Texas Instruments | Floating-Point Digital Signal Processor . (Rev. K) | Datasheet | Texas Instruments Floating-Point Digital Signal Processor . (Rev. K) Datasheet

Texas Instruments Floating-Point Digital Signal Processor . (Rev. K) Datasheet
SM320C6713-EP
SM320C6713B-EP
FLOATING-POINT DIGITAL SIGNAL PROCESSORS
Data Manual
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Literature Number: SGUS049K
August 2003 – Revised April 2011
SM320C6713-EP
SM320C6713B-EP
SGUS049K – AUGUST 2003 – REVISED APRIL 2011
www.ti.com
Contents
1
2
3
FEATURES ......................................................................................................................... 9
SUPPORTS DEFENSE, AEROSPACE, AND MEDICAL APPLICATIONS ..................................... 10
DEVICE INFORMATION ...................................................................................................... 11
10
.................................................................................................................
....................................................................................................
3.3
Functional Block and CPU (DSP Core) Diagram .....................................................................
OVERVIEW .......................................................................................................................
4.1
CPU (DSP Core) Description ............................................................................................
4.2
Memory Map Summary ...................................................................................................
4.3
L2 Memory Structure Expanded .........................................................................................
4.4
Peripheral Register Descriptions ........................................................................................
4.5
Signal Groups Description ................................................................................................
DEVICE CONFIGURATIONS ................................................................................................
5.1
Device Configurations at Device Reset .................................................................................
5.2
Peripheral Pin Selection at Device Reset ..............................................................................
5.3
Peripheral Selection/Device Configurations Via the DEVCFG Control Register ..................................
5.4
Multiplexed Pins ...........................................................................................................
5.5
Configuration Examples ..................................................................................................
5.6
Debugging Considerations ...............................................................................................
TERMINAL FUNCTIONS ......................................................................................................
6.1
Development Support .....................................................................................................
6.2
Device and Development-Support Tool Nomenclature ...............................................................
6.2.1
Device Development Evolutionary Flow .....................................................................
6.2.2
Support Tool Development Evolutionary Flow ..............................................................
6.3
Ordering Nomenclature ...................................................................................................
6.4
Documentation Support ...................................................................................................
REGISTER INFORMATION ..................................................................................................
7.1
CPU Control Status Register (CSR) Description ......................................................................
7.2
Cache Configuration (CCFG) Register Description (13B) ...........................................................
7.3
Interrupts and Interrupt Selector .........................................................................................
7.4
External Interrupt Sources ...............................................................................................
7.5
EDMA Module and EDMA Selector .....................................................................................
PLL and PLL Controller ......................................................................................................
8.1
PLL Registers ..............................................................................................................
MULTICHANNEL AUDIO SERIAL PORT (McASP) PERIPHERALS .............................................
9.1
McASP Block Diagram ....................................................................................................
9.2
Multichannel Time Division Multiplexed (TDM) Synchronous Transfer Mode .....................................
9.3
Burst Transfer Mode ......................................................................................................
9.4
Supported Bit Stream Formats for TDM and Burst Transfer Modes ................................................
9.5
Digital Audio Interface Transmitter (DIT) Transfer Mode (Transmitter Only) ......................................
9.6
McASP Flexible Clock Generators ......................................................................................
9.7
McASP Error Handling and Management ..............................................................................
9.8
McASP Interrupts and EDMA Events ...................................................................................
9.9
I2C ...........................................................................................................................
LOGIC AND POWER SUPPLY ..............................................................................................
2
Contents
4
5
6
7
8
9
3.1
Description
14
3.2
Device Characteristics
16
17
18
18
19
21
22
30
35
35
36
36
37
41
47
47
55
56
56
56
57
57
59
59
60
61
63
64
68
69
75
75
77
77
78
78
79
79
80
80
82
Copyright © 2003–2011, Texas Instruments Incorporated
SM320C6713-EP
SM320C6713B-EP
SGUS049K – AUGUST 2003 – REVISED APRIL 2011
www.ti.com
10.1
10.2
General-Purpose Input/Output (GPIO) ................................................................................. 82
Power-Down Mode Logic ................................................................................................. 83
10.3
10.2.1 Triggering, Wake-Up, and Effects ............................................................................ 83
Power-Supply Sequencing ............................................................................................... 84
........................................................................ 85
10.3.2 Power-Supply Design Considerations ....................................................................... 85
10.4 Power-Supply Decoupling ................................................................................................ 85
10.5 IEEE Std 1149.1 JTAG Compatibility Statement ...................................................................... 85
10.6 EMIF Device Speed ....................................................................................................... 86
10.7 EMIF Big Endian Mode Correctness (C6713B Only) ................................................................. 87
10.8 Bootmode ................................................................................................................... 88
PARAMETRIC INFORMATION ............................................................................................. 89
11.1 Absolute Maximum Ratings .............................................................................................. 89
11.2 Recommended Operating Conditions .................................................................................. 89
11.3 Electrical Characteristics ................................................................................................. 90
11.4 Parameter Measurement Information ................................................................................... 91
11.4.1 Timing Information .............................................................................................. 91
11.4.2 Signal Transition Levels ....................................................................................... 91
11.4.3 AC Transient Rise/Fall Time Specifications ................................................................. 92
11.4.4 Timing Parameters and Board Routing Analysis ........................................................... 93
11.5 Input and Output Clocks .................................................................................................. 94
11.6 Asynchronous Memory Timing .......................................................................................... 97
11.7 Synchronous-Burst Memory Timing ................................................................................... 100
11.8 Synchronous DRAM Timing ............................................................................................ 101
11.9 HOLD/HOLDA Timing ................................................................................................... 106
11.10 BUSREQ Timing ......................................................................................................... 106
11.11 Reset Timing ............................................................................................................. 107
11.12 External Interrupt Timing ............................................................................................... 109
11.13 Multichannel Audio Serial Port (McASP) Timing .................................................................... 110
11.14 Inter-Integrated Circuits (I2C) Timing .................................................................................. 113
11.15 Host-Port Interface Timing .............................................................................................. 115
11.16 Multichannel Buffered Serial Port (McBSP) Timing ................................................................. 119
11.17 Timer Timing ............................................................................................................. 126
11.18 General-Purpose Input/Output (GPIO) Port Timing ................................................................. 127
11.19 JTAG Test Port Timing .................................................................................................. 128
MECHANICAL DATA ........................................................................................................ 129
12.1 Mechanical Information .................................................................................................. 129
12.2 Packaging Information ................................................................................................... 129
10.3.1
11
12
System-Level Design Considerations
Copyright © 2003–2011, Texas Instruments Incorporated
Contents
3
SM320C6713-EP
SM320C6713B-EP
SGUS049K – AUGUST 2003 – REVISED APRIL 2011
www.ti.com
List of Figures
4-1
320C67x™ CPU (DSP Core) Data Paths ..................................................................................... 19
4-2
L2 Memory Configuration
4-3
4-4
4-5
4-6
4-7
4-8
5-1
5-2
5-3
5-4
5-5
5-6
6-1
7-1
7-2
8-1
9-1
9-2
10-1
10-2
10-3
10-4
10-5
10-6
10-7
11-1
11-2
11-3
11-4
11-5
11-6
11-7
11-8
11-9
11-10
11-11
11-12
11-13
11-14
11-15
11-16
11-17
11-18
11-19
11-20
4
.......................................................................................................
EDMA Channel Parameter Entries (Six Words) for Each EDMA Event ..................................................
CPU (DSP Core) and Peripheral Signals .....................................................................................
Peripheral Signals ................................................................................................................
Peripheral Signals ................................................................................................................
Peripheral Signals ................................................................................................................
Peripheral Signals ................................................................................................................
Configuration Example A (Two I2C + Two McASP + GPIO) ...............................................................
Configuration Example B (One I2C + One McBSP + Two McASP + GPIO) .............................................
Configuration Example C [2 I2C + 1 McBSP + 1 McASP + 1 McASP (DIT) + GPIO] ..................................
Configuration Example D [1 I2C + 2 McBSP + 1 McASP + 1 McASP (DIT) + GPIO + Timers] .......................
Configuration Example E (1 I2C + HPI + 1 McASP).........................................................................
Configuration Example F (One McBSP + HPI + One McASP) .............................................................
TMS320C6000™ DSP Device Nomenclature (Including SM320C6713 and C6713B Devices) .......................
CPU Control Status Register (CPU CSR) ....................................................................................
Cache Configuration (CCFG) Register ........................................................................................
PLL and Clock Generator Logic ................................................................................................
McASP0 and McASP1 Configuration ..........................................................................................
I2Cx Module Block Diagram ....................................................................................................
GPIO Enable (GPEN) Register (Hex Address: 01B0 0000) ...............................................................
GPIO Direction (GPDIR) Register (Hex Address: 01B0 0004) ............................................................
Power-Down Mode Logic........................................................................................................
PWRD Field of the CSR ........................................................................................................
Schottky Diode Diagram.........................................................................................................
16/8-Bit EMIF Big Endian Mode Correctness Mapping (HD12 = 1) (C6713B Only) ....................................
16/8-Bit EMIF Big Endian Mode Correctness Mapping (HD12 = 0) (C6713B Only) ....................................
Test Load Circuit for AC Timing Measurements .............................................................................
Input and Output Voltage Reference Levels for AC Timing Measurements ..............................................
Rise and Fall Transition Time Voltage Reference Levels ...................................................................
AC Transient Specification Rise Time .........................................................................................
AC Transient Specification Fall Time ..........................................................................................
Board-Level Input/Output Timings .............................................................................................
CLKIN ..............................................................................................................................
CLKOUT2 .........................................................................................................................
CLKOUT3 .........................................................................................................................
ECLKIN ............................................................................................................................
ECLKOUT .........................................................................................................................
Asynchronous Memory Read ...................................................................................................
Asynchronous Memory Write ...................................................................................................
SBSRAM Read Timing .........................................................................................................
SBSRAM Write Timing .........................................................................................................
SDRAM Read Command (CAS Latency 3) .................................................................................
SDRAM Write Command ......................................................................................................
SDRAM ACTV Command .....................................................................................................
SDRAM DCAB Command .....................................................................................................
SDRAM DEAC Command .....................................................................................................
List of Figures
21
25
31
32
33
34
34
42
43
44
45
46
47
57
59
61
68
76
81
82
82
83
84
85
87
88
91
91
91
92
92
94
94
94
95
95
96
99
99
101
101
103
103
104
104
105
Copyright © 2003–2011, Texas Instruments Incorporated
SM320C6713-EP
SM320C6713B-EP
www.ti.com
SGUS049K – AUGUST 2003 – REVISED APRIL 2011
11-21
SDRAM REFR Command ..................................................................................................... 105
11-22
......................................................................................................
HOLD/HOLDA Timing ..........................................................................................................
BUSREQ .........................................................................................................................
Reset Timing ....................................................................................................................
External/NMI Interrupt ..........................................................................................................
McASP Input Timings ..........................................................................................................
McASP Output Timings ........................................................................................................
I2C Receive ......................................................................................................................
I2C Transmit Timings ...........................................................................................................
HPI Read Timing (HAS Not Used, Tied High) ..............................................................................
HPI Read Timing (HAS Used) ................................................................................................
HPI Write Timing (HAS Not Used, Tied High) ..............................................................................
HPI Write Timing (HAS Used).................................................................................................
McBSP Timings .................................................................................................................
FSR Timing When GSYNC = 1 ...............................................................................................
McBSP Timing as SPI Master or Slave: CLKSTP = 10b, CLKXP = 0 ...................................................
McBSP as SPI Master or Slave: CLKSTP = 11b, CLKXP = 0 ............................................................
McBSP as SPI Master or Slave: CLKSTP = 10b, CLKXP = 1 ............................................................
McBSP as SPI Master or Slave: CLKSTP = 11b, CLKXP = 1 ............................................................
Timer .............................................................................................................................
GPIO Port Timing ...............................................................................................................
JTAG Test-Port Timing.........................................................................................................
11-23
11-24
11-25
11-26
11-27
11-28
11-29
11-30
11-31
11-32
11-33
11-34
11-35
11-36
11-37
11-38
11-39
11-40
11-41
11-42
11-43
SDRAM MRS Command
Copyright © 2003–2011, Texas Instruments Incorporated
List of Figures
105
106
107
108
109
112
112
113
114
117
117
118
118
121
121
122
123
124
125
126
127
128
5
SM320C6713-EP
SM320C6713B-EP
SGUS049K – AUGUST 2003 – REVISED APRIL 2011
www.ti.com
List of Tables
................................................
3-1
Terminal Assignments for 272-Ball GDP Package (in Order of Ball No.)
3-2
Characteristics of the C6713 and C6713B Processor ....................................................................... 16
4-1
320C6713/13B Memory Map Summary
4-2
EMIF Registers ................................................................................................................... 22
4-3
L2 Cache Registers .............................................................................................................. 23
4-4
Interrupt Selector Registers ..................................................................................................... 23
4-5
Device Registers
4-6
4-7
4-8
4-9
4-10
4-11
4-12
4-13
4-14
4-15
5-1
5-2
5-3
5-4
5-5
5-6
6-1
7-1
7-2
7-3
7-4
7-5
7-6
7-7
7-8
7-9
7-10
7-11
8-1
8-2
8-3
8-4
8-5
8-6
8-7
......................................................................................
.................................................................................................................
EDMA Parameter RAM .........................................................................................................
EDMA Registers ..................................................................................................................
Quick DMA (QDMA) and Pseudo Registers .................................................................................
PLL Controller Registers ........................................................................................................
McASP0 and McASP1 Registers ..............................................................................................
I2C0 and I2C1 Registers ........................................................................................................
HPI Registers .....................................................................................................................
Timer 0 and Timer 1 Registers .................................................................................................
McBSP0 and McBSP1 Registers ..............................................................................................
GPIO Registers ...................................................................................................................
Device Configurations Pins at Device Reset (HD[4:3], HD8, HD12 [13B only], and CLKMODE0) ...................
HPI_EN (HD14 Pin) Peripheral Selection (HPI or McASP1, and Select GPIO Pins) ..................................
Device Configuration Register (DEVCFG) [Address Location: 0x019C0200−0x019C02FF] ..........................
Device Configuration Register (DEVCFG) Selection Bit Descriptions ....................................................
Peripheral Pin Selection Matrix ................................................................................................
C6713/13B Device Multiplexed/Shared Pins .................................................................................
320C6713 and C6713B Device Part Numbers (P/Ns) and Ordering Information .......................................
CPU CSR Bit Field Description ................................................................................................
CCFG Register Bit Field Description ..........................................................................................
DSP Interrupts ....................................................................................................................
Interrupt Selector .................................................................................................................
External Interrupt Sources and Peripheral Module Control .................................................................
EDMA Channels ..................................................................................................................
EDMA Selector ...................................................................................................................
EDMA Event Selector Registers (ESEL0 Register (0x01A0 FF00) .......................................................
EDMA Event Selector Registers—ESEL1 Register (0x01A0 FF04) ......................................................
EDMA Event Selector Registers—ESEL3 Register (0x01A0 FF0C) .....................................................
EDMA Event Selection Registers (ESEL0, ESEL1, and ESEL3) Description ............................................
PLL Lock and Reset Times .....................................................................................................
CLKOUT Signals, Default Settings, and Control .............................................................................
PLL Clock Frequency Ranges .................................................................................................
PLL Control/Status Register (PLLCSR) (0x01B7 C100) ...................................................................
PLL Control/Status Register (PLLCSR) Description .........................................................................
PLL Multiplier (PLLM) Control Register (0x01B7 C110) ....................................................................
PLL Multiplier (PLLM) Control Register Description .........................................................................
12
20
24
24
25
25
25
26
28
28
28
28
29
35
36
36
37
38
38
57
60
61
61
63
64
65
66
67
67
67
67
69
69
70
70
71
71
72
8-8
PLL Wrapper Divider x Registers (PLLDIV0, PLLDIV1, PLLDIV2, and PLLDIV3)
(0x01B7 C114, 0x01B7 C118, 0x01B7 C11C, and 0x01B7 C120, respectively) ....................................... 72
8-9
PLL Wrapper Divider x Registers
(Prescaler Divider D0 and Post-Scaler Dividers D1, D2, and D3) Description
72
Oscillator Divider 1 (OSCDIV1) Register (0x01B7 C124)
73
8-10
6
List of Tables
..........................................
..................................................................
Copyright © 2003–2011, Texas Instruments Incorporated
SM320C6713-EP
SM320C6713B-EP
www.ti.com
SGUS049K – AUGUST 2003 – REVISED APRIL 2011
.......................................................................
8-11
Oscillator Divider 1 (OSCDIV1) Register Description
10-1
Characteristics of the Power-Down Modes ................................................................................... 84
10-2
C6713/13B Example Boards and Maximum EMIF Speed .................................................................. 87
11-1
Board-Level Timings Example (see ) .......................................................................................... 93
11-2
Timing Requirements for CLKIN
11-3
Switching Characteristics for CLKOUT2
11-4
11-5
11-6
11-7
11-8
11-9
11-10
11-11
11-12
11-13
11-14
11-15
11-16
11-17
11-18
11-19
11-20
11-21
11-22
11-23
11-24
11-25
11-26
11-27
74
............................................................................................... 94
...................................................................................... 94
Switching Characteristics for CLKOUT3 ...................................................................................... 95
Timing Requirements for ECLKIN ............................................................................................. 95
Switching Characteristics for ECLKOUT ..................................................................................... 96
Timing Requirements for Asynchronous Memory Cycles .................................................................. 97
Switching Characteristics for Asynchronous Memory Cycles ............................................................. 97
Timing Requirements for Synchronous-Burst SRAM Cycles ............................................................. 100
Switching Characteristics for Synchronous-Burst SRAM Cycles ........................................................ 100
Timing Requirements for Synchronous DRAM Cycles .................................................................... 101
Switching Characteristics for Synchronous DRAM Cycles ............................................................... 101
Timing Requirements for HOLD/HOLDA Cycles ........................................................................... 106
Switching Characteristics for HOLD/HOLDA Cycles ...................................................................... 106
Switching Characteristics for BUSREQ Cycles ............................................................................ 106
Timing Requirements for RESET ............................................................................................ 107
Switching Characteristics For RESET ....................................................................................... 107
Timing Requirements for External Interrupts ............................................................................... 109
Timing Requirements for McASP ............................................................................................ 110
Switching Characteristics for McASP ........................................................................................ 110
Timing Requirements for I2C ................................................................................................. 113
Switching Characteristics for I2C ............................................................................................. 114
Timing Requirements for Host-Port Interface Cycles ..................................................................... 115
Switching Characteristics for Host-Port Interface Cycles ................................................................. 116
Timing Requirements for McBSP ............................................................................................ 119
Switching Characteristics for McBSP ........................................................................................ 120
Timing Requirements for FSR When GSYNC = 1 ......................................................................... 121
11-28
Timing Requirements for McBSP as SPI Master or Slave:
CLKSTP = 10b, CLKXP = 0 .................................................................................................... 121
11-29
Switching Characteristics for McBSP as SPI Master or Slave:
CLKSTP = 10b, CLKXP = 0 .................................................................................................... 122
11-30
Timing Requirements for McBSP as SPI Master or Slave:
CLKSTP = 11b, CLKXP = 0 .................................................................................................... 122
11-31
Switching Characteristics for McBSP as SPI Master or Slave:
CLKSTP = 11b, CLKXP = 0 .................................................................................................... 123
11-32
Timing Requirements for McBSP as SPI Master or Slave:
CLKSTP = 10b, CLKXP = 1 .................................................................................................... 124
11-33
Switching Characteristics for McBSP as SPI Master or Slave:
CLKSTP = 10b, CLKXP = 1 .................................................................................................... 124
11-34
11-35
Timing Requirements for McBSP as SPI Master or Slave: CLKSTP = 11b, CLKXP = 1
.............................
125
Switching Characteristics for McBSP as SPI Master or Slave:
CLKSTP = 11b, CLKXP = 1 .................................................................................................... 125
......................................................................................
.................................................................................
Timing Requirements for GPIO Inputs ......................................................................................
Switching Characteristics for GPIO Inputs ..................................................................................
Timing Requirements for JTAG Test Port ..................................................................................
11-36
Timing Requirements for Timer Inputs
126
11-37
Switching Characteristics for Timer Inputs
126
11-38
11-39
11-40
Copyright © 2003–2011, Texas Instruments Incorporated
List of Tables
127
127
128
7
SM320C6713-EP
SM320C6713B-EP
SGUS049K – AUGUST 2003 – REVISED APRIL 2011
www.ti.com
..............................................................................
11-41
Switching Characteristics for JTAG Test Port
12-1
Thermal Resistance Characteristics (S-PBGA Package) for GDP ....................................................... 129
8
List of Tables
128
Copyright © 2003–2011, Texas Instruments Incorporated
SM320C6713-EP
SM320C6713B-EP
SGUS049K – AUGUST 2003 – REVISED APRIL 2011
www.ti.com
FLOATING-POINT DIGITAL SIGNAL PROCESSORS
Check for Samples: SM320C6713-EP
1
FEATURES
1
2
• Highest Performance Floating Point Digital
Signal Processors (DSPs): C6713/C6713B
– Eight 32 Bit Instructions/Cycle
– 32/64 Bit Data Word
– 200 and 300 MHz Clock Rate
– 5 Instruction Cycle Times
– 2400/1800 and 1600/1200 MIPS/MFLOPS
– Rich Peripheral Set, Optimized for Audio
– Highly Optimized C/C++ Compiler
• Advanced Very Long Instruction Word (VLIW)
320C67x™ DSP Core
– Eight Independent Functional Units:
• Two ALUs (Fixed Point)
• Four ALUs (Floating Point and Fixed
Point)
• Two Multipliers (Floating Point and Fixed
Point)
– Load Store Architecture With 32 32-Bit
General Purpose Registers
– Instruction Packing Reduces Code Size
– All Instructions Conditional
• Instruction Set Features
– Native Instructions for IEEE 754
– Byte Addressable (8/16/32 Bit Data)
– 8 Bit Overflow Protection
– Saturation; Bit-Field Extract, Set, Clear;
Bit-Counting; Normalization
• L1/L2 Memory Architecture
– 4K Byte L1P Program Cache (Direct-Mapped)
– 4K Byte L1D Data Cache (2-Way)
– 256K Byte L2 Memory Total: 64K-Byte L2
Unified Cache/Mapped RAM, and 192K Byte
Additional L2 Mapped RAM
• Device Configuration
– Boot Mode: HPI, 8/16/32 Bit ROM Boot
– Endianness: Little Endian, Big Endian
• 32 Bit External Memory Interface (EMIF)
– Glueless Interface to SRAM, EPROM, Flash,
SBSRAM, and SDRAM
– 512M Byte Total Addressable External
Memory Space
• Enhanced Direct Memory Access (EDMA)
Controller (16 Independent Channels)
• 16 Bit Host Port Interface (HPI)
• Two Multichannel Audio Serial Ports (McASPs)
– Two Independent Clock Zones Each
(One TX and One RX)
– Eight Serial Data Pins Per Port: Individually
Assignable to any of the Clock Zones
– Wide Variety of I2S™ and Similar Bit Stream
Formats
– Integrated Digital Audio Interface Transmitter
(DIT)
– Extensive Error Checking and Recovery
• Two Inter-Integrated Circuit Bus (I2C™ Bus)
Multi-Master and Slave Interfaces
• Two Multichannel Buffered Serial Ports:
– Serial Peripheral Interface (SPI)
– High Speed TDM Interface
– AC97 Interface
• Two 32 Bit General Purpose Timers
• Dedicated GPIO Module With 16 Pins (External
Interrupt Capable)
• Flexible Phase Locked Loop (PLL) Based Clock
Generator Module
• IEEE-1149.1 (JTAG) (1) Boundary-Scan
Compatible
• 272 Ball, Ball Grid Array Package (GDP)
• 0.13 μm/6 Level Copper Metal Process
– CMOS Technology
• 3.3 V I/Os, 1.26 V Internal
(1)
IEEE Standard 1149.1-1990 Standard-Test-Access Port and
Boundary Scan Architecture.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
320C67x, TMS320C6000, TMS320C67x, eXpressDSP, Code Composer Studio, DSP/BIOS, C6000, XDS, TMS320, PowerPAD, C62x, C67x
are trademarks of Texas Instruments.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2003–2011, Texas Instruments Incorporated
SM320C6713-EP
SM320C6713B-EP
SGUS049K – AUGUST 2003 – REVISED APRIL 2011
2
www.ti.com
SUPPORTS DEFENSE, AEROSPACE, AND MEDICAL APPLICATIONS
3
•
•
•
•
(2)
Controlled Baseline
One Assembly/Test Site
One Fabrication Site
Available in Military (–55°C/125°C) Temperature
Range (2)
break
• Extended Product Life Cycle
• Extended Product-Change Notification
• Product Traceability
Custom temperature ranges available
320C67x, TMS320C6000, TMS320C67x, eXpressDSP, Code Composer Studio, DSP/BIOS, C6000, XDS, TMS320, PowerPAD, C62x, C67x
are trademarks of Texas Instruments.
3
10
SUPPORTS DEFENSE, AEROSPACE, AND MEDICAL APPLICATIONS
Submit Documentation Feedback
focus.ti.com: SM320C6713-EP
Copyright © 2003–2011, Texas Instruments Incorporated
SM320C6713-EP
SM320C6713B-EP
SGUS049K – AUGUST 2003 – REVISED APRIL 2011
www.ti.com
3
DEVICE INFORMATION
GDP 272-BALL BGA PACKAGE
(BOTTOM VIEW)
Y
VSS
VSS
W
VSS
CVDD DVDD
ED18
BE2
ED17
ARDY EA2
VSS
ECLKIN
CLKOUT2/
GP[2]
VSS
EA14
EA16
EA18
DVDD
EA20
VSS
VSS
VSS
DVDD
EA11
EA13
EA15
VSS
EA19
CE1
CVDD
VSS
EA10 SDCAS/ SDWE/ DVDD
ARE/
AWE/
EA12
DVDD
EA17
CE0
CVDD
DVDD
BE0
CVDD
CVDD
DVDD
VSS
EA21
BE1
VSS
VSS
ED13 ED15
ED14
CVDD
DVDD
ED11
ED12
DVDD
EA7
EA9
EA4
EA6
DVDD SDRAS/
ECLKOUT
AOE/
CE2
SSOE
V
CVDD ED16
ED20 ED19
BE3
CE3
EA3
EA5
EA8
SSADS SSWE
U
ED22
ED21 ED23
VSS
T
ED24 ED25 DVDD
VSS
R
DVDD
ED27 ED26 CVDD
P
ED28
ED29 ED30
VSS
VSS
ED9
VSS
ED10
N
SCL0
SDA0 ED31
VSS
VSS
ED6
ED7
ED8
M
DVDD CVDD
DVDD
VSS
VSS
CVDD
CVDD
DVDD
VSS
CLKR1/ DR1/ FSR1/
AXR0[6] SDA1 AXR0[7]
VSS
VSS
VSS
VSS
VSS
VSS
DVDD
ED4
ED5
L
FSX1
DX1
AXR0[5]
CLKX1/
AMUTE0
CVDD
VSS
VSS
VSS
VSS
CVDD
ED2
ED3
CVDD
K
CVDD
VSS
CLKS0
AHCLKR0
CVDD
VSS
VSS
VSS
VSS
CVDD
ED0
ED1
VSS
VSS
VSS
VSS
VSS
HOLD HOLDA
BUS
REQ
HINT/
GP[1]
J
DR0/
DVDD FSR0/
AXR0[0]
AFSR0
VSS
H
DX0/
FSX0/
CLKR0/
AFSX0 AXR0[1] ACLKR0
VSS
VSS
G
TOUT0/
AXR0[2]
TINP0/
AXR0[3]
VSS
VSS
F
TOUT1/
TINP1/
AXR0[4] AHCLKX0
E
CLKS1/
SCL1
VSS
D
DVDD
GP[6]
(EXT_INT6)
C
GP[5]
GP[4]
(EXT_INT5) (EXT_INT4)
AMUTEIN0 AMUTEIN1
B
VSS
CVDD
A
VSS
VSS
1
2
CLKX0/
ACLKX0
DVDD CVDD
GP[7]
(EXT_INT7)
EMU2
CVDD
DVDD
VSS
VSS
RSV
VSS
EMU0
VSS
CVDD
VSS
VSS
RSV
TRST
TMS
DVDD
EMU1 EMU3 RSV
RSV
TCK
TDI
TD0
CVDD
CVDD
VSS
RSV
RESET
VSS
5
6
7
8
9
10
11
12
13
14
CLK
PLLHV
MODE0
VSS
CLKIN CVDD
3
CVDD
CVDD
4
DVDD
HHWIL/
HRDY/
ACLKR[1] AFSR[1]
HCNTL0/ HCNTL1/
AXR1[3] AXR1[1]
HR/W/
AXR1[0]
CVDD
HDS2/
AXR1[5]
VSS
HCS/
AXR1[1]
VSS
HAS/
ACLKX1
HDS/
AXR1[6]
HD0/
AXR1[4]
VSS
HD2/
AFSX1
DVDD
HD1/
AXR1[7]
CVDD
RSV
VSS
CVDD
CVDD DVDD
DVDD EMU4
RSV
NMI
HD14/
GP[14]
HD12/
GP[12]
HD9/
GP[9]
HD6/
AHCLKR1
CVDD
HD4/
GP[0]
HD3/
AMUTE1
VSS
HD10/
GP[10]
HD8/
GP[8]
HD5/
AHCLKX1
CVDD
VSS
HD13/ HD11/
GP[13] GP[11]
DVDD
HD7/
GP[3]
VSS
VSS
17
18
19
20
CLKOUT3
HD15/
EMU5 DVDD GP[15]
15
16
Shading denotes the GDP package pin functions that drop out on the PYP package.
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Table 3-1. Terminal Assignments for 272-Ball GDP Package (in Order of Ball No.)
BALL NO.
12
SIGNAL NAME
BALL NO.
SIGNAL NAME
A1
VSS
C1
GP[5](EXT_INT5)/AMUTEIN0
A2
VSS
C2
GP[4](EXT_INT4)/AMUTEIN1
A3
CLKIN
C3
CVDD
A4
CVDD
C4
CLKMODE0
A5
RSV
C5
PLLHV
A6
TCK
C6
VSS
A7
TDI
C7
CVDD
A8
TDO
C8
VSS
A9
CVDD
C9
VSS
A10
CVDD
C10
DVDD
A11
VSS
C11
EMU4
A12
RSV (connected directly to CVDD)
C12
RSV
A13
RESET
C13
NMI
A14
VSS
C14
HD14/GP[14]
A15
HD13/GP[13]
C15
HD12/GP[12]
A16
HD11/GP[11]
C16
HD9/GP[9]
A17
DVDD
C17
HD6/AHCLKR1
A18
HD7/GP[3]
C18
CVDD
A19
VSS
C19
HD4/GP[0]
A20
VSS
C20
HD3/AMUTE1
B1
VSS
D1
DVDD
B2
CVDD
D2
GP[6](EXT_INT6)
B3
DVDD
D3
EMU2
B4
VSS
D4
VSS
B5
RSV
D5
CVDD
B6
TRST
D6
CVDD
B7
TMS
D7
RSV
B8
DVDD
D8
VSS
B9
EMU1
D9
EMU0
B10
EMU3
D10
CLKOUT3
B11
RSV (connected directly to VSS)
D11
CVDD
B12
EMU5
D12
RSV
B13
DVDD
D13
VSS
B14
HD15/GP[15]
D14
CVDD
B15
VSS
D15
CVDD
B16
HD10/GP[10]
D16
DVDD
B17
HD8/GP[8]
D17
VSS
B18
HD5/AHCLKX1
D18
HD2/AFSX1
B19
CVDD
D19
DVDD
B20
VSS
D20
HD1/AXR1[7]
E1
CLKS1/SCL1
J17
HOLD
E2
VSS
J18
HOLDA
E3
GP[7]/(EXP_INT7)
J19
BUSREQ
E4
VSS
J20
HINT/GP[1]
E17
VSS
K1
CVDD
E18
HAS/ACLKX1
K2
VSS
E19
HDS1/AXR1[6]
K3
CLKS0/AHCLKR0
E20
HD0/AXR1[4]
K4
CVDD
F1
TOUT1/AXR0[4]
K9
VSS
F2
TINP1/AHCLKX0
K10
VSS
F3
DVDD
K11
VSS
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Table 3-1. Terminal Assignments for 272-Ball GDP Package (in Order of Ball No.) (continued)
BALL NO.
SIGNAL NAME
BALL NO.
SIGNAL NAME
F4
CVDD
K12
VSS
F17
CVDD
K17
CVDD
F18
HDS2/AXR1[5]
K18
ED0
F19
VSS
K19
ED1
F20
HCS/AXR1[2]
K20
VSS
G1
TOUT0/AXR0[2]
L1
FSX1
G2
TINP0/AXR0[3]
L2
DX1/AXR0[5]
G3
CLKX0/ACLKX0
L3
CLKX1/AMUTE0
G4
VSS
L4
CVDD
G17
VSS
L9
VSS
G18
HCNTL0/AXR1[3]
L10
VSS
G19
HCNTL1/AXR1[1]
L11
VSS
G20
HR/W/AXR1[0]
L12
VSS
H1
FSX0/AFSX0
L17
CVDD
H2
DX0/AXR0[1]
L18
ED2
H3
CLKR0/ACLKR0
L19
ED3
H4
VSS
L20
CVDD
H17
VSS
M1
CLKR1/AXR0[6]
H18
DVDD
M2
DR1/SDA1
H19
HRDY/ACLKR1
M3
FSR1/AXR0[7]
H20
HHWIL/AFSR1
M4
VSS
J1
DR0/AXR0[0]
M9
VSS
J2
DVDD
M10
VSS
J3
FSR0/AFSR0
M11
VSS
J4
VSS
M12
VSS
J9
VSS
M17
VSS
J10
VSS
M18
DVDD
J11
VSS
M19
ED4
J12
VSS
M20
ED5
N1
SCL0
U9
VSS
N2
SDA0
U10
CVDD
N3
ED31
U11
CVDD
N4
VSS
U12
DVDD
N17
VSS
U13
VSS
N18
ED6
U14
CVDD
N19
ED7
U15
CVDD
N20
ED8
U16
DVDD
P1
ED28
U17
VSS
P2
ED29
U18
EA21
P3
ED30
U19
BE1
P4
VSS
U20
VSS
P17
VSS
V1
ED20
P18
ED9
V2
ED19
P19
VSS
V3
CVDD
P20
ED10
V4
ED16
R1
DVDD
V5
BE3
R2
ED27
V6
CE3
R3
ED26
V7
EA3
R4
CVDD
V8
EA5
R17
CVDD
V9
EA8
R18
DVDD
V10
EA10
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Table 3-1. Terminal Assignments for 272-Ball GDP Package (in Order of Ball No.) (continued)
BALL NO.
3.1
SIGNAL NAME
BALL NO.
SIGNAL NAME
R19
ED11
V11
ARE/SDCAS/SSADS
R20
ED12
V12
AWE/SDWE/SSWE
T1
ED24
V13
DVDD
T2
ED25
V14
EA17
T3
DVDD
V15
DVDD
T4
VSS
V16
EA
T17
VSS
V17
CE0
T18
ED13
V18
CVDD
T19
ED15
V19
DVDD
T20
ED14
V20
BE0
U1
ED22
W1
VSS
U2
ED21
W2
CVDD
U3
ED23
W3
DVDD
U4
VSS
W4
ED17
U5
DVDD
W5
VSS
U6
CVDD
W6
CE2
U7
DVDD
W7
EA4
U8
VSS
W8
EA6
W9
DVDD
Y5
ARDY
W10
AOE/SDRAS/SSOE
Y6
EA2
W11
VSS
Y7
DVDD
W12
DVDD
Y8
EA7
W13
EA11
Y9
EA9
W14
EA13
Y10
ECLKOUT
W15
EA15
Y11
ECLKIN
W16
VSS
Y12
CLKOUT2/GP[2]
W17
EA19
Y13
VSS
W18
CE1
Y14
EA14
W19
CVDD
Y15
EA16
W20
VSS
Y16
EA18
Y1
VSS
Y17
DVDD
Y2
VSS
Y18
EA20
Y3
ED18
Y19
VSS
Y4
BE2
Y20
VSS
Description
The TMS320C67x™ DSPs (including the SM320C6713 and SM320C6713B devices) compose the
floating-point DSP generation in the TMS320C6000™ DSP platform. The C6713 and C6713B devices are
based on the high-performance, advanced very-long-instruction-word (VLIW) architecture developed by
Texas Instruments (TI), making this DSP an excellent choice for multichannel and multifunction
applications. Throughout the remainder of this document, the SM320C6713 and SM320C6713B are
referred to as 320C67x or C67x or 13/13B where generic, and where specific, their individual full device
part numbers are used or abbreviated as C6713, C6713B, 13, or 13B, and so forth.
Operating at 225 MHz, the C6713/13B delivers up to 1350 million floating-point operations per second
(MFLOPS), 1800 million instructions per second (MIPS), and with dual fixed-/floating-point multipliers up to
450 million multiply-accumulate operations per second (MMACS).
