Texas Instruments | TMS320C6671 Fixed and Floating-Point Digital Signal Processor (Rev. E) | Datasheet | Texas Instruments TMS320C6671 Fixed and Floating-Point Digital Signal Processor (Rev. E) Datasheet

Texas Instruments TMS320C6671 Fixed and Floating-Point Digital Signal Processor (Rev. E) Datasheet
TMS320C6671
SPRS756E—November 2010—Revised March 2014
Fixed and Floating-Point Digital Signal Processor
Check for Evaluation Modules (EVM): TMS320C6678
1 TMS320C6671 Features and Description
1.1 Features
•
One TMS320C66x™ DSP Core Subsystem (C66x
CorePac), with
– 1.0 GHz or 1.25 GHz C66x Fixed/Floating-Point CPU
Core
› 40 GMAC/Core for Fixed Point @ 1.25 GHz
› 20 GFLOP/Core for Floating Point @ 1.25 GHz
– Memory
› 32K Byte L1P
› 32K Byte L1D
› 512K Byte Local L2
• Multicore Shared Memory Controller (MSMC)
– 4096KB MSM SRAM
– Memory Protection Unit for Both MSM SRAM and
DDR3_EMIF
• Multicore Navigator
– 8192 Multipurpose Hardware Queues with Queue
Manager
– Packet-Based DMA for Zero-Overhead Transfers
• Network Coprocessor
– Packet Accelerator Enables Support for
› Transport Plane IPsec, GTP-U, SCTP, PDCP
› L2 User Plane PDCP (RoHC, Air Ciphering)
› 1-Gbps Wire-Speed Throughput at 1.5 MPackets
Per Second
– Security Accelerator Engine Enables Support for
› IPSec, SRTP, 3GPP, WiMAX Air Interface, and
SSL/TLS Security
› ECB, CBC, CTR, F8, A5/3, CCM, GCM, HMAC, CMAC,
GMAC, AES, DES, 3DES, Kasumi, SNOW 3G, SHA-1,
SHA-2 (256-bit Hash), MD5
› Up to 2.8 Gbps Encryption Speed
• Peripherals
– Four Lanes of SRIO 2.1
› 1.24/2.5/3.125/5 GBaud Operation Supported Per
Lane
› Supports Direct I/O, Message Passing
› Supports Four 1×, Two 2×, One 4×, and Two 1× +
One 2× Link Configurations
– PCIe Gen2
› Single Port Supporting 1 or 2 Lanes
› Supports Up To 5 GBaud Per Lane
– HyperLink
› Supports Connections to Other KeyStone
Architecture Devices Providing Resource
Scalability
› Supports up to 50 Gbaud
– Gigabit Ethernet (GbE) Switch Subsystem
› Two SGMII Ports
› Supports 10/100/1000 Mbps Operation
– 64-Bit DDR3 Interface (DDR3-1600)
› 8G Byte Addressable Memory Space
– 16-Bit EMIF
– Two Telecom Serial Ports (TSIP)
› Supports 1024 DS0s Per TSIP
› Supports 2/4/8 Lanes at 32.768/16.384/8.192 Mbps
Per Lane
– UART Interface
– I2C Interface
– 16 GPIO Pins
– SPI Interface
– Semaphore Module
– Nine 64-Bit Timers
– Three On-Chip PLLs
• Commercial Temperature:
– 0°C to 85°C
• Extended Temperature:
– -40°C to 100°C
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and
other important disclaimers. PRODUCTION DATA.
TMS320C6671
Fixed and Floating-Point Digital Signal Processor
SPRS756E—March 2014
1.2 Applications
•
•
•
•
•
•
•
•
•
•
•
Mission-Critical Systems
High-Performance Computing Systems
Communications
Audio
Video Infrastructure
Imaging
Analytics
Networking
Media Processing
Industrial Automation
Automation and Process Control
1.3 KeyStone Architecture
TI’s KeyStone Multicore Architecture provides a high-performance structure for integrating RISC and DSP cores
with application-specific coprocessors and I/O. KeyStone is the first of its kind that provides adequate internal
bandwidth for nonblocking access to all processing cores, peripherals, coprocessors, and I/O. This is achieved with
four main hardware elements: Multicore Navigator, TeraNet, Multicore Shared Memory Controller, and
HyperLink.
Multicore Navigator is an innovative packet-based manager that controls 8192 queues. When tasks are allocated to
the queues, Multicore Navigator provides hardware-accelerated dispatch that directs tasks to the appropriate
available hardware. The packet-based system on a chip (SoC) uses the two Tbps capacity of the TeraNet switched
central resource to move packets. The Multicore Shared Memory Controller enables processing cores to access
shared memory directly without drawing from TeraNet’s capacity, so packet movement cannot be blocked by
memory access.
HyperLink provides a 50-Gbaud chip-level interconnect that allows SoCs to work in tandem. Its low-protocol
overhead and high throughput make HyperLink an ideal interface for chip-to-chip interconnections. Working with
Multicore Navigator, HyperLink dispatches tasks to tandem devices transparently and executes tasks as if they are
running on local resources.
1.4 Device Description
The TMS320C6671 DSP is a highest-performance fixed/floating-point single-core DSP that is based on TI's
KeyStone multicore architecture. It is pin-for-pin compatible with the TMS320C6678 / 6674 / 6672 multicore
high-performance DSPs. Incorporating the new and innovative C66x DSP core, this device can run at a core speed
of up to 1.25 GHz. For developers of a broad range of applications, such as mission-critical systems, medical
imaging, test and automation, and other applications requiring high performance, TI's TMS320C6671 DSP offers a
platform that is power-efficient and easy to use. In addition, it is fully backward compatible with all existing C6000
family fixed and floating point DSPs.
2
TMS320C6671 Features and Description
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TMS320C6671
Fixed and Floating-Point Digital Signal Processor
SPRS756E—March 2014
TI's KeyStone architecture provides a programmable platform integrating various subsystems (C66x cores, memory
subsystem, peripherals, and accelerators) and uses several innovative components and techniques to maximize
intra-device and inter-device communication that allows the various DSP resources to operate efficiently and
seamlessly. Central to this architecture are key components such as Multicore Navigator that allows for efficient data
management between the various device components. The TeraNet is a non-blocking switch fabric enabling fast and
contention-free internal data movement. The multicore shared memory controller allows access to shared and
external memory directly without drawing from switch fabric capacity.
For fixed-point use, the C66x core has 4× the multiply accumulate (MAC) capability of C64x+ cores. In addition,
the C66x core integrates floating point capability and the per-core raw computational performance in an
industry-leading 40 GMACS/core and 20 GFLOPS/core (@1.25 GHz operating frequency). It can execute 8
single-precision floating point MAC operations per cycle and can perform double- and mixed-precision operations,
and is IEEE754 compliant. The C66x core incorporates 90 new instructions (compared to the C64x+ core) targeted
for floating point and vector math oriented processing. These enhancements yield sizeable performance
improvements in popular DSP kernels used in signal processing, mathematical, and image acquisition functions.
The C66x core is backwards code-compatible with TI's previous generation C6000 fixed and floating point DSP
cores, ensuring software portability and shortened software development cycles for applications migrating to faster
hardware.
The C6671 DSP integrates a large amount of on-chip memory. In addition to 32KB of L1 program and data cache,
there is 512KB of dedicated memory that can be configured as mapped RAM or cache. The device also integrates
4096KB of Multicore Shared Memory that can be used as a shared L2 SRAM and/or shared L3 SRAM. All L2
memories incorporate error detection and error correction. For fast access to external memory, this device includes
a 64-bit DDR-3 external memory interface (EMIF) running at 1600 MHz and has ECC DRAM support.
This family supports a plethora of high speed standard interfaces including RapidIO ver 2, PCI Express Gen2, and
Gigabit Ethernet, as well as an integrated Ethernet switch. It also includes I2C, UART, Telecom Serial Interface Port
(TSIP), and a 16-bit EMIF, along with general purpose CMOS IO. For high throughput, low latency communication
between devices or with an FPGA, this device also sports a 50-Gbaud full-duplex interface called HyperLink. Adding
to the network awareness of this device is a network co-processor that includes both packet and optional security
acceleration. The packet accelerator can process up to 1.5 M packets/s and enables a single IP address to be used for
the entire C6671 device. It also provides L2 to L4 classification, along with checksum and QoS capabilities.
The C6671 device has a complete set of development tools, which includes: an enhanced C compiler, an assembly
optimizer to simplify programming and scheduling, and a Windows® debugger interface for visibility into source
code execution.
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TMS320C6671 Features and Description
3
TMS320C6671
Fixed and Floating-Point Digital Signal Processor
SPRS756E—March 2014
1.5 Functional Block Diagram
Figure 1-1 shows the functional block diagram of the TMS320C6671 device.
Figure 1-1
Functional Block Diagram
6671
Memory Subsystem
4MB
MSM
SRAM
64-Bit
DDR3 EMIF
MSMC
Debug & Trace
Boot ROM
Semaphore
C66x
CorePac
Power
Management
PLL
32KB L1
P-Cache
´3
32KB L1
D-Cache
512KB L2 Cache
EDMA
´3
@ up to 1.25 GHz
TeraNet
HyperLink
Multicore Navigator
4
TMS320C6671 Features and Description
Switch
Ethernet
Switch
´4
SRIO
SGMII
´2
´2
TSIP
SPI
UART
´2
PCIe
I2C
GPIO
EMIF 16
Queue
Manager
Packet
DMA
Security
Accelerator
Packet
Accelerator
Network Coprocessor
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TMS320C6671
Fixed and Floating-Point Digital Signal Processor
SPRS756E—March 2014
1.6 Release History
Revision
Date
Description/Comments
SPRS756E
March 2014
• Added DSP_SUSP_CTL register section
• Updated Core Before IO Power Sequencing diagram, changing clock signal SYSCLK1P&N to REFCLK1P&N
• Updated the Trace timing diagram
2
• Updated Parameter Table Index bit field in I C boot configuration
• Updated PKTDMA_PRI_ALLOC register to be CHIP_MSIC_CTL register with new bit field added.
• Updated OUTPUT_DIVIDE default value and PLL clock formula in PLL Settings section
• Updated Chip Select field description in SPI boot device configuration table
• Corrections applied to EMIF16 Boot Device Configuration Bit Fields
• Restored Parameter Information section
SPRS756D April 2013
• Added Initial Startup row for CVDD in Recommended Operating Conditions table
• Added DDR3PLLCTL1 and PASSPLLCTL1 registers to Device Status Control Registers table
• Added CVDD and SmartReflex voltage parameter in SmartReflex switching table
• Added HOUT timing diagram in Host Interrupt Output section
• Added MPU Registers Reset Values section
• Corrected PASSCLK(N/P) max cycle time from 6.4 ns to 25 ns
• Corrected Reserved to be Assert local reset to all CorePacs in LRESET and NMI decoding table
• Corrected PASS PLL clock to SRIOSGMIICLK in the boot device values table for Ethernet.
• Updated the Timer numbering across the whole document
• Updated DDR3 PLL initialization sequence
SPRS756C
February 2012
• Added TeraNet connection figures and added bridge numbers to the connection tables
• Changed TPCC to EDMA3CC and TPTC to EDMA3TC
• Changed chip level interrupt controller name from INTC to CIC
• Added the DDR3 PLL and PASS PLL Initialization Sequence
• Added DEVSPEED Register section
• Updated device frequency in the feature section
• Corrected the SPI, DDR3, and Hyperbridge config/data memory map addresses
• Restricted Output Divide of SECCTL Register to max value of divide by 2
SPRS756B
August 2011
• Updated the timing and electrical sections of several peripherals
• Updated the core-specific and general-purpose timer numbers
• Updated the connection matrix tables in chapter 4 “System Interconnection”
• Updated device boot configuration tables and figures
• Updated DDR3 and PASS PLL timing figures
• Removed section 7.1 “Parameter Information”
SPRS756A
July 2011
• Added sections: NMI and LRSET
• Added Pin Map diagrams
• Added MAINPLLCTL1, DDR3PLLCTL1 and PAPLLCTL1 registers
• Changed PLL diagrams of MAIN PLL, DDR3 PLL and PASS PLL
• Changed C66x DSP System PLL Configuration table to include 1000 MHz and 1250 MHz columns
• Corrected items in the Memory Map Summary table
• Changed all occurrences of PA_SS to Network Coprocessor
• Updated the complete Power-up sequencing section. RESETFULL must always de-assert after POR
SPRS756
November 2010
Initial release
For detailed revision information, see ‘‘Revision History’’ on page 236.
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TMS320C6671 Features and Description
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TMS320C6671
Fixed and Floating-Point Digital Signal Processor
SPRS756E—March 2014
6
TMS320C6671 Features and Description
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TMS320C6671
SPRS756E—November 2010—Revised March 2014
Contents
1
TMS320C6671 Features and Description . . . . . . . . . . . . .1
1.1
1.2
1.3
1.4
1.5
1.6
2
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
KeyStone Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
Device Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
Functional Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
Release History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
4
Device Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.1
2.2
2.3
2.4
2.5
Device Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DSP Core Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Memory Map Summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Boot Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Boot Modes Supported and PLL Settings . . . . . . . . . . . .
2.5.1 Boot Device Field . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.5.2 Device Configuration Field . . . . . . . . . . . . . . . . . . . .
2.5.3 Boot Parameter Table . . . . . . . . . . . . . . . . . . . . . . . . .
2.5.4 PLL Boot Configuration Settings . . . . . . . . . . . . . . .
2.6 Second-Level Bootloaders . . . . . . . . . . . . . . . . . . . . . . . . . .
2.7 Terminals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.7.1 Package Terminals . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.7.2 Pin Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.8 Terminal Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.9 Development and Support . . . . . . . . . . . . . . . . . . . . . . . . .
2.9.1 Development Support . . . . . . . . . . . . . . . . . . . . . . . .
2.9.2 Device Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.10 Related Documentation from Texas Instruments . . .
3
3.3.20 DSP Suspension Control Register
(DSP_SUSP_CTL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .91
3.3.21 Device Speed Register (DEVSPEED) . . . . . . . . . . .93
3.3.22 Chip Miscellaneous Control Register
(CHIP_MISC_CTL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .93
3.4 Pullup/Pulldown Resistors . . . . . . . . . . . . . . . . . . . . . . . . . . .94
13
14
17
23
24
25
26
31
38
38
39
39
39
44
70
70
70
72
5
5.2
5.3
5.4
5.5
5.6
6
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73
74
74
78
79
79
80
80
Device Operating Conditions . . . . . . . . . . . . . . . . . . . . . .113
7
Peripheral Information and
Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . .117
7.1
7.2
7.3
81
82
7.4
82
83
7.5
84
84
86
86
87
88
90
90
Memory Architecture. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .106
5.1.1 L1P Memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .106
5.1.2 L1D Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .107
5.1.3 L2 Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .108
5.1.4 MSM SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .109
5.1.5 L3 Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .109
Memory Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .110
Bandwidth Management . . . . . . . . . . . . . . . . . . . . . . . . . . .111
Power-Down Control. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .111
C66x CorePac Revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . .112
C66x CorePac Register Descriptions. . . . . . . . . . . . . . . . .112
6.1 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . .113
6.2 Recommended Operating Conditions . . . . . . . . . . . . . .114
6.3 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .115
6.4 Power Supply to Peripheral I/O Mapping. . . . . . . . . . . .116
80
83
Internal Buses and Switch Fabrics . . . . . . . . . . . . . . . . . . . .95
Switch Fabric Connections . . . . . . . . . . . . . . . . . . . . . . . . . .96
Bus Priorities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .104
C66x CorePac . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .105
5.1
Device Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
3.1 Device Configuration at Device Reset . . . . . . . . . . . . . . .
3.2 Peripheral Selection After Device Reset. . . . . . . . . . . . . .
3.3 Device State Control Registers . . . . . . . . . . . . . . . . . . . . . .
3.3.1 Device Status Register . . . . . . . . . . . . . . . . . . . . . . . .
3.3.2 Device Configuration Register (DEVCFG). . . . . . .
3.3.3 JTAG ID Register (JTAGID) Description . . . . . . . . .
3.3.4 Kicker Mechanism Register (KICK0 and KICK1). .
3.3.5 DSP Boot Address Register
(DSP_BOOT_ADDRn) . . . . . . . . . . . . . . . . . . . . . . . . .
3.3.6 LRESETNMI PIN Status Register
(LRSTNMIPINSTAT) . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3.7 LRESETNMI PIN Status Clear Register
(LRSTNMIPINSTAT_CLR) . . . . . . . . . . . . . . . . . . . . . .
3.3.8 Reset Status Register (RESET_STAT). . . . . . . . . . . .
3.3.9 Reset Status Clear Register
(RESET_STAT_CLR) . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3.10 Boot Complete Register (BOOTCOMPLETE) . . .
3.3.11 Power State Control Register
(PWRSTATECTL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3.12 NMI Event Generation to CorePac Register
(NMIGRx). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3.13 IPC Generation Registers (IPCGRx) . . . . . . . . . . . .
3.3.14 IPC Acknowledgement Registers (IPCARx) . . . .
3.3.15 IPC Generation Host Register (IPCGRH) . . . . . . .
3.3.16 IPC Acknowledgement Host Register
(IPCARH) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3.17 Timer Input Selection Register (TINPSEL) . . . . .
3.3.18 Timer Output Selection Register
(TOUTPSEL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3.19 Reset Mux Register (RSTMUXx) . . . . . . . . . . . . . . .
System Interconnect . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
4.1
4.2
4.3
7.6
Parameter Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . .117
7.1.1 Timing Parameters and Board Routing
Analysis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .117
7.1.2 1.8-V LVCMOS Signal Transition Levels . . . . . . . .117
Recommended Clock and Control Signal
Transition Behavior . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .117
Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .118
7.3.1 Power-Supply Sequencing . . . . . . . . . . . . . . . . . . . .119
7.3.2 Power-Down Sequence . . . . . . . . . . . . . . . . . . . . . . .124
7.3.3 Power Supply Decoupling and
Bulk Capacitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .124
7.3.4 SmartReflex . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .125
Power Sleep Controller (PSC) . . . . . . . . . . . . . . . . . . . . . . .126
7.4.1 Power Domains . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .126
7.4.2 Clock Domains . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .127
7.4.3 PSC Register Memory Map . . . . . . . . . . . . . . . . . . . .128
Reset Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .130
7.5.1 Power-on Reset. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .131
7.5.2 Hard Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .132
7.5.3 Soft Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .133
7.5.4 Local Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .134
7.5.5 Reset Priority . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .134
7.5.6 Reset Controller Register. . . . . . . . . . . . . . . . . . . . . .134
7.5.7 Reset Electrical Data / Timing . . . . . . . . . . . . . . . . .135
Main PLL and PLL Controller . . . . . . . . . . . . . . . . . . . . . . . .137
7.6.1 Main PLL Controller Device-Specific
Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .138
7.6.2 PLL Controller Memory Map . . . . . . . . . . . . . . . . . .140
Contents
7
TMS320C6671
SPRS756E—November 2010—Revised March 2014
7.6.3 Main PLL Control Register . . . . . . . . . . . . . . . . . . . . 147
7.6.4 Main PLL and PLL Controller Initialization
Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 148
7.6.5 Main PLL Controller/SRIO/HyperLink/PCIe
Clock Input Electrical Data/Timing . . . . . . . . . . . 148
7.7 DD3 PLL. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150
7.7.1 DDR3 PLL Control Register . . . . . . . . . . . . . . . . . . . 150
7.7.2 DDR3 PLL Device-Specific Information . . . . . . . . 151
7.7.3 DDR3 PLL Initialization Sequence. . . . . . . . . . . . . 151
7.7.4 DDR3 PLL Input Clock Electrical Data/Timing. . 152
7.8 PASS PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 153
7.8.1 PASS PLL Control Register . . . . . . . . . . . . . . . . . . . . 153
7.8.2 PASS PLL Device-Specific Information . . . . . . . . 154
7.8.3 PASS PLL Initialization Sequence . . . . . . . . . . . . . 154
7.8.4 PASS PLL Input Clock Electrical Data/Timing . . 155
7.9 Enhanced Direct Memory Access (EDMA3)
Controller. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 156
7.9.1 EDMA3 Device-Specific Information . . . . . . . . . . 157
7.9.2 EDMA3 Channel Controller Configuration . . . . 157
7.9.3 EDMA3 Transfer Controller Configuration. . . . . 157
7.9.4 EDMA3 Channel Synchronization Events. . . . . . 158
7.10 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162
7.10.1 Interrupt Sources and Interrupt Controller . . . 162
7.10.2 CIC Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175
7.10.3 Inter-Processor Register Map. . . . . . . . . . . . . . . . 181
7.10.4 NMI and LRESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . 182
7.10.5 External Interrupts Electrical Data/Timing . . . 183
7.10.6 Host Interrupt Output. . . . . . . . . . . . . . . . . . . . . . . 183
7.11 Memory Protection Unit (MPU) . . . . . . . . . . . . . . . . . . . 184
7.11.1 MPU Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 187
7.11.2 MPU Programmable Range Registers . . . . . . . . 192
7.12 DDR3 Memory Controller . . . . . . . . . . . . . . . . . . . . . . . . . 197
7.12.1 DDR3 Memory Controller Device-Specific
Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 197
7.12.2 DDR3 Memory Controller Race Condition
Consideration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 197
8
Contents
7.12.3 DDR3 Memory Controller Electrical
Data/Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .198
7.13 I2C Peripheral . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .199
7.13.1 I2C Device-Specific Information . . . . . . . . . . . . . .199
7.13.2 I2C Peripheral Register Description(s) . . . . . . . .200
7.13.3 I2C Electrical Data/Timing. . . . . . . . . . . . . . . . . . . .201
7.14 SPI Peripheral . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .204
7.14.1 SPI Electrical Data/Timing. . . . . . . . . . . . . . . . . . . .204
7.15 HyperLink Peripheral. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .207
7.15.1 HyperLink Device-Specific Interrupt Event. . . .207
7.15.2 HyperLink Electrical Data/Timing . . . . . . . . . . . .209
7.16 UART Peripheral . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .211
7.17 PCIe Peripheral . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .212
7.18 TSIP Peripheral. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .213
7.18.1 TSIP Electrical Data/Timing . . . . . . . . . . . . . . . . . .213
7.19 EMIF16 Peripheral. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .215
7.19.1 EMIF16 Electrical Data/Timing . . . . . . . . . . . . . . .215
7.20 Packet Accelerator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .217
7.21 Security Accelerator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .217
7.22 Gigabit Ethernet (GbE) Switch Subsystem. . . . . . . . . .218
7.23 Management Data Input/Output (MDIO) . . . . . . . . . .220
7.24 Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .221
7.24.1 Timers Device-Specific Information . . . . . . . . . .221
7.24.2 Timers Electrical Data/Timing . . . . . . . . . . . . . . . .222
7.25 Serial RapidIO (SRIO) Port . . . . . . . . . . . . . . . . . . . . . . . . .222
7.26 General-Purpose Input/Output (GPIO) . . . . . . . . . . . . .223
7.26.1 GPIO Device-Specific Information . . . . . . . . . . . .223
7.26.2 GPIO Electrical Data/Timing. . . . . . . . . . . . . . . . . .223
7.27 Semaphore2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .224
7.28 Emulation Features and Capability . . . . . . . . . . . . . . . .224
7.28.1 Advanced Event Triggering (AET) . . . . . . . . . . . .224
7.28.2 Trace. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .225
7.28.3 IEEE 1149.1 JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . .226
8
9
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .228
Mechanical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .233
9.1
9.2
Thermal Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .233
Packaging Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . .233
Copyright 2014 Texas Instruments Incorporated
Submit Documentation Feedback
TMS320C6671
SPRS756E—November 2010—Revised March 2014
List of Figures
Figure 1-1
Figure 2-1
Figure 2-2
Figure 2-3
Figure 2-4
Figure 2-5
Figure 2-6
Figure 2-7
Figure 2-8
Figure 2-9
Figure 2-10
Figure 2-11
Figure 2-12
Figure 2-13
Figure 2-14
Figure 2-15
Figure 2-16
Figure 2-17
Figure 3-1
Figure 3-2
Figure 3-3
Figure 3-4
Figure 3-5
Figure 3-6
Figure 3-7
Figure 3-8
Figure 3-9
Figure 3-10
Figure 3-11
Figure 3-12
Figure 3-13
Figure 3-14
Figure 3-15
Figure 3-16
Figure 3-17
Figure 3-18
Figure 3-19
Figure 3-20
Figure 3-21
Figure 4-1
Figure 4-2
Figure 4-3
Figure 4-4
Figure 5-1
Figure 5-2
Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . .4
DSP Core Data Paths . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Boot Mode Pin Decoding . . . . . . . . . . . . . . . . . . . . . . 24
No Boot/ EMIF16 Configuration Fields. . . . . . . . . . 26
Serial Rapid I/O Device Configuration Fields . . . . 26
Ethernet (SGMII) Device Configuration Fields. . . 27
PCI Device Configuration Fields. . . . . . . . . . . . . . . . 27
I2C Master Mode Device Configuration
Bit Fields . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
I2C Passive Mode Device Configuration
Bit Fields . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
SPI Device Configuration Bit Fields . . . . . . . . . . . . . 29
HyperLink Boot Device Configuration Fields. . . . 30
CYP 841-Pin BGA Package (Bottom View). . . . . . . 39
Pin Map Quadrants (Bottom View) . . . . . . . . . . . . . 39
Upper Left Quadrant—A (Bottom View). . . . . . . . 40
Upper Right Quadrant—B (Bottom View) . . . . . . 41
Lower Right Quadrant—C (Bottom View) . . . . . . 42
Lower Left Quadrant—D (Bottom View). . . . . . . . 43
C66x DSP Device Nomenclature (including
the TMS320C6671) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
Device Status Register . . . . . . . . . . . . . . . . . . . . . . . . . 78
Device Configuration Register (DEVCFG) . . . . . . . 79
JTAG ID Register (JTAGID) . . . . . . . . . . . . . . . . . . . . . 79
DSP BOOT Address Register
(DSP_BOOT_ADDRn) . . . . . . . . . . . . . . . . . . . . . . . . . . 80
LRESETNMI PIN Status Register
(LRSTNMIPINSTAT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
LRESETNMI PIN Status Clear Register
(LRSTNMIPINSTAT_CLR) . . . . . . . . . . . . . . . . . . . . . . . 81
Reset Status Register (RESET_STAT) . . . . . . . . . . . . 82
Reset Status Clear Register (RESET_STAT_CLR). . 82
Boot Complete Register (BOOTCOMPLETE). . . . . 83
Power State Control Register (PWRSTATECTL) . . 83
NMI Generation Register (NMIGRx). . . . . . . . . . . . . 84
IPC Generation (IPCGRx) Registers . . . . . . . . . . . . . 85
IPC Acknowledgement (IPCARx) Registers. . . . . . 86
IPC Generation (IPCGRH) Registers . . . . . . . . . . . . . 86
IPC Acknowledgement Register (IPCARH) . . . . . . 87
Timer Input Selection Register (TINPSEL) . . . . . . . 88
Timer Output Selection Register (TOUTPSEL) . . . 90
Reset Mux Register (RSTMUXx). . . . . . . . . . . . . . . . . 90
DSP Suspension Control Register
(DSP_SUSP_CTL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
Device Speed Register (DEVSPEED) . . . . . . . . . . . . 93
Chip Miscellaneous Control Register
(CHIP_MISC_CTL). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
TeraNet 2A for C6671. . . . . . . . . . . . . . . . . . . . . . . . . . 96
TeraNet 3A for C6671. . . . . . . . . . . . . . . . . . . . . . . . . . 97
TeraNet 3P_A & B for C6671 . . . . . . . . . . . . . . . . . . . 99
TeraNet 6P_B and 3P_Tracer for C6671. . . . . . . . 100
C66x CorePac Block Diagram . . . . . . . . . . . . . . . . . 105
L1P Memory Configurations . . . . . . . . . . . . . . . . . . 106
Copyright 2014 Texas Instruments Incorporated
Submit Documentation Feedback
Figure 5-3
Figure 5-4
Figure 5-5
Figure 7-1
Figure 7-2
Figure 7-3
Figure 7-4
Figure 7-5
Figure 7-6
Figure 7-7
Figure 7-8
Figure 7-9
Figure 7-10
Figure 7-11
Figure 7-12
Figure 7-13
Figure 7-14
Figure 7-15
Figure 7-16
Figure 7-17
Figure 7-18
Figure 7-19
Figure 7-20
Figure 7-21
Figure 7-22
Figure 7-23
Figure 7-24
Figure 7-25
Figure 7-26
Figure 7-27
Figure 7-28
Figure 7-29
Figure 7-30
Figure 7-31
Figure 7-32
Figure 7-33
Figure 7-34
Figure 7-35
Figure 7-36
Figure 7-37
Figure 7-38
Figure 7-39
Figure 7-40
Figure 7-41
L1D Memory Configurations . . . . . . . . . . . . . . . . . .107
L2 Memory Configurations . . . . . . . . . . . . . . . . . . . .108
CorePac Revision ID Register (MM_REVID)
Address - 0181 2000h . . . . . . . . . . . . . . . . . . . . . . . . .112
Input and Output Voltage Reference Levels
for AC Timing Measurements. . . . . . . . . . . . . . . . . .117
Rise and Fall Transition Time Voltage
Reference Levels . . . . . . . . . . . . . . . . . . . . . . . . . . . . .117
Core Before IO Power Sequencing . . . . . . . . . . . .120
IO Before Core Power Sequencing . . . . . . . . . . . .122
SmartReflex 4-Pin VID Interface Timing . . . . . . . .125
RESETFULL Reset Timing . . . . . . . . . . . . . . . . . . . . . .135
Soft/Hard-Reset Timing . . . . . . . . . . . . . . . . . . . . . . .135
Boot Configuration Timing . . . . . . . . . . . . . . . . . . . .136
Main PLL and PLL Controller . . . . . . . . . . . . . . . . . .137
PLL Secondary Control Register (SECCTL)) . . . . .141
PLL Controller Divider Register (PLLDIVn) . . . . . .142
PLL Controller Clock Align Control
Register (ALNCTL). . . . . . . . . . . . . . . . . . . . . . . . . . . . .142
PLLDIV Divider Ratio Change Status
Register (DCHANGE) . . . . . . . . . . . . . . . . . . . . . . . . . .143
SYSCLK Status Register (SYSTAT) . . . . . . . . . . . . . .143
Reset Type Status Register (RSTYPE) . . . . . . . . . . .144
Reset Control Register (RSTCTRL) . . . . . . . . . . . . . .145
Reset Configuration Register (RSTCFG). . . . . . . . .145
Reset Isolation Register (RSISO) . . . . . . . . . . . . . . . .146
Main PLL Control Register 0 (MAINPLLCTL0) . . .147
Main PLL Control Register 1 (MAINPLLCTL1) . . .147
Main PLL Controller/SRIO/HyperLink/PCIe
Clock Input Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . .149
Main PLL Clock Input Transition Time . . . . . . . . .149
DDR3 PLL Block Diagram . . . . . . . . . . . . . . . . . . . . . .150
DDR3 PLL Control Register 0 (DDR3PLLCTL0). . .150
DDR3 PLL Control Register 1 (DDR3PLLCTL1). . .151
DDR3 PLL DDRCLK Timing. . . . . . . . . . . . . . . . . . . . .152
PASS PLL Block Diagram . . . . . . . . . . . . . . . . . . . . . .153
PASS PLL Control Register 0 (PASSPLLCTL0). . . .153
PASS PLL Control Register 1 (PASSPLLCTL1). . . .154
PASS PLL Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .155
TMS320C6671 Interrupt Topology . . . . . . . . . . . . .163
TMS320C6671 System Event Inputs —
C66x CorePac Primary Interrupts . . . . . . . . . . . . . .163
NMI and Local Reset Timing . . . . . . . . . . . . . . . . . . .183
HOUT Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .183
Configuration Register (CONFIG) . . . . . . . . . . . . . .191
Programmable Range n Start Address
Register (PROGn_MPSAR) . . . . . . . . . . . . . . . . . . . . .192
Programmable Range n End Address
Register (PROGn_MPEAR) . . . . . . . . . . . . . . . . . . . . .192
Programmable Range n Memory Protection
Page Attribute Register (PROGn_MPPA) . . . . . . .193
I2C Module Block Diagram. . . . . . . . . . . . . . . . . . . . .200
I2C Receive Timings . . . . . . . . . . . . . . . . . . . . . . . . . . .202
I2C Transmit Timings . . . . . . . . . . . . . . . . . . . . . . . . . .203
List of Figures
9
TMS320C6671
SPRS756E—November 2010—Revised March 2014
Figure 7-42
Figure 7-43
Figure 7-44
Figure 7-45
Figure 7-46
Figure 7-47
Figure 7-48
Figure 7-49
Figure 7-50
Figure 7-51
10
SPI Master Mode Timing Diagrams —
Base Timings for 3 Pin Mode . . . . . . . . . . . . . . . . . . 206
SPI Additional Timings for 4 Pin Master
Mode with Chip Select Option . . . . . . . . . . . . . . . . 206
HyperLink Station Management Clock
Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 210
HyperLink Station Management Transmit
Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 210
HyperLink Station Management Receive
Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 210
UART Receive Timing Waveform . . . . . . . . . . . . . . 211
UART CTS (Clear-to-Send Input) —
Autoflow Timing Waveform . . . . . . . . . . . . . . . . . . 211
UART Transmit Timing Waveform . . . . . . . . . . . . . 212
UART RTS (Request-to-Send Output) —
Autoflow Timing Waveform . . . . . . . . . . . . . . . . . . 212
TSIP 2x Timing Diagram(1) . . . . . . . . . . . . . . . . . . . . 213
List of Figures
Figure 7-52
Figure 7-53
Figure 7-54
Figure 7-55
Figure 7-56
Figure 7-57
Figure 7-58
Figure 7-59
Figure 7-60
Figure 7-61
Figure 7-62
Figure 7-63
Figure 7-64
Figure 7-65
TSIP 1x Timing Diagram(1) . . . . . . . . . . . . . . . . . . . . .214
EMIF16 Asynchronous Memory Read
Timing Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .216
EMIF16 Asynchronous Memory Write
Timing Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .216
EMIF16 EM_WAIT Read Timing Diagram . . . . . . .217
EMIF16 EM_WAIT Write Timing Diagram . . . . . . .217
MACID1 Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .218
MACID2 Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .218
CPTS_RFTCLK_SEL Register. . . . . . . . . . . . . . . . . . . .219
MDIO Input Timing . . . . . . . . . . . . . . . . . . . . . . . . . . .220
MDIO Output Timing. . . . . . . . . . . . . . . . . . . . . . . . . .220
Timer Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .222
GPIO Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .223
Trace Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .225
JTAG Test-Port Timing . . . . . . . . . . . . . . . . . . . . . . . .227
Copyright 2014 Texas Instruments Incorporated
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TMS320C6671
SPRS756E—November 2010—Revised March 2014
List of Tables
Table 2-1
Table 2-2
Table 2-3
Table 2-4
Table 2-5
Table 2-6
Table 2-7
Table 2-8
Table 2-9
Table 2-10
Table 2-11
Table 2-12
Table 2-13
Table 2-14
Table 2-15
Table 2-16
Table 2-17
Table 2-18
Table 2-19
Table 2-20
Table 2-21
Table 2-22
Table 2-23
Table 2-24
Table 2-25
Table 2-26
Table 2-27
Table 2-28
Table 2-29
Table 3-1
Table 3-2
Table 3-3
Table 3-4
Table 3-5
Table 3-6
Table 3-7
Table 3-8
Table 3-9
Table 3-10
Table 3-11
Device Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 13
Memory Map Summary. . . . . . . . . . . . . . . . . . . . . . . . 17
Bootloader section in L2 SRAM . . . . . . . . . . . . . . . . 23
Boot Mode Pins: Boot Device Values . . . . . . . . . . . 25
Extended Boot Modes . . . . . . . . . . . . . . . . . . . . . . . . . 25
No Boot / EMIF16 Configuration
Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Serial Rapid I/O Configuration
Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Ethernet (SGMII) Configuration
Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
PCI Device Configuration Field Descriptions. . . . 27
BAR Config / PCIe Window Sizes . . . . . . . . . . . . . . . 28
I2C Master Mode Device Configuration
Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
I2C Passive Mode Device Configuration
Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
SPI Device Configuration Field Descriptions . . . . 29
HyperLink Boot Device Configuration
Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Boot Parameter Table Common Parameters . . . . 31
EMIF16 Boot Mode Parameter Table . . . . . . . . . . . 31
SRIO Boot Mode Parameter Table . . . . . . . . . . . . . . 32
Ethernet Boot Mode Parameter Table . . . . . . . . . . 32
PCIe Boot Mode Parameter Table . . . . . . . . . . . . . . 34
I2C Boot Mode Parameter Table. . . . . . . . . . . . . . . . 34
SPI Boot Mode Parameter Table. . . . . . . . . . . . . . . . 35
HyperLink Boot Mode Parameter Table . . . . . . . . 36
DDR3 Boot Parameter Table . . . . . . . . . . . . . . . . . . . 37
C66x DSP System PLL Configuration . . . . . . . . . . . 38
I/O Functional Symbol Definitions . . . . . . . . . . . . . 44
Terminal Functions — Signals and Control
by Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Terminal Functions — Power and Ground. . . . . . 57
Terminal Functions — By Signal Name . . . . . . . . . 58
Terminal Functions — By Ball Number . . . . . . . . . 63
TMS320C6671 Device Configuration Pins . . . . . . 73
Device State Control Registers . . . . . . . . . . . . . . . . . 74
Device Status Register Field Descriptions. . . . . . . 78
Device Configuration Register (DEVCFG) Field
Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
JTAG ID Register (JTAGID) Field Descriptions . . . 79
DSP BOOT Address Register (DSP_BOOT_ADDRn)
Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
LRESETNMI PIN Status Register (LRSTNMIPINSTAT)
Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
LRESETNMI PIN Status Clear Register
(LRSTNMIPINSTAT_CLR) Field Descriptions . . . . . 81
Reset Status Register (RESET_STAT) Field
Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
Reset Status Clear Register (RESET_STAT_CLR) Field
Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
Boot Complete Register (BOOTCOMPLETE) Field
Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
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Table 3-12
Table 3-13
Table 3-14
Table 3-15
Table 3-16
Table 3-17
Table 3-18
Table 3-19
Table 3-20
Table 3-21
Table 3-22
Table 3-23
Table 4-1
Table 4-2
Table 4-3
Table 5-1
Table 5-2
Table 6-1
Table 6-2
Table 6-3
Table 6-4
Table 7-1
Table 7-2
Table 7-3
Table 7-4
Table 7-5
Table 7-6
Table 7-7
Table 7-8
Table 7-9
Table 7-10
Table 7-11
Table 7-12
Table 7-13
Table 7-14
Power State Control Register (PWRSTATECTL)
Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .84
NMI Generation Register (NMIGRx)
Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .84
IPC Generation Registers (IPCGRx)
Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .85
IPC Acknowledgement Registers (IPCARx)
Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .86
IPC Generation Registers (IPCGRH)
Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .87
IPC Acknowledgement Register (IPCARH)
Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .87
Timer Input Selection Field Description
(TINPSEL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .88
Timer Output Selection Register (TOUTPSEL)
Field Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .90
Reset Mux Register (RSTMUXx)
Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .91
DSP Suspension Control Register
(DSP_SUSP_CTL) Field Descriptions. . . . . . . . . . . . .92
Device Speed Register (DEVSPEED)
Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .93
Chip Miscellaneous Control Register
(CHIP_MISC_CTL) Field Descriptions . . . . . . . . . . . .93
Data Switch Fabric Connection Matrix . . . . . . . . . .98
Configuration Switch Fabric Connection
Matrix Section1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .101
Configuration Switch Fabric Connection
Matrix Section2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .102
Available Memory Page Protection Schemes . . .110
CorePac Revision ID Register (MM_REVID)
Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .112
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . .113
Recommended Operating Conditions . . . . . . . . .114
Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . .115
Power Supply to Peripheral I/O Mapping . . . . . .116
Power Supply Rails on the TMS320C6671 . . . . . .118
Core Before IO Power Sequencing . . . . . . . . . . . . .121
IO Before Core Power Sequencing . . . . . . . . . . . . .123
Clock Sequencing. . . . . . . . . . . . . . . . . . . . . . . . . . . . .124
SmartReflex 4-Pin VID Interface Switching
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .125
Power Domains . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .126
Clock Domains. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .127
PSC Register Memory Map . . . . . . . . . . . . . . . . . . . .128
Reset Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .130
Reset Timing Requirements . . . . . . . . . . . . . . . . . . .135
Reset Switching Characteristics Over
Recommended Operating Conditions . . . . . . . . .135
Boot Configuration Timing Requirements. . . . . .136
Main PLL Stabilization, Lock, and Reset Times . .139
PLL Controller Registers (Including Reset
Controller) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .140
List of Tables
11
TMS320C6671
SPRS756E—November 2010—Revised March 2014
Table 7-15
Table 7-16
Table 7-17
Table 7-18
Table 7-19
Table 7-20
Table 7-21
Table 7-22
Table 7-23
Table 7-24
Table 7-25
Table 7-26
Table 7-27
Table 7-28
Table 7-29
Table 7-30
Table 7-31
Table 7-32
Table 7-33
Table 7-34
Table 7-35
Table 7-36
Table 7-37
Table 7-38
Table 7-39
Table 7-40
Table 7-41
Table 7-42
Table 7-43
Table 7-44
Table 7-45
Table 7-46
Table 7-47
Table 7-48
Table 7-49
12
PLL Secondary Control Register (SECCTL)
Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141
PLL Controller Divider Register (PLLDIVn)
Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142
PLL Controller Clock Align Control Register
(ALNCTL) Field Descriptions . . . . . . . . . . . . . . . . . . 143
PLLDIV Divider Ratio Change Status Register
(DCHANGE) Field Descriptions . . . . . . . . . . . . . . . . 143
SYSCLK Status Register (SYSTAT)
Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144
Reset Type Status Register (RSTYPE)
Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144
Reset Control Register (RSTCTRL)
Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145
Reset Configuration Register (RSTCFG)
Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145
Reset Isolation Register (RSISO)
Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 146
Main PLL Control Register 0 (MAINPLLCTL0)
Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 147
Main PLL Control Register 1 (MAINPLLCTL1)
Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 147
Main PLL Controller/SRIO/HyperLink/PCIe
Clock Input Timing Requirements. . . . . . . . . . . . . 148
DDR3 PLL Control Register 0
Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150
DDR3 PLL Control Register 1
Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151
DDR3 PLL DDRSYSCLK1(N|P)
Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . 152
PASS PLL Control Register 0
Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154
PASS PLL Control Register 1
Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154
PASS PLL Timing Requirements . . . . . . . . . . . . . . . 155
EDMA3 Channel Controller Configuration . . . . . 157
EDMA3 Transfer Controller Configuration . . . . . 158
EDMA3CC0 Events for C6671 . . . . . . . . . . . . . . . . . 158
EDMA3CC1 Events for C6671 . . . . . . . . . . . . . . . . . 158
EDMA3CC2 Events for C6671 . . . . . . . . . . . . . . . . . 160
CIC0 Event Inputs (Secondary Interrupts for
C66x CorePacs). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166
CIC2 Event Inputs (Secondary Events for
EDMA3CC1 and EDMA3CC2). . . . . . . . . . . . . . . . . . 170
CIC3 Event Inputs (Secondary Events for
EDMA3CC0 and HyperLink) . . . . . . . . . . . . . . . . . . . 174
CIC0 Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 176
CIC2 Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 178
CIC3 Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180
IPC Generation Registers (IPCGRx) . . . . . . . . . . . . 181
LRESET and NMI Decoding. . . . . . . . . . . . . . . . . . . . 182
NMI and Local Reset Timing Requirements . . . . 183
HOUT Switching Characteristics . . . . . . . . . . . . . . 183
MPU Default Configuration . . . . . . . . . . . . . . . . . . . 184
MPU Memory Regions . . . . . . . . . . . . . . . . . . . . . . . . 184
List of Tables
Table 7-50
Table 7-51
Table 7-52
Table 7-53
Table 7-54
Table 7-55
Table 7-56
Table 7-57
Table 7-58
Table 7-59
Table 7-60
Table 7-61
Table 7-62
Table 7-63
Table 7-64
Table 7-65
Table 7-66
Table 7-67
Table 7-68
Table 7-69
Table 7-70
Table 7-71
Table 7-72
Table 7-73
Table 7-74
Table 7-75
Table 7-76
Table 7-77
Table 7-78
Table 7-79
Table 7-80
Table 7-81
Table 7-82
Table 7-83
Table 7-84
Table 7-85
Table 7-86
Table 7-87
Table 7-88
Table 7-89
Table 9-1
Privilege ID Settings. . . . . . . . . . . . . . . . . . . . . . . . . . .184
Master ID Settings . . . . . . . . . . . . . . . . . . . . . . . . . . .185
MPU0 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .187
MPU1 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .188
MPU2 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .189
MPU3 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .190
Configuration Register (CONFIG)
Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .191
Programmable Range n Start Address Register
(PROGn_MPSAR) Field Descriptions. . . . . . . . . . . .192
Programmable Range n End Address Register
(PROGn_MPEAR) Field Descriptions. . . . . . . . . . . .192
Programmable Range n Memory Protection
Page Attribute Register (PROGn_MPPA) Field
Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .193
Programmable Range n Registers Reset
Values for MPU0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .195
Programmable Range n Registers Reset
Values for MPU1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .195
Programmable Range n Registers Reset
Values for MPU2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .196
Programmable Range n Registers Reset
Values for MPU3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .196
I2C Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .200
I2C Timing Requirements. . . . . . . . . . . . . . . . . . . . . .201
I2C Switching Characteristics . . . . . . . . . . . . . . . . . .202
SPI Timing Requirements. . . . . . . . . . . . . . . . . . . . . .204
SPI Switching Characteristics . . . . . . . . . . . . . . . . . .204
HyperLink Events for C6671 . . . . . . . . . . . . . . . . . . .207
HyperLink Peripheral Timing Requirements . . . .209
HyperLink Peripheral Switching
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .209
UART Timing Requirements . . . . . . . . . . . . . . . . . . .211
UART Switching Characteristics. . . . . . . . . . . . . . . .212
Timing Requirements for TSIP 2x Mode . . . . . . . .213
Timing Requirements for TSIP 1x Mode . . . . . . . .214
EMIF16 Asynchronous Memory Timing
Requirements. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .215
MACID1 Register Field Descriptions. . . . . . . . . . . .218
MACID2 Register Field Descriptions. . . . . . . . . . . .218
CPTS_RFTCLK_SEL Register
Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .219
MDIO Timing Requirements . . . . . . . . . . . . . . . . . . .220
MDIO Switching Characteristics . . . . . . . . . . . . . . .220
Timer Input Timing Requirements . . . . . . . . . . . . .222
Timer Output Switching Characteristics. . . . . . . .222
GPIO Input Timing Requirements. . . . . . . . . . . . . .223
GPIO Output Switching Characteristics . . . . . . . .223
DSP Trace Switching Characteristics . . . . . . . . . . .225
STM Trace Switching Characteristics . . . . . . . . . .225
JTAG Test Port Timing Requirements . . . . . . . . . .226
JTAG Test Port Switching Characteristics . . . . . . .226
Thermal Resistance Characteristics for
CYP (PBGA 841-Pin Package) . . . . . . . . . . . . . . . . . .233
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Fixed and Floating-Point Digital Signal Processor
SPRS756E—March 2014
2 Device Overview
2.1 Device Characteristics
Table 2-1 shows the significant features of the device.
Table 2-1
Device Characteristics
Features
DDR3 Memory Controller (64-bit bus width) [1.5 V I/O]
(clock source = DDRREFCLKN|P)
Peripherals
1
EDMA3 (16 independent channels) [DSP/2 clock rate]
1
EDMA3 (64 independent channels) [DSP/3 clock rate]
2
High-speed 1× / 2× / 4× Serial RapidIO Port (4 lanes)
1
PCIe (2 lanes)
1
10/100/1000 Ethernet
2
Management Data Input/Output (MDIO)
1
HyperLink
1
EMIF16
1
TSIP
2
SPI
1
UART
1
2
Accelerators
TMS320C6671
IC
1
64-Bit Timers (configurable) (internal clock source = CPU/6 clock frequency)
Nine 64-bit (each configurable as two 32-bit
timers)
General-Purpose Input/Output Port (GPIO)
16
Packet Accelerator
1
Security Accelerator
(1)
Size (Bytes)
1
4800KB
32KB L1 Program Memory [SRAM/Cache]
On-Chip Memory
32KB L1 Data Memory [SRAM/Cache]
Organization
512KB L2 Unified Memory/Cache
4096KB MSM SRAM
128KB L3 ROM
C66x CorePac Rev ID
CorePac Revision ID Register (address location: 0181 2000h)
See Section 5.5 ‘‘C66x CorePac Revision’’.
JTAG BSDL_ID
JTAGID register (address location: 0262 0018h)
See Section 3.3.3 ‘‘JTAG ID Register (JTAGID)
Description’’
Frequency
MHz
Cycle Time
ns
Voltage
Process Technology
Core (V)
1250 (1.25 GHz)
1000 (1.0 GHz)
0.8 ns (1.25 GHz)
1 ns (1.0 GHz)
SmartReflex variable supply
I/O (V)
1.0 V, 1.5 V, and 1.8 V
m
0.040 m
BGA Package
24 mm × 24 mm lead-free die bump and solder ball package
CYP 841-Pin (lead-free)
Product Status (2)
Product Preview (PP), Advance Information (AI), or Production Data (PD)
PD
1 The Security Accelerator function is subject to export control and will be enabled only for approved device shipments.
2 PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production
processing does not necessarily include testing of all parameters.
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13
TMS320C6671
Fixed and Floating-Point Digital Signal Processor
SPRS756E—March 2014
2.2 DSP Core Description
The C66x Digital Signal Processor (DSP) extends the performance of the C64x+ and C674x DSPs through
enhancements and new features. Many of the new features target increased performance for vector processing. The
C64x+ and C674x DSPs support 2-way SIMD operations for 16-bit data and 4-way SIMD operations for 8-bit data.
On the C66x DSP, the vector processing capability is improved by extending the width of the SIMD instructions.
C66x DSPs can execute instructions that operate on 128-bit vectors. For example the QMPY32 instruction is able to
perform the element-to-element multiplication between two vectors of four 32-bit data each. The C66x DSP also
supports SIMD for floating-point operations. Improved vector processing capability (each instruction can process
multiple data in parallel) combined with the natural instruction level parallelism of C6000 architecture (e.g
execution of up to 8 instructions per cycle) results in a very high level of parallelism that can be exploited by DSP
programmers through the use of TI's optimized C/C++ compiler.
The C66x DSP consists of eight functional units, two register files, and two data paths as shown in Figure 2-1. The
two general-purpose register files (A and B) each contain thirty-two 32-bit registers for a total of 64 registers. The
general-purpose registers can be used for data or can be data address pointers. The data types supported include
packed 8-bit data, packed 16-bit data, 32-bit data, 40-bit data, and 64-bit data. Multiplies also support 128-bit data.
40-bit-long or 64-bit-long values are stored in register pairs, with the 32 LSBs of data placed in an even register and
the remaining 8 or 32 MSBs in the next upper register (which is always an odd-numbered register). 128-bit data
values are stored in register quadruplets, with the 32 LSBs of data placed in a register that is a multiple of 4 and the
remaining 96 MSBs in the next 3 upper registers.
The eight functional units (.M1, .L1, .D1, .S1, .M2, .L2, .D2, and .S2) are each capable of executing one instruction
every clock cycle. The .M functional units perform all multiply operations. The .S and .L units perform a general set
of arithmetic, logical, and branch functions. The .D units primarily load data from memory to the register file and
store results from the register file into memory.
Each C66x .M unit can perform one of the following fixed-point operations each clock cycle: four 32 × 32 bit
multiplies, sixteen 16 × 16 bit multiplies, four 16 × 32 bit multiplies, four 8 × 8 bit multiplies, four 8 × 8 bit multiplies
with add operations, and four 16 × 16 multiplies with add/subtract capabilities. There is also support for Galois field
multiplication for 8-bit and 32-bit data. Many communications algorithms such as FFTs and modems require
complex multiplication. Each C66x .M unit can perform one 16 × 16 bit complex multiply with or without rounding
capabilities, two 16 × 16 bit complex multiplies with rounding capability, and a 32 × 32 bit complex multiply with
rounding capability. The C66x can also perform two 16 × 16 bit and one 32 × 32 bit complex multiply instructions
that multiply a complex number with a complex conjugate of another number with rounding capability.
Communication signal processing also requires an extensive use of matrix operations. Each C66x .M unit is capable
of multiplying a [1 × 2] complex vector by a [2 × 2] complex matrix per cycle with or without rounding capability.
A version also exists allowing multiplication of the conjugate of a [1 × 2] vector with a [2 × 2] complex matrix.
Each C66x .M unit also includes IEEE floating-point multiplication operations from the C674x DSP, which includes
one single-precision multiply each cycle and one double-precision multiply every 4 cycles. There is also a
mixed-precision multiply that allows multiplication of a single-precision value by a double-precision value and an
operation allowing multiplication of two single-precision numbers resulting in a double-precision number. The
C66x DSP improves the performance over the C674x double-precision multiplies by adding a instruction allowing
one double-precision multiply per cycle and also reduces the number of delay slots from 10 down to 4. Each C66x .M
unit can also perform one the following floating-point operations each clock cycle: one, two, or four single-precision
multiplies or a complex single-precision multiply.
The .L and .S units can now support up to 64-bit operands. This allows for new versions of many of the arithmetic,
logical, and data packing instructions to allow for more parallel operations per cycle. Additional instructions were
added yielding performance enhancements of the floating point addition and subtraction instructions, including the
ability to perform one double precision addition or subtraction per cycle. Conversion to/from integer and
14
Device Overview
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Fixed and Floating-Point Digital Signal Processor
SPRS756E—March 2014
single-precision values can now be done on both .L and .S units on the C66x. Also, by taking advantage of the larger
operands, instructions were also added to double the number of these conversions that can be done. The .L unit also
has additional instructions for logical AND and OR instructions, as well as, 90 degree or 270 degree rotation of
complex numbers (up to two per cycle). Instructions have also been added that allow for the computing the
conjugate of a complex number.
The MFENCE instruction is a new instruction introduced on the C66x DSP. This instruction will create a DSP stall
until the completion of all the DSP-triggered memory transactions, including:
• Cache line fills
• Writes from L1D to L2 or from the CorePac to MSMC and/or other system endpoints
• Victim write backs
• Block or global coherence operations
• Cache mode changes
• Outstanding XMC prefetch requests
This is useful as a simple mechanism for programs to wait for these requests to reach their endpoint. It also provides
ordering guarantees for writes arriving at a single endpoint via multiple paths, multiprocessor algorithms that
depend on ordering, and manual coherence operations.
For more details on the C66x DSP and its enhancements over the C64x+ and C674x architectures, see the following
documents:
• C66x DSP CPU and Instruction Set Reference Guide in ‘‘Related Documentation from Texas Instruments’’ on
page 72.
• C66x DSP Cache User Guide in ‘‘Related Documentation from Texas Instruments’’ on page 72.
• C66x DSP CorePac User Guide in ‘‘Related Documentation from Texas Instruments’’ on page 72.
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Device Overview
15
TMS320C6671
Fixed and Floating-Point Digital Signal Processor
SPRS756E—March 2014
Figure 2-1 shows the DSP core functional units and data paths.
Figure 2-1
DSP Core Data Paths
Note:
Default bus width
is 64 bits
(i.e. a register pair)
src1
.L1
Register
File A
(A0, A1, A2,
...A31)
src2
dst
ST1
src1
.S1
src2
dst
src1
src1_hi
Data Path A
.M1
src2
src2_hi
dst2
dst1
LD1
32
src1
DA1
32
.D1
dst
32
src2
32
32
2´
1´
src2
DA2
32
.D2
dst
src1
Register
File B
(B0, B1, B2,
...B31)
32
32
32
32
32
LD2
dst1
dst2
src2_hi
.M2
src2
src1_hi
src1
Data Path B
dst
.S2
src2
src1
ST2
dst
.L2
src2
src1
32
Control
Register
32
16
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TMS320C6671
Fixed and Floating-Point Digital Signal Processor
SPRS756E—March 2014
2.3 Memory Map Summary
Table 2-2 shows the memory map address ranges of the TMS320C6671 device.
Table 2-2
Memory Map Summary (Part 1 of 7)
Logical 32-bit Address
Physical 36-bit Address
Start
End
Start
End
Bytes
Description
00000000
007FFFFF
0 00000000
0 007FFFFF
8M
Reserved
00800000
0087FFFF
0 00800000
0 0087FFFF
512K
Local L2 SRAM
00880000
00DFFFFF
0 00880000
0 00DFFFFF
5M+512K
Reserved
00E00000
00E07FFF
0 00E00000
0 00E07FFF
32K
Local L1P SRAM
00E08000
00EFFFFF
0 00E08000
0 00EFFFFF
1M-32K
Reserved
00F00000
00F07FFF
0 00F00000
0 00F07FFF
32K
Local L1D SRAM
00F08000
017FFFFF
0 00F08000
0 017FFFFF
9M-32K
Reserved
01800000
01BFFFFF
0 01800000
0 01BFFFFF
4M
C66x CorePac Registers
01C00000
01CFFFFF
0 01C00000
0 01CFFFFF
1M
Reserved
01D00000
01D0007F
0 01D00000
0 01D0007F
128
Tracer_MSMC_0
01D00080
01D07FFF
0 01D00080
0 01D07FFF
32K-128
Reserved
01D08000
01D0807F
0 01D08000
0 01D0807F
128
Tracer_MSMC_1
01D08080
01D0FFFF
0 01D08080
0 01D0FFFF
32K-128
Reserved
01D10000
01D1007F
0 01D10000
0 01D1007F
128
Tracer_MSMC_2
01D10080
01D17FFF
0 01D10080
0 01D17FFF
32K-128
Reserved
01D18000
01D1807F
0 01D18000
0 01D1807F
128
Tracer_MSMC_3
01D18080
01D1FFFF
0 01D18080
0 01D1FFFF
32K-128
Reserved
01D20000
01D2007F
0 01D20000
0 01D2007F
128
Tracer_QM_DMA
01D20080
01D27FFF
0 01D20080
0 01D27FFF
32K-128
Reserved
01D28000
01D2807F
0 01D28000
0 01D2807F
128
Tracer_DDR
01D28080
01D2FFFF
0 01D28080
0 01D2FFFF
32K-128
Reserved
01D30000
01D3007F
0 01D30000
0 01D3007F
128
Tracer_SM
01D30080
01D37FFF
0 01D30080
0 01D37FFF
32K-128
Reserved
01D38000
01D3807F
0 01D38000
0 01D3807F
128
Tracer_QM_CFG
01D38080
01D3FFFF
0 01D38080
0 01D3FFFF
32K-128
Reserved
01D40000
01D4007F
0 01D40000
0 01D4007F
128
Tracer_CFG
01D40080
01D47FFF
0 01D40080
0 01D47FFF
32K-128
Reserved
01D48000
01D4807F
0 01D48000
0 01D4807F
128
Tracer_L2_0
01D48080
01D4FFFF
0 01D48080
0 01D4FFFF
32K-128
Reserved
01D50000
01D5007F
0 01D50000
0 01D5007F
128
Reserved
01D50080
01D57FFF
0 01D50080
0 01D57FFF
32K-128
Reserved
01D58000
01D5807F
0 01D58000
0 01D5807F
128
Reserved
01D58080
01D5FFFF
0 01D58080
0 01D5FFFF
32K-128
Reserved
01D60000
01D6007F
0 01D60000
0 01D6007F
128
Reserved
01D60080
01D67FFF
0 01D60080
0 01D67FFF
32K-128
Reserved
01D68000
01D6807F
0 01D68000
0 01D6807F
128
Reserved
01D68080
01D6FFFF
0 01D68080
0 01D6FFFF
32K-128
Reserved
01D70000
01D7007F
0 01D70000
0 01D7007F
128
Reserved
01D70080
01D77FFF
0 01D70080
0 01D77FFF
32K-128
Reserved
01D78000
01D7807F
0 01D78000
0 01D7807F
128
Reserved
Copyright 2014 Texas Instruments Incorporated
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Device Overview
17
TMS320C6671
Fixed and Floating-Point Digital Signal Processor
SPRS756E—March 2014
Table 2-2
Memory Map Summary (Part 2 of 7)
Logical 32-bit Address
Physical 36-bit Address
Start
End
Start
End
Bytes
Description
01D78080
01D7FFFF
0 01D78080
0 01D7FFFF
32K-128
Reserved
01D80000
01D8007F
0 01D80000
0 01D8007F
128
Reserved
01D80080
01DFFFFF
0 01D80080
0 01DFFFFF
512K-128
Reserved
01E00000
01E3FFFF
0 01E00000
0 01E3FFFF
256K
Telecom Serial Interface Port (TSIP) 0
01E40000
01E7FFFF
0 01E40000
0 01E7FFFF
256K
Reserved
01E80000
01EBFFFF
0 01E80000
0 01EBFFFF
256K
Telecom Serial Interface Port (TSIP) 1
01EC0000
01FFFFFF
0 01EC0000
0 01FFFFFF
1M +256K
Reserved
02000000
020FFFFF
0 02000000
0 020FFFFF
1M
Network Coprocessor (Packet Accelerator, Gigabit Ethernet
Switch Subsystem and Security Accelerator)
02100000
021FFFFF
0 02100000
0 021FFFFF
1M
Reserved
02200000
0220007F
0 02200000
0 0220007F
128
Timer0
02200080
0220FFFF
0 02200080
0 0220FFFF
64K-128
Reserved
02210000
0221007F
0 02210000
0 0221007F
128
Reserved
02210080
0221FFFF
0 02210080
0 0221FFFF
64K-128
Reserved
02220000
0222007F
0 02220000
0 0222007F
128
Reserved
02220080
0222FFFF
0 02220080
0 0222FFFF
64K-128
Reserved
02230000
0223007F
0 02230000
0 0223007F
128
Reserved
02230080
0223FFFF
0 02230080
0 0223FFFF
64K-128
Reserved
02240000
0224007F
0 02240000
0 0224007F
128
Reserved
02240080
0224FFFF
0 02240080
0 0224FFFF
64K-128
Reserved
02250000
0225007F
0 02250000
0 0225007F
128
Reserved
02250080
0225FFFF
0 02250080
0 0225FFFF
64K-128
Reserved
02260000
0226007F
0 02260000
0 0226007F
128
Reserved
02260080
0226FFFF
0 02260080
0 0226FFFF
64K-128
Reserved
02270000
0227007F
0 02270000
0 0227007F
128
Reserved
02270080
0227FFFF
0 02270080
0 0227FFFF
64K-128
Reserved
02280000
0228007F
0 02280000
0 0228007F
128
Timer8
02280080
0228FFFF
0 02280080
0 0228FFFF
64K-128
Reserved
02290000
0229007F
0 02290000
0 0229007F
128
Timer9
02290080
0229FFFF
0 02290080
0 0229FFFF
64K-128
Reserved
022A0000
022A007F
0 022A0000
0 022A007F
128
Timer10
022A0080
022AFFFF
0 022A0080
0 022AFFFF
64K-128
Reserved
022B0000
022B007F
0 022B0000
0 022B007F
128
Timer11
022B0080
022BFFFF
0 022B0080
0 022BFFFF
64K-128
Reserved
022C0000
022C007F
0 022C0000
0 022C007F
128
Timer12
022C0080
022CFFFF
0 022C0080
0 022CFFFF
64K-128
Reserved
022D0000
022D007F
0 022D0000
0 022D007F
128
Timer13
022D0080
022DFFFF
0 022D0080
0 022DFFFF
64K-128
Reserved
022E0000
022E007F
0 022E0000
0 022E007F
128
Timer14
022E0080
022EFFFF
0 022E0080
0 022EFFFF
64K-128
Reserved
022F0000
022F007F
0 022F0000
0 022F007F
128
Timer15
022F0080
022FFFFF
0 022F0080
0 022FFFFF
64K-128
Reserved
02300000
0230FFFF
0 02300000
0 0230FFFF
64K
Reserved
18
Device Overview
Copyright 2014 Texas Instruments Incorporated
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TMS320C6671
Fixed and Floating-Point Digital Signal Processor
SPRS756E—March 2014
Table 2-2
Memory Map Summary (Part 3 of 7)
Logical 32-bit Address
Physical 36-bit Address
Start
End
Start
End
Bytes
Description
02310000
023101FF
0 02310000
0 023101FF
512
PLL Controller
02310200
0231FFFF
0 02310200
0 0231FFFF
64K-512
Reserved
02320000
023200FF
0 02320000
0 023200FF
256
GPIO
02320100
0232FFFF
0 02320100
0 0232FFFF
64K-256
Reserved
02330000
023303FF
0 02330000
0 023303FF
1K
SmartReflex
02330400
0234FFFF
0 02330400
0 0234FFFF
127K
Reserved
02350000
02350FFF
0 02350000
0 02350FFF
4K
Power Sleep Controller (PSC)
02351000
0235FFFF
0 02351000
0 0235FFFF
64K-4K
Reserved
02360000
023603FF
0 02360000
0 023603FF
1K
Memory Protection Unit (MPU) 0
02360400
02367FFF
0 02360400
0 02367FFF
31K
Reserved
02368000
023683FF
0 02368000
0 023683FF
1K
Memory Protection Unit (MPU) 1
02368400
0236FFFF
0 02368400
0 0236FFFF
31K
Reserved
02370000
023703FF
0 02370000
0 023703FF
1K
Memory Protection Unit (MPU) 2
02370400
02377FFF
0 02370400
0 02377FFF
31K
Reserved
02378000
023783FF
0 02378000
0 023783FF
1K
Memory Protection Unit (MPU) 3
02378400
023FFFFF
0 02378400
0 023FFFFF
543K
Reserved
02400000
0243FFFF
0 02400000
0 0243FFFF
256K
Debug Subsystem Configuration
02440000
02443FFF
0 02440000
0 02443FFF
16K
DSP trace formatter 0
02444000
0244FFFF
0 02444000
0 0244FFFF
48K
Reserved
02450000
02453FFF
0 02450000
0 02453FFF
16K
Reserved
02454000
0245FFFF
0 02454000
0 0245FFFF
48K
Reserved
02460000
02463FFF
0 02460000
0 02463FFF
16K
Reserved
02464000
0246FFFF
0 02464000
0 0246FFFF
48K
Reserved
02470000
02473FFF
0 02470000
0 02473FFF
16K
Reserved
02474000
0247FFFF
0 02474000
0 0247FFFF
48K
Reserved
02480000
02483FFF
0 02480000
0 02483FFF
16K
Reserved
02484000
0248FFFF
0 02484000
0 0248FFFF
48K
Reserved
02490000
02493FFF
0 02490000
0 02493FFF
16K
Reserved
02494000
0249FFFF
0 02494000
0 0249FFFF
48K
Reserved
024A0000
024A3FFF
0 024A0000
0 024A3FFF
16K
Reserved
024A4000
024AFFFF
0 024A4000
0 024AFFFF
48K
Reserved
024B0000
024B3FFF
0 024B0000
0 024B3FFF
16K
Reserved
024B4000
024BFFFF
0 024B4000
0 024BFFFF
48K
Reserved
024C0000
0252FFFF
0 024C0000
0 0252FFFF
448K
Reserved
02530000
0253007F
0 02530000
0 0253007F
128
I2C data & control
02530080
0253FFFF
0 02530080
0 0253FFFF
64K-128
Reserved
02540000
0254003F
0 02540000
0 0254003F
64
UART
02540400
0254FFFF
0 02540400
0 0254FFFF
64K-64
Reserved
02550000
025FFFFF
0 02550000
0 025FFFFF
704K
Reserved
02600000
02601FFF
0 02600000
0 02601FFF
8K
Chip Interrupt Controller (CIC) 0
02602000
02603FFF
0 02602000
0 02603FFF
8K
Reserved
02604000
02605FFF
0 02604000
0 02605FFF
8K
Reserved
02606000
02607FFF
0 02606000
0 02607FFF
8K
Reserved
Copyright 2014 Texas Instruments Incorporated
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Device Overview
19
TMS320C6671
Fixed and Floating-Point Digital Signal Processor
SPRS756E—March 2014
Table 2-2
Memory Map Summary (Part 4 of 7)
Logical 32-bit Address
Physical 36-bit Address
Start
End
Start
End
Bytes
Description
02608000
02609FFF
0 02608000
0 02609FFF
8K
Chip Interrupt Controller (CIC) 2
0260A000
0260BFFF
0 0260A000
0 0260BFFF
8K
Reserved
0260C000
0260DFFF
0 0260C000
0 0260DFFF
8K
Chip Interrupt Controller (CIC) 3
0260E000
0261FFFF
0 0260E000
0 0261FFFF
72K
Reserved
02620000
026207FF
0 02620000
0 026207FF
2K
Chip-Level Registers
02620800
0263FFFF
0 02620800
0 0263FFFF
126K
Reserved
02640000
026407FF
0 02640000
0 026407FF
2K
Semaphore
02640800
0264FFFF
0 02640800
0 0264FFFF
64K-2K
Reserved
02650000
026FFFFF
0 02650000
0 026FFFFF
704K
Reserved
02700000
02707FFF
0 02700000
0 02707FFF
32K
EDMA3 Channel Controller (EDMA3CC) 0
02708000
0271FFFF
0 02708000
0 0271FFFF
96K
Reserved
02720000
02727FFF
0 02720000
0 02727FFF
32K
EDMA3 Channel Controller (EDMA3CC) 1
02728000
0273FFFF
0 02728000
0 0273FFFF
96K
Reserved
02740000
02747FFF
0 02740000
0 02747FFF
32K
EDMA3 Channel Controller (EDMA3CC) 2
02748000
0275FFFF
0 02748000
0 0275FFFF
96K
Reserved
02760000
027603FF
0 02760000
0 027603FF
1K
EDMA3CC0 Transfer Controller (EDMA3TC) 0
02760400
02767FFF
0 02760400
0 02767FFF
31K
Reserved
02768000
027683FF
0 02768000
0 027683FF
1K
EDMA3CC0 Transfer Controller (EDMA3TC) 1
02768400
0276FFFF
0 02768400
0 0276FFFF
31K
Reserved
02770000
027703FF
0 02770000
0 027703FF
1K
EDMA3CC1 Transfer Controller (EDMA3TC) 0
02770400
02777FFF
0 02770400
0 02777FFF
31K
Reserved
02778000
027783FF
0 02778000
0 027783FF
1K
EDMA3CC1 Transfer Controller (EDMA3TC) 1
02778400
0277FFFF
0 02778400
0 0277FFFF
31K
Reserved
02780000
027803FF
0 02780000
0 027803FF
1K
EDMA3CC1 Transfer Controller (EDMA3TC) 2
02780400
02787FFF
0 02780400
0 02787FFF
31K
Reserved
02788000
027883FF
0 02788000
0 027883FF
1K
EDMA3CC1 Transfer Controller (EDMA3TC) 3
02788400
0278FFFF
0 02788400
0 0278FFFF
31K
Reserved
02790000
027903FF
0 02790000
0 027903FF
1K
EDMA3PCC2 Transfer Controller (EDMA3TC) 0
02790400
02797FFF
0 02790400
0 02797FFF
31K
Reserved
02798000
027983FF
0 02798000
0 027983FF
1K
EDMA3CC2 Transfer Controller (EDMA3TC) 1
02798400
0279FFFF
0 02798400
0 0279FFFF
31K
Reserved
027A0000
027A03FF
0 027A0000
0 027A03FF
1K
EDMA3CC2 Transfer Controller (EDMA3TC) 2
027A0400
027A7FFF
0 027A0400
0 027A7FFF
31K
Reserved
027A8000
027A83FF
0 027A8000
0 027A83FF
1K
EDMA3CC2 Transfer Controller (EDMA3TC) 3
027A8400
027AFFFF
0 027A8400
0 027AFFFF
31K
Reserved
027B0000
027CFFFF
0 027B0000
0 027CFFFF
128K
Reserved
027D0000
027D0FFF
0 027D0000
0 027D0FFF
4K
TI embedded trace buffer (TETB) - CorePac0
027D1000
027DFFFF
0 027D1000
0 027DFFFF
60K
Reserved
027E0000
027E0FFF
0 027E0000
0 027E0FFF
4K
Reserved
027E1000
027EFFFF
0 027E1000
0 027EFFFF
60K
Reserved
027F0000
027F0FFF
0 027F0000
0 027F0FFF
4K
Reserved
027F1000
027FFFFF
0 027F1000
0 027FFFFF
60K
Reserved
02800000
02800FFF
0 02800000
0 02800FFF
4K
Reserved
20
Device Overview
Copyright 2014 Texas Instruments Incorporated
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TMS320C6671
Fixed and Floating-Point Digital Signal Processor
SPRS756E—March 2014
Table 2-2
Memory Map Summary (Part 5 of 7)
Logical 32-bit Address
Physical 36-bit Address
Start
End
Start
End
Bytes
Description
02801000
0280FFFF
0 02801000
0 0280FFFF
60K
Reserved
02810000
02810FFF
0 02810000
0 02810FFF
4K
Reserved
02811000
0281FFFF
0 02811000
0 0281FFFF
60K
Reserved
02820000
02820FFF
0 02820000
0 02820FFF
4K
Reserved
02821000
0282FFFF
0 02821000
0 0282FFFF
60K
Reserved
02830000
02830FFF
0 02830000
0 02830FFF
4K
Reserved
02831000
0283FFFF
0 02831000
0 0283FFFF
60K
Reserved
02840000
02840FFF
0 02840000
0 02840FFF
4K
Reserved
02841000
0284FFFF
0 02841000
0 0284FFFF
60K
Reserved
02850000
02857FFF
0 02850000
0 02857FFF
32K
TI embedded trace buffer (TETB) — system
02858000
0285FFFF
0 02858000
0 0285FFFF
32K
Reserved
02860000
028FFFFF
0 02860000
0 028FFFFF
640K
Reserved
02900000
02920FFF
0 02900000
0 02920FFF
132K
Serial RapidIO (SRIO) configuration
02921000
029FFFFF
0 02921000
0 029FFFFF
1M-132K
Reserved
02A00000
02BFFFFF
0 02A00000
0 02BFFFFF
2M
Queue manager subsystem configuration
02C00000
07FFFFFF
0 02C00000
0 07FFFFFF
84M
Reserved
08000000
0800FFFF
0 08000000
0 0800FFFF
64K
Extended memory controller (XMC) configuration
08010000
0BBFFFFF
0 08010000
0 0BBFFFFF
60M-64K
Reserved
0BC00000
0BCFFFFF
0 0BC00000
0 0BCFFFFF
1M
Multicore shared memory controller (MSMC) config
0BD00000
0BFFFFFF
0 0BD00000
0 0BFFFFFF
3M
Reserved
0C000000
0C3FFFFF
0 0C000000
0 0C3FFFFF
4M
Multicore shared memory (MSM)
0C400000
107FFFFF
0 0C400000
0 107FFFFF
68 M
Reserved
10800000
1087FFFF
0 10800000
0 1087FFFF
512K
CorePac0 L2 SRAM
10880000
108FFFFF
0 10880000
0 108FFFFF
512K
Reserved
10900000
10DFFFFF
0 10900000
0 10DFFFFF
5M
Reserved
10E00000
10E07FFF
0 10E00000
0 10E07FFF
32K
CorePac0 L1P SRAM
10E08000
10EFFFFF
0 10E08000
0 10EFFFFF
1M-32K
Reserved
10F00000
10F07FFF
0 10F00000
0 10F07FFF
32K
CorePac0 L1D SRAM
10F08000
117FFFFF
0 10F08000
0 117FFFFF
9M-32K
Reserved
11800000
1187FFFF
0 11800000
0 1187FFFF
512K
Reserved
11880000
118FFFFF
0 11880000
0 118FFFFF
512K
Reserved
11900000
11DFFFFF
0 11900000
0 11DFFFFF
5M
Reserved
11E00000
11E07FFF
0 11E00000
0 11E07FFF
32K
Reserved
11E08000
11EFFFFF
0 11E08000
0 11EFFFFF
1M-32K
Reserved
11F00000
11F07FFF
0 11F00000
0 11F07FFF
32K
Reserved
11F08000
127FFFFF
0 11F08000
0 127FFFFF
9M-32K
Reserved
12800000
1287FFFF
0 12800000
0 1287FFFF
512K
Reserved
12880000
128FFFFF
0 12880000
0 128FFFFF
512K
Reserved
12900000
12DFFFFF
0 12900000
0 12DFFFFF
5M
Reserved
12E00000
12E07FFF
0 12E00000
0 12E07FFF
32K
Reserved
12E08000
12EFFFFF
0 12E08000
0 12EFFFFF
1M-32K
Reserved
12F00000
12F07FFF
0 12F00000
0 12F07FFF
32K
Reserved
12F08000
137FFFFF
0 12F08000
0 137FFFFF
9M-32K
Reserved
Copyright 2014 Texas Instruments Incorporated
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Device Overview
21
TMS320C6671
Fixed and Floating-Point Digital Signal Processor
SPRS756E—March 2014
Table 2-2
Memory Map Summary (Part 6 of 7)
Logical 32-bit Address
Physical 36-bit Address
Start
End
Start
End
Bytes
Description
13800000
1387FFFF
0 13800000
0 1387FFFF
512K
Reserved
13880000
138FFFFF
0 13880000
0 138FFFFF
512K
Reserved
13900000
13DFFFFF
0 13900000
0 13DFFFFF
5M
Reserved
13E00000
13E07FFF
0 13E00000
0 13E07FFF
32K
Reserved
13E08000
13EFFFFF
0 13E08000
0 13EFFFFF
1M-32K
Reserved
13F00000
13F07FFF
0 13F00000
0 13F07FFF
32K
Reserved
13F08000
147FFFFF
0 13F08000
0 147FFFFF
9M-32K
Reserved
14800000
1487FFFF
0 14800000
0 1487FFFF
512K
Reserved
14880000
148FFFFF
0 14880000
0 148FFFFF
512K
Reserved
14900000
14DFFFFF
0 14900000
0 14DFFFFF
5M
Reserved
14E00000
14E07FFF
0 14E00000
0 14E07FFF
32K
Reserved
14E08000
14EFFFFF
0 14E08000
0 14EFFFFF
1M-32K
Reserved
14F00000
14F07FFF
0 14F00000
0 14F07FFF
32K
Reserved
14F08000
157FFFFF
0 14F08000
0 157FFFFF
9M-32K
Reserved
15800000
1587FFFF
0 15800000
0 1587FFFF
512K
Reserved
15880000
158FFFFF
0 15880000
0 158FFFFF
512K
Reserved
15900000
15DFFFFF
0 15900000
0 15DFFFFF
5M
Reserved
15E00000
15E07FFF
0 15E00000
0 15E07FFF
32K
Reserved
15E08000
15EFFFFF
0 15E08000
0 15EFFFFF
1M-32K
Reserved
15F00000
15F07FFF
0 15F00000
0 15F07FFF
32K
Reserved
15F08000
167FFFFF
0 15F08000
0 167FFFFF
9M-32K
Reserved
16800000
1687FFFF
0 16800000
0 1687FFFF
512K
Reserved
16880000
168FFFFF
0 16880000
0 168FFFFF
512K
Reserved
16900000
16DFFFFF
0 16900000
0 16DFFFFF
5M
Reserved
16E00000
16E07FFF
0 16E00000
0 16E07FFF
32K
Reserved
16E08000
16EFFFFF
0 16E08000
0 16EFFFFF
1M-32K
Reserved
16F00000
16F07FFF
0 16F00000
0 16F07FFF
32K
Reserved
16F08000
177FFFFF
0 16F08000
0 177FFFFF
9M-32K
Reserved
17800000
1787FFFF
0 17800000
0 1787FFFF
512K
Reserved
17880000
178FFFFF
0 17880000
0 178FFFFF
512K
Reserved
17900000
17DFFFFF
0 17900000
0 17DFFFFF
5M
Reserved
17E00000
17E07FFF
0 17E00000
0 17E07FFF
32K
Reserved
17E08000
17EFFFFF
0 17E08000
0 17EFFFFF
1M-32K
Reserved
17F00000
17F07FFF
0 17F00000
0 17F07FFF
32K
Reserved
17F08000
1FFFFFFF
0 17F08000
0 1FFFFFFF
129M-32K
Reserved
20000000
200FFFFF
0 20000000
0 200FFFFF
1M
System trace manager (STM) configuration
20100000
20AFFFFF
0 20100000
0 20AFFFFF
10M
Reserved
20B00000
20B1FFFF
0 20B00000
0 20B1FFFF
128K
Boot ROM
20B20000
20BEFFFF
0 20B20000
0 20BEFFFF
832K
Reserved
20BF0000
20BF01FF
0 20BF0000
0 20BF01FF
512
SPI
20BF0200
20BFFFFF
0 20BF0200
0 20BFFFFF
64K-512
Reserved
20C00000
20C000FF
0 20C00000
0 20C000FF
256
EMIF16 config
20C00100
20FFFFFF
0 20C00100
0 20FFFFFF
12M - 256
Reserved
22
Device Overview
Copyright 2014 Texas Instruments Incorporated
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TMS320C6671
Fixed and Floating-Point Digital Signal Processor
SPRS756E—March 2014
Table 2-2
Memory Map Summary (Part 7 of 7)
Logical 32-bit Address
Physical 36-bit Address
Start
End
Start
End
Bytes
Description
21000000
210001FF
1 00000000
1 000001FF
512
DDR3 EMIF configuration
21000200
213FFFFF
0 21000200
0 213FFFFF
4M-512
Reserved
21400000
214000FF
0 21400000
0 214000FF
256
HyperLink config
21400100
217FFFFF
0 21400100
0 217FFFFF
4M-256
Reserved
21800000
21807FFF
0 21800000
0 21807FFF
32K
PCIe config
21808000
33FFFFFF
0 21808000
0 33FFFFFF
296M-32K
Reserved
34000000
341FFFFF
0 34000000
0 341FFFFF
2M
Queue manager subsystem data
34200000
3FFFFFFF
0 34200000
0 3FFFFFFF
190M
Reserved
40000000
4FFFFFFF
0 40000000
0 4FFFFFFF
256M
HyperLink data
50000000
5FFFFFFF
0 50000000
0 5FFFFFFF
256M
Reserved
60000000
6FFFFFFF
0 60000000
0 6FFFFFFF
256M
PCIe data
70000000
73FFFFFF
0 70000000
0 73FFFFFF
64M
EMIF16 CE0 data space, supports NAND, NOR or SRAM memory (1)
74000000
77FFFFFF
0 74000000
0 77FFFFFF
64M
EMIF16 CE1 data space, supports NAND, NOR or SRAM memory
78000000
7BFFFFFF
0 78000000
0 7BFFFFFF
64M
EMIF16 CE2 data space, supports NAND, NOR or SRAM memory
7C000000
7FFFFFFF
0 7C000000
0 7FFFFFFF
64M
EMIF16 CE3 data space, supports NAND, NOR or SRAM memory(1)
80000000
FFFFFFFF
8 00000000
8 7FFFFFFF
2G
DDR3 EMIF data
(1)
(1)
(2)
End of Table 2-2
1 32MB per chip select for 16-bit NOR and SRAM. 16MB per chip select for 8-bit NOR and SRAM. The 32MB and 16MB size restrictions do not apply to NAND.
