Texas Instruments | CC3220R, CC3220S, and CC3220SF SimpleLink™ Wi-Fi® Single-Chip Wireless MCU Solutions (Rev. B) | Datasheet | Texas Instruments CC3220R, CC3220S, and CC3220SF SimpleLink™ Wi-Fi® Single-Chip Wireless MCU Solutions (Rev. B) Datasheet

Texas Instruments CC3220R, CC3220S, and CC3220SF SimpleLink™ Wi-Fi® Single-Chip Wireless MCU Solutions (Rev. B) Datasheet
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CC3220R, CC3220S, CC3220SF
SWAS035B – SEPTEMBER 2016 – REVISED NOVEMBER 2018
CC3220R, CC3220S, and CC3220SF SimpleLink™ Wi-Fi®
Single-Chip Wireless MCU Solutions
1 Device Overview
1.1
Features
1
• Dual-Core Architecture:
– User-Dedicated Application MCU Subsystem
– Highly-Integrated Wi-Fi Network Processor
• Rich Set of IoT Security Features:
– Enhanced IoT Networking Security
– Asymmetric Keys and Unique Device Identity
– Software IP Protection and Secure Storage
(CC3220S/CC3220SF)
• Advanced Low-Power Modes for Battery Powered
Applications
• Built-In Power Management Subsystem
• Industrial Temperature: –40°C to 85°C
• Chip-Level Wi-Fi Alliance® Wi-Fi CERTIFIED™
Extended Features List:
• Applications Microcontroller Subsystem:
– Arm® Cortex®-M4 Core at 80 MHz
– Embedded Memory:
– 256KB of RAM
– Optional 1MB of Executable Flash
– External Serial Flash
– Peripherals:
– McASP Supports Two I2S Channels
– SD, SPI, I2C, UART
– 8-Bit Synchronous Imager Interface
– 4-Channel 12-Bit ADCs
– 4 General-Purpose Timers (GPT) With 16-Bit
PWM Mode
– Watchdog Timer
– Up to 27 GPIO Pins
– Debug Interfaces: JTAG, cJTAG, SWD
• Wi-Fi Network Processor (NWP) Subsystem:
– Wi-Fi Modes:
– 802.11b/g/n Station
– 802.11b/g Access Point (AP) Supports up to
Four Stations
– Wi-Fi Direct® Client and Group Owner
– WPA2 Personal and Enterprise Security: WEP,
WPA™/ WPA2™ PSK, WPA2 Enterprise
(802.1x)
– IPv4 and IPv6 TCP/IP Stack
– Industry-Standard BSD Socket Application
Programming Interfaces (APIs):
– 16 Simultaneous TCP or UDP Sockets
– 6 Simultaneous TLS and SSL Sockets
– IP Addressing: Static IP, LLA, DHCPv4,
DHCPv6 With Duplicate Address Detection
(DAD)
– SimpleLink Connection Manager for
Autonomous and Fast Wi-Fi Connections
– Flexible Wi-Fi Provisioning With SmartConfig™
Technology, AP Mode, and WPS2 Options
– RESTful API Support Using the Internal HTTP
Server
– Wide Set of Security Features:
– Hardware Features:
– Separate Execution Environments
– Device Identity
– Hardware Crypto Engine for Advanced
Fast Security, Including: AES, DES,
3DES, SHA2, MD5, CRC, and Checksum
– Initial Secure Programming:
– Debug Security
– JTAG and Debug Ports are Locked
– Personal and Enterprise Wi-Fi Security
– Secure Sockets (SSLv3, TLS1.0, TLS1.1,
TLS1.2)
– Networking Security:
– Personal and Enterprise Wi-Fi Security
– Secure Sockets (SSLv3, TLS1.0, TLS1.1,
TLS1.2)
– HTTPS Server
– Trusted Root-Certificate Catalog
– TI Root-of-Trust Public Key
– Software IP Protection:
– Secure Key Storage
– File System Security
– Software Tamper Detection
– Cloning Protection
– Secure Boot: Validate the Integrity and
Authenticity of the Runtime Binary During
Boot
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
CC3220R, CC3220S, CC3220SF
SWAS035B – SEPTEMBER 2016 – REVISED NOVEMBER 2018
– Embedded Network Applications Running on the
Dedicated Network Processor:
– HTTP/HTTPS Web Server With Dynamic
User Callbacks
– mDNS, DNS-SD, DHCP Server
– Ping
– Recovery Mechanism—Can Recover to Factory
Defaults or to a Complete Factory Image
– Wi-Fi TX Power:
– 18.0 dBm at 1 DSSS
– 14.5 dBm at 54 OFDM
– Wi-Fi RX Sensitivity:
– –96 dBm at 1 DSSS
– –74.5 dBm at 54 OFDM
– Application Throughput:
– UDP: 16 Mbps
– TCP: 13 Mbps
– Peak: 72 Mbps
• Power-Management Subsystem:
– Integrated DC/DC Converters Support a Wide
Range of Supply Voltage:
– VBAT Wide-Voltage Mode: 2.1 V to 3.6 V
– VIO is Always Tied With VBAT
– Preregulated 1.85-V Mode
1.2
•
2
www.ti.com
•
•
•
•
– Advanced Low-Power Modes:
– Shutdown: 1 µA
– Hibernate: 4.5 µA
– Low-Power Deep Sleep (LPDS): 135 µA
(Measured on CC3220R, CC3220S, and
CC3220SF With 256KB RAM Retention)
– RX Traffic (MCU Active): 59 mA (Measured
on CC3220R and CC3220S; CC3220SF
Consumes an Additional 10 mA) at 54 OFDM
– TX Traffic (MCU Active): 223 mA (Measured
on CC3220R and CC3220S; CC3220SF
Consumes an Additional 15 mA) at
54 OFDM, Maximum Power
– Idle Connected (MCU in LPDS): 710 µA
(Measured on CC3220R and CC3220S With
256KB RAM Retention) at DTIM = 1
Clock Source:
– 40.0-MHz Crystal With Internal Oscillator
– 32.768-kHz Crystal or External RTC
RGK Package
– 64-Pin, 9-mm × 9-mm Very Thin Quad Flat
Nonleaded (VQFN) Package, 0.5-mm Pitch
Operating Temperature
– Ambient Temperature Range: –40°C to +85°C
Device Supports SimpleLink™ MCU Platform
Developer's Ecosystem
Applications
For Internet of Things applications, such as:
– Building and Home Automation:
• HVAC Systems & Thermostat
• Video Surveillance, Video Doorbells, and
Low-Power Camera
• Building Security Systems & E-locks
Device Overview
–
–
–
–
–
Appliances
Asset Tracking
Factory Automation
Medical and Healthcare
Grid Infrastructure
Copyright © 2016–2018, Texas Instruments Incorporated
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CC3220R, CC3220S, CC3220SF
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1.3
SWAS035B – SEPTEMBER 2016 – REVISED NOVEMBER 2018
Description
The SoC Wireless MCU CC3220x device comes in three variants: CC3220R, CC3220S, and C3220SF.
• CC3220R features 256KB of RAM, IoT networking security and device identity/keys.
• CC3220S builds on the CC3220R and MCU level security such as file system encryption, user IP
(MCU image) encryption, secure boot and debug security.
• CC3220SF builds on the CC3220S and integrates a user-dedicated 1MB of executable Flash, in
addition to the 256KB of RAM.
Start your internet-of-things (IoT) design with a Wi-Fi CERTIFIED™ Wireless Microcontroller. The
SimpleLink™ Wi-Fi® CC3220x device family is a system-on-chip (SoC) solution, that integrates two
processors within a single-chip:
• The application processor is an Arm® Cortex®-M4 MCU with a user-dedicated 256KB of RAM and an
optional 1MB of serial flash.
• The network processor MCU runs all Wi-Fi® and internet logical layers. This ROM-based subsystem
includes an 802.11b/g/n radio, baseband, and MAC with a powerful crypto engine.
These devices introduce new features and capabilities that further simplify the connectivity of things to the
internet. The main new features include the following:
• Optimized low-power management
• Enhanced networking security
• Device identity and Asymmetric keys
• Enhanced file system security (supported only by the CC3220S and CC3220SF variants)
• IPv6 TCP/IP Stack
• AP mode with support of four stations
• Up to 16 concurrent BSD sockets, of which 6 are secure
• HTTPS support
• RESTful API support
The CC3220x device family is part of the SimpleLink™ MCU platform, a common, easy-to-use
development environment based on a single core software development kit (SDK), rich tool set, reference
designs and E2E™ community that supports Wi-Fi®, Bluetooth® low energy, Sub-1 GHz and host MCUs.
For more information, visit the SimpleLink™ MCU Platform.
Device Information (1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
CC3220RM2ARGKR/T
VQFN (64)
9.00 mm × 9.00 mm
CC3220SM2ARGKR/T
VQFN (64)
9.00 mm × 9.00 mm
CC3220SF12ARGKR/T
VQFN (64)
9.00 mm × 9.00 mm
(1)
For all available packages, see the orderable addendum at the end of the data sheet.
Copyright © 2016–2018, Texas Instruments Incorporated
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Product Folder Links: CC3220R CC3220S CC3220SF
Device Overview
3
CC3220R, CC3220S, CC3220SF
SWAS035B – SEPTEMBER 2016 – REVISED NOVEMBER 2018
1.4
www.ti.com
Functional Block Diagrams
Figure 1-1 shows the functional block diagram of the CC3220x SimpleLink Wi-Fi solution.
Figure 1-1. Functional Block Diagram
4
Device Overview
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CC3220R, CC3220S, CC3220SF
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SWAS035B – SEPTEMBER 2016 – REVISED NOVEMBER 2018
Figure 1-2 shows the CC3220x hardware overview.
CC32xx ± Single-Chip Wireless MCU
1MB flash (optional)
256KB RAM
Arm® Cortex®-M4
Processor
80 MHz
ROM
1× SPI
2× UART
1× I2S/PCM
DMA
System
Timers
1× SD/MMC
Peripherals
1× I2C
8-bit Camera
GPIOs
4× ADC
Network Processor
Application
Protocols
Wi-Fi® Driver
TCP/IP Stack
Oscillators
(Arm® Cortex®
Processor)
DC/DC
ROM
Baseband
MAC
Processor
Radio
Synthesizer
RTC
Crypto Engine
RAM
Power
Management
Figure 1-2. CC3220x Hardware Overview
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Device Overview
5
CC3220R, CC3220S, CC3220SF
SWAS035B – SEPTEMBER 2016 – REVISED NOVEMBER 2018
www.ti.com
Figure 1-3 shows an overview of the CC3220x embedded software.
Customer Application
NetApp
BSD Socket
Wi-Fi®
6LPSOH/LQNΠ'ULYHU $3,V
Host Interface
Network Apps
WLAN Security
and
Management
TCP/IP Stack
WLAN MAC and PHY
Figure 1-3. CC3220x Embedded Software Overview
6
Device Overview
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Product Folder Links: CC3220R CC3220S CC3220SF
CC3220R, CC3220S, CC3220SF
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SWAS035B – SEPTEMBER 2016 – REVISED NOVEMBER 2018
Table of Contents
1
2
3
Device Overview ......................................... 1
5.12
WLAN Filter Requirements.......................... 38
1.1
Features .............................................. 1
1.2
Applications ........................................... 2
5.13
5.14
1.3
Description ............................................ 3
Thermal Resistance Characteristics ................ 38
Thermal Resistance Characteristics for RGK
Package ............................................. 38
1.4
Functional Block Diagrams ........................... 4
5.15
Timing and Switching Characteristics ............... 38
Revision History ......................................... 7
Device Comparison ..................................... 9
Arm® Cortex®-M4 Processor Core Subsystem ..... 56
Related Products ..................................... 9
6.2
Wi-Fi Network Processor Subsystem ............... 57
Terminal Configuration and Functions ............ 10
6.3
Security .............................................. 59
Pin Diagram ......................................... 10
6.4
Power-Management Subsystem .................... 62
Pin Attributes and Pin Multiplexing.................. 11
6.5
Low-Power Operating Mode ........................ 63
Signal Descriptions .................................. 19
6.6
Memory .............................................. 65
Pin Multiplexing ..................................... 24
Drive Strength and Reset States for Analog and
Digital Multiplexed Pins ............................. 26
Pad State After Application of Power to Chip But
Before Reset Release ............................... 26
6.7
Restoring Factory Default Configuration ............ 68
6.8
Boot Modes.......................................... 68
4.1
4.2
4.3
4.4
4.5
4.6
Connections for Unused Pins ....................... 27
4.7
5
Detailed Description ................................... 56
6.1
3.1
4
6
Specifications ........................................... 28
5.1
Absolute Maximum Ratings ......................... 28
5.2
ESD Ratings
5.4
5.5
5.6
5.7
8
Applications, Implementation, and Layout........ 69
7.1
Application Information .............................. 69
7.2
PCB Layout Guidelines
.............................
74
Device and Documentation Support ............... 77
8.1
Development Tools and Software................... 77
8.2
Firmware Updates................................... 78
28
8.3
Device Nomenclature ............................... 78
28
8.4
Documentation Support ............................. 79
29
8.5
Current Consumption Summary (CC3220R,
CC3220S) ........................................... 29
Related Links ........................................ 81
8.6
Community Resources .............................. 81
Current Consumption Summary (CC3220SF) ...... 31
TX Power and IBAT versus TX Power Level
Settings .............................................. 32
8.7
Trademarks.......................................... 81
8.8
Electrostatic Discharge Caution ..................... 82
........................................
Power-On Hours (POH) .............................
Recommended Operating Conditions ...............
5.3
7
.................
5.8
Brownout and Blackout Conditions
5.9
Electrical Characteristics (3.3 V, 25°C) ............. 35
5.10
WLAN Receiver Characteristics
5.11
WLAN Transmitter Characteristics .................. 37
....................
34
37
9
...............................
8.9
Export Control Notice
8.10
Glossary ............................................. 82
82
Mechanical, Packaging, and Orderable
Information .............................................. 83
9.1
Packaging Information
..............................
83
2 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from February 7, 2017 to November 29, 2018
•
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Page
Changed Features section .......................................................................................................... 1
Changed all occurrences of "XIP flash" to "Serial Flash"........................................................................ 1
Added Functional Block Diagram to the Functional Block Diagrams section ................................................. 4
Added Device Comparison section ................................................................................................. 9
Changed Device Features Comparison table ..................................................................................... 9
Added NC = No internal connection note to the pinout diagram ............................................................. 10
Added By default, all I/Os float in the Hibernate state. However, the default state can be changed by SW in the
Pin Attributes and Pin Multiplexing section ...................................................................................... 11
Changed "mode 0" to "high impedance" in the note in the Pin Attributes and Pin Multiplexing section ................. 11
Added "2.4-GHz TX, RX" to the description of pin 31 .......................................................................... 12
Added "+ve" to the description of pin 40 ........................................................................................ 13
Added "–ve" to the description of pin 40 ........................................................................................ 13
Deleted the pin number for GND_TAB ........................................................................................... 14
Changed the condition statement in the Absolute Maximum Ratings table ................................................. 28
Deleted "VBAT present and nReset pin pulled low" from the "MCU SHUTDOWN" row in the Current
Consumption Summary (CC3220R, CC3220S) table .......................................................................... 30
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Revision History
7
CC3220R, CC3220S, CC3220SF
SWAS035B – SEPTEMBER 2016 – REVISED NOVEMBER 2018
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www.ti.com
Added "MCU HIBERNATE" row to the Current Consumption Summary (CC3220R, CC3220S) table ..................
Deleted "VBAT present and nReset pin pulled low" from the "MCU SHUTDOWN" row in the Current
Consumption Summary (CC3200SF) table ......................................................................................
Added the "MCU HIBERNATE" row to the Current Consumption Summary (CC3200SF) table .........................
Deleted the + sign from the typical values in the WLAN Transmitter Characteristics table ...............................
Added the table note "Power of 802.11b rates are reduced to meet ETSI requirements" to the WLAN
Transmitter Characteristics table ..................................................................................................
Changed from "200-mS" to 200-ms" in the Device Reset section ...........................................................
Changed from "pin 32" to "pin 52" in the second list item of the Device Reset section ...................................
Changed SPI Master Timing Diagram ...........................................................................................
Changed the parameter numbers in the SPI Master Timing Parameters table ............................................
Changed SPI Slave Timing Diagram ............................................................................................
Changed the parameter numbers in the SPI Slave Timing Parameters table ..............................................
Changed I2S Transmit Mode Timing Diagram ..................................................................................
Changed the parameter numbers in the I2S Transmit Mode Timing Parameters table ...................................
Changed I2S Receive Mode Timing Diagram ...................................................................................
Changed the parameter numbers in the I2S Receive Mode Timing Parameters table ....................................
Changed I2C Timing Diagram .....................................................................................................
Changed the parameter names in the I2C Timing Parameters table .........................................................
Changed JTAG Timing Diagram .................................................................................................
Changed the parameter names in the JTAG Timing Parameters table ......................................................
Changed Camera Parallel Port Timing Diagram ................................................................................
Changed the parameter numbers in the Camera Parallel Port Timing Parameters table .................................
Deleted the Functional Block Diagram subsection in the Detailed Description section. Subsequent subsections
renumbered .........................................................................................................................
Changed from "0x4401 EFFF" to "0x4401 DFFF" in the Memory Map table ...............................................
Changed from "0x4402 0FFF" to "0x4402 1FFF" in the Memory Map table ................................................
Changed CC3220x Wide-Voltage Mode Application Circuit diagram ........................................................
Added footnote to L5 in the Bill of Materials for CC3220x in Wide-Voltage Mode table ...................................
Added R7 information to the Bill of Materials for CC3220x in Wide-Voltage Mode table..................................
Added R8 information to the Bill of Materials for CC3220x in Wide-Voltage Mode table..................................
Changed CC3220x Preregulated 1.85-V Mode Application Circuit diagram ................................................
Added footnote to L3 in the Bill of Materials for CC3220x Preregulated, 1.85-V Mode table .............................
Added R7 information to the Bill of Materials for CC3220x in Preregulated, 1.85-V Mode table .........................
Changed from "XTALM" to "XTAL_N" in the Clock Interfaces section .......................................................
Changed Tools and Software section ............................................................................................
Changed CC3220x Device Nomenclature figure................................................................................
Changed Documentation Support section .......................................................................................
Added Related Links subsection ..................................................................................................
Revision History
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SWAS035B – SEPTEMBER 2016 – REVISED NOVEMBER 2018
3 Device Comparison
Table 3-1 shows the features supported across different CC3220 devices.
Table 3-1. Device Features Comparison
DEVICE
FEATURE
CC3220R
CC3220S
CC3220SF
On-Chip Application Memory
RAM
256KB
256KB
Flash
–
–
256KB
1MB
Security Features
–
File system security
Secure key storage
Software tamper detection
Cloning protection
Initial secure programming
File system security
Secure key storage
Software tamper detection
Cloning protection
Initial secure programming
Hardware Acceleration
Hardware Crypto Engines
Hardware Crypto Engines
Hardware Crypto Engines
Additional Networking Security
Unique Device Identity
Trusted Root-Certificate Catalog
TI Root-of-Trust Public key
Unique Device Identity
Trusted Root-Certificate Catalog
TI Root-of-Trust Public key
Unique Device Identity
Trusted Root-Certificate Catalog
TI Root-of-Trust Public key
Secure Boot
No
Yes
Yes
Enhanced Application Level
Security
Additional Features
Standard
802.11 b/g/n
TCP/IP Stack
IPv4, IPv6
Package
9 mm × 9 mm VQFN
Sockets
16
3.1
Related Products
For information about other devices in this family of products or related products, see the following links:
SimpleLink™ MCU Portfolio This portfolio offers a single development environment that delivers flexible
hardware, software and tool options for customers developing wired and wireless
applications. With 100 percent code reuse across host MCUs, Wi-Fi™, Bluetooth® low
energy, Sub-1 GHz devices and more, choose the MCU or connectivity standard that fits
your design. A one-time investment with the SimpleLink software development kit (SDK)
allows you to reuse often, opening the door to create unlimited applications.
SimpleLink™ Wi-Fi® Family This device platform offers several Internet-on-a chip™ solutions, which
address the need of battery operated, security enabled products. Texas instruments offers a
single chip wireless microcontroller and a wireless network processor which can be paired
with any MCU, to allow developers to design new wi-fi products, or upgrade existing
products with wi-fi capabilities.
BoosterPack™ Plug-In Modules The BoosterPack Plug-in modules extend the functionality of TI
LaunchPad Development Kit. Application-specific BoosterPack Plug-in modules allow you to
explore a broad range of applications, including capacitive touch, wireless sensing, LED
Lighting control, and more. Stack multiple BoosterPack modules onto a single LaunchPad kit
to further enhance the functionality of your design.
Reference Designs for CC3200 and CC3220 Devices TI Designs Reference Design Library is a robust
reference design library spanning analog, embedded processor and connectivity. Created by
TI experts to help you jump start your system design, all TI Designs include schematic or
block diagrams, BOMs and design files to speed your time to market. Search and download
designs at ti.com/tidesigns.
SimpleLink™ Wi-Fi® CC3220 SDK This SDK contains drivers for the CC3220 programmable MCU,
sample applications, and documentation required to start development with CC3220
solutions.
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Device Comparison
9
CC3220R, CC3220S, CC3220SF
SWAS035B – SEPTEMBER 2016 – REVISED NOVEMBER 2018
www.ti.com
4 Terminal Configuration and Functions
4.1
Pin Diagram
37
VDD_PA_IN
38
SOP1
39
LDO_IN1
40
SOP0
41
VIN_DCDC_ANA
42
VIN_DCDC_PA
43
DCDC_ANA_SW
44
DCDC_PA_SW_P
45
DCDC_PA_OUT
DCDC_DIG_SW
46
DCDC_PA_SW_N
VIN_DCDC_DIG
47
DCDC_ANA2_SW_N
VDD_ANA2
48
DCDC_ANA2_SW_P
VDD_ANA1
Figure 4-1 shows pin assignments for the 64-pin VQFN package.
36
35
34
33
VDD_RAM
49
32
nRESET
GPIO0
50
31
RF_BG
ANTSEL2
RTC_XTAL_P
51
30
RTC_XTAL_N
52
29
ANTSEL1
GPIO30
53
28
NC
VIN_IO2
54
27
NC
GPIO1
55
26
NC
VDD_DIG2
56
25
LDO_IN2
GPIO2
57
24
VDD_PLL
GPIO3
58
23
WLAN_XTAL_P
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
TDI
1
GPIO22
TDO
FLASH_SPI_CS
GPIO28
17
FLASH_SPI_DIN
18
64
FLASH_SPI_DOUT
63
GPIO9
FLASH_SPI_CLK
GPIO8
VIN_IO1
TCK
VDD_DIG1
TMS
19
GPIO17
20
62
GPIO16
61
GPIO7
GPIO15
GPIO6
GPIO14
SOP2
GPIO12
WLAN_XTAL_N
21
GPIO13
22
60
GPIO10
59
GPIO11
GPIO4
GPIO5
NC = No internal connection
Figure 4-1. VQFN 64-Pin Assignments
Top View
10
Terminal Configuration and Functions
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4.2
SWAS035B – SEPTEMBER 2016 – REVISED NOVEMBER 2018
Pin Attributes and Pin Multiplexing
The device makes extensive use of pin multiplexing to accommodate the large number of peripheral
functions in the smallest possible package. To achieve this configuration, pin multiplexing is controlled
using a combination of hardware configuration (at device reset) and register control.
NOTE
TI highly recommends using Pin Mux Tool to obtain the desired pinout.
The board and software designers are responsible for the proper pin multiplexing configuration. Hardware
does not ensure that the proper pin multiplexing options are selected for the peripherals or interface mode
used.
Table 4-1 and Table 4-2 list the pin descriptions and attributes. Table 4-3 lists the signal descriptions.
Table 4-4 presents an overall view of pin multiplexing. All pin multiplexing options are configurable using
the pin mux registers.
The following special considerations apply:
• All I/Os support drive strengths of 2, 4, and 6 mA. The drive strength is individually configurable for
each pin.
• All I/Os support 10-µA pullup and pulldown resistors.
• The VIO and VBAT supply must be tied together at all times.
• By default, all I/Os float in the Hibernate state. However, the default state can be changed by SW.
• All digital I/Os are nonfail-safe.
NOTE
If an external device drives a positive voltage to the signal pads and the CC3220x device is
not powered, DC is drawn from the other device. If the drive strength of the external device is
adequate, an unintentional wakeup and boot of the CC3220x device can occur. To prevent
current draw, TI recommends any one of the following conditions:
• All devices interfaced to the CC3220x device must be powered from the same power rail
as the chip.
• Use level shifters between the device and any external devices fed from other
independent rails.
