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Texas Instruments TMP1075 EVM (Rev. A) User guides
User's Guide
SNOU157A – March 2018 – Revised April 2018
TMP1075EVM User's Guide
The industry standard LM75/TMP75 is now available with high accuracy and a wider temperature range.
The TMP1075 is a drop-in replacement for the most prevalent digital temperature sensors with enhanced
features. The TMP1075 provides up to ±0.5°C typical accuracy over the −25°C to +85°C range, and ±1°C
typical accuracy over the −55°C to +125°C range with 12-bit resolution, giving a temperature resolution of
0.0625°C. The Texas Instruments TMP1075EVM (Evaluation Module) provides the user a simple way to
get started with TMP1075. The module and GUI are designed to provide the user a quick setup to
evaluate the system and register map. The EVM features a perforation that allows the temperature sensor
to be placed away from the MSP430 for remote temperature measurements and a header to connect
multiple TMP1075’s to the controller. This document provides detailed information about the hardware
design and software installation.
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1
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Contents
Overview ...................................................................................................................... 3
EVM Kit Contents ............................................................................................................ 3
Board Connectors and Components ...................................................................................... 4
System Setup ................................................................................................................ 6
Software Installation ......................................................................................................... 7
Upgrading the Firmware ................................................................................................... 12
TMP1075EVM Setup and Operation .................................................................................... 16
Board Layout ................................................................................................................ 22
Schematic ................................................................................................................... 24
Bill of Materials ............................................................................................................. 25
List of Figures
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.................................................................................... 4
TMP1075 Evaluation Board Bottom Side................................................................................. 4
TMP1075EVM Hardware Setup ........................................................................................... 6
TMP1075EVM Welcome.................................................................................................... 7
TMP1075EVM License Agreement........................................................................................ 8
NI License Agreements ..................................................................................................... 8
TMP1075EVM Installation Directory ...................................................................................... 9
Network Proxy Server ....................................................................................................... 9
TMP1075EVM Select Components Installation ........................................................................ 10
Ready to Install ............................................................................................................. 11
TMP1075EVM Installation Finish ........................................................................................ 11
TMP1075 GUI Firmware Upgrade ....................................................................................... 12
Firmware Update Confirmation ........................................................................................... 13
TMP1075EVM Connection Diagram ..................................................................................... 13
MSP430 USB Firmware Upgrade Program ............................................................................. 14
MSP430 USB Firmware Upgrade Program With No Device Connected ........................................... 14
MSP430 USB Firmware Upgrade Program With Device Found ..................................................... 15
MSP430 USB Firmware Upgrade Program Showing Successful Firmware Update .............................. 15
Confirmation of USB-to-I2C Converter Driver Installation ............................................................ 16
Default Configuration ...................................................................................................... 16
TMP1075EVM Default Tab ............................................................................................... 17
Registers Tab ............................................................................................................... 19
Configuration Tab .......................................................................................................... 20
TMP1075 Set-Up ........................................................................................................... 21
Top Assembly Layer ....................................................................................................... 22
Top Layer Routing ......................................................................................................... 22
Power Layer Routing ...................................................................................................... 22
Ground Layer Routing ..................................................................................................... 23
Bottom Layer Routing ..................................................................................................... 23
Bottom Assembly Layer ................................................................................................... 23
TMP1075EVM Schematic ................................................................................................. 24
TMP1075 Evaluation Board Top Side
List of Tables
2
1
EVM Kit Contents ............................................................................................................ 3
2
Device and Package Configurations ...................................................................................... 4
3
I2C Slave Addresses ........................................................................................................ 6
4
TMP1075EVM Bill of Materials ........................................................................................... 25
TMP1075EVM User's Guide
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Overview
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1
Overview
The TMP1075EVM allows users to evaluate the performance of the best digital temperature sensor
available in the VSSOP8 (MSOP8) package. The EVM comes in a USB stick form factor with an onboard
MSP430F5528 microcontroller that interfaces with both the host computer and up to two TMP1075
devices using I2C interface. The module is designed to provide user flexibility separating the TMP1075
and MSP430 at the perforation location on the EVM board. The perforation allows the user to connect
wires, cable, or header to both ends for remote temperature measurements or connects to desired system
as well as connecting additional TMP1075s.
2
EVM Kit Contents
Table 1 details the contents of the EVM kit. Contact the Texas Instruments Product Information Center
nearest you if any component is missing. TI highly recommends checking the TI website at
http://www.ti.com to verify that you have the latest versions of the related software.
