Texas Instruments | CC2650MODA SimpleLink™ Bluetooth® low energy Wireless MCU Module (Rev. D) | Datasheet | Texas Instruments CC2650MODA SimpleLink™ Bluetooth® low energy Wireless MCU Module (Rev. D) Datasheet

Texas Instruments CC2650MODA SimpleLink™ Bluetooth® low energy Wireless MCU Module (Rev. D) Datasheet
Product
Folder
Order
Now
Technical
Documents
Tools &
Software
Support &
Community
Reference
Design
CC2650MODA
SWRS187D – AUGUST 2016 – REVISED JULY 2019
CC2650MODA SimpleLink™ Bluetooth® low energy Wireless MCU Module
1 Device Overview
1.1
Features
1
• Microcontroller
– Powerful ARM® Cortex®-M3
– EEMBC CoreMark® Score: 142
– Up to 48-MHz Clock Speed
– 128KB of In-System Programmable Flash
– 8KB of SRAM for Cache
– 20KB of Ultra-Low-Leakage SRAM
– 2-Pin cJTAG and JTAG Debugging
– Supports Over-The-Air (OTA) Upgrade
• Ultra-Low-Power Sensor Controller
– Can Run Autonomous From the Rest of the
System
– 16-Bit Architecture
– 2KB of Ultra-Low-Leakage SRAM for
Code and Data
• Efficient Code Size Architecture, Placing Drivers,
Bluetooth® low energy Controller, IEEE® 802.15.4
Medium Access Control (MAC), and Bootloader in
ROM
• Integrated Antenna
• Peripherals
– All Digital Peripheral Pins Can Be Routed to
Any GPIO
– Four General-Purpose Timer Modules
(8 × 16-Bit or 4 × 32-Bit Timer, PWM Each)
– 12-Bit ADC, 200-ksamples/s, 8-Channel
Analog MUX
– Continuous Time Comparator
– Ultra-Low-Power Analog Comparator
– Programmable Current Source
– UART
– 2 × SSI (SPI, MICROWIRE, TI)
– I2C
– I2S
– Real-Time Clock (RTC)
– AES-128 Security Module
– True Random Number Generator (TRNG)
– 15 GPIOs
– Support for Eight Capacitive Sensing Buttons
– Integrated Temperature Sensor
• External System
– On-Chip Internal DC-DC Converter
– No External Components Needed, Only Supply
Voltage
• Low Power
– Wide Supply Voltage Range
– Operation from 1.8 to 3.8 V
– Active-Mode RX: 6.2 mA
– Active-Mode TX at 0 dBm: 6.8 mA
– Active-Mode TX at +5 dBm: 9.4 mA
– Active-Mode MCU: 61 µA/MHz
– Active-Mode MCU: 48.5 CoreMark/mA
– Active-Mode Sensor Controller:
0.4 mA + 8.2 µA/MHz
– Standby: 1 µA (RTC Running and RAM/CPU
Retention)
– Shutdown: 100 nA (Wake Up on External
Events)
• RF Section
– 2.4-GHz RF Transceiver Compatible With
Bluetooth low energy (BLE) 5.1 Specification
and IEEE 802.15.4 PHY and MAC
– CC2650MODA RF-PHY Qualified (QDID:
88415)
– Excellent Receiver Sensitivity (–97 dBm for
Bluetooth low energy and –100 dBm for
802.15.4), Selectivity, and Blocking
Performance
– Programmable Output Power up to +5 dBm
– Pre-certified for Compliance With Worldwide
Radio Frequency Regulations
– ETSI RED (Europe)
– IC (Canada)
– FCC (USA)
– ARIB STD-T66 (Japan)
– JATE (Japan)
• Tools and Development Environment
– Full-Feature and Low-Cost Development Kits
– Multiple Reference Designs for Different RF
Configurations
– Packet Sniffer PC Software
– Sensor Controller Studio
– SmartRF™ Studio
– SmartRF Flash Programmer 2
– IAR Embedded Workbench® for ARM
– Code Composer Studio™
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
CC2650MODA
SWRS187D – AUGUST 2016 – REVISED JULY 2019
1.2
•
•
•
•
•
Applications
Building Automation
Medical and Health
Appliances
Industrial
Consumer Electronics
1.3
www.ti.com
•
•
•
•
Proximity Tags
Alarm and Security
Remote Controls
Wireless Sensor Networks
Description
The SimpleLink™ CC2650MODA device is a wireless microcontroller (MCU) module that targets
Bluetooth® low energy applications. The CC2650MODA device can also run ZigBee® and 6LoWPAN and
ZigBee RF4CE™ remote control applications.
The module is based on the SimpleLink CC2650 wireless MCU, a member of the CC26xx family of costeffective, ultra-low-power, 2.4-GHz RF devices. Very-low active RF and MCU current and low-power mode
current consumption provide excellent battery lifetime and allow for operation on small coin-cell batteries
and in energy-harvesting applications.
The CC2650MODA module contains a 32-bit ARM Cortex-M3 processor that runs at 48 MHz as the main
processor and a rich peripheral feature set that includes a unique ultra-low-power sensor controller. This
sensor controller is good for interfacing with external sensors or for collecting analog and digital data
autonomously while the rest of the system is in sleep mode. Thus, the CC2650MODA device is good for
applications within a wide range of products including industrial, consumer electronics, and medical
devices.
The CC2650MODA module is pre-certified for operation under the regulations of the FCC, IC, ETSI, and
ARIB. These certifications save significant cost and effort for customers when integrating the module into
their products.
The Bluetooth low energy controller and the IEEE 802.15.4 MAC are embedded in the ROM and are partly
running on a separate ARM® Cortex®-M0 processor. This architecture improves overall system
performance and power consumption and makes more flash memory available.
The Bluetooth low energy software stack (BLE-Stack) and the ZigBee software stack ( Z-Stack™) are
available free of charge.
Device Information (1)
PART NUMBER
CC2650MODAMOH
(1)
2
PACKAGE
BODY SIZE
MOH (Module)
16.90 mm × 11.00 mm
For more information, see Section 10.
Device Overview
Copyright © 2016–2019, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2650MODA
CC2650MODA
www.ti.com
1.4
SWRS187D – AUGUST 2016 – REVISED JULY 2019
Functional Block Diagram
Figure 1-1 is a block diagram for the CC2650MODA device.
SimpleLink CC2650MODA Wireless MCU Module
32.768-kHz
Crystal
Oscillator
24-MHz Crystal
Oscillator
RF Balun
cJTAG
RF core
ROM
Main CPU
ADC
ADC
128-KB
Flash
ARM
Cortex-M3
Digital PLL
DSP Modem
8-KB
Cache
20-KB
SRAM
ROM
Sensor Controller
General Peripherals / Modules
I2C
4× 32-bit Timers
UART
2× SSI (SPI, µWire, TI)
4-KB
SRAM
ARM
Cortex-M0
Sensor Controller Engine
12-bit ADC, 200 ks/s
I2S
Watchdog Timer
2× Analog Comparators
15 GPIOs
TRNG
SPI / I2C Digital Sensor IF
AES
Temp. / Batt. Monitor
Constant Current Source
32 ch. µDMA
RTC
Time-to-Digital Converter
2-KB SRAM
DC-DC Converter
Copyright © 2017, Texas Instruments Incorporated
Figure 1-1. CC2650MODA Block Diagram
Device Overview
Copyright © 2016–2019, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2650MODA
3
CC2650MODA
SWRS187D – AUGUST 2016 – REVISED JULY 2019
www.ti.com
Table of Contents
Device Overview ......................................... 1
6.2
Functional Block Diagram ........................... 24
1.1
Features .............................................. 1
6.3
Main CPU ........................................... 25
1.2
Applications ........................................... 2
6.4
RF Core ............................................. 25
1.3
Description ............................................ 2
6.5
Sensor Controller
1.4
Functional Block Diagram ............................ 3
6.6
Memory .............................................. 27
2
3
Revision History ......................................... 5
Device Comparison ..................................... 6
6.7
Debug
6.8
Power Management ................................. 28
4
Terminal Configuration and Functions .............. 7
1
Related Products ..................................... 6
3.1
5
4.1
Module Pin Diagram .................................. 7
4.2
Pin Functions ......................................... 8
............................................ 9
Absolute Maximum Ratings .......................... 9
ESD Ratings .......................................... 9
Recommended Operating Conditions ................ 9
Power Consumption Summary...................... 10
General Characteristics ............................. 10
Antenna ............................................. 11
1-Mbps GFSK (Bluetooth low energy) – RX ........ 11
1-Mbps GFSK (Bluetooth low energy) – TX ........ 12
Specifications
5.1
5.2
5.3
5.4
5.5
5.6
5.7
5.8
5.9
5.10
5.11
5.12
5.13
5.14
5.15
5.16
5.17
5.18
5.19
5.20
5.21
5.22
6
4
8
IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) –
RX ................................................... 12
IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) –
TX ................................................... 13
.............
32.768-kHz Crystal Oscillator (XOSC_LF) ..........
48-MHz RC Oscillator (RCOSC_HF) ...............
32-kHz RC Oscillator (RCOSC_LF).................
ADC Characteristics.................................
Temperature Sensor ................................
Battery Monitor ......................................
Continuous Time Comparator .......................
Low-Power Clocked Comparator ...................
Programmable Current Source .....................
DC Characteristics ..................................
24-MHz Crystal Oscillator (XOSC_HF)
13
13
13
13
14
15
15
15
15
16
16
Thermal Resistance Characteristics for MOH
Package ............................................. 17
...............................
5.24 Switching Characteristics ...........................
5.25 Typical Characteristics ..............................
Detailed Description ...................................
6.1
Overview ............................................
5.23
7
Timing Requirements
17
17
20
24
24
9
...................................
...............................................
......................................
..................
6.11 System Architecture .................................
6.12 Certification ..........................................
6.13 End Product Labeling ...............................
6.14 Manual Information to the End User ................
6.15 Module Marking .....................................
Application, Implementation, and Layout .........
7.1
Application Information ..............................
7.2
Layout ...............................................
26
27
6.9
Clock Systems
29
6.10
General Peripherals and Modules
29
30
30
32
32
33
34
34
35
Environmental Requirements and
Specifications ........................................... 36
8.1
PCB Bending ........................................ 36
8.2
Handling Environment
8.3
Storage Condition ................................... 36
8.4
Baking Conditions ................................... 36
8.5
Soldering and Reflow Condition
..............................
....................
36
37
Device and Documentation Support ............... 38
9.1
Device Nomenclature ............................... 38
9.2
Tools and Software
9.3
Documentation Support ............................. 40
9.4
Texas Instruments Low-Power RF Website
9.5
Low-Power RF eNewsletter ......................... 40
9.6
Community Resources .............................. 41
9.7
Additional Information ............................... 41
9.8
Trademarks.......................................... 41
.................................
........
39
40
9.9
Electrostatic Discharge Caution ..................... 42
9.10
Export Control Notice
9.11
Glossary ............................................. 42
...............................
42
10 Mechanical, Packaging, and Orderable
Information .............................................. 42
..............................
..................
PACKAGE MATERIALS INFORMATION ...........
10.1
Packaging Information
42
10.2
PACKAGE OPTION ADDENDUM
43
10.3
Table of Contents
44
Copyright © 2016–2019, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2650MODA
CC2650MODA
www.ti.com
SWRS187D – AUGUST 2016 – REVISED JULY 2019
2 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from July 1, 2017 to July 31, 2019
•
•
Page
Added Module Marking section. .................................................................................................. 33
Added Environmental Requirements and Specifications section. ............................................................ 36
Revision History
Copyright © 2016–2019, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2650MODA
5
CC2650MODA
SWRS187D – AUGUST 2016 – REVISED JULY 2019
www.ti.com
3 Device Comparison
Table 3-1. Device Family Overview
DEVICE
CC2650MODAMOH
(1)
3.1
PHY SUPPORT
Multiprotocol
(1)
FLASH (KB)
RAM (KB)
GPIO
PACKAGE
128
20
15
MOH
The CC2650 device supports all PHYs and can be reflashed to run all the supported standards.