• The nRESET pin of the CC3220x device must be held low until the VBAT supply to the
device is driven and stable.
• All GPIO pins default to high impedance unless programmed by the MCU. The
bootloader sets the TDI, TDO, TCK, TMS, and Flash_SPI pins to mode 1. All the other
pins are left in the Hi-Z state.
Table 4-1. Pin Descriptions
PINS
NO.
NAME
TYPE
DESCRIPTION
SELECT AS
WAKEUP
SOURCE
CONFIGURE
ADDITIONAL
ANALOG MUX
MUXED
WITH JTAG
1
GPIO10
I/O
General-purpose input or output
No
No
No
2
GPIO11
I/O
General-purpose input or output
Yes
No
No
3
GPIO12
I/O
General-purpose input or output
No
No
No
4
GPIO13
I/O
General-purpose input or output
Yes
No
No
5
GPIO14
I/O
General-purpose input or output
No
No
No
6
GPIO15
I/O
General-purpose input or output
No
No
No
7
GPIO16
I/O
General-purpose input or output
No
No
No
8
GPIO17
I/O
General-purpose input or output
Yes
No
No
9
VDD_DIG1
Internal digital core voltage
N/A
N/A
N/A
Power
Terminal Configuration and Functions
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CC3220R, CC3220S, CC3220SF
SWAS035B – SEPTEMBER 2016 – REVISED NOVEMBER 2018
www.ti.com
Table 4-1. Pin Descriptions (continued)
PINS
NO.
NAME
TYPE
Power
SELECT AS
WAKEUP
SOURCE
CONFIGURE
ADDITIONAL
ANALOG MUX
MUXED
WITH JTAG
I/O power supply (same as
battery voltage)
N/A
N/A
N/A
DESCRIPTION
10
VIN_IO1
11
FLASH_SPI_CLK
O
Serial flash interface: SPI clock
N/A
N/A
N/A
12
FLASH_SPI_DOUT
O
Serial flash interface: SPI data
out
N/A
N/A
N/A
13
FLASH_SPI_DIN
I
Serial flash interface: SPI data in
N/A
N/A
N/A
14
FLASH_SPI_CS
O
Serial flash interface: SPI chip
select
N/A
N/A
N/A
15
GPIO22
I/O
General-purpose input or output
No
No
No
16
TDI
I/O
JTAG interface: data input
No
No
Muxed with
JTAG TDI
17
TDO
I/O
JTAG interface: data output
Yes
No
Muxed with
JTAG TDO
18
GPIO28
I/O
General-purpose input or output
No
No
No
19
TCK
I/O
JTAG/SWD interface: clock
No
No
Muxed with
JTAG/
SWD-TCK
20
TMS
I/O
JTAG/SWD interface: mode
select or SWDIO
No
No
Muxed with
JTAG/
SWD-TMSC
21 (1)
SOP2
I
Configuration sense-on-power 2
No
No
No
22
WLAN_XTAL_N
Analog
40-MHz crystal. Pulldown if
external TCXO is used.
N/A
N/A
N/A
23
WLAN_XTAL_P
Analog
40-MHz crystal or TCXO clock
input
N/A
N/A
N/A
24
VDD_PLL
Power
Internal analog voltage
N/A
N/A
N/A
Power
Internal analog RF supply from
analog DC/DC output
N/A
N/A
N/A
25
LDO_IN2
26
NC
—
No connect
N/A
N/A
N/A
27
NC
—
Reserved
N/A
N/A
N/A
28
NC
—
Reserved
N/A
N/A
N/A
29 (2)
ANTSEL1
O
Antenna selection control
No
User configuration
not required (3)
No
30 (2)
ANTSEL2
O
Antenna selection control
No
User configuration
not required (3)
No
31
RF_BG
RF
RF BG band: 2.4-GHz TX, RX
N/A
N/A
N/A
I
Master chip reset input. Active
low input.
N/A
N/A
N/A
Power
Internal RF power amplifier (PA)
input from PA DC/DC output
N/A
N/A
N/A
32
nRESET
33
VDD_PA_IN
34
SOP1
I
Configuration sense-on-power 1
N/A
N/A
N/A
35
SOP0
I
Configuration sense-on-power 0
N/A
N/A
N/A
36
LDO_IN1
Power
Internal Analog RF supply from
analog DC/DC output
N/A
N/A
N/A
37
VIN_DCDC_ANA
Analog DC/DC supply input
(same as battery voltage [VBAT])
N/A
N/A
N/A
38
DCDC_ANA_SW
Internal Analog DC/DC converter
switching node
N/A
N/A
N/A
(1)
(2)
(3)
12
Power
This pin has dual functions: as a SOP[2] (device operation mode), and as an external TCXO enable. As a TXCO enable, the pin is an
output on power up and driven logic high. During hibernate low-power mode, the pin is in a Hi-Z state but is pulled down for SOP mode
to disable TCXO. Because of the SOP functionality, the pin must be used as an output only.
This pin is reserved for WLAN antenna selection, controlling an external RF switch that multiplexes the RF pin of the CC3220x device
between two antennas. These pins must not be used for other functionalities.
Device firmware automatically enables the digital path during ROM boot.
Terminal Configuration and Functions
Copyright © 2016–2018, Texas Instruments Incorporated
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SWAS035B – SEPTEMBER 2016 – REVISED NOVEMBER 2018
Table 4-1. Pin Descriptions (continued)
PINS
NO.
NAME
TYPE
DESCRIPTION
SELECT AS
WAKEUP
SOURCE
CONFIGURE
ADDITIONAL
ANALOG MUX
MUXED
WITH JTAG
39
VIN_DCDC_PA
Power
PA DC/DC converter input supply
(same as battery voltage [VBAT])
N/A
N/A
N/A
40
DCDC_PA_SW_P
Power
Internal PA DC/DC converter
+ve switching node
N/A
N/A
N/A
41
DCDC_PA_SW_N
Power
Internal PA DC/DC converter
–ve switching node
N/A
N/A
N/A
42
DCDC_PA_OUT
Power
Internal PA buck DC/DC
converter output
N/A
N/A
N/A
43
DCDC_DIG_SW
Power
Internal Digital DC/DC converter
switching node
N/A
N/A
N/A
44
VIN_DCDC_DIG
Power
Digital DC/DC converter supply
input (same as battery voltage
[VBAT])
N/A
N/A
N/A
45 (4)
DCDC_ANA2_SW_P
I/O
Analog2 DC/DC converter
+ve switching node
No
User configuration
not required (3)
No
46
DCDC_ANA2_SW_N
Power
Internal Analog2 DC/DC
converter –ve switching node
N/A
N/A
N/A
47
VDD_ANA2
Power
Internal Analog2 DC/DC output
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
No
48
VDD_ANA1
Power
Internal Analog1 power supply
fed by analog2 DC/DC converter
output
49
VDD_RAM
Power
Internal SRAM LDO output
I/O
General-purpose input or output
No
User configuration
not required (3)
RTC_XTAL_P
Analog
32.768-kHz XTAL_P or external
CMOS level clock input
N/A
N/A
N/A
52 (5)
RTC_XTAL_N
Analog
32.768-kHz XTAL_N
N/A
User configuration
not required (3) (6)
No
53
GPIO30
I/O
General-purpose input or output
No
User configuration
not required (3)
No
54
VIN_IO2
Power
device supply voltage (VBAT)
N/A
N/A
N/A
55
GPIO1
General-purpose input or output
No
No
No
internal digital core voltage
N/A
N/A
N/A
50
GPIO0
51
56
VDD_DIG2
I/O
Power
I/O
Analog input (up to 1.5-V ) or
general-purpose input or output
Yes
GPIO3
I/O
Analog input (up to 1.5-V ) or
general-purpose input or output
59 (7)
GPIO4
I/O
60 (7)
GPIO5
61
(7)
See
(8)
GPIO2
No
58 (7)
No
See
(8)
No
Analog input (up to 1.5-V ) or
general-purpose input or output
Yes
See
(8)
No
I/O
Analog input (up to 1.5 V) or
general-purpose input or output
No
See
(8)
No
GPIO6
I/O
General-purpose input or output
No
No
No
62
GPIO7
I/O
General-purpose input or output
No
No
No
63
GPIO8
I/O
General-purpose input or output
No
No
No
57
(4)
(5)
(6)
(7)
(8)
Pin 45 is used by an internal DC/DC converter (ANA2_DCDC). This pin will be available automatically if the serial flash is forced in the
CC3220SF device. For the CC3220R and CC3220S devices, pin 45 can be used as GPIO_31 if a supply is provided on pin 47.
Pin 52 is used by the RTC crystal oscillator. These devices use automatic configuration sensing. Therefore, some board-level
configuration is required to use pin 52 as a digital pad. Pin 52 is used for the RTC crystal in most applications. However, in some
applications a 32.768-kHz square-wave clock might always be available onboard. When a 32.768-kHz square-wave clock is available,
the crystal can be removed to free pin 52 for digital functions. The external clock must then be applied at pin 51. For the device to
automatically detect this configuration, a 100-kΩ pullup resistor must be connected between pin 52 and the supply line. To prevent false
detection, TI recommends using pin 52 for output-only functions.
To use the digital functions, RTC_XTAL_N must be pulled high to the supply voltage using a 100-kΩ resistor.
This pin is shared by the ADC inputs and digital I/O pad cells.
Requires user configuration to enable the analog switch of the ADC channel (the switch is off by default.) The digital I/O is always
connected and must be made Hi-Z before enabling the ADC switch.
Terminal Configuration and Functions
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13
CC3220R, CC3220S, CC3220SF
SWAS035B – SEPTEMBER 2016 – REVISED NOVEMBER 2018
www.ti.com
Table 4-1. Pin Descriptions (continued)
PINS
NO.
64
NAME
GPIO9
GND_TAB
TYPE
DESCRIPTION
SELECT AS
WAKEUP
SOURCE
CONFIGURE
ADDITIONAL
ANALOG MUX
MUXED
WITH JTAG
I/O
General-purpose input or output
No
No
No
—
Thermal pad and electrical
ground
N/A
N/A
N/A
Table 4-2. Pin Attributes
PIN
NO.
1
2
3
SIGNAL
DIRECTION
LPDS (3)
GPIO10 (PN)
0
I/O
Hi-Z, Pull, Drive
I2C_SCL
1
I/O (open drain)
Hi-Z, Pull, Drive
GT_PWM06
3
O
Hi-Z, Pull, Drive
7
O
1
SDCARD_CLK
6
O
0
GT_CCP01
12
I
Hi-Z, Pull, Drive
GPIO11 (PN)
0
I/O
Hi-Z, Pull, Drive
I2C_SDA
1
I/O (open drain)
Hi-Z, Pull, Drive
GT_PWM07
3
O
Hi-Z, Pull, Drive
pXCLK (XVCLK)
4
O
0
6
I/O (open drain)
Hi-Z, Pull, Drive
UART1_RX
7
I
Hi-Z, Pull, Drive
GT_CCP02
12
I
Hi-Z, Pull, Drive
McAFSX
13
O
Hi-Z, Pull, Drive
GPIO12 (PN)
0
I/O
Hi-Z, Pull, Drive
McACLK
3
O
Hi-Z, Pull, Drive
pVS (VSYNC)
4
I
Hi-Z, Pull, Drive
5
I/O (open drain)
Hi-Z, Pull, Drive
UART0_TX
7
O
1
GT_CCP03
12
I
Hi-Z, Pull, Drive
GPIO13 (PN)
0
I/O
5
I/O (open drain)
4
I
UART0_RX
7
I
GT_CCP04
12
I
GPIO14 (PN)
0
I/O
I2C_SCL
5
I/O (open drain)
7
I/O
pDATA8 (CAM_D4)
4
I
GT_CCP05
12
I
UART1_TX
SDCARD_CMD
I2C_SCL
SIGNAL
TYPE (2)
I/O
I/O
I/O
I2C_SDA
4
5
(1)
(2)
(3)
(4)
14
PAD STATES
PIN MUX
ENCODING
SIGNAL NAME (1)
pHS (HSYNC)
GSPI_CLK
I/O
I/O
Hib (4)
nRESET = 0
Hi-Z, Pull,
Drive
Hi-Z
Hi-Z, Pull,
Drive
Hi-Z
Hi-Z, Pull,
Drive
Hi-Z
Hi-Z, Pull, Drive
Hi-Z, Pull,
Drive
Hi-Z
Hi-Z, Pull, Drive
Hi-Z, Pull,
Drive
Hi-Z
Signals names with (PN) denote the default pin name.
Signal Types: I = Input, O = Output, I/O = Input or Output.
LPDS state: Unused I/Os are in a Hi-Z state. Software may program the I/Os to be input with pull or drive (regardless of active pin
configuration), according to the need.
Hibernate mode: The I/Os are in a Hi-Z state. Software may program the I/Os to be input with pull or drive (regardless of active pin
configuration), according to the need.
Terminal Configuration and Functions
Copyright © 2016–2018, Texas Instruments Incorporated
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SWAS035B – SEPTEMBER 2016 – REVISED NOVEMBER 2018
Table 4-2. Pin Attributes (continued)
PIN
NO.
SIGNAL NAME (1)
0
I/O
5
I/O (open drain)
7
I/O
4
I
I/O
Hib (4)
nRESET = 0
Hi-Z, Pull, Drive
Hi-Z, Pull,
Drive
Hi-Z
Hi-Z, Pull,
Drive
Hi-Z
Hi-Z, Pull, Drive
Hi-Z, Pull,
Drive
Hi-Z
13
I
SDCARD_DATA0
8
I/O
GPIO16 (PN)
0
I/O
Hi-Z, Pull, Drive
GSPI_MOSI
7
I/O
Hi-Z, Pull, Drive
pDATA10 (CAM_D6)
4
I
Hi-Z, Pull, Drive
5
O
1
I/O
GT_CCP07
13
I
Hi-Z, Pull, Drive
SDCARD_CLK
8
O
0
GPIO17 (PN)
0
I/O
UART1_RX
GSPI_CS
I/O
pDATA11 (CAM_D7)
SDCARD_CMD
5
I
7
I/O
4
I
8
I/O
9
VDD_DIG1 (PN)
—
N/A
N/A
N/A
N/A
N/A
10
VIN_IO1
—
N/A
N/A
N/A
N/A
N/A
Hi-Z, Pull,
Drive
Hi-Z
11
FLASH_SPI_CLK
O
N/A
O
Hi-Z, Pull,
Drive (5)
12
FLASH_SPI_DOUT
O
N/A
O
Hi-Z, Pull,
Drive (5)
Hi-Z, Pull,
Drive
Hi-Z
13
FLASH_SPI_DIN
I
N/A
I
Hi-Z, Pull,
Drive (5)
Hi-Z
Hi-Z
14
FLASH_SPI_CS
O
N/A
O
1
Hi-Z, Pull,
Drive
Hi-Z
GPIO22 (PN)
I/O
0
I/O
McAFSX
O
7
O
Hi-Z, Pull, Drive
Hi-Z, Pull,
Drive
Hi-Z
GT_CCP04
I
5
I
Hi-Z, Pull,
Drive
Hi-Z
15
16
17
18
19
(5)
PAD STATES
LPDS (3)
GT_CCP06
UART1_TX
8
SIGNAL
DIRECTION
I2C_SDA
pDATA9 (CAM_D5)
7
PIN MUX
ENCODING
GPIO15 (PN)
GSPI_MISO
6
SIGNAL
TYPE (2)
TDI (PN)
1
I
GPIO23
0
I/O
2
O
1
I2C_SCL
9
I/O (open drain)
Hi-Z, Pull, Drive
TDO (PN)
1
O
GPIO24
0
I/O
PWM0
5
O
UART1_TX
UART1_RX
I/O
2
I
I2C_SDA
9
I/O (open drain)
GT_CCP06
4
I
McAFSX
6
O
0
I/O
1
I
8
O
GPIO28
TCK (PN)
GT_PWM03
I/O
I/O
I/O
Hi-Z, Pull, Drive
Driven high
in SWD;
Hi-Z, Pull, Drive
driven low in
4-wire JTAG
Hi-Z
Hi-Z, Pull, Drive
Hi-Z, Pull,
Drive
Hi-Z
Hi-Z, Pull, Drive
Hi-Z, Pull,
Drive
Hi-Z
To minimize leakage in some serial flash vendors during LPDS, TI recommends that the user application always enables internal weak
pulldown resistors on the FLASH_SPI_DIN, FLASH_SPI_DOUT, and FLASH_SPI_CLK pins.
Terminal Configuration and Functions
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15
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SWAS035B – SEPTEMBER 2016 – REVISED NOVEMBER 2018
www.ti.com
Table 4-2. Pin Attributes (continued)
PIN
NO.
20
21 (6)
SIGNAL NAME (1)
TMS (PN)
GPIO29
SIGNAL
TYPE (2)
I/O
PIN MUX
ENCODING
1
0
PAD STATES
SIGNAL
DIRECTION
LPDS (3)
Hib (4)
nRESET = 0
I/O
Hi-Z, Pull, Drive
Hi-Z, Pull,
Drive
Hi-Z
Driven low
Hi-Z
GPIO25
0
O
Hi-Z, Pull, Drive
GT_PWM02
9
O
Hi-Z, Pull, Drive
McAFSX
2
O
Hi-Z, Pull, Drive
TCXO_EN
N/A
(see (7))
O
0
SOP2 (PN)
N/A
(see (8))
I
Hi-Z, Pull, Drive
O
22
WLAN_XTAL_N
—
N/A
(see (7))
N/A
N/A
N/A
N/A
23
WLAN_XTAL_P
—
N/A
N/A
N/A
N/A
N/A
24
VDD_PLL
—
N/A
N/A
N/A
N/A
N/A
25
LDO_IN2
—
N/A
N/A
N/A
N/A
N/A
26
NC
—
N/A
N/A
N/A
N/A
N/A
27
NC
—
N/A
N/A
N/A
N/A
N/A
28
NC
—
N/A
N/A
N/A
N/A
N/A
29 (9)
ANTSEL1
O
0
O
Hi-Z, Pull, Drive
Hi-Z, Pull,
Drive
Hi-Z
30 (9)
ANTSEL2
O
0
O
Hi-Z, Pull, Drive
Hi-Z, Pull,
Drive
Hi-Z
31
RF_BG
—
N/A
N/A
N/A
N/A
N/A
32
nRESET
—
N/A
N/A
N/A
N/A
N/A
33
VDD_PA_IN
—
N/A
N/A
N/A
N/A
N/A
34
SOP1
—
N/A
N/A
N/A
N/A
N/A
35
SOP0
—
N/A
N/A
N/A
N/A
N/A
36
LDO_IN1
—
N/A
N/A
N/A
N/A
N/A
37
VIN_DCDC_ANA
—
N/A
N/A
N/A
N/A
N/A
38
DCDC_ANA_SW
—
N/A
N/A
N/A
N/A
N/A
39
VIN_DCDC_PA
—
N/A
N/A
N/A
N/A
N/A
40
DCDC_PA_SW_P
—
N/A
N/A
N/A
N/A
N/A
41
DCDC_PA_SW_N
—
N/A
N/A
N/A
N/A
N/A
42
DCDC_PA_OUT
—
N/A
N/A
N/A
N/A
N/A
43
DCDC_DIG_SW
—
N/A
N/A
N/A
N/A
N/A
44
VIN_DCDC_DIG
—
N/A
N/A
N/A
N/A
N/A
(6)
(7)
(8)
(9)
16
This pin has dual functions: as a SOP[2] (device operation mode), and as an external TCXO enable. As a TXCO enable, the pin is an
output on power up and driven logic high. During hibernate low-power mode, the pin is in a Hi-Z state but is pulled down for SOP mode
to disable TCXO. Because of the SOP functionality, the pin must be used as an output only.
For details on proper use, see Section 4.5.
This pin is one of three that must have a passive pullup or pulldown resistor onboard to configure the device hardware power-up mode.
For this reason, the pin must be output only when used for digital functions.
This pin is reserved for WLAN antenna selection, controlling an external RF switch that multiplexes the RF pin of the CC3220x device
between two antennas. These pins must not be used for other functionalities.
Terminal Configuration and Functions
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SWAS035B – SEPTEMBER 2016 – REVISED NOVEMBER 2018
Table 4-2. Pin Attributes (continued)
PIN
NO.
45 (10)
PIN MUX
ENCODING
SIGNAL
DIRECTION
GPIO31
0
I/O
UART0_RX
9
I
McAFSX
12
O
2
I
McAXR0
6
I/O
GSPI_CLK
7
I/O
SIGNAL NAME (1)
UART1_RX
SIGNAL
TYPE (2)
I/O
PAD STATES
LPDS (3)
Hib (4)
nRESET = 0
Hi-Z
Hi-Z
Hi-Z
DCDC_ANA2_SW_P
(PN)
—
N/A
(see (7))
N/A
N/A
N/A
N/A
46
DCDC_ANA2_SW_N
—
N/A
N/A
N/A
N/A
N/A
47
VDD_ANA2
—
N/A
N/A
N/A
N/A
N/A
48
VDD_ANA1
—
N/A
N/A
N/A
N/A
N/A
49
VDD_RAM
—
N/A
N/A
N/A
N/A
N/A
GPIO0 (PN)
0
I/O
Hi-Z, Pull, Drive
UART0_CTS
12
I
Hi-Z, Pull, Drive
McAXR1
6
I/O
Hi-Z, Pull, Drive
GT_CCP00
7
I
Hi-Z, Pull, Drive
9
I/O
Hi-Z, Pull, Drive
Hi-Z, Pull,
Drive
Hi-Z
UART1_RTS
10
O
1
UART0_RTS
3
O
1
McAXR0
4
I/O
Hi-Z, Pull, Drive
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
0
O
2
O
4
O
Hi-Z, Pull,
Drive
Hi-Z
UART0_RTS
6
O
1
GSPI_MOSI
8
O
Hi-Z, Pull, Drive
GPIO30 (PN)
0
I/O
Hi-Z, Pull, Drive
UART0_TX
9
O
1
McACLK
2
O
3
O
Hi-Z, Pull,
Drive
Hi-Z
N/A
N/A
Hi-Z, Pull,
Drive
Hi-Z
N/A
N/A
50
51
GSPI_CS
RTC_XTAL_P
I/O
—
RTC_XTAL_N (PN)
GPIO32
52 (11)
53
54
McACLK
McAXR0
McAFSX
O
I/O
4
I
GSPI_MISO
7
I/O
N/A
N/A
N/A
0
I/O
Hi-Z, Pull, Drive
3
O
1
4
I
Hi-Z, Pull, Drive
UART1_TX
6
O
1
GT_CCP01
7
I
Hi-Z, Pull, Drive
N/A
N/A
N/A
VIN_IO2
—
UART0_TX
56
Hi-Z, Pull, Drive
GT_CCP05
GPIO1 (PN)
55
Hi-Z, Pull, Drive
pCLK (PIXCLK)
VDD_DIG2
I/O
—
(10) Pin 45 is used by an internal DC/DC (ANA2_DCDC). This pin will be available automatically if serial flash is forced in the CC3220SF
device. For the CC3220R and CC3220S devices, pin 45 can be used as GPIO_31 if a supply is provided on pin 47.
(11) Pin 52 is used by the RTC crystal oscillator. These devices use automatic configuration sensing. Therefore, some board-level
configuration is required to use pin 52 as a digital pad. Pin 52 is used for RTC crystal in most applications. However, in some
applications a 32.768-kHz square-wave clock might always be available onboard. When a 32.768-kHz square-wave clock is available,
the crystal can be removed to free pin 52 for digital functions. The external clock must then be applied at pin 51. For the chip to
automatically detect this configuration, a 100-kΩ pullup resistor must be connected between pin 52 and the supply line. To prevent false
detection, TI recommends using pin 52 for output-only functions.
Terminal Configuration and Functions
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Table 4-2. Pin Attributes (continued)
PIN
NO.
