Texas Instruments | HDC1010 Low Power, High Accuracy Digital Humidity Sensor with Temperature Sensor (Rev. A) | Datasheet | Texas Instruments HDC1010 Low Power, High Accuracy Digital Humidity Sensor with Temperature Sensor (Rev. A) Datasheet

Texas Instruments HDC1010 Low Power, High Accuracy Digital Humidity Sensor with Temperature Sensor (Rev. A) Datasheet
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HDC1010
SNAS685A – MAY 2016 – REVISED AUGUST 2016
HDC1010 Low Power, High Accuracy Digital Humidity Sensor with Temperature Sensor
1 Features
3 Description
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•
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The HDC1010 is a digital humidity sensor with
integrated temperature sensor that provides excellent
measurement accuracy at very low power. The
HDC1010 operates over a wide supply range, and is
a low cost, low power alternative to competitive
solutions in a wide range of common applications.
The innovative WLCSP (Wafer Level Chip Scale
Package) simplifies board design with the use of an
ultra-compact package. The sensing element of the
HDC1010 is placed on the bottom part of the device,
which makes the HDC1010 more robust against dirt,
dust, and other environmental contaminants. The
humidity and temperature sensors are factory
calibrated and the calibration data is stored in the onchip non-volatile memory.
1
•
•
•
Relative Humidity Accuracy ±2% (typical)
Temperature Accuracy ±0.2°C (typical)
Excellent Stability at High Humidity
14 Bit Measurement Resolution
100 nA Sleep Mode Current
Average Supply Current:
– 710 nA @ 1 sps, 11 bit RH Measurement
– 1.3 µA @ 1 sps, 11 bit RH and Temperature
Measurement
Supply Voltage 2.7 V to 5.5 V
Tiny 2 mm x 1.6 mm Device Footprint
I2C Interface
Device Information
2 Applications
•
•
•
•
•
•
•
PART NUMBER
HVAC
IoT Smart Thermostats and Room Monitors
Refrigerators
Printers
White Goods
Medical Devices
Wireless Sensor (TIDA: 00374, 00484, 00524)
HDC1010
PACKAGE
(1)
BODY SIZE (NOM)
DSBGA (8-bump)
2.04 mm x 1.59 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
4 Typical Application
3.3 V
RH
HDC1010
ADC
TEMPERATURE
3.3 V
3.3 V
VDD
Registers
and
Logic
2
IC
SDA
SCL
DRDYn
ADR0
ADR1
MCU
VDD
2
IC
Peripheral
GPIO
OTP
Calibration Coefficients
GND
GND
Copyright © 2016, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
HDC1010
SNAS685A – MAY 2016 – REVISED AUGUST 2016
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Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Typical Application ................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
1
2
3
4
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
4
4
4
4
5
6
6
7
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
I2C Interface Electrical Characteristics .....................
I2C Interface Timing Requirements ........................
Typical Characteristics ..............................................
Detailed Description .............................................. 9
8.1 Overview ................................................................... 9
8.2 Functional Block Diagram ......................................... 9
8.3 Feature Description................................................... 9
8.4 Device Functional Modes.......................................... 9
8.5 Programming........................................................... 10
8.6 Register Map .......................................................... 14
9
Application and Implementation ........................ 17
9.1 Application Information............................................ 17
9.2 Typical Application ................................................. 17
9.3 Do's and Don'ts ...................................................... 18
10 Power Supply Recommendations ..................... 19
11 Layout................................................................... 19
11.1 Layout Guidelines ................................................. 19
11.2 Layout Example .................................................... 21
12 Device and Documentation Support ................. 22
12.1
12.2
12.3
12.4
12.5
12.6
Documentation Support ........................................
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
22
22
22
22
22
22
13 Mechanical, Packaging, and Orderable
Information ........................................................... 22
5 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (May 2016) to Revision A
•
2
Page
Changed Product Preview to Production Data ...................................................................................................................... 1
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6 Pin Configuration and Functions
WLCSP (DSBGA)
8 Pin YPA
Top View
A2
B1
B2
C1
D1
RH
SENSOR
A1
C2
D2
Pin Functions
PIN
I/O TYPE (1)
DESCRIPTION
NAME
NO.
SCL
A1
I
Serial clock line for I2C, open-drain; requires a pull-up resistor to VDD
VDD
B1
P
Supply Voltage
ADR0
C1
I
Address select pin – hardwired to GND or VDD
ADR1
D1
I
Address select pin – hardwired to GND or VDD
SDA
A2
I/O
Serial data line for I2C, open-drain; requires a pull-up resistor to VDD
GND
B2
G
Ground
DNC
C2
-
Do not connect, or, may be connected to GND.
DRDYn
D2
O
Data ready, active low, open-drain. Requires a pull-up resistor to VDD. If not used tie to
GND.
