Texas Instruments | LMx35, LMx35A Precision Temperature Sensors (Rev. E) | Datasheet | Texas Instruments LMx35, LMx35A Precision Temperature Sensors (Rev. E) Datasheet

Texas Instruments LMx35, LMx35A Precision Temperature Sensors (Rev. E) Datasheet
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LM135, LM135A, LM235, LM235A, LM335, LM335A
SNIS160E – MAY 1999 – REVISED FEBRUARY 2015
LMx35, LMx35A Precision Temperature Sensors
1 Features
3 Description
•
The LM135 series are precision, easily-calibrated,
integrated circuit temperature sensors. Operating as
a 2-terminal zener, the LM135 has a breakdown
voltage directly proportional to absolute temperature
at 10 mV/°K. With less than 1-Ω dynamic impedance,
the device operates over a current range of 400 μA to
5 mA with virtually no change in performance. When
calibrated at 25°C, the LM135 has typically less than
1°C error over a 100°C temperature range. Unlike
other sensors, the LM135 has a linear output.
1
•
•
•
•
•
•
•
Directly Calibrated to the Kelvin Temperature
Scale
1°C Initial Accuracy Available
Operates from 400 μA to 5 mA
Less than 1-Ω Dynamic Impedance
Easily Calibrated
Wide Operating Temperature Range
200°C Overrange
Low Cost
2 Applications
•
•
•
•
Power Supplies
Battery Management
HVAC
Appliances
Applications for the LM135 include almost any type of
temperature sensing over a −55°C to 150°C
temperature range. The low impedance and linear
output make interfacing to readout or control circuitry
are especially easy.
The LM135 operates over a −55°C to 150°C
temperature range while the LM235 operates over a
−40°C to 125°C temperature range. The LM335
operates from −40°C to 100°C. The LMx35 devices
are available packaged in hermetic TO transistor
packages while the LM335 is also available in plastic
TO-92 packages.
Device Information(1)
PART NUMBER
LM135
LM135A
LM235
LM235A
LM335
LM335A
PACKAGE
BODY SIZE (NOM)
TO-46 (3)
4.699 mm × 4.699 mm
TO-92 (3)
4.30 mm × 4.30 mm
SOIC (8)
4.90 mm × 3.91 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Basic Temperature Sensor Simplified Schematic
Calibrated Sensor
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM135, LM135A, LM235, LM235A, LM335, LM335A
SNIS160E – MAY 1999 – REVISED FEBRUARY 2015
www.ti.com
Table of Contents
1
2
3
4
5
6
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
4
4
4
Absolute Maximum Ratings ......................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Temperature Accuracy: LM135/LM235,
LM135A/LM235A .......................................................
6.5 Temperature Accuracy: LM335, LM335A (1)..............
6.6 Electrical Characteristics...........................................
6.7 Typical Characteristics ..............................................
7
4
5
5
6
Detailed Description .............................................. 8
7.1
7.2
7.3
7.4
Overview ...................................................................
Functional Block Diagram .........................................
Feature Description...................................................
Device Functional Modes..........................................
8
8
8
9
8
Application and Implementation ........................ 10
8.1 Application Information............................................ 10
8.2 Typical Application .................................................. 10
8.3 System Examples ................................................... 11
9 Power Supply Recommendations...................... 16
10 Layout................................................................... 16
10.1
10.2
10.3
10.4
Layout Guidelines .................................................
Layout Example ....................................................
Waterproofing Sensors .........................................
Mounting the Sensor at the End of a Cable..........
16
16
17
17
11 Device and Documentation Support ................. 18
11.1
11.2
11.3
11.4
11.5
Device Support......................................................
Related Links ........................................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
18
18
18
18
18
12 Mechanical, Packaging, and Orderable
Information ........................................................... 18
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision D (March 2013) to Revision E
•
Page
Added Pin Configuration and Functions section, Feature Description section, Device Functional Modes, Application
and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation
Support section, and Mechanical, Packaging, and Orderable Information section................................................................ 1
Changes from Revision C (November 2012) to Revision D
•
2
Page
Changed layout of National Data Sheet to TI format ........................................................................................................... 18
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SNIS160E – MAY 1999 – REVISED FEBRUARY 2015
5 Pin Configuration and Functions
TO-46 (NDV)
3 Pins
Bottom View
TO-92 (LP)
3 Pins
Bottom View
SOIC (D)
8 Pins
Top View
Pin Functions
PIN
NAME
TO-46
TO-92
SO8
—
—
1
—
—
2
—
—
3
–
—
—
ADJ
—
—
N.C.
