Texas Instruments | Single-Chip Low Cost Low Power RF-Transceiver (Rev. D) | Datasheet | Texas Instruments Single-Chip Low Cost Low Power RF-Transceiver (Rev. D) Datasheet

Texas Instruments Single-Chip Low Cost Low Power RF-Transceiver (Rev. D) Datasheet
CC1100
CC1100
Low-Power Sub- 1 GHz RF Transceiver
Applications
• Ultra low-power wireless applications
operating in the 315/433/868/915 MHz
ISM/SRD bands
• Wireless alarm and security systems
• Industrial monitoring and control
• Wireless sensor networks
• AMR – Automatic Meter Reading
• Home and building automation
Product Description
2
3
16
17
18
15
CC1100
14
13
11
10
12
5
9
4
8
CC1100 provides extensive hardware support
for packet handling, data buffering, burst
transmissions, clear channel assessment, link
quality indication, and wake-on-radio.
1
6
The RF transceiver is integrated with a highly
configurable baseband modem. The modem
supports various modulation formats and has
a configurable data up to 500 kBaud.
19
20
The main operating parameters and the 64byte transmit/receive FIFOs of CC1100 can be
controlled via an SPI interface. In a typical
system, the CC1100 will be used together with a
microcontroller and a few additional passive
components.
7
The CC1100
is a low-cost sub- 1 GHz
transceiver designed for very low-power
wireless applications. The circuit is mainly
intended for the ISM (Industrial, Scientific and
Medical) and SRD (Short Range Device)
frequency bands at 315, 433, 868, and 915
MHz, but can easily be programmed for
operation at other frequencies in the 300-348
MHz, 400-464 MHz and 800-928 MHz bands.
This product shall not be used in any of the following products or systems without prior express written permission
from Texas Instruments:
(i)
(ii)
(iii)
implantable cardiac rhythm management systems, including without limitation pacemakers,
defibrillators and cardiac resynchronization devices,
external cardiac rhythm management systems that communicate directly with one or more
implantable medical devices; or
other devices used to monitor or treat cardiac function, including without limitation pressure
sensors, biochemical sensors and neurostimulators.
Please contact lpw-medical-approval@list.ti.com if your application might fall within the category described above.
SWRS038D
Page 1 of 92
CC1100
Key Features
•
RF Performance
•
•
•
•
•
•
High sensitivity (–111 dBm at 1.2 kBaud,
868 MHz, 1% packet error rate)
Low current consumption (14.4 mA in RX,
1.2 kBaud, 868 MHz)
Programmable output power up to +10
dBm for all supported frequencies
Excellent receiver selectivity and blocking
performance
Programmable data rate from 1.2 to 500
kBaud
Frequency bands: 300-348 MHz, 400-464
MHz and 800-928 MHz
•
•
•
Low-Power Features
•
•
Analog Features
•
•
•
•
2-FSK, GFSK, and MSK supported as
well as OOK and flexible ASK shaping
Suitable for frequency hopping systems
due to a fast settling frequency
synthesizer: 90us settling time
Automatic Frequency Compensation
(AFC) can be used to align the frequency
synthesizer to the received centre
frequency
Integrated analog temperature sensor
•
•
•
•
•
•
•
•
•
•
•
SWRS038D
400nA SLEEP mode current consumption
Fast startup time: 240us from sleep to RX
or TX mode (measured on EM reference
design [5] and [6])
Wake-on-radio functionality for automatic
low-power RX polling
Separate 64-byte RX and TX data FIFOs
(enables burst mode data transmission)
General
Digital Features
Flexible support for packet oriented
systems: On-chip support for sync word
detection, address check, flexible packet
length, and automatic CRC handling
Efficient SPI interface: All registers can be
programmed with one “burst” transfer
Digital RSSI output
Programmable channel filter bandwidth
Programmable Carrier Sense (CS)
indicator
Programmable Preamble Quality Indicator
(PQI) for improved protection against
false sync word detection in random noise
Support for automatic Clear Channel
Assessment (CCA) before transmitting
(for listen-before-talk systems)
Support for per-package Link Quality
Indication (LQI)
Optional automatic whitening and dewhitening of data
•
Few external components: Completely onchip frequency synthesizer, no external
filters or RF switch needed
Green package: RoHS compliant and no
antimony or bromine
Small size (QLP 4x4 mm package, 20
pins)
Suited for systems targeting compliance
with EN 300 220 (Europe) and FCC CFR
Part 15 (US).
Support
for
asynchronous
and
synchronous serial receive/transmit mode
for backwards compatibility with existing
radio communication protocols
Page 2 of 92
CC1100
Abbreviations
Abbreviations used in this data sheet are described below.
ACP
Adjacent Channel Power
MSK
ADC
Analog to Digital Converter
N/A
Minimum Shift Keying
Not Applicable
AFC
Automatic Frequency Compensation
NRZ
Non Return to Zero (Coding)
AGC
AMR
ASK
Automatic Gain Control
Automatic Meter Reading
Amplitude Shift Keying
OOK
PA
PCB
On-Off Keying
Power Amplifier
Printed Circuit Board
BER
Bit Error Rate
PD
Power Down
BT
Bandwidth-Time product
PER
Packet Error Rate
CCA
Clear Channel Assessment
PLL
Phase Locked Loop
CFR
Code of Federal Regulations
POR
Power-On Reset
CRC
Cyclic Redundancy Check
PQI
Preamble Quality Indicator
CS
Carrier Sense
PQT
Preamble Quality Threshold
CW
Continuous Wave (Unmodulated Carrier)
PTAT
Proportional To Absolute Temperature
DC
Direct Current
QLP
Quad Leadless Package
DVGA
Digital Variable Gain Amplifier
QPSK
Quadrature Phase Shift Keying
ESR
Equivalent Series Resistance
RC
Resistor-Capacitor
FCC
Federal Communications Commission
RF
Radio Frequency
FEC
Forward Error Correction
RSSI
Received Signal Strength Indicator
FIFO
First-In-First-Out
RX
Receive, Receive Mode
FHSS
Frequency Hopping Spread Spectrum
SAW
Surface Aqustic Wave
2-FSK
Binary Frequency Shift Keying
SMD
Surface Mount Device
GFSK
Gaussian shaped Frequency Shift Keying
SNR
Signal to Noise Ratio
IF
Intermediate Frequency
SPI
Serial Peripheral Interface
I/Q
In-Phase/Quadrature
SRD
Short Range Devices
ISM
Industrial, Scientific, Medical
TBD
To Be Defined
LC
Inductor-Capacitor
T/R
Transmit/Receive
LNA
Low Noise Amplifier
TX
Transmit, Transmit Mode
LO
Local Oscillator
UHF
Ultra High frequency
LSB
Least Significant Bit
VCO
Voltage Controlled Oscillator
LQI
Link Quality Indicator
WOR
Wake on Radio, Low power polling
MCU
Microcontroller Unit
XOSC
Crystal Oscillator
MSB
Most Significant Bit
XTAL
Crystal
SWRS038D
Page 3 of 92
CC1100
Table Of Contents
APPLICATIONS .................................................................................................................................................. 1
PRODUCT DESCRIPTION................................................................................................................................ 1
KEY FEATURES ................................................................................................................................................. 2
RF PERFORMANCE .......................................................................................................................................... 2
ANALOG FEATURES ........................................................................................................................................ 2
DIGITAL FEATURES......................................................................................................................................... 2
LOW-POWER FEATURES................................................................................................................................ 2
GENERAL ............................................................................................................................................................ 2
ABBREVIATIONS............................................................................................................................................... 3
TABLE OF CONTENTS ..................................................................................................................................... 4
1
ABSOLUTE MAXIMUM RATINGS ..................................................................................................... 7
2
OPERATING CONDITIONS ................................................................................................................. 7
3
GENERAL CHARACTERISTICS......................................................................................................... 7
4
ELECTRICAL SPECIFICATIONS ....................................................................................................... 8
4.1
CURRENT CONSUMPTION ............................................................................................................................ 8
4.2
RF RECEIVE SECTION .................................................................................................................................. 9
4.3
RF TRANSMIT SECTION ............................................................................................................................. 13
4.4
CRYSTAL OSCILLATOR .............................................................................................................................. 14
4.5
LOW POWER RC OSCILLATOR ................................................................................................................... 15
4.6
FREQUENCY SYNTHESIZER CHARACTERISTICS .......................................................................................... 15
4.7
ANALOG TEMPERATURE SENSOR .............................................................................................................. 16
4.8
DC CHARACTERISTICS .............................................................................................................................. 16
4.9
POWER-ON RESET ..................................................................................................................................... 16
5
PIN CONFIGURATION........................................................................................................................ 17
6
CIRCUIT DESCRIPTION .................................................................................................................... 18
7
APPLICATION CIRCUIT .................................................................................................................... 19
8
CONFIGURATION OVERVIEW ........................................................................................................ 22
9
CONFIGURATION SOFTWARE........................................................................................................ 24
10
4-WIRE SERIAL CONFIGURATION AND DATA INTERFACE .................................................. 24
10.1 CHIP STATUS BYTE ................................................................................................................................... 26
10.2 REGISTER ACCESS ..................................................................................................................................... 26
10.3 SPI READ .................................................................................................................................................. 27
10.4 COMMAND STROBES ................................................................................................................................. 27
10.5 FIFO ACCESS ............................................................................................................................................ 27
10.6 PATABLE ACCESS ................................................................................................................................... 28
11
MICROCONTROLLER INTERFACE AND PIN CONFIGURATION .......................................... 28
11.1 CONFIGURATION INTERFACE ..................................................................................................................... 28
11.2 GENERAL CONTROL AND STATUS PINS ..................................................................................................... 28
11.3 OPTIONAL RADIO CONTROL FEATURE ...................................................................................................... 29
12
DATA RATE PROGRAMMING.......................................................................................................... 29
13
RECEIVER CHANNEL FILTER BANDWIDTH .............................................................................. 30
14
DEMODULATOR, SYMBOL SYNCHRONIZER, AND DATA DECISION.................................. 30
14.1 FREQUENCY OFFSET COMPENSATION........................................................................................................ 30
14.2 BIT SYNCHRONIZATION ............................................................................................................................. 30
14.3 BYTE SYNCHRONIZATION .......................................................................................................................... 31
15
PACKET HANDLING HARDWARE SUPPORT .............................................................................. 31
15.1 DATA WHITENING ..................................................................................................................................... 31
15.2 PACKET FORMAT ....................................................................................................................................... 32
15.3 PACKET FILTERING IN RECEIVE MODE ...................................................................................................... 34
15.4 PACKET HANDLING IN TRANSMIT MODE ................................................................................................... 34
15.5 PACKET HANDLING IN RECEIVE MODE ..................................................................................................... 35
SWRS038D
Page 4 of 92
CC1100
15.6
16
16.1
16.2
16.3
17
17.1
17.2
17.3
17.4
17.5
17.6
18
18.1
18.2
19
19.1
19.2
19.3
19.4
19.5
19.6
19.7
20
21
22
22.1
23
24
25
26
27
27.1
28
29
30
31
31.1
31.2
32
32.1
32.2
32.3
32.4
32.5
32.6
32.7
32.8
32.9
32.10
33
33.1
33.2
33.3
PACKET HANDLING IN FIRMWARE ............................................................................................................. 35
MODULATION FORMATS ................................................................................................................. 36
FREQUENCY SHIFT KEYING ....................................................................................................................... 36
MINIMUM SHIFT KEYING........................................................................................................................... 36
AMPLITUDE MODULATION ........................................................................................................................ 36
RECEIVED SIGNAL QUALIFIERS AND LINK QUALITY INFORMATION ............................ 37
SYNC WORD QUALIFIER ............................................................................................................................ 37
PREAMBLE QUALITY THRESHOLD (PQT) .................................................................................................. 37
RSSI.......................................................................................................................................................... 37
CARRIER SENSE (CS)................................................................................................................................. 39
CLEAR CHANNEL ASSESSMENT (CCA) ..................................................................................................... 40
LINK QUALITY INDICATOR (LQI) .............................................................................................................. 40
FORWARD ERROR CORRECTION WITH INTERLEAVING ..................................................... 40
FORWARD ERROR CORRECTION (FEC)...................................................................................................... 40
INTERLEAVING .......................................................................................................................................... 41
RADIO CONTROL................................................................................................................................ 42
POWER-ON START-UP SEQUENCE ............................................................................................................. 42
CRYSTAL CONTROL ................................................................................................................................... 43
VOLTAGE REGULATOR CONTROL.............................................................................................................. 43
ACTIVE MODES ......................................................................................................................................... 44
WAKE ON RADIO (WOR).......................................................................................................................... 44
TIMING ...................................................................................................................................................... 45
RX TERMINATION TIMER .......................................................................................................................... 46
DATA FIFO ............................................................................................................................................ 46
FREQUENCY PROGRAMMING........................................................................................................ 48
VCO ......................................................................................................................................................... 48
VCO AND PLL SELF-CALIBRATION .......................................................................................................... 48
VOLTAGE REGULATORS ................................................................................................................. 49
OUTPUT POWER PROGRAMMING ................................................................................................ 49
SHAPING AND PA RAMPING............................................................................................................ 50
SELECTIVITY....................................................................................................................................... 52
CRYSTAL OSCILLATOR.................................................................................................................... 53
REFERENCE SIGNAL .................................................................................................................................. 54
EXTERNAL RF MATCH ..................................................................................................................... 54
PCB LAYOUT RECOMMENDATIONS............................................................................................. 54
GENERAL PURPOSE / TEST OUTPUT CONTROL PINS ............................................................. 55
ASYNCHRONOUS AND SYNCHRONOUS SERIAL OPERATION .............................................. 57
ASYNCHRONOUS OPERATION .................................................................................................................... 57
SYNCHRONOUS SERIAL OPERATION .......................................................................................................... 57
SYSTEM CONSIDERATIONS AND GUIDELINES ......................................................................... 57
SRD REGULATIONS ................................................................................................................................... 57
FREQUENCY HOPPING AND MULTI-CHANNEL SYSTEMS ............................................................................ 58
WIDEBAND MODULATION NOT USING SPREAD SPECTRUM ....................................................................... 58
DATA BURST TRANSMISSIONS................................................................................................................... 58
CONTINUOUS TRANSMISSIONS .................................................................................................................. 59
CRYSTAL DRIFT COMPENSATION .............................................................................................................. 59
SPECTRUM EFFICIENT MODULATION ......................................................................................................... 59
LOW COST SYSTEMS ................................................................................................................................. 59
BATTERY OPERATED SYSTEMS ................................................................................................................. 59
INCREASING OUTPUT POWER ................................................................................................................ 59
CONFIGURATION REGISTERS........................................................................................................ 60
CONFIGURATION REGISTER DETAILS – REGISTERS WITH PRESERVED VALUES IN SLEEP STATE ............... 64
CONFIGURATION REGISTER DETAILS – REGISTERS THAT LOSE PROGRAMMING IN SLEEP STATE ............ 84
STATUS REGISTER DETAILS....................................................................................................................... 85
SWRS038D
Page 5 of 92
CC1100
34
34.1
34.2
35
36
37
37.1
PACKAGE DESCRIPTION (QLP 20)................................................................................................. 88
RECOMMENDED PCB LAYOUT FOR PACKAGE (QLP 20) ........................................................................... 88
SOLDERING INFORMATION ........................................................................................................................ 88
ORDERING INFORMATION.............................................................................................................. 89
REFERENCES ....................................................................................................................................... 90
GENERAL INFORMATION................................................................................................................ 91
DOCUMENT HISTORY ................................................................................................................................ 91
SWRS038D
Page 6 of 92
CC1100
1
Absolute Maximum Ratings
Under no circumstances must the absolute maximum ratings given in Table 1 be violated. Stress
exceeding one or more of the limiting values may cause permanent damage to the device.
Caution!
ESD
sensitive
device.
Precaution should be used when handling
the device in order to prevent permanent
damage.
Parameter
Min
Max
Units
Supply voltage
–0.3
3.9
V
Voltage on any digital pin
–0.3
VDD+0.3
V
Condition
All supply pins must have the same voltage
max 3.9
Voltage on the pins RF_P, RF_N,
and DCOUPL
–0.3
2.0
V
Voltage ramp-up rate
120
kV/µs
Input RF level
+10
dBm
150
°C
Solder reflow temperature
260
°C
According to IPC/JEDEC J-STD-020C
ESD
<500
V
According to JEDEC STD 22, method A114,
Human Body Model
Storage temperature range
–50
Table 1: Absolute Maximum Ratings
2
Operating Conditions
The operating conditions for CC1100 are listed Table 2 in below.
Parameter
Min
Max
Unit
Operating temperature
-40
85
°C
Operating supply voltage
1.8
3.6
V
Condition
All supply pins must have the same voltage
Table 2: Operating Conditions
3
General Characteristics
Parameter
Min
Frequency range
Data rate
Typ
Max
Unit
Condition/Note
300
348
MHz
400
464
MHz
800
928
MHz
1.2
500
kBaud
2-FSK
1.2
250
kBaud
GFSK, OOK, and ASK
26
500
kBaud
(Shaped) MSK (also known as differential offset
QPSK)
Optional Manchester encoding (the data rate in kbps
will be half the baud rate)
Table 3: General Characteristics
SWRS038D
Page 7 of 92
CC1100
4
Electrical Specifications
4.1
Current Consumption
Tc = 25°C, VDD = 3.0V if nothing else stated. All measurement results are obtained using the CC1100EM reference designs
([5] and [6]).
Reduced current settings (MDMCFG2.DEM_DCFILT_OFF=1) gives a slightly lower current consumption at the cost of a
reduction in sensitivity. See Table 5 for additional details on current consumption and sensitivity.
Parameter
Current consumption in power
down modes
Current consumption
Current consumption,
315MHz
Min
Typ
Max
Unit Condition
400
nA
Voltage regulator to digital part off, register values retained
(SLEEP state). All GDO pins programmed to 0x2F (HW to 0)
900
nA
Voltage regulator to digital part off, register values retained, lowpower RC oscillator running (SLEEP state with WOR enabled
95
µA
Voltage regulator to digital part off, register values retained,
XOSC running (SLEEP state with MCSM0.OSC_FORCE_ON set)
160
µA
Voltage regulator to digital part on, all other modules in power
down (XOFF state)
9.8
µA
Automatic RX polling once each second, using low-power RC
oscillator, with 460 kHz filter bandwidth and 250 kBaud data rate,
th
PLL calibration every 4 wakeup. Average current with signal in
channel below carrier sense level (MCSM2.RX_TIME_RSSI=1).
34.2
µA
Same as above, but with signal in channel above carrier sense
level, 1.95 ms RX timeout, and no preamble/sync word found.
1.5
µA
Automatic RX polling every 15 second, using low-power RC
oscillator, with 460kHz filter bandwidth and 250 kBaud data rate,
th
PLL calibration every 4 wakeup. Average current with signal in
channel below carrier sense level (MCSM2.RX_TIME_RSSI=1).
39.3
µA
Same as above, but with signal in channel above carrier sense
level, 29.3 ms RX timeout, and no preamble/sync word found.
1.6
mA
Only voltage regulator to digital part and crystal oscillator running
(IDLE state)
8.2
mA
Only the frequency synthesizer is running (FSTXON state). This
currents consumption is also representative for the other
intermediate states when going from IDLE to RX or TX, including
the calibration state.
15.1
mA
Receive mode, 1.2 kBaud, reduced current, input at sensitivity
limit
13.9
mA
Receive mode, 1.2 kBaud, reduced current, input well above
sensitivity limit
14.9
mA
Receive mode, 38.4 kBaud, reduced current, input at sensitivity
limit
14.1
mA
Receive mode,38.4 kBaud, reduced current, input well above
sensitivity limit
15.9
mA
Receive mode, 250 kBaud, reduced current, input at sensitivity
limit
14.5
mA
Receive mode, 250 kBaud, reduced current, input well above
sensitivity limit
27.0
mA
Transmit mode, +10 dBm output power
14.8
mA
Transmit mode, 0 dBm output power
12.3
mA
Transmit mode, –6 dBm output power
th
SWRS038D
Page 8 of 92
CC1100
Parameter
Min
Current consumption,
433MHz
Current consumption,
868/915MHz
Typ
Max
Unit Condition
15.5
mA
Receive mode, 1.2 kBaud , reduced current, input at sensitivity
limit
14.5
mA
Receive mode, 1.2 kBaud , reduced current, input well above
sensitivity limit
15.4
mA
Receive mode, 38.4 kBaud , reduced current, input at sensitivity
limit
14.4
mA
Receive mode, 38.4 kBaud , reduced current, input well above
sensitivity limit
16.5
mA
Receive mode, 250 kBaud , reduced current, input at sensitivity
limit
15.2
mA
Receive mode, 250 kBaud , reduced current, input well above
sensitivity limit
28.9
mA
Transmit mode, +10 dBm output power
15.5
mA
Transmit mode, 0 dBm output power
13.1
mA
Transmit mode, –6 dBm output power
15.4
mA
Receive mode, 1.2 kBaud , reduced current, input at sensitivity
limit
14.4
mA
Receive mode, 1.2 kBaud , reduced current, input well above
sensitivity limit
15.2
mA
Receive mode, 38.4 kBaud , reduced current, input at sensitivity
limit
14.4
mA
Receive mode,38.4 kBaud , reduced current, input well above
sensitivity limit
16.4
mA
Receive mode, 250 kBaud , reduced current, input at sensitivity
limit
15.1
mA
Receive mode, 250 kBaud , reduced current, input well above
sensitivity limit
31.1
mA
Transmit mode, +10 dBm output power
16.9
mA
Transmit mode, 0 dBm output power
13.5
mA
Transmit mode, –6 dBm output power
Table 4: Electrical Specifications
4.2
RF Receive Section
Tc = 25°C, VDD = 3.0V if nothing else stated. All measurement results are obtained using the CC1100EM reference designs
([5] and [6]).
