Texas Instruments | CC2640R2F-Q1 SimpleLink™ Bluetooth® low energy Wireless MCU for Automotive (Rev. A) | Datasheet | Texas Instruments CC2640R2F-Q1 SimpleLink™ Bluetooth® low energy Wireless MCU for Automotive (Rev. A) Datasheet

Texas Instruments CC2640R2F-Q1 SimpleLink™ Bluetooth® low energy Wireless MCU for Automotive (Rev. A) Datasheet
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CC2640R2F-Q1
SWRS201A – JANUARY 2017 – REVISED AUGUST 2017
CC2640R2F-Q1 SimpleLink™ Bluetooth® low energy Wireless MCU
for Automotive
1 Device Overview
1.1
Features
1
• Qualified for Automotive Applications
• AEC-Q100 Qualified With the Following Results:
– Device Temperature Grade 2: –40°C to +105°C
Ambient Operating Temperature Range
– Device HBM ESD Classification Level 2
– Device CDM ESD Classification Level C3
• Microcontroller
– Powerful ARM® Cortex®-M3
– EEMBC CoreMark® Score: 142
– Up to 48-MHz Clock Speed
– 275-KB Nonvolatile Memory, Including 128-KB
In-System Programmable Flash
– Up to 28-KB System SRAM, of Which 20 KB is
Ultra-Low-Leakage SRAM
– 8-KB SRAM for Cache or System RAM Use
– 2-Pin cJTAG and JTAG Debugging
– Supports Over-the-Air Upgrade (OTA)
• Ultra-Low Power Sensor Controller
– Can Run Autonomously From the Rest of the
System
– 16-Bit Architecture
– 2-KB Ultra-Low Leakage SRAM for Code and
Data
• Efficient Code Size Architecture, Placing Drivers,
Bluetooth® low energy Controller, and Bootloader
in ROM to Make More Flash Available for the
Application
• RoHS-Compliant Automotive Grade Package
– 7-mm × 7-mm RGZ VQFN48 With Wettable
Flanks
• Peripherals
– 31 GPIOs, All Digital Peripheral Pins Can Be
Routed to Any GPIO
– Four General-Purpose Timer Modules
(Eight 16-Bit or Four 32-Bit Timers, PWM Each)
– 12-Bit ADC, 200-ksamples/s, 8-Channel Analog
MUX
– Continuous Time Comparator
– Ultra-Low Power Analog Comparator
– Programmable Current Source
– UART
– 2× SSI (SPI, MICROWIRE, TI)
– I2C, I2S
– Real-Time Clock (RTC)
– AES-128 Security Module
•
•
•
•
– True Random Number Generator (TRNG)
– Support for Eight Capacitive-Sensing Buttons
– Integrated Temperature Sensor
External System
– On-Chip Internal DC/DC Converter
– Very Few External Components
– Seamless Integration With the SimpleLink™
CC2590 and CC2592 Range Extenders
Low Power
– Wide Supply Voltage Range: 1.8 to 3.8 V
– Active-Mode RX: 6.1 mA
– Active-Mode TX at 0 dBm: 7.0 mA
– Active-Mode TX at +5 dBm: 9.3 mA
– Active-Mode MCU: 61 µA/MHz
– Active-Mode MCU: 48.5 CoreMark/mA
– Active-Mode Sensor Controller:
0.4 mA + 8.2 µA/MHz
– Standby: 1.3 µA (RTC Running and RAM/CPU
Retention)
– Shutdown: 150 nA (Wake Up on External
Events)
RF Section
– 2.4-GHz RF Transceiver Compatible With
Bluetooth low energy (BLE) 4.2 and 5
Specifications
– Excellent Receiver Sensitivity (–97 dBm for
Bluetooth low energy 1 Mbps), Selectivity, and
Blocking Performance
– Programmable Output Power up to +5 dBm
– Link budget of 102 dB for Bluetooth low energy
1 Mbps
– Suitable for Systems Targeting Compliance With
Worldwide Radio Frequency Regulations
– ETSI EN 300 328 and EN 300 440 (Europe)
– FCC CFR47 Part 15 (US)
– ARIB STD-T66 (Japan)
Tools and Development Environment
– Full-Feature Development Kits
– Sensor Controller Studio
– SmartRF™ Tools Portfolio
– IAR Embedded Workbench® for ARM
– Code Composer Studio™ (CCS)
– CCS Cloud
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
CC2640R2F-Q1
SWRS201A – JANUARY 2017 – REVISED AUGUST 2017
1.2
•
www.ti.com
Applications
Automotive Applications
– Car Access
– Keyless Entry
– Passive Entry/Passive Start (PEPS) Systems
– Car Sharing
– Piloted Parking
– Wireless Onboard Diagnostics (OBD)
– Cable Replacement
– Remote Control
– Sensors
1.3
•
Industrial
– Logistics
– Production and Manufacturing Automation
– Asset Tracking and Management
– HMI and Remote Display
– Access Control
Description
The SimpleLink™ Bluetooth® low energy CC2640R2F-Q1 device is an AEC-Q100 compliant wireless
microcontroller (MCU) targeting Bluetooth 4.2 and Bluetooth 5 low energy automotive applications such as
Passive Entry/Passive Start (PEPS), remote keyless entry (RKE), car sharing, piloted parking, cable
replacement, and smartphone connectivity.
The device is a member of the SimpleLink ultra-low power family of cost-effective, 2.4-GHz RF devices.
Very low active RF and MCU current and low-power mode current consumption provide excellent battery
lifetime allowing for operation on small coin-cell batteries and a low power-consumption footprint for nodes
connected to the car battery. Excellent receiver sensitivity and programmable output power provides
industry leading RF performance that is required for the demanding automotive RF environment.
The CC2640R2F-Q1 wireless MCU contains a 32-bit ARM® Cortex®-M3 processor that runs at 48 MHz as
the main application processor and includes the Bluetooth 4.2 low energy controller and host libraries
embedded in ROM. This architecture improves overall system performance and power consumption and
frees up significant amounts of flash memory for the application.
Additionally, the device is AEC-Q100 Qualified at the Grade 2 temperature range (–40°C to +105°C) and
is offered in a 7-mm × 7-mm VQFN package with wettable flanks. The wettable flanks help reduce
production-line cost and increase the reliability enabled by optical inspection of solder points.
The Bluetooth low energy Software Stack is available free of charge from ti.com.
Device Information (1)
PART NUMBER
CC2640R2FTWRGZQ1
(1)
2
PACKAGE
BODY SIZE (NOM)
VQFN (48) with Wettable Flanks
7.00 mm × 7.00 mm
For more information, see Section 9.
Device Overview
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1.4
SWRS201A – JANUARY 2017 – REVISED AUGUST 2017
Functional Block Diagram
Figure 1-1 shows a block diagram for the CC2640R2F-Q1 device.
AEC-Q100 Automotive Grade
SimpleLink CC2640R2F-Q1 Wireless MCU
RF Core
cJTAG
Main CPU
ROM
ADC
ADC
ARM
Cortex-M3
128-KB
Flash
8-KB
Cache
Digital PLL
DSP Modem
4-KB
SRAM
ARM
20-KB
SRAM
Cortex-M0
ROM
General Peripherals / Modules
I2C
4× 32-bit Timers
UART
2× SSI (SPI, µW, TI)
Sensor Controller
Sensor Controller
Engine
12-bit ADC, 200 ks/s
I2S
Watchdog Timer
2× Comparator
31 GPIOs
TRNG
SPI-I2C Digital Sensor IF
AES
Temp. / Batt. Monitor
Constant Current Source
32 ch. µDMA
RTC
Time-to-Digital Converter
2-KB SRAM
DC/DC Converter
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Figure 1-1. Block Diagram
Device Overview
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Table of Contents
1
Device Overview ......................................... 1
1.1
Features .............................................. 1
1.2
Applications ........................................... 2
Description ............................................ 2
1.3
Functional Block Diagram ............................ 3
1.4
2
3
Revision History ......................................... 4
Device Comparison ..................................... 5
Terminal Configuration and Functions .............. 6
........................ 6
4.2
Signal Descriptions – RGZ Package ................. 7
4.3
Wettable Flanks ...................................... 8
Specifications ............................................ 9
5.1
Absolute Maximum Ratings .......................... 9
5.2
ESD Ratings .......................................... 9
5.3
Recommended Operating Conditions ................ 9
5.4
Power Consumption Summary...................... 10
5.5
General Characteristics ............................. 10
4.1
5
6
Related Products ..................................... 5
3.1
4
5.20
Pin Diagram – RGZ Package
5.6
1-Mbps GFSK (Bluetooth low energy Technology) –
RX ................................................... 11
1-Mbps GFSK (Bluetooth low energy Technology) –
TX ................................................... 12
5.7
5.8
.............
32.768-kHz Crystal Oscillator (XOSC_LF) ..........
48-MHz RC Oscillator (RCOSC_HF) ...............
32-kHz RC Oscillator (RCOSC_LF).................
ADC Characteristics.................................
Temperature Sensor ................................
Battery Monitor ......................................
Continuous Time Comparator .......................
Low-Power Clocked Comparator ...................
Programmable Current Source .....................
Synchronous Serial Interface (SSI) ................
DC Characteristics ..................................
24-MHz Crystal Oscillator (XOSC_HF)
5.9
5.10
5.11
5.12
5.13
5.14
5.15
5.16
5.17
5.18
5.19
7
8
12
12
13
13
13
14
14
14
15
15
9
Thermal Resistance Characteristics for RGZ
Package ............................................. 18
...............................
...........................
5.23 Typical Characteristics ..............................
Detailed Description ...................................
6.1
Overview ............................................
6.2
Functional Block Diagram ...........................
6.3
Main CPU ...........................................
6.4
RF Core .............................................
6.5
Sensor Controller ...................................
6.6
Memory ..............................................
6.7
Debug ...............................................
6.8
Power Management .................................
6.9
Clock Systems ......................................
6.10 General Peripherals and Modules ..................
6.11 System Architecture .................................
Application, Implementation, and Layout .........
7.1
Application Information ..............................
7.2
7 × 7 Internal Differential (7ID) Application Circuit .
Device and Documentation Support ...............
8.1
Device Nomenclature ...............................
8.2
Tools and Software .................................
8.3
Documentation Support .............................
8.4
Texas Instruments Low-Power RF Website ........
8.5
Community Resources ..............................
8.6
Additional Information ...............................
8.7
Trademarks..........................................
8.8
Electrostatic Discharge Caution .....................
8.9
Export Control Notice ...............................
8.10 Glossary .............................................
5.21
Timing Requirements
5.22
Switching Characteristics
19
19
20
24
24
24
25
25
26
27
27
28
29
29
30
31
31
32
35
35
36
37
37
37
38
38
38
38
38
15
Mechanical, Packaging, and Orderable
Information .............................................. 38
17
9.1
Packaging Information
..............................