Table 1. EVM Kit Contents
ITEM
QUANTITY
PCB test board: TMP1075EVM
1
USB cable extender
1
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Board Connectors and Components
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Board Connectors and Components
The jumpers and connectors on the EVM, along with how to properly connect, set up, and use the
TMP1075 Bench Board, are described here.
3.1
Input/Output Connector Description and Components
USB Connector (J2)
Breakouts
TMP1075 (U4)
Figure 1. TMP1075 Evaluation Board Top Side
Figure 2. TMP1075 Evaluation Board Bottom Side
Table 2. Device and Package Configurations
4
DEVICE
IC
PACKAGE
U4
TMP1075AIDRVR
VSSOP (8)
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Board Connectors and Components
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3.2
EVM Power Supply Input – J1
TMP1075EVM uses the +5-V input power supply of the USB connector to power the EVM. The EVM does
not require an external power supply. The board is powered by the USB port and switches to +3.3 V. It
can be powered by shorting the J1 jumper with a regulated voltage with desired programmable voltage
such as 1.8 V, 3.3 V, and 3.6 V based on Equation 1. The EVM power supply input can be changed to
any input power supply range of the TMP1075 1.7 V to 5.5 V; however, note that the MSP430 can only
support a power supply range of 1.8 V to 3.6 V with the recommended VOH and VOL conditions listed in the
TMP1075 data sheet specifications.
The resistor adjust RADJ can be calculated using Equation 1 with the desired voltage of VOUT and where
VREF = 1.23 V, RADJ = R6, and R8 = 51.1kΩ.
ª
§ R
·º
VOUT VREF « VREF u ¨ ADJ ¸ »
© 51.1k: ¹ ¼
¬
(1)
ª§ V
· º
R ADJ 51.1k: u «¨ OUT ¸ 1»
V
¬«© REF ¹ ¼»
(2)
3.3
Interface Connector – J2
J2 is the USB connector, and used to connect the PC. The interface is used to access the device’s
registers and read the conversion data from the TMP1075 through I2C communication protocol.
3.4
Debug Jumper – J4
J4 is the connector that allows debugging the firmware using three wires instead of the standard 14-pin
header. This connector is not populated.
3.5
Pushbutton Switch – SW1
Basically, the SW1 is to bring the MSP430 into a BSL mode for upgrading the firmware with combination
of the USB connector manually referring to the picture in Figure 1 BSL button (SW1 switch). Press and
hold the switch SW1 next to the USB connector while plugging the USB cable from the board to the PC.
This will allow bringing the MSP430 into BSL mode.
3.6
Header Connector – J3
The purpose of the header connector is to isolate the heat source and prevent it from heat incoming
directly into contact with the TMP1075, and the perforation allows users to snap at the breakout tab. When
the TMP1075 is separated from the MSP430, it can be connected through wires or header to both ends
for remote temperature measurements.
3.7
LED – (D4, D6, D7)
There are a total of three LEDs on the board: green (D4), red (D6), and orange (D7). The green LED is
the power supply indicator, and it should be turned ON. The orange LED should not blink when the EVM
is initially plugged into the PC. The orange LED will blink if the power-on-reset (POR) tests on the
MSP430 microcontroller fails on start-up or if the Test LED button is toggled. It will blink when the Start
Graph button is pressed. The red LED is the Alert pin indicator when the Alert pin is pulling LOW.
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Board Connectors and Components
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I2C Slave Addresses – (R15, R16)
TMP1075 is capable of supporting up to 32 I2C 7-bit addresses. The TMP1075 is connected to the bus by
a unique slave address to operate data transfer from the master-transmitter to the slave-receiver or the
slave-transmitter to the master-receiver. The TMP1075 can be configured desired two serial bus
addresses depending on the state of the A0, A1, and A2 as Table 3. The EVM can be configured up to
two addresses. At default, the resistor R16 is soldered, and configured for 0x48h address. For more
details information, refer to the Address Pins and Slave Addresses for the TMP1075 table in the TMP1075
Temp Sensor With I2C and SMBus Interface in Industry Standard LM75 data sheet (SBOS854).