Related Products
TI's Wireless Connectivity The wireless connectivity portfolio offers a wide selection of low-power RF
solutions suitable for a broad range of applications. The offerings range from fully
customized solutions to turn key offerings with pre-certified hardware and software
(protocol).
TI's SimpleLink™ Sub-1 GHz Wireless MCUs Long-range, low-power wireless connectivity solutions
are offered in a wide range of Sub-1 GHz ISM bands.
Companion Products Review products that are frequently purchased or used in conjunction with this
product.
SimpleLink™ CC2650 Wireless MCU LaunchPad™ Development Kit
The CC2650 LaunchPad™
development kit brings easy Bluetooth® low energy connectivity to the LaunchPad kit
ecosystem with the SimpleLink ultra-low power CC26xx family of devices. This LaunchPad
kit also supports development for multi-protocol support for the SimpleLink multi-standard
CC2650 wireless MCU and the rest of CC26xx family of products: CC2630 wireless MCU for
ZigBee®/6LoWPAN and CC2640 wireless MCU for Bluetooth low energy.
Reference Designs for CC2650MODA TI Designs Reference Design Library is a robust reference design
library spanning analog, embedded processor and connectivity. Created by TI experts to
help you jump-start your system design, all TI Designs include schematic or block diagrams,
BOMs, and design files to speed your time to market. Search and download designs at
ti.com/tidesigns.
6
Device Comparison
Copyright © 2016–2019, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2650MODA
CC2650MODA
www.ti.com
SWRS187D – AUGUST 2016 – REVISED JULY 2019
4 Terminal Configuration and Functions
Section 4.1 shows pin assignments for the CC2650MODA device.
4.1
Module Pin Diagram
Antenna
GND
1
25 GND
NC
2
24 NC
GND
3
23 VDD
DIO 0
4
22 VDD
DIO 1
5
DIO 2
6
DIO 3
7
DIO 4
8
21 DIO 14
G1
G2
G3
G4
20 DIO 13
19 DIO 12
18 DIO 11
(Exposed GND Pads)
17 DIO 10
JTAG_TMS 9
13
14
15
16
nRESET
DIO 7
DIO 8
DIO 9
(2)
12
DIO 5/JTAG_TDO
JTAG_TCK
(1)
11
DIO 6/JTAG_TDI
10
The following I/O pins marked in bold in the pinout have high-drive capabilities:
•
DIO 2
•
DIO 3
•
DIO 4
•
JTAG_TMS
•
DIO 5/JTAG_TDO
•
DIO 6/JTAG_TDI
The following I/O pins marked in italics in the pinout have analog capabilities:
•
DIO 7
•
DIO 8
•
DIO 9
•
DIO 10
•
DIO 11
•
DIO 12
•
DIO 13
•
DIO 14
Figure 4-1. CC2650MODA MOH Package
(16.9-mm × 11-mm) Module Pinout
Terminal Configuration and Functions
Copyright © 2016–2019, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2650MODA
7
CC2650MODA
SWRS187D – AUGUST 2016 – REVISED JULY 2019
4.2
www.ti.com
Pin Functions
Table 4-1 describes the CC2650MODA pins.
Table 4-1. Signal Descriptions – MOH Package
PIN NAME
PIN NO.
PIN TYPE
DESCRIPTION
DIO_0
4
Digital I/O
GPIO, Sensor Controller
DIO_1
5
Digital I/O
GPIO, Sensor Controller
DIO_2
6
Digital I/O
GPIO, Sensor Controller, high-drive capability
DIO_3
7
Digital I/O
GPIO, Sensor Controller, high-drive capability
DIO_4
8
Digital I/O
GPIO, Sensor Controller, high-drive capability
DIO_5/JTAG_TDO
11
Digital I/O
GPIO, high-drive capability, JTAG_TDO
DIO_6/JTAG_TDI
12
Digital I/O
GPIO, high-drive capability, JTAG_TDI
DIO_7
14
Digital I/O, Analog I/O
GPIO, Sensor Controller, analog
DIO_8
15
Digital I/O, Analog I/O
GPIO, Sensor Controller, analog
DIO_9
16
Digital I/O, Analog I/O
GPIO, Sensor Controller, analog
DIO_10
17
Digital I/O, Analog I/O
GPIO, Sensor Controller, analog
DIO_11
18
Digital I/O, Analog I/O
GPIO, Sensor Controller, analog
DIO_12
19
Digital I/O, Analog I/O
GPIO, Sensor Controller, analog
DIO_13
20
Digital I/O, Analog I/O
GPIO, Sensor Controller, analog
DIO_14
21
Digital I/O, Analog I/O
GPIO, Sensor Controller, analog
EGP
G1, G2, G3, G4
Power
Ground – Exposed ground pad
GND
1, 3, 25
—
Ground
JTAG_TCK
10
Digital I/O
JTAG TCKC
JTAG_TMS
9
Digital I/O
JTAG TMSC, high-drive capability
NC
2, 24
NC
Not Connected—TI recommends leaving these pins floating
nRESET
13
Digital input
Reset, active low. No internal pullup
VDD
22, 23
Power
1.8-V to 3.8-V main chip supply
8
Terminal Configuration and Functions
Copyright © 2016–2019, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2650MODA
CC2650MODA
www.ti.com
SWRS187D – AUGUST 2016 – REVISED JULY 2019
5 Specifications
5.1
Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1) (2)
VDD
Supply voltage
Voltage on any digital pin
Vin
(3)
Voltage on ADC input
MIN
MAX
UNIT
–0.3
4.1
V
V
–0.3
VDD + 0.3, max 4.1
Voltage scaling enabled
–0.3
VDD
Voltage scaling disabled, internal reference
–0.3
1.49
Voltage scaling disabled, VDD as reference
–0.3
VDD / 2.9
5
dBm
–40
85
°C
Input RF level
Tstg
(1)
(2)
(3)
Storage temperature
V
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to ground, unless otherwise noted.
Including analog capable DIO.
5.2
ESD Ratings
VALUE
Human body model (HBM), per ANSI/ESDA/JEDEC
JS001 (1)
VESD
Electrostatic discharge
Charged device model (CDM), per JESD22-C101 (2)
(1)
(2)
5.3
All pins
±1000
RF pins
±500
Non-RF pins
±500
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
Recommended Operating Conditions
Ambient temperature
Operating supply voltage (VDD)
For operation in battery-powered and 3.3-V systems
(internal DC-DC can be used to minimize power
consumption)
MIN
MAX
–40
85
°C
1.8
3.8
V
Specifications
Copyright © 2016–2019, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2650MODA
UNIT
9
CC2650MODA
SWRS187D – AUGUST 2016 – REVISED JULY 2019
5.4
www.ti.com
Power Consumption Summary
Tc = 25°C, VDD = 3.0 V with internal DC-DC converter, unless otherwise noted
PARAMETER
Icore
Core current
consumption
TEST CONDITIONS
MIN
TYP
Reset. RESET_N pin asserted or VDD below Power-onReset threshold
100
Shutdown. No clocks running, no retention
150
Standby. With RTC, CPU, RAM and (partial) register
retention. RCOSC_LF
1
Standby. With RTC, CPU, RAM and (partial) register
retention. XOSC_LF
1.2
Standby. With Cache, RTC, CPU, RAM and (partial)
register retention. RCOSC_LF
2.5
Standby. With Cache, RTC, CPU, RAM and (partial)
register retention. XOSC_LF
2.7
Idle. Supply systems and RAM powered.
MAX
UNIT
nA
µA
550
1.45 mA +
31 µA/MHz
Active. Core running CoreMark
Radio RX
6.2
Radio TX, 0-dBm output power
6.8
Radio TX, 5-dBm output power
9.4
mA
Peripheral Current Consumption (Adds to core current Icore for each peripheral unit activated) (1)
Iperi
(1)
5.5
Peripheral power
domain
Delta current with domain enabled
20
Serial power domain
Delta current with domain enabled
13
RF core
Delta current with power domain enabled, clock
enabled, RF Core Idle
237
µDMA
Delta current with clock enabled, module idle
130
Timers
Delta current with clock enabled, module idle
113
I2C
Delta current with clock enabled, module idle
12
I2S
Delta current with clock enabled, module idle
36
SSI
Delta current with clock enabled, module idle
93
UART
Delta current with clock enabled, module idle
164
µA
Iperi is not supported in Standby or Shutdown.
General Characteristics
Tc = 25°C, VDD = 3.0 V, unless otherwise noted
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
FLASH MEMORY
Supported flash erase cycles before
failure
Flash page/sector erase current
100
Average delta current
Flash page/sector erase time (1)
Flash page/sector size
Flash write current
Average delta current, 4 bytes at a time
Flash write time (1)
4 bytes at a time
(1)
10
k Cycles
12.6
mA
8
ms
4
KB
8.15
mA
8
µs
This number is dependent on flash aging and will increase over time and erase cycles.
Specifications
Copyright © 2016–2019, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2650MODA
CC2650MODA
www.ti.com
5.6
SWRS187D – AUGUST 2016 – REVISED JULY 2019
Antenna
Tc = 25°C, VDD = 3.0 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
Polarization
TYP
UNIT
Linear
Peak Gain
2450 MHz
1.26
Efficiency
2450 MHz
57%
5.7
MAX
dBi
1-Mbps GFSK (Bluetooth low energy) – RX
RF performance is specified in a single ended 50-Ω reference plane at the antenna feeding point with Tc = 25°C,
VDD = 3.0 V, fRF = 2440 MHz, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Receiver sensitivity
BER = 10
–3
–97
dBm
Receiver saturation
BER = 10–3
4
dBm
Frequency error tolerance
Difference between center frequency of the received RF signal
and local oscillator frequency.