38
2 Revision History
Changes from January 16, 2017 to August 29, 2017
•
4
Page
Changed status to Production Data ................................................................................................ 1
Revision History
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3 Device Comparison
Table 3-1. Device Family Overview
DEVICE
CC2640R2F-Q1 (2)
PHY SUPPORT
FLASH
(KB)
RAM
(KB)
GPIO
PACKAGE (1)
Bluetooth low energy (Automotive)
128
20
31
RGZ (Wettable Flanks)
Bluetooth low energy (Normal, High
Speed, Long Range)
128
20
31, 15, 14, 10
RGZ, RHB, YFV, RSM
CC2650F128xxx
Multi-Protocol
128
20
31, 15, 10
RGZ, RHB, RSM
CC2640F128xxx
Bluetooth low energy (Normal)
128
20
31, 15, 10
RGZ, RHB, RSM
CC2630F128xxx
IEEE 802.15.4 ( ZigBee®/6LoWPAN)
128
20
31, 15, 10
RGZ, RHB, RSM
CC2620F128xxx
IEEE 802.15.4 (RF4CE)
128
20
31, 10
RGZ, RSM
CC2640R2Fxxx
(1)
(2)
(2)
Package designator replaces the xxx in device name to form a complete device name, RGZ is 7-mm × 7-mm VQFN48, RHB is 5-mm ×
5-mm VQFN32, RSM is 4-mm × 4-mm VQFN32, and YFV is 2.7-mm × 2.7-mm DSBGA.
CC2640R2Fxxx devices contain Bluetooth 4.2 Host and Controller libraries in ROM, leaving more of the 128KB of flash available for
the customer application when used with supported BLE-Stack software protocol stack releases. Actual use of ROM and flash by
the protocol stack may vary depending on device software configuration. See Bluetooth low energy Stack for more details.
Table 3-2. Typical (1) Flash Memory Available for Customer Applications
(1)
(2)
(3)
(4)
3.1
Device
Simple BLE Peripheral (BT 4.0) (2)
Simple BLE Peripheral (BT 4.2) (2)
CC2640R2Fxxx, CC2640R2F-Q1 (4)
83 KB
80 KB
CC2640F128xxx, CC2650F128xxx
41 KB
31 KB
(3)
Actual use of ROM and flash by the protocol stack will vary depending on device software configuration. The values in this table are
provided as guidance only.
Application example with two services (GAP and Simple Profile). Compiled using IAR.
BT4.2 configuration including Secure Pairing, Privacy 1.2, and Data Length Extension
Bluetooth low energy applications running on the CC2640R2F-Q1 device make use of up to 115 KB of system ROM and up to 32 KB of
RF Core ROM in order to minimize the flash usage. The maximum amount of nonvolatile memory available for Bluetooth low energy
applications on the CC2640R2F-Q1 device is thus 275 KB (128-KB flash + 147-KB ROM).
Related Products
Wireless Connectivity The wireless connectivity portfolio offers a wide selection of low power RF
solutions suitable for a broad range of applications. The offerings range from fully
customized solutions to turn key offerings with pre-certified hardware and software
(protocol).
TI's SimpleLink™ Sub-1 GHz Wireless MCUs Long-range, low-power wireless connectivity solutions
are offered in a wide range of Sub-1 GHz ISM bands.
Companion Products Review products that are frequently purchased or used in conjunction with this
product.
SimpleLink™ CC2640R2 Wireless MCU LaunchPad™ Development Kit
The CC2640R2 LaunchPad ™ development kit brings easy Bluetooth low energy (BLE)
connection to the LaunchPad ecosystem with the SimpleLink ultra-low power CC26xx family
of devices. Compared to the CC2650 LaunchPad, the CC2640R2 LaunchPad provides the
following:
• More free flash memory for the user application in the CC2640R2 wireless MCU
• Out-of-the-box support for Bluetooth 4.2 specification
• 4× faster over-the-air download speed compared to Bluetooth 4.1
SimpleLink™ Bluetooth low energy/Multistandard SensorTag
The SensorTag IoT kit invites you to realize your cloud-connected product idea. The
SensorTag includes 10 low-power MEMS sensors in a tiny red package, and it is expandable
with DevPacks to make it easy to add your own sensors or actuators.
Reference Designs for CC2640 TI Designs Reference Design Library is a robust reference design library
spanning analog, embedded processor and connectivity. Created by TI experts to help you
jump-start your system design, all TI Designs include schematic or block diagrams, BOMs
and design files to speed your time to market. Search and download designs at
ti.com/tidesigns.
Device Comparison
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4 Terminal Configuration and Functions
25 JTAG_TCKC
26 DIO_16
27 DIO_17
28 DIO_18
29 DIO_19
30 DIO_20
31 DIO_21
32 DIO_22
33 DCDC_SW
34 VDDS_DCDC
35 RESET_N
Pin Diagram – RGZ Package
36 DIO_23
4.1
DIO_24 37
24 JTAG_TMSC
DIO_25 38
23 DCOUPL
DIO_26 39
22 VDDS3
DIO_27 40
21 DIO_15
DIO_28 41
20 DIO_14
DIO_29 42
19 DIO_13
DIO_30 43
18 DIO_12
VDDS 44
17 DIO_11
VDDR 45
16 DIO_10
X24M_N 46
15 DIO_9
X24M_P 47
14 DIO_8
13 VDDS2
Note:
Note:
4
5
6
7
8
9
X32K_Q2
DIO_0
DIO_1
DIO_2
DIO_3
DIO_4
DIO_7 12
3
X32K_Q1
DIO_6 11
2
RF_N
DIO_5 10
1
RF_P
VDDR_RF 48
The following I/O pins marked in bold have high-drive capabilities:
•
Pin 10: DIO_5
•
Pin 11: DIO_6
•
Pin 12: DIO_7
•
Pin 24: JTAG_TMSC
•
Pin 26: DIO_16
•
Pin 27: DIO_17
The following I/O pins marked in italics have analog capabilities:
•
Pin 36: DIO_23
•
Pin 37: DIO_24
•
Pin 38: DIO_25
•
Pin 39: DIO_26
•
Pin 40: DIO_27
•
Pin 41: DIO_28
•
Pin 42: DIO_29
•
Pin 43: DIO_30
Figure 4-1. 48-Pin RGZ Package with Wettable Flanks
7-mm × 7-mm Pinout, 0.5-mm Pitch
Top View
6
Terminal Configuration and Functions
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4.2
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Signal Descriptions – RGZ Package
Table 4-1. Signal Descriptions – RGZ Package
NAME
NO.
TYPE
DESCRIPTION
(1)
DCDC_SW
33
Power
Output from internal DC/DC
DCOUPL
23
Power
1.27-V regulated digital-supply decoupling capacitor (2)
DIO_0
5
Digital I/O
GPIO, Sensor Controller
DIO_1
6
Digital I/O
GPIO, Sensor Controller
DIO_2
7
Digital I/O
GPIO, Sensor Controller
DIO_3
8
Digital I/O
GPIO, Sensor Controller
DIO_4
9
Digital I/O
GPIO, Sensor Controller
DIO_5
10
Digital I/O
GPIO, Sensor Controller, high-drive capability
DIO_6
11
Digital I/O
GPIO, Sensor Controller, high-drive capability
DIO_7
12
Digital I/O
GPIO, Sensor Controller, high-drive capability
DIO_8
14
Digital I/O
GPIO
DIO_9
15
Digital I/O
GPIO
DIO_10
16
Digital I/O
GPIO
DIO_11
17
Digital I/O
GPIO
DIO_12
18
Digital I/O
GPIO
DIO_13
19
Digital I/O
GPIO
DIO_14
20
Digital I/O
GPIO
DIO_15
21
Digital I/O
GPIO
DIO_16
26
Digital I/O
GPIO, JTAG_TDO, high-drive capability
DIO_17
27
Digital I/O
GPIO, JTAG_TDI, high-drive capability
DIO_18
28
Digital I/O
GPIO
DIO_19
29
Digital I/O
GPIO
DIO_20
30
Digital I/O
GPIO
DIO_21
31
Digital I/O
GPIO
DIO_22
32
Digital I/O
GPIO
DIO_23
36
Digital/Analog I/O
GPIO, Sensor Controller, Analog
DIO_24
37
Digital/Analog I/O
GPIO, Sensor Controller, Analog
DIO_25
38
Digital/Analog I/O
GPIO, Sensor Controller, Analog
DIO_26
39
Digital/Analog I/O
GPIO, Sensor Controller, Analog
DIO_27
40
Digital/Analog I/O
GPIO, Sensor Controller, Analog
DIO_28
41
Digital/Analog I/O
GPIO, Sensor Controller, Analog
DIO_29
42
Digital/Analog I/O
GPIO, Sensor Controller, Analog
DIO_30
43
Digital/Analog I/O
GPIO, Sensor Controller, Analog
JTAG_TMSC
24
Digital I/O
JTAG TMSC, high-drive capability
JTAG_TCKC
25
Digital I/O
JTAG TCKC
RESET_N
35
Digital input
RF_P
1
RF I/O
Positive RF input signal to LNA during RX
Positive RF output signal to PA during TX
RF_N
2
RF I/O
Negative RF input signal to LNA during RX
Negative RF output signal to PA during TX
VDDR
45
Power
Connect to output of internal DC/DC (2) (3)
VDDR_RF
48
Power
Connect to output of internal DC/DC (2) (4)
(1)
(2)
(3)
(4)
Reset, active-low. No internal pullup.
See the technical reference manual listed in Section 8.3 for more details.
Do not supply external circuitry from this pin.
If internal DC/DC is not used, this pin is supplied internally from the main LDO.
If internal DC/DC is not used, this pin must be connected to VDDR for supply from the main LDO.
Terminal Configuration and Functions
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Table 4-1. Signal Descriptions – RGZ Package (continued)
NAME
NO.
TYPE
VDDS
44
Power
1.8-V to 3.8-V main chip supply (1)
VDDS2
13
Power
1.8-V to 3.8-V DIO supply (1)
VDDS3
22
Power
1.8-V to 3.8-V DIO supply (1)
VDDS_DCDC
34
Power
1.8-V to 3.8-V DC/DC supply
X32K_Q1
3
Analog I/O
32-kHz crystal oscillator pin 1
X32K_Q2
4
Analog I/O
32-kHz crystal oscillator pin 2
X24M_N
46
Analog I/O
24-MHz crystal oscillator pin 1
X24M_P
47
Analog I/O
24-MHz crystal oscillator pin 2
EGP
4.3
Power
DESCRIPTION
Ground – Exposed Ground Pad
Wettable Flanks
The automotive industry requires original equipment manufacturers (OEMs) to perform 100% automated
visual inspection (AVI) post-assembly to ensure that cars meet the current demands for safety and high
reliability. Standard quad-flat no-lead (VQFN) packages do not have solderable or exposed pins/terminals
that are easily viewed. It is therefore difficult to determine visually whether or not the package is
successfully soldered onto the printed circuit board (PCB). To resolve the issue of side-lead wetting of
leadless packaging for automotive and commercial component manufacturers, the wettable-flank process
was developed. The wettable flanks on the VQFN package provide a visual indicator of solderability and
thereby lower the inspection time and manufacturing costs.