(1)
P=Power, G=Ground, I=Input, O=Output
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7 Specifications
7.1 Absolute Maximum Ratings (1)
Input Voltage
Storage Temperature
(1)
MIN
MAX
VDD
-0.3
6
UNIT
SCL
-0.3
6
SDA
-0.3
6
DRDYn
-0.3
6
ADR0
-0.3
VDD+0.3
ADR1
-0.3
VDD+0.3
TSTG
-65
150
V
°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
pins (1)
±1000
Charged device model (CDM), per JEDEC specification –500 500
JESD22-C101, all pins (2)
±250
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating range (unless otherwise noted)
MIN
NOM
3
MAX
UNIT
VDD
Supply Voltage
2.7
5.5
V
TA, Temperature Sensor
Ambient Operating Temperature
-40
125
°C
TA, Humidity Sensor (1)
Ambient Operating Temperature
-20
70
°C
Functional Operating Temperature
-20
85
°C
TA, Humidity sensor
(1)
(1)
See Figure 2
7.4 Thermal Information
HDC1010
THERMAL METRIC (1)
DSBGA -YPA
UNIT
8 PINS
RθJA
Junction-to-ambient thermal resistance
98.0
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
0.8
°C/W
RθJB
Junction-to-board thermal resistance
17.8
°C/W
ψJT
Junction-to-top characterization parameter
3.7
°C/W
ψJB
Junction-to-board characterization parameter
17.8
°C/W
(1)
4
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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7.5 Electrical Characteristics (1)
The electrical ratings specified in this section apply to all specifications in this document, unless otherwise noted. TA = 30°C,
VDD = 3V, and RH = 40%.
TEST CONDITION (2)
TYP (4)
MAX (3)
RH measurement, bit 12 of 0x02 register =
0 (5)
190
220
µA
Temperature measurement, bit 12 of 0x02
register = 0 (5)
160
185
µA
Sleep Mode
100
200
nA
Average @ 1 measurement/second, RH (11
bit), bit 12 of 0x02 register = 0 (5) (6)
710
nA
Average @ 1 measurement/second, Temp
(11 bit), bit 12 of 0x02 register = 0 (5) (6)
590
nA
Average @ 1 measurement/second, RH
(11bit) +temperature (11 bit), bit 12 of 0x02
register = 1 (5) (6)
1.3
µA
Startup (average on Start-up time)
300
µA
Peak current
7.2
mA
Average @ 1 measurement/second, RH
(11bit) +temperature (11 bit), bit 12 of 0x02
register = 1 (5) (6)
50
µA
Refer to Figure 2 in Typical Characteristics
section.
±2
%RH
±0.1
%RH
±1
%RH
PARAMETER
MIN (3)
UNIT
POWER CONSUMPTION
IDD
IHEAT
Supply Current
Heater Current (7)
RELATIVE HUMIDITY SENSOR
RHACC
Accuracy
RHREP
Repeatability (7)
RHHYS
Hysteresis
14 bit resolution.
(8)
10% ≤ RH ≤ 70%
(9)
RHRT
Response Time
RHCT
Conversion Time (7)
t 63%
(10)
15
2.50
ms
11 bit resolution
3.85
ms
14 bit resolution
RHHOR
Operating Range (11)
RHLTD
Long Term Drift (12)
s
8 bit resolution
Non-condensing
6.50
0
ms
100
±0.25
%RH
%RH/yr
TEMPERATURE SENSOR
TEMPACC
Accuracy (7)
5°C < TA< 60°C
±0.2
TEMPREP
Repeatability (7)
14 bit accuracy
±0.1
°C
TEMPCT
Conversion Time (7)
11 bit accuracy
3.65
ms
14 bit accuracy
6.35
ms
±0.4
°C
(1)
Electrical Characteristics Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions
result in very limited self-heating of the device such that TJ = TA. No guarantee of parametric performance is indicated in the electrical
tables under conditions of internal self-heating where TJ > TA. Absolute Maximum Ratings indicate junction temperature limits beyond
which the device may be permanently degraded, either mechanically or electrically.
(2) Register values are represented as either binary (b is the prefix to the digits), or hexadecimal (0x is the prefix to the digits). Decimal
values have no prefix.
(3) Limits are ensured by testing, design, or statistical analysis at 30°C. Limits over the operating temperature range are ensured through
correlations using statistical quality control (SQC) method.
(4) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested and are not guaranteed on
shipped production material.
(5) I2C read/write communication and pull-up resistors current through SCL and SDA not included.
(6) Average current consumption while conversion is in progress.
(7) This parameter is specified by design and/or characterization and it is not tested in production.
(8) The hysteresis value is the difference between an RH measurement in a rising and falling RH environment, at a specific RH point.
(9) Actual response times will vary dependent on system thermal mass and air-flow.
(10) Time for the RH output to change by 63% of the total RH change after a step change in environmental humidity.
(11) Recommended humidity operating range is 10% to 70% RH. Prolonged operation outside this range may result in a measurement
offset. The measurement offset will decrease after operating the sensor in this recommended operating range.
(12) Drift due to aging effects at typical conditions (30°C and 20% to 50% RH). This value may be impacted by dust, vaporized solvents, outgassing tapes, adhesives, packaging materials, etc.
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Electrical Characteristics(1) (continued)
The electrical ratings specified in this section apply to all specifications in this document, unless otherwise noted. TA = 30°C,
VDD = 3V, and RH = 40%.