Table 3. I2C Slave Addresses
CORRESPONDING EVM
RESISTOR
4
ADDRESS PIN CONNECTION
SLAVE ADDRESS
A2
A1
A0
BINARY
HEX
R15
GND
GND
GND
1001000
0x48
R16
GND
GND
V+
1001001
0x49
System Setup
The TMP1075EVM hardware consists of the USB2ANY Platform and the TMP1075EVM altogether in one
single board. The unit is easily connected through USB connector into the computer as shown in Figure 3.
Figure 3. TMP1075EVM Hardware Setup
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Software Installation
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5
Software Installation
5.1
Graphical User Interface (GUI)
The EVM software is tested on the Microsoft Windows 7 and 10 operating system (OS). The software also
functions on other Windows operating systems. The EVM software is available through the EVM product
folder on the TI website. To download the software to your system, simply follows the instructions below.
1. Go to the TMP1075EVM web page on the TI website: http://www.ti.com/tool/TMP1075EVM. Scroll
down to the Software section and download the latest evaluation software.
2. Unzip the downloaded file into a known directory. Once the files are extracted, navigate and run the
Setup_TMP1075EVM_GUI.exe file located in [Unzip location]. The EVM software installer then begins
the installation process as shown in Figure 4.
Figure 4. TMP1075EVM Welcome
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3. Follow the on-screen instructions by clicking the Next button to install the software. The following this
option, two license agreements are presented as shown in Figure 5 and Figure 6 that must be
accepted. After accepting both the Texas Instruments and National Instruments license agreements,
the user is given the choice of selecting the directory to install the program; usually, TI recommends
choosing the default setting stored in the C:\Program Files (x86)\Texas Instruments\TMP1075EVM
path as shown in Figure 7.
Figure 5. TMP1075EVM License Agreement
Figure 6. NI License Agreements
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Figure 7. TMP1075EVM Installation Directory
4. Some servers must configure the proxy before authorizing users gains access outside of the internal
network, and they act like an intermediary between the user's computer and the internet. In this case,
provide the correct server address and port number. If the server does not require the proxy server,
just simply delete the default address and port number in Figure 8 by leaving the input box blank and
click Next.
Figure 8. Network Proxy Server
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Software Installation
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5. For first-time installation, ensure the LabVIEW Run Time Engine is listed in the following summary as
shown in Figure 9. TMP1075EVM GUI is required LabVIEW 2016 f5 runtime engine for proper
operation. Once the Next button is clicked, the progress bar opens and shows the installation of the
software. It may take some time to download the LabVIEW Run Time Engine on the first installation.
Users may be prompted to download the file when installing the software for the first time, especially if
the LabVIEW Run Time Engine checkbox is checked.
Figure 9. TMP1075EVM Select Components Installation
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6. Click the Next button in Figure 10 to proceed the installation processes.
Figure 10. Ready to Install
7. Once the installation process is complete, uncheck the View readme file and click Finish.
Figure 11. TMP1075EVM Installation Finish
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Upgrading the Firmware
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Upgrading the Firmware
There are two ways to upgrade or program the firmware of the TMP1075EVM board. The first method is
to click on the Upgrade Firmware through the TMP1075 GUI or go directly to the directory of the
TMP1075EVM folder.
CAUTION
TMP1075EVM software must be installed before performing any tasks.
In Figure 12, the Upgrade Firmware button will call the MSP430 USB Firmware Upgrade Example
application in the TMP1075EVM folder C:\Program Files (x86)\Texas Instruments\TMP1075EVM\MSP430
USB Firmware Upgrade\BSL_USB_GUI.exe. So, another method is to go directly to the folder instead of
running from the GUI. For programming multiple EVMs, the second method is the best option.
• An error window will appear if the computer cannot communicate with the EVM. This is due to the
driver not recognized by the computer yet because the firmware is not programmed. On top right of the
GUI, ensure the Demo Mode checkbox is checked.
• Click on Update Firmware button. This will launch the MSP430 USB Firmware Upgrade Example
program.
• The confirmation pop-up dialog appears in Figure 13. Click on OK button to precede the firmware
update.
Figure 12. TMP1075 GUI Firmware Upgrade
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Figure 13. Firmware Update Confirmation
Figure 14. TMP1075EVM Connection Diagram
To update the firmware of the TMP1075EVM, please following the procedure below.
1. Start the MSP430 USB Firmware Upgrade Example program as shown in Figure 15 , and click on Next
to proceed the update and accept the license agreement. Note that in Figure 16, it shows No device
connected at this time.
2. Before starting the upgrade, the BSL mode must be invoked by disconnecting the TMP1075EVM from
the USB cable.
