Texas Instruments | LM19 2.4V, 10A, TO-92 Temperature Sensor (Rev. E) | Datasheet | Texas Instruments LM19 2.4V, 10A, TO-92 Temperature Sensor (Rev. E) Datasheet

Texas Instruments LM19 2.4V, 10A, TO-92 Temperature Sensor (Rev. E) Datasheet
LM19
www.ti.com
SNIS122E – MAY 2001 – REVISED MARCH 2013
LM19 2.4V, 10µA, TO-92 Temperature Sensor
Check for Samples: LM19
FEATURES
1
•
•
•
•
•
2
Rated for Full −55°C to +130°C Range
Available in a TO-92 Package
Predictable Curvature Error
Suitable for Remote Applications
UL Recognized Component
APPLICATIONS
•
•
•
•
•
•
•
•
•
Cellular Phones
Computers
Power Supply Modules
Battery Management
FAX Machines
Printers
HVAC
Disk Drives
Appliances
KEY SPECIFICATIONS
•
•
•
•
•
•
•
Accuracy at +30°C ±2.5 °C (max)
Accuracy at +130°C & −55°C ±3.5 to ±3.8 °C
(max)
Power Supply Voltage Range +2.4V to +5.5V
Current Drain 10 μA (max)
Nonlinearity ±0.4 % (typ)
Output Impedance 160 Ω (max)
Load Regulation
– 0µA < IL< +16 µA
DESCRIPTION
The LM19 is a precision analog output CMOS
integrated-circuit temperature sensor that operates
over a −55°C to +130°C temperature range. The
power supply operating range is +2.4 V to +5.5 V.
The transfer function of LM19 is predominately linear,
yet has a slight predictable parabolic curvature. The
accuracy of the LM19 when specified to a parabolic
transfer function is ±2.5°C at an ambient temperature
of +30°C. The temperature error increases linearly
and reaches a maximum of ±3.8°C at the
temperature range extremes. The temperature range
is affected by the power supply voltage. At a power
supply voltage of 2.7 V to 5.5 V the temperature
range extremes are +130°C and −55°C. Decreasing
the power supply voltage to 2.4 V changes the
negative extreme to −30°C, while the positive
remains at +130°C.
The LM19's quiescent current is less than 10 μA.
Therefore, self-heating is less than 0.02°C in still air.
Shutdown capability for the LM19 is intrinsic because
its inherent low power consumption allows it to be
powered directly from the output of many logic gates
or does not necessitate shutdown at all.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2001–2013, Texas Instruments Incorporated
LM19
SNIS122E – MAY 2001 – REVISED MARCH 2013
www.ti.com
Typical Application
Output Voltage vs Temperature
VO = (−3.88×10−6×T2) + (−1.15×10−2×T) + 1.8639
or
where:
T is temperature, and VO is the measured output voltage of the
LM19.
Figure 1. Full-Range Celsius (Centigrade) Temperature Sensor (−55°C to +130°C) Operating from a
Single Li-Ion Battery Cell
Temperature (T)
Typical VO
+130°C
+303 mV
+100°C
+675 mV
+80°C
+919 mV
+30°C
+1515 mV
+25°C
+1574 mV
0°C
+1863.9 mV
−30°C
+2205 mV
−40°C
+2318 mV
−55°C
+2485 mV
Connection Diagram
Figure 2. TO-92
Package Number LP
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
2
Submit Documentation Feedback
Copyright © 2001–2013, Texas Instruments Incorporated
Product Folder Links: LM19
LM19
www.ti.com
SNIS122E – MAY 2001 – REVISED MARCH 2013
Absolute Maximum Ratings (1)
Supply Voltage
+6.5V to −0.2V
Output Voltage
(V+ + 0.6 V) to −0.6 V
Output Current
10 mA
Input Current at any pin (2)
5 mA
−65°C to +150°C
Storage Temperature
Maximum Junction Temperature (TJMAX)
+150°C
ESD Susceptibility (3)
2500 V
Human Body Model
Machine Model
Lead Temperature
(1)
(2)
(3)
TO-92 Package
250 V
Soldering (3 seconds dwell)
+240°C
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The specified specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
When the input voltage (VI) at any pin exceeds power supplies (VI < GND or VI > V+), the current at that pin should be limited to 5 mA.
The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200 pF
capacitor discharged directly into each pin.
