Texas Instruments | SOT-23, /-3C Accurate, Factory Preset Thermostat (LM26 without V TEMP output) (Rev. B) | Datasheet | Texas Instruments SOT-23, /-3C Accurate, Factory Preset Thermostat (LM26 without V TEMP output) (Rev. B) Datasheet

Texas Instruments SOT-23,  /-3C Accurate, Factory Preset Thermostat (LM26 without V TEMP output) (Rev. B) Datasheet
LM26NV
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SNIS151B – AUGUST 2008 – REVISED MARCH 2013
LM26NV SOT-23, ±3°C Accurate, Factory Preset Thermostat
(LM26 without VTEMP output)
Check for Samples: LM26NV
FEATURES
DESCRIPTION
•
The LM26NV is a precision, single digital-output, lowpower thermostat comprised of an internal reference,
DAC, temperature sensor and comparator. Utilizing
factory programming, it can be manufactured with
different trip points as well as different digital output
functionality. The trip point (TOS) can be preset at the
factory to any temperature in the range of −55°C to
+110°C in 1°C increments. The LM26NV has one
digital output (OS/OS/US/US) and one digital input
(HYST). The digital output stage can be preset as
either open-drain or push-pull. In addition, it can be
factory programmed to be active HIGH or LOW. The
digital output can be factory programmed to indicate
an over temperature shutdown event (OS or OS) or
an under temperature shutdown event (US or US).
When preset as an overtemperature shutdown (OS),
it will go LOW to indicate that the die temperature is
over the internally preset TOS and go HIGH when the
temperature goes below (TOS–THYST). Similarly, when
preprogrammed as an undertemperature shutdown
(US) it will go HIGH to indicate that the temperature
is below TUS and go LOW when the temperature is
above (TUS+THYST). The typical hysteresis, THYST, can
be set to 2°C or 10°C and is controlled by the state of
the HYST pin.
1
2
•
•
•
•
•
•
Internal Comparator with Pin Programmable
2°C or 10°C Hysteresis
No External Components Required
Open Drain or Push-Pull Digital Output;
Supports CMOS Logic Levels
Internal Temperature Sensor
Internal Voltage Reference and DAC for TripPoint Setting
Currently Available in 5-Pin SOT-23 Plastic
Package
Excellent Power Supply Noise Rejection
APPLICATIONS
•
•
•
•
•
•
•
•
Microprocessor Thermal Management
Appliances
Portable Battery Powered Systems
Fan Control
Industrial Process Control
HVAC Systems
Remote Temperature Sensing
Electronic System Protection
KEY SPECIFICATIONS
•
•
•
Power Supply Voltage: 2.7V to 5.5 V
Power Supply Current:
– 40µA(max)
– 20µA(typ)
Hysteresis Temperature: 2°C or 10°C(typ)
Available parts are detailed in the ordering
information. For other part options, contact a Texas
Instruments Distributor or Sales Representative for
information on minimum order qualification. The
LM26NV is currently available in a 5-lead SOT-23
package.
Table 1. Temperature Trip Point Accuracy
Temperature Range
LM26NV
−55°C to +110°C
±3°C (max)
+120°C
±4°C (max)
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008–2013, Texas Instruments Incorporated
LM26NV
SNIS151B – AUGUST 2008 – REVISED MARCH 2013
www.ti.com
Connection Diagram
HYST
1
GND
2
NC or
GND
3
5
OS, OS,
US, or US
4
V+
LM26NV
Figure 1. 5-Lead SOT-23
See DBV Package
PIN DESCRIPTIONS
Pin
Number
Pin
Name
1
HYST
Hysteresis control, digital input
GND for 10°C or V+ for 2°C
2
GND
Ground, connected to the back side of the die
through lead frame.
System GND
3
NC
Not Connected Inside Part
Ground or No Connect
4
V+
Supply input
2.7V to 5.5V with a 0.1µF bypass capacitor. For PSRR
information see Section Titled NOISE CONSIDERATIONS.
