Texas Instruments | ±1°C Remote and Local Temperature Sensor (Rev. C) | Datasheet | Texas Instruments ±1°C Remote and Local Temperature Sensor (Rev. C) Datasheet

Texas Instruments ±1°C Remote and Local Temperature Sensor (Rev. C) Datasheet
TMP421
TMP422
TMP423
www.ti.com
SBOS398C – JULY 2007 – REVISED MAY 2012
±1°C Remote and Local TEMPERATURE SENSOR
Check for Samples: TMP421, TMP422, TMP423
FEATURES
DESCRIPTION
•
•
•
•
•
•
•
•
•
The TMP421, TMP422, and TMP423 are remote
temperature sensor monitors with a built-in local
temperature sensor. The remote temperature sensor
diode-connected transistors are typically low-cost,
NPN- or PNP-type transistors or diodes that are an
integral part of microcontrollers, microprocessors, or
FPGAs.
1
234
SOT23-8 and DSBGA (WCSP) PACKAGES
±1°C REMOTE DIODE SENSOR (MAX)
±1.5°C LOCAL TEMPERATURE SENSOR (MAX)
SERIES RESISTANCE CANCELLATION
n-FACTOR CORRECTION
TWO-WIRE/ SMBus™ SERIAL INTERFACE
MULTIPLE INTERFACE ADDRESSES
DIODE FAULT DETECTION
RoHS COMPLIANT AND NO Sb/Br
APPLICATIONS
•
•
•
•
•
PROCESSOR/FPGA TEMPERATURE
MONITORING
LCD/ DLP®/LCOS PROJECTORS
SERVERS
CENTRAL OFFICE TELECOM EQUIPMENT
STORAGE AREA NETWORKS (SAN)
Remote accuracy is ±1°C for multiple IC
manufacturers, with no calibration needed. The twowire serial interface accepts SMBus write byte, read
byte, send byte, and receive byte commands to
configure the device.
The TMP421, TMP422, and TMP423 include series
resistance cancellation, programmable non-ideality
factor, wide remote temperature measurement range
(up to +150°C), and diode fault detection.
The TMP421, TMP422, and TMP423 are all available
in a SOT23-8 package. The TMP421C is also
available in a DSBGA (WCSP) package.
+5V
TMP421
1
TMP422
2
DX1
SCL
DXP1
2
2
DXN
8
V+
1
1
DXP
TMP423
DX2
SDA
DXP2
7
6
SMBus
Controller
3
A1
3
3
DX3
4
A0
4
DXP3
4
DX4
DXN
GND
5
1 Channel Local
1 Channel Remote
1 Channel Local
2 Channels Remote
1 Channel Local
3 Channels Remote
1
2
3
4
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
DLP is a registered trademark of Texas Instruments.
SMBus is a trademark of Intel Corporation.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007–2012, Texas Instruments Incorporated
TMP421
TMP422
TMP423
SBOS398C – JULY 2007 – REVISED MAY 2012
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE INFORMATION (1)
PRODUCT
DESCRIPTION
TMP421
Single Channel
Remote Junction
Temperature Sensor
TMP421C
TMP422
TMP423A
TMP423B
(1)
Dual Channel
Remote Junction
Temperature Sensor
Triple Channel
Remote Junction
Temperature Sensor
TWO-WIRE
ADDRESS
PACKAGE-LEAD
PACKAGE
DESIGNATOR
PACKAGE
MARKING
100 11xx
SOT23-8
DCN
DACI
100 11xx
DSBGA-8
YZD
TMP421
100 11xx
SOT23-8
DCN
DADI
100 1100
SOT23-8
DCN
DAEI
100 1101
SOT23-8
DCN
DAFI
For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS (1)
Over operating free-air temperature range, unless otherwise noted.
Power Supply, VS
Input Voltage
Pins 1, 2, 3, and 4 only
Pins 6 and 7 only
Input Current
TMP421, TMP422, TMP423
UNIT
+7
V
–0.5 to VS + 0.5
V
–0.5 to 7
V
10
mA
Operating Temperature Range
–55 to +127
°C
Storage Temperature Range
–60 to +130
°C
Junction Temperature (TJ max)
ESD Rating
(1)
2
+150
°C
Human Body Model (HBM)
3000
V
Charged Device Model (CDM)
1000
V
Machine Model (MM)
200
V
Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
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Product Folder Link(s): TMP421 TMP422 TMP423
TMP421
TMP422
TMP423
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SBOS398C – JULY 2007 – REVISED MAY 2012
ELECTRICAL CHARACTERISTICS: TMP421, TMP422, TMP423
At TA = –40°C to +125°C and V+ = 2.7V to 5.5V, unless otherwise noted.
TMP421, TMP422, TMP423
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNIT
TEMPERATURE ERROR
Local Temperature Sensor
Remote Temperature Sensor (1)
TELOCAL
TEREMOTE
vs Supply (Local/Remote)
TA = –40°C to +125°C
±1.25
±2.5
°C
TA = +15°C to +85°C, V+ = 3.3V
±0.25
±1.5
°C
TA = +15°C to +85°C, TD = –40°C to +150°C, V+ = 3.3V
±0.25
±1
°C
TA = –40°C to +100°C, TD = –40°C to +150°C, V+ = 3.3V
±1
±3
°C
TA = –40°C to +125°C, TD = –40°C to +150°C
±3
±5
°C
V+ = 2.7V to 5.5V
±0.2
±0.5
°C/V
115
130
ms
TEMPERATURE MEASUREMENT
Conversion Time (per channel)
100
Resolution
Local Temperature Sensor (programmable)
12
Bits
Remote Temperature Sensor
12
Bits
Remote Sensor Source Currents
120
μA
Medium High
60
μA
Medium Low
12
μA
Low
6
μA
High
Remote Transistor Ideality Factor
Series Resistance 3kΩ Max
η
TMP421/22/23 Optimized Ideality Factor
1.008
SMBus INTERFACE
Logic Input High Voltage (SCL, SDA)
VIH
Logic Input Low Voltage (SCL, SDA)
VIL
2.1
Hysteresis
500
SMBus Output Low Sink Current
SDA Output Low Voltage
V
0.8
6
VOL
IOUT = 6mA
0 ≤ VIN ≤ 6V
Logic Input Current
mA
0.15
–1
SMBus Input Capacitance (SCL, SDA)
0.4
V
+1
μA
3.4
MHz
35
ms
1
μs
3
SMBus Clock Frequency
SMBus Timeout
25
V
mV
30
SCL Falling Edge to SDA Valid Time
pF
DIGITAL INPUTS
Input Capacitance
3
pF
Input Logic Levels
Input High Voltage
VIH
0.7(V+)
(V+)+0.5
Input Low Voltage
VIL
–0.5
0.3(V+)
V
Leakage Input Current
IIN
1
μA
0V ≤ VIN ≤ V+
V
POWER SUPPLY
Specified Voltage Range
Quiescent Current
Undervoltage Lockout
Power-On Reset Threshold
V+
IQ
5.5
V
0.0625 Conversions per Second
2.7
32
38
μA
Eight Conversions per Second
400
525
μA
Serial Bus Inactive, Shutdown Mode
3
10
μA
Serial Bus Active, fS = 400kHz, Shutdown Mode
90
Serial Bus Active, fS = 3.4MHz, Shutdown Mode
350
UVLO
2.3
POR
μA
μA
2.4
2.6
V
1.6
2.3
V
°C
TEMPERATURE RANGE
Specified Range
–40
+125
Storage Range
–60
+130
Thermal Resistance
(1)
θJA
SOT23
100
°C
°C/W
Tested with less than 5Ω effective series resistance and 100pF differential input capacitance.
Copyright © 2007–2012, Texas Instruments Incorporated
Product Folder Link(s): TMP421 TMP422 TMP423
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TMP421
TMP422
TMP423
SBOS398C – JULY 2007 – REVISED MAY 2012
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ELECTRICAL CHARACTERISTICS: TMP421C
At TA = –40°C to +125°C and V+ = 2.55V to 5.5V, unless otherwise noted.
