Texas Instruments | DRV5053 Analog-Bipolar Hall Effect Sensor (Rev. C) | Datasheet | Texas Instruments DRV5053 Analog-Bipolar Hall Effect Sensor (Rev. C) Datasheet

Texas Instruments DRV5053 Analog-Bipolar Hall Effect Sensor (Rev. C) Datasheet
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DRV5053
SLIS153C – MAY 2014 – REVISED DECEMBER 2015
DRV5053 Analog-Bipolar Hall Effect Sensor
1 Features
2 Applications
•
•
•
•
•
•
1
•
•
•
•
•
•
•
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Linear Output Hall Sensor
Superior Temperature Stability
– Sensitivity ±10% Over Temperature
High Sensitivity Options:
– –11 mV/mT (OA, See Figure 17)
– –23 mV/mT (PA)
– –45 mV/mT (RA)
– –90 mV/mT (VA)
– +23 mV/mT (CA)
– +45 mV/mT (EA)
Supports a Wide Voltage Range
– 2.5 to 38 V
– No External Regulator Required
Wide Operating Temperature Range
– TA = –40 to 125°C (Q, see Figure 17)
Amplified Output Stage
– 2.3-mA Sink, 300 µA Source
Output Voltage: 0.2 ~ 1.8 V
– B = 0 mT, OUT = 1 V
Fast Power-On: 35 µs
Small Package and Footprint
– Surface Mount 3-Pin SOT-23 (DBZ)
– 2.92 mm × 2.37 mm
– Through-Hole 3-Pin TO-92 (LPG)
– 4.00 mm × 3.15 mm
Protection Features
– Reverse Supply Protection (up to –22 V)
– Supports up to 40-V Load Dump
– Output Short-Circuit Protection
– Output Current Limitation
Output State
Flow Meters
Docking Adjustment
Vibration Correction
Damper Controls
3 Description
The DRV5053 device is a chopper-stabilized Hall IC
that offers a magnetic sensing solution with superior
sensitivity stability over temperature and integrated
protection features.
The 0- to 2-V analog output responds linearly to the
applied magnetic flux density, and distinguishes the
polarity of magnetic field direction. A wide operating
voltage range from 2.5 to 38 V with reverse polarity
protection up to –22 V makes the device suitable for
a wide range of industrial and consumer applications.
Internal protection functions are provided for reverse
supply conditions, load dump, and output short circuit
or overcurrent.
Device Information(1)
PART NUMBER
DRV5053
PACKAGE
BODY SIZE (NOM)
SOT-23 (3)
2.92 mm × 1.30 mm
TO-92 (3)
4.00 mm × 3.15 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Device Packages
VOUT (V)
VMAX
VQ
VMIN
BMIN (N)
B (mT)
BMAX (S)
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
DRV5053
SLIS153C – MAY 2014 – REVISED DECEMBER 2015
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Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8
4
4
4
4
5
5
5
7
Absolute Maximum Ratings ......................................
ESD Ratings ............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Switching Characteristics ..........................................
Magnetic Characteristics...........................................
Typical Characteristics ..............................................
Detailed Description .............................................. 8
7.1
7.2
7.3
7.4
8
Overview ................................................................... 8
Functional Block Diagram ......................................... 8
Feature Description................................................... 9
Device Functional Modes........................................ 11
Application and Implementation ........................ 12
8.1 Application Information............................................ 12
8.2 Typical Applications ................................................ 12
9 Power Supply Recommendations...................... 14
10 Device and Documentation Support ................. 15
10.1
10.2
10.3
10.4
10.5
Device Support......................................................
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
15
16
16
16
16
11 Mechanical, Packaging, and Orderable
Information ........................................................... 16
4 Revision History
Changes from Revision B (September 2014) to Revision C
Page
•
Corrected body size of SOT-23 package and SIP package name to TO-92 ........................................................................ 1
•
Added BMAX to Absolute Maximum Ratings ........................................................................................................................... 4
•
Removed table note from junction temperature .................................................................................................................... 4
•
Updated the typical value for BN and VN for each version...................................................................................................... 5
•
Updated Figure 6 ................................................................................................................................................................... 7
•
Updated the Functional Block Diagram ................................................................................................................................. 8
•
Updated Output Stage ......................................................................................................................................................... 11
•
Updated package tape and reel options for M and blank ................................................................................................... 15
•
Added Community Resources.............................................................................................................................................. 16
Changes from Revision A (August 2014) to Revision B
Page
•
Updated high sensitivity options ............................................................................................................................................ 1
•
Updated the sensitivity device values and typicals. Updated typical and max values for DRV5053VA: –80 mV/mT .......... 6
•
Updated Typical Characteristics graphs ................................................................................................................................ 7
Changes from Original (May 2014) to Revision A
Page
•
Updated device status to production data ............................................................................................................................. 1
•
Changed the maximum TJ value from 175°C to 150°C ......................................................................................................... 4
•
Updated Magnetic Characteristics table. ............................................................................................................................... 5
2
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5 Pin Configuration and Functions
For additional configuration information, see Device Markings and Mechanical, Packaging, and Orderable
Information.
