Texas Instruments | TMP10x Temperature Sensor With I2C and SMBus Interface with Alert Function in SOT-23 Package (Rev. I) | Datasheet | Texas Instruments TMP10x Temperature Sensor With I2C and SMBus Interface with Alert Function in SOT-23 Package (Rev. I) Datasheet

Texas Instruments TMP10x Temperature Sensor With I2C and SMBus Interface with Alert Function in SOT-23 Package (Rev. I) Datasheet
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TMP100, TMP101
SBOS231I – JANUARY 2002 – REVISED NOVEMBER 2015
TMP10x Temperature Sensor With I2C and SMBus Interface with
Alert Function in SOT-23 Package
1 Features
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1
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3 Description
2
Digital Output: SMBus™, Two-Wire, and I C
Interface Compatibility
Resolution: 9 to 12 Bits, User-Selectable
Accuracy:
– ±1°C (Typical) from –55°C to 125°C
– ±2°C (Maximum) from –55°C to 125°C
Low Quiescent Current: 45-μA, 0.1-μA Standby
Wide Supply Range: 2.7 V to 5.5 V
TMP100 Features Two Address Pins
TMP101 Features One Address Pin and an
ALERT Pin
6-Pin SOT-23 Package
2 Applications
•
•
•
•
•
•
•
•
•
The TMP100 and TMP101 devices are digital
temperature sensors ideal for negative temperature
coefficient (NTC) and positive temperature coefficient
(PTC) thermistor replacement. The devices offer a
typical accuracy of ±1°C without requiring calibration
or external component signal conditioning. Device
temperature sensors are highly linear and do not
require complex calculations or look-up tables to
derive the temperature. The on-chip, 12-bit ADC
offers resolutions down to 0.0625°C. The devices are
available in 6-Pin SOT-23 packages.
The TMP100 and TMP101 devices feature SMBus,
Two-Wire, and I2C interface compatibility. The
TMP100 device allows up to eight devices on one
bus. The TMP101 device offers an SMBus Alert
function with up to three devices per bus.
The TMP100 and TMP101 devices are ideal for
extended temperature measurement in a variety of
communication, computer, consumer, environmental,
industrial, and instrumentation applications.
Power-Supply Temperature Monitoring
Computer Peripheral Thermal Protection
Notebook Computers
Cell Phones
Battery Management
Office Machines
Thermostat Controls
Environmental Monitoring and HVAC
Electromechanical Device Temperature
The TMP100 and TMP101 devices are specified for
operation over a temperature range of −55°C to
125°C.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
TMP100
SOT-23 (6)
2.90 mm × 1.60 mm
TMP101
SOT-23 (6)
2.90 mm × 1.60 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Simplified Schematics
Temperature
SCL
GND
ADD1
Temperature
1
2
3
Diode
Temp.
Sensor
Control
Logic
6
∆Σ
ADC
Converter
Serial
Interface
5
OSC
Config
and Temp
Register
TMP100
4
SDA
SCL
ADD0
GND
V+
ALERT
1
2
3
Diode
Temp.
Sensor
Control
Logic
6
∆Σ
ADC
Converter
Serial
Interface
5
OSC
Config
and Temp
Register
4
SDA
ADD0
V+
TMP101
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TMP100, TMP101
SBOS231I – JANUARY 2002 – REVISED NOVEMBER 2015
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Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
6.5
6.6
6.7
4
4
4
4
5
6
7
Absolute Maximum Ratings ......................................
ESD Ratings ............................................................
Recommended Operating Conditions.......................
Thermal Information .................................................
Electrical Characteristics...........................................
Timing Requirements ................................................
Typical Characteristics ..............................................
Detailed Description .............................................. 8
7.1 Overview ................................................................... 8
7.2 Functional Block Diagram ......................................... 8
7.3 Feature Description................................................... 9
7.4 Device Functional Modes........................................ 14
7.5 Programming........................................................... 15
8
Application and Implementation ........................ 19
8.1 Application Information............................................ 19
8.2 Typical Application .................................................. 19
9 Power Supply Recommendations...................... 21
10 Layout................................................................... 21
10.1 Layout Guidelines ................................................. 21
10.2 Layout Examples................................................... 21
11 Device and Documentation Support ................. 23
11.1
11.2
11.3
11.4
Related Links ........................................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
23
23
23
23
12 Mechanical, Packaging, and Orderable
Information ........................................................... 23
4 Revision History
Changes from Revision H (March 2015) to Revision I
•
Page
Changed body size values in Device Information table ........................................................................................................ 1
Changes from Revision G (November 2007) to Revision H
Page
•
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section. ................................................................................................ 1
•
Changed specification values in Timing Requirements table ................................................................................................ 6
2
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5 Pin Configuration and Functions
DBV Package
6-Pin SOT-23
Top View
1
GND
2
ADD1
3
T100
SCL
6
SDA
5
ADD0
4
V+
6
SDA
5
ADD0
4
V+
TMP100
DBV Package
6-Pin SOT-23
Top View
1
GND
2
ALERT
3
T101
SCL
TMP101
Pin Functions
PIN
NAME
NO.
TMP100
I/O
DESCRIPTION
TMP101
ADD0
5
5
I
Address select. Connect to GND, V+, or leave floating.
ADD1
3
—
I
Address select. Connect to GND, V+, or leave floating.
ALERT
—
3
O
Overtemperature alert. Open-drain output; requires a pullup resistor.
GND
2
2
—
Ground
SCL
1
1
I
Serial clock. Open-drain output; requires a pullup resistor.
SDA
6
6
I/O
Serial data. Open-drain output; requires a pullup resistor.
