Texas Instruments | LM95071 SPI/MICROWIRE 13-Bit Plus Sign Temperature Sensor (Rev. G) | Datasheet | Texas Instruments LM95071 SPI/MICROWIRE 13-Bit Plus Sign Temperature Sensor (Rev. G) Datasheet

Texas Instruments LM95071 SPI/MICROWIRE 13-Bit Plus Sign Temperature Sensor (Rev. G) Datasheet
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LM95071
SNIS137G – AUGUST 2004 – REVISED AUGUST 2019
LM95071 SPI/MICROWIRE 13-Bit Plus Sign Temperature Sensor
1 Features
3 Description
•
•
The LM95071 is a low-power, high-resolution digital
temperature sensor with an SPI and MICROWIRE
compatible interface, available in the 5-pin SOT-23.
The host can query the LM95071 at any time to read
temperature. Its low operating current is useful in
systems where low power consumption is critical.
1
•
•
•
Small SOT-23 package saves space
Shutdown mode conserves power between
temperature readings
Operates over a full −40°C to +150°C range
SPI and MICROWIRE bus interface
Key specifications:
– Supply voltage: 2.4 V to 5.5 V
– Supply current:
– Operating: 280 µA (typical)
– Shutdown: 6 µA (typical)
– Temperature accuracy:
– 0°C to 70°C ±1°C (maximum)
– −40°C to 150°C ±2°C (maximum)
– Temperature resolution: 0.03125°C
The 2.4-V to 5.5-V supply voltage range, fast
conversion rate, low supply current, and simple SPI
interface of the LM95071 make it ideal for a wide
range of applications.
Device Information(1)
PART NUMBER
LM95071
PACKAGE
SOT-23 (5)
BODY SIZE (NOM)
2.90 mm × 1.60 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
2 Applications
•
•
•
•
•
•
The LM95071 has 13-bit plus sign temperature
resolution (0.03125°C per LSB) while operating over
a temperature range of −40°C to +150°C.
System thermal management
Portable electronic devices
Personal computers
Disk drives
Office electronics
Electronic test equipment
Temperature Monitor Application
+3.3V
SimpleLink
MSP432P4
LM95071
0.1 µF
GPIO
CS
UCxSOMI (GPIO)
VDD
SI/O
10k
UCxSIMO
SC
GND
UCxCLK
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM95071
SNIS137G – AUGUST 2004 – REVISED AUGUST 2019
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Table of Contents
1
2
3
4
5
6
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
3
6.1
6.2
6.3
6.4
6.5
6.6
3
3
4
4
4
Absolute Maximum Ratings .....................................
ESD Ratings..............................................................
Recommended Operating Ratings............................
Thermal Information ..................................................
Temperature-to-Digital Converter Characteristics.....
Logic Electrical Characteristics - Digital DC
Characteristics ...........................................................
6.7 Logic Electrical Characteristics - Serial Bus Digital
Switching Characteristics...........................................
6.8 Timing Diagrams .......................................................
6.9 Typical Characteristics ..............................................
4
5
5
7
7
8
Parameter Measurement Information .................. 8
Detailed Description .............................................. 9
8.1
8.2
8.3
8.4
8.5
8.6
9
Overview ................................................................... 9
Functional Block Diagram ......................................... 9
Feature Description................................................... 9
Device Functional Modes........................................ 10
Programming .......................................................... 10
Register Maps ......................................................... 12
Device and Documentation Support.................. 14
9.1
9.2
9.3
9.4
9.5
Receiving Notification of Documentation Updates.. 14
Community Resource.............................................. 14
Trademarks ............................................................. 14
Electrostatic Discharge Caution .............................. 14
Glossary .................................................................. 14
10 Mechanical, Packaging, and Orderable
Information ........................................................... 14
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision F (May 2019) to Revision G
•
Page
Changed Temperature Monitor Application graphic ............................................................................................................... 1
Changes from Revision E (December 2018) to Revision F
Page
•
Added the TYPE column to the Pin Functions table ............................................................................................................. 3
•
Changed V(ESD) for CDM from ±200 V to ±250 V .................................................................................................................. 3
Changes from Revision D (September 2013) to Revision E
Page
•
Updated data sheet layout to the latest SDS format ............................................................................................................. 1
•
Moved the automotive device to a standalone data sheet (SNIS207) .................................................................................. 1
•
Added Device Information table, ESD Ratings table, Feature Description section, Device Functional Modes, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. .............................. 1
•
Changed key graphics on the first page ................................................................................................................................ 1
•
Replaced the Thermal Characteristics table with the Thermal Information table and added new thermal resistance
values .................................................................................................................................................................................... 4
•
Changed Temperature-to-Digital Converter Characteristics tablenote to clarify conversion interval ..................................... 4
2
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5 Pin Configuration and Functions
DBV Package
5-Pin SOT-23
Top View
1
5
CS
2
GND
VDD
LM95071/
LM95071-Q1
3
4
SI/O
SC
Pin Function
PIN
NO.
