Texas Instruments | PGAxxxEVM-037 Pressure Sensor Signal Conditioner Evaluation Module | User Guides | Texas Instruments PGAxxxEVM-037 Pressure Sensor Signal Conditioner Evaluation Module User guides

Texas Instruments PGAxxxEVM-037 Pressure Sensor Signal Conditioner Evaluation Module User guides
User's Guide
SLDU031 – December 2017
PGAxxxEVM-037 Pressure Sensor Signal Conditioner
Evaluation Module
The PGAxxxEVM-037 provides a platform to test the PGA902, PGA904, and PGA302 in the TSSOP
package. The EVM comes shipped as the PGA902EVM-037, the PGA904EVM-037, or the PGA302EVM037, with the name indicating the associated device included with the EVM. The PGA902EVM-037 and
PGA904EVM-037 includes a TSSOP socket, and can be used interchangeably for all three devices. This
user’s guide describes both the EVM hardware platform, and the graphical user interface (GUI) software
used to configure and calibrate the PGAxxx pressure devices.
1
2
3
4
5
6
Contents
Introduction ................................................................................................................... 2
Default Configuration ........................................................................................................ 5
EVM Setup and Operation .................................................................................................. 5
3.1
Quick Start Procedure .............................................................................................. 5
3.2
VDD Voltage Setup ................................................................................................. 7
3.3
Pressure Inputs ..................................................................................................... 7
3.4
Temperature Inputs ................................................................................................. 9
3.5
Voltage Output ..................................................................................................... 10
Software ..................................................................................................................... 10
4.1
Installation .......................................................................................................... 10
4.2
GUI Navigation .................................................................................................... 10
4.3
EVM Settings Page ............................................................................................... 12
4.4
General Settings Page............................................................................................ 13
4.5
Analog Front End Page........................................................................................... 15
4.6
Output DAC Page ................................................................................................. 17
4.7
Diagnostics Page .................................................................................................. 18
4.8
SENT Interface Page (PGA 904 Only) ......................................................................... 19
4.9
Memory Map Page ................................................................................................ 20
4.10 Test Mode Page ................................................................................................... 22
4.11 Memory Program Page ........................................................................................... 23
4.12 PGA302 Linearity Calibration Page (PGA302 Only) .......................................................... 24
4.13 PGA302 EEPROM Settings Page (PGA302 Only) ........................................................... 26
4.14 Data Monitor Page ................................................................................................ 28
4.15 Tool Panel .......................................................................................................... 29
Board Layout ................................................................................................................ 35
Schematic and Bill of Materials ........................................................................................... 39
6.1
Schematic .......................................................................................................... 39
6.2
Bill of Materials .................................................................................................... 42
List of Figures
1
PGA302EVM-037 Top Board Sections ................................................................................... 3
2
PGA302EVM-037 EVM Bottom Board Sections......................................................................... 4
3
EVM Quick Start Setup ..................................................................................................... 6
4
EVM GUI Connection Status ............................................................................................... 6
5
VDD Voltage Adjustment Potentiometer .................................................................................. 7
6
Schematic of Resistive Bridge Emulator.................................................................................. 8
SLDU031 – December 2017
Submit Documentation Feedback
PGAxxxEVM-037 Pressure Sensor Signal Conditioner Evaluation Module
Copyright © 2017, Texas Instruments Incorporated
1
Introduction
www.ti.com
7
External Bridge Connections ............................................................................................... 9
8
GUI Sections ................................................................................................................ 11
9
EVM Settings Page ........................................................................................................ 12
10
General Settings Page
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
....................................................................................................
Analog Front End Page ...................................................................................................
Output DAC Page ..........................................................................................................
Diagnostics Page ...........................................................................................................
SENT Interface Page ......................................................................................................
Memory Map Page .........................................................................................................
Test Mode Page ............................................................................................................
Memory Program Page ....................................................................................................
PGA302 Linearity Calibration Page ......................................................................................
PGA302 EEPROM Settings Page .......................................................................................
Data Monitor Page .........................................................................................................
Tool Panel ...................................................................................................................
UTILITIES tab...............................................................................................................
Data Log Tab ...............................................................................................................
Voltage Monitor Tab .......................................................................................................
Fault Status tab .............................................................................................................
Resistive Bridge Configuration Panel....................................................................................
Top Layer ...................................................................................................................
Top Component Placement ...............................................................................................
Bottom Layer................................................................................................................
Bottom Component Placement ...........................................................................................
PGA302EVM Schematic ..................................................................................................
PGAxxxEVM MSP430 Interface Schematic ............................................................................
14
16
18
18
19
21
22
23
24
26
28
29
30
31
32
33
34
35
36
37
38
40
41
List of Tables
1
Default Jumper Settings .................................................................................................... 5
2
Additional Jumper Settings Description ................................................................................... 5
3
Jumper Settings to Connect Resistive Bridge to Temperature Inputs
10
4
EVM Status Possibilities
13
5
6
7
..............................................
..................................................................................................
EVM Status Field Descriptions ...........................................................................................
Fault Status Indicators .....................................................................................................
Bill of Materials .............................................................................................................
13
33
42
Trademarks
Microsoft, Windows are registered trademarks of Microsoft Corporation.
All other trademarks are the property of their respective owners.
1
Introduction
The PGAxxxEVM-037 is a fully-assembled evaluation module (EVM) designed to provide evaluation of the
PGA902, PGA904, and PGA302 pressure sensor signal conditioner ICs. The user is able to configure the
EVM by using any of the available digital interfaces (I2C, OWI, and SENT) depending on which device
and EVM are being used. For ease of use, the most basic evaluation can be completed with only the
PGAxxxEVM-037, a voltage supply capable of at least 7-V output, and a Microsoft® Windows® PC with the
PGAxxxEVM GUI installed.
Temperature and pressure inputs can be simulated by the onboard Resistive Bridge Emulator (see
Section 4.15.5), or the user can connect external temperature and pressure sensors to evaluate their
performance in conjunction with the PGAxxx device.
2
PGAxxxEVM-037 Pressure Sensor Signal Conditioner Evaluation Module
Copyright © 2017, Texas Instruments Incorporated
SLDU031 – December 2017
Submit Documentation Feedback
Introduction
www.ti.com
Figure 1. PGA302EVM-037 Top Board Sections
SLDU031 – December 2017
Submit Documentation Feedback
PGAxxxEVM-037 Pressure Sensor Signal Conditioner Evaluation Module
Copyright © 2017, Texas Instruments Incorporated
3
Introduction
www.ti.com
Figure 2. PGA302EVM-037 EVM Bottom Board Sections
The PGAxxxxEVM-037 is divided into the following sections:
1. Power
a. External power connectors
b. Onboard regulators
2. OWI Communication
3. MSPR430F5510 Microcontroller
4. External resistive bridge interface
5. Resistive bridge emulator
6. Programming circuitry
NOTE: Pictured is a PGA302EVM-037 which does not include additional circuitry for firmware
programming and SENT communication that is present on the PGA90xEVM-037. The
PGA90xEVM-037 also includes a socket instead of a soldered down device.
4
PGAxxxEVM-037 Pressure Sensor Signal Conditioner Evaluation Module
Copyright © 2017, Texas Instruments Incorporated
SLDU031 – December 2017
Submit Documentation Feedback
Default Configuration
www.ti.com
2
Default Configuration
The EVM requires a 7-V to 28-V input applied to PWR_IN and GND_IN. The power supply should be
current limited to 100 mA. The default jumper settings connect the resistive bridge emulator to the VBRG
outputs and to the VINP inputs of the PGAxxx device and are described in full in Table 1.
