Texas Instruments | TMS320C6211, TMS320C6211B Fixed-Point Digital Signal Processors (Rev. L) | Datasheet | Texas Instruments TMS320C6211, TMS320C6211B Fixed-Point Digital Signal Processors (Rev. L) Datasheet

Texas Instruments TMS320C6211, TMS320C6211B Fixed-Point Digital Signal Processors (Rev. L) Datasheet
 SPRS073L − AUGUST 1998 − REVISED JUNE 2005
D Excellent Price/Performance Digital Signal
D
D
D
Processors (DSPs): TMS320C62x
(TMS320C6211 and TMS320C6211B)
− Eight 32-Bit Instructions/Cycle
− C6211, C6211B, C6711, and C6711B are
Pin-Compatible
− 150-, 167-MHz Clock Rates
− 6.7-, 6-ns Instruction Cycle Time
− 1200, 1333 MIPS
− Extended Temperature Device (C6211B)
VelociTI Advanced Very Long Instruction
Word (VLIW) C62x DSP Core (C6211/11B)
− Eight Highly Independent Functional
Units:
− Six ALUs (32-/40-Bit)
− Two 16-Bit Multipliers (32-Bit Results)
− Load-Store Architecture With 32 32-Bit
General-Purpose Registers
− Instruction Packing Reduces Code Size
− All Instructions Conditional
Instruction Set Features
− Byte-Addressable (8-, 16-, 32-Bit Data)
− 8-Bit Overflow Protection
− Saturation
− Bit-Field Extract, Set, Clear
− Bit-Counting
− Normalization
L1/L2 Memory Architecture
− 32K-Bit (4K-Byte) L1P Program Cache
(Direct Mapped)
− 32K-Bit (4K-Byte) L1D Data Cache
(2-Way Set-Associative)
− 512K-Bit (64K-Byte) L2 Unified Mapped
RAM/Cache
(Flexible Data/Program Allocation)
D Device Configuration
D
D
D
D
D
D
D
D
D
D
− Boot Mode: HPI, 8-, 16-, and 32-Bit ROM
Boot
− Endianness: Little Endian, Big Endian
32-Bit External Memory Interface (EMIF)
− Glueless Interface to Asynchronous
Memories: SRAM and EPROM
− Glueless Interface to Synchronous
Memories: SDRAM and SBSRAM
− 512M-Byte Total Addressable External
Memory Space
Enhanced Direct-Memory-Access (EDMA)
Controller (16 Independent Channels)
16-Bit Host-Port Interface (HPI)
− Access to Entire Memory Map
Two Multichannel Buffered Serial Ports
(McBSPs)
− Direct Interface to T1/E1, MVIP, SCSA
Framers
− ST-Bus-Switching Compatible
− Up to 256 Channels Each
− AC97-Compatible
− Serial-Peripheral-Interface (SPI)
Compatible (Motorola)
Two 32-Bit General-Purpose Timers
Flexible Phase-Locked-Loop (PLL) Clock
Generator
IEEE-1149.1 (JTAG†)
Boundary-Scan-Compatible
256-Pin Ball Grid Array (BGA) Package
(GFN and ZFN Suffixes)
0.18-µm/5-Level Metal Process
− CMOS Technology
3.3-V I/Os, 1.8-V Internal
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
TMS320C62x, VelociTI, and C62x are trademarks of Texas Instruments.
Motorola is a trademark of Motorola, Inc.
All trademarks are the property of their respective owners.
† IEEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture.
Copyright  2004, Texas Instruments Incorporated
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Table of Contents
revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
GFN and ZFN BGA packages (bottom view) . . . . . . . . . . . . 4
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
device characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
device compatibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
functional block and CPU (DSP core) diagram . . . . . . . . . . . 8
CPU (DSP core) description . . . . . . . . . . . . . . . . . . . . . . . . . . 9
memory map summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
peripheral register descriptions . . . . . . . . . . . . . . . . . . . . . . . 12
PWRD bits in CPU CSR register description . . . . . . . . . . . 17
EDMA channel synchronization events . . . . . . . . . . . . . . . . 18
interrupt sources and interrupt selector . . . . . . . . . . . . . . . . 19
signal groups description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
terminal functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
development support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
documentation support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
clock PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
power-down logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
power-supply sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
IEEE 1149.1 JTAG compatibility statement . . . . . . . . . . . . . 40
EMIF device speed . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
bootmode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
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absolute maximum ratings over operating case
temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . 42
recommended operating conditions . . . . . . . . . . . . . . . . 42
electrical characteristics over recommended ranges of
supply voltage and operating case temperature . 42
parameter measurement information . . . . . . . . . . . . . . .
signal transition levels . . . . . . . . . . . . . . . . . . . . . . . . . .
timing parameters and board routing analysis . . . . . .
input and output clocks . . . . . . . . . . . . . . . . . . . . . . . . . . .
asynchronous memory timing . . . . . . . . . . . . . . . . . . . . .
synchronous-burst memory timing . . . . . . . . . . . . . . . . .
synchronous DRAM timing . . . . . . . . . . . . . . . . . . . . . . . .
HOLD/HOLDA timing . . . . . . . . . . . . . . . . . . . . . . . . . . . .
BUSREQ timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
reset timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
external interrupt timing . . . . . . . . . . . . . . . . . . . . . . . . . .
host-port interface timing . . . . . . . . . . . . . . . . . . . . . . . . .
multichannel buffered serial port timing . . . . . . . . . . . . .
timer timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
JTAG test-port timing . . . . . . . . . . . . . . . . . . . . . . . . . . . .
mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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REVISION HISTORY
This data sheet revision history highlights the technical changes made to the SPRS073K device-specific data
sheet to make it an SPRS073L revision.
Scope: Applicable updates to the C62x device family, specifically relating to the C6211 and C6211B devices,
have been incorporated.
PAGE(S)
NO.
ADDITIONS/CHANGES/DELETIONS
Global:
Added “ZFN” mechanical packaging information
3
Moved the Revision History to the front of the document
31
Device Support, Device and Development-Support Tool Nomenclature section:
Updated the “To designate the stages in the product development cycle...” paragraph
Updated the “TMX and TMP devices...” paragraph
Added “The ZFN package, like the GFN package, is ...” paragraph
32
Figure 4. TMS320C6000 DSP Device Nomenclature (Including the TMS320C6211 and TMS320C6211B Devices):
Deleted the “TMS320C6211/C6211B Device Part Numbers (P/Ns) and Ordering Information” table and associated
paragraph
Added “ZFN” package and associated footnote
Added the “For actual device part numbers (P/Ns) and ordering information, ...” footnote
82, 83
Mechanical Data section:
Deleted the “GFN (S-PBGA-N256)” mechanical data package diagram; now an automated merge process
Added “thermal resistance characteristics (S-PBGA package) for ZFN” table
Added new “Packaging Information” title and lead-in sentence
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GFN and ZFN BGA packages (bottom view)
GFN and ZFN 256-PIN BALL GRID ARRAY (BGA) PACKAGES
( BOTTOM VIEW )
Y
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
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description
The TMS320C62x DSPs (including the TMS320C6211/C6211B devices) compose one of the fixed-point DSP
families in the TMS320C6000 DSP platform. The TMS320C6211 (C6211) and TMS320C6211B (C6211B)
devices are based on the high-performance, advanced VelociTI very-long-instruction-word (VLIW)
architecture developed by Texas Instruments (TI), making these DSPs an excellent choice for multichannel and
multifunction applications.
With performance of up to 1333 million instructions per second (MIPS) at a clock rate of 167 MHz, the
C6211/C6211B device offers cost-effective solutions to high-performance DSP programming challenges. The
C6211/C6211B DSP possesses the operational flexibility of high-speed controllers and the numerical capability
of array processors. This processor has 32 general-purpose registers of 32-bit word length and eight highly
independent functional units. The eight functional units provide six arithmetic logic units (ALUs) for a high
degree of parallelism and two 16-bit multipliers for a 32-bit result. The C6211/C6211B can produce two
multiply-accumulates (MACs) per cycle for a total of 333 million MACs per second (MMACS). The
C6211/C6211B DSP also has application-specific hardware logic, on-chip memory, and additional on-chip
peripherals.
The C6211/C6211B uses a two-level cache-based architecture and has a powerful and diverse set of
peripherals. The Level 1 program cache (L1P) is a 32-Kbit direct mapped cache and the Level 1 data cache
(L1D) is a 32-Kbit 2-way set-associative cache. The Level 2 memory/cache (L2) consists of a 512-Kbit memory
space that is shared between program and data space. L2 memory can be configured as mapped memory,
cache, or combinations of the two.The peripheral set includes two multichannel buffered serial ports (McBSPs),
two general-purpose timers, a host-port interface (HPI), and a glueless external memory interface (EMIF)
capable of interfacing to SDRAM, SBSRAM and asynchronous peripherals.
The C6211/C6211B has a complete set of development tools which includes: a new C compiler, an assembly
optimizer to simplify programming and scheduling, and a Windows debugger interface for visibility into source
code execution.
TMS320C6000 is a trademark of Texas Instruments.
Windows is a registered trademark of the Microsoft Corporation.
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SPRS073L − AUGUST 1998 − REVISED JUNE 2005
device characteristics
Table 1 provides an overview of the C6211/C6211B DSP. The table shows significant features of each device,
including the capacity of on-chip RAM, the peripherals, the execution time, and the package type with pin count.
For more details on the C6000 DSP device part numbers and part numbering, see Figure 4.
Table 1. Characteristics of the C6211/C6211B Processors
C6211
(FIXED-POINT DSP)
C6211B
(FIXED-POINT DSP)
EMIF
(Clock source = ECLKIN)
1
1
EDMA
(Internal clock source =
CPU clock frequency)
1
1
HPI
1
1
McBSPs
(Internal clock source =
CPU/2 clock frequency)
2
2
32-Bit Timers
(Internal clock source =
CPU/4 clock frequency)
2
2
HARDWARE FEATURES
Peripherals
Size (Bytes)
72K
72K
On-Chip
Memory
Organization
4K-Byte (4KB) L1 Program (L1P) Cache
4KB L1 Data (L1D) Cache
64KB Unified Mapped RAM/Cache (L2)
4K-Byte (4KB) L1 Program (L1P) Cache
4KB L1 Data (L1D) Cache
64KB Unified Mapped RAM/Cache (L2)
CPU ID+
CPU Rev ID
Control Status Register
(CSR.[31:16])
0x0002
0x0002
Frequency
MHz
Cycle Time
Voltage
167, 150
167, 150
6 ns (C6211-167)
6.7 ns (C6211-150)
6 ns (C6211B-167)
6.7 ns (C6211B-150)
6.7 ns (C6211BGFNA-150)
Core (V)
1.8
1.8
I/O (V)
3.3
3.3
ns
PLL Options
CLKIN frequency multiplier
BGA Packages
27 x 27 mm
Process
Technology
µm
Product Status
Product Preview (PP)
Advance Information (AI)
Production Data (PD)
Bypass (x1), x4
Bypass (x1), x4
256-Pin BGA (GFN)
256-Pin BGA (GFN and ZFN)
0.18 µm
0.18 µm
PD
PD
C6000 is a trademark of Texas Instruments.
6
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SPRS073L − AUGUST 1998 − REVISED JUNE 2005
device compatibility
The TMS320C6211/C6211B and C6711/C6711B devices are pin-compatible and have the same peripheral set;
thus, making new system designs easier and providing faster time to market. The following list summarizes the
device characteristic differences among the C6211, C6211B, C6711, and C6711B devices:
D The C6211 and C6211B devices have a fixed-point C62x CPU, while the C6711 and C6711B devices have
a floating-point C67x CPU.
D The C6211/C6211B device runs at -167 and -150 MHz clock speeds (with a C6211BGFNA extended
temperature device that also runs at -150 MHz), while the C6711/C6711B device runs at -150 and -100 MHz
(with a C6711BGFNA extended temperature device that also runs at -100 MHz).
For a more detailed discussion on the similarities/differences between the C6211 and C6711 devices, see the
How to Begin Development Today with the TMS320C6211 DSP and How to Begin Development with the
TMS320C6711 DSP application reports (literature number SPRA474 and SPRA522, respectively).
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functional block and CPU (DSP core) diagram
SDRAM
SBSRAM
32
SRAM
External
Memory
Interface
(EMIF)
ROM/FLASH
Timer 0
I/O Devices
Timer 1
Multichannel
Buffered
Serial Port 1
(McBSP1)
Framing Chips:
H.100, MVIP,
SCSA, T1, E1
AC97 Devices,
SPI Devices,
Codecs
Multichannel
Buffered
Serial Port 0
(McBSP0)
16
Host Port
Interface
(HPI)
Interrupt
Selector
8
Enhanced
DMA
Controller
(16 channel)
ÁÁÁ
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C6211/C6211B Digital Signal Processors
L1P Cache
Direct Mapped
4K Bytes Total
C6000 CPU (DSP Core)
Instruction Fetch
L2
Memory
4 Banks
64K Bytes
Total
PLL
(x1, x4)
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Control
Registers
Instruction Dispatch
Control
Logic
Instruction Decode
Data Path A
A Register File
.L1
.S1
.M1 .D1
Data Path B
Test
B Register File
.D2 .M2 .S2
.L2
L1D Cache
2-Way Set
Associative
4K Bytes Total
Power-Down
Logic
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Configuration
In-Circuit
Emulation
Interrupt
Control
SPRS073L − AUGUST 1998 − REVISED JUNE 2005
CPU (DSP core) description
The CPU fetches VelociTI advanced very-long instruction words (VLIW) (256 bits wide) to supply up to eight
32-bit instructions to the eight functional units during every clock cycle. The VelociTI VLIW architecture
features controls by which all eight units do not have to be supplied with instructions if they are not ready to
execute. The first bit of every 32-bit instruction determines if the next instruction belongs to the same execute
packet as the previous instruction, or whether it should be executed in the following clock as a part of the next
execute packet. Fetch packets are always 256 bits wide; however, the execute packets can vary in size. The
variable-length execute packets are a key memory-saving feature, distinguishing the C62x CPU from other
VLIW architectures.
The CPU features two sets of functional units. Each set contains four units and a register file. One set contains
functional units .L1, .S1, .M1, and .D1; the other set contains units .D2, .M2, .S2, and .L2. The two register files
each contain 16 32-bit registers for a total of 32 general-purpose registers. The two sets of functional units, along
with two register files, compose sides A and B of the CPU (see the functional block and CPU diagram and
Figure 1). The four functional units on each side of the CPU can freely share the 16 registers belonging to that
side. Additionally, each side features a single data bus connected to all the registers on the other side, by which
the two sets of functional units can access data from the register files on the opposite side. While register access
by functional units on the same side of the CPU as the register file can service all the units in a single clock cycle,
register access using the register file across the CPU supports one read and one write per cycle.
Another key feature of the C62x CPU is the load/store architecture, where all instructions operate on registers
(as opposed to data in memory). Two sets of data-addressing units (.D1 and .D2) are responsible for all data
transfers between the register files and the memory. The data address driven by the .D units allows data
addresses generated from one register file to be used to load or store data to or from the other register file. The
C62x CPU supports a variety of indirect addressing modes using either linear- or circular-addressing modes
with 5- or 15-bit offsets. All instructions are conditional, and most can access any one of the 32 registers. Some
registers, however, are singled out to support specific addressing or to hold the condition for conditional
instructions (if the condition is not automatically “true”). The two .M functional units are dedicated for multiplies.
The two .S and .L functional units perform a general set of arithmetic, logical, and branch functions with results
available every clock cycle.
The processing flow begins when a 256-bit-wide instruction fetch packet is fetched from a program memory.
The 32-bit instructions destined for the individual functional units are “linked” together by “1” bits in the least
significant bit (LSB) position of the instructions. The instructions that are “chained” together for simultaneous
execution (up to eight in total) compose an execute packet. A “0” in the LSB of an instruction breaks the chain,
effectively placing the instructions that follow it in the next execute packet. If an execute packet crosses the
fetch-packet boundary (256 bits wide), the assembler places it in the next fetch packet, while the remainder of
the current fetch packet is padded with NOP instructions. The number of execute packets within a fetch packet
can vary from one to eight. Execute packets are dispatched to their respective functional units at the rate of one
per clock cycle and the next 256-bit fetch packet is not fetched until all the execute packets from the current fetch
packet have been dispatched. After decoding, the instructions simultaneously drive all active functional units
for a maximum execution rate of eight instructions every clock cycle. While most results are stored in 32-bit
registers, they can be subsequently moved to memory as bytes or half-words as well. All load and store
instructions are byte-, half-word, or word-addressable.
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CPU (DSP core) description (continued)
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src1
.L1
src2
dst
long dst
long src
ST1
Data Path A
long src
long dst
dst
.S1
src1
8
8
32
8
Register
File A
(A0−A15)
src2
.M1
dst
src1
src2
LD1
DA1
DA2
.D1
.D2
dst
src1
src2
2X
1X
src2
src1
dst
LD2
src2
.M2
src1
dst
src2
Data Path B
src1
.S2
dst
long dst
long src
ST2
long src
long dst
dst
.L2
src2
Register
File B
(B0−B15)
8
32
8
src1
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Á
8
Control
Register
File
Figure 1. TMS320C62x CPU (DSP Core) Data Paths
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memory map summary
Table 2 shows the memory map address ranges of the C6211/C6211B devices. Internal memory is always
located at address 0 and can be used as both program and data memory. The C6211/C6211B configuration
registers for the common peripherals are located at the same hex address ranges. The external memory
address ranges in the C6211/C6211B devices begin at the address location 0x8000 0000.