TYPE
NAME
1
CS
Input
2
GND
Ground
3
SI/O
Input/Output
4
SC
Input
5
VDD
Supply
DESCRIPTION
Chip Select input. This pin receives an active-low signal from the controller to select the device.
Ground. This is the power and signal ground return.
Serial Input/Output. This serial, bidirectional, data bus pin transmits and receives signals to and
from the controller. Schmitt trigger input in the input mode.
Serial bus clock. This serial clock signal comes from the controller. Schmitt trigger input.
Positive Supply Voltage. Supply a DC voltage from 2.4V to 5.5V to this pin and bypass with a
0.1-µF ceramic capacitor to ground.
6 Specifications
6.1 Absolute Maximum Ratings
(1) (2) (3)
MIN
MAX
UNIT
Supply voltage
−0.3
6
V
Voltage at any pin
−0.3
VDD + 0.3
V
5
mA
−65
150
°C
Input current at any pin
(4)
Storage temperature, Tstg
(1)
(2)
(3)
(4)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not
apply when operating the device beyond its rated operating conditions.
Soldering process must comply with Reflow Temperature Profile specifications.
Refer to http://www.ti.com/packaging.
Reflow temperature profiles are different for lead-free and non-lead-free packages.
When the input voltage (VI) at any pin exceeds the power supplies (VI < GND or VI > VDD) the current at that pin should be limited to
5 mA.
6.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
(3)
Electrostatic
discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) (2)
±2000
Charged-device model (CDM), per JEDEC specification JESD22-C101 (3)
±250
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
Human body model, 100 pF discharged through a 1.5 kΩ resistor. Machine model, 200 pF discharged directly into each pin.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
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6.3 Recommended Operating Ratings
MIN
MAX
UNIT
Specified temperature (1), TMIN to TMAX
−40
150
°C
Supply voltage (VDD)
2.4
5.5
V
(1)
The life expectancy of the of the LM95071 will be reduced when operating at elevated temperatures. of the LM95071 θJA (thermal
resistance, junction-to-ambient) when attached to a printed-circuit board with 2-oz. foil is summarized in the table below.
6.4 Thermal Information
LM95071
THERMAL METRIC (1)
DBV (SOT-23)
UNIT
5 PINS
RθJA
Junction-to-ambient thermal resistance
167.2
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
118.8
°C/W
RθJB
Junction-to-board thermal resistance
30.7
°C/W
ψJT
Junction-to-top characterization parameter
14.4
°C/W
ψJB
Junction-to-board characterization parameter
30.1
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
n/a
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.5 Temperature-to-Digital Converter Characteristics
Unless otherwise noted, these specifications apply for VDD = 3.3 V. All limits TA = TJ = +25°C, unless otherwise noted.
PARAMETER
Temperature error (3)
Line regulation
MIN (1)
TEST CONDITIONS
MAX (1)
VDD = 3.0V to 3.6V; TA = 0°C to +70°C, TA = TJ = TMIN to TMAX
UNIT
±1.0
°C
VDD = 3.0V to 3.6V; TA = −40°C to +150°C, TA = TJ = TMIN to TMAX
±2.0
°C
VDD = 3.6V to 5.5V; TA = 0°C to +70°C
+0.3
VDD = 3.0V to 2.4V; TA = 0°C to +70°C
-0.6
°C/V
14
0.03125
Resolution
Temperature
conversion time
See
TA = TJ = +25°C
(4)
Quiescent current
ms
228
TA = TJ = +25°C
280
TA = TJ = TMIN to TMAX
µA
520
TA = TJ = +25°C
Shutdown
Bits
°C
130
TA = TJ = TMIN to TMAX
Operating, serial bus inactive
(1)
(2)
(3)
(4)
TYP (2)
6
TA = TJ = TMIN to TMAX
µA
28
Limits are guaranteed to TI's AOQL (Average Outgoing Quality Level).
Typicals are at TA = 25°C and represent most likely parametric norm.