V+
4
4
I
Supply voltage, 2.7 V to 5.5 V
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN
MAX
UNIT
7.5
V
Power supply, V+
Input voltage
(2)
Operating temperature
–0.5
7.5
V
–55
125
°C
150
°C
150
°C
Junction temperature, TJ
Storage temperature, Tstg
(1)
(2)
–60
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Input voltage rating applies to all TMP100 and TMP101 input voltages.
6.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±2000
Charged device model (CDM), per JEDEC specification JESD22-C101 (2)
±200
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
Supply voltage
2.7
5.5
V
Operating free-air temperature, TA
–55
125
°C
6.4 Thermal Information
TMP100, TMP101
THERMAL METRIC (1)
DBV (SOT-23)
UNIT
6 PINS
RθJA
Junction-to-ambient thermal resistance
182.9
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
115
°C/W
RθJB
Junction-to-board thermal resistance
30.2
°C/W
ψJT
Junction-to-top characterization parameter
17.1
°C/W
ψJB
Junction-to-board characterization parameter
29.7
°C/W
(1)
4
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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6.5 Electrical Characteristics
At TA = −55°C to 125°C and V+ = 2.7 V to 5.5 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
125
°C
TEMPERATURE INPUT
Range
Accuracy (temperature error)
–55
−25°C to 85°C
−55°C to 125°C
Accuracy (temperature error) vs supply
Resolution
Selectable
±0.5
±2
±1
±2
0.2
±0.5
0.0625
°C
°C/V
°C
DIGITAL INPUT/OUTPUT
Input capacitance
3
pF
VIH
High-level input logic
0.7 (V+)
6
V
VIL
Low-level input logic
−0.5
0.3 (V+)
V
IIN
Input current
0 V ≤ VIN ≤ 6 V
1
µA
VOL
Low-level output logic SDA
IOL = 3 mA
0
0.15
0.4
V
VOL
Low-level output logic ALERT
IOL = 4 mA
0
0.15
0.4
V
Resolution
Selectable
9
12
Bits
Conversion time
Conversion rate
9 bits
40
75
10 bits
80
150
11 bits
160
300
12 bits
320
600
9 bits
25
10 bits
12
11 bits
6
12 bits
3
ms
s/s
POWER SUPPLY
Operating range
2.7
Serial bus inactive
IQ
ISD
Quiescent current
Shutdown current
5.5
45
Serial bus active, SCL frequency = 400 kHz
70
Serial bus active, SCL frequency = 3.4 MHz
150
Serial bus inactive
0.1
Serial bus active, SCL frequency = 400 kHz
20
Serial bus active, SCL frequency = 3.4 MHz
100
V
75
µA
13
µA
TEMPERATURE RANGE
Specified range
–55
125
°C
Storage range
–60
150
°C
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6.6 Timing Requirements
FAST MODE
PARAMETER
MIN
f(SCL)
SCL operating frequency
t(BUF)
Bus free time between STOP and START condition
t(HDSTA)
HIGH-SPEED MODE
MAX
MIN
0.4
MAX
2
UNIT
MHz
1300
160
ns
Hold time after repeated START condition.
After this period, the first clock is generated.
600
160
ns
t(SUSTA)
Repeated START condition setup time
600
160
ns
t(SUSTO)
STOP condition setup time
600
160
t(HDDAT)
Data hold time
20
t(SUDAT)
Data setup time
100
20
ns
t(LOW)
SCL clock LOW period
1300
360
ns
t(HIGH)
SCL clock HIGH period
600
60
tRC, tFC
Clock rise and fall time
300
40
ns
tRD, tFD
Data rise and fall time
300
170
ns
6
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900
20
ns
170
ns
ns
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6.7 Typical Characteristics
At TA = 25°C and V+ = 5 V, unless otherwise noted.
1
70
0.9
0.8
60
0.7
0.6
ISD (µA)
I Q (µA)
V+ = 5 V
50
0.5
0.4
0.3
V+ = 27 V
0.2
40
0.1
0
Serial Bus Inactive
−0.1
−60 −40 −20
30
−60 −40 −20
0
20
40
60
80
100 120 140
0
Temperature (°C)
20
40
60
80
100
120 140
Temperature (°C)
Figure 1. Quiescent Current vs Temperature
Figure 2. Shutdown Current vs Temperature
2.0
400
350
Temperature Error (°C)
Conversion Time (ms)
1.5
V+ = 5 V
300
V+ = 2.7 V
1.0
0.5
0.0
−0.5
−1.0
−1.5
NOTE: 12−bit resolution.
3 Typical Units
−2.0
−60 −40 −20
0
250
−60 −40 −20
0
20
40
60
80
100
120 140
NOTE: 12−bit resolution.
20
40
60
80
100
120 140
Temperature (°C)
Temperature (°C)
Figure 3. Conversion Time vs Temperature
Figure 4. Temperature Accuracy vs Temperature
180
160
125°C
140
25°C
I Q (µA)
120
100
125°C
80
25°C
−55°C
60
40
20
−55°C
FAST MODE
Hs MODE
0
10k
100k
1M
10M
SCL Frequency (Hz)
Figure 5. Quiescent Current With Bus Activity vs Temperature
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7 Detailed Description
7.1 Overview
The TMP100 and TMP101 devices are digital temperature sensors optimal for thermal management and thermal
protection applications. The TMP100 and TMP101 devices are Two-Wire, SMBus, and I2C interface-compatible.
These devices are specified over a operating temperature range of −55°C to 125°C. The Functional Block
Diagram section shows the internal block diagrams of the TMP100 and TMP101 devices.
The temperature sensor in the TMP100 and TMP101 devices is the chip itself. Thermal paths run through the
package leads as well as the plastic package. The package leads provide the primary thermal path because of
the lower thermal resistance of the metal. The GND pin of the TMP100 or TMP101 is directly connected to the
metal lead frame, and is the best choice for thermal input.