Parameter
Digital channel filter
bandwidth
Min
Typ
58
Max
Unit
Condition/Note
812
kHz
User programmable. The bandwidth limits are proportional to
crystal frequency (given values assume a 26.0 MHz crystal).
315 MHz, 1.2 kBaud data rate, sensitivity optimized, MDMCFG2.DEM_DCFILT_OFF=0
(2-FSK, 1% packet error rate, 20 bytes packet length, 5.2 kHz deviation, 58 kHz digital channel filter bandwidth)
Receiver sensitivity
-111
dBm
Sensitivity can be traded for current consumption by setting
MDMCFG2.DEM_DCFILT_OFF=1. The typical current
consumption is then reduced from 17.1 mA to 15.1 mA at
sensitivity limit. The sensitivity is typically reduced to -109 dBm
315 MHz, 500 kBaud data rate, sensitivity optimized, MDMCFG2.DEM_DCFILT_OFF=0 (MDMCFG2.DEM_DCFILT_OFF=1
cannot be used for data rates > 250 kBaud)
(MSK, 1% packet error rate, 20 bytes packet length, 812 kHz digital channel filter bandwidth)
-88
dBm
SWRS038D
Page 9 of 92
CC1100
Parameter
Min
Typ
Max
Unit
Condition/Note
433 MHz, 1.2 kBaud data rate, sensitivity optimized, MDMCFG2.DEM_DCFILT_OFF=0
(2-FSK, 1% packet error rate, 20 bytes packet length, 5.2 kHz deviation, 58 kHz digital channel filter bandwidth
Receiver sensitivity
–110
dBm
Sensitivity can be traded for current consumption by setting
MDMCFG2.DEM_DCFILT_OFF=1. The typical current
consumption is then reduced from 17.4 mA to 15.5 mA at
sensitivity limit. The sensitivity is typically reduced to -108 dBm
433 MHz, 38.4 kBaud data rate, sensitivity optimized, MDMCFG2.DEM_DCFILT_OFF=0
(2-FSK, 1% packet error rate, 20 bytes packet length, 20 kHz deviation, 100 kHz digital channel filter bandwidth)
Receiver sensitivity
–103
dBm
433 MHz, 250 kBaud data rate, sensitivity optimized, MDMCFG2.DEM_DCFILT_OFF=0
(MSK, 1% packet error rate, 20 bytes packet length, 540 kHz digital channel filter bandwidth)
Receiver sensitivity
–94
dBm
433 MHz, 500 kBaud data rate, sensitivity optimized, MDMCFG2.DEM_DCFILT_OFF=0 (MDMCFG2.DEM_DCFILT_OFF=1
cannot be used for data rates > 250 kBaud)
(MSK, 1% packet error rate, 20 bytes packet length, 812 kHz digital channel filter bandwidth)
Receiver sensitivity
–88
dBm
868 MHz, 1.2 kBaud data rate, sensitivity optimized, MDMCFG2.DEM_DCFILT_OFF=0
(2-FSK, 1% packet error rate, 20 bytes packet length, 5.2 kHz deviation, 58 kHz digital channel filter bandwidth)
Receiver sensitivity
–111
dBm
Sensitivity can be traded for current consumption by setting
MDMCFG2.DEM_DCFILT_OFF=1. The typical current
consumption is then reduced from 17.7 mA to 15.4 mA at
sensitivity limit. The sensitivity is typically reduced to -109 dBm
Saturation
–15
dBm
Adjacent channel
rejection
33
dB
Desired channel 3 dB above the sensitivity limit. 100 kHz
channel spacing
Alternate channel
rejection
33
dB
Desired channel 3 dB above the sensitivity limit. 100 kHz
channel spacing
See Figure 25 for plot of selectivity versus frequency offset
Image channel
rejection,
868MHz
30
dB
IF frequency 152 kHz
Desired channel 3 dB above the sensitivity limit.
868 MHz, 38.4 kBaud data rate
(2-FSK, 1% packet error rate, 20 bytes packet length, 20 kHz deviation, 100 kHz digital channel filter bandwidth)
Receiver sensitivity
–103
dBm
Saturation
–16
dBm
Adjacent channel
rejection
20
dB
Desired channel 3 dB above the sensitivity limit. 200 kHz
channel spacing
Alternate channel
rejection
28
dB
Desired channel 3 dB above the sensitivity limit. 200 kHz
channel spacing
See Figure 26 for plot of selectivity versus frequency offset
Image channel
rejection,
868MHz
23
dB
IF frequency 152 kHz
Desired channel 3 dB above the sensitivity limit.
SWRS038D
Page 10 of 92
CC1100
Parameter
Min
Typ
Max
Unit
Condition/Note
868 MHz, 250 kBaud data rate, sensitivity optimized, MDMCFG2.DEM_DCFILT_OFF=0
(MSK, 1% packet error rate, 20 bytes packet length, 540 kHz digital channel filter bandwidth)
Receiver
sensitivity
–93
dBm
Sensitivity can be traded for current consumption by setting
MDMCFG2.DEM_DCFILT_OFF=1. The typical current consumption
is then reduced from 18.8 mA to 16.4 mA at sensitivity limit. The
sensitivity is typically reduced to -91 dBm
Saturation
–16
dBm
Adjacent channel
rejection
24
dB
Desired channel 3 dB above the sensitivity limit. 750 kHz channel
spacing
Alternate channel
rejection
37
dB
Desired channel 3 dB above the sensitivity limit. 750 kHz channel
spacing
Image channel
rejection,
868MHz
14
dB
IF frequency 254 kHz
See Figure 27 for plot of selectivity versus frequency offset
Desired channel 3 dB above the sensitivity limit.
868 MHz, 500 kBaud data rate, sensitivity optimized, MDMCFG2.DEM_DCFILT_OFF=0 (MDMCFG2.DEM_DCFILT_OFF=1
cannot be used for data rates > 250 kBaud )
(MSK, 1% packet error rate, 20 bytes packet length, 812 kHz digital channel filter bandwidth)
Receiver
sensitivity
–88
dBm
868 MHz, 250 kBaud data rate, sensitivity optimized, MDMCFG2.DEM_DCFILT_OFF=0
(OOK, 1% packet error rate, 20 bytes packet length, 540 kHz digital channel filter bandwidth)
Receiver
sensitivity
-86
dBm
915 MHz, 1.2 kBaud data rate, sensitivity optimized, MDMCFG2.DEM_DCFILT_OFF=0
(2-FSK, 5.2kHz deviation, 1% packet error rate, 20 bytes packet length, 58 kHz digital channel filter bandwidth)
Receiver
sensitivity
–111
dBm
Sensitivity can be traded for current consumption by setting
MDMCFG2.DEM_DCFILT_OFF=1. The typical current consumption
is then reduced from 17.7 mA to 15.4 mA at sensitivity limit. The
sensitivity is typically reduced to -109 dBm
915 MHz, 38.4 kBaud data rate, sensitivity optimized, MDMCFG2.DEM_DCFILT_OFF=0
(2-FSK, 1% packet error rate, 20 bytes packet length, 20 kHz deviation, 100 kHz digital channel filter bandwidth)
Receiver
sensitivity
–104
dBm
915 MHz, 250 kBaud data rate, sensitivity optimized, MDMCFG2.DEM_DCFILT_OFF=0
(MSK, 1% packet error rate, 20 bytes packet length, 540 kHz digital channel filter bandwidth)
Receiver
sensitivity
–93
dBm
Sensitivity can be traded for current consumption by setting
MDMCFG2.DEM_DCFILT_OFF=1. The typical current consumption
is then reduced from 18.8 mA to 16.4 mA at sensitivity limit. The
sensitivity is typically reduced to -92 dBm
915 MHz, 500 kBaud data rate, sensitivity optimized, MDMCFG2.DEM_DCFILT_OFF=0 (MDMCFG2.DEM_DCFILT_OFF=1
cannot be used for data rates > 250 kBaud )
(MSK, 1% packet error rate, 20 bytes packet length, 812 kHz digital channel filter bandwidth)
Receiver
sensitivity
–87
dBm
SWRS038D
Page 11 of 92
CC1100
Parameter
Min
Typ
Max
Unit
Condition/Note
dBm
Desired channel 3dB above the sensitivity limit. Compliant
Blocking
Blocking at ±2 MHz offset,
1.2 kBaud, 868 MHz
-53
Blocking at ±2 MHz offset,
500 kBaud, 868 MHz
-51
Blocking at ±10 MHz offset,
1.2 kBaud, 868 MHz
-43
Blocking at ±10 MHz offset,
500 kBaud, 868 MHz
-43
with ETSI EN 300 220 class 2 receiver requirement.
dBm
Desired channel 3dB above the sensitivity limit. Compliant
with ETSI EN 300 220 class 2 receiver requirement.
dBm
Desired channel 3dB above the sensitivity limit. Compliant
with ETSI EN 300 220 class 2 receiver requirement.
dBm
Desired channel 3dB above the sensitivity limit. Compliant
with ETSI EN 300 220 class 2 receiver requirement.
General
Spurious emissions
RX latency
-68
–57
dBm
25 MHz – 1 GHz
(Maximum figure is the ETSI EN 300 220 limit)
-66
–47
dBm
Above 1 GHz
(Maximum figure is the ETSI EN 300 220 limit)
9
bit
Serial operation. Time from start of reception until data is
available on the receiver data output pin is equal to 9 bit.
Table 5: RF Receive Section
SWRS038D
Page 12 of 92
CC1100
4.3
RF Transmit Section
Tc = 25°C, VDD = 3.0V, +10dBm if nothing else stated. All measurement results are obtained using the CC1100EM reference
designs ([5] and [6]).
Parameter
Min
Typ
Max
Unit
Differential load
impedance
315 MHz
122 + j31
433 MHz
116 + j41
868/915 MHz
86.5 + j43
Output power,
highest setting
+10
Ω
dBm
Condition/Note
Differential impedance as seen from the RF-port (RF_P and
RF_N) towards the antenna. Follow the CC1100EM reference
design ([5] and [6]) available from theTI website.
Output power is programmable, and full range is available in all
frequency bands
(Output power may be restricted by regulatory limits. See also
Application Note AN039 [3].
Delivered to a 50Ω single-ended load via CC1100EM reference
design ([5] and [6]) RF matching network.
Output power,
lowest setting
-30
dBm
Output power is programmable, and full range is available in all
frequency bands.
Delivered to a 50Ω single-ended load via CC1100EM reference
design([5] and [6]) RF matching network.
Harmonics,
radiated
Measured on CC1100EM reference designs([5] and [6]) with
CW, 10 dBm output power
nd
-50
-40
nd
-34
-45
2 Harm, 433 MHz
rd
3 Harm, 433 MHz
2 Harm, 868 MHz
rd
3 Harm, 868 MHz
dBm
Harmonics,
conducted
The antennas used during the radiated measurements (SMAFF433 from R.W.Badland and Nearson S331 868/915) plays a part
in attenuating the harmonics
Measured with 10 dBm CW, TX frequency at 315.00 MHz,
433.00 MHz, 868.00 MHz, or 915.00 MHz
315 MHz
< -33
< -38
433 MHz
< -51
< -34
868 MHz
< -32
915 MHz
< -30
dBm
Frequencies below 960 MHz
Frequencies above 960 MHz
Frequencies below 1 GHz
Frequencies above 1 GHz
SWRS038D
Page 13 of 92
CC1100
Spurious emissions,
conducted
Harmonics not
included
Measured with 10 dBm CW, TX frequency at 315.00 MHz,
433.00 MHz, 868.00 MHz or 915.00 MHz
315 MHz
< -58
< -53
433 MHz
< -50
< -54
< -56
Frequencies below 1 GHz
Frequencies above 1 GHz
Frequencies within 47-74, 87.5-118, 174-230, 470-862 MHz
868 MHz
< -50
< -51
< -53
Frequencies below 1 GHz
Frequencies above 1 GHz
Frequencies within 47-74, 87.5-118, 174-230, 470-862 MHz.
dBm
Frequencies below 960 MHz
Frequencies above 960 MHz
The peak conducted spurious emission is -53dBm @ 699 MHz,
which is in an EN300220 restricted band limited to -54dBm. All
radiated spurious emissions are within the limits of ETSI.
915 MHz
Frequencies below 960 MHz
Frequencies above 960 MHz
< -51
< -51
General
TX latency
8
bit
Serial operation. Time from sampling the data on the transmitter
data input DIO pin until it is observed on the RF output ports.
Table 6: RF Transmit Section
4.4
Crystal Oscillator
Tc = 25°C @ VDD = 3.0 V if nothing else is stated.
Parameter
Crystal frequency
Tolerance
Min
Typ
Max
Unit
26
26
27
MHz
±40
ppm
Condition/Note
This is the total tolerance including a) initial tolerance, b)
crystal loading, c) aging, and d) temperature dependence.
The acceptable crystal tolerance depends on RF frequency
and channel spacing / bandwidth.
ESR
Start-up time
100
150
Ω
µs
Measured on the CC1100EM reference designs ([5] and [6])
using crystal AT-41CD2 from NDK.
This parameter is to a large degree crystal dependent.
Table 7: Crystal Oscillator Parameters
SWRS038D
Page 14 of 92
CC1100
4.5
Low Power RC Oscillator
Tc = 25°C, VDD = 3.0 V if nothing else is stated. All measurement results obtained using the CC1100EM reference designs ([5]
and [6]).
Parameter
Min
Typ
Max
Calibrated frequency
34.7
34.7
36
kHz
±1
%
Frequency accuracy after
calibration
Temperature coefficient
Supply voltage coefficient
Initial calibration time
Unit
Condition/Note
Calibrated RC Oscillator frequency is XTAL
frequency divided by 750
+0.5
% / °C
Frequency drift when temperature changes after
calibration
+3
%/V
Frequency drift when supply voltage changes after
calibration
2
ms
When the RC Oscillator is enabled, calibration is
continuously done in the background as long as
the crystal oscillator is running.
Table 8: RC Oscillator Parameters
4.6
Frequency Synthesizer Characteristics
Tc = 25°C @ VDD = 3.0 V if nothing else is stated. All measurement results are obtained using the CC1100EM reference
designs ([5] and [6]). Min figures are given using a 27 MHz crystal. Typ and max are given using a 26 MHz crystal.
Parameter
Programmed frequency
resolution
Min
397
Typ
FXOSC/
16
2
Max
Unit
412
Hz
Condition/Note
26-27 MHz crystal.
The resolution (in Hz) is equal for all frequency
bands.
Synthesizer frequency
tolerance
±40
ppm
Given by crystal used. Required accuracy
(including temperature and aging) depends on
frequency band and channel bandwidth /
spacing.
RF carrier phase noise
–89
dBc/Hz
@ 50 kHz offset from carrier
RF carrier phase noise
–89
dBc/Hz
@ 100 kHz offset from carrier
RF carrier phase noise
–90
dBc/Hz
@ 200 kHz offset from carrier
RF carrier phase noise
–98
dBc/Hz
@ 500 kHz offset from carrier
RF carrier phase noise
–107
dBc/Hz
@ 1 MHz offset from carrier
RF carrier phase noise
–113
dBc/Hz
@ 2 MHz offset from carrier
RF carrier phase noise
–119
dBc/Hz
@ 5 MHz offset from carrier
RF carrier phase noise
–129
dBc/Hz
@ 10 MHz offset from carrier
PLL turn-on / hop time
85.1
88.4
88.4
µs
Time from leaving the IDLE state until arriving in
the RX, FSTXON or TX state, when not
performing calibration.
Crystal oscillator running.
PLL RX/TX settling time
9.3
9.6
9.6
µs
Settling time for the 1·IF frequency step from RX
to TX
PLL TX/RX settling time
20.7
21.5
21.5
µs
Settling time for the 1·IF frequency step from TX
to RX
PLL calibration time
694
721
721
µs
Calibration can be initiated manually or
automatically before entering or after leaving
RX/TX.
Table 9: Frequency Synthesizer Parameters
SWRS038D
Page 15 of 92
CC1100
4.7
Analog Temperature Sensor
The characteristics of the analog temperature sensor at 3.0 V supply voltage are listed in Table 10
below. Note that it is necessary to write 0xBF to the PTEST register to use the analog temperature
sensor in the IDLE state.
Parameter
Min
Typ
Max
Unit
Output voltage at –40°C
0.651
V
Output voltage at 0°C
0.747
V
Output voltage at +40°C
0.847
V
Output voltage at +80°C
0.945
V
Temperature coefficient
2.45
Error in calculated
temperature, calibrated
-2
*
0
mV/°C
2
*
°C
Condition/Note
Fitted from –20 °C to +80 °C
From –20 °C to +80 °C when using 2.45 mV / °C,
after 1-point calibration at room temperature
*
The indicated minimum and maximum error with 1point calibration is based on simulated values for
typical process parameters
Current consumption
increase when enabled
0.3
mA
Table 10: Analog Temperature Sensor Parameters
4.8
DC Characteristics
Tc = 25°C if nothing else stated.
Digital Inputs/Outputs
Min
Max
Unit
Condition
Logic "0" input voltage
0
0.7
V
Logic "1" input voltage
VDD-0.7
VDD
V
Logic "0" output voltage
0
0.5
V
For up to 4 mA output current
Logic "1" output voltage
VDD-0.3
VDD
V
For up to 4 mA output current
Logic "0" input current
N/A
–50
nA
Input equals 0V
Logic "1" input current
N/A
50
nA
Input equals VDD
Table 11: DC Characteristics
4.9
Power-On Reset
When the power supply complies with the requirements in Table 12 below, proper Power-On-Reset
functionality is guaranteed. Otherwise, the chip should be assumed to have unknown state until
transmitting an SRES strobe over the SPI interface. See Section 19.1 on page 42 for further details.
Parameter
Min
Power-up ramp-up time.
Power off time
1
Typ
Max
Unit
Condition/Note
5
ms
From 0V until reaching 1.8V
ms
Minimum time between power-on and power-off
Table 12: Power-On Reset Requirements
SWRS038D
Page 16 of 92
CC1100
GND
RBIAS
DGUARD
GND
Pin Configuration
SI
5
20 19 18 17 16
SCLK 1
15 AVDD
SO (GDO1) 2
14 AVDD
GDO2 3
13 RF_N
DVDD 4
12 RF_P
DCOUPL 5
11 AVDD
7
8
9 10
GDO0 (ATEST)
CSn
XOSC_Q1
AVDD
XOSC_Q2
6
GND
Exposed die
attach pad
Figure 1: Pinout Top View
Note: The exposed die attach pad must be connected to a solid ground plane as this is the main
ground connection for the chip.
Pin #
Pin Name
Pin type
Description
1
SCLK
Digital Input
Serial configuration interface, clock input
2
SO (GDO1)
Digital Output
Serial configuration interface, data output.
Optional general output pin when CSn is high
3
GDO2
Digital Output
Digital output pin for general use:
• Test signals
• FIFO status signals
• Clear Channel Indicator
• Clock output, down-divided from XOSC
• Serial output RX data
4
DVDD
Power (Digital)
1.8 - 3.6 V digital power supply for digital I/O’s and for the digital core
voltage regulator
5
DCOUPL
Power (Digital)
1.6 - 2.0 V digital power supply output for decoupling.
NOTE: This pin is intended for use with the CC1100 only. It can not be used
to provide supply voltage to other devices.
