Texas Instruments | PGA400-Q1 Pressure-Sensor Signal Conditioner | Datasheet | Texas Instruments PGA400-Q1 Pressure-Sensor Signal Conditioner Datasheet

Texas Instruments PGA400-Q1 Pressure-Sensor Signal Conditioner Datasheet
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PGA400-Q1
SLDS256 – APRIL 2019
PGA400-Q1 Pressure-Sensor Signal Conditioner
1 Features
3 Description
•
The PGA400-Q1 is an interface device for
piezoresistive, strain gauge, and capacitive-sense
elements. The device incorporates the analog front
end (AFE) that directly connects to the sense element
and has voltage regulators and an oscillator. The
device also includes a sigma-delta analog-to-digital
converter (ADC), 8051 WARP core microprocessor,
and OTP memory. Sensor compensation algorithms
can be implemented in software. The PGA400-Q1
also includes two digital-to-analog converter (DAC)
outputs.
1
•
•
•
Analog features
– Analog front-end for resistive bridge sensors
– Self-oscillating demodulator for capacitive
sensors
– On-chip temperature sensor
– Programmable gain
– 16-bit, 1-MHz sigma-delta analog-to-digital
converter for signal channel
– 10-bit sigma-delta analog-to-digital converter
for temperature channel
– Two 12-bit digital-to-analog outputs
Digital features
– Microcontroller core
– 10-MHz 8051 WARP core
– 2 clocks per instruction cycle
– On-chip oscillator
– Memory
– 8KB of OTP memory
– 89 bytes of EEPROM
– 256 bytes data SRAM
Peripheral features
– Serial peripheral interface (SPI)
– Inter-integrated circuit (I2C)
– One-wire interface (OWI)
– Two input capture ports
– Two output compare ports
– Software watchdog timer
– Oscillator watchdog
– Power management control
– Analog low-voltage detect
General features
– AEC-Q100 qualified with the following results:
– Device temperature grade 1: –40°C to
+125°C ambient operating temperature
– Device HBM ESD classification level 2
– Device HBM ESD classification level C3B
– Power supply: 4.5-V to 5.5-V operational,
–5.5-V to 16-V absolute maximum
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
PGA400QRHHRQ1
VQFN (36)
6.00 mm × 6.00 mm
PGA400QYZRQ1
WCSP (36)
3.65 mm × 3.65 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Simplified Schematic
2 Applications
•
•
•
Pressure sensor-signal conditioning
Level sensor-signal conditioning
Humidity sensor-signal conditioning
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
PGA400-Q1
SLDS256 – APRIL 2019
www.ti.com
4 Device and Documentation Support
4.1 Documentation Support
4.1.1 Related Documentation
For related documentation see the following:
• Texas Instruments, PGA400-Q1 EVM user guide
• Texas Instruments, PGA400-Q1 errata
• Texas Instruments, Shelf-Life Evaluation of Lead-Free Component Finishes application report
4.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
4.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
4.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
4.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
4.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
5 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
2
Submit Documentation Feedback
Copyright © 2019, Texas Instruments Incorporated
Product Folder Links: PGA400-Q1
PACKAGE OPTION ADDENDUM
www.ti.com
29-Mar-2019
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
PGA400QRHHRQ1
ACTIVE
VQFN
RHH
36
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 125
PGA400Q
RHH-Q100
PGA400QYZSRQ1
ACTIVE
DSBGA
YZS
36
1500
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 125
PGA400
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
