
K3
DVDD18
L23
VSS
H8
VSS
K4
EMIFWE
L24
MCMRXP3
H9
CVDD
K5
EMIFCE0
L25
VSS
H10
VSS
K6
VSS
M1
EMIFA07
H11
CVDD
K7
DVDD18
M1
UPPXD07 †
H12
VSS
K8
VSS
M2
EMIFA06
H13
CVDD
K9
CVDD1
M2
UPPXD06 †
Terminal Configuration and Functions
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SPRS814D – MARCH 2012 – REVISED OCTOBER 2019
www.ti.com
Table 4-5. Terminal Functions — By Ball Number (continued)
BALL NUMBER
SIGNAL NAME
BALL NUMBER SIGNAL NAME
BALL NUMBER
SIGNAL NAME
M3
EMIFA01
N21
MCMTXN1
R8
VSS
M3
UPPXD01 †
N22
MCMTXP0
R9
VSS
M4
EMIFWAIT1
N23
VSS
R10
CVDD
M4
UPP2XTXCLK †
N24
MCMRXP0
R11
VSS
M5
EMIFCE3
N25
MCMRXP1
R12
CVDD
M6
VSS
P1
EMIFA12
R13
VSS
M7
DVDD18
P1
UPPXD12 †
R14
CVDD
M8
VSS
P2
EMIFA11
R15
VSS
M9
CVDD
P2
UPPXD11 †
R16
CVDD
M10
VSS
P3
EMIFA09
R17
VSS
M11
CVDD
P3
UPPXD09 †
R18
CVDD
M12
VSS
P4
EMIFA05
R19
VSS
M13
CVDD
P4
UPPXD05 †
R20
DVDD18
M14
VSS
P5
EMIFA03
R21
GPIO07
M15
CVDD
P5
UPPXD03 †
R21
BOOTMODE06 †
M16
VSS
P6
VSS
R22
VSS
M17
CVDD
P7
DVDD18
R23
GPIO02
M18
VSS
P8
VSS
R23
BOOTMODE01 †
M19
VDDT1
P9
CVDD
R24
VSS
M20
VDDR1
P10
VSS
R25
GPIO01
M21
MCMTXP1
P11
CVDD
R25
BOOTMODE00 †
M22
VSS
P12
VSS
T1
EMIFA19
M23
VSS
P13
CVDD
T1
UPP_CH0_WAIT †
M24
VSS
P14
VSS
T2
VSS
M25
MCMRXN1
P15
CVDD
T3
DVDD18
N1
EMIFA10
P16
VSS
T4
EMIFA18
N1
UPPXD10 †
P17
CVDD
T4
UPP_CH0_ENABLE
†
N2
EMIFA08
P18
VSS
T5
EMIFA20
N2
UPPXD08 †
P19
CVDD
T5
UPP_CH1_CLK †
N3
DVDD18
P20
VSS
T6
VSS
N4
VSS
P21
VSS
T7
DVDD18
N5
EMIFWAIT0
P22
MCMTXN0
T8
VSS
N6
DVDD18
P23
VSS
T9
CVDD1
N7
VSS
P24
MCMRXN0
T10
VSS
N8
CVDD
P25
VSS
T11
CVDD
N9
VSS
R1
EMIFA17
T12
VSS
N10
CVDD
R1
UPP_CH0_START †
T13
CVDD
N11
VSS
R2
EMIFA16
T14
VSS
N12
CVDD
R2
UPP_CH0_CLK †
T15
CVDD
N13
VSS
R3
EMIFA14
T16
VSS
N14
CVDD
R3
UPPXD14 †
T17
CVDD1
N15
VSS
R4
EMIFA15
T18
VSS
N16
CVDD
R4
UPPXD15 †
T19
DVDD18
N17
VSS
R5
EMIFA13
T20
VSS
N18
CVDD
R5
UPPXD13 †
T21
GPIO12
N19
VSS
R6
DVDD18
T21
BOOTMODE11 †
N20
VDDT1
R7
VSS
T22
GPIO06
32
Terminal Configuration and Functions
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SPRS814D – MARCH 2012 – REVISED OCTOBER 2019
Table 4-5. Terminal Functions — By Ball Number (continued)
BALL NUMBER
SIGNAL NAME
BALL NUMBER SIGNAL NAME
BALL NUMBER
SIGNAL NAME
T22
BOOTMODE05 †
V3
UPPD04 †
W16
DVDD18
T23
GPIO04
V4
EMIFD05
W17
VSS
T23
BOOTMODE03 †
V4
UPPD05 †
W18
DVDD18
T24
DVDD18
V5
EMIFD07
W19
VSS
T25
GPIO00
V5
UPPD07 †
W20
DVDD18
T25
LENDIAN †
V6
VSS
W21
GPIO14 †
U1
EMIFA21
V7
DVDD18
W21
PCIESSMODE0 †
U1
UPP_CH1_START †
V8
VSS
W22
EMU08
U2
EMIFA22
V9
CVDD
W23
EMU03
U2
UPP_CH1_ENABLE
†
V10
VSS
W24
EMU04
V11
CVDD
W25
EMU02
U3
EMIFA23
V12
VSS
Y1
EMIFD09
U3
UPP_CH1_WAIT †
V13
CVDD
Y1
UPPD09 †
U4
EMIFD00
V14
VSS
Y2
EMIFD11
U4
UPPD00 †
V15
CVDD
Y2
UPPD11 †
U5
EMIFD01
V16
VSS
Y3
DVDD18
U5
UPPD01 †
V17
CVDD
Y4
RSV13
U6
DVDD18
V18
VSS
Y5
RSV12
U7
VSS
V19
DVDD18
Y6
VSS
U8
CVDD1
V20
VSS
Y7
VDDT2
U9
VSS
V21
GPIO15
Y8
VSS
U10
CVDD
V21
PCIESSMODE1 †
Y9
VDDT2
U11
VSS
V22
GPIO13
Y10
VSS
U12
CVDD
V22
BOOTMODE12 †
Y11
VDDT2
U13
VSS
V23
GPIO10
Y12
VSS
U14
CVDD
V23
BOOTMODE09 †
Y13
DVDD18
U15
VSS
V24
EMU00
Y14
VSS
U16
CVDD
V25
EMU01
Y15
AVDDA1
U17
VSS
W1
EMIFD06
Y16
VSS
U18
CVDD1
W1
UPPD06 †
Y17
DVDD18
U19
VSS
W2
EMIFD08
Y18
POR
U20
DVDD18
W2
UPPD08 †
Y19
RSV08
U21
GPIO11
W3
VSS
Y20
CLKX0
U21
BOOTMODE10 †
W4
EMIFD10
Y21
EMU18
U22
GPIO08
W4
UPPD10 †
Y22
EMU09
U22
BOOTMODE07 †
W5
EMIFD12
Y23
EMU07
U23
GPIO09
W5
UPPD12 †
Y24
EMU06
U23
BOOTMODE08 †
W6
DVDD18
Y25
EMU05
U24
GPIO05
W7
VSS
AA1
EMIFD13
U24
BOOTMODE04 †
W8
VDDT2
AA1
UPPD13 †
U25
GPIO03
W9
VSS
AA2
EMIFD15
U25
BOOTMODE02 †
W10
VDDT2
AA2
UPPD15 †
V1
EMIFD02
W11
VSS
AA3
VDDR3
V1
UPPD02 †
W12
VDDT2
AA4
VSS
V2
EMIFD03
W13
VSS
AA5
VDDR4
V2
UPPD03 †
W14
DVDD18
AA6
VSS
V3
EMIFD04
W15
VSS
AA7
RSV17
Terminal Configuration and Functions
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Table 4-5. Terminal Functions — By Ball Number (continued)
BALL NUMBER
SIGNAL NAME
BALL NUMBER SIGNAL NAME
BALL NUMBER
SIGNAL NAME
AA8
VSS
AB22
EMU15
AD15
UARTRTS1
AA9
VDDR2
AB23
DVDD18
AD15
GPIO27 †
AA10
VSS
AB24
VSS
AD16
VSS
AA11
RSV18
AB25
EMU12
AD17
TCK
AA12
SPISCS0
AC1
VSS
AD18
CORECLKP
AA12
GPIO28 †
AC2
SGMII0TXN
AD19
TDO
AA13
SPICLK
AC3
SGMII0TXP
AD20
TIMI0
AA14
SPISCS1
AC4
VSS
AD20
GPIO16 †
AA14
GPIO29 †
AC5
RIOTXN2
AD20
PCIESSEN ‡
AA15
UARTTXD
AC6
RIOTXP2
AD21
DR1
AA15
GPIO21 †
AC7
VSS
AD22
FSR1
AA16
MDCLK
AC8
RIOTXP0
AD23
CLKR1
AA17
SCL
AC9
RIOTXN0
AD24
FSR0
AA18
SDA
AC10
VSS
AD25
EMU16
AA19
SYSCLKOUT
AC11
PCIETXP0
AE1
VSS
AA20
FSX0
AC12
PCIETXN0
AE2
SGMII0RXN
AA21
CLKR0
AC13
VSS
AE3
SGMII0RXP
AA22
RSV01
AC14
UARTRXD1
AE4
VSS
AA23
EMU14
AC14
GPIO24 †
AE5
RIORXN2
AA24
EMU10
AC15
UARTTXD1
AE6
RIORXP2
AA25
EMU11
AC15
GPIO25 †
AE7
VSS
AB1
EMIFD14
AC16
DVDD18
AE8
RIORXP0
AB1
UPPD14 †
AC17
UARTCTS
AE9
RIORXN0
AB2
VSS
AC17
GPIO22 †
AE10
VSS
AB3
RSV19
AC18
RSV04
AE11
PCIERXP0
AB4
RIOTXN3
AC19
TIMO0
AE12
PCIERXN0
AB5
RIOTXP3
AC19
GPIO18 †
AE13
VSS
AB6
VSS
AC20
DVDD18
AE14
SRIOSGMIICLKN
AB7
RIOTXN1
AC21
CLKS1
AE15
PCIECLKN
AB8
RIOTXP1
AC22
DX0
AE16
UARTCTS1
AB9
VSS
AC23
CLKS0
AE16
GPIO26 †
AB10
PCIETXP1
AC24
EMU17
AE17
TDI
AB11
PCIETXN1
AC25
EMU13
AE18
TMS
AB12
VSS
AD1
VSS
AE19
CORECLKN
AB13
SPIDOUT
AD2
VSS
AE20
TIMO1
AB13
GPIO31 †
AD3
VSS
AE20
GPIO19 †
AB14
SPIDIN
AD4
RIORXN3
AE21
TIMI1
AB14
GPIO30 †
AD5
RIORXP3
AE21
GPIO17 †
AB15
UARTRXD
AD6
VSS
AE22
DX1
AB15
GPIO20 †
AD7
RIORXP1
AE23
FSX1
AB16
MDIO
AD8
RIORXN1
AE24
CLKX1
AB17
UARTRTS
AD9
VSS
AE25
VSS
AB17
GPIO23 †
AD10
PCIERXN1
AB18
RSV05
AD11
PCIERXP1
AB19
TRST
AD12
VSS
AB20
VSS
AD13
SRIOSGMIICLKP
AB21
DR0
AD14
PCIECLKP
34
Terminal Configuration and Functions
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Terminal Configuration and Functions
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5 Specifications
Absolute Maximum Ratings (1) (2)
5.1
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
CVDD
-0.3
1.3
CVDD1
-0.3
1.3
DVDD15
-0.3
2.45
DVDD18
Supply voltage (3)
VREFSSTL
-0.3
2.45
0.49 × DVDD15
0.51 × DVDD15
VDDT1, VDDT2
-0.3
1.3
VDDR1, VDDR2, VDDR3, VDDR4
-0.3
2.45
AVDDA1, AVDDA2
-0.3
2.45
LVCMOS (1.8V)
-0.3
DVDD18+0.3
DDR3
-0.3
2.45
VSS Ground
Output voltage (VO)
V
0
2
Input voltage (VI)
UNIT
I C
-0.3
2.45
LVDS
-0.3
DVDD18+0.3
LJCB
-0.3
1.3
SerDes
-0.3
CVDD1+0.3
LVCMOS (1.8V)
-0.3
DVDD18+0.3
DDR3
-0.3
2.45
I2C
-0.3
2.45
SerDes
-0.3
CVDD1+0.3
V
V
LVCMOS (1.8V)
Overshoot/undershoot (4)
20% Overshoot/Undershoot
for 20% of Signal Duty Cycle
DDR3
I2C
Storage temperature, Tstg
(1)
(2)
(3)
(4)
–65
150
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to VSS, unless otherwise noted.
All voltage values are with respect to VSS.
Overshoot/Undershoot percentage relative to I/O operating values - for example the maximum overshoot value for 1.8-V LVCMOS
signals is DVDD18 + 0.20 × DVDD18 and maximum undershoot value would be VSS - 0.20 × DVDD18
5.2
ESD Ratings
VALUE
V(ESD)
(1)
(2)
(3)
36
°C
Electrostatic
discharge (1)
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (2)
±1000
Charged-device model (CDM), per JEDEC specification JESD22-C101 (3)
±250
UNIT
V
Electrostatic discharge (ESD) to measure device sensitivity/immunity to damage caused by electrostatic discharges into the device.
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 500-V HBM is possible with the necessary precautions. Pins listed as ±1000 V may actually have higher performance.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Pins listed as ±250 V
may actually have higher performance.
Specifications
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Recommended Operating Conditions (1) (2)
5.3
over operating free-air temperature range (unless otherwise noted)
850MHz - Device
CVDD
SR Core Supply
SRVnom
(3)
MIN
NOM
MAX
UNIT
× 0.95
0.85-1.1
SRVnom × 1.05
1000MHz - Device
SRVnom × 0.95
0.85-1.1
SRVnom × 1.05
1250MHZ - Device
SRVnom × 0.95
0.85-1.1
SRVnom × 1.05
0.95
1
1.05
V
V
CVDD1
Core supply voltage for memory array
DVDD18
1.8-V supply I/O voltage
1.71
1.8
1.89
V
DVDD15
1.5-V supply I/O voltage
1.425
1.5
1.575
V
VREFSSTL
DDR3 reference voltage
0.49 × DVDD15 0.5 × DVDD15
0.51 × DVDD15
V
VDDRx
(4)
1.425
1.5
1.575
V
VDDAx
SerDes regulator supply
PLL analog supply
1.71
1.8
1.89
V
VDDTx
SerDes termination supply
0.95
1
1.05
V
VSS
Ground
0
0
0
V
LVCMOS (1.8 V)
VIH
I2C
High-level input voltage
DDR3 EMIF
0.65 × DVDD18
0.7 × DVDD18
LVCMOS (1.8 V)
VIL
Low-level input voltage
DDR3 EMIF
0.35 × DVDD18
-0.3
I2C
TC
(1)
(2)
(3)
(4)
5.4
Operating case temperature
Commercial
Extended
V
VREFSSTL + 0.1
VREFSSTL - 0.1
V
0.3 × DVDD18
0
85
-40
100
°C
All differential clock inputs comply with the LVDS Electrical Specification, IEEE 1596.3-1996 and all SERDES I/Os comply with the XAUI
Electrical Specification, IEEE 802.3ae-2002.
All SERDES I/Os comply with the XAUI Electrical Specification, IEEE 802.3ae-2002.
SRVnom refers to the unique SmartReflex core supply voltage set from the factory for each individual device.
Where x = 1, 2, 3, 4... to indicate all supplies of the same kind.
Power Consumption Summary
Power consumption on these devices depends on several operating parameters such as operating
voltage, operating frequency, and temperature. Power consumption also varies by end applications that
determine the overall processor, CPU, and peripheral activity. For more specific power consumption
details, see C6654 and C6652 power consumption model. This model contains a spreadsheet for
estimating power based on parameters that closely resemble the end application to generate a realistic
estimate of power consumption on this device based on use-case and operating conditions.
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5.5
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Electrical Characteristics
Over Recommended Ranges of Supply Voltage and Operating Case Temperature (Unless Otherwise Noted)
TEST CONDITIONS (1)
PARAMETER
LVCMOS (1.8 V)
VOH
High-level output voltage
MIN
IO = IOH
NOM
MAX
UNIT
DVDD18 - 0.45
DDR3
DVDD15 - 0.4
V
I2C (2)
LVCMOS (1.8 V)
VOL
Low-level output voltage
0.4
IO = 3 mA, pulled up to
1.8 V
I C
LVCMOS (1.8 V)
Input current [DC]
High-level output current
[DC]
Low-level output current
[DC]
-5
Internal pullup
50
100
170 (4)
-170
-100
-50
0.1 × DVDD18 V < VI <
0.9 × DVDD18 V
-10
(1)
(2)
(3)
(4)
(5)
(6)
Off-state output current
[DC]
-8
LVCMOS (1.8 V)
6
DDR3
8
2
mA
3
LVCMOS (1.8 V)
-2
2
DDR3
-2
2
I2C
-2
2
µA
Thermal Resistance Characteristics for [CZH/GZH] Package
°C/W (1)
NAME
DESCRIPTION
RΘJC
Junction-to-case
0.284
RΘJB
Junction-to-board
4.200
38
mA
(5)
For test conditions shown as MIN, MAX, or TYP, use the appropriate value specified in the recommended operating conditions table.
I2C uses open collector I/Os and does not have a VOH Minimum.
II applies to input-only pins and bidirectional pins. For input-only pins, II indicates the input leakage current. For bidirectional pins, II
includes input leakage current and off-state (Hi-Z) output leakage current.
For RESETSTAT, max DC input current is 300 µA.
I2C uses open collector I/Os and does not have a IOH Maximum.
IOZ applies to output-only pins, indicating off-state (Hi-Z) output leakage current.
5.6
(1)
(2)
µA
10
-6
I C
IOZ (6)
5
DDR3
I C
IOL
No IPD/IPU
LVCMOS (1.8 V)
2
V
0.4
Internal pulldown
I2C
IOH
0.45
DDR3
2
II (3)
IO = IOL
(2)
°C/W = degrees Celsius per watt.
These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a
JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
Power dissipation of 2 W and an ambient temperature of 70ºC is assumed.
Specifications
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5.7
SPRS814D – MARCH 2012 – REVISED OCTOBER 2019
Timing and Switching Characteristics
5.7.1
SmartReflex
Increasing the device complexity increases its power consumption and with the smaller transistor
structures responsible for higher achievable clock rates and increased performance, comes an inevitable
penalty, increasing the leakage currents. Leakage currents are present in any active circuit, independently
of clock rates and usage scenarios. This static power consumption is mainly determined by transistor type
and process technology. Higher clock rates also increase dynamic power, the power used when
transistors switch. The dynamic power depends mainly on a specific usage scenario, clock rates, and I/O
activity.
TI's SmartReflex technology is used to decrease both static and dynamic power consumption while
maintaining the device performance. SmartReflex in the C665x device is a feature that allows the core
voltage to be optimized based on the process corner of the device. This requires a voltage regulator for
each device.
To ensure maximizing performance and minimizing power consumption of the device, SmartReflex is
required to be implemented whenever the C665x device is used. The voltage selection is done using four
VCNTL pins which are used to select the output voltage of the core voltage regulator.
For information on implementation of SmartReflex see the Power Management for KeyStone Devices
application report and the Hardware Design Guide for KeyStone Devices.
Table 5-1. SmartReflex 4-Pin VID Interface Switching Characteristics
(See Figure 5-1.)
NO.
PARAMETER
MIN
1
td(VCNTL[2:0]-VCNTL[3])
Delay Time - VCNTL[2:0] valid after VCNTL[3] low
2
toh(VCNTL[3] -VCNTL[2:0])
Output Hold Time - VCNTL[2:0] valid after VCNTL[3] low
3
td(VCNTL[2:0]-VCNTL[3])
Delay Time - VCNTL[2:0] valid after VCNTL[3] high
4
toh(VCNTL[3] -VCNTL[2:0])
Output Hold Time - VCNTL[2:0] valid after VCNTL[3] high
5
VCNTL being valid to CVDD being switched to SmartReflex Voltage (2)
(1)
(2)
0.07
0.07
MAX
UNIT
300.00
ns
172020C (1)
ms
300.00
ns
172020C
ms
10
ms
C = 1/SYSCLK1 frequency (see Figure 6-5) in ms
SmartReflex voltage must be set before execution of application code
1.1 V
SRV*
* SRV = Smart Reflex Voltage
CVDD
4
5
VCNTL[3]
1
3
VCNTL[2:0]
LSB VID[2:0]
MSB VID[5:3]
2
Figure 5-1. SmartReflex 4-Pin VID Interface Timing
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5.7.2
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Reset Electrical Data / Timing
Table 5-2. Reset Timing Requirements (1)
(See Figure 5-2 and Figure 5-3.)
NO.
MIN
MAX
UNIT
RESETFULL Pin Reset
1
tw(RESETFULL)
Pulse width - Pulse width RESETFULL low
2
tw(RESET)
Pulse width - Pulse width RESET low
500C
ns
500C
ns
Soft/Hard-Reset
(1)
C = 1 / CORECLK(N|P) frequency in ns.
Table 5-3. Reset Switching Characteristics Over Recommended Operating Conditions (1)
(See Figure 5-2 and Figure 5-3.)
NO.
PARAMETER
MIN
MAX
UNIT
RESETFULL Pin Reset
3
td(RESETFULLHRESETSTATH)
Delay time - RESETSTAT high after RESETFULL high
4
td(RESETH-RESETSTATH)
Delay time - RESETSTAT high after RESET high
50000C
ns
50000C
ns
Soft/Hard Reset
(1)
C = 1 / CORECLK(N|P) frequency in ns.
POR
1
RESETFULL
RESET
3
RESETSTAT
Figure 5-2. RESETFULL Reset Timing
POR
RESETFULL
2
RESET
4
RESETSTAT
Figure 5-3. Soft/Hard-Reset Timing
40
Specifications
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Table 5-4. Boot Configuration Timing Requirements (1)
(See Figure 5-4.)
NO.
1
MIN
MAX
UNIT
tsu(GPIOn-RESETFULL)
Setup time - GPIO valid before RESETFULL asserted
12C
ns
2
th(RESETFULL-GPIOn)
Hold time - GPIO valid after RESETFULL asserted
12C
ns
(1)
C = 1/SYSCLK1 frequency in ns.
POR
1
RESETFULL
GPIO[15:0]
2
Figure 5-4. Boot Configuration Timing
5.7.3
Main PLL Stabilization, Lock, and Reset Times
The PLL stabilization time is the amount of time that must be allotted for the internal PLL regulators to
become stable after device power up. The PLL should not be operated until this stabilization time has
elapsed.
The PLL reset time is the amount of wait time needed when resetting the PLL (writing PLLRST = 1), in
order for the PLL to properly reset, before bringing the PLL out of reset (writing PLLRST = 0). For the
Main PLL reset time value, see Table 5-5.
The PLL lock time is the amount of time needed from when the PLL is taken out of reset (PLLRST = 1
with PLLEN = 0) to when to when the PLL controller can be switched to PLL mode (PLLEN = 1). The Main
PLL lock time is given in Table 5-5.
Table 5-5. Main PLL Stabilization, Lock, and Reset Times
MIN
PLL stabilization time
TYP
PLL lock time
UNIT
µs
500 ×(PLLD
PLL reset time
(1)
(2)
MAX
100
(1)
+1) × C
(2)
1000
ns
PLLD is the value in PLLD bit fields of MAINPLLCTL0 register
C = SYSCLK1(N|P) cycle time in ns.
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Main PLL Controller/SRIO/HyperLink/PCIe Clock Input Electrical Data/Timing
Table 5-6. Main PLL Controller/SRIO/HyperLink/PCIe Clock Input Timing Requirements
(See Figure 5-5 and Figure 5-6.)
NO.
MIN
MAX
UNIT
3.2
25
ns
CORECLK[P:N]
1
tc(CORCLKN)
Cycle time _ CORECLKN cycle time
1
tc(CORECLKP)
Cycle time _ CORECLKP cycle time
3.2
25
ns
3
tw(CORECLKN)
Pulse width _ CORECLKN high
0.45*tc(CORECLKN)
0.55*tc(CORECLKN)
ns
2
tw(CORECLKN)
Pulse width _ CORECLKN low
0.45*tc(CORECLKN)
0.55*tc(CORECLKN)
ns
2
tw(CORECLKP)
Pulse width _ CORECLKP high
0.45*tc(CORECLKP)
0.55*tc(CORECLKP)
ns
3
tw(CORECLKP)
Pulse width _ CORECLKP low
0.45*tc(CORECLKP)
0.55*tc(CORECLKP)
ns
4
tr(CORECLK_250mv)
Transition time _ CORECLK differential rise
time (250mV)
50
350
ps
4
tf(CORECLK_250mv)
Transition time _ CORECLK differential fall time
(250 mV)
50
350
ps
5
tj(CORECLKN)
Jitter, peak_to_peak _ periodic CORECLKN
100
ps
5
tj(CORECLKP)
Jitter, peak_to_peak _ periodic CORECLKP
100
ps
SRIOSGMIICLK[P:N]
1
tc(SRIOSGMIICLKN)
Cycle time _ SRIOSGMIICLKN cycle time
3.2 or 4 or 6.4
ns
1
tc(SRIOSGMIICLKP)
Cycle time _ SRIOSGMIICLKP cycle time
3.2 or 4 or 6.4
ns
3
tw(SRIOSGMIICLKN)
Pulse with _ SRIOSGMIICLKN high
0.45*tc(SRIOSGMIICLKN)
0.55*tc(SRIOSGMIICLKN)
ns
2
tw(SRIOSGMIICLKN)
Pulse width _ SRIOSGMIICLKN low
0.45*tc(SRIOSGMIICLKN)
0.55*tc(SRIOSGMIICLKN)
ns
2
tw(SRIOSGMIICLKP)
Pulse width _ SRIOSGMIICLKP high
0.45*tc(SRIOSGMIICLKP)
0.55*tc(SRIOSGMIICLKP)
ns
3
tw(SRIOSGMIICLKP)
Pulse width _ SRIOSGMIICLKP low
0.45*tc(SRIOSGMIICLKP)
0.55*tc(SRIOSGMIICLKP)
ns
4
tr(SRIOSGMIICLK_250mv) Transition time _ SRIOSGMIICLK differential
rise time (250 mV)
50
350
ps
4
tf(SRIOSGMIICLK_250mv) Transition time _ SRIOSGMIICLK differential fall
time (250 mV)
50
350
ps
5
tj(SRIOSGMIICLKN)
Jitter, peak_to_peak _ periodic
SRIOSGMIICLKN
5
tj(SRIOSGMIICLKP)
Jitter, peak_to_peak _ periodic
SRIOSGMIICLKP
4
ps,RMS
5
tj(SRIOSGMIICLKN)
Jitter, peak_to_peak _ periodic
SRIOSGMIICLKN (SRIO not used)
8
ps,RMS
5
tj(SRIOSGMIICLKP)
Jitter, peak_to_peak _ periodic
SRIOSGMIICLKP (SRIO not used)
8
ps,RMS
1
tc(MCMCLKN)
Cycle time _ MCMCLKN cycle time
3.2
6.4
ns
1
tc(MCMCLKP)
Cycle time _ MCMCLKP cycle time
3.2
6.4
ns
3
tw(MCMCLKN)
Pulse width _ MCMCLKN high
0.45*tc(MCMCLKN)
0.55*tc(MCMCLKN)
ns
2
tw(MCMCLKN)
Pulse width _ MCMCLKN low
0.45*tc(MCMCLKN)
0.55*tc(MCMCLKN)
ns
2
tw(MCMCLKP)
Pulse width _ MCMCLKP high
0.45*tc(MCMCLKP)
0.55*tc(MCMCLKP)
ns
3
tw(MCMCLKP)
Pulse width _ MCMCLKP low
0.45*tc(MCMCLKP)
0.55*tc(MCMCLKP)
ns
4
tr(MCMCLK_250mv)
Transition time _ MCMCLK differential rise time
(250mV)
50
350
ps
4
tf(MCMCLK_250mv)
Transition time _ MCMCLK differential fall time
(250mV)
50
350
ps
5
tj(MCMCLKN)
Jitter, peak_to_peak _ periodic MCMCLKN
4
ps,RMS
5
tj(MCMCLKP)
Jitter, peak_to_peak _ periodic MCMCLKP
4
ps,RMS
4
ps,RMS
HyperLinkCLK[P:N]
PCIECLK[P:N]
1
tc(PCIECLKN)
Cycle time _ PCIECLKN cycle time
3.2
10
ns
1
tc(PCIECLKP)
Cycle time _ PCIECLKP cycle time
3.2
10
ns
3
tw(PCIECLKN)
Pulse width _ PCIECLKN high
0.45*tc(PCIECLKN)
0.55*tc(PCIECLKN)
ns
2
tw(PCIECLKN)
Pulse width _ PCIECLKN low
0.45*tc(PCIECLKN)
0.55*tc(PCIECLKN)
ns
2
tw(PCIECLKP)
Pulse width _ PCIECLKP high
0.45*tc(PCIECLKP)
0.55*tc(PCIECLKP)
ns
3
tw(PCIECLKP)
Pulse width _ PCIECLKP low
0.45*tc(PCIECLKP)
0.55*tc(PCIECLKP)
ns
42
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Table 5-6. Main PLL Controller/SRIO/HyperLink/PCIe Clock Input Timing Requirements (continued)
(See Figure 5-5 and Figure 5-6.)
MIN
MAX
UNIT
4
NO.
tr(PCIECLK_250mv)
Transition time _ PCIECLK differential rise time
(250 mV)
50
350
ps
4
tf(PCIECLK_250mv)
Transition time _ PCIECLK differential fall time
(250 mV)
50
350
ps
5
tj(PCIECLKN)
Jitter, peak_to_peak _ periodic PCIECLKN
4
ps,RMS
5
tj(PCIECLKP)
Jitter, peak_to_peak _ periodic PCIECLKP
4
ps,RMS
1
2
3
<CLK_NAME>CLKN
<CLK_NAME>CLKP
5
4
Figure 5-5. Main PLL Controller/SRIO/HyperLink/PCIe Clock Input Timing
peak-to-peak differential input
voltage (250mV to 2 V)
250mV peak-to-peak
0
TR = 50 ps min to 350 ps max (10% to 90 %)
for the 250mV peak-to-peak centered at zero crossing
Figure 5-6. Main PLL Clock Input Transition Time
5.7.5
DDR3 PLL Input Clock Electrical Data/Timing
Table 5-7. DDR3 PLL DDRSYSCLK1(N|P) Timing Requirements
(See Figure 5-7 and Figure 5-6.)
NO
MIN
MAX
UNIT
3.2
25
ns
DDRCLK[P:N]
1
tc(DDRCLKN)
Cycle time _ DDRCLKN cycle time
1
tc(DDRCLKP)
Cycle time _ DDRCLKP cycle time
3.2
25
ns
3
tw(DDRCLKN)
Pulse width _ DDRCLKN high
0.45*tc(DDRCLKN)
0.55*tc(DDRCLKN)
ns
2
tw(DDRCLKN)
Pulse width _ DDRCLKN low
0.45*tc(DDRCLKN)
0.55*tc(DDRCLKN)
ns
2
tw(DDRCLKP)
Pulse width _ DDRCLKP high
0.45*tc(DDRCLKP)
0.55*tc(DDRCLKP)
ns
3
tw(DDRCLKP)
Pulse width _ DDRCLKP low
0.45*tc(DDRCLKP)
0.55*tc(DDRCLKP)
ns
4
tr(DDRCLK_250mv)
Transition time _ DDRCLK differential rise time (250 mV)
50
350
ps
4
tf(DDRCLK_250mv)
Transition time _ DDRCLK differential fall time (250 mV)
50
350
ps
5
tj(DDRCLKN)
Jitter, peak_to_peak _ periodic DDRCLKN
0.025*tc(DDRCLKN)
ps
5
tj(DDRCLKP)
Jitter, peak_to_peak _ periodic DDRCLKP
0.025*tc(DDRCLKP)
ps
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1
2
3
DDRCLKN
DDRCLKP
5
4
Figure 5-7. DDR3 PLL DDRCLK Timing
5.7.6
External Interrupts Electrical Data/Timing
Table 5-8. NMI and Local Reset Timing Requirements (1)
(See Figure 5-8.)
NO.
MIN
MAX
UNIT
1
tsu(LRESET-LRESETNMIENL)
Setup Time - LRESET valid before LRESETNMIEN low
12*P
ns
1
tsu(NMI-LRESETNMIENL)
Setup Time - NMI valid before LRESETNMIEN low
12*P
ns
1
tsu(CORESELn-LRESETNMIENL)
Setup Time - CORESEL[2:0] valid before LRESETNMIEN low
12*P
ns
2
th(LRESETNMIENL-LRESET)
Hold Time - LRESET valid after LRESETNMIEN high
12*P
ns
2
th(LRESETNMIENL-NMI)
Hold Time - NMI valid after LRESETNMIEN high
12*P
ns
2
th(LRESETNMIENL-CORESELn)
Hold Time - CORESEL[2:0] valid after LRESETNMIEN high
12*P
ns
3
tw(LRESETNMIEN)
Pulse Width - LRESETNMIEN low width
12*P
ns
(1)
P = 1/SYSCLK1 clock frequency in ns.
1
2
CORESEL[3:0]/
LRESET/
NMI
3
LRESETNMIEN
Figure 5-8. NMI and Local Reset Timing
5.7.7
DDR3 Memory Controller Electrical Data/Timing
The KeyStone DSP DDR3 Implementation Guidelines specifies a complete DDR3 interface solution as
well as a list of compatible DDR3 devices. The DDR3 electrical requirements are fully specified in the
DDR3 Jedec Specification JESD79-3C. TI has performed the simulation and system characterization to
ensure all DDR3 interface timings in this solution are met; therefore, no electrical data/timing information is
supplied here for this interface.
NOTE
TI supports only designs that follow the board design guidelines outlined in the application
report.
44
Specifications
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SPRS814D – MARCH 2012 – REVISED OCTOBER 2019
I2C Electrical Data/Timing
5.7.8
5.7.8.1
Inter-Integrated Circuits (I2C) Timing
Table 5-9. I2C Timing Requirements (1)
(See Figure 5-9.)
STANDARD MODE
NO.
1
MIN
MAX
FAST MODE
MIN
MAX
UNIT
tc(SCL)
Cycle time, SCL
10
2.5
µs
tsu(SCLH-SDAL)
Setup time, SCL high before SDA low (for a repeated Start
condition)
4.7
0.6
µs
th(SDAL-SCLL)
Hold time, SCL low after SDA low (for a Start and a
repeated Start condition)
4
0.6
µs
4
tw(SCLL)
Pulse duration, SCL low
4.7
1.3
µs
5
tw(SCLH)
Pulse duration, SCL high
4
0.6
µs
(2)
2
3
6
tsu(SDAV-SCLH)
Setup time, SDA valid before SCL high
250
7
th(SCLL-SDAV)
Hold time, SDA valid after SCL low (for I2C bus devices)
0 (3)
tw(SDAH)
Pulse duration, SDA high between Stop and Start
conditions
4.7
9
tr(SDA)
Rise time, SDA
1000 20 + 0.1Cb (5)
300
ns
10
tr(SCL)
Rise time, SCL
1000
20 + 0.1Cb (5)
300
ns
11
tf(SDA)
Fall time, SDA
300
20 + 0.1Cb (5)
300
ns
300
(5)
300
8
12
tf(SCL)
Fall time, SCL
13
tsu(SCLH-SDAH)
Setup time, SCL high before SDA high (for Stop condition)
14
tw(SP)
Pulse duration, spike (must be suppressed)
15
(5)
(1)
(2)
(3)
(4)
(5)
Cb
100
ns
0 (3)
3.45
0.9 (4)
1.3
20 + 0.1Cb
4
µs
0.6
ns
µs
0
Capacitive load for each bus line
µs
400
50
ns
400
pF
The I2C pins SDA and SCL do not feature fail-safe I/O buffers. These pins could potentially draw current when the device is powered
down
A Fast-mode I2C-bus™ device can be used in a Standard-mode I2C-bus™ system, but the requirement tsu(SDA-SCLH) ≥ 250 ns must
then be met. This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such a device does
stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line tr max + tsu(SDA-SCLH) = 1000 + 250 = 1250 ns
(according to the Standard-mode I2C-Bus Specification) before the SCL line is released.
A device must internally provide a hold time of at least 300 ns for the SDA signal (referred to the VIHmin of the SCL signal) to bridge the
undefined region of the falling edge of SCL.
The maximum th(SDA-SCLL) has only to be met if the device does not stretch the low period [tw(SCLL)] of the SCL signal.
Cb = total capacitance of one bus line in pF. If mixed with HS-mode devices, faster fall-times are allowed.
11
9
SDA
8
6
4
14
13
5
10
SCL
1
3
12
7
2
3
Stop
Start
Repeated
Start
Stop
Figure 5-9. I2C Receive Timings
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Table 5-10. I2C Switching Characteristics (1)
(See Figure 5-10.)
STANDARD MODE
NO.
16
PARAMETER
MIN
FAST MODE
MAX
MIN
MAX UNIT
tc(SCL)
Cycle time, SCL
10
2.5
ms
tsu(SCLH-SDAL)
Setup time, SCL high to SDA low (for a repeated Start
condition)
4.7
0.6
ms
th(SDAL-SCLL)
Hold time, SDA low after SCL low (for a Start and a
repeated Start condition)
4
0.6
ms
19
tw(SCLL)
Pulse duration, SCL low
4.7
1.3
ms
20
tw(SCLH)
Pulse duration, SCL high
4
0.6
ms
21
td(SDAV-SDLH)
Delay time, SDA valid to SCL high
250
100
22
tv(SDLL-SDAV)
Valid time, SDA valid after SCL low (for I2C bus devices)
0
0
tw(SDAH)
Pulse duration, SDA high between Stop and Start
conditions
4.7
1.3
24
tr(SDA)
Rise time, SDA
1000
20 + 0.1Cb (1)
300
ns
25
tr(SCL)
Rise time, SCL
1000
20 + 0.1Cb (1)
300
ns
26
tf(SDA)
Fall time, SDA
300
20 + 0.1Cb (1)
300
ns
300
(1)
300
17
18
23
27
tf(SCL)
Fall time, SCL
28
td(SCLH-SDAH)
Delay time, SCL high to SDA high (for Stop condition)
29
Cp
Capacitance for each I2C pin
(1)
20 + 0.1Cb
4
ns
0.9
ms
ms
0.6
ns
ms
10
10
pF
Cb = total capacitance of one bus line in pF. If mixed with HS-mode devices, faster fall-times are allowed.
26
24
SDA
23
21
19
28
20
25
SCL
16
18
27
22
17
18
Stop
Start
Repeated
Start
Stop
Figure 5-10. I2C Transmit Timings
46
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5.7.9
SPRS814D – MARCH 2012 – REVISED OCTOBER 2019
SPI Peripheral
The serial peripheral interconnect (SPI) module provides an interface between the DSP and other SPIcompliant devices. The primary intent of this interface is to allow for connection to an SPI ROM for boot.
The SPI module on the C665x is supported only in master mode. Additional chip-level components can
also be included, such as temperature sensors or an I/O expander.
5.7.9.1
SPI Timing
Table 5-11. SPI Timing Requirements
(See Figure 5-11.)
NO.
MIN
MAX UNIT
Master Mode Timing Diagrams — Base Timings for 3-Pin Mode
7
tsu(SDI-SPC)
Input Setup Time, SPIDIN valid before receive edge of SPICLK. Polarity = 0 Phase = 0
2
ns
7
tsu(SDI-SPC)
Input Setup Time, SPIDIN valid before receive edge of SPICLK. Polarity = 0 Phase = 1
2
ns
7
tsu(SDI-SPC)
Input Setup Time, SPIDIN valid before receive edge of SPICLK. Polarity = 1 Phase = 0
2
ns
7
tsu(SDI-SPC)
Input Setup Time, SPIDIN valid before receive edge of SPICLK. Polarity = 1 Phase = 1
2
ns
8
th(SPC-SDI)
Input Hold Time, SPIDIN valid after receive edge of SPICLK. Polarity = 0 Phase = 0
5
ns
8
th(SPC-SDI)
Input Hold Time, SPIDIN valid after receive edge of SPICLK. Polarity = 0 Phase = 1
5
ns
8
th(SPC-SDI)
Input Hold Time, SPIDIN valid after receive edge of SPICLK. Polarity = 1 Phase = 0
5
ns
8
th(SPC-SDI)
Input Hold Time, SPIDIN valid after receive edge of SPICLK. Polarity = 1 Phase = 1
5
ns
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Table 5-12. SPI Switching Characteristics
(See Figure 5-11 and Figure 5-12.)
NO.
PARAMETER
MIN
MAX
UNIT
Master Mode Timing Diagrams — Base Timings for 3-Pin Mode
3*P2 (1)
ns
Pulse Width High, SPICLK, All Master Modes
0.5*tc - 1
ns
tw(SPCL)
Pulse Width Low, SPICLK, All Master Modes
0.5*tc - 1
4
td(SDO-SPC)
Setup (Delay), initial data bit valid on SPIDOUT to initial edge on SPICLK.
Polarity = 0, Phase = 0
5
ns
4
td(SDO-SPC)
Setup (Delay), initial data bit valid on SPIDOUT to initial edge on SPICLK.
Polarity = 0, Phase = 1
5
ns
4
td(SDO-SPC)
Setup (Delay), initial data bit valid on SPIDOUT to initial edge on SPICLK.
Polarity = 1, Phase = 0
5
ns
4
td(SDO-SPC)
Setup (Delay), initial data bit valid on SPIDOUT to initial edge on SPICLK.
Polarity = 1, Phase = 1
5
ns
5
td(SPC-SDO)
Setup (Delay), subsequent data bits valid on SPIDOUT to initial edge on
SPICLK.. Polarity = 0 Phase = 0
2
ns
5
td(SPC-SDO)
Setup (Delay), subsequent data bits valid on SPIDOUT to initial edge on
SPICLK. Polarity = 0 Phase = 1
2
ns
5
td(SPC-SDO)
Setup (Delay), subsequent data bits valid on SPIDOUT to initial edge on
SPICLK. Polarity = 1 Phase = 0
2
ns
5
td(SPC-SDO)
Setup (Delay), subsequent data bits valid on SPIDOUT to initial edge on
SPICLK. Polarity = 1 Phase = 1
2
ns
6
toh(SPC-SDO)
Output hold time, SPIDOUT valid after receive edge of SPICLK except for final
bit. Polarity = 0 Phase = 0
0.5*tc - 2
ns
6
toh(SPC-SDO)
Output hold time, SPIDOUT valid after receive edge of SPICLK except for final
bit. Polarity = 0 Phase = 1
0.5*tc - 2
ns
6
toh(SPC-SDO)
Output hold time, SPIDOUT valid after receive edge of SPICLK except for final
bit. Polarity = 1 Phase = 0
0.5*tc - 2
ns
6
toh(SPC-SDO)
Output hold time, SPIDOUT valid after receive edge of SPICLK except for final
bit. Polarity = 1 Phase = 1
0.5*tc - 2
ns
19
td(SCS-SPC)
Delay from SPISCS[n] active to first SPICLK. Polarity = 0 Phase = 0
2*P2 - 5
2*P2 + 5
ns
19
td(SCS-SPC)
Delay from SPISCS[n] active to first SPICLK. Polarity = 0 Phase = 1
0.5*tc + (2*P2) - 5
0.5*tc + (2*P2) + 5
ns
19
td(SCS-SPC)
Delay from SPISCS[n] active to first SPICLK. Polarity = 1 Phase = 0
2*P2 - 5
2*P2 + 5
ns
19
td(SCS-SPC)
Delay from SPISCS[n] active to first SPICLK. Polarity = 1 Phase = 1
0.5*tc + (2*P2) - 5
0.5*tc + (2*P2) + 5
ns
20
td(SPC-SCS)
Delay from final SPICLK edge to master deasserting SPISCS[n]. Polarity = 0
Phase = 0
1*P2 - 5
1*P2 + 5
ns
20
td(SPC-SCS)
Delay from final SPICLK edge to master deasserting SPISCS[n]. Polarity = 0
Phase = 1
0.5*tc + (1*P2) - 5
0.5*tc + (1*P2) + 5
ns
20
td(SPC-SCS)
Delay from final SPICLK edge to master deasserting SPISCS[n]. Polarity = 1
Phase = 0
1*P2 - 5
1*P2 + 5
ns
20
td(SPC-SCS)
Delay from final SPICLK edge to master deasserting SPISCS[n]. Polarity = 1
Phase = 1
0.5*tc + (1*P2) - 5
0.5*tc + (1*P2) + 5
ns
tw(SCSH)
Minimum inactive time on SPISCS[n] pin between two transfers when SPISCS[n]
is not held using the CSHOLD feature.
1
tc(SPC)
Cycle Time, SPICLK, All Master Modes
2
tw(SPCH)
3
ns
Additional SPI Master Timings — 4-Pin Mode with Chip Select Option
(1)
P2 = 1/SYSCLK7
48
Specifications
2*P2 - 5
ns
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1
2
MASTER MODE
POLARITY = 0 PHASE = 0
3
SPICLK
5
4
MO(0)
SPIDOUT
7
MO(1)
MO(n−1)
MO(n)
MI(n−1)
MI(n)
8
MI(0)
SPIDIN
6
MI(1)
MASTER MODE
POLARITY = 0 PHASE = 1
4
SPICLK
6
5
MO(0)
SPIDOUT
7
MO(n−1)
MO(n)
MI(1)
MI(n−1)
MI(n)
8
MI(0)
SPIDIN
MO(1)
4
MASTER MODE
POLARITY = 1 PHASE = 0
SPICLK
5
6
MO(0)
SPIDOUT
7
MO(1)
MO(n)
8
MI(0)
SPIDIN
MO(n−1)
MI(1)
MI(n−1)
MI(n)
MASTER MODE
POLARITY = 1 PHASE = 1
SPICLK
5
4
MO(0)
SPIDOUT
7
MO(1)
MO(n−1)
MO(n)
MI(1)
MI(n−1)
MI(n)
8
MI(0)
SPIDIN
6
Figure 5-11. SPI Master Mode Timing Diagrams — Base Timings for 3-Pin Mode
MASTER MODE 4 PIN WITH CHIP SELECT
19
20
SPICLK
MO(0)
SPIDOUT
MI(0)
SPIDIN
MO(1)
MO(n−1)
MO(n)
MI(1)
MI(n−1)
MI(n)
SPISCSx
Figure 5-12. SPI Additional Timings for 4-Pin Master Mode With Chip Select Option
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5.7.10 HyperLink Electrical Data/Timing
Table 5-13, Table 5-14, Figure 5-13, Figure 5-14, and Figure 5-15 below describe the timing requirements
and switching characteristics of HyperLink peripheral.
Table 5-13. HyperLink Peripheral Timing Requirements
See Figure 5-13, Figure 5-14, Figure 5-15
NO.
MIN
MAX UNIT
FL Interface
1
tc(MCMTXFLCLK)
Clock period - MCMTXFLCLK (C1)
2
tw(MCMTXFLCLKH)
High pulse width - MCMTXFLCLK
0.4*C1
0.6*C1
ns
3
tw(MCMTXFLCLKL)
Low pulse width - MCMTXFLCLK
0.4*C1
0.6*C1
ns
tsu(MCMTXFLDAT-MCMTXFLCLKH)
Setup time - MCMTXFLDAT valid before
MCMTXFLCLK high
1
th(MCMTXFLCLKH-MCMTXFLDAT)
Hold time - MCMTXFLDAT valid after MCMTXFLCLK
high
1
tsu(MCMTXFLDAT-MCMTXFLCLKL)
Setup time - MCMTXFLDAT valid before
MCMTXFLCLK low
1
th(MCMTXFLCLKL-MCMTXFLDAT)
Hold time - MCMTXFLDAT valid after MCMTXFLCLK
low
1
1
tc(MCMRXPMCLK)
Clock period - MCMRXPMCLK (C3)
2
tw(MCMRXPMCLK)
High pulse width - MCMRXPMCLK
0.4*C3
0.6*C3
ns
3
tw(MCMRXPMCLK)
Low pulse width - MCMRXPMCLK
0.4*C3
0.6*C3
ns
tsu(MCMRXPMDAT-MCMRXPMCLKH)
Setup time - MCMRXPMDAT valid before
MCMRXPMCLK high
1
th(MCMRXPMCLKH-MCMRXPMDAT)
Hold time - MCMRXPMDAT valid after
MCMRXPMCLK high
1
tsu(MCMRXPMDAT-MCMRXPMCLKL)
Setup time - MCMRXPMDAT valid before
MCMRXPMCLK low
1
th(MCMRXPMCLKL-MCMRXPMDAT)
Hold time - MCMRXPMDAT valid after
MCMRXPMCLK low
1
6
7
6
7
6.4
ns
ns
ns
ns
ns
PM Interface
6
7
6
7
50
Specifications
6.4
ns
ns
ns
ns
ns
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Table 5-14. HyperLink Peripheral Switching Characteristics
See Figure 5-13, Figure 5-14, Figure 5-15
NO.
PARAMETER
MIN
MAX UNIT
FL Interface
1
tc(MCMRXFLCLK)
Clock period - MCMRXFLCLK (C2)
2
tw(MCMRXFLCLKH)
High pulse width - MCMRXFLCLK
0.4*C2
0.6*C2
ns
3
tw(MCMRXFLCLKL)
Low pulse width - MCMRXFLCLK
0.4*C2
0.6*C2
ns
4
Setup time - MCMRXFLDAT valid before
tosu(MCMRXFLDAT-MCMRXFLCLKH)
MCMRXFLCLK high
5
6.4
ns
ns
0.25*C2-0.4
toh(MCMRXFLCLKH-MCMRXFLDAT)
Hold time - MCMRXFLDAT valid after MCMRXFLCLK
high
0.25*C2-0.4
tosu(MCMRXFLDAT-MCMRXFLCLKL)
Setup time - MCMRXFLDAT valid before
MCMRXFLCLK low
0.25*C2-0.4
toh(MCMRXFLCLKL-MCMRXFLDAT)
Hold time - MCMRXFLDAT valid after MCMRXFLCLK
low
0.25*C2-0.4
1
tc(MCMTXPMCLK)
Clock period - MCMTXPMCLK (C4)
2
tw(MCMTXPMCLK)
High pulse width - MCMTXPMCLK
0.4*C4
0.6*C4
ns
3
tw(MCMTXPMCLK)
Low pulse width - MCMTXPMCLK
0.4*C4
0.6*C4
ns
4
tosu(MCMTXPMDATMCMTXPMCLKH)
Setup time - MCMTXPMDAT valid before
MCMTXPMCLK high
0.25*C4-0.4
toh(MCMTXPMCLKH-MCMTXPMDAT)
Hold time - MCMTXPMDAT valid after MCMTXPMCLK
high
0.25*C4-0.4
tosu(MCMTXPMDATMCMTXPMCLKL)
Setup time - MCMTXPMDAT valid before
MCMTXPMCLK low
0.25*C4-0.4
toh(MCMTXPMCLKL-MCMTXPMDAT)
Hold time - MCMTXPMDAT valid after MCMTXPMCLK
low
0.25*C4-0.4
4
5
ns
ns
ns
PM Interface
5
4
5
6.4
ns
ns
ns
ns
ns
1
2
3
Figure 5-13. HyperLink Station Management Clock Timing
4
5
4
5
MCMTX<xx>CLK
MCMTX<xx>DAT
A.
<xx> represents the interface that is being used: PM or FL
Figure 5-14. HyperLink Station Management Transmit Timing
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6
7
6
7
MCMRX<xx>CLK
MCMRX<xx>DAT
A.
<xx> represents the interface that is being used: PM or FL
Figure 5-15. HyperLink Station Management Receive Timing
5.7.11 UART Peripheral
The universal asynchronous receiver/transmitter (UART) module provides an interface between the DSP
and a UART terminal interface or other UART-based peripheral. The UART is based on the industry
standard TL16C550 asynchronous communications element, which, in turn, is a functional upgrade of the
TL16C450. Functionally similar to the TL16C450 on power up (single character or TL16C450 mode), the
UART can be placed in an alternate FIFO (TL16C550) mode. This relieves the DSP of excessive software
overhead by buffering received and transmitted characters. The receiver and transmitter FIFOs store up to
16 bytes including three additional bits of error status per byte for the receiver FIFO.
The UART performs serial-to-parallel conversions on data received from a peripheral device and parallelto-serial conversion on data received from the DSP. The DSP can read the UART status at any time. The
UART includes control capability and a processor interrupt system that can be tailored to minimize
software management of the communications link. For more information on UART, see the Universal
Asynchronous Receiver/Transmitter (UART) for KeyStone Devices User's Guide.
Table 5-15. UART Timing Requirements
(See Figure 5-16 and Figure 5-17.)
NO.
MIN
MAX
UNIT
0.96U (1)
Receive Timing
4
tw(RXSTART)
Pulse width, receive Start bit
1.05U
ns
5
tw(RXH)
Pulse width, receive data/parity bit high
0.96U
1.05U
ns
5
tw(RXL)
Pulse width, receive data/parity bit low
0.96U
1.05U
ns
6
tw(RXSTOP1)
Pulse width, receive Stop bit 1
0.96U
1.05U
ns
6
tw(RXSTOP15)
Pulse width, receive Stop bit 1.5
1.5*(0.96U)
1.5*(1.05U)
ns
6
tw(RXSTOP2)
Pulse width, receive Stop bit 2
2*(0.96U)
2*(1.05U)
ns
P (2)
5P
ns
Autoflow Timing Requirements
8
td(CTSL-TX)
(1)
(2)
Delay time, CTS asserted to Start bit transmit
U = UART baud time = 1/programmed baud rate
P = 1/SYSCLK7
4
RXD
Stop/Idle
Start
5
Bit 0
5
Bit 1
Bit N-1
Bit N
Parity
6
Stop
Idle
Start
Figure 5-16. UART Receive Timing Waveform
52
Specifications
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8
TXD
Bit N-1
Bit N
Stop
Start
Bit 0
CTS
Figure 5-17. UART CTS (Clear-to-Send Input) — Autoflow Timing Waveform
Table 5-16. UART Switching Characteristics
(See Figure 5-18 and Figure 5-19.)
NO.
PARAMETER
MIN
MAX
UNIT
U (1) - 2
U+2
ns
Transmit Timing
1
tw(TXSTART)
Pulse width, transmit Start bit
2
tw(TXH)
Pulse width, transmit data/parity bit high
U-2
U+2
ns
2
tw(TXL)
Pulse width, transmit data/parity bit low
U-2
U+2
ns
3
tw(TXSTOP1)
Pulse width, transmit Stop bit 1
U-2
U+2
ns
3
tw(TXSTOP15)
Pulse width, transmit Stop bit 1.5
1.5 * (U - 2)
1.5 * ('U + 2)
ns
3
tw(TXSTOP2)
Pulse width, transmit Stop bit 2
2 * (U - 2)
2 * ('U + 2)
ns
P (2)
5P
ns
Autoflow Timing Requirements
7
td(RX-RTSH)
(1)
(2)
Delay time, Stop bit received to RTS deasserted
U = UART baud time = 1/programmed baud rate
P = 1/SYSCLK7
1
TXD
Start
Stop/Idle
2
2
Bit 1
Bit 0
Bit N-1
Bit N
Parity
3
Stop
Idle
Start
Figure 5-18. UART Transmit Timing Waveform
7
RXD
Bit N-1
Bit N
Stop
Start
CTS
Figure 5-19. UART RTS (Request-to-Send Output) — Autoflow Timing Waveform
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5.7.12 EMIF16 Peripheral
The EMIF16 module provides an interface between DSP and external memories such as NAND and NOR
flash. For more information, see the External Memory Interface (EMIF16) for KeyStone Devices User's
Guide.
5.7.12.1 EMIF16 Electrical Data/Timing
Table 5-17. EMIF16 Asynchronous Memory Timing Requirements (1) (2)
(See Figure 5-20 and Figure 5-21.)
NO.