Table 2. TMS320C6211/C6211B Memory Map Summary
MEMORY BLOCK DESCRIPTION
BLOCK SIZE (BYTES)
Internal RAM (L2)
64K
HEX ADDRESS RANGE
0000 0000 – 0000 FFFF
Reserved
24M – 64K
0001 0000 – 017F FFFF
External Memory Interface (EMIF) Registers
256K
0180 0000 – 0183 FFFF
L2 Registers
256K
0184 0000 – 0187 FFFF
HPI Registers
256K
0188 0000 – 018B FFFF
McBSP 0 Registers
256K
018C 0000 – 018F FFFF
McBSP 1 Registers
256K
0190 0000 – 0193 FFFF
Timer 0 Registers
256K
0194 0000 – 0197 FFFF
Timer 1 Registers
256K
0198 0000 – 019B FFFF
Interrupt Selector Registers
256K
019C 0000 – 019F FFFF
EDMA RAM and EDMA Registers
256K
01A0 0000 – 01A3 FFFF
Reserved
6M – 256K
01A4 0000 – 01FF FFFF
QDMA Registers
52
0200 0000 – 0200 0033
Reserved
736M – 52
0200 0034 – 2FFF FFFF
McBSP 0/1 Data
256M
3000 0000 – 3FFF FFFF
Reserved
EMIF CE0†
1G
4000 0000 – 7FFF FFFF
256M
8000 0000 – 8FFF FFFF
EMIF CE1†
EMIF CE2†
256M
9000 0000 – 9FFF FFFF
256M
A000 0000 – AFFF FFFF
EMIF CE3†
256M
B000 0000 – BFFF FFFF
Reserved
1G
C000 0000 – FFFF FFFF
† The number of EMIF address pins (EA[21:2]) limits the maximum addressable memory (SDRAM) to 128MB per CE space. To get 256MB of
addressable memory, additional general-purpose output pin or external logic is required.
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peripheral register descriptions
Table 3 through Table 13 identify the peripheral registers for the C6211/C6211B device by their register names,
acronyms, and hex address or hex address range. For more detailed information on the register contents, bit
names, and their descriptions, see the TMS320C6000 DSP Peripherals Overview Reference Guide (literature
number SPRU190).
Table 3. EMIF Registers
HEX ADDRESS RANGE
ACRONYM
0180 0000
GBLCTL
EMIF global control
REGISTER NAME
0180 0004
CECTL1
EMIF CE1 space control
0180 0008
CECTL0
EMIF CE0 space control
0180 000C
−
0180 0010
CECTL2
Reserved
EMIF CE2 space control
0180 0014
CECTL3
EMIF CE3 space control
0180 0018
SDCTL
EMIF SDRAM control
0180 001C
SDTIM
EMIF SDRAM refresh control
0180 0020
SDEXT
EMIF SDRAM extension
0180 0024 − 0183 FFFF
−
Reserved
Table 4. L2 Cache Registers
12
HEX ADDRESS RANGE
ACRONYM
0184 0000
CCFG
REGISTER NAME
0184 4000
L2FBAR
L2 flush base address register
0184 4004
L2FWC
L2 flush word count register
0184 4010
L2CBAR
L2 clean base address register
0184 4014
L2CWC
L2 clean word count register
0184 4020
L1PFBAR
L1P flush base address register
0184 4024
L1PFWC
L1P flush word count register
0184 4030
L1DFBAR
L1D flush base address register
0184 4034
L1DFWC
L1D flush word count register
0184 5000
L2FLUSH
L2 flush register
0184 5004
L2CLEAN
L2 clean register
0184 8200
MAR0
Controls CE0 range 8000 0000 − 80FF FFFF
0184 8204
MAR1
Controls CE0 range 8100 0000 − 81FF FFFF
0184 8208
MAR2
Controls CE0 range 8200 0000 − 82FF FFFF
0184 820C
MAR3
Controls CE0 range 8300 0000 − 83FF FFFF
0184 8240
MAR4
Controls CE1 range 9000 0000 − 90FF FFFF
0184 8244
MAR5
Controls CE1 range 9100 0000 − 91FF FFFF
0184 8248
MAR6
Controls CE1 range 9200 0000 − 92FF FFFF
0184 824C
MAR7
Controls CE1 range 9300 0000 − 93FF FFFF
0184 8280
MAR8
Controls CE2 range A000 0000 − A0FF FFFF
0184 8284
MAR9
Controls CE2 range A100 0000 − A1FF FFFF
0184 8288
MAR10
Controls CE2 range A200 0000 − A2FF FFFF
0184 828C
MAR11
Controls CE2 range A300 0000 − A3FF FFFF
0184 82C0
MAR12
Controls CE3 range B000 0000 − B0FF FFFF
0184 82C4
MAR13
Controls CE3 range B100 0000 − B1FF FFFF
0184 82C8
MAR14
Controls CE3 range B200 0000 − B2FF FFFF
0184 82CC
MAR15
Controls CE3 range B300 0000 − B3FF FFFF
0184 82D0 − 0187 FFFF
−
Cache configuration register
Reserved
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peripheral register descriptions (continued)
Table 5. EDMA Registers
HEX ADDRESS RANGE
ACRONYM
REGISTER NAME
01A0 FF9C − 01A0 FFDC
−
01A0 FFE0
PQSR
Reserved
Priority queue status register
01A0 FFE4
CIPR
Channel interrupt pending register
01A0 FFE8
CIER
Channel interrupt enable register
01A0 FFEC
CCER
Channel chain enable register
01A0 FFF0
ER
01A0 FFF4
EER
Event enable register
01A0 FFF8
ECR
Event clear register
01A0 FFFC
ESR
Event set register
01A1 0000 − 01A3 FFFF
–
Event register
Reserved
Table 6. EDMA Parameter RAM†
HEX ADDRESS RANGE
ACRONYM
01A0 0000 − 01A0 0017
−
Parameters for Event 0 (6 words)
REGISTER NAME
01A0 0018 − 01A0 002F
−
Parameters for Event 1 (6 words)
01A0 0030 − 01A0 0047
−
Parameters for Event 2 (6 words)
01A0 0048 − 01A0 005F
−
Parameters for Event 3 (6 words)
01A0 0060 − 01A0 0077
−
Parameters for Event 4 (6 words)
01A0 0078 − 01A0 008F
−
Parameters for Event 5 (6 words)
01A0 0090 − 01A0 00A7
−
Parameters for Event 6 (6 words)
01A0 00A8 − 01A0 00BF
−
Parameters for Event 7 (6 words)
01A0 00C0 − 01A0 00D7
−
Parameters for Event 8 (6 words)
01A0 00D8 − 01A0 00EF
−
Parameters for Event 9 (6 words)
01A0 00F0 − 01A0 00107
−
Parameters for Event 10 (6 words)
01A0 0108 − 01A0 011F
−
Parameters for Event 11 (6 words)
01A0 0120 − 01A0 0137
−
Parameters for Event 12 (6 words)
01A0 0138 − 01A0 014F
−
Parameters for Event 13 (6 words)
01A0 0150 − 01A0 0167
−
Parameters for Event 14 (6 words)
01A0 0168 − 01A0 017F
−
Parameters for Event 15 (6 words)
01A0 0180 − 01A0 0197
−
Reload/link parameters for Event M (6 words)
01A0 0198 − 01A0 01AF
−
Reload/link parameters for Event N (6 words)
...
...
01A0 07E0 − 01A0 07F7
−
01A0 07F8 − 01A0 07FF
−
Reload/link parameters for Event Z (6 words)
Scratch pad area (2 words)
† The C6211/C6211B device has sixty-nine parameter sets [six (6) words each] that can be used to reload/link EDMA transfers.
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peripheral register descriptions (continued)
Table 7. Quick DMA (QDMA) and Pseudo Registers†
HEX ADDRESS RANGE
ACRONYM
REGISTER NAME
0200 0000
QOPT
QDMA options parameter register
0200 0004
QSRC
QDMA source address register
0200 0008
QCNT
QDMA frame count register
0200 000C
QDST
QDMA destination address register
0200 0010
QIDX
QDMA index register
0200 0014 − 0200 001C
−
0200 0020
QSOPT
QDMA pseudo options register
0200 0024
QSSRC
QDMA pseudo source address register
0200 0028
QSCNT
QDMA pseudo frame count register
0200 002C
QSDST
QDMA pseudo destination address register
0200 0030
QSIDX
Reserved
QDMA pseudo index register
† All the QDMA and Pseudo registers are write-accessible only
Table 8. Interrupt Selector Registers
HEX ADDRESS RANGE
14
ACRONYM
REGISTER NAME
COMMENTS
019C 0000
MUXH
Interrupt multiplexer high
Selects which interrupts drive CPU interrupts
10−15 (INT10−INT15)
019C 0004
MUXL
Interrupt multiplexer low
Selects which interrupts drive CPU interrupts 4−9
(INT04−INT09)
019C 0008
EXTPOL
External interrupt polarity
Sets the polarity of the external interrupts
(EXT_INT4−EXT_INT7)
019C 000C − 019F FFFF
−
Reserved
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peripheral register descriptions (continued)
Table 9. McBSP 0 Registers
HEX ADDRESS RANGE
ACRONYM
REGISTER NAME
018C 0000
DRR0
McBSP0 data receive register via Peripheral Bus
0x3000 0000 − 0x33FF FFFF
DRR0
McBSP0 data receive register via EDMA Bus
018C 0004
DXR0
McBSP0 data transmit register via Peripheral Bus
0x3000 0000 − 0x33FF FFFF
DXR0
McBSP0 data transmit register via EDMA Bus
018C 0008
SPCR0
018C 000C
RCR0
McBSP0 receive control register
018C 0010
XCR0
McBSP0 transmit control register
018C 0014
SRGR0
018C 0018
MCR0
McBSP0 multichannel control register
018C 001C
RCER0
McBSP0 receive channel enable register
018C 0020
XCER0
McBSP0 transmit channel enable register
018C 0024
PCR0
018C 0028 − 018F FFFF
−
COMMENTS
The CPU and DMA/EDMA
controller can only read this
register; they cannot write to
it.
McBSP0 serial port control register
McBSP0 sample rate generator register
McBSP0 pin control register
Reserved
Table 10. McBSP 1 Registers
HEX ADDRESS RANGE
ACRONYM
REGISTER NAME
0190 0000
DRR1
Data receive register via Peripheral Bus
0x3400 0000 − 0x37FF FFFF
DRR1
McBSP1 data receive register via EDMA Bus
0190 0004
DXR1
McBSP1 data transmit register via Peripheral Bus
0x3400 0000 − 0x37FF FFFF
DXR1
McBSP1 data transmit register via EDMA Bus
0190 0008
SPCR1
0190 000C
RCR1
McBSP1 receive control register
0190 0010
XCR1
McBSP1 transmit control register
0190 0014
SRGR1
0190 0018
MCR1
McBSP1 multichannel control register
0190 001C
RCER1
McBSP1 receive channel enable register
0190 0020
XCER1
McBSP1 transmit channel enable register
0190 0024
PCR1
0190 0028 − 0193 FFFF
−
COMMENTS
The CPU and DMA/EDMA
controller can only read this
register; they cannot write to
it.
McBSP1 serial port control register
McBSP1 sample rate generator register
McBSP1 pin control register
Reserved
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peripheral register descriptions (continued)
Table 11. Timer 0 Registers
HEX ADDRESS RANGE
ACRONYM
REGISTER NAME
COMMENTS
0194 0000
CTL0
Timer 0 control register
Determines the operating mode of the timer,
monitors the timer status, and controls the function
of the TOUT pin.
0194 0004
PRD0
Timer 0 period register
Contains the number of timer input clock cycles to
count. This number controls the TSTAT signal
frequency.
0194 0008
CNT0
Timer 0 counter register
Contains the current value of the incrementing
counter.
0194 000C − 0197 FFFF
−
Reserved
Table 12. Timer 1 Registers
HEX ADDRESS RANGE
ACRONYM
REGISTER NAME
COMMENTS
0198 0000
CTL1
Timer 1 control register
Determines the operating mode of the timer,
monitors the timer status, and controls the function
of the TOUT pin.
0198 0004
PRD1
Timer 1 period register
Contains the number of timer input clock cycles to
count. This number controls the TSTAT signal
frequency.
0198 0008
CNT1
Timer 1 counter register
Contains the current value of the incrementing
counter.
0198 000C − 019B FFFF
−
Reserved
Table 13. HPI Registers
16
HEX ADDRESS RANGE
ACRONYM
−
HPID
HPI data register
REGISTER NAME
Host read/write access only
COMMENTS
−
HPIA
HPI address register
Host read/write access only
0188 0000
HPIC
HPI control register
Both Host/CPU read/write access
0188 0001 − 018B FFFF
−
Reserved
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PWRD bits in CPU CSR register description
Table 14 identifies the PWRD field (bits 15−10) in the CPU CSR register. These bits control the device
power-down modes. For more detailed information on the PWRD bit field of the CPU CSR register, see the
TMS320C6000 CPU and Instruction Set Reference Guide (literature number SPRU189).
Table 14. PWRD field bits in the CPU CSR Register
HEX ADDRESS RANGE
−
ACRONYM
CSR
REGISTER NAME
Control status register
COMMENTS
The PWRD field (bits 15−10 in the CPU CSR)
controls the device power-down modes.
Accessible by writing a value to the CSR register.
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EDMA channel synchronization events
The C62x EDMA supports up to 16 EDMA channels. Four of the sixteen channels (channels 8−11) are reserved
for EDMA chaining, leaving 12 EDMA channels available to service peripheral devices. Table 15 lists the source
of synchronization events associated with each of the programmable EDMA channels. For the C6211/11B, the
association of an event to a channel is fixed; each of the EDMA channels has one specific event associated
with it. For more detailed information on the EDMA module, associated channels, and event-transfer chaining,
see the TMS320C6000 DSP Enhanced Direct Memory Access (EDMA) Controller Reference Guide (literature
number SPRU234).
Table 15. TMS320C6211/C6211B EDMA Channel Synchronization Events
EDMA
CHANNEL
EVENT NAME
0
DSP_INT
1
TINT0
Timer 0 interrupt
2
TINT1
Timer 1 interrupt
3
SD_INT
4
EXT_INT4
External interrupt pin 4
5
EXT_INT5
External interrupt pin 5
6
EXT_INT6
External interrupt pin 6
7
8†
EXT_INT7
External interrupt pin 7
EVENT DESCRIPTION
Host-port interface (HPI)-to-DSP interrupt
EMIF SDRAM timer interrupt
EDMA_TCC8
EDMA transfer complete code (TCC) 1000b interrupt
9†
10†
EDMA_TCC9
EDMA TCC 1001b interrupt
EDMA_TCC10
EDMA TCC 1010b interrupt
11†
EDMA_TCC11
EDMA TCC 1011b interrupt
12
XEVT0
McBSP0 transmit event
13
REVT0
McBSP0 receive event
14
XEVT1
McBSP1 transmit event
15
REVT1
McBSP1 receive event
† EDMA channels 8 through 11 are used for transfer chaining only. For more detailed information on event-transfer chaining, see the
TMS320C6000 DSP Enhanced Direct Memory Access (EDMA) Controller Reference Guide (literature number SPRU234).
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interrupt sources and interrupt selector
The C62x DSP core supports 16 prioritized interrupts, which are listed in Table 16. The highest-priority interrupt
is INT_00 (dedicated to RESET) while the lowest-priority interrupt is INT_15. The first four interrupts
(INT_00−INT_03) are non-maskable and fixed. The remaining interrupts (INT_04−INT_15) are maskable and
default to the interrupt source specified in Table 16. The interrupt source for interrupts 4−15 can be programmed
by modifying the selector value (binary value) in the corresponding fields of the Interrupt Selector Control
registers: MUXH (address 0x019C0000) and MUXL (address 0x019C0004).
Table 16. C6211/C6211B DSP Interrupts
INTERRUPT
SELECTOR
CONTROL
REGISTER
SELECTOR
VALUE
(BINARY)
INTERRUPT
EVENT
INT_00†
INT_01†
−
−
RESET
−
−
NMI
INT_02†
INT_03†
−
−
Reserved
Reserved. Do not use.
−
−
Reserved
Reserved. Do not use.
INT_04‡
INT_05‡
MUXL[4:0]
00100
EXT_INT4
External interrupt pin 4
MUXL[9:5]
00101
EXT_INT5
External interrupt pin 5
INT_06‡
INT_07‡
MUXL[14:10]
00110
EXT_INT6
External interrupt pin 6
MUXL[20:16]
00111
EXT_INT7
External interrupt pin 7
INT_08‡
INT_09‡
MUXL[25:21]
01000
EDMA_INT
EDMA channel (0 through 15) interrupt
MUXL[30:26]
01001
Reserved
INT_10‡
INT_11‡
MUXH[4:0]
00011
SD_INT
MUXH[9:5]
01010
Reserved
None, but programmable
INT_12‡
INT_13‡
MUXH[14:10]
01011
Reserved
None, but programmable
MUXH[20:16]
00000
DSP_INT
Host-port interface (HPI)-to-DSP interrupt
INT_14‡
INT_15‡
MUXH[25:21]
00001
TINT0
Timer 0 interrupt
MUXH[30:26]
00010
TINT1
Timer 1 interrupt
−
−
01100
XINT0
McBSP0 transmit interrupt
−
−
01101
RINT0
McBSP0 receive interrupt
−
−
01110
XINT1
McBSP1 transmit interrupt
−
−
01111
RINT1
McBSP1 receive interrupt
−
−
10000 − 11111
Reserved
CPU
INTERRUPT
NUMBER
INTERRUPT SOURCE
None, but programmable
EMIF SDRAM timer interrupt
Reserved. Do not use.
