Texas Instruments | TI OMAP4430 POP SMT Design line (Rev. C) | Application notes | Texas Instruments TI OMAP4430 POP SMT Design line (Rev. C) Application notes

Texas Instruments TI OMAP4430 POP SMT Design line (Rev. C) Application notes
TI OMAP4xxx POP SMT
Design Guideline
Michael Chen (TITL PKG)
Kenji Masumoto (HIJI PKG)
Shawn Wu (TITL PKG)
Kurt Wachtler (WTBU PKG)
SWPA182C
We Support
1
Index:
X Package Introduction
X OMAP4 SMT Process sharing
9Stencil/PCB design guide
9Memory chip flux/solder dipping in 1-step mounting
9The example of Pick & Place machine condition setting
9Reflow profile recommendation
9SMT experiment examples
X Appendix
9Through molded via solder rework methods
9X-ray examples
9Screen print material and tool examples
9Package warpage affect examples
2
OMAP4XXX POP Packages
Memory
OMAP 4
System Board
3
Mechanical Drawing of OMAP4xxx CBS (TMV)
OMAP4xxx
Top View
Bottom View
4
OMAP4xxx TMV
A-Dimension
D2
D3
5
Mechanical Drawing of Memory Chip
Memory Chip
Bottom View
6
Agenda:
X Package Introduction
X OMAP4 SMT Process sharing
9Stencil/PCB design guide
9Memory chip flux/solder dipping in 1-step mounting
9The example of Pick & Place machine condition setting
9Reflow profile recommendation
9SMT experiment examples
X Q& A
7
Stencil/PCB design guide for P0.4 OMAP4
PWB Land & Stencil aperture design Recommendation for pitch 0.4mm
Solder Mask Defined
SMD
PWB Design
A
B
Ball Pitch
Stencil Design
Thickness Opening
B
SMD*
0.4mm
A
NSMD
Non Solder Mask Defined
0.23 0.28 0.08/0.1 0.25
0.08/0.1 0.20
(Zone C)
0.28 0.23 0.08/0.1 0.25
0.08/0.1 0.20
(Zone C)
(Zone A+B)
(Zone A+B)
NSMD
B
• Avoid VIP( Via in Pad) design. If should do it, the plugged via
A
with flatten surface is recommended.
• SMD design is more suggested than NSMD to prevent the
solder starvation form trace neck or irregular joint shape.
• Trace design: No big ground with several pads connection or
wide trace neck.
• Square opening of Stencil can get more volume for joint print.
8
Package on Package (POP)
Surface Mount Assembly Process Flow
• Screen print solder paste to PCB
• Pick and place OMAP BGA
OMAP
PCB
• Dip Memory package into flux or paste
• Place on top of OMAP package
Memory
Flux Dip Station
Memory
OMAP
PCB
• Reflow to form POP stack
9
Memory chip flux/solder dipping
recommendation in 1-step mounting
“A” memory DC package, is dipped into flux with variable depth
Memory Chip
Ball height
Variable depth of flux
e.g. 20% dipping
e.g. 50% dipping
Ball height
50% depth
66%
50%
50% is appropriate
dipping depth
Flux/solder past dip depth:
From the evaluation, the optimal results at 50-70 % flux dip and solder paste.
10
Memory Paste dipping & SMT
Machine Control Setting
Memory Chip
Ball height
Paste height
Dip depth
Memory Dip too fast +
paste suppress by 4
balls and extrude the
additional paste up &
attached on the bottom
of substrate surface.
Balance the in/out transfer speed & dwell
time to get optimized solder dipping.
11
Flux/Solder Paste Depth Measurement
Gauge of height measurement
Flux/paste dipping depth was
measured by using height gauge
shown in below picture.
Flux/Paste Dipping feeder
Roll & measure
Good dip sample
Bad dip sample
Flux or Paste
The dipping performance contributed the top level soldering yield directly.
12
Measurement of flux depth (Example)
13
Condition of PnP M/C setting (example)
Placement Parameters:
Panasonic NPM
9SMT M/C Brand: Panasonic
9Type: NPM
Next Production Modular
9Device Placement: OMAP4 + Memory Chip
9Placement method: By 1-step
9Fiducial marks recognition for placement:
By Board fiducial
9Pick up Nozzle type: 1004
9Nozzle size: ~8mm (with robber tip)
9Memory Vision sequence: Pickup + Camera
vision + Memory Dipping + Placement
9Dwell time of memory dipping: 400ms ~1 sec
9Placement Force (N) or placement depth (um):
For OMAP4: package height+1~2.5N (push down)
For Memory Chip: package height+1~2.5N (push down)
Nozzle type: 1004
14
Bottom and Top BGA Placement
Surface Mounter: Fuji NXT
Memory Package
Flux Dipping Reservoir
Ideal Flux Depth = 50-60%
15
Temperature – Degrees C
Profile Recommendation for OMAP4xxx (TMV)
250
200
150
100
50
Preheating Stage
Reflow Cool Down
Time
Reflow conditions:
¾
RT to 150°C
¾ Pre –heat temp(150~200 °C)
¾ Time above melting 220°C
¾Peak temp
¾ Cool down rate
1~3°C/s
60~120sec
50~80sec
240-250°C
2~6°C/sec (max.)