Operating at 300 MHz, the C6713B delivers up to 1800 million floating-point operations per second
(MFLOPS), 2400 million instructions per second (MIPS), and with dual fixed-/floating-point multipliers up to
600 million multiply-accumulate operations per second (MMACS).
14
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The C6713/13B has a rich peripheral set that includes two multichannel audio serial ports (McASPs), two
multichannel buffered serial ports (McBSPs), two inter-integrated circuit (I2C) buses, one dedicated
general-purpose input/output (GPIO) module, two general-purpose timers, a host-port interface (HPI), and
a glueless external memory interface (EMIF) capable of interfacing to SDRAM, SBSRAM, and
asynchronous peripherals.
The two McASP interface modules each support one transmit and one receive clock zone. Each of the
McASPs has eight serial data pins that can be individually allocated to any of the two zones. The serial
port supports time-division multiplexing on each pin from 2 to 32 time slots. The C6713/13B has sufficient
bandwidth to support all 16 serial data pins transmitting a 192-kHz stereo signal. Serial data in each zone
may be transmitted and received on multiple serial data pins simultaneously and formatted in a multitude
of variations on the Philips Inter-IC Sound (I2S) format.
In addition, the McASP transmitter may be programmed to output multiple S/PDIF, IEC60958, AES-3, and
CP-430 encoded data channels simultaneously, with a single RAM containing the full implementation of
user data and channel status fields.
The McASP also provides extensive error-checking and recovery features, such as the bad clock
detection circuit for each high-frequency master clock, which verifies that the master clock is within a
programmed frequency range.
The two I2C ports on the 320C6713/13B allow the DSP to easily control peripheral devices and
communicate with a host processor. In addition, the standard multichannel buffered serial port (McBSP)
may be used to communicate with serial peripheral interface (SPI™) mode peripheral devices.
The 320C6713/13B device has two boot modes—from the HPI or from external asynchronous ROM. For
more detailed information, see the Bootmode section of this data sheet.
The TMS320C67x DSP generation is supported by the TI eXpressDSP™ set of industry benchmark
development tools, including a highly optimizing C/C++ Compiler, the Code Composer Studio™ Integrated
Development Environment (IDE), JTAG-based emulation and real-time debugging, and the DSP/BIOS™
kernel.
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3.2
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Device Characteristics
Table 3-2 provides an overview of the C6713/C6713B DSPs. The table shows significant features of each
device, including the capacity of on-chip RAM, the peripherals, the execution time, and the package type
with pin count. For more details on the C67x™ DSP device part numbers and part numbering, see
Table 6-1 and Figure 6-1.
Table 3-2. Characteristics of the C6713 and C6713B Processor
INTERNAL CLOCK
SOURCE
HARDWARE FEATURES
Peripherals
Not all peripheral pins are available at the
same time. (For more details, see the
Device Configurations section.)
Peripheral performance is dependent on
chip-level configuration.
On-chip memory
C6713/C6713B
(FLOATING-POINT DSPs)
GDP
EMIF
SYSCLK3 or ECLKIN
1 (32 bit)
EDMA
(16 channels)
CPU clock frequency
1
HPI (16 bit)
SYSCLK2
1
McASPs
AUXCLK,
SYSCLK2 (1)
2
I Cs
SYSCLK2
2
McBSPs
SYSCLK2
2
32-bit timers
� of SYSCLK2
2
GPIO module
SYSCLK2
2
Size (Bytes)
Organization
1
264K
4K-Byte (KB) L1 program (L1P) cache
4KB L1 data (L1D) cache
64KB unified L2 cache/mapped RAM
192KB L2 mapped RAM
CPU ID+CPU Rev ID
Control Status Register (CSR[31:16])
BSDL file
For the C6713/13B BSDL file, contact your field sales representative.
Frequency
MHz
Time
ns
Voltage
200
5 ns
Core (V)
I/O (V)
Clock generator options
Prescaler
Multiplier
Postscaler
Package
27 mm × 27 mm
Process technology
μm
(2)
16
1.26 V (C6713/C6713B)
3.3 V
/1, /2, /3, ..., /32
×4, ×5, ×6, ..., ×25
/1, /2, /3, ..., /32
272-ball BGA (GDP)
0.13
Product status (2)
Product preview (PP)
Advance information (AI)
Production data (PD)
(1)
0x0203
PD (13)
AUXCLK is the McASP internal high-frequency clock source for serial transfers. SYSCLK2 is the McASP system clock used for the clock
check (high-frequency) circuit.
PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice.
ADVANCE INFORMATION concerns new products in the sampling or preproduction phase of development. Characteristic data and
other specifications are subject to change without notice.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
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3.3
Functional Block and CPU (DSP Core) Diagram
C6713/13B Digital Signal Processors
32
EMIF
L1P Cache
Direct Mapped
4K Bytes Total
L2 Cache/
Memory
4 Banks
64K Bytes
Total
McASP1
C67xä CPU
(up to
4-Way)
McASP0
Instruction Fetch
Control
Registers
Instruction Dispatch
McBSP1
Data Path A
Pin Multiplexing
McBSP0
I2C1
Control
Logic
Instruction Decode
Data Path B
A Register File
Enhanced
DMA
Controller
(16 channel)
I2C0
(A)
.L1
(A)
.D1.
Clock Generator and PLL
x4 through x25 Multiplier
/1 through /32 Dividers
Timer 0
(A)
(A)
D2 .M2 .S2
In-Circuit
Emulation
(A)
.L2
Interrupt
Control
L1D Cache
2-Way
Set Associative
4K Bytes
L2
Memory
192K
Bytes
Timer 1
(A)
.S1 .M1
Test
B Register File
Power-Down
Logic
GPIO
16
HPI
NOTE A: In addition to fixed-point instructions, these functional units execute floating-point instructions.
EMIF interfaces to:
-SDRAM
-SBSRAM
-SRAM
-ROM/flash and
I/O devices
McBSPs interface to:
-SPI control port
-High-speed TDM codecs
-AC97 codecs
-Serial EEPROM
McASPs interface to:
-I2S multichannel ADC, DAC, codec, DIR
-DIT: Multiple outputs
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4
OVERVIEW
4.1
CPU (DSP Core) Description
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The 320C6713/13B floating-point digital signal processor is based on the C67x CPU. The CPU fetches
advanced very-long instruction words (VLIW) (256 bits wide) to supply up to eight 32-bit instructions to the
eight functional units during every clock cycle. The VLIW architecture features controls by which all eight
units do not have to be supplied with instructions if they are not ready to execute. The first bit of every
32-bit instruction determines if the next instruction belongs to the same execute packet as the previous
instruction, or whether it should be executed in the following clock as a part of the next execute packet.
Fetch packets are always 256 bits wide; however, the execute packets can vary in size. The
variable-length execute packets are a key memory-saving feature, distinguishing the C67x CPU from other
VLIW architectures.
The CPU features two sets of functional units. Each set contains four units and a register file. One set
contains functional units .L1, .S1, .M1, and .D1. The other set contains units .D2, .M2, .S2, and .L2. The
two register files each contain 16 32-bit registers for a total of 32 general-purpose registers. The two sets
of functional units, along with two register files, compose sides A and B of the CPU (see the Functional
Block and CPU (DSP Core) Diagram and Figure 4-1). The four functional units on each side of the CPU
can freely share the 16 registers belonging to that side. Additionally, each side features a single data bus
connected to all the registers on the other side, by which the two sets of functional units can access data
from the register files on the opposite side. While register access by functional units on the same side of
the CPU as the register file can service all the units in a single clock cycle, register access using the
register file across the CPU supports one read and one write per cycle.
The C67x CPU executes all C62x instructions. In addition to C62x fixed-point instructions, the six out of
eight functional units (.L1, .S1, .M1, .M2, .S2, and .L2) also execute floating-point instructions. The
remaining two functional units (.D1 and .D2) also execute the new LDDW instruction, which loads 64 bits
per CPU side for a total of 128 bits per cycle.
Another key feature of the C67x CPU is the load/store architecture, where all instructions operate on
registers (as opposed to data in memory). Two sets of data-addressing units (.D1 and .D2) are
responsible for all data transfers between the register files and the memory. The data address driven by
the .D units allows data addresses generated from one register file to be used to load or store data to or
from the other register file. The C67x CPU supports a variety of indirect addressing modes using either
linear- or circular-addressing modes with 5- or 15-bit offsets. All instructions are conditional, and most can
access any one of the 32 registers. Some registers, however, are singled out to support specific
addressing or to hold the condition for conditional instructions (if the condition is not automatically true).
The two .M functional units are dedicated for multiplies. The two .S and .L functional units perform a
general set of arithmetic, logical, and branch functions with results available every clock cycle.
The processing flow begins when a 256-bit-wide instruction fetch packet is fetched from a program
memory. The 32-bit instructions destined for the individual functional units are chained together by 1 bits
in the least significant bit (LSB) position of the instructions. The instructions that are chained together for
simultaneous execution (up to eight in total) compose an execute packet. A 0 in the LSB of an instruction
breaks the chain, effectively placing the instructions that follow it in the next execute packet. If an execute
packet crosses the fetch-packet boundary (256 bits wide), the assembler places it in the next fetch packet,
while the remainder of the current fetch packet is padded with NOP instructions. The number of execute
packets within a fetch packet can vary from one to eight. Execute packets are dispatched to their
respective functional units at the rate of one per clock cycle and the next 256-bit fetch packet is not
fetched until all the execute packets from the current fetch packet have been dispatched. After decoding,
the instructions simultaneously drive all active functional units for a maximum execution rate of eight
instructions every clock cycle. While most results are stored in 32-bit registers, they can be subsequently
moved to memory as bytes or half-words as well. All load and store instructions are byte, half-word, or
word addressable.
18
OVERVIEW
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src1
(A)
.L1
src2
dst
long dst
long src
8
8
32
LD1 32 MSB
ST1
32
long src
long dst
dst
(A)
.S1
src1
Data Path A
Register
File A
(A0−A15)
8
8
src2
(A)
.M1
dst
src1
src2
LD1 32 LSB
DA1
dst
src1
src2
.D1
2X
1X
DA2
src2
src1
dst
.D2
LD2 32 LSB
src2
(A)
.M2
src1
dst
src2
src1
.S2
dst
long dst
long src
Register
File B
(B0−B15)
(A)
Data Path B
8
8
32
LD2 32 MSB
ST2
long src
long dst
dst
(A)
.L2
src2
32
8
8
src1
Control
Register File
A.
In addition to fixed-point instructions, these functional units execute floating-point instructions.
Figure 4-1. 320C67x™ CPU (DSP Core) Data Paths
4.2
Memory Map Summary
Table 4-1 shows the memory map address ranges of the C6713/13B devices.
OVERVIEW
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Table 4-1. 320C6713/13B Memory Map Summary
(1)
20
MEMORY BLOCK DESCRIPTION
BLOCK SIZE (BYTES)
HEX ADDRESS RANGE
Internal RAM (L2)
192K
0000 0000 0002 FFFF
Internal RAM/Cache
64K
0003 0000 0003 FFFF
Reserved
24M – 256K
0004 0000 017F FFFF
External Memory Interface (EMIF) Registers
256K
0180 0000 0183 FFFF
L2 Registers
128K
0184 0000 0185 FFFF
Reserved
128K
0186 0000 0187 FFFF
HPI Registers
256K
0188 0000 018B FFFF
McBSP 0 Registers
256K
018C 0000 018F FFFF
McBSP 1 Registers
256K
0190 0000 0193 FFFF
Timer 0 Registers
256K
0194 0000 0197 FFFF
Timer 1 Registers
256K
0198 0000 019B FFFF
019C 0000 019C 01FF
Interrupt Selector Registers
512
Device Configuration Registers
4
019C 0200 019C 0203
Reserved
256K − 516
019C 0204 019F FFFF
EDMA RAM and EDMA Registers
256K
01A0 0000 01A3 FFFF
Reserved
768K
01A4 0000 01AF FFFF
GPIO Registers
16K
01B0 0000 01B0 3FFF
Reserved
240K
01B0 4000 01B3 FFFF
I2C0 Registers
16K
01B4 0000 01B4 3FFF
I2C1 Registers
16K
01B4 4000 01B4 7FFF
Reserved
16K
01B4 8000 01B4 BFFF
McASP0 Registers
16K
01B4 C000 01B4 FFFF
McASP1 Registers
16K
01B5 0000 01B5 3FFF
Reserved
160K
01B5 4000 01B7 BFFF
PLL Registers
8K
01B7 C000 01B7 DFFF
Reserved
264K
01B7 E000 01BB FFFF
Emulation Registers
256K
01BC 0000 01BF FFFF
Reserved
4M
01C0 0000 01FF FFFF
QDMA Registers
52
0200 0000 0200 0033
Reserved
16M − 52
0200 0034 02FF FFFF
Reserved
720M
0300 0000 2FFF FFFF
McBSP0 Data Port
64M
3000 0000 33FF FFFF
McBSP1 Data Port
64M
3400 0000 37FF FFFF
Reserved
64M
3800 0000 3BFF FFFF
McASP0 Data Port
1M
3C00 0000 3C0F FFFF
McASP1 Data Port
1M
3C10 0000 3C1F FFFF
Reserved
1G + 62M
3C20 0000 7FFF FFFF
EMIF CE0 (1)
256M
8000 0000 8FFF FFFF
EMIF CE1 (1)
256M
9000 0000 9FFF FFFF
EMIF CE2 (1)
256M
A000 0000 AFFF FFFF
EMIF CE3 (1)
256M
B000 0000 BFFF FFFF
Reserved
1G
C000 0000 FFFF FFFF
The number of EMIF address pins (EA[21:2]) limits the maximum addressable memory (SDRAM) to 128MB per CE space.
OVERVIEW
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4.3
L2 Memory Structure Expanded
Figure 4-2 shows the detail of the L2 memory structure.
L2 Mode
000
001
010
L2 Memory
011
Block Base Address
111
192K SRAM
208K SRAM
224K SRAM
240K SRAM
256K SRAM (All)
0x0000 0000
192K-Byte RAM
0x0003 0000
64K 4-Way Cache
48K 3-Way Cache
32K
2-Way Cache
16K
1-Way
Cache
16K-Byte RAM
0x0003 4000
16K-Byte RAM
0x0003 8000
16K-Byte RAM
0x0003 C000
16K-Byte RAM
0x0003 FFFF
Figure 4-2. L2 Memory Configuration
OVERVIEW
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4.4
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Peripheral Register Descriptions
Table 4-2 through Table 4-15 identify the peripheral registers for the C6713/C6713B devices by their
register names, acronyms, and hex address or hex address range. For more detailed information on the
register contents and bit names and their respective descriptions, see the specific peripheral reference
guide listed in the TMS320C6000 DSP Peripherals Overview Reference Guide (literature number
SPRU190).
Table 4-2. EMIF Registers
22
HEX ADDRESS RANGE
ACRONYM
0180 0000
GBLCTL
EMIF global control
REGISTER NAME
0180 0004
CECTL1
EMIF CE1 space control
0180 0008
CECTL0
EMIF CE0 space control
0180 000C
—
0180 0010
CECTL2
EMIF CE2 space control
0180 0014
CECTL3
EMIF CE3 space control
Reserved
0180 0018
SDCTL
EMIF SDRAM control
0180 001C
SDTIM
EMIF SDRAM refresh control
0180 0020
SDEXT
EMIF SDRAM extension
0180 0024−0183 FFFF
—
Reserved
OVERVIEW
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Table 4-3. L2 Cache Registers
HEX ADDRESS RANGE
ACRONYM
REGISTER NAME
0184 0000
CCFG
0184 4000
L2WBAR
Cache configuration
L2 writeback base address register
0184 4004
L2WWC
L2 writeback word count
0184 4010
L2WIBAR
L2 writeback-invalidate base address register
0184 4014
L2WIWC
L2 writeback-invalidate word count
0184 4020
L1PIBAR
L1P invalidate base address register
0184 4024
L1PIWC
L1P invalidate word count
0184 4030
L1DWIBAR
L1D writeback-invalidate base address register
0184 4034
L1DWIWC
L1D writeback-invalidate word count
0184 5000
L2WB
0184 5004
L2WBINV
0184 8200
MAR0
Memory attribute register 0. Controls CE0 range 8000 0000 80FF FFFF
0184 8204
MAR1
Memory attribute register 1. Controls CE0 range 8100 0000 81FF FFFF
0184 8208
MAR2
Memory attribute register 2. Controls CE0 range 8200 0000 82FF FFFF
0184 820C
MAR3
Memory attribute register 3. Controls CE0 range 8300 0000 83FF FFFF
0184 8240
MAR4
Memory attribute register 4. Controls CE1 range 9000 0000 90FF FFFF
0184 8244
MAR5
Memory attribute register 5. Controls CE1 range 9100 0000 91FF FFFF
L2 writeback all
L2 writeback-invalidate all
0184 8248
MAR6
Memory attribute register 6. Controls CE1 range 9200 0000 92FF FFFF
0184 824C
MAR7
Memory attribute register 7. Controls CE1 range 9300 0000 93FF FFFF
0184 8280
MAR8
Memory attribute register 8. Controls CE2 range A000 0000 A0FF FFFF
0184 8284
MAR9
Memory attribute register 9. Controls CE2 range A100 0000 A1FF FFFF
0184 8288
MAR10
Memory attribute register 10. Controls CE2 range A200 0000 A2FF FFFF
0184 828C
MAR11
Memory attribute register 11. Controls CE2 range A300 0000 A3FF FFFF
0184 82C0
MAR12
Memory attribute register 12. Controls CE3 range B000 0000 B0FF FFFF
0184 82C4
MAR13
Memory attribute register 13. Controls CE3 range B100 0000 B1FF FFFF
0184 82C8
MAR14
Memory attribute register 14. Controls CE3 range B200 0000 B2FF FFFF
0184 82CC
MAR15
Memory attribute register 15. Controls CE3 range B300 0000 B3FF FFFF
0184 82D0−0185 FFFF
—
Reserved
Table 4-4. Interrupt Selector Registers
HEX ADDRESS RANGE
ACRONYM
REGISTER NAME
COMMENTS
019C 0000
MUXH
Interrupt multiplexer high
Selects which interrupts drive CPU interrupts
10–15 (INT10−INT15)
019C 0004
MUXL
Interrupt multiplexer low
Selects which interrupts drive CPU interrupts
4−9 (INT04−INT09)
019C 0008
EXTPOL
External interrupt polarity
Sets the polarity of the external interrupts
(EXT_INT4−EXT_INT7)
019C 000C−019F FFFF
—
Reserved
OVERVIEW
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Table 4-5. Device Registers
HEX ADDRESS RANGE
ACRONYM
019C 0200
DEVCFG
019C 0204−019F FFFF
—
N/A
REGISTER NAME
COMMENTS
Allows the user to control peripheral
selection. This register also offers the user
control of the EMIF input clock source. For
more detailed information on the device
configuration register, see the Device
Configurations section of this data sheet.
Device configuration
Reserved
CSR
Identifies which CPU and defines the silicon
revision of the CPU. This register also offers
the user control of device operation. For more
detailed information on the CPU Control
Status Register, see the CPU CSR Register
description section of this data sheet.
CPU control status register
Table 4-6. EDMA Parameter RAM (1)
(1)
HEX ADDRESS RANGE
ACRONYM
REGISTER NAME
01A0 0000 01A0 0017
—
Parameters for Event 0 (6 words) or Reload/Link parameters for other event
01A0 0018 01A0 002F
—
Parameters for Event 1 (6 words) or Reload/Link parameters for other event
01A0 0030 01A0 0047
—
Parameters for Event 2 (6 words) or Reload/Link parameters for other event
01A0 0048 01A0 005F
—
Parameters for Event 3 (6 words) or Reload/Link parameters for other event
01A0 0060 01A0 0077
—
Parameters for Event 4 (6 words) or Reload/Link parameters for other event
01A0 0078 01A0 008F
—
Parameters for Event 5 (6 words) or Reload/Link parameters for other event
01A0 0090 01A0 00A7
—
Parameters for Event 6 (6 words) or Reload/Link parameters for other event
01A0 00A8 01A0 00BF
—
Parameters for Event 7 (6 words) or Reload/Link parameters for other event
01A0 00C0 01A0 00D7
—
Parameters for Event 8 (6 words) or Reload/Link parameters for other event
01A0 00D8 01A0 00EF
—
Parameters for Event 9 (6 words) or Reload/Link parameters for other event
01A0 00F0 01A0 00107
—
Parameters for Event 10 (6 words) or Reload/Link parameters for other event
01A0 0108 01A0 011F
—
Parameters for Event 11 (6 words) or Reload/Link parameters for other event
01A0 0120 01A0 0137
—
Parameters for Event 12 (6 words) or Reload/Link parameters for other event
01A0 0138 01A0 014F
—
Parameters for Event 13 (6 words) or Reload/Link parameters for other event
01A0 0150 01A0 0167
—
Parameters for Event 14 (6 words) or Reload/Link parameters for other event
01A0 0168 01A0 017F
—
Parameters for Event 15 (6 words) or Reload/Link parameters for other event
01A0 0180 01A0 0197
—
Reload/link parameters for Event 0−15
01A0 0198 01A0 01AF
—
Reload/link parameters for Event 0−15
...
...
...
01A0 07E0 01A0 07F7
—
Reload/link parameters for Event 0−15
01A0 07F8 01A0 07FF
—
Scratch pad area (two words)
The C6713/13B device has 85 EDMA parameters total: 16 Event/Reload parameters and 69 Reload-only parameters.
For more details on the EDMA parameter RAM six-word parameter entry structure, see Figure 4-3.
31
0
EDMA Parameter
Word 0
EDMA Channel Options Parameter (OPT)
OPT
Word 1
EDMA Channel Source Address (SRC)
SRC
Word 2
Word 3
Array/Frame Count (FRMCNT)
Element Count (ELECNT)
EDMA Channel Destination Address (DST)
CNT
DST
Word 4
Array/Frame Index (FRMIDX)
Element Index (ELEIDX)
IDX
Word 5
Element Count Reload (ELERLD)
Link Address (LINK)
RLD
Figure 4-3. EDMA Channel Parameter Entries (Six Words) for Each EDMA Event
24
OVERVIEW
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Table 4-7. EDMA Registers
HEX ADDRESS RANGE
ACRONYM
REGISTER NAME
01A0 0800−01A0 FEFC
—
01A0 FF00
ESEL0
EDMA event selector 0
01A0 FF04
ESEL1
EDMA event selector 1
01A0 FF08−01A0 FF0B
—
Reserved
Reserved
01A0 FF0C
ESEL3
01A0 FF1F−01A0 FFDC
—
EDMA event selector 3
01A0 FFE0
PQSR
Priority queue status register
01A0 FFE4
CIPR
Channel interrupt pending register
01A0 FFE8
CIER
Channel interrupt enable register
01A0 FFEC
CCER
Channel chain enable register
Reserved
01A0 FFF0
ER
01A0 FFF4
EER
Event register
Event enable register
01A0 FFF8
ECR
Event clear register
01A0 FFFC
ESR
Event set register
01A1 0000−01A3 FFFF
—
Reserved
Table 4-8. Quick DMA (QDMA) and Pseudo Registers (1)
HEX ADDRESS RANGE
(1)
ACRONYM
REGISTER NAME
0200 0000
QOPT
QDMA options parameter
0200 0004
QSRC
QDMA source address
0200 0008
QCNT
QDMA frame count
0200 000C
QDST
QDMA destination address
0200 0010
QIDX
QDMA index
0200 0014−0200 001C
—
Reserved
0200 0020
QSOPT
QDMA pseudo options
0200 0024
QSSRC
QDMA pseudo source address
0200 0028
QSCNT
QDMA pseudo frame count
0200 002C
QSDST
QDMA pseudo destination address
0200 0030
QSIDX
QDMA pseudo index
All the QDMA and Pseudo registers are write accessible only.
Table 4-9. PLL Controller Registers
HEX ADDRESS RANGE
ACRONYM
01B7 C000
PLLPID
01B7 C004−01B7 C0FF
—
01B7 C100
PLLCSR
REGISTER NAME
Peripheral identification
(C6713/13B value: 0x00010801 for PLL Controller)
Reserved
PLL control/status register
01B7 C104−01B7 C10F
—
01B7 C110
PLLM
01B7 C114
PLLDIV0
PLL controller divider 0
01B7 C118
PLLDIV1
PLL controller divider 1
01B7 C11C
PLLDIV2
PLL controller divider 2
01B7 C120
PLLDIV3
PLL controller divider 3
01B7 C124
OSCDIV1
Oscillator divider 1
01B7 C128−01B7 DFFF
—
Reserved
PLL multiplier control
Reserved
OVERVIEW
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Table 4-10. McASP0 and McASP1 Registers
HEX ADDRESS RANGE
26
ACRONYM
REGISTER NAME AND DESCRIPTION
3C10 0000−3C10 FFFF
RBUF/XBUFx
McASPx receive buffer or McASPx transmit buffer via the peripheral
data bus. Used when RSEL or XSEL bits = 0 (these bits are located
in the RFMT or XFMT registers, respectively).
01B4 C000
01B5 0000
MCASPPIDx
Peripheral identification
[13/13B value: 0x00100101 for McASP0 and for McASP1]
01B4 C004
01B5 0004
PWRDEMUx
Power down and emulation management
01B4 C008
01B5 0008
—
Reserved
01B4 C00C
01B5 000C
—
Reserved
01B4 C010
01B5 0010
PFUNCx
Pin function
01B4 C014
01B5 0014
PDIRx
Pin direction
01B4 C018
01B5 0018
PDOUTx
Pin data out
01B4 C01C
01B5 001C
PDIN/PDSETx
McASP0
McASP1
3C00 0000−3C00 FFFF
Pin data in/data set
Read returns: PDIN
Writes affect: PDSET
01B4 C020
01B5 0020
PDCLRx
01B4 C024−01B4 C040
01B5 0024−01B5 0040
—
Pin data clear
01B4 C044
01B5 0044
GBLCTLx
Global control
01B4 C048
01B5 0048
AMUTEx
Mute control
01B4 C04C
01B5 004C
DLBCTLx
Digital loopback control
01B4 C050
01B5 0050
DITCTLx
DIT mode control
01B4 C054−01B4 C05C
01B5 0054−01B5 005C
—
01B4 C060
01B5 0060
RGBLCTLx
01B4 C064
01B5 0064
RMASKx
01B4 C068
01B5 0068
RFMTx
01B4 C06C
01B5 006C
AFSRCTLx
01B4 C070
01B5 0070
ACLKRCTLx
01B4 C074
01B5 0074
AHCLKRCTLx
01B4 C078
01B5 0078
RTDMx
01B4 C07C
01B5 007C
RINTCTLx
01B4 C080
01B5 0080
RSTATx
Status − receiver
01B4 C084
01B5 0084
RSLOTx
Current receive TDM slot
01B4 C088
01B5 0088
RCLKCHKx
01B4 C08C−01B4 C09C
01B5 008C−01B5 009C
—
01B4 C0A0
01B5 00A0
XGBLCTLx
01B4 C0A4
01B5 00A4
XMASKx
01B4 C0A8
01B5 00A8
XFMTx
01B4 C0AC
01B5 00AC
AFSXCTLx
01B4 C0B0
01B5 00B0
ACLKXCTLx
01B4 C0B4
01B5 00B4
AHCLKXCTLx
01B4 C0B8
01B5 00B8
XTDMx
Transmit TDM slot 0−31
01B4 C0BC
01B5 00BC
XINTCTLx
Transmit interrupt control
01B4 C0C0
01B5 00C0
XSTATx
Status − transmitter
01B4 C0C4
01B5 00C4
XSLOTx
Current transmit TDM slot
01B4 C0C8
01B5 00C8
XCLKCHKx
01B4 C0D0−01B4 C0FC
01B5 00CC−01B5 00FC
—
01B4 C100
01B5 0100
DITCSRA0x
Left (even TDM slot) channel status register file
01B4 C104
01B5 0104
DITCSRA1x
Left (even TDM slot) channel status register file
01B4 C108
01B5 0108
DITCSRA2x
Left (even TDM slot) channel status register file
01B4 C10C
01B5 0108
DITCSRA3x
Left (even TDM slot) channel status register file
01B4 C110
01B5 0110
DITCSRA4x
Left (even TDM slot) channel status register file
Reserved
Reserved
Alias of GBLCTL containing only Receiver Reset bits; allows
transmit to be reset independently from receive
Receiver format unit bit mask
Receive bit stream format
Receive frame sync control
Receive clock control
High-frequency receive clock control
Receive TDM slot 0−31
Receiver interrupt control
Receiver clock check control
Reserved
Alias of GBLCTL containing only Transmitter Reset bits; allows
transmit to be reset independently from receive
Transmit format unit bit mask
Transmit bit stream format
Transmit frame sync control
Transmit clock control
High-frequency Transmit clock control
Transmit clock check control
Reserved
OVERVIEW
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Table 4-10. McASP0 and McASP1 Registers (continued)
HEX ADDRESS RANGE
(1)
(2)
ACRONYM
REGISTER NAME AND DESCRIPTION
McASP0
McASP1
01B4 C114
01B5 0114
DITCSRA5x
Left (even TDM slot) channel status register file
01B4 C118
01B5 0118
DITCSRB0x
Right (odd TDM slot) channel status register file
01B4 C11C
01B5 011C
DITCSRB1x
Right (odd TDM slot) channel status register file
01B4 C120
01B5 0120
DITCSRB2x
Right (odd TDM slot) channel status register file
01B4 C124
01B5 0124
DITCSRB3x
Right (odd TDM slot) channel status register file
01B4 C128
01B5 0128
DITCSRB4x
Right (odd TDM slot) channel status register file
01B4 C12C
01B5 012C
DITCSRB5x
Right (odd TDM slot) channel status register file
01B4 C130
01B5 0130
DITUDRA0x
Left (even TDM slot) user data register file
01B4 C134
01B5 0134
DITUDRA1x
Left (even TDM slot) user data register file
01B4 C138
01B5 0138
DITUDRA2x
Left (even TDM slot) user data register file
01B4 C13C
01B5 013C
DITUDRA3x
Left (even TDM slot) user data register file
01B4 C140
01B5 0140
DITUDRA4x
Left (even TDM slot) user data register file
01B4 C144
01B5 0144
DITUDRA5x
Left (even TDM slot) user data register file
01B4 C148
01B5 0148
DITUDRB0x
Right (odd TDM slot) user data register file
01B4 C14C
01B5 014C
DITUDRB1x
Right (odd TDM slot) user data register file
01B4 C150
01B5 0150
DITUDRB2x
Right (odd TDM slot) user data register file
01B4 C154
01B5 0154
DITUDRB3x
Right (odd TDM slot) user data register file
01B4 C158
01B5 0158
DITUDRB4x
Right (odd TDM slot) user data register file
01B4 C15C
01B5 015C
DITUDRB5x
Right (odd TDM slot) user data register file
01B4 C160−01B4 C17C
01B5 0160−01B5 017C
—
01B4 C180
01B5 0180
SRCTL0x
Serializer 0 control
01B4 C184
01B5 0184
SRCTL1x
Serializer 1 control
01B4 C188
01B5 0188
SRCTL2x
Serializer 2 control
01B4 C18C
01B5 018C
SRCTL3x
Serializer 3 control
01B4 C190
01B5 0190
SRCTL4x
Serializer 4 control
01B4 C194
01B5 0194
SRCTL5x
Serializer 5 control
01B4 C198
01B5 0198
SRCTL6x
Serializer 6 control
01B4 C19C
01B5 019C
SRCTL7x
Serializer 7 control
01B4 C1A0−01B4 C1FC
01B5 01A0−01B5 01FC
—
01B4 C200
01B5 0200
XBUF0x
Transmit buffer for serializer 0 through configuration bus (1)
01B4 C204
01B5 0204
XBUF1x
Transmit buffer for serializer 1 through configuration bus (1)
01B4 C208
01B5 0208
XBUF2x
Transmit buffer for serializer 2 through configuration bus (1)
01B4 C20C
01B5 020C
XBUF3x
Transmit buffer for serializer 3 through configuration bus (1)
01B4 C210
01B5 0210
XBUF4x
Transmit buffer for serializer 4 through configuration bus (1)
01B4 C214
01B5 0214
XBUF5x
Transmit buffer for serializer 5 through configuration bus (1)
01B4 C218
01B5 0218
XBUF6x
Transmit buffer for serializer 6 through configuration bus (1)
01B4 C21C
01B5 021C
XBUF7x
Transmit buffer for serializer 7 through configuration bus (1)
01B4 C220−01B4 C27C
01B5 C220−01B5 027C
—
01B4 C280
01B5 0280
RBUF0x
Receive buffer for serializer 0 through configuration bus (2)
01B4 C284
01B5 0284
RBUF1x
Receive buffer for serializer 1 through configuration bus (2)
01B4 C288
01B5 0288
RBUF2x
Receive buffer for serializer 2 through configuration bus (2)
01B4 C28C
01B5 028C
RBUF3x
Receive buffer for serializer 3 through configuration bus (2)
01B4 C290
01B5 0290
RBUF4x
Receive buffer for serializer 4 through configuration bus (2)
01B4 C294
01B5 0294
RBUF5x
Receive buffer for serializer 5 through configuration bus (2)
Reserved
Reserved
Reserved
01B4 C298
01B5 0298
RBUF5x
Receive buffer for serializer 6 through configuration bus (2)
01B4 C29C
01B5 029C
RBUF7x
Receive buffer for serializer 7 through configuration bus (2)
01B4 C2A0−01B4 FFFF
01B5 02A0−01B5 3FFF
—
Reserved
The transmit buffers for serializers 0−7 are accessible to the CPU via the peripheral bus if the XSEL bit = 1 (XFMT register).
The receive buffers for serializers 0−7 are accessible to the CPU via the peripheral bus if the RSEL bit = 1 (RFMT register).
OVERVIEW
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Table 4-11. I2C0 and I2C1 Registers
HEX ADDRESS RANGE
ACRONYM
REGISTER NAME AND DESCRIPTION
I2C0
I2C1
01B4 0000
01B4 4000
I2COARx
I2Cx own address register
01B4 0004
01B4 4004
I2CIERx
I2Cx interrupt enable register
01B4 0008
01B4 4008
I2CSTRx
I2Cx interrupt status register
01B4 000C
01B4 400C
I2CCLKLx
I2Cx clock low-time divider
01B4 0010
01B4 4010
I2CCLKHx
I2Cx clock high-time divider
01B4 0014
01B4 4014
I2CCNTx
I2Cx data count
01B4 0018
01B4 4018
I2CDRRx
I2Cx data receive register
01B4 001C
01B4 401C
I2CSARx
I2Cx slave address register
01B4 0020
01B4 4020
I2CDXRx
I2Cx data transmit register
01B4 0024
01B4 4024
I2CMDRx
I2Cx mode register
01B4 0028
01B4 4028
I2CISRCx
I2Cx interrupt source
01B4 002C
01B4 402C
—
01B4 0030
01B4 4030
I2CPSCx
I2Cx prescaler
01B4 0034
01B4 4034
I2CPID10
I2CPID11
I2Cx peripheral identification 1
(C6713/13B value: 0x0000 0103)
01B4 0038
01B4 4038
I2CPID20
I2CPID21
I2Cx peripheral identification 2
(C6713/13B value: 0x0000 0005)
01B4 003C−01B4 3FFF
01B4 403C−01B4 7FFF
—
Reserved
Reserved
Table 4-12. HPI Registers
HEX ADDRESS RANGE
ACRONYM
—
HPID
HPI data register
REGISTER NAME
Host read/write access only
COMMENTS
—
HPIA
HPI address register
Host read/write access only
0188 0000
HPIC
HPI control register
Both Host/CPU read/write access
0188 0004−018B FFFF
—
Reserved
Table 4-13. Timer 0 and Timer 1 Registers
HEX ADDRESS RANGE
ACRONYM
REGISTER NAME
COMMENTS
TIMER 0
TIMER 1
0194 0000
0198 0000
CTLx
Timer x control register
Determines the operating mode of the
timer, monitors the timer status, and
controls the function of the TOUT pin.
0194 0004
0198 0004
PRDx
Timer x period register
Contains the number of timer input
clock cycles to count. This number
controls the TSTAT signal frequency.
0194 0008
0198 0008
CNTx
Timer x counter register
Contains the current value of the
incrementing counter.
0194 000C−0197 FFFF
0198 000C−019B FFFF
—
Reserved
Table 4-14. McBSP0 and McBSP1 Registers
HEX ADDRESS RANGE
28
ACRONYM
REGISTER NAME AND DESCRIPTION
McBSP0
McBSP1
018C 0000
0190 0000
DRRx
McBSPx data receive register via configuration bus.
The CPU and EDMA controller can only read this register; they
cannot write to it.