† Interrupts INT_00 through INT_03 are non-maskable and fixed.
‡ Interrupts INT_04 through INT_15 are programmable by modifying the binary selector values in the Interrupt Selector Control
registers fields. Table 16 shows the default interrupt sources for Interrupts INT_04 through INT_15. For more detailed
information on interrupt sources and selection, see the TMS320C6000 DSP Interrupt Selector Reference Guide (literature
number SPRU646).
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signal groups description
CLKIN
CLKOUT2
CLKOUT1
CLKMODE0
PLLV
PLLG
PLLF
Clock/PLL
TMS
TDO
TDI
TCK
TRST
EMU0
EMU1
EMU2
EMU3
EMU4
EMU5
Reset and
Interrupts
RESET
NMI
EXT_INT7
EXT_INT6
EXT_INT5
EXT_INT4
RSV5
IEEE Standard
1149.1
(JTAG)
Emulation
Reserved
RSV4
RSV3
RSV2
RSV1
RSV0
Control/Status
HD[15:0]
HCNTL0
HCNTL1
16
Data
HPI
(Host-Port Interface)
Register Select
Control
HHWIL
Half-Word
Select
Figure 2. CPU (DSP Core) and Peripheral Signals
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HAS
HR/W
HCS
HDS1
HDS2
HRDY
HINT
SPRS073L − AUGUST 1998 − REVISED JUNE 2005
signal groups description (continued)
32
ED[31:0]
Data
Memory
Control
CE3
CE2
CE1
CE0
EA[21:2]
BE3
BE2
BE1
BE0
TOUT1
Memory Map
Space Select
20
Address
Bus
Arbitration
ECLKIN
ECLKOUT
ARE/SDCAS/SSADS
AOE/SDRAS/SSOE
AWE/SDWE/SSWE
ARDY
HOLD
HOLDA
BUSREQ
Byte Enables
EMIF
(External Memory Interface)
Timer 1
Timer 0
TOUT0
TINP0
TINP1
Timers
McBSP1
McBSP0
CLKX1
FSX1
DX1
Transmit
Transmit
CLKX0
FSX0
DX0
CLKR1
FSR1
DR1
Receive
Receive
CLKR0
FSR0
DR0
CLKS1
Clock
Clock
CLKS0
McBSPs
(Multichannel Buffered Serial Ports)
Figure 3. Peripheral Signals
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Terminal Functions
SIGNAL
NAME
NO.
TYPE†
IPD/
IPU‡
DESCRIPTION
CLOCK/PLL
CLKIN
A3
I
IPD
Clock Input
CLKOUT1
D7
O
IPD
Clock output at device speed
The CLK1EN bit in the EMIF GBLCTL register controls the CLKOUT1 pin.
CLK1EN = 0:
CLKOUT1 is disabled
CLK1EN = 1:
CLKOUT1 enabled to clock [default]
CLKOUT2
Y12
O
IPD
Clock output at half of device speed
When the CLKOUT2 pin is enabled, the CLK2EN bit in the EMIF global control register
(GBLCTL) controls the CLKOUT2 pin.
CLK2EN = 0:
CLKOUT2 is disabled
CLK2EN = 1:
CLKOUT1 enabled to clock [default]
CLKMODE0
C4
I
IPU
Clock mode select
• Selects whether the CPU clock frequency = input clock frequency x4 or x1
PLLV§
PLLG§
A4
A¶
A¶
PLL analog VCC connection for the low-pass filter
C6
B5
A¶
PLL low-pass filter connection to external components and a bypass capacitor
PLLF
PLL analog GND connection for the low-pass filter
JTAG EMULATION
TMS
B7
I
IPU
JTAG test-port mode select
TDO
A8
O/Z
IPU
JTAG test-port data out
TDI
A7
I
IPU
JTAG test-port data in
TCK
A6
I
IPU
JTAG test-port clock
TRST
B6
I
IPD
JTAG test-port reset
EMU5
B12
I/O/Z
IPU
Emulation pin 5. Reserved for future use, leave unconnected.
EMU4
C11
I/O/Z
IPU
Emulation pin 4. Reserved for future use, leave unconnected.
EMU3
B10
I/O/Z
IPU
Emulation pin 3. Reserved for future use, leave unconnected.
EMU2
D10
I/O/Z
IPU
EMU1
B9
I/O/Z
IPU
Emulation pin 2. Reserved for future use, leave unconnected.
Emulation pin 1#
EMU0
D9
I/O/Z
IPU
Emulation pin 0#
RESET
A13
I
IPU
Device reset
NMI
C13
I
IPD
Nonmaskable interrupt
• Edge-driven (rising edge)
Any noise on the NMI pin may trigger an NMI interrupt; therefore, if the NMI pin is not used, it is
recommended that the NMI pin be grounded versus relying on the IPD.
I
IPU
External interrupts
• Edge-driven
• Polarity independently selected via the External Interrupt Polarity Register bits
(EXTPOL.[3:0])
RESETS AND INTERRUPTS
EXT_INT7
E3
EXT_INT6
D2
EXT_INT5
C1
EXT_INT4
C2
HINT
J20
O
IPU
Host interrupt (from DSP to host)
HCNTL1
G19
I
IPU
Host control − selects between control, address, or data registers
HCNTL0
G18
I
IPU
Host control − selects between control, address, or data registers
HHWIL
H20
I
IPU
Host half-word select − first or second half-word (not necessarily high or low order)
HOST-PORT INTERFACE (HPI)
HR/W
G20
I
IPU
Host read or write select
† I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground
‡ IPD = Internal pulldown, IPU = Internal pullup. (These IPD/IPU signal pins feature a 30-kΩ IPD or IPU resistor. To pull up a signal to the opposite
supply rail, a 1-kΩ resistor should be used.)
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§ PLLV and PLLG are not part of external voltage supply or ground. See the CLOCK/PLL documentation for information on how to connect these
pins.
¶ A = Analog signal (PLL Filter)
# The EMU0 and EMU1 pins are internally pulled up with 30-kΩ resistors; therefore, for emulation and normal operation, no external
pullup/pulldown resistors are necessary. However, for boundary scan operation, pull down the EMU1 and EMU0 pins with a dedicated 1-kΩ
resistor.
Terminal Functions (Continued)
SIGNAL
NAME
NO.
TYPE†
IPD/
IPU‡
DESCRIPTION
HOST-PORT INTERFACE (HPI) (CONTINUED)
HD15
B14
IPU
HD14
C14
IPU
HD13
A15
IPU
HD12
C15
IPU
HD11
A16
IPU
HD10
B16
IPU
HD9
C16
IPU
HD8
B17
HD7
A18
HD6
C17
IPU
HD5
B18
IPU
HD4
C19
IPD
HD3
C20
IPU
HD2
D18
IPU
HD1
D20
IPU
HD0
E20
HAS
E18
I
IPU
Host address strobe
HCS
F20
I
IPU
Host chip select
HDS1
E19
I
IPU
Host data strobe 1
HDS2
F18
I
IPU
Host data strobe 2
HRDY
H19
O
IPD
Host ready (from DSP to host)
IPU
I/O/Z
IPU
Host-port data
• Used for transfer of data, address, and control
• Also controls initialization of DSP modes at reset via pullup/pulldown resistors
− Device Endian mode
HD8: 0 – Big Endian
1 − Little Endian
− Boot mode
HD[4:3]: 00 – HPI boot
01 − 8-bit ROM boot with default timings
10 − 16-bit ROM boot with default timings
11 − 32-bit ROM boot with default timings
IPU
EMIF − CONTROL SIGNALS COMMON TO ALL TYPES OF MEMORY
CE3
V6
O/Z
IPU
CE2
W6
O/Z
IPU
CE1
W18
O/Z
IPU
CE0
V17
O/Z
IPU
BE3
V5
O/Z
IPU
BE2
Y4
O/Z
IPU
BE1
U19
O/Z
IPU
Memory space enables
• Enabled by bits 28 through 31 of the word address
• Only one asserted during any external data access
Byte-enable control
• Decoded from the two lowest bits of the internal address
• Byte-write enables for most types of memory
• Can be directly connected to SDRAM read and write mask signal (SDQM)
BE0
V20
O/Z
IPU
† I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground
‡ IPD = Internal pulldown, IPU = Internal pullup. (These IPD/IPU signal pins feature a 30-kΩ IPD or IPU resistor. To pull up a signal to the opposite
supply rail, a 1-kΩ resistor should be used.)
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Terminal Functions (Continued)
SIGNAL
NAME
NO.
TYPE†
IPD/
IPU‡
DESCRIPTION
EMIF − BUS ARBITRATION
HOLDA
J18
O
IPU
Hold-request-acknowledge to the host
HOLD
J17
I
IPU
Hold request from the host
BUSREQ
J19
O
IPU
Bus request output
EMIF − ASYNCHRONOUS/SYNCHRONOUS DRAM/SYNCHRONOUS BURST SRAM MEMORY CONTROL
ECLKIN
Y11
I
IPD
EMIF input clock
ECLKOUT
Y10
O
IPD
EMIF output clock (based on ECLKIN)
ARE/SDCAS/
SSADS
V11
O/Z
IPU
Asynchronous memory read enable/SDRAM column-address strobe/SBSRAM address strobe
AOE/SDRAS/
SSOE
W10
O/Z
IPU
Asynchronous memory output enable/SDRAM row-address strobe/SBSRAM output enable
AWE/SDWE/
SSWE
V12
O/Z
IPU
Asynchronous memory write enable/SDRAM write enable/SBSRAM write enable
ARDY
Y5
I
IPU
Asynchronous memory ready input
EMIF − ADDRESS
EA21
U18
EA20
Y18
EA19
W17
EA18
Y16
EA17
V16
EA16
Y15
EA15
W15
EA14
Y14
EA13
W14
EA12
V14
EA11
W13
EA10
V10
EA9
Y9
EA8
V9
EA7
Y8
EA6
W8
EA5
V8
EA4
W7
EA3
V7
O/Z
IPU
EMIF external address
EA2
Y6
† I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground
‡ IPD = Internal pulldown, IPU = Internal pullup. (These IPD/IPU signal pins feature a 30-kΩ IPD or IPU resistor. To pull up a signal to the opposite
supply rail, a 1-kΩ resistor should be used.)
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Terminal Functions (Continued)
SIGNAL
NAME
NO.
TYPE†
IPD/
IPU‡
DESCRIPTION
EMIF − DATA
ED31
N3
ED30
P3
ED29
P2
ED28
P1
ED27
R2
ED26
R3
ED25
T2
ED24
T1
ED23
U3
ED22
U1
ED21
U2
ED20
V1
ED19
V2
ED18
Y3
ED17
W4
ED16
V4
ED15
T19
ED14
T20
ED13
T18
ED12
R20
ED11
R19
ED10
P20
ED9
P18
ED8
N20
ED7
N19
ED6
N18
ED5
M20
ED4
M19
ED3
L19
ED2
L18
ED1
K19
I/O/Z
IPU
External data
ED0
K18
† I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground
‡ IPD = Internal pulldown, IPU = Internal pullup. (These IPD/IPU signal pins feature a 30-kΩ IPD or IPU resistor. To pull up a signal to the opposite
supply rail, a 1-kΩ resistor should be used.)
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Terminal Functions (Continued)
SIGNAL
NAME
NO.
TYPE†
IPD/
IPU‡
DESCRIPTION
TIMER 1
TOUT1
F1
O
IPD
Timer 1 or general-purpose output
TINP1
F2
I
IPD
Timer 1 or general-purpose input
TIMER 0
TOUT0
G1
O
IPD
Timer 0 or general-purpose output
TINP0
G2
I
IPD
Timer 0 or general-purpose input
CLKS1
E1
I
IPD
External clock source (as opposed to internal)
CLKR1
M1
I/O/Z
IPD
Receive clock
CLKX1
L3
I/O/Z
IPD
Transmit clock
DR1
M2
I
IPU
Receive data
DX1
L2
O/Z
IPU
Transmit data
FSR1
M3
I/O/Z
IPD
Receive frame sync
FSX1
L1
I/O/Z
IPD
Transmit frame sync
CLKS0
K3
I
IPD
External clock source (as opposed to internal)
CLKR0
H3
I/O/Z
IPD
Receive clock
CLKX0
G3
I/O/Z
IPD
Transmit clock
DR0
J1
I
IPU
Receive data
DX0
H2
O/Z
IPU
Transmit data
FSR0
J3
I/O/Z
IPD
Receive frame sync
FSX0
H1
I/O/Z
IPD
Transmit frame sync
RSV0
C12
O
IPU
Reserved (leave unconnected, do not connect to power or ground)
RSV1
D12
O
IPU
Reserved (leave unconnected, do not connect to power or ground)
RSV2
A5
O
IPU
Reserved (leave unconnected, do not connect to power or ground)
RSV3
D3
O
Reserved (leave unconnected, do not connect to power or ground)
RSV4
N2
O
Reserved (leave unconnected, do not connect to power or ground)
MULTICHANNEL BUFFERED SERIAL PORT 1 (McBSP1)
MULTICHANNEL BUFFERED SERIAL PORT 0 (McBSP0)
RESERVED FOR TEST
RSV5
Y20
O
Reserved (leave unconnected, do not connect to power or ground)
† I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground
‡ IPD = Internal pulldown, IPU = Internal pullup. (These IPD/IPU signal pins feature a 30-kΩ IPD or IPU resistor. To pull up a signal to the opposite
supply rail, a 1-kΩ resistor should be used.)
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Terminal Functions (Continued)
SIGNAL
NAME
NO.
TYPE†
DESCRIPTION
SUPPLY VOLTAGE PINS
A17
B3
B8
B13
C5
C10
D1
D16
D19
F3
H18
J2
M18
N1
DVDD
R1
S
3.3-V supply voltage
S
1.8-V supply voltage
R18
T3
U5
U7
U12
U16
V13
V15
V19
W3
W9
W12
Y7
Y17
A9
A10
A12
B2
B19
C3
CVDD
C7
C18
D5
D6
D11
D14
† I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground
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Terminal Functions (Continued)
SIGNAL
NAME
NO.
TYPE†
DESCRIPTION
SUPPLY VOLTAGE PINS (CONTINUED)
D15
F4
F17
K1
K4
K17
L4
L17
L20
R4
CVDD
R17
S
1.8-V supply voltage
U6
U10
U11
U14
U15
V3
V18
W2
W19
GROUND PINS
A1
A2
A11
A14
A19
A20
B1
B4
B11
VSS
B15
GND
Ground pins
B20
C8
C9
D4
D8
D13
D17
E2
† I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground
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Terminal Functions (Continued)
SIGNAL
NAME
NO.
TYPE†
DESCRIPTION
GROUND PINS (CONTINUED)
E4
E17
F19
G4
G17
H4
H17
J4
K2
K20
M4
M17
N4
N17
P4
P17
P19
VSS
T4
GND
Ground pins
T17
U4
U8
U9
U13
U17
U20
W1
W5
W11
W16
W20
Y1
Y2
Y13
Y19
† I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground
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development support
TI offers an extensive line of development tools for the TMS320C6000 DSP platform, including tools to
evaluate the performance of the processors, generate code, develop algorithm implementations, and fully
integrate and debug software and hardware modules.
The following products support development of C6000 DSP-based applications:
Software Development Tools:
Code Composer Studio Integrated Development Environment (IDE): including Editor
C/C++/Assembly Code Generation, and Debug plus additional development tools
Scalable, Real-Time Foundation Software (DSP/BIOS), which provides the basic run-time target software
needed to support any DSP application.
Hardware Development Tools:
Extended Development System (XDS) Emulator (supports C6000 DSP multiprocessor system debug)
EVM (Evaluation Module)
For a complete listing of development-support tools for the TMS320C6000 DSP platform, visit the Texas
Instruments web site on the Worldwide Web at http://www.ti.com uniform resource locator (URL) and select
“Find Development Tools”. For device-specific tools, under “Semiconductor Products”, select “Digital Signal
Processors”, choose a product family, and select the particular DSP device. For information on pricing and
availability, contact the nearest TI field sales office or authorized distributor.
Code Composer Studio, DSP/BIOS, and XDS are trademarks of Texas Instruments.
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device and development-support tool nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all DSP
devices and support tools. Each DSP commercial family member has one of three prefixes: TMX, TMP, or
TMS (e.g., TMS320C6211GFN167). Texas Instruments recommends two of three possible prefix designators
for support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development
from engineering prototypes (TMX / TMDX) through fully qualified production devices/tools (TMS / TMDS).
Device development evolutionary flow:
TMX
Experimental device that is not necessarily representative of the final device’s electrical specifications
TMP
Final silicon die that conforms to the device’s electrical specifications but has not completed quality
and reliability verification
TMS
Fully qualified production device
Support tool development evolutionary flow:
TMDX Development-support product that has not yet completed Texas Instruments internal qualification
testing.