2 The memory map shows only the default MPAX configuration of DDR3 memory space. For the extended DDR3 memory space access (up to 8GB), see the MPAX configuration
details in C66x CorePac User Guide and Multicore Shared Memory Controller (MSMC) for KeyStone Devices User Guide in ‘‘Related Documentation from Texas Instruments’’ on
page 72.
2.4 Boot Sequence
The boot sequence is a process by which the DSP's internal memory is loaded with program and data sections. The
DSP's internal registers are programmed with predetermined values. The boot sequence is started automatically
after each power-on reset, warm reset, and system reset. A local reset to the C66x CorePac should not affect the state
of the hardware boot controller on the device. For more details on the initiators of the resets, see section 7.5 ‘‘Reset
Controller’’ on page 130. The bootloader uses a section of the L2 SRAM (start address 0x0087 2DC0 and end address
0x0087 FFFF) during initial booting of the device. For more details on the type of configurations stored in this
reserved L2 section see Table 2-3.
Table 2-3
Bootloader section in L2 SRAM (Part 1 of 2)
Start Address (Hex)
Size (Hex Bytes)
Description
0x00872DC0
0x40
ROM boot version string (Unreserved)
0x00872E00
0x400
Boot code stack
0x00873200
0xE0
Boot log
0x008732E0
0x20
Boot progress register stack (copies of boot program on mode change)
0x00873300
0x100
Boot Internal Stats
0x00873400
0x20
Boot table arguments
0x00873420
0xE0
ROM boot FAR data
0x00873500
0x100
DDR configuration table
0x00873600
0x80
RAM table
0x00873680
0x80
Boot parameter table
0x00873700
0x4900
Clear text packet scratch
0x00878000
0x7F80
Ethernet/SRIO packet/message/descriptor memory
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Table 2-3
Bootloader section in L2 SRAM (Part 2 of 2)
Start Address (Hex)
Size (Hex Bytes)
0x0087FF80
0x40
Description
Small stack
0x0087FFC0
0x3C
Not used
0x0087FFFC
0x4
Boot magic address
End of Table 2-3
The C6671 supports several boot processes that begins execution at the ROM base address, which contains the
bootloader code necessary to support various device boot modes. The boot processes are software-driven and use
the BOOTMODE[12:0] device configuration inputs to determine the software configuration that must be
completed. For more details on Boot Sequence see the DSP Bootloader for KeyStone Devices User Guide in ‘‘Related
Documentation from Texas Instruments’’ on page 72.
2.5 Boot Modes Supported and PLL Settings
The device supports several boot processes, which leverage the internal boot ROM. Most boot processes are software
driven, using the BOOTMODE[3:0] device configuration inputs to determine the software configuration that must
be completed. From a hardware perspective, there are two possible boot modes:
• Public ROM Boot - C66x CorePac0 is released from reset and begins executing from the L3 ROM base
2
address. After performing the boot process (e.g., from I C ROM, Ethernet, or RapidIO), C66x CorePac0 then
begins execution from the provided boot entry point. See the DSP Bootloader for KeyStone Devices User Guide
in ‘‘Related Documentation from Texas Instruments’’ on page 72 for more details.
• Secure ROM Boot - On secure devices, the C66x CorePac0 is released from reset and begin executing from
secure ROM. Software in the secure ROM will free up internal RAM pages, after which the C66x CorePac0
initiates the boot process. The C66x CorePac0 performs any authentication and decryption required on the
bootloaded image prior to beginning execution.
The boot process performed by the C66x CorePac0 in public ROM boot and secure ROM boot are determined by
the BOOTMODE[12:0] value in the DEVSTAT register. The C66x CorePac0 reads this value, and then executes the
associated boot process in software. Figure 2-2 shows the bits associated with BOOTMODE[12:0].
Figure 2-2
Boot Mode Pin Decoding
Boot Mode Pins
12
11
2
10
PLL Mult I C /SPI Ext Dev Cfg
24
Device Overview
9
8
7
6
Device Configuration
5
4
3
2
1
0
Boot Device
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2.5.1 Boot Device Field
The Boot Device field BOOTMODE[2:0] defines the boot device that is chosen. Table 2-4 shows the supported boot
modes.
Table 2-4
Boot Mode Pins: Boot Device Values
Bit
Field
Description
2-0
Boot Device
Device boot mode
0 = EMIF16 / No Boot
1 = Serial Rapid I/O
2 = Ethernet (SGMII) (PASS PLL configuration assumes input rate same as CORECLK(P|N); BOOTMODE[12:10] values drive
the PASS PLL configuration during boot)
3 = Ethernet (SGMII) (PASS PLL configuration assumes input rate same as SRIOSGMIICLK(P|N); BOOTMODE[9:8] values
drive the PASS PLL configuration during boot)
4 = PCIe
2
5=I C
6 = SPI
7 = HyperLink
End of Table 2-4
Internally, these boot modes are translated by RBL into the extended boot mode value that is used in the boot
parameter table. Table 2-5 shows the details of extended boot mode values.
Table 2-5
Extended Boot Modes
Boot Type
Extended Boot Mode Value (Decimal)
Ethernet Boot Mode
10
SRIO Boot Mode
20
PCIe Boot Mode
30
2
40
I C Passive Boot Mode
2
41
SPI Boot Mode
50
HyperLink Boot Mode
60
EMIF 16 Boot Mode
70
Sleep Boot Mode
100
I C Master Boot Mode
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2.5.2 Device Configuration Field
The device configuration fields BOOTMODE[9:3] are used to configure the boot peripheral and, therefore, the bit
definitions depend on the boot mode
2.5.2.1 No Boot/ EMIF16 Boot Device Configuration
Figure 2-3
No Boot/ EMIF16 Configuration Fields
9
8
Reserved
Table 2-6
7
6
Wait Enable
Reserved
5
4
3
Sub-Mode
Reserved
No Boot / EMIF16 Configuration Field Descriptions
Bit
Field
Description
9-8
Reserved
Reserved
7
Wait Enable
Extended Wait mode for EMIF16.
0 = Wait enable disabled (EMIF16 sub mode)
1 = Wait enable enabled (EMIF16 sub mode)
6
Reserved
Reserved
5-4
Sub-Mode
Sub mode selection.
0 = No boot
1 = EMIF16 boot
2 -3 = Reserved
3
Reserved
Reserved
End of Table 2-6
2.5.2.2 Serial Rapid I/O Boot Device Configuration
The device ID is always set to 0xff (8-bit node IDs) or 0xffff (16 bit node IDs) at power-on reset.
Figure 2-4
Serial Rapid I/O Device Configuration Fields
9
8
Lane Setup
Table 2-7
7
6
Data Rate
5
4
Ref Clock
3
Reserved
Serial Rapid I/O Configuration Field Descriptions
Bit
Field
Description
9
Lane Setup
SRIO port and lane configuration
0 = Port Configured as 4 ports each 1 lane wide (4 -1× ports)
1 = Port Configured as 2 ports 2 lanes wide (2 – 2× ports)
8-7
Data Rate
SRIO data rate configuration
0 = 1.25 GBaud
1 = 2.5 GBaud
2 = 3.125 GBaud
3 = 5.0 GBaud
6-5
Ref Clock
SRIO reference clock configuration
0 = 156.25 MHz
1 = 250 MHz
2 = 312.5 MHz
3 = Reserved
4-3
Reserved
Reserved
End of Table 2-7
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In SRIO boot mode, the message mode will be enabled by default. If use of the memory reserved for received
messages is required and reception of messages cannot be prevented, the master can disable the message mode by
writing to the boot table and generating a boot restart.
2.5.2.3 Ethernet (SGMII) Boot Device Configuration
Figure 2-5
Ethernet (SGMII) Device Configuration Fields
9
8
7
SerDes Clock Mult
Table 2-8
6
5
Ext connection
4
3
Device ID
Ethernet (SGMII) Configuration Field Descriptions
Bit
Field
Description
9-8
SerDes Clock Mult
SGMII SerDes input clock. The output frequency of the PLL must be 1.25 GBs.
0 = ×8 for input clock of 156.25 MHz
1 = ×5 for input clock of 250 MHz
2 = ×4 for input clock of 312.5 MHz
3 = Reserved
7-6
Ext connection
External connection mode
0 = MAC to MAC connection, master with auto negotiation
1 = MAC to MAC connection, slave, and MAC to PHY
2 = MAC to MAC, forced link
3 = MAC to fiber connection
5-3
Device ID
This value can range from 0 to 7 is used in the device ID field of the Ethernet-ready frame.
End of Table 2-8
Note—Both of the SGMII ports have been initialized for boot. The device can boot through either of the
ports. If only one SGMII port is used, then the other port will time out before the boot process completes.
2.5.2.4 PCI Boot Device Configuration
Extra device configuration is provided by the PCI bits in the DEVSTAT register.
Figure 2-6
PCI Device Configuration Fields
9
8
7
Reserved
Table 2-9
6
BAR Config
5
4
3
Reserved
PCI Device Configuration Field Descriptions
Bit
Field
Description
9
Reserved
Reserved
8-5
BAR Config
PCIe BAR registers configuration
4-3
Reserved
Reserved
This value can range from 0 to 0xf. See Table 2-10.
End of Table 2-9
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Table 2-10
BAR Config / PCIe Window Sizes
32-Bit Address Translation
BAR cfg
BAR0
BAR1
BAR2
BAR3
BAR4
0b0000
32
32
32
32
0b0001
16
16
32
64
0b0010
16
32
32
64
0b0011
32
32
32
64
0b0100
16
16
64
64
0b0101
16
32
64
64
0b0110
32
32
64
64
32
32
64
128
0b1000
64
64
128
256
0b1001
4
128
128
128
0b1010
4
128
128
256
0b1011
4
128
256
256
64-Bit Address Translation
BAR2/3
BAR4/5
0b1100
256
256
0b1101
512
512
0b1110
1024
1024
0b1111
2048
2048
0b0111
PCIe MMRs
BAR5
Clone of BAR4
End of Table 2-10
2
2.5.2.5 I C Boot Device Configuration
2.5.2.5.1 I2C Master Mode
In master mode, the I2C device configuration uses ten bits of device configuration instead of seven as used in other
2
boot modes. In this mode, the device will make the initial read of the I C EEPROM while the PLL is in bypass mode.
The initial read will contain the desired clock multiplier, which will be set up prior to any subsequent reads.
I2C Master Mode Device Configuration Bit Fields
Figure 2-7
12
11
10
Reserved
Speed
Address
Table 2-11
9
8
7
6
Mode
5
3
Parameter Index
I2C Master Mode Device Configuration Field Descriptions (Part 1 of 2)
Bit
Field
Description
12
Reserved
Reserved
11
Speed
I C data rate configuration
2
0 = I C slow mode. Initial data rate is CORECLK/5000 until PLLs and clocks are programmed
2
1 = I C fast mode. Initial data rate is CORECLK/250 until PLLs and clocks are programmed
10
Address
I2C bus address configuration
2
2
0 = Boot from I C EEPROM at I C bus address 0x50
2
1 = Boot from I C EEPROM at I2C bus address 0x51
28
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Table 2-11
I2C Master Mode Device Configuration Field Descriptions (Part 2 of 2)
Bit
Field
Description
9-8
Mode
I C operation mode
0 = Master mode
3 = Passive mode (see section 2.5.2.5.2 ‘‘I2C Passive Mode’’)
Others = Reserved
7-3
Parameter Table Index Specifies which parameter table is loaded from I C EEPROM. The boot ROM reads the parameter table (each table is
2
2
0x80 bytes) from the I C EEPROM starting at I C address (0x80 * parameter index).
2
2
This value can range from 0 to 31.
End of Table 2-11
2.5.2.5.2 I2C Passive Mode
In passive mode, the device does not drive the clock, but simply acks data received on the specified address.
I2C Passive Mode Device Configuration Bit Fields
Figure 2-8
9
8
7
Mode
Table 2-12
6
5
4
2
Receive I C Address
3
Reserved
I2C Passive Mode Device Configuration Field Descriptions
Bit
Field
Description
9-8
Mode
I2C operation mode
0 = Master mode (see section 2.5.2.5.1 ‘‘I2C Master Mode’’)
3 = Passive mode
Others = Reserved
7-5
Receive I C Address
2
2
I C bus address configuration
2
0 - 7h= The I C Bus address the device will listen to for data
The actual value on the bus is 0x19 plus the value in bits [7:5]. For Ex. if bits[7:5] = 0 then the device will listen to I2C
bus address 0x19.
4-3
Reserved
Reserved
End of Table 2-12
2.5.2.6 SPI Boot Device Configuration
In SPI boot mode, the SPI device configuration uses ten bits of device configuration instead of seven as used in other
boot modes.
Figure 2-9
SPI Device Configuration Bit Fields
12
11
Mode
Table 2-13
10
9
4, 5 Pin
Addr Width
8
7
Chip Select
6
5
4
3
Parameter Table Index
SPI Device Configuration Field Descriptions (Part 1 of 2)
Bit
Field
Description
12-11
Mode
Clk Pol / Phase
0 = Data is output on the rising edge of SPICLK. Input data is latched on the falling edge.
1 = Data is output one half-cycle before the first rising edge of SPICLK and on subsequent falling edges. Input data
is latched on the rising edge of SPICLK.
2 = Data is output on the falling edge of SPICLK. Input data is latched on the rising edge.
3 = Data is output one half-cycle before the first falling edge of SPICLK and on subsequent rising edges. Input data
is latched on the falling edge of SPICLK.
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Table 2-13
SPI Device Configuration Field Descriptions (Part 2 of 2)
Bit
Field
Description
10
4, 5 Pin
SPI operation mode configuration
0 = 4-pin mode used
1 = 5-pin mode used
9
Addr Width
SPI address width configuration
0 = 16-bit address values are used
1 = 24-bit address values are used
8-7
Chip Select
The chip select field value
00b = CS0 and CS1 are both active (not used)
01b = CS1 is active
10b = CS0 is active
11b = None is active
6-3
Parameter Table Index
Specifies which parameter table is loaded from SPI. The boot ROM reads the parameter table (each table is 0x80
bytes) from the SPI starting at SPI address (0x80 * parameter index).
The value can range from 0 to 15.
End of Table 2-13
2.5.2.7 HyperLink Boot Device Configuration
Figure 2-10
HyperLink Boot Device Configuration Fields
9
8
Reserved
Table 2-14
7
Data Rate
6
5
Ref Clock
4
3
Reserved
HyperLink Boot Device Configuration Field Descriptions
Bit
Field
Description
9
Reserved
Reserved
8-7
Data Rate
HyperLink data rate configuration
0 = 1.25 GBaud
1 = 3.125 GBaud
2 = 6.25 GBaud
3 = Reserved
6-5
Ref Clocks
HyperLink reference clock configuration
0 = 156.25 MHz
1 = 250 MHz
2 = 312.5 MHz
3 = Reserved
4-3
Reserved
Reserved
End of Table 2-14
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2.5.3 Boot Parameter Table
The ROM Bootloader (RBL) uses a set of tables to carry out the boot process. The boot parameter table is the
most common format the RBL employs to determine the boot flow. These boot parameter tables have certain
parameters common across all the boot modes, while the rest of the parameters are unique to the boot modes. The
common entries in the boot parameter table are shown in the table below:
Table 2-15
Boot Parameter Table Common Parameters
Byte
Offset
Name
Description
0
Length
The length of the table, including the length field, in bytes.
2
Checksum
The 16 bits ones complement of the ones complement of the entire table. A value of 0 will disable checksum verification
of the table by the boot ROM.
4
Boot Mode
Internal values used by RBL for different boot modes.
6
Port Num
Identifies the device port number to boot from, if applicable
8
SW PLL, MSW
PLL configuration, MSW
10
SW PLL, LSW
PLL configuration, LSW
End of Table 2-15
2.5.3.1 EMIF16 Boot Parameter Table
Table 2-16
Byte
Offset
EMIF16 Boot Mode Parameter Table
Name
Description
Configured Through Boot
Configuration Pins
12
Options
Option for EMIF16 boot (currently none)
-
14
Type
Boot only from NOR flash is supported for C6671
-
16
Branch Address MSW
Most significant bit for Branch address (depends on chip select)
-
18
Branch Address LSW
Least significant bit for Branch address (depends on chip select)
-
20
Chip Select
Chip Select for the NOR flash
-
22
Memory Width
Memory width of the Emif16 bus (16 bits)
-
24
Wait Enable
Extended wait mode enabled
0 = Wait enable is disabled
1 = Wait enable is enabled
YES
End of Table 2-16
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2.5.3.2 SRIO Boot Parameter Table
Table 2-17
SRIO Boot Mode Parameter Table
Byte
Offset
Name
Description
12
Options
Bit 0 TX enable
0 = SRIO transmit disable
1 = SRIO transmit enable
Configured Through Boot
Configuration Pins
-
Bit 1 Mailbox enable
0 = Mailbox mode disabled. SRIO boot is in directIO mode).
1 = Mailbox mode enabled. SRIO boot is in messaging mode).
Bit 2 Bypass configuration
0 = Configure the SRIO
1 = Bypass SRIO configuration
Bit 15-3 = Reserved
14
Lane Setup
16
Config Index
SRIO lane setup
0 = SRIO configured as 4 1x ports
1 = SRIO configured as 3 ports (2x, 1x, 1x)
2 = SRIO configured as 3 ports (1x, 1x, 2x)
3 = SRIO configured as 2 ports (2x, 2x)
4 = SRIO configured as 1 4x port
Others = Reserved
YES
Specifies the template used for RapidIO configuration.
-
(but not all lane setup are
possible through the boot
configuration pins)
Must be 0 for KeyStone architecture
18
Node ID
The node ID value to set for this device
-
20
SerDes ref clk
The SerDes reference clock frequency, in 1/100 MHz
YES
22
Link Rate
Link rate, MHz
YES
24
PF Low
Packet forward address range, low value
-
26
PF High
Packet forward address range, high value
-
End of Table 2-17
2.5.3.3 Ethernet Boot Parameter Table
Table 2-18
Ethernet Boot Mode Parameter Table (Part 1 of 2)
Byte
Offset
Name
Description
12
Options
Bits 2-0 Interface
101b = SGMII
Others = Reserved
Configured Through Boot
Configuration Pins
-
Bit 3 Half or Full duplex
0 = Half Duplex
1 = Full Duplex
Bit 4 Skip TX
0 = Send Ethernet ready frame every 3 seconds
1 = Don't send Ethernet ready frame
Bits 6-5 Initialize config
00b = Switch, SerDes, SGMII and PASS are configured
01b = Only SGMII and PASS are configured
10b= Reserved
11b = None of the Ethernet system is configured.
Bits 15-7 = Reserved
14
MAC High
The 16 MSBs of the MAC address to receive during boot
-
16
MAC Med
The 16 middle bits of the MAC address to receive during boot
-
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Table 2-18
Ethernet Boot Mode Parameter Table (Part 2 of 2)
Byte
Offset
Name
18
MAC Low
The 16 LSBs of the MAC address to receive during boot
-
20
Multi MAC High
The 16 MSBs of the multi-cast MAC address to receive during boot
-
22
Multi MAC Med
The 16 middle bits of the multi-cast MAC address to receive during boot
-
24
Multi MAC Low
The 16 LSBs of the multi-cast MAC address to receive during boot
-
26
Source Port
The source UDP port to accept boot packets from.
-
Description
Configured Through Boot
Configuration Pins
A value of 0 will accept packets from any UDP port
28
Dest Port
30
Device ID 12
The destination port to accept boot packets on.
-
The first two bytes of the device ID.
-
This is typically a string value, and is sent in the Ethernet ready frame
32
Device ID 34
The 2nd two bytes of the device ID.
-
34
Dest MAC High
The 16 MSBs of the MAC destination address used
for the Ethernet ready frame. Default is broadcast.
-
36
Dest MAC Med
The 16 middle bits of the MAC destination address
-
38
Dest MAC Low
The 16 LSBs of the MAC destination address
-
40
SGMII Config
Bits 3-0 are the config index
-
Bit 4 set if direct config used
Bit 5 set if no configuration done
Bits 15-6 Reserved
42
SGMII Control
The SGMII control register value
-
44
SGMII Adv Ability
The SGMII ADV Ability register value
-
46
SGMII TX Cfg High
The 16 MSBs of the SGMII TX config register
-
48
SGMII TX Cfg Low
The 16 LSBs of the SGMII TX config register
-
50
SGMII RX Cfg High
The 16 MSBs of the SGMII RX config register
-
52
SGMII RX Cfg Low
The 16 LSBs of the SGMII RX config register
-
54
SGMII Aux Cfg High
The 16 MSBs of the SGMII Aux config register
-
56
SGMII Aux Cfg Low
The 16 LSBs of the SGMII Aux config register
-
58
PKT PLL Cfg MSW
The packet subsystem PLL configuration, MSW
-
60
PKT PLL CFG LSW
The packet subsystem PLL configuration, LSW
-
End of Table 2-18
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2.5.3.4 PCIe Boot Parameter Table
Table 2-19
PCIe Boot Mode Parameter Table
Byte
Offset
Name
Description
12
Options
Bit 0 Mode
0 = Host mode (direct boot mode)
1 = Boot table boot mode
Configured Through Boot
Configuration Pins
-
Bit 1 Configuration of PCIe
0 = PCIe is configured by RBL
1 = PCIe is not configured by RBL
Bits 3-2 Reserved
Bit 4 Multiplier
0 = SerDes PLL configuration is done based on SerDes register values
1 = SerDes PLL configuration based on the reference clock values
Bits 15-5 Reserved
14
Address Width
PCI address width, can be 32 or 64
-
16
Link Rate
SerDes frequency, in Mbps. Can be 2500 or 5000
18
Reference clock
Reference clock frequency, in units of 10 kHz. Value values are 10000
(100 MHz), 12500 (125 MHz), 15625 (156.25 MHz), 25000 (250 MHz), and 31250
(312.5 MHz). A value of 0 means that value is already in the SerDes
configuration parameters and will not be computed by the boot ROM.
20
Window 1 Size
Window 1 size.
YES
22
Window 2 Size
Window 2 size.
YES
24
Window 3 Size
Window 3 size. Valid only if address width is 32.
YES
26
Window 4 Size
Window 4 Size. Valid only if the address width is 32.
YES
28
Vendor ID
Vendor ID
-
30
Device ID
Device ID
-
32
Class code Rev ID MSW
Class code revision ID MSW
-
34
Class code Rev ID LSW
Class code revision ID LSW
-
36
SerDes Cfg MSW
PCIe SerDes config word, MSW
-
38
SerDes Cfg LSW
PCIe SerDes config word, LSW
-
40
SerDes lane 0 Cfg MSW
SerDes lane config word, MSW, lane 0
-
42
SerDes lane 0 Cfg LSW
SerDes lane config word, LSW, lane 0
-
44
SerDes lane 1 Cfg MSW
SerDes lane config word, MSW, lane 1
-
46
SerDes lane 1 Cfg LSW
SerDes lane config word, LSW, lane 1
-
End of Table 2-19
2
2.5.3.5 I C Boot Parameter Table
Table 2-20
I2C Boot Mode Parameter Table (Part 1 of 2)
Configured Through Boot
Configuration Pins
Byte Offset Name
Description
12
Option
Bits 1-0 Mode
00b = Boot Parameter Table Mode
01b = Boot Table Mode
10b = Boot Config Mode
11b = Slave Receive Boot Config
14
Boot Dev Addr
The I C device address to boot from
YES
16
Boot Dev Addr Ext
Extended boot device address
YES
YES
Bits 15-2 Reserved
34
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Fixed and Floating-Point Digital Signal Processor
SPRS756E—March 2014
Table 2-20
I2C Boot Mode Parameter Table (Part 2 of 2)
Configured Through Boot
Configuration Pins
Byte Offset Name
Description
18
I C address used to send data in the I C master broadcast mode.
Broadcast Addr
2
2
-
2
Local Address
The I C address of this device
22
Device Freq
The operating frequency of the device (MHz)
24
Bus Frequency
The desired I C data rate (kHz)
YES
-
20
-
2
26
Next Dev Addr
The next device address to boot (Used only if boot config option is selected)
28
Next Dev Addr Ext
The extended next device address to boot (Used only if boot config option is selected) -
30
Address Delay
The number of CPU cycles to delay between writing the address to an I C EEPROM and reading data.
2
End of Table 2-20
2.5.3.6 SPI Boot Parameter Table
Table 2-21
SPI Boot Mode Parameter Table
Byte Offset
Name
Description
12
Options
Bits 1-0 Modes
00b = Load a boot parameter table from the SPI (Default mode)
01b = Load boot records from the SPI (boot tables)
10b = Load boot config records from the SPI (boot config tables)
11b = Reserved
Configured Through Boot
Configuration Pins
-
Bits 15-2 Reserved
14
Address Width
The number of bytes in the SPI device address. Can be 16 or 24 bit.
YES
16
NPin
The operational mode, 4 or 5 pin
YES
18
Chipsel
The chip select used (valid in 4-pin mode only). Can be 0-3.
YES
20
Mode
Standard SPI mode (0-3)
YES
22
C2Delay
Setup time between chip assert and transaction
-
24
CPU Freq MHz
The speed of the CPU, in MHz
-
26
Bus Freq, MHz
The MHz portion of the SPI bus frequency. Default = 5 MHz
-
28
Bus Freq, kHz
The kHz portion of the SPI buf frequency. Default = 0
-
30
Read Addr MSW
The first address to read from, MSW (valid for 24-bit address width only)
YES
32
Read Addr LSW
The first address to read from, LSW
YES
28
Next Chip Select
Next Chip Select to be used (Used only in boot config mode)
-
30
Next Read Addr MSW
The Next read address (used in boot config mode only)
-
32
Next Read Addr LSW
The Next read address (used in boot config mode only)
-
End of Table 2-21
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35
TMS320C6671
Fixed and Floating-Point Digital Signal Processor
SPRS756E—March 2014
2.5.3.7 HyperLink Boot Parameter Table
Table 2-22
HyperLink Boot Mode Parameter Table
Byte Offset
Name
Description
12
Options
Bit 0 Mode
0 = Host Mode (Direct boot mode)
1 = Boot Table Boot Mode
Configured Through Boot
Configuration Pins
-
Bit 1 Configuration of PCIe
0 = HyperLink is configured by RBL
1 = HyperLink is not configured by RBL
Bits 15-2 Reserved
14
Number of Lanes
Number of lanes to be configured
-
16
SerDes cfg msw
HyperLink SerDes config word, MSW
-
18
SerDes cfg lsw
HyperLink SerDes config word, LSW
-
20
SerDes CFG RX lane 0 cfg msw
SerDes RX lane config word, MSW lane 0
-
22
SerDes CFG RXlane 0 cfg lsw
SerDes RX lane config word, LSW, lane 0
-
24
SerDes CFG TX lane 0 cfg msw
SerDes TX lane config word, MSW lane 0
-
26
SerDes CFG TXlane 0 cfg lsw
SerDes TX lane config word, LSW, lane 0
-
28
SerDes CFG RX lane 1 cfg msw
SerDes RX lane config word, MSW lane 1
-
30
SerDes CFG RXlane 1 cfg lsw
SerDes RX lane config word, LSW, lane 1
-
32
SerDes CFG TX lane 1 cfg msw
SerDes TX lane config word, MSW lane 1
-
34
SerDes CFG TXlane 1 cfg lsw
SerDes TX lane config word, LSW, lane 1
-
36
SerDes CFG RX lane 2 cfg msw
SerDes RX lane config word, MSW lane 2
-
38
SerDes CFG RXlane 2 cfg lsw
SerDes RX lane config word, LSW, lane 2
-
40
SerDes CFG TX lane 2 cfg msw
SerDes TX lane config word, MSW lane 2
-
42
SerDes CFG TXlane 2 cfg lsw
SerDes TX lane config word, LSW, lane 2
-
44
SerDes CFG RX lane 3 cfg msw
SerDes RX lane config word, MSW lane 3
-
46
SerDes CFG RXlane 3 cfg lsw
SerDes RX lane config word, LSW, lane 3
-
48
SerDes CFG TX lane 3 cfg msw
SerDes TX lane config word, MSW lane 3
-
50
SerDes CFG TXlane 3 cfg lsw
SerDes TX lane config word, LSW, lane 3
-
End of Table 2-22
36
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Fixed and Floating-Point Digital Signal Processor
SPRS756E—March 2014
2.5.3.8 DDR3 Configuration Table
The ROM Bootloader (RBL) also provides an option to configure the DDR table before loading the image into the
external memory. More information on how to configure the DDR3, see the DSP Bootloader for KeyStone Devices
User Guide in ‘‘Related Documentation from Texas Instruments’’ on page 72 for more details. The configuration
table for DDR3 is shown below:
Table 2-23
DDR3 Boot Parameter Table
Configured Through Boot
Configuration Pins
Byte Offset
Name
Description
0
configselect
Selecting the configuration register below that to be set. Each field below is represented by one bit, each.
4
pllprediv
PLL pre divider value (Should be the exact value not value -1)
-
8
pllMult
PLL Multiplier value (Should be the exact value not value -1)
-
12
pllPostDiv
PLL post divider value (Should be the exact value not value -1)
-
16
sdRamConfig
SDRAM config register
-
20
sdRamConfig2
SDRAM Config register
-
24
sdRamRefreshctl
SDRAM Refresh Control Register
-
28
sdRamTiming1
SDRAM Timing 1 Register
-
32
sdRamTiming2
SDRAM Timing 2 Register
-
36
sdRamTiming3
SDRAM Timing 3 Register
-
40
IpDfrNvmTiming
LP DDR2 NVM Timing Register
-
44
powerMngCtl
Power management Control Register
-
48
iODFTTestLogic
IODFT Test Logic Global Control Register
-
52
performCountCfg
Performance Counter Config Register
-
56
performCountMstRegSel
Performance Counter Master Region Select Register
-
60
readIdleCtl
Read IDLE counter Register
-
64
sysVbusmIntEnSet
System Interrupt Enable Set Register
-
68
sdRamOutImpdedCalcfg
SDRAM Output Impedance Calibration Config Register
-
72
tempAlertCfg
Temperature Alert Configuration Register
-
76
ddrPhyCtl1
DDR PHY Control Register 1
-
80
ddrPhyCtl2
DDR PHY Control Register 1
-
84
proClassSvceMap
Priority to Class of Service mapping Register
-
88
mstId2ClsSvce1Map
Master ID to Class of Service Mapping 1 Register
-
92
mstId2ClsSvce2Map
Master ID to Class of Service Mapping 2Register
-
96
eccCtl
ECC Control Register
-
100
eccRange1
ECC Address Range1 Register
-
104
eccRange2
ECC Address Range2 Register
-
108
rdWrtExcThresh
Read Write Execution Threshold Register
-
End of Table 2-23
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37
TMS320C6671
Fixed and Floating-Point Digital Signal Processor
SPRS756E—March 2014
2.5.4 PLL Boot Configuration Settings
The PLL default settings are determined by the BOOTMODE[12:10] bits. The table below shows settings for various
input clock frequencies.
C66x DSP System PLL Configuration (1)
800
0b001
66.67
0
23
800.04
0
29
1000.05
0
35
0b010
80.00
0
19
800
0
24
1000
0
29
0b011
100.00
0
15
800
0
19
1000
0
23
0b100
156.25
24
255
800
4
63
1000
24
383
0b101
250.00
4
31
800
0
7
1000
4
0b110
312.50
24
127
800
4
31
1000
24
0b111
122.88
47
624
800
28
471
999.989
31
0
39
1000
0
47
1200
(2)
DSP Freq
(MHz)
31
PLLM
0
PASS PLL = 350 MHz
PLLD
50.00
DSP Freq
(MHz)
0b000
PLLM
Input Clock
Freq (MHz)
1250 MHz Device
PLLD
BOOTMODE
[12:10]
DSP Freq
(MHz)
PLLM
1200 MHz Device
PLLD
DSP Freq
(MHz)
1000 MHz Device
PLLD
DSP Freq
(MHz)
PLLM
PLLD
800 MHz Device
PLLM
Table 2-24
0
49
1250
0
41
1050
1200.06
1
74
1250.06 1
62
1050.053
1200
3
124
1250
3
104
1050
1200
0
24
1250
0
20
1050
1200
0
15
1250
24
335
1050
47
1200
0
9
1250
4
41
1050
191
1200
0
7
1250
24
167
1050
624
1200
2
60
1249.28 11
204
1049.6
End of Table 2-24
1 The PLL boot configuration of initial silicon 1.0 may support only 800 MHz, 1000 MHz, and 1200 MHz frequencies by default.
2 The PASS PLL generates 1050 MHz and is internally divided by 3 to supply 350 MHz to the packet accelerator.
OUTPUT_DIVIDE is the value of the field of SECCTL[22:19]. This will set the PLL to the maximum clock setting
for the device (with OUTPUT_DIVIDE=1, by default).
CLK = CLKIN × ((PLLM+1) ÷ ((OUTPUT_DIVIDE+1) × (PLLD+1)))
The configuration for the PASS PLL is also shown. The PASS PLL is configured with these values only if the Ethernet
boot mode is selected with the input clock set to match the main PLL clock (not the PASS clock). See Table 2-4 for
details on configuring Ethernet boot mode. The output from the PASS PLL goes through an on-chip divider to
reduce the operating frequency before reaching the NETCP. The PASS PLL generates 1050 MHz, and after the chip
divider (=3), feeds 350 MHz to the NETCP.
The Main PLL is controlled using a PLL controller and a chip-level MMR. The DDR3 PLL and PASS PLL are
controlled by chip level MMRs. For details on how to set up the PLL see section 7.6 ‘‘Main PLL and PLL Controller’’
on page 137. For details on the operation of the PLL controller module, see the Phase Locked Loop (PLL) for KeyStone
Devices User Guide in ‘‘Related Documentation from Texas Instruments’’ on page 72.
2.6 Second-Level Bootloaders
Any of the boot modes can be used to download a second-level bootloader. A second-level bootloader allows for any
level of customization to current boot methods as well as the definition of a completely customized boot.
38
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Fixed and Floating-Point Digital Signal Processor
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2.7 Terminals
2.7.1 Package Terminals
Figure 2-11 shows the TMS320C6671CYP ball grid area (BGA) package (bottom view).
Figure 2-11
CYP 841-Pin BGA Package (Bottom View)
AH
AF
AD
AB
Y
AJ
AG
AE
AC
AA
W
V
T
U
R
P
N
M
L
K
J
H
F
D
G
E
C
B
A
3
1
2
5
4
9
7
6
8
11 13 15 17 19 21 23 25 27 29
10 12 14 16 18 20 22 24 26 28
2.7.2 Pin Map
Figure 2-13 through Figure 2-16 show the TMS320C6671 pin assignments in four quadrants (A, B, C, and D).
Figure 2-12
Pin Map Quadrants (Bottom View)
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A
B
D
C
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39
TMS320C6671
Fixed and Floating-Point Digital Signal Processor
SPRS756E—March 2014
Figure 2-13
Upper Left Quadrant—A (Bottom View)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
AJ
VSS
DVDD18
RSV05
PASSCLKN
PASSCLKP
SRIOSGMII
CLKN
VSS
PCIERXP1
PCIERXN1
VSS
RIORXN0
RIORXP0
VSS
RIORXP3
RIORXN3
AH
DVDD18
RSV04
RSV25
RSV24
PCIECLKN
VSS
PCIERXN0
PCIERXP0
VSS
RIORXN1
RIORXP1
VSS
RIORXP2
RIORXN2
VSS
AG
SPISCS0
SPISCS1
PCIECLKP
SRIOSGMII
CLKP
VSS
PCIETXP1
PCIETXN1
VSS
RIOTXN1
RIOTXP1
VSS
RIOTXP2
RIOTXN2
AF
RSV22
CORESEL0
DVDD18
VSS
PCIETXP0
PCIETXN0
VSS
RIOTXN0
RIOTXP0
VSS
RIOTXP3
RIOTXN3
VSS
AE
SPICLK
BOOT
SYSCLKOUT PACLKSEL
COMPLETE
CORESEL3
CORESEL2
VSS
VSS
VSS
VDDR2
VSS
RSV15
VSS
VDDR4
VSS
AD
UARTRXD
SPIDIN
SCL
CORESEL1
AVDDA3
VSS
VDDT2
VSS
VDDT2
VSS
VDDT2
VSS
VDDT2
VSS
VDDT2
AC
UARTTXD
VSS
DVDD18
SDA
VSS
AVDDA2
VSS
VDDT2
RSV16
VDDT2
VSS
VDDT2
VSS
VDDT2
VSS
AB
SPIDOUT
UARTRTS
UARTCTS
VSS
DVDD18
VSS
DVDD18
VSS
VDDT2
VSS
VDDT2
VSS
VDDT2
VSS
VDDT2
AA
MCMTX
FLCLK
MCMTX
PMCLK
MCMTX
FLDAT
MCMTX
PMDAT
VSS
DVDD18
VSS
CVDD
VSS
CVDD
VSS
CVDD
VSS
CVDD
VSS
Y
MCMREF
CLKOUTP
MCMCLKN
MCMRX
PMCLK
MCMRX
PMDAT
RSV12
VSS
DVDD18
VSS
CVDD
VSS
CVDD
VSS
CVDD
VSS
CVDD
W
MCMREF
CLKOUTN
MCMCLKP
MCMRX
FLCLK
MCMRX
FLDAT
RSV13
RSV14
VSS
CVDD
VSS
CVDD
VSS
CVDD1
VSS
CVDD1
VSS
V
VSS
VSS
VSS
VSS
VDDR1
VSS
VDDT1
VSS
CVDD
VSS
CVDD
VSS
CVDD1
VSS
CVDD1
U
VSS
MCMRXN0
VSS
MCMTXP1
VSS
VDDT1
VSS
CVDD
VSS
CVDD
VSS
CVDD1
VSS
CVDD1
VSS
T
MCMRXN1
MCMRXP0
VSS
MCMTXN1
MCMTXP2
VSS
VDDT1
VSS
CVDD
VSS
CVDD
VSS
CVDD
VSS
CVDD
CORECLKP CORECLKN
RSV20
VSS
A
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Fixed and Floating-Point Digital Signal Processor
SPRS756E—March 2014
Figure 2-14
Upper Right Quadrant—B (Bottom View)
16
17
18
19
20
21
22
23
24
25
26
27
28
29
VSS
SGMII0RXP
SGMII0RXN
VSS
TR15
TR13
FSB1
CLKA1
TX02
TR01
FSA0
EMU16
DVDD18
VSS
AJ
SGMII1RXP
SGMII1RXN
VSS
RSV08
TX16
TR16
TR14
CLKB1
TX04
TR05
TR00
EMU18
RSV01
DVDD18
AH
VSS
SGMII0TXP
SGMII0TXN
VSS
TX14
TR17
DVDD18
FSA1
TX03
CLKB0
FSB0
EMU15
EMU14
EMU12
AG
SGMII1TXP
SGMII1TXN
VSS
RSV09
TX17
TX10
VSS
TX07
TX05
CLKA0
DVDD18
EMU17
EMU11
EMU09
AF
VDDR3
VSS
VDDT2
VSS
TX15
TX13
TR10
TX06
TX00
TR07
VSS
EMU10
EMU08
EMU07
AE
VSS
VDDT2
VSS
RSV17
HOUT
TR11
TX11
TR02
TR03
TX01
EMU13
EMU06
EMU05
EMU04
AD
VDDT2
VSS
VDDT2
VSS
POR
TR12
TX12
TR04
TR06
EMIFD15
EMU03
EMU02
EMU01
EMU00
AC
VSS
VDDT2
VSS
DVDD18
VSS
DVDD18
VSS
EMIFD12
EMIFD13
EMIFD09
EMIFD14
EMIFD05
DVDD18
EMIFD01
AB
CVDD
VSS
CVDD
VSS
RSV0B
RSV0A
CVDD
VSS
EMIFD10
EMIFD07
EMIFD06
EMIFD04
VSS
EMIFD02
AA
VSS
CVDD
VSS
CVDD
VSS
CVDD
VSS
DVDD18
EMIFD11
EMIFD08
EMIFD03
EMIFD00
EMIFA22
EMIFA21
Y
CVDD1
VSS
CVDD
VSS
CVDD
VSS
CVDD
EMIFA20
EMIFA19
EMIFA18
EMIFA17
EMIFA15
EMIFA14
EMIFA16
W
VSS
CVDD
VSS
CVDD
VSS
CVDD
VSS
DVDD18
EMIFA13
EMIFA12
EMIFA11
EMIFA10
EMIFA08
EMIFA09
V
CVDD1
VSS
CVDD
VSS
CVDD
VSS
CVDD
EMIFA23
EMIFA07
EMIFA06
DVDD18
EMIFA04
EMIFA05
EMIFA02
U
VSS
CVDD
VSS
CVDD
VSS
CVDD
VSS
DVDD18
EMIFA01
EMIFA03
VSS
EMIFA00
EMIFWAIT1 EMIFWAIT0
T
B
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TMS320C6671
Fixed and Floating-Point Digital Signal Processor
SPRS756E—March 2014
Figure 2-15
Lower Right Quadrant—C (Bottom View)
C
R
CVDD1
VSS
CVDD
VSS
CVDD
VSS
CVDD
EMIFBE1
EMIFBE0
EMIFCE3
EMIFOE
EMIFCE1
EMIFCE2
TDO
VSS
CVDD
VSS
CVDD
VSS
CVDD
VSS
DVDD18
EMIFWE
EMIFCE0
EMIFRW
TDI
TRST
TMS
P
CVDD
VSS
CVDD
VSS
CVDD1
VSS
CVDD1
RSV03
RSV02
RESETFULL
LRESET
RESETSTAT
DVDD18
TCK
N
VSS
CVDD
VSS
CVDD
VSS
CVDD1
VSS
RSV26
RSV27
NMI
TIMO1
LRESET
NMIEN
VSS
RESET
M
CVDD
VSS
CVDD
VSS
CVDD1
VSS
CVDD1
VCNTL0
TIMI0
TIMO0
TIMI1
GPIO15
GPIO11
GPIO12
L
VSS
CVDD
VSS
CVDD
VSS
CVDD
RSV10
VCNTL1
GPIO14
GPIO13
GPIO09
GPIO07
GPIO08
GPIO10
K
CVDD
VSS
CVDD
VSS
CVDD
VSS
RSV11
VCNTL2
GPIO06
GPIO04
GPIO03
GPIO05
GPIO01
GPIO02
J
VSS
CVDD
VSS
CVDD
VSS
CVDD
AVDDA1
VCNTL3
DVDD18
GPIO00
MDCLK
DDRSL
RATE1
RSV06
DDRCLKN
H
DVDD15
VSS
DVDD15
VSS
DVDD15
VSS
PTV15
DVDD15
VSS
RSV21
MDIO
DDRSL
RATE0
RSV07
DDRCLKP
G
VSS
DVDD15
VSS
DVDD15
DDRD25
DDRD27
DDRD17
DDRD16
DDRD08
DDRD07
DVDD15
VSS
DVDD15
VSS
F
DDRA10
DDRA12
DDRCKE1
DDRCB00
VSS
DDRD26
DDRD23
DDRD19
DDRD09
DDRD10
DDRD06
DDRD02
DDRD00
DDRDQM0
E
DDRA11
DDRA14
VSS
DDRCB02
DVDD15
DDRD24
DDRD28
DVDD15
DDRD18
DDRD11
DDRD12
DDRD04
DDRD03
DDRD01
D
DDRA13
DDRA15
DDRCB05
DDRCB04
DDRCB01
DDRD29
DDRD31
VSS
DDRD22
DVDD15
DDRD13
DDRDQM1
DDRCLK
OUTN1
VSS
DDRCB06
DDRDQS8N
DDRCB03
DDRDQS3N
DDRD30
DDRD21
DDRDQS2N
VSS
DDRD14
DDRDQS1N
DDRD05
DVDD15
B
DDRCLK
OUTP1
DVDD15
DDRCB07
DDRDQS8P
DDRDQM8
DDRDQS3P
DDRDQM3
DDRD20
DDRDQS2P
DDRDQM2
DDRD15
DDRDQS1P
DVDD15
VSS
A
16
17
18
19
20
21
22
23
24
25
26
27
28
29
42
Device Overview
DDRDQS0P DDRDQS0N
C
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Fixed and Floating-Point Digital Signal Processor
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Figure 2-16
Lower Left Quadrant—D (Bottom View)
D
R
MCMRXP1
VSS
VSS
VSS
MCMTXN2
VDDT1
VSS
CVDD
VSS
CVDD
VSS
CVDD1
VSS
CVDD1
VSS
P
VSS
MCMRXN3
VSS
MCMTXP3
VSS
VSS
VDDT1
VSS
CVDD
VSS
CVDD
VSS
CVDD
VSS
CVDD
N
MCMRXP2
MCMRXP3
VSS
MCMTXN3
MCMTXP0
VDDT1
VSS
CVDD
VSS
CVDD
VSS
CVDD
VSS
CVDD
VSS
M
MCMRXN2
VSS
VSS
VSS
MCMTXN0
VSS
VDDT1
VSS
CVDD1
VSS
CVDD
VSS
CVDD
VSS
CVDD
L
VSS
VSS
VSS
VSS
VSS
VSS
VSS
CVDD1
VSS
CVDD
VSS
CVDD
VSS
CVDD1
VSS
K
VSS
VSS
VSS
VSS
VSS
VSS
CVDD1
VSS
CVDD1
VSS
CVDD
VSS
CVDD1
VSS
CVDD1
J
VSS
VSS
VSS
VSS
VSS
VSS
VSS
CVDD1
VSS
CVDD
VSS
CVDD
VSS
CVDD1
VSS
H
VSS
VSS
VSS
VSS
VSS
VSS
CVDD
VSS
CVDD
VSS
CVDD
VSS
CVDD
VSS
CVDD
G
VSS
DVDD15
VSS
DVDD15
VSS
VSS
VSS
DVDD15
VSS
DVDD15
VSS
DVDD15
VSS
DVDD15
VSS
F
DDRD63
DDRD60
DDRD61
DDRD56
DVDD15
VSS
DVDD15
VSS
DVDD15
VSS
DVDD15
VSS
DDRA03
DDRA02
DDRA08
E
DDRD62
DDRD58
DVDD15
DDRD53
VSS
DDRD45
DDRD42
DDRD39
DDRD36
DDRD32
DDRRESET
DDRWE
DDRODT1
VREFSSTL
DDRA09
D
DDRDQS7P
DDRD57
VSS
DDRD52
DVDD15
DDRD46
DDRD41
DVDD15
DDRD35
DDRD33
DDRCKE0
DDRCAS
DDRODT0
VSS
DDRA07
C
DDRDQS7N
DDRD59
DDRD55
DDRD54
DDRD48
DDRD47
DDRD43
VSS
DDRD37
DDRRAS
DDRCE0
DDRCE1
DDRBA2
DVDD15
DDRA05
B
DVDD15
DDRD44
DDRD38
DDRDQS4N
DDRD34
VSS
DDRCLK
OUTN0
DDRBA1
DDRA01
DDRA06
A
VSS
DVDD15
DDRDQS6N
DDRD51
DDRD49
DDRDQS5N
DDRD40
DVDD15
DDRCLK
OUTP0
DDRBA0
DDRA00
DDRA04
1
2
3
4
5
6
7
11
12
13
14
15
DDRDQM7 DDRDQS6P
DDRD50
DDRDQM6 DDRDQS5P
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DDRDQM5 DDRDQS4P DDRDQM4
8
9
10
Device Overview
43
TMS320C6671
Fixed and Floating-Point Digital Signal Processor
SPRS756E—March 2014
2.8 Terminal Functions
The terminal functions table (Table 2-26) identifies the external signal names, the associated pin (ball) numbers, the
pin type (I, O/Z, or I/O/Z), whether the pin has any internal pullup/pulldown resistors, and gives functional pin
descriptions. This table is arranged by function. The power terminal functions table (Table 2-27) lists the various
power supply pins and ground pins and gives functional pin descriptions. Table 2-28 shows all pins arranged by
signal name. Table 2-29 shows all pins arranged by ball number.
There are 17 pins that have a secondary function as well as a primary function. The secondary function is indicated
with a dagger (†).
For more detailed information on device configuration, peripheral selection, multiplexed/shared pins, and
pullup/pulldown resistors, see section 3.4 ‘‘Pullup/Pulldown Resistors’’ on page 94.
Use the symbol definitions in Table 2-25 when reading Table 2-26.
Table 2-25
I/O Functional Symbol Definitions
Functional
Symbol
IPD or IPU
A
GND
Table 2-26
Column Heading
Definition
Internal 100-μA pulldown or pullup is provided for this terminal. In most systems, a 1-k resistor can
be used to oppose the IPD/IPU. For more detailed information on pulldown/pullup resistors and
situations in which external pulldown/pullup resistors are required, see the Hardware Design Guide for
KeyStone I Devices in ‘‘Related Documentation from Texas Instruments’’ on page 72.
IPD/IPU
Analog signal
Type
Ground
Type
I
Input terminal
Type
O
Output terminal
Type
S
Supply voltage
Type
Z
Three-state terminal or high impedance
Type
End of Table 2-25
Table 2-26
Signal Name
Terminal Functions — Signals and Control by Function (Part 1 of 13)
Ball No. Type
IPD/IPU
Description
Boot Configuration Pins
LENDIAN †
H25
IOZ
UP
BOOTMODE00 †
J28
IOZ
Down
BOOTMODE01†
J29
IOZ
Down
BOOTMODE02 †
J26
IOZ
Down
BOOTMODE03 †
J25
IOZ
Down
BOOTMODE04 †
J27
IOZ
Down
BOOTMODE05 †
J24
IOZ
Down
BOOTMODE06 †
K27
IOZ
Down
BOOTMODE07 †
K28
IOZ
Down
BOOTMODE08 †
K26
IOZ
Down
BOOTMODE09 †
K29
IOZ
Down
BOOTMODE10 †
L28
IOZ
Down
BOOTMODE11 †
L29
IOZ
Down
BOOTMODE12 †
K25
IOZ
Down
44
Device Overview
Endian configuration pin (Pin shared with GPIO[0])
See Section 2.5 ‘‘Boot Modes Supported and PLL Settings’’ on page 24 for more details
(Pins shared with GPIO[1:13])
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TMS320C6671
Fixed and Floating-Point Digital Signal Processor
SPRS756E—March 2014
Table 2-26
Terminal Functions — Signals and Control by Function (Part 2 of 13)
Signal Name
Ball No. Type
IPD/IPU
PCIESSMODE0 †
K24
IOZ
Down
Description
PCIESSMODE1 †
L27
IOZ
Down
PCIESSEN †
L24
I
Down
CORECLKP
AG3
I
CORECLKN
AG4
I
SRIOSGMIICLKP
AG6
I
SRIOSGMIICLKN
AJ6
I
DDRCLKP
G29
I
DDRCLKN
H29
I
PCIECLKP
AG5
I
PCIECLKN
AH5
I
MCMCLKP
W2
I
MCMCLKN
Y2
I
PASSCLKP
AJ5
I
PASSCLKN
AJ4
I
AVDDA1
H22
P
AVDDA2
AC6
P
DDR_CLK PLL Power Supply Pin
AVDDA3
AD5
P
PASS_CLK PLL Power Supply Pin
PCIe Mode selection pins (Pins shared with GPIO[14:15])
PCIe module enable (Pin shared with TIMI0)
Clock / Reset
Core Clock Input to main PLL.
RapidIO/SGMII Reference Clock to drive the RapidIO and SGMII SerDes
DDR Reference Clock Input to DDR PLL (
PCIe Clock Input to drive PCIe SerDes
HyperLink Reference Clock to drive the HyperLink SerDes
Network Coprocessor (PASS PLL) Reference Clock
SYS_CLK PLL Power Supply Pin
SYSCLKOUT
AE3
OZ
Down
System Clock Output to be used as a general purpose output clock for debug purposes
PACLKSEL
AE4
I
Down
PA clock select to choose between core clock and PASSCLK pins
HOUT
AD20
OZ
UP
Interrupt output pulse created by IPCGRH
NMI
M25
I
UP
Non-maskable Interrupt
LRESET
N26
I
UP
Warm Reset
LRESETNMIEN
M27
I
UP
Enable for core selects
CORESEL0
AF2
I
Down
CORESEL1
AD4
I
Down
CORESEL2
AE6
I
Down
CORESEL3
AE5
I
Down
Select for the target core for LRESET and NMI. For more details see Table 7-46‘‘NMI and Local Reset
Timing Requirements’’ on page 183
RESETFULL
N25
I
UP
Full Reset
RESET
M29
I
UP
Warm Reset of non isolated portion on the IC
POR
AC20
I
RESETSTAT
N27
O
UP
Reset Status Output
BOOTCOMPLETE
AE2
OZ
Down
Boot progress indication output
PTV15
G22
A
Power-on Reset
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PTV Compensation NMOS Reference Input. A precision resistor placed between the PTV15 pin
and ground is used to closely tune the output impedance of the DDR interface drivers to 50 .
Presently the recommended value for this 1% resistor is 45.3 .
