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Texas Instruments LM63LM64LM96x63EVM User guides
LM63, LM64, LM96x63 Evaluation Module User
Guide
User's Guide
Literature Number: SNAU154
October 2013
User's Guide
SNAU154 – October 2013
LM63, LM64, LM96x3 Evaluation Module
The Texas Instruments LM63LM64LM96x3EVM evaluation module (EVM) helps designers evaluate the
operation and performance of the LM63, LM64, LM96063, and LM96163. The LM63, LM64, LM96063, and
LM96163 are industry-standard digital temperature sensors with integrated Sigma-Delta analog-to-digital
converters and a digital I2C interface.
Topic
1
2
3
4
5
6
7
2
...........................................................................................................................
Page
Introduction ........................................................................................................ 3
Board Connectors and Components ..................................................................... 4
Software Installation .......................................................................................... 15
Board Setup and Operation ................................................................................ 20
Board Layout .................................................................................................... 24
Schematic ........................................................................................................ 29
Bill of Materials ................................................................................................. 32
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Introduction
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1
Introduction
The LM63 provides a 10-bit signed digital temperature reading with an accuracy of ±1°C from 60°C to
100°C and ±3°C from 25°C to 125°C. It has an ALERT/TACH pin that can be used in Comparator,
Interrupt, or SMBus ALERT mode.
The LM64 provides a 10-bit signed digital temperature reading with an accuracy of ±1°C from 120°C to
140°C and ±3°C from 25°C to 140°C. It has an ALERT pin that can be used in Comparator, Interrupt, or
SMBus ALERT mode. It has a T_CRIT pin that acts as a comparator, and an A0 pin which selects either a
high or low I2C address. It also features 5 General Purpose Input Output (GPIO) and 5 General Purpose
Default (GPD) pins that are user customizable.
The LM96063 provides a 10-bit signed digital temperature reading with an accuracy of ±0.75°C from 40°C
to 105°C and ±1.5°C from 40°C to 125°C and ±3°C from 25°C to 125°C. It has an ALERT pin that can be
used in Comparator, Interrupt, or SMBus ALERT mode. It has a T_CRIT pin that acts as a comparator.
The LM96163 is similar to the LM96063 with the addition of TruTherm compensation for small feature size
transistors. It provides a 10-bit signed digital temperature reading with an accuracy of ±0.75°C from 50°C
to 105°C and ±1.5°C from 40°C to 125°C and ±3°C from 25°C to 125°C. It has an ALERT pin that can be
used in Comparator, Interrupt, or SMBus ALERT mode, and a T_CRIT pin that acts as a comparator.
The EVM contains one LM63, LM64, LM96063, and LM96163 digital temperature sensors. The EVM
comes pre-assembled with the LM63, LM63, LM96063, and LM96163 and jumper headers that allow the
end user to select different parameters such as slave address or input/output modes. The evaluation
board communicates with the USB interface and is programmed via a PC running LabVIEW evaluation
software.
Table 1. LM63LM64LM96x3 Evaluation Module
Device and Package Configurations
SENSOR
IC
U6
LM63CIMAX
SOIC-8
U7
LM64CILQ
WQFN-24
U8
LM96063CISD
WSON-10
U9
LM96163CISD
WSON-10
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PACKAGE
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Board Connectors and Components
2
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Board Connectors and Components
This section describes the jumpers and connectors on the LM63LM64LM96x63EVM, as well as software
installation, and the proper set up, connection, and use of the LM63LM64LM96x63EVM.
2.1
Input/Output Connector Description and Components
Figure 1. LM63LM64LM96x63EVM Board
4
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Board Connectors and Components
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2.1.1
Power Supply Input – VDD and GND
The power supply pin of all temperature sensors are connect to the +3.3V_DUT_JMP jumper. The EVM is
powered by USB but it can be attached to an external power supply by connecting it to pin 2 of
+3.3V_DUT_JMP jumper.
Figure 2. +3.3V_DUT_JMP Jumper
2.1.2
LM63 Test Point
The standard 100 mils header allows probing the LM63 signals including the I2C bus. The I2C bus is
required two bus lines to communicate with the device: a serial data line (SDA) and a serial clock line
(SCL). The ALERT pin is an active low comparator signal. The PWM pin sets the speed of the fan and the
TACH pin reads the speed of the fan.
Figure 3. LM63 Test Points
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Board Connectors and Components
2.1.3
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LM63 ALERT/TACH Select Jumper
The ALERT/TACH_SEL jumper allows setting ALERT / TACH pin as either an input TACH signal or an
output ALERT signal. However, the ALERT / TACH pin is a multi-function that can be programmed via
registers 0x03 or 0x09 bit 2.
Figure 4. LM63 ALERT/TACH Select Jumper
2.1.4
LM64 Test Point
The standard 100 mils header allows probing the LM64 signals including the I2C bus. The I2C bus is two
required bus lines to communicate with the device: a serial data line (SDA) and a serial clock line (SCL).
The A0 pin selects a high or low I2C slave address for the LM64. The ALERT and TCRIT pins are active
low comparator signals. The PWM pin sets the speed of the fan and the TACH pin reads the speed of the
fan.
Figure 5. LM64 Test Points
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2.1.5
LM64 A0 Select Jumper
The LM64 have two pre-programmed slave address. The A0_SEL jumper selects either a high or low I2C
slave address for the LM64. Setting the jumper to VDD sets the I2C address of the LM64 to 0x4E and
setting the jumper to GND sets the I2C address to 0x18. However, it was hardcoded to 0x18 slave
address in the software GUI.
Figure 6. LM64 A0 Select Jumper
2.1.6
LM64 GPIO Test Point
The GPIO Test Point header allows probing the General Purpose Input Output (GPIO) pins and General
Purpose Default (GPD) pins. The GPIO and GPD pins are pulled up to VDD with a 10kOhm resistor by
default.
Figure 7. LM64 GPIO Test Points
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Board Connectors and Components
2.1.7
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LM96063 Test Point
The standard 100 mils header allows probing the LM96063 signals including the I2C bus. The I2C bus is
required two bus lines to communicate with the device: a serial data line (SDA) and a serial clock line
(SCL). The ALERT and TCRIT pins are active low comparator signals. The PWM pin sets the speed of the
fan and the TACH pin reads the speed of the fan.