N.C.
+
I/O
DESCRIPTION
—
No Connection
4
O
Negative output
—
5
I
Calibration adjust pin
—
6
—
—
7
—
—
8
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—
I
No Connection
Positive input
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1) (2) (3) (4)
MIN
Reverse Current
Forward Current
Storage temperature,
Tstg
(1)
(2)
(3)
(4)
MAX
UNIT
15
mA
10
mA
8-Pin SOIC Package
−65
150
°C
TO / TO-92 Package
−60
150
°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Refer to RETS135H for military specifications.
If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
Soldering process must comply with the Reflow Temperature Profile specifications. Refer to http://www.ti.com/packaging.
6.2 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
LM135, LM135A
Specified Temperature
LM235, LM235A
LM335, LM335A
Continuous (TMIN ≤ TA ≤ TMAX)
Intermittent
(1)
Continuous (TMIN ≤ TA ≤ TMAX)
Intermittent
(1)
Continuous (TMIN ≤ TA ≤ TMAX)
Intermittent
(1)
Forward Current
(1)
NOM
MAX
UNIT
−55
150
°C
150
200
−40
125
125
150
−40
100
100
125
0.4
1
°C
°C
5
mA
Continuous operation at these temperatures for 5,000 hours for LP package may decrease life expectancy of the device.
6.3 Thermal Information
THERMAL METRIC
(1)
RθJA
Junction-to-ambient thermal resistance
RθJC
Junction-to-case thermal resistance
(1)
LM335 /
LM335A
LM235 /
LM235A
LM135 /
LM135A
SOIC (D)
TO-92 (LP)
TO-46 (NDV)
8 PINS
3 PINS
3 PINS
165
202
400
—
170
—
UNIT
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
6.4 Temperature Accuracy: LM135/LM235, LM135A/LM235A (1)
PARAMETER
TEST CONDITIONS
LM135A/LM235A
LM135/LM235
MIN
TYP MAX
MIN
TYP MAX
2.97
2.95
UNIT
Operating Output Voltage
TC = 25°C, IR = 1 mA
2.98
2.99
2.98
3.01
V
Uncalibrated Temperature Error
TC = 25°C, IR = 1 mA
0.5
1
1
3
°C
Uncalibrated Temperature Error
TMIN ≤ TC ≤ TMAX, IR = 1
mA
1.3
2.7
2
5
°C
Temperature Error with 25°C
TMIN ≤ TC ≤ TMAX, IR = 1
mA
0.3
1
0.5
1.5
°C
Calibration
Calibrated Error at Extended
TC = TMAX (Intermittent)
Temperature
Non-Linearity
IR = 1 mA
0.5
0.3
(1)
4
2
0.3
2
°C
1
°C
Accuracy measurements are made in a well-stirred oil bath. For other conditions, self heating must be considered.
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6.5 Temperature Accuracy: LM335, LM335A (1)
PARAMETER
LM335A
TEST CONDITIONS
LM335
MIN
TYP MAX
MIN
TYP MAX
2.95
2.92
UNIT
Operating Output Voltage
TC = 25°C, IR = 1 mA
2.98
3.01
2.98
3.04
V
Uncalibrated Temperature Error
TC = 25°C, IR = 1 mA
1
3
2
6
°C
Uncalibrated Temperature Error
TMIN ≤ TC ≤ TMAX, IR = 1
mA
2
5
4
9
°C
Temperature Error with 25°C
TMIN ≤ TC ≤ TMAX, IR = 1
mA
0.5
1
1
2
°C
Calibration
Calibrated Error at Extended
TC = TMAX (Intermittent)
Temperature
Non-Linearity
IR = 1 mA
1.5
0.3
(1)
2
0.3
2
°C
1.5
°C
Accuracy measurements are made in a well-stirred oil bath. For other conditions, self heating must be considered.
6.6 Electrical Characteristics
See
(1)
.