TEST CONDITION (2)
PARAMETER
TEMPOR
MIN (3)
Operating Range
TYP (4)
-40
MAX (3)
125
UNIT
°C
7.6 I2C Interface Electrical Characteristics
At TA=30°C, VDD=3V (unless otherwise noted)
PARAMETER
TEST CONDITION
MIN
TYP
MAX
UNIT
I2C INTERFACE VOLTAGE LEVEL
VIH
Input High Voltage
VIL
Input Low Voltage
VOL
Output Low Voltage
HYS
Hysteresis
CIN
Input Capacitance on all digital pins
(1)
0.7xVDD
V
Sink current 3mA
(1)
0.3xVDD
V
0.4
V
0.1xVDD
V
0.5
pF
This parameter is specified by design and/or characterization and it is not tested in production.
7.7
I2C Interface Timing Requirements
PARAMETER
TEST CONDITION
MIN
TYP
MAX
UNIT
400
kHz
I2C INTERFACE VOLTAGE LEVEL
fSCL
Clock Frequency
10
tLOW
Clock Low Time
1.3
tHIGH
Clock High Time
0.6
tSP
Pulse width of spikes that must be
suppressed by the input filter (1)
tSTART
Device Start-up time
(1)
(2)
µs
µs
From VDD ≥ 2.7 V to ready for a
conversion (1) (2)
10
50
ns
15
ms
This parameter is specified by design and/or characterization and it is not tested in production.
Within this interval it is not possible to communicate to the device.
SDA
tLOW
tSP
SCL
tHIGH
START
REPEATED
START
STOP
START
Figure 1. I2C Timing
6
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7.8 Typical Characteristics
Unless otherwise noted. TA = 30°C, VDD = 3V.
1
10
Typical
9
0.9
8
0.8
7
0.7
Accuracy (r°C)
Accuracy (r%RH)
Typical
6
5
4
0.6
0.5
0.4
3
0.3
2
0.2
1
0.1
0
-40
0
0
10
20
30
40
50
60
70
80
90
100
-25
-10
5
20
35
50
65
80
95
110
125
Temp (°C)
RH (%RH)
Figure 2. RH Accuracy vs. RH
Figure 3. Temperature Accuracy vs. Temperature
300
300
T= -20°C
T= 25°C
T= 40°C
T= 85°C
T= 125°C
250
250
225
225
200
200
175
175
150
150
125
125
100
2.7
Vdd=2.7V
Vdd=3V
Vdd=3.3V
Vdd=5V
275
Idd (PA)
Idd (PA)
275
100
3
3.3
3.6
3.9
4.2
4.5
4.8
5
0
25
50
Vdd (V)
Figure 4. Supply Current vs. Supply Voltage, RH
Measurement
Vdd=2.7V
Vdd=3V
Vdd=3.3V
Vdd=5V
275
250
225
225
Idd (PA)
Idd (PA)
125
300
T= -20°C
T= 25°C
T= 40°C
T= 85°C
T= 125°C
250
200
200
175
175
150
150
125
125
100
2.7
100
Figure 5. Supply Current vs. Temperature, RH Measurement
300
275
75
Temp (°C)
100
3
3.3
3.6
3.9
4.2
4.5
4.8
5
0
25
Vdd (V)
50
75
100
125
Temp (°C)
Figure 6. Supply Current vs. Supply Voltage, Temp
Measurement
Figure 7. Supply Current vs. Temperature, Temp
Measurement
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Typical Characteristics (continued)
Unless otherwise noted. TA = 30°C, VDD = 3V.
1200
1000
1200
T= -20°C
T= 25°C
T= 40°C
T= 85°C
T= 125°C
1000
8
800
Idd (nA)
Idd (nA)
800
600
600
400
400
200
200
0
2.7
Vdd=2.7V
Vdd=3V
Vdd=3.3V
Vdd=5V
0
3
3.3
3.6
3.9
4.2
4.5
4.8
5
0
25
50
75
100
125
Vdd (V)
Temp (°C)
Figure 8. Supply Current vs. Supply Voltage, Sleep Mode
Figure 9. Supply Current vs. Temperature, Sleep Mode
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8 Detailed Description
8.1 Overview
The HDC1010 is a digital humidity sensor with integrated temperature sensor that provides excellent
measurement accuracy at very low power. The sensing element of the HDC1010 is placed on the bottom part of
the device, which makes the HDC1010 more robust against dirt, dust, and other environmental contaminants.
Measurement results can be read out through the I2C compatible interface. Resolution is based on the
measurement time and can be 8, 11, or 14 bits for humidity; 11 or 14 bits for temperature.
8.2 Functional Block Diagram
RH
HDC1010
ADC
TEMPERATURE
VDD
Registers
and
Logic
SDA
SCL
DRDYn
ADR0
ADR1
I2C
OTP
Calibration Coefficients
GND
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8.3 Feature Description
8.3.1 Power Consumption
One of the key features of the HDC1010 is its low power consumption, which makes the device suitable in
battery or power harvesting applications. In these applications the HDC1010 spends most of the time in sleep
mode: with a typical 100nA of current consumption in sleep mode, the averaged current consumption is minimal.
Its low consumption in measurement mode minimizes any self-heating.