Figure 8. LM96063 Test Points
2.1.8
LM96163 Test Point
The standard 100 mils header allows probing the LM96163 signals including the I2C bus. The I2C bus is
required two bus lines to communicate with the device: a serial data line (SDA) and a serial clock line
(SCL). The ALERT and TCRIT pins are active low comparator signals. The PWM pin sets the speed of the
fan and the TACH pin reads the speed of the fan.
Figure 9. LM96163 Test Points
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2.1.9
Diode Jumper – JP2, JP4, JP6, JP7
The Q2, Q3, Q4, and Q5 are the remote diodes where the LM63, LM64, LM96063, LM96163 sense their
temperature. JP2, JP4, JP6, JP7 are used to connect the remote sensing diode to the temperature
sensors by connecting pin 1-3 for D- and pin 2-4 for D+. The end user may remove these jumpers and
attach his or her own diode.
Figure 10. LM64 Diode Jumper
Figure 11. LM63 Diode Jumper
Figure 12. LM96063 Diode Jumper
Figure 13. LM96163 Diode Jumper
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Board Connectors and Components
2.1.10
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LM63, LM64, LM96063, LM96163 Fan and External Power Connectors.
The LM63, LM64, LM96063, LM96163 Fan Connectors are used to connect a 4-pin fan to the
LM63LM64LM96x63EVM board. The LM63, LM64, LM96063, LM96163 external power connectors are
used to power the fan to its corresponding fan connectors. The connectors are to be powered with 5 V or
12 V from an external power supply.
Figure 14. LM63 Fan Connector
Figure 15. LM64 Fan Connector
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Figure 16. LM96063 Fan Connector
Figure 17. LM96163 Fan Connector
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Board Connectors and Components
2.1.11
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USB Connector
The USB Connector, J2, is a mini-USB port that is used to interface between a computer and the
evaluation board
Figure 18. LM63LM64LM96x63 USB Connector
2.1.12
MSP430F5529 Microcontroller
The MSP430F5529 microcontroller, U1, is used to translate the USB signals to I2C signals. The
MSP430F5529 is connected to a 24MHz crystal shown in Y1.
C1 and C2 are for filtering the 24MHz crystal’s signals. C4, C5, C6, C7, C15 are bypass capacitors. Q1 is
a transistor that allows the D1 LED to turn on or turn off.
Figure 19. MSP430F5529 Microcontroller
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2.1.13
PCA954A I2C Multiplexer
The PCA954A, U5, is a 1 to 4 bidirectional I2C line multiplexer. LM64, LM96063, and LM96163 have the
same slave address of 0x4C so their I2C buses must be separated. This separation is done using the
PCA954A I2C Multiplexer. The MSP430F5529 sends I2C commands to select the appropriate device,
after the selection the microcontroller sends I2C signals to the DUT’s as normal.
R5, R6, R15, R16, R17, R18, R19, R20 are pull up resistors are for the unused pins on the PCA954A.
C16 and C17 are bypass capacitors of values 0.1uF and 10uF respectively. R3 and R4 are 0 ohm series
resistors for the I2C lines.
Figure 20. PCA954A I2C Multiplexer
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Board Connectors and Components
2.1.14
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Power Conversion
The LM63LM64LM96x63EVM has components that convert 5 V from the USB connection to 3.3 V via a
LDO (U3, TPS7533DRB). A current limiting IC (U4, TPS2553DBV-1) is connected after the LDO and will
tell the MSP430F5529 to shut down if current drawn from the DUT’s exceeds the limit. There are 4 test
points: 5V_USB for testing power from the USB connector, +3.3V for testing voltage after the LDO,
+3.3_DUT for testing voltage after the LDO (TPS7533DRB) and current limiter (TPS2553DBV-1), and
GND for reference.
D2 is a Zener diode with a breakdown voltage of 7.5 V used for over voltage protection. FB1 is a ferrite
bead with an impedance of 90 Ω at 100 MHz.
Figure 21. LM63LM64LM96x63 Power Conversion
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Software Installation
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3
Software Installation
Download the latest version of LM63LM64LM96x63EVM software from our website at
http://www.ti.com/product/lm63. You must install the LM63LM64LM96x63EVM software before you
connect the LM63LM64LM96x63EVM board to your PC.
To install the LM63LM64LM96x63EVM Software:
1. Click this link http://www.ti.com/product/lm63, scroll down to the “software” section, and download the
latest LM63LM64LM96x63 evaluation software.
2. Unzip the downloaded file into a known directory, and run the “setup.exe” file located on the previous
created folder. Follow the pop-screen instructions by clicking the “Next” button to install the software.
Figure 22. LM63LM64LM96x63 Installation Directory
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Software Installation
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3. When the installation is finished, please click “Finish” button.
Figure 23. LM63LM64LM96x63 Installation Finish
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Software Installation
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4. Before launching the LM63LM64LM96x63EVM software, connect the LM63LM64LM96x63EVM board
to a USB port of your PC. Go to Device Manager and find “MSP43-USB Example” (see Figure 24).
Right click and select Update Driver Software.
Figure 24. Update Driver Software
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Software Installation
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5. On the next screen, select the “Browse my computer for driver software” option and go to the
directory of C:\Program Files (x86)\Texas Instruments\LM63LM64LM96x63\ LM63LM64LM96x63
Driver and select the “LM63LM64LM96x63_PID0x0925.inf” file.
6. If prompted with a warning window select “Install this Driver Anyway”. Close the installation window
when it is done. The device manager should now display an “LM63LM64LM96x63EVM” item followed
by a COM port number.
Figure 25. Driver Authentication Warning
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7. Close the installation window when it’s done. The device manager should now display a
"LM63LM64LM96x63EVM(COM5)” item followed by a COM port number. The EVM software is
automatically selected as the COM port.
Figure 26. Example COM Port Number
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Board Setup and Operation
4
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Board Setup and Operation
1. For proper operation of the LM63LM64LM96x63EVM JP1 should be jumpered. This will allow the
DUT’s VDD to be sourced from an on-board 3.3 V regulator.