7.2 Functional Block Diagram
Temperature
SCL
GND
ADD1
Temperature
1
2
3
Diode
Temp.
Sensor
Control
Logic
6
∆Σ
ADC
Converter
Serial
Interface
5
OSC
Config
and Temp
Register
4
SDA
SCL
ADD0
GND
V+
ALERT
1
2
3
TMP100
8
Diode
Temp.
Sensor
Control
Logic
6
∆Σ
ADC
Converter
Serial
Interface
5
OSC
Config
and Temp
Register
4
SDA
ADD0
V+
TMP101
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7.3 Feature Description
7.3.1 Digital Temperature Output
The digital output from each temperature measurement conversion is stored in the read-only Temperature
Register. The Temperature Register of the TMP100 or TMP101 device is a 12-bit, read-only register that stores
the output of the most recent conversion. Two bytes must be read to obtain data and are listed in Table 6 and
Table 7. The first 12 bits are used to indicate temperature with all the remaining bits equal to zero. The data
format for temperature is listed in Table 1. Negative numbers are represented in binary twos complement format.
Following power-up or reset, the temperature register reads 0°C until the first conversion is complete.
The user can obtain 9, 10, 11, or 12 bits of resolution by addressing the Configuration Register and setting the
resolution bits accordingly. For 9-, 10-, or 11-bit resolution, the most significant bits (MSBs) in the Temperature
Register are used with the unused least significant bits (LSBs) set to zero.
Table 1. Temperature Data Format
DIGITAL OUTPUT
TEMPERATURE
(°C)
BINARY
HEX
128
0111 1111 1111
7FF
127.9375
0111 1111 1111
7FF
100
0110 0100 0000
640
80
0101 0000 0000
500
75
0100 1011 0000
4B0
50
0011 0010 0000
320
25
0001 1001 0000
190
0.25
0000 0000 0100
004
0
0000 0000 0000
000
–0.25
1111 1111 1100
FFC
–25
1110 0111 0000
E70
–55
1100 1001 0000
C90
–128
1000 0000 0000
800
7.3.2 Serial Interface
The TMP100 and TMP101 devices operate only as slave devices on the SMBus, Two-Wire, and I2C interfacecompatible bus. Connections to the bus are made through the open-drain I/O lines SDA and SCL. The TMP100
and TMP101 devices support the transmission protocol for fast (up to 400 kHz) and high-speed (up to 2 MHz)
modes. All data bytes are transmitted MSB first.
7.3.2.1 Bus Overview
The device that initiates the transfer is called a master, and the devices controlled by the master are slaves. The
bus must be controlled by a master device that generates the serial clock (SCL), controls the bus access, and
generates the START and STOP conditions.
To address a specific device, a START condition is initiated, indicated by pulling the data line (SDA) from a HIGH
to LOW logic level while SCL is HIGH. All slaves on the bus shift in the slave address byte, with the last bit
indicating whether a read or write operation is intended. During the ninth clock pulse, the slave being addressed
responds to the master by generating an Acknowledge and pulling SDA LOW.
Data transfer is then initiated and sent over eight clock pulses followed by an Acknowledge Bit. During data
transfer, SDA must remain stable while SCL is HIGH because any change in SDA while SCL is HIGH is
interpreted as a control signal.
When all data are transferred, the master generates a STOP condition indicated by pulling SDA from LOW to
HIGH, while SCL is HIGH.
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7.3.2.2 Serial Bus Address
To program the TMP100 and TMP101 devices, the master must first address slave devices through a slave
address byte. The slave address byte consists of seven address bits and a direction bit indicating the intent of
executing a read or write operation.
The TMP100 device features two address pins to allow up to eight devices to be addressed on a single I2C
interface. Table 2 describes the pin logic levels used to properly connect up to eight devices. Float indicates the
pin is left unconnected. The state of pins ADD0 and ADD1 is sampled on the first I2C bus communication and
must be set before any activity on the interface.
Table 2. Address Pins and Slave Addresses for the TMP100
ADD1
ADD0
SLAVE ADDRESS
0
0
1001000
0
Float
1001001
0
1
1001010
1
0
1001100
1
Float
1001101
1
1
1001110
Float
0
1001011
Float
1
1001111
The TMP101 device features one address pin and an ALERT pin, allowing up to three devices to be connected
per bus. Pin logic levels are described in Table 3. The address pins of the TMP100 and TMP101 devices are
read after reset or in response to an I2C address acquire request. Following reading, the state of the address
pins is latched to minimize power dissipation associated with detection.
Table 3. Address Pins and Slave Addresses for the TMP101
ADD0
SLAVE ADDRESS
0
1001000
Float
1001001
1
1001010
7.3.2.3 Writing and Reading to the TMP100 and TMP101
Accessing a particular register on the TMP100 and TMP101 devices is accomplished by writing the appropriate
value to the Pointer Register. The value for the Pointer Register is the first byte transferred after the I2C slave
address byte with the R/W bit LOW. Every write operation to the TMP100 and TMP101 devices requires a value
for the Pointer Register (see Figure 7).
When reading from the TMP100 and TMP101 devices, the last value stored in the Pointer Register by a write
operation is used to determine which register is read by a read operation. To change the register pointer for a
read operation, a new value must be written to the Pointer Register. This action is accomplished by issuing an
I2C slave address byte with the R/W bit LOW, followed by the Pointer Register Byte. No additional data are
required. The master can then generate a START condition and send the I2C slave address byte with the R/W bit
HIGH to initiate the read command; see Figure 8 for details of this sequence. If repeated reads from the same
register are desired, the Pointer Register bytes do not have to be continually sent because the TMP100 and
TMP101 devices remember the Pointer Register value until that value is changed by the next write operation.