9 Evaluated solder paste:
9 Shenmao PF-606-P (SAC305)
9 Tamura TLF-204-19A
9 Evaluated Memory dip flux/paste:
9 Senju M705-TVA03.9F (Paste)
9 Senju Deltalux-901K3 (Flux)
9 <700 ppm O2 reflow atmosphere is recommended to
provide the widest process window.
9 The real profile must be fine-tuned for each product to
meet the optimized soldering results
16
PCB panel
17
POP profile test board example
3
2
1
b.
-Thermal couple test locations: see above picture
-Thermal couple test points:
a. The central point btw PCB & OMAP
b. The central point btw OMAP & Memory
-Total 6 test points
a.
18
2-pass reflow: Pre-stack tray for FCPOP
To check temperature profile
Pre-stack tray designed for TI OMAP3430
Bottom POP is supported by
this rib to depopulated ball area
Pre-stack tray designed for TI OMAP3430
19
Agenda:
X Package Introduction
X OMAP4 SMT Process sharing
9Stencil/PCB design guide
9Memory chip flux/solder dipping in 1-step mounting
9The example of Pick & Place machine condition setting
9Reflow profile recommendation
9SMT experiment examples
X Q& A
20
OMAP4xxx SMT Evaluation
Preliminary experiments performed concurrent to
package design and material selection
Summary:
• Nitrogen atmosphere better than air
• Senju 901K3 better in air than Senju 529D-1*
• Dipping depth too deep*
*reference follow up tests in this report
21
OMAP4xxx DOE Experiments
22
OMAP4xxx DC (TMV) SMT Evaluation
DOE1
23
DOE1 Set Up
OMAP4 Package
Memory Package
SMT Board
Bottom BGA Paste
Top BGA Flux or Paste
Solder Stencil
Thickness (um)
Shape
Outer Four Rows
Diameter (um)
Inner Rows
Diameter (um)
Memory Package
Dipping Depth (um)
Reflow Profile
Pre-heat time
Time above Liquid
Peak temp and time
Reflow Atmosphere
Sample Size
Yield
Opens (DC net test)
Shorts (X-Ray)
Flux Dipping
Paste Dipping
OMAP4 CBS Daisy Chain
OMAP4 CBS Daisy Chain
Mock Up
Mock Up
NSMD Pads
SMD Pads
Shenmao PF-606-P (SAC305)
Senju Deltalux-901K3
(No-Clean dipping flux)
Laser and electro-polished
Shenmao PF-606-P (SAC305)
Senju M705-TVA03.9F
(SAC305, No-Clean dipping paste)
Laser and electro-polished
80
Round
80
Round
250
250
200
200
120 - 140um
See other table
70-80 sec
70-80 sec
65 - 75 sec
65 - 75 sec
245-250oC
245-250oC
Nitrogen (700 O2 ppm)
Nitrogen (700 O2 ppm)
540 packages
270
0/540
See other table
0/540
See other table
24
DOE1 Results
Memory Ball Height
Top BGA Flux or Paste
Warm up time
Memory Package
Dipping Depth (um)
Sample Size
Yield
Opens (DC net test)
Shorts (X-Ray)
Run 1
Flux Dipping
Run 2
Paste Dipping
190um
190um
Senju Deltalux-901K3
(No-Clean dipping flux)
> 8 hours
Senju M705-TVA03.9F
(SAC305, No-Clean dipping paste)
120 - 140um
See below table
540 ea
270ea
0/540
See below table
0/540
See below table
See below table
25
Top BGA Typical Solder Joint Defects
Defect: Random single or double non-wet solder joints
Root Causes:
• Insufficient flux
• OMAP and/or Memory solder ball height and gap variation during
the reflow process
Solution: Flux volume transfer control
26
POP SMT Process Variables
Paste &
Flux
Solder Paste
and Flux
Application
Solder
Stencil
Solder Alloy
Solder
% Metal
Particle Size
Paste
Thixotropy/
Slump
Viscosity
Opening
Memory Dip
Print
Speed
Size
Flux/Paste
Material
Squeegee Volume Transfer
Opening
pressure
shape
Thickness
Snap off
Surface
Separation
Flux
Mfg
Shelf/
finish
Speed
Activation Working Life
Method
SMT
Success
Memory Pkg
BGA Pitch Solder
Atmosphere:
Bd & Panel
