Texas Instruments | TMP300 1.8-V, Resistor-Programmable Temperature Switch and Analog Out Temperature Sensor in SC70 (Rev. E) | Datasheet | Texas Instruments TMP300 1.8-V, Resistor-Programmable Temperature Switch and Analog Out Temperature Sensor in SC70 (Rev. E) Datasheet

Texas Instruments TMP300 1.8-V, Resistor-Programmable Temperature Switch and Analog Out Temperature Sensor in SC70 (Rev. E) Datasheet
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TMP300
SBOS335E – JUNE 2005 – REVISED DECEMBER 2018
TMP300 1.8-V, Resistor-Programmable Temperature Switch and
Analog Out Temperature Sensor in SC70
1 Features
3 Description
•
•
•
•
•
•
•
•
•
The TMP300 is a low-power, resistor-programmable,
digital output temperature switch. The device allows a
threshold point to be set by adding an external
resistor. Two levels of hysteresis are available. The
TMP300 has a VTEMP analog output that can be used
as a testing point or in temperature-compensation
loops.
1
Accuracy: ±1°C (Typical at +25°C)
Programmable Trip Point
Programmable Hysteresis: 5°C/10°C
Open-Drain Outputs
Low Power: 110μA (Max)
Wide Voltage Range: +1.8V to +18V
Temperature Range: –40°C to +125°C
Analog Out: 10mV/°C
SC70-6 and SOT23-6 Packages
2 Applications
•
•
•
•
Power-supply Systems
DC-DC Modules
Thermal Monitoring
Electronic Protection Systems
With a supply voltage as low as 1.8V and low current
consumption, the TMP300 is ideal for power-sensitive
systems.
Available in two micropackages that have proven
thermal characteristics, this part gives a complete and
simple solution for users who need simple and
reliable thermal management.
Device Information(1)
PART NUMBER
PACKAGE
TMP300
BODY SIZE (NOM)
SOT-23 (6)
2.90 mm × 1.60 mm
SC70 (6)
2.00 mm × 1.25 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Pinout
Application Schematic
V+
TSET
1
6
V+
GND
2
5
VTEMP
OUT
3
4
3mA
HYSTSET
Proportional
to TA
VTEMP
RPULL-UP
OUT
TSET
(1)
RSET
210kW
TMP300
HYSTSET
NOTE: (1) Thinfilm resistor with
approximately 10% accuracy; however, this
accuracy error is trimmed out at the factory.
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TMP300
SBOS335E – JUNE 2005 – REVISED DECEMBER 2018
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Table of Contents
1
2
3
4
5
6
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
4
4
5
6
Absolute Maximum Ratings .....................................
ESD Ratings..............................................................
Electrical Characteristics...........................................
Typical Characteristics ..............................................
7
Detailed Description .............................................. 8
7.1 Overview ................................................................... 8
7.2 Feature Description................................................... 8
8
Device and Documentation Support.................. 12
8.1
8.2
8.3
8.4
8.5
9
Receiving Notification of Documentation Updates.. 12
Community Resources............................................ 12
Trademarks ............................................................. 12
Electrostatic Discharge Caution .............................. 12
Glossary .................................................................. 12
Mechanical, Packaging, and Orderable
Information ........................................................... 12
4 Revision History
Changes from Revision D (January 2016) to Revision E
•
Page
Added Pin Configuration and Functions section ................................................................................................................... 3
Changes from Revision C (January 2011) to Revision D
Page
•
Added Device Information table, ESD Ratings table, Feature Description section, Device and Documentation
Support section, and Mechanical, Packaging, and Orderable Information section................................................................ 1
•
Changed Temperature Range Features bullet ...................................................................................................................... 1
•
Added package names to pinout ........................................................................................................................................... 1
•
Deleted Ordering Information table ....................................................................................................................................... 4
•
Changed Temperature Range, TA, Functional Range parameter name in Electrical Characteristics table .......................... 5
•
Added footnote 4 to Electrical Characteristics table .............................................................................................................. 5
Changes from Revision B (November 2008) to Revision C
Page
•
Deleted second sentence from Description section ............................................................................................................... 1
•
Added TMP300B grade device specifications to Electrical Characteristics table .................................................................. 5
2
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5 Pin Configuration and Functions
DCK and DBV Package
6-Pin SOT-23 and SC70
Top View
TSET
1
6
V+
GND
2
5
VTEMP
OUT
3
4
HYSTSET
Not to scale
Pin Functions
PIN
NAME
NO.