6
GDO0
Digital I/O
(ATEST)
Digital output pin for general use:
• Test signals
• FIFO status signals
• Clear Channel Indicator
• Clock output, down-divided from XOSC
• Serial output RX data
• Serial input TX data
Also used as analog test I/O for prototype/production testing
7
CSn
Digital Input
Serial configuration interface, chip select
8
XOSC_Q1
Analog I/O
Crystal oscillator pin 1, or external clock input
9
AVDD
Power (Analog)
1.8 - 3.6 V analog power supply connection
10
XOSC_Q2
Analog I/O
Crystal oscillator pin 2
SWRS038D
Page 17 of 92
CC1100
Pin #
Pin Name
Pin type
Description
11
AVDD
Power (Analog)
1.8 -3.6 V analog power supply connection
12
RF_P
RF I/O
Positive RF input signal to LNA in receive mode
Positive RF output signal from PA in transmit mode
13
RF_N
RF I/O
Negative RF input signal to LNA in receive mode
Negative RF output signal from PA in transmit mode
14
AVDD
Power (Analog)
1.8 - 3.6 V analog power supply connection
15
AVDD
Power (Analog)
1.8 - 3.6 V analog power supply connection
16
GND
Ground (Analog)
Analog ground connection
17
RBIAS
Analog I/O
External bias resistor for reference current
18
DGUARD
Power (Digital)
Power supply connection for digital noise isolation
19
GND
Ground (Digital)
Ground connection for digital noise isolation
20
SI
Digital Input
Serial configuration interface, data input
Table 13: Pinout Overview
6
Circuit Description
FREQ
SYNTH
90
PA
RC OSC
BIAS
RBIAS
XOSC
XOSC_Q1
RXFIFO
DIGITAL INTERFACE TO MCU
0
RF_N
MODULATOR
RF_P
TXFIFO
ADC
PACKET HANDLER
LNA
FEC / INTERLEAVER
ADC
DEMODULATOR
RADIO CONTROL
SCLK
SO (GDO1)
SI
CSn
GDO0 (ATEST)
GDO2
XOSC_Q2
Figure 2: CC1100 Simplified Block Diagram
A simplified block diagram of CC1100 is shown
in Figure 2.
CC1100
features a low-IF receiver. The
received RF signal is amplified by the lownoise amplifier (LNA) and down-converted in
quadrature (I and Q) to the intermediate
frequency (IF). At IF, the I/Q signals are
digitised by the ADCs. Automatic gain control
(AGC), fine channel filtering and demodulation
bit/packet synchronization are performed
digitally.
The transmitter part of CC1100 is based on
direct synthesis of the RF frequency. The
SWRS038D
frequency synthesizer includes a completely
on-chip LC VCO and a 90 degree phase
shifter for generating the I and Q LO signals to
the down-conversion mixers in receive mode.
A crystal is to be connected to XOSC_Q1 and
XOSC_Q2. The crystal oscillator generates the
reference frequency for the synthesizer, as
well as clocks for the ADC and the digital part.
A 4-wire SPI serial interface is used for
configuration and data buffer access.
The digital baseband includes support for
channel configuration, packet handling, and
data buffering.
Page 18 of 92
CC1100
7
Application Circuit
Only a few external components are required
for using the CC1100. The recommended
application circuits are shown in Figure 3 and
Figure 4. The external components are
described in Table 14, and typical values are
given in Table 15.
The balun and LC filter component values and
their placement are important to keep the
performance
optimized.
It
is
highly
recommended to follow the CC1100EM
reference design [5] and [6].
Bias Resistor
The bias resistor R171 is used to set an
accurate bias current.
The crystal oscillator uses an external crystal
with two loading capacitors (C81 and C101).
See Section 27 on page 53 for details.
Balun and RF Matching
Additional Filtering
The components between the RF_N/RF_P
pins and the point where the two signals are
joined together (C131, C121, L121 and L131
for the 315/433 MHz reference design [5].
L121, L131, C121, L122, C131, C122 and
L132 for the 868/915 MHz reference design
[6]) form a balun that converts the differential
RF signal on CC1100 to a single-ended RF
signal. C124 is needed for DC blocking.
Together with an appropriate LC network, the
balun components also transform the
impedance to match a 50 Ω antenna (or
cable). Suggested values for 315 MHz, 433
MHz, and 868/915 MHz are listed in Table 15.
Additional external components (e.g. an RF
SAW filter) may be used in order to improve
the performance in specific applications.
Component
Crystal
Power Supply Decoupling
The power supply must be properly decoupled
close to the supply pins. Note that decoupling
capacitors are not shown in the application
circuit. The placement and the size of the
decoupling capacitors are very important to
achieve the optimum performance. The
CC1100EM reference design ([5] and [6])
should be followed closely.
Description
C51
Decoupling capacitor for on-chip voltage regulator to digital part
C81/C101
Crystal loading capacitors, see Section 27 on page 53 for details
C121/C131
RF balun/matching capacitors
C122
RF LC filter/matching filter capacitor (315 and 433 MHz). RF balun/matching
capacitor (868/915 MHz).
C123
RF LC filter/matching capacitor
C124
RF balun DC blocking capacitor
C125
RF LC filter DC blocking capacitor (only needed if there is a DC path in the antenna)
L121/L131
RF balun/matching inductors (inexpensive multi-layer type)
L122
RF LC filter/matching filter inductor (315 and 433 MHz). RF balun/matching inductor
(868/915 MHz). (inexpensive multi-layer type)
L123
RF LC filter/matching filter inductor (inexpensive multi-layer type)
L124
RF LC filter/matching filter inductor (inexpensive multi-layer type)
L132
RF balun/matching inductor. (inexpensive multi-layer type)
R171
Resistor for internal bias current reference.
XTAL
26MHz - 27MHz crystal, see Section 27 on page 53 for details.
Table 14: Overview of External Components (excluding supply decoupling capacitors)
SWRS038D
Page 19 of 92
CC1100
1.8V-3.6V power supply
R171
Digital Inteface
SO
(GDO1)
GDO2
(optional)
1 SCLK
2 SO
(GDO1)
3 GDO2
GND 16
RBIAS 17
DGUARD 18
SCLK
GND 19
SI 20
SI
Antenna
(50 Ohm)
AVDD 15
CC1100
C131
L131
AVDD 14
C125
RF_N 13
DIE ATTACH PAD:
RF_P 12
9 AVDD
8 XOSC_Q1
C51
7 CSn
6 GDO0
5 DCOUPL
10 XOSC_Q2
4 DVDD
L122
C121
AVDD 11
L121
L123
C122
C123
C124
GDO0
(optional)
CSn
XTAL
C81
C101
Figure 3: Typical Application and Evaluation Circuit 315/433 MHz (excluding supply
decoupling capacitors)
1.8V-3.6V power supply
R171
GND 16
RBIAS 17
AVDD 14
3 GDO2
RF_N 13
DIE ATTACH PAD:
10 XOSC_Q2
L132
L131
C121
RF_P 12
AVDD 11
9 AVDD
7 CSn
5 DCOUPL
Antenna
(50 Ohm)
C131
AVDD 15
2 SO (GDO1)
4 DVDD
C51
DGUARD 18
1 SCLK
8 XOSC_Q1
SO
(GDO1)
GDO2
(optional)
6 GDO0
Digital Inteface
SCLK
GND 19
SI 20
SI
L123
L124
C125
C122
C123
L121
L122
GDO0
(optional)
CSn
C124
XTAL
C81
C101
Figure 4: Typical Application and Evaluation Circuit 868/915 MHz (excluding supply
decoupling capacitors)
SWRS038D
Page 20 of 92
CC1100
Component
Value at 315MHz
Value at 433MHz
Value at
868/915MHz
Manufacturer
C51
100 nF ± 10%, 0402 X5R
Murata GRM1555C series
C81
27 pF ± 5%, 0402 NP0
Murata GRM1555C series
C101
27 pF ± 5%, 0402 NP0
Murata GRM1555C series
C121
6.8 pF ± 0.5 pF,
0402 NP0
3.9 pF ± 0.25 pF,
0402 NP0
1.0 pF ± 0.25
pF, 0402 NP0
Murata GRM1555C series
C122
12 pF ± 5%, 0402
NP0
8.2 pF ± 0.5 pF,
0402 NP0
1.5 pF ± 0.25
pF, 0402 NP0
Murata GRM1555C series
C123
6.8 pF ± 0.5 pF,
0402 NP0
5.6 pF ± 0.5 pF,
0402 NP0
3.3 pF ± 0.25
pF, 0402 NP0
Murata GRM1555C series
C124
220 pF ± 5%,
0402 NP0
220 pF ± 5%,
0402 NP0
100 pF ± 5%,
0402 NP0
Murata GRM1555C series
C125
220 pF ± 5%,
0402 NP0
220 pF ± 5%,
0402 NP0
100 pF ± 5%,
0402 NP0
Murata GRM1555C series
C131
6.8 pF ± 0.5 pF,
0402 NP0
3.9 pF ± 0.25 pF,
0402 NP0
1.5 pF ± 0.25
pF, 0402 NP0
Murata GRM1555C series
L121
33 nH ± 5%, 0402
monolithic
27 nH ± 5%, 0402
monolithic
12 nH ± 5%,
0402 monolithic
Murata LQG15HS series
L122
18 nH ± 5%, 0402
monolithic
22 nH ± 5%, 0402
monolithic
18 nH ± 5%,
0402 monolithic
Murata LQG15HS series
L123
33 nH ± 5%, 0402
monolithic
27 nH ± 5%, 0402
monolithic
12 nH ± 5%,
0402 monolithic
Murata LQG15HS series
12 nH ± 5%,
0402 monolithic
Murata LQG15HS series
12 nH ± 5%,
0402 monolithic
Murata LQG15HS series
18 nH ± 5%,
0402 monolithic
Murata LQG15HS series
L124
L131
33 nH ± 5%, 0402
monolithic
27 nH ± 5%, 0402
monolithic
L132
R171
56 kΩ ± 1%, 0402
Koa RK73 series
XTAL
26.0 MHz surface mount crystal
NDK, AT-41CD2
Table 15: Bill Of Materials for the Application Circuit
The Gerber files for the CC1100EM reference designs ([5] and [6]) are available from the TI website.
SWRS038D
Page 21 of 92
CC1100
8
Configuration Overview
CC1100 can be configured to achieve optimum
performance for many different applications.
Configuration is done using the SPI interface.
The following key parameters can be
programmed:
•
•
•
•
•
•
•
•
•
•
Power-down / power up mode
Crystal oscillator power-up / power-down
Receive / transmit mode
RF channel selection
Data rate
Modulation format
RX channel filter bandwidth
RF output power
Data buffering with separate 64-byte
receive and transmit FIFOs
Packet radio hardware support
SWRS038D
•
•
•
Forward Error Correction (FEC) with
interleaving
Data Whitening
Wake-On-Radio (WOR)
Details of each configuration register can be
found in Section 33, starting on page 60.
Figure 5 shows a simplified state diagram that
explains the main CC1100 states, together with
typical usage and current consumption. For
detailed information on controlling the CC1100
state machine, and a complete state diagram,
see Section 19, starting on page 42.
Page 22 of 92
CC1100
Sleep
SPWD or wake-on-radio (WOR)
SIDLE
Default state when the radio is not
receiving or transmitting. Typ.
current consumption: 1.6 mA.
CSn = 0
Lowest power mode. Most
register values are retained.
Current consumption typ
400 nA, or typ 900 nA when
wake-on-radio (WOR) is
enabled.
IDLE
SXOFF
SCAL
Used for calibrating frequency
synthesizer upfront (entering
CSn = 0
receive or transmit mode can
Manual freq.
then be done quicker).
synth. calibration SRX or STX or SFSTXON or wake-on-radio (WOR)
Transitional state. Typ. current
consumption: 8.2 mA.
SFSTXON
Frequency synthesizer is on,
ready to start transmitting.
Transmission starts very
quickly after receiving the STX
command strobe.Typ. current
consumption: 8.2 mA.
Frequency
synthesizer startup,
optional calibration,
settling
Crystal
oscillator off
All register values are
retained. Typ. current
consumption; 0.16 mA.
Frequency synthesizer is turned on, can optionally be
calibrated, and then settles to the correct frequency.
Transitional state. Typ. current consumption: 8.2 mA.
Frequency
synthesizer on
STX
SRX or wake-on-radio (WOR)
STX
TXOFF_MODE = 01
SFSTXON or RXOFF_MODE = 01
Typ. current consumption:
13.5 mA at -6 dBm output,
16.9 mA at 0 dBm output,
30.7 mA at +10 dBm output.
STX or RXOFF_MODE=10
Transmit mode
SRX or TXOFF_MODE = 11
TXOFF_MODE = 00
In FIFO-based modes,
transmission is turned off and
this state entered if the TX
FIFO becomes empty in the
middle of a packet. Typ.
current consumption: 1.6 mA.
Receive mode
RXOFF_MODE = 00
Optional transitional state. Typ.
current consumption: 8.2mA.
TX FIFO
underflow
Typ. current
consumption:
from 14.4 mA (strong
input signal) to 15.4mA
(weak input signal).
Optional freq.
synth. calibration
SFTX
RX FIFO
overflow
In FIFO-based modes,
reception is turned off and this
state entered if the RX FIFO
overflows. Typ. current
consumption: 1.6 mA.
SFRX
IDLE
Figure 5: Simplified State Diagram, with Typical Current Consumption at 1.2 kBaud Data Rate
and MDMCFG2.DEM_DCFILT_OFF=1 (current optimized). Freq. Band = 868 MHz
SWRS038D
Page 23 of 92
CC1100
9
Configuration Software
CC1100 can be configured using the SmartRF®
Studio software [7]. The SmartRF® Studio
software is highly recommended for obtaining
optimum register settings, and for evaluating
performance and functionality. A screenshot of
the SmartRF® Studio user interface for CC1100
is shown in Figure 6.
After chip reset, all the registers have default
values as shown in the tables in Section 33.
The optimum register setting might differ from
the default value. After a reset all registers that
shall be different from the default value
therefore needs to be programmed through
the SPI interface.
Figure 6: SmartRF® Studio [7] User Interface
10
4-wire Serial Configuration and Data Interface
CC1100 is configured via a simple 4-wire SPIcompatible interface (SI, SO, SCLK and CSn)
where CC1100 is the slave. This interface is
also used to read and write buffered data. All
transfers on the SPI interface are done most
significant bit first.
All transactions on the SPI interface start with
a header byte containing a R/W;¯ bit, a burst
access bit (B), and a 6-bit address (A5 – A0).
SWRS038D
The CSn pin must be kept low during transfers
on the SPI bus. If CSn goes high during the
transfer of a header byte or during read/write
from/to a register,
the transfer will be
cancelled. The timing for the address and data
transfer on the SPI interface is shown in Figure
7 with reference to Table 16.
When CSn is pulled low, the MCU must wait
until CC1100 SO pin goes low before starting to
transfer the header byte. This indicates that
the crystal is running. Unless the chip was in
Page 24 of 92
CC1100
the SLEEP or XOFF states, the SO pin will
always go low immediately after taking CSn
low.
Figure 7: Configuration Registers Write and Read Operations
Parameter
Description
Min
Max
Units
fSCLK
SCLK frequency
-
10
MHz
-
9
-
6.5
100 ns delay inserted between address byte and data byte (single access), or
between address and data, and between each data byte (burst access).
SCLK frequency, single access
No delay between address and data byte
SCLK frequency, burst access
No delay between address and data byte, or between data bytes
tsp,pd
CSn low to positive edge on SCLK, in power-down mode
150
-
µs
tsp
CSn low to positive edge on SCLK, in active mode
20
-
ns
tch
Clock high
50
-
ns
tcl
Clock low
50
-
ns
trise
Clock rise time
-
5
ns
tfall
Clock fall time
-
5
ns
tsd
Setup data (negative SCLK edge) to
positive edge on SCLK
Single access
55
-
ns
Burst access
76
-
(tsd applies between address and data bytes, and between
data bytes)
thd
Hold data after positive edge on SCLK
20
-
ns
tns
Negative edge on SCLK to CSn high.
20
-
ns
Table 16: SPI Interface Timing Requirements
Note: The minimum tsp,pd figure in Table 16 can be used in cases where the user does not read the
CHIP_RDYn signal. CSn low to positive edge on SCLK when the chip is woken from power-down
depends on the start-up time of the crystal being used. The 150 us in Table 16 is the crystal oscillator
start-up time measured on CC1100EM reference designs ([5] and [6]) using crystal AT-41CD2 from
NDK.
SWRS038D
Page 25 of 92
CC1100
10.1 Chip Status Byte
When the header byte, data byte, or command
strobe is sent on the SPI interface, the chip
status byte is sent by the CC1100 on the SO
pin. The status byte contains key status
signals, useful for the MCU. The first bit, s7, is
the CHIP_RDYn signal; this signal must go low
before the first positive edge of SCLK. The
CHIP_RDYn signal indicates that the crystal is
running.
Bits 6, 5, and 4 comprise the STATE value.
This value reflects the state of the chip. The
XOSC and power to the digital core is on in
the IDLE state, but all other modules are in
power down. The frequency and channel
configuration should only be updated when the
chip is in this state. The RX state will be active
Bits
when the chip is in receive mode. Likewise, TX
is active when the chip is transmitting.
The last four bits (3:0) in the status byte contains FIFO_BYTES_AVAILABLE. For read
operations (the R/W;¯ bit in the header byte is
set to 1), the FIFO_BYTES_AVAILABLE field
contains the number of bytes available for
reading from the RX FIFO. For write
operations (the R/W;¯ bit in the header byte is
set to 0), the FIFO_BYTES_AVAILABLE field
contains the number of bytes that can be
written
to
the
TX
FIFO.
When
FIFO_BYTES_AVAILABLE=15, 15 or more
bytes are available/free.
Table 17 gives a status byte summary.
Name
Description
7
CHIP_RDYn
Stays high until power and crystal have stabilized. Should always be low when
using the SPI interface.
6:4
STATE[2:0]
Indicates the current main state machine mode
Value
State
000
IDLE
Description
IDLE state
(Also reported for some transitional states
instead of SETTLING or CALIBRATE)
3:0
FIFO_BYTES_AVAILABLE[3:0]
001
RX
Receive mode
010
TX
Transmit mode
011
FSTXON
Fast TX ready
100
CALIBRATE
Frequency synthesizer calibration is
running
101
SETTLING
PLL is settling
110
RXFIFO_OVERFLOW
RX FIFO has overflowed. Read out any
useful data, then flush the FIFO with SFRX
111
TXFIFO_UNDERFLOW
TX FIFO has underflowed. Acknowledge
with SFTX
The number of bytes available in the RX FIFO or free bytes in the TX FIFO
Table 17: Status Byte Summary
10.2 Register Access
The configuration registers on the CC1100 are
located on SPI addresses from 0x00 to 0x2E.
Table 36 on page 61 lists all configuration
registers. It is highly recommended to use
SmartRF® Studio [7] to generate optimum
register settings. The detailed description of
each register is found in Section 33.1 and
33.2, starting on page 64. All configuration
registers can be both written to and read. The
R/W;¯ bit controls if the register should be
written to or read. When writing to registers,
SWRS038D
the status byte is sent on the SO pin each time
a header byte or data byte is transmitted on
the SI pin. When reading from registers, the
status byte is sent on the SO pin each time a
header byte is transmitted on the SI pin.
Registers with consecutive addresses can be
accessed in an efficient way by setting the
burst bit (B) in the header byte. The address
bits (A5 – A0) set the start address in an
internal address counter. This counter is
incremented by one each new byte (every 8
clock pulses). The burst access is either a
Page 26 of 92
CC1100
read or a write access and must be terminated
by setting CSn high.
For register addresses in the range 0x300x3D, the burst bit is used to select between
status registers, burst bit is one, and command
strobes, burst bit is zero (see 10.4 below).
Because of this, burst access is not available
for status registers and they must be accesses
one at a time. The status registers can only be
read.
10.3 SPI Read
When reading register fields over the SPI
interface while the register fields are updated
by the radio hardware (e.g. MARCSTATE or
TXBYTES), there is a small, but finite,
probability that a single read from the register
is being corrupt. As an example, the
probability of any single read from TXBYTES
being corrupt, assuming the maximum data
rate is used, is approximately 80 ppm. Refer to
the CC1100 Errata Notes [1] for more details.
10.4 Command Strobes
Command Strobes may be viewed as single
byte instructions to CC1100. By addressing a
command strobe register, internal sequences
will be started. These commands are used to
disable the crystal oscillator, enable receive
mode, enable wake-on-radio etc. The 13
command strobes are listed in Table 35 on
page 60.
The command strobe registers are accessed
by transferring a single header byte (no data is
being transferred). That is, only the R/W;¯ bit,
the burst access bit (set to 0), and the six
address bits (in the range 0x30 through 0x3D)
are written. The R/W;¯ bit can be either one or
zero
and
will
determine
how
the
FIFO_BYTES_AVAILABLE field in the status
byte should be interpreted.
When writing command strobes, the status
byte is sent on the SO pin.
A command strobe may be followed by any
other SPI access without pulling CSn high.
However, if an SRES strobe is being issued,
one will have to waith for SO to go low again
before the next header byte can be issued as
shown in Figure 8. The command strobes are
executed immediately, with the exception of
the SPWD and the SXOFF strobes that are
executed when CSn goes high.
SWRS038D
Figure 8: SRES Command Strobe
10.5 FIFO Access
The 64-byte TX FIFO and the 64-byte RX
FIFO are accessed through the 0x3F address.
When the R/W;¯ bit is zero, the TX FIFO is
accessed, and the RX FIFO is accessed when
the R/W;¯ bit is one.
The TX FIFO is write-only, while the RX FIFO
is read-only.