SIGNAL
TYPE (2)
SIGNAL
DIRECTION
N/A
(see (7))
I
0
I/O
3
I
UART1_RX
6
I
GT_CCP02
7
I
ADC_CH1
N/A
(see (7))
I
0
I/O
6
O
1
Hi-Z, Pull, Drive
ADC_CH0
57 (12)
58
(12)
GPIO2 (PN)
UART0_RX
GPIO3 (PN)
UART1_TX
Analog input
(up to 1.5 V)
or digital I/O
Analog input
(up to 1.5 V)
or digital I/O
pDATA7 (CAM_D3)
ADC_CH2
59 (12)
GPIO4 (PN)
UART1_RX
Analog input
(up to 1.5 V)
or digital I/O
pDATA6 (CAM_D2)
61
62
63
64
4
I
N/A
(see (7))
I
0
I/O
6
I
LPDS (3)
Hib (4)
nRESET = 0
Hi-Z, Pull, Drive
Hi-Z, Pull,
Drive
Hi-Z
Hi-Z, Pull,
Drive
Hi-Z
Hi-Z, Pull, Drive
Hi-Z, Pull,
Drive
Hi-Z
Hi-Z, Pull, Drive
Hi-Z, Pull,
Drive
Hi-Z
Hi-Z, Pull,
Drive
Hi-Z
Hi-Z, Pull,
Drive
Hi-Z
Hi-Z, Pull, Drive
Hi-Z, Pull,
Drive
Hi-Z
Hi-Z, Pull, Drive
Hi-Z, Pull,
Drive
Hi-Z
N/A
N/A
N/A
Hi-Z, Pull, Drive
4
I
N/A
(see (7))
I
0
I/O
4
I
McAXR1
6
I/O
GT_CCP05
7
I
GPIO6 (PN)
0
I/O
Hi-Z, Pull, Drive
UART0_RTS
5
O
1
4
I
3
I
UART0_CTS
6
I
GT_CCP06
7
I
GPIO7 (PN)
0
I/O
McACLKX
13
O
3
O
UART0_RTS
10
O
UART0_TX
11
O
GPIO8 (PN)
0
I/O
ADC_CH3
60 (12)
PAD STATES
PIN MUX
ENCODING
SIGNAL NAME (1)
GPIO5 (PN)
pDATA5 (CAM_D1)
pDATA4 (CAM_D0)
UART1_CTS
UART1_RTS
SDCARD_IRQ
Analog input
(up to 1.5 V)
or digital I/O
I/O
I/O
6
I
7
O
GT_CCP06
12
I
GPIO9 (PN)
0
I/O
GT_PWM05
3
O
6
I/O
McAXR0
7
I/O
GT_CCP00
12
I
N/A
N/A
McAFSX
SDCARD_DATA0
GND_TAB
I/O
I/O
—
Hi-Z, Pull, Drive
Hi-Z, Pull, Drive
1
(12) This pin is shared by the ADC inputs and digital I/O pad cells.
18
Terminal Configuration and Functions
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NOTE
The ADC inputs are tolerant up to 1.8 V (see Table 5-18 for more details about the usable
range of the ADC). On the other hand, the digital pads can tolerate up to 3.6 V. Hence, take
care to prevent accidental damage to the ADC inputs. TI recommends first disabling the
output buffers of the digital I/Os corresponding to the desired ADC channel (that is,
converted to Hi-Z state), and thereafter disabling the respective pass switches (S7 [Pin 57],
S8 [Pin 58], S9 [Pin 59], and S10 [Pin 60]). For more information about drive strength and
reset states for analog-digital multiplexed pins, see Section 4.5.
4.3
Signal Descriptions
Table 4-3. Signal Descriptions
PIN
NO.
PIN
TYPE
SIGNAL
DIRECTION
ADC_CH0
57
I/O
I
ADC channel 0 input (maximum of 1.5 V)
ADC_CH1
58
I/O
I
ADC channel 1 input (maximum of 1.5 V)
ADC_CH2
59
I/O
I
ADC channel 2 input (maximum of 1.5 V)
ADC_CH3
60
I/O
I
ADC channel 3 input (maximum of 1.5 V)
ANTSEL1
29
O
O
Antenna selection control 1
ANTSEL2
30
O
O
Antenna selection control 2
TCX0_EN
21
O
O
Enable to optional external 40-MHz TCXO
WLAN_XTAL_N
22
—
—
40-MHz crystal; pull down if external TCXO is used
WLAN_XTAL_P
23
—
—
40-MHz crystal or TCXO clock input
RTC_XTAL_P
51
—
—
Connect 32.768-kHz crystal or force external CMOS
level clock
RTC_XTAL_N
52
—
—
Connect 32.768-kHz crystal or connect 100-kΩ resistor
to supply voltage
TDI
16
I/O
I
JTAG TDI. Reset default pinout.
TDO
17
I/O
O
JTAG TDO. Reset default pinout.
TCK
19
I/O
I
JTAG/SWD TCK. Reset default pinout.
TMS
20
I/O
I/O
JTAG/SWD TMS. Reset default pinout.
I/O
I/O (open drain)
I2C clock data
I/O
I/O (open drain)
I2C data
FUNCTION
ADC
Antenna
selection
SIGNAL NAME
Clock
JTAG / SWD
DESCRIPTION
1
I2C_SCL
3
5
16
I2C
2
I2C_SDA
4
6
17
Terminal Configuration and Functions
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Table 4-3. Signal Descriptions (continued)
FUNCTION
PIN
NO.
PIN
TYPE
SIGNAL
DIRECTION
GT_PWM06
1
I/O
O
Pulse-width modulated O/P
GT_CCP01
1
I/O
I
Timer capture port
GT_PWM07
2
I/O
O
Pulse-width modulated O/P
GT_CCP02
2
I/O
I
GT_CCP03
3
I/O
I
4
I/O
I
15
I/O
I
5
I/O
I
6
I/O
I
17
I/O
I
61
I/O
I
63
I/O
I
GT_CCP07
7
I/O
I
PWM0
17
I/O
O
GT_PWM03
19
I/O
O
GT_PWM02
21
O
O
50
I/O
I
SIGNAL NAME
GT_CCP04
GT_CCP05
GT_CCP06
Timers
GT_CCP00
20
64
I/O
I
GT_CCP05
53
I/O
I
GT_CCP01
55
I/O
I
GT_CCP02
57
I/O
I
GT_CCP05
60
I
I
GT_PWM05
64
I/O
O
Terminal Configuration and Functions
DESCRIPTION
Timer capture port
Pulse-width modulated output
Timer capture port
Pulse-width modulated output
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Table 4-3. Signal Descriptions (continued)
FUNCTION
GPIO
PIN
NO.
PIN
TYPE
SIGNAL
DIRECTION
GPIO10
1
I/O
I/O
GPIO11
2
I/O
I/O
GPIO12
3
I/O
I/O
GPIO13
4
I/O
I/O
GPIO14
5
I/O
I/O
GPIO15
6
I/O
I/O
GPIO16
7
I/O
I/O
GPIO17
8
I/O
I/O
GPIO22
15
I/O
I/O
GPIO23
16
I/O
I/O
GPIO24
17
I/O
I/O
GPIO28
18
I/O
I/O
GPIO29
20
I/O
I/O
GPIO25
21
O
O
GPIO31
45
I/O
I/O
GPIO0
50
I/O
I/O
GPIO32
52
I/O
O
GPIO30
53
I/O
I/O
GPIO1
55
I/O
I/O
GPIO2
57
I/O
I/O
GPIO3
58
I/O
I/O
GPIO4
59
I/O
I/O
GPIO5
60
I/O
I/O
GPIO6
61
I/O
I/O
GPIO7
62
I/O
I/O
GPIO8
63
I/O
I/O
GPIO9
64
I/O
I/O
I/O
O
SIGNAL NAME
DESCRIPTION
General-purpose input or output
General-purpose output only
General-purpose input or output
General-purpose output only
General-purpose input or output
2
15
17
McAFSX
21
I2S audio port frame sync
45
53
63
McASP
I2S or PCM
McACLK
McAXR1
McAXR0
McACLKX
3
I/O
O
52
O
O
53
I/O
O
50
I/O
I/O
60
I
I/O
45
I/O
I/O
50
I/O
I/O
52
O
O
I2S audio port data (only output mode is supported on
pin 52)
64
I/O
I/O
I2S audio port data (RX and TX)
62
I/O
O
I2S audio port clock
I2S audio port clock output
I2S audio port data 1 (RX and TX)
I2S audio port data 0 (RX and TX)
Terminal Configuration and Functions
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Table 4-3. Signal Descriptions (continued)
FUNCTION
PIN
NO.
SIGNAL NAME
Power
22
I/O
O
2
I/O
I/O (open drain)
8
I/O
I/O
I/O
I/O
7
SDCARD_CMD
6
SDCARD_DATA0
Parallel
interface
(8-bit π)
SIGNAL
DIRECTION
1
SDCARD_CLK
Multimedia card
(MMC or SD)
PIN
TYPE
64
DESCRIPTION
SD card clock data
SD card command line
SD card data
SDCARD_IRQ
63
I/O
I
Interrupt from SD card (future support)
pXCLK (XVCLK)
2
I/O
O
Free clock to parallel camera
pVS (VSYNC)
3
I/O
I
Parallel camera vertical sync
pHS (HSYNC)
4
I/O
I
Parallel camera horizontal sync
pDATA8 (CAM_D4)
5
I/O
I
Parallel camera data bit 4
pDATA9 (CAM_D5)
6
I/O
I
Parallel camera data bit 5
pDATA10 (CAM_D6)
7
I/O
I
Parallel camera data bit 6
pDATA11 (CAM_D7)
8
I/O
I
Parallel camera data bit 7
pCLK (PIXCLK)
55
I/O
I
Pixel clock from parallel camera sensor
pDATA7 (CAM_D3)
58
I/O
I
Parallel camera data bit 3
pDATA6 (CAM_D2)
59
I/O
I
Parallel camera data bit 2
pDATA5 (CAM_D1)
60
I
I
Parallel camera data bit 1
pDATA4 (CAM_D0)
61
I/O
I
Parallel camera data bit 0
VDD_DIG1
9
—
—
Internal digital core voltage
VIN_IO1
10
—
—
Device supply voltage (VBAT)
VDD_PLL
24
—
—
Internal analog voltage
LDO_IN2
25
—
—
Internal analog RF supply from analog DC/DC output
VDD_PA_IN
33
—
—
Internal PA supply voltage from PA DC/DC output
LDO_IN1
36
—
—
Internal analog RF supply from analog DC/DC output
VIN_DCDC_ANA
37
—
—
Analog DC/DC input (connected to device input supply
[VBAT])
DCDC_ANA_SW
38
—
—
Internal analog DC/DC switching node
VIN_DCDC_PA
39
—
—
PA DC/DC input (connected to device input supply
[VBAT])
DCDC_PA_SW_P
40
—
—
DCDC_PA_SW_N
41
—
—
DCDC_PA_OUT
42
—
—
Internal PA buck converter output
DCDC_DIG_SW
43
—
—
Internal digital DC/DC switching node
VIN_DCDC_DIG
44
—
—
Digital DC/DC input (connected to device input supply
[VBAT])
DCDC_ANA2_SW_P
45
—
—
Analog to DC/DC converter +ve switching node
DCDC_ANA2_SW_N
46
—
—
Internal analog to DC/DC converter –ve switching node
VDD_ANA2
47
—
—
Internal analog to DC/DC output
VDD_ANA1
48
—
—
Internal analog supply fed by ANA2 DC/DC output
VDD_RAM
49
—
—
Internal SRAM LDO output
VIN_IO2
54
—
—
Device supply voltage (VBAT)
VDD_DIG2
56
—
—
Internal digital core voltage
Terminal Configuration and Functions
Internal PA DC/DC switching node
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Table 4-3. Signal Descriptions (continued)
FUNCTION
SIGNAL NAME
GSPI_CLK
GSPI_MISO
SPI
SIGNAL
DIRECTION
5
I/O
I/O
45
I/O
I/O
6
I/O
I/O
53
I/O
I/O
DESCRIPTION
General SPI clock
General SPI MISO
8
I/O
I/O
I/O
I/O
7
I/O
I/O
52
O
O
FLASH_SPI_CLK
11
O
O
Clock to SPI serial flash (fixed default)
FLASH_SPI_DOUT
12
O
O
Data to SPI serial flash (fixed default)
FLASH_SPI_DIN
13
I
I
Data from SPI serial flash (fixed default)
FLASH_SPI_CS
14
O
O
Device select to SPI serial flash (fixed default)
1
I/O
O
GSPI_MOSI
UART1_TX
UART1_RX
UART1_RTS
UART
PIN
TYPE
50
GSPI_CS
FLASH SPI
PIN
NO.
UART1_CTS
UART0_TX
UART0_RX
UART0_CTS
UART0_RTS
7
I/O
O
16
I/O
O
55
I/O
O
58
I/O
O
2
I/O
I
8
I/O
I
17
I/O
I
45
I/O
I
57
I/O
I
59
I/O
I
50
I/O
O
62
I/O
O
61
I/O
I
3
I/O
O
53
I/O
O
55
I/O
O
62
I/O
O
4
I/O
I
45
I/O
I
57
I/O
I
50
I/O
I
61
I/O
I
50
I/O
O
52
O
O
61
I/O
O
General SPI chip select
General SPI MOSI
UART1 TX data
UART1 RX data
UART1 request-to-send (active low)
UART1 clear-to-send (active low)
UART0 TX data
UART0 RX data
UART0 clear-to-send input (active low)
UART0 request-to-send (active low)
62
I/O
O
SOP2
21 (1)
O
I
SOP1
34
—
—
Configuration sense-on-power 1
SOP0
35
—
—
Configuration sense-on-power 0
Reset
nRESET
32
—
—
Global master device reset (active low)
RF
RF_BG
31
—
—
WLAN analog RF 802.11 b/g bands
Sense-onPower
(1)
Sense-on-power 2
This pin has dual functions: as a SOP[2] (device operation mode), and as an external TCXO enable. As a TXCO enable, the pin is an
output on power up and driven logic high. During hibernate low-power mode, the pin is in a Hi-Z state but is pulled down for SOP mode
to disable TCXO. Because of the SOP functionality, the pin must be used as an output only.
Terminal Configuration and Functions
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4.4
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Pin Multiplexing
Table 4-4. Pin Multiplexing
REGISTER
ADDRESS
REGISTER NAME
PIN
ANALOG OR
SPECIAL
FUNCTION
JTAG
0x4402
E0C8
GPIO_PAD_CONFIG_10
1
—
DIGITAL FUNCTION (XXX FIELD ENCODING) (1)
0
GPIO10
1
2
I2C_SCL
0x4402
E0CC
GPIO_PAD_CONFIG_11
2
—
GPIO11
I2C_SDA
0x4402
E0D0
GPIO_PAD_CONFIG_12
3
—
GPIO12
—
3
4
5
6
7
8
9
10
11
12
13
GT_PWM06
—
—
SDCARD_
CLK
UART1_TX
—
—
—
—
GT_CCP01
—
—
GT_PWM07
pXCLK
(XVCLK)
—
SDCARD_
CMD
UART1_RX
—
—
—
—
GT_CCP02
MCAFSX
—
McACLK
pVS
(VSYNC)
I2C_SCL
—
UART0_TX
—
—
—
—
GT_CCP03
—
I2C_SDA
—
UART0_RX
—
—
—
—
GT_CCP04
—
I2C_SCL
—
GSPI_CLK
—
—
—
—
GT_CCP05
—
—
GSPI_
MISO
SDCARD_
DATA0
—
—
—
—
GT_CCP06
—
0x4402
E0D4
GPIO_PAD_CONFIG_13
4
—
GPIO13
—
—
—
pHS
(HSYNC)
0x4402
E0D8
GPIO_PAD_CONFIG_14
5
—
GPIO14
—
—
—
pDATA8
(CAM_D4)
0x4402
E0DC
GPIO_PAD_CONFIG_15
6
—
GPIO15
—
—
—
pDATA9
(CAM_D5)
0x4402
E0E0
GPIO_PAD_CONFIG_16
7
—
GPIO16
—
—
—
pDATA10
UART1_TX
(CAM_D6)
—
GSPI_
MOSI
SDCARD_
CLK
—
—
—
—
GT_CCP07
0x4402
E0E4
GPIO_PAD_CONFIG_17
8
—
GPIO17
—
—
—
pDATA11
UART1_RX
(CAM_D7)
—
GSPI_CS
SDCARD_
CMD
—
—
—
—
—
0x4402
E0F8
GPIO_PAD_CONFIG_22
15
—
GPIO22
—
—
—
—
GT_CCP04
—
McAFSX
—
—
—
—
—
—
0x4402
E0FC
GPIO_PAD_CONFIG_23
16
Muxed with
JTAG
GPIO23
TDI
UART1_TX
—
—
—
—
—
—
I2C_SCL
—
—
—
—
Muxed with
JTAG TDO
GPIO24
TDO
UART1_RX
—
GT_CCP06
PWM0
McAFSX
—
—
I2C_SDA
—
—
—
—
I2C_SDA
0x4402
E100
GPIO_PAD_CONFIG_24
17
0x4402
E140
GPIO_PAD_CONFIG_40
18
—
GPIO28
—
—
—
—
—
—
—
—
—
—
—
—
—
—
TCK
—
—
—
—
—
—
GT_
PWM03
—
—
—
—
—
0x4402
E110
GPIO_PAD_CONFIG_28
19
Muxed with
JTAG or
SWD and
TCK
0x4402
E114
GPIO_PAD_CONFIG_29
20
Muxed with
JTAG or
SWD and
TMSC
GPIO29
TMS
—
—
—
—
—
—
—
—
—
—
—
—
0x4402
E104
GPIO_PAD_CONFIG_25
21 (2)
—
GPIO25
—
McAFSX
—
—
—
—
—
—
GT_
PWM02
—
—
—
—
0x4402
E108
GPIO_PAD_CONFIG_26
29
—
ANTSEL1 (3)
—
—
—
—
—
—
—
—
—
—
—
—
—
0x4402
E10C
GPIO_PAD_CONFIG_27
30
—
ANTSEL2 (3)
—
—
—
—
—
—
—
—
—
—
—
—
—
(1)
(2)
(3)
24
Pin mux encodings with (RD) denote the default encoding after reset release.
This pin has dual functions: as a SOP[2] (device operation mode), and as an external TCXO enable. As a TXCO enable, the pin is an output on power up and driven logic high. During
hibernate low-power mode, the pin is in a Hi-Z state but is pulled down for SOP mode to disable TCXO. Because of the SOP functionality, the pin must be used as an output only.
LPDS state: Unused I/Os are in a Hi-Z state. Software may program the I/Os to be input with pull or drive (regardless of active pin configuration), according to the need.
Terminal Configuration and Functions
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Table 4-4. Pin Multiplexing (continued)
REGISTER
ADDRESS
REGISTER NAME
PIN
ANALOG OR
SPECIAL
FUNCTION
DIGITAL FUNCTION (XXX FIELD ENCODING) (1)
JTAG
0
1
2
3
4
5
6
7
8
9
10
11
12
13
45
—
GPIO31
—
UART1_RX
—
—
—
McAXR0
GSPI_CLK
—
UART0_RX
—
—
McAFSX
—
GPIO_PAD_CONFIG_0
50
—
GPIO0
—
—
UART0_
RTS
McAXR0
—
McAXR1
GT_CCP00
—
GSPI_CS
UART1_
RTS
—
UART0_
CTS
—
0x4402
E120
GPIO_PAD_CONFIG_32
52
—
GPIO32
—
McACLK
—
McAXR0
—
UART0 _
RTS
—
GSPI_
MOSI
—
—
—
—
—
0x4402
E118
GPIO_PAD_CONFIG_30
53
-—
GPIO30
—
McACLK
McAFSX
GT_CCP05
—
—
GSPI_
MISO
—
UART0_TX
—
—
—
—
pCLK
(PIXCLK)
—
UART1_TX
GT_CCP01
—
—
—
—
—
—
0x4402
E11C
GPIO_PAD_CONFIG_31
0x4402
E0A0
0x4402
E0A4
GPIO_PAD_CONFIG_1
55
—
GPIO1
—
—
UART0_TX
0x4402
E0A8
GPIO_PAD_CONFIG_2
57
—
GPIO2
—
—
UART0_RX
—
—
UART1_RX
GT_CCP02
—
—
—
—
—
—
—
UART1_TX
—
—
—
—
—
—
—
0x4402
E0AC
GPIO_PAD_CONFIG_3
58
—
GPIO3
—
—
—
pDATA7
(CAM_D3)
0x4402
E0B0
GPIO_PAD_CONFIG_4
59
—
GPIO4
—
—
—
pDATA6
(CAM_D2)
—
UART1_RX
—
—
—
—
—
—
—
—
McAXR1
GT_CCP05
—
—
—
—
—
—
0x4402
E0B4
GPIO_PAD_CONFIG_5
60
—
GPIO5
—
—
—
pDATA5
(CAM_D1)
0x4402
E0B8
GPIO_PAD_CONFIG_6
61
—
GPIO6
—
—
UART1_
CTS
pDATA4
(CAM_D0)
UART0_
RTS
UART0_
CTS
GT_CCP06
—
—
—
—
—
—
0x4402
E0BC
GPIO_PAD_CONFIG_7
62
—
GPIO7
—
—
UART1_
RTS
—
—
—
—
—
—
UART0_
RTS
UART0_TX
—
McACLKX
0x4402
E0C0
GPIO_PAD_CONFIG_8
63
—
GPIO8
—
—
—
—
—
SDCARD_
IRQ
McAFSX
—
—
—
—
GT_CCP06
—
0x4402
E0C4
GPIO_PAD_CONFIG_9
64
-—
GPIO9
—
—
GT_PWM05
—
—
SDCARD_
DATA0
McAXR0
—
—
—
—
GT_CCP00
—
Terminal Configuration and Functions
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4.5
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Drive Strength and Reset States for Analog and Digital Multiplexed Pins
Table 4-5 describes the use, drive strength, and default state of analog and digital multiplexed pins at firsttime power up and reset (nRESET pulled low).
Table 4-5. Drive Strength and Reset States for Analog and Digital Multiplexed Pins
Pin
4.6
BOARD-LEVEL CONFIGURATION AND
USE
DEFAULT STATE AT FIRST
POWER UP OR FORCED
RESET
STATE AFTER
CONFIGURATION OF
ANALOG SWITCHES
(ACTIVE, LPDS, AND HIB
POWER MODES)
MAXIMUM
EFFECTIVE
DRIVE
STRENGTH
(mA)
29
Connected to the enable pin of the RF
switch (ANTSEL1). Other use is not
recommended.
Analog is isolated. The digital I/O Determined by the I/O state, as
cell is also isolated.
are other digital I/Os.
4
30
Connected to the enable pin of the RF
switch (ANTSEL2). Other use is not
recommended.
Analog is isolated. The digital I/O Determined by the I/O state, as
cell is also isolated.
are other digital I/Os.
4
45
VDD_ANA2 (pin 47) must be shorted to the
Analog is isolated. The digital I/O Determined by the I/O state, as
input supply rail. Otherwise, the pin is driven
cell is also isolated.
are other digital I/Os.
by the ANA2 DC/DC.
4
50
Generic I/O
Analog is isolated. The digital I/O Determined by the I/O state, as
cell is also isolated.
are other digital I/Os.
4
52
The pin must have an external pullup of 100
Analog is isolated. The digital I/O Determined by the I/O state, as
kΩ to the supply rail and must be used in
cell is also isolated.
are other digital I/Os.
output signals only.
4
53
Generic I/O
Analog is isolated. The digital I/O Determined by the I/O state, as
cell is also isolated.
are other digital I/Os.
4
57
Analog signal (1.8-V absolute, 1.46-V full
scale)
ADC is isolated. The digital I/O
cell is also isolated.
Determined by the I/O state, as
are other digital I/Os.
4
58
Analog signal (1.8-V absolute, 1.46-V full
scale)
ADC is isolated. The digital I/O
cell is also isolated.
Determined by the I/O state, as
are other digital I/Os.
4
59
Analog signal (1.8-V absolute, 1.46-V full
scale)
ADC is isolated. The digital I/O
cell is also isolated.
Determined by the I/O state, as
are other digital I/Os.
4
60
Analog signal (1.8-V absolute, 1.46-V full
scale)
ADC is isolated. The digital I/O
cell is also isolated.
Determined by the I/O state, as
are other digital I/Os.
4
Pad State After Application of Power to Chip But Before Reset Release
When a stable power is applied to the CC3220x chip for the first time or when supply voltage is restored
to the proper value following a period with supply voltage less than 1.5 V, the level of each digital pad is
undefined in the period starting from the release of nRESET and until DIG_DCDC powers up. This period
is less than approximately 10 ms. During this period, pads can be internally pulled weakly in either
direction. If a certain set of pins is required to have a definite value during this prereset period, an
appropriate pullup or pulldown resistor must be used at the board level. The recommended value of this
external pull is 2.7 kΩ.
26
Terminal Configuration and Functions
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SWAS035B – SEPTEMBER 2016 – REVISED NOVEMBER 2018
Connections for Unused Pins
All unused pins must be left as no connect (NC) pins. Table 4-6 provides a list of NC pins.
Table 4-6. Connections for Unused Pins
PIN
DEFAULT FUNCTION
STATE AT RESET
AND HIBERNATE
I/O TYPE
26
NC
WLAN analog
—
Unused; leave unconnected.
27
NC
WLAN analog
—
Unused; leave unconnected.
28
NC
WLAN analog
—
Unused; leave unconnected.