I/O
DESCRIPTION
TSET
1
I
GND
2
—
Temperature set pin. Connects to a resistor to set the trip point
Ground
OUT
3
O
Trip output
HYSTSET
4
I
Hystersis Set. Connect to Ground for 5°C hysteresis or connect to V+ for 10°C hysteresis
VTEMP
5
I
Analog Temperature output
V+
6
O
Supply voltage: 1.8 V to 18 V
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6 Specifications
6.1 Absolute Maximum Ratings (1)
MIN
V+
Supply voltage
UNIT
+18
V
Signal input pins, voltage (2)
–0.5
(V+) + 0.5
V
Signal input pins, current (2)
–10
10
mA
Output short-circuit (3)
ISC
MAX
Continuous
Open-drain output
(V+) + 0.5
V
TA
Functional temperature
–40
+150
°C
Tstg
Storage temperature
–55
+150
°C
TJ
Junction temperature
+150
°C
(1)
(2)
(3)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Input pins are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should be
current limited to 10mA or less.
Short-circuit to ground.
6.2 ESD Ratings
VALUE
V(ESD)
4
Electrostatic discharge
Human-body model (HBM)
±4000
Charged-device model (CDM)
±1000
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UNIT
V
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6.3 Electrical Characteristics
At VS = 3.3V and TA = –40°C to +125°C, unless otherwise noted.
TMP300
PARAMETER
TEST CONDITIONS
MIN (1)
TMP300B
TYP (1)
MAX (1)
MIN
TYP
MAX
UNIT
TEMPERATURE MEASUREMENT
VS = 2.35V to 18V
Measurement range
VS = 1.8V to 2.35V
–40
+125
–40
100 ×
(VS – 0.95)
–40
+125
–40
100 ×
(VS – 0.95)
°C
TRIP POINT
Total accuracy
TA = –40°C to +125°C
RSET equation
TC is in °C
±4 (2)
±2
±2
RSET = 10 (50 + TC)/3
±6
°C
RSET = 10 (50 + TC)/3
kΩ
HYSTERESIS SET INPUT
LOW threshold
0.4
HIGH threshold
VS – 0.4
HYSTSET = GND
Threshold hysteresis
HYSTSET = VS
0.4
V
VS – 0.4
V
5
5
10
10
°C
DIGITAL OUTPUT
Logic family
VOL
CMOS
CMOS
Open-drain leakage current
OUT = VS
10
10
μA
Logic levels
VS = 1.8V to 18V, ISINK =
5mA
0.3
0.3
V
ANALOG OUTPUT
Accuracy
±2
Temperature sensitivity
10
Output voltage
TA = +25°C
720
VTEMP pin output resistance
±3
±2
±5
10
750
780
720
210
750
°C
mV/°C
780
210
mV
kΩ
POWER SUPPLY
IQ
VS = 1.8V to 18V,
TA = –40°C to +125°C
Quiescent current (3)
110
110
μA
TEMPERATURE RANGE
VS = 2.35V to 18V
Specified range
TA
Functional range
θJA
(1)
(2)
(3)
(4)
–40
+125
–40
+125
VS = 1.8V to 2.35V
–40
100 ×
(VS – 0.95)
–40
100 ×
(VS – 0.95)
VS = 2.35V to 18V
–40
+150
–40
+150
VS = 1.8V to 2.35V
–50
100 ×
(VS – 0.95)
–50
100 ×
(VS – 0.95)
(4)
Thermal resistance
SC70
250
250
SOT23-6
180
180
°C
°C/W
100% of production is tested at TA = +85°C. Specifications over temperature range are ensured by design.
Shaded cells indicate characteristic performance difference.
See Figure 1 for typical quiescent current.
The TMP300 is functional over this range and no indication of performance is implied.
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6.4 Typical Characteristics
At VS = 5V, unless otherwise noted.
2.0
95
TERROR + 1%
1.5
85
1.0
VS = 18V
Error (°C)
IQ (mA)
75
VS = 3.3V
65
VS = 1.8V
0.5
TERROR + 0.1%
0
TERROR - 0.1%
-0.5
-1.0
55
-1.5
45
-40 -25
0
25
50
75
100
TERROR - 1%
-2.0
-40 -25
125
0
Figure 1. Quiescent Current Over Temperature and Supply
4.0
600
3.0
Error (°C)
RSET (kW)
75
100
125
2.0
400
300
200
1.0
0
-1.0
-2.0
100
-3.0
0
-40 -25
0
25
50
75
100
-4.0
-40 -25
125
0
Temperature (°C)
25
50
75
100
125
Temperature (°C)
Figure 3. RSET vs Temperature
Figure 4. Typical Trip Error
0.10
3.0
2.5
0.08
2.0
1.5
0.06
0.04
1.0
0.5
Error (°C/V)
Error (°C)
50
Figure 2. RSET Shift Resulting From RSET Tolerance
700
500
0
-0.5
-1.0
-1.5
-2.0
-2.5
-3.0
-40 -25
TMAX is +85°C for VS = 1.8V to 3.3V
0.02
0
3.3V to 18V
-0.02
-0.04
-0.06
-0.08
0
25
50
75
100
125
-0.10
-40 -25
Temperature (°C)
0
25
50
75
100
125
Temperature (°C)
Figure 5. Typical Analog Output Error
6
25
Temperature (°C)
Temperature (°C)
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Figure 6. Analog PSR Over Temperature
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Typical Characteristics (continued)
At VS = 5V, unless otherwise noted.