Device Overview
45
TMS320C6671
Fixed and Floating-Point Digital Signal Processor
SPRS756E—March 2014
Table 2-26
Signal Name
Terminal Functions — Signals and Control by Function (Part 3 of 13)
Ball No. Type
IPD/IPU
Description
DDR
DDRDQM0
E29
OZ
DDRDQM1
C27
OZ
DDRDQM2
A25
OZ
DDRDQM3
A22
OZ
DDRDQM4
A10
OZ
DDRDQM5
A8
OZ
DDRDQM6
B5
OZ
DDRDQM7
B2
OZ
DDRDQM8
A20
OZ
DDRDQS0P
C28
IOZ
DDRDQS0N
C29
IOZ
DDRDQS1P
A27
IOZ
DDRDQS1N
B27
IOZ
DDRDQS2P
A24
IOZ
DDRDQS2N
B24
IOZ
DDRDQS3P
A21
IOZ
DDRDQS3N
B21
IOZ
DDRDQS4P
A9
IOZ
DDRDQS4N
B9
IOZ
DDRDQS5P
B6
IOZ
DDRDQS5N
A6
IOZ
DDRDQS6P
B3
IOZ
DDRDQS6N
A3
IOZ
DDRDQS7P
D1
IOZ
DDRDQS7N
C1
IOZ
DDRDQS8P
A19
IOZ
DDRDQS8N
B19
IOZ
DDRCB00
E19
IOZ
DDRCB01
C20
IOZ
DDRCB02
D19
IOZ
DDRCB03
B20
IOZ
DDRCB04
C19
IOZ
DDRCB05
C18
IOZ
DDRCB06
B18
IOZ
DDRCB07
A18
IOZ
46
Device Overview
DDR EMIF Data Masks
DDR EMIF Data Strobe
DDR EMIF Check Bits
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TMS320C6671
Fixed and Floating-Point Digital Signal Processor
SPRS756E—March 2014
Table 2-26
Terminal Functions — Signals and Control by Function (Part 4 of 13)
Signal Name
Ball No. Type
DDRD00
E28
DDRD01
D29
IOZ
DDRD02
E27
IOZ
DDRD03
D28
IOZ
DDRD04
D27
IOZ
IPD/IPU
Description
IOZ
DDRD05
B28
IOZ
DDRD06
E26
IOZ
DDRD07
F25
IOZ
DDRD08
F24
IOZ
DDRD09
E24
IOZ
DDRD10
E25
IOZ
DDRD11
D25
IOZ
DDRD12
D26
IOZ
DDRD13
C26
IOZ
DDRD14
B26
IOZ
DDRD15
A26
IOZ
DDRD16
F23
IOZ
DDRD17
F22
IOZ
DDRD18
D24
IOZ
DDRD19
E23
IOZ
DDRD20
A23
IOZ
DDRD21
B23
IOZ
DDRD22
C24
IOZ
DDRD23
E22
IOZ
DDRD24
D21
IOZ
DDRD25
F20
IOZ
DDRD26
E21
IOZ
DDRD27
F21
IOZ
DDRD28
D22
IOZ
DDRD29
C21
IOZ
DDRD30
B22
IOZ
DDRD31
C22
IOZ
DDRD32
E10
IOZ
DDRD33
D10
IOZ
DDRD34
B10
IOZ
DDRD35
D9
IOZ
DDRD36
E9
IOZ
DDRD37
C9
IOZ
DDRD38
B8
IOZ
DDRD39
E8
IOZ
DDRD40
A7
IOZ
DDRD41
D7
IOZ
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DDR EMIF Data Bus
DDR EMIF Data Bus
Device Overview
47
TMS320C6671
Fixed and Floating-Point Digital Signal Processor
SPRS756E—March 2014
Table 2-26
Terminal Functions — Signals and Control by Function (Part 5 of 13)
Signal Name
Ball No. Type
DDRD42
E7
IOZ
DDRD43
C7
IOZ
DDRD44
B7
IOZ
DDRD45
E6
IOZ
DDRD46
D6
IOZ
DDRD47
C6
IOZ
DDRD48
C5
IOZ
DDRD49
A5
IOZ
DDRD50
B4
IOZ
DDRD51
A4
IOZ
DDRD52
D4
IOZ
DDRD53
E4
IOZ
DDRD54
C4
IOZ
DDRD55
C3
IOZ
DDRD56
F4
IOZ
DDRD57
D2
IOZ
DDRD58
E2
IOZ
DDRD59
C2
IOZ
DDRD60
F2
IOZ
DDRD61
F3
IOZ
DDRD62
E1
IOZ
DDRD63
F1
IOZ
DDRCE0
C11
OZ
DDRCE1
C12
OZ
DDRBA0
A13
OZ
DDRBA1
B13
OZ
DDRBA2
C13
OZ
DDRA00
A14
OZ
DDRA01
B14
OZ
DDRA02
F14
OZ
DDRA03
F13
OZ
DDRA04
A15
OZ
DDRA05
C15
OZ
DDRA06
B15
OZ
DDRA07
D15
OZ
DDRA08
F15
OZ
DDRA09
E15
OZ
DDRA10
E16
OZ
DDRA11
D16
OZ
DDRA12
E17
OZ
DDRA13
C16
OZ
DDRA14
D17
OZ
DDRA15
C17
OZ
48
Device Overview
IPD/IPU
Description
DDR EMIF Data Bus
DDR EMIF Chip Enables
DDR EMIF Bank Address
DDR EMIF Address Bus
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TMS320C6671
Fixed and Floating-Point Digital Signal Processor
SPRS756E—March 2014
Table 2-26
Terminal Functions — Signals and Control by Function (Part 6 of 13)
Signal Name
Ball No. Type
DDRCAS
D12
IPD/IPU
DDRRAS
C10
OZ
DDR EMIF Row Address Strobe
DDRWE
E12
OZ
DDR EMIF Write Enable
DDRCKE0
D11
OZ
DDR EMIF Clock Enable
DDRCKE1
E18
OZ
DDR EMIF Clock Enable
OZ
Description
DDR EMIF Column Address Strobe
DDRCLKOUTP0
A12
OZ
DDRCLKOUTN0
B12
OZ
DDRCLKOUTP1
A16
OZ
DDRCLKOUTN1
B16
OZ
DDRODT0
D13
OZ
DDR EMIF On Die Termination Outputs used to set termination on the SDRAMs
DDRODT1
E13
OZ
DDR EMIF On Die Termination Outputs used to set termination on the SDRAMs
DDR EMIF Output Clocks to drive SDRAMs (one clock pair per SDRAM)
DDRRESET
E11
OZ
DDRSLRATE0
G27
I
Down
DDR Reset signal
DDRSLRATE1
H27
I
Down
VREFSSTL
E14
P
EMIFRW
P26
OZ
UP
DDR Slew rate control
Reference Voltage Input for SSTL15 buffers used by DDR EMIF (VDDS15 ÷ 2)
EMIF16
EMIFCE0
P25
OZ
UP
EMIFCE1
R27
OZ
UP
EMIFCE2
R28
OZ
UP
EMIFCE3
R25
OZ
UP
EMIFOE
R26
OZ
UP
EMIFWE
P24
OZ
UP
EMIFBE0
R24
OZ
UP
EMIFBE1
R23
OZ
UP
EMIFWAIT0
T29
I
Down
EMIFWAIT1
T28
I
Down
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EMIF16 Control Signals
Device Overview
49
TMS320C6671
Fixed and Floating-Point Digital Signal Processor
SPRS756E—March 2014
Table 2-26
Terminal Functions — Signals and Control by Function (Part 7 of 13)
Signal Name
Ball No. Type
IPD/IPU
EMIFA00
T27
Down
EMIFA01
T24
OZ
Down
EMIFA02
U29
OZ
Down
EMIFA03
T25
OZ
Down
EMIFA04
U27
OZ
Down
EMIFA05
U28
OZ
Down
EMIFA06
U25
OZ
Down
EMIFA07
U24
OZ
Down
EMIFA08
V28
OZ
Down
EMIFA09
V29
OZ
Down
EMIFA10
V27
OZ
Down
EMIFA11
V26
OZ
Down
EMIFA12
V25
OZ
Down
EMIFA13
V24
OZ
Down
EMIFA14
W28
OZ
Down
EMIFA15
W27
OZ
Down
EMIFA16
W29
OZ
Down
EMIFA17
W26
OZ
Down
EMIFA18
W25
OZ
Down
EMIFA19
W24
OZ
Down
EMIFA20
W23
OZ
Down
EMIFA21
Y29
OZ
Down
EMIFA22
Y28
OZ
Down
EMIFA23
U23
OZ
Down
EMIFD00
Y27
IOZ
Down
EMIFD01
AB29
IOZ
Down
EMIFD02
AA29
IOZ
Down
OZ
EMIFD03
Y26
IOZ
Down
EMIFD04
AA27
IOZ
Down
EMIFD05
AB27
IOZ
Down
EMIFD06
AA26
IOZ
Down
EMIFD07
AA25
IOZ
Down
EMIFD08
Y25
IOZ
Down
EMIFD09
AB25
IOZ
Down
EMIFD10
AA24
IOZ
Down
EMIFD11
Y24
IOZ
Down
EMIFD12
AB23
IOZ
Down
EMIFD13
AB24
IOZ
Down
EMIFD14
AB26
IOZ
Down
EMIFD15
AC25
IOZ
Down
50
Device Overview
Description
EMIF16 Address
EMIF16 Data
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Fixed and Floating-Point Digital Signal Processor
SPRS756E—March 2014
Table 2-26
Signal Name
Terminal Functions — Signals and Control by Function (Part 8 of 13)
Ball No. Type
IPD/IPU
Description
EMU
EMU00
AC29
IOZ
UP
EMU01
AC28
IOZ
UP
EMU02
AC27
IOZ
UP
EMU03
AC26
IOZ
UP
EMU04
AD29
IOZ
UP
EMU05
AD28
IOZ
UP
EMU06
AD27
IOZ
UP
EMU07
AE29
IOZ
UP
EMU08
AE28
IOZ
UP
EMU09
AF29
IOZ
UP
EMU10
AE27
IOZ
UP
EMU11
AF28
IOZ
UP
EMU12
AG29
IOZ
UP
EMU13
AD26
IOZ
UP
EMU14
AG28
IOZ
UP
EMU15
AG27
IOZ
UP
EMU16
AJ27
IOZ
UP
EMU17
AF27
IOZ
UP
EMU18
AH27
IOZ
UP
Emulation and Trace Port
General Purpose Input/Output (GPIO)
GPIO00
H25
IOZ
UP
GPIO01
J28
IOZ
Down
GPIO02
J29
IOZ
Down
GPIO03
J26
IOZ
Down
GPIO04
J25
IOZ
Down
GPIO05
J27
IOZ
Down
GPIO06
J24
IOZ
Down
GPIO07
K27
IOZ
Down
GPIO08
K28
IOZ
Down
GPIO09
K26
IOZ
Down
GPIO10
K29
IOZ
Down
GPIO11
L28
IOZ
Down
GPIO12
L29
IOZ
Down
GPIO13
K25
IOZ
Down
GPIO14
K24
IOZ
Down
GPIO15
L27
IOZ
Down
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General Purpose Input/Output
These GPIO pins have secondary functions assigned to them as mentioned in the ‘‘Boot
Configuration Pins’’ on page 44.
Device Overview
51
TMS320C6671
Fixed and Floating-Point Digital Signal Processor
SPRS756E—March 2014
Table 2-26
Terminal Functions — Signals and Control by Function (Part 9 of 13)
Signal Name
Ball No. Type
IPD/IPU
Description
HyperLink
MCMRXN0
U2
I
MCMRXP0
T2
I
MCMRXN1
T1
I
MCMRXP1
R1
I
MCMRXN2
M1
I
MCMRXP2
N1
I
MCMRXN3
P2
I
MCMRXP3
N2
I
MCMTXN0
M5
O
MCMTXP0
N5
O
MCMTXN1
T4
O
MCMTXP1
U4
O
MCMTXN2
R5
O
MCMTXP2
T5
O
MCMTXN3
N4
O
MCMTXP3
P4
O
Serial HyperLink Receive Data
Serial HyperLink Transmit Data
MCMRXFLCLK
W3
O
Down
MCMRXFLDAT
W4
O
Down
MCMTXFLCLK
AA1
I
Down
MCMTXFLDAT
AA3
I
Down
MCMRXPMCLK
Y3
I
Down
MCMRXPMDAT
Y4
I
Down
MCMTXPMCLK
AA2
O
Down
MCMTXPMDAT
AA4
O
Down
MCMREFCLKOUTP
Y1
O
MCMREFCLKOUTN
W1
O
Serial HyperLink Sideband Signals
HyperLink Reference clock output for daisy chain connection
2
I C
2
SCL
AD3
IOZ
I C Clock
SDA
AC4
IOZ
I C Data
2
JTAG
TCK
N29
I
UP
JTAG Clock Input
TDI
P27
I
UP
JTAG Data Input
TDO
R29
OZ
UP
JTAG Data Output
TMS
P29
I
UP
JTAG Test Mode Input
TRST
P28
I
Down
JTAG Reset
MDIO
MDIO
G26
IOZ
UP
MDIO Data
MDCLK
H26
O
Down
MDIO Clock
52
Device Overview
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TMS320C6671
Fixed and Floating-Point Digital Signal Processor
SPRS756E—March 2014
Table 2-26
Signal Name
Terminal Functions — Signals and Control by Function (Part 10 of 13)
Ball No. Type
IPD/IPU
Description
PCIe
PCIERXN0
AH7
I
PCIERXP0
AH8
I
PCIERXN1
AJ9
I
PCIERXP1
AJ8
I
PCIETXN0
AF8
O
PCIETXP0
AF7
O
PCIETXN1
AG9
O
PCIETXP1
AG8
O
RIORXN0
AJ11
I
RIORXP0
AJ12
I
RIORXN1
AH10
I
PCIexpress Receive Data (2 links)
PCIexpress Transmit Data (2 links)
Serial RapidIO
RIORXP1
AH11
I
RIORXN2
AH14
I
RIORXP2
AH13
I
RIORXN3
AJ15
I
RIORXP3
AJ14
I
RIOTXN0
AF10
O
RIOTXP0
AF11
O
RIOTXN1
AG11
O
RIOTXP1
AG12
O
RIOTXN2
AG15
O
RIOTXP2
AG14
O
RIOTXN3
AF14
O
RIOTXP3
AF13
O
Serial RapidIO Receive Data (2 links)
Serial RapidIO Receive Data (2 links)
Serial RapidIO Transmit Data (2 links)
Serial RapidIO Transmit Data (2 links)
SGMII
SGMII0RXN
AJ18
I
SGMII0RXP
AJ17
I
SGMII0TXN
AG18
O
SGMII0TXP
AG17
O
SGMII1RXN
AH17
I
SGMII1RXP
AH16
I
SGMII1TXN
AF17
O
SGMII1TXP
AF16
O
VCNTL0
L23
OZ
VCNTL1
K23
OZ
VCNTL2
J23
OZ
VCNTL3
H23
OZ
Ethernet MAC SGMII Receive Data
Ethernet MAC SGMII Transmit Data
Ethernet MAC SGMII Receive Data
Ethernet MAC SGMII Transmit Data
SmartReflex
Copyright 2014 Texas Instruments Incorporated
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Voltage Control Outputs to variable core power supply. These are open-drain output buffers.
Device Overview
53
TMS320C6671
Fixed and Floating-Point Digital Signal Processor
SPRS756E—March 2014
Table 2-26
Signal Name
Terminal Functions — Signals and Control by Function (Part 11 of 13)
Ball No. Type
IPD/IPU
Description
SPI
SPISCS0
AG1
OZ
UP
SPI Interface Enable 0
SPISCS1
AG2
OZ
UP
SPI Interface Enable 1
SPICLK
AE1
OZ
Down
SPI Clock
SPIDIN
AD2
I
Down
SPI Data In
SPIDOUT
AB1
OZ
Down
SPI Data Out
Timer
TIMI0
L24
I
Down
TIMI1
L26
I
Down
TIMO0
L25
OZ
Down
TIMO1
M26
OZ
Down
CLKA0
AF25
I
Down
Timer Inputs
Timer Outputs
TSIP
TSIP0 external clock A
CLKB0
AG25
I
Down
TSIP0 external clock B
FSA0
AJ26
I
Down
TSIP0 frame sync A
FSB0
AG26
I
Down
TSIP0 frame sync B
TR00
AH26
I
Down
TR01
AJ25
I
Down
TR02
AD23
I
Down
TR03
AD24
I
Down
TR04
AC23
I
Down
TR05
AH25
I
Down
TR06
AC24
I
Down
TR07
AE25
I
Down
TX00
AE24
OZ
Down
TX01
AD25
OZ
Down
TX02
AJ24
OZ
Down
TX03
AG24
OZ
Down
TX04
AH24
OZ
Down
TX05
AF24
OZ
Down
TX06
AE23
OZ
Down
TSIP0 receive data
TSIP0 transmit data
TX07
AF23
OZ
Down
CLKA1
AJ23
I
Down
TSIP1 external clock A
CLKB1
AH23
I
Down
TSIP1 external clock B
FSA1
AG23
I
Down
TSIP1 frame sync A
FSB1
AJ22
I
Down
TSIP1 frame sync B
54
Device Overview
Copyright 2014 Texas Instruments Incorporated
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TMS320C6671
Fixed and Floating-Point Digital Signal Processor
SPRS756E—March 2014
Table 2-26
Terminal Functions — Signals and Control by Function (Part 12 of 13)
Signal Name
Ball No. Type
IPD/IPU
TR10
AE22
I
Down
TR11
AD21
I
Down
TR12
AC21
I
Down
TR13
AJ21
I
Down
TR14
AH22
I
Down
TR15
AJ20
I
Down
TR16
AH21
I
Down
TR17
AG21
I
Down
TX10
AF21
OZ
Down
TX11
AD22
OZ
Down
TX12
AC22
OZ
Down
TX13
AE21
OZ
Down
TX14
AG20
OZ
Down
TX15
AE20
OZ
Down
TX16
AH20
OZ
Down
TX17
AF20
OZ
Down
Description
TSIP1 receive data
TSIP1 transmit data
UART
UARTRXD
AD1
I
Down
UART Serial Data In
UARTTXD
AC1
OZ
Down
UART Serial Data Out
UARTCTS
AB3
I
Down
UART Clear To Send
UARTRTS
AB2
OZ
Down
UART Request To Send
RSV01
AH28
IOZ
Down
Reserved - Pullup to DVDD18
RSV02
N24
OZ
Down
Reserved - leave unconnected
RSV03
N23
OZ
Down
Reserved - leave unconnected
RSV04
AH2
O
Reserved - leave unconnected
RSV05
AJ3
O
Reserved - leave unconnected
RSV06
H28
O
Reserved - leave unconnected
RSV07
G28
O
Reserved - leave unconnected
RSV08
AH19
A
Reserved - Connect to GND
RSV09
AF19
A
Reserved - leave unconnected
RSV10
K22
A
Reserved - leave unconnected
RSV11
J22
A
Reserved - leave unconnected
RSV12
Y5
A
Reserved - leave unconnected
RSV13
W5
A
Reserved - leave unconnected
RSV14
W6
A
Reserved - leave unconnected
RSV15
AE12
A
Reserved - leave unconnected
RSV16
AC9
A
Reserved - leave unconnected
RSV17
AD19
A
Reserved - leave unconnected
RSV20
AF3
OZ
Down
Reserved - leave unconnected
RSV21
G25
OZ
Down
Reserved - leave unconnected
Down
Reserved
RSV22
AF1
OZ
RSV24
AH4
O
Copyright 2014 Texas Instruments Incorporated
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Reserved - leave unconnected
Reserved - leave unconnected
Device Overview
55
TMS320C6671
Fixed and Floating-Point Digital Signal Processor
SPRS756E—March 2014
Table 2-26
Terminal Functions — Signals and Control by Function (Part 13 of 13)
Signal Name
Ball No. Type
RSV25
AH3
O
IPD/IPU
Reserved - leave unconnected
Description
RSV26
M23
IOZ
Reserved - leave unconnected
RSV27
M24
IOZ
Reserved - leave unconnected
RSV0A
AA21
A
Reserved - leave unconnected
RSV0B
AA20
A
Reserved - leave unconnected
End of Table 2-26
56
Device Overview
Copyright 2014 Texas Instruments Incorporated
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TMS320C6671
Fixed and Floating-Point Digital Signal Processor
SPRS756E—March 2014
Table 2-27
Supply
Terminal Functions — Power and Ground
Ball No.
Volts Description
AVDDA1
H22
1.8
PLL Supply - CORE_PLL
AVDDA2
AC6
1.8
PLL Supply - DDR3_PLL
AVDDA3
AD5
1.8
PLL Supply - PASS_PLL
CVDD
H7, H9, H11, H13, H15, H17, H19, H21, J10, J12, J16, J18, J20, K11, K17, K19, K21, L10, L12, L16, 0.9
to
L18, M11, M13, M15, M17, M19, N8, N10, N12, N14, N16, N18, P9, P11, P13, P15, P17, P19,
P21, R8, R10, R18, R20, R22, T9, T11, T13, T15, T17, T19, T21, U8, U10, U18, U20, U22, V9, V11, 1.1
V17, V19, V21, W8, W10, W18, W20, W22, Y9, Y11, Y13, Y15, Y17, Y19, Y21, AA8, AA10, AA12,
AA14, AA16, AA18, AA22
SmartReflex core supply voltage
CVDD1
J8, J14, K7, K9, K13, K15, L8, L14, L20, L22, M9, M21, N20, N22, R12, R14, R16, U12, U14, U16,
V13, V15, W12, W14, W16
Fixed core supply voltage for
memory array
DVDD15
A2, A11, A17, A28, B1, B29, C14, C25, D5, D8, D20, D23, E3, F5, F7, F9, F11, F17, F19, F26, F28, 1.5
G2, G4, G8, G10, G12, G14, G16, G18, G20, G23
DDR IO supply
DVDD18
H24, N28, P23, T23, U26, V23, Y7, Y23, AA6, AB5, AB7, AB19, AB21, AB28, AC3, AF5, AF26,
AG22, AH1, AH29, AJ2, AJ28
1.8
IO supply
VDDR1
V5
1.5
HyperLink SerDes regulator supply
VDDR2
AE10
1.5
PCIe SerDes regulator supply
VDDR3
AE16
1.5
SGMII SerDes regulator supply
1.0
VDDR4
AE14
1.5
SRIO SerDes regulator supply
VDDT1
M7, N6, P7, R6, T7, U6, V7
1.0
HyperLink SerDes termination
supply
VDDT2
AB9, AB11, AB13, AB15, AB17, AC8, AC10, AC12, AC14, AC16, AC18, AD7, AD9, AD11, AD13,
AD15, AD17, AE18
1.0
SGMII/SRIO/PCIe SerDes
termination supply
VREFSSTL
E14
0.75
VSS
A1, A29, B11, B17, B25, C8, C23, D3, D14, D18, E5, E20, F6, F8, F10, F12, F16, F18, F27, F29, G1, GND
G3, G5, G6, G7, G9, G11, G13, G15, G17, G19, G21, G24, H1, H2, H3, H4, H5, H6, H8, H10, H12,
H14, H16, H18, H20, J1, J2, J3, J4, J5, J6, J7, J9, J11, J13, J15, J17, J19, J21, K1, K2, K3, K4, K5, K6,
K8, K10, K12, K14, K16, K18, K20, L1, L2, L3, L4, L5, L6, L7, L9, L11, L13, L15, L17, L19, L21, M2,
M3, M4, M6, M8, M10, M12, M14, M16, M18, M20, M22, M28, N3, N7, N9, N11, N13, N15, N17,
N19, N21, P1, P3, P5, P6, P8, P10, P12, P14, P16, P18, P20, P22, R2, R3, R4, R7, R9, R11, R13,
R15, R17, R19, R21, T3, T6, T8, T10, T12, T14, T16, T18, T20, T22, T26, U1, U3, U5, U7, U9, U11,
U13, U15, U17, U19, U21, V1, V2, V3, V4, V6, V8, V10, V12, V14, V16, V18, V20, V22, W7, W9,
W11, W13, W15, W17, W19, W21, Y6, Y8, Y10, Y12, Y14, Y16, Y18, Y20, Y22, AA5, AA7, AA9,
AA11, AA13, AA15, AA17, AA19, AA23, AA28, AB4, AB6, AB8, AB10, AB12, AB14, AB16, AB18,
AB20, AB22, AC2, AC5, AC7, AC11, AC13, AC15, AC17, AC19, AD6, AD8, AD10, AD12, AD14,
AD16, AD18, AE7, AE8, AE9, AE11, AE13, AE15, AE17, AE19, AE26, AF4, AF6, AF9, AF12, AF15,
AF18, AF22, AG7, AG10, AG13, AG16, AG19, AH6, AH9, AH12, AH15, AH18, AJ1, AJ7, AJ10,
AJ13, AJ16, AJ19, AJ29
DDR3 reference voltage
Ground
End of Table 2-27
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Device Overview
57
TMS320C6671
Fixed and Floating-Point Digital Signal Processor
SPRS756E—March 2014
Table 2-28
Terminal Functions
— By Signal Name
(Part 1 of 13)
Table 2-28
Terminal Functions
— By Signal Name
(Part 2 of 13)
Table 2-28
Terminal Functions
— By Signal Name
(Part 3 of 13)
Ball Number
Signal Name
Ball Number
Signal Name
Ball Number
AVDDA1
H22
CVDD
DDRCLKOUTN0
B12
AVDDA2
AC6
W10, W18, W20,
W22, Y9, Y11, Y13,
Y15, Y17, Y19, Y21,
AA8, AA10, AA12,
AA14, AA16, AA18,
AA22
Signal Name
AVDDA3
AD5
BOOTCOMPLETE
AE2
BOOTMODE00 †
J28
BOOTMODE01†
J29
BOOTMODE02 †
J26
BOOTMODE03 †
J25
CVDD1
DDRCLKOUTN1
B16
DDRCLKOUTP0
A12
DDRCLKOUTP1
A16
J8, J14, K7, K9, K13,
K15, L8, L14, L20,
L22, M9, M21, N20,
N22, R12, R14, R16,
U12, U14, U16, V13,
V15, W12, W14,
W16
DDRCLKP
G29
DDRD00
E28
DDRD01
D29
DDRD02
E27
DDRD03
D28
BOOTMODE04 †
J27
BOOTMODE05 †
J24
DDRA00
A14
DDRD04
D27
BOOTMODE06 †
K27
DDRA01
B14
DDRD05
B28
BOOTMODE07 †
K28
DDRA02
F14
DDRD06
E26
BOOTMODE08 †
K26
DDRA03
F13
DDRD07
F25
BOOTMODE09 †
K29
DDRA04
A15
DDRD08
F24
BOOTMODE10 †
L28
DDRA05
C15
DDRD09
E24
BOOTMODE11 †
L29
DDRA06
B15
DDRD10
E25
BOOTMODE12 †
K25
DDRA07
D15
DDRD11
D25
CLKA0
AF25
DDRA08
F15
DDRD12
D26
CLKA1
AJ23
DDRA09
E15
DDRD13
C26
CLKB0
AG25
DDRA10
E16
DDRD14
B26
CLKB1
AH23
DDRA11
D16
DDRD15
A26
CORECLKN
AG4
DDRA12
E17
DDRD16
F23
CORECLKP
AG3
DDRA13
C16
DDRD17
F22
CORESEL0
AF2
DDRA14
D17
DDRD18
D24
CORESEL1
AD4
DDRA15
C17
DDRD19
E23
CORESEL2
AE6
DDRBA0
A13
DDRD20
A23
CORESEL3
AE5
DDRBA1
B13
DDRD21
B23
CVDD
H7, H9, H11, H13,
H15, H17, H19, H21,
J10, J12, J16, J18,
J20, K11, K17, K19,
K21, L10, L12, L16,
L18, M11, M13,
M15, M17, M19, N8,
N10, N12, N14,
DDRBA2
C13
DDRD22
C24
DDRCAS
D12
DDRD23
E22
DDRCB00
E19
DDRD24
D21
DDRCB01
C20
DDRD25
F20
DDRCB02
D19
DDRD26
E21
DDRCB03
B20
DDRD27
F21
DDRCB04
C19
DDRD28
D22
DDRCB05
C18
DDRD29
C21
DDRCB06
B18
DDRD30
B22
DDRCB07
A18
DDRD31
C22
DDRCE0
C11
DDRD32
E10
DDRCE1
C12
DDRD33
D10
DDRCKE0
D11
DDRD34
B10
DDRCKE1
E18
DDRD35
D9
DDRCLKN
H29
DDRD36
E9
CVDD
N16, N18, P9, P11,
P13, P15, P17, P19,
P21, R8, R10, R18,
R20, R22, T9, T11,
T13, T15, T17, T19,
T21, U8, U10, U18,
U20, U22, V9, V11,
V17, V19, V21, W8,
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Device Overview
58
TMS320C6671
Fixed and Floating-Point Digital Signal Processor
SPRS756E—March 2014
Table 2-28
Terminal Functions
— By Signal Name
(Part 4 of 13)
Table 2-28
Signal Name
Ball Number
Signal Name
DDRD37
C9
DDRD38
B8
DDRD39
E8
DDRD40
A7
DDRD41
DDRD42
Terminal Functions
— By Signal Name
(Part 5 of 13)
Table 2-28
Terminal Functions
— By Signal Name
(Part 6 of 13)
Ball Number
Signal Name
Ball Number
DDRDQS3N
B21
EMIFA13
V24
DDRDQS3P
A21
EMIFA14
W28
DDRDQS4N
B9
EMIFA15
W27
DDRDQS4P
A9
EMIFA16
W29
D7
DDRDQS5N
A6
EMIFA17
W26
E7
DDRDQS5P
B6
EMIFA18
W25
DDRD43
C7
DDRDQS6N
A3
EMIFA19
W24
DDRD44
B7
DDRDQS6P
B3
EMIFA20
W23
DDRD45
E6
DDRDQS7N
C1
EMIFA21
Y29
DDRD46
D6
DDRDQS7P
D1
EMIFA22
Y28
DDRD47
C6
DDRDQS8N
B19
EMIFA23
U23
DDRD48
C5
DDRDQS8P
A19
EMIFBE0
R24
DDRD49
A5
DDRODT0
D13
EMIFBE1
R23
DDRD50
B4
DDRODT1
E13
EMIFCE0
P25
DDRD51
A4
DDRRAS
C10
EMIFCE1
R27
DDRD52
D4
DDRRESET
E11
EMIFCE2
R28
DDRD53
E4
DDRSLRATE0
G27
EMIFCE3
R25
DDRD54
C4
DDRSLRATE1
H27
EMIFD00
Y27
DDRD55
C3
DDRWE
E12
EMIFD01
AB29
DDRD56
F4
DVDD15
EMIFD02
AA29
DDRD57
D2
EMIFD03
Y26
DDRD58
E2
EMIFD04
AA27
DDRD59
C2
EMIFD05
AB27
DDRD60
F2
EMIFD06
AA26
DDRD61
F3
A2, A11, A17, A28,
B1, B29, C14, C25,
D5, D8, D20, D23,
E3, F5, F7, F9, F11,
F17, F19, F26, F28,
G2, G4, G8, G10,
G12, G14, G16, G18,
G20, G23
DDRD62
E1
DDRD63
F1
DDRDQM0
E29
DDRDQM1
C27
DDRDQM2
A25
DDRDQM3
A22
DDRDQM4
A10
DDRDQM5
A8
DDRDQM6
B5
DDRDQM7
B2
DDRDQM8
A20
DDRDQS0N
C29
DDRDQS0P
C28
DDRDQS1N
B27
DDRDQS1P
A27
DDRDQS2N
B24
DDRDQS2P
A24
59
Device Overview
DVDD18
H24, N28, P23, T23,
U26, V23, Y7, Y23,
AA6, AB5, AB7,
AB19, AB21, AB28,
AC3, AF5, AF26,
AG22, AH1, AH29,
AJ2, AJ28
EMIFA00
T27
EMIFA01
T24
EMIFA02
U29
EMIFA03
T25
EMIFA04
U27
EMIFA05
U28
EMIFA06
U25
EMIFA07
U24
EMIFA08
V28
EMIFA09
V29
EMIFA10
V27
EMIFA11
V26
EMIFA12
V25
EMIFD07
AA25
EMIFD08
Y25
EMIFD09
AB25
EMIFD10
AA24
EMIFD11
Y24
EMIFD12
AB23
EMIFD13
AB24
EMIFD14
AB26
EMIFD15
AC25
EMIFOE
R26
EMIFRW
P26
EMIFWAIT0
T29
EMIFWAIT1
T28
EMIFWE
P24
EMU00
AC29
EMU01
AC28
EMU02
AC27
EMU03
AC26
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TMS320C6671
Fixed and Floating-Point Digital Signal Processor
SPRS756E—March 2014
Table 2-28
Terminal Functions
— By Signal Name
(Part 7 of 13)
Table 2-28
Signal Name
Ball Number
Signal Name
EMU04
AD29
EMU05
AD28
EMU06
EMU07
Terminal Functions
— By Signal Name
(Part 8 of 13)
Table 2-28
Terminal Functions
— By Signal Name
(Part 9 of 13)
Ball Number
Signal Name
Ball Number
MCMREFCLKOUTP
Y1
PCIETXP0
AF7
MCMRXFLCLK
W3
PCIETXP1
AG8
AD27
MCMRXFLDAT
W4
POR
AC20
AE29
MCMRXN0
U2
PTV15
G22
EMU08
AE28
MCMRXN1
T1
RESETFULL
N25
EMU09
AF29
MCMRXN2
M1
RESETSTAT
N27
EMU10
AE27
MCMRXN3
P2
RESET
M29
EMU11
AF28
MCMRXP0
T2
RIORXN0
AJ11
EMU12
AG29
MCMRXP1
R1
RIORXN1
AH10
EMU13
AD26
MCMRXP2
N1
RIORXN2
AH14
EMU14
AG28
MCMRXP3
N2
RIORXN3
AJ15
EMU15
AG27
MCMRXPMCLK
Y3
RIORXP0
AJ12
EMU16
AJ27
MCMRXPMDAT
Y4
RIORXP1
AH11
EMU17
AF27
MCMTXFLCLK
AA1
RIORXP2
AH13
EMU18
AH27
MCMTXFLDAT
AA3
RIORXP3
AJ14
FSA0
AJ26
MCMTXN0
M5
RIOTXN0
AF10
FSA1
AG23
MCMTXN1
T4
RIOTXN1
AG11
FSB0
AG26
MCMTXN2
R5
RIOTXN2
AG15
FSB1
AJ22
MCMTXN3
N4
RIOTXN3
AF14
GPIO00
H25
MCMTXP0
N5
RIOTXP0
AF11
GPIO01
J28
MCMTXP1
U4
RIOTXP1
AG12
GPIO02
J29
MCMTXP2
T5
RIOTXP2
AG14
GPIO03
J26
MCMTXP3
P4
RIOTXP3
AF13
GPIO04
J25
MCMTXPMCLK
AA2
RSV01
AH28
GPIO05
J27
MCMTXPMDAT
AA4
RSV02
N24
GPIO06
J24
MDCLK
H26
RSV03
N23
GPIO07
K27
MDIO
G26
RSV04
AH2
GPIO08
K28
NMI
M25
RSV05
AJ3
GPIO09
K26
PACLKSEL
AE4
RSV06
H28
GPIO10
K29
PASSCLKN
AJ4
RSV07
G28
GPIO11
L28
PASSCLKP
AJ5
RSV08
AH19
GPIO12
L29
PCIECLKN
AH5
RSV09
AF19
GPIO13
K25
PCIECLKP
AG5
RSV0A
AA21
GPIO14
K24
PCIERXN0
AH7
RSV0B
AA20
GPIO15
L27
PCIERXN1
AJ9
RSV10
K22
HOUT
AD20
PCIERXP0
AH8
RSV11
J22
LENDIAN †
H25
PCIERXP1
AJ8
RSV12
Y5
LRESETNMIEN
M27
PCIESSMODE0 †
K24
RSV13
W5
LRESET
N26
PCIESSMODE1 †
L27
RSV14
W6
MCMCLKN
Y2
PCIESSEN †
L24
RSV15
AE12
MCMCLKP
W2
PCIETXN0
AF8
RSV16
AC9
MCMREFCLKOUTN
W1
PCIETXN1
AG9
RSV17
AD19
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60
TMS320C6671
Fixed and Floating-Point Digital Signal Processor
SPRS756E—March 2014
Table 2-28
Terminal Functions
— By Signal Name
(Part 10 of 13)
Table 2-28
Terminal Functions
— By Signal Name
(Part 11 of 13)
Table 2-28
Terminal Functions
— By Signal Name
(Part 12 of 13)
Signal Name
Ball Number
Signal Name
Ball Number
Signal Name
Ball Number
RSV20
AF3
TR13
AJ21
VSS
RSV21
G25
TR14
AH22
RSV22
AF1
TR15
AJ20
RSV24
AH4
TR16
AH21
RSV25
AH3
TR17
AG21
SCL
AD3
TRST
P28
A1, A29, B11, B17,
B25, C8, C23, D3,
D14, D18, E5, E20,
F6, F8, F10, F12,
F16, F18, F27, F29,
G1, G3, G5, G6, G7,
G9, G11, G13, G15,
G17, G19, G21, G24,
SDA
AC4
TX00
AE24
VSS
SGMII0RXN
AJ18
TX01
AD25
SGMII0RXP
AJ17
TX02
AJ24
SGMII0TXN
AG18
TX03
AG24
SGMII0TXP
AG17
TX04
AH24
H1, H2, H3, H4, H5,
H6, H8, H10, H12,
H14, H16, H18, H20,
J1, J2, J3, J4, J5, J6,
J7, J9, J11, J13, J15,
J17, J19, J21, K1, K2,
K3, K4, K5, K6, K8,
K10, K12, K14, K16,
SGMII1RXN
AH17
TX05
AF24
VSS
SGMII1RXP
AH16
TX06
AE23
SGMII1TXN
AF17
TX07
AF23
SGMII1TXP
AF16
TX10
AF21
SPICLK
AE1
TX11
AD22
SPIDIN
AD2
TX12
AC22
K18, K20, L1, L2, L3,
L4, L5, L6, L7, L9,
L11, L13, L15, L17,
L19, L21, M2, M3,
M4, M6, M8, M10,
M12, M14, M16,
M18, M20, M22,
M28, N3, N7, N9,
SPIDOUT
AB1
TX13
AE21
VSS
SPISCS0
AG1
TX14
AG20
SPISCS1
AG2
TX15
AE20
SRIOSGMIICLKN
AJ6
TX16
AH20
SRIOSGMIICLKP
AG6
TX17
AF20
N11, N13, N15, N17,
N19, N21, P1, P3,
P5, P6, P8, P10, P12,
P14, P16, P18, P20,
P22, R2, R3, R4, R7,
R9, R11, R13, R15,
R17, R19, R21, T3,
T6, T8, T10, T12,
SYSCLKOUT
AE3
UARTCTS
AB3
VSS
TCK
N29
UARTRTS
AB2
TDI
P27
UARTRXD
AD1
TDO
R29
UARTTXD
AC1
TIMI0
L24
VCNTL0
L23
TIMI1
L26
VCNTL1
K23
T14, T16, T18, T20,
T22, T26, U1, U3,
U5, U7, U9, U11,
U13, U15, U17, U19,
U21, V1, V2, V3, V4,
V6, V8, V10, V12,
V14, V16, V18, V20,
V22, W7, W9, W11,
TIMO0
L25
VCNTL2
J23
VSS
TIMO1
M26
VCNTL3
H23
TMS
P29
VDDR1
V5
TR00
AH26
VDDR2
AE10
TR01
AJ25
VDDR3
AE16
W13, W15, W17,
W19, W21, Y6, Y8,
Y10, Y12, Y14, Y16,
Y18, Y20, Y22, AA5,
AA7, AA9, AA11,
AA13, AA15, AA17,
AA19, AA23, AA28,
AB4, AB6, AB8,
TR02
AD23
VDDR4
AE14
VSS
TR03
AD24
VDDT1
TR04
AC23
M7, N6, P7, R6, T7,
U6, V7
TR05
AH25
VDDT2
TR06
AC24
TR07
AE25
TR10
AE22
AB9, AB11, AB13,
AB15, AB17, AC8,
AC10, AC12, AC14,
AC16, AC18, AD7,
AD9, AD11, AD13,
AD15, AD17, AE18
AB10, AB12, AB14,
AB16, AB18, AB20,
AB22, AC2, AC5,
AC7, AC11, AC13,
AC15, AC17, AC19,
AD6, AD8, AD10,
AD12, AD14, AD16,
AD18, AE7, AE8,
TR11
AD21
VREFSSTL
E14
TR12
AC21
61
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TMS320C6671
Fixed and Floating-Point Digital Signal Processor
SPRS756E—March 2014
Table 2-28
Terminal Functions
— By Signal Name
(Part 13 of 13)
Signal Name
Ball Number
VSS
AE9, AE11, AE13,
AE15, AE17, AE19,
AE26, AF4, AF6,
AF9, AF12, AF15,
AF18, AF22AG7,
AG10, AG13, AG16,
AG19, AH6, AH9,
AH12, AH15, AH18,
VSS
AJ1, AJ7, AJ10,
AJ13, AJ16, AJ19,
AJ29
End of Table 2-28
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Device Overview
62
TMS320C6671
Fixed and Floating-Point Digital Signal Processor
SPRS756E—March 2014
Table 2-29
Terminal Functions
— By Ball Number
(Part 1 of 21)
Table 2-29
Terminal Functions
— By Ball Number
(Part 2 of 21)
Table 2-29
Terminal Functions
— By Ball Number
(Part 3 of 21)
Signal Name
Ball Number
Signal Name
Ball Number
Signal Name
A1
VSS
B14
DDRA01
C27
DDRDQM1
A2
DVDD15
B15
DDRA06
C28
DDRDQS0P
A3
DDRDQS6N
B16
DDRCLKOUTN1
C29
DDRDQS0N
A4
DDRD51
B17
VSS
D1
DDRDQS7P
A5
DDRD49
B18
DDRCB06
D2
DDRD57
A6
DDRDQS5N
B19
DDRDQS8N
D3
VSS
A7
DDRD40
B20
DDRCB03
D4
DDRD52
A8
DDRDQM5
B21
DDRDQS3N
D5
DVDD15
A9
DDRDQS4P
B22
DDRD30
D6
DDRD46
A10
DDRDQM4
B23
DDRD21
D7
DDRD41
A11
DVDD15
B24
DDRDQS2N
D8
DVDD15
A12
DDRCLKOUTP0
B25
VSS
D9
DDRD35
A13
DDRBA0
B26
DDRD14
D10
DDRD33
A14
DDRA00
B27
DDRDQS1N
D11
DDRCKE0
A15
DDRA04
B28
DDRD05
D12
DDRCAS
A16
DDRCLKOUTP1
B29
DVDD15
D13
DDRODT0
A17
DVDD15
C1
DDRDQS7N
D14
VSS
A18
DDRCB07
C2
DDRD59
D15
DDRA07
A19
DDRDQS8P
C3
DDRD55
D16
DDRA11
A20
DDRDQM8
C4
DDRD54
D17
DDRA14
A21
DDRDQS3P
C5
DDRD48
D18
VSS
A22
DDRDQM3
C6
DDRD47
D19
DDRCB02
A23
DDRD20
C7
DDRD43
D20
DVDD15
A24
DDRDQS2P
C8
VSS
D21
DDRD24
A25
DDRDQM2
C9
DDRD37
D22
DDRD28
A26
DDRD15
C10
DDRRAS
D23
DVDD15
A27
DDRDQS1P
C11
DDRCE0
D24
DDRD18
A28
DVDD15
C12
DDRCE1
D25
DDRD11
A29
VSS
C13
DDRBA2
D26
DDRD12
B1
DVDD15
C14
DVDD15
D27
DDRD04
B2
DDRDQM7
C15
DDRA05
D28
DDRD03
B3
DDRDQS6P
C16
DDRA13
D29
DDRD01
B4
DDRD50
C17
DDRA15
E1
DDRD62
B5
DDRDQM6
C18
DDRCB05
E2
DDRD58
B6
DDRDQS5P
C19
DDRCB04
E3
DVDD15
B7
DDRD44
C20
DDRCB01
E4
DDRD53
B8
DDRD38
C21
DDRD29
E5
VSS
B9
DDRDQS4N
C22
DDRD31
E6
DDRD45
B10
DDRD34
C23
VSS
E7
DDRD42
B11
VSS
C24
DDRD22
E8
DDRD39
B12
DDRCLKOUTN0
C25
DVDD15
E9
DDRD36
B13
DDRBA1
C26
DDRD13
E10
DDRD32
Ball Number
63
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TMS320C6671
Fixed and Floating-Point Digital Signal Processor
SPRS756E—March 2014
Table 2-29
Terminal Functions
— By Ball Number
(Part 4 of 21)
Table 2-29
Terminal Functions
— By Ball Number
(Part 5 of 21)
Table 2-29
Terminal Functions
— By Ball Number
(Part 6 of 21)
Ball Number
Signal Name
Ball Number
Signal Name
Ball Number
E11
DDRRESET
F24
DDRD08
H8
VSS
E12
DDRWE
F25
DDRD07
H9
CVDD
E13
DDRODT1
F26
DVDD15
H10
VSS
E14
VREFSSTL
F27
VSS
H11
CVDD
E15
DDRA09
F28
DVDD15
H12
VSS
E16
DDRA10
F29
VSS
H13
CVDD
E17
DDRA12
G1
VSS
H14
VSS
E18
DDRCKE1
G2
DVDD15
H15
CVDD
E19
DDRCB00
G3
VSS
H16
VSS
E20
VSS
G4
DVDD15
H17
CVDD
E21
DDRD26
G5
VSS
H18
VSS
E22
DDRD23
G6
VSS
H19
CVDD
E23
DDRD19
G7
VSS
H20
VSS
E24
DDRD09
G8
DVDD15
H21
CVDD
E25
DDRD10
G9
VSS
H22
AVDDA1
E26
DDRD06
G10
DVDD15
H23
VCNTL3
E27
DDRD02
G11
VSS
H24
DVDD18
E28
DDRD00
G12
DVDD15
H25
GPIO00
E29
DDRDQM0
G13
VSS
H25
LENDIAN †
F1
DDRD63
G14
DVDD15
H26
MDCLK
F2
DDRD60
G15
VSS
H27
DDRSLRATE1
F3
DDRD61
G16
DVDD15
H28
RSV06
F4
DDRD56
G17
VSS
H29
DDRCLKN
F5
DVDD15
G18
DVDD15
J1
VSS
F6
VSS
G19
VSS
J2
VSS
F7
DVDD15
G20
DVDD15
J3
VSS
F8
VSS
G21
VSS
J4
VSS
F9
DVDD15
G22
PTV15
J5
VSS
F10
VSS
G23
DVDD15
J6
VSS
F11
DVDD15
G24
VSS
J7
VSS
F12
VSS
G25
RSV21
J8
CVDD1
F13
DDRA03
G26
MDIO
J9
VSS
F14
DDRA02
G27
DDRSLRATE0
J10
CVDD
F15
DDRA08
G28
RSV07
J11
VSS
F16
VSS
G29
DDRCLKP
J12
CVDD
F17
DVDD15
H1
VSS
J13
VSS
F18
VSS
H2
VSS
J14
CVDD1
F19
DVDD15
H3
VSS
J15
VSS
F20
DDRD25
H4
VSS
J16
CVDD
F21
DDRD27
H5
VSS
J17
VSS
F22
DDRD17
H6
VSS
J18
CVDD
F23
DDRD16
H7
CVDD
J19
VSS
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Device Overview
64
TMS320C6671
Fixed and Floating-Point Digital Signal Processor
SPRS756E—March 2014
Table 2-29
Ball Number
Terminal Functions
— By Ball Number
(Part 7 of 21)
Table 2-29
Signal Name
Ball Number
J20
CVDD
J21
VSS
J22
RSV11
J23
VCNTL2
J24
GPIO06
J24
BOOTMODE05 †
J25
GPIO04
J25
BOOTMODE03 †
J26
GPIO03
J26
BOOTMODE02 †
J27
J27
Terminal Functions
— By Ball Number
(Part 8 of 21)
Table 2-29
Terminal Functions
— By Ball Number
(Part 9 of 21)
Signal Name
Ball Number
Signal Name
K25
BOOTMODE12 †
M1
MCMRXN2
K26
GPIO09
M2
VSS
K26
BOOTMODE08 †
M3
VSS
K27
GPIO07
M4
VSS
K27
BOOTMODE06 †
M5
MCMTXN0
K28
GPIO08
M6
VSS
K28
BOOTMODE07 †
M7
VDDT1
K29
GPIO10
M8
VSS
K29
BOOTMODE09 †
M9
CVDD1
L1
VSS
M10
VSS
GPIO05
L2
VSS
M11
CVDD
BOOTMODE04 †
L3
VSS
M12
VSS
J28
GPIO01
L4
VSS
M13
CVDD
J28
BOOTMODE00 †
L5
VSS
M14
VSS
J29
GPIO02
L6
VSS
M15
CVDD
J29
BOOTMODE01†
L7
VSS
M16
VSS
K1
VSS
L8
CVDD1
M17
CVDD
K2
VSS
L9
VSS
M18
VSS
K3
VSS
L10
CVDD
M19
CVDD
K4
VSS
L11
VSS
M20
VSS
K5
VSS
L12
CVDD
M21
CVDD1
K6
VSS
L13
VSS
M22
VSS
K7
CVDD1
L14
CVDD1
M25
NMI
K8
VSS
L15
VSS
M26
TIMO1
K9
CVDD1
L16
CVDD
M27
LRESETNMIEN
K10
VSS
L17
VSS
M28
VSS
K11
CVDD
L18
CVDD
M29
RESET
K12
VSS
L19
VSS
N1
MCMRXP2
K13
CVDD1
L20
CVDD1
N2
MCMRXP3
K14
VSS
L21
VSS
N3
VSS
K15
CVDD1
L22
CVDD1
N4
MCMTXN3
K16
VSS
L23
VCNTL0
N5
MCMTXP0
K17
CVDD
L24
TIMI0
N6
VDDT1
K18
VSS
L24
PCIESSEN †
N7
VSS
K19
CVDD
L25
TIMO0
N8
CVDD
K20
VSS
L26
TIMI1
N9
VSS
K21
CVDD
L27
GPIO15
N10
CVDD
K22
RSV10
L27
PCIESSMODE1 †
N11
VSS
K23
VCNTL1
L28
GPIO11
N12
CVDD
K24
GPIO14
L28
BOOTMODE10 †
N13
VSS
K24
PCIESSMODE0 †
L29
GPIO12
N14
CVDD
K25
GPIO13
L29
BOOTMODE11 †
N15
VSS
65
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TMS320C6671
Fixed and Floating-Point Digital Signal Processor
SPRS756E—March 2014
Table 2-29
Ball Number
Terminal Functions
— By Ball Number
(Part 10 of 21)
Table 2-29
Terminal Functions
— By Ball Number
(Part 11 of 21)
Table 2-29
Terminal Functions
— By Ball Number
(Part 12 of 21)
Signal Name
Ball Number
Signal Name
Ball Number
N16
CVDD
P29
TMS
T13
CVDD
N17
VSS
R1
MCMRXP1
T14
VSS
N18
CVDD
R2
VSS
T15
CVDD
N19
VSS
R3
VSS
T16
VSS
N20
CVDD1
R4
VSS
T17
CVDD
N21
VSS
R5
MCMTXN2
T18
VSS
N22
CVDD1
R6
VDDT1
T19
CVDD
N23
RSV03
R7
VSS
T20
VSS
N24
RSV02
R8
CVDD
T21
CVDD
N25
RESETFULL
R9
VSS
T22
VSS
N26
LRESET
R10
CVDD
T23
DVDD18
N27
RESETSTAT
R11
VSS
T24
EMIFA01
N28
DVDD18
R12
CVDD1
T25
EMIFA03
N29
TCK
R13
VSS
T26
VSS
P1
VSS
R14
CVDD1
T27
EMIFA00
P2
MCMRXN3
R15
VSS
T28
EMIFWAIT1
P3
VSS
R16
CVDD1
T29
EMIFWAIT0
P4
MCMTXP3
R17
VSS
U1
VSS
P5
VSS
R18
CVDD
U2
MCMRXN0
P6
VSS
R19
VSS
U3
VSS
P7
VDDT1
R20
CVDD
U4
MCMTXP1
P8
VSS
R21
VSS
U5
VSS
P9
CVDD
R22
CVDD
U6
VDDT1
P10
VSS
R23
EMIFBE1
U7
VSS
P11
CVDD
R24
EMIFBE0
U8
CVDD
P12
VSS
R25
EMIFCE3
U9
VSS
P13
CVDD
R26
EMIFOE
U10
CVDD
P14
VSS
R27
EMIFCE1
U11
VSS
P15
CVDD
R28
EMIFCE2
U12
CVDD1
P16
VSS
R29
TDO
U13
VSS
P17
CVDD
T1
MCMRXN1
U14
CVDD1
P18
VSS
T2
MCMRXP0
U15
VSS
P19
CVDD
T3
VSS
U16
CVDD1
P20
VSS
T4
MCMTXN1
U17
VSS
P21
CVDD
T5
MCMTXP2
U18
CVDD
P22
VSS
T6
VSS
U19
VSS
P23
DVDD18
T7
VDDT1
U20
CVDD
P24
EMIFWE
T8
VSS
U21
VSS
P25
EMIFCE0
T9
CVDD
U22
CVDD
P26
EMIFRW
T10
VSS
U23
EMIFA23
P27
TDI
T11
CVDD
U24
EMIFA07
P28
TRST
T12
VSS
U25
EMIFA06
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Signal Name
Device Overview
66
TMS320C6671
Fixed and Floating-Point Digital Signal Processor
SPRS756E—March 2014
Table 2-29
Terminal Functions
— By Ball Number
(Part 13 of 21)
Table 2-29
Ball Number
Signal Name
Ball Number
U26
DVDD18
U27
EMIFA04
U28
U29
Terminal Functions
— By Ball Number
(Part 14 of 21)
Table 2-29
Terminal Functions
— By Ball Number
(Part 15 of 21)
Signal Name
Ball Number
Signal Name
W10
CVDD
Y23
DVDD18
W11
VSS
Y24
EMIFD11
EMIFA05
W12
CVDD1
Y25
EMIFD08
EMIFA02
W13
VSS
Y26
EMIFD03
V1
VSS
W14
CVDD1
Y27
EMIFD00
V2
VSS
W15
VSS
Y28
EMIFA22
V3
VSS
W16
CVDD1
Y29
EMIFA21
V4
VSS
W17
VSS
AA1
MCMTXFLCLK
V5
VDDR1
W18
CVDD
AA2
MCMTXPMCLK
V6
VSS
W19
VSS
AA3
MCMTXFLDAT
V7
VDDT1
W20
CVDD
AA4
MCMTXPMDAT
V8
VSS
W21
VSS
AA5
VSS
V9
CVDD
W22
CVDD
AA6
DVDD18
V10
VSS
W23
EMIFA20
AA7
VSS
V11
CVDD
W24
EMIFA19
AA8
CVDD
V12
VSS
W25
EMIFA18
AA9
VSS
V13
CVDD1
W26
EMIFA17
AA10
CVDD
V14
VSS
W27
EMIFA15
AA11
VSS
V15
CVDD1
W28
EMIFA14
AA12
CVDD
V16
VSS
W29
EMIFA16
AA13
VSS
V17
CVDD
Y1
MCMREFCLKOUTP
AA14
CVDD
V18
VSS
Y2
MCMCLKN
AA15
VSS
V19
CVDD
Y3
MCMRXPMCLK
AA16
CVDD
V20
VSS
Y4
MCMRXPMDAT
AA17
VSS
V21
CVDD
Y5
RSV12
AA18
CVDD
V22
VSS
Y6
VSS
AA19
VSS
V23
DVDD18
Y7
DVDD18
AA20
RSV0B
V24
EMIFA13
Y8
VSS
AA21
RSV0A
V25
EMIFA12
Y9
CVDD
AA22
CVDD
V26
EMIFA11
Y10
VSS
AA23
VSS
V27
EMIFA10
Y11
CVDD
AA24
EMIFD10
V28
EMIFA08
Y12
VSS
AA25
EMIFD07
V29
EMIFA09
Y13
CVDD
AA26
EMIFD06
W1
MCMREFCLKOUTN
Y14
VSS
AA27
EMIFD04
W2
MCMCLKP
Y15
CVDD
AA28
VSS
W3
MCMRXFLCLK
Y16
VSS
AA29
EMIFD02
W4
MCMRXFLDAT
Y17
CVDD
AB1
SPIDOUT
W5
RSV13
Y18
VSS
AB2
UARTRTS
W6
RSV14
Y19
CVDD
AB3
UARTCTS
W7
VSS
Y20
VSS
AB4
VSS
W8
CVDD
Y21
CVDD
AB5
DVDD18
W9
VSS
Y22
VSS
AB6
VSS
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Table 2-29
Terminal Functions
— By Ball Number
(Part 16 of 21)
Table 2-29
Ball Number
Signal Name
Ball Number
AB7
DVDD18
AB8
VSS
AB9
AB10
Terminal Functions
— By Ball Number
(Part 17 of 21)
Table 2-29
Terminal Functions
— By Ball Number
(Part 18 of 21)
Signal Name
Ball Number
AC20
POR
AE4
PACLKSEL
AC21
TR12
AE5
CORESEL3
VDDT2
AC22
TX12
AE6
CORESEL2
VSS
AC23
TR04
AE7
VSS
AB11
VDDT2
AC24
TR06
AE8
VSS
AB12
VSS
AC25
EMIFD15
AE9
VSS
AB13
VDDT2
AC26
EMU03
AE10
VDDR2
AB14
VSS
AC27
EMU02
AE11
VSS
AB15
VDDT2
AC28
EMU01
AE12
RSV15
AB16
VSS
AC29
EMU00
AE13
VSS
AB17
VDDT2
AD1
UARTRXD
AE14
VDDR4
AB18
VSS
AD2
SPIDIN
AE15
VSS
AB19
DVDD18
AD3
SCL
AE16
VDDR3
AB20
VSS
AD4
CORESEL1
AE17
VSS
AB21
DVDD18
AD5
AVDDA3
AE18
VDDT2
AB22
VSS
AD6
VSS
AE19
VSS
AB23
EMIFD12
AD7
VDDT2
AE20
TX15
AB24
EMIFD13
AD8
VSS
AE21
TX13
AB25
EMIFD09
AD9
VDDT2
AE22
TR10
AB26
EMIFD14
AD10
VSS
AE23
TX06
AB27
EMIFD05
AD11
VDDT2
AE24
TX00
AB28
DVDD18
AD12
VSS
AE25
TR07
AB29
EMIFD01
AD13
VDDT2
AE26
VSS
AC1
UARTTXD
AD14
VSS
AE27
EMU10
AC2
VSS
AD15
VDDT2
AE28
EMU08
AC3
DVDD18
AD16
VSS
AE29
EMU07
AC4
SDA
AD17
VDDT2
AF1
RSV22
AC5
VSS
AD18
VSS
AF2
CORESEL0
AC6
AVDDA2
AD19
RSV17
AF3
RSV20
AC7
VSS
AD20
HOUT
AF4
VSS
AC8
VDDT2
AD21
TR11
AF5
DVDD18
AC9
RSV16
AD22
TX11
AF6
VSS
AC10
VDDT2
AD23
TR02
AF7
PCIETXP0
AC11
VSS
AD24
TR03
AF8
PCIETXN0
AC12
VDDT2
AD25
TX01
AF9
VSS
AC13
VSS
AD26
EMU13
AF10
RIOTXN0
AC14
VDDT2
AD27
EMU06
AF11
RIOTXP0
AC15
VSS
AD28
EMU05
AF12
VSS
AC16
VDDT2
AD29
EMU04
AF13
RIOTXP3
AC17
VSS
AE1
SPICLK
AF14
RIOTXN3
AC18
VDDT2
AE2
BOOTCOMPLETE
AF15
VSS
AC19
VSS
AE3
SYSCLKOUT
AF16
SGMII1TXP
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Table 2-29
Terminal Functions
— By Ball Number
(Part 19 of 21)
Table 2-29
Terminal Functions
— By Ball Number
(Part 20 of 21)
Table 2-29
Terminal Functions
— By Ball Number
(Part 21 of 21)
Ball Number
Signal Name
Ball Number
Signal Name
Ball Number
AF17
SGMII1TXN
AH1
DVDD18
AJ14
RIORXP3
AF18
VSS
AH2
RSV04
AJ15
RIORXN3
AF19
RSV09
AH3
RSV25
AJ16
VSS
AF20
TX17
AH4
RSV24
AJ17
SGMII0RXP
AF21
TX10
AH5
PCIECLKN
AJ18
SGMII0RXN
AF22
VSS
AH6
VSS
AJ19
VSS
AF23
TX07
AH7
PCIERXN0
AJ20
TR15
AF24
TX05
AH8
PCIERXP0
AJ21
TR13
AF25
CLKA0
AH9
VSS
AJ22
FSB1
AF26
DVDD18
AH10
RIORXN1
AJ23
CLKA1
AF27
EMU17
AH11
RIORXP1
AJ24
TX02
AF28
EMU11
AH12
VSS
AJ25
TR01
AF29
EMU09
AH13
RIORXP2
AJ26
FSA0
AG1
SPISCS0
AH14
RIORXN2
AJ27
EMU16
AG2
SPISCS1
AH15
VSS
AJ28
DVDD18
AG3
CORECLKP
AH16
SGMII1RXP
AJ29
VSS
AG4
CORECLKN
AH17
SGMII1RXN
End of Table 2-29
AG5
PCIECLKP
AH18
VSS
AG6
SRIOSGMIICLKP
AH19
RSV08
AG7
VSS
AH20
TX16
AG8
PCIETXP1
AH21
TR16
AG9
PCIETXN1
AH22
TR14
AG10
VSS
AH23
CLKB1
AG11
RIOTXN1
AH24
TX04
AG12
RIOTXP1
AH25
TR05
AG13
VSS
AH26
TR00
AG14
RIOTXP2
AH27
EMU18
AG15
RIOTXN2
AH28
RSV01
AG16
VSS
AH29
DVDD18
AG17
SGMII0TXP
AJ1
VSS
AG18
SGMII0TXN
AJ2
DVDD18
AG19
VSS
AJ3
RSV05
AG20
TX14
AJ4
PASSCLKN
AG21
TR17
AJ5
PASSCLKP
AG22
DVDD18
AJ6
SRIOSGMIICLKN
AG23
FSA1
AJ7
VSS
AG24
TX03
AJ8
PCIERXP1
AG25
CLKB0
AJ9
PCIERXN1
AG26
FSB0
AJ10
VSS
AG27
EMU15
AJ11
RIORXN0
AG28
EMU14
AJ12
RIORXP0
AG29
EMU12
AJ13
VSS
69
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Fixed and Floating-Point Digital Signal Processor
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2.9 Development and Support
2.9.1 Development Support
In case the customer would like to develop their own features and software on the C6671 device, TI offers an
extensive line of development tools for the TMS320C6000™ DSP platform, including tools to evaluate the
performance of the processors, generate code, develop algorithm implementations, and fully integrate and debug
software and hardware modules. The tool's support documentation is electronically available within the Code
Composer Studio™ Integrated Development Environment (IDE).
The following products support development of C6000™ DSP-based applications:
• Software Development Tools:
– Code Composer Studio™ Integrated Development Environment (IDE), including Editor C/C++/Assembly
Code Generation, and Debug plus additional development tools.
– Scalable, Real-Time Foundation Software (DSP/BIOS™), which provides the basic run-time target software
needed to support any DSP application.
• Hardware Development Tools:
– Extended Development System (XDS™) Emulator (supports C6000™ DSP multiprocessor system debug)
– EVM (Evaluation Module)
2.9.2 Device Support
2.9.2.1 Device and Development-Support Tool Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all DSP devices
and support tools. Each DSP commercial family member has one of three prefixes: TMX, TMP, or TMS (e.g.,
TMX320CMH). Texas Instruments recommends two of three possible prefix designators for its support tools:
TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering
prototypes (TMX/TMDX) through fully qualified production devices/tools (TMS/TMDS).
Device development evolutionary flow:
• TMX: Experimental device that is not necessarily representative of the final device's electrical specifications
• TMP: Final silicon die that conforms to the device's electrical specifications but has not completed quality and
reliability verification
• TMS: Fully qualified production device
Support tool development evolutionary flow:
• TMDX: Development-support product that has not yet completed Texas Instruments internal qualification
testing.
• TMDS: Fully qualified development-support product
TMX and TMP devices and TMDX development-support tools are shipped with the following disclaimer:
"Developmental product is intended for internal evaluation purposes."
TMS devices and TMDS development-support tools have been characterized fully, and the quality and reliability of
the device have been demonstrated fully. TI's standard warranty applies.
Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard production
devices. Texas Instruments recommends that these devices not be used in any production system because their
expected end-use failure rate still is undefined. Only qualified production devices are to be used.
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Fixed and Floating-Point Digital Signal Processor
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TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for
example, CYP), the temperature range (for example, blank is the default case temperature range), and the device
speed range, in Megahertz (for example, blank is 1000 MHz [1 GHz]).
For device part numbers and further ordering information for TMS320C6671 in the CYP package type, see the TI
website www.ti.com or contact your TI sales representative.
Figure 2-17 provides a legend for reading the complete device name for any C66x KeyStone device.
Figure 2-17
C66x DSP Device Nomenclature (including the TMS320C6671)
TMS
320
C6671
(
) (
) CYP
(
)
(
)
PREFIX
TMX = Experimental device
TMS = Qualified device
DEVICE SPEED RANGE
Blank = 1 GHz
25 = 1.25 GHz
DEVICE FAMILY
320 = TMS320 DSP family
TEMPERATURE RANGE
Blank = 0°C to +85°C (default case temperature)
A = Extended temperature range
(-40°C to +100°C)
DEVICE
C66x DSP: C6671
SILICON REVISION
Blank = Initial Silicon 1.0
A = Silicon Revision 2.0
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PACKAGE TYPE
CYP = 841-pin plastic ball grid array, with
Pb-free die bumps and Pb-free solder balls
ENCRYPTION
Blank = Encryption NOT enabled
X = Encryption enabled
Device Overview
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TMS320C6671
Fixed and Floating-Point Digital Signal Processor
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2.10 Related Documentation from Texas Instruments
These documents describe the TMS320C6671 Fixed and Floating-Point Digital Signal Processor. Copies of these
documents are available on the Internet at www.ti.com
C66x DSP CorePac User Guide
SPRUGW0
C66x DSP CPU and Instruction Set Reference Guide
SPRUGH7
C66x DSP Cache User Guide
SPRUGY8
Chip Interrupt Controller (CIC) for KeyStone Devices User Guide
SPRUGW4
DDR3 Design Requirements for KeyStone Devices
SPRABI1
DDR3 Memory Controller for KeyStone Devices User Guide
SPRUGV8
Debug and Trace for KeyStone I Devices User Guide
SPRUGZ2
DSP Bootloader for KeyStone Devices User Guide
SPRUGY5
Emulation and Trace Headers Technical Reference
SPRU655
Enhanced Direct Memory Access 3 (EDMA3) Controller for KeyStone Devices User Guide
SPRUGS5
External Memory Interface (EMIF16) for KeyStone Devices User Guide
SPRUGZ3
General Purpose Input/Output (GPIO) for KeyStone Devices User Guide
SPRUGV1
Gigabit Ethernet (GbE) Switch Subsystem for KeyStone Devices User Guide
SPRUGV9
Hardware Design Guide for KeyStone I Devices
SPRABI2
HyperLink for KeyStone Devices User Guide
SPRUGW8
2
Inter -IC Control Bus (I C) for KeyStone Devices User Guide
SPRUGV3
Memory Protection Unit (MPU) for KeyStone Devices User Guide
SPRUGW5
Multicore Navigator for KeyStone Devices User Guide
SPRUGR9
Multicore Shared Memory Controller (MSMC) for KeyStone Devices User Guide
SPRUGW7
Network Coprocessor (NETCP) for KeyStone Devices User Guide
SPRUGZ6
Packet Accelerator (PA) for KeyStone Devices User Guide
SPRUGS4
Peripheral Component Interconnect Express (PCIe) for KeyStone Devices User Guide
SPRUGS6
Phase Locked Loop (PLL) for KeyStone Devices User Guide
SPRUGV2
Power Consumption Summary for KeyStone C66x Devices
SPRABL5
Power Sleep Controller (PSC) for KeyStone Devices User Guide
SPRUGV4
Security Accelerator (SA) for KeyStone Devices User Guide
SPRUGY6
Semaphore2 Hardware Module for KeyStone Devices User Guide
SPRUGS3
Serial Peripheral Interface (SPI) for KeyStone Devices User Guide
SPRUGP2
Serial RapidIO (SRIO) for KeyStone Devices User Guide
SPRUGW1
Telecom Serial Interface Port (TSIP) for the C66x DSP User Guide
SPRUGY4
Timer64P for KeyStone Devices User Guide
SPRUGV5
Universal Asynchronous Receiver/Transmitter (UART) for KeyStone Devices User Guide
SPRUGP1
Using Advanced Event Triggering to Debug Real-Time Problems in High Speed Embedded Microprocessor Systems
SPRA387
Using Advanced Event Triggering to Find and Fix Intermittent Real-Time Bugs
SPRA753
Using IBIS Models for Timing Analysis
SPRA839
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Fixed and Floating-Point Digital Signal Processor
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3 Device Configuration
On the TMS320C6671 device, certain device configurations like boot mode and endianess, are selected at device
power-on reset. The status of the peripherals (enabled/disabled) is determined after device power-on reset.
3.1 Device Configuration at Device Reset
Table 3-1 describes the device configuration pins. The logic level is latched at power-on reset to determine the device
configuration. The logic level on the device configuration pins can be set by using external pullup/pulldown resistors
or by using some control device (e.g., FPGA/CPLD) to intelligently drive these pins. When using a control device,
care should be taken to ensure there is no contention on the lines when the device is out of reset. The device
configuration pins are sampled during power-on reset and are driven after the reset is removed. To avoid
contention, the control device must stop driving the device configuration pins of the DSP. And when driving by a
control device, the control device must be fully powered and out of reset itself and driving the pins before the DSP
can be taken out of reset.
Also, note that most of the device configuration pins are shared with other function pins (LENDIAN/GPIO[0],
BOOTMODE[12:0]/GPIO[13:1], PCIESSMODE[1:0]/GPIO[15:14] and PCIESSEN/TIMI0), some time must be
given following the rising edge of reset in order to drive these device configuration input pins before they assume an
output state (those GPIO pins should not become outputs during boot). Another caution that must be noted is that
systems using TIMI0 (pin shared with PCIESSEN) as a clock input must assure that the clock itself is disabled from
the input until after reset is released and a control device is no longer driving that input.
Note—If a configuration pin must be routed out from the device and it is not driven (Hi-Z state), the internal
pullup/pulldown (IPU/IPD) resistor should not be relied upon. TI recommends the use of an external
pullup/pulldown resistor. For more detailed information on pullup/pulldown resistors and situations in
which external pullup/pulldown resistors are required, see Section 3.4 ‘‘Pullup/Pulldown Resistors’’ on
page 94.
Table 3-1
TMS320C6671 Device Configuration Pins
Configuration Pin
LENDIAN
(1) (2)
BOOTMODE[12:0]
PCIESSMODE[1:0]
PCIESSEN
(1) (2)
PACLKSEL(1)
(1) (2)
(1) (2)
Pin No.
IPD/IPU
H25
IPU
(1)
Functional Description
Device endian mode (LENDIAN).
0 = Device operates in big endian mode
1 = Device operates in little endian mode
IPD
J28, J29, J26, J25,
J27, J24, K27, K28,
K26, K29, L28, L29,
K25
Method of boot.
L27, K24
IPD
PCIe Subsystem mode selection.
00 = PCIe in end point mode
01 = PCIe legacy end point (support for legacy INTx)
10 = PCIe in root complex mode
11 = Reserved
L24
IPD
PCIe subsystem enable/disable.
0 = PCIE Subsystem is disabled
1 = PCIE Subsystem is enabled
AE4
IPD
Network Coprocessor (PASS PLL) input clock select.
0 = CORECLK is used as the input to PASS PLL
1 = PASSCLK is used as the input to PASS PLL
Some pins may not be used by bootloader and can be used as general purpose config
pins. See the Bootloader for the C66x DSP User Guide in ‘‘Related Documentation from
Texas Instruments’’ on page 72 for how to determine the device enumeration ID value.
End of Table 3-1
1 Internal 100-μA pulldown or pullup is provided for this terminal. In most systems, a 1-k resistor can be used to oppose the IPD/IPU. For more detailed information on
pulldown/pullup resistors and situations in which external pulldown/pullup resistors are required, see Section 3.4 ‘‘Pullup/Pulldown Resistors’’ on page 94.
2 These signal names are the secondary functions of these pins.
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3.2 Peripheral Selection After Device Reset
Several of the peripherals on the TMS320C6671 are controlled by the Power Sleep Controller (PSC). By default, the
PCIe, SRIO, and HyperLink are held in reset and clock-gated. The memories in these modules are also in a
low-leakage sleep mode. Software is required to turn these memories on. The software enables the modules (turns
on clocks and de-asserts reset) before these modules can be used.
If one of the above modules is used in the selected ROM boot mode, the ROM code will automatically enable the
module.
All other modules come up enabled by default and there is no special software sequence to enable. For more detailed
information on the PSC usage, see the Power Sleep Controller (PSC) for KeyStone Devices User Guide in ‘‘Related
Documentation from Texas Instruments’’ on page 72.
3.3 Device State Control Registers
The TMS320C6671 device has a set of registers that are used to provide the status or configure certain parts of its
peripherals. These registers are shown in Table 3-2.