8.3.2 Voltage Supply Monitoring
The HDC1010 monitors the supply voltage level and indicates when the voltage supply of the HDC1010 is less
than 2.8V. This information is useful in battery-powered systems in order to inform the user to replace the
battery. This is reported in the BTST field (register address 0x02:bit[11]) which is updated after power-on reset
(POR) and after each measurement request.
8.3.3 Heater
The heater is an integrated resistive element that can be used to test the sensor or to drive condensation off the
sensor. The heater can be activated using HEAT, bit 13 in Configuration Register. The heater helps in reducing
the accumulated offset after long exposure at high humidity conditions.
Once enabled the heater is turned on only in the measurement mode. To have a reasonable increase of the
temperature it is suggested to increase the measurement data rate.
8.4 Device Functional Modes
The HDC1010 has two modes of operation: sleep mode and measurement mode. After power up, the HDC1010
is in sleep mode. In this mode, the HDC1010 waits for I2C input including commands to configure the conversion
times, read the status of the battery, trigger a measurement, and read measurements. Once it receives a
command to trigger a measurement, the HDC1010 moves from sleep mode to measurement mode. In
measurement mode, the HDC1010 acquires the configured measurements and sets the DRDYn line low when
the measurement is complete. After completing the measurement and setting DRDYn low, the HDC1010 returns
to sleep mode.
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8.5 Programming
8.5.1 I2C Serial Bus Address Configuration
To communicate with the HDC1010, the master must first address slave devices via a slave address byte. The
slave address byte consists of seven address bits and a direction bit that indicates the intent to execute a read or
write operation. The HDC1010 features two address pins to allow up to 4 devices to be addressed on a single
bus. Table 1 describes the pin logic levels used to properly connect up to 4 devices. The state of the ADR0 and
ADR1 pins is sampled on every bus communication and should be set before any activity on the interface
occurs. The address pin is read at the start of each communication event.
Table 1. HDC1010 ADDRESS
ADR1
ADR0
ADDRESS (7-bit address)
0
0
1000000
0
1
1000001
1
0
1000010
1
1
1000011
8.5.2 I2C Interface
The HDC1010 operates only as a slave device on the I2C bus interface. It is not allowed to have on the I2C bus
multiple devices with the same address. Connection to the bus is made via the open-drain I/O lines, SDA, and
SCL. The SDA and SCL pins feature integrated spike-suppression filters and Schmitt triggers to minimize the
effects of input spikes and bus noise. After power-up, the sensor needs at most 15 ms, to be ready to start RH
and temperature measurement. During this power-up time the HDC1010 is only able to provide the content of the
serial number registers (0xFB to 0xFF) if requested. After the power-up the sensor is in the sleep mode until a
communication or measurement is performed. All data bytes are transmitted MSB first.
8.5.2.1 Serial Bus Address
To communicate with the HDC1010, the master must first address slave devices via a slave address byte. The
slave address byte consists of seven address bits, and a direction bit that indicates the intent to execute a read
or write operation.
8.5.2.2 Read and Write Operations
To access a particular register on the HDC1010, write the desired register address value to the Pointer Register.
The pointer value is the first byte transferred after the slave address byte with the R/W bit low. Every write
operation to the HDC1010 requires a value for the pointer register (refer to Figure 10).
When reading from the HDC1010, the last value stored in the pointer by a write operation is used to determine
which register is read by a read operation. To change the pointer register for a read operation, a new value must
be written to the pointer. This transaction is accomplished by issuing the slave address byte with the R/W bit low,
followed by the pointer byte. No additional data is required (refer to Figure 11).
The master can then generate a START condition and send the slave address byte with the R/W bit high to
initiate the read command. Note that register bytes are sent MSB first, followed by the LSB. A write operation in
a read-only register such as (DEVICE ID, MANUFACTURER ID, SERIAL ID) returns a NACK after each data
byte; read/write operation to unused address returns a NACK after the pointer; a read/write operation with
incorrect I2C address returns a NACK after the I2C address.
10
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1
9
1
9
SCL
SDA
A6
A5
A4
A3
A2
A1
A0
P7
R/W
Start by
Master
P6
P5
P4
P3
P2
P1
P0
Ack by
Slave
Ack by
Slave
Frame 1
7-bit Serial Bus Address Byte
Frame 2
Pointer Register Byte
1
9
1
9
SCL
D15
SDA
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
Ack by
Slave
Ack by
Slave
Frame 3
Data MSB from
MASTER
Stop by
Master
Frame 4
Data LSB from
MASTER
Figure 10. Writing Frame (Configuration Register)
1
9
1
9
SCL
SDA
A6
A5
A4
A3
A2
A1
A0 R/W
Start by
Master
P7
P6
P5
P4
P3
P2
P1
P0
Ack by
Slave
Ack by
Slave
Frame 1
Frame 2
7-bit Serial Bus Address Byte
Pointer Register Byte
1
9
1
9
1
9
SCL
A6
SDA
A5
A4
A3
A2
A1
D15 D14 D13 D12 D11 D10
A0 R/W
Start by
Master
D9
D8
Ack by
Slave
D7
D6
D5
D4
D3
D2
Frame 3
D0
Nack by Stop by
Master Master
Ack by
Master
Frame 4
Data MSB from
Slave
7-bit Serial Bus Address Byte
D1
Frame 5
Data LSB from
Slave
Figure 11. Reading Frame (Configuration Register)
8.5.2.3 Device Measurement Configuration
By default the HDC1010 will first perform a temperature measurement followed by a humidity measurement. On
power-up, the HDC1010 enters a low power sleep mode and is not actively measuring. Use the following steps
to perform a measurement of both temperature and humidity and then retrieve the results:
1. Configure the acquisition parameters in register address 0x02:
(a) Set the acquisition mode to measure both temperature and humidity by setting Bit[12] to 1.