The CC2640R2F-Q1 device is assembled using an automotive-grade VQFN package with wettable flanks.
8
Terminal Configuration and Functions
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5 Specifications
5.1
Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1) (2)
VDDR supplied by internal DC/DC regulator or
internal GLDO. VDDS_DCDC connected to VDDS on
PCB.
Supply voltage, VDDS (3)
MIN
MAX
UNIT
–0.3
4.1
V
Voltage on any digital pin (4)
–0.3
VDDS + 0.3, max 4.1
V
Voltage on crystal oscillator pins, X32K_Q1, X32K_Q2, X24M_N and X24M_P
–0.3
VDDR + 0.3, max 2.25
V
Voltage scaling enabled
–0.3
VDDS
Voltage scaling disabled, internal reference
–0.3
1.49
Voltage scaling disabled, VDDS as reference
–0.3
VDDS / 2.9
Storage temperature
–40
150
Voltage on ADC input (Vin)
Input RF level
5
Tstg
(1)
(2)
(3)
(4)
V
dBm
°C
All voltage values are with respect to ground, unless otherwise noted.
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
VDDS2 and VDDS3 need to be at the same potential as VDDS.
Including analog-capable DIO.
5.2
ESD Ratings
VALUE
Human Body Model (HBM), per AEC Q100-002
VESD
(1)
(2)
(3)
5.3
Electrostatic discharge
(1) (2)
Charged Device Model (CDM), per AEC Q100-011 (3)
All pins
±2000
XOCS pins 46, 47
±250
All other pins
±500
UNIT
V
AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
Ambient temperature
Operating supply voltage,
VDDS
For operation in battery-powered and 3.3-V systems
(internal DC/DC can be used to minimize power consumption)
MIN
MAX
UNIT
–40
105
°C
1.8
3.8
V
Specifications
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5.4
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Power Consumption Summary
Measured on the TI CC2640Q1EM-7ID reference design with Tc = 25°C, VDDS = 3.0 V with internal DC/DC converter, unless
otherwise noted.
PARAMETER
Icore
Core current consumption
TEST CONDITIONS
MIN
TYP
Reset. RESET_N pin asserted or VDDS below
power-on-reset (POR) threshold
100
Shutdown. No clocks running, no retention
150
Standby. With RTC, CPU, RAM and (partial)
register retention. RCOSC_LF
1.3
Standby. With RTC, CPU, RAM and (partial)
register retention. XOSC_LF
1.5
Standby. With Cache, RTC, CPU, RAM and
(partial) register retention. RCOSC_LF
3.4
Standby. With Cache, RTC, CPU, RAM and
(partial) register retention. XOSC_LF
3.6
Idle. Supply Systems and RAM powered.
650
Active. Core running CoreMark
MAX
UNIT
nA
µA
1.45 mA + 31 µA/MHz
Radio RX
6.1
Radio TX, 0-dBm output power
7.0
Radio TX, 5-dBm output power
9.3
mA
Peripheral Current Consumption (Adds to core current Icore for each peripheral unit activated) (1)
Iperi
(1)
5.5
Peripheral power domain
Delta current with domain enabled
20
µA
Serial power domain
Delta current with domain enabled
13
µA
RF Core
Delta current with power domain enabled, clock
enabled, RF core idle
237
µA
µDMA
Delta current with clock enabled, module idle
130
µA
Timers
Delta current with clock enabled, module idle
113
µA
I2C
Delta current with clock enabled, module idle
12
µA
I2S
Delta current with clock enabled, module idle
36
µA
SSI
Delta current with clock enabled, module idle
93
µA
UART
Delta current with clock enabled, module idle
164
µA
Iperi is not supported in Standby or Shutdown.
General Characteristics
Tc = 25°C, VDDS = 3.0 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
FLASH MEMORY
Supported flash erase cycles before
failure
100
k Cycles
Maximum number of write operations
per row before erase (1)
83
write
operations
Years at
105°C
Flash retention
105°C
11.4
Flash page/sector erase current
Average delta current
12.6
4
KB
Average delta current, 4 bytes at a time
8.15
mA
8
ms
8
µs
Flash page/sector size
Flash write current
Flash page/sector erase time (2)
Flash write time
(1)
(2)
10
(2)
4 bytes at a time
mA
Each row is 2048 bits (or 256 bytes) wide.
This number is dependent on Flash aging and will increase over time and erase cycles.
Specifications
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5.6
SWRS201A – JANUARY 2017 – REVISED AUGUST 2017
1-Mbps GFSK (Bluetooth low energy Technology) – RX
Measured on the TI CC2640Q1EM-7ID reference design with Tc = 25°C, VDDS = 3.0 V, fRF = 2440 MHz, unless otherwise
noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Receiver sensitivity
Differential mode. Measured at the CC2640Q1EM-7ID SMA
connector, BER = 10–3
–97
dBm
Receiver saturation
Differential mode. Measured at the CC2640Q1EM-7ID SMA
connector, BER = 10–3
4
dBm
Frequency error tolerance
Difference between the incoming carrier frequency and the
internally generated carrier frequency
–350
350
kHz
Data rate error tolerance
Difference between incoming data rate and the internally
generated data rate
–750
750
ppm
Co-channel rejection (1)
Wanted signal at –67 dBm, modulated interferer in channel,
BER = 10–3
–6
dB
Selectivity, ±1 MHz (1)
Wanted signal at –67 dBm, modulated interferer at ±1 MHz,
BER = 10–3
7 / 2 (2)
dB
Selectivity, ±2 MHz (1)
Wanted signal at –67 dBm, modulated interferer at ±2 MHz,
Image frequency is at –2 MHz, BER = 10–3
39 / 17 (2)
dB
Selectivity, ±3 MHz (1)
Wanted signal at –67 dBm, modulated interferer at ±3 MHz,
BER = 10–3
38 / 30 (2)
dB
Selectivity, ±4 MHz (1)
Wanted signal at –67 dBm, modulated interferer at ±4 MHz,
BER = 10–3
42 / 36 (2)
dB
Selectivity, ±5 MHz or more (1)
Wanted signal at –67 dBm, modulated interferer at ≥ ±5
MHz, BER = 10–3
32
dB
Selectivity, Image frequency (1)
Wanted signal at –67 dBm, modulated interferer at image
frequency, BER = 10–3
17
dB
Selectivity, Image frequency
±1 MHz (1)
Wanted signal at –67 dBm, modulated interferer at ±1 MHz
from image frequency, BER = 10–3
2 / 30 (2)
dB
Out-of-band blocking
(3)
–20
dBm
Out-of-band blocking
2003 MHz to 2399 MHz
–5
dBm
Out-of-band blocking
2484 MHz to 2997 MHz
–8
dBm
Out-of-band blocking
3000 MHz to 12.75 GHz
–8
dBm
Intermodulation
Wanted signal at 2402 MHz, –64 dBm. Two interferers at
2405 and 2408 MHz respectively, at the given power level
–34
dBm
Spurious emissions,
30 MHz to 1000 MHz
Conducted measurement in a 50-Ω single-ended load.
Suitable for systems targeting compliance with EN 300 328,
EN 300 440, FCC CFR47, Part 15 and ARIB STD-T-66
–65
dBm
Spurious emissions,
1 GHz to 12.75 GHz
Conducted measurement in a 50-Ω single-ended load.
Suitable for systems targeting compliance with EN 300 328,
EN 300 440, FCC CFR47, Part 15 and ARIB STD-T-66
–52
dBm
RSSI dynamic range
70
dB
RSSI accuracy
±4
dB
(1)
(2)
(3)
30 MHz to 2000 MHz
Numbers given as I/C dB.
X / Y, where X is +N MHz and Y is –N MHz.
Excluding one exception at Fwanted / 2, per Bluetooth Specification.
Specifications
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1-Mbps GFSK (Bluetooth low energy Technology) – TX
Measured on the TI CC2640Q1EM-7ID reference design with Tc = 25°C, VDDS = 3.0 V, fRF = 2440 MHz, unless otherwise
noted.
PARAMETER
TEST CONDITIONS
MIN
Output power, highest setting
Differential mode, delivered to a single-ended 50-Ω load
through a balun
Output power, lowest setting
Spurious emission conducted
measurement (1)
(1)
5.8
TYP
MAX
UNIT
5
dBm
Delivered to a single-ended 50-Ω load through a balun
–21
dBm
f < 1 GHz, outside restricted bands
–44
dBm
f < 1 GHz, restricted bands ETSI
–62
dBm
f < 1 GHz, restricted bands FCC
–62
dBm
f > 1 GHz, including harmonics
–55
dBm
Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 (Europe), FCC
CFR47 Part 15 (US), and ARIB STD-T66 (Japan).
24-MHz Crystal Oscillator (XOSC_HF)
Tc = 25°C, VDDS = 3.0 V, unless otherwise noted. (1)
PARAMETER
TEST CONDITIONS
ESR Equivalent series resistance (2)
6 pF < CL ≤ 9 pF
ESR Equivalent series resistance (2)
5 pF < CL ≤ 6 pF
LM Motional inductance (2)
Relates to load capacitance
(CL in Farads)
CL Crystal load capacitance
MIN
(2)
Ω
80
Ω
H
9
pF
24
MHz
–40
40
Start-up time (3) (5)
5.9
UNIT
60
5
Crystal frequency tolerance (2) (4)
(5)
MAX
20
< 1.6 × 10–24 / CL2
Crystal frequency (2) (3)
(1)
(2)
(3)
(4)
TYP
ppm
150
µs
Probing or otherwise stopping the crystal while the DC/DC converter is enabled may cause permanent damage to the device.
The crystal manufacturer's specification must satisfy this requirement
Measured on the TI CC2640Q1EM-7ID reference design with Tc = 25°C, VDDS = 3.0 V
Includes initial tolerance of the crystal, drift over temperature, ageing and frequency pulling due to incorrect load capacitance, as per
Bluetooth specification.
Kick-started based on a temperature and aging compensated RCOSC_HF using precharge injection.
32.768-kHz Crystal Oscillator (XOSC_LF)
Tc = 25°C, VDDS = 3.0 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
Crystal frequency (1)
Crystal frequency tolerance, Bluetooth lowenergy applications (1) (2)
–500
ESR Equivalent series resistance (1)
30
CL Crystal load capacitance (1)
(1)
(2)
12
TYP
MAX
32.768
6
UNIT
kHz
500
ppm
100
kΩ
12
pF
The crystal manufacturer's specification must satisfy this requirement.
Includes initial tolerance of the crystal, drift over temperature, ageing and frequency pulling due to incorrect load capacitance, as per
Bluetooth specification.
Specifications
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5.10 48-MHz RC Oscillator (RCOSC_HF)
Measured on the TI CC2640Q1EM-7ID reference design with Tc = 25°C, VDDS = 3.0 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
Frequency
UNIT
48
Uncalibrated frequency accuracy
±1%
Calibrated frequency accuracy (1)
±0.25%
Start-up time
(1)
MAX
MHz
5
µs
Accuracy relative to the calibration source (XOSC_HF).