3. Press and hold the SW1 switch button down while connecting the USB cable.
4. Once the BSL mode is now invoked, the MSP430 USB Firmware Upgrade Example shows Found 1
device in Figure 17.
5. Select the Select Firmware radio button and click on Browse button to navigate the firmware file in this
folder C:\Program Files (x86)\Texas Instruments\TMP1075EVM\Firmware. The firmware file name is
USB2ANY_F5528.txt version v2.7.16.
6. The firmware image is programmed, and the TMP1075EVM restarts automatically. The new firmware
is now ready to use as shown in Figure 18.
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Upgrading the Firmware
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Figure 15. MSP430 USB Firmware Upgrade Program
Figure 16. MSP430 USB Firmware Upgrade Program With No Device Connected
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Figure 17. MSP430 USB Firmware Upgrade Program With Device Found
Figure 18. MSP430 USB Firmware Upgrade Program Showing Successful Firmware Update
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TMP1075EVM Setup and Operation
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TMP1075EVM Setup and Operation
CAUTION
Do not exceed the power supply rating of the MSP430.
7.1
Launching and Running the Software
The TMP1075EVM is recognized by the host as a generic human interface device (HID); therefore, there
is no required proprietary driver to install on the user's PC. It shows the typical response to connecting the
USB-to-I2C converter board to a PC USB port for the first time. Typically, the computer responds with a
Found New Hardware: USB device pop-up dialog. The pop-up window then typically changes to Found
New Hardware: USB Human Interface Device. This pop-up indicates that the device is ready to be used.
The USB-to-I2C Converter uses the human interface device drivers that are part of the Microsoft
Windows® operating system.
Figure 19. Confirmation of USB-to-I2C Converter Driver Installation
The TMP1075EVM GUI can be run from the Start Menu or from Windows desktop. It is located in a folder
Start -> Programs -> Texas Instruments -> TMP1075EVM -> TMP1075EVM.exe. Clicking the OK button
will take the user to the main window of the GUI.
Figure 20. Default Configuration
1. Connect the TMP1075EVM to a USB port on a PC as shown in Figure 20.
2. Launch the TMP1075EVM software by clicking on Start >> All Program >> Texas Instruments >>
TMP1075 EVM >> TMP1075EVM.exe. The TMP1075 EVM GUI should automatically initialize and
connect to the HID port. A successful connection will show HARDWARE CONNECTED highlighted in
green color on the bottom of the GUI status indicator. If there is a connection problem please verify if
the TMP1075EVM has an established connection with the PC. A fail connection if the status indicator
shows as DEMO MODE.
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7.2
Tab Pages Selection
The tab pages selection consists of three tabs: Main (Temperature Graph), EVM Set-Up, and TMP1075
Configuration. Launching the software will take you to the main window GUI (Main tab) display. By clicking
on the page tab allows switching between pages of the tab control.
Figure 21. TMP1075EVM Default Tab
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TMP1075EVM Setup and Operation
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Main Tab
The Main tab provides graphing the temperature result as well as other features:
Clear Chart erases the contents of the Temperature Chart box or click right button of the mouse on the
display screen then select Clear chart.
Save Chart prompts for a file name, and then saves the contents of the current Temperature graph box to
*.csv file. Note that theClear Chart button must be performed first before log the data; otherwise, it will
also save from the previous data in the memory.
Current Value shows the current temperature of the TMP1075.
Celsius or Fahrenheit is to toggle the temperature conversion Celsius to Fahrenheit.
One Shot is available on the Temperature Chart tab. The One Shot button writes to the TMP1075
configuration register with the one-shot in conversion mode. This setting initiates a temperature
conversion within the TMP1075 device that updates the temperature result registers. After the one-shot
conversion finishes, the device goes into shutdown until the next trigger of one-shot again.
Continuous performs the temperature conversion continuously when the shutdown mode bits is
configured in the configuration register to continuously. Each temperature conversion consists of an active
conversion period followed by a standby period based on the time of the conversion cycle configuration.
Alert high and low limit register can be set by entering the value in °C or °F based on °C/°F control on
Main tab that stores the high and low limit for comparison with the temperature result.
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7.4
Register Tab
The Registers tab provides access to the registers of the TMP1075, performing read and writes
commands. Changes to the configuration page are mirrored here, and vice versa. For more details about
each register, refer to the latest TMP1075 (SBOS854) data sheet.
