Texas Instruments | 1.5C Accurate Programmable Digital Temperature Sensors With SPI Interface | Datasheet | Texas Instruments 1.5C Accurate Programmable Digital Temperature Sensors With SPI Interface Datasheet

Texas Instruments 1.5C Accurate Programmable Digital Temperature Sensors With SPI Interface Datasheet
TMP122-EP
www.ti.com .......................................................................................................................................................................................... SBOS454 – NOVEMBER 2008
1.5°C ACCURATE PROGRAMMABLE DIGITAL TEMPERATURE SENSORS
WITH SPI™ INTERFACE
FEATURES
1
• Digital Output: SPI-Compatible Interface
• Programmable Resolution: 9 to 12 Bits + Sign
• Aaccuracy: ±1.5°C from -25°C to 85°C (max)
±2.0°C from -55°C to 125°C (max)
• Low Quiescent Current: 50 µA
• Wide Supply Range: 2.7 V to 5.5 V
• Tiny SOT23-6 Package
• Operation to 150°C
• Programmable High/Low Setpoints
2
APPLICATIONS
•
•
•
•
•
•
•
•
•
Power-Supply Temperature Monitoring
Computer Peripheral Thermal Protection
Notebook Computers
Cell Phones
Battery Management
Office Machines
Thermostat Controls
Environmental Monitoring and HVAC
Electromechanical Device Temperature
DESCRIPTION
The TMP122 is an SPI-compatible temperature
sensor available in an SOT23-6 package. Requiring
only a pull-up resistor for complete function, the
TMP122 temperature sensor is capable of measuring
temperatures within 2°C of accuracy over a
temperature range of -55°C to 125°C, with operation
up
to
150°C.
Programmable
resolution,
programmable set points and shut down function
provide versatility for any application. Low supply
current and a supply range from 2.7 V to 5.5 V make
the TMP122 an excellent candidate for low-power
applications.
The TMP122 is ideal for extended thermal
measurement in a variety of communication,
computer, consumer, environmental, industrial, and
instrumentation applications.
SUPPORTS DEFENSE, AEROSPACE,
AND MEDICAL APPLICATIONS
•
•
•
•
•
•
•
(1)
Controlled Baseline
One Assembly/Test Site
One Fabrication Site
Available in Military (–55°C/125°C)
Temperature Range (1)
Extended Product Life Cycle
Extended Product-Change Notification
Product Traceability
Additional temperature ranges are available - contact factory
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
SPI is a trademark of Motorola.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008, Texas Instruments Incorporated
TMP122-EP
SBOS454 – NOVEMBER 2008 .......................................................................................................................................................................................... www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION (1)
PACKAGE (2)
TA
–55°C to 125°C
(1)
(2)
SOT23-6
ORDERABLE PART NUMBER
Tape and reel of 250
TMP122AMDBVTEP
TOP-SIDE MARKING
122E
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
VALUE
UNIT
V+
Power supply
7
V
VI
Input voltage
-0.3 to 7
V
Inout current
TJ (max)
10
mA
Operating temperature range
-55 to 150
°C
Storage temperature range
-60 to 150
°C
Junction temperature
150
°C
Lead temperature (soldering)
300
°C
PIN CONFIGURATION
2
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ELECTRICAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
Temperature
input
TEST CONDITIONS
MIN
Range
Accuracy (temperature error)
Resolution
°C
±0.5
±1.5
-55°C to 125°C
±1.0
±2.0
-55°C to 150°C
±1.5
Selectable
VIH
°C
°C/V
±0.0625
°C
0.7 (V+)
V
VIL
0.3 (V+)
V
0 V ≤ VIN ≤ V+
±1
µA
VOL SO/I
ISINK = 3mA
0.4
V
VOH SO/I
ISOURCE = 2mA
VOL ALERT
Leakage current ALERT
(V+) - 0.4
V
ISINK = 4mA
0 V ≤ VIN ≤ 6 V
Input capacitance, SO/I, SCK, CS,
ALERT
0.4
V
±1
µA
2.5
Reolution
Selectable
9 to 12 + sign
Conversion time
9 bit + sign
30
pF
bits
40
10 bit + sign
60
80
11 bit + sign
120
160
240
320
12 bit + sign
Power supply Operating range
2.7
5.5
Quiescent current IQ
Serial bus inactive
50
75
Shutdown current ISD
Serial bus inactive
0.1
1
Specified range
-55
125
Operating range
-55
150
Storage range
Thermal resistance, θJA
(1)
UNIT
125
0.1
(1)
Input current, SO/I, SCK, CS
Temperature
range
MAX
-25°C to 85°C
vs supply
Digital
input/output
TYP
-55
-60
SOT23-6
surface-mount
ms
V
µA
°C
150
200
°C/W
Specified for 12-bit resolution.