Table 1. Default Jumper Settings
Jumper
Setting
Function
J4
Pins 1-2 Closed
Connect VINTP to RT1 10-kΩ thermistor
J5
Pins 1-2 Closed
Connect top of resistive bridge emulator to VBRGP
J6
Pins 1-2 Closed
Connect resistive bridge emulator output to VINPP
J7
Pins 1-2 Closed
Connect resistive bridge emulator output to VINPN
J9
Pins 2-3 Closed
Power 3.3-V LDO from VCC
J11
Open
Disconnect SENT output
Table 2. Additional Jumper Settings Description
Jumper
Setting
Function
J4
Pins 2-3 closed
Connect DAC_CAP to RT1 10-kΩ thermistor
Pins 2-3 closed
Connect top of resistive bridge emulator to TEST1
J5
J6
J7
Open
Connect VBRGP to J3 pin 1
Pins 2-3 closed
Connect resistive bridge emulator output to VINTP
Open
Connect VINPP to J2 pin 1
Pins 2-3 Closed
Connect resistive bridge emulator output to VINTN
Open
Connect VINPN to J2 pin 2
J9
Pins 1-2 Closed
Power 3.3-V LDO from USB VBUS
J11
Closed
Connect SENT output
3
EVM Setup and Operation
3.1
Quick Start Procedure
The PGAxxxEVM-037 is designed to be ready for immediate evaluation out of the box with the onboard
resistive bridge emulator as a simulation of a pressure sensor input. The following procedure details the
steps necessary to begin evaluation with the PGAxxxEVM-037 and the PGAxxx EVM GUI.
1. Collect the following supplies:
• PGAxxxEVM-037
• PC running Windows 7 or later
• Micro-USB to USB cable
• A single power supply unit, battery, or AC/DC adapter to provide a voltage output from 7 V to 28 V
and a current output of up to 100 mA.
2. Follow the instructions in the Installation section (see Section 4.1) of the User's Guide to install and run
the PGAxxx EVM GUI.
3. With the power supply off, connect the positive output of the supply to the PWR_IN connector on the
EVM, and the power supply ground to the GND_IN connector. Only turn on the power supply output
after connecting to the EVM.
4. Plug the micro-USB cable into the USB port on the EVM, and the USB side of the cable into the PC.
The EVM setup should look similar to the one shown in Figure 3.
SLDU031 – December 2017
Submit Documentation Feedback
PGAxxxEVM-037 Pressure Sensor Signal Conditioner Evaluation Module
Copyright © 2017, Texas Instruments Incorporated
5
EVM Setup and Operation
www.ti.com
Figure 3. EVM Quick Start Setup
5. Navigate to the GUI installation directory to run the PGAxxx EVM GUI.
6. Verify that communication has been established between the EVM and the GUI by checking the EVM
Status section in the main panel, or in the status bar on the bottom left of the GUI as shown in
Figure 4.
Figure 4. EVM GUI Connection Status
6
PGAxxxEVM-037 Pressure Sensor Signal Conditioner Evaluation Module
Copyright © 2017, Texas Instruments Incorporated
SLDU031 – December 2017
Submit Documentation Feedback
EVM Setup and Operation
www.ti.com
3.2
VDD Voltage Setup
The OWI circuitry can be sensitive to component variances and loading. To ensure proper voltage levels,
a 10-kΩ potentiometer (R21) must be adjusted by the user. The potentiometer is located on the bottom of
the board (pictured in Figure 5) and should be adjusted while the PGAxxxEVM-037 is powered up first by
pulling the OWI_5P5 pin high with the EVM Pin State controls in the GUI (see Section 4.3.2), then by
monitoring the voltage on the VDD test point or with the Voltage Monitor tab (see section Section 4.15.3)
and turning the potentiometer until VDD is between 4.5 V and 5.5 V.
Figure 5. VDD Voltage Adjustment Potentiometer
3.3
Pressure Inputs
The PGAxxxEVM-037 includes a resistive bridge emulator designed to simulate a typical 5-kΩ pressure
sensor topology. The variable leg consists of a digital potentiometer in parallel with a 2.61-kΩ resistor, and
the parallel components are in series with a 2.55-kΩ resistor as shown in Figure 6.
SLDU031 – December 2017
Submit Documentation Feedback
PGAxxxEVM-037 Pressure Sensor Signal Conditioner Evaluation Module
Copyright © 2017, Texas Instruments Incorporated
7
EVM Setup and Operation
www.ti.com
J5
VBRGP
1 2 3
TEST1
3V3
R24
2.55 k
4
5
6
SCLK
DIN
CS
H
w
L
GND
8
1
7
R26
2.61 k
3
GND
R29
4.99 k
VINTP I
TPL0501-100DCNR
VINTN I
VDD
VINTP I
2
GND
SPI_SCLK
SPI_MOSI
SPI_CS0
R25
4.99 k
U6
1
2
3
1
2
3
J6
R30
4.99 k
VINTN I
C40
0.1 µF
J7
VBRGN
Copyright © 2017, Texas Instruments Incorporated
Figure 6. Schematic of Resistive Bridge Emulator
The default configuration of the EVM connects the PGAxxx to the resistive bridge emulator with VBRGP
and VBRGN supplying voltage, while VINPP and VINPN are connected to measure the differential voltage
across the legs of the bridge. To use an external bridge or pressure sensor, remove the jumpers J5, J6,
and J7. Next, connect the positive bridge voltage to J3 pin 1 (VBRGP) and the negative terminal of the
bridge to J3 pin 2 (VBRGN). The differential voltage outputs of the bridge can be connected to J2, with pin
1 being VINPP and pin 2 being VINPN, as shown in Figure 7.
8
PGAxxxEVM-037 Pressure Sensor Signal Conditioner Evaluation Module
Copyright © 2017, Texas Instruments Incorporated
SLDU031 – December 2017
Submit Documentation Feedback
EVM Setup and Operation
www.ti.com
Figure 7. External Bridge Connections
3.4
Temperature Inputs
The external temperature sensor inputs can be connected to either the resistive bridge emulator, or to an
external temperature sensor. By default, the EVM is configured with the external temperature sensor
inputs, VINTP and VINTN, disconnected from the resistive bridge emulator, but accessible via J1 with pin
1 being VINTP and pin 2 being VINTN. To use the resistive bridge emulator to test the external
temperature sensor measurement, place the jumpers as described in Table 3.
SLDU031 – December 2017
Submit Documentation Feedback
PGAxxxEVM-037 Pressure Sensor Signal Conditioner Evaluation Module
Copyright © 2017, Texas Instruments Incorporated
9
EVM Setup and Operation
www.ti.com
Table 3. Jumper Settings to Connect Resistive Bridge to Temperature Inputs
Jumper
Setting
Function
J5
Open
Disconnect VBRGP from resistive bridge emulator
J6
Pins 2-3 closed
Connect resistive bridge emulator output to VINTP
J7
Pins 2-3 closed
Connect resistive bridge emulator output to VINTN
NOTE: This configuration connects an adjustable 10-kΩ resistance between VINTP and VINTN as a
test mode. It is not intended for use as a functioning external temperature sensor
3.5
Voltage Output
The PGAxxx devices can output measured pressure and temperature values in analog voltage form via
the 14-bit output DAC. On the PGAxxxEVM-037 this VOUT voltage can be measured externally at the
VOUT_SENT test point or through the GUI, which makes use of the internal ADC of the MSP430 to
measure the voltage and display it on the Voltage Monitor tab of the GUI.
4
Software
4.1
Installation
Download and install the GUI from www.ti.com. Navigate to the default installation path of the executable
file by clicking on the Windows Start button. Click on All Programs and then navigate to the Texas
Instruments folder to find the PGAxxxGUI application shortcut.
4.2
GUI Navigation
The GUI is comprised of three main sections: the menu tree, the main control panel, and the tool panel as
Figure 8 shows. All PGA device settings will be adjusted through the main control panel, which can be
changed to display different groups of settings via the menu tree. The following sections describe the
settings available in each item in the menu tree.