TMP421C
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNIT
TEMPERATURE ERROR
Local Temperature Sensor
Remote Temperature Sensor (1)
TELOCAL
TEREMOTE
vs Supply (Local/Remote)
TA = –40°C to +125°C
±1.25
±2.5
°C
TA = +15°C to +85°C, V+ = 3.3V
±0.25
±1.5
°C
TA = +15°C to +85°C, TD = –40°C to +150°C, V+ = 3.3V
±0.25
±1
°C
TA = –40°C to +100°C, TD = –40°C to +150°C, V+ = 3.3V
±1
±3
°C
TA = –40°C to +125°C, TD = –40°C to +150°C
±3
±5
°C
V+ = 2.55V to 5.5V
±0.2
±0.5
°C/V
115
130
ms
TEMPERATURE MEASUREMENT
Conversion Time (per channel)
100
Resolution
Local Temperature Sensor (programmable)
12
Bits
Remote Temperature Sensor
12
Bits
Remote Sensor Source Currents
120
μA
Medium High
60
μA
Medium Low
12
μA
Low
6
μA
High
Remote Transistor Ideality Factor
Series Resistance 3kΩ Max
η
TMP421C Optimized Ideality Factor
1.008
SMBus INTERFACE
Logic Input High Voltage (SCL, SDA)
VIH
Logic Input Low Voltage (SCL, SDA)
VIL
2.1
Hysteresis
500
SMBus Output Low Sink Current
SDA Output Low Voltage
V
0.8
6
VOL
IOUT = 6mA
mA
0.15
0 ≤ VIN ≤ 6V
Logic Input Current
–1
SMBus Input Capacitance (SCL, SDA)
0.4
V
+1
μA
3.4
MHz
35
ms
1
μs
3
SMBus Clock Frequency
SMBus Timeout
25
V
mV
30
SCL Falling Edge to SDA Valid Time
pF
DIGITAL INPUTS
Input Capacitance
3
pF
Input Logic Levels
Input High Voltage
VIH
0.7(V+)
(V+)+0.5
Input Low Voltage
VIL
–0.5
0.3(V+)
V
Leakage Input Current
IIN
1
μA
0V ≤ VIN ≤ V+
V
POWER SUPPLY
Specified Voltage Range
Quiescent Current
Undervoltage Lockout
Power-On Reset Threshold
V+
IQ
5.5
V
0.0625 Conversions per Second
2.55
32
38
μA
Eight Conversions per Second
400
525
μA
Serial Bus Inactive, Shutdown Mode
3
10
μA
Serial Bus Active, fS = 400kHz, Shutdown Mode
90
Serial Bus Active, fS = 3.4MHz, Shutdown Mode
350
UVLO
2.3
POR
μA
μA
2.4
2.5
V
1.6
2.3
V
°C
TEMPERATURE RANGE
Specified Range
–40
+125
Storage Range
–60
+130
Thermal Resistance
(1)
4
θJA
DSBGA
128
°C
°C/W
Tested with less than 5Ω effective series resistance and 100pF differential input capacitance.
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Product Folder Link(s): TMP421 TMP422 TMP423
TMP421
TMP422
TMP423
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SBOS398C – JULY 2007 – REVISED MAY 2012
TMP421 PIN CONFIGURATION
DCN PACKAGE
SOT23-8
(TOP VIEW)
1
DXN
2
8
V+
7
SCL
TMP421
A1
3
6
SDA
A0
4
5
GND
DXP
1
DXN
2
A1
3
A0
4
TMP421C
DXP
YZD PACKAGE
DSBGA-8
(TOP VIEW)
8
V+
7
SCL
6
SDA
5
GND
TMP421 PIN ASSIGNMENTS
TMP421
NO.
NAME
1
DXP
DESCRIPTION
Positive connection to remote temperature sensor.
2
DXN
Negative connection to remote temperature sensor.
3
A1
Address pin
4
A0
Address pin
5
GND
Ground
6
SDA
Serial data line for SMBus, open-drain; requires pull-up resistor to V+.
7
SCL
Serial clock line for SMBus, open-drain; requires pull-up resistor to V+.
8
V+
Positive supply voltage (2.7V to 5.5V for the TMP421; 2.55V to 5.5V for the TMP421C)
TMP422 PIN CONFIGURATION
DCN PACKAGE
SOT23-8
(TOP VIEW)
DX1
1
DX2
2
8
V+
7
SCL
TMP422
DX3
3
6
SDA
DX4
4
5
GND
TMP422 PIN ASSIGNMENTS
TMP422
NO.
NAME
1
DX1
DESCRIPTION
Channel 1 remote temperature sensor connection pin. Also sets the TMP422 address; see Table 10.
2
DX2
Channel 1 remote temperature sensor connection pin. Also sets the TMP422 address; see Table 10.
3
DX3
Channel 2 remote temperature sensor connection pin. Also sets the TMP422 address; see Table 10.
4
DX4
Channel 2 remote temperature sensor connection pin. Also sets the TMP422 address; see Table 10.
5
GND
Ground
6
SDA
Serial data line for SMBus, open-drain; requires pull-up resistor to V+.
7
SCL
Serial clock line for SMBus, open-drain; requires pull-up resistor to V+.
8
V+
Positive supply voltage (2.7V to 5.5V)
Copyright © 2007–2012, Texas Instruments Incorporated
Product Folder Link(s): TMP421 TMP422 TMP423
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TMP421
TMP422
TMP423
SBOS398C – JULY 2007 – REVISED MAY 2012
www.ti.com
TMP423 PIN CONFIGURATION
DCN PACKAGE
SOT23-8
(TOP VIEW)
DXP1
1
DXP2
2
8
V+
7
SCL
TMP423
DXP3
3
6
SDA
DXN
4
5
GND
TMP423 PIN ASSIGNMENTS
TMP423
6
NO.
NAME
DESCRIPTION
1
DXP1
Channel 1 positive connection to remote temperature sensor.
2
DXP2
Channel 2 positive connection to remote temperature sensor.
3
DXP3
Channel 3 positive connection to remote temperature sensor.
4
DXN
Common negative connection to remote temperature sensors, Channel 1, Channel 2, Channel 3.
5
GND
Ground
6
SDA
Serial data line for SMBus, open-drain; requires pull-up resistor to V+.
7
SCL
Serial clock line for SMBus, open-drain; requires pull-up resistor to V+.
8
V+
Positive supply voltage (2.7V to 5.5V)
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TMP422
TMP423
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SBOS398C – JULY 2007 – REVISED MAY 2012
TYPICAL CHARACTERISTICS
At TA = +25°C and V+ = +5.0V, unless otherwise noted.
REMOTE TEMPERATURE ERROR
vs TEMPERATURE
3
V+ = 3.3V
TREMOTE = +25°C
2
30 Typical Units Shown
h = 1.008
1
0
-1
-2
2
1
0
-1
-2
-3
-3
-50
0
-25
25
50
75
100
125
-50
-25
0
25
50
75
100
Ambient Temperature, TA (°C)
Ambient Temperature, TA (°C)
Figure 1.
Figure 2.
REMOTE TEMPERATURE ERROR
vs LEAKAGE RESISTANCE
REMOTE TEMPERATURE ERROR
vs SERIES RESISTANCE
(Diode-Connected Transistor, 2N3906 PNP)
125
2.0
Remote Temperature Error (°C)
60
Remote Temperature Error (°C)
50 Units Shown
V+ = 3.3V
Local Temperature Error (°C)
Remote Temperature Error (°C)
3
LOCAL TEMPERATURE ERROR
vs TEMPERATURE
40
20
R - GND
0
R - V+
-20
-40
1.5
V+ = 2.7V
1.0
0.5
0
V+ = 5.5V
-0.5
-1.0
-1.5
-2.0
-60
0
5
10
15
20
25
30
0
500
Leakage Resistance (MW )
Figure 3.
1000
1500
2000
2500
3000
3500
RS ( W )
Figure 4.
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TMP421
TMP422
TMP423
SBOS398C – JULY 2007 – REVISED MAY 2012
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TYPICAL CHARACTERISTICS (continued)
At TA = +25°C and V+ = +5.0V, unless otherwise noted.
REMOTE TEMPERATURE ERROR
vs SERIES RESISTANCE
(GND Collector-Connected Transistor, 2N3906 PNP)
REMOTE TEMPERATURE ERROR
vs DIFFERENTIAL CAPACITANCE
3
1.5
Remote Temperature Error (°C)
Remote Temperature Error (°C)
2.0
V+ = 2.7V
1.0
0.5
V+ = 5.5V
0
-0.5
-1.0
-1.5
-2.0
2
1
0
-1
-2
-3
0
500
1000
1500
2000
2500
3000
0
3500
0.5
1.0
TEMPERATURE ERROR
vs POWER-SUPPLY NOISE FREQUENCY
QUIESCENT CURRENT
vs CONVERSION RATE
15
10
450
400
350
5
0
-5
300
200
150
-15
100
-20
50
0
0.0625
-25
5
10
V+ = 5.5V
250
-10
0
3.0
500
Local 100mVPP Noise
Remote 100mVPP Noise
Local 250mVPP Noise
Remote 250mVPP Noise
IQ (mA)
Temperature Error (°C)
2.5
Figure 6.
20
15
V+ = 2.7V
0.125
Frequency (MHz)
0.25
0.5
1
2
4
8
Conversion Rate (conversions/sec)
Figure 7.
Figure 8.
SHUTDOWN QUIESCENT CURRENT
vs SCL CLOCK FREQUENCY
SHUTDOWN QUIESCENT CURRENT
vs SUPPLY VOLTAGE
500
8
450
7
400
6
350
5
300
250
IQ (mA)
IQ (mA)
2.0
Figure 5.
25
V+ = 5.5V
200
4
3
150
2
100
1
50
V+ = 3.3V
0
0
1k
10k
100k
1M
10M
2.5
3.0
SCL CLock Frequency (Hz)
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3.5
4.0
4.5
5.0
5.5
V+ (V)
Figure 9.
8
1.5
Capacitance (nF)
RS (W)
Figure 10.
Copyright © 2007–2012, Texas Instruments Incorporated
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TMP422
TMP423
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SBOS398C – JULY 2007 – REVISED MAY 2012
APPLICATION INFORMATION
The TMP421 is a two-channel digital temperature
sensor that combines a local die temperaturemeasurement channel and a remote-junction
temperature-measurement channel, and is available
in SOT23-8 and DSBGA-8 packages. The TMP422
(three-channel), and TMP423 (four-channel) are
digital temperature sensors that combine a local die
temperature measurement channel and two or three
remote junction temperature measurement channels,
respectively, in a single SOT23-8 package. These
devices are two-wire- and SMBus interfacecompatible and are specified over a temperature
range of –40°C to +125°C. The TMP421/22/23 each
contain multiple registers for holding configuration
information and temperature measurement results.