Data rate error tolerance
–350
350
kHz
–750
750
ppm
Co-channel rejection (1)
Wanted signal at –67 dBm, modulated interferer in channel,
BER = 10–3
–6
dB
Selectivity, ±1 MHz (1)
Wanted signal at –67 dBm, modulated interferer at ±1 MHz,
BER = 10–3
7 / 3 (2)
dB
Selectivity, ±2 MHz (1)
Wanted signal at –67 dBm, modulated interferer at ±2 MHz,
BER = 10–3
29 / 23 (2)
dB
Selectivity, ±3 MHz (1)
Wanted signal at –67 dBm, modulated interferer at ±3 MHz,
BER = 10–3
38 / 26 (2)
dB
Selectivity, ±4 MHz (1)
Wanted signal at –67 dBm, modulated interferer at ±4 MHz,
BER = 10–3
42 / 29 (2)
dB
Selectivity, ±5 MHz or more (1)
Wanted signal at –67 dBm, modulated interferer at ≥ ±5 MHz,
BER = 10–3
32
dB
Selectivity, Image frequency (1)
Wanted signal at –67 dBm, modulated interferer at image
frequency, BER = 10–3
23
dB
Selectivity,
Image frequency ±1 MHz (1)
Wanted signal at –67 dBm, modulated interferer at ±1 MHz from
image frequency, BER = 10–3
3 / 26 (2)
dB
Out-of-band blocking (3)
30 MHz to 2000 MHz
–20
dBm
Out-of-band blocking
2003 MHz to 2399 MHz
–5
dBm
Out-of-band blocking
2484 MHz to 2997 MHz
–8
dBm
Out-of-band blocking
3000 MHz to 12.75 GHz
–8
dBm
Intermodulation
Wanted signal at 2402 MHz, –64 dBm. Two interferers at 2405
and 2408 MHz respectively, at the given power level
–34
dBm
Spurious emissions,
30 MHz to 1000 MHz
Conducted measurement in a 50-Ω single-ended load. Suitable
for systems targeting compliance with EN 300 328, EN 300 440
class 2, FCC CFR47, Part 15 and ARIB STD-T-66
–71
dBm
Spurious emissions,
1 GHz to 12.75 GHz
Conducted measurement in a 50-Ω single-ended load. Suitable
for systems targeting compliance with EN 300 328, EN 300 440
class 2, FCC CFR47, Part 15 and ARIB STD-T-66
–62
dBm
RSSI dynamic range
70
dB
RSSI accuracy
±4
dB
(1)
(2)
(3)
Numbers given as I/C dB
X / Y, where X is +N MHz and Y is –N MHz
Excluding one exception at Fwanted / 2, per Bluetooth Specification
Specifications
Copyright © 2016–2019, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2650MODA
11
CC2650MODA
SWRS187D – AUGUST 2016 – REVISED JULY 2019
5.8
www.ti.com
1-Mbps GFSK (Bluetooth low energy) – TX
RF performance is specified in a single ended 50-Ω reference plane at the antenna feeding point with Tc = 25°C,
VDD = 3.0 V, fRF = 2440 MHz, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
Output power, highest setting
Output power, lowest setting
Spurious emission conducted
measurement (1)
(1)
5.9
TYP
MAX
UNIT
5
dBm
–21
dBm
f < 1 GHz, outside restricted bands
–43
f < 1 GHz, restricted bands ETSI
–58
f < 1 GHz, restricted bands FCC
–57
f > 1 GHz, including harmonics
–45
dBm
Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 Class 2
(Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan)
IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) – RX
RF performance is specified in a single ended 50-Ω reference plane at the antenna feeding point with Tc = 25°C,
VDD = 3.0 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Receiver sensitivity
PER = 1%
–100
dBm
Receiver saturation
PER = 1%
–7
dBm
Adjacent channel rejection
Wanted signal at –82 dBm, modulated interferer at ±5 MHz,
PER = 1%
35
dB
Alternate channel rejection
Wanted signal at –82 dBm, modulated interferer at ±10 MHz,
PER = 1%
52
dB
Channel rejection, ±15 MHz or
more
Wanted signal at –82 dBm, undesired signal is IEEE 802.15.4
modulated channel, stepped through all channels 2405 to
2480 MHz, PER = 1%
57
dB
Blocking and desensitization,
5 MHz from upper band edge
Wanted signal at –97 dBm (3 dB above the sensitivity level),
CW jammer, PER = 1%
64
dB
Blocking and desensitization,
10 MHz from upper band edge
Wanted signal at –97 dBm (3 dB above the sensitivity level),
CW jammer, PER = 1%
64
dB
Blocking and desensitization,
20 MHz from upper band edge
Wanted signal at –97 dBm (3 dB above the sensitivity level),
CW jammer, PER = 1%
65
dB
Blocking and desensitization,
50 MHz from upper band edge
Wanted signal at –97 dBm (3 dB above the sensitivity level),
CW jammer, PER = 1%
68
dB
Blocking and desensitization,
–5 MHz from lower band edge
Wanted signal at –97 dBm (3 dB above the sensitivity level),
CW jammer, PER = 1%
63
dB
Blocking and desensitization,
–10 MHz from lower band edge
Wanted signal at –97 dBm (3 dB above the sensitivity level),
CW jammer, PER = 1%
63
dB
Blocking and desensitization,
–20 MHz from lower band edge
Wanted signal at –97 dBm (3 dB above the sensitivity level),
CW jammer, PER = 1%
65
dB
Blocking and desensitization,
–50 MHz from lower band edge
Wanted signal at –97 dBm (3 dB above the sensitivity level),
CW jammer, PER = 1%
67
dB
Spurious emissions,
30 MHz to 1000 MHz
Conducted measurement in a 50-Ω single-ended load.
Suitable for systems targeting compliance with EN 300 328,
EN 300 440 class 2, FCC CFR47, Part 15 and ARIB STD-T66
–71
dBm
Spurious emissions,
1 GHz to 12.75 GHz
Conducted measurement in a 50-Ω single-ended load.
Suitable for systems targeting compliance with EN 300 328,
EN 300 440 class 2, FCC CFR47, Part 15 and ARIB STD-T66
–62
dBm
Frequency error tolerance
Difference between center frequency of the received RF
signal and local oscillator frequency
>200
ppm
100
dB
±4
dB
RSSI dynamic range
RSSI accuracy
12
Specifications
Copyright © 2016–2019, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2650MODA
CC2650MODA
www.ti.com
SWRS187D – AUGUST 2016 – REVISED JULY 2019
5.10 IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) – TX
RF performance is specified in a single ended 50-Ω reference plane at the antenna feeding point with Tc = 25°C,
VDD = 3.0 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
Output power, highest setting
Output power, lowest setting
Error vector magnitude
Spurious emission conducted
measurement (1)
(1)
TYP
MAX
UNIT
5
dBm
–21
dBm
At maximum output power
2%
f < 1 GHz, outside restricted bands
–43
f < 1 GHz, restricted bands ETSI
–58
f < 1 GHz, restricted bands FCC
–57
f > 1 GHz, including harmonics
–45
dBm
Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 Class 2
(Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan)
5.11 24-MHz Crystal Oscillator (XOSC_HF) (1)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
Crystal frequency
Start-up time
(3)
MAX
24
Crystal frequency tolerance (2)
(1)
(2)
TYP
–40
(3)
UNIT
MHz
40
ppm
150
µs
Probing or otherwise stopping the XTAL while the DC-DC converter is enabled may cause permanent damage to the device.
Includes initial tolerance of the crystal, drift over temperature, aging and frequency pulling due to incorrect load capacitance. As per
Bluetooth and IEEE 802.15.4 specification
Kick-started based on a temperature and aging compensated RCOSC_HF using precharge injection
5.12 32.768-kHz Crystal Oscillator (XOSC_LF)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
Crystal frequency
Initial crystal frequency tolerance, Bluetooth
low energy applications
TYP
MAX
32.768
Tc = 25°C
Crystal aging
UNIT
kHz
–20
20
ppm
-3
3
ppm/year
5.13 48-MHz RC Oscillator (RCOSC_HF)
Tc = 25°C, VDD = 3.0 V, unless otherwise noted
PARAMETER
TEST CONDITIONS
MIN
Frequency
TYP
48
Uncalibrated frequency accuracy
±1%
Calibrated frequency accuracy (1)
±0.25%
Start-up time
(1)
MAX
UNIT
MHz
5
µs
Accuracy relatively to the calibration source (XOSC_HF).
5.14 32-kHz RC Oscillator (RCOSC_LF)
Tc = 25°C, VDD = 3.0 V, unless otherwise noted
PARAMETER
TEST CONDITIONS
Calibrated frequency
MIN
TYP
32.8
Temperature coefficient
50
MAX
UNIT
kHz
ppm/°C
Specifications
Copyright © 2016–2019, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2650MODA
13
CC2650MODA
SWRS187D – AUGUST 2016 – REVISED JULY 2019
www.ti.com
5.15 ADC Characteristics
Tc = 25°C, VDD = 3.0 V and voltage scaling enabled, unless otherwise noted
PARAMETER
(1)
TEST CONDITIONS
MIN
Input voltage range
TYP
0
VDD
Resolution
12
Sample rate
Offset
Gain error
DNL (3)
Differential nonlinearity
INL (4)
Integral nonlinearity
Internal 4.3-V equivalent reference
(2)
, 200 ksps,
THD
(1)
(2)
(3)
(4)
(5)
14
LSB
2.4
LSB
>–1
LSB
±3
LSB
10
Bits
11.1
(2)
, 200 ksps,
–65
VDD as reference, 200 ksps, 9.6-kHz input tone
–69
Internal 1.44-V reference, voltage scaling disabled,
32 samples average, 200 ksps, 300-Hz input tone
–71
dB
Internal 4.3-V equivalent reference (2), 200 ksps,
9.6-kHz input tone
60
VDD as reference, 200 ksps, 9.6-kHz input tone
63
Internal 1.44-V reference, voltage scaling disabled,
32 samples average, 200 ksps, 300-Hz input tone
69
Internal 4.3-V equivalent reference (2), 200 ksps,
9.6-kHz input tone
67
VDD as reference, 200 ksps, 9.6-kHz input tone
72
Internal 1.44-V reference, voltage scaling disabled, 32
samples average, 200 ksps, 300-Hz input tone
73
Conversion time
Serial conversion, time-to-output, 24-MHz clock
50
Current consumption
Internal 4.3-V equivalent reference (2)
0.66
mA
Current consumption
VDD as reference
0.75
mA
Reference voltage
Equivalent fixed internal reference (input voltage
scaling enabled). For best accuracy, the ADC
conversion should be initiated through the TI-RTOS™
API to include the gain or offset compensation factors
stored in FCFG1.
SINAD
Signal-to-noise and
and SNDR distortion ratio
SFDR
ksps
2
9.8
Internal 1.44-V reference, voltage scaling disabled,
32 samples average, 200 ksps, 300-Hz input tone
Total harmonic
distortion
V
(2)
Effective number of bits VDD as reference, 200 ksps, 9.6-kHz input tone
Internal 4.3-V equivalent reference
9.6-kHz input tone
UNIT
Bits
200
Internal 4.3-V equivalent reference (2)
Internal 4.3-V equivalent reference
9.6-kHz input tone
ENOB
MAX
Spurious-free dynamic
range
dB
dB
clockcycles
4.3 (2) (5)
V
Reference voltage
Fixed internal reference (input voltage scaling
disabled). For best accuracy, the ADC conversion
should be initiated through the TI-RTOS API to include
the gain or offset compensation factors stored in
FCFG1. This value is derived from the scaled value
(4.3 V) as follows: Vref = 4.3 V × 1408 / 4095
1.48
V
Reference voltage
VDD as reference (Also known as RELATIVE) (input
voltage scaling enabled)
VDD
V
Reference voltage
VDD as reference (Also known as RELATIVE) (input
voltage scaling disabled)
VDD / 2.82 (5)
V
Input Impedance
200 ksps, voltage scaling enabled. Capacitive input,
input impedance depends on sampling frequency and
sampling time
>1
MΩ
Using IEEE Std 1241™-2010 for terminology and test methods.
Input signal scaled down internally before conversion, as if voltage range was 0 to 4.3 V.
No missing codes. Positive DNL typically varies from +0.3 to +3.5 depending on device, see Figure 5-24.
For a typical example, see Figure 5-25.
Applied voltage must be within absolute maximum ratings (see Section 5.1) at all times.
Specifications
Copyright © 2016–2019, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2650MODA
CC2650MODA
www.ti.com
SWRS187D – AUGUST 2016 – REVISED JULY 2019
5.16 Temperature Sensor
Tc = 25°C, VDD = 3.0 V, unless otherwise noted
PARAMETER
TEST CONDITIONS
MIN
Resolution
TYP
MAX
4
Range
–40
UNIT
°C
85
°C
Accuracy
±5
°C
Supply voltage coefficient (1)
3.2
°C/V
(1)
Automatically compensated when using supplied driver libraries.
5.17 Battery Monitor
Tc = 25°C, VDD = 3.0 V, unless otherwise noted
PARAMETER
TEST CONDITIONS
MIN
Resolution
TYP
MAX
50
Range
1.8
Accuracy
UNIT
mV
3.8
13
V
mV
5.18 Continuous Time Comparator
Tc = 25°C, VDD = 3.0 V, unless otherwise noted
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Input voltage range
0
VDD
V
External reference voltage
0
VDD
V
Internal reference voltage
DCOUPL as reference
1.27
Offset
Hysteresis
Decision time
Step from –10 mV to +10 mV
Current consumption when enabled (1)
(1)
V
3
mV
<2
mV
0.72
µs
8.6
µA
Additionally, the bias module must be enabled when running in standby mode.