3000 0000−33FF FFFF
3400 0000−37FF FFFF
DRRx
McBSPx data receive register via peripheral data bus
018C 0004
0190 0004
DXRx
McBSPx data transmit register via configuration bus
3000 0000−33FF FFFF
3400 0000−37FF FFFF
DXRx
McBSPx data transmit register via peripheral data bus
018C 0008
0190 0008
SPCRx
018C 000C
0190 000C
RCRx
McBSPx serial port control register
McBSPx receive control register
OVERVIEW
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Table 4-14. McBSP0 and McBSP1 Registers (continued)
HEX ADDRESS RANGE
ACRONYM
REGISTER NAME AND DESCRIPTION
McBSP0
McBSP1
018C 0010
0190 0010
XCRx
018C 0014
0190 0014
SRGRx
018C 0018
0190 0018
MCRx
McBSPx multichannel control register
018C 001C
0190 001C
RCERx
McBSPx receive channel enable register
018C 0020
0190 0020
XCERx
McBSPx transmit channel enable register
018C 0024
0190 0024
PCRx
018C 0028−018F FFFF
0190 0028−0193 FFFF
—
McBSPx transmit control register
McBSPx sample rate generator register
McBSPx pin control register
Reserved
Table 4-15. GPIO Registers
HEX ADDRESS RANGE
ACRONYM
01B0 0000
GPEN
GPIO enable
REGISTER NAME
01B0 0004
GPDIR
GPIO direction
01B0 0008
GPVAL
GPIO value
01B0 000C
—
01B0 0010
GPDH
GPIO delta high
01B0 0014
GPHM
GPIO high mask
01B0 0018
GPDL
GPIO delta low
01B0 001C
GPLM
GPIO low mask
01B0 0020
GPGC
GPIO global control
01B0 0024
GPPOL
GPIO interrupt polarity
01B0 0028−01B0 3FFF
—
Reserved
Reserved
OVERVIEW
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Signal Groups Description
CLKIN
CLKOUT2/GP[2]
CLKOUT3
CLKMODE0
PLLHV
TMS
TDO
TDI
TCK
TRST
EMU0
EMU1
(A)
EMU2
(A)
EMU3
(A)
EMU4
(A)
EMU5
Clock/PLL
Oscillator
RESET
NMI
(B)(C)
GP[7](EXT_INT7)
(B)(C)
GP[6](EXT_INT6)
(B)(C)
GP[5](EXT_INT5)/AMUTEIN0
(B)(C)
GP[4](EXT_INT4)/AMUTEIN1
HD4/GP[0](B)
Reset and
Interrupts
IEEE Standard
1149.1
(JTAG)
Emulation
Control/Status
HD15/GP[15]
HD14/GP[14]
HD13/GP[13]
HD12/GP[12]
HD11/GP[11]
HD10/GP[10]
HD9/GP[9]
HD8/GP[8]
HD7/GP[3]
HD6/AHCLKR1
HD5/AHCLKX1
HD4/GP[0]
HD3/AMUTE1
HD2/AFSX1
HD1/AXR1[7]
HD0/AXR1[4]
A.
B.
C.
D.
HPI
(Host-Port Interface)
HAS/ACLKX1
HR/W/AXR1[0]
HCS/AXR1[2]
HDS1/AXR1[6]
HDS2/AXR1[5]
HRDY/ACLKR1
HINT/GP[1]
Control
Data
Register Select
Half-Word
Select
HCNTL0/AXR1[3]
HCNTL1/AXR1[1]
HHWIL/AFSR1
These external pins are applicable to the GDP package only.
The GP[15:0] pins, through interrupt sharing, are external interrupt capable via GPINT0. For more details, see the
external interrupt sources section of this data sheet. For more details on interrupt sharing, see the TMS320C6000
DSP Interrupt Selector Reference Guide (literature number SPRU646).
All of these pins are external interrupt sources. For more details see the External Interrupt Sources section of this
data sheet.
On multiplexed pins, boldface text denotes the active function of the pin for that particular peripheral module.
Figure 4-4. CPU (DSP Core) and Peripheral Signals
30
OVERVIEW
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HD15/GP[15]
HD14/GP[14]
HD13/GP[13]
HD12/GP[12]
HD11/GP[11]
HD10/GP[10]
HD9/GP[9]
HD8/GP[8]
GP[7](EXT_INT7)
GP[6](EXT_INT6)
GP[5](EXT_INT5)/AMUTEIN0
GP[4](EXT_INT4)/AMUTEIN1
HD7/GP[3]
CLKOUT2/GP[2]
HINT/GP[1]
HD4/GP[0]
(A)
GPIO
General-Purpose Input/Output (GPIO) Port
TOUT1/AXR0[4]
TINP1/AHCLKX0
Timer 0
Timer 1
TOUT0/AXR0[2]
TINP0/AXR0[3]
Timers
CLKS1/SCL1
DR1/SDA1
I2C1
I2C0
SCL0
SDA0
2
I Cs
A.
B.
The GP[15:0} pins, through interrupt sharing, are external interrupt capable via GPINT0. GP[15:0] are also external
EDMA event source capable. For more details, see the External Interrupt Sources and External EDMA Event Sources
sections of this data sheet.
On multiplexed pins, boldface text denotes the active function of the pin for that particular peripheral module.
Figure 4-5. Peripheral Signals
OVERVIEW
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(A)
ED[31:16]
CE3
CE2
CE1
CE0
EA[21:2]
ECLKIN
ECLKOUT
ARE/SDCAS/SSADS
16
16
ED[15:0]
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Data
Memory
Control
AOE/SDRAS/SSOE
AWE/SDWE/SSWE
ARDY
Memory Map
Space Select
20
Address
HOLD
HOLDA
BUSREQ
Bus
Arbitration
(A)
BE3
(A)
BE2
BE1
BE0
Byte Enables
EMIF
(External Memory Interface)
McBSP1
McBSP0
CLKX1/AMUTE0
FSX1
DX1/AXR0[5]
Transmit
Transmit
CLKX0/ACLKX0
FSX0/AFSX0
DX0/AXR0[1]
CLKR1/AXR0[6]
FSR1/AXR0[7]
DR1/SDA1
Receive
Receive
CLKR0/ACLKR0
FSR0/AFSR0
DR0/AXR0[0]
Clock
Clock
CLKS1/SCL1
CLKS0/AHCLKR0
McBSPs
(Multichannel Buffered Serial Ports)
A.
B.
These external pins are applicable to the GDP package only.
On multiplexed pins, boldface text denotes the active function of the pin for that particular peripheral module.
Figure 4-6. Peripheral Signals
32
OVERVIEW
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(Transmit/Receive Data Pins)
FSR1/AXR0[7]
CLKR1/AXR0[6]
DX1/AXR0[5]
TOUT1/AXR0[4]
TINP0/AXR0[3]
TOUT0/AXR0[2]
DX0/AXR0[1]
DR0/AXR0[0]
8-Serial Ports
Flexible
Partitioning
Tx, Rx, OFF
(Receive Bit Clock)
CLKR0/ACLKR0
CLKS0/AHCLKR0
(Transmit Bit Clock)
Receive Clock
Generator
Transmit
Clock
Generator
(Receive Master Clock)
CLKX0/ACLKX0
TINP1/AHCLKX0
(Transmit Master Clock)
Receive Clock
Check Circuit
Transmit
Clock Check
Circuit
Receive
Frame Sync
Transmit
Frame Sync
FSR0/AFSR0
(Receive Frame Sync or
Left/Right Clock)
Error Detect
(see Note A)
Auto Mute
Logic
FSX0/AFSX0
(Transmit Frame Sync or
Left/Right Clock)
CLKX1/AMUTE0
GP[5](EXT_INT5)/AMUTEIN0
McASP0
(Multichannel Audio Serial Port 0)
A.
B.
C.
The McASP Error Detect function detects underruns, overruns, early/late frame syncs, DMA errors, and external mute
input.
On multiplexed pins, boldface text denotes the active function of the pin for that particular peripheral module.
Boldface and italicized text within parentheses denotes the function of the pins in an audio system.
Figure 4-7. Peripheral Signals
OVERVIEW
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(Transmit/Receive Data Pins)
HD1/AXR1[7]
HDS1/AXR1[6]
HDS2/AXR1[5]
HD0/AXR1[4]
HCNTL0/AXR1[3]
HCS/AXR1[2]
HCNTL1/AXR1[1]
HR/W/AXR1[0]
8-Serial Ports
Flexible
Partitioning
Tx, Rx, OFF
(Receive Bit Clock)
HRDY/ACLKR1
HD6/AHCLKR1
(Transmit Bit Clock)
Receive Clock
Generator
Transmit
Clock
Generator
(Receive Master Clock)
HHWIL/AFSR1
(Receive Frame Sync or
Left/Right Clock)
HAS/ACLKX1
HD5/AHCLKX1
(Transmit Master Clock)
Receive Clock
Check Circuit
Transmit
Clock Check
Circuit
Receive
Frame Sync
Transmit
Frame Sync
Error Detect
(see Note A)
Auto Mute
Logic
HD2/AFSX1
(Transmit Frame Sync or
Left/Right Clock)
HD3/AMUTE1
GP[4](EXT_INT4)/AMUTEIN1
McASP1
(Multichannel Audio Serial Port 1)
A.
B.
C.
The McASP Error Detect function detects underruns, overruns, early/late frame syncs, DMA errors, and external mute
input.
On multiplexed pins, boldface text denotes the active function of the pin for that particular peripheral module.
Boldface and italicized text within parentheses denotes the function of the pins in an audio system.
Figure 4-8. Peripheral Signals
34
OVERVIEW
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5
DEVICE CONFIGURATIONS
On the C6713/13B devices, bootmode and certain device configurations/peripheral selections are
determined at device reset, while other device configurations/peripheral selections are
software-configurable via the device configurations register (DEVCFG) [address location 0x019C0200]
after device reset.
5.1
Device Configurations at Device Reset
Table 5-1 describes the C6713 and C6713B device configuration pins, which are set up via internal or
external pullup/pulldown resistors through the HPI data pins (HD[4:3], HD8, HD12 [13B only]), and
CLKMODE0 pin. These configuration pins must be in the desired state until reset is released. For proper
device operation, do not oppose the HD [13, 11:9, 7, 1, 0] pins with external pullups/pulldowns at reset.
For more details on these device configuration pins, see the Terminal Functions table and the Debugging
Considerations section of this data sheet.
Table 5-1. Device Configurations Pins at Device Reset (HD[4:3], HD8, HD12 [13B only], and CLKMODE0) (1)
CONFIGURATION
PIN
GDP
FUNCTIONAL DESCRIPTION
EMIF Big Endian mode correctness (EMIFBE) [C6713B only]
For a C6713BGDP:
HD12 (2)
0–
The EMIF data will always be presented on the ED[7:0] side of the bus, regardless of the
endianess mode (Little/Big Endian).
1–
In Little Endian mode (HD8 = 1), the 8-bit or 16-bit EMIF data will be present on the
ED[7:0] side of the bus.
In Big Endian mode (HD8 = 0), the 8-bit or 16-bit EMIF data will be present on the
ED[31:24] side of the bus [default].
C15
For a C6713BPYP, when Big Endian mode is selected (LENDIAN = 0), for proper device operation the
EMIFBE pin must be externally pulled low.
This enhancement is not supported on the C6713 device.
For proper C6713 device operation, do not oppose the internal pullup (IPU) resistor on this pin.
This new functionality does not affect systems using the current default value of HD12 = 1. For more
detailed information on the big endian mode correctness, see the EMIF Big Endian Mode Correctness
[C6713B only] portion of this data sheet.
Device Endian mode (LEND)
HD8
B17
0–
System operates in Big Endian mode
1–
System operates in Little Endian mode (default)
Bootmode Configuration pins (BOOTMODE)
HD[4:3]
(BOOTMODE) (2)
C19, C20
00 –
HPI boot/Emulation boot
01 –
CE1 width 8-bit, asynchronous external ROM boot with default timings (default mode)
10 –
CE1 width 16-bit, asynchronous external ROM boot with default timings
11 –
CE1 width 32-bit, asynchronous external ROM boot with default timings
For more detailed information on these bootmode configurations, see the Bootmode section of this
data sheet.
Clock generator input clock source select
CLKMODE0
C4
0–
Reserved. Do not use.
1–
CLKIN square wave [default]
This pin must be pulled to the correct level even after reset.
(1)
(2)
All other HD pins [HD [15, 13:9, 7:5, 2:0] (for 13) or HD [15, 13, 11:9, 7:5, 2:0] (for 13B)] have pullups/pulldowns (IPUs or IPDs). For
proper device operation of the HD [15, 13:9, 7, 1, 0] (for 13) or HD [13, 11:9, 7, 1, 0] (for 13B), do not oppose these pins with external
pullups/pulldowns at reset; however, the HD[6, 5, 2] (for 13) or HD[15, 6, 5, 2] (for 13B) pins can be opposed and driven during reset.
IPD = Internal pulldown, IPU = Internal pullup. To oppose the supply rail on these IPD/IPU signal pins, use external pullup or pulldown
resistors no greater than 4.4 kΩ and 2.0 kΩ, respectively.
DEVICE CONFIGURATIONS
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Peripheral Pin Selection at Device Reset
Some C6713/13B peripherals share the same pins (internally MUXed) and are mutually exclusive (that is,
HPI, general-purpose input/output pins GP[15:8, 3, 1, 0], and McASP1).
• HPI, McASP1, and GPIO peripherals
The HPI_EN (HD14 pin) is latched at reset. This pin selects whether the HPI peripheral pins or
McASP1 peripheral pins and GP[15:8, 3, 1, 0] pins are functionally enabled (see Table 5-2).
Table 5-2. HPI_EN (HD14 Pin) Peripheral Selection (HPI or McASP1, and Select GPIO Pins) (1)
PERIPHERAL
PIN SELECTION
PERIPHERAL
PINS SELECTED
HPI_EN
(HD14 Pin) [173, C14]
HPI
HPI_EN = 1
HPI pins are enabled; McASP1 peripheral pins and GP[15:8, 3, 1, 0] pins
are disabled [default]. All multiplexed HPI/McASP1 and HPI/GPIO pins
function as HPI pins.
✓
1
5.3
HPI_EN = 0
HPI pins are disabled; McASP1 peripheral pins and GP[15:8, 3, 1, 0] pins
are enabled. All multiplexed HPI/McASP1 and HPI/GPIO pins function as
McASP1 and GPIO pins, respectively. To use the GPIO pins, the
appropriate bits in the GPEN and GPDIR registers need to be configured.
✓
0
(1)
DESCRIPTION
McASP1 and
GP[15:8, 3, 1, 0]
The HPI_EN (HD[14]) pin cannot be controlled via software.
Peripheral Selection/Device Configurations Via the DEVCFG Control Register
The device configuration register (DEVCFG) allows the user to control the pin availability of the McBSP0,
McBSP1, McASP0, I2C1, and timer peripherals. The DEVCFG register also offers the user control of the
EMIF input clock source and the timer output pins. For more detailed information on the DEVCFG register
control bits, see Table 5-3 and Table 5-4.
Table 5-3. Device Configuration Register (DEVCFG) [Address Location: 0x019C0200−0x019C02FF]
31
16
Reserved (1)
R/W-0
15
4
3
2
1
0
Reserved (1)
5
EKSRC
TOUT1SEL
TOUT0SEL
MCBSP0DIS
MCBSP1DIS
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
LEGEND: R = Read, W = Write, --n = value at reset
(1)
36
Do not write non-zero values to these bit locations.
DEVICE CONFIGURATIONS
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Table 5-4. Device Configuration Register (DEVCFG) Selection Bit Descriptions
BIT NO.
NAME
31:5
Reserved
DESCRIPTION
Reserved. Do not write non-zero values to these bit locations.
EMIF input clock source bit.
Determines which clock signal is used as the EMIF input clock.
4
EKSRC
0 = SYSCLK3 (from the clock generator) is the EMIF input clock source (default).
1 = ECLKIN external pin is the EMIF input clock source.
Timer 1 output (TOUT1) pin function select bit.
Selects the pin function of the TOUT1/AXR0[4] external pin independent of the rest of the peripheral
selection bits in the DEVCFG register.
3
TOUT1SEL
0 = The pin functions as a Timer 1 output (TOUT1) pin (default).
1 = The pin functions as the McASP0 transmit/receive data pin 4 (AXR0[4]). The Timer 1 module
is still active.
Timer 0 output (TOUT0) pin function select bit.
Selects the pin function of the TOUT0/AXR0[2] external pin independent of the rest of the peripheral
selection bits in the DEVCFG register.
2
TOUT0SEL
0 = The pin functions as a Timer 0 output (TOUT0) pin (default).
1 = The pin functions as the McASP0 transmit/receive data pin 2 (AXR0[2]). The Timer 0 module
is still active.
Multichannel Buffered Serial Port 0 (McBSP0) disable bit.
Selects whether McBSP0 or the McASP0 multiplexed peripheral pins are enabled or disabled.
1
MCBSP0DIS
0 = McBSP0 peripheral pins are enabled, McASP0 peripheral pins (AHCLKR0, ACLKR0,
ACLKX0, AXR0[0], AXR0[1], AFSR0, and AFSX0) are disabled (default).
If the McASP0 data pins are available, the McASP0 peripheral is functional for DIT mode only.
1 = McBSP0 peripheral pins are disabled, McASP0 peripheral pins (AHCLKR0, ACLKR0,
ACLKX0, AXR0[0], AXR0[1], AFSR0, and AFSX0) are enabled.
Multichannel Buffered Serial Port 1 (McBSP1) disable bit.
Selects whether McBSP1 or I2C1 and McASP0 multiplexed peripheral pins are enabled or disabled.
0
MCBSP1DIS
0 = McBSP1 peripheral pins are enabled, I2C1 peripheral pins (SCL1 and SDA1) and McASP0
peripheral pins (AXR0[7:5] and AMUTE0) are disabled (default)
1 = McBSP1 peripheral pins are disabled, I2C1 peripheral pins (SCL1 and SDA1) and McASP0
peripheral pins (AXR0[7:5] and AMUTE0) are enabled.
5.4
Multiplexed Pins
Multiplexed (MUXed) pins are pins that are shared by more than one peripheral and are internally
multiplexed. Most of these pins are configured by software via the device configuration register
(DEVCFG), and the others (specifically, the HPI pins) are configured by external pullup/pulldown resistors
only at reset. The MUXed pins that are configured by software can be programmed to switch
functionalities at any time. The MUXed pins that are configured by external pullup/pulldown resistors are
mutually exclusive; only one peripheral has primary control of the function of these pins after reset.
Table 5-5 summarizes the peripheral pins affected by the HPI_EN (HD14 pin) and DEVCFG register.
Table 5-6 identifies the multiplexed pins on the C6713/13B devices, shows the default (primary) function
and the default settings after reset, and describes the pins, registers, etc., necessary to configure the
specific multiplexed functions.
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Table 5-5. Peripheral Pin Selection Matrix (1)
SELECTION BITS
BIT
NAME
BIT
VAL
PERIPHERAL PIN AVAILABILITY
MCASP0
(2)
MCASP1
HPI_EN
(boot config
pin)
0
AHCLKX1
AHCLKR1
ACLKX1
ACLKR1
AFSX1
AFSR1
AMUTE1
AXR1[0]
to
AXR1[7]
HPI_EN
(boot config
pin)
1
None
2
I C0
2
I C1
MCBSP0
MCBSP1
TIMER0
0
None
1
ACLKX0
ACLKR0
AFSX0
AFSR0
AHCLKR
0
AXR0[0]
AXR0[1]
0
NO
AMUTE0
AXR0[5]
AXR0[6]
AXR0[7]
None
All
1
AMUTE0
AXR0[5]
AXR0[6]
AXR0[7]
All
None
TOUT0SEL
(DEVCFG
bit)
0
NO
AXR0[2]
TOUT0
1
AXR0[2]
NO
TOUT0
TOUT1SEL
(DEVCFG
bit)
0
NO
AXR0[4]
1
AXR0[4]
MCBSP0DI
S (DEVCFG
bit)
MCBSP1DI
S (DEVCFG
bit)
HD12 (boot
config pin)
[13BGDP] (3)
(1)
(2)
(3)
TIMER1
HPI
GPIO
PINS
None
GP[0:1],
GP[3],
GP[8:15]
abc
Plus:
GP[2]
ctrl’d by
GP2EN bit
All
EMIF
NO
GP[0:1],
GP[3],
GP[8:15]
All
None
TOUT1
NO
TOUT1
0
ED[7:0];
HD8 = 1/0
1
ED[7:0} side
[HD8 = 1 (Little)]
ED[31:24] side
[HD8 = 0 (Big)]
Gray blocks indicate that the peripheral is not affected by the selection bit.
The McASP0 pins, AXR0[3] and AHCLKX0, are shared with the timer input pins, TINP0 and TINP1, respectively. See Table 5-6 for
more detailed information.
For more detailed information on endianness correction, see the EMIF Big Endian Mode Correctness [C6713B only] section of this data
sheet.
Table 5-6. C6713/13B Device Multiplexed/Shared Pins
MULTIPLEXED PIN
NAME
GDP
CLKOUT2/GP[2]
DEFAULT
FUNCTION
Y12 CLKOUT2
DEFAULT SETTING
DESCRIPTION
GP2EN = 0 (GPEN register bit)
GP[2] function disabled, CLKOUT2
enabled
When the CLKOUT2 pin is enabled, the CLK2EN bit in the
EMIF global control register (GBLCTL) controls the
CLKOUT2 pin.
CLK2EN = 0: CLKOUT2 held high
CLK2EN = 1: CLKOUT2 enabled to clock [default].
38
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Table 5-6. C6713/13B Device Multiplexed/Shared Pins (continued)
MULTIPLEXED PIN
NAME
GP[5](EXT_INT5)/AMUTEIN
0
GP[4](EXT_INT4)/AMUTEIN
1
GDP
DEFAULT
FUNCTION
C1 GP[5](EXT_INT5)
C2 GP[4](EXT_INT4)
DEFAULT SETTING
No Function
GPxDIR = 0 (input)
GP5EN = 0 (disabled)
GP4EN = 0 (disabled)
[(GPEN register bits)
GP[x] function disabled]
DESCRIPTION
To use these software-configurable GPIO pins, the
GPxEN bits in the GP Enable Register and the GPxDIR
bits in the GP Direction Register must be properly
configured.
GPxEN = 1:
GP[x] pin enabled.
GPxDIR = 0:
GP[x] pin is an input.
GPxDIR = 1:
GP[x] pin is an output.
To use AMUTEIN0/1 pin function, the GP[5]/GP[4] pins
must be configured as an input, the INEN bit set to 1, and
the polarity through the INPOL bit selected in the
associated McASP AMUTE register.
CLKS0/AHCLKR0
K3
DR0/AXR0[0]
J1
DX0/AXR0[1]
H2
FSR0/AFSR0
J3 McBSP0 pin function
FSX0/AFSX0
H1
CLKR0/ACLKR0
H3
CLKX0/ACLKX0
G3
CLKS1/SCL1
E1
DR1/SDA1
M2
DX1/AXR0[5]
L2
FSR1/AXR0[7]
M3
CLKR1/AXR0[6]
M1
CLKX1/AMUTE0
HINT/GP[1]
McBSP1 pin function
MCBSP0DIS = 0
(DEVCFG register bit)
McASP0 pins disabled,
McBSP0 pins enabled
MCBSP1DIS = 0
(DEVCFG register bit)
I2C1 and McASP0 pins
disabled, McBSP1 pins enabled
By default, McBSP0 peripheral pins are enabled upon
reset (McASP0 pins are disabled).
abc
To enable the McASP0 peripheral pins, the MCBSP0DIS
bit in the DEVCFG register must be set to 1 (disabling the
McBSP0 peripheral pins).
By default, McBSP1 peripheral pins are enabled upon
reset (I2C1 and McASP0 pins are disabled).
abc
To enable the I2C1 and McASP0 peripheral pins, the
MCBSP1DIS bit in the DEVCFG register must be set to 1
(disabling the McBSP1 peripheral pins).
L3
J20
HD15/GP[15]
B14
HD14/GP[14]
C14
HD13/GP[13]
A15
HD12/GP[12]
C15
HD11/GP[11]
A16
HD10/GP[10]
B16
HD9/GP[9]
C16
HD8/GP[8]
B17
By default, the HPI peripheral pins are enabled at reset.
McASP1 peripheral pins and eleven GPIO pins are
disabled.
To enable the McASP1 peripheral pins and the eleven
GPIO pins, an external pulldown resistor must be provided
on the HD14 pin setting HPI_EN = 0 at reset.
HD7/GP[3]
A18
HD4/GP[0]
C19
HD1/AXR1[7]
D20
HD0/AXR1[4]
HCNTL1/AXR1[1]
E20 HPI
G19 pin function
HCNTL0/AXR1[3]
G18
GPxEN = 1:
GP[x] pin enabled.
HR/W/AXR1[0]
G20
GPxDIR = 0:
GP[x] pin is an input.
HDS1/AXR1[6]
E19
GPxDIR = 1:
GP[x] pin is an output.
HDS2/AXR1[5]
F18
HCS/AXR1[2]
F20
HD6/AHCLKR1
C17
HD5/AHCLKX1
B18
HD3/AMUTE1
C20
HD2/AFSX1
D18
HHWIL/AFSR1
H20
HRDY/ACLKR1
H19
HAS/ACLKX1
E18
HPI_EN (HD14 pin) = 1
(HPI enabled)
McASP1 pins and 11 GPIO pins
are disabled.
GP enable register and the GPxDIR bits in the GP
direction register must be properly configured. To use
these software-configurable GPIO pins, the GPxEN bits in
the
McASP1 pin direction is controlled by the PDIR[x] bits in
the McASP1PDIR register.
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Table 5-6. C6713/13B Device Multiplexed/Shared Pins (continued)
MULTIPLEXED PIN
NAME
DEFAULT
FUNCTION
GDP
TINP0/AXR0[3]
TOUT0/AXR0[2]
G2
G1
Timer 0
input function
Timer 0
output function
DEFAULT SETTING
McASP0PDIR = 0 (input)
[specifically AXR0[3] bit]
TOUT0SEL = 0 (DEVCFG register
bit) [TOUT0 pin enabled and
McASP0 AXR0[2] pin disabled]
DESCRIPTION
By default, the Timer 0 input pin is enabled (and a shared
input until the McASP0 peripheral forces an output).
abc
McASP0PDIR = 0 input, = 1 output
By default, the Timer 0 output pin is enabled.
abc
To enable the McASP0 AXR0[2] pin, the TOUT0SEL bit in
the DEVCFG register must be set to 1 (disabling the
Timer 0 peripheral output pin function).
abc
The AXR2 bit in the McASP0PDIR register controls the
direction (input/output) of the AXR0[2] pin.
McASP0PDIR = 0 input, = 1 output
TINP1/AHCLKX0
TOUT1/AXR0[4]
Timer 1
F2
input function
F1
Timer 1
output function
McASP0PDIR = 0 (input)
[specifically AHCLKX bit]
TOUT1SEL = 0 (DEVCFG register
bit) [TOUT1 pin enabled and
McASP0 AXR0[4] pin disabled]
By default, the Timer 1 input and McASP0 clock function
are enabled as inputs.
abc
For the McASP0 clock to function as an output:
McASP0PDIR = 1 (specifically the AHCLKX bit).
By default, the Timer 1 output pin is enabled.
abc
To enable the McASP0 AXR0[4] pin, the TOUT1SEL bit in
the DEVCFG register must be set to 1 (disabling the
Timer 1 peripheral output pin function).
abc
The AXR4 bit in the McASP0PDIR register controls the
direction (input/output) of the AXR0[4] pin.
McASP0PDIR = 0 input, = 1 output
40
DEVICE CONFIGURATIONS
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5.5
Configuration Examples
Figure 5-1 through Figure 5-6 illustrate examples of peripheral selections that are configurable on this
device.
ED [31:16],
ED[15:0]
EA[21:2]
32
20
EMIF
CE[3:0], BE[3:0],
HOLDA, HOLD,
BUSREQ, ECLKIN,
ECLKOUT,
ARE/SDCAS/SSADS,
AWE/SDWE/SSWE,
AOE/SDRAS/SSOE,
ARDY
CLKIN, CLKOUT3, CLKMODE0,
PLLHV, TMS, TDO, TDI, TCK,
TRST, EMU[5:3,1,0], RESET,
NMI
Clock,
System,
EMU, and
Reset
GP[15:8, 3:1]
GPIO
and
EXT_INT
HPI
SCL1, SDA1
GP[0],
GP[4](EXT_INT4)/AMUTEIN1,
GP[5](EXT_INT5)/AMUTEIN0,
GP[6](EXT_INT6),
GP[7](EXT_INT7)
I2C0
I2C1
SCL0, SDA0
AFSX1, AFSR1, ACLKX1,
ACLKR1, AHCLKR1,
AHCLKX1, AMUTE1
McASP1
8
AXR1[7:0]
8
AXR0[7:0]
{TINP0/AXR0[3]}
McBSP1
McASP0
AMUTE0,
TINP1/AHCLKX0,
AHCLKR0,
ACLKR0,
ACLKX0, AFSR0,
AFSX0
TIMER0
McBSP0
TIMER1
Shading denotes a peripheral module not available for this configuration.
DEVCFG Register Value:
0x0000 000F
MCBSP0DIS = 1
MCBSP1DIS = 1
TOUT0SEL = 1
TOUT1SEL = 1
EKSRC = 0
HPI_EN(HD14) = 0
GP2EN BIT = 1 (enabling GPEN.[2])
Figure 5-1. Configuration Example A (Two I2C + Two McASP + GPIO)
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ED [31:16],
ED[15:0]
EA[21:2]
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32
20
EMIF
CE[3:0], BE[3:0],
HOLDA, HOLD,
BUSREQ, ECLKIN,
ECLKOUT,
ARE/SDCAS/SSADS,
AWE/SDWE/SSWE,
AOE/SDRAS/SSOE,
ARDY
CLKIN, CLKOUT3, CLKMODE0,
PLLHV, TMS, TDO, TDI, TCK,
TRST, EMU[5:3,1,0], RESET,
NMI
Clock,
System,
EMU, and
Reset
GP[15:8, 3:1]
GPIO
and
EXT_INT
HPI
GP[0],
GP[4](EXT_INT4)/AMUTEIN1,
GP[5](EXT_INT5)/AMUTEIN0,
GP[6](EXT_INT6),
GP[7](EXT_INT7)
I2C0
I2C1
SCL0, SDA0
McASP1
8
AFSX1, AFSR1, ACLKX1,
ACLKR1, AHCLKR1,
AHCLKX1, AMUTE1
AXR1[7:0]
5
AXR0[4:0]
{TINP0/AXR0[3]}
DR1, CLKS1,
CLKR1, CLKX1,
FSR1, DX1,
FSX1
McBSP1
McASP0
TINP1/AHCLKX0,
AHCLKR0,
ACLKR0,
ACLKX0, AFSR0,
AFSX0
TIMER0
McBSP0
TIMER1
Shading denotes a peripheral module not available for this configuration.
DEVCFG Register Value:
0x0000 000E
MCBSP0DIS = 1
MCBSP1DIS = 0
TOUT0SEL = 1
TOUT1SEL = 1
EKSRC = 0
HPI_EN(HD14) = 0
GP2EN BIT = 1 (enabling GPEN.[2])
Figure 5-2. Configuration Example B (One I2C + One McBSP + Two McASP + GPIO)
42
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ED [31:16],
ED[15:0]
EA[21:2]
32
20
EMIF
CE[3:0], BE[3:0],
HOLDA, HOLD,
BUSREQ, ECLKIN,
ECLKOUT,
ARE/SDCAS/SSADS,
AWE/SDWE/SSWE,
AOE/SDRAS/SSOE,
ARDY
CLKIN, CLKOUT3, CLKMODE0,
PLLHV, TMS, TDO, TDI, TCK,
TRST, EMU[5:3,1,0], RESET,
NMI
Clock,
System,
EMU, and
Reset
GP[15:8, 3:1]
GPIO
and
EXT_INT
HPI
SCL1, SDA1
GP[0],
GP[4](EXT_INT4)/AMUTEIN1,
GP[5](EXT_INT5)/AMUTEIN0,
GP[6](EXT_INT6),
GP[7](EXT_INT7)
I2C0
I2C1
SCL0, SDA0
AFSX1, AFSR1, ACLKX1,
ACLKR1, AHCLKR1,
AHCLKX1, AMUTE1
McASP1
8
AXR1[7:0]
6
McBSP1
AXR0[7:2]
{TINP0/AXR0[3]}
McASP0
(DIT Mode)
AMUTE0,
TINP1/AHCLKX0
TIMER0
McBSP0
DR0, CLKS0,
CLKR0, CLKX0,
FSR0, DX0,
FSX0
TIMER1
Shading denotes a peripheral module not available for this configuration.
DEVCFG Register Value:
0x0000 000D
MCBSP0DIS = 0
MCBSP1DIS = 1
TOUT0SEL = 1
TOUT1SEL = 1
EKSRC = 0
HPI_EN(HD14) = 0
GP2EN BIT = 1 (enabling GPEN.[2])
Figure 5-3. Configuration Example C [2 I2C + 1 McBSP + 1 McASP + 1 McASP (DIT) + GPIO]
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ED [31:16],
ED[15:0]
EA[21:2]
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32
20
EMIF
CE[3:0], BE[3:0],
HOLDA, HOLD,
BUSREQ, ECLKIN,
ECLKOUT,
ARE/SDCAS/SSADS,
AWE/SDWE/SSWE,
AOE/SDRAS/SSOE,
ARDY
CLKIN, CLKOUT3, CLKMODE0,
PLLHV, TMS, TDO, TDI, TCK,
TRST, EMU[5:3,1,0], RESET,
NMI
Clock,
System,
EMU, and
Reset
GP[15:8, 3:1]
GPIO
and
EXT_INT
HPI
GP[0],
GP[4](EXT_INT4)/AMUTEIN1,
GP[5](EXT_INT5)/AMUTEIN0,
GP[6](EXT_INT6),
GP[7](EXT_INT7)
I2C0
I2C1
SCL0, SDA0
McASP1
8
AFSX1, AFSR1, ACLKX1,
ACLKR1, AHCLKR1,
AHCLKX1, AMUTE1
AXR1[7:0]
3
McBSP1
DR1, CLKS1,
CLKR1, CLKX1,
FSR1, DX1,
FSX1
AXR0[4:2]
{TINP0/AXR0[3]}
McASP0
(DIT Mode)
TINP1/AHCLKX0
TIMER0
TOUT0/AXR0[2]
TIMER1
TOUT1/AXR0[4]
McBSP0
DR0, CLKS0,
CLKR0, CLKX0,
FSR0, DX0,
FSX0
Shading denotes a peripheral module not available for this configuration.
DEVCFG Register Value:
0x0000 000C
MCBSP0DIS = 0
MCBSP1DIS = 0
TOUT0SEL = 1
TOUT1SEL = 1
EKSRC = 0
HPI_EN(HD14) = 0
GP2EN BIT = 1 (enabling GPEN.[2])
Figure 5-4. Configuration Example D [1 I2C + 2 McBSP + 1 McASP + 1 McASP (DIT) + GPIO + Timers]
44
DEVICE CONFIGURATIONS
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ED [31:16],
ED[15:0]
EA[21:2]
32
20
EMIF
CE[3:0], BE[3:0],
HOLDA, HOLD,
BUSREQ, ECLKIN,
ECLKOUT,
ARE/SDCAS/SSADS,
AWE/SDWE/SSWE,
AOE/SDRAS/SSOE,
ARDY
CLKIN, CLKOUT3, CLKMODE0,
PLLHV, TMS, TDO, TDI, TCK,
TRST, EMU[5:3,1,0], RESET,
NMI
Clock,
System,
EMU, and
Reset
CLKOUT2
GPIO
and
EXT_INT
GP[4](EXT_INT4)/AMUTEIN1,
GP[5](EXT_INT5)/AMUTEIN0,
GP[6](EXT_INT6),
GP[7](EXT_INT7)
16
HD[15:0]
HPI
I2C0
I2C1
McASP1
SCL0, SDA0
HINT, HHWIL,
HRDY, HR/W,
HCNTRL1,
HCNTRL0, HCS,
HDS2, HDS1,
HAS
SCL1, SDA1
8
AXR0[7:0],
{TINP0/AXR0[3]}
McBSP1
McASP0
AMUTE0,
TINP1/AHCLKX0,
AHCLKR0,
ACLKR0,
ACLKX0, AFSR0,
AFSX0
TIMER0
McBSP0
TIMER1
Shading denotes a peripheral module not available for this configuration.
DEVCFG Register Value:
0x0000 000F
MCBSP0DIS = 1
MCBSP1DIS = 1
TOUT0SEL = 1
TOUT1SEL = 1
EKSRC = 0
HPI_EN(HD14) = 1
GP2EN BIT = 0 (enabling GPEN.[2])
Figure 5-5. Configuration Example E (1 I2C + HPI + 1 McASP)
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ED [31:16],
ED[15:0]
EA[21:2]
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32
20
EMIF
CE[3:0] , BE[3:0] ,
HOLDA , HOLD,
BUSREQ, ECLKIN ,
ECLKOUT,
ARE/SDCAS/SSADS,
AWE/SDWE/SSWE,
AOE/SDRAS/SSOE,
ARDY
CLKIN, CLKOUT3, CLKMODE0 ,
PLLHV, TMS, TDO, TDI, TCK,
TRST, EMU[5:3,1,0], RESET,
NMI
Clock,
System ,
EMU, and
Reset
CLKOUT 2
GPIO
and
EXT_INT
GP[4](EXT_INT4)/AMUTEIN1,
GP[5](EXT_INT5)/AMUTEIN0,
GP[6](EXT_INT6),
GP[7](EXT_INT7)
16
HD[15:0]
HPI
I2C0
I2C1
McASP 1
SCL0, SDA0
HINT, HHWIL,
HRDY, HR/W,
HCNTRL1,
HCNTRL0, HCS,
HDS2, HDS1,
HAS
5
AXR0[4:0]
{TINP0/AXR0[3]}
DR1, CLKS1,
CLKR1, CLKX1 ,
FSR1, DX1,
FSX1
McBSP 1
McASP 0
TINP1/AHCLKX0,
AHCLKR0 ,
ACLKR0 ,
ACLKX0, AFSR0 ,
AFSX0
TIMER0
McBSP 0
TIMER1
Shading denotes a peripheral module not available for this configuration.