Table 3-2
Device State Control Registers (Part 1 of 4)
Address Start
Address End
Size
Field
0x02620000
0x02620007
8B
Reserved
0x02620008
0x02620017
16B
Reserved
0x02620018
0x0262001B
4B
JTAGID
0x0262001C
0x0262001F
4B
Reserved
0x02620020
0x02620023
4B
DEVSTAT
0x02620024
0x02620037
20B
Reserved
0x02620038
0x0262003B
4B
KICK0
0x0262003C
0x0262003F
4B
KICK1
0x02620040
0x02620043
4B
DSP_BOOT_ADDR0
0x02620044
0x02620047
4B
Reserved
0x02620048
0x0262004B
4B
Reserved
0x0262004C
0x0262004F
4B
Reserved
0x02620050
0x02620053
4B
Reserved
0x02620054
0x02620057
4B
Reserved
0x02620058
0x0262005B
4B
Reserved
0x0262005C
0x0262005F
4B
Reserved
0x02620060
0x026200DF
128B
Reserved
0x026200E0
0x0262010F
48B
Reserved
0x02620110
0x02620117
8B
MACID
0x02620118
0x0262012F
24B
Reserved
0x02620130
0x02620133
4B
LRSTNMIPINSTAT_CLR
See section 3.3.7
See section 3.3.9
0x02620134
0x02620137
4B
RESET_STAT_CLR
0x02620138
0x0262013B
4B
Reserved
0x0262013C
0x0262013F
4B
BOOTCOMPLETE
0x02620140
0x02620143
4B
Reserved
Description
See section 3.3.3
See section 3.3.1
See section 3.3.4
The boot address for C66x DSP CorePac0, see section 3.3.5
See section 7.22 ‘‘Gigabit Ethernet (GbE) Switch Subsystem’’ on
page 218
See section 3.3.10
0x02620144
0x02620147
4B
RESET_STAT
See section 3.3.8
0x02620148
0x0262014B
4B
LRSTNMIPINSTAT
See section 3.3.6
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Fixed and Floating-Point Digital Signal Processor
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Table 3-2
Device State Control Registers (Part 2 of 4)
Address Start
Address End
Size
Field
Description
0x0262014C
0x0262014F
4B
DEVCFG
See section 3.3.2
0x02620150
0x02620153
4B
PWRSTATECTL
See section 3.3.11
0x02620154
0x02620157
4B
SRIO_SERDES_STS
See ‘‘Related Documentation from Texas Instruments’’ on page 72
0x02620158
0x0262015B
4B
SMGII_SERDES_STS
0x0262015C
0x0262015F
4B
PCIE_SERDES_STS
0x02620160
0x02620163
4B
HYPERLINK_SERDES_STS
0x02620164
0x02620167
4B
Reserved
0x02620168
0x0262016B
4B
Reserved
0x0262016C
0x0262017F
20B
Reserved
0x02620180
0x02620183
4B
Reserved
0x02620184
0x0262018F
12B
Reserved
0x02620190
0x02620193
4B
Reserved
0x02620194
0x02620197
4B
Reserved
0x02620198
0x0262019B
4B
Reserved
0x0262019C
0x0262019F
4B
Reserved
0x026201A0
0x026201A3
4B
Reserved
0x026201A4
0x026201A7
4B
Reserved
0x026201A8
0x026201AB
4B
Reserved
0x026201AC
0x026201AF
4B
Reserved
0x026201B0
0x026201B3
4B
Reserved
0x026201B4
0x026201B7
4B
Reserved
0x026201B8
0x026201BB
4B
Reserved
0x026201BC
0x026201BF
4B
Reserved
0x026201C0
0x026201C3
4B
Reserved
0x026201C4
0x026201C7
4B
Reserved
0x026201C8
0x026201CB
4B
Reserved
0x026201CC
0x026201CF
4B
Reserved
0x026201D0
0x026201FF
48B
Reserved
0x02620200
0x02620203
4B
NMIGR0
0x02620204
0x02620207
4B
Reserved
0x02620208
0x0262020B
4B
Reserved
0x0262020C
0x0262020F
4B
Reserved
0x02620210
0x02620213
4B
Reserved
0x02620214
0x02620217
4B
Reserved
0x02620218
0x0262021B
4B
Reserved
0x0262021C
0x0262021F
4B
Reserved
0x02620220
0x0262023F
32B
Reserved
0x02620240
0x02620243
4B
IPCGR0
0x02620244
0x02620247
4B
Reserved
0x02620248
0x0262024B
4B
Reserved
0x0262024C
0x0262024F
4B
Reserved
0x02620250
0x02620253
4B
Reserved
0x02620254
0x02620257
4B
Reserved
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See section 3.3.12
See section 3.3.13
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Table 3-2
Device State Control Registers (Part 3 of 4)
Address Start
Address End
Size
Field
0x02620258
0x0262025B
4B
Reserved
0x0262025C
0x0262025F
4B
Reserved
0x02620260
0x0262027B
28B
Reserved
0x0262027C
0x0262027F
4B
IPCGRH
See section 3.3.15
See section 3.3.14
0x02620280
0x02620283
4B
IPCAR0
0x02620284
0x02620287
4B
Reserved
0x02620288
0x0262028B
4B
Reserved
0x0262028C
0x0262028F
4B
Reserved
0x02620290
0x02620293
4B
Reserved
0x02620294
0x02620297
4B
Reserved
0x02620298
0x0262029B
4B
Reserved
0x0262029C
0x0262029F
4B
Reserved
0x026202A0
0x026202BB
28B
Reserved
0x026202BC
0x026202BF
4B
IPCARH
0x026202C0
0x026202FF
64B
Reserved
Description
See section 3.3.16
0x02620300
0x02620303
4B
TINPSEL
See section 3.3.17
0x02620304
0x02620307
4B
TOUTPSEL
See section 3.3.18
See section 3.3.19
0x02620308
0x0262030B
4B
RSTMUX0
0x0262030C
0x0262030F
4B
Reserved
0x02620310
0x02620313
4B
Reserved
0x02620314
0x02620317
4B
Reserved
0x02620318
0x0262031B
4B
Reserved
0x0262031C
0x0262031F
4B
Reserved
0x02620320
0x02620323
4B
Reserved
0x02620324
0x02620327
4B
Reserved
0x02620328
0x0262032B
4B
MAINPLLCTL0
0x0262032C
0x0262032F
4B
MAINPLLCTL1
0x02620330
0x02620333
4B
DDR3PLLCTL0
0x02620334
0x02620337
4B
DDR3PLLCTL1
0x02620338
0x0262033B
4B
PASSPLLCTL0
0x0262033C
0x0262033F
4B
PASSPLLCTL1
76
Device Configuration
See section 7.6 ‘‘Main PLL and PLL Controller’’ on page 137
See section 7.7 ‘‘DD3 PLL’’ on page 150
See section 7.8 ‘‘PASS PLL’’ on page 153
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Table 3-2
Device State Control Registers (Part 4 of 4)
Address Start
Address End
Size
Field
Description
0x02620340
0x02620343
4B
SGMII_SERDES_CFGPLL
See ‘‘Related Documentation from Texas Instruments’’ on page 72
0x02620344
0x02620347
4B
SGMII_SERDES_CFGRX0
0x02620348
0x0262034B
4B
SGMII_SERDES_CFGTX0
0x0262034C
0x0262034F
4B
SGMII_SERDES_CFGRX1
0x02620350
0x02620353
4B
SGMII_SERDES_CFGTX1
0x02620354
0x02620357
4B
Reserved
0x02620358
0x0262035B
4B
PCIE_SERDES_CFGPLL
0x0262035C
0x0262035F
4B
Reserved
0x02620360
0x02620363
4B
SRIO_SERDES_CFGPLL
0x02620364
0x02620367
4B
SRIO_SERDES_CFGRX0
0x02620368
0x0262036B
4B
SRIO_SERDES_CFGTX0
0x0262036C
0x0262036F
4B
SRIO_SERDES_CFGRX1
0x02620370
0x02620373
4B
SRIO_SERDES_CFGTX1
0x02620374
0x02620377
4B
SRIO_SERDES_CFGRX2
0x02620378
0x0262037B
4B
SRIO_SERDES_CFGTX2
0x0262037C
0x0262037F
4B
SRIO_SERDES_CFGRX3
0x02620380
0x02620383
4B
SRIO_SERDES_CFGTX3
0x02620384
0x0262038B
8B
Reserved
0x0262038C
0x0262038F
4B
DSP_SUSP_CTL
0x02620390
0x026203B3
36B
Reserved
0x026203B4
0x026203B7
4B
HYPERLINK_SERDES_CFGPLL
0x026203B8
0x026203BB
4B
HYPERLINK_SERDES_CFGRX0
0x026203BC
0x026203BF
4B
HYPERLINK_SERDES_CFGTX0
0x026203C0
0x026203C3
4B
HYPERLINK_SERDES_CFGRX1
0x026203C4
0x026203C7
4B
HYPERLINK_SERDES_CFGTX1
0x026203C8
0x026203CB
4B
HYPERLINK_SERDES_CFGRX2
0x026203CC
0x026203CF
4B
HYPERLINK_SERDES_CFGTX2
0x026203D0
0x026203D3
4B
HYPERLINK_SERDES_CFGRX3
0x026203D4
0x026203D7
4B
HYPERLINK_SERDES_CFGTX3
0x026203D8
0x026203DB
4B
Reserved
0x026203DC
0x026203F7
28B
Reserved
0x026203F8
0x026203FB
4B
DEVSPEED
0x026203FC
0x026203FF
4B
Reserved
0x02620400
0x02620403
4B
CHIP_MISC_CTL
0x02620404
0x02620467
100B
Reserved
See section 3.3.20
See ‘‘Related Documentation from Texas Instruments’’ on page 72
See section 3.3.21
See section 3.3.22
End of Table 3-2
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3.3.1 Device Status Register
The Device Status Register depicts the device configuration selected upon a power-on reset by either the POR or
RESETFULL pin. Once set, these bits will remain set until the next power-on reset. The Device Status Register is
shown in Figure 3-1 and described in Table 3-3.
Figure 3-1
Device Status Register
31
18
Reserved
17
16
PACLKSEL
PCIESSEN
PCIESSMODE[1:0
BOOTMODE[12:0]
LENDIAN
R-x
R/W -xx
R/W-xxxxxxxxxxxx
R-x (1)
R-0
15
14
13
1
0
Legend: R = Read only; RW = Read/Write; -n = value after reset
1 x indicates the bootstrap value latched via the external pin
Table 3-3
Device Status Register Field Descriptions
Bit
Field
Description
31-18
Reserved
Reserved. Read only, writes have no effect.
17
PACLKSEL
PA Clock select to select the reference clock for PA Sub-System PLL
0 = Selects CORECLK(P/N)
1 = Selects PASSCLK(P/N)
16
PCIESSEN
PCIe module enable
0 = PCIe module disabled
1 = PCIe module enabled
15-14
PCIESSMODE[1:0]
PCIe Mode selection pins
00b = PCIe in end-point mode
01b = PCIe in legacy end-point mode (support for legacy INTx)
10b = PCIe in root complex mode
11b = Reserved
13-1
BOOTMODE[12:0]
Determines the bootmode configured for the device. For more information on bootmode, see Section 2.5 ‘‘Boot Modes
Supported and PLL Settings’’ on page 24 and see the DSP Bootloader for KeyStone Devices User Guide in 2.10 ‘‘Related
Documentation from Texas Instruments’’ on page 72
0
LENDIAN
Device endian mode (LENDIAN) — Shows the status of whether the system is operating in big endian mode or little
endian mode.
0 = System is operating in big endian mode
1 = System is operating in little endian mode
End of Table 3-3
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3.3.2 Device Configuration Register (DEVCFG)
The Device Configuration Register is one-time writeable through software. The register is reset on all hard resets
and is locked after the first write. The Device Configuration Register is shown in Figure 3-2 and described in
Table 3-4.
Figure 3-2
Device Configuration Register (DEVCFG)
31
1
0
Reserved
SYSCLKOUTEN
R-0
R/W-1
Legend: R = Read only; RW = Read/Write; -n = value after reset
Table 3-4
Device Configuration Register (DEVCFG) Field Descriptions
Bit
Field
Description
31-1
Reserved
Reserved. Read only, writes have no effect.
0
SYSCLKOUTEN
SYSCLKOUT Enable
0 = No clock output
1 = Clock output enabled (default)
End of Table 3-4
3.3.3 JTAG ID Register (JTAGID) Description
The JTAG ID register is a read-only register that identifies to the customer the JTAG/Device ID. For the device, the
JTAG ID register resides at address location 0x0262 0018. The JTAG ID Register is shown in Figure 3-3 and
described in Table 3-5.
Figure 3-3
JTAG ID Register (JTAGID)
31
28
27
12
11
1
0
VARIANT
PART NUMBER
MANUFACTURER
LSB
R-xxxxb
R-0000 0000 1001 1110b
0000 0010 111b
R-1
Legend: RW = Read/Write; R = Read only; -n = value after reset
Table 3-5
JTAG ID Register (JTAGID) Field Descriptions
Bit
Field
Value
Description
31-28
VARIANT
xxxxb
Variant (4-bit) value.
27-12
PART NUMBER
0000 0000 1001 1110b
Part number for boundary scan
11-1
MANUFACTURER
0000 0010 111b
Manufacturer
0
LSB
1b
This bit is read as a 1 for TMS320C6671
End of Table 3-5
Note—The value of the VARIANT and PART NUMBER fields depend on the silicon revision being used.
See the Silicon Errata for details.
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3.3.4 Kicker Mechanism Register (KICK0 and KICK1)
The Bootcfg module contains a kicker mechanism to prevent any spurious writes from changing any of the Bootcfg
MMR values. When the kicker is locked (which it is initially after power on reset) none of the Bootcfg MMRs are
writable (they are only readable). This mechanism requires two MMR writes to the KICK0 and KICK1 registers with
exact data values before the kicker lock mechanism is un-locked. See Table 3-2 ‘‘Device State Control Registers’’ on
page 74 for the address location. Once released then all the Bootcfg MMRs having “write” permissions are writable
(the read-only MMRs are still read only). The first KICK0 data is 0x83e70b13. The second KICK1 data is 0x95a4f1e0.
Writing any other data value to either of these kick MMRs will lock the kicker mechanism and block any writes to
Bootcfg MMRs.
The kicker mechanism is unlocked by the ROM code. Do not write any other different values afterward to these
registers because that will lock the kicker mechanism and block any writes to Bootcfg registers.
3.3.5 DSP Boot Address Register (DSP_BOOT_ADDRn)
The DSP_BOOT_ADDRn register stores the initial boot fetch address of CorePac_n (n = core number). The fetch
address is the public ROM base address (for any boot mode) by default. DSP_BOOT_ADDRn register access should
be permitted to any master or emulator when the device is non-secure. CorePac will boot from that address when a
reset is performed. The DSP_BOOT_ADDRn register is shown in Figure 3-4 and described in Table 3-6.
Figure 3-4
DSP BOOT Address Register (DSP_BOOT_ADDRn)
31
10
9
0
DSP_BOOT_ADDR
Reserved
RW-0010000010110000000000
R-0
Legend: R = Read only; RW = Read/Write; -n = value after reset
Table 3-6
DSP BOOT Address Register (DSP_BOOT_ADDRn) Field Descriptions
Bit
Field
Description
31-10
DSP_BOOT_ADDR
Boot address of CorePac. CorePac will boot from that address when a reset is performed.
9-0
Reserved
The reset value is 22 MSBs of ROM base address = 0x20B00000.
Reserved
End of Table 3-6
3.3.6 LRESETNMI PIN Status Register (LRSTNMIPINSTAT)
The LRSTNMIPINSTAT Register is created in Boot Configuration to latch the status of LRESET and NMI based on
CORESEL. The LRESETNMI PIN Status Register is shownin Figure 3-5 and described in Table 3-7.
Figure 3-5
LRESETNMI PIN Status Register (LRSTNMIPINSTAT)
31
9
8
7
1
0
Reserved
NMI0
Reserved
LR0
R, +0000 0000 0000 0000 0000 000
R-0
R, +000 0000
R-0
Legend: R = Read only; -n = value after reset;
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Table 3-7
LRESETNMI PIN Status Register (LRSTNMIPINSTAT) Field Descriptions
Bit
Field
Description
31-17
Reserved
Reserved
16
NMI0
CorePac0 in NMI
15-1
Reserved
Reserved
0
LR0
CorePac0 in Local Reset
End of Table 3-7
3.3.7 LRESETNMI PIN Status Clear Register (LRSTNMIPINSTAT_CLR)
The LRSTNMIPINSTAT_CLR Register is used to clear the status of LRESET and NMI based on CORESEL. The
LRESETNMI PIN Status Clear Register is shownin Figure 3-6 and described in Table 3-8
Figure 3-6
LRESETNMI PIN Status Clear Register (LRSTNMIPINSTAT_CLR)
31
9
8
7
1
0
Reserved
NMI0
Reserved
LR0
R, +0000 0000 0000 0000 0000 000
WC,+0
R, +0000 000
WC,+0
Legend: R = Read only; -n = value after reset; WC = Write 1 to Clear
Table 3-8
LRESETNMI PIN Status Clear Register (LRSTNMIPINSTAT_CLR) Field Descriptions
Bit
Field
Description
31-9
Reserved
Reserved
8
NMI0
CorePac0 in NMI clear
7-1
Reserved
Reserved
0
LR0
CorePac0 in local reset clear
End of Table 3-8
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3.3.8 Reset Status Register (RESET_STAT)
The reset status register (RESET_STAT) captures the status of local reset (LRx) for each of the cores and also the
global device reset (GR). Software can use this information to take different device initialization steps, if desired.
• In case of local reset: The LRx bits are written as 1 and GR bit is written as 0 only when the CorePac receives
a local reset without receiving a global reset.
• In case of global reset: The LRx bits are written as 0 and GR bit is written as 1 only when a global reset is
asserted.
The Reset Status Register is shown in Figure 3-7 and described in Table 3-9.
Figure 3-7
31
Reset Status Register (RESET_STAT)
30
1
0
GR
Reserved
LR0
R, +1
R, + 000 0000 0000 0000 0000 0000
R,+0
Legend: R = Read only; -n = value after reset
Table 3-9
Reset Status Register (RESET_STAT) Field Descriptions
Bit
Field
Description
31
GR
Global reset status
0 = Device has not received a global reset.
1 = Device received a global reset.
30-1
Reserved
Reserved.
0
LR0
CorePac0 reset status
0 = CorePac0 has not received a local reset.
1 = CorePac0 received a local reset.
End of Table 3-9
3.3.9 Reset Status Clear Register (RESET_STAT_CLR)
The RESET_STAT bits can be cleared by writing 1 to the corresponding bit in the RESET_STAT_CLR register. The
Reset Status Clear Register is shown in Figure 3-8 and described in Table 3-10.
Figure 3-8
31
Reset Status Clear Register (RESET_STAT_CLR)
30
1
0
GR
Reserved
LR0
RW, +0
R, + 000 0000 0000 0000 0000 0000
RW,+0
Legend: R = Read only; RW = Read/Write; -n = value after reset
Table 3-10
Reset Status Clear Register (RESET_STAT_CLR) Field Descriptions (Part 1 of 2)
Bit
Field
Description
31
GR
Global reset clear bit
0 = Writing a 0 has no effect.
1 = Writing a 1 to the GR bit clears the corresponding bit in the RESET_STAT register.
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Table 3-10
Reset Status Clear Register (RESET_STAT_CLR) Field Descriptions (Part 2 of 2)
Bit
Field
Description
30-1
Reserved
Reserved.
0
LR0
CorePac0 reset clear bit
0 = Writing a 0 has no effect.
1 = Writing a 1 to the LR0 bit clears the corresponding bit in the RESET_STAT register.
End of Table 3-10
3.3.10 Boot Complete Register (BOOTCOMPLETE)
The BOOTCOMPLETE register controls the BOOTCOMPLETE pin status. The purpose is to indicate the
completion of the ROM booting process. The Boot Complete Register is shown in Figure 3-9 and described in
Table 3-11.
Figure 3-9
Boot Complete Register (BOOTCOMPLETE)
31
1
0
Reserved
BC0
R, + 0000 0000 0000 0000 0000 0000
RW,+0
Legend: R = Read only; RW = Read/Write; -n = value after reset
Table 3-11
Boot Complete Register (BOOTCOMPLETE) Field Descriptions
Bit
Field
Description
31-1
Reserved
Reserved.
0
BC0
CorePac0 boot status
0 = CorePac0 boot NOT complete
1 = CorePac0 boot complete
End of Table 3-11
The BCx bit indicates the boot complete status of the corresponding core. All BCx bits will be sticky bits — that is
they can be set only once by the software after device reset and they will be cleared to 0 on all device resets.
Boot ROM code will be implemented such that each core will set its corresponding BCx bit immediately before
branching to the predefined location in memory.
3.3.11 Power State Control Register (PWRSTATECTL)
The PWRSTATECTL register is controlled by the software to indicate the power-saving mode. ROM code reads this
register to differentiate between the various power saving modes. This register is cleared only by POR and will
survive all other device resets. See the Hardware Design Guide for KeyStone I Devices in ‘‘Related Documentation
from Texas Instruments’’ on page 72 for more information. The Power State Control Register is shown in
Figure 3-10 and described in Table 3-12.
Figure 3-10
Power State Control Register (PWRSTATECTL)
31
3
2
1
0
GENERAL_PURPOSE
HIBERNATION_MODE
HIBERNATION
STANDBY
RW-0000 0000 0000 0000 0000 0000 0000 0
RW-0
RW-0
RW-0
Legend: RW = Read/Write; -n = value after reset
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Table 3-12
Power State Control Register (PWRSTATECTL) Field Descriptions
Bit
Field
Description
31-3
GENERAL_PURPOSE
Used to provide a start address for execution out of the hibernation modes. See the DSP Bootloader for KeyStone
Devices User Guide in ‘‘Related Documentation from Texas Instruments’’ on page 72.
2
HIBERNATION_MODE
Indicates whether the device is in hibernation mode 1 or mode 2.
0 = Hibernation mode 1
1 = Hibernation mode 2
1
HIBERNATION
Indicates whether the device is in hibernation mode or not.
0 = Not in hibernation mode
1 = Hibernation mode
0
STANDBY
Indicates whether the device is in standby mode or not.
0 = Not in standby mode
1 = Standby mode
End of Table 3-12
3.3.12 NMI Event Generation to CorePac Register (NMIGRx)
NMIGRx registers are used for generating NMI events to the corresponding CorePac. The C6671 has
one NMIGRx register (NMIGR0). The NMIGR0 register generates an NMI event to CorePac0. Writing a 1 to the
NMIG field generates a NMI pulse. Writing a 0 has no effect and reads return 0 and have no other effect. The NMI
Even Generation to CorePac Register is shown in Figure 3-11 and described in Table 3-13.
Figure 3-11
NMI Generation Register (NMIGRx)
31
1
0
Reserved
NMIG
R-0000 0000 0000 0000 0000 0000 0000 000
RW-0
Legend: RW = Read/Write; -n = value after reset
Table 3-13
NMI Generation Register (NMIGRx) Field Descriptions
Bit
Field
Description
31-1
Reserved
Reserved
0
NMIG
NMI pulse generation.
Reads return 0
Writes:
0 = No effect
1 = Creates NMI pulse to the corresponding CorePac — CorePac0 for NMIGR0, etc.
End of Table 3-13
3.3.13 IPC Generation Registers (IPCGRx)
IPCGRx are the IPC interrupt generation registers to facilitate inter CorePac interrupts.
The C6671 has one IPCGRx register (IPCGR0). This register can be used by external hosts or CorePacs to generate
interrupts to other CorePacs. A write of 1 to IPCG field of IPCGRx register will generate an interrupt pulse to
CorePac0.
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These registers also provide a Source ID facility by which up to 28 different sources of interrupts can be identified.
Allocation of source bits to source processor and meaning is entirely based on software convention. The register field
descriptions are given in the following tables. Virtually anything can be a source for these registers as this is
completely controlled by software. Any master that has access to BOOTCFG module space can write to these
registers. The IPC Generation Register is shown in Figure 3-12 and described in Table 3-14.
Figure 3-12
IPC Generation (IPCGRx) Registers
31
30
29
28
SRCS27
SRCS26
SRCS25
SRCS24
RW-0
RW-0
RW-0
RW-0
27
8
7
6
5
4
3
1
0
SRCS23 – SRCS4
SRCS3
SRCS2
SRCS1
SRCS0
Reserved
IPCG
RW-0 (per bit field)
RW-0
RW-0
RW-0
RW-0
R-000
RW-0
Legend: R = Read only; RW = Read/Write; -n = value after reset
Table 3-14
IPC Generation Registers (IPCGRx) Field Descriptions
Bit
Field
Description
31-4
SRCSx
Interrupt source indication.
Reads return current value of internal register bit.
Writes:
0 = No effect
1 = Sets both SRCSx and the corresponding SRCCx.
3-1
Reserved
Reserved
0
IPCG
Inter-DSP interrupt generation.
Reads return 0.
Writes:
0 = No effect
1 = Creates an Inter-DSP interrupt.
End of Table 3-14
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3.3.14 IPC Acknowledgement Registers (IPCARx)
IPCARx are the IPC interrupt-acknowledgement registers to facilitate inter-CorePac core interrupts.
The C6671 has one IPCARx register (IPCAR0). This register also provides a Source ID facility by which up to 28
different sources of interrupts can be identified. Allocation of source bits to source processor and meaning is entirely
based on software convention. The register field descriptions are shown in the following tables. Virtually anything
can be a source for these registers as this is completely controlled by software. Any master that has access to
BOOTCFG module space can write to these registers. The IPC Acknowledgement Register is shown in Figure 3-13
and described in Table 3-15.
Figure 3-13
IPC Acknowledgement (IPCARx) Registers
31
30
29
28
SRCC27
SRCC26
SRCC25
SRCC24
RW-0
RW-0
RW-0
RW-0
27
8
7
6
5
4
3
0
SRCC23 – SRCC4
SRCC3
SRCC2
SRCC1
SRCC0
Reserved
RW-0 (per bit field)
RW-0
RW-0
RW-0
RW-0
R-0000
Legend: R = Read only; RW = Read/Write; -n = value after reset
Table 3-15
IPC Acknowledgement Registers (IPCARx) Field Descriptions
Bit
Field
Description
31-4
SRCCx
Interrupt source acknowledgement.
Reads return current value of internal register bit.
Writes:
0 = No effect
1 = Clears both SRCCx and the corresponding SRCSx
3-0
Reserved
Reserved
End of Table 3-15
3.3.15 IPC Generation Host Register (IPCGRH)
The IPCGRH register facilitates interrupts to external hosts. Operation and use of the IPCGRH register is the same
as for other IPCGR registers. The interrupt output pulse created by the IPCGRH register appears on device pin
HOUT.
The host interrupt output pulse is stretched so that it is asserted for four bootcfg clock (CPU/6) cycles followed by a
deassertion of four bootcfg clock cycles. Generating the pulse results in a pulse-blocking window that is eight
CPU/6-cycles long. Back to back writes to the IPCRGH register with the IPCG bit (bit 0) set, generates only one pulse
if the back-to-back writes to IPCGRH are less than the eight CPU/6 cycle window -- the pulse blocking window. In
order to generate back-to-back pulses, the back-to-back writes to the IPCGRH register must be greater than eight
CPU/6 cycle window. The IPC Generation Host Register is shown in Figure 3-14 and described in Table 3-16.
Figure 3-14
IPC Generation (IPCGRH) Registers
31
30
29
28
SRCS27
SRCS26
SRCS25
SRCS24
RW-0
RW-0
RW-0
RW-0
27
8
7
6
5
4
3
1
0
SRCS23 – SRCS4
SRCS3
SRCS2
SRCS1
SRCS0
Reserved
IPCG
RW-0 (per bit field)
RW-0
RW-0
RW-0
RW-0
R-000
RW-0
Legend: R = Read only; RW = Read/Write; -n = value after reset
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Table 3-16
IPC Generation Registers (IPCGRH) Field Descriptions
Bit
Field
Description
31-4
SRCSx
Interrupt source indication.
Reads return current value of internal register bit.
Writes:
0 = No effect
1 = Sets both SRCSx and the corresponding SRCCx.
3-1
Reserved
Reserved
0
IPCG
Host interrupt generation.
Reads return 0.
Writes:
0 = No effect
1 = Creates an interrupt pulse on device pin (host interrupt/event output in HOUT pin)
End of Table 3-16
3.3.16 IPC Acknowledgement Host Register (IPCARH)
IPCARH registers are provided to facilitate host DSP interrupt. Operation and use of IPCARH is the same as
other IPCAR registers. The IPC Acknowledgement Host Register is shown in Figure 3-15 and described in
Table 3-17.
Figure 3-15
IPC Acknowledgement Register (IPCARH)
31
30
29
28
SRCC27
SRCC26
SRCC25
SRCC24
RW-0
RW-0
RW-0
RW-0
27
8
7
6
5
4
3
0
SRCC23 – SRCC4
SRCC3
SRCC2
SRCC1
SRCC0
Reserved
RW-0 (per bit field)
RW-0
RW-0
RW-0
RW-0
R-0000
Legend: R = Read only; RW = Read/Write; -n = value after reset
Table 3-17
IPC Acknowledgement Register (IPCARH) Field Descriptions
Bit
Field
Description
31-4
SRCCx
Interrupt source acknowledgement.
Reads return current value of internal register bit.
Writes:
0 = No effect
1 = Clears both SRCCx and the corresponding SRCSx
3-0
Reserved
Reserved
End of Table 3-17
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3.3.17 Timer Input Selection Register (TINPSEL)
Timer input selection is handled within the control register TINPSEL. The Timer Input Selection Register is shown
in Figure 3-16 and described in Table 3-18. Timer 1~7 are reserved.
Figure 3-16
31
Timer Input Selection Register (TINPSEL)
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
TINPHS TINPLS TINPHS TINPLS TINPHS TINPLS TINPHS TINPLS TINPHS TINPLS TINPHS TINPLS TINPHS TINPLS TINPHS TINPLS
EL15
EL15
EL14
EL14
EL13
EL13
EL12
EL12
EL11
EL11
EL10
EL10
EL9
EL9
EL8
EL8
RW, +1
RW, +0
RW, +1
RW, +0
RW, +1
RW, +0
RW, +1
RW, +0
RW, +1
RW, +0
RW, +1
RW, +0
RW, +1
RW, +0
RW, +1
RW, +0
2
1
0
spacer
15
Reserved
R, +0
TINPHS TINPLS
EL0
EL0
RW, +1
RW, +0
Legend: R = Read only; RW = Read/Write; -n = value after reset
Table 3-18
Timer Input Selection Field Description (TINPSEL) (Part 1 of 2)
Bit
Field
Description
31
TINPHSEL15
Input select for TIMER15 high.
0 = TIMI0
1 = TIMI1
30
TINPLSEL15
Input select for TIMER15 low.
0 = TIMI0
1 = TIMI1
29
TINPHSEL14
Input select for TIMER14 high.
0 = TIMI0
1 = TIMI1
28
TINPLSEL14
Input select for TIMER14 low.
0 = TIMI0
1 = TIMI1
27
TINPHSEL13
Input select for TIMER13 high.
0 = TIMI0
1 = TIMI1
26
TINPLSEL13
Input select for TIMER13 low.
0 = TIMI0
1 = TIMI1
25
TINPHSEL12
Input select for TIMER12 high.
0 = TIMI0
1 = TIMI1
24
TINPLSEL12
Input select for TIMER12 low.
0 = TIMI0
1 = TIMI1
23
TINPHSEL11
Input select for TIMER11 high.
0 = TIMI0
1 = TIMI1
22
TINPLSEL11
Input select for TIMER11 low.
0 = TIMI0
1 = TIMI1
21
TINPHSEL10
Input select for TIMER10 high.
0 = TIMI0
1 = TIMI1
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Table 3-18
Timer Input Selection Field Description (TINPSEL) (Part 2 of 2)
Bit
Field
Description
20
TINPLSEL10
Input select for TIMER10 low.
0 = TIMI0
1 = TIMI1
19
TINPHSEL9
Input select for TIMER9 high.
0 = TIMI0
1 = TIMI1
18
TINPLSEL9
Input select for TIMER9 low.
0 = TIMI0
1 = TIMI1
17
TINPHSEL8
Input select for TIMER8 high.
0 = TIMI0
1 = TIMI1
16
TINPLSEL8
Input select for TIMER8 low.
0 = TIMI0
1 = TIMI1
15-2
Reserved
1
TINPHSEL0
Input select for TIMER0 high.
0 = TIMI0
1 = TIMI1
Reserved
0
TINPLSEL0
Input select for TIMER0 low.
0 = TIMI0
1 = TIMI1
End of Table 3-18
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3.3.18 Timer Output Selection Register (TOUTPSEL)
The timer output selection is handled within the control register TOUTSEL. The Timer Output Selection Register
is shown in Figure 3-17 and described in Table 3-19.
Figure 3-17
Timer Output Selection Register (TOUTPSEL)
31
10
9
5
4
0
Reserved
TOUTPSEL1
TOUTPSEL0
R-000000000000000000000000
RW-00001
RW-00000
Legend: R = Read only; RW = Read/Write; -n = value after reset
Table 3-19
Bit
Timer Output Selection Register (TOUTPSEL) Field Description
Field
Description
31-10
Reserved
Reserved
9-5
TOUTPSEL1
Output select for TIMO1
00000: TOUTL0
00001: TOUTH0
00010 to 01111: Reserved
10000: TOUTL8
10001: TOUTH8
10010: TOUTL9
10011: TOUTH9
10100: TOUTL10
10101: TOUTH10
10110: TOUTL11
10111: TOUTH11
11000: TOUTL12
11001: TOUTH12
11010: TOUTL13
11011: TOUTH13
11100: TOUTL14
11101: TOUTH14
11110: TOUTL15
11111: TOUTH15
4-0
TOUTPSEL0
Output select for TIMO0
00000: TOUTL0
00001: TOUTH0
00010 to 01111: Reserved
10000: TOUTL8
10001: TOUTH8
10010: TOUTL9
10011: TOUTH9
10100: TOUTL10
10101: TOUTH10
10110: TOUTL11
10111: TOUTH11
11000: TOUTL12
11001: TOUTH12
11010: TOUTL13
11011: TOUTH13
11100: TOUTL14
11101: TOUTH14
11110: TOUTL15
11111: TOUTH15
End of Table 3-19
3.3.19 Reset Mux Register (RSTMUXx)
The software controls the Reset Mux block through the reset multiplex register (RSTMUX0). This register is located
in Bootcfg memory space. The Reset Mux Register is shown in Figure 3-18 and described in Table 3-20.
Figure 3-18
Reset Mux Register (RSTMUXx)
31
10
9
8
7
5
4
3
1
0
Reserved
EVTSTATCLR
Reserved
DELAY
EVTSTAT
OMODE
LOCK
R-0000 0000 0000 0000 0000 00
RC-0
R-0
RW-100
R-0
RW-000
RW-0
Legend: R = Read only; RW = Read/Write; -n = value after reset; RC = Read only and write 1 to clear
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Table 3-20
Reset Mux Register (RSTMUXx) Field Descriptions
Bit
Field
Description
31-10
Reserved
Reserved
9
EVTSTATCLR
Clear event status
0 = Writing 0 has no effect
1 = Writing 1 to this bit clears the EVTSTAT bit
8
Reserved
Reserved
7-5
DELAY
Delay cycles between NMI & local reset
000b = 256 CPU/6 cycles delay between NMI & local reset, when OMODE = 100b
001b = 512 CPU/6 cycles delay between NMI & local reset, when OMODE=100b
010b = 1024 CPU/6 cycles delay between NMI & local reset, when OMODE=100b
011b = 2048 CPU/6 cycles delay between NMI & local reset, when OMODE=100b
100b = 4096 CPU/6 cycles delay between NMI & local reset, when OMODE=100b (Default)
101b = 8192 CPU/6 cycles delay between NMI & local reset, when OMODE=100b
110b = 16384 CPU/6 cycles delay between NMI & local reset, when OMODE=100b
111b = 32768 CPU/6 cycles delay between NMI & local reset, when OMODE=100b
4
EVTSTAT
Event status.
0 = No event received (Default)
1 = WD timer event received by Reset Mux block
3-1
OMODE
Timer event operation mode
000b = WD timer event input to the reset mux block does not cause any output event (default)
001b = Reserved
010b = WD timer event input to the reset mux block causes local reset input to CorePac
011b = WD timer event input to the reset mux block causes NMI input to CorePac
100b = WD timer event input to the reset mux block causes NMI input followed by local reset input to CorePac. Delay
between NMI and local reset is set in DELAY bit field.
101b = WD timer event input to the reset mux block causes device reset to C6671
110b = Reserved
111b = Reserved
0
LOCK
Lock register fields
0 = Register fields are not locked (default)
1 = Register fields are locked until the next timer reset
End of Table 3-20
3.3.20 DSP Suspension Control Register (DSP_SUSP_CTL)
The DSP Suspension Control Register controls the emulation suspension signals from DSP cores. The DSP
Suspension Control Register is shown in Figure 3-19 and described in Table 3-21.
Figure 3-19
31
DSP Suspension Control Register (DSP_SUSP_CTL)
30
0
DSP_SUSP_CTL
Reserved
R/W-0
R-0
Legend: R = Read only; RW = Read/Write; -n = value after reset
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Table 3-21
DSP Suspension Control Register (DSP_SUSP_CTL) Field Descriptions
Bit
Field
Description
31
DSP_SUSP_CTL
Control the combination of emulation suspension signals from DSP cores
0 = AND suspension signals from all DSP cores
1 = OR suspension signals from all DSP cores
30-0
Reserved
Reserved. Read only
End of Table 3-21
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3.3.21 Device Speed Register (DEVSPEED)
The Device Speed Register depicts the device speed grade. The Device Speed Register is shown below.
Figure 3-20
Device Speed Register (DEVSPEED)
31
23
22
0
DEVSPEED
Reserved
R-n
R-n
Legend: R = Read only; RW = Read/Write; -n = value after reset
Table 3-22
Device Speed Register (DEVSPEED) Field Descriptions
Bit
Field
Description
31-23
DEVSPEED
Indicates the speed of the device (read only)
0000 0000 0b = 800 MHz
0000 0000 1b = 1000 MHz
0000 0001 xb = 1200 MHz
0000 001x xb = 1250 MHz
0000 01xx xb = Reserved
0000 1xxx xb = Reserved
0001 xxxx xb = 1250 MHz
001x xxxx xb = 1200 MHz
01xx xxxx xb = 1000 MHz
1xxx xxxx xb = 800 MHz
22-0
Reserved
Reserved. Read only
End of Table 3-22
3.3.22 Chip Miscellaneous Control Register (CHIP_MISC_CTL)
The Chip Miscellaneous Control Register is shown below.
Figure 3-21
Chip Miscellaneous Control Register (CHIP_MISC_CTL)
31
13
12
11
3
2
0
Reserved
MSMC_BLOCK_PARITY_RST
Reserved
QM_PRIORITY
R/W-0000000000000000000
RW-0
R/W-001000011
RW-000
Legend: R = Read only; R/W = Read/Write; -n = value after reset
Table 3-23
Chip Miscellaneous Control Register (CHIP_MISC_CTL) Field Descriptions
Bit
Field
Description
31-13
Reserved
Reserved.
12
MSMC_BLOCK_PARITY_RST
Controls MSMC parity RAM reset. When set to 1, it means the MSMC parity RAM will not be reset.
11-3
Reserved
Reserved.
2-0
QM_PRIORITY
Control the priority level for the transactions from QM Packet DMA master port, which access the external
linking RAM.
End of Table 3-23
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3.4 Pullup/Pulldown Resistors
Proper board design should ensure that input pins to the device always be at a valid logic level and not floating. This
may be achieved via pullup/pulldown resistors. The device features internal pullup (IPU) and internal pulldown
(IPD) resistors on most pins to eliminate the need, unless otherwise noted, for external pullup/pulldown resistors.
An external pullup/pulldown resistor must be used in the following situations:
• Device Configuration Pins: If the pin is both routed out and are not driven (in Hi-Z state), an external
pullup/pulldown resistor must be used, even if the IPU/IPD matches the desired value/state.
• Other Input Pins: If the IPU/IPD does not match the desired value/state, use an external pullup/pulldown
resistor to pull the signal to the opposite rail.
For the device configuration pins (listed in Table 3-1), if they are both routed out and are not driven (in Hi-Z state),
it is strongly recommended that an external pullup/pulldown resistor be implemented. Although, internal
pullup/pulldown resistors exist on these pins and they may match the desired configuration value, providing
external connectivity can help ensure that valid logic levels are latched on these device configuration pins. In
addition, applying external pullup/pulldown resistors on the device configuration pins adds convenience to the user
in debugging and flexibility in switching operating modes.
Tips for choosing an external pullup/pulldown resistor:
• Consider the total amount of current that may pass through the pullup or pulldown resistor. Make sure to
include the leakage currents of all the devices connected to the net, as well as any internal pullup or pulldown
resistors.
• Decide a target value for the net. For a pulldown resistor, this should be below the lowest VIL level of all inputs
connected to the net. For a pullup resistor, this should be above the highest VIH level of all inputs on the net.
A reasonable choice would be to target the VOL or VOH levels for the logic family of the limiting device; which,
by definition, have margin to the VIL and VIH levels.
• Select a pullup/pulldown resistor with the largest possible value that can still ensure that the net will reach the
target pulled value when maximum current from all devices on the net is flowing through the resistor. The
current to be considered includes leakage current plus, any other internal and external pullup/pulldown
resistors on the net.
• For bidirectional nets, there is an additional consideration that sets a lower limit on the resistance value of the
external resistor. Verify that the resistance is small enough that the weakest output buffer can drive the net to
the opposite logic level (including margin).
• Remember to include tolerances when selecting the resistor value.
• For pullup resistors, also remember to include tolerances on the DVDD rail.
For most systems:
• A 1-k resistor can be used to oppose the IPU/IPD while meeting the above criteria. Users should confirm this
resistor value is correct for their specific application.
• A 20-k resistor can be used to compliment the IPU/IPD on the device configuration pins while meeting the
above criteria. Users should confirm this resistor value is correct for their specific application.
For more detailed information on input current (II), and the low-level/high-level input voltages (VIL and VIH) for
the TMS320C6671 device, see Section 6.3 ‘‘Electrical Characteristics’’ on page 115.
To determine which pins on the device include internal pullup/pulldown resistors, see Table 2-26 ‘‘Terminal
Functions — Signals and Control by Function’’ on page 44.
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4 System Interconnect
On the TMS320C6671 device, the C66x CorePac, the EDMA3 transfer controllers, and the system peripherals are
interconnected through the TeraNet, which is a non-blocking switch fabric enabling fast and contention-free
internal data movement. The TeraNet allows for low-latency, concurrent data transfers between master peripherals
and slave peripherals. The TeraNet also allows for seamless arbitration between the system masters when accessing
system slaves.
4.1 Internal Buses and Switch Fabrics
Two types of buses exist in the device: data buses and configuration buses. Some peripherals have both a data bus
and a configuration bus interface, while others have only one type of interface. Further, the bus interface width and
speed varies from peripheral to peripheral. Configuration buses are mainly used to access the register space of a
peripheral and the data buses are used mainly for data transfers.
The C66x CorePac, the EDMA3 traffic controllers, and the various system peripherals can be classified into two
categories: masters and slaves. Masters are capable of initiating read and write transfers in the system and do not rely
on the EDMA3 for their data transfers. Slaves, on the other hand, rely on the masters to perform transfers to and
from them. Examples of masters include the EDMA3 traffic controllers, SRIO, and Network Coprocessor packet
DMA. Examples of slaves include the SPI, UART, and I2C.
The masters and slaves in the device are communicating through the TeraNet (switch fabric). The device contains
two switch fabrics. The data switch fabric (data TeraNet) and the configuration switch fabric (configuration
TeraNet). The data TeraNet, is a high-throughput interconnect mainly used to move data across the system. The
data TeraNet connects masters to slaves via data buses. Some peripherals require a bridge to connect to the data
TeraNet. The configuration TeraNet, is mainly used to access peripheral registers. The configuration TeraNet
connects masters to slaves via configuration buses. As with the data TeraNet, some peripherals require the use of a
bridge to interface to the configuration TeraNet. Note that the data TeraNet also connects to the configuration
TeraNet. For more details see 4.2 ‘‘Switch Fabric Connections’’.
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4.2 Switch Fabric Connections
The following figures show the connections between masters and slaves on TeraNet 2A and TeraNet 3A.
Figure 4-1
TeraNet 2A for C6671
Bridge_5
Bridge_6
Bridge_7
From TeraNet_3_A
Bridge_8
CPU/2
´n*
XMC
S
SES
S
SMS
M
S
MSMC
M
DDR3
Tracer_MSMC0
Tracer_MSMC1
Bridge_10
HyperLink
M
TC_0
M
M
EDMA
CC0
TC_1
TeraNet 2_A
Bridge_9
Tracer_MSMC2
Tracer_MSMC3
Tracer_DDR
S
HyperLink
Bridge_1
Bridge_2
To TeraNet_3_A
Bridge_3
Bridge_4
* n varies with the number of CorePacs present in the specific device.
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Figure 4-2
TeraNet 3A for C6671
Bridge_1
Bridge_2
From TeraNet_2_A
Bridge_3
M
SRIO_M
M
SRIO
Packet DMA
M
NETCP
M
QM_SS
Packet DMA
M
QM_SS
Second
M
Debug_SS
M
TSIP0
M
TSIP1
TC_0
EDMA
CC1
TC_1
TC_2
TC_3
TC_0
EDMA
CC2
TC_1
TC_2
TC_3
M
TNet_3_D
CPU/3
TNet_3_C
CPU/3
M
M
M
M
M
M
M
M
TeraNet 3_A
PCIe
CPU/3
Bridge_4
Tracer_L2_n*
MPU_1
Tracer_QM_M
TNet_6P_A
CPU/3
S
CorePac_n*
S
QM_SS
S
PCIe
S
SRIO
S
SPI
S
Boot_ROM
S
EMIF16
Bridge_5
Bridge_6
Bridge_7
To TeraNet_2_A
Bridge_8
Bridge_9
Bridge_10
Bridge_12
To TeraNet_3P_A
Bridge_13
Bridge_14
* n varies with the number of CorePacs present in the specific device.
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Allowed connections on TeraNet 2A and TeraNet 3A are summarized in the table below.
Intersecting cells may contain one of the following:
• Y — There is a direct connection between this master and that slave.
• - — There is NO connection between this master and that slave.
• n — A numeric value indicates that the path between this master and that slave goes through bridge n.
Table 4-1
Data Switch Fabric Connection Matrix
HyperLink_Master
-
Y
Y
1
1
1
1
1
1
QM_Slave
PCIe_Slave
EMIF16
SPI
Boot_ROM
SRIO_Slave
CorePac0_SDMA
MSMC_SMS
Masters
MSMC_SES
HyperLink_Slave
Slaves
1
EDMA3CC0_TC0_RD
Y
Y
Y
2
2
2
2
2
2
-
EDMA3CC0_TC0_WR
Y
Y
Y
2
2
-
2
2
2
-
EDMA3CC0_TC1_RD
Y
Y
Y
3
3
3
3
3
3
-
EDMA3CC0_TC1_WR
Y
Y
Y
3
3
-
3
3
3
-
EDMA3CC1_TC0_RD
5
5
5
Y
Y
Y
Y
Y
Y
-
EDMA3CC1_TC0_WR
5
5
5
Y
Y
-
Y
Y
Y
-
EDMA3CC1_TC1_RD
6
6
6
Y
Y
Y
Y
Y
Y
Y
EDMA3CC1_TC1_WR
6
6
6
Y
Y
-
Y
Y
Y
Y
EDMA3CC1_TC2_RD
7
7
7
Y
Y
Y
Y
Y
Y
-
EDMA3CC1_TC2_WR
7
7
7
Y
Y
-
Y
Y
Y
-
EDMA3CC1_TC3_RD
8
8
8
Y
Y
Y
Y
Y
Y
-
EDMA3CC1_TC3_WR
8
8
8
Y
Y
-
Y
Y
Y
-
EDMA3CC2_TC0_RD
9
9
9
Y
Y
Y
Y
Y
Y
-
EDMA3CC2_TC0_WR
9
9
9
Y
Y
-
Y
Y
Y
-
EDMA3CC2_TC1_RD
10
10
10
Y
Y
Y
Y
Y
Y
Y
EDMA3CC2_TC1_WR
10
10
10
Y
Y
-
Y
Y
Y
Y
EDMA3CC2_TC2_RD
5
5
5
Y
Y
Y
Y
Y
Y
-
EDMA3CC2_TC2_WR
5
5
5
Y
Y
-
Y
Y
Y
-
EDMA3CC2_TC3_RD
6
6
6
Y
Y
Y
Y
Y
Y
-
EDMA3CC2_TC3_WR
6
6
6
Y
Y
-
Y
Y
Y
-
SRIO packet DMA
-
9
9
Y
-
-
-
Y
-
Y
SRIO_Master
9
9
9
Y
-
-
Y
Y
-
Y
PCIe_Master
7
7
7
Y
-
-
Y
Y
-
Y
NETCP packet DMA
-
10
10
Y
-
-
-
-
-
Y
MSMC_Data_Master
Y
-
-
4
4
4
4
4
4
4
QM packet DMA
8
8
8
Y
-
-
-
-
-
Y
QM_Second
8
8
8
Y
-
-
-
-
-
-
DebugSS_Master
10
10
10
Y
Y
Y
Y
Y
Y
Y
TSIP0_Master
-
5
5
Y
-
-
-
-
-
-
TSIP1_Master
-
5
5
Y
-
-
-
-
-
-
End of Table 4-1
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The following figure shows the connection between masters and slaves on TeraNet 3P and TeraNet 6P.
TeraNet 3P_A & B for C6671
Bridge_12
Bridge_13
From TeraNet_3_A
Bridge_14
S
MPU (× 4)
S
TC (× 2)
S
CC0
S
TC (× 4)
S
CC1
S
TC (× 4)
S
CC2
MPU_2
S
QM_SS
MPU_3
S
Semaphore
TNet_2P
CPU/2
TNet_3P_C
CPU/3
M
TeraNet 3P_A
CorePac_n*
CPU/3
Figure 4-3
TNet_3P_D
CPU/3
Tracer_QM_CFG
Tracer_SM
TETB (Debug_SS)
TETB (for core)
To TeraNet_3P_Tracer
MPU_0
TeraNet 3P_B
CPU/3
Tracer_CFG
S
SRIO
S
Tracer
S
NETCP
S
TSIP0
S
TSIP1
To TeraNet_6P_B
Bridge_20
* n varies with the number of CorePacs present in the specific device.
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Figure 4-4
TeraNet 6P_B and 3P_Tracer for C6671
M
Tracer_
MSMC_1
M
Tracer_
MSMC_2
M
Tracer_
MSMC_3
M
Tracer_CFG
M
Tracer_DDR
M
Tracer_SM
M
Tracer_
QM_M
M
Tracer_
QM_P
M
Tracer_L2_n*
M
Bridge_20
From TeraNet_3P_B
TeraNet 6P_B
CPU/6
Tracer_
MSMC_0
TeraNet 3P_Tracer
CPU/3
From TeraNet_3P_A
S
Debug_SS
STM
S
Debug_SS
TETB
S
SmartReflex
S
GPIO
S
IC
S
UART
S
BOOTCFG
S
PSC
S
PLL_CTL
S
Debug_SS
S
CIC
S
Timer
2
* n varies with the number of CorePacs present in the specific device.
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Allowed connections on TeraNet 3P and TeraNet 6P are summarized in the tables below.
Intersecting cells may contain one of the following:
• Y — There is a direct connection between this master and that slave.
• - — There is NO connection between this master and that slave.
• n — A numeric value indicates that the path between this master and that slave goes through bridge n.
Table 4-2
Configuration Switch Fabric Connection Matrix Section1 (Part 1 of 2)
HyperLink_Master
1,12
1,12
1,12
1,12
1,12
1,12
1,12
1,12
1,12
1,12
1,12
1,12
1,12
1,12
Timer
CIC
PLL
PSC
Boot_CFG
UART_CFG
QMSS__CFG
TSIP_CFG
NETCP_CFG
SRIO_CFG
EDMA3CC2_TC(0-3)
EDMA3CC1_TC(0-3)
EDMA3CC0_TC(0-1)
EDMA3CC2
Masters
EDMA3CC1
EDMA3CC0
Slave
1,12
1,12
EDMA3CC0_TC0_RD
2,12
2,12
2,12
2,12
2,12
2,12
-
-
-
-
-
-
-
-
-
-
EDMA3CC0_TC0_WR
2,12
2,12
2,12
2,12
2,12
2,12
-
-
-
-
-
-
-
-
-
-
EDMA3CC0_TC1_RD
3,12
3,12
3,12
3,12
3,12
3,12
-
-
-
-
-
-
-
-
-
-
EDMA3CC0_TC1_WR
3,12
3,12
3,12
3,12
3,12
3,12
-
-
-
-
-
-
-
-
-
-
EDMA3CC1_TC0_RD
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
EDMA3CC1_TC0_WR
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
EDMA3CC1_TC1_RD
13
13
13
13
13
13
-
-
-
-
-
-
-
-
-
-
EDMA3CC1_TC1_WR
13
13
13
13
13
13
-
-
-
-
-
-
-
-
-
-
EDMA3CC1_TC2_RD
14
14
14
14
14
14
-
-
-
-
-
-
-
-
-
-
EDMA3CC1_TC2_WR
14
14
14
14
14
14
-
-
-
-
-
-
-
-
-
-
EDMA3CC1_TC3_RD
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
EDMA3CC1_TC3_WR
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
EDMA3CC2_TC0_RD
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
EDMA3CC2_TC0_WR
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
EDMA3CC2_TC1_RD
13
13
13
13
13
13
-
-
-
-
-
-
-
-
-
-
EDMA3CC2_TC1_WR
13
13
13
13
13
13
-
-
-
-
-
-
-
-
-
-
EDMA3CC2_TC2_RD
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
EDMA3CC2_TC2_WR
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
EDMA3CC2_TC3_RD
14
14
14
14
14
14
-
-
-
-
-
-
-
-
-
-
EDMA3CC2_TC3_WR
14
14
14
14
14
14
-
-
-
-
-
-
-
-
-
-
SRIO packet DMA
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
SRIO_Master
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
PCIe_Master
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
NETCP packet DMA
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
MSMC_Data_Master
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
QM packet DMA
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
QM_Second
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
TSIP0_Master
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
TSIP1_Master
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
EDMA3CC0
-
-
-
Y
-
-
-
-
-
-
-
-
-
-
-
-
DebugSS_Master
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Table 4-2
Configuration Switch Fabric Connection Matrix Section1 (Part 2 of 2)
EDMA3CC1
-
-
-
-
Y
-
-
-
-
-
-
-
-
-
Timer
CIC
PLL
PSC
Boot_CFG
UART_CFG
QMSS__CFG
TSIP_CFG
NETCP_CFG
SRIO_CFG
EDMA3CC2_TC(0-3)
EDMA3CC1_TC(0-3)
EDMA3CC0_TC(0-1)
EDMA3CC2
Masters
EDMA3CC1
EDMA3CC0
Slave
-
-
EDMA3CC2
-
-
-
-
-
Y
-
-
-
-
-
-
-
-
-
-
CorePac0_CFG
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
End of Table 4-2
Table 4-3
Configuration Switch Fabric Connection Matrix Section2 (Part 1 of 2)
HyperLink_Master
1,12
1,12
1,12
1,12
1,12
1,12
TETB0
TETB_System
Debug_SS_CFG
Tracer
MPU
SmartReflex
Semaphore
2
Masters
I C
GPIO
Slave
1,12
-
-
EDMA3CC0_TC0_RD
-
-
-
-
-
-
-
2,12
-
EDMA3CC0_TC0_WR
-
-
-
-
-
-
-
-
-
EDMA3CC0_TC1_RD
-
-
-
-
-
-
-
3,12
-
EDMA3CC0_TC1_WR
-
-
-
-
-
-
-
-
-
EDMA3CC1_TC0_RD
12
12
12
12
12
12
12
12
-
EDMA3CC1_TC0_WR
12
12
12
12
12
12
12
-
-
EDMA3CC1_TC1_RD
-
-
-
-
-
-
-
-
13
EDMA3CC1_TC1_WR
-
-
-
-
-
-
-
-
-
EDMA3CC1_TC2_RD
-
-
-
-
-
-
-
-
-
EDMA3CC1_TC2_WR
-
-
-
-
-
-
-
-
-
EDMA3CC1_TC3_RD
12
12
12
12
12
12
12
12
-
EDMA3CC1_TC3_WR
12
12
12
12
12
12
12
-
-
EDMA3CC2_TC0_RD
12
12
12
12
12
12
12
12
-
EDMA3CC2_TC0_WR
12
12
12
12
12
12
12
-
-
EDMA3CC2_TC1_RD
-
-
-
-
-
-
-
-
13
EDMA3CC2_TC1_WR
-
-
-
-
-
-
-
-
-
EDMA3CC2_TC2_RD
12
12
12
12
12
12
12
12
-
EDMA3CC2_TC2_WR
12
12
12
12
12
12
12
-
-
EDMA3CC2_TC3_RD
-
-
-
-
-
-
-
-
-
EDMA3CC2_TC3_WR
-
-
-
-
-
-
-
-
-
SRIO packet DMA
-
-
-
-
-
-
-
-
-
SRIO_Master
12
12
12
12
12
12
12
12
12
PCIe_Master
12
12
12
12
12
12
12
12
12
NETCP packet DMA
-
-
-
-
-
-
-
-
-
MSMC_Data_Master
-
-
-
-
-
-
-
-
-
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Table 4-3
Configuration Switch Fabric Connection Matrix Section2 (Part 2 of 2)
QM packet DMA
QM_Second
-
-
-
-
-
-
-
-
TETB0
TETB_System
Debug_SS_CFG
Tracer
MPU
SmartReflex
Semaphore
2
Masters
I C
GPIO
Slave
-
-
-
-
-
-
-
-
-
-
12
12
12
12
12
12
12
12
12
TSIP0_Master
-
-
-
-
-
-
-
-
-
TSIP1_Master
-
-
-
-
-
-
-
-
-
EDMA3CC0
-
-
-
-
-
-
-
-
-
EDMA3CC1
-
-
-
-
-
-
-
-
-
DebugSS_Master
EDMA3CC2
-
-
-
-
-
-
-
-
-
CorePac0_CFG
Y
Y
Y
Y
Y
Y
Y
Y
Y
End of Table 4-3
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4.3 Bus Priorities
The priority level of all master peripheral traffic is defined at the TeraNet boundary. User programmable priority
registers allow software configuration of the data traffic through the TeraNet. Note that a lower number means
higher priority - PRI = 000b = urgent, PRI = 111b = low.
All other masters provide their priority directly and do not need a default priority setting. Examples include the
CorePacs, whose priorities are set through software in the UMC control registers. All the packet-DMA-based
peripherals also have internal registers to define the priority level of their initiated transactions.
The QM Packet DMA master port is one master port that does not have priority allocation register inside the IP. The
priority level for transaction from this master port is described by QM_PRIORITY bit field in CHIP_MISC_CTL
register in section 3.3.22 .
For all other modules, see the respective User Guides in “Related Documentation from Texas Instruments” on
page 72 for programmable priority registers.
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5 C66x CorePac
The C66x CorePac consists of several components:
• The C66x DSP and associated C66x CorePac core
• Level-one and level-two memories (L1P, L1D, L2)
• Data Trace Formatter (DTF)
• Embedded Trace Buffer (ETB)
• Interrupt Controller
• Power-down controller
• External Memory Controller
• Extended Memory Controller
• A dedicated power/sleep controller (LPSC)
The C66x CorePac also provides support for memory protection, bandwidth management (for resources local to the
C66x CorePac) and address extension. Figure 5-1 shows a block diagram of the C66x CorePac.
Figure 5-1
C66x CorePac Block Diagram
Interrupt and Exception Controller
Instruction Fetch
16-/32-bit Instruction Dispatch
Control Registers
In-Circuit Emulation
Boot
Controller
Instruction Decode
Data Path B
Data Path A
PLLC
LPSC
A Register File
B Register File
A31-A16
A15-A0
B31-B16
B15-B0
.M1
xx
xx
.M2
xx
xx
GPSC
.L1
.S1
.D1
.D2
.S2
Data Memory Controller (DMC) With
Memory Protect/Bandwidth Mgmt
.L2
Extended Memory
Controller (XMC)
C66x DSP Core
L2 Cache/
SRAM
512KB
MSM
SRAM
4096KB
DDR3
SRAM
DMA Switch
Fabric
External Memory
Controller (EMC)
Program Memory Controller (PMC) With
Memory Protect/Bandwidth Mgmt
Unified Memory
Controller (UMC)
32KB L1P
CFG Switch
Fabric
32KB L1D
For more detailed information on the TMS320C66x CorePac on the C6671 device, see the C66x DSP CorePac User
Guide in ‘‘Related Documentation from Texas Instruments’’ on page 72.
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5.1 Memory Architecture
The C66x CorePac of the TMS320C6671 device contains a 512KB level-2 memory (L2), a 32KB level-1 program
memory (L1P), and a 32KB level-1 data memory (L1D). The device also contain a 4096KB multicore shared memory
(MSM). All memory on the C6671 has a unique location in the memory map (see Table 2-2 ‘‘Memory Map
Summary’’ on page 17.
After device reset, L1P and L1D cache are configured as all cache, by default. The L1P and L1D cache can be
reconfigured via software through the L1PMODE field of the L1P Configuration Register (L1PCFG) and the
L1DMODE field of the L1D Configuration Register (L1DCFG) of the C66x CorePac. L1D is a two-way
set-associative cache, while L1P is a direct-mapped cache.
The on-chip bootloader changes the reset configuration for L1P and L1D. For more information, see the DSP
Bootloader for KeyStone Devices User Guide in ‘‘Related Documentation from Texas Instruments’’ on page 72.
For more information on the operation L1 and L2 caches, see the C66x DSP Cache User Guide in ‘‘Related
Documentation from Texas Instruments’’ on page 72.
5.1.1 L1P Memory
The L1P memory configuration for the C6671 device is as follows:
• 32K bytes with no wait states
Figure 5-2 shows the available SRAM/cache configurations for L1P.
Figure 5-2
L1P Memory Configurations
L1P mode bits
000
001
010
011
100
1/2
SRAM
All
SRAM
7/8
SRAM
L1P memory
Block base
address
00E0 0000h
16K bytes
3/4
SRAM
direct
mapped
cache
00E0 4000h
8K bytes
dm
cache
106
C66x CorePac
direct
mapped
cache
direct
mapped
cache
00E0 6000h
4K bytes
00E0 7000h
4K bytes
00E0 8000h
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5.1.2 L1D Memory
The L1D memory configuration for the C6671 device is as follows:
• 32K bytes with no wait states
Figure 5-3 shows the available SRAM/cache configurations for L1D.
Figure 5-3
L1D Memory Configurations
L1D mode bits
000
001
010
011
100
1/2
SRAM
All
SRAM
7/8
SRAM
L1D memory
Block base
address
00F0 0000h
16K bytes
3/4
SRAM
2-way
cache
00F0 4000h
8K bytes
2-way
cache
00F0 6000h
4K bytes
2-way
cache
2-way
cache
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00F0 7000h
4K bytes
00F0 8000h
C66x CorePac
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5.1.3 L2 Memory
The L2 memory configuration for the C6671 device is as follows:
• Total memory size is 4096KB
• Each core contains 512KB of memory
• Local starting address for each core is 0080 0000h
L2 memory can be configured as all SRAM, all 4-way set-associative cache, or a mix of the two. The amount of L2
memory that is configured as cache is controlled through the L2MODE field of the L2 Configuration Register
(L2CFG) of the C66x CorePac. Figure 5-4 shows the available SRAM/cache configurations for L2. By default, L2 is
configured as all SRAM after device reset.
Figure 5-4
L2 Memory Configurations
L2 Mode Bits
000
001
010
011
ALL
SRAM
15/16
SRAM
7/8
SRAM
3/4
SRAM
100
1/2
SRAM
101
ALL
Cache
L2 Memory
Block Base
Address
0080 0000h
256Kbytes
4-Way
Cache
0084 0000h
128Kbytes
4-Way
Cache
4-Way
Cache
4-Way
Cache
4-Way
Cache
0086 0000h
64Kbytes
32Kbytes
32Kbytes
0087 0000h
0087 8000h
0087 FFFFh
Global addresses are accessible to all masters in the system. In addition, local memory can be accessed directly by
the associated processor through aliased addresses, where the eight MSBs are masked to 0. The aliasing is handled
within the C66x CorePac and allows for common code to be run unmodified on multiple cores. For example, address
location 0x10800000 is the global base address for C66x CorePac Core 0's L2 memory. C66x CorePac Core 0 can
access this location by either using 0x10800000 or 0x00800000. Any other master on the device must use 0x10800000
only. Conversely, 0x00800000 can by used by any of the cores as their own L2 base addresses.
For C66x CorePac Core 0, as mentioned, this is equivalent to 0x10800000. Local addresses should be used only for
shared code or data, allowing a single image to be included in memory. Any code/data targeted to a specific core, or
a memory region allocated during run-time by a particular core should always use the global address only.
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5.1.4 MSM SRAM
The MSM SRAM configuration for the C6671 device is as follows:
• Memory size is 4096KB
• The MSM SRAM can be configured as shared L2 and/or shared L3 memory
• Allows extension of external addresses from 2GB to up to 8GB
• Has built in memory protection features
The MSM SRAM is always configured as all SRAM. When configured as a shared L2, its contents can be cached in
L1P and L1D. When configured in shared L3 mode, it’s contents can be cached in L2 also. For more details on
external memory address extension and memory protection features, see the Multicore Shared Memory Controller
(MSMC) for KeyStone Devices User Guide in ‘‘Related Documentation from Texas Instruments’’ on page 72.
5.1.5 L3 Memory
The L3 ROM on the device is 128KB. The ROM contains software used to boot the device. There is no requirement
to block accesses from this portion to the ROM.
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5.2 Memory Protection
Memory protection allows an operating system to define who or what is authorized to access L1D, L1P, and L2
memory. To accomplish this, the L1D, L1P, and L2 memories are divided into pages. There are 16 pages of L1P (2KB
each), 16 pages of L1D (2KB each), and 32 pages of L2 (16KB each). The L1D, L1P, and L2 memory controllers in
the C66x CorePac are equipped with a set of registers that specify the permissions for each memory page.
Each page may be assigned with fully orthogonal user and supervisor read, write, and execute permissions. In
addition, a page may be marked as either (or both) locally accessible or globally accessible. A local access is a direct
DSP access to L1D, L1P, and L2, while a global access is initiated by a DMA (either IDMA or the EDMA3) or by
other system masters. Note that EDMA or IDMA transfers programmed by the DSP count as global accesses. On a
secure device, pages can be restricted to secure access only (default) or opened up for public, non-secure access.
The DSP and each of the system masters on the device are all assigned a privilege ID. It is possible to specify whether
memory pages are locally or globally accessible.
The AIDx and LOCAL bits of the memory protection page attribute registers specify the memory page protection
scheme, see Table 5-1.
Table 5-1
Available Memory Page Protection Schemes
AIDx Bit
Local Bit
Description
0
0
No access to memory page is permitted.
0
1
Only direct access by DSP is permitted.
1
0
Only accesses by system masters and IDMA are permitted (includes EDMA and IDMA accesses initiated by the DSP).
1
1
All accesses permitted.
End of Table 5-1
Faults are handled by software in an interrupt (or an exception, programmable within the C66x CorePac interrupt
controller) service routine. A DSP or DMA access to a page without the proper permissions will:
• Block the access — reads return 0, writes are ignored
• Capture the initiator in a status register — ID, address, and access type are stored
• Signal event to DSP interrupt controller
The software is responsible for taking corrective action to respond to the event and resetting the error status in the
memory controller. For more information on memory protection for L1D, L1P, and L2, see the C66x DSP CorePac
User Guide in ‘‘Related Documentation from Texas Instruments’’ on page 72.
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5.3 Bandwidth Management
When multiple requestors contend for a single C66x CorePac resource, the conflict is resolved by granting access to
the highest priority requestor. The following four resources are managed by the Bandwidth Management control
hardware:
• Level 1 Program (L1P) SRAM/Cache
• Level 1 Data (L1D) SRAM/Cache
• Level 2 (L2) SRAM/Cache
• Memory-mapped registers configuration bus
The priority level for operations initiated within the C66x CorePac are declared through registers in the C66x
CorePac. These operations are:
• DSP-initiated transfers
• User-programmed cache coherency operations
• IDMA-initiated transfers
The priority level for operations initiated outside the C66x CorePac by system peripherals is declared through the
Priority Allocation Register (PRI_ALLOC), see section 4.3 ‘‘Bus Priorities’’ on page 104 for more details. System
peripherals with no fields in the PRI_ALLOC have their own registers to program their priorities.
More information on the bandwidth management features of the C66x CorePac can be found in the C66x DSP
CorePac User Guide in ‘‘Related Documentation from Texas Instruments’’ on page 72.
5.4 Power-Down Control
The C66x CorePac supports the ability to power down various parts of the C66x CorePac. The power down
controller (PDC) of the C66x CorePac can be used to power down L1P, the cache control hardware, the DSP, and
the entire C66x CorePac. These power-down features can be used to design systems for lower overall system power
requirements.
Note—The C6671 does not support power-down modes for the L2 memory at this time.
More information on the power-down features of the C66x CorePac can be found in the C66x DSP CorePac User
Guide in ‘‘Related Documentation from Texas Instruments’’ on page 72.
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5.5 C66x CorePac Revision
The version and revision of the C66x CorePac can be read from the CorePac Revision ID Register (MM_REVID)
located at address 0181 2000h. The MM_REVID register is shown in Figure 5-5 and described in Table 5-2. The
C66x CorePac revision is dependant on the silicon revision being used.
Figure 5-5
CorePac Revision ID Register (MM_REVID) Address - 0181 2000h
31
16
15
0
VERSION
REVISION
R-n
R-n
Legend: R = Read; -n = value after reset
Table 5-2
Bit
CorePac Revision ID Register (MM_REVID) Field Descriptions
Field
Description
31-16
VERSION
Version of the C66x CorePac implemented on the device.
15-0
REVISION
Revision of the C66x CorePac version implemented on the device.
End of Table 5-2
5.6 C66x CorePac Register Descriptions
See the C66x DSP CorePac User Guide in ‘‘Related Documentation from Texas Instruments’’ on page 72 for register
offsets and definitions.