5.19 Low-Power Clocked Comparator
Tc = 25°C, VDD = 3.0 V, unless otherwise noted
PARAMETER
TEST CONDITIONS
Input voltage range
MIN
TYP
0
Clock frequency
MAX
VDD
32
UNIT
V
kHz
Internal reference voltage, VDD / 2
1.49–1.51
V
Internal reference voltage, VDD / 3
1.01–1.03
V
Internal reference voltage, VDD / 4
0.78–0.79
V
Internal reference voltage, DCOUPL / 1
1.25–1.28
V
Internal reference voltage, DCOUPL / 2
0.63–0.65
V
Internal reference voltage, DCOUPL / 3
0.42–0.44
V
Internal reference voltage, DCOUPL / 4
0.33–0.34
V
Offset
<2
Hysteresis
<5
mV
<1
clock-cycle
362
nA
Decision time
Step from –50 mV to +50 mV
Current consumption when enabled
mV
Specifications
Copyright © 2016–2019, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2650MODA
15
CC2650MODA
SWRS187D – AUGUST 2016 – REVISED JULY 2019
www.ti.com
5.20 Programmable Current Source
Tc = 25°C, VDD = 3.0 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
Current source programmable output range
TYP
Current consumption
(1)
UNIT
0.25–20
µA
0.25
µA
23
µA
Resolution
(1)
MAX
Including current source at maximum
programmable output
Additionally, the bias module must be enabled when running in standby mode.
5.21 DC Characteristics
PARAMETER
TEST CONDITIONS
MIN
TYP
1.32
1.54
MAX
UNIT
TA = 25°C, VDD = 1.8 V
GPIO VOH at 8-mA load
IOCURR = 2, high-drive GPIOs only
GPIO VOL at 8-mA load
IOCURR = 2, high-drive GPIOs only
GPIO VOH at 4-mA load
IOCURR = 1
GPIO VOL at 4-mA load
IOCURR = 1
0.21
GPIO pullup current
Input mode, pullup enabled, Vpad = 0 V
71.7
µA
GPIO pulldown current
Input mode, pulldown enabled, Vpad = VDD
21.1
µA
GPIO high/low input transition,
no hysteresis
IH = 0, transition between reading 0 and reading 1
0.88
V
GPIO low-to-high input transition,
with hysteresis
IH = 1, transition voltage for input read as 0 → 1
1.07
V
GPIO high-to-low input transition,
with hysteresis
IH = 1, transition voltage for input read as 1 → 0
0.74
V
GPIO input hysteresis
IH = 1, difference between 0 → 1 and 1 → 0 points
0.33
V
GPIO VOH at 8-mA load
IOCURR = 2, high-drive GPIOs only
2.68
V
GPIO VOL at 8-mA load
IOCURR = 2, high-drive GPIOs only
0.33
V
GPIO VOH at 4-mA load
IOCURR = 1
2.72
V
GPIO VOL at 4-mA load
IOCURR = 1
0.28
V
GPIO pullup current
Input mode, pullup enabled, Vpad = 0 V
277
µA
GPIO pulldown current
Input mode, pulldown enabled, Vpad = VDD
113
µA
GPIO high/low input transition,
no hysteresis
IH = 0, transition between reading 0 and reading 1
1.67
V
GPIO low-to-high input transition,
with hysteresis
IH = 1, transition voltage for input read as 0 → 1
1.94
V
GPIO high-to-low input transition,
with hysteresis
IH = 1, transition voltage for input read as 1 → 0
1.54
V
GPIO input hysteresis
IH = 1, difference between 0 → 1 and 1 → 0 points
0.4
V
0.26
1.32
V
0.32
1.58
V
V
0.32
V
TA = 25°C, VDD = 3.0 V
TA = 25°C, VDD = 3.8 V
TA = 25°C
VIH
Lowest GPIO input voltage reliably interpreted as a
«High»
VIL
Highest GPIO input voltage reliably interpreted as a
«Low»
16
Specifications
0.8
0.2
VDD
VDD
Copyright © 2016–2019, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2650MODA
CC2650MODA
www.ti.com
SWRS187D – AUGUST 2016 – REVISED JULY 2019
5.22 Thermal Resistance Characteristics for MOH Package
°C/W (1)
(2)
AIR FLOW (m/s) (3)
NAME
DESCRIPTION
RΘJC
Junction-to-case
20.0
RΘJB
Junction-to-board
15.3
RΘJA
Junction-to-free air
29.6
0
RΘJMA
Junction-to-moving air
25.0
1
PsiJT
Junction-to-package top
8.8
0
PsiJB
Junction-to-board
14.8
0
(1)
(2)
(3)
°C/W = degrees Celsius per watt.
These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a
JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
Power dissipation of 2 W and an ambient temperature of 70ºC is assumed.
m/s = meters per second.
5.23 Timing Requirements
MAX
UNIT
Rising supply-voltage slew rate
MIN
0
NOM
100
mV/µs
Falling supply-voltage slew rate
0
20
mV/µs
3
mV/µs
5
°C/s
Falling supply-voltage slew rate, with low-power flash settings (1)
Positive temperature gradient in standby (2)
No limitation for negative
temperature gradient, or
outside standby mode
CONTROL INPUT AC CHARACTERISTICS (3)
RESET_N low duration
1
µs
SYNCHRONOUS SERIAL INTERFACE (SSI) (4)
System
clocks
S1 (SLAVE) (5)
tclk_per
SSIClk period
S2 (5)
tclk_high
SSIClk high time
0.5
tclk_per
S3 (5)
tclk_low
SSIClk low time
0.5
tclk_per
(1)
(2)
(3)
(4)
(5)
12
65024
For smaller coin cell batteries, with high worst-case end-of-life equivalent source resistance, a 22-µF VDD input capacitor (see
Section 7.1.1) must be used to ensure compliance with this slew rate.
Applications using RCOSC_LF as sleep timer must also consider the drift in frequency caused by a change in temperature (see
Section 5.14).
TA = –40°C to +85°C, VDD = 1.7 V to 3.8 V, unless otherwise noted.
Tc = 25°C, VDD = 3.0 V, unless otherwise noted. Device operating as slave. For SSI master operation, see Section 5.24.
Refer to the SSI timing diagrams Figure 5-1, Figure 5-2, and Figure 5-3.
5.24 Switching Characteristics
Measured on the TI CC2650EM-5XD reference design with Tc = 25°C, VDD = 3.0 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
WAKEUP AND TIMING
Idle → Active
Standby → Active
Shutdown → Active
14
µs
151
µs
1015
µs
Specifications
Copyright © 2016–2019, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2650MODA
17
CC2650MODA
SWRS187D – AUGUST 2016 – REVISED JULY 2019
www.ti.com
Switching Characteristics (continued)
Measured on the TI CC2650EM-5XD reference design with Tc = 25°C, VDD = 3.0 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
SYNCHRONOUS SERIAL INTERFACE (SSI)
MIN
TYP
MAX
UNIT
(1)
S1 (TX only) (2) tclk_per (SSIClk period)
One-way communication to SLAVE
4
65024
System
clocks
S1 (TX and RX) (2) tclk_per (SSIClk period)
Normal duplex operation
8
65024
System
clocks
S2 (2) tclk_high (SSIClk high time)
S3
(1)
(2)
(2)
tclk_low (SSIClk low time)
0.5
tclk_per
0.5
tclk_per
Device operating as master. For SSI slave operation, see Section 5.23.
Refer to SSI timing diagrams Figure 5-1, Figure 5-2, and Figure 5-3.
S1
S2
SSIClk
S3
SSIFss
SSITx
SSIRx
MSB
LSB
4 to 16 bits
Figure 5-1. SSI Timing for TI Frame Format (FRF = 01), Single Transfer Timing Measurement
S2
S1
SSIClk
S3
SSIFss
SSITx
MSB
LSB
8-bit control
SSIRx
0
MSB
LSB
4 to 16 bits output data
Figure 5-2. SSI Timing for MICROWIRE Frame Format (FRF = 10), Single Transfer
18
Specifications
Copyright © 2016–2019, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2650MODA
CC2650MODA
www.ti.com
SWRS187D – AUGUST 2016 – REVISED JULY 2019
S1
S2
SSIClk
(SPO = 0)
S3
SSIClk
(SPO = 1)
SSITx
(Master)
MSB
SSIRx
(Slave)
MSB
LSB
LSB
SSIFss
Figure 5-3. SSI Timing for SPI Frame Format (FRF = 00), With SPH = 1
Specifications
Copyright © 2016–2019, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2650MODA
19
CC2650MODA
SWRS187D – AUGUST 2016 – REVISED JULY 2019
www.ti.com
5.25 Typical Characteristics
This section contains typical performance plots measured on the CC2650F128RHB device. They are published in the
CC2650 data sheet, and the plots relevant for the CC2650MODA device are repeated here. RF performance is specified in a
single-ended 50-Ω reference plane at the antenna feeding point with Tc = 25°C and VDD = 3.0 V, unless otherwise noted.
-95
-93
Sensitivity
Sensitivity
-96
-94
Sensitivity (dBm)
Sensitivity (dBm)
-97
-95
-96
-97
-98
-99
-100
-101
-98
-102
-99
-40 -30 -20 -10
0
10 20 30 40
Temperature (qC)
50
60
70
-103
-40 -30 -20 -10
80
D004
10 20 30 40
Temperature (qC)
50
-95
80
D005
IEEE 802.15.4 Sensitivity
-96
Sensitivity (dBm)
-96
-97
-98
-99
-100
-97
-98
-99
-100
-101
1.8
2.3
2.8
VDDS (V)
3.3
-101
1.9
3.8
2.4
D006
Figure 5-6. Bluetooth low energy Sensitivity
vs Supply Voltage (VDD)
2.9
VDDS (V)
3.4
D007
-95
Sensitivity
Sensitivity
-95.5
Sensitivity Level (dBm)
-96
-97
-98
-99
-100
-101
2400
3.8
Figure 5-7. IEEE 802.15.4 Sensitivity
vs Supply Voltage (VDD)
-95
Sensitivity Level (dBm)
70
-95
BLE Sensitivity
-96
-96.5
-97
-97.5
-98
-98.5
2410
2420
2430 2440 2450
Frequency (MHz)
2460
2470
2480
-99
2400
2410
D008
Figure 5-8. IEEE 802.15.4 Sensitivity
vs Channel Frequency
20
60
Figure 5-5. IEEE 802.15.4 Sensitivity vs Temperature
Figure 5-4. Bluetooth low energy Sensitivity vs Temperature
Sensitivity (dBm)
0
2420
2430 2440 2450
Frequency (MHz)
2460
2470
2480
D009
Figure 5-9. Bluetooth low energy Sensitivity
vs Channel Frequency
Specifications
Copyright © 2016–2019, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2650MODA
CC2650MODA
www.ti.com
SWRS187D – AUGUST 2016 – REVISED JULY 2019
Typical Characteristics (continued)
6
6
5
5
Output power (dBm)
Output Power (dBm)
This section contains typical performance plots measured on the CC2650F128RHB device. They are published in the
CC2650 data sheet, and the plots relevant for the CC2650MODA device are repeated here. RF performance is specified in a
single-ended 50-Ω reference plane at the antenna feeding point with Tc = 25°C and VDD = 3.0 V, unless otherwise noted.