Alloy
Pkg Size
Air or N2
Design
• TI Controlled
Accuracy
Warpage
• Standard POP
Temperature
TMV Size Solder
Pressure
Variables
Ball Size
Profile &
BOM
Warpage
• POP-TMV
Uniformity
Thermal
Dwell Time
Mold Cap
Variables
Pad Design
Load
Thickness
Pick &
Reflow
Package
Customer
Board
Place
Process
27
OMAP4xxx DC (TMV) SMT Evaluation
DOE2
28
DOE2 Set up: Screen Print Stencil Design & Reflow Process
Reflow Profiles
Preheat Zone
Temperature
Time
Soak Zone
Temperature
Time
Reflow Zone
Peak Temperature
Time above Liquid
Cooling Zone
Option 1
Option 2
Option 3
R/T-120C
70
R/T-120C
90
R/T-120C
110
120-180c
90
120-180c
110
120-180c
130
235
60
o
3 /sec
240-245
80
o
3 /sec
245-250
100
o
3 /sec29
DOE2: Solder Paste
and Flux
Flux for memory dipping:
Senju DELTALUX 901K3
Solder paste for POP mount:
Tamura TLF-204-19A
Solder paste for memory dipping:
Senju M705-TVA03.9-F
30
DOE2 Results
31
Memory Dipping Defect Example
Black ring is flux wetting bottom of memory
package: pulled flux off solder ball
140um ( actual depth)
Flux viscosity with continuous stirring
130um ( actual depth)
Flux transfer to memory package is critical:
• Type of flux
• Viscosity of flux
• Dipping depth
• Dwell time of package in flux tray
32
Paste Dipping Experiment Result
105um ( actual depth)
140um ( actual depth)
180um ( actual depth)
33
DOE2 Result
Summary:
• Bottom BGA yield robust vs. stencil design
• Top BGA yield sensitive to flux dipping process
• Depth
• Viscosity
• Dwell time
• Top BGA dipping in paste successful: verification required
• Nitrogen atmosphere (<700ppm O2) required in this test
• Experiments will continue to define assembly capability in
an Air reflow atmosphere
34
OMAP4xxx DC (TMV) SMT Evaluation
DOE3
35
DOE3 Set up:
Stencil Design
Shape
Surface Finish
Thickness (um)
Opening Diameter(um)
Zone C
Zones A & B
Round 80 Variable
Laser Job nano coating
80
250
200
100% Volume Transfer Rate
3
3926991
Zones C (um )
3
Zone A & B (um )
2513274
Opening Ratio
Zones C
Zone A & B
0.78
0.63
36
DOE3: Results
37
DOE3 Result
Summary:
• Flux and Paste chemistry and rheology are critical factors
for use in an air reflow atmosphere
• Time out of refrigeration and time worked in dipping tray
affects coating uniformity
• Dipping time change from 600ms to 900ms improved yield
• A paste that did not work in air worked in nitrogen reflow
atmosphere
• Bottom BGA process continues to be robust
• Pre-conditioned parts shifted and yielded zero bottom BGA
connections: X-ray of top BGA looked normal but unable
to test due to lack of connection through bottom BGA
38
X Appendix
9A1: Through molded via solder rework methods
• Brush with flux repair method
• Manual rework method
9A2: X-ray examples
9A3: Screen print material and reflow equipment examples
9A4: Package warpage affect examples
39
Brush with flux for repair in TMV level (1)
1
2
4
3
5
-Use cotton swab to apply adequate flux at the side-walls of defective POP.
-Reflow then Check in X-ray (see next slide) & O/S test.
Size
5
Evaluate samples
Test result (Xray, O/S)
Flux type
Repair level
OK
NG
Senju 529D-1
TMV
5
0
40
Brush with flux for repair in TMV level (2)
1
1 2
1
2
2
3
1 2
3
Non-wet Solder Joint
The non-wetting TMV joints show as
3 balls overlapped with bottom BGA
ball in X-ray inspection.
Repaired Solder Joint
The defect TMV joints are re-healed
& show as 2 balls overlapped with
bottom BGA ball in X-ray inspection.