(b) Set the desired temperature measurement resolution:
– Set Bit[10] to 0 for 14 bit resolution.
– Set Bit[10] to 1 for 11 bit resolution.
(c) Set the desired humidity measurement resolution:
– Set Bit[9:8] to 00 for 14 bit resolution.
– Set Bit[9:8] to 01 for 11 bit resolution.
– Set Bit[9:8] to 10 for 8 bit resolution.
2. Trigger the measurements by executing a pointer write transaction with the address pointer set to 0x00.
Refer to Figure 12.
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3. Wait for the measurements to complete, based on the conversion time (refer to Electrical Characteristics (1)
for the conversion time). Alternatively, wait for the assertion of DRDYn.
4. Read the output data:
Read the temperature data from register address 0x00, followed by the humidity data from register address
0x01 in a single transaction as shown in Figure 14. A read operation will return a NACK if the contents of the
registers have not been updated as shown in Figure 13.
To perform another acquisition with the same measurement configuration simply repeat steps 2 through 4.
If only a humidity or temperature measurement is desired, the following steps will perform a measurement and
retrieve the result:
1. Configure the acquisition parameters in register address 0x02:
(a) Set the acquisition mode to independently measure temperature or humidity by setting Bit[12] to 0.
(b) For a temperature measurement, set the desired temperature measurement resolution:
– Set Bit[10] to 0 for 14 bit resolution.
– Set Bit[10] to 1 for 11 bit resolution.
(c) For a humidity measurement, set the desired humidity measurement resolution:
– Set Bit[9:8] to 00 for 14 bit resolution.
– Set Bit[9:8] to 01 for 11 bit resolution.
– Set Bit[9:8] to 10 for 8 bit resolution.
2. Trigger the measurement by executing a pointer write transaction. Refer to Figure 12
– Set the address pointer to 0x00 for a temperature measurement.
– Set the address pointer to 0x01 for a humidity measurement.
3. Wait for the measurement to complete, based on the conversion time (refer to Electrical Characteristics (1) for
the conversion time). Alternatively, wait for the assertion of DRDYn.
4. Read the output data:
Retrieve the completed measurement result from register address 0x00 or 0x01, as appropriate, as shown in
Figure 10. A read operation will return a NACK if the measurement result is not yet available, as shown in
Figure 13.
To perform another acquisition with the same measurement configuration repeat steps 2 through 4.
It is possible to read the output registers (addresses 0x00 and 0x01) during an Temperature or Relative Humidity
measurement without affecting any ongoing measurement. Note that a write to address 0x00 or 0x01 while a
measurement is ongoing will abort the ongoing measurement. If the newest acquired measurement is not read,
DRDYn stays low until the next measurement is triggered.
1
9
1
9
SCL
SDA
A6
A5
A4
A3
A2
A1
A0 R/W
Start by
Master
P7
P6
P5
P4
P3
P2
P1
P0
Ack by
Slave
Ack by
Slave
Frame 1
Frame 2
7-bit Serial Bus Address Byte
Pointer Register Byte
Figure 12. Trigger Humidity/Temperature Measurement
(1)
12
Electrical Characteristics Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions
result in very limited self-heating of the device such that TJ = TA. No guarantee of parametric performance is indicated in the electrical
tables under conditions of internal self-heating where TJ > TA. Absolute Maximum Ratings indicate junction temperature limits beyond
which the device may be permanently degraded, either mechanically or electrically.
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1
9
SCL
A6
SDA
A5
A4
A3
A2
A1
A0 R/W
Start by
Master
Nack by
Slave
Frame 3
7-bit Serial Bus Address Byte
Figure 13. Read Humidity/Temperature Measurement (Data Not Ready)
1
1
9
9
1
9
SCL
A6
SDA
A5
A4
A3
A2
A1
D15 D14 D13 D12 D11 D10
A0 R/W
Start by
Master
D9
D8
Ack by
Slave
D7
D6
Frame 3
7-bit Serial Bus Address Byte
9
D4
D3
D2
D1
D0
Ack by
Master
Ack by
Master
Frame 4
Data MSB from
Slave
1
D5
Frame 5
Data LSB from
Slave
1
9
SCL
SDA
D15 D14 D13 D12 D11 D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
Frame 6
Data MSB from
Slave
D0
Nack by Stop by
Master Master
Ack by
Master
Frame 7
Data LSB from
Slave
Figure 14. Read Humidity and Temperature Measurement (Data Ready)
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8.6 Register Map
The HDC1010 contains data registers that hold configuration information, temperature and humidity
measurement results, and status information.