For proper remote temperature sensing operation, the
TMP421 requires only a transistor connected
between DXP and DXN pins. If the remote channel is
not utilized, DXP can be left open or tied to GND.
The TMP422 requires transistors connected between
DX1 and DX2 and between DX3 and DX4. Unused
channels on the TMP422 must be connected to GND.
The TMP423 requires a transistor connected to each
positive channel (DXP1, DXP2, and DXP3), with the
base of each channel tied to the common negative,
DXN. For an unused channel, the TMP423 DXP pin
can be left open or tied to GND.
The TMP421/22/23 SCL and SDA interface pins each
require pull-up resistors as part of the communication
bus. A 0.1μF power-supply bypass capacitor is
recommended for local bypassing. Figure 11,
Figure 12, and Figure 13 show typical configurations
for the TMP421, TMP422, and TMP423, respectively.
+5V
Transistor-connected configuration(1):
0.1mF
Series Resistance
RS(2)
8
1
CDIFF(3)
RS(2)
2
3
4
(1)
Diode-connected configuration :
V+
SCL
DXP
DXN
TMP421
SDA
10kW
(typ)
10kW
(typ)
7
6
SMBus
Controller
A1
A0
GND
5
RS(2)
RS(2)
CDIFF(3)
(1) Diode-connected configuration provides better settling time. Transistor-connected configuration provides better series resistance
cancellation.
(2) RS (optional) should be < 1.5kΩ in most applications. Selection of RS depends on application; see the Filtering section.
(3) CDIFF (optional) should be < 1000pF in most applications. Selection of CDIFF depends on application; see the Filtering section and
Figure 6, Remote Temperature Error vs Differential Capacitance.
Figure 11. TMP421 Basic Connections
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TMP421
TMP422
TMP423
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+5V
Transistor-connected configuration(1):
0.1mF
Series Resistance
RS(2)
DXP1
8
1
CDIFF(3)
RS(2)
2
V+
DX1(4)
DXN1
SMBus
Controller
6
SDA
TMP422
RS(2)
DXP2
10kW
(typ)
7
SCL
DX2(4)
10kW
(typ)
3
CDIFF(3)
RS(2)
4
DX3(4)
DX4(4)
DXN2
GND
5
Diode-connected configuration(1):
RS(2)
RS(2)
CDIFF(3)
(1) Diode-connected configuration provides better settling time. Transistor-connected configuration provides better series resistance
cancellation.
(2) RS (optional) should be < 1.5kΩ in most applications. Selection of RS depends on application; see the Filtering section.
(3) CDIFF (optional) should be < 1000pF in most applications. Selection of CDIFF depends on application; see the Filtering section and
Figure 6, Remote Temperature Error vs Differential Capacitance.
(4) TMP422 SMBus slave address is 1001 100 when connected as shown.
Figure 12. TMP422 Basic Connections
+5V
(1)
Transistor-connected configuration :
8
RS(2)
RS(2)
RS(2)
RS(2)
RS(2)
1
CDIFF(3)
2
V+
DXP1
SCL
10kW
(typ)
7
SDA 6
DXP2
CDIFF(3)
SMBus
Controller
TMP423
3
CDIFF(3)
RS(2)
10kW
(typ)
0.1mF
Series Resistance
4
DXP3
DXN
GND
5
Diode-connected configuration(1):
RS(2)
DXP
RS(2)
CDIFF(3)
DXN
(1) Diode-connected configuration provides better settling time. Transistor-connected configuration provides better series resistance
cancellation.
(2) RS (optional) should be < 1.5kΩ in most applications. Selection of RS depends on application; see the Filtering section.
(3) CDIFF (optional) should be < 1000pF in most applications. Selection of CDIFF depends on application; see the Filtering section and
Figure 6, Remote Temperature Error vs Differential Capacitance.
Figure 13. TMP423 Basic Connections
10
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SBOS398C – JULY 2007 – REVISED MAY 2012
SERIES RESISTANCE CANCELLATION
Series resistance in an application circuit that typically
results from printed circuit board (PCB) trace
resistance and remote line length is automatically
cancelled by the TMP421/22/23, preventing what
would otherwise result in a temperature offset. A total
of up to 3kΩ of series line resistance is cancelled by
the TMP421/22/23, eliminating the need for additional
characterization and temperature offset correction.
See the two Remote Temperature Error vs Series
Resistance typical characteristic curves (Figure 4 and
Figure 5) for details on the effects of series resistance
and power-supply voltage on sensed remote
temperature error.
changing bit 2 (RANGE) of Configuration Register 1
from low to high. The change in measurement range
and data format from standard binary to extended
binary occurs at the next temperature conversion. For
data captured in the extended temperature range
configuration, an offset of 64 (40h) is added to the
standard binary value, as shown in the Extended
Binary column of Table 1. This configuration allows
measurement of temperatures as low as –64°C, and
as high as +191°C; however, most temperaturesensing diodes only measure with the range of –55°C
to +150°C. Additionally, the TMP421/22/23 are rated
only for ambient temperatures ranging from –40°C to
+125°C. Parameters in the Absolute Maximum
Ratings table must be observed.
DIFFERENTIAL INPUT CAPACITANCE
The TMP421/22/23 tolerate differential input
capacitance of up to 1000pF with minimal change in
temperature error. The effect of capacitance on
sensed remote temperature error is illustrated in
Figure 6, Remote Temperature Error vs Differential
Capacitance.
TEMPERATURE MEASUREMENT DATA
Table 1. Temperature Data Format (Local and
Remote Temperature High Bytes)
LOCAL/REMOTE TEMPERATURE REGISTER
HIGH BYTE VALUE (1°C RESOLUTION)
TEMP
(°C)
STANDARD BINARY (1)
EXTENDED BINARY (2)
BINARY
HEX
BINARY
–64
1100 0000
C0
0000 0000
HEX
00
–50
1100 1110
CE
0000 1110
0E
–25
1110 0111
E7
0010 0111
27
Temperature measurement data may be taken over
an operating range of –40°C to +127°C for both local
and remote locations.
0
0000 0000
00
0100 0000
40
1
0000 0001
01
0100 0001
41
5
0000 0101
05
0100 0101
45
However, measurements from –55°C to +150°C can
be made both locally and remotely by reconfiguring
the TMP421/22/23 for the extended temperature
range, as described below.
10
0000 1010
0A
0100 1010
4A
25
0001 1001
19
0101 1001
59
50
0011 0010
32
0111 0010
72
75
0100 1011
4B
1000 1011
8B
Temperature data that result from conversions within
the default measurement range are represented in
binary form, as shown in Table 1, Standard Binary
column. Note that although the device is rated to only
measure temperatures down to –55°C, it may read
temperatures below this level. However, any
temperature below –64°C results in a data value of
–64 (C0h). Likewise, temperatures above +127°C
result in a value of 127 (7Fh). The device can be set
to measure over an extended temperature range by
100
0110 0100
64
1010 0100
A4
125
0111 1101
7D
1011 1101
BD
127
0111 1111
7F
1011 1111
BF
150
0111 1111
7F
1101 0110
D6
175
0111 1111
7F
1110 1111
EF
191
0111 1111
7F
1111 1111
FF
(1)
(2)
Resolution is 1°C/count. Negative numbers are represented in
two's complement format.
Resolution is 1°C/count. All values are unsigned with a –64°C
offset.
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Both local and remote temperature data use two
bytes for data storage. The high byte stores the
temperature with 1°C resolution. The second or low
byte stores the decimal fraction value of the
temperature and allows a higher measurement
resolution, as shown in Table 2. The measurement
resolution for the both the local and remote channels
is 0.0625°C, and is not adjustable.
Table 2. Decimal Fraction Temperature Data
Format (Local and Remote Temperature Low
Bytes)
TEMPERATURE REGISTER LOW BYTE VALUE
(0.0625°C RESOLUTION)(1)
TEMP
(°C)
STANDARD AND EXTENDED BINARY
HEX
0
0000 0000
00
0.0625
0001 0000
10
0.1250
0010 0000
20
0.1875
0011 0000
30
0.2500
0100 0000
40
0.3125
0101 0000
50
0.3750
0110 0000
60
0.4375
0111 0000
70
0.5000
1000 0000
80
0.5625
1001 0000
90
0.6250
1010 0000
A0
0.6875
1011 0000
B0
0.7500
1100 0000
C0
0.8125
1101 0000
D0
0.8750
1110 0000
E0
0.9385
1111 0000
F0
(1) Resolution is 0.0625°C/count. All possible values are shown.
Standard Binary to Decimal Temperature Data
Calculation Example
High byte conversion (for example, 0111 0011):
Convert the right-justified binary high byte to
hexadecimal.
From hexadecimal, multiply the first number by
160 = 1 and the second number by 161 = 16.
The sum equals the decimal equivalent.
0111 0011b → 73h → (3 × 160) + (7 × 161) = 115
Low byte conversion (for example, 0111 0000):
To convert the left-justified binary low-byte to
decimal, use bits 7 through 4 and ignore bits 3
through 0 because they do not affect the value of
the number.
0111b → (0 × 1/2)1 + (1 × 1/2)2 + (1 × 1/2)3 + (1
× 1/2)4 = 0.4375
Standard Decimal to Binary Temperature Data
Calculation Example
For positive temperatures (for example, +20°C):
(+20°C)/(+1°C/count) = 20 → 14h → 0001 0100
Convert the number to binary code with 8-bit,
right-justified format, and MSB = '0' to denote a
positive sign.