10
PGAxxxEVM-037 Pressure Sensor Signal Conditioner Evaluation Module
Copyright © 2017, Texas Instruments Incorporated
SLDU031 – December 2017
Submit Documentation Feedback
Software
www.ti.com
Figure 8. GUI Sections
SLDU031 – December 2017
Submit Documentation Feedback
PGAxxxEVM-037 Pressure Sensor Signal Conditioner Evaluation Module
Copyright © 2017, Texas Instruments Incorporated
11
Software
4.3
www.ti.com
EVM Settings Page
Figure 9. EVM Settings Page
4.3.1
EVM Status
The GUI can automatically detect the presence of the PGAxxxEVM. In the event of a successful or failed
connection between the PC, MSP430F5510, and PGAxxxEVM-037, the EVM status fields are updated
according to Table 4.
12
PGAxxxEVM-037 Pressure Sensor Signal Conditioner Evaluation Module
Copyright © 2017, Texas Instruments Incorporated
SLDU031 – December 2017
Submit Documentation Feedback
Software
www.ti.com
Table 4. EVM Status Possibilities
EVM Status
Success
Failure
USB Controller
USB2ANY I/F Found
Not Detected
USB Firmware
2.7.0.52
N/A
Connection Status
Connected
N/A
PGA Device Status
Revision 0.0
Not available
Table 5. EVM Status Field Descriptions
4.3.2
EVM Status
Definition
USB Controller
The MSP430F5510 is programmed with TI’s USB2ANY host interface (I/F) controller firmware. The
GUI calls API functions for the USB2ANY to execute. The USB2ANY I/F is the only compatible USB
controller for the PGAxxxEVM GUI.
USB Firmware
The USB2ANY firmware can be updated for improvements or bug fixes. Version 2.7.0.52 is the only
firmware version tested and known to be working for the PGAxxxEVM GUI.
Connection Status
Typically, only one USB2ANY is connected to a PC, though the USB2ANY APIs are able to
distinguish multiple USB2ANY devices on the same USB bus. For a single USB2ANY I/F, the status
will read Connected, but for multiple, the status will read Multiple Found. TI advises that a single
USB2ANY I/F be connected to your PC during the evaluation of the PGAxxxEVM GUI.
PGA Device Status
When an I2C read command is successfully executed on the PGA device, the status will be updated
to Ready. If the status reads back Not available, use the following checklist to troubleshoot:
• Is the device seated properly in the socket (PGA902/904 only)?
• Is the PGAxxx-037 EVM powered with a voltage of 7–28 V?
• Is the power supply unit able to source at least 20 mA?
• If the device was powered after the GUI was first initialized, click the application reset button to
reconnect
EVM Pin State
The EVM Pin State is automatically updated when the GUI is started and connected to a PGAxxx device.
Any of the available pins can be changed by the user to either HIGH, LOW, or HIZ states.
4.3.3
OWI Settings
The following OWI settings are available:
• OWI Buad Rate: Sets the baud rate for the OWI communication. The available options are 2400 bps or
4800 bps
• Stop Bits: Sets the number of stop bits for OWI communication. The available options are 1 or 2 stop
bits.
• Send VDD Activation Pulse: Briefly raises the VDD voltage to 7 V to initiate OWI communication. This
is used to test if the OWI circuitry is functioning properly.
• Send Register Activation Command: For the PGA90x devices without programmed firmware, a register
activation command is sent to activate the OWI transceiver circuitry within the device.
4.3.4
I2C Settings
The I2C frequency selection allows the user to select 100 kHz, 400 kHz, and 800 kHz for I2C
communication.
4.4
General Settings Page
Figure 10 shows the General Settings Page window.
SLDU031 – December 2017
Submit Documentation Feedback
PGAxxxEVM-037 Pressure Sensor Signal Conditioner Evaluation Module
Copyright © 2017, Texas Instruments Incorporated
13
Software
www.ti.com
Figure 10. General Settings Page
4.4.1
Power Enable
Power can be disabled to specific blocks within the PGAxxx device to decrease total power consumption.
The analog blocks, I2C communication, OWI communication, and SENT OUTPUT (PGA904 only) can all
be individually enabled or disabled to save power.
4.4.2
Clock Frequency
This section allows the user to control the clock frequency of the internal microcontroller.
14
PGAxxxEVM-037 Pressure Sensor Signal Conditioner Evaluation Module
Copyright © 2017, Texas Instruments Incorporated
SLDU031 – December 2017
Submit Documentation Feedback
Software
www.ti.com
4.4.3
RAM Memory Built-In Self Test
A RAM Memory Built-In self test is available to ensure the RAM of the PGAxxx device is functioning
properly. The user can select one or more algorithms to test the memory. Once the test is begun by
clicking the START button, the GUI will initiate each selected test in turn, and will report once all tests are
complete and if the any of the tests were failed.
4.5
Analog Front End Page
The analog front end panel allows the user to configure the AFE portion of the PGAxxx device in an easyto-use block diagram format (shown in Figure 11) as an initial test and debug measure. These same
settings are available in the PGA302 EEPROM Settings page (PGA302 EVM GUI only), however the
settings made in the Analog Front End page will not carry over to the EEPROM settings page, and they
must be repopulated in order to program the EEPROM for future use.
SLDU031 – December 2017
Submit Documentation Feedback
PGAxxxEVM-037 Pressure Sensor Signal Conditioner Evaluation Module
Copyright © 2017, Texas Instruments Incorporated
15
Software
www.ti.com
Figure 11. Analog Front End Page
4.5.1
Offset Correction
The offset correction setting allows the user to adjust the voltage offset of the pressure inputs to account
for minor offset errors and to make full use of the input range of the integrated ADC of the PGAxxx. Offset
correction values from –54.75 mV to +54.75 mV are available, or the offset correction can be turned off
entirely.
16
PGAxxxEVM-037 Pressure Sensor Signal Conditioner Evaluation Module
Copyright © 2017, Texas Instruments Incorporated
SLDU031 – December 2017
Submit Documentation Feedback
Software
www.ti.com
4.5.2
Input Signal MUX Select and Additional Settings
The MUX select setting allows the user to choose the input type of the signal connected to the VINPP and
VINPN pins of the device. For a differential signal, select VINPP – VINPN, and for single-ended signals
the user can choose either VINPP – 1.25 V, or 1.25 V – VINPN depending on which of the input pins the
signal is connected to. The Single Ended Input box must also be selected if using a single-ended input
signal. Additionally, the input signal can be inverted if desired by checking the Invert Signal box. The
Single Ended Input and Invert Signal check boxes are available for both the P Gain and T Gain input
blocks, and can be configured separately.
4.5.3
P Channel and T Channel
Both the P Channel and T Channel blocks have adjustable gains with a range of 1.33 V/V up to 200 V/V
to properly amplify any input signal to take advantage of the full input range of the ADC.
4.5.4
P/T Channel Select
The P/T Channel MUX Select allows the user to determine which input signals are directed to the ADC of
the PGAxxx device. In fixed-channel mode, either the P Channel or T Channel inputs can be directed to
the ADC for sampling. The Auto Scan mode allows the ADC to sample from both the P Channel and the T
Channel at user-defined intervals.
4.5.5
T Channel MUX Select
The T Channel MUX Select allows the user to determine which signals will be passed through the T
Channel to the ADC for sampling. The VINTP and VINTN pin option can be selected for use with an
external temperature sensor, or other sensor. To use the internal temperature sensor of the PGAxxx
device, select the Internal Temp Sense option. The Bridge Current option allows the user to read the
current through the internal VBRG voltage supply of the PGAxxx device. Additionally, the TEST1 pin can
be MUXed through to monitor a variety of internal signals for debugging purposes. The output of the
TEST1 pin can be set on the Test Mode page (see Section 4.10). Finally, the DACCAP pin can be used
as an additional input if desired, and can be sent through the MUX to the ADC for sampling.
4.5.6
Block Enable Check Boxes
There are several block enable check boxes on the analog front end page. The ITEMP enable box will
turn on and connect the internal temperature sensor current source for use with external temperature
sensors that need current excitation. The VBRG enable box activates the internal bridge voltage supply to
provide voltage excitation for resistive bridge pressure sensors. The ADC is enabled with a check box,
and finally the DACCAP can be connected with an enable check box to provide a low-pass filter to the
DAC output buffer.
4.5.7
ITEMP Select
ITEMP select gives the user the option to select the current output of the ITEMP internal current source.