DBZ Package
3-Pin SOT-23
Top View
LPG Package
3-Pin TO-92
Top View
OUT
2
3
GND
1
1
2
3
VCC
VCC
OUT
GND
Pin Functions
PIN
NAME
TYPE
DESCRIPTION
DBZ
LPG
GND
3
2
GND
VCC
1
1
Power
2.5 to 38 V power supply. Bypass this pin to the GND pin with a 0.01-μF (minimum)
ceramic capacitor rated for VCC.
OUT
2
3
Output
Hall sensor analog output. 1 V output corresponds to B = 0 mT
Ground pin
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
VCC
Power supply voltage
MIN
MAX
UNIT
–22 (2)
40
V
Voltage ramp rate (VCC), VCC < 5 V
Unlimited
Voltage ramp rate (VCC), VCC > 5 V
Output pin voltage
Output pin reverse current during reverse supply condition
V/µs
0
2
–0.5
2.5
V
–20
mA
0
Magnetic flux density, BMAX
Unlimited
Operating junction temperature, TJ
–40
150
°C
Storage temperature, Tstg
–65
150
°C
(1)
(2)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Ensured by design. Only tested to –20 V.
6.2 ESD Ratings
VALUE
Electrostatic
discharge
V(ESD)
(1)
(2)
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1)
±2500
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins (2)
±500
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
2.5
38
UNIT
VCC
Power supply voltage
V
VOUT
Output pin voltage (OUT)
0
2
V
ISOURCE
Output pin current source (OUT)
0
300
µA
ISINK
Output pin current sink (OUT)
0
2.3
mA
TA
Operating ambient temperature
–40
125
°C
6.4 Thermal Information
DRV5053
THERMAL METRIC (1)
DBZ (SOT-23)
LPG (TO-92)
3 PINS
3 PINS
UNIT
RθJA
Junction-to-ambient thermal resistance
333.2
180
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
99.9
98.6
°C/W
RθJB
Junction-to-board thermal resistance
66.9
154.9
°C/W
ψJT
Junction-to-top characterization parameter
4.9
40
°C/W
ψJB
Junction-to-board characterization parameter
65.2
154.9
°C/W
(1)
4
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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6.5 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
POWER SUPPLIES (VCC)
VCC
VCC operating voltage
ICC
Operating supply current
ton
Power-on time
2.5
VCC = 2.5 to 38 V, TA = 25°C
38
2.7
VCC = 2.5 to 38 V, TA = 125°C
3
3.6
35
50
V
mA
µs
PROTECTION CIRCUITS
VCCR
Reverse supply voltage
–22
V
IOCP,SOURCE
Overcurrent protection level
Sourcing current
300
µA
IOCP,SINK
Overcurrent protection level
Sinking current
2.3
mA
6.6 Switching Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
13
25
UNIT
ANALOG OUTPUT (OUT)
td
Output delay time
TA = 25°C
µs
6.7 Magnetic Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
VQ
Quiescent output
ƒBW
Bandwidth
TEST CONDITIONS
B = 0 mT
TA = –40°C to 125°C
(2)
MIN
TYP
MAX
UNIT (1)
0.9
1.02
1.15
V
20
BN
Input-referred noise (3)
COUT = 50 pF
TA = –40°C to 125°C
Le
Linearity (4)
–BSAT < B < BSAT
VOUT MIN
Output saturation voltage (min)
B < –BSAT
VOUT MAX
Output saturation voltage (max)
B > BSAT
0.40
kHz
0.49
0.79
mTpp
0.2
V
1%
1.8
V
DRV5053OA: –11 mV/mT
S
Sensitivity
VCC = 3.3 V
TA ≈ –40°C to 125°C
VN
Output-referred noise
VCC = 3.3 V; ROUT = 10 kΩ;
COUT = 50 pF
TA ≈ –40°C to 125°C
BSAT
Input saturation field
VCC = 3.3 V
TA ≈ –40°C to 125°C
–17.5
–11
–5
mV/mT
5
mVpp
73
mT
DRV5053PA: –23 mV/mT
S
Sensitivity
VCC = 3.3 V
TA ≈ –40°C to 125°C
VN
Output-referred noise
VCC = 3.3 V; ROUT = 10 kΩ;
COUT = 50 pF
TA ≈ –40°C to 125°C
11
mVpp
BSAT
Input saturation field
VCC = 3.3 V
TA ≈ –40°C to 125°C
35
mT
(1)
(2)
(3)
(4)
–35
–23
–10
mV/mT
1 mT = 10 Gauss
Bandwidth describes the fastest changing magnetic field that can be detected and translated to the output.