DEVCFG Register V alue:
0x0000 000E
MCBSP0DIS = 1
MCBSP1DIS = 0
TOUT0SEL = 1
TOUT1SEL = 1
EKSRC = 0
HPI_EN(HD14) = 1
GP2EN BIT = 0 (enabling GPEN.[2])
Figure 5-6. Configuration Example F (One McBSP + HPI + One McASP)
46
DEVICE CONFIGURATIONS
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5.6
Debugging Considerations
It is recommended that external connections be provided to peripheral selection/device configuration pins,
including HD[14, 8, 12 (for 13B only), 4, 3], and CLKMODE0. Although internal pullup resistors exist on
these pins, providing external connectivity adds convenience to the user in debugging and flexibility in
switching operating modes.
Internal pullup/pulldown resistors also exist on the non−configuration pins on the HPI data bus (HD[15,
13:9, 7:5, 2:0] (for 13) and HD[15, 13, 11:9, 7:5, 2:0] (for 13B)). For proper device operation of the HD[15,
13:9, 7, 1, 0] (for13) or HD[13, 11:9, 7, 1, 0] (for 13B), do not oppose the internal pullup/pulldown resistors
on these non-configuration pins with external pullup/pulldown resistors at reset. If an external controller
provides signals to these HD[15, 13:9, 7, 1, 0] (for 13) or HD[13, 11:9, 7, 1, 0] (for 13B) non-configuration
pins, these signals must be driven to the default state of the pins at reset, or not be driven at all. For the
list of routed out, 3-stated, or not-driven pins recommended for external pullup/pulldown resistors, and
internal pullup/pulldown resistors for all devices pins, etc., see Terminal Functions. However, the HD[6, 5,
2] (for 13) or HD[15, 6, 5, 2] (for 13B) non-configuration pins can be opposed and driven during reset.
For the internal pullup/pulldown resistors for all device pins, see the Terminal Functions table.
6
TERMINAL FUNCTIONS
The Terminal Functions table identifies the external signal names, the associated pin (ball) numbers along
with the mechanical package designator, the pin type (I, O/Z, or I/O/Z), whether the pin has any internal
pullup/pulldown resistors and a functional pin description. For more detailed information on device
configuration, peripheral selection, multiplexed/shared pins, and debugging considerations, see the Device
Configurations section of this data sheet.
TERMINAL FUNCTIONS
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TERMINAL FUNCTIONS
SIGNAL NAME
PIN
NO.
TYPE (1)
IPD/IPU (2)
DESCRIPTION
GDP
CLOCK/PLL CONFIGURATION
CLKIN
A3
I
IPD
Clock input
CLKOUT2/GP[2]
Y12
O/Z
IPD
Clock output at half of device speed (O/Z) [default] (SYSCLK2 internal signal from the clock generator) or this pin can be programmed
as GP[2] pin (I/O/Z).
CLKOUT3
D10
O
IPD
Clock output programmable by OSCDIV1 register in the PLL controller
Clock generator input clock source select
0: Reserved, do not use
CLKMODE0
C4
I
IPU
1: CLKIN square wave [default]
For proper device operation, this pin must be either left unconnected or externally pulled up with a 1-kΩ resistor.
PLLHV
C5
A (3)
TMS
B7
I
IPU
JTAG test-port mode select
TDO
A8
O/Z
IPU
JTAG test-port data out
TDI
A7
I
IPU
JTAG test-port data in
TCK
A6
I
IPU
JTAG test-port clock
TRST
B6
I
IPD
JTAG test-port reset. For IEEE Std 1149.1 JTAG compatibility, see the IEEE 1149.1 JTAG Compatibility Statement section of this data
sheet.
EMU5
B12
I/O/Z
IPU
Emulation pin 5. Reserved for future use, leave unconnected.
EMU4
C11
I/O/Z
IPU
Emulation pin 4. Reserved for future use, leave unconnected.
EMU3
B10
I/O/Z
IPU
Emulation pin 3. Reserved for future use, leave unconnected.
EMU2
D3
I/O/Z
IPU
Emulation pin 2. Reserved for future use, leave unconnected.
Analog power (3.3 V) for PLL (PLL filter)
JTAG EMULATION
Emulation [1:0]
•
Select the device functional mode of operation
Operation: EMU[1:0]:
EMU1
EMU0
B9
D9
I/O/Z
00
01
10
11
IPU
Boundary Scan/Functional Mode (see note)
Reserved
Reserved
Emulation/Functional Mode [default] (see the IEEE 1149.1 JTAG Compatibility Statement of this data
sheet)
The DSP can be placed in Functional mode when the EMU[1:0] pins are configured for either boundary scan or emulation.
Note: When the EMU[1:0] pins are configured for boundary scan mode, the internal pulldown (IPD) on the TRST signal must not be
opposed to operate in functional mode.
For the boundary scan mode, drive EMU[1:0] and RESET pins low.
RESETS AND INTERRUPTS
RESET
A13
I
—
NMI
C13
I
IPD
Device reset. When using boundary scan mode, drive the EMU[1:0] and RESET pins low.
Nonmaskable interrupt
•
GP[7](EXT_INT7)
E3
GP[6](EXT_INT6)
D2
Edge-driven (rising edge)
General-purpose input/output pins (I/O/Z), which also function as external interrupts
I/O/Z
•
Edge-driven
•
Polarity independently selected via the external interrupt polarity register bits (EXTPOL.[3:0]), in addition to the GPIO registers.
IPU
GP[5](EXT_INT5)/
AMUTEIN0
C1
GP[4](EXT_INT4)/
AMUTEIN1
C2
HINT/GP[1]
J20
O/Z
IPU
Host interrupt (from DSP to host) (O) [default] or this pin can be programmed as a GP[1] pin (I/O/Z)
HCNTL1/AXR1[1]
G19
I
IPU
Host control: Selects between control, address, or data registers (I) [default] or McASP1 data pin 1 (I/O/Z)
HCNTL0/AXR1[3]
G18
I
IPU
Host control: Selects between control, address, or data registers (I) [default] or McASP1 data pin 3 (I/O/Z)
HHWIL/AFSR1
H20
I
IPU
Host half-word select: First or second half-word (not necessarily high or low order) (I) [default] or McASP1 receive frame sync
or left/right clock (LRCLK) (I/O/Z).
HR/W/AXR1[0]
G20
I
IPU
Host read or write select (I) [default] or McASP1 data pin 0 (I/O/Z)
GP[4] and GP[5] pins also function as AMUTEIN1 McASP1 mute input and AMUTEIN0 McASP0 mute input, respectively, if enabled by
the INEN bit in the associated McASP AMUTE register.
HOST-PORT INTERFACE (HPI)
(1)
(2)
(3)
48
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground
IPD = Internal pulldown, IPU = Internal pullup. [These IPD/IPU signal pins feature a 13-kΩ resistor (approximate) for the IPD or 18-kΩ
resistor (approximate) for the IPU. An external pullup or pulldown resistor no greater than 4.4 kΩ and 2.0 kΩ, respectively, should be
used to pull a signal to the opposite supply rail.]
A = Analog signal
TERMINAL FUNCTIONS
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TERMINAL FUNCTIONS (continued)
SIGNAL NAME
PIN
NO.
TYPE (1)
IPD/IPU (2)
DESCRIPTION
GDP
Host-port data pins (I/O/Z) [default] or general-purpose input/output pins (I/O/Z)
•
•
Used for transfer of data, address, and control
Also controls initialization of DSP modes at reset via pullup/pulldown resistors
– Device Endian mode (HD8)
0: Big Endian
HD15/GP[15]
HD14/GP[14]
HD13/GP[13]
HD12/GP[12]
HD11/GP[11]
HD10/GP[10]
HD9/GP[9]
HD8/GP[8]
HD7/GP[3]
B14
C14
A15
C15
A16
B16
C16
B17
A18
1: Little Endian
– Boot mode (HD[4:3])
00: HPI boot/emulation boot
I/O/Z
IPU
01: CE1 width 8-bit, asynchronous external ROM boot with default timings (default mode)
10: CE1 width 16-bit, asynchronous external ROM boot with default timings
11: CE1 width 32-bit, asynchronous external ROM boot with default timings
– HPI_EN (HD14)
0: HPI disabled, McASP1 enabled
1: HPI enabled, McASP1 disabled (default)
Other HD pins (HD [15, 13:9, 7:5, 2:0] have pullups/pulldowns (IPUs/IPDs). For proper device operation, do not oppose these pins
with external pullups/pulldowns at reset; however, the HD[15, 6, 5, 2] pins can be opposed and driven at reset. For more details, see
the Device Configurations section of this data sheet.
HD6/AHCLKR1
C17
I/O/Z
IPU
Host-port data pin 6 (I/O/Z) [default] or McASP1 receive high-frequency master clock (I/O/Z)
HD5/AHCLKX1
B18
I/O/Z
IPU
Host-port data pin 5 (I/O/Z) [default] or McASP1 transmit high-frequency master clock (I/O/Z)
HD4/GP[0]
C19
I/O/Z
IPD
Host-port data pin 4 (I/O/Z) [default] or this pin can be programmed as a GP[0] pin (I/O/Z)
HD3/AMUTE1
C20
I/O/Z
IPU
Host-port data pin 3 (I/O/Z) [default] or McASP1 mute output (O/Z)
HD2/AFSX1
D18
I/O/Z
IPU
Host-port data pin 2 (I/O/Z) [default] or McASP1 transmit frame sync or left/right clock (LRCLK) (I/O/Z)
HD1/AXR1[7]
D20
I/O/Z
IPU
Host-port data pin 1 (I/O/Z) [default] or McASP1 data pin 7 (I/O/Z)
HD0/AXR1[4]
E20
I/O/Z
IPU
Host-port data pin 0 (I/O/Z) [default] or McASP1 data pin 4 (I/O/Z)
HAS/ACLKX1
E18
I
IPU
Host address strobe (I) [default] or McASP1 transmit bit clock (I/O/Z)
HCS/AXR1[2]
F20
I
IPU
Host chip select (I) [default] or McASP1 data pin 2 (I/O/Z)
HDS1/AXR1[6]
E19
I
IPU
Host data strobe 1 (I) [default] or McASP1 data pin 6 (I/O/Z)
HDS2/AXR1[5]
F18
I
IPU
Host data strobe 2 (I) [default] or McASP1 data pin 5 (I/O/Z)
HRDY/ACLKR1
H19
O/Z
IPD
Host ready (from DSP to host) (O) [default] or McASP1 receive bit clock (I/O/Z)
EMIF—COMMON SIGNALS TO ALL TYPES OF MEMORY (4)
CE3
V6
CE2
W6
Memory space enables
O/Z
CE1
W18
CE0
V17
BE3
V5
BE2
Y4
IPU
•
Enabled by bits 28 through 31 of the word address
•
Only one asserted during any external data access
Byte-enable control
•
Decoded from the two lowest bits of the internal address
BE1
U19
•
Byte-write enables for most types of memory
BE0
V20
•
Can be directly connected to SDRAM read and write mask signal (SDQM)
HOLDA
J18
HOLD
BUSREQ
ECLKIN
O/Z
IPU
EMIF—BUS ARBITRATION (4)
O/Z
IPU
Hold-request-acknowledge to the host
J17
I
IPU
Hold request from the host
J19
O/Z
IPU
Bus request output
Y11
I
IPD
External EMIF input clock source
EMIF—ASYNCHRONOUS/SYNCHRONOUS MEMORY CONTROL (4)
EMIF output clock depends on the EKSRC bit (DEVCFG.[4]) and on EKEN bit (GBLCTL.[5]).
EKSRC = 0 ECLKOUT is based on the internal SYSCLK3 signal from the clock generator (default).
ECLKOUT
Y10
O/Z
IPD
EKSRC = 1 ECLKOUT is based on the external EMIF input clock source pin (ECLKIN)
EKEN = 0 ECLKOUT held low
EKEN = 1 ECLKOUT enabled to clock (default)
ARE/SDCAS/
SSADS
V11
O/Z
IPU
Asynchronous memory read enable/SDRAM column-address strobe/SBSRAM address strobe
AOE/SDRAS/ SSOE
W10
O/Z
IPU
Asynchronous memory output enable/SDRAM row-address strobe/SBSRAM output enable
AWE/SDWE/ SSWE
V12
O/Z
IPU
Asynchronous memory write enable/SDRAM write enable/SBSRAM write enable
ARDY
Y5
I
IPU
Asynchronous memory ready input
(4)
To maintain signal integrity for the EMIF signals, serial termination resistors should be inserted into all EMIF output signal lines.
TERMINAL FUNCTIONS
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TERMINAL FUNCTIONS (continued)
SIGNAL NAME
PIN
NO.
TYPE (1)
IPD/IPU (2)
DESCRIPTION
GDP
EMIF—ADDRESS (4)
EA21
U18
EA20
Y18
EA19
W17
EA18
Y16
EA17
V16
EA16
Y15
EA15
W15
EA14
Y14
EA13
W14
External address (word, half-word, and byte address)
The EMIF adjusts the address based on memory width:
EA12
V14
EA11
W13
Width
32
21:2 21 through 2
EA10
V10
16
21:2 20 through 1
EA9
Y9
8
21:2 19 through 0
EA8
V9
O/Z
EA7
Y8
EA6
W8
EA5
V8
EA4
W7
EA3
V7
EA2
Y6
50
Pins Address
IPU
For more details on address width adjustments, see the External Memory Interface (EMIF) chapter of the TMS320C6000 Peripherals
Reference Guide (literature number SPRU190)
TERMINAL FUNCTIONS
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TERMINAL FUNCTIONS (continued)
SIGNAL NAME
PIN
NO.
TYPE (1)
IPD/IPU (2)
DESCRIPTION
GDP
EMIF—DATA (5)
ED31
N3
ED30
P3
ED29
P2
ED28
P1
ED27
R2
ED26
R3
ED25
T2
ED24
T1
ED23
U3
ED22
U1
ED21
U2
ED20
V1
ED19
V2
ED18
Y3
ED17
W4
ED16
V4
ED15
T19
ED14
T20
I/O/Z
ED13
T18
ED12
R20
ED11
R19
ED10
P20
ED9
P18
ED8
N20
ED7
N19
ED6
N18
ED5
M20
ED4
M19
ED3
L19
ED2
L18
ED1
K19
ED0
K18
IPU
External data pins (ED[31:16] pins applicable to GDP package only)
MULTICHANNEL AUDIO SERIAL PORT 1 (McASP1)
GP[4](EXT_INT4)/
AMUTEIN1
C2
I/O/Z
IPU
General-purpose input/output pin 4 and external interrupt 4 (I/O/Z) [default] or McASP1 mute input (I/O/Z)
HD3/AMUTE1
C20
I/O/Z
IPU
Host-port data pin 3 (I/O/Z) [default] or McASP1 mute output (O/Z)
HRDY/ACLKR1
H19
I/O/Z
IPU
Host ready (from DSP to host) (O) [default] or McASP1 receive bit clock (I/O/Z)
HD6/AHCLKR1
C17
I/O/Z
IPU
Host-port data pin 6 (I/O/Z) [default] or McASP1 receive high-frequency master clock (I/O/Z)
HAS/ACLKX1
E18
I/O/Z
IPU
Host address strobe (I) [default] or McASP 1 transmit bit clock (I/O/Z)
HD5/AHCLKX1
B18
I/O/Z
IPU
Host-port data pin 5 (I/O/Z) [default] or McASP1 transmit high-frequency master clock (I/O/Z)
HHWIL/AFSR1
H20
I/O/Z
IPU
Host half-word select − first or second half-word (not necessarily high or low order) (I) [default] or McASP1 receive frame sync or
left/right clock (LRCLK) (I/O/Z)
HD2/AFSX1
D18
I/O/Z
IPU
Host-port data pin 2 (I/O/Z) [default] or McASP1 transmit frame sync or left/right clock (LRCLK) (I/O/Z)
HD1/AXR1[7]
D20
I/O/Z
IPU
Host-port data pin 1 (I/O/Z) [default] or McASP1 TX/RX data pin 7 (I/O/Z)
HDS1/AXR1[6]
E19
I/O/Z
IPU
Host data strobe 1 (I) [default] or McASP1 TX/RX data pin 6 (I/O/Z)
HDS2/AXR1[5]
F18
I/O/Z
IPU
Host data strobe 2 (I) [default] or McASP1 TX/RX data pin 5 (I/O/Z)
HD0/AXR1[4]
E20
I/O/Z
IPU
Host-port data pin 0 (I/O/Z) [default] or McASP1 TX/RX data pin 4 (I/O/Z)
HCNTL0/AXR1[3]
G18
I/O/Z
IPU
Host control − selects between control, address, or data registers (I) [default] or McASP1 TX/RX data pin 3 (I/O/Z)
HCS/AXR1[2]
F20
I/O/Z
IPU
Host chip select (I) [default] or McASP1 TX/RX data pin 2 (I/O/Z)
HCNTL1/AXR1[1]
G19
I/O/Z
IPU
Host control − selects between control, address, or data registers (I) [default] or McASP1 TX/RX data pin 1 (I/O/Z)
HR/W/AXR1[0]
G20
I/O/Z
IPU
Host read or write select (I) [default] or McASP1 TX/RX data pin 0 (I/O/Z)
(5)
To maintain signal integrity for the EMIF signals, serial termination resistors should be inserted into all EMIF output signal lines.
TERMINAL FUNCTIONS
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TERMINAL FUNCTIONS (continued)
SIGNAL NAME
PIN
NO.
TYPE (1)
IPD/IPU (2)
DESCRIPTION
GDP
MULTICHANNEL AUDIO SERIAL PORT 0 (McASP0)
GP[5](EXT_INT5)/
AMUTEIN0
C1
I/O/Z
IPU
General-purpose input/output pin 5 and external interrupt 5 (I/O/Z) [default] or McASP0 mute input (I/O/Z)
CLKX1/AMUTE0
L3
I/O/Z
IPD
McBSP1 transmit clock (I/O/Z) [default] or McASP0 mute output (O/Z)
CLKR0/ACLKR0
H3
I/O/Z
IPD
McBSP0 receive clock (I/O/Z) [default] or McASP0 receive bit clock (I/O/Z)
TINP1/AHCLKX0
F2
I/O/Z
IPD
Timer 1 input (I) [default] or McBSP0 transmit high-frequency master clock (I/O/Z)
CLKX0/ACLKX0
G3
I/O/Z
IPD
McBSP0 transmit clock (I/O/Z) [default] or McASP0 transmit bit clock (I/O/Z)
CLKS0/AHCLKR0
K3
I/O/Z
IPD
McBSP0 external clock source (as opposed to internal) (I) [default] or McASP0 receive high-frequency master clock (I/O/Z)
FSR0/AFSR0
J3
I/O/Z
IPD
McBSP0 receive frame sync (I/O/Z) [default] or McASP0 receive frame sync or left/right clock (LRCLK) (I/O/Z)
FSX0/AFSX0
H1
I/O/Z
IPD
McBSP0 transmit frame sync (I/O/Z) [default] or McASP0 transmit frame sync or left/right clock (LRCLK) (I/O/Z)
FSR1/AXR0[7]
M3
I/O/Z
IPD
McBSP1 receive frame sync (I/O/Z) [default] or McASP0 TX/RX data pin 7 (I/O/Z)
CLKR1/AXR0[6]
M1
I/O/Z
IPD
McBSP1 receive clock (I/O/Z) [default] or McASP0 TX/RX data pin 6 (I/O/Z)
DX1/AXR0[5]
L2
I/O/Z
IPU
McBSP1 transmit data (O/Z) [default] or McASP0 TX/RX data pin 5 (I/O/Z)
TOUT1/AXR0[4]
F1
I/O/Z
IPD
Timer 1 output (O) [default] or McASP0 TX/RX data pin 4 (I/O/Z)
TINP0/AXR0[3]
G2
I/O/Z
IPD
Timer 0 input (I) [default] or McASP0 TX/RX data pin 3 (I/O/Z)
TOUT0/AXR0[2]
G1
I/O/Z
IPD
Timer 0 output (O) [default] or McASP0 TX/RX data pin 2 (I/O/Z)
DX0/AXR0[1]
H2
I/O/Z
IPU
McBSP0 transmit data (O/Z) [default] or McASP0 TX/RX data pin 1 (I/O/Z)
DR0/AXR0[0]
J1
I/O/Z
IPU
McBSP0 receive data (I) [default] or McASP0 TX/RX data pin 0 (I/O/Z)
TOUT1/AXR0[4]
F1
O
IPD
Timer 1 output (O) [default] or McASP0 TX/RX data pin 4 (I/O/Z)
TINP1/AHCLKX0
F2
I
IPD
Timer 1 input (I) [default] or McBSP0 transmit high-frequency master clock (I/O/Z). This pin defaults as Timer 1 input (I) and McASP
transmit high−frequency master clock input (I).
TOUT0/AXR0[2]
G1
O
IPD
Timer 0 output (O) [default] or McASP0 TX/RX data pin 2 (I/O/Z)
TINP0/AXR0[3]
G2
I
IPD
Timer 0 input (I) [default] or McASP0 TX/RX data pin 3 (I/O/Z)
TIMER1
TIMER0
MULTICHANNEL BUFFERED SERIAL PORT 1 (McBSP1)
McBSP1 external clock source (as opposed to internal) (I) [default] or I2C1 clock (I/O/Z). This pin does not have an internal pullup or
pulldown. When this pin is used as a McBSP pin, this pin should either be driven externally at all times or be pulled up with a 10-kΩ
resistor to a valid logic level. Because it is common for some ICs to 3-state their outputs at times, a 10-kΩ pullup resistor may be
desirable even when an external device is driving the pin.
CLKS1/SCL1
E1
I
—
CLKR1/AXR0[6]
M1
I/O/Z
IPD
McBSP1 receive clock (I/O/Z) [default] or McASP0 TX/RX data pin 6 (I/O/Z)
CLKX1/AMUTE0
L3
I/O/Z
IPD
McBSP1 transmit clock (I/O/Z) [default] or McASP0 mute output (O/Z)
DR1/SDA1
M2
I
—
McBSP1 receive data (I) [default] or I2C1 data (I/O/Z). This pin does not have an internal pullup or pulldown. When this pin is used as
a McBSP pin, this pin should either be driven externally at all times or be pulled up with a 10-kΩ resistor to a valid logic level. Because
it is common for some ICs to 3-state their outputs at times, a 10-kΩ pullup resistor may be desirable even when an external device is
driving the pin.
DX1/AXR0[5]
L2
O/Z
IPU
McBSP1 transmit data (O/Z) [default] or McASP0 TX/RX data pin 5 (I/O/Z)
FSR1/AXR0[7]
M3
I/O/Z
IPD
McBSP1 receive frame sync (I/O/Z) [default] or McASP0 TX/RX data pin 7 (I/O/Z)
FSX1
L1
I/O/Z
IPD
McBSP1 transmit frame sync
CLKS0/AHCLKR0
K3
I
IPD
McBSP0 external clock source (as opposed to internal) (I) [default] or McASP0 receive high-frequency master clock (I/O/Z)
CLKR0/ACLKR0
H3
I/O/Z
IPD
McBSP0 receive clock (I/O/Z) [default] or McASP0 receive bit clock (I/O/Z)
CLKX0/ACLKX0
G3
I/O/Z
IPD
McBSP0 transmit clock (I/O/Z) [default] or McASP0 transmit bit clock (I/O/Z)
DR0/AXR0[0]
J1
I
IPU
McBSP0 receive data (I) [default] or McASP0 TX/RX data pin 0 (I/O/Z)
DX0/AXR0[1]
H2
O/Z
IPU
McBSP0 transmit data (O/Z) [default] or McASP0 TX/RX data pin 1 (I/O/Z)
FSR0/AFSR0
J3
I/O/Z
IPD
McBSP0 receive frame sync (I/O/Z) [default] or McASP0 receive frame sync or left/right clock (LRCLK) (I/O/Z)
FSX0/AFSX0
H1
I/O/Z
IPD
McBSP0 transmit frame sync (I/O/Z) [default] or McASP0 transmit frame sync or left/right clock (LRCLK) (I/O/Z)
MULTICHANNEL BUFFERED SERIAL PORT 0 (McBSP0)
INTER-INTEGRATED CIRCUIT 1 (I2C1)
CLKS1/SCL1
E1
I/O/Z
—
McBSP1 external clock source (as opposed to internal) (I) [default] or I2C1 clock (I/O/Z). This pin must be externally pulled up. When
this pin is used as an I2C pin, the value of the pullup resistor depends on the number of devices connected to the I2C bus. For more
details, see the Philips I2C Specification Revision 2.1 (January 2000).
DR1/SDA1
M2
I/O/Z
—
McBSP1 receive data (I) [default] or I2C1 data (I/O/Z). This pin must be externally pulled up. When this pin is used as an I2C pin, the
value of the pullup resistor depends on the number of devices connected to the I2C bus. For more details, see the Philips I2C
Specification Revision 2.1 (January 2000).
—
I2C0 clock. This pin must be externally pulled up. When this pin is used as an I2C pin, the value of the pull-up resistor depends on the
number of devices connected to the I2C bus. For more details, see the Philips I2C Specification Revision 2.1 (January 2000).
INTER-INTEGRATED CIRCUIT 0 (I2C0)
SCL0
52
N1
I/O/Z
TERMINAL FUNCTIONS
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TERMINAL FUNCTIONS (continued)
SIGNAL NAME
PIN
NO.
TYPE (1)
IPD/IPU (2)
DESCRIPTION
GDP
SDA0
N2
I/O/Z
—
I2C0 data. This pin must be externally pulled up. When this pin is used as an I2C pin, the value of the pull-up resistor depends on the
number of devices connected to the I2C bus. For more details, see the Philips I2C Specification Revision 2.1 (January 2000).
HD15/GP[15]
B14
I/O/Z
IPU
Host-port data pins (I/O/Z) [default] or general-purpose input/output pins (I/O/Z) and some function as boot configuration pins at reset.
HD14/GP[14]
C14
I/O/Z
IPU
•
HD13/GP[13]
A15
I/O/Z
IPU
HD12/GP[12]
C15
I/O/Z
IPU
HD11/GP[11]
A16
I/O/Z
IPU
HD10/GP[10]
B16
I/O/Z
IPU
HD9/GP[9]
C16
I/O/Z
IPU
HD8/GP[8]
B17
I/O/Z
IPU
GP[7](EXT_INT7)
E3
I/O/Z
IPU
GP[6](EXT_INT6)
D2
I/O/Z
IPU
GP[5](EXT_INT5)/AM
UTEIN0
C1
I/O/Z
IPU
GP[4](EXT_INT4)/
AMUTEIN1
C2
I/O/Z
IPU
•
Polarity independently selected via the External Interrupt Polarity Register bits (EXTPOL.[3:0])
abc
GP[4] and GP[5] pins also function as AMUTEIN1 McASP1 mute input and AMUTEIN0 McASP0 mute input, respectively, if enabled by
the INEN bit in the associated McASP AMUTE register.
HD7/GP[3]
A18
I/O/Z
IPU
Host-port data pin 7 (I/O/Z) [default] or general-purpose input/output pin 3 (I/O/Z)
CLKOUT2/GP[2]
Y12
I/O/Z
IPD
Clock output at half of device speed (O/Z) [default] or this pin can be programmed as GP[2] pin
HINT/GP[1]
J20
O
IPU
Host interrupt (from DSP to host) (O) [default] or this pin can be programmed as a GP[1] pin (I/O/Z)
HD4/GP[0]
C19
I/O/Z
IPD
Host-port data pin 4 (I/O/Z) [default] or this pin can be programmed as a GP[0] pin (I/O/Z)
RSV
A5
O/Z
IPU
Reserved. (Leave unconnected; do not connect to power or ground.)
RSV
B5
A (6)
—
Reserved. (Leave unconnected; do not connect to power or ground.)
RSV
C12
O
—
Reserved. (Leave unconnected; do not connect to power or ground.)
RSV
D7
O/Z
IPD
Reserved. (Leave unconnected; do not connect to power or ground.)
RSV
D12
I
—
Reserved. This pin does not have an IPU. For proper C6713 device operation, the D12 pin must be externally pulled down with a
10-kΩ resistor.
RSV
A12
—
—
Reserved. For new designs, it is recommended that this pin be connected directly to CVDD (core power). For old designs, this can be
left unconnected.
RSV
B11
—
—
Reserved. For new designs, it is recommended that this pin be connected directly to VSS (ground). For old designs, this pin can be left
unconneced.
DVDD
A17
B3
B8
B13
C10
D1
D16
D19
F3
H18
J2
M18
R1
R18
T3
U5
U7
U12
U16
V13
V15
V19
W3
W9
W12
Y7
Y17
GENERAL-PURPOSE INPUT/OUTPUT (GPIO)
Used for transfer of data, address, and control
•
Also controls initialization of DSP modes at reset via pullup/pulldown resistors
abc
As general-purpose input/output (GP[x]) functions, these pins are software configurable through registers. The GPxEN bits in the GP
Enable register and the GPxDIR bits in the GP Direction register must be properly configured:
abc
GPxEN = 1; GP[x] pin is enabled.
GPxDIR = 0; GP[x] pin is an input.
GPxDIR = 1; GP[x] pin is an output.
abc
For the functionality description of the Host-port data pins or the boot configuration pins, see the Host-Port Interface (HPI) portion of
this table.
General-purpose input/output pins (I/O/Z) that also function as external interrupts
•
Edge-driven
RESERVED FOR TEST
SUPPLY VOLTAGE PINS
(6)
S
—
3.3-V supply voltage
(see the Power-Supply Decoupling section of this data sheet)
A = Analog signal
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TERMINAL FUNCTIONS (continued)
SIGNAL NAME
PIN
NO.
TYPE (1)
IPD/IPU (2)
S
—
DESCRIPTION
GDP
CVDD
54
A4
A9
A10
B2
B19
C3
C7
C18
D5
D6
D11
D14
D15
F4
F17
K1
K4
K17
L4
L17
L20
R4
R17
U6
U10
U11
U14
U15
V3
V18
W2
W19
1.26-V supply voltage
(see the Power-Supply Decoupling section of this data sheet)
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TERMINAL FUNCTIONS (continued)
SIGNAL NAME
PIN
NO.
TYPE (1)
IPD/IPU (2)
DESCRIPTION
GDP
GROUND PINS
VSS
(1)
6.1
A1
A2
A11
A14
A19
A20
B1
B4
B15
B20
C6
C8
C9
D4
D8
D13
D17
E2
E4
E17
F19
G4
G17
H4
H17
J4
J9
J10
J11
J12
K2
K9
K10
K11
K12
K20
L9
L10
L11
L12
M4
M9
M10
M11
M12
M17
N4
N17
P4
P17
P19
T4
T17
U4
U8
U9
U13
U17
U20
W1
W5
W11
W16
W20
Y1
Y2
Y13
Y19
Y20
GND
—
Ground pins (1). The center thermal balls (J9−J12, K9−K12, L9−L12, M9−M12) [shaded] are all tied to ground and act as both electrical
grounds and thermal relief (thermal dissipation).
Shaded pin numbers denote the center thermal balls.
Development Support
TI offers an extensive line of development tools for the TMS320C6000™ DSP platform, including tools to
evaluate the performance of the processors, generate code, develop algorithm implementations, and fully
integrate and debug software and hardware modules.
The following products support development of C6000™ DSP-based applications:
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Software Development Tools
• Code Composer Studio™ Integrated Development Environment (IDE), including Editor
• C/C++/Assembly Code Generation, and Debug plus additional development tools
• Scalable, Real-Time Foundation Software ( DSP/BIOS™), which provides the basic run-time target
software needed to support any DSP application.
Hardware Development Tools
• Extended Development System ( XDS™) Emulator (supports C6000 DSP multiprocessor system
debug)
• EVM (evaluation module)
For a complete listing of development-support tools for the TMS320C6000 DSP platform, visit the Texas
Instruments web site at www.ti.com. For information on pricing and availability, contact the nearest TI field
sales office or authorized distributor.
6.2
Device and Development-Support Tool Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all
TMS320™ DSP devices and support tools. Each TMS320 DSP commercial family member has one of
three prefixes: SMX, TMP, or SM/SMJ. TI recommends two of three possible prefix designators for
support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development
from engineering prototypes (SMX/TMDX) through fully qualified production devices/tools
(SM/SMJ/TMDS).
6.2.1
Device Development Evolutionary Flow
SMX
Preproduction device that is not necessarily representative of the final device
electrical specifications
TMP
Final silicon die that conforms to the device electrical specifications but has not
completed quality and reliability verification
SM/SMJ
6.2.2
Fully qualified production device
Support Tool Development Evolutionary Flow
TMDX
Development-support product that has not yet completed Texas Instruments
internal qualification testing
TMDS
Fully qualified development-support product
SMX and TMP devices and TMDX development-support tools are shipped with appropriate disclaimers
describing their limitations and intended uses. Experimental devices (SMX) may not be representative of a
final product and TI reserves the right to change or discontinue these products without notice.
SM/SMJ devices and TMDS development-support tools have been characterized fully, and the quality and
reliability of the device have been demonstrated fully. TI’s standard warranty applies.
Predictions show that prototype devices (SMX or TMP) have a greater failure rate than the standard
production devices. TI recommends that these devices not be used in any production system because
their expected end-use failure rate still is undefined. Only qualified production devices are to be used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the
package type (for example, GDP), the temperature range (for example, blank is the default commercial
temperature range), and the device speed range in megahertz (for example, 20 is 200 MHz).
Figure 6-1 provides a legend for reading the complete device name for any TMS320C6000 DSP family
member.
56
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Table 6-1. 320C6713 and C6713B Device Part Numbers (P/Ns) and Ordering Information (1)
CORE AND I/O VOLTAGE
DEVICE ORDERABLE P/N (2)
DEVICE SPEED
CVDD (CORE)
DVDD (I/O)
OPERATING CASE
TEMPERATURE
RANGE
1.26 V
3.3 V
–40°C to 105°C
C6713B
(1)
SM32C6713BGDPA20EP
200 MHz/1200 MFlops
SM32C6713BGDPM30EP
300 MHz/1800 MFlops
1.4V
3.3V
–55°C to 125°C
SM32C6713BGDPS20EP
200 MHz/1200 MFlops
1.26 V
3.3 V
–55°C to 105°C
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package
(2)
6.3
Ordering Nomenclature
SM
320
C
6713
GDP
( )
20
EP
PREFIX
SMX= Experimental device
TMP= Prototype device
TMS= Qualified device
SM J= MIL-PRF-38535, QML
SM = High Rel (non-38535)
DEVICE FAMILY
320 = TMS320 ä DSP family
TECHNOLOGY
C = CMOS
ENHANCED PLASTIC INDICA TOR
DEVICE SPEED RANGE
20 = 200 MHz
TEMPERATURE RANGE (DEFAULT: 0°C TO 90°C)
Blank = 0°C to 90°C (commercial temperature)
A
= -40°C to 105°C (extended temperature)
M
= –55°C to 125°C (extended temperature)
S
= -55°C to 105°C (extended temperature)
PACKAGE TYPE (See Note 1)
GDP = 272-pin plastic BGA
GFN= 256-pin plastic BGA
GGP = 352-pin plastic BGA
GJC= 352-pin plastic BGA
GJL=
352-pin plastic BGA
GLS= 384-pin plastic BGA
GLW= 340-pin plastic BGA
GNY = 384-pin plastic BGA
GNZ = 352-pin plastic BGA
GLZ= 532-pin plastic BGA
TM
GHK = 288-pin plastic MicroStar BGA
PYP = 208-pin PowerPADTM plastic QFP
DEVICE
C6000 DSP:
C6713
C6713B
NOTE (1): BGA = Ball Grid Array
QFP = Quad Flatpack
For actual device part numbers (P/Ns) and ordering information, see the Mechanical Data section of this document or
the TI website (www.ti.com).
Figure 6-1. TMS320C6000™ DSP Device Nomenclature (Including SM320C6713 and C6713B Devices)
6.4
Documentation Support
Extensive documentation supports all the TMS320 DSP family generations of devices from product
announcement through applications development. The types of documentation available include data
sheets, such as this document with design specifications complete user’s reference guides for all devices
and tools, technical briefs, development-support tools, on-line help, and hardware and software
applications. The following is a brief, descriptive list of support documentation specific to the C6000 DSP
devices, except where noted, all documents are accessible through the TI web site at www.ti.com.
• TMS320C6000™ CPU and Instruction Set Reference Guide (literature number SPRU189) describes
the C6000 CPU (DSP core) architecture, instruction set, pipeline, and associated interrupts.