10
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7.3.2.4 Slave Mode Operations
The TMP100 and TMP101 devices can operate as a slave receiver or slave transmitter.
7.3.2.4.1 Slave Receiver Mode
The first byte transmitted by the master is the slave address, with the R/W bit LOW. The TMP100 or TMP101
devices then acknowledges reception of a valid address. The next byte transmitted by the master is the Pointer
Register. The TMP100 or TMP101 devices then acknowledges reception of the Pointer Register byte. The next
byte or bytes are written to the register addressed by the Pointer Register. The TMP100 and TMP101 devices
acknowledge reception of each data byte. The master can terminate data transfer by generating a START or
STOP condition.
7.3.2.4.2 Slave Transmitter Mode
The first byte is transmitted by the master and is the slave address, with the R/W bit HIGH. The slave
acknowledges reception of a valid slave address. The next byte is transmitted by the slave and is the most
significant byte of the register indicated by the Pointer Register. The master acknowledges reception of the data
byte. The next byte transmitted by the slave is the least significant byte. The master acknowledges reception of
the data byte. The master can terminate data transfer by generating a Not-Acknowledge on reception of any data
byte, or generating a START or STOP condition.
7.3.2.5 SMBus Alert Function
The TMP101 device supports the SMBus Alert function. When the TMP101 device is operating in Interrupt Mode
(TM = 1), the ALERT pin of the TMP101 device can be connected as an SMBus Alert signal. When a master
senses that an ALERT condition is present on the ALERT line, the master sends an SMBus Alert command
(00011001) on the bus. If the ALERT pin of the TMP101 device is active, the TMP101 device acknowledges the
SMBus Alert command and responds by returning its slave address on the SDA line. The eighth bit (LSB) of the
slave address byte indicates if the temperature exceeding THIGH or falling below TLOW caused the ALERT
condition. For POL = 0, this bit is LOW if the temperature is greater than or equal to THIGH. This bit is HIGH if
the temperature is less than TLOW. The polarity of this bit is inverted if POL = 1; see Figure 9 for details of this
sequence.
If multiple devices on the bus respond to the SMBus Alert command, arbitration during the slave address portion
of the SMBus alert command determine which device clears its ALERT status. If the TMP101 device wins the
arbitration, its ALERT pin becomes inactive at the completion of the SMBus Alert command. If the TMP101 loses
the arbitration, its ALERT pin remains active.
The TMP100 device also responds to the SMBus ALERT command if its TM bit is set to 1. Because the device
does not have an ALERT pin, the device must periodically poll the device by issuing an SMBus Alert command.
If the TMP100 device generates an ALERT, the device acknowledges the SMBus Alert command and returns its
slave address in the next byte.
7.3.2.6 General Call
The TMP100 and TMP101 devices respond to the I2C General Call address (0000000) if the eighth bit is 0. The
device acknowledges the General Call address and responds to commands in the second byte. If the second
byte is 00000100, the TMP100 and TMP101 devices latch the status of their address pins, but do not reset. If the
second byte is 00000110, the TMP100 and TMP101 devices latch the status of their address pins and reset their
internal registers.
7.3.2.7 High-Speed Mode
In order for the I2C bus to operate at frequencies above 400 kHz, the master device must issue an Hs-mode
master code (00001XXX) as the first byte after a START condition to switch the bus to high-speed operation.
The TMP100 and TMP101 devices do not acknowledge this byte as required by the I2C specification, but do
switch their input filters on SDA and SCL and their output filters on SDA to operate in Hs-mode, allowing
transfers at up to 2 MHz. After the Hs-mode master code is issued, the master transmits an I2C slave address to
initiate a data transfer operation. The bus continues to operate in Hs-mode until a STOP condition occurs on the
bus. Upon receiving the STOP condition, the TMP100 and TMP101 devices switch the input and output filter
back to fast-mode operation.
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7.3.2.8 POR (Power-On Reset)
The TMP100 and TMP101 devices both have on-chip, power-on reset circuits that reset the device to default
settings when the device is powered on. This circuit activates when the power supply is less than 0.3 V for more
than 100 ms. If the TMP100 and TMP101 devices are powered down by removing supply voltage from the
device, but the supply voltage is not assured to be less than 0.3 V, TI recommends issuing a General Call reset
command on the I2C interface bus to ensure that the TMP100 and TMP101 devices are completely reset.
7.3.3 Timing Diagrams
The TMP100 and TMP101 devices are Two-Wire, SMBUs, and I2C interface-compatible. Figure 6 to Figure 9
describe the various operations on the TMP100 and TMP101. The following list provides bus definitions.
Parameters for Figure 6 are defined in the Timing Requirements section.
Bus Idle: Both SDA and SCL lines remain HIGH.
Start Data Transfer: A change in the state of the SDA line, from HIGH to LOW, while the SCL line is HIGH,
defines a START condition. Each data transfer is initiated with a START condition.
Stop Data Transfer: A change in the state of the SDA line from LOW to HIGH while the SCL line is HIGH
defines a STOP condition. Each data transfer is terminated with a repeated START or STOP condition.
Data Transfer: The number of data bytes transferred between a START and a STOP condition is not limited and
is determined by the master device. The receiver acknowledges the transfer of data.