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TYPICAL CHARACTERISTICS
4
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APPLICATION INFORMATION
The TMP122 digital temperature sensor is optimal for thermal management and thermal protection applications.
The TMP122 is SPI interface-compatible and specified for a temperature range of -55°C to 125°C.
The TMP122 requires minimal external components for operation, needing only a pullup resistor on the ALERT
pin and a bypass capacitor on the supply. Bypass capacitors of 0.1 µF is recommended. Figure 1 shows typical
connections for the TMP122.
Figure 1. Typical Connections
To maintain accuracy in applications requiring air or surface temperature measurement, care should be taken to
isolate the package and leads from ambient air temperature.
Figure 2. Multiple Command Sequence
COMMUNICATING WITH THE TMP122
The TMP122 converts continuously. If CS is brought low during a conversion the conversion process continues,
but the last completed conversion is available at the output register. Communication with the TMP122 is initiated
by pulling CS low. The first 16 clocks of data transfer will return temperature data from the temperature sensors.
The 16-bit data word is clocked out sign bit first, followed by the MSB. Any portion of the 16-bit word may be
read before raising CS. If the user wishes to continue with CS low, the following 16 clocks transfer in a READ or
WRITE command. READ and WRITE commands are described in Table 1 and Table 2.
The READ command contains an embedded address in bits D4 and D3 to identify which register to read. Bits D4
and D3 are internally registered and will hold their value following a READ command until an entire 16-bit read is
completed by the user. The completion of the 16-bit READ acknowledges that the READ command has been
completed. If the user issues a READ command and then raises CS with less than 16 subsequent clocks, the
data from that register will be available at the next fall of CS. Teh registered READ address will remain in effect
until a full 16 clocks have been received. After the compleation of a 16-bit READ from the part, the READ
address is reset to return data from the Temperature Register. A WRITE command to a register will not change
the READ address registered. For further discussion on the READ address register, see the Read Address
Register section.
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Multiple commands may be strung together as illustrated in Figure 2. The TMP122 accepts commands
alternating with 16-bit response data. On lowering CS, the part always responds with a READ from the address
location indicated by the READ address register. If the next command is a READ command then data is returned
from the address specified by the READ command with the 16th clock resetting the READ address register to
the default temperature register. The TMP122 then expects a 16-bit command. If the command is a WRITE
command, then the 16 clocks following the command will again return temperature data.
Figure 3, Figure 4, Figure 5, and Figure 6 detail the communication sequences.
Table 1. READ Command
READ Command
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
Temperature
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Configuration
register
1
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
Low temperature
threshold
1
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
High temperature
threshold
1
0
0
0
0
0
0
0
0
0
0
1
1
0
0
0
Table 2. WRITE Command
WRITE Command
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
Temperature
0
0
0
0
D1
D0
R1
R0
F1
F0
POL
TM1
TM0
0
1
0
Low temperature
threshold
T12
T11
T10
T9
T8
T7
T6
T5
T4
T3
T2
T1
T0
1
0
0
High temperature
threshold
T12
T11
T10
T9
T8
T7
T6
T5
T4
T3
T2
T1
T0
1
1
0
Shutdown command
x
x
x
x
x
x
x
x
1
1
1
1
1
1
1
1
Figure 3. READ followed by WRITE Command to TLOW/THIGH Register
Figure 4. READ followed by WRITE Command to Configuration Register
6
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Figure 5. READ followed by READ Command and Response
Figure 6. Data READ
READ ADDRESS REGISTER
Figure 7 shows the internal register structure of the TMP122/TMP124. Table III describes the addresses of the
registers available. The READ address register uses the two bits to identify which of the data registers should
respond to a read command. Following a complete 16-bit read, the READ address register is reset to the default
power-up state of P1/P0 equal 0/0.
Figure 7. Internal Register Structure
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Table 3. Pointer Addresses
P1
P0
REGISTER
0
0
Temperature Register (READ only)
0
1
Configuration Register (READ/WRITE)
1
0
TLOW Register (READ/WRITE)
1
1
THIGH Register (READ/WRITE)
TEMPERATURE REGISTER
The Temperature Register of the TMP122 is a 16-bit, signed read-only register that stores the output of the most
recent conversion. The TMP122 is specified for the temperature range of -55°C to 125°C with operation from
-55°C to 150°C. Up to 16 bits can be read to obtain data and are described in Table 4. The first 13 bits are used
to indicate temperature where bit D2 is 1, and D1, D0 are in a high impedance state. Data format for temperature
is summarized in Table 5. Following power-up or reset, the Temperature Register will read 0°C until the first
conversion is complete.