+20°C is stored as 0001 0100 → 14h.
For negative temperatures (for example, –20°C):
(|–20|)/(+1°C/count) = 20 → 14h → 0001 0100
Generate the two's complement of a negative
number by complementing the absolute value
binary number and adding 1.
–20°C is stored as 1110 1100 → ECh.
REGISTER INFORMATION
The TMP421/22/23 contain multiple registers for
holding configuration information, temperature
measurement results, and status information. These
registers are described in Figure 14 and Table 3.
POINTER REGISTER
Figure 14 shows the internal register structure of the
TMP421/22/23. The 8-bit Pointer Register is used to
address a given data register. The Pointer Register
identifies which of the data registers should respond
to a read or write command on the two-wire bus. This
register is set with every write command. A write
command must be issued to set the proper value in
the Pointer Register before executing a read
command. Table 3 describes the pointer address of
the TMP421/22/23 registers. The power-on reset
(POR) value of the Pointer Register is 00h (0000
0000b).
Pointer Register
Local and Remote Temperature Registers
Status Register
SDA
Configuration Registers
One-Shot Start Register
Conversion Rate Register
I/O
Control
Interface
N-Factor Correction Registers
SCL
Identification Registers
Software Reset
Figure 14. Internal Register Structure
Note that the final numerical result is the sum of the
high byte and low byte. In negative temperatures, the
unsigned low byte adds to the negative high byte to
result in a value less than the high byte (for instance,
–15 + 0.75 = –14.25, not –15.75).
12
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Table 3. Register Map
BIT DESCRIPTION
POINTER
(HEX)
POR (HEX)
7
6
5
4
3
2
1
0
00
00
LT11
LT10
LT9
LT8
LT7
LT6
LT5
LT4
Local Temperature (High Byte)
01
00
RT11
RT10
RT9
RT8
RT7
RT6
RT5
RT4
Remote Temperature 1
(High Byte) (1)
02
00
RT11
RT10
RT9
RT8
RT7
RT6
RT5
RT4
Remote Temperature 2
(High Byte) (1) (2) (3)
03
00
RT11
RT10
RT9
RT8
RT7
RT6
RT5
RT4
Remote Temperature 3
(High Byte) (1) (3)
08
BUSY
0
0
0
0
0
0
0
Status Register
09
00
0
SD
0
0
0
RANGE
0
0
Configuration Register 1
0A
1C/3C (2)/
7C (3)
0
REN3 (3)
REN
LEN
RC
0
0
Configuration Register 2
0B
07
0F
REN2 (2)
(3)
0
0
0
0
0
R2
R1
R0
X
X
X
X
X
X
X
X
One-Shot Start (4)
Local Temperature (Low Byte)
(1)
Conversion Rate Register
10
00
LT3
LT2
LT1
LT0
0
0
PVLD
0
11
00
RT3
RT2
RT1
RT0
0
0
PVLD
OPEN
Remote Temperature 1 (Low Byte)
12
00
RT3
RT2
RT1
RT0
0
0
PVLD
OPEN
Remote Temperature 2
(Low Byte) (2) (3)
13
00
RT3
RT2
RT1
RT0
0
0
PLVD
OPEN
Remote Temperature 3 (Low Byte) (3)
21
00
NC7
NC6
NC5
NC4
NC3
NC2
NC1
NC0
N Correction 1
22
00
NC7
NC6
NC5
NC4
NC3
NC2
NC1
NC0
N Correction 2 (2)
(3)
23
00
FC
FE
FF
(1)
(2)
(3)
(4)
(5)
REGISTER DESCRIPTION
55
21
N Correction 3
(3)
NC7
NC6
NC5
NC4
NC3
NC2
NC1
NC0
X
X
X
X
X
X
X
X
Software Reset (5)
0
1
0
1
0
1
0
1
Manufacturer ID
0
0
1
0
0
0
0
1
TMP421 Device ID
0
0
1
0
0
0
1
0
TMP422 Device ID
0
0
1
0
0
0
1
1
TMP423 Device ID
Compatible with Two-Byte Read; see Figure 19.
TMP422.
TMP423.
X = undefined. Writing any value to this register initiates a one-shot start; see the One-Shot Conversion section.
X = undefined. Writing any value to this register initiates a software reset; see the Software Reset section.
TEMPERATURE REGISTERS
The TMP421/22/23 have multiple 8-bit registers that
hold temperature measurement results. The local
channel and each of the remote channels have a high
byte register that contains the most significant bits
(MSBs) of the temperature analog-to-digital converter
(ADC) result and a low byte register that contains the
least significant bits (LSBs) of the temperature ADC
result. The local channel high byte address is 00h;
the local channel low byte address is 10h. The
remote channel high byte is at address 01h; the
remote channel low byte address is 11h. For the
TMP422, the second remote channel high byte
address is 02h; the second remote channel low byte
is 12h. The TMP 423 uses the same local and remote
address as the TMP421 and TMP422, with the third
remote channel high byte of 03h; the third remote
channel low byte is 13h. These registers are readonly and are updated by the ADC each time a
temperature measurement is completed.
The TMP421/22/23 contain circuitry to assure that a
low byte register read command returns data from the
same ADC conversion as the immediately preceding
high byte read command. This assurance remains
valid only until another register is read. For proper
operation, the high byte of a temperature register
should be read first. The low byte register should be
read in the next read command. The low byte register
may be left unread if the LSBs are not needed.
Alternatively, the temperature registers may be read
as a 16-bit register by using a single two-byte read
command from address 00h for the local channel
result, or from address 01h for the remote channel
result (02h for the second remote channel result, and
03h for the third remote channel). The high byte is
output first, followed by the low byte. Both bytes of
this read operation are from the same ADC
conversion. The power-on reset value of all
temperature registers is 00h.
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STATUS REGISTER
shutdown mode. When SD is set to '0' again, the
TMP421/22/23 resume continuous conversions.
When SD = '1', a single conversion can be started by
writing to the One-Shot Register. See the One-Shot
Conversion section for more information.
The Status Register reports the state of the
temperature ADCs. Table 4 summarizes the Status
Register bits. The Status Register is read-only, and is
read by accessing pointer address 08h.
The temperature range is set by configuring the
RANGE bit (bit 2) of the Configuration Register.
Setting this bit low configures the TMP421/22/23 for
the standard measurement range (–40°C to +127°C);
temperature conversions will be stored in the
standard binary format. Setting bit 2 high configures
the TMP421/22/23 for the extended measurement
range (–55°C to +150°C); temperature conversions
will be stored in the extended binary format (see
Table 1).
The BUSY bit = '1' if the ADC is making a conversion;
it is set to '0' if the ADC is not converting.
CONFIGURATION REGISTER 1
Configuration Register 1 (pointer address 09h) sets
the temperature range and controls the shutdown
mode. The Configuration Register is set by writing to
pointer address 09h and read by reading from pointer
address 09h. Table 5 summarizes the bits of
Configuration Register 1.
The remaining bits of the Configuration Register are
reserved and must always be set to '0'. The power-on
reset value for this register is 00h.
The shutdown (SD) bit (bit 6) enables or disables the
temperature measurement circuitry. If SD = '0', the
TMP421/22/23 convert continuously at the rate set in
the conversion rate register. When SD is set to '1',
the TMP421/22/23 stop converting when the current
conversion sequence is complete and enter a
CONFIGURATION REGISTER 2
Configuration Register 2 (pointer address 0Ah)
controls which temperature measurement channels
are enabled and whether the external channels have
the resistance correction feature enabled or not.
Table 6 summarizes the bits of Configuration
Register 2.
Table 4. Status Register Format
STATUS REGISTER (Read = 08h, Write = NA)
BIT #
BIT NAME
POR VALUE
(1)
D7
D6
D5
D4
D3
D2
D1
D0
BUSY
0
0
0
0
0
0
0
0 (1)
0
0
0
0
0
0
0
FOR TMP421/TMP423: The BUSY changes to '1' almost immediately (< 100μs) following power-up, as the TMP421/TMP423 begin the
first temperature conversion. It is high whenever the TMP421/TMP423 convert a temperature reading.
FOR TMP422: The BUSY bit changes to '1' approximately 1ms following power-up. It is high whenever the TMP422 converts a
temperature reading.
Table 5. Configuration Register 1 Bit Descriptions
CONFIGURATION REGISTER 1 (Read/Write = 09h, POR = 00h)
14
BIT
NAME
FUNCTION
POWER-ON RESET
VALUE
7
Reserved
—
0
6
SD
0 = Run
1 = Shut Down
0
5, 4, 3
Reserved
—
0
2
Temperature Range
0 = –40°C to +127°C
1 = –55°C to +150°C
0
1, 0
Reserved
—
0
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The RC bit (bit 2) enables the resistance correction
feature for the external temperature channels. If RC =
'1', series resistance correction is enabled; if RC = '0',
resistance correction is disabled. Resistance
correction should be enabled for most applications.
However, disabling the resistance correction may
yield slightly improved temperature measurement
noise performance, and reduce conversion time by
about 50%, which could lower power consumption
when conversion rates of two per second or less are
selected.
For the TMP423 only, the REN3 bit (bit 6) enables
the third external measurement channel. If REN3 =
'1', the third external channel is enabled; if REN3 =
'0', the third external channel is disabled.