The current source can supply 50 to 1000 µA, or it can be disabled with this control.
4.6
Output DAC Page
Figure 12 illustrates the output DAC page.
SLDU031 – December 2017
Submit Documentation Feedback
PGAxxxEVM-037 Pressure Sensor Signal Conditioner Evaluation Module
Copyright © 2017, Texas Instruments Incorporated
17
Software
www.ti.com
Figure 12. Output DAC Page
The Output DAC page allows the user to quickly test the functionality of the output DAC by inputting
specific DAC Values and monitoring the result at the VOUT pin. The output DAC and DACCAP
connections can also be enabled or disabled from this page. To easily read the voltage on VOUT, the user
can use the Voltage Monitor tab on the tool panel to the right.
4.7
Diagnostics Page
Figure 13 shows the diagnostics page.
Figure 13. Diagnostics Page
18
PGAxxxEVM-037 Pressure Sensor Signal Conditioner Evaluation Module
Copyright © 2017, Texas Instruments Incorporated
SLDU031 – December 2017
Submit Documentation Feedback
Software
www.ti.com
4.7.1
DAC Loopback Diagnostics Section
The DAC Loopback Diagnostics section allows the user to ensure proper signal chain operation by
reading the DAC output through the ADC. With the feedback loop enabled, the user can set a DAC value,
and then read the resulting ADC value on the Data Monitor page (see Section 4.14) to check for
agreement.
4.7.2
Sensor Connectivity Diagnostic Resistors Section
The Sensor Connectivity Diagnostic Resistors section allows the user to enable the sensor diagnostic
resistors to monitor short and open conditions on the sensor input pins. The output of these diagnostics is
available in the Fault Status tab of the tool panel to the right under the AFE Diagnostics Section. Short
and open conditions can be determined using the VINTP, VINTN, VINPP, and VINPN undervoltage and
overvoltage fault status bits in combination with the internal pulldown resistors.
4.8
SENT Interface Page (PGA 904 Only)
The SENT Interface page (see Figure 14) allows the user to control SENT settings, and to test
communication on both the fast and slow communication channels.
Figure 14. SENT Interface Page
Data length controls the number of fast data Nibbles (4 bits) that will be sent within each transmission, and
the Tick period determines the overall speed of the data output.
SLDU031 – December 2017
Submit Documentation Feedback
PGAxxxEVM-037 Pressure Sensor Signal Conditioner Evaluation Module
Copyright © 2017, Texas Instruments Incorporated
19
Software
www.ti.com
The pause pulse at the end of each data transmission can be either disabled or turned on with three
options for how the length of the pause pulse is determined.
The serial message, or slow channel communication can be enabled and configured. The slow channel
data will be contained in small portions as part of the STATUS frame at the beginning of each
transmission, when enabled. Short mode will send only 8 bits, while enhanced mode will allow the user to
send 12 or 16 bits depending on the Enhanced Config Bit value (0b0 = 12 bits and 0b1 = 16 bits).
Both the fast- and slow-channel communication can be tested from the SENT interface page. Note that
when a test signal is begun, it will continuously output the test data until the SENT interface is disabled.
4.9
Memory Map Page
The Memory Map, shown in Figure 15, allows low-level access to all available registers in the PGAxxx
device. Any changes made to the map on the left are not finalized until the user clicks either the Write
Selected or Write All buttons to the right of the grid.
The user can save a grid or load a previously saved grid. Note that only the active tab will be saved to a
file when saving a grid. The file created when saving the EEPROM tab grid is interchangeable with the file
created when saving the EEPROM settings on the Memory Program page (see Section 4.11).
20
PGAxxxEVM-037 Pressure Sensor Signal Conditioner Evaluation Module
Copyright © 2017, Texas Instruments Incorporated
SLDU031 – December 2017
Submit Documentation Feedback
Software
www.ti.com
Figure 15. Memory Map Page
SLDU031 – December 2017
Submit Documentation Feedback
PGAxxxEVM-037 Pressure Sensor Signal Conditioner Evaluation Module
Copyright © 2017, Texas Instruments Incorporated
21
Software
www.ti.com
4.10 Test Mode Page
Figure 16. Test Mode Page
The Test Mode page (see Figure 16) provides access to the analog and digital test MUX settings of the
PGAxxx device. The analog and digital test MUX outputs are output through the TEST1 pin, while the
analog test MUX inputs are connected to the VINTP and VINTN pins. A variety of internal signals are
accessible through these options for debugging purposes, but a full description of this functionality is
outside the scope of this document.
22
PGAxxxEVM-037 Pressure Sensor Signal Conditioner Evaluation Module
Copyright © 2017, Texas Instruments Incorporated
SLDU031 – December 2017
Submit Documentation Feedback
Software
www.ti.com
4.11 Memory Program Page
Figure 17. Memory Program Page
For the EEPROM Memory, the user can load or save a memory map file as well as program the
calculated CRC. It is a good practice to verify the EEPROM after each programming procedure. Note that
the file loaded and saved on this page is interchangeable with the file that can be loaded or saved on the
Memory Map page when viewing the EEPROM tab.
NOTE: The OTP Memory and Development RAM Memory sections are only available in the
PGA902 and PGA904 EVM GUIs.
SLDU031 – December 2017
Submit Documentation Feedback
PGAxxxEVM-037 Pressure Sensor Signal Conditioner Evaluation Module
Copyright © 2017, Texas Instruments Incorporated
23
Software
www.ti.com
The Check OTP Status button allows the user to see if the OTP memory has already been burned on their
PGAxxx device. An OTP file can be loaded and then programmed and verified in the OTP Memory
Section.
When using the DEVRAM, the DEVRAM memory space must be remapped to the OTP memory so that
the microcontroller operates from the correct memory. Select the Remap to OTP radio button, and click
the DEVRAM Remap button before continuing. Once completed, a DEVRAM file can be loaded,
programmed, and verified.
4.12 PGA302 Linearity Calibration Page (PGA302 Only)
Figure 18. PGA302 Linearity Calibration Page
24
PGAxxxEVM-037 Pressure Sensor Signal Conditioner Evaluation Module
Copyright © 2017, Texas Instruments Incorporated
SLDU031 – December 2017
Submit Documentation Feedback
Software
www.ti.com
One of the key features of the PGA302 pressure sensor signal conditioner is the preprogrammed firmware
which includes linearization and temperature compensation algorithms to provide reliable results from a
variety of pressure sensors in real world systems. To maximize the effectiveness of these algorithms,
calibration of the PGA302 device for each sensor is critical. The PGA302 Linearity Calibration panel
provides a simple interface to calibrate the input and output stages of the PGA302 device with minimal
external equipment. The following example procedure will walk the user through the calibration process by
using the onboard resistive bridge to simulate a pressure sensor.
4.12.1
PGA302 Linearity Calibration Procedure
1. Follow the PGAxxxEVM-037 Quick Start Procedure (Section 3.1) to power up the EVM and establish
communication with the PGAxxx device. Make sure that the jumpers are set to their default position as
shown in Table 1.
2. Place the microcontroller in Reset by clicking the Microcontroller State field.
3. Select the Calibration Model you wish to use. For this example, select “3 Pressure, 1 Temperature”
4. Click START at the bottom of the page, and follow the prompts from the message center below the
START button.
5. Update the desired output voltage for Pressure 1 and click NEXT when finished. Repeat this process
for Pressure 2 through Pressure 4. In this case (3 Pressure, 1 Temperature), Pressure 3 is not
accessible for updating.
6. Update the desired DAC Code for Pressure 1 and click NEXT when finished. Repeat this process for
Pressures 2 and 4.
7. Click NEXT again. Check the value in the Vout 1 row under the column Temp 2. This value will be
automatically populated with the Vout voltage output associated with the DAC code entered in the
previous step. The voltage is measured by the ADC in the MSP430 microcontroller on the
PGAxxxEVM-037. If you wish to verify the voltage with an external voltage meter, measure the voltage
on the VOUT_SENT test point on the EVM. The voltage value can be left as is, or an updated value
can be manually entered by the user. Once the value is set, click NEXT. Repeat this process for Vout
2, and Vout 4.