Operating Ratings (1)
TMIN ≤ TA ≤ TMAX
Specified Temperature Range
2.4 V ≤ V+≤ 2.7 V
−30°C ≤ TA ≤ +130°C
2.7 V ≤ V+≤ 5.5 V
−55°C ≤ TA ≤ +130°C
+
Supply Voltage Range (V )
Thermal Resistance, θJA (2)
(1)
(2)
+2.4 V to +5.5 V
TO-92
150°C/W
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The specified specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
The junction to ambient thermal resistance (θJA) is specified without a heat sink in still air.
Submit Documentation Feedback
Copyright © 2001–2013, Texas Instruments Incorporated
Product Folder Links: LM19
3
LM19
SNIS122E – MAY 2001 – REVISED MARCH 2013
www.ti.com
Electrical Characteristics
Unless otherwise noted, these specifications apply for V+ = +2.7 VDC. Boldface limits apply for TA = TJ = TMIN to TMAX ; all
other limits TA = TJ = 25°C; Unless otherwise noted.
Parameter
Conditions
Typical (1)
LM19C
Limits (2)
Temperature to Voltage Error
VO = (−3.88×10−6×T2)
+ (−1.15×10−2×T) + 1.8639V (3)
Units
(Limit)
TA = +25°C to +30°C
±2.5
°C (max)
TA = +130°C
±3.5
°C (max)
TA = +125°C
±3.5
°C (max)
TA = +100°C
±3.2
°C (max)
TA = +85°C
±3.1
°C (max)
TA = +80°C
±3.0
°C (max)
TA = 0°C
±2.9
°C (max)
TA = −30°C
±3.3
°C (min)
TA = −40°C
±3.5
°C (max)
TA = −55°C
±3.8
°C (max)
Output Voltage at 0°C
+1.8639
V
Variance from Curve
±1.0
°C
Non-Linearity (4)
−20°C ≤ TA ≤ +80°C
±0.4
Sensor Gain (Temperature Sensitivity
or Average Slope) to equation:
VO=−11.77 mV/°C×T+1.860V
−30°C ≤ TA ≤ +100°C
−11.77
Output Impedance
(7)
Load Regulation
Line Regulation (8)
mV/°C (min)
mV/°C (max)
0 μA ≤ IL ≤ +16 μA (5) (6)
160
Ω (max)
(5) (6)
−2.5
mV (max)
+3.7
mV/V (max)
+11
mV (max)
7
μA (max)
0 μA ≤ IL ≤ +16 μA
+2. 4 V ≤ V+ ≤ +5.0V
+5.0 V ≤ V+ ≤ +5.5 V
Quiescent Current
Change of Quiescent Current
+2. 4 V ≤ V+ ≤ +5.0V
4.5
+
+5.0V ≤ V ≤ +5.5V
4.5
9
μA (max)
+2. 4 V ≤ V+ ≤ +5.0V
4.5
10
μA (max)
+2. 4 V ≤ V+ ≤ +5.5V
+0.7
μA
−11
nA/°C
0.02
μA
Temperature Coefficient of Quiescent
Current
Shutdown Current
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
4
%
−11.0
−12.6
+
V ≤ +0.8 V
Typicals are at TJ = TA = 25°C and represent most likely parametric norm.
Limits are ensured to AOQL (Average Outgoing Quality Level).
Accuracy is defined as the error between the measured and calculated output voltage at the specified conditions of voltage, current, and
temperature (expressed in°C).
Non-Linearity is defined as the deviation of the calculated output-voltage-versus-temperature curve from the best-fit straight line, over
the temperature range specified.
Negative currents are flowing into the LM19. Positive currents are flowing out of the LM19. Using this convention the LM19 can at most
sink −1 μA and source +16 μA.
Load regulation or output impedance specifications apply over the supply voltage range of +2.4V to +5.5V.
Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating
effects can be computed by multiplying the internal dissipation by the thermal resistance.
Line regulation is calculated by subtracting the output voltage at the highest supply input voltage from the output voltage at the lowest
supply input voltage.