Acknowledge: Each receiving device, when addressed, is obliged to generate an Acknowledge bit. A device
that acknowledges must pull down the SDA line during the Acknowledge clock pulse in such a way that the SDA
line is stable LOW during the HIGH period of the Acknowledge clock pulse. Setup and hold times must be taken
into account. On a master receive, the termination of the data transfer can be signaled by the master generating
a Not-Acknowledge on the last byte that is transmitted by the slave.
t(LOW)
tFC
t(HDSTA)
tRC
SCL
t(HDSTA)
t(HIGH)
t(HDDAT)
t(SUSTO)
t(SUSTA)
t(SUDAT)
SDA
t(BUF)
P
tRD
S
tFD
S
P
Figure 6. I2C Timing Diagram
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1
9
1
9
…
SCL
1
SDA
0
0
1
A2
A1
A0
Start By
Master
R/W
0
0
0
0
0
0
P1
ACK By
TMP100 or TMP101
…
P0
ACK By
TMP100 or TMP101
Frame 1 I2C Slave Address Byte
Frame 2 Pointer Register Byte
1
1
9
9
SCL
(Continued)
SDA
(Continued)
D7
D6
D5
D4
D3
D2
D1
D7
D0
D6
D5
D4
D3
D2
D1
D0
ACK By
Stop By
TMP100 or TMP101 Master
ACK By
TMP100 orTMP101
Frame 3 Data Byte 1
Frame 4 Data Byte 2
Figure 7. I2C Timing Diagram for Write Word Format
1
9
1
9
…
SCL
SDA
1
0
0
1
A2
A1
A0
R/W
Start By
Master
0
0
0
0
0
0
P1
ACK By
TMP100 or TMP101
…
P0
ACK By
TMP100 or TMP101
Frame 1 I2C Slave Address Byte
Frame 2 Pointer Register Byte
1
9
1
9
…
SCL
(Continued)
SDA
(Continued)
1
0
0
1
A2
A1
A0
R/W
Start By
Master
D7
D6
D5
ACK By
TMP100 or TMP101
Frame 3 I2C Slave Address Byte
1
D4
D3
D2
D1
D0
From
TMP100 or TMP101
…
ACK By
Master
Frame 4 Data Byte 1 Read Register
9
SCL
(Continued)
SDA
(Continued)
D7
D6
D5
D4
D3
D2
D1
D0
From
TMP100 or TMP101
ACK By
Master
Stop By
Master
Frame 5 Data Byte 2 Read Register
Figure 8. I2C Timing Diagram for Read Word Format
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ALERT
1
9
1
9
SCL
SDA
0
0
0
1
Start By
Master
1
0
0
R/W
1
0
0
1
ACK By
TMP100 or TMP101
Frame 1 SMBus ALERT Response Address Byte
A2
A1
A0
S ta tu s
From
NACK By
TMP100 orTMP101 Master
Stop By
Master
Frame 2 Slave Address From TMP100
Figure 9. Timing Diagram for SMBus ALERT
7.4 Device Functional Modes
7.4.1 Shutdown Mode (SD)
The Shutdown Mode of the TMP100 and TMP101 devices lets the user save maximum power by shutting down
all device circuitry other than the serial interface, which reduces current consumption to less than 1 µA. For the
TMP100 and TMP101 devices, Shutdown Mode is enabled when the SD bit is 1. The device shuts down when
the current conversion is completed. For SD equal to 0, the device maintains continuous conversion.
7.4.2 OS/ALERT (OS)
The TMP100 and TMP101 devices feature a One-Shot Temperature Measurement Mode. When the device is in
Shutdown Mode, writing 1 to the OS/ALERT bit starts a single temperature conversion. The device returns to the
shutdown state at the completion of the single conversion. This feature is useful to reduce power consumption in
the TMP100 and TMP101 devices when continuous monitoring of temperature is not required.
Reading the OS/ALERT bit provides information about the Comparator Mode status. The state of the POL bit
inverts the polarity of data returned from the OS/ALERT bit. For POL = 0, the OS/ALERT reads as 1 until the
temperature equals or exceeds THIGH for the programmed number of consecutive faults, causing the OS/ALERT
bit to read as 0. The OS/ALERT bit continues to read as 0 until the temperature falls below TLOW for the
programmed number of consecutive faults when the OS/ALERT bit again reads as 1. The status of the TM bit
does not affect the status of the OS/ALERT bit.
7.4.3 Thermostat Mode (TM)
The Thermostat Mode bit of the TMP101 device indicates to the device whether to operate in Comparator Mode
(TM = 0) or Interrupt Mode (TM = 1). For more information on comparator and interrupt modes, see the Highand Low-Limit Registers section.
7.4.3.1 Comparator Mode (TM = 0)
In Comparator Mode (TM = 0), the ALERT pin is activated when the temperature equals or exceeds the value in
the THIGH register and remains active until the temperature falls below the value in the TLOW register. For more
information on the Comparator Mode, see the High- and Low-Limit Registers section.
7.4.3.2 Interrupt Mode (TM = 1)
In Interrupt Mode (TM = 1), the ALERT pin is activated when the temperature exceeds THIGH or goes below the
TLOW registers. The ALERT pin is cleared when the host controller reads the temperature register. For more
information on the interrupt mode, see the High- and Low-Limit Registers section.
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7.5 Programming
7.5.1 Pointer Register
Figure 10 shows the internal register structure of the TMP100 and TMP101 devices. The 8-bit Pointer Register of
the TMP100 and TMP101 devices is used to address a given data register. The Pointer Register uses the two
LSBs to identify which of the data registers respond to a read or write command. Table 4 identifies the bits of the
Pointer Register byte. Table 5 describes the pointer address of the registers available in the TMP100 and
TMP101 devices. The power-up reset value of P1 and P0 is 00.