Figure 22. Registers Tab
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TMP1075EVM Setup and Operation
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Configuration Tab
Figure 23. Configuration Tab
Configuration register can be set to desired value by selecting the drop-down menu.
Alert high and low limit register can be set by entering the value in °C/°F based on setting of the Main
tab.
Temperature displays the current temperature of the TMP1075.
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7.6
EVM Set-Up Tab
It is necessary to configure the TMP1075 slave address as 0x48 for communication with the EVM-GUI.
This is the default slave address.
Figure 24. TMP1075 Set-Up
Firmware is allowed to check the firmware revision on the MSP430F5528 microcontroller by clicking the
Read button or Update The Firmware Revision.
I2C Configuration is to change the bus frequency and slave address.
Software Reset performs software reset on the TMP1075 device by issuing a general call. After software
reset, the values displayed in the EVM software may be out of sync with the device register contents. To
sync register contents after software reset, click Read All in the Registers tab page.
Demo Mode allows to operate the GUI without a hardware connected. In this mode, the handle is closed.
Clicking on any buttons or drop-down menu will be automatically closed the software GUI.
User Interface polling rate refers to the time interval at which the GUI software queries the TMP1075
device. It can be configured here, but it will be changed automatically when changes are made to
resolution bit.
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Board Layout
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Board Layout
Figure 25. Top Assembly Layer
Figure 26. Top Layer Routing
Figure 27. Power Layer Routing
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Figure 28. Ground Layer Routing
Figure 29. Bottom Layer Routing
Figure 30. Bottom Assembly Layer
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Schematic
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Schematic
J1
J2
VBUS
1
R1
DM
R2
DP
33
2
33
3
4
R4
1.5k
D3
TPD1E04U04DPLR
1
BOARD POWER
VBUS
VIN
5
VOUT
TP1
GND
D-
+5V
VOUT
3
D+
VDUT
ON/OFF
R3
GND
R5
10k
C3
10uF
PUR
4
ADJ
GND
R6
86.6k
2
C1
6.8pF
C2
2.2uF
GND
D1
0
6
D2
TPD1E04U04DPLR
1
2
3
5
DUT POWER
U1
USB INTERFACE
LP2980IM5X-ADJ/NOPB
GND
R7
33
SW1
GND
GND
GND
D4
VUSB
R9
BSL
1.2M
R8
51.1k
C4
220pF
GND
GND
GND
GND
GND
L1
VBUS
GND
GND
D5
C5
22uF
VDUT
U3
GND
GND
1
2
3
NC
A
VCC
NC
GND
Y
SN74AUP1G04DSFR
U2
R10
ALERT
0
TP2
TP3
Y1
P1.0/TA0CLK/ACLK
P1.1/TA0.0
P1.2/TA0.1
P1.3/TA0.2
P1.4/TA0.3
P1.5/TA0.4
P1.6/TA1CLK/CBOUT
P1.7/TA1.0
34
35
36
37
38
P3.0/UCB0SIMO/UCB0SDA
P3.1/UCB0SOMI/UCB0SCL
P3.2/UCB0CLK/UCA0STE
P3.3/UCA0TXD/UCA0SIMO
P3.4/UCA0RXD/UCA0SOMI
VREF+
VREF-
9
10
57
58