The burst bit is used to determine if the FIFO
access is a single byte access or a burst
access. The single byte access method
expects a header byte with the burst bit set to
zero and one data byte. After the data byte a
new header byte is expected; hence, CSn can
remain low. The burst access method expects
one header byte and then consecutive data
bytes until terminating the access by setting
CSn high.
The following header bytes access the FIFOs:
•
0x3F: Single byte access to TX FIFO
•
0x7F: Burst access to TX FIFO
•
0xBF: Single byte access to RX FIFO
•
0xFF: Burst access to RX FIFO
When writing to the TX FIFO, the status byte
(see Section 10.1) is output for each new data
byte on SO, as shown in Figure 7. This status
byte can be used to detect TX FIFO underflow
while writing data to the TX FIFO. Note that
the status byte contains the number of bytes
free before writing the byte in progress to the
TX FIFO. When the last byte that fits in the TX
FIFO is transmitted on SI, the status byte
received concurrently on SO will indicate that
one byte is free in the TX FIFO.
The TX FIFO may be flushed by issuing a
SFTX command strobe. Similarly, a SFRX
command strobe will flush the RX FIFO. A
SFTX or SFRX command strobe can only be
issued in the IDLE, TXFIFO_UNDERLOW, or
RXFIFO_OVERFLOW states. Both FIFOs are
flushed when going to the SLEEP state.
Figure 9 gives a brief overview of different
register access types possible.
Page 27 of 92
CC1100
10.6 PATABLE Access
The 0x3E address is used to access the
PATABLE, which is used for selecting PA
power control settings. The SPI expects up to
eight data bytes after receiving the address.
By programming the PATABLE, controlled PA
power ramp-up and ramp-down can be
achieved, as well as ASK modulation shaping
for reduced bandwidth. Note that both the ASK
modulation shaping and the PA ramping is
limited to output powers up to -1 dBm, and the
PATABLE settings allowed are 0x00 and 0x30
to 0x3F. See SmartRF® Studio [7] for
recommended shaping / PA ramping
sequences.
See Section 24 on page 49 for details on
output power programming.
The PATABLE is an 8-byte table that defines
the PA control settings to use for each of the
eight PA power values (selected by the 3-bit
value FREND0.PA_POWER). The table is
written and read from the lowest setting (0) to
the highest (7), one byte at a time. An index
counter is used to control the access to the
table. This counter is incremented each time a
byte is read or written to the table, and set to
the lowest index when CSn is high. When the
highest value is reached the counter restarts
at zero.
The access to the PATABLE is either single
byte or burst access depending on the burst
bit. When using burst access the index counter
will count up; when reaching 7 the counter will
restart at 0. The R/W;¯ bit controls whether the
access is a read or a write access.
If one byte is written to the PATABLE and this
value is to be read out then CSn must be set
high before the read access in order to set the
index counter back to zero.
Note that the content of the PATABLE is lost
when entering the SLEEP state, except for the
first byte (index 0).
Figure 9: Register Access Types
11
Microcontroller Interface and Pin Configuration
In a typical system, CC1100 will interface to a
microcontroller. This microcontroller must be
able to:
• Program CC1100 into different modes
• Read and write buffered data
• Read back status information via the 4-wire
SPI-bus configuration interface (SI, SO,
SCLK and CSn).
11.1 Configuration Interface
The microcontroller uses four I/O pins for the
SPI configuration interface (SI, SO, SCLK and
CSn). The SPI is described in Section 10 on
page 24.
11.2 General Control and Status Pins
The CC1100 has two dedicated configurable
pins (GDO0 and GDO2) and one shared pin
SWRS038D
(GDO1) that can output internal status
information useful for control software. These
pins can be used to generate interrupts on the
MCU. See Section 30 page 55 for more details
on the signals that can be programmed.
GDO1 is shared with the SO pin in the SPI
interface. The default setting for GDO1/SO is
3-state output. By selecting any other of the
programming options, the GDO1/SO pin will
become a generic pin. When CSn is low, the
pin will always function as a normal SO pin.
In the synchronous and asynchronous serial
modes, the GDO0 pin is used as a serial TX
data input pin while in transmit mode.
The GDO0 pin can also be used for an on-chip
analog temperature sensor. By measuring the
voltage on the GDO0 pin with an external
ADC, the temperature can be calculated.
Specifications for the temperature sensor are
found in Section 4.7 on page 16.
Page 28 of 92
CC1100
With default PTEST register setting (0x7F) the
temperature sensor output is only available
when the frequency synthesizer is enabled
(e.g. the MANCAL, FSTXON, RX, and TX
states). It is necessary to write 0xBF to the
PTEST register to use the analog temperature
sensor in the IDLE state. Before leaving the
IDLE state, the PTEST register should be
restored to its default value (0x7F).
latched and a command strobe is generated
internally according to the pin configuration. It
is only possible to change state with this
functionality. That means that for instance RX
will not be restarted if SI and SCLK are set to
RX and CSn toggles. When CSn is low the SI
and SCLK has normal SPI functionality.
All pin control command strobes are executed
immediately, except the SPWD strobe, which is
delayed until CSn goes high.
11.3 Optional Radio Control Feature
The CC1100 has an optional way of controlling
the radio, by reusing SI, SCLK, and CSn from
the SPI interface. This feature allows for a
simple three-pin control of the major states of
the radio: SLEEP, IDLE, RX, and TX.
This optional functionality is enabled with the
MCSM0.PIN_CTRL_EN configuration bit.
State changes are commanded as follows:
When CSn is high the SI and SCLK is set to
the desired state according to Table 18. When
CSn goes low the state of SI and SCLK is
12
CSn
SCLK
SI
Function
1
X
X
Chip unaffected by SCLK/SI
↓
0
0
Generates SPWD strobe
↓
0
1
Generates STX strobe
↓
1
0
Generates SIDLE strobe
↓
1
1
Generates SRX strobe
0
SPI
mode
SPI
mode
SPI mode (wakes up into
IDLE if in SLEEP/XOFF)
Table 18: Optional Pin Control Coding
Data Rate Programming
The data rate used when transmitting, or the
data rate expected in receive is programmed
by
the
MDMCFG3.DRATE_M
and
the
MDMCFG4.DRATE_E configuration registers.
The data rate is given by the formula below.
As the formula shows, the programmed data
rate depends on the crystal frequency.
If DRATE_M is rounded to the nearest integer
and becomes 256, increment DRATE_E and
use DRATE_M = 0.
The data rate can be set from 1.2 kBaud to
500 kBaud with the minimum step size of:
Min Data
Rate
[kBaud]
Typical Data
Rate
[kBaud]
Max Data
Rate
[kBaud]
Data rate
Step Size
[kBaud]
0.8
1.2 / 2.4
3.17
0.0062
3.17
4.8
6.35
0.0124
The following approach can be used to find
suitable values for a given data rate:
6.35
9.6
12.7
0.0248
12.7
19.6
25.4
0.0496
⎢
⎛R
⋅ 2 20 ⎞⎥
⎟⎟⎥
DRATE _ E = ⎢log 2 ⎜⎜ DATA
⎝ f XOSC ⎠⎦⎥
⎣⎢
25.4
38.4
50.8
0.0992
50.8
76.8
101.6
0.1984
101.6
153.6
203.1
0.3967
203.1
250
406.3
0.7935
406.3
500
500
1.5869
RDATA =
(256 + DRATE _ M ) ⋅ 2
DRATE _ E
2 28
⋅ f XOSC
R DATA ⋅ 2
− 256
f XOSC ⋅ 2 DRATE _ E
28
DRATE _ M =
Table 19: Data Rate Step Size
SWRS038D
Page 29 of 92
CC1100
13
Receiver Channel Filter Bandwidth
In order to meet different channel width
requirements, the receiver channel filter is
programmable. The MDMCFG4.CHANBW_E and
MDMCFG4.CHANBW_M configuration registers
control the receiver channel filter bandwidth,
which scales with the crystal oscillator
frequency. The following formula gives the
relation between the register settings and the
channel filter bandwidth:
BWchannel =
f XOSC
8 ⋅ (4 + CHANBW _ M )·2CHANBW _ E
The CC1100 supports the following channel
filter bandwidths:
MDMCFG4.CHANBW_E
MDMCFG4.
CHANBW_M
00
01
10
11
00
812
406
203
102
01
650
325
162
81
10
541
270
135
68
11
464
232
116
58
For best performance, the channel filter
bandwidth should be selected so that the
signal bandwidth occupies at most 80% of the
channel filter bandwidth. The channel centre
tolerance due to crystal accuracy should also
be subtracted from the signal bandwidth. The
following example illustrates this:
With the channel filter bandwidth set to
500 kHz, the signal should stay within 80% of
500 kHz, which is 400 kHz. Assuming
915 MHz frequency and ±20 ppm frequency
uncertainty for both the transmitting device and
the receiving device, the total frequency
uncertainty is ±40 ppm of 915MHz, which is
±37 kHz. If the whole transmitted signal
bandwidth is to be received within 400kHz, the
transmitted signal bandwidth should be
maximum 400kHz – 2·37 kHz, which is
326 kHz.
Table 20: Channel Filter Bandwidths [kHz]
(Assuming a 26MHz crystal)
14
Demodulator, Symbol Synchronizer, and Data Decision
CC1100 contains an advanced and highly
configurable demodulator. Channel filtering
and frequency offset compensation is
performed digitally. To generate the RSSI level
(see Section 17.3 for more information) the
signal level in the channel is estimated. Data
filtering is also included for enhanced
performance.
14.1 Frequency Offset Compensation
When using 2-FSK, GFSK, or MSK
modulation, the demodulator will compensate
for the offset between the transmitter and
receiver frequency, within certain limits, by
estimating the centre of the received data.
This value is available in the FREQEST status
register. Writing the value from FREQEST into
FSCTRL0.FREQOFF
the
frequency
synthesizer
is
automatically
adjusted
according to the estimated frequency offset.
The tracking range of the algorithm is
selectable as fractions of the channel
bandwidth with the FOCCFG.FOC_LIMIT
configuration register.
SWRS038D
If the FOCCFG.FOC_BS_CS_GATE bit is set,
the offset compensator will freeze until carrier
sense asserts. This may be useful when the
radio is in RX for long periods with no traffic,
since the algorithm may drift to the boundaries
when trying to track noise.
The tracking loop has two gain factors, which
affects the settling time and noise sensitivity of
the algorithm. FOCCFG.FOC_PRE_K sets the
gain before the sync word is detected, and
FOCCFG.FOC_POST_K selects the gain after
the sync word has been found.
Note that frequency offset compensation is not
supported for ASK or OOK modulation.
14.2 Bit Synchronization
The bit synchronization algorithm extracts the
clock from the incoming symbols. The
algorithm requires that the expected data rate
is programmed as described in Section 12 on
page 29. Re-synchronization is performed
continuously to adjust for error in the incoming
symbol rate.
Page 30 of 92
CC1100
14.3 Byte Synchronization
Byte synchronization is achieved by a
continuous sync word search. The sync word
is a 16 bit configurable field (can be repeated
to get a 32 bit) that is automatically inserted at
the start of the packet by the modulator in
transmit mode. The demodulator uses this
field to find the byte boundaries in the stream
of bits. The sync word will also function as a
system identifier, since only packets with the
correct predefined sync word will be received if
the sync word detection in RX is enabled in
register MDMCFG2 (see Section 17.1). The
sync word detector correlates against the
user-configured 16 or 32 bit sync word. The
15
In transmit mode, the packet handler can be
configured to add the following elements to the
packet stored in the TX FIFO:
•
•
•
•
•
•
•
•
•
A programmable number of preamble
bytes
A two byte synchronization (sync) word.
Can be duplicated to give a 4-byte sync
word (recommended). It is not possible to
only insert preamble or only insert a sync
word.
A CRC checksum computed over the
data field.
•
•
Preamble detection.
Sync word detection.
CRC computation and CRC check.
One byte address check.
SWRS038D
Bit
Field Name
Description
7:0
RSSI
RSSI value
Table 21: Received Packet Status Byte 1
(first byte appended after the data)
Bit
Field Name
Description
7
CRC_OK
1: CRC for received data OK
(or CRC disabled)
0: CRC error in received data
In addition, the following can be
implemented on the data field and the
optional 2-byte CRC checksum:
Whitening of the data with a PN9
sequence.
Forward error correction by the use of
interleaving and coding of the data
(convolutional coding).
Packet length check (length byte checked
against a programmable maximum
length).
De-whitening
De-interleaving and decoding
Optionally, two status bytes (see Table 21
and Table 22) with RSSI value, Link
Quality Indication, and CRC status can be
appended in the RX FIFO.
•
•
•
The recommended setting is 4-byte
preamble and 4-byte sync word, except
for 500 kBaud data rate where the
recommended preamble length is 8 bytes.
•
In receive mode, the packet handling support
will de-construct the data packet by
implementing the following (if enabled):
•
•
•
•
In order to make false detections of sync
words less likely, a mechanism called
preamble quality indication (PQI) can be used
to qualify the sync word. A threshold value for
the preamble quality must be exceeded in
order for a detected sync word to be accepted.
See Section 17.2 on page 37 for more details.
Packet Handling Hardware Support
The CC1100 has built-in hardware support for
packet oriented radio protocols.
•
correlation threshold can be set to 15/16,
16/16, or 30/32 bits match. The sync word can
be further qualified using the preamble quality
indicator mechanism described below and/or a
carrier sense condition. The sync word is
configured through the SYNC1 and SYNC0
registers.
6:0
LQI
Indicating the link quality
Table 22: Received Packet Status Byte 2
(second byte appended after the data)
•
•
Note that register fields that control the
packet handling features should only be
altered when CC1100 is in the IDLE state.
15.1 Data Whitening
From a radio perspective, the ideal over the air
data are random and DC free. This results in
the smoothest power distribution over the
occupied bandwidth. This also gives the
regulation loops in the receiver uniform
operation conditions (no data dependencies).
Page 31 of 92
CC1100
Real world data often contain long sequences
of zeros and ones. Performance can then be
improved by whitening the data before
transmitting, and de-whitening the data in the
receiver. With CC1100, this can be done
automatically
by
setting
PKTCTRL0.WHITE_DATA=1. All data, except
the preamble and the sync word, are then
XOR-ed with a 9-bit pseudo-random (PN9)
sequence before being transmitted, as shown
in Figure 10. At the receiver end, the data are
XOR-ed with the same pseudo-random
sequence. This way, the whitening is reversed,
and the original data appear in the receiver.
The PN9 sequence is initialized to all 1’s.
Figure 10: Data Whitening in TX Mode
15.2 Packet Format
The format of the data packet can be
configured and consists of the following items
(see Figure 11):
•
•
Preamble
Synchronization word
•
•
•
•
•
Optional length byte
Optional address byte
Payload
Optional 2 byte CRC
Data field
16/32 bits
8
bits
8
bits
8 x n bits
Legend:
Inserted automatically in TX,
processed and removed in RX.
CRC-16
Address field
8 x n bits
Length field
Preamble bits
(1010...1010)
Sync word
Optional data whitening
Optionally FEC encoded/decoded
Optional CRC-16 calculation
Optional user-provided fields processed in TX,
processed but not removed in RX.
Unprocessed user data (apart from FEC
and/or whitening)
16 bits
Figure 11: Packet Format
The preamble pattern is an alternating
sequence of ones and zeros (10101010…).
The minimum length of the preamble is
programmable. When enabling TX, the
modulator will start transmitting the preamble.
SWRS038D
When the programmed number of preamble
bytes has been transmitted, the modulator will
send the sync word and then data from the TX
FIFO if data is available. If the TX FIFO is
empty, the modulator will continue to send
Page 32 of 92
CC1100
preamble bytes until the first byte is written to
the TX FIFO. The modulator will then send the
sync word and then the data bytes. The
number of preamble bytes is programmed with
the MDMCFG1.NUM_PREAMBLE value.
The synchronization word is a two-byte value
set in the SYNC1 and SYNC0 registers. The
sync word provides byte synchronization of the
incoming packet. A one-byte synch word can
be emulated by setting the SYNC1 value to the
preamble pattern. It is also possible to emulate
a
32
bit
sync
word
by
using
MDMCFG2.SYNC_MODE set to 3 or 7. The sync
word will then be repeated twice.
(PKTCTRL0.LENGTH_CONFIG=0) this opens
the possibility to have a different length field
configuration than supported for variable
length packets (in variable packet length mode
the length byte is the first byte after the sync
word). At the start of reception, the packet
length is set to a large value. The MCU reads
out enough bytes to interpret the length field in
the packet. Then the PKTLEN value is set
according to this value. The end of packet will
occur when the byte counter in the packet
handler is equal to the PKTLEN register. Thus,
the MCU must be able to program the correct
length, before the internal counter reaches the
packet length.
CC1100 supports both constant packet length
protocols and variable length protocols.
Variable or fixed packet length mode can be
used for packets up to 255 bytes. For longer
packets, infinite packet length mode must be
used.
Fixed packet length mode is selected by
setting PKTCTRL0.LENGTH_CONFIG=0. The
desired packet length is set by the PKTLEN
register.
In
variable
packet
length
mode,
PKTCTRL0.LENGTH_CONFIG=1, the packet
length is configured by the first byte after the
sync word. The packet length is defined as the
payload data, excluding the length byte and
the optional CRC. The PKTLEN register is
used to set the maximum packet length
allowed in RX. Any packet received with a
length byte with a value greater than PKTLEN
will be discarded.
With PKTCTRL0.LENGTH_CONFIG=2, the
packet length is set to infinite and transmission
and reception will continue until turned off
manually. As described in the next section, this
can be used to support packet formats with
different length configuration than natively
supported by CC1100. One should make sure
that TX mode is not turned off during the
transmission of the first half of any byte. Refer
to the CC1100 Errata Notes [1] for more details.
15.2.2 Packet Length > 255
Also the packet automation control register,
PKTCTRL0, can be reprogrammed during TX
and RX. This opens the possibility to transmit
and receive packets that are longer than 256
bytes and still be able to use the packet
handling hardware support. At the start of the
packet, the infinite packet length mode
(PKTCTRL0.LENGTH_CONFIG=2) must be
active. On the TX side, the PKTLEN register is
set to mod(length, 256). On the RX side the
MCU reads out enough bytes to interpret the
length field in the packet and sets the PKTLEN
register to mod(length, 256). When less than
256 bytes remains of the packet the MCU
disables infinite packet length mode and
activates fixed packet length mode. When the
internal byte counter reaches the PKTLEN
value, the transmission or reception ends (the
radio enters the state determined by
TXOFF_MODE or RXOFF_MODE). Automatic
CRC appending/checking can also be used
(by setting PKTCTRL0.CRC_EN=1).
When for example a 600-byte packet is to be
transmitted, the MCU should do the following
(see also Figure 12)
•
Set PKTCTRL0.LENGTH_CONFIG=2.
•
Note that the minimum packet length
supported (excluding the optional length byte
and CRC) is one byte of payload data.
Pre-program the PKTLEN
mod(600, 256) = 88.
•
Transmit at least 345 bytes (600 - 255), for
example by filling the 64-byte TX FIFO six
times (384 bytes transmitted).
15.2.1 Arbitrary Length Field Configuration
•
Set PKTCTRL0.LENGTH_CONFIG=0.
The packet length register, PKTLEN, can be
reprogrammed during receive and transmit. In
combination with fixed packet length mode
•
The transmission ends when the packet
counter reaches 88. A total of 600 bytes
are transmitted.
SWRS038D
register to
Page 33 of 92
CC1100
Internal byte counter in packet handler counts from 0 to 255 and then starts at 0 again
0,1,..........,88,....................255,0,........,88,..................,255,0,........,88,..................,255,0,.......................
Infinite packet length enabled
Fixed packet length
enabled when less than
256 bytes remains of
packet
600 bytes transmitted and
received
Length field transmitted and received. Rx and Tx PKTLEN value set to mod(600,256) = 88
Figure 12: Packet Length > 255
15.3 Packet Filtering in Receive Mode
CC1100 supports three different types of
packet-filtering; address filtering, maximum
length filtering, and CRC filtering.
15.3.1 Address Filtering
Setting PKTCTRL1.ADR_CHK to any other
value than zero enables the packet address
filter. The packet handler engine will compare
the destination address byte in the packet with
the programmed node address in the ADDR
register and the 0x00 broadcast address when
PKTCTRL1.ADR_CHK=10 or both 0x00 and
0xFF
broadcast
addresses
when
PKTCTRL1.ADR_CHK=11. If the received
address matches a valid address, the packet is
received and written into the RX FIFO. If the
address match fails, the packet is discarded
and receive mode restarted (regardless of the
MCSM1.RXOFF_MODE setting).
If the received address matches a valid
address when using infinite packet length
mode and address filtering is enabled, 0xFF
will be written into the RX FIFO followed by the
address byte and then the payload data.
15.3.2 Maximum Length Filtering
In
variable
packet
length
mode,
PKTCTRL0.LENGTH_CONFIG=1,
the
PKTLEN.PACKET_LENGTH register value is
used to set the maximum allowed packet
length. If the received length byte has a larger
value than this, the packet is discarded and
receive mode restarted (regardless of the
MCSM1.RXOFF_MODE setting).