The LEN bit (bit 3) enables the local temperature
measurement channel. If LEN = '1', the local channel
is enabled; if LEN = '0', the local channel is disabled.
CONVERSION RATE REGISTER
The REN bit (bit 4) enables external temperature
measurement for channel 1. If REN = '1', the first
external channel is enabled; if REN = '0', the external
channel is disabled.
For the TMP422 and TMP423 only, the REN2 bit (bit
5) enables the second external measurement
channel. If REN2 = '1', the second external channel is
enabled; if REN2 = '0', the second external channel is
disabled.
The temperature measurement sequence is: local
channel, external channel 1, external channel 2,
external channel 3, shutdown, and delay (to set
conversion rate, if necessary). The sequence starts
over with the local channel. If any of the channels are
disabled, they are bypassed in the sequence.
The Conversion Rate Register (pointer address 0Bh)
controls the rate at which temperature conversions
are performed. This register adjusts the idle time
between conversions but not the conversion timing
itself, thereby allowing the TMP421/22/23 power
dissipation to be balanced with the temperature
register update rate. Table 7 describes the
conversion rate options and corresponding current
consumption. A one-shot command can be used
during the idle time between conversions to
immediately start temperature conversions on all
enabled channels.
Table 6. Configuration Register 2 Bit Descriptions
CONFIGURATION REGISTER 2 (Read/Write = 0Ah, POR = 1Ch for TMP421; 3Ch for TMP422; 7Ch for TMP423)
FUNCTION
POWER-ON RESET
VALUE
BIT
NAME
7
Reserved
—
0
6
REN3
0 = External Channel 3 Disabled
1 = External Channel 3 Enabled
1 (TMP423)
0 (TMP421, TMP422)
5
REN2
0 = External Channel 2 Disabled
1 = External Channel 2 Enabled
1 (TMP422, TMP423)
0 (TMP421)
4
REN
0 = External Channel 1 Disabled
1 = External Channel 1 Enabled
1
3
LEN
0 = Local Channel Disabled
1 = Local Channel Enabled
1
2
RC
0 = Resistance Correction Disabled
1 = Resistance Correction Enabled
1
1, 0
Reserved
—
0
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Table 7. Conversion Rate Register
CONVERSION RATE REGISTER (Read/Write = 0Bh, POR = 07h)
AVERAGE IQ (TYP) (μA)
(1)
(2)
R7
R6
R5
R4
R3
R2
R1
R0
CONVERSIONS/SEC
V+ = 2.7V
V+ = 5.5V
0
0
0
0
0
0
0
0
0.0625
11
32
0
0
0
0
0
0
0
1
0.125
17
38
0
0
0
0
0
0
1
0
0.25
28
49
0
0
0
0
0
0
1
1
0.5
47
69
0
0
0
0
0
1
0
0
1
80
103
0
0
0
0
0
1
0
1
2
128
155
0
0
0
0
0
1
1
0
4 (1)
190
220
0
0
0
0
0
1
1
1
8 (2)
373
413
Conversion rate shown is for only one or two enabled measurement channels. When three channels are enabled, the conversion rate is
2 and 2/3 conversions-per-second. When four channels are enabled, the conversion rate is 2 per second.
Conversion rate shown is for only one enabled measurement channel. When two channels are enabled, the conversion rate is 4
conversions-per-second. When three channels are enabled, the conversion rate is 2 and 2/3 conversions-per-second. When four
channels are enabled, the conversion rate is 2 conversions-per-second.
ONE-SHOT CONVERSION
When the TMP421/22/23 are in shutdown mode
(SD = 1 in the Configuration Register 1), a single
conversion is started on all enabled channels by
writing any value to the One-Shot Start Register,
pointer address 0Fh. This write operation starts one
conversion; the TMP421/22/23 return to shutdown
mode when that conversion completes. The value of
the data sent in the write command is irrelevant and
is not stored by the TMP421/22/23. When the
TMP421/22/23 are in shutdown mode, the conversion
sequence currently in process must be completed
before a one-shot command can be issued. One-shot
commands issued during a conversion are ignored.
η-FACTOR CORRECTION REGISTER
The TMP421/22/23 allow for a different η-factor value
to be used for converting remote channel
measurements to temperature. The remote channel
uses sequential current excitation to extract a
differential VBE voltage measurement to determine
the temperature of the remote transistor. Equation 1
describes this voltage and temperature.
VBE2 - VBE1 =
16
hkT
I
ln 2
q
I1
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The value η in Equation 1 is a characteristic of the
particular transistor used for the remote channel. The
power-on reset value for the TMP421/22/23 is η =
1.008. The value in the η-Factor Correction Register
may be used to adjust the effective η-factor according
to Equation 2 and Equation 3.
heff =
1.008 ´ 300
300 - NADJUST
NADJUST = 300 -
300 ´ 1.008
heff
(2)
(3)
The η-correction value must be stored in two'scomplement format, yielding an effective data range
from –128 to +127. The n-correction value may be
written to and read from pointer address 21h. The ηcorrection value for the second remote channel
(TMP422 and TMP423) may be written and read from
pointer address 22h. The η-correction value for the
third remote channel (TMP423 only) may be written
to and read from pointer address 23h. The register
power-on reset value is 00h, thus having no effect
unless the register is written to.
(1)
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SOFTWARE RESET
The TMP421/22/23 may be reset by writing any value
to the Software Reset Register (pointer address
FCh). This action restores the power-on reset state to
all of the TMP421/22/23 registers as well as aborts
any conversion in process. The TMP421/22/23 also
support reset via the two-wire general call address
(0000 0000). The General Call Reset section contains
more information.
Table 8. η-Factor Range
NADJUST
BINARY
HEX
DECIMAL
η
0111 1111
7F
127
1.747977
0000 1010
0A
10
1.042759
0000 1000
08
8
1.035616
0000 0110
06
6
1.028571
0000 0100
04
4
1.021622
0000 0010
02
2
1.014765
0000 0001
01
1
1.011371
0000 0000
00
0
1.008
1111 1111
FF
–1
1.004651
1111 1110
FE
–2
1.001325
1111 1100
FC
–4
0.994737
1111 1010
FA
–6
0.988235
1111 1000
F8
–8
0.981818
1111 0110
F6
–10
0.975484
1000 0000
80
–128
0.706542
GENERAL CALL RESET
The TMP421/22/23 support reset via the two-wire
General Call address 00h (0000 0000b). The
TMP421/22/23 acknowledge the General Call
address and respond to the second byte. If the
second byte is 06h (0000 0110b), the TMP421/22/23
execute a software reset. This software reset restores
the power-on reset state to all TMP421/22/23
registers, and aborts any conversion in progress. The
TMP421/22/23 take no action in response to other
values in the second byte.
IDENTIFICATION REGISTERS
The TMP421/22/23 allow for the two-wire bus
controller to query the device for manufacturer and
device IDs to enable software identification of the
device at the particular two-wire bus address. The
manufacturer ID is obtained by reading from pointer
address FEh. The device ID is obtained by reading
from pointer address FFh. The TMP421/22/23 each
return 55h for the manufacturer code. The TMP421
returns 21h for the device ID; the TMP422 returns
22h for the device ID; and the TMP423 returns 23h
for the device ID. These registers are read-only.
BUS OVERVIEW
The TMP421/22/23 are SMBus interface-compatible.
In SMBus protocol, the device that initiates the
transfer is called a master, and the devices controlled
by the master are slaves. The bus must be controlled
by a master device that generates the serial clock
(SCL), controls the bus access, and generates the
START and STOP conditions.
To address a specific device, a START condition is
initiated. START is indicated by pulling the data line
(SDA) from a high-to-low logic level while SCL is
high. All slaves on the bus shift in the slave address
byte, with the last bit indicating whether a read or
write operation is intended. During the ninth clock
pulse, the slave being addressed responds to the
master by generating an Acknowledge and pulling
SDA low.
Data transfer is then initiated and sent over eight
clock pulses followed by an Acknowledge bit. During
data transfer SDA must remain stable while SCL is
high, because any change in SDA while SCL is high
is interpreted as a control signal.
Once all data have been transferred, the master
generates a STOP condition. STOP is indicated by
pulling SDA from low to high, while SCL is high.
SERIAL INTERFACE
The TMP421/22/23 operate only as a slave device on
either the two-wire bus or the SMBus. Connections to
either bus are made via the open-drain I/O lines, SDA
and SCL. The SDA and SCL pins feature integrated
spike suppression filters and Schmitt triggers to
minimize the effects of input spikes and bus noise.
The TMP421/22/23 support the transmission protocol
for fast (1kHz to 400kHz) and high-speed (1kHz to
3.4MHz) modes. All data bytes are transmitted MSB
first.
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SERIAL BUS ADDRESS
To communicate with the TMP421/22/23, the master
must first address slave devices via a slave address
byte. The slave address byte consists of seven
address bits, and a direction bit indicating the intent
of executing a read or write operation.
DXN connection should be left unconnected. The
polarity of the transistor for external channel 2 (pins 3
and 4) sets the least significant bit of the slave
address. The polarity of the transistor for external
channel 1 (pins 1 and 2) sets the next least
significant bit of the slave address.
Table 9. TMP421 Slave Address Options
Two-Wire Interface Slave Device Addresses
The TMP421 supports nine slave device addresses
and the TMP422 supports four slave device
addresses. The TMP423 has one of two factorypreset slave addresses.