DESCRIPTION
Terminal Configuration and Functions
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5 Specifications
All measurements are referenced at the device pins, unless otherwise indicated. All specifications are over
process and voltage, unless otherwise indicated.
5.1
Absolute Maximum Ratings
All measurements are referenced at the device pins unless otherwise indicated. All specifications are over process, voltage,
and operating free-air temperature range (unless otherwise noted) (1) (2)
MIN
VBAT and VIO
Pins: 37, 39, 44
MAX
3.8
V
VBAT and VIO should be
tied together
V
–0.5
VIO + 0.5
V
–0.5
2.1
V
–0.5
2.1
V
Operating temperature, TA
–40
85
°C
Storage temperature, Tstg
–55
125
°C
VIO – VBAT (differential)
Pins: 10, 54
Digital inputs
RF pins
Analog pins, crystal
(1)
(2)
–0.5
UNIT
Pins: 22, 23, 51, 52
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to VSS, unless otherwise noted.
5.2
ESD Ratings
VALUE
VESD
(1)
(2)
5.3
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±2000
Charged device model (CDM), per JEDEC specification JESD22-C101 (2)
±500
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
Power-On Hours (POH)
This information is provided solely for your convenience and does not extend or modify the warranty provided under TI's
standard terms and conditions for TI semiconductor products.
POWER-ON HOURS [POH]
(hours)
OPERATING CONDITION
TA up to 85°C (1)
(1)
28
87,600
The TX duty cycle (power amplifier ON time) is assumed to be 10% of the device POH. Of the remaining 90% of the time, the device
can be in any other state.
Specifications
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5.4
SWAS035B – SEPTEMBER 2016 – REVISED NOVEMBER 2018
Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) (1) (2)
VBAT, VIO
(shorted to VBAT)
Pins: 10, 37, 39,
44, 54
Direct battery connection
(3)
(3)
(4)
(5)
(6)
5.5
TYP
MAX
(4)
3.3
3.6
2.1
UNIT
V
Preregulated 1.85 V (5) (6)
Ambient thermal slew
(1)
(2)
MIN
–20
20
°C/minute
Operating temperature is limited by crystal frequency variation.
When operating at an ambient temperature of over 75°C, the transmit duty cycle must remain below 50% to avoid the auto-protect
feature of the power amplifier. If the auto-protect feature triggers, the device takes a maximum of 60 seconds to restart the transmission.
To ensure WLAN performance, ripple on the supply must be less than ±300 mV.
The minimum voltage specified includes the ripple on the supply voltage and all other transient dips. The brownout condition is also 2.1
V, and care must be taken when operating at the minimum specified voltage.
To ensure WLAN performance, ripple on the 1.85-V supply must be less than 2% (±40 mV).
TI recommends keeping VBAT above 1.85 V. For lower voltages, use a boost converter.
Current Consumption Summary (CC3220R, CC3220S)
TA = 25°C, VBAT = 3.6 V
TEST CONDITIONS (1)
PARAMETER
1 DSSS
TX
MCU ACTIVE
6 OFDM
NWP ACTIVE
54 OFDM
RX
(2)
TX power level = 4
190
TX power level = 0
248
TX power level = 4
182
TX power level = 0
223
TX power level = 4
160
1 DSSS
(2)
(3)
mA
59
6 OFDM
54 OFDM
TX power level = 0
269
TX power level = 4
187
TX power level = 0
245
TX power level = 4
179
TX power level = 0
220
TX power level = 4
157
1 DSSS
54 OFDM
NWP idle connected (3)
(1)
UNIT
15.3
NWP ACTIVE
RX
MAX
59
54 OFDM
1 DSSS
MCU SLEEP
TYP
272
NWP idle connected (3)
TX
MIN
TX power level = 0
mA
56
56
12.2
TX power level = 0 implies maximum power (see Figure 5-1, Figure 5-2, and Figure 5-3). TX power level = 4 implies output power
backed off approximately 4 dB.
The CC3220x system is a constant power-source system. The active current numbers scale based on the VBAT voltage supplied.
DTIM = 1
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Current Consumption Summary (CC3220R, CC3220S) (continued)
TA = 25°C, VBAT = 3.6 V
TEST CONDITIONS (1)
PARAMETER
1 DSSS
TX
6 OFDM
NWP ACTIVE
54 OFDM
MCU LPDS
RX
NWP idle connected
MCU shutdown
MCU HIBERNATE
MCU hibernate
Peak calibration current (5)
(4)
(5)
30
MIN
TYP
TX power level = 0
266
TX power level = 4
184
TX power level = 0
242
TX power level = 4
176
TX power level = 0
217
TX power level = 4
154
1 DSSS
53
54 OFDM
53
120 µA at 64KB
135 µA at 256KB
NWP LPDS (4)
MCU SHUTDOWN
(2)
(3)
MAX
UNIT
mA
135
µA
710
µA
1
µA
4.5
µA
VBAT = 3.6 V
420
VBAT = 3.3 V
450
VBAT = 2.1 V
670
VBAT = 1.85 V
700
mA
LPDS current does not include the external serial Flash. The LPDS number of reported is with retention of 256KB of MCU SRAM. The
CC3220x device can be configured to retain 0KB, 64KB, 128KB, 192KB, or 256KB of SRAM in LPDS. Each 64-KB block of MCU
retained SRAM increases LPDS current by 4 µA.
The complete calibration can take up to 17 mJ of energy from the battery over a time of 24 ms. In default mode, calibration is performed
sparingly, and typically occurs when re-enabling the NWP and when the temperature has changed by more than 20°C. There are two
additional calibration modes that may be used to reduced or completely eliminate the calibration event. For further details, see CC3120,
CC3220 SimpleLink™ Wi-Fi® and IoT Network Processor Programmer's Guide.
Specifications
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5.6
SWAS035B – SEPTEMBER 2016 – REVISED NOVEMBER 2018
Current Consumption Summary (CC3220SF)
TA = 25°C, VBAT = 3.6 V
TEST CONDITIONS (1)
PARAMETER
1 DSSS
TX
MCU ACTIVE
6 OFDM
NWP ACTIVE
54 OFDM
(2)
286
TX power level = maximum – 4
202
TX power level = maximum
255
TX power level = maximum – 4
192
TX power level = maximum
232
TX power level = maximum – 4
174
54 OFDM
TX
6 OFDM
NWP ACTIVE
54 OFDM
RX
74
TX power level = maximum
282
TX power level = maximum – 4
198
TX power level = maximum
251
TX power level = maximum – 4
188
TX power level = maximum
228
TX power level = maximum – 4
170
1 DSSS
70
54 OFDM
70
(3)
TX
6 OFDM
NWP active
54 OFDM
MCU LPDS
RX
TX power level = 0
266
TX power level = 4
184
TX power level = 0
242
TX power level = 4
176
TX power level = 0
217
TX power level = 4
154
1 DSSS
53
54 OFDM
53
120 µA at 64KB
135 µA at 256KB
NWP LPDS (4)
NWP idle connected (3)
710
MCU shutdown
1
MCU
HIBERNATE
MCU hibernate
4.5
(2)
(3)
(4)
(5)
mA
135
MCU
SHUTDOWN
(1)
mA
21.2
1 DSSS
Peak calibration current (5)
mA
25.2
1 DSSS
NWP idle connected
MAX UNIT
74
NWP idle connected (3)
MCU SLEEP
TYP
TX power level = maximum
1 DSSS
RX
MIN
VBAT = 3.6 V
420
VBAT = 3.3 V
450
VBAT = 2.1 V
670
VBAT = 1.85 V
700
µA
mA
TX power level = 0 implies maximum power (see Figure 5-1, Figure 5-2, and Figure 5-3). TX power level = 4 implies output power
backed off approximately 4 dB.
The CC3220x system is a constant power-source system. The active current numbers scale based on the VBAT voltage supplied.
DTIM = 1
LPDS current does not include the external serial flash. The LPDS number of reported is with retention of 256KB of MCU SRAM. The
CC3220x device can be configured to retain 0KB, 64KB, 128KB, 192KB, or 256KB of SRAM in LPDS. Each 64-KB block of MCU
retained SRAM increases LPDS current by 4 µA.
The complete calibration can take up to 17 mJ of energy from the battery over a period of 24 ms. Calibration is performed sparingly,
typically when coming out of HIBERNATE and only if temperature has changed by more than 20°C. The calibration event can be
controlled by a configuration file in the serial Flash..
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5.7
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TX Power and IBAT versus TX Power Level Settings
Figure 5-1, Figure 5-2, and Figure 5-3 show TX Power and IBAT versus TX power level settings for the
CC3220R and CC3220S devices at modulations of 1 DSSS, 6 OFDM, and 54 OFDM, respectively. For
the CC3220SF device, the IBAT current has an increase of approximately 10 mA to 15 mA depending on
the transmitted rate. The TX power level will remain the same.
In Figure 5-1, the area enclosed in the circle represents a significant reduction in current during transition
from TX power level 3 to level 4. In the case of lower range requirements (14-dBm output power), TI
recommends using TX power level 4 to reduce the current.
1 DSSS
19.00
280.00
Color by
17.00
264.40
TX Power (dBm)
IBAT (VBAT @ 3.6 V)
249.00
13.00
233.30
11.00
218.00
9.00
202.00
7.00
186.70
5.00
171.00
3.00
155.60
1.00
140.00
0
1
2
3
4
5
6
7
8
9
10
TX power level setting
11
12
13
14
IBAT (VBAT @ 3.6 V)(mAmp)
TX Power (dBm)
15.00
15
Figure 5-1. TX Power and IBAT vs TX Power Level Settings (1 DSSS)
6 OFDM
19.00
280.00
Color by
17.00
IBAT (VBAT @ 3.6 V)
249.00
13.00
233.30
11.00
218.00
9.00
202.00
7.00
186.70
5.00
171.00
3.00
155.60
1.00
IBAT (VBAT @ 3.6 V)(mAmp)
15.00
TX Power (dBm)
264.40
TX Power (dBm)
140.00
0
1
2
3
4
5
6
7
8
9
10
TX power level setting
11
12
13
14
15
Figure 5-2. TX Power and IBAT vs TX Power Level Settings (6 OFDM)
32
Specifications
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54 OFDM
19.00
280.00
Color by
17.00
IBAT (VBAT @ 3.6 V)
249.00
13.00
233.30
11.00
218.00
9.00
202.00
7.00
186.70
5.00
171.00
3.00
155.60
1.00
IBAT (VBAT @ 3.6 V)(mAmp)
15.00
TX Power (dBm)
264.40
TX Power (dBm)
140.00
0
1
2
3
4
5
6
7
8
9
10
TX power level setting
11
12
13
14
15
Figure 5-3. TX Power and IBAT vs TX Power Level Settings (54 OFDM)
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SWAS035B – SEPTEMBER 2016 – REVISED NOVEMBER 2018
5.8
www.ti.com
Brownout and Blackout Conditions
The device enters a brownout condition when the input voltage drops below Vbrownout (see Figure 5-4 and
Figure 5-5). This condition must be considered during design of the power supply routing, especially when
operating from a battery. High-current operations, such as a TX packet or any external activity (not
necessarily related directly to networking) can cause a drop in the supply voltage, potentially triggering a
brownout condition. The resistance includes the internal resistance of the battery, the contact resistance of
the battery holder (four contacts for 2× AA batteries), and the wiring and PCB routing resistance.
NOTE
When the device is in HIBERNATE state, brownout is not detected. Only blackout is in effect
during HIBERNATE state.
Figure 5-4. Brownout and Blackout Levels (1 of 2)
Figure 5-5. Brownout and Blackout Levels (2 of 2)
34
Specifications
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In the brownout condition, all sections of the device (including the 32-kHz RTC) shut down except for the
Hibernate module, which remains on. The current in this state can reach approximately 400 µA. The
blackout condition is equivalent to a hardware reset event in which all states within the device are lost.
Table 5-1 lists the brownout and blackout voltage levels.
Table 5-1. Brownout and Blackout Voltage Levels
VOLTAGE LEVEL
UNIT
Vbrownout
CONDITION
2.1
V
Vblackout
1.67
V
5.9
Electrical Characteristics (3.3 V, 25°C)
GPIO Pins Except 29, 30, 50, 52, and 53 (25°C) (1)
PARAMETER
TEST CONDITIONS
MIN
NOM
MAX
Pin capacitance
VIH
High-level input voltage
0.65 × VDD
VDD + 0.5 V
VIL
Low-level input voltage
–0.5
0.35 × VDD
IIH
High-level input current
5
nA
IIL
Low-level input current
5
nA
VOH
VOL
IOH
(1)
4
UNIT
CIN
High-level output voltage
Low-level output voltage
High-level
source current
pF
IL = 2 mA; configured I/O drive
strength = 2 mA;
2.4 V ≤ VDD < 3.6 V
VDD × 0.8
IL = 4 mA; configured I/O drive
strength = 4 mA;
2.4 V ≤ VDD < 3.6 V
VDD × 0.7
IL = 6 mA; configured I/O drive
strength = 6 mA;
2.4 V ≤ VDD < 3.6 V
VDD × 0.7
IL = 2 mA; configured I/O drive
strength = 2 mA;
2.1 V ≤ VDD < 2.4 V
VDD × 0.75
IL = 2 mA; configured I/O drive
strength = 2 mA;
VDD = 1.85 V
VDD × 0.7
IL = 2 mA; configured I/O drive
strength = 2 mA;
2.4 V ≤ VDD < 3.6 V
VDD × 0.2
IL = 4 mA; configured I/O drive
strength = 4 mA;
2.4 V ≤ VDD < 3.6 V
VDD × 0.2
IL = 6 mA; configured I/O drive
strength = 6 mA;
2.4 V ≤ VDD < 3.6 V
VDD × 0.2
IL = 2 mA; configured I/O drive
strength = 2 mA;
2.1 V ≤ VDD < 2.4 V
VDD × 0.25
IL = 2 mA; configured I/O drive
strength = 2 mA;
VDD = 1.85 V
VDD × 0.35
2-mA drive
2
4-mA drive
4
6-mA drive
6
V
V
V
V
mA
TI recommends using the lowest possible drive strength that is adequate for the applications. This recommendation minimizes the risk of
interference to the WLAN radio and reduces any potential degradation of RF sensitivity and performance. The default drive strength
setting is 6 mA.
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Electrical Characteristics (3.3 V, 25°C) (continued)
GPIO Pins Except 29, 30, 50, 52, and 53 (25°C) (1)
PARAMETER
IOL
Low-level
sink current
TEST CONDITIONS
MIN
2-mA drive
2
4-mA drive
4
6-mA drive
6
NOM
MAX
UNIT
mA
GPIO Pins 29, 30, 50, 52, and 53 (25°C) (1)
CIN
Pin capacitance
VIH
High-level input voltage
0.65 × VDD
VIL
Low-level input voltage
–0.5
IIH
High-level input current
IIL
Low-level input current
VOH
VOL
IOH
IOL
VIL
7
High-level output voltage
Low-level output voltage
High-level
source current,
VOH = 2.4
Low-level
sink current
50
nA
IL = 4 mA; configured I/O drive
strength = 4 mA;
2.4 V ≤ VDD < 3.6 V
VDD × 0.7
IL = 6 mA; configured I/O drive
strength = 6 mA;
2.4 V ≤ VDD < 3.6 V
VDD × 0.7
IL = 2 mA; configured I/O drive
strength = 2 mA;
2.1 V ≤ VDD < 2.4 V
VDD × 0.75
IL = 2 mA; configured I/O drive
strength = 2 mA;
VDD = 1.85 V
VDD × 0.7
IL = 2 mA; configured I/O drive
strength = 2 mA;
2.4 V ≤ VDD < 3.6 V
VDD × 0.2
IL = 4 mA; configured I/O drive
strength = 4 mA;
2.4 V ≤ VDD < 3.6 V
VDD × 0.2
IL = 6 mA; configured I/O drive
strength = 6 mA;
2.4 V ≤ VDD < 3.6 V
VDD × 0.2
IL = 2 mA; configured I/O drive
strength = 2 mA;
2.1 V ≤ VDD < 2.4 V
VDD × 0.25
IL = 2 mA; configured I/O drive
strength = 2 mA;
VDD = 1.85 V
VDD × 0.35
1.5
4-mA drive
2.5
6-mA drive
3.5
2-mA drive
1.5
4-mA drive
2.5
6-mA drive
3.5
nRESET (2)
V
nA
VDD × 0.8
V
V
mA
mA
0.6
V
(1)
IOH
Pullup current, VOH = 2.4
(VDD = 3.0 V)
5
IOL
Pulldown current, VOL = 0.4
(VDD = 3.0 V)
5
36
0.35 × VDD
V
50
IL = 2 mA; configured I/O drive
strength = 2 mA;
2.4 V ≤ VDD < 3.6 V
2-mA drive
Pin Internal Pullup and Pulldown (25°C)
(2)
pF
VDD + 0.5 V
10
µA
µA
The nRESET pin must be held below 0.6 V for the device to register a reset.
Specifications
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5.10 WLAN Receiver Characteristics
TA = 25°C, VBAT = 2.1 V to 3.6 V. Parameters are measured at the SoC pin on channel 6 (2437 MHz).
PARAMETER
TEST CONDITIONS (Mbps)
Sensitivity
(8% PER for 11b rates, 10% PER for
11g/11n rates) (10% PER) (2)
Maximum input level
(10% PER)
(1)
(2)
(3)
MIN
TYP (1)
1 DSSS
–96.0
2 DSSS
–94.0
11 CCK
–88.0
6 OFDM
–90.5
9 OFDM
–90.0
18 OFDM
–86.5
36 OFDM
–80.5
54 OFDM
–74.5
MCS7 (GF) (3)
–71.5
MCS7 (MM) (3)
–70.5
802.11b
–4.0
802.11g
–10.0
MAX
UNIT
dBm
dBm
In preregulated 1.85-V mode, RX sensitivity is 0.25- to 1-dB lower.
Sensitivity is 1-dB worse on channel 13 (2472 MHz).
Sensitivity for mixed mode is 1-dB worse.
5.11 WLAN Transmitter Characteristics
TA = 25°C, VBAT = 2.1 V to 3.6 V. Parameters measured at SoC pin on channel 6 (2437 MHz). (1) (2) (3)
TEST CONDITIONS (3)
PARAMETER
Maximum RMS output power measured at 1
dB from IEEE spectral mask or EVM
MIN
18.0
2 DSSS
18.0
11 CCK
18.3
6 OFDM
17.3
9 OFDM
17.3
18 OFDM
17.0
36 OFDM
16.0
54 OFDM
14.5
MCS7 (MM)
Transmit center frequency accuracy
(1)
(2)
(3)
TYP
1 DSSS
MAX
UNIT
dBm
13.0
–25
25
ppm
The edge channels (2412 and 2472 MHz) have reduced TX power to meet FCC emission limits.
Power of 802.11b rates are reduced to meet ETSI requirements.
In preregulated 1.85-V mode, maximum TX power is 0.25- to 0.75-dB lower for modulations higher than 18 OFDM.
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5.12 WLAN Filter Requirements
The device requires an external band-pass filter to meet the various emission standards, including FCC.
Table 5-2 presents the attenuation requirements for the band-pass filter. TI recommends using the same
filter used in the reference design to ease the process of certification.
Table 5-2. WLAN Filter Requirements
PARAMETER
FREQUENCY (MHz)
Return loss
2412 to 2484
Insertion loss (1)
2412 to 2484
Attenuation
Reference impendence
TYP
MAX
1
1.5
UNIT
10
dB
800 to 830
30
45
1600 to 1670
20
25
3200 to 3300
30
48
4000 to 4150
45
50
4800 to 5000
20
25
5600 to 5800
20
25
6400 to 6600
20
35
7200 to 7500
35
45
7500 to 10000
20
25
2412 to 2484
Filter type
(1)
MIN
dB
dB
50
Ω
Bandpass
Insertion loss directly impacts output power and sensitivity. At customer discretion, insertion loss can be relaxed to meet attenuation
requirements.
5.13 Thermal Resistance Characteristics
5.14 Thermal Resistance Characteristics for RGK Package
AIR FLOW
PARAMETER
0 lfm (C/W)
150 lfm (C/W)
250 lfm (C/W)
500 lfm (C/W)
θja
23
14.6
12.4
10.8
Ψjt
0.2
0.2
0.3
0.1
Ψjb
2.3
2.3
2.2
2.4
θjc
6.3
θjb
2.4
5.15 Timing and Switching Characteristics
5.15.1 Power Supply Sequencing
For proper operation of the CC3220x device, perform the recommended power-up sequencing as follows:
1. Tie VBAT (pins 37, 39, 44) and VIO (pins 54 and 10) together on the board.
2. Hold the RESET pin low while the supplies are ramping up. TI recommends using a simple RC circuit
(100 K ||, 1 µF, RC = 100 ms).
3. For an external RTC, ensure that the clock is stable before RESET is deasserted (high).
For timing diagrams, see Section 5.15.3.
38
Specifications
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5.15.2 Device Reset
When a device restart is required, the user may issue a negative pulse to the nRESET pin. The user must
follow one of the two alternatives to ensure the reset is properly applied:
• A negative reset pulse (on pin 32) of at least 200-ms duration
• If the above cannot be guaranteed, a pull-down resistor of 2 MΩ should be connected to pin 52
(RTC_XTAL_N). If implemented, a shorter pulse of at least 100 µs can be used.
To ensure a proper reset sequence, the user has to call the sl_stop function prior to toggling the reset. It is
preferable to use software reset instead of an external trigger when a reset is required.
5.15.3 Reset Timing
5.15.3.1 nRESET (32-kHz Crystal)
Figure 5-6 shows the reset timing diagram for the 32-kHz crystal first-time power-up and reset removal.
T1
T2
T3
T4
HW INIT
FW INIT
APP CODE
LOAD
VBAT
VIO
nRESET
STATE
POWER
RESET
OFF
APP CODE
EXECUTION
32-kHz
RTC CLK
NOTE: T1 should be ≥200 ms without a pulldown resistor on the XTAL_N pin or T1 should be ≥100 µs if there is 2-MΩ
pulldown resistor on the XTAL_N pin.
Figure 5-6. First-Time Power-Up and Reset Removal Timing Diagram (32-kHz Crystal)
Table 5-3 describes the timing requirements for the 32-kHz clock crystal first-time power-up and reset
removal.
Table 5-3. First-Time Power-Up and Reset Removal Timing Requirements (32-kHz Crystal)
ITEM
NAME
T1
Supply settling time
T2
Hardware wake-up time
T3
Time taken by ROM
firmware to initialize
hardware
T4
App code load time for
CC3220R and CC3220S
App code integrity check
time for CC3220SF
DESCRIPTION
MIN
Depends on application board
power supply, decoupling capacitor,
and so on
Includes 32.768-kHz XOSC settling
time
TYP
MAX
3
ms
25
ms
1.1
s
CC3220R
Image size (KB) × 0.75 ms
CC3220S
Image size (KB) × 1.7 ms
CC3220SF
Image size (KB) × 0.06 ms
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5.15.3.2 nRESET (External 32-kHz)
Figure 5-7 shows the reset timing diagram for the external 32-kHz first-time power-up and reset removal.
T1
T2
T3
T4
RESET
HW INIT
FW INIT
APP CODE
LOAD
VBAT
VIO
nRESET
STATE
POWER
OFF
APP CODE
EXECUTION
32-kHz
RTC CLK
Figure 5-7. First-Time Power-Up and Reset Removal Timing Diagram (External 32-kHz)
Table 5-4 describes the timing requirements for the external 32-kHz clock first-time power-up and reset
removal.
Table 5-4. First-Time Power-Up and Reset Removal Timing Requirements (External 32-kHz)
ITEM
NAME
T1
Supply settling time
T2
Hardware wake-up time
T3
Time taken by ROM
firmware to initialize
hardware
T4
App code load time for
CC3220R and CC3220S
App code integrity check
time for CC3220SF
40
Specifications
DESCRIPTION
MIN
Depends on application board power
supply, decoupling capacitor, and so
on
TYP
MAX
UNIT
3
ms
25
ms
CC3220R
5
CC3220S
10.3
CC3220SF
17.3
CC3220R
Image size (KB) × 0.75 ms
CC3220S
Image size (KB) × 1.7 ms
CC3220SF
Image size (KB) × 0.06 ms
ms
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5.15.4 Wakeup From HIBERNATE Mode
Figure 5-8 shows the timing diagram for wakeup from HIBERNATE mode.
Application software requests
entry to HIBERNATE mode
THIB_MIN
T2
T3
T4
FW INIT
APP CODE
LOAD
VBAT
VIO
nRESET
STATE
ACTIVE
HIBERNATE
HW WAKEUP
EXECUTION
32-kHz
RTC CLK
Figure 5-8. Wakeup From HIBERNATE Timing Diagram
NOTE
The 32.768-kHz crystal is kept enabled by default when the chip goes into HIBERNATE
mode.