Table 2. Register Map
Pointer
Name
Reset value
Description
0x00
Temperature
0x0000
Temperature measurement output
0x01
Humidity
0x0000
Relative Humidity measurement output
0x02
Configuration
0x1000
HDC1010 configuration and status
0xFB
Serial ID
device dependent
First 2 bytes of the serial ID of the part
0xFC
Serial ID
device dependent
Mid 2 bytes of the serial ID of the part
0xFD
Serial ID
device dependent
Last byte bit of the serial ID of the part
0xFE
Manufacturer ID
0x5449
ID of Texas Instruments
0xFF
Device ID
0x1000
ID of HDC1010 device
Registers from 0x03 to 0xFA are reserved and should not be written.
The HDC1010 has an 8-bit pointer used to address a given data register. The pointer identifies which of the data
registers should respond to a read or write command on the two-wire bus. This register is set with every write
command. A write command must be issued to set the proper value in the pointer before executing a read
command. The power-on reset (POR) value of the pointer is 0x00, which selects a temperature measurement.
8.6.1 Temperature Register
The temperature register is a 16-bit result register in binary format (the 2 LSBs D1 and D0 are always 0). The
result of the acquisition is always a 14 bit value. The accuracy of the result is related to the selected conversion
time (refer to Electrical Characteristics (1)). The temperature can be calculated from the output data with:
§ TEMPERATURE>15:00@ ·
Temperature(qC) ¨
¸ *165qC - 40qC
216
©
¹
Table 3. Temperature Register Description (0x00)
Name
Registers
TEMPERATURE
(1)
Description
[15:02]
Temperature
Temperature measurement (read only)
[01:00]
Reserved
Reserved, always 0 (read only)
Electrical Characteristics Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions
result in very limited self-heating of the device such that TJ = TA. No guarantee of parametric performance is indicated in the electrical
tables under conditions of internal self-heating where TJ > TA. Absolute Maximum Ratings indicate junction temperature limits beyond
which the device may be permanently degraded, either mechanically or electrically.
8.6.2 Humidity Register
The humidity register is a 16-bit result register in binary format (the 2 LSBs D1 and D0 are always 0). The result
of the acquisition is always a 14 bit value, while the accuracy is related to the selected conversion time (refer to
Electrical Characteristics (1)). The humidity can be calculated from the output data with:
§ HUMIDITY >15 :00 @ ·
Relative Humidity(% RH) ¨
¸ *100%RH
216
©
¹
Table 4. Humidity Register Description (0x01)
Name
Registers
HUMIDITY
(1)
14
Description
[15:02]
Relative
Humidity
Relative Humidity measurement (read only)
[01:00]
Reserved
Reserved, always 0 (read only)
Electrical Characteristics Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions
result in very limited self-heating of the device such that TJ = TA. No guarantee of parametric performance is indicated in the electrical
tables under conditions of internal self-heating where TJ > TA. Absolute Maximum Ratings indicate junction temperature limits beyond
which the device may be permanently degraded, either mechanically or electrically.
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8.6.3 Configuration Register
This register configures device functionality and returns status.
Table 5. Configuration Register Description (0x02)
NAME
RST
REGISTERS
[15]
DESCRIPTION
Software reset
bit
0
Normal Operation, this bit self clears
1
Software Reset
Reserved
[14]
Reserved
0
Reserved, must be 0
HEAT
[13]
Heater
0
Heater Disabled
1
Heater Enabled
MODE
[12]
Mode of
acquisition
0
Temperature or Humidity is acquired.
1
Temperature and Humidity are acquired in sequence, Temperature first.
BTST
[11]
Battery Status
0
Battery voltage > 2.8V (read only)
1
Battery voltage < 2.8V (read only)
Temperature
Measurement
Resolution
0
14 bit
1
11 bit
Humidity
Measurement
Resolution
00
14 bit
01
11 bit
10
8 bit
0
Reserved, must be 0
TRES
HRES
Reserved
[10]
[9:8]
[7:0]
Reserved
8.6.4 Serial Number Registers
These registers contain a 40bit unique serial number for each individual HDC1010.
Table 6. Serial Number Register Description (0xFB)
Name
SERIAL ID[40:25]
Registers
[15:0]
Description
Serial Id bits
Device Serial Number bits from 40 to 25 (read only)
Table 7. Serial Number Register Description (0xFC)
Name
SERIAL ID[24:9]
Registers
[15:0]
Description
Serial Id bits
Device Serial Number bits from 24 to 9 (read only)
Table 8. Serial Number Register Description (0xFD)
Name
SERIAL ID[8:0]
Registers
Description
[15:7]
Serial Id bits
Device Serial Number bits from 8 to 0 (read only)
[6:0]
Reserved
Reserved, always 0 (read only)
8.6.5 Manufacturer ID Register
This register contains a factory-programmable identification value that identifies this device as being
manufactured by Texas Instruments. This register distinguishes this device from other devices that are on the
same I2C bus. The manufacturer ID reads 0x5449.
Table 9. Manufacturer ID Register Description (0xFE)
Name
MANUFACTURER
ID
Registers
[15:0]
Description
Manufacturer
ID
0x5449
Texas instruments ID (read only)
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8.6.6 Device Register ID
This register contains a factory-programmable identification value that identifies this device as a HDC1010. This
register distinguishes this device from other devices that are on the same I2C bus. The Device ID for the
HDC1010 is 0x1000.