2. JP2, JP4, JP6, and JP7 should be jumpered to connect the MMBT3904’s to their respective parts.
3. A0_SEL should be jumpered to GND for hardware selectable I2C address.
4. ALERT/TACH_SEL should be jumpered to TACH to allow TACH signals to go into the LM63 part.
Figure 27. LM63LM64LM96x63EVM Hardware Connection
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Board Setup and Operation
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4.1
Launching the Software
1. The LM63LM64LM96x63EVM GUI software can be run by clicking on Start | All Program | Texas
Instruments | LM63LM64LM96x63EVM. Launching the software will take you directly to the GUI where
register settings can be changed and data can be logged to a .csv file. The default GUI that launches
is the LM63. There is a pull down menu in which the user can select which part and GUI to use.
Figure 28. Part Select
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Board Setup and Operation
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2. The hexadecimal numbered tabs represent the register map associated with their respective part.
Each tab shows the register address, whether the particular address is read, write, or read/write, the
number of bits the register spans, the register name, its POR value, the register bit value in hex, and
the bit field value. The user can change the register contents by either pressing the up and down
buttons on the register bit value column or by selecting an option on the pull down menu in the bit field
value column. A change in the register bit value will automatically change the bit field value to its
corresponding value and vice versa with a change in the bit field value. The user can read back the
register data by pressing the “Read All” button the upper right hand of the GUI. This will read all the
register contents and update all the fields in the GUI.
Figure 29. Selectable Fields in GUI
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3. The “Plots” tab allows capturing and displaying the remote temperature, local temperature, and
tachometer data. By default, the plotting will not start until the “Start” button is pressed. Click on the
“Stop” button to stop the plotting. The temperature and tachometer data can be saved into an Excel
file by checking the “Log” button before pressing the start button. A prompt will pop up allowing the
user to choose the save location and file name.
Figure 30. Plots Tab
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Board Layout
5
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Board Layout
Figure 31, Figure 32, Figure 33, Figure 34, and Figure 35 show the board layout for the
LM63LM64LM96x63EVM.
Figure 31. Top Assembly Layer
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Figure 32. Top Layer Routing
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Board Layout
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Figure 33. Power Layer Routing
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Board Layout
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Figure 34. Ground Layer Routing
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Board Layout
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Figure 35. Bottom Layer Routing
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Schematic
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Schematic
1
2
3
4
C19
0.1µF
D+_LM64
U6
SMBCLK
SMBDAT
D+
ALERT/TACH
3
2
Q2
R21
R22
0
0
SCL_LM63
SDA_LM63
PWM
4
C23
2200pF
Q3
PWM_LM63
7
ALERT/TACH Select
ALERT_LM631
ALERT_LM63
2
TACH_LM63 3
TACH
A0_LM64
LM63_EXT_PWR
LM63 Te st Point
TACH_LM64
ALERT_LM64
GND
LM64
VDD
GPD5
GPD4
GPD3
GPD2
GPD1
D+
D-
GPIO5
GPIO4
GPIO3
GPIO2
GPIO1
T_CRIT
A0
PWM
SMBCLK
SMBDAT
NC
NC
NC
DAP
TACH
ALERT
GND
24
23
22
21
20
GPD5
GPD4
GPD3
GPD2
GPD1
18
19
3
2
1
GPIO5
GPIO4
GPIO3
GPIO2
GPIO1
17
16
11
10
9
25
R27
R28
1
2
GND
GND
PWR
R60
1.00k
J9
1
2
3
4
GND
R61
TACH_LM64
13k
GND
PWR
TACH
PWM
R62
10k
0 SCL_LM64
0 SDA_LM64
R63
6.34k
SCL_LM64
SDA_LM64
PWM_LM64
GND
R64
5.1k
LM64CILQ-F
GND
GND
GND
13k
+3.3V_DUT
GND
PWR
TACH
PWM
R57
10k
R39
4.02k
R58
6.34k
+3.3V_DUT
R40
4.02k
R41
1.2k
PWM_LM63
R59
5.1k
B
R42
1.2k
SCL_LM64
SDA_LM64
TACH_LM64
ALERT_LM64
PWM_LM64
TCRIT_LM64
A0_LM64
GND
R29
10k
LM64 Te st Point
1
2
3
4
5
6
7
GND
SCL
SDA
TACH
ALERT
PWM
TCRIT
A0
R30
10k
R31
10k
R32
10k
R33
10k
R34
10k
R35
10k
R36
10k
R37
10k
R38
10k
LM64 GPIO
GPIO5
GPIO4
GPIO3
GPIO2
GPIO1
1
2
3
4
5
6
7
8
9
10
GPD5
GPD4
GPD3
GPD2
GPD1
J6
+3.3V_DUT
C24
100pF
A
LM64_FAN_CONN
J5
1
2
3
4
GND
R56
TACH_LM63
B
15
14
13
GND
PWR
LM63_FAN_CONN
R55
1.00k
4
JP5
1
2
GND
12
PWM_LM64
1
2
3
GND
J4
SCL
SDA
TACH
ALERT
PWM
8
R26
10k
A0 Select
VDD
J3
TCRIT_LM64
+3.3V_DUT
GND
1
2
3
4
5
5
GND
6
D-_LM64
JP3
GND
1
SCL_LM63
SDA_LM63
6
D-
5
1
3
8
7
LM63CIMAX/NOPB
SCL_LM63
SDA_LM63
TACH_LM63
ALERT_LM63
PWM_LM63
LM64_EXT_PWR
J8
U7
JP4
2
VDD
2
D-_LM63
C22
0.1µF
LM63
3
2
4
1
C20
2200pF
JP2
1
C21
100pF
3
GND
D+_LM63
6
+3.3V_DUT
+3.3V_DUT
R23
R24
R25
4.02k 4.02k 1.2k
2
4
C18
100pF
A
5
+3.3V_DUT
+3.3V_DUT
1
3
6
GPIO5
GPIO4
GPIO3
GPIO2
GPIO1
GPD5
GPD4
GPD3
GPD2
GPD1
J7
C25
0.1µF
+3.3V_DUT
GND
C27
100pF
U8
+3.3V_DUT
C
TACH
D+
D-
TCRIT
ALERT
SDA_LM96063
SCL_LM96063
SDA_LM96063
SCL_LM96063
R43
R44
0
0
9
10
TACH_LM96063
1
TCRIT_LM96063
7
ALERT_LM96063
5
PWM_LM96063
GND
D+_LM96163
SMBDAT
SMBCLK
PWM
GND
PAD
U9
Q5
LM96063_EXT_PWR
6
GND
R65
1.00k
+3.3V_DUT
TCRIT_LM96063
SCL_LM96063
SDA_LM96063
TACH_LM96063
ALERT_LM96063
PWM_LM96063
R48
1.2k
GND
13k
R52
R53
R54
4.02k 4.02k 1.2k
4
6
GND
PWM_LM96163 5
1
2
3
4
11
GND
PWR
TACH
PWM
VDD
D+
TCRIT
SMBCLK
SMBDAT
DALERT
1 TCRIT_LM96163
10
9
R49
R50
J14
0
0
TACH
LM96163_FAN_CONN
R70
1.00k
8 TACH_LM96163
13k
DAP
R73
6.34k
TCRIT_LM96163
SCL_LM96163
SDA_LM96163
TACH_LM96163
ALERT_LM96163
PWM_LM96163
R69
5.1k
PWM_LM96163
1
2
3
4
5
6
GND
R74
5.1k
TCRIT
SCL
SDA
TACH
ALERT
PWM
2
3
4
D
GND
GND
Number: SV601006
Rev: A
Te xas Instruments and/or its licensors do not warrant the accuracy or completeness of this specification or any information contained therein. Te xas Instruments and/or its licensors do not SVN Rev: Not in version control
Drawn By: Michael Wong
warrant that this design will meet the specifications, will be suitable for your application or fit for any particular purpose, or will operate in an implementation. Te xas Instruments and/or its
Engineer: Michael Wong
licensors do not warrant that the design is production worthy. You should completely validate and test your design implementation to confirm the system functionality for your application.