MIN
MAX
UNIT
General Timing
2
tw(WAIT)
Pulse duration, WAIT assertion and deassertion minimum time
2E
ns
28
td(WAIT-WEH)
14
td(WAIT-OEH)
Setup time, WAIT asserted before WE high
4E + 3
ns
Setup time, WAIT asserted before OE high
4E + 3
ns
Read Timing
3
3
tC(CEL)
tC(CEL)
EMIF read cycle time when ew = 0, meaning not in extended wait mode
(RS+RST+RH+3
)*E-3
(RS+RST+RH+3
)*E+3
ns
EMIF read cycle time when ew =1, meaning extended wait mode enabled
(RS+RST+WAIT
+RH+3)*E-3
(RS+RST+WAIT
+RH+3)*E+3
ns
4
tosu(CEL-OEL)
Output setup time from CE low to OE low. SS = 0, not in select strobe mode
(RS+1) * E - 3
(RS+1) * E + 3
ns
5
toh(OEH-CEH)
Output hold time from OE high to CE high. SS = 0, not in select strobe mode
(RH+1) * E - 3
(RH+1) * E + 3
ns
4
tosu(CEL-OEL)
Output setup time from CE low to OE low in select strobe mode, SS = 1
(RS+1) * E - 3
(RS+1) * E + 3
ns
5
toh(OEH-CEH)
Output hold time from OE high to CE high in select strobe mode, SS = 1
(RH+1) * E - 3
(RH+1) * E + 3
ns
6
tosu(BAV-OEL)
Output setup time from BA valid to OE low
(RS+1) * E - 3
(RS+1) * E + 3
ns
7
toh(OEH-BAIV)
Output hold time from OE high to BA invalid
(RH+1) * E - 3
(RH+1) * E + 3
ns
8
tosu(AV-OEL)
Output setup time from A valid to OE low
(RS+1) * E - 3
(RS+1) * E + 3
ns
9
toh(OEH-AIV)
Output hold time from OE high to A invalid
(RH+1) * E - 3
(RH+1) * E + 3
ns
10
tw(OEL)
OE active time low, when ew = 0. Extended wait mode is disabled.
(RST+1) * E - 3
(RST+1) * E + 3
ns
10
tw(OEL)
OE active time low, when ew = 1. Extended wait mode is enabled.
(RST+1) * E - 3
(RST+1) * E + 3
ns
11
td(WAITH-OEH)
Delay time from WAIT deasserted to OE high
4E + 3
ns
12
tsu(D-OEH)
Input setup time from D valid to OE high
3
ns
13
th(OEH-D)
Input hold time from OE high to D invalid
0.5
ns
Write Timing
15
15
tc(CEL)
tc(CEL)
EMIF write cycle time when ew = 0, meaning not in extended wait mode
EMIF write cycle time when ew =1., meaning extended wait mode is enabled
(WS+WST+WH+
3)*E-3
(WS+WST+WH+
3)*E+3
ns
(WS+WST+WAI
T+WH+3)*E-3
(WS+WST+WAI
T+WH+3)*E+3
ns
16
tosuCEL-WEL)
Output setup time from CE low to WE low. SS = 0, not in select strobe mode
(WS+1) * E - 3
ns
17
toh(WEH-CEH)
Output hold time from WE high to CE high. SS = 0, not in select strobe mode
(WH+1) * E - 3
ns
16
tosuCEL-WEL)
Output setup time from CE low to WE low in select strobe mode, SS = 1
(WS+1) * E - 3
ns
17
toh(WEH-CEH)
Output hold time from WE high to CE high in select strobe mode, SS = 1
(WH+1) * E - 3
ns
18
tosu(RNW-WEL)
Output setup time from RNW valid to WE low
(WS+1) * E - 3
ns
19
toh(WEH-RNW)
Output hold time from WE high to RNW invalid
(WH+1) * E - 3
ns
20
tosu(BAV-WEL)
Output setup time from BA valid to WE low
(WS+1) * E - 3
ns
21
toh(WEH-BAIV)
Output hold time from WE high to BA invalid
(WH+1) * E - 3
ns
22
tosu(AV-WEL)
Output setup time from A valid to WE low
(WS+1) * E - 3
ns
23
toh(WEH-AIV)
Output hold time from WE high to A invalid
(WH+1) * E - 3
ns
24
tw(WEL)
WE active time low, when ew = 0. Extended wait mode is disabled.
(WST+1) * E - 3
ns
24
tw(WEL)
WE active time low, when ew = 1. Extended wait mode is enabled.
(WST+1) * E - 3
ns
26
tosu(DV-WEL)
Output setup time from D valid to WE low
(WS+1) * E - 3
ns
27
toh(WEH-DIV)
Output hold time from WE high to D invalid
(WH+1) * E - 3
25
td(WAITH-WEH)
Delay time from WAIT deasserted to WE high
(1)
(2)
54
ns
4E + 3
ns
E = 1/SYSCLK7, RS = Read Setup, RST = Read Strobe, RH = Read Hold, WS = Write Setup, WST = Write Strobe, WH = Write Hold.
WAIT = number of cycles wait is asserted between the programmed end of the strobe period and wait deassertion.
Specifications
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3
EM_CE[3:0]
EM_R/W
EM_BA[1:0]
EM_A[21:0]
9
7
5
4
6
8
10
EM_OE
13
12
EM_D[15:0]
EM_WE
Figure 5-20. EMIF16 Asynchronous Memory Read Timing Diagram
15
EM_CE[3:0]
EM_R/W
EM_BA[1:0]
EM_A[21:0]
16
18
20
22
19
21
23
17
24
EM_WE
26
27
EM_D[15:0]
EM_OE
Figure 5-21. EMIF16 Asynchronous Memory Write Timing Diagram
Setup
Extended Due to EM_WAIT
Strobe
Strobe
Hold
EM_CE[3:0]
EM_BA[1:0]
EM_A[21:0]
EM_D[15:0]
EM_OE
14
11
EM_WAIT
2
2
Asserted
Deasserted
Figure 5-22. EMIF16 EM_WAIT Read Timing Diagram
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Setup
EM_CE[3:0]
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Extended Due to EM_WAIT
Strobe
Hold
Strobe
EM_BA[1:0]
EM_A[21:0]
EM_D[15:0]
EM_WE
28
25
EM_WAIT
2
2
Asserted
Deasserted
Figure 5-23. EMIF16 EM_WAIT Write Timing Diagram
5.7.13 MDIO Timing
Table 5-18. MDIO Timing Requirements
(See Figure 5-24.)
NO.
MIN
MAX
UNIT
1
tc(MDCLK)
Cycle time, MDCLK
400
ns
2
tw(MDCLKH)
Pulse duration, MDCLK high
180
ns
3
tw(MDCLKL)
Pulse duration, MDCLK low
180
ns
4
tsu(MDIOMDCLKH)
Setup time, MDIO data input valid before MDCLK high
5
th(MDCLKH-MDIO) Hold time, MDIO data input valid after MDCLK high
tt(MDCLK)
ns
10
0
Transition time, MDCLK
ns
5
ns
1
MDCLK
2
3
4
5
MDIO
(Input)
Figure 5-24. MDIO Input Timing
Table 5-19. MDIO Switching Characteristics
(See Figure 5-25.)
NO.
6
56
PARAMETER
MIN
td(MDCLKL-MDIO) Delay time, MDCLK low to MDIO data output valid
Specifications
MAX
UNIT
100
ns
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1
MDCLK
6
MDIO
(Ouput)
Figure 5-25. MDIO Output Timing
5.7.14 Timers Electrical Data/Timing
Table 5-20, Table 5-21, and Figure 5-26 describe the timing requirements and switching characteristics of
Timer0 through Timer7 peripherals.
Table 5-20. Timer Input Timing Requirements (1)
(See Figure 5-26.)
NO.
1
2
(1)
MIN
MAX
UNIT
tw(TINPH)
Pulse duration, high
12C
ns
tw(TINPL)
Pulse duration, low
12C
ns
C = 1 / CORECLK(N|P) frequency in ns.
Table 5-21. Timer Output Switching Characteristics (1)
(See Figure 5-26.)
NO.
PARAMETER
MIN
MAX
UNIT
3
tw(TOUTH)
Pulse duration, high
12C - 3
ns
4
tw(TOUTL)
Pulse duration, low
12C - 3
ns
(1)
C = 1 / CORECLK(N|P) frequency in ns.
1
2
TIMIx
3
4
TIMOx
Figure 5-26. Timer Timing
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5.7.15 General-Purpose Input/Output (GPIO)
5.7.15.1 GPIO Device-Specific Information
On the C665x, the GPIO peripheral pins GP[15:0] are also used to latch configuration settings. For more
detailed information on device/peripheral configuration and the C665x device pin muxing, see Section 8.
For more information on GPIO, see the General Purpose Input/Output (GPIO) for KeyStone Devices
User's Guide.
5.7.15.2 GPIO Electrical Data/Timing
Table 5-22. GPIO Input Timing Requirements
NO.
1
2
(1)
MIN
tw(GPOH)
Pulse duration, GPOx high
tw(GPOL)
Pulse duration, GPOx low
MAX UNIT
12C (1)
ns
12C
ns
C = 1/SYSCLK1 frequency in ns.
Table 5-23. GPIO Output Switching Characteristics
NO.
PARAMETER
3
tw(GPOH)
Pulse duration, GPOx high
4
tw(GPOL)
Pulse duration, GPOx low
(1)
MIN
36C
(1)
MAX UNIT
-8
ns
36C - 8
ns
C = 1/SYSCLK1 frequency in ns.
1
2
GPIx
4
3
GPOx
Figure 5-27. GPIO Timing
58
Specifications
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5.7.16 McBSP Electrical Data/Timing
The following tables assume testing over recommended operating conditions.
5.7.16.1 McBSP Timing
Table 5-24. McBSP Timing Requirements (1)
(See Figure 5-28.)
NO.
MIN
MAX
UNIT
2
tc(CKRX)
Cycle time, CLKR/X
CLKR/X ext
2P or 20 (2) (3)
ns
3
tw(CKRX)
Pulse duration, CLKR/X high or CLKR/X low
CLKR/X ext
P-1 (4)
ns
5
tsu(FRH-CKRL)
Setup time, external FSR high before CLKR low
6
th(CKRL-FRH)
Hold time, external FSR high after CLKR low
7
tsu(DRV-CKRL)
Setup time, DR valid before CLKR low
8
th(CKRL-DRV)
Hold time, DR valid after CLKR low
10
tsu(FXH-CKXL)
Setup time, external FSX high before CLKX low
11
th(CKXL-FXH)
Hold time, external FSX high after CLKX low
(1)
(2)
(3)
(4)
CLKR int
14
CLKR ext
4
CLKR int
6
CLKR ext
3
CLKR int
14
CLKR ext
4
CLKR int
3
CLKR ext
3
CLKR int
14
CLKR ext
4
CLKR int
6
CLKR ext
3
ns
ns
ns
ns
ns
ns
CLKRP = CLKXP = FSRP = FSXP = 0. If polarity of any of the signals is inverted, then the timing references of that signal are also
inverted.
P = SYSCLK7 period in ns. For example, when the SYSCLK7 clock domain is running at 166MHz, use 6ns.
Use whichever value is greater. Minimum CLKR/X cycle times must be met, even when CLKR/X is generated by an internal clock
source. The minimum CLKR/X cycle times are based on internal logic speed; the maximum usable speed may be lower due to EDMA
limitations and AC timing requirements
This parameter applies to the maximum McBSP frequency. Operate serial clocks (CLKR/X) in the reasonable range of 40/60 duty cycle.
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Table 5-25. McBSP Switching Characteristics (1) (2)
(See Figure 5-28.)
NO.
PARAMETER
2
tc(CKRX)
Cycle time, CLKR/X
CLKR/X int
2P or 20 (3) (4)
3
tw(CKRX)
Pulse duration, CLKR/X high or CLKR/X low
CLKR/X int
C – 2 (5)
C + 2 (5)
ns
–4
5.5
ns
CLKR int
1
14.5
ns
CLKX int
–4
5.5
CLKX ext
1
14.5
CLKX int
–4
7.5
CLKX ext
1
14.5
CLKX int
–4 + D1 (6)
5.5 + D2 (6)
4
td(CKRH-FRV)
Delay time, CLKR high to internal FSR valid
9
td(CKXH-FXV)
Delay time, CLKX high to internal FSX valid
12
tdis(CKXHDXHZ)
Disable time, DX Hi-Z following last data bit from CLKX
high
13
td(CKXH-DXV)
Delay time, CLKX high to DX valid
14
td(FXH-DXV)
Delay time, FSX high to DX valid applies ONLY when in
data delay 0 (XDATDLY = 00b) mode
(2)
(3)
(4)
(5)
(6)
(7)
60
MAX UNIT
CKRXH)
4
(1)
MIN
Delay time, CLKS high to CLKR/X high for internal CLKR/X generated from
CLKS input.
1
td(CKSH-
CLKR int
1
14.5
ns
1 + D1 (6) 14.5 + D2 (6)
CLKX ext
FSX int
FSX ext
–4 + D1 (7)
5 + D2 (7)
(7)
14.5 + D2 (7)
–2 + D1
ns
ns
ns
ns
ns
CLKRP = CLKXP = FSRP = FSXP = 0. If polarity of any of the signals is inverted, then the timing references of that signal are also
inverted.
Minimum delay times also represent minimum output hold times.
P = SYSCLK7 period in ns. For example, when the SYSCLK7 clock domain is running at 166 MHz, use 6 ns.
Use whichever value is greater.
C = H or L
S = sample rate generator input clock = P if CLKSM = 1 (P = SYSCLK7 period)
S = sample rate generator input clock = P_clks if CLKSM = 0 (P_clks = CLKS period)
If CLKGDV is even:
(1) H = CLKX high pulse width = (CLKGDV/2 + 1) * S
(2) L = CLKX low pulse width = (CLKGDV/2) * S
If CLKGDV is odd:
(1) H = (CLKGDV + 1)/2 * S
(2) L = (CLKGDV + 1)/2 * S
CLKGDV should be set appropriately to ensure the McBSP bit rate does not exceed the maximum limit.
Extra delay from CLKX high to DX valid applies only to the first data bit of a device, if and only if DXENA = 1 in SPCR.
if DXENA = 0, then D1 = D2 = 0
if DXENA = 1, then D1 = 4P, D2 = 8P
Extra delay from FSX high to DX valid applies only to the first data bit of a device, if and only if DXENA = 1 in SPCR.
if DXENA = 0, then D1 = D2 = 0
if DXENA = 1, then D1 = 4P, D2 = 8P
Specifications
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CLKS
1
2
3
3
CLKR
4
4
FSR (int)
5
6
FSR (ext)
7
8
Bit(n-1)
DR
(n-2)
(n-3)
2
3
3
CLKX
9
FSX (int)
11
10
FSX (ext)
FSX (XDATDLY=00b)
DX
13
14
(B)
13
Bit(n-1)
12
Bit 0
(n-2)
(n-3)
Figure 5-28. McBSP Timing
Table 5-26. McBSP Timing Requirements for FSR When GSYNC = 1
(See Figure 5-29.)
NO.
MIN
MAX
UNIT
1
tsu(FRH-CKSH)
Setup time, FSR high before CLKS high
4
ns
2
th(CKSH-FRH)
Hold time, FSR high after CLKS high
4
ns
CLKS
1
2
FSR external
CLKR/X
(no need to resync)
CLKR/X
(needs resync)
Figure 5-29. FSR Timing When GSYNC = 1
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5.7.17 uPP Timing and Switching
Table 5-27. uPP Timing Requirements
(See Figure 5-30, Figure 5-31, Figure 5-32, Figure 5-33.)
NO.
MIN
1
tc(INCLK)
Cycle time, CHn_CLK
2
tw(INCLKH)
Pulse width, CHn_CLK high
3
tw(INCLKL)
Pulse width, CHn_CLK low
4
tsu(STV-INCLKH)
Setup time, CHn_START valid before CHn_CLK high
5
th(INCLKH-STV)
Hold time, CHn_START valid after CHn_CLK high
6
tsu(ENV-INCLKH)
Setup time, CHn_ENABLE valid before CHn_CLK high
7
th(INCLKH-ENV)
Hold time, CHn_ENABLE valid after CHn_CLK high
8
tsu(DV-INCLKH)
Setup time, CHn_DATA/XDATA valid before CHn_CLK high
9
th(INCLKH-DV)
Hold time, CHn_DATA/XDATA valid after CHn_CLK high
10
tsu(DV-INCLKL)
Setup time, CHn_DATA/XDATA valid before CHn_CLK low
11
th(INCLKL-DV)
Hold time, CHn_DATA/XDATA valid after CHn_CLK low
19
tsu(WTV-OUTCLKL)
Setup time, CHn_WAIT valid before CHn_CLK high
20
th(INCLKL-WTV)
Hold time, CHn_WAIT valid after CHn_CLK high
21
(1)
tc(2xTXCLK)
Cycle time, 2xTXCLK input clock
SDR mode
13.33
DDR mode
26.66
SDR mode
5
DDR mode
10
SDR mode
5
DDR mode
10
(1)
MAX UNIT
ns
ns
ns
4
ns
0.8
ns
4
ns
0.8
ns
4
ns
0.8
ns
4
ns
0.8
ns
4
ns
0.8
ns
6.66
ns
2xTXCLK is an alternate transmit clock source that must be at least 2 times the required uPP transmit clock rate (as it is divided down
by 2 inside the uPP). 2xTXCLK has no specified skew relationship to the CHn_CLOCK and therefore is not shown in the timing diagram.
Table 5-28. uPP Switching Characteristics
(See Figure 5-32 and Figure 5-33.)
NO.
62
PARAMETER
MIN
SDR mode
13.33
DDR mode
26.66
MAX UNIT
12
tc(OUTCLK)
Cycle time, CHn_CLK
13
tw(OUTCLKH)
Pulse width, CHn_CLK high
14
tw(OUTCLKL)
Pulse width, CHn_CLK low
15
td(OUTCLKH-STV)
Delay time, CHn_START valid after CHn_CLK high
1
11
ns
16
td(OUTCLKH-ENV)
Delay time, CHn_ENABLE valid after CHn_CLK high
1
11
ns
17
td(OUTCLKH-DV)
Delay time, CHn_DATA/XDATA valid after CHn_CLK high
1
11
ns
18
td(OUTCLKL-DV)
Delay time, CHn_DATA/XDATA valid after CHn_CLK low
1
11
ns
Specifications
SDR mode
5
DDR mode
10
SDR mode
5
DDR mode
10
ns
ns
ns
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2
1
3
CHx_CLK
5
4
CHx_START
7
6
CHx_ENABLE
CHx_WAIT
8
CHx_DATA[n:0]
CHx_XDATA[n:0]
Data1
Data3
Data2
Data5
Data4
Data6
Data8
Data7
Data9
9
Figure 5-30. uPP Single Data Rate (SDR) Receive Timing
2
1
3
CHx_CLK
5
4
CHx_START
7
6
CHx_ENABLE
CHx_WAIT
10
8
CHx_DATA[n:0]
CHx_XDATA[n:0]
I1
Q1
I2
Q2
I3
Q3
I4
Q4
I5
Q5
I6
Q6
I7
9
Q7
I8
Q8
I9
Q9
11
Figure 5-31. uPP Double Data Rate (DDR) Receive Timing
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12
14
13
CHx_CLK
15
CHx_START
16
CHx_ENABLE
20
19
CHx_WAIT
17
CHx_DATA[n:0]
CHx_XDATA[n:0]
Data1
Data2
Data3
Data4
Data5
Data6
Data7
Data8
Data9
I8
I9
Figure 5-32. uPP Single Data Rate (SDR) Transmit Timing
12
14
13
CHx_CLK
15
CHx_START
16
CHx_ENABLE
20
19
CHx_WAIT
17
CHx_DATA[n:0]
CHx_XDATA[n:0]
I1
18
Q1
I2
Q2
I3
Q3
I4
Q4
I5
Q5
I6
Q6
I7
Q7
Q8
Q9
Figure 5-33. uPP Double Data Rate (DDR) Transmit Timing
64
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5.7.18 Trace Electrical Data/Timing
Table 5-29. DSP Trace Switching Characteristics (1)
(See Figure 5-34.)
NO.
PARAMETER
MIN
MAX UNIT
1
tw(DPnH)
Pulse duration, DPn/EMUn high detected at 50% Voh
2.4
ns
1
tw(DPnH)90%
Pulse duration, DPn/EMUn high detected at 90% Voh
1.5
ns
2
tw(DPnL)
Pulse duration, DPn/EMUnlow detected at 50% Voh
2.4
ns
2
tw(DPnL)10%
Pulse duration, DPn/EMUnlow detected at 10% Voh
1.5
ns
tsko(DPn)
Output skew time, time delay difference between DPn/EMUnpins configured as
trace
–1
tskp(DPn)
Pulse skew, magnitude of difference between high-to-low (tphl) and low-to-high
(tplh) propagation delays.
tσλδπ_o(DPn)
Output slew rate DPn/EMUn
3
(1)
1
ns
600
ps
3.3
V/ns
MIN
MAX UNIT
Over recommended operating conditions.
Table 5-30. STM Trace Switching Characteristics
(1)
(See Figure 5-34.)
NO.
PARAMETER
1
tw(DPnH)
Pulse duration, DPn/EMUn high detected at 50% Voh with 60/40 duty cycle
1
tw(DPnH)90%
Pulse duration, DPn/EMUn high detected at 90% Voh
2
tw(DPnL)
Pulse duration, DPn/EMUn low detected at 50% Voh with 60/40 duty cycle
2
tw(DPnL)10%
3
(1)
4
ns
3.5
ns
4
ns
Pulse duration, DPn/EMUn low detected at 10% Voh
3.5
ns
tsko(DPn)
Output skew time, time delay difference between DPn/EMUn pins configured
as trace
–1
tskp(DPn)
Pulse skew, magnitude of difference between high-to-low (tphl) and low-to-high
(tplh) propagation delays.
tσλδπ_o(DPn)
Output slew rate DPn/EMUn
1
ns
1
ns
3.3
V/ns
Over recommended operating conditions.
A
TPLH
TPHL
1
2
B
3
C
A.
EMUx represents the EMU output pin configured as the trace clock output.
EMUy and EMUz represent all of the trace output data pins.
Figure 5-34. Trace Timing
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5.7.19 JTAG Electrical Data/Timing
Table 5-31. JTAG Test Port Timing Requirements
(See Figure 5-35.)
NO.
MIN
1
tc(TCK)
Cycle time, TCK
1a
tw(TCKH)
1b
3
MAX UNIT
34
ns
Pulse duration, TCK high (40% of tc)
13.6
ns
tw(TCKL)
Pulse duration, TCK low(40% of tc)
13.6
ns
tsu(TDI-TCK)
input setup time, TDI valid to TCK high
3.4
ns
3
tsu(TMS-TCK)
input setup time, TMS valid to TCK high
3.4
ns
4
th(TCK-TDI)
input hold time, TDI valid from TCK high
17
ns
4
th(TCK-TMS)
input hold time, TMS valid from TCK high
17
ns
Table 5-32. JTAG Test Port Switching Characteristics (1)
(See Figure 5-35.)
NO.
2
(1)
PARAMETER
td(TCKL-TDOV)
MIN
Delay time, TCK low to TDO valid
MAX UNIT
13.6
ns
Over recommended operating conditions.
1
1b
1a
TCK
2
TDO
4
3
TDI / TMS
Figure 5-35. JTAG Test-Port Timing
66
Specifications
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SPRS814D – MARCH 2012 – REVISED OCTOBER 2019
6 Detailed Description
6.1
Recommended Clock and Control Signal Transition Behavior
All clocks and control signals must transition between VIH and VIL (or between VIL and VIH) in a monotonic
manner.
6.2
Power Supplies
The following sections describe the proper power-supply sequencing and timing needed to properly power
on the C665x. The various power supply rails and their primary function is listed in Table 6-1.
Table 6-1. Power Supply Rails on C665x
NAME
PRIMARY FUNCTION
VOLTAGE
NOTES
CVDD
SmartReflex core supply
voltage
0.85 V - 1.1 V
Includes core voltage for DDR3 module
CVDD1
Core supply voltage for memory 1.0 V
array
Fixed supply at 1.0 V
VDDT1
HyperLink SerDes termination
supply
1.0 V
Filtered version of CVDD1. Special considerations for noise. Filter is
not needed if HyperLink is not in use.
VDDT2
SGMII/SRIO/PCIE SerDes
termination supply
1.0 V
Filtered version of CVDD1. Special considerations for noise. Filter is
not needed if SGMII/SRIO/PCIE is not in use.
DVDD15
1.5-V DDR3 IO supply
1.5 V
VDDR1
HyperLink SerDes regulator
supply
1.5 V
Filtered version of DVDD15. Special considerations for noise. Filter is
not needed if HyperLink is not in use.
VDDR2
PCIE SerDes regulator supply
1.5 V
Filtered version of DVDD15. Special considerations for noise. Filter is
not needed if PCIE is not in use.
VDDR3
SGMII SerDes regulator supply
1.5 V
Filtered version of DVDD15. Special considerations for noise. Filter is
not needed if SGMII is not in use.
VDDR4
SRIO SerDes regulator supply
1.5 V
Filtered version of DVDD15. Special considerations for noise. Filter is
not needed if HyperLink is not in use.
DVDD18
1.8-V IO supply
1.8 V
AVDDA1
Main PLL supply
1.8 V
Filtered version of DVDD18. Special considerations for noise.
AVDDA2
DDR3 PLL supply
1.8 V
Filtered version of DVDD18. Special considerations for noise.
VREFSSTL
0.75-V DDR3 reference voltage
0.75 V
Should track the 1.5-V supply. Use 1.5 V as source.
VSS
Ground
GND
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Power Supply to Peripheral I/O Mapping (1) (2)
6.3
Over Recommended Ranges of Supply Voltage and Operating Case Temperature (Unless Otherwise Noted)
POWER SUPPLY
I/O BUFFER TYPE
ASSOCIATED PERIPHERAL
CORECLK(P|N) PLL input buffers
CVDD
Supply Core Voltage
LJCB
SRIOSGMIICLK(P|N) SerDes PLL input buffers
DDRCLK(P|N) PLL input buffers
PCIECLK(P|N) SERDES PLL input buffers
CVDD
Supply Core Voltage
LJCB
MCMCLK(P|N) SERDES PLL input buffer s
DVDD15
1.5-V supply I/O voltage
DDR3 (1.5 V)
All DDR3 memory controller peripheral I/O buffers
All GPIO peripheral I/O buffers
All JTAG and EMU peripheral I/O buffers
All Timer peripheral I/O buffers
All SPI peripheral I/O buffers
LVCMOS (1.8 V)
DVDD18
1.8-V supply I/O voltage
All RESETs, NMI, Control peripheral I/O buffers
All MDIO peripheral I/O buffers
All UART peripheral I/O buffers
All McBSP peripheral I/O buffers
All EMIF16 peripheral I/O buffers
All uPP peripheral I/O buffers
Open-drain (1.8V)
All I2C peripheral I/O buffers
All SmartReflex peripheral I/O buffers
DVDD18
1.8-V supply I/O voltage
LVCMOS (1.8 V)
All Hyperlink sideband peripheral I/O buffers
VDDT1
Hyperlink SerDes
termination and analogue
front-end supply
SerDes/CML
Hyperlink SerDes CML I/O buffers
VDDT2
SRIO/SGMII/PCIE SerDes
termination and analogue SerDes/CML
front-end supply
(1)
(2)
68
SRIO/SGMII/PCIE SerDes CML I/O buffers
This table does not try to describe all functions of all power supply terminals but only those whose purpose it is to power peripheral I/O
buffers and clock input buffers.
See Hardware Design Guide for KeyStone Devices for more information about individual peripheral I/O.
Detailed Description
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6.3.1
SPRS814D – MARCH 2012 – REVISED OCTOBER 2019
Power-Supply Sequencing
This section defines the requirements for a power up sequencing from a power-on reset condition. There
are two acceptable power sequences for the device. The first sequence stipulates the core voltages
starting before the I/O voltages as follows:
1.
2.
3.
4.
CVDD
CVDD1, VDDT1-2
DVDD18, AVDDA1, AVDDA2
DVDD15, VDDR1-4
The second sequence provides compatibility with other TI processors with the I/O voltage starting before
the core voltages as follows:
1.
2.
3.
4.
DVDD18, AVDDA1, AVDDA2
CVDD
CVDD1, VDDT1-2
DVDD15, VDDR1-4
The clock input buffers for CORECLK, DDRCLK, SRIOSGMIICLK, MCMCLK, and PCIECLK use only
CVDD as a supply voltage. These clock inputs are not fail-safe and must be held in a high-impedance
state until CVDD is at a valid voltage level. Driving these clock inputs high before CVDD is valid could
cause damage to the device. Once CVDD is valid it is acceptable that the P and N legs of these CLKs
may be held in a static state (either high and low or low and high) until a valid clock frequency is needed
at that input. To avoid internal oscillation the clock inputs should be removed from the high impedance
state shortly after CVDD is present.
If a clock input is not used it must be held in a static state. To accomplish this the N leg should be pulled
to ground through a 1 kΩ resistor. The P leg should be tied to CVDD to ensure it will not have any voltage
present until CVDD is active. Connections to the I/O cells powered by DVDD18 and DVDD15 are not failsafe and should not be driven high before these voltages are active. Driving these I/O cells high before
DVDD18 or DVDD15 are valid could cause damage to the device.
The device initialization is broken into two phases. The first phase consists of the time period from the
activation of the first power supply until the point in which all supplies are active and at a valid voltage
level. Either of the sequencing scenarios described above can be implemented during this phase.
Figure 6-1 and Figure 6-2 show both the core-before-I/O voltage sequence and the I/O-before-core
voltage sequence. POR must be held low for the entire power stabilization phase.
This is followed by the device initialization phase. The rising edge of POR followed by the rising edge of
RESETFULL will trigger the end of the initialization phase but both must be inactive for the initialization to
complete. POR must always go inactive before RESETFULL goes inactive as described in the following
sections. SYSCLK1 in the following section refers to the clock input that has been selected as the source
for the main PLL and SYSCLK1 refers to the main PLL output that is used by the CorePac, see Figure 6-3
for more details.
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Core-Before-IO Power Sequencing
Figure 6-1 shows the power sequencing and reset control of C665x for device initialization. POR may be
removed after the power has been stable for the required 100 µs. RESETFULL must be held low for a
period after the rising edge of POR but may be held low for longer periods if necessary. The configuration
bits shared with the GPIO pins will be latched on the rising edge of RESETFULL and must meet the setup
and hold times specified. SYSCLK1 must always be active before POR can be removed. Core-before-IO
power sequencing is defined in Table 6-2.
NOTE
TI recommends a maximum of 100 ms between one power rail being valid, and the next
power rail in the sequence starting to ramp.
Power Stabilization Phase
Device Initialization Phase
POR
7
RESETFULL
8
GPIO Config
Bits
4b
9
10
RESET
2c
1
CVDD
6
2a
CVDD1
3
DVDD18
4a
DVDD15
5
SYSCLK1P&N
2b
DDRCLKP&N
RESETSTAT
Figure 6-1. Core-Before-IO Power Sequencing
70
Detailed Description
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Table 6-2. Core-Before-IO Power Sequencing
TIME
SYSTEM STATE
1
Begin Power Stabilization Phase
•
CVDD (core AVS) ramps up.
•
POR must be held low through the power stabilization phase. Because POR is low, all the core logic that has async reset
(created from POR) is put into the reset state.
2a
•
•
CVDD1 (core constant) ramps at the same time or shortly following CVDD. Although ramping CVDD1 and CVDD
simultaneously is permitted, the voltage for CVDD1 must never exceed CVDD until after CVDD has reached a valid voltage.
The purpose of ramping up the core supplies close to each other is to reduce crowbar current. CVDD1 should trail CVDD as
this will ensure that the WLs in the memories are turned off and there is no current through the memory bit cells. If,
however, CVDD1 (core constant) ramps up before CVDD (core AVS), then the worst-case current could be on the order of
twice the specified draw of CVDD1.
2b
•
Once CVDD is valid, the clock drivers should be enabled. Although the clock inputs are not necessary at this time, they
should either be driven with a valid clock or be held in a static state with one leg high and one leg low.
2c
•
The DDRCLK and SYSCLK1 may begin to toggle anytime between when CVDD is at a valid level and the setup time before
POR goes high specified by t6.
3
•
•
•
Filtered versions of 1.8 V can ramp simultaneously with DVDD18.
RESETSTAT is driven low once the DVDD18 supply is available.
All LVCMOS input and bidirectional pins must not be driven or pulled high until DVDD18 is present. Driving an input or
bidirectional pin before DVDD18 is valid could cause damage to the device.
4a
•
DVDD15 (1.5 V) supply is ramped up following DVDD18. Although ramping DVDD18 and DVDD15 simultaneously is
permitted, the voltage for DVDD15 must never exceed DVDD18.
4b
•
RESET may be driven high any time after DVDD18 is at a valid level. In a POR-controlled boot, RESET must be high before
POR is driven high.
5
•
POR must continue to remain low for at least 100 µs after power has stabilized.
End Power Stabilization Phase
6
•
Device initialization requires 500 SYSCLK1 periods after the Power Stabilization Phase. The maximum clock period is 33.33
nsec, so a delay of an additional 16 µs is required before a rising edge of POR. The clock must be active during the entire
16 µs.
7
•
RESETFULL must be held low for at least 24 transitions of the SYSCLK1 after POR has stabilized at a high level.
8
•
•
9
•
GPIO configuration bits must be valid for at least 12 transitions of the SYSCLK1 before the rising edge of RESETFULL
10
•
GPIO configuration bits must be held valid for at least 12 transitions of the SYSCLK1 after the rising edge of RESETFULL
The rising edge of the RESETFULL will remove the reset to the efuse farm allowing the scan to begin.
Once device initialization and the efuse farm scan are complete, the RESETSTAT signal is driven high. This delay will be
10000 to 50000 clock cycles.
End Device Initialization Phase
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IO-Before-Core Power Sequencing
The timing diagram for IO-before-core power sequencing is shown in Figure 6-2 and defined in Table 6-3.
NOTE
TI recommends a maximum of 100 ms between one power rail being valid, and the next
power rail in the sequence starting to ramp.
Power Stabilization Phase
Device Initialization Phase
POR
5
7
RESETFULL
8
GPIO Config
Bits
2a
9
10
RESET
3c
2b
CVDD
6
3a
CVDD1
1
DVDD18
4
DVDD15
3b
SYSCLK1P&N
DDRCLKP&N
RESETSTAT
Figure 6-2. IO-Before-Core Power Sequencing
72
Detailed Description
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Table 6-3. IO-Before-Core Power Sequencing
TIME
SYSTEM STATE
1
Begin Power Stabilization Phase
•
Because POR is low, all the core logic having async reset (created from POR) are put into reset state once the core supply
ramps. POR must remain low through Power Stabilization Phase.
•
Filtered versions of 1.8 V can ramp simultaneously with DVDD18.
•
RESETSTAT is driven low once the DVDD18 supply is available.
•
All input and bidirectional pins must not be driven or pulled high until DVDD18 is present. Driving an input or bidirectional pin
before DVDD18 could cause damage to the device.
2a
•
RESET may be driven high anytime after DVDD18 is at a valid level.
2b
•
CVDD (core AVS) ramps up.
3a
•
CVDD1 (core constant) ramps at the same time or following CVDD. Although ramping CVDD1 and CVDD simultaneously is
permitted the voltage for CVDD1 must never exceed CVDD until after CVDD has reached a valid voltage.
The purpose of ramping up the core supplies close to each other is to reduce crowbar current. CVDD1 should trail CVDD as
this will ensure that the WLs in the memories are turned off and there is no current through the memory bit cells. If,
however, CVDD1 (core constant) ramps up before CVDD (core AVS), then the worst case current could be on the order of
twice the specified draw of CVDD1.
•
3b
•
Once CVDD is valid, the clock drivers should be enabled. Although the clock inputs are not necessary at this time, they
should either be driven with a valid clock or held in a static state with one leg high and one leg low.
3c
•
The DDRCLK and SYSCLK1 may begin to toggle anytime between when CVDD is at a valid level and the setup time before
POR goes high specified by t6.
4
•
DVDD15 (1.5 V) supply is ramped up following CVDD1.
5
•
POR must continue to remain low for at least 100 µs after power has stabilized.
End Power Stabilization Phase
6
Begin Device Initialization
•
Device initialization requires 500 SYSCLK1 periods after the Power Stabilization Phase. The maximum clock period is 33.33
nsec so a delay of an additional 16 µs is required before a rising edge of POR. The clock must be active during the entire
16 µs.
•
POR must remain low.
7
•
•
8
•
9
•
GPIO configuration bits must be valid for at least 12 transitions of the SYSCLK1 before the rising edge of RESETFULL
10
•
GPIO configuration bits must be held valid for at least 12 transitions of the SYSCLK1 after the rising edge of RESETFULL
RESETFULL is held low for at least 24 transitions of the SYSCLK1 after POR has stabilized at a high level.
The rising edge of the RESETFULL will remove the reset to the efuse farm allowing the scan to begin.
Once device initialization and the efuse farm scan are complete, the RESETSTAT signal is driven high. This delay will be
10000 to 50000 clock cycles.
End Device Initialization Phase
6.3.1.3
Prolonged Resets
Holding the device in POR, RESETFULL, or RESET for long periods of time will affect the long term
reliability of the part. The device should not be held in a reset for times exceeding 1 hour and should not
be held in reset for more the 5% of the time during which power is applied. Exceeding these limits will
cause a gradual reduction in the reliability of the part. This can be avoided by allowing the DSP to boot
and then configuring it to enter a hibernation state soon after power is applied. This will satisfy the reset
requirement while limiting the power consumption of the device.
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Clocking During Power Sequencing
Some of the clock inputs are required to be present for the device to initialize correctly, but behavior of
many of the clocks is contingent on the state of the boot configuration pins. Table 6-4 describes the clock
sequencing and the conditions that affect the clock operation. All clock drivers should be in a highimpedance state until CVDD is at a valid level and that all clock inputs either be active or in a static state
with one leg pulled low and the other connected to CVDD.
Table 6-4. Clock Sequencing
CLOCK
CONDITION
SEQUENCING
DDRCLK
None
Must be present 16 µs before POR transitions high.
CORECLK
None
CORECLK used to clock the core PLL. It must be present 16 µs before POR transitions high.
SRIOSGMII
CLK
SGMII will not be used.
SRIOSGMIICLK must be present 16 µs before POR transitions high.
SRIO will be used as a boot
device.
SGMII will not be used.
SRIO will be used after
boot.
SRIOSGMIICLK is used as a source to the SRIO SERDES PLL. It must be present before the
SRIO is removed from reset and programmed.
PCIE will be used as a boot PCIECLK must be present 16 µs before POR transitions high.
device.
PCIECLK
PCIE will be used after
boot.
PCIECLK is used as a source to the PCIE SERDES PLL. It must be present before the PCIE
is removed from reset and programmed.
PCIE will not be used.
PCIECLK is not used and should be tied to a static state.
HyperLink will be used as a MCMCLK must be present 16 µs before POR transitions high.
boot device.
MCMCLK
HyperLink will be used after MCMCLK is used as a source to the MCM SERDES PLL. It must be present before the
boot.
HyperLink is removed from reset and programmed.
HyperLink will not be used.
6.3.2
MCMCLK is not used and should be tied to a static state.
Power-Down Sequence
The power down sequence is the exact reverse of the power-up sequence described above. The goal is to
prevent a large amount of static current and to prevent overstress of the device. A power-good circuit that
monitors all the supplies for the device should be used in all designs. If a catastrophic power supply failure
occurs on any voltage rail, POR should transition to low to prevent overcurrent conditions that could
possibly impact device reliability.
A system power monitoring solution is needed to shut down power to the board if a power supply fails.
Long-term exposure to an environment in which one of the power supply voltages is no longer present will
affect the reliability of the device. Holding the device in reset is not an acceptable solution because
prolonged periods of time with an active reset can also affect long term reliability.
6.3.3
Power Supply Decoupling and Bulk Capacitors
To properly decouple the supply planes on the PCB from system noise, decoupling and bulk capacitors
are required. Bulk capacitors are used to minimize the effects of low-frequency current transients and
decoupling or bypass capacitors are used to minimize higher frequency noise. For recommendations on
selection of Power Supply Decoupling and Bulk capacitors see the Hardware Design Guide for KeyStone
Devices.
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6.4
SPRS814D – MARCH 2012 – REVISED OCTOBER 2019
Power Sleep Controller (PSC)
The Power Sleep Controller (PSC) controls overall device power by turning off unused power domains
and gating off clocks to individual peripherals and modules. The PSC provides the user with an interface
to control several important power and clock operations.
For information on the Power Sleep Controller, see the Power Sleep Controller (PSC) for KeyStone
Devices User's Guide.
6.4.1
Power Domains
The device has several power domains that can be turned on for operation or off to minimize power
dissipation. The global power/sleep controller (GPSC) is used to control the power gating of various power
domains.
Table 6-5 shows the C665x power domains.
Table 6-5. Power Domains
DOMAIN
BLOCK(S)
NOTE
POWER CONNECTION
0
Most peripheral logic
Cannot be disabled
Always on
1
Per-core TETB and System TETB
RAMs can be powered down
Software control
2
Reserved
Reserved
Reserved
3
PCIe
Logic can be powered down
Software control
4
SRIO
Logic can be powered down
Software control
5
HyperLink
Logic can be powered down
Software control
6
Reserved
Reserved
Reserved
7
MSMC RAM
MSMC RAM can be powered down
Software control
8
Reserved
Reserved
Reserved
9
Reserved
Reserved
Reserved
10
Reserved
Reserved
Reserved
11
TCP3d
RAMs can be powered down
Software control
12
VCP2_B
RAMs can be powered down
Software control
13
C66x Core 0, L1/L2 RAMs
L2 RAMs can sleep
Software control through C66x CorePac. For
details, see the C66x CorePac Reference
Guide.
14
C66x Core 1, L1/L2 RAMs (C6657
only)
L2 RAMs can sleep
Software control through C66x CorePac. For
details, see the C66x CorePac Reference
Guide.
15
Reserved
Reserved
Reserved
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Clock Domains
Clock gating to each logic block is managed by the local power/sleep controllers (LPSCs) of each module.
For modules with a dedicated clock or multiple clocks, the LPSC communicates with the PLL controller to
enable and disable the clock (or clocks) of that module at the source. For modules that share a clock with
other modules, the LPSC controls the clock gating.
Table 6-6 shows the C665x clock domains.
Table 6-6. Clock Domains
LPSC NUMBER
MODULE(S)
NOTES
0
Shared LPSC for all peripherals other than those listed in this table
Always on
1
SmartReflex
Always on
2
DDR3 EMIF
Always on
3
EMAC
Software control
4
VCP2_A
Software control
5
Debug Subsystem and Tracers
Software control
6
Per-core TETB and System TETB
Software control
7
Reserved
Reserved
8
Reserved
Reserved
9
Reserved
Reserved
10
PCIe
Software control
11
SRIO
Software control
12
HyperLink
Software control
13
Reserved
Reserved
14
MSMC RAM
Software control
15
Reserved
Reserved
16
Reserved
Reserved
17
Reserved
Reserved
18
Reserved
Reserved
19
TCP3d
Software control
20
VCP2_1
Software control
21
Reserved
Reserved
22
Reserved
Reserved
23
C66x CorePac 0 and Timer 0
Software control
24
C66x CorePac 1 (C6657 only) and Timer 1
Software control
No LPSC
Bootcfg, PSC, and PLL controller
These modules do not use LPSC.
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SPRS814D – MARCH 2012 – REVISED OCTOBER 2019
PSC Register Memory Map
Table 6-7 shows the PSC Register memory map.
Table 6-7. PSC Register Memory Map
OFFSET
REGISTER
DESCRIPTION
0x000
PID
Peripheral Identification Register
0x004 - 0x010
Reserved
Reserved
0x014
VCNTLID
Voltage Control Identification Register (1)
0x018 - 0x11C
Reserved
Reserved
0x120
PTCMD
Power Domain Transition Command Register
0x124
Reserved
Reserved
0x128
PTSTAT
Power Domain Transition Status Register
0x12C - 0x1FC
Reserved
Reserved
0x200
PDSTAT0
Power Domain Status Register 0 (AlwaysOn)
0x204
PDSTAT1
Power Domain Status Register 1 (Per-core TETB and System TETB)
0x208
PDSTAT2
Power Domain Status Register 2 (Reserved)
0x20C
PDSTAT3
Power Domain Status Register 3 (PCIe)
0x210
PDSTAT4
Power Domain Status Register 4 (SRIO)
0x214
PDSTAT5
Power Domain Status Register 5 (Hyperlink)
0x218
PDSTAT6
Power Domain Status Register 6 (Reserved)
0x21C
PDSTAT7
Power Domain Status Register 7 (MSMC RAM)
0x220
PDSTAT8
Power Domain Status Register 8 (Reserved)
0x224
PDSTAT9
Power Domain Status Register 9 (Reserved)
0x228
PDSTAT10
Power Domain Status Register 10 (Reserved)
0x22C
PDSTAT11
Power Domain Status Register 11 (TCP3d)
0x230
PDSTAT12
Power Domain Status Register 12 (VCP2_B)
0x234
PDSTAT13
Power Domain Status Register 13 (C66x CorePac 0)
0x238
PDSTAT14
Power Domain Status Register 14 (C66x CorePac 1) (C6657) or Reserved (C6655)
0x23C
Reserved
Reserved
0x240 - 0x2FC
Reserved
Reserved
0x300
PDCTL0
Power Domain Control Register 0 (AlwaysOn)
0x304
PDCTL1
Power Domain Control Register 1 (Per-core TETB and System TETB)
0x308
PDCTL2
Power Domain Control Register 2 (Reserved)
0x30C
PDCTL3
Power Domain Control Register 3 (PCIe)
0x310
PDCTL4
Power Domain Control Register 4 (SRIO)
0x314
PDCTL5
Power Domain Control Register 5 (HyperLink)
0x318
PDCTL6
Power Domain Control Register 6 (Reserved)
0x31C
PDCTL7
Power Domain Control Register 7 (MSMC RAM)
0x320
PDCTL8
Power Domain Control Register 8 (Reserved)
0x324
PDCTL9
Power Domain Control Register 9 (Reserved)
0x328
PDCTL10
Power Domain Control Register 10 (Reserved)
0x32C
PDCTL11
Power Domain Control Register 11 (TCP3d)
0x330
PDCTL12
Power Domain Control Register 12 (VCP2_B)
0x334
PDCTL13
Power Domain Control Register 13 (C66x CorePac 0)
0x338
PDCTL14
Power Domain Control Register 14 (C66x CorePac 1) (C6657) or Reserved (C6655)
0x33C
Reserved
Reserved
0x340 - 0x7FC
Reserved
Reserved
0x800
MDSTAT0
Module Status Register 0 (Never Gated)
(1)
VCNTLID register is available for debug purpose only.
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Table 6-7. PSC Register Memory Map (continued)
OFFSET
REGISTER
DESCRIPTION
0x804
MDSTAT1
Module Status Register 1 (SmartReflex)
0x808
MDSTAT2
Module Status Register 2 (DDR3 EMIF)
0x80C
MDSTAT3
Module Status Register 3 (EMAC)
0x810
MDSTAT4
Module Status Register 4 (VCP2_A)
0x814
MDSTAT5
Module Status Register 5 (Debug Subsystem and Tracers)
0x818
MDSTAT6
Module Status Register 6 (Per-core TETB and System TETB)
0x81C
MDSTAT7
Module Status Register 7 (Reserved)
0x820
MDSTAT8
Module Status Register 8 (Reserved)
0x824
MDSTAT9
Module Status Register 9 (Reserved)
0x828
MDSTAT10
Module Status Register 10 (PCIe)
0x82C
MDSTAT11
Module Status Register 11 (SRIO)
0x830
MDSTAT12
Module Status Register 12 (HyperLink)
0x834
MDSTAT13
Module Status Register 13 (Reserved)
0x838
MDSTAT14
Module Status Register 14 (MSMC RAM)
0x83C
MDSTAT15
Module Status Register 15 (Reserved)
0x840
MDSTAT16
Module Status Register 16 (Reserved)
0x844
MDSTAT17
Module Status Register 17 (Reserved)
0x848
MDSTAT18
Module Status Register 18 (Reserved)
0x84C
MDSTAT19
Module Status Register 19 (TCP3d)
0x850
MDSTAT20
Module Status Register 20 (VCP2_B)
0x854
MDSTAT21
Module Status Register 11 (Reserved)
0x858
MDSTAT22
Module Status Register 22(Reserved)
0x85C
MDSTAT23
Module Status Register 23(C66x CorePac 0 and Timer 0)
0x860
MDSTAT24
Module Status Register 24(C66x CorePac 1 [C6657 only] and Timer 1)
0x864 - 0x9FC
Reserved
Reserved
0xA00
MDCTL0
Module Control Register 0 (Never Gated)
0xA04
MDCTL1
Module Control Register 1 (SmartReflex)
0xA08
MDCTL2
Module Control Register 2 (DDR3 EMIF)
0xA0C
MDCTL3
Module Control Register 3 (EMAC)
0xA10
MDCTL4
Module Control Register 4 (VCP2_A)
0xA14
MDCTL5
Module Control Register 5 (Debug Subsystem and Tracers)
0xA18
MDCTL6
Module Control Register 6 (Per-core TETB and System TETB)
0xA1C
MDCTL7
Module Control Register 7 (Reserved)
0xA20
MDCTL8
Module Control Register 8 (Reserved)
0xA24
MDCTL9
Module Control Register 9 (Reserved)
0xA28
MDCTL10
Module Control Register 10 (PCIe)
0xA2C
MDCTL11
Module Control Register 11 (SRIO)
0xA30
MDCTL12
Module Control Register 12 (HyperLink)
0xA34
MDCTL13
Module Control Register 13 (Reserved)
0xA38
MDCTL14
Module Control Register 14 (MSMC RAM)
0xA3C
MDCTL15
Module Control Register 15 (Reserved)
0xA40
MDCTL16
Module Control Register 16 (Reserved)
0xA44
MDCTL17
Module Control Register 17 (Reserved)
0xA48
MDCTL18
Module Control Register 18 (Reserved)
0xA4C
MDCTL19
Module Control Register 19 (TCP3d)
0xA50
MDCTL20
Module Control Register 20 (VCP2_1)
0xA54
MDCTL21
Module Control Register 21(Reserved)
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Table 6-7. PSC Register Memory Map (continued)
OFFSET
REGISTER
DESCRIPTION
0xA58
MDCTL22
Module Control Register 22(Reserved)
0xA5C
MDCTL23
Module Control Register 23(C66x CorePac 0 and Timer 0)
0xA60
MDCTL24
Module Control Register 24(C66x CorePac 1 [C6657 only] and Timer 1)
0xA5C - 0xFFC
Reserved
Reserved
6.5
Reset Controller
The reset controller detects the different type of resets supported on the C665x device and manages the
distribution of those resets throughout the device.
The device has several types of resets:
•
•
•
•
Power-on reset
Hard reset
Soft reset
CPU local reset
Table 6-8 explains further the types of reset, the reset initiator, and the effects of each reset on the device.
For more information on the effects of each reset on the PLL controllers and their clocks, see
Section 5.7.2.
Table 6-8. Reset Types
RESET TYPE
INITIATOR
POR
(Power On Reset)
POR pin active low
RESETFULL pin active low
Hard reset
RESET pin active low
Emulation
PLLCTL register (RSCTRL)
Watchdog timers
Soft reset
RESET pin active low
PLLCTL register (RSCTRL)
Watchdog timers
C66x CorePac
local reset
RESETSTAT
PIN STATUS
EFFECT ON DEVICE WHEN RESET OCCURS
Total reset of the chip. Everything on the device is reset to its
default state in response to this. Activates the POR signal on
chip, which is used to reset test/EMU logic. Boot configurations
are latched. ROM boot process is initiated.
Toggles
RESETSTAT pin
Resets everything except for test/EMU logic and reset isolation Toggles
modules. Emulator and reset Isolation modules stay alive during RESETSTAT pin
this reset. This reset is also different from POR in that the
PLLCTL assumes power and clocks are stable when device
reset is asserted. Boot configurations are not latched. ROM
boot process is initiated.
Software can program these initiators to be hard or soft. Hard
reset is the default, but can be programmed to be soft reset.
Soft reset will behave like hard reset except that EMIF16
MMRs, DDR3 EMIF MMRs, sticky bits in PCIe MMRs, and
external memory contents are retained. Boot configurations are
not latched. ROM boot process is initiated.
MMR bit in LPSC controls C66x CorePac local reset. Used by
Software
(through
LPSC watchdog timers (in the event of a time-out) to reset C66x
MMR) Watchdog timers
CorePac. Can also be initiated by LRESET device pin. C66x
CorePac memory system and slave DMA port are still alive
LRESET pin
when C66x CorePac is in local reset. Provides a local reset of
the C66x CorePac, without destroying clock alignment or
memory contents. Does not initiate ROM boot process.
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Toggles
RESETSTAT pin
Does not toggle
RESETSTAT pin
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Power-on Reset
Power-on reset is used to reset the entire device, including the test and emulation logic.
Power-on reset is initiated by the following:
1. POR pin
2. RESETFULL pin
During power-up, the POR pin must be asserted (driven low) until the power supplies have reached their
normal operating conditions. A RESETFULL pin is also provided to allow the onboard host to reset the
entire device including the reset isolated logic. The assumption is that the device is already powered up
and hence, unlike the POR pin, the RESETFULL pin will be driven by the onboard host control instead of
the power-good circuitry. For power-on reset, the Main PLL Controller comes up in bypass mode and the
PLL is not enabled. Other resets do not affect the state of the PLL or the dividers in the PLL controller.
The following sequence must be followed during a power-on reset:
1. Wait for all power supplies to reach normal operating conditions while keeping the POR pin asserted (driven low).
While POR is asserted, all pins except RESETSTAT will be set to high-impedance. After the POR pin is
deasserted (driven high), all Z group pins, low group pins, and high group pins are set to their reset state and will
remain at their reset state until otherwise configured by their respective peripheral. All peripherals that are power
managed, are disabled after a power-on reset and must be enabled through the Device State Control Registers
(for more details, see Table 8-2).
2. Clocks are reset, and they are propagated throughout the device to reset any logic that was using reset
synchronously. All logic is now reset and RESETSTAT will be driven low indicating that the device is in reset.
3. POR must be held active until all supplies on the board are stable then for at least an additional time for the chiplevel PLLs to lock.
4. The POR pin can now be deasserted. Reset-sampled pin values are latched at this point. The chip level PLLs are
taken out of reset and begin their locking sequence, and all power-on device initialization also begins.
5. After device initialization is complete, the RESETSTAT pin is deasserted (driven high). By this time, the DDR3 PLL
has already completed its locking sequence and is outputting a valid clock. The system clocks of both PLL
controllers are allowed to finish their current cycles and then paused for 10 cycles of their respective system
reference clocks. After the pause, the system clocks are restarted at their default divide by settings.
6. The device is now out of reset and device execution begins as dictated by the selected boot mode.
NOTE
To most of the device, reset is deasserted only when the POR and RESET pins are both
deasserted (driven high). Therefore, in the sequence described above, if the RESET pin is
held low past the low period of the POR pin, most of the device will remain in reset. The
RESET pin should not be tied together with the POR pin.
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6.5.2
SPRS814D – MARCH 2012 – REVISED OCTOBER 2019
Hard Reset
A hard reset will reset everything on the device except the PLLs, test, emulation logic, and reset isolation
modules. POR should also remain deasserted during this time.
Hard reset is initiated by the following:
•
•
•
•
RESET pin
RSCTRL register in PLLCTL
Watchdog timer
Emulation
All the above initiators, by default, are configured to act as a hard reset. Except emulation, all the other
three initiators can be configured as soft resets in the RSCFG register in PLLCTL.
The following sequence must be followed during a hard reset:
1. The RESET pin is pulled active low for a minimum of 24 input clock cycles. During this time, the RESET signal is
able to propagate to all modules (except those specifically mentioned above). All I/O are Hi-Z for modules affected
by RESET, to prevent off-chip contention during the warm reset.
2. Once all logic is reset, RESETSTAT is driven active to denote that the device is in reset.
3. The RESET pin can now be released. A minimal device initialization begins to occur. Configuration pins are not
relatched and clocking is unaffected within the device.
