Texas Instruments | TMP20 ±2.5°C Low-Power, Analog Out Temperature Sensor (Rev. B) | Datasheet | Texas Instruments TMP20 ±2.5°C Low-Power, Analog Out Temperature Sensor (Rev. B) Datasheet

Texas Instruments TMP20 ±2.5°C Low-Power, Analog Out Temperature Sensor (Rev. B) Datasheet
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TMP20
SBOS466B – DECEMBER 2009 – REVISED DECEMBER 2018
TMP20 ±2.5°C Low-Power, Analog Out Temperature Sensor
1 Features
3 Description
•
•
•
•
•
The TMP20 device is a CMOS, precision analog
output temperature sensor available in the tiny SOT563 package. The TMP20 operates from –55°C to
+130°C on a supply voltage of 2.7 V to 5.5 V with a
supply current of 4 µA. Operation as low as 1.8 V is
possible for temperatures between 15°C and 130°C.
The linear transfer function has a slope of –11.77
mV/°C (typical) and an output voltage of 1.8639 V
(typical) at 0°C. The TMP20 has a ±2.5°C accuracy
across the entire specified temperature range of
–55°C to +130°C.
1
±2.5°C Accuracy from –55°C to +130°C
Supply Voltage Range: 1.8 V to 5.5 V
Low Power: 4 µA (Maximum)
MicroSize Packages: SOT-563, SC70-5
SC70 Pin-Compatible With LM20
2 Applications
•
•
•
•
•
•
•
•
•
•
•
Cell Phones
Desktop and Notebook Computers
Portable Devices
Consumer Electronics
Battery Management
Power Supplies
HVAC
Thermal Monitoring
Disk Drives
Appliances and White Goods
Automotive
The 4-µA (maximum) supply current of the TMP20
limits self-heating of the device to less than 0.01°C.
When V+ is less than 0.5 V, the device is in
shutdown mode and consumes less than 20 nA
(typical).
The TMP20 is available in a 5-lead SC70 or 6-lead
SOT-563 package that reduces the overall required
board space.
Device Information(1)
PART NUMBER
PACKAGE
TMP20
BODY SIZE (NOM)
SOT-563 (6)
1.60 mm × 1.20 mm
SC70 (5)
2.00 mm × 1.25 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Device Block Diagram
Device Quiescent Current Over Temperature
6
Quiescent Current (µA)
VS = 5.5 V
5
4
3
2
1
0
-75
-50
-25
0
25 50 75
Temperature (°C)
100 125 150
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TMP20
SBOS466B – DECEMBER 2009 – REVISED DECEMBER 2018
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Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
6.5
6.6
4
4
4
4
5
6
Absolute Maximum Ratings .....................................
ESD Ratings ............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Typical Characteristics ..............................................
Detailed Description .............................................. 8
7.1 Overview ................................................................... 8
7.2 Functional Block Diagram ......................................... 8
7.3 Feature Description................................................... 9
7.4 Device Functional Modes........................................ 10
8
Application and Implementation ........................ 11
8.1 Application Information............................................ 11
8.2 Typical Application .................................................. 12
9 Power Supply Recommendations...................... 13
10 Layout................................................................... 13
10.1 Layout Guidelines ................................................. 13
10.2 Layout Example .................................................... 13
11 Device and Documentation Support ................. 14
11.1
11.2
11.3
11.4
11.5
11.6
Device Support ....................................................