1
GND
PWR
TACH
PWM
R72
10k
LM96163 Te st Point
J13
PWM_LM96063
J15
1
2
3
4
GND
R71
TACH_LM96163
LM96163CISD/NOPB
GND
GND
PWR
SDA_LM96163
7 ALERT_LM96163
GND
PWM
1
2
GND
SCL_LM96163
SCL_LM96163
SDA_LM96163
GND
R68
6.34k
TCRIT
SCL
SDA
TACH
ALERT
PWM
LM96163_EXT_PWR
LM96163
R67
10k
LM96063 Te st Point
J10
1
2
3
4
5
6
2
J12
R66
TACH_LM96063
R47
4.02k
GND
PWR
LM96063_FAN_CONN
C29
100pF
3
D-_LM96163
J11
1
2
GND
R46
4.02k
JP7
1
LM96063CISD/NOPB
R45
1.2k
R51
1.2k
2
4
VDD
8
1
3
3
4
1
3
D-_LM96063
LM96063
3
2
2
Q4
C26
100pF
2
JP6
1
D
C28
0.1µF
3
2
4
D+_LM96063
C
5
Mod. Date: 10/9/2013
Designed for: Public Release
Project Title: Temp Sensors Fan Control
Sheet Title: LM63/LM64/LM96x63 Evaluation Board
Sheet: 1 of 1
Assembly Variant:001
File: SV601006A.SchDoc
Size: B
Contact: http://www.ti.com/support
http://www.ti.com
© Tex as Instruments 2013
6
Figure 36. LM63LM64LM96x63EVM DUT Schematic
SNAU154 – October 2013
Submit Documentation Feedback
LM63, LM64, LM96x3 Evaluation Module
Copyright © 2013, Texas Instruments Incorporated
29
Schematic
www.ti.com
+3.3V
+3.3V_DUT
TP2
FB1
R8
33
2
R7
3
33k
GND
IO1
VCC
IO2
IO4
GND
IO3
R10
6
PUR
1.5k
5
S1
C8
10µF
4
C10
22µF
1
2
TPD4E004DRYR
IN
5
VBUS
90 ohm
DP
33
U2
1
1734035-2
DM
R9
2
1
2
3
4
5
1
VBUS
J2
C11
1µF
D2
1SMB5922BT3G
7.5V
OUT
EN
2
6
7
NR/FB
N/C
N/C
N/C
PAD
GND
1
3
4
C13
2.2µF
3
OUT
FAULT
ILIM
EN
GND
6
+3.3V_DUT
2
R12
10k
C12 GND
0.01µF
C14
10µF
5 R13 160k
D3
Green
GND
TPS2553DBV-1
4
GND
R14
200
GND
GND
4
3
IN
1
2
1
TPS73533DRB
GND
+3.3V_DUT_JMP
U4
U3
8
TP1
Mini USB Conn
JP1
TP3
+3.3V
5V_USB
GND
GND
VUSB
GND
EXT3.3V_EN
EXT3.3V_FAULT
GND
R11
1.2Meg
GND
C9
220pF
GND
GND
V18
C15
220pF
+3.3V
TP4
GND
1
2
SCL
SDA
A0
A1
+3.3V
GND
H5
R20
10k
H6
H2
1902C
NY PMS 440 0025 PH
1902C
NY PMS 440 0025 PH
R15
10k
3
+3.3V
C17
10µF
PCB
LOGO
PCB Number: SV601006
PCB Rev: A
SC0
SD0
INT0
SC1
SD1
INT1
SC2
SD2
INT2
17
H1
TP5
TP6
TP7
TP8
TP9
TP10
TP11
GND
GND
GND
GND
GND
GND
GND
U5
18
19
SCL
SDA
20
INT
RESET
SC3
SD3
INT3
VCC
EP
GND
6
5
4
SCL_LM96063
SDA_LM96063
9
8
7
SCL_LM63
SDA_LM63
13
12
11
SCL_LM64
SDA_LM64
16
15
14
SCL_LM96163
SDA_LM96163
R19
10k
R18
10k
R17
10k
R16
10k
GND
21
10
PCA9545ARGYR
C16
0.1µF
GND
Texas Instruments
H7
H8
H3
H4
1902C
NY PMS 440 0025 PH
1902C
NY PMS 440 0025 PH
GND
LBL1
PCB Label
Size: 0.65" x 0.20 "
ZZ1
Assembly Note
Short SH-JP1 on JP1 pin 1-2
SH-JP1
ZZ7
Assembly Note
Short SH-JP4 on JP4 pins 2-4
SH-JP6
ZZ12
Assembly Note
Short SH-JP4 on JP4 pins 1-3
SH-JP4_1_3
ZZ8
Assembly Note
Short SH-JP7 on JP7 pins 1-3
SH-JP7_1_3
ZZ3
Assembly Note
Short SH-JP4 on JP4 pins 2-4
SH-JP4
ZZ9
Assembly Note
Short SH-JP7 on JP7 pins 2-4
SH-JP7
ZZ4
Assembly Note
Short SH-JP2 on JP2 pins 1-3
SH-JP2_1_3
ZZ5
Assembly Note
Short SH-JP4 on JP4 pins 2-4
SH-JP2
ZZ10
Assembly Note
Short SH-A0_SEL on A0_SEL pins 1-2
SH-A0_SEL
ZZ11
Assembly Note
Short SH-ALERT/TACH_SEL on ALERT/TACH_SEL pins 1-2
SH-ALERT/TACH_SEL
ZZ6
Assembly Note
Short SH-JP6 on JP6 pins 1-3
SH-JP6_1_3
Texas Instruments and/or its licensors do not warrant the accuracy or completeness of this
specification or any information contained therein. Texas Instruments and/or its licensors do not
warrant that this design will meet the specifications, will be suitable for your application or fit for
any particular purpose, or will operate in an implementation. Texas Instruments and/or its
licensors do not warrant that the design is production worthy. You should completely validate
and test your design implementation to confirm the system functionality for your application.