4. After device initialization is complete, the RESETSTAT pin is deasserted (driven high).
NOTE
The POR pin should be held inactive (high) throughout the warm reset sequence. Otherwise,
if POR is activated (brought low), the minimum POR pulse width must be met. The RESET
pin should not be tied together with the POR pin.
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Soft Reset
A soft reset will behave like a hard reset except that the PCIe MMR sticky bits and DDR3 EMIF MMRs
contents are retained. POR should also remain deasserted during this time.
Soft reset is initiated by the following:
•
•
•
RESET pin
RSCTRL register in PLLCTL
Watchdog timer
All the above initiators by default are configured to act as hard reset. Except emulation, all the other three
initiators can be configured as soft resets in the RSCFG register in PLLCTL.
In the case of a soft reset, the clock logic or the power control logic of the peripherals are not affected,
and, therefore, the enabled/disabled state of the peripherals is not affected. On a soft reset, the DDR3
memory controller registers are not reset. In addition, the DDR3 SDRAM memory content is retained if the
user places the DDR3 SDRAM in self-refresh mode before invoking the soft reset.
During a soft reset, the following happens:
1. The RESETSTAT pin goes low to indicate an internal reset is being generated. The reset is allowed to propagate
through the system. Internal system clocks are not affected. PLLs also remain locked.
2. After device initialization is complete, the RESETSTAT pin is deasserted (driven high). In addition, the PLL
controllers pause their system clocks for about 8 cycles.
– At this point:
– The state of the peripherals before the soft reset is not changed.
– The I/O pins are controlled as dictated by the DEVSTAT register.
– The DDR3 MMRs and PCIe MMR sticky bits retain their previous values. Only the DDR3 Memory
Controller and PCIe state machines are reset by the soft reset.
– The PLL controllers are operating in the mode prior to soft reset. System clocks are unaffected.
The boot sequence is started after the system clocks are restarted. Because the configuration pins are not
latched with a system reset, the previous values, as shown in the DEVSTAT register, are used to select
the boot mode.
6.5.4
Local Reset
The local reset can be used to reset a particular CorePac without resetting any other chip components.
Local reset is initiated by the following (for more details see the Phase-Locked Loop (PLL) for KeyStone
Devices User's Guide:
•
•
•
6.5.5
LRESET pin
Based on the setting of the CORESEL[2:0] and RSTCFG register in the PLL controller, one of the following should
be caused by the watchdog timer. See Section 6.6.2.8 and Section 6.9.2:
– Local Reset
– NMI
– NMI followed by a time delay and then a local reset for the CorePac selected
– Hard Reset by requesting reset through PLLCTL
LPSC MMRs (memory-mapped registers)
Reset Priority
If any of the reset sources in Section 6.5.4 occur simultaneously, the PLLCTL processes only the highest
priority reset request. The reset request priorities are as follows (high to low):
•
•
6.5.6
Power-on reset
Hard/soft reset
Reset Controller Register
The reset controller register is part of the PLLCTL MMRs. All C665x device-specific MMRs are covered in
Section 6.6.3. For more details on these registers and how to program them, see the Phase-Locked Loop
(PLL) for KeyStone Devices User's Guide.
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6.6
SPRS814D – MARCH 2012 – REVISED OCTOBER 2019
Main PLL and PLL Controller
This section provides a description of the Main PLL and the PLL controller. For details on the operation of
the PLL controller module, see the Phase-Locked Loop (PLL) for KeyStone Devices User's Guide.
The Main PLL is controlled by the standard PLL controller. The PLL controller manages the clock ratios,
alignment, and gating for the system clocks to the device. Figure 6-3 shows a block diagram of the main
PLL and the PLL controller.
PLL
PLLD
xPLLM
/2
CORECLK(N|P)
0
PLLOUT
OUTPUT
DIVIDE
1
BYPASS
1
PLL Controller
0
PLLDIV1
0
PLLEN
1
0
PLLDIV2
PLLDIV3
PLLENSRC
PLLDIV4
PLLDIV5
PLLDIV6
PLLDIV7
PLLDIV8
PLLDIV9
PLLDIV10
PLLDIV11
/1
SYSCLK1
C66x
CorePac
/x
SYSCLK2
/2
SYSCLK3
/3
SYSCLK4
/y
SYSCLK5
/64
SYSCLK6
To Switch Fabric,
Peripherals,
Accelerators
/6
SYSCLK7
/z
SYSCLK8
/12
SYSCLK9
/3
SYSCLK10
/6
SYSCLK11
Figure 6-3. Main PLL and PLL Controller
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NOTE
PLLM[5:0] bits of the multiplier are controlled by the PLLM register inside the PLL controller
and PLLM[12:6] bits are controlled by the chip-level MAINPLLCTL0 register. The complete
13-bit value is latched when the GO operation is initiated in the PLL controller. Only
PLLDIV2, PLLDIV5, and PLLDIV8 are programmable on the C665x device. See the PhaseLocked Loop (PLL) for KeyStone Devices User's Guide for more details on how to program
the PLL controller.
The multiplication and division ratios within the PLL and the post-division for each of the chip-level clocks
are determined by a combination of this PLL and the PLL controller. The PLL controller also controls reset
propagation through the chip, clock alignment, and test points. The PLL controller monitors the PLL status
and provides an output signal indicating when the PLL is locked.
Main PLL power is supplied externally through the Main PLL power-supply pin (AVDDA1). An external
EMI filter circuit must be added to all PLL supplies. See the Hardware Design Guide for KeyStone Devices
for detailed recommendations. For the best performance, TI recommends placing all the PLL external
components on one side of the board without jumpers, switches, or components other than those shown.
For reduced PLL jitter, maximize the spacing between switching signal traces and the PLL external
components (C1, C2, and the EMI Filter).
The minimum SYSCLK rise and fall times should also be observed. For the input clock timing
requirements, see Section 5.7.4.
NOTE
The PLL controller as described in the Phase-Locked Loop (PLL) for KeyStone Devices
User's Guide includes a superset of features, some of which are not supported on the C665x
device. The following sections describe the registers that are supported; it should be
assumed that any registers not included in these sections is not supported by the device.
Furthermore, only the bits within the registers described here are supported. Avoid writing to
any reserved memory location or changing the value of reserved bits.
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6.6.1
SPRS814D – MARCH 2012 – REVISED OCTOBER 2019
Main PLL Controller Device-Specific Information
6.6.1.1
Internal Clocks and Maximum Operating Frequencies
The Main PLL, used to drive the CorePacs, the switch fabric, and a majority of the peripheral clocks (all
but the DDR3) requires a PLL controller to manage the various clock divisions, gating, and
synchronization. The PLL controller of the Main PLL has several SYSCLK outputs that follow, as well as
the clock description. Each SYSCLK has a corresponding divider that divides down the output clock of the
PLL. Dividers are not programmable unless explicitly mentioned in the following description.
•
•
•
•
•
•
•
•
•
•
•
SYSCLK1: Full-rate clock for the CorePacs.
SYSCLK2: 1/x-rate clock for CorePac emulation. The default rate for this is 1/3. It is programmable from /1 to /32,
where this clock does not violate the max of 350 MHz. The SYSCLK2 can be turned off by software.
SYSCLK3: 1/2-rate clock used to clock the MSMC, HyperLink, and DDR EMIF.
SYSCLK4: 1/3-rate clock for the switch fabrics and fast peripherals. The Debug_SS and ETBs use this as well.
SYSCLK5: 1/y-rate clock for the system trace module only. The default rate for this is 1/5. It is configurable and
the max configurable clock is 210 MHz and min configurable clock is 32 MHz. The SYSCLK5 can be turned off by
software.
SYSCLK6: 1/64-rate clock. 1/64 rate clock (emif_ptv) used to clock the PVT-compensated buffers for DDR3 EMIF.
SYSCLK7: 1/6-rate clock for slow peripherals (GPIO, UART, Timer, I2C, SPI, EMIF16, McBSP, and so forth.) and
sources the SYSCLKOUT output pin.
SYSCLK8: 1/z-rate clock. This clock is used as slow_sysclk in the system. Default is 1/64. It is programmable from
/24 to /80.
SYSCLK9: 1/12-rate clock for SmartReflex.
SYSCLK10: 1/3-rate clock for SRIO only.
SYSCLK11: 1/6-rate clock for PSC only.
Only SYSCLK2, SYSCLK5, and SYSCLK8 are programmable on the C665x device.
NOTE
In case any of the other programmable SYSCLKs are set slower than 1/64 rate, then
SYSCLK8 (SLOW_SYSCLK) must be programmed to either match, or be slower than, the
slowest SYSCLK in the system.
6.6.1.2
Main PLL Controller Operating Modes
The Main PLL controller has two modes of operation: bypass mode and PLL mode. The mode of
operation is determined by BYPASS bit of the PLL Secondary Control Register (SECCTL). In PLL mode,
SYSCLK1 is generated from the PLL output using the values set in PLLM and PLLD bit fields in the
MAINPLLCTL0 Register. In bypass mode, PLL input is fed directly out as SYSCLK1.
All hosts must hold off accesses to the DSP while the frequency of its internal clocks is changing. A
mechanism must be in place such that the DSP notifies the host when the PLL configuration has
completed.
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PLL Controller Memory Map
The memory map of the PLL controller is shown in Table 6-9. C665x-specific PLL Controller register
definitions can be found in the sections following Table 6-9. For other registers in the table, see the
Phase-Locked Loop (PLL) for KeyStone Devices User's Guide.
NOTE
Only registers documented here are accessible on the C665x. Other addresses in the PLL
controller memory map including the reserved registers should not be modified. Furthermore,
only the bits within the registers described here are supported. Avoid writing to any reserved
memory location or changing the value of reserved bits. It is recommended to use readmodify-write sequence to make any changes to the valid bits in the register.
Table 6-9. PLL Controller Registers (Including Reset Controller)
HEX ADDRESS RANGE
FIELD
REGISTER NAME
0231 0000 - 0231 00E3
-
Reserved
0231 00E4
RSTYPE
Reset Type Status Register (Reset Controller)
0231 00E8
RSTCTRL
Software Reset Control Register (Reset Controller)
0231 00EC
RSTCFG
Reset Configuration Register (Reset Controller)
0231 00F0
RSISO
Reset Isolation Register (Reset Controller)
0231 00F0 - 0231 00FF
-
Reserved
0231 0100
PLLCTL
PLL Control Register
0231 0104
-
Reserved
0231 0108
SECCTL
PLL Secondary Control Register
0231 010C
-
Reserved
0231 0110
PLLM
PLL Multiplier Control Register
0231 0114
-
Reserved
0231 0118
PLLDIV1
Reserved
0231 011C
PLLDIV2
PLL Controller Divider 2 Register
0231 0120
PLLDIV3
Reserved
0231 0124
-
Reserved
0231 0128
-
Reserved
0231 012C - 0231 0134
-
Reserved
0231 0138
PLLCMD
PLL Controller Command Register
0231 013C
PLLSTAT
PLL Controller Status Register
0231 0140
ALNCTL
PLL Controller Clock Align Control Register
0231 0144
DCHANGE
PLLDIV Ratio Change Status Register
0231 0148
CKEN
Reserved
0231 014C
CKSTAT
Reserved
0231 0150
SYSTAT
SYSCLK Status Register
0231 0154 - 0231 015C
-
Reserved
0231 0160
PLLDIV4
Reserved
0231 0164
PLLDIV5
PLL Controller Divider 5 Register
0231 0168
PLLDIV6
Reserved
0231 016C
PLLDIV7
Reserved
0231 0170
PLLDIV8
PLL Controller Divider 8 Register
0231 0174 - 0231 0193
PLLDIV9 - PLLDIV16
Reserved
0231 0194 - 0231 01FF
-
Reserved
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6.6.2.1
SPRS814D – MARCH 2012 – REVISED OCTOBER 2019
PLL Secondary Control Register (SECCTL)
The PLL Secondary Control Register contains extra fields to control the Main PLL and is shown in
Figure 6-4 and described in Table 6-10.
Figure 6-4. PLL Secondary Control Register (SECCTL)
31
24
23
22
19
18
0
Reserved
BYPASS
OUTPUT_DIVIDE
Reserved
R-0000 0000
RW-0
RW-0001
RW-001 0000 0000 0000 0000
Legend: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-10. PLL Secondary Control Register (SECCTL) Field Descriptions
BIT
FIELD
DESCRIPTION
31-24
Reserved
Reserved
23
BYPASS
Main PLL Bypass Enable
•
0 = Main PLL Bypass disabled.
•
1 = Main PLL Bypass enabled.
22-19
OUTPUT_DIVIDE
Output Divider ratio bits.
•
0h = ÷1. Divide frequency by 1.
•
1h = ÷2. Divide frequency by 2.
•
2h - Fh = Reserved.
18-0
Reserved
Reserved
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PLL Controller Divider Register (PLLDIV2, PLLDIV5, PLLDIV8)
The PLL Controller Divider Registers (PLLDIV2, PLLDIV5, and PLLDIV8) are shown in Figure 6-5 and
described in Table 6-11. The default values of the RATIO field on a reset for PLLDIV2, PLLDIV5, and
PLLDIV8 are different and mentioned in the footnote of Figure 6-5.
Figure 6-5. PLL Controller Divider Register (PLLDIVn)
31
16
15
14
8
Reserved
Dn (1) EN
Reserved
R-0
R/W-1
R-0
7
0
RATIO
R/W-n (2)
Legend: R/W = Read/Write; R = Read only; -n = value after reset
(1)
(2)
D2EN for PLLDIV2; D5EN for PLLDIV5; D8EN for PLLDIV8
n=02h for PLLDIV2; n=04h for PLLDIV5; n=3Fh for PLLDIV8
Table 6-11. PLL Controller Divider Register (PLLDIVn) Field Descriptions
BIT
FIELD
DESCRIPTION
31-16
Reserved
Reserved.
15
DnEN
Divider Dn enable bit. (see footnote of Figure 6-5)
•
0 = Divider n is disabled.
•
1 = No clock output. Divider n is enabled.
14-8
Reserved
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
7-0
RATIO
Divider ratio bits. (see footnote of Figure 6-5)
•
0h = ÷1. Divide frequency by 1.
•
1h = ÷2. Divide frequency by 2.
•
2h = ÷3. Divide frequency by 3.
•
3h = ÷4. Divide frequency by 4.
•
4h - 4Fh = ÷5 to ÷80. Divide frequency by 5 to divide frequency by 80.
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6.6.2.3
SPRS814D – MARCH 2012 – REVISED OCTOBER 2019
PLL Controller Clock Align Control Register (ALNCTL)
The PLL controller clock align control register (ALNCTL) is shown in Figure 6-6 and described in
Table 6-12.
Figure 6-6. PLL Controller Clock Align Control Register (ALNCTL)
31
1
0
Reserved
8
ALN8
7
6
Reserved
5
ALN5
4
3
Reserved
2
ALN2
Reserved
R-0
R/W-1
R-0
R/W-1
R-0
R/W-1
R-0
Legend: R/W = Read/Write; R = Read only; -n = value after reset, for reset value
Table 6-12. PLL Controller Clock Align Control Register (ALNCTL) Field Descriptions
BIT
FIELD
DESCRIPTION
31-8
Reserved
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
ALN8
SYSCLKn alignment. Do not change the default values of these fields.
•
0 = Do not align SYSCLKn to other SYSCLKs during GO operation. If SYSn in DCHANGE is set, SYSCLKn
switches to the new ratio immediately after the GOSET bit in PLLCMD is set.
•
1 = Align SYSCLKn to other SYSCLKs selected in ALNCTL when the GOSET bit in PLLCMD is set and SYSn
in DCHANGE is 1. The SYSCLKn rate is set to the ratio programmed in the RATIO bit in PLLDIVn.
Reserved
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
ALN5
SYSCLKn alignment. Do not change the default values of these fields.
•
0 = Do not align SYSCLKn to other SYSCLKs during GO operation. If SYSn in DCHANGE is set, SYSCLKn
switches to the new ratio immediately after the GOSET bit in PLLCMD is set.
•
1 = Align SYSCLKn to other SYSCLKs selected in ALNCTL when the GOSET bit in PLLCMD is set and SYSn
in DCHANGE is 1. The SYSCLKn rate is set to the ratio programmed in the RATIO bit in PLLDIVn.
Reserved
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
ALN2
SYSCLKn alignment. Do not change the default values of these fields.
•
0 = Do not align SYSCLKn to other SYSCLKs during GO operation. If SYSn in DCHANGE is set, SYSCLKn
switches to the new ratio immediately after the GOSET bit in PLLCMD is set.
•
1 = Align SYSCLKn to other SYSCLKs selected in ALNCTL when the GOSET bit in PLLCMD is set and SYSn
in DCHANGE is 1. The SYSCLKn rate is set to the ratio programmed in the RATIO bit in PLLDIVn.
Reserved
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
7
6-5
4
3-2
1
0
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PLLDIV Divider Ratio Change Status Register (DCHANGE)
When a different ratio is written to the PLLDIVn registers, the PLLCTL flags the change in the DCHANGE
Status Register. During the GO operation, the PLL controller will change only the divide ratio of the
SYSCLKs with the bit set in DCHANGE. The ALNCTL Register determines if that clock also must be
aligned to other clocks. The PLLDIV divider ratio change status register is shown in Figure 6-7 and
described in Table 6-13.
Figure 6-7. PLLDIV Divider Ratio Change Status Register (DCHANGE)
31
1
0
Reserved
8
SYS8
7
6
Reserved
5
SYS5
4
3
Reserved
2
SYS2
Reserved
R-0
R/W-0
R-0
R/W-0
R-0
R/W-0
R-0
Legend: R/W = Read/Write; R = Read only; -n = value after reset, for reset value
Table 6-13. PLLDIV Divider Ratio Change Status Register (DCHANGE) Field Descriptions
BIT
FIELD
DESCRIPTION
31-8
Reserved
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
SYS8
Identifies when the SYSCLKn divide ratio has been modified.
•
0 = SYSCLKn ratio has not been modified. When GOSET is set, SYSCLKn will not be affected.
•
1 = SYSCLKn ratio has been modified. When GOSET is set, SYSCLKn will change to the new ratio.
Reserved
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
SYS5
Identifies when the SYSCLKn divide ratio has been modified.
•
0 = SYSCLKn ratio has not been modified. When GOSET is set, SYSCLKn will not be affected.
•
1 = SYSCLKn ratio has been modified. When GOSET is set, SYSCLKn will change to the new ratio.
Reserved
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
SYS2
Identifies when the SYSCLKn divide ratio has been modified.
•
0 = SYSCLKn ratio has not been modified. When GOSET is set, SYSCLKn will not be affected.
•
1 = SYSCLKn ratio has been modified. When GOSET is set, SYSCLKn will change to the new ratio.
Reserved
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
7
6-5
4
3-2
1
0
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6.6.2.5
SPRS814D – MARCH 2012 – REVISED OCTOBER 2019
SYSCLK Status Register (SYSTAT)
The SYSCLK Status Register (SYSTAT) shows the status of SYSCLK[11:1]. SYSTAT is shown in
Figure 6-8 and described in Table 6-14.
Figure 6-8. SYSCLK Status Register (SYSTAT)
31
10
9
Reserved
11
SYS11
ON
SYS10
ON
R-n
R-1
R-1
8
7
6
5
4
3
2
1
0
SYS9ON SYS8ON SYS7ON SYS6ON SYS5ON SYS4ON SYS3ON SYS2ON SYS1ON
R-1
R-1
R-1
R-1
R-1
R-1
R-1
R-1
R-1
Legend: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-14. SYSCLK Status Register (SYSTAT) Field Descriptions
BIT
FIELD
DESCRIPTION
31-11
Reserved
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
10-0
SYS[N (1)]ON
SYSCLK[N] on status.
•
0 = SYSCLK[N] is gated.
•
1 = SYSCLK[N] is on.
(1)
Where N = 1, 2, 3,....N (Not all these output clocks may be used on a specific device. For more information, see the device-specific data
manual)
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Reset Type Status Register (RSTYPE)
The Reset Type Status (RSTYPE) Register latches the cause of the last reset. If multiple reset sources
occur simultaneously, this register latches the highest priority reset source. The Reset Type Status
Register is shown in Figure 6-9 and described in Table 6-15.
Figure 6-9. Reset Type Status Register (RSTYPE)
31
2
1
0
Reserved
29
EMURST
28
27
Reserved
12
11
WDRST[N]
8
7
Reserved
3
PLLCTRL
RST
RESET
POR
R-0
R-0
R-0
R-0
R-0
R-0
R-0
R-0
Legend: R = Read only; -n = value after reset
Table 6-15. Reset Type Status Register (RSTYPE) Field Descriptions
BIT
FIELD
DESCRIPTION
31-29
Reserved
Reserved. Read only. Always reads as 0. Writes have no effect.
28
EMU-RST
Reset initiated by emulation.
•
0 = Not the last reset to occur.
•
1 = The last reset to occur.
27-12
Reserved
Reserved. Read only. Always reads as 0. Writes have no effect.
11
WDRST3
Reset initiated by watchdog timer[N].
•
0 = Not the last reset to occur.
•
1 = The last reset to occur.
10
WDRST2
Reset initiated by watchdog timer[N].
•
0 = Not the last reset to occur.
•
1 = The last reset to occur.
9
WDRST1
Reset initiated by watchdog timer[N].
•
0 = Not the last reset to occur.
•
1 = The last reset to occur.
8
WDRST0
Reset initiated by watchdog timer[N].
•
0 = Not the last reset to occur.
•
1 = The last reset to occur.
7-3
Reserved
Reserved. Read only. Always reads as 0. Writes have no effect.
2
PLLCTLRST
Reset initiated by PLLCTL.
•
0 = Not the last reset to occur.
•
1 = The last reset to occur.
1
RESET
RESET reset.
•
0 = RESET was not the last reset to occur.
•
1 = RESET was the last reset to occur.
0
POR
Power-on reset.
•
0 = Power-on reset was not the last reset to occur.
•
1 = Power-on reset was the last reset to occur.
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6.6.2.7
SPRS814D – MARCH 2012 – REVISED OCTOBER 2019
Reset Control Register (RSTCTRL)
This register contains a key that enables writes to the MSB of this register and the RSTCFG Register. The
key value is 0x5A69. A valid key will be stored as 0x000C, any other key value is invalid. When the
RSTCTRL or the RSTCFG is written, the key is invalidated. Every write must be set up with a valid key.
The Software Reset Control Register (RSTCTRL) is shown in Figure 6-10 and described in Table 6-16.
Figure 6-10. Reset Control Register (RSTCTRL)
31
17
16
15
0
Reserved
SWRST
KEY
R-0x0000
R/W-0x (1)
R/W-0x0003
Legend: R = Read only; -n = value after reset;
(1)
Writes are conditional based on valid key.
Table 6-16. Reset Control Register (RSTCTRL) Field Descriptions
BIT
FIELD
DESCRIPTION
31-17
Reserved
Reserved.
16
SWRST
Software reset
•
0 = Reset
•
1 = Not reset
15-0
KEY
Key used to enable writes to RSTCTRL and RSTCFG.
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Reset Configuration Register (RSTCFG)
This register is used to configure the type of reset initiated by RESET, watchdog timer and the RSTCTRL
Register of the PLL controller; that is, a hard reset or a soft reset. By default, these resets will be hard
resets. The Reset Configuration Register (RSTCFG) is shown in Figure 6-11 and described in Table 6-17.
Figure 6-11. Reset Configuration Register (RSTCFG)
31
13
12
Reserved
14
PLLCTLRST
TYPE
RESETTYPE
11
Reserved
4
3
WDTYPE[N (1)]
0
R-0
R/W-0 (2)
R/W-02
R-0
R/W-02
Legend: R = Read only; R/W = Read/Write; -n = value after reset
(1)
(2)
Where N = 1, 2, 3,....N (Not all these output may be used on a specific device. For more information, see the device-specific data
manual).
Writes are conditional based on valid key. For details, see Section 6.6.2.7.
Table 6-17. Reset Configuration Register (RSTCFG) Field Descriptions
BIT
FIELD
DESCRIPTION
31-14
Reserved
Reserved.
13
PLLCTLRSTTYPE
PLL controller initiates a software-driven reset of type:
•
0 = Hard reset (default)
•
1 = Soft reset
12
RESETTYPE
RESET initiates a reset of type:
•
0 = Hard Reset (default)
•
1 = Soft Reset
11-4
Reserved
Reserved.
3
WDTYPE3
Watchdog timer [N] initiates a reset of type:
•
0 = Hard Reset (default)
•
1 = Soft Reset
2
WDTYPE2
Watchdog timer [N] initiates a reset of type:
•
0 = Hard Reset (default)
•
1 = Soft Reset
1
WDTYPE1
Watchdog timer [N] initiates a reset of type:
•
0 = Hard Reset (default)
•
1 = Soft Reset
0
WDTYPE0
Watchdog timer [N] initiates a reset of type:
•
0 = Hard Reset (default)
•
1 = Soft Reset
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6.6.2.9
SPRS814D – MARCH 2012 – REVISED OCTOBER 2019
Reset Isolation Register (RSISO)
This register is used to select the module clocks that must maintain their clocking without pausing through
non power-on reset. Setting any of these bits blocks reset to all PLLCTL registers in order to maintain
current values of PLL multiplier, divide ratios, and other settings. Along with setting module specific bit in
RSISO, the corresponding MDCTLx[12] bit also must be set in PSC to reset-isolate a particular module.
For more information on MDCTLx Register, see the Power Sleep Controller (PSC) for KeyStone Devices
User's Guide. The Reset Isolation Register (RSISO) is shown in Figure 6-12 and described in Table 6-18.
Figure 6-12. Reset Isolation Register (RSISO)
31
9
8
Reserved
10
SRIOISO
SRISO
7
Reserved
0
R-0
R/W-0
R/W-0
R-0
Legend: R = Read only; R/W = Read/Write; -n = value after reset
Table 6-18. Reset Isolation Register (RSISO) Field Descriptions
BIT
FIELD
DESCRIPTION
31-10
Reserved
Reserved.
9
SRIOISO
Isolate SRIO module
•
0 = Not reset isolated
•
1 = Reset Isolated
8
SRISO
Isolate SmartReflex
•
0 = Not reset isolated
•
1 = Reset Isolated
7-0
Reserved
Reserved.
NOTE
The boot ROM code will enable the reset isolation for both SRIO and SmartReflex modules
during boot with the Reset Isolation Register. It is up to the user application to disable.
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Main PLL Control Register
The Main PLL uses two chip-level registers (MAINPLLCTL0 and MAINPLLCTL1) and the PLL controller
for its configuration. These MMRs exist inside the Bootcfg space. To write to these registers, software
should go through an unlocking sequence using KICK0/KICK1 registers. For valid configurable values into
the MAINPLLCTL0 and MAINPLLCTL1 Registers, see Section 6.29. See Section 8.3.4 for the address
location of the registers and locking and unlocking sequences for accessing the registers. The registers
are reset on POR only. MAINPLLCTL0 is shown in Figure 6-13 and described in Table 6-19.
MAINPLLCTL1 is shown in Figure 6-14 and described in Table 6-20.
Figure 6-13. Main PLL Control Register 0 (MAINPLLCTL0)
31
24
23
19
18
12
11
6
5
0
BWADJ[7:0]
Reserved
PLLM[12:6]
Reserved
PLLD
RW-0000 0101
RW-0000 0
RW-0000000
RW-000000
RW-000000
Legend: RW = Read/Write; -n = value after reset
Table 6-19. Main PLL Control Register 0 (MAINPLLCTL0) Field Descriptions
BIT
FIELD
DESCRIPTION
31-24
BWADJ[7:0]
BWADJ[11:8] and BWADJ[7:0] are located in separate registers. The combination (BWADJ[11:0]) should be
programmed to a value related to PLLM[12:0] value based on the equation: BWADJ = ((PLLM+1)>>1) -1
23-19
Reserved
Reserved
18-12
PLLM[12:6]
A 13-bit bus that selects the values for the multiplication factor (see the following Note)
11-6
Reserved
Reserved
5-0
PLLD
A 6-bit bus that selects the values for the reference divider
Figure 6-14. Main PLL Control Register 1 (MAINPLLCTL1)
31
7
6
5
4
3
0
Reserved
ENSAT
Reserved
BWADJ[11:8]
RW-0000000000000000000000000
RW-0
RW-00
RW-0000
Legend: RW = Read/Write; -n = value after reset
Table 6-20. Main PLL Control Register 1 (MAINPLLCTL1) Field Descriptions
BIT
FIELD
DESCRIPTION
31-7
Reserved
Reserved
6
ENSAT
Needs to be set to 1 for proper operation of PLL
5-4
Reserved
Reserved
3-0
BWADJ[11:8]
BWADJ[11:8] and BWADJ[7:0] are located in separate registers. The combination (BWADJ[11:0]) should be
programmed to a value related to PLLM[12:0] value based on the equation: BWADJ = ((PLLM+1)>>1) -1
NOTE
PLLM[5:0] bits of the multiplier are controlled by the PLLM Register inside the PLL controller
and PLLM[12:6] bits are controlled by the MAINPLLCTL0 chip-level register. The
MAINPLLCTL0 Register PLLM[12:6] bits should be written just before writing to the PLLM
Register PLLM[5:0] bits in the controller to have the complete 13-bit value latched when the
GO operation is initiated in the PLL controller. See the Phase-Locked Loop (PLL) for
KeyStone Devices User's Guide for the recommended programming sequence. Output divide
ratio and bypass enable/disable of the Main PLL is controlled by the SECCTL Register in the
PLL Controller. See the Section 6.6.2.1 for more details.
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6.6.4
SPRS814D – MARCH 2012 – REVISED OCTOBER 2019
Main PLL and PLL Controller Initialization Sequence
See the Phase-Locked Loop (PLL) for KeyStone Devices User's Guide for details on the initialization
sequence for Main PLL and PLL Controller.
6.7
DDR3 PLL
The DDR3 PLL generates interface clocks for the DDR3 memory controller. When coming out of power-on
reset, the DDR3 PLL is programmed to a valid frequency during the boot config before being enabled and
used.
DDR3 PLL power is supplied externally through the Main PLL power-supply pin (AVDDA2). An external
EMI filter circuit must be added to all PLL supplies. See the Hardware Design Guide for KeyStone
Devices. For the best performance, TI recommends placing all the PLL external components on one side
of the board without jumpers, switches, or components other than those shown. For reduced PLL jitter,
maximize the spacing between switching signal traces and the PLL external components (C1, C2, and the
EMI Filter).
Figure 6-15 shows the DDR3 PLL.
DDR3 PLL
PLLD
xPLLM
/2
0
DDRCLK(N|P)
PLLOUT
DDR3
PHY
1
BYPASS
Figure 6-15. DDR3 PLL Block Diagram
6.7.1
DDR3 PLL Control Register
The DDR3 PLL, which is used to drive the DDR PHY for the EMIF, does not use a PLL controller. The
DDR3 PLL can be controlled using the DDR3PLLCTL0 and DDR3PLLCTL1 Registers in the Bootcfg
module. These MMRs exist inside the Bootcfg space. To write to these registers, software should go
through an unlocking sequence using the KICK0/KICK1 registers. For suggested configurable values, see
Section 8.3.4 for the address location of the registers and locking and unlocking sequences for accessing
the registers. This register is reset on POR only. DDR3PLLCTL0 is shown in Figure 6-16 and described in
Table 6-21. DDR3PLLCTL1 is shown in Figure 6-17 and described in Table 6-22.
Figure 6-16. DDR3 PLL Control Register 0 (DDR3PLLCTL0) (1)
31
24
23
22
19
18
6
5
0
BWADJ[7:0]
BYPASS
Reserved
PLLM
PLLD
RW,+0000 1001
RW,+0
RW,+0001
RW,+0000000010011
RW,+000000
Legend: RW = Read/Write; -n = value after reset
(1)
This register is Reset on POR only. The regreset, reset and bgreset from PLL are all tied to a common pll0_ctrl_rst_n The pwrdn,
regpwrdn, bgpwrdn are all tied to common pll0_ctrl_to_pll_pwrdn.
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Table 6-21. DDR3 PLL Control Register 0 Field Descriptions
BIT
FIELD
DESCRIPTION
31-24
BWADJ[7:0]
BWADJ[11:8] and BWADJ[7:0] are located in DDR3PLLCTL0 and DDR3PLLCTL1 registers. The combination
(BWADJ[11:0]) should be programmed to a value related to PLLM[12:0] value based on the equation: BWADJ
= ((PLLM+1)>>1) -1
23
BYPASS
Enable bypass mode
•
0 = Bypass disabled
•
1 = Bypass enabled
22-19
Reserved
Reserved
18-6
PLLM
A 13-bit bus that selects the values for the multiplication factor
5-0
PLLD
A 6-bit bus that selects the values for the reference divider
Figure 6-17. DDR3 PLL Control Register 1 (DDR3PLLCTL1)
31
14
Reserved
13
12
PLLRST
RW-000000000000000000
RW-0
7
Reserved
RW-000000
6
5
4
3
0
ENSAT
Reserved
BWADJ[11:8]
RW-0
R-0
RW-0000
Legend: RW = Read/Write; -n = value after reset
Table 6-22. DDR3 PLL Control Register 1 Field Descriptions
BIT
FIELD
DESCRIPTION
31-14
Reserved
Reserved
13
PLLRST
PLL reset bit.
•
0 = PLL reset is released.
•
1 = PLL reset is asserted.
12-7
Reserved
Reserved
6
ENSAT
Needs to be set to 1 for proper operation of the PLL
5-4
Reserved
Reserved
3-0
BWADJ[11:8]
BWADJ[11:8] and BWADJ[7:0] are located in separate registers. The combination (BWADJ[11:0]) should be
programmed to a value related to PLLM[12:0] value based on the equation: BWADJ = ((PLLM+1)>>1) -1
6.7.2
DDR3 PLL Device-Specific Information
As shown in Figure 6-15, the output of DDR3 PLL (PLLOUT) is divided by 2 and directly fed to the DDR3
memory controller. The DDR3 PLL is affected by power-on reset. During power-on resets, the internal
clocks of the DDR3 PLL are affected as described in Section 6.5. The DDR3 PLL is unlocked only during
the power-up sequence and is locked by the time the RESETSTAT pin goes high. It does not lose lock
during any of the other resets.
6.7.3
DDR3 PLL Initialization Sequence
See the Phase-Locked Loop (PLL) for KeyStone Devices User's Guide for details on the initialization
sequence for DDR3 PLL.
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6.8
SPRS814D – MARCH 2012 – REVISED OCTOBER 2019
Enhanced Direct Memory Access (EDMA3) Controller
The primary purpose of the EDMA3 is to service user-programmed data transfers between two memorymapped slave endpoints on the device. The EDMA3 services software-driven paging transfers (for
example, data movement between external memory and internal memory), performs sorting or subframe
extraction of various data structures, services event driven peripherals, and offloads data transfers from
the device CPU.
There is one EDMA Channel Controller on the C665x device: EDMA3_CC. It has four transfer controllers:
TC0, TC1, TC2, and TC3. In the context of this document, TCx associated with CC is referred to as
EDMA3_CC_TCx. Each of the transfer controllers has a direct connection to the switch fabric. Section 9.2
lists the peripherals that can be accessed by the transfer controllers.
The EDMA3 Channel Controller includes the following features:
•
•
•
•
•
•
•
•
Fully orthogonal transfer description
– Three transfer dimensions:
• Array (multiple bytes)
• Frame (multiple arrays)
• Block (multiple frames)
– Single event can trigger transfer of array, frame, or entire block
– Independent indexes on source and destination
Flexible transfer definition:
– Increment or FIFO transfer addressing modes
– Linking mechanism allows for ping-pong buffering, circular buffering, and repetitive/continuous transfers, all
with no CPU intervention
– Chaining allows multiple transfers to execute with one event
512 PaRAM entries
– Used to define transfer context for channels
– Each PaRAM entry can be used as a DMA entry, QDMA entry, or link entry
64 DMA channels
– Manually triggered (CPU writes to channel controller register), external event triggered, and chain triggered
(completion of one transfer triggers another)
Eight Quick DMA (QDMA) channels
– Used for software-driven transfers
– Triggered upon writing to a single PaRAM set entry
Four transfer controllers and four event queues with programmable system-level priority
Interrupt generation for transfer completion and error conditions
Debug visibility
– Queue watermarking/threshold allows detection of maximum usage of event queues
– Error and status recording to facilitate debug
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EDMA3 Device-Specific Information
The EDMA supports two addressing modes: constant addressing and increment addressing mode.
Constant addressing mode is applicable to a very limited set of use cases. For most applications,
increment mode must be used. On the C665x, the EDMA can use constant addressing mode only with the
Enhanced Viterbi-Decoder Coprocessor (VCP) and the Enhanced Turbo Decoder Coprocessor (TCP).
Constant addressing mode is not supported by any other peripheral or internal memory in the device.
Increment mode is supported by all peripherals, including VCP and TCP. For more information on these
two addressing modes, see the Enhanced Direct Memory Access 3 (EDMA3) for KeyStone Devices
User's Guide.
For the range of memory addresses that include EDMA3 channel controller (EDMA3_CC) control registers
and EDMA3 transfer controller (TC) control register, see Table 6-63. For memory offsets and other details
on EDMA3_CC and TC control registers entries, see the Enhanced Direct Memory Access 3 (EDMA3) for
KeyStone Devices User's Guide.
6.8.2
EDMA3 Channel Controller Configuration
Table 6-23 provides the configuration of the EDMA3 channel controller present on the device.
Table 6-23. EDMA3 Channel Controller Configuration
6.8.3
DESCRIPTION
EDMA3_CC
Number of DMA channels in Channel Controller
64
Number of QDMA channels
8
Number of interrupt channels
64
Number of PaRAM set entries
512
Number of event queues
4
Number of Transfer Controllers
4
Memory Protection Existence
Yes
Number of Memory Protection and Shadow Regions
8
EDMA3 Transfer Controller Configuration
Each transfer controller on a device is designed differently based on considerations like performance
requirements, system topology (like main TeraNet bus width, external memory bus width), and so on. The
parameters that determine the transfer controller configurations are:
•
•
•
•
FIFOSIZE: Determines the size in bytes for the data FIFO that is the temporary buffer for the in-flight data. The
data FIFO is where the read return data read by the TC read controller from the source endpoint is stored and
subsequently written out to the destination endpoint by the TC write controller.
BUSWIDTH: The width of the read and write data buses, in bytes, for the TC read and write controller,
respectively. This is typically equal to the bus width of the main TeraNet interface.
Default Burst Size (DBS): The DBS is the maximum number of bytes per read/write command issued by a
transfer controller.
DSTREGDEPTH: This determines the number of destination FIFO register set. The number of destination FIFO
register set for a transfer controller determines the maximum number of outstanding transfer requests.
All four parameters listed above are specified by the design of the device.
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Table 6-24 provides the configuration of the EDMA3 transfer controller present on the device.
Table 6-24. EDMA3 Transfer Controller Configuration
EDMA3 CC
6.8.4
PARAMETER
TC0
TC1
TC2
TC3
FIFOSIZE
1024 bytes
512 bytes
512 bytes
1024 bytes
BUSWIDTH
16 bytes
16 bytes
16 bytes
16 bytes
DSTREGDEPTH
4 entries
4 entries
4 entries
4 entries
DBS
64 bytes
64 bytes
64 bytes
64 bytes
EDMA3 Channel Synchronization Events
The EDMA3 supports up to 64 DMA channels for EDMA3_CC that can be used to service system
peripherals and to move data between system memories. DMA channels can be triggered by
synchronization events generated by system peripherals. Table 6-25 lists the source of the
synchronization event associated with each of the EDMA3_CC DMA channels. On the C665x, the
association of each synchronization event and DMA channel is fixed and cannot be reprogrammed.
For more detailed information on the EDMA3 module and how EDMA3 events are enabled, captured,
processed, prioritized, linked, chained, and cleared, and so forth, see the Enhanced Direct Memory
Access 3 (EDMA3) for KeyStone Devices User's Guide.
Table 6-25. EDMA3_CC Events for C665x
EVENT
NUMBER
EVENT
EVENT DESCRIPTION
0
TCP3D_AREVT0
TCP3D_A receive event0
1
TCP3D_AREVT1
TCP3D_A receive event1
2
TINT2L
Timer2 interrupt low
3
TINT2H
Timer2 interrupt high
4
URXEVT
UART0 receive event
5
UTXEVT
UART0 transmit event
6
GPINT0
GPIO interrupt
7
GPINT1
GPIO interrupt
8
GPINT2
GPIO Interrupt
9
GPINT3
GPIO interrupt
10
VCPAREVT
VCP2_A receive event
11
VCPAXEVT
VCP2_A transmit event
12
VCPBREVT
VCP2_B receive event
13
VCPBXEVT
VCP2_B transmit event
14
URXEVT_B
UART1 receive event
15
UTXEVT_B
UART1 transmit event
16
SPIINT0
SPI interrupt
17
SPIINT1
SPI interrupt
18
SEMINT0
Semaphore interrupt
19
SEMINT1
Semaphore interrupt
20
SEMINT2
Semaphore interrupt
21
SEMINT3
Semaphore interrupt
22
TINT4L
Timer4 interrupt low
23
TINT4H
Timer4 interrupt high
24
TINT5L
Timer5 interrupt low
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Table 6-25. EDMA3_CC Events for C665x (continued)
102
EVENT
NUMBER
EVENT
EVENT DESCRIPTION
25
TINT5H
Timer5 interrupt high
26
TINT6L
Timer6 interrupt low
27
TINT6H
Timer6 interrupt high
28
TINT7L
Timer7 interrupt low
29
TINT7H
Timer7 interrupt high
30
SPIXEVT
SPI transmit event
31
SPIREVT
SPI receive event
32
I2CREVET
I2C receive event
33
I2CXEVT
I2C transmit event
34
TINT3L
Timer3 interrupt low
35
TINT3H
Timer3 interrupt high
36
MCBSP0_REVT
McBSP_0 receive event
37
MCBSP0_XEVT
McBSP_0 transmit event
38
MCBSP1_REVT
McBSP_1 receive event
39
MCBSP1_XEVT
McBSP_1 transmit event
40
TETBHFULLINT
TETB half full interrupt
41
TETBHFULLINT0
TETB half full interrupt
42
TETBHFULLINT1
TETB half full interrupt
43
CIC1_OUT0
Interrupt Controller output
44
CIC1_OUT1
Interrupt Controller output
45
CIC1_OUT2
Interrupt Controller output
46
CIC1_OUT3
Interrupt Controller output
47
CIC1_OUT4
Interrupt Controller output
48
CIC1_OUT5
Interrupt Controller output
49
CIC1_OUT6
Interrupt Controller output
50
CIC1_OUT7
Interrupt Controller output
51
CIC1_OUT8
Interrupt Controller output
52
CIC1_OUT9
Interrupt Controller output
53
CIC1_OUT10
Interrupt Controller output
54
CIC1_OUT11
Interrupt Controller output
55
CIC1_OUT12
Interrupt Controller output
56
CIC1_OUT13
Interrupt Controller output
57
CIC1_OUT14
Interrupt Controller output
58
CIC1_OUT15
Interrupt Controller output
59
CIC1_OUT16
Interrupt Controller output
60
CIC1_OUT17
Interrupt Controller output
61
TETBFULLINT
TETB full interrupt
62
TETBFULLINT0
TETB full interrupt
63
TETBFULLINT1
TETB full interrupt
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6.9
6.9.1
SPRS814D – MARCH 2012 – REVISED OCTOBER 2019
Interrupts
Interrupt Sources and Interrupt Controller
The CPU interrupts on the C665x device are configured through the C66x CorePac Interrupt Controller.
The interrupt controller allows for up to 128 system events to be programmed to any of the 12 CPU
interrupt inputs (CPUINT4–CPUINT15), the CPU exception input (EXCEP), or the advanced emulation
logic. The 128 system events consist of both internally-generated events (within the CorePac) and chiplevel events.
Additional system events are routed to each of the C66x CorePacs to provide chip-level events that are
not required as CPU interrupts/exceptions to be routed to the interrupt controller as emulation events. In
addition, error-class events or infrequently used events are also routed through the system event router to
offload the C66x CorePac interrupt selector. This is accomplished through CIC blocks, CIC[2:0]. This is
clocked using CPU/6.
The event controllers consist of simple combination logic to provide additional events to the C66x
CorePacs, plus the EDMA3_CC and CIC0 provide 12 additional events as well as 8 broadcast events to
the C66x CorePacs. CIC1 provides 18 additional events to EDMA3_CC, and CIC2 provides 32 additional
events to HyperLink.
There are numerous events on the chip-level. The chip-level CIC provides a flexible way to combine and
remap those events. Multiple events can be combined to a single event through chip-level CIC. However,
an event can be mapped only to a single event output from the chip-level CIC. The chip-level CIC also
allows the software to trigger system events through memory writes. The broadcast events to C66x
CorePacs can be used for synchronization among multiple cores, interprocessor communication purposes,
and so forth. For more details on the CIC features, see the Chip Interrupt Controller (CIC) for KeyStone
Devices User's Guide.
NOTE
Modules such as MPU, Tracer, and BOOT_CFG have level interrupts and an EOI
handshaking interface. The EOI value is 0 for MPU, Tracer, and BOOT_CFG.
Figure 6-18 shows the C665x interrupt topology.
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16 Reserved Secondary Events
106 Primary Events
26 Reserved Secondary Events
12 Secondary Events
Core0
2 Reserved Primary Events
100 Core-only Secondary Events
CIC0
106 Primary Events
12 Secondary Events
82 Common Events
Core1
(C6657 only)
2 Reserved Primary Events
8 Broadcast Events from CIC0
82 Common Events
21 Reserved Secondary Events
11 Reserved Secondary Events
CIC1
46 Primary Events
57 EDMA3_CC-only
Secondary Events
18 Secondary Events
8 Reserved Secondary Events
12 Reserved Secondary Events
CIC2
68 Events
EDMA3
CC
32 Queue Events
HyperLink
32 Secondary Events
Figure 6-18. C665x Interrupt Topology
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Table 6-26 shows the mapping of system events. For more information on the Interrupt Controller, see the
C66x CorePac User's Guide.
Table 6-26. C665x System Event Inputs — C66x CorePac Primary Interrupts
INPUT EVENT
NUMBER
INTERRUPT EVENT
DESCRIPTION
0
EVT0
Event combiner 0 output
1
EVT1
Event combiner 1 output
2
EVT2
Event combiner 2 output
3
EVT3
Event combiner 3 output
4
TETBHFULLINTn (1)
TETB is half full
(1)
5
TETBFULLINTn
6
TETBACQINTn (1)
TETB is full
Acquisition has been completed
7
TETBOVFLINTn (1)
Overflow condition interrupt
8
TETBUNFLINTn (1)
Underflow condition interrupt
9
EMU_DTDMA
ECM interrupt for:
•
1. Host scan access
•
2. DTDMA transfer complete
•
3. AET interrupt
10
MSMC_mpf_errorn (2)
Memory protection fault indicators for local core
11
EMU_RTDXRX
RTDX receive complete
12
EMU_RTDXTX
RTDX transmit complete
13
IDMA0
IDMA channel 0 interrupt
14
IDMA1
IDMA channel 1 interrupt
15
SEMERRn (3)
Semaphore error interrupt
16
SEMINTn (3)
Semaphore interrupt
(4)
17
PCIExpress_MSI_INTn
18
PCIExpress_MSI_INTn+4 (4)
Message signaled interrupt mode
Message signaled interrupt mode
19
MACINTn (5)
EMAC interrupt
20
INTDST(n+16)
(6)
SRIO Interrupt
21
INTDST(n+20) (7)
SRIO Interrupt
22
CIC0_OUT(0+20*n) (8)
Interrupt Controller Output
23
CIC0_OUT(1+20*n)
(8)
Interrupt Controller Output
24
CIC0_OUT(2+20*n) (8)
Interrupt Controller Output
25
CIC0_OUT(3+20*n) (8)
Interrupt Controller Output
26
CIC0_OUT(4+20*n) (8)
Interrupt Controller Output
27
CIC0_OUT(5+20*n)
(8)
Interrupt Controller Output
28
CIC0_OUT(6+20*n) (8)
Interrupt Controller Output
29
CIC0_OUT(7+20*n) (8)
Interrupt Controller Output
30
CIC0_OUT(8+20*n)
(8)
Interrupt Controller Output
31
CIC0_OUT(9+20*n) (8)
Interrupt Controller Output
32
QM_INT_LOW_0
QM Interrupt for 0~31 Queues
33
QM_INT_LOW_1
QM Interrupt for 32~63 Queues
34
QM_INT_LOW_2
QM Interrupt for 64~95 Queues
35
QM_INT_LOW_3
QM Interrupt for 96~127 Queues
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
CorePac[n] will receive TETBHFULLINTn, TETBFULLINTn, TETBACQINTn, TETBOVFLINTn, and TETBUNFLINTn.
CorePac[n] will receive MSMC_mpf_errorn.
CorePac[n] will receive SEMINTn and SEMERRn.
CorePac[n] will receive PCIEXpress_MSI_INTn.
CorePac[n] will receive MACINTn/MACRXINTn/MACTXINTn/MACTRESHn.
CorePac[n] will receive INTDST(n+16).
CorePac[n] will receive INTDST(n+20).
n is core number.
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Table 6-26. C665x System Event Inputs — C66x CorePac Primary Interrupts (continued)
INPUT EVENT
NUMBER
INTERRUPT EVENT
DESCRIPTION
36
QM_INT_LOW_4
QM Interrupt for 128~159 Queues
37
QM_INT_LOW_5
QM Interrupt for 160~191 Queues
38
QM_INT_LOW_6
QM Interrupt for 192~223 Queues
39
QM_INT_LOW_7
QM Interrupt for 224~255 Queues
40
QM_INT_LOW_8
QM Interrupt for 256~287 Queues
41
QM_INT_LOW_9
QM Interrupt for 288~319 Queues
42
QM_INT_LOW_10
QM Interrupt for 320~351 Queues
43
QM_INT_LOW_11
QM Interrupt for 352~383 Queues
44
QM_INT_LOW_12
QM Interrupt for 384~415 Queues
45
QM_INT_LOW_13
QM Interrupt for 416~447 Queues
46
QM_INT_LOW_14
QM Interrupt for 448~479 Queues
47
QM_INT_LOW_15
QM Interrupt for 480~511 Queues
48
QM_INT_HIGH_n (8)
QM Interrupt for Queue 704+n (8)
49
QM_INT_HIGH_(n+4) (8)
QM Interrupt for Queue 708+n (8)
50
(8)
QM Interrupt for Queue 712+n (8)
QM_INT_HIGH_(n+8)
51
QM_INT_HIGH_(n+12)
(8)
QM Interrupt for Queue 716+n (8)
52
QM_INT_HIGH_(n+16) (8)
QM Interrupt for Queue 720+n (8)
53
QM_INT_HIGH_(n+20)
(8)
QM Interrupt for Queue 724+n (8)
54
QM_INT_HIGH_(n+24)
(8)
QM Interrupt for Queue 728+n (8)
55
QM_INT_HIGH_(n+28) (8)
QM Interrupt for Queue 732+n (8)
56
CIC0_OUT40
Interrupt Controller Output
57
CIC0_OUT41
Interrupt Controller Output
58
CIC0_OUT42
Interrupt Controller Output
59
CIC0_OUT43
Interrupt Controller Output
60
CIC0_OUT44
Interrupt Controller Output
61
CIC0_OUT45
Interrupt Controller Output
62
CIC0_OUT46
Interrupt Controller Output
63
CIC0_OUT47
Interrupt Controller Output
64
TINTLn (9)
Local timer interrupt low
65
TINTHn (9)
Local timer interrupt high
66
TINT2L
Timer2 interrupt low
67
TINT2H
Timer2 interrupt high
68
TINT3L
Timer3 interrupt low
69
TINT3H
Timer3 interrupt high
70
PCIExpress_MSI_INTn+2 (4)
Message signaled interrupt mode
71
PCIExpress_MSI_INTn+6 (4)
Message signaled interrupt mode
72
GPINT2
GPIO interrupt
73
GPINT3
GPIO interrupt
74
MACINTn+2 (5)
EMAC interrupt
75
MACTXINTn+2 (5)
EMAC interrupt
(5)
76
MACTRESHn+2
77
MACRXINTn+2 (5)
EMAC interrupt
78
GPINT4
GPIO interrupt
79
GPINT5
GPIO interrupt
80
GPINT6
GPIO interrupt
81
GPINT7
GPIO interrupt
(9)
106
EMAC interrupt
CorePac[n] will receive TINTLn and TINTHn.
Detailed Description
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Table 6-26. C665x System Event Inputs — C66x CorePac Primary Interrupts (continued)
INPUT EVENT
NUMBER
INTERRUPT EVENT
DESCRIPTION
82
GPINT8
GPIO interrupt
83
GPINT9
GPIO interrupt
84
GPINT10
GPIO interrupt
85
GPINT11
GPIO interrupt
86
GPINT12
GPIO interrupt
87
GPINT13
GPIO interrupt
88
GPINT14
GPIO interrupt
89
GPINT15
GPIO interrupt
90
IPC_LOCAL
Inter DSP interrupt from IPCGRn
91
GPINTn (10)
Local GPIO interrupt
92
CIC0_OUT(10+20*n)
(8)
Interrupt Controller Output
93
CIC0_OUT(11+20*n) (8)
Interrupt Controller Output
94
MACTXINTn (5)
EMAC interrupt
(5)
95
MACTRESHn
96
INTERR
Dropped CPU interrupt event
97
EMC_IDMAERR
Invalid IDMA parameters
98
Reserved
99
MACRXINTn (5)
EMAC interrupt
100
EFIINTA
EFI Interrupt from side A
101
EFIINTB
102
103
EMAC interrupt
EFI Interrupt from side B
QM_INT_HIGH_(n+2)
(8)
QM Interrupt for Queue 706+n (8)
QM_INT_HIGH_(n+6)
(8)
QM Interrupt for Queue 710+n (8)
104
QM_INT_HIGH_(n+10)
(8)
QM Interrupt for Queue 714+n (8)
105
QM_INT_HIGH_(n+14) (8)
QM Interrupt for Queue 718+n (8)
106
QM_INT_HIGH_(n+18)
(8)
QM Interrupt for Queue 722+n (8)
107
QM_INT_HIGH_(n+22)
(8)
QM Interrupt for Queue 726+n (8)
108
QM_INT_HIGH_(n+26) (8)
QM Interrupt for Queue 730+n (8)
109
QM_INT_HIGH_(n+30)
(8)
QM Interrupt for Queue 734+n (8)
110
MDMAERREVT
111
Reserved
112
INTDST(n+18) (11)
SRIO Interrupt
113
PMC_ED
Single bit error detected during DMA read
114
INTDST(n+22) (12)
SRIO Interrupt
115
EDMA3_CC_AETEVT
EDMA3 CC AET Event
116
UMC_ED1
Corrected bit error detected
117
UMC_ED2
Uncorrected bit error detected
118
PDC_INT
Power down sleep interrupt
119
SYS_CMPA
SYS CPU memory protection fault event
120
PMC_CMPA
PMC CPU memory protection fault event
121
PMC_DMPA
PMC DMA memory protection fault event
122
DMC_CMPA
DMC CPU memory protection fault event
123
DMC_DMPA
DMC DMA memory protection fault event
124
UMC_CMPA
UMC CPU memory protection fault event
125
UMC_DMPA
UMC DMA memory protection fault event
VbusM error event
(10) CorePac[n] will receive GPINTn.
(11) CorePac[n] will receive INTDST(n+18).
(12) CorePac[n] will receive INTDST(n+22).