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
14
16
16
16
16
16
12 Mechanical, Packaging, and Orderable
Information ........................................................... 17
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (October 2017) to Revision B
Page
•
Changed the y-axis unit of Device Quiescent Current Over Temperature graph from: mA to: µA ........................................ 1
•
Changed the y-axis unit of Device Quiescent Current vs Temperature graph from: mA to: µA ............................................ 6
•
Changed the y-axis unit of Device Quiescent Current vs Temperature graph from: mA to: µA .......................................... 12
•
Added Receiving Notification of Documentation Updates section ....................................................................................... 16
Changes from Original (December 2009) to Revision A
Page
•
Updated data sheet formatting and content to latest TIS documentation and translation standards ................................... 1
•
Added body size information to Device Information section ................................................................................................. 1
•
Updated Device Block Diagram.............................................................................................................................................. 1
•
Updated Device Quiescent Current Over Temperature ......................................................................................................... 1
•
Reformatted Absolute Maximum Ratings table ..................................................................................................................... 4
•
Changed Thermal Information table and added thermal information .................................................................................... 4
•
Changed minimum temperature sensitivity value from –11.4 mV/°C to –12.2 mV/°C in Electrical Characteristics table ...... 5
•
Changed maximum temperature sensitivity value from –12.2 mV/°C to –11.4 mV/°C in Electrical Characteristics table ..... 5
•
Updated Figure 1 ................................................................................................................................................................... 6
•
Updated Figure 3 ................................................................................................................................................................... 6
•
Updated Figure 7.................................................................................................................................................................... 6
•
Added Functional Block diagram, key graphics on front page, typical application schematic, application curves, and
updated layout images .......................................................................................................................................................... 8
•
Reformatted equations in Transfer Function section ............................................................................................................. 9
•
Corrected Equation 2 in Transfer Function section ............................................................................................................... 9
•
Added copyright notices to Figure 15 and Figure 16 ........................................................................................................... 14
2
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SBOS466B – DECEMBER 2009 – REVISED DECEMBER 2018
5 Pin Configuration and Functions
DRL Package
6-Pin SOT-563
Top View
NC
1
6
GND
NC / GND
2
5
NC / GND
VOUT
3
4
V+
Not to scale
DCK Package
5-Pin SC70
Top View
NC
1
GND
2
VOUT
3
5
GND
4
V+
NC- no internal connection
Pin Functions
PIN
I/O
DESCRIPTION
DRL (SOT563)
DCK (SC70)
GND
6
5
—
Ground pin
NC
1
1
—
This pin must be grounded or left floating. See Layout Example for more
information.
2, 5
2
—
This pin must be grounded or left floating. For best thermal response, connect
to GND plane. See Layout Example for more information.
VOUT
3
3
O
Analog output
V+
4
4
I
Positive supply voltage
NAME
NC / GND
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN
MAX
UNIT
7
V
150
°C
150
°C
150
°C
Supply voltage, V+
Operating temperature
–55
Junction temperature, TJ(max)
Storage temperature, Tstg
(1)
–65
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
V(ESD)
Charged-device model (CDM), per JEDEC specification JESD22-C101
Electrostatic discharge
±1000
(2)
Machine model (MM)
(1)
(2)
UNIT
±4000
V
±200
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VDD
Supply voltage range
1.8
5.5
V
TA
Specified temperature range
–55
130
°C
6.4 Thermal Information
TMP20
THERMAL METRIC (1)
DRL (SOT563)
DCK (SC70)
6 PINS
5 PINS
UNIT
RθJA
Junction-to-ambient thermal resistance
238
185
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
253
263.3
°C/W
RθJB
Junction-to-board thermal resistance
126.4
76.2
°C/W
ψJT
Junction-to-top characterization parameter
126
51.3
°C/W
ψJB
Junction-to-board characterization parameter
13
1.1
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
125.9
50.6
°C/W
(1)
4
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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6.5 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEMPERATURE MEASUREMENT
Accuracy
TEST CONDITIONS
(2)
vs supply
Temperature sensitivity
Output voltage
Nonlinearity
MIN
TYP
MAX
UNIT
(1)
(3)
(4)
(5)
TA = –55°C to 130°C
–2.5
2.5
°C
V+ = 1.8 V to 5.5 V
TA = 15°C to 130°C
–0.05
0.05
°C/V
V+ = 2.7 V to 5.5 V
TA = –50°C to 130°C
–0.05
0.05
°C/V
TA = –30°C to 100°C
–12.2
–11.4
mV/°C
TA = 0°C
–11.77
1863.9
TA = 25°C
mV
1574
–20°C ≤ TA ≤ 80°C
±0.4%
ANALOG OUTPUT
Output resistance
–600 µA ≤ ILOAD ≤ 600 μA
10
Ω
Load regulation
–600 µA ≤ ILOAD ≤ 600 μA
6
mV
Maximum capacitive load
1
nF
POWER SUPPLY
VS
Specified voltage
2.7
5.5
TA = 15°C to 130°C (6)
1.8
5.5
Quiescent current
V+ = 5.5 V
TA = 25°C
Over temperature
V+ = 5.5 V
TA = –55°C to 130°C
Shutdown current
V+ < 0.5 V
IQ
ISD
TA = –55°C to 130°C
2.6
V
4
µA
6
µA
20
nA
TEMPERATURE RANGE
Specified operating
Operating range
θJA
Thermal resistance
Self-heating
(1)
(2)
(3)
(4)
(5)
(6)
TA = –55°C to 130°C
TA = 15°C to 130°C
(6)
V+ = 2.7 V to 5.5 V
–55
130
°C
15
130
°C
–55
150
°C
SC70
185
°C/W
SOT-563
238
°C/W
SC70
0.01
°C
SOT-563
0.01
°C
100% production tested at TA = 25°C. Specifications over temperature range are assured by design.