Designed for: Public Release
Project: Temp Sensors Fan Control
. Date:
Sheet:
870PRJ_BasePN Rev: A
C
Assembly Variant:001
File:
Contact: http://www.ti.com/support
of
http://www.ti.com
© Texas Instruments 2013
Figure 37. LM63LM64LM96x63EVM Power Schematic
30
LM63, LM64, LM96x3 Evaluation Module
SNAU154 – October 2013
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Schematic
www.ti.com
1
2
3
4
5
6
A
A
2
C1
30pF
GND
C2
24MHz
14
12
10
8
6
4
2
1
Y1
30pF
+3.3V
J1
DNP
R1
33k
13
11
9
7
5
3
1
V18
VUSB
VBUS
C3
2200pF
GND
DM
PUR
GND
64
63
62
61
67
68
65
66
71
69
70
73
74
72
77
75
78
79
80
76
DP
VSSU
PUR
VBUS
PU.0/DP
PU.1/DM
V18
VUSB
AVSS2
P5.2/XT2IN
PJ.0/TDO
P5.3/XT2OUT
TEST/SBWTCK
PJ.2/TMS
PJ.1/TDI/TCLK
PJ.3/TCK
RST/NMI/SBWTDIO
P6.0/CB0/A0
P6.1/CB1/A1
P6.2/CB2/A2
GND
P6.3/CB3/A3
U1
B
B
6
7
8
D1
Green
9
10
+3.3V
11
R2
200
12
3
13
14
Q1
1BSS138W-7-F
15
50V
2
16
17
18
GND
19
C5
0.1µF
20
P7.6/TB0.4
P6.6/CB6/A6
P7.5/TB0.3
P6.7/CB7/A7
P7.4/TB0.2
P7.0/CB8/A12
P5.7/TB0.1
P7.1/CB9/A13
P5.6/TB0.0
P7.2/CB10/A14
P4.7/PM_NONE
P7.3/CB11/A15
P4.6/PM_NONE
P5.0/A8/VREF+/VEREF+
P4.5/PM_UCA1RXD/PM_UCA1SOMI
MSP430F5529IPNR
P5.1/A9/VREF-/VEREF-
P4.4/PM_UCA1TXD/PM_UCA1SIMO
AVCC1
DVCC2
P5.4/XIN
DVSS2
P5.5/XOUT
P4.3/PM_UCB1CLK/PM_UCA1STE
AVSS1
P4.2/PM_UCB1SOMI/PM_UCB1SCL
P8.0
P4.1/PM_UCB1SIMO/PM_UCB1SDA
P8.1
P4.0/PM_UCB1STE/PM_UCA1CLK
P8.2
P3.7/TB0OUTH/SVMOUT
DVCC1
P3.6/TB0.6
DVSS1
P3.5/TB0.5
VCORE
P3.4/UCA0RXD/UCA0SOMI
P2.6/RTCCLK/DMAE0
P2.5/TA2.2
P2.4/TA2.1
P2.3/TA2.0
P2.2/TA2CLK/SMCLK
P2.1/TA1.2
P2.0/TA1.1
P1.7/TA1.0
P1.6/TA1CLK/CBOUT
P1.5/TA0.4
P1.4/TA0.3
P1.3/TA0.2
C7
4.7µF
P1.2/TA0.1
C6
0.1µF
P1.1/TA0.0
GND
P1.0/TA0CLK/ACLK
C
60
EXT3.3V_FAULT
59
EXT3.3V_EN
58
57
56
55
54
53
52
+3.3V
51
50
49
C4
0.1µF
48
47
46
GND
+3.3V
45
44
R5
4.02k
43
42
R3
0
41
R4
0
R6
4.02k
SCL
SDA
C
P3.3/UCA0TXD/UCA0SIMO
5
P7.7/TB0CLK/MCLK
P6.5/CB5/A5
P3.2/UCB0CLK/UCA0STE
4
+3.3V
P6.4/CB4/A4
P3.1/UCB0SOMI/UCB0SCL
3
P3.0/UCB0SIMO/UCB0SDA
2
P2.7/UCB0STE/UCA0CLK
1
40
38
39
37
34
33
36
35
30
32
31
29
28
27
26
25
24
21
22
23
GND
D
D
Texas Instruments and/or its licensors do not warrant the accuracy or completeness of this
specification or any information contained therein. Texas Instruments and/or its licensors do not
warrant that this design will meet the specifications, will be suitable for your application or fit for
any particular purpose, or will operate in an implementation. Texas Instruments and/or its
licensors do not warrant that the design is production worthy. You should completely validate
and test your design implementation to confirm the system functionality for your application.