5.11 32-kHz RC Oscillator (RCOSC_LF)
Measured on the TI CC2640Q1EM-7ID reference design with Tc = 25°C, VDDS = 3.0 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
Calibrated frequency (1)
32.8
Temperature coefficient
50
(1)
MAX
UNIT
kHz
ppm/°C
The frequency accuracy of the real time clock (RTC) is not directly dependent on the frequency accuracy of the 32-kHz RC oscillator.
The RTC can be calibrated by measuring the frequency error of RCOSC_LF relative to XOSC_HF and compensating the RTC tick
speed.
5.12 ADC Characteristics
Tc = 25°C, VDDS = 3.0 V without internal DC/DC converter and with voltage scaling enabled, unless otherwise noted. (1)
PARAMETER
TEST CONDITIONS
Input voltage range
MIN
TYP
0
Resolution
VDDS
12
Sample rate
Offset
Gain error
DNL (3)
Differential nonlinearity
INL (4)
Integral nonlinearity
Internal 4.3-V equivalent reference
Effective number of bits
(2)
, 200 ksps,
Internal 1.44-V reference, voltage scaling disabled,
32 samples average, 200 ksps, 300-Hz input tone
THD
, 200 ksps,
Total harmonic distortion VDDS as reference, 200 ksps, 9.6-kHz input tone
SFDR
Signal-to-noise
and
Distortion ratio
Spurious-free dynamic
range
Conversion time
(1)
(2)
(3)
(4)
ksps
2
LSB
2.4
LSB
>–1
LSB
±3
LSB
9.8
10
Bits
11.1
(2)
Internal 1.44-V reference, voltage scaling disabled,
32 samples average, 200 ksps, 300-Hz input tone
SINAD,
SNDR
V
(2)
VDDS as reference, 200 ksps, 9.6-kHz input tone
Internal 4.3-V equivalent reference
9.6-kHz input tone
UNIT
Bits
200
Internal 4.3-V equivalent reference (2)
Internal 4.3-V equivalent reference
9.6-kHz input tone
ENOB
MAX
–65
–69
dB
–71
Internal 4.3-V equivalent reference (2), 200 ksps,
9.6-kHz input tone
60
VDDS as reference, 200 ksps, 9.6-kHz input tone
63
Internal 1.44-V reference, voltage scaling disabled,
32 samples average, 200 ksps, 300-Hz input tone
69
Internal 4.3-V equivalent reference (2), 200 ksps,
9.6-kHz input tone
67
VDDS as reference, 200 ksps, 9.6-kHz input tone
72
Internal 1.44-V reference, voltage scaling disabled,
32 samples average, 200 ksps, 300-Hz input tone
73
Serial conversion, time-to-output, 24-MHz clock
50
dB
dB
clockcycles
Using IEEE Std 1241™-2010 for terminology and test methods.
Input signal scaled down internally before conversion, as if voltage range was 0 to 4.3 V.
No missing codes. Positive DNL typically varies from +0.3 to +3.5, depending on device (see Figure 5-21).
For a typical example, see Figure 5-22.
Specifications
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ADC Characteristics (continued)
Tc = 25°C, VDDS = 3.0 V without internal DC/DC converter and with voltage scaling enabled, unless otherwise noted.(1)
PARAMETER
(5)
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Current consumption
Internal 4.3-V equivalent reference (2)
0.66
mA
Current consumption
VDDS as reference
0.75
mA
Reference voltage
Equivalent fixed internal reference (input voltage scaling
enabled). For best accuracy, the ADC conversion should
be initiated through the TI-RTOS API to include the
gain/offset compensation factors stored in FCFG1.
Reference voltage
Fixed internal reference (input-voltage scaling disabled).
For the best accuracy, the ADC conversion should be
initiated through the TI-RTOS API to include the gain/offset
compensation factors stored in FCFG1. This value is
derived from the scaled value (4.3 V) as follows.
Vref = 4.3 V × 1408 / 4095
Reference voltage
4.3 (2) (5)
V
1.48
V
VDDS as reference (also known as RELATIVE) (input
voltage scaling enabled)
VDDS
V
Reference voltage
VDDS as reference (also known as RELATIVE) (input
voltage scaling disabled)
VDDS /
2.82 (5)
V
Input Impedance
200 ksps, voltage scaling enabled. Capacitive input, input
impedance depends on sampling frequency and sampling
time
>1
MΩ
Applied voltage must be within absolute maximum ratings at all times (see Section 5.1).
5.13 Temperature Sensor
Measured on the TI CC2640Q1EM-7ID reference design with Tc = 25°C, VDDS = 3.0 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
Resolution
TYP
MAX
4
Range
–40
UNIT
°C
105
°C
Accuracy
±5
°C
Supply voltage coefficient (1)
3.2
°C/V
(1)
Automatically compensated when using supplied driver libraries.
5.14 Battery Monitor
Measured on the TI CC2640Q1EM-7ID reference design with Tc = 25°C, VDDS = 3.0 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
Resolution
TYP
MAX
50
Range
1.8
Accuracy
UNIT
mV
3.8
13
V
mV
5.15 Continuous Time Comparator
Tc = 25°C, VDDS = 3.0 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Input voltage range
0
VDDS
V
External reference voltage
0
VDDS
V
Internal reference voltage
DCOUPL as reference
Offset
Hysteresis
Decision time
Step from –10 mV to 10 mV
Current consumption when enabled (1)
(1)
14
1.27
V
3
mV
<2
mV
0.72
µs
8.6
µA
Additionally, the bias module must be enabled when running in standby mode.
Specifications
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5.16
SWRS201A – JANUARY 2017 – REVISED AUGUST 2017
Low-Power Clocked Comparator
Tc = 25°C, VDDS = 3.0 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
Input voltage range
MIN
TYP
MAX
0
VDDS
Clock frequency
32
UNIT
V
kHz
Internal reference voltage, VDDS / 2
1.49–1.51
V
Internal reference voltage, VDDS / 3
1.01–1.03
V
Internal reference voltage, VDDS / 4
0.78–0.79
V
Internal reference voltage, DCOUPL / 1
1.25–1.28
V
Internal reference voltage, DCOUPL / 2
0.63–0.65
V
Internal reference voltage, DCOUPL / 3
0.42–0.44
V
Internal reference voltage, DCOUPL / 4
0.33–0.34
Offset
V
<2
Hysteresis
Decision time
Step from –50 mV to 50 mV
Current consumption when enabled
mV
<5
mV
<1
clock-cycle
362
nA
5.17 Programmable Current Source
Tc = 25°C, VDDS = 3.0 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
Current source programmable output range
Resolution
Current consumption (1)
(1)
TYP
MAX
UNIT
0.25–20
µA
0.25
µA
23
µA
Including current source at maximum
programmable output
Additionally, the bias module must be enabled when running in standby mode.
5.18 Synchronous Serial Interface (SSI)
Tc = 25°C, VDDS = 3.0 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
65024
system
clocks
S1 (1) tclk_per (SSIClk period)
Device operating as SLAVE
S2 (1) tclk_high (SSIClk high time)
Device operating as SLAVE
0.5
tclk_per
S3 (1) tclk_low (SSIClk low time)
Device operating as SLAVE
0.5
tclk_per
S1 (TX only) (1) tclk_per (SSIClk period)
One-way communication to SLAVE:
Device operating as MASTER
4
65024
system
clocks
S1 (TX and RX) (1) tclk_per (SSIClk period)
Normal duplex operation:
Device operating as MASTER
8
65024
system
clocks
S2 (1) tclk_high (SSIClk high time)
Device operating as MASTER
0.5
tclk_per
S3 (1) tclk_low(SSIClk low time)
Device operating as MASTER
0.5
tclk_per
(1)
12
Refer to SSI timing diagrams Figure 5-1, Figure 5-2, and Figure 5-3.
Specifications
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S1
S2
SSIClk
S3
SSIFss
SSITx
SSIRx
MSB
LSB
4 to 16 bits
Figure 5-1. SSI Timing for TI Frame Format (FRF = 01), Single Transfer Timing Measurement
S2
S1
SSIClk
S3
SSIFss
SSITx
MSB
LSB
8-bit control
SSIRx
0
MSB
LSB
4 to 16 bits output data
Figure 5-2. SSI Timing for MICROWIRE Frame Format (FRF = 10), Single Transfer
16
Specifications
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S1
S2
SSIClk
(SPO = 0)
S3
SSIClk
(SPO = 1)
SSITx
(Master)
MSB
SSIRx
(Slave)
MSB
LSB
LSB
SSIFss
Figure 5-3. SSI Timing for SPI Frame Format (FRF = 00), With SPH = 1
5.19 DC Characteristics
PARAMETER
TEST CONDITIONS
MIN
TYP
1.32
1.54
MAX
UNIT
TA = 25°C, VDDS = 1.8 V
GPIO VOH at 8-mA load
IOCURR = 2, high-drive GPIOs only
GPIO VOL at 8-mA load
IOCURR = 2, high-drive GPIOs only
GPIO VOH at 4-mA load
IOCURR = 1
GPIO VOL at 4-mA load
IOCURR = 1
0.21
GPIO pullup current
Input mode, pullup enabled, V(pad) = 0 V
71.7
µA
GPIO pulldown current
Input mode, pulldown enabled, V(pad) = VDDS
21.1
µA
GPIO high/low input transition,
no hysteresis
IH = 0, transition between reading 0 and reading 1
0.88
V
GPIO low-to-high input transition,
with hysteresis
IH = 1, transition voltage for input read as 0 → 1
1.07
V
GPIO high-to-low input transition,
with hysteresis
IH = 1, transition voltage for input read as 1 → 0
0.74
V
GPIO input hysteresis
IH = 1, difference between 0 → 1 and 1 → 0 points
0.33
V
0.26
1.32
V
0.32
1.58
V
0.32
Specifications
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V
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DC Characteristics (continued)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
TA = 25°C, VDDS = 3.0 V
GPIO VOH at 8-mA load
IOCURR = 2, high-drive GPIOs only
2.68
V
GPIO VOL at 8-mA load
IOCURR = 2, high-drive GPIOs only
0.33
V
GPIO VOH at 4-mA load
IOCURR = 1
2.72
V
GPIO VOL at 4-mA load
IOCURR = 1
0.28
V
GPIO pullup current
Input mode, pullup enabled, V(pad) = 0 V
277
µA
GPIO pulldown current
Input mode, pulldown enabled, V(pad) = VDDS
113
µA
GPIO high/low input transition,
no hysteresis
IH = 0, transition between reading 0 and reading 1
1.67
V
GPIO low-to-high input transition,
with hysteresis
IH = 1, transition voltage for input read as 0 → 1
1.94
V
GPIO high-to-low input transition,
with hysteresis
IH = 1, transition voltage for input read as 1 → 0
1.54
V
GPIO input hysteresis
IH = 1, difference between 0 → 1 and 1 → 0 points
0.4
V
TA = 25°C, VDDS = 3.8 V
TA = 25°C
V(IH)
Lowest GPIO input voltage reliably interpreted as a
«High»
V(IL)
Highest GPIO input voltage reliably interpreted as a
«Low»
(1)
0.8 VDDS (1)
VDDS (1)
0.2
Each GPIO is referenced to a specific VDDS pin. See the technical reference manual listed in Section 8.3 for more details.