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•
•
•
•
•
•
•
•
•
•
www.ti.com
TMS320C6000™ DSP Peripherals Overview Reference Guide [hereafter referred to as the C6000
PRG Overview] (literature number SPRU190) provides an overview and briefly describes the
functionality of the peripherals available on the C6000 DSP platform of devices. This document also
includes a table listing the peripherals available on the C6000 devices along with literature numbers
and hyperlinks to the associated peripheral documents. These C6713/13B peripherals are similar to
the peripherals on the TMS320C6711 and TMS320C64x devices; therefore, see the TMS320C6711
(C6711 or C67x) peripheral information and, in some cases (where indicated), see the TMS320C6711
(C6711 or C671x) peripheral information and, in some cases (where indicated), see the C64x
information in the C6000™ PRG Overview (literature number SPRU190).
TMS320DA6000™ DSP Multichannel Audio Serial Port (McASP) Reference Guide (literature number
SPRU041) describes the functionality of the McASP peripherals available on the C6713/13B device.
TMS320C6000™ DSP Software-Programmable Phase-Locked Loop (PLL) Controller Reference Guide
(literature number SPRU233) describes the functionality of the PLL peripheral available on the
C6713/13B device.
TMS320C6000™ DSP Inter-Integrated Circuit (I2C) Module Reference Guide (literature number
SPRU175) describes the functionality of the I2C peripherals available on the C6713/13B device.
The PowerPAD ™Thermally-Enhanced Package Technical Brief (literature number SLMA002) focuses
on the specifics of integrating a PowerPAD package into the printed circuit board (PCB) design to
make optimum use of the thermal efficiencies designed into the PowerPAD package.
TMS320C6000™ Technical Brief (literature number SPRU197) gives an introduction to the C62x™/
C67x™ devices, associated development tools, and third-party support.
Migrating from TMS320C6211(B)/C6711(B) to TMS320C6713 application report (literature number
SPRA851) indicates the differences and describes the issues of interest related to the migration from
the TI TMS320C6211(B)/C6711(B) GFN package to the TMS320C6713 GDP package.
TMS320C6713, TMS320C6713B Digital Signal Processors Silicon Errata (literature number SPRZ191)
describes the known exceptions to the functional specifications for particular silicon revisions of the
TMS320C6713 and TMS320C6713B devices.
TMS320C6713/12C/11C Power Consumption Summary application report (literature number
SPRA889) discusses the power consumption for user applications with the TMS320C6713/13B,
TMS320C6712C/12D, and TMS320C6711C/11D DSP devices.
Using IBIS Models for Timing Analysis application report (literature number SPRA839) describes how
to properly use IBIS models to attain accurate timing analysis for a given system.
The tools support documentation is electronically available within the Code Composer Studio Integrated
Development Environment (IDE). For a complete listing of C6000 DSP latest documentation, visit the
Texas Instruments web site at www.ti.com. Also, see the TI web site for the application report, How To
Begin Development Today With the TMS320C6713 Floating-Point DSP (literature number SPRA809),
which describes in more detail the similarities/differences between the C6713 and C6711 C6000 DSP
devices.
58
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7
REGISTER INFORMATION
This section provides the register information for the device.
7.1
CPU Control Status Register (CSR) Description
The CPU CSR contains the CPU ID and CPU Revision ID (bits 16−31), as well as the status of the device
power-down modes [PWRD field (bits 15−10)], program and data cache control modes, the endian bit
(EN, bit 8), and the global interrupt enable (GIE, bit 0) and previous GIE (PGIE, bit 1). Figure 7-1 and
Table 7-1 identify the bit fields in the CPU CSR.
For more detailed information on the bit fields in the CPU CSR, see the TMS320C6000 DSP Peripherals
Overview Reference Guide (literature number SPRU190) and the TMS320C6000 CPU and Instruction Set
Reference Guide (literature number SPRU189).
31
24 23
16
CPU ID
REVISION ID
R-0x02
R-0x03 [13/13B]
15
10
PWRD
98
SAT
R/W-0R
/C-0
76
EN
R-1R
54
PCC
/W-0
21
DCC
R/W-0R
0
PGIE
/W-0
GIE
R/W-0
Legend: R = Readable by the MVC instruction, R/W = Readable/Writeable by the MVC instruction; W = Read/write; -n = value after reset, -x = undefined value after
reset, C = Clearable by the MVC instruction
Figure 7-1. CPU Control Status Register (CPU CSR)
REGISTER INFORMATION
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Table 7-1. CPU CSR Bit Field Description
Bit NO.
NAME
31:24
CPU ID
23:16
15:10
DESCRIPTION
CPU ID + REV ID. Read only. Identifies which CPU is used and defines the silicon revision of the CPU.
REVISION ID CPU ID + REVISION ID (31:16) are combined for a value of: 0x0203 for C6713/13B
PWRD
Control power-down modes. The values are always read as zero.
000000 = No power down (default)
001001 = PD1, wake up by an enabled interrupt
010001 = PD1, wake up by an enabled or not enabled interrupt
011010 = PD2, wake up by a device reset
011100 = PD3, wake up by a device reset
Others = Reserved
9
SAT
Saturate bit.
Set when any unit performs a saturate. This bit can be cleared only by the MVC instruction and can be set only
by a functional unit. The set by the a functional unit has priority over a clear (by the MVC instruction) if they
occur on the same cycle. The saturate bit is set one full cycle (one delay slot) after a saturate occurs. This bit
will not be modified by a conditional instruction whose condition is false.
8
EN
Endian bit. This bit is read-only. Depicts the device endian mode.
0 = Big Endian mode
1 = Little Endian mode [default]
7:5
PCC
Program cache control mode.
L1D, Level 1 program cache
000/010 = Cache enabled/cache accessed and updated on reads
All other PCC values are reserved.
4:2
DCC
Data cache control mode.
L1D, Level 1 data cache
000/010 = Cache enabled/2-way cache
All other DCC values are reserved.
1
PGIE
Previous GIE (global interrupt enable); saves the Global Interrupt Enable (GIE) when an interrupt is taken.
Allows for proper nesting of interrupts.
0 = Previous GIE value is 0 (default).
1 = Previous GIE value is 1.
0
GIE
Global interrupt enable bit.
Enables (1) or disables (0) all interrupts except the reset interrupt and NMI (nonmaskable interrupt).
0 = Disables all interrupts (except the reset interrupt and NMI) [default].
1 = Enables all interrupts (except the reset interrupt and NMI).
7.2
Cache Configuration (CCFG) Register Description (13B)
The C6713B device includes an enhancement to the CCFG register. A P bit (CCFG.31) allows the
programmer to select the priority of accesses to L2 memory originating from the transfer crossbar (TC)
over accesses originating from the L1D memory system. An important class of TC accesses is EDMA
transfers, which move data to or from the L2 memory. While the EDMA normally has no issue accessing
L2 memory because of the high hit rates on the L1D memory system, there are pathological cases where
certain CPU behavior could block the EDMA from accessing the L2 memory for long enough to cause a
missed deadline when transferring data to a peripheral such as the McASP or McBSP. This can be
avoided by setting the P bit to 1 because the EDMA will assume a higher priority than the L1D memory
system when accessing L2 memory.
For more detailed information on the P-bit function and for silicon advisories concerning EDMA L2
memory accesses blocked, see the TMS320C6713, TMS320C6713B Digital Signal Processors Silicon
Errata (literature number SPRZ191).
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31
30
P
10
(1)
R/W-0
7
98
32
0
Reserved
IP
ID
Reserved
L2MODE
R-x
W-0
W-0
R-0 0000
R/W-000
Legend: R = Readable; R/W = Readable/Writeable; -n = value after reset, -x = undefined value after reset
A: Unlike the C6713 device, the C6713B device includes a P bit.
A.
Unlike the C6713 device, the C6713B device includes a P bit.
Figure 7-2. Cache Configuration (CCFG) Register
Table 7-2. CCFG Register Bit Field Description
BIT NO.
NAME
DESCRIPTION
L1D requestor priority to L2 bit
P = 0: L1D requests to L2 higher priority than TC requests
P = 1: TC requests to L2 higher priority than L1D requests
31
P
30:10
Reserved
9
IP
Invalidate L1P bit
0 = Normal L1P operation
1 = All L1P lines are invalidated
8
ID
Invalidate L1D bit
0 = Normal L1D operation
1 = All L1D lines are invalidated
7:3
Reserved
Reserved. Read only, writes have no effect.
Reserved. Read only, writes have no effect.
L2 operation mode bits (L2MODE)
000b = L2 cache disabled (All SRAM mode) [256K SRAM]
001b = 1-way cache (16K L2 cache) / [240K SRAM]
2:0
L2MODE
010b = 2-way cache (32K L2 cache) / [224K SRAM]
011b = 3-way cache (48K L2 cache) / [208K SRAM]
111b = 4-way cache (64K L2 cache) / [192K SRAM]
All others are reserved.
7.3
Interrupts and Interrupt Selector
The C67x DSP core supports 16 prioritized interrupts, which are listed in Table 7-3. The highest priority
interrupt is INT_00 (dedicated to RESET), while the lowest priority is INT_15. The first four interrupts are
non-maskable and fixed. The remaining interrupts (4−15) are maskable and default to the interrupt source
listed in Table 7-3. However, their interrupt source may be reprogrammed to any one of the sources listed
in Table 7-4 (Interrupt Selector). Table 7-4 lists the selector value corresponding to each of the alternate
interrupt sources. The selector choice for interrupts 4−15 is made by programming the corresponding
fields (listed in Table 7-3) in the MUXH (address 0x019C0000) and MUXL (address 0x019C0004)
registers.
Table 7-3. DSP Interrupts
DSP
INTERRUPT NUMBER
INTERRUPT
SELECTOR CONTROL
REGISTER
DEFAULT
SELECTOR VALUE
(BINARY)
DEFAULT
INTERRUPT
EVENT
INT_00
—
—
RESET
INT_01
—
—
NMI
INT_02
—
—
Reserved
INT_03
—
—
Reserved
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Table 7-3. DSP Interrupts (continued)
DSP
INTERRUPT NUMBER
INTERRUPT
SELECTOR CONTROL
REGISTER
DEFAULT
SELECTOR VALUE
(BINARY)
DEFAULT
INTERRUPT
EVENT
INT_04
MUXL[4:0]
00100
GPINT4 (1)
INT_05
MUXL[9:5]
00101
GPINT5 (1)
INT_06
MUXL[14:10]
00110
GPINT6 (1)
INT_07
MUXL[20:16]
00111
GPINT7 (1)
INT_08
MUXL[25:21]
01000
EDMAINT
INT_09
MUXL[30:26]
01001
EMUDTDMA
INT_10
MUXH[4:0]
00011
SDINT
INT_11
MUXH[9:5]
01010
EMURTDXRX
INT_12
MUXH[14:10]
01011
EMURTDXTX
INT_13
MUXH[20:16]
00000
DSPINT
INT_14
MUXH[25:21]
00001
TINT0
INT_15
MUXH[30:26]
00010
TINT1
(1)
62
Interrupt events GPINT4, GPINT5, GPINT6, and GPINT7 are outputs from the GPIO module (GP).
They originate from the device pins GP[4](EXT_INT4)/AMUTEIN1, GP[5](EXT_INT5)/AMUTEIN0,
GP[6](EXT_INT6), and GP[7](EXT_INT7). These pins can be used as edge-sensitive EXT_INTx with
polarity controlled by the External Interrupt Polarity Register (EXTPOL.[3:0]). The corresponding pins
must first be enabled in the GPIO module by setting the corresponding enable bits in the GP Enable
Register (GPEN.[7:4]), and configuring them as inputs in the GP Direction Register (GPDIR.[7:4]).
These interrupts can be controlled through the GPIO module in addition to the simple EXTPOL.[3:0]
bits. For more information on interrupt control via the GPIO module, see the TMS320C6000™ DSP
General-Purpose Input/Output (GPIO) Reference Guide (literature number SPRU584).
REGISTER INFORMATION
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Table 7-4. Interrupt Selector
INTERRUPT SELECTOR VALUE
(BINARY)
INTERRUPT EVENT
00000
DSPINT
HPI
00001
TINT0
Timer 0
00010
TINT1
Timer 1
(1)
7.4
MODULE
00011
SDINT
EMIF
00100
GPINT4 (1)
GPIO
00101
GPINT5 (1)
GPIO
00110
GPINT6
(1)
GPIO
00111
GPINT7 (1)
GPIO
01000
EDMAINT
EDMA
01001
EMUDTDMA
Emulation
01010
EMURTDXRX
Emulation
01011
EMURTDXTX
Emulation
01100
XINT0
McBSP0
01101
RINT0
McBSP0
01110
XINT1
McBSP1
01111
RINT1
McBSP1
10000
GPINT0
GPIO
10001
Reserved
—
10010
Reserved
—
10011
Reserved
—
10100
Reserved
—
10101
Reserved
—
10110
I2CINT0
I2C0
10111
I2CINT1
I2C1
11000
Reserved
—
11001
Reserved
—
11010
Reserved
—
11011
Reserved
—
11100
AXINT0
McASP0
11101
ARINT0
McASP0
11110
AXINT1
McASP1
11111
ARINT1
McASP1
Interrupt events GPINT4, GPINT5, GPINT6, and GPINT7 are outputs from the GPIO module (GP).
They originate from the device pins GP[4](EXT_INT4)/AMUTEIN1, GP[5](EXT_INT5)/AMUTEIN0,
GP[6](EXT_INT6), and GP[7](EXT_INT7). These pins can be used as edge-sensitive EXT_INTx with
polarity controlled by the External Interrupt Polarity Register (EXTPOL.[3:0]). The corresponding pins
must first be enabled in the GPIO module by setting the corresponding enable bits in the GP Enable
Register (GPEN.[7:4]), and configuring them as inputs in the GP Direction Register (GPDIR.[7:4]).
These interrupts can be controlled through the GPIO module in addition to the simple EXTPOL.[3:0]
bits. For more information on interrupt control via the GPIO module, see the TMS320C6000™ DSP
General-Purpose Input/Output (GPIO) Reference Guide (literature number SPRU584).
External Interrupt Sources
The C6713/13B device supports many external interrupt sources as indicated in Table 7-5. Control of the
interrupt source is done by the associated module and is made available by enabling the corresponding
binary interrupt selector value (see Table 7-4 shaded rows). Because of pin multiplexing and module
usage, not all external interrupt sources are available at the same time.
REGISTER INFORMATION
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Table 7-5. External Interrupt Sources and Peripheral Module Control
7.5
PIN NAME
INTERRUPT EVENT
MODULE
GP[15]
GPINT0
GPIO
GP[14]
GPINT0
GPIO
GP[13
GPINT0
GPIO
GP[12]
GPINT0
GPIO
GP[11]
GPINT0
GPIO
GP[10]
GPINT0
GPIO
GP[9]
GPINT0
GPIO
GP[8]
GPINT0
GPIO
GP[7]
GPINT0 or GPINT7
GPIO
GP[6]
GPINT0 or GPINT6
GPIO
GP[5]
GPINT0 or GPINT5
GPIO
GP[4]
GPINT0 or GPINT4
GPIO
GP[3]
GPINT0
GPIO
GP[2]
GPINT0
GPIO
GP[1]
GPINT0
GPIO
GP[0]
GPINT0
GPIO
EDMA Module and EDMA Selector
The C67x EDMA supports up to 16 EDMA channels. Four of the 16 channels (channels 8−11) are
reserved for EDMA chaining, leaving 12 EDMA channels available to service peripheral devices.
The EDMA selector registers that control the EDMA channels servicing peripheral devices are located at
addresses 0x01A0FF00 (ESEL0), 0x01A0FF04 (ESEL1), and 0x01A0FF0C (ESEL3). These EDMA
selector registers control the mapping of the EDMA events to the EDMA channels. Each EDMA event has
an assigned EDMA selector code (see Table 7-7). By loading each EVTSELx register field with an EDMA
selector code, users can map any desired EDMA event to any specified EDMA channel. Table 7-6 lists the
default EDMA selector value for each EDMA channel.
See Table 7-8 and Table 7-11 for the EDMA Event Selector registers and their associated bit descriptions.
64
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Table 7-6. EDMA Channels
EDMA SELECTOR
CONTROL REGISTER
DEFAULT SELECTOR
VALUE (BINARY)
DEFAULT EDMA EVENT
0
ESEL0[5:0]
000000
DSPINT
1
ESEL0[13:8]
000001
TINT0
2
ESEL0[21:16]
000010
TINT1
3
ESEL0[29:24]
000011
SDINT
4
ESEL1[5:0]
000100
GPINT4
5
ESEL1[13:8]
000101
GPINT5
6
ESEL1[21:16]
000110
GPINT6
7
ESEL1[29:24]
000111
GPINT7
8
—
—
TCC8 (Chaining)
9
—
—
TCC9 (Chaining)
10
—
—
TCC10 (Chaining)
EDMA CHANNEL
11
—
—
TCC11 (Chaining)
12
ESEL3[5:0]
001100
XEVT0
13
ESEL3[13:8]
001101
REVT0
14
ESEL3[21:16]
001110
XEVT1
15
ESEL3[29:24]
001111
REVT1
REGISTER INFORMATION
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Table 7-7. EDMA Selector
EDMA SELECTOR CODE
(BINARY)
EDMA EVENT
000000
DSPINT
HPI
000001
TINT0
TIMER0
000010
TINT1
TIMER1
000011
SDINT
EMIF
000100
GPINT4
GPIO
000101
GPINT5
GPIO
000110
GPINT6
GPIO
000111
GPINT7
GPIO
001000
GPINT0
GPIO
001001
GPINT1
GPIO
001010
GPINT2
GPIO
001011
GPINT3
GPIO
001100
XEVT0
McBSP0
001101
REVT0
McBSP0
001110
XEVT1
McBSP1
001111
REVT1
McBSP1
010000−011111
Reserved
100000
AXEVTE0
McASP0
100001
AXEVTO0
McASP0
100010
AXEVT0
McASP0
100011
AREVTE0
McASP0
100100
AREVTO0
McASP0
100101
AREVT0
McASP0
100110
AXEVTE1
McASP1
100111
AXEVTO1
McASP1
101000
AXEVT1
McASP1
101001
AREVTE1
McASP1
101010
AREVTO1
McASP1
101011
AREVT1
McASP1
101100
I2CREVT0
I2C0
101101
I2CXEVT0
I2C0
101110
I2CREVT1
I2C1
101111
I2CXEVT1
I2C1
110000
GPINT8
GPIO
110001
GPINT9
GPIO
110010
GPINT10
GPIO
110011
GPINT11
GPIO
110100
GPINT12
GPIO
110101
GPINT13
GPIO
110110
GPINT14
GPIO
110111
GPINT15
111000−111111
66
MODULE
GPIO
Reserved
REGISTER INFORMATION
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Table 7-8. EDMA Event Selector Registers (ESEL0 Register (0x01A0 FF00)
31
30
29
28
27
24
23
22
21
20
19
Reserved
EVTSEL3
Reserved
EVTSEL2
R–0
R/W−00 0011b
R−0
R/W−00 0010b
15
14
13
12
11
8
7
6
5
4
3
Reserved
EVTSEL1
Reserved
EVTSEL0
R–0
R/W−00 0001b
R−0
R/W−00 0000b
16
0
Legend: R = Read only, R/W = Read/write, -n = value at reset
Table 7-9. EDMA Event Selector Registers—ESEL1 Register (0x01A0 FF04)
31
30
29
28
27
24
23
22
21
20
19
Reserved
EVTSEL7
Reserved
EVTSEL6
R–0
R/W−00 0111b
R−0
R/W−00 0110b
15
14
13
12
11
8
7
6
5
4
3
Reserved
EVTSEL5
Reserved
EVTSEL4
R–0
R/W−00 0101b
R−0
R/W−00 0100b
16
0
Legend: R = Read only, R/W = Read/write, -n = value at reset
Table 7-10. EDMA Event Selector Registers—ESEL3 Register (0x01A0 FF0C)
31
30
29
28
27
24
23
22
21
20
19
Reserved
EVTSEL15
Reserved
EVTSEL14
R–0
R/W−00 1111b
R−0
R/W−00 1110b
15
14
13
12
11
8
7
6
5
4
3
Reserved
EVTSEL13
Reserved
EVTSEL12
R–0
R/W−00 1101b
R−0
R/W−00 1100b
16
0
Legend: R = Read only, R/W = Read/write, -n = value at reset
Table 7-11. EDMA Event Selection Registers (ESEL0, ESEL1, and ESEL3) Description
BIT NO.
NAME
31:30
23:22
15:14
7:6
Reserved
Reserved. Read only, writes have no effect.
EVTSELx
EDMA event selection bits for channel x. Allows mapping of the EDMA events to the EDMA channels.
abc
The EVTSEL0 through EVTSEL15 bits correspond to channels 0 to 15, respectively. These EVTSELx
fields are user selectable. By configuring the EVTSELx fields to the EDMA selector value of the desired
EDMA sync event number (see Table 7-7), users can map any EDMA event to the EDMA channel.
abc
For example, if EVTSEL15 is programmed to 00 0001b (the EDMA selector code for TINT0), channel 15
is triggered by Timer 0 TINT0 events.
29:24
21:16
13:8
5:0
DESCRIPTION
REGISTER INFORMATION
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PLL and PLL Controller
The 320C6713/13B includes a PLL and a flexible PLL controller peripheral consisting of a prescaler (D0)
and four dividers (OSCDIV1, D1, D2, and D3). The PLL controller is able to generate different clocks for
different parts of the system (that is, DSP core, peripheral data bus, external memory interface, McASP,
and other peripherals). Figure 8-1 shows the PLL, the PLL controller, and the clock generator logic.
PLLHV
+3.3 V
C1
EMI filter
10 mF0
C2
.1 mF
CLKMODE0
PLLOUT
CLKIN
PLLREF
DIVIDER D0
1
0
Reserved
/1, /2,
..., /32
PLLEN (PLL_CSR.[0])
PLL
x4 to x25
ENA
(A)
1
DIVIDER D1
0
/1, /2,
..., /32
ENA
D1EN (PLLDIV1.[15])
D0EN (PLLDIV0.[15])
OSCDIV1
For Use
in System
CLKOUT3
/1, /2,
..., /32
ENA
OD1EN (OSCDIV1.[15])
D2EN (PLLDIV2.[15])
AUXCLK
(Internal Clock Source
to McASP0 and McASP1)
D3EN (PLLDIV3.[15])
SYSCLK1
(DSP Core)
DIVIDER D2
(A)
/1, /2,
..., /32
ENA
SYSCLK2
(Peripherals)
DIVIDER D3
/1, /2,
..., /32
SYSCLK3
ENA
ECLKIN
(EMIF Clock Input)
1
0
EKSRC Bit
(DEVCFG.[4])
EMIF
C6713/13B DSPs
ECLKOUT
A.
B.
C.
D.
E.
Dividers D1 and D2 must never be disabled. Never write a '0' to the D1EN or D2EN bits in the PLLDIV1 and PLLDIV2
registers.
Place all PLL external components (C1, C2, and the EMI filter) as close to the C67x DSP device as possible. For the
best performance, TI recommends that all the PLL external components be on a single side of the board without
jumpers, switches, or components other than the ones shown.
For reduced PLL jitter, maximize the spacing between switching signals and the PLL external components (C1, C2,
and the EMI filter).
The 3.3-V supply for the EMI filter must be from the same 3.3-V power plane supplying the I/O voltage, DVDD.
EMI filter manufacturer TDK part number ACF451832-333, -223, -153, -103. Panasonic part number EXCCET103U.
Figure 8-1. PLL and Clock Generator Logic
68
PLL and PLL Controller
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8.1
PLL Registers
The PLL reset time is the amount of wait time needed when resetting the PLL (writing PLLRST = 1), for
the PLL to properly reset, before bringing the PLL out of reset (writing PLLRST = 0). For the PLL reset
time value, see Table 8-1. The PLL lock time is the amount of time from when PLLRST = 0 with PLLEN =
0 (PLL out of reset, but still bypassed) to when the PLLEN bit can be safely changed to 1 (switching from
bypass to the PLL path); see Table 8-1 and Figure 8-1.
Under some operating conditions, the maximum PLL lock time may vary from the specified typical value.
For the PLL lock time values, see Table 8-1.
Table 8-1. PLL Lock and Reset Times
MIN
PLL lock time
PLL reset time
TYP
MAX
UNIT
75
187.5
μs
125
ns
Table 8-2 shows the C6713/13B device CLKOUT signals, how and by what register control bits they are
derived, and what is the default settings. For more details on the PLL, see the PLL and Clock Generator
Logic diagram (Figure 8-1).
Table 8-2. CLKOUT Signals, Default Settings, and Control
CLOCK OUTPUT
SIGNAL NAME
DEFAULT SETTING
(ENABLED or DISABLED)
CONTROL BIT(s)
(Register)
CLKOUT2
ON (ENABLED)
D2EN = 1 (PLLDIV2.[15])
CK2EN = 1 (EMIF GBLCTL.[3])
CLKOUT3
ON (ENABLED)
OD1EN = 1 (OSCDIV1.[15])
ECLKOUT
ON (ENABLED);
derived from SYSCLK3
EKSRC = 0 (DEVCFG.[4])
EKEN = 1 (EMIF GBLCTL.[5])
DESCRIPTION
SYSCLK2 selected [default]
Derived from CLKIN
SYSCLK3 selected [default].
To select ECLKIN source:
EKSRC = 1 (DEVCFG.[4]) and
EKEN = 1 (EMIF GBLCTL.[5])
The input clock (CLKIN) is directly available to the McASP modules as AUXCLK for use as an internal
high-frequency clock source. The input clock (CLKIN) may also be divided down by a programmable
divider OSCDIV1 (/1, /2, /3, ..., /32) and output on the CLKOUT3 pin for other use in the system.
Figure 8-1 shows that the input clock source may be divided down by divider PLLDIV0 (/1, /2, ..., /32) and
then multiplied up by a factor of x4, x5, x6, and so on, up to x25.
Either the input clock (PLLEN = 0) or the PLL output (PLLEN = 1) then serves as the high-frequency
reference clock for the rest of the DSP system. The DSP core clock, the peripheral bus clock, and the
EMIF clock may be divided down from this high-frequency clock (each with a unique divider). For
example, with a 30-MHz input if the PLL output is configured for 450 MHz, the DSP core may be operated
at 225 MHz (/2), while the EMIF may be configured to operate at a rate of 75 MHz (/6). Note that there is
a specific minimum and maximum reference clock (PLLREF) and output clock (PLLOUT) for the block
labeled PLL in Figure 8-1, as well as for the DSP core, peripheral bus, and EMIF. The clock generator
must not be configured to exceed any of these constraints (certain combinations of external clock input,
internal dividers, and PLL multiply ratios might not be supported). See Table 8-3 for the PLL clocks input
and output frequency ranges.
PLL and PLL Controller
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Table 8-3. PLL Clock Frequency Ranges (1)
CLOCK SIGNAL
(2)
MIN
MAX
UNIT
PLLREF (PLLEN = 1)
12
100
MHz
140
600
MHz
SYSCLK1
—
Device speed (DSP core)
MHz
SYSCLK3 (EKSRC = 0)
—
100
MHz
—
(3)
MHz
PLLOUT
AUXCLK
(1)
(2)
(3)
50
SYSCLK2 rate must be exactly half of SYSCLK1.
See also the Electrical Specification (timing requirements and switching characteristics parameters) in
the Input and Output Clocks section of this data sheet.
When the McASP module is not used, the AUXCLK maximum frequency can be any frequency up to
the CLKIN maximum frequency.
The EMIF itself may be clocked by an external reference clock via the ECLKIN pin or can be generated
on-chip as SYSCLK3. SYSCLK3 is derived from divider D3 off of PLLOUT (see Figure 8-1). The EMIF
clock selection is programmable via the EKSRC bit in the DEVCFG register.
The settings for the PLL multiplier and each of the dividers in the clock generation block may be
reconfigured via software at run time. If either the input to the PLL changes due to D0, CLKMODE0, or
CLKIN, or if the PLL multiplier is changed, then software must enter bypass first and stay in bypass until
the PLL has had enough time to lock (see electrical specifications). For the programming procedure, see
the TMS320C6000™ DSP Software-Programmable Phase-Locked Loop (PLL) Controller Reference Guide
(literature number SPRU233).
SYSCLK2 is the internal clock source for peripheral bus control. SYSCLK2 (Divider D2) must be
programmed to be half of the SYSCLK1 rate. For example, if D1 is configured to divide-by-2 mode (/2),
then D2 must be programmed to divide-by-4 mode (/4). SYSCLK2 is also tied directly to CLKOUT2 pin
(see Figure 8-1).
During the programming transition of Divider D1 and Divider D2 (resulting in SYSCLK1 and SYSCLK2
output clocks, see Figure 8-1), the order of programming the PLLDIV1 and PLLDIV2 registers must be
observed to ensure that SYSCLK2 always runs at half the SYSCLK1 rate or slower. For example, if the
divider ratios of D1 and D2 are to be changed from /1, /2 (respectively) to /5, /10 (respectively) then, the
PLLDIV2 register must be programmed before the PLLDIV1 register. The transition ratios become /1, /2;
/1, /10; and then /5, /10. If the divider ratios of D1 and D2 are to be changed from /3, /6 to /1, /2, then the
PLLDIV1 register must be programmed before the PLLDIV2 register. The transition ratios, for this case,
become /3, /6; /1, /6; and then /1, /2. The final SYSCLK2 rate must be exactly half of the SYSCLK1 rate.
Note that Divider D1 and Divider D2 must always be enabled (that is, D1EN and D2EN bits are set to 1 in
the PLLDIV1 and PLLDIV2 registers).
The PLL Controller registers should be modified only by the CPU or via emulation. The HPI should not be
used to directly access the PLL Controller registers.
For detailed information on the clock generator (PLL Controller registers) and the associated software bit
descriptions, see Table 8-4 through Table 8-11.
Table 8-4. PLL Control/Status Register (PLLCSR) (0x01B7 C100)
31
28
27
24
23
20
19
16
Reserved
R-0
15
12
11
8
Reserved
R-0
7
6
5
Stable
Reserved
R–x
4
R-0
3
PLLRS
T
RW−1
2
Reserv
ed
R/W−0
1
0
PLLPWRD
N
PLLEN
R/W−0b
RW−0
Legend: R = Read only, R/W = Read/write, -n = value at reset
70
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Table 8-5. PLL Control/Status Register (PLLCSR) Description
BIT NO.
NAME
DESCRIPTION
31:7
Reserved
6
STABLE
Reserved. Read only, writes have no effect.
Clock input stable. This bit indicates if the clock input has stabilized.
0: Clock input not yet stable. Clock counter is not finished counting (default).
1: Clock input stable
5:4
Reserved
3
PLLRST
2
Reserved
Reserved. Read only, writes have no effect.
Asserts RESET to PLL
0: PLL reset released
1: PLL reset asserted (default)
Reserved. The user must write a 0 to this bit.
Select PLL power down
1
PLLPWRDN
0: PLL operational (default)
1: PLL placed in power-down state
PLL mode enable
0
0: Bypass mode (default). PLL disabled Divider D0 and PLL are bypassed.
SYSCLK1/SYSCLK2/SYSCLK3 are divided down directly from input reference clock.
PLLEN
1: PLL enabled Divider D0 and PLL are not bypassed. SYSCLK1/SYSCLK2/SYSCLK3 are
divided down from PLL output.
Table 8-6. PLL Multiplier (PLLM) Control Register (0x01B7 C110)
31
28
27
24
23
20
19
16
Reserved
R-0
15
12
11
8
7
5
4
0
Reserved
PLLM
R-0
R/W−0 0111
Legend: R = Read only, R/W = Read/write, -n = value at reset
PLL and PLL Controller
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Table 8-7. PLL Multiplier (PLLM) Control Register Description
BIT NO.
NAME
31:5
Reserved
DESCRIPTION
Reserved. Read only, writes have no effect.
PLL multiply mode [default is x7 (0 0111)]
4:0
PLLM
00000 = Reserved
10000 = x16
00001 = Reserved
10001 = x17
00010 = Reserved
10010 = x18
00011 = Reserved
10011 = x19
00100 = x4
10100 = x20
00101 = x5
10101 = x21
00110 = x6
10110 = x22
00111 = x7
10111 = x23
01000 = x8
11000 = x24
01001 = x9
11001 = x25
01010 = x10
11010 = Reserved
01011 = x11
11011 = Reserved
01100 = x12
11100 = Reserved
01101 = x13
11101 = Reserved
01110 = x14
11110 = Reserved
01111 = x15
11111 = Reserved
PLLM select values 00000 through 00011 and 11010 through 11111 are not supported.
Table 8-8. PLL Wrapper Divider x Registers (PLLDIV0, PLLDIV1, PLLDIV2, and PLLDIV3)
(0x01B7 C114, 0x01B7 C118, 0x01B7 C11C, and 0x01B7 C120, respectively)
31
28
27
24
23
20
19
16
Reserved
R-0
15
14
12
11
8
7
5
4
0
DxEN
Reserved
PLLDIVx
R/W−1
R−0
R/W−x xxxx (1)
Legend: R = Read only, R/W = Read/write, -n = value at reset
(1)
Default values for the PLLDIV0, PLLDIV1, PLLDIV2, and PLLDIV3 bits are /1 (0 0000), /1 (0 0000), /2 (0 0001), and /2 (0 0001),
respectively.
CAUTION
D1 and D2 should never be disabled. D3 should only be disabled if ECLKIN is used.
Table 8-9. PLL Wrapper Divider x Registers
(Prescaler Divider D0 and Post-Scaler Dividers D1, D2, and D3) Description (1)
BIT NO.
NAME
31:16
Reserved
DESCRIPTION
Reserved. Read only, writes have no effect.
Divider Dx enable (where x denotes 0 through 3).
15
DxEN
0: Divider x disabled. No clock output
1: Divider x enabled (default)
These divider-enable bits are device specific and must be set to 1 to enable.
(1)
72
Note that SYSCLK2 must run at half the rate of SYSCLK1. Therefore, the divider ratio of D2 must be two times slower than D1. For
example, if D1 is set to /2, then D2 must be set to /4.
PLL and PLL Controller
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Table 8-9. PLL Wrapper Divider x Registers
(Prescaler Divider D0 and Post-Scaler Dividers D1, D2, and D3) Description(1) (continued)
BIT NO.
NAME
14:5
Reserved
DESCRIPTION
Reserved. Read only, writes have no effect.
PLL divider ratio (default values for the PLLDIV0, PLLDIV1, PLLDIV2, and PLLDIV3 bits are /1, /1, /2,
and /2, respectively).
4:0
PLLDIVx
00000 = /1
10000 = /17
00001 = /2
10001 = /18
00010 = /3
10010 = /19
00011 = /4
10011 = /20
00100 = /5
10100 = /21
00101 = /6
10101 = /22
00110 = /7
10110 = /23
00111 = /8
10111 = /24
01000 = /9
11000 = /25
01001 = /10
11001 = /26
01010 = /11
11010 = /27
01011 = /12
11011 = /28
01100 = /13
11100 = /29
01101 = /14
11101 = /30
01110 = /15
11110 = /31
01111 = /16
11111 = /32
Table 8-10. Oscillator Divider 1 (OSCDIV1) Register (0x01B7 C124)
31
28
27
24
23
20
19
16
Reserved
R-0
15
14
12
11
8
7
5
4
0
OD1EN
Reserved
OSCDIV1
R/W−1
R−0
R/W−0 0111
Legend: R = Read only, R/W = Read/write, -n = value at reset
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Table 8-11. Oscillator Divider 1 (OSCDIV1) Register Description
BIT NO.
NAME
31:16
Reserved
15
OD1EN
DESCRIPTION
Reserved. Read-only; writes have no effect.
Oscillator Divider 1 enable.
0: Oscillator Divider 1 disabled
1: Oscillator Divider 1 enabled (default)
14:5
Reserved
Reserved. Read only, writes have no effect.
Oscillator Divider 1 ratio [default is /8 (0 0111)]
4:0
74
OSCDIV1
00000 = /1
10000 = /17
00001 = /2
10001 = /18
00010 = /3
10010 = /19
00011 = /4
10011 = /20
00100 = /5
10100 = /21
00101 = /6
10101 = /22
00110 = /7
10110 = /23
00111 = /8
10111 = /24
01000 = /9
11000 = /25
01001 = /10
11001 = /26
01010 = /11
11010 = /27
01011 = /12
11011 = /28
01100 = /13
11100 = /29
01101 = /14
11101 = /30
01110 = /15
11110 = /31
01111 = /16
11111 = /32
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9
MULTICHANNEL AUDIO SERIAL PORT (McASP) PERIPHERALS
The 320C6713/13B device includes two multichannel audio serial port (McASP) interface peripherals
(McASP1 and McASP0). The McASP is a serial port optimized for the needs of multichannel audio
applications. With two McASP peripherals, the 320C6713/13B device is capable of supporting two
completely independent audio zones simultaneously.
Each McASP consists of a transmit and receive section. These sections can operate completely
independently with different data formats, separate master clocks, bit clocks, and frame syncs or
alternatively, the transmit and receive sections may be synchronized. Each McASP module also includes
a pool of 16 shift registers that may be configured to operate as either transmit data, receive data, or
general-purpose I/O (GPIO).
The transmit section of the McASP can transmit data in either a time division multiplexed (TDM)
synchronous serial format or in a digital audio interface (DIT) format where the bit stream is encoded for
S/PDIF, AES-3, IEC-60958, and CP-430 transmission. The receive section of the McASP supports the
TDM synchronous serial format.
