Texas Instruments | OMAP3530/25/15/03, DM3730/25, AM3715/03 CBB, CBC and CUS reflow profiles | Application notes | Texas Instruments OMAP3530/25/15/03, DM3730/25, AM3715/03 CBB, CBC and CUS reflow profiles Application notes

Texas Instruments OMAP3530/25/15/03, DM3730/25, AM3715/03 CBB, CBC and CUS reflow profiles Application notes
Application Report
SPRAB79 – March 2019
OMAP3530/25/15/03, DM3730/25, AM3715/03 CBB, CBC
and CUS reflow profiles
.......................................................................................................................... Catalog Processors
ABSTRACT
Reflow profiles are dependent on numerous factors including package type, number of components, board
layers, board size, reflow oven accuracy and process and more.
Because of the number of variables, it is not possible to provide a single reflow profile that is
representative of every board using a specific package type. Typically, manufacturing houses have reflow
profiles in place and modify them for specific hardware.
The reflow profiles in this application report are provided as a reference to assist customers and
manufacturing houses in customizing the reflow profile to specific hardware for the package type
indicated. Therefore, the information provided is not considered a final reflow profile.
1
2
3
Contents
Optimized Reflow Profiles .................................................................................................. 2
Reference Reflow Profiles .................................................................................................. 3
References ................................................................................................................... 3
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1
Optimized Reflow Profiles
1
www.ti.com
Optimized Reflow Profiles
For optimal reflow results in achieving consistent solder joint geometries the reflow profile should be
developed in cooperation with the solder paste supplier and with the equipment supplier as needed. The
solder paste vendor's datasheet includes recommendation for reflow profiles based on alloy melting
temperatures and flux activity. These recommendations must be followed to achieve optimal flux activity
resulting in wetting of the lead surface. The flux activity in the solder paste plays an important role in
facilitating solder wetting resulting in consistent solder joint geometries.
In the event SnPb or Sn lead finish are compared to NiPdAu solder joint geometries, be aware there are
distinct but acceptable different solder joint geometries for NiPdAu lead finish. For more information, see
Evaluation of nickel/palladium/gold-finished surface-mount integrated circuits and Factors that influence
side-wetting performance on IC terminals.
1.1
Maximum Reflow Temperature
The maximum allowed reflow temperature is stated on the Moisture Sensitivity Label (MSL). The following
provides a detailed MSL explanation.
The maximum allowed reflow solder temperature is specified for Pb-free and non Pb-free soldering per the
international Standard JEDEC 020D.1. The standard can be downloaded from the JEDEC Standards &
Documents Search.
This standard describes the Temperature versus Time maximum for a reflow profile used in Pb-free and
non Pb-free soldering. These conditions are used also for the package qualification tests and are intended
to be referenced as the allowable reflow profile ranges for device level qualification testing and not a
recommendation for solderability. Older packages may have used earlier versions of the JEDEC 020
standard that are grandfathered (considered acceptable). The allowed maximum reflow peak temperature
is listed on the device MSL label on the tape and reel. Sometimes multiple values may be given indicating
different humidity exposure levels and with associated processing temperature.
2
OMAP3530/25/15/03, DM3730/25, AM3715/03 CBB, CBC and CUS reflow
profiles
Copyright © 2019, Texas Instruments Incorporated
SPRAB79 – March 2019
Submit Documentation Feedback
Reference Reflow Profiles
www.ti.com
2
Reference Reflow Profiles
The reflow profiles shown in Table 1 are provided as reference when working with a manufacturing house
to generate a final reflow profile specific to the hardware using the specified package type. This
information is provided for reference only and should not be used as the final reflow profile. Final reflow
profiles must be worked out between the customer and manufacturing house.
Table 1. Reference Reflow Profiles for CBB and CBC Package Types
Time above
Liquid (sec)
Peak Reflow
Temperature
(°C)
Duration at
Peak Reflow
Temperature
(sec)
Cool Down
Rate (°C/sec)
Conveyor
Speed
(cm/min)
60-120
30-60
250
10
8
50
60-120
10
30-60
250
20
8
What ever is
required to
accomplish
desired reflow
profile
150 ±10
90 ±30
30-60
245-250
10
8
What ever is
required to
accomplish
desired reflow
profile
Pre-Heat
Temperature
(°C)
Pre-Heat Dwell
Time (sec)
CBB (12x12
mm, 0.4 mm,
top - 0.5 mm)/
CBP (12x12
mm, 0.4 mm,
top - 0.5 mm)
CBP (12x12
mm, 0.4 mm,
top - 0.5 mm)/
CBP (12x12
mm, 0.4 mm,
top - 0.5 mm)
165-185
CBC (14x14
mm, 0.5 mm,
top – 0.65 mm)
CUS (16x16
mm, 0.65 mm)
3
References
•
•
•
•
•
•
•
•
•
•
Texas Instruments: Evaluation of nickel/palladium/gold-finished surface-mount integrated circuits
Texas Instruments: Factors that influence side-wetting performance on IC terminals
JEDEC
JEDEC Standards & Documents Search
Texas Instruments: nFBGA packaging
Texas Instruments: Shelf-life evaluation of lead-free component finishes
Texas Instruments: A nickel-palladium-gold integrated circuit lead finish and its potential for solder-joint
embrittlement
Texas Instruments: Evaluation of nickel/palladium-finished ICs with lead-free solder alloys
Texas Instruments: MicroStar BGA packaging reference guide
Texas Instruments: MSL ratings and reflow profiles
SPRAB79 – March 2019
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OMAP3530/25/15/03, DM3730/25, AM3715/03 CBB, CBC and CUS reflow
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