12
13
P5.0/A8/VREF+/VEREF+
P5.1/A9/VREF-/VEREFP5.2/XT2IN
P5.3/XT2OUT
P5.4/XIN
P5.5/XOUT
DP
DM
50
52
PU.0/DP
PU.1/DM
PUR
51
V18
VCORE
55
17
VBUS
VUSB
53
54
VBUS
VUSB
11
15
40
AVCC1
DVCC1
DVCC2
3
2
1
18
19
20
21
22
23
24
25
GND
V18
VCORE
C9
0.22uF
VUSB
C10
0.47uF
VDUT
C11
0.22uF
PUR
V18
VCORE
MSP430
V+
P2.0/TA1.1
P2.1/TA1.2
P2.2/TA2CLK/SMCLK
P2.3/TA2.0
P2.4/TA2.1
P2.5/TA2.2
P2.6/RTCCLK/DMAE0
P2.7/UCB0STE/UCA0CLK
P4.0/PM_UCB1STE/PM_UCA1CLK
P4.1/PM_UCB1SIMO/PM_UCB1SDA
P4.2/PM_UCB1SOMI/PM_UCB1SCL
P4.3/PM_UCB1CLK/PM_UCA1STE
P4.4/PM_UCA1TXD/PM_UCA1SIMO
P4.5/PM_UCA1RXD/PM_UCA1SOMI
P4.6/PM_NONE
P4.7/PM_NONE
P6.0/CB0/A0
P6.1/CB1/A1
P6.2/CB2/A2
P6.3/CB3/A3
P6.4/CB4/A4
P6.5/CB5/A5
P6.6/CB6/A6
P6.7/CB7/A7
PJ.0/TDO
PJ.1/TDI/TCLK
PJ.2/TMS
PJ.3/TCK
RST/NMI/SBWTDIO
TEST/SBWTCK
QFN PAD
VSSU
AVSS1
AVSS2
DVSS1
DVSS2
GND
26
27
28
29
30
31
32
33
6
C6
0.1uF
5
4
D6
R11
5.1k
GND
C7
VDUT
VDUT
VDUT
GND
0.1uF
GND
R12
5.1k
R13
5.1k
R14
5.1k
U4
41
42
43
44
45
46
47
48
SDA
SCL
ADDRESS SELECTION
R15
V+
8
V+
ADD0 7
GND
R16
SCL
SDA
0
0
A0
A1
A2
6
5
ALERT
GND
2
1
SCL
SDA
3
ALERT
4
TMP1075DGK
1
2
3
4
5
6
7
8
GND
VDUT
D7
60
61
62
63
64
59
GND
TMP1075
J3
R17
33k
SBWTDIO
SBWTCK
R18
1.0k
VDUT
GND
R19
1
3
5
7
9
2
4
6
8
10
SDA
SCL
ALERT
GND
V+
0
C8
2200pF
65
49
14
56
16
39
SDA
SCL
ALERT
GND
V+
GND
J4
GND
GND
C12
0.1uF
GND
C13
0.1uF
C14
0.1uF
MSP430F5528IRGCR
SBWTCK
SBWTDIO
GND
GND
GND
1
2
3
GND
GND
Copyright © 2018, Texas Instruments Incorporated
Figure 31. TMP1075EVM Schematic
24
TMP1075EVM User's Guide
SNOU157A – March 2018 – Revised April 2018
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Copyright © 2018, Texas Instruments Incorporated
Bill of Materials
www.ti.com
10
Bill of Materials
Table 4. TMP1075EVM Bill of Materials
Designator Quantity
Value
Description
Package
Reference
Printed Circuit Board
Part Number
Manufacturer
!PCB1
1
SENS012
Any
C1
1
6.8pF
CAP, CERM, 6.8 pF, 25 V, +/- 5%,
C0G/NP0, 0402
0402
GRM1555C1E6R8CA
01D
MuRata
C2
1
2.2uF
CAP, CERM, 2.2 uF, 16 V, +/- 10%, X5R,
0402
0402
GRM155R61C225KE
11D
MuRata
C3
1
10uF
CAP, CERM, 10 uF, 10 V, +/- 20%, X5R,
0603
0603
C1608X5R1A106M08
0AC
TDK
C4
1
220pF
CAP, CERM, 220 pF, 50 V, +/- 10%,
X7R, 0402
0402
GRM155R71H221KA
01D
MuRata
C5
1
22uF
CAP, CERM, 22 uF, 10 V, +/- 20%, X5R,
0603
0603
C1608X5R1A226M08
0AC
TDK
C6, C7
2
0.1uF
CAP, CERM, 0.1 uF, 16 V, +/- 5%, X7R,
0402
0402
GRM155R71C104JA8 MuRata
8D
C8
1
2200pF
CAP, CERM, 2200 pF, 100 V, +/- 10%,
X7S, AEC-Q200 Grade 1, 0402
0402
CGA2B3X7S2A222K0 TDK
50BB
C9, C11
2
0.22uF
CAP, CERM, 0.22 uF, 16 V, +/- 10%,
X5R, 0402
0402
C1005X5R1C224K05
0BB
TDK
C10
1
0.47uF
CAP, CERM, 0.47 uF, 10 V, +/- 10%,
X5R, 0402
0402
GRM155R61A474KE
15D
MuRata
C12, C13,
C14
3
0.1uF
CAP, CERM, 0.1 uF, 10 V, +/- 10%, X5R,
0402
0402
C1005X5R1A104K05
0BA
TDK
D1
1
4.3V
Diode, Zener, 4.3 V, 300 mW, SOD-523
SOD-523
BZT52C4V3T-7
Diodes Inc.