The of the LM95071 will operate properly over the VDD supply voltage range of 2.4V to 5.5V.
Following a power on reset, the user must allow at least 228 ms before making the first read transaction to ensure a first valid
temperature read. After the first read, in order to ensure an accurate temperature result, the time interval between any two consecutive
temperature reads must be greater than the maximum conversion time of 228 ms.
6.6 Logic Electrical Characteristics - Digital DC Characteristics
Unless otherwise noted, these specifications apply for VDD = 2.4 V to 5.5 V (1).
PARAMETER
TEST CONDITIONS
MIN (2)
TYP (3)
MAX (2)
UNIT
VIN(1)
Logical “1” Input
Voltage
TA = TJ = TMIN to TMAX
0.7 × VDD
VDD + 0.3
V
VIN(0)
Logical “0” Input
Voltage
TA = TJ = TMIN to TMAX
−0.3
0.3 × VDD
V
(1)
(2)
(3)
4
The of the LM95071 will operate properly over the VDD supply voltage range of 2.4V to 5.5V.
Limits are guaranteed to TI's AOQL (Average Outgoing Quality Level).
Typicals are at TA = 25°C and represent most likely parametric norm.
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Logic Electrical Characteristics - Digital DC Characteristics (continued)
Unless otherwise noted, these specifications apply for VDD = 2.4 V to 5.5 V(1).
PARAMETER
TYP (3)
TA = TJ = +25°C
Input Hysteresis
Voltage
VDD = 3 V to 3.6 V
IIN(1)
Logical “1” Input
Current
VIN = VDD
IIN(0)
Logical “0” Input
Current
VIN = 0 V
CIN
All Digital Inputs
TA = TJ = +25°C
VOH
High Level
Output Voltage
IOH = −400 µA, TA = TJ = TMIN to TMAX
VOL
Low Level
Output Voltage
IOL = +1.6 mA, TA = TJ = TMIN to TMAX
IO_TRI-
TRI-STATE
VO = GND
®
Output
V = VDD, TA = TJ = TMIN to TMAX
Leakage Current O
STATE
MIN (2)
TEST CONDITIONS
MAX (2)
UNIT
0.4
TA = TJ = TMIN to TMAX
V
0.33
TA = TJ = +25°C
0.005
TA = TJ = TMIN to TMAX
µA
3
−0.005
TA = TJ = +25°C
µA
−3
TA = TJ = TMIN to TMAX
20
pF
2.25
V
−1
0.4
V
+1
µA
6.7 Logic Electrical Characteristics - Serial Bus Digital Switching Characteristics
Unless otherwise noted, these specifications apply for VDD = 2.4 V to 5.5 V (1); CL (load capacitance) on output lines = 100 pF
unless otherwise specified.
MIN (2)
(1)
(2)
(3)
TA = TJ = TMIN to TMAX
TYP (3)
MAX (2)
0.16
UNIT
t1
SC (Clock) Period
t2
CS Low to SC (Clock) High Set-Up Time
TA = TJ = TMIN to TMAX
t3
CS Low to Data Out (SO) Delay
TA = TJ = TMIN to TMAX
70
ns
t4
SC (Clock) Low to Data Out (SO) Delay
TA = TJ = TMIN to TMAX
70
ns
t5
CS High to Data Out (SO) TRI-STATE
TA = TJ = TMIN to TMAX
200
ns
t6
SC (Clock) High to Data In (SI) Hold Time TA = TJ = TMIN to TMAX
50
ns
t7
Data In (SI) Set-Up Time to SC (Clock)
High
TA = TJ = TMIN to TMAX
30
ns
t8
SC (Clock) High to CS High Hold Time
TA = TJ = TMIN to TMAX
50
ns
TA = TJ = +25°C
DC
100
µs
ns
The of the LM95071 will operate properly over the VDD supply voltage range of 2.4V to 5.5V.
Limits are guaranteed to TI's AOQL (Average Outgoing Quality Level).
Typicals are at TA = 25°C and represent most likely parametric norm.