TMDS Fully qualified development-support product
TMX and TMP devices and TMDX development-support tools are shipped with the following disclaimer:
“Developmental product is intended for internal evaluation purposes.”
TMS devices and TMDS development-support tools have been characterized fully, and the quality and reliability
of the device have been demonstrated fully. TI’s standard warranty applies.
Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard production
devices. Texas Instruments recommends that these devices not be used in any production system because their
expected end-use failure rate still is undefined. Only qualified production devices are to be used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type
(for example, GFN), the temperature range (for example, blank is the default commercial temperature range),
and the device speed range in megahertz (for example, -167 is 167 MHz).
The ZFN package, like the GFN package, is a 256-ball plastic BGA only with Pb-free balls. For device part
numbers and further ordering information for TMS320C6211/6211B in the GFN and ZFN, package types, see
the TI website (http://www.ti.com) or contact your TI sales representative.
TMS320 is a trademark of Texas Instruments.
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device and development-support tool nomenclature (continued)
TMS 320
C 6211
GFN
( )
167
PREFIX
TMX = Experimental device
TMP = Prototype device
TMS = Qualified device
SMJ = MIL-PRF-38535, QML
SM = High Rel (non-38535)
DEVICE FAMILY
32 or 320 = TMS320 DSP family
DEVICE SPEED RANGE
100 MHz
120 MHz
150 MHz
167 MHz
200 MHz
233 MHz
250 MHz
300 MHz
TEMPERATURE RANGE (DEFAULT: 0°C TO 90°C)
Blank = 0°C to 90°C, commercial temperature
A
= −40°C to 105°C, extended temperature
PACKAGE TYPE†‡
GDP = 272-pin plastic BGA
GFN = 256-pin plastic BGA
GGP = 352-pin plastic BGA
GJC = 352-pin plastic BGA
GJL = 352-pin plastic BGA
GLS = 384-pin plastic BGA
GLW = 340-pin plastic BGA
GNY = 384-pin plastic BGA
GNZ = 352-pin plastic BGA
GLZ = 532-pin plastic BGA
GHK = 288-pin plastic MicroStar BGAt
PYP = 208-pin PowerPADt plastic QFP
ZFN = 256-pin plastic BGA, with Pb-free soldered balls
DEVICE§
C6000 DSPs:
C6201
C6211B DM641 C6712
C6202
C6411
DM642 C6712C
C6202B C6412
C6701
C6712D
C6203B C6414
C6711
C6713
C6204
C6415
C6711B C6713B
C6205
C6416
C6711C
C6211
DM640 C6711D
TECHNOLOGY
C = CMOS
† BGA = Ball Grid Array
QFP = Quad Flatpack
‡ The ZFN mechanical package designator represents the version of the GFN with Pb−Free soldered balls.
§ For actual device part numbers (P/Ns) and ordering information, see the Mechanical Data section of this
document or the TI website (www.ti.com).
Figure 4. TMS320C6000 DSP Device Nomenclature (Including the TMS320C6211
and TMS320C6211B Devices)
MicroStar BGA is a trademark of Texas Instruments.
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documentation support
Extensive documentation supports all TMS320 DSP family generations of devices from product
announcement through applications development. The types of documentation available include: data sheets,
such as this document, with design specifications; complete user’s reference guides for all devices and tools;
technical briefs; development-support tools; on-line help; and hardware and software applications. The
following is a brief, descriptive list of support documentation specific to the C6000 DSP devices:
For device-specific datasheets and related documentation, visit the TI web site at: http://www.ti.com.
The TMS320C6000 CPU and Instruction Set Reference Guide (literature number SPRU189) describes the
C6000 CPU (DSP core) architecture, instruction set, pipeline, and associated interrupts.
The TMS320C6000 DSP Peripherals Overview Reference Guide (literature number SPRU190) provides an
overview and briefly describes the functionality of the peripherals available on the C6000 DSP platform of
devices. This document also includes a table listing the peripherals available on the C6000 devices along with
literature numbers and hyperlinks to the associated peripheral documents.
The TMS320C6000 Technical Brief (literature number SPRU197) gives an introduction to the
TMS320C62x/TMS320C67x devices, associated development tools, and third-party support.
The TMS320C6000 DSP Interrupt Selector Reference Guide (literature number SPRU646) describes the
interrupt selector, interrupt selector registers, and the available interrupts in the TMS320C6000 DSPs.
The TMS320C6000 DSP Enhanced Direct Memory Access (EDMA) Controller Reference Guide (literature
number SPRU234) describes the operation of the enhanced direct memory access (EDMA) controller in the
TMS320C6000 DSPs.
The TMS320C62x/C67x Power Consumption Summary application report (literature number SPRA486)
discusses the power consumption for user applications with the TMS320C6211 and TMS320C6211B DSP
devices.
The TMS320C6211/TMS320C6211B Digital Signal Processors Silicon Errata (literature number SPRZ154)
describes the known exceptions to the functional specifications for the TMS320C6211 and TMS320C6211B
DSP devices.
The Using IBIS Models for Timing Analysis application report (literature number SPRA839) describes how to
properly use IBIS models to attain accurate timing analysis for a given system.
The tools support documentation is electronically available within the Code Composer Studio Integrated
Development Environment (IDE). For a complete listing of C6000 DSP latest documentation, visit the Texas
Instruments web site on the Worldwide Web at http://www.ti.com uniform resource locator (URL).
See the Worldwide Web URL for the application reports How To Begin Development Today with the
TMS320C6211 DSP (literature number SPRA474) and How To Begin Development with the TMS320C6711
DSP (literature number SPRA522), which describe in more detail the similarities/differences between the C6211
and C6711 C6000 DSP devices.
TMS320C67x is a trademark of Texas Instruments.
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clock PLL
All of the internal C62x clocks are generated from a single source through the CLKIN pin. This source clock
either drives the PLL, which multiplies the source clock in frequency to generate the internal CPU clock, or
bypasses the PLL to become the internal CPU clock.
To use the PLL to generate the CPU clock, the external PLL filter circuit must be properly designed. Figure 5
shows the external PLL circuitry for either x1 (PLL bypass) or x4 PLL multiply modes. Figure 6 shows the
external PLL circuitry for a system with ONLY x1 (PLL bypass) mode.
To minimize the clock jitter, a single clean power supply should power both the C62x device and the external
clock oscillator circuit. Noise coupling into PLLF will directly impact PLL clock jitter. The minimum CLKIN rise
and fall times should also be observed. For the input clock timing requirements, see the input and output clocks
electricals section.
Rise/fall times, duty cycles (high/low pulse durations), and the load capacitance of the external clock source
must meet the DSP requirements in this data sheet (see the electrical characteristics over recommended
ranges of suppy voltage and operating case temperature table and the input and output clocks electricals
section). Table 17 lists some examples of compatible CLKIN external clock sources.
Table 17. Compatible CLKIN External Clock Sources
COMPATIBLE PARTS FOR
EXTERNAL CLOCK SOURCES (CLKIN)
PART NUMBER
MANUFACTURER
JITO-2
Fox Electronix
STA series, ST4100 series
SaRonix Corporation
Oscillators
PLL
SG-636
Epson America
342
Corning Frequency Control
MK1711-S, ICS525-02
Integrated Circuit Systems
3.3V
EMI Filter
PLLV
Internal to
C6211/C6211B
PLL
CLKMODE0
C3
10 mF
PLLMULT
C4
0.1 mF
PLLCLK
CLKIN
CLKIN
1
LOOP FILTER
0
CPU
CLOCK
PLL Multiply
Factors
CPU Clock
Frequency
f(CPUCLOCK)
0
x1(BYPASS)
1 x f(CLKIN)
1
x4
4 x f(CLKIN)
C2
PLLG
CLKMODE0
PLLF
Available Multiply Factors
(For C1, C2, and R1 values, see Table 18.)
C1
R1
NOTES: A. Keep the lead length and the number of vias between the PLLF pin, the PLLG pin, and R1, C1, and C2 to a minimum. In addition,
place all PLL external components (R1, C1, C2, C3, C4, and the EMI Filter) as close to the C6000 device as possible. For the best
performance, TI recommends that all the PLL external components be on a single side of the board without jumpers, switches, or
components other than the ones shown.
B. For reduced PLL jitter, maximize the spacing between switching signals and the PLL external components (R1, C1, C2, C3, C4,
and the EMI filter).
C. The 3.3-V supply for the EMI filter must be from the same 3.3-V power plane supplying the I/O voltage, DVDD.
D. EMI filter manufacturer: TDK part number ACF451832-333, 223, 153, 103. Panasonic part number EXCCET103U.
Figure 5. External PLL Circuitry for Either PLL x4 Mode or x1 (Bypass) Mode
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clock PLL (continued)
3.3V
PLLV
Internal to
C6211/C6211B
PLL
CLKMODE0
PLLMULT
PLLCLK
CLKIN
CLKIN
LOOP FILTER
1
CPU
CLOCK
PLLG
PLLF
0
NOTES: A. For a system with ONLY PLL x1 (bypass) mode, short the PLLF terminal to the PLLG terminal.
B. The 3.3-V supply for the EMI filter must be from the same 3.3-V power plane supplying the I/O voltage, DVDD.
Figure 6. External PLL Circuitry for x1 (Bypass) Mode Only
Table 18. C6211/C6211B PLL Component Selection
CLKMODE
CLKIN
RANGE
(MHz)
CPU CLOCK
FREQUENCY
(CLKOUT1)
RANGE (MHz)
CLKOUT2
RANGE
(MHz)
R1 [±1%]
(Ω)
C1 [±10%]
(nF)
C2 [±10%]
(pF)
TYPICAL
LOCK TIME
(µs)†
x4
16.3−41.6
65−167
32.5−83
60.4
27
560
75
† Under some operating conditions, the maximum PLL lock time may vary as much as 150% from the specified typical value. For example, if the
typical lock time is specified as 100 µs, the maximum value may be as long as 250 µs.
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power-down mode logic
Figure 7 shows the power-down mode logic on the C6211/C6211B.
CLKOUT1
CLKOUT2
Internal Clock Tree
Clock
Distribution
and Dividers
PD1
PD2
PowerDown
Logic
Clock
PLL
IFR
Internal
Peripherals
IER
PWRD CSR
CPU
PD3
TMS320C6211/C6211B
CLKIN
RESET
† External input clocks, with the exception of CLKIN, are not gated by the power-down mode logic.
Figure 7. Power-Down Mode Logic†
triggering, wake-up, and effects
The power-down modes and their wake-up methods are programmed by setting the PWRD field (bits 15−10)
of the control status register (CSR). The PWRD field of the CSR is shown in Figure 8 and described in Table 19.
When writing to the CSR, all bits of the PWRD field should be set at the same time. Logic 0 should be used when
“writing” to the reserved bit (bit 15) of the PWRD field. The CSR is discussed in detail in the TMS320C6000 CPU
and Instruction Set Reference Guide (literature number SPRU189).
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31
16
15
14
13
12
11
10
Reserved
Enable or
Non-Enabled
Interrupt Wake
Enabled
Interrupt Wake
PD3
PD2
PD1
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
7
9
8
0
Legend: R/W−x = Read/write reset value
NOTE: The shadowed bits are not part of the power-down logic discussion and therefore are not covered here. For information on these other
bit fields in the CSR register, see the TMS320C6000 CPU and Instruction Set Reference Guide (literature number SPRU189).
Figure 8. PWRD Field of the CSR Register
A delay of up to nine clock cycles may occur after the instruction that sets the PWRD bits in the CSR before the
PD mode takes effect. As best practice, NOPs should be padded after the PWRD bits are set in the CSR to account
for this delay.
If PD1 mode is terminated by a non-enabled interrupt, the program execution returns to the instruction where
PD1 took effect. If PD1 mode is terminated by an enabled interrupt, the interrupt service routine with be executed
first, then the program execution returns to the instruction where PD1 took effect. In the case with an enabled
interrupt, the GIE bit in the CSR and the NMIE bit in the interrupt enable register (IER) must also be set in order
for the interrupt service routine to execute; otherwise, execution returns to the instruction where PD1 took effect
upon PD1 mode termination by an enabled interrupt.
PD2 and PD3 modes can only be aborted by device reset. Table 19 summarizes all the power-down modes.
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Table 19. Characteristics of the Power-Down Modes
PRWD FIELD
(BITS 15−10)
POWER-DOWN
MODE
WAKE-UP METHOD
000000
No power-down
—
—
001001
PD1
Wake by an enabled interrupt
010001
PD1
Wake by an enabled or
non-enabled interrupt
011010
011100
PD2†
PD3†
EFFECT ON CHIP’S OPERATION
CPU halted (except for the interrupt logic)
Power-down mode blocks the internal clock inputs at the
boundary of the CPU, preventing most of the CPU’s logic from
switching. During PD1, EDMA transactions can proceed
between peripherals and internal memory.
Wake by a device reset
Output clock from PLL is halted, stopping the internal clock
structure from switching and resulting in the entire chip being
halted. All register and internal RAM contents are preserved. All
functional I/O “freeze” in the last state when the PLL clock is
turned off.
Wake by a device reset
Input clock to the PLL stops generating clocks. All register and
internal RAM contents are preserved. All functional I/O “freeze” in
the last state when the PLL clock is turned off. Following reset, the
PLL needs time to re-lock, just as it does following power-up.
Wake-up from PD3 takes longer than wake-up from PD2 because
the PLL needs to be re-locked, just as it does following power-up.
All others
Reserved
—
—
† When entering PD2 and PD3, all functional I/O remains in the previous state. However, for peripherals which are asynchronous in nature or
peripherals with an external clock source, output signals may transition in response to stimulus on the inputs. Under these conditions,
peripherals will not operate according to specifications.
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power-supply sequencing
TI DSPs do not require specific power sequencing between the core supply and the I/O supply. However,
systems should be designed to ensure that neither supply is powered up for extended periods of time if the other
supply is below the proper operating voltage.
system-level design considerations
System-level design considerations, such as bus contention, may require supply sequencing to be
implemented. In this case, the core supply should be powered up at the same time as, or prior to (and powered
down after), the I/O buffers. This is to ensure that the I/O buffers receive valid inputs from the core before the
output buffers are powered up, thus, preventing bus contention with other chips on the board.
power-supply design considerations
For systems using the C6000 DSP platform of devices, the core supply may be required to provide in excess
of 2 A per DSP until the I/O supply is powered up. This extra current condition is a result of uninitialized logic
within the DSP(s) and is corrected once the CPU sees an internal clock pulse. With the PLL enabled, as the
I/O supply is powered on, a clock pulse is produced stopping the extra current draw from the supply. With the
PLL disabled, as many as five external clock cycle pulses may be required to stop this extra current draw. A
normal current state returns once the I/O power supply is turned on and the CPU sees a clock pulse. Decreasing
the amount of time between the core supply power up and the I/O supply power up can minimize the effects
of this current draw.
A dual-power supply with simultaneous sequencing, such as available with TPS563xx controllers or PT69xx
plug-in power modules, can be used to eliminate the delay between core and I/O power up [see the Using the
TPS56300 to Power DSPs application report (literature number SLVA088)]. A Schottky diode can also be used
to tie the core rail to the I/O rail, effectively pulling up the I/O power supply to a level that can help initialize the
logic within the DSP.
Core and I/O supply voltage regulators should be located close to the DSP (or DSP array) to minimize
inductance and resistance in the power delivery path. Additionally, when designing for high-performance
applications utilizing the C6000 platform of DSPs, the PC board should include separate power planes for
core, I/O, and ground, all bypassed with high-quality low-ESL/ESR capacitors.
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IEEE 1149.1 JTAG compatibility statement
The TMS320C6211/C6211B DSP requires that both TRST and RESET resets be asserted upon power up to
be properly initialized. While RESET initializes the DSP core, TRST initializes the DSP’s emulation logic. Both
resets are required for proper operation.
While both TRST and RESET need to be asserted upon power up, only RESET needs to be released for the
DSP to boot properly. TRST may be asserted indefinitely for normal operation, keeping the JTAG port interface
and DSP’s emulation logic in the reset state.
TRST only needs to be released when it is necessary to use a JTAG controller to debug the DSP or exercise
the DSP’s boundary scan functionality.
For maximum reliability, the TMS320C6211/C6211B DSP includes an internal pulldown (IPD) on the TRST pin
to ensure that TRST will always be asserted upon power up and the DSP’s internal emulation logic will always
be properly initialized.
JTAG controllers from Texas Instruments actively drive TRST high. However, some third-party JTAG controllers
may not drive TRST high but expect the use of an external pullup resistor on TRST.
When using this type of JTAG controller, assert TRST to initialize the DSP after powerup and externally drive
TRST high before attempting any emulation or boundary scan operations. Following the release of RESET, the
low-to-high transition of TRST must be “seen” to latch the state of EMU1 and EMU0. The EMU[1:0] pins
configure the device for either Boundary Scan mode or Emulation mode. For more detailed information, see
the terminal functions section of this data sheet.
EMIF device speed
TI recommends utilizing the input/output buffer information specification (IBIS) models to analyze all AC timings.
To properly use IBIS models to attain accurate timing analysis for a given system, see the Using IBIS Models
for Timing Analysis application report (literature number SPRA839).
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bootmode
The C62x device resets using the active-low signal RESET signal (for the C6211/C6211B device, the RESET
signal is the same as the internal reset signal). While RESET is low, the internal reset is also asserted and the
device is held in reset and is initialized to the prescribed reset state. Refer to reset timing for reset timing
characteristics and states of device pins during reset. The release of the internal reset signal (see the Reset
Phase 3 discussion in the Reset Timing section of this data sheet) starts the processor running with the
prescribed device configuration and boot mode.