5 (1)
OS
Overtemperature Shutdown open-drain active low Controller interrupt, system or power supply shutdown; pull-up
thermostat digital output
resistor ≥ 10kΩ
OS
Overtemperature Shutdown push-pull active high
thermostat digital output
Controller interrupt, system or power supply shutdown
US
Undertemperature Shutdown open-drain active
low thermostat digital output
System or power supply shutdown; pull-up resistor ≥ 10kΩ
US
Undertemperature Shutdown push-pull active
high thermostat digital output
System or power supply shutdown
(1)
Function
Connection
Pin 5 functionality and trip point setting are programmed during LM26NV manufacture.
LM26CIM5-YPE Simplified Block Diagram and Connection Diagram
TOS
HYST
OS
HYST
REF
GND
TEMP
SENSOR
TOS - THYST
Temp. of
Leads
+
-
NC
OS
V+ = 2.7V
to 5.5V
HYST = GND for 10°C Hysteresis
HYST = V+ for 2°C Hysteresis
The LM26CIM5-YPE has a fixed trip point of 115°C. For other trip point and output function availability, please see
ordering information or contact Texas Instruments.
Figure 2.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
2
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Absolute Maximum Ratings
(1)
Input Voltage
6.0V
Input Current at any pin
(2)
5mA
Package Input Current (2)
20mA
Package Dissipation at TA = 25°C (3)
Soldering Information
500mW
(4)
SOT-23 Package
Vapor Phase (60 seconds)
215°C
Infrared (15 seconds)
220°C
−65°C to + 150°C
Storage Temperature
ESD Susceptibility
(5)
Human Body Model
2500V
Machine Model
(1)
(2)
(3)
(4)
(5)
250V
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
When the input voltage (VI) at any pin exceeds the power supply (VI < GND or VI > V+), the current at that pin should be limited to 5mA.
The 20mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input
current of 5mA to four. Under normal operating conditions the maximum current that pins 2, 4 or 5 can handle is limited to 5mA each.
The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature),
θJA (junction to ambient thermal resistance) and TA (ambient temperature). The maximum allowable power dissipation at any
temperature is PD = (TJmax–TA)/θJA or the number given in the Absolute Maximum Ratings, whichever is lower. For this device, TJmax =
150°C. For this device the typical thermal resistance (θJA) of the different package types when board mounted follow:
See the URL ”http://www.ti.com/packaging“ for other recommendations and methods of soldering surface mount devices.
The human body model is a 100pF capacitor discharge through a 1.5kΩ resistor into each pin. The machine model is a 200pF capacitor
discharged directly into each pin.
Operating Ratings
(1)
TMIN ≤ TA ≤ TMAX
Specified Temperature Range
−55°C ≤ TA ≤ +125°C
LM26NV
Positive Supply Voltage (V+)
+2.7V to +5.5V
Maximum VOUT
(1)
+5.5V
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
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LM26NV
SNIS151B – AUGUST 2008 – REVISED MARCH 2013
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LM26NV Electrical Characteristics
The following specifications apply for V+ = 2.7VDC to 5.5VDC, and VTEMP load current = 0µA unless otherwise specified.
Boldface limits apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ = 25°C unless otherwise specified.
Symbol
Parameter
Conditions
Typical (1)
LM26NV Limits
(2)
Units (Limits)
Temperature Sensor
IS
Trip Point Accuracy (Includes VREF, DAC,
Comparator Offset, and Temperature
Sensitivity errors)
-55°C ≤ TA ≤ +110°C
±3
°C (max)
+120°C
±4
°C (max)
Trip Point Hysteresis
HYST = GND
11
HYST = V+
2
Supply Current
°C
°C
16
20
40
µA (max)
µA (max)
Digital Output and Input
(1)
(2)
(3)
(4)
(3)
V+ = +5.0V
IOUT(“1”)
Logical “1” Output Leakage Current
VOUT(“0”)
Logical “0” Output Voltage
IOUT = +1.2mA and
V+≥2.7V; IOUT = +3.2mA
and V+≥4.5V; (4)
VOUT(“1”)
Logical “1” Push-Pull Output Voltage
0.001
1
µA (max)
0.4
V (max)
ISOURCE = 500µA, V+ ≥
2.7V
0.8 × V+
V (min)
ISOURCE = 800µA, V+≥4.5V
V+ − 1.5
V (min)
VIH
HYST Input Logical ”1“ Threshold Voltage
0.8 × V+
V (min)
VIL
HYST Input Logical ”0“ Threshold Voltage
0.2 × V+
V (max)
Typicals are at TJ = TA = 25°C and represent most likely parametric norm.