4
3
2
4
3
2
1
1
5-dBm Setting
5-dBm Setting
0
-40 -30 -20 -10
0
10 20 30 40
Temperature (qC)
50
60
70
0
1.8
80
2.3
2.8
VDDS (V)
D010
Figure 5-10. TX Output Power vs Temperature
3.3
3.8
D011
Figure 5-11. TX Output Power vs Supply Voltage (VDD)
8
16
5-dBm Setting
15
7
14
13
TX Current (mA)
Output Power (dBm)
6
5
4
3
2
12
11
10
9
8
7
1
6
0
5
5-dBm setting
-1
2400
2410
2420
2430 2440 2450
Frequency (MHz)
2460
2470
4
1.8
2480
Figure 5-12. TX Output Power
vs Channel Frequency
9.5
9
RX Current (mA)
Current Consumption (mA)
10
8.5
8
7.5
7
6.5
6
5.5
5
2
2.25 2.5 2.75
3 3.25 3.5 3.75
Voltage (V)
2.2
2.4
2.6 2.8
3
VDDS (V)
3.2
3.4
3.6
3.8
D013
Figure 5-13. TX Current Consumption
vs Supply Voltage (VDD)
10.5
4.5
1.75
2
D012
4
4.25 4.5
7
6.9
6.8
6.7
6.6
6.5
6.4
6.3
6.2
6.1
6
5.9
5.8
5.7
5.6
5.5
-40 -30 -20 -10
D014
Figure 5-14. RX Mode Current vs Supply Voltage (VDD)
RX Current
0
10 20 30 40
Temperature (qC)
50
60
70
80
D015
Figure 5-15. RX Mode Current Consumption vs Temperature
Specifications
Copyright © 2016–2019, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2650MODA
21
CC2650MODA
SWRS187D – AUGUST 2016 – REVISED JULY 2019
www.ti.com
Typical Characteristics (continued)
This section contains typical performance plots measured on the CC2650F128RHB device. They are published in the
CC2650 data sheet, and the plots relevant for the CC2650MODA device are repeated here. RF performance is specified in a
single-ended 50-Ω reference plane at the antenna feeding point with Tc = 25°C and VDD = 3.0 V, unless otherwise noted.
12
Active Mode Current Consumpstion (mA)
3.1
TX Current (mA)
10
8
6
4
2
5-dBm Setting
0
-40 -30 -20 -10
0
10 20 30 40
Temperature (qC)
50
60
70
Active Mode Current
3.05
3
2.95
2.9
2.85
-40 -30 -20 -10
80
D016
Figure 5-16. TX Mode Current Consumption vs Temperature
50
60
70
80
D006
4
Standby Mode Current
Active Mode Current
3.5
4.5
3
4
Current (uA)
Current Consumption (mA)
10 20 30 40
Temperature (qC)
Figure 5-17. Active Mode (MCU Running, No Peripherals)
Current Consumption vs Temperature
5
3.5
3
2.5
2
1.5
1
2.5
2
1.8
0.5
2.3
2.8
VDDS (V)
3.3
0
-20
3.8
0
10
20 30 40 50
Temperature (qC)
60
70
80
D008
Figure 5-19. Standby Mode Current Consumption
With RCOSC RTC vs Temperature
1006.4
11.4
11.2
-10
D007
Figure 5-18. Active Mode (MCU Running, No Peripherals)
Current Consumption vs Supply Voltage (VDD)
Fs= 200 kHz, No Averaging
Fs= 200 kHz, 32 samples averaging
1006.2
11
1006
10.8
ADC Code
Effective Number of Bits
0
10.6
10.4
10.2
1005.8
1005.6
1005.4
10
1005.2
9.8
1005
9.6
9.4
200 300 500
1000 2000
5000 10000 20000
Input Frequency (Hz)
100000
D009
Figure 5-20. SoC ADC Effective Number of Bits vs Input
Frequency (Internal Reference)
22
1004.8
1.8
2.3
2.8
VDDS (V)
3.3
3.8
D012
Figure 5-21. SoC ADC Output vs Supply Voltage (Fixed Input,
Internal Reference)
Specifications
Copyright © 2016–2019, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2650MODA
CC2650MODA
www.ti.com
SWRS187D – AUGUST 2016 – REVISED JULY 2019
Typical Characteristics (continued)
This section contains typical performance plots measured on the CC2650F128RHB device. They are published in the
CC2650 data sheet, and the plots relevant for the CC2650MODA device are repeated here. RF performance is specified in a
single-ended 50-Ω reference plane at the antenna feeding point with Tc = 25°C and VDD = 3.0 V, unless otherwise noted.
10.5
1007.5
ENOB Internal Reference (No Averaging)
ENOB Internal Reference (32 Samples Averaging)
10.4
1007
10.3
10.2
ENOB
ADC Code
1006.5
1006
10.1
10
9.9
1005.5
9.8
1005
9.7
1004.5
-40 -30 -20 -10
0
10 20 30 40
Temperature (qC)
50
60
70
9.6
1k
80
10k
Sampling Frequency (Hz)
D013
Figure 5-22. SoC ADC Output vs Temperature (Fixed Input,
Internal Reference)
100k
200k
D009A
Figure 5-23. SoC ADC ENOB vs Sampling Frequency
(Input Frequency = FS / 10)
3.5
3
2.5
2
DNL
1.5
1
0.5
0
-0.5
-1
ADC Code
4200
4000
3800
3600
3400
3200
3000
2800
2600
2400
2200
2000
1800
1600
1400
1200
1000
800
600
400
200
0
-1.5
D010
Figure 5-24. SoC ADC DNL vs ADC Code (Internal Reference)
3
2
1
INL
0
-1
-2
-3
-4
0
200
400
600
800 1000 1200 1400 1600 1800 2000 2200 2400 2600 2800 3000 3200 3400 3600 3800 4000 4200
ADC Code
D011
Figure 5-25. SoC ADC INL vs ADC Code (Internal Reference)
Specifications
Copyright © 2016–2019, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2650MODA
23
CC2650MODA
SWRS187D – AUGUST 2016 – REVISED JULY 2019
www.ti.com
6 Detailed Description
6.1
Overview
Figure 6-1 shows the core modules of the CC2650MODA device.
6.2
Functional Block Diagram
SimpleLink CC2650MODA Wireless MCU Module
32.768-kHz
Crystal
Oscillator
24-MHz Crystal
Oscillator
RF Balun
cJTAG
RF core
ROM
Main CPU
ADC
ADC
128-KB
Flash
ARM
Cortex-M3
Digital PLL
DSP Modem
8-KB
Cache
20-KB
SRAM
ROM
Sensor Controller
General Peripherals / Modules
I2C
4× 32-bit Timers
UART
2× SSI (SPI, µWire, TI)
I2S
Watchdog Timer
4-KB
SRAM
ARM
Cortex-M0
Sensor Controller Engine
12-bit ADC, 200 ks/s
2× Analog Comparators
15 GPIOs
TRNG
SPI / I2C Digital Sensor IF
AES
Temp. / Batt. Monitor
Constant Current Source
32 ch. µDMA
RTC
Time-to-Digital Converter
2-KB SRAM
DC-DC Converter
Copyright © 2017, Texas Instruments Incorporated
Figure 6-1. CC2650MODA Functional Block Diagram
24
Detailed Description
Copyright © 2016–2019, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2650MODA
CC2650MODA
www.ti.com
6.3
SWRS187D – AUGUST 2016 – REVISED JULY 2019
Main CPU
The SimpleLink CC2650MODA wireless MCU contains an ARM Cortex-M3 32-bit CPU, which runs the
application and the higher layers of the protocol stack.
The Cortex-M3 processor provides a high-performance, low-cost platform that meets the system
requirements of minimal memory implementation, and low-power consumption, while delivering
outstanding computational performance and exceptional system response to interrupts.
Cortex-M3 features include:
• 32-bit ARM Cortex-M3 architecture optimized for small-footprint embedded applications
• Outstanding processing performance combined with fast interrupt handling
• ARM Thumb®-2 mixed 16- and 32-bit instruction set delivers the high performance expected of a 32-bit
ARM core in a compact memory size usually associated with 8- and 16-bit devices, typically in the
range of a few kilobytes of memory for microcontroller-class applications:
– Single-cycle multiply instruction and hardware divide
– Atomic bit manipulation (bit-banding), delivering maximum memory use and streamlined peripheral
control
– Unaligned data access, enabling data to be efficiently packed into memory
• Fast code execution permits slower processor clock or increases sleep mode time
• Harvard architecture characterized by separate buses for instruction and data
• Efficient processor core, system, and memories
• Hardware division and fast digital-signal-processing oriented multiply accumulate
• Saturating arithmetic for signal processing
• Deterministic, high-performance interrupt handling for time-critical applications
• Enhanced system debug with extensive breakpoint and trace capabilities
• Serial wire trace reduces the number of pins required for debugging and tracing
• Migration from the ARM7™ processor family for better performance and power efficiency
• Optimized for single-cycle flash memory use
• Ultra-low-power consumption with integrated sleep modes
• 1.25 DMIPS per MHz
6.4
RF Core
The RF core contains an ARM Cortex-M0 processor that interfaces the analog RF and base-band
circuitries, handles data to and from the system side, and assembles the information bits in a given packet
structure. The RF core offers a high-level, command-based API to the main CPU.
The RF core can autonomously handle the time-critical aspects of the radio protocols (802.15.4 RF4CE
and ZigBee, Bluetooth low energy) thus offloading the main CPU and leaving more resources for the user
application.
The RF core has a dedicated 4-KB SRAM block and runs initially from separate ROM memory. The ARM
Cortex-M0 processor is not programmable by customers.
Detailed Description
Copyright © 2016–2019, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2650MODA
25
CC2650MODA
SWRS187D – AUGUST 2016 – REVISED JULY 2019
6.5
www.ti.com
Sensor Controller
The Sensor Controller contains circuitry that can be selectively enabled in standby mode. The peripherals
in this domain may be controlled by the Sensor Controller Engine, which is a proprietary power-optimized
CPU. This CPU can read and monitor sensors or perform other tasks autonomously, thereby significantly
reducing power consumption and offloading the main Cortex-M3 CPU.
The Sensor Controller is set up using a PC-based configuration tool, called Sensor Controller Studio, and
typical use cases may be (but are not limited to):
• Analog sensors using integrated ADC
• Digital sensors using GPIOs and bit-banged I2C or SPI
• UART communication for sensor reading or debugging
• Capacitive sensing
• Waveform generation
• Pulse counting
• Keyboard scan
• Quadrature decoder for polling rotation sensors
• Oscillator calibration
The peripherals in the Sensor Controller include the following:
• The low-power clocked comparator can be used to wake the device from any state in which the
comparator is active. A configurable internal reference can be used with the comparator. The output of
the comparator can also be used to trigger an interrupt or the ADC.
• Capacitive sensing functionality is implemented through the use of a constant current source, a timeto-digital converter, and a comparator. The continuous time comparator in this block can also be used
as a higher-accuracy alternative to the low-power clocked comparator. The Sensor Controller will take
care of baseline tracking, hysteresis, filtering and other related functions.
• The ADC is a 12-bit, 200-ksamples/s ADC with eight inputs and a built-in voltage reference. The ADC
can be triggered by many different sources, including timers, I/O pins, software, the analog
comparator, and the RTC.
• The Sensor Controller also includes a SPI/I2C digital interface.
• The analog modules can be connected to up to eight different GPIOs.
The peripherals in the Sensor Controller can also be controlled from the main application processor.
26
Detailed Description
Copyright © 2016–2019, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2650MODA
CC2650MODA
www.ti.com
SWRS187D – AUGUST 2016 – REVISED JULY 2019
Table 6-1 lists the GPIOs that are connected to the Sensor Controller.