Submit Documentation Feedback
Copyright © 2001–2013, Texas Instruments Incorporated
Product Folder Links: LM19
LM19
www.ti.com
SNIS122E – MAY 2001 – REVISED MARCH 2013
Typical Performance Characteristics
Temperature Error vs. Temperature
Thermal Response in Still Air
5
MAX Limit
4
ERROR ( º C)
3
2
Typical
1
0
-1
-2
MIN Limit
-3
-4
-5
-100
-50
0
50
100
150
TEMPERATURE (ºC)
LM19 TRANSFER FUNCTION
The LM19's transfer function can be described in different ways with varying levels of precision. A simple linear
transfer function, with good accuracy near 25°C, is
VO= −11.69 mV/°C × T + 1.8663 V
(1)
Over the full operating temperature range of −55°C to +130°C, best accuracy can be obtained by using the
parabolic transfer function
VO = (−3.88×10−6×T2) + (−1.15×10−2×T) + 1.8639
(2)
solving for T:
(3)
A linear transfer function can be used over a limited temperature range by calculating a slope and offset that give
best results over that range. A linear transfer function can be calculated from the parabolic transfer function of
the LM19. The slope of the linear transfer function can be calculated using the following equation:
m = −7.76 × 10−6× T − 0.0115
where
•
T is the middle of the temperature range of interest and m is in V/°C.
(4)
For example for the temperature range of Tmin = −30 to Tmax = +100°C:
T = 35°C
and
m = −11.77 mV/°C
The offset of the linear transfer function can be calculated using the following equation:
b = (VOP(Tmax) + VOP(T) − m × (Tmax+T))/2
where
•
•
VOP(Tmax) is the calculated output voltage at Tmax using the parabolic transfer function for VO.
VOP(T) is the calculated output voltage at T using the parabolic transfer function for VO.
(5)
Using this procedure the best fit linear transfer function for many popular temperature ranges was calculated in
Table 1. As shown in Table 1 the error that is introduced by the linear transfer function increases with wider
temperature ranges.
Submit Documentation Feedback
Copyright © 2001–2013, Texas Instruments Incorporated
Product Folder Links: LM19
5
LM19
SNIS122E – MAY 2001 – REVISED MARCH 2013
www.ti.com
Table 1. First Order Equations Optimized For Different Temperature Ranges
Temperature Range
Linear Equation
VO=
Maximum Deviation of Linear Equation from
Parabolic Equation (°C)
+130
−11.79 mV/°C × T + 1.8528 V
±1.41
+110
−11.77 mV/°C × T + 1.8577 V
±0.93
−30
+100
−11.77 mV/°C × T + 1.8605 V
±0.70
-40
+85
−11.67 mV/°C × T + 1.8583 V
±0.65
−10
+65
−11.71 mV/°C × T + 1.8641 V
±0.23
+35
+45
−11.81 mV/°C × T + 1.8701 V
±0.004
+20
+30
−11.69 mV/°C × T + 1.8663 V
±0.004
Tmin (°C)
Tmax (°C)
−55
−40
Mounting
The LM19 can be applied easily in the same way as other integrated-circuit temperature sensors. It can be glued
or cemented to a surface. The temperature that the LM19 is sensing will be within about +0.02°C of the surface
temperature to which the LM19's leads are attached.
This presumes that the ambient air temperature is almost the same as the surface temperature; if the air
temperature were much higher or lower than the surface temperature, the actual temperature measured would
be at an intermediate temperature between the surface temperature and the air temperature.
To ensure good thermal conductivity the backside of the LM19 die is directly attached to the GND pin. The
tempertures of the lands and traces to the other leads of the LM19 will also affect the temperature that is being
sensed.
Alternatively, the LM19 can be mounted inside a sealed-end metal tube, and can then be dipped into a bath or
screwed into a threaded hole in a tank. As with any IC, the LM19 and accompanying wiring and circuits must be
kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit may operate at cold
temperatures where condensation can occur. Printed-circuit coatings and varnishes such as Humiseal and epoxy
paints or dips are often used to ensure that moisture cannot corrode the LM19 or its connections.
The thermal resistance junction to ambient (θJA) is the parameter used to calculate the rise of a device junction
temperature due to its power dissipation. For the LM19 the equation used to calculate the rise in the die
temperature is as follows:
TJ = TA + θJA [(V+ IQ) + (V+ − VO) IL]
where
•
IQ is the quiescent current and ILis the load current on the output.
(6)
Since the LM19's junction temperature is the actual temperature being measured care should be taken to
minimize the load current that the LM19 is required to drive.
Table 2 summarizes the rise in die temperature of the LM19 without any loading, and the thermal resistance for
different conditions.