5.15.5 Clock Specifications
The CC3220x device requires two separate clocks for its operation:
• A slow clock running at 32.768 kHz is used for the RTC.
• A fast clock running at 40 MHz is used by the device for the internal processor and the WLAN
subsystem.
The device features internal oscillators that enable the use of less-expensive crystals rather than
dedicated TCXOs for these clocks. The RTC can also be fed externally to provide reuse of an existing
clock on the system and to reduce overall cost.
5.15.5.1 Slow Clock Using Internal Oscillator
The RTC crystal connected on the device supplies the free-running slow clock. The accuracy of the slow
clock frequency must be 32.768 kHz ±150 ppm. In this mode of operation, the crystal is tied between
RTC_XTAL_P (pin 51) and RTC_XTAL_N (pin 52) with a suitable load capacitance to meet the ppm
requirement.
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Figure 5-9 shows the crystal connections for the slow clock.
51
RTC_XTAL_P
10 pF
GND
32.768 kHz
52
RTC_XTAL_N
10 pF
GND
Copyright © 2017, Texas Instruments Incorporated
Figure 5-9. RTC Crystal Connections
Table 5-5 lists the RTC crystal requirements.
Table 5-5. RTC Crystal Requirements
CHARACTERISTICS
TEST CONDITIONS
MIN
Frequency
TYP
MAX
UNIT
±150
ppm
32.768
Frequency accuracy
Initial plus temperature plus aging
Crystal ESR
32.768 kHz
kHz
70
kΩ
5.15.5.2 Slow Clock Using an External Clock
When an RTC oscillator is present in the system, the CC3220x device can accept this clock directly as an
input. The clock is fed on the RTC_XTAL_P line, and the RTC_XTAL_N line is held to VIO. The clock must
be a CMOS-level clock compatible with VIO fed to the device.
Figure 5-10 shows the external RTC input connection.
RTC_XTAL_P
32.768 kHz
VIO
Host system
100 KΩ
RTC_XTAL_N
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Figure 5-10. External RTC Input
42
Specifications
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Table 5-6 lists the external RTC digital clock requirements.
Table 5-6. External RTC Digital Clock Requirements
CHARACTERISTICS
TEST CONDITIONS
MIN
TYP
Frequency
Frequency accuracy
(Initial plus temperature plus aging)
MAX
Hz
±150
ppm
Input transition time tr, tf (10% to
90%)
tr, tf
100
Frequency input duty cycle
Vih
20%
Slow clock input voltage limits
Vil
Square wave, DC coupled
50%
ns
80%
0.65 × VIO
VIO
0
0.35 × VIO
1
Input impedance
UNIT
32768
V
Vpeak
MΩ
5
pF
5.15.5.3 Fast Clock (Fref) Using an External Crystal
The CC3220x device also incorporates an internal crystal oscillator to support a crystal-based fast clock.
The crystal is fed directly between WLAN_XTAL_P (pin 23) and WLAN_XTAL_N (pin 22) with suitable
loading capacitors.
Figure 5-11 shows the crystal connections for the fast clock.
23
WLAN_XTAL_P
6.2 pF
GND
40 MHz
WLAN_XTAL_N
22
6.2 pF
GND
SWAS031-030
NOTE: The crystal capacitance must be tuned to ensure that the PPM requirement is met. See CC31xx & CC32xx
Frequency Tuning for information on frequency tuning.
Figure 5-11. Fast Clock Crystal Connections
Table 5-7 lists the WLAN fast-clock crystal requirements.
Table 5-7. WLAN Fast-Clock Crystal Requirements
CHARACTERISTICS
TEST CONDITIONS
Frequency
MIN
TYP
MAX
40
Frequency accuracy
Initial plus temperature plus aging
Crystal ESR
40 MHz
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UNIT
MHz
±25
ppm
60
Ω
Specifications
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5.15.5.4 Fast Clock (Fref) Using an External Oscillator
The CC3220x device can accept an external TCXO/XO for the 40-MHz clock. In this mode of operation,
the clock is connected to WLAN_XTAL_P (pin 23). WLAN_XTAL_N (pin 22) is connected to GND. The
external TCXO/XO can be enabled by TCXO_EN (pin 21) from the device to optimize the power
consumption of the system.
If the TCXO does not have an enable input, an external LDO with an enable function can be used. Using
the LDO improves noise on the TCXO power supply.
Figure 5-12 shows the connection.
Vcc
XO (40 MHz)
CC3220x
TCXO_EN
EN
82 pF
WLAN_XTAL_P
OUT
WLAN_XTAL_N
Copyright © 2017, Texas Instruments Incorporated
Figure 5-12. External TCXO Input
Table 5-8 lists the external Fref clock requirements.
Table 5-8. External Fref Clock Requirements (–40°C to +85°C)
CHARACTERISTICS
TEST CONDITIONS
MIN
Frequency
TYP
Frequency accuracy (Initial plus temperature plus
aging)
45%
Sine or clipped sine wave, AC
coupled
Clock voltage limits
0.7
at 1 kHz
Phase noise at 40 MHz
44
Specifications
ppm
55%
1.2
Vpp
–125
at 10 kHz
–138.5 dBc/Hz
at 100 kHz
Input impedance
50%
UNIT
MHz
±25
Frequency input duty cycle
Vpp
MAX
40.00
–143
Resistance
12
Capacitance
kΩ
7
pF
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5.15.6 Peripherals Timing
This section describes the peripherals that are supported by the CC3220x device:
• SPI
• I2S
• GPIOs
• I2C
• IEEE 1149.1 JTAG
• ADC
• Camera parallel port
• UART
• SD Host
• Timers
5.15.6.1 SPI
5.15.6.1.1 SPI Master
The CC3220x microcontroller includes one SPI module, which can be configured as a master or slave
device. The SPI includes a serial clock with programmable frequency, polarity, and phase; a
programmable timing control between chip select and external clock generation; and a programmable
delay before the first SPI word is transmitted. Slave mode does not include a dead cycle between two
successive words.
Figure 5-13 shows the timing diagram for the SPI master.
T2
CLK
T6
T7
MISO
T9
T8
MOSI
Figure 5-13. SPI Master Timing Diagram
Table 5-9 lists the timing parameters for the SPI master.
Table 5-9. SPI Master Timing Parameters
PARAMETER
NUMBER
MIN
F
T2
(1)
Tclk (1)
D
(1)
(1)
Clock frequency
Clock period
Duty cycle
45%
tIS (1)
RX data setup time
1
T7
tIH (1)
RX data hold time
2
T8
tOD (1)
TX data output delay
T9
(1)
TX data hold time
UNIT
20
MHz
50
T6
tOH
MAX
ns
55%
ns
ns
8.5
ns
8
ns
Timing parameter assumes a maximum load of 20 pF.
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5.15.6.1.2 SPI Slave
Figure 5-14 shows the timing diagram for the SPI slave.
T2
CLK
T6
T7
MISO
T9
T8
MOSI
Figure 5-14. SPI Slave Timing Diagram
Table 5-10 lists the timing parameters for the SPI slave.
Table 5-10. SPI Slave Timing Parameters
PARAMETER
NUMBER
MIN
F (1)
T2
Tclk (1)
D
(1)
46
(1)
MAX
Clock frequency at VBAT = 3.3 V
20
Clock frequency at VBAT ≤ 2.1 V
12
Clock period
50
Duty cycle
45%
UNIT
MHz
ns
55%
T6
tIS (1)
RX data setup time
4
ns
T7
tIH (1)
RX data hold time
4
ns
(1)
T8
tOD
T9
tOH (1)
TX data output delay
20
ns
TX data hold time
24
ns
Timing parameter assumes a maximum load of 20 pF at 3.3 V.
Specifications
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5.15.6.2 I2S
The McASP interface functions as a general-purpose audio serial port optimized for multichannel audio
applications and supports transfer of two stereo channels over two data pins. The McASP consists of
transmit and receive sections that operate synchronously and have programmable clock and frame-sync
polarity. A fractional divider is available for bit-clock generation.
5.15.6.2.1 I2S Transmit Mode
Figure 5-15 shows the timing diagram for the I2S transmit mode.
T2
T1
T3
McACLKX
T4
T4
McAFSX
McAXR0/1
Figure 5-15. I2S Transmit Mode Timing Diagram
Table 5-11 lists the timing parameters for the I2S transmit mode.
Table 5-11. I2S Transmit Mode Timing Parameters
PARAMETER
NUMBER
(1)
MIN
MAX
UNIT
MHz
T1
fclk (1)
Clock frequency
9.216
T2
LP (1)
t
Clock low period
1/2 fclk
ns
T3
tHT (1)
Clock high period
1/2 fclk
ns
T4
tOH (1)
TX data hold time
22
ns
Timing parameter assumes a maximum load of 20 pF.
5.15.6.2.2 I2S Receive Mode
Figure 5-16 shows the timing diagram for the I2S receive mode.
T2
T1
T3
McACLKX
T5
T4
McAFSX
McAXR0/1
Figure 5-16. I2S Receive Mode Timing Diagram
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Table 5-12 lists the timing parameters for the I2S receive mode.
Table 5-12. I2S Receive Mode Timing Parameters
PARAMETER
NUMBER
(1)
MIN
MAX
UNIT
T1
fclk (1)
Clock frequency
9.216
MHz
T2
LP (1)
t
Clock low period
1/2 fclk
ns
T3
tHT (1)
Clock high period
1/2 fclk
ns
T4
tOH (1)
RX data hold time
0
ns
T5
(1)
RX data setup time
15
ns
tOS
Timing parameter assumes a maximum load of 20 pF.
5.15.6.3 GPIOs
All digital pins of the device can be used as general-purpose input/output (GPIO) pins. The GPIO module
consists of four GPIO blocks, each of which provides eight GPIOs. The GPIO module supports 24
programmable GPIO pins, depending on the peripheral used. Each GPIO has configurable pullup and
pulldown strength (weak 10 µA), configurable drive strength (2, 4, and 6 mA), and open-drain enable.
Figure 5-17 shows the GPIO timing diagram.
VDD
80%
20%
tGPIOF
tGPIOR
SWAS031-067
Figure 5-17. GPIO Timing Diagram
5.15.6.3.1 GPIO Output Transition Time Parameters (Vsupply = 3.3 V)
Table 5-13 lists the GPIO output transition times for Vsupply = 3.3 V.
Table 5-13. GPIO Output Transition Times (Vsupply = 3.3 V) (1) (2)
DRIVE
STRENGTH
(mA)
2
4
6
(1)
(2)
48
DRIVE STRENGTH
CONTROL BITS
2MA_EN=1
4MA_EN=0
2MA_EN=0
4MA_EN=1
2MA_EN=1
4MA_EN=1
tr
tf
UNIT
MIN
NOM
MAX
MIN
NOM
MAX
8.0
9.3
10.7
8.2
9.5
11.0
ns
6.6
7.1
7.6
4.7
5.2
5.8
ns
3.2
3.5
3.7
2.3
2.6
2.9
ns
Vsupply = 3.3 V, T = 25°C, total pin load = 30 pF
The transition data applies to the pins except the multiplexed analog-digital pins 29, 30, 45, 50, 52, and 53.
Specifications
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5.15.6.3.2 GPIO Output Transition Time Parameters (Vsupply = 1.85 V)
Table 5-14 lists the GPIO output transition times for Vsupply = 1.8 V.
Table 5-14. GPIO Output Transition Times (Vsupply = 1.85 V) (1) (2)
DRIVE
STRENGTH
(mA)
2
4
6
(1)
(2)
tr
DRIVE STRENGTH
CONTROL BITS
2MA_EN=1
4MA_EN=0
2MA_EN=0
4MA_EN=1
2MA_EN=1
4MA_EN=1
tf
UNIT
MIN
NOM
MAX
MIN
NOM
MAX
11.7
13.9
16.3
11.5
13.9
16.7
ns
13.7
15.6
18.0
9.9
11.6
13.6
ns
5.5
6.4
7.4
3.8
4.7
5.8
ns
Vsupply = 1.8 V, T = 25°C, total pin load = 30 pF
The transition data applies to the pins other than the multiplexed analog-digital pins 29, 30, 45, 50, 52, and 53.
5.15.6.3.3 GPIO Input Transition Time Parameters
Table 5-15 lists the input transition time parameters.
Table 5-15. GPIO Input Transition Time Parameters'
tr
tf
Input transition time (tr, tf), 10% to 90%
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MAX
1
3
UNIT
ns
1
3
ns
Specifications
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5.15.6.4 I2C
The CC3220x microcontroller includes one I2C module operating with standard (100 kbps) or fast
(400 kbps) transmission speeds.
Figure 5-18 shows the I2C timing diagram.
T2
T6
T5
I2CSCL
T1
T4
T7
T8
T3
T9
I2CSDA
Figure 5-18. I2C Timing Diagram
Table 5-16 lists the I2C timing parameters.
Table 5-16. I2C Timing Parameters (1)
PARAMETER
NUMBER
(1)
(2)
(3)
50
MIN
T2
tLP
Clock low period
T3
tSRT
SCL/SDA rise time
T4
tDH
Data hold time
T5
tSFT
SCL/SDA fall time
T6
tHT
Clock high time
T7
tDS
Data setup time
T8
tSCSR
T9
tSCS
See
MAX
(2)
UNIT
System clock
See
(3)
ns
NA
3
ns
(2)
System clock
tLP/2
System clock
Start condition setup time
36
System clock
Stop condition setup time
24
System clock
See
All timing is with 6-mA drive and 20-pF load.
This value depends on the value programmed in the clock period register of I2C. Maximum output frequency is the result of the minimal
value programmed in this register.
Because I2C is an open-drain interface, the controller can drive logic 0 only. Logic is the result of external pullup. Rise time depends on
the value of the external signal capacitance and external pullup register.
Specifications
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5.15.6.5 IEEE 1149.1 JTAG
The Joint Test Action Group (JTAG) port is an IEEE standard that defines a test access port (TAP) and
boundary scan architecture for digital integrated circuits and provides a standardized serial interface to
control the associated test logic. For detailed information on the operation of the JTAG port and TAP
controller, see the IEEE Standard 1149.1,Test Access Port and Boundary-Scan Architecture.
Figure 5-19 shows the JTAG timing diagram.
T2
T3
T4
TCK
T7
TMS
T8
TMS Input Valid
T9
TDI
T8
T7
TMS Input Valid
T10
T9
TDI Input Valid
T10
TDI Input Valid
T1
T11
TDO
TDO Output Valid
TDO Output Valid
Figure 5-19. JTAG Timing Diagram
Table 5-17 lists the JTAG timing parameters.
Table 5-17. JTAG Timing Parameters
PARAMETER
NUMBER
MIN
MAX
UNIT
15
MHz
T1
fTCK
Clock frequency
T2
tTCK
Clock period
1 / fTCK
ns
T3
tCL
Clock low period
tTCK / 2
ns
T4
tCH
Clock high period
tTCK / 2
ns
T7
tTMS_SU
TMS setup time
1
ns
T8
tTMS_HO
TMS hold time
16
ns
T9
tTDI_SU
TDI setup time
1
ns
T10
tTDI_HO
TDI hold time
16
T11
tTDO_HO
TDO hold time
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15
ns
Specifications
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5.15.6.6 ADC
Figure 5-20 shows the ADC clock timing diagram.
Repeats Every 16 µs
Internal Ch
2 µs
2 µs
2 µs
2 µs
2 µs
2 µs
2 µs
2 µs
2 µs
2 µs
ADC CLOCK
= 10 MHz
Sampling
4 cycles
SAR Conversion
16 cycles
Sampling
4 cycles
EXT CHANNEL 0
SAR Conversion
16 cycles
Sampling
4 cycles
INTERNAL CHANNEL
SAR Conversion
16 cycles
Sampling
4 cycles
EXT CHANNEL 1
SAR Conversion
16 cycles
INTERNAL CHANNEL
Figure 5-20. ADC Clock Timing Diagram
Table 5-18 lists the ADC electrical specifications. See CC32xx ADC Appnote for further information on
using the ADC and for application-specific examples.
Table 5-18. ADC Electrical Specifications
PARAMETER
Nbits
DESCRIPTION
TEST CONDITIONS AND
ASSUMPTIONS
MIN
Number of bits
TYP
12
INL
Integral nonlinearity
Worst-case deviation from
histogram method over full scale
(not including first and last three
LSB levels)
DNL
Differential nonlinearity
Worst-case deviation of any step
from ideal
Input range
LSB
–1
4
LSB
0
1.4
V
100
Ω
Input capacitance
ADC Pin 57
Input impedance
12
pF
0.7
ADC Pin 59
2.12
ADC Pin 60
1.17
kΩ
4
Sampling rate of each pin
F_input_max
Maximum input signal frequency
SINAD
Signal-to-noise and distortion
Input frequency DC to 300 Hz
and 1.4 Vpp sine wave input
I_active
Active supply current
Average for analog-to-digital
during conversion without
reference current
I_PD
Power-down supply current for
core supply
Total for analog-to-digital when
not active (this must be the SoC
level test)
Absolute offset error
62.5
KSPS
31
55
FCLK = 10 MHz
Gain error
kHz
60
dB
1.5
mA
1
µA
±2
mV
±2%
ADC reference voltage
Specifications
MHz
ADC Pin 58
Fsample
52
10
2.15
Number of channels
Vref
Bits
2.5
Successive approximation input
clock rate
Clock rate
UNIT
–2.5
Driving source
impedance
FCLK
MAX
1.467
V
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5.15.6.7 Camera Parallel Port
The fast camera parallel port interfaces with a variety of external image sensors, stores the image data in
a FIFO, and generates DMA requests. The camera parallel port supports 8 bits.
Figure 5-21 shows the timing diagram for the camera parallel port.
T3
T2
T4
pCLK
T6
T7
pVS, pHS
pDATA
Figure 5-21. Camera Parallel Port Timing Diagram
Table 5-19 lists the timing parameters for the camera parallel port.
Table 5-19. Camera Parallel Port Timing Parameters
PARAMETER NUMBER
MIN
pCLK
Clock frequency
T2
Tclk
Clock period
T3
tLP
T4
tHT
T6
tIS
RX data setup time
T7
tIH
RX data hold time
D
Duty cycle
MAX
UNIT
2
MHz
1/pCLK
ns
Clock low period
Tclk/2
ns
Clock high period
Tclk/2
ns
2
ns
2
ns
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45%
55%
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5.15.6.8 UART
The CC3220x device includes two UARTs with the following features:
• Programmable baud-rate generator allowing speeds up to 3 Mbps
• Separate 16-bit × 8-bit TX and RX FIFOs to reduce CPU interrupt service loading
• Programmable FIFO length, including a 1-byte-deep operation providing conventional double-buffered
interface
• FIFO trigger levels of 1/8, 1/4, 1/2, 3/4, and 7/8
• Standard asynchronous communication bits for start, stop, and parity
• Generation and detection of line-breaks
• Fully programmable serial interface characteristics:
– 5, 6, 7, or 8 data bits
– Generation and detection of even, odd, stick, or no-parity bits
– Generation of 1 or 2 stop-bits
• RTS and CTS hardware flow support
• Standard FIFO-level and end-of-transmission interrupts
• Efficient transfers using µDMA:
– Separate channels for transmit and receive
– Receive single request asserted when data is in the FIFO; burst request asserted at programmed
FIFO level
– Transmit single request asserted when there is space in the FIFO; burst request asserted at
programmed FIFO level
• System clock is used to generate the baud clock.
5.15.6.9 SD Host
CC3220x provides an interface between a local host (LH), such as an MCU and an SD memory card, and
handles SD transactions with minimal LH intervention.
The SD host does the following:
• Provides SD card access in 1-bit mode
• Deals with SD protocol at the transmission level
• Handles data packing
• Adds cyclic redundancy checks (CRC)
• Start and end bit
• Checks for syntactical correctness
The application interface sends every SD command and either polls for the status of the adapter or waits
for an interrupt request. The result is then sent back to the application interface in case of exceptions or to
warn of end-of-operation. The controller can be configured to generate DMA requests and work with
minimum CPU intervention. Given the nature of integration of this peripheral on the CC3220x platform, TI
recommends that developers use peripheral library APIs to control and operate the block. This section
emphasizes understanding the SD host APIs provided in the peripheral library of the CC3220x Software
Development Kit (SDK).
The SD Host features are as follows:
• Full compliance with SD command and response sets, as defined in the SD memory card
– Specifications, v2.0
– Includes high-capacity (size >2 GB) cards HC SD
• Flexible architecture, allowing support for new command structure.
• 1-bit transfer mode specifications for SD cards
54
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•
•
•
•
•
•
•
•
•
SWAS035B – SEPTEMBER 2016 – REVISED NOVEMBER 2018
Built-in 1024-byte buffer for read or write
– 512-byte buffer for both transmit and receive
– Each buffer is 32-bits wide by 128-words deep
32-bit-wide access bus to maximize bus throughput
Single interrupt line for multiple interrupt source events
Two slave DMA channels (1 for TX, 1 for RX)
Programmable clock generation
Integrates an internal transceiver that allows a direct connection to the SD card without external
transceiver
Supports configurable busy and response timeout
Support for a wide range of card clock frequency with odd and even clock ratio
Maximum frequency supported is 24 MHz
5.15.6.10 Timers
Programmable timers can be used to count or time external events that drive the timer input pins. The
CC3220x general-purpose timer module (GPTM) contains 16- or 32-bit GPTM blocks. Each 16- or 32-bit
GPTM block provides two 16-bit timers or counters (referred to as Timer A and Timer B) that can be
configured to operate independently as timers or event counters, or they can be concatenated to operate
as one 32-bit timer. Timers can also be used to trigger µDMA transfers.
The GPTM contains four 16- or 32-bit GPTM blocks with the following functional options:
• Operating modes:
– 16- or 32-bit programmable one-shot timer
– 16- or 32-bit programmable periodic timer
– 16-bit general-purpose timer with an 8-bit prescaler
– 16-bit input-edge count- or time-capture modes with an 8-bit prescaler
– 16-bit PWM mode with an 8-bit prescaler and software-programmable output inversion of the PWM
signal
• Counts up or counts down
• Sixteen 16- or 32-bit capture compare pins (CCP)
• User-enabled stalling when the microcontroller asserts CPU Halt flag during debug
• Ability to determine the elapsed time between the assertion of the timer interrupt and entry into the
interrupt service routine
• Efficient transfers using micro direct memory access controller (µDMA):
– Dedicated channel for each timer
– Burst request generated on timer interrupt
• Runs from system clock (80 MHz)
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6 Detailed Description
The CC3220x wireless MCU family has a rich set of peripherals for diverse application requirements. This
section briefly highlights the internal details of the CC3220x devices and offers suggestions for application
configurations.
6.1
Arm® Cortex®-M4 Processor Core Subsystem
The high-performance Cortex-M4 processor provides a low-cost platform that meets the needs of minimal
memory implementation, reduced pin count, and low power consumption, while delivering outstanding
computational performance and exceptional system response to interrupts.
• The Cortex-M4 core has low-latency interrupt processing with the following features:
– A 32-bit Arm® Thumb® instruction set optimized for embedded applications
– Handler and thread modes
– Low-latency interrupt handling by automatic processor state saving and restoration during entry and
exit
– Support for ARMv6 unaligned accesses
• Nested vectored interrupt controller (NVIC) closely integrated with the processor core to achieve lowlatency interrupt processing. The NVIC includes the following features:
– Bits of priority configurable from 3 to 8
– Dynamic reprioritization of interrupts
– Priority grouping that enables selection of preempting interrupt levels and nonpreempting interrupt
levels
– Support for tail-chaining and late arrival of interrupts, which enables back-to-back interrupt
processing without the overhead of state saving and restoration between interrupts
– Processor state automatically saved on interrupt entry and restored on interrupt exit with no
instruction overhead
– Wake-up interrupt controller (WIC) providing ultra-low-power sleep mode support
• Bus interfaces:
– Advanced high-performance bus (AHB-Lite) interfaces: system bus interfaces
– Bit-band support for memory and select peripheral that includes atomic bit-band write and read
operations
• Low-cost debug solution featuring:
– Debug access to all memory and registers in the system, including access to memory-mapped
devices, access to internal core registers when the core is halted, and access to debug control
registers even while SYSRESETn is asserted
– Serial wire debug port (SW-DP) or serial wire JTAG debug port (SWJ-DP) debug access
– Flash patch and breakpoint (FPB) unit to implement breakpoints and code patches
56
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6.2
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Wi-Fi Network Processor Subsystem
The Wi-Fi network processor subsystem includes a dedicated Arm MCU to completely offload the host
MCU along with an 802.11 b/g/n radio, baseband, and MAC with a powerful crypto engine for a fast,
secure WLAN and Internet connections with 256-bit encryption. The CC3220x devices support station, AP,
and Wi-Fi Direct modes. The device also supports WPA2 personal and enterprise security and WPS 2.0.
