Texas Instruments | LM6 2 2.7V, 15.6 mV/C SOT-23 Temperature Sensor (Rev. E) | Datasheet | Texas Instruments LM6 2 2.7V, 15.6 mV/C SOT-23 Temperature Sensor (Rev. E) Datasheet

Texas Instruments LM6 2 2.7V, 15.6 mV/C SOT-23 Temperature Sensor (Rev. E) Datasheet
LM62
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SNIS105E – JUNE 1999 – REVISED MARCH 2013
LM62 2.7V, 15.6 mV/°C SOT-23 Temperature Sensor
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FEATURES
DESCRIPTION
•
•
The LM62 is a precision integrated-circuit
temperature sensor that can sense a 0°C to +90°C
temperature range while operating from a single
+3.0V supply. The LM62's output voltage is linearly
proportional to Celsius (Centigrade) temperature
(+15.6 mV/°C) and has a DC offset of +480 mV. The
offset allows reading temperatures down to 0°C
without the need for a negative supply. The nominal
output voltage of the LM62 ranges from +480 mV to
+1884 mV for a 0°C to +90°C temperature range.
The LM62 is calibrated to provide accuracies of
±2.0°C at room temperature and +2.5°C/−2.0°C over
the full 0°C to +90°C temperature range.
1
2
•
Calibrated Linear Scale Factor of +15.6 mV/°C
Rated for Full 0°C to +90°C Range with 3.0V
Supply
Suitable for Remote Applications
APPLICATIONS
•
•
•
•
•
•
•
•
•
Cellular Phones
Computers
Power Supply Modules
Battery Management
FAX Machines
Printers
HVAC
Disk Drives
Appliances
KEY SPECIFICATIONS
•
•
•
•
•
•
Accuracy at 25°C ±2.0 or ±3.0°C (max)
Temperature Slope +15.6 mV/°C
Power Supply Voltage Range +2.7V to +10V
Current Drain @ 25°C 130 μA (max)
Nonlinearity ±0.8°C (max)
Output Impedance 4.7 kΩ (max)
Connection Diagram
The LM62's linear output, +480 mV offset, and factory
calibration simplify external circuitry required in a
single
supply
environment
where
reading
temperatures down to 0°C is required. Because the
LM62's quiescent current is less than 130 μA, selfheating is limited to a very low 0.2°C in still air.
Shutdown capability for the LM62 is intrinsic because
its inherent low power consumption allows it to be
powered directly from the output of many logic gates.
Typical Application
See Package Number DBZ
VO = (+15.6 mV/°C × T°C) + 480 mV
Figure 1. Full-Range Centigrade Temp. Sensor
(0°C to +90°C) Stabilizing a Crystal Oscillator
Temperature (T)
Typical VO
+90°C
+1884 mV
+70°C
+1572 mV
+25°C
870 mV
0°C
+480 mV
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1999–2013, Texas Instruments Incorporated
LM62
SNIS105E – JUNE 1999 – REVISED MARCH 2013
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Absolute Maximum Ratings (1)
Supply Voltage
+12V to −0.2V
Output Voltage
(+VS + 0.6V) to −0.6V
Output Current
10 mA
Input Current at any pin (2)
5 mA
−65°C to +150°C
Storage Temperature
Junction Temperature, max (TJMAX)
ESD Susceptibility (3)
+125°C
Human Body Model
2500V
Machine Model
(1)
(2)
(3)
250V
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
When the input voltage (VI) at any pin exceeds power supplies (VI < GND or VI > +VS), the current at that pin should be limited to 5 mA.
The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200 pF
capacitor discharged directly into each pin.
Operating Ratings (1)
Specified Temperature Range
TMIN ≤ TA ≤ TMAX
LM62B, LM62C
0°C ≤ TA ≤ +90°C
Supply Voltage Range (+VS)
+2.7V to +10V
Thermal Resistance, θJA (2)
450°C/W
Soldering process must comply with Texas Instruments' Reflow Temperature Profile specifications.
Refer to http://www.ti.com/packaging (3)
(1)
(2)
(3)
2
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
The junction to ambient thermal resistance (θJA) is specified without a heat sink in still air.
Reflow temperature profiles are different for lead-free and non-lead-free packages.
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Electrical Characteristics
Unless otherwise noted, these specifications apply for +VS = +3.0 VDC. Boldface limits apply for TA = TJ = TMIN to TMAX ; all
other limits TA = TJ = 25°C.