D2, D3
2
1-Channel ESD Protection Diode With
Low Dynamic Resistance for HDMI 2.0
and USB 3.0, DPL0002A (X2SON-2)
DPL0002A
TPD1E04U04DPLR
Texas Instruments
D4
1
Green
LED, Green, SMD
LED_0603
LTST-C191TGKT
Lite-On
D5
1
6.2V
Diode, Zener, 6.2 V, 300 mW, SOD-523
SOD-523
BZT52C6V2T-7
Diodes Inc.
D6
1
Red
LED, Red, SMD
LED_0603
LTST-C191KRKT
Lite-On
D7
1
Orange
LED, Orange, SMD
LED_0603
LTST-C191KFKT
Lite-On
J1
1
Header, 2.54 mm, 3x1, Gold, TH
Header,
2.54mm, 3x1,
TH
61300311121
Wurth Elektronik
J2
1
Connector, Plug, USB Type A, R/A, Top
Mount SMT
Edge mount
USB A CONN
48037-2200
Molex
L1
1
120 ohm
Ferrite Bead, 120 ohm @ 100 MHz, 0.55
A, 0402
0402
BLM15AG121SN1D
MuRata
R1, R2, R7
3
33
RES, 33, 5%, 0.063 W, AEC-Q200 Grade
0, 0402
0402
CRCW040233R0JNE
D
Vishay-Dale
R3, R10,
R16
3
0
RES, 0, 5%, 0.063 W, AEC-Q200 Grade
0, 0402
0402
CRCW04020000Z0E
D
Vishay-Dale
R4
1
1.5k
RES, 1.5 k, 5%, 0.063 W, AEC-Q200
Grade 0, 0402
0402
CRCW04021K50JNE
D
Vishay-Dale
R5
1
10k
RES, 10 k, 5%, 0.1 W, AEC-Q200 Grade
0, 0402
0402
ERJ-2GEJ103X
Panasonic
R6
1
86.6k
RES, 86.6 k, 1%, 0.063 W, AEC-Q200
Grade 0, 0402
0402
CRCW040286K6FKE
D
Vishay-Dale
R8
1
51.1k
RES, 51.1 k, 1%, 0.063 W, AEC-Q200
Grade 0, 0402
0402
CRCW040251K1FKE
D
Vishay-Dale
R9
1
1.2Meg
RES, 1.2 M, 5%, 0.063 W, AEC-Q200
Grade 0, 0402
0402
CRCW04021M20JNE
D
Vishay-Dale
R11, R12,
R13, R14
4
5.1k
RES, 5.1 k, 5%, 0.063 W, AEC-Q200
Grade 0, 0402
0402
CRCW04025K10JNE
D
Vishay-Dale
R17
1
33k
RES, 33 k, 5%, 0.063 W, AEC-Q200
Grade 0, 0402
0402
CRCW040233K0JNE
D
Vishay-Dale
R18
1
1.0k
RES, 1.0 k, 5%, 0.063 W, AEC-Q200
Grade 0, 0402
0402
CRCW04021K00JNE
D
Vishay-Dale
R19
1
0
RES, 0, 5%, 0.1 W, AEC-Q200 Grade 0,
0603
0603
CRCW06030000Z0E
A
Vishay-Dale
SNOU157A – March 2018 – Revised April 2018
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TMP1075EVM User's Guide
Copyright © 2018, Texas Instruments Incorporated
25
Bill of Materials
www.ti.com
Table 4. TMP1075EVM Bill of Materials (continued)
Designator Quantity
26
Value
Description
Package
Reference
Part Number
Manufacturer
SH-J1
1
Shunt, 100mil, Tin plated, Black
Shunt
Connector
Black Open
Top, 2x1
SNT-100-BK-T-H
Samtec
SW1
1
Switch, SPST-NO, Off-Mom, 0.05A,
12VDC, SMD
3.9x2.9mm
PTS820 J20M SMTR
LFS
CK Components
TP1
1
Test Point, Miniature, Black, TH
Black Miniature
Testpoint
5001
Keystone
U1
1
Micropower 50 mA Ultra Low-Dropout
Adjustable Voltage Regulator in SOT-23,
DBV0005A (SOT-23-5)
DBV0005A
LP2980IM5XADJ/NOPB
Texas Instruments
U2
1
25 MHz Mixed Signal Microcontroller with
128 KB Flash, 8192 B SRAM and 47
GPIOs, -40 to 85 degC, 64-pin QFN
(RGC), Green (RoHS and no Sb/Br)
RGC0064B
MSP430F5528IRGCR Texas Instruments
U3
1
Low-Power Single Inverter Gate,
DSF0006A, LARGE TandR
DSF0006A
SN74AUP1G04DSFR
Texas Instruments
U4
1
Temperature Sensor With I2C and
SMBus Interface, DGK0008A (VSSOP-8)
DGK0008A
TMP1075DGK
Texas Instruments
Y1
1
Resonator, 4 MHz, 5000 ppm, AEC-Q200
Grade 1, SMD
4.5x2mm
PBRV4.00MR50Y000
AVX
FID1, FID2, 0
FID3
Fiducial mark. There is nothing to buy or
mount.