Table 6-1. GPIOs Connected to the Sensor Controller (1)
(1)
6.6
ANALOG CAPABLE
16.9 × 11 MOH DIO NUMBER
Y
14
Y
13
Y
12
Y
11
Y
9
Y
10
Y
8
Y
7
N
4
N
3
N
2
N
1
N
0
Up to 13 pins can be connected to the Sensor Controller. Up to eight
of these pins can be connected to analog modules
Memory
The flash memory provides nonvolatile storage for code and data. The flash memory is in-system
programmable.
The SRAM (static RAM) can be used for both storage of data and execution of code and is split into two
4-KB blocks and two 6-KB blocks. Retention of the RAM contents in standby mode can be enabled or
disabled individually for each block to minimize power consumption. In addition, if flash cache is disabled,
the 8KB of cache can be used as a general-purpose RAM.
The ROM provides preprogrammed embedded TI-RTOS kernel, Driverlib and lower layer protocol stack
software (802.15.4 MAC and Bluetooth low energy Controller). The ROM also contains a bootloader that
can be used to reprogram the device using SPI or UART.
6.7
Debug
The on-chip debug support is done through a dedicated cJTAG (IEEE 1149.7) or JTAG (IEEE 1149.1)
interface.
Detailed Description
Copyright © 2016–2019, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2650MODA
27
CC2650MODA
SWRS187D – AUGUST 2016 – REVISED JULY 2019
6.8
www.ti.com
Power Management
To minimize power consumption, the CC2650MODA device supports a number of power modes and
power-management features (see Table 6-2).
Table 6-2. Power Modes
SOFTWARE-CONFIGURABLE POWER MODES
ACTIVE
IDLE
STANDBY
SHUTDOWN
RESET PIN
HELD
CPU
Active
Off
Off
Off
Off
Flash
On
Available
Off
Off
Off
SRAM
On
On
On
Off
Off
Radio
Available
Available
Off
Off
Off
MODE
Supply System
Current
Wake-up time to CPU active (1)
Register retention
SRAM retention
On
On
Duty Cycled
Off
Off
1.45 mA + 31 µA/MHz
550 µA
1 µA
0.15 µA
0.1 µA
–
14 µs
151 µs
1015 µs
1015 µs
Full
Full
Partial
No
No
Full
Full
Full
No
No
High-speed clock
XOSC_HF or
RCOSC_HF
XOSC_HF or
RCOSC_HF
Off
Off
Off
Low-speed clock
XOSC_LF or
RCOSC_LF
XOSC_LF or
RCOSC_LF
XOSC_LF or
RCOSC_LF
Off
Off
Peripherals
Available
Available
Off
Off
Off
Sensor Controller
Available
Available
Available
Off
Off
Wake up on RTC
Available
Available
Available
Off
Off
Wake up on pin edge
Available
Available
Available
Available
Off
Wake up on reset pin
Available
Available
Available
Available
Available
Brown Out Detector (BOD)
Active
Active
Duty Cycled (2)
Off
N/A
Power On Reset (POR)
Active
Active
Active
Active
N/A
(1)
(2)
Not including RTOS overhead
The Brown Out Detector is disabled between recharge periods in STANDBY. Lowering the supply voltage below the BOD threshold
between two recharge periods while in STANDBY may cause the BOD to lock the device upon wake-up until a Reset or POR releases
it. To avoid this, TI recommends that STANDBY mode is avoided if there is a risk that the supply voltage (VDD) may drop below the
specified operating voltage range. For the same reason, it is also good practice to ensure that a power cycling operation, such as a
battery replacement, triggers a Power-on-reset by ensuring that the VDD decoupling network is fully depleted before applying supply
voltage again (for example, inserting new batteries).
In active mode, the application Cortex-M3 CPU is actively executing code. Active mode provides normal
operation of the processor and all of the peripherals that are currently enabled. The system clock can be
any available clock source (see Table 6-2).
In idle mode, all active peripherals can be clocked, but the Application CPU core and memory are not
clocked and no code is executed. Any interrupt event will bring the processor back into active mode.
In standby mode, only the always-on domain (AON) is active. An external wake event, RTC event, or
sensor-controller event is required to bring the device back to active mode. MCU peripherals with retention
do not need to be reconfigured when waking up again, and the CPU continues execution from where it
went into standby mode. All GPIOs are latched in standby mode.
In shutdown mode, the device is turned off entirely, including the AON domain and the Sensor Controller.
The I/Os are latched with the value they had before entering shutdown mode. A change of state on any
I/O pin, defined as a wake from Shutdown pin, wakes up the device and functions as a reset trigger. The
CPU can differentiate between a reset in this way, a reset-by-reset pin, or a power-on-reset by reading the
reset status register. The only state retained in this mode is the latched I/O state and the flash memory
contents.
28
Detailed Description
Copyright © 2016–2019, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2650MODA
CC2650MODA
www.ti.com
SWRS187D – AUGUST 2016 – REVISED JULY 2019
The Sensor Controller is an autonomous processor that can control the peripherals in the Sensor
Controller independently of the main CPU, which means that the main CPU does not have to wake up, for
example, to execute an ADC sample or poll a digital sensor over SPI. The main CPU saves both current
and wake-up time that would otherwise be wasted. The Sensor Controller Studio enables the user to
configure the sensor controller and choose which peripherals are controlled and which conditions wake up
the main CPU.
6.9
Clock Systems
The CC2650MODA device supports two external and two internal clock sources.
A 24-MHz crystal is required as the frequency reference for the radio. This signal is doubled internally to
create a 48-MHz clock.
The 32-kHz crystal is optional. Bluetooth low energy requires a slow-speed clock with better than
±500-ppm accuracy if the device is to enter any sleep mode while maintaining a connection. The internal
32-kHz RC oscillator can in some use cases be compensated to meet the requirements. The low-speed
crystal oscillator is designed for use with a 32-kHz watch-type crystal.
The internal high-speed oscillator (48 MHz) can be used as a clock source for the CPU subsystem.
The internal low-speed oscillator (32.768 kHz) can be used as a reference if the low-power crystal
oscillator is not used.
The 32-kHz clock source can be used as external clocking reference through GPIO.
6.10 General Peripherals and Modules
The I/O controller controls the digital I/O pins and contains multiplexer circuitry to allow a set of peripherals
to be assigned to I/O pins in a flexible manner. All digital I/Os are interrupt and wake-up capable, have a
programmable pullup and pulldown function and can generate an interrupt on a negative or positive edge
(configurable). When configured as an output, pins can function as either push-pull or open-drain. Five
GPIOs have high-drive capabilities (marked in bold in Section 4).
The SSIs are synchronous serial interfaces that are compatible with SPI, MICROWIRE, and TI's
synchronous serial interfaces. The SSIs support both SPI master and slave up to 4 MHz.
The UART implements a universal asynchronous receiver/transmitter function. It supports flexible baudrate generation up to a maximum of 3 Mbps.
Timer 0 is a general-purpose timer module (GPTM), which provides two 16-bit timers. The GPTM can be
configured to operate as a single 32-bit timer, dual 16-bit timers or as a PWM module.
Timer 1, Timer 2, and Timer 3 are also GPTMs. Each of these timers is functionally equivalent to Timer 0.
In addition to these four timers, the RF core has its own timer to handle timing for RF protocols; the RF
timer can be synchronized to the RTC.
The I2C interface is used to communicate with devices compatible with the I2C standard. The I2C interface
is capable of 100-kHz and 400-kHz operation, and can serve as both I2C master and I2C slave.
The TRNG module provides a true, nondeterministic noise source for the purpose of generating keys,
initialization vectors (IVs), and other random number requirements. The TRNG is built on 24 ring
oscillators that create unpredictable output to feed a complex nonlinear combinatorial circuit.
The watchdog timer is used to regain control if the system fails due to a software error after an external
device fails to respond as expected. The watchdog timer can generate an interrupt or a reset when a
predefined time-out value is reached.
Detailed Description
Copyright © 2016–2019, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2650MODA
29
CC2650MODA
SWRS187D – AUGUST 2016 – REVISED JULY 2019
www.ti.com
The device includes a direct memory access (µDMA) controller. The µDMA controller provides a way to
offload data transfer tasks from the Cortex-M3 CPU, allowing for more efficient use of the processor and
the available bus bandwidth. The µDMA controller can perform transfer between memory and peripherals.
The µDMA controller has dedicated channels for each supported on-chip module and can be programmed
to automatically perform transfers between peripherals and memory as the peripheral is ready to transfer
more data. Some features of the µDMA controller include the following (this is not an exhaustive list):
• Highly flexible and configurable channel operation of up to 32 channels
• Transfer modes: memory-to-memory, memory-to-peripheral, peripheral-to-memory, and peripheral-toperipheral
• Data sizes of 8, 16, and 32 bits
The AON domain contains circuitry that is always enabled, except in Shutdown mode (where the digital
supply is off). This circuitry includes the following:
• The RTC can be used to wake the device from any state where it is active. The RTC contains three
compare and one capture registers. With software support, the RTC can be used for clock and
calendar operation. The RTC is clocked from the 32-kHz RC oscillator or crystal. The RTC can also be
compensated to tick at the correct frequency even when the internal 32-kHz RC oscillator is used
instead of a crystal.
• The battery monitor and temperature sensor are accessible by software and give a battery status
indication as well as a coarse temperature measure.
6.11 System Architecture
Depending on the product configuration, CC26xx can function either as a Wireless Network Processor
(WNP—an IC running the wireless protocol stack, with the application running on a separate MCU), or as
a System-on-Chip (SoC), with the application and protocol stack running on the ARM Cortex-M3 core
inside the device.
In the first case, the external host MCU communicates with the device using SPI or UART. In the second
case, the application must be written according to the application framework supplied with the wireless
protocol stack.
6.12 Certification
The CC2650MODA module is certified to the standards listed in Table 6-3 (with IDs where applicable).
Table 6-3. CC2650MODA List of Certifications
REGULATORY BODY
FCC (USA)
IC (Canada)
SPECIFICATION
ID (IF APPLICABLE)
Part 15C:2015 + MPE FCC 1.1307 RF Exposure (Bluetooth)
Part 15C:2015 + MPE FCC 1.1307 RF Exposure (802.15.4)
RSS-102 (MPE) and RSS-247 (Bluetooth)
RSS-102 (MPE) and RSS-247 (IEEE 802.15.4)
FCC ID: ZAT26M1
ID: 451H-26M1
EN 300 328 V2.1.1 (Bluetooth)
EN 300 328 V2.1.1 (802.15.4)
EN 62479:2010 (MPE)
ETSI/CE (Europe)
Draft EN 301 489-1 V2.2.0 (2017-03)
Draft EN 301 489-1 V3.2.0 (2017-03)
EN 55024:2010 + A1:2015
EN 55032:2015 + AC:2016-07
EN 60950-1:2006/A11:2009/A1:2010/A12:2011/A2:2013
Japan MIC
30
ARIB STD-T66
No: 201-160413/00
JATE
D 16 0093 201/00
Detailed Description
Copyright © 2016–2019, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2650MODA
CC2650MODA
www.ti.com
SWRS187D – AUGUST 2016 – REVISED JULY 2019
6.12.1 Regulatory Information Europe
Hereby, Texas Instruments Inc. declares that the radio equipment type CC2650MODA is in compliance
with Directive 2014/53/EU.
The full text of the EU Declaration of Conformity (DoC) is available on the CC2650MODA technical
documents page. The compliance has been verified in the operating frequency band of 2400 MHz to
2483.5 MHz. Developers and integrators that incorporate the CC2650MODA RF Module in any end
products are responsible for obtaining applicable regulatory approvals for such end product.
NOTE
The CC2650MODA has been tested in the 2400-GHz to 2483.5-GHz ISM frequency band at
3.3 V with a maximum peak power of 5.056-dBm EIRP across the temperature range –40°C
to +85°C and tolerance.