TWO-WIRE SLAVE
ADDRESS
A1
A0
0011 100
Float
0
0011 101
Float
1
0011 110
0
Float
0011 111
1
Float
0101 010
Float
Float
1001 100
0
0
1001 101
0
1
1001 110
1
0
1001 111
1
1
The slave device address for the TMP421 is set by
the A1 and A0 pins according to Table 9.
The slave device address for the TMP422 is set by
the connections between the external transistors and
the TMP422 according to Figure 15 and Table 10. If
one of the channels is unused, the respective DXP
connection should be connected to GND, and the
Table 10. TMP422 Slave Address Options
TWO-WIRE SLAVE ADDRESS
DX1
DX2
DX3
DX4
1001 100
DXP1
DXN1
DXP2
DXN2
1001 101
DXP1
DXN1
DXN2
DXP2
1001 110
DXN1
DXP1
DXP2
DXN2
1001 111
DXN1
DXP1
DXN2
DXP2
SCL
SDA
V+
Q0
Q1
DX1
V+
DX2
SCL
Q2
DX1
V+
DX2
SCL
Q4
DX1
V+
DX2
SCL
Q6
DX1
V+
DX2
SCL
DX3
SDA
DX3
SDA
DX3
SDA
DX3
SDA
DX4
GND
DX4
GND
DX4
GND
DX4
GND
Q3
Address = 1001100
Address = 1001101
Q5
Q7
Address = 1001110
Address = 1001111
Figure 15. TMP422 Connections for Device Address Setup
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The TMP422 checks the polarity of the external
transistor at power-on, or after software reset, by
forcing current to pin 1 while connecting pin 2 to
approximately 0.6V. If the voltage on pin 1 does not
pull up to near the V+ of the TMP422, pin 1 functions
as DXP for channel 1, and the second LSB of the
slave address is '0'. If the voltage on pin 1 does pull
up to near V+, the TMP422 forces current to pin 2
while connecting pin 1 to 0.6V. If the voltage on pin 2
does not pull up to near V+, the TMP422 uses pin 2
for DXP of channel 1, and sets the second LSB of the
slave address to '1'. If both pins are shorted to GND
or if both pins are open, the TMP422 uses pin 1 as
DXP and sets the address bit to '0'. This process is
then repeated for channel 2 (pins 3 and 4).
If the TMP422 is to be used with transistors that are
located on another IC (such as a CPU, DSP, or
graphics processor), it is recommended to use pin 1
or pin 3 as DXP to ensure correct address detection.
If the other IC has a lower supply voltage or is not
powered when the TMP422 tries to detect the slave
address, a protection diode may turn on during the
detection process and the TMP422 may incorrectly
choose the DXP pin and corresponding slave
address. Using pin 1 and/or pin 3 for transistors that
are on other ICs ensures correct operation
independent of supply sequencing or levels.
The TMP423 has a factory-preset slave address. The
TMP423A slave address is 1001100b, and the
TMP423B slave address is 1001101b. The
configuration of the DXP and DXN channels are
independent of the address. Unused DXP channels
can be left open or tied to GND.
READ/WRITE OPERATIONS
Accessing a particular register on the TMP421/22/23
is accomplished by writing the appropriate value to
the Pointer Register. The value for the Pointer
Register is the first byte transferred after the slave
address byte with the R/W bit low. Every write
operation to the TMP421/22/23 requires a value for
the Pointer Register (see Figure 17).
When reading from the TMP421/22/23, the last value
stored in the Pointer Register by a write operation is
used to determine which register is read by a read
operation. To change which register is read for a read
operation, a new value must be written to the Pointer
Register. This transaction is accomplished by issuing
a slave address byte with the R/W bit low, followed
by the Pointer Register byte; no additional data are
required. The master can then generate a START
condition and send the slave address byte with the
R/W bit high to initiate the read command. See
Figure 19 for details of this sequence. If repeated
reads from the same register are desired, it is not
necessary to continually send the Pointer Register
bytes, because the TMP421/22/23 retain the Pointer
Register value until it is changed by the next write
operation. Note that register bytes are sent MSB first,
followed by the LSB.
Read operations should be terminated by issuing a
Not-Acknowledge command at the end of the last
byte to be read. For a single-byte operation, the
master should leave the SDA line high during the
Acknowledge time of the first byte that is read from
the slave. For a two-byte read operation, the master
must pull SDA low during the Acknowledge time of
the first byte read, and should leave SDA high during
the Acknowledge time of the second byte read from
the slave.
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TIMING DIAGRAMS
The TMP421/22/23 are two-wire and SMBuscompatible. Figure 16 to Figure 19 describe the
timing for various operations on the TMP421/22/23.
Parameters for Figure 16 are defined in Table 11.
Bus definitions are:
Bus Idle: Both SDA and SCL lines remain high.
Start Data Transfer: A change in the state of the
SDA line, from high to low, while the SCL line is high,
defines a START condition. Each data transfer
initiates with a START condition. Denoted as S in
Figure 16.
Stop Data Transfer: A change in the state of the
SDA line from low to high while the SCL line is high
defines a STOP condition. Each data transfer
terminates with a repeated START or STOP
condition. Denoted as P in Figure 16.
t(LOW)
Data Transfer: The number of data bytes transferred
between a START and a STOP condition is not
limited and is determined by the master device. The
receiver acknowledges data transfer.
Acknowledge: Each receiving device, when
addressed, is obliged to generate an Acknowledge
bit. A device that acknowledges must pull down the
SDA line during the Acknowledge clock pulse in such
a way that the SDA line is stable low during the high
period of the Acknowledge clock pulse. Setup and
hold times must be taken into account. On a master
receive, data transfer termination can be signaled by
the master generating a Not-Acknowledge on the last
byte that has been transmitted by the slave.
tF
tR
t(HDSTA)
SCL
t(HDSTA)
t(HIGH)
t(HDDAT)
t(SUSTO)
t(SUSTA)
t(SUDAT)
SDA
t(BUF)
P
S
S
P
Figure 16. Two-Wire Timing Diagram
Table 11. Timing Characteristics for Figure 16
FAST MODE
PARAMETER
HIGH-SPEED MODE
MIN
MAX
MIN
MAX
UNIT
0.4
0.001
3.4
MHz
SCL Operating Frequency
f(SCL)
0.001
Bus Free Time Between STOP and START Condition
t(BUF)
600
160
ns
t(HDSTA)
100
100
ns
Repeated START Condition Setup Time
t(SUSTA)
100
100
ns
STOP Condition Setup Time
t(SUSTO)
100
100
ns
Data Hold Time
t(HDDAT)
0 (1)
0 (2)
ns
Data Setup Time
t(SUDAT)
100
10
ns
SCL Clock LOW Period
t(LOW)
1300
160
ns
SCL Clock HIGH Period
t(HIGH)
600
60
Hold time after repeated START condition. After this period, the first clock
is generated.
ns
Clock/Data Fall Time
tF
300
160
Clock/Data Rise Time
tR
300
160
tR
1000
for SCL ≤ 100kHz
(1)
(2)
20
ns
ns
For cases with fall time of SCL less than 20ns and/or the rise or fall time of SDA less than 20ns, the hold time should be greater than
20ns.
For cases with a fall time of SCL less than 10ns and/or the rise or fall time of SDA less than 10ns, the hold time should be greater than
10ns.
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1
9
9
1
¼
SCL
SDA
1
0
0
1
1
0(1)
0
R/W
Start By
Master
P7
P6
P5
P4
P3
P2
P1
ACK By
TMP421/22/23
¼
P0
ACK By
TMP421/22/23
Frame 2 Pointer Register Byte
Frame 1 Two-Wire Slave Address Byte
9
1
SCL
(Continued)
SDA
(Continued)
D7
D6
D5
D4
D3
D2
D1
D0
ACK By
Stop By
TMP421/22/23 Master
Frame 3 Data Byte 1
(1) Slave address 1001100 shown.
Figure 17. Two-Wire Timing Diagram for Write Word Format
1
9
1
9
¼
SCL
SDA
1
0
0
1
1
0
0(1)
R/W
Start By
Master
P7
P6
P5
P4
P3
P2
P1
¼
P0
ACK By
TMP421/22/23
ACK By
TMP421/22/23
Frame 1 Two-Wire Slave Address Byte
Frame 2 Pointer Register Byte
1
9
1
9
SCL
(Continued)
¼
SDA
(Continued)
1
0
0
1
1
0
0(1)
R/W
Start By
Master
D7
D6
D5
D4
ACK By
TMP421/22/23
Frame 3 Two-Wire Slave Address Byte
D3
D2
D1
D0
From
TMP421/22/23
¼
NACK By
Master(2)
Frame 4 Data Byte 1 Read Register
(1) Slave address 1001100 shown.
(2) Master should leave SDA high to terminate a single-byte read operation.
Figure 18. Two-Wire Timing Diagram for Single-Byte Read Format
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1
9
1
9
¼
SCL
SDA
1
0
0
1
1
0
0(1)
P7
R/W
Start By
Master
P6
P5
P4
P3
P2
P1
¼
P0
ACK By
TMP421/22/23
ACK By
TMP421/22/23
Frame 1 Two-Wire Slave Address Byte
Frame 2 Pointer Register Byte
1
9
1
9
SCL
(Continued)
¼
SDA
(Continued)
1
0
0
1
1
0
0(1)
R/W
Start By
Master
D7
D6
D5
D4
ACK By
TMP421/22/23
Frame 3 Two-Wire Slave Address Byte
1
D3
D2
D1
D0
From
TMP421/22/23
¼
ACK By
Master
Frame 4 Data Byte 1 Read Register
9
SCL
(Continued)
SDA
(Continued)
D7
D6
D5
D4
D3
D2
From
TMP421/22/23
D1
D0
NACK By
Master(2)
Stop By
Master
Frame 5 Data Byte 2 Read Register
(1) Slave address 1001100 shown.