29-Mar-2019
OTHER QUALIFIED VERSIONS OF PGA400-Q1 :
• Enhanced Product: PGA400-EP
NOTE: Qualified Version Definitions:
• Enhanced Product - Supports Defense, Aerospace and Medical Applications
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Apr-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
PGA400QRHHRQ1
VQFN
RHH
36
2500
330.0
16.4
6.3
6.3
1.1
12.0
16.0
Q2
PGA400QYZSRQ1
DSBGA
YZS
36
1500
180.0
12.4
3.79
3.79
0.71
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Apr-2019
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
PGA400QRHHRQ1
VQFN
RHH
36
2500
367.0
367.0
38.0
PGA400QYZSRQ1
DSBGA
YZS
36
1500
210.0
185.0
35.0
Pack Materials-Page 2
GENERIC PACKAGE VIEW
RHH 36
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
6 x 6, 0.5 mm pitch
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4225440/A
www.ti.com
PACKAGE OUTLINE
RHH0036C
VQFN - 1 mm max height
SCALE 2.300
PLASTIC QUAD FLATPACK - NO LEAD
6.1
5.9
B
A
PIN 1 INDEX AREA
6.1
5.9
1.0
0.8
C
SEATING PLANE
0.05
0.00
0.08 C
4.4 0.1
2X 4
SYMM
EXPOSED
THERMAL PAD
(0.2) TYP
18
10
9
19
SYMM
37
2X 4
32X 0.5
1
PIN 1 ID
27
36
28
36X
0.65
0.45
36X
0.30
0.18
0.1
0.05
C A B
4225412/A 10/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
RHH0036C
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
( 4.4)
SYMM
28
36
SEE SOLDER MASK
DETAIL
36X (0.75)
36X (0.24)
27
1
(1.95)
TYP
32X (0.5)
(1.12)
TYP
37
SYMM
(5.65)
(R0.05) TYP
( 0.2) TYP
VIA
19
9
18
10
(1.12)
TYP
(1.95) TYP
(5.65)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 15X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
METAL UNDER
SOLDER MASK
METAL EDGE
EXPOSED
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER
EXPOSED
METAL
SOLDER MASK
OPENING
SOLDER MASK DEFINED
MASK DETAILS
4225412/A 10/2019
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
RHH0036C
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
16X ( 0.92)
36
(0.56)
TYP
(1.12)
TYP
28
36X (0.75)
27
1
36X (0.24)
32X (0.5)
(1.12) TYP
(0.56) TYP
37
SYMM
(5.65)
(R0.05) TYP
19
9
10
SYMM
18
(5.65)
SOLDER PASTE EXAMPLE
BASED ON 0.125 MM THICK STENCIL
SCALE: 15X
EXPOSED PAD 37
70% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
4225412/A 10/2019
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
PACKAGE OUTLINE
YZS0036
DSBGA - 0.625 mm max height
SCALE 5.000
DIE SIZE BALL GRID ARRAY
B
A
E
BALL A1
CORNER
D
0.625 MAX
C
SEATING PLANE
BALL TYP
0.225
0.175
0.05 C
2.5
TYP
SYMM
F
E
2.5
TYP
D
SYMM
D: Max = 3.693 mm, Min =3.632 mm
C
E: Max = 3.693 mm, Min =3.632 mm
B
0.5 TYP
A
1
0.3
36X
0.2
0.015
C A B
2
3
4
5
6
0.5 TYP
4219444/A 02/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
YZS0036
DSBGA - 0.625 mm max height
DIE SIZE BALL GRID ARRAY
(0.5) TYP
36X ( 0.23)
1
2
4
3
5
6
A
(0.5) TYP
B
C
SYMM
D
E
F
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 25X
0.05 MAX
0.05 MIN
METAL UNDER
SOLDER MASK
( 0.23)
METAL
SOLDER MASK
OPENING
EXPOSED
METAL
( 0.23)
SOLDER MASK
OPENING
EXPOSED
METAL
SOLDER MASK
DEFINED
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
NOT TO SCALE
4219444/A 02/2018
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
See Texas Instruments Literature No. SNVA009 (www.ti.com/lit/snva009).
www.ti.com
EXAMPLE STENCIL DESIGN
YZS0036
DSBGA - 0.625 mm max height
DIE SIZE BALL GRID ARRAY
(0.5) TYP
(R0.05) TYP
36X ( 0.25)
1
2
3
4
5
6
A
(0.5) TYP
B
METAL
TYP
C
SYMM
D
E
F
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE: 25X
4219444/A 02/2018
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
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