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Table 6-26. C665x System Event Inputs — C66x CorePac Primary Interrupts (continued)
INPUT EVENT
NUMBER
INTERRUPT EVENT
DESCRIPTION
126
EMC_CMPA
EMC CPU memory protection fault event
127
EMC_BUSERR
EMC bus error interrupt
108
Detailed Description
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Table 6-27. CIC0 Event Inputs (Secondary Interrupts for C66x CorePacs)
INPUT EVENT NO. ON
CIC
SYSTEM INTERRUPT
DESCRIPTION
0
GPINT16
GPIO interrupt
1
GPINT17
GPIO interrupt
2
GPINT18
GPIO interrupt
3
GPINT19
GPIO interrupt
4
GPINT20
GPIO interrupt
5
GPINT21
GPIO interrupt
6
GPINT22
GPIO interrupt
7
GPINT23
GPIO interrupt
8
GPINT24
GPIO interrupt
9
GPINT25
GPIO interrupt
10
GPINT26
GPIO interrupt
11
GPINT27
GPIO interrupt
12
GPINT28
GPIO interrupt
13
GPINT29
GPIO interrupt
14
GPINT30
GPIO interrupt
15
GPINT31
GPIO interrupt
16
EDMA3_CC_ERRINT
EDMA3_CC error interrupt
17
EDMA3_CC_MPINT
EDMA3_CC memory protection interrupt
18
EDMA3_TC_ERRINT0
EDMA3_CC TC0 error interrupt
19
EDMA3_TC_ERRINT1
EDMA3_CC TC1 error interrupt
20
EDMA3_TC_ERRINT2
EDMA3_CC TC2 error interrupt
21
EDMA3_TC_ERRINT3
EDMA3_CC TC3 error interrupt
22
EDMA3_CC_GINT
EDMA3_CC GINT
23
Reserved
24
EDMA3_CC_INT0
EDMA3_CC individual completion interrupt
25
EDMA3_CC_INT1
EDMA3_CC individual completion interrupt
26
EDMA3_CC_INT2
EDMA3_CC individual completion interrupt
27
EDMA3_CC_INT3
EDMA3_CC individual completion interrupt
28
EDMA3_CC_INT4
EDMA3_CC individual completion interrupt
29
EDMA3_CC_INT5
EDMA3_CC individual completion interrupt
30
EDMA3_CC_INT6
EDMA3_CC individual completion interrupt
31
EDMA3_CC_INT7
EDMA3_CC individual completion interrupt
32
MCBSP0_RINT
McBSP0 interrupt
33
MCBSP0_XINT
McBSP0 interrupt
34
MCBSP0_REVT
McBSP0 interrupt
35
MCBSP0_XEVT
McBSP0 interrupt
36
MCBSP1_RINT
McBSP1 interrupt
37
MCBSP1_XINT
McBSP1 interrupt
38
MCBSP1_REVT
McBSP1 interrupt
39
MCBSP1_XEVT
McBSP1 interrupt
40
UARTINT_B
UART_1 interrupt
41
URXEVT_B
UART_1 interrupt
42
UTXEVT_B
UART_1 interrupt
43
Reserved
44
Reserved
45
Reserved
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Table 6-27. CIC0 Event Inputs (Secondary Interrupts for C66x CorePacs) (continued)
INPUT EVENT NO. ON
CIC
SYSTEM INTERRUPT
46
Reserved
47
Reserved
48
PCIEXpress_ERR_INT
Protocol error interrupt
49
PCIEXpress_PM_INT
Power management interrupt
50
PCIEXpress_Legacy_INTA
Legacy interrupt mode
51
PCIEXpress_Legacy_INTB
Legacy interrupt mode
52
PCIEXpress_Legacy_CIC
Legacy interrupt mode
53
PCIEXpress_Legacy_INTD
Legacy interrupt mode
54
SPIINT0
SPI interrupt0
55
SPIINT1
SPI interrupt1
56
SPIXEVT
Transmit event
57
SPIREVT
Receive event
58
I2CINT
I2C interrupt
59
I2CREVT
I2C receive event
60
I2CXEVT
I2C transmit event
61
Reserved
62
Reserved
63
TETBHFULLINT
TETB is half full
64
TETBFULLINT
TETB is full
65
TETBACQINT
Acquisition has been completed
66
TETBOVFLINT
Overflow condition occur
67
TETBUNFLINT
Underflow condition occur
68
SEMINT2
Semaphore interrupt
69
SEMINT3
Semaphore interrupt
70
SEMERR2
Semaphore interrupt
71
SEMERR3
Semaphore interrupt
72
Reserved
73
Tracer_core_0_INTD
Tracer sliding time window interrupt for individual core
74
Tracer_core_1_INTD
Tracer sliding time window interrupt for individual core (C6657 only)
75
Reserved
76
Reserved
77
Tracer_DDR_INTD
Tracer sliding time window interrupt for DDR3 EMIF1
78
Tracer_MSMC_0_INTD
Tracer sliding time window interrupt for MSMC SRAM bank0
79
Tracer_MSMC_1_INTD
Tracer sliding time window interrupt for MSMC SRAM bank1
80
Tracer_MSMC_2_INTD
Tracer sliding time window interrupt for MSMC SRAM bank2
81
Tracer_MSMC_3_INTD
Tracer sliding time window interrupt for MSMC SRAM bank3
81
Tracer_CFG_INTD
Tracer sliding time window interrupt for CFG0 TeraNet
82
Tracer_QM_CFG_INTD
Tracer sliding time window interrupt for QM_SS CFG
84
Tracer_QM_DMA_INTD
Tracer sliding time window interrupt for QM_SS slave
85
Tracer_SM_INTD
Tracer sliding time window interrupt for semaphore
86
PSC_ALLINT
Power/sleep controller interrupt
87
MSMC_scrub_cerror
Correctable (1-bit) soft error detected during scrub cycle
88
BOOTCFG_INTD
Chip-level MMR error register
89
po_vcon_smpserr_intr
SmartReflex VolCon error status
90
MPU0_INTD
(MPU0_ADDR_ERR_INT and
MPU0_PROT_ERR_INT combined)
MPU0 addressing violation interrupt and protection violation interrupt.
110
Detailed Description
DESCRIPTION
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Table 6-27. CIC0 Event Inputs (Secondary Interrupts for C66x CorePacs) (continued)
INPUT EVENT NO. ON
CIC
SYSTEM INTERRUPT
91
Reserved
92
MPU1_INTD
(MPU1_ADDR_ERR_INT and
MPU1_PROT_ERR_INT combined)
93
Reserved
94
MPU2_INTD
(MPU2_ADDR_ERR_INT and
MPU2_PROT_ERR_INT combined)
95
Reserved
96
MPU3_INTD
(MPU3_ADDR_ERR_INT and
MPU3_PROT_ERR_INT combined)
97
Reserved
98
MSMC_dedc_cerror
Correctable (1-bit) soft error detected on SRAM read
99
MSMC_dedc_nc_error
Noncorrectable (2-bit) soft error detected on SRAM read
100
MSMC_scrub_nc_error
Noncorrectable (2-bit) soft error detected during scrub cycle
101
Reserved
102
MSMC_mpf_error8
Memory protection fault indicators for each system master PrivID
103
MSMC_mpf_error9
Memory protection fault indicators for each system master PrivID
104
MSMC_mpf_error10
Memory protection fault indicators for each system master PrivID
105
MSMC_mpf_error11
Memory protection fault indicators for each system master PrivID
105
MSMC_mpf_error12
Memory protection fault indicators for each system master PrivID
107
MSMC_mpf_error13
Memory protection fault indicators for each system master PrivID
108
MSMC_mpf_error14
Memory protection fault indicators for each system master PrivID
109
MSMC_mpf_error15
Memory protection fault indicators for each system master PrivID
110
DDR3_ERR
DDR3 EMIF error interrupt
111
HyperLink_int_o
HyperLink interrupt
112
INTDST0
RapidIO interrupt
113
INTDST1
RapidIO interrupt
114
INTDST2
RapidIO interrupt
115
INTDST3
RapidIO interrupt
116
INTDST4
RapidIO interrupt
117
INTDST5
RapidIO interrupt
118
INTDST6
RapidIO interrupt
119
INTDST7
RapidIO interrupt
120
INTDST8
RapidIO interrupt
121
INTDST9
RapidIO interrupt
122
INTDST10
RapidIO interrupt
123
INTDST11
RapidIO interrupt
124
INTDST12
RapidIO interrupt
125
INTDST13
RapidIO interrupt
126
INTDST14
RapidIO interrupt
127
INTDST15
RapidIO interrupt
128
Reserved
129
Reserved
130
po_vp_smpsack_intr
131
Reserved
132
Reserved
DESCRIPTION
MPU1 addressing violation interrupt and protection violation interrupt.
MPU2 addressing violation interrupt and protection violation interrupt.
MPU3 addressing violation interrupt and protection violation interrupt.
Indicating that Volt_Proc receives the r-edge at its smpsack input
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Table 6-27. CIC0 Event Inputs (Secondary Interrupts for C66x CorePacs) (continued)
INPUT EVENT NO. ON
CIC
SYSTEM INTERRUPT
133
Reserved
134
QM_INT_PASS_TXQ_PEND_662
Queue manager pend event
135
QM_INT_PASS_TXQ_PEND_663
Queue manager pend event
136
QM_INT_PASS_TXQ_PEND_664
Queue manager pend event
137
QM_INT_PASS_TXQ_PEND_665
Queue manager pend event
138
QM_INT_PASS_TXQ_PEND_666
Queue manager pend event
139
QM_INT_PASS_TXQ_PEND_667
Queue manager pend event
140
QM_INT_PASS_TXQ_PEND_668
Queue manager pend event
141
QM_INT_PASS_TXQ_PEND_669
Queue manager pend event
142
QM_INT_PASS_TXQ_PEND_670
Queue manager pend event
143
VCP0INT
VCP2_0 interrupt
144
VCP1INT
VCP2_1 interrupt
145
TINT4L
Timer4 interrupt low
146
TINT4H
Timer4 interrupt high
147
VCPAREVT
VCP2_A receive event
148
VCPAXEVT
VCP2_A transmit event
149
VCPBREVT
VCP2_B receive event
150
VCPBXEVT
VCP2_B transmit event
151
TINT5L
Timer5 interrupt low
152
TINT5H
Timer5 interrupt high
153
TINT6L
Timer6 interrupt low
154
TINT6H
Timer6 interrupt high
155
TCP_INTD
TCP3d interrupt
156
UPPINT
uPP interrupt
157
TCP_REVT0
TCP3d interrupt
158
TCP_XEVT0
TCP3d interrupt
159
Reserved
160
MSMC_mpf_error2
Memory protection fault indicators for each system master PrivID
161
MSMC_mpf_error3
Memory protection fault indicators for each system master PrivID
162
TINT7L
Timer7 interrupt low
163
TINT7H
Timer7interrupt high
164
UARTINT_A
UART_0 interrupt
165
URXEVT_A
UART_0 interrupt
166
UTXEVT_A
UART_0 interrupt
167
EASYNCERR
EMIF16 error interrupt
168
Tracer_EMIF16
Tracer sliding time window interrupt for EMIF16
169
Reserved
170
MSMC_mpf_error4
Memory protection fault indicators for each system master PrivID
171
MSMC_mpf_error5
Memory protection fault indicators for each system master PrivID
172
MSMC_mpf_error6
Memory protection fault indicators for each system master PrivID
173
MSMC_mpf_error7
Memory protection fault indicators for each system master PrivID
174
MPU4_INTD
(MPU4_ADDR_ERR_INT and
MPU4_PROT_ERR_INT combined)
MPU4 addressing violation interrupt and protection violation interrupt.
175
QM_INT_PASS_TXQ_PEND_671
Queue manager pend event
176
QM_INT_PKTDMA_0
QM interrupt for CDMA starvation
177
QM_INT_PKTDMA_1
QM interrupt for CDMA starvation
112
Detailed Description
DESCRIPTION
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Table 6-27. CIC0 Event Inputs (Secondary Interrupts for C66x CorePacs) (continued)
INPUT EVENT NO. ON
CIC
SYSTEM INTERRUPT
DESCRIPTION
178
SRIO_INT_PKTDMA_0
SRIO interrupt for CDMA starvation
179
Reserved
180
Reserved
181
SmartReflex_intrreq0
SmartReflex sensor interrupt
182
SmartReflex_intrreq1
SmartReflex sensor interrupt
183
SmartReflex_intrreq2
SmartReflex sensor interrupt
184
SmartReflex_intrreq3
SmartReflex sensor interrupt
185
VPNoSMPSAck
VPVOLTUPDATE has been asserted but SMPS has not been responded
to in a defined time interval
186
VPEqValue
SRSINTERUPT is asserted, but the new voltage is not different from the
current SMPS voltage
187
VPMaxVdd
The new voltage required is equal to or greater than MaxVdd.
188
VPMinVdd
The new voltage required is equal to or less than MinVdd.
189
VPINIDLE
Indicating that the FSM of voltage processor is in idle.
190
VPOPPChangeDone
Indicating that the average frequency error is within the desired limit.
191
Reserved
192
MACINT4
EMAC interrupt
193
MACRXINT4
EMAC interrupt
194
MACTXINT4
EMAC interrupt
195
MACTRESH4
EMAC interrupt
196
MACINT5
EMAC interrupt
197
MACRXINT5
EMAC interrupt
198
MACTXINT5
EMAC interrupt
199
MACTRESH5
EMAC interrupt
200
MACINT6
EMAC interrupt
201
MACRXINT6
EMAC interrupt
202
MACTXINT6
EMAC interrupt
203
MACTRESH6
EMAC interrupt
204
MACINT7
EMAC interrupt
205
MACRXINT7
EMAC interrupt
206
MACTXINT7
EMAC interrupt
207
MACTRESH7
EMAC interrupt
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Table 6-28. CIC1 Event Inputs (Secondary Events for EDMA3_CC)
INPUT EVENT NO.
ON CIC
SYSTEM INTERRUPT
DESCRIPTION
0
GPINT8
GPIO interrupt
1
GPINT9
GPIO interrupt
2
GPINT10
GPIO interrupt
3
GPINT11
GPIO interrupt
4
GPINT12
GPIO interrupt
5
GPINT13
GPIO interrupt
6
GPINT14
GPIO interrupt
7
GPINT15
GPIO interrupt
8
Reserved
9
Reserved
10
TETBACQINT
11
Reserved
12
Reserved
13
TETBACQINT0
14
Reserved
15
Reserved
16
TETBACQINT1
TETB1 acquisition has been completed (C6657 only)
17
GPINT16
GPIO interrupt
18
GPINT17
GPIO interrupt
19
GPINT18
GPIO interrupt
20
GPINT19
GPIO interrupt
21
GPINT20
GPIO interrupt
22
GPINT21
GPIO interrupt
23
Reserved
24
QM_INT_HIGH_16
QM interrupt
25
QM_INT_HIGH_17
QM interrupt
26
QM_INT_HIGH_18
QM interrupt
27
QM_INT_HIGH_19
QM interrupt
28
QM_INT_HIGH_20
QM interrupt
29
QM_INT_HIGH_21
QM interrupt
30
QM_INT_HIGH_22
QM interrupt
31
QM_INT_HIGH_23
QM interrupt
32
QM_INT_HIGH_24
QM interrupt
33
QM_INT_HIGH_25
QM interrupt
34
QM_INT_HIGH_26
QM interrupt
35
QM_INT_HIGH_27
QM interrupt
36
QM_INT_HIGH_28
QM interrupt
37
QM_INT_HIGH_29
QM interrupt
38
QM_INT_HIGH_30
QM interrupt
39
QM_INT_HIGH_31
QM interrupt
40
Reserved
41
Reserved
42
Reserved
43
Reserved
44
Reserved
45
Tracer_core_0_INTD
114
Detailed Description
System TETB acquisition has been completed
TETB0 acquisition has been completed
Tracer sliding time window interrupt for individual core
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Table 6-28. CIC1 Event Inputs (Secondary Events for EDMA3_CC) (continued)
INPUT EVENT NO.
ON CIC
SYSTEM INTERRUPT
DESCRIPTION
46
Tracer_core_1_INTD
Tracer sliding time window interrupt for individual core (C6657 only)
47
GPINT22
GPIO interrupt
48
GPINT23
GPIO interrupt
49
Tracer_DDR_INTD
Tracer sliding time window interrupt for DDR3 EMIF
50
Tracer_MSMC_0_INTD
Tracer sliding time window interrupt for MSMC SRAM bank0
51
Tracer_MSMC_1_INTD
Tracer sliding time window interrupt for MSMC SRAM bank1
52
Tracer_MSMC_2_INTD
Tracer sliding time window interrupt for MSMC SRAM bank2
53
Tracer_MSMC_3_INTD
Tracer sliding time window interrupt for MSMC SRAM bank3
54
Tracer_CFG_INTD
Tracer sliding time window interrupt for CFG0 TeraNet
55
Tracer_QM_CFG_INTD
Tracer sliding time window interrupt for QM_SS CFG
56
Tracer_QM_DMA_INTD
Tracer sliding time window interrupt for QM_SS slave port
57
Tracer_SEM_INTD
Tracer sliding time window interrupt for semaphore
58
SEMERR0
Semaphore interrupt
59
SEMERR1
Semaphore interrupt
60
SEMERR2
Semaphore interrupt
61
SEMERR3
Semaphore interrupt
62
BOOTCFG_INTD
BOOTCFG interrupt BOOTCFG_ERR and BOOTCFG_PROT
63
UPPINT
uPP interrupt
64
MPU0_INTD (MPU0_ADDR_ERR_INT and
MPU0_PROT_ERR_INT combined)
MPU0 addressing violation interrupt and protection violation
interrupt.
65
MSMC_scrub_cerror
Correctable (1-bit) soft error detected during scrub cycle
66
MPU1_INTD (MPU1_ADDR_ERR_INT and
MPU1_PROT_ERR_INT combined)
MPU1 addressing violation interrupt and protection violation
interrupt.
67
RapidIO_INT_PKTDMA_0
RapidIO interrupt for packet DMA starvation
68
MPU2_INTD (MPU2_ADDR_ERR_INT and
MPU2_PROT_ERR_INT combined)
MPU2 addressing violation interrupt and protection violation
interrupt.
69
QM_INT_PKTDMA_0
QM interrupt for packet DMA starvation
70
MPU3_INTD (MPU3_ADDR_ERR_INT and
MPU3_PROT_ERR_INT combined)
MPU3 addressing violation interrupt and protection violation
interrupt.
71
QM_INT_PKTDMA_1
QM interrupt for packet DMA starvation
72
MSMC_dedc_cerror
Correctable (1-bit) soft error detected on SRAM read
73
MSMC_dedc_nc_error
Noncorrectable (2-bit) soft error detected on SRAM read
74
MSMC_scrub_nc_error
Noncorrectable (2-bit) soft error detected during scrub cycle
75
Reserved
76
MSMC_mpf_error0
Memory protection fault indicators for each system master PrivID
77
MSMC_mpf_error1
Memory protection fault indicators for each system master PrivID
78
MSMC_mpf_error2
Memory protection fault indicators for each system master PrivID
79
MSMC_mpf_error3
Memory protection fault indicators for each system master PrivID
80
MSMC_mpf_error4
Memory protection fault indicators for each system master PrivID
81
MSMC_mpf_error5
Memory protection fault indicators for each system master PrivID
82
MSMC_mpf_error6
Memory protection fault indicators for each system master PrivID
83
MSMC_mpf_error7
Memory protection fault indicators for each system master PrivID
84
MSMC_mpf_error8
Memory protection fault indicators for each system master PrivID
85
MSMC_mpf_error9
Memory protection fault indicators for each system master PrivID
86
MSMC_mpf_error10
Memory protection fault indicators for each system master PrivID
87
MSMC_mpf_error11
Memory protection fault indicators for each system master PrivID
88
MSMC_mpf_error12
Memory protection fault indicators for each system master PrivID
89
MSMC_mpf_error13
Memory protection fault indicators for each system master PrivID
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Table 6-28. CIC1 Event Inputs (Secondary Events for EDMA3_CC) (continued)
INPUT EVENT NO.
ON CIC
SYSTEM INTERRUPT
DESCRIPTION
90
MSMC_mpf_error14
Memory protection fault indicators for each system master PrivID
91
MSMC_mpf_error15
Memory protection fault indicators for each system master PrivID
92
Reserved
93
INTDST0
RapidIO interrupt
94
INTDST1
RapidIO interrupt
95
INTDST2
RapidIO interrupt
96
INTDST3
RapidIO interrupt
97
INTDST4
RapidIO interrupt
98
INTDST5
RapidIO interrupt
99
INTDST6
RapidIO interrupt
100
INTDST7
RapidIO interrupt
101
INTDST8
RapidIO interrupt
102
INTDST9
RapidIO interrupt
103
INTDST10
RapidIO interrupt
104
INTDST11
RapidIO interrupt
105
INTDST12
RapidIO interrupt
106
INTDST13
RapidIO interrupt
107
INTDST14
RapidIO interrupt
108
INTDST15
RapidIO interrupt
109
INTDST16
RapidIO interrupt
110
INTDST17
RapidIO interrupt
111
INTDST18
RapidIO interrupt
112
INTDST19
RapidIO interrupt
113
INTDST20
RapidIO interrupt
114
INTDST21
RapidIO interrupt
115
INTDST22
RapidIO interrupt
116
INTDST23
RapidIO interrupt
117
GPINT24
GPIO interrupt
118
GPINT25
GPIO interrupt
119
VCPAINT
VCP2_A interrupt
120
VCPBINT
VCP2_B interrupt
121
GPINT26
GPIO interrupt
122
GPINT27
GPIO interrupt
123
TCP3D_INTD
Error interrupt TCP3DINT0 and TCP3DINT1
124
GPINT28
GPIO interrupt
125
GPINT29
GPIO interrupt
126
GPINT30
GPIO interrupt
127
GPINT31
GPIO interrupt
128
GPINT4
GPIO interrupt
129
GPINT5
GPIO interrupt
130
GPINT6
GPIO interrupt
131
GPINT7
GPIO interrupt
132
Hyperlink_int_o
Hyperlink interrupt
133
Tracer_EMIF16
Tracer sliding time window interrupt for EMIF16
134
EASYNCERR
EMIF16 error interrupt
135
MPU4_INTD (MPU4_ADDR_ERR_INT and
MPU4_PROT_ERR_INT combined)
MPU4 addressing violation interrupt and protection violation
interrupt.
116
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Table 6-28. CIC1 Event Inputs (Secondary Events for EDMA3_CC) (continued)
INPUT EVENT NO.
ON CIC
SYSTEM INTERRUPT
136
Reserved
137
QM_INT_HIGH_0
QM interrupt
138
QM_INT_HIGH_1
QM interrupt
139
QM_INT_HIGH_2
QM interrupt
140
QM_INT_HIGH_3
QM interrupt
141
QM_INT_HIGH_4
QM interrupt
142
QM_INT_HIGH_5
QM interrupt
143
QM_INT_HIGH_6
QM interrupt
144
QM_INT_HIGH_7
QM interrupt
145
QM_INT_HIGH_8
QM interrupt
146
QM_INT_HIGH_9
QM interrupt
147
QM_INT_HIGH_10
QM interrupt
148
QM_INT_HIGH_11
QM interrupt
149
QM_INT_HIGH_12
QM interrupt
150
QM_INT_HIGH_13
QM interrupt
151
QM_INT_HIGH_14
QM interrupt
152
QM_INT_HIGH_15
QM interrupt
153
Reserved
154
Reserved
155
Reserved
156
Reserved
157
Reserved
158
Reserved
159
DDR3_ERR
DESCRIPTION
DDR3 error interrupt
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Table 6-29. CIC2 Event Inputs (Secondary Events for HyperLink)
INPUT EVENT NO.
ON CIC
SYSTEM INTERRUPT
DESCRIPTION
0
GPINT0
GPIO interrupt
1
GPINT1
GPIO interrupt
2
GPINT2
GPIO interrupt
3
GPINT3
GPIO interrupt
4
GPINT4
GPIO interrupt
5
GPINT5
GPIO interrupt
6
GPINT6
GPIO interrupt
7
GPINT7
GPIO interrupt
8
GPINT8
GPIO interrupt
9
GPINT9
GPIO interrupt
10
GPINT10
GPIO interrupt
11
GPINT11
GPIO interrupt
12
GPINT12
GPIO interrupt
13
GPINT13
GPIO interrupt
14
GPINT14
GPIO interrupt
15
GPINT15
GPIO interrupt
16
TETBHFULLINT
System TETB is half full
17
TETBFULLINT
System TETB is full
18
TETBACQINT
System TETB acquisition has been completed
19
TETBHFULLINT0
TETB0 is half full
20
TETBFULLINT0
TETB0 is full
21
TETBACQINT0
TETB0 acquisition has been completed
22
TETBHFULLINT1
TETB1 is half full
23
TETBFULLINT1
TETB1 is full
24
TETBACQINT1
TETB1 acquisition has been completed
25
GPINT16
GPIO interrupt
26
GPINT17
GPIO interrupt
27
GPINT18
GPIO interrupt
28
GPINT19
GPIO interrupt
29
GPINT20
GPIO interrupt
30
GPINT21
GPIO interrupt
31
Tracer_core_0_INTD
Tracer sliding time window interrupt for individual core
32
Tracer_core_1_INTD
Tracer sliding time window interrupt for individual core (C6657 only)
33
GPINT22
GPIO interrupt
34
GPINT23
GPIO interrupt
35
Tracer_DDR_INTD
Tracer sliding time window interrupt for DDR3 EMIF1
36
Tracer_MSMC_0_INTD
Tracer sliding time window interrupt for MSMC SRAM bank0
37
Tracer_MSMC_1_INTD
Tracer sliding time window interrupt for MSMC SRAM bank1
38
Tracer_MSMC_2_INTD
Tracer sliding time window interrupt for MSMC SRAM bank2
39
Tracer_MSMC_3_INTD
Tracer sliding time window interrupt for MSMC SRAM bank3
40
Tracer_CFG_INTD
Tracer sliding time window interrupt for CFG0 TeraNet
41
Tracer_QM_SS_CFG_INTD
Tracer sliding time window interrupt for QM_SS CFG
42
Tracer_QM_SS_DMA_INTD
Tracer sliding time window interrupt for QM_SS slave port
43
Tracer_SEM_INTD
Tracer sliding time window interrupt for semaphore
44
Reserved
45
GPINT24
118
Detailed Description
GPIO interrupt
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Table 6-29. CIC2 Event Inputs (Secondary Events for HyperLink) (continued)
INPUT EVENT NO.
ON CIC
SYSTEM INTERRUPT
DESCRIPTION
46
GPINT25
GPIO interrupt
47
GPINT26
GPIO interrupt
48
GPINT27
GPIO interrupt
49
TINT4L
Timer64_4 interrupt low
50
TINT4H
Timer64_4 interrupt high
51
TINT5L
Timer64_5 interrupt low
52
TINT5H
timer64_5 interrupt high
53
TINT6L
Timer64_6 interrupt low
54
TINT6H
Timer64_6 interrupt high
55
TINT7L
Timer64_7 interrupt low
56
TINT7H
Timer64_7 interrupt high
57
Reserved
58
Reserved
59
Reserved
60
Tracer_EMIF16
Tracer sliding time window interrupt for TNet_6P_A
61
DDR3_ERR
DDR3 EMIF Error interrupt
62
Reserved
63
EASYNCERR
EMIF16 error interrupt
64
GPINT28
GPIO interrupt
65
GPINT29
GPIO interrupt
66
GPINT30
GPIO interrupt
67
GPINT31
GPIO interrupt
68
TINT2L
Timer2 interrupt low
69
TINT2H
Timer2 interrupt high
70
TINT3L
Timer2 interrupt low
71
TINT3H
Timer2 interrupt high
72-79
Reserved
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CIC Registers
This section includes the offsets for CIC registers. The base addresses for interrupt control registers are
CIC0 - 0x0260 0000, CIC1 - 0x0260 4000, and CIC2 - 0x0260 8000.
6.9.2.1
CIC0 Register Map
Table 6-30 describes the CIC0 registers.
Table 6-30. CIC0 Register
ADDRESS
OFFSET
REGISTER MNEMONIC
REGISTER NAME
0x0
REVISION_REG
Revision Register
0x4
CONTROL_REG
Control Register
0xc
HOST_CONTROL_REG
Host Control Register
0x10
GLOBAL_ENABLE_HINT_REG
Global Host Int Enable Register
0x20
STATUS_SET_INDEX_REG
Status Set Index Register
0x24
STATUS_CLR_INDEX_REG
Status Clear Index Register
0x28
ENABLE_SET_INDEX_REG
Enable Set Index Register
0x2c
ENABLE_CLR_INDEX_REG
Enable Clear Index Register
0x34
HINT_ENABLE_SET_INDEX_REG
Host Int Enable Set Index Register
0x38
HINT_ENABLE_CLR_INDEX_REG
Host Int Enable Clear Index Register
0x200
RAW_STATUS_REG0
Raw Status Register 0
0x204
RAW_STATUS_REG1
Raw Status Register 1
0x208
RAW_STATUS_REG2
Raw Status Register 2
0x20c
RAW_STATUS_REG3
Raw Status Register 3
0x210
RAW_STATUS_REG4
Raw Status Register 4
0x214
RAW_STATUS_REG5
Raw Status Register 5
0x218
RAW_STATUS_REG6
Raw Status Register 6
0x280
ENA_STATUS_REG0
Enabled Status Register 0
0x284
ENA_STATUS_REG1
Enabled Status Register 1
0x288
ENA_STATUS_REG2
Enabled Status Register 2
0x28c
ENA_STATUS_REG3
Enabled Status Register 3
0x290
ENA_STATUS_REG4
Enabled Status Register 4
0x294
ENA_STATUS_REG5
Enabled Status Register 5
0x298
ENA_STATUS_REG6
Enabled Status Register 6
0x300
ENABLE_REG0
Enable Register 0
0x304
ENABLE_REG1
Enable Register 1
0x308
ENABLE_REG2
Enable Register 2
0x30c
ENABLE_REG3
Enable Register 3
0x310
ENABLE_REG4
Enable Register 4
0x314
ENABLE_REG5
Enable Register 5
0x318
ENABLE_REG6
Enable Register 6
0x380
ENABLE_CLR_REG0
Enable Clear Register 0
0x384
ENABLE_CLR_REG1
Enable Clear Register 1
0x388
ENABLE_CLR_REG2
Enable Clear Register 2
0x38c
ENABLE_CLR_REG3
Enable Clear Register 3
0x390
ENABLE_CLR_REG4
Enable Clear Register 4
0x394
ENABLE_CLR_REG5
Enable Clear Register 5
0x398
ENABLE_CLR_REG6
Enable Clear Register 6
0x400
CH_MAP_REG0
Interrupt Channel Map Register for 0 to 0+3
120
Detailed Description
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Table 6-30. CIC0 Register (continued)
ADDRESS
OFFSET
REGISTER MNEMONIC
REGISTER NAME
0x404
CH_MAP_REG1
Interrupt Channel Map Register for 4 to 4+3
0x408
CH_MAP_REG2
Interrupt Channel Map Register for 8 to 8+3
0x40c
CH_MAP_REG3
Interrupt Channel Map Register for 12 to 12+3
0x410
CH_MAP_REG4
Interrupt Channel Map Register for 16 to 16+3
0x414
CH_MAP_REG5
Interrupt Channel Map Register for 20 to 20+3
0x418
CH_MAP_REG6
Interrupt Channel Map Register for 24 to 24+3
0x41c
CH_MAP_REG7
Interrupt Channel Map Register for 28 to 28+3
0x420
CH_MAP_REG8
Interrupt Channel Map Register for 32 to 32+3
0x424
CH_MAP_REG9
Interrupt Channel Map Register for 36 to 36+3
0x428
CH_MAP_REG10
Interrupt Channel Map Register for 40 to 40+3
0x42c
CH_MAP_REG11
Interrupt Channel Map Register for 44 to 44+3
0x430
CH_MAP_REG12
Interrupt Channel Map Register for 48 to 48+3
0x434
CH_MAP_REG13
Interrupt Channel Map Register for 52 to 52+3
0x438
CH_MAP_REG14
Interrupt Channel Map Register for 56 to 56+3
0x43c
CH_MAP_REG15
Interrupt Channel Map Register for 60 to 60+3
0x440
CH_MAP_REG16
Interrupt Channel Map Register for 64 to 64+3
0x444
CH_MAP_REG17
Interrupt Channel Map Register for 68 to 68+3
0x448
CH_MAP_REG18
Interrupt Channel Map Register for 72 to 72+3
0x44c
CH_MAP_REG19
Interrupt Channel Map Register for 76 to 76+3
0x450
CH_MAP_REG20
Interrupt Channel Map Register for 80 to 80+3
0x454
CH_MAP_REG21
Interrupt Channel Map Register for 84 to 84+3
0x458
CH_MAP_REG22
Interrupt Channel Map Register for 88 to 88+3
0x45c
CH_MAP_REG23
Interrupt Channel Map Register for 92 to 92+3
0x460
CH_MAP_REG24
Interrupt Channel Map Register for 96 to 96+3
0x464
CH_MAP_REG25
Interrupt Channel Map Register for 100 to 100+3
0x468
CH_MAP_REG26
Interrupt Channel Map Register for 104 to 104+3
0x46c
CH_MAP_REG27
Interrupt Channel Map Register for 108 to 108+3
0x470
CH_MAP_REG28
Interrupt Channel Map Register for 112 to 112+3
0x474
CH_MAP_REG29
Interrupt Channel Map Register for 116 to 116+3
0x478
CH_MAP_REG30
Interrupt Channel Map Register for 120 to 120+3
0x47c
CH_MAP_REG31
Interrupt Channel Map Register for 124 to 124+3
0x480
CH_MAP_REG32
Interrupt Channel Map Register for 128 to 128+3
0x484
CH_MAP_REG33
Interrupt Channel Map Register for 132 to 132+3
0x488
CH_MAP_REG34
Interrupt Channel Map Register for 136 to 136+3
0x48c
CH_MAP_REG35
Interrupt Channel Map Register for 140 to 140+3
0x490
CH_MAP_REG36
Interrupt Channel Map Register for 144 to 144+3
0x494
CH_MAP_REG37
Interrupt Channel Map Register for 148 to 148+3
0x498
CH_MAP_REG38
Interrupt Channel Map Register for 152 to 152+3
0x49c
CH_MAP_REG39
Interrupt Channel Map Register for 156 to 156+3
0x4a0
CH_MAP_REG40
Interrupt Channel Map Register for 160 to 160+3
0x4a4
CH_MAP_REG41
Interrupt Channel Map Register for 164 to 164+3
0x4a8
CH_MAP_REG42
Interrupt Channel Map Register for 168 to 168+3
0x4ac
CH_MAP_REG43
Interrupt Channel Map Register for 172 to 172+3
0x4b0
CH_MAP_REG44
Interrupt Channel Map Register for 176 to 176+3
0x4b4
CH_MAP_REG45
Interrupt Channel Map Register for 180 to 180+3
0x4b8
CH_MAP_REG46
Interrupt Channel Map Register for 184 to 184+3
0x4bc
CH_MAP_REG47
Interrupt Channel Map Register for 188 to 188+3
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Table 6-30. CIC0 Register (continued)
ADDRESS
OFFSET
REGISTER MNEMONIC
REGISTER NAME
0x4c0
CH_MAP_REG48
Interrupt Channel Map Register for 192 to 192+3
0x4c4
CH_MAP_REG49
Interrupt Channel Map Register for 196 to 196+3
0x4c8
CH_MAP_REG50
Interrupt Channel Map Register for 200 to 200+3
0x4cc
CH_MAP_REG51
Interrupt Channel Map Register for 204 to 204+3
0x800
HINT_MAP_REG0
Host Interrupt Map Register for 0 to 0+3
0x804
HINT_MAP_REG1
Host Interrupt Map Register for 4 to 4+3
0x808
HINT_MAP_REG2
Host Interrupt Map Register for 8 to 8+3
0x80c
HINT_MAP_REG3
Host Interrupt Map Register for 12 to 12+3
0x810
HINT_MAP_REG4
Host Interrupt Map Register for 16 to 16+3
0x814
HINT_MAP_REG5
Host Interrupt Map Register for 20 to 20+3
0x818
HINT_MAP_REG6
Host Interrupt Map Register for 24 to 24+3
0x81c
HINT_MAP_REG7
Host Interrupt Map Register for 28 to 28+3
0x820
HINT_MAP_REG8
Host Interrupt Map Register for 32 to 32+3
0x824
HINT_MAP_REG9
Host Interrupt Map Register for 36 to 36+3
0x828
HINT_MAP_REG10
Host Interrupt Map Register for 40 to 40+3
0x82c
HINT_MAP_REG11
Host Interrupt Map Register for 44 to 44+3
0x830
HINT_MAP_REG12
Host Interrupt Map Register for 48 to 48+3
0x834
HINT_MAP_REG13
Host Interrupt Map Register for 52 to 52+3
0x838
HINT_MAP_REG14
Host Interrupt Map Register for 56 to 56+3
0x83c
HINT_MAP_REG15
Host Interrupt Map Register for 60 to 60+3
0x840
HINT_MAP_REG16
Host Interrupt Map Register for 64 to 64+3
0x844
HINT_MAP_REG17
Host Interrupt Map Register for 68 to 68+3
0x848
HINT_MAP_REG18
Host Interrupt Map Register for 72 to 72+3
0x84c
HINT_MAP_REG19
Host Interrupt Map Register for 76 to 76+3
0x850
HINT_MAP_REG20
Host Interrupt Map Register for 80 to 80+3
0x854
HINT_MAP_REG21
Host Interrupt Map Register for 84 to 84+3
0x858
HINT_MAP_REG22
Host Interrupt Map Register for 88 to 88+3
0x860
HINT_MAP_REG23
Host Interrupt Map Register for 92 to 92+3
0x1500
ENABLE_HINT_REG0
Host Int Enable Register 0
0x1504
ENABLE_HINT_REG1
Host Int Enable Register 1
0x1508
ENABLE_HINT_REG2
Host Int Enable Register 2
122
Detailed Description
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6.9.2.2
SPRS814D – MARCH 2012 – REVISED OCTOBER 2019
CIC1 Register Map
Table 6-31 describes the CIC1 registers.
Table 6-31. CIC1 Register
ADDRESS
OFFSET
REGISTER MNEMONIC
REGISTER NAME
0x0
REVISION_REG
Revision Register
0x10
GLOBAL_ENABLE_HINT_REG
Global Host Int Enable Register
0x20
STATUS_SET_INDEX_REG
Status Set Index Register
0x24
STATUS_CLR_INDEX_REG
Status Clear Index Register
0x28
ENABLE_SET_INDEX_REG
Enable Set Index Register
0x2c
ENABLE_CLR_INDEX_REG
Enable Clear Index Register
0x34
HINT_ENABLE_SET_INDEX_REG
Host Int Enable Set Index Register
0x38
HINT_ENABLE_CLR_INDEX_REG
Host Int Enable Clear Index Register
0x200
RAW_STATUS_REG0
Raw Status Register 0
0x204
RAW_STATUS_REG1
Raw Status Register 1
0x208
RAW_STATUS_REG2
Raw Status Register 2
0x20c
RAW_STATUS_REG3
Raw Status Register 3
0x210
RAW_STATUS_REG4
Raw Status Register 4
0x280
ENA_STATUS_REG0
Enabled Status Register 0
0x284
ENA_STATUS_REG1
Enabled Status Register 1
0x288
ENA_STATUS_REG2
Enabled Status Register 2
0x28c
ENA_STATUS_REG3
Enabled Status Register 3
0x290
ENA_STATUS_REG4
Enabled Status Register 4
0x300
ENABLE_REG0
Enable Register 0
0x304
ENABLE_REG1
Enable Register 1
0x308
ENABLE_REG2
Enable Register 2
0x30c
ENABLE_REG3
Enable Register 3
0x310
ENABLE_REG4
Enable Register 4
0x380
ENABLE_CLR_REG0
Enable Clear Register 0
0x384
ENABLE_CLR_REG1
Enable Clear Register 1
0x388
ENABLE_CLR_REG2
Enable Clear Register 2
0x38c
ENABLE_CLR_REG3
Enable Clear Register 3
0x390
ENABLE_CLR_REG4
Enable Clear Register 4
0x400
CH_MAP_REG0
Interrupt Channel Map Register for 0 to 0+3
0x404
CH_MAP_REG1
Interrupt Channel Map Register for 4 to 4+3
0x408
CH_MAP_REG2
Interrupt Channel Map Register for 8 to 8+3
0x40c
CH_MAP_REG3
Interrupt Channel Map Register for 12 to 12+3
0x410
CH_MAP_REG4
Interrupt Channel Map Register for 16 to 16+3
0x414
CH_MAP_REG5
Interrupt Channel Map Register for 20 to 20+3
0x418
CH_MAP_REG6
Interrupt Channel Map Register for 24 to 24+3
0x41c
CH_MAP_REG7
Interrupt Channel Map Register for 28 to 28+3
0x420
CH_MAP_REG8
Interrupt Channel Map Register for 32 to 32+3
0x424
CH_MAP_REG9
Interrupt Channel Map Register for 36 to 36+3
0x428
CH_MAP_REG10
Interrupt Channel Map Register for 40 to 40+3
0x42c
CH_MAP_REG11
Interrupt Channel Map Register for 44 to 44+3
0x430
CH_MAP_REG12
Interrupt Channel Map Register for 48 to 48+3
0x434
CH_MAP_REG13
Interrupt Channel Map Register for 52 to 52+3
0x438
CH_MAP_REG14
Interrupt Channel Map Register for 56 to 56+3
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Table 6-31. CIC1 Register (continued)
ADDRESS
OFFSET
REGISTER MNEMONIC
REGISTER NAME
0x43c
CH_MAP_REG15
Interrupt Channel Map Register for 60 to 60+3
0x440
CH_MAP_REG16
Interrupt Channel Map Register for 64 to 64+3
0x444
CH_MAP_REG17
Interrupt Channel Map Register for 68 to 68+3
0x448
CH_MAP_REG18
Interrupt Channel Map Register for 72 to 72+3
0x44c
CH_MAP_REG19
Interrupt Channel Map Register for 76 to 76+3
0x450
CH_MAP_REG20
Interrupt Channel Map Register for 80 to 80+3
0x454
CH_MAP_REG21
Interrupt Channel Map Register for 84 to 84+3
0x458
CH_MAP_REG22
Interrupt Channel Map Register for 88 to 88+3
0x45c
CH_MAP_REG23
Interrupt Channel Map Register for 92 to 92+3
0x460
CH_MAP_REG24
Interrupt Channel Map Register for 96 to 96+3
0x464
CH_MAP_REG25
Interrupt Channel Map Register for 100 to 100+3
0x468
CH_MAP_REG26
Interrupt Channel Map Register for 104 to 104+3
0x46c
CH_MAP_REG27
Interrupt Channel Map Register for 108 to 108+3
0x470
CH_MAP_REG28
Interrupt Channel Map Register for 112 to 112+3
0x474
CH_MAP_REG29
Interrupt Channel Map Register for 116 to 116+3
0x478
CH_MAP_REG30
Interrupt Channel Map Register for 120 to 120+3
0x47c
CH_MAP_REG31
Interrupt Channel Map Register for 124 to 124+3
0x480
CH_MAP_REG32
Interrupt Channel Map Register for 128 to 128+3
0x484
CH_MAP_REG33
Interrupt Channel Map Register for 132 to 132+3
0x488
CH_MAP_REG34
Interrupt Channel Map Register for 136 to 136+3
0x48c
CH_MAP_REG35
Interrupt Channel Map Register for 140 to 140+3
0x490
CH_MAP_REG36
Interrupt Channel Map Register for 144 to 144+3
0x494
CH_MAP_REG37
Interrupt Channel Map Register for 148 to 148+3
0x498
CH_MAP_REG38
Interrupt Channel Map Register for 152 to 152+3
0x49c
CH_MAP_REG39
Interrupt Channel Map Register for 156 to 156+3
0x800
HINT_MAP_REG0
Host Interrupt Map Register for 0 to 0+3
0x804
HINT_MAP_REG1
Host Interrupt Map Register for 4 to 4+3
0x808
HINT_MAP_REG2
Host Interrupt Map Register for 8 to 8+3
0x80c
HINT_MAP_REG3
Host Interrupt Map Register for 12 to 12+3
0x810
HINT_MAP_REG4
Host Interrupt Map Register for 16 to 16+3
0x814
HINT_MAP_REG5
Host Interrupt Map Register for 20 to 20+3
0x818
HINT_MAP_REG6
Host Interrupt Map Register for 24 to 24+3
0x81c
HINT_MAP_REG7
Host Interrupt Map Register for 28 to 28+3
0x820
HINT_MAP_REG8
Host Interrupt Map Register for 32 to 32+3
0x824
HINT_MAP_REG9
Host Interrupt Map Register for 36 to 36+3
0x828
HINT_MAP_REG10
Host Interrupt Map Register for 40 to 40+3
0x82c
HINT_MAP_REG11
Host Interrupt Map Register for 44 to 44+3
0x830
HINT_MAP_REG12
Host Interrupt Map Register for 48 to 48+3
0x834
HINT_MAP_REG13
Host Interrupt Map Register for 52 to 52+3
0x838
HINT_MAP_REG14
Host Interrupt Map Register for 56 to 56+3
0x83c
HINT_MAP_REG15
Host Interrupt Map Register for 60 to 60+3
0x1500
ENABLE_HINT_REG0
Host Int Enable Register 0
0x1504
ENABLE_HINT_REG1
Host Int Enable Register 1
124
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6.9.2.3
SPRS814D – MARCH 2012 – REVISED OCTOBER 2019
CIC2 Register Map
Table 6-32 describes the CIC2 registers.
Table 6-32. CIC2 Register
ADDRESS
OFFSET
REGISTER MNEMONIC
REGISTER NAME
0x0
REVISION_REG
Revision Register
0x10
GLOBAL_ENABLE_HINT_REG
Global Host Int Enable Register
0x20
STATUS_SET_INDEX_REG
Status Set Index Register
0x24
STATUS_CLR_INDEX_REG
Status Clear Index Register
0x28
ENABLE_SET_INDEX_REG
Enable Set Index Register
0x2c
ENABLE_CLR_INDEX_REG
Enable Clear Index Register
0x34
HINT_ENABLE_SET_INDEX_REG
Host Int Enable Set Index Register
0x38
HINT_ENABLE_CLR_INDEX_REG
Host Int Enable Clear Index Register
0x200
RAW_STATUS_REG0
Raw Status Register 0
0x204
RAW_STATUS_REG1
Raw Status Register 1
0x208
RAW_STATUS_REG2
Raw Status Register 2
0x280
ENA_STATUS_REG0
Enabled Status Register 0
0x284
ENA_STATUS_REG1
Enabled Status Register 1
0x288
ENA_STATUS_REG2
Enabled Status Register 2
0x300
ENABLE_REG0
Enable Register 0
0x304
ENABLE_REG1
Enable Register 1
0x308
ENABLE_REG2
Enable Register 2
0x380
ENABLE_CLR_REG0
Enable Clear Register 0
0x384
ENABLE_CLR_REG1
Enable Clear Register 1
0x388
ENABLE_CLR_REG2
Enable Clear Register 2
0x400
CH_MAP_REG0
Interrupt Channel Map Register for 0 to 0+3
0x404
CH_MAP_REG1
Interrupt Channel Map Register for 4 to 4+3
0x408
CH_MAP_REG2
Interrupt Channel Map Register for 8 to 8+3
0x40c
CH_MAP_REG3
Interrupt Channel Map Register for 12 to 12+3
0x410
CH_MAP_REG4
Interrupt Channel Map Register for 16 to 16+3
0x414
CH_MAP_REG5
Interrupt Channel Map Register for 20 to 20+3
0x418
CH_MAP_REG6
Interrupt Channel Map Register for 24 to 24+3
0x41c
CH_MAP_REG7
Interrupt Channel Map Register for 28 to 28+3
0x420
CH_MAP_REG8
Interrupt Channel Map Register for 32 to 32+3
0x424
CH_MAP_REG9
Interrupt Channel Map Register for 36 to 36+3
0x428
CH_MAP_REG10
Interrupt Channel Map Register for 40 to 40+3
0x42c
CH_MAP_REG11
Interrupt Channel Map Register for 44 to 44+3
0x430
CH_MAP_REG12
Interrupt Channel Map Register for 48 to 48+3
0x434
CH_MAP_REG13
Interrupt Channel Map Register for 52 to 52+3
0x438
CH_MAP_REG14
Interrupt Channel Map Register for 56 to 56+3
0x43c
CH_MAP_REG15
Interrupt Channel Map Register for 60 to 60+3
0x440
CH_MAP_REG16
Interrupt Channel Map Register for 64 to 64+3
0x444
CH_MAP_REG17
Interrupt Channel Map Register for 68 to 68+3
0x448
CH_MAP_REG18
Interrupt Channel Map Register for 72 to 72+3
0x44c
CH_MAP_REG19
Interrupt Channel Map Register for 76 to 76+3
0x800
HINT_MAP_REG0
Host Interrupt Map Register for 0 to 0+3
0x804
HINT_MAP_REG1
Host Interrupt Map Register for 4 to 4+3
0x808
HINT_MAP_REG2
Host Interrupt Map Register for 8 to 8+3
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Table 6-32. CIC2 Register (continued)
ADDRESS
OFFSET
REGISTER MNEMONIC
REGISTER NAME
0x80c
HINT_MAP_REG3
Host Interrupt Map Register for 12 to 12+3
0x810
HINT_MAP_REG4
Host Interrupt Map Register for 16 to 16+3
0x814
HINT_MAP_REG5
Host Interrupt Map Register for 20 to 20+3
0x818
HINT_MAP_REG6
Host Interrupt Map Register for 24 to 24+3
0x81c
HINT_MAP_REG7
Host Interrupt Map Register for 28 to 28+3
0x1500
ENABLE_HINT_REG0
Host Int Enable Register 0
6.9.3
Interprocessor Register Map
Table 6-33 describes the IPC generation registers.
Table 6-33. IPC Generation Registers (IPCGRx)
ADDRESS START ADDRESS END
SIZE
REGISTER NAME
DESCRIPTION
0x02620200
0x02620203
4B
NMIGR0
NMI Event Generation Register for CorePac0
0x02620204
0x02620207
4B
NMIGR1
NMI Event Generation Register for CorePac 1 (C6657 only)
0x02620208
0x0262020B
4B
Reserved
Reserved
0x0262020C
0x0262020F
4B
Reserved
Reserved
0x02620210
0x02620213
4B
Reserved
Reserved
0x02620214
0x02620217
4B
Reserved
Reserved
0x02620218
0x0262021B
4B
Reserved
Reserved
0x0262021C
0x0262021F
4B
Reserved
Reserved
0x02620220
0x0262023F
32B
Reserved
Reserved
0x02620240
0x02620243
4B
IPCGR0
IPC Generation Register for CorePac 0
0x02620244
0x02620247
4B
IPCGR1
IPC Generation Register for CorePac 1 (C6657 only)
0x02620248
0x0262024B
4B
Reserved
Reserved
0x0262024C
0x0262024F
4B
Reserved
Reserved
0x02620250
0x02620253
4B
Reserved
Reserved
0x02620254
0x02620257
4B
Reserved
Reserved
0x02620258
0x0262025B
4B
Reserved
Reserved
0x0262025C
0x0262025F
4B
Reserved
Reserved
0x02620260
0x0262027B
28B
Reserved
Reserved
0x0262027C
0x0262027F
4B
IPCGRH
IPC Generation Register for Host
0x02620280
0x02620283
4B
IPCAR0
IPC Acknowledgement Register for CorePac 0
0x02620284
0x02620287
4B
IPCAR1
IPC Acknowledgement Register for CorePac 1 (C6657 only)
0x02620288
0x0262028B
4B
Reserved
Reserved
0x0262028C
0x0262028F
4B
Reserved
Reserved
0x02620290
0x02620293
4B
Reserved
Reserved
0x02620294
0x02620297
4B
Reserved
Reserved
0x02620298
0x0262029B
4B
Reserved
Reserved
0x0262029C
0x0262029F
4B
Reserved
Reserved
0x026202A0
0x026202BB
28B
Reserved
Reserved
0x026202BC
0x026202BF
4B
IPCARH
IPC Acknowledgement Register for Host
126
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6.9.4
SPRS814D – MARCH 2012 – REVISED OCTOBER 2019
NMI and LRESET
Nonmaskable interrupts (NMI) can be generated by chip-level registers and the LRESET can be
generated by software writing into LPSC registers. LRESET and NMI can also be asserted by device pins
or watchdog timers. One NMI pin and one LRESET pin are shared by all CorePacs on the device. The
CORESEL[3:0] pins can be configured to select between the CorePacs available as shown in Table 6-34.
Table 6-34. LRESET and NMI Decoding
CORESEL[1:0]
PIN INPUT
LRESET
PIN INPUT
NMI
PIN INPUT
LRESETNMIEN
PIN INPUT
RESET MUX BLOCK OUTPUT
XX
X
X
1
No local reset or NMI assertion.
00
0
X
0
Assert local reset to CorePac 0
01
0
X
0
Assert local reset to CorePac 1 (C6657) or Reserved
(C6655)
1x
0
X
0
Assert local reset to all CorePacs
00
1
1
0
Deassert local reset and NMI to CorePac 0
01
1
1
0
Deassert local reset and NMI to CorePac 1 (C6657)
or Reserved (C6655)
1x
1
1
0
Deassert local reset and NMI to all CorePacs
00
1
0
0
Assert NMI to CorePac 0
01
1
0
0
Assert NMI to CorePac 1 (C6657) or Reserved
(C6655)
1x
1
0
0
Assert NMI to all CorePacs
6.10 Memory Protection Unit (MPU)
The C665x supports five MPUs:
•
•
•
•
One MPU is used to protect main CORE/3 CFG TeraNet (CFG space of all slave devices on the TeraNet is
protected by the MPU).
Two MPUs are used for QM_SS (one for the DATA PORT port and the other is for the CFG PORT port).
One MPU is used for Semaphore.
One MPU is used for EMIF16
This section contains MPU register map and details of device-specific MPU registers only. For MPU
features and details of generic MPU registers, see the Memory Protection Unit (MPU) for KeyStone
Devices User's Guide.
Table 6-35 lists the configuration of each MPU and Table 6-36 lists the memory regions protected by each
MPU.
Table 6-35. MPU Default Configuration
SETTING
MPU0 (MAIN CFG
TERANET)
MPU1 (QM_SS
DATA PORT)
MPU2 (QM_SS CFG MPU3
PORT)
(SEMAPHORE)
Default permission
Assume allowed
Assume allowed
Assume allowed
Assume allowed Assume allowed
Number of allowed IDs supported
16
16
16
16
16
Number of programmable ranges
supported
16
5
16
1
16
Compare width
1KB granularity
1KB granularity
1KB granularity
1KB granularity
1KB granularity
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MPU4
(EMIF16)
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Table 6-36. MPU Memory Regions
MEMORY PROTECTION
START ADDRESS
END ADDRESS
MPU0
Main CFG TeraNet
0x01D00000
0x026207FF
MPU1
QM_SS DATA PORT
0x34000000
0x340BFFFF
MPU2
QM_SS CFG PORT
0x02A00000
0x02ABFFFF
MPU3
Semaphore
0x02640000
0x026407FF
MPU4
EMIF16
0x70000000
0x7FFFFFFF
Table 6-37 shows the privilege ID of each CORE and every mastering peripheral. Table 6-37 also shows
the privilege level (supervisor vs. user), and access type (instruction read vs. data/DMA read or write) of
each master on the device. In some cases, a particular setting depends on software being executed at the
time of the access or the configuration of the master peripheral.
Table 6-37. Privilege ID Settings
PRIVILEGE ID MASTER
PRIVILEGE LEVEL
ACCESS
TYPE
0
CorePac0
SW dependant, driven by MSMC
DMA
1
CorePac1 (C6657 only)
SW dependant, driven by MSMC
DMA
2
Reserved
3
Reserved
4
Reserved
5
Reserved
6
uPP
User
DMA
7
EMAC
User
DMA
8
QM_PKTDMA
User
DMA
9
SRIO_Packet DMA/SRIO_M
User/Driven by SRIO block, user mode and supervisor mode is
DMA
determined on a per-transaction basis. Only the transaction with source ID
matching the value in the SupervisorID Register is granted supervisor
mode.
10
QM_second
User
DMA
11
PCIe
Supervisor
DMA
12
DAP
Driven by Debug_SS
DMA
13
HyperLink
Supervisor
DMA
14
HyperLink
Supervisor
DMA
15
HyperLink
Supervisor
DMA
128
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Table 6-38 shows the master ID of each CorePac and every mastering peripheral. Master IDs are used to
determine allowed connections between masters and slaves. Unlike privilege IDs, which can be shared
across different masters, master IDs are unique to each master.