(2) Master should leave SDA high to terminate a two-byte read operation.
Figure 19. Two-Wire Timing Diagram for Two-Byte Read Format
HIGH-SPEED MODE
In order for the two-wire bus to operate at frequencies
above 400kHz, the master device must issue a HighSpeed mode (Hs-mode) master code (0000 1xxx) as
the first byte after a START condition to switch the
bus to high-speed operation. The TMP421/22/23 do
not acknowledge this byte, but switch the input filters
on SDA and SCL and the output filter on SDA to
operate in Hs-mode, allowing transfers at up to
3.4MHz. After the Hs-mode master code has been
issued, the master transmits a two-wire slave address
22
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to initiate a data transfer operation. The bus
continues to operate in Hs-mode until a STOP
condition occurs on the bus. Upon receiving the
STOP condition, the TMP421/22/23 switch the input
and output filters back to fast mode operation.
TIMEOUT FUNCTION
The TMP421/22/23 reset the serial interface if either
SCL or SDA are held low for 30ms (typical) between
a START and STOP condition. If the TMP421/22/23
are holding the bus low, the device releases the bus
and waits for a START condition. To avoid activating
the timeout function, it is necessary to maintain a
communication speed of at least 1kHz for the SCL
operating frequency.
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SHUTDOWN MODE (SD)
The TMP421/22/23 Shutdown Mode allows the user
to save maximum power by shutting down all device
circuitry other than the serial interface, reducing
current consumption to typically less than 3μA; see
Figure 10, Shutdown Quiescent Current vs Supply
Voltage. Shutdown Mode is enabled when the SD bit
(bit 6) of Configuration Register 1 is high; the device
shuts down once the current conversion is completed.
When SD is low, the device maintains a continuous
conversion state.
SENSOR FAULT
The TMP421 can sense a fault at the DXP input
resulting from incorrect diode connection. The
TMP421/22/23 can all sense an open circuit. Shortcircuit conditions return a value of –64°C. The
detection circuitry consists of a voltage comparator
that trips when the voltage at DXP exceeds
(V+) – 0.6V (typical). The comparator output is
continuously checked during a conversion. If a fault is
detected, the OPEN bit (bit 0) in the temperature
result register is set to '1' and the rest of the register
bits should be ignored.
When not using the remote sensor with the TMP421,
the DXP and DXN inputs must be connected together
to prevent meaningless fault warnings. When not
using a remote sensor with the TMP422, the DX pins
should be connected (refer to Table 10) such that
DXP connections are grounded and DXN connections
are left open (unconnected). Unused TMP423 DXP
pins can be left open or connected to GND.
UNDERVOLTAGE LOCKOUT
The TMP421/22/23 sense when the power-supply
voltage has reached a minimum voltage level for the
ADC to function. The detection circuitry consists of a
voltage comparator that enables the ADC after the
power supply (V+) exceeds 2.45V (typical). The
comparator output is continuously checked during a
conversion. The TMP421/22/23 do not perform a
temperature conversion if the power supply is not
valid. The PVLD bit (bit 1, see Table 3) of the
individual Local/Remote Temperature Register is set
to '1' and the temperature result may be incorrect.
FILTERING
Remote junction temperature sensors are usually
implemented in a noisy environment. Noise is most
often created by fast digital signals, and it can corrupt
measurements. The TMP421/22/23 have a built-in
65kHz filter on the inputs of DXP and DXN
(TMP421/TMP423), or on the inputs of DX1 through
DX4 (TMP422), to minimize the effects of noise.
However, a bypass capacitor placed differentially
across the inputs of the remote temperature sensor is
recommended to make the application more robust
against unwanted coupled signals. The value of this
capacitor should be between 100pF and 1nF. Some
applications attain better overall accuracy with
additional series resistance; however, this increased
accuracy is application-specific. When series
resistance is added, the total value should not be
greater than 3kΩ. If filtering is needed, suggested
component values are 100pF and 50Ω on each input;
exact values are application-specific.
REMOTE SENSING
The TMP421/22/23 are designed to be used with
either discrete transistors or substrate transistors built
into processor chips and ASICs. Either NPN or PNP
transistors can be used, as long as the base-emitter
junction is used as the remote temperature sense.
NPN transistors must be diode-connected. PNP
transistors can either be transistor- or diodeconnected (see Figure 11, Figure 12, and Figure 13).
Errors in remote temperature sensor readings are
typically the consequence of the ideality factor and
current excitation used by the TMP421/22/23 versus
the manufacturer-specified operating current for a
given transistor. Some manufacturers specify a highlevel and low-level current for the temperaturesensing substrate transistors. The TMP421/22/23 use
6μA for ILOW and 120μA for IHIGH.
The ideality factor (η) is a measured characteristic of
a remote temperature sensor diode as compared to
an ideal diode. The TMP421/22/23 allow for different
η-factor values; see the N-Factor Correction Register
section.
The ideality factor for the TMP421/22/23 is trimmed
to be 1.008. For transistors that have an ideality
factor that does not match the TMP421/22/23,
Equation 4 can be used to calculate the temperature
error. Note that for the equation to be used correctly,
actual temperature (°C) must be converted to kelvins
(K).
TERR =
h - 1.008
´ (273.15 + T(°C))
1.008
(4)
Where:
η = ideality factor of remote temperature sensor
T(°C) = actual temperature
TERR = error in TMP421/22/23 because η ≠ 1.008
Degree delta is the same for °C and K
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For η = 1.004 and T(°C) = 100°C:
power dissipated as a result of exciting the remote
temperature sensor is negligible because of the small
currents used. For a 5.5V supply and maximum
conversion rate of eight conversions per second, the
TMP421/22/23 dissipate 2.3mW (PDIQ = 5.5V ×
415μA). A θJA of 100°C/W (for SOT23 package)
causes the junction temperature to rise approximately
+0.23°C above the ambient.
ǒ
Ǔ
T ERR + 1.004 * 1.008
1.008
ǒ273.15 ) 100°CǓ
T ERR + 1.48°C
(5)
If a discrete transistor is used as the remote
temperature sensor with the TMP421/22/23, the best
accuracy can be achieved by selecting the transistor
according to the following criteria:
1. Base-emitter voltage > 0.25V at 6μA, at the
highest sensed temperature.
2. Base-emitter voltage < 0.95V at 120μA, at the
lowest sensed temperature.
3. Base resistance < 100Ω.
4. Tight control of VBE characteristics indicated by
small variations in hFE (that is, 50 to 150).
Based on these criteria, two recommended smallsignal transistors are the 2N3904 (NPN) or 2N3906
(PNP).
MEASUREMENT ACCURACY AND THERMAL
CONSIDERATIONS
The temperature measurement accuracy of the
TMP421/22/23 depends on the remote and/or local
temperature sensor being at the same temperature
as the system point being monitored. Clearly, if the
temperature sensor is not in good thermal contact
with the part of the system being monitored, then
there will be a delay in the response of the sensor to
a temperature change in the system. For remote
temperature-sensing applications using a substrate
transistor (or a small, SOT23 transistor) placed close
to the device being monitored, this delay is usually
not a concern.
The
local
temperature
sensor
inside
the
TMP421/22/23 monitors the ambient air around the
device. The thermal time constant for the
TMP421/22/23 is approximately two seconds. This
constant implies that if the ambient air changes
quickly by 100°C, it would take the TMP421/22/23
about 10 seconds (that is, five thermal time
constants) to settle to within 1°C of the final value. In
most applications, the TMP421/22/23 package is in
electrical, and therefore thermal, contact with the
printed circuit board (PCB), as well as subjected to
forced airflow. The accuracy of the measured
temperature directly depends on how accurately the
PCB and forced airflow temperatures represent the
temperature that the TMP421/22/23 is measuring.
Additionally, the internal power dissipation of the
TMP421/22/23 can cause the temperature to rise
above the ambient or PCB temperature. The internal
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LAYOUT CONSIDERATIONS
Remote temperature sensing on the TMP421/22/23
measures very small voltages using very low
currents; therefore, noise at the IC inputs must be
minimized.
Most
applications
using
the
TMP421/22/23 will have high digital content, with
several clocks and logic level transitions creating a
noisy environment. Layout should adhere to the
following guidelines:
1. Place the TMP421/22/23 as close to the remote
junction sensor as possible.
2. Route the DXP and DXN traces next to each
other and shield them from adjacent signals
through the use of ground guard traces; see
Figure 20. If a multilayer PCB is used, bury these
traces between ground or V+ planes to shield
them from extrinsic noise sources. 5 mil
(0.127mm) PCB traces are recommended.
3. Minimize additional thermocouple junctions
caused by copper-to-solder connections. If these
junctions are used, make the same number and
approximate
locations
of
copper-to-solder
connections in both the DXP and DXN
connections to cancel any thermocouple effects.
4. Use a 0.1μF local bypass capacitor directly
between the V+ and GND of the TMP421/22/23;
see Figure 21. Minimize filter capacitance
between DXP and DXN to 1000pF or less for
optimum measurement performance. This
capacitance includes any cable capacitance
between the remote temperature sensor and the
TMP421/22/23.