Table 2. Temperature Rise of LM19 Due to Self-Heating and Thermal Resistance (θJA)
TO-92
TO-92
no heat sink
small heat fin
θJA
TJ − TA
θJA
TJ − TA
(°C/W)
(°C)
(°C/W)
(°C)
Still air
150
TBD
TBD
TBD
Moving air
TBD
TBD
TBD
TBD
6
Submit Documentation Feedback
Copyright © 2001–2013, Texas Instruments Incorporated
Product Folder Links: LM19
LM19
www.ti.com
SNIS122E – MAY 2001 – REVISED MARCH 2013
Capacitive Loads
The LM19 handles capacitive loading well. Without any precautions, the LM19 can drive any capacitive load less
than 300 pF as shown in Figure 3. Over the specified temperature range the LM19 has a maximum output
impedance of 160 Ω. In an extremely noisy environment it may be necessary to add some filtering to minimize
noise pickup. It is recommended that 0.1 μF be added from V+ to GND to bypass the power supply voltage, as
shown in Figure 4. In a noisy environment it may even be necessary to add a capacitor from the output to ground
with a series resistor as shown in Figure 4. A 1 μF output capacitor with the 160 Ω maximum output impedance
and a 200 Ω series resistor will form a 442 Hz lowpass filter. Since the thermal time constant of the LM19 is
much slower, the overall response time of the LM19 will not be significantly affected.
Figure 3. LM19 No Decoupling Required for Capacitive Loads Less than 300 pF
Table 3. LM19 with Filter for Noisy Environment
and Capacitive Loading greater than 300 pF
R (Ω)
C (µF)
200
1
470
0.1
680
0.01
1k
0.001
Either placement of resistor as shown
above is just as effective.
Figure 4. LM19 with Filter for Noisy Environment
and Capacitive Loading greater than 300 pF
Submit Documentation Feedback
Copyright © 2001–2013, Texas Instruments Incorporated
Product Folder Links: LM19
7
LM19
SNIS122E – MAY 2001 – REVISED MARCH 2013
www.ti.com
Applications Circuits
V+
VTEMP
R3
VT1
R4
VT2
LM4040
V+
VT
R1
4.1V
U3
0.1 PF
R2
(High = overtemp alarm)
+
U1
-
VOUT
VOUT
LM7211
VT1 =
(4.1)R2
R2 + R1||R3
VT2 =
(4.1)R2||R3
R1 + R2||R3
LM19
VTemp
U2
Figure 5. Centigrade Thermostat
Figure 6. Conserving Power Dissipation with Shutdown
Figure 7. Suggested Connection to a Sampling Analog to Digital Converter Input Stage
Most CMOS ADCs found in ASICs have a sampled data comparator input structure that is notorious for causing
grief to analog output devices such as the LM19 and many op amps. The cause of this grief is the requirement of
instantaneous charge of the input sampling capacitor in the ADC. This requirement is easily accommodated by
the addition of a capacitor. Since not all ADCs have identical input stages, the charge requirements will vary
necessitating a different value of compensating capacitor. This ADC is shown as an example only. If a digital
output temperature is required please refer to devices such as the LM74.
8
Submit Documentation Feedback
Copyright © 2001–2013, Texas Instruments Incorporated
Product Folder Links: LM19
LM19
www.ti.com
SNIS122E – MAY 2001 – REVISED MARCH 2013
REVISION HISTORY
Changes from Revision D (March 2013) to Revision E
•
Page
Changed layout of National Data Sheet to TI format ............................................................................................................ 8
Submit Documentation Feedback
Copyright © 2001–2013, Texas Instruments Incorporated
Product Folder Links: LM19
9
PACKAGE OPTION ADDENDUM
www.ti.com
6-Jul-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
LM19CIZ/LFT4
ACTIVE
TO-92
LP
3
2000
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
LM19CIZ/NOPB
ACTIVE
TO-92
LP
3
1800
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
Op Temp (°C)
Device Marking
(4/5)
LM19
CIZ
-55 to 130
LM19
CIZ
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
6-Jul-2014
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE OUTLINE
LP0003A
TO-92 - 5.34 mm max height
SCALE 1.200
SCALE 1.200
TO-92
5.21
4.44
EJECTOR PIN
OPTIONAL
5.34
4.32
(1.5) TYP
SEATING
PLANE
(2.54)
NOTE 3
2X
4 MAX
(0.51) TYP
6X
0.076 MAX
SEATING
PLANE
2X
2.6 0.2
3X
12.7 MIN
3X
3X
0.55
0.38
0.43
0.35
2X 1.27 0.13
FORMED LEAD OPTION
STRAIGHT LEAD OPTION
OTHER DIMENSIONS IDENTICAL
TO STRAIGHT LEAD OPTION
3X
2.67
2.03
4.19
3.17
3
2
1
3.43 MIN
4215214/B 04/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Lead dimensions are not controlled within this area.