1
2
3
4
5
Designed for: Public Release
Mod. Date: 10/10/2013
Project: Temp Sensors Fan Control
Sheet: * of *
Sheet Title: MSP430
Size: C
Schematic: 870PRJ_BasePN Rev: A
Assembly Variant:001
File: MSP430F29IPNA.SchDoc
Contact: http://www.ti.com/support
http://www.ti.com
© Texas Instruments 2013
6
Figure 38. LM63LM64LM96x63EVM MSP430 Schematic
SNAU154 – October 2013
Submit Documentation Feedback
LM63, LM64, LM96x3 Evaluation Module
Copyright © 2013, Texas Instruments Incorporated
31
Bill of Materials
7
www.ti.com
Bill of Materials
Table 2. LM63LM64LM96x63EVM
Bill of Materials
Designator
Description
Manufacturer
Part Number
Quantity
EVM
LM63LM64LM96x63EVM
Texas
Instruments
SV601006
1
C1, C2
CAP, CERM, 30 pF, 100V, ±5%,
C0G/NP0, 0603
MuRata
GRM1885C2A300JA01D
2
C3
CAP, CERM, 2200 pF, 50 V, ±10%,
X7R, 0603
Kemet
C0603X222K5RACTU
1
C4, C5, C6
CAP, CERM, 0.1 uF, 16V, ±5%,
X7R, 0603
AVX
0603YC104JAT2A
3
C7
CAP, CERM, 4.7 uF, 10V, ±10%,
X7R, 0805
Taiyo Yuden
LMK212B7475KG-T
1
C8, C14
CAP, CERM, 10 uF, 16 V, ±20%,
X5R, 0805
AVX
0805YD106MAT2A
2
C9, C15
CAP, CERM, 220 pF, 50 V, ±1%,
C0G/NP0, 0603
AVX
06035A221FAT2A
2
C10
CAP ALUM 22 uF 10 V 20% SMD
Panasonic ECG
EEE-1AA220WR
1
C11
CAP, CERM, 1 uF, 16 V, ±10%,
X7R, 0805
Taiyo Yuden
EMK212B7105KG-T
1
C12
CAP, CERM, 0.01 uF, 50 V, ±10%,
X7R, 0603
TDK
C1608X7R1H103K
1
C13
CAP, CERM, 2.2 uF, 16 V, ±10%,
X5R, 0805
AVX
0805YD225KAT2A
1
C16, C19, C22, C25, C28
CAP, CERM, 0.1 uF, 25 V, ±10%,
X7R, 0603
AVX
06033C104KAT2A
5
C17
CAP, TA, 10 uF, 10V, ±20%, 3.4 Ω,
SMD
Vishay-Sprague
293D106X0010A2TE3
1
C18, C21, C24, C26, C27,
C29
CAP, CERM, 100 pF, 25 V, ±10%,
X7R, 0603
AVX
06033C101KAT2A
6
C20, C23
CAP, CERM, 2200pF, 100 V, ±5%,
X7R, 0603
AVX
06031C222JAT2A
2
D1, D3
LED, Green, SMD
Lite-On
LTST-C171GKT
2
D2
Diode, Zener, 7.5 V, 550 mW, SMB
ON
Semiconductor
1SMB5922BT3G
1
FB1
1.5A Ferrite Bead, 90 Ω @ 100MHz,
SMD
Steward
MI1206K900R-10
1
H1, H2, H3, H4
Machine Screw, Round, #4-40 x
1/4, Nylon, Philips panhead
NY PMS 440 0025 PH
4
H5, H6, H7, H8
Standoff, Hex, 0.5"L #4-40 Nylon
Keystone
1902C
4
J2
Conn Rcpt Mini USB2.0 Type B
5POS SMD
TE Connectivity
1734035-2
1
J3
Header, TH, 100mil, 5x1, Gold
plated, 230 mil above insulator
Samtec
TSW-105-07-G-S
1
J4, J8, J11, J14, JP1
Header, TH, 100mil, 2x1, Gold
plated, 230 mil above insulator
Samtec
TSW-102-07-G-S
5
J5, J9, J12, J15
Header, TH, 100mil, 4x1, Gold
plated, 230 mil above insulator
Samtec
TSW-104-07-G-S
4
J6
Header, TH, 100mil, 7x1, Gold
plated, 230 mil above insulator
Samtec
TSW-107-07-G-S
1
J7
Header, TH, 100mil, 10x1, Gold
plated, 230 mil above insulator
Samtec
TSW-110-07-G-S
1
J10, J13
Header, TH, 100mil, 6x1, Gold
plated, 230 mil above insulator
Samtec
TSW-106-07-G-S
2
32
LM63, LM64, LM96x3 Evaluation Module
Copyright © 2013, Texas Instruments Incorporated
SNAU154 – October 2013
Submit Documentation Feedback
Bill of Materials
www.ti.com
Table 2. LM63LM64LM96x63EVM
Bill of Materials (continued)
Designator
Description
Manufacturer
Part Number
Quantity
JP2, JP4, JP6, JP7
Header, TH, 100mil, 2x2, Gold
plated, 230 mil above insulator
Samtec
TSW-102-07-G-D
4
JP3, JP5
Header, TH, 100mil, 3x1, Gold
plated, 230 mil above insulator
Samtec
TSW-103-07-G-S
2
LBL1
Thermal Transfer Printable Labels,
0.650" W x 0.200" H - 10,000 per
roll
Brady
THT-14-423-10
1
Q1
MOSFET, N-CH, 50V, 0.2 A, SOT323
Diodes Inc.