Table 6-38. Master ID Settings (1)
MASTER ID
MASTER
MASTER ID
MASTER
0
CorePac0
40 - 47
Reserved
1
CorePac1 (C6657) or Reserved
(C6655)
48
DAP
2
Reserved
49
Reserved
3
Reserved
50
EDMA3_CC
4
Reserved
51
Reserved
5
Reserved
52
MSMC (2)
6
Reserved
53
PCIe
7
Reserved
54
SRIO_Master
8
CorePac0_CFG
55
HyperLink
9
CorePac1_CFG (C6657) or
Reserved (C6655)
56
EMAC
10
Reserved
57 - 87
Reserved
11
Reserved
88 - 91
QM_PKTDMA
12
Reserved
92 - 93
QM_Second
13
Reserved
94
Reserved
14
Reserved
95
uPP
15
Reserved
96 - 127
Reserved
16
Reserved
128
Tracer_core_0 (3)
17
Reserved
129
Tracer_core_1 (C6657) or
Reserved (C6655)
18
Reserved
130
Reserved
19
Reserved
131
Reserved
20
Reserved
132
Reserved
21
Reserved
133
Reserved
22
Reserved
134
Reserved
23
Reserved
135
Reserved
24
Reserved
136
Tracer_MSMC0
25
Reserved
137
Tracer_MSMC1
26
Reserved
138
Tracer_MSMC2
27
Reserved
139
Tracer_MSMC3
28
EDMA_TC0 read
140
Tracer_DDR
29
EDMA_TC0 write
141
Tracer_SEM
30
EDMA_TC1 read
142
Tracer_QM_CFG
31
EDMA_TC1 write
143
Tracer_QM_DMA
32
EDMA_TC2 read
144
Tracer_CFG
33
EDMA_TC2 write
145
Reserved
34
EDMA_TC3 read
146
Reserved
35
EDMA_TC3 write
147
Reserved
36 - 37
Reserved
148
Tracer_EMIF16
38 - 39
SRIO_PKTDMA
(1)
(2)
(3)
Some of the PKTDMA-based peripherals require multiple master IDs. QMS_PKTDMA is assigned with 88,89,90,91, but only 88-89 are
actually used. There are two master ID values are assigned for the QM_second master port, one master ID for external linking RAM and
the other one for the PDSP/MCDM accesses.
The master ID for MSMC is for the transactions initiated by MSMC internally and sent to the DDR.
All Tracers are set to the same master ID and bit 7 of the master ID must be 1.
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6.10.1 MPU Registers
This section includes the offsets for MPU registers and definitions for device specific MPU registers.
6.10.1.1 MPU Register Map
Table 6-39. MPU0 Registers
OFFSET
NAME
DESCRIPTION
0h
REVID
Revision ID
4h
CONFIG
Configuration
10h
IRAWSTAT
Interrupt raw status/set
14h
IENSTAT
Interrupt enable status/clear
18h
IENSET
Interrupt enable
1Ch
IENCLR
Interrupt enable clear
20h
EOI
End of interrupt
200h
PROG0_MPSAR
Programmable range 0, start address
204h
PROG0_MPEAR
Programmable range 0, end address
208h
PROG0_MPPA
Programmable range 0, memory page protection attributes
210h
PROG1_MPSAR
Programmable range 1, start address
214h
PROG1_MPEAR
Programmable range 1, end address
218h
PROG1_MPPA
Programmable range 1, memory page protection attributes
220h
PROG2_MPSAR
Programmable range 2, start address
224h
PROG2_MPEAR
Programmable range 2, end address
228h
PROG2_MPPA
Programmable range 2, memory page protection attributes
230h
PROG3_MPSAR
Programmable range 3, start address
234h
PROG3_MPEAR
Programmable range 3, end address
238h
PROG3_MPPA
Programmable range 3, memory page protection attributes
240h
PROG4_MPSAR
Programmable range 4, start address
244h
PROG4_MPEAR
Programmable range 4, end address
248h
PROG4_MPPA
Programmable range 4, memory page protection attributes
250h
PROG5_MPSAR
Programmable range 5, start address
254h
PROG5_MPEAR
Programmable range 5, end address
258h
PROG5_MPPA
Programmable range 5, memory page protection attributes
260h
PROG6_MPSAR
Programmable range 6, start address
264h
PROG6_MPEAR
Programmable range 6, end address
268h
PROG6_MPPA
Programmable range 6, memory page protection attributes
270h
PROG7_MPSAR
Programmable range 7, start address
274h
PROG7_MPEAR
Programmable range 7, end address
278h
PROG7_MPPA
Programmable range 7, memory page protection attributes
280h
PROG8_MPSAR
Programmable range 8, start address
284h
PROG8_MPEAR
Programmable range 8, end address
288h
PROG8_MPPA
Programmable range 8, memory page protection attributes
290h
PROG9_MPSAR
Programmable range 9, start address
294h
PROG9_MPEAR
Programmable range 9, end address
298h
PROG9_MPPA
Programmable range 9, memory page protection attributes
2A0h
PROG10_MPSAR
Programmable range 10, start address
2A4h
PROG10_MPEAR
Programmable range 10, end address
2A8h
PROG10_MPPA
Programmable range 10, memory page protection attributes
2B0h
PROG11_MPSAR
Programmable range 11, start address
2B4h
PROG11_MPEAR
Programmable range 11, end address
130
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Table 6-39. MPU0 Registers (continued)
OFFSET
NAME
DESCRIPTION
2B8h
PROG11_MPPA
Programmable range 11, memory page protection attributes
2C0h
PROG12_MPSAR
Programmable range 12, start address
2C4h
PROG12_MPEAR
Programmable range 12, end address
2C8h
PROG12_MPPA
Programmable range 12, memory page protection attributes
2D0h
PROG13_MPSAR
Programmable range 13, start address
2D4h
PROG13_MPEAR
Programmable range 13, end address
2Dh
PROG13_MPPA
Programmable range 13, memory page protection attributes
2E0h
PROG14_MPSAR
Programmable range 14, start address
2E4h
PROG14_MPEAR
Programmable range 14, end address
2E8h
PROG14_MPPA
Programmable range 14, memory page protection attributes
2F0h
PROG15_MPSAR
Programmable range 15, start address
2F4h
PROG15_MPEAR
Programmable range 15, end address
2F8h
PROG15_MPPA
Programmable range 15, memory page protection attributes
300h
FLTADDRR
Fault address
304h
FLTSTAT
Fault status
308h
FLTCLR
Fault clear
Table 6-40. MPU1 Registers
OFFSET
NAME
DESCRIPTION
0h
REVID
Revision ID
4h
CONFIG
Configuration
10h
IRAWSTAT
Interrupt raw status/set
14h
IENSTAT
Interrupt enable status/clear
18h
IENSET
Interrupt enable
1Ch
IENCLR
Interrupt enable clear
20h
EOI
End of interrupt
200h
PROG0_MPSAR
Programmable range 0, start address
204h
PROG0_MPEAR
Programmable range 0, end address
208h
PROG0_MPPA
Programmable range 0, memory page protection attributes
210h
PROG1_MPSAR
Programmable range 1, start address
214h
PROG1_MPEAR
Programmable range 1, end address
218h
PROG1_MPPA
Programmable range 1, memory page protection attributes
220h
PROG2_MPSAR
Programmable range 2, start address
224h
PROG2_MPEAR
Programmable range 2, end address
228h
PROG2_MPPA
Programmable range 2, memory page protection attributes
230h
PROG3_MPSAR
Programmable range 3, start address
234h
PROG3_MPEAR
Programmable range 3, end address
238h
PROG3_MPPA
Programmable range 3, memory page protection attributes
240h
PROG4_MPSAR
Programmable range 4, start address
244h
PROG4_MPEAR
Programmable range 4, end address
248h
PROG4_MPPA
Programmable range 4, memory page protection attributes
300h
FLTADDRR
Fault address
304h
FLTSTAT
Fault status
308h
FLTCLR
Fault clear
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Table 6-41. MPU2 Registers
OFFSET
NAME
DESCRIPTION
0h
REVID
Revision ID
4h
CONFIG
Configuration
10h
IRAWSTAT
Interrupt raw status/set
14h
IENSTAT
Interrupt enable status/clear
18h
IENSET
Interrupt enable
1Ch
IENCLR
Interrupt enable clear
20h
EOI
End of interrupt
200h
PROG0_MPSAR
Programmable range 0, start address
204h
PROG0_MPEAR
Programmable range 0, end address
208h
PROG0_MPPA
Programmable range 0, memory page protection attributes
210h
PROG1_MPSAR
Programmable range 1, start address
214h
PROG1_MPEAR
Programmable range 1, end address
218h
PROG1_MPPA
Programmable range 1, memory page protection attributes
220h
PROG2_MPSAR
Programmable range 2, start address
224h
PROG2_MPEAR
Programmable range 2, end address
228h
PROG2_MPPA
Programmable range 2, memory page protection attributes
230h
PROG3_MPSAR
Programmable range 3, start address
234h
PROG3_MPEAR
Programmable range 3, end address
238h
PROG3_MPPA
Programmable range 3, memory page protection attributes
240h
PROG4_MPSAR
Programmable range 4, start address
244h
PROG4_MPEAR
Programmable range 4, end address
248h
PROG4_MPPA
Programmable range 4, memory page protection attributes
250h
PROG5_MPSAR
Programmable range 5, start address
254h
PROG5_MPEAR
Programmable range 5, end address
258h
PROG5_MPPA
Programmable range 5, memory page protection attributes
260h
PROG6_MPSAR
Programmable range 6, start address
264h
PROG6_MPEAR
Programmable range 6, end address
268h
PROG6_MPPA
Programmable range 6, memory page protection attributes
270h
PROG7_MPSAR
Programmable range 7, start address
274h
PROG7_MPEAR
Programmable range 7, end address
278h
PROG7_MPPA
Programmable range 7, memory page protection attributes
280h
PROG8_MPSAR
Programmable range 8, start address
284h
PROG8_MPEAR
Programmable range 8, end address
288h
PROG8_MPPA
Programmable range 8, memory page protection attributes
290h
PROG9_MPSAR
Programmable range 9, start address
294h
PROG9_MPEAR
Programmable range 9, end address
298h
PROG9_MPPA
Programmable range 9, memory page protection attributes
2A0h
PROG10_MPSAR
Programmable range 10, start address
2A4h
PROG10_MPEAR
Programmable range 10, end address
2A8h
PROG10_MPPA
Programmable range 10, memory page protection attributes
2B0h
PROG11_MPSAR
Programmable range 11, start address
2B4h
PROG11_MPEAR
Programmable range 11, end address
2B8h
PROG11_MPPA
Programmable range 11, memory page protection attributes
2C0h
PROG12_MPSAR
Programmable range 12, start address
2C4h
PROG12_MPEAR
Programmable range 12, end address
2C8h
PROG12_MPPA
Programmable range 12, memory page protection attributes
2D0h
PROG13_MPSAR
Programmable range 13, start address
132
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Table 6-41. MPU2 Registers (continued)
OFFSET
NAME
DESCRIPTION
2D4h
PROG13_MPEAR
Programmable range 13, end address
2Dh
PROG13_MPPA
Programmable range 13, memory page protection attributes
2E0h
PROG14_MPSAR
Programmable range 14, start address
2E4h
PROG14_MPEAR
Programmable range 14, end address
2E8h
PROG14_MPPA
Programmable range 14, memory page protection attributes
2F0h
PROG15_MPSAR
Programmable range 15, start address
2F4h
PROG15_MPEAR
Programmable range 15, end address
2F8h
PROG15_MPPA
Programmable range 15, memory page protection attributes
300h
FLTADDRR
Fault address
304h
FLTSTAT
Fault status
308h
FLTCLR
Fault clear
Table 6-42. MPU3 Registers
OFFSET
NAME
DESCRIPTION
0h
REVID
Revision ID
4h
CONFIG
Configuration
10h
IRAWSTAT
Interrupt raw status/set
14h
IENSTAT
Interrupt enable status/clear
18h
IENSET
Interrupt enable
1Ch
IENCLR
Interrupt enable clear
20h
EOI
End of interrupt
200h
PROG0_MPSAR
Programmable range 0, start address
204h
PROG0_MPEAR
Programmable range 0, end address
208h
PROG0_MPPA
Programmable range 0, memory page protection attributes
300h
FLTADDRR
Fault address
304h
FLTSTAT
Fault status
308h
FLTCLR
Fault clear
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Table 6-43. MPU4 Registers
OFFSET
NAME
DESCRIPTION
0h
REVID
Revision ID
4h
CONFIG
Configuration
10h
IRAWSTAT
Interrupt raw status/set
14h
IENSTAT
Interrupt enable status/clear
18h
IENSET
Interrupt enable
1Ch
IENCLR
Interrupt enable clear
20h
EOI
End of interrupt
200h
PROG0_MPSAR
Programmable range 0, start address
204h
PROG0_MPEAR
Programmable range 0, end address
208h
PROG0_MPPA
Programmable range 0, memory page protection attributes
210h
PROG1_MPSAR
Programmable range 1, start address
214h
PROG1_MPEAR
Programmable range 1, end address
218h
PROG1_MPPA
Programmable range 1, memory page protection attributes
220h
PROG2_MPSAR
Programmable range 2, start address
224h
PROG2_MPEAR
Programmable range 2, end address
228h
PROG2_MPPA
Programmable range 2, memory page protection attributes
230h
PROG3_MPSAR
Programmable range 3, start address
234h
PROG3_MPEAR
Programmable range 3, end address
238h
PROG3_MPPA
Programmable range 3, memory page protection attributes
240h
PROG4_MPSAR
Programmable range 4, start address
244h
PROG4_MPEAR
Programmable range 4, end address
248h
PROG4_MPPA
Programmable range 4, memory page protection attributes
250h
PROG5_MPSAR
Programmable range 5, start address
254h
PROG5_MPEAR
Programmable range 5, end address
258h
PROG5_MPPA
Programmable range 5, memory page protection attributes
260h
PROG6_MPSAR
Programmable range 6, start address
264h
PROG6_MPEAR
Programmable range 6, end address
268h
PROG6_MPPA
Programmable range 6, memory page protection attributes
270h
PROG7_MPSAR
Programmable range 7, start address
274h
PROG7_MPEAR
Programmable range 7, end address
278h
PROG7_MPPA
Programmable range 7, memory page protection attributes
280h
PROG8_MPSAR
Programmable range 8, start address
284h
PROG8_MPEAR
Programmable range 8, end address
288h
PROG8_MPPA
Programmable range 8, memory page protection attributes
290h
PROG9_MPSAR
Programmable range 9, start address
294h
PROG9_MPEAR
Programmable range 9, end address
298h
PROG9_MPPA
Programmable range 9, memory page protection attributes
2A0h
PROG10_MPSAR
Programmable range 10, start address
2A4h
PROG10_MPEAR
Programmable range 10, end address
2A8h
PROG10_MPPA
Programmable range 10, memory page protection attributes
2B0h
PROG11_MPSAR
Programmable range 11, start address
2B4h
PROG11_MPEAR
Programmable range 11, end address
2B8h
PROG11_MPPA
Programmable range 11, memory page protection attributes
2C0h
PROG12_MPSAR
Programmable range 12, start address
2C4h
PROG12_MPEAR
Programmable range 12, end address
2C8h
PROG12_MPPA
Programmable range 12, memory page protection attributes
2D0h
PROG13_MPSAR
Programmable range 13, start address
134
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Table 6-43. MPU4 Registers (continued)
OFFSET
NAME
DESCRIPTION
2D4h
PROG13_MPEAR
Programmable range 13, end address
2Dh
PROG13_MPPA
Programmable range 13, memory page protection attributes
2E0h
PROG14_MPSAR
Programmable range 14, start address
2E4h
PROG14_MPEAR
Programmable range 14, end address
2E8h
PROG14_MPPA
Programmable range 14, memory page protection attributes
2F0h
PROG15_MPSAR
Programmable range 15, start address
2F4h
PROG15_MPEAR
Programmable range 15, end address
2F8h
PROG15_MPPA
Programmable range 15, memory page protection attributes
300h
FLTADDRR
Fault address
304h
FLTSTAT
Fault status
308h
FLTCLR
Fault clear
6.10.1.2 Device-Specific MPU Registers
6.10.1.2.1 Configuration Register (CONFIG)
The Configuration Register (CONFIG) contains the configuration value of the MPU. CONFIG is shown in
Figure 6-19 and described in Table 6-44.
Figure 6-19. Configuration Register (CONFIG)
31
Reset Values
MPU0
MPU1
MPU2
MPU3
MPU4
24
ADDR_WIDTH
R-0
R-0
R-0
R-0
R-0
23
20
NUM_FIXED
R-0
R-0
R-0
R-0
R-0
19
16
NUM_PROG
R-16
R-5
R-16
R-1
R-16
15
12
NUM_AIDS
R-16
R-16
R-16
R-16
R-16
11
1
Reserved
R-0
R-0
R-0
R-0
R-0
0
ASSUME_ALLOWED
R-1
R-1
R-1
R-1
R-1
Legend: R = Read only; -n = value after reset
Table 6-44. Configuration Register (CONFIG) Field Descriptions
BIT
FIELD
DESCRIPTION
31 – 24
ADDR_WIDTH
Address alignment for range checking
•
0 = 1KB alignment
•
6 = 64KB alignment
23 – 20
NUM_FIXED
Number of fixed address ranges
19 – 16
NUM_PROG
Number of programmable address ranges
15 – 12
NUM_AIDS
Number of supported AIDs
11 – 1
Reserved
Reserved. These bits will always reads as 0.
0
ASSUME_ALLOWED
Assume allowed bit. When an address is not covered by any MPU protection range, this bit determines
whether the transfer is assumed to be allowed or not.
•
0 = Assume disallowed
•
1 = Assume allowed
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6.10.2 MPU Programmable Range Registers
6.10.2.1 Programmable Range n Start Address Register (PROGn_MPSAR)
The Programmable Address Start Register holds the start address for the range. This register is writeable
by a supervisor entity only.
The start address must be aligned on a page boundary. The size of the page is 1KB. The size of the page
determines the width of the address field in MPSAR and MPEAR. PROGn_MPSAR is shown in Figure 620 and described in Table 6-45.
Figure 6-20. Programmable Range n Start Address Register (PROGn_MPSAR)
31
10
9
0
START_ADDR
Reserved
R/W
R
Legend: R = Read only; R/W = Read/Write
Table 6-45. Programmable Range n Start Address Register (PROGn_MPSAR) Field Descriptions
BIT
FIELD
DESCRIPTION
31 – 10
START_ADDR
Start address for range n.
9–0
Reserved
Reserved and these bits always read as 0.
136
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6.10.2.2 Programmable Range n End Address Register (PROGn_MPEAR)
The Programmable Address End Register holds the end address for the range. This register is writeable
by a supervisor entity only.
The end address must be aligned on a page boundary. The size of the page depends on the MPU
number. The page size for MPU1 is 1KB and for MPU2 it is 64KB. The size of the page determines the
width of the address field in MPSAR and MPEAR. PROGn_MPEAR is shown in Figure 6-21 and
described in Table 6-46.
Figure 6-21. Programmable Range n End Address Register (PROGn_MPEAR)
31
10
9
0
END_ADDR
Reserved
R/W
R
Legend: R = Read only; R/W = Read/Write
Table 6-46. Programmable Range n End Address Register (PROGn_MPEAR) Field Descriptions
BIT
FIELD
DESCRIPTION
31 – 10
END_ADDR
End address for range n.
9–0
Reserved
Reserved and these bits always read as 3FFh.
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6.10.2.3 Programmable Range n Memory Protection Page Attribute Register (PROGn_MPPA)
The Programmable Address Memory Protection Page Attribute Register holds the permissions for the
region. This register is writeable only by a nondebug supervisor entity. PROGn_MPPA is shown in
Figure 6-22 and described in Table 6-47.
Figure 6-22. Programmable Range n Memory Protection Page Attribute Register (PROGn_MPPA)
31
26
Reserved
R
25
24
23
22
21
20
19
18
17
16
15
AID15
AID14
AID13
AID12
AID11
AID10
AID9
AID8
AID7
AID6
AID5
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
AID4
AID3
AID2
AID1
AID0
AIDX
Reserved
Reserved
EMU
SR
SW
SX
UR
UW
UX
R/W
R/W
R/W
R/W
R/W
R/W
R
R
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Legend: R = Read only; R/W = Read/Write
Table 6-47. Programmable Range n Memory Protection Page Attribute Register (PROGn_MPPA)
Field Descriptions
BIT
FIELD
DESCRIPTION
31 – 26
Reserved
Reserved. These bits will always reads as 0.
25
AID15
Controls permission check of ID = 15
•
0 = AID is not checked for permissions
•
1 = AID is checked for permissions
24
AID14
Controls permission check of ID = 14
•
0 = AID is not checked for permissions
•
1 = AID is checked for permissions
23
AID13
Controls permission check of ID = 13
•
0 = AID is not checked for permissions
•
1 = AID is checked for permissions
22
AID12
Controls permission check of ID = 12
•
0 = AID is not checked for permissions
•
1 = AID is checked for permissions
21
AID11
Controls permission check of ID = 11
•
0 = AID is not checked for permissions
•
1 = AID is checked for permissions
20
AID10
Controls permission check of ID = 10
•
0 = AID is not checked for permissions
•
1 = AID is checked for permissions
19
AID9
Controls permission check of ID = 9
•
0 = AID is not checked for permissions
•
1 = AID is checked for permissions
18
AID8
Controls permission check of ID = 8
•
0 = AID is not checked for permissions
•
1 = AID is checked for permissions
17
AID7
Controls permission check of ID = 7
•
0 = AID is not checked for permissions
•
1 = AID is checked for permissions
16
AID6
Controls permission check of ID = 6
•
0 = AID is not checked for permissions
•
1 = AID is checked for permissions
15
AID5
Controls permission check of ID = 5
•
0 = AID is not checked for permissions
•
1 = AID is checked for permissions
138
Detailed Description
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Table 6-47. Programmable Range n Memory Protection Page Attribute Register (PROGn_MPPA) Field
Descriptions (continued)
BIT
FIELD
DESCRIPTION
14
AID4
Controls permission check of ID = 4
•
0 = AID is not checked for permissions
•
1 = AID is checked for permissions
13
AID3
Controls permission check of ID = 3
•
0 = AID is not checked for permissions
•
1 = AID is checked for permissions
12
AID2
Controls permission check of ID = 2
•
0 = AID is not checked for permissions
•
1 = AID is checked for permissions
11
AID1
Controls permission check of ID = 1
•
0 = AID is not checked for permissions
•
1 = AID is checked for permissions
10
AID0
Controls permission check of ID = 0
•
0 = AID is not checked for permissions
•
1 = AID is checked for permissions
9
AIDX
Controls permission check of ID > 15
•
0 = AID is not checked for permissions
•
1 = AID is checked for permissions
8
Reserved
Always reads as 0.
7
Reserved
Always reads as 1.
6
EMU
Emulation (debug) access permission.
•
0 = Debug access not allowed.
•
1 = Debug access allowed.
5
SR
Supervisor Read permission
•
0 = Access not allowed.
•
1 = Access allowed.
4
SW
Supervisor Write permission
•
0 = Access not allowed.
•
1 = Access allowed.
3
SX
Supervisor Execute permission
•
0 = Access not allowed.
•
1 = Access allowed.
2
UR
User Read permission
•
0 = Access not allowed.
•
1 = Access allowed
1
UW
User Write permission
•
0 = Access not allowed.
•
1 = Access allowed.
0
UX
User Execute permission
•
0 = Access not allowed.
•
1 = Access allowed.
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6.10.2.4 MPU Registers Reset Values
Table 6-48, Table 6-49, Table 6-50, Table 6-51, and Table 6-52 describe the MPU register resets.
Table 6-48. Programmable Range n Registers Reset Values for MPU0
MPU0 (MAIN CFG TERANET)
PROGRAMMA START ADDRESS
BLE RANGE
(PROGn_MPSAR)
END ADDRESS
(PROGn_MPEAR)
MEMORY PAGE
PROTECTION ATTRIBUTE
(PROGn_MPPA)
MEMORY PROTECTION
PROG0
0x01D0_0000
0x01D8_007F
0x03FF_FCB6
Tracers
PROG1
0x01F0_0000
0x01F7_FFFF
0x03FF_FC80
Reserved
PROG2
0x0200_0000
0x0209_FFFF
0x03FF_FCB6
Reserved
PROG3
0x01E0_0000
0x01EB_FFFF
0x03FF_FCB6
Reserved
PROG4
0x021C_0000
0x021E_0C3F
0x03FF_FCB6
TCP/VCP
PROG5
0x021F_0000
0x021F_7FFF
0x03FF_FCB6
Reserved
PROG6
0x0220_0000
0x0227_007F
0x03FF_FCB6
Timers
PROG7
0x0231_0000
0x0231_03FF
0x03FF_FCB4
PLL
PROG8
0x0232_0000
0x0232_03FF
0x03FF_FCB4
GPIO
PROG9
0x0233_0000
0x0233_03FF
0x03FF_FCB4
SmartReflex
PROG10
0x0235_0000
0x0235_0FFF
0x03FF_FCB4
PSC
PROG11
0x0240_0000
0x0245_3FFF
0x03FF_FCB6
DEBUG_SS, Tracer
Formatters
PROG12
0x0250_0000
0x0252_03FF
0x03FF_FCB4
EFUSE
PROG13
0x0253_0000
0x0255_03FF
0x03FF_FCB6
I2C, UART
PROG14
0x0260_0000
0x0260_BFFF
0x03FF_FCB4
CICs
PROG15
0x0262_0000
0x0262_07FF
0x03FF_FCB4
Chip-level Registers
Table 6-49. Programmable Range n Registers Reset Values for MPU1
MPU1 (QM_SS DATA PORT)
PROGRAMMA START ADDRESS
BLE RANGE
(PROGn_MPSAR)
END ADDRESS
(PROGn_MPEAR)
MEMORY PAGE
PROTECTION ATTRIBUTE
(PROGn_MPPA)
PROG0
0x3400_0000
0x3401_FFFF
0x03FF_FC80
PROG1
0x3402_0000
0x3405_FFFF
0x000F_FCB6
PROG2
0x3406_0000
0x3406_7FFF
0x03FF_FCB4
PROG3
0x3406_8000
0x340B_7FFF
0x03FF_FC80
PROG4
0x340B_8000
0x340B_FFFF
0x03FF_FCB6
140
Detailed Description
MEMORY PROTECTION
Queue Manager subsystem
data
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Table 6-50. Programmable Range n Registers Reset Values for MPU2
MPU2 (QM_SS CFG PORT)
PROGRAMMA START ADDRESS
BLE RANGE
(PROGn_MPSAR)
END ADDRESS
(PROGn_MPEAR)
MEMORY PAGE
PROTECTION ATTRIBUTE
(PROGn_MPPA)
PROG0
0x02A0_0000
0x02A1_FFFF
0x03FF_FCA4
PROG1
0x02A2_0000
0x02A3_FFFF
0x000F_FCB6
PROG2
0x02A4_0000
0x02A5_FFFF
0x000F_FCB6
PROG3
0x02A6_0000
0x02A6_7FFF
0x03FF_FCB4
PROG4
0x02A6_8000
0x02A6_8FFF
0x03FF_FCB4
PROG5
0x02A6_9000
0x02A6_9FFF
0x03FF_FCB4
PROG6
0x02A6_A000
0x02A6_AFFF
0x03FF_FCB4
PROG7
0x02A6_B000
0x02A6_BFFF
0x03FF_FCB4
PROG8
0x02A6_C000
0x02A6_DFFF
0x03FF_FCB4
PROG9
0x02A6_E000
0x02A6_FFFF
0x03FF_FCB4
PROG10
0x02A8_0000
0x02A8_FFFF
0x03FF_FCA4
PROG11
0x02A9_0000
0x02A9_FFFF
0x03FF_FCB4
PROG12
0x02AA_0000
0x02AA_7FFF
0x03FF_FCB4
PROG13
0x02AA_8000
0x02AA_FFFF
0x03FF_FCB4
PROG14
0x02AB_0000
0x02AB_7FFF
0x03FF_FCB4
PROG15
0x02AB_8000
0x02AB_FFFF
0x03FF_FCB6
MEMORY PROTECTION
Queue Manager subsystem
configuration
Table 6-51. Programmable Range n Registers Reset Values for MPU3
MPU3 (SEMAPHORE)
PROGRAMMA START ADDRESS
BLE RANGE
(PROGn_MPSAR)
END ADDRESS
(PROGn_MPEAR)
MEMORY PAGE
PROTECTION
ATTRIBUTES
(PROGn_MPPA)
PROG0
0x0264_07FF
0x0003_FCB6
0x0264_0000
MEMORY PROTECTION
Semaphore
Table 6-52. Programmable Range n Registers Reset Values for MPU4
MPU4 (EMIF16)
PROGRAMMA START ADDRESS
BLE RANGE
(PROGn_MPSAR)
END ADDRESS
(PROGn_MPEAR)
MEMORY PAGE
PROTECTION ATTRIBUTE
(PROGn_MPPA)
MEMORY PROTECTION
PROG0
0x7000_0000
0x70FF_FFFF
0x03FF_FCB6
EMIF16 data
PROG1
0x7100_0000
0x71FF_FFFF
0x03FF_FCB6
PROG2
0x7200_0000
0x72FF_FFFF
0x03FF_FCB6
PROG3
0x7300_0000
0x73FF_FFFF
0x03FF_FCB6
PROG4
0x7400_0000
0x74FF_FFFF
0x03FF_FCB6
PROG5
0x7500_0000
0x75FF_FFFF
0x03FF_FCB6
PROG6
0x7600_0000
0x76FF_FFFF
0x03FF_FCB6
PROG7
0x7700_0000
0x77FF_FFFF
0x03FF_FCB6
PROG8
0x7800_0000
0x78FF_FFFF
0x03FF_FCB6
PROG9
0x7900_0000
0x79FF_FFFF
0x03FF_FCB6
PROG10
0x7A00_0000
0x7AFF_FFFF
0x03FF_FCB6
PROG11
0x7B00_0000
0x7BFF_FFFF
0x03FF_FCB6
PROG12
0x7C00_0000
0x7CFF_FFFF
0x03FF_FCB6
PROG13
0x7D00_0000
0x7DFF_FFFF
0x03FF_FCB6
PROG14
0x7E00_0000
0x7EFF_FFFF
0x03FF_FCB6
PROG15
0x7F00_0000
0x7FFF_FFFF
0x03FF_FCB6
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6.11 DDR3 Memory Controller
The 32-bit DDR3 Memory Controller bus of the C665x is used to interface to JEDEC-standard-compliant
DDR3 SDRAM devices. The DDR3 external bus interfaces only to DDR3 SDRAM devices; it does not
share the bus with any other types of peripherals.
6.11.1 DDR3 Memory Controller Device-Specific Information
The C665x includes one 32-bit-wide 1.5-V DDR3 SDRAM EMIF interface. The DDR3 interface can
operate at 800 Mega transfers per second (MTS), 1033 MTS, and 1333 MTS.
Due to the complicated nature of the interface, a limited number of topologies will be supported to provide
a 16-bit or 32-bit interface.
The DDR3 electrical requirements are fully specified in the DDR Jedec Specification JESD79-3C.
Standard DDR3 SDRAMs are available in 8- and 16-bit versions, allowing for the following bank
topologies to be supported by the interface:
•
•
•
•
•
•
36-bit: Three 16-bit SDRAMs (including 4 bits of ECC)
36-bit: Five 8-bit SDRAMs (including 4 bits of ECC)
32-bit: Two 16-bit SDRAMs
32-bit: Four 8-bit SDRAMs
16-bit: One 16-bit SDRAM
16-bit: Two 8-bit SDRAM
The approach to specifying interface timing for the DDR3 memory bus is different than on other interfaces
such as I2C or SPI. For these other interfaces, the device timing was specified in terms of data manual
specifications and I/O buffer information specification (IBIS) models. For the DDR3 memory bus, the
approach is to specify compatible DDR3 devices and provide the printed circuit board (PCB) solution and
guidelines directly to the user.
A race condition may exist when certain masters write data to the DDR3 memory controller. For example,
if master A passes a software message through a buffer in external memory and does not wait for an
indication that the write completes, before signaling to master B that the message is ready, when master B
attempts to read the software message, then the master B read may bypass the master A write and, thus,
master B may read stale data and, therefore, receive an incorrect message.
Some master peripherals (for example, EDMA3 transfer controllers with TCCMOD=0) will always wait for
the write to complete before signaling an interrupt to the system, thus avoiding this race condition. For
masters that do not have a hardware specification of write-read ordering, it may be necessary to specify
data ordering through software.
If master A does not wait for indication that a write is complete, it must perform the following workaround:
1.
2.
3.
4.
142
Perform the required write to DDR3 memory space.
Perform a dummy write to the DDR3 memory controller module ID and revision register.
Perform a dummy read from the DDR3 memory controller module ID and revision register.
Indicate to master B that the data is ready to be read after completion of the read in Step 3. The completion of the
read in Step 3 ensures that the previous write was done.
Detailed Description
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6.12 I2C Peripheral
The inter-integrated circuit (I2C) module provides an interface between DSP and other devices compliant
with Philips Semiconductors Inter-IC bus (I2C bus) specification version 2.1 and connected by way of an
I2C bus. External components attached to this 2-wire serial bus can transmit/receive up to 8-bit data
to/from the DSP through the I2C module.
6.12.1 I2C Device-Specific Information
The C665x device includes an I2C peripheral module.
NOTE
When using the I2C module, ensure there are external pullup resistors on the SDA and SCL
pins.
The I2C modules on the C665x may be used by the DSP to control local peripheral ICs (DACs, ADCs, and
so forth.) or may be used to communicate with other controllers in a system or to implement a user
interface.
The I2C port is compatible with Philips I2C specification revision 2.1 (January 2000) and supports:
•
•
•
•
•
•
Fast mode up to 400 Kbps (no fail-safe I/O buffers)
Noise filter to remove noise 50 ns or less
7-bit and 10-bit device addressing modes
Multimaster (transmit/receive) and slave (transmit/receive) functionality
Events: DMA, interrupt, or polling
Slew-rate limited open-drain output buffers
Figure 6-23 shows a block diagram of the I2C module.
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I2C Module
Clock
Prescale
Peripheral Clock
(CPU/6)
2
I CPSC
Control
Bit Clock
Generator
SCL
Noise
Filter
2
I C Clock
I2CCLKH
I2COAR
Own
Address
I2CSAR
Slave
Address
I2CMDR
Mode
I2CCLKL
2
I CCNT
Transmit
I2CXSR
Transmit
Shift
I2CDXR
Transmit
Buffer
SDA
I2C Data
I2CEMDR
Data
Count
Extended
Mode
Interrupt/DMA
Noise
Filter
Receive
I2CIMR
Interrupt
Mask/Status
I2CDRR
Receive
Buffer
I2CSTR
Interrupt
Status
I2CRSR
Receive
Shift
I2CIVR
Interrupt
Vector
Shading denotes control/status registers.
Figure 6-23. I2C Module Block Diagram
144
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6.12.2 I2C Peripheral Register Description(s)
Table 6-53. I2C Registers
HEX ADDRESS RANGE
REGISTER
REGISTER NAME
0253 0000
ICOAR
I2C Own Address Register
0253 0004
ICIMR
I2C Interrupt Mask/Status Register
0253 0008
ICSTR
I2C Interrupt Status Register
0253 000C
ICCLKL
I2C Clock Low-Time Divider Register
0253 0010
ICCLKH
I2C Clock High-Time Divider Register
0253 0014
ICCNT
I2C Data Count Register
0253 0018
ICDRR
I2C Data Receive Register
0253 001C
ICSAR
I2C Slave Address Register
0253 0020
ICDXR
I2C Data Transmit Register
0253 0024
ICMDR
I2C Mode Register
0253 0028
ICIVR
I2C Interrupt Vector Register
0253 002C
ICEMDR
I2C Extended Mode Register
0253 0030
ICPSC
I2C Prescaler Register
0253 0034
ICPID1
I2C Peripheral Identification Register 1 [Value: 0x0000 0105]
0253 0038
ICPID2
I2C Peripheral Identification Register 2 [Value: 0x0000 0005]
0253 003C - 0253 007F
-
Reserved
6.13 HyperLink Peripheral
The devices include the HyperLink bus for companion chip/die interfaces. This is a 4-lane SerDes
interface designed to operate at up to 10 Gbaud per lane. The supported data rates include 1.25 Gbaud,
3.125 Gbaud, 6.25 Gbaud, and 10 Gbaud. The interface is used to connect with external accelerators.
The HyperLink links must be connected with DC coupling.
The interface includes the Serial Station Management Interfaces used to send power management and
flow messages between devices. This consists of four LVCMOS inputs and four LVCMOS outputs
configured as two 2-wire output buses and two 2-wire input buses. Each 2-wire bus includes a data signal
and a clock signal.
6.13.1 HyperLink Device-Specific Interrupt Event
The HyperLink has 64 input events. Events 0 to 31 come from the chip-level interrupt controller and
events 32 to 63 are from queue-pending signals from the Queue Manager to monitor some of the
transmission queue status.
Table 6-54. HyperLink Events
EVENT NUMBER
EVENT
EVENT DESCRIPTION
0
CIC2_OUT8
Interrupt Controller output
1
CIC2_OUT9
Interrupt Controller output
2
CIC2_OUT10
Interrupt Controller output
3
CIC2_OUT11
Interrupt Controller output
4
CIC2_OUT12
Interrupt Controller output
5
CIC2_OUT13
Interrupt Controller output
6
CIC2_OUT14
Interrupt Controller output
7
CIC2_OUT15
Interrupt Controller output
8
CIC2_OUT16
Interrupt Controller output
9
CIC2_OUT17
Interrupt Controller output
10
CIC2_OUT18
Interrupt Controller output
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Table 6-54. HyperLink Events (continued)
EVENT NUMBER
EVENT
EVENT DESCRIPTION
11
CIC2_OUT19
Interrupt Controller output
12
CIC2_OUT20
Interrupt Controller output
13
CIC2_OUT21
Interrupt Controller output
14
CIC2_OUT22
Interrupt Controller output
15
CIC2_OUT23
Interrupt Controller output
16
CIC2_OUT24
Interrupt Controller output
17
CIC2_OUT25
Interrupt Controller output
18
CIC2_OUT26
Interrupt Controller output
19
CIC2_OUT27
Interrupt Controller output
20
CIC2_OUT28
Interrupt Controller output
21
CIC2_OUT29
Interrupt Controller output
22
CIC2_OUT30
Interrupt Controller output
23
CIC2_OUT31
Interrupt Controller output
24
CIC2_OUT32
Interrupt Controller output
25
CIC2_OUT33
Interrupt Controller output
26
CIC2_OUT34
Interrupt Controller output
27
CIC2_OUT35
Interrupt Controller output
28
CIC2_OUT36
Interrupt Controller output
29
CIC2_OUT37
Interrupt Controller output
30
CIC2_OUT38
Interrupt Controller output
31
CIC2_OUT39
Interrupt Controller output
32
QM_INT_PEND_864
Queue manager pend event
33
QM_INT_PEND_865
Queue manager pend event
34
QM_INT_PEND_866
Queue manager pend event
35
QM_INT_PEND_867
Queue manager pend event
36
QM_INT_PEND_868
Queue manager pend event
37
QM_INT_PEND_869
Queue manager pend event
38
QM_INT_PEND_870
Queue manager pend event
39
QM_INT_PEND_871
Queue manager pend event
40
QM_INT_PEND_872
Queue manager pend event
41
QM_INT_PEND_873
Queue manager pend event
42
QM_INT_PEND_874
Queue manager pend event
43
QM_INT_PEND_875
Queue manager pend event
44
QM_INT_PEND_876
Queue manager pend event
45
QM_INT_PEND_877
Queue manager pend event
46
QM_INT_PEND_878
Queue manager pend event
47
QM_INT_PEND_879
Queue manager pend event
48
QM_INT_PEND_880
Queue manager pend event
49
QM_INT_PEND_881
Queue manager pend event
50
QM_INT_PEND_882
Queue manager pend event
51
QM_INT_PEND_883
Queue manager pend event
52
QM_INT_PEND_884
Queue manager pend event
53
QM_INT_PEND_885
Queue manager pend event
54
QM_INT_PEND_886
Queue manager pend event
55
QM_INT_PEND_887
Queue manager pend event
56
QM_INT_PEND_888
Queue manager pend event
57
QM_INT_PEND_889
Queue manager pend event
146
Detailed Description
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Table 6-54. HyperLink Events (continued)
EVENT NUMBER
EVENT
EVENT DESCRIPTION
58
QM_INT_PEND_890
Queue manager pend event
59
QM_INT_PEND_891
Queue manager pend event
60
QM_INT_PEND_892
Queue manager pend event
61
QM_INT_PEND_893
Queue manager pend event
62
QM_INT_PEND_894
Queue manager pend event
63
QM_INT_PEND_895
Queue manager pend event
6.14 PCIe Peripheral
The 2-lane PCI express (PCIe) module on the device provides an interface between the DSP and other
PCIe-compliant devices. The PCI Express module provides low-pin-count, high-reliability, and high-speed
data transfer at rates of 5.0 GBaud per lane on the serial links. For more information, see the Peripheral
Component Interconnect Express (PCIe) for KeyStone Devices User's Guide. The PCIe electrical
requirements are fully specified in the PCI Express Base Specification Revision 2.0 of PCI-SIG. TI has
performed the simulation and system characterization to ensure all PCIe interface timings in this solution
are met; therefore, no electrical data/timing information is supplied here for this interface.
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6.15 Ethernet Media Access Controller (EMAC)
The Ethernet media access controller (EMAC) module provides an efficient interface between the C665x
DSP core processor and the networked community. The EMAC supports 10Base-T (10 Mbps), and
100BaseTX (100 Mbps), in half- or full-duplex mode, and 1000BaseT (1000 Mbps) in full-duplex mode,
with hardware flow control and quality-of-service (QOS) support.
The EMAC module conforms to the IEEE 802.3-2002 standard, describing the Carrier Sense Multiple
Access with Collision Detection (CSMA/CD) Access Method and Physical Layer specifications. The IEEE
802.3 standard has also been adopted by ISO/IEC and redesignated as ISO/IEC 8802-3:2000(E).
Deviating from this standard, the EMAC module does not use the transmit coding error signal MTXER.
Instead of driving the error pin when an underflow condition occurs on a transmitted frame, the EMAC will
intentionally generate an incorrect checksum by inverting the frame CRC, so that the transmitted frame
will be detected as an error by the network.
The EMAC control module is the main interface between the device core processor, the MDIO module,
and the EMAC module. The relationship between these three components is shown in Figure 6-24. The
EMAC control module contains the necessary components to allow the EMAC to make efficient use of
device memory, plus it controls device interrupts. The EMAC control module incorporates 8KB of internal
RAM to hold EMAC buffer descriptors.
Interrupt
Controller
Configuration Bus
DMA Memory
Transfer Controller
Peripheral Bus
EMAC Control Module
EMAC/MDIO
Interrupt
EMAC Module
MDIO Module
Ethernet Bus
MDIO Bus
Figure 6-24. EMAC, MDIO, and EMAC Control Modules
For more detailed information on the EMAC/MDIO, see Gigabit Ethernet (GbE) Subsystem for KeyStone
Devices User's Guide.
6.15.1 EMAC Device-Specific Information
The EMAC module on the device supports Serial Gigabit Media Independent Interface (SGMII). The
SGMII interface conforms to version 1.8 of the industry standard specification.
148
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6.15.2 EMAC Peripheral Register Description(s)
The memory maps of the EMAC are shown in Table 6-55 through Table 6-60.
Table 6-55. Ethernet MAC (EMAC) Control Registers
HEX ADDRESS
ACRONYM
02C0 8000
TXIDVER
02C0 8004
TXCONTROL
02C0 8008
TXTEARDOWN
02C0 800F
-
02C0 8010
RXIDVER
REGISTER NAME
Transmit Identification and Version Register
Transmit Control Register
Transmit Teardown register
Reserved
Receive Identification and Version Register
02C0 8014
RXCONTROL
02C0 8018
RXTEARDOWN
02C0 801C
-
Reserved
02C0 8020 - 02C0 807C
-
Reserved
02C0 8080
TXINTSTATRAW
02C0 8084
TXINTSTATMASKED
02C0 8088
TXINTMASKSET
02C0 808C
TXINTMASKCLEAR
02C0 8090
MACINVECTOR
02C0 8094
MACEOIVECTOR
Receive Control Register
Receive Teardown Register
Transmit Interrupt Status (Unmasked) Register
Transmit Interrupt Status (Masked) Register
Transmit Interrupt Mask Set Register
Transmit Interrupt Mask Clear Register
MAC Input Vector Register
MAC End of Interrupt Vector Register
02C0 8098 - 02C0 819C
-
02C0 80A0
RXINTSTATRAW
02C0 80A4
RXINTSTATMASKED
02C0 80A8
RXINTMASKSET
02C0 80AC
RXINTMASKCLEAR
Receive Interrupt Mask Clear Register
02C0 80B0
MACINTSTATRAW
MAC Interrupt Status (Unmasked) Register
02C0 80B4
MACINTSTATMASKED
02C0 80B8
MACINTMASKSET
02C0 80BC
MACINTMASKCLEAR
02C0 80C0 - 02C0 80FC
-
Reserved
Receive Interrupt Status (Unmasked) Register
Receive Interrupt Status (Masked) Register
Receive Interrupt Mask Set Register
MAC Interrupt Status (Masked) Register
MAC Interrupt Mask Set Register
MAC Interrupt Mask Clear Register
Reserved
02C0 8100
RXMBPENABLE
Receive Multicast/Broadcast/Promiscuous Channel Enable Register
02C0 8104
RXUNICASTSET
Receive Unicast Enable Set Register
02C0 8108
RXUNICASTCLEAR
02C0 810C
RXMAXLEN
Receive Unicast Clear Register
Receive Maximum Length Register
02C0 8110
RXBUFFEROFFSET
02C0 8114
RXFILTERLOWTHRESH
Receive Buffer Offset Register
02C0 8118 - 02C0 811C
-
02C0 8120
RX0FLOWTHRESH
Receive Channel 0 Flow Control Threshold Register
02C0 8124
RX1FLOWTHRESH
Receive Channel 1 Flow Control Threshold Register
02C0 8128
RX2FLOWTHRESH
Receive Channel 2 Flow Control Threshold Register
02C0 812C
RX3FLOWTHRESH
Receive Channel 3 Flow Control Threshold Register
02C0 8130
RX4FLOWTHRESH
Receive Channel 4 Flow Control Threshold Register
02C0 8134
RX5FLOWTHRESH
Receive Channel 5 Flow Control Threshold Register
02C0 8138
RX6FLOWTHRESH
Receive Channel 6 Flow Control Threshold Register
02C0 813C
RX7FLOWTHRESH
Receive Channel 7 Flow Control Threshold Register
02C0 8140
RX0FREEBUFFER
Receive Channel 0 Free Buffer Count Register
02C0 8144
RX1FREEBUFFER
Receive Channel 1 Free Buffer Count Register
02C0 8148
RX2FREEBUFFER
Receive Channel 2 Free Buffer Count Register
02C0 814C
RX3FREEBUFFER
Receive Channel 3 Free Buffer Count Register
Receive Filter Low Priority Frame Threshold Register
Reserved
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Table 6-55. Ethernet MAC (EMAC) Control Registers (continued)
HEX ADDRESS
ACRONYM
02C0 8150
RX4FREEBUFFER
REGISTER NAME
Receive Channel 4 Free Buffer Count Register
02C0 8154
RX5FREEBUFFER
Receive Channel 5 Free Buffer Count Register
02C0 8158
RX6FREEBUFFER
Receive Channel 6 Free Buffer Count Register
02C0 815C
RX7FREEBUFFER
Receive Channel 7 Free Buffer Count Register
02C0 8160
MACCONTROL
MAC Control Register
02C0 8164
MACSTATUS
MAC Status Register
02C0 8168
EMCONTROL
Emulation Control Register
02C0 816C
FIFOCONTROL
02C0 8170
MACCONFIG
MAC Configuration Register
02C0 8174
SOFTRESET
Soft Reset Register
02C0 81D0
MACSRCADDRLO
MAC Source Address Low Bytes Register
02C0 81D4
MACSRCADDRHI
MAC Source Address High Bytes Register
02C0 81D8
MACHASH1
MAC Hash Address Register 1
02C0 81DC
MACHASH2
MAC Hash Address Register 2
02C0 81E0
BOFFTEST
Back Off Test Register
02C0 81E4
TPACETEST
02C0 81E8
RXPAUSE
Receive Pause Timer Register
Transmit Pause Timer Register
FIFO Control Register
Transmit Pacing Algorithm Test Register
02C0 81EC
TXPAUSE
02C0 8200 - 02C0 82FC
-
See Table 6-56.
02C0 8300 - 02C0 84FC
-
Reserved
02C0 8500
MACADDRLO
MAC Address Low Bytes Register (used in Receive Address Matching)
02C0 8504
MACADDRHI
MAC Address High Bytes Register (used in Receive Address Matching)
02C0 8508
MACINDEX
02C0 850C - 02C0 85FC
-
02C0 8600
TX0HDP
Transmit Channel 0 DMA Head Descriptor Pointer Register
02C0 8604
TX1HDP
Transmit Channel 1 DMA Head Descriptor Pointer Register
02C0 8608
TX2HDP
Transmit Channel 2 DMA Head Descriptor Pointer Register
02C0 860C
TX3HDP
Transmit Channel 3 DMA Head Descriptor Pointer Register
02C0 8610
TX4HDP
Transmit Channel 4 DMA Head Descriptor Pointer Register
02C0 8614
TX5HDP
Transmit Channel 5 DMA Head Descriptor Pointer Register
02C0 8618
TX6HDP
Transmit Channel 6 DMA Head Descriptor Pointer Register
02C0 861C
TX7HDP
Transmit Channel 7 DMA Head Descriptor Pointer Register
02C0 8620
RX0HDP
Receive Channel 0 DMA Head Descriptor Pointer Register
02C0 8624
RX1HDP
Receive t Channel 1 DMA Head Descriptor Pointer Register
150
MAC Index Register
Reserved
02C0 8628
RX2HDP
Receive Channel 2 DMA Head Descriptor Pointer Register
02C0 862C
RX3HDP
Receive t Channel 3 DMA Head Descriptor Pointer Register
02C0 8630
RX4HDP
Receive Channel 4 DMA Head Descriptor Pointer Register
02C0 8634
RX5HDP
Receive t Channel 5 DMA Head Descriptor Pointer Register
02C0 8638
RX6HDP
Receive Channel 6 DMA Head Descriptor Pointer Register
02C0 863C
RX7HDP
Receive t Channel 7 DMA Head Descriptor Pointer Register
02C0 8640
TX0CP
Transmit Channel 0 Completion Pointer (Interrupt Acknowledge) Register
02C0 8644
TX1CP
Transmit Channel 1 Completion Pointer (Interrupt Acknowledge) Register
02C0 8648
TX2CP
Transmit Channel 2 Completion Pointer (Interrupt Acknowledge) Register
02C0 864C
TX3CP
Transmit Channel 3 Completion Pointer (Interrupt Acknowledge) Register
02C0 8650
TX4CP
Transmit Channel 4 Completion Pointer (Interrupt Acknowledge) Register
02C0 8654
TX5CP
Transmit Channel 5 Completion Pointer (Interrupt Acknowledge) Register
02C0 8658
TX6CP
Transmit Channel 6 Completion Pointer (Interrupt Acknowledge) Register
Detailed Description
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Table 6-55. Ethernet MAC (EMAC) Control Registers (continued)
HEX ADDRESS
ACRONYM
02C0 865C
TX7CP
REGISTER NAME
Transmit Channel 7 Completion Pointer (Interrupt Acknowledge) Register
02C0 8660
RX0CP
Receive Channel 0 Completion Pointer (Interrupt Acknowledge) Register
02C0 8664
RX1CP
Receive Channel 1 Completion Pointer (Interrupt Acknowledge) Register
02C0 8668
RX2CP
Receive Channel 2 Completion Pointer (Interrupt Acknowledge) Register
02C0 866C
RX3CP
Receive Channel 3 Completion Pointer (Interrupt Acknowledge) Register
02C0 8670
RX4CP
Receive Channel 4 Completion Pointer (Interrupt Acknowledge) Register
02C0 8674
RX5CP
Receive Channel 5 Completion Pointer (Interrupt Acknowledge) Register
02C0 8678
RX6CP
Receive Channel 6 Completion Pointer (Interrupt Acknowledge) Register
02C0 867C
RX7CP
Receive Channel 7 Completion Pointer (Interrupt Acknowledge) Register
02C0 8680 - 02C0 86FC
-
Reserved
02C0 8700 - 02C0 877C
-
Reserved
02C0 8780 - 02C0 8FFF
-
Reserved
Table 6-56. EMAC Statistics Registers
HEX ADDRESS
ACRONYM
02C0 8200
RXGOODFRAMES
REGISTER NAME
Good Receive Frames Register
02C0 8204
RXBCASTFRAMES
Broadcast Receive Frames Register (Total number of Good Broadcast Frames
Receive)
02C0 8208
RXMCASTFRAMES
Multicast Receive Frames Register (Total number of Good Multicast Frames
Received)
02C0 820C
RXPAUSEFRAMES
Pause Receive Frames Register
02C0 8210
RXCRCERRORS
02C0 8214
RXALIGNCODEERRORS
02C0 8218
RXOVERSIZED
02C0 821C
RXJABBER
02C0 8220
RXUNDERSIZED
Receive Undersized Frames Register (Total number of Undersized Frames
Received)
02C0 8224
RXFRAGMENTS
Receive Frame Fragments Register
02C0 8228
RXFILTERED
02C0 822C
RXQOSFILTERERED
02C0 8230
RXOCTETS
Receive CRC Errors Register (Total number of Frames Received with CRC
Errors)
Receive Alignment/Code Errors register (Total number of frames received with
alignment/code errors)
Receive Oversized Frames Register (Total number of Oversized Frames
Received)
Receive Jabber Frames Register (Total number of Jabber Frames Received)
Filtered Receive Frames Register
Received QOS Filtered Frames Register
Receive Octet Frames Register (Total number of Received Bytes in Good
Frames)
02C0 8234
TXGOODFRAMES
Good Transmit Frames Register (Total number of Good Frames Transmitted)
02C0 8238
TXBCASTFRAMES
Broadcast Transmit Frames Register
02C0 823C
TXMCASTFRAMES
Multicast Transmit Frames Register
02C0 8240
TXPAUSEFRAMES
Pause Transmit Frames Register
02C0 8244
TXDEFERED
Deferred Transmit Frames Register
02C0 8248
TXCOLLISION
Transmit Collision Frames Register
02C0 824C
TXSINGLECOLL
Transmit Single Collision Frames Register
02C0 8250
TXMULTICOLL
02C0 8254
TXEXCESSIVECOLL
Transmit Multiple Collision Frames Register
02C0 8258
TXLATECOLL
Transmit Late Collision Frames Register
02C0 825C
TXUNDERRUN
Transmit Under Run Error Register
02C0 8260
TXCARRIERSENSE
02C0 8264
TXOCTETS
02C0 8268
FRAME64
Transmit Excessive Collision Frames Register
Transmit Carrier Sense Errors Register
Transmit Octet Frames Register
Transmit and Receive 64 Octet Frames Register
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Table 6-56. EMAC Statistics Registers (continued)
HEX ADDRESS
ACRONYM
02C0 826C
FRAME65T127
REGISTER NAME
Transmit and Receive 65 to 127 Octet Frames Register
02C0 8270
FRAME128T255
Transmit and Receive 128 to 255 Octet Frames Register
02C0 8274
FRAME256T511
Transmit and Receive 256 to 511 Octet Frames Register
02C0 8278
FRAME512T1023
Transmit and Receive 512 to 1023 Octet Frames Register
02C0 827C
FRAME1024TUP
Transmit and Receive 1024 to 1518 Octet Frames Register
02C0 8280
NETOCTETS
02C0 8284
RXSOFOVERRUNS
Receive FIFO or DMA Start of Frame Overruns Register
Network Octet Frames Register
02C0 8288
RXMOFOVERRUNS
Receive FIFO or DMA Middle of Frame Overruns Register
02C0 828C
RXDMAOVERRUNS
Receive DMA Start of Frame and Middle of Frame Overruns Register
02C0 8290 - 02C0 82FC
-
Reserved
Table 6-57. EMAC Descriptor Memory
HEX ADDRESS
ACRONYM
02C0 A000 - 02C0 BFFF
-
REGISTER NAME
EMAC Descriptor Memory
Table 6-58. SGMII Control Registers
HEX ADDRESS
ACRONYM
02C0 8900
IDVER
02C0 8904
SOFT_RESET
02C0 8910
CONTROL
Control Register
02C0 8914
STATUS
Status Register
02C0 8918
MR_ADV_ABILITY
02C0 891C
-
02C0 8920
MR_LP_ADV_ABILITY
02C0 8924 - 02C0 8948
-
152
REGISTER NAME
Detailed Description
Identification and Version register
Software Reset Register
Advertised Ability Register
Reserved
Link Partner Advertised Ability Register
Reserved
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Table 6-59. EMIC Control Registers
HEX ADDRESS
ACRONYM
02C0 8A00
IDVER
REGISTER NAME
02C0 8A04
SOFT_RESET
Software Reset Register
02C0 8A08
EM_CONTROL
Emulation Control Register
02C0 8A0C
INT_CONTROL
Interrupt Control Register
02C0 8A10
C0_RX_THRESH_EN
02C0 8A14
C0_RX_EN
Receive Interrupt Enable Register for CorePac0
Transmit Interrupt Enable Register for CorePac0
Identification and Version register
Receive Threshold Interrupt Enable Register for CorePac0
02C0 8A18
C0_TX_EN
02C0 8A1C
C0_MISC_EN
02C0 8A10
C1_RX_THRESH_EN
02C0 8A14
C1_RX_EN
Receive Interrupt Enable Register for CorePac1 (C6657 only)
02C0 8A18
C1_TX_EN
Transmit Interrupt Enable Register for CorePac1 (C6657 only)
02C0 8A1C
C1_MISC_EN
02C0 8A90
C0_RX_THRESH_STAT
02C0 8A94
C0_RX_STAT
Receive Interrupt Masked Interrupt Status Register for CorePac0
02C0 8A98
C0_TX_STAT
Transmit Interrupt Masked Interrupt Status Register for CorePac0
02C0 8A9C
C0_MISC_STAT
02C0 8AA0
C1_RX_THRESH_STAT
02C0 8AA4
C1_RX_STAT
Receive Interrupt Masked Interrupt Status Register for CorePac1 (C6657 only)
02C0 8AA8
C1_TX_STAT
Transmit Interrupt Masked Interrupt Status Register for CorePac1 (C6657 only)
02C0 8AAC
C1_MISC_STAT
02C0 8B10
C0_RX_IMAX
Receive Interrupts Per Millisecond for CorePac0
02C0 8B14
C0_TX_IMAX
Transmit Interrupts Per Millisecond for CorePac0
02C0 8B18
C1_RX_IMAX
Receive Interrupts Per Millisecond for CorePac1 (C6657 only)
02C0 8B1C
C1_TX_IMAX
Transmit Interrupts Per Millisecond for CorePac1 (C6657 only)
Misc Interrupt Enable Register for CorePac0
Receive Threshold Interrupt Enable Register for CorePac1 (C6657 only)
Misc Interrupt Enable Register for CorePac1 (C6657 only)
Receive Threshold Masked Interrupt Status Register for CorePac0
Misc Interrupt Masked Interrupt Status Register for CorePac0
Receive Threshold Masked Interrupt Status Register for CorePac1 (C6657
only)
Misc Interrupt Masked Interrupt Status Register for CorePac1 (C6657 only)
6.15.3 EMAC Electrical Data/Timing (SGMII)
The Hardware Design Guide for KeyStone Devices specifies a complete EMAC and SGMII interface
solution for the C665x as well as a list of compatible EMAC and SGMII devices. TI has performed the
simulation and system characterization to ensure all EMAC and SGMII interface timings in this solution
are met; therefore, no electrical data/timing information is supplied here for this interface.