Pointer
Register
Temperature
Register
SCL
Configuration
Register
I/O
Control
Interface
TLOW
Register
SDA
THIGH
Register
Figure 10. Internal Register Structure of the TMP100 and TMP101
7.5.1.1 Pointer Register Byte (pointer = N/A) [reset = 00h]
Table 4. Pointer Register Byte
P7
P6
P5
P4
P3
P2
0
0
0
0
0
0
P1
P0
Register Bits
7.5.1.2 Pointer Addresses of the TMP100 and TMP101 Registers
Table 5. Pointer Addresses of the TMP100 and TMP101 Registers
P1
P0
TYPE
REGISTER
0
0
R only, default
Temperature Register
0
1
R/W
Configuration Register
1
0
R/W
TLOW Register
1
1
R/W
THIGH Register
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7.5.2 Temperature Register
The Temperature Register of the TMP100 or TMP101 devices is a 12-bit, read-only register that stores the
output of the most recent conversion. Two bytes must be read to obtain data, and are described in Table 6 and
Table 7. The first 12 bits are used to indicate temperature, with all remaining bits equal to zero. Data format for
temperature is summarized in Table 1. Following power-up or reset, the Temperature Register reads 0°C until
the first conversion is complete.
Table 6. Byte 1 of the Temperature Register
D7
D6
D5
D4
D3
D2
D1
D0
T11
T10
T9
T8
T7
T6
T5
T4
Table 7. Byte 2 of the Temperature Register
D7
D6
D5
D4
D3
D2
D1
D0
T3
T2
T1
T0
0
0
0
0
7.5.3 Configuration Register
The Configuration Register is an 8-bit read and write register used to store bits that control the operational
modes of the temperature sensor. Read and write operations are performed MSB-first. The format of the
Configuration Register for the TMP100 and TMP101 devices is shown in Table 8, followed by a breakdown of the
register bits. The power-up or reset value of the Configuration Register is all bits equal to 0. The OS/ALERT bit
reads as 1 after power-up or reset value.
Table 8. Configuration Register Format
BYTE
D7
D6
D5
D4
D3
D2
D1
D0
1
OS/ALERT
R1
R0
F1
F0
POL
TM
SD
7.5.3.1 Shutdown Mode (SD)
The Shutdown Mode of the TMP100 and TMP101 devices allows the user to save maximum power by shutting
down all device circuitry other than the serial interface, which reduces current consumption to less than 1 µA. For
the TMP100 and TMP101 devices, Shutdown Mode is enabled when the SD bit is 1. The device shuts down
when the current conversion is completed. For SD equal to 0, the device maintains continuous conversion.
7.5.3.2 Thermostat Mode (TM)
The Thermostat Mode bit of the TMP101 device indicates to the device whether to operate in Comparator Mode
(TM = 0) or Interrupt Mode (TM = 1). For more information on comparator and interrupt modes, see High- and
Low-Limit Registers.
7.5.3.3 Polarity (POL)
The Polarity bit of the TMP101 device lets the user adjust the polarity of the ALERT pin output. If the POL bit is
set to 0 (default), the ALERT pin becomes active low. When the POL bit is set to 1, the ALERT pin becomes
active high and the state of the ALERT pin is inverted. The operation of the ALERT pin in various modes is
illustrated in Figure 11.
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THIGH
Measured
Temperature
TLOW
TMP101 ALERT PIN
(Comparator Mode)
POL = 0
TMP101 ALERT PIN
(Interrupt Mode)
POL = 0
TMP101 ALERT PIN
(Comparator Mode)
POL = 1
TMP101 ALERT PIN
(Interrupt Mode)
POL = 1
Read
Read
Read
Time
Figure 11. Output Transfer Function Diagrams
7.5.3.4 Fault Queue (F1, F0)
A fault condition occurs when the measured temperature exceeds the user-defined limits set in the THIGH and
TLOW Registers. Additionally, the number of fault conditions required to generate an alert can be programmed
using the Fault Queue. The Fault Queue is provided to prevent a false alert resulting from environmental noise.
The Fault Queue requires consecutive fault measurements in order to trigger the alert function. If the temperature
falls below TLOW before reaching the number of programmed consecutive faults limit, the count is reset to 0.
Table 9 defines the number of measured faults that can be programmed to trigger an alert condition in the
device.
Table 9. Fault Settings of the TMP100 and TMP101
F1
F0
CONSECUTIVE FAULTS
0
0
1
0
1
2
1
0
4
1
1
6
7.5.3.5 Converter Resolution (R1, R0)
The Converter Resolution bits control the resolution of the internal analog-to-digital converter (ADC), thus
allowing the user to maximize efficiency by programming for higher resolution or faster conversion time. Table 10
identifies the Resolution bits and the relationship between resolution and conversion time.
Table 10. Resolution of the TMP100 and TMP101
RESOLUTION
CONVERSION TIME
(Typical)
0
9 bits (0.5°C)
40 ms
1
10 bits (0.25°C)
80 ms
1
0
11 bits (0.125°C)
160 ms
1
1
12 bits (0.0625°C)
320 ms
R1
R0
0
0
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7.5.3.6 OS/ALERT (OS)
The TMP100 and TMP101 devices feature a One-Shot Temperature Measurement Mode. When the device is in
Shutdown Mode, writing 1 to the OS/ALERT bit starts a single temperature conversion. The device returns to the
shutdown state at the completion of the single conversion. This feature is useful to reduce power consumption in
the TMP100 and TMP101 when continuous temperature monitoring is not required.
Reading the OS/ALERT bit provides information about the Comparator Mode status. The state of the POL bit
inverts the polarity of data returned from the OS/ALERT bit. For POL = 0, the OS/ALERT reads as 1 until the
temperature equals or exceeds THIGH for the programmed number of consecutive faults, causing the OS/ALERT
bit to read as 0. The OS/ALERT bit continues to read as 0 until the temperature falls below TLOW for the
programmed number of consecutive faults when the OS/ALERT bit again reads as 1. The status of the TM bit
does not affect the status of the OS/ALERT bit.