The Wi-Fi network processor includes an embedded IPv6, IPv4 TCP/IP stack.
6.2.1
WLAN
The WLAN features are as follows:
• 802.11b/g/n integrated radio, modem, and MAC supporting WLAN communication as a BSS station,
AP, Wi-Fi Direct client and group owner with CCK and OFDM rates in the 2.4-GHz ISM band, channels
1 to 13.
NOTE
802.11n is supported only in Wi-Fi station, Wi-Fi direct, and P2P client modes.
•
•
•
•
•
6.2.2
Autocalibrated radio with a single-ended 50-Ω interface enables easy connection to the antenna
without requiring expertise in radio circuit design.
Advanced connection manager with multiple user-configurable profiles stored in serial Flash allows
automatic fast connection to an access point without user or host intervention.
Supports all common Wi-Fi security modes for personal and enterprise networks with on-chip security
accelerators, including: WEP, WPA/WPA2 PSK, WPA2 Enterprise (802.1x).
Smart provisioning options deeply integrated within the device providing a comprehensive end-to-end
solution. With elaborate events notification to the host, enabling the application to control the
provisioning decision flow. The wide variety of Wi-Fi provisioning methods include:
– Access Point using HTTPS
– SmartConfig Technology: a 1-step, 1-time process to connect a CC3220-enabled device to the
home wireless network, removing dependency on the I/O capabilities of the host MCU; thus, it is
usable by deeply embedded applications
802.11 transceiver mode allows transmitting and receiving of proprietary data through a socket without
adding MAC or PHY headers. The 802.11 transceiver mode provides the option to select the working
channel, rate, and transmitted power. The receiver mode works with the filtering options.
Network Stack
The Network Stack features are as follows:
• Integrated IPv4, IPv6 TCP/IP stack with BSD (BSD adjacent) socket APIs for simple Internet
connectivity with any MCU, microprocessor, or ASIC
NOTE
Not all APIs are 100% BSD compliant. Not all BSD APIs are supported.
•
•
•
Support of 16 simultaneous TCP, UDP, or RAW sockets
Support of 6 simultaneous SSL\TLS sockets
Built-in network protocols:
– Static IP, LLA, DHCPv4, DHCPv6 with DAD and stateless autoconfiguration
– ARP, ICMPv4, IGMP, ICMPv6, MLD, ND
– DNS client for easy connection to the local network and the Internet
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•
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Built-in network application and utilities:
– HTTP/HTTPS
• Web page content stored on serial Flash
• RESTful APIs for setting and configuring application content
• Dynamic user callbacks
– Service discovery: Multicast DNS service discovery lets a client advertise its service without a
centralized server. After connecting to the access point, the CC3220x device provides critical
information, such as device name, IP, vendor, and port number.
– DHCP server
– Ping
Table 6-1 describes the NWP features.
Table 6-1. NWP Features
Feature
Description
802.11b/g/n station
Wi-Fi standards
802.11b/g AP supporting up to four stations
Wi-Fi Direct client and group owner
Wi-Fi channels
1 to 13
Wi-Fi security
WEP, WPA/WPA2 PSK, WPA2 enterprise (802.1x)
Wi-Fi provisioning
SmartConfig technology, Wi-Fi protected setup (WPS2), AP mode with internal HTTP web server
IP protocols
IPv4/IPv6
IP addressing
Static IP, LLA, DHCPv4, DHCPv6 with DAD
Cross layer
ARP, ICMPv4, IGMP, ICMPv6, MLD, NDP
UDP, TCP
Transport
SSLv3.0/TLSv1.0/TLSv1.1/TLSv1.2
RAW
Ping
HTTP/HTTPS web server
Network applications and
utilities
mDNS
DNS-SD
DHCP server
Host interface
UART/SPI
Device identity
Trusted root-certificate catalog
TI root-of-trust public key
Security
Power management
Enhanced power policy management uses 802.11 power save and deep-sleep power modes
Transceiver
Other
58
The CC3220S and CC3220SF variants also support:
•
Secure key storage
•
File system security
•
Software tamper detection
•
Cloning protection
•
Secure boot
•
Validate the integrity and authenticity of the run-time binary during boot
•
Initial secure programming
•
Debug security
•
JTAG and debug
Programmable RX filters with event-trigger mechanism
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6.3
SWAS035B – SEPTEMBER 2016 – REVISED NOVEMBER 2018
Security
The SimpleLink™ Wi-Fi® CC3220x Internet-on-a-Chip device enhances the security capabilities available
for development of IoT devices, while completely offloading these activities from the MCU to the
networking subsystem. The security capabilities include the following key features:
Wi-Fi and Internet Security:
• Personal and enterprise Wi-Fi security
– Personal standards
• AES (WPA2-PSK)
• TKIP (WPA-PSK)
• WEP
– Enterprise standards
• EAP Fast
• EAP PEAPv0/1
• EAP PEAPv0 TLS
• EAP PEAPv1 TLS EAP LS
• EAP TLS
• EAP TTLS TLS
• EAP TTLS MSCHAPv2
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•
•
•
•
•
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Secure sockets
– Protocol versions: SSL v3, TLS 1.0, TLS 1.1, TLS 1.2
– Powerful crypto engine for fast, secure Wi-Fi and internet connections with 256-bit AES encryption
for TLS and SSL connections
– Ciphers suites
• SL_SEC_MASK_SSL_RSA_WITH_RC4_128_SHA
• SL_SEC_MASK_SSL_RSA_WITH_RC4_128_MD5
• SL_SEC_MASK_TLS_RSA_WITH_AES_256_CBC_SHA
• SL_SEC_MASK_TLS_DHE_RSA_WITH_AES_256_CBC_SHA
• SL_SEC_MASK_TLS_ECDHE_RSA_WITH_AES_256_CBC_SHA
• SL_SEC_MASK_TLS_ECDHE_RSA_WITH_RC4_128_SHA
• SL_SEC_MASK_TLS_RSA_WITH_AES_128_CBC_SHA256
• SL_SEC_MASK_TLS_RSA_WITH_AES_256_CBC_SHA256
• SL_SEC_MASK_TLS_ECDHE_RSA_WITH_AES_128_CBC_SHA256
• SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_AES_128_CBC_SHA256
• SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_AES_128_CBC_SHA
• SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_AES_256_CBC_SHA
• SL_SEC_MASK_TLS_RSA_WITH_AES_128_GCM_SHA256
• SL_SEC_MASK_TLS_RSA_WITH_AES_256_GCM_SHA384
• SL_SEC_MASK_TLS_DHE_RSA_WITH_AES_128_GCM_SHA256
• SL_SEC_MASK_TLS_DHE_RSA_WITH_AES_256_GCM_SHA384
• SL_SEC_MASK_TLS_ECDHE_RSA_WITH_AES_128_GCM_SHA256
• SL_SEC_MASK_TLS_ECDHE_RSA_WITH_AES_256_GCM_SHA384
• SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_AES_128_GCM_SHA256
• SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_AES_256_GCM_SHA384
• SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_CHACHA20_POLY1305_SHA256
• SL_SEC_MASK_TLS_ECDHE_RSA_WITH_CHACHA20_POLY1305_SHA256
• SL_SEC_MASK_TLS_DHE_RSA_WITH_CHACHA20_POLY1305_SHA256
– Server authentication
– Client authentication
– Domain name verification
– Runtime socket upgrade to secure socket – STARTTLS
Secure HTTP server (HTTPS)
Trusted root-certificate catalog—Verifies that the CA used by the application is trusted and known
secure content delivery
TI root-of-trust public key—Hardware-based mechanism that allows authenticating TI as the genuine
origin of a given content using asymmetric keys
Secure content delivery—Allows encrypted file transfer to the system using asymmetric keys created
by the device
Code and Data Security:
• Network passwords and certificates are encrypted and signed.
• Cloning protection—Application and data files are encrypted by a unique key per device.
• Access control—Access to application and data files only by using a token provided in file creation
time. If an unauthorized access is detected, a tamper protection lockdown mechanism takes effect.
• Encrypted and Authenticated file system (not supported in CC3220R)
• Secured boot—Authentication of the application image on every boot
• Code and data encryption (not supported in CC3220R)—User application and data files are encrypted
in serial flash.
60
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•
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Code and data authentication (not supported in CC3220R)—User Application and data files are
authenticated with a public key certificate.
Offloaded crypto library for asymmetric keys, including the ability to create key-pair, sign and verify
data buffer.
Recovery mechanism
Device Security:
• Separate execution environments—Application processor and network processor run on separate Arm
cores
• Initial secure programming (not supported in CC3220R)—Allows for keeping the content confidential on
the production line
• Debug security (not supported in CC3220R)
– JTAG lock
– Debug ports lock
• True random number generator
Figure 6-1 shows the high-level structure of the CC3220R device. The network information files
(passwords and certificates) are encrypted using a device-specific key.
CC3220R
Network Processor + MCU
MCU
Peripherals
SPI and I2C
GPIO
Network Processor
Arm® Cortex®-M4
Processor
Internet
Wi-Fi®
HTTPS
MAC
TLS/SSL
Baseband
TCP/IP
Radio
256KB RAM
Internet
UART
PWM
ADC
-
OEM
Application
Serial Flash
OEM
Application
Data Files
Network Information
Figure 6-1. CC3220R High-Level Structure
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Figure 6-2 shows the high-level structure of the CC3220S and CC3220SF devices. The application image,
user data, and network information files (passwords, certificates) are encrypted using a device-specific
key.
CC3220S and CC3220SF
Network Processor + MCU
MCU
Peripherals
SPI and I2C
GPIO
UART
®
Network Processor
®
Arm Cortex -M4
Processor
Internet
Wi-Fi®
HTTPS
MAC
TLS/SSL
Baseband
TCP/IP
Radio
Internet
256KB RAM /
1MB Flash (CC3220SF)
PWM
ADC
OEM
Application
-
Serial Flash
OEM
Application
Data Files
Network Information
Figure 6-2. CC3220S and CC3220SF High-Level Structure
6.4
Power-Management Subsystem
The CC3220x power-management subsystem contains DC/DC converters to accommodate the different
voltage or current requirements of the system.
• Digital DC/DC (Pin 44)
– Input: VBAT wide voltage (2.1 to 3.6 V) or preregulated 1.85 V
• ANA1 DC/DC (Pin 37)
– Input: VBAT wide voltage (2.1 to 3.6 V)
– In preregulated 1.85-V mode, the ANA1 DC/DC converter is bypassed.
• PA DC/DC (Pin 39)
– Input: VBAT wide voltage (2.1 to 3.6 V)
– In preregulated 1.85-V mode, the PA DC/DC converter is bypassed.
• ANA2 DC/DC (Pin 47)
– Input: VBAT wide voltage (2.1 to 3.6 V) or preregulated 1.85 V
The CC3220x device is a single-chip WLAN radio solution used on an embedded system with a widevoltage supply range. The internal power management, including DC/DC converters and LDOs, generates
all of the voltages required for the device to operate from a wide variety of input sources. For maximum
flexibility, the device can operate in the modes described in Section 6.4.1 and Section 6.4.2.
6.4.1
VBAT Wide-Voltage Connection
In the wide-voltage battery connection, the device is powered directly by the battery or preregulated 3.3-V
supply. All other voltages required to operate the device are generated internally by the DC/DC
converters. This scheme supports wide-voltage operation from 2.1 to 3.6 V and is thus the most common
mode for the device.
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6.4.2
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Preregulated 1.85-V Connection
The preregulated 1.85-V mode of operation applies an external regulated 1.85 V directly at pins 10, 25,
33, 36, 37, 39, 44, 48, and 54 of the device. The VBAT and the VIO are also connected to the 1.85-V
supply. This mode provides the lowest BOM count version in which inductors used for PA DC/DC and
ANA1 DC/DC (2.2 and 1 µH) and a capacitor (22 µF) can be avoided.
In the preregulated 1.85-V mode, the regulator providing the 1.85 V must have the following
characteristics:
• Load current capacity ≥900 mA
• Line and load regulation with <2% ripple with 500-mA step current and settling time of < 4 µs with the
load step
NOTE
The regulator must be placed as close as possible to the device so that the IR drop to the
device is very low.
6.5
Low-Power Operating Mode
From a power-management perspective, the CC3220x device comprises the following two independent
subsystems:
• Arm Cortex-M4 application processor subsystem
• Networking subsystem
Each subsystem operates in one of several power states.
The Cortex-M4 application processor runs the user application loaded from an external serial Flash, or
internal Flash (in CC3220SF). The networking subsystem runs preprogrammed TCP/IP and Wi-Fi data link
layer functions.
The user program controls the power state of the application processor subsystem and can be in one of
the five modes described in Table 6-2.
Table 6-2. User Program Modes
APPLICATION PROCESSOR
(MCU) MODE (1)
DESCRIPTION
MCU active mode
MCU executing code at 80-MHz state rate
MCU sleep mode
The MCU clocks are gated off in sleep mode and the entire state of the device is retained. Sleep mode
offers instant wakeup. The MCU can be configured to wake up by an internal fast timer or by activity
from any GPIO line or peripheral.
MCU LPDS mode
State information is lost and only certain MCU-specific register configurations are retained. The MCU
can wake up from external events or by using an internal timer. (The wake-up time is less than 3 ms.)
Certain parts of memory can be retained while the MCU is in LPDS mode. The amount of memory
retained is configurable. Users can choose to preserve code and the MCU-specific setting. The MCU
can be configured to wake up using the RTC timer or by an external event on specific GPIOs as the
wake-up source.
MCU hibernate mode
The lowest power mode in which all digital logic is power-gated. Only a small section of the logic directly
powered by the input supply is retained. The RTC keeps running and the MCU supports wakeup from
an external event or from an RTC timer expiry. Wake-up time is longer than LPDS mode at about 15 ms
plus the time to load the application from serial Flash, which varies according to code size. In this mode,
the MCU can be configured to wake up using the RTC timer or external event on a GPIO.
MCU shutdown mode
The lowest power mode system-wise. All device logics are off, including the RTC. The wake-up time in
this mode is longer than hibernate at about 1.1 s. To enter or exit the shutdown mode, the state of the
nRESET line is changed (low to shut down, high to turn on).
(1)
Modes are listed in order of power consumption, with highest power modes listed first.
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The NWP can be active or in LPDS mode and takes care of its own mode transitions. When there is no
network activity, the NWP sleeps most of the time and wakes up only for beacon reception (see
Table 6-3).
Table 6-3. Networking Subsystem Modes
NETWORK PROCESSOR MODE
DESCRIPTION
Network active mode
(processing layer 3, 2, and 1)
Transmitting or receiving IP protocol packets
Network active mode
(processing layer 2 and 1)
Transmitting or receiving MAC management frames; IP processing not required.
Network active listen mode
Special power optimized active mode for receiving beacon frames (no other frames supported)
Network connected Idle
A composite mode that implements 802.11 infrastructure power save operation. The CC3220x NWP
automatically goes into LPDS mode between beacons and then wakes to active listen mode to
receive a beacon and determine if there is pending traffic at the AP. If not, the NWP returns to
LPDS mode and the cycle repeats.
Network LPDS mode
Low-power state between beacons in which the state is retained by the NWP, allowing for a rapid
wake up.
Network disabled
The network is disabled
The operation of the application and network processor ensures that the device remains in the lowest
power mode most of the time to preserve battery life.
The following examples show the use of the power modes in applications:
• A product that is continuously connected to the network in the 802.11 infrastructure power-save mode
but sends and receives little data spends most of the time in connected idle, which is a composite of
receiving a beacon frame and waiting for the next beacon.
• A product that is not continuously connected to the network but instead wakes up periodically (for
example, every 10 minutes) to send data, spends most of the time in hibernate mode, jumping briefly
to active mode to transmit data.
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6.6
SWAS035B – SEPTEMBER 2016 – REVISED NOVEMBER 2018
Memory
6.6.1
External Memory Requirements
The CC3220x device maintains a proprietary file system on the serial flash. The CC3220x file system
stores the MCU binary, service pack file, system files, configuration files, certificate files, web page files,
and user files. By using a format command through the API, users can provide the total size allocated for
the file system. The starting address of the file system cannot be set and is always at the beginning of the
serial flash. The applications microcontroller must access the serial flash memory area allocated to the file
system directly through the CC3220x file system. The applications microcontroller must not access the
serial flash memory area directly.
The file system manages the allocation of serial flash blocks for stored files according to download order,
which means that the location of a specific file is not fixed in all systems. Files are stored on serial flash
using human-readable filenames rather than file IDs. The file system API works using plain text, and file
encryption and decryption is invisible to the user. Encrypted files can be accessed only through the file
system.
All file types can have a maximum of 100 supported files in the file system. All files are stored in 4-KB
blocks and thus use a minimum of 4KB of Flash space. Fail-safe files require twice the original size and
use a minimum of 8KB. Encrypted files are counted as fail-safe in terms of space. The maximum file size
is 1MB.
Table 6-4 lists the minimum required memory consumption under the following assumptions:
• System files in use consume 64 blocks (256KB).
• Vendor files are not taken into account.
• MCU code is taken as the maximal possible size for the CC3220 with fail-safe enabled to account for
future updates, such as through OTA.
• Gang image:
– Storage for the gang image is rounded up to 32 blocks (meaning 128KB resolution).
– Gang image size depends on the actual content size of all components. Additionally, the image
should be 128KB aligned so unaligned memory is considered lost. Service pack, system files, and
the 128KB aligned memory are assumed to occupy 256KB.
• All calculations consider that the restore-to-default is enabled.
Table 6-4. Recommended Flash Size
ITEM
CC3220R and CC3220S [KB]
CC3220SF [KB]
File system allocation table
20
20
System and configuration files (1)
256
256
Service Pack (1)
264
264
MCU Code (1)
512
2048
Gang image size
256 + MCU
256 + MCU
Total
1308 + MCU
2844 + MCU
Minimal Flash size (2)
16MBit
32MBit
Recommended Flash size (2)
16MBit
32MBit
(1)
(2)
Including fail-safe.
For maximum MCU size.
NOTE
The maximum supported serial flash size is 32MB (256Mb). See the Using Serial Flash on
CC3120/CC3220 SimpleLink™ Wi-Fi® and Internet-of-Things Devices application report.
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Internal Memory
The CC3220x device includes on-chip SRAM to which application programs are downloaded and
executed. The application developer must share the SRAM for code and data. The micro direct memory
access (μDMA) controller can transfer data to and from SRAM and various peripherals. The CC3220x
ROM holds the rich set of peripheral drivers, which saves SRAM space. For more information on drivers,
see the CC3220x API list.
6.6.2.1
SRAM
The CC3220x family provides 256KB of on-chip SRAM. Internal RAM is capable of selective retention
during LPDS mode. This internal SRAM is at offset 0x2000 0000 of the device memory map.
Use the µDMA controller to transfer data to and from the SRAM.
When the device enters low-power mode, the application developer can choose to retain a section of
memory based on need. Retaining the memory during low-power mode provides a faster wakeup. The
application developer can choose the amount of memory to retain in multiples of 64KB. For more
information, see the API guide.
6.6.2.2
ROM
The internal zero-wait-state ROM of the CC3220x device is at address 0x0000 0000 of the device memory
and is programmed with the following components:
• Bootloader
• Peripheral driver library (DriverLib) release for product-specific peripherals and interfaces
The bootloader is used as an initial program loader (when the serial Flash memory is empty). The
CC3220x DriverLib software library controls on-chip peripherals with a bootloader capability. The library
performs peripheral initialization and control functions, with a choice of polled or interrupt-driven peripheral
support. The DriverLib APIs in ROM can be called by applications to reduce Flash memory requirements
and free the Flash memory for other purposes.
6.6.2.3
Flash Memory
The CC3220SF device comes with an on-chip Flash memory of 1MB that allows application code to
execute in place while freeing SRAM exclusively for read-write data. The Flash memory is used for code
and constant data sections and is directly attached to the ICODE/DCODE bus of the Cortex-M4 core. A
128-bit-wide instruction prefetch buffer allows maintenance of maximum performance for linear code or
loops that fit inside the buffer.
The Flash memory is organized as 2-KB sectors that can be independently erased. Reads and writes can
be performed at word (32-bit) level.
6.6.2.4
Memory Map
Table 6-5 describes the various MCU peripherals and how they are mapped to the processor memory. For
more information on peripherals, see the API document.
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Table 6-5. Memory Map
START ADDRESS
END ADDRESS
0x0000 0000
0x0007 FFFF
On-chip ROM (bootloader + DriverLib)
DESCRIPTION
0x0100 0000
0x010F FFFF
On-chip Flash (for user application code)
0x2000 0000
0x2003 FFFF
Bit-banded on-chip SRAM
0x2200 0000
0x23FF FFFF
Bit-band alias of 0x2000 0000 to 0x200F FFFF
0x4000 0000
0x4000 0FFF
Watchdog timer A0
0x4000 4000
0x4000 4FFF
GPIO port A0
0x4000 5000
0x4000 5FFF
GPIO port A1
0x4000 6000
0x4000 6FFF
GPIO port A2
0x4000 7000
0x4000 7FFF
GPIO port A3
0x4000 C000
0x4000 CFFF
UART A0
0x4000 D000
0x4000 DFFF
UART A1
0x4002 0000
0x4000 07FF
I2C A0 (master)
0x4002 4000
0x4002 4FFF
GPIO group 4
0x4002 0800
0x4002 0FFF
I2C A0 (slave)
0x4003 0000
0x4003 0FFF
General-purpose timer A0
0x4003 1000
0x4003 1FFF
General-purpose timer A1
0x4003 2000
0x4003 2FFF
General-purpose timer A2
0x4003 3000
0x4003 3FFF
General-purpose timer A3
0x400F7000
0x400F 7FFF
Configuration registers
0x400F E000
0x400F EFFF
System control
0x400F F000
0x400F FFFF
µDMA
0x4200 0000
0x43FF FFFF
Bit band alias of 0x4000 0000 to 0x400F FFFF
0x4401 0000
0x4401 0FFF
SDIO master
COMMENT
CC3220SF device only
0x4401 8000
0x4401 8FFF
Camera Interface
0x4401 C000
0x4401 DFFF
McASP
0x4402 0000
0x4402 1FFF
SSPI
Used for external serial Flash
0x4402 1000
0x4402 2FFF
GSPI
Used by application processor
0x4402 5000
0x4402 5FFF
MCU reset clock manager
0x4402 6000
0x4402 6FFF
MCU configuration space
0x4402 D000
0x4402 DFFF
Global power, reset, and clock manager (GPRCM)
0x4402 E000
0x4402 EFFF
MCU shared configuration
0x4402 F000
0x4402 FFFF
Hibernate configuration
0x4403 0000
0x4403 FFFF
Crypto range (includes apertures for all crypto-related
blocks as follows)
0x4403 0000
0x4403 0FFF
DTHE registers and TCP checksum
0x4403 5000
0x4403 5FFF
MD5/SHA
0x4403 7000
0x4403 7FFF
AES
0x4403 9000
0x4403 9FFF
DES
0xE000 0000
0xE000 0FFF
Instrumentation trace Macrocell™
0xE000 1000
0xE000 1FFF
Data watchpoint and trace (DWT)
0xE000 2000
0xE000 2FFF
Flash patch and breakpoint (FPB)
0xE000 E000
0xE000 EFFF
NVIC
0xE004 0000
0xE004 0FFF
Trace port interface unit (TPIU)
0xE004 1000
0xE004 1FFF
Reserved for embedded trace macrocell (ETM)
0xE004 2000
0xE00F FFFF
Reserved
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Restoring Factory Default Configuration
The device has an internal recovery mechanism that allows rolling back the file system to its predefined
factory image or restoring the factory default parameters of the device. The factory image is kept in a
separate sector on the serial flash in a secure manner and cannot be accessed from the host processor.
The following restore modes are supported:
• None—no factory restore settings
• Enable restore of factory default parameters
• Enable restore of factory image and factory default parameters
The restore process is performed by calling SW APIs, or by pulling or forcing SOP[2:0] = 110 pins and
toggling the nRESET pin from low to high.
The process is fail-safe and resumes operation if a power failure occurs before the restore is finished. The
restore process typically takes about 8 seconds, depending on the attributes of the serial Flash vendor.
6.8
6.8.1
Boot Modes
Boot Mode List
The CC3220x device implements a sense-on-power (SoP) scheme to determine the device operation
mode.
SoP values are sensed from the device pin during power up. This encoding determines the boot flow.
Before the device is taken out of reset, the SoP values are copied to a register and used to determine the
device operation mode while powering up. These values determine the boot flow as well as the default
mapping for some of the pins (JTAG, SWD, UART0). Table 6-6 lists the pull configurations.