PARAMETER
TEST CONDITIONS
LM135/LM235/LM135A/LM
235A
MIN
TYP
MAX
10
LM335/LM335A
UNIT
MIN
TYP
MAX
3
14
Operating Output Voltage Change
with Current
400 μA ≤ IR ≤ 5 mA, At
Constant Temperature
2.5
Dynamic Impedance
IR = 1 mA
0.5
0.6
Ω
10
10
mV/°C
Still Air
80
80
sec
100 ft/Min Air
10
10
sec
1
1
0.2
0.2
Output Voltage Temperature
Coefficient
Time Constant
Stirred Oil
Time Stability
(1)
TC = 125°C
mV
sec
°C/khr
Accuracy measurements are made in a well-stirred oil bath. For other conditions, self heating must be considered.
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6.7 Typical Characteristics
6
Figure 1. Reverse Voltage Change
Figure 2. Calibrated Error
Figure 3. Reverse Characteristics
Figure 4. Response Time
Figure 5. Dynamic Impedance
Figure 6. Noise Voltage
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Typical Characteristics (continued)
Figure 7. Thermal Resistance Junction To Air
Figure 8. Thermal Time Constant
Figure 9. Thermal Response In Still Air
Figure 10. Thermal Response In Stirred Oil Bath
Figure 11. Forward Characteristics
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7 Detailed Description
7.1 Overview
Applications for the LM135 include almost any type of temperature sensing over a −55°C to 150°C temperature
range. The low impedance and linear output make interfacing to readout or control circuitry especially easy.
The LM135 operates over a −55°C to 150°C temperature range while the LM235 operates over a −40°C to
125°C temperature range. The LM335 operates from −40°C to 100°C.
Operating as a 2-terminal zener, the LM135 has a breakdown voltage directly proportional to absolute
temperature at 10 mV/°K. With less than 1-Ω dynamic impedance, the device operates over a current range of
400 μA to 5 mA with virtually no change in performance. When calibrated at 25°C, the LM135 has typically less
than 1°C error over a 100°C temperature range. Unlike other sensors, the LM135 has a linear output.
7.2 Functional Block Diagram
7.3 Feature Description
7.3.1 Temperature Calibration Using ADJ Pin
Included on the LM135 chip is an easy method of calibrating the device for higher accuracies. A pot connected
across the LM135 with the arm tied to the adjustment terminal (as shown in Figure 12) allows a 1-point
calibration of the sensor that corrects for inaccuracy over the full temperature range.
This single point calibration works because the output of the LM135 is proportional to absolute temperature with
the extrapolated output of sensor going to 0-V output at 0 K (−273.15°C). Errors in output voltage versus
temperature are only slope (or scale factor) errors so a slope calibration at one temperature corrects at all
temperatures.
The output of the device (calibrated or uncalibrated) can be expressed as:
where
8
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Feature Description (continued)
•
•
T is the unknown temperature in degrees Kelvin
To is a reference temperature in degrees Kelvin
(1)
By calibrating the output to read correctly at one temperature the output at all temperatures is correct. Nominally
the output is calibrated at 10 mV/K.
Calibrate for 2.982V at 25°C
Figure 12. Calibrated Sensor
7.4 Device Functional Modes
The LM135 has two functional modes calibrated and uncalibrated. For optimum accuracy, a one point calibration
is recommended. For more information on calibration, see Temperature Calibration Using ADJ Pin.
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
To insure good sensing accuracy, several precautions must be taken. Like any temperature-sensing device, selfheating can reduce accuracy. The LM135 should be operated at the lowest current suitable for the application.
Sufficient current, of course, must be available to drive both the sensor and the calibration pot at the maximum
operating temperature as well as any external loads.
If the sensor is used in an ambient where the thermal resistance is constant, self-heating errors can be calibrated
out. This is possible if the device is run with a temperature-stable current. Heating will then be proportional to
zener voltage and therefore temperature. This makes the self-heating error proportional to absolute temperature
the same as scale factor errors.