6.8 Timing Diagrams
SC
tr
t1
t2
t4
t4
tf
CS
t3
SO
Figure 1. Data Output Timing Diagram
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Timing Diagrams (continued)
SC
SC
CS
CS
t5
SO
t5
SO
Figure 2. TRI-STATE Data Output Timing Diagram
SC
SC
t7
t7
t8
t8
t6
t6
CS
CS
SI
SI
Figure 3. Data Input Timing Diagram
6
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6.9 Typical Characteristics
Figure 4. Static Supply Current vs. Temperature
Figure 6. Conversion Time vs Temperature
Figure 5. Maximum Temperature Error
Figure 7. Typical Output Noise at 30°C
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7 Parameter Measurement Information
01,0010,1100,0000
Output Code
+25°C
+0.03125°C
00,0011,0010,0000
00,0000,0000,0001
Temperature
00,0000,0000,0000
0°C
-40°C
+150°C
11,1111,1111,1111
-0.03125°C
11,1100,1110,0000
-25°C
11,1011,0000,0000
Figure 8. Temperature-to-Digital Transfer Function (Non-Linear Scale for Clarity)
+3.3V
IOL = 1.6 mA
To LM95071/
LM95071-Q1
SI/O Pin
80 pF
1.4V
IOH = -1.6 mA
Figure 9. TRI-STATE Test Circuit
8
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8 Detailed Description
8.1 Overview
The LM95071 temperature sensor incorporates a temperature sensor and 13-bit-plus-sign ΔΣ ADC (Delta-Sigma
Analog-to-Digital Converter). Compatibility of the LM95071's three-wire serial interface with SPI and
MICROWIRE allows simple communications with common microcontrollers and processors. Shutdown mode can
be used to optimize current drain for different applications. A Manufacturer/Device ID register identifies the
LM95071 as a Texas Instruments product.
8.2 Functional Block Diagram
VDD
LM95071/
LM95071-Q1
Temperature
Sensor
Circuitry
Control
Logic
14-Bit
Delta-Sigma
A/D Converter
Manufacturer's
ID Register
Temperature
Register
SI/O
Three-Wire
Serial Interface
CS
SC
8.3 Feature Description
8.3.1 Power Up and Power Down
The LM95071 always powers up in a known state and in the continuous conversion mode. Immediately after
power up, the LM95071 will output an erroneous code until the first temperature conversion has completed.
When the supply voltage is less than about 1.6V (typical), the LM95071 is considered powered down. As the
supply voltage rises above the nominal 1.6-V power up threshold, the internal registers are reset to the power up
default state described above.
8.3.2 Temperature Data Format
Temperature data is represented by a 14-bit, two's complement word with an LSB (Least Significant Bit) equal to
0.03125°C:
Table 1. Digital Output for Temperature Data
Temperature
Digital Output
Binary
Hex
+150°C
0100 1011 0000 0011
4B03
+125°C
0011 1110 1000 0011
3E83
+25°C
0000 1100 1000 0011
0C83
+0.03125°C
0000 0000 0000 0111
0007
0°C
0000 0000 0000 0011
0003
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Table 1. Digital Output for Temperature
Data (continued)
Temperature
Digital Output
Binary
Hex
−0.03125°C
1111 1111 1111 1111
FFFF
−25°C
1111 0011 1000 0011
F383
−40°C
1110 1100 0000 0011
EC03
The first data byte is the most significant byte with most significant bit first, permitting only as much data as
necessary to be read to determine temperature condition. For instance, if the first four bits of the temperature
data indicate an overtemperature condition, the host processor could immediately take action to remedy the
excessive temperatures.
8.3.3 Tight Accuracy, Fine Resolution and Low Noise
The LM95071 is well suited for applications that require tight temperature measurement accuracy. In many
applications, from process control to HVAC, the low temperature error can mean better system performance and,
by eliminating a system calibration step, lower production cost.
With fine digital resolution, the LM95071 senses and reports very small changes in its temperature, making it
ideal for applications where temperature sensitivity is important. For example, the LM95071 enables the system
to quickly identify the direction of temperature change, allowing the processor to take compensating action before
the system reaches a critical temperature.
The LM95071 has very low output noise (see Figure 7 in the Typical Characteristics section), which makes it
ideal for applications where stable thermal compensation is a priority. For example, in a temperaturecompensated oscillator application, the very small deviation in successive temperature readings translates to a
stable frequency output from the oscillator.
8.4 Device Functional Modes
8.4.1 Shutdown Mode/Manufacturer ID
The master controller may enable the shutdown mode for the purpose of reducing power consumption or for
reading the Manufacturer/Device ID information. The shutdown mode is enabled by writing XX FF hex to the
LM95071 as shown in Figure 13c. The serial bus is still active when the LM95071 is in shutdown. When in
shutdown mode the LM95071 always will output 1000 0000 0000 1111. This is the Manufacturer/Device ID
information. The first 5-bits of the field (1000 0XXX) are reserved for the manufacturer ID.