Limits are ensured to AOQL (Average Outgoing Quality Level).
The 1µA limit is based on a testing limitation and does not reflect the actual performance of the part. Expect to see a doubling of the
current for every 15°C increase in temperature. For example, the 1nA typical current at 25°C would increase to 16nA at 85°C.
Care should be taken to include the effects of self heating when setting the maximum output load current. The power dissipation of the
LM26NV would increase by 1.28mW when IOUT=3.2mA and VOUT=0.4V. With a thermal resistance of 250°C/W, this power dissipation
would cause an increase in the die temperature of about 0.32°C due to self heating. Self heating is not included in the trip point
accuracy specification.
Package Type
θJA
SOT-23, DBV
250°C/W
Part Number Template
The series of characters labeled "xyz" in the part number LM26CIM5-xyz, describe the set point value and the
function of the output. The character at "x" and "y" define the set point temperature (at which the digital output
will go active). The "z" character defines the type and function of the digital output. These place holders are
defined in the following tables.
The place holders xy describe the set point temperature as shown in the following table.
4
x (10x)
y (1x)
Temperature (°C)
A
-
−5
B
-
−4
C
-
−3
D
-
−2
E
-
−1
F
-
−0
H
H
0
J
J
1
K
K
2
L
L
3
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x (10x)
y (1x)
Temperature (°C)
N
N
4
P
P
5
R
R
6
S
S
7
T
T
8
V
V
9
X
-
10
Y
-
11
Z
-
12
The value of z describes the assignment/function of the output as shown in the following table:
Active-Low/High
Open-Drain/ PushPull
OS/US
Value of z
0
0
0
E
Active-Low, Open-Drain, OS output
0
0
1
F
Active-Low, Open-Drain, US output
1
1
0
G
Active-High, Push-Pull, OS output
1
1
1
H
Active-High, Push-Pull, US output
Digital Output Function
EXAMPLE:
• The part number LM26CIM5-YPE has TOS = 115°C, and has an active-low open-drain overtemperature
shutdown output. The "Y" represents the tens value "11", the "P" represents the ones value "5", and the "E"
means that the output will be an active-low, open-drain, over-temperature output.
Many active-high open-drain and active-low push-pull options are available, please contact Texas Instruments for
more information.
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LM26NV
SNIS151B – AUGUST 2008 – REVISED MARCH 2013
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FUNCTIONAL DESCRIPTION
LM26NV OPTIONS
The LM26NV can be factory programmed to have a trip point anywhere in the range of −55°C to +110°C. It is
also available in any of four output options, as indicated by the last letter in the part number.