8.2 Typical Application
Figure 13. Basic Temperature Sensor
8.2.1 Design Requirements
Table 1. Design Parameters
PARAMETER
Accuracy at 25°C
Accuracy from –55 °C to 150 °C
Forward Current
Temperature Slope
EXAMPLE VALUE
±1°C
±2.7°C
1 mA
10m V/K
8.2.2 Detailed Design Procedure
For optimum accuracy, R1 is picked such that 1 mA flows through the sensor. Additional error can be introduced
by varying load currents or varying supply voltage. The influence of these currents on the minimum and
maximum reverse current flowing through the LM135 should be calculated and be maintained in the range of 0.4
mA to 5 mA. Minimizing the current variation through the LM135 will provide for the best accuracy. The
Operating Output Voltage Change with Current specification can be used to calculate the additional error which
could be up to 1 K maximum from the LM135A, for example.
10
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8.2.3 Application Curve
Figure 14. Reverse Characteristics
8.3 System Examples
Figure 15. Wide Operating Supply
Figure 16. Minimum Temperature Sensing
Wire length for 1°C error due to wire drop
Figure 17. Average Temperature Sensing
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Figure 18. Isolated Temperature Sensor
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System Examples (continued)
Figure 19. Simple Temperature Controller
Adjust R2 for 2.554V across LM336.
Figure 20. Simple Temperature Control
Adjust for 2.7315V at output of LM308
Adjust R1 for correct output.
Figure 21. Ground Referred Fahrenheit
Thermometer
Figure 22. Centigrade Thermometer
To calibrate adjust R2 for 2.554V across LM336.
Adjust R1 for correct output.
Figure 23. Fahrenheit Thermometer
12
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System Examples (continued)
8.3.1 Thermocouple Cold Junction Compensation
Compensation for Grounded Thermocouple
Select R3 for proper thermocouple type
Figure 24. Thermocouple Cold Junction Compensation
THERMO-COUPLE
R3 (±1%)
SEEBECK COEFFICIENT
J
377 Ω
52.3 μV/°C
T
308 Ω
42.8 μV/°C
K
293 Ω
40.8 μV/°C
S
45.8 Ω
6.4 μV/°C
Adjustments: Compensates for both sensor and resistor tolerances
1. Short LM329B
2. Adjust R1 for Seebeck Coefficient times ambient temperature (in degrees K) across R3.
3. Short LM335 and adjust R2 for voltage across R3 corresponding to thermocouple type.
J
14.32 mV K
11.17 mV
T
11.79 mV S
1.768 mV
1.
2.
THERMO-COUPLE
R3
R4
SEEBECK COEFFICIENT
J
1.05K
385Ω
52.3 μV/°C
T
856Ω
315Ω
42.8 μV/°C
K
816Ω
300Ω
40.8 μV/°C
S
128Ω
46.3Ω
6.4 μV/°C
Adjustments:
Adjust R1 for the voltage across R3 equal to the Seebeck Coefficient times ambient temperature in degrees Kelvin.
Adjust R2 for voltage across R4 corresponding to thermocouple.
J
14.32 mV
T
11.79 mV
K
11.17 mV
S
1.768 mV
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Terminate thermocouple reference junction in close
proximity to LM335.
Adjustments:
1. Apply signal in place of thermocouple and adjust
R3 for a gain of 245.7.
Select R3 and R4 for thermocouple type
2. Short non-inverting input of LM308A and output of
LM329B to ground.
3. Adjust R1 so that VOUT = 2.982V @ 25°C.
4. Remove short across LM329B and adjust R2 so
that VOUT = 246 mV @ 25°C.
5. Remove short across thermocouple.
14
Figure 25. Single Power Supply Cold Junction
Compensation
Figure 26. Centigrade Calibrated Thermocouple
Thermometer
Figure 27. Differential Temperature Sensor
Figure 28. Differential Temperature Sensor
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SNIS160E – MAY 1999 – REVISED FEBRUARY 2015
Adjust D1 to 50 mV greater VZ than D2.
Charge terminates on 5°C temperature rise.
Couple D2 to battery.
Adjust for zero with sensor at 0°C and 10T pot set at
0°C
Adjust for zero output with 10T pot set at 100°C and
sensor at 100°C
Output reads difference between temperature and
dial setting of 10T pot
Figure 29. Fast Charger For Nickel-Cadmium
Batteries
Figure 30. Variable Offset Thermometer
*Self heating is used to detect air flow
Figure 31. Ground Referred Centigrade
Thermometer
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Figure 32. Air Flow Detector
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9 Power Supply Recommendations
Ensure the LM335 is biased properly with a current ranging 0.4 mA to 5 mA.