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6 Device Operating Conditions
6.1 Absolute Maximum Ratings
Table 6-1
Absolute Maximum Ratings (1)
Over Operating Case Temperature Range (Unless Otherwise Noted)
CVDD
-0.3 V to 1.3 V
CVDD1
-0.3 V to 1.3 V
DVDD15
-0.3 V to 2.45 V
DVDD18
(2)
Supply voltage range :
-0.3 V to 2.45 V
VREFSSTL
0.49 × DVDD15 to 0.51 × DVDD15
VDDT1, VDDT2
-0.3 V to 1.3 V
VDDR1, VDDR2, VDDR3, VDDR4
-0.3 V to 2.45 V
AVDDA1, AVDDA2, AVDDA3
-0.3 V to 2.45 V
VSS Ground
0V
LVCMOS (1.8V)
-0.3 V to DVDD18+0.3 V
DDR3
-0.3 V to 2.45 V
2
Input voltage (VI) range:
IC
-0.3 V to 2.45 V
LVDS
-0.3 V to DVDD18+0.3 V
LJCB
-0.3 V to 1.3 V
SerDes
-0.3 V to CVDD1+0.3 V
LVCMOS (1.8V)
Output voltage (VO) range:
-0.3 V to DVDD18+0.3 V
DDR3
-0.3 V to 2.45 V
2
IC
-0.3 V to 2.45 V
SerDes
-0.3 V to CVDD1+0.3 V
Commercial
Operating case temperature range, TC:
(3)
ESD stress voltage, VESD :
0°C to 85°C
Extended
HBM (human body model)
-40°C to 100°C
(4)
CDM (charged device model)
±1000 V
(5)
±250 V
LVCMOS (1.8V)
Overshoot/undershoot
(6)
DDR3
2
20% Overshoot/Undershoot for 20% of
Signal Duty Cycle
IC
Storage temperature range, Tstg:
-65°C to 150°C
End of Table 6-1
1 Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the
device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated
conditions for extended periods may affect device reliability.
2 All voltage values are with respect to VSS.
3 Electrostatic discharge (ESD) to measure device sensitivity/immunity to damage caused by electrostatic discharges into the device.
4 Level listed above is the passing level per ANSI/ESDA/JEDEC JS-001-2010. JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD
control process, and manufacturing with less than 500 V HBM is possible if necessary precautions are taken. Pins listed as 1000 V may actually have higher performance.
5 Level listed above is the passing level per EIA-JEDEC JESD22-C101E. JEDEC document JEP157 states that 250 V CDM allows safe manufacturing with a standard ESD control
process. Pins listed as 250 V may actually have higher performance.
6 Overshoot/Undershoot percentage relative to I/O operating values - for example the maximum overshoot value for 1.8-V LVCMOS signals is DVDD18 + 0.20 × DVDD18 and
maximum undershoot value would be VSS - 0.20 × DVDD18
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6.2 Recommended Operating Conditions
Recommended Operating Conditions (1)
Table 6-2
(2)
Min
CVDD
SR Core Supply
Initial Startup
Nom
(3)
Max Unit
VINITnom × 1.05
VINITnom × 0.95
1.1
1000MHz - Device
SRVnom (4) × 0.95
0.85-1.1
SRVnom × 1.05
1250MHz - Device
SRVnom × 0.95
0.9-1.1
SRVnom × 1.05
V
CVDD1
Core supply voltage for memory array
0.95
1
1.05
V
DVDD18
1.8-V supply I/O voltage
1.71
1.8
1.89
V
DVDD15
1.5-V supply I/O voltage
1.425
1.5
1.575
V
VREFSSTL
DDR3 reference voltage
0.49 × DVDD15
0.5 × DVDD15
0.51 × DVDD15
V
SerDes regulator supply
VDDRx
VDDAx
(5)
1.425
1.5
1.575
V
PLL analog supply
1.71
1.8
1.89
V
0.95
1
1.05
V
0
0
0
V
VDDTx
SerDes termination supply
VSS
Ground
VIH
High-level input voltage
LVCMOS (1.8 V)
2
IC
DDR3 EMIF
0.65 × DVDD18
V
0.7 × DVDD18
V
VREFSSTL + 0.1
LVCMOS (1.8 V)
VIL
Low-level input voltage
DDR3 EMIF
-0.3
2
IC
Commercial
TC
Operating case temperature
Extended
V
0.35 × DVDD18
V
VREFSSTL - 0.1
V
0.3 × DVDD18
V
0
85
°C
-40
100
°C
End of Table 6-2
1 All differential clock inputs comply with the LVDS Electrical Specification, IEEE 1596.3-1996 and all SerDes I/Os comply with the XAUI Electrical Specification, IEEE
802.3ae-2002.
2 All SerDes I/Os comply with the XAUI Electrical Specification, IEEE 802.3ae-2002.
3 The initial CVDD voltage at power on will be 1.1V nominal and it must transition to VID set value immediately after being presented on VCNTL pins. This is required to maintain
full power functionality and reliability targets guaranteed by TI.
4 SRVnom refers to the unique SmartReflex core supply voltage set from the factory for each individual device.
5 Where x = 1, 2, 3, 4... to indicate all supplies of the same kind.
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6.3 Electrical Characteristics
Table 6-3
Electrical Characteristics
Over Recommended Ranges of Supply Voltage and Operating Case Temperature (Unless Otherwise Noted)
Parameter
LVCMOS (1.8 V)
VOH
High-level output voltage
Test Conditions (1)
IO = IOH
DDR3
Min
Typ
Max Unit
DVDD18 - 0.45
DVDD15 - 0.4
V
2 (2)
IC
LVCMOS (1.8 V)
VOL
II
(3)
Low-level output voltage
IO = IOL
0.45
DDR3
0.4
I2 C
IO = 3 mA, pulled up to 1.8 V
No IPD/IPU
-5
LVCMOS (1.8 V)
Internal pullup
50
100
-170
-100
Input current [DC]
Internal pulldown
2
IC
0.1 × DVDD18 V < VI < 0.9 ×
DVDD18 V
-10
LVCMOS (1.8 V)
IOH
V
0.4
5
170
(4)
-50
A
10
-6
High-level output current [DC] DDR3
-8
mA
I2C (5)
IOL
Low-level output current [DC]
LVCMOS (1.8 V)
6
DDR3
8
2
IC
IOZ
(6)
Off-state output current [DC]
mA
3
LVCMOS (1.8 V)
-2
2
DDR3
-2
2
I2 C
-2
2
A
End of Table 6-3
1
2
3
For test conditions shown as MIN, MAX, or TYP, use the appropriate value specified in the recommended operating conditions table.
I2C uses open collector IOs and does not have a VOH Minimum.
II applies to input-only pins and bidirectional pins. For input-only pins, II indicates the input leakage current. For bidirectional pins, II includes input leakage current and
off-state (Hi-Z) output leakage current.
4 For RESETSTAT, max DC input current is 300 A.
2
5 I C uses open collector IOs and does not have an IOH Maximum.
6 IOZ applies to output-only pins, indicating off-state (Hi-Z) output leakage current.
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6.4 Power Supply to Peripheral I/O Mapping
Table 6-4
Power Supply to Peripheral I/O Mapping
(1) (2)
Over Recommended Ranges of Supply Voltage and Operating Case Temperature (Unless Otherwise Noted)
Power Supply
I/O Buffer Type
Associated Peripheral
CORECLK(P|N) PLL input buffers
SRIOSGMIICLK(P|N) SerDes PLL input buffers
CVDD
Supply Core Voltage
LJCB
DDRCLK(P|N) PLL input buffers
PCIECLK(P|N) SerDes PLL input buffers
MCMCLK(P|N) SerDes PLL input buffers
PASSCLK(P|N) PLL input buffers
DVDD15
1.5-V supply I/O voltage
DDR3 (1.5 V)
All DDR3 memory controller peripheral I/O buffers
All GPIO peripheral I/O buffers
All JTAG and EMU peripheral I/O buffers
All Timer peripheral I/O buffers
All SPI peripheral I/O buffers
LVCMOS (1.8 V)
DVDD18
1.8-V supply I/O voltage
All RESETs, NMI, Control peripheral I/O buffers
All Hyperlink sideband peripheral I/O buffers
All MDIO peripheral I/O buffers
All UART peripheral I/O buffers
All TSIP0 and TSIP1 peripheral I/O buffers
All EMIF16 peripheral I/O buffers
2
Open-drain (1.8V)
All I C peripheral I/O buffers
All SmartReflex peripheral I/O buffers
VDDT1
Hyperlink SerDes termination and analog front-end supply
SerDes/CML
Hyperlink SerDes CML IO buffers
VDDT2
SRIO/SGMII/PCIE SerDes termination and analog front-end
supply
SerDes/CML
SRIO/SGMII/PCIE SerDes CML IO buffers
End of Table 6-4
1 Note that this table does not attempt to describe all functions of all power supply terminals, but only those whose purpose it is to power peripheral I/O buffers and clock
input buffers.
2 See the Hardware Design Guide for KeyStone I Devices in ‘‘Related Documentation from Texas Instruments’’ on page 72 for more information about individual peripheral I/O.
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7 Peripheral Information and Electrical Specifications
This chapter covers the various peripherals on the TMS320C6671 DSP. Peripheral-specific information, timing
diagrams, electrical specifications, and register memory maps are described in this chapter.
7.1 Parameter Information
This section describes the conditions used to capture the electrical data seen in this chapter.
7.1.1 Timing Parameters and Board Routing Analysis
The timing parameter values specified in this data manual do not include delays caused by board routings. As a good
board design practice, such delays must always be taken into account. Timing values may be adjusted by
increasing/decreasing such delays. TI recommends using the available I/O buffer information specification (IBIS)
models to analyze the timing characteristics correctly. To properly use IBIS models to attain accurate timing analysis
for a given system, see the Using IBIS Models for Timing Analysis application report in ‘‘Related Documentation
from Texas Instruments’’ on page 72. If needed, external logic hardware such as buffers may be used to compensate
any timing differences.
7.1.2 1.8-V LVCMOS Signal Transition Levels
All input and output timing parameters are referenced to VDD/2 for both 0 and 1 logic levels.
Figure 7-1
Input and Output Voltage Reference Levels for AC Timing Measurements
Vref = VDD / 2
All rise and fall transition timing parameters are referenced to VIL MAX and VIH MIN for input clocks,
VOL MAX and VOH MIN for output clocks.
Figure 7-2
Rise and Fall Transition Time Voltage Reference Levels
Vref = VIH MIN (or VOH MIN)
Vref = VIL MAX (or VOL MAX)
7.2 Recommended Clock and Control Signal Transition Behavior
All clocks and control signals must transition between VIH and VIL (or between VIL and VIH) in a monotonic
manner.
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7.3 Power Supplies
The following sections describe the proper power-supply sequencing and timing needed to properly power on the
C6671. The various power supply rails and their primary function is listed in Table 7-1.
Table 7-1
Power Supply Rails on the TMS320C6671
Name
Primary Function
Voltage
Notes
CVDD
SmartReflex core supply voltage
0.9 V to 1.1 V
Includes core voltage for DDR3 module
CVDD1
Core supply voltage for memory
array
1.0 V
Fixed supply at 1.0 V
VDDT1
HyperLink SerDes termination
supply
1.0 V
Filtered version of CVDD1. Special considerations for noise. Filter is not
needed if HyperLink is not in use.
VDDT2
SGMII/SRIO/PCIE SerDes
termination supply
1.0 V
Filtered version of CVDD1. Special considerations for noise. Filter is not
needed if SGMII/SRIO/PCIE is not in use.
DVDD15
1.5-V DDR3 IO supply
1.5 V
Fixed supply at 1.5V
VDDR1
HyperLink SerDes regulator supply
1.5 V
Filtered version of DVDD15. Special considerations for noise. Filter is not
needed if HyperLink is not in use.
VDDR2
PCIE SerDes regulator supply
1.5 V
Filtered version of DVDD15. Special considerations for noise. Filter is not
needed if PCIe is not in use.
VDDR3
SGMII SerDes regulator supply
1.5 V
Filtered version of DVDD15. Special considerations for noise. Filter is not
needed if SGMII is not in use.
VDDR4
SRIO SerDes regulator supply
1.5 V
Filtered version of DVDD15. Special considerations for noise. Filter is not
needed if SRIO is not in use.
DVDD18
1.8-V IO supply
1.8V
Fixed supply at 1.8V
AVDDA1
Main PLL supply
1.8 V
Filtered version of DVDD18. Special considerations for noise.
AVDDA2
DDR3 PLL supply
1.8 V
Filtered version of DVDD18. Special considerations for noise.
AVDDA3
PASS PLL supply
1.8 V
Filtered version of DVDD18. Special considerations for noise.
VREFSSTL
0.75-V DDR3 reference voltage
0.75 V
Should track the 1.5-V supply. Use 1.5 V as source.
VSS
Ground
GND
Ground
End of Table 7-1
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7.3.1 Power-Supply Sequencing
This section defines the requirements for a power up sequencing from a power-on reset condition. There are two
acceptable power sequences for the device. The first sequence stipulates the core voltages starting before the IO
voltages as shown below.
1. CVDD
2. CVDD1, VDDT1-2
3. DVDD18, AVDD1, AVDD2
4. DVDD15, VDDR1-4
The second sequence provides compatibility with other TI processors with the IO voltage starting before the core
voltages as shown below.
1. DVDD18, AVDD1, AVDD2
2. CVDD
3. CVDD1, VDDT1-2
4. DVDD15, VDDR1-4
The clock input buffers for CORECLK, DDRCLK, PASSCLK, SRIOSGMIICLK, PCIECLK and MCMCLK
use CVDD as a supply voltage. These clock inputs are not failsafe and must be held in a high-impedance state until
CVDD is at a valid voltage level. Driving these clock inputs high before CVDD is valid could cause damage to the
device. Once CVDD is valid it is acceptable that the P and N legs of these CLKs may be held in a static state (either
high and low or low and high) until a valid clock frequency is needed at that input. To avoid internal oscillation the
clock inputs should be removed from the high impedance state shortly after CVDD is present.
If a clock input is not used it must be held in a static state. To accomplish this the N leg should be pulled to ground
through a 1K ohm resistor. The P leg should be tied to CVDD to ensure it won't have any voltage present until
CVDD is active. Connections to the IO cells powered by DVDD18 and DVDD15 are not failsafe and should not be
driven high before these voltages are active. Driving these IO cells high before DVDD18 or DVDD15 are valid could
cause damage to the device.
The device initialization is broken into two phases. The first phase consists of the time period from the activation of
the first power supply until the point at which all supplies are active and at a valid voltage level. Either of the
sequencing scenarios described above can be implemented during this phase. The figures below show both the
core-before-IO voltage sequence and the IO-before-core voltage sequence. POR must be held low for the entire
power stabilization phase.
This is followed by the device initialization phase. The rising edge of POR followed by the rising edge of RESETFULL
will trigger the end of the initialization phase but both must be inactive for the initialization to complete. POR must
always go inactive before RESETFULL goes inactive as described below. REFCLK in the following section refers to
the clock input that has been selected as the source for the main PLL and SYSCLK1 refers to the main PLL output
that is used by the CorePac, see Figure 7-9 for more details.
7.3.1.1 Core-Before-IO Power Sequencing
Figure 7-3 shows the power sequencing and reset control of TMS320C6671 for device initialization. POR may be
removed after the power has been stable for the required 100 μsec. RESETFULL must be held low for a period after
the rising edge of POR but may be held low for longer periods if necessary. The configuration bits shared with the
GPIO pins will be latched on the rising edge of RESETFULL and must meet the setup and hold times specified.
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REFCLK must always be active before POR can be removed. Core-before-IO power sequencing is defined in
Table 7-2.
Note—TI recommends a maximum of 100 ms between one power rail being valid, and the next power rail
in the sequence starting to ramp. Each supply must ramp monotonically and must reach a stable valid level
within 20ms.
Figure 7-3
Core Before IO Power Sequencing
Power Stabilization Phase
Device Initialization Phase
POR
7
RESETFULL
8
GPIO Config
Bits
4b
9
10
RESET
2c
1
CVDD
6
2a
CVDD1
3
DVDD18
4a
DVDD15
5
REFCLKP&N
2b
DDRCLKP&N
RESETSTAT
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Table 7-2
Core Before IO Power Sequencing
Time
System State
1
Begin Power Stabilization Phase
• CVDD (core AVS) ramps up.
• POR must be held low through the power stabilization phase. Because POR is low, all the core logic that has async reset (created from
POR) is put into the reset state.
• Once enabled, the power supply should ramp to its valid voltage level within 20 ms.
2a
• CVDD1 (core constant) ramps at the same time or shortly following CVDD. Although ramping CVDD1 and CVDD simultaneously is
permitted, the voltage for CVDD1 must never exceed CVDD until after CVDD has reached a valid voltage.
• The purpose of ramping up the core supplies close to each other is to reduce crowbar current. CVDD1 should trail CVDD as this will
ensure that the WLs in the memories are turned off and there is no current through the memory bit cells. If, however, CVDD1 (core
constant) ramps up before CVDD (core AVS), then the worst-case current could be on the order of twice the specified draw of CVDD1.
• The maximum duration is 100 ms.
2b
• Once CVDD is valid, the clock drivers should be enabled. Although the clock inputs are not necessary at this time, they should either be
driven with a valid clock or be held in a static state with one leg high and one leg low.
2c
• The DDRCLK and REFCLK may begin to toggle anytime between when CVDD is at a valid level and the setup time before POR goes high
specified by t6.
3
• Filtered versions of 1.8 V can ramp simultaneously with DVDD18.
• RESETSTAT is driven low once the DVDD18 supply is available.
• All LVCMOS input and bidirectional pins must not be driven or pulled high until DVDD18 is present. Driving an input or bidirectional pin
before DVDD18 is valid could cause damage to the device.
4a
• DVDD15 (1.5 V) supply is ramped up after DVDD18 is valid. Although ramping DVDD18 and DVDD15 simultaneously is permitted, the
voltage for DVDD15 must never exceed DVDD18.
4b
• RESET may be driven high any time after DVDD18 is at a valid level. In a POR-controlled boot, RESET must be high before POR is driven
high.
5
• POR must continue to remain low for at least 100 μs after power has stabilized.
End Power Stabilization Phase
6
• Device initialization requires 500 REFCLK periods after the Power Stabilization Phase. The maximum clock period is 33.33 nsec, so a delay
of an additional 16 μs is required before a rising edge of POR. The clock must be active during the entire 16 μs.
7
• RESETFULL must be held low for at least 24 transitions of the REFCLK after POR has stabilized at a high level.
8
• The rising edge of the RESETFULL will remove the reset to the efuse farm allowing the scan to begin.
• Once device initialization and the efuse farm scan are complete, the RESETSTAT signal is driven high. This delay will be 10000 to 50000
clock cycles.
End Device Initialization Phase
9
• GPIO configuration bits must be valid for at least 12 transitions of the REFCLK before the rising edge of RESETFULL
10
• GPIO configuration bits must be held valid for at least 12 transitions of the REFCLK after the rising edge of RESETFULL
End of Table 7-2
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7.3.1.2 IO-Before-Core Power Sequencing
The timing diagram for IO-before-core power sequencing is shown in Figure 7-4 and defined in Table 7-3.
Note—TI recommends a maximum of 100 ms between one power rail being valid, and the next power rail
in the sequence starting to ramp. Each supply must ramp monotonically and must reach a stable valid level
within 20 ms.
Figure 7-4
IO Before Core Power Sequencing
Power Stabilization Phase
Device Initialization Phase
POR
5
7
RESETFULL
8
GPIO Config
Bits
2a
9
10
RESET
3c
2b
CVDD
6
3a
CVDD1
1
DVDD18
4
DVDD15
3b
REFCLKP&N
DDRCLKP&N
RESETSTAT
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Table 7-3
IO Before Core Power Sequencing
Time
System State
1
Begin Power Stabilization Phase
• Because POR is low, all the core logic having async reset (created from POR) are put into reset state once the core supply ramps. POR must
remain low through Power Stabilization Phase.
• Filtered versions of 1.8 V can ramp simultaneously with DVDD18.
• RESETSTAT is driven low once the DVDD18 supply is available.
• All input and bidirectional pins must not be driven or pulled high until DVDD18 is present. Driving an input or bidirectional pin before
DVDD18 could cause damage to the device.
• Once enabled, the power supply should ramp to its valid voltage level within 20 ms.
2a
• RESET may be driven high anytime after DVDD18 is at a valid level.
2b
• CVDD (core AVS) ramps up.
• The maximum duration is 100 ms.
3a
• CVDD1 (core constant) ramps at the same time or following CVDD. Although ramping CVDD1 and CVDD simultaneously is permitted the
voltage for CVDD1 must never exceed CVDD until after CVDD has reached a valid voltage.
• The purpose of ramping up the core supplies close to each other is to reduce crowbar current. CVDD1 should trail CVDD as this will ensure
that the WLs in the memories are turned off and there is no current through the memory bit cells. If, however, CVDD1 (core constant)
ramps up before CVDD (core AVS), then the worst case current could be on the order of twice the specified draw of CVDD1.
3b
• Once CVDD is valid, the clock drivers should be enabled. Although the clock inputs are not necessary at this time, they should either be
driven with a valid clock or held in a static state with one leg high and one leg low.
3c
• The DDRCLK and REFCLK may begin to toggle anytime between when CVDD is at a valid level and the setup time before POR goes high
specified by t6.
4
• DVDD15 (1.5 V) supply is ramped up after CVDD1 is valid.
5
• POR must continue to remain low for at least 100 μs after power has stabilized.
End Power Stabilization Phase
6
Begin Device Initialization
• Device initialization requires 500 REFCLK periods after the Power Stabilization Phase. The maximum clock period is 33.33 nsec so a delay
of an additional 16 μs is required before a rising edge of POR. The clock must be active during the entire 16 μs.
• POR must remain low.
7
• RESETFULL is held low for at least 24 transitions of the REFCLK after POR has stabilized at a high level.
• The rising edge of the RESETFULL will remove the reset to the efuse farm allowing the scan to begin.
8
• Once device initialization and the efuse farm scan are complete, the RESETSTAT signal is driven high. This delay will be 10000 to 50000
clock cycles.
End Device Initialization Phase
9
• GPIO configuration bits must be valid for at least 12 transitions of the REFCLK before the rising edge of RESETFULL
10
• GPIO configuration bits must be held valid for at least 12 transitions of the REFCLK after the rising edge of RESETFULL
End of Table 7-3
7.3.1.3 Prolonged Resets
Holding the device in POR, RESETFULL, or RESET for long periods of time will affect the long term reliability of
the part. The device should not be held in a reset for times exceeding one hour and should not be held in reset for
more the 5% of the time during which power is applied. Exceeding these limits will cause a gradual reduction in the
reliability of the part. This can be avoided by allowing the DSP to boot and then configuring it to enter a hibernation
state soon after power is applied. This will satisfy the reset requirement while limiting the power consumption of the
device.
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7.3.1.4 Clocking During Power Sequencing
Some of the clock inputs are required to be present for the device to initialize correctly, but behavior of many of the
clocks is contingent on the state of the boot configuration pins. Table 7-4 describes the clock sequencing and the
conditions that affect the clock operation. Note that all clock drivers should be in a high-impedance state until
CVDD is at a valid level and that all clock inputs either be active or in a static state with one leg pulled low and the
other connected to CVDD.
Table 7-4
Clock Sequencing
Clock
Condition
DDRCLK
None
Must be present 16 μsec before POR transitions high.
CORECLK
None
CORECLK used to clock the core PLL. It must be present 16 μsec before POR transitions high.
PASSCLK
Sequencing
PASSCLKSEL = 0
PASSCLK is not used and should be tied to a static state.
PASSCLKSEL = 1
PASSCLK is used as a source for the PASS PLL. It must be present before the PASS PLL is removed from
reset and programmed.
An SGMII port will be used.
SRIOSGMIICLK must be present 16 μsec before POR transitions high.
SGMII will not be used. SRIO SRIOSGMIICLK must be present 16 μsec before POR transitions high.
will be used as a boot device.
SRIOSGMIICLK SGMII will not be used. SRIO
will be used after boot.
PCIECLK
MCMCLK
SRIOSGMIICLK is used as a source to the SRIO SerDes PLL. It must be present before the SRIO is removed
from reset and programmed.
SGMII will not be used. SRIO
will not be used.
SRIOSGMIICLK is not used and should be tied to a static state.
PCIE will be used as a boot
device.
PCIECLK must be present 16 μsec before POR transitions high.
PCIE will be used after boot.
PCIECLK is used as a source to the PCIE SerDes PLL. It must be present before the PCIE is removed from
reset and programmed.
PCIE will not be used.
PCIECLK is not used and should be tied to a static state.
HyperLink will be used as a
boot device.
MCMCLK must be present 16usec before POR transitions high.
HyperLink will be used after
boot.
MCMCLK is used as a source to the MCM SerDes PLL. It must be present before the HyperLink is
removed from reset and programmed.
HyperLink will not be used.
MCMCLK is not used and should be tied to a static state.
End of Table 7-4
7.3.2 Power-Down Sequence
The power down sequence is the exact reverse of the power-up sequence described above. The goal is to prevent a
large amount of static current and to prevent overstress of the device. A power-good circuit that monitors all the
supplies for the device should be used in all designs. If a catastrophic power supply failure occurs on any voltage rail,
POR should transition to low to prevent over-current conditions that could possibly impact device reliability.
A system power monitoring solution is needed to shut down power to the board if a power supply fails. Long-term
exposure to an environment in which one of the power supply voltages is no longer present will affect the reliability
of the device. Holding the device in reset is not an acceptable solution because prolonged periods of time with an
active reset can also affect long term reliability.
7.3.3 Power Supply Decoupling and Bulk Capacitors
In order to properly decouple the supply planes on the PCB from system noise, decoupling and bulk capacitors are
required. Bulk capacitors are used to minimize the effects of low frequency current transients and decoupling or
bypass capacitors are used to minimize higher frequency noise. For recommendations on selection of Power Supply
Decoupling and Bulk capacitors see the Hardware Design Guide for KeyStone I Devices in ‘‘Related Documentation
from Texas Instruments’’ on page 72.
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7.3.4 SmartReflex
Increasing the device complexity increases its power consumption and with the smaller transistor structures
responsible for higher achievable clock rates and increased performance, comes an inevitable penalty: increasing the
leakage currents. Leakage currents are present in any active circuit, independent of clock rates and usage scenarios.
This static power consumption is mainly determined by the transistor type and process technology used in the
manufacture of the device. Higher clock rates also increase dynamic power — the power used when transistors
switch. The dynamic power depends mostly on a specific usage scenario, clock rates, and I/O activity.
Texas Instruments' SmartReflex technology is used to decrease both static and dynamic power consumption while
maintaining device performance.
SmartReflex in the TMS320C6671 is a feature that allows the core supply voltage to be optimized based on the
process corner of the device. Voltage selection is done using four VCNTL pins that control the output voltage of the
core voltage regulator supplying the device. Each TMS320C6671 device in an application requires a separate core
voltage regulator. For information on the implementation of SmartReflex, see the Power Consumption Summary for
KeyStone C66x Devices application report and the Hardware Design Guide for KeyStone I Devices in ‘‘Related
Documentation from Texas Instruments’’ on page 72.
Table 7-5
SmartReflex 4-Pin VID Interface Switching Characteristics
(see Figure 7-5)
No.
1
Parameter
td(VCNTL[2:0]-VCNTL[3])
Min
Max
Delay Time - VCNTL[2:0] valid after VCNTL[3] low
2
toh(VCNTL[3] -VCNTL[2:0]) Output Hold Time - VCNTL[2:0] valid after VCNTL[3] low
3
td(VCNTL[2:0]-VCNTL[3])
4
toh(VCNTL[3] -VCNTL[2:0]) Output Hold Time - VCNTL[2:0] valid after VCNTL[3] high
5
VCNTL being valid to CVDD being switched to SmartReflex Voltage
Unit
300.00
ns
(1)
ms
300.00
ns
172020C
ms
10
ms
0.07 172020C
Delay Time - VCNTL[2:0] valid after VCNTL[3] high
0.07
(2)
End of Table 7-5
1 C = 1/SYSCLK1 frequency in ms
2 SmartReflex voltage must be set before execution of application code
Figure 7-5
SmartReflex 4-Pin VID Interface Timing
IV*
SRV †
* IV = Initial Voltage
†
SRV = Smart Reflex Voltage
CVDD
4
5
VCNTL[3]
1
3
VCNTL[2:0]
LSB VID[2:0]
MSB VID[5:3]
2
Note—The initial CVDD voltage (IV) at power on will be 1.1 V nominal and it must transition to the VID
set value immediately after being presented on the VCNTL pins. This is required to maintain full power
functionality and reliability targets specified by TI.
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7.4 Power Sleep Controller (PSC)
The Power Sleep Controller (PSC) controls overall device power by turning off unused power domains and gating
off clocks to individual peripherals and modules. The PSC provides the user with an interface to control several
important power and clock operations.
For information on the Power Sleep Controller, see the Power Sleep Controller (PSC) for KeyStone Devices User
Guide in ‘‘Related Documentation from Texas Instruments’’ on page 72.
7.4.1 Power Domains
The device has several power domains that can be turned on for operation or off to minimize power dissipation. The
global power/sleep controller (GPSC) is used to control the power gating of various power domains.
Table 7-6 shows the TMS320C6671 power domains.
Table 7-6
Power Domains
Domain
Block(s)
Note
Power Connection
0
Most peripheral logic
Cannot be disabled
Always on
1
Per-core TETB and System TETB
RAMs can be powered down
Software control
2
Packet Coprocessor
Logic can be powered down
Software control
3
PCIe
Logic can be powered down
Software control
4
SRIO
Logic can be powered down
Software control
5
HyperLink
Logic can be powered down
Software control
6
Reserved
Reserved
Reserved
7
MSMC RAM
MSMC RAM can be powered down
Software control
8
C66x CorePac 0, L1/L2 RAMs
L2 RAMs can sleep
Software control via C66x core. For details, see the
C66x CorePac User Guide.
9
Reserved
Reserved
Reserved
10
Reserved
Reserved
Reserved
11
Reserved
Reserved
Reserved
12
Reserved
Reserved
Reserved
13
Reserved
Reserved
Reserved
14
Reserved
Reserved
Reserved
15
Reserved
Reserved
Reserved
End of Table 7-6
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7.4.2 Clock Domains
Cock gating to each logic block is managed by the local power/sleep controllers (LPSCs) of each module. For
modules with a dedicated clock or multiple clocks, the LPSC communicates with the PLL controller to enable and
disable that module's clock(s) at the source. For modules that share a clock with other modules, the LPSC controls
the clock gating.
Table 7-7 shows the TMS320C6671 clock domains.
Table 7-7
Clock Domains
LPSC Number
Module(s)
Notes
0
Shared LPSC for all peripherals other than those listed in this table
Always on
1
SmartReflex
Always on
2
DDR3 EMIF
Always on
3
EMIF16 and SPI
Software control
4
TSIP
Software control
5
Debug Subsystem and Tracers
Software control
6
Per-core TETB and System TETB
Software control
7
Packet Accelerator
Software control
8
Ethernet SGMIIs
Software control
9
Security Accelerator
Software control
10
PCIe
Software control
11
SRIO
Software control
12
HyperLink
Software control
13
Reserved
Reserved
14
MSMC RAM
Software control
15
C66x CorePac 0 and Timer 0
Always on
16
Reserved
Reserved
17
Reserved
Reserved
18
Reserved
Reserved
19
Reserved
Reserved
20
Reserved
Reserved
21
Reserved
Reserved
22
Reserved
Reserved
No LPSC
Bootcfg, PSC, and PLL controller
These modules do not use LPSC
End of Table 7-7
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7.4.3 PSC Register Memory Map
Table 7-8 shows the PSC Register memory map.
Table 7-8
PSC Register Memory Map (Part 1 of 3)
Offset
Register
Description
0x000
PID
Peripheral Identification Register
0x004 - 0x010
Reserved
Reserved
0x014
VCNTLID
Voltage Control Identification Register
0x018 - 0x11C
Reserved
Reserved
(1)
0x120
PTCMD
Power Domain Transition Command Register
0x124
Reserved
Reserved
0x128
PTSTAT
Power Domain Transition Status Register
0x12C - 0x1FC
Reserved
Reserved
0x200
PDSTAT0
Power Domain Status Register 0 (AlwaysOn)
0x204
PDSTAT1
Power Domain Status Register 1 (Per-core TETB and System TETB)
0x208
PDSTAT2
Power Domain Status Register 2 (Packet Coprocessor)
0x20C
PDSTAT3
Power Domain Status Register 3 (PCIe)
0x210
PDSTAT4
Power Domain Status Register 4 (SRIO)
0x214
PDSTAT5
Power Domain Status Register 5 (HyperLink)
0x218
PDSTAT6
Power Domain Status Register 6 (Reserved)
0x21C
PDSTAT7
Power Domain Status Register 7 (MSMC RAM)
0x220
PDSTAT8
Power Domain Status Register 8 (C66x CorePac 0)
0x224
Reserved
Reserved
0x228
Reserved
Reserved
0x22C
Reserved
Reserved
0x230
Reserved
Reserved
0x234
Reserved
Reserved
0x238
Reserved
Reserved
0x23C
Reserved
Reserved
0x240 - 0x2FC
Reserved
Reserved
0x300
PDCTL0
Power Domain Control Register 0 (AlwaysOn)
0x304
PDCTL1
Power Domain Control Register 1 (Per-core TETB and System TETB)
0x308
PDCTL2
Power Domain Control Register 2 (Packet Coprocessor)
0x30C
PDCTL3
Power Domain Control Register 3 (PCIe)
0x310
PDCTL4
Power Domain Control Register 4 (SRIO)
0x314
PDCTL5
Power Domain Control Register 5 (HyperLink)
0x318
PDCTL6
Power Domain Control Register 6 (Reserved)
0x31C
PDCTL7
Power Domain Control Register 7 (MSMC RAM)
0x320
PDCTL8
Power Domain Control Register 8 (C66x CorePac 0)
0x324
Reserved
Reserved
0x328
Reserved
Reserved
0x32C
Reserved
Reserved
0x330
Reserved
Reserved
0x334
Reserved
Reserved
0x338
Reserved
Reserved
0x33C
Reserved
Reserved
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Table 7-8
PSC Register Memory Map (Part 2 of 3)
Offset
Register
Description
0x340 - 0x7FC
Reserved
Reserved
0x800
MDSTAT0
Module Status Register 0 (Never Gated)
0x804
MDSTAT1
Module Status Register 1 (SmartReflex)
0x808
MDSTAT2
Module Status Register 2 (DDR3 EMIF)
0x80C
MDSTAT3
Module Status Register 3 (EMIF16 and SPI)
0x810
MDSTAT4
Module Status Register 4 (TSIP)
0x814
MDSTAT5
Module Status Register 5 (Debug Subsystem and Tracers)
0x818
MDSTAT6
Module Status Register 6 (Per-core TETB and System TETB)
0x81C
MDSTAT7
Module Status Register 7 (Packet Accelerator)
0x820
MDSTAT8
Module Status Register 8 (Ethernet SGMIIs)
0x824
MDSTAT9
Module Status Register 9 (Security Accelerator)
0x828
MDSTAT10
Module Status Register 10 (PCIe)
0x82C
MDSTAT11
Module Status Register 11 (SRIO)
0x830
MDSTAT12
Module Status Register 12 (HyperLink)
0x834
MDSTAT13
Module Status Register 13 (Reserved)
0x838
MDSTAT14
Module Status Register 14 (MSMC RAM)
0x83C
MDSTAT15
Module Status Register 15 (C66x CorePac 0 and Timer 0)
0x840
MDSTAT16
Reserved
0x844
MDSTAT17
Reserved
0x848
MDSTAT18
Reserved
0x84C
MDSTAT19
Reserved
0x850
MDSTAT20
Reserved
0x854
MDSTAT21
Reserved
0x858
MDSTAT22
Reserved
0x85C - 0x9FC
Reserved
Reserved
0xA00
MDCTL0
Module Control Register 0 (Never Gated)
0xA04
MDCTL1
Module Control Register 1 (SmartReflex)
0xA08
MDCTL2
Module Control Register 2 (DDR3 EMIF)
0xA0C
MDCTL3
Module Control Register 3 (EMIF16 and SPI)
0xA10
MDCTL4
Module Control Register 4 (TSIP)
0xA14
MDCTL5
Module Control Register 5 (Debug Subsystem and Tracers)
0xA18
MDCTL6
Module Control Register 6 (Per-core TETB and System TETB)
0xA1C
MDCTL7
Module Control Register 7 (Packet Accelerator)
0xA20
MDCTL8
Module Control Register 8 (Ethernet SGMIIs)
0xA24
MDCTL9
Module Control Register 9 (Security Accelerator)
0xA28
MDCTL10
Module Control Register 10 (PCIe)
0xA2C
MDCTL11
Module Control Register 11 (SRIO)
0xA30
MDCTL12
Module Control Register 12 (HyperLink)
0xA34
MDCTL13
Module Control Register 13 (Reserved)
0xA38
MDCTL14
Module Control Register 14 (MSMC RAM)
0xA3C
MDCTL15
Module Control Register 15 (C66x CorePac 0 and Timer 0)
0xA40
MDCTL16
Reserved
0xA44
MDCTL17
Reserved
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Table 7-8
PSC Register Memory Map (Part 3 of 3)
Offset
Register
Description
0xA48
MDCTL18
Reserved
0xA4C
MDCTL19
Reserved
0xA50
MDCTL20
Reserved
0xA54
MDCTL21
Reserved
0xA58
MDCTL22
Reserved
0xA5C - 0xFFC
Reserved
Reserved
End of Table 7-8
1 VCNTLID register is available for debug purposes only.
7.5 Reset Controller
The reset controller detects the different type of resets supported on the TMS320C6671 device and manages the
distribution of those resets throughout the device.
The device has several types of resets:
• Power-on reset
• Hard reset
• Soft reset
• CPU local reset
Table 7-9 explains further the types of reset, the reset initiator, and the effects of each reset on the device. For more
information on the effects of each reset on the PLL controllers and their clocks, see Section ‘‘Reset Electrical Data /
Timing’’ on page 135
Table 7-9
Reset Type
Reset Types
Initiator
POR (Power On Reset) POR pin active low
RESETFULL pin active low
Hard Reset
RESET pin active low
Emulation
PLLCTL register (RSCTRL)
Watchdog timers
Soft Reset
RESET pin active low
PLLCTL register (RSCTRL)
Watchdog timers
C66x CorePac
local reset
Software (through
LPSC MMR)
Watchdog timers
LRESET pin
Effect on Device When Reset Occurs
RESETSTAT Pin Status
Toggles RESETSTAT pin
Total reset of the chip. Everything on the device is reset to its default
state in response to this. Activates the POR signal on chip, which is used
to reset test/emu logic. Boot configurations are latched. ROM boot
process is initiated.
Resets everything except for test/emu logic and reset isolation
modules. Emulator and reset Isolation modules stay alive during this
reset. This reset is also different from POR in that the PLLCTL assumes
power and clocks are stable when device reset is asserted. Boot
configurations are not latched. ROM boot process is initiated.
Toggles RESETSTAT pin
Toggles RESETSTAT pin
Software can program these initiators to be hard or soft. Hard reset is
the default, but can be programmed to be soft reset. Soft reset will
behave like hard reset except that EMIF16 MMRs, DDR3 EMIF MMRs, the
sticky bits in PCIe MMRs, and external memory contents are retained.
Boot configurations are not latched. ROM boot process is initiated.
MMR bit in LPSC controls C66x CorePac local reset. Used by watchdog Does not toggle
RESETSTAT pin
timers (in the event of a timeout) to reset C66x CorePac. Can also be
initiated by LRESET device pin. C66x CorePac memory system and slave
DMA port are still alive when C66x CorePac is in local reset. Provides a
local reset of the C66x CorePac, without destroying clock alignment or
memory contents. Does not initiate ROM boot process.
End of Table 7-9
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7.5.1 Power-on Reset
Power-on reset is used to reset the entire device, including the test and emulation logic.
Power-on reset is initiated by the following
1. POR pin
2. RESETFULL pin
During power-up, the POR pin must be asserted (driven low) until the power supplies have reached their normal
operating conditions. A RESETFULL pin is also provided to allow the on-board host to reset the entire device
including the reset isolated logic. The assumption is that, device is already powered up and hence unlike POR,
RESETFULL pin will be driven by the on-board host control other than the power good circuitry. For power-on
reset, the Main PLL Controller comes up in bypass mode and the PLL is not enabled. Other resets do not affect the
state of the PLL or the dividers in the PLL controller.
The following sequence must be followed during a power-on reset:
1. Wait for all power supplies to reach normal operating conditions while keeping the POR pin asserted (driven
low). While POR is asserted, all pins except RESETSTAT will be set to high-impedance. After the POR pin is
de-asserted (driven high), all Z group pins, low group pins, and high group pins are set to their reset state and
will remain at their reset state until otherwise configured by their respective peripheral. All peripherals that are
power managed, are disabled after a Power-on Reset and must be enabled through the Device State Control
registers (for more details, see Section Table 3-2 ‘‘Device State Control Registers’’ on page 74).
2. Clocks are reset, and they are propagated throughout the chip to reset any logic that was using reset
synchronously. All logic is now reset and RESETSTAT will be driven low indicating that the device is in reset.
3. POR must be held active until all supplies on the board are stable then for at least an additional time for the
Chip level PLLs to lock.
4. The POR pin can now be de-asserted. Reset sampled pin values are latched at this point. The Chip level PLLs
is taken out of reset and begins its locking sequence, and all power-on device initialization also begins.
5. After device initialization is complete, the RESETSTAT pin is de-asserted (driven high). By this time, DDR3
PLL has already completed its locking sequence and is outputting a valid clock. The system clocks of both PLL
controllers are allowed to finish their current cycles and then paused for 10 cycles of their respective system
reference clocks. After the pause, the system clocks are restarted at their default divide by settings.
6. The device is now out of reset and device execution begins as dictated by the selected boot mode.
Note—To most of the device, reset is de-asserted only when the POR and RESET pins are both de-asserted
(driven high). Therefore, in the sequence described above, if the RESET pin is held low past the low period
of the POR pin, most of the device will remain in reset. The RESET pin should not be tied together with the
POR pin.
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7.5.2 Hard Reset
A hard reset will reset everything on the device except the PLLs, test, emulation logic, and reset isolation modules.
POR should also remain de-asserted during this time.
Hard reset is initiated by the following
• RESET pin
• RSCTRL register in PLLCTL
• Watchdog timer
• Emulation
All the above initiators by default are configured to act as hard reset. Except emulation, all the other 3 initiators can
be configured as soft resets in the RSCFG register in PLLCTL.
The following sequence must be followed during a hard reset:
1. The RESET pin is pulled active low for a minimum of 24 CLKIN1 cycles. During this time the RESET signal is
able to propagate to all modules (except those specifically mentioned above). All I/O are Hi-Z for modules
affected by RESET, to prevent off-chip contention during the warm reset.
2. Once all logic is reset, RESETSTAT is driven active to denote that the device is in reset.
3. The RESET pin can now be released. A minimal device initialization begins to occur. Note that configuration
pins are not re-latched and clocking is unaffected within the device.
4. After device initialization is complete, the RESETSTAT pin is de-asserted (driven high).
Note—The POR pin should be held inactive (high) throughout the warm reset sequence. Otherwise, if POR
is activated (brought low), the minimum POR pulse width must be met. The RESET pin should not be tied
together with the POR pin.
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7.5.3 Soft Reset
A soft reset will behave like a hard reset except that EMIF16 MMRs, DDR3 EMIF MMRs and the PCIe MMRs sticky
bits, and external memory contents are retained. POR should also remain de-asserted during this time.
Soft reset is initiated by the following
• RESET pin
• RSCTRL register in PLLCTL
• Watchdog timer
All the above initiators by default are configured to act as hard reset. Except emulation, all the other 3 initiators can
be configured as soft resets in the RSCFG register in PLLCTL.
In the case of a soft reset, the clock logic or the power control logic of the peripherals are not affected, and, therefore,
the enabled/disabled state of the peripherals is not affected. On a soft reset, the DDR3 memory controller registers
are not reset. In addition, the DDR3 SDRAM memory content is retained if the user places the DDR3 SDRAM in
self-refresh mode before invoking the soft reset.
During a soft reset, the following happens:
1. The RESETSTAT pin goes low to indicate an internal reset is being generated. The reset is allowed to propagate
through the system. Internal system clocks are not affected. PLLs also remain locked.
2. After device initialization is complete, the RESETSTAT pin is deasserted (driven high). In addition, the PLL
controllers pause their system clocks for about 8 cycles.
At this point:
› The state of the peripherals before the soft reset is not changed.
› The I/O pins are controlled as dictated by the DEVSTAT register.
› The DDR3 MMRs and the PCIe MMRs sticky bits retain their previous values. Only the DDR3
Memory Controller and PCIe state machines are reset by the soft reset.
› The PLL controllers are operating in the mode prior to soft reset. System clocks are unaffected.
The boot sequence is started after the system clocks are restarted. Because the configuration pins are not latched with
a System Reset, the previous values, as shown in the DEVSTAT register, are used to select the boot mode.
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7.5.4 Local Reset
The local reset can be used to reset a particular CorePac without resetting any other chip components.
Local reset is initiated by the following (for more details see the Phase Locked Loop (PLL) for KeyStone Devices User
Guide in ‘‘Related Documentation from Texas Instruments’’ on page 72:
• LRESET pin
• Watchdog timer should cause one of the below based on the setting of the CORESEL[2:0] and RSTCFG
register in the PLL controller. See ‘‘Reset Configuration Register (RSTCFG)’’ on page 145 and ‘‘CIC Registers’’
on page 175:
– Local reset
– NMI
– NMI followed by a time delay and then a local reset for the CorePac selected
– Hard Reset by requesting reset via PLLCTL
• LPSC MMRs (memory-mapped registers)
7.5.5 Reset Priority
If any of the above reset sources occur simultaneously, the PLLCTL processes only the highest priority reset request.
The reset request priorities are as follows (high to low):
• Power-on reset
• Hard/soft reset
7.5.6 Reset Controller Register
The reset controller register are part of the PLLCTL MMRs. All C6671 device-specific MMRs are covered in Section
7.6.3 ‘‘Main PLL Control Register’’ on page 147. For more details on these registers and how to program them, see
the Phase Locked Loop (PLL) for KeyStone Devices User Guide in ‘‘Related Documentation from Texas Instruments’’
on page 72.
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7.5.7 Reset Electrical Data / Timing
Table 7-10
Reset Timing Requirements
(1)
(see Figure 7-6 and Figure 7-7)
No.
Min
Max
Unit
RESETFULL Pin Reset
1
Pulse width - Pulse width RESETFULL low
tw(RESETFULL)
500C
ns
500C
ns
Soft/Hard-Reset
2
Pulse width - Pulse width RESET low
tw(RESET)
End of Table 7-10
1 C = 1/SYSCLK1 frequency in ns.
Table 7-11
Reset Switching Characteristics Over Recommended Operating Conditions (1)
(see Figure 7-6 and Figure 7-7)
No.
Parameter
Min
Max
Unit
RESETFULL Pin Reset
3
td(RESETFULLH-RESETSTATH)
Delay time - RESETSTAT high after RESETFULL high
50000C ns
Soft/Hard Reset
4
td(RESETH-RESETSTATH)
Delay time - RESETSTAT high after RESET high
50000C ns
End of Table 7-11
1 C = 1/SYSCLK1 frequency in ns.
Figure 7-6
RESETFULL Reset Timing
POR
1
RESETFULL
RESET
3
RESETSTAT
Figure 7-7
Soft/Hard-Reset Timing
POR
RESETFULL
2
RESET
4
RESETSTAT
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Boot Configuration Timing Requirements (1)
Table 7-12
(See Figure 7-8)
No.
Min
Max
Unit
1
tsu(GPIOn-RESETFULL)
Setup time - GPIO valid before RESETFULL asserted
12C
ns
2
th(RESETFULL-GPIOn)
Hold time - GPIO valid after RESETFULL asserted
12C
ns
End of Table 7-12
1 C = 1/SYSCLK1 frequency in ns.
Figure 7-8
Boot Configuration Timing
POR
1
RESETFULL
GPIO[15:0]
2
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7.6 Main PLL and PLL Controller
This section provides a description of the Main PLL and the PLL Controller. For details on the operation of the PLL
Controller module, see the Phase Locked Loop (PLL) for KeyStone Devices User Guide in ‘‘Related Documentation
from Texas Instruments’’ on page 72.
The Main PLL is controlled by the standard PLL Controller. The PLL controller manages the clock ratios, alignment,
and gating for the system clocks to the device. Figure 7-9 shows a block diagram of the main PLL and the PLL
Controller.
Figure 7-9
Main PLL and PLL Controller
PLL
PLLD
xPLLM
CORECLK(N|P)
0
PLLOUT
OUTPUT
DIVIDE
1
BYPASS
1
0
0
1
PLLEN
0
PLLENSRC
PLL Controller
PLLDIV1
PLLDIV2
PLLDIV3
PLLDIV4
PLLDIV5
PLLDIV6
PLLDIV7
PLLDIV8
PLLDIV9
PLLDIV10
PLLDIV11
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/1
SYSCLK1
C66x
CorePac
/x
SYSCLK2
/2
SYSCLK3
/3
SYSCLK4
/y
SYSCLK5
/64
SYSCLK6
/6
SYSCLK7
To Switch Fabric,
Peripherals,
Accelerators
/z
SYSCLK8
/12
SYSCLK9
/3
SYSCLK10
/6
SYSCLK11
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Note—The Main PLL Controller registers can be accessed by any master in the device. The PLLM[5:0] bits
of the multiplier are controlled by the PLLM register inside the PLL controller and PLLM[12:6] bits are
controlled by the chip-level MAINPLLCTL0 register. The Output Divide and Bypass logic of the PLL
are controlled by fields in the SECCTL register in the PLL controller. Only PLLDIV2, PLLDIV5, and
PLLDIV8 are programmable on the C6671 device. See the Phase Locked Loop (PLL) for KeyStone Devices
User Guide in ‘‘Related Documentation from Texas Instruments’’ on page 72 for more details on how to
program the PLL controller.
The multiplication and division ratios within the PLL and the post-division for each of the chip-level clocks are
determined by a combination of this PLL and the PLL Controller. The PLL controller also controls reset propagation
through the chip, clock alignment, and test points. The PLL controller monitors the PLL status and provides an
output signal indicating when the PLL is locked.
Main PLL power is supplied externally via the Main PLL power-supply pin (AVDDA1). An external EMI filter
circuit must be added to all PLL supplies. See the Hardware Design Guide for KeyStone I Devices in ‘‘Related
Documentation from Texas Instruments’’ on page 72 for detailed recommendations. For the best performance, TI
recommends that all the PLL external components be on a single side of the board without jumpers, switches, or
components other than those shown. For reduced PLL jitter, maximize the spacing between switching signal traces
and the PLL external components (C1, C2, and the EMI Filter).
The minimum SYSCLK rise and fall times should also be observed. For the input clock timing requirements, see
Section 7.6.5 ‘‘Main PLL Controller/SRIO/HyperLink/PCIe Clock Input Electrical Data/Timing’’.
Note—The PLL controller module as described in the see the Phase Locked Loop (PLL) for KeyStone Devices
User Guide in ‘‘Related Documentation from Texas Instruments’’ on page 72 includes a superset of features,
some of which are not supported on the TMS320C6671 device. The following sections describe the registers
that are supported; it should be assumed that any registers not included in these sections is not supported
by the device. Furthermore, only the bits within the registers described here are supported. Avoid writing to
any reserved memory location or changing the value of reserved bits.
7.6.1 Main PLL Controller Device-Specific Information
7.6.1.1 Internal Clocks and Maximum Operating Frequencies
The Main PLL, used to drive the CorePacs, the switch fabric, and a majority of the peripheral clocks (all but the
DDR3 and the network coprocessor (PASS)) requires a PLL controller to manage the various clock divisions, gating,
and synchronization. The Main PLL Controller has several SYSCLK outputs that are listed below, along with the
clock description. Each SYSCLK has a corresponding divider that divides down the output clock of the PLL. Note
that dividers are not programmable unless explicitly mentioned in the description below.
• SYSCLK1: Full-rate clock for the CorePac.
• SYSCLK2: 1/x-rate clock for CorePac (emulation). Default rate for this is 1/3. This is programmable from /1
to /32, where this clock does not violate the max of 350 MHz. The SYSCLK2 can be turned off by software.
• SYSCLK3: 1/2-rate clock used to clock the MSMC, HyperLink, CPU/2 TeraNet, DDR EMIF and CPU/2
EDMA.
• SYSCLK4: 1/3-rate clock for the switch fabrics and fast peripherals. The Debug_SS and ETBs use this as well.
• SYSCLK5: 1/y-rate clock for system trace module, only. Default rate for this is 1/5. It is configurable and the
max configurable clock is 210 MHz and min configuration clock is 32 MHz. The SYSCLK5 can be turned off
by software.
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•
•
•
•
•
•
SYSCLK6: 1/64-rate clock. 1/64 rate clock (emif_ptv) used to clock the PVT compensated buffers for DDR3
EMIF.
2
SYSCLK7: 1/6-rate clock for slow peripherals (GPIO, UART, Timer, I C, SPI, EMIF16, etc.) and sources the
SYSCLKOUT output pin.
SYSCLK8: 1/z-rate clock. This clock is used as slow_sysclk in the system. Default for this will be 1/64. This is
programmable from /24 to /80.
SYSCLK9: 1/12-rate clock for SmartReflex.
SYSCLK10: 1/3-rate clock for SRIO only.
SYSCLK11: 1/6-rate clock for PSC only.
Only SYSCLK2, SYSCLK5, and SYSCLK8 are programmable on the TMS320C6671 device.
Note—In case any of the other programmable SYSCLKs are set slower than 1/64 rate, then SYSCLK8
(SLOW_SYSCLK) must be programmed to either match, or be slower than, the slowest SYSCLK in the
system.
7.6.1.2 Main PLL Controller Operating Modes
The Main PLL Controller has two modes of operation: bypass mode and PLL mode. The mode of operation is
determined by BYPASS bit of the PLL Secondary control register (SECCTL). In PLL mode, SYSCLK1 is generated
from the PLL output using the values set in PLLM and PLLD bit fields in the MAINPLLCTL0 register. In bypass
mode, PLL input is fed directly out as SYSCLK1.
All hosts must hold off accesses to the DSP while the frequency of its internal clocks is changing. A mechanism must
be in place such that the DSP notifies the host when the PLL configuration has completed.
7.6.1.3 Main PLL Stabilization, Lock, and Reset Times
The PLL stabilization time is the amount of time that must be allotted for the internal PLL regulators to become
stable after device powerup. The PLL should not be operated until this stabilization time has elapsed.
The PLL reset time is the amount of wait time needed when resetting the PLL (writing PLLRST = 1), in order for the
PLL to properly reset, before bringing the PLL out of reset (writing PLLRST = 0). For the Main PLL reset time value,
see Table 7-13.
The PLL lock time is the amount of time needed from when the PLL is taken out of reset (PLLRST = 1) to when to
when the PLL Controller can be switched to PLL mode. The Main PLL lock time is given in Table 7-13.
Table 7-13
Main PLL Stabilization, Lock, and Reset Times
Min
PLL stabilization time
Max
Unit
100
PLL lock time
PLL reset time
Typ
μs
500×(PLLD
(1)
+1)×C
(2)
1000
ns
End of Table 7-13
1 PLLD is the value in PLLD bit fields of MAINPLLCTL0 register
2 C = SYSCLK1 cycle time in ns.
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7.6.2 PLL Controller Memory Map
The memory map of the PLL Controller is shown in Table 7-14. TMS320C6671-specific PLL Controller register
definitions can be found in the sections following Table 7-14. For other registers in the table, see the Phase Locked
Loop (PLL) for KeyStone Devices User Guide in ‘‘Related Documentation from Texas Instruments’’ on page 72.
Note—Only registers documented here are accessible on the TMS320C6671. Other addresses in the PLL
Controller memory map including the reserved registers should not be modified. Furthermore, only the bits
within the registers described here are supported. Avoid writing to any reserved memory location or
changing the value of reserved bits. It is recommended to use read-modify-write sequence to make any
changes to the valid bits in the register.
Table 7-14
PLL Controller Registers (Including Reset Controller) (Part 1 of 2)
Hex Address Range
Field
Register Name
0231 0000 - 0231 00E3
-
Reserved
0231 00E4
RSTYPE
Reset Type Status Register (Reset Controller)
0231 00E8
RSTCTRL
Software Reset Control Register (Reset Controller)
0231 00EC
RSTCFG
Reset Configuration Register (Reset Controller)
0231 00F0
RSISO
Reset Isolation Register (Reset Controller)
0231 00F0 - 0231 00FF
-
Reserved
0231 0100
PLLCTL
PLL Control Register
0231 0104
-
Reserved
0231 0108
SECCTL
PLL Secondary Control Register
0231 010C
-
Reserved
0231 0110
PLLM
PLL Multiplier Control Register
0231 0114
-
Reserved
0231 0118
PLLDIV1
Reserved
0231 011C
PLLDIV2
PLL Controller Divider 2 Register
0231 0120
PLLDIV3
Reserved
0231 0124
-
Reserved
0231 0128
-
Reserved
0231 012C - 0231 0134
-
Reserved
0231 0138
PLLCMD
PLL Controller Command Register
0231 013C
PLLSTAT
PLL Controller Status Register
0231 0140
ALNCTL
PLL Controller Clock Align Control Register
0231 0144
DCHANGE
PLLDIV Ratio Change Status Register
0231 0148
CKEN
Reserved
0231 014C
CKSTAT
Reserved
0231 0150
SYSTAT
SYSCLK Status Register
0231 0154 - 0231 015C
-
Reserved
0231 0160
PLLDIV4
Reserved
0231 0164
PLLDIV5
PLL Controller Divider 5 Register
0231 0168
PLLDIV6
Reserved
0231 016C
PLLDIV7
Reserved
0231 0170
PLLDIV8
PLL Controller Divider 8 Register
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Table 7-14
PLL Controller Registers (Including Reset Controller) (Part 2 of 2)
Hex Address Range
Field
Register Name
0231 0174 - 0231 0193
PLLDIV9 - PLLDIV16
Reserved
0231 0194 - 0231 01FF
-
Reserved
End of Table 7-14
7.6.2.1 PLL Secondary Control Register (SECCTL)
The PLL Secondary Control Register contains extra fields to control the Main PLL and is shown in Figure 7-10 and
described in Table 7-15.
Figure 7-10
PLL Secondary Control Register (SECCTL))
31
24
23
22
19
18
0
Reserved
BYPASS
OUTPUT DIVIDE
Reserved
R-0000 0000
RW-0
RW-0001
RW-001 0000 0000 0000 0000
Legend: R/W = Read/Write; R = Read only; -n = value after reset
Table 7-15
PLL Secondary Control Register (SECCTL) Field Descriptions
Bit
Field
Description
31-24
Reserved
Reserved
23
BYPASS
22-19
OUTPUT DIVIDE
Output Divider ratio bits.
0h = ÷1. Divide frequency by 1.
1h = ÷2. Divide frequency by 2.
2h - Fh = Reserved.
18-0
Reserved
Reserved
Main PLL Bypass Enable
0 = Main PLL Bypass disabled
1 = Main PLL Bypass enabled
End of Table 7-15
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7.6.2.2 PLL Controller Divider Register (PLLDIV2, PLLDIV5, PLLDIV8)
The PLL controller divider registers (PLLDIV2, PLLDIV5, and PLLDIV8) are shown in Figure 7-11 and described
in Table 7-16. The default values of the RATIO field on a reset for PLLDIV2, PLLDIV5, and PLLDIV8 are different
and mentioned in the footnote of Figure 7-11.
Figure 7-11
PLL Controller Divider Register (PLLDIVn)
31
16
Reserved
15
Dn
R-0
(1)
14
8
EN
7
Reserved
R/W-1
0
RATIO
R-0
R/W-n
(2)
Legend: R/W = Read/Write; R = Read only; -n = value after reset
1 D2EN for PLLDIV2; D5EN for PLLDIV5; D8EN for PLLDIV8
2 n=02h for PLLDIV2; n=04h for PLLDIV5; n=3Fh for PLLDIV8
Table 7-16
PLL Controller Divider Register (PLLDIVn) Field Descriptions
Bit
Field
Description
31-16
Reserved
Reserved.
15
DnEN
Divider Dn enable bit. (see footnote of Figure 7-11)
0 = Divider n is disabled.
1 = No clock output. Divider n is enabled.
14-8
Reserved
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
7-0
RATIO
Divider ratio bits. (see footnote of Figure 7-11)
0h = ÷1. Divide frequency by 1.
1h = ÷2. Divide frequency by 2.
2h = ÷3. Divide frequency by 3.
3h = ÷4. Divide frequency by 4.
4h - 4Fh = ÷5 to ÷80. Divide frequency by 5 to divide frequency by 80.
End of Table 7-16
7.6.2.3 PLL Controller Clock Align Control Register (ALNCTL)
The PLL Controller clock align control register (ALNCTL) is shown in Figure 7-12 and described in Table 7-17.
Figure 7-12
PLL Controller Clock Align Control Register (ALNCTL)
31
8
7
6
5
4
3
2
1
0
Reserved
ALN8
Reserved
ALN5
Reserved
ALN2
Reserved
R-0
R/W-1
R-0
R/W-1
R-0
R/W-1
R-0
Legend: R/W = Read/Write; R = Read only; -n = value after reset, for reset value
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Table 7-17
Bit
PLL Controller Clock Align Control Register (ALNCTL) Field Descriptions
Field
Description
Reserved
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
7
ALN8
4
ALN5
1
ALN2
SYSCLKn alignment. Do not change the default values of these fields.
0 = Do not align SYSCLKn to other SYSCLKs during GO operation. If SYSn in DCHANGE is set, SYSCLKn switches to the new
ratio immediately after the GOSET bit in PLLCMD is set.
1 = Align SYSCLKn to other SYSCLKs selected in ALNCTL when the GOSET bit in PLLCMD is set and SYSn in DCHANGE is 1.
The SYSCLKn rate is set to the ratio programmed in the RATIO bit in PLLDIVn.
31-8
6-5
3-2
0
End of Table 7-17
7.6.2.4 PLLDIV Divider Ratio Change Status Register (DCHANGE)
Whenever a different ratio is written to the PLLDIVn registers, the PLLCTL flags the change in the DCHANGE
status register. During the GO operation, the PLL Controller will change only the divide ratio of the SYSCLKs with
the bit set in DCHANGE. Note that the ALNCTL register determines if that clock also needs to be aligned to other
clocks. The PLLDIV divider ratio change status register is shown in Figure 7-13 and described in Table 7-18.
Figure 7-13
PLLDIV Divider Ratio Change Status Register (DCHANGE)
31
8
7
6
5
4
3
2
1
0
Reserved
SYS8
Reserved
SYS5
Reserved
SYS2
Reserved
R-0
R/W-0
R-0
R/W-0
R-0
R/W-0
R-0
Legend: R/W = Read/Write; R = Read only; -n = value after reset, for reset value
Table 7-18
Bit
PLLDIV Divider Ratio Change Status Register (DCHANGE) Field Descriptions
Field
Description
Reserved
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
7
SYS8
4
SYS5
1
SYS2
Identifies when the SYSCLKn divide ratio has been modified.
0 = SYSCLKn ratio has not been modified. When GOSET is set, SYSCLKn will not be affected.
1 = SYSCLKn ratio has been modified. When GOSET is set, SYSCLKn will change to the new ratio.
31-8
6-5
3-2
0
End of Table 7-18
7.6.2.5 SYSCLK Status Register (SYSTAT)
The SYSCLK status register (SYSTAT) shows the status of SYSCLK[11:1]. SYSTAT is shown in Figure 7-14 and
described in Table 7-19.
SYSCLK Status Register (SYSTAT)
Figure 7-14
31
11
Reserved
R-n
10
9
SYS11ON SYS10ON
R-1
R-1
8
7
6
5
4
3
2
1
0
SYS9ON
SYS8ON
SYS7ON
SYS6ON
SYS5ON
SYS4ON
SYS3ON
SYS2ON
SYS1ON
R-1
R-1
R-1
R-1
R-1
R-1
R-1
R-1
R-1
Legend: R/W = Read/Write; R = Read only; -n = value after reset
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Table 7-19
SYSCLK Status Register (SYSTAT) Field Descriptions
Bit
Field
31-11
Reserved
Description
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
(1)
SYS[N ]ON
10-0
SYSCLK[N] on status.
0 = SYSCLK[N] is gated.
1 = SYSCLK[N] is on.
End of Table 7-19
1 Where N = 1, 2, 3,....N (Not all these output clocks may be used on a specific device. For more information, see the device-specific data manual)
7.6.2.6 Reset Type Status Register (RSTYPE)
The reset type status (RSTYPE) register latches the cause of the last reset. If multiple reset sources occur
simultaneously, this register latches the highest priority reset source. The Reset Type Status Register is shown in
Figure 7-15 and described in Table 7-20.
Figure 7-15
31
Reset Type Status Register (RSTYPE)
29
28
27
12
11
8
7
3
2
1
0
Reserved
EMU-RST
Reserved
WDRST[N]
Reserved
PLLCTRLRST
RESET
POR
R-0
R-0
R-0
R-0
R-0
R-0
R-0
R-0
Legend: R = Read only; -n = value after reset
Table 7-20
Reset Type Status Register (RSTYPE) Field Descriptions
Bit
Field
Description
31-29
Reserved
Reserved. Read only. Always reads as 0. Writes have no effect.
28
EMU-RST
Reset initiated by emulation.
0 = Not the last reset to occur.
1 = The last reset to occur.
27-12
Reserved
Reserved. Read only. Always reads as 0. Writes have no effect.
11
WDRST3
10
WDRST2
9
WDRST1
Reset initiated by watchdog timer[N].
0 = Not the last reset to occur.
1 = The last reset to occur.
8
WDRST0
7-3
Reserved
Reserved. Read only. Always reads as 0. Writes have no effect.
2
PLLCTLRST
Reset initiated by PLLCTL.
0 = Not the last reset to occur.
1 = The last reset to occur.
1
RESET
RESET reset.
0 = RESET was not the last reset to occur.
1 = RESET was the last reset to occur.
0
POR
Power-on reset.
0 = Power-on reset was not the last reset to occur.
1 = Power-on reset was the last reset to occur.
End of Table 7-20
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7.6.2.7 Reset Control Register (RSTCTRL)
This register contains a key that enables writes to the MSB of this register and the RSTCFG register. The key value
is 0x5A69. A valid key will be stored as 0x000C, any other key value is invalid. When the RSTCTRL or the RSTCFG
is written, the key is invalidated. Every write must be set up with a valid key. The Software Reset Control Register
(RSTCTRL) is shown in Figure 7-16 and described in Table 7-21.
Figure 7-16
Reset Control Register (RSTCTRL)
31
17
16
Reserved
15
0
SWRST
R-0x0000
R/W-0x
KEY
(1)
R/W-0x0003
Legend: R = Read only; -n = value after reset;
1 Writes are conditional based on valid key.
Table 7-21
Bit
Reset Control Register (RSTCTRL) Field Descriptions
Field
Description
31-17
Reserved
Reserved.
16
SWRST
Software reset
0 = Reset
1 = Not reset
15-0
KEY
Key used to enable writes to RSTCTRL and RSTCFG.
End of Table 7-21
7.6.2.8 Reset Configuration Register (RSTCFG)
This register is used to configure the type of reset initiated by RESET, watchdog timer and the PLL Controller’s
RSTCTRL Register; i.e., a hard reset or a soft reset. By default, these resets will be hard resets. The Reset
Configuration Register (RSTCFG) is shown in Figure 7-17 and described in Table 7-22.
Figure 7-17
Reset Configuration Register (RSTCFG)
31
14
Reserved
13
12
PLLCTLRSTTYPE
R-0
R/W-0
(2)
11
RESETTYPE
R/W-0
2
4
Reserved
R-0
3
0
WDTYPE[N
(1)
]
2
R/W-0
Legend: R = Read only; R/W = Read/Write; -n = value after reset
1 Where N = 1, 2, 3,....N (Not all these output may be used on a specific device. For more information, see the device-specific data manual)
2 Writes are conditional based on valid key. For details, see Section 7.6.2.7 ‘‘Reset Control Register (RSTCTRL)’’.
Table 7-22
Bit
Reset Configuration Register (RSTCFG) Field Descriptions (Part 1 of 2)
Field
Description
31-14
Reserved
Reserved.
13
PLLCTLRSTTYPE
PLL Controller initiates a software-driven reset of type:
0 = Hard reset (default)
1 = Soft reset
12
RESETTYPE
RESET initiates a reset of type:
0 = Hard reset (default)
1 = Soft reset
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Table 7-22
Reset Configuration Register (RSTCFG) Field Descriptions (Part 2 of 2)
Bit
Field
Description
11-4
Reserved
Reserved.
3
WDTYPE3
2
WDTYPE2
1
WDTYPE1
Watchdog timer [N] initiates a reset of type:
0 = Hard reset (default)
1 = Soft reset
0
WDTYPE0
End of Table 7-22
7.6.2.9 Reset Isolation Register (RSISO)
This register is used to select the module clocks that must maintain their clocking without pausing through non
power-on reset. Setting any of these bits effectively blocks reset to all PLLCTL registers in order to maintain current
values of PLL multiplier, divide ratios and other settings. Along with setting module specific bit in RSISO, the
corresponding MDCTLx[12] bit also must be set in PSC to reset isolate a particular module. For more information
on MDCTLx register see the Power Sleep Controller (PSC) for KeyStone Devices User Guide in ‘‘Related
Documentation from Texas Instruments’’ on page 72. The Reset Isolation Register (RSTCTRL) is shown in
Figure 7-18 and described in Table 7-23.
Figure 7-18
Reset Isolation Register (RSISO)
31
10
9
8
7
0
Reserved
SRIOISO
SRISO
Reserved
R-0
R/W-0
R/W-0
R-0
Legend: R = Read only; R/W = Read/Write; -n = value after reset
Table 7-23
Reset Isolation Register (RSISO) Field Descriptions
Bit
Field
Description
31-10
Reserved
Reserved.