Output Pin Options Block Diagrams
HYST
OS
HYST
US
HYST
HYST
REF
GND
TEMP
SENSOR
REF
+
GND
TEMP
SENSOR
-
NC
V+
The "E" in "LM26CIM5 - _ _ E " indicates that the digital
output is Active-Low Open-Drain
and will trip as temperature is rising (OS)
NC
V+
The "F" in "LM26CIM5 - _ _ F " indicates that the digital
output is Active-Low Open-Drain
and will trip as temperature is falling (US)
Figure 3. LM26CIM5 - _ _ E
Figure 4. LM26CIM5 - _ _ F
V+
HYST
+
OS
V+
HYST
HYST
REF
GND
TEMP
SENSOR
US
HYST
REF
+
GND
TEMP
SENSOR
-
NC
V+
The "G" in "LM26CIM5 - _ _G " indicates that the digital
output is Active-High Push-Pull
and will trip as temperature is rising (OS)
+
NC
V+
The "H" in "LM26CIM5 - _ _H" indicates that the digital
output is Active-High Push-Pull
and will trip as temperature is falling (US)
Figure 5. LM26CIM5 - _ _G
Figure 6. LM26CIM5 - _ _H
Applications Hints
NOISE CONSIDERATIONS
The LM26NV has excellent power supply noise rejection. Listed below is a variety of signals used to test the
LM26NV power supply rejection. False triggering of the output was not observed when these signals where
coupled into the V+ pin of the LM26NV.
• Square Wave 400kHz, 1Vp-p
• Square Wave 2kHz, 200mVp-p
• Sine Wave 100Hz to 1MHz, 200mVp-p
Testing was done while maintaining the temperature of the LM26NV one degree centigrade way from the trip
point with the output not activated.
6
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LM26NV
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SNIS151B – AUGUST 2008 – REVISED MARCH 2013
MOUNTING CONSIDERATIONS
The LM26NV can be applied easily in the same way as other integrated-circuit temperature sensors. It can be
glued or cemented to a surface. The temperature that the LM26NV is sensing will be within about +0.06°C of the
surface temperature to which the LM26NV's leads are attached to.
This presumes that the ambient air temperature is almost the same as the surface temperature; if the air
temperature were much higher or lower than the surface temperature, the actual temperature measured would
be at an intermediate temperature between the surface temperature and the air temperature.
To ensure good thermal conductivity, the backside of the LM26NV die is directly attached to the GND pin (pin 2).
The temperatures of the lands and traces to the other leads of the LM26NV will also affect the temperature that
is being sensed.
Alternatively, the LM26NV can be mounted inside a sealed-end metal tube, and can then be dipped into a bath
or screwed into a threaded hole in a tank. As with any IC, the LM26NV and accompanying wiring and circuits
must be kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit may operate
at cold temperatures where condensation can occur. Printed-circuit coatings and varnishes such as Humiseal
and epoxy paints or dips are often used to ensure that moisture cannot corrode the LM26NV or its connections.
The junction to ambient thermal resistance (θJA) is the parameter used to calculate the rise of a part's junction
temperature due to its power dissipation. For the LM26NV the equation used to calculate the rise in the die
junction temperature is as follows:
+
TJ = TA + 4JA(V IQ + VDOIDO)
where
•
•
•
•
•
TA is the ambient temperature
V+ is the power supply voltage
IQ is the quiescent current
VDO is the voltage on the digital output
IDO is the load current on the digital output
(1)
Table 2 summarizes the thermal resistance for different conditions and the rise in die temperature of the LM26NV
and a 10k pull-up resistor on an open-drain digital output with a 5.5V power supply.
Table 2. Thermal resistance (θJA) and temperature rise due to self heating (TJ−TA)
SOT-23
no heat sink
SOT-23
small heat sink
θJA
(°C/W)
TJ−TA
(°C)
θJA
(°C/W)
TJ−TA
(°C)
Still Air
250
0.11
TBD
TBD
Moving Air
TBD
TBD
TBD
TBD
Typical Applications
System Fan
Sanyo Denki
109R0612T4H12
HYST
OS
GND
NC
V+
+5V
12V
10k
LM26NV
0.1 PF
The fan's control pin has an internal pull-up. The 10 kOhm pull-down sets a slow fan speed. When the output of the
LM26NV goes low, the fan will speed up.
Figure 7. Two Speed Fan Speed Control
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LM26NV
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5V
HYST
OS
GND
NC
V+
NDS356P
R1
(100k)
LM26NV
0.1
1N4001
5V
5V Fan
MC05J3
Comair-Rotron
The LM26NV switches the fan on when the measured temperature exceeds the trip temperature.