Power-supply rejection is encompassed in the accuracy specification.
Temperature sensitivity is the average slope to the equation VO = (–11.77 × T) + 1.860 V.
VOUT is calculated from temperature with the following equation:
VO = (–3.88 × 10–6 × T2) + (–1.15 × 10–2 × T) + 1.8639 V,
where T is in °C.
Nonlinearity is the deviation of the calculated output voltage from the best fit straight line.
The TMP20 transfer function requires the output voltage to rise above the 1.8-V supply as the temperature decreases below 15°C.
When operating at a 1.8-V supply, it is normal for the TMP20 output to approach 1.8 V and remain at that voltage as the temperature
continues to decrease below 15°C. This condition does not damage the device. Once the temperature rises above 15°C, the output
voltage resumes changing as the temperature changes, according to the transfer function specified in this document. For more
information about the transfer function, see Transfer Function .
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6.6 Typical Characteristics
20
6
VS = 5.5 V
16
Quiescent Current (µA)
Output Impedance (W)
18
14
R
OUT
12
Sinking
V = 2.7 V
S
10
R
OUT
8
Sinking
V = 5.5 V
S
6
4
R
2
V = 2.7 V
OUT
Source
R
OUT
Source
4
3
2
1
V = 5.5 V
S
S
0
0
Temperature (°C)
0
25 50 75
Temperature (°C)
Figure 1. Output Impedance vs Temperature
Figure 2. Quiescent Current vs Temperature
-75
-50
-25
0
25
75
50
100
125
-75
150
3.0
-50
-25
TA = +25°C
2.5
Quiescent Current (mA)
5
2.0
1.5
1.0
4
3
2
1
0.5
0
0
-75
-50
-25
0
25
75
50
100
125
1.5
150
2.0
2.5
Temperature (°C)
Power-Supply Induced Temperature Error
(Line Regulation, °C)
Power-Supply Induced Temperature Error
(Line Regulation, °C)
20 Typical Units
At +25°C, +120°C
0.3
0.2
0.1
0
-0.1
-0.2
-0.3
-0.4
-0.5
1.5
2.0
2.5
3.0
3.5
4.0
3.5
4.0
4.5
5.0
5.5
Figure 4. Quiescent Current vs Supply Voltage
0.5
0.4
3.0
Supply Voltage (V)
Figure 3. Output Voltage vs Temperature
4.5
5.0
5.5
0.5
20 Typical Units
At -50°C
0.4
0.3
0.2
0.1
0
-0.1
-0.2
-0.3
-0.4
-0.5
1.5
Supply Voltage (V)
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Supply Voltage (V)
Figure 5. Power-Supply Rejection vs Temperature
6
100 125 150
6
V+ = 2.7 V
Output Voltage (V)
5
Figure 6. Power-Supply Rejection vs Temperature
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Typical Characteristics (continued)
2.5
3.0
39 Typical Units
V+ = 2.7 V
2.5
1.5
Minimum VSUPPLY (V)
Temperature Error (°C)
2.0
1.0
0.5
0
-0.5
-1.0
-1.5
2.0
1.5
1.0
0.5
-2.0
-2.5
-75
-50
-25
0
25
50
75
100
125
0
-75
150
-50
-25
Temperature (°C)
0
25
50
75
100
125
150
Sensor Temperature (°C)
Figure 7. Temperature Error vs Temperature
Figure 8. Minimum Supply Voltage vs Temperature
V+ = 3.3 V
T step from +25°C to +110° C
V
OUT
(200ms/div)
Output Noise (0.5 mV/div)
A
V+ = 3.3 V, TA = +25°C
0V
Time (2s/div)
Time (5 ms/div)
Figure 9. Wideband Output Noise Voltage
Figure 10. Thermal Settling (Fluid-Filled Temperature Bath)
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7 Detailed Description
7.1 Overview
The TMP20 device is a precision analog output temperature sensor. The temperature range of operation is
–55°C to +130°C with supply voltages of 2.7 V to 5.5 V. The TMP20 operates from power-supply voltages as low
as 1.8 V over a temperature range of 15°C to 130°C.