The C6211/C6211B has three types of boot modes:
D Host boot
If host boot is selected, upon release of internal reset, the CPU is internally “stalled” while the remainder of
the device is released. During this period, an external host can initialize the CPU’s memory space as
necessary through the host interface, including internal configuration registers, such as those that control
the EMIF or other peripherals. Once the host is finished with all necessary initialization, it must set the
DSPINT bit in the HPIC register to complete the boot process. This transition causes the boot configuration
logic to bring the CPU out of the “stalled” state. The CPU then begins execution from address 0. The DSPINT
condition is not latched by the CPU, because it occurs while the CPU is still internally “stalled”. Also, DSPINT
brings the CPU out of the “stalled” state only if the host boot process is selected. All memory may be written
to and read by the host. This allows for the host to verify what it sends to the DSP if required. After the CPU is
out of the “stalled” state, the CPU needs to clear the DSPINT, otherwise, no more DSPINTs can be received.
D Emulation boot
Emulation boot mode is a variation of host boot. In this mode, it is not necessary for a host to load code or to
set DSPINT to release the CPU from the “stalled” state. Instead, the emulator will set DSPINT if it has not
been previously set so that the CPU can begin executing code from address 0. Prior to beginning execution,
the emulator sets a breakpoint at address 0. This prevents the execution of invalid code by halting the CPU
prior to executing the first instruction. Emulation boot is a good tool in the debug phase of development.
D EMIF boot (using default ROM timings)
Upon the release of internal reset, the 1K-Byte ROM code located in the beginning of CE1 is copied to
address 0 by the EDMA using the default ROM timings, while the CPU is internally “stalled”. The data should
be stored in the endian format that the system is using. The boot process also lets you choose the width of
the ROM. In this case, the EMIF automatically assembles consecutive 8-bit bytes or 16-bit half-words to
form the 32-bit instruction words to be copied. The transfer is automatically done by the EDMA as a
single-frame block transfer from the ROM to address 0. After completion of the block transfer, the CPU is
released from the “stalled” state and start running from address 0.
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absolute maximum ratings over operating case temperature range (unless otherwise noted)†
Supply voltage range, CVDD (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 0.3 V to 2.3 V
Supply voltage range, DVDD (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 4 V
Input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 4 V
Output voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 4 V
Operating case temperature ranges, TC:(default) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0_C to 90_C
(A version) [C6211BGFNA only] . . . . . . . . . . . . . . −40_C to105_C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65_C to 150_C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: All voltage values are with respect to VSS.
recommended operating conditions
MIN
NOM
MAX
UNIT
CVDD
Supply voltage, Core
1.71
1.8
1.89
V
DVDD
Supply voltage, I/O
3.14
3.3
3.46
V
VSS
VIH
Supply ground
0
0
0
V
High-level input voltage
2
VIL
Low-level input voltage
IOH
High-level output current
IOL
Low-level output current
0.8
V
All signals except CLKOUT1, CLKOUT2, and ECLKOUT
−4
mA
CLKOUT1, CLKOUT2, and ECLKOUT
−8
mA
All signals except CLKOUT1, CLKOUT2, and ECLKOUT
4
mA
CLKOUT1, CLKOUT2, and ECLKOUT
8
mA
0
90
_C
−40
105
_C
Default
TC
Operating case temperature
V
A version (C6211BGFNA only)
electrical characteristics over recommended ranges of supply voltage and operating case
temperature (unless otherwise noted)
TEST CONDITIONS‡
PARAMETER
VOH
VOL
High-level output voltage
II
IOZ
Input current
IDD2V
IDD2V
DVDD = MIN,
DVDD = MIN,
Low-level output voltage
IOH = MAX
IOL = MAX
MIN
TYP
MAX
2.4
UNIT
V
0.4
V
±150
uA
±10
uA
Off-state output current
VI = VSS to DVDD
VO = DVDD or 0 V
Supply current, CPU + CPU memory
access§
C6211, CVDD = NOM, CPU clock = 150 MHz
C6211B, CVDD = NOM, CPU clock = 150 MHz
270
mA
270
mA
C6211, CVDD = NOM, CPU clock = 150 MHz
220
mA
C6211B, CVDD = NOM, CPU clock = 150 MHz
Supply current, peripherals§
IDD3V
Supply current, I/O pins§
Ci
Input capacitance
220
mA
C6211, DVDD = NOM, CPU clock = 150 MHz
60
mA
C6211B, DVDD = NOM, CPU clock = 150 MHz
60
mA
7
pF
Co
Output capacitance
7
pF
‡ For test conditions shown as MIN, MAX, or NOM, use the appropriate value specified in the recommended operating conditions table.
§ Measured with average activity (50% high/50% low power). For more details on CPU, peripheral, and I/O activity, refer to the TMS320C62x/C67x
Power Consumption Summary application report (literature number SPRA486).
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PARAMETER MEASUREMENT INFORMATION
IOL
Tester Pin
Electronics
50 Ω
Vcomm
Output
Under
Test
CT
IOH
Where:
IOL
IOH
Vcomm
CT
=
=
=
=
2 mA
2 mA
0.8 V
10−15-pF typical load-circuit capacitance
Figure 9. Test Load Circuit for AC Timing Measurements
signal transition levels
All input and output timing parameters are referenced to 1.5 V for both “0” and “1” logic levels.
Vref = 1.5 V
Figure 10. Input and Output Voltage Reference Levels for ac Timing Measurements
All rise and fall transition timing parameters are referenced to VIL MAX and VIH MIN for input clocks, and
VOL MAX and VOH MIN for output clocks.
Vref = VIH MIN (or VOH MIN)
Vref = VIL MAX (or VOL MAX)
Figure 11. Rise and Fall Transition Time Voltage Reference Levels
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PARAMETER MEASUREMENT INFORMATION (CONTINUED)
timing parameters and board routing analysis
The timing parameter values specified in this data sheet do not include delays by board routings. As a good
board design practice, such delays must always be taken into account. Timing values may be adjusted by
increasing/decreasing such delays. TI recommends utilizing the available I/O buffer information specification
(IBIS) models to analyze the timing characteristics correctly. If needed, external logic hardware such as buffers
may be used to compensate any timing differences. For example:
D In typical boards with the C6211B commercial temperature device, the routing delay improves the external
memory’s ability to meet the DSP’s EMIF data input hold time requirement [th(EKOH-EDV)].
D In some boards with the C6211BGFNA extended temperature device, the routing delay improves the
external memory’s ability to meet the DSP’s EMIF data input hold time requirement [th(EKOH-EDV)]. In
addition, it may be necessary to add an extra delay to the input clock of the external memory to robustly
meet the DSP’s data input hold time requirement. If the extra delay approach is used, memory bus
frequency adjustments may be needed to ensure the DPS’s input setup time requirement [tsu(EDV-EKOH)]
is still maintained.
For inputs, timing is most impacted by the round-trip propagation delay from the DSP to the external device and
from the external device to the DSP. This round-trip delay tends to negatively impact the input setup time margin,
but also tends to improve the input hold time margins (see Table 20 and Figure 12).
Figure 12 represents a general transfer between the DSP and an external device. The figure also represents
board route delays and how they are perceived by the DSP and the external device.
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PARAMETER MEASUREMENT INFORMATION (CONTINUED)
Table 20. IBIS Timing Parameters Example (see Figure 12)
NO.
DESCRIPTION
1
Clock route delay
2
Minimum DSP hold time
3
Minimum DSP setup time
4
External device hold time requirement
5
External device setup time requirement
6
Control signal route delay
7
External device hold time
8
External device access time
9
DSP hold time requirement
10
DSP setup time requirement
11
Data route delay
ECLKOUT
(Output from DSP)
1
ECLKOUT
(Input to External Device)
Control Signals†
(Output from DSP)
2
3
4
5
Control Signals
(Input to External Device)
6
7
Data Signals‡
(Output from External Device)
8
10
9
11
Data Signals‡
(Input to DSP)
† Control signals include data for Writes.
‡ Data signals are generated during Reads from an external device.
Figure 12. IBIS Input/Output Timings
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INPUT AND OUTPUT CLOCKS
timing requirements for CLKIN†‡ (see Figure 13)
−150
CLKMODE = x4
NO.
MIN
1
2
3
−167
CLKMODE = x1
MAX
MIN
CLKMODE = x4
MAX
MIN
CLKMODE = x1
MAX
MIN
tc(CLKIN)
tw(CLKINH)
Cycle time, CLKIN
26.7
6.7
24
6
ns
Pulse duration, CLKIN high
0.4C
0.45C
0.4C
0.45C
ns
tw(CLKINL)
tt(CLKIN)
Pulse duration, CLKIN low
0.4C
0.45C
0.4C
0.45C
ns
4
Transition time, CLKIN
5
1
† The reference points for the rise and fall transitions are measured at VIL MAX and VIH MIN.
‡ C = CLKIN cycle time in ns. For example, when CLKIN frequency is 40 MHz, use C = 25 ns.
1
5
1
4
2
CLKIN
3
4
Figure 13. CLKIN Timings
46
UNIT
MAX
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INPUT AND OUTPUT CLOCKS (CONTINUED)
switching characteristics over recommended operating conditions for CLKOUT1†‡§
(see Figure 14)
−150
−167
NO.
PARAMETER
CLKMODE = x4
MIN
1
2
3
4
tc(CKO1)
tw(CKO1H)
Cycle time, CLKOUT1
tw(CKO1L)
tt(CKO1)
UNIT
CLKMODE = x1
MAX
MIN
MAX
P − 0.7
P + 0.7
P − 0.7
P + 0.7
ns
Pulse duration, CLKOUT1 high
(P/2) − 0.7
(P/2 ) + 0.7
PH − 0.7
PH + 0.7
ns
Pulse duration, CLKOUT1 low
(P/2) − 0.7
(P/2 ) + 0.7
PL − 0.7
PL + 0.7
ns
2
ns
Transition time, CLKOUT1
2
† The reference points for the rise and fall transitions are measured at VOL MAX and VOH MIN.
‡ P = 1/CPU clock frequency in nanoseconds (ns)
§ PH is the high period of CLKIN in ns and PL is the low period of CLKIN in ns.
1
4
2
CLKOUT1
3
4
Figure 14. CLKOUT1 Timings
switching characteristics over recommended operating conditions for CLKOUT2†‡ (see Figure 15)
NO.
1
2
3
−150
−167
PARAMETER
UNIT
MIN
MAX
2P − 0.7
2P + 0.7
ns
tc(CKO2)
tw(CKO2H)
Cycle time, CLKOUT2
Pulse duration, CLKOUT2 high
P − 0.7
P + 0.7
ns
tw(CKO2L)
tt(CKO2)
Pulse duration, CLKOUT2 low
P − 0.7
P + 0.7
ns
2
ns
4
Transition time, CLKOUT2
† The reference points for the rise and fall transitions are measured at VOL MAX and VOH MIN.
‡ P = 1/CPU clock frequency in ns
1
4
2
CLKOUT2
3
4
Figure 15. CLKOUT2 Timings
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INPUT AND OUTPUT CLOCKS (CONTINUED)
timing requirements for ECLKIN† (see Figure 16)
−150
−167
NO.
MIN
1
2
3
4
UNIT
MAX
tc(EKI)
tw(EKIH)
Cycle time, ECLKIN
10
ns
Pulse duration, ECLKIN high
4.5
ns
tw(EKIL)
tt(EKI)
Pulse duration, ECLKIN low
4.5
ns
Transition time, ECLKIN
2.2
ns
† The reference points for the rise and fall transitions are measured at VIL MAX and VIH MIN.
1
4
2
ECLKIN
3
4
Figure 16. ECLKIN Timings
switching characteristics over recommended operating conditions for ECLKOUTद
(see Figure 17)
NO.
1
2
3
4
5
6
−150
−167
PARAMETER
MAX
E − 0.7
E + 0.7
ns
tc(EKO)
tw(EKOH)
Cycle time, ECLKOUT
Pulse duration, ECLKOUT high
EH − 0.7
EH + 0.7
ns
tw(EKOL)
tt(EKO)
Pulse duration, ECLKOUT low
EL − 0.7
EL + 0.7
ns
2
ns
td(EKIH-EKOH)
td(EKIL-EKOL)
Delay time, ECLKIN high to ECLKOUT high
1
7
ns
Delay time, ECLKIN low to ECLKOUT low
1
7
ns
Transition time, ECLKOUT
‡ The reference points for the rise and fall transitions are measured at VOL MAX and VOH MIN.
§ E = ECLKIN period in ns
¶ EH is the high period of ECLKIN in ns and EL is the low period of ECLKIN in ns.
ECLKIN
6
1
2
5
3
ECLKOUT
Figure 17. ECLKOUT Timings
48
UNIT
MIN
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ASYNCHRONOUS MEMORY TIMING
timing requirements for asynchronous memory cycles†‡§ (see Figure 18−Figure 19)
NO.
MIN
3
4
6
7
C6211B−150
C6211B−167
C6211BGFNA−150
C6211−150
C6211−167
MAX
MIN
UNIT
MAX
tsu(EDV-AREH)
th(AREH-EDV)
Setup time, EDx valid before ARE high
9
9
ns
Hold time, EDx valid after ARE high
1
2
ns
tsu(ARDY-EKOH)
th(EKOH-ARDY)
Setup time, ARDY valid before ECLKOUT high
3
3
ns
Hold time, ARDY valid after ECLKOUT high
1
2
ns
† To ensure data setup time, simply program the strobe width wide enough. ARDY is internally synchronized. The ARDY signal is recognized in
the cycle for which the setup and hold time is met. To use ARDY as an asynchronous input, the pulse width of the ARDY signal should be wide
enough (e.g., pulse width = 2E) to ensure setup and hold time is met.
‡ RS = Read setup, RST = Read strobe, RH = Read hold, WS = Write setup, WST = Write strobe, WH = Write hold. These parameters are
programmed via the EMIF CE space control registers.
§ E = ECLKOUT period in ns
switching characteristics over recommended operating conditions for asynchronous memory
cycles for C6211 and C6211B‡§¶ (see Figure 18−Figure 19)
NO.
1
2
5
8
9
PARAMETER
C6211−150
C6211−167
C6211B−150
C6211B−167
MIN
MIN
MAX
tosu(SELV-AREL)
toh(AREH-SELIV)
Output setup time, select signals valid to ARE low
RS * E − 3
RS * E − 3
Output hold time, ARE high to select signals invalid
RH * E − 3
RH * E − 3
td(EKOH-AREV)
tosu(SELV-AWEL)
Delay time, ECLKOUT high to ARE vaild
toh(AWEH-SELIV)
td(EKOH-AWEV)
Output hold time, AWE high to select signals invalid
Output setup time, select signals valid to AWE low
1.5
WS * E − 3
WH * E − 3
8
1.5
UNIT
MAX
ns
ns
8
WS * E − 3
ns
ns
WH * E − 3
ns
10
Delay time, ECLKOUT high to AWE vaild
1.5
8
1.2
8
ns
‡ RS = Read setup, RST = Read strobe, RH = Read hold, WS = Write setup, WST = Write strobe, WH = Write hold. These parameters are
programmed via the EMIF CE space control registers.
§ E = ECLKOUT period in ns
¶ Select signals include: CEx, BE[3:0], EA[21:2], AOE; and for writes, include ED[31:0].
switching characteristics over recommended operating conditions for asynchronous memory
cycles for C6211BGFNA‡§¶ (see Figure 18−Figure 19)
C6211BGFNA−150
NO.
1
2
5
8
9
10
PARAMETER
MIN
MAX
UNIT
tosu(SELV-AREL)
toh(AREH-SELIV)
Output setup time, select signals valid to ARE low
RS * E − 3
ns
Output hold time, ARE high to select signals invalid
RH * E − 3
ns
td(EKOH-AREV)
tosu(SELV-AWEL)
Delay time, ECLKOUT high to ARE vaild
toh(AWEH-SELIV)
td(EKOH-AWEV)
Output hold time, AWE high to select signals invalid
Output setup time, select signals valid to AWE low
Delay time, ECLKOUT high to AWE vaild
1.5
8
WS * E − 3
ns
WH * E − 3
ns
ns
‡ RS = Read setup, RST = Read strobe, RH = Read hold, WS = Write setup, WST = Write strobe, WH = Write hold. These parameters are
programmed via the EMIF CE space control registers.
§ E = ECLKOUT period in ns
¶ Select signals include: CEx, BE[3:0], EA[21:2], AOE; and for writes, include ED[31:0].
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1
ns
8
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ASYNCHRONOUS MEMORY TIMING (CONTINUED)
Setup = 2
Strobe = 3
Not Ready
Hold = 2
ECLKOUT
1
2
CEx
1
2
BE[3:0]
BE
1
2
EA[21:2]
Address
3
4
ED[31:0]
1
2
Read Data
AOE/SDRAS/SSOE†
5
5
ARE/SDCAS/SSADS†
AWE/SDWE/SSWE†
7
6
7
6
ARDY
† AOE/SDRAS/SSOE, ARE/SDCAS/SSADS, and AWE/SDWE/SSWE operate as AOE (identified under select signals), ARE, and AWE,
respectively, during asynchronous memory accesses.