8. Before continuing, set the number of Average Samples to use in the Advanced Settings section of the
page. This value can range from 1 to 128 and will average the number of samples selected to
generate the ADC value populated in the calibration algorithm. Increasing the number of samples
averaged will increase the amount of time it takes for the ADC value to populate. For this example, the
default value of 8 will be selected.
9. Set the resistive bridge leg resistance to the desired value using the Resistive Bridge Configuration
panel. For this example use "5.0850k" as the Pressure 1 value. Click NEXT when finished. The cell will
be populated automatically with the value read by the ADC. If the value does not populate properly, or
if the value does not seem correct, the Data Monitor page (see Section 4.14) can be used to help
debug by reading the ADC values in real time. The value in the cell can be manually entered at any
time by clicking the Full Manual Data Entry checkbox.
10. Set the resistive bridge leg resistance to the second pressure value. For this example, use "5.0806k".
Once complete, click NEXT to populate the ADC value in the cell. Repeat this process for the third and
final pressure point, using a resistive bridge leg resistance of "5.0713k".
11. After completing the pressure readings, click NEXT to populate the temperature cell. The cell will be
automatically populated with the ADC value read from the internal temperature sensor of the PGA302.
Click NEXT again.
12. The VDD Supply Voltage field will now be automatically populated with the value measured by the
ADC of the MSP430. If desired, the VDD Supply Voltage can be measured externally from the test
point labeled VDD on the EVM, and entered manually into the calibration page. Click NEXT again.
13. Now the desired VDD Supply Voltage field will be populated. Click NEXT again.
14. Click CALCULATE. This will use the data generated through the calibration procedure to calculate the
coefficient values for linearity and temperature compensation and display them in the message center
at the bottom of the page. Click PROGRAM to program the values to the EEPROM.
15. Navigate to the PGA302 EEPROM Settings page to verify the coefficients have been populated in the
Linearity Calibration Parameters section of the page. While on this page, click the UPDATE button to
correct the EEPROM CRC value. The PGA302 device is now fully calibrated.
SLDU031 – December 2017
Submit Documentation Feedback
PGAxxxEVM-037 Pressure Sensor Signal Conditioner Evaluation Module
Copyright © 2017, Texas Instruments Incorporated
25
Software
www.ti.com
16. To test the results of the calibration click the Microcontroller State field to begin running the
microcontroller, and navigate to the Voltage Monitor tab in the tool panel.
17. Select the second pressure point in the Resistive Bridge Configuration panel, by setting the resistance
of the leg to "5.0806k". The VOUT voltage in the tool panel should match the voltage selected for the
Pressure 2 output during the calibration procedure.
4.13 PGA302 EEPROM Settings Page (PGA302 Only)
Figure 19 illustrates the PGA302 EEPROM settings page.
Figure 19. PGA302 EEPROM Settings Page
26
PGAxxxEVM-037 Pressure Sensor Signal Conditioner Evaluation Module
Copyright © 2017, Texas Instruments Incorporated
SLDU031 – December 2017
Submit Documentation Feedback
Software
www.ti.com
When making changes to any parameters on the PGA302 EEPROM settings page, the new settings are
automatically burned to the EEPROM. No separate programming action is required. However, it is
necessary to update the CRC once any of the EEPROM settings have been changed, including at the end
of a calibration procedure.
4.13.1
Linearity Calibration Parameters
The linearity calibration parameters are automatically set once the Linearity Calibration Procedure (see
Section 4.12.1) has been completed. No user input is necessary; however, individual coefficients can be
changed manually if desired.
4.13.2
Analog Front End Settings
The Analog Front End Settings are the same as those included in the Analog Front End block diagram
panel. To program the settings in the EEPROM, they must be entered in the PGA302 EEPROM Settings
panel. For a full description of the Analog Front End Settings, see Section 4.5.
4.13.3
DAC Output Settings
The DAC Output Settings allow the user to configure the DAC output ranges as well as the DAC output
level during a fault.
4.13.4
Diagnostics Enable
Allows the user to enable analog front end diagnostic bits to be viewed in the Fault Status tab. See
Table 6 for a description of diagnostic bits.
4.13.5
Other Settings
Other settings on this page include locking the EEPROM so that the values cannot be changed, enabling
all diagnostics with a single check box, viewing the production serial number of the PGA302 device (read
only), or setting the IIR Filter Cutoff frequency.
SLDU031 – December 2017
Submit Documentation Feedback
PGAxxxEVM-037 Pressure Sensor Signal Conditioner Evaluation Module
Copyright © 2017, Texas Instruments Incorporated
27
Software
www.ti.com
4.14 Data Monitor Page
Figure 20. Data Monitor Page
The Data Monitor page (see Figure 20) allows you to see the ADC sample values being read in real time.
Data can be read from the P Channel, the T Channel, or both on the same graph. The number of samples
recorded can be adjusted from 128 to 4096. By default, the graph will continually loop until it is stopped by
the user, but by unchecking the Loop checkbox the samples will stop when the record length is reached.
Data can be exported to a .txt file format by clicking the Export Data button. The file contains all of the
data currently displayed in the plot in a comma separated value format with the sample number, the P
channel value, and the T channel value for each sample for easy data manipulation.
28
PGAxxxEVM-037 Pressure Sensor Signal Conditioner Evaluation Module
Copyright © 2017, Texas Instruments Incorporated
SLDU031 – December 2017
Submit Documentation Feedback
Software
www.ti.com
4.15 Tool Panel
Figure 21. Tool Panel
4.15.1
Utilities Tab
The UTILITIES tab (see Figure 22) includes useful tools for interacting with the low level memory of the
PGAxxx device and for communication debugging purposes.
SLDU031 – December 2017
Submit Documentation Feedback
PGAxxxEVM-037 Pressure Sensor Signal Conditioner Evaluation Module
Copyright © 2017, Texas Instruments Incorporated
29
Software
www.ti.com
Figure 22. UTILITIES tab
4.15.1.1
Base Converter
A base converter is included to quickly convert among decimal, hexadecimal, and binary number systems.
Simply type a number into one of the three fields, and press the enter key to populate the converted
values in the remaining two fields.
4.15.1.2
EVM Low-Level Communication
The EVM Low-Level Communication section allows for direct access to device registers, and provides an
easy method to debug I2C and OWI communications. To configure a specific register enter the I2C device
address, the PGAxxx device register address desired, and the register value in the Data Write field then
click the I2C Write button to send the data.
4.15.2
Data Log tab
The Data Log tab (see Figure 23) logs all communication functions between the GUI and the PGAxxx
device. Each line displays the communication type, followed by whether data was read or written, and
finally the actual data in hexadecimal form.
30
PGAxxxEVM-037 Pressure Sensor Signal Conditioner Evaluation Module
Copyright © 2017, Texas Instruments Incorporated
SLDU031 – December 2017
Submit Documentation Feedback
Software
www.ti.com
Figure 23. Data Log Tab
SLDU031 – December 2017
Submit Documentation Feedback
PGAxxxEVM-037 Pressure Sensor Signal Conditioner Evaluation Module
Copyright © 2017, Texas Instruments Incorporated
31
Software
4.15.3
www.ti.com
Voltage Monitor Tab
The Voltage Monitor as illustrated in Figure 24 provides a quick way to check vital system voltages for
EVM functionality and debugging purposes. These voltages are measured via the ADC in the MSP430
microcontroller included on the EVM.
Figure 24. Voltage Monitor Tab
32
PGAxxxEVM-037 Pressure Sensor Signal Conditioner Evaluation Module
Copyright © 2017, Texas Instruments Incorporated
SLDU031 – December 2017
Submit Documentation Feedback
Software
www.ti.com
4.15.4
Fault Status tab
The Fault Status tab shown in Figure 25 includes fault status registers for the digital interfaces, OWI
status, the power supply monitor, and AFE diagnostics for quick diagnosis and debug of the most common
device and EVM issues. Table 6 describes the available fault status bits. Note that the AFE Diagnostics
must be enabled in the EEPROM Settings before they are updated in the Fault Status tab.