TI recommends power supply bypassing; use a 100-nF capacitor placed as closely as possible to the supply pin.
7.2 Functional Block Diagram
8
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7.3 Feature Description
7.3.1 Transfer Function
The analog output of the TMP20 over the –55°C to +130°C temperature range corresponds to the parabolic
transfer function shown in
Added Receiving Notification of Documentation Updates section:
VOUT
3.88 u 10
6
u T2
1.15 u 10
2
uT
1.8639 V
Where:
•
the temperature (T) is in °C.
(1)
When solving for temperature, the equation is shown as Equation 2:
(2)
These equations apply over the entire operating range of –55°C to +130°C.
A simplified linear transfer function referenced at 25°C is shown in Equation 3:
VOUT
11.69 mV / qC u T
1.8863 V
(3)
Linear transfer functions are calculated for limited temperature ranges by calculating the slope and offset for that
limited range, where slope is calculated by Equation 4:
P
u
6
u7 ±
Where:
•
T equals the temperature at the middle of the temperature range of interest
(4)
The offset in the linear transfer function is calculated with Equation 5:
E
9OUT 7MAX
9OUT 7
± P u 7MAX
7
where
•
VOUT(TMAX) is the calculated output voltage at TMAX as determined from
Added Receiving Notification of Documentation Updates section.
(5)
VOUT(T) is the calculated output voltage at T as calculated by
Added Receiving Notification of Documentation Updates section.
7.3.1.1 Example 1
Determine the linear transfer function for –40°C to +110°C.
TMIN = –40°C; TMAX = 110°C; therefore, T = 35°C
m = –11.77mV/°C
VOUT (110°C) = 0.5520 V
VOUT (35°C) = 1.4566 V
b = 1.8576 V
The linear transfer function for –40°C to +110°C is shown in Equation 6:
VOUT
11.77 mV / qC u T
1.8576 V
(6)
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Feature Description (continued)
Table 1 lists common temperature ranges of interest and the corresponding linear transfer functions for these
ranges. Note that the error (maximum deviation) of the linear equation from the parabolic equation increases as
the temperature ranges widen.
Table 1. Common Temperature Ranges and Corresponding Linear Transfer Functions
TEMPERATURE RANGE
LINEAR EQUATION (V)
MAXIMUM DEVIATION OF LINEAR
EQUATION FROM PARABOLIC
EQUATION (°C)
TMIN (°C)
TMAX (°C)
–55
130
VOUT = –11.79 mV/°C × T + 1.8528
±1.41
–40
110
VOUT = –11.77 mV/°C × T + 1.8577
±0.93
–30
100
VOUT = –11.77 mV/°C × T + 1.8605
±0.70
–40
85
VOUT = –11.67 mV/°C × T + 1.8583
±0.65
–10
65
VOUT = –11.71 mV/°C × T + 1.8641
±0.23
35
45
VOUT = –11.81 mV/°C × T + 1.8701
±0.004
20
30
VOUT = –11.69 mV/°C × T + 1.8663
±0.004
7.4 Device Functional Modes
The singular functional mode of the TMP20 is an analog output inversely proportional to temperature.
10
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
8.1.1 Output Drive and Capacitive Loads
When used in noisy environments, adding a capacitor from the output to ground with a series resistor filters the
TMP20 output; this configuration is shown in Figure 11. The TMP20 can drive up to 1 nF of load capacitance
while sourcing and sinking 600 μA. Under this condition, capacitive loads in the range of 1 nF to 10 μF require a
150-Ω series output resistor to achieve a stable temperature measurement. The output impedance of the TMP20
is typically 10 Ω when sinking currents and less than 1 Ω when sourcing current, as shown in Figure 1.