N/A
N/A
N/A
J3
0
Header, 100mil, 5x2, Tin, TH
Header, 5x2,
100mil, Tin
PEC05DAAN
Sullins Connector
Solutions
J4
0
Header, 2.54 mm, 3x1, Gold, TH
Header,
2.54mm, 3x1,
TH
61300311121
Wurth Elektronik
R15
0
RES, 0, 5%, 0.063 W, AEC-Q200 Grade
0, 0402
0402
CRCW04020000Z0E
D
Vishay-Dale
0
TMP1075EVM User's Guide
SNOU157A – March 2018 – Revised April 2018
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Revision History
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Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (March 2018) to A Revision ....................................................................................................... Page
•
•
•
Changed key graphic ..................................................................................................................... 1
Changed TMP1075EVM Hardware Setup graphic ................................................................................... 6
Changed TMP1075EVM Connection Diagram graphic ............................................................................. 13
SNOU157A – March 2018 – Revised April 2018
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Revision History
Copyright © 2018, Texas Instruments Incorporated
27
STANDARD TERMS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or
documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance
with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by
neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have
been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications
or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control
techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM.
User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)
business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.
2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit
User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty
period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or
replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be
warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software
associated with the kit to determine whether to incorporate such items in a finished product and software developers to write
software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or
otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition
that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.
Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must
operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the
instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs
(which for the avoidance of doubt are stated strictly for convenience and should be verified by User):
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿6丁目24番1号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/
/www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
3.4 European Union
3.4.1
For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive):
This is a class A product intended for use in environments other than domestic environments that are connected to a
low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this
product may cause radio interference in which case the user may be required to take adequate measures.
4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT
LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL
FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT
NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS
FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE
SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE
CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR
INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE
EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR
IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY
WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL
THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF
SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR
REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING,
OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF
USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI
MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS
OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDED
HEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN
CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR
EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE
CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2018, Texas Instruments Incorporated
IMPORTANT NOTICE FOR TI DESIGN INFORMATION AND RESOURCES
Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to,
reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are
developing applications that incorporate TI products; by downloading, accessing or using any particular TI Resource in any way, you
(individually or, if you are acting on behalf of a company, your company) agree to use it solely for this purpose and subject to the terms of
this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,
enhancements, improvements and other changes to its TI Resources.
You understand and agree that you remain responsible for using your independent analysis, evaluation and judgment in designing your
applications and that you have full and exclusive responsibility to assure the safety of your applications and compliance of your applications
(and of all TI products used in or for your applications) with all applicable regulations, laws and other applicable requirements. You
represent that, with respect to your applications, you have all the necessary expertise to create and implement safeguards that (1)
anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that
might cause harm and take appropriate actions. You agree that prior to using or distributing any applications that include TI products, you
will thoroughly test such applications and the functionality of such TI products as used in such applications. TI has not conducted any
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You are authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include
the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO
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RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or
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regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or
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third party, or a license from TI under the patents or other intellectual property of TI.
TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR
REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING TI RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO
ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF
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TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY YOU AGAINST ANY CLAIM, INCLUDING BUT NOT
LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF
DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL,
COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR
ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGES.
You agree to fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of your noncompliance with the terms and provisions of this Notice.
This Notice applies to TI Resources. Additional terms apply to the use and purchase of certain types of materials, TI products and services.
These include; without limitation, TI’s standard terms for semiconductor products http://www.ti.com/sc/docs/stdterms.htm), evaluation
modules, and samples (http://www.ti.com/sc/docs/sampterms.htm).
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2018, Texas Instruments Incorporated
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