Not tested in production; limits are based on characterization data.
Linearity describes the change in sensitivity across the B-range. The sensitivity near BSAT is typically within 1% of the sensitivity near
B = 0.
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Magnetic Characteristics (continued)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT (1)
–70
–45
–20
mV/mT
DRV5053RA: –45 mV/mT
S
Sensitivity
VCC = 3.3 V
TA ≈ –40°C to 125°C
VN
Output-referred noise
VCC = 3.3 V; ROUT = 10 kΩ;
COUT = 50 pF
TA ≈ –40°C to 125°C
22
mVpp
BSAT
Input saturation field
VCC = 3.3 V
TA ≈ –40°C to 125°C
18
mT
DRV5053VA: –90 mV/mT
S
Sensitivity
VCC = 3.3 V
TA ≈ –40°C to 125°C
VN
Output-referred noise
VCC = 3.3 V; ROUT = 10 kΩ;
COUT = 50 pF
TA ≈ –40°C to 125°C
BSAT
Input saturation field
VCC = 3.3 V
TA ≈ –40°C to 125°C
–140
–90
–45
mV/mT
44
mVpp
9
mT
DRV5053CA: 23 mV/mT
S
Sensitivity
VCC = 3.3 V
TA ≈ –40°C to 125°C
VN
Output-referred noise
VCC = 3.3 V; ROUT = 10 kΩ;
COUT = 50 pF
TA ≈ –40°C to 125°C
11
mVpp
BSAT
Input saturation field
VCC = 3.3 V
TA ≈ –40°C to 125°C
35
mT
10
23
35
mV/mT
DRV5053EA: 45 mV/mT
S
Sensitivity
VCC = 3.3 V
TA ≈ –40°C to 125°C
VN
Output-referred noise
VCC = 3.3 V; ROUT = 10 kΩ;
COUT = 50 pF
TA ≈ –40°C to 125°C
22
mVpp
BSAT
Input saturation field
VCC = 3.3 V
TA ≈ –40°C to 125°C
18
mT
6
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20
45
70
mV/mT
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6.8 Typical Characteristics
3.5
TA ± ƒ&
TA = 25°C
TA = 75°C
TA = 125°C
Supply Current (mA)
Supply Current (mA)
3.5
3
2.5
VCC = 2.5 V
VCC = 3.3 V
VCC = 13.2 V
VCC = 38 V
3
2.5
2
0
10
20
Supply Voltage (V)
30
2
-50
40
-25
Figure 1. ICC vs VCC
60
DRV5053EA
125
D010
DRV5053EA
40
Magnetic Sensitivity (mV/mT)
40
M a g n e tic S e n s itivity (m V /m T )
100
Figure 2. ICC vs Temperature
60
DRV5053CA
20
0
DRV5053OA
DRV5053PA
-20
DRV5053RA
-40
-60
-80
0
DRV5053CA
20
0 DRV5053OA
-20 DRV5053PA
-40
DRV5053RA
-60
-80
DRV5053VA
-100
DRV5053VA
-100
10
20
Supply Voltage (V)
30
-120
-50
40
-25
D001
TA = 25°C
0
25
50
75
Ambient Temperature (°C)
100
125
D002
VCC = 3.3 V
Figure 3. Sensitivity vs VCC
Figure 4. Sensitivity vs Temperature
1.035
0.7
1.03
0.65
Input-Referred Noise (mTpp)
Quiescent Voltage VQ (V)
0
25
50
75
Ambient Temperature (°C)
D009
1.025
1.02
1.015
1.01
TA ± ƒ&
TA = 25°C
1.005
TA = 85°C
TA = 125°C
0.6
0.55
0.5
0.45
0.4
0.35
1
0.995
0
10
20
Supply Voltage (V)
TA = 25°C
30
40
0.3
-50
-25
0
25
50
75
Ambient Temperature (°C)
100
D003
125
D004
VCC = 3.3 V
Figure 5. VQ vs VCC
Figure 6. BN vs Temperature
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7 Detailed Description
7.1 Overview
The DRV5053 device is a chopper-stabilized Hall sensor with an analog output for magnetic sensing
applications. The DRV5053 device can be powered with a supply voltage between 2.5 and 38 V, and will survive
–22 V reverse battery conditions continuously. Note that the DRV5053 device will not be operating when
approximately –22 to 2.4 V is applied to VCC (with respect to GND). In addition, the device can withstand supply
voltages up to 40 V for transient durations.