Table 6-6. CC3220x Functional Configurations
NAME
SOP[2]
SOP[1]
SOP[0]
SoP MODE
COMMENT
UARTLOAD
Pullup
Pulldown
Pulldown
LDfrUART
Factory, lab Flash, and SRAM loads
through the UART. The device waits
indefinitely for the UART to load code.
The SOP bits then must be toggled to
configure the device in functional mode.
Also puts JTAG in 4-wire mode.
FUNCTIONAL_2WJ
Pulldown
Pulldown
Pullup
Fn2WJ
Functional development mode. In this
mode, 2-pin SWD is available to the
developer. TMS and TCK are available
for debugger connection.
FUNCTIONAL_4WJ
Pulldown
Pulldown
Pulldown
Fn4WJ
Functional development mode. In this
mode, 4-pin JTAG is available to the
developer. TDI, TMS, TCK, and TDO are
available for debugger connection.
UARTLOAD_FUNCTIONAL_4WJ
Pulldown
Pullup
Pulldown
LDfrUART_Fn4WJ
Supports Flash and SRAM load through
UART and functional mode. The MCU
bootloader tries to detect a UART break
on UART receive line. If the break signal
is present, the device enters the
UARTLOAD mode, otherwise, the device
enters the functional mode. TDI, TMS,
TCK, and TDO are available for
debugger connection.
RET_FACTORY_IMAGE
Pulldown
Pullup
Pullup
RetFactDef
When device reset is toggled, the MCU
bootloader kickstarts the procedure to
restore factory default images.
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The recommended values of pull resistors are 100 kΩ for SOP0 and SOP1 and 2.7 kΩ for SOP2. The
application can use SOP2 for other functions after chip has powered up. However, to avoid spurious SOP
values from being sensed at power up, TI strongly recommends using the SOP2 pin only for output
signals. The SOP0 and SOP1 pins are multiplexed with the WLAN analog test pins and are not available
for other functions.
7 Applications, Implementation, and Layout
NOTE
Information in the following Applications section is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI's customers are responsible for
determining suitability of components for their purposes. Customers should validate and test
their design implementation to confirm system functionality.
7.1
7.1.1
Application Information
Typical Application—CC3220x Wide-Voltage Mode
Figure 7-1 shows the schematic for an application using the CC3220x device in the wide-voltage mode of
operation. For a full operation reference design, refer to CC3220 SimpleLink™ and Internet of Things
Hardware Design Files.
NOTE
For complete reference schematics and BOM, see the CC3220x product page.
Table 7-1 lists the bill of materials for an application using the CC3220x device in wide-voltage mode.
Applications, Implementation, and Layout
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VBAT_CC
VBAT_CC
VBAT_CC
R1
10k
Optional:
Consider adding extra decoupling
capacitors if the battery cannot source
the peak currents.
VBAT_CC
C4
Antenna match. Pi
network might be
required depending on
type of antenna.
C2
1µF
C3
C6
C5
C7
E1
C2
100µF
0.1µF
C3
100µF
GND
FL1
1
GND
GND
GND
GND
IN
GND
GND
L1
GND
OUT
3
GND
GND
2
4
1
4.7µF
4.7µF
2
0.1µF
4.7µF
3.3nH
C9
0.5pF
GND GND
GND
GND
VBAT_CC
U2
U1
VIN_IO1
54
VIN_IO2
10µF
L3
GND
1uH
GND
C12
0.1µF
C13
0.1µF
GND
C14
22µF
GND
1µF
GND
VIN_DCDC_DIG
39
VIN_DCDC_PA
37
VIN_DCDC_ANA
38
DCDC_ANA_SW
48
VDD_ANA1
36
25
LDO_IN1
LDO_IN2
40
DCDC_PA_SW_P
41
DCDC_PA_SW_N
GND
C16
C15
22µF
44
42
L4
GND
C18
0.1µF
10µF
PIN 45, 46, and 47:
Refer to the BOM in the following table for
R8 notes on device-dependent configurations.
0
GND L5
C19
0.1µF
VDD_PA_IN
DCDC_DIG_SW
9
56
VDD_DIG1
VDD_DIG2
45
DCDC_ANA2_SW_P
46
DCDC_ANA2_SW_N
47
VDD_ANA2
49
VDD_RAM
24
VDD_PLL
27
28
26
NC
NC
NC
GND
10uH
C20
10µF
C21
0.1µF
C22
0.1µF
GND
GND
GND
DCDC_PA_OUT
43
C17
VBAT_CC
35
34
21
19
20
16
17
32
RF_BG
31
FLASH_SPI_CS
FLASH_SPI_DIN
FLASH_SPI_DOUT
FLASH_SPI_CLK
14
13
12
11
GPIO0
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
50
55
57
58
59
60
61
62
GPIO8
GPIO9
GPIO10
GPIO11
GPIO12
GPIO13
GPIO14
GPIO15
63
64
1
2
3
4
5
6
GPIO16
GPIO17
GPIO22
GPIO28
GPIO30
7
8
15
18
53
RTC_XTAL_P
51
R2
100k
C8
0.1µF
GND
33
2.2uH
RESET
SOP0
SOP1
SOP2
TCK
TMS
TDI
TDO
1
6
5
2
3
7
CS
SCLK
SI/SIO0
SO/SIO1
WP/SIO2
RESET/SIO3
GND
4
GND
RTC_XTAL_N
52
WLAN_XTAL_P
23
WLAN_XTAL_N
22
ANTSEL2
30
ANTSEL1
29
GND_TAB
65
CC_GPIO_00
CC_GPIO_01
CC_GPIO_02
CC_GPIO_03
CC_GPIO_04
CC_GPIO_05
CC_GPIO_06
CC_GPIO_07
TP1
CC_nReset
CC_GPIO_08
CC_GPIO_09
CC_GPIO_10
CC_GPIO_11
CC_GPIO_12
CC_GPIO_13
CC_GPIO_14
CC_GPIO_15
FLASH PROGRAMMING
INTERFACE
TP1
CC_GPIO_01
TP1
CC_GPIO_02
Add provision on the board to isolate
GPIO_01 and GPIO_02 while programming
TP1
SOP0
TP1
SOP2
CC_GPIO_16
CC_GPIO_17
CC_GPIO_22
CC_GPIO_28
CC_GPIO_30
Y1
32.768kHz
2
C23
10pF
1
C24
10pF
3
1
C11
0.1µF
VCC
CC3220SF12RGK
C25
6.2pF
GND
Y2
40 MHz
C26
6.2pF
GND
GND
G
G
10
2.2uH
C10
8
GND
VBAT_CC
4
2
L2
GND
CC_JTAG_TDO
R7
270
CC_JTAG_TDI
CC_JTAG_TMS
J1
2
4
6
1
3
5
JTAG
GND
CC_JTAG_TCK
R4
100k
R5
100k
R6
2.7k
GND
R3
100k
GND
Figure 7-1. CC3220x Wide-Voltage Mode Application Circuit
70
Applications, Implementation, and Layout
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SWAS035B – SEPTEMBER 2016 – REVISED NOVEMBER 2018
Table 7-1. Bill of Materials for CC3220x in Wide-Voltage Mode
QUANTITY
DESIGNATOR
VALUE
MANUFACTURER
PART NUMBER
DESCRIPTION
1
C1
1 µF
MuRata
GRM155R61A105KE15D
Capacitor, Ceramic, 1 µF, 10 V, ±10%, X5R, 0402
10
C2, C6, C10, C12, C13,
C14, C19, C20, C22, C23
0.1 µF
TDK
C1005X5R1A104K050BA
Capacitor, Ceramic, 0.1 µF, 10 V, ±10%, X5R, 0402
3
C3, C4, C5
4.7 µF
TDK
C1005X5R0J475M050BC
Capacitor, Ceramic, 4.7 µF, 6.3 V, ±20%, X5R, 0402
2
C7, C8
100 µF
Taiyo Yuden
LMK325ABJ107MMHT
Capacitor, Ceramic, 100 µF, 10 V, ±20%, X5R, AEC-Q200 Grade 3,
1210
1
C9
0.5 pF
MuRata
GRM1555C1HR50BA01D
Capacitor, Ceramic, 0.5 pF, 50 V, ±20%, C0G/NP0, 0402
3
C11, C18, C21
10 µF
MuRata
GRM188R60J106ME47D
Capacitor, Ceramic, 10 µF, 6.3 V, ±20%, X5R, 0603
1
C15
1 µF
TDK
C1005X5R1A105K050BB
Capacitor, Ceramic, 1 µF, 10 V, ±10%, X5R, 0402
2
C16, C17
22 µF
TDK
C1608X5R0G226M080AA
Capacitor, Ceramic, 22 µF, 4 V, ±20%, X5R, 0603
2
C24, C25
10 pF
MuRata
GRM1555C1H100JA01D
Capacitor, Ceramic, 10 pF, 50 V, ±5%, C0G/NP0, 0402
2
C26, C27
6.2 pF
MuRata
GRM1555C1H6R2CA01D
Capacitor, Ceramic, 6.2 pF, 50 V, ±5%, C0G/NP0, 0402
1
E1
2.45-GHz
Antenna
Taiyo Yuden
AH316M245001-T
ANT Bluetooth W-LAN Zigbee® WiMAX™, SMD
1
FL1
1.02 dB
TDK
DEA202450BT-1294C1-H
Multilayer Chip Band Pass Filter For 2.4 GHz W-LAN/Bluetooth, SMD
1
L1
3.3 nH
MuRata
LQG15HS3N3S02D
Inductor, Multilayer, Air Core, 3.3 nH, 0.3 A, 0.17 ohm, SMD
2
L2, L4
2.2 µH
MuRata
LQM2HPN2R2MG0L
Inductor, Multilayer, Ferrite, 2.2 µH, 1.3 A, 0.08 ohm, SMD
1
L3
1 µH
MuRata
LQM2HPN1R0MG0L
Inductor, Multilayer, Ferrite, 1 µH, 1.6 A, 0.055 ohm, SMD
1
L5 (1)
10 µH
Taiyo Yuden
CBC2518T100M
Inductor, Wirewound, Ceramic, 10 µH, 0.48 A, 0.36 ohm, SMD
1
R1
10 k
Vishay-Dale
CRCW040210K0JNED
Resistor, 10 k, 5%, 0.063 W, 0402
4
R2, R3, R4, R5
100 k
Vishay-Dale
CRCW0402100KJNED
Resistor, 100 k, 5%, 0.063 W, 0402
1
R6
2.7 k
Vishay-Dale
CRCW04022K70JNED
Resistor, 2.7 k, 5%, 0.063 W, 0402
1
R7
270
Vishay-Dale
CRCW0402270RJNED
Resistor, 270, 5%, 0.063 W, 0402
1
R8 (2)
0
Panasonic
ERJ-2GE0R00X
Resistor, 0, 5% 0.063W, 0402
1
U1
MX25R
Macronix International
Co., LTD
MX25R3235FM1IL0
Ultra-Low Power, 32-Mbit [x 1/x 2/x 4] CMOS MXSMIO
(Serial Multi I/O) Flash Memory, SOP-8
1
U2
CC3220
Texas Instruments
CC3220SF12RGK
SimpleLink™ Wi-Fi® and internet-of-things Solution, a Single-Chip
Wireless MCU, RGK0064B
1
Y1
Crystal
Abracon Corportation
ABS07-32.768KHZ-9-T
Crystal, 32.768 KHz, 9PF, SMD
Y2
Crystal
Epson
Q24FA20H0039600
Crystal, 40 MHz, 8pF, SMD
1
(1)
(2)
For CC3220SF device, L5 is populated. For CC3220R and CC3220S devices, L5 is not populated.
For CC3220SF device, R8 is not populated. For CC3220R and CC3220S devices if R8 is populated, Pin 47 can be used as GPIO_31.
Applications, Implementation, and Layout
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71
CC3220R, CC3220S, CC3220SF
SWAS035B – SEPTEMBER 2016 – REVISED NOVEMBER 2018
7.1.2
www.ti.com
Typical Application Schematic—CC3220x Preregulated, 1.85-V Mode
Figure 7-2 shows the typical application schematic using the CC3220x in preregulated, 1.85-V mode of operation. For addition information on this
mode of operation please contact your TI representative.
1.85V
1.85V
1.85V
R1
10k
Optional:
Consider adding extra decoupling
capacitors if the battery cannot source
the peak currents.
1.85V
C3
Antenna match. Pi
network might be
required depending on
type of antenna.
C1
1µF
C2
C5
C4
C6
E1
4.7µF
4.7µF
C7
100µF
0.1µF
C8
100µF
GND
GND
GND
GND
IN
GND
GND
L1
FL1
1
GND
GND
OUT
3
GND
GND
2
4
1
4.7µF
2
0.1µF
3.3nH
C9
0.5pF
GND GND
GND
GND
1.85V
U1
1.85V
U2
C13
0.1µF
GND
VIN_DCDC_DIG
39
VIN_DCDC_PA
37
VIN_DCDC_ANA
38
DCDC_ANA_SW
48
VDD_ANA1
LDO_IN1
LDO_IN2
40
DCDC_PA_SW_P
41
DCDC_PA_SW_N
42
DCDC_PA_OUT
33
VDD_PA_IN
43
DCDC_DIG_SW
9
56
VDD_DIG1
VDD_DIG2
45
DCDC_ANA2_SW_P
46
DCDC_ANA2_SW_N
47
VDD_ANA2
49
VDD_RAM
24
VDD_PLL
27
28
26
NC
NC
NC
1µF
GND
GND
L2
2.2uH
C16
1.85V
C17
0.1µF
10µF
PIN 45, 46, and 47:
Refer to the BOM in the following table for
notes on device-dependent configurations.
GND
C18
0.1µF
GND
L3
10uH
C19
10µF
GND
C20
0.1µF
C21
0.1µF
GND
GND
1.85V
35
34
21
SOP0
SOP1
SOP2
19
20
16
17
TCK
TMS
TDI
TDO
32
RF_BG
31
FLASH_SPI_CS
FLASH_SPI_DIN
FLASH_SPI_DOUT
FLASH_SPI_CLK
14
13
12
11
GPIO0
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
50
55
57
58
59
60
61
62
GPIO8
GPIO9
GPIO10
GPIO11
GPIO12
GPIO13
GPIO14
GPIO15
63
64
1
2
3
4
5
6
GPIO16
GPIO17
GPIO22
GPIO28
GPIO30
7
8
15
18
53
RTC_XTAL_P
51
R2
100k
C10
0.1µF
GND
36
25
GND
C14
C15
22µF
44
RESET
1
6
5
2
3
7
CS
SCLK
SI/SIO0
SO/SIO1
WP/SIO2
RESET/SIO3
GND
4
GND
RTC_XTAL_N
52
WLAN_XTAL_P
23
WLAN_XTAL_N
22
ANTSEL2
30
ANTSEL1
29
CC_GPIO_00
CC_GPIO_01
CC_GPIO_02
CC_GPIO_03
CC_GPIO_04
CC_GPIO_05
CC_GPIO_06
CC_GPIO_07
TP1
CC_nReset
CC_GPIO_08
CC_GPIO_09
CC_GPIO_10
CC_GPIO_11
CC_GPIO_12
CC_GPIO_13
CC_GPIO_14
CC_GPIO_15
FLASH PROGRAMMING
INTERFACE
TP2
CC_GPIO_01
TP3
CC_GPIO_02
Add provision on the board to isolate
GPIO_01 and GPIO_02 while programming
TP4
SOP0
TP5
SOP2
CC_GPIO_16
CC_GPIO_17
CC_GPIO_22
CC_GPIO_28
CC_GPIO_30
Y1
32.768kHz
2
C22
10pF
1
C23
10pF
3
1
C12
0.1µF
VIN_IO2
GND_TAB
CC3220SF12RGK
C24
6.2pF
65
GND
Y2
40 MHz
C25
6.2pF
GND
GND
G
G
GND
VIN_IO1
54
VCC
GND
4
2
C11
0.1µF
10
8
R7
270
GND
J1
2
4
6
1
3
5
CC_JTAG_TDO
CC_JTAG_TDI
R3
100k
R4
100k
CC_JTAG_TMS
R5
2.7k
GND
JTAG
CC_JTAG_TCK
R6
100k
GND
GND
Figure 7-2. CC3220x Preregulated 1.85-V Mode Application Circuit
72
Applications, Implementation, and Layout
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SWAS035B – SEPTEMBER 2016 – REVISED NOVEMBER 2018
Table 7-2 lists the bill of materials for an application using the CC3120R device in preregulated 1.85-V mode.
Table 7-2. Bill of Materials for CC3220x Preregulated, 1.85-V Mode
QUANTITY
DESIGNATOR
VALUE
MANUFACTURER
PART NUMBER
DESCRIPTION
1
C1
1 µF
MuRata
GRM155R61A105KE15D
10
C2, C6, C10, C11, C12,
C13, C17, C18, C20, C21
0.1 µF
TDK
C1005X5R1A104K050BA
3
C3, C4, C5
4.7 µF
TDK
C1005X5R0J475M050BC
Capacitor, Ceramic, 4.7 µF, 6.3 V, ±20%, X5R, 0402
2
C7, C8
100 µF
Taiyo Yuden
LMK325ABJ107MMHT
Capacitor, Ceramic, 100 µF, 10 V, ± 20%, X5R, AEC-Q200 Grade 3,
1210
1
C9
0.5 pF
MuRata
GRM1555C1HR50BA01D
Capacitor, Ceramic, 0.5 pF, 50 V, ±20%, C0G/NP0, 0402
1
C14
1 µF
TDK
C1005X5R1A105K050BB
Capacitor, Ceramic, 1 µF, 10 V, ±10%, X5R, 0402
1
C15
22 µF
TDK
C1608X5R0G226M080AA
Capacitor, Ceramic, 22 µF, 4 V, ±20%, X5R, 0603
2
C16, C19
10 µF
MuRata
GRM188R60J106ME47D
Capacitor, Ceramic, 10 µF, 6.3 V, ±20%, X5R, 0603
2
C22, C23
10 pF
MuRata
GRM1555C1H100JA01D
Capacitor, Ceramic, 10 pF, 50 V, ±5%, C0G/NP0, 0402
2
C24, C25
6.2 pF
MuRata
GRM1555C1H6R2CA01D
Capacitor, Ceramic, 6.2 pF, 50 V, ±5%, C0G/NP0, 0402
1
U1
MX25R
Macronix International
Co. LTD
MX25R3235FM1IL0
Ultra-low power, 32-Mbit [x 1/x 2/x 4] CMOS MXSMIO
(Serial Multi I/O) Flash Memory, SOP-8
1
E1
2.45-GHz
Antenna
Taiyo Yuden
AH316M245001-T
1
FL1
1.02 dB
TDK
DEA202450BT-1294C1-H
Multilayer Chip Band Pass Filter For 2.4GHz W-LAN/Bluetooth, SMD
1
L1
3.3 nH
MuRata
LQG15HS3N3S02D
Inductor, Multilayer, Air Core, 3.3 nH, 0.3 A, 0.17 ohm, SMD
1
L2
2.2 µH
MuRata
LQM2HPN2R2MG0L
Inductor, Multilayer, Ferrite, 2.2 µH, 1.3 A, 0.08 ohm, SMD
(1)
Capacitor, Ceramic, 1 µF, 10 V, ±10%, X5R, 0402
Capacitor, Ceramic, 0.1 µF, 10 V, ±10%, X5R, 0402
ANT Bluetooth W-LAN Zigbee® WiMAX™, SMD
1
L3
10 µH
Taiyo Yuden
CBC2518T100M
Inductor, Wirewound, Ceramic, 10 µH, 0.48 A, 0.36 ohm, SMD
1
R1
10 k
Vishay-Dale
CRCW040210K0JNED
Resistor, 10 k, 5%, 0.063 W, 0402
4
R2, R3, R4, R6
100 k
Vishay-Dale
CRCW0402100KJNED
Resistor, 100 k, 5%, 0.063 W, 0402
1
R5
2.7 k
Vishay-Dale
CRCW04022K70JNED
Resistor, 2.7 k, 5%, 0.063 W, 0402
1
R7
270
Vishay-Dale
CRCW0402270RJNED
Resistor, 270, 5%, 0.063 W, 0402
1
U2
CC3220
Texas Instruments
CC3220SF12RGK
SimpleLink™ Wi-Fi® and internet-of-things solution, a Single-Chip
Wireless MCU, RGK0064B
1
Y1
Crystal
Abracon Corporation
ABS07-32.768KHZ-9-T
Crystal, 32.768 kHZ, 9PF, SMD
1
Y2
Crystal
Epson
Q24FA20H0039600
Crystal, 40 MHz, 8pF, SMD
(1)
For CC3220SF device, L3 is populated. For CC3220R and CC3220S devices, L3 is not populated and Pin 47 can be used as GPIO_31.
Applications, Implementation, and Layout
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CC3220R, CC3220S, CC3220SF
SWAS035B – SEPTEMBER 2016 – REVISED NOVEMBER 2018
7.2
www.ti.com
PCB Layout Guidelines
This section details the PCB guidelines to speed up the PCB design using the CC3220x VQFN device.
Follow these guidelines ensures that the design will minimize the risk with regulatory certifications
including FCC, ETSI, and CE. For more information, see CC3120 and CC3220 SimpleLink™ Wi-Fi® and
IoT Solution Layout Guidelines.
7.2.1
General PCB Guidelines
Use the following PCB guidelines:
• Verify the recommended PCB stackup in the PCB design guidelines, as well as the recommended
layers for signals and ground.
• Ensure that the PCB footprint of the VQFN follows the information in Section 9.
• Ensure that the GND and solder paste of the VQFN PCB follow the recommendations provided in
CC3120 and CC3220 SimpleLink™ Wi-Fi® and IoT Solution Layout Guidelines.
• Decoupling capacitors must be as close as possible to the VQFN device.
7.2.2
Power Layout and Routing
Three critical DC/DC converters must be considered for the CC3220x device.
• Analog DC/DC converter
• PA DC/DC converter
• Digital DC/DC converter
Each converter requires an external inductor and capacitor that must be laid out with care. DC current
loops are formed when laying out the power components.
7.2.2.1
Design Considerations
The following design guidelines must be followed when laying out the CC3220x device:
• Route all of the input decoupling capacitors (C11, C13, and C18) on L2 using thick traces, to isolate
the RF ground from the noisy supply ground. This step is also required to meet the IEEE spectral mask
specifications.
• Maintain the thickness of power traces to be greater than 12 mils. Take special consideration for power
amplifier supply lines (pins 33, 40, 41, and 42), and all input supply pins (pins 37, 39, and 44).
• Ensure the shortest grounding loop for the PLL supply decoupling capacitor (pin 24).
• Place all decoupling capacitors as close to the respective pins as possible.
• Power budget: The CC3220x device can consume up to 450 mA for 3.3 V, 670 mA for 2.1 V, and 700
mA for 1.85 V, for 24 ms during the calibration cycle.
• Ensure the power supply is designed to source this current without any issues. The complete
calibration (TX and RX) can take up to 17 mJ of energy from the battery over a time of 24 ms.
• The CC3220x device contains many high-current input pins. Ensure the trace feeding these pins is
capable of handling the following currents:
– VIN_DCDC_PA input (pin 39) maximum is 1 A
– VIN_DCDC_ANA input (pin 37) maximum is 600 mA
– VIN_DCDC_DIG input (pin 44) maximum is 500 mA
– DCDC_PA_SW_P (pin 40) and DCDC_PA_SW_N (pin 41) switching nodes maximum is 1 A
– DCDC_PA_OUT output node (pin 42) maximum 1 A
– DCDC_ANA_SW switching node (pin 38) maximum is 600 mA
– DCDC_DIG_SW switching node (pin 43) maximum is 500 mA
– VDD_PA_IN supply (pin 33) maximum is 500 mA
74
Applications, Implementation, and Layout
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SWAS035B – SEPTEMBER 2016 – REVISED NOVEMBER 2018
Figure 7-3 shows the ground routing for the input decoupling capacitors.
Figure 7-3. Ground Routing for the Input Decoupling Capacitors
The ground return for the input capacitors are routed on L2 to reduce the EMI and improve the spectral
mask. This routing must be strictly followed because it is critical for the overall performance of the device.
7.2.3
Clock Interfaces
The following guidelines are for the slow clock.
• The 32.768-kHz crystal must be placed close to the VQFN package.
• Ensure that the load capacitance is tuned according to the board parasitics to the frequency tolerance
is within ±150 ppm.
• The ground plane on layer two is solid below the trace lanes and there is ground around these traces
on the top layer.
The following guidelines are for the fast clock.
• The 40-MHz crystal must be placed close to the VQFN package.
• Ensure that he load capacitance is tuned according to the board parasitics to the frequency tolerance
is within ±100 ppm at room temperature. The total frequency across parts, temperature, and with
aging, must be ±25 ppm to meet the WLAN specification.