Table 4. Temperature Register
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
T12
T11
T10
T9
T8
T7
T6
T5
T4
T3
T2
T1
T0
1
Z
Z
Table 5. Temperature Data Format
(1)
TEMPERATURE
(°c)
DIGITAL OUTPUT (1)
(BINARY)
HEX
150
0100 1011 0000 0111
4B07
125
0011 1110 1000 0111
3E87
25
0000 1100 1000 0111
0C87
0.0625
0000 0000 0000 1111
000F
0
0000 0000 0000 0111
0007
-0.0625
1111 1111 1111 1111
FFFF
-25
1111 0011 1000 0111
F387
-55
1110 0100 1000 0111
E487
The last two bits are high impedance and are shown as 11 in the table.
The user can obtain 9, 10, 11, or 12 bits of resolution by addressing the Configuration Register and setting the
resolution bits accordingly. For 9-, 10-, or 11-bit resolution, the most significant bits in the Temperture Register
are used with the unused LSBs set to zero.
CONFIGURATION REGISTER
The Configuration Register is a 16-bit read/write register used to store bits that control the operational modes of
the temperature sensor. Read/write operations are performed MSB first. The format of the Configuration Register
for the TMP122 is shown in Table 6, followed by a break-down of the register bits. The power-up/reset value of
the Configuration Register bits R1/R0 equal 1/1, all other bits equal zero.
Table 6. Configuration Register
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
0
D1
D0
R1
R0
F1
F0
POL
TM1
TM0
0
1
0
SHUTDOWN MODE (SD)
The Shutdown Mode of the TMP122 can be used to shut down all device circuitry except the serial interface.
Shutdown mode occurs when the last 8 bits of the WRITE command are equal to 1, and will occur once the
current conversion is completed, reducing current consumption to less than 1 µA. To take the part out of
shutdown, send any command or pattern after the 16-bit read with the last 8 bits not equal to one. Power on
default is in active mode.
8
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THERMOSTAT MODE (TM1/TM0)
The Thermostat Mode bits of the TMP122 indicate to the device whether to operate in Comparator Mode,
Interrupt Mode or Interrupt Comparator Mode. For more information on Comparator and Interrupt Mode, see text
HIGH and LOW limit registers. The bit assignments for thermostat mode are described in Table 7. Power on
default is comparator mode.
Table 7. Mode Settings
TM1
TM0
MODE OF OPERATION
0
0
Comparator mode
0
1
Interrupt mode
1
0
Interrupt comparator mode
1
1
Reserved
POLARITY (POL)
The Polarity Bit of the TMP122 adjusts the polarity of the ALERT pin output. By default, POL = 0 and the ALERT
pin will be active LOW, as shown in Figure 8. For POL = 1 the ALERT Pin will be active HIGH, and the state of
the ALERT Pin is inverted.
Figure 8. ALERT Output Transfer Function Diagrams
FAULT QUEUE (F1/F0)
A fault condition occurs when the measured temperature exceeds the limits set in the THIGH and TLOW registers.
The Fault Queue is provided to prevent a false alert due to environmental noise and requires consecutive fault
measurements to trigger the alert function of the TMP122. Table 8 defines the number of consecutive faults
required to trigger a consecutive alert condition. Power-on default for F1/F0 is 0/0.
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Table 8. Fault Settings
F1
F0
CONSECUTIVE FAULTS
0
0
1
0
1
2
1
0
4
1
1
6
HIGH AND LOW LIMIT REGISTERS
In Comparator Mode (TM1/TM0 = 0/0), the ALERT Pin of the TMP122 becomes active when the temperature
equals or exceeds the value in THIGH and generates a consecutive number of faults according to fault bits F1 and
F0. The ALERT pin will remain active until the temperature falls below the indicated TLOW value for the same
number of faults.
In Interrupt Mode (TM1/TM0 = 0/1) the ALERT pin becomes active when the temperature equals or exceeds
THIGH for a consecutive number of fault conditions. The ALERT pin remains active until a read operation of any
register occurs. The ALERT pin will also be cleared if the device is placed in Shutdown Mode. Once the ALERT
pin is cleared, it will only become active again by the temperature falling below TLOW. When the temperature falls
below TLOW, the ALERT pin becomes active and remains active until cleared by a read operation of any register.
Once the ALERT pin is cleared, the above cycle will repeat with the ALERT pin becoming active when the
temperature equals or exceeds THIGH.
In Interrupt/Comparator Mode (TM1/TM0 = 1/0), the ALERT Pin of the TMP122 becomes active when the
temperature equals or exceeds the value in THIGH and generates a consecutive number of faults according to
fault bits F1 and F0. The ALERT pin will remain active until the temperature falls below the indicated TLOW value
for the same number of faults and a communication with the device has occurred after that point.