The output voltage is dependent on the magnetic field perpendicular to the package. The absence of a magnetic
field will result in OUT = 1 V. A magnetic field will cause the output voltage to change linearly with the magnetic
field.
The field polarity is defined as follows: a south pole near the marked side of the package is a positive magnetic
field. A north pole near the marked side of the package is a negative magnetic field.
For devices with a negative sensitivity (that is, DRV5053RA: –40 mV/mT), a south pole will cause the output
voltage to drop below 1 V, and a north pole will cause the output to rise above 1 V.
For devices with a positive sensitivity (that is, DRV5053EA: +40 mV/mT), a south pole will cause the output
voltage to rise above 1 V, and a north pole will cause the output to drop below 1 V.
7.2 Functional Block Diagram
2.5 ± 38 V
CVCC
VCC
Regulated Supply
Bias
Offset Cancel
Hall Element
Temperature
Compensation
+
-
OUT
Output
Driver
COUT
Optional RC Filtering
GND
8
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ROUT
Equivalent
impedance to
ground
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7.3 Feature Description
7.3.1 Field Direction Definition
A positive magnetic field is defined as a south pole near the marked side of the package as shown in Figure 7.
SOT-23 (DBZ)
TO-92 (LPG)
B > 0 mT
B < 0 mT
B > 0 mT
B < 0 mT
N
S
N
S
S
N
S
N
1
2
3
1
2
3
(Bottom view)
N = North pole, S = South pole
Figure 7. Field Direction Definition
7.3.2 Device Output
The DRV5053 device output is defined below for negative sensitivity (that is, –45 mV/mT, RA) and positive
sensitivity (that is, +45 mV/mT, EA):
VOUT (V)
VMAX
VQ
VMIN
–BSAT (N)
B (mT)
BSAT (S)
Figure 8. DRV5053 – Negative Sensitivity
VOUT (V)
VMAX
VQ
VMIN
–BSAT (N)
B (mT)
BSAT (S)
Figure 9. DRV5053 – Positive Sensitivity
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Feature Description (continued)
7.3.3 Power-On Time
After applying VCC to the DRV5053 device, ton must elapse before OUT is valid. Figure 10 shows Case 1 and
Figure 11 shows case 2; the output is defined assuming a negative sensitivity device and a constant magnetic
field –BSAT < B < BSAT.
Case #1
VCC
t (s)
B (mT)
BSAT
t (s)
-BSAT
OUT
90%
Invalid Output
Valid Output
t (s)
tON
Figure 10. Case 1: Power On When B < 0, North
Case #2
VCC
t (s)
B (mT)
BSAT
t (s)
-BSAT
OUT
Invalid Output
Valid Output
10%
t (s)
tON
Figure 11. Case 2: Power On When B > 0, South
10
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Feature Description (continued)
7.3.4 Output Stage
The DRV5053 output stage is capable of up to 300-μA of current source or 2.3-mA sink. For proper operation,
ensure that equivalent output load ROUT > 10 kΩ.
The capacitive load directly present on the OUT pin should be less than 10 nF to ensure the internal operational
amplifier is stable. If an external RC filter is added to reduce noise, it is acceptable to use a resistor ≥ 200 Ω with
a capacitor ≤0.1 µF. For an application example, see Filtered Typical Application.
7.3.5 Protection Circuits
An analog current limit circuit limits the current through the output driver. The driver current will be clamped to
IOCP
7.3.5.1 Overcurrent Protection (OCP)
An analog current-limit circuit limits the current through the FET. The driver current is clamped to IOCP. During
this clamping, the rDS(on) of the output FET is increased from the nominal value.
7.3.5.2 Load Dump Protection
The DRV5053 device operates at DC VCC conditions up to 38 V nominally, and can additionally withstand VCC =
40 V. No current-limiting series resistor is required for this protection.
7.3.5.3 Reverse Supply Protection
The DRV5053 device is protected in the event that the VCC pin and the GND pin are reversed (up to –22 V).
NOTE
In a reverse supply condition, the OUT pin reverse-current must not exceed the ratings
specified in the Absolute Maximum Ratings.
Table 1.
FAULT
CONDITION
DEVICE
DESCRIPTION
RECOVERY
FET overload (OCP)
ISINK ≥ IOCP
Operating
Output current is clamped to IOCP
IO < IOCP
Load Dump
38 V < VCC < 40 V
Operating
Device will operate for a transient duration
VCC ≤ 38 V
Reverse Supply
–22 V < VCC < 0 V
Disabled
Device will survive this condition
VCC ≥ 2.5 V
7.4 Device Functional Modes
The DRV5053 device is active only when VCC is between 2.5 and 38 V.
When a reverse supply condition exists, the device is inactive.
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The DRV5053 device is used in magnetic-field sensing applications.