• Ensure that no high-frequency lines are routed close to the crystal routing to avoid noise degradation.
• Ensure that crystal tuning capacitors are close to the crystal pads.
• Make both traces (XTAL_N and XTAL_P) as close to parallel as possible and approximately the same
length.
• The ground plane on layer two is solid below the trace lines and that there is ground around these
traces on the top layer.
• See CC31xx & CC32xx Frequency Tuning for frequency tuning.
Applications, Implementation, and Layout
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75
CC3220R, CC3220S, CC3220SF
SWAS035B – SEPTEMBER 2016 – REVISED NOVEMBER 2018
7.2.4
www.ti.com
Digital Input and Output
The following guidelines are for the digital I/O.
• Route SPI and UART lines away from any RF traces.
• Keep the length of the high-speed lines as short as possible to avoid transmission line effects.
• Keep the line lower than 1/10 of the rise time of the signal to ignore transmission line effects. This is
required if the traces cannot be kept short. Place the resistor at the source end, closer to the device
that is driving the signal.
• Add a series-terminating resistor for each high-speed line (such as SPI_CLK or SPI_DATA) to match
the driver impedance to the line. Typical terminating-resistor values range from 27 to 36 Ω for a 50-Ω
line impedance.
• Route high-speed lines with a ground reference plane continuously below it to offer good impedance
throughout. This routing also helps shield the trace against EMI.
• Avoid stubs on high-speed lines to minimize the reflections. If the line must be routed to multiple
locations, use a separate line driver for each line.
• If the lines are longer compared to the rise time, add series-terminating resistors near the driver for
each high-speed line to match the driver impedance to the line. Typical terminating-resistor values
range from 27 to 36 Ω for a 50-Ω line impedance.
7.2.5
RF Interface
The following guidelines are for the RF interface. Follow guidelines specified in the vendor-specific
antenna design guides (including placement of the antenna). Also see CC3120 and CC3220 SimpleLink™
Wi-Fi® and IoT Solution Layout Guidelines for general antenna guidelines.
• Ensure that the antenna is matched for 50-Ω. TI recommends using a Pi-matching network.
• Ensure that the area underneath the BPF pads is grounded on layer one and layer two, and ensure
that the minimum filter requirements are met.
• Verify that the Wi-Fi RF trace is a 50-Ω, impedance-controlled trace with a reference to solid ground.
• The RF trace bends must be made with gradual curves. Avoid using 90-degree bends.
• The RF traces must not have sharp corners.
• Do not place traces or ground under the antenna section.
• The RF traces must have via stitching on the ground plane beside the RF trace on both sides.
76
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Product Folder Links: CC3220R CC3220S CC3220SF
CC3220R, CC3220S, CC3220SF
www.ti.com
SWAS035B – SEPTEMBER 2016 – REVISED NOVEMBER 2018
8 Device and Documentation Support
TI offers an extensive line of development tools. Tools and software to evaluate the performance of the
device, generate code, and develop solutions are listed in this section.
8.1
Development Tools and Software
For the most up-to-date list of development tools and software, see the CC3220 Tools & Software product
page. Users can also click the "Alert Me" button on the top right corner of the CC3220 Tools & Software
page to stay informed about updates related to the CC3220MOD device.
Development Tools
Pin Mux Tool The supported devices are: CC3200 and CC3220x.
The Pin Mux Tool is a software tool that provides a graphical user interface (GUI) for
configuring pin multiplexing settings, resolving conflicts and specifying I/O cell characteristics
for MPUs from TI. Results are output as C header/code files that can be imported into
software development kits (SDKs) or used to configure customers' custom software. Version
3 of the Pin Mux Tool adds the capability of automatically selecting a mux configuration that
satisfies the entered requirements.
SimpleLink™ Wi-Fi® Starter Pro The supported devices are: CC3100, CC3200, CC3120R, and
CC3220x.
The SimpleLink™ Wi-Fi® Starter Pro mobile App is a new mobile application for SimpleLink
provisioning. The app goes along with the embedded provisioning library and example that
runs on the device side (see SimpleLink™ Wi-Fi® CC3120 SDK plugin and TI SimpleLink™
Wi-Fi® CC3220 Software Development Kit (SDK)). The new provisioning release is a TI
recommendation for Wi-Fi provisioning using SimpleLink Wi-Fi products. The provisioning
release implements advanced AP mode and SmartConfig™ technology provisioning with
feedback and fallback options to ensure successful process has been accomplished.
Customers can use both embedded library and the mobile library for integration to their end
products.
SimpleLink™ Wi-Fi® Radio Testing Tool The supported devices are: CC3100, CC3200, and CC3220x.
The SimpleLink™ Wi-Fi® Radio Testing Tool is a Windows-based software tool for RF
evaluation and testing of SimpleLink Wi-Fi CC3120 and CC3220 designs during
development and certification. The tool enables low-level radio testing capabilities by
manually setting the radio into transmit or receive modes. Using the tool requires familiarity
and knowledge of radio circuit theory and radio test methods.
Created for the Internet of Things (IoT), the SimpleLink Wi-Fi CC31xx and CC32xx family of
devices include on-chip Wi-Fi, Internet, and robust security protocols with no prior Wi-Fi
experience needed for faster development. For more information on these devices, visit
SimpleLink™ Wi-Fi® family, Internet-on-a chip™ solutions.
CC3220 Software Development Kit (SDK) The CC3220x device is supported.
The CC3220 SDK contains drivers, many sample applications for Wi-Fi features and
Internet, as well as documentation needed to use the CC3220 Internet-on-a-chip solution.
This SDK can be used with TI’s MSP432P401R LaunchPad™ development kit, or with the
SimpleLink Studio, a PC tool that allows MCU development with CC3220. You can also use
the SDK as example code for any platform. All sample applications in the SDK are supported
on TI’s MSP432P401R ultra-low-power MCUs with Code Composer Studio™ IDE and TIRTOS. In addition, many of the applications support IAR.
Uniflash Standalone Flash Tool for TI Microcontrollers (MCU), Sitara Processors & SimpleLink
Devices
CCS Uniflash is a standalone tool used to program on-chip flash memory on TI MCUs and
on-board flash memory for Sitara processors. Uniflash has a GUI, command line, and
scripting interface. CCS Uniflash is available free of charge.
Device and Documentation Support
Submit Documentation Feedback
Product Folder Links: CC3220R CC3220S CC3220SF
Copyright © 2016–2018, Texas Instruments Incorporated
77
CC3220R, CC3220S, CC3220SF
SWAS035B – SEPTEMBER 2016 – REVISED NOVEMBER 2018
www.ti.com
TI Designs and Reference Designs
The TI Designs Reference Design Library is a robust reference design library spanning analog, embedded
processor, and connectivity. Created by TI experts to help you jumpstart your system design, all TI
Designs include schematic or block diagrams, BOMs, and design files to speed your time to market.
8.2
Firmware Updates
TI updates features in the service pack for this module with no published schedule. Due to the ongoing
changes, TI recommends that the user has the latest service pack in their module for production.
To stay informed, click the SDK “Alert me” button the top right corner of the product page, or visit
SimpleLink™ Wi-Fi® CC3120 SDK plugin.
8.3
Device Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of the
CC3220x device and support tools (see Figure 8-1).
CC
3220
x
PREFIX
xx
x
xxx
x
PACKAGING
R = tape/reel
T = small reel
X = preproduction device
no prefix = production device
DEVICE FAMILY
CC = wireless connectivity
SERIES NUMBER
3 = Wi-Fi Centric
MEMORY
R = ROM
S = Secured
SF = Secured flash
PACKAGE
RGK = 9-mm × 9-mm VQFN
REVISION
A = Revision A
MEMORY SIZE
M2 = 256KB RAM
12 = 1MB flash and 256KB RAM
Figure 8-1. CC3220x Device Nomenclature
78
Device and Documentation Support
Copyright © 2016–2018, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC3220R CC3220S CC3220SF
CC3220R, CC3220S, CC3220SF
www.ti.com
8.4
SWAS035B – SEPTEMBER 2016 – REVISED NOVEMBER 2018
Documentation Support
To receive notification of documentation updates—including silicon errata—go to the product folder for
your device on ti.com (CC3220). In the upper right corner, click the "Alert me" button. This registers you to
receive a weekly digest of product information that has changed (if any). For change details, check the
revision history of any revised document. The current documentation that describes the processor, related
peripherals, and other technical collateral follows.
The following documents provide support for the CC3220 device.
Errata
CC3220R, CC3220S Silicon Errata This document describes the known exceptions to the functional
specifications for the CC3220R and the CC3220S SimpleLink™ Wi-Fi® Wireless and
Internet-of-Things Solution, a Single-Chip Wireless MCU.
CC3220SF Silicon Errata This document describes the known exception to the functional specifications
for the CC3220SF SimpleLink™ Wi-Fi® Wireless and Internet-of-Things Solution, a SingleChip Wireless MCU.
Application Reports
CC3120 and CC3220 SimpleLink™ Wi-Fi® Embedded Programming
SimpleLink™ Wi-Fi® Embedded Programming
CC3120
and
CC3220
SimpleLink™ CC3120, CC3220 Wi-Fi® Internet-on-a chip™ Networking Sub-System Power
Management
This application report describes the best practices for power management and extended
battery life for embedded low-power Wi-Fi devices such as the SimpleLink™ Wi-Fi® Interneton-a chip™ solution from Texas Instruments™.
SimpleLink™ CC3120, CC3220 Wi-Fi® Internet-on-a chip™ Solution Built-In Security Features The
SimpleLink™ Wi-Fi® CC3120 and CC3220 Internet-on-a chip™ family of devices from Texas
Instruments™ offer a wide range of built-in security features to help developers address a
variety of security needs, which is achieved without any processing burden on the main
microcontroller (MCU). This document describes these security-related features and provides
recommendations for leveraging each in the context of practical system implementation.
SimpleLink™ CC3120, CC3220 Wi-Fi® and Internet of Things Over-the-Air Update This document
describes the OTA library for the SimpleLink™ Wi-Fi® CC3x20 family of devices from Texas
Instruments™ and explains how to prepare a new cloud-ready update to be downloaded by
the OTA library.
SimpleLink™ CC3120, CC3220 Wi-Fi® Internet-on-a chip™ Solution Device Provisioning This guide
describes the provisioning process, which provides the SimpleLink™ Wi-Fi® device with the
information (network name, password, and so forth) needed to connect to a wireless
network.
Transfer of TI's Wi-Fi® Alliance Certifications to Products Based on SimpleLink™ This document
explains how to employ the Wi-Fi® Alliance (WFA) derivative certification transfer policy to
transfer a WFA certification, already obtained by Texas Instruments, to a system you have
developed.
Using Serial Flash on SimpleLink™ CC3120 and CC3220 Wi-Fi® and Internet-of-Things Devices
This application note is divided into two parts. The first part provides important guidelines
and best- practice design techniques to consider when choosing and embedding a serial
Flash paired with the CC3120 and CC3220 (CC3x20) devices. The second part describes
the file system, along with guidelines and considerations for system designers working with
the CC3x20 devices.
Device and Documentation Support
Submit Documentation Feedback
Product Folder Links: CC3220R CC3220S CC3220SF
Copyright © 2016–2018, Texas Instruments Incorporated
79
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SWAS035B – SEPTEMBER 2016 – REVISED NOVEMBER 2018
www.ti.com
User's Guides
SimpleLink™ Wi-Fi® and Internet of Things CC3120 and CC3220 Network Processor This document
provides software (SW) programmers with all of the required knowledge for working with the
networking subsystem of the SimpleLink™ Wi-Fi® devices. This guide provides basic
guidelines for writing robust, optimized networking host applications, and describes the
capabilities of the networking subsystem. The guide contains some example code
snapshots, to give users an idea of how to work with the host driver. More comprehensive
code examples can be found in the formal software development kit (SDK). This guide does
not provide a detailed description of the host driver APIs.
SimpleLink™ Wi-Fi® CC3120 and CC3220 and IoT Solution Layout Guidelines This
document
provides the design guidelines of the 4-layer PCB used for the CC3120 and CC3220
SimpleLink™ Wi-Fi® family of devices from Texas Instruments™. The CC3120 and CC3220
devices are easy to lay out and are available in quad flat no-leads (QFNS) packages. When
designing the board, follow the suggestions in this document to optimize performance of the
board.
SimpleLink™ Wi-Fi® and Internet of Things Solution CC3220, a Single-Chip Wireless MCU This
guide is intended to assist users in the initial setup and demonstration of running their first
sample application for the CC3220, CC3220S, CC3220SF SimpleLink™ Wi-Fi® and Internet
of Things Solution, a Single-Chip Wireless MCU from Texas Instruments™. The guide
explains how to install the software development kit (SDK) and various other tools required
to get started with the first application.
SimpleLink™ CC3220 Wi-Fi® LaunchPad™ Development Kit Hardware The
CC3220
SimpleLink
LaunchPad™ Development Kit (CC3220-LAUNCHXL) is a low-cost evaluation platform for
Arm® Cortex®-M4-based MCUs. The LaunchPad design highlights the CC3220 Internet-on-a
chip™ solution and Wi-Fi capabilities. The CC3220 LaunchPad also features temperature
and accelerometer sensors, programmable user buttons, three LEDs for custom
applications, and onboard emulation for debugging. The stackable headers of the CC3220
LaunchPad XL interface demonstrate how easy it is to expand the functionality of the
LaunchPad when interfacing with other peripherals on many existing BoosterPack™ Plug-in
Module add-on boards, such as graphical displays, audio codecs, antenna selection,
environmental sensing, and more.
SimpleLink™ Wi-Fi® and Internet of Things CC3220 This document introduces the user to the
environment setup for the CC3220x device, along with some reference examples from the
software development kit (SDK). This document explains both the platform and the
framework available to enable further application development.
SimpleLink™ Wi-Fi® CC3220 Out-of-Box Application This
guide
demonstrates
the
out-of-box
experience for the CC3220 LaunchPad™ Development Kit, highlighting the easy connection
to the CC3220 LaunchPad using the SimpleLink™ Wi-Fi® Starter Pro application, and the
over-the-air update.
SimpleLink™ Wi-Fi® and Internet-on-a-chip™ CC3120 and CC3220 Solution Radio Tool The Radio
Tool serves as a control panel for direct access to the radio, and can be used for both the
radio frequency (RF) evaluation and for certification purposes. This guide describes how to
have the tool work seamlessly on Texas Instruments™ evaluation platforms such as the
BoosterPack™ plus FTDI emulation board for CC3120 devices, and the LaunchPad™ for
CC3220 devices.
SimpleLink™ Wi-Fi® CC3120 and CC3220 Provisioning for Mobile Applications This guide describes
TI’s SimpleLink™ Wi-Fi® provisioning solution for mobile applications, specifically on the
usage of the Android™ and iOS® building blocks for UI requirements, networking, and
provisioning APIs required for building the mobile application.
SimpleLink™ Wi-Fi® CC3220 Out-of-Box Application This guide details the out-of-box (OOB)
experience with the CC3220 LaunchPad™ Development Kit from Texas Instruments™.
UniFlash CC3120 and CC3220 SimpleLink™ Wi-Fi® and Internet-on-a chip™ Solution ImageCreator
and Programming Tool This document describes the installation, operation, and usage of
the SimpleLink ImageCreator tool as part of the UniFlash.
80
Device and Documentation Support
Copyright © 2016–2018, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC3220R CC3220S CC3220SF
CC3220R, CC3220S, CC3220SF
www.ti.com
SWAS035B – SEPTEMBER 2016 – REVISED NOVEMBER 2018
More Literature
CC3220, CC3220S, CC3220SF SimpleLink™ Wi-Fi® and Internet of Things This technical reference
manual details the modules and peripherals of the SimpleLink™ CC32xx wireless MCU.
Each description presents the module or peripheral in a general sense. Not all features and
functions of all modules or peripherals may be present on all devices. Pin functions, internal
signal connections, and operational parameters differ from device to device. The user should
consult the device-specific data sheet for these details.
RemoTI Manifest
CC3120, CC3220 SimpleLink™ Wi-Fi® and Internet of Things Design Checklist
CC3220 SimpleLink™ Wi-Fi® and Internet of Things CC3220 hardware design files.
8.5
Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to order now.
Table 8-1. Related Links
8.6
PARTS
PRODUCT FOLDER
ORDER NOW
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
CC3220R
Click here
Click here
Click here
Click here
Click here
CC3220S
Click here
Click here
Click here
Click here
Click here
CC3220SF
Click here
Click here
Click here
Click here
Click here
Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the
respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views;
see TI's Terms of Use.
TI E2E™ Online Community The TI engineer-to-engineer (E2E) community was created to foster
collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge,
explore ideas and help solve problems with fellow engineers.
TI Embedded Processors Wiki Established to help developers get started with Embedded Processors
from Texas Instruments and to foster innovation and growth of general knowledge about the
hardware and software surrounding these devices.
8.7
Trademarks
SmartConfig, SimpleLink, LaunchPad, Code Composer Studio, E2E are trademarks of Texas Instruments.
Arm, Cortex, Thumb are registered trademarks of Arm Limited.
Macrocell is a trademark of Kappa Global Inc.
Wi-Fi CERTIFIED, WPA, WPA2 are trademarks of Wi-Fi Alliance.
Wi-Fi Alliance, Wi-Fi Direct are registered trademarks of Wi-Fi Alliance.
WiMAX is a trademark of WiMAX Forum.
Zigbee is a registered trademark of Zigbee Alliance.
All other trademarks are the property of their respective owners.
Device and Documentation Support
Submit Documentation Feedback
Product Folder Links: CC3220R CC3220S CC3220SF
Copyright © 2016–2018, Texas Instruments Incorporated
81
CC3220R, CC3220S, CC3220SF
SWAS035B – SEPTEMBER 2016 – REVISED NOVEMBER 2018
8.8
www.ti.com
Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
8.9
Export Control Notice
Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data
(as defined by the U.S., EU, and other Export Administration Regulations) including software, or any
controlled product restricted by other applicable national regulations, received from disclosing party under
nondisclosure obligations (if any), or any direct product of such technology, to any destination to which
such export or re-export is restricted or prohibited by U.S. or other applicable laws, without obtaining prior
authorization from U.S. Department of Commerce and other competent Government authorities to the
extent required by those laws.
8.10 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
82
Device and Documentation Support
Copyright © 2016–2018, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC3220R CC3220S CC3220SF
CC3220R, CC3220S, CC3220SF
www.ti.com
SWAS035B – SEPTEMBER 2016 – REVISED NOVEMBER 2018
9 Mechanical, Packaging, and Orderable Information
9.1
Packaging Information
The following pages include mechanical, packaging, and orderable information. This information is the
most current data available for the designated devices. This data is subject to change without notice and
revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Mechanical, Packaging, and Orderable Information
Submit Documentation Feedback
Product Folder Links: CC3220R CC3220S CC3220SF
Copyright © 2016–2018, Texas Instruments Incorporated
83
PACKAGE OPTION ADDENDUM
www.ti.com
6-Mar-2017
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
CC3220RM2ARGKR
ACTIVE
VQFN
RGK
64
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
Level-3-260C-168 HR
-40 to 85
CC3220R
M2A
CC3220RM2ARGKT
ACTIVE
VQFN
RGK
64
250
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
Level-3-260C-168 HR
-40 to 85
CC3220R
M2A
CC3220SF12ARGKR
ACTIVE
VQFN
RGK
64
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
Level-3-260C-168 HR
-40 to 85
CC3220SF
12A
CC3220SF12ARGKT
ACTIVE
VQFN
RGK
64
250
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
Level-3-260C-168 HR
-40 to 85
CC3220SF
12A
CC3220SM2ARGKR
ACTIVE
VQFN
RGK
64
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
Level-3-260C-168 HR
-40 to 85
CC3220S
M2A
CC3220SM2ARGKT
ACTIVE
VQFN
RGK
64
250
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
Level-3-260C-168 HR
-40 to 85
CC3220S
M2A
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
6-Mar-2017
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Nov-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
CC3220RM2ARGKR
VQFN
RGK
64
2500
330.0
16.4
9.3
9.3
1.1
12.0
16.0
Q2
CC3220RM2ARGKR
VQFN
RGK
64
2500
330.0
16.4
9.3
9.3
1.1
12.0
16.0
Q2
CC3220RM2ARGKT
VQFN
RGK
64
250
180.0
16.4
9.3
9.3
1.1
12.0
16.0
Q2
CC3220RM2ARGKT
VQFN
RGK
64
250
180.0
16.4
9.3
9.3
1.1
12.0
16.0
Q2
CC3220SF12ARGKR
VQFN
RGK
64
2500
330.0
16.4
9.3
9.3
1.1
12.0
16.0
Q2
CC3220SF12ARGKR
VQFN
RGK
64
2500
330.0
16.4
9.3
9.3
1.1
12.0
16.0
Q2
CC3220SF12ARGKT
VQFN
RGK
64
250
180.0
16.4
9.3
9.3
1.1
12.0
16.0
Q2
CC3220SF12ARGKT
VQFN
RGK
64
250
330.0
16.4
9.3
9.3
1.1
12.0
16.0
Q2
CC3220SM2ARGKR
VQFN
RGK
64
2500
330.0
16.4
9.3
9.3
1.1
12.0
16.0
Q2
CC3220SM2ARGKR
VQFN
RGK
64
2500
330.0
16.4
9.3
9.3
1.1
12.0
16.0
Q2
CC3220SM2ARGKT
VQFN
RGK
64
250
180.0
16.4
9.3
9.3
1.1
12.0
16.0
Q2
CC3220SM2ARGKT
VQFN
RGK
64
250
180.0
16.4
9.3
9.3
1.1
12.0
16.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Nov-2019
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CC3220RM2ARGKR
VQFN
RGK
64
2500
336.6
336.6
31.8
CC3220RM2ARGKR
VQFN
RGK
64
2500
367.0
367.0
38.0
CC3220RM2ARGKT
VQFN
RGK
64
250
210.0
185.0
35.0
CC3220RM2ARGKT
VQFN
RGK
64
250
210.0
185.0
35.0
CC3220SF12ARGKR
VQFN
RGK
64
2500
336.6
336.6
31.8
CC3220SF12ARGKR
VQFN
RGK
64
2500
367.0
367.0
38.0
CC3220SF12ARGKT
VQFN
RGK
64
250
210.0
185.0
35.0
CC3220SF12ARGKT
VQFN
RGK
64
250
336.6
336.6
31.8
CC3220SM2ARGKR
VQFN
RGK
64
2500
367.0
367.0
38.0
CC3220SM2ARGKR
VQFN
RGK
64
2500
336.6
336.6
31.8
CC3220SM2ARGKT
VQFN
RGK
64
250
210.0
185.0
35.0
CC3220SM2ARGKT
VQFN
RGK
64
250
210.0
185.0
35.0
Pack Materials-Page 2
PACKAGE OUTLINE
RGK0064B
VQFN - 1 mm max height
SCALE 1.500
PLASTIC QUAD FLATPACK - NO LEAD
9.1
8.9
B
A
PIN 1 INDEX AREA
9.1
8.9
1.0
0.8
C
SEATING PLANE
0.05
0.00
0.08 C
2X 7.5
6.3 0.1
(0.2) TYP
SYMM
17
32
16
33
EXPOSED
THERMAL PAD
SYMM
65
2X 7.5
60X 0.5
PIN 1 ID
1
48
64
49
0.5
64X
0.3
64X
0.30
0.18
0.1
0.05
C A B
4222201/B 03/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
RGK0064B
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
( 6.3)
SYMM
64X (0.6)
64
49
SEE SOLDER MASK
DETAIL
64X (0.24)
1
48
60X (0.5)
8X (1.1)
(R0.05) TYP
18X (1.2)
SYMM
(0.6) TYP
65
(8.8)
( 0.2) TYP
VIA
16
33
17
32
(0.6) TYP
8X
(1.1)
18X (1.2)
(8.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 10X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
METAL UNDER
SOLDER MASK
METAL EDGE
EXPOSED METAL
SOLDER MASK
OPENING
EXPOSED
METAL
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
OPENING
SOLDER MASK DEFINED
SOLDER MASK DETAILS
4222201/B 03/2018
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
RGK0064B
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
25X ( 1)
64X (0.6)
(1.2) TYP
64
49
64X (0.24)
1
48
60X (0.5)
(R0.05) TYP
(1.2) TYP
65
SYMM
(8.8)
16
METAL
TYP
33
17
32
SYMM
(8.8)
SOLDER PASTE EXAMPLE
BASED ON 0.1 MM THICK STENCIL
SCALE: 10X
EXPOSED PAD 65
63% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
4222201/B 03/2018
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
IMPORTANT NOTICE AND DISCLAIMER
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