6.12.2 Federal Communications Commission Statement
You are cautioned that changes or modifications not expressly approved by the part responsible for
compliance could void the user’s authority to operate the equipment.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions:
1. This device may not cause harmful interference and
2. This device must accept any interference received, including interference that may cause undesired
operation of the device.
FCC RF Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End
users must follow the specific operating instructions for satisfying RF exposure limits. This transmitter
must not be colocated or operating with any other antenna or transmitter.
6.12.3 Canada, Industry Canada (IC)
This device complies with Industry Canada licence-exempt RSS standards.
Operation is subject to the following two conditions:
1. This device may not cause interference, and
2. This device must accept any interference, including interference that may cause undesired operation of
the device
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio
exempts de licence
L'exploitation est autorisée aux deux conditions suivantes:
1. l'appareil ne doit pas produire de brouillage, et
2. l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est
susceptible d'en compromettre le fonctionnement.
IC RF Radiation Exposure Statement:
To comply with IC RF exposure requirements, this device and its antenna must not be co-located or
operating in conjunction with any other antenna or transmitter.
Pour se conformer aux exigences de conformité RF canadienne l'exposition, cet appareil et son antenne
ne doivent pas étre co-localisés ou fonctionnant en conjonction avec une autre antenne ou transmetteur.
Detailed Description
Copyright © 2016–2019, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2650MODA
31
CC2650MODA
SWRS187D – AUGUST 2016 – REVISED JULY 2019
www.ti.com
6.12.4 Japan (JATE ID)
JATE ID is D 16 0093 201
For units already sold and marked with JATE ID: D 16 0086 201, please publicize to users that the JATE
ID: D 16 0086 201 should be read as D 16 0093 201 (for example, clients web page, by software update,
or similar).
6.13 End Product Labeling
This module is designed to comply with the FCC statement, FCC ID: ZAT26M1. The host system using
this module must display a visible label indicating the following text:
"Contains FCC ID: ZAT26M1"
This module is designed to comply with the IC statement, IC: 451H-26M1. The host system using this
module must display a visible label indicating the following text:
"Contains IC: 451H-26M1"
6.14 Manual Information to the End User
The OEM integrator must be aware not to provide information to the end user regarding how to install or
remove this RF module in the user’s manual of the end product that integrates this module.
NOTE
Operation outside of test conditions as documented in this datasheet is not supported and
may void TI’s warranty. Should the user choose to configure the CC2650MODA to operate
outside of the test conditions, the device must be operated inside a protected and controlled
environment, such as an RF shielded chamber and user must ensure compliance with
regulatory requirements.
The end user's manual must include all required regulatory information and warnings as shown in this
document.
32
Detailed Description
Copyright © 2016–2019, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2650MODA
CC2650MODA
www.ti.com
SWRS187D – AUGUST 2016 – REVISED JULY 2019
6.15 Module Marking
Figure 6-2 shows the marking for the SimpleLink™ CC2650MODA module.
Figure 6-2. SimpleLink CC2650MODA Module Marking
Table 6-4. Module Descriptions
MARKING
DESCRIPTION
CC2650MODA
Model
YMWLLLC
LTC (lot trace code):
•
Y = Year
•
M = Month
•
WLLLLC = Reserved for internal use
ZAT26M1
FCC ID: single modular FCC grant ID
451H-26M1
IC: single modular IC grant ID
MIC compliance mark
R 201-160413
JATE ID: Japan module grant ID
T D160093201
ARIB STD-T66 ID: Japan modular grant ID
Bluetooth compliance mark
CE
CE compliance mark
Detailed Description
Copyright © 2016–2019, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2650MODA
33
CC2650MODA
SWRS187D – AUGUST 2016 – REVISED JULY 2019
www.ti.com
7 Application, Implementation, and Layout
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI's customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
NOTE
TI does not recommend the use of conformal coating or similar material on the module. This
coating can lead to localized stress on the solder connections inside the module and impact
the module reliability. Use caution during the module assembly process to the final PCB to
avoid the presence of foreign material inside the module.
7.1
7.1.1
Application Information
Typical Application Circuit
No external components are required for the operation of the CC2650MODA device. Figure 7-1 shows the
application circuit.
VDDS
U1
VDDS
R28
100k
nReset
JTAG-TCK
JTAG-TMS
DIO0
DIO1
DIO2
DIO3
DIO4
DIO5
DIO6
DIO7
DIO8
DIO9
DIO10
DIO11
DIO12
DIO13
DIO14
4
5
6
7
8
11
12
14
15
16
17
18
19
20
21
13
10
9
1
3
25
DIO_0
DIO_1
DIO_2
DIO_3
DIO_4
DIO_5/JTAG_TDO
DIO_6/JTAG_TDI
DIO_7
DIO_8
DIO_9
DIO_10
DIO_11
DIO_12
DIO_13
DIO_14
VDDS
VDDS
NC_2
NC_24
nRESET
JTAG_TCKC
JTAG_TMSC
GND
GND
GND
EGP
EGP
EGP
EGP
22
23
2
24
26
27
28
29
CC2650MODAMOH
Copyright © 2016, Texas Instruments Incorporated
Figure 7-1. CC2650MODA Application Circuit
34
Application, Implementation, and Layout
Copyright © 2016–2019, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2650MODA
CC2650MODA
www.ti.com
7.2
7.2.1
SWRS187D – AUGUST 2016 – REVISED JULY 2019
Layout
Layout Guidelines
Use the following guidelines to lay out the CC2650MODA device:
• The module must be placed close to the edge of the PCB.
• TI recommends leaving copper clearance on all PCB layers underneath the antenna area, as shown in
Figure 7-2 and Figure 7-3.
• TI recommends using a generous amount of ground vias to stitch together the ground planes on
different layers. Several ground vias should be placed close to the exposed ground pads of the
module.
• No external decoupling is required.
• The reset line should have an external pullup resistor unless the line is actively driven. Placement of
this component is not critical.
• TI recommends leaving a clearance in the top-side copper plane underneath the RF test pads.
Figure 7-2. Top Layer
Figure 7-3. Bottom Layer
Application, Implementation, and Layout
Copyright © 2016–2019, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2650MODA
35
CC2650MODA
SWRS187D – AUGUST 2016 – REVISED JULY 2019
www.ti.com
8 Environmental Requirements and Specifications
8.1
PCB Bending
The PCB follows IPC-A-600J for PCB twist and warpage < 0.75% or 7.5 mil per inch.
8.2
8.2.1
Handling Environment
Terminals
The product is mounted with motherboard through land-grid array (LGA). To prevent poor soldering, do
not make skin contact with the LGA portion.
8.2.2
Falling
The mounted components will be damaged if the product falls or is dropped. Such damage may cause the
product to malfunction.
8.3
8.3.1
Storage Condition
Moisture Barrier Bag Before Opened
A moisture barrier bag must be stored in a temperature of less than 30°C with humidity under 85% RH.
The calculated shelf life for the dry-packed product will be 12 months from the date the bag is sealed.
8.3.2
Moisture Barrier Bag Open
Humidity indicator cards must be blue, < 30%.
8.4
Baking Conditions
Products require baking before mounting if:
• Humidity indicator cards read > 30%
• Temp < 30°C, humidity < 70% RH, over 96 hours
Baking condition: 90°C, 12 to 24 hours
Baking times: 1 time
36
Environmental Requirements and Specifications
Submit Documentation Feedback
Product Folder Links: CC2650MODA
Copyright © 2016–2019, Texas Instruments Incorporated
CC2650MODA
www.ti.com
8.5
SWRS187D – AUGUST 2016 – REVISED JULY 2019
Soldering and Reflow Condition
•
•
•
•
•
Heating method: Conventional convection or IR convection
Temperature measurement: Thermocouple d = 0.1 mm to 0.2 mm CA (K) or CC (T) at soldering
portion or equivalent method
Solder paste composition: Sn/3.0 Ag/0.5 Cu
Allowable reflow soldering times: 2 times based on the reflow soldering profile (see Figure 8-1)
Temperature profile: Reflow soldering will be done according to the temperature profile
(see Figure 8-1)
Figure 8-1. Temperature Profile for Evaluation of Solder Heat Resistance of a Component
(at Solder Joint)
Table 8-1. Temperature Profile
Convection or IR (1)
Profile Elements
Peak temperature range
235 to 240°C typical (260°C maximum)
Pre-heat / soaking (150 to 200°C)
60 to 120 seconds
Time above melting point
60 to 90 seconds
Time with 5°C to peak
30 seconds maximum
Ramp up
< 3°C / second
Ramp down
< -6°C / second
(1)
For details, refer to the solder paste manufacturer's recommendation.
NOTE
TI does not recommend the use of conformal coating or similar material on the SimpleLink™
module. This coating can lead to localized stress on the solder connections inside the
module and impact the module reliability. Use caution during the module assembly process
to the final PCB to avoid the presence of foreign material inside the module.
Copyright © 2016–2019, Texas Instruments Incorporated
Environmental Requirements and Specifications
Submit Documentation Feedback
Product Folder Links: CC2650MODA
37
CC2650MODA
SWRS187D – AUGUST 2016 – REVISED JULY 2019
www.ti.com
9 Device and Documentation Support
9.1
Device Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to all part numbers and/or
date-code. Each device has one of three prefixes/identifications: X, P, or null (no prefix) (for example,
CC2650MODA is in production; therefore, no prefix/identification is assigned).
Device development evolutionary flow:
X
Experimental device that is not necessarily representative of the final device's electrical
specifications and may not use production assembly flow.
P
Prototype device that is not necessarily the final silicon die and may not necessarily meet
final electrical specifications.
null
Production version of the silicon die that is fully qualified.
Production devices have been characterized fully, and the quality and reliability of the device have been
demonstrated fully. TI's standard warranty applies.
Predictions show that prototype devices (X or P) have a greater failure rate than the standard production
devices. Texas Instruments recommends that these devices not be used in any production system
because their expected end-use failure rate still is undefined. Only qualified production devices are to be
used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the
package type (for example, MOH).
For orderable part numbers of CC2650MODA devices in the MOH package type, see the Package Option
Addendum of this document, the TI website (www.ti.com), or contact your TI sales representative.
CC2650
MOD
A
MOH
PREFIX
X = Experimental device
Blank = Qualified device
PACKAGE DESIGNATOR
MOH = 29-pin Module
DEVICE FAMILY
SimpleLink™ Multistandard
Wireless MCU
ROM version 1
Flash = 128KB
DEVICE
MOD = Module
Figure 9-1. Device Nomenclature
38
Device and Documentation Support
Copyright © 2016–2019, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2650MODA
CC2650MODA
www.ti.com
9.2
SWRS187D – AUGUST 2016 – REVISED JULY 2019
Tools and Software
TI offers an extensive line of development tools, including tools to evaluate the performance of the
processors, generate code, develop algorithm implementations, and fully integrate and debug software
and hardware modules.
The following products support development of the CC2650MODA device applications:
Software Tools
SmartRF Studio 7:
SmartRF Studio is a PC application that helps designers of radio systems to easily evaluate the RF-IC at
an early stage in the design process.
• Test functions for sending and receiving radio packets, continuous wave transmit and receive
• Evaluate RF performance on custom boards by wiring it to a supported evaluation board or debugger
• Can also be used without any hardware, but then only to generate, edit and export radio configuration
settings
• Can be used in combination with several development kits for TI's CCxxxx RF-ICs
Sensor Controller Studio:
Sensor Controller Studio provides a development environment for the CC26xx Sensor Controller. The
Sensor Controller is a proprietary, power-optimized CPU in the CC26xx, which can perform simple
background tasks autonomously and independent of the System CPU state.