9
SRIOISO
Isolate SRIO module
0 = Not reset isolated
1 = Reset Isolated
8
SRISO
Isolate SmartReflex
0 = Not reset isolated
1 = Reset Isolated
7-0
Reserved
Reserved.
End of Table 7-23
Note—The boot ROM code will enable the reset isolation for both SRIO and SmartReflex modules during
boot with the Reset Isolation Register. It is up to the user application to disable.
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7.6.3 Main PLL Control Register
The Main PLL uses two chip-level registers (MAINPLLCTL0 and MAINPLLCTL1) along with the PLL Controller
for its configuration. These MMRs exist inside the Bootcfg space. To write to these registers, software should go
through an un-locking sequence using KICK0/KICK1 registers. For valid configurable values into the
MAINPLLCTL0 and MAINPLLCTL1 registers see Section 2.5.4 ‘‘PLL Boot Configuration Settings’’ on page 38. See
section 3.3.4 ‘‘Kicker Mechanism Register (KICK0 and KICK1)’’ on page 80 for the address location of the registers
and locking and unlocking sequences for accessing the registers. The registers are reset on POR only.
Figure 7-19
Main PLL Control Register 0 (MAINPLLCTL0)
31
24
23
19
18
12
11
6
5
0
BWADJ[7:0]
Reserved
PLLM[12:6]
Reserved
PLLD
RW-0000 0101
RW-0000 0
RW-0000000
RW-000000
RW-000000
Legend: RW = Read/Write; -n = value after reset
Table 7-24
Main PLL Control Register 0 (MAINPLLCTL0) Field Descriptions
Bit
Field
Description
31-24
BWADJ[7:0]
BWADJ[11:8] and BWADJ[7:0] are located in MAINPLLCTL0 and MAINPLLCTL1 registers. The combination (BWADJ[11:0])
should be programmed to a value related to PLLM[12:0] value based on the equation: BWADJ = ((PLLM+1)>>1) - 1
23-19
Reserved
Reserved
18-12
PLLM[12:6]
A 13-bit bus that selects the values for the multiplication factor (see Note— below)
11-6
Reserved
Reserved
5-0
PLLD
A 6-bit bus that selects the values for the reference divider
End of Table 7-24
Figure 7-20
Main PLL Control Register 1 (MAINPLLCTL1)
31
7
6
5
4
3
0
Reserved
ENSAT
Reserved
BWADJ[11:8]
RW-0000000000000000000000000
RW-0
RW-00
RW-0000
Legend: RW = Read/Write; -n = value after reset
Table 7-25
Main PLL Control Register 1 (MAINPLLCTL1) Field Descriptions
Bit
Field
Description
31-7
Reserved
Reserved
6
ENSAT
Must be set to 1 for proper operation of PLL
5-4
Reserved
Reserved
3-0
BWADJ[11:8]
BWADJ[11:8] and BWADJ[7:0] are located in MAINPLLCTL0 and MAINPLLCTL1 registers. The combination (BWADJ[11:0])
should be programmed to a value related to PLLM[12:0] value based on the equation: BWADJ = ((PLLM+1)>>1) - 1
End of Table 7-25
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Note—PLLM[5:0] bits of the multiplier is controlled by the PLLM register inside the PLL Controller
and PLLM[12:6] bits are controlled by the MAINPLLCTL0 chip-level register. The MAINPLLCTL0 register
PLLM[12:6] bits should be written just before writing to the PLLM register PLLM[5:0] bits in the controller
to have the complete 13 bit value latched when the GO operation is initiated in the PLL controller. See the
Phase Locked Loop (PLL) for KeyStone Devices User Guide in ‘‘Related Documentation from Texas
Instruments’’ on page 72 for the recommended programming sequence. Output divide ratio and Bypass
enable/disable of the Main PLL is controlled by the SECCTL register in the PLL Controller. See the
7.6.2.1 ‘‘PLL Secondary Control Register (SECCTL)’’ for more details.
7.6.4 Main PLL and PLL Controller Initialization Sequence
See the Phase Locked Loop (PLL) for KeyStone Devices User Guide in ‘‘Related Documentation from Texas
Instruments’’ on page 72 for details on the initialization sequence for Main PLL and PLL Controller.
7.6.5 Main PLL Controller/SRIO/HyperLink/PCIe Clock Input Electrical Data/Timing
Table 7-26
Main PLL Controller/SRIO/HyperLink/PCIe Clock Input Timing Requirements (1) (Part 1 of 2)
(see Figure 7-21 and Figure 7-22)
No.
Min
Max
3.2
25
Unit
CORECLK[P:N]
1
tc(CORCLKN)
Cycle time _ CORECLKN cycle time
ns
1
tc(CORECLKP)
Cycle time _ CORECLKP cycle time
3.2
25
ns
3
tw(CORECLKN)
Pulse width _ CORECLKN high
0.45*tc(CORECLKN)
0.55*tc(CORECLKN)
ns
2
tw(CORECLKN)
Pulse width _ CORECLKN low
0.45*tc(CORECLKN)
0.55*tc(CORECLKN)
ns
2
tw(CORECLKP)
Pulse width _ CORECLKP high
0.45*tc(CORECLKP)
0.55*tc(CORECLKP)
ns
3
tw(CORECLKP)
Pulse width _ CORECLKP low
0.45*tc(CORECLKP)
0.55*tc(CORECLKP)
ns
4
tr(CORECLK_250mv)
Transition time _ CORECLK differential rise time
(250mV)
50
350
ps
4
tf(CORECLK_250mv)
Transition time _ CORECLK differential fall time (250mV)
50
350
ps
5
tj(CORECLKN)
Jitter, peak_to_peak _ periodic CORECLKN
0.02*tc(CORECLKN)
ps
5
tj(CORECLKP)
Jitter, peak_to_peak _ periodic CORECLKP
0.02*tc(CORECLKP)
ps
1
tc(SRIOSGMIICLKN)
Cycle time _ SRIOSGMIICLKN cycle time
1
tc(SRIOSGMIICLKP)
Cycle time _ SRIOSGMIICLKP cycle time
3.2 or 4 or 6.4
ns
3
tw(SRIOSGMIICLKN)
Pulse width _ SRIOSGMIICLKN high
0.45*tc(SRIOSGMIICLKN) 0.55*tc(SRIOSGMIICLKN)
ns
2
tw(SRIOSGMIICLKN)
Pulse width _ SRIOSGMIICLKN low
0.45*tc(SRIOSGMIICLKN) 0.55*tc(SRIOSGMIICLKN)
ns
2
tw(SRIOSGMIICLKP)
Pulse width _ SRIOSGMIICLKP high
0.45*tc(SRIOSGMIICLKP)
0.55*tc(SRIOSGMIICLKP)
ns
3
tw(SRIOSGMIICLKP)
Pulse width _ SRIOSGMIICLKP low
0.45*tc(SRIOSGMIICLKP)
0.55*tc(SRIOSGMIICLKP)
ns
4
tr(SRIOSGMIICLK_
250mv)
Transition time _ SRIOSGMIICLK differential rise time
(250 mV)
50
350
ps
4
tf(SRIOSGMIICLK_
250mv)
Transition time _ SRIOSGMIICLK differential fall time
(250 mV)
50
350
ps
5
tj(SRIOSGMIICLKN)
Jitter, peak_to_peak _ periodic SRIOSGMIICLKN
4
(2)
ps,RMS
(2)
ps,RMS
SRIOSGMIICLK[P:N]
3.2 or 4 or 6.4
ns
5
tj(SRIOSGMIICLKP)
Jitter, peak_to_peak _ periodic SRIOSGMIICLKP
4
5
tj(SRIOSGMIICLKN)
Jitter, peak_to_peak _ periodic SRIOSGMIICLKN (SRIO
not used)
8 (2) ps,RMS
5
tj(SRIOSGMIICLKP)
Jitter, peak_to_peak _ periodic SRIOSGMIICLKP (SRIO
not used)
8
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Table 7-26
Main PLL Controller/SRIO/HyperLink/PCIe Clock Input Timing Requirements (1) (Part 2 of 2)
(see Figure 7-21 and Figure 7-22)
No.
Min
Max
Unit
HyperLinkCLK[P:N]
1
tc(MCMCLKN)
Cycle time _ MCMCLKN cycle time
3.2 or 4 or 6.4
ns
1
tc(MCMCLKP)
Cycle time _ MCMCLKP cycle time
3
tw(MCMCLKN)
Pulse width _ MCMCLKN high
0.45*tc(MCMCLKN)
3.2 or 4 or 6.4
0.55*tc(MCMCLKN)
ns
2
tw(MCMCLKN)
Pulse width _ MCMCLKN low
0.45*tc(MCMCLKN)
0.55*tc(MCMCLKN)
ns
2
tw(MCMCLKP)
Pulse width _ MCMCLKP high
0.45*tc(MCMCLKP)
0.55*tc(MCMCLKP)
ns
3
tw(MCMCLKP)
Pulse width _ MCMCLKP low
0.45*tc(MCMCLKP)
0.55*tc(MCMCLKP)
ns
4
tr(MCMCLK_250mv)
Transition time _ MCMCLK differential rise time (250mV)
50
350
ps
4
tf(MCMCLK_250mv)
Transition time _ MCMCLK differential fall time (250mV)
50
350
ps
5
tj(MCMCLKN)
Jitter, peak_to_peak _ periodic MCMCLKN
4
(2)
ps,RMS
5
tj(MCMCLKP)
Jitter, peak_to_peak _ periodic MCMCLKP
4
(2)
ps,RMS
ns
PCIECLK[P:N]
1
tc(PCIECLKN)
Cycle time _ PCIECLKN cycle time
3.2 or 4 or 6.4 or 10
ns
1
tc(PCIECLKP)
Cycle time _ PCIECLKP cycle time
3.2 or 4 or 6.4 or 10
ns
3
tw(PCIECLKN)
Pulse width _ PCIECLKN high
0.45*tc(PCIECLKN)
0.55*tc(PCIECLKN)
ns
2
tw(PCIECLKN)
Pulse width _ PCIECLKN low
0.45*tc(PCIECLKN)
0.55*tc(PCIECLKN)
ns
2
tw(PCIECLKP)
Pulse width _ PCIECLKP high
0.45*tc(PCIECLKP)
0.55*tc(PCIECLKP)
ns
3
tw(PCIECLKP)
Pulse width _ PCIECLKP low
0.45*tc(PCIECLKP)
0.55*tc(PCIECLKP)
ns
4
tr(PCIECLK_250mv)
Transition time _ PCIECLK differential rise time (250 mV)
50
350
ps
4
tf(PCIECLK_250mv)
Transition time _ PCIECLK differential fall time (250 mV)
50
350
ps
5
tj(PCIECLKN)
Jitter, peak_to_peak _ periodic PCIECLKN
4 (2) ps,RMS
5
tj(PCIECLKP)
Jitter, peak_to_peak _ periodic PCIECLKP
4
(2)
ps,RMS
End of Table 7-26
1 See the Hardware Design Guide for KeyStone I Devices in ‘‘Related Documentation from Texas Instruments’’ on page 72 for detailed recommendations.
2 The jitter frequency mask shown in the Hardware Design Guide for KeyStone Devices in ‘‘Related Documentation from Texas Instruments’’ on page 72 must also be met for
the specific operating mode chosen.
Figure 7-21
Main PLL Controller/SRIO/HyperLink/PCIe Clock Input Timing
1
2
3
<CLK_NAME>CLKN
<CLK_NAME>CLKP
4
Figure 7-22
5
Main PLL Clock Input Transition Time
peak-to-peak Differential Input
Voltage (250 mV to 2 V)
0
200 mV Transition Voltage Range
TR = 50 ps Min to 350 ps Max
for the 200-mV Transition Voltage Range
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7.7 DD3 PLL
The DDR3 PLL generates interface clocks for the DDR3 memory controller. When coming out of power-on reset,
the DDR3 PLL is programmed to a valid frequency during the boot config before being enabled and used.
DDR3 PLL power is supplied externally via the DDR3 PLL power-supply pin (AVDDA2). An external EMI filter
circuit must be added to all PLL supplies. See the Hardware Design Guide for KeyStone I Devices in ‘‘Related
Documentation from Texas Instruments’’ on page 72. For the best performance, TI recommends that all the PLL
external components be on a single side of the board without jumpers, switches, or components other than those
shown. For reduced PLL jitter, maximize the spacing between switching signal traces and the PLL external
components (C1, C2, and the EMI filter).
Figure 7-23 shows the DDR3 PLL.
Figure 7-23
DDR3 PLL Block Diagram
DDR3 PLL
PLLD
xPLLM
/2
0
DDRCLK(N|P)
PLLOUT
DDR3
PHY
1
BYPASS
7.7.1 DDR3 PLL Control Register
The DDR3 PLL, which is used to drive the DDR PHY for the EMIF, does not use a PLL controller. DDR3 PLL can
be controlled using the DDR3PLLCTL0 and DDR3PLLCTL1 registers located in the Bootcfg module. These MMRs
(memory-mapped registers) exist inside the Bootcfg space. To write to these registers, software should go through
an un-locking sequence using KICK0/KICK1 registers. For suggested configurable values see 2.5.4 ‘‘PLL Boot
Configuration Settings’’ on page 38. See section 3.3.4 ‘‘Kicker Mechanism Register (KICK0 and KICK1)’’ on
page 80 for the address location of the registers and locking and unlocking sequences for accessing the registers. This
register is reset on POR only.
.
DDR3 PLL Control Register 0 (DDR3PLLCTL0) (1)
Figure 7-24
31
24
23
22
19
18
6
5
0
BWADJ[7:0]
BYPASS
Reserved
PLLM
PLLD
RW-0000 1001
RW-0
RW-0001
RW-0000000010011
RW-000000
Legend: RW = Read/Write; -n = value after reset
1 This register is reset on POR only. The regreset, reset, and bgreset from PLL are all tied to a common pll0_ctrl_rst_n The pwrdn, regpwrdn, bgpwrdn are all tied to common
pll0_ctrl_to_pll_pwrdn.
Table 7-27
DDR3 PLL Control Register 0 Field Descriptions (Part 1 of 2)
Bit
Field
Description
31-24
BWADJ[7:0]
BWADJ[11:8] and BWADJ[7:0] are located in DDR3PLLCTL0 and DDR3PLLCTL1 registers. The combination (BWADJ[11:0])
should be programmed to a value related to PLLM[12:0] value based on the equation: BWADJ = ((PLLM+1)>>1) - 1
23
BYPASS
Enable bypass mode
0 = Bypass disabled
1 = Bypass enabled
22-19
Reserved
Reserved
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Table 7-27
DDR3 PLL Control Register 0 Field Descriptions (Part 2 of 2)
Bit
Field
Description
18-6
PLLM
A 13-bit bus that selects the values for the multiplication factor
5-0
PLLD
A 6-bit bus that selects the values for the reference divider
End of Table 7-27
Figure 7-25
DDR3 PLL Control Register 1 (DDR3PLLCTL1)
31
14
13
12
7
6
5
4
3
0
Reserved
PLLRST
Reserved
ENSAT
Reserved
BWADJ[11:8]
RW-000000000000000000
RW-0
RW-000000
RW-0
R-0
RW-0000
Legend: RW = Read/Write; -n = value after reset
Table 7-28
DDR3 PLL Control Register 1 Field Descriptions
Bit
Field
Description
31-14
Reserved
Reserved
13
PLLRST
PLL reset bit.
0 = PLL reset is released.
1 = PLL reset is asserted.
12-7
Reserved
Reserved
6
ENSAT
Must be set to 1 for proper operation of PLL
5-4
Reserved
Reserved
3-0
BWADJ[11:8]
BWADJ[11:8] and BWADJ[7:0] are located in DDR3PLLCTL0 and DDR3PLLCTL1 registers. The combination (BWADJ[11:0])
should be programmed to a value related to PLLM[12:0] value based on the equation: BWADJ = ((PLLM+1)>>1) - 1
End of Table 7-28
7.7.2 DDR3 PLL Device-Specific Information
As shown in Figure 7-23, the output of DDR3 PLL (PLLOUT) is divided by 2 and directly fed to the DDR3 memory
controller. The DDR3 PLL is affected by power-on reset. During power-on resets, the internal clocks of the DDR3
PLL are affected as described in Section 7.5 ‘‘Reset Controller’’ on page 130. DDR3 PLL is unlocked only during the
power-up sequence and is locked by the time the RESETSTAT pin goes high. It does not lose lock during any of the
other resets.
7.7.3 DDR3 PLL Initialization Sequence
See the Phase Locked Loop (PLL) for KeyStone Devices User Guide in ‘‘Related Documentation from Texas
Instruments’’ on page 72 for details on the initialization sequence for DDR3 PLL.
Note—The DDR3 interface must reset every time the DDR3 PLL is re-programmed.
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7.7.4 DDR3 PLL Input Clock Electrical Data/Timing
Table 7-29
DDR3 PLL DDRSYSCLK1(N|P) Timing Requirements
(see Figure 7-26 and Figure 7-22)
No.
Min
Max
Unit
DDRCLK[P:N]
1
tc(DDRCLKN)
Cycle time _ DDRCLKN cycle time
3.2
25
ns
1
tc(DDRCLKP)
Cycle time _ DDRCLKP cycle time
3.2
25
ns
3
tw(DDRCLKN)
Pulse width _ DDRCLKN high
0.45*tc(DDRCLKN)
0.55*tc(DDRCLKN)
ns
2
tw(DDRCLKN)
Pulse width _ DDRCLKN low
0.45*tc(DDRCLKN)
0.55*tc(DDRCLKN)
ns
2
tw(DDRCLKP)
Pulse width _ DDRCLKP high
0.45*tc(DDRCLKP)
0.55*tc(DDRCLKP)
ns
3
tw(DDRCLKP)
Pulse width _ DDRCLKP low
0.45*tc(DDRCLKP)
0.55*tc(DDRCLKP)
ns
4
tr(DDRCLK_250mv)
Transition time _ DDRCLK differential rise time (250 mV)
50
350
ps
4
tf(DDRCLK_250mv)
Transition time _ DDRCLK differential fall time (250 mV)
50
350
ps
5
tj(DDRCLKN)
Jitter, peak_to_peak _ periodic DDRCLKN
0.02*tc(DDRCLKN)
ps
5
tj(DDRCLKP)
Jitter, peak_to_peak _ periodic DDRCLKP
0.02*tc(DDRCLKP)
ps
End of Table 7-29
Figure 7-26
DDR3 PLL DDRCLK Timing
1
2
3
DDRCLKN
DDRCLKP
4
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7.8 PASS PLL
The PASS PLL generates interface clocks for the Network Coprocessor. Using the PACLKSEL pin the user can select
the input source of PASS PLL as either the output of CORECLK clock reference sources or the PASSCLK clock
reference sources. When coming out of power-on reset, PASS PLL comes out in a bypass mode and must be
programmed to a valid frequency before being enabled and used.
PASS PLL power is supplied via the PASS PLL power-supply pin (AVDDA3). An external EMI filter circuit must be
added to all PLL supplies. See the Hardware Design Guide for KeyStone I Devices in ‘‘Related Documentation from
Texas Instruments’’ on page 72. for detailed recommendations. For the best performance, TI recommends that all
the PLL external components be on a single side of the board without jumpers, switches, or components other than
those shown. For reduced PLL jitter, maximize the spacing between switching signal traces and the PLL external
components (C1, C2, and the EMI Filter).
Figure 7-27 shows the PASS PLL.
Figure 7-27
PASS PLL Block Diagram
PLLOUT
PLL
PLL
Controller
SYSCLKn
C66x
CorePac
SYSCLK1
PASS PLL
PLLD
xPLLM
/3
//2
CORECLK(P|N)
Network
Coprocessor
0
PASSCLK(P|N)
PLLOUT
PACLKSEL
1
BYPASS
PLLSELECT
7.8.1 PASS PLL Control Register
The PASS PLL, which is used to drive the Network Coprocessor, does not use a PLL controller. The PASS PLL can
be controlled using the PASSPLLCTL0 and PASSPLLCTL1 registers located in Bootcfg module. These MMRs
(memory-mapped registers) exist inside the Bootcfg space. To write to these registers, software should go through
an un-locking sequence using KICK0/KICK1 registers. For suggested configurable values see 2.5.4 ‘‘PLL Boot
Configuration Settings’’ on page 38. See section 3.3.4 ‘‘Kicker Mechanism Register (KICK0 and KICK1)’’ on
page 80 for the address location of the registers and locking and unlocking sequences for accessing the registers. This
register is reset on POR only.
.
Figure 7-28
PASS PLL Control Register 0 (PASSPLLCTL0) (1)
31
24
23
22
19
18
6
5
0
BWADJ[7:0]
BYPASS
Reserved
PLLM
PLLD
RW-0000 1001
RW-0
RW-0001
RW-0000000010011
RW-000000
Legend: RW = Read/Write; -n = value after reset
1 This register is Reset on POR only. The regreset, reset and bgreset from PLL are all tied to a common pll0_ctrl_rst_n The pwrdn, regpwrdn, bgpwrdn are all tied to common
pll0_ctrl_to_pll_pwrdn.
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Table 7-30
PASS PLL Control Register 0 Field Descriptions
Bit
Field
Description
31-24
BWADJ[7:0]
BWADJ[11:8] and BWADJ[7:0] are located in PASSPLLCTL0 and PASSPLLCTL1 registers. The combination (BWADJ[11:0])
should be programmed to a value related to PLLM[12:0] value based on the equation: BWADJ = ((PLLM+1)>>1) - 1
23
BYPASS
Enable bypass mode
0 = Bypass disabled
1 = Bypass enabled
22-19
Reserved
Reserved
18-6
PLLM
A 13-bit bus that selects the values for the multiplication factor
5-0
PLLD
A 6-bit bus that selects the values for the reference divider
End of Table 7-30
Figure 7-29
PASS PLL Control Register 1 (PASSPLLCTL1)
31
15
Reserved
14
13
12
PLLRST PLLSELECT
RW-00000000000000000
RW-0
RW-0
7
6
5
4
3
0
Reserved
ENSAT
Reserved
BWADJ[11:8]
RW-000000
RW-0
R-0
RW-0000
Legend: RW = Read/Write; -n = value after reset
Table 7-31
Bit
PASS PLL Control Register 1 Field Descriptions
Field
Description
31-15
Reserved
Reserved
14
PLLRST
PLL reset bit.
0 = PLL reset is released
1 = PLL reset is asserted
13
PLLSELECT
PASS PLL select bit. Note that this bit must be set before the Ethernet subsystem is configured and used.
0 = Reserved
1 = PASS PLL output clock is used as the input to PASS
12-7
Reserved
Reserved
6
ENSAT
Must be set to 1 for proper operation of the PLL
5-4
Reserved
Reserved
3-0
BWADJ[11:8]
BWADJ[11:8] and BWADJ[7:0] are located in PASSPLLCTL0 and PASSPLLCTL1 registers. The combination (BWADJ[11:0])
should be programmed to a value related to PLLM[12:0] value based on the equation: BWADJ = ((PLLM+1)>>1) - 1
End of Table 7-31
7.8.2 PASS PLL Device-Specific Information
As shown in Figure 7-27, the output of PASS PLL (PLLOUT) is divided by 2 and directly fed to the Network
Coprocessor. The PASS PLL is affected by power-on reset. During power-on resets, the internal clocks of the PASS
PLL are affected as described in Section 7.5 ‘‘Reset Controller’’ on page 130. The PASS PLL is unlocked only during
the power-up sequence and is locked by the time the RESETSTAT pin goes high. It does not lose lock during any of
the other resets.
7.8.3 PASS PLL Initialization Sequence
See the Phase Locked Loop (PLL) for KeyStone Devices User Guide in ‘‘Related Documentation from Texas
Instruments’’ on page 72 for details on the initialization sequence for PASS PLL.
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7.8.4 PASS PLL Input Clock Electrical Data/Timing
Table 7-32
PASS PLL Timing Requirements
(See Figure 7-30 and Figure 7-22)
No.
Min
Max
Unit
PASSCLK[P:N]
1
tc(PASSCLKN)
Cycle Time _ PASSCLKN cycle time
3.2
25
ns
1
tc(PASSCLKP)
Cycle Time _ PASSCLKP cycle time
3.2
25
ns
3
tw(PASSCLKN)
Pulse Width _ PASSCLKN high
0.45*tc(PASSCLKN)
0.55*tc(PASSCLKN)
ns
2
tw(PASSCLKN)
Pulse Width _ PASSCLKN low
0.45*tc(PASSCLKN)
0.55*tc(PASSCLKN)
ns
2
tw(PASSCLKP)
Pulse Width _ PASSCLKP high
0.45*tc(PASSCLKP)
0.55*tc(PASSCLKP)
ns
3
tw(PASSCLKP)
Pulse Width _ PASSCLKP low
0.45*tc(PASSCLKP)
0.55*tc(PASSCLKP)
ns
4
tr(PASSCLK_250mv)
Transition time _ PASSCLK differential rise time (250 mV)
50
350
ps
4
tf(PASSCLK_250mv)
Transition time _ PASSCLK differential fall time (250 mV)
50
350
ps
5
tj(PASSCLKN)
Jitter, peak_to_peak _ periodic PASSCLKN
0.02*tc(PASSCLKN)
ps, pk-pk
5
tj(PASSCLKP)
Jitter, peak_to_peak _ periodic PASSCLKP
0.02*tc(PASSCLKP)
ps, pk-pk
Figure 7-30
PASS PLL Timing
1
2
3
PASSCLKN
PASSCLKP
4
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7.9 Enhanced Direct Memory Access (EDMA3) Controller
The primary purpose of the EDMA3 is to service user-programmed data transfers between two memory-mapped
slave endpoints on the device. The EDMA3 services software-driven paging transfers (e.g., data movement between
external memory and internal memory), performs sorting or subframe extraction of various data structures, services
event driven peripherals, and offloads data transfers from the device CPU.
There are 3 EDMA Channel Controllers on the C6671 DSP, EDMA3CC0, EDMA3CC1, and EDMA3CC2.
• EDMA3CC0 has two transfer controllers: EDMA3TC1 and EDMA3TC2.
• EDMA3CC1 has four transfer controllers: EDMA3TC0, EDMA3TC1, EDMA3TC2, and EDMA3TC3.
• EDMA3CC2 has four transfer controllers: EDMA3TC0, EDMA3TC1, EDMA3TC2, and EDMA3TC3.
In the context of this document, EDMA3TCx associated with EDMA3CCy, and is referred to as EDMA3CCy TCx.
Each of the transfer controllers has a direct connection to the switch fabric. Section 4.2 ‘‘Switch Fabric Connections’’
lists the peripherals that can be accessed by the transfer controllers.
EDMA3CC0 is optimized to be used for transfers to/from/within the MSMC and DDR-3 subsytems. The others are
to be used for the remaining traffic.
Each EDMA3 Channel Controller includes the following features:
• Fully orthogonal transfer description
– Three transfer dimensions:
› Array (multiple bytes)
› Frame (multiple arrays)
› Block (multiple frames)
– Single event can trigger transfer of array, frame, or entire block
– Independent indexes on source and destination
• Flexible transfer definition:
– Increment or FIFO transfer addressing modes
– Linking mechanism allows for ping-pong buffering, circular buffering, and repetitive/continuous
transfers, all with no CPU intervention
– Chaining allows multiple transfers to execute with one event
• 128 PaRAM entries for EDMA3CC0, 512 each for EDMA3CC1 and EDMA3CC2
– Used to define transfer context for channels
– Each PaRAM entry can be used as a DMA entry, QDMA entry, or link entry
• 16 DMA channels for EDMA3CC0, 64 each for EDMA3CC1 and EDMA3CC2
– Manually triggered (CPU writes to channel controller register), external event triggered, and chain
triggered (completion of one transfer triggers another)
• 8 Quick DMA (QDMA) channels per EDMA 3 Channel Controller
– Used for software-driven transfers
– Triggered upon writing to a single PaRAM set entry
• Two transfer controllers and two event queues with programmable system-level priority for EDMA3CC0, four
transfer controllers and four event queues with programmable system-level priority per channel controller for
EDMA3CC1 and EDMA3CC2
• Interrupt generation for transfer completion and error conditions
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•
Debug visibility
– Queue watermarking/threshold allows detection of maximum usage of event queues
– Error and status recording to facilitate debug
7.9.1 EDMA3 Device-Specific Information
The EDMA supports two addressing modes: constant addressing and increment addressing mode. Constant
addressing mode is applicable to a very limited set of use cases. For most applications, increment mode must be used.
For more information on these two addressing modes, see the Enhanced Direct Memory Access 3 (EDMA3)
Controller for KeyStone Devices User Guide in ‘‘Related Documentation from Texas Instruments’’ on page 72.
For the range of memory addresses that include EDMA3 channel controller (EDMA3CC) control registers and
EDMA3 transfer controller (EDMA3TC) control register see Section Table 2-2‘‘Memory Map Summary’’ on
page 17. For memory offsets and other details on EDMA3CC and EDMA3TC control registers entries, see the
Enhanced Direct Memory Access 3 (EDMA3) Controller for KeyStone Devices User Guide in ‘‘Related Documentation
from Texas Instruments’’ on page 72.
7.9.2 EDMA3 Channel Controller Configuration
Table 7-33 shows the configuration for each of the EDMA3 channel controllers present on the device.
Table 7-33
EDMA3 Channel Controller Configuration
Description
EDMA3 CC0
EDMA3 CC1
EDMA3 CC2
Number of DMA channels in Channel Controller
16
64
64
Number of QDMA channels
8
8
8
Number of interrupt channels
16
64
64
Number of PaRAM set entries
128
512
512
Number of event queues
2
4
4
Number of Transfer Controllers
2
4
4
Memory Protection Existence
Yes
Yes
Yes
Number of Memory Protection and Shadow Regions
8
8
8
End of Table 7-33
7.9.3 EDMA3 Transfer Controller Configuration
Each transfer controller on a device is designed differently based on considerations like performance requirements,
system topology (like main TeraNet bus width, external memory bus width), etc. The parameters that determine the
transfer controller configurations are:
• FIFOSIZE: Determines the size in bytes for the data FIFO that is the temporary buffer for the in-flight data.
The data FIFO is where the read return data read by the TC read controller from the source endpoint is stored
and subsequently written out to the destination endpoint by the TC write controller.
• BUSWIDTH: The width of the read and write data buses in bytes, for the TC read and write controller,
respectively. This is typically equal to the bus width of the main TeraNet interface.
• Default Burst Size (DBS): The DBS is the maximum number of bytes per read/write command issued by a
transfer controller.
• DSTREGDEPTH: This determines the number of destination FIFO register set. The number of destination
FIFO register set for a transfer controller determines the maximum number of outstanding transfer requests.
All four parameters listed above are fixed by the design of the device.
Table 7-34 shows the configuration for each of the EDMA3 transfer controllers present on the device.
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Table 7-34
EDMA3 Transfer Controller Configuration
EDMA3 CC0
Parameter
TC0
TC1
EDMA3 CC1
TC0
TC1
EDMA3 CC2
TC2
TC3
TC0
TC1
TC2
TC3
FIFOSIZE
1024 bytes
1024 bytes
1024 bytes
512 bytes
1024 bytes
512 bytes
1024 bytes
512 bytes
512 bytes
1024 bytes
BUSWIDTH
32 bytes
32 bytes
16 bytes
16 bytes
16 bytes
16 bytes
16 bytes
16 bytes
16 bytes
16 bytes
DSTREGDEPTH
4 entries
4 entries
4 entries
4 entries
4 entries
4 entries
4 entries
4 entries
4 entries
4 entries
DBS
128 bytes
128 bytes
128 bytes
64 bytes
128 bytes
64 bytes
128 bytes
64 bytes
64 bytes
128 bytes
End of Table 7-34
7.9.4 EDMA3 Channel Synchronization Events
The EDMA3 supports up to 16 DMA channels for EDMA3CC0, 64 each for EDMA3CC1 and EDMA3CC2 that can
be used to service system peripherals and to move data between system memories. DMA channels can be triggered
by synchronization events generated by system peripherals. The following tables lists the source of the
synchronization event associated with each of the EDMA EDMA3CC DMA channels. On the C6671, the association
of each synchronization event and DMA channel is fixed and cannot be reprogrammed.
For more detailed information on the EDMA3 module and how EDMA3 events are enabled, captured, processed,
prioritized, linked, chained, and cleared, etc., see the Enhanced Direct Memory Access 3 (EDMA3) Controller for
KeyStone Devices User Guide in ‘‘Related Documentation from Texas Instruments’’ on page 72.
Table 7-35
EDMA3CC0 Events for C6671
Event Number
Event
Event Description
0
TINT8L
Timer interrupt low
1
TINT8H
Timer interrupt high
2
TINT9L
Timer interrupt low
3
TINT9H
Timer interrupt high
4
TINT10L
Timer interrupt low
5
TINT10H
Timer interrupt high
6
TINT11L
Timer interrupt low
7
TINT11H
Timer interrupt high
8
CIC3_OUT0
Interrupt Controller output
9
CIC3_OUT1
Interrupt Controller output
10
CIC3_OUT2
Interrupt Controller output
11
CIC3_OUT3
Interrupt Controller output
12
CIC3_OUT4
Interrupt Controller output
13
CIC3_OUT5
Interrupt Controller output
14
CIC3_OUT6
Interrupt Controller output
15
CIC3_OUT7
Interrupt Controller output
End of Table 7-35
Table 7-36
EDMA3CC1 Events for C6671 (Part 1 of 3)
Event Number
Event
Event Description
0
SPIINT0
SPI interrupt
1
SPIINT1
SPI interrupt
2
SPIXEVT
Transmit event
3
SPIREVT
Receive event
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Table 7-36
Event Number
EDMA3CC1 Events for C6671 (Part 2 of 3)
Event
Event Description
4
I2CREVT
I2C receive event
5
I2CXEVT
I2C transmit event
6
GPINT0
GPIO interrupt
7
GPINT1
GPIO interrupt
8
GPINT2
GPIO interrupt
9
GPINT3
GPIO interrupt
10
GPINT4
GPIO interrupt
11
GPINT5
GPIO interrupt
12
GPINT6
GPIO interrupt
13
GPINT7
GPIO interrupt
14
SEMINT0
Semaphore interrupt
15
Reserved
16
Reserved
17
Reserved
18
Reserved
19
Reserved
20
Reserved
21
Reserved
22
TINT8L
Timer interrupt low
23
TINT8H
Timer interrupt high
24
TINT9L
Timer interrupt low
25
TINT9H
Timer interrupt high
26
TINT10L
Timer interrupt low
27
TINT10H
Timer interrupt high
28
TINT11L
Timer interrupt low
29
TINT11H
Timer interrupt high
30
TINT12L
Timer interrupt low
31
TINT12H
Timer interrupt high
32
TINT13L
Timer interrupt low
33
TINT13H
Timer interrupt high
34
TINT14L
Timer interrupt low
35
TINT14H
Timer interrupt high
36
TINT15L
Timer interrupt low
37
TINT15L
Timer interrupt high
38
CIC2_OUT44
Interrupt Controller output
39
CIC2_OUT45
Interrupt Controller output
40
CIC2_OUT46
Interrupt Controller output
41
CIC2_OUT47
Interrupt Controller output
42
CIC2_OUT0
Interrupt Controller output
43
CIC2_OUT1
Interrupt Controller output
44
CIC2_OUT2
Interrupt Controller output
45
CIC2_OUT3
Interrupt Controller output
46
CIC2_OUT4
Interrupt Controller output
47
CIC2_OUT5
Interrupt Controller output
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Table 7-36
EDMA3CC1 Events for C6671 (Part 3 of 3)
Event Number
Event
Event Description
48
CIC2_OUT6
Interrupt Controller output
49
CIC2_OUT7
Interrupt Controller output
50
CIC2_OUT8
Interrupt Controller output
51
CIC2_OUT9
Interrupt Controller output
52
CIC2_OUT10
Interrupt Controller output
53
CIC2_OUT11
Interrupt Controller output
54
CIC2_OUT12
Interrupt Controller output
55
CIC2_OUT13
Interrupt Controller output
56
CIC2_OUT14
Interrupt Controller output
57
CIC2_OUT15
Interrupt Controller output
58
CIC2_OUT16
Interrupt Controller output
59
CIC2_OUT17
Interrupt Controller output
60
CIC2_OUT18
Interrupt Controller output
61
CIC2_OUT19
Interrupt Controller output
62
CIC2_OUT20
Interrupt Controller output
63
CIC2_OUT21
Interrupt Controller output
End of Table 7-36
Table 7-37
EDMA3CC2 Events for C6671 (Part 1 of 2)
Event Number
Event
Event Description
0
SPIINT0
SPI interrupt
1
SPIINT1
SPI interrupt
2
SPIXEVT
Transmit event
3
SPIREVT
Receive event
4
I2CREVT
I2C receive event
5
I2CXEVT
I2C transmit event
6
GPINT0
GPIO interrupt
7
GPINT1
GPIO interrupt
8
GPINT2
GPIO Interrupt
9
GPINT3
GPIO interrupt
10
GPINT4
GPIO interrupt
11
GPINT5
GPIO interrupt
12
GPINT6
GPIO interrupt
13
GPINT7
GPIO interrupt
14
SEMINT0
Semaphore interrupt
15
Reserved
16
Reserved
17
Reserved
18
Reserved
19
Reserved
20
Reserved
21
Reserved
22
TINT8L
160
Timer interrupt low
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Table 7-37
EDMA3CC2 Events for C6671 (Part 2 of 2)
Event Number
Event
Event Description
23
TINT8H
Timer interrupt high
24
TINT9L
Timer interrupt low
25
TINT9H
Timer interrupt high
26
TINT10L
Timer interrupt low
27
TINT10H
Timer interrupt high
28
TINT11L
Timer interrupt low
29
TINT11H
Timer interrupt high
30
TINT12L
Timer interrupt low
31
TINT12H
Timer interrupt high
32
TINT13L
Timer interrupt low
33
TINT13H
Timer interrupt high
34
TINT14L
Timer interrupt low
35
TINT14H
Timer interrupt high
36
TINT15L
Timer interrupt low
37
TINT15H
Timer interrupt high
38
CIC2_OUT48
Interrupt Controller output
39
CIC2_OUT49
Interrupt Controller output
40
URXEVT
UART receive event
41
UTXEVT
UART transmit event
42
CIC2_OUT22
Interrupt Controller output
43
CIC2_OUT23
Interrupt Controller output
44
CIC2_OUT24
Interrupt Controller output
45
CIC2_OUT25
Interrupt Controller output
46
CIC2_OUT26
Interrupt Controller output
47
CIC2_OUT27
Interrupt Controller output
48
CIC2_OUT28
Interrupt Controller output
49
CIC2_OUT29
Interrupt Controller output
50
CIC2_OUT30
Interrupt Controller output
51
CIC2_OUT31
Interrupt Controller output
52
CIC2_OUT32
Interrupt Controller output
53
CIC2_OUT33
Interrupt Controller output
54
CIC2_OUT34
Interrupt Controller output
55
CIC2_OUT35
Interrupt Controller output
56
CIC2_OUT36
Interrupt Controller output
57
CIC2_OUT37
Interrupt Controller output
58
CIC2_OUT38
Interrupt Controller output
59
CIC2_OUT39
Interrupt Controller output
60
CIC2_OUT40
Interrupt Controller output
61
CIC2_OUT41
Interrupt Controller output
62
CIC2_OUT42
Interrupt Controller output
63
CIC2_OUT43
Interrupt Controller output
End of Table 7-37
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7.10 Interrupts
7.10.1 Interrupt Sources and Interrupt Controller
The CPU interrupts on the C6671 device are configured through the C66x CorePac Interrupt Controller. The
interrupt controller allows for up to 128 system events to be programmed to any of the twelve CPU interrupt inputs
(CPUINT4 - CPUINT15), the CPU exception input (EXCEP), or the advanced emulation logic. The 128 system
events consist of both internally-generated events (within the CorePac) and chip-level events.
Additional system events are routed to each of the C66x CorePacs to provide chip-level events that are not required
as CPU interrupts/exceptions to be routed to the interrupt controller as emulation events. Additionally, error-class
events or infrequently used events are also routed through the system event router to offload the C66x CorePac
interrupt selector. This is accomplished through chip interrupt controller (CIC) blocks. This is clocked using CPU/6.
The event controllers consist of simple combination logic to provide additional events to the C66x CorePac, plus the
EDMA3CC and CIC0 provide 17 additional events as well as 8 broadcast events to the C66x CorePac, CIC2 provides
26 and 24 additional events to EDMA3CC1 and EDMA3CC2 respectively, and CIC3 provides 8 and 32 additional
events to EDMA3CC0 and HyperLink respectively.
There are a large number of events at the chip level. The chip level CIC provides a flexible way to combine and remap
those events. Multiple events can be combined to a single event through chip level CIC. However, an event can be
mapped only to a single event output from the chip level CIC. The chip level CIC also allows the software to trigger
system event through memory writes. For more details on the CIC features, see the Chip Interrupt Controller (CIC)
for KeyStone Devices User Guide in ‘‘Related Documentation from Texas Instruments’’ on page 72.
Note—Modules such as MPU, Tracer, and BOOT_CFG have level interrupts and EOI handshaking
interface. The EOI value is 0 for MPU, Tracer, and BOOT_CFG.
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Figure 7-31 shows the C6671 interrupt topology.
Figure 7-31
TMS320C6671 Interrupt Topology
98 Primary Events
15 Reserved Secondary Events
17 Secondary Events
89 Core-only Secondary Events
CIC0
56 Common Events
Core0
5 Reserved Primary Events
8 Broadcast Events from CIC0
31 Primary Events
26 Secondary Events
56 Common Events
EDMA3
CC1
7 Reserved Primary Events
44 Reserved Secondary Events
CIC2
33 Primary Events
60 EDMA3CC-only
Secondary Events
24 Secondary Events
EDMA3
CC2
7 Reserved Primary Events
32 Primary Events
45 Reserved Secondary Events
HyperLink
32 Secondary Events
CIC3
35 Events
8 Primary Events
8 Secondary Events
EDMA3
CC0
Figure 7-32 shows the mapping of system events. For more information on the Interrupt Controller, see the C66x
DSP CorePac User Guide in ‘‘Related Documentation from Texas Instruments’’ on page 72.
Figure 7-32
TMS320C6671 System Event Inputs — C66x CorePac Primary Interrupts (Part 1 of 4)
Input Event Number
Interrupt Event
Description
0
EVT0
Event combiner 0 output
1
EVT1
Event combiner 1 output
2
EVT2
Event combiner 2 output
3
EVT3
4
TETBHFULLINTn
Event combiner 3 output
(1)
TETB is half full
(1)
5
TETBFULLINTn
6
TETBACQINTn (1)
TETB is full
Acquisition has been completed
7
TETBOVFLINTn
(1)
8
TETBUNFLINTn
(1)
9
EMU_DTDMA
10
MSMC_mpf_errorn
11
EMU_RTDXRX
RTDX receive complete
12
EMU_RTDXTX
RTDX transmit complete
13
IDMA0
IDMA channel 0 interrupt
14
IDMA1
15
SEMERRn
Overflow condition interrupt
Underflow condition interrupt
ECM interrupt for:
1. Host scan access
2. DTDMA transfer complete
3. AET interrupt
(2)
Memory protection fault indicators for local core
IDMA channel 1 interrupt
(3)
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Figure 7-32
TMS320C6671 System Event Inputs — C66x CorePac Primary Interrupts (Part 2 of 4)
Input Event Number
Interrupt Event
Description
(3)
16
SEMINTn
17
PCIExpress_MSI_INTn
Semaphore interrupt
(4)
Message signaled interrupt mode
18
TSIP0_ERRINT[n]
(5)
TSIP0 receive/transmit error interrupt
19
TSIP1_ERRINT[n] (5)
TSIP1 receive/transmit error interrupt
(6)
SRIO Interrupt
20
INTDST(n+16)
21
CIC0_OUT(32+0+11*n)
Interrupt Controller Output
22
CIC0_OUT(32+1+11*n)
Interrupt Controller Output
23
CIC0_OUT(32+2+11*n)
Interrupt Controller Output
24
CIC0_OUT(32+3+11*n)
Interrupt Controller Output
25
CIC0_OUT(32+4+11*n)
Interrupt Controller Output
26
CIC0_OUT(32+5+11*n)
Interrupt Controller Output
27
CIC0_OUT(32+6+11*n)
Interrupt Controller Output
28
CIC0_OUT(32+7+11*n)
Interrupt Controller Output
29
CIC0_OUT(32+8+11*n)
Interrupt Controller Output
30
CIC0_OUT(32+9+11*n)
Interrupt Controller Output
31
CIC0_OUT(32+10+11*n)
Interrupt Controller Output
32
QM_INT_LOW_0
QM Interrupt for 0~31 Queues
33
QM_INT_LOW_1
QM Interrupt for 32~63 Queues
34
QM_INT_LOW_2
QM Interrupt for 64~95 Queues
35
QM_INT_LOW_3
QM Interrupt for 96~127 Queues
36
QM_INT_LOW_4
QM Interrupt for 128~159 Queues
37
QM_INT_LOW_5
QM Interrupt for 160~191 Queues
38
QM_INT_LOW_6
QM Interrupt for 192~223 Queues
39
QM_INT_LOW_7
QM Interrupt for 224~255 Queues
40
QM_INT_LOW_8
QM Interrupt for 256~287 Queues
41
QM_INT_LOW_9
QM Interrupt for 288~319 Queues
42
QM_INT_LOW_10
QM Interrupt for 320~351 Queues
43
QM_INT_LOW_11
QM Interrupt for 352~383 Queues
44
QM_INT_LOW_12
QM Interrupt for 384~415 Queues
45
QM_INT_LOW_13
QM Interrupt for 416~447 Queues
46
QM_INT_LOW_14
QM Interrupt for 448~479 Queues
47
QM_INT_LOW_15
QM Interrupt for 480~511 Queues
48
QM_INT_HIGH_n
(7)
QM Interrupt for Queue 704+n
(7)
8
QM Interrupt for Queue 712+n8
49
QM_INT_HIGH_(n+8)
50
QM_INT_HIGH_(n+16)
(7)
QM Interrupt for Queue 720+n
51
QM_INT_HIGH_(n+24)
(7)
QM Interrupt for Queue 728+n8
52
TSIP0_RFSINT[n]
(5)
TSIP0 receive frame sync interrupt
53
TSIP0_RSFINT[n]
(5)
TSIP0 receive super frame interrupt
54
TSIP0_XFSINT[n]
(5)
TSIP0 transmit frame sync interrupt
55
TSIP0_XSFINT[n]
(5)
TSIP0 transmit super frame interrupt
56
TSIP1_RFSINT[n]
(5)
TSIP1 receive frame sync interrupt
57
TSIP1_RSFINT[n] (5)
TSIP1 receive super frame interrupt
58
TSIP1_XFSINT[n]
(5)
TSIP1 transmit frame sync interrupt
59
TSIP1_XSFINT[n]
(5)
TSIP1 transmit super frame interrupt
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Figure 7-32
TMS320C6671 System Event Inputs — C66x CorePac Primary Interrupts (Part 3 of 4)
Input Event Number
Interrupt Event
Description
60
Reserved
61
Reserved
62
CIC0_OUT(2+8*n)
Interrupt Controller Output
63
CIC0_OUT(3+8*n)
Interrupt Controller Output
64
TINTLn
(8)
Local timer interrupt low
65
TINTHn
(8)
Local timer interrupt high
66
TINT8L
Timer interrupt low
67
TINT8H
Timer interrupt high
68
TINT9L
Timer interrupt low
69
TINT9H
Timer interrupt high
70
TINT10L
Timer interrupt low
71
TINT10H
Timer interrupt high
72
TINT11L
Timer interrupt low
73
TINT11H
Timer interrupt high
74
TINT12L
Timer interrupt low
75
TINT12H
Timer interrupt high
76
TINT13L
Timer interrupt low
77
TINT13H
Timer interrupt high
78
TINT14L
Timer interrupt low
79
TINT14H
Timer interrupt high
80
TINT15L
Timer interrupt low
81
TINT15H
Timer interrupt high
82
GPINT8
Local GPIO interrupt
83
GPINT9
Local GPIO interrupt
84
GPINT10
Local GPIO interrupt
85
GPINT11
Local GPIO interrupt
86
GPINT12
Local GPIO interrupt
87
GPINT13
Local GPIO interrupt
88
GPINT14
Local GPIO interrupt
89
GPINT15
Local GPIO interrupt
(9)
Local GPIO interrupt
90
GPINTn
91
IPC_LOCAL
Inter DSP interrupt from IPCGRn
92
CIC0_OUT(4+8*n)
Interrupt Controller Output
93
CIC0_OUT(5+8*n)
Interrupt Controller Output
94
CIC0_OUT(6+8*n)
Interrupt Controller Output
95
CIC0_OUT(7+8*n)
Interrupt Controller Output
96
INTERR
Dropped CPU interrupt event
97
EMC_IDMAERR
Invalid IDMA parameters
98
Reserved
99
Reserved
100
EFIINTA
EFI Interrupt from side A
101
EFIINTB
EFI Interrupt from side B
102
CIC0_OUT0
Interrupt Controller Output
103
CIC0_OUT1
Interrupt Controller Output
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Figure 7-32
TMS320C6671 System Event Inputs — C66x CorePac Primary Interrupts (Part 4 of 4)
Input Event Number
Interrupt Event
Description
104
CIC0_OUT8
Interrupt Controller Output
105
CIC0_OUT9
Interrupt Controller Output
106
CIC0_OUT16
Interrupt Controller Output
107
CIC0_OUT17
Interrupt Controller Output
108
CIC0_OUT24
Interrupt Controller Output
109
CIC0_OUT25
Interrupt Controller Output
110
MDMAERREVT
VbusM error event
111
Reserved
112
EDMA3CC0_EDMACC_AETEVT
EDMA3CC0 AET event
113
PMC_ED
Single bit error detected during DMA read
114
EDMA3CC1_EDMACC_AETEVT
EDMA3CC1 AET Event
115
EDMA3CC2_EDMACC_AETEVT
EDMA3CC2 AET Event
116
UMC_ED1
Corrected bit error detected
117
UMC_ED2
Uncorrected bit error detected
118
PDC_INT
Power down sleep interrupt
119
SYS_CMPA
SYS CPU memory protection fault event
120
PMC_CMPA
PMC CPU memory protection fault event
121
PMC_DMPA
PMC DMA memory protection fault event
122
DMC_CMPA
DMC CPU memory protection fault event
123
DMC_DMPA
DMC DMA memory protection fault event
124
UMC_CMPA
UMC CPU memory protection fault event
125
UMC_DMPA
UMC DMA memory protection fault event
126
EMC_CMPA
EMC CPU memory protection fault event
127
EMC_BUSERR
EMC bus error interrupt
End of Table 7-37
1
2
3
4
5
6
7
8
9
CorePac[n] will receive TETBHFULLINTn, TETBFULLINTn, TETBACQINTn, TETBOVFLINTn, and TETBUNFLINTn.
CorePac[n] will receive MSMC_mpf_errorn.CIC.
CorePac[n] will receive SEMINTn and SEMERRn.
CorePac[n] will receive PCIEXpress_MSI_INTn.
CorePac[n] will receive TSIPx_xxx[n].
CorePac[n] will receive INTDST(n+16).
n is core number.
CorePac[n] will receive TINTLn and TINTHn.
CorePac[n] will receive GPINTn.
Table 7-38
CIC0 Event Inputs (Secondary Interrupts for C66x CorePacs) (Part 1 of 5)
Input Event# on CIC
System Interrupt
Description
0
EDMA3CC1 CC_ERRINT
EDMA3CC1 error interrupt
1
EDMA3CC1 CC_MPINT
EDMA3CC1 memory protection interrupt
2
EDMA3CC1 TC_ERRINT0
EDMA3CC1 TC0 error interrupt
3
EDMA3CC1 TC_ERRINT1
EDMA3CC1 TC1 error interrupt
4
EDMA3CC1 TC_ERRINT2
EDMA3CC1 TC2 error interrupt
5
EDMA3CC1 TC_ERRINT3
EDMA3CC1 TC3 error interrupt
6
EDMA3CC1 CC_GINT
EDMA3CC1 GINT
7
Reserved
8
EDMA3CC1 CCINT0
166
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EDMA3CC1 individual completion interrupt
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Fixed and Floating-Point Digital Signal Processor
SPRS756E—March 2014
Table 7-38
CIC0 Event Inputs (Secondary Interrupts for C66x CorePacs) (Part 2 of 5)
Input Event# on CIC
System Interrupt
Description
9
EDMA3CC1 CCINT1
EDMA3CC1 individual completion interrupt
10
EDMA3CC1 CCINT2
EDMA3CC1 individual completion interrupt
11
EDMA3CC1 CCINT3
EDMA3CC1 individual completion interrupt
12
EDMA3CC1 CCINT4
EDMA3CC1 individual completion interrupt
13
EDMA3CC1 CCINT5
EDMA3CC1 individual completion interrupt
14
EDMA3CC1 CCINT6
EDMA3CC1 individual completion interrupt
15
EDMA3CC1 CCINT7
EDMA3CC1 individual completion interrupt
16
EDMA3CC2 CC_ERRINT
EDMA3CC2 error interrupt
17
EDMA3CC2 CC_MPINT
EDMA3CC2 memory protection interrupt
18
EDMA3CC2 TC_ERRINT0
EDMA3CC2 TC0 error interrupt
19
EDMA3CC2 TC_ERRINT1
EDMA3CC2 TC1 error interrupt
20
EDMA3CC2 TC_ERRINT2
EDMA3CC2 TC2 error interrupt
21
EDMA3CC2 TC_ERRINT3
EDMA3CC2 TC3 error interrupt
22
EDMA3CC2 CC_GINT
EDMA3CC2 GINT
23
Reserved
24
EDMA3CC2 CCINT0
EDMA3CC2 individual completion interrupt
25
EDMA3CC2 CCINT1
EDMA3CC2 individual completion interrupt
26
EDMA3CC2 CCINT2
EDMA3CC2 individual completion interrupt
27
EDMA3CC2 CCINT3
EDMA3CC2 individual completion interrupt
28
EDMA3CC2 CCINT4
EDMA3CC2 individual completion interrupt
29
EDMA3CC2 CCINT5
EDMA3CC2 individual completion interrupt
30
EDMA3CC2 CCINT6
EDMA3CC2 individual completion interrupt
31
EDMA3CC2 CCINT7
EDMA3CC2 individual completion interrupt
32
EDMA3CC0 CC_ERRINT
EDMA3CC0 error interrupt
33
EDMA3CC0 CC_MPINT
EDMA3CC0 memory protection interrupt
34
EDMA3CC0 TC_ERRINT0
EDMA3CC0 TC0 error interrupt
35
EDMA3CC0 TC_ERRINT1
EDMA3CC0 TC1 error interrupt
36
EDMA3CC0 CC_GINT
EDMA3CC0 GINT
37
Reserved
38
EDMA3CC0 CCINT0
EDMA3CC0 individual completion interrupt
39
EDMA3CC0 CCINT1
EDMA3CC0 individual completion interrupt
40
EDMA3CC0 CCINT2
EDMA3CC0 individual completion interrupt
41
EDMA3CC0 CCINT3
EDMA3CC0 individual completion interrupt
42
EDMA3CC0 CCINT4
EDMA3CC0 individual completion interrupt
43
EDMA3CC0 CCINT5
EDMA3CC0 individual completion interrupt
44
EDMA3CC0 CCINT6
EDMA3CC0 individual completion interrupt
45
EDMA3CC0 CCINT7
EDMA3CC0 individual completion interrupt
46
Reserved
47
QM_INT_PASS_TXQ_PEND_12
Queue manager pend event
48
PCIEXpress_ERR_INT
Protocol error interrupt
49
PCIEXpress_PM_INT
Power management interrupt
50
PCIEXpress_Legacy_INTA
Legacy interrupt mode
51
PCIEXpress_Legacy_INTB
Legacy interrupt mode
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Table 7-38
CIC0 Event Inputs (Secondary Interrupts for C66x CorePacs) (Part 3 of 5)
Input Event# on CIC
System Interrupt
Description
52
PCIEXpress_Legacy_INTC
Legacy interrupt mode
53
PCIEXpress_Legacy_INTD
Legacy interrupt mode
54
SPIINT0
SPI interrupt0
55
SPIINT1
SPI interrupt1
56
SPIXEVT
Transmit event
57
SPIREVT
Receive event
58
I2CINT
I C interrupt
59
I2CREVT
I2C receive event
60
I2CXEVT
I C transmit event
61
Reserved
62
Reserved
63
TETBHFULLINT
TETB is half full
64
TETBFULLINT
TETB is full
2
2
65
TETBACQINT
Acquisition has been completed
66
TETBOVFLINT
Overflow condition occur
67
TETBUNFLINT
Underflow condition occur
68
MDIO_LINK_INTR0
Network coprocessor MDIO interrupt
69
MDIO_LINK_INTR1
Network coprocessor MDIO interrupt
70
MDIO_USER_INTR0
Network coprocessor MDIO interrupt
71
MDIO_USER_INTR1
Network coprocessor MDIO interrupt
72
MISC_INTR
Network coprocessor MISC interrupt
73
TRACER_CORE_0_INTD
Tracer sliding time window interrupt for individual core
74
Reserved
75
Reserved
76
Reserved
77
TRACER_DDR_INTD
Tracer sliding time window interrupt for DDR3 EMIF1
78
TRACER_MSMC_0_INTD
Tracer sliding time window interrupt for MSMC SRAM bank0
79
TRACER_MSMC_1_INTD
Tracer sliding time window interrupt for MSMC SRAM bank1
80
TRACER_MSMC_2_INTD
Tracer sliding time window interrupt for MSMC SRAM bank2
81
TRACER_MSMC_3_INTD
Tracer sliding time window interrupt for MSMC SRAM bank3
81
TRACER_CFG_INTD
Tracer sliding time window interrupt for CFG0 TeraNet
82
TRACER_QM_CFG_INTD
Tracer sliding time window interrupt for QM_SS CFG
84
TRACER_QM_DMA_INTD
Tracer sliding time window interrupt for QM_SS slave
85
TRACER_SM_INTD
Tracer sliding time window interrupt for semaphore
86
PSC_ALLINT
Power/sleep controller interrupt
87
MSMC_SCRUB_CERROR
Correctable (1-bit) soft error detected during scrub cycle
88
BOOTCFG_INTD
Chip-level MMR error register
89
Reserved
90
MPU0_INTD (MPU0_ADDR_ERR_INT and MPU0 addressing violation interrupt and protection violation interrupt.
MPU0_PROT_ERR_INT combined)
91
QM_INT_PASS_TXQ_PEND_13
92
MPU1_INTD (MPU1_ADDR_ERR_INT and MPU1 addressing violation interrupt and protection violation interrupt.
MPU1_PROT_ERR_INT combined)
93
QM_INT_PASS_TXQ_PEND_14
168
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Queue manager pend event
Queue manager pend event
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Table 7-38
CIC0 Event Inputs (Secondary Interrupts for C66x CorePacs) (Part 4 of 5)
Input Event# on CIC
System Interrupt
94
MPU2_INTD (MPU2_ADDR_ERR_INT and MPU2 addressing violation interrupt and protection violation interrupt.
MPU2_PROT_ERR_INT combined)
Description
95
QM_INT_PASS_TXQ_PEND_15
96
MPU3_INTD (MPU3_ADDR_ERR_INT and MPU3 addressing violation interrupt and protection violation interrupt.
MPU3_PROT_ERR_INT combined)
Queue manager pend event
97
QM_INT_PASS_TXQ_PEND_16
Queue manager pend event
98
MSMC_dedc_cerror
Correctable (1-bit) soft error detected on SRAM read
99
MSMC_dedc_nc_error
Non-correctable (2-bit) soft error detected on SRAM read
100
MSMC_scrub_nc_error
Non-correctable (2-bit) soft error detected during scrub cycle
101
Reserved
102
MSMC_mpf_error8
Memory protection fault indicators for each system master PrivID
103
MSMC_mpf_error9
Memory protection fault indicators for each system master PrivID
104
MSMC_mpf_error10
Memory protection fault indicators for each system master PrivID
105
MSMC_mpf_error11
Memory protection fault indicators for each system master PrivID
105
MSMC_mpf_error12
Memory protection fault indicators for each system master PrivID
107
MSMC_mpf_error13
Memory protection fault indicators for each system master PrivID
108
MSMC_mpf_error14
Memory protection fault indicators for each system master PrivID
109
MSMC_mpf_error15
Memory protection fault indicators for each system master PrivID
110
DDR3_ERR
DDR3 EMIF error interrupt
111
VUSR_INT_O
HyperLink interrupt
112
INTDST0
RapidIO interrupt
113
INTDST1
RapidIO interrupt
114
INTDST2
RapidIO interrupt
115
INTDST3
RapidIO interrupt
116
INTDST4
RapidIO interrupt
117
INTDST5
RapidIO interrupt
118
INTDST6
RapidIO interrupt
119
INTDST7
RapidIO interrupt
120
INTDST8
RapidIO interrupt
121
INTDST9
RapidIO interrupt
122
INTDST10
RapidIO interrupt
123
INTDST11
RapidIO interrupt
124
INTDST12
RapidIO interrupt
125
INTDST13
RapidIO interrupt
126
INTDST14
RapidIO interrupt
127
INTDST15
RapidIO interrupt
128
EASYNCERR
EMIF16 error interrupt
129
Reserved
130
Reserved
131
Reserved
132
Reserved
133
QM_INT_PKTDMA_0
Queue manager Interrupt for packet DMA starvation
134
QM_INT_PKTDMA_1
Queue manager Interrupt for packet DMA starvation
135
RapidIO_INT_PKTDMA_0
RapidIO Interrupt for packet DMA starvation
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Table 7-38
CIC0 Event Inputs (Secondary Interrupts for C66x CorePacs) (Part 5 of 5)
Input Event# on CIC
System Interrupt
Description
136
PASS_INT_PKTDMA_0
Network coprocessor Interrupt for packet DMA starvation
137
SmartReflex_intrreq0
SmartReflex sensor interrupt
138
SmartReflex_intrreq1
SmartReflex sensor interrupt
139
SmartReflex_intrreq2
SmartReflex sensor interrupt
140
SmartReflex_intrreq3
SmartReflex sensor interrupt
141
VPNoSMPSAck
VPVOLTUPDATE has been asserted but SMPS has not been responded to in a
defined time interval
142
VPEqValue
SRSINTERUPTZ is asserted, but the new voltage is not different from the
current SMPS voltage
143
VPMaxVdd
The new voltage required is equal to or greater than MaxVdd.
144
VPMinVdd
The new voltage required is equal to or less than MinVdd.
145
VPINIDLE
The FSM of Voltage processor is in idle.
146
VPOPPChangeDone
The average frequency error is within the desired limit.
147
Reserved
148
UARTINT
UART interrupt
149
URXEVT
UART receive event
150
UTXEVT
UART transmit event
151
QM_INT_PASS_TXQ_PEND_17
Queue manager pend event
152
QM_INT_PASS_TXQ_PEND_18
Queue manager pend event
153
QM_INT_PASS_TXQ_PEND_19
Queue manager pend event
154
QM_INT_PASS_TXQ_PEND_20
Queue manager pend event
155
QM_INT_PASS_TXQ_PEND_21
Queue manager pend event
156
QM_INT_PASS_TXQ_PEND_22
Queue manager pend event
157
QM_INT_PASS_TXQ_PEND_23
Queue manager pend event
158
QM_INT_PASS_TXQ_PEND_24
Queue manager pend event
159
QM_INT_PASS_TXQ_PEND_25
Queue manager pend event
End of Table 7-38
Table 7-39
CIC2 Event Inputs (Secondary Events for EDMA3CC1 and EDMA3CC2) (Part 1 of 5)
Input Event # on CIC
System Interrupt
Description
0
GPINT8
GPIO interrupt
1
GPINT9
GPIO interrupt
2
GPINT10
GPIO interrupt
3
GPINT11
GPIO interrupt
4
GPINT12
GPIO interrupt
5
GPINT13
GPIO interrupt
6
GPINT14
GPIO interrupt
7
GPINT15
GPIO interrupt
8
TETBHFULLINT
System TETB is half full
9
TETBFULLINT
System TETB is full
10
TETBACQINT
System TETB acquisition has been completed
11
TETBHFULLINT0
TETB0 is half full
12
TETBFULLINT0
TETB0 is full
13
TETBACQINT0
TETB0 acquisition has been completed
170
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Table 7-39
CIC2 Event Inputs (Secondary Events for EDMA3CC1 and EDMA3CC2) (Part 2 of 5)
Input Event # on CIC
System Interrupt
Description
14
Reserved
15
Reserved
16
Reserved
17
Reserved
18
Reserved
19
Reserved
20
Reserved
21
Reserved
22
Reserved
23
Reserved
24
QM_INT_HIGH_16
QM interrupt
25
QM_INT_HIGH_17
QM interrupt
26
QM_INT_HIGH_18
QM interrupt
27
QM_INT_HIGH_19
QM interrupt
28
QM_INT_HIGH_20
QM interrupt
29
QM_INT_HIGH_21
QM interrupt
30
QM_INT_HIGH_22
QM interrupt
31
QM_INT_HIGH_23
QM interrupt
32
QM_INT_HIGH_24
QM interrupt
33
QM_INT_HIGH_25
QM interrupt
34
QM_INT_HIGH_26
QM interrupt
35
QM_INT_HIGH_27
QM interrupt
36
QM_INT_HIGH_28
QM interrupt
37
QM_INT_HIGH_29
QM interrupt
38
QM_INT_HIGH_30
QM interrupt
39
QM_INT_HIGH_31
QM interrupt
40
MDIO_LINK_INTR0
Network coprocessor MDIO interrupt
41
MDIO_LINK_INTR1
Network coprocessor MDIO interrupt
42
MDIO_USER_INTR0
Network coprocessor MDIO interrupt
43
MDIO_USER_INTR0
Network coprocessor MDIO interrupt
44
MISC_INTR
Network coprocessor MISC interrupt
45
TRACER_CORE_0_INTD
Tracer sliding time window interrupt for individual core
46
Reserved
47
Reserved
48
Reserved
49
TRACER_DDR_INTD
Tracer sliding time window interrupt for DDR3 EMIF
50
TRACER_MSMC_0_INTD
Tracer sliding time window interrupt for MSMC SRAM bank0
51
TRACER_MSMC_1_INTD
Tracer sliding time window interrupt for MSMC SRAM bank1
52
TRACER_MSMC_2_INTD
Tracer sliding time window interrupt for MSMC SRAM bank2
53
TRACER_MSMC_3_INTD
Tracer sliding time window interrupt for MSMC SRAM bank3
54
TRACER_CFG_INTD
Tracer sliding time window interrupt for CFG0 TeraNet
55
TRACER_QM_CFG_INTD
Tracer sliding time window interrupt for QM_SS CFG
56
TRACER_QM_DMA_INTD
Tracer sliding time window interrupt for QM_SS slave port
57
TRACER_SM_INTD
Tracer sliding time window interrupt for semaphore
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Table 7-39
CIC2 Event Inputs (Secondary Events for EDMA3CC1 and EDMA3CC2) (Part 3 of 5)
Input Event # on CIC
System Interrupt
Description
58
SEMERR0
Semaphore interrupt
59
Reserved
60
Reserved
61
Reserved
62
BOOTCFG_INTD
BOOTCFG interrupt BOOTCFG_ERR and BOOTCFG_PROT
63
PASS_INT_PKTDMA_0
Network coprocessor interrupt for packet DMA starvation
64
MPU0_INTD (MPU0_ADDR_ERR_INT and
MPU0_PROT_ERR_INT combined)
MPU0 addressing violation interrupt and protection violation interrupt.
65
MSMC_scrub_cerror
Correctable (1-bit) soft error detected during scrub cycle
66
MPU1_INTD (MPU1_ADDR_ERR_INT and
MPU1_PROT_ERR_INT combined)
MPU1 addressing violation interrupt and protection violation interrupt.
67
RapidIO_INT_PKTDMA_0
RapidIO interrupt for packet DMA starvation
68
MPU2_INTD (MPU2_ADDR_ERR_INT and
MPU2_PROT_ERR_INT combined)
MPU2 addressing violation interrupt and protection violation interrupt.
69
QM_INT_PKTDMA_0
QM interrupt for packet DMA starvation
70
MPU3_INTD (MPU3_ADDR_ERR_INT and
MPU3_PROT_ERR_INT combined)
MPU3 addressing violation interrupt and protection violation interrupt.