10 Layout
10.1 Layout Guidelines
The LM135 is applied easily in the same way as other integrated-circuit temperature sensors. Glue or cement the
device to a surface and the temperature should be within about 0.01°C of the surface temperature.
Efficient temperature transfer assumes that the ambient air temperature is almost the same as the surface
temperature where the LM135 leads are attached. If there is a great difference between the air temperature and
the surface temperature, the actual temperature of the LM135 die would be at an intermediate temperature
between the two temperatures. For example, the TO-92 plastic package, where the copper leads are the
principal thermal path to carry heat into the device, can be greatly affected by airflow. The temperature sensed
by the TO92 package could greatly depend on velocity of the airflow as well.
To lessen the affect of airflow, ensure that the wiring to the LM135 (leads and wires connected to the leads) is
held at the same temperature as the surface temperature that is targeted for measurement. To insure that the
temperature of the LM135 die is not affected by the air temperature, mechanically connect the LM135 leads with
a bead of epoxy to the surface being measured. If air temperature is targeted for measurement ensure that the
PCB surface temperature is close to the air temperature. Keep the LM135 away from offending PCB heat
sources such as power regulators. One method commonly used for thermal isolation is to route a thermal well as
shown in Figure 33 with the smallest possible geometry traces connecting back to rest of the PCB.
10.2 Layout Example
VIA to ground plane
VIA to power plane
ADJ
-
N.C.
N.C.
N.C.
N.C.
+
N.C.
R1
Figure 33. Layout Example
16
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10.3 Waterproofing Sensors
Meltable inner-core, heat-shrinkable tubing, such as manufactured by Raychem, can be used to make low-cost
waterproof sensors. The LM335 is inserted into the tubing about 0.5 inches from the end and the tubing heated
above the melting point of the core. The unfilled 0.5-inch end melts and provides a seal over the device.
10.4 Mounting the Sensor at the End of a Cable
The main error due to a long wire is caused by the voltage drop across that wire caused by the reverse current
biasing the LM135 on. Table 2 shows the wire AWG and the length of wire that would cause 1°C error.
Figure 34. Cable Connected Temperature Sensor
Table 2. Wire Length for 1°C Error Due to Wire Drop
(1)
IR = 1 mA
IR = 0.5 mA (1)
AWG
FEET
FEET
14
4000
8000
16
2500
5000
18
1600
3200
20
1000
2000
22
625
1250
24
400
800
For IR = 0.5 mA, the trim pot must be deleted.
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11 Device and Documentation Support
11.1 Device Support
11.1.1 Device Nomenclature
Operating Output Voltage: The voltage appearing across the positive and negative terminals of the device at
specified conditions of operating temperature and current.
Uncalibrated Temperature Error: The error between the operating output voltage at 10 mV/°K and case
temperature at specified conditions of current and case temperature.
Calibrated Temperature Error: The error between operating output voltage and case temperature at 10 mV/°K
over a temperature range at a specified operating current with the 25°C error adjusted to zero.