Figure 18. Asynchronous Memory Read Timing
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ASYNCHRONOUS MEMORY TIMING (CONTINUED)
Setup = 2
Strobe = 3
Hold = 2
Not Ready
ECLKOUT
8
9
CEx
8
9
BE[3:0]
BE
8
9
EA[21:2]
Address
8
9
ED[31:0]
Write Data
AOE/SDRAS/SSOE†
ARE/SDCAS/SSADS†
10
10
AWE/SDWE/SSWE†
7
6
7
6
ARDY
† AOE/SDRAS/SSOE, ARE/SDCAS/SSADS, and AWE/SDWE/SSWE operate as AOE (identified under select signals), ARE, and AWE,
respectively, during asynchronous memory accesses.
Figure 19. Asynchronous Memory Write Timing
POST OFFICE BOX 1443
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51
SPRS073L − AUGUST 1998 − REVISED JUNE 2005
SYNCHRONOUS-BURST MEMORY TIMING
timing requirements for synchronous-burst SRAM cycles† (see Figure 20)
C6211−150
C6211−167
NO.
MIN
6
tsu(EDV-EKOH)
Setup time, read EDx valid before
ECLKOUT high
7
th(EKOH-EDV)
Hold time, read EDx valid after
ECLKOUT high
C6211BGFNA−150
MAX
MIN
MAX
C6211B−150
C6211B−167
MIN
UNIT
MAX
2.5
2.5
2.5
ns
1
2.5
2
ns
† The C6211/C6211B SBSRAM interface takes advantage of the internal burst counter in the SBSRAM. Accesses default to incrementing 4-word
bursts, but random bursts and decrementing bursts are done by interrupting bursts in progress. All burst types can sustain continuous data flow.
switching characteristics over recommended operating conditions for synchronous-burst SRAM
cycles†‡ (see Figure 20 and Figure 21)
NO.
C6211−150
C6211−167
PARAMETER
C6211BGFNA−150
C6211B−150
C6211B−167
UNIT
MIN
MAX
MIN
MAX
MIN
MAX
1.5
6.5
1
6.5
1.2
6.5
ns
6.5
ns
1
td(EKOH-CEV)
Delay time, ECLKOUT high to CEx
valid
2
td(EKOH-BEV)
Delay time, ECLKOUT high to BEx
valid
3
td(EKOH-BEIV)
Delay time, ECLKOUT high to BEx
invalid
4
td(EKOH-EAV)
Delay time, ECLKOUT high to EAx
valid
5
td(EKOH-EAIV)
Delay time, ECLKOUT high to EAx
invalid
1.5
8
td(EKOH-ADSV)
Delay time, ECLKOUT high to
ARE/SDCAS/SSADS valid
1.5
6.5
1
6.5
1.2
6.5
ns
9
td(EKOH-OEV)
Delay time, ECLKOUT high to
AOE/SDRAS/SSOE valid
1.5
6.5
1
6.5
1.2
6.5
ns
10
td(EKOH-EDV)
Delay time, ECLKOUT high to EDx
valid
7
ns
11
td(EKOH-EDIV)
Delay time, ECLKOUT high to EDx
invalid
1.5
12
td(EKOH-WEV)
Delay time, ECLKOUT high to
AWE/SDWE/SSWE valid
1.5
6.5
1.5
6.5
1
6.5
1.2
6.5
1
7
6.5
1.2
7
1
6.5
1
ns
ns
1.2
6.5
1.2
ns
ns
6.5
ns
† The C6211/C6211B SBSRAM interface takes advantage of the internal burst counter in the SBSRAM. Accesses default to incrementing 4-word
bursts, but random bursts and decrementing bursts are done by interrupting bursts in progress. All burst types can sustain continuous data flow.
‡ ARE/SDCAS/SSADS, AOE/SDRAS/SSOE, and AWE/SDWE/SSWE operate as SSADS, SSOE, and SSWE, respectively, during SBSRAM
accesses.
52
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SPRS073L − AUGUST 1998 − REVISED JUNE 2005
SYNCHRONOUS-BURST MEMORY TIMING (CONTINUED)
ECLKOUT
1
1
CEx
BE[3:0]
2
BE1
3
BE2
BE3
4
BE4
5
EA[21:2]
EA
6
ED[31:0]
7
Q1
Q2
Q3
Q4
8
8
ARE/SDCAS/SSADS†
9
9
AOE/SDRAS/SSOE†
AWE/SDWE/SSWE†
† ARE/SDCAS/SSADS, AOE/SDRAS/SSOE, and AWE/SDWE/SSWE operate as SSADS, SSOE, and SSWE, respectively, during SBSRAM
accesses.
Figure 20. SBSRAM Read Timing
ECLKOUT
1
1
CEx
BE[3:0]
2
BE1
3
BE2
BE3
5
4
EA[21:2]
ED[31:0]
BE4
EA
10
Q1
8
11
Q2
Q3
Q4
8
ARE/SDCAS/SSADS†
AOE/SDRAS/SSOE†
12
12
AWE/SDWE/SSWE†
† ARE/SDCAS/SSADS, AOE/SDRAS/SSOE, and AWE/SDWE/SSWE operate as SSADS, SSOE, and SSWE, respectively, during SBSRAM
accesses.
Figure 21. SBSRAM Write Timing
POST OFFICE BOX 1443
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53
SPRS073L − AUGUST 1998 − REVISED JUNE 2005
SYNCHRONOUS DRAM TIMING
timing requirements for synchronous DRAM cycles† (see Figure 22)
C6211−150
C6211−167
NO.
MIN
6
tsu(EDV-EKOH)
Setup time, read EDx valid before
ECLKOUT high
7
th(EKOH-EDV)
Hold time, read EDx valid after
ECLKOUT high
C6211BGFNA−150
MAX
MIN
MAX
C6211B−150
C6211B−167
MIN
UNIT
MAX
2.5
2.5
2.5
ns
1
2.5
2
ns
† The C6211/C6211B SDRAM interface takes advantage of the internal burst counter in the SDRAM. Accesses default to incrementing 4-word
bursts, but random bursts and decrementing bursts are done by interrupting bursts in progress. All burst types can sustain continuous data flow.
switching characteristics over recommended operating conditions for synchronous DRAM
cycles†‡ (see Figure 22−Figure 28)
NO.
C6211−150
C6211−167
PARAMETER
C6211BGFNA−150
C6211B−150
C6211B−167
UNIT
MIN
MAX
MIN
MAX
MIN
MAX
1.5
6.5
1
6.5
1.2
6.5
ns
6.5
ns
1
td(EKOH-CEV)
Delay time, ECLKOUT high to CEx
valid
2
td(EKOH-BEV)
Delay time, ECLKOUT high to BEx
valid
3
td(EKOH-BEIV)
Delay time, ECLKOUT high to BEx
invalid
4
td(EKOH-EAV)
Delay time, ECLKOUT high to EAx
valid
5
td(EKOH-EAIV)
Delay time, ECLKOUT high to EAx
invalid
1.5
8
td(EKOH-CASV)
Delay time, ECLKOUT high to
ARE/SDCAS/SSADS valid
1.5
9
td(EKOH-EDV)
Delay time, ECLKOUT high to EDx
valid
10
td(EKOH-EDIV)
Delay time, ECLKOUT high to EDx
invalid
1.5
11
td(EKOH-WEV)
Delay time, ECLKOUT high to
AWE/SDWE/SSWE valid
1.5
6.5
1
6.5
1.2
6.5
ns
12
td(EKOH-RAS)
Delay time, ECLKOUT high to
AOE/SDRAS/SSOE valid
1.5
6.5
1
6.5
1.2
6.5
ns
6.5
1.5
6.5
1
6.5
1.2
6.5
1
6.5
1
7
ns
6.5
1.2
6.5
1.2
7
1
ns
ns
6.5
ns
7
ns
1.2
ns
† The C6211/C6211B SDRAM interface takes advantage of the internal burst counter in the SDRAM. Accesses default to incrementing 4-word
bursts, but random bursts and decrementing bursts are done by interrupting bursts in progress. All burst types can sustain continuous data flow.
‡ ARE/SDCAS/SSADS, AWE/SDWE/SSWE, and AOE/SDRAS/SSOE operate as SDCAS, SDWE, and SDRAS, respectively, during SDRAM
accesses.
54
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SPRS073L − AUGUST 1998 − REVISED JUNE 2005
SYNCHRONOUS DRAM TIMING (CONTINUED)
READ
ECLKOUT
1
1
CEx
2
BE1
BE[3:0]
EA[21:13]
EA[11:2]
4
Bank
5
4
Column
5
4
3
BE2
BE3
BE4
5
EA12
6
D1
ED[31:0]
7
D2
D3
D4
AOE/SDRAS/SSOE†
8
8
ARE/SDCAS/SSADS†
AWE/SDWE/SSWE†
† ARE/SDCAS/SSADS, AWE/SDWE/SSWE, and AOE/SDRAS/SSOE operate as SDCAS, SDWE, and SDRAS, respectively, during SDRAM
accesses.
Figure 22. SDRAM Read Command (CAS Latency 3)
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
55
SPRS073L − AUGUST 1998 − REVISED JUNE 2005
SYNCHRONOUS DRAM TIMING (CONTINUED)
WRITE
ECLKOUT
1
2
CEx
2
3
4
BE[3:0]
BE1
4
BE2
BE3
BE4
D2
D3
D4
5
Bank
EA[21:13]
5
4
Column
EA[11:2]
4
5
EA12
9
10
9
ED[31:0]
D1
AOE/SDRAS/SSOE†
8
8
11
11
ARE/SDCAS/SSADS†
AWE/SDWE/SSWE†
† ARE/SDCAS/SSADS, AWE/SDWE/SSWE, and AOE/SDRAS/SSOE operate as SDCAS, SDWE, and SDRAS, respectively, during SDRAM
accesses.
Figure 23. SDRAM Write Command
56
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SPRS073L − AUGUST 1998 − REVISED JUNE 2005
SYNCHRONOUS DRAM TIMING (CONTINUED)
ACTV
ECLKOUT
1
1
CEx
BE[3:0]
4
Bank Activate
5
EA[21:13]
4
Row Address
5
EA[11:2]
4
Row Address
5
EA12
ED[31:0]
12
12
AOE/SDRAS/SSOE†
ARE/SDCAS/SSADS†
AWE/SDWE/SSWE†
† ARE/SDCAS/SSADS, AWE/SDWE/SSWE, and AOE/SDRAS/SSOE operate as SDCAS, SDWE, and SDRAS, respectively, during SDRAM
accesses.
Figure 24. SDRAM ACTV Command
DCAB
ECLKOUT
1
1
4
5
12
12
11
11
CEx
BE[3:0]
EA[21:13, 11:2]
EA12
ED[31:0]
AOE/SDRAS/SSOE†
ARE/SDCAS/SSADS†
AWE/SDWE/SSWE†
† ARE/SDCAS/SSADS, AWE/SDWE/SSWE, and AOE/SDRAS/SSOE operate as SDCAS, SDWE, and SDRAS, respectively, during SDRAM
accesses.
Figure 25. SDRAM DCAB Command
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
57
SPRS073L − AUGUST 1998 − REVISED JUNE 2005
SYNCHRONOUS DRAM TIMING (CONTINUED)
DEAC
ECLKOUT
1
1
CEx
BE[3:0]
4
5
Bank
EA[21:13]
EA[11:2]
4
5
12
12
11
11
EA12
ED[31:0]
AOE/SDRAS/SSOE†
ARE/SDCAS/SSADS†
AWE/SDWE/SSWE†
† ARE/SDCAS/SSADS, AWE/SDWE/SSWE, and AOE/SDRAS/SSOE operate as SDCAS, SDWE, and SDRAS, respectively, during SDRAM
accesses.
Figure 26. SDRAM DEAC Command
REFR
ECLKOUT
1
1
12
12
8
8
CEx
BE[3:0]
EA[21:2]
EA12
ED[31:0]
AOE/SDRAS/SSOE†
ARE/SDCAS/SSADS†
AWE/SDWE/SSWE†
† ARE/SDCAS/SSADS, AWE/SDWE/SSWE, and AOE/SDRAS/SSOE operate as SDCAS, SDWE, and SDRAS, respectively, during SDRAM
accesses.
Figure 27. SDRAM REFR Command
58
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SPRS073L − AUGUST 1998 − REVISED JUNE 2005
SYNCHRONOUS DRAM TIMING (CONTINUED)
MRS
ECLKOUT
1
1
4
MRS value
5
12
12
8
8
11
11
CEx
BE[3:0]
EA[21:2]
ED[31:0]
AOE/SDRAS/SSOE†
ARE/SDCAS/SSADS†
AWE/SDWE/SSWE†
† ARE/SDCAS/SSADS, AWE/SDWE/SSWE, and AOE/SDRAS/SSOE operate as SDCAS, SDWE, and SDRAS, respectively, during SDRAM
accesses.
Figure 28. SDRAM MRS Command
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
59
SPRS073L − AUGUST 1998 − REVISED JUNE 2005
HOLD/HOLDA TIMING
timing requirements for the HOLD/HOLDA cycles† (see Figure 29)
−150
−167
NO.
MIN
3
toh(HOLDAL-HOLDL)
† E = ECLKIN period in ns
Output hold time, HOLD low after HOLDA low
UNIT
MAX
E
ns
switching characteristics over recommended operating conditions for the HOLD/HOLDA cycles†‡
(see Figure 29)
NO.
−150
−167
PARAMETER
MIN
1
2
4
td(HOLDL-EMHZ)
td(EMHZ-HOLDAL)
Delay time, HOLD low to EMIF Bus high impedance
td(HOLDH-EMLZ)
td(EMLZ-HOLDAH)
Delay time, HOLD high to EMIF Bus low impedance
Delay time, EMIF Bus high impedance to HOLDA low
UNIT
2E
MAX
§
ns
0
2E
ns
2E
7E
ns
5
Delay time, EMIF Bus low impedance to HOLDA high
0
2E
ns
† E = ECLKIN period in ns
‡ EMIF Bus consists of CE[3:0], BE[3:0], ED[31:0], EA[21:2], ARE/SDCAS/SSADS, AOE/SDRAS/SSOE, and AWE/SDWE/SSWE.
§ All pending EMIF transactions are allowed to complete before HOLDA is asserted. If no bus transactions are occurring, then the minimum delay
time can be achieved. Also, bus hold can be indefinitely delayed by setting NOHOLD = 1.
External Requestor
Owns Bus
DSP Owns Bus
DSP Owns Bus
3
HOLD
2
5
HOLDA
EMIF Bus†
1
C6211/C6211B
4
C6211/C6211B
† EMIF Bus consists of CE[3:0], BE[3:0], ED[31:0], EA[21:2], ARE/SDCAS/SSADS, AOE/SDRAS/SSOE, and AWE/SDWE/SSWE.
Figure 29. HOLD/HOLDA Timing
60
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SPRS073L − AUGUST 1998 − REVISED JUNE 2005
BUSREQ TIMING
switching characteristics over recommended operating conditions for the BUSREQ cycles
(see Figure 30)
NO.
1
−150
−167
PARAMETER
td(EKOH-BUSRV)
Delay time, ECLKOUT high to BUSREQ valid
UNIT
MIN
MAX
1.5
11
ns
ECLKOUT
1
1
BUSREQ
Figure 30. BUSREQ Timing
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
61
SPRS073L − AUGUST 1998 − REVISED JUNE 2005
RESET TIMING
timing requirements for reset† (see Figure 31)
−150
−167
NO.
MIN
UNIT
MAX
Width of the RESET pulse (PLL stable)‡
10P
ns
1
tw(RST)
Width of the RESET pulse (PLL needs to sync up)§
250
µs
14
tsu(HD)
th(HD)
Setup time, HD boot configuration bits valid before RESET high¶
Hold time, HD boot configuration bits valid after RESET high¶
2P
ns
15
2P
ns
† P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns.
‡ This parameter applies to CLKMODE x1 when CLKIN is stable, and applies to CLKMODE x4 when CLKIN and PLL are stable.
§ This parameter applies to CLKMODE x4 only (it does not apply to CLKMODE x1). The RESET signal is not connected internally to the clock PLL
circuit. The PLL, however, may need up to 250 µs to stabilize following device power up or after PLL configuration has been changed. During
that time, RESET must be asserted to ensure proper device operation. See the clock PLL section for PLL lock times.
¶ HD[4:3] are the boot configuration pins during device reset.
switching characteristics over recommended operating conditions during reset†#|| (see Figure 31)
NO.
2
3
4
5
6
7
8
9
10
11
12
13
−150
−167
PARAMETER
UNIT
MIN
MAX
td(RSTL-ECKI)
td(RSTH-ECKI)
Delay time, RESET low to ECLKIN synchronized internally
2P + 3E
3P + 4E
ns
Delay time, RESET high to ECLKIN synchronized internally
2P + 3E
3P + 4E
ns
td(RSTL-EMIFZHZ)
td(RSTH-EMIFZV)
Delay time, RESET low to EMIF Z group high impedance
2P + 3E
td(RSTL-EMIFHIV)
td(RSTH-EMIFHV)
Delay time, RESET low to EMIF high group invalid
td(RSTL-EMIFLIV)
td(RSTH-EMIFLV)
Delay time, RESET low to EMIF low group invalid
td(RSTL-HIGHIV)
td(RSTH-HIGHV)
Delay time, RESET low to high group invalid
td(RSTL-ZHZ)
td(RSTH-ZV)
Delay time, RESET low to Z group high impedance
2P
ns
Delay time, RESET high to Z group valid
2P
ns
Delay time, RESET high to EMIF Z group valid
ns
3P + 4E
2P + 3E
Delay time, RESET high to EMIF high group valid
ns
3P + 4E
2P + 3E
Delay time, RESET high to EMIF low group valid
ns
ns
3P + 4E
2P
Delay time, RESET high to high group valid
ns
ns
ns
4P
ns
† P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns.