Parameter
Conditions
Typical (1)
Accuracy (3)
Output Voltage at 0°C
Sensor Gain
(Average Slope)
+16
+3.0V ≤ +VS ≤ +10V
0°C ≤ TA ≤ +75°C, +VS= +2.7V
Line Regulation (5)
LM62C
Limits (2)
Units
(Limit)
±2.0
±3.0
°C (max)
+2.5/−2.0
+4.0/−3.0
°C (max)
±0.8
±1.0
°C (max)
+16.1
+15.1
+16.3
+14.9
mV/°C (max)
mV/°C (min)
4.7
4.7
kΩ (max)
+480
Nonlinearity (4)
Output Impedance
LM62B
Limits (2)
mV
4.4
4.4
kΩ (max)
+3.0V ≤ +VS ≤ +10V
±1.13
±1.13
mV/V (max)
+2.7V ≤ +VS ≤ +3.3V, 0°C ≤ TA ≤ +75°C
±9.7
±9.7
mV (max)
130
165
130
165
μA (max)
μA (max)
Quiescent Current
+2.7V ≤ +VS ≤ +10V
82
Change of Quiescent Current
+2.7V ≤ +VS ≤ +10V
±5
μA
0.2
μA/°C
±0.2
°C
Temperature Coefficient of
Quiescent Current
Long Term Stability (6)
(1)
(2)
(3)
(4)
(5)
(6)
TJ=TMAX=+100°C,
for 1000 hours
Typicals are at TJ = TA = 25°C and represent most likely parametric norm.
Limits are ensured to Texas Instruments' AOQL (Average Outgoing Quality Level).
Accuracy is defined as the error between the output voltage and +15.6 mV/°C times the device's case temperature plus 480 mV, at
specified conditions of voltage, current, and temperature (expressed in °C).
Nonlinearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the device's
rated temperature range.
Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating
effects can be computed by multiplying the internal dissipation by the thermal resistance.
For best long-term stability, any precision circuit will give best results if the unit is aged at a warm temperature, and/or temperature
cycled for at least 46 hours before long-term life test begins. This is especially true when a small (Surface-Mount) part is wave-soldered;
allow time for stress relaxation to occur. The majority of the drift will occur in the first 1000 hours at elevated temperatures. The drift after
1000 hours will not continue at the first 1000 hour rate.
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Typical Performance Characteristics
To generate these curves the LM62 was mounted to a printed circuit board as shown in Figure 12.
4
Thermal Resistance
Junction to Air
Thermal Time Constant
Figure 2.
Figure 3.
Thermal Response in
Still Air with Heat Sink
Thermal Response
in Stirred Oil Bath
with Heat Sink
Figure 4.
Figure 5.
Thermal Response in Still
Air without a Heat Sink
Quiescent Current
vs. Temperature
Figure 6.
Figure 7.
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Typical Performance Characteristics (continued)
To generate these curves the LM62 was mounted to a printed circuit board as shown in Figure 12.
Accuracy
vs
Temperature
Noise Voltage
Figure 8.
Figure 9.
Supply Voltage
vs Supply Current
Start-Up Response
Figure 10.
Figure 11.
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CIRCUIT BOARD
½″ Square Printed Circuit Board with 2 oz. Copper Foil or Similar.
Figure 12. Printed Circuit Board Used for Heat Sink to Generate All Curves
Mounting
The LM62 can be applied easily in the same way as other integrated-circuit temperature sensors. It can be glued
or cemented to a surface. The temperature that the LM62 is sensing will be within about +0.2°C of the surface
temperature that LM62's leads are attached to.
This presumes that the ambient air temperature is almost the same as the surface temperature; if the air
temperature were much higher or lower than the surface temperature, the actual temperature measured would
be at an intermediate temperature between the surface temperature and the air temperature.
To ensure good thermal conductivity the backside of the LM62 die is directly attached to the GND pin. The lands
and traces to the LM62 will, of course, be part of the printed circuit board, which is the object whose temperature
is being measured. These printed circuit board lands and traces will not cause the LM62's temperature to deviate
from the desired temperature.
Alternatively, the LM62 can be mounted inside a sealed-end metal tube, and can then be dipped into a bath or
screwed into a threaded hole in a tank. As with any IC, the LM62 and accompanying wiring and circuits must be
kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit may operate at cold
temperatures where condensation can occur. Printed-circuit coatings and varnishes such as Humiseal and epoxy
paints or dips are often used to ensure that moisture cannot corrode the LM62 or its connections.
The thermal resistance junction to ambient (θJA) is the parameter used to calculate the rise of a device junction
temperature due to its power dissipation. For the LM62 the equation used to calculate the rise in the die
temperature is as follows:
TJ = TA + θJA [(+VS IQ) + (+VS − VO) IL]
(1)
where IQ is the quiescent current and ILis the load current on the output. Since the LM62's junction temperature
is the actual temperature being measured care should be taken to minimize the load current that the LM62 is
required to drive.
The table shown in Table 1 summarizes the rise in die temperature of the LM62 without any loading, and the
thermal resistance for different conditions.
Table 1. Temperature Rise of LM62 Due to Self-Heating and Thermal Resistance (θJA)
SOT-23
no heat sink (1)
Still air
SOT-23
small heat fin (2)
θJA
(°C/W)
TJ − TA
(°C)
θJA
(°C/W)
450
0.17
260
0.1
180
0.07
Moving air
(1)
(2)
6
TJ − TA
(°C)
Part soldered to 30 gauge wire.