0.10
0.08
0.06
Error (°C/V)
0.04
0.02
3.3V to 18V
0
-0.02
-0.04
-0.06
TMAX is +85°C for VS = 1.8V to 3.3V
-0.08
-0.10
-40 -25
0
25
50
75
100
125
Temperature (°C)
Figure 7. Trip PSR Over Temperature
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7 Detailed Description
7.1 Overview
The TMP300 is a thermal sensor designed for over-temperature protection circuits in electronic systems. The
TMP300 uses a set resistor to program the trip temperature of the digital output. An additional high-impedance
(210kΩ) analog voltage output provides the temperature reading.
7.2 Feature Description
7.2.1 Calculating RSET
The set resistor (RSET) provides a threshold voltage for the comparator input. The TMP300 trips when the VTEMP
pin exceeds the TSET voltage. The value of the set resistor is determined by the analog output function and the
3μA internal bias current.
To set the TMP300 to trip at a preset value, calculate the RSET resistor value according to Equation 1 or
Equation 2:
(TSET ´ 0.01 + 0.5)
RSET =
-6
3e
where
•
TSET is in °C; or
RSET in kW =
(1)
10(50 + TSET)
3
where
•
TSET is in °C.
(2)
7.2.2 Using VTEMP to Trip the Digital Output
The analog voltage output can also serve as a voltage input that forces a trip of the digital output to simulate a
thermal event. This simulation facilitates easy system design and test of thermal safety circuits, as shown in
Figure 8.
V+
3 mA
Voltage source
to test trip point.
Proportional
to TA
VTEMP
OUT
Open-Drain Control
TSET
RINT
210kW
RSET
TMP300
HYSTSET
Figure 8. Applying Voltage to Trip Digital Output
8
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Feature Description (continued)
7.2.3 Analog Temperature Output
The analog out or VTEMP pin is high-impedance (210kΩ). Avoid loading this pin to prevent degrading the analog
out value or trip point. Buffer the output of this pin when used for direct thermal measurement. Figure 9 shows
buffering of the analog output signal.
Analog Out
OPA335
V+
Proportional
to TA
3mA
VTEMP
OUT
TSET
210kW
TMP300
HYSTSET
Figure 9. Buffering the Analog Output Signal
7.2.4 Using a DAC to Set the Trip Point
The trip point is easily converted by changing the digital-to-analog converter (DAC) code. This technique can be
useful for control loops where a large thermal mass is being brought up to the set temperature and the OUT pin
is used to control the heating element. The analog output can be monitored in a control algorithm that adjusts the
set temperature to prevent overshoot. Trip set voltage error versus temperature is shown in Figure 10, which
shows error in °C of the comparator input over temperature. An alternative method of setting the trip point by
using a DAC is illustrated in Figure 11.
1.00
Trip Set Voltage Error (°C)
0.75
0.50
0.25
0
-0.25
-0.50
-0.75
-1.00
-50
-25
0
25
50
75
100
125
Temperature (°C)
Figure 10. Trip Set Voltage Error vs Temperature
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Feature Description (continued)
V+
Proportional
to TA
3 mA
Voltage source
to test trip point.
VTEMP
OUT
Open-Drain Control
TSET
210kW
DAC8560
TMP300
HYSTSET
Figure 11. DAC Generates the Voltage-Driving TSET Pin
7.2.5 Hysteresis
The hysteresis pin has two settings. Grounding HYSTSET results in 5°C of hysteresis. Connecting HYSTSET to VS
results in 10°C of hysteresis. Hysteresis error variation over temperature is shown in Figure 12 and Figure 13.
5
5
4
4
3
3
0
-1
Average
-2
Minimum
0
-1
-3
-4
0
Average
-2
-4
-25
Maximum
1
-3
-5
-50
10
2
Maximum
1
Error (°C)
Error (°C)
2
25
50
75
100
125
-5
-50
-25
Minimum
0
25
50
75
100
125
Temperature (°C)
Temperature (°C)
Figure 12. 5°C Hysteresis Error vs Temperature
Figure 13. 10°C Hysteresis Error vs Temperature
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Feature Description (continued)
Use bypass capacitors on the supplies as well as on the RSET and analog out (VTEMP) pins when in noisy
environments, as shown in Figure 14. These capacitors reduce premature triggering of the comparator.