71
QM_INT_PKTDMA_1
QM interrupt for packet DMA starvation
72
MSMC_dedc_cerror
Correctable (1-bit) soft error detected on SRAM read
73
MSMC_dedc_nc_error
Non-correctable (2-bit) soft error detected on SRAM read
74
MSMC_scrub_nc_error
Non-correctable (2-bit) soft error detected during scrub cycle
75
Reserved
76
MSMC_mpf_error0
Memory protection fault indicators for each system master PrivID
77
MSMC_mpf_error1
Memory protection fault indicators for each system master PrivID
78
MSMC_mpf_error2
Memory protection fault indicators for each system master PrivID
79
MSMC_mpf_error3
Memory protection fault indicators for each system master PrivID
80
MSMC_mpf_error4
Memory protection fault indicators for each system master PrivID
81
MSMC_mpf_error5
Memory protection fault indicators for each system master PrivID
82
MSMC_mpf_error6
Memory protection fault indicators for each system master PrivID
83
MSMC_mpf_error7
Memory protection fault indicators for each system master PrivID
84
MSMC_mpf_error8
Memory protection fault indicators for each system master PrivID
85
MSMC_mpf_error9
Memory protection fault indicators for each system master PrivID
86
MSMC_mpf_error10
Memory protection fault indicators for each system master PrivID
87
MSMC_mpf_error11
Memory protection fault indicators for each system master PrivID
88
MSMC_mpf_error12
Memory protection fault indicators for each system master PrivID
89
MSMC_mpf_error13
Memory protection fault indicators for each system master PrivID
90
MSMC_mpf_error14
Memory protection fault indicators for each system master PrivID
91
MSMC_mpf_error15
Memory protection fault indicators for each system master PrivID
92
Reserved
93
INTDST0
RapidIO interrupt
94
INTDST1
RapidIO interrupt
95
INTDST2
RapidIO interrupt
96
INTDST3
RapidIO interrupt
97
INTDST4
RapidIO interrupt
98
INTDST5
RapidIO interrupt
172
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Table 7-39
CIC2 Event Inputs (Secondary Events for EDMA3CC1 and EDMA3CC2) (Part 4 of 5)
Input Event # on CIC
System Interrupt
Description
99
INTDST6
RapidIO interrupt
100
INTDST7
RapidIO interrupt
101
INTDST8
RapidIO interrupt
102
INTDST9
RapidIO interrupt
103
INTDST10
RapidIO interrupt
104
INTDST11
RapidIO interrupt
105
INTDST12
RapidIO interrupt
106
INTDST13
RapidIO interrupt
107
INTDST14
RapidIO interrupt
108
INTDST15
RapidIO interrupt
109
INTDST16
RapidIO interrupt
110
INTDST17
RapidIO interrupt
111
INTDST18
RapidIO interrupt
112
INTDST19
RapidIO interrupt
113
INTDST20
RapidIO interrupt
114
INTDST21
RapidIO interrupt
115
INTDST22
RapidIO interrupt
116
INTDST23
RapidIO interrupt
117
EASYNCERR
EMIF16 error interrupt
118
Reserved
119
Reserved
120
Reserved
121
Reserved
122
Reserved
123
Reserved
124
Reserved
125
Reserved
126
Reserved
127
Reserved
128
Reserved
129
Reserved
130
Reserved
131
Reserved
132
Reserved
133
Reserved
134
Reserved
135
Reserved
136
Reserved
137
Reserved
138
QM_INT_HIGH_0
QM interrupt
139
QM_INT_HIGH_1
QM interrupt
140
QM_INT_HIGH_2
QM interrupt
141
QM_INT_HIGH_3
QM interrupt
142
QM_INT_HIGH_4
QM interrupt
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Table 7-39
CIC2 Event Inputs (Secondary Events for EDMA3CC1 and EDMA3CC2) (Part 5 of 5)
Input Event # on CIC
System Interrupt
Description
143
QM_INT_HIGH_5
QM interrupt
144
QM_INT_HIGH_6
QM interrupt
145
QM_INT_HIGH_7
QM interrupt
146
QM_INT_HIGH_8
QM interrupt
147
QM_INT_HIGH_9
QM interrupt
148
QM_INT_HIGH_10
QM interrupt
149
QM_INT_HIGH_11
QM interrupt
150
QM_INT_HIGH_12
QM interrupt
151
QM_INT_HIGH_13
QM interrupt
152
QM_INT_HIGH_14
QM interrupt
153
QM_INT_HIGH_15
QM interrupt
154-159
Reserved
End of Table 7-39
Table 7-40
CIC3 Event Inputs (Secondary Events for EDMA3CC0 and HyperLink) (Part 1 of 2)
Input Event # on CIC
System Interrupt
Description
0
GPINT0
GPIO interrupt
1
GPINT1
GPIO interrupt
2
GPINT2
GPIO interrupt
3
GPINT3
GPIO interrupt
4
GPINT4
GPIO interrupt
5
GPINT5
GPIO interrupt
6
GPINT6
GPIO interrupt
7
GPINT7
GPIO interrupt
8
GPINT8
GPIO interrupt
9
GPINT9
GPIO interrupt
10
GPINT10
GPIO interrupt
11
GPINT11
GPIO interrupt
12
GPINT12
GPIO interrupt
13
GPINT13
GPIO interrupt
14
GPINT14
GPIO interrupt
15
GPINT15
GPIO interrupt
16
TETBHFULLINT
System TETB is half full
17
TETBFULLINT
System TETB is full
18
TETBACQINT
System TETB acquisition has been completed
19
TETBHFULLINT0
TETB0 is half full
20
TETBFULLINT0
TETB0 is full
21
TETBACQINT0
TETB0 acquisition has been completed
22
Reserved
23
Reserved
24
Reserved
25
Reserved
26
Reserved
174
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Table 7-40
CIC3 Event Inputs (Secondary Events for EDMA3CC0 and HyperLink) (Part 2 of 2)
Input Event # on CIC
System Interrupt
27
Reserved
28
Reserved
29
Reserved
30
Reserved
Description
31
TRACER_CORE_0_INTD
32
Reserved
Tracer sliding time window interrupt for individual core
33
Reserved
34
Reserved
35
TRACER_DDR_INTD
Tracer sliding time window interrupt for DDR3 EMIF1
36
TRACER_MSMC_0_INTD
Tracer sliding time window interrupt for MSMC SRAM bank0
37
TRACER_MSMC_1_INTD
Tracer sliding time window interrupt for MSMC SRAM bank1
38
TRACER_MSMC_2_INTD
Tracer sliding time window interrupt for MSMC SRAM bank2
39
TRACER_MSMC_3_INTD
Tracer sliding time window interrupt for MSMC SRAM bank3
40
TRACER_CFG_INTD
Tracer sliding time window interrupt for CFG0 TeraNet
41
TRACER_QM_CFG_INTD
Tracer sliding time window interrupt for QM_SS CFG
42
TRACER_QM_DMA_INTD
Tracer sliding time window interrupt for QM_SS slave port
43
TRACER_SM_INTD
Tracer sliding time window interrupt for semaphore
44
VUSR_INT_O
HyperLink interrupt
45
Reserved
46
Reserved
47
Reserved
48
Reserved
49
Reserved
50
Reserved
51
Reserved
52
Reserved
53
Reserved
54
Reserved
55
Reserved
56
Reserved
57
Reserved
58
Reserved
59
Reserved
60
Reserved
61
DDR3_ERR
62-79
Reserved
DDR3 EMIF Error interrupt
End of Table 7-40
7.10.2 CIC Registers
This section includes the offsets for CIC registers. The base addresses for interrupt control registers are CIC0 0x0260 0000, CIC2 - 0x0260 8000, and CIC3 - 0x0260 C000.
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7.10.2.1 CIC0 Register Map
Table 7-41
CIC0 Register
Address Offset
Register Mnemonic
Register Name
0x0
REVISION_REG
Revision Register
0x10
GLOBAL_ENABLE_HINT_REG
Global Host Int Enable Register
0x20
STATUS_SET_INDEX_REG
Status Set Index Register
0x24
STATUS_CLR_INDEX_REG
Status Clear Index Register
0x28
ENABLE_SET_INDEX_REG
Enable Set Index Register
0x2C
ENABLE_CLR_INDEX_REG
Enable Clear Index Register
0x34
HINT_ENABLE_SET_INDEX_REG
Host Int Enable Set Index Register
0x38
HINT_ENABLE_CLR_INDEX_REG
Host Int Enable Clear Index Register
0x200
RAW_STATUS_REG0
Raw Status Register 0
0x204
RAW_STATUS_REG1
Raw Status Register 1
0x208
RAW_STATUS_REG2
Raw Status Register 2
0x20C
RAW_STATUS_REG3
Raw Status Register 3
0x210
RAW_STATUS_REG4
Raw Status Register 4
0x280
ENA_STATUS_REG0
Enabled Status Register 0
0x284
ENA_STATUS_REG1
Enabled Status Register 1
0x288
ENA_STATUS_REG2
Enabled Status Register 2
0x28c
ENA_STATUS_REG3
Enabled Status Register 3
0x290
ENA_STATUS_REG4
Enabled Status Register 4
0x300
ENABLE_REG0
Enable Register 0
0x304
ENABLE_REG1
Enable Register 1
0x308
ENABLE_REG2
Enable Register 2
0x30c
ENABLE_REG3
Enable Register 3
0x310
ENABLE_REG4
Enable Register 4
0x380
ENABLE_CLR_REG0
Enable Clear Register 0
0x384
ENABLE_CLR_REG1
Enable Clear Register 1
0x388
ENABLE_CLR_REG2
Enable Clear Register 2
0x38c
ENABLE_CLR_REG3
Enable Clear Register 3
0x390
ENABLE_CLR_REG4
Enable Clear Register 4
0x400
CH_MAP_REG0
Interrupt Channel Map Register for 0 to 0+3
0x404
CH_MAP_REG1
Interrupt Channel Map Register for 4 to 4+3
0x408
CH_MAP_REG2
Interrupt Channel Map Register for 8 to 8+3
0x40c
CH_MAP_REG3
Interrupt Channel Map Register for 12 to 12+3
0x410
CH_MAP_REG4
Interrupt Channel Map Register for 16 to 16+3
0x414
CH_MAP_REG5
Interrupt Channel Map Register for 20 to 20+3
0x418
CH_MAP_REG6
Interrupt Channel Map Register for 24 to 24+3
0x41c
CH_MAP_REG7
Interrupt Channel Map Register for 28 to 28+3
0x420
CH_MAP_REG8
Interrupt Channel Map Register for 32 to 32+3
0x424
CH_MAP_REG9
Interrupt Channel Map Register for 36 to 36+3
0x428
CH_MAP_REG10
Interrupt Channel Map Register for 40 to 40+3
0x42c
CH_MAP_REG11
Interrupt Channel Map Register for 44 to 44+3
0x430
CH_MAP_REG12
Interrupt Channel Map Register for 48 to 48+3
0x434
CH_MAP_REG13
Interrupt Channel Map Register for 52 to 52+3
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Table 7-41
CIC0 Register
Address Offset
Register Mnemonic
Register Name
0x438
CH_MAP_REG14
Interrupt Channel Map Register for 56 to 56+3
0x43c
CH_MAP_REG15
Interrupt Channel Map Register for 60 to 60+3
0x440
CH_MAP_REG16
Interrupt Channel Map Register for 64 to 64+3
0x444
CH_MAP_REG17
Interrupt Channel Map Register for 68 to 68+3
0x448
CH_MAP_REG18
Interrupt Channel Map Register for 72 to 72+3
0x44c
CH_MAP_REG19
Interrupt Channel Map Register for 76 to 76+3
0x450
CH_MAP_REG20
Interrupt Channel Map Register for 80 to 80+3
0x454
CH_MAP_REG21
Interrupt Channel Map Register for 84 to 84+3
0x458
CH_MAP_REG22
Interrupt Channel Map Register for 88 to 88+3
0x45c
CH_MAP_REG23
Interrupt Channel Map Register for 92 to 92+3
0x460
CH_MAP_REG24
Interrupt Channel Map Register for 96 to 96+3
0x464
CH_MAP_REG25
Interrupt Channel Map Register for 100 to 100+3
0x468
CH_MAP_REG26
Interrupt Channel Map Register for 104 to 104+3
0x46c
CH_MAP_REG27
Interrupt Channel Map Register for 108 to 108+3
0x470
CH_MAP_REG28
Interrupt Channel Map Register for 112 to 112+3
0x474
CH_MAP_REG29
Interrupt Channel Map Register for 116 to 116+3
0x478
CH_MAP_REG30
Interrupt Channel Map Register for 120 to 120+3
0x47c
CH_MAP_REG31
Interrupt Channel Map Register for 124 to 124+3
0x480
CH_MAP_REG32
Interrupt Channel Map Register for 128 to 128+3
0x484
CH_MAP_REG33
Interrupt Channel Map Register for 132 to 132+3
0x488
CH_MAP_REG34
Interrupt Channel Map Register for 136 to 136+3
0x48c
CH_MAP_REG35
Interrupt Channel Map Register for 140 to 140+3
0x490
CH_MAP_REG36
Interrupt Channel Map Register for 144 to 144+3
0x494
CH_MAP_REG37
Interrupt Channel Map Register for 148 to 148+3
0x498
CH_MAP_REG38
Interrupt Channel Map Register for 152 to 152+3
0x49c
CH_MAP_REG39
Interrupt Channel Map Register for 156 to 156+3
0x800
HINT_MAP_REG0
Host Interrupt Map Register for 0 to 0+3
0x804
HINT_MAP_REG1
Host Interrupt Map Register for 4 to 4+3
0x808
HINT_MAP_REG2
Host Interrupt Map Register for 8 to 8+3
0x80c
HINT_MAP_REG3
Host Interrupt Map Register for 12 to 12+3
0x810
HINT_MAP_REG4
Host Interrupt Map Register for 16 to 16+3
0x814
HINT_MAP_REG5
Host Interrupt Map Register for 20 to 20+3
0x818
HINT_MAP_REG6
Host Interrupt Map Register for 24 to 24+3
0x81c
HINT_MAP_REG7
Host Interrupt Map Register for 28 to 28+3
0x820
HINT_MAP_REG8
Host Interrupt Map Register for 32 to 32+3
0x824
HINT_MAP_REG9
Host Interrupt Map Register for 36 to 36+3
0x828
HINT_MAP_REG10
Host Interrupt Map Register for 40 to 40+3
0x82c
HINT_MAP_REG11
Host Interrupt Map Register for 44 to 44+3
0x830
HINT_MAP_REG12
Host Interrupt Map Register for 48 to 48+3
0x834
HINT_MAP_REG13
Host Interrupt Map Register for 52 to 52+3
0x838
HINT_MAP_REG14
Host Interrupt Map Register for 56 to 56+3
0x83c
HINT_MAP_REG15
Host Interrupt Map Register for 60 to 60+3
0x840
HINT_MAP_REG16
Host Interrupt Map Register for 64 to 64+3
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Table 7-41
CIC0 Register
Address Offset
Register Mnemonic
Register Name
0x844
HINT_MAP_REG17
Host Interrupt Map Register for 68 to 68+3
0x848
HINT_MAP_REG18
Host Interrupt Map Register for 72 to 72+3
0x1500
ENABLE_HINT_REG0
Host Int Enable Register 0
0x1504
ENABLE_HINT_REG1
Host Int Enable Register 1
0x1508
ENABLE_HINT_REG2
Host Int Enable Register 2
End of Table 7-41
7.10.2.2 CIC2 Register Map
Table 7-42
CIC2 Register
Address Offset
Register Mnemonic
Register Name
0x0
REVISION_REG
Revision Register
0x10
GLOBAL_ENABLE_HINT_REG
Global Host Int Enable Register
0x20
STATUS_SET_INDEX_REG
Status Set Index Register
0x24
STATUS_CLR_INDEX_REG
Status Clear Index Register
0x28
ENABLE_SET_INDEX_REG
Enable Set Index Register
0x2c
ENABLE_CLR_INDEX_REG
Enable Clear Index Register
0x34
HINT_ENABLE_SET_INDEX_REG
Host Int Enable Set Index Register
0x38
HINT_ENABLE_CLR_INDEX_REG
Host Int Enable Clear Index Register
0x200
RAW_STATUS_REG0
Raw Status Register 0
0x204
RAW_STATUS_REG1
Raw Status Register 1
0x208
RAW_STATUS_REG2
Raw Status Register 2
0x20c
RAW_STATUS_REG3
Raw Status Register 3
0x210
RAW_STATUS_REG4
Raw Status Register 4
0x280
ENA_STATUS_REG0
Enabled Status Register 0
0x284
ENA_STATUS_REG1
Enabled Status Register 1
0x288
ENA_STATUS_REG2
Enabled Status Register 2
0x28c
ENA_STATUS_REG3
Enabled Status Register 3
0x290
ENA_STATUS_REG4
Enabled Status Register 4
0x300
ENABLE_REG0
Enable Register 0
0x304
ENABLE_REG1
Enable Register 1
0x308
ENABLE_REG2
Enable Register 2
0x30c
ENABLE_REG3
Enable Register 3
0x310
ENABLE_REG4
Enable Register 4
0x380
ENABLE_CLR_REG0
Enable Clear Register 0
0x384
ENABLE_CLR_REG1
Enable Clear Register 1
0x388
ENABLE_CLR_REG2
Enable Clear Register 2
0x38c
ENABLE_CLR_REG3
Enable Clear Register 3
0x390
ENABLE_CLR_REG4
Enable Clear Register 4
0x400
CH_MAP_REG0
Interrupt Channel Map Register for 0 to 0+3
0x404
CH_MAP_REG1
Interrupt Channel Map Register for 4 to 4+3
0x408
CH_MAP_REG2
Interrupt Channel Map Register for 8 to 8+3
0x40c
CH_MAP_REG3
Interrupt Channel Map Register for 12 to 12+3
0x410
CH_MAP_REG4
Interrupt Channel Map Register for 16 to 16+3
178
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Table 7-42
CIC2 Register
Address Offset
Register Mnemonic
Register Name
0x414
CH_MAP_REG5
Interrupt Channel Map Register for 20 to 20+3
0x418
CH_MAP_REG6
Interrupt Channel Map Register for 24 to 24+3
0x41c
CH_MAP_REG7
Interrupt Channel Map Register for 28 to 28+3
0x420
CH_MAP_REG8
Interrupt Channel Map Register for 32 to 32+3
0x424
CH_MAP_REG9
Interrupt Channel Map Register for 36 to 36+3
0x428
CH_MAP_REG10
Interrupt Channel Map Register for 40 to 40+3
0x42c
CH_MAP_REG11
Interrupt Channel Map Register for 44 to 44+3
0x430
CH_MAP_REG12
Interrupt Channel Map Register for 48 to 48+3
0x434
CH_MAP_REG13
Interrupt Channel Map Register for 52 to 52+3
0x438
CH_MAP_REG14
Interrupt Channel Map Register for 56 to 56+3
0x43c
CH_MAP_REG15
Interrupt Channel Map Register for 60 to 60+3
0x440
CH_MAP_REG16
Interrupt Channel Map Register for 64 to 64+3
0x444
CH_MAP_REG17
Interrupt Channel Map Register for 68 to 68+3
0x448
CH_MAP_REG18
Interrupt Channel Map Register for 72 to 72+3
0x44c
CH_MAP_REG19
Interrupt Channel Map Register for 76 to 76+3
0x450
CH_MAP_REG20
Interrupt Channel Map Register for 80 to 80+3
0x454
CH_MAP_REG21
Interrupt Channel Map Register for 84 to 84+3
0x458
CH_MAP_REG22
Interrupt Channel Map Register for 88 to 88+3
0x45c
CH_MAP_REG23
Interrupt Channel Map Register for 92 to 92+3
0x460
CH_MAP_REG24
Interrupt Channel Map Register for 96 to 96+3
0x464
CH_MAP_REG25
Interrupt Channel Map Register for 100 to 100+3
0x468
CH_MAP_REG26
Interrupt Channel Map Register for 104 to 104+3
0x46c
CH_MAP_REG27
Interrupt Channel Map Register for 108 to 108+3
0x470
CH_MAP_REG28
Interrupt Channel Map Register for 112 to 112+3
0x474
CH_MAP_REG29
Interrupt Channel Map Register for 116 to 116+3
0x478
CH_MAP_REG30
Interrupt Channel Map Register for 120 to 120+3
0x47c
CH_MAP_REG31
Interrupt Channel Map Register for 124 to 124+3
0x480
CH_MAP_REG32
Interrupt Channel Map Register for 128 to 128+3
0x484
CH_MAP_REG33
Interrupt Channel Map Register for 132 to 132+3
0x488
CH_MAP_REG34
Interrupt Channel Map Register for 136 to 136+3
0x48c
CH_MAP_REG35
Interrupt Channel Map Register for 140 to 140+3
0x490
CH_MAP_REG36
Interrupt Channel Map Register for 144 to 144+3
0x494
CH_MAP_REG37
Interrupt Channel Map Register for 148 to 148+3
0x498
CH_MAP_REG38
Interrupt Channel Map Register for 152 to 152+3
0x49c
CH_MAP_REG39
Interrupt Channel Map Register for 156 to 156+3
0x800
HINT_MAP_REG0
Host Interrupt Map Register for 0 to 0+3
0x804
HINT_MAP_REG1
Host Interrupt Map Register for 4 to 4+3
0x808
HINT_MAP_REG2
Host Interrupt Map Register for 8 to 8+3
0x80c
HINT_MAP_REG3
Host Interrupt Map Register for 12 to 12+3
0x810
HINT_MAP_REG4
Host Interrupt Map Register for 16 to 16+3
0x814
HINT_MAP_REG5
Host Interrupt Map Register for 20 to 20+3
0x818
HINT_MAP_REG6
Host Interrupt Map Register for 24 to 24+3
0x81c
HINT_MAP_REG7
Host Interrupt Map Register for 28 to 28+3
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Table 7-42
CIC2 Register
Address Offset
Register Mnemonic
Register Name
0x820
HINT_MAP_REG8
Host Interrupt Map Register for 32 to 32+3
0x824
HINT_MAP_REG9
Host Interrupt Map Register for 36 to 36+3
0x828
HINT_MAP_REG10
Host Interrupt Map Register for 40 to 40+3
0x82c
HINT_MAP_REG11
Host Interrupt Map Register for 44 to 44+3
0x830
HINT_MAP_REG12
Host Interrupt Map Register for 48 to 48+3
0x1500
ENABLE_HINT_REG0
Host Int Enable Register 0
0x1504
ENABLE_HINT_REG1
Host Int Enable Register 1
End of Table 7-42
7.10.2.3 CIC3 Register Map
Table 7-43
CIC3 Register
Address Offset
Register Mnemonic
Register Name
0x0
REVISION_REG
Revision Register
0x10
GLOBAL_ENABLE_HINT_REG
Global Host Int Enable Register
0x20
STATUS_SET_INDEX_REG
Status Set Index Register
0x24
STATUS_CLR_INDEX_REG
Status Clear Index Register
0x28
ENABLE_SET_INDEX_REG
Enable Set Index Register
0x2c
ENABLE_CLR_INDEX_REG
Enable Clear Index Register
0x34
HINT_ENABLE_SET_INDEX_REG
Host Int Enable Set Index Register
0x38
HINT_ENABLE_CLR_INDEX_REG
Host Int Enable Clear Index Register
0x200
RAW_STATUS_REG0
Raw Status Register 0
0x204
RAW_STATUS_REG1
Raw Status Register 1
0x280
ENA_STATUS_REG0
Enabled Status Register 0
0x284
ENA_STATUS_REG1
Enabled Status Register 1
0x300
ENABLE_REG0
Enable Register 0
0x304
ENABLE_REG1
Enable Register 1
0x380
ENABLE_CLR_REG0
Enable Clear Register 0
0x384
ENABLE_CLR_REG1
Enable Clear Register 1
0x400
CH_MAP_REG0
Interrupt Channel Map Register for 0 to 0+3
0x404
CH_MAP_REG1
Interrupt Channel Map Register for 4 to 4+3
0x408
CH_MAP_REG2
Interrupt Channel Map Register for 8 to 8+3
0x40c
CH_MAP_REG3
Interrupt Channel Map Register for 12 to 12+3
0x410
CH_MAP_REG4
Interrupt Channel Map Register for 16 to 16+3
0x414
CH_MAP_REG5
Interrupt Channel Map Register for 20 to 20+3
0x418
CH_MAP_REG6
Interrupt Channel Map Register for 24 to 24+3
0x41c
CH_MAP_REG7
Interrupt Channel Map Register for 28 to 28+3
0x420
CH_MAP_REG8
Interrupt Channel Map Register for 32 to 32+3
0x424
CH_MAP_REG9
Interrupt Channel Map Register for 36 to 36+3
0x428
CH_MAP_REG10
Interrupt Channel Map Register for 40 to 40+3
0x42c
CH_MAP_REG11
Interrupt Channel Map Register for 44 to 44+3
0x430
CH_MAP_REG12
Interrupt Channel Map Register for 48 to 48+3
0x434
CH_MAP_REG13
Interrupt Channel Map Register for 52 to 52+3
0x438
CH_MAP_REG14
Interrupt Channel Map Register for 56 to 56+3
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Table 7-43
CIC3 Register
Address Offset
Register Mnemonic
Register Name
0x43c
CH_MAP_REG15
Interrupt Channel Map Register for 60 to 60+3
0x800
HINT_MAP_REG0
Host Interrupt Map Register for 0 to 0+3
0x804
HINT_MAP_REG1
Host Interrupt Map Register for 4 to 4+3
0x808
HINT_MAP_REG2
Host Interrupt Map Register for 8 to 8+3
0x80c
HINT_MAP_REG3
Host Interrupt Map Register for 12 to 12+3
0x810
HINT_MAP_REG4
Host Interrupt Map Register for 16 to 16+3
0x814
HINT_MAP_REG5
Host Interrupt Map Register for 20 to 20+3
0x818
HINT_MAP_REG6
Host Interrupt Map Register for 24 to 24+3
0x81c
HINT_MAP_REG7
Host Interrupt Map Register for 28 to 28+3
0x820
HINT_MAP_REG8
Host Interrupt Map Register for 32 to 32+3
0x824
HINT_MAP_REG9
Host Interrupt Map Register for 36 to 36+3
0x1500
ENABLE_HINT_REG0
Host Int Enable Register 0
0x1504
ENABLE_HINT_REG1
Host Int Enable Register 1
End of Table 7-43
7.10.3 Inter-Processor Register Map
Table 7-44
IPC Generation Registers (IPCGRx) (Part 1 of 2)
Address Start
Address End
Size
Register Name
Description
0x02620200
0x02620203
4B
NMIGR0
NMI Event Generation Register for CorePac0
0x02620204
0x02620207
4B
Reserved
Reserved
0x02620208
0x0262020B
4B
Reserved
Reserved
0x0262020C
0x0262020F
4B
Reserved
Reserved
0x02620210
0x02620213
4B
Reserved
Reserved
0x02620214
0x02620217
4B
Reserved
Reserved
0x02620218
0x0262021B
4B
Reserved
Reserved
0x0262021C
0x0262021F
4B
Reserved
Reserved
0x02620220
0x0262023F
32B
Reserved
Reserved
0x02620240
0x02620243
4B
IPCGR0
IPC Generation Register for CorePac 0
0x02620244
0x02620247
4B
Reserved
Reserved
0x02620248
0x0262024B
4B
Reserved
Reserved
0x0262024C
0x0262024F
4B
Reserved
Reserved
0x02620250
0x02620253
4B
Reserved
Reserved
0x02620254
0x02620257
4B
Reserved
Reserved
0x02620258
0x0262025B
4B
Reserved
Reserved
0x0262025C
0x0262025F
4B
Reserved
Reserved
0x02620260
0x0262027B
28B
Reserved
Reserved
0x0262027C
0x0262027F
4B
IPCGRH
IPC Generation Register for Host
0x02620280
0x02620283
4B
IPCAR0
IPC Acknowledgement Register for CorePac 0
0x02620284
0x02620287
4B
Reserved
Reserved
0x02620288
0x0262028B
4B
Reserved
Reserved
0x0262028C
0x0262028F
4B
Reserved
Reserved
0x02620290
0x02620293
4B
Reserved
Reserved
0x02620294
0x02620297
4B
Reserved
Reserved
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Table 7-44
IPC Generation Registers (IPCGRx) (Part 2 of 2)
Address Start
Address End
Size
Register Name
Description
0x02620298
0x0262029B
4B
Reserved
Reserved
0x0262029C
0x0262029F
4B
Reserved
Reserved
0x026202A0
0x026202BB
28B
Reserved
Reserved
0x026202BC
0x026202BF
4B
IPCARH
IPC Acknowledgement Register for Host
End of Table 7-44
7.10.4 NMI and LRESET
Non-maskable interrupts (NMI) can be generated by chip-level registers and the LRESET can be generated by
software writing into LPSC registers. LRESET and NMI can also be asserted by device pins or watchdog timers. One
NMI pin and one LRESET pin are shared by all CorePacs on the device. The CORESEL[3:0] pins can be configured
to select between the CorePacs available as shown in Table 7-45.
Table 7-45
LRESET and NMI Decoding
CORESEL[3:0] Pin Input LRESET Pin Input NMI Pin Input
LRESETNMIEN Pin Input
Reset Mux Block Output
XXXX
X
X
1
No local reset or NMI assertion.
0000
0
X
0
Assert local reset to CorePac 0
0001
0
X
0
0010
0
X
0
0011
0
X
0
0100
0
X
0
0101
0
X
0
0110
0
X
0
0111
0
X
0
1xxx
0
X
0
Assert local reset to all CorePacs
0000
1
1
0
De-assert local reset & NMI to CorePac 0
0001
1
1
0
0010
1
1
0
0011
1
1
0
0100
1
1
0
0101
1
1
0
0110
1
1
0
0111
1
1
0
Reserved
Reserved
1xxx
1
1
0
De-assert local reset & NMI to all CorePacs
0000
1
0
0
Assert NMI to CorePac 0
0001
1
0
0
0010
1
0
0
0011
1
0
0
0100
1
0
0
0101
1
0
0
0110
1
0
0
0111
1
0
0
1xxx
1
0
0
Reserved
Assert NMI to all CorePacs
End of Table 7-45
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7.10.5 External Interrupts Electrical Data/Timing
NMI and Local Reset Timing Requirements (1)
Table 7-46
(see Figure 7-33)
No.
Min
1
tsu(LRESET-LRESETNMIENL)
Setup Time - LRESET valid before LRESETNMIEN low
Max
Unit
12*P
ns
1
tsu(NMI-LRESETNMIENL)
Setup Time - NMI valid before LRESETNMIEN low
12*P
ns
1
tsu(CORESELn-LRESETNMIENL)
Setup Time - CORESEL[2:0] valid before LRESETNMIEN low
12*P
ns
2
th(LRESETNMIENL-LRESET)
Hold Time - LRESET valid after LRESETNMIEN high
12*P
ns
2
th(LRESETNMIENL-NMI)
Hold Time - NMI valid after LRESETNMIEN high
12*P
ns
2
th(LRESETNMIENL-CORESELn)
Hold Time - CORESEL[2:0] valid after LRESETNMIEN high
12*P
ns
3
tw(LRESETNMIEN)
Pulse Width - LRESETNMIEN low width
12*P
ns
End of Table 7-46
1 P = 1/SYSCLK1 frequency in ns.
Figure 7-33
NMI and Local Reset Timing
1
2
CORESEL[3:0]/
LRESET/
NMI
3
LRESETNMIEN
7.10.6 Host Interrupt Output
The C66x CorePac can assert an event to the external host processor using HOUT. Table 7-47 shows the timing for
the HOUT pulse. For more details, see section 3.3.15 .
Table 7-47
HOUT Switching Characteristics
(see Figure 7-34)
No.
Min
1
tw(HOUTH)
HOUT pulse duration high
2
tw(HOUTL)
HOUT pulse duration low
Max
Unit
(1)
ns
24*P
ns
24*P
End of Table 7-47
1 P = 1/SYSCLK1 frequency in ns.
Figure 7-34
HOUT Timing
1
2
HOUT
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7.11 Memory Protection Unit (MPU)
The C6671 supports four MPUs:
• One MPU is used to protect the main CORE/3 CFG TeraNet (the CFG space of all slave devices on the TeraNet
is protected by the MPU).
• Two MPUs are used for QM_SS (one for the DATA PORT port and one for the CFG PORT port).
• One MPU is used for Semaphore.
This section contains MPU register map and details of device-specific MPU registers only. For MPU features and
details of generic MPU registers, see the Memory Protection Unit (MPU) for KeyStone Devices User Guide in ‘‘Related
Documentation from Texas Instruments’’ on page 72.
The following tables show the configuration of each MPU and the memory regions protected by each MPU.
Table 7-48
MPU Default Configuration
Setting
MPU0
(Main CFG TeraNet)
MPU1
(QM_SS DATA PORT)
MPU2
(QM_SS CFG PORT)
MPU3
(Semaphore)
Default permission
Assume allowed
Assume allowed
Assume allowed
Assume allowed
Number of allowed IDs supported
16
16
16
16
Number of programmable ranges supported
16
5
16
1
Compare width
1KB granularity
1KB granularity
1KB granularity
1KB granularity
End of Table 7-48
Table 7-49
MPU Memory Regions
Memory Protection
Start Address
End Address
MPU0
Main CFG TeraNet
0x01D00000
0x026207FF
MPU1
QM_SS DATA PORT
0x34000000
0x340BFFFF
MPU2
QM_SS CFG PORT
0x02A00000
0x02ABFFFF
MPU3
Semaphore
0x02640000
0x026407FF
Table 7-50 shows the privilege ID of each CORE and every mastering peripheral. Table 7-50 also shows the privilege
level (supervisor vs. user), security level (secure vs. non-secure), and access type (instruction read vs. data/DMA read
or write) of each master on the device. In some cases, a particular setting depends on software being executed at the
time of the access or the configuration of the master peripheral.
Table 7-50
Privilege ID Settings (Part 1 of 2)
Privilege ID
Master
Privilege Level
Security Level
Access Type
0
CorePac0
SW dependant, driven by MSMC
SW dependant
DMA
1
Reserved
2
Reserved
3
Reserved
4
Reserved
5
Reserved
6
Reserved
7
Reserved
8
Network Coprocessor
Packet DMA
User
Non-secure
DMA
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Table 7-50
Privilege ID Settings (Part 2 of 2)
Privilege ID
Master
Privilege Level
9
SRIO Packet DMA/SRIO_M
Non-secure
User/Driven by SRIO block, User mode and supervisor mode is
determined on a per-transaction basis. Only the transaction with
source ID matching the value in the SupervisorID register is granted
supervisor mode.
Security Level
Access Type
DMA
10
QM_SS Packet
DMA/QM_SS Second
User
Non-secure
DMA
11
PCIe
Driven by PCIe module
Non-secure
DMA
12
Debug_SS
Driven by Debug_SS
Driven by Debug_SS
DMA
13
HyperLink
Driven by HyperLink
Non-secure
DMA
14
HyperLink
Supervisor
Non-secure
DMA
15
TSIP0/1
User
Non-secure
DMA
End of Table 7-50
Table 7-51 shows the master ID of each CorePac and every mastering peripheral. Master IDs are used to determine
allowed connections between masters and slaves. Unlike privilege IDs, which can be shared across different masters,
master IDs are unique to each master.
Table 7-51
Master ID Settings (Part 1 of 3) (1)
Master ID
Master
0
CorePac0
1
Reserved
2
Reserved
3
Reserved
4
Reserved
5
Reserved
6
Reserved
7
Reserved
8
CorePac0_CFG
9
Reserved
10
Reserved
11
Reserved
12
Reserved
13
Reserved
14
Reserved
15
Reserved
16
EDMA0_TC0 read
17
EDMA0_TC0 write
18
EDMA0_TC1 read
19
EDMA0_TC1 write
20
EDMA1_TC0 read
21
EDMA1_TC0 write
22
EDMA1_TC1 read
23
EDMA1_TC1 write
24
EDMA1_TC2 read
25
EDMA1_TC2 write
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Table 7-51
Master ID Settings (Part 2 of 3) (1)
Master ID
Master
26
EDMA1_TC3 read
27
EDMA1_TC3 write
28
EDMA2_TC0 read
29
EDMA2_TC0 write
30
EDMA2_TC1 read
31
EDMA2_TC1 write
32
EDMA2_TC2 read
33
EDMA2_TC2 write
34
EDMA2_TC3 read
35
EDMA2_TC3 write
36 - 37
Reserved
38 - 39
SRIO Packet DMA
40 - 47
Reserved
48
Debug SS
49
EDMA3CC0
50
EDMA3CC1
51
EDMA3CC2
52
MSMC
53
PCIe
(2)
54
SRIO_Master
55
HyperLink
56 - 59
Network Coprocessor Packet DMA
60 - 85
Reserved
86
TSIP0
87
TSIP1
88 - 91
Queue Manager Packet DMA
92 - 93
Queue Manager Second
94 - 127
Reserved
128
Tracer_core_0 (3)
129
Reserved
130
Reserved
131
Reserved
132
Reserved
133
Reserved
134
Reserved
135
Reserved
136
Tracer_MSMC0
137
Tracer_MSMC1
138
Tracer_MSMC2
139
Tracer_MSMC3
140
Tracer_DDR
141
Tracer_SM
142
Tracer_QM_CFG
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Table 7-51
Master ID Settings (Part 3 of 3) (1)
Master ID
Master
143
Tracer_QM_DMA
144
Tracer_CFG
End of Table 7-51
1 Some of the Packet DMA-based peripherals require multiple master IDs. Queue Manager Packet DMA is assigned with 88, 89, 90, 91, but only 88 - 89 are actually used. For the
network coprocessor packet DMA port, 56, 57, 58, and 59 are assigned, while only one (56) is actually used. There are two master ID values assigned for the queue manager
second master port: one master ID for external linking RAM and the other master ID for PDSP/MCDM accesses.
2 The master ID for MSMC is for the transactions initiated by MSMC internally and sent to the DDR.
3 All traces are set to the same master ID and bit 7 of the master ID must be 1.
7.11.1 MPU Registers
This section includes the offsets for MPU registers and definitions for device-specific MPU registers.
7.11.1.1 MPU Register Map
Table 7-52
MPU0 Registers (Part 1 of 2)
Offset
Name
Description
0h
REVID
Revision ID
4h
CONFIG
Configuration
10h
IRAWSTAT
Interrupt raw status/set
14h
IENSTAT
Interrupt enable status/clear
18h
IENSET
Interrupt enable
1Ch
IENCLR
Interrupt enable clear
20h
EOI
End of interrupt
200h
PROG0_MPSAR
Programmable range 0, start address
204h
PROG0_MPEAR
Programmable range 0, end address
208h
PROG0_MPPA
Programmable range 0, memory page protection attributes
210h
PROG1_MPSAR
Programmable range 1, start address
214h
PROG1_MPEAR
Programmable range 1, end address
218h
PROG1_MPPA
Programmable range 1, memory page protection attributes
220h
PROG2_MPSAR
Programmable range 2, start address
224h
PROG2_MPEAR
Programmable range 2, end address
228h
PROG2_MPPA
Programmable range 2, memory page protection attributes
230h
PROG3_MPSAR
Programmable range 3, start address
234h
PROG3_MPEAR
Programmable range 3, end address
238h
PROG3_MPPA
Programmable range 3, memory page protection attributes
240h
PROG4_MPSAR
Programmable range 4, start address
244h
PROG4_MPEAR
Programmable range 4, end address
248h
PROG4_MPPA
Programmable range 4, memory page protection attributes
250h
PROG5_MPSAR
Programmable range 5, start address
254h
PROG5_MPEAR
Programmable range 5, end address
258h
PROG5_MPPA
Programmable range 5, memory page protection attributes
260h
PROG6_MPSAR
Programmable range 6, start address
264h
PROG6_MPEAR
Programmable range 6, end address
268h
PROG6_MPPA
Programmable range 6, memory page protection attributes
270h
PROG7_MPSAR
Programmable range 7, start address
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Table 7-52
MPU0 Registers (Part 2 of 2)
Offset
Name
Description
274h
PROG7_MPEAR
Programmable range 7, end address
278h
PROG7_MPPA
Programmable range 7, memory page protection attributes
280h
PROG8_MPSAR
Programmable range 8, start address
284h
PROG8_MPEAR
Programmable range 8, end address
288h
PROG8_MPPA
Programmable range 8, memory page protection attributes
290h
PROG9_MPSAR
Programmable range 9, start address
294h
PROG9_MPEAR
Programmable range 9, end address
298h
PROG9_MPPA
Programmable range 9, memory page protection attributes
2A0h
PROG10_MPSAR
Programmable range 10, start address
2A4h
PROG10_MPEAR
Programmable range 10, end address
2A8h
PROG10_MPPA
Programmable range 10, memory page protection attributes
2B0h
PROG11_MPSAR
Programmable range 11, start address
2B4h
PROG11_MPEAR
Programmable range 11, end address
2B8h
PROG11_MPPA
Programmable range 11, memory page protection attributes
2C0h
PROG12_MPSAR
Programmable range 12, start address
2C4h
PROG12_MPEAR
Programmable range 12, end address
2C8h
PROG12_MPPA
Programmable range 12, memory page protection attributes
2D0h
PROG13_MPSAR
Programmable range 13, start address
2D4h
PROG13_MPEAR
Programmable range 13, end address
2Dh
PROG13_MPPA
Programmable range 13, memory page protection attributes
2E0h
PROG14_MPSAR
Programmable range 14, start address
2E4h
PROG14_MPEAR
Programmable range 14, end address
2E8h
PROG14_MPPA
Programmable range 14, memory page protection attributes
2F0h
PROG15_MPSAR
Programmable range 15, start address
2F4h
PROG15_MPEAR
Programmable range 15, end address
2F8h
PROG15_MPPA
Programmable range 15, memory page protection attributes
300h
FLTADDRR
Fault address
304h
FLTSTAT
Fault status
308h
FLTCLR
Fault clear
End of Table 7-52
Table 7-53
MPU1 Registers (Part 1 of 2)
Offset
Name
Description
0h
REVID
Revision ID
4h
CONFIG
Configuration
10h
IRAWSTAT
Interrupt raw status/set
14h
IENSTAT
Interrupt enable status/clear
18h
IENSET
Interrupt enable
1Ch
IENCLR
Interrupt enable clear
20h
EOI
End of interrupt
200h
PROG0_MPSAR
Programmable range 0, start address
204h
PROG0_MPEAR
Programmable range 0, end address
208h
PROG0_MPPA
Programmable range 0, memory page protection attributes
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Table 7-53
MPU1 Registers (Part 2 of 2)
Offset
Name
Description
210h
PROG1_MPSAR
Programmable range 1, start address
214h
PROG1_MPEAR
Programmable range 1, end address
218h
PROG1_MPPA
Programmable range 1, memory page protection attributes
220h
PROG2_MPSAR
Programmable range 2, start address
224h
PROG2_MPEAR
Programmable range 2, end address
228h
PROG2_MPPA
Programmable range 2, memory page protection attributes
230h
PROG3_MPSAR
Programmable range 3, start address
234h
PROG3_MPEAR
Programmable range 3, end address
238h
PROG3_MPPA
Programmable range 3, memory page protection attributes
240h
PROG4_MPSAR
Programmable range 4, start address
244h
PROG4_MPEAR
Programmable range 4, end address
248h
PROG4_MPPA
Programmable range 4, memory page protection attributes
300h
FLTADDRR
Fault address
304h
FLTSTAT
Fault status
308h
FLTCLR
Fault clear
End of Table 7-53
Table 7-54
MPU2 Registers (Part 1 of 2)
Offset
Name
Description
0h
REVID
Revision ID
4h
CONFIG
Configuration
10h
IRAWSTAT
Interrupt raw status/set
14h
IENSTAT
Interrupt enable status/clear
18h
IENSET
Interrupt enable
1Ch
IENCLR
Interrupt enable clear
20h
EOI
End of interrupt
200h
PROG0_MPSAR
Programmable range 0, start address
204h
PROG0_MPEAR
Programmable range 0, end address
208h
PROG0_MPPA
Programmable range 0, memory page protection attributes
210h
PROG1_MPSAR
Programmable range 1, start address
214h
PROG1_MPEAR
Programmable range 1, end address
218h
PROG1_MPPA
Programmable range 1, memory page protection attributes
220h
PROG2_MPSAR
Programmable range 2, start address
224h
PROG2_MPEAR
Programmable range 2, end address
228h
PROG2_MPPA
Programmable range 2, memory page protection attributes
230h
PROG3_MPSAR
Programmable range 3, start address
234h
PROG3_MPEAR
Programmable range 3, end address
238h
PROG3_MPPA
Programmable range 3, memory page protection attributes
240h
PROG4_MPSAR
Programmable range 4, start address
244h
PROG4_MPEAR
Programmable range 4, end address
248h
PROG4_MPPA
Programmable range 4, memory page protection attributes
250h
PROG5_MPSAR
Programmable range 5, start address
254h
PROG5_MPEAR
Programmable range 5, end address
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Table 7-54
MPU2 Registers (Part 2 of 2)
Offset
Name
Description
258h
PROG5_MPPA
Programmable range 5, memory page protection attributes
260h
PROG6_MPSAR
Programmable range 6, start address
264h
PROG6_MPEAR
Programmable range 6, end address
268h
PROG6_MPPA
Programmable range 6, memory page protection attributes
270h
PROG7_MPSAR
Programmable range 7, start address
274h
PROG7_MPEAR
Programmable range 7, end address
278h
PROG7_MPPA
Programmable range 7, memory page protection attributes
280h
PROG8_MPSAR
Programmable range 8, start address
284h
PROG8_MPEAR
Programmable range 8, end address
288h
PROG8_MPPA
Programmable range 8, memory page protection attributes
290h
PROG9_MPSAR
Programmable range 9, start address
294h
PROG9_MPEAR
Programmable range 9, end address
298h
PROG9_MPPA
Programmable range 9, memory page protection attributes
2A0h
PROG10_MPSAR
Programmable range 10, start address
2A4h
PROG10_MPEAR
Programmable range 10, end address
2A8h
PROG10_MPPA
Programmable range 10, memory page protection attributes
2B0h
PROG11_MPSAR
Programmable range 11, start address
2B4h
PROG11_MPEAR
Programmable range 11, end address
2B8h
PROG11_MPPA
Programmable range 11, memory page protection attributes
2C0h
PROG12_MPSAR
Programmable range 12, start address
2C4h
PROG12_MPEAR
Programmable range 12, end address
2C8h
PROG12_MPPA
Programmable range 12, memory page protection attributes
2D0h
PROG13_MPSAR
Programmable range 13, start address
2D4h
PROG13_MPEAR
Programmable range 13, end address
2Dh
PROG13_MPPA
Programmable range 13, memory page protection attributes
2E0h
PROG14_MPSAR
Programmable range 14, start address
2E4h
PROG14_MPEAR
Programmable range 14, end address
2E8h
PROG14_MPPA
Programmable range 14, memory page protection attributes
2F0h
PROG15_MPSAR
Programmable range 15, start address
2F4h
PROG15_MPEAR
Programmable range 15, end address
2F8h
PROG15_MPPA
Programmable range 15, memory page protection attributes
300h
FLTADDRR
Fault address
304h
FLTSTAT
Fault status
308h
FLTCLR
Fault clear
End of Table 7-54
Table 7-55
MPU3 Registers (Part 1 of 2)
Offset
Name
Description
0h
REVID
Revision ID
4h
CONFIG
Configuration
10h
IRAWSTAT
Interrupt raw status/set
14h
IENSTAT
Interrupt enable status/clear
18h
IENSET
Interrupt enable
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Table 7-55
MPU3 Registers (Part 2 of 2)
Offset
Name
Description
1Ch
IENCLR
Interrupt enable clear
20h
EOI
End of interrupt
200h
PROG0_MPSAR
Programmable range 0, start address
204h
PROG0_MPEAR
Programmable range 0, end address
208h
PROG0_MPPA
Programmable range 0, memory page protection attributes
300h
FLTADDRR
Fault address
304h
FLTSTAT
Fault status
308h
FLTCLR
Fault clear
End of Table 7-55
7.11.1.2 Device-Specific MPU Registers
7.11.1.2.1 Configuration Register (CONFIG)
The configuration register (CONFIG) contains the configuration value of the MPU.
Figure 7-35
Configuration Register (CONFIG)
31
24
23
20
19
16
15
12
11
1
0
ADDR_WIDTH
NUM_FIXED
NUM_PROG
NUM_AIDS
Reserved
ASSUME_ALLOWED
MPU0
R-0
R-0
R-16
R-16
R-0
R-1
MPU1
R-0
R-0
R-5
R-16
R-0
R-1
MPU2
R-0
R-0
R-16
R-16
R-0
R-1
MPU3
R-0
R-0
R-1
R-16
R-0
R-1
Reset Values
Legend: R = Read only; -n = value after reset
Table 7-56
Configuration Register (CONFIG) Field Descriptions
Bit
Field
Description
31 – 24
ADDR_WIDTH
Address alignment for range checking
0 = 1KB alignment
6 = 64KB alignment
23 – 20
NUM_FIXED
Number of fixed address ranges
19 – 16
NUM_PROG
Number of programmable address ranges
15 – 12
NUM_AIDS
Number of supported AIDs
11 – 1
Reserved
Reserved. These bits will always reads as 0.
0
ASSUME_ALLOWED
Assume allowed bit. When an address is not covered by any MPU protection range, this bit determines whether the
transfer is assumed to be allowed or not.
0 = Assume disallowed
1 = Assume allowed
End of Table 7-56
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7.11.2 MPU Programmable Range Registers
7.11.2.1 Programmable Range n Start Address Register (PROGn_MPSAR)
The programmable address start register holds the start address for the range. This register is writeable only by a
supervisor entity. If NS = 0 (non-secure mode) in the associated MPPA register, then the register is also writeable
only by a secure entity.
The start address must be aligned on a page boundary. The size of the page is 1K byte. The size of the page determines
the width of the address field in MPSAR and MPEAR.
Figure 7-36
Programmable Range n Start Address Register (PROGn_MPSAR)
31
10
9
0
START_ADDR
Reserved
R/W
R
Legend: R = Read only; R/W = Read/Write
Table 7-57
Programmable Range n Start Address Register (PROGn_MPSAR) Field Descriptions
Bit
Field
Description
31 – 10
START_ADDR
Start address for range n.
9–0
Reserved
Reserved and these bits always read as 0.
End of Table 7-57
7.11.2.2 Programmable Range n End Address Register (PROGn_MPEAR)
The programmable address end register holds the end address for the range. This register is writeable only by a
supervisor entity. If NS = 0 (non-secure mode) in the associated MPPA register, then the register is also writeable
only by a secure entity.
The end address must be aligned on a page boundary. The size of the page depends on the MPU number. The page
size for MPU1 is 1K byte and for MPU2 it is 64K bytes. The size of the page determines the width of the address field
in MPSAR and MPEAR
Figure 7-37
Programmable Range n End Address Register (PROGn_MPEAR)
31
10
9
0
END_ADDR
Reserved
R/W
R
Legend: R = Read only; R/W = Read/Write
Table 7-58
Programmable Range n End Address Register (PROGn_MPEAR) Field Descriptions
Bit
Field
Description
31 – 10
END_ADDR
End address for range n.
9–0
Reserved
Reserved and these bits always read as 3FFh.
End of Table 7-58
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7.11.2.3 Programmable Range n Memory Protection Page Attribute Register (PROGn_MPPA)
The programmable address memory protection page attribute register holds the permissions for the region. This
register is writeable only by a non-debug supervisor entity. If NS = 0 (secure mode), then the register is also writeable
only by a non-debug secure entity. The NS bit is writeable only by a non-debug secure entity. For debug accesses,
the register is writeable only when NS = 1 or EMU = 1.
Figure 7-38
Programmable Range n Memory Protection Page Attribute Register (PROGn_MPPA)
31
26
25
24
23
22
21
20
19
18
17
16
15
Reserved
AID15
AID14
AID13
AID12
AID11
AID10
AID9
AID8
AID7
AID6
AID5
R
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
AID4
AID3
AID2
AID1
AID0
AIDX
Reserved
NS
EMU
SR
SW
SX
UR
UW
UX
R/W
R/W
R/W
R/W
R/W
R/W
R
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Legend: R = Read only; R/W = Read/Write
Table 7-59
Programmable Range n Memory Protection Page Attribute Register (PROGn_MPPA) Field Descriptions
(Part 1 of 2)
Bit
Field
Description
31 – 26
Reserved
Reserved. These bits will always reads as 0.
25
AID15
Controls permission check of ID = 15
0 = AID is not checked for permissions
1 = AID is checked for permissions
24
AID14
Controls permission check of ID = 14
0 = AID is not checked for permissions
1 = AID is checked for permissions
23
AID13
Controls permission check of ID = 13
0 = AID is not checked for permissions
1 = AID is checked for permissions
22
AID12
Controls permission check of ID = 12
0 = AID is not checked for permissions
1 = AID is checked for permissions
21
AID11
Controls permission check of ID = 11
0 = AID is not checked for permissions
1 = AID is checked for permissions
20
AID10
Controls permission check of ID = 10
0 = AID is not checked for permissions
1 = AID is checked for permissions
19
AID9
Controls permission check of ID = 9
0 = AID is not checked for permissions
1 = AID is checked for permissions
18
AID8
Controls permission check of ID = 8
0 = AID is not checked for permissions
1 = AID is checked for permissions
17
AID7
Controls permission check of ID = 7
0 = AID is not checked for permissions
1 = AID is checked for permissions
16
AID6
Controls permission check of ID = 6
0 = AID is not checked for permissions
1 = AID is checked for permissions
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Table 7-59
Programmable Range n Memory Protection Page Attribute Register (PROGn_MPPA) Field Descriptions
(Part 2 of 2)
Bit
Field
Description
15
AID5
Controls permission check of ID = 5
0 = AID is not checked for permissions
1 = AID is checked for permissions
14
AID4
Controls permission check of ID = 4
0 = AID is not checked for permissions
1 = AID is checked for permissions
13
AID3
Controls permission check of ID = 3
0 = AID is not checked for permissions
1 = AID is checked for permissions
12
AID2
Controls permission check of ID = 2
0 = AID is not checked for permissions
1 = AID is checked for permissions
11
AID1
Controls permission check of ID = 1
0 = AID is not checked for permissions
1 = AID is checked for permissions
10
AID0
Controls permission check of ID = 0
0 = AID is not checked for permissions
1 = AID is checked for permissions
9
AIDX
Controls permission check of ID > 15
0 = AID is not checked for permissions
1 = AID is checked for permissions
8
Reserved
Always reads as 0.
7
NS
Non-secure access permission
0 = Only secure access allowed.
1 = Non-secure access allowed.
6
EMU
Emulation (debug) access permission. This bit is ignored if NS = 1
0 = Debug access not allowed.
1 = Debug access allowed.
5
SR
Supervisor Read permission
0 = Access not allowed.
1 = Access allowed.
4
SW
Supervisor Write permission
0 = Access not allowed.
1 = Access allowed.
3
SX
Supervisor Execute permission
0 = Access not allowed.
1 = Access allowed.
2
UR
User Read permission
0 = Access not allowed.
1 = Access allowed
1
UW
User Write permission
0 = Access not allowed.
1 = Access allowed.
0
UX
User Execute permission
0 = Access not allowed.
1 = Access allowed.
End of Table 7-591
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7.11.2.4 MPU Registers Reset Values
Table 7-60
Programmable Range n Registers Reset Values for MPU0
MPU0 (Main CFG TeraNet)
Programmable Start Address
Range
(PROGn_MPSAR)
End Address
(PROGn_MPEAR)
Memory Page Protection
Attribute (PROGn_MPPA)
Memory Protection
PROG0
0x01D0_0000
0x01D8_03FF
0x03FF_FCB6
Tracers
PROG1
0x01F0_0000
0x01F7_FFFF
0x03FF_FC80
Reserved
PROG2
0x0200_0000
0x0209_FFFF
0x03FF_FCB6
NETCP
PROG3
0x01E0_0000
0x01EB_FFFF
0x03FF_FCB6
TSIP
PROG4
0x021C_0000
0x021E_0FFF
0x03FF_FC80
Reserved
PROG5
0x021F_0000
0x021F_7FFF
0x03FF_FC80
Reserved
PROG6
0x0220_0000
0x022F_03FF
0x03FF_FCB6
Timers
PROG7
0x0231_0000
0x0231_03FF
0x03FF_FCB4
PLL
PROG8
0x0232_0000
0x0232_03FF
0x03FF_FCB4
GPIO
PROG9
0x0233_0000
0x0233_03FF
0x03FF_FCB4
SmartReflex
PROG10
0x0235_0000
0x0235_0FFF
0x03FF_FCB4
PSC
PROG11
0x0240_0000
0x024B_3FFF
0x03FF_FCB6
DEBUG_SS, Tracer Formatters
PROG12
0x0250_0000
0x0252_03FF
0x03FF_FCB4
Reserved
PROG13
0x0253_0000
0x0254_03FF
0x03FF_FCB6
I C, UART
2
PROG14
0x0260_0000
0x0260_FFFF
0x03FF_FCB4
CICs
PROG15
0x0262_0000
0x0262_07FF
0x03FF_FCB4
Chip-level Registers
End of Table 7-60
Table 7-61
Programmable Range n Registers Reset Values for MPU1
MPU1 (QM_SS DATA PORT)
Programmable Start Address
Range
(PROGn_MPSAR)
End Address
(PROGn_MPEAR)
Memory Page Protection
Attribute (PROGn_MPPA)
PROG0
0x3400_0000
0x3401_FFFF
0x03FF_FC80
PROG1
0x3402_0000
0x3405_FFFF
0x000F_FCB6
PROG2
0x3406_0000
0x3406_7FFF
0x03FF_FCB4
PROG3
0x3406_8000
0x340B_7FFF
0x03FF_FC80
PROG4
0x340B_8000
0x340B_FFFF
0x03FF_FCB6
Memory Protection
Queue Manager subsystem
data
End of Table 7-61
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Table 7-62
Programmable Range n Registers Reset Values for MPU2
MPU2 (QM_SS CFG PORT)
Programmable Start Address
Range
(PROGn_MPSAR)
End Address
(PROGn_MPEAR)
Memory Page Protection
Attribute (PROGn_MPPA)
PROG0
0x02A0_0000
0x02A1_FFFF
0x03FF_FCA4
PROG1
0x02A2_0000
0x02A3_FFFF
0x000F_FCB6
PROG2
0x02A4_0000
0x02A5_FFFF
0x000F_FCB6
PROG3
0x02A6_0000
0x02A6_7FFF
0x03FF_FCB4
PROG4
0x02A6_8000
0x02A6_8FFF
0x03FF_FCB4
PROG5
0x02A6_9000
0x02A6_9FFF
0x03FF_FCB4
PROG6
0x02A6_A000
0x02A6_AFFF
0x03FF_FCB4
PROG7
0x02A6_B000
0x02A6_BFFF
0x03FF_FCB4
PROG8
0x02A6_C000
0x02A6_DFFF
0x03FF_FCB4
PROG9
0x02A6_E000
0x02A6_FFFF
0x03FF_FCB4
PROG10
0x02A8_0000
0x02A8_FFFF
0x03FF_FCA4
PROG11
0x02A9_0000
0x02A9_FFFF
0x03FF_FCB4
PROG12
0x02AA_0000
0x02AA_7FFF
0x03FF_FCB4
PROG13
0x02AA_8000
0x02AA_FFFF
0x03FF_FCB4
PROG14
0x02AB_0000
0x02AB_7FFF
0x03FF_FCB4
PROG15
0x02AB_8000
0x02AB_FFFF
0x03FF_FCB6
Memory Protection
Queue Manager subsystem
configuration
End of Table 7-62
Table 7-63
Programmable Range n Registers Reset Values for MPU3
MPU3 (Semaphore)
Programmable Start Address
Range
(PROGn_MPSAR)
End Address
(PROGn_MPEAR)
Memory Page Protection
Attributes (PROGn_MPPA)
Memory Protection
PROG0
0x0264_07FF
0x0003_FCB6
Semaphore
0x0264_0000
End of Table 7-63
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7.12 DDR3 Memory Controller
The 64-bit DDR3 Memory Controller bus of the TMS320C6671 is used to interface to JEDEC standard-compliant
DDR3 SDRAM devices. The DDR3 external bus interfaces only to DDR3 SDRAM devices; it does not share the bus
with any other types of peripherals.
7.12.1 DDR3 Memory Controller Device-Specific Information
The TMS320C6671 includes one 64-bit wide 1.5-V DDR3 SDRAM EMIF interface. The DDR3 interface can operate
at 800 Mega Transfers per Second (MTS), 1066 MTS, 1333 MTS, and 1600 MTS.
Due to the complicated nature of the interface, a limited number of topologies are supported to provide a 16-bit,
32-bit, or 64-bit interface.
The DDR3 electrical requirements are fully specified in the DDR Jedec Specification JESD79-3C. Standard DDR3
SDRAMs are available in 8- and 16-bit versions, allowing for the following bank topologies to be supported by the
interface:
• 72-bit: Five 16-bit SDRAMs (including 8 bits of ECC)
• 72-bit: Nine 8-bit SDRAMs (including 8 bits of ECC)
• 36-bit: Three 16-bit SDRAMs (including 4 bits of ECC)
• 36-bit: Five 8-bit SDRAMs (including 4 bits of ECC)
• 64-bit: Four 16-bit SDRAMs
• 64-bit: Eight 8-bit SDRAMs
• 32-bit: Two 16-bit SDRAMs
• 32-bit: Four 8-bit SDRAMs
• 16-bit: One 16-bit SDRAM
• 16-bit: Two 8-bit SDRAM
The approach to specifying interface timing for the DDR3 memory bus is different than on other interfaces such as
2
I C or SPI. For these other interfaces, the device timing was specified in terms of data manual specifications and I/O
buffer information specification (IBIS) models. For the DDR3 memory bus, the approach is to specify compatible
DDR3 devices and provide the printed circuit board (PCB) solution and guidelines directly to the user.
7.12.2 DDR3 Memory Controller Race Condition Consideration
A race condition may exist when certain masters write data to the DDR3 memory controller. For example, if
master A passes a software message via a buffer in external memory and does not wait for an indication that the write
completes, before signaling to master B that the message is ready, when master B attempts to read the software
message, then the master B read may bypass the master A write and, thus, master B may read stale data and,
therefore, receive an incorrect message.
Some master peripherals (e.g., EDMA3 transfer controllers with TCCMOD=0) will always wait for the write to
complete before signaling an interrupt to the system, thus avoiding this race condition. For masters that do not have
a hardware specification of write-read ordering, it may be necessary to specify data ordering via software.
If master A does not wait for indication that a write is complete, it must perform the following workaround:
1. Perform the required write to DDR3 memory space.
2. Perform a dummy write to the DDR3 memory controller module ID and revision register.
3. Perform a dummy read to the DDR3 memory controller module ID and revision register.
4. Indicate to master B that the data is ready to be read after completion of the read in step 3. The completion of
the read in step 3 ensures that the previous write was done.
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7.12.3 DDR3 Memory Controller Electrical Data/Timing
The DDR3 Design Requirements for KeyStone Devices in ‘‘Related Documentation from Texas Instruments’’ on
page 72 specifies a complete DDR3 interface solution as well as a list of compatible DDR3 devices. The DDR3
electrical requirements are fully specified in the DDR3 Jedec Specification JESD79-3C. TI has performed the
simulation and system characterization to ensure all DDR3 interface timings in this solution are met; therefore, no
electrical data/timing information is supplied here for this interface.
Note—TI supports only designs that follow the board design guidelines outlined in the application report.
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7.13 I2C Peripheral
The inter-integrated circuit (I2C) module provides an interface between DSP and other devices compliant with
2
2
Philips Semiconductors Inter-IC bus (I C bus) specification version 2.1 and connected by way of an I C bus.
External components attached to this 2-wire serial bus can transmit/receive up to 8-bit data to/from the DSP
through the I2C module.
7.13.1 I2C Device-Specific Information
The TMS320C6671 device includes an I2C peripheral module.
2
Note—When using the I
C module, ensure there are external pullup resistors on the SDA and SCL pins.
2
The I C modules on the C6671 may be used by the DSP to control local peripheral ICs (DACs, ADCs, etc.) or may
be used to communicate with other controllers in a system or to implement a user interface.
2
2
The I C port is compatible with Philips I C specification revision 2.1 (January 2000) and supports:
• Fast mode up to 400 Kbps (no fail-safe I/O buffers)
• Noise filter to remove noise 50 ns or less
• 7-bit and 10-bit device addressing modes
• Multi-master (transmit/receive) and slave (transmit/receive) functionality
• Events: DMA, interrupt, or polling
• Slew-rate limited open-drain output buffers
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2
Figure 7-39 shows a block diagram of the I C module.
Figure 7-39
I2C Module Block Diagram
2
I C Module
Clock
Prescale
Peripheral Clock
(CPU/6)
2
I CPSC
Control
Bit Clock
Generator
SCL
Noise
Filter
2
I C Clock
I COAR
Own
Address
I2CSAR
Slave
Address
2
I2CCLKH
I2CCLKL
2
I CMDR
2
I CCNT
Transmit
I2CXSR
2
I CDXR
Transmit
Shift
I2CEMDR
Data
Count
Extended
Mode
Transmit
Buffer
SDA
Interrupt/DMA
Noise
Filter
I2C Data
Mode
I2CDRR
2
I CRSR
2
Interrupt
Mask/Status
2
Interrupt
Status
I CIMR
Receive
Receive
Buffer
I CSTR
Receive
Shift
I CIVR
2
Interrupt
Vector
Shading denotes control/status registers.
2
7.13.2 I C Peripheral Register Description(s)
Table 7-64
I2C Registers (Part 1 of 2)
Hex Address Range
Register
Register Name
0253 0000
ICOAR
I C Own Address Register
0253 0004
ICIMR
I C Interrupt Mask/Status Register
0253 0008
ICSTR
I2C Interrupt Status Register
0253 000C
ICCLKL
I C Clock Low-Time Divider Register
0253 0010
ICCLKH
I C Clock High-Time Divider Register
0253 0014
ICCNT
I2C Data Count Register
0253 0018
ICDRR
I C Data Receive Register
0253 001C
ICSAR
I2C Slave Address Register
0253 0020
ICDXR
I C Data Transmit Register
0253 0024
ICMDR
I C Mode Register
0253 0028
ICIVR
I2C Interrupt Vector Register
0253 002C
ICEMDR
I C Extended Mode Register
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2
2
2
2
2
2
2
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Table 7-64
I2C Registers (Part 2 of 2)
Hex Address Range
Register
Register Name
0253 0030
ICPSC
I C Prescaler Register
0253 0034
ICPID1
I2C Peripheral Identification Register 1 [Value: 0x0000 0105]
0253 0038
ICPID2
I C Peripheral Identification Register 2 [Value: 0x0000 0005]
0253 003C - 0253 007F
-
Reserved
2
2
End of Table 7-64
2
7.13.3 I C Electrical Data/Timing
2
7.13.3.1 Inter-Integrated Circuits (I C) Timing
Table 7-65
I2C Timing Requirements (1)
(see Figure 7-40)
Standard Mode
No.
Min
Max
Fast Mode
Min
Max Units
tc(SCL)
Cycle time, SCL
10
2.5
μs
tsu(SCLH-SDAL)
Setup time, SCL high before SDA low (for a repeated START
condition)
4.7
0.6
μs
th(SDAL-SCLL)
Hold time, SCL low after SDA low (for a START and a repeated
START condition)
4
0.6
μs
4
tw(SCLL)
Pulse duration, SCL low
4.7
1.3
μs
5
tw(SCLH)
Pulse duration, SCL high
0.6
μs
6
tsu(SDAV-SCLH)
Setup time, SDA valid before SCL high
1
2
3
4
250
2
(3)
7
th(SCLL-SDAV)
Hold time, SDA valid after SCL low (For I C bus devices)
0
8
tw(SDAH)
Pulse duration, SDA high between STOP and START conditions
4.7
3.45
100
(2)
0
(3)
ns
0.9
(4)
1.3
μs
μs
9
tr(SDA)
Rise time, SDA
1000
20 + 0.1Cb
(5)
300
ns
10
tr(SCL)
Rise time, SCL
1000
20 + 0.1Cb
(5)
300
ns
300
ns
300
ns
11
tf(SDA)
Fall time, SDA
300
20 + 0.1Cb
(5)
12
tf(SCL)
Fall time, SCL
300
20 + 0.1Cb
(5)
13
tsu(SCLH-SDAH)
Setup time, SCL high before SDA high (for STOP condition)
14
tw(SP)
Pulse duration, spike (must be suppressed)
15
(5)
Cb
Capacitive load for each bus line
4
0.6
0
400
μs
50
ns
400
pF
End of Table 7-65
2
1 The I C pins SDA and SCL do not feature fail-safe I/O buffers. These pins could potentially draw current when the device is powered down
2
2
2 A Fast-mode I C-bus™ device can be used in a Standard-mode I C-bus™ system, but the requirement tsu(SDA-SCLH)  250 ns must then be met. This will automatically be the
case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal, it must output the next data bit to the
SDA line tr max + tsu(SDA-SCLH) = 1000 + 250 = 1250 ns (according to the Standard-mode I2C-Bus Specification) before the SCL line is released.
3 A device must internally provide a hold time of at least 300 ns for the SDA signal (referred to the VIHmin of the SCL signal) to bridge the undefined region of the falling edge
of SCL.
4 The maximum th(SDA-SCLL) has to be met only if the device does not stretch the low period [tw(SCLL)] of the SCL signal.
5 Cb = total capacitance of one bus line in pF. If mixed with HS-mode devices, faster fall-times are allowed.
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I2C Receive Timings
Figure 7-40
11
9
SDA
8
6
4
14
13
5
10
SCL
1
3
12
7
2
3
Stop
Table 7-66
Start
Repeated
Start
Stop
I2C Switching Characteristics (1)
(see Figure 7-41)
Standard Mode
No.
16
17
18
Parameter
Min
Fast Mode
Max
Min
Max Unit
tc(SCL)
Cycle time, SCL
10
2.5
ms
tsu(SCLH-SDAL)
Setup time, SCL high to SDA low (for a repeated START
condition)
4.7
0.6
ms
th(SDAL-SCLL)
Hold time, SDA low after SCL low (for a START and a repeated
START condition)
4
0.6
ms
4.7
1.3
ms
4
0.6
ms
250
100
0
0
19
tw(SCLL)
Pulse duration, SCL low
20
tw(SCLH)
Pulse duration, SCL high
21
td(SDAV-SDLH)
Delay time, SDA valid to SCL high
22
tv(SDLL-SDAV)
Valid time, SDA valid after SCL low (For I C bus devices)
23
tw(SDAH)
Pulse duration, SDA high between STOP and START conditions
24
tr(SDA)
Rise time, SDA
2
4.7
ns
0.9
1.3
1000
ms
ms
20 + 0.1Cb
(1)
300
ns
20 + 0.1Cb
(1)
25
tr(SCL)
Rise time, SCL
1000
300
ns
26
tf(SDA)
Fall time, SDA
300
20 + 0.1Cb (1)
300
ns
300
(1)
300
27
tf(SCL)
Fall time, SCL
28
td(SCLH-SDAH)
Delay time, SCL high to SDA high (for STOP condition)
29
Cp
Capacitance for each I2C pin
4
20 + 0.1Cb
0.6
10
ns
ms
10
pF
End of Table 7-66
1 Cb = total capacitance of one bus line in pF. If mixed with HS-mode devices, faster fall-times are allowed.
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Figure 7-41
I2C Transmit Timings
26
24
SDA
23
21
19
28
20
25
SCL
16
18
27
22
17
18
Stop
Start
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Repeated
Start
Stop
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7.14 SPI Peripheral
The serial peripheral interconnect (SPI) module provides an interface between the DSP and other SPI-compliant
devices. The primary intent of this interface is to allow for connection to a SPI ROM for boot. The SPI module on
C6671 is supported only in master mode. Additional chip-level components can also be included, such as
temperature sensors or an I/O expander.