Table 10. Device ID Register Description (0xFF)
Name
Registers
DEVICE ID
16
[15:0]
Description
Device ID
0x1000
HDC1010 Device ID (read only)
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
An HVAC system thermostat control is based on environmental sensors and a micro-controller. The microcontroller acquires data from humidity sensors and temperature sensors and controls the heating/cooling system.
The collected data are then showed on a display that can be easily controlled by the micro controller. Based on
data from the humidity and temperature sensor, the heating/cooling system then maintains the environment at
customer-defined preferred conditions.
9.2 Typical Application
In a battery-powered HVAC system thermostat, one of the key parameters in the selection of components is the
power consumption. The HDC1010, with its 1.3μA of current consumption (average consumption over 1s for RH
and Temperature measurements) in conjunction with an MSP430 represents an excellent choice for the low
power consumption, which extends the battery life. A system block diagram of a battery powered HVAC or
Thermostat is shown in Figure 15.
DISPLAY
Temp 29°C
RH 40%
-
Lithium
ion battery
+
TPL5110
TIME xx:xx
Date xx/xx/xxxx
EN/
ONE_SHOT
DRV
DELAY/
M_DRIVE
DONE
GND
VDD
RH
KEYBOARD
VDD
HDC1010
Registers
and
Logic
ADC
TEMPERATURE
I 2C
SDA
SCL
DRDYn
ADR0
ADR1
OTP
Calibration Coefficients
GND
VDD
MCU
Button
I2C
Peripheral
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GND
Button
Button
To Air
Conditioning
System
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Figure 15. Typical Application Schematic HVAC
9.2.1 Design Requirements
In order to correctly sense the ambient temperature and humidity, the HDC1010 should be positioned away from
heat sources on the PCB. Generally, it should not be close to the LCD and battery. Moreover, to minimize any
self-heating of the HDC1010 it is recommended to acquire at a maximum sample rate of 1sps (RH + Temp). In
home systems, humidity and the temperature monitoring rates of less than 1sps (even 0.5sps or 0.2sps) can be
still effective.
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Typical Application (continued)
9.2.2 Detailed Design Procedure
When a circuit board layout is created from the schematic shown in Figure 15 a small circuit board is possible.
The accuracy of a RH and temperature measurement depends on the sensor accuracy and the setup of the
sensing system. The HDC1010 samples relative humidity and temperature in its immediate environment, it is
therefore important that the local conditions at the sensor match the monitored environment. Use one or more
openings in the physical cover of the thermostat to obtain a good airflow even in static conditions. Refer to the
layout below ( Figure 20) for a PCB layout which minimizes the thermal mass of the PCB in the region of the
HDC1010, which can improve measurement response time and accuracy.
9.2.3 Application Curve
The data showed below have been acquired with the HDC1010EVM. A humidity chamber was used to control
the environment.
Figure 16. RH vs. Time
9.3 Do's and Don'ts
9.3.1 Soldering
For soldering HDC1010 use the standard soldering profile IPC/JEDEC J-STD-020 with peak temperatures at 260
°C. Refer to the document SNVA009 for more details on the DSBGA package. In the document refer to DSBGA
package with bump size 0.5mm pitch and 0.32mm diameter.
When soldering the HDC1010 it is mandatory to use no-clean solder paste and no board wash shall be applied.
The HDC1010 should be limited to a single IR reflow and no rework is recommended.
9.3.2 Chemical Exposure and Sensor Protection
The humidity sensor is not a standard IC and therefore should not be exposed to particulates or volatile
chemicals such as solvents or other organic compounds. If any type of protective coating must be applied to the
circuit board, the sensor must be protected during the coating process.
9.3.3 High Temperature and Humidity Exposure
Long exposure outside the recommended operating conditions may temporarily offset the RH output. Table 11
shows the RH offset values that can be expected for exposure to 85°C and 85% RH for duration between 12 and
500 hours (continuos).
18
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Table 11. Induced RH Offset Due to Extended Exposure to High Humidity and High Temperature
(85°C/85% RH)
85°C/85% RH Duration (hours)
12
24
168
500
RH Offset (%)
3
6
12
15
When the sensor is exposed to less severe conditions, Figure 17 shows the typical RH offset at other
combinations of temperature and RH.
100
RH Offset (%)
90
±3%
±4%
80
70
60
50
±2%
40
30
20
10
±3%
0
10
20
30
40
50
60
70
Temperature (° C)
Figure 17. Relative Humidity Accuracy vs Temperature
10 Power Supply Recommendations
The HDC1010 require a voltage supply within 2.7V and 5.5V. A multilayer ceramic bypass X7R capacitor of
0.1µF between VDD and GND pin is recommended.
11 Layout
11.1 Layout Guidelines
The Relative Humidity sensor element is located on the bottom side of the package. It is positioned between the
two rows of bumps
It is recommended to not route any traces below the sensor element. Moreover the external components, such
as pull-up resistors and bypass capacitors need to be placed next to the 2 rows of bumps or on the bottom side
of the PCB in order to guarantee a good air flow.
It is recommended to isolate the sensor from the rest of the PCB by eliminating copper layers below the device
(GND, VDD) and creating a slot into the PCB around the sensor to enhance thermal isolation.