8.5 Programming
8.5.1 Serial Bus Interface
The LM95071 operates as a slave and is compatible with SPI or MICROWIRE bus specifications. Data is clocked
out on the falling edge of the serial clock (SC), while data is clocked in on the rising edge of SC. A complete
communication is framed by falling and rising chip select (CS) signal. The CS signal should be held high for at
least one clock cycle (160 ns minimum) between communications. The transmit-only communication (register
read) consists of 16 clock cycles. A complete transmit/receive communication will consist of 32 serial clocks (see
Serial Bus Timing Diagrams). The first 16 clocks comprise the transmit phase of communication, while the
second 16 clocks are the receive phase.
When CS is high SI/O will be in TRI-STATE. Communication should be initiated by taking chip select (CS) low.
This should not be done when SC is changing from a low to high state. Once CS is low the serial I/O pin (SI/O)
will transmit the first bit of data. The master can then read this bit with the rising edge of SC. The remainder of
the data will be clocked out by the falling edge of SC. CS can be taken high at any time during the transmit
phase. If CS is brought low in the middle of a conversion the LM95071 will complete the conversion and the
output shift register will be updated after CS is brought back high.
10
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Programming (continued)
The receive phase of a communication starts after 16 SC periods. CS can remain low for 32 SC cycles. The
LM95071/LM95071-Q1 will read the data available on the SI/O line on the rising edge of the serial clock. Input
data is to an 8-bit shift register. The part will detect the last eight bits shifted into the register. The receive phase
can last up to 16 SC periods. All ones must be shifted in order to place the part into shutdown. All zeros must be
shifted in order to place the LM95071 into continuous conversion mode. Only the following codes should be
transmitted to the LM95071:
• 00 hex for continuous conversion
• FF hex for shutdown
Another code may place the part into a test mode. Test modes are used by Texas Instruments to thoroughly test
the function of the LM95071 during production testing. Only eight bits have been defined above since only the
last eight transmitted are detected by the LM95071, before CS is taken HIGH.
The following communication can be used to determine the Manufacturer's/Device ID and then immediately place
the part into continuous conversion mode. With CS continuously low:
• Read 16 bits of temperature data
• Write 16 bits of data commanding shutdown
• Read 16 bits of Manufacture's/Device ID data
• Write 8 to 16 bits of data commanding Conversion Mode
• Take CS HIGH.
Note that 228 ms (max) will have to pass for a conversion to complete before the LM95071 actually transmits
temperature data.
8.5.2 Serial Bus Timing Diagrams
1
8
SC
CS
SO
D15
D14
D8
Figure 10. Reading Continuous Conversion - Single Eight-Bit Frame
1
8
1
8
SC
CS
SO
D15
D14
D7
D2
TRI-STATE
Figure 11. Reading Continuous Conversion - Two Eight-Bit Frames
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Programming (continued)
1
8
1
8
1
8
1
8
SC
CS
SI/O
D15 D14
D7
D15 D14
D2
Data from the LM95071/
LM95071-Q1
D8
TRISTATE
D7
D0
D6
Data from the Controller
Figure 12. Writing Shutdown Mode
1
8
1
8
1
8
1
8
SC
CS
SI/O
D15 D14
D7
D15 D14
D2
Data from the LM95071/
LM95071-Q1
D8
TRISTATE
D7
D0
D6
Data from the Controller
Figure 13. Writing Conversion Mode
8.6 Register Maps
8.6.1 Internal Register Structure
The LM95071 has three registers: the temperature register, the configuration register and the
Manufacturer/Device identification register. The temperature and Manufacturer/Device identification registers are
read only. The configuration register is write only.
8.6.1.1 Configuration Register
(Selects shutdown or continuous conversion modes):
Table 2. (Write Only):
D15
D14
D13
D12
D11
D10
D9
D8
X
X
X
X
X
X
X
X
D7
D6
D5
D4
D3
D2
D1
D0
Shutdown
D0–D15 set to XX FF hex enables shutdown mode.
D0–D15 set to XX 00 hex sets continuous-conversion mode.
Note: setting D0-D15 to any other values may place the LM95071 into a manufacturer's test mode, upon which
the LM95071 will stop responding as described. These test modes are to be used for Texas Instruments
production testing only. See Serial Bus Interface for a complete discussion.
8.6.1.2 Temperature Register
Table 3. (Read Only):
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
MSB
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit1
LSB
1
1
12
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D0–D1: Logic 1 will be output on SI/0.