15.3.3 CRC Filtering
The filtering of a packet when CRC check fails
is
enabled
by
setting
PKTCTRL1.CRC_AUTOFLUSH=1. The CRC
auto flush function will flush the entire RX
SWRS038D
FIFO if the CRC check fails. After auto flushing
the RX FIFO, the next state depends on the
MCSM1.RXOFF_MODE setting.
When using the auto flush function, the
maximum packet length is 63 bytes in variable
packet length mode and 64 bytes in fixed
packet length mode. Note that the maximum
allowed packet length is reduced by two bytes
when
PKTCTRL1.APPEND_STATUS
is
enabled, to make room in the RX FIFO for the
two status bytes appended at the end of the
packet. Since the entire RX FIFO is flushed
when the CRC check fails, the previously
received packet must be read out of the FIFO
before receiving the current packet. The MCU
must not read from the current packet until the
CRC has been checked as OK.
15.4 Packet Handling in Transmit Mode
The payload that is to be transmitted must be
written into the TX FIFO. The first byte written
must be the length byte when variable packet
length is enabled. The length byte has a value
equal to the payload of the packet (including
the optional address byte). If address
recognition is enabled on the receiver, the
second byte written to the TX FIFO must be
the address byte. If fixed packet length is
enabled, then the first byte written to the TX
FIFO should be the address (if the receiver
uses address recognition).
The modulator will first send the programmed
number of preamble bytes. If data is available
in the TX FIFO, the modulator will send the
two-byte (optionally 4-byte) sync word and
then the payload in the TX FIFO. If CRC is
enabled, the checksum is calculated over all
the data pulled from the TX FIFO and the
result is sent as two extra bytes following the
payload data. If the TX FIFO runs empty
before the complete packet has been
Page 34 of 92
CC1100
transmitted,
the
radio
will
enter
TXFIFO_UNDERFLOW state. The only way to
exit this state is by issuing an SFTX strobe.
Writing to the TX FIFO after it has underflowed
will not restart TX mode.
If whitening is enabled, everything following
the sync words will be whitened. This is done
before the optional FEC/Interleaver stage.
Whitening
is
enabled
by
setting
PKTCTRL0.WHITE_DATA=1.
If FEC/Interleaving is enabled, everything
following the sync words will be scrambled by
the interleaver and FEC encoded before being
modulated. FEC is enabled by setting
MDMCFG1.FEC_EN=1.
15.5 Packet Handling in Receive Mode
In receive mode, the demodulator and packet
handler will search for a valid preamble and
the sync word. When found, the demodulator
has obtained both bit and byte synchronism
and will receive the first payload byte.
If FEC/Interleaving is enabled, the FEC
decoder will start to decode the first payload
byte. The interleaver will de-scramble the bits
before any other processing is done to the
data.
If whitening is enabled, the data will be dewhitened at this stage.
When variable packet length mode is enabled,
the first byte is the length byte. The packet
handler stores this value as the packet length
and receives the number of bytes indicated by
the length byte. If fixed packet length mode is
used, the packet handler will accept the
programmed number of bytes.
Next, the packet handler optionally checks the
address and only continues the reception if the
address matches. If automatic CRC check is
enabled, the packet handler computes CRC
and matches it with the appended CRC
checksum.
At the end of the payload, the packet handler
will optionally write two extra packet status
bytes (see Table 21 and Table 22) that contain
CRC status, link quality indication, and RSSI
value.
when a packet has been received/transmitted.
Additionally, for packets longer than 64 bytes
the RX FIFO needs to be read while in RX and
the TX FIFO needs to be refilled while in TX.
This means that the MCU needs to know the
number of bytes that can be read from or
written to the RX FIFO and TX FIFO
respectively. There are two possible solutions
to get the necessary status information:
a) Interrupt Driven Solution
In both RX and TX one can use one of the
GDO pins to give an interrupt when a sync
word has been received/transmitted and/or
when a complete packet has been
received/transmitted
(IOCFGx.GDOx_CFG=0x06). In addition, there
are
2
configurations
for
the
IOCFGx.GDOx_CFG
register
that
are
associated
with
the
RX
FIFO
(IOCFGx.GDOx_CFG=0x00
and
IOCFGx.GDOx_CFG=0x01) and two that are
associated
with
the
TX
FIFO
(IOCFGx.GDOx_CFG=0x02
and
IOCFGx.GDOx_CFG=0x03) that can be used
as interrupt sources to provide information on
how many bytes are in the RX FIFO and TX
FIFO respectively. See Table 34.
b) SPI Polling
The PKTSTATUS register can be polled at a
given rate to get information about the current
GDO2 and GDO0 values respectively. The
RXBYTES and TXBYTES registers can be
polled at a given rate to get information about
the number of bytes in the RX FIFO and TX
FIFO respectively. Alternatively, the number of
bytes in the RX FIFO and TX FIFO can be
read from the chip status byte returned on the
MISO line each time a header byte, data byte,
or command strobe is sent on the SPI bus.
It is recommended to employ an interrupt
driven solution as high rate SPI polling will
reduce the RX sensitivity. Furthermore, as
explained in Section 10.3 and the CC1100
Errata Notes [1], when using SPI polling there
is a small, but finite, probability that a single
read from registers PKTSTATUS , RXBYTES
and TXBYTES is being corrupt. The same is
the case when reading the chip status byte.
Refer to the TI website for SW examples ([8]
and [9]).
15.6 Packet Handling in Firmware
When implementing a packet oriented radio
protocol in firmware, the MCU needs to know
SWRS038D
Page 35 of 92
CC1100
16
Modulation Formats
CC1100 supports amplitude, frequency, and
16.2 Minimum Shift Keying
phase shift modulation formats. The desired
modulation
format
is
set
in
the
MDMCFG2.MOD_FORMAT register.
When using MSK1, the complete transmission
(preamble, sync word, and payload) will be
MSK modulated.
Optionally, the data stream can be Manchester
coded by the modulator and decoded by the
demodulator. This option is enabled by setting
MDMCFG2.MANCHESTER_EN=1. Manchester
encoding is not supported at the same time as
using the FEC/Interleaver option.
Phase shifts are performed with a constant
transition time.
16.1 Frequency Shift Keying
2-FSK can optionally be shaped by a
Gaussian filter with BT = 1, producing a GFSK
modulated signal.
The frequency deviation is programmed with
the DEVIATION_M and DEVIATION_E values
in the DEVIATN register. The value has an
exponent/mantissa form, and the resultant
deviation is given by:
f dev =
f xosc
⋅ (8 + DEVIATION _ M ) ⋅ 2 DEVIATION _ E
217
The symbol encoding is shown in Table 23.
Format
Symbol
Coding
2-FSK/GFSK
‘0’
– Deviation
‘1’
+ Deviation
Table 23: Symbol Encoding for 2-FSK/GFSK
Modulation
The fraction of a symbol period used to
change the phase can be modified with the
DEVIATN.DEVIATION_M setting. This is
equivalent to changing the shaping of the
symbol.
The MSK modulation format implemented in
CC1100 inverts the sync word and data
compared to e.g. signal generators.
16.3 Amplitude Modulation
CC1100
supports two different forms of
amplitude modulation: On-Off Keying (OOK)
and Amplitude Shift Keying (ASK).
OOK modulation simply turns on or off the PA
to modulate 1 and 0 respectively.
The ASK variant supported by the CC1100
allows programming of the modulation depth
(the difference between 1 and 0), and shaping
of the pulse amplitude. Pulse shaping will
produce a more bandwidth constrained output
spectrum. Note that the pulse shaping feature
on the CC1100 does only support output power
up to about -1dBm. The PATABLE settings that
can be used for pulse shaping are 0x00 and
0x30 to 0x3F.
1
Identical to offset QPSK with half-sine
shaping (data coding may differ)
SWRS038D
Page 36 of 92
CC1100
17
Received Signal Qualifiers and Link Quality Information
CC1100 has several qualifiers that can be used
to increase the likelihood that a valid sync
word is detected.
17.1 Sync Word Qualifier
If sync word detection in RX is enabled in
register MDMCFG2 the CC1100 will not start
filling the RX FIFO and perform the packet
filtering described in Section 15.3 before a
valid sync word has been detected. The sync
word
qualifier
mode
is
set
by
MDMCFG2.SYNC_MODE and is summarized in
Table 24. Carrier sense is described in Section
17.4.
MDMCFG2.
A “Preamble Quality Reached” signal can be
observed on one of the GDO pins by setting
IOCFGx.GDOx_CFG=8. It is also possible to
determine if preamble quality is reached by
checking the PQT_REACHED bit in the
PKTSTATUS register. This signal / bit asserts
when the received signal exceeds the PQT.
17.3 RSSI
The RSSI value is an estimate of the signal
power level in the chosen channel. This value
is based on the current gain setting in the RX
chain and the measured signal level in the
channel.
In RX mode, the RSSI value can be read
continuously from the RSSI status register until
the demodulator detects a sync word (when
sync word detection is enabled). At that point
the RSSI readout value is frozen until the next
time the chip enters the RX state. The RSSI
value is in dBm with ½dB resolution. The RSSI
update rate, fRSSI, depends on the receiver
filter bandwidth (BWchannel defined in Section
13) and AGCCTRL0.FILTER_LENGTH.
Sync Word Qualifier Mode
SYNC_MODE
000
No preamble/sync
001
15/16 sync word bits detected
010
16/16 sync word bits detected
011
30/32 sync word bits detected
100
No preamble/sync, carrier sense
above threshold
101
15/16 + carrier sense above threshold
110
16/16 + carrier sense above threshold
111
30/32 + carrier sense above threshold
Table 24: Sync Word Qualifier Mode
17.2 Preamble Quality Threshold (PQT)
The Preamble Quality Threshold (PQT) syncword qualifier adds the requirement that the
received sync word must be preceded with a
preamble with a quality above the
programmed threshold.
Another use of the preamble quality threshold
is as a qualifier for the optional RX termination
timer. See Section 19.7 on page 46 for details.
The preamble quality estimator increases an
internal counter by one each time a bit is
received that is different from the previous bit,
and decreases the counter by 8 each time a
bit is received that is the same as the last bit.
The threshold is configured with the register
field PKTCTRL1.PQT. A threshold of 4·PQT for
this counter is used to gate sync word
detection. By setting the value to zero, the
preamble quality qualifier of the synch word is
disabled.
SWRS038D
f RSSI =
2 ⋅ BWchannel
8 ⋅ 2 FILTER _ LENGTH
If PKTCTRL1.APPEND_STATUS is enabled the
last RSSI value of the packet is automatically
added to the first byte appended after the
payload.
The RSSI value read from the RSSI status
register is a 2’s complement number. The
following procedure can be used to convert the
RSSI reading to an absolute power level
(RSSI_dBm).
1) Read the RSSI status register
2) Convert the reading from a hexadecimal
number to a decimal number (RSSI_dec)
3) If RSSI_dec ≥ 128 then RSSI_dBm =
(RSSI_dec - 256)/2 – RSSI_offset
4) Else if RSSI_dec < 128 then RSSI_dBm =
(RSSI_dec)/2 – RSSI_offset
Table 25 gives
RSSI_offset.
typical
values
for
the
Figure 13 and Figure 14 shows typical plots of
RSSI reading as a function of input power
level for different data rates.
Page 37 of 92
CC1100
Data rate [kBaud]
RSSI_offset [dB], 433 MHz
RSSI_offset [dB], 868 MHz
1.2
75
74
38.4
75
74
250
79
78
500
79
77
Table 25: Typical RSSI_offset Values
0
-10
-20
-30
RSSI Readout [dBm]
-40
-50
-60
-70
-80
-90
-100
-110
-120
-120
-110
-100
-90
-80
-70
-60
-50
-40
-30
-20
-10
0
Input Power [dBm]
1.2 kBuad
38.4 kBaud
250 kBaud
500 kBaud
Figure 13: Typical RSSI Value vs. Input Power Level for Different Data Rates at 433 MHz
0
-10
-20
RSSI Readout [dBm]
-30
-40
-50
-60
-70
-80
-90
-100
-110
-120
-120
-110
-100
-90
-80
-70
-60
-50
-40
-30
-20
-10
0
Input Power [dBm]
1.2 kBaud
38.4 kBuad
250 kBaud
500 kBaud
Figure 14: Typical RSSI Value vs. Input Power Level for Different Data Rates at 868 MHz
SWRS038D
Page 38 of 92
CC1100
Carrier Sense (CS) is used as a sync word
qualifier and for CCA and can be asserted
based on two conditions, which can be
individually adjusted:
•
•
CS is asserted when the RSSI is above a
programmable absolute threshold, and deasserted when RSSI is below the same
threshold (with hysteresis).
CS is asserted when the RSSI has
increased with a programmable number of
dB from one RSSI sample to the next, and
de-asserted when RSSI has decreased
with the same number of dB. This setting
is not dependent on the absolute signal
level and is thus useful to detect signals in
environments with time varying noise floor.
Carrier Sense can be used as a sync word
qualifier that requires the signal level to be
higher than the threshold for a sync word
search to be performed. The signal can also
be observed on one of the GDO pins by
setting IOCFGx.GDOx_CFG=14 and in the
status register bit PKTSTATUS.CS.
Other uses of Carrier Sense include the TX-ifCCA function (see Section 17.5 on page 40)
and the optional fast RX termination (see
Section 19.7 on page 46).
Studio to generate the correct MAGN_TARGET
setting.
Table 26 and Table 27 show the typical RSSI
readout values at the CS threshold at 2.4
kBaud and 250 kBaud data rate respectively.
The default CARRIER_SENSE_ABS_THR=0 (0
dB) and MAGN_TARGET=3 (33 dB) have been
used.
For other data rates the user must generate
similar tables to find the CS absolute
threshold.
MAX_DVGA_GAIN[1:0]
MAX_LNA_GAIN[2:0]
17.4 Carrier Sense (CS)
00
01
10
11
000
-97.5
-91.5
-85.5
-79.5
001
-94
-88
-82.5
-76
010
-90.5
-84.5
-78.5
-72.5
011
-88
-82.5
-76.5
-70.5
100
-85.5
-80
-73.5
-68
101
-84
-78
-72
-66
110
-82
-76
-70
-64
111
-79
-73.5
-67
-61
Table 26: Typical RSSI Value in dBm at CS
Threshold with Default MAGN_TARGET at 2.4
kBaud, 868 MHz
CS can be used to avoid interference from
other RF sources in the ISM bands.
MAX_DVGA_GAIN[1:0]
00
01
10
11
000
-90.5
-84.5
-78.5
-72.5
001
-88
-82
-76
-70
010
-84.5
-78.5
-72
-66
011
-82.5
-76.5
-70
-64
100
-80.5
-74.5
-68
-62
101
-78
-72
-66
-60
110
-76.5
-70
-64
-58
111
-74.5
-68
-62
-56
The absolute threshold related to the RSSI
value depends on the following register fields:
•
AGCCTRL2.MAX_LNA_GAIN
•
AGCCTRL2.MAX_DVGA_GAIN
•
AGCCTRL1.CARRIER_SENSE_ABS_THR
•
AGCCTRL2.MAGN_TARGET
• For a given AGCCTRL2.MAX_LNA_GAIN
and AGCCTRL2.MAX_DVGA_GAIN setting the
absolute threshold can be adjusted ±7 dB in
steps
of
1
dB
using
CARRIER_SENSE_ABS_THR.
The MAGN_TARGET setting is a compromise
between blocker tolerance/selectivity and
sensitivity. The value sets the desired signal
level in the channel into the demodulator.
Increasing this value reduces the headroom
for blockers, and therefore close-in selectivity.
It is strongly recommended to use SmartRF®
SWRS038D
MAX_LNA_GAIN[2:0]
17.4.1 CS Absolute Threshold
Table 27: Typical RSSI Value in dBm at CS
Threshold with Default MAGN_TARGET at 250
kBaud, 868 MHz
If the threshold is set high, i.e. only strong
signals are wanted, the threshold should be
adjusted upwards by first reducing the
MAX_LNA_GAIN
value
and
then
the
MAX_DVGA_GAIN value. This will reduce
power consumption in the receiver front end,
since the highest gain settings are avoided.
Page 39 of 92
CC1100
17.4.2 CS Relative Threshold
The relative threshold detects sudden changes
in the measured signal level. This setting is not
dependent on the absolute signal level and is
thus useful to detect signals in environments
with a time varying noise floor. The register
field AGCCTRL1.CARRIER_SENSE_REL_THR
is used to enable/disable relative CS, and to
select threshold of 6 dB, 10 dB, or 14 dB RSSI
change.
feature is called TX-if-CCA. Four
requirements can be programmed:
CCA
•
Always (CCA disabled, always goes to TX)
•
If RSSI is below threshold
•
Unless currently receiving a packet
•
Both the above (RSSI below threshold and
not currently receiving a packet)
17.6 Link Quality Indicator (LQI)
17.5 Clear Channel Assessment (CCA)
The Clear Channel Assessment (CCA) is used
to indicate if the current channel is free or
busy. The current CCA state is viewable on
any of the GDO pins by setting
IOCFGx.GDOx_ CFG=0x09.
MCSM1.CCA_MODE selects the mode to use
when determining CCA.
When the STX or SFSTXON command strobe is
given while CC1100 is in the RX state, the TX or
FSTXON state is only entered if the clear
channel requirements are fulfilled. The chip will
otherwise remain in RX (if the channel
becomes available, the radio will not enter TX
or FSTXON state before a new strobe
command is sent on the SPI interface). This
The Link Quality Indicator is a metric of the
current quality of the received signal. If
PKTCTRL1.APPEND_STATUS is enabled, the
value is automatically added to the last byte
appended after the payload. The value can
also be read from the LQI status register. The
LQI gives an estimate of how easily a received
signal can be demodulated by accumulating
the magnitude of the error between ideal
constellations and the received signal over the
64 symbols immediately following the sync
word. LQI is best used as a relative
measurement of the link quality (a high value
indicates a better link than what a low value
does), since the value is dependent on the
modulation format.
18 Forward Error Correction with Interleaving
18.1 Forward Error Correction (FEC)
CC1100 has built in support for Forward Error
Correction (FEC). To enable this option, set
MDMCFG1.FEC_EN to 1. FEC is only supported
in
fixed
packet
length
mode
(PKTCTRL0.LENGTH_CONFIG=0). FEC is
employed on the data field and CRC word in
order to reduce the gross bit error rate when
operating
near
the
sensitivity
limit.
Redundancy is added to the transmitted data
in such a way that the receiver can restore the
original data in the presence of some bit
errors.
The use of FEC allows correct reception at a
lower SNR, thus extending communication
range if the receiver bandwidth remains
constant. Alternatively, for a given SNR, using
FEC decreases the bit error rate (BER). As the
packet error rate (PER) is related to BER by:
PER = 1 − (1 − BER) packet _ length
a lower BER can be used to allow longer
packets, or a higher percentage of packets of
SWRS038D
a given length, to be transmitted successfully.
Finally, in realistic ISM radio environments,
transient and time-varying phenomena will
produce occasional errors even in otherwise
good reception conditions. FEC will mask such
errors and, combined with interleaving of the
coded data, even correct relatively long
periods of faulty reception (burst errors).
The FEC scheme adopted for CC1100 is
convolutional coding, in which n bits are
generated based on k input bits and the m
most recent input bits, forming a code stream
able to withstand a certain number of bit errors
between each coding state (the m-bit window).
The convolutional coder is a rate 1/2 code with
a constraint length of m = 4. The coder codes
one input bit and produces two output bits;
hence, the effective data rate is halved. I.e. to
transmit at the same effective datarate when
using FEC, it is necessary to use twice as high
over-the-air datarate. This will require a higher
receiver bandwidth, and thus reduce
sensitivity. In other words the improved
Page 40 of 92
CC1100
reception by using FEC and the degraded
sensitivity from a higher receiver bandwidth
will be counteracting factors.
receiver, the received symbols are written into
the columns of the matrix, whereas the data
passed onto the convolutional decoder is read
from the rows of the matrix.
18.2 Interleaving
When FEC and interleaving is used at least
one extra byte is required for trellis
termination. In addition, the amount of data
transmitted over the air must be a multiple of
the size of the interleaver buffer (two bytes).
The packet control hardware therefore
automatically inserts one or two extra bytes at
the end of the packet, so that the total length
of the data to be interleaved is an even
number. Note that these extra bytes are
invisible to the user, as they are removed
before the received packet enters the RX
FIFO.
Data received through radio channels will
often experience burst errors due to
interference and time-varying signal strengths.
In order to increase the robustness to errors
spanning multiple bits, interleaving is used
when FEC is enabled. After de-interleaving, a
continuous span of errors in the received
stream will become single errors spread apart.
CC1100 employs matrix interleaving, which is
illustrated in Figure 15. The on-chip
interleaving and de-interleaving buffers are 4 x
4 matrices. In the transmitter, the data bits
from the rate ½ convolutional coder are written
into the rows of the matrix, whereas the bit
sequence to be transmitted is read from the
columns of the matrix. Conversely, in the
When FEC and interleaving is used the
minimum data payload is 2 bytes.