Operational modes are represented in Figure 8. Table 9 and Table 10 describe the format for the THIGH and TLOW
registers. Power-up reset values for THIGH and TLOW are: THIGH = 80°C and TLOW = 75°C. The format of the data
for THIGH and TLOW is the same as for the Temperature Register. TABLE IX. THIGH Register.
All 13 bits for the Temperature, THIGH, and TLOW registers are used in the comparisons for the ALERT function for
all converter resolutions. The three LSBs in THIGH and TLOW can affect the ALERT output even if the converter is
configured for 9-bit resolution.
Table 9. THIGH Register
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
H12
H11
H10
H9
H8
H7
H6
H5
H4
H3
H2
H1
H0
1
1
0
Table 10. TLOW Register
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
L12
L11
L10
L9
L8
L7
L6
L5
L4
L3
L2
L1
L0
1
0
0
CONVERTER RESOLUTION (R1/R0)
The Converter Resolution Bits control the resolution of the internal analog-to-digital (A/D) converter. This allows
the user to maximize efficiency by programming for higher resolution or faster conversion time. Table 11
identifies the resolution bits and the relationship between resolution and conversion time. The TMP122 has a
default resolution of 12 bits.
Table 11. Resolution
10
R1
R2
RESOLUTION
CONVERSION TIME
(TYPICAL)
0
0
9 bits (0.5°C) + sign
30 ms
0
1
10 bits (0.25°C) + sign
60 ms
1
0
11 bits (0.125°C) + sign
120 ms
1
1
12 bits (0.0625°C) + sign
240 ms
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DELAY TIME
The Delay Bits control the amount of time delay between each conversion. This feature allows the user to
maximize power savings by eliminating unnecessary conversions, and minimizing current consumption. During
active conversion the TMP122 typically requires 50 µA of current for approximately 0.25s conversion time, and
approximately 20 µA for idle times between conversions. Delay settings are identified in Table 12 as conversion
time and period, and are shown in Figure 9. Default power up is D1/D0 equal 0/0. Conversion time and
conversion periods scale with resolution. Conversion period denotes time between conversion starts.
Table 12. Conversion Delay for 12-Bit Resolution
D1
D2
CONVERSION TIME
CONVERSION PERIOD
0
0
0.25 s
0.25 s
0
1
0.25 s
0.5 s
1
0
0.25 s
1s
1
1
0.25 s
8s
Figure 9. Conversion Time and Period Description
TIMING DIAGRAMS
The TMP122 is SPI compatible. Figure 10 to Figure 12 describe the various timing parameters of the TMP122
with timing definitions in Table 13.
Table 13. Timing Description
PARAMETER
MIN
MAX
100
UNIT
t1
SCK period
t2
Data in to rising edge SCK setup time
ns
t3
SCK falling edge to output data delay
t4
SCK rising edge to input data hold time
20
t5
CS to rising edge SCK set-up time
40
t6
CS to output data delay
30
ns
t7
CS rising edge to output high impedance
30
ns
20
ns
30
ns
ns
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Figure 10. Output Data Timing Diagram
Figure 11. High Impedance Output Timing Diagram
Figure 12. Input Data Timing Diagram
12
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PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
TMP122AMDBVTEP
ACTIVE
SOT-23
DBV
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-55 to 125
122E
V62/09607-01XE
ACTIVE
SOT-23
DBV
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-55 to 125
122E
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TMP122-EP :
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
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11-Apr-2013
• Catalog: TMP122
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
Addendum-Page 2
PACKAGE OUTLINE
DBV0006A
SOT-23 - 1.45 mm max height
SCALE 4.000
SMALL OUTLINE TRANSISTOR
C
3.0
2.6
1.75
1.45
PIN 1
INDEX AREA
1
0.1 C
B
A
6
2X 0.95
1.9
1.45 MAX
3.05
2.75
5
2
4
0.50
6X
0.25
0.2
C A B
3
(1.1)
0.15
TYP
0.00
0.25
GAGE PLANE
8
TYP
0
0.22
TYP
0.08
0.6
TYP
0.3
SEATING PLANE
4214840/B 03/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.15 per side.
4. Leads 1,2,3 may be wider than leads 4,5,6 for package orientation.
5. Refernce JEDEC MO-178.
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EXAMPLE BOARD LAYOUT
DBV0006A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
6X (1.1)
1
6X (0.6)
6
SYMM
2
5
3
4
2X (0.95)
(R0.05) TYP
(2.6)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
EXPOSED METAL
EXPOSED METAL
0.07 MIN
ARROUND
0.07 MAX
ARROUND
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4214840/B 03/2018
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
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EXAMPLE STENCIL DESIGN
DBV0006A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
6X (1.1)
1
6X (0.6)
6
SYMM
2
5
3
4
2X(0.95)
(R0.05) TYP
(2.6)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
4214840/B 03/2018
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
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