Each McASP can support one transmit data format (either a TDM format or DIT format) and one receive
format at a time. All transmit shift registers use the same format and all receive shift registers use the
same format. However, the transmit and receive formats need not be the same.
Both the transmit and receive sections of the McASP also support burst mode, which is useful for
non-audio data (for example, passing control information between two DSPs).
The McASP peripherals have additional capability
detection/handling, as well as error management.
9.1
for
flexible
clock
generation,
and
error
McASP Block Diagram
Figure 9-1 shows the major blocks along with external signals of the 320C6713/13B McASP1 and
McASP0 peripherals, and shows the eight serial data [AXR] pins for each McASP. Each McASP also
includes full general-purpose I/O (GPIO) control, so any pins not needed for serial transfers can be used
for general-purpose I/O.
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McASP0
McASP1
Transmit
Clock
Generator
Receive
Clock Check
(HighFrequency)
Receive
Clock
Generator
Transmit
Data
Formatter
Receive
Frame Sync
Generator
DMA Receive
INDIVIDUALLY PROGRAMMABLE TX/RX/GPIO
DMA Transmit
Error
Detect
Receive
Data
Formatter
Transmit
Frame Sync
Generator
AHCLKX0
ACLKX0
Transmit
Clock Check
(HighFrequency)
Transmit
Clock
Generator
AMUTE0
AMUTEIN0
Error
Detect
AHCLKR0
ACLKR0
Receive
Clock Check
(HighFrequency)
Receive
Clock
Generator
Transmit
Data
Formatter
Receive
Frame Sync
Generator
AFSR0
Serializer 0
AXR0[0]
Serializer 1
AXR0[1]
Serializer 2
AXR0[2]
Serializer 3
AXR0[3]
Serializer 4
AXR0[4]
Serializer 5
AXR0[5]
Serializer 6
AXR0[6]
Serializer 7
AXR0[7]
GPIO
Control
INDIVIDUALLY PROGRAMMABLE TX/RX/GPIO
Transmit
Clock Check
(HighFrequency)
DIT
RAM
AFSX0
DMA Transmit
Transmit
Frame Sync
Generator
DMA Receive
DIT
RAM
AFSX1
AHCLKX1
ACLKX1
AMUTE1
AMUTEIN1
AHCLKR1
ACLKR1
AFSR1
Serializer 0
AXR1[0]
Serializer 1
AXR1[1]
Serializer 2
AXR1[2]
Serializer 3
AXR1[3]
Serializer 4
AXR1[4]
Serializer 5
AXR1[5]
Serializer 6
AXR1[6]
Serializer 7
AXR1[7]
Receive
Data
Formatter
GPIO
Control
Figure 9-1. McASP0 and McASP1 Configuration
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Multichannel Time Division Multiplexed (TDM) Synchronous Transfer Mode
The McASP supports a multichannel TDM synchronous transfer mode for both transmit and receive.
Within this transfer mode, a wide variety of serial data formats are supported, including formats compatible
with devices using the Inter-Integrated Sound (IIS) protocol.
TDM synchronous transfer mode is typically used when communicating between integrated circuits, such
as between a DSP and one or more ADC, DAC, codec, or S/PDIF receiver devices. In multichannel
applications, it is typical to find several devices operating synchronized with each other. For example, to
provide six analog outputs, three stereo DAC devices would be driven with the same bit clock and frame
sync, but each stereo DAC would use a different McASP serial data pin carrying stereo data (two TDM
time slots, left and right).
The TDM synchronous serial transfer mode utilizes several control signals and one or more serial data
signals:
• A bit clock signal (ACLKX for transmit, ACKLR for receive)
• A frame sync signal (AFSX for transmit, AFSR for receive)
• An (optional) high-frequency master clock (AHCLKX for transmit, AHCLKR for receive) from which the
bit clock is derived
• One or more serial data pins (AXR for transmit and for receive)
Except for the optional high-frequency master clock, all of the signals in the TDM synchronous serial
transfer mode protocol are synchronous to the bit clocks (ACLKX and ACLKR).
In the TDM synchronous transfer mode, the McASP continually transmits and receives data periodically
(since audio ADCs and DACs operate at a fixed-data rate). The data is organized into frames, and the
beginning of a frame is marked by a frame sync pulse on the AFSX, AFSR pin.
In a typical audio system, one frame is transferred per sample period. To support multiple channels, the
choices are to either include more time slots per frame (and therefore operate with a higher bit clock) or to
keep the bit clock period constant and use additional data pins to transfer the same number of channels.
For example, a particular six-channel DAC might require three McASP serial data pins; transferring two
channels of data on each serial data pin during each sample period (frame). Another similar DAC may be
designed to use only a single McASP serial data pin, but clocked three times faster and transferring six
channels of data per sample period. The McASP is flexible enough to support either type of DAC, but a
transmitter cannot be configured to do both at the same time.
For multiprocessor applications, the McASP supports any number of time slots per frame (between 2 and
32), and includes the ability to disable transfers during specific time slots.
In addition, to support S/PDIF, AES-3, IEC-60958, and CP-430 receiver chips whose natural block
(McASP frame) size is 384 samples; the McASP receiver supports a 384 time slot mode. The advantage
to using the 384 time slot mode is that interrupts may be generated synchronous to the S/PDIF, AES-3,
IEC-60958, and CP-430 receivers; for example, the last slot interrupt.
9.3
Burst Transfer Mode
The McASP also supports a burst transfer mode, which is useful for non-audio data (for example, passing
control information between two DSPs). Burst transfer mode uses a synchronous serial format similar to
TDM, except the frame sync is generated for each data word transferred. In addition, frame sync
generation is not periodic or time driven as in TDM mode, but rather data driven.
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Supported Bit Stream Formats for TDM and Burst Transfer Modes
The serial data pins support a wide variety of formats. In the TDM and burst synchronous modes, the data
may be transmitted/received with the following options:
• Time slots per frame: 1 (burst/data driven), or 2,3...32 (TDM/time driven)
• Time slot size: 8, 12, 16, 20, 24, 28, 32 bits per time slot
• Data size: 8, 12, 16, 20, 24, 28, 32 bits (must be less than or equal to time slot)
• Data alignment within time slot: left or right justified
• Bit order: MSB or LSB first
• Unused bits in time slot: Padded with 0, 1 or extended with value of another bit
• Time slot delay from frame sync: 0-, 1-, or 2-bit delay
The data format can be programmed independently for transmit and receive, and for McASP0 versus
McASP1. In addition, the McASP can automatically realign the data as processed natively by the DSP
(any format on a nibble boundary) adjusting the data in hardware to any of the supported serial bit stream
formats (TDM, burst, and DIT modes). This adjustment reduces the amount of bit manipulation that the
DSP must perform and simplifies software architecture.
9.5
Digital Audio Interface Transmitter (DIT) Transfer Mode (Transmitter Only)
The McASP transmit section may also be configured in DIT mode where it outputs data formatted for
transmission over an S/PDIF, AES-3, IEC-60958, or CP-430 standard link. These standards encode the
serial data such that the equivalent of clock and frame sync are embedded within the data stream. DIT
transfer mode is used as an interconnect between audio components and can transfer multichannel digital
audio data over a single optical or coaxial cable.
From an internal DSP standpoint, the McASP operation in DIT transfer mode is similar to the two-time-slot
TDM mode, but the data transmitted is output as a bi-phase mark encoded bit stream with preamble,
channel status, user data, validity, and parity automatically stuffed into the bit stream by the McASP
module. The McASP includes separate validity bits for even/odd subframes and two 384-bit register file
modules to hold channel status and user data bits.
DIT mode requires (at a minimum):
• One serial data pin (if the AUXCLK is used as the reference (see Figure 8-1)
OR
• One serial data pin plus either the AHCLKX or ACLKX pin (if an external clock is needed)
If additional serial data pins are used, each McASP may be used to transmit multiple encoded bit streams
(one per pin). However, the bit streams will all be synchronized to the same clock and the user data,
channel status, and validity information carried by each bit stream will be the same for all bit streams
transmitted by the same McASP module.
The McASP can also automatically realign the data as processed by the DSP (any format on a nibble
boundary) in DIT mode; reducing the amount of bit manipulation that the DSP must perform and
simplifying software architecture.
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9.6
McASP Flexible Clock Generators
The McASP transmit and receive clock generators are identical. Each clock generator can accept a
high-frequency master clock input (on the AHCLKX and AHCLKR pins).
The transmit and receive bit clocks (on the ACLKX and ACLKR pins) can also be sourced externally or
can be sourced internally by dividing down the high-frequency master clock input (programmable factor /1,
/2, /3, ... /4096). The polarity of each bit clock is individually programmable.
The frame sync pins are AFSX (transmit) and AFSR (receive). A typical usage for these pins is to carry
the left-right clock (LRCLK) signal when transmitting and receiving stereo data. The frame sync signals
are individually programmable for either internal or external generation, either bit or slot length, and either
rising or falling edge polarity.
Some examples of the things that a system designer can use the McASP clocking flexibility for are:
• Input a high-frequency master clock (for example, 512 fS of the receiver) and receive with an internally
generated bit clock ratio of /8, while transmitting with an internally generated bit clock ratio of /4 or /2.
(An example application would be to receive data from a DVD at 48 kHz but output up-sampled or
decoded audio at 96 kHz or 192 kHz.)
• Transmit/receive data based on sample rate (for example, 44.1 kHz) using McASP0 while transmitting
and receiving at a different sample rate (for example, 48 kHz) on McASP1.
• Use the DSP on-board AUXCLK to supply the system clock when the input source is an A/D converter.
9.7
McASP Error Handling and Management
To support the design of a robust audio system, the McASP module includes error-checking capability for
the serial protocol, data underrun, and data overrun. In addition, each McASP includes a timer that
continually measures the high-frequency master clock every 32 SYSCLK2 clock cycles. The timer value
can be read to get a measurement of the high-frequency master clock frequency and has a min-max
range setting that can raise an error flag if the high-frequency master clock goes out of a specified range.
The user would read the high-frequency transmit master clock measurement (AHCLKX0 or AHCLKX1) by
reading the XCNT field of the XCLKCHK register and the user would read the high-frequency receive
master clock measurement (AHCLKR0 or AHCLKR1) by reading the RCNT field of the RCLKCHK
register.
Upon the detection of any one or more of the above errors (software selectable) or the assertion of the
AMUTE_IN pin, the AMUTE output pin may be asserted to a high or low level (selectable) to immediately
mute the audio output. In addition, an interrupt may be generated if enabled based on any one or more of
the error sources.
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McASP Interrupts and EDMA Events
The McASP transmitter and receiver sections each generate an event on every time slot. This event can
be serviced by an interrupt or by the EDMA controller.
When using interrupts to service the McASP, each shift register buffer has a unique address in the McASP
registers space (see Table 4-1).
When using the EDMA to service the McASP, the McASP DATA Port space, shown in Table 4-1, is
accessed. In this case, the address least-significant bits are ignored. Writes to any address in this range
access the transmitting buffers in order from lowest (serializer 0) to highest (serializer 15), skipping over
disabled and receiving serializers. Likewise, reads from any address in this space access the receiving
buffers in the same order but skip over disabled and transmitting buffers.
9.9
I2C
Having two I2C modules on the 320C6713/13B simplifies system architecture, since one module may be
used by the DSP to control local peripherals ICs (DACs, ADCs, etc.) while the other may be used to
communicate with other controllers in a system or to implement a user interface.
NOTE
I2C ports are compatible with Philips I2C Specification Revision 2.1 (January 2000).
The 320C6713/13B also includes two I2C serial ports for control purposes. Each I2C port supports:
• Fast mode up to 400 Kbps (no fail-safe I/O buffers)
• Noise filter to remove noise 50 ns or less
• 7- and 10-bit device addressing modes
• Master (transmit/receive) and slave (transmit/receive) functionality
• Events: DMA, interrupt, or polling
• Slew-rate limited open-drain output buffers
Figure 9-2 shows a block diagram of the I2Cx module.
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I2Cx Module
Clock
Prescale
SYSCLK2
From PLL
Clock Generator
I2CPSCx
SCL
Noise
Filter
I2C Clock
Bit Clock
Generator
Control
I2CCLKHx
I2COARx
Own
Address
I2CSARx
Slave
Address
I2CMDRx
Mode
I2CCNTx
Data
Count
I2CCLKLx
Transmit
I2CXSRx
Transmit
Shift
I2CDXRx
Transmit
Buffer
Interrupt/DMA
SDA
I2C Data
Noise
Filter
Receive
I2CIERx
Interrupt
Enable
I2CDRRx
Receive
Buffer
I2CSTRx
Interrupt
Status
I2CRSRx
Receive
Shift
I2CISRCx
Interrupt
Source
NOTE: Shading denotes control/status registers.
Figure 9-2. I2Cx Module Block Diagram
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LOGIC AND POWER SUPPLY
This section discusses the logic and power-supply configuration of the SM320C6713-EP and
SM320C6713B-EP.
10.1 General-Purpose Input/Output (GPIO)
To use the GP[15:0] software-configurable GPIO pins, the GPxEN bits in the GP enable (GPEN) register
and the GPxDIR bits in the GP direction (GPDIR) register must be properly configured.
GPxEN = 1
GP[x] pin is enabled.
GPxDIR = 0
GP[x] pin is an input.
GPxDIR = 1
GP[x] pin is an output.
where x represents one of the 15 through 0 GPIO pins.
Figure 10-1 shows the GPIO enable bits in the GPEN register for the C6713/13B device. To use any of
the GPx pins as general-purpose input/output functions, the corresponding GPxEN bit must be set to 1
(enabled). Default values are device-specific, so refer to Figure 10-1 for the C6713/13B default
configuration.
31
24
23
16
Reserved
R-0
15
14
13
12
11
10
9
8
GP15EN
GP14EN
GP13EN
GP12EN
GP11EN
GP10EN
GP9EN
GP8EN
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
7
6
5
4
3
2
1
0
GP7EN
GP6EN
GP5EN
GP4EN
GP3EN
GP2EN
GP1EN
GP0EN
R/W-1
R/W-1
R/W-1
R/W-1
R/W-0
R/W-0
R/W-0
R/W-0
Legend: R/W = Readable/Writeable; -n = value after reset, -x = undefined value after reset
Figure 10-1. GPIO Enable (GPEN) Register (Hex Address: 01B0 0000)
Figure 10-2 shows the GPIO direction bits in the GPIO Direction (GPDIR) register. This register
determines if a given GPIO pin is an input or an output providing the corresponding GPxEN bit is enabled
(set to 1) in the GPEN register. By default, all the GPIO pins are configured as input pins.
31
24
23
16
Reserved
R-0
15
14
13
12
11
10
9
8
GP15DIR
GP14DIR
GP13DIR
GP12DIR
GP11DIR
GP10DIR
GP9DIR
GP8DIR
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
7
6
5
4
3
2
1
0
GP7DIR
GP6DIR
GP5DIR
GP4DIR
GP3DIR
GP2DIR
GP1DIR
GP0DIR
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
Legend: R/W = Readable/Writeable; -n = value after reset, -x = undefined value after reset
Figure 10-2. GPIO Direction (GPDIR) Register (Hex Address: 01B0 0004)
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For more detailed information on general-purpose inputs/outputs (GPIOs), see the TMS320C6000 DSP
General-Purpose Input/Output (GPIO) Reference Guide (literature number SPRU584).
10.2 Power-Down Mode Logic
Figure 10-3 shows the power-down mode logic on the C6713/13B.
CLKOUT2
Internal Clock Tree
Clock
Distribution
and Dividers
PD1
PD2
PowerDown
Logic
Clock
PLL
IFR
IER
Internal
Peripherals
PWRD CSR
CPU
PD3
320C6713/13B
A.
CLKIN
RESET
External input clocks, with the exception of CLKIN and CLKOUT3, are not gated by the power-down mode logic.
Figure 10-3. Power-Down Mode Logic
10.2.1 Triggering, Wake-Up, and Effects
The device includes a programmable PLL which allows software control of PLL bypass via the PLLEN bit
in the PLLCSR register. With this enhanced functionality come some additional considerations when
entering power-down modes.
The power-down modes (PD2 and PD3) function by disabling the PLL to stop clocks to the C6713 device.
However, if the PLL is bypassed (PLLEN = 0), the device will still receive clocks from the external clock
input (CLKIN). Therefore, bypassing the PLL makes the power-down modes PD2 and PD3 ineffective.
The PLL needs to be enabled by writing a “1” to PLLEN bit (PLLCSR.0) before being able to enter either
PD3 (CSR.11) or PD2 (CSR.10) in order for these modes to have an effect.
For the TMS320C6713B device it is recommended to use the PLLPWDN bit (PLLCSR.1) to enter a deep
power−down state equivalent to PD3 since the PLLPWDN bit takes full advantage of the PLL power−down
feature.
The power-down modes (PD1, PD2 and PD3) and their wake-up methods are programmed by setting the
PWRD field (bits 15−10) of the control status register (CSR). The PWRD field of the CSR is shown in
Figure 10-4 and described in Table 10-1. When writing to the CSR, all bits of the PWRD field should be
set at the same time. Logic 0 should be used when writing to the reserved bit (bit 15) of the PWRD field.
The CSR is discussed in detail in the TMS320C6000 CPU and Instruction Set Reference Guide (literature
number SPRU189).
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31
16
15
14
13
12
11
10
Reserved
Enable or
Non-Enabled
Interrupt Wake
Enabled
Interrupt Wake
PD3
PD2
PD1
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
9
7
8
0
Legend: R/W-x = Read/write reset value
Figure 10-4. PWRD Field of the CSR
A delay of up to nine clock cycles may occur after the instruction that sets the PWRD bits in the CSR
before the PD mode takes effect. As best practice, NOPs should be padded after the PWRD bits are set in
the CSR to account for this delay.
If PD1 mode is terminated by a non-enabled interrupt, the program execution returns to the instruction
where PD1 took effect. If PD1 mode is terminated by an enabled interrupt, the interrupt service routine will
be executed first, then the program execution returns to the instruction where PD1 took effect. In the case
with an enabled interrupt, the GIE bit in the CSR and the NMIE bit in the interrupt enable register (IER)
must also be set for the interrupt service routine to execute; otherwise, execution returns to the instruction
where PD1 took effect upon PD1 mode termination by an enabled interrupt.
PD2 and PD3 modes can only be aborted by device reset. Table 10-1 summarizes all the power-down
modes.
Table 10-1. Characteristics of the Power-Down Modes
PRWD FIELD
(BITS 15−10)
POWER-DOWN
MODE
000000
No power down
001001
PD1
010001
PD1
Wake by an enabled or
non-enabled interrupt
PD2
(1)
011100
PD3 (1)
All others
Reserved
EFFECT ON CHIP OPERATION
—
Wake by an enabled
interrupt
011010
(1)
WAKE-UP METHOD
—
CPU halted (except for the interrupt logic)
Power-down mode blocks the internal clock inputs at the
boundary of the CPU, preventing most of the CPU logic from
switching. During PD1, EDMA transactions can proceed
between peripherals and internal memory.
Wake by a device reset
Output clock from PLL is halted, stopping the internal clock
structure from switching and resulting in the entire chip being
halted. All register and internal RAM contents are preserved.
All functional I/O freeze in the last state when the PLL clock is
turned off.
Wake by a device reset
Input clock to the PLL stops generating clocks. All register and
internal RAM contents are preserved. All functional I/O freeze
in the last state when the PLL clock is turned off. Following
reset, the PLL needs time to relock, just as it does following
power up. Wake-up from PD3 takes longer than wake-up from
PD2 because the PLL needs to be relocked, just as it does
following power up. It is recommended to use the PLLPWDN
bit (PLLCSR.1) as an alternative to PD3.
—
—
When entering PD2 and PD3, all functional I/Os remain in the previous state. However, for peripherals that are asynchronous in nature
or peripherals with an external clock source, output signals may transition in response to stimulus on the inputs. Under these conditions,
peripherals will not operate according to specifications.
10.3 Power-Supply Sequencing
TI DSPs do not require specific power sequencing between the core supply and the I/O supply. However,
systems should be designed to ensure that neither supply is powered up for extended periods of time
(>1 second) if the other supply is below the proper operating voltage.
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10.3.1 System-Level Design Considerations
System-level design considerations, such as bus contention, may require supply sequencing to be
implemented. In this case, the core supply should be powered up before, and powered down after, the I/O
buffers. This is to ensure that the I/O buffers receive valid inputs from the core before the output buffers
are powered up, thus preventing bus contention with other chips on the board.
10.3.2 Power-Supply Design Considerations
A dual-power supply with simultaneous sequencing can be used to eliminate the delay between core and
I/O power up. A Schottky diode can also be used to tie the core rail to the I/O rail (see Figure 10-5).
I/O Supply
DVDD
Schottky
Diode
C6000
DSP
Core Supply
CVDD
VSS
GND
Figure 10-5. Schottky Diode Diagram
Core and I/O supply voltage regulators should be located close to the DSP (or DSP array) to minimize
inductance and resistance in the power delivery path. Additionally, when designing for high-performance
applications utilizing the C6000 platform of DSPs, the printed circuit board (PCB) should include separate
power planes for core, I/O, and ground, all bypassed with high-quality low-ESL/ESR capacitors.
10.4 Power-Supply Decoupling
To properly decouple the supply planes from system noise, place as many capacitors (caps) as possible
close to the DSP. Assuming 0603 caps, the user should be able to fit a total of 60 caps—30 for the core
supply and 30 for the I/O supply. These caps need to be close (no more than 1.25-cm maximum distance)
to the DSP to be effective. Physically smaller caps are better, such as 0402, but the size needs to be
evaluated from a yield/manufacturing point-of-view. Parasitic inductance limits the effectiveness of the
decoupling capacitors; therefore, physically smaller capacitors should be used while maintaining the
largest available capacitance value. As with the selection of any component, verification of capacitor
availability over the product’s production lifetime needs to be considered.
10.5 IEEE Std 1149.1 JTAG Compatibility Statement
The 320C6713/13B DSP requires that both TRST and RESET resets be asserted upon power up to be
properly initialized. While RESET initializes the DSP core, TRST initializes the DSP emulation logic. Both
resets are required for proper operation.
NOTE
TRST is synchronous and must be clocked by TCLK; otherwise, BSCAN may not respond as
expected after TRST is asserted.
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While both TRST and RESET need to be asserted upon power-up, only RESET needs to be released for
the DSP to boot properly. TRST may be asserted indefinitely for normal operation, keeping the JTAG port
interface and DSP emulation logic in the reset state.
TRST only needs to be released when it is necessary to use a JTAG controller to debug the DSP or
exercise the DSP boundary scan functionality.
The TMS320C6713B DSP includes an internal pulldown (IPD) on the TRST pin to ensure that TRST will
always be asserted upon power up and the DSP’s internal emulation logic will always be properly
initialized when this pin is not routed out. JTAG controllers from Texas Instruments actively drive TRST
high. However, some third-party JTAG controllers may not drive TRST high but expect the use of an
external pullup resistor on TRST. When using this type of JTAG controller, assert TRST to initialize the
DSP after powerup and externally drive TRST high before attempting any emulation or boundary scan
operations.
Following the release of RESET, the low-to-high transition of TRST must be “seen” to latch the state of
EMU1 and EMU0. The EMU[1:0] pins configure the device for either boundary scan mode or emulation
mode. For more detailed information, see the terminal functions section of this data sheet.
NOTE
Note: The DESIGN−WARNING section of the TMS320C6713B BSDL file contains
information and constraints regarding proper device operation while in boundary scan mode.
For more detailed information on the C6713B JTAG emulation, see the TMS320C6000 DSP Designing for
JTAG Emulation Reference Guide (literature number SPRU641).
10.6 EMIF Device Speed
The maximum EMIF speed on the C6713/13B device is 100 MHz. TI recommends utilizing I/O buffer
information specification (IBIS) to analyze all ac timings to determine if the maximum EMIF speed is
achievable for a given board layout. To properly use IBIS models to attain accurate timing analysis for a
given system, see the application report Using IBIS Models for Timing Analysis (literature number
SPRA839).
For ease of design evaluation, Table 10-2 contains IBIS simulation results showing the maximum
EMIF-SDRAM interface speeds for the given example boards (TYPE) and SDRAM speed grades. Timing
analysis should be performed to verify that all ac timings are met for the specified board layout. Other
configurations are also possible, but again, timing analysis must be done to verify proper ac timings.
To maintain signal integrity, serial termination resistors should be inserted into all EMIF output signal lines
(see the Terminal Functions table for the EMIF output signals).
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Table 10-2. C6713/13B Example Boards and Maximum EMIF Speed
BOARD CONFIGURATION
TYPE
1-Load
Short
Traces
One bank of
one 32-bit SDRAM
2-Loads
Short
Traces
One bank of
two 16-bit SDRAMs
3-Loads
Short
Traces
One bank of
two 16-bit SDRAMs
One bank of buffer
3-Loads
Long Traces
(1)
EMIF INTERFACE
COMPONENTS
One bank of
one 32-bit-bit SDRAM,
One bank of
one 32-bit-bit SDRAM,
One bank of buffer
BOARD TRACE
1- to 3-in traces with
proper termination
resistors;
Trace impedance ~50 Ω
1.2 to 3 in from EMIF to
each load, with proper
termination resistors;
Trace impedance ~78 Ω
1.2 to 3 inches from EMIF
to each load, with proper
termination resistors;
Trace impedance ~78 Ω
4 to 7 in from EMIF;
Trace impedance ~63 Ω
SDRAM SPEED GRADE
MAXIMUM ACHIEVABLE
EMIF-SDRAM
INTERFACE SPEED
143-MHz 32-bit SDRAM (−7)
100 MHz
166-MHz 32-bit SDRAM (−6)
For short traces, SDRAM data
output hold time on these SDRAM
speed grades cannot meet EMIF
input hold time requirement. (1)
183-MHz 32-bit SDRAM (−55)
200-MHz 32-bit SDRAM (−5)
125-MHz 16-bit SDRAM (−8E)
100 MHz
133-MHz 16-bit SDRAM (−75)
100 MHz
143-MHz 16-bit SDRAM (−7E)
100 MHz
167-MHz 16-bit SDRAM (−6A)
100 MHz
167-MHz 16-bit SDRAM (−6)
100 MHz
125-MHz 16-bit SDRAM (−8E)
For short traces, EMIF cannot
meet SDRAM input hold
requirement. (1)
133-MHz 16-bit SDRAM (−75)
100 MHz
143-MHz 16-bit SDRAM (−7E)
100 MHz
167-MHz 16-bit SDRAM (−6A)
100 MHz
167-MHz 16-bit SDRAM (−6)
For short traces, EMIF cannot
meet SDRAM input hold
requirement. (1)
143-MHz 32-bit SDRAM (−7)
83 MHz
166-MHz 32-bit SDRAM (−6)
83 MHz
183-MHz 32-bit SDRAM (−55)
83 MHz
200-MHz 32-bit SDRAM (−5)
SDRAM data output hold time
cannot meet EMIF input hold
requirement. (1)
Results are based on IBIS simulations for the given example boards (TYPE). Timing analysis should be performed to determine if timing
requirements can be met for the particular system.
10.7 EMIF Big Endian Mode Correctness (C6713B Only)
The HD8 pin device endian mode (LENDIAN) selects the endian mode of operation (Little or Big Endian).
For the C6713/13B device Little Endian is the default setting.
The C6713B HD12 pin (EMIF Big Endian Mode Correctness) [EMIFBE] enhancement allows the flexibility
to change the EMIF data placement on the EMIF bus.
When using the default setting of HD12 = 1 for the C6713B, the EMIF will present 8-bit or 16-bit data on
the ED[7:0] side of the bus if using Little Endian mode (HD8 = 1), and to the ED[31:24] side of the bus if
using Big Endian mode. Figure 10-6 shows the mapping of 16-bit and 8-bit C6713B devices.
abc
EMIF DATA LINES (PINS) WHERE DATA PRESENT
ED[31:24] (BE3)
ED[23:16] (BE2)
ED[15:8] (BE1)
ED[7:0] (BE0)
32-Bit Device in Any Endianness Mode
16-Bit Device in Big Endianness Mode
16-Bit Device in Little Endianness Mode
8-Bit Device in
Big Endianness Mode
8-Bit Device in
Little Endianness Mode
Figure 10-6. 16/8-Bit EMIF Big Endian Mode Correctness Mapping (HD12 = 1) (C6713B Only)
When HD12 = 0 for the C6713B, enabling EMIF endianness correction, the EMIF will present 8-bit or
16-bit data on the ED[7:0] side of the bus, regardless of the endianess mode (see Figure 10-7)
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abc
EMIF DATA LINES (PINS) WHERE DATA PRESENT
ED[31:24] (BE3)
ED[23:16] (BE2)
ED[15:8] (BE1)
ED[7:0] (BE0)
32-Bit Device in Any Endianness Mode
16-Bit Device in Any Endianness Mode
8-Bit Device in
Any Endianness Mode
Figure 10-7. 16/8-Bit EMIF Big Endian Mode Correctness Mapping (HD12 = 0) (C6713B Only)
This new C6713B endianness correction functionality does not affect systems using the default value of
HD12 = 1.
This new C6713B feature does not affect systems operating in Little Endian mode.
10.8 Bootmode
The C6713/13B device resets using the active-low signal RESET and the internal reset signal. While
RESET is low, the internal reset is also asserted and the device is held in reset and is initialized to the
prescribed reset state. Refer to Reset Timing for reset timing characteristics and states of device pins
during reset. The release of the internal reset signal (see the Reset phase 3 discussion in the RESET
Timing section of this data sheet) starts the processor running with the prescribed device configuration
and boot mode.
The C6713/13B has three types of boot modes:
• Host boot
If host boot is selected, upon release of internal reset, the CPU is internally stalled while the remainder
of the device is released. During this period, an external host can initialize the CPU memory space as
necessary through the host interface, including internal configuration registers, such as those that
control the EMIF or other peripherals. Once the host is finished with all necessary initialization, it must
set the DSPINT bit in the HPIC register to complete the boot process. This transition causes the boot
configuration logic to bring the CPU out of the stalled state. The CPU then begins execution from
address 0. The DSPINT condition is not latched by the CPU, because it occurs while the CPU is still
internally stalled. Also, DSPINT brings the CPU out of the stalled state only if the host boot process is
selected. All memory may be written to and read by the host. This allows for the host to verify what it
sends to the DSP if required. After the CPU is out of the stalled state , the CPU needs to clear the
DSPINT; otherwise, no more DSPINTs can be received.
• Emulation boot
Emulation boot mode is a variation of host boot. In this mode, it is not necessary for a host to load
code or to set DSPINT to release the CPU from the stalled state. Instead, the emulator will set DSPINT
if it has not been previously set so that the CPU can begin executing code from address 0. Before
beginning execution, the emulator sets a breakpoint at address 0. This prevents the execution of
invalid code by halting the CPU before executing the first instruction. Emulation boot is a good tool in
the debug phase of development.
• EMIF boot (using default ROM timings)
Upon the release of internal reset, the 1K-Byte ROM code located in the beginning of CE1 is copied to
address 0 by the EDMA using the default ROM timings, while the CPU is internally stalled. The data
should be stored in the endian format that the system is using. The boot process also lets you choose
the width of the ROM. In this case, the EMIF automatically assembles consecutive 8-bit bytes or 16-bit
half-words to form the 32-bit instruction words to be copied. The transfer is automatically done by the
EDMA as a single-frame block transfer from the ROM to address 0. After completion of the block
transfer, the CPU is released from the stalled state and start running from address 0.
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11
PARAMETRIC INFORMATION
11.1 Absolute Maximum Ratings (1)
over operating case temperature range (unless otherwise noted)
VALUE
UNIT
Supply voltage range, CVDD
(2)
–0.3 to 1.8
V
Supply voltage range, DVDD
(2)
–0.3 to 4
V
−0.3 to DVDD + 0.5
V
−0.3 to DVDD + 0.5
V
Input voltage range
Output voltage range
Operating case temperature range TC
A version
–40 to 105
S version
–55 to 105
M version (3)
–55 to 125
–60 to 150
Storage temperature range, Tstg
(1)
(2)
(3)
°C
°C
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to VSS.
Long-term high temperature storage and/or extended use at maximum recommended operating conditions may result in a reduction of
overall device life. See http://ti.com/ep_quality for additional information on enhanced product packaging.
11.2 Recommended Operating Conditions (1)
MIN
NOM
MAX
C6713B
1.20
1.26
1.32
C6713B 300 MHz only
1.33
1.40
1.47
3.13
3.3
UNIT
CVDD
Supply voltage,
core referenced to VSS
DVDD
Supply voltage, I/O referenced to VSS
3.47
V
V(C – D)
Maximum supply voltage difference, CVDD − DVDD
1.32
V
V(D – C)
Maximum supply voltage difference, DVDD − CVDD
2.75
V
VIH
High-level
input voltage
VIL
2
CLKS1/SCL1, DR1/SDA1, SCL0, SDA0, and RESET
2
All signals except CLKS1/SCL1, DR1/SDA1, SCL0, SDA0, and
RESET
Low-level
input voltage
CLKS1/SCL1, DR1/SDA1, SCL0, SDA0, and RESET
C6713 (2)
IOH
All signals except CLKS1/SCL1, DR1/SDA1, SCL0, SDA0, and
RESET
High-level
output
current
All signals except ECLKOUT, CLKOUT2, CLKOUT3,
CLKS1/SCL1, DR1/SDA1, SCL0, and SDA0
ECLKOUT, CLKOUT2, and CLKOUT3
C6713B
(2)
All signals except ECLKOUT, CLKOUT2, CLKS1/SCL1,
DR1/SDA1, SCL0, and SDA0
ECLKOUT and CLKOUT2
C6713
IOL
(2)
Low-level
output
current
C6713B (2)
V
0.8
0.3 ×
DVDD
–16
–16
8
16
3
All signals except ECLKOUT, CLKOUT2, CLKS1/SCL1,
DR1/SDA1, SCL0, and SDA0
8
(1)
(2)
(3)
Maximum voltage during overshoot (See Figure 11-4)
mA
16
CLKS1/SCL1, DR1/SDA1, SCL0, and SDA0
VOS
mA
–8
CLKS1/SCL1, DR1/SDA1, SCL0, and SDA0
ECLKOUT and CLKOUT2
V
–8
All signals except ECLKOUT, CLKOUT2, CLKOUT3,
CLKS1/SCL1, DR1/SDA1, SCL0, and SDA0
ECLKOUT, CLKOUT2, and CLKOUT3
V
3
4
(3)
V
The core supply should be powered up before, and powered down after, the I/O supply. Systems should be designed to ensure that
neither supply is powered up for an extended period of time if the other supply is below the proper operating voltage.
Refers to dc (or steady state) currents only; actual switching currents are higher. For more details, see the device-specific IBIS models.
The absolute maximum ratings should not be exceeded for more than 30% of the cycle period.
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Recommended Operating Conditions(1) (continued)
MIN
VUS
Maximum voltage during undershoot (See Figure 11-5)
TC
Operating case temperature
NOM
MAX
–0.7 (3)
A version
–40
105
S version
–55
105
M version
–55
125
UNIT
V
°C
11.3 Electrical Characteristics (1)
over recommended ranges of supply voltage and operating case temperature (unless otherwise noted)
PARAMETER
VOH
High-level output
voltage
VOL
Low-level output
voltage
II
Input current
TEST CONDITIONS
MIN
TYP
All signals except SCL1, SDA1,
SCL0, and SDA0
IOH = MAX
All signals except SCL1, SDA1,
SCL0, and SDA0
IOL = MAX
0.4
SCL1, SDA1, SCL0, and SDA0
IOL = MAX
0.4
All signals except SCL1, SDA1,
SCL0, and SDA0
VI = VSS to DVDD
2.4
Off-state output current
All signals except SCL1, SDA1,
SCL0, and SDA0
±170
IDD2V Core supply current
IDD3V I/O supply current (2)
V
μA
±10
±170
VO = DVDD or 0 V
μA
±10
SCL1, SDA1, SCL0, and SDA0
(2)
UNIT
V
SCL1, SDA1, SCL0, and SDA0
IOZ
MAX
13GDPA, CVDD = 1.4 V,
CPU clock = 300 MHz
945
13GDPA, CVDD = 1.26 V,
CPU clock = 200 MHz
560
C6713/13B, DVDD = 3.3 V,
EMIF speed = 100 MHz
75
mA
mA
CI
Input capacitance
7
pF
Co
Output capacitance
7
pF
(1)
(2)
90
For test conditions shown as MIN, MAX, or NOM, use the appropriate value specified in the recommended operating conditions table.
Measured with average activity (50% high/50% low power) at 25°C case temperature and 100-MHz EMIF. This model represents a
device performing high-DSP-activity operations 50% of the time, and the remainder performing low-DSP-activity operations. The
high/low-DSP-activity models are defined as follows:
• High DSP activity model:
• CPU: 8 instructions/cycle with 2 LDDW instructions [L1 data memory: 128 bits/cycle via LDDW instructions; L1 program memory:
256 bits/cycle; L2/EMIF EDMA: 50% writes, 50% reads to/from SDRAM (50% bit switching)]
• McBSP: 2 channels at E1 rate
• Timers: 2 timers at maximum rate
• Low DSP activity model:
• CPU: 2 instructions/cycle with 1 LDH instruction [L1 data memory: 16 bits/cycle; L1 program memory: 256 bits per 4 cycles;
L2/EMIF EDMA: None]
• McBSP: 2 channels at E1 rate
• Timers: 2 timers at maximum rate
The actual current draw is highly application dependent. For more details on core and I/O activity, refer to the TMS320C6713/12C/11C
Power Consumption Summary application report (literature number SPRA889).