The C6671 SPI supports two modes, 3-pin and 4-pin. For the 4-pin chip-select mode, the C6671 supports up to two
chip selects.
7.14.1 SPI Electrical Data/Timing
7.14.1.1 SPI Timing
Table 7-67
SPI Timing Requirements
See Figure 7-42)
No.
Min
Max
Unit
Master Mode Timing Diagrams — Base Timings for 3 Pin Mode
7
tsu(SDI-SPC)
Input Setup Time, SPIDIN valid before receive edge of SPICLK. Polarity = 0 Phase = 0
2
ns
7
tsu(SDI-SPC)
Input Setup Time, SPIDIN valid before receive edge of SPICLK. Polarity = 0 Phase = 1
2
ns
7
tsu(SDI-SPC)
Input Setup Time, SPIDIN valid before receive edge of SPICLK. Polarity = 1 Phase = 0
2
ns
7
tsu(SDI-SPC)
Input Setup Time, SPIDIN valid before receive edge of SPICLK. Polarity = 1 Phase = 1
2
ns
8
th(SPC-SDI)
Input Hold Time, SPIDIN valid after receive edge of SPICLK. Polarity = 0 Phase = 0
5
ns
8
th(SPC-SDI)
Input Hold Time, SPIDIN valid after receive edge of SPICLK. Polarity = 0 Phase = 1
5
ns
8
th(SPC-SDI)
Input Hold Time, SPIDIN valid after receive edge of SPICLK. Polarity = 1 Phase = 0
5
ns
8
th(SPC-SDI)
Input Hold Time, SPIDIN valid after receive edge of SPICLK. Polarity = 1 Phase = 1
5
ns
End of Table 7-67
Table 7-68
SPI Switching Characteristics (Part 1 of 2)
(See Figure 7-42 and Figure 7-43)
No.
Parameter
Min
Max
Unit
Master Mode Timing Diagrams — Base Timings for 3 Pin Mode
1
tc(SPC)
3*P2 (1)
Cycle Time, SPICLK, All Master Modes
ns
2
tw(SPCH)
Pulse Width High, SPICLK, All Master Modes
0.5*tc - 1
ns
3
tw(SPCL)
Pulse Width Low, SPICLK, All Master Modes
0.5*tc - 1
ns
4
td(SDO-SPC)
Setup (Delay), initial data bit valid on SPIDOUT to initial edge on SPICLK.
Polarity = 0, Phase = 0.
5
ns
4
td(SDO-SPC)
Setup (Delay), initial data bit valid on SPIDOUT to initial edge on SPICLK.
Polarity = 0, Phase = 1.
5
ns
4
td(SDO-SPC)
Setup (Delay), initial data bit valid on SPIDOUT to initial edge on SPICLK
Polarity = 1, Phase = 0
5
ns
4
td(SDO-SPC)
Setup (Delay), initial data bit valid on SPIDOUT to initial edge on SPICLK
Polarity = 1, Phase = 1
5
ns
5
td(SPC-SDO)
Setup (Delay), subsequent data bits valid on SPIDOUT to initial edge on
SPICLK. Polarity = 0 Phase = 0
2
ns
5
td(SPC-SDO)
Setup (Delay), subsequent data bits valid on SPIDOUT to initial edge on SPICLK
Polarity = 0 Phase = 1
2
ns
5
td(SPC-SDO)
Setup (Delay), subsequent data bits valid on SPIDOUT to initial edge on SPICLK
Polarity = 1 Phase = 0
2
ns
5
td(SPC-SDO)
Setup (Delay), subsequent data bits valid on SPIDOUT to initial edge on SPICLK
Polarity = 1 Phase = 1
2
ns
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Table 7-68
SPI Switching Characteristics (Part 2 of 2)
(See Figure 7-42 and Figure 7-43)
No.
Parameter
Min
Max
Unit
6
toh(SPC-SDO)
Output hold time, SPIDOUT valid after receive edge of SPICLK except for final
bit. Polarity = 0 Phase = 0
0.5*tc - 2
ns
6
toh(SPC-SDO)
Output hold time, SPIDOUT valid after receive edge of SPICLK except for final
bit. Polarity = 0 Phase = 1
0.5*tc - 2
ns
6
toh(SPC-SDO)
Output hold time, SPIDOUT valid after receive edge of SPICLK except for final
bit. Polarity = 1 Phase = 0
0.5*tc - 2
ns
6
toh(SPC-SDO)
Output hold time, SPIDOUT valid after receive edge of SPICLK except for final
bit. Polarity = 1 Phase = 1
0.5*tc - 2
ns
19
td(SCS-SPC)
Delay from SPISCS[n] active to first SPICLK. Polarity = 0 Phase = 0
2*P2 - 5
19
td(SCS-SPC)
Delay from SPISCS[n] active to first SPICLK. Polarity = 0 Phase = 1
0.5*tc + (2*P2) - 5 0.5*tc + (2*P2) + 5 ns
19
td(SCS-SPC)
Delay from SPISCS[n] active to first SPICLK. Polarity = 1 Phase = 0
2*P2 - 5
Additional SPI Master Timings — 4 Pin Mode with Chip Select Option
2*P2 + 5
2*P2 + 5
ns
ns
19
td(SCS-SPC)
Delay from SPISCS[n] active to first SPICLK. Polarity = 1 Phase = 1
0.5*tc + (2*P2) - 5 0.5*tc + (2*P2) + 5 ns
20
td(SPC-SCS)
Delay from final SPICLK edge to master deasserting SPISCS[n]. Polarity = 0
Phase = 0
1*P2 - 5
20
td(SPC-SCS)
Delay from final SPICLK edge to master deasserting SPISCS[n]. Polarity = 0
Phase = 1
0.5*tc + (1*P2) - 5 0.5*tc + (1*P2) + 5 ns
20
td(SPC-SCS)
Delay from final SPICLK edge to master deasserting SPISCS[n]. Polarity = 1
Phase = 0
1*P2 - 5
20
td(SPC-SCS)
Delay from final SPICLK edge to master deasserting SPISCS[n]. Polarity = 1
Phase = 1
0.5*tc + (1*P2) - 5 0.5*tc + (1*P2) + 5 ns
tw(SCSH)
Minimum inactive time on SPISCS[n] pin between two transfers when
SPISCS[n] is not held using the CSHOLD feature.
2*P2 - 5
1*P2 + 5
1*P2 + 5
ns
ns
ns
End of Table 7-68
1 P2 = 1/SYSCLK7
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Figure 7-42
SPI Master Mode Timing Diagrams — Base Timings for 3 Pin Mode
1
2
MASTER MODE
POLARITY = 0 PHASE = 0
3
SPICLK
5
4
MO(0)
SPIDOUT
7
MO(n−1)
MO(n)
MI(n−1)
MI(n)
8
MI(0)
SPIDIN
6
MO(1)
MI(1)
MASTER MODE
POLARITY = 0 PHASE = 1
4
SPICLK
6
5
MO(0)
SPIDOUT
7
MI(0)
SPIDIN
MO(1)
MO(n−1)
MO(n)
MI(1)
MI(n−1)
MI(n)
8
4
MASTER MODE
POLARITY = 1 PHASE = 0
SPICLK
5
6
MO(0)
SPIDOUT
7
SPIDIN
MO(1)
MO(n−1)
MO(n)
8
MI(0)
MI(1)
MI(n−1)
MI(n)
MASTER MODE
POLARITY = 1 PHASE = 1
SPICLK
5
4
SPIDOUT
MO(0)
7
SPIDIN
Figure 7-43
6
MO(1)
MO(n−1)
MO(n)
MI(1)
MI(n−1)
MI(n)
8
MI(0)
SPI Additional Timings for 4 Pin Master Mode with Chip Select Option
MASTER MODE 4 PIN WITH CHIP SELECT
19
20
SPICLK
SPIDOUT
SPIDIN
MO(0)
MI(0)
MO(1)
MO(n−1)
MO(n)
MI(1)
MI(n−1)
MI(n)
SPISCSx
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7.15 HyperLink Peripheral
The TMS320C6671 includes the HyperLink bus for companion chip/die interfaces. This is a four-lane SerDes
interface designed to operate at up to 12.5 Gbaud per lane. The supported data rates include 1.25 Gbaud,
3.125 Gbaud, 6.25 Gbaud, 10 Gbaud and 12.5 Gbaud. The interface is used to connect with external accelerators.
The HyperLink links must be connected with DC coupling.
The interface includes the Serial Station Management Interfaces used to send power management and flow messages
between devices. This consists of four LVCMOS inputs and four LVCMOS outputs configured as two 2-wire output
buses and two 2-wire input buses. Each 2-wire bus includes a data signal and a clock signal.
7.15.1 HyperLink Device-Specific Interrupt Event
The HyperLink has 64 input events. Events 0 to 31come from the chip level interrupt controller and events 32 to 63
are from queue-pending signals from the Queue Manager to monitor some of the transmission queue status.
Table 7-69
HyperLink Events for C6671 (Part 1 of 2)
Event Number
Event
Event Description
0
CIC3_OUT8
Interrupt Controller output
1
CIC3_OUT9
Interrupt Controller output
2
CIC3_OUT10
Interrupt Controller output
3
CIC3_OUT11
Interrupt Controller output
4
CIC3_OUT12
Interrupt Controller output
5
CIC3_OUT13
Interrupt Controller output
6
CIC3_OUT14
Interrupt Controller output
7
CIC3_OUT15
Interrupt Controller output
8
CIC3_OUT16
Interrupt Controller output
9
CIC3_OUT17
Interrupt Controller output
10
CIC3_OUT18
Interrupt Controller output
11
CIC3_OUT19
Interrupt Controller output
12
CIC3_OUT20
Interrupt Controller output
13
CIC3_OUT21
Interrupt Controller output
14
CIC3_OUT22
Interrupt Controller output
15
CIC3_OUT23
Interrupt Controller output
16
CIC3_OUT24
Interrupt Controller output
17
CIC3_OUT25
Interrupt Controller output
18
CIC3_OUT26
Interrupt Controller output
19
CIC3_OUT27
Interrupt Controller output
20
CIC3_OUT28
Interrupt Controller output
21
CIC3_OUT29
Interrupt Controller output
22
CIC3_OUT30
Interrupt Controller output
23
CIC3_OUT31
Interrupt Controller output
24
CIC3_OUT32
Interrupt Controller output
25
CIC3_OUT33
Interrupt Controller output
26
CIC3_OUT34
Interrupt Controller output
27
CIC3_OUT35
Interrupt Controller output
28
CIC3_OUT36
Interrupt Controller output
29
CIC3_OUT37
Interrupt Controller output
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Table 7-69
HyperLink Events for C6671 (Part 2 of 2)
Event Number
Event
Event Description
30
CIC3_OUT38
Interrupt Controller output
31
CIC3_OUT39
Interrupt Controller output
32
QM_INT_PEND_864
Queue manager pend event
33
QM_INT_PEND_865
Queue manager pend event
34
QM_INT_PEND_866
Queue manager pend event
35
QM_INT_PEND_867
Queue manager pend event
36
QM_INT_PEND_868
Queue manager pend event
37
QM_INT_PEND_869
Queue manager pend event
38
QM_INT_PEND_870
Queue manager pend event
39
QM_INT_PEND_871
Queue manager pend event
40
QM_INT_PEND_872
Queue manager pend event
41
QM_INT_PEND_873
Queue manager pend event
42
QM_INT_PEND_874
Queue manager pend event
43
QM_INT_PEND_875
Queue manager pend event
44
QM_INT_PEND_876
Queue manager pend event
45
QM_INT_PEND_877
Queue manager pend event
46
QM_INT_PEND_878
Queue manager pend event
47
QM_INT_PEND_879
Queue manager pend event
48
QM_INT_PEND_880
Queue manager pend event
49
QM_INT_PEND_881
Queue manager pend event
50
QM_INT_PEND_882
Queue manager pend event
51
QM_INT_PEND_883
Queue manager pend event
52
QM_INT_PEND_884
Queue manager pend event
53
QM_INT_PEND_885
Queue manager pend event
54
QM_INT_PEND_886
Queue manager pend event
55
QM_INT_PEND_887
Queue manager pend event
56
QM_INT_PEND_888
Queue manager pend event
57
QM_INT_PEND_889
Queue manager pend event
58
QM_INT_PEND_890
Queue manager pend event
59
QM_INT_PEND_891
Queue manager pend event
60
QM_INT_PEND_892
Queue manager pend event
61
QM_INT_PEND_893
Queue manager pend event
62
QM_INT_PEND_894
Queue manager pend event
63
QM_INT_PEND_895
Queue manager pend event
End of Table 7-69
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7.15.2 HyperLink Electrical Data/Timing
The tables and figure below describe the timing requirements and switching characteristics of HyperLink peripheral.
Table 7-70
HyperLink Peripheral Timing Requirements
See Figure 7-44,Figure 7-45,Figure 7-46
No.
Min
Max
Unit
FL Interface
1
tc(MCMTXFLCLK)
Clock period - MCMTXFLCLK (C1)
2
tw(MCMTXFLCLKH)
High pulse width - MCMTXFLCLK
0.4*C1 0.6*C1
6.4
ns
3
tw(MCMTXFLCLKL)
Low pulse width - MCMTXFLCLK
0.4*C1 0.6*C1
6
tsu(MCMTXFLDAT-MCMTXFLCLKH)
Setup time - MCMTXFLDAT valid before MCMTXFLCLK high
7
th(MCMTXFLCLKH-MCMTXFLDAT)
Hold time - MCMTXFLDAT valid after MCMTXFLCLK high
1
ns
6
tsu(MCMTXFLDAT-MCMTXFLCLKL)
Setup time - MCMTXFLDAT valid before MCMTXFLCLK low
1
ns
7
th(MCMTXFLCLKL-MCMTXFLDAT)
Hold time - MCMTXFLDAT valid after MCMTXFLCLK low
1
ns
6.4
ns
1
ns
ns
ns
PM Interface
1
tc(MCMRXPMCLK)
Clock period - MCMRXPMCLK (C3)
2
tw(MCMRXPMCLK)
High pulse width - MCMRXPMCLK
0.4*C3 0.6*C3
3
tw(MCMRXPMCLK)
Low pulse width - MCMRXPMCLK
0.4*C3 0.6*C3
6
tsu(MCMRXPMDAT-MCMRXPMCLKH) Setup time - MCMRXPMDAT valid before MCMRXPMCLK high
7
th(MCMRXPMCLKH-MCMRXPMDAT)
Hold time - MCMRXPMDAT valid after MCMRXPMCLK high
1
ns
6
tsu(MCMRXPMDAT-MCMRXPMCLKL)
Setup time - MCMRXPMDAT valid before MCMRXPMCLK low
1
ns
7
th(MCMRXPMCLKL-MCMRXPMDAT)
Hold time - MCMRXPMDAT valid after MCMRXPMCLK low
1
ns
1
ns
ns
ns
End of Table 7-70
Table 7-71
HyperLink Peripheral Switching Characteristics
See Figure 7-44,Figure 7-45,Figure 7-46
No.
Parameter
Min
Max
Unit
FL Interface
1
tc(MCMRXFLCLK)
Clock period - MCMRXFLCLK (C2)
6.4
ns
2
tw(MCMRXFLCLKH)
High pulse width - MCMRXFLCLK
0.4*C2 0.6*C2
ns
3
tw(MCMRXFLCLKL)
Low pulse width - MCMRXFLCLK
0.4*C2 0.6*C2
ns
4
tosu(MCMRXFLDAT-MCMRXFLCLKH)
Setup time - MCMRXFLDAT valid before MCMRXFLCLK high
0.25*C2-0.4
ns
5
toh(MCMRXFLCLKH-MCMRXFLDAT)
Hold time - MCMRXFLDAT valid after MCMRXFLCLK high
0.25*C2-0.4
ns
4
tosu(MCMRXFLDAT-MCMRXFLCLKL)
Setup time - MCMRXFLDAT valid before MCMRXFLCLK low
0.25*C2-0.4
ns
5
toh(MCMRXFLCLKL-MCMRXFLDAT)
Hold time - MCMRXFLDAT valid after MCMRXFLCLK low
0.25*C2-0.4
ns
1
tc(MCMTXPMCLK)
Clock period - MCMTXPMCLK (C4)
6.4
ns
2
tw(MCMTXPMCLK)
High pulse width - MCMTXPMCLK
0.4*C4 0.6*C4
ns
3
tw(MCMTXPMCLK)
Low pulse width - MCMTXPMCLK
0.4*C4 0.6*C4
ns
4
tosu(MCMTXPMDAT-MCMTXPMCLKH) Setup time - MCMTXPMDAT valid before MCMTXPMCLK high
0.25*C4-0.4
ns
5
toh(MCMTXPMCLKH-MCMTXPMDAT)
Hold time - MCMTXPMDAT valid after MCMTXPMCLK high
0.25*C4-0.4
ns
4
tosu(MCMTXPMDAT-MCMTXPMCLKL)
Setup time - MCMTXPMDAT valid before MCMTXPMCLK low
0.25*C4-0.4
ns
5
toh(MCMTXPMCLKL-MCMTXPMDAT)
Hold time - MCMTXPMDAT valid after MCMTXPMCLK low
0.25*C4-0.4
ns
PM Interface
End of Table 7-71
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Figure 7-44
HyperLink Station Management Clock Timing
1
2
Figure 7-45
3
HyperLink Station Management Transmit Timing
4
5
4
5
7
6
7
MCMTX<xx>CLK
MCMTX<xx>DAT
<xx> represents the interface that is being used: PM or FL
Figure 7-46
HyperLink Station Management Receive Timing
6
MCMRX<xx>CLK
MCMRX<xx>DAT
<xx> represents the interface that is being used: PM or FL
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7.16 UART Peripheral
The universal asynchronous receiver/transmitter (UART) module provides an interface between the DSP and
UART terminal interface or other UART-based peripheral. The UART is based on the industry standard TL16C550
asynchronous communications element, which, in turn, is a functional upgrade of the TL16C450. Functionally
similar to the TL16C450 on power up (single character or TL16C450 mode), the UART can be placed in an alternate
FIFO (TL16C550) mode. This relieves the DSP of excessive software overhead by buffering received and transmitted
characters. The receiver and transmitter FIFOs store up to 16 bytes including three additional bits of error status per
byte for the receiver FIFO.
The UART performs serial-to-parallel conversions on data received from a peripheral device and parallel-to-serial
conversion on data received from the DSP. The DSP can read the UART status at any time. The UART includes
control capability and a processor interrupt system that can be tailored to minimize software management of the
communications link. For more information on UART, see the Universal Asynchronous Receiver/Transmitter
(UART) for KeyStone Devices User Guide in ‘‘Related Documentation from Texas Instruments’’ on page 72.
Table 7-72
UART Timing Requirements
(see Figure 7-47 and Figure 7-48)
No.
Min
Max
Unit
Receive Timing
(1)
1.05U
ns
0.96U
1.05U
ns
4
tw(RXSTART)
Pulse width, receive start bit
0.96U
5
tw(RXH)
Pulse width, receive data/parity bit high
5
tw(RXL)
Pulse width, receive data/parity bit low
0.96U
1.05U
ns
6
tw(RXSTOP1)
Pulse width, receive stop bit 1
0.96U
1.05U
ns
1.5*(0.96U) 1.5*(1.05U)
ns
6
tw(RXSTOP15)
Pulse width, receive stop bit 1.5
6
tw(RXSTOP2)
Pulse width, receive stop bit 2
8
td(CTSL-TX)
Delay time, CTS asserted to START bit transmit
2*(0.96U)
2*(1.05U)
ns
(2)
5P
ns
Autoflow Timing Requirements
P
End of Table 7-72
1 U = UART baud time = 1/programmed baud rate
2 P = 1/SYSCLK7
Figure 7-47
UART Receive Timing Waveform
5
4
RXD
Figure 7-48
Stop/Idle
Start
5
Bit 0
Bit 1
Bit N-1
Bit N
6
Parity
Stop
Idle
Start
UART CTS (Clear-to-Send Input) — Autoflow Timing Waveform
8
TXD
Bit N-1
Bit N
Stop
Start
Bit 0
CTS
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Table 7-73
UART Switching Characteristics
(See Figure 7-49 and Figure 7-50)
No.
Parameter
Min
Max
Unit
Transmit Timing
U (1) - 2
U+2
ns
Pulse width, transmit data/parity bit high
U-2
U+2
ns
tw(TXL)
Pulse width, transmit data/parity bit low
U-2
U+2
ns
tw(TXSTOP1)
Pulse width, transmit stop bit 1
U-2
U+2
ns
3
tw(TXSTOP15)
Pulse width, transmit stop bit 1.5
1.5 * (U - 2) 1.5 * ('U + 2)
ns
3
tw(TXSTOP2)
Pulse width, transmit stop bit 2
7
td(RX-RTSH)
Delay time, STOP bit received to RTS deasserted
1
tw(TXSTART)
Pulse width, transmit start bit
2
tw(TXH)
2
3
2 * (U - 2)
2 * ('U + 2)
ns
(2)
5P
ns
Autoflow Timing Requirements
P
End of Table 7-73
1 U = UART baud time = 1/programmed baud rate
2 P = 1/SYSCLK7
Figure 7-49
UART Transmit Timing Waveform
1
TXD
Start
Stop/Idle
Figure 7-50
2
Bit 0
2
Bit 1
Bit N-1
Bit N
3
Parity
Stop
Idle
Start
UART RTS (Request-to-Send Output) — Autoflow Timing Waveform
7
RXD
Bit N-1
Bit N
Stop
Start
CTS
7.17 PCIe Peripheral
The two-lane PCI express (PCIe) module on the device provides an interface between the DSP and other
PCIe-compliant devices. The PCI Express module provides low-pin-count, high-reliability, and high-speed data
transfer at rates of 5.0 GBaud per lane on the serial links. For more information, see the Peripheral Component
Interconnect Express (PCIe) for KeyStone Devices User Guide in ‘‘Related Documentation from Texas Instruments’’
on page 72. The PCIe electrical requirements are fully specified in the PCI Express Base Specification Revision 2.0
of PCI-SIG. TI has performed the simulation and system characterization to ensure all PCIe interface timings in this
solution are met; therefore, no electrical data/timing information is supplied here for this interface.
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7.18 TSIP Peripheral
The telecom serial interface port (TSIP) module provides a glueless interface to common telecom serial data streams.
For more information, see the Telecom Serial Interface Port (TSIP) for the C66x DSP User Guide in ‘‘Related
Documentation from Texas Instruments’’ on page 72.
7.18.1 TSIP Electrical Data/Timing
Timing Requirements for TSIP 2x Mode (1)
Table 7-74
(see Figure 7-51)
No.
Min
61
Max
Unit
(2)
ns
ns
1
tc(CLK)
Cycle time, CLK rising edge to next CLK rising edge
2
tw(CLKL)
Pulse duration, CLK low
0.4×tc(CLK)
3
tw(CLKH)
Pulse duration, CLK high
0.4×tc(CLK)
4
tt(CLK)
Transition time, CLK high to low or CLK low to high
ns
2
ns
5
tsu(FS-CLK)
Setup time, FS valid before rising CLK
5
ns
6
th(CLK-FS)
Hold time, FS valid after rising CLK
5
ns
7
tsu(TR-CLK)
Setup time, TR valid before rising CLK
5
ns
8
th(CLK-TR)
Hold time, TR valid after rising CLK
5
ns
9
td(CLKL-TX)
Delay time, CLK low to TX valid
1
12
ns
10
tdis(CLKH-TXZ)
Disable time, CLK low to TX Hi-Z
2
10
ns
End of Table 7-74
1 Polarities of XMTFSYNCP = 0b, XMTFCLKP = 0, XMTDCLKP = 1b, RCVFSYNCP = 0, RCVFCLKP = 0, RCVDCLKP = 0. If the polarity of any of the signals is inverted, then the timing
references of that signal are also inverted.
2 Timing shown is for 8.192 Mbps links. Timing for 16.384 Mbps and 32.768 Mbps links is 30.5 ns and 15.2 ns, respectively.
Figure 7-51
TSIP 2x Timing Diagram(1)
1
2
3
CLKA/B
6
5
FSA/B
8
7
TR[n]
ts127-3
ts127-2
ts127-1
ts127-0
ts000-7
ts000-6
ts000-5
ts000-4
ts000-3
ts000-2
ts000-1
ts000-0
9
TX[n]
ts127-3
ts127-2
ts127-1
ts127-0
ts000-7
ts000-6
ts000-5
ts000-4
ts000-3
ts000-2
ts000-1
ts000-0
1 Example timeslot numbering shown is for 8.192 Mbps links; 16.384 Mbps links have timeslots numbered 0 through 255 and 32.768 Mbps links have timeslots numbered 0
through 511. The data timing shown relative to the clock and frame sync signals would require a RCVDATD=1 and a XMTDATD=1
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Timing Requirements for TSIP 1x Mode (1)
Table 7-75
(see Figure 7-52)
No.
Min
tc(CLK)
11
Cycle time, CLK rising edge to next CLK rising edge
Max
Unit
122.1 (2)
ns
12
tw(CLKL)
Pulse duration, CLK low
0.4×tc(CLK)
ns
13
tw(CLKH)
Pulse duration, CLK high
0.4×tc(CLK)
ns
14
tt(CLK)
Transition time, CLK high to low or CLK low to high
15
tsu(FS-CLK)
Setup time, FS valid before rising CLK
2
5
ns
ns
16
th(CLK-FS)
Hold time, FS valid after rising CLK
5
ns
17
tsu(TR-CLK)
Setup time, TR valid before rising CLK
5
ns
18
th(CLK-TR)
Hold time, TR valid after rising CLK
5
19
td(CLKL-TX)
Delay time, CLK low to TX valid
1
12
ns
20
tdis(CLKH-TXZ)
Disable time, CLK low to TX Hi-Z
2
10
ns
ns
End of Table 7-75
1 Polarities of XMTFSYNCP = 0b, XMTFCLKP = 0, XMTDCLKP = 0b, RCVFSYNCP = 0, RCVFCLKP = 0, RCVDCLKP = 1. If the polarity of any of the signals is inverted, then the timing
references of that signal are also inverted.
2 Timing shown is for 8.192 Mbps links. Timing for 16.384 Mbps and 32.768 Mbps links is 61 ns and 30.5 ns, respectively.
Figure 7-52
TSIP 1x Timing Diagram(1)
11
12
13
CLKA/B
16
15
FSA/B
17
TR[n]
ts127-3
ts127-2
ts127-1
ts127-0
18
ts000-7
ts000-6
ts000-5
ts000-4
ts000-3
ts000-2
ts000-1
ts000-0
19
TX[n]
ts127-3
ts127-2
ts127-1
ts127-0
ts000-7
ts000-6
ts000-5
ts000-4
ts000-3
ts000-2
ts000-1
ts000-0
1 Example timeslot numbering shown is for 8.192 Mbps links; 16.384 Mbps links have timeslots numbered 0 through 255 and 32.768 Mbps links have timeslots numbered 0
through 511. The data timing shown relative to the clock and frame sync signals would require a RCVDATD=1023 and a XMTDATD=1023.
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7.19 EMIF16 Peripheral
The EMIF16 module provides an interface between DSP and external memories such as NAND and NOR flash. For
more information, see the External Memory Interface (EMIF16) for KeyStone Devices User Guide in ‘‘Related
Documentation from Texas Instruments’’ on page 72.
7.19.1 EMIF16 Electrical Data/Timing
Table 7-76
EMIF16 Asynchronous Memory Timing Requirements (1) (2)
(see Figure 7-53 and Figure 7-54)
No.
Min
Max
Unit
General Timing
2
tw(WAIT)
Pulse duration, WAIT assertion and deassertion minimum time
2E
ns
28
td(WAIT-WEH)
Setup time, WAIT asserted before WE high
4E + 3
ns
14
td(WAIT-OEH)
Setup time, WAIT asserted before OE high
4E + 3
ns
EMIF read cycle time when ew = 0, meaning not in extended wait mode
(RS+RST+RH+3)* (RS+RST+RH+3)*
E-3
E+3
ns
EMIF read cycle time when ew =1, meaning extended wait mode enabled
(RS+RST+WAIT+
RH+3)* E-3
(RS+RST+WAIT+
RH+3)* E+3
ns
Output setup time from CE low to OE low. SS = 0, not in select strobe mode
(RS+1) * E - 3
(RS+1) * E + 3
ns
Read Timing
3
3
4
tC(CEL)
tC(CEL)
tosu(CEL-OEL)
5
toh(OEH-CEH)
Output hold time from OE high to CE high. SS = 0, not in select strobe mode
(RH+1) * E - 3
(RH+1) * E + 3
ns
4
tosu(CEL-OEL)
Output setup time from CE low to OE low in select strobe mode, SS = 1
(RS+1) * E - 3
(RS+1) * E + 3
ns
5
toh(OEH-CEH)
Output hold time from OE high to CE high in select strobe mode, SS = 1
(RH+1) * E - 3
(RH+1) * E + 3
ns
6
tosu(BEV-OEL)
Output setup time from BE valid to OE low
(RS+1) * E - 3
(RS+1) * E + 3
ns
7
toh(OEH-BEIV)
Output hold time from OE high to BE invalid
(RH+1) * E - 3
(RH+1) * E + 3
ns
8
tosu(AV-OEL)
Output setup time from A valid to OE low
(RS+1) * E - 3
(RS+1) * E + 3
ns
9
toh(OEH-AIV)
Output hold time from OE high to A invalid
(RH+1) * E - 3
(RH+1) * E + 3
ns
10
tw(OEL)
OE active time low, when ew = 0. Extended wait mode is disabled.
(RST+1) * E - 3
(RST+1) * E + 3
ns
10
tw(OEL)
OE active time low, when ew = 1. Extended wait mode is enabled.
(RST+1) * E - 3
(RST+1) * E + 3
ns
11
td(WAITH-OEH)
Delay time from WAIT deasserted to OE# high
4E + 3
ns
12
tsu(D-OEH)
Input setup time from D valid to OE high
13
th(OEH-D)
Input hold time from OE high to D invalid
3
ns
0.5
ns
Write Timing
15
15
16
tc(CEL)
tc(CEL)
tosu(CEL-WEL)
EMIF write cycle time when ew = 0, meaning not in extended wait mode
(WS+WST+WH+
3)* E-3
(WS+WST+WH+
3)* E+3
ns
EMIF write cycle time when ew =1., meaning extended wait mode is enabled
(WS+WST+WAIT
+WH+3)* E-3
(WS+WST+WAIT
+WH+3)* E+3
ns
Output setup time from CE low to WE low. SS = 0, not in select strobe mode
(WS+1) * E - 3
ns
17
toh(WEH-CEH)
Output hold time from WE high to CE high. SS = 0, not in select strobe mode
(WH+1) * E - 3
ns
16
tosu(CEL-WEL)
Output setup time from CE low to WE low in select strobe mode, SS = 1
(WS+1) * E - 3
ns
17
toh(WEH-CEH)
Output hold time from WE high to CE high in select strobe mode, SS = 1
(WH+1) * E - 3
ns
18
tosu(RNW-WEL)
Output setup time from RNW valid to WE low
(WS+1) * E - 3
ns
19
toh(WEH-RNW)
Output hold time from WE high to RNW invalid
(WH+1) * E - 3
ns
20
tosu(BEV-WEL)
Output setup time from BE valid to WE low
(WS+1) * E - 3
ns
21
toh(WEH-BEIV)
Output hold time from WE high to BE invalid
(WH+1) * E - 3
ns
22
tosu(AV-WEL)
Output setup time from A valid to WE low
(WS+1) * E - 3
ns
23
toh(WEH-AIV)
Output hold time from WE high to A invalid
(WH+1) * E - 3
ns
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EMIF16 Asynchronous Memory Timing Requirements (1) (2)
Table 7-76
(see Figure 7-53 and Figure 7-54)
No.
Min
Max
Unit
24
tw(WEL)
WE active time low, when ew = 0. Extended wait mode is disabled.
(WST+1) * E - 3
ns
24
tw(WEL)
WE active time low, when ew = 1. Extended wait mode is enabled.
(WST+1) * E - 3
ns
26
tosu(DV-WEL)
Output setup time from D valid to WE low
(WS+1) * E - 3
ns
27
toh(WEH-DIV)
Output hold time from WE high to D invalid
(WH+1) * E - 3
ns
25
td(WAITH-WEH)
Delay time from WAIT deasserted to WE# high
4E + 3
ns
End of Table 7-76
1 E = 1/SYSCLK7, RS = Read Setup, RST = Read Strobe, RH = Read Hold, WS = Write Setup, WST = Write Strobe, WH = Write Hold.
2 WAIT = number of cycles wait is asserted between the programmed end of the strobe period and wait de-assertion.
Figure 7-53
EMIF16 Asynchronous Memory Read Timing Diagram
3
EMIFCE[3:0]
EMIFR/W
EMIFBE[1:0]
EMIFA[21:0]
9
7
5
4
6
8
10
EMIFOE
13
12
EMIFD[15:0]
EMIFWE
Figure 7-54
EMIF16 Asynchronous Memory Write Timing Diagram
15
EMIFCE[3:0]
EMIFR/W
EMIFBE[1:0]
EMIFA[21:0]
16
18
20
22
19
21
23
17
24
EMIFWE
26
27
EMIFD[15:0]
EMIFOE
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Figure 7-55
EMIF16 EM_WAIT Read Timing Diagram
Setup
Extended Due to EM_WAIT
Strobe
Strobe
Hold
Strobe
Hold
EMIFCE[3:0]
EMIFBE[1:0]
EMIFA[21:0]
EMIFD[15:0]
EMIFOE
14
11
EMIFWAIT
Figure 7-56
2
2
Asserted
Deasserted
EMIF16 EM_WAIT Write Timing Diagram
Setup
Extended Due to EM_WAIT
Strobe
EMIFCE[3:0]
EMIFBE[1:0]
EMIFA[21:0]
EMIFD[15:0]
EMIFWE
28
25
EMIFWAIT
2
2
Asserted
Deasserted
7.20 Packet Accelerator
The packet accelerator provides L2 to L4 classification functionalities. It supports classification for Ethernet, VLAN,
MPLS over Ethernet, IPv4/6, GRE over IP, and other session identification over IP such as TCP and UDP ports. It
maintains 8K multiple-in, multiple-out hardware queues. It also provides checksum capability as well as some QoS
capabilities. It can process up to 1.5 M pps. The packet accelerator is coupled with the network coprocessor. For
more information, see the Packet Accelerator (PA) for KeyStone Devices User Guide in ‘‘Related Documentation from
Texas Instruments’’ on page 72.
7.21 Security Accelerator
The security accelerator provides wire-speed processing on 1-Gbps Ethernet traffic on IPSec, SRTP, and 3GPP Air
interface security protocols. It functions on the packet level with the packet and the associated security context being
one of these above three types. The security accelerator is coupled with network coprocessor, and receives the packet
descriptor containing the security context in the buffer descriptor, and the data to be encrypted/decrypted in the
linked buffer descriptor. For more information, see the Security Accelerator (SA) for KeyStone Devices User Guide in
‘‘Related Documentation from Texas Instruments’’ on page 72.
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7.22 Gigabit Ethernet (GbE) Switch Subsystem
The Gigabit Ethernet (GbE) switch subsystem provide an efficient interface between the TMS320C6671 DSP and the
networked community. The GbE switch subsystem supports 10Base-T (10 Mbits/second [Mbps]), and 100BaseTX
(100 Mbps), in half- or full-duplex mode, and 1000BaseT (1000 Mbps) in full-duplex mode, with hardware flow
control and quality-of-service (QOS) support. The GbE switch subsystem is coupled with network coprocessor. For
more information, see the Gigabit Ethernet (GbE) Switch Subsystem for KeyStone Devices User Guide in ‘‘Related
Documentation from Texas Instruments’’ on page 72.
Each device has a unique MAC address. There are two registers to hold these values, MACID1 (0x02620110) and
MACID2 (0x02620114). All bits of these registers are defined as follows:
Figure 7-57
MACID1 Register
31
0
MACID[31:0]
R-xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx
Legend: R = Read only; -x, value is indeterminate
Table 7-77
MACID1 Register Field Descriptions
Bit
Field
Description
31-0
MAC ID[31-0]
MAC ID. A range will be assigned to this device. Each device will consume only one MAC address.
End of Table 7-77
Figure 7-58
MACID2 Register
31
24
23
18
17
16
15
0
Reserved
Reserved
FLOW
BCAST
MACID[47:32]
R-xxxx xxxx
R-0
R-z
R-y
R-xxxx xxxx xxxx xxxx
Legend: R = Read only; -x, value is indeterminate
Table 7-78
MACID2 Register Field Descriptions
Bit
Field
Description
31-24
Reserved
Reserved. Values will vary.
23-18
Reserved
Reserved. Read as 0.
17
FLOW
MAC flow control
0 = Off
1 = On
16
BCAST
Default m/b-cast reception
0 = Broadcast
1 = Disabled
15-0
MAC ID[47-0]
MAC ID
End of Table 7-78
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There is one Time Synchronization (CPTS) submodule in the Ethernet switch module for time synchronization.
Programming this register selects the clock source for the CPTS_RCLK. See the Gigabit Ethernet (GbE) Switch
Subsystem for KeyStone Devices User Guide in ‘‘Related Documentation from Texas Instruments’’ on page 72 for the
register address and other details about the Time Synchronization module. The register CPTS_RFTCLK_SEL for
reference clock selection of Time Synchronization submodule is shown in Figure 7-59.
Figure 7-59
CPTS_RFTCLK_SEL Register
31
3
2
0
Reserved
CPTS_RFTCLK_SEL
R-0
RW-0
Legend: R = Read only; -x, value is indeterminate
Table 7-79
CPTS_RFTCLK_SEL Register Field Descriptions
Bit
Field
Description
31-3
Reserved
Reserved. Read as 0.
2-0
CPTS_RFTCLK_SEL
Reference Clock Select. This signal is used to control an external multiplexer that selects one of 8 clocks for time sync
reference (RFTCLK). This CPTS_RFTCLK_SEL value can be written only when the CPTS_EN bit is cleared to 0 in the
TS_CTL register.
000 = SYSCLK2
001 = SYSCLK3
010 = TIMI0
011 = TIMI1
100 = TSIP0 CLK_A
101 = TSIP0 CLK_B
110 = TSIP1 CLK_A
111 = TSIP1 CLK_B
End of Table 7-79
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7.23 Management Data Input/Output (MDIO)
The management data input/output (MDIO) module implements the 802.3 serial management interface to
interrogate and controls up to 32 Ethernet PHY(s) connected to the device, using a shared two-wire bus. Application
software uses the MDIO module to configure the auto-negotiation parameters of each PHY attached to the GbE
switch subsystem, retrieve the negotiation results, and configure required parameters in the GbE switch subsystem
module for correct operation. The module is designed to allow almost transparent operation of the MDIO interface,
with very little maintenance from the core processor. For more information, see the Gigabit Ethernet (GbE) Switch
Subsystem for KeyStone Devices User Guide in ‘‘Related Documentation from Texas Instruments’’ on page 72.
Table 7-80
MDIO Timing Requirements
See Figure 7-60
No.
Min
Max
Unit
1
tc(MDCLK)
Cycle time, MDCLK
400
ns
2
tw(MDCLKH)
Pulse duration, MDCLK high
180
ns
3
tw(MDCLKL)
Pulse duration, MDCLK low
180
ns
4
tsu(MDIO-MDCLKH)
Setup time, MDIO data input valid before MDCLK high
5
th(MDCLKH-MDIO)
Hold time, MDIO data input valid after MDCLK high
tt(MDCLK)
Transition time, MDCLK
10
ns
0
ns
5
ns
End of Table 7-80
Figure 7-60
MDIO Input Timing
MDCLK
2
3
4
5
MDIO
(Input)
Table 7-81
MDIO Switching Characteristics
See Figure 7-61
No.
6
Parameter
td(MDCLKL-MDIO)
Min
Delay time, MDCLK low to MDIO data output valid
Max
Unit
100
ns
End of Table 7-81
Figure 7-61
MDIO Output Timing
1
MDCLK
6
MDIO
(Ouput)
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7.24 Timers
The timers can be used to: time events, count events, generate pulses, interrupt the CPU and send synchronization
events to the EDMA3 channel controller.
7.24.1 Timers Device-Specific Information
The TMS320C6671 device has nine 64-bit timers in total. Timer0 is dedicated to the CorePac as a watchdog timer
and can also be used as a general-purpose timer. Timer1 through Timer7 are reserved. Each of the other eight timers
(Timer8 through Timer15) can also be configured as a general-purpose timer only, programmed as a 64-bit timer
or as two separate 32-bit timers.
When operating in 64-bit mode, the timer counts either VBUS clock cycles or input (TINPLx) pulses (rising edge)
and generates an output pulse/waveform (TOUTLx) plus an internal event (TINTLx) on a software-programmable
period.
When operating in 32-bit mode, the timer is split into two independent 32-bit timers. Each timer is made up of two
32-bit counters: a high counter and a low counter. The timer pins, TINPLx and TOUTLx are connected to the low
counter. The timer pins, TINPHx and TOUTHx are connected to the high counter.
When operating in watchdog mode, the timer counts down to 0 and generates an event. It is a requirement
that software writes to the timer before the count expires, after which the count begins again. If the count ever
reaches 0, the timer event output is asserted. Reset initiated by a watchdog timer can be set by programming ‘‘Reset
Type Status Register (RSTYPE)’’ on page 144 and the type of reset initiated can set by programming ‘‘Reset
Configuration Register (RSTCFG)’’ on page 145. For more information, see the Timer64P for KeyStone Devices User
Guide in ‘‘Related Documentation from Texas Instruments’’ on page 72.
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7.24.2 Timers Electrical Data/Timing
The tables and figure below describe the timing requirements and switching characteristics of Timer0 and Timer8
through Timer15 peripherals.
Table 7-82
Timer Input Timing Requirements (1)
(see Figure 7-62)
No.
Min
Max
Unit
1
tw(TINPH)
Pulse duration, high
12C
ns
2
tw(TINPL)
Pulse duration, low
12C
ns
End of Table 7-82
1 C = 1/SYSCLK1 frequency in ns.
Table 7-83
Timer Output Switching Characteristics (1)
(see Figure 7-62)
No.
Parameter
Min
Max
Unit
3
tw(TOUTH)
Pulse duration, high
12C - 3
ns
4
tw(TOUTL)
Pulse duration, low
12C - 3
ns
End of Table 7-83
1 C = 1/SYSCLK1 frequency in ns.
Figure 7-62
Timer Timing
1
2
TIMIx
3
4
TIMOx
7.25 Serial RapidIO (SRIO) Port
The SRIO port on the TMS320C6671 device is a high-performance, low pin-count interconnect aimed for
embedded markets. The use of the RapidIO interconnect in a baseband board design can create a homogeneous
interconnect environment, providing even more connectivity and control among the components. RapidIO is based
on the memory and device addressing concepts of processor buses where the transaction processing is managed
completely by hardware. This enables the RapidIO interconnect to lower the system cost by providing lower latency,
reduced overhead of packet data processing, and higher system bandwidth, all of which are key for wireless
interfaces. For more information, see the Serial RapidIO (SRIO) for KeyStone Devices User Guide in ‘‘Related
Documentation from Texas Instruments’’ on page 72.
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7.26 General-Purpose Input/Output (GPIO)
7.26.1 GPIO Device-Specific Information
On the TMS320C6671, the GPIO peripheral pins GP[15:0] are also used to latch configuration pins. For more
detailed information on device/peripheral configuration and the C6671 device pin muxing, see ‘‘Device
Configuration’’ on page 73. For more information on GPIO, see the General Purpose Input/Output (GPIO) for
KeyStone Devices User Guide ‘‘Related Documentation from Texas Instruments’’ on page 72.
7.26.2 GPIO Electrical Data/Timing
Table 7-84
GPIO Input Timing Requirements
No.
Min
1
tw(GPOH)
Pulse duration, GPOx high
2
tw(GPOL)
Pulse duration, GPOx low
Max
Unit
(1)
ns
12C
ns
12C
End of Table 7-84
1 C = 1/SYSCLK1 frequency in ns.
Table 7-85
GPIO Output Switching Characteristics
No.
Parameter
3
tw(GPOH)
Pulse duration, GPOx high
4
tw(GPOL)
Pulse duration, GPOx low
Min
36C
(1)
Max
Unit
-8
ns
36C - 8
ns
End of Table 7-85
1 C = 1/SYSCLK1 frequency in ns.
Figure 7-63
GPIO Timing
1
2
GPIx
3
4
GPOx
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7.27 Semaphore2
The device contains an enhanced semaphore module for the management of shared resources of the DSP C66x
CorePacs. The semaphore enforces atomic accesses to shared chip-level resources so that the read-modify-write
sequence is not broken. The semaphore block has unique interrupts to each of the cores to identify when that core
has acquired the resource.
Semaphore resources within the module are not tied to specific hardware resources. It is a software requirement to
allocate semaphore resources to the hardware resource(s) to be arbitrated.
The semaphore module supports 1 master and contains 32 semaphores to be used within the system.
The semaphore module is accessible only by master with privilege ID (privID) 0, which means only CorePac 0 or
the EDMA transactions initiated by CorePac 0 can access the semaphore module.
If the remote device wants to access the semaphore module, the HyperLink configuration register must be
appropriately configured, so the remote device can send transactions with the desired privID value to the local
semaphore module. For more information on HyperLink configuration, see the HyperLink for KeyStone Devices
User Guide in ‘‘Related Documentation from Texas Instruments’’ on page 72.
There are two methods of accessing a semaphore resource:
• Direct Access: A core directly accesses a semaphore resource. If free, the semaphore will be granted. If not, the
semaphore is not granted.
• Indirect Access: A core indirectly accesses a semaphore resource by writing it. Once it is free, an interrupt
notifies the CPU that it is available.
7.28 Emulation Features and Capability
7.28.1 Advanced Event Triggering (AET)
The TMS320C6671 device supports advanced event triggering (AET). This capability can be used to debug complex
problems as well as understand performance characteristics of user applications. AET provides the following
capabilities:
• Hardware Program Breakpoints: specify addresses or address ranges that can generate events such as halting
the processor or triggering the trace capture.
• Data Watchpoints: specify data variable addresses, address ranges, or data values that can generate events
such as halting the processor or triggering the trace capture.
• Counters: count the occurrence of an event or cycles for performance monitoring.
• State Sequencing: allows combinations of hardware program breakpoints and data watchpoints to precisely
generate events for complex sequences.
For more information on AET, see the following documents in ‘‘Related Documentation from Texas Instruments’’
on page 72:
• Using Advanced Event Triggering to Find and Fix Intermittent Real-Time Bugs application report
• Using Advanced Event Triggering to Debug Real-Time Problems in High Speed Embedded Microprocessor
Systems application report
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7.28.2 Trace
The C6671 device supports Trace. Trace is a debug technology that provides a detailed, historical account of
application code execution, timing, and data accesses. Trace collects, compresses, and exports debug information
for analysis. Trace works in real-time and does not impact the execution of the system.
For more information on board design guidelines for Trace Advanced Emulation, see the Emulation and Trace
Headers Technical Reference Manual in ‘‘Related Documentation from Texas Instruments’’ on page 72.
7.28.2.1 Trace Electrical Data/Timing
Table 7-86
DSP Trace Switching Characteristics
(1)
(see Figure 7-64)
No.
Parameter
Min Max Unit
1
tw(EMUnH)
Pulse duration, EMUn high detected at 50% Voh
2.4
ns
1
tw(EMUnH)90%
Pulse duration, EMUn high detected at 90% Voh
1.5
ns
2
tw(EMUnL)
Pulse duration, EMUn low detected at 50% Voh
2.4
ns
2
tw(EMUnL)10%
Pulse duration, EMUn low detected at 10% Voh
1.5
ns
3
tsko(EMUn)
Output skew time, time delay difference between EMUn pins configured as trace
tsldp_(EMUn)
Output slew rate EMUn
-1
1
3.3
ns
V/ns
End of Table 7-86
1 Over recommended operating conditions.
Table 7-87
STM Trace Switching Characteristics
(1)
(see Figure 7-64)
No.
Parameter
Min Max Unit
1
tw(EMUnH)
Pulse duration, EMUn high detected at 50% Voh with 60/40 duty cycle
1
tw(EMUnH)90%
Pulse duration, EMUn high detected at 90% Voh
2
tw(EMUnL)
Pulse duration, EMUn low detected at 50% Voh with 60/40 duty cycle
2
tw(EMUnL)10%
Pulse duration, EMUn low detected at 10% Voh
3
tsko(EMUn)
Output skew time, time delay difference between EMUn pins configured as trace
tsldp_(EMUn)
Output slew rate EMUn
4
ns
3.5
ns
4
ns
3.5
ns
-1
1
3.3
ns
V/ns
End of Table 7-87
1 Over recommended operating conditions.
Figure 7-64
Trace Timing
1
2
EMUx
3
EMUy
3
EMUz
EMUx represents the EMU output pin configured as the trace clock output.
EMUy and EMUz represent all of the trace output data pins.
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7.28.3 IEEE 1149.1 JTAG
The JTAG interface is used to support boundary scan and emulation of the device. The boundary scan supported
allows for an asynchronous TRST and only the 5 baseline JTAG signals (e.g., no EMU[1:0]) required for boundary
scan. Most interfaces on the device follow the Boundary Scan Test Specification (IEEE1149.1), while all of the SerDes
(SRIO and SGMII) support the AC-coupled net test defined in AC-Coupled Net Test Specification (IEEE1149.6).
It is expected that all compliant devices are connected through the same JTAG interface, in daisy-chain fashion, in
accordance with the specification. The JTAG interface uses 1.8-V LVCMOS buffers, compliant with the Power
Supply Voltage and Interface Standard for Nonterminated Digital Integrated Circuit Specification (EAI/JESD8-5).
7.28.3.1 IEEE 1149.1 JTAG Compatibility Statement
For maximum reliability, the C6671 DSP includes an internal pulldown (IPD) on the TRST pin to ensure that TRST
will always be asserted upon power up and the DSP's internal emulation logic will always be properly initialized
when this pin is not routed out. JTAG controllers from Texas Instruments actively drive TRST high. However, some
third-party JTAG controllers may not drive TRST high but expect the use of an external pullup resistor on TRST.
When using this type of JTAG controller, assert TRST to initialize the DSP after powerup and externally drive TRST
high before attempting any emulation or boundary scan operations.
7.28.3.2 JTAG Electrical Data/Timing
Table 7-88
JTAG Test Port Timing Requirements
(see Figure 7-65)
No.
Min
Max
Unit
1
tc(TCK)
Cycle time, TCK
34
ns
1a
tw(TCKH)
Pulse duration, TCK high (40% of tc)
13.6
ns
1b
tw(TCKL)
Pulse duration, TCK low(40% of tc)
13.6
ns
3
tsu(TDI-TCK)
input setup time, TDI valid to TCK high
3.4
ns
3
tsu(TMS-TCK)
input setup time, TMS valid to TCK high
3.4
ns
4
th(TCK-TDI)
input hold time, TDI valid from TCK high
17
ns
4
th(TCK-TMS)
input hold time, TMS valid from TCK high
17
ns
End of Table 7-88
Table 7-89
JTAG Test Port Switching Characteristics (1)
(see Figure 7-65)
No.
2
Parameter
td(TCKL-TDOV)
Delay time, TCK low to TDO valid
Min
Max
Unit
13.6
ns
End of Table 7-89
1 Over recommended operating conditions.
226
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Figure 7-65
JTAG Test-Port Timing
1
1b
1a
TCK
2
TDO
3
4
TDI / TMS
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8 Revision History
Revision E
Updated EDMA addressing mode descriptions. (Page 157)
Updated BWADJ value setting description in MAIN/DDR3/PASS PLL registers (Page 147)
Added info for output clocks to 1.8-V LVCMOS Signal Transition Levels paragraph (Page 117)
Updated Main PLL and PLL Controller figure: removed /2 label from PLL object (Page 137)
Updated Rise and Fall Transition Time Voltage Reference Levels figure to include label for lower transition (Page 117)
Clarified SmartReflex pin output type (Page 53)
Clarified table caption and first column heading (Page 163)
Corrected SmartReflex peripheral I/O Buffer Type from LVCMOS category to Open drain (Page 116)
Revised Main PLL Clock Input Transition Time figure (Page 149)
Corrected EMIF16 Boot Device Configuration Bit Fields (Page 26)
Restored Parameter Information section (Page 117)
Updated Core Before IO Power Sequencing diagram, changing clock signal SYSCLK1P&N to REFCLK1P&N (Page 120)
Updated IO Before Core Power Sequencing diagram, changing clock signal SYSCLK1P&N to REFCLK1P&N (Page 122)
Updated the PASS PLL Block Diagram (Page 153)
Updated the Trace timing diagram (Page 225)
Updated Parameter Table Index bit field in I2C boot configuration (Page 29)
Updated Parameter Table Index bit field in SPI boot configuration (Page 30)
Updated PKTDMA_PRI_ALLOC register to be CHIP_MSIC_CTL register with new bit field added. (Page 77)
Updated OUTPUT_DIVIDE default value and PLL clock formula in PLL Settings section (Page 38)
Updated slow peripherals in SYSCLK7 description (Page 139)
Updated Chip Select field description in SPI boot device configuration table (Page 30)
Added DSP_SUSP_CTL register section (Page 77)
Revision D
Corrected NMI7-0 from bit fields 23-16 to bit fields 15-8 in LRSTNMIPINSTAT and LRSTNMIPINSTAT_CLR registers (Page 80)
Added Extended Boot Mode table in Boot Device Field section (Page 25)
Updated event PO_VP_SMPSACK_INTR to be Reserved in CIC3 event table (Page 175)
Updated Trace Electrical Timing tables and Timing diagrams (Page 225)
Updated event PO_VCON_SMPSERR_INTR be Reserved in CIC0/1 Event Inputs table (Page 168)
Added Boot Parameter Table section (Page 31)
Added new section DDR3 Memory Controller Race Condition Consideration to include the last 3 paragraphs originally in section 7.11.1
(Page 197)
Added REFCLK description in power sequencing section (Page 119)
Added table of Bootloader section in L2 SRAM in Boot Sequence section (Page 23)
Updated SYSCLK1 to REFCLK in power sequencing section to refer to the clock source of main PLL (Page 120)
Updated note in power sequencing that each supply must ramp monotonically and must reach a stable valid level within 20 ms
(Page 120)
Corrected differential clock rise and fall time in the PLL timing table for the clock inputs that feed into the LJCB clock buffers (Page 148)
Changed all footnote references from CORECLK to SYSCLK1 (Page 223)
Updated PCIe privilege level from "Supervisor" to "Driven by PCIe module" (Page 185)
Corrected "Reserved" to be "Assert local reset to all CorePacs" in LRESET and NMI Decoding table (Page 182)
Added MPU Registers Reset Values section (Page 195)
Added "Initial Startup" row for CVDD in Recommended Operating Conditions table (Page 114)
Added DDR3PLLCTL1 and PASSPLLCTL1 registers to Device Status Control Registers table (Page 76)
Updated all SerDes clocks to discrete frequencies in the Clock Input Timing Requirements table (Page 148)
Corrected tj(CORECLKN/P) max value from 100 to 0.02*tc(CORECLKN/P) (Page 148)
Corrected tj(DDRCLKN/P) max value from 0.025*tc(DDRCLKN/P) to 0.02*tc(DDRCLKN/P) (Page 152)
Corrected tj(PASSCLKN/P) max value from 100 to 0.02*tc(PASSCLKN/P) (Page 155)
Updated the descriptions of how Semaphore module is accessible (Page 224)
Added Debug Subsystem Configuration region to memory map table (Page 19)
Added HOUT timing diagram in Host Interrupt Output section (Page 183)
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Added note to DDR3 PLL initialization sequence (Page 151)
Corrected MPU0 Memory Protection End Address from 0x026203FF to 0x026207FF (Page 184)
Revised IPCGRH register description (Page 86)
Corrected DDR3 transfer rate from 1033 MTS to 1066 MTS (Page 197)
Added CVDD and SmartReflex voltage parameter in SmartReflex switching table (Page 125)
Removed DDR3 PLL initialization sequence from data manual to PLL controller user guide (Page 151)
Removed PASS PLL initialization sequence from data manual to PLL controller user guide (Page 154)
Updated chip select from CS[5:2] to CE[3:0] in EMIF16 Peripheral section (Page 215)
Updated EMIF chip select from CS[5:2] to CE[3:0] in Memory Map Summary table (Page 23)
Updated DDR3 PLL initialization sequence (Page 152)
Added footnote for DDR3 EMIF data in memory map summary table (Page 23)
Updated Tracer descriptions across the data manual (Page 17)
Corrected PASSCLK(N/P) max cycle time from 6.4 ns to 25 ns (Page 155)
Updated the Timer numbering across the whole document (Page 18)
Corrected PASS PLL clock to SRIOSGMIICLK in the boot device values table for Ethernet. (Page 25)
Added clarification for RESETSTATz input current (Page 115)
Added note for VCNTLID register that it is available for debug purpose only (Page 128)
Added STM Trace Switching Characteristics table (Page 225)
Removed the incorrect description of 16-Bit EMIF in Features section (Page 1)
Updated th(MDCLKH-MDIO) value from 10 ns to 0 ns in MDIO Timing Requirements table (Page 220)
Updated the description of NAND in the footnote of memory map summary table (Page 23)
Updated tw(DPnH) and tw(DPnL) descriptions in Trace Switching Characteristics tables (Page 225)
Updated I2C master mode table that bits[9:8] are used for mode selection (Page 28)
Updated the I2C passive mode table that bits[9:8] are used for mode selection and actual value on the bus is 0x19+bits[7:5] (Page 29)
Updated I2C data rate configuration descriptions in I2C Master Mode Configuration table (Page 28)
Added PLLSELECT bit to PASSPLLCTL1 Register (Page 154)
Added SPI device-specific support details (Page 204)
Corrected that only the sticky bits in PCIe MMRs will be retained after soft reset (Page 133)
Revision C
Added note stating that both SGMII ports can be used for boot (Page 27)
Updated the DDR3 MMR descriptions and deleted the unrelated PCIe MMR descriptions for soft reset. (Page 133)
Corrected physical 36-bit addresses of DDR3 EMIF configuration/data (Page 23)
Added TeraNet connection figures and added bridge numbers to the connection tables. (Page 96)
Restricted Output Divide of SECCTL register to max value of divide by 2 (Page 141)
Updated DEVSPEED register for both silicon rev1.0 and 2.0 (Page 93)
Removed RESETFULLz parameter from 4b timing description (Page 121)
Added supported data rates for HyperLink (Page 207)
Changed chip level interrupt controller name from INTC to CIC (Page 162)
Changed TPCC to EDMA3CC and TPTC to EDMA3TC (Page 156)
Added PLLRST bit to DDR3PLLCTL1 register (Page 151)
Added PLLRST bit to PASSPLLCTL1 register (Page 154)
Deleted INTC0 register map address offset 0x4 and 0x8, which are Reserved (Page 176)
Corrected the SGMII SerDes clock to PASS clock in PASS PLL configuration description (Page 38)
Corrected PASS PLL clock from SRIOSGMIICLK to PASSCLK in the boot device values table for Ethernet. (Page 25)
Corrected the SPI and DDR3/HyperLink Config end addressed (Page 23)
Added the DDR3 PLL Initialization Sequence (Page 151)
Added the Main PLL and PLL Controller Initialization Sequence (Page 148)
Added the PASS PLL Initialization Sequence (Page 154)
Added HyperLink interrupt event section (Page 207)
Added events #144-159 to INTC2 event input table (Page 170)
Added DEVSPEED Register section. (Page 93)
Added more description to Boot Sequence section (Page 23)
Corrected a typo, changed DDRCLKN to DDRCLKP (Page 152)
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Revision B
Removed section 7.1 Parameter Information (Page 117)
Corrected PASS PLL clock source description from Main PLL mux to CORECLK clock reference sources (Page 153)
Corrected MACID2 address from 0x02600114 to 0x02620114 (Page 218)
Added EMIF16 Electrical Data/Timing section (Page 215)
Added TSIP Electrical Data/Timing section (Page 213)
Updated SPI Timing section (Page 204)
Changed Data Rate 3 to Reserved from 12.5GBs in HyperLink configuration field table (Page 30)
Corrected the Device ID field to be bits 5 to 3 in Ethernet Configuration Field figure and table (Page 27)
Corrected the field bits of No Boot/EMIF16 configuration field figure and table (Page 26)
Revision A
Added note to RSISO register that both SRIOISO and SRISO will be set by boot ROM code during boot (Page 146)
Removed AIF2ISO from Reset Isolation Register (Page 146)
Added information of on-chip divider (=3) for PA in the PLL Boot Configuration Settings section (Page 38)
Changed "no support for MSI" to "support for legacy INTx" for PCIe in legacy EP mode description in Device Status Register Field Descriptions table (Page 78)
Changed "no support for MSI" to "support for legacy INTx" for PCIe legacy end point description in Device Configuration Pins table
(Page 73)
Added "The packet accelerator is coupled with network coprocessor" in the Packet Accelerator section (Page 217)
Added Network Coprocessor document link (Page 72)
Changed 2 to OUTPUT_DIVIDE in the clock formula in PLL Boot Configuration Settings section (Page 38)
Changed EMAC to GbE switch subsystem (Page 218)
Changed EMAC to Gigabit Ethernet (GbE) Switch Subsystem (Page 220)
Changed EMAC to Gigabit Ethernet Switch (Page 72)
Changed EMAC to Network Coprocessor Packet DMA (Page 95)
Changed PA_SS into Network Coprocessor Packet DMA in Device Master Settings table (Page 184)
Changed PA_SS into PASS in the Clock Sequencing table (Page 124)
Changed Packet Accelerator into Network Coprocessor and corrected the memory address in the memory map summary table (Page 17)
Changed Packet Accelerator into network coprocessor in Security Accelerator section (Page 217)
Changed Packet Accelerator into Network Coprocessor in the Device Configuration Pins table. (Page 73)
Changed Packet Accelerator subsystem into Network Coprocessor (Page 153)
Changed Packet Subsystem to Network Coprocessor (PASS PLL) in Terminal Functions table (Page 44)
Changed PASS into Network Coprocessor (PASS) (Page 138)
Changed PS_SS_CLK PLL to PASS_CLK PLL in Terminal Functions table (Page 44)
Deleted section 5.5 "C66x CorePac Resets" to avoid confusion and the reset details are covered in "Reset Controller" section (Page 105)
Removed EMAC in Characteristics of the device Processor table (Page 13)
Added BGA Package row into Characteristics of Processor table (Page 13)
Corrected End and Bytes of DDR3 EMIF Configuration section in Memory Map Summary table (Page 17)
Corrected BAR number from BAR1/2 to BAR2/3 and BAR3/4 to BAR4/5 in PCIe Window Sizes table (Page 28)
Deleted EDMA3 Peripheral Register Description section, which is covered in EDMA user guide (Page 156)
Added SerDes PLL Status and Config registers (Page 74)
Added "to DDR3 memory space" to the first step of workaround (Page 197)
Added "with TCCMOD=0" after "e.g. EDMA3 transfer controllers" (Page 197)
Added CPTS_RFTCLK_SEL register in GbE Switch Subsystem section (Page 218)
Changed "DSP/2" to "CPU/2" and "DSP/3" to "CPU/3" (Page 95)
Changed the word "can" to "must" in the sentence "for most applications increment mode can be used" to specify it is a hard rule.
(Page 157)
Corrected the tw(RXSTOP15) and tw(RXSTOP2) values in UART Timing Requirements table (Page 211)
Changed "sleep boot" to "No boot" in Sub-Mode field of No boot/EMIF16 Configuration Bit Field Descriptions table (Page 26)
Changed Section 2.5.2.1 title from "Sleep/EMIF16" to "No Boot/EMIF16" (Page 26)
Corrections Applied to I2C Passive Mode Device Configuration Bit Fields (Page 29)
Corrections Applied to I2C Passive Mode Device Configuration Field Descriptions (Page 29)
Modified description of value 0 to EMIF16/No Boot in Boot Device Values table (Page 25)
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Corrected SRIO configuration memory map from 0x02900000~0x02907FFF to 0x02900000~0x02920FFF (Page 17)
Added thermal values into the Thermal Resistance Characteristics table. (Page 233)
Added DDR3PLLCTL1 register and field description table (Page 151)
Added more description to pin PTV15 in the Terminal Functions table (Page 45)
Added PASSPLLCTL1 register and field descriptions (Page 154)
Added Master ID Settings table. (Page 185)
Added the table of Power Supply to Peripheral I/O Mapping (Page 116)
Changed PROGn_MPEAR register table format and reset value format (Page 192)
Changed PROGn_MPSAR registers table format and reset value format (Page 192)
Modified the figure of SmartReflex 4-Pin VID Interface Timing (Page 125)
Modified the table of SmartReflex 4-Pin VID Interface Switching Characteristics (Page 125)
Added PROG4 registers set into MPU1 Registers table (Page 188)
Changed number of programmable ranges supported from 4 to 5 for MPU1 (Page 184)
Modified reset values in MPU Configuration Register table (Page 191)
Modified Table 2-13 to include 1000 MHz and 1250 MHz columns. (Page 38)
Added BWADJ[11:8] to MAINPLLCTL1 register table and description. (Page 147)
Changed Privilege ID from the second column to the first column (Page 184)
Changed PROG3_MPEA to PROG3_MPEAR in MPU1 Registers table (Page 188)
Changed Programmable range enumeration from 1-N based to 0-N based in MPU Register Map. (Page 187)
Changed SRIO_CPPI and SRIO_M rows to the single row (Page 184)
Changed the master from Reserved to HyperLink with Privilege ID 13 and 14 (Page 184)
Modified BWADJ descriptions in MAINPLLCTL0 and MAINPLLCTL1 registers (Page 147)
Modified SECCTL register reference place in the note. (Page 148)
Corrected Clock Sequencing table - Removed ALTCORECLK reference, Corrected SYSCLK as CORECLK. (Page 124)
Corrections Applied to I2C Boot Device Configuration Bit Fields (Page 28)
Corrections Applied to Sleep / EMIF16 Boot Device Configuration Bit Fields (Page 26)
Updated Device Configuration Pins Table; PACLKSEL Functional Description (Page 73)
Updated Reset Electrical Data / Timing section. Included updated reset requirements. (Page 135)
Updated Reset Electrical Data; Included updated Reset Requirements. (Page 135)
Updated Table 2-3 Boot Mode Pins: Boot Device Values description of the Ethernet (SGMII) boots. (Page 25)
Removed the SRIOSMGIICLK, MCMCLK, and PCIECLK transition timing values with respect to VOH and VOL within the Main PLL Controller
timing requirements. (Page 148)
Updated Terminal Descriptions of TSIP Pins (Page 54)
Updated EMIF16 timing requirements table (Page 215)
Added MAINPLLCTL1, Renamed DDR3PLLCTL0 to DDR3PLLCT, Renamed PAPLLCTL0 to PAPLLCTL (Page 74)
Corrected the size of TETBs for the 4 cores from 16k to 4k (Page 17)
Corrected the size of TETBs for the 4 cores from 16k to 4k (Page 17)
Updated the complete Power-up sequencing section. RESETFULL must always de-assert after POR (Page 119)
Added section NMI and LRSET. (Page 182)
Corrected Extended Temperature range - Changed 105C to 100C for the top end. (Page 1)
Added BWADJ bit field to DDR3 PLL Control Register. (Page 150)
Added BWADJ bit field to PASS PLL Control Register. (Page 153)
Added MAINPLLCTL1 register table and description. (Page 147)
Added more detailed information on valid levels for CLKs and IOs during the power sequencing. (Page 119)
Added Note on level interrupts and use of EOI handshaking. (Page 162)
Corrected Address Range of I2C MMRs (Page 200)
Corrected PACLKSEL bitfield description. (Page 78)
Corrected RSV01 should be pulled up to 1.8 V and RSV08 should be tied to GND (Page 55)
Changed CVDD Range; Corrected CVDD and CVDD1 Descriptions (CVDD: Core Supply -> SR Core Supply) (CVDD1: SR Core Supply -> Core
Supply) (Page 114)
Added more detailed information on valid levels for CLKs and IOs during the power sequencing. (Page 119)
Added to table "Terminal Functions - Signals and Control by Function", signals - RSV0A and RSV0B. (Page 44)
Corrected the timing pointers to point the correct figure (Page 135)
Changed incorrect reserved address in Memory Map Summary - 02780400 -> 02778400 (Page 17)
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Corrected Commercial Temperature range - Changed 100C to 85C for the top end. (Page 1)
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9 Mechanical Data
9.1 Thermal Data
Table 9-1 shows the thermal resistance characteristics for the CYP PBGA 841-pin package with Pb-free die bumps
and Pb-free solder balls.
Table 9-1
Thermal Resistance Characteristics for CYP (PBGA 841-Pin Package)
No.
°C/W
1
RJC
Junction-to-case
0.18
2
RJB
Junction-to-board
3.71
End of Table 9-1
9.2 Packaging Information
The following packaging information reflects the most current released data available for the designated device(s).
This data is subject to change without notice and without revision of this document.
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PACKAGE OPTION ADDENDUM
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21-Jul-2017
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TMS320C6671ACYP
ACTIVE
FCBGA
CYP
841
44
Green (RoHS
& no Sb/Br)
SNAGCU
Level-4-245C-72HR
0 to 85
TMS320C6671CYP
@2010 TI
TMS320C6671ACYP25
ACTIVE
FCBGA
CYP
841
44
Green (RoHS
& no Sb/Br)
SNAGCU
Level-4-245C-72HR
0 to 85
TMS320C6671CYP
@2010 TI
1.25GHZ
TMS320C6671ACYPA
ACTIVE
FCBGA
CYP
841
44
Green (RoHS
& no Sb/Br)
SNAGCU
Level-4-245C-72HR
-40 to 100
TMS320C6671CYP
@2010 TI
A
TMS320C6671ACYPA25
ACTIVE
FCBGA
CYP
841
44
Green (RoHS
& no Sb/Br)
SNAGCU
Level-4-245C-72HR
-40 to 100
TMS320C6671CYP
@2010 TI
A1.25GHZ
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
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Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
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