7.5.4 High- and Low-Limit Registers
In Comparator Mode (TM = 0), the ALERT pin of the TMP101 becomes active when the temperature equals or
exceeds the value in THIGH and generates a consecutive number of faults according to fault bits F1 and F0. The
ALERT pin remains active until the temperature falls below the indicated TLOW value for the same number of
faults.
In Interrupt Mode (TM = 1) the ALERT pin becomes active when the temperature equals or exceeds THIGH for a
consecutive number of fault conditions. The ALERT pin remains active until a read operation of any register
occurs or the device successfully responds to the SMBus Alert Response Address. The ALERT pin is also
cleared if the device is placed in Shutdown Mode. When the ALERT pin is cleared, it only becomes active again
by the temperature falling below TLOW. When the temperature falls below TLOW, the ALERT pin becomes active
and remains active until cleared by a read operation of any register or a successful response to the SMBus Alert
Response Address. When the ALERT pin is cleared, the above cycle repeats with the ALERT pin becoming
active when the temperature equals or exceeds THIGH. The ALERT pin can also be cleared by resetting the
device with the General Call Reset command. This action also clears the state of the internal registers in the
device, returning the device to Comparator Mode (TM = 0).
Both operational modes are represented in Figure 11. Table 11, Table 12, Table 13, and Table 14 describe the
format for the THIGH and TLOW registers. Power-up reset values for THIGH and TLOW are: THIGH = 80°C and TLOW =
75°C. The format of the data for THIGH and TLOW is the same as for the Temperature Register.
Table 11. Byte 1 of the THIGH Register
D7
D6
D5
D4
D3
D2
D1
D0
H11
H10
H9
H8
H7
H6
H5
H4
Table 12. Byte 2 of the THIGH Register
D7
D6
D5
D4
D3
D2
D1
D0
H3
H2
H1
H0
0
0
0
0
Table 13. Byte 1 of the TLOW Register
D7
D6
D5
D4
D3
D2
D1
D0
L11
L10
L9
L8
L7
L6
L5
L4
Table 14. Byte 2 of the TLOW Register
D7
D6
D5
D4
D3
D2
D1
D0
L3
L2
L1
L0
0
0
0
0
All 12 bits for the Temperature, THIGH, and TLOW registers are used in the comparisons for the ALERT function for
all converter resolutions. The three LSBs in THIGH and TLOW can affect the ALERT output even if the converter is
configured for 9-bit resolution.
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The TMP100 and TMP101 devices are used to measure the printed circuit board (PCB) temperature of the board
location where the devices are mounted. The TMP100 features two address pins to allow up to eight devices to
be addressed on a single I2C interface. The TMP101 device features one address pin and an ALERT pin,
allowing up to three devices to be connected per bus. The TMP100 and TMP101 devices require no external
components for operation except for pullup resistors on SCL, SDA, and ALERT (TMP101 device), although a
0.1-μF bypass capacitor is recommended.
The sensing device of the TMP100 and TMP101 devices is the chip itself. Thermal paths run through the
package leads as well as the plastic package. The die flag of the lead frame is connected to GND. The lower
thermal resistance of metal causes the leads to provide the primary thermal path. The GND pin of the TMP100 or
TMP101 device is directly connected to the metal lead frame, and is the best choice for thermal input.
8.2 Typical Application
Supply Voltage
2.7 V to 5.5 V
Supply Voltage
2.7 V to 5.5 V
Supply Bypass
Capacitor
Pull-Up Resistors
Supply Bypass
Capacitor
Pull-Up Resistors
0.01 PF
5-k
TMP100
Two-Wire
Host Controller
1
2
3
0.01 PF
5-k
TMP101
SCL
SDA
GND
ADD0
ADD1
6
Two-Wire
Host Controller
5
1
2
4
3
V+
Figure 12. Typical Connections of the TMP100
SCL
SDA
GND
ADD0
ALERT
6
5
4
V+
Figure 13. Typical Connections of the TMP101
8.2.1 Design Requirements
The TMP100 and TMP101 devices require pullup resistors on the SCL, SDA, and ALERT (TMP101 device) pins.
The recommended value for the pullup resistor is 5-kΩ. In some applications, the pullup resistor can be lower or
higher than 5-kΩ but must not exceed 3 mA of current on the SCL and SDA pins, and must not exceed 4 mA on
the ALERT (TMP101) pin. A 0.1-μF bypass capacitor is recommended, as shown in Figure 12 and Figure 13.
The SCL, SDA, and ALERT lines can be pulled up to a supply that is equal to or higher than VS through the
pullup resistors. For the TMP100, to configure one of eight different addresses on the bus, connect ADD0 and
ADD1 to either the GND pin, V+ pin, or float. Float indicates the pin is left unconnected. For the TMP101 device,
to configure one of three different addresses on the bus, connect ADD0 to either the GND pin, V+ pin, or float.
8.2.2 Detailed Design Procedure
Place the TMP100 and TMP101 devices in close proximity to the heat source that must be monitored, with a
proper layout for good thermal coupling. This placement ensures that temperature changes are captured within
the shortest possible time interval. To maintain accuracy in applications that require air or surface temperature
measurement, care must be taken to isolate the package and leads from ambient air temperature. A thermallyconductive adhesive is helpful in achieving accurate surface temperature measurement.
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Typical Application (continued)
8.2.3 Application Curve
Temperature (qC)
Figure 14 shows the step response of the TMP100 and TMP101 devices to a submersion in an oil bath of 100ºC
from room temperature (27ºC). The time constant, or the time for the output to reach 63% of the input step, is
0.9 s. The time-constant result depends on the PCB that the TMP100 and TMP101 devices are mounted. For
this test, the TMP100 and TMP101 devices are soldered to a two-layer PCB that measures 0.375 inch × 0.437
inch.