TMP20
MSP430
1 nF
R
(1)
TMP20
MSP430
C
(1)
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(1) A series resistor (R) may be required depending upon the amount of capacitance (C) and the amount of source and sink current drawn
from the output of the TMP20.
Figure 11. TMP20 Output Filtering
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8.2 Typical Application
V+ (1.8 V to 5.5 V)
MSP430
V+
TMP20
ADC
VOUT
CBP
CF
GND
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Figure 12. Suggested Connections to a MCU ADC
8.2.1 Design Requirements
ADCs that are found in microcontrollers (such as the MSP430 line of microcontrollers) take charge during the
sampling phase. A high sampling frequency results in too much charge pulled into the ADC and sags the output
voltage of the TMP20, which results in a reading that is hotter than normal. To mitigate this, place a capacitor
(CF) between the TMP20 and the ADC. The capacitor functions as a charge reservoir.
8.2.2 Detailed Design Procedure
The size of CF depends on the size of the internal sampling capacitor and the sampling frequency. The charge
requirements may vary because not all ADCs have identical input stages. This general ADC application is shown
as an example only.
8.2.3 Application Curves
Figure 13 shows the quiescent current versus temperature.
6
Quiescent Current (µA)
VS = 5.5 V
5
4
3
2
1
0
-75
-50
-25
0
25 50 75
Temperature (°C)
100 125 150
Figure 13. Quiescent Current vs Temperature
12
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9 Power Supply Recommendations
The low supply current and supply range of 1.8 V to 5.5 V enable the TMP20 to be powered from multiple supply
sources.
Power supply bypassing is optional and is typically dependent on the noise of the power supply. In noisy
systems, adding bypass capacitors may be necessary to decrease the noise that couples to the output of the
TMP20.
10 Layout
10.1 Layout Guidelines
The substrate on the TMP20AIDCK package is directly connected through conductive epoxy to the flag that
connects pin 2 on the lead frame. Consequently, pin 2 is the best lead for a conductive thermal connection to the
TMP20 die. The optimal electrical connection for this pin is ground (GND).
CAUTION
Do not attempt to connect pin 2 (DCK package) to any electrical potential other than
ground.
If it is not possible to connect pin 2 to ground, it is possible to electrically isolate this pin (that is, leave it floating).
Take care when electrically isolating this pin because any noise or electromagnetic interference or radio
frequency interference (EMI or RFI) spikes that couple in through this pin can cause erroneous temperature
results.
shows a proper layout of the TMP20 with correct electrical and thermal connections to pin 2.
10.2 Layout Example
Figure 14 shows a layout of the TMP20 with proper electrical and thermal connections to pin 2.
NC
GND
GND
NC
VOUT
V+
Figure 14. TMP20 Layout With Proper Electrical and Thermal Connections
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11 Device and Documentation Support
11.1 Device Support
11.1.1 TINA-TI (Free Download Software)
TINA is a simple, powerful, and easy-to-use circuit simulation program based on a SPICE engine. TINA-TI is a
free, fully functional version of the TINA software, preloaded with a library of macromodels in addition to a range
of passive and active models. It provides all the conventional dc, transient, and frequency domain analysis of
SPICE and additional design capabilities.
Available as a free download from the WEBENCH® Design Center, TINA-TI offers extensive post-processing
capability that allows users to format results in a variety of ways.
Virtual instruments offer users the ability to select input waveforms and probe circuit nodes, voltages, and
waveforms, creating a dynamic quick-start tool.
Figure 15 and Figure 16 show example TINA-TI circuits for the TMP20 that can develop, modify, and assess the
circuit design for specific applications. Links to download these simulation files are given below.
11.1.1.1 Using TINA-TI SPICE-Based Analog Simulation Program with the TMP20
NOTE
These files require that the TINA software (from DesignSoft) or TINA-TI software be
installed. Download the free TINA-TI software from the TINA-TI folder.