8.2 Typical Applications
8.2.1 Typical Application With No Filter
2
OUT
3
VCC
1
VCC
C1
0.01 µF
(minimum)
Figure 12. Typical Application Schematic – No Filter
8.2.1.1 Design Requirements
For this design example, use the parameters listed in Table 2 as the input parameters.
Table 2. Design Parameters
DESIGN PARAMETER
REFERENCE
EXAMPLE VALUE
System bandwidth
ƒBW
15 kHz
8.2.1.2 Detailed Design Procedure
The DRV5053 has internal filtering that limits the bandwidth to at least 20 kHz. For this application no external
components are required other than the C1 bypass capacitor, which is 0.01 µF minimum. If the analog output
OUT is tied to a microcontroller ADC input, the equivalent load must be R > 10 kΩ and C < 10 nF.
Table 3. External Components
COMPONENT
PIN 1
PIN 2
RECOMMENDED
C1
VCC
GND
A 0.01-µF (minimum) ceramic capacitor rated for VCC
12
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8.2.1.3 Application Curve
Figure 13. 10-kHz Switching Magnetic Field
8.2.2 Filtered Typical Application
For lower noise on the analog output OUT, additional RC filtering can be added to further reduce the bandwidth.
C2
1500 pF
2
OUT
R1
10 kΩ
3
1
VCC
VCC
C1
0.01 µF
(minimum)
Figure 14. Filtered Typical Application Schematic
8.2.2.1 Design Requirements
For this design example, use the parameters listed in Table 4 as the input parameters.
Table 4. Design Parameters
DESIGN PARAMETER
REFERENCE
EXAMPLE VALUE
System bandwidth
ƒBW
5 kHz
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8.2.2.2 Detailed Design Procedure
In this example we will add an external RC filter in order to reduce the output bandwidth.
In order to preserve the signal at the frequencies of interest, we will conservatively select a low-pass filter
bandwidth (–3-dB point) at twice the system bandwidth (10 kHz).
1
10 kHz
2p ´ R1 ´ C2
(1)
If we guess R1 = 10 kΩ, then C2 < 1590 pF. So we select C2 = 1500 pF.
8.2.2.2.1 Typical Noise Versus Cutoff Frequency
RC filters are an effective way to reduce the noise present on OUT. The following shows typical noise
measurements for different cutoff frequencies using the DRV5053VA.
Table 5. DRV5053VA Typical Noise Data
R (Ω)
C (µF)
fCUTOFF (kHz)
NOISE (mVpp)
163
0.1
9.8
30.4
349
0.1
4.6
22.8
750
0.1
2.1
15.2
1505
0.1
1.1
9.7
3322
0.1
0.5
5.3
7510
0.1
0.2
2.5
8.2.2.3 Application Curves
0
-2
Magnitude (dB)
-4
-6
-8
-10
-12
-14
100
200
500 1000 2000
5000 10000
Frequency (Hz)
R1 = 10-kΩ pullup
Figure 15. 5-kHz Switching Magnetic Field
100000
D011
C2 = 680 pF
Figure 16. Low-Pass Filtering
9 Power Supply Recommendations
The DRV5053 device is designed to operate from an input voltage supply (VM) range between 2.5 and 38 V. A
0.01-µF (minimum) ceramic capacitor rated for VCC must be placed as close to the DRV5053 device as possible.
14
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Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: DRV5053
DRV5053
www.ti.com
SLIS153C – MAY 2014 – REVISED DECEMBER 2015
10 Device and Documentation Support
10.1 Device Support
10.1.1 Device Nomenclature
Figure 17 shows a legend for reading the complete device name for the DRV5053 device.
DRV5053
(RA)
(Q)
(DBZ)
(R)
()
Prefix
DRV5053: Analog linear Hall sensor
AEC-Q100
Q1: Automotive qualification
Blank: Non-auto
Sensitivity
OA: ±11 mV/mT
PA: ±23 mV/mT
RA: ±45 mV/mT
VA: ±90 mV/mT
CA: +23 mV/mT
EA: +45 mV/mT
Tape and Reel
R: 3000 pcs/reel
T: 250 pcs/reel
M: 3000 pcs/box (ammo)
Blank: 1000 pcs/bag (bulk)
Package
DBZ: 3-pin SOT-23
LPG: 3-pin TO-92
Temperature Range
Q: ±40 to 125°C
E: ±40 to 150°C
Figure 17. Device Nomenclature
10.1.2 Device Markings
Marked Side
3
Marked Side Front
1
1
2
3
2
Marked Side
1
2
3
(Bottom view)
Figure 18. SOT-23 (DBZ) Package
Figure 19. TO-92 (LPG) Package
indicates the Hall effect sensor (not to scale). The Hall element is located in the center of the package with a
tolerance of ±100 µm. The height of the Hall element from the bottom of the package is 0.7 mm ±50 µm in the DBZ
package and 0.987 mm ±50 µm in the LPG package.