4. Reference JEDEC TO-226, variation AA.
5. Shipping method:
a. Straight lead option available in bulk pack only.
b. Formed lead option available in tape and reel or ammo pack.
c. Specific products can be offered in limited combinations of shipping medium and lead options.
d. Consult product folder for more information on available options.
www.ti.com
EXAMPLE BOARD LAYOUT
LP0003A
TO-92 - 5.34 mm max height
TO-92
0.05 MAX
ALL AROUND
TYP
FULL R
TYP
METAL
TYP
(1.07)
3X ( 0.85) HOLE
2X
METAL
(1.5)
2X (1.5)
2
1
(R0.05) TYP
3
2X (1.07)
(1.27)
SOLDER MASK
OPENING
2X
SOLDER MASK
OPENING
(2.54)
LAND PATTERN EXAMPLE
STRAIGHT LEAD OPTION
NON-SOLDER MASK DEFINED
SCALE:15X
0.05 MAX
ALL AROUND
TYP
( 1.4)
2X ( 1.4)
METAL
3X ( 0.9) HOLE
METAL
(R0.05) TYP
2
1
(2.6)
SOLDER MASK
OPENING
3
2X
SOLDER MASK
OPENING
(5.2)
LAND PATTERN EXAMPLE
FORMED LEAD OPTION
NON-SOLDER MASK DEFINED
SCALE:15X
4215214/B 04/2017
www.ti.com
TAPE SPECIFICATIONS
LP0003A
TO-92 - 5.34 mm max height
TO-92
13.7
11.7
32
23
(2.5) TYP
0.5 MIN
16.5
15.5
11.0
8.5
9.75
8.50
19.0
17.5
6.75
5.95
2.9
TYP
2.4
3.7-4.3 TYP
13.0
12.4
FOR FORMED LEAD OPTION PACKAGE
4215214/B 04/2017
www.ti.com
IMPORTANT NOTICE
Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its
semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers
should obtain the latest relevant information before placing orders and should verify that such information is current and complete.
TI’s published terms of sale for semiconductor products (http://www.ti.com/sc/docs/stdterms.htm) apply to the sale of packaged integrated
circuit products that TI has qualified and released to market. Additional terms may apply to the use or sale of other types of TI products and
services.
Reproduction of significant portions of TI information in TI data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such reproduced
documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements
different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the
associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Buyers and others who are developing systems that incorporate TI products (collectively, “Designers”) understand and agree that Designers
remain responsible for using their independent analysis, evaluation and judgment in designing their applications and that Designers have
full and exclusive responsibility to assure the safety of Designers' applications and compliance of their applications (and of all TI products
used in or for Designers’ applications) with all applicable regulations, laws and other applicable requirements. Designer represents that, with
respect to their applications, Designer has all the necessary expertise to create and implement safeguards that (1) anticipate dangerous
consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and
take appropriate actions. Designer agrees that prior to using or distributing any applications that include TI products, Designer will
thoroughly test such applications and the functionality of such TI products as used in such applications.
TI’s provision of technical, application or other design advice, quality characterization, reliability data or other services or information,
including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to
assist designers who are developing applications that incorporate TI products; by downloading, accessing or using TI Resources in any
way, Designer (individually or, if Designer is acting on behalf of a company, Designer’s company) agrees to use any particular TI Resource
solely for this purpose and subject to the terms of this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,
enhancements, improvements and other changes to its TI Resources. TI has not conducted any testing other than that specifically
described in the published documentation for a particular TI Resource.
Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that
include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE
TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY
RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or
endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR
REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO
ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF
MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL
PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM,
INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF
PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL,
DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN
CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN
ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949
and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements.
Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such
products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards
and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must
ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in
life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use.
Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life
support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all
medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.
TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product).
Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications
and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory
requirements in connection with such selection.
Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s noncompliance with the terms and provisions of this Notice.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2017, Texas Instruments Incorporated
Was this manual useful for you? yes no
Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Download PDF

advertising