Interleaver
Write buffer
Packet
Engine
Interleaver
Read buffer
FEC
Encoder
Modulator
Interleaver
Write buffer
Interleaver
Read buffer
FEC
Decoder
Demodulator
Packet
Engine
Figure 15: General Principle of Matrix Interleaving
SWRS038D
Page 41 of 92
CC1100
19
Radio Control
SIDLE
SPWD | SWOR
SLEEP
0
CAL_COMPLETE
MANCAL
3,4,5
IDLE
1
CSn = 0 | WOR
SXOFF
SCAL
CSn = 0
XOFF
2
SRX | STX | SFSTXON | WOR
FS_WAKEUP
6,7
FS_AUTOCAL = 01
&
SRX | STX | SFSTXON | WOR
FS_AUTOCAL = 00 | 10 | 11
&
SRX | STX | SFSTXON | WOR
SETTLING
9,10,11
SFSTXON
CALIBRATE
8
CAL_COMPLETE
FSTXON
18
STX
SRX
STX
TXOFF_MODE=01
SFSTXON | RXOFF_MODE = 01
STX | RXOFF_MODE = 10
TXOFF_MODE = 10
SRX | WOR
RXTX_SETTLING
21
TX
19,20
SRX | TXOFF_MODE = 11
TX_UNDERFLOW
22
TXOFF_MODE = 00
&
FS_AUTOCAL = 00 | 01
RX
13,14,15
RXOFF_MODE = 11
TXRX_SETTLING
16
RXOFF_MODE = 00
&
FS_AUTOCAL = 10 | 11
TXOFF_MODE = 00
&
FS_AUTOCAL = 10 | 11
TXFIFO_UNDERFLOW
( STX | SFSTXON ) & CCA
|
RXOFF_MODE = 01 | 10
CALIBRATE
12
SFTX
RXOFF_MODE = 00
&
FS_AUTOCAL = 00 | 01
RXFIFO_OVERFLOW
RX_OVERFLOW
17
SFRX
IDLE
1
Figure 16: Complete Radio Control State Diagram
CC1100 has a built-in state machine that is
used to switch between different operational
states (modes). The change of state is done
either by using command strobes or by
internal events such as TX FIFO underflow.
A simplified state diagram, together with
typical usage and current consumption, is
shown in Figure 5 on page 23. The complete
radio control state diagram is shown in Figure
16. The numbers refer to the state number
readable in the MARCSTATE status register.
This register is primarily for test purposes.
SWRS038D
19.1 Power-On Start-Up Sequence
When the power supply is turned on, the
system must be reset. This is achieved by one
of the two sequences described below, i.e.
automatic power-on reset (POR) or manual
reset.
After the automatic power-on reset or manual
reset it is also recommended to change the
signal that is output on the GDO0 pin. The
default setting is to output a clock signal with a
frequency of CLK_XOSC/192, but to optimize
Page 42 of 92
CC1100
performance in TX and RX an alternative GDO
setting should be selected from the settings
found in Table 34 on page 56.
XOSC and voltage regulator switched on
40 us
CSn
19.1.1 Automatic POR
A power-on reset circuit is included in the
CC1100. The minimum requirements stated in
Table 12 must be followed for the power-on
reset to function properly. The internal powerup sequence is completed when CHIP_RDYn
goes low. CHIP_RDYn is observed on the SO
pin after CSn is pulled low. See Section 10.1
for more details on CHIP_RDYn.
When the CC1100 reset is completed the chip
will be in the IDLE state and the crystal
oscillator will be running. If the chip has had
sufficient time for the crystal oscillator to
stabilize after the power-on-reset the SO pin
will go low immediately after taking CSn low. If
CSn is taken low before reset is completed the
SO pin will first go high, indicating that the
crystal oscillator is not stabilized, before going
low as shown in Figure 17.
Figure 17: Power-On Reset
19.1.2 Manual Reset
The other global reset possibility on CC1100
uses the SRES command strobe. By issuing
this strobe, all internal registers and states are
set to the default, IDLE state. The manual
power-up sequence is as follows (see Figure
18):
•
Set SCLK = 1 and SI = 0, to avoid
potential problems with pin control mode
(see Section 11.3 on page 29).
•
Strobe CSn low / high.
•
Hold CSn high for at least 40µs relative to
pulling CSn low
•
Pull CSn low and wait for SO to go low
(CHIP_RDYn).
•
Issue the SRES strobe on the SI line.
•
When SO goes low again, reset is
complete and the chip is in the IDLE state.
SWRS038D
SO
XOSC Stable
SI
SRES
Figure 18: Power-On Reset with SRES
Note that the above reset procedure is only
required just after the power supply is first
turned on. If the user wants to reset the CC1100
after this, it is only necessary to issue an SRES
command strobe.
19.2 Crystal Control
The crystal oscillator (XOSC) is either
automatically controlled or always on, if
MCSM0.XOSC_FORCE_ON is set.
In the automatic mode, the XOSC will be
turned off if the SXOFF or SPWD command
strobes are issued; the state machine then
goes to XOFF or SLEEP respectively. This
can only be done from the IDLE state. The
XOSC will be turned off when CSn is released
(goes high). The XOSC will be automatically
turned on again when CSn goes low. The
state machine will then go to the IDLE state.
The SO pin on the SPI interface must be
pulled low before the SPI interface is ready to
be used; as described in Section 10.1 on page
26.
If the XOSC is forced on, the crystal will
always stay on even in the SLEEP state.
Crystal oscillator start-up time depends on
crystal ESR and load capacitances. The
electrical specification for the crystal oscillator
can be found in Section 4.4 on page 14.
19.3 Voltage Regulator Control
The voltage regulator to the digital core is
controlled by the radio controller. When the
chip enters the SLEEP state, which is the state
with the lowest current consumption, the
voltage regulator is disabled. This occurs after
CSn is released when a SPWD command
strobe has been sent on the SPI interface. The
chip is now in the SLEEP state. Setting CSn
Page 43 of 92
CC1100
low again will turn on the regulator and crystal
oscillator and make the chip enter the IDLE
state.
state will change as indicated by the
MCSM1.TXOFF_MODE setting. The possible
destinations are the same as for RX.
When wake on radio is enabled, the WOR
module will control the voltage regulator as
described in Section 19.5.
The MCU can manually change the state from
RX to TX and vice versa by using the
command strobes. If the radio controller is
currently in transmit and the SRX strobe is
used, the current transmission will be ended
and the transition to RX will be done.
19.4 Active Modes
CC1100 has two active modes: receive and
transmit. These modes are activated directly
by the MCU by using the SRX and STX
command strobes, or automatically by Wake
on Radio.
The frequency synthesizer must be calibrated
regularly. CC1100 has one manual calibration
option (using the SCAL strobe), and three
automatic calibration options, controlled by the
MCSM0.FS_AUTOCAL setting:
•
Calibrate when going from IDLE to either
RX or TX (or FSTXON)
•
Calibrate when going from either RX or TX
to IDLE automatically
•
Calibrate every fourth time when going
from either RX or TX to IDLE automatically
If the radio goes from TX or RX to IDLE by
issuing an SIDLE strobe, calibration will not be
performed. The calibration takes a constant
number of XOSC cycles (see Table 28 for
timing details).
When RX is activated, the chip will remain in
receive mode until a packet is successfully
received or the RX termination timer expires
(see Section 19.7). Note: the probability that a
false sync word is detected can be reduced by
using PQT, CS, maximum sync word length,
and sync word qualifier mode as described in
Section 17. After a packet is successfully
received the radio controller will then go to the
state indicated by the MCSM1.RXOFF_MODE
setting. The possible destinations are:
•
IDLE
•
FSTXON: Frequency synthesizer on and
ready at the TX frequency. Activate TX
with STX .
•
TX: Start sending preamble
•
RX: Start search for a new packet
Similarly, when TX is active the chip will
remain in the TX state until the current packet
has been successfully transmitted. Then the
SWRS038D
If the radio controller is in RX when the STX or
SFSTXON command strobes are used, the TXif-CCA function will be used. If the channel is
not clear, the chip will remain in RX. The
MCSM1.CCA_MODE
setting
controls
the
conditions for clear channel assessment. See
Section 17.5 on page 40 for details.
The SIDLE command strobe can always be
used to force the radio controller to go to the
IDLE state.
19.5 Wake On Radio (WOR)
The optional Wake on Radio (WOR)
functionality enables CC1100 to periodically
wake up from SLEEP and listen for incoming
packets without MCU interaction.
When the WOR strobe command is sent on
the SPI interface, the CC1100 will go to the
SLEEP state when CSn is released. The RC
oscillator must be enabled before the WOR
strobe can be used, as it is the clock source
for the WOR timer. The on-chip timer will set
CC1100 into IDLE state and then RX state. After
a programmable time in RX, the chip will go
back to the SLEEP state, unless a packet is
received. See Figure 19 and Section 19.7 for
details on how the timeout works.
Set the CC1100 into the IDLE state to exit WOR
mode.
CC1100 can be set up to signal the MCU that a
packet has been received by using the GDO
pins. If a packet is received, the
MCSM1.RXOFF_MODE
will determine the
behaviour at the end of the received packet.
When the MCU has read the packet, it can put
the chip back into SLEEP with the SWOR strobe
from the IDLE state. The FIFO will loose its
contents in the SLEEP state.
The WOR timer has two events, Event 0 and
Event 1. In the SLEEP state with WOR
activated, reaching Event 0 will turn on the
digital regulator and start the crystal oscillator.
Event 1 follows Event 0 after a programmed
timeout.
Page 44 of 92
CC1100
The time between two consecutive Event 0 is
programmed with a mantissa value given by
WOREVT1.EVENT0 and WOREVT0.EVENT0,
and
an
exponent
value
set
by
WORCTRL.WOR_RES. The equation is:
t Event 0 =
750
⋅ EVENT 0 ⋅ 2 5⋅WOR _ RES
f XOSC
The Event 1 timeout is programmed with
WORCTRL.EVENT1. Figure 19 shows the
timing relationship between Event 0 timeout
and Event 1 timeout.
oscillator is locked to the main crystal
frequency divided by 750.
In applications where the radio wakes up very
often, typically several times every second, it
is possible to do the RC oscillator calibration
once
and
then
turn
off
calibration
(WORCTRL.RC_CAL=0) to reduce the current
consumption. This requires that RC oscillator
calibration values are read from registers
RCCTRL0_STATUS and RCCTRL1_STATUS
and written back to RCCTRL0 and RCCTRL1
respectively. If the RC oscillator calibration is
turned off it will have to be manually turned on
again if temperature and supply voltage
changes.
Refer to Application Note AN047 [4] for further
details.
19.6 Timing
Figure 19: Event 0 and Event 1 Relationship
The time from the CC1100 enters SLEEP state
until the next Event0 is programmed to appear
(tSLEEP in Figure 19) should be larger than
11.08 ms when using a 26 MHz crystal and
10.67 ms when a 27 MHz crystal is used. If
tSLEEP is less than 11.08 (10.67) ms there is a
chance that the consecutive Event 0 will occur
750
⋅128 seconds
f XOSC
The radio controller controls most of the timing
in CC1100, such as synthesizer calibration, PLL
lock time, and RX/TX turnaround times. Timing
from IDLE to RX and IDLE to TX is constant,
dependent on the auto calibration setting.
RX/TX and TX/RX turnaround times are
constant. The calibration time is constant
18739 clock periods. Table 28 shows timing in
crystal clock cycles for key state transitions.
Power on time and XOSC start-up times are
variable, but within the limits stated in Table 7.
Note that in a frequency hopping spread
spectrum or a multi-channel protocol the
calibration time can be reduced from 721 µs to
approximately 150 µs. This is explained in
Section 32.2.
too early. Application Note AN047 [4] explains
in detail the theory of operation and the
different registers involved when using WOR,
as well as highlighting important aspects when
using WOR mode.
Description
XOSC
Periods
26 MHz
Crystal
IDLE to RX, no calibration
2298
88.4µs
19.5.1 RC Oscillator and Timing
IDLE to RX, with calibration
~21037
809µs
The frequency of the low-power RC oscillator
used for the WOR functionality varies with
temperature and supply voltage. In order to
keep the frequency as accurate as possible,
the RC oscillator will be calibrated whenever
possible, which is when the XOSC is running
and the chip is not in the SLEEP state. When
the power and XOSC is enabled, the clock
used by the WOR timer is a divided XOSC
clock. When the chip goes to the sleep state,
the RC oscillator will use the last valid
calibration result. The frequency of the RC
IDLE to TX/FSTXON, no
calibration
2298
88.4µs
IDLE to TX/FSTXON, with
calibration
~21037
809µs
TX to RX switch
560
21.5µs
RX to TX switch
250
9.6µs
RX or TX to IDLE, no calibration
2
0.1µs
RX or TX to IDLE, with calibration
~18739
721µs
Manual calibration
~18739
721µs
SWRS038D
Table 28: State Transition Timing
Page 45 of 92
CC1100
19.7 RX Termination Timer
CC1100 has optional functions for automatic
termination of RX after a programmable time.
The main use for this functionality is wake-onradio (WOR), but it may be useful for other
applications. The termination timer starts when
in RX state. The timeout is programmable with
the MCSM2.RX_TIME setting. When the timer
expires, the radio controller will check the
condition for staying in RX; if the condition is
not met, RX will terminate.
The programmable conditions are:
•
MCSM2.RX_TIME_QUAL=0:
Continue
receive if sync word has been found
•
MCSM2.RX_TIME_QUAL=1:
Continue
receive if sync word has been found or
preamble quality is above threshold (PQT)
If the system can expect the transmission to
have started when enabling the receiver, the
MCSM2.RX_TIME_RSSI function can be used.
The radio controller will then terminate RX if
the first valid carrier sense sample indicates
no carrier (RSSI below threshold). See Section
17.4 on page 39 for details on Carrier Sense.
20
For ASK/OOK modulation, lack of carrier
sense is only considered valid after eight
symbol
periods.
Thus,
the
MCSM2.RX_TIME_RSSI function can be used
in ASK/OOK mode when the distance between
“1” symbols is 8 or less.
If RX terminates due to no carrier sense when
the MCSM2.RX_TIME_RSSI function is used,
or if no sync word was found when using the
MCSM2.RX_TIME timeout function, the chip
will always go back to IDLE if WOR is disabled
and back to SLEEP if WOR is enabled.
Otherwise, the MCSM1.RXOFF_MODE setting
determines the state to go to when RX ends.
This means that the chip will not automatically
go back to SLEEP once a sync word has been
received. It is therefore recommended to
always wake up the microcontroller on sync
word detection when using WOR mode. This
can be done by selecting output signal 6 (see
Table 34 on page 56) on one of the
programmable GDO output pins, and
programming the microcontroller to wake up
on an edge-triggered interrupt from this GDO
pin.
Data FIFO
The CC1100 contains two 64 byte FIFOs, one
for received data and one for data to be
transmitted. The SPI interface is used to read
from the RX FIFO and write to the TX FIFO.
Section 10.5 contains details on the SPI FIFO
access. The FIFO controller will detect
overflow in the RX FIFO and underflow in the
TX FIFO.
TXBYTES.NUM_TXBYTES respectively. If a
received data byte is written to the RX FIFO at
the exact same time as the last byte in the RX
FIFO is read over the SPI interface, the RX
FIFO pointer is not properly updated and the
last read byte is duplicated. To avoid this
problem one should never empty the RX FIFO
before the last byte of the packet is received.
When writing to the TX FIFO it is the
responsibility of the MCU to avoid TX FIFO
overflow. A TX FIFO overflow will result in an
error in the TX FIFO content.
For packet lengths less than 64 bytes it is
recommended to wait until the complete
packet has been received before reading it out
of the RX FIFO.
Likewise, when reading the RX FIFO the MCU
must avoid reading the RX FIFO past its empty
value, since an RX FIFO underflow will result
in an error in the data read out of the RX FIFO.
If the packet length is larger than 64 bytes the
MCU must determine how many bytes can be
read
from
the
RX
FIFO
(RXBYTES.NUM_RXBYTES-1) and the following
software routine can be used:
The chip status byte that is available on the
SO pin while transferring the SPI header
contains the fill grade of the RX FIFO if the
access is a read operation and the fill grade of
the TX FIFO if the access is a write operation.
Section 10.1 on page 26 contains more details
on this.
The number of bytes in the RX FIFO and TX
FIFO can be read from the status registers
RXBYTES.NUM_RXBYTES
and
SWRS038D
1. Read
RXBYTES.NUM_RXBYTES
repeatedly at a rate guaranteed to be at
least twice that of which RF bytes are
received until the same value is returned
twice; store value in n.
2. If n < # of bytes remaining in packet, read
n-1 bytes from the RX FIFO.
Page 46 of 92
CC1100
3. Repeat steps 1 and 2 until n = # of bytes
remaining in packet.
FIFO_THR
Bytes in TX FIFO
Bytes in RX FIFO
0 (0000)
61
4
4. Read the remaining bytes from the RX
FIFO.
1 (0001)
57
8
2 (0010)
53
12
3 (0011)
49
16
4 (0100)
45
20
5 (0101)
41
24
6 (0110)
37
28
7 (0111)
33
32
8 (1000)
29
36
9 (1001)
25
40
10 (1010)
21
44
11 (1011)
17
48
12 (1100)
13
52
13 (1101)
9
56
14 (1110)
5
60
15 (1111)
1
64
The 4-bit FIFOTHR.FIFO_THR setting is used
to program threshold points in the FIFOs.
Table 29 lists the 16 FIFO_THR settings and
the corresponding thresholds for the RX and
TX FIFOs. The threshold value is coded in
opposite directions for the RX FIFO and TX
FIFO. This gives equal margin to the overflow
and underflow conditions when the threshold
is reached.
A signal will assert when the number of bytes
in the FIFO is equal to or higher than the
programmed threshold. This signal can be
viewed on the GDO pins (see Table 34 on
page 56).
Figure 21 shows the number of bytes in both
the RX FIFO and TX FIFO when the threshold
signal toggles, in the case of FIFO_THR=13.
Figure 20 shows the signal as the respective
FIFO is filled above the threshold, and then
drained below.
Table 29: FIFO_THR Settings and the
Corresponding FIFO Thresholds
Overflow
margin
FIFO_THR=13
NUM_RXBYTES
53 54 55 56 57 56 55 54 53
GDO
NUM_TXBYTES
6
7
8
9 10 9
8
7
6
56 bytes
GDO
Figure 20: FIFO_THR=13 vs. Number of
Bytes in FIFO (GDOx_CFG=0x00 in RX and
GDOx_CFG=0x02 in TX)
FIFO_THR=13
Underflow
margin
RXFIFO
8 bytes
TXFIFO
Figure 21: Example of FIFOs at Threshold
SWRS038D
Page 47 of 92
CC1100
21
Frequency Programming
The frequency programming in CC1100 is
designed to minimize the programming
needed in a channel-oriented system.
To set up a system with channel numbers, the
desired channel spacing is programmed with
the
MDMCFG0.CHANSPC_M
and
MDMCFG1.CHANSPC_E registers. The channel
spacing registers are mantissa and exponent
respectively.
f carrier =
(
(
The preferred IF frequency is programmed
with the FSCTRL1.FREQ_IF register. The IF
frequency is given by:
22
The desired channel number is programmed
with the 8-bit channel number register,
CHANNR.CHAN, which is multiplied by the
channel offset. The resultant carrier frequency
is given by:
f XOSC
⋅ FREQ + CHAN ⋅ (256 + CHANSPC _ M ) ⋅ 2 CHANSPC _ E − 2
216
With a 26 MHz crystal the maximum channel
spacing is 405 kHz. To get e.g. 1 MHz channel
spacing one solution is to use 333 kHz
channel spacing and select each third channel
in CHANNR.CHAN.
f IF =
The base or start frequency is set by the 24 bit
frequency word located in the FREQ2, FREQ1,
and FREQ0 registers. This word will typically
be set to the centre of the lowest channel
frequency that is to be used.
f XOSC
⋅ FREQ _ IF
210
))
Note that the SmartRF® Studio software [7]
automatically
calculates
the
optimum
FSCTRL1.FREQ_IF register setting based on
channel spacing and channel filter bandwidth.
If any frequency programming register is
altered when the frequency synthesizer is
running, the synthesizer may give an
undesired response. Hence, the frequency
programming should only be updated when
the radio is in the IDLE state.
VCO
The VCO is completely integrated on-chip.
command strobe is activated in the IDLE
mode.
22.1 VCO and PLL Self-Calibration
Note that the calibration values are maintained
in SLEEP mode, so the calibration is still valid
after waking up from SLEEP mode (unless
supply voltage or temperature has changed
significantly).
The VCO characteristics will vary with
temperature and supply voltage changes, as
well as the desired operating frequency. In
order to ensure reliable operation, CC1100
includes frequency synthesizer self-calibration
circuitry. This calibration should be done
regularly, and must be performed after turning
on power and before using a new frequency
(or channel). The number of XOSC cycles for
completing the PLL calibration is given in
Table 28 on page 45.