Figure 25. Fault Status tab
Table 6. Fault Status Indicators
Fault Indicator
Description
I2C_ERR
An error response on the access from I2C during access to the slave
OWI_ERR
An error response on the access from OWI during access to the slave
TF_ERR
Error response on the access from Trace FIFO
SYNC <320BPS
SYNC field data rate under 320 bits per second
SYNC >9600BPS
SYNC field data rate over 9600 bits per second
SYNC STOP Short
SYNC stop bit too short
CMD STOP Bad
Incorrect CMD stop bit value
CMD STOP Short
CMD stop bit too short
Data STOP Bad
Incorrect DATA stop bit value
Data STOP Short
DATA stop bit too short
Data STOP Override
DATA Field slave transmit value overdriven to dominant value during stop bit transmit
SYNC Tolerance Err
Consecutive bits in the sync field are different by more than ±25% tolerance
SLDU031 – December 2017
Submit Documentation Feedback
PGAxxxEVM-037 Pressure Sensor Signal Conditioner Evaluation Module
Copyright © 2017, Texas Instruments Incorporated
33
Software
www.ti.com
Table 6. Fault Status Indicators (continued)
4.15.5
Fault Indicator
Description
OWI Invalid CMD
OWI command field invalid. See device datasheet for available OWI commands
VBRG_OV
Bridge Supply OV Flag; Bridge Supply voltage > 1.15 times nominal value
VBRG_UV
Bridge Supply UV Flag; Bridge Supply voltage < 0.85 times nominal value
REF_OV
Reference OV Flag; Reference voltage > 1.1 times nominal value
REF_UV
Reference UV Flag; Reference voltage > 0.9 times nominal value
DVDD_OV
DVDD OV Flag; DVDD voltage > 1.15 times nominal value
DVDD_UV
DVDD UV Flag; DVDD voltage < 0.9 times nominal value
VINP_OV
Overvoltage on VINPP or VINPN pins
VINP_UV
Undervoltage on VINPP or VINPN pins
VINT_OV
Overvoltage on VINTP or VINTN pins
VINT_UV
Undervoltage on VINTP or VINTN pins
PGAIN_OV
Overvoltage at PGAIN output
PGAIN_UV
Undervoltage at PGAIN output
TGAIN_OV
Overvoltage at TGAIN output
TGAIN_UV
Undervoltage at TGAIN output
Resistive Bridge Configuration Panel
Figure 26. Resistive Bridge Configuration Panel
The Resistive Bridge Configuration panel allows the user to control the digital potentiometer that makes up
one leg of the resistive bridge emulator on the EVM. This can be used to generate a differential voltage
across the VINTP and VINTN or the VINPP and VINPN pins depending on the jumper configuration. The
drop-down box allows the user to select a resistance in kΩ; the resulting change in the Vp voltage as well
as the differential voltage of Vp – Vn are automatically updated in the schematic.
34
PGAxxxEVM-037 Pressure Sensor Signal Conditioner Evaluation Module
Copyright © 2017, Texas Instruments Incorporated
SLDU031 – December 2017
Submit Documentation Feedback
Board Layout
www.ti.com
5
Board Layout
Figure 27 through Figure 30 illustrate the EVM PCB layouts.
Figure 27. Top Layer
SLDU031 – December 2017
Submit Documentation Feedback
PGAxxxEVM-037 Pressure Sensor Signal Conditioner Evaluation Module
Copyright © 2017, Texas Instruments Incorporated
35
Board Layout
www.ti.com
Figure 28. Top Component Placement
36
PGAxxxEVM-037 Pressure Sensor Signal Conditioner Evaluation Module
Copyright © 2017, Texas Instruments Incorporated
SLDU031 – December 2017
Submit Documentation Feedback
Board Layout
www.ti.com
Figure 29. Bottom Layer
SLDU031 – December 2017
Submit Documentation Feedback
PGAxxxEVM-037 Pressure Sensor Signal Conditioner Evaluation Module
Copyright © 2017, Texas Instruments Incorporated
37
Board Layout
www.ti.com
Figure 30. Bottom Component Placement
38
PGAxxxEVM-037 Pressure Sensor Signal Conditioner Evaluation Module
Copyright © 2017, Texas Instruments Incorporated
SLDU031 – December 2017
Submit Documentation Feedback
Schematic and Bill of Materials
www.ti.com
6
Schematic and Bill of Materials
6.1
Schematic
NOTE: The schematic pictured in Figure 31 shows the board configuration for the PGA904EVM which includes additional components populated
for OTP programming and a socket for the PGAxxx devices.
SLDU031 – December 2017
Submit Documentation Feedback
PGAxxxEVM-037 Pressure Sensor Signal Conditioner Evaluation Module
Copyright © 2017, Texas Instruments Incorporated
39
Schematic and Bill of Materials
www.ti.com
Figure 31. PGA302EVM Schematic
40
PGAxxxEVM-037 Pressure Sensor Signal Conditioner Evaluation Module
Copyright © 2017, Texas Instruments Incorporated
SLDU031 – December 2017
Submit Documentation Feedback
Schematic and Bill of Materials
www.ti.com
Figure 32. PGAxxxEVM MSP430 Interface Schematic
SLDU031 – December 2017
Submit Documentation Feedback
PGAxxxEVM-037 Pressure Sensor Signal Conditioner Evaluation Module
Copyright © 2017, Texas Instruments Incorporated
41
Schematic and Bill of Materials
6.2
www.ti.com
Bill of Materials
NOTE: The bill of materials in Table 7 shows the components for the PGA904EVM-037. The PGA302EVM-037 and PGA904EVM-037 contain
fewer components, but any component present on all three boards will have the same value and part number.
Table 7. Bill of Materials (1)
Designator
QTY
Value
Description
Package Reference
Manufacturer
!PCB1
1
MHR037
Any
C4, C7, C9, C10, C20,
C21, C23, C40
8
0.1uF
CAP, CERM, 0.1 µF, 50 V, ±10%, X7R, 0603
0603
C0603C104K5RACTU
Kemet
C5
1
100uF
CAP, AL, 100 µF, 35 V, ±20%, SMD
F80
EMVA350ADA101MF80G
Chemi-Con
C6
1
100uF
CAP, AL, 100 µF, 35 V, ±20%, 0.34 ohm, SMD
F80
EMZA350ADA101MF80G
Chemi-Con
C11, C19, C29
3
2200pF
CAP, CERM, 2200 pF, 50 V, ±10%, X7R, 0603
0603
C0603C222K5RAC
Kemet
C13, C14, C17, C18
4
0.15uF
CAP, CERM, 0.15 µF, 16 V, +80/-20%, Y5V, 0603
0603
C0603C154Z4VACTU
Kemet
C15
1
470pF
CAP, CERM, 470 pF, 50 V, ±10%, X7R, 0603
0603
C0603C471K5RACTU
Kemet
C22
1
0.47uF
CAP, CERM, 0.47 µF, 10 V, ±10%, X5R, 0603
0603
C0603C474K8PACTU
Kemet
C24, C25, C26
3
1uF
CAP, CERM, 1 µF, 16 V, ±10%, X5R, 0603
0603
C0603C105K4PACTU
Kemet
C27, C32
2
220pF
CAP, CERM, 220pF, 50V, ±1%, C0G/NP0, 0603
0603
06035A221FAT2A
AVX
C28
1
220pF
CAP, CERM, 220 pF, 50 V, ±10%, C0G/NP0, 0603
0603
C0603C221K5GACTU
Kemet
C30
1
100pF
CAP, CERM, 100 pF, 50 V, ±5%, C0G/NP0, 0603
0603
C0603C101J5GAC
Kemet
C31
1
2200pF
CAP, CERM, 2200pF, 50V, ±10%, X7R, 0603
0603
C0603X222K5RACTU
Kemet
C33
1
0.47uF
CAP, CERM, 0.47 µF, 10 V, ±10%, X5R, 0402
0402
C1005X5R1A474K050BB
TDK
C34, C35, C36
3
0.1uF
CAP, CERM, 0.1 µF, 10 V, ±10%, X5R, 0402
0402
C1005X5R1A104K
TDK
C37, C38
2
30pF
CAP, CERM, 30 pF, 50 V, ±5%, C0G/NP0, 0603
0603
GRM1885C1H300JA01D
Murata
D1
1
75V
Diode, Switching, 75 V, 0.3 A, SOT-23
SOT-23
BAV99-7-F
Diodes Inc.