# E = ECLKIN period in ns
|| EMIF Z group consists of:
EA[21:2], ED[31:0], CE[3:0], BE[3:0], ARE/SDCAS/SSADS, AWE/SDWE/SSWE, and AOE/SDRAS/SSOE
EMIF high group consists of: HOLDA
EMIF low group consists of: BUSREQ
High group consists of:
HRDY and HINT
Z group consists of:
HD[15:0], CLKX0, CLKX1, FSX0, FSX1, DX0, DX1, CLKR0, CLKR1, FSR0, FSR1, TOUT0, and TOUT1.
62
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SPRS073L − AUGUST 1998 − REVISED JUNE 2005
RESET TIMING (CONTINUED)
CLKOUT1
CLKOUT2
1
14
15
RESET
§
ECLKIN
2
3
4
5
6
7
8
9
EMIF Z Group†
EMIF High Group†
EMIF Low Group†
10
11
12
13
High Group†
Z Group†
HD[8, 4:3]‡
§ ECLKIN should be provided during reset in order to drive EMIF signals to the correct reset values. ECLKOUT continues to clock as long as
ECLKIN is provided.
† EMIF Z group consists of:
EA[21:2], ED[31:0], CE[3:0], BE[3:0], ARE/SDCAS/SSADS, AWE/SDWE/SSWE, and AOE/SDRAS/SSOE
EMIF high group consists of: HOLDA
EMIF low group consists of: BUSREQ
High group consists of:
HRDY and HINT
Z group consists of:
HD[15:0], CLKX0, CLKX1, FSX0, FSX1, DX0, DX1, CLKR0, CLKR1, FSR0, FSR1, TOUT0, and TOUT1.
‡ HD[8, 4:3] are the endianness and boot configuration pins during device reset.
Figure 31. Reset Timing
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
63
SPRS073L − AUGUST 1998 − REVISED JUNE 2005
EXTERNAL INTERRUPT TIMING
timing requirements for external interrupts† (see Figure 32)
−150
−167
NO.
MIN
1
2
tw(ILOW)
tw(IHIGH)
Width of the interrupt pulse low
2P
ns
Width of the interrupt pulse high
2P
ns
† P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns.
1
2
EXT_INT, NMI
Figure 32. External/NMI Interrupt Timing
64
UNIT
MAX
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SPRS073L − AUGUST 1998 − REVISED JUNE 2004
HOST-PORT INTERFACE TIMING
timing requirements for host-port interface cycles [C6211]†‡ (see Figure 33, Figure 34, Figure 35,
and Figure 36)
C6211−150
C6211−167
NO.
MIN
1
tsu(SELV-HSTBL)
th(HSTBL-SELV)
Setup time, select signals§ valid before HSTROBE low
Hold time, select signals§ valid after HSTROBE low
tw(HSTBL)
tw(HSTBH)
UNIT
MAX
5
ns
4
ns
Pulse duration, HSTROBE low
4P
ns
Pulse duration, HSTROBE high between consecutive accesses
Setup time, select signals§ valid before HAS low
4P
ns
5
ns
Hold time, select signals§ valid after HAS low
3
ns
Setup time, host data valid before HSTROBE high
5
ns
Hold time, host data valid after HSTROBE high
3
ns
Hold time, HSTROBE low after HRDY low. HSTROBE should not be inactivated
until HRDY is active (low); otherwise, HPI writes will not complete properly.
2
ns
Setup time, HAS low before HSTROBE low
2
ns
19
Hold time, HAS low after HSTROBE low
2
† HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
‡ P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns.
§ Select signals include: HCNTL[1:0], HR/W, and HHWIL.
ns
2
3
4
10
11
12
tsu(SELV-HASL)
th(HASL-SELV)
13
tsu(HDV-HSTBH)
th(HSTBH-HDV)
14
th(HRDYL-HSTBL)
18
tsu(HASL-HSTBL)
th(HSTBL-HASL)
switching characteristics over recommended operating conditions during host-port interface
cycles [C6211]†‡ (see Figure 33, Figure 34, Figure 35, and Figure 36)
NO.
PARAMETER
C6211−150
C6211−167
MIN
UNIT
MAX
Delay time, HCS to HRDY¶
1
15
ns
6
td(HCS-HRDY)
td(HSTBL-HRDYH)
Delay time, HSTROBE low to HRDY high#
3
15
ns
7
td(HSTBL-HDLZ)
Delay time, HSTROBE low to HD low impedance for an HPI read
8
Delay time, HD valid to HRDY low
9
td(HDV-HRDYL)
toh(HSTBH-HDV)
15
td(HSTBH-HDHZ)
16
17
5
2
ns
2P − 4
2P
ns
Output hold time, HD valid after HSTROBE high
3
15
ns
Delay time, HSTROBE high to HD high impedance
3
15
ns
td(HSTBL-HDV)
Delay time, HSTROBE low to HD valid
3
15
ns
td(HSTBH-HRDYH)
td(HASL-HRDYH)
Delay time, HSTROBE high to HRDY high||
3
15
ns
20
Delay time, HAS low to HRDY high
3
15
ns
† HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
‡ P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns.
¶ HCS enables HRDY, and HRDY is always low when HCS is high. The case where HRDY goes high when HCS falls indicates that HPI is busy
completing a previous HPID write or READ with autoincrement.
# This parameter is used during an HPID read. At the beginning of the first half-word transfer on the falling edge of HSTROBE, the HPI sends the
request to the EDMA internal address generation hardware, and HRDY remains high until the EDMA internal address generation hardware loads
the requested data into HPID.
|| This parameter is used after the second half-word of an HPID write or autoincrement read. HRDY remains low if the access is not an HPID write
or autoincrement read. Reading or writing to HPIC or HPIA does not affect the HRDY signal.
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
65
SPRS073L − AUGUST 1998 − REVISED JUNE 2004
HOST-PORT INTERFACE TIMING (CONTINUED)
timing requirements for host-port interface cycles [C6211BGFNA/C6211B]†‡ (see Figure 33,
Figure 34, Figure 35, and Figure 36)
C6211B−150
C6211B−167
C6211BGFNA−150
NO.
MIN
1
2
3
4
10
11
12
13
tsu(SELV-HSTBL)
th(HSTBL-SELV)
Setup time, select signals§ valid before HSTROBE low
Hold time, select signals§ valid after HSTROBE low
tw(HSTBL)
tw(HSTBH)
tsu(SELV-HASL)
th(HASL-SELV)
tsu(HDV-HSTBH)
th(HSTBH-HDV)
14
th(HRDYL-HSTBL)
18
tsu(HASL-HSTBL)
th(HSTBL-HASL)
19
UNIT
MAX
5
ns
4
ns
Pulse duration, HSTROBE low
4P
ns
Pulse duration, HSTROBE high between consecutive accesses
Setup time, select signals§ valid before HAS low
4P
ns
5
ns
Hold time, select signals§ valid after HAS low
3
ns
Setup time, host data valid before HSTROBE high
5
ns
Hold time, host data valid after HSTROBE high
3
ns
Hold time, HSTROBE low after HRDY low. HSTROBE should not be
inactivated until HRDY is active (low); otherwise, HPI writes will not
complete properly.
2
ns
Setup time, HAS low before HSTROBE low
2
ns
Hold time, HAS low after HSTROBE low
2
ns
† HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
‡ P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns.
§ Select signals include: HCNTL[1:0], HR/W, and HHWIL.
switching characteristics over recommended operating conditions during host-port interface
cycles [C6211BGFNA/C6211B]†‡ (see Figure 33, Figure 34, Figure 35, and Figure 36)
NO.
C6211BGFNA−150
PARAMETER
MIN
5
MAX
C6211B−150
C6211B−167
MIN
UNIT
MAX
Delay time, HCS to HRDY¶
1
13
1
12
ns
Delay time, HSTROBE low to HRDY high#
3
13
3
12
ns
Delay time, HSTROBE low to HD low impedance for
an HPI read
2
6
td(HCS-HRDY)
td(HSTBL-HRDYH)
7
td(HSTBL-HDLZ)
8
Delay time, HD valid to HRDY low
9
td(HDV-HRDYL)
toh(HSTBH-HDV)
15
td(HSTBH-HDHZ)
16
17
2
ns
2P − 4
2P
2P − 4
2P
ns
Output hold time, HD valid after HSTROBE high
3
13
3
12
ns
Delay time, HSTROBE high to HD high impedance
3
13
3
12
ns
td(HSTBL-HDV)
Delay time, HSTROBE low to HD valid
3
13
3
12
ns
td(HSTBH-HRDYH)
td(HASL-HRDYH)
Delay time, HSTROBE high to HRDY high||
3
13
3
12
ns
20
Delay time, HAS low to HRDY high
3
13
3
12
ns
† HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
‡ P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns.
¶ HCS enables HRDY, and HRDY is always low when HCS is high. The case where HRDY goes high when HCS falls indicates that HPI is busy
completing a previous HPID write or READ with autoincrement.
# This parameter is used during an HPID read. At the beginning of the first half-word transfer on the falling edge of HSTROBE, the HPI sends the
request to the EDMA internal address generation hardware, and HRDY remains high until the EDMA internal address generation hardware loads
the requested data into HPID.
|| This parameter is used after the second half-word of an HPID write or autoincrement read. HRDY remains low if the access is not an HPID write
or autoincrement read. Reading or writing to HPIC or HPIA does not affect the HRDY signal.
66
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SPRS073L − AUGUST 1998 − REVISED JUNE 2004
HOST-PORT INTERFACE TIMING (CONTINUED)
HAS
1
1
2
2
HCNTL[1:0]
1
1
2
2
HR/W
1
1
2
2
HHWIL
4
3
HSTROBE†
3
HCS
15
9
7
15
9
16
HD[15:0] (output)
1st halfword
5
2nd halfword
8
17
5
HRDY (case 1)
6
8
17
5
HRDY (case 2)
† HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
Figure 33. HPI Read Timing (HAS Not Used, Tied High)
HAS†
19
11
19
10
11
10
HCNTL[1:0]
11
11
10
10
HR/W
11
11
10
10
HHWIL
4
3
HSTROBE‡
18
18
HCS
15
7
9
15
16
9
HD[15:0] (output)
1st half-word
5
8
2nd half-word
17
5
17
5
HRDY (case 1)
20
8
HRDY (case 2)
† For correct operation, strobe the HAS signal only once per HSTROBE active cycle.
‡ HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
Figure 34. HPI Read Timing (HAS Used)
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
67
SPRS073L − AUGUST 1998 − REVISED JUNE 2004
HOST-PORT INTERFACE TIMING (CONTINUED)
HAS
1
1
2
2
HCNTL[1:0]
1
1
2
2
HR/W
1
1
2
2
HHWIL
3
3
4
14
HSTROBE†
HCS
12
12
13
13
HD[15:0] (input)
1st halfword
5
17
2nd halfword
5
HRDY
† HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
Figure 35. HPI Write Timing (HAS Not Used, Tied High)
HAS†
19
19
11
11
10
10
HCNTL[1:0]
11
11
10
10
HR/W
11
11
10
10
HHWIL
3
14
HSTROBE‡
4
18
18
HCS
12
13
12
13
HD[15:0] (input)
5
1st half-word
2nd half-word
17
HRDY
† For correct operation, strobe the HAS signal only once per HSTROBE active cycle.
‡ HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
Figure 36. HPI Write Timing (HAS Used)
68
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
5
SPRS073L − AUGUST 1998 − REVISED JUNE 2004
MULTICHANNEL BUFFERED SERIAL PORT TIMING
timing requirements for McBSP†‡ (see Figure 37)
−150
−167
NO.
2
3
tc(CKRX)
tw(CKRX)
Cycle time, CLKR/X
CLKR/X ext
Pulse duration, CLKR/X high or CLKR/X low
CLKR/X ext
5
tsu(FRH-CKRL)
Setup time, external FSR high before CLKR low
6
th(CKRL-FRH)
Hold time, external FSR high after CLKR low
7
tsu(DRV-CKRL)
Setup time, DR valid before CLKR low
8
th(CKRL-DRV)
Hold time, DR valid after CLKR low
10
tsu(FXH-CKXL)
Setup time, external FSX high before CLKX low
11
th(CKXL-FXH)
Hold time, external FSX high after CLKX low
UNIT
MIN
2P§
CLKR int
0.5tc(CKRX) − 1
20
CLKR ext
1
CLKR int
6
CLKR ext
3
CLKR int
22
CLKR ext
3
CLKR int
3
CLKR ext
4
CLKX int
23
CLKX ext
1
CLKX int
6
CLKX ext
3
MAX
ns
ns
ns
ns
ns
ns
ns
ns
† CLKRP = CLKXP = FSRP = FSXP = 0. If polarity of any of the signals is inverted, then the timing references of that signal are also inverted.
‡ P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns.
§ The minimum CLKR/X period is twice the CPU cycle time (2P). This means that the maximum bit rate for communications between the McBSP
and other device is 83 Mbps for 167 MHz CPU clock or 75 Mbps for 150 MHz CPU clock; where the McBSP is either the master or the slave.
Care must be taken to ensure that the AC timings specified in this data sheet are met. The maximum bit rate for McBSP-to-McBSP
communications is 33 Mbps; therefore, the minimum CLKR/X clock cycle is either twice the CPU cycle time (2P), or 30 ns (33 MHz), whichever
value is larger. For example, when running parts at 167 MHz (P = 6 ns), use 30 ns as the minimum CLKR/X clock cycle (by setting the appropriate
CLKGDV ratio or external clock source). When running parts at 60 MHz (P = 16.67 ns), use 2P = 33 ns (30 MHz) as the minimum CLKR/X clock
cycle. The maximum bit rate for McBSP-to-McBSP communications applies when the serial port is a master of the clock and frame syncs (with
CLKR connected to CLKX, FSR connected to FSX, CLKXM = FSXM = 1, and CLKRM = FSRM = 0) in data delay 1 or 2 mode (R/XDATDLY =
01b or 10b) and the other device the McBSP communicates to is a slave.
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
69
SPRS073L − AUGUST 1998 − REVISED JUNE 2004
MULTICHANNEL BUFFERED SERIAL PORT TIMING (CONTINUED)
switching characteristics over recommended operating conditions for McBSP†‡ (see Figure 37)
NO.
−150
−167
PARAMETER
Delay time, CLKS high to CLKR/X high for internal CLKR/X generated from
CLKS input
UNIT
MIN
MAX
4
26
2P§¶
C − 1#
C + 1#
ns
ns
1
td(CKSH-CKRXH)
2
Cycle time, CLKR/X
CLKR/X int
3
tc(CKRX)
tw(CKRX)
Pulse duration, CLKR/X high or CLKR/X low
CLKR/X int
4
td(CKRH-FRV)
Delay time, CLKR high to internal FSR valid
CLKR int
−11
3
CLKX int
−11
3
CLKX ext
3
9
CLKX int
−9
4
CLKX ext
CLKX int
3
−9+ D1||
9
4 + D2||
CLKX ext
3 + D1||
19 + D2||
9
td(CKXH-FXV)
Delay time, CLKX high to internal FSX valid
12
tdis(CKXH-DXHZ)
Disable time, DX high impedance following last data bit
from CLKX high
13
td(CKXH-DXV)
Delay time, CLKX high to DX valid
14
td(FXH-DXV)
ns
ns
Delay time, FSX high to DX valid
FSX int
−1
3
ONLY applies when in data
delay 0 (XDATDLY = 00b) mode
FSX ext
3
9
ns
ns
ns
ns
† CLKRP = CLKXP = FSRP = FSXP = 0. If polarity of any of the signals is inverted, then the timing references of that signal are also inverted.
‡ Minimum delay times also represent minimum output hold times.
§ P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns.
¶ The minimum CLKR/X period is twice the CPU cycle time (2P). This means that the maximum bit rate for communications between the McBSP
and other device is 83 Mbps for 167 MHz CPU clock or 75 Mbps for 150 MHz CPU clock; where the McBSP is either the master or the slave.
Care must be taken to ensure that the AC timings specified in this data sheet are met. The maximum bit rate for McBSP-to-McBSP
communications is 33 Mbps; therefore, the minimum CLKR/X clock cycle is either twice the CPU cycle time (2P), or 30 ns (33 MHz), whichever
value is larger. For example, when running parts at 167 MHz (P = 6 ns), use 30 ns as the minimum CLKR/X clock cycle (by setting the appropriate
CLKGDV ratio or external clock source). When running parts at 60 MHz (P = 16.67 ns), use 2P = 33 ns (30 MHz) as the minimum CLKR/X clock
cycle. The maximum bit rate for McBSP-to-McBSP communications applies when the serial port is a master of the clock and frame syncs (with
CLKR connected to CLKX, FSR connected to FSX, CLKXM = FSXM = 1, and CLKRM = FSRM = 0) in data delay 1 or 2 mode (R/XDATDLY =
01b or 10b) and the other device the McBSP communicates to is a slave.