The calibration can be initiated automatically
or manually. The synthesizer can be
automatically calibrated each time the
synthesizer is turned on, or each time the
synthesizer is turned off automatically. This is
configured with the MCSM0.FS_AUTOCAL
register setting. In manual mode, the
calibration is initiated when the SCAL
SWRS038D
To check that the PLL is in lock the user can
program register IOCFGx.GDOx_CFG to 0x0A
and use the lock detector output available on
the GDOx pin as an interrupt for the MCU (x =
0,1, or 2). A positive transition on the GDOx
pin means that the PLL is in lock. As an
alternative the user can read register FSCAL1.
The PLL is in lock if the register content is
different from 0x3F. Refer also to the CC1100
Errata Notes [1]. For more robust operation the
source code could include a check so that the
PLL is re-calibrated until PLL lock is achieved
if the PLL does not lock the first time.
Page 48 of 92
CC1100
23
Voltage Regulators
CC1100 contains several on-chip linear voltage
regulators, which generate the supply voltage
needed by low-voltage modules. These
voltage regulators are invisible to the user, and
can be viewed as integral parts of the various
modules. The user must however make sure
that the absolute maximum ratings and
required pin voltages in Table 1 and Table 13
are not exceeded. The voltage regulator for
the digital core requires one external
decoupling capacitor.
Setting the CSn pin low turns on the voltage
regulator to the digital core and starts the
crystal oscillator. The SO pin on the SPI
interface must go low before the first positive
edge of SCLK. (setup time is given in Table
16).
If the chip is programmed to enter power-down
mode, (SPWD strobe issued), the power will be
turned off after CSn goes high. The power and
crystal oscillator will be turned on again when
CSn goes low.
The voltage regulator output should only be
used for driving the CC1100.
24
Output Power Programming
The RF output power level from the device
has two levels of programmability, as
illustrated in Figure 22. Firstly, the special
PATABLE register can hold up to eight user
selected output power settings. Secondly, the
3-bit FREND0.PA_POWER value selects the
PATABLE entry to use. This two-level
functionality provides flexible PA power ramp
up and ramp down at the start and end of
transmission, as well as ASK modulation
shaping. All the PA power settings in the
PATABLE
from index 0 up to the
FREND0.PA_POWER value are used.
The power ramping at the start and at the end
of a packet can be turned off by setting
FREND0.PA_POWER
to zero and then
program the desired output power to index 0 in
the PATABLE.
315 MHz
If OOK modulation is used, the logic 0 and
logic 1 power levels shall be programmed to
index 0 and 1 respectively.
Table 30 contains recommended PATABLE
settings for various output levels and
frequency bands. Using PA settings from 0x61
to 0x6F is not recommended. See Section
10.6 on page 28 for PATABLE programming
details.
Table 31 contains output power and current
consumption for default PATABLE setting
(0xC6). PATABLE must be programmed in
burst mode if you want to write to other entries
than PATABLE[0].
Note that all content of the PATABLE, except
for the first byte (index 0) is lost when entering
the SLEEP state.
433 MHz
868 MHz
915 MHz
Output
Power
[dBm]
Setting
Current
Consumption,
Typ. [mA]
Setting
Current
Consumption,
Typ. [mA]
Setting
Current
Consumption,
Typ. [mA]
Setting
Current
Consumption,
Typ. [mA]
-30
0x04
10.6
0x04
11.5
0x03
11.9
0x11
11.8
-20
0x17
11.1
0x17
12.1
0x0D
12.4
0x0D
12.3
-15
0x1D
11.8
0x1C
12.7
0x1C
13.0
0x1C
13.0
-10
0x26
13.0
0x26
14.0
0x34
14.5
0x26
14.3
-5
0x57
12.9
0x57
13.7
0x57
14.1
0x57
13.9
0
0x60
14.8
0x60
15.6
0x8E
16.9
0x8E
16.7
5
0x85
18.1
0x85
19.1
0x85
20.0
0x83
19.9
7
0xCB
22.1
0xC8
24.2
0xCC
25.8
0xC9
25.8
10
0xC2
27.1
0xC0
29.2
0xC3
31.1
0xC0
32.3
Table 30: Optimum PATABLE Settings for Various Output Power Levels and Frequency Bands
SWRS038D
Page 49 of 92
CC1100
315 MHz
433 MHz
868 MHz
915 MHz
Default
Power
Setting
Output
Power
[dBm]
Current
Consumption,
Typ. [mA]
Output
Power
[dBm]
Current
Consumption,
Typ. [mA]
Output
Power
[dBm]
Current
Consumption,
Typ. [mA]
Output
Power
[dBm]
0xC6
8.7
24.5
7.9
25.2
8.9
28.3
7.9
Current
Consumption,
Typ. [mA]
26.8
Table 31: Output Power and Current Consumption for Default PATABLE Setting
25
Shaping and PA Ramping
should be 7 when ASK is active. The shaping
of the ASK signal is dependent on the
configuration of the PATABLE.
With ASK modulation, up to eight power
settings are used for shaping. The modulator
contains a counter that counts up when
transmitting a one and down when transmitting
a zero. The counter counts at a rate equal to 8
times the symbol rate. The counter saturates
at FREND0.PA_POWER and 0 respectively.
This counter value is used as an index for a
lookup in the power table. Thus, in order to
utilize the whole table, FREND0.PA_POWER
Note that the ASK shaping feature is only
supported for output power levels up to -1
dBm and only values in the range 0x30–0x3F,
together with 0x00 can be used. The same is
the case when implementing PA ramping for
other modulations formats. Figure 23 shows
some
examples
of
ASK
shaping.
PATABLE(7)[7:0]
The PA uses this
setting.
PATABLE(6)[7:0]
PATABLE(5)[7:0]
PATABLE(4)[7:0]
Settings 0 to PA_POWER are
used during ramp-up at start of
transmission and ramp-down at
end of transmission, and for
ASK/OOK modulation.
PATABLE(3)[7:0]
PATABLE(2)[7:0]
PATABLE(1)[7:0]
PATABLE(0)[7:0]
Index into PATABLE(7:0)
The SmartRF® Studio software
should be used to obtain optimum
PATABLE settings for various
output powers.
e.g 6
PA_POWER[2:0]
in FREND0 register
Figure 22: PA_POWER and PATABLE
Output Power
PATABLE[7]
PATABLE[6]
PATABLE[5]
PATABLE[4]
PATABLE[3]
PATABLE[2]
PATABLE[1]
PATABLE[0]
1
0
0
1
0
1
1
0
Time
Bit Sequence
FREND0.PA_POWER = 3
FREND0.PA_POWER = 7
Figure 23: Shaping of ASK Signal
SWRS038D
Page 50 of 92
CC1100
Output Power [dBm]
PATABLE Setting
315 MHz
433 MHz
868 MHz
915 MHz
0x00
-62.0
-62.0
-57.1
-56.0
0x30
-41.7
-39.0
-33.6
-33.1
0x31
-21.8
-21.7
-21.2
-21.0
0x32
-16.2
-16.1
-16.0
-15.8
0x33
-12.8
-12.7
-12.7
-12.5
0x34
-10.5
-10.4
-10.5
-10.3
0x35
-8.6
-8.5
-8.7
-8.5
0x36
-7.2
-7.1
-7.4
-7.2
0x37
-5.9
-5.8
-6.2
-6.0
0x38
-4.8
-4.9
-5.3
-5.1
0x39
-3.9
-4.0
-4.5
-4.3
0x3A
-3.2
-3.3
-3.8
-3.7
0x3B
-2.5
-2.7
-3.3
-3.1
0x3C
-2.1
-2.3
-2.8
-2.7
0x3D
-1.7
-1.9
-2.5
-2.3
0x3E
-1.3
-1.6
-2.1
-2.0
0x3F
-1.1
-1.3
-1.9
-1.7
Table 32: PATABLE Settings used together with ASK Shaping and PA Ramping
Assume working in the 433 MHz and using
FSK. The desired output power is -10 dBm.
Figure 24 shows how the PATABLE should
look like in the two cases where no ramping is
used (A) and when PA ramping is being
implemented (B). In case A, the PATABLE
value is taken from Table 30, while in case B,
the values are taken from Table 32.
PATABLE[7] = 0x00
PATABLE[7] = 0x00
PATABLE[6] = 0x00
PATABLE[6] = 0x00
PATABLE[5] = 0x00
PATABLE[5] = 0x34
PATABLE[4] = 0x00
PATABLE[4] = 0x33
PATABLE[3] = 0x00
PATABLE[3] = 0x32
PATABLE[2] = 0x00
PATABLE[2] = 0x31
PATABLE[1] = 0x00
PATABLE[1] = 0x30
PATABLE[0] = 0x26
PATABLE[0] = 0x00
FREND0.PA_POWER = 0
FREND0.PA_POWER = 5
A: Output Power = -10 dBm,
No PA Ramping
B: Output Power = -10 dBm,
PA Ramping
Figure 24: PA Ramping
SWRS038D
Page 51 of 92
CC1100
26
Selectivity
Figure 25 to Figure 27 show the typical selectivity performance (adjacent and alternate rejection).
50.0
40.0
Selectivity [dB]
30.0
20.0
10.0
0.0
-0.5
-0.4
-0.3
-0.2
-0.1
0.0
0.1
0.2
0.4
0.5
-10.0
Frequency offset [MHz]
Figure 25: Typical Selectivity at 1.2 kBaud Data Rate, 868 MHz, 2-FSK, 5.2 kHz Deviation. IF
Frequency is 152.3 kHz and the Digital Channel Filter Bandwidth is 58 kHz
40.0
30.0
Selectivity [dB]
20.0
10.0
0.0
-0.5
-0.4
-0.3
-0.2
-0.1
0.0
0.1
0.2
0.4
0.5
-10.0
-20.0
Frequency offset [MHz]
Figure 26: Typical Selectivity at 38.4 kBaud Data Rate, 868 MHz, 2-FSK, 20 kHz Deviation. IF
Frequency is 152.3 kHz and the Digital Channel Filter Bandwidth is 100 kHz
SWRS038D
Page 52 of 92
CC1100
50.0
40.0
Selectivity [dB]
30.0
20.0
10.0
0.0
-2.3
1.5
-1.0
-0.8
0.0
0.8
1.0
1.5
2.3
-10.0
-20.0
Frequency offset [MHz]
Figure 27: Typical Selectivity at 250 kBaud Data Rate, 868 MHz, MSK, IF Frequency is 254 kHz
and the Digital Channel Filter Bandwidth is 540 kHz
27
Crystal Oscillator
A crystal in the frequency range 26-27 MHz
must be connected between the XOSC_Q1
and XOSC_Q2 pins. The oscillator is designed
for parallel mode operation of the crystal. In
addition, loading capacitors (C81 and C101)
for the crystal are required. The loading
capacitor values depend on the total load
capacitance, CL, specified for the crystal. The
total load capacitance seen between the
crystal terminals should equal CL for the
crystal to oscillate at the specified frequency.
CL =
The crystal oscillator circuit is shown in Figure
28. Typical component values for different
values of CL are given in Table 33.
The crystal oscillator is amplitude regulated.
This means that a high current is used to start
up the oscillations. When the amplitude builds
up, the current is reduced to what is necessary
to maintain approximately 0.4 Vpp signal
swing. This ensures a fast start-up, and keeps
the drive level to a minimum. The ESR of the
crystal should be within the specification in
order to ensure a reliable start-up (see Section
4.4 on page 14).
1
+ C parasitic
1
1
+
C81 C101
The initial tolerance, temperature drift, aging
and load pulling should be carefully specified
in order to meet the required frequency
accuracy in a certain application.
The parasitic capacitance is constituted by pin
input capacitance and PCB stray capacitance.
Total parasitic capacitance is typically 2.5 pF.
XOSC_Q1
XOSC_Q2
XTAL
C81
C101
Figure 28: Crystal Oscillator Circuit
Component
CL = 10 pF
CL = 13 pF
CL = 16 pF
C81
15 pF
22 pF
27 pF
C101
15 pF
22 pF
27 pF
Table 33: Crystal Oscillator Component Values
SWRS038D
Page 53 of 92
CC1100
27.1 Reference Signal
The chip can alternatively be operated with a
reference signal from 26 to 27 MHz instead of
a crystal. This input clock can either be a fullswing digital signal (0 V to VDD) or a sine
wave of maximum 1 V peak-peak amplitude.
The reference signal must be connected to the
28
XOSC_Q1 input. The sine wave must be
connected to XOSC_Q1 using a serial
capacitor. When using a full-swing digital
signal this capacitor can be omitted. The
XOSC_Q2 line must be left un-connected. C81
and C101 can be omitted when using a
reference signal.
External RF Match
The balanced RF input and output of CC1100
share two common pins and are designed for
a simple, low-cost matching and balun network
on the printed circuit board. The receive- and
transmit switching at the CC1100 front-end is
controlled by a dedicated on-chip function,
eliminating the need for an external RX/TXswitch.
The
passive
matching/filtering
network
connected to CC1100 should have the following
differential impedance as seen from the RFport (RF_P and RF_N) towards the antenna:
A few passive external components combined
with the internal RX/TX switch/termination
circuitry ensures match in both RX and TX
mode.
To ensure optimal matching of the CC1100
differential output it is recommended to follow
the CC1100EM reference design ([5] or [6]) as
closely as possible. Gerber files for the
reference designs are available for download
from the TI website.
Although CC1100 has a balanced RF
input/output, the chip can be connected to a
single-ended antenna with few external low
cost capacitors and inductors.
29
Zout 315 MHz = 122 + j31 Ω
Zout 433 MHz = 116 + j41 Ω
Zout 868/915 MHz = 86.5 + j43 Ω
PCB Layout Recommendations
The top layer should be used for signal
routing, and the open areas should be filled
with metallization connected to ground using
several vias.
best routing is from the power line (or power
plane) to the decoupling capacitor and then to
the CC1100 supply pin. Supply power filtering is
very important.
The area under the chip is used for grounding
and shall be connected to the bottom ground
plane with several vias. In the CC1100EM
reference designs ([5] and [6]) we have placed
5 vias inside the exposed die attached pad.
These vias should be “tented” (covered with
solder mask) on the component side of the
PCB to avoid migration of solder through the
vias during the solder reflow process.
Each decoupling capacitor ground pad should
be connected to the ground plane using a
separate via. Direct connections between
neighboring power pins will increase noise
coupling and should be avoided unless
absolutely necessary.
The solder paste coverage should not be
100%. If it is, out gassing may occur during the
reflow process, which may cause defects
(splattering, solder balling). Using “tented” vias
reduces the solder paste coverage below
100%.
See Figure 29 for top solder resist and top
paste masks.
Each decoupling capacitor should be placed
as close as possible to the supply pin it is
supposed to decouple. Each decoupling
capacitor should be connected to the power
line (or power plane) by separate vias. The
SWRS038D
The external components should ideally be as
small as possible (0402 is recommended) and
surface
mount
devices
are
highly
recommended. Please note that components
smaller than those specified may have
differing characteristics.
Precaution should be used when placing the
microcontroller in order to avoid noise
interfering with the RF circuitry.
A CC1100/1150DK Development Kit with a
fully assembled CC1100EM Evaluation
Module is available. It is strongly advised that
this reference layout is followed very closely in
order to get the best performance. The
schematic, BOM and layout Gerber files are all
available from the TI website ([5] and [6]).
Page 54 of 92
CC1100
Figure 29: Left: Top Solder Resist Mask (Negative). Right: Top Paste Mask. Circles are Vias
30
General Purpose / Test Output Control Pins
The three digital output pins GDO0, GDO1,
and GDO2 are general control pins configured
with
IOCFG0.GDO0_CFG,
IOCFG1.GDO1_CFG, and IOCFG2.GDO3_CFG
respectively. Table 34 shows the different
signals that can be monitored on the GDO
pins. These signals can be used as inputs to
the MCU. GDO1 is the same pin as the SO pin
on the SPI interface, thus the output
programmed on this pin will only be valid when
CSn is high. The default value for GDO1 is 3stated, which is useful when the SPI interface
is shared with other devices.
The default value for GDO0 is a 135-141 kHz
clock output (XOSC frequency divided by
192). Since the XOSC is turned on at poweron-reset, this can be used to clock the MCU in
systems with only one crystal. When the MCU
is up and running, it can change the clock
frequency by writing to IOCFG0.GDO0_CFG.
IOCFG0 register. The voltage on the GDO0
pin is then proportional to temperature. See
Section 4.7 on page 16 for temperature sensor
specifications.
If the IOCFGx.GDOx_CFG setting is less than
0x20 and IOCFGx_GDOx_INV is 0 (1), the
GDO0 and GDO2 pins will be hardwired to 0
(1) and the GDO1 pin will be hardwired to 1
(0) in the SLEEP state. These signals will be
hardwired until the CHIP_RDYn signal goes
low.
If the IOCFGx.GDOx_CFG setting is 0x20 or
higher the GDO pins will work as programmed
also in SLEEP state. As an example, GDO1 is
high
impedance
in
all
states
if
IOCFG1.GDO1_CFG=0x2E.
An on-chip analog temperature sensor is
enabled by writing the value 128 (0x80) to the
SWRS038D
Page 55 of 92
CC1100
GDOx_CFG[5:0]
0 (0x00)
1 (0x01)
2 (0x02)
3 (0x03)
4 (0x04)
5 (0x05)
6 (0x06)
7 (0x07)
8 (0x08)
9 (0x09)
10 (0x0A)
11 (0x0B)
12 (0x0C)
13 (0x0D)
14 (0x0E)
15 (0x0F)
16 (0x10)
17 (0x11)
18 (0x12)
19 (0x13)
20 (0x14)
21 (0x15)
22 (0x16)
23 (0x17)
24 (0x18)
25 (0x19)
26 (0x1A)
27 (0x1B)
28 (0x1C)
29 (0x1D)
30 (0x1E)
31 (0x1F)
32 (0x20)
33 (0x21)
34 (0x22)
35 (0x23)
36 (0x24)
37 (0x25)
38 (0x26)
39 (0x27)
40 (0x28)
41 (0x29)
42 (0x2A)
43 (0x2B)
44 (0x2C)
45 (0x2D)
46 (0x2E)
47 (0x2F)
48 (0x30)
49 (0x31)
50 (0x32)
51 (0x33)
52 (0x34)
53 (0x35)
54 (0x36)
55 (0x37)
56 (0x38)
57 (0x39)
58 (0x3A)
59 (0x3B)
60 (0x3C)
61 (0x3D)
62 (0x3E)
63 (0x3F)
Description
Associated to the RX FIFO: Asserts when RX FIFO is filled at or above the RX FIFO threshold. De-asserts when RX FIFO
is drained below the same threshold.
Associated to the RX FIFO: Asserts when RX FIFO is filled at or above the RX FIFO threshold or the end of packet is
reached. De-asserts when the RX FIFO is empty.
Associated to the TX FIFO: Asserts when the TX FIFO is filled at or above the TX FIFO threshold. De-asserts when the TX
FIFO is below the same threshold.
Associated to the TX FIFO: Asserts when TX FIFO is full. De-asserts when the TX FIFO is drained below theTX FIFO
threshold.
Asserts when the RX FIFO has overflowed. De-asserts when the FIFO has been flushed.
Asserts when the TX FIFO has underflowed. De-asserts when the FIFO is flushed.
Asserts when sync word has been sent / received, and de-asserts at the end of the packet. In RX, the pin will de-assert
when the optional address check fails or the RX FIFO overflows. In TX the pin will de-assert if the TX FIFO underflows.
Asserts when a packet has been received with CRC OK. De-asserts when the first byte is read from the RX FIFO.
Preamble Quality Reached. Asserts when the PQI is above the programmed PQT value.
Clear channel assessment. High when RSSI level is below threshold (dependent on the current CCA_MODE setting)
Lock detector output. The PLL is in lock if the lock detector output has a positive transition or is constantly logic high. To
check for PLL lock the lock detector output should be used as an interrupt for the MCU.
Serial Clock. Synchronous to the data in synchronous serial mode.
In RX mode, data is set up on the falling edge by CC1100 when GDOx_INV=0.
In TX mode, data is sampled by CC1100 on the rising edge of the serial clock when GDOx_INV=0.
Serial Synchronous Data Output. Used for synchronous serial mode.
Serial Data Output. Used for asynchronous serial mode.
Carrier sense. High if RSSI level is above threshold.
CRC_OK. The last CRC comparison matched. Cleared when entering/restarting RX mode.
Reserved – used for test.
Reserved – used for test.
Reserved – used for test.
Reserved – used for test.
Reserved – used for test.
Reserved – used for test.
RX_HARD_DATA[1]. Can be used together with RX_SYMBOL_TICK for alternative serial RX output.
RX_HARD_DATA[0]. Can be used together with RX_SYMBOL_TICK for alternative serial RX output.
Reserved – used for test.
Reserved – used for test.
Reserved – used for test.