41
X Appendix
9A1: Through molded via solder rework methods
• Basic repair method
• Manual rework method
Note: this method is not recommended for product repair due
to the number of times the topside solder ball is reflowed
9A2: X-ray examples
9A3: Screen print material and reflow equipment examples
9A4: Package warpage affect examples
42
TMV Rework Option B
Process Flow of Manual TMV Rework (1)
Manual Rework Flow
Check external
TOP SIDE Clean sub routine
Pre bake, Dry N2 Oven,
125degC, 3hr
Coat solder paste (SAC305 solder alloy)
Clean solder
Add new ball on top
side (SAC105 solder
alloy, 0.25mm diameter)
Dry N2 Oven Bake
240degC 5min
Add new ball on Bottom
side (M705 solder alloy,
0.25mm diameter)
Dry N2 Oven Bake
240degC 5min
TMV de-solder
and re-ball
(See the exact
process in next
slide)
Remove solder by solder cleaner
(machine example: Hozan HS-800)
Clean by flux remover
(material example: HAKKO 017)
Bottom SIDE Clean and surface
preparation: follow standard
BGA methods
Note: this method is not recommended for
Clean by flux remover
(material example:
HAKKO 017)
product repair due to the number of times the
Finished reball
topside solder ball is reflowed
43
TMV Rework Option B
Manual TMV Removal and Re-ball (2)
Reball Approach
Customer return
Solder up
Solder up
• Thicker solder contributes
better thermal conduction
De-soldering
• More flux help the solder
soften and extract out ,
vacuum pressure ~80kPa
Re-balling
• Paint with flux and place
0.25mm solder ball and reflow
Bake
• measure coplanarity by an
Equipment
Bottom reball process
44
X Appendix
9A1: Through molded via solder rework methods
• Basic repair method
• Manual rework method
9A2: X-ray examples
9A3: Screen print material and reflow equipment examples A4:
Package warpage affect examples
45
Solder ball analysis by X-ray -1
1-pass reflow
Picture: POP and Memory mount on PCB. Before reflow.
Solder paste printing check was good. Memory is mount on POP by flux
with good accuracy.
46
Solder ball analysis by X-ray -2
1-pass reflow
Bottom
NSMD
Top
Picture: Memory mounted by flux, NSMD board, After reflow
Memory solder ball was jointed with POP showing good barrel shape
47
Solder ball analysis by X-ray -3
1-pass reflow
Picture: Memory mounted by flux, SMD board, After reflow
Memory jointed with POP with good barrel shape.
No anomaly is found for POP solder balls.
48
Solder ball analysis by X-ray -4
1-pass reflow
Picture: Memory mounted by solder paste, SMD board, After reflow
Excess solder paste caused solder ball short
49
Solder ball analysis by X-ray -5
1-pass reflow
Picture: Memory mounted by solder paste, SMD board, After reflow.
Reduced solder paste dipping depth then solder ball short did not happen
50
Solder ball analysis by X-ray -6
1-pass reflow
2nd reflow result. Run POP+Memory mount board reflow again
Paste dip, After reflow, SMD pad
Package upward
Paste dip, After reflow, SMD pad
Package downward
2nd Reflow
2nd Reflow
Memory solder ball joint did not change by 2nd reflow
51
X Appendix
9A1: Through molded via solder rework methods
• Basic repair method
• Manual rework method
9A2: X-ray examples
9A3: Screen print material and reflow equipment examples
9A4: Package warpage affect examples
52
Solder Paste
Screen Printing
Printed Paste
Solder Stencil
53
Solder Reflow
Reflow Profile
Reflow Setup
Reflow Oven
54
X Appendix
9A1: Through molded via solder rework methods
• Basic repair method
• Manual rework method
9A2: X-ray examples
9A3: Screen print material and reflow equipment examples
9A4: Package warpage affect examples
55
Calculating Solder Paste Volume to
Prevent Shorts in the Center Array
Pre-Reflow
Max. Reflow Temperature
Post-Reflow Room Temperature
Factors affecting location of neutral point:
• Number and location of solder balls
Neutral solder ball at
• Solder surface tension
maximum reflow temperature • Pad shape
(nominal height)
• Weight of OMAP and Memory packages
• Phone board warpage
• Temperature ramp, uniformity & maximum
• Paste
• Reflow atmosphere
Sketches not to scale
56
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Audio
www.ti.com/audio
Communications and Telecom www.ti.com/communications
Amplifiers
amplifier.ti.com
Computers and Peripherals
www.ti.com/computers
Data Converters
dataconverter.ti.com
Consumer Electronics
www.ti.com/consumer-apps
DLP® Products
www.dlp.com
Energy and Lighting
www.ti.com/energy
DSP
dsp.ti.com
Industrial
www.ti.com/industrial
Clocks and Timers
www.ti.com/clocks
Medical
www.ti.com/medical
Interface
interface.ti.com
Security
www.ti.com/security
Logic
logic.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Power Mgmt
power.ti.com
Transportation and Automotive www.ti.com/automotive
Microcontrollers
microcontroller.ti.com
Video and Imaging
RFID
www.ti-rfid.com
OMAP Mobile Processors
www.ti.com/omap
Wireless Connectivity
www.ti.com/wirelessconnectivity
TI E2E Community Home Page
www.ti.com/video
e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2011, Texas Instruments Incorporated
Was this manual useful for you? yes no
Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Download PDF

advertising