BSS138W-7-F
1
Q2, Q3, Q4, Q5
Transistor, NPN, 40V, 0.2 A, SOT23
Fairchild
Semiconductor
MMBT3904
4
R1, R7
RES, 33k Ω, 5%, 0.063W, 0402
Vishay-Dale
CRCW040233K0JNED
2
R2
RES, 200 Ω, 1%, 0. 1W, 0603
Vishay-Dale
CRCW0603200RFKEA
1
R3, R4, R21, R22, R27,
R28, R43, R44, R49, R50
RES, 0 Ω, 5%, 0.1 W, 0603
Vishay-Dale
CRCW06030000Z0EA
10
R5, R6
RES, 4.02k Ω, 1%, 0.06 3W, 0402
Vishay-Dale
CRCW04024K02FKED
2
R8, R9
RES, 33 Ω, 5%, 0.063 W, 0402
Vishay-Dale
CRCW040233R0JNED
2
R10
RES, 1.5k Ω, 5%, 0.063 W, 0402
Vishay-Dale
CRCW04021K50JNED
1
R11
RES, 1.2 Meg Ω, 5%, 0.1 W, 0603
Vishay-Dale
CRCW06031M20JNEA
1
R12
RES, 10k Ω, 5%, 0.063 W, 0402
Vishay-Dale
CRCW06031M20JNEA
1
R13
RES, 160k Ω, 5%, 0.063 W, 0402
Vishay-Dale
CRCW0402160KJNED
1
R14
RES, 200 Ω, 5%, 0.063 W, 0402
Vishay-Dale
CRCW0402200RJNED
1
RES, 10k Ω, 5%, 0.1 W, 0603
Vishay-Dale
CRCW060310K0JNEA
21
R23, R24, R39, R40, R46,
R47, R52, R53
RES, 4.02k Ω, 1%, 0.1 W, 0603
Vishay-Dale
CRCW06034K02FKEA
8
R25, R41, R42, R45, R48,
R51, R54
RES, 1.2k Ω, 5%, 0.1W, 0603
Vishay-Dale
CRCW06031K20JNEA
7
R55, R60, R65, R70
RES, 1.00k Ω, 1%, 0.25 W, 0805
Panasonic
ERJ-P06F1001V
4
R56, R61, R66, R71
RES, 13k Ω, 5%, 0.1 W, 0603
Vishay-Dale
CRCW060313K0JNEA
4
R58, R63, R68, R73
RES, 6.34k Ω, 1%, 0.1 W, 0603
Vishay-Dale
CRCW06036K34FKEA
4
R59, R64, R69, R74
RES, 5.1k Ω, 5%, 0.1 W, 0603
Vishay-Dale
CRCW06035K10JNEA
4
S1
Switch, Tactile, SPST-NO, SMT
Panasonic
EVQ-PSD02K
1
SH-A0_SEL,
SH-ALERT/TACH_SEL,
SH-JP1, SH-JP2,
SH-JP2_1_3,
SH-JP4, SH-JP4_1_3,
SH-JP6, SH-JP6_1_3,
SH-JP7, SH-JP7_1_3
Shunt, 2mm, Gold plated, Black
Samtec
2SN-BK-G
11
R15,
R20,
R32,
R37,
R16,
R26,
R33,
R38,
R17,
R29,
R34,
R57,
R72
R18,
R30,
R35,
R62,
R19,
R31,
R36,
R67,
TP1, TP2, TP3
Test Point, Multipurpose, Red, TH
Keystone
5010
3
TP4, TP5, TP6, TP7, TP8,
TP9, TP10, TP11
Test Point, Multipurpose, Black, TH
Keystone
5011
8
U1
IC MCU 16BIT 128K FLASH
80LQFP
Texas
Instruments
MSP430F5529IPNR
1
U2
IC, 4-Chan ESD-Protection Array
Texas
Instruments
TPD4E004DRYR
1
U3
500mA, Low Quiescent Current,
Ultra-Low Noise, High PSRR LowDropout Linear Regulator,
DRB0008A
Texas
Instruments
TPS73533DRB
1
SNAU154 – October 2013
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LM63, LM64, LM96x3 Evaluation Module
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33
Bill of Materials
www.ti.com
Table 2. LM63LM64LM96x63EVM
Bill of Materials (continued)
34
Designator
Description
Manufacturer
Part Number
Quantity
U4
PRECISION ADJUSTABLE
CURRENT-LIMITED POWERDISTRIBUTION SWITCHES,
DBV0006A
Texas
Instruments
TPS2553DBV-1
1
U5
4-Channel I2C and SMBus
Multiplexer with Interrupt Logic and
Reset Function, 2.3 to 5.5 V, -40 to
85 °C, 20-pin VQFN (RGY), Green
(RoHS & no Sb/Br)
Texas
Instruments
PCA9545ARGYR
1
U6
±1ºC/±3ºC Accurate Remote Diode
Digital Temperature Sensor with
Integrated Fan Control, 8-pin
Narrow SOIC, Pb-Free
Texas
Instruments
LM63CIMAX/NOPB
1
U7
±1ºC Remote Diode Temperature
Sensor with PWM Fan Control and
5 GPIO's, 25-pin LLP
Texas
Instruments
LM64CILQ-F
1
U8
LM96063 Remote Diode Digital
Temperature Sensor with Integrated
Fan Control, DSC0010A
Texas
Instruments
LM96063CISD/NOPB
1
U9
Remote Diode Digital Temperature
Sensor with Integrated Fan Control
and TruTherm BJT Transistor Beta
Compensation Technology, 10-pin
LLP, Pb-Free
Texas
Instruments
LM96163CISD/NOPB
1
Y1
Crystal, 24.000MHz, 20 pF, SMD
ECS Inc.
ECS-240-20-5PX-TR
1
ZZ1, ZZ12
Short SH-JP1 on JP1 pin 1-2, Short
SH-JP4 on JP4 pins 1-3
LM63, LM64, LM96x3 Evaluation Module
Copyright © 2013, Texas Instruments Incorporated
2
SNAU154 – October 2013
Submit Documentation Feedback
EVALUATION BOARD/KIT/MODULE (EVM) ADDITIONAL TERMS
Texas Instruments (TI) provides the enclosed Evaluation Board/Kit/Module (EVM) under the following conditions:
The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claims
arising from the handling or use of the goods.
Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned within 30 days from
the date of delivery for a full refund. THE FOREGOING LIMITED WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO
BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF
MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH
ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL
DAMAGES.
Please read the User's Guide and, specifically, the Warnings and Restrictions notice in the User's Guide prior to handling the product. This
notice contains important safety information about temperatures and voltages. For additional information on TI's environmental and/or safety
programs, please visit www.ti.com/esh or contact TI.
No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, or
combination in which such TI products or services might be or are used. TI currently deals with a variety of customers for products, and
therefore our arrangement with the user is not exclusive. TI assumes no liability for applications assistance, customer product design,
software performance, or infringement of patents or services described herein.
REGULATORY COMPLIANCE INFORMATION
As noted in the EVM User’s Guide and/or EVM itself, this EVM and/or accompanying hardware may or may not be subject to the Federal
Communications Commission (FCC) and Industry Canada (IC) rules.
For EVMs not subject to the above rules, this evaluation board/kit/module is intended for use for ENGINEERING DEVELOPMENT,
DEMONSTRATION OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end product fit for general consumer
use. It generates, uses, and can radiate radio frequency energy and has not been tested for compliance with the limits of computing
devices pursuant to part 15 of FCC or ICES-003 rules, which are designed to provide reasonable protection against radio frequency
interference. Operation of the equipment may cause interference with radio communications, in which case the user at his own expense will
be required to take whatever measures may be required to correct this interference.