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11.4 Parameter Measurement Information
11.4.1 Timing Information
Tester Pin Electronics
42
Data Sheet Timing Reference Point
Output
Under
Test
3.5 nH
Transmission Line
Z0 = 50
(see Note A)
4.0 pF
Device Pin
(see Note 1)
1.85 pF
NOTE A: The data sheet provides timing at the device pin. For output timing analysis, the tester pin electronics and its transmission line effects
must be taken into account. A transmission line with a delay of 2 ns or longer can be used to produce the desired transmission line
effect. The transmission line is intended as a load only. It is not necessary to add or subtract the transmission line delay (2 ns or longer)
from the data-sheet timings.
Input requirements in this data sheet are tested with an input slew rate of <4 V per nanosecond (4 V/ns) at the device pin.
Figure 11-1. Test Load Circuit for AC Timing Measurements
11.4.2 Signal Transition Levels
All input and output timing parameters are referenced to 1.5 V for both 0 and 1 logic levels.
Vref = 1.5 V
Figure 11-2. Input and Output Voltage Reference Levels for AC Timing Measurements
All rise and fall transition timing parameters are referenced to VIL MAX and VIH MIN for input clocks, VOL MAX
and VOH MIN for output clocks.
Vref = VIH MIN (or VOH MIN)
Vref = VIL MAX (or VOL MAX)
Figure 11-3. Rise and Fall Transition Time Voltage Reference Levels
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11.4.3 AC Transient Rise/Fall Time Specifications
Figure 11-4 and Figure 11-5 show the AC transient specifications for rise and fall time. For device-specific
information on these values, refer to the Recommended Operating Conditions section of this data sheet.
t = 0.3 tc (max)†
VOS (max)
Minimum
Risetime
VIH (min)
Waveform
Valid Region
Ground
† tc = the peripheral cycle time.
Figure 11-4. AC Transient Specification Rise Time
t = 0.3 tc(max)†
VIL (max)
VUS (max)
Ground
† tc = the peripheral cycle time.
Figure 11-5. AC Transient Specification Fall Time
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11.4.4 Timing Parameters and Board Routing Analysis
The timing parameter values specified in this data sheet do not include delays by board routings. As a good
board design practice, such delays must always be taken into account. Timing values may be adjusted by
increasing/decreasing such delays. TI recommends utilizing the available I/O buffer information specification
(IBIS) models to analyze the timing characteristics correctly. To properly use IBIS models to attain accurate
timing analysis for a given system, see the Using IBIS Models for Timing Analysis application report (literature
number SPRA839). If needed, external logic hardware such as buffers may be used to compensate any timing
differences.
For inputs, timing is most impacted by the round-trip propagation delay from the DSP to the external device and
from the external device to the DSP. This round-trip delay tends to negatively impact the input setup time margin,
but also tends to improve the input hold time margins (see Table 11-1 and Figure 11-6).
Figure 11-6 represents a general transfer between the DSP and an external device. The figure also represents
board route delays and how they are perceived by the DSP and the external device.
Table 11-1. Board-Level Timings Example (see
Figure 11-6)
NO.
DESCRIPTION
1
Clock route delay
2
Minimum DSP hold time
3
Minimum DSP setup time
4
External device hold time requirement
5
External device setup time requirement
6
Control signal route delay
7
External device hold time
8
External device access time
9
DSP hold time requirement
10
DSP setup time requirement
11
Data route delay
ECLKOUT
(Output from DSP)
1
ECLKOUT
(Input to External Device)
(A)
Control Signals
(Output from DSP)
2
3
4
5
Control Signals
(Input to External Device)
6
7
(B)
8
Data Signals
(Output from External Device)
10
(B)
Data Signals
(Input to DSP)
9
11
NOTES A: Control signals include data for writes.
B: Data signals are generated during reads from an external device.
Figure 11-6. Board-Level Input/Output Timings
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11.5 Input and Output Clocks
Table 11-2. Timing Requirements for CLKIN (1)
(2) (3)
See Figure 11-7
PLL MODE
(PLLEN = 1)
NO.
tc(CLKIN)
1
MIN
MAX
MIN
GDP-200
5
83.3
6.7
GDP-300
4
83.3
6.7
UNIT
MAX
ns
2
tw(CLKINH)
Pulse duration, CLKIN high
0.4C
0.4C
ns
3
tw(CLKINL)
Pulse duration, CLKIN low
0.4C
0.4C
ns
tt(CLKIN)
Transition time, CLKIN
4
(1)
(2)
(3)
Cycle time, CLKIN
BYPASS MODE
(PLLEN = 0)
5
5
ns
The reference points for the rise and fall transitions are measured at VIL MAX and VIH MIN.
C = CLKIN cycle time in nanoseconds (ns). For example, when CLKIN frequency is 40 MHz, use C = 25 ns.
See the PLL and PLL Controller section of this data sheet.
1
4
2
CLKIN
3
4
Figure 11-7. CLKIN
Table 11-3. Switching Characteristics for CLKOUT2 (1)
(2)
over recommended operating conditions (see Figure 11-8)
NO.
(1)
(2)
PARAMETER
MIN
MAX
C2 – 0.8
C2 + 0.8
ns
Pulse duration, CLKOUT2 high
(C2/2) – 0.8
(C2/2) + 0.8
ns
Pulse duration, CLKOUT2 low
(C2/2) – 0.8
(C2/2) + 0.8
ns
2
ns
1
tc(CKO2)
Cycle time, CLKOUT2
2
tw(CKO2H)
3
tw(CKO2L)
4
tt(CKO2)
Transition time, CLKOUT2
UNIT
The reference points for the rise and fall transitions are measured at VOL MAX and VOH MIN.
C2 = CLKOUT2 period in ns. CLKOUT2 period is determined by the PLL controller output SYSCLK2 period, which must be set to CPU
period divide-by-2.
1
4
2
CLKOUT2
3
4
Figure 11-8. CLKOUT2
94
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Table 11-4. Switching Characteristics for CLKOUT3 (1)
(2)
over recommended operating conditions (see Figure 11-9)
NO.
(1)
(2)
6713
PARAMETER
6713B
MIN
MAX
MIN
MAX
UNIT
1
tc(CKO3)
Cycle time, CLKOUT3
C3 – 0.6
C3 + 0.6
C3 – 0.9
C3 + 0.9
ns
2
tw(CKO3H)
Pulse duration, CLKOUT3 high
(C3/2) – 0.6
(C3/2) + 0.6
(C3/2) – 0.9
(C3/2) + 0.9
ns
3
tw(CKO3L)
Pulse duration, CLKOUT3 low
(C3/2) – 0.6
(C3/2) + 0.6
(C3/2) – 0.9
(C3/2) + 0.9
ns
4
tt(CKO3)
Transition time, CLKOUT3
3
ns
5
td(CLKINH-CKO3V) Delay time, CLKIN high to CLKOUT3 valid
7.5
ns
2
1.5
6.5
1.5
The reference points for the rise and fall transitions are measured at VOL MAX and VOH MIN.
C3 = CLKOUT3 period in ns. CLKOUT3 period is a divide-down of the CPU clock, configurable via the RATIO field in the PLLDIV3
register.
CLKIN
5
1
5
4
3
CLKOUT3
2
4
Figure 11-9. CLKOUT3
Table 11-5. Timing Requirements for ECLKIN (1)
See Figure 11-10
NO.
(1)
MIN
MAX
UNIT
1
tc(EKI)
Cycle time, ECLKIN
10
ns
2
tw(EKIH)
Pulse duration, ECLKIN high
4.5
ns
3
tw(EKIL)
Pulse duration, ECLKIN low
4.5
ns
4
tt(EKI)
Transition time, ECLKIN
3
ns
The reference points for the rise and fall transitions are measured at VIL MAX and VIH MIN.
1
4
2
ECLKIN
3
4
Figure 11-10. ECLKIN
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Table 11-6. Switching Characteristics for ECLKOUT (1)
(2) (3)
over recommended operating conditions (see Figure 11-11)
NO.
(1)
(2)
(3)
PARAMETER
MIN
MAX
E – 0.9
E + 0.9
ns
Pulse duration, ECLKOUT high
EH – 0.9
EH + 0.9
ns
tw (EKOL)
Pulse duration, ECLKOUT low
EL – 0.9
EL + 0.9
ns
4
tt
(EKO)
Transition time, ECLKOUT
2
ns
5
td
(EKIH-EKOH)
Delay time, ECLKIN high to ECLKOUT high
1
6.5
ns
6
td
(EKIL-EKOL)
Delay time, ECLKIN low to ECLKOUT low
1
6.5
ns
1
tc
2
tw (EKOH)
3
(EKO)
Cycle time, ECLKOUT
UNIT
The reference points for the rise and fall transitions are measured at VOL MAX and VOH MIN.
E = ECLKIN period in ns
EH is the high period of ECLKIN in ns and EL is the low period of ECLKIN in ns.
ECLKIN
6
5
1
2
3
4
4
ECLKOUT
Figure 11-11. ECLKOUT
96
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11.6 Asynchronous Memory Timing
Table 11-7. Timing Requirements for Asynchronous Memory Cycles (1)
(2) (3)
See Figure 11-12 and Figure 11-13
NO.
(1)
(2)
(3)
MIN
MAX
UNIT
3
tsu(EDV-AREH)
Setup time, EDx valid before ARE high
6.5
ns
4
th(AREH-EDV)
Hold time, EDx valid after ARE high
1
ns
6
tsu(ARDY-EKOH)
Setup time, ARDY valid before ECLKOUT high
3
ns
7
th(EKOH-ARDY)
ARDY valid after ECLKOUT high
2.3
ns
To ensure data setup time, simply program the strobe width wide enough. ARDY is internally synchronized. The ARDY signal is
recognized in the cycle for which the setup and hold time is met. To use ARDY as an asynchronous input, the pulse width of the ARDY
signal should be wide enough (for example, pulse width = 2E) to ensure setup and hold time is met.
RS = Read setup, RST = Read strobe, RH = Read hold, WS = Write setup, WST = Write strobe, WH = Write hold. These parameters
are programmed via the EMIF CE space control registers.
E = ECLKOUT period in ns
Table 11-8. Switching Characteristics for Asynchronous Memory Cycles (1)
(2) (3)
over recommended operating condition (see Figure 11-12 and Figure 11-13)
NO.
(1)
(2)
(3)
PARAMETER
MIN
1
tosu(SELV-AREL)
Output setup time, select signals valid to ARE low
RS*E – 1.7
2
toh(AREH-SELIV)
Output hold time, ARE high to select signals invalid
RH*E – 1.7
5
td(EKOH-AREV)
Delay time, ECLKOUT high to ARE valid
8
tosu(SELV-AWEL)
Output setup time, select signals valid to AWE low
WS*E – 1.7
9
toh(AWEH-SELIV)
Output hold time, AWE high to select signals and EDx invalid
WH*E – 1.7
10
td(EKOH-AWEV)
Delay time, ECLKOUT high to AWE valid
11
tosu(EDV-AWEL)
Output setup time, ED valid to AWE low
1.5
1.5
MAX
UNIT
ns
ns
7
ns
ns
ns
7
(WS – 1)*E – 1.7
ns
ns
RS = Read setup, RST = Read strobe, RH = Read hold, WS = Write setup, WST = Write strobe, WH = Write hold. These parameters
are programmed via the EMIF CE space control registers.
E = ECLKOUT period in ns
Select signals include CEx, BE[3:0], EA[21:2], and AOE.
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trobe = 3
Not Ready
Hold = 2
ECLKOUT
1
2
CEx
1
2
BE[3:0]
BE
1
2
EA[21:2]
Address
3
4
ED[31:0]
1
AOE/SDRAS/SSOE
2
Read Data
(A)
5
ARE/SDCAS/SSADS
AWE/SDWE/SSWE
5
(A)
(A)
77
6
6
ARDY
NOTE A: AOE/SDRAS/SSOE, ARE/SDCAS/SSADS, and AWE/SDWE/SSWE operate as AOE (identified under select signals), ARE, and AWE,
respectively, during asynchronous memory accesses.
Figure 11-12. Asynchronous Memory Read
98
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Setup = 2
Strobe = 3
Hold = 2
Not Ready
ECLKOUT
8
9
CEx
8
9
BE[3:0]
BE
8
9
EA[21:2]
Address
11
9
ED[31:0]
Write Data
(A)
AOE/SDRAS/SSOE
(A)
ARE/SDCAS/SSADS
10
AWE/SDWE/SSWE
10
(A)
7
6
7
6
ARDY
NOTE A: AOE/SDRAS/SSOE, ARE/SDCAS/SSADS, and AWE/SDWE/SSWE operate as AOE (identified under select signals), ARE, and AWE,
respectively, during asynchronous memory accesses.
Figure 11-13. Asynchronous Memory Write
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11.7 Synchronous-Burst Memory Timing
Table 11-9. Timing Requirements for Synchronous-Burst SRAM Cycles (1)
See Figure 11-14
NO.
(1)
MIN
MAX
UNIT
6
tsu(EDV-EKOH)
Setup time, read EDx valid before ECLKOUT high
1.5
ns
7
th(EKOH-EDV)
Hold time, read EDx valid after ECLKOUT high
2.5
ns
The C6713/13B SBSRAM interface takes advantage of the internal burst counter in the SBSRAM. Accesses default to incrementing
4-word bursts, but random bursts and decrementing bursts are done by interrupting bursts in progress. All burst types can sustain
continuous data flow.
Table 11-10. Switching Characteristics for Synchronous-Burst SRAM Cycles (1)
(2)
over recommended operating conditions (see Figure 11-14 and Figure 11-15)
NO.
(1)
PARAMETER
MIN
MAX
1.2
7
UNIT
ns
7
ns
1
td
(EKOH-CEV)
Delay time, ECLKOUT high to CEx valid
2
td
(EKOH-BEV)
Delay time, ECLKOUT high to BEx valid
3
td
(EKOH-BEIV)
Delay time, ECLKOUT high to BEx invalid
4
td
(EKOH-EAV)
Delay time, ECLKOUT high to EAx valid
5
td
(EKOH-EAIV)
Delay time, ECLKOUT high to EAx invalid
1.2
8
td
(EKOH-ADSV)
Delay time, ECLKOUT high to ARE/SDCAS/SSADS valid
1.2
7
ns
9
td
(EKOH-OEV)
Delay time, ECLKOUT high to AOE/SDRAS/SSOE valid
1.2
7
ns
10
td
(EKOH-EDV)
Delay time, ECLKOUT high to EDx valid
7
ns
11
td
(EKOH-EDIV)
Delay time, ECLKOUT high to EDx invalid
1.2
12
td
(EKOH-WEV)
Delay time, ECLKOUT high to AWE/SDWE/SSWE valid
1.2
1.2
ns
7
ns
ns
ns
7
ns
The C6713/13B SBSRAM interface takes advantage of the internal burst counter in the SBSRAM. Accesses default to incrementing
4-word bursts, but random bursts and decrementing bursts are done by interrupting bursts in progress. All burst types can sustain
continuous data flow.
ARE/SDCAS/SSADS, AOE/SDRAS/SSOE, and AWE/SDWE/SSWE operate as SSADS, SSOE, and SSWE, respectively, during
SBSRAM accesses.
(2)
ECLKOUT
1
1
CEx
BE[3:0]
2
BE1
3
BE2
BE3
4
5
EA[21:2]
EA
6
ED[31:0]
7
Q1
8
ARE/SDCAS/SSADS
BE4
Q2
Q3
8
(1)
9
AOE/SDRAS/SSOE
AWE/SDWE/SSWE
Q4
9
(1)
(1)
NOTE (1): ARE/SDCAS/SSADS, AOE/SDRAS/SSOE, and AWE/SDWE/SSWE operate as SSADS, SSOE, and SSWE, respectively, during SBSRAM accesses.
Figure 11-14. SBSRAM Read Timing
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ECLKOUT
1
1
CEx
3
2
BE1B
BE[3:0]
E2
BE3B
E4
5
4
EA[21:2]
EA
11
10
Q1
ED[31:0]
8
(A)
Q2
Q3
Q4
8
ARE/SDCAS/SSADS
(A)
AOE/SDRAS/SSOE
12
12
AWE/SDWE/SSWE
(A)
NOTE A: ARE/SDCAS/SSADS, AOE/SDRAS/SSOE, and AWE/SDWE/SSWE operate as SSADS, SSOE, and SSWE, respectively, during SBSRAM accesses.
Figure 11-15. SBSRAM Write Timing
11.8 Synchronous DRAM Timing
Table 11-11. Timing Requirements for Synchronous DRAM Cycles (1)
See Figure 11-16
NO.
(1)
MIN
MAX
UNIT
6
tsu(EDV-EKOH) Setup time, read EDx valid before ECLKOUT high
1.5
ns
7
th(EKOH-EDV)
2.5
ns
Hold time, read EDx valid after ECLKOUT high
The C6713/13B SDRAM interface takes advantage of the internal burst counter in the SDRAM. Accesses default to incrementing 4-word
bursts, but random bursts and decrementing bursts are done by interrupting bursts in progress. All burst types can sustain continuous
data flow.
Table 11-12. Switching Characteristics for Synchronous DRAM Cycles (1)
(2)
over recommended operating conditions (see Figure 11-16— Figure 11-22)
NO.
(1)
(2)
PARAMETER
MIN
MAX
1.5
7
ns
7
ns
1
td(EKOH-CEV)
Delay time, ECLKOUT high to CEx valid
2
td(EKOH-BEV)
Delay time, ECLKOUT high to BEx valid
3
td(EKOH-BEIV)
Delay time, ECLKOUT high to BEx invalid
4
td(EKOH-EAV)
Delay time, ECLKOUT high to EAx valid
5
td(EKOH-EAIV)
Delay time, ECLKOUT high to EAx invalid
1.5
8
td(EKOH-CASV)
Delay time, ECLKOUT high to ARE/SDCAS/SSADS valid
1.5
1.5
UNIT
ns
7
ns
ns
7
ns
7
ns
9
td(EKOH-EDV)
Delay time, ECLKOUT high to EDX valid
10
td(EKOH-EDIV)
Delay time, ECLKOUT high to EDx invalid
1.5
11
td(EKOH-WEV)
Delay time, ECLKOUT high to AWE/SDWE/SSWE valid
1.5
7
ns
12
td(EKOH-RAV)
Delay time, ECLKOUT high to AOE/SDRAS/SSOE valid
1.5
7
ns
ns
The C6713/13B SDRAM interface takes advantage of the internal burst counter in the SDRAM. Accesses default to incrementing 4-word
bursts, but random bursts and decrementing bursts are done by interrupting bursts in progress. All burst types can sustain continuous
data flow.
ARE/SDCAS/SSADS, AWE/SDWE/SSWE and AOE/SDRAS/SSOE operate as SDCAS, SWE, and SDRAS, respectively, during SDRAM
accesses.
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READ
ECLKOUT
1
1
CEx
2
BE1
BE[3:0]
EA[21:13]
EA[11:2]
4
Bank
5
4
Column
5
4
3
BE2B
E3
BE4
5
EA12
6
D1
ED[31:0]
AOE/SDRAS/SSOE
AWE/SDWE/SSWE
D3
D4
(A)
8
ARE/SDCAS/SSADS
7
D2
8
(A)
(A)
NOTE A: ARE/SDCAS/SSADS, AWE/SDWE/SSWE, and AOE/SDRAS/SSOE operate as SDCAS, SDWE, and SDRAS, respectively, during SDRAM accesses.
Figure 11-16. SDRAM Read Command (CAS Latency 3)
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WRITE
ECLKOUT
1
1
CEx
2
3
2
BE[3:0]
BE1
4
BE2
BE3
BE4
D2
D3
D4
5
Bank
EA[21:13]
4
5
Column
EA[11:2]
4
5
EA12
9
ED[31:0]
AOE/SDRAS/SSOE
ARE/SDCAS/SSADS
AWE/SDWE/SSWE
9
D1
10
(A)
(A)
8
8
11
11
(A)
NOTE A: ARE/SDCAS/SSADS, AWE/SDWE/SSWE, and AOE/SDRAS/SSOE operate as SDCAS, SDWE, and SDRAS, respectively, during SDRAM accesses.
Figure 11-17. SDRAM Write Command
ACTV
ECLKOUT
1
1
CEx
BE[3:0]
4
Bank Activate
5
EA[21:13]
4
Row Address
5
EA[11:2]
4
Row Address
5
EA12
ED[31:0]
12
AOE/SDRAS/SSOE
ARE/SDCAS/SSADS
AWE/SDWE/SSWE
12
(A)
(A)
(A)
NOTE A: ARE/SDCAS/SSADS, AWE/SDWE/SSWE, and AOE/SDRAS/SSOE operate as SDCAS, SDWE, and SDRAS, respectively, during SDRAM accesses.
Figure 11-18. SDRAM ACTV Command
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DCAB
ECLKOUT
1
1
4
5
12
12
11
11
CEx
BE[3:0]
EA[21:13, 11:2]
EA12
ED[31:0]
(A)
AOE/SDRAS/SSOE
ARE/SDCAS/SSADS
AWE/SDWE/SSWE
(A)
(A)
NOTE A: ARE/SDCAS/SSADS, AWE/SDWE/SSWE, and AOE/SDRAS/SSOE operate as SDCAS, SDWE, and SDRAS, respectively, during SDRAM accesses.
Figure 11-19. SDRAM DCAB Command
DEAC
ECLKOUT
1
1
CEx
BE[3:0]
4
EA[21:13]
5
Bank
EA[11:2]
4
5
12
12
11
11
EA12
ED[31:0]
AOE/SDRAS/SSOE
ARE/SDCAS/SSADS
AWE/SDWE/SSWE
(A)
(A)
(A)
NOTE A: ARE/SDCAS/SSADS, AWE/SDWE/SSWE, and AOE/SDRAS/SSOE operate as SDCAS, SDWE, and SDRAS, respectively, during SDRAM accesses.
Figure 11-20. SDRAM DEAC Command
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REFR
ECLKOUT
1
1
12
12
8
8
CEx
BE[3:0]
EA[21:2]
EA12
ED[31:0]
AOE/SDRAS/SSOE
ARE/SDCAS/SSADS
AWE/SDWE/SSWE
(A)
(A)
(A)
NOTE A: ARE/SDCAS/SSADS, AWE/SDWE/SSWE, and AOE/SDRAS/SSOE operate as SDCAS, SDWE, and SDRAS, respectively, during SDRAM accesses.
Figure 11-21. SDRAM REFR Command
MRS
ECLKOUT
1
1
4
MRS value
5
12
12
8
8
11
11
CEx
BE[3:0]
EA[21:2]
ED[31:0]
(A)
AOE/SDRAS/SSOE
(A)
ARE/SDCAS/SSADS
AWE/SDWE/SSWE
(A)
NOTE A: ARE/SDCAS/SSADS, AWE/SDWE/SSWE, and AOE/SDRAS/SSOE operate as SDCAS, SDWE, and SDRAS, respectively, during SDRAM accesses.
Figure 11-22. SDRAM MRS Command
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HOLD/HOLDA Timing
Table 11-13. Timing Requirements for HOLD/HOLDA Cycles (1)
See Figure 11-23
NO.
3
(1)
MIN
th(HOLDAL-HOLDL)
Hold time, HOLD low after HOLDA low
MAX
E
UNIT
ns
E = ECLKOUT period in ns
Table 11-14. Switching Characteristics for HOLD/HOLDA Cycles (1)
(2)
over recommended operating conditions (see Figure 11-23)
NO.
(1)
(2)
(3)
6713
PARAMETER
1
td(HOLDL-EMHZ)
Delay time, HOLD low to EMIF Bus high impedance
2
td(EMHZ-HOLDAL)
Delay time, EMIF Bus high impedance to HOLDA low
4
td(HOLDH-EMLZ)
Delay time, HOLD high to EMIF Bus low impedance
5
td(EMLZ-HOLDAH)
Delay time, EMIF Bus low impedance to HOLDA high
6713B
UNIT
MIN
MAX
MIN
MAX
2E
(3)
2E
(3)
ns
–0.1
2E
0
2E
ns
2E
7E
2E
7E
ns
–1.5
2E
0
2E
ns
E = ECLKOUT period in ns
EMIF bus consists of CE[3:0], BE[3:0], ED[31:0], EA[21:2], ARE/SDCAS/SSADS, AOE/SDRAS/SSOE, and AWE/SDWE/SSWE.
All pending EMIF transactions are allowed to complete before HOLDA is asserted. If no bus transactions are occurring, then the
minimum delay time can be achieved. Also, bus hold can be indefinitely delayed by setting NOHOLD = 1.
External Requestor
Owns Bus
DSP Owns Bus
DSP Owns Bus
3
HOLD
25
HOLDA
EMIF Bus(A)
1
C6713/13BC
4
6713/13B
NOTE A: EMIF bus consists of CE[3:0], BE[3:0], ED[31:0], EA[21:2], ARE/SDCAS/SSADS, AWE/SDWE/SSWE, and AOE/SDRAS/SSOE.
Figure 11-23. HOLD/HOLDA Timing
11.10 BUSREQ Timing
Table 11-15. Switching Characteristics for BUSREQ Cycles
over recommended operating conditions (see Figure 11-24)
NO.
1
PARAMETER
td(EKOH-BUSRV)
Delay time, ECLKOUT high to BUSREQ valid
MIN
MAX
1.5
7.2
UNIT
ns
ECLKOUT
1
1
BUSREQ
Figure 11-24. BUSREQ
106
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11.11 Reset Timing
Table 11-16. Timing Requirements for RESET
(1) (2)
See Figure 11-25
NO.
(1)
(2)
(3)
MIN
MAX
UNIT
1
tw(RST)
Pulse duration, RESET
100
ns
13
tsu(HD)
Setup time, HD boot configuration bits valid before RESET high (3)
2P
ns
14
th(HD)
Hold time, HD boot configuration bits valid after RESET high (3)
2P
ns
P = 1/CPU clock frequency in ns. For example, when running parts at 300 MHz, use P = 3.3 ns.
For the C6713/13B device, the PLL is bypassed immediately after the device comes out of reset. The PLL controller can be
programmed to change the PLL mode in software. For more detailed information on the PLL controller, see the TMS320C6000 DSP
Phase-Lock Loop (PLL) Controller Peripheral Reference Guide (literature number SPRU233).
The boot and device configurations bits are latched asynchronously when RESET is transitioning high. The boot and device
configurations bits consist of HD[14, 8, 4:3].
Table 11-17. Switching Characteristics For RESET
(1)
over recommended operating conditions (see Figure 11-25)
NO.
(1)
(2)
(3)
PARAMETER
MIN
MAX
UNIT
512 x
CLKIN
period
ns
2
td(RSTH-ZV)
Delay time, external RESET high to internal reset high and all
signal groups valid (2) (3)
3a
td(RSTL-ECKOL)
Delay time, RESET low to ECLKOUT low (6713)
0
ns
3b
td(RSTL-ECKOL)
Delay time, RESET low to ECLKOUT high impedance (6713B)
0
ns
CLKMODE0 = 1
4
td(RSTH-ECKOV)
Delay time, RESET high to ECLKOUT valid
5a
td(RSTL-CKO2IV)
Delay time, RESET low to CLKOUT2 invalid (6713)
0
6P
ns
5b
td(RSTL-CKO2IV)
Delay time, RESET low to CLKOUT2 high impedance (6713B)
0
ns
6
td(RSTH-CKO2V)
Delay time, RESET high to CLKOUT2 valid
7
td(RSTL-CKO3L)
Delay time, RESET low to CLKOUT3 low
8
td(RSTH-CKO3V)
Delay time, RESET high to CLKOUT3 valid
6P
0
ns
ns
6P
(3)
ns
ns
9
td(RSTL-EMIFZHZ)
Delay time, RESET low to EMIF Z group high impedance
0
ns
10
td(RSTL-EMIFLIV)
Delay time, RESET low to EMIF low group (BUSREQ) invalid (3)
0
ns
11
td(RSTL-Z1HZ)
Delay time, RESET low to Z group 1 high impedance (3)
0
ns
12
td(RSTL-Z2HZ)
Delay time, RESET low to Z group 2 high impedance (3)
0
ns
P = 1/CPU clock frequency in ns. Note that while internal reset is asserted low, the CPU clock (SYSCLK1) period is equal to the input
clock (CLKIN) period multiplied by 8. For example, if the CLKIN period is 20 ns, the CPU clock (SYSCLK1) period is 20 ns x 8 = 160 ns.
Therefore, P = SYSCLK1 = 160 ns while internal reset is asserted.
The internal reset is stretched exactly 512 x CLKIN cycles if CLKIN is used (CLKMODE0 = 1). If the input clock (CLKIN) is not stable
when RESET is deasserted, the actual delay time may vary.
EMIF Z group consists of EA[21:2], ED[31:0], CE[3:0], BE[3:0], ARE/SDCAS/SSADS, AWE/SDWE/SSWE, AOE/SDRAS/SSOE, and
HOLDA.
EMIF low group consists of BUSREQ.
Z group 1 consists of CLKR0/ACLKR0, CLKR1/AXR0[6], CLKX0/ACLKX0, CLKX1/AMUTE0, FSR0/AFSR0, FSR1/AXR0[7],
FSX0/AFSX0, FSX1, DX0/AXR0[1], DX1/AXR0[5], TOUT0/AXR0[2], TOUT1/AXR0[4], SDA0, and SCL0.
Z group 2 consists of all other HPI, McASP0/1, GPIO, and I2C1 signals.
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Phase 1
Phase 2
Phase 3
CLKIN
ECLKIN
1
RESET
2
Internal Reset
Internal SYSCLK1
Internal SYSCLK2
Internal SYSCLK3
3
4
5
6
7
8
6713 ECLKOUT
6713B ECLKOUT
6713 CLKOUT2
6713B CLKOUT2
CLKOUT3
(A)
9
2
10
2
11
2
EMIF Z Group
(A)
EMIF Low Group
(A)
Z Group 1
(A)
2
12
Z Group 2
Boot and
Device
Configuration
(B)
Pins
14
13
NOTES A: EMIF Z group consists of EA[21:2], ED[31:0], CE[3:0], BE[3:0], ARE/SDCAS/SSADS, AWE/SDWE/SSWE, AOE/SDRAS/SSOE, and HOLDA.
EMIF low group consists of BUSREQ.
Z group 1 consists of CLKR0/ACLKR0, CLKR1/AXR0[6], CLKX0/ACLKX0, CLKX1/AMUTE0, FSR0/AFSR0, FSR1/AXR0[7], FSX0/AFSX0, FSX1,
DX0/AXR0[1], DX1/AXR0[5], TOUT0/AXR0[2], TOUT1/AXR0[4], SDA0, and SCL0.
Z group 2 consists of All other HPI, McASP0/1, GPIO, and I2C1 signals.
B: Boot and device configurations consist of: HD[14, 8, 4:3].
Figure 11-25. Reset Timing
Reset Phase 1: The RESET pin is asserted. During this time, all internal clocks are running at the CLKIN
frequency divide-by-8. The CPU is also running at the CLKIN frequency divide-by-8.
Reset Phase 2: The RESET pin is deasserted but the internal reset is stretched. During this time, all internal
clocks are running at the CLKIN frequency divide-by-8. The CPU is also running at the CLKIN frequency
divide-by-8.
Reset Phase 3: Both the RESET pin and internal reset are deasserted. During this time, all internal clocks are
running at their default divide-down frequency of CLKIN. The CPU clock (SYSCLK1) is running at CLKIN
frequency. The peripheral clock (SYSCLK2) is running at CLKIN frequency divide-by-2. The EMIF internal clock
source (SYSCLK3) is running at CLKIN frequency divide-by-2. SYSCLK3 is reflected on the ECLKOUT pin
(when EKSRC bit = 0 [default]). CLKOUT3 is running at CLKIN frequency divide-by-8.
108
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11.12 External Interrupt Timing
Table 11-18. Timing Requirements for External Interrupts (1)
See Figure 11-26
NO.
1
2
(1)
MIN
tw(ILOW)
tw(IHIGH)
MAX
UNIT
Width of the NMI interrupt pulse low
2P
ns
Width of the EXT_INT interrupt pulse low
4P
ns
Width of the NMI interrupt pulse high
2P
ns
Width of the EXT_INT interrupt pulse high
4P
ns
P = 1/CPU clock frequency in ns. For example, when running parts at 300 MHz, use P = 3.3 ns.
1
2
EXT_INT, NMI
Figure 11-26. External/NMI Interrupt
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11.13 Multichannel Audio Serial Port (McASP) Timing
Table 11-19. Timing Requirements for McASP
See Figure 11-27 and Figure 11-28
6713
NO.
MIN
6713B
MAX
MIN
UNIT
MAX
1
tc(AHCKRX)
Cycle time, AHCLKR/X
20
20
ns
2
tw(AHCKRX)
Pulse duration, AHCLKR/X high or low
7.5
7.5
ns
33
ns
3
tc(ACKRX)
Cycle time, ACLKR/X
ACLKR/X ext
Greater of
2P (1) or 33
4
tw(ACKRX)
Pulse duration, ACLKR/X high or low
ACLKR/X ext
14
14
ns
tsu(AFRXC-ACKRX)
Setup time, AFSR/X input valid before
ACLKR/X latches data
ACLKR/X int
6
6
ns
ACLKR/X ext
3
3
ns
th(ACKRX-AFRX)
Hold time, AFSR/X input valid after
ACLKR/X latches data
ACLKR/X int
0
0
ns
ACLKR/X ext
3
3
ns
tsu(AXR-ACKRX)
Setup time, AXR input valid before ACLKR/X ACLKR/X int
latches data
ACLKR/X ext
10.2
8
ns
6
3
ns
ACLKR/X int
1
1
ns
ACLKR/X ext
3
3
ns
5
6
7
8
(1)
th(ACKRX-AXR)
Hold time, AXR input valid after ACLKR/X
latches data
P = SYSCLK2 period
Table 11-20. Switching Characteristics for McASP (1)
over recommended operating conditions (see Figure 11-27 and Figure 11-28)
NO.
tc(AHCKRX)
Cycle time, AHCLKR/X
10
tw(AHCKRX)
Pulse duration, AHCLKR/X high or low
11
tc(ACKRX)
Cycle time, ACLKR/X
12
tw(ACKRX)
td(ACKRX-AFRX)
13
14
15
(1)
(2)
110
PARAMETER
9
MIN
MAX
UNIT
20
ns
(AH/2) – 2.5
ns
ACLKR/X int
Greater of
2P (2) or 33
ns
Pulse duration, ACLKR/X high or low
ACLKR/X int
(AH/2) – 2.5
Delay time, ACLKR/X transmit edge to AFSX/R
output valid
ACLKR/X int
–1
5
ns
ACLKR/X ext
0
10
ns
ACLKR/X int
–1
5
ns
ns
td(ACKX-AXRV)
Delay time, ACLKX transmit edge to AXR output valid
ACLKR/X ext
0
10
ns
tdis(ACKRX−AXRHZ)
Disable time, AXR high impedance following last data ACLKR/X int
bit from ACLKR/X transmit edge
ACLKR/X ext
–1
10
ns
–1
10
ns
AH = AHCLKR/X period in ns; A = ACLKR/X period in ns
P = SYSCLK2 period
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2
1
2
AHCLKR/X (Falling Edge Polarity)
AHCLKR/X (Rising Edge Polarity)
4
3
4
ACLKR/X (Falling Edge Polarity)
ACLKR/X (Rising Edge Polarity)
6
5
AFSR/X (Bit Width, 0 Bit Delay)
AFSR/X (Bit Width, 1 Bit Delay)
AFSR/X (Bit Width, 2 Bit Delay)
AFSR/X (Slot Width, 0 Bit Delay)
AFSR/X (Slot Width, 1 Bit Delay)
AFSR/X (Slot Width, 2 Bit Delay)
8
7
AXR[n] (Data In/Receive)
A0
A1
A30A 31 B0 B1
B30B 31 C0 C1
C2 C3
C31
Figure 11-27. McASP Input Timings
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10
10
9
AHCLKR/X (Falling Edge Polarity)
AHCLKR/X (Rising Edge Polarity)
12
11
12
ACLKR/X (Falling Edge Polarity)
ACLKR/X (Rising Edge Polarity)
13
13
13
13
AFSR/X (Bit Width, 0 Bit Delay)
AFSR/X (Bit Width, 1 Bit Delay)
AFSR/X (Bit Width, 2 Bit Delay)
13
13
13
AFSR/X (Slot Width, 0 Bit Delay)
AFSR/X (Slot Width, 1 Bit Delay)
14
AFSR/X (Slot Width, 2 Bit Delay)
14
14
14
15
14
14
AXR[n] (Data Out/Transmit)
A0
A1
A30A 31 B0 B1
B30B 31 C0
C1 C2 C3
C31
Figure 11-28. McASP Output Timings
112
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11.14 Inter-Integrated Circuits (I2C) Timing
Table 11-21. Timing Requirements for I2C (1)
See Figure 11-29
STANDARD
MODE
NO.