D2
1
Green
LED, Green, SMD
1.6x0.8x0.8mm
LTST-C190GKT
Lite-On
D3
1
75V
Diode, Switching, 75 V, 0.3 A, SOD-523
SOD-523
1N4148X-TP
Micro Commercial
Components
H1, H2, H3, H4
4
Machine Screw, Round, #4-40 x 1/4, Nylon, Philips
panhead
Screw
NY PMS 440 0025 PH
BandF Fastener Supply
H5, H6, H7, H8
4
Standoff, Hex, 0.5"L #4-40 Nylon
Standoff
1902C
Keystone
J1, J2, J3
3
Therminal Block, 5 mm, 2-pole, TH
TH, 2-Leads, Body
10x9mm, Pitch 5mm
1935161
Phoenix Contact
J4, J5, J6, J7, J9
5
Header, 100mil, 3x1, Gold, SMT
Samtec_TSM-103-01X-SV
TSM-103-01-L-SV
Samtec
J8
1
Conn Rcpt Mini USB2.0 Type B 5POS SMD
USB Mini Type B
1734035-2
TE Connectivity
J11
1
Header, 100mil, 2x1, Gold with Tin Tail, SMT
2x1 Header
TSM-102-01-L-SV
Samtec
J12
1
Header, 100mil, 10x2, Tin, SMT
1000x180x290mil
TSM-110-01-T-DV-P
Samtec
J13, J14
2
Standard Banana Jack, Uninsulated, 5.5mm
Keystone_575-4
575-4
Keystone
LBL1
1
Thermal Transfer Printable Labels, 0.650" W x 0.200" H
- 10,000 per roll
PCB Label 0.650"H x
0.200"W
THT-14-423-10
Brady
(1)
42
Printed Circuit Board
Part Number
Alternate Part
Number
Alternate
Manufacturer
Unless otherwise noted in the Alternate Part Number or Alternate Manufacturer columns, all parts may be substituted with equivalents.
PGAxxxEVM-037 Pressure Sensor Signal Conditioner Evaluation Module
Copyright © 2017, Texas Instruments Incorporated
SLDU031 – December 2017
Submit Documentation Feedback
Schematic and Bill of Materials
www.ti.com
Table 7. Bill of Materials (1) (continued)
Designator
QTY
Value
PWR
1
Green
LED, Green, SMD
2x1.25mm
LG R971-KN-1
OSRAM
Q1
1
40 V
Transistor, PNP, 40 V, 0.2 A, SOT-23
SOT-23
MMBT3906-7-F
Diodes Inc.
R1, R4, R27, R28
4
100k
RES, 100 k, 1%, 0.1 W, 0603
0603
RC0603FR-07100KL
Yageo America
R2, R5, R7, R55
4
10.0
RES, 10.0, 1%, 0.1 W, 0603
0603
RC0603FR-0710RL
Yageo America
R9, R11, R15, R17, R53
5
0
RES, 0, 5%, 0.1 W, 0603
0603
RC0603JR-070RL
Yageo America
R10
1
1.2k
RES, 1.2 k, 5%, 0.1 W, 0603
0603
RC0603JR-071K2L
Yageo America
R12
1
2.40k
RES, 2.40 k, 1%, 0.1 W, 0603
0603
RC0603FR-072K4L
Yageo America
R13
1
2.37k
RES, 2.37 k, 1%, 0.1 W, 0603
0603
RC0603FR-072K37L
Yageo America
R14, R22, R42, R45,
R49, R51
6
4.70k
RES, 4.70 k, 1%, 0.1 W, 0603
0603
RC0603FR-074K7L
Yageo America
R16
1
17.8k
RES, 17.8 k, 1%, 0.1 W, 0603
0603
RC0603FR-0717K8L
Yageo America
R18
1
10.0k
RES, 10.0 k, 1%, 0.1 W, 0603
0603
RC0603FR-0710KL
Yageo America
R19, R52
2
6.19k
RES, 6.19 k, 1%, 0.1 W, 0603
0603
RC0603FR-076K19L
Yageo America
R20
1
0
RES, 0, 5%, 0.125 W, 0805
0805
RC0805JR-070RL
Yageo America
R21
1
TRIMMER 10K OHM 0.1W
3.8x3.6mm
TC33X-2-103E
Bourns
R23
1
0
RES, 0, 5%, 0.125 W, 0805
0805
CRCW08050000Z0EA
Vishay-Dale
R24
1
2.55k
RES, 2.55 k, 0.1%, 0.1 W, 0603
0603
RT0603BRD072K55L
Yageo America
R25, R29, R30
3
4.99k
RES, 4.99 k, 0.1%, 0.1 W, 0603
0603
RT0603BRD074K99L
Yageo America
R26
1
2.61k
RES, 2.61 k, 0.1%, 0.1 W, 0603
0603
RT0603BRD072K61L
Yageo America
R31, R32
2
33
RES, 33 ohm, 5%, 0.063W, 0402
0402
CRCW040233R0JNED
Vishay-Dale
R33
1
1.5k
RES, 1.5k ohm, 5%, 0.063W, 0402
0402
CRCW04021K50JNED
Vishay-Dale
R34
1
1.07Meg
RES, 1.07Meg ohm, 1%, 0.1W, 0603
0603
CRCW06031M07FKEA
Vishay-Dale
R35, R47
2
33k
RES, 33k ohm, 5%, 0.063W, 0402
0402
CRCW040233K0JNED
Vishay-Dale
R36
1
2.7k
RES, 2.7 k, 5%, 0.1 W, 0603
0603
RC0603JR-072K7L
Yageo America
R37
1
27.0k
RES, 27.0 k, 1%, 0.1 W, 0603
0603
RC0603FR-0727KL
Yageo America
R38
1
76.8k
RES, 76.8 k, 1%, 0.1 W, 0603
0603
RC0603FR-0776K8L
Yageo America
R39
1
560
RES, 560, 1%, 0.1 W, 0603
0603
RC0603FR-07560RL
Yageo America
R40
1
82.0k
RES, 82.0 k, 1%, 0.1 W, 0603
0603
RC0603FR-0782KL
Yageo America
R41, R44, R48
3
2.43k
RES, 2.43 k, 1%, 0.1 W, 0603
0603
RC0603FR-072K43L
Yageo America
R50
1
9.53k
RES, 9.53 k, 1%, 0.1 W, 0603
0603
RC0603FR-079K53L
Yageo America
R54
1
220
RES, 220, 1%, 0.1 W, 0603
0603
RC0603FR-07220RL
Yageo America
R59
1
470k
RES, 470 k, 1%, 0.0625 W, 0402
0402
RC0402FR-07470KL
Yageo America
RT1
1
10.0k ohm
Thermistor NTC, 10.0k ohm, 1%, 0402
0402
NCP15XH103F03RC
Murata
S1
1
Switch, Tactile, SPST-NO, 0.1A, 16V, SMT
4.93x4.19x6.2 mm
7914G-1-000E
Bourns
SH-J4, SH-J5, SH-J6,
SH-J7, SH-J9
5
Shunt, 100mil, Gold plated, Black
Shunt 2 pos. 100 mil
881545-2
TE Connectivity
TP1, TP2, TP3
3
Test Point, Miniature, Black, TH
Black Miniature
Testpoint
5001
Keystone
U1
1
Sensor Signal Conditioner with 0-5V Ratiometric Output,
PW0016A (TSSOP-16)
PW0016A
PGA302PWQ1
Texas Instruments
Black
SLDU031 – December 2017
Submit Documentation Feedback
Description
Package Reference
Part Number
Manufacturer
Alternate Part
Number
Alternate
Manufacturer
PGAxxxEVM-037 Pressure Sensor Signal Conditioner Evaluation Module
Copyright © 2017, Texas Instruments Incorporated
43
Schematic and Bill of Materials
www.ti.com
Table 7. Bill of Materials (1) (continued)
Designator
QTY
Value
Description
Package Reference
Part Number
Manufacturer
U2
1
Voltage Output, Low- or High-Side Measurement,
Bidirectional, Zero-Drift Series, Current-Shunt Monitor,
DCK0006A (SOT-6)
DCK0006A
INA210BIDCKR
Texas Instruments
U3
1
DUAL DIFFERENTIAL COMPARATORS, DGK0008A
DGK0008A
LM2903DGKR
Texas Instruments
U4
1
3-TERMINAL ADJUSTABLE REGULATOR, DCY0004A
DCY0004A
LM317DCYR
Texas Instruments
U6
1
256 Taps Single Channel Digital Potentiometer With SPI
Interface, DCN0008A
DCN0008A
TPL0501-100DCNR
Texas Instruments
U7
1
36-V, Single-Supply, Low-Power Operational Amplifier
for Cost-Sensitive Systems, D0008A (SOIC-8)
D0008A
TLV2171IDR
Texas Instruments
U8
1
Dual Output High PSRR LDO, 200 mA, Fixed 3.3, 1.8 V
Output, 2 to 5.5 V Input, 6-pin WSON (DSE), -40 to 125
degC, Green (RoHS and no Sb/Br)
DSE0006A
TLV7113318DDSER
U9
1
25 MHz Mixed Signal Microcontroller with 32 KB Flash,
4096 B SRAM and 47 GPIOs, -40 to 85 degC, 64-pin
QFN (RGC), Green (RoHS and no Sb/Br)
RGC0064B
U10
1
2-Bit Bidirectional Voltage-Level Translator for OpenDrain and Push-Pull Application, DQE0008A
Y1
1
C1
0
0.1uF
C2, C8, C16
0
C3
Alternate Part
Number
INA210BIDCKT
Alternate
Manufacturer
Texas Instruments
Texas Instruments
LM317DCY
Texas Instruments
Texas Instruments
Equivalent
Texas Instruments
MSP430F5510IRGCR
Texas Instruments
Equivalent
Texas Instruments
DQE0008A
TXS0102DQER
Texas Instruments
Crystal, 24 MHz, 18 pF, SMD
ABM3
ABM3-24.000MHZ-D2Y-T
Abracon Corporation
CAP, CERM, 0.1 µF, 50 V, ±10%, X7R, 0603
0603
C0603C104K5RACTU
Kemet
0.01uF
CAP, CERM, 0.01 µF, 25 V, ±5%, C0G/NP0, 0603
0603
C0603H103J3GACTU
Kemet
0
4.7uF
CAP, CERM, 4.7 µF, 10 V, ±10%, X5R, 0603
0603
C0603C475K8PACTU
Kemet
C12
0
1uF
CAP, TA, 1 µF, 35 V, ±10%, 1.7 ohm, SMD
3528-21
T495B105K035ATE1K7
Kemet
C39
0
2200pF
CAP, CERM, 2200 pF, 50 V, ±10%, X7R, 0603
0603
C0603C222K5RAC
Kemet
FID1, FID2, FID3, FID4,
FID5, FID6
0
Fiducial mark. There is nothing to buy or mount.
Fiducial
N/A
N/A
J10
0
Header, 100mil, 2x1, Gold with Tin Tail, SMT
2x1 Header
TSM-102-01-L-SV
Samtec
R3
0
25.5k
RES, 25.5 k, 1%, 0.1 W, 0603
0603
RC0603FR-0725K5L
Yageo America
R6
0
4.70k
RES, 4.70 k, 1%, 0.1 W, 0603
0603
RC0603FR-074K7L
Yageo America
R43, R46
0
0
RES, 0, 5%, 0.1 W, 0603
0603
RC0603JR-070RL
Yageo America
R57
0
10.0k
RES, 10.0 k, 1%, 0.1 W, 0603
0603
RC0603FR-0710KL
Yageo America