Submit Documentation Feedback
Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: DRV5053
15
DRV5053
SLIS153C – MAY 2014 – REVISED DECEMBER 2015
www.ti.com
10.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
10.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
10.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
10.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
11 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
16
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Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: DRV5053
PACKAGE OPTION ADDENDUM
www.ti.com
11-Oct-2018
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
DRV5053CAQDBZR
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS CU NIPDAUAG | CU SN Level-1-260C-UNLIM
& no Sb/Br)
-40 to 125
(+ALCA, 1LX2)
DRV5053CAQDBZT
ACTIVE
SOT-23
DBZ
3
250
Green (RoHS CU NIPDAUAG | CU SN Level-1-260C-UNLIM
& no Sb/Br)
-40 to 125
(+ALCA, 1LX2)
DRV5053CAQLPG
ACTIVE
TO-92
LPG
3
1000
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
-40 to 125
+ALCA
DRV5053CAQLPGM
ACTIVE
TO-92
LPG
3
3000
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
-40 to 125
+ALCA
DRV5053EAQDBZR
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS CU NIPDAUAG | CU SN Level-1-260C-UNLIM
& no Sb/Br)
-40 to 125
(+ALEA, 1LZ2)
DRV5053EAQDBZT
ACTIVE
SOT-23
DBZ
3
250
Green (RoHS CU NIPDAUAG | CU SN Level-1-260C-UNLIM
& no Sb/Br)
-40 to 125
(+ALEA, 1LZ2)
DRV5053EAQLPG
ACTIVE
TO-92
LPG
3
1000
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
-40 to 125
+ALEA
DRV5053EAQLPGM
ACTIVE
TO-92
LPG
3
3000
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
-40 to 125
+ALEA
DRV5053OAQDBZR
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS CU NIPDAUAG | CU SN Level-1-260C-UNLIM
& no Sb/Br)
-40 to 125
(+ALOA, 1M12)
DRV5053OAQDBZT
ACTIVE
SOT-23
DBZ
3
250
Green (RoHS CU NIPDAUAG | CU SN Level-1-260C-UNLIM
& no Sb/Br)
-40 to 125
(+ALOA, 1M12)
DRV5053OAQLPG
ACTIVE
TO-92
LPG
3
1000
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
-40 to 125
+ALOA
DRV5053OAQLPGM
ACTIVE
TO-92
LPG
3
3000
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
-40 to 125
+ALOA
DRV5053PAQDBZR
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS CU NIPDAUAG | CU SN Level-1-260C-UNLIM
& no Sb/Br)
-40 to 125
(+ALPA, 1M22)
DRV5053PAQDBZT
ACTIVE
SOT-23
DBZ
3
250
Green (RoHS CU NIPDAUAG | CU SN Level-1-260C-UNLIM
& no Sb/Br)
-40 to 125
(+ALPA, 1M22)
DRV5053PAQLPG
ACTIVE
TO-92
LPG
3
1000
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
-40 to 125
+ALPA
DRV5053PAQLPGM
ACTIVE
TO-92
LPG
3
3000
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
-40 to 125
+ALPA
DRV5053RAQDBZR
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS CU NIPDAUAG | CU SN Level-1-260C-UNLIM
& no Sb/Br)
-40 to 125
(+ALRA, 1M32)
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
11-Oct-2018
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
DRV5053RAQDBZT
ACTIVE
SOT-23
DBZ
3
250
Green (RoHS CU NIPDAUAG | CU SN Level-1-260C-UNLIM
& no Sb/Br)
-40 to 125
(+ALRA, 1M32)
DRV5053RAQLPG
ACTIVE
TO-92
LPG
3
1000