# C = H or L
S = sample rate generator input clock = 2P if CLKSM = 1 (P = 1/CPU clock frequency)
= sample rate generator input clock = P_clks if CLKSM = 0 (P_clks = CLKS period)
H = CLKX high pulse width = (CLKGDV/2 + 1) * S if CLKGDV is even
= (CLKGDV + 1)/2 * S if CLKGDV is odd or zero
L = CLKX low pulse width = (CLKGDV/2) * S if CLKGDV is even
= (CLKGDV + 1)/2 * S if CLKGDV is odd or zero
CLKGDV should be set appropriately to ensure the McBSP bit rate does not exceed the maximum limit (see ¶ footnote above).
|| Extra delay from CLKX high to DX valid applies only to the first data bit of a device, if and only if DXENA = 1 in SPCR.
If DXENA = 0, then D1 = D2 = 0
If DXENA = 1, then D1 = 2P, D2 = 4P
70
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SPRS073L − AUGUST 1998 − REVISED JUNE 2004
MULTICHANNEL BUFFERED SERIAL PORT TIMING (CONTINUED)
CLKS
1
2
3
3
CLKR
4
4
FSR (int)
5
6
FSR (ext)
7
DR
8
Bit(n-1)
(n-2)
(n-3)
2
3
3
CLKX
9
FSX (int)
11
10
FSX (ext)
FSX (XDATDLY=00b)
12
DX
Bit 0
14
13
Bit(n-1)
13
(n-2)
(n-3)
Figure 37. McBSP Timings
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
71
SPRS073L − AUGUST 1998 − REVISED JUNE 2004
MULTICHANNEL BUFFERED SERIAL PORT TIMING (CONTINUED)
timing requirements for FSR when GSYNC = 1 (see Figure 38)
−150
−167
NO.
MIN
1
2
tsu(FRH-CKSH)
th(CKSH-FRH)
Setup time, FSR high before CLKS high
4
ns
Hold time, FSR high after CLKS high
4
ns
CLKS
1
2
FSR external
CLKR/X (no need to resync)
CLKR/X (needs resync)
Figure 38. FSR Timing When GSYNC = 1
72
UNIT
MAX
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SPRS073L − AUGUST 1998 − REVISED JUNE 2004
MULTICHANNEL BUFFERED SERIAL PORT TIMING (CONTINUED)
timing requirements for McBSP as SPI master or slave: CLKSTP = 10b, CLKXP = 0†‡ (see Figure 39)
−150
−167
NO.
MASTER
MIN
4
tsu(DRV-CKXL)
th(CKXL-DRV)
Setup time, DR valid before CLKX low
MAX
26
5
Hold time, DR valid after CLKX low
4
† P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns.
‡ For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
UNIT
SLAVE
MIN
MAX
2 − 6P
ns
6 + 12P
ns
switching characteristics over recommended operating conditions for McBSP as SPI master or
slave: CLKSTP = 10b, CLKXP = 0†‡ (see Figure 39)
−150
−167
NO.
PARAMETER
MASTER§
2
th(CKXL-FXL)
td(FXL-CKXH)
Hold time, FSX low after CLKX low¶
Delay time, FSX low to CLKX high#
3
td(CKXH-DXV)
Delay time, CLKX high to DX valid
6
tdis(CKXL-DXHZ)
Disable time, DX high impedance following last data bit from
CLKX low
7
tdis(FXH-DXHZ)
Disable time, DX high impedance following last data bit from
FSX high
1
UNIT
SLAVE
MIN
MAX
T−9
T+9
L−9
L+9
−9
9
L−9
L+9
MIN
MAX
ns
ns
6P + 4
10P + 20
ns
ns
2P + 3
6P + 20
ns
8
td(FXL-DXV)
Delay time, FSX low to DX valid
4P + 2
8P + 20
ns
† P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns.
‡ For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
§ S = Sample rate generator input clock = 2P if CLKSM = 1 (P = 1/CPU clock frequency)
= Sample rate generator input clock = P_clks if CLKSM = 0 (P_clks = CLKS period)
T = CLKX period = (1 + CLKGDV) * S
H = CLKX high pulse width = (CLKGDV/2 + 1) * S if CLKGDV is even
= (CLKGDV + 1)/2 * S if CLKGDV is odd or zero
L = CLKX low pulse width = (CLKGDV/2) * S if CLKGDV is even
= (CLKGDV + 1)/2 * S if CLKGDV is odd or zero
¶ FSRP = FSXP = 1. As a SPI master, FSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on FSX
and FSR is inverted before being used internally.
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP
CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP
# FSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock
(CLKX).
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
73
SPRS073L − AUGUST 1998 − REVISED JUNE 2004
MULTICHANNEL BUFFERED SERIAL PORT TIMING (CONTINUED)
CLKX
1
2
FSX
7
6
DX
8
3
Bit 0
Bit(n-1)
4
DR
Bit 0
(n-2)
(n-3)
(n-4)
5
Bit(n-1)
(n-2)
(n-3)
(n-4)
Figure 39. McBSP Timing as SPI Master or Slave: CLKSTP = 10b, CLKXP = 0
74
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SPRS073L − AUGUST 1998 − REVISED JUNE 2004
MULTICHANNEL BUFFERED SERIAL PORT TIMING (CONTINUED)
timing requirements for McBSP as SPI master or slave: CLKSTP = 11b, CLKXP = 0†‡ (see Figure 40)
−150
−167
NO.
MASTER
MIN
4
tsu(DRV-CKXH)
th(CKXH-DRV)
Setup time, DR valid before CLKX high
UNIT
SLAVE
MAX
26
5
Hold time, DR valid after CLKX high
4
† P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns.
‡ For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
MIN
MAX
2 − 6P
ns
6 + 12P
ns
switching characteristics over recommended operating conditions for McBSP as SPI master or
slave: CLKSTP = 11b, CLKXP = 0†‡ (see Figure 40)
−150
−167
NO.
PARAMETER
MASTER§
2
th(CKXL-FXL)
td(FXL-CKXH)
Hold time, FSX low after CLKX low¶
Delay time, FSX low to CLKX high#
3
td(CKXL-DXV)
Delay time, CLKX low to DX valid
tdis(CKXL-DXHZ)
Disable time, DX high impedance following last data bit from
CLKX low
1
6
UNIT
SLAVE
MIN
MAX
L−9
L+9
MIN
MAX
T−9
T+9
−9
9
6P + 4
10P + 20
ns
−9
9
6P + 3
10P + 20
ns
ns
ns
7
td(FXL-DXV)
Delay time, FSX low to DX valid
H−9 H+9
4P + 2
8P + 20
ns
† P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns.
‡ For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
§ S = Sample rate generator input clock = 2P if CLKSM = 1 (P = 1/CPU clock frequency)
= Sample rate generator input clock = P_clks if CLKSM = 0 (P_clks = CLKS period)
T = CLKX period = (1 + CLKGDV) * S
H = CLKX high pulse width = (CLKGDV/2 + 1) * S if CLKGDV is even
= (CLKGDV + 1)/2 * S if CLKGDV is odd or zero
L = CLKX low pulse width = (CLKGDV/2) * S if CLKGDV is even
= (CLKGDV + 1)/2 * S if CLKGDV is odd or zero
¶ FSRP = FSXP = 1. As a SPI master, FSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on FSX
and FSR is inverted before being used internally.
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP
CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP
# FSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock
(CLKX).
CLKX
1
2
6
Bit 0
7
FSX
DX
3
Bit(n-1)
4
DR
Bit 0
(n-2)
(n-3)
(n-4)
5
Bit(n-1)
(n-2)
(n-3)
(n-4)
Figure 40. McBSP Timing as SPI Master or Slave: CLKSTP = 11b, CLKXP = 0
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
75
SPRS073L − AUGUST 1998 − REVISED JUNE 2004
MULTICHANNEL BUFFERED SERIAL PORT TIMING (CONTINUED)
timing requirements for McBSP as SPI master or slave: CLKSTP = 10b, CLKXP = 1†‡ (see Figure 41)
−150
−167
NO.
MASTER
MIN
4
tsu(DRV-CKXH)
th(CKXH-DRV)
Setup time, DR valid before CLKX high
MAX
26
5
Hold time, DR valid after CLKX high
4
† P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns.
‡ For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
UNIT
SLAVE
MIN
MAX
2 − 6P
ns
6 + 12P
ns
switching characteristics over recommended operating conditions for McBSP as SPI master or
slave: CLKSTP = 10b, CLKXP = 1†‡ (see Figure 41)
−150
−167
NO.
PARAMETER
MASTER§
2
th(CKXH-FXL)
td(FXL-CKXL)
Hold time, FSX low after CLKX high¶
Delay time, FSX low to CLKX low#
3
td(CKXL-DXV)
Delay time, CLKX low to DX valid
6
tdis(CKXH-DXHZ)
Disable time, DX high impedance following last data bit from
CLKX high
7
tdis(FXH-DXHZ)
Disable time, DX high impedance following last data bit from
FSX high
1
UNIT
SLAVE
MIN
MAX
T−9
T+9
H−9
H+9
−9
9
H−9
H+9
MIN
MAX
ns
ns
6P + 4
10P + 20
ns
ns
2P + 3
6P + 20
ns
8
td(FXL-DXV)
Delay time, FSX low to DX valid
4P + 2
8P + 20
ns
† P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns.
‡ For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
§ S = Sample rate generator input clock = 2P if CLKSM = 1 (P = 1/CPU clock frequency)
= Sample rate generator input clock = P_clks if CLKSM = 0 (P_clks = CLKS period)
T = CLKX period = (1 + CLKGDV) * S
H = CLKX high pulse width = (CLKGDV/2 + 1) * S if CLKGDV is even
= (CLKGDV + 1)/2 * S if CLKGDV is odd or zero
L = CLKX low pulse width = (CLKGDV/2) * S if CLKGDV is even
= (CLKGDV + 1)/2 * S if CLKGDV is odd or zero
¶ FSRP = FSXP = 1. As a SPI master, FSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on FSX
and FSR is inverted before being used internally.
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP
CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP
# FSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock
(CLKX).
76
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MULTICHANNEL BUFFERED SERIAL PORT TIMING (CONTINUED)
CLKX
1
2
FSX
7
6
DX
8
3
Bit 0
Bit(n-1)
4
DR
Bit 0
(n-2)
(n-3)
(n-4)
5
Bit(n-1)
(n-2)
(n-3)
(n-4)
Figure 41. McBSP Timing as SPI Master or Slave: CLKSTP = 10b, CLKXP = 1
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MULTICHANNEL BUFFERED SERIAL PORT TIMING (CONTINUED)
timing requirements for McBSP as SPI master or slave: CLKSTP = 11b, CLKXP = 1†‡ (see Figure 42)
−150
−167
NO.
MASTER
MIN
4
tsu(DRV-CKXH)
th(CKXH-DRV)
Setup time, DR valid before CLKX high
MAX
26
5
Hold time, DR valid after CLKX high
4
† P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns.
‡ For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
UNIT
SLAVE
MIN
MAX
2 − 6P
ns
6 + 12P
ns
switching characteristics over recommended operating conditions for McBSP as SPI master or
slave: CLKSTP = 11b, CLKXP = 1†‡ (see Figure 42)
−150
−167
NO.
PARAMETER
MASTER§
2
th(CKXH-FXL)
td(FXL-CKXL)
Hold time, FSX low after CLKX high¶
Delay time, FSX low to CLKX low#
3
td(CKXH-DXV)
Delay time, CLKX high to DX valid
tdis(CKXH-DXHZ)
Disable time, DX high impedance following last data bit from
CLKX high
1
6
UNIT
SLAVE
MIN
MAX
H−9
H+9
MIN
MAX
T−9
T+9
−9
9
6P + 4
10P + 20
ns
−9
9
6P + 3
10P + 20
ns
ns
ns
7
td(FXL-DXV)
Delay time, FSX low to DX valid
L−9 L+9
4P + 2
8P + 20
ns
† P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns.
‡ For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
§ S = Sample rate generator input clock = 2P if CLKSM = 1 (P = 1/CPU clock frequency)
= Sample rate generator input clock = P_clks if CLKSM = 0 (P_clks = CLKS period)
T = CLKX period = (1 + CLKGDV) * S
H = CLKX high pulse width = (CLKGDV/2 + 1) * S if CLKGDV is even
= (CLKGDV + 1)/2 * S if CLKGDV is odd or zero
L = CLKX low pulse width = (CLKGDV/2) * S if CLKGDV is even
= (CLKGDV + 1)/2 * S if CLKGDV is odd or zero
¶ FSRP = FSXP = 1. As a SPI master, FSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on FSX
and FSR is inverted before being used internally.
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP
CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP
# FSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock
(CLKX).
78
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MULTICHANNEL BUFFERED SERIAL PORT TIMING (CONTINUED)
CLKX
1
2
FSX
7
6
DX
3
Bit 0
Bit(n-1)
4
DR
Bit 0
(n-2)
(n-3)
(n-4)
5
Bit(n-1)
(n-2)
(n-3)
(n-4)
Figure 42. McBSP Timing as SPI Master or Slave: CLKSTP = 11b, CLKXP = 1
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SPRS073L − AUGUST 1998 − REVISED JUNE 2004
TIMER TIMING
timing requirements for timer inputs† (see Figure 43)
−150
−167
NO.
MIN
1
2
tw(TINPH)
tw(TINPL)
UNIT
MAX
Pulse duration, TINP high
2P
ns
Pulse duration, TINP low
2P
ns
† P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns.
switching characteristics over recommended operating conditions for timer outputs†
(see Figure 43)
NO.
−150
−167
PARAMETER
MIN
3
4
tw(TOUTH)
tw(TOUTL)
Pulse duration, TOUT high
4P −3
ns
Pulse duration, TOUT low
4P −3
ns
† P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns.
2
1
TINPx
4
3
TOUTx
Figure 43. Timer Timing
80
UNIT
MAX
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JTAG TEST-PORT TIMING
timing requirements for JTAG test port (see Figure 44)
−150
−167
NO.
MIN
1
UNIT
MAX
tc(TCK)
tsu(TDIV-TCKH)
Cycle time, TCK
35
ns
3
Setup time, TDI/TMS/TRST valid before TCK high
10
ns
4
th(TCKH-TDIV)
Hold time, TDI/TMS/TRST valid after TCK high
9
ns
switching characteristics over recommended operating conditions for JTAG test port
(see Figure 44)
NO.
2
−150
−167
PARAMETER
td(TCKL-TDOV)
Delay time, TCK low to TDO valid
UNIT
MIN
MAX
–3
18
ns
1
TCK
2
2
TDO
4
3
TDI/TMS/TRST
Figure 44. JTAG Test-Port Timing
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SPRS073L − AUGUST 1998 − REVISED JUNE 2004
MECHANICAL DATA
The following tables show the thermal resistance characteristics for the GFN and ZFN mechanical packages.
thermal resistance characteristics (S-PBGA package) for GFN
NO
1
°C/W
Air Flow (m/s)†
RΘJC
RΘJA
Junction-to-case
6.4
N/A
Junction-to-free air
25.5
0.0
RΘJA
RΘJA
Junction-to-free air
23.1
0.5
Junction-to-free air
22.3
1.0
5
RΘJA
Junction-to-free air
† m/s = meters per second
21.2
2.0
°C/W
Air Flow (m/s)†
2
3
4
thermal resistance characteristics (S-PBGA package) for ZFN
NO
1
RΘJC
RΘJA
Junction-to-case
6.4
N/A
Junction-to-free air
25.5
0.0
RΘJA
RΘJA
Junction-to-free air
23.1
0.5
Junction-to-free air
22.3
1.0
RΘJA
Junction-to-free air
† m/s = meters per second
21.2
2.0
2
3
4
5
82
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packaging information
The following packaging information and addendum reflect the most current released data available for the
designated device(s). This data is subject to change without notice and without revision of this document.
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PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2019
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TMS320C6211BGFN150
ACTIVE
BGA
GFN
256
40
TBD
SNPB
Level-4-220C-72 HR
GFN
TMS320C6211B
TMS320C6211BZFN150
ACTIVE
BGA
ZFN
256
40
Pb-Free
(RoHS)
SNAGCU
Level-4-260C-72HRS
ZFN
TMS320C6211B
TMS320C6211BZFN167
ACTIVE
BGA
ZFN
256
40
Pb-Free
(RoHS)
SNAGCU
Level-4-260C-72HRS
ZFN
TMS320C6211B
167
TMS32C6211BGFNA150
ACTIVE
BGA
GFN
256
40
TBD
SNPB
Level-4-220C-72 HR
320C6211BGFNA
TMS
TMS32C6211BZFNA150
ACTIVE
BGA
ZFN
256
40
Pb-Free
(RoHS)
SNAGCU
Level-4-260C-72HRS
320C6211BZFNA
TMS
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2019
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MBGA002C – JANUARY 1995 – REVISED MARCH 2002
GFN (S-PBGA-N256)
PLASTIC BALL GRID ARRAY
27,20
SQ
26,80
24,70
SQ
23,80
24,13 TYP
1,27
0,635
A1 Corner
0,635
1,27
Y
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
1
3
2
5
4
7
6
9
8
10
11 13 15 17 19
12 14 16 18 20
Bottom View
2,32 MAX
1,17 NOM
Seating Plane
0,40
0,30
0,90
0,60
0,15 M
0,70
0,50
0,15
4040185-2/D 02/02
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Falls within JEDEC MO-151
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