MIN
(2)
(3)
(4)
(5)
MIN
UNIT
MAX
tc(SCL)
Cycle time, SCL
10
2.5
μs
2
tsu(SCLH-SDAL)
Setup time, SCL high before SDA low (for a repeated
START condition)
4.7
0.6
μs
3
th(SCLL-SDAL)
Hold time, SCL low after SDA low (for a START and a
repeated START condition)
4
0.6
μs
4
tw(SCLL)
Pulse duration, SCL low
4.7
1.3
μs
5
tw(SCLH)
Pulse duration, SCL high
4
0.6
μs
6
tsu(SDAV-SDLH)
Setup time, SDA valid before SCL high
250
100 (2)
ns
7
th(SDA-SDLL)
Hold time,
SDA valid after SCL low (for I2C bus devices)
0 (3)
0 (3)
8
tw(SDAH)
Pulse duration,
SDA high between STOP and START conditions
4.7
1.3
9
tr(SDA)
Rise time, SDA
1
(1)
MAX
FAST
MODE
0.9 (4)
μs
μs
1000 20 + 0.1Cb
(5)
300
ns
10
tr(SCL)
Rise time, SCL
1000 20 + 0.1Cb
(5)
300
ns
11
tf(SDA)
Fall time, SDA
300 20 + 0.1Cb
(5)
300
ns
12
tf(SCL)
Fall time, SCL
300 20 + 0.1Cb
(5)
300
ns
13
tsu(SCLH-SDAH)
Setup time,
SCL high before SDA high (for STOP condition)
14
tw(
Pulse duration, spike (must be suppressed)
15
Cb
SP)
(5)
4
μs
0.6
0
Capacitive load for each bus line
400
50
ns
400
pF
The I2C pins SDA and SCL do not feature fail-safe I/O buffers. These pins could potentially draw current when the device is powered
down.
A fast-mode I2C-bus device can be used in a standard-mode I2C-bus system, but the requirement tsu (SDA−SCLH) ≥ 250 ns must then
be met. This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch
the LOW period of the SCL signal, it must output the next data bit to the SDA line tr max + tsu (SDA−SCLH) = 1000 + 250 = 1250 ns
(according to the standard-mode I2C-bus specification) before the SCL line is released.
A device must internally provide a hold time of at least 300 ns for the SDA signal (referred to the VIH min of the SCL signal) to bridge the
undefined region of the falling edge of SCL.
The maximum th(SDA−SCLL) has only to be met if the device does not stretch the low period [tw(SCLL)] of the SCL signal.
Cb = total capacitance of one bus line in pF. If mixed with HS-mode devices, faster fall times are allowed.
11
9
SDA
6
8
14
4
13
5
10
SCL
1
12
3
2
7
3
Stop
Start
Repeated
Start
Stop
Figure 11-29. I2C Receive
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Table 11-22. Switching Characteristics for I2C (1)
over recommended operating conditions (see Figure 11-30)
STANDARD
MODE
NO.
PARAMETER
MIN
MAX
FAST
MODE
MIN
MAX
UNIT
16
tc(SCL)
Cycle time, SCL
10
2.5
μs
17
td(SCLH-SDAL)
Delay time, SCL high to SDA low (for a repeated START
condition)
4.7
0.6
μs
18
td(SDAL-SCLL)
Delay time, SDA low to SCL low (for a START and a repeated
START condition)
4
0.6
μs
19
tw(SCLL)
Pulse duration, SCL low
4.7
1.3
μs
20
tw(SCLH)
Pulse duration, SCL high
4
0.6
μs
21
td(SDAV-SDLH)
Delay time, SDA valid to SCL high
250
100
ns
22
tv(SDLL-SDAV)
Valid time,
SDA valid after SCL low (for I2C bus devices)
0
0
23
tw(SDAH)
Pulse duration,
SDA high between STOP and START conditions
4.7
1.3
24
tr(SDA)
Rise time, SDA
1000 20 + 0.1Cb
(1)
300
ns
25
tr(SCL)
Rise time, SCL
1000 20 + 0.1Cb
(1)
300
ns
26
tf(SDA)
Fall time, SDA
300 20 + 0.1Cb
(1)
300
ns
300 20 + 0.1Cb
(1)
300
ns
27
tf(SCL)
Fall time, SCL
28
td(SCLH-SDAH)
Delay time,
SCL high to SDA high (for STOP condition)
30
Cb
Capacitance for each I2C pin
(1)
4
0.9
μs
μs
μs
0.6
10
10
pF
Cb = total capacitance of one bus line in pF. If mixed with HS-mode devices, faster fall-times are allowed.
26
24
SDA
21
23
19
28
20
25
SCL
16
27
18
17
22
18
Stop
Start
Repeated
Start
Stop
Figure 11-30. I2C Transmit Timings
114
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11.15 Host-Port Interface Timing
Table 11-23. Timing Requirements for Host-Port Interface Cycles (1)
(2)
See Figure 11-31—Figure 11-34
6713
NO.
(1)
(2)
(3)
MIN
6713B
MAX
MIN
MAX
UNIT
1
tsu(SELV-HSTBL)
Setup time, select signals valid before HSTROBE low (3)
5
5
ns
2
th(HSTBL-SELV)
Hold time, select signals valid after HSTROBE low (3)
4
4
ns
Pulse duration, HSTROBE low (host read access)
10P + 5.8
4P
ns
3
tw(HSTBL)
Pulse duration, HSTROBE low (host write access)
4P
4P
ns
4
tw(HSTBH)
Pulse duration, HSTROBE high between consecutive accesses
4P
4P
ns
10
tsu(SELV-HASL)
Setup time, select signals valid before HAS low (3)
5
5
ns
(3)
11
th(HASL-SELV)
Hold time, select signals valid after HAS low
3
3
ns
12
tsu(HDV-HSTBH)
Setup time, host data valid before HSTROBE high
5
5
ns
13
th(HSTBH-HDV)
Hold time, host data valid after HSTROBE high
3
3
ns
14
th(HRDYL-HSTBL)
Hold time, HSTROBE low after HRDY low. HSTROBE should not
be inactivated until HRDY is active (low); otherwise, HPI writes will
not complete properly.
2
2
ns
18
tsu(HASL-HSTBL)
Setup time, HAS low before HSTROBE low
2
2
ns
19
th(HSTBL-HASL)
Hold time, HAS low after HSTROBE low
2
2
ns
HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
P = 1/CPU clock frequency in ns. For example, when running parts at 300 MHz, use P = 3.3 ns.
Select signals include HCNTL[1:0], HR/W, and HHWIL.
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Table 11-24. Switching Characteristics for Host-Port Interface Cycles (1)
(2)
over recommended operating conditions (see Figure 11-31—Figure 11-34)
NO.
6713
PARAMETER
(3)
6713B
MIN
MAX
MIN
MAX
UNIT
5
td(HCS-HRDY)
Delay time, HCS to HRDY
1
15
1
12
ns
6
td(HSTBL-HRDYH)
Delay time, HSTROBE low to HRDY high (4)
3
15
3
12
ns
7
td(HSTBL-HDLZ)
Delay time, HSTROBE low to HD low impedance for an
HPI read
2
2
ns
8
td(HDV-HRDYL)
Delay time, HD valid to HRDY low
2P – 4
2P – 4
ns
9
toh(HSTBH-HDV)
Output hold time, HD valid after HSTROBE high
3
12
3
12
ns
15
td(HSTBH-HDHZ)
Delay time, HSTROBE high to HD high impedance
2
12
3
12
ns
16
td(HSTBL-HDV)
Delay time, HSTROBE low to HD valid
3
10P + 5.8
3
12.5
ns
3
15
3
12
ns
17
(1)
(2)
(3)
(4)
(5)
td(HSTBH-HRDYH)
Delay time, HSTROBE high to HRDY high
(5)
HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
P = 1/CPU clock frequency in ns. For example, when running parts at 300 MHz, use P = 3.3 ns.
HCS enables HRDY, and HRDY is always low when HCS is high. The case where HRDY goes high when HCS falls indicates that HPI
is busy completing a previous HPID write or READ with autoincrement.
This parameter is used during an HPID read. At the beginning of the first half-word transfer on the falling edge of HSTROBE, the HPI
sends the request to the EDMA internal address generation hardware, and HRDY remains high until the EDMA internal address
generation hardware loads the requested data into HPID.
This parameter is used after the second half-word of an HPID write or autoincrement read. HRDY remains low if the access is not an
HPID write or autoincrement read. Reading or writing to HPIC or HPIA does not affect the HRDY signal.
HAS
1
1
2
2
HCNTL[1:0]
1
1
2
2
HR/W
1
1
2
2
HHWIL
HSTROBE
4
3
(A)
3
HCS
7
15
9
16
15
9
HD[15:0] (output)
1st halfword2
5
8
nd halfword
17
5
HRDY (case 1)
6
8
17
5
HRDY (case 2)
NOTE A: HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
Figure 11-31. HPI Read Timing (HAS Not Used, Tied High)
116
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HAS
(A)
19
11
19
10
11
10
HCNTL[1:0]
11
11
10
10
HR/W
11
11
10
10
HHWIL
HSTROBE
4
3
(B)
18
18
HCS
15
7
9
15
16
9
HD[15:0] (output)
1st half-word
5
2nd half-word
8
17
5
17
5
HRDY (case 1)
8
HRDY (case 2)
NOTES A: For correct operation, strobe the HAS signal only once per HSTROBE active cycle.
B: HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
Figure 11-32. HPI Read Timing (HAS Used)
HAS
1
1
2
2
HCNTL[1:0]
1
1
2
2
HR/W
1
1
2
2
HHWIL
3
HSTROBE
3
4
14
(A)
HCS
12
13
12
13
HD[15:0] (input)
5
1st halfword
17
2nd halfword
5
HRDY
NOTE A: HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
Figure 11-33. HPI Write Timing (HAS Not Used, Tied High)
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(A)
HAS
19
19
11
11
10
10
HCNTL[1:0]
11
11
10
10
HR/W
11
11
10
10
HHWIL
3
HSTROBE
4
14
(B)
18
18
HCS
12
13
12
13
HD[15:0] (input)
5
1st half-word
2nd half-word
17
5
HRDY
NOTES A: For correct operation, strobe the HAS signal only once per HSTROBE active cycle.
B: HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
Figure 11-34. HPI Write Timing (HAS Used)
118
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11.16 Multichannel Buffered Serial Port (McBSP) Timing
Table 11-25. Timing Requirements for McBSP (1)
(2)
See Figure 11-35
NO.
(4)
MAX
UNIT
(3)
ns
0.5 * tc(CKRX) – 1 (4)
ns
tc(CKRX)
Cycle time, CLKR/X
CLKR/X ext
3
tw(CKRX)
Pulse duration, CLKR/X high or CLKR/X low
CLKR/X ext
CLKR int
9
ns
CLKR ext
1
ns
CLKR int
6
ns
CLKR ext
3
ns
CLKR int
8
ns
CLKR ext
0
ns
CLKR int
3
ns
CLKR ext
4
ns
CLKX int
9
ns
CLKX ext
1
ns
CLKX int
6
ns
CLKX ext
3
ns
5
tsu(FRH-CKRL)
Setup time, external FSR high before CLKR
low
6
th(CKRL-FRH)
Hold time, external FSR high after CLKR low
tsu(DRV-CKRL)
Setup time, DR valid before CLKR low
8
th(CKRL-DRV)
Hold time, DR valid after CLKR low
10
tsu(FXH-CKXL)
Setup time, external FSX high before CLKX
low
11
(2)
(3)
MIN
2
7
(1)
PARAMETER
th(CKXL-FXH)
Hold time, external FSX high after CLKX low
2P
CLKRP = CLKXP = FSRP = FSXP = 0. If polarity of any of the signals is inverted, then the timing references of that signal are also
inverted.
P = 1/CPU clock frequency in ns. For example, when running parts at 300 MHz, use P = 3.3 ns.
The minimum CLKR/X period is twice the CPU cycle time (2P) and not faster than 75 Mbps (13.3 ns). This means that the maximum bit
rate for communications between the McBSP and other devices is 75 Mbps for 167-MHz and 225-MHz CPU clocks or 50 Mbps for
100-MHz CPU clock; where the McBSP is either the master or the slave. Care must be taken to ensure that the ac timings specified in
this data sheet are met. The maximum bit rate for McBSP-to-McBSP communications is 67 Mbps; therefore, the minimum CLKR/X clock
cycle is either twice the CPU cycle time (2P), or 15 ns (67 MHz), whichever value is larger. For example, when running parts at
150 MHz (P = 6.7 ns), use 15 ns as the minimum CLKR/X clock cycle (by setting the appropriate CLKGDV ratio or external clock
source). When running parts at 60 MHz (P = 16.67 ns), use 2P = 33 ns (30 MHz) as the minimum CLKR/X clock cycle. The maximum
bit rate for McBSP-to-McBSP communications applies when the serial port is a master of the clock and frame syncs (with CLKR
connected to CLKX, FSR connected to FSX, CLKXM = FSXM = 1, and CLKRM = FSRM = 0) in data delay 1 or 2 mode (R/XDATDLY =
01b or 10b) and the other device the McBSP communicates to is a slave.
This parameter applies to the maximum McBSP frequency. Operate serial clocks (CLKR/X) in the reasonable range of 40/60 duty cycle.
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Table 11-26. Switching Characteristics for McBSP (1)
(2)
over recommended operating conditions (see Figure 11-35)
NO.
6713
PARAMETER
6713B
MIN
MAX
MIN
MAX
1.8
10
1.8
10
1
td(CKSH-CKRXH)
Delay time, CLKS high to CLKR/X high for
internal CLKR/X generated from CLKS input
2
tc(CKRX)
Cycle time, CLKR/X
3
tw(CKRX)
Pulse duration, CLKR/X high or
CLKR/X low
CLKR/X int
4
td(CKRH-FRV)
Delay time, CLKR high to internal
FSR valid
CLKRint
–2
3
9
td(CKXH-FXV)
Delay time, CLKX high to internal
FSX valid
CLKX int
–2
CLKX ext
2
tdis(CKXH-DXHZ)
Disable time, DX high impedance
following last data bit from CLKX
high
CLKX int
12
CLKX ext
CLKR/X int
CLKX int
13
td(CKXH-DXV)
14
td(FXH-DXV)
(1)
(2)
(3)
(4)
(5)
(6)
120
Delay time, CLKX high to DX valid
CLKX ext
2P (3)
(4)
C–1
(5)
(4)
C–1
(5)
ns
ns
(5)
ns
–2
3
ns
3
–2
3
ns
9
2
9
ns
–1
4
–1
4
ns
1.5
10
1.5
10
ns
–3.2 + D1
(6)
(6)
–3.2 + D1
(6)
4 + D2
(6)
ns
0.5 + D1
(6)
10 +
D2 (6)
0.5 + D1
(6)
10 + D2
(6)
ns
C+1
4 + D2
(5)
2P (3)
UNIT
C+1
Delay time, FSX high to DX valid
FSX int
–1.5
4.5
–1
7.5
ns
ONLY applies when in data delay 0
(XDATDLY = 00b) mode
FSX ext
2
9
2
11.5
ns
CLKRP = CLKXP = FSRP = FSXP = 0. If polarity of any of the signals is inverted, then the timing references of that signal are also
inverted.
Minimum delay times also represent minimum output hold times.
P = 1/CPU clock frequency in ns. For example, when running parts at 300 MHz, use P = 3.3 ns.
The minimum CLKR/X period is twice the CPU cycle time (2P) and not faster than 75 Mbps (13.3 ns). This means that the maximum bit
rate for communications between the McBSP and other devices is 75 Mbps for 167-MHz and 225-MHz CPU clocks or 50 Mbps for
100-MHz CPU clock; where the McBSP is either the master or the slave. Care must be taken to ensure that the AC timings specified in
this data sheet are met. The maximum bit rate for McBSP-to-McBSP communications is 67 Mbps; therefore, the minimum CLKR/X clock
cycle is either twice the CPU cycle time (2P), or 15 ns (67 MHz), whichever value is larger. For example, when running parts at 150
MHz (P = 6.7 ns), use 15 ns as the minimum CLKR/X clock cycle (by setting the appropriate CLKGDV ratio or external clock source).
When running parts at 60 MHz (P = 16.67 ns), use 2P = 33 ns (30 MHz) as the minimum CLKR/X clock cycle. The maximum bit rate for
McBSP-to-McBSP communications applies when the serial port is a master of the clock and frame syncs (with CLKR connected to
CLKX, FSR connected to FSX, CLKXM = FSXM = 1, and CLKRM = FSRM = 0) in data delay 1 or 2 mode (R/XDATDLY = 01b or 10b)
and the other device the McBSP communicates to is a slave.
C = H or L
S = sample rate generator input clock = 2P if CLKSM = 1 (P = 1/CPU clock frequency)
S = sample rate generator input clock = P_clks if CLKSM = 0 (P_clks = CLKS period)
H = CLKX high pulse width = (CLKGDV/2 + 1) * S if CLKGDV is even
H = CLKX high pulse width = (CLKGDV + 1)/2 * S if CLKGDV is odd or zero
L = CLKX low pulse width = (CLKGDV/2) * S if CLKGDV is even
L = CLKX low pulse width = (CLKGDV + 1)/2 * S if CLKGDV is odd or zeroCLKGDV should be set appropriately to ensure the McBSP
bit rate does not exceed the maximum limit (see note (4) above).
Extra delay from CLKX high to DX valid applies only to the first data bit of a device, if and only if DXENA = 1 in SPCR. If DXENA = 0,
then D1 = D2 = 0. If DXENA = 1, then D1 = 2P, D2 = 4P.
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CLKS
1
2
3
3
CLKR
4
4
FSR (int)
5
6
FSR (ext)
7
DR
8
Bit(n-1)
(n-2)
(n-3)
2
3
3
CLKX
9
FSX (int)
11
10
FSX (ext)
FSX (XDATDLY=00b)
13
14
13
Bit(n-1)
12
Bit 0
DX
13
(n-2)
(n-3)
Figure 11-35. McBSP Timings
Table 11-27. Timing Requirements for FSR When GSYNC = 1
See Figure 11-36
NO.
MIN
MAX
UNIT
1
tsu(FRH-CKSH)
Setup time, FSR high before CLKS high
4
ns
2
th(CKSH-FRH)
Hold time, FSR high after CLKS high
4
ns
CLKS
1
FSR external
2
CLKR/X (no need to resync)
CLKR/X (needs resync)
Figure 11-36. FSR Timing When GSYNC = 1
Table 11-28. Timing Requirements for McBSP as SPI Master or Slave:
CLKSTP = 10b, CLKXP = 0 (1) (2)
See Figure 11-37
NO.
(1)
(2)
4
tsu(DRV-CKXL)
Setup time, DR valid before CLKX low
5
th(CKXL-DRV)
Hold time, DR valid after CLKX low
MASTER
SLAVE
MIN
MIN
MAX
MAX
UNIT
12
2 – 6P
ns
4
5 + 12P
ns
P = 1/CPU clock frequency in ns. For example, when running parts at 300 MHz, use P = 3.3 ns.
For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
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Table 11-29. Switching Characteristics for McBSP as SPI Master or Slave:
CLKSTP = 10b, CLKXP = 0 (1) (2)
over recommended operating conditions (see Figure 11-37)
6713
NO.
MASTER (3)
PARAMETER
MIN MAX
1
th(CKXL-FXL)
Hold time, FSX low after CLKX
low (4)
td(FXL-CKXH)
Delay time, FSX low to CLKX
high (5)
3
td(CKXH-DXV)
Delay time, CLKX high to DX
valid
6
tdis(CKXL-DXHZ)
Disable time, DX high
impedance following last data
bit from CLKX low
7
tdis(FXH-DXHZ)
Disable time, DX high
impedance following last data
bit from FSX high
8
td(FXL-DXV)
Delay time, FSX low to DX valid
2
(1)
(2)
(3)
6713B
MASTER (3)
SLAVE
MIN
MAX
T–2 T+3
T–2
T+3
L–2 L+3
L–2
L+3
–3
4
MIN
6P + 2
MAX
SLAVE
10P + 17
L–4 L+3
–3
MIN
MAX
ns
ns
4 6P + 2
L–2
UNIT
10P + 17
L+3
ns
ns
2P +
1.5
6P + 17
2P + 3
6P + 17
ns
4P + 2
8P + 17
4P + 2
8P + 17
ns
P = 1/CPU clock frequency in ns. For example, when running parts at 300 MHz, use P = 3.3 ns.
For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
S = Sample rate generator input clock = 2P if CLKSM = 1 (P = 1/CPU clock frequency)
S = Sample rate generator input clock = Sample rate generator input clock = P_clks if CLKSM = 0 (P_clks = CLKS period)
T = CLKX period = (1 + CLKGDV) * S
H = CLKX high pulse width = (CLKGDV/2 + 1) * S if CLKGDV is even
H = CLKX high pulse width = (CLKGDV + 1)/2 * S if CLKGDV is odd or zero
L = CLKX low pulse width = (CLKGDV/2) * S if CLKGDV is even
L = CLKX low pulse width = (CLKGDV + 1)/2 * S if CLKGDV is odd or zero
FSRP = FSXP = 1. As a SPI master, FSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on
FSX and FSR is inverted before being used internally.
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP. CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP.
FSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master
clock (CLKX).
(4)
(5)
CLKX
1
2
FSX
7
6
DX
8
3
Bit 0
Bit(n-1)
4
DR
Bit 0
(n-2)
(n-3)
(n-4)
5
Bit(n-1)
(n-2)
(n-3)
(n-4)
Figure 11-37. McBSP Timing as SPI Master or Slave: CLKSTP = 10b, CLKXP = 0
Table 11-30. Timing Requirements for McBSP as SPI Master or Slave:
CLKSTP = 11b, CLKXP = 0 (1) (2)
See Figure 11-38
NO.
(1)
(2)
122
PARAMETER
4
tsu(DRV-CKXH) Setup time, DR valid before CLKX high
5
th(CKXH-DRV)
Hold time, DR valid after CLKX high
MASTER
MIN
MAX
SLAVE
MIN
MAX
UNIT
12
2 – 6P
ns
4
5 + 12P
ns
P = 1/CPU clock frequency in ns. For example, when running parts at 300 MHz, use P = 3.3 ns.
For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
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Table 11-31. Switching Characteristics for McBSP as SPI Master or Slave:
CLKSTP = 11b, CLKXP = 0 (1) (2)
over recommended operating conditions (see Figure 11-38)
6713
NO.
(1)
(2)
(3)
(4)
(5)
PARAMETER
1
th(CKXL-FXL)
Hold time, FSX low after
CLKX low (4)
2
td(FXL-CKXH)
Delay time, FSX low to
CLKX high (5)
3
td(CKXL-DXV)
Delay time, CLKX low to DX
valid
6
Disable time, DX high
tdis(CKXL-DXHZ) impedance following last
data bit from CLKX low
7
td(FXL-DXV)
Delay time, FSX low to DX
valid
MASTER (3)
6713B
MASTER (3)
SLAVE
MIN
MAX
L–2
MIN
MAX
SLAVE
MIN
UNIT
MIN
MAX
MAX
L+3
L–2
L+3
ns
T–2
T+3
T–2
T+3
ns
–3
4
6P + 2
10P + 17
–3
4
6P + 2 10P + 17
ns
–4
4
6P +
1.5
10P + 17
–2
4
6P + 3 10P + 17
ns
H–2
H+4
4P + 2
8P + 17
H–2
H + 6.5
4P + 2
ns
8P + 17
P = 1/CPU clock frequency in ns. For example, when running parts at 300 MHz, use P = 3.3 ns.
For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
S = Sample rate generator input clock = 2P if CLKSM = 1 (P = 1/CPU clock frequency)
S = Sample rate generator input clock = Sample rate generator input clock = P_clks if CLKSM = 0 (P_clks = CLKS period)
T = CLKX period = (1 + CLKGDV) * S
H = CLKX high pulse width = (CLKGDV/2 + 1) * S if CLKGDV is even
H = CLKX high pulse width = (CLKGDV + 1)/2 * S if CLKGDV is odd or zero
L = CLKX low pulse width = (CLKGDV/2) * S if CLKGDV is even
L = CLKX low pulse width = (CLKGDV + 1)/2 * S if CLKGDV is odd or zero
FSRP = FSXP = 1. As a SPI master, FSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on
FSX and FSR is inverted before being used internally.
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP. CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP.
FSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master
clock (CLKX).
CLKX
1
2
6
Bit 0
7
FSX
DX
3
Bit(n-1)
4
DR
Bit 0
(n-2)
(n-3)
(n-4)
5
Bit(n-1)
(n-2)
(n-3)
(n-4)
Figure 11-38. McBSP as SPI Master or Slave: CLKSTP = 11b, CLKXP = 0
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Table 11-32. Timing Requirements for McBSP as SPI Master or Slave:
CLKSTP = 10b, CLKXP = 1 (1) (2)
See Figure 11-39
NO.
(1)
(2)
4
tsu(DRV-CKXH)
Setup time, DR valid before CLKX high
5
th(CKXH-DRV)
Hold time, DR valid after CLKX high
MASTER
SLAVE
MIN
MIN
MAX
MAX
UNIT
12
2 – 6P
ns
4
5 + 12P
ns
P = 1/CPU clock frequency in ns. For example, when running parts at 300 MHz, use P = 3.3 ns.
For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
Table 11-33. Switching Characteristics for McBSP as SPI Master or Slave:
CLKSTP = 10b, CLKXP = 1 (1) (2)
over recommended operating conditions (see Figure 11-39)
6713
NO.
PARAMETER
MASTER
(3)
MIN MAX
6713B
SLAVE
MIN
MASTER
MAX
(3)
SLAVE
MIN
MAX
1
th
(CKXH-FXL)
Hold time, FSX low after CLKX
high (4)
T–2 T+3
T–2
T+3
2
td
(FXL-CKXL)
Delay time, FSX low to CLKX
low (5)
H–2
H+
3
H–2
H+3
3
td
(CKXL-DXV)
Delay time, CLKX low to DX valid
–3
6
tdis
(CKXH-DXHZ)
Disable time, DX high impedance
following last data bit from CLKX
high
H–
3.6
7
tdis
(FXH-DXHZ)
Disable time, DX high impedance
following last data bit from FSX
high
8
td
(1)
(2)
(3)
(4)
(5)
H+
3
Delay time, FSX low to DX valid
(FXL-DXV)
–3
4 6P + 2 10P + 17
H–2
MIN
UNIT
MAX
ns
ns
4 6P + 2 10P + 17
H+3
ns
ns
2P +
1.5
6P + 17
2P + 3
6P + 17
ns
4P + 2
8P + 17
4P + 2
8P + 17
ns
P = 1/CPU clock frequency in ns. For example, when running parts at 300 MHz, use P = 3.3 ns.
For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
S = Sample rate generator input clock = 2P if CLKSM = 1 (P = 1/CPU clock frequency)
S = Sample rate generator input clock = Sample rate generator input clock = P_clks if CLKSM = 0 (P_clks = CLKS period)
T = CLKX period = (1 + CLKGDV) * S
H = CLKX high pulse width = (CLKGDV/2 + 1) * S if CLKGDV is even
H = CLKX high pulse width = (CLKGDV + 1)/2 * S if CLKGDV is odd or zero
L = CLKX low pulse width = (CLKGDV/2) * S if CLKGDV is even
L = CLKX low pulse width = (CLKGDV + 1)/2 * S if CLKGDV is odd or zero
FSRP = FSXP = 1. As a SPI master, FSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on
FSX and FSR is inverted before being used internally.
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP. CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP.
FSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master
clock (CLKX).
CLKX
1
2
FSX
7
6
DX
8
3
Bit 0
Bit(n-1)
4
DR
Bit 0
(n-2)
(n-3)
(n-4)
5
Bit(n-1)
(n-2)
(n-3)
(n-4)
Figure 11-39. McBSP as SPI Master or Slave: CLKSTP = 10b, CLKXP = 1
124
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Table 11-34. Timing Requirements for McBSP as SPI Master or Slave: CLKSTP = 11b, CLKXP = 1 (1)
(2)
See Figure 11-40
NO.
(1)
(2)
4
tsu(DRV-CKXH)
Setup time, DR valid before CLKX high
5
th(CKXH-DRV)
Hold time, DR valid after CLKX high
MASTER
SLAVE
MIN
MIN
MAX
MAX
UNIT
12
2 – 6P
ns
4
5 + 12P
ns
P = 1/CPU clock frequency in ns. For example, when running parts at 300 MHz, use P = 3.3 ns.
For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
Table 11-35. Switching Characteristics for McBSP as SPI Master or Slave:
CLKSTP = 11b, CLKXP = 1 (1) (2)
over recommended operating conditions (see Figure 11-40)
6713
NO.
MASTER (3)
PARAMETER
MIN MAX
(1)
(2)
(3)
(4)
(5)
1
th(CKXH-FXL)
Hold time, FSX low after CLKX
high (4)
2
td(FXL-CKXL)
Delay time, FSX low to CLKX
low (5)
3
td(CKXH-DXV)
Delay time, CLKX high to DX
valid
6
7
6713B
MASTER (3)
SLAVE
MIN
MAX
H+
3
H–
2
T+3
T–2 T+3
T–2
H+3
H–
2
MIN
MAX
SLAVE
MIN
UNIT
MAX
ns
ns
ns
–3
4
6P + 2
10P + 17
–3
4 6P + 2
10P + 17
Disable time, DX high impedance
tdis(CKXH-DXHZ) following last data bit from CLKX
high
– 3.6
4
6P +
1.5
10P + 17
–2
4 6P + 3
10P + 17
ns
td(FXL-DXV)
L–2 L+4
4P + 2
8P + 17 L – 2
L + 6.5 4P + 2
8P + 17
ns
Delay time, FSX low to DX valid
P = 1/CPU clock frequency in ns. For example, when running parts at 300 MHz, use P = 3.3 ns.
For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
S = Sample rate generator input clock = 2P if CLKSM = 1 (P = 1/CPU clock frequency)
S = Sample rate generator input clock = Sample rate generator input clock = P_clks if CLKSM = 0 (P_clks = CLKS period)
T = CLKX period = (1 + CLKGDV) * S
H = CLKX high pulse width = (CLKGDV/2 + 1) * S if CLKGDV is even
H = CLKX high pulse width = (CLKGDV + 1)/2 * S if CLKGDV is odd or zero
L = CLKX low pulse width = (CLKGDV/2) * S if CLKGDV is even
L = CLKX low pulse width = (CLKGDV + 1)/2 * S if CLKGDV is odd or zero
FSRP = FSXP = 1. As a SPI master, FSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on
FSX and FSR is inverted before being used internally.
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP. CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP.
FSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master
clock (CLKX).
CLKX
1
2
FSX
6
DX
7
3
Bit 0
Bit(n-1)
4
DR
Bit 0
(n-2)
(n-3)
(n-4)
5
Bit(n-1)
(n-2)
(n-3)
(n-4)
Figure 11-40. McBSP as SPI Master or Slave: CLKSTP = 11b, CLKXP = 1
PARAMETRIC INFORMATION
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11.17 Timer Timing
Table 11-36. Timing Requirements for Timer Inputs (1)
See Figure 11-41
NO.
(1)
MIN
MAX
UNIT
1
tw(TINPH)
Pulse duration, TINP high
2P
ns
2
tw(TINPL)
Pulse duration, TINP low
2P
ns
P = 1/CPU clock frequency in ns. For example, when running parts at 300 MHz, use P = 3.3 ns.
Table 11-37. Switching Characteristics for Timer Inputs (1)
over recommended operating conditions (see Figure 11-41)
NO.
(1)
PARAMETER
MIN MAX
UNIT
3
tw(TOUTH)
Pulse duration, TOUT high
4P – 3
ns
4
tw(TOUTL)
Pulse duration, TOUT low
4P – 3
ns
P = 1/CPU clock frequency in ns. For example, when running parts at 300 MHz, use P = 3.3 ns.
2
1
TINPx
4
3
TOUTx
Figure 11-41. Timer
126
PARAMETRIC INFORMATION
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11.18 General-Purpose Input/Output (GPIO) Port Timing
Table 11-38. Timing Requirements for GPIO Inputs (1)
(2)
See Figure 11-42
NO.
(1)
(2)
MIN
MAX
UNIT
1
tw(GPIH)
Pulse duration, GPIx high
4P
ns
2
tw(GPIL)
Pulse duration, GPIx low
4P
ns
P = 1/CPU clock frequency in ns. For example, when running parts at 300 MHz, use P = 3.3 ns.
The pulse width given is sufficient to generate a CPU interrupt or an EDMA event. However, if a user wants to have the DSP recognize
the GPIx changes through software polling of the GPIO register, the GPIx duration must be extended to at least 24P to allow the DSP
enough time to access the GPIO register through the CFGBUS.
Table 11-39. Switching Characteristics for GPIO Inputs (1)
(2)
over recommended operating conditions (see Figure 11-42)
NO.
(1)
(2)
PARAMETER
MIN
MAX
UNIT
3
tw(GPOH)
Pulse duration, GPOx high
12P – 3
ns
4
tw(GPOL)
Pulse duration, GPOx low
12P – 3
ns
P = 1/CPU clock frequency in ns. For example, when running parts at 300 MHz, use P = 3.3 ns.
The number of CFGBUS cycles between two back-to-back CFGBUS writes to the GPIO register is 12 SYSCLK1 cycles; therefore, the
minimum GPOx pulse width is 12P.
2
1
GPIx
4
3
GPOx
Figure 11-42. GPIO Port Timing
PARAMETRIC INFORMATION
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11.19 JTAG Test Port Timing
Table 11-40. Timing Requirements for JTAG Test Port
See Figure 11-43
NO.
MIN
MAX
UNIT
1
tc(TCK)
Cycle time, TCK
35
ns
3
tsu(TDIV-
Setup time, TDI/TMS/TRST valid before TCK high
10
ns
7
ns
TCKH)
4
th(TCKH-TDIV)
Hold time, TDI/TMS/TRST valid after TCK high
Table 11-41. Switching Characteristics for JTAG Test Port
over recommended operating conditions (see Figure 11-43)
NO.
2
PARAMETER
td(TCKL-TDOV)
Delay time, TCK low to TDO valid
MIN
MAX
0
15
UNIT
ns
1
TCK
2
2
TDO
4
3
TDI/TMS/TRST
Figure 11-43. JTAG Test-Port Timing
128
PARAMETRIC INFORMATION
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12
MECHANICAL DATA
12.1 Mechanical Information
The following table shows the thermal resistance characteristics for the GDP package.
Table 12-1. Thermal Resistance Characteristics (S-PBGA Package) for GDP
NO
°C/W
Air Flow
(m/s) (1)
Two Signals, Two Planes (4-Layer Board)
(1)
1
RθJC
Junction-to-case
9.7
N/A
2
PsiJT
Junction-to-package top
1.5
0.0
3
RθJB
Junction-to-board
19
N/A
4
RθJA
Junction-to-free air
22
0.0
5
RθJA
Junction-to-free air
21
0.5
6
RθJA
Junction-to-free air
20
1.0
7
RθJA
Junction-to-free air
19
2.0
8
RθJA
Junction-to-free air
18
4.0
9
PsiJB
Junction-to-board
16
0.0
m/s = meters per second
12.2 Packaging Information
For proper device thermal performance, the thermal pad must be soldered to an external ground thermal
plane. The following packaging information and addendum reflect the most current released data available
for the designated device(s). This data is subject to change without notice and without revision of this
document.
MECHANICAL DATA
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PACKAGE OPTION ADDENDUM
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15-Apr-2017
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
SM32C6713BGDPA20EP
ACTIVE
BGA
GDP
272
40
TBD
SNPB
Level-3-220C-168 HR
-40 to 105
SM32C6713BGDPA
20EP
SM32C6713BGDPM30EP
ACTIVE
BGA
GDP
272
1
TBD
SNPB
Level-3-220C-168 HR
-55 to 125
SM32C6713BGDPM
30EP
SM32C6713BGDPS20EP
ACTIVE
BGA
GDP
272
40
TBD
SNPB
Level-3-220C-168 HR
-55 to 105
SM32C6713BGDPS
20EP
V62/04603-02XA
ACTIVE
BGA
GDP
272
40
TBD
SNPB
Level-3-220C-168 HR
-40 to 105
SM32C6713BGDPA
20EP
V62/04603-03XA
ACTIVE
BGA
GDP
272
40
TBD
SNPB
Level-3-220C-168 HR
-55 to 105
SM32C6713BGDPS
20EP
V62/04603-04XA
ACTIVE
BGA
GDP
272
1
TBD
SNPB
Level-3-220C-168 HR
-55 to 125
SM32C6713BGDPM
30EP
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
15-Apr-2017
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MPBG274 – MAY 2002
GDP (S–PBGA–N272)
PLASTIC BALL GRID ARRAY
27,20
SQ
26,80
24,20
SQ
23,80
24,13 TYP
1,27
0,635
Y
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
A1 Corner
1,27
0,635
3
1
2
1,22
1,12
5
4
7
6
9
8
11 13 15 17 19
10 12 14 16 18 20
Bottom View
2,57 MAX
Seating Plane
0,65
0,57
0,90
0,60
0,10
0,70
0,50
0,15
4204396/A 04/02
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Falls within JEDEC MO-151
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