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
-40 to 125
+ALRA
DRV5053RAQLPGM
ACTIVE
TO-92
LPG
3
3000
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
-40 to 125
+ALRA
DRV5053VAQDBZR
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS CU NIPDAUAG | CU SN Level-1-260C-UNLIM
& no Sb/Br)
-40 to 125
(+ALVA, 1M42)
DRV5053VAQDBZT
ACTIVE
SOT-23
DBZ
3
250
Green (RoHS CU NIPDAUAG | CU SN Level-1-260C-UNLIM
& no Sb/Br)
-40 to 125
(+ALVA, 1M42)
DRV5053VAQLPG
ACTIVE
TO-92
LPG
3
1000
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
-40 to 125
+ALVA
DRV5053VAQLPGM
ACTIVE
TO-92
LPG
3
3000
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
-40 to 125
+ALVA
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
11-Oct-2018
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF DRV5053 :
• Automotive: DRV5053-Q1
NOTE: Qualified Version Definitions:
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
20-May-2018
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
DRV5053CAQDBZR
SOT-23
DBZ
3
3000
178.0
9.0
DRV5053CAQDBZR
SOT-23
DBZ
3
3000
180.0
DRV5053CAQDBZT
SOT-23
DBZ
3
250
180.0
DRV5053CAQDBZT
SOT-23
DBZ
3
250
DRV5053EAQDBZR
SOT-23
DBZ
3
DRV5053EAQDBZR
SOT-23
DBZ
DRV5053EAQDBZT
SOT-23
DBZ
DRV5053EAQDBZT
SOT-23
DRV5053OAQDBZR
DRV5053OAQDBZR
3.15
2.77
1.22
4.0
8.0
Q3
8.4
3.15
2.77
1.22
4.0
8.0
Q3
8.4
3.15
2.77
1.22
4.0
8.0
Q3
178.0
9.0
3.15
2.77
1.22
4.0
8.0
Q3
3000
180.0
8.4
3.15
2.77
1.22
4.0
8.0
Q3
3
3000
178.0
9.0
3.15
2.77
1.22
4.0
8.0
Q3
3
250
180.0
8.4
3.15
2.77
1.22
4.0
8.0
Q3
DBZ
3
250
178.0
9.0
3.15
2.77
1.22
4.0
8.0
Q3
SOT-23
DBZ
3
3000
180.0
8.4
3.15
2.77
1.22
4.0
8.0
Q3
SOT-23
DBZ
3
3000
178.0
9.0
3.15
2.77
1.22
4.0
8.0
Q3
DRV5053OAQDBZT
SOT-23
DBZ
3
250
180.0
8.4
3.15
2.77
1.22
4.0
8.0
Q3
DRV5053OAQDBZT
SOT-23
DBZ
3
250
178.0
9.0
3.15
2.77
1.22
4.0
8.0
Q3
DRV5053PAQDBZR
SOT-23
DBZ
3
3000
178.0
9.0
3.15
2.77
1.22
4.0
8.0
Q3
DRV5053PAQDBZR
SOT-23
DBZ
3
3000
180.0
8.4
3.15
2.77
1.22
4.0
8.0
Q3
DRV5053PAQDBZT
SOT-23
DBZ
3
250
180.0
8.4
3.15
2.77
1.22
4.0
8.0
Q3
DRV5053PAQDBZT
SOT-23
DBZ
3
250
178.0
9.0
3.15
2.77
1.22
4.0
8.0
Q3
DRV5053RAQDBZR
SOT-23
DBZ
3
3000
180.0
8.4
3.15
2.77
1.22
4.0
8.0
Q3
DRV5053RAQDBZR
SOT-23
DBZ
3
3000
178.0
9.0
3.15
2.77
1.22
4.0
8.0
Q3
Pack Materials-Page 1
W
Pin1
(mm) Quadrant
PACKAGE MATERIALS INFORMATION
www.ti.com
20-May-2018
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
DRV5053RAQDBZT
SOT-23
DBZ
3
250
178.0
9.0
DRV5053RAQDBZT
SOT-23
DBZ
3
250
180.0
8.4
DRV5053VAQDBZR
SOT-23
DBZ
3
3000
178.0
DRV5053VAQDBZR
SOT-23
DBZ
3
3000
180.0
DRV5053VAQDBZT
SOT-23
DBZ
3
250
DRV5053VAQDBZT
SOT-23
DBZ
3
250
W
Pin1
(mm) Quadrant
3.15
2.77
1.22
4.0
8.0
Q3
3.15
2.77
1.22
4.0
8.0
Q3
9.0
3.15
2.77
1.22
4.0
8.0
Q3
8.4
3.15
2.77
1.22
4.0
8.0
Q3
180.0
8.4
3.15
2.77
1.22
4.0
8.0
Q3
178.0
9.0
3.15
2.77
1.22
4.0
8.0
Q3
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DRV5053CAQDBZR
SOT-23
DBZ
3
3000
180.0
180.0
18.0
DRV5053CAQDBZR
SOT-23
DBZ
3
3000
202.0
201.0
28.0
DRV5053CAQDBZT
SOT-23
DBZ
3
250
202.0
201.0
28.0
DRV5053CAQDBZT
SOT-23
DBZ
3
250
180.0
180.0
18.0
DRV5053EAQDBZR