5.20 Thermal Resistance Characteristics for RGZ Package
over operating free-air temperature range (unless otherwise noted)
NAME
DESCRIPTION
(°C/W) (1)
RθJA
Junction-to-ambient thermal resistance
29.6
RθJC(top)
Junction-to-case (top) thermal resistance
15.7
RθJB
Junction-to-board thermal resistance
6.2
PsiJT
Junction-to-top characterization parameter
0.3
PsiJB
Junction-to-board characterization parameter
6.2
RθJC(bot)
Junction-to-case (bottom) thermal resistance
1.9
(1)
(2)
18
(2)
°C/W = degrees Celsius per watt.
These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RθJC] value, which is based on a
JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see the following
EIA/JEDEC standards:
• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
Power dissipation of 2 W and an ambient temperature of 70ºC is assumed.
Specifications
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5.21 Timing Requirements
MAX
UNIT
Rising supply-voltage slew rate
MIN
0
NOM
100
mV/µs
Falling supply-voltage slew rate
0
20
mV/µs
3
mV/µs
5
°C/s
Falling supply-voltage slew rate, with low-power flash settings (1)
Positive temperature gradient in standby (2)
No limitation for negative
temperature gradient, or
outside standby mode
CONTROL INPUT AC CHARACTERISTICS (3)
RESET_N low duration
(1)
(2)
(3)
1
µs
For smaller coin cell batteries, with high worst-case end-of-life equivalent source resistance, a 22-µF VDDS input capacitor (see
Figure 7-1) must be used to ensure compliance with this slew rate.
Applications using RCOSC_LF as sleep timer must also consider the drift in frequency caused by a change in temperature (see
Section 5.11).
TA = –40°C to +105°C, VDDS = 1.8 V to 3.8 V, unless otherwise noted.
5.22 Switching Characteristics
Measured on the TI CC2640Q1EM-7ID reference design with Tc = 25°C, VDDS = 3.0 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
WAKEUP and TIMING
Idle → Active
Standby → Active
Shutdown → Active
14
µs
151
µs
1015
µs
Specifications
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5.23 Typical Characteristics
-95
-95
BLE 1-Mbps
-96
RX Sensitivity (dBm)
RX Sensitivity (dBm)
-96
-97
-98
-97
-98
-99
-99
-100
-40
-20
0
20
40
60
Temperature (°C)
80
-100
1.8
100
Figure 5-4. Bluetooth low energy Sensitivity vs Temperature
2.2
2.4 2.6 2.8
3
3.2
Supply Voltage VDDS (V)
3.6
3.8
D002
6
BLE 1-Mbps
5
Output Power (dBm)
-96
-96.5
-97
-97.5
-98
-98.5
-99
4
3
2
1
-99.5
-100
2400
3.4
Figure 5-5. Bluetooth low energy Sensitivity vs
Supply Voltage (VDDS)
-95
-95.5
RX Sensitivity (dBm)
2
D001
+5 dBm settings
2410
2420 2430 2440 2450 2460
Channel Frequency (MHz)
2470
0
-40
2480
-20
D003
Figure 5-6. Bluetooth low energy Sensitivity vs
Channel Frequency
0
20
40
60
Temperature (°C)
80
100
D004
Figure 5-7. TX Output Power vs Temperature
6
5.5
5
5
Output Power (dBm)
Output Power (dBm)
4.5
4
3.5
3
2.5
2
1.5
3
2
1
0.5
1.8
4
+5 dBm settings
2
2.2
2.4 2.6 2.8
3
3.2
Supply Voltage VDDS (V)
3.4
3.6
+5 dBm setting
3.8
1
2400
2410
D005
Figure 5-8. TX Output Power vs Supply Voltage (VDDS)
20
Specifications
2420 2430 2440 2450 2460
Channel Frequency (MHz)
2470
2480
D006
Figure 5-9. TX Output Power
vs Channel Frequency
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Typical Characteristics (continued)
16
10.5
+5 dBm settings
0 dBm settings
15
10
Current Consumption (mA)
14
TX Current (mA)
13
12
11
10
9
8
7
9.5
9
8.5
8
7.5
7
6.5
6
5.5
6
5
1.8
5
2
2.2
2.4 2.6 2.8
3
3.2
Supply Voltage VDDS (V)
3.4
3.6
4.5
1.8
3.8
2
2.2
2.4 2.6 2.8
3
3.2
Supply Voltage VDDS (V)
D007
3.4
3.6
3.8
D008
Figure 5-11. RX Mode Current vs Supply Voltage (VDDS)
Figure 5-10. TX Current Consumption
vs Supply Voltage (VDDS)
7
10
TX Current (mA)
RX Current (mA)
9
6.5
6
8
7
6
+5 dBm settings
0 dBm settings
5.5
-40
-20
0
20
40
60
Temperature (°C)
80
5
-40
100
Figure 5-12. RX Mode Current Consumption vs Temperature
20
40
60
Temperature (°C)
80
100
D010
5
3.1
Current Consumption (mA)
Active Mode Current Consumption (mA)
0
Figure 5-13. TX Mode Current Consumption vs Temperature
3.2
3
2.9
2.8
2.7
-40
-20
D009
-20
0
20
40
60
Temperature (°C)
80
100
4
3
2
1.8
2
D011
Figure 5-14. Active Mode (MCU Running, No Peripherals)
Current Consumption vs Temperature
2.2
2.4 2.6 2.8
3
3.2
Supply Voltage VDDS (V)
3.4
3.6
3.8
D012
Figure 5-15. Active Mode (MCU Running, No Peripherals)
Current Consumption vs Supply Voltage (VDDS)
Specifications
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Typical Characteristics (continued)
10
11.4
9
11.2
11
Effective Number of Bits
Standby Current (μA)
8
7
6
5
4
3
2
10.6
10.4
10.2
10
9.8
9.6
9.4
1
0
-40
10.8
Fs = 200 kHz, No Averaging
Fs = 200 kHz, 32 Samples Averaging
9.2
-20
0
20
40
60
Temperature (°C)
80
9
500
100
1000
10000
Input Frequency (Hz)
D013
100000
Figure 5-17. SoC ADC Effective Number of Bits vs
Input Frequency (Internal Reference, No Scaling)
Figure 5-16. Standby Mode Current Consumption
vs Temperature
1005
1005
1004
ADC Code
ADC Code
1004
1003
1003
1002
1002
1001
1001
1.8
2.3
2.8
3.3
Supply Voltage VDDS (V)
3.8
1000
-40
-20
0
20
40
60
Temperature (qC)
D015
Figure 5-18. SoC ADC Output vs Supply Voltage
(Fixed Input, Internal Reference, No Scaling)
80
100
D016
Figure 5-19. SoC ADC Output vs Temperature
(Fixed Input, Internal Reference, No Scaling)
11
10.9
Effective Number of Bits
10.8
10.7
10.6
10.5
10.4
ENOB Internal Reference (32 Samples Averaging)
ENOB Internal Reference (No Averaging)
10.3
10.2
10.1
10
9.9
9.8
1k
10k
Input Frequency (Hz)
100k
200k
D019
Figure 5-20. SoC ADC ENOB vs Sampling Frequency
(Input Frequency = FS / 10)
22
Specifications
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Typical Characteristics (continued)
1
0.8
0.6
0.4
DNL
0.2
0
-0.2
-0.4
-0.6
-0.8
-1
0
600
1200
1800
2400
3000
3600
ADC CODE
4200
D001
D017
D001
Figure 5-21. SoC ADC DNL vs ADC Code (Internal Reference, No Scaling)
1.5
1
INL
0.5
0
-0.5
-1
-1.5
0
400
800
1200
1600
2000
2400
ADC CODE
2800
3200
3600
4000 4200
D018
Figure 5-22. SoC ADC INL vs ADC Code (Internal Reference, No Scaling)
Specifications
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6 Detailed Description
6.1
Overview
Section 6.2 shows the core modules of the CC26xx product family.
6.2
Functional Block Diagram
AEC-Q100 Automotive Grade
SimpleLink CC2640R2F-Q1 Wireless MCU
RF Core
cJTAG
Main CPU
ROM
ADC
ADC
ARM
Cortex-M3
128-KB
Flash
8-KB
Cache
Digital PLL
DSP Modem
4-KB
SRAM
ARM
20-KB
SRAM
Cortex-M0
ROM
General Peripherals / Modules
I2C
4× 32-bit Timers
UART
2× SSI (SPI, µW, TI)
Sensor Controller
Sensor Controller
Engine
12-bit ADC, 200 ks/s
I2S
Watchdog Timer
2× Comparator
31 GPIOs
TRNG
SPI-I2C Digital Sensor IF
AES
Temp. / Batt. Monitor
Constant Current Source
32 ch. µDMA
RTC
Time-to-Digital Converter
2-KB SRAM
DC/DC Converter
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Main CPU
The automotive grade SimpleLink CC2640R2F-Q1 Wireless MCU contains an ARM Cortex-M3 (CM3) 32bit CPU, which runs the application and the higher layers of the protocol stack.
The Cortex-M3 processor provides a high-performance, low-cost platform that meets the system
requirements of minimal memory implementation, and low-power consumption, while delivering
outstanding computational performance and exceptional system response to interrupts.
Cortex-M3 features include the following:
• 32-bit ARM Cortex-M3 architecture optimized for small-footprint embedded applications
• Outstanding processing performance combined with fast interrupt handling
• ARM Thumb®-2 mixed 16- and 32-bit instruction set delivers the high performance expected of a 32-bit
ARM core in a compact memory size usually associated with 8- and 16-bit devices, typically in the
range of a few kilobytes of memory for microcontroller-class applications:
– Single-cycle multiply instruction and hardware divide
– Atomic bit manipulation (bit-banding), delivering maximum memory use and streamlined peripheral
control
– Unaligned data access, enabling data to be efficiently packed into memory
• Fast code execution permits slower processor clock or increases sleep mode time
• Harvard architecture characterized by separate buses for instruction and data
• Efficient processor core, system, and memories
• Hardware division and fast digital-signal-processing oriented multiply accumulate
• Saturating arithmetic for signal processing
• Deterministic, high-performance interrupt handling for time-critical applications
• Enhanced system debug with extensive breakpoint and trace capabilities
• Serial wire trace reduces the number of pins required for debugging and tracing
• Migration from the ARM7™ processor family for better performance and power efficiency
• Optimized for single-cycle flash memory use
• Ultra-low power consumption with integrated sleep modes
• 1.25 DMIPS per MHz
6.4
RF Core
The RF Core contains an ARM Cortex-M0 processor that interfaces the analog RF and base-band
circuitries, handles data to and from the system side, and assembles the information bits in a given packet
structure. The RF core offers a high level, command-based API to the main CPU.