11.2 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 3. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
LM135
Click here
Click here
Click here
Click here
Click here
LM135A
Click here
Click here
Click here
Click here
Click here
LM235
Click here
Click here
Click here
Click here
Click here
LM235A
Click here
Click here
Click here
Click here
Click here
LM335
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LM335A
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11.3 Trademarks
All trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
18
Submit Documentation Feedback
Copyright © 1999–2015, Texas Instruments Incorporated
Product Folder Links: LM135 LM135A LM235 LM235A LM335 LM335A
PACKAGE OPTION ADDENDUM
www.ti.com
19-Apr-2019
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM135AH
ACTIVE
TO
NDV
3
500
TBD
Call TI
Call TI
-55 to 150
( LM135AH, LM135AH
)
LM135AH/NOPB
ACTIVE
TO
NDV
3
500
Green (RoHS
& no Sb/Br)
Call TI
Level-1-NA-UNLIM
-55 to 150
( LM135AH, LM135AH
)
LM135H
ACTIVE
TO
NDV
3
500
TBD
Call TI
Call TI
-55 to 150
( LM135H, LM135H)
LM135H/NOPB
ACTIVE
TO
NDV
3
500
Green (RoHS
& no Sb/Br)
Call TI
Level-1-NA-UNLIM
-55 to 150
( LM135H, LM135H)
LM235AH
ACTIVE
TO
NDV
3
500
TBD
Call TI
Call TI
-40 to 125
( LM235AH, LM235AH
)
LM235AH/NOPB
ACTIVE
TO
NDV
3
500
Green (RoHS
& no Sb/Br)
Call TI
Level-1-NA-UNLIM
-40 to 125
( LM235AH, LM235AH
)
LM235H
ACTIVE
TO
NDV
3
500
TBD
Call TI
Call TI
-40 to 125
( LM235H, LM235H)
LM235H/NOPB
ACTIVE
TO
NDV
3
500
Green (RoHS
& no Sb/Br)
Call TI
Level-1-NA-UNLIM
-40 to 125
( LM235H, LM235H)
LM335A MWC
ACTIVE
WAFERSALE
YS
0
1
TBD
Call TI
Call TI
-40 to 85
LM335AH/NOPB
ACTIVE
TO
NDV
3
1000
Green (RoHS
& no Sb/Br)
Call TI
Level-1-NA-UNLIM
-40 to 100
( LM335AH, LM335AH
)
LM335AM
NRND
SOIC
D
8
95
TBD
Call TI
Call TI
-40 to 100
LM335
AM
LM335AM/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 100
LM335
AM
LM335AMX
NRND
SOIC
D
8
2500
TBD
Call TI
Call TI
-40 to 100
LM335
AM
LM335AMX/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 100
LM335
AM
LM335AZ/NOPB
ACTIVE
TO-92
LP
3
1800
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
-40 to 100
LM335
AZ
LM335H
ACTIVE
TO
NDV
3
1000
TBD
Call TI
Call TI
-40 to 100
( LM335H, LM335H)
LM335H/NOPB
ACTIVE
TO
NDV
3
1000
Green (RoHS
& no Sb/Br)
Call TI
Level-1-NA-UNLIM
-40 to 100
( LM335H, LM335H)
LM335M
NRND
SOIC
D
8
95
TBD
Call TI
Call TI
-40 to 100
LM335
M
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
19-Apr-2019
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM335M/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 100
LM335
M
LM335MX/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 100
LM335
M
LM335Z/LFT7
ACTIVE
TO-92
LP
3
2000
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
LM335Z/NOPB
ACTIVE
TO-92
LP
3
1800
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
LM335
Z
-40 to 100
LM335
Z
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
19-Apr-2019
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
29-Sep-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LM335AMX
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM335AMX/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM335MX/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
29-Sep-2019
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM335AMX
SOIC
D
8
2500
367.0
367.0
35.0
LM335AMX/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
LM335MX/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
Pack Materials-Page 2
PACKAGE OUTLINE
LP0003A
TO-92 - 5.34 mm max height
SCALE 1.200
SCALE 1.200
TO-92
5.21
4.44
EJECTOR PIN
OPTIONAL
5.34
4.32
(1.5) TYP
SEATING
PLANE
(2.54)
NOTE 3
2X
4 MAX
(0.51) TYP
6X
0.076 MAX
SEATING
PLANE
2X
2.6 0.2
3X
12.7 MIN
3X
3X
0.55
0.38
0.43
0.35
2X 1.27 0.13
FORMED LEAD OPTION
STRAIGHT LEAD OPTION
OTHER DIMENSIONS IDENTICAL
TO STRAIGHT LEAD OPTION
3X
2.67
2.03
4.19
3.17
3
2
1
3.43 MIN
4215214/B 04/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Lead dimensions are not controlled within this area.