NOTE
TI supports only designs that follow the board design guidelines outlined in the application
report.
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6.16 Management Data Input/Output (MDIO)
The management data input/output (MDIO) module implements the 802.3 serial management interface to
interrogate and control up to 32 Ethernet PHY(s) connected to the device, using a shared 2-wire bus.
Application software uses the MDIO module to configure the auto-negotiation parameters of each PHY
attached to the GbE switch subsystem, retrieve the negotiation results, and configure required parameters
in the GbE switch subsystem module for correct operation. The module is designed to allow almost
transparent operation of the MDIO interface, with very little maintenance from the core processor. For
more information, see the Gigabit Ethernet (GbE) Subsystem for KeyStone Devices User's Guide.
The EMAC control module is the main interface between the device core processor, the MDIO module,
and the EMAC module. The relationship between these three components is shown in Figure 6-24.
For more detailed information on the EMAC/MDIO, see Gigabit Ethernet (GbE) Subsystem for KeyStone
Devices User's Guide.
6.16.1 MDIO Peripheral Registers
The memory map of the MDIO is shown in Table 6-60.
Table 6-60. MDIO Registers
HEX ADDRESS
ACRONYM
02C0 8800
VERSION
MDIO Version Register
02C0 8804
CONTROL
MDIO Control Register
02C0 8808
ALIVE
MDIO PHY Alive Status Register
02C0 880C
LINK
MDIO PHY Link Status Register
02C0 8810
LINKINTRAW
02C0 8814
LINKINTMASKED
02C0 8818 - 02C0 881C
-
02C0 8820
USERINTRAW
REGISTER NAME
MDIO link Status Change Interrupt (unmasked) Register
MDIO link Status Change Interrupt (masked) Register
Reserved
MDIO User Command Complete Interrupt (Unmasked) Register
02C0 8824
USERINTMASKED
MDIO User Command Complete Interrupt (Masked) Register
02C0 8828
USERINTMASKSET
MDIO User Command Complete Interrupt Mask Set Register
02C0 882C
USERINTMASKCLEAR
MDIO User Command Complete Interrupt Mask Clear Register
02C0 8830 - 02C0 887C
-
02C0 8880
USERACCESS0
MDIO User Access Register 0
02C0 8884
USERPHYSEL0
MDIO User PHY Select Register 0
02C0 8888
USERACCESS1
MDIO User Access Register 1
02C0 888C
USERPHYSEL1
MDIO User PHY Select Register 1
02C0 8890 - 02C0 8FFF
-
154
Detailed Description
Reserved
Reserved
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6.17 Timers
The timers can be used to: time events, count events, generate pulses, interrupt the CPU and send
synchronization events to the EDMA3 channel controller.
6.17.1 Timers Device-Specific Information
The C665x devices have eight (C6657) or seven (C6655) 64-bit timers in total. On the C6657, Timer0 and
Timer1 are dedicated to each of the two CorePacs as a watchdog timer and can also be used as generalpurpose timers. Each of the other six timers can also be configured as a general-purpose timer only, with
each timer programmed as a 64-bit timer or as two separate 32-bit timers. On the C6655, Timer0 is
dedicated to the CorePac as a watchdog timer and can also be used as a general-purpose timer. Each of
the other six timers can also be configured as a general-purpose timer only, programmed as a 64-bit timer
or as two separate 32-bit timers.
When operating in 64-bit mode, the timer counts either VBUS clock cycles or input (TINPLx) pulses (rising
edge) and generates an output pulse/waveform (TOUTLx) plus an internal event (TINTLx) on a softwareprogrammable period.
When operating in 32-bit mode, the timer is split into two independent 32-bit timers. Each timer is made up
of two 32-bit counters: a high counter and a low counter. The timer pins, TINPLx and TOUTLx are
connected to the low counter. The timer pins, TINPHx and TOUTHx are connected to the high counter.
When operating in watchdog mode, the timer counts down to 0 and generates an event. It is a
requirement that software writes to the timer before the count expires, after which the count begins again.
If the count ever reaches 0, the timer event output is asserted. Reset initiated by a watchdog timer can be
set by programming Section 6.6.2.6 and the type of reset initiated can set by programming
Section 6.6.2.8. For more information, see the 64-bit Timer (Timer 64) for KeyStone Devices User's Guide.
6.18 Semaphore2
The device contains an enhanced semaphore module for the management of shared resources of the
DSP C66x CorePac. The semaphore enforces atomic accesses to shared chip-level resources so that the
read-modify-write sequence is not broken. The semaphore module has a unique interrupt to the CorePac
to identify when the core has acquired the resource.
Semaphore resources within the module are not tied to specific hardware resources. It is a software
requirement to allocate semaphore resources to the hardware resource(s) to be arbitrated.
The semaphore module supports 8(C6655) or 2(C6657) masters and contains 32 semaphores to be used
within the system.
The Semaphore module is accessible only by masters with privilege ID (privID) 0(C6655) or 0 to
1(C6657), which means only CorePac 0 (C6655) or 0 to 1(C6657) or the EDMA transactions initiated by
CorePac 0(C6655) or 0 to 1(C6657) can access the Semaphore module.
There are two methods of accessing a semaphore resource:
•
•
Direct Access: A core directly accesses a semaphore resource. If free, the semaphore will be granted. If not, the
semaphore is not granted.
Indirect Access: A core indirectly accesses a semaphore resource by writing it. Once it is free, an interrupt
notifies the CPU that it is available.
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6.19 Multichannel Buffered Serial Port (McBSP)
The McBSP provides these functions:
•
•
•
•
•
•
Full-duplex communication
Double-buffered data registers, which allow a continuous data stream
Independent framing and clocking for receive and transmit
Direct interface to industry-standard codecs, analog interface chips (AICs), and other serially connected analog-todigital (A/D) and digital-to-analog (D/A) devices
External shift clock or an internal, programmable frequency shift clock for data transfer
Transmit and receive FIFO buffers allow the McBSP to operate at a higher sample rate by making it more tolerant
to DMA latency
If an internal clock source is used, the CLKGDV field of the Sample Rate Generator Register (SRGR)
must always be set to a value of 1 or greater.
The McBSP implementation on this device does not support the GPIO option on these pins.
For more information, see the Multichannel Buffered Serial Port (McBSP) for KeyStone Devices User's
Guide.
6.19.1 McBSP Peripheral Register
Table 6-61 describes the McBSP registers.
Table 6-61. McBSP/FIFO Registers
MCBSP0
BYTE ADDRESS
McBSP1
BYTE ADDRESS ACRONYM
0x021B 4000
0x021B 8000
DRR
McBSP Data Receive Register (read-only)
0x021B 4004
0x021B 8004
DXR
McBSP Data Transmit Register
0x021B 4008
0x021B 8008
SPCR
McBSP Serial Port Control Register
0x021B 400C
0x021B 800C
RCR
McBSP Receive Control Register
0x021B 4010
0x021B 8010
XCR
McBSP Transmit Control Register
0x021B 4014
0x021B 8014
SRGR
McBSP Sample Rate Generator register
0x021B 4018
0x021B 8018
MCR
McBSP Multichannel Control Register
0x021B 401C
0x021B 801C
RCERE0
McBSP Enhanced Receive Channel Enable Register 0 Partition A/B
0x021B 4020
0x021B 8020
XCERE0
McBSP Enhanced Transmit Channel Enable Register 0 Partition A/B
0x021B 4024
0x021B 8024
PCR
McBSP Pin Control Register
0x021B 4028
0x021B 8028
RCERE1
McBSP Enhanced Receive Channel Enable Register 1 Partition C/D
0x021B 402C
0x021B 802C
XCERE1
McBSP Enhanced Transmit Channel Enable Register 1 Partition C/D
0x021B 4030
0x021B 8030
RCERE2
McBSP Enhanced Receive Channel Enable Register 2 Partition E/F
0x021B 4034
0x021B 8034
XCERE2
McBSP Enhanced Transmit Channel Enable Register 2 Partition E/F
0x021B 4038
0x021B 8038
RCERE3
McBSP Enhanced Receive Channel Enable Register 3 Partition G/H
0x021B 403C
0x021B 803C
XCERE3
McBSP Enhanced Transmit Channel Enable Register 3 Partition G/H
0x021B 6000
0x021B A000
BFIFOREV
BFIFO Revision Identification Register
0x021B 6010
0x021B A010
WFIFOCTL
Write FIFO Control Register
0x021B 6014
0x021B A014
WFIFOSTS
Write FIFO Status Register
0x021B 6018
0x021B A018
RFIFOCTL
Read FIFO Control Register
0x021B 601C
0x021B A01C
RFIFOSTS
Read FIFO Status Register
0x2200 0000
0x2240 0000
RBUF
McBSP FIFO Receive Buffer
0x2200 0000
0x2240 0000
XBUF
McBSP FIFO Transmit Buffer
REGISTER DESCRIPTION
McBSP Registers
McBSP FIFO Control and Status Registers
McBSP FIFO Data Registers
156
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6.20 Universal Parallel Port (uPP)
The universal parallel port (uPP) peripheral is a multichannel, high-speed parallel interface with dedicated
data lines and minimal control signals. It is designed to interface cleanly with high-speed analog-to-digital
converters (ADCs) or digital-to-analog converters (DACs) with up to 16-bits of data width (per channel). It
may also be interconnected with field-programmable gate arrays (FPGAs) or other uPP devices to achieve
high-speed digital data transfer. It can operate in receive mode, transmit mode, or duplex mode, in which
its individual channels operate in opposite directions.
The uPP peripheral includes an internal DMA controller to maximize throughput and minimize CPU
overhead during high-speed data transmission. All uPP transactions use the internal DMA to provide data
to or retrieve data from the I/O channels. The DMA controller includes two DMA channels, which typically
service separate I/O channels. The uPP peripheral also supports data interleave mode, in which all DMA
resources service a single I/O channel. In this mode, only one I/O channel may be used.
The features of the uPP include:
•
•
•
•
•
•
•
Programmable data width per channel (from 8 bits to 16 bits inclusive)
Programmable data justification
– Right-justify with 0 extend
– Right-justify with sign extend
– Left-justify with 0 fill
Supports multiplexing of interleaved data during SDR transmit
Optional frame Start signal with programmable polarity
Optional data ENABLE signal with programmable polarity
Optional synchronization WAIT signal with programmable polarity
Single Data Rate (SDR) or Double Data Rate (DDR, interleaved) interface
– Supports multiplexing of interleaved data during SDR transmit
– Supports demultiplexing and multiplexing of interleaved data during DDR transfers
For more information, see the Universal Parallel Port (uPP) for KeyStone Devices User's Guide.
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6.20.1 uPP Register Descriptions
Table 6-62. Universal Parallel Port (uPP) Registers
BYTE ADDRESS
ACRONYM
REGISTER DESCRIPTION
0x0258 0000
UPPID
uPP Peripheral Identification Register
0x0258 0004
UPPCR
uPP Peripheral Control Register
0x0258 0008
UPDLB
uPP Digital Loopback Register
0x0258 0010
UPCTL
uPP Channel Control Register
0x0258 0014
UPICR
uPP Interface Configuration Register
0x0258 0018
UPIVR
uPP Interface Idle Value Register
0x0258 001C
UPTCR
uPP Threshold Configuration Register
0x0258 0020
UPISR
uPP Interrupt Raw Status Register
0x0258 0024
UPIER
uPP Interrupt Enabled Status Register
0x0258 0028
UPIES
uPP Interrupt Enable Set Register
0x0258 002C
UPIEC
uPP Interrupt Enable Clear Register
0x0258 0030
UPEOI
uPP End-of-Interrupt Register
0x0258 0040
UPID0
uPP DMA Channel I Descriptor 0 Register
0x0258 0044
UPID1
uPP DMA Channel I Descriptor 1 Register
0x0258 0048
UPID2
uPP DMA Channel I Descriptor 2 Register
0x0258 0050
UPIS0
uPP DMA Channel I Status 0 Register
0x0258 0054
UPIS1
uPP DMA Channel I Status 1 Register
0x0258 0058
UPIS2
uPP DMA Channel I Status 2 Register
0x0258 0060
UPQD0
uPP DMA Channel Q Descriptor 0 Register
0x0258 0064
UPQD1
uPP DMA Channel Q Descriptor 1 Register
0x0258 0068
UPQD2
uPP DMA Channel Q Descriptor 2 Register
0x0258 0070
UPQS0
uPP DMA Channel Q Status 0 Register
0x0258 0074
UPQS1
uPP DMA Channel Q Status 1 Register
0x0258 0078
UPQS2
uPP DMA Channel Q Status 2 Register
6.21 Serial RapidIO (SRIO) Port
The SRIO port is a high-performance, low pin-count interconnect aimed for embedded markets. The use
of the RapidIO interconnect in a baseband board design can create a homogeneous interconnect
environment, providing even more connectivity and control among the components. RapidIO is based on
the memory and device addressing concepts of processor buses where the transaction processing is
managed completely by hardware. This enables the RapidIO interconnect to lower the system cost by
providing lower latency, reduced overhead of packet data processing, and higher system bandwidth, all of
which are key for wireless interfaces. For more information, see the Serial RapidIO (SRIO) for KeyStone
Devices User's Guide in Section 10.3.
158
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6.22 Turbo Decoder Coprocessor (TCP3d)
The C6655 and C6657 have one high-performance embedded Turbo-Decoder Coprocessor (TCP3d) that
significantly speeds up channel-decoding operations on-chip for WCDMA, HSPA, HSPA+, TD-SCDMA,
LTE, and WiMAX. Operating at CPU clock divided-by-2, the TCP3d is capable of processing data
channels at a throughput of >100 Mbps. For more information, see the Turbo Decoder Coprocessor 3
(TCP3d) for KeyStone Devices User's Guide in Section 10.3.
6.23 Enhanced Viterbi-Decoder Coprocessor (VCP2)
The devices have two high-performance embedded Viterbi Decoder Coprocessors (VCP2) that
significantly speed up channel-decoding operations on-chip. Each VCP2, operating at CPU clock dividedby-3, can decode more than 694 7.95-Kbps adaptive multi-rate (AMR) [K = 9, R = 1/3] voice channels.
The VCP2 supports constraint lengths K = 5, 6, 7, 8, and 9, rates R = 3/4, 1/2, 1/3, 1/4, and 1/5, and
flexible polynomials, while generating hard decisions or soft decisions. Communications between the
VCP2 and the CPU are carried out through the EDMA3 controller.
The VCP2 supports:
•
•
•
•
•
•
•
•
•
•
Unlimited frame sizes
Code rates 3/4, 1/2, 1/3, 1/4, and 1/5
Constraint lengths 5, 6, 7, 8, and 9
Programmable encoder polynomials
Programmable reliability and convergence lengths
Hard and soft decoded decisions
Tail and convergent modes
Yamamoto logic
Tail biting logic
Various input and output FIFO lengths
For more information, see the Viterbi Coprocessor (VCP2) for KeyStone Devices User's Guide in
Section 10.3.
6.24 Emulation Features and Capability
6.24.1 Advanced Event Triggering (AET)
The C665x device supports advanced event triggering (AET). This capability can be used to debug
complex problems as well as understand performance characteristics of user applications. AET provides
the following capabilities:
•
•
•
•
Hardware Program Breakpoints: specify addresses or address ranges that can generate events such as halting
the processor or triggering the trace capture.
Data Watchpoints: specify data variable addresses, address ranges, or data values that can generate events
such as halting the processor or triggering the trace capture.
Counters: count the occurrence of an event or cycles for performance monitoring.
State Sequencing: allows combinations of hardware program breakpoints and data watchpoints to precisely
generate events for complex sequences.
For more information on AET, see the following documents in Section 10.3:
•
•
Using Advanced Event Triggering to Find and Fix Intermittent Real-Time Bugs
Using Advanced Event Triggering to Debug Real-Time Problems in High Speed Embedded Microprocessor
Systems
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6.24.2 Trace
The C665x device supports trace. Trace is a debug technology that provides a detailed, historical account
of application code execution, timing, and data accesses. Trace collects, compresses, and exports debug
information for analysis. Trace works in real-time and does not impact the execution of the system.
For more information on board design guidelines for trace advanced emulation, see the 60-Pin Emulation
Header Technical Reference.
6.24.3 IEEE 1149.1 JTAG
The JTAG interface is used to support boundary scan and emulation of the device. The boundary scan
supported allows for an asynchronous TRST and only the 5 baseline JTAG signals (for example, no
EMU[1:0]) required for boundary scan. Most interfaces on the device follow the Boundary Scan Test
Specification (IEEE1149.1), while all of the SerDes (SRIO and SGMII) support the AC-coupled net test
defined in AC-Coupled Net Test Specification (IEEE1149.6).
It is expected that all compliant devices are connected through the same JTAG interface, in daisy-chain
fashion, in accordance with the specification. The JTAG interface uses 1.8-V LVCMOS buffers, compliant
with the Power Supply Voltage and Interface Standard for Nonterminated Digital Integrated Circuit
Specification (EAI/JESD8-5).
6.24.3.1 IEEE 1149.1 JTAG Compatibility Statement
For maximum reliability, the C665x DSP includes an internal pulldown (IPD) on the TRST pin to ensure
that TRST will always be asserted upon power up and the internal emulation logic of the DSP will always
be properly initialized when this pin is not routed out. JTAG controllers from Texas Instruments actively
drive TRST high. However, some third-party JTAG controllers may not drive TRST high but expect the use
of an external pullup resistor on TRST. When using this type of JTAG controller, assert TRST to initialize
the DSP after power up and externally drive TRST high before attempting any emulation or boundary scan
operations.
6.25 DSP Core Description
The C66x DSP extends the performance of the C64x+ and C674x DSPs through enhancements and new
features. Many of the new features target increased performance for vector processing. The C64x+ and
C674x DSPs support 2-way SIMD operations for 16-bit data and 4-way SIMD operations for 8-bit data. On
the C66x DSP, the vector processing capability is improved by extending the width of the SIMD
instructions. C66x DSPs can execute instructions that operate on 128-bit vectors. For example the
QMPY32 instruction is able to perform the element-to-element multiplication between two vectors of four
32-bit data each. The C66x DSP also supports SIMD for floating-point operations. Improved vector
processing capability (each instruction can process multiple data in parallel) combined with the natural
instruction level parallelism of C6000 architecture (for example, execution of up to 8 instructions per cycle)
results in a very high level of parallelism that can be exploited by DSP programmers through the use of
TI's optimized C/C++ compiler.
The C66x DSP consists of eight functional units, two register files, and two data paths as shown in
Figure 6-25. The two general-purpose register files (A and B) each contain 32 32-bit registers for a total of
64 registers. The general-purpose registers can be used for data or can be data address pointers. The
data types supported include packed 8-bit data, packed 16-bit data, 32-bit data, 40-bit data, and 64-bit
data. Multiplies also support 128-bit data. 40-bit-long or 64-bit-long values are stored in register pairs, with
the 32 LSBs of data placed in an even register and the remaining 8 or 32 MSBs in the next upper register
(which is always an odd-numbered register). 128-bit data values are stored in register quadruplets, with
the 32 LSBs of data placed in a register that is a multiple of 4 and the remaining 96 MSBs in the next 3
upper registers.
160
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The eight functional units (.M1, .L1, .D1, .S1, .M2, .L2, .D2, and .S2) are each capable of executing one
instruction every clock cycle. The .M functional units perform all multiply operations. The .S and .L units
perform a general set of arithmetic, logical, and branch functions. The .D units primarily load data from
memory to the register file and store results from the register file into memory.
Each C66x .M unit can perform one of the following fixed-point operations each clock cycle: four 32 × 32
bit multiplies, sixteen 16 × 16 bit multiplies, four 16 × 32 bit multiplies, four 8 × 8 bit multiplies, four 8 × 8
bit multiplies with add operations, and four 16 × 16 multiplies with add/subtract capabilities. There is also
support for Galois field multiplication for 8-bit and 32-bit data. Many communications algorithms such as
FFTs and modems require complex multiplication. Each C66x .M unit can perform one 16 × 16 bit
complex multiply with or without rounding capabilities, two 16 × 16 bit complex multiplies with rounding
capability, and a 32 × 32 bit complex multiply with rounding capability. The C66x can also perform two 16
× 16 bit and one 32 × 32 bit complex multiply instructions that multiply a complex number with a complex
conjugate of another number with rounding capability. Communication signal processing also requires an
extensive use of matrix operations. Each C66x .M unit is capable of multiplying a [1 × 2] complex vector
by a [2 × 2] complex matrix per cycle with or without rounding capability. A version also exists allowing
multiplication of the conjugate of a [1 × 2] vector with a [2 × 2] complex matrix.
Each C66x .M unit also includes IEEE floating-point multiplication operations from the C674x DSP, which
includes one single-precision multiply each cycle and one double-precision multiply every 4 cycles. There
is also a mixed-precision multiply that allows multiplication of a single-precision value by a doubleprecision value and an operation allowing multiplication of two single-precision numbers resulting in a
double-precision number. The C66x DSP improves the performance over the C674x double-precision
multiplies by adding a instruction allowing one double-precision multiply per cycle and also reduces the
number of delay slots from 10 down to 4. Each C66x .M unit can also perform one the following floatingpoint operations each clock cycle: one, two, or four single-precision multiplies or a complex singleprecision multiply.
The .L and .S units can now support up to 64-bit operands. This allows for new versions of many of the
arithmetic, logical, and data packing instructions to allow for more parallel operations per cycle. Additional
instructions were added yielding performance enhancements of the floating point addition and subtraction
instructions, including the ability to perform one double precision addition or subtraction per cycle.
Conversion to/from integer and single-precision values can now be done on both .L and .S units on the
C66x. Also, by taking advantage of the larger operands, instructions were also added to double the
number of these conversions that can be done. The .L unit also has additional instructions for logical AND
and OR instructions, as well as, 90 degree or 270 degree rotation of complex numbers (up to two per
cycle). Instructions have also been added that allow for the computing the conjugate of a complex
number.
The MFENCE instruction is a new instruction introduced on the C66x DSP. This instruction will create a
DSP stall until the completion of all the DSP-triggered memory transactions, including:
•
•
•
•
•
•
Cache line fills
Writes from L1D to L2 or from the CorePac to MSMC and/or other system endpoints
Victim write backs
Block or global coherence operations
Cache mode changes
Outstanding XMC prefetch requests
This is useful as a simple mechanism for programs to wait for these requests to reach their endpoint. It
also ensures ordering for writes arriving at a single endpoint through multiple paths, multiprocessor
algorithms that depend on ordering, and manual coherence operations.
For more details on the C66x DSP and its enhancements over the C64x+ and C674x architectures, see
the following documents:
•
•
•
C66x CPU and Instruction Set Reference Guide
C66x DSP Cache User's Guide
C66x CorePac User's Guide
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Figure 6-25 shows the DSP core functional units and data paths.
Note:
Default bus width
is 64 bits
(that is, a register pair)
src1
.L1
Register
File A
(A0, A1, A2,
...A31)
src2
dst
ST1
src1
.S1
src2
dst
src1
src1_hi
Data Path A
.M1
src2
src2_hi
dst2
dst1
LD1
32
src1
DA1
32
.D1
dst
32
src2
32
32
2
1
src2
DA2
32
.D2
dst
src1
Register
File B
(B0, B1, B2,
...B31)
32
32
32
32
32
LD2
dst1
dst2
src2_hi
.M2
src2
src1_hi
src1
Data Path B
dst
.S2
src2
src1
ST2
dst
.L2
src2
src1
32
Control
Register
32
Figure 6-25. DSP Core Data Paths
162
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6.26 Memory Map Summary
Table 6-63 shows the memory map address ranges of the C665x device.
Table 6-63. Memory Map Summary
LOGICAL 32-BIT ADDRESS
PHYSICAL 36-BIT
ADDRESS
START
END
START
END
BYTES
DESCRIPTION
00000000
007FFFFF
0 00000000
0 007FFFFF
8M
Reserved
00800000
008FFFFF
0 00800000
0 008FFFFF
1M
Local L2 SRAM
00900000
00DFFFFF
0 00900000
0 00DFFFFF
5M
Reserved
00E00000
00E07FFF
0 00E00000
0 00E07FFF
32K
Local L1P SRAM
00E08000
00EFFFFF
0 00E08000
0 00EFFFFF
1M-32K
Reserved
00F00000
00F07FFF
0 00F00000
0 00F07FFF
32K
Local L1D SRAM
00F08000
017FFFFF
0 00F08000
0 017FFFFF
9M-32K
Reserved
01800000
01BFFFFF
0 01800000
0 01BFFFFF
4M
C66x CorePac Registers
01C00000
01CFFFFF
0 01C00000
0 01CFFFFF
1M
Reserved
01D00000
01D0007F
0 01D00000
0 01D0007F
128
Tracer_MSMC_0
01D00080
01D07FFF
0 01D00080
0 01D07FFF
32K-128
Reserved
01D08000
01D0807F
0 01D08000
0 01D0807F
128
Tracer_MSMC_1
01D08080
01D0FFFF
0 01D08080
0 01D0FFFF
32K-128
Reserved
01D10000
01D1007F
0 01D10000
0 01D1007F
128
Tracer_MSMC_2
01D10080
01D17FFF
0 01D10080
0 01D17FFF
32K-128
Reserved
01D18000
01D1807F
0 01D18000
0 01D1807F
128
Tracer_MSMC_3
01D18080
01D1FFFF
0 01D18080
0 01D1FFFF
32K-128
Reserved
01D20000
01D2007F
0 01D20000
0 01D2007F
128
Tracer_QM_DMA
01D20080
01D27FFF
0 01D20080
0 01D27FFF
32K-128
Reserved
01D28000
01D2807F
0 01D28000
0 01D2807F
128
Tracer_DDR
01D28080
01D2FFFF
0 01D28080
0 01D2FFFF
32K-128
Reserved
01D30000
01D3007F
0 01D30000
0 01D3007F
128
Tracer_SM
01D30080
01D37FFF
0 01D30080
0 01D37FFF
32K-128
Reserved
01D38000
01D3807F
0 01D38000
0 01D3807F
128
Tracer_QM_CFG
01D38080
01D3FFFF
0 01D38080
0 01D3FFFF
32K-128
Reserved
01D40000
01D4007F
0 01D40000
0 01D4007F
128
Tracer_CFG
01D40080
01D47FFF
0 01D40080
0 01D47FFF
32K-128
Reserved
01D48000
01D4807F
0 01D48000
0 01D4807F
128
Tracer_L2_0
01D48080
01D4FFFF
0 01D48080
0 01D4FFFF
32K-128
Reserved
01D50000
01D5007F
0 01D50000
0 01D5007F
128
Tracer_L2_1(C6657) or Reserved (C6655)
01D50080
01D57FFF
0 01D50080
0 01D57FFF
32K-128
Reserved
01D58000
01D5807F
0 01D58000
0 01D5807F
128
Tracer_TNet_6P_A
01D58080
021B3FFF
0 01D58080
0 021B3FFF
4464K -128
Reserved
021B4000
021B47FF
0 021B4000
0 021B47FF
2K
McBSP0 Registers
021B4800
021B5FFF
0 021B4800
0 021B5FFF
6K
Reserved
021B6000
021B67FF
0 021B6000
0 021B67FF
2K
McBSP0 FIFO Registers
021B6800
021B7FFF
0 021B6800
0 021B7FFF
6K
Reserved
021B8000
021B87FF
0 021B8000
0 021B87FF
2K
McBSP1 Registers
021B8800
021B9FFF
0 021B8800
0 021B9FFF
6K
Reserved
021BA000
021BA7FF
0 021BA000
0 021BA7FF
2K
McBSP1 FIFO Registers
021BA800
021BFFFF
0 021BA800
0 021BFFFF
22K
Reserved
021C0000
021C03FF
0 021C0000
0 021C03FF
1K
TCP3d Registers
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Table 6-63. Memory Map Summary (continued)
LOGICAL 32-BIT ADDRESS
PHYSICAL 36-BIT
ADDRESS
START
END
START
END
BYTES
DESCRIPTION
021C0400
021CFFFF
0 021C0400
0 021CFFFF
63K
Reserved
021D0000
021D00FF
0 021D0000
0 021D00FF
256
VCP2_A Registers
021D0100
021D3FFF
0 021D0100
0 021D3FFF
16K - 256
Reserved
021D4000
021D40FF
0 021D4000
0 021D40FF
256
VCP2_B Registers
021D4100
021FFFFF
0 021D4100
0 021FFFFF
176K - 256
Reserved
02200000
0220007F
0 02200000
0 0220007F
128
Timer0
02200080
0220FFFF
0 02200080
0 0220FFFF
64K-128
Reserved
02210000
0221007F
0 02210000
0 0221007F
128
Reserved
02210080
0221FFFF
0 02210080
0 0221FFFF
64K-128
Reserved
02220000
0222007F
0 02220000
0 0222007F
128
Timer2
02220080
0222FFFF
0 02220080
0 0222FFFF
64K-128
Reserved
02230000
0223007F
0 02230000
0 0223007F
128
Timer3
02230080
0223FFFF
0 02230080
0 0223FFFF
64K-128
Reserved
02240000
0224007F
0 02240000
0 0224007F
128
Timer4
02240080
0224FFFF
0 02240080
0 0224FFFF
64K-128
Reserved
02250000
0225007F
0 02250000
0 0225007F
128
Timer5
02250080
0225FFFF
0 02250080
0 0225FFFF
64K-128
Reserved
02260000
0226007F
0 02260000
0 0226007F
128
Timer6
02260080
0226FFFF
0 02260080
0 0226FFFF
64K-128
Reserved
02270000
0227007F
0 02270000
0 0227007F
128
Timer7
02270080
0230FFFF
0 02270080
0 0230FFFF
640K - 128
Reserved
02310000
023101FF
0 02310000
0 023101FF
512
PLL Controller
02310200
0231FFFF
0 02310200
0 0231FFFF
64K-512
Reserved
02320000
023200FF
0 02320000
0 023200FF
256
GPIO
02320100
0232FFFF
0 02320100
0 0232FFFF
64K-256
Reserved
02330000
023303FF
0 02330000
0 023303FF
1K
SmartReflex
02330400
0234FFFF
0 02330400
0 0234FFFF
127K
Reserved
02350000
02350FFF
0 02350000
0 02350FFF
4K
Power Sleep Controller (PSC)
02351000
0235FFFF
0 02351000
0 0235FFFF
64K-4K
Reserved
02360000
023603FF
0 02360000
0 023603FF
1K
Memory Protection Unit (MPU) 0
02360400
02367FFF
0 02360400
0 02367FFF
31K
Reserved
02368000
023683FF
0 02368000
0 023683FF
1K
Memory Protection Unit (MPU) 1
02368400
0236FFFF
0 02368400
0 0236FFFF
31K
Reserved
02370000
023703FF
0 02370000
0 023703FF
1K
Memory Protection Unit (MPU) 2
02370400
02377FFF
0 02370400
0 02377FFF
31K
Reserved
02378000
023783FF
0 02378000
0 023783FF
1K
Memory Protection Unit (MPU) 3
02378400
0237FFFF
0 02378400
0 0237FFFF
31K
Reserved
02380000
023803FF
0 02380000
0 023803FF
1K
Memory Protection Unit (MPU) 4
02380400
023FFFFF
0 02380400
0 023FFFFF
511K
Reserved
02440000
02443FFF
0 02440000
0 02443FFF
16K
DSP trace formatter 0
02444000
0244FFFF
0 02444000
0 0244FFFF
48K
Reserved
02450000
02453FFF
0 02450000
0 02453FFF
16K
DSP trace formatter 1 (C6657) or Reserved (C6655)
02454000
02521FFF
0 02454000
0 02521FFF
824K
Reserved
02522000
02522FFF
0 02522000
0 02522FFF
4K
Efuse
02523000
0252FFFF
0 02523000
0 0252FFFF
52K
Reserved
02530000
0253007F
0 02530000
0 0253007F
128
I2C data and control
164
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Table 6-63. Memory Map Summary (continued)
LOGICAL 32-BIT ADDRESS
PHYSICAL 36-BIT
ADDRESS
START
END
START
END
BYTES
DESCRIPTION
02530080
0253FFFF
0 02530080
0 0253FFFF
64K-128
Reserved
02540000
0254003F
0 02540000
0 0254003F
64
UART 0
02540400
0254FFFF
0 02540400
0 0254FFFF
64K-64
Reserved
02550000
0255003F
0 02550000
0 0255003F
64
UART 1
02550040
0257FFFF
0 02550040
0 0257FFFF
192K-64
Reserved
02580000
02580FFF
0 02580000
0 02580FFF
4K
uPP
02581000
025FFFFF
0 02581000
0 025FFFFF
508K
Reserved
02600000
02601FFF
0 02600000
0 02601FFF
8K
Chip Interrupt Controller (CIC) 0
02602000
02603FFF
0 02602000
0 02603FFF
8K
Reserved
02604000
02605FFF
0 02604000
0 02605FFF
8K
Chip Interrupt Controller (CIC) 1
02606000
02607FFF
0 02606000
0 02607FFF
8K
Reserved
02608000
02609FFF
0 02608000
0 02609FFF
8K
Chip Interrupt Controller (CIC) 2
0260A000
0261FFFF
0 0260A000
0 0261FFFF
88K
Reserved
02620000
026207FF
0 02620000
0 026207FF
2K
Chip-Level Registers
02620800
0263FFFF
0 02620800
0 0263FFFF
126K
Reserved
02640000
026407FF
0 02640000
0 026407FF
2K
Semaphore
02640800
0273FFFF
0 02640800
0 0273FFFF
1022K
Reserved
02740000
02747FFF
0 02740000
0 02747FFF
32K
EDMA Channel Controller (EDMA3CC)
02748000
0278FFFF
0 02748000
0 0278FFFF
288K
Reserved
02790000
027903FF
0 02790000
0 027903FF
1K
EDMA3CC Transfer Controller EDMA3TC0
02790400
02797FFF
0 02790400
0 02797FFF
31K
Reserved
02798000
027983FF
0 02798000
0 027983FF
1K
EDMA3CC Transfer Controller EDMA3TC1
02798400
0279FFFF
0 02798400
0 0279FFFF
31K
Reserved
027A0000
027A03FF
0 027A0000
0 027A03FF
1K
EDMA3CC Transfer Controller EDMA3TC2
027A0400
027A7FFF
0 027A0400
0 027A7FFF
31K
Reserved
027A8000
027A83FF
0 027A8000
0 027A83FF
1K
EDMA3CC Transfer Controller EDMA3TC3
027A8400
027CFFFF
0 027A8400
0 027CFFFF
159K
Reserved
027D0000
027D0FFF
0 027D0000
0 027D0FFF
4K
TI embedded trace buffer (TETB) - CorePac0
027D1000
027DFFFF
0 027D1000
0 027DFFFF
60K
Reserved
027E0000
027E0FFF
0 027E0000
0 027E0FFF
4K
TI embedded trace buffer (TETB) - CorePac1 (C6657) or
Reserved (C6655)
027E1000
0284FFFF
0 027E1000
0 0284FFFF
444K
Reserved
02850000
02857FFF
0 02850000
0 02857FFF
32K
TI embedded trace buffer (TETB) — system
02858000
028FFFFF
0 02858000
0 028FFFFF
672K
Reserved
02900000
02920FFF
0 02900000
0 02920FFF
132K
Serial RapidIO (SRIO) configuration
02921000
029FFFFF
0 02921000
0 029FFFFF
1M-132K
Reserved
02A00000
02AFFFFF
0 02A00000
0 02AFFFFF
1M
Queue manager subsystem configuration
02B00000
02C07FFF
0 02B00000
0 02C07FFF
1056K
Reserved
02C08000
02C8BFFF
0 02C08000
0 02C8BFFF
16K
EMAC subsystem configuration
02C0C000
07FFFFFF
0 02C0C000
0 07FFFFFF
84M - 48K
Reserved
08000000
0800FFFF
0 08000000
0 0800FFFF
64K
Extended memory controller (XMC) configuration
08010000
0BBFFFFF
0 08010000
0 0BBFFFFF
60M-64K
Reserved
0BC00000
0BCFFFFF
0 0BC00000
0 0BCFFFFF
1M
Multicore shared memory controller (MSMC) config
0BD00000
0BFFFFFF
0 0BD00000
0 0BFFFFFF
3M
Reserved
0C000000
0C0FFFFF
0 0C000000
0 0C0FFFFF
1M
Multicore shared memory (MSM)
0C200000
107FFFFF
0 0C100000
0 107FFFFF
71 M
Reserved
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Table 6-63. Memory Map Summary (continued)
LOGICAL 32-BIT ADDRESS
PHYSICAL 36-BIT
ADDRESS
START
END
START
END
BYTES
DESCRIPTION
10800000
108FFFFF
0 10800000
0 108FFFFF
1M
CorePac0 L2 SRAM
10900000
10DFFFFF
0 10900000
0 10DFFFFF
5M
Reserved
10E00000
10E07FFF
0 10E00000
0 10E07FFF
32K
CorePac0 L1P SRAM
10E08000
10EFFFFF
0 10E08000
0 10EFFFFF
1M-32K
Reserved
10F00000
10F07FFF
0 10F00000
0 10F07FFF
32K
CorePac0 L1D SRAM
10F08000
117FFFFF
0 10F08000
0 117FFFFF
9M-32K
Reserved
11800000
118FFFFF
0 11800000
0 118FFFFF
1M
CorePac1 L2 SRAM (C6657) or Reserved (C6655)
11900000
11DFFFFF
0 11900000
0 11DFFFFF
5M
Reserved
11E00000
11E07FFF
0 11E00000
0 11E07FFF
32K
CorePac1 L1P SRAM (C6657) or Reserved (C6655)
11E08000
11EFFFFF
0 11E08000
0 11EFFFFF
1M-32K
Reserved
11F00000
11F07FFF
0 11F00000
0 11F07FFF
32K
CorePac1 L1D SRAM (C6657) or Reserved (C6655)
11F08000
1FFFFFFF
0 11F08000
0 1FFFFFFF
225M-32K
Reserved
20000000
200FFFFF
0 20000000
0 200FFFFF
1M
System trace manager (STM) configuration
20100000
207FFFFF
0 20100000
0 207FFFFF
7M
Reserved
20800000
208FFFFF
0 20080000
0 208FFFFF
1M
TCP3d Data
20900000
20AFFFFF
0 20900000
0 20AFFFFF
2M
Reserved
20B00000
20B1FFFF
0 20B00000
0 20B1FFFF
128K
Boot ROM
20B20000
20BEFFFF
0 20B20000
0 20BEFFFF
832K
Reserved
20BF0000
20BF01FF
0 20BF0000
0 20BF01FF
512
SPI
20BF0400
20BFFFFF
0 20BF0200
0 20BFFFFF
64K -512
Reserved
20C00000
20C000FF
0 20C00000
0 20C000FF
256
EMIF16 configuration
20C00100
20FFFFFF
0 20C00100
0 20FFFFFF
4M - 256
Reserved
21000000
210001FF
1 00000000
1 000001FF
512
DDR3 EMIF configuration
21000200
213FFFFF
0 21000200
0 213FFFFF
4M-512
Reserved
21400000
214000FF
0 21400000
0 214000FF
256
HyperLink config
21400100
217FFFFF
0 21400100
0 217FFFFF
4M-256
Reserved
21800000
21807FFF
0 21800000
0 21807FFF
32K
PCIe config
21808000
33FFFFFF
0 21808000
0 33FFFFFF
8M-32K
Reserved
22000000
22000FFF
0 22000000
0 22000FFF
4K
McBSP0 FIFO Data
22000100
223FFFFF
0 22000100
0 223FFFFF
4M-4K
Reserved
22400000
22400FFF
0 22400000
0 22400FFF
4K
McBSP1 FIFO Data
22400100
229FFFFF
0 22400100
0 229FFFFF
6M-4K
Reserved
22A00000
22A0FFFF
0 22A00000
0 22A0FFFF
64K
VCP2_A
22A01000
22AFFFFF
0 22A01000
0 22AFFFFF
1M-64K
Reserved
22B00000
22B0FFFF
0 22B00000
0 22B0FFFF
64K
VCP2_B
22B01000
33FFFFFF
0 22B01000
0 33FFFFFF
277M-64K
Reserved
34000000
341FFFFF
0 34000000
0 341FFFFF
2M
Queue manager subsystem data
34200000
3FFFFFFF
0 34200000
0 3FFFFFFF
190M
Reserved
40000000
4FFFFFFF
0 40000000
0 4FFFFFFF
256M
HyperLink data
50000000
5FFFFFFF
0 50000000
0 5FFFFFFF
256M
Reserved
60000000
6FFFFFFF
0 60000000
0 6FFFFFFF
256M
PCIe data
166
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Table 6-63. Memory Map Summary (continued)
LOGICAL 32-BIT ADDRESS
PHYSICAL 36-BIT
ADDRESS
START
END
START
END
BYTES
DESCRIPTION
70000000
73FFFFFF
0 70000000
0 73FFFFFF
64M
EMIF16 CE0 data space, supports NAND, NOR, or SRAM
memory (1)
74000000
77FFFFFF
0 74000000
0 77FFFFFF
64M
EMIF16 CE1 data space, supports NAND, NOR, or SRAM
memory (1)
78000000
7BFFFFFF
0 78000000
0 7BFFFFFF
64M
EMIF16 CE2 data space, supports NAND, NOR, or SRAM
memory (1)
7C000000
7FFFFFFF
0 7C000000
0 7FFFFFFF
64M
EMIF16 CE3 data space, supports NAND, NOR or SRAM
memory (1)
80000000
FFFFFFFF
8 00000000
8 7FFFFFFF
2G
DDR3 EMIF data (2)
(1)
(2)
32MB per chip select for 16-bit NOR and SRAM. 16MB per chip select for 8-bit NOR and SRAM. The 32MB and 16MB size restrictions
do not apply to NAND.
The memory map only shows the default MPAX configuration of DDR3 memory space. For the extended DDR3 memory space access
(up to 4GB), see the MPAX configuration details in C66x CorePac User's Guide and Multicore Shared Memory Controller (MSMC) for
KeyStone Devices User's Guide in Section 10.3.
6.27 Boot Sequence
The boot sequence is a process by which the DSP's internal memory is loaded with program and data
sections. The DSP's internal registers are programmed with predetermined values. The boot sequence is
started automatically after each power-on reset, warm reset, and system reset. A local reset to an
individual C66x CorePac should not affect the state of the hardware boot controller on the device. For
more details on the initiators of the resets, see Section 6.5. The bootloader uses a section of the L2
SRAM (start address 0x008EFD00 and end address 0x008F FFFF) during initial booting of the device. For
more details on the type of configurations stored in this reserved L2 section see the Bootloader for the
C66x DSP User's Guide.
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6.28 Boot Modes Supported and PLL Settings
The device supports several boot processes, which leverage the internal boot ROM. Most boot processes
are software driven, using the BOOTMODE[2:0] device configuration inputs to determine the software
configuration that must be completed. From a hardware perspective, there are two possible boot modes:
•
ROM Boot - C66x CorePac0 is released from reset and begins executing from the L3 ROM base address. After
performing the boot process (for example, from I2C ROM, Ethernet, or RapidIO), C66x CorePac0 then begins
execution from the provided boot entry point. For C6657 only, the other C66x CorePac is released from reset and
begins executing an IDLE from the L3 ROM. It is then released from IDLE based on interrupts generated by C66x
CorePac0. See the Bootloader for the C66x DSP User's Guide for more details.
The boot process performed by the C66x CorePac0 in ROM boot is determined by the BOOTMODE[12:0]
value in the DEVSTAT register. The C66x CorePac0 reads this value, and then executes the associated
boot process in software. Figure 6-26 shows the bits associated with BOOTMODE[12:0].
Figure 6-26. Boot Mode Pin Decoding
12
11
10
9
2
PLL Mult I C /SPI Ext Dev Cfg
8
7
6
5
4
3
Device Configuration
2
1
0
Boot Device
6.28.1 Boot Device Field
The Boot Device field BOOTMODE[2:0] defines the boot device that is chosen. Table 6-64 shows the
supported boot modes.
Table 6-64. Boot Mode Pins: Boot Device Values
Bit
Field
Description
2-0
Boot Device
Device boot mode
•
0 = EMIF16 / UART / No Boot
•
1 = Serial Rapid I/O
•
2 = Ethernet (SGMII)
•
3 = NAND
•
4 = PCIe
•
5 = I2C
•
6 = SPI
•
7 = HyperLink
168
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6.28.2 Device Configuration Field
The device configuration fields BOOTMODE[9:3] are used to configure the boot peripheral and, therefore,
the bit definitions depend on the boot mode.
6.28.2.1 EMIF16 / UART / No Boot Device Configuration
Figure 6-27. EMIF16 / UART / No Boot Configuration Fields
9
8
7
6
5
Submode Specific Configuration
4
3
Submode
Table 6-65. EMIF16 / UART / No Boot Configuration Field Descriptions
Bit
Field
Description
9-6
Submode
Specific
Configuration
Configures the selected submode. See Section 6.28.2.1.1, Section 6.28.2.1.2, and Section 6.28.2.1.3
5-3
Submode
Submode selection.
•
0 = No boot
•
1 = UART port 0 boot
•
2 - 3 = Reserved
•
4 = EMIF16 boot
•
5 = UART port 1 boot
•
6 - 7 = Reserved
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6.28.2.1.1 No Boot Mode
No boot mode is shown in Figure 6-28 and described in Table 6-66.
Figure 6-28. No Boot Configuration Fields
9
8
7
6
Reserved
Table 6-66. No Boot Configuration Field Descriptions
Bit
Field
Description
9-6
Reserved
Reserved
170
Detailed Description
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6.28.2.1.2 UART Boot Mode
UART boot mode is shown in Figure 6-29 and described in Table 6-67.
Figure 6-29. UART Boot Configuration Fields
9
8
7
Speed
6
Parity
Table 6-67. UART Boot Configuration Field Descriptions
Bit
Field
Description
9-8
Speed
UART interface speed.
•
0 = 115200 baud
•
1 = 38400 baud
•
2 = 19200 baud
•
3 = 9600 baud
7-6
Parity
UART parity used during boot.
•
0 = None
•
1 = Odd
•
2 = Even
•
4 = None
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6.28.2.1.3 EMIF16 Boot Mode
EMIF16 boot mode is shown in Figure 6-30 and described in Table 6-68.
Figure 6-30. EMIF16 Boot Configuration Fields
9
8
Wait Enable
Width Select
7
6
Chip Select
Table 6-68. EMIF16 Boot Configuration Field Descriptions
Bit
Field
Description
9
Wait Enable
Extended Wait mode for EMIF16.
•
0 = Wait enable disabled (EMIF16 submode)
•
1 = Wait enable enabled (EMIF16 submode)
8
Width Select
EMIF data width for EMIF16.
•
0 = 8-bit wide EMIF (EMIF16 submode)
•
1 = 16-bit wide EMIF (EMIF16 submode)
7-6
Chip Select
EMIF Chip Select used during EMIF 16 boot.
•
0 = CS2 (Default)
•
1 = CS3
•
2 = CS4
•
4 = CS5
Note: the Chip Select configuration is currently not available. The device always boots from CS2 (EMIFCE0)
during EMIF16 boot.
172
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6.28.2.2 Serial Rapid I/O Boot Device Configuration
The device ID is always set to 0xff (8-bit node IDs) or 0xffff (16-bit node IDs) at power-on reset.
Figure 6-31. Serial Rapid I/O Device Configuration Fields
9
8
Lane Setup
7
6
Data Rate
5
4
3
Ref Clock
Reserved
Table 6-69. Serial Rapid I/O Configuration Field Descriptions
Bit
Field
Description
9
Lane Setup
SRIO port and lane configuration
•
0 = Port Configured as 4 ports each 1 lane wide (4 -1× ports)
•
1 = Port Configured as 2 ports 2 lanes wide (2 – 2× ports)
8-7
Data Rate
SRIO data rate configuration
•
0 = 1.25 GBaud
•
1 = 2.5 GBaud
•
2 = 3.125 GBaud
•
3 = 5.0 GBaud
6-5
Ref Clock
SRIO reference clock configuration
•
0 = 156.25 MHz
•
1 = 250 MHz
•
2 = 312.5 MHz
•
3 = Reserved
4-3
Reserved
Reserved
In SRIO boot mode, the message mode will be enabled by default. If use of the memory reserved for
received messages is required and reception of messages cannot be prevented, the master can disable
the message mode by writing to the boot table and generating a boot restart.
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6.28.2.3 Ethernet (SGMII) Boot Device Configuration
SGMII boot is shown in Figure 6-32 and described in Table 6-70.
Figure 6-32. Ethernet (SGMII) Device Configuration Fields
9
8
7
SerDes Clock Mult
6
5
4
Ext connection
3
Device ID
Table 6-70. Ethernet (SGMII) Configuration Field Descriptions
Bit
Field
Description
9-8
SerDes Clock Mult
SGMII SerDes input clock. The output frequency of the PLL must be 1.25GB.
•
0 = ×8 for input clock of 156.25 MHz
•
1 = ×5 for input clock of 250 MHz
•
2 = ×4 for input clock of 312.5 MHz
•
3 = Reserved
7-6
Ext connection
External connection mode
•
0 = MAC to MAC connection, master with auto negotiation
•
1 = MAC to MAC connection, slave, and MAC to PHY
•
2 = MAC to MAC, forced link
•
3 = MAC to fiber connection
5-3
Device ID
This value can range from 0 to 7 is used in the device ID field of the Ethernet-ready frame.
174
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6.28.2.4 NAND Boot Device Configuration
NAND boot is shown in Figure 6-33 and described in Table 6-71.
Figure 6-33. NAND Device Configuration Fields
9
8
7
6
5
1st Block
4
3
I2C
Reserved
Table 6-71. NAND Configuration Field Descriptions
Bit
Field
Description
9-5
1st Block
NAND Block to be read first by the boot ROM.
•
0 = Block 0
•
...
•
31 = Block 31
4
I2C
NAND parameters read from I2C EEPROM
•
0 = Parameters are not read from I2C
•
1 = Parameters are read from I2C
3
Reserved
Reserved
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6.28.2.5 PCI Boot Device Configuration
Extra device configuration is provided in the PCI bits in the DEVSTAT register. PCI boot is shown in
Figure 6-34 and described in Table 6-72 and Table 6-73.
Figure 6-34. PCI Device Configuration Fields
9
8
7
6
Ref Clock
5
4
BAR Config
3
Reserved
Table 6-72. PCI Device Configuration Field Descriptions
Bit
Field
Description
9
Ref Clock
PCIe reference clock configuration
•
0 = 100 MHz
•
1 = 250 MHz
8-5
BAR Config
PCIe BAR registers configuration
4-3
Reserved
This value can range from 0 to 0xf. See Table 6-73.
Reserved
Table 6-73. BAR Config / PCIe Window Sizes
64-BIT ADDRESS
TRANSLATION
32-BIT ADDRESS TRANSLATION
BAR CFG
BAR1
BAR2
BAR3
BAR4
0b0000
32
32
32
32
BAR2/3
BAR4/5
0b0001
16
16
32
64
0b0010
16
32
32
64
0b0011
32
32
32
64
0b0100
16
16
64
64
0b0101
16
32
64
64
0b0110
32
32
64
64
32
32
64
128
64
64
128
256
0b1001
4
128
128
128
0b1010
4
128
128
256
0b1011
4
128
256
256
0b1100
256
256
0b1101
512
512
0b1110
1024
1024
0b1111
2048
2048
0b0111
0b1000
176
BAR0
PCIe MMRs
Detailed Description
BAR5
Clone of
BAR4
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6.28.2.6 I2C Boot Device Configuration
6.28.2.6.1 I2C Master Mode
In master mode, the I2C device configuration uses 10 bits of device configuration instead of 7 as used in
other boot modes. In this mode, the device will make the initial read of the I2C EEPROM while the PLL is
in bypass mode. The initial read will contain the desired clock multiplier, which will be set up prior to any
subsequent reads. I2C master mode is shown in Figure 6-35 and described in Table 6-74.