The RF core is capable of autonomously handling the time-critical aspects of the radio protocols
(Bluetooth low energy) thus offloading the main CPU and leaving more resources for the user application.
The RF core has a dedicated 4-KB SRAM block and runs initially from separate ROM memory. The ARM
Cortex-M0 processor is not programmable by customers.
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Sensor Controller
The Sensor Controller contains circuitry that can be selectively enabled in standby mode. The peripherals
in this domain may be controlled by the Sensor Controller Engine, which is a proprietary power-optimized
CPU. This CPU can read and monitor sensors or perform other tasks autonomously, thereby significantly
reducing power consumption and offloading the main Cortex-M3 CPU.
The Sensor Controller is set up using a PC-based configuration tool, called Sensor Controller Studio, and
potential use cases may be (but are not limited to):
• Analog sensors using integrated ADC
• Digital sensors using GPIOs, bit-banged I2C, and SPI
• UART communication for sensor reading or debugging
• Capacitive sensing
• Waveform generation
• Pulse counting
• Keyboard scan
• Quadrature decoder for polling rotation sensors
• Oscillator calibration
NOTE
Texas Instruments provides application examples for some of these use cases, but not for all
of them.
The peripherals in the Sensor Controller include the following:
• The low-power clocked comparator can be used to wake the device from any state in which the
comparator is active. A configurable internal reference can be used in conjunction with the comparator.
The output of the comparator can also be used to trigger an interrupt or the ADC.
• Capacitive sensing functionality is implemented through the use of a constant current source, a timeto-digital converter, and a comparator. The continuous time comparator in this block can also be used
as a higher-accuracy alternative to the low-power clocked comparator. The Sensor Controller will take
care of baseline tracking, hysteresis, filtering and other related functions.
• The ADC is a 12-bit, 200-ksamples/s ADC with eight inputs and a built-in voltage reference. The ADC
can be triggered by many different sources, including timers, I/O pins, software, the analog
comparator, and the RTC.
• The Sensor Controller also includes a SPI–I2C digital interface.
• The analog modules can be connected to up to eight different GPIOs.
The peripherals in the Sensor Controller can also be controlled from the main application processor.
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Table 6-1. GPIOs Connected to the Sensor Controller (1)
(1)
6.6
ANALOG CAPABLE
7 × 7 RGZ
DIO NUMBER
Y
30
Y
29
Y
28
Y
27
Y
26
Y
25
Y
24
Y
23
N
7
N
6
N
5
N
4
N
3
N
2
N
1
N
0
Up to 16 pins can be connected to the Sensor Controller. Up to 8 of these pins can be connected to
analog modules.
Memory
The flash memory provides nonvolatile storage for code and data. The flash memory is in-system
programmable.
The SRAM (static RAM) can be used for both storage of data and execution of code and is split into two
4-KB blocks and two 6-KB blocks. Retention of the RAM contents in standby mode can be enabled or
disabled individually for each block to minimize power consumption. In addition, if flash cache is disabled,
the 8-KB cache can be used as a general-purpose RAM.
The ROM provides preprogrammed embedded TI-RTOS kernel, Driver Library, and lower layer protocol
stack software (Bluetooth low energy Controller). It also contains a bootloader that can be used to
reprogram the device using SPI or UART.
6.7
Debug
The on-chip debug support is done through a dedicated cJTAG (IEEE 1149.7) or JTAG (IEEE 1149.1)
interface.
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Power Management
To minimize power consumption, the CC2640R2F-Q1 device supports a number of power modes and
power management features (see Table 6-2).
Table 6-2. Power Modes
SOFTWARE CONFIGURABLE POWER MODES
ACTIVE
IDLE
STANDBY
SHUTDOWN
RESET PIN
HELD
CPU
Active
Off
Off
Off
Off
Flash
On
Available
Off
Off
Off
SRAM
On
On
On
Off
Off
Radio
Available
Available
Off
Off
Off
MODE
Supply System
Current
Wake-up Time to CPU Active (1)
Register Retention
SRAM Retention
On
On
Duty Cycled
Off
Off
1.45 mA + 31 µA/MHz
650 µA
1.3 µA
0.15 µA
0.1 µA
–
14 µs
151 µs
1015 µs
1015 µs
Full
Full
Partial
No
No
Full
Full
Full
No
No
High-Speed Clock
XOSC_HF or
RCOSC_HF
XOSC_HF or
RCOSC_HF
Off
Off
Off
Low-Speed Clock
XOSC_LF or
RCOSC_LF
XOSC_LF or
RCOSC_LF
XOSC_LF or
RCOSC_LF
Off
Off
Peripherals
Available
Available
Off
Off
Off
Sensor Controller
Available
Available
Available
Off
Off
Wake up on RTC
Available
Available
Available
Off
Off
Wake up on Pin Edge
Available
Available
Available
Available
Off
Wake up on Reset Pin
Available
Available
Available
Available
Available
Brown Out Detector (BOD)
Active
Active
Duty Cycled
Off
N/A
Power On Reset (POR)
Active
Active
Active
Active
N/A
(1)
Not including RTOS overhead
In active mode, the application Cortex-M3 CPU is actively executing code. Active mode provides normal
operation of the processor and all of the peripherals that are currently enabled. The system clock can be
any available clock source (see Table 6-2).
In idle mode, all active peripherals can be clocked, but the Application CPU core and memory are not
clocked and no code is executed. Any interrupt event will bring the processor back into active mode.
In standby mode, only the always-on domain (AON) is active. An external wake event, RTC event, or
sensor-controller event is required to bring the device back to active mode. MCU peripherals with retention
do not need to be reconfigured when waking up again, and the CPU continues execution from where it
went into standby mode. All GPIOs are latched in standby mode.
In shutdown mode, the device is turned off entirely, including the AON domain and the Sensor Controller.
The I/Os are latched with the value they had before entering shutdown mode. A change of state on any
I/O pin defined as a wake from Shutdown pin wakes up the device and functions as a reset trigger. The
CPU can differentiate between a reset in this way, a reset-by-reset pin, or a power-on-reset by reading the
reset status register. The only state retained in this mode is the latched I/O state and the Flash memory
contents.
The Sensor Controller is an autonomous processor that can control the peripherals in the Sensor
Controller independently of the main CPU, which means that the main CPU does not have to wake up, for
example, to execute an ADC sample or poll a digital sensor over SPI. The main CPU saves both current
and wake-up time that would otherwise be wasted. The Sensor Controller Studio enables the user to
configure the sensor controller and choose which peripherals are controlled and which conditions wake up
the main CPU.
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Clock Systems
The CC2640R2F-Q1 device supports two external and two internal clock sources.
A 24-MHz crystal is required as the frequency reference for the radio. This signal is doubled internally to
create a 48-MHz clock.
The 32-kHz crystal is optional. Bluetooth low energy requires a slow-speed clock with better than
±500 ppm accuracy if the device is to enter any sleep mode while maintaining a connection. The internal
32-kHz RC oscillator can in some use cases be compensated to meet the requirements. The low-speed
crystal oscillator is designed for use with a 32-kHz watch-type crystal.
The internal high-speed oscillator (48-MHz) can be used as a clock source for the CPU subsystem.
The internal low-speed oscillator (32.768-kHz) can be used as a reference if the low-power crystal
oscillator is not used.
The 32-kHz clock source can be used as external clocking reference through GPIO.
6.10 General Peripherals and Modules
The I/O controller controls the digital I/O pins and contains multiplexer circuitry to allow a set of peripherals
to be assigned to I/O pins in a flexible manner. All digital I/Os are interrupt and wake-up capable, have a
programmable pullup and pulldown function and can generate an interrupt on a negative or positive edge
(configurable). When configured as an output, pins can function as either push-pull or open-drain. Five
GPIOs have high drive capabilities (marked in bold in Section 4).
The SSIs are synchronous serial interfaces that are compatible with SPI, MICROWIRE, and synchronous
serial interfaces from Texas Instruments™. The SSIs support both SPI master and slave up to 4 MHz.
The UART implements a universal asynchronous receiver/transmitter function. It supports flexible baudrate generation up to a maximum of 3 Mbps and is compatible with the Bluetooth HCI specifications.
Timer 0 is a general-purpose timer module (GPTM), which provides two 16-bit timers. The GPTM can be
configured to operate as a single 32-bit timer, dual 16-bit timers or as a PWM module.
Timer 1, Timer 2, and Timer 3 are also GPTMs. Each of these timers is functionally equivalent to Timer 0.
In addition to these four timers, the RF core has its own timer to handle timing for RF protocols; the RF
timer can be synchronized to the RTC.
The I2C interface is used to communicate with devices compatible with the I2C standard. The I2C interface
is capable of 100-kHz and 400-kHz operation, and can serve as both I2C master and I2C slave.
The TRNG module provides a true, nondeterministic noise source for the purpose of generating keys,
initialization vectors (IVs), and other random number requirements. The TRNG is built on 24 ring
oscillators that create unpredictable output to feed a complex nonlinear combinatorial circuit.
The watchdog timer is used to regain control if the system fails due to a software error after an external
device fails to respond as expected. The watchdog timer can generate an interrupt or a reset when a
predefined time-out value is reached.
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The device includes a direct memory access (µDMA) controller. The µDMA controller provides a way to
offload data transfer tasks from the Cortex-M3 CPU, allowing for more efficient use of the processor and
the available bus bandwidth. The µDMA controller can perform transfer between memory and peripherals.
The µDMA controller has dedicated channels for each supported on-chip module and can be programmed
to automatically perform transfers between peripherals and memory as the peripheral is ready to transfer
more data. Some features of the µDMA controller include the following (this is not an exhaustive list):
• Highly flexible and configurable channel operation of up to 32 channels
• Transfer modes:
– Memory-to-memory
– Memory-to-peripheral
– Peripheral-to-memory
– Peripheral-to-peripheral
• Data sizes of 8, 16, and 32 bits
The AON domain contains circuitry that is always enabled, except in Shutdown mode (where the digital
supply is off). This circuitry includes the following:
• The RTC can be used to wake the device from any state where it is active. The RTC contains three
compare and one capture registers. With software support, the RTC can be used for clock and
calendar operation. The RTC is clocked from the 32-kHz RC oscillator or crystal. The RTC can also be
compensated to tick at the correct frequency even when the internal 32-kHz RC oscillator is used
instead of a crystal.
• The battery monitor and temperature sensor are accessible by software and give a battery status
indication as well as a coarse temperature measure.
6.11 System Architecture
Depending on the product configuration, the CC2640R2F-Q1 device can function either as a wireless
network processor (WNP—a device running the wireless protocol stack with the application running on a
separate MCU), or as a system-on-chip (SoC), with the application and protocol stack running on the ARM
Cortex-M3 core inside the device.
In the first case, the external host MCU communicates with the device using SPI or UART. In the second
case, the application must be written according to the application framework supplied with the wireless
protocol stack.