11.1.1 Surface Mount
Two types of PCB land patterns are used for surface mount packages:
1. Non-solder mask defined (NSMD)
2. Solder mask defined (SMD)
Pros and cons of NSMD and SMD:
1. The NSMD configuration is preferred due to its tighter control of the copper etch process and a reduction in
the stress concentration points on the PCB side compared to SMD configuration.
2. A copper layer thickness of less than 1 oz. is recommended to achieve higher solder joint stand-off. A 1 oz.
(30 micron) or greater copper thickness causes a lower effective solder joint stand-off, which may
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Layout Guidelines (continued)
compromise solder joint reliability.
3. For the NSMD pad geometry, the trace width at the connection to the land pad should not exceed 2/3 of the
pad diameter.
0.05 MAX
( 0.263)
METAL
METAL
UNDER
MASK
0.05 MIN
( 0.263)
SOLDER MASK
OPENING
SOLDER MASK
OPENING
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
Figure 18. Solder Mask
11.1.2 Stencil Printing Process
1. Use laser cutting followed by electro-polishing for stencil fabrication
2. If possible, offset apertures from land pads to maximize separation and minimize possibility of bridging for
DSBGA packages
3. Use Type 3 (25 to 45 micron particle size range) or finer solder paste for printing
(0.5) TYP
8X ( 0.25)
1
(R0.05) TYP
2
A
B
SYMM
(0.5) TYP
METAL
TYP
C
D
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.1mm THICK STENCIL
SCALE:25X
Figure 19. Solder Paste
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11.2 Layout Example
The only component next to the device is the supply bypass capacitor. Since the relative humidity is dependent
on the temperature, the HDC1010 should be positioned away from hot points present on the board such as
battery, display or micro-controller. Slots around the device can be used to reduce the thermal mass, for a
quicker response to environmental changes.
TOP LAYER
BOTTOM LAYER
Figure 20. Layout
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12 Device and Documentation Support
12.1 Documentation Support
12.1.1 Related Documentation
Wireless Sensor Humidity & Temp Sensor Node for Star Networks Enabling 10+ Year Coin Cell Battery Life Ref
Design TIDA-00374
Humidity & Temp Sensor Node for Sub-1GHz Star Networks Enabling 10+ Year Coin Cell Battery Life TIDA00484
Ultralow Power Multi-sensor Data Logger with NFC Interface Reference Design TIDA-00524
HDC1010 Texas Instruments Humidity Sensors, SNAA216
12.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
12.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
www.ti.com
16-Sep-2016
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
HDC1010YPAR
ACTIVE
DSBGA
YPA
8
3000
Green (RoHS
& no Sb/Br)
SAC405 SNAGCU
Level-1-260C-UNLIM
-40 to 85
3N
HDC1010YPAT
ACTIVE
DSBGA
YPA
8
250
Green (RoHS
& no Sb/Br)
SAC405 SNAGCU
Level-1-260C-UNLIM
-40 to 85
3N
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
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16-Sep-2016
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
7-Sep-2016
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
HDC1010YPAR
DSBGA
YPA
8
3000
178.0
8.4
HDC1010YPAT
DSBGA
YPA
8
250
178.0
8.4
Pack Materials-Page 1
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
1.68
2.13
0.76
4.0
8.0
Q1
1.68
2.13
0.76
4.0
8.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
7-Sep-2016
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
HDC1010YPAR
DSBGA
YPA
8
3000
210.0
185.0
35.0
HDC1010YPAT
DSBGA
YPA
8
250
210.0
185.0
35.0
Pack Materials-Page 2
PACKAGE OUTLINE
YPA0008
DSBGA - 0.675 mm max height
SCALE 8.000
DIE SIZE BALL GRID ARRAY
B
A
E
BALL A1
CORNER
D
0.675 MAX
C
SEATING PLANE
0.265
0.215
BALL TYP
1
TYP
D
C
1.5
TYP
0.5
TYP
D: Max = 2.07 mm, Min = 2.01 mm
B
E: Max = 1.62 mm, Min = 1.56 mm
A
1
8X
0.005
C A
2
0.335
0.305
B
4215068/A 11/2013
NOTES:
1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
YPA0008
DSBGA - 0.675 mm max height
DIE SIZE BALL GRID ARRAY
8X
0.275
0.250
(0.5) TYP
1
2
A
(0.5) TYP
B
SYMM
C
D
SYMM
LAND PATTERN EXAMPLE
SCALE:20X
0.05 MAX
( 0.263)
METAL
METAL
UNDER
MASK
0.05 MIN
( 0.263)
SOLDER MASK
OPENING
SOLDER MASK
OPENING
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
4215068/A 11/2013
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
See Texas Instruments Literature No. SBVA017 (www.ti.com/lit/sbva017).
www.ti.com
EXAMPLE STENCIL DESIGN
YPA0008
DSBGA - 0.675 mm max height
DIE SIZE BALL GRID ARRAY
(0.5) TYP
8X ( 0.25)
1
(R0.05) TYP
2
A
B
SYMM
(0.5) TYP
METAL
TYP
C
D
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.1mm THICK STENCIL
SCALE:25X
4215068/A 11/2013
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
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