Figure 6-35. I2C Master Mode Device Configuration Bit Fields
12
11
Mode
10
9
Address
8
7
Speed
6
5
4
3
Parameter Index
Table 6-74. I2C Master Mode Device Configuration Field Descriptions
Bit
Field
Description
12
Mode
I2C operation mode
•
0 = Master mode
•
1 = Passive mode (see Section 6.28.2.6.2)
11 - 10
Address
I2C
•
•
•
•
9
Speed
I2C data rate configuration
•
0 = I2C slow mode. Initial data rate is SYSCLK / 5000 until PLLs and clocks are programmed
•
1 = I2C fast mode. Initial data rate is SYSCLK / 250 until PLLs and clocks are programmed
8-3
Parameter Index
Identifies the index of the configuration table initially read from the I2C EEPROM
This value can range from 0 to 63.
bus address configuration
0 = Boot from I2C EEPROM at I2C bus address 0x50
1 = Boot from I2C EEPROM at I2C bus address 0x51
2= Boot from I2C EEPROM at I2C bus address 0x52
3= Boot from I2C EEPROM at I2C bus address 0x53
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6.28.2.6.2 I2C Passive Mode
In passive mode, the device does not drive the clock, but simply acks data received on the specified
address. I2C passive mode is shown in Figure 6-36 and described in Table 6-75.
Figure 6-36. I2C Passive Mode Device Configuration Bit Fields
12
11
10
9
Mode
8
7
6
5
4
Address
3
Reserved
Table 6-75. I2C Passive Mode Device Configuration Field Descriptions
Bit
Field
Description
12
Mode
I2C operation mode
•
0 = Master mode (see Section 6.28.2.6.1)
•
1 = Passive mode
11 - 5
Address
I2C bus address accepted during boot. Value may range from 0x00 to 0x7F
4-3
Reserved
Reserved
178
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6.28.2.7 SPI Boot Device Configuration
In SPI boot mode, the SPI device configuration uses 10 bits of device configuration instead of 7 as used in
other boot modes. SPI boot is shown in Figure 6-37 and described in Table 6-76.
Figure 6-37. SPI Device Configuration Bit Fields
12
11
Mode
10
9
4, 5 Pin
Addr Width
8
7
6
Chip Select
5
4
3
Parameter Table Index
Table 6-76. SPI Device Configuration Field Descriptions
Bit
Field
Description
12-11
Mode
Clk Pol / Phase
•
0 = Data is output on the rising edge of SPICLK. Input data is latched on the falling edge.
•
1 = Data is output one half-cycle before the first rising edge of SPICLK and on subsequent falling
edges. Input data is latched on the rising edge of SPICLK.
•
2 = Data is output on the falling edge of SPICLK. Input data is latched on the rising edge.
•
3 = Data is output one half-cycle before the first falling edge of SPICLK and on subsequent rising
edges. Input data is latched on the falling edge of SPICLK.
10
4, 5 Pin
SPI operation mode configuration
•
0 = 4-pin mode used
•
1 = 5-pin mode used
9
Addr Width
SPI address width configuration
•
0 = 16-bit address values are used
•
1 = 24-bit address values are used
8-7
Chip Select
The chip select field value
•
00b = CS0 and CS1 are both active (not used)
•
01b = CS1 is active
•
10b = CS0 is active
•
11b = None is active
6-3
Parameter Table
Index
Specifies which parameter table is loaded from SPI. The boot ROM reads the parameter table (each table
is 0x80 bytes) from the SPI starting at SPI address (0x80 * parameter index). The value can range from 0
to 15.
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6.28.2.8 HyperLink Boot Device Configuration
Figure 6-38. HyperLink Boot Device Configuration Fields
9
8
Reserved
7
Data Rate
6
5
4
Ref Clock
3
Reserved
Table 6-77. HyperLink Boot Device Configuration Field Descriptions
Bit
Field
Description
9
Reserved
Reserved
8-7
Data Rate
HyperLink data rate configuration
•
0 = 1.25 GBaud/s
•
1 = 3.125 GBaud/s
•
2 = 6.25 GBaud/s
•
3 = Reserved
6-5
Ref Clocks
HyperLink reference clock configuration
•
0 = 156.25 MHz
•
1 = 250 MHz
•
2 = 312.5 MHz
•
3 = Reserved
4-3
Reserved
Reserved
180
Detailed Description
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6.28.3 Boot Parameter Table
The ROM Bootloader (RBL) is guided by the boot parameter table to carry out the boot process. The boot
parameter table is the most common format the RBL employs to determine the boot flow. These boot
parameter tables have certain parameters common across all the boot modes, while the rest of the
parameters are unique to the boot modes. Table 6-78 lists the common entries in the boot parameter
table.
Table 6-78. Boot Parameter Table Common Values
Byte Offset
Name
Description
0
Length
The length of this table, including this length field, in bytes.
2
Checksum
Identifies the device port number to boot from, if applicable. The value 0xFFFF
indicates that all ports are configured (Ethernet, SRIO).
The 16 bits ones complement of the ones complement of the entire table. A value
of "0" will disable checksum verification of the table by the boot ROM.
4
Boot Mode
See Table 6-79
6
Port Num
8
PLL config, MSW
PLL configuration, MSW (see Figure 6-39)
10
PLL config, LSW
PLL configuration, LSW
Identifies the device port number to boot from, if applicable. The value 0xFFFF
indicates that all ports are configured (Ethernet, SRIO).
Table 6-79. Boot Parameter Table Boot Mode Field
Value
Boot Mode
10
Ethernet (boot table)
20
Rapid I/O
30
PCIe
40
I2C Master
41
I2C Slave
42
I2C Master Write
50
SPI
60
Hyperlink
70
EMIF16
80
NAND
81
NAND I2C
100
SLEEP, no PLL configuration
110
UART
Figure 6-39. Boot Parameter PLL Configuration Field
31
30
29
PLL Config Ctl
16
15
PLL Multiplier
8
7
PLL Predivider
0
PLL Post-Divider
Table 6-80. PLL Configuration Field Description
Field
Value
Description
PLL Config Ctl
0b00
PLL is not configured
0b01
PLL is configured only if it is currently disabled or in bypass
0b10
PLL is configured only if it is currently disabled or in bypass
0b11
PLL is disabled and put into bypass
Predivider
0-255
Input clock division. The value 0 is treated as predivide by 1
Multiplier
0-16383
Multiplier. The value 0 is treated as multiply by 1
Post-divider
0-255
PLL output division. The value 0 is treated as post divide by 1
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6.28.3.1 Sleep / XIP Mode Parameter Table
The sleep mode parameter table has no fields in addition to the common fields described in
Section 6.28.3.
Table 6-81. EMIF16 XIP Parameter Table Values
Byte Offset
Name
Descriptions
12
Options
Figure 6-40
14
Type
Must be set to 0 for NOR flash
16
Branch Addr, MSW
Address to branch to
18
Branch Addr, LSW
20
CsNum
The chip select number, valid values are 2-5
22
memWidth
The bit width of the memory, valid values are 8 or 16
24
waitEnable
Extended wait is enabled if this value is 1, otherwise disabled
26
Async config, MSW
EMIF16 async config register value, msw
28
Async config, LSW
EMIF16 async config register value, lsw
Figure 6-40. EMIF16 XIP Options Fields
15
1
Reserved
0
async
Table 6-82. EMIF16 XIP Option Field Descriptions
Field
Value
Async
0
The async config register is not changed by the boot code
1
The async config value in the boot parameter table is programmed in the async config
register (EMIF timing values)
182
Detailed Description
Description
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6.28.3.2 SRIO Mode Boot Parameter Table
Table 6-83. SRIO Mode Boot Parameter Table
Byte Offset
Name
12
Options
See Figure 6-41
Description
14
Lane Setup
See Table 6-85
16
Reserved
18
Node ID
20
SERDES ref clk
22
Link Rate
24
PF Low
Packet forward address range, low value
26
PF high
Packet forward address range, high value
28
Promiscuous Mask
A bit is set for each lane/port that is configured as promiscuous.
30
Serdes AUX, MSW
Serdes Auxillary Register Configuration, MSW
32
Serdes AUX, LSW
Serdes Auxillary Register Configuration, LSW
34
SERDES Rx Lane 0, MSW
Serdes Rx Config, Lane 0, MSW
36
SERDES Rx Lane 0, LSW
Serdes Rx Config, Lane 0, LSW
38
SERDES Rx Lane 1, MSW
Serdes Rx Config, Lane 1, MSW
40
SERDES Rx Lane 1, LSW
Serdes Rx Config, Lane 1, LSW
42
SERDES Rx Lane 2, MSW
Serdes Rx Config, Lane 2, MSW
44
SERDES Rx Lane 2, LSW
Serdes Rx Config, Lane 2, LSW
46
SERDES Rx Lane 3, MSW
Serdes Rx Config, Lane 3, MSW
48
SERDES Rx Lane 3, LSW
Serdes Rx Config, Lane 3, LSW
50
SERDES Tx Lane 0, MSW
Serdes Tx Config, Lane 0, MSW
52
SERDES Tx Lane 0, LSW
Serdes Tx Config, Lane 0, LSW
54
SERDES Tx Lane 1, MSW
Serdes Tx Config, Lane 1, MSW
56
SERDES Tx Lane 1, LSW
Serdes Tx Config, Lane 1, LSW
58
SERDES Tx Lane 2, MSW
Serdes Tx Config, Lane 2, MSW
60
SERDES Tx Lane 2, LSW
Serdes Tx Config, Lane 2, LSW
62
SERDES Tx Lane 3, MSW
Serdes Tx Config, Lane 3, MSW
64
SERDES Tx Lane 3, LSW
Serdes Tx Config, Lane 3, LSW
Reserved
The node ID value to set for this device
The SERDES reference clock frequency, in 1/100 MHZ. Used only if PLL setup
field in options is set.
Link rate, MHz. Used only if PLL setup field in options is set.
Figure 6-41. SRIO Boot Options
15
5
Reserved
4
PLL
Setup
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3
2
1
QM
Cfg
Mailbox
Bypass Bypass
En
Detailed Description
0
Tx En
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Table 6-84. SRIO Boot Options Description
Parameter
Value
PLL Setup
0
Serdes Configuration registers taken without modification
1
Multiplier and rate fields are modified based on the reference clock and link rate
fields.
0
Configure the QM (and cpdma)
1
Bypass QM configuration
0
Configure the SRIO
1
Bypass SRIO configuration
0
Mailbox mode disabled. SRIO boot is in Master mode
1
Mailbox mode enabled. SRIO boot is in message mode (master boot still works)
0
SRIO transmit disabled
1
SRIO transmit enabled
QM Bypass
Cfg Bypass
Mailbox En
Tx En
Description
Table 6-85. SRIO Lane Setup Values
Value
Description
0
SRIO configured as four 1x ports
1
SRIO configured as 3 ports (2x, 1x, 1x)
2
SRIO configured as 3 ports (1x, 1x, 2x)
3
SRIO configured as 2 ports (2x, 2x)
4
SRIO configured as 1 4x port
5-0xFFFF
Reserved
6.28.3.3 Ethernet Mode Boot Parameter Table
The default multicast Ethernet MAC address is the broadcast address.
Table 6-86. Ethernet Boot Parameter Table Values
184
Byte Offset
Name
12
Options
Description
14
MAC High
The 16 MSBs of the MAC address to receive during boot
16
MAC Med
The 16 middle bits of the MAC address to receive during boot
18
MAC Low
The 16 LSBs of the MAC address to receive during boot
20
Multi MAC High
The 16 MSBs of the multicast MAC address to receive during boot
22
Multi MAC Med
The 16 middle bits of the multicast MAC address to receive during boot
24
Mulit MAC Low
The 16 LSBs of the multicast MAC address to receive during boot
26
Source Port
28
Dest Port
30
Device ID 12
The first 2 bytes of the device ID. This is typically a string value, and is sent in the
Ethernet ready frame
32
Device ID 34
The second 2 bytes of the device ID.
34
Dest MAC High
The 16 MSBs of the MAC destination address used for the Ethernet ready frame.
Default is broadcast.
36
Dest MAC Med
The 16 middle bits of the MAC destination address
38
DEST MAC Low
The 16 LSBs of the MAC destination address
40
Sgmii Config
See Figure 6-43
42
Sgmii Control
The SGMII control register value (if table value not used)
See Figure 6-42
The source UDP port to accept boot packets from. A value of 0 will accept packets
from any UDP port
The destination port to accept boot packets on.
44
Sgmii Adv Abilility
The SGMII ADV Ability register value (if table value not used)
46
Sgmii Tx Cfg High
The 16 MSBs of the sgmii Tx config register (if table value not used)
48
Sgmii Tx Cfg Low
The 16 LSBs of the sgmii Tx config register (if table value not used)
Detailed Description
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Table 6-86. Ethernet Boot Parameter Table Values (continued)
Byte Offset
Name
50
Sgmii Rx Cfg High
The 16 MSBs of the sgmii Rx config register (if table value not used)
Description
52
Sgmii Rx Cfg Low
The 16 LSBs of the sgmii Rx config register (if table value not used)
54
Sgmii Aux Cfg High
The 16 MSBs of the sgmii Aux config register (if table value not used)
56
Sgmii Aux Cfg Low
The 16 LSBs of the sgmii Aux config register (if table value not used)
58
Pkt PLL Config, MSW
60
Packet PLL Config, LSW
The packet subsystem PLL configuration, MSW (unused in gauss)
The packet subsystem PLL configuration, LSW
Figure 6-42. Ethernet Mode Boot Parameter Options Field
15
7
Reserved
6
5
Init Config
4
3
Skip
Tx
0
Reserved
Table 6-87. Ethernet Options Field Descriptions
Name
Value
Init Config
0b00
SERDES and SGMII are configured.
0b01
SERDES and SGMII are NOT configured
0b10
Reserved
0b11
None of the Ethernet system hardware is configured.
0
Ethernet ready frame is sent once when the system is first ready to receive
packets, and then roughly every 3 seconds until the first boot packet is accepted.
1
Ethernet ready frame is not sent
Skip tx
Description
Figure 6-43. SGMII Config Bit Field
15
6
Reserved
5
4
bypass
direct
3
0
Index
Table 6-88. SGMII Config Field Descriptions
Field
Value
Index
0
Configure the SGMII as a master
1
Configure the SGMII as a slave, or connected to a Phy
2
Configure the SGMII as a forced link
3
Configure the SGMII as mac to fiber
4-15
Reserved
0
Configure the SGMII as directed in the index field
1
Configure the SGMII using the advise ability and control fields in the boot
parameter table, not based on the index field
0
Configure the SGMII.
1
Do not configure the SGMII.
Direct
Bypass
Description
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6.28.3.4 NAND Mode Boot Parameter Table
Table 6-89. NAND Mode Boot Parameter Table
Byte Offset
Name
12
Options
Decription
14
I2cClkFreqKhz
The I2C clock frequency to use when using I2C tables
16
I2cTargetAddr
The I2C bus address of the EEPROM
18
I2cLocalAddr
The I2C bus address of the Appleton device
20
I2cDataAddr
The address on the EEPROM of the NAND configuration table
22
I2cWtoRDelay
24
csNum
26
firstBlock
See Figure 6-44
Delay between addres writes and data reads, in I2C clock periods
The NAND chip-select region (0-3)
The first block of the boot image
Figure 6-44. NAND Boot Parameter Option Fields
15
1
Reserved
0
I2C
Table 6-90. NAND Boot Parameter Options Bit Field Descriptions
Name
Value
I2C
0
NAND configuration is NOT read from I2C
1
NAND configuration is read from the I2C
186
Detailed Description
Description
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6.28.3.5 PCIE Mode Boot Parameter Table
Table 6-91. PCIe Mode Boot Parameter Table
Byte Offset
Name
Description
12
options
PCI configuration options (see Figure 6-45)
14
Address Width
PCI address width, can be 32 or 64
16
Serdes Frequency
Serdes frequency, in MBs. Currently only 2500 supported.
18
Reference clock
Reference clock frequency, in units of 10 kHz. Valid values are 10000 (100 MHz),
12500 (125 MHz), 15625 (156.25 MHz), 25000 (250 MHz) and 31250 (312.5 MHz),
although other values should work.
20
Window 1 Size
Window 1 size, in Mbytes
22
Window 2 Size
Window 2 size, in Mbytes
24
Window 3 Size
Window 3 size, in Mbytes. Valid only if address width is 32.
26
Window 4 Size
Window 4 Size, in Mbytes Valid only if address width is 32.
28
Window 5 Size
Window 5 Size. Valid only if the address width is 32.
30
Vendor ID
Vendor ID field
32
Device ID
Device ID field (0xb006 by default for Gauss)
34
Class code Rev Id, MSW
Class code/revision ID field
36
Class code Rev Id, LSW
Class code/revision ID field
38
Serdes cfg msw
PCIe serdes config word, MSW
40
Serdes cfg lsw
PCIe serdes config word, LSW
42
Serdes lane 0 cfg msw
Serdes lane config word, msw lane 0
44
Serdes lane 0 cfg lsw
Serdes lane config word, lsw, lane 0
46
Serdes lane 1 cfg msw
Serdes lane config word, msw, lane 1
48
Serdes lane 1 cfg lsw
Serdes lane config word, lsw, lane 1
Figure 6-45. PCIe Options Bit Field
15
3
Reserved
2
1
0
Serdes
Cfg
Reserv
Cfg
Disable
ed
Table 6-92. PCIe Options Field Descriptions
Field
Value
Cfg disable
0
PCIe peripheral is configured by the boot rom
1
PCIe peripheral is not configured by the boot rom
0
Serdes PLL multiplier and rate fields in the table are used directly
1
Serdes PLL multiplier and rate fields in the serdes registers will be overwritten
based on the values in the serdes frequency and reference clock parameters.
Serdes Cfg
Description
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6.28.3.6 I2C Mode Boot Parameter Table
Table 6-93. I2C Mode Boot Parameter Table
Byte Offset
Name
12
Options
Description
See Figure 6-46
14
Boot Dev Addr
16
Boot Dev Addr Ext
The I2C device address to boot from
Extended boot device address, or I2C bus address (typically 0x50, 0x51)
18
Broadcast Addr
In master broadcast boot, this is the I2C address to send the boot data to
20
Local Address
The I2C address of this device.
22
Device Freq
24
Bus Frequency
The desired I2C data rate (kHz).
26
Next Dev Addr
The next device to boot from (used in boot config mode)
28
Next Dev Addr Ext
30
Address Delay
The operating frequency of the device (MHz). Used to compute the divide down to
the I2C module
The extended next boot device address
The number of CPU cycles to delay between writing the address to an I2C
EEPROM and reading data. This allows the I2C EEPROM time to load the data.
Figure 6-46. I2C Mode Boot Options Bitfield
15
2
Reserved
1
0
Mode
Table 6-94. Register Description
Parameter
Value
Mode
0
Load a boot parameter table from the I2C
1
Load boot records from the I2C (boot tables)
2
Load boot config records from the I2C (boot config tables)
3
Perform a slave mode boot, listening on the local address specified in the table.
188
Detailed Description
Description
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6.28.3.7 SPI Mode Boot Parameter Table
Table 6-95. 2.5.3.7 SPI Mode Boot Parameter Table
Byte Offset
Name
12
options
Description
14
Address Width
16
NPin
The operational mode, 4 or 5 pin
18
Chipsel
The chip select used. Can be 0-3.
See Figure 6-47
The number of bytes in the SPI device address. Can be 2 or 3 (16 or 24 bit)
20
Mode
22
C2T Delay
SPI mode, 0-3
24
CPU Freq MHz
The speed of the CPU, in MHz
26
Bus Freq, MHz
The MHz portion of the SPI bus frequency. Default = 5MHz
28
Bus Freq, kHz
The kHz portion of the SPI buf frequency. Default = 0
30
Read Addr MSW
The first address to read from, MSW (valid for 24 bit address width only)
32
Read Addr LSW
The first address to read from, LSW
SPI chip select active to transmit start delay value (0-255)
34
Next chipsel
36
Next read MSW
Chipsel value used after boot config table processing is complete
The next read address, MSW after config table processing is complete
38
Next read LSW
The next read address, LSW after config table processing is complete
The bus frequency programmed into the SPI by the boot ROM is from the table: MHz.kHz. So for a 5.1
MHz bus frequency the MHz value is 5, the kHz value is 100.
Figure 6-47. SPI Options Field Bit Map
15
2
Reserved
1
0
Mode
Table 6-96. SPI Options Field Description
Parameter
Value
Mode
0
Load a boot parameter table from the SPI
Description
1
Load boot records from the SPI (boot tables)
2
Load boot config records from the SPI (boot config tables)
3
Reserved
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6.28.3.8 Hyperlink Mode Boot Parameter Table
Table 6-97. Hyperlink Mode Boot Parameter Table
Byte Offset
Name
12
Options
See Figure 6-48
Description
14
N lanes
The number of lanes to configure
16
Serdes Aux, MSW
SERDES Aux register config value, MSW
18
Serdes Aux, LSW
SERDES Aux register config value, LSW
20
Rx Lane 0, MSW
SERDES Rx Lane 0 register value, MSW
22
Rx Lane 0, LSW
SERDES Rx Lane 0 register value, LSW
24
Tx Lane 0, MSW
SERDES Tx Lane 0 register value, MSW
26
Tx Lane 0, LSW
SERDES Tx Lane 0 register value, LSW
28
Rx Lane 1, MSW
SERDES Rx Lane 1 register value, MSW
30
Rx Lane 1, LSW
SERDES Rx Lane 1 register value, LSW
32
Tx Lane 1, MSW
SERDES Tx Lane 1 register value, MSW
34
Tx Lane 1, LSW
SERDES Tx Lane 1 register value, LSW
36
Rx Lane 2, MSW
SERDES Rx Lane 2 register value, MSW
38
Rx Lane 2, LSW
SERDES Rx Lane 2 register value, LSW
40
Tx Lane 2, MSW
SERDES Tx Lane 2 register value, MSW
42
Tx Lane 2, LSW
SERDES Tx Lane 2 register value, LSW
Figure 6-48. Hyperlink Options Bit Field
15
2
Reserved
1
0
nonit
Rsvd
Table 6-98. Hyperlink Options Field Descriptions
Field
Value
nonit
0
Initialize hyperlink peripheral
1
Do not initialize hyperlink peripheral
190
Detailed Description
Description
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6.28.3.9 UART Mode Boot Parameter Table
Table 6-99. UART Mode Boot Parameter Table
Byte Offset
Field
12
Rsvd
Description
14
Data Format
16
Protocol
18
Initial Ping Cnt
Number of initial pings without reply before the boot times out
20
Max Err Count
Number of consecutive errors before the boot fails
22
Nack timeout
Time-out period waiting for an ack/nack, in milliseconds
24
Char timeout
Time-out period between characters
26
Data bits
Reserved
Only value 1, boot table format is supported
Only value 0, XMODEM is supported
Number of data bits. Only the value 8 is supported
28
Parity
30
Stop bits x2
0 = none, 1 = odd, 2 = even
Number of stop bits x2, (2 = 1 stop bit, 4 = 2 stop bits)
32
Oversample
The oversample factor. Only 13 and 16 are valid
34
Flow Control
Only 0, no flow control is supported.
36
Data Rate, MSW
The Baud rate, MSW
38
Data Rate, LSW
The Baud rate, LSW
40
timerRefMhz
Timer reference frequency, in MHz. In Gauss this is the frequency the device is
operating at after the PLL is programmed.
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6.29 PLL Boot Configuration Settings
The PLL default settings are determined by the BOOTMODE[12:10] bits. Table 6-100 shows settings for
various input clock frequencies.
Table 6-100. C66x DSP System PLL Configuration (1)
850 MHz DEVICE
1000 MHz DEVICE
1250 MHz DEVICE
BOOTMODE
[12:10]
INPUT CLOCK
FREQ (MHz)
PLLD
0b000
50.00
0
33
850
0
39
1000
0
49
1250
0b001
66.67
1
50
850.04
0
29
1000.05
1
74
1250.063
0b010
80.00
3
84
850
0
24
1000
3
124
1250
0b011
100.00
0
16
850
0
19
1000
0
24
1250
0b100
156.25
49
543
850
4
63
1000
0
15
1250
0b101
250.00
4
33
850
0
7
1000
0
9
1250
0b110
312.50
49
271
850
4
31
1000
0
7
1250
0b111
122.88
5
82
849.92
28
471
999.989
28
589
1249.986
(1)
PLLM
DSP ƒ
PLLD
PLLM
DSP ƒ
PLLD
PLLM
DSP ƒ
The PLL boot configuration table above may not include all the frequency values that the device supports.
OUTPUT_DIVIDE is the value of the field of SECCTL[22:19]. This will set the PLL to the maximum clock
setting for the device (with OUTPUT_DIVIDE=2, by default).
•
CLK = CLKIN × ((PLLM+1) ÷ ((OUTPUT_DIVIDE+1) × (PLLD+1)))
The Main PLL is controlled using a PLL controller and a chip-level MMR. The DDR3 PLL is controlled by
chip level MMRs. For details on how to set up the PLL see Section 6.6. For details on the operation of the
PLL controller module, see the Phase-Locked Loop (PLL) for KeyStone Devices User's Guide.
6.30 Second-Level Bootloaders
Any of the boot modes can be used to download a second-level bootloader. A second-level bootloader
allows for any level of customization to current boot methods as well as the definition of a completely
customized boot.
192
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7 C66x CorePac
The C66x CorePac consists of several components:
•
•
•
•
•
•
•
•
•
The C66x DSP and associated C66x CorePac core
Level-one and level-two memories (L1P, L1D, L2)
Data Trace Formatter (DTF)
Embedded Trace Buffer (ETB)
Interrupt Controller
Power-down controller
External Memory Controller
Extended Memory Controller
A dedicated power/sleep controller (LPSC)
The C66x CorePac also provides support for memory protection, bandwidth management (for resources
local to the C66x CorePac) and address extension. Figure 7-1 shows a block diagram of the C66x
CorePac.
Interrupt and Exception Controller
Instruction Fetch
16-/32-bit Instruction Dispatch
Control Registers
In-Circuit Emulation
Boot
Controller
Instruction Decode
Data Path A
PLLC
LPSC
A Register File
B Register File
A31-A16
A15-A0
B31-B16
B15-B0
.M1
xx
xx
.M2
xx
xx
GPSC
.L1
Data Path B
.S1
.D1
.D2
.S2
.L2
Data Memory Controller (DMC) With
Memory Protect/Bandwidth Mgmt
Extended Memory
Controller (XMC)
C66x DSP Core
L2 Cache/
SRAM
1024KB
MSM
SRAM
1024KB
DDR3
SRAM
DMA Switch
Fabric
External Memory
Controller (EMC)
Program Memory Controller (PMC) With
Memory Protect/Bandwidth Mgmt
Unified Memory
Controller (UMC)
32KB L1P
CFG Switch
Fabric
32KB L1D
Figure 7-1. C66x CorePac Block Diagram
For more detailed information on the TMS320C66x CorePac on the C665x device, see the C66x CorePac
User's Guide.
7.1
Memory Architecture
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Each C66x CorePac of the device contains a 1024KB level-2 memory (L2), a 32KB level-1 program
memory (L1P), and a 32KB level-1 data memory (L1D). The C665x device also contain a 1024KB
multicore shared memory (MSM). All memory on the C665x has a unique location in the memory map
(see Table 6-63).
After device reset, L1P and L1D cache are configured as all cache, by default. The L1P and L1D cache
can be reconfigured through software through the L1PMODE field of the L1P Configuration Register
(L1PCFG) and the L1DMODE field of the L1D Configuration Register (L1DCFG) of the C66x CorePac.
L1D is a two-way set-associative cache, while L1P is a direct-mapped cache.
The on-chip bootloader changes the reset configuration for L1P and L1D. For more information, see the
Bootloader for the C66x DSP User's Guide.
For more information on the operation L1 and L2 caches, see the C66x DSP User's Guide.
7.1.1
L1P Memory
The L1P memory configuration for the C665x device is as follows:
•
32KB with no wait states
Figure 7-2 shows the available SRAM/cache configurations for L1P.
L1P mode bits
000
001
010
011
100
1/2
SRAM
All
SRAM
7/8
SRAM
L1P memory
Block base
address
00E0 0000h
16KB
3/4
SRAM
direct
mapped
cache
00E0 4000h
8KB
dm
cache
direct
mapped
cache
direct
mapped
cache
00E0 6000h
4KB
00E0 7000h
4KB
00E0 8000h
Figure 7-2. L1P Memory Configurations
194
C66x CorePac
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L1D Memory
The L1D memory configuration for the C665x device is as follows:
•
32KB with no wait states
Figure 7-3 shows the available SRAM/cache configurations for L1D.
L1D mode bits
000
001
010
011
100
1/2
SRAM
All
SRAM
7/8
SRAM
L1D memory
Block base
address
00F0 0000h
16KB
3/4
SRAM
2-way
cache
00F0 4000h
8KB
2-way
cache
2-way
cache
2-way
cache
00F0 6000h
4KB
00F0 7000h
4KB
00F0 8000h
Figure 7-3. L1D Memory Configurations
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7.1.3
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L2 Memory
The L2 memory configuration for the C665x device is as follows:
•
•
•
Total memory is 1024KB (C6655) or 2048KB (C6657)
Each core contains 1024KB of memory
Local starting address for each core is 0080 0000h
L2 memory can be configured as all SRAM, all 4-way set-associative cache, or a mix of the two. The
amount of L2 memory that is configured as cache is controlled through the L2MODE field of the L2
Configuration Register (L2CFG) of the C66x CorePac. Figure 7-4 shows the available SRAM/cache
configurations for L2. By default, L2 is configured as all SRAM after device reset.
L2 Mode Bits
000
001
010
011
100
101
L2 Memory
110
Block Base
Address
0080 0000h
1/2
SRAM
512KB
3/4
SRAM
ALL
SRAM
31/32
SRAM
15/16
SRAM
7/8
SRAM
4-Way
Cache
0088 0000h
256KB
4-Way
Cache
008C 0000h
128KB
4-Way
Cache
4-Way
Cache
4-Way
Cache
008E 0000h
64KB
4-Way
Cache
32KB
32KB
008F 0000h
008F 8000h
008F FFFFh
Figure 7-4. L2 Memory Configurations
196
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Global addresses are accessible to all masters in the system. In addition, local memory can be accessed
directly by the associated processor through aliased addresses, where the eight MSBs are masked to
zero. The aliasing is handled within the C66x CorePac and allows for common code to be run unmodified
on multiple cores. For example, address location 0x10800000 is the global base address for C66x
CorePac Core 0's L2 memory. C66x CorePac Core 0 can access this location by either using 0x10800000
or 0x00800000. Any other master on the device must use 0x10800000 only. Conversely, 0x00800000 can
by used by any of the cores as their own L2 base addresses.
For C66x CorePac Core 0, address 0x00800000 is equivalent to 0x10800000, and for C66x CorePac
Core 1 (C6657 only) address 0x00800000 is equivalent to 0x11800000. Local addresses should be used
only for shared code or data, allowing a single image to be included in memory. Any code/data targeted to
a specific core, or a memory region allocated during run-time by a particular core should always use the
global address only.
7.1.4
MSM SRAM
The MSM SRAM configuration for the device is as follows:
•
•
•
•
Memory size is 1024KB
The MSM SRAM can be configured as shared L2 and/or shared L3 memory
Allows extension of external addresses from 2GB to up to 4GB
Has built in memory protection features
The MSM SRAM is always configured as all SRAM. When configured as a shared L2, its contents can be
cached in L1P and L1D. When configured in shared L3 mode, it’s contents can be cached in L2 also. For
more details on external memory address extension and memory protection features, see the Multicore
Shared Memory Controller (MSMC) for KeyStone Devices User's Guide.
7.1.5
L3 Memory
The L3 ROM on the device is 128KB. The ROM contains software used to boot the device. There is no
requirement to block accesses from this portion to the ROM.
7.2
Memory Protection
Memory protection allows an operating system to define who or what is authorized to access L1D, L1P,
and L2 memory. To accomplish this, the L1D, L1P, and L2 memories are divided into pages. There are 16
pages of L1P (2KB each), 16 pages of L1D (2KB each), and 32 pages of L2 (16KB each). The L1D, L1P,
and L2 memory controllers in the C66x CorePac are equipped with a set of registers that specify the
permissions for each memory page.
Each page may be assigned with fully orthogonal user and supervisor read, write, and execute
permissions. In addition, a page may be marked as either (or both) locally accessible or globally
accessible. A local access is a direct DSP access to L1D, L1P, and L2, while a global access is initiated
by a DMA (either IDMA or the EDMA3) or by other system masters. EDMA or IDMA transfers programmed
by the DSP count as global accesses.
The DSP and each of the system masters on the device are all assigned a privilege ID. It is possible to
specify whether memory pages are locally or globally accessible.
The AIDx and LOCAL bits of the memory protection page attribute registers specify the memory page
protection scheme, see Table 7-1.
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Table 7-1. Available Memory Page Protection Schemes
AIDx BIT
LOCAL BIT DESCRIPTION
0
0
No access to memory page is permitted.
0
1
Only direct access by DSP is permitted.
1
0
Only accesses by system masters and IDMA are permitted (includes EDMA
and IDMA accesses initiated by the DSP).
1
1
All accesses permitted.
Faults are handled by software in an interrupt (or an exception, programmable within the C66x CorePac
interrupt controller) service routine. A DSP or DMA access to a page without the proper permissions will:
•
•
•
Block the access — reads return 0, writes are ignored
Capture the initiator in a status register — ID, address, and access type are stored
Signal event to DSP interrupt controller
The software is responsible for taking corrective action to respond to the event and resetting the error
status in the memory controller. For more information on memory protection for L1D, L1P, and L2, see the
C66x CorePac User's Guide.
7.3
Bandwidth Management
When multiple requestors contend for a single C66x CorePac resource, the conflict is resolved by granting
access to the highest priority requestor. The following four resources are managed by the Bandwidth
Management control hardware:
•
•
•
•
Level 1 Program (L1P) SRAM/Cache
Level 1 Data (L1D) SRAM/Cache
Level 2 (L2) SRAM/Cache
Memory-mapped registers configuration bus
The priority level for operations initiated within the C66x CorePac are declared through registers in the
C66x CorePac. These operations are:
•
•
•
DSP-initiated transfers
User-programmed cache coherency operations
IDMA-initiated transfers
The priority level for operations initiated outside the C66x CorePac by system peripherals is declared
through the Priority Allocation Register (PRI_ALLOC), see Section 9.4 for more details. System
peripherals with no fields in the PRI_ALLOC have their own registers to program their priorities.
More information on the bandwidth management features of the C66x CorePac can be found in the C66x
CorePac User's Guide.
7.4
Power-Down Control
The C66x CorePac supports the ability to power down various parts of the C66x CorePac. The power
down controller (PDC) of the C66x CorePac can be used to power down L1P, the cache control hardware,
the DSP, and the entire C66x CorePac. These power-down features can be used to design systems for
lower overall system power requirements.
NOTE
The C665x does not support power-down modes for the L2 memory at this time.
More information on the power-down features of the C66x CorePac can be found in the C66x CorePac
User's Guide.
198
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7.5
SPRS814D – MARCH 2012 – REVISED OCTOBER 2019
C66x CorePac Revision
The version and revision of the C66x CorePac can be read from the CorePac Revision ID Register
(MM_REVID) located at address 0181 2000h. The MM_REVID register is shown in Figure 7-5 and
described in Table 7-2. The C66x CorePac revision is dependent on the silicon revision being used.
Figure 7-5. CorePac Revision ID Register (MM_REVID) Address - 0181 2000h
31
16
15
0
VERSION
REVISION
R-n
R-n
Legend: R = Read; -n = value after reset
Table 7-2. CorePac Revision ID Register (MM_REVID) Field Descriptions
BIT
FIELD
DESCRIPTION
31-16
VERSION
Version of the C66x CorePac implemented on the device.
15-0
REVISION
Revision of the C66x CorePac version implemented on the device.
7.6
C66x CorePac Register Descriptions
See the C66x CorePac User's Guide for register offsets and definitions.
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8 Device Configuration
On the C665x device, certain device configurations like boot mode and endianness, are selected at device
power-on reset. The status of the peripherals (enabled or disabled) is determined after device power-on
reset.
8.1
Device Configuration at Device Reset
Table 8-1 describes the device configuration pins. The logic level is latched at power-on reset to
determine the device configuration. The logic level on the device configuration pins can be set by using
external pullup or pulldown resistors or by using some control device (for example, FPGA/CPLD) to
intelligently drive these pins. When using a control device, ensure there is no contention on the lines when
the device is out of reset. The device configuration pins are sampled during power-on reset and are driven
after the reset is removed. To avoid contention, the control device must stop driving the device
configuration pins of the DSP. And when driving by a control device, the control device must be fully
powered and out of reset and driving the pins before the DSP can be taken out of reset.
Most of the device configuration pins are shared with other function pins (LENDIAN/GPIO[0],
BOOTMODE[12:0]/GPIO[13:1], PCIESSMODE[1:0]/GPIO[15:14], and PCIESSEN/TIMI0). Some time must
be given following the rising edge of reset to drive these device configuration input pins before they
assume an output state (those GPIO pins should not become outputs during boot). Also be aware that
systems using TIMI0 (the pin shared with PCIESSEN) as a clock input must assure that the clock is
disabled from the input until after reset is released and a control device is no longer driving that input.
NOTE
If a configuration pin must be routed out from the device and it is not driven (Hi-Z state), the
internal pullup or pulldown (IPU/IPD) resistor should not be relied upon. TI recommends the
use of an external pullup or pulldown resistor. For more detailed information on pullup or
pulldown resistors and situations in which external pullup or pulldown resistors are required,
see Section 8.4.
Table 8-1. C665x Device Configuration Pins
PIN NO.
IPD/IPU (1)
(1) (2)
T25
IPU
Device endian mode (LENDIAN).
•
0 = Device operates in big-endian mode
•
1 = Device operates in little-endian mode
BOOTMODE[12:0] (1) (2)
R25, R23, U25,
T23, U24, T22,
R21, U22, U23,
V23, U21, T21,
V22
IPD
Method of boot.
W21, V21
IPD
PCIe Subsystem mode selection.
•
00 = PCIe in end point mode
•
01 = PCIe legacy end point (support for legacy INTx)
•
10 = PCIe in root complex mode
•
11 = Reserved
AD20
IPD
PCIe subsystem enable/disable.
•
0 = PCIE Subsystem is disabled
•
1 = PCIE Subsystem is enabled
CONFIGURATION PIN
LENDIAN
PCIESSMODE[1:0] (1) (2)
PCIESSEN (1) (2)
(1)
(2)
200
FUNCTIONAL DESCRIPTION
Some pins may not be used by bootloader and can be used as general purpose
config pins. See Bootloader for the C66x DSP User's Guide for how to determine
the device enumeration ID value.
Internal 100-µA pulldown or pullup is provided for this terminal. In most systems, a 1-kΩ resistor can be used to oppose the IPD/IPU.
For more detailed information on pulldown or pullup resistors and situations in which external pulldown or pullup resistors are required,
see Section 8.4.
These signal names are the secondary functions of these pins.
Device Configuration
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8.2
SPRS814D – MARCH 2012 – REVISED OCTOBER 2019
Peripheral Selection After Device Reset
Several of the peripherals on the C665x are controlled by the Power Sleep Controller (PSC). By default,
the PCIe, SRIO, and HyperLink are held in reset and clock-gated. The memories in these modules are
also in a low-leakage sleep mode. Software is required to turn these memories on. The software enables
the modules (turns on clocks and deasserts reset) before these modules can be used.
If one of the above modules is used in the selected ROM boot mode, the ROM code will automatically
enable the module.
All other modules come up enabled by default and there is no special software sequence to enable. For
more detailed information on the PSC use, see the Power Sleep Controller (PSC) for KeyStone Devices
User's Guide.
8.3
Device State Control Registers
The C665x device has a set of registers that are used to provide the status or configure certain parts of its
peripherals. Table 8-2 lists these registers.
Table 8-2. Device State Control Registers
ADDRESS
START
ADDRESS END SIZE
FIELD
0x02620000
0x02620007
8B
Reserved
0x02620008
0x02620017
16B
Reserved
0x02620018
0x0262001B
4B
JTAGID
0x0262001C
0x0262001F
4B
Reserved
0x02620020
0x02620023
4B
DEVSTAT
0x02620024
0x02620037
20B
Reserved
0x02620038
0x0262003B
4B
KICK0
0x0262003C
0x0262003F
4B
KICK1
0x02620040
0x02620043
4B
DSP_BOOT_ADDR0
The boot address for C66x DSP CorePac0
0x02620044
0x02620047
4B
DSP_BOOT_ADDR1
The boot address for C66x DSP CorePac1 (C6657) or
Reserved (C6655)
0x02620048
0x0262004B
4B
Reserved
0x0262004C
0x0262004F
4B
Reserved
0x02620050
0x02620053
4B
Reserved
0x02620054
0x02620057
4B
Reserved
0x02620058
0x0262005B
4B
Reserved
0x0262005C
0x0262005F
4B
Reserved
0x02620060
0x026200DF
128B
Reserved
0x026200E0
0x0262010F
48B
Reserved
0x02620110
0x02620117
8B
MACID
0x02620118
0x0262012F
24B
Reserved
0x02620130
0x02620133
4B
LRSTNMIPINSTAT_CLR
See Section 8.3.6.
0x02620134
0x02620137
4B
RESET_STAT_CLR
See Section 8.3.8.
0x02620138
0x0262013B
4B
Reserved
0x0262013C
0x0262013F
4B
BOOTCOMPLETE
0x02620140
0x02620143
4B
Reserved
0x02620144
0x02620147
4B
RESET_STAT
See Section 8.3.7.
0x02620148
0x0262014B
4B
LRSTNMIPINSTAT
See Section 8.3.5.
0x0262014C
0x0262014F
4B
DEVCFG
See Section 8.3.2.
0x02620150
0x02620153
4B
PWRSTATECTL
See Section 8.3.10.
0x02620154
0x02620157
4B
SRIO_SERDES_STS
See Section 10.3.
DESCRIPTION
See Section 8.3.3.
See Section 8.3.1.
See Section 8.3.4.
See Section 6.15.
See Section 8.3.9.
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Table 8-2. Device State Control Registers (continued)
ADDRESS
START
ADDRESS END SIZE
FIELD
DESCRIPTION
0x02620158
0x0262015B
4B
SGMII_SERDES_STS
See Section 10.3.
0x0262015C
0x0262015F
4B
PCIE_SERDES_STS
0x02620160
0x02620163
4B
HYPERLINK_SERDES_STS
0x02620164
0x02620167
4B
Reserved
0x02620168
0x0262016B
4B
Reserved
0x0262016C
0x0262016F
4B
UPP_CLOCK
0x02620170
0x02620183
20B
Reserved
0x02620184
0x0262018F
12B
Reserved
0x02620190
0x02620193
4B
Reserved
0x02620194
0x02620197
4B
Reserved
0x02620198
0x0262019B
4B
Reserved
0x0262019C
0x0262019F
4B
Reserved
0x026201A0
0x026201A3
4B
Reserved
0x026201A4
0x026201A7
4B
Reserved
0x026201A8
0x026201AB
4B
Reserved
0x026201AC
0x026201AF
4B
Reserved
0x026201B0
0x026201B3
4B
Reserved
0x026201B4
0x026201B7
4B
Reserved
0x026201B8
0x026201BB
4B
Reserved
0x026201BC
0x026201BF
4B
Reserved
0x026201C0
0x026201C3
4B
Reserved
0x026201C4
0x026201C7
4B
Reserved
0x026201C8
0x026201CB
4B
Reserved
0x026201CC
0x026201CF
4B
Reserved
0x026201D0
0x026201FF
48B
Reserved
0x02620200
0x02620203
4B
NMIGR0
See Section 8.3.11.
0x02620204
0x02620207
4B
NMIGR1
See Section 8.3.11.(C6657) or Reserved (C6655))
0x02620208
0x0262020B
4B
Reserved
0x0262020C
0x0262020F
4B
Reserved
0x02620210
0x02620213
4B
Reserved
0x02620214
0x02620217
4B
Reserved
0x02620218
0x0262021B
4B
Reserved
0x0262021C
0x0262021F
4B
Reserved
0x02620220
0x0262023F
32B
Reserved
0x02620240
0x02620243
4B
IPCGR0
See Section 8.3.12.
0x02620244
0x02620247
4B
IPCGR1
See Section 8.3.12. (C6657) or Reserved (C6655))
0x02620248
0x0262024B
4B
Reserved
0x0262024C
0x0262024F
4B
Reserved
0x02620250
0x02620253
4B
Reserved
0x02620254
0x02620257
4B
Reserved
0x02620258
0x0262025B
4B
Reserved
0x0262025C
0x0262025F
4B
Reserved
0x02620260
0x0262027B
28B
Reserved
0x0262027C
0x0262027F
4B
IPCGRH
See Section 8.3.14.
0x02620280
0x02620283
4B
IPCAR0
See Section 8.3.13.
0x02620284
0x02620287
4B
IPCAR1
See Section 8.3.13. (C6657) or Reserved (C6655))
0x02620288
0x0262028B
4B
Reserved
202
Device Configuration
See Section 10.3.
See Section 8.3.22.
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Table 8-2. Device State Control Registers (continued)
ADDRESS
START
ADDRESS END SIZE
FIELD
0x0262028C
0x0262028F
4B
Reserved
0x02620290
0x02620293
4B
Reserved
0x02620294
0x02620297
4B
Reserved
0x02620298
0x0262029B
4B
Reserved
0x0262029C
0x0262029F
4B
Reserved
0x026202A0
0x026202BB
28B
Reserved
0x026202BC
0x026202BF
4B
IPCARH
0x026202C0
0x026202FF
64B
Reserved
0x02620300
0x02620303
4B
TINPSEL
See Section 8.3.16.
0x02620304
0x02620307
4B
TOUTPSEL
See Section 8.3.17.
0x02620308
0x0262030B
4B
RSTMUX0
See Section 8.3.18.
0x0262030C
0x0262030F
4B
RSTMUX1
See Section 8.3.18. (C6657) or Reserved (C6655))
0x02620310
0x02620313
4B
Reserved
0x02620314
0x02620317
4B
Reserved
0x02620318
0x0262031B
4B
Reserved
0x0262031C
0x0262031F
4B
Reserved
0x02620320
0x02620323
4B
Reserved
0x02620324
0x02620327
4B
Reserved
0x02620328
0x0262032B
4B
MAINPLLCTL0
0x0262032C
0x0262032F
4B
MAINPLLCTL1
0x02620330
0x02620333
4B
DDR3PLLCTL0
0x02620334
0x02620337
4B
DDR3PLLCTL1
0x02620338
0x0262033B
4B
Reserved
0x0262033C
0x0262033F
4B
Reserved
0x02620340
0x02620343
4B
SGMII_SERDES_CFGPLL
0x02620344
0x02620347
4B
SGMII_SERDES_CFGRX0
0x02620348
0x0262034B
4B
SGMII_SERDES_CFGTX0
0x0262034C
0x0262034F
4B
Reserved
0x02620350
0x02620353
4B
Reserved
0x02620354
0x02620357
4B
Reserved
0x02620358
0x0262035B
4B
PCIE_SERDES_CFGPLL
0x0262035C
0x0262035F
4B
Reserved
0x02620360
0x02620363
4B
SRIO_SERDES_CFGPLL
0x02620364
0x02620367
4B
SRIO_SERDES_CFGRX0
0x02620368
0x0262036B
4B
SRIO_SERDES_CFGTX0
0x0262036C
0x0262036F
4B
SRIO_SERDES_CFGRX1
0x02620370
0x02620373
4B
SRIO_SERDES_CFGTX1
0x02620374
0x02620377
4B
SRIO_SERDES_CFGRX2
0x02620378
0x0262037B
4B
SRIO_SERDES_CFGTX2
0x0262037C
0x0262037F
4B
SRIO_SERDES_CFGRX3
0x02620380
0x02620383
4B
SRIO_SERDES_CFGTX3
0x02620384
0x02620387
8B
Reserved
0x02620388
0x026203AF
28B
Reserved
0x026203B0
0x026203B3
4B
Reserved
DESCRIPTION
See Section 8.3.15.
See Section 6.6.
See Section 6.7.
See Section 10.3.
See Section 10.3.
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Table 8-2. Device State Control Registers (continued)
ADDRESS
START
ADDRESS END SIZE
FIELD
DESCRIPTION
0x026203B4
0x026203B7
4B
HYPERLINK_SERDES_CFG
PLL
See Section 10.3.
0x026203B8
0x026203BB
4B
HYPERLINK_SERDES_CFG
RX0
0x026203BC
0x026203BF
4B
HYPERLINK_SERDES_CFG
TX0
0x026203C0
0x026203C3
4B
HYPERLINK_SERDES_CFG
RX1
0x026203C4
0x026203C7
4B
HYPERLINK_SERDES_CFG
TX1
0x026203C8
0x026203CB
4B
HYPERLINK_SERDES_CFG
RX2
0x026203CC
0x026203CF
4B
HYPERLINK_SERDES_CFG
TX2
0x026203D0
0x026203D3
4B
HYPERLINK_SERDES_CFG
RX3
0x026203D4
0x026203D7
4B
HYPERLINK_SERDES_CFG
TX3
0x026203D8
0x026203DB
4B
Reserved
0x026203DC
0x026203F7
28B
Reserved
0x026203F8
0x026203FB
4B
DEVSPEED
0x026203FC
0x026203FF
4B
Reserved
0x02620400
0x02620403
4B
CHIP_MISC_CTL
0x02620404
0x02620467
100B
Reserved
0x02620468
0x0262057f
280B
Reserved
0x02620580
0x02620583
4B
PIN_CONTROL_0
See Section 8.3.20.
0x02620584
0x02620587
4B
PIN_CONTROL_1
See Section 8.3.21.
0x02620588
0x0262058B
4B
EMAC_UPP_PRI_ALLOC
See Section 9.4.
204
Device Configuration
See Section 8.3.19.
See Section 9.4.
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8.3.1
SPRS814D – MARCH 2012 – REVISED OCTOBER 2019
Device Status Register
The Device Status Register depicts the device configuration selected upon a power-on reset by either the
POR or RESETFULL pin. Once set, these bits will remain set until the next power-on reset. The Device
Status Register is shown in Figure 8-1 and described in Table 8-3.
Figure 8-1. Device Status Register
31
17
16
15
14
Reserved
PCIESSEN
PCIESSMODE
[1:0]
R-0
R-x (1)
R/W-xx (1)
13
1
0
BOOTMODE[12:0]
LENDIAN
R/W-xxxxxxxxxxxx (1)
R-x (1)
Legend: R = Read only; RW = Read/Write; -n = value after reset
(1)
x indicates the bootstrap value latched through the external pin
Table 8-3. Device Status Register Field Descriptions
BIT
FIELD
31-17 Reserved
PCIESSEN
16
DESCRIPTION
Reserved. Read only, writes have no effect.
PCIe module enable
•
0 = PCIe module disabled
•
1 = PCIe module enabled
PCIESSMODE[1:0] PCIe Mode selection pins
•
00b = PCIe in End-point mode
15-14
•
01b = PCIe in Legacy End-point mode (support for legacy INTx)
•
10b = PCIe in Root complex mode
•
11b = Reserved
13-1
0
BOOTMODE[12:0]
Determines the bootmode configured for the device. For more information on bootmode, see Section 6.28 and
see the Bootloader for the C66x DSP User's Guide
LENDIAN
Device Endian mode (LENDIAN) — Shows the status of whether the system is operating in Big Endian mode
or Little Endian mode.
•
0 = System is operating in Big Endian mode
•
1 = System is operating in Little Endian mode
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Device Configuration Register
The Device Configuration Register is one-time writeable through software. The register is reset on all hard
resets and is locked after the first write. The Device Configuration Register is shown in Figure 8-2 and
described in Table 8-4.
Figure 8-2. Device Configuration Register (DEVCFG)
31
1
0
Reserved
SYSCLKOUTEN
R-0
R/W-1
Legend: R = Read only; RW = Read/Write; -n = value after reset
Table 8-4. Device Configuration Register Field Descriptions
BIT
FIELD
DESCRIPTION
31-1
Reserved
Reserved. Read only, writes have no effect.
0
SYSCLKOUTEN
SYSCLKOUT Enable
•
0 = No clock output
•
1 = Clock output enabled (default)
206
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8.3.3
SPRS814D – MARCH 2012 – REVISED OCTOBER 2019
JTAG ID (JTAGID) Register Description
The JTAG ID register is a read-only register that identifies to the customer the JTAG/Device ID. For the
device, the JTAG ID register resides at address location 0x0262 0018. The JTAG ID Register is shown in
Figure 8-3 and described in Table 8-5.
Figure 8-3. JTAG ID (JTAGID) Register
31
28
27
12
11
1
0
VARIANT
PART NUMBER
MANUFACTURER
LSB
R-xxxxb
R-1011 1001 0111 1010b
0000 0010 111b
R-1
Legend: RW = Read/Write; R = Read only; -n = value after reset
Table 8-5. JTAG ID Register Field Descriptions
BIT
FIELD
VALUE
DESCRIPTION
31-28
VARIANT
xxxxb
Variant (4-Bit) value.
27-12
PART NUMBER
1011 1001 0111 1010b
Part Number for boundary scan
11-1
MANUFACTURER
0000 0010 111b
Manufacturer
0
LSB
1b
This bit is read as a 1 for C665x
NOTE
The value of the VARIANT and PART NUMBER fields depend on the silicon revision. See
the Silicon Errata for details.
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Kicker Mechanism (KICK0 and KICK1) Register
The Bootcfg module contains a kicker mechanism to prevent any spurious writes from changing any of the
Bootcfg MMR values. When the kicker is locked (which it is initially after power on reset), none of the
Bootcfg MMRs are writable (they are only readable). On the C665x, the exceptions to this are the IPC
registers such as IPCGRx and IPCARx. These registers are not protected by the kicker mechanism. This
mechanism requires two MMR writes to the KICK0 and KICK1 registers with exact data values before the
kicker lock mechanism is unlocked. See Table 8-2 for the address location. Once released, then all the
Bootcfg MMRs having write permissions are writable (the read only MMRs are still read only). The first
KICK0 data is 0x83e70b13. The second KICK1 data is 0x95a4f1e0. Writing any other data value to either
of these kick MMRs will lock the kicker mechanism and block any writes to Bootcfg MMRs. To ensure
protection of all Bootcfg MMRs, software must always relock the kicker mechanism after completing the
MMR writes.
8.3.5
LRESETNMI PIN Status (LRSTNMIPINSTAT) Register
The LRSTNMIPINSTAT Register is created in Boot Configuration to latch the status of LRESET and NMI
based on CORESEL. The LRESETNMI PIN Status Register is shown in Figure 8-4 and described in
Table 8-6.
Figure 8-4. LRESETNMI PIN Status Register (LRSTNMIPINSTAT)
31
17
16
1
0
Reserved
18
NMI1/Reserved
NMI0
15
Reserved
2
LR1
LR0
R, +0000 0000
R,+0
R,+0
R, +0000 0000
R,+0
R,+0
Legend: R = Read only; -n = value after reset;
Table 8-6. LRESETNMI PIN Status Register (LRSTNMIPINSTAT) Field Descriptions
BIT
FIELD
DESCRIPTION
31-18
Reserved
Reserved
17
NMI1/Reserved
CorePac1 in NMI (C6657) or Reserved (C6655)
16
NMI0
CorePac0 in NMI
15-2
Reserved
Reserved
1
LR1/Reserved
CorePac1 in Local Reset (C6657) or Reserved (C6655)
0
LR0
CorePac0 in Local Reset
208
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8.3.6
SPRS814D – MARCH 2012 – REVISED OCTOBER 2019
LRESETNMI PIN Status Clear (LRSTNMIPINSTAT_CLR) Register
The LRSTNMIPINSTAT_CLR Register is used to clear the status of LRESET and NMI based on
CORESEL. The LRESETNMI PIN Status Clear Register is shown in Figure 8-5 and described
in Table 8-7.