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7 Application, Implementation, and Layout
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI's customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
7.1
Application Information
Very few external components are required for the operation of the CC2640R2F-Q1 device. This section
provides general information about the differential configuration when using the CC2640R2F-Q1 device in
an application, and an example application circuit with schematics and layout is shown in Figure 7-1,
Figure 7-2, Figure 7-3, and Figure 7-4. This is only a small selection of the many application circuit
examples available as complete reference designs from the product folder on www.ti.com.
Figure 7-1 shows the differential RF front-end configuration option with internal biasing. See the
CC2640Q1EM-7ID reference design for this option.
10 µF
To VDDR
pins
Optional
inductor is
needed
only for
DC-DC 10 µH
operation
6.8 pF
Antenna
(50 Q)
2.4 nH
CC26xx
DCDC_SW
VDDS_DCDC
1 pF
2 nH
Pin 2 (RF N)
(GND exposed die
attached pad )
Pin 2 (RF N)
input
decoupling
10 µF to 22 µF
Pin 1 (RF P)
2.4 to 2.7 nH
Pin 1 (RF P)
Differential operation
1 pF
2 nH
12 pF
1 pF
24-MHz XTAL
(Load capacitors on chip)
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Figure 7-1. CC2640R2F-Q1 Application Circuit
Application, Implementation, and Layout
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Figure 7-2 shows the various supply voltage configuration options for the CC2640R2F-Q1 device. Not all
power supply decoupling capacitors or digital I/Os are shown. For a detailed overview of power supply
decoupling and wiring, see the TI reference designs and the CC13x0, CC26x0 SimpleLink Wireless MCU
Technical Reference Manual.
Internal DC-DC Regulator
Internal LDO Regulator
To all VDDR Pins
To all VDDR Pins
10 F
10 F
VDDS
VDDS
VDDS
VDDS
10 H
CC26xx
DCDC_SW Pin
VDDS_DCDC Pin
CC26xx
NC
(GND Exposed Die
Attached Pad)
Pin 2 (RF N)
(GND Exposed Die
Attached Pad)
VDDS_DCDC Pin
Pin 2 (RF N)
Pin 1 (RF P)
VDDS_DCDC
Input Decoupling
10 F to 22 F
Pin 1 (RF P)
VDDS_DCDC
Input Decoupling
10 F to 22 F
1.8 V to 3.8 V
to all VDDS Pins
VDDR
VDDR
VDDR
VDDR
24-MHz XTAL
(Load Capacitors on Chip)
24-MHz XTAL
(Load Capacitors on Chip)
1.8-V to 3.8-V
Supply Voltage
To All VDDS Pins
Copyright © 2017, Texas Instruments Incorporated
Figure 7-2. Supply Voltage Configurations
7.2
7 × 7 Internal Differential (7ID) Application Circuit
32
Application, Implementation, and Layout
Copyright © 2017, Texas Instruments Incorporated
Submit Documentation Feedback
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SWRS201A – JANUARY 2017 – REVISED AUGUST 2017
VDD_EB
VDDS
VDDS Decoupling Capacitors
VDDR Decoupling Capacitors
VDDR
FL1
L1
Pin 13
BLM18HE152SZ1
Pin 22
Pin 44
DCDC_SW
Pin 34
Pin 45
10uH
C2
C3
C4
C5
C6
C7
DNM
0.1uF
0.1uF
0.1uF
10uF
100nF
Pin 48
C8
C9
C16
C10
10uF
0.1uF
0.1uF
DNM_0402
Place L1 and
C8 close to pin 33
VDDS
R1
100k
VDDS
4
VDDR
J1
SMA-10V21-TGG
3
C31
5
nRESET
U1A
JTAG_TMS
JTAG_TCK
C20
0.1uF
DCDC_SW
C17
2
32.768kHz
33
3
4
23
49
Y1
1
24
25
35
C18
C19
22pF
1uF
JTAG_TMSC
JTAG_TCKC
RESET_N
DCDC_SW
X32K_Q1
X32K_Q2
DCOUPL
VSS
RF_P
RF_N
X24M_N
X24M_P
13
22
44
34
45
48
2
1
L11
2.4nH
1
C24
1
1pF
1
2
2.4nH
2
1
2nH
L21
46
47
L13
C12
DNM_0402
C14
U1B
5
6
7
8
9
10
11
12
14
15
16
17
18
19
20
21
DIO_0
DIO_1
DIO_2
DIO_3
DIO_4
DIO_5
DIO_6
DIO_7
DIO_8
DIO_9
DIO_10
DIO_11
DIO_12
DIO_13
DIO_14
DIO_15
DIO_16
DIO_17
DIO_18
DIO_19
DIO_20
DIO_21
DIO_22
DIO_23
DIO_24
DIO_25
DIO_26
DIO_27
DIO_28
DIO_29
DIO_30
26
27
28
29
30
31
32
36
37
38
39
40
41
42
43
1
2.4GHz
2nH
DNM_0402
C13
1pF
DNM_0402
C22
4
C15
R12 and C15 for
antenna matching
Note that a
DC-blocking
capacitor must
be used if
antenna
has DC-path
to ground.
3
2
0
DNM_0402
Mount either
C24 or C14
To select SMA
or PCB ant.
C21
1pF
C23
DIO_16 / JTAG TDO
DIO_17 / JTAG TDI
DIO_18
DIO_19
DIO_20
DIO_21
DIO_22
DIO22
DIO_23
TP_0.9mm_PTH
DIO_24
DIO_25
DIO_26
DIO_27
DIO_28
DIO_29
DIO_30
3
R12
2
Y2
24MHz
DIO_0
DIO_1
DIO_2
DIO_3
DIO_4
DIO_5
DIO_6
DIO_7
DIO_8
DIO_9
DIO_10
DIO_11
DIO_12
DIO_13
DIO_14
DIO_15
2
12pF
1
2
1
A1
C11
L12
CC2640R2FTWRGZRQ1
22pF
2
6.8pF
VDDS2
VDDS3
VDDS
VDDS_DCDC
VDDR
VDDR
DNM_0402
CC2640R2FTWRGZRQ1
EM connector 1
EM connector 2
P1
DIO_0
DIO_1
DIO_2
DIO_3
DIO_4
DIO_5
DIO_13
DIO_14
1
3
5
7
9
11
13
15
17
19
P2
2
4
6
8
10
12
14
16
18
20
DIO_7
DIO_6
DIO_15
DIO_18
DIO_19
DIO_12
DIO_11
DIO_10
DIO_9
DIO_8
JTAG_TCK
1
3
DIO_23
5
7
VDD_EB
9
DIO_25
11
DIO_27
13
15
nRESET
DIO_17 / JTAG TDI 17
DIO_16 / JTAG TDO19
SFM-110-02-S-D-A-K-TR
2
4
6
8
10
12
14
16
18
20
JTAG_TMS
DIO_26
DIO_20
DIO_24
DIO_30
DIO_29
DIO_28
DIO_21
SFM-110-02-S-D-A-K-TR
FIDU1
FIDU2
FIDU3
FIDU4
FIDU5
FIDU6
Copyright © 2017, Texas Instruments Incorporated
Figure 7-3. 7 × 7 Internal Differential (7ID) Application Circuit
Application, Implementation, and Layout
Copyright © 2017, Texas Instruments Incorporated
Submit Documentation Feedback
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33
CC2640R2F-Q1
SWRS201A – JANUARY 2017 – REVISED AUGUST 2017
7.2.1
www.ti.com
Layout
Figure 7-4. Layout
34
Application, Implementation, and Layout
Copyright © 2017, Texas Instruments Incorporated
Submit Documentation Feedback
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SWRS201A – JANUARY 2017 – REVISED AUGUST 2017
8 Device and Documentation Support
8.1
Device Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to all part numbers and
date-code. Each device has one of three prefixes/identifications: X, P, or null (no prefix) (for example,
CC2640R2F-Q1 is in production; therefore, no prefix/identification is assigned).
Device development evolutionary flow:
X
Experimental device that is not necessarily representative of the final device's electrical
specifications and may not use production assembly flow.
P
Prototype device that is not necessarily the final silicon die and may not necessarily meet
final electrical specifications.
null
Production version of the silicon die that is fully qualified.
Production devices have been characterized fully, and the quality and reliability of the device have been
demonstrated fully. TI's standard warranty applies.
Predictions show that prototype devices (X or P) have a greater failure rate than the standard production
devices. Texas Instruments recommends that these devices not be used in any production system
because their expected end-use failure rate still is undefined. Only qualified production devices are to be
used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the
package type (for example, RGZ).
For orderable part numbers of the CC2640R2F-Q1 device package types, see the Package Option
Addendum of this document, the TI website (www.ti.com), or contact your TI sales representative.
CC26 40
PREFIX
X = Experimental device
P = Prototype
Blank = Qualified device
DEVICE FAMILY
SimpleLink™ Multistandard
Wireless MCU
DEVICE
40 = Bluetooth low energy
R2 FTW RGZ
R/T Q1
Q1 = Q100
R = Large Reel
T = Small Reel
PACKAGE DESIGNATOR
RGZ = 48-pin VQFN
(Very Thin Quad Flatpack No-Lead)
F = Flash
T = Grade 2, 105°C
W = Wettable flanks
ROM revision 2
Flash = 128KB
Figure 8-1. Device Nomenclature
Device and Documentation Support
Copyright © 2017, Texas Instruments Incorporated
Submit Documentation Feedback
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35
CC2640R2F-Q1
SWRS201A – JANUARY 2017 – REVISED AUGUST 2017
8.2
www.ti.com
Tools and Software
TI offers an extensive line of development tools, including tools to evaluate the performance of the
processors, generate code, develop algorithm implementations, and fully integrate and debug software
and hardware modules.
The following products support development of the CC2640R2F-Q1 device applications:
Software Tools:
SmartRF Studio 7:
SmartRF Studio is a PC application that helps designers of radio systems to easily evaluate the RF-IC at
an early stage in the design process.
• Test functions for sending and receiving radio packets, continuous wave transmit and receive
• Evaluate RF performance on custom boards by wiring it to a supported evaluation board or debugger
• Can also be used without any hardware, but then only to generate, edit and export radio configuration
settings
• Can be used in combination with several development kits for TI's CCxxxx RF-ICs
Sensor Controller Studio:
Sensor Controller Studio provides a development environment for the CC26xx Sensor Controller. The
Sensor Controller is a proprietary, power-optimized CPU in the CC26xx, which can perform simple
background tasks autonomously and independent of the System CPU state.
• Allows for Sensor Controller task algorithms to be implemented using a C-like programming language
• Outputs a Sensor Controller Interface driver, which incorporates the generated Sensor Controller
machine code and associated definitions
• Allows for rapid development by using the integrated Sensor Controller task testing and debugging
functionality. This allows for live visualization of sensor data and algorithm verification.