• Allows for Sensor Controller task algorithms to be implemented using a C-like programming language
• Outputs a Sensor Controller Interface driver, which incorporates the generated Sensor Controller
machine code and associated definitions
• Allows for rapid development by using the integrated Sensor Controller task testing and debugging
functionality. This allows for live visualization of sensor data and algorithm verification.
IDEs and Compilers
Code Composer Studio:
• Integrated development environment with project management tools and editor
• Code Composer Studio (CCS) 6.1 and later has built-in support for the CC26xx device family
• Best support for XDS debuggers; XDS100v3, XDS110 and XDS200
• High integration with TI-RTOS with support for TI-RTOS Object View
IAR Embedded Workbench for ARM
• Integrated development environment with project management tools and editor
• IAR EWARM 7.30.3 and later has built-in support for the CC26xx device family
• Broad debugger support, supporting XDS100v3, XDS200, IAR I-Jet and Segger J-Link
• Integrated development environment with project management tools and editor
• RTOS plugin is available for TI-RTOS
For a complete listing of development-support tools for the CC2650MODA platform, visit the Texas
Instruments website at www.ti.com. For information on pricing and availability, contact the nearest TI field
sales office or authorized distributor.
Device and Documentation Support
Copyright © 2016–2019, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2650MODA
39
CC2650MODA
SWRS187D – AUGUST 2016 – REVISED JULY 2019
9.3
www.ti.com
Documentation Support
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the
upper right corner, click on Alert me to register and receive a weekly digest of any product information that
has changed. For change details, review the revision history included in any revised document.
The following documents describe the CC2650MODA device. Copies of these documents are available on
the Internet at www.ti.com.
Declaration of Conformity
CC2650MODA EU Declaration of Conformity (DoC)
Errata
CC2630 and CC2650 SimpleLink™ Wireless MCU Errata
Technical Reference Manual
CC13x0, CC26x0 SimpleLink™ Wireless MCU
Application Reports
Running Standalone Bluetooth® low energy Applications on CC2650 Module
How to Qualify Your Bluetooth(R) Low Energy Product
User's Guide
CC2650 Module BoosterPack™ Getting Started Guide
White Paper
Which TI Bluetooth® Solution Should I Choose?
More Literature
Streamline the Challenges of RF Design With Certified Wireless Modules
9.4
Texas Instruments Low-Power RF Website
TI's Low-Power RF website has all the latest products, application and design notes, FAQ section, news
and events updates. Go to Wireless Connectivity: TI’s SimpleLink™ Sub-1 GHz Wireless MCUs.
9.5
Low-Power RF eNewsletter
The Low-Power RF eNewsletter is up-to-date on new products, news releases, developers’ news, and
other news and events associated with low-power RF products from TI. The Low-Power RF eNewsletter
articles include links to get more online information.
Sign up at: www.ti.com/lprfnewsletter
40
Device and Documentation Support
Copyright © 2016–2019, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2650MODA
CC2650MODA
www.ti.com
9.6
SWRS187D – AUGUST 2016 – REVISED JULY 2019
Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the
respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views;
see TI's Terms of Use.
TI E2E™ Online Community The TI engineer-to-engineer (E2E) community was created to foster
collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge,
explore ideas and help solve problems with fellow engineers.
Texas Instruments Embedded Processors Wiki Established to help developers get started with
Embedded Processors from Texas Instruments and to foster innovation and growth of
general knowledge about the hardware and software surrounding these devices.
Low-Power RF Online Community Wireless Connectivity Section of the TI E2E Support Community
• Forums, videos, and blogs
• RF design help
• E2E interaction
Join here.
Low-Power RF Developer Network Texas Instruments has launched an extensive network of low-power
RF development partners to help customers speed up their application development. The
network consists of recommended companies, RF consultants, and independent design
houses that provide a series of hardware module products and design services, including:
• RF circuit, low-power RF, and ZigBee design services
• Low-power RF and ZigBee module solutions and development tools
• RF certification services and RF circuit manufacturing
For help with modules, engineering services or development tools:
Search the Low-Power RF Developer Network to find a suitable partner.
9.7
Additional Information
Texas Instruments offers a wide selection of cost-effective, low-power RF solutions for proprietary and
standard-based wireless applications for use in industrial and consumer applications. The selection
includes RF transceivers, RF transmitters, RF front ends, modules, and Systems-on-Chips as well as
various software solutions for the Sub-1 GHz and 2.4-GHz frequency bands.
In addition, Texas Instruments provides a large selection of support collateral such as development tools,
technical documentation, reference designs, application expertise, customer support, third-party and
university programs.
The Low-Power RF E2E Online Community provides technical support forums, videos and blogs, and the
chance to interact with engineers from all over the world.
With a broad selection of product solutions, end-application possibilities, and a range of technical support,
Texas Instruments offers the broadest low-power RF portfolio.
9.8
Trademarks
IAR Embedded Workbench is a registered trademark of IAR Systems AB.
SmartRF, Code Composer Studio, SimpleLink, Z-Stack, LaunchPad, TI-RTOS, BoosterPack, E2E are
trademarks of Texas Instruments.
ARM7 is a trademark of ARM Limited (or its subsidiaries).
ARM, Cortex, Thumb are registered trademarks of ARM Limited (or its subsidiaries).
Bluetooth is a registered trademark of Bluetooth SIG, Inc.
CoreMark is a registered trademark of Embedded Microprocessor Benchmark Consortium.
IEEE Std 1241 is a trademark of The Institute of Electrical and Electronics Engineers, Inc.
IEEE is a registered trademark of The Institute of Electrical and Electronics Engineers, Inc.
ZigBee is a registered trademark of ZigBee Alliance, Inc.
ZigBee RF4CE is a trademark of Zigbee Alliance, Inc.
All other trademarks are the property of their respective owners.
Device and Documentation Support
Copyright © 2016–2019, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2650MODA
41
CC2650MODA
SWRS187D – AUGUST 2016 – REVISED JULY 2019
9.9
www.ti.com
Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
9.10 Export Control Notice
Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data
(as defined by the U.S., EU, and other Export Administration Regulations) including software, or any
controlled product restricted by other applicable national regulations, received from Disclosing party under
this Agreement, or any direct product of such technology, to any destination to which such export or reexport is restricted or prohibited by U.S. or other applicable laws, without obtaining prior authorization from
U.S. Department of Commerce and other competent Government authorities to the extent required by
those laws.
9.11 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
10 Mechanical, Packaging, and Orderable Information
10.1 Packaging Information
The following pages include mechanical, packaging, and orderable information. This information is the
most current data available for the designated devices. This data is subject to change without notice and
revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
42
Mechanical, Packaging, and Orderable Information
Submit Documentation Feedback
Product Folder Links: CC2650MODA
Copyright © 2016–2019, Texas Instruments Incorporated
CC2650MODA
www.ti.com
SWRS187D – AUGUST 2016 – REVISED JULY 2019
10.2 PACKAGE OPTION ADDENDUM
10.2.1 PACKAGING INFORMATION
Orderable Device
CC2650MODAMOHR
(1)
(2)
(3)
(4)
(5)
Status
(1)
ACTIVE
Package
Type
Package
Drawing
Pins
Package
Qty
QFM
MOH
29
1200
Eco Plan
(2)
Green (RoHS & no
Sb/Br)
Lead/Ball
Finish
MSL Peak
Temp (3)
Op Temp (°C)
ENIG
3, 250°C
–40 to 85
Device Marking (4)
(5)
CC2650MODA
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
space
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest
availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the
requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified
lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used
between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by
weight in homogeneous material)
space
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
space
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device
space
Multiple Device markings will be inside parentheses. Only on Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief
on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third
parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Mechanical, Packaging, and Orderable Information
Copyright © 2016–2019, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2650MODA
43
CC2650MODA
SWRS187D – AUGUST 2016 – REVISED JULY 2019
www.ti.com
10.3 PACKAGE MATERIALS INFORMATION
10.3.1 TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
B0 W
Reel
Diameter
Cavity
A0
B0
K0
W
P1
A0
Dimension designed to accommodate the component width
Dimension designed to accommodate the component length
Dimension designed to accommodate the component thickness
Overall width of the carrier tape
Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1
Q2
Q1
Q2
Q3
Q4
Q3
Q4
User Direction of Feed
Pocket Quadrants
All dimensions are nominal.
Device
Package
Type
Package
Drawing
Pins
SPQ
Reel
Diameter
(mm)
Reel Width
W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
CC2650MODAMOHR
QFM
MOH
29
1200
330
32.5
11.4
17.4
2.9
16
32
Q1
44
Mechanical, Packaging, and Orderable Information
Submit Documentation Feedback
Product Folder Links: CC2650MODA
Copyright © 2016–2019, Texas Instruments Incorporated
CC2650MODA
www.ti.com
SWRS187D – AUGUST 2016 – REVISED JULY 2019
TAPE AND REEL BOX DIMENSIONS
Width (mm)
W
L
H
Device
Package Type
Package
Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CC2650MODAMOHR
QFM
MOH
29
1200
352
348
56
Copyright © 2016–2019, Texas Instruments Incorporated
Mechanical, Packaging, and Orderable Information
Submit Documentation Feedback
Product Folder Links: CC2650MODA
45
PACKAGE OUTLINE
MOH0029A
QFM - 2.69 mm max height
SCALE 1.000
SCALE 1.000
QUAD FLAT MODULE
11.1
10.9
A
B
17.0
16.8
PIN 1 ID AREA
( 10.77)
PICK & PLACE
NOZZLE AREA
C
2.69 MAX
SEATING PLANE
6.9
4.065±0.05
0.45 0.05 TYP
22X 1.15
16
10
9
1.7±0.05
2X
9.2
26
PKG
1.7±0.05
29
1.5 0.05
(1)
2
1
25X
2X ( 0.7)
5.721
±0.05
1.27±0.05
4.125±0.05
28
27
2X
6.9
17
0.6
0.5
25
25X
0.95
0.85
0.1
0.05
C A B
C
PKG
4222814/A 04/2016
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
MOH0029A
QFM - 2.69 mm max height
QUAD FLAT MODULE
(11)
NO TRACES, VIAS, GND PLANE
OR SILK SCREEN SHOULD BE
LOCATED WITHIN THIS AREA
(8.45)
25X (0.55)
(R0.05) TYP
25
1
25X (0.9)
PKG
(16.9)
( 1.5)
(2.625)
29
26
2X (6.9)
(1.7)
27
(0.265)
( 0.2) VIA
TYP
22X (1.15)
(8)
28
(1.7)
17
9
10
16
PKG
(10.1)
LAND PATTERN EXAMPLE
SCALE:7X
0.05 MAX
ALL AROUND
METAL
0.05 MIN
ALL AROUND
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
PADS 1-25
SOLDER MASK
DEFINED
PADS 26-29
SOLDER MASK DETAILS
4222814/A 04/2016
NOTES: (continued)
3. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments
literature number SLUA271 (www.ti.com/lit/slua271).
www.ti.com
EXAMPLE STENCIL DESIGN
MOH0029A
QFM - 2.69 mm max height
QUAD FLAT MODULE
25X (0.55)
(R0.05) TYP
PKG
25X (0.9)
25
1
PKG
4X METAL
ALL AROUND
26
(2.625)
29
4X
( 1.383)
(2X 6.9)
(1.7)
(8)
28
27
(0.265)
(1.7)
17
9
22X (1.15)
16
10
(10.1)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
PRINTED SOLDER COVERAGE BY AREA
PADS 26-29: 85%
SCALE:10X
4222814/A 04/2016
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
permission to use these resources only for development of an application that uses the TI products described in the resource. Other
reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third
party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims,
damages, costs, losses, and liabilities arising out of your use of these resources.
TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on
ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable
warranties or warranty disclaimers for TI products.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2019, Texas Instruments Incorporated
Was this manual useful for you? yes no
Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Related manuals

Download PDF

advertising