D2–D15: Temperature Data. One LSB = 0.03125°C. Two's complement format.
8.6.1.3 Manufacturer/Device ID Register
Table 4. (Read Only):
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
1
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
D0–D1: Logic 1 will be output on SI/0.
D2–D15: Manufacturer/Device ID Data. This register is accessed whenever the LM95071 is in shutdown mode.
Submit Documentation Feedback
Copyright © 2004–2019, Texas Instruments Incorporated
Product Folder Links: LM95071
13
LM95071
SNIS137G – AUGUST 2004 – REVISED AUGUST 2019
www.ti.com
9 Device and Documentation Support
9.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
9.2 Community Resource
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
9.3 Trademarks
E2E is a trademark of Texas Instruments.
TRI-STATE is a registered trademark of National Semiconductor Corporation.
All other trademarks are the property of their respective owners.
9.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
9.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
10 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
14
Submit Documentation Feedback
Copyright © 2004–2019, Texas Instruments Incorporated
Product Folder Links: LM95071
PACKAGE OPTION ADDENDUM
www.ti.com
9-Aug-2019
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM95071CIMF
NRND
SOT-23
DBV
5
1000
TBD
Call TI
Call TI
-40 to 150
T18C
LM95071CIMF/NOPB
ACTIVE
SOT-23
DBV
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 150
T18C
LM95071CIMFX
NRND
SOT-23
DBV
5
3000
TBD
Call TI
Call TI
-40 to 150
T18C
LM95071CIMFX/NOPB
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 150
T18C
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
9-Aug-2019
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LM95071 :
• Automotive: LM95071-Q1
NOTE: Qualified Version Definitions:
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
29-Sep-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
LM95071CIMF
SOT-23
DBV
5
1000
178.0
8.4
LM95071CIMF/NOPB
SOT-23
DBV
5
1000
178.0
LM95071CIMFX
SOT-23
DBV
5
3000
178.0
LM95071CIMFX/NOPB
SOT-23
DBV
5
3000
178.0
3.2
3.2
1.4
4.0
8.0
Q3
8.4
3.2
3.2
1.4
4.0
8.0
Q3
8.4
3.2
3.2
1.4
4.0
8.0
Q3
8.4
3.2
3.2
1.4
4.0
8.0
Q3
Pack Materials-Page 1
W
Pin1
(mm) Quadrant
PACKAGE MATERIALS INFORMATION
www.ti.com
29-Sep-2019
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM95071CIMF
SOT-23
DBV
5
1000
210.0
185.0
35.0
LM95071CIMF/NOPB
SOT-23
DBV
5
1000
210.0
185.0
35.0
LM95071CIMFX
SOT-23
DBV
5
3000
210.0
185.0
35.0
LM95071CIMFX/NOPB
SOT-23
DBV
5
3000
210.0
185.0
35.0
Pack Materials-Page 2
PACKAGE OUTLINE
DBV0005A
SOT-23 - 1.45 mm max height
SCALE 4.000
SMALL OUTLINE TRANSISTOR
C
3.0
2.6
1.75
1.45
PIN 1
INDEX AREA
1
0.1 C
B
A
5
2X 0.95
1.9
1.45
0.90
3.05
2.75
1.9
2
4
0.5
5X
0.3
0.2
3
(1.1)
C A B
0.15
TYP
0.00
0.25
GAGE PLANE
8
TYP
0
0.22
TYP
0.08
0.6
TYP
0.3
SEATING PLANE
4214839/E 09/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Refernce JEDEC MO-178.
4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
www.ti.com
EXAMPLE BOARD LAYOUT
DBV0005A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
5X (1.1)
1
5
5X (0.6)
SYMM
(1.9)
2
2X (0.95)
3
4
(R0.05) TYP
(2.6)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
EXPOSED METAL
EXPOSED METAL
0.07 MIN
ARROUND
0.07 MAX
ARROUND
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4214839/E 09/2019
NOTES: (continued)
5. Publication IPC-7351 may have alternate designs.
6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DBV0005A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
5X (1.1)
1
5
5X (0.6)
SYMM
(1.9)
2
2X(0.95)
4
3
(R0.05) TYP
(2.6)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
4214839/E 09/2019
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.
www.ti.com
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TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
permission to use these resources only for development of an application that uses the TI products described in the resource. Other
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warranties or warranty disclaimers for TI products.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2019, Texas Instruments Incorporated
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