5. If the connection between the remote
temperature sensor and the TMP421/22/23 is
less than 8 in (20.32 cm) long, use a twisted-wire
pair connection. Beyond 8 in, use a twisted,
shielded pair with the shield grounded as close to
the TMP421/22/23 as possible. Leave the remote
sensor connection end of the shield wire open to
avoid ground loops and 60Hz pickup.
6. Thoroughly clean and remove all flux residue in
and around the pins of the TMP421/22/23 to
avoid temperature offset readings as a result of
leakage paths between DXP or DXN and GND,
or between DXP or DXN and V+.
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V+
DXP
Ground or V+ layer
on bottom and/or
top, if possible.
DXN
GND
NOTE: Use minimum 5 mil (0.127mm) traces with 5 mil spacing.
Figure 20. Suggested PCB Layer Cross-Section
0.1mF Capacitor
DXP
1
8
DXN
2
A1
A0
0.1mF Capacitor
GND
GND
PCB Via
PCB Via
V+
DX1
1
8
7
DX2
2
7
3
6
DX3
3
6
4
5
DX4
4
5
TMP421
V+
TMP422
0.1mF Capacitor
DXP
1
8
DXN
2
A1
A0
0.1mF Capacitor
GND
GND
PCB Via
PCB Via
V+
DXP1
1
8
7
DXP2
2
7
3
6
DXP3
3
6
4
5
DXN
4
5
TMP421C
V+
TMP423
Figure 21. Suggested Bypass Capacitor Placement and Trace Shielding
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REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision B (March 2008) to Revision C
Page
•
Removed package name from title ....................................................................................................................................... 1
•
Added new DSBGA package to feature bullet ...................................................................................................................... 1
•
Added TMP421C device to Description section ................................................................................................................... 1
•
Added TMP421C device with DSBGA package to Package Information table .................................................................... 2
•
Added new Electrical Characteristics table for TMP421C .................................................................................................... 4
•
Changed V+ pin voltage range in all Pin Assignment tables from 2.7V to 2.55V ................................................................ 5
•
Added DSBGA package to TMP421 Pin Configuration section ........................................................................................... 5
•
Changed supply voltage minimum range for pin 8 from 2.55V to 2.7V in TMP422 Pin Assignments table ........................ 5
•
Changed supply voltage minimum range for pin 8 from 2.55V to 2.7V in TMP423 Pin Assignments table ........................ 6
•
Changed label from VS to V+ and value from 2.7V to 2.55V in Figure 4 ............................................................................. 7
•
Changed label from VS to V+ and value from 2.7V to 2.55V in Figure 5 ............................................................................. 8
•
Changed label from VS to V+ and value from 2.7V to 2.55V in Figure 8 ............................................................................. 8
•
Added new DSBGA package text to first paragraph of Application Information section ...................................................... 9
•
Changed text in first paragraph of Application Information section ...................................................................................... 9
•
Changed text in first paragraph of Application Information section to clarify temperature measurement channels ............ 9
•
Changed text in last paragraph of Application Information section ...................................................................................... 9
•
Changed minimum temperature value for bit 2 = 0 from –55°C to –40°C in Table 5 ......................................................... 14
•
Changed header row for Table 6 ........................................................................................................................................ 15
•
Changed VS to V+ in Table 7 .............................................................................................................................................. 16
•
Added "(for SOT23 package)" to end of Measurement Accuracy and Thermal Considerations section ........................... 24
•
Changed VDD to V+ in bullet 2 of Layout Considerations section ....................................................................................... 24
•
Added TMP421C to Figure 21 ............................................................................................................................................ 25
26
Submit Documentation Feedback
Copyright © 2007–2012, Texas Instruments Incorporated
Product Folder Link(s): TMP421 TMP422 TMP423
PACKAGE OPTION ADDENDUM
www.ti.com
24-Aug-2018
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TMP421AIDCNR
ACTIVE
SOT-23
DCN
8
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
DACI
TMP421AIDCNT
ACTIVE
SOT-23
DCN
8
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
DACI
TMP421AIDCNTG4
ACTIVE
SOT-23
DCN
8
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
DACI
TMP421YZDR
ACTIVE
DSBGA
YZD
8
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 125
TMP421
TMP421YZDT
ACTIVE
DSBGA
YZD
8
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 125
TMP421
TMP422AIDCNR
ACTIVE
SOT-23
DCN
8
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
DADI
TMP422AIDCNRG4
ACTIVE
SOT-23
DCN
8
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
DADI
TMP422AIDCNT
ACTIVE
SOT-23
DCN
8
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
DADI
TMP422AIDCNTG4
ACTIVE
SOT-23
DCN
8
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
DADI
TMP423AIDCNR
ACTIVE
SOT-23
DCN
8
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
DAEI
TMP423AIDCNRG4
ACTIVE
SOT-23
DCN
8
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
DAEI
TMP423AIDCNT
ACTIVE
SOT-23
DCN
8
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
DAEI
TMP423AIDCNTG4
ACTIVE
SOT-23
DCN
8
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
DAEI
TMP423BIDCNR
ACTIVE
SOT-23
DCN
8
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
DAFI
TMP423BIDCNRG4
ACTIVE
SOT-23
DCN
8
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
DAFI
TMP423BIDCNT
ACTIVE
SOT-23
DCN
8
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
DAFI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
24-Aug-2018
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TMP421, TMP422, TMP423 :
• Automotive: TMP421-Q1, TMP422-Q1, TMP423-Q1
• Enhanced Product: TMP422-EP
NOTE: Qualified Version Definitions:
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
24-Aug-2018
• Enhanced Product - Supports Defense, Aerospace and Medical Applications
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Aug-2017
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
TMP421AIDCNR
SOT-23
DCN
8
3000
179.0
8.4
3.2
TMP421AIDCNT
SOT-23
DCN
8
250
179.0
8.4
3.2
TMP421YZDR
DSBGA
YZD
8
3000
180.0
8.4
1.1
TMP421YZDT
DSBGA
YZD
8
250
180.0
8.4
1.1
TMP422AIDCNR
SOT-23
DCN
8
3000
179.0
8.4
W
Pin1
(mm) Quadrant
3.2
1.4
4.0
8.0
Q3
3.2
1.4
4.0
8.0
Q3
2.29
0.69
4.0
8.0
Q1
2.29
0.69
4.0
8.0
Q1
3.2
3.2
1.4
4.0
8.0
Q3
TMP422AIDCNT
SOT-23
DCN
8
250
179.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
TMP423AIDCNR
SOT-23
DCN
8
3000
179.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
TMP423AIDCNT
SOT-23
DCN
8
250
179.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
TMP423BIDCNR
SOT-23
DCN
8
3000
179.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
TMP423BIDCNT
SOT-23
DCN
8
250
179.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Aug-2017
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TMP421AIDCNR
SOT-23
DCN
8
3000
195.0
200.0
45.0
TMP421AIDCNT
SOT-23
DCN
8
250
195.0
200.0
45.0
TMP421YZDR
DSBGA
YZD
8
3000
182.0
182.0
20.0
TMP421YZDT
DSBGA
YZD
8
250
182.0
182.0
20.0
TMP422AIDCNR
SOT-23
DCN
8
3000
195.0
200.0
45.0
TMP422AIDCNT
SOT-23
DCN
8
250
195.0
200.0
45.0
TMP423AIDCNR
SOT-23
DCN
8
3000
195.0
200.0
45.0
TMP423AIDCNT
SOT-23
DCN
8
250
195.0
200.0
45.0
TMP423BIDCNR
SOT-23
DCN
8
3000
195.0
200.0
45.0
TMP423BIDCNT
SOT-23
DCN
8
250
195.0
200.0
45.0
Pack Materials-Page 2
PACKAGE OUTLINE
YZD0008
DSBGA - 0.625 mm max height
SCALE 8.000
DIE SIZE BALL GRID ARRAY
B
A
E
BALL A1
CORNER
D
C
0.625 MAX
SEATING PLANE
0.35
0.15
BALL TYP
0.05 C
SYMM
D
1.5
TYP
C
SYMM
D: Max = 2.218 mm, Min =2.158 mm
B
E: Max = 1.028 mm, Min =0.968 mm
0.5 TYP
A
8X
0.015
0.35
0.25
C A B
1
2
0.5 TYP
4219545/A 12/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
YZD0008
DSBGA - 0.625 mm max height
DIE SIZE BALL GRID ARRAY
(0.5) TYP
8X ( 0.245)
1
2
A
(0.5) TYP
B
SYMM
C
D
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 30X
0.05 MAX
0.05 MIN
METAL UNDER
SOLDER MASK
( 0.245)
METAL
SOLDER MASK
OPENING
EXPOSED
METAL
( 0.245)
SOLDER MASK
OPENING
EXPOSED
METAL
SOLDER MASK
DEFINED
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
NOT TO SCALE
4219545/A 12/2018
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
See Texas Instruments Literature No. SNVA009 (www.ti.com/lit/snva009).
www.ti.com
EXAMPLE STENCIL DESIGN
YZD0008
DSBGA - 0.625 mm max height
DIE SIZE BALL GRID ARRAY
(0.5) TYP
(R0.05) TYP
8X ( 0.25)
2
1
A
(0.5) TYP
B
SYMM
METAL
TYP
C
D
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE: 30X
4219545/A 12/2018
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
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TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
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AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
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standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
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Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2018, Texas Instruments Incorporated
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