Figure 8-5. LRESETNMI PIN Status Clear Register (LRSTNMIPINSTAT_CLR)
31
17
16
1
0
Reserved
18
NMI1/Reserved
NMI0
15
Reserved
2
LR1/Reserved
LR0
R, +0000 0000
WC,+0
WC,+0
R, +0000 0000
WC,+0
WC,+0
Legend: R = Read only; -n = value after reset; WC = Write 1 to Clear
Table 8-7. LRESETNMI PIN Status Clear Register (LRSTNMIPINSTAT_CLR) Field Descriptions
BIT
FIELD
DESCRIPTION
31-18
Reserved
Reserved
17
NMI1/Reserved
CorePac1 in NMI Clear (C6657) or Reserved (C6655)
16
NMI0
CorePac0 in NMI Clear
15-2
Reserved
Reserved
1
LR1/Reserved
CorePac1 in Local Reset Clear (C6657) or Reserved (C6655)
0
LR0
CorePac0 in Local Reset Clear
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Reset Status (RESET_STAT) Register
The reset status register (RESET_STAT) captures the status of Local reset (LRx) for each of the cores
and also the global device reset (GR). Software can use this information to take different device
initialization steps, if desired.
•
•
In case of Local reset: The LRx bits are written as 1 and GR bit is written as 0 only when the CorePac receives a
local reset without receiving a global reset.
In case of Global reset: The LRx bits are written as 0 and GR bit is written as 1 only when a global reset is
asserted.
The Reset Status Register is shown in Figure 8-6 and described in Table 8-8.
Figure 8-6. Reset Status Register (RESET_STAT)
1
0
GR
31
30
Reserved
2
LR1/Reserved
LR0
R, +1
R, + 000 0000 0000 0000 0000 0000
R,+0
R,+0
Legend: R = Read only; -n = value after reset
Table 8-8. Reset Status Register (RESET_STAT) Field Descriptions
BIT
FIELD
DESCRIPTION
31
GR
Global reset status
•
0 = Device has not received a global reset.
•
1 = Device received a global reset.
30-2
Reserved
Reserved.
1
LR1/Reserved
CorePac1 reset status (C6657) or Reserved (C6655)
•
0 = CorePac1 has not received a local reset.
•
1 = CorePac1 received a local reset.
0
LR0
CorePac0 reset status
•
0 = CorePac0 has not received a local reset.
•
1 = CorePac0 received a local reset.
210
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8.3.8
SPRS814D – MARCH 2012 – REVISED OCTOBER 2019
Reset Status Clear (RESET_STAT_CLR) Register
The RESET_STAT bits can be cleared by writing 1 to the corresponding bit in the RESET_STAT_CLR
register. The Reset Status Clear Register is shown in Figure 8-7 and described in Table 8-9.
Figure 8-7. Reset Status Clear Register (RESET_STAT_CLR)
1
0
GR
31
30
Reserved
2
LR1/Reserved
LR0
RW, +0
R, + 000 0000 0000 0000 0000 0000
RW,+0
RW,+0
Legend: R = Read only; RW = Read/Write; -n = value after reset
Table 8-9. Reset Status Clear Register (RESET_STAT_CLR) Field Descriptions
BIT
FIELD
DESCRIPTION
31
GR
Global reset clear bit
•
0 = Writing 0 has no effect.
•
1 = Writing 1 to the GR bit clears the corresponding bit in the RESET_STAT register.
30-2
Reserved
Reserved.
1
LR1/Reserved
CorePac1 reset clear bit (C6657) or Reserved (C6655)
•
0 = Writing 0 has no effect.
•
1 = Writing 1 to the LR1 bit clears the corresponding bit in the RESET_STAT register.
0
LR0
CorePac0 reset clear bit
•
0 = Writing 0 has no effect.
•
1 = Writing 1 to the LR0 bit clears the corresponding bit in the RESET_STAT register.
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Boot Complete (BOOTCOMPLETE) Register
The BOOTCOMPLETE register controls the BOOTCOMPLETE pin status. The purpose is to indicate the
completion of the ROM booting process. The Boot Complete Register is shown in Figure 8-8 and
described Table 8-10.
Figure 8-8. Boot Complete Register (BOOTCOMPLETE)
31
1
0
Reserved
2
BC1/Reserved
BC0
R, + 0000 0000 0000 0000 0000 0000
RW,+0
RW,+0
Legend: R = Read only; RW = Read/Write; -n = value after reset
Table 8-10. Boot Complete Register (BOOTCOMPLETE) Field Descriptions
BIT
FIELD
DESCRIPTION
31-2
Reserved
Reserved.
1
BC1
CorePac1 boot status (C6657) or Reserved (C6655)
•
0 = CorePac1 boot NOT complete
•
1 = CorePac1 boot complete
0
BC0
CorePac0 boot status
•
0 = CorePac0 boot NOT complete
•
1 = CorePac0 boot complete
The BCx bit indicates the boot complete status of the corresponding core. All BCx bits will be sticky bits —
that is, they can be set only once by the software after device reset and they will be cleared to 0 on all
device resets.
Boot ROM code will be implemented such that each core will set its corresponding BCx bit immediately
before branching to the predefined location in memory.
212
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8.3.10 Power State Control (PWRSTATECTL) Register
The PWRSTATECTL register is controlled by the software to indicate the power-saving mode. ROM code
reads this register to differentiate between the various power saving modes. This register is cleared only
by POR and will survive all other device resets. See the Hardware Design Guide for KeyStone Devices for
more information. The Power State Control Register is shown in Figure 8-9 and described in Table 8-11.
Figure 8-9. Power State Control Register (PWRSTATECTL)
31
2
1
0
GENERAL_PURPOSE
3
HIBERNATION
_MODE
HIBERNATION
STANDBY
RW, +0000 0000 0000 0000 0000 0000 0000 0
RW,+0
RW,+0
RW,+0
Legend: RW = Read/Write; -n = value after reset
Table 8-11. Power State Control Register (PWRSTATECTL) Field Descriptions
BIT
FIELD
DESCRIPTION
31-3
GENERAL_PURPOSE
Used to provide a start address for execution out of the hibernation modes. See the Bootloader for the
C66x DSP User's Guide.
2
HIBERNATION_MODE
Indicates whether the device is in hibernation mode 1 or mode 2.
•
0 = Hibernation mode 1
•
1 = Hibernation mode 2
1
HIBERNATION
Indicates whether the device is in hibernation mode or not.
•
0 = Not in hibernation mode
•
1 = Hibernation mode
0
STANDBY
Indicates whether the device is in standby mode or not.
•
0 = Not in standby mode
•
1 = Standby mode
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8.3.11 NMI Event Generation to CorePac (NMIGRx) Register
NMIGRx registers are used for generating NMI events to the corresponding CorePac. The C6657 has two
NMIGRx registers (NMIGR0 and NMIGR1) while the C6655 has only NMIGR0. The NMIGR0 register
generates an NMI event to CorePac0, and the NMIGR1 register generates an NMI event to CorePac1.
Writing 1 to the NMIG field generates an NMI pulse. Writing 0 has no effect and reads return 0 and have
no other effect. The NMI Event Generation to CorePac Register is shown in Figure 8-10 and described in
Table 8-12.
Figure 8-10. NMI Generation Register (NMIGRx)
31
1
0
Reserved
NMIG
R, +0000 0000 0000 0000 0000 0000 0000 000
RW,+0
Legend: RW = Read/Write; -n = value after reset
Table 8-12. NMI Generation Register (NMIGRx) Field Descriptions
BIT
FIELD
DESCRIPTION
31-1
Reserved
Reserved
0
NMIG
NMI pulse generation.
Reads return 0
Writes:
•
0 = No effect
•
1 = Sends an NMI pulse to the corresponding CorePac — CorePac0 for NMIGR0, and so forth.
214
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8.3.12 IPC Generation (IPCGRx) Registers
IPCGRx are the IPC interrupt generation registers to facilitate inter CorePac interrupts.
The C6657 has two IPCGRx registers (IPCGR0 and IPCGR1) while the C6655 has only IPCGR0. These
registers can be used by external hosts or CorePacs to generate interrupts to other CorePacs. A write of 1
to the IPCG field of the IPCGRx register will generate an interrupt pulse to CorePacx (0 <= x <= 1).
These registers also provide a Source ID facility by which up to 28 different sources of interrupts can be
identified. Allocation of source bits to source processor and meaning is entirely based on software
convention. The register field descriptions are given in the following tables. Virtually anything can be a
source for these registers as this is completely controlled by software. Any master that has access to
BOOTCFG module space can write to these registers. The IPC Generation Register is shown in Figure 811 and described in Table 8-13.
Figure 8-11. IPC Generation Registers (IPCGRx)
31
30
29
28
SRCS
27
SRCS
26
SRCS
25
SRCS
24
27
SRCS23 – SRCS4
8
RW +0
RW +0
RW +0
RW +0
RW +0 (per bit field)
7
6
5
4
SRCS3 SRCS2 SRCS1 SRCS0
RW +0
RW +0
RW +0
RW +0
3
1
0
Reserved
IPCG
R, +000
RW +0
Legend: R = Read only; RW = Read/Write; -n = value after reset
Table 8-13. IPC Generation Registers (IPCGRx) Field Descriptions
BIT
FIELD
DESCRIPTION
31-4
SRCSx
Interrupt source indication.
Reads return current value of internal register bit.
Writes:
•
0 = No effect
•
1 = Sets both SRCSx and the corresponding SRCCx.
3-1
Reserved
Reserved
0
IPCG
Inter-DSP interrupt generation.
Reads return 0.
Writes:
•
0 = No effect
•
1 = Creates an Inter-DSP interrupt.
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8.3.13 IPC Acknowledgement (IPCARx) Registers
IPCARx are the IPC interrupt-acknowledgement registers to facilitate inter-CorePac core interrupts.
The C6657 has two IPCARx registers (IPCAR0 and IPCAR1) while the C6655 has only IPCAR0. These
registers also provide a Source ID facility by which up to 28 different sources of interrupts can be
identified. Allocation of source bits to source processor and meaning is entirely based on software
convention. The register field descriptions are shown in the following tables. Virtually anything can be a
source for these registers as this is completely controlled by software. Any master that has access to
BOOTCFG module space can write to these registers. The IPC Acknowledgement Register is shown in
Figure 8-12 and described in Table 8-14.
Figure 8-12. IPC Acknowledgement Registers (IPCARx)
31
30
29
28
27
8
7
6
SRCC
27
SRCC
26
SRCC
25
SRCC
24
SRCC23 – SRCC4
SRCC3 SRCC2 SRCC1 SRCC0
Reserved
RW +0
RW +0
RW +0
RW +0
RW +0 (per bit field)
RW +0
R, +0000
RW +0
5
RW +0
4
RW +0
3
0
Legend: R = Read only; RW = Read/Write; -n = value after reset
Table 8-14. IPC Acknowledgement Registers (IPCARx) Field Descriptions
BIT
FIELD
DESCRIPTION
31-4
SRCCx
Interrupt source acknowledgement.
Reads return current value of internal register bit.
Writes:
•
0 = No effect
•
1 = Clears both SRCCx and the corresponding SRCSx
3-0
216
Reserved
Reserved
Device Configuration
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8.3.14 IPC Generation Host (IPCGRH) Register
The IPCGRH register facilitates interrupts to external hosts. Operation and use of the IPCGRH register is
the same as for other IPCGR registers. The interrupt output pulse created by the IPCGRH register
appears on device pin HOUT.
The host interrupt output pulse should be stretched. It should be asserted for 4 bootcfg clock cycles
(CPU/6) followed by a deassertion of 4 bootcfg clock cycles. Generating the pulse will result in 8 CPU/6
cycle pulse blocking window. Write to IPCGRH with IPCG bit (bit 0) set will only generate a pulse if they
are beyond 8 CPU/6 cycle period. The IPC Generation Host Register is shown in Figure 8-13 and
described in Table 8-15.
Figure 8-13. IPC Generation Registers (IPCGRH)
31
30
29
28
27
8
SRCS
27
SRCS
26
SRCS
25
SRCS
24
SRCS23 – SRCS4
RW +0
RW +0
RW +0
RW +0
RW +0 (per bit field)
7
6
5
4
3
SRCS3 SRCS2 SRCS1 SRCS0
RW +0
RW +0
RW +0
RW +0
1
0
Reserved
IPCG
R, +000
RW +0
Legend: R = Read only; RW = Read/Write; -n = value after reset
Table 8-15. IPC Generation Registers (IPCGRH) Field Descriptions
BIT
FIELD
DESCRIPTION
31-4
SRCSx
Interrupt source indication.
Reads return current value of internal register bit.
Writes:
•
0 = No effect
•
1 = Sets both SRCSx and the corresponding SRCCx.
3-1
Reserved
Reserved
0
IPCG
Host interrupt generation.
Reads return 0.
Writes:
•
0 = No effect
•
1 = Creates an interrupt pulse on device pin (host interrupt/event output in HOUT pin)
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8.3.15 IPC Acknowledgement Host (IPCARH) Register
IPCARH registers are provided to facilitate host DSP interrupt. Operation and use of IPCARH is the same
as other IPCAR registers. The IPC Acknowledgement Host Register is shown in Figure 8-14 and
described in Table 8-16.
Figure 8-14. IPC Acknowledgement Register (IPCARH)
31
30
29
28
SRCC
27
SRCC
26
SRCC
25
SRCC
24
27
SRCC23 – SRCC4
8
SRCC3 SRCC2 SRCC1 SRCC0
7
6
Reserved
RW +0
RW +0
RW +0
RW +0
RW +0 (per bit field)
RW +0
R, +0000
RW +0
5
RW +0
4
RW +0
3
0
Legend: R = Read only; RW = Read/Write; -n = value after reset
Table 8-16. IPC Acknowledgement Register (IPCARH) Field Descriptions
BIT
FIELD
DESCRIPTION
31-4
SRCCx
Interrupt source acknowledgement.
Reads return current value of internal register bit.
Writes:
•
0 = No effect
•
1 = Clears both SRCCx and the corresponding SRCSx
3-0
218
Reserved
Reserved
Device Configuration
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8.3.16 Timer Input Selection Register (TINPSEL)
Timer input selection is handled within the control register TINPSEL. The Timer Input Selection Register is
shown in Figure 8-15 and described in Table 8-17.
Figure 8-15. Timer Input Selection Register (TINPSEL)
31
16
Reserved
R, +1010 1010 1010 1010
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
TINPH
SEL7
TINPL
SEL7
TINPH
SEL6
TINPL
SEL6
TINPH
SEL5
TINPL
SEL5
TINPH
SEL4
TINPL
SEL4
TINPH
SEL3
TINPL
SEL3
TINPH
SEL2
TINPL
SEL2
TINPH
SEL1
TINPL
SEL1
TINPH
SEL0
TINPL
SEL0
RW,
+1
RW,
+0
RW,
+1
RW,
+0
RW,
+1
RW,
+0
RW,
+1
RW,
+0
RW,
+1
RW,
+0
RW,
+1
RW,
+0
RW,
+1
RW,
+0
RW,
+1
RW,
+0
Legend: R = Read only; RW = Read/Write; -n = value after reset
Table 8-17. Timer Input Selection Field Description (TINPSEL)
BIT
FIELD
DESCRIPTION
31-16
Reserved
•
15
TINPHSEL7
Input select for TIMER7 high.
•
0 = TIMI0
•
1 = TIMI1
14
TINPLSEL7
Input select for TIMER7 low.
•
0 = TIMI0
•
1 = TIMI1
13
TINPHSEL6
Input select for TIMER6 high.
•
0 = TIMI0
•
1 = TIMI1
12
TINPLSEL6
Input select for TIMER6 low.
•
0 = TIMI0
•
1 = TIMI1
11
TINPHSEL5
Input select for TIMER5 high.
•
0 = TIMI0
•
1 = TIMI1
10
TINPLSEL5
Input select for TIMER5 low.
•
0 = TIMI0
•
1 = TIMI1
9
TINPHSEL4
Input select for TIMER4 high.
•
0 = TIMI0
•
1 = TIMI1
8
TINPLSEL4
Input select for TIMER4 low.
•
0 = TIMI0
•
1 = TIMI1
7
TINPHSEL3
Input select for TIMER3 high.
•
0 = TIMI0
•
1 = TIMI1
6
TINPLSEL3
Input select for TIMER3 low.
•
0 = TIMI0
•
1 = TIMI1
5
TINPHSEL2
Input select for TIMER2 high.
•
0 = TIMI0
•
1 = TIMI1
Reserved
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Table 8-17. Timer Input Selection Field Description (TINPSEL) (continued)
BIT
FIELD
DESCRIPTION
4
TINPLSEL2
Input select for TIMER2 low.
•
0 = TIMI0
•
1 = TIMI1
3
TINPHSEL1
Input select for TIMER1 high.
•
0 = TIMI0
•
1 = TIMI1
2
TINPLSEL1
Input select for TIMER1 low.
•
0 = TIMI0
•
1 = TIMI1
1
TINPHSEL0
Input select for TIMER0 high.
•
0 = TIMI0
•
1 = TIMI1
0
TINPLSEL0
Input select for TIMER0 low.
•
0 = TIMI0
•
1 = TIMI1
220
Device Configuration
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8.3.17 Timer Output Selection Register (TOUTPSEL)
The timer output selection is handled within the control register TOUTSEL. The Timer Output Selection
Register is shown in Figure 8-16 and described in Table 8-18.
Figure 8-16. Timer Output Selection Register (TOUTPSEL)
31
10
9
5
4
0
Reserved
TOUTPSEL1
TOUTPSEL0
R,+000000000000000000000000
RW,+00001
RW,+00000
Legend: R = Read only; RW = Read/Write; -n = value after reset
Table 8-18. Timer Output Selection Field Description (TOUTPSEL)
BIT
FIELD
DESCRIPTION
31-10
Reserved
Reserved
9-5
TOUTPSEL1
Output select for TIMO1
•
0x0: TOUTL0
•
0x1: TOUTH0
•
0x2: TOUTL1
•
0x3: TOUTH1
•
0x4: TOUTL2
•
0x5: TOUTH2
•
0x6: TOUTL3
•
0x7: TOUTH3
•
0x8: TOUTL4
•
•
•
•
•
•
•
•
0x9: TOUTH4
0xA: TOUTL5
0xB: TOUTH5
0xC: TOUTL6
0xD: TOUTH6
0xE: TOUTL7
0xF: TOUTH7
0x10 to 0x1F: Reserved
4-0
TOUTPSEL0
Output select for TIMO0
•
0x0: TOUTL0
•
0x1: TOUTH0
•
0x2: TOUTL1
•
0x3: TOUTH1
•
0x4: TOUTL2
•
0x5: TOUTH2
•
0x6: TOUTL3
•
0x7: TOUTH3
•
0x8: TOUTL4
•
•
•
•
•
•
•
•
0x9: TOUTH4
0xA: TOUTL5
0xB: TOUTH5
0xC: TOUTL6
0xD: TOUTH6
0xE: TOUTL7
0xF: TOUTH7
0x10 to 0x1F: Reserved
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8.3.18 Reset Mux (RSTMUXx) Register
The software controls the Reset Mux block through the reset multiplex registers using RSTMUX0 through
RSTMUX1 for each of the two CorePacs on the C6657. The C6655 has only RSTMUX0. These registers
arelocated in Bootcfg memory space. The Reset Mux Register is shown in Figure 8-17 and described in
Table 8-19.
Figure 8-17. Reset Mux Register RSTMUXx
31
9
8
Reserved
10
EVTSTATCLR
Reserved
7
DELAY
5
EVTSTAT
4
3
OMODE
1
LOCK
0
R, +0000 0000 0000 0000 0000
00
RC, +0
R, +0
RW, +100
R, +0
RW, +000
RW, +0
Legend: R = Read only; RW = Read/Write; -n = value after reset; RC = Read only and write 1 to clear
Table 8-19. Reset Mux Register Field Descriptions
BIT
FIELD
DESCRIPTION
31-10
Reserved
Reserved
9
EVTSTATCLR
Clear event status
•
0 = Writing 0 has no effect
•
1 = Writing 1 clears the EVTSTAT bit
8
Reserved
Reserved
7-5
DELAY
Delay cycles between NMI and local reset
•
000b = 256 CPU/6 cycles delay between NMI and local reset, when OMODE = 100b
•
001b = 512 CPU/6 cycles delay between NMI and local reset, when OMODE=100b
•
010b = 1024 CPU/6 cycles delay between NMI and local reset, when OMODE=100b
•
011b = 2048 CPU/6 cycles delay between NMI and local reset, when OMODE=100b
•
100b = 4096 CPU/6 cycles delay between NMI and local reset, when OMODE=100b (Default)
•
101b = 8192 CPU/6 cycles delay between NMI and local reset, when OMODE=100b
•
110b = 16384 CPU/6 cycles delay between NMI and local reset, when OMODE=100b
•
111b = 32768 CPU/6 cycles delay between NMI and local reset, when OMODE=100b
4
EVTSTAT
Event status.
•
0 = No event received (Default)
•
1 = WD timer event received by Reset Mux block
3-1
OMODE
Timer event operation mode
•
000b = WD timer event input to the reset mux block does not cause any output event (default)
•
001b = Reserved
•
010b = WD timer event input to the reset mux block causes local reset input to CorePac
•
011b = WD timer event input to the reset mux block causes NMI input to CorePac
•
100b = WD timer event input to the reset mux block causes NMI input followed by local reset input to
CorePac. Delay between NMI and local reset is set in DELAY bit field.
•
101b = WD timer event input to the reset mux block causes device reset to C665x
•
110b = Reserved
•
111b = Reserved
0
LOCK
Lock register fields
•
0 = Register fields are not locked (default)
•
1 = Register fields are locked until the next timer reset
222
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8.3.19 Device Speed (DEVSPEED) Register
The Device Speed Register indicates the device speed grade. The Device Speed Register is shown in
Figure 8-18 and described in Table 8-20.
Figure 8-18. Device Speed Register (DEVSPEED)
31
30
23
22
0
Reserved
DEVSPEED
Reserved
R-n
R-n
R-n
Legend: R = Read only; RW = Read/Write; -n = value after reset
Table 8-20. Device Speed Register Field Descriptions
BIT
FIELD
DESCRIPTION
31
Reserved
Reserved. Read only
30-23
DEVSPEED
Indicates the speed of the device (Read Only)
•
1xxx xxxxb = 850 MHz
•
01xx xxxxb = 1000 MHz
•
001x xxxxb = 1250 MHz
•
0001 xxxxb = Reserved
•
0000 1xxxb = Reserved
•
0000 01xxb = 1250 MHz
•
0000 001xb = 1000 MHz
•
0000 0001b = 850 MHz
•
0000 0000b = 850 MHz
22-0
Reserved
Reserved. Read only
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8.3.20 Pin Control 0 (PIN_CONTROL_0) Register
The Pin Control 0 Register controls the pin muxing between GPIO[16:31] and TIMER / UART / SPI pins.
The Pin Control 0 Register is shown in Figure 8-19 and described in Table 8-21.
Figure 8-19. Pin Control 0 Register (PIN_CONTROL_0)
31
30
29
28
GPIO31_SPID
OUT_MUX
GPIO30_SPIDI
N_MUX
GPIO29_SPIC
S1_MUX
GPIO28_SPIC
S0_MUX
27
RW-0
RW-0
RW-0
RW-0
23
22
21
20
RW-0
GPIO23_UART GPIO22_UART GPIO21_UART GPIO20_UART
RTS0_MUX
CTS0_MUX
TX0_MUX
RX0_MUX
RW-0
RW-0
RW-0
26
25
24
GPIO27_UART GPIO26_UART GPIO25_UART GPIO24_UART
RTS1_MUX
CTS1_MUX
TX1_MUX
RX1_MUX
RW-0
RW-0
RW-0
19
18
17
16
GPIO19_TIMO
1_MUX
GPIO18_TIMO
0_MUX
GPIO17_TIMI1
_MUX
GPIO16_TIMI0
_MUX
RW-0
RW-0
RW-0
RW-0
RW-0
15
0
Reserved
R-0
Legend: R = Read only; RW = Read/Write; -n = value after reset
Table 8-21. Pin Control 0 Register Field Descriptions
BIT
FIELD
DESCRIPTION
31
GPIO31_SPIDOUT_MUX
SPI or GPIO mux control
•
0 = SPIDOUT pin enabled
•
1 = GPIO31 pin enabled
30
GPIO30_SPIDIN_MUX
SPI or GPIO mux control
•
0 = SPIDIN pin enabled
•
1 = GPIO30 pin enabled
29
GPIO29_SPICS1_MUX
SPI or GPIO mux control
•
0 = SPICS1 pin enabled
•
1 = GPIO29 pin enabled
28
GPIO28_SPICS0_MUX
SPI or GPIO mux control
•
0 = SPICS0 pin enabled
•
1 = GPIO28 pin enabled
27
GPIO27_UARTRTS1_MUX
UART or GPIO mux control
•
0 = UARTRTS1 pin enabled
•
1 = GPIO27 pin enabled
26
GPIO26_UARTCTS1_MUX
UART or GPIO mux control
•
0 = UARTCTS1 pin enabled
•
1 = GPIO26 pin enabled
25
GPIO25_UARTTX1_MUX
UART or GPIO mux control
•
0 = UARTTX1 pin enabled
•
1 = GPIO25 pin enabled
24
GPIO24_UARTRX1_MUX
UART or GPIO mux control
•
0 = UARTRX1 pin enabled
•
1 = GPIO24 pin enabled
23
GPIO23_UARTRTS0_MUX
UART or GPIO mux control
•
0 = UARTRTS0 pin enabled
•
1 = GPIO23 pin enabled
22
GPIO22_UARTCTS0_MUX
UART or GPIO mux control
•
0 = UARTCTS0 pin enabled
•
1 = GPIO22 pin enabled
21
GPIO21_UARTTX0_MUX
UART or GPIO mux control
•
0 = UARTTX0 pin enabled
•
1 = GPIO21 pin enabled
224
Device Configuration
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Table 8-21. Pin Control 0 Register Field Descriptions (continued)
BIT
FIELD
DESCRIPTION
20
GPIO20_UARTRX0_MUX
UART or GPIO mux control
•
0 = UARTRX0 pin enabled
•
1 = GPIO20 pin enabled
19
GPIO19_TIMO1_MUX
TIMER or GPIO mux control
•
0 = TIMO1 pin enabled
•
1 = GPIO19 pin enabled
18
GPIO18_TIMO0_MUX
TIMER or GPIO mux control
•
0 = TIMO0 pin enabled
•
1 = GPIO18 pin enabled
17
GPIO17_TIMI1_MUX
TIMER or GPIO mux control
•
0 = TIMI1 pin enabled
•
1 = GPIO17 pin enabled
16
GPIO16_TIMI0_MUX
TIMER or GPIO mux control
•
0 = TIMI0 pin enabled
•
1 = GPIO16 pin enabled
15-0
Reserved
Reserved
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8.3.21 Pin Control 1 (PIN_CONTROL_1) Register
The Pin Control 1 Register controls the pin muxing between uPP and EMIF16 pins. The Pin Control 1
Register is shown in Figure 8-20 and described in Table 8-22.
Figure 8-20. Pin Control 1Register (PIN_CONTROL_1)
31
1
0
Reserved
UPP_EMIF16_MUX
R-0
RW-0
Legend: R = Read only; RW = Read/Write; -n = value after reset
Table 8-22. Pin Control 1 Register Field Descriptions
BIT
FIELD
DESCRIPTION
31-1
Reserved
Reserved
0
UPP_EMIF_MUX
uPP or EMIF16 mux control
•
0 = EMIF16 pins enabled
•
1 = uPP pins enabled
226
Device Configuration
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8.3.22 uPP Clock Source (UPP_CLOCK) Register
The uPP Clock Source Register controls whether the uPP transmit clock is internally or externally
sourced. The uPP Clock Source Register is shown in Figure 8-21 and described in Table 8-23.
Figure 8-21. uPP Clock Source Register (UPP_CLOCK)
31
1
0
Reserved
UPP_TX_CLKSRC
R-0
RW-0
Legend: R = Read only; RW = Read/Write; -n = value after reset
Table 8-23. uPP Clock Source Register Field Descriptions
BIT
FIELD
DESCRIPTION
31-1
Reserved
Reserved
0
UPP_TX_CLKSRC
uPP clock source selection
•
0 = from internal SYSCLK4 (CPU/3)
•
1 = from external UPP_2XTXCLK pin
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8.4
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Pullup and Pulldown Resistors
Proper board design should ensure that input pins to the device always be at a valid logic level and not
floating. This may be achieved through pullup and pulldown resistors. The device features internal pullup
(IPU) and internal pulldown (IPD) resistors on most pins to eliminate the need, unless otherwise noted, for
external pullup and pulldown resistors.
An external pullup or pulldown resistor needs to be used in the following situations:
•
•
Device Configuration Pins: If the pin is both routed out and is not driven (in Hi-Z state), an external pullup or
pulldown resistor must be used, even if the IPU/IPD matches the desired value/state.
Other Input Pins: If the IPU/IPD does not match the desired value/state, use an external pullup or pulldown
resistor to pull the signal to the opposite rail.
For the device configuration pins (listed in Table 8-1), if they are both routed out and are not driven (in HiZ state), it is strongly recommended that an external pullup or pulldown resistor be implemented.
Although, internal pullup and pulldown resistors exist on these pins and they may match the desired
configuration value, providing external connectivity can help ensure that valid logic levels are latched on
these device configuration pins. In addition, applying external pullup and pulldown resistors on the device
configuration pins adds convenience to the user in debugging and flexibility in switching operating modes.
Tips for choosing an external pullup or pulldown resistor:
•
•
•
•
•
•
Consider the total amount of current that may pass through the pullup or pulldown resistor. Make sure to include
the leakage currents of all the devices connected to the net, as well as any internal pullup or pulldown resistors.
Decide a target value for the net. For a pulldown resistor, this should be below the lowest VIL level of all inputs
connected to the net. For a pullup resistor, this should be above the highest VIH level of all inputs on the net. A
reasonable choice would be to target the VOL or VOH levels for the logic family of the limiting device; which, by
definition, have margin to the VIL and VIH levels.
Select a pullup or pulldown resistor with the largest possible value that can still ensure that the net will reach the
target pulled value when maximum current from all devices on the net is flowing through the resistor. The current
to be considered includes leakage current plus, any other internal and external pullup or pulldown resistors on the
net.
For bidirectional nets, there is an additional consideration that sets a lower limit on the resistance value of the
external resistor. Verify that the resistance is small enough that the weakest output buffer can drive the net to the
opposite logic level (including margin).
Remember to include tolerances when selecting the resistor value.
For pullup resistors, also remember to include tolerances on the DVDD rail.
For most systems:
•
•
A 1-kΩ resistor can be used to oppose the IPU/IPD while meeting the above criteria. Users should confirm this
resistor value is correct for their specific application.
A 20-kΩ resistor can be used to compliment the IPU/IPD on the device configuration pins while meeting the above
criteria. Users should confirm this resistor value is correct for their specific application.
For more detailed information on input current (II), and the low-level/high-level input voltages (VIL and VIH)
for the C665x device, see Section 5.5.
To determine which pins on the device include internal pullup and pulldown resistors, see Table 4-2.
228
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9 System Interconnect
On the C665x device, the C66x CorePacs, the EDMA3 transfer controller, and the system peripherals are
interconnected through the TeraNet, which is a nonblocking switch fabric enabling fast and contention-free
internal data movement. The TeraNet allows for low-latency, concurrent data transfers between master
peripherals and slave peripherals. The TeraNet also allows for seamless arbitration between the system
masters when accessing system slaves.
9.1
Internal Buses and Switch Fabrics
Two types of buses exist in the device: data buses and configuration buses. Some peripherals have both
a data bus and a configuration bus interface, while others have only one type of interface. Further, the bus
interface width and speed varies from peripheral to peripheral. Configuration buses are mainly used to
access the register space of a peripheral and the data buses are used mainly for data transfers.
The C66x CorePacs, the EDMA3 traffic controller, and the various system peripherals can be classified
into two categories: masters and slaves. Masters can initiate read and write transfers in the system and do
not rely on the EDMA3 for their data transfers. Slaves, on the other hand, rely on the masters to perform
transfers to and from them. Examples of masters include the EDMA3 traffic controller, SRIO, and PCI
Express. Examples of slaves include the SPI, UART, and I2C.
The masters and slaves in the device communicate through the TeraNet (switch fabric). The device
contains two switch fabrics. The data switch fabric (data TeraNet) and the configuration switch fabric
(configuration TeraNet). The data TeraNet, is a high-throughput interconnect mainly used to move data
across the system. The data TeraNet connects masters to slaves through data buses. The configuration
TeraNet is mainly used to access peripheral registers. The configuration TeraNet connects masters to
slaves through configuration buses. The data TeraNet also connects to the configuration TeraNet. For
more details see Section 9.2.
9.2
Switch Fabric Connections Matrix
Table 9-1 and Table 9-2 list the master and slave end point connections.
Intersecting cells may contain one of the following:
•
•
•
Y — There is a connection between this master and that slave.
- — There is no connection between this master and that slave.
n — A numeric value indicates that the path between this master and that slave goes through bridge n.
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Table 9-1. Switch Fabric Connection Matrix Section 1
TETB1 (C6657 Only)
-
-
-
1
1
1
1
1
1
Y
1
-
-
1
1
1
1
1
1
EDMA3CC_TC0_WR
Y
Y
Y
-
Y
Y
-
-
-
Y
Y
Y
1
Y
Y
-
-
-
1
1
1
1
1
1
EDMA3CC_TC1_RD
Y
Y
Y
Y
Y
Y
2, 4
2, 4
-
Y
Y
Y
-
-
Y
-
2
2
-
-
2
2
-
-
EDMA3CC_TC1_WR
Y
Y
Y
-
Y
Y
2, 4
2, 4
-
Y
Y
Y
-
-
Y
-
-
-
-
-
2
2
-
-
EDMA3CC_TC2_RD
Y
Y
Y
Y
Y
Y
1, 4
1, 4
-
Y
Y
Y
-
Y
Y
1
-
-
1
1
1
1
1
1
EDMA3CC_TC2_WR
Y
Y
Y
-
Y
Y
1, 4
1, 4
-
Y
Y
Y
-
Y
Y
-
-
-
1
1
1
1
1
1
EDMA3CC_TC3_RD
Y
Y
Y
Y
Y
Y
-
-
2
Y
Y
Y
-
-
-
-
-
-
-
-
2
2
-
-
EDMA3CC_TC3_WR
Y
Y
Y
-
Y
Y
-
-
2
Y
Y
Y
2
-
-
-
-
-
-
-
2
2
-
-
SRIO packet DMA
Y
Y
-
-
-
-
-
-
1
Y
Y
Y
-
-
-
-
-
-
-
-
-
-
-
-
SRIO_Master
Y
Y
-
-
Y
Y
1, 4
1, 4
1
Y
Y
Y
1
Y
Y
1
1
1
1
1
1
1
1
1
PCIe_Master
Y
Y
-
-
Y
Y
1, 4
1, 4
1
Y
Y
Y
1
Y
Y
1
1
1
1
1
1
1
1
1
EMAC
3
3
-
-
-
-
-
-
-
3
3
3
-
-
-
-
-
-
-
-
-
-
-
-
MSMC_Data_Master
Y
Y
Y
Y
Y
Y
1, 4
1, 4
1
Y
-
-
1
Y
Y
-
-
-
-
-
-
-
-
-
QM Packet DMA
Y
Y
-
-
-
-
-
-
1
Y
Y
Y
-
-
-
-
-
-
-
-
-
-
-
-
QM Second
Y
Y
-
Y
Y
Y
-
-
1
Y
Y
Y
-
-
-
-
-
-
-
-
-
-
-
-
DAP_Master
Y
Y
Y
Y
Y
Y
1, 4
1, 4
1
Y
Y
Y
1
Y
Y
1
1
1
1
1
1
1
1
1
CorePac0_CFG
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Y
-
-
CorePac1_CFG
(C6657 Only)
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
TCP3d
Tracer_Master
-
-
-
-
-
-
-
-
-
-
-
-
1
-
-
Y
Y
Y
Y
Y
Y
Y
uPP
3
3
-
-
-
-
-
-
-
3
3
3
-
-
-
-
-
-
-
-
-
-
230
System Interconnect
QM__CFG
Y
Y
Semaphore
Y
-
EDMA3TC(0-3)
-
Y
EDMA3CC
Y
Y
TCP3d
Y
Y
VCP2_Cfg
-
-
TETB0
1
-
TETB_D
1, 4
-
STM
VCP2(0-1)
1, 4
Y
MSMC_SMS
Y
Y
MSMC_SES
Y
Y
HyperLink_Slave
Y
Y
QM_Slave
Mcbsp1_FIFO_Data
Y
Y
SPI
EMIF16
Y
Y
Boot_ROM
Y
EDMA3CC_TC0_RD
MASTERS
PCIe0_Slave
HyperLink_Master
CorePac0_SDMA
Mcbsp0_FIFO_Data
CorePac1_SDMA (C6657 Only)
SLAVES
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Table 9-2. Switch Fabric Connection Matrix Section 2
1, 4 1, 4 1, 4 1, 4
1
1, 4
-
-
1, 4 1, 4 1, 4 1, 4
1
EDMA3CC_TC1_RD
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
UPP_CFG
-
EMAC_CFG
1, 4 1, 4 1, 4 1, 4 1, 4
McBSP_FIFO_CFG(0-1)
1
McBSP_CFG(0-1)
1
UART_CFG (0-1)
1
EDMA3CC_TC0_WR
SmartReflex
1, 4 1, 4 1, 4 1, 4
Debug_SS_CFG
-
MPU4
-
MPU0-3
1, 4
CIC
1
PLL
1
1, 4 1, 4 1, 4 1, 4
PSC
1, 4 1, 4 1, 4 1, 4 1, 4 1, 4 1, 4
-
Boot_CFG
1
1, 4 1, 4 1, 4 1, 4 1, 4
Efuse
1, 4 1, 4 1, 4 1, 4 1, 4 1, 4 1, 4 1, 4 1, 4 1, 4
1
SEC_KEY_MGR
1
1
I2C
SEC_CTL
1
EDMA3CC_TC0_RD
GPIO
SRIO_CFG (C6655/57 Only)
HyperLink_Master
MASTERS
Timer
Tracer
SLAVES
-
EDMA3CC_TC1_WR
-
-
-
-
-
-
EDMA3CC_TC2_RD
1
1
1, 4 1, 4 1, 4 1, 4 1, 4
-
1, 4 1, 4 1, 4 1, 4
1
1, 4
-
-
1, 4 1, 4 1, 4 1, 4
1
EDMA3CC_TC2_WR
1
1
1, 4 1, 4 1, 4 1, 4 1, 4
-
1, 4 1, 4 1, 4 1, 4
1
1, 4
-
-
1, 4 1, 4 1, 4 1, 4
1
EDMA3CC_TC3_RD
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
EDMA3CC_TC3_WR
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
SRIO packet DMA
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
SRIO_Master
1
1
1, 4 1, 4 1, 4 1, 4 1, 4
-
1, 4 1, 4 1, 4 1, 4
1
1, 4 1, 4 1, 4 1, 4 1, 4 1, 4 1, 4
1
PCIe_Master
1
1
1, 4 1, 4 1, 4 1, 4 1, 4
-
1, 4 1, 4 1, 4 1, 4
1
1, 4 1, 4 1, 4 1, 4 1, 4 1, 4 1, 4
1
EMAC
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
MSMC_Data_Master
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
QM Packet DMA
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
QM Second
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
DAP_Master
1
1
1, 4 1, 4 1, 4 1, 4 1, 4 1, 4 1, 4 1, 4 1, 4 1, 4
1
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
1, 4 1, 4 1, 4 1, 4 1, 4 1, 4 1, 4
1
EDMA3CC
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
CorePac0_CFG
Y
Y
4
4
4
4
4
4
4
4
4
4
Y
4
4
4
4
4
4
4
Y
CorePac1_CFG
(C6657 Only)
Y
Y
4
4
4
4
4
4
4
4
4
4
Y
4
4
4
4
4
4
4
Y
Tracer_Master
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
uPP
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
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9.3
www.ti.com
TeraNet Switch Fabric Connections
Figure 9-1, Figure 9-2, Figure 9-3, Figure 9-4, and Figure 9-5 show the connections between masters and
slaves through various sections of the TeraNet.
XMC
2
EMAC
M
UPP
M
HyperLink
M
PCIe
M
SRIO_M
M
SRIO
Packet DMA
M
QM_SS
Packet DMA
M
QM_SS
Second
M
Debug_SS
M
TC_0
EDMA
CC
TC_1
TC_2
TC_3
M
M
M
M
TNet_3_D
CPU/3
S
SES
Bridge 3
S
SMS
M
S
MSMC
M
DDR3
Tracer_MSMC0
Tracer_MSMC1
Tracer_MSMC2
Tracer_MSMC3
Tracer_DDR
TeraNet
3_A
CPU/3
Tracer_L2_0
Tracer_L2_1
S
HyperLink
S
CorePac_0
S
CorePac_1
S
QM_SS
S
PCIe
S
VCP2
S
VCP2
S
TCP3d
S
McBSP0
S
McBSP1
S
SPI
S
Boot_ROM
S
EMIF
C5557 Only
MPU_1
Tracer_QM_M
TNet_3_B
CPU/3
TNet_6P_A
CPU/3
MPU_4
Tracer_TN_6P_A
Bridge_1
To TeraNet_3P_A
Bridge_2
Figure 9-1. TeraNet 3A
232
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S
MPU0
S
MPU1
S
MPU2
S
MPU3
S
TC (´ 4)
S
CC
MPU_2
S
QM_SS
MPU_3
S
Semaphore
Bridge_1
Bridge_2
From TeraNet_3_A
CorePac_0
M
CorePac_1
M
TNet_3P_C
CPU/3
C6657 Only
TeraNet
3P_A
CPU/3
Tracer_QM_CFG
Tracer_SM
TETB (Debug_SS)
TETB (core) (´ )
*
To TeraNet_3P_Tracer
MPU_0
To TeraNet_3P_B
Tracer_CFG
*
(´ 1) for C6655, (´ 2) for C6657
Figure 9-2. TeraNet 3P_A
From TeraNet_3P_A
TeraNet
3P_B
CPU/3
TNet_3P_E
CPU/3
S
Tracer (´ )
S
SRIO
S
UPP
S
VCP2
S
VCP2
S
TCP3d
To TeraNet_6P_B
*
Bridge_4
* (´ 11) for C6655, (´ 12) for C6657
Figure 9-3. TeraNet 3P_B
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From TeraNet_3P_A
Tracer_
MSMC_0
M
Tracer_
MSMC_1
M
Tracer_
MSMC_2
M
Tracer_
MSMC_3
M
Tracer_CFG
M
Tracer_DDR
M
Tracer_SM
M
Tracer_
QM_M
M
Tracer_
QM_P
M
Tracer_L2_*
M
Tracer_TN_
6P_A
M
*0
TeraNet
3P_Tracer
CPU/3
S
Debug_SS
STM
S
Debug_SS
TETB
for C6655, 0 to 1 for C6657
Figure 9-4. TeraNet 3P_Tracer
234
System Interconnect
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Bridge_4
From TeraNet_3P_B
TeraNet
6P_B
CPU/6
S
SmartReflex
S
GPIO
S
IC
S
UART (´ 2)
S
BOOTCFG
S
PSC
S
PLL_CTL
S
Debug_SS
S
CIC (´ 3)
S
Timer (´ 8)
S
MPU4
S
EMAC
S
McBSP ´ 2
S
SEC_CTL
S
SEC_KEY_MGR
S
Efuse
2
Figure 9-5. TeraNet 6P_B
9.4
Bus Priorities
The priority level of all master peripheral traffic is defined at the TeraNet boundary. User programmable
priority registers allow software configuration of the data traffic through the TeraNet. A lower number
means higher priority - PRI = 000b = urgent, PRI = 111b = low.
Most master ports provide their priority directly and do not need a default priority setting. Examples include
the CorePacs, whose priorities are set through software in the UMC control registers. All the packet-DMAbased peripherals also have internal registers to define the priority level of their initiated transactions.
Some masters do not have apriority allocation register of their own. For these masters, a priority allocation
register is provided for them and described Section 9.4.1 and Section 9.4.2. For all other modules, see the
respective User Guides in Section 10.3 for programmable priority registers.
9.4.1
Packet DMA Priority Allocation (PKTDMA_PRI_ALLOC) Register
The packet DMA secondary port is one master port that does not have priority allocation register inside
the IP. The priority level for transaction from this master port is described by PKTDMA_PRI_ALLOC
register in Figure 9-6 and Table 9-3.
Figure 9-6. Packet DMA Priority Allocation Register (PKTDMA_PRI_ALLOC)
31
3
2
0
Reserved
PKTDMA_PRI
R/W-00000000000000000000001000011
RW-000
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
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Table 9-3. Packet DMA Priority Allocation Register (PKTDMA_PRI_ALLOC) Field Descriptions
BIT
NAME
31-3
Reserved
Reserved
2-0
PKTDMA_PRI
Control the priority level for the transactions from packet DMA master port, which
access the external linking RAM.
9.4.2
DESCRIPTION
EMAC / uPP Priority Allocation (EMAC_UPP_PRI_ALLOC) Register
The EMAC and uPP are master ports that do not have priority allocation registers inside the IP. The
priority level for transaction from these master ports is described by EMAC_UPP_PRI_ALLOC register in
Figure 9-7 and Table 9-4.
Figure 9-7. EMAC / uPP Priority Allocation Register (EMAC_UPP_PRI_ALLOC)
31
27
26
24
23
19
18
16
15
11
10
8
7
3
2
0
Reserved
EMAC_EPRI
Reserved
EMAC_PRI
Reserved
UPP_EPRI
Reserved
UPP_PRI
R-00000
RW-110
R-00000
RW-111
R-00000
RW-110
R-00000
RW-111
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 9-4. EMAC / uPP Priority Allocation Register (EMAC_UPP_PRI_ALLOC) Field Descriptions
BIT
NAME
31-27
Reserved
Reserved
DESCRIPTION
26-24
EMAC_EPRI
Control the maximum priority level for the transactions from EMAC master port.
23-19
Reserved
Reserved
18-16
EMAC_PRI
Control the priority level for the transactions from EMAC master port.
15-11
Reserved
Reserved
10-8
UPP_EPRI
Control the maximum priority level for the transactions from uPP master port.
7-3
Reserved
Reserved
2-0
UPP_PRI
Control the priority level for the transactions from uPP master port.
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10 Device and Documentation Support
10.1 Device Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all
DSP devices and support tools. Each DSP commercial family member has one of three prefixes: TMX,
TMP, or TMS (for example, TMX320CMH). Texas Instruments recommends two of three possible prefix
designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of
product development from engineering prototypes (TMX/TMDX) through fully qualified production
devices/tools (TMS/TMDS).
Device development evolutionary flow:
•
•
•
TMX: Experimental device that is not necessarily representative of the final device's electrical specifications
TMP: Final silicon die that conforms to the device's electrical specifications but has not completed quality and
reliability verification
TMS: Fully qualified production device
Support tool development evolutionary flow:
•
•
TMDX: Development-support product that has not yet completed Texas Instruments internal qualification testing.
TMDS: Fully qualified development-support product
TMX and TMP devices and TMDX development-support tools are shipped with the following disclaimer:
•
"Developmental product is intended for internal evaluation purposes."
TMS devices and TMDS development-support tools have been characterized fully, and the quality and
reliability of the device have been demonstrated fully. TI's standard warranty applies.
Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard
production devices. Texas Instruments recommends that these devices not be used in any production
system because their expected end-use failure rate still is undefined. Only qualified production devices are
to be used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the
package type (for example, CZH), the temperature range (for example, blank is the default case
temperature range), and the device speed range, in Megahertz (for example, blank is 1000 MHz [1 GHz]).
For device part numbers and further ordering information for C665x in the CZH or GZH package type, see
the TI website www.ti.com or contact your TI sales representative.
Figure 10-1 provides a legend for reading the complete device name for any C66x KeyStone device.
TMX
320 C6657
PREFIX
TMX = Experimental device
TMS = Qualified device
(
)
CZH
(
)
(
)
DEVICE SPEED RANGE
8 = 850 MHz
Blank = 1 GHz
25 = 1.25 GHz
DEVICE FAMILY
320 = TMS320 DSP family
TEMPERATURE RANGE
Blank = 0°C to +85°C (default case temperature)
A = Extended temperature range
(-40°C to +100°C)
S = Extended low temperature range
(-55°C to +100°C)
DEVICE
C66x DSP: C6655 or C6657
SILICON REVISION
Blank = Initial Silicon 1.0
PACKAGE TYPE
CZH = 625-pin plastic ball grid array,
with Pb-free die bumps and solder balls
GZH = 625-pin plastic ball grid array,
with Pb-free die bumps and leaded balls
Figure 10-1. C66x DSP Device Nomenclature (including the C665x)
Device and Documentation Support
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10.2 Tools and Software
In case the customer would like to develop their own features and software on the C665x device, TI offers
an extensive line of development tools for the TMS320C6000™ DSP platform, including tools to evaluate
the performance of the processors, generate code, develop algorithm implementations, and fully integrate
and debug software and hardware modules. The tool's support documentation is electronically available
within the Code Composer Studio™ Integrated Development Environment (IDE).
The following products support development of C6000™ DSP-based applications:
•
•
238
Software Development Tools:
– Code Composer Studio™ Integrated Development Environment (IDE), including Editor C/C++/Assembly Code
Generation, and Debug plus additional development tools.
– Scalable, Real-Time Foundation Software (DSP/BIOS™), which provides the basic run-time target software
needed to support any DSP application.
Hardware Development Tools:
– Extended Development System (XDS™) Emulator (supports C6000™ DSP multiprocessor system debug)
– EVM (Evaluation Module)
Device and Documentation Support
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10.3 Documentation Support
These documents describe the C665x Fixed and Floating-Point Digital Signal Processor. Copies of these
documents are available on the Internet at www.ti.com.
Receiving Notification of Documentation Updates
To receive notification of documentation updates—including silicon errata—go to the product folder for
your device on ti.com. In the upper right-hand corner, click the "Alert me" button. This registers you to
receive a weekly digest of product information that has changed (if any). For change details, check the
revision history of any revised document.
Application Reports
DDR3 Design Guide for KeyStone Devices
DSP Power Consumption Summary for KeyStone Devices
Emulation and Trace Headers Technical Reference
Hardware Design Guide for KeyStone Devices
Using Advanced Event Triggering to Debug Real-Time Problems in High Speed Embedded
Microprocessor Systems
Using Advanced Event Triggering to Find and Fix Intermittent Real-Time Bugs
Using IBIS Models for Timing Analysis
User's Guides
64-bit Timer (Timer 64) for KeyStone Devices User's Guide
Bootloader for the C66x DSP User's Guide
C66x CorePac User's Guide
C66x CPU and Instruction Set Reference Guide
C66x DSP Cache User's Guide
DDR3 Memory Controller for KeyStone Devices User's Guide
Debug and Trace for KeyStone I Devices User's Guide
Enhanced Direct Memory Access 3 (EDMA3) for KeyStone Devices User's Guide
External Memory Interface (EMIF16) for KeyStone Devices User's Guide
General-Purpose Input/Output (GPIO) for KeyStone Devices User's Guide
Ethernet Media Access Controller (EMAC) for KeyStone Devices User's Guide
HyperLink for KeyStone Devices User's Guide
Inter Integrated Circuit (I2C) for KeyStone Devices User's Guide
Chip Interrupt Controller (CIC) for KeyStone Devices User's Guide
Memory Protection Unit (MPU) for KeyStone Devices User's Guide
Multichannel Buffered Serial Port (McBSP) for KeyStone Devices User's Guide
Multicore Navigator for KeyStone Devices User's Guide
Peripheral Component Interconnect Express (PCIe) for KeyStone Devices User's Guide
Phase-Locked Loop (PLL) for KeyStone Devices User's Guide
Power Sleep Controller (PSC) for KeyStone Devices User's Guide
Semaphore2 Hardware Module for KeyStone Devices User's Guide
Serial Peripheral Interface (SPI) for KeyStone Devices User's Guide
Serial RapidIO (SRIO) for KeyStone Devices User's Guide
Turbo Decoder Coprocessor 3 (TCP3d) for KeyStone Devices User's Guide
Device and Documentation Support
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Universal Asynchronous Receiver/Transmitter (UART) for KeyStone Devices User's Guide
Universal Parallel Port (uPP) for KeyStone Architecture User's Guide
Viterbi Coprocessor (VCP2) for KeyStone Devices User's Guide
10.4 Related Links
Table 10-1 lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 10-1. Related Links
PARTS
PRODUCT FOLDER
SAMPLE AND BUY
TECHNICAL
DOCUMENTS
TOOLS AND
SOFTWARE
SUPPORT AND
COMMUNITY
TMS320C6655
Click here
Click here
Click here
Click here
Click here
TMS320C6657
Click here
Click here
Click here
Click here
Click here
10.5 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help —
straight from the experts. Search existing answers or ask your own question to get the quick design help
you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications
and do not necessarily reflect TI's views; see TI's Terms of Use.
10.6 Trademarks
E2E is a trademark of Texas Instruments.
SmartReflex, TMS320C6000 are trademarks of Texas Instruments Inc.
All other trademarks are the property of their respective owners.
10.7 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
10.8 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
240
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11 Mechanical Packaging and Orderable Information
11.1 Packaging Information
The following pages include mechanical packaging and orderable information. This information is the
most current data available for the designated devices. This data is subject to change without notice
and revision of this document. For browser-based versions of this data sheet, see the left-hand
navigation.
Mechanical Packaging and Orderable Information
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PACKAGE OPTION ADDENDUM
www.ti.com
4-Sep-2019
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TMS320C6655CZH
ACTIVE
FCBGA
CZH
625
60
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-245C-168 HR
0 to 85
TMS320C6655CZH
@2012 TI
TMS320C6655CZH25
ACTIVE
FCBGA
CZH
625
60
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-245C-168 HR
0 to 85
TMS320C6655CZH
@2012 TI
1.25GHZ
TMS320C6655CZHA
ACTIVE
FCBGA
CZH
625
60
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-245C-168 HR
-40 to 100
TMS320C6655CZH
@2012 TI
A1GHZ
TMS320C6655CZHA25
ACTIVE
FCBGA
CZH
625
60
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-245C-168 HR
-40 to 100
TMS320C6655CZH
@2012 TI
A1.25GHZ
TMS320C6655GZHA
ACTIVE
FCBGA
GZH
625
60
TBD
SNPB
Level-3-220C-168 HR
-40 to 100
TMS320C6655GZH
@2012 TI
A1GHZ
TMS320C6655SCZH
ACTIVE
FCBGA
CZH
625
TBD
Call TI
Call TI
0 to 85
TMS320C6655SCZH
@2012 TI
TMS320C6657CZH
ACTIVE
FCBGA
CZH
625
60
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-245C-168 HR
0 to 85
TMS320C6657CZH
@2012 TI
TMS320C6657CZH25
ACTIVE
FCBGA
CZH
625
60
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-245C-168 HR
0 to 85
TMS320C6657CZH
@2012 TI
1.25GHZ
TMS320C6657CZH8
ACTIVE
FCBGA
CZH
625
60
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-245C-168 HR
0 to 85
TMS320C6657CZH
@2012 TI
850MHZ
TMS320C6657CZHA
ACTIVE
FCBGA
CZH
625
60
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-245C-168 HR
-40 to 100
TMS320C6657CZH
@2012 TI
A1GHZ
TMS320C6657CZHA25
ACTIVE
FCBGA
CZH
625
60
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-245C-168 HR
-40 to 100
TMS320C6657CZH
@2012 TI
A1.25GHZ
TMS320C6657GZHA
ACTIVE
FCBGA
GZH
625
60
TBD
SNPB
Level-3-220C-168 HR
-40 to 100
TMS320C6657GZH
@2012 TI
A1GHZ
TMS320C6657SCZH
ACTIVE
FCBGA
CZH
625
TBD
Call TI
Call TI
0 to 85
Addendum-Page 1
TMS320C6657SCZH
@2012 TI
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
4-Sep-2019
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
permission to use these resources only for development of an application that uses the TI products described in the resource. Other
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warranties or warranty disclaimers for TI products.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2019, Texas Instruments Incorporated
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