5.00
Trip Point = 80C
Analog Temperature Switch
3.75
Vtemp
VCC
Voltage (V)
4
+
TMP20 VOUT
GND
GND
2
5
3
1
V+
T
+ +
U1 TLV3021
REF
TEMP
1.25
R2 28.5k
V2 5
Vtrip = 80C
+
VCC
Vset
VCC
2.50
Vref
R1 10k
-
Vout
0.00
25.00 35.00
Vtrip
45.00 55.00 65.00 75.00 85.00 95.00 105.00 115.00 125.00
Input voltage (V)
Copyright © 2017, Texas Instruments Incorporated
Note:
The TMP20 TINA model is preliminary only.
Figure 15. Analog Temperature Switch
To download a compressed file that contains the TINA-TI simulation file for this circuit, visit the WEBENCH®
Design Center.
14
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Copyright © 2009–2018, Texas Instruments Incorporated
Product Folder Links: TMP20
TMP20
www.ti.com
SBOS466B – DECEMBER 2009 – REVISED DECEMBER 2018
Device Support (continued)
VTEMP
R5 100k
RG1 100k
Vref
VCC
4
RG3 100k
TEMP(C)
RF3 100k
6
1
4
5
En
A
A
Hot Plate 1
Isource
3
Out
+
5
En
+V
+V
VCC
8
TEC, Heat Sink, Object,
and TMP20 Mounting
7
RTflag1 10k
VTEMP
8
12
Vref
+
6
VCC
Vset
Vref
V2 1.4
+
V
7
_
U3 OPA569
T Flg
Isink
17
V-
Iset
Imon
I LimFlg
14
T1 TEC1
T Flg
19
VoA2
14
+
Rset2 4k
+
3
I LimFlg
Out
12
VCC
3
4
Imon
R9 10M
+
+
Tobject (C)
Cold Plate
6
R2 100k
R1 10M
Vset
4
U2 OPA569
-
+
Iset
5
U1 OPA333
R3 1M
V-
19
2
VCC
VoA1
2
_
VoA333
3
GND
5
Rmon2 200
17
TMP20 T
GND
R8 10M
R6 100M
VOUT
RFlag2 10k
C2 15.9n
RFlag1 10k
R7 31.6k
Rmon1 200
C3 2.5u
Rset1 4k
R4 100k
V+
V1 2.5
Cold Plate
Hot Plate
VCC
5
VM3
+
+
V
RTflag2 10k
V
VM1
VM2
Copyright © 2017, Texas Instruments Incorporated
(1)
The TMP20 TINA model is preliminary only.
(2)
Parameters and definitions:
a.
Tobject = Temperature of the object to be cooled (in °C)
b.
Vset = Voltage that corresponds to the desired output temperature from the TMP20
c.
VTEMP = Voltage output of the TMP20
d.
Hotplate = TEC plate on opposite side of object
e.
Coldplate = TEC plate in contact with object
(3)
In this configuration, the TEC driver can cool to –T°C and heating to 41°C; the Vset range is 1.38 V to 1.95 V. The
OPA569 device outputs = ±1.65 A, ±0.5 V to ±4.5 V. The 10-MΩ resistors are for TINA convergence.
(4)
For convergence in TINA software: In Analysis/Set Analysis Parameters menu, set shunt conductance = 1 p.
Figure 16. Thermoelectric Cooler
To download a compressed file that contains the TINA-TI simulation file for this circuit, see Thermoelectric
Cooler.