General Statement for EVMs including a radio
User Power/Frequency Use Obligations: This radio is intended for development/professional use only in legally allocated frequency and
power limits. Any use of radio frequencies and/or power availability of this EVM and its development application(s) must comply with local
laws governing radio spectrum allocation and power limits for this evaluation module. It is the user’s sole responsibility to only operate this
radio in legally acceptable frequency space and within legally mandated power limitations. Any exceptions to this are strictly prohibited and
unauthorized by Texas Instruments unless user has obtained appropriate experimental/development licenses from local regulatory
authorities, which is responsibility of user including its acceptable authorization.
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant
Caution
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause
harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the
equipment.
FCC Interference Statement for Class A EVM devices
This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial
environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the
instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to
cause harmful interference in which case the user will be required to correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment
generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause
harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If
this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and
on, the user is encouraged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
For EVMs annotated as IC – INDUSTRY CANADA Compliant
This Class A or B digital apparatus complies with Canadian ICES-003.
Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the
equipment.
Concerning EVMs including radio transmitters
This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this
device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired
operation of the device.
Concerning EVMs including detachable antennas
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain
approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should
be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication.
This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum
permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain
greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.
Cet appareil numérique de la classe A ou B est conforme à la norme NMB-003 du Canada.
Les changements ou les modifications pas expressément approuvés par la partie responsable de la conformité ont pu vider l’autorité de
l'utilisateur pour actionner l'équipement.
Concernant les EVMs avec appareils radio
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est
autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout
brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain
maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à
l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente
(p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante.
Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel
d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans
cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur.
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【Important Notice for Users of EVMs for RF Products in Japan】
】
This development kit is NOT certified as Confirming to Technical Regulations of Radio Law of Japan
If you use this product in Japan, you are required by Radio Law of Japan to follow the instructions below with respect to this product:
1.
2.
3.
Use this product in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and
Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of
Japan,
Use this product only after you obtained the license of Test Radio Station as provided in Radio Law of Japan with respect to this
product, or
Use of this product only after you obtained the Technical Regulations Conformity Certification as provided in Radio Law of Japan with
respect to this product. Also, please do not transfer this product, unless you give the same notice above to the transferee. Please note
that if you could not follow the instructions above, you will be subject to penalties of Radio Law of Japan.
Texas Instruments Japan Limited
(address) 24-1, Nishi-Shinjuku 6 chome, Shinjuku-ku, Tokyo, Japan
http://www.tij.co.jp
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】
本開発キットは技術基準適合証明を受けておりません。
本製品のご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。
日本テキサス・インスツルメンツ株式会社
東京都新宿区西新宿6丁目24番1号
西新宿三井ビル
http://www.tij.co.jp
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EVALUATION BOARD/KIT/MODULE (EVM)
WARNINGS, RESTRICTIONS AND DISCLAIMERS
For Feasibility Evaluation Only, in Laboratory/Development Environments. Unless otherwise indicated, this EVM is not a finished
electrical equipment and not intended for consumer use. It is intended solely for use for preliminary feasibility evaluation in
laboratory/development environments by technically qualified electronics experts who are familiar with the dangers and application risks
associated with handling electrical mechanical components, systems and subsystems. It should not be used as all or part of a finished end
product.
Your Sole Responsibility and Risk. You acknowledge, represent and agree that:
1.
2.
3.
4.
You have unique knowledge concerning Federal, State and local regulatory requirements (including but not limited to Food and Drug
Administration regulations, if applicable) which relate to your products and which relate to your use (and/or that of your employees,
affiliates, contractors or designees) of the EVM for evaluation, testing and other purposes.
You have full and exclusive responsibility to assure the safety and compliance of your products with all such laws and other applicable
regulatory requirements, and also to assure the safety of any activities to be conducted by you and/or your employees, affiliates,
contractors or designees, using the EVM. Further, you are responsible to assure that any interfaces (electronic and/or mechanical)
between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to
minimize the risk of electrical shock hazard.
Since the EVM is not a completed product, it may not meet all applicable regulatory and safety compliance standards (such as UL,
CSA, VDE, CE, RoHS and WEEE) which may normally be associated with similar items. You assume full responsibility to determine
and/or assure compliance with any such standards and related certifications as may be applicable. You will employ reasonable
safeguards to ensure that your use of the EVM will not result in any property damage, injury or death, even if the EVM should fail to
perform as described or expected.
You will take care of proper disposal and recycling of the EVM’s electronic components and packing materials.
Certain Instructions. It is important to operate this EVM within TI’s recommended specifications and environmental considerations per the
user guidelines. Exceeding the specified EVM ratings (including but not limited to input and output voltage, current, power, and
environmental ranges) may cause property damage, personal injury or death. If there are questions concerning these ratings please contact
a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the
specified output range may result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or
interface electronics. Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the
load specification, please contact a TI field representative. During normal operation, some circuit components may have case temperatures
greater than 60°C as long as the input and output are maintained at a normal ambient operating temperature. These components include
but are not limited to linear regulators, switching transistors, pass transistors, and current sense resistors which can be identified using the
EVM schematic located in the EVM User's Guide. When placing measurement probes near these devices during normal operation, please
be aware that these devices may be very warm to the touch. As with all electronic evaluation tools, only qualified personnel knowledgeable
in electronic measurement and diagnostics normally found in development environments should use these EVMs.
Agreement to Defend, Indemnify and Hold Harmless. You agree to defend, indemnify and hold TI, its licensors and their representatives
harmless from and against any and all claims, damages, losses, expenses, costs and liabilities (collectively, "Claims") arising out of or in
connection with any use of the EVM that is not in accordance with the terms of the agreement. This obligation shall apply whether Claims
arise under law of tort or contract or any other legal theory, and even if the EVM fails to perform as described or expected.
Safety-Critical or Life-Critical Applications. If you intend to evaluate the components for possible use in safety critical applications (such
as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, such as devices
which are classified as FDA Class III or similar classification, then you must specifically notify TI of such intent and enter into a separate
Assurance and Indemnity Agreement.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
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www.ti.com/audio
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DLP® Products
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Copyright © 2013, Texas Instruments Incorporated
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