SOT-23
DBZ
3
3000
202.0
201.0
28.0
DRV5053EAQDBZR
SOT-23
DBZ
3
3000
180.0
180.0
18.0
DRV5053EAQDBZT
SOT-23
DBZ
3
250
202.0
201.0
28.0
DRV5053EAQDBZT
SOT-23
DBZ
3
250
180.0
180.0
18.0
DRV5053OAQDBZR
SOT-23
DBZ
3
3000
202.0
201.0
28.0
DRV5053OAQDBZR
SOT-23
DBZ
3
3000
180.0
180.0
18.0
DRV5053OAQDBZT
SOT-23
DBZ
3
250
202.0
201.0
28.0
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
20-May-2018
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DRV5053OAQDBZT
SOT-23
DBZ
3
250
180.0
180.0
18.0
DRV5053PAQDBZR
SOT-23
DBZ
3
3000
180.0
180.0
18.0
DRV5053PAQDBZR
SOT-23
DBZ
3
3000
202.0
201.0
28.0
DRV5053PAQDBZT
SOT-23
DBZ
3
250
202.0
201.0
28.0
DRV5053PAQDBZT
SOT-23
DBZ
3
250
180.0
180.0
18.0
DRV5053RAQDBZR
SOT-23
DBZ
3
3000
202.0
201.0
28.0
DRV5053RAQDBZR
SOT-23
DBZ
3
3000
180.0
180.0
18.0
DRV5053RAQDBZT
SOT-23
DBZ
3
250
180.0
180.0
18.0
DRV5053RAQDBZT
SOT-23
DBZ
3
250
202.0
201.0
28.0
DRV5053VAQDBZR
SOT-23
DBZ
3
3000
180.0
180.0
18.0
DRV5053VAQDBZR
SOT-23
DBZ
3
3000
202.0
201.0
28.0
DRV5053VAQDBZT
SOT-23
DBZ
3
250
202.0
201.0
28.0
DRV5053VAQDBZT
SOT-23
DBZ
3
250
180.0
180.0
18.0
Pack Materials-Page 3
PACKAGE OUTLINE
LPG0003A
TO-92 - 5.05 mm max height
SCALE 1.300
TRANSISTOR OUTLINE
4.1
3.9
3.25
3.05
3X
0.55
0.40
5.05
MAX
3
1
3X (0.8)
3X
15.5
15.1
3X
0.48
0.35
3X
2X 1.27 0.05
0.51
0.36
2.64
2.44
2.68
2.28
1.62
1.42
2X (45 )
1
(0.5425)
2
3
0.86
0.66
4221343/C 01/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
LPG0003A
TO-92 - 5.05 mm max height
TRANSISTOR OUTLINE
0.05 MAX
ALL AROUND
TYP
FULL R
TYP
METAL
TYP
(1.07)
3X ( 0.75) VIA
2X
METAL
(1.7)
2X (1.7)
2
1
2X
SOLDER MASK
OPENING
3
2X (1.07)
(R0.05) TYP
(1.27)
SOLDER MASK
OPENING
(2.54)
LAND PATTERN EXAMPLE
NON-SOLDER MASK DEFINED
SCALE:20X
4221343/C 01/2018
www.ti.com
TAPE SPECIFICATIONS
LPG0003A
TO-92 - 5.05 mm max height
TRANSISTOR OUTLINE
0
13.0
12.4
1
0
1
1 MAX
21
18
2.5 MIN
6.5
5.5
9.5
8.5
0.25
0.15
19.0
17.5
3.8-4.2 TYP
6.55
6.15
12.9
12.5
0.45
0.35
4221343/C 01/2018
www.ti.com
4203227/C
PACKAGE OUTLINE
DBZ0003A
SOT-23 - 1.12 mm max height
SCALE 4.000
SMALL OUTLINE TRANSISTOR
C
2.64
2.10
1.4
1.2
PIN 1
INDEX AREA
1.12 MAX
B
A
0.1 C
1
0.95
3.04
2.80
1.9
3X
3
0.5
0.3
0.2
2
(0.95)
C A B
0.25
GAGE PLANE
0 -8 TYP
0.10
TYP
0.01
0.20
TYP
0.08
0.6
TYP
0.2
SEATING PLANE
4214838/C 04/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-236, except minimum foot length.
www.ti.com
EXAMPLE BOARD LAYOUT
DBZ0003A
SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR
PKG
3X (1.3)
1
3X (0.6)
SYMM
3
2X (0.95)
2
(R0.05) TYP
(2.1)
LAND PATTERN EXAMPLE
SCALE:15X
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4214838/C 04/2017
NOTES: (continued)
4. Publication IPC-7351 may have alternate designs.
5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DBZ0003A
SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR
PKG
3X (1.3)
1
3X (0.6)
SYMM
3
2X(0.95)
2
(R0.05) TYP
(2.1)
SOLDER PASTE EXAMPLE
BASED ON 0.125 THICK STENCIL
SCALE:15X
4214838/C 04/2017
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
www.ti.com
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