100
95
90
85
80
75
70
65
60
55
50
45
40
35
30
25
-1
1
3
5
7
9
11
Time (s)
13
15
17
19
Figure 14. Temperature Step Response
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9 Power Supply Recommendations
The TMP100 and TMP101 devices operate with power supply in the range of 2.7 V to 5.5 V. A power-supply
bypass capacitor is required for stability; place this capacitor as close as possible to the supply and ground pins
of the device. A typical value for this supply bypass capacitor is 0.01 μF. Applications with noisy or highimpedance power supplies can require additional decoupling capacitors to reject power-supply noise.
10 Layout
10.1 Layout Guidelines
Place the power-supply bypass capacitor as close as possible to the supply and ground pins. The recommended
value of this bypass capacitor is 0.01 μF. Additional decoupling capacitance can be added to compensate for
noisy or high-impedance power supplies. Pull up the open-drain output pins SDA , SCL, and ALERT (TMP101)
through 5-kΩ pullup resistors.
10.2 Layout Examples
Via to Power or Ground Plane
Via to Internal Layer
Pull-Up Resistors
SCL
SDA
GND
ADD0
Supply Voltage
ADD1
V+
Supply Bypass
Capacitor
Ground Plane for
Thermal Coupling
to Heat Source
Serial Bus Traces
Heat Source
Figure 15. TMP100 Layout Example
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Layout Examples (continued)
Via to Power or Ground Plane
Via to Internal Layer
Pull-Up Resistors
SCL
SDA
GND
ADD0
ALERT
Supply Voltage
V+
Supply Bypass
Capacitor
Ground Plane for
Thermal Coupling
to Heat Source
Serial Bus Traces
Heat Source
Figure 16. TMP101 Layout Example
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11 Device and Documentation Support
11.1 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 15. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
TMP100
Click here
Click here
Click here
Click here
Click here
TMP101
Click here
Click here
Click here
Click here
Click here
11.2 Trademarks
SMBus is a trademark of NXP Semiconductors.
All other trademarks are the property of their respective owners.
11.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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15-Apr-2017
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
SN0312100DBVR
ACTIVE
SOT-23
DBV
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-55 to 125
T100
TMP100NA/250
ACTIVE
SOT-23
DBV
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
T100
TMP100NA/250G4
ACTIVE
SOT-23
DBV
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
T100
TMP100NA/3K
ACTIVE
SOT-23
DBV
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-55 to 125
T100
TMP100NA/3KG4
ACTIVE
SOT-23
DBV
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-55 to 125
T100
TMP101NA/250
ACTIVE
SOT-23
DBV
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-55 to 125
T101
TMP101NA/250G4
ACTIVE
SOT-23
DBV
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-55 to 125
T101
TMP101NA/3K
ACTIVE
SOT-23
DBV
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-55 to 125
T101
TMP101NA/3KG4
ACTIVE
SOT-23
DBV
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-55 to 125
T101
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
15-Apr-2017
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TMP100, TMP101 :
• Automotive: TMP101-Q1
• Enhanced Product: TMP100-EP
NOTE: Qualified Version Definitions:
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
• Enhanced Product - Supports Defense, Aerospace and Medical Applications
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
10-Jul-2018
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
TMP100NA/250
SOT-23
DBV
6
250
178.0
9.0
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
3.23
3.17
1.37
4.0
8.0
Q3
TMP100NA/3K
SOT-23
DBV
6
3000
178.0
9.0
3.23
3.17
1.37
4.0
8.0
Q3
TMP101NA/250
SOT-23
DBV
6
250
178.0
9.0
3.23
3.17
1.37
4.0
8.0
Q3
TMP101NA/3K
SOT-23
DBV
6
3000
178.0
9.0
3.23
3.17
1.37
4.0
8.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
10-Jul-2018
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TMP100NA/250
SOT-23
DBV
TMP100NA/3K
SOT-23
DBV
6
250
180.0
180.0
18.0
6
3000
180.0
180.0
18.0
TMP101NA/250
SOT-23
DBV
TMP101NA/3K
SOT-23
DBV
6
250
445.0
220.0
345.0
6
3000
445.0
220.0
345.0
Pack Materials-Page 2
PACKAGE OUTLINE
DBV0006A
SOT-23 - 1.45 mm max height
SCALE 4.000
SMALL OUTLINE TRANSISTOR
C
3.0
2.6
1.75
1.45
PIN 1
INDEX AREA
1
0.1 C
B
A
6
2X 0.95
1.9
1.45 MAX
3.05
2.75
5
2
4
0.50
6X
0.25
0.2
C A B
3
(1.1)
0.15
TYP
0.00
0.25
GAGE PLANE
8
TYP
0
0.22
TYP
0.08
0.6
TYP
0.3
SEATING PLANE
4214840/B 03/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.15 per side.
4. Leads 1,2,3 may be wider than leads 4,5,6 for package orientation.
5. Refernce JEDEC MO-178.
www.ti.com
EXAMPLE BOARD LAYOUT
DBV0006A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
6X (1.1)
1
6X (0.6)
6
SYMM
2
5
3
4
2X (0.95)
(R0.05) TYP
(2.6)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
EXPOSED METAL
EXPOSED METAL
0.07 MIN
ARROUND
0.07 MAX
ARROUND
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4214840/B 03/2018
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DBV0006A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
6X (1.1)
1
6X (0.6)
6
SYMM
2
5
3
4
2X(0.95)
(R0.05) TYP
(2.6)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
4214840/B 03/2018
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
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TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
permission to use these resources only for development of an application that uses the TI products described in the resource. Other
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Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2019, Texas Instruments Incorporated
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