Submit Documentation Feedback
Copyright © 2009–2018, Texas Instruments Incorporated
Product Folder Links: TMP20
15
TMP20
SBOS466B – DECEMBER 2009 – REVISED DECEMBER 2018
www.ti.com
Device Support (continued)
11.1.2 Development Support
WEBENCH® Design Center
TINA-TI folder
Analog Temperature Switch
Thermoelectric Cooler
11.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
11.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
16
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Copyright © 2009–2018, Texas Instruments Incorporated
Product Folder Links: TMP20
TMP20
www.ti.com
SBOS466B – DECEMBER 2009 – REVISED DECEMBER 2018
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Submit Documentation Feedback
Copyright © 2009–2018, Texas Instruments Incorporated
Product Folder Links: TMP20
17
PACKAGE OPTION ADDENDUM
www.ti.com
22-Dec-2018
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TMP20AIDCKR
ACTIVE
SC70
DCK
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
Level-1-260C-UNLIM
-55 to 125
ODB
TMP20AIDCKT
ACTIVE
SC70
DCK
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
Level-1-260C-UNLIM
-55 to 125
ODB
TMP20AIDRLR
ACTIVE
SOT-5X3
DRL
6
4000
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
Level-1-260C-UNLIM
-55 to 125
ODA
TMP20AIDRLT
ACTIVE
SOT-5X3
DRL
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
Level-1-260C-UNLIM
-55 to 125
ODA
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
22-Dec-2018
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Nov-2018
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
TMP20AIDCKR
SC70
DCK
5
3000
180.0
8.4
2.47
2.3
1.25
4.0
8.0
Q3
TMP20AIDCKR
SC70
DCK
5
3000
178.0
9.0
2.4
2.5
1.2
4.0
8.0
Q3
TMP20AIDCKT
SC70
DCK
5
250
178.0
9.0
2.4
2.5
1.2
4.0
8.0
Q3
TMP20AIDCKT
SC70
DCK
5
250
180.0
8.4
2.47
2.3
1.25
4.0
8.0
Q3
TMP20AIDRLR
SOT-5X3
DRL
6
4000
180.0
9.5
1.78
1.78
0.69
4.0
8.0
Q3
TMP20AIDRLR
SOT-5X3
DRL
6
4000
180.0
8.4
1.98
1.78
0.69
4.0
8.0
Q3
TMP20AIDRLT
SOT-5X3
DRL
6
250
180.0
8.4
1.98
1.78
0.69
4.0
8.0
Q3
TMP20AIDRLT
SOT-5X3
DRL
6
250
180.0
9.5
1.78
1.78
0.69
4.0
8.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Nov-2018
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TMP20AIDCKR
SC70
DCK
5
3000
202.0
201.0
28.0
TMP20AIDCKR
SC70
DCK
5
3000
180.0
180.0
18.0
TMP20AIDCKT
SC70
DCK
5
250
180.0
180.0
18.0
TMP20AIDCKT
SC70
DCK
5
250
202.0
201.0
28.0
TMP20AIDRLR
SOT-5X3
DRL
6
4000
184.0
184.0
19.0
TMP20AIDRLR
SOT-5X3
DRL
6
4000
202.0
201.0
28.0
TMP20AIDRLT
SOT-5X3
DRL
6
250
202.0
201.0
28.0
TMP20AIDRLT
SOT-5X3
DRL
6
250
184.0
184.0
19.0
Pack Materials-Page 2
PACKAGE OUTLINE
DRL0006A
SOT - 0.6 mm max height
SCALE 8.000
PLASTIC SMALL OUTLINE
1.7
1.5
PIN 1
ID AREA
1
A
6
4X 0.5
1.7
1.5
NOTE 3
2X 1
4
3
B
1.3
1.1
6X
0.3
0.1
0.6 MAX
0.05
TYP
0.00
C
SEATING PLANE
6X
0.18
0.08
0.05 C
SYMM
SYMM
6X
6X
0.4
0.2
0.27
0.15
0.1
0.05
C A B
4223266/A 09/2016
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
www.ti.com
EXAMPLE BOARD LAYOUT
DRL0006A
SOT - 0.6 mm max height
PLASTIC SMALL OUTLINE
6X (0.67)
SYMM
1
6
6X (0.3)
SYMM
4X (0.5)
4
3
(R0.05) TYP
(1.48)
LAND PATTERN EXAMPLE
SCALE:30X
0.05 MIN
AROUND
0.05 MAX
AROUND
SOLDER MASK
OPENING
METAL
METAL UNDER
SOLDER MASK
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
OPENING
SOLDER MASK
DEFINED
SOLDERMASK DETAILS
4223266/A 09/2016
NOTES: (continued)
4. Publication IPC-7351 may have alternate designs.
5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DRL0006A
SOT - 0.6 mm max height
PLASTIC SMALL OUTLINE
6X (0.67)
SYMM
1
6
6X (0.3)
SYMM
4X (0.5)
4
3
(R0.05) TYP
(1.48)
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE:30X
4223266/A 09/2016
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
www.ti.com
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IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
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