Heat sink used is ½″ square printed circuit board with 2 oz. foil with part attached as shown in Figure 12 .
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Capacitive Loads
The LM62 handles capacitive loading well. Without any special precautions, the LM62 can drive any capacitive
load as shown in Figure 13. Over the specified temperature range the LM62 has a maximum output impedance
of 4.7 kΩ. In an extremely noisy environment it may be necessary to add some filtering to minimize noise pickup.
It is recommended that 0.1 μF be added from +VS to GND to bypass the power supply voltage, as shown in
Figure 14. In a noisy environment it may be necessary to add a capacitor from the output to ground. A 1 μF
output capacitor with the 4.7 kΩ maximum output impedance will form a 34 Hz lowpass filter. Since the thermal
time constant of the LM62 is much slower than the 30 ms time constant formed by the RC, the overall response
time of the LM62 will not be significantly affected. For much larger capacitors this additional time lag will increase
the overall response time of the LM62.
Figure 13. LM62 No Decoupling Required for Capacitive Load
Figure 14. LM62 with Filter for Noisy Environment
Figure 15. Simplified Schematic
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Applications Circuits
V+
VTEMP
R3
VT1
R4
VT2
LM4040
V+
VT
R1
4.1V
U3
0.1 PF
R2
(Low = overtemp alarm)
+
U1
-
VOUT
VOUT
LM7211
VT1 =
(4.1)R2
R2 + R1||R3
VT2 =
(4.1)R2||R3
R1 + R2||R3
LM62
VTemp
U2
Figure 16. Centigrade Thermostat
Figure 17. Conserving Power Dissipation with Shutdown
8
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SNIS105E – JUNE 1999 – REVISED MARCH 2013
REVISION HISTORY
Changes from Revision D (March 2013) to Revision E
•
Page
Changed layout of National Data Sheet to TI format ............................................................................................................ 8
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PACKAGE OPTION ADDENDUM
www.ti.com
27-Oct-2016
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM62BIM3/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 90
T7B
LM62BIM3X/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 90
T7B
LM62CIM3/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 90
T7C
LM62CIM3X/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 90
T7C
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
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27-Oct-2016
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
1-Oct-2016
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
LM62BIM3/NOPB
SOT-23
DBZ
3
1000
178.0
8.4
LM62BIM3X/NOPB
SOT-23
DBZ
3
3000
178.0
LM62CIM3/NOPB
SOT-23
DBZ
3
1000
178.0
LM62CIM3X/NOPB
SOT-23
DBZ
3
3000
178.0
3.3
2.9
1.22
4.0
8.0
Q3
8.4
3.3
2.9
1.22
4.0
8.0
Q3
8.4
3.3
2.9
1.22
4.0
8.0
Q3
8.4
3.3
2.9
1.22
4.0
8.0
Q3
Pack Materials-Page 1
W
Pin1
(mm) Quadrant
PACKAGE MATERIALS INFORMATION
www.ti.com
1-Oct-2016
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM62BIM3/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM62BIM3X/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM62CIM3/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM62CIM3X/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
Pack Materials-Page 2
4203227/C
PACKAGE OUTLINE
DBZ0003A
SOT-23 - 1.12 mm max height
SCALE 4.000
SMALL OUTLINE TRANSISTOR
C
2.64
2.10
1.4
1.2
PIN 1
INDEX AREA
1.12 MAX
B
A
0.1 C
1
0.95
3.04
2.80
1.9
3X
3
0.5
0.3
0.2
2
(0.95)
C A B
0.25
GAGE PLANE
0 -8 TYP
0.10
TYP
0.01
0.20
TYP
0.08
0.6
TYP
0.2
SEATING PLANE
4214838/C 04/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-236, except minimum foot length.
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EXAMPLE BOARD LAYOUT
DBZ0003A
SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR
PKG
3X (1.3)
1
3X (0.6)
SYMM
3
2X (0.95)
2
(R0.05) TYP
(2.1)
LAND PATTERN EXAMPLE
SCALE:15X
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4214838/C 04/2017
NOTES: (continued)
4. Publication IPC-7351 may have alternate designs.
5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
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EXAMPLE STENCIL DESIGN
DBZ0003A
SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR
PKG
3X (1.3)
1
3X (0.6)
SYMM
3
2X(0.95)
2
(R0.05) TYP
(2.1)
SOLDER PASTE EXAMPLE
BASED ON 0.125 THICK STENCIL
SCALE:15X
4214838/C 04/2017
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
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DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN
CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN
ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949
and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements.
Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such
products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards
and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must
ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in
life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use.
Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life
support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all
medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.
TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product).
Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications
and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory
requirements in connection with such selection.
Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s noncompliance with the terms and provisions of this Notice.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2017, Texas Instruments Incorporated
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