V+
3mA
Proportional
to TA
VTEMP
OUT
Open-Drain Control
TSET
CBYPASS
CBYPASS
210kW
RSET
TMP300
HYSTSET
Figure 14. Bypass Capacitors Prevent Early Comparator Toggling Due to Circuit Board Noise
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8 Device and Documentation Support
8.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
8.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
8.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
8.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
8.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
9 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
12
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PACKAGE OPTION ADDENDUM
www.ti.com
22-Oct-2018
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TMP300AIDBVR
NRND
SOT-23
DBV
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
T300
TMP300AIDBVT
NRND
SOT-23
DBV
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
T300
TMP300AIDCKR
NRND
SC70
DCK
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
BPN
TMP300AIDCKT
NRND
SC70
DCK
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
BPN
TMP300BIDBVR
ACTIVE
SOT-23
DBV
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
DUDC
TMP300BIDBVT
ACTIVE
SOT-23
DBV
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
DUDC
TMP300BIDCKR
ACTIVE
SC70
DCK
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
QWL
TMP300BIDCKT
ACTIVE
SC70
DCK
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
QWL
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
22-Oct-2018
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TMP300 :
• Automotive: TMP300-Q1
NOTE: Qualified Version Definitions:
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
29-Sep-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
TMP300AIDBVR
SOT-23
3000
180.0
8.4
DBV
6
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
3.2
3.2
1.4
4.0
8.0
Q3
TMP300AIDBVT
SOT-23
DBV
6
250
179.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
TMP300AIDCKR
SC70
DCK
6
3000
179.0
8.4
2.2
2.5
1.2
4.0
8.0
Q3
TMP300AIDCKT
SC70
DCK
6
250
179.0
8.4
2.2
2.5
1.2
4.0
8.0
Q3
TMP300BIDBVR
SOT-23
DBV
6
3000
179.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
TMP300BIDBVT
SOT-23
DBV
6
250
179.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
TMP300BIDCKR
SC70
DCK
6
3000
179.0
8.4
2.2
2.5
1.2
4.0
8.0
Q3
TMP300BIDCKT
SC70
DCK
6
250
179.0
8.4
2.2
2.5
1.2
4.0
8.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
29-Sep-2019
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TMP300AIDBVR
SOT-23
DBV
6
3000
203.0
203.0
35.0
TMP300AIDBVT
SOT-23
DBV
6
250
203.0
203.0
35.0
TMP300AIDCKR
SC70
DCK
6
3000
203.0
203.0
35.0
TMP300AIDCKT
SC70
DCK
6
250
203.0
203.0
35.0
TMP300BIDBVR
SOT-23
DBV
6
3000
203.0
203.0
35.0
TMP300BIDBVT
SOT-23
DBV
6
250
203.0
203.0
35.0
TMP300BIDCKR
SC70
DCK
6
3000
203.0
203.0
35.0
TMP300BIDCKT
SC70
DCK
6
250
203.0
203.0
35.0
Pack Materials-Page 2
PACKAGE OUTLINE
DBV0006A
SOT-23 - 1.45 mm max height
SCALE 4.000
SMALL OUTLINE TRANSISTOR
C
3.0
2.6
1.75
1.45
PIN 1
INDEX AREA
1
0.1 C
B
A
6
2X 0.95
1.9
1.45 MAX
3.05
2.75
5
2
4
0.50
6X
0.25
0.2
C A B
3
(1.1)
0.15
TYP
0.00
0.25
GAGE PLANE
8
TYP
0
0.22
TYP
0.08
0.6
TYP
0.3
SEATING PLANE
4214840/B 03/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.15 per side.
4. Leads 1,2,3 may be wider than leads 4,5,6 for package orientation.
5. Refernce JEDEC MO-178.
www.ti.com
EXAMPLE BOARD LAYOUT
DBV0006A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
6X (1.1)
1
6X (0.6)
6
SYMM
2
5
3
4
2X (0.95)
(R0.05) TYP
(2.6)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
EXPOSED METAL
EXPOSED METAL
0.07 MIN
ARROUND
0.07 MAX
ARROUND
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4214840/B 03/2018
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DBV0006A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
6X (1.1)
1
6X (0.6)
6
SYMM
2
5
3
4
2X(0.95)
(R0.05) TYP
(2.6)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
4214840/B 03/2018
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
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IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
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TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
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Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2019, Texas Instruments Incorporated
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