Figure 8. Fan High Side Drive
12V
1N4001
Vout
HYST
OS
GND
NC
V+
TOYO
USTF802512HW
R1
(1k)
LM26NV
5V
0.1
The LM26LV sinks causes the switch to sink the fan current when the measured temperature exceeds the trip
temperature.
Figure 9. Fan Low Side Drive
5V
THERMALLY COUPLED
LM26NV
+28V
8:
HYST
+
-
GND
NC
OS
NDS356P
V+
100k
IC1 -28V
LM3886
20k
1k
47k
3.3 PF
Audio
Input
0.1 PF
1N4001
5V
5V Fan
MC05J3
Comair-Rotron
10 PF
By thermally coupling the LM26NV to the audio power amplifier, the LM26NV safeguards the amplifier from
overheating, turning on the fan when it temperature exceeds the trip temperature.
Figure 10. Audio Power Amplifier Thermal Protection
8
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5V
HYST
OS
GND
NC
V+
Heater
Supply
R1
(10k)
LM26NV
Heater
0.1
5V
When the measured temperature is below the trip temperature of the LM26NV, the OS output will be high, causing
the switch and relay to close. When the temperature exceeds the trip point, OS goes low and shuts off the relay and
heater.
Figure 11. Simple Thermostat
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LM26NV
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REVISION HISTORY
Changes from Revision A (March 2013) to Revision B
•
10
Page
Changed layout of National Data Sheet to TI format ............................................................................................................ 9
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PACKAGE OPTION ADDENDUM
www.ti.com
5-Feb-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM26CIM5-YPE/NOPB
ACTIVE
SOT-23
DBV
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-55 to 125
TYPE
LM26CIM5X-YPE/NOPB
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-55 to 125
TYPE
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
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5-Feb-2014
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
3-Aug-2017
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
LM26CIM5-YPE/NOPB
SOT-23
DBV
5
1000
179.0
8.4
LM26CIM5X-YPE/NOPB
SOT-23
DBV
5
3000
179.0
8.4
Pack Materials-Page 1
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
3.2
3.2
1.4
4.0
8.0
Q3
3.2
3.2
1.4
4.0
8.0
Q3
PACKAGE MATERIALS INFORMATION
www.ti.com
3-Aug-2017
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM26CIM5-YPE/NOPB
SOT-23
DBV
5
1000
203.0
203.0
35.0
LM26CIM5X-YPE/NOPB
SOT-23
DBV
5
3000
203.0
203.0
35.0
Pack Materials-Page 2
PACKAGE OUTLINE
DBV0005A
SOT-23 - 1.45 mm max height
SCALE 4.000
SMALL OUTLINE TRANSISTOR
C
3.0
2.6
1.75
1.45
PIN 1
INDEX AREA
1
0.1 C
B
A
5
2X 0.95
1.9
1.45
0.90
3.05
2.75
1.9
2
4
0.5
5X
0.3
0.2
3
(1.1)
C A B
0.15
TYP
0.00
0.25
GAGE PLANE
8
TYP
0
0.22
TYP
0.08
0.6
TYP
0.3
SEATING PLANE
4214839/E 09/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Refernce JEDEC MO-178.
4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
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EXAMPLE BOARD LAYOUT
DBV0005A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
5X (1.1)
1
5
5X (0.6)
SYMM
(1.9)
2
2X (0.95)
3
4
(R0.05) TYP
(2.6)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
EXPOSED METAL
EXPOSED METAL
0.07 MIN
ARROUND
0.07 MAX
ARROUND
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4214839/E 09/2019
NOTES: (continued)
5. Publication IPC-7351 may have alternate designs.
6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
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EXAMPLE STENCIL DESIGN
DBV0005A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
5X (1.1)
1
5
5X (0.6)
SYMM
(1.9)
2
2X(0.95)
4
3
(R0.05) TYP
(2.6)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
4214839/E 09/2019
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.
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