4. Reference JEDEC TO-226, variation AA.
5. Shipping method:
a. Straight lead option available in bulk pack only.
b. Formed lead option available in tape and reel or ammo pack.
c. Specific products can be offered in limited combinations of shipping medium and lead options.
d. Consult product folder for more information on available options.
www.ti.com
EXAMPLE BOARD LAYOUT
LP0003A
TO-92 - 5.34 mm max height
TO-92
0.05 MAX
ALL AROUND
TYP
FULL R
TYP
METAL
TYP
(1.07)
3X ( 0.85) HOLE
2X
METAL
(1.5)
2X (1.5)
2
1
(R0.05) TYP
3
2X (1.07)
(1.27)
SOLDER MASK
OPENING
2X
SOLDER MASK
OPENING
(2.54)
LAND PATTERN EXAMPLE
STRAIGHT LEAD OPTION
NON-SOLDER MASK DEFINED
SCALE:15X
0.05 MAX
ALL AROUND
TYP
( 1.4)
2X ( 1.4)
METAL
3X ( 0.9) HOLE
METAL
(R0.05) TYP
2
1
(2.6)
SOLDER MASK
OPENING
3
2X
SOLDER MASK
OPENING
(5.2)
LAND PATTERN EXAMPLE
FORMED LEAD OPTION
NON-SOLDER MASK DEFINED
SCALE:15X
4215214/B 04/2017
www.ti.com
TAPE SPECIFICATIONS
LP0003A
TO-92 - 5.34 mm max height
TO-92
13.7
11.7
32
23
(2.5) TYP
0.5 MIN
16.5
15.5
11.0
8.5
9.75
8.50
19.0
17.5
6.75
5.95
2.9
TYP
2.4
3.7-4.3 TYP
13.0
12.4
FOR FORMED LEAD OPTION PACKAGE
4215214/B 04/2017
www.ti.com
PACKAGE OUTLINE
NDV0003H
TO-CAN - 2.67 mm max height
SCALE 1.250
TO-46
4.95
4.55
0.76 MAX
2.67 MAX
0.64 MAX
UNCONTROLLED
LEAD DIA
3X
12.7 MIN
3X
0.483
0.407
5.32-5.56
2
1
3
45
( 2.54)
1.16
0.92
1.22
0.72
4219876/A 01/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-46.
www.ti.com
EXAMPLE BOARD LAYOUT
NDV0003H
TO-CAN - 2.67 mm max height
TO-46
(2.54)
0.07 MAX
ALL AROUND
( 1.2)
METAL
3
3X ( 0.7) VIA
SOLDER MASK
OPENING
(1.27)
1
(R0.05) TYP
2X ( 1.2)
METAL
2
0.07 MAX
TYP
2X
SOLDER MASK
OPENING
LAND PATTERN EXAMPLE
NON-SOLDER MASK DEFINED
SCALE:12X
4219876/A 01/2017
www.ti.com
PACKAGE OUTLINE
D0008A
SOIC - 1.75 mm max height
SCALE 2.800
SMALL OUTLINE INTEGRATED CIRCUIT
C
SEATING PLANE
.228-.244 TYP
[5.80-6.19]
A
.004 [0.1] C
PIN 1 ID AREA
6X .050
[1.27]
8
1
2X
.150
[3.81]
.189-.197
[4.81-5.00]
NOTE 3
4X (0 -15 )
4
5
B
8X .012-.020
[0.31-0.51]
.010 [0.25]
C A B
.150-.157
[3.81-3.98]
NOTE 4
.069 MAX
[1.75]
.005-.010 TYP
[0.13-0.25]
4X (0 -15 )
SEE DETAIL A
.010
[0.25]
.004-.010
[0.11-0.25]
0 -8
.016-.050
[0.41-1.27]
DETAIL A
(.041)
[1.04]
TYPICAL
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
www.ti.com
EXAMPLE BOARD LAYOUT
D0008A
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
8X (.061 )
[1.55]
SYMM
SEE
DETAILS
1
8
8X (.024)
[0.6]
6X (.050 )
[1.27]
SYMM
5
4
(R.002 ) TYP
[0.05]
(.213)
[5.4]
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:8X
METAL
SOLDER MASK
OPENING
EXPOSED
METAL
.0028 MAX
[0.07]
ALL AROUND
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
EXPOSED
METAL
.0028 MIN
[0.07]
ALL AROUND
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4214825/C 02/2019
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
D0008A
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
8X (.061 )
[1.55]
SYMM
1
8
8X (.024)
[0.6]
6X (.050 )
[1.27]
SYMM
5
4
(R.002 ) TYP
[0.05]
(.213)
[5.4]
SOLDER PASTE EXAMPLE
BASED ON .005 INCH [0.125 MM] THICK STENCIL
SCALE:8X
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
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IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
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These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
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Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
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