IDEs and Compilers:
Code Composer Studio:
• Integrated development environment with project management tools and editor
• Code Composer Studio (CCS) 6.1 and later has built-in support for the CC26xx device family
• Best support for XDS debuggers; XDS100v3, XDS110 and XDS200
• High integration with TI-RTOS with support for TI-RTOS Object View
IAR Embedded Workbench for ARM
• Integrated development environment with project management tools and editor
• IAR EWARM 7.30.3 and later has built-in support for the CC26xx device family
• Broad debugger support, supporting XDS100v3, XDS200, IAR I-Jet and Segger J-Link
• Integrated development environment with project management tools and editor
• RTOS plugin available for TI-RTOS
For a complete listing of development-support tools for the CC2640R2F-Q1 platform, visit the Texas
Instruments website at www.ti.com. For information on pricing and availability, contact the nearest TI field
sales office or authorized distributor.
36
Device and Documentation Support
Copyright © 2017, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2640R2F-Q1
CC2640R2F-Q1
www.ti.com
8.3
SWRS201A – JANUARY 2017 – REVISED AUGUST 2017
Documentation Support
To receive notification of documentation updates, navigate to the device product folder on ti.com
(CC2640R2F-Q1). In the upper right corner, click on Alert me to register and receive a weekly digest of
any product information that has changed. For change details, review the revision history included in any
revised document.
The current documentation that describes the CC2640R2F-Q1 devices, related peripherals, and other
technical collateral is listed in the following.
Technical Reference Manual
CC13xx, CC26xx SimpleLink™ Wireless MCU Technical Reference Manual
SPACER
Errata
CC2640R2F-Q1 SimpleLink™ Wireless MCU Errata
8.4
Texas Instruments Low-Power RF Website
Texas Instruments' Low-Power RF website has all the latest products, application and design notes, FAQ
section, news and events updates. Go to www.ti.com/lprf.
8.5
Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the
respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views;
see TI's Terms of Use.
TI E2E™ Online Community The TI engineer-to-engineer (E2E) community was created to foster
collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge,
explore ideas and help solve problems with fellow engineers.
TI Embedded Processors Wiki Texas Instruments Embedded Processors Wiki. Established to help
developers get started with Embedded Processors from Texas Instruments and to foster
innovation and growth of general knowledge about the hardware and software surrounding
these devices.
Low-Power RF Online Community Wireless Connectivity Section of the TI E2E Support Community
• Forums, videos, and blogs
• RF design help
• E2E interaction
Join here.
Low-Power RF Developer Network Texas Instruments has launched an extensive network of low-power
RF development partners to help customers speed up their application development. The
network consists of recommended companies, RF consultants, and independent design
houses that provide a series of hardware module products and design services, including:
• RF circuit, low-power RF, and ZigBee design services
• Low-power RF and ZigBee module solutions and development tools
• RF certification services and RF circuit manufacturing
For help with modules, engineering services or development tools:
Search the Low-Power RF Developer Network to find a suitable partner.
www.ti.com/lprfnetwork
Device and Documentation Support
Copyright © 2017, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2640R2F-Q1
37
CC2640R2F-Q1
SWRS201A – JANUARY 2017 – REVISED AUGUST 2017
8.6
www.ti.com
Additional Information
Texas Instruments offers a wide selection of cost-effective, low-power RF solutions for proprietary and
standard-based wireless applications for use in automotive, industrial and consumer applications. The
selection includes RF transceivers, RF transmitters, RF front ends, and Systems-on-Chips as well as
various software solutions for the Sub-1 GHz and 2.4-GHz frequency bands.
In addition, Texas Instruments provides a large selection of support collateral such as development tools,
technical documentation, reference designs, application expertise, customer support, third-party and
university programs.
The Low-Power RF E2E Online Community provides technical support forums, videos and blogs, and the
chance to interact with engineers from all over the world.
With a broad selection of product solutions, end-application possibilities, and a range of technical support,
Texas Instruments offers the broadest low-power RF portfolio.
8.7
Trademarks
SimpleLink, SmartRF, Code Composer Studio, LaunchPad, Texas Instruments, E2E are trademarks of
Texas Instruments.
ARM7 is a trademark of ARM Limited (or its subsidiaries).
ARM, Cortex, ARM Thumb are registered trademarks of ARM Limited (or its subsidiaries).
Bluetooth is a registered trademark of Bluetooth SIG, Inc.
CoreMark is a registered trademark of Embedded Microprocessor Benchmark Consortium.
IAR Embedded Workbench is a registered trademark of IAR Systems AB.
IEEE Std 1241 is a trademark of Institute of Electrical and Electronics Engineers, Incorporated.
ZigBee is a registered trademark of ZigBee Alliance, Inc.
All other trademarks are the property of their respective owners.
8.8
Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
8.9
Export Control Notice
Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data
(as defined by the U.S., EU, and other Export Administration Regulations) including software, or any
controlled product restricted by other applicable national regulations, received from disclosing party under
nondisclosure obligations (if any), or any direct product of such technology, to any destination to which
such export or re-export is restricted or prohibited by U.S. or other applicable laws, without obtaining prior
authorization from U.S. Department of Commerce and other competent Government authorities to the
extent required by those laws.
8.10 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
9 Mechanical, Packaging, and Orderable Information
9.1
Packaging Information
The following pages include mechanical, packaging, and orderable information. This information is the
most current data available for the designated devices. This data is subject to change without notice and
revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
38
Mechanical, Packaging, and Orderable Information
Submit Documentation Feedback
Product Folder Links: CC2640R2F-Q1
Copyright © 2017, Texas Instruments Incorporated
CC2640R2F-Q1
www.ti.com
SWRS201A – JANUARY 2017 – REVISED AUGUST 2017
PACKAGE OUTLINE
RGZ0048N
VQFN - 1 mm max height
SCALE 1.900
PLASTIC QUAD FLATPACK - NO LEAD
7.1
6.9
B
A
0.5
0.3
0.3
0.2
PIN 1 INDEX AREA
DETAIL
OPTIONAL TERMINAL
TYPICAL
7.1
6.9
0.1 MIN
(0.05)
SECTION A-A
A-A 25.000
1 MAX
TYPICAL
C
SEATING PLANE
0.05
0.00
0.08 C
2X 5.5
5.15
0.1
(0.2) TYP
24
13
44X 0.5
12
25
EXPOSED
THERMAL PAD
2X
5.5
49
SYMM
A
SEE TERMINAL
DETAIL
A
1
PIN 1 ID
(OPTIONAL)
36
37
48
SYMM
48X
0.5
0.3
48X
0.3
0.2
0.1
0.05
C B A
4223598/A 03/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
Copyright © 2017, Texas Instruments Incorporated
Mechanical, Packaging, and Orderable Information
Submit Documentation Feedback
Product Folder Links: CC2640R2F-Q1
39
CC2640R2F-Q1
SWRS201A – JANUARY 2017 – REVISED AUGUST 2017
www.ti.com
EXAMPLE BOARD LAYOUT
RGZ0048N
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
( 5.15)
SYMM
48
37
48X (0.6)
1
36
48X (0.25)
6X
(1.065)
44X (0.5)
10X
(1.26)
49
SYMM
(6.8)
(R0.05)
TYP
( 0.2) TYP
VIA
25
12
13
6X
(1.065)
10X (1.26)
24
(6.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:12X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
SOLDER MASK
OPENING
METAL
EXPOSED METAL
EXPOSED METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4223598/A 03/2017
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
40
Mechanical, Packaging, and Orderable Information
Submit Documentation Feedback
Product Folder Links: CC2640R2F-Q1
Copyright © 2017, Texas Instruments Incorporated
CC2640R2F-Q1
www.ti.com
SWRS201A – JANUARY 2017 – REVISED AUGUST 2017
EXAMPLE STENCIL DESIGN
RGZ0048N
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(0.63 TYP)
(1.26) TYP
16X
( 1.06)
37
48
48X (0.6)
49
1
36
48X (0.25)
44X (0.5)
(1.26)
TYP
(0.63)
TYP
SYMM
(6.8)
(R0.05) TYP
25
12
METAL
TYP
13
24
SYMM
(6.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD 49
68% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:15X
4223598/A 03/2017
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
Copyright © 2017, Texas Instruments Incorporated
Mechanical, Packaging, and Orderable Information
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Product Folder Links: CC2640R2F-Q1
41
PACKAGE OPTION ADDENDUM
www.ti.com
30-Sep-2017
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
CC2640R2FTWRGZRQ1
ACTIVE
VQFN
RGZ
48
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 105
CC2640Q1
R2F
CC2640R2FTWRGZTQ1
ACTIVE
VQFN
RGZ
48
250
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 105
CC2640Q1
R2F
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
30-Sep-2017
OTHER QUALIFIED VERSIONS OF CC2640R2F-Q1 :
• Catalog: CC2640R2F
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Sep-2017
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
CC2640R2FTWRGZRQ1
VQFN
RGZ
48
2500
330.0
16.4
7.3
7.3
1.1
12.0
16.0
Q2
CC2640R2FTWRGZTQ1
VQFN
RGZ
48
250
180.0
16.4
7.3
7.3
1.1
12.0
16.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Sep-2017
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CC2640R2FTWRGZRQ1
VQFN
RGZ
48
2500
336.6
336.6
31.8
CC2640R2FTWRGZTQ1
VQFN
RGZ
48
250
210.0
185.0
35.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its
semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers
should obtain the latest relevant information before placing orders and should verify that such information is current and complete.
TI’s published terms of sale for semiconductor products (http://www.ti.com/sc/docs/stdterms.htm) apply to the sale of packaged integrated
circuit products that TI has qualified and released to market. Additional terms may apply to the use or sale of other types of TI products and
services.
Reproduction of significant portions of TI information in TI data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such reproduced
documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements
different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the
associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Buyers and others who are developing systems that incorporate TI products (collectively, “Designers”) understand and agree that Designers
remain responsible for using their independent analysis, evaluation and judgment in designing their applications and that Designers have
full and exclusive responsibility to assure the safety of Designers' applications and compliance of their applications (and of all TI products
used in or for Designers’ applications) with all applicable regulations, laws and other applicable requirements. Designer represents that, with
respect to their applications, Designer has all the necessary expertise to create and implement safeguards that (1) anticipate dangerous
consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and
take appropriate actions. Designer agrees that prior to using or distributing any applications that include TI products, Designer will
thoroughly test such applications and the functionality of such TI products as used in such applications.
TI’s provision of technical, application or other design advice, quality characterization, reliability data or other services or information,
including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to
assist designers who are developing applications that incorporate TI products; by downloading, accessing or using TI Resources in any
way, Designer (individually or, if Designer is acting on behalf of a company, Designer’s company) agrees to use any particular TI Resource
solely for this purpose and subject to the terms of this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,
enhancements, improvements and other changes to its TI Resources. TI has not conducted any testing other than that specifically
described in the published documentation for a particular TI Resource.
Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that
include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE
TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY
RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or
endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR
REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO
ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF
MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL
PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM,
INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF
PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL,
DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN
CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN
ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949
and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements.
Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such
products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards
and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must
ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in
life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use.
Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life
support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all
medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.
TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product).
Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications
and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory
requirements in connection with such selection.
Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s noncompliance with the terms and provisions of this Notice.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2017, Texas Instruments Incorporated
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