R58
0
4.70Meg
RES, 4.70 M, 1%, 0.1 W, 0603
0603
RC0603FR-074M7L
Yageo America
U5
0
Single Output LDO, 50 mA, Adjustable 1.175 to 26 V
Output, 7 to 28 V Input, 8-pin MSOP (DGN), -40 to 125
degC, Green (RoHS and no Sb/Br)
DGN0008B
TPS7A4201DGNR
Texas Instruments
Equivalent
Texas Instruments
U11
0
Sensor Signal Conditioner with 0-5V Ratiometric Output,
PW0016A (TSSOP-16)
PW0016A
PGA902PWQ1
Texas Instruments
XU1
0
Socket, SOP-16, 0.65mm Pitch, TH
Socket, 16-Leads,
Body 17.6X21.5mm,
Pitch 0.65mm
OTS-16(28)-0.65-01
Enplas Tech Solutions
44
PGAxxxEVM-037 Pressure Sensor Signal Conditioner Evaluation Module
Copyright © 2017, Texas Instruments Incorporated
SLDU031 – December 2017
Submit Documentation Feedback
STANDARD TERMS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or
documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance
with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by
neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have
been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications
or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control
techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM.
User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)
business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.
2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit
User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty
period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or
replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be
warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software
associated with the kit to determine whether to incorporate such items in a finished product and software developers to write
software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or
otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition
that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.
Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must
operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the
instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs
(which for the avoidance of doubt are stated strictly for convenience and should be verified by User):
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿6丁目24番1号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/
/www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
3.4 European Union
3.4.1
For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive):
This is a class A product intended for use in environments other than domestic environments that are connected to a
low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this
product may cause radio interference in which case the user may be required to take adequate measures.
4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT
LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL
FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT
NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS
FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE
SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE
CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR
INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE
EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR
IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY
WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL
THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF
SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR
REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING,
OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF
USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI
MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS
OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDED
HEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN
CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR
EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE
CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2017, Texas Instruments Incorporated
IMPORTANT NOTICE FOR TI DESIGN INFORMATION AND RESOURCES
Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to,
reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are
developing applications that incorporate TI products; by downloading, accessing or using any particular TI Resource in any way, you
(individually or, if you are acting on behalf of a company, your company) agree to use it solely for this purpose and subject to the terms of
this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,
enhancements, improvements and other changes to its TI Resources.
You understand and agree that you remain responsible for using your independent analysis, evaluation and judgment in designing your
applications and that you have full and exclusive responsibility to assure the safety of your applications and compliance of your applications
(and of all TI products used in or for your applications) with all applicable regulations, laws and other applicable requirements. You
represent that, with respect to your applications, you have all the necessary expertise to create and implement safeguards that (1)
anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that
might cause harm and take appropriate actions. You agree that prior to using or distributing any applications that include TI products, you
will thoroughly test such applications and the functionality of such TI products as used in such applications. TI has not conducted any
testing other than that specifically described in the published documentation for a particular TI Resource.
You are authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include
the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO
ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY
RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or
endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR
REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING TI RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO
ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF
MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL
PROPERTY RIGHTS.
TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY YOU AGAINST ANY CLAIM, INCLUDING BUT NOT
LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF
DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL,
COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR
ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGES.
You agree to fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of your noncompliance with the terms and provisions of this Notice.
This Notice applies to TI Resources. Additional terms apply to the use and purchase of certain types of materials, TI products and services.
These include; without limitation, TI’s standard terms for semiconductor products http://www.ti.com/sc/docs/stdterms.htm), evaluation
modules, and samples (http://www.ti.com/sc/docs/sampterms.htm).
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2017, Texas Instruments Incorporated
Was this manual useful for you? yes no
Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Download PDF

advertising