PA_PD. Note: PA_PD will have the same signal level in SLEEP and TX states. To control an external PA or RX/TX switch
in applications where the SLEEP state is used it is recommended to use GDOx_CFGx=0x2F instead.
LNA_PD. Note: LNA_PD will have the same signal level in SLEEP and RX states. To control an external LNA or RX/TX
switch in applications where the SLEEP state is used it is recommended to use GDOx_CFGx=0x2F instead.
RX_SYMBOL_TICK. Can be used together with RX_HARD_DATA for alternative serial RX output.
Reserved – used for test.
Reserved – used for test.
Reserved – used for test.
Reserved – used for test.
Reserved – used for test.
Reserved – used for test.
WOR_EVNT0
WOR_EVNT1
Reserved – used for test.
CLK_32k
Reserved – used for test.
CHIP_RDYn
Reserved – used for test.
XOSC_STABLE
Reserved – used for test.
GDO0_Z_EN_N. When this output is 0, GDO0 is configured as input (for serial TX data).
High impedance (3-state)
HW to 0 (HW1 achieved by setting GDOx_INV=1). Can be used to control an external LNA/PA or RX/TX switch.
CLK_XOSC/1
CLK_XOSC/1.5
CLK_XOSC/2
CLK_XOSC/3
CLK_XOSC/4
Note: There are 3 GDO pins, but only one CLK_XOSC/n can be selected as an output at any
CLK_XOSC/6
time. If CLK_XOSC/n is to be monitored on one of the GDO pins, the other two GDO pins must
CLK_XOSC/8
be configured to values less than 0x30. The GDO0 default value is CLK_XOSC/192.
CLK_XOSC/12
CLK_XOSC/16
To optimize rf performance, these signal should not be used while the radio is in RX or TX mode.
CLK_XOSC/24
CLK_XOSC/32
CLK_XOSC/48
CLK_XOSC/64
CLK_XOSC/96
CLK_XOSC/128
CLK_XOSC/192
Table 34: GDOx Signal Selection (x = 0, 1, or 2)
SWRS038D
Page 56 of 92
CC1100
31
Asynchronous and Synchronous Serial Operation
Several features and modes of operation have
been included in the CC1100 to provide
backward compatibility with previous Chipcon
products and other existing RF communication
systems. For new systems, it is recommended
to use the built-in packet handling features, as
they can give more robust communication,
significantly offload the microcontroller, and
simplify software development.
31.1 Asynchronous Operation
For backward compatibility with systems
already using the asynchronous data transfer
from other Chipcon products, asynchronous
transfer is also included in CC1100. When
asynchronous transfer is enabled, several of
the support mechanisms for the MCU that are
included in CC1100 will be disabled, such as
packet handling hardware, buffering in the
FIFO, and so on. The asynchronous transfer
mode does not allow the use of the data
whitener, interleaver, and FEC, and it is not
possible to use Manchester encoding.
Note that MSK is
asynchronous transfer.
not
supported
Setting
PKTCTRL0.PKT_FORMAT
enables asynchronous serial mode.
to
for
3
In TX, the GDO0 pin is used for data input (TX
data). Data output can be on GDO0, GDO1, or
GDO2. This is set by the IOCFG0.GDO0_CFG,
IOCFG1.GDO1_CFG and IOCFG2.GDO2_CFG
fields.
31.2 Synchronous Serial Operation
Setting
PKTCTRL0.PKT_FORMAT
to
1
enables synchronous serial mode. In the
synchronous serial mode, data is transferred
on a two wire serial interface. The CC1100
provides a clock that is used to set up new
data on the data input line or sample data on
the data output line. Data input (TX data) is the
GDO0 pin. This pin will automatically be
configured as an input when TX is active. The
data output pin can be any of the GDO pins;
this is set by the IOCFG0.GDO0_CFG,
IOCFG1.GDO1_CFG, and IOCFG2.GDO2_CFG
fields.
Preamble and sync word insertion/detection
may or may not be active, dependent on the
sync mode set by the MDMCFG2.SYNC_MODE.
If preamble and sync word is disabled, all
other packet handler features and FEC should
also be disabled. The MCU must then handle
preamble and sync word insertion and
detection in software. If preamble and sync
word insertion/detection is left on, all packet
handling features and FEC can be used. One
exception is that the address filtering feature is
unavailable in synchronous serial mode.
When using the packet handling features in
synchronous serial mode, the CC1100 will insert
and detect the preamble and sync word and
the MCU will only provide/get the data
payload.
This
is
equivalent
to
the
recommended FIFO operation mode.
The CC1100 modulator samples the level of the
asynchronous input 8 times faster than the
programmed data rate. The timing requirement
for the asynchronous stream is that the error in
the bit period must be less than one eighth of
the programmed data rate.
32
System Considerations and Guidelines
32.1 SRD Regulations
International regulations and national laws
regulate the use of radio receivers and
transmitters. Short Range Devices (SRDs) for
license free operation below 1 GHz are usually
operated in the 433 MHz, 868 MHz or 915
MHz frequency bands. The CC1100 is
specifically designed for such use with its 300 348 MHz, 400 - 464 MHz, and 800 - 928 MHz
operating ranges. The most important
regulations when using the CC1100 in the 433
SWRS038D
MHz, 868 MHz, or 915 MHz frequency bands
are EN 300 220 (Europe) and FCC CFR47
part 15 (USA). A summary of the most
important aspects of these regulations can be
found in Application Note AN001 [2].
Please note that compliance with regulations is
dependent on complete system performance.
It is the customer’s responsibility to ensure that
the system complies with regulations.
Page 57 of 92
CC1100
32.2 Frequency Hopping
Channel Systems
and
Multi-
The 433 MHz, 868 MHz, or 915 MHz bands
are shared by many systems both in industrial,
office, and home environments. It is therefore
recommended to use frequency hopping
spread spectrum (FHSS) or a multi-channel
protocol because the frequency diversity
makes the system more robust with respect to
interference from other systems operating in
the same frequency band. FHSS also combats
multipath fading.
CC1100 is highly suited for FHSS or multichannel systems due to its agile frequency
synthesizer and effective communication
interface. Using the packet handling support
and data buffering is also beneficial in such
systems as these features will significantly
offload the host controller.
time is reduced from approximately 720 µs to
approximately 150 µs. The blanking interval
between each frequency hop is then
approximately 240 us.
There is a trade off between blanking time and
memory space needed for storing calibration
data in non-volatile memory. Solution 2) above
gives the shortest blanking interval, but
requires more memory space to store
calibration
values.
Solution
3)
gives
approximately 570 µs smaller blanking interval
than solution 1).
Note that the recommended settings for
TEST0.VCO_SEL_CAL_EN will change with
frequency. This means that one should always
use SmartRF® Studio [7] to get the correct
settings for a specific frequency before doing a
calibration, regardless of which calibration
method is being used.
Charge pump current, VCO current, and VCO
capacitance array calibration data is required
for each frequency when implementing
frequency hopping for CC1100. There are 3
ways of obtaining the calibration data from the
chip:
It must be noted that the TESTn registers (n =
0, 1, or 2) content is not retained in SLEEP
state, and thus it is necessary to re-write these
registers when returning from the SLEEP
state.
1) Frequency hopping with calibration for each
hop. The PLL calibration time is approximately
720 µs. The blanking interval between each
frequency hop is then approximately 810 us.
32.3 Wideband Modulation
Spread Spectrum
2) Fast frequency hopping without calibration
for each hop can be done by calibrating each
frequency at startup and saving the resulting
FSCAL3, FSCAL2, and FSCAL1 register values
in MCU memory. Between each frequency
hop, the calibration process can then be
replaced by writing the FSCAL3, FSCAL2and
FSCAL1 register values corresponding to the
next RF frequency. The PLL turn on time is
approximately 90 µs. The blanking interval
between each frequency hop is then
approximately 90 us. The VCO current
calibration result available in FSCAL2 is not
dependent on the RF frequency. Neither is the
charge pump current calibration result
available in FSCAL3. The same value can
therefore be used for all frequencies.
3) Run calibration on a single frequency at
startup. Next write 0 to FSCAL3[5:4] to
disable the charge pump calibration. After
writing to FSCAL3[5:4] strobe SRX (or STX)
with MCSM0.FS_AUTOCAL=1 for each new
frequency hop. That is, VCO current and VCO
capacitance calibration is done but not charge
pump current calibration. When charge pump
current calibration is disabled the calibration
SWRS038D
not
Using
Digital modulation systems under FFC part
15.247 includes 2-FSK and GFSK modulation.
A maximum peak output power of 1W (+30
dBm) is allowed if the 6 dB bandwidth of the
modulated signal exceeds 500 kHz. In
addition, the peak power spectral density
conducted to the antenna shall not be greater
than +8 dBm in any 3 kHz band.
Operating at high data rates and frequency
separation, the CC1100 is suited for systems
targeting compliance with digital modulation
system as defined by FFC part 15.247. An
external power amplifier is needed to increase
the output above +10 dBm.
32.4 Data Burst Transmissions
The high maximum data rate of CC1100 opens
up for burst transmissions. A low average data
rate link (e.g. 10 kBaud), can be realized using
a higher over-the-air data rate. Buffering the
data and transmitting in bursts at high data
rate (e.g. 500 kBaud) will reduce the time in
active mode, and hence also reduce the
average current consumption significantly.
Reducing the time in active mode will reduce
the likelihood of collisions with other systems
in the same frequency range.
Page 58 of 92
CC1100
32.5 Continuous Transmissions
32.8 Low Cost Systems
In data streaming applications the CC1100
opens up for continuous transmissions at 500
kBaud effective data rate. As the modulation is
done with a closed loop PLL, there is no
limitation in the length of a transmission (open
loop modulation used in some transceivers
often prevents this kind of continuous data
streaming and reduces the effective data rate).
As the CC1100 provides 500 kBaud multichannel performance without any external
filters, a very low cost system can be made.
A differential antenna will eliminate the need
for a balun, and the DC biasing can be
achieved in the antenna topology, see Figure 3
and Figure 4.
A HC-49 type SMD crystal is used in the
CC1100EM reference designs ([5] and [6]).
Note that the crystal package strongly
influences the price. In a size constrained PCB
design a smaller, but more expensive, crystal
may be used.
32.6 Crystal Drift Compensation
The CC1100 has a very fine frequency
resolution (see Table 9). This feature can be
used to compensate for frequency offset and
drift.
The frequency offset between an ‘external’
transmitter and the receiver is measured in the
CC1100 and can be read back from the
FREQEST status register as described in
Section 14.1. The measured frequency offset
can be used to calibrate the frequency using
the ‘external’ transmitter as the reference. That
is, the received signal of the device will match
the receiver’s channel filter better. In the same
way the centre frequency of the transmitted
signal will match the ‘external’ transmitter’s
signal.
32.9 Battery Operated Systems
In low power applications, the SLEEP state
with the crystal oscillator core switched off
should be used when the CC1100 is not active.
It is possible to leave the crystal oscillator core
running in the SLEEP state if start-up time is
critical.
The WOR functionality should be used in low
power applications.
32.10 Increasing Output Power
In some applications it may be necessary to
extend the link range. Adding an external
power amplifier is the most effective way of
doing this.
32.7 Spectrum Efficient Modulation
CC1100 also has the possibility to use Gaussian
shaped 2-FSK (GFSK). This spectrum-shaping
feature improves adjacent channel power
(ACP) and occupied bandwidth. In ‘true’ 2-FSK
systems with abrupt frequency shifting, the
spectrum is inherently broad. By making the
frequency shift ‘softer’, the spectrum can be
made significantly narrower. Thus, higher data
rates can be transmitted in the same
bandwidth using GFSK.
The power amplifier should be inserted
between the antenna and the balun, and two
T/R switches are needed to disconnect the PA
in RX mode. See Figure 30.
Antenna
Filter
P
A
Balun
T/R
switch
CC1100
T/R
switch
Figure 30: Block Diagram of CC1100 Usage with External Power Amplifier
SWRS038D
Page 59 of 92
CC1100
33
Configuration Registers
The configuration of CC1100 is done by
programming 8-bit registers. The optimum
configuration data based on selected system
parameters are most easily found by using the
SmartRF® Studio software [7]. Complete
descriptions of the registers are given in the
following tables. After chip reset, all the
registers have default values as shown in the
tables. The optimum register setting might
differ from the default value. After a reset all
registers that shall be different from the default
value therefore needs to be programmed
through the SPI interface.
There are 13 command strobe registers, listed
in Table 35. Accessing these registers will
initiate the change of an internal state or
mode. There are 47 normal 8-bit configuration
registers, listed in Table 36. Many of these
registers are for test purposes only, and need
not be written for normal operation of CC1100.
Address
There are also 12 Status registers, which are
listed in Table 37. These registers, which are
read-only, contain information about the status
of CC1100.
The two FIFOs are accessed through one 8-bit
register. Write operations write to the TX FIFO,
while read operations read from the RX FIFO.
During the header byte transfer and while
writing data to a register or the TX FIFO, a
status byte is returned on the SO line. This
status byte is described in Table 17 on page
26.
Table 38 summarizes the SPI address space.
The address to use is given by adding the
base address to the left and the burst and
read/write bits on the top. Note that the burst
bit has different meaning for base addresses
above and below 0x2F.
Strobe
Name
Description
0x30
SRES
Reset chip.
0x31
SFSTXON
0x32
SXOFF
0x33
SCAL
Calibrate frequency synthesizer and turn it off. SCAL can be strobed from IDLE mode without
setting manual calibration mode (MCSM0.FS_AUTOCAL=0)
0x34
SRX
Enable RX. Perform calibration first if coming from IDLE and MCSM0.FS_AUTOCAL=1.
0x35
STX
In IDLE state: Enable TX. Perform calibration first if MCSM0.FS_AUTOCAL=1.
If in RX state and CCA is enabled: Only go to TX if channel is clear.
0x36
SIDLE
Exit RX / TX, turn off frequency synthesizer and exit Wake-On-Radio mode if applicable.
0x38
SWOR
Start automatic RX polling sequence (Wake-on-Radio) as described in Section 19.5 if
WORCTRL.RC_PD=0.
0x39
SPWD
Enter power down mode when CSn goes high.
0x3A
SFRX
Flush the RX FIFO buffer. Only issue SFRX in IDLE or, RXFIFO_OVERFLOW states.
0x3B
SFTX
Flush the TX FIFO buffer. Only issue SFTX in IDLE or TXFIFO_UNDERFLOW states.
0x3C
SWORRST
0x3D
SNOP
Enable and calibrate frequency synthesizer (if MCSM0.FS_AUTOCAL=1). If in RX (with CCA):
Go to a wait state where only the synthesizer is running (for quick RX / TX turnaround).
Turn off crystal oscillator.
Reset real time clock to Event1 value.
No operation. May be used to get access to the chip status byte.
Table 35: Command Strobes
SWRS038D
Page 60 of 92
CC1100
Preserved in
SLEEP State
Details on
Page Number
Yes
64
Yes
64
Yes
64
Address
Register
Description
0x00
IOCFG2
0x01
IOCFG1
0x02
IOCFG0
GDO2 output pin configuration
GDO1 output pin configuration
GDO0 output pin configuration
0x03
FIFOTHR
RX FIFO and TX FIFO thresholds
Yes
65
0x04
SYNC1
Sync word, high byte
Yes
65
0x05
SYNC0
Sync word, low byte
Yes
65
0x06
PKTLEN
Packet length
Yes
65
0x07
PKTCTRL1
Packet automation control
Yes
66
0x08
PKTCTRL0
Packet automation control
Yes
67
0x09
ADDR
Device address
Yes
67
0x0A
CHANNR
Channel number
Yes
67
68
0x0B
FSCTRL1
Frequency synthesizer control
Yes
0x0C
FSCTRL0
Frequency synthesizer control
Yes
68
0x0D
FREQ2
Frequency control word, high byte
Yes
68
0x0E
FREQ1
Frequency control word, middle byte
Yes
68
0x0F
FREQ0
Frequency control word, low byte
Yes
68
0x10
MDMCFG4
Modem configuration
Yes
69
0x11
MDMCFG3
Modem configuration
Yes
69
0x12
MDMCFG2
Modem configuration
Yes
70
0x13
MDMCFG1
Modem configuration
Yes
71
0x14
MDMCFG0
0x15
DEVIATN
0x16
0x17
Modem configuration
Yes
71
Modem deviation setting
Yes
72
MCSM2
Main Radio Control State Machine configuration
Yes
73
MCSM1
Main Radio Control State Machine configuration
Yes
74
0x18
MCSM0
Main Radio Control State Machine configuration
Yes
75
0x19
FOCCFG
Frequency Offset Compensation configuration
Yes
76
0x1A
BSCFG
Bit Synchronization configuration
Yes
77
0x1B
AGCTRL2
AGC control
Yes
78
0x1C
AGCTRL1
AGC control
Yes
79
0x1D
AGCTRL0
AGC control
Yes
80
0x1E
WOREVT1
High byte Event 0 timeout
Yes
80
0x1F
WOREVT0
Low byte Event 0 timeout
Yes
81
0x20
WORCTRL
0x21
FREND1
0x22
FREND0
Front end TX configuration
Yes
82
0x23
FSCAL3
Frequency synthesizer calibration
Yes
82
0x24
FSCAL2
Frequency synthesizer calibration
Yes
83
0x25
FSCAL1
Frequency synthesizer calibration
Yes
83
0x26
FSCAL0
Frequency synthesizer calibration
Yes
83
0x27
RCCTRL1
RC oscillator configuration
Yes
83
0x28
RCCTRL0
RC oscillator configuration
Yes
83
0x29
FSTEST
Frequency synthesizer calibration control
No
84
0x2A
PTEST
Production test
No
84
0x2B
AGCTEST
0x2C
TEST2
Wake On Radio control
Yes
81
Front end RX configuration
Yes
82
AGC test
No
84
Various test settings
No
84
0x2D
TEST1
Various test settings
No
84
0x2E
TEST0
Various test settings
No
84
Table 36: Configuration Registers Overview
SWRS038D
Page 61 of 92
CC1100
Address
Register
Description
Details on page number
0x30 (0xF0)
PARTNUM
Part number for CC1100
85
0x31 (0xF1)
VERSION
Current version number
85
0x32 (0xF2)
FREQEST
Frequency Offset Estimate
85
0x33 (0xF3)
LQI
Demodulator estimate for Link Quality
85
0x34 (0xF4)
RSSI
Received signal strength indication
85
0x35 (0xF5)
MARCSTATE
Control state machine state
86
0x36 (0xF6)
WORTIME1
High byte of WOR timer
86
0x37 (0xF7)
WORTIME0
Low byte of WOR timer
86
0x38 (0xF8)
PKTSTATUS
Current GDOx status and packet status
87
VCO_VC_DAC
Current setting from PLL calibration
module
87
0x39 (0xF9)
TXBYTES
Underflow and number of bytes in the TX
FIFO
87
0x3A (0xFA)
RXBYTES
Overflow and number of bytes in the RX
FIFO
87
0x3B (0xFB)
0x3C (0xFC)
RCCTRL1_STATUS
Last RC oscillator calibration result
87
0x3D (0xFD)
RCCTRL0_STATUS
Last RC oscillator calibration result
88
Table 37: Status Registers Overview
SWRS038D
Page 62 of 92
CC1100
Single Byte
+0x80
IOCFG2
IOCFG1
IOCFG0
FIFOTHR
SYNC1
SYNC0
PKTLEN
PKTCTRL1
PKTCTRL0
ADDR
CHANNR
FSCTRL1
FSCTRL0
FREQ2
FREQ1
FREQ0
MDMCFG4
MDMCFG3
MDMCFG2
MDMCFG1
MDMCFG0
DEVIATN
MCSM2
MCSM1
MCSM0
FOCCFG
BSCFG
AGCCTRL2
AGCCTRL1
AGCCTRL0
WOREVT1
WOREVT0
WORCTRL
FREND1
FREND0
FSCAL3
FSCAL2
FSCAL1
FSCAL0
RCCTRL1
RCCTRL0
FSTEST
PTEST
AGCTEST
TEST2
TEST1
TEST0
SRES
SFSTXON
SXOFF
SCAL
SRX
STX
SIDLE
SRES
SFSTXON
SXOFF
SCAL
SRX
STX
SIDLE
SWOR
SPWD
SFRX
SFTX
SWORRST
SNOP
PATABLE
TX FIFO
SWOR
SPWD
SFRX
SFTX
SWORRST
SNOP
PATABLE
RX FIFO
PATABLE
TX FIFO
Burst
+0xC0
R/W configuration registers, burst access possible
0x00
0x01
0x02
0x03
0x04
0x05
0x06
0x07
0x08
0x09
0x0A
0x0B
0x0C
0x0D
0x0E
0x0F
0x10
0x11
0x12
0x13
0x14
0x15
0x16
0x17
0x18
0x19
0x1A
0x1B
0x1C
0x1D
0x1E
0x1F
0x20
0x21
0x22
0x23
0x24
0x25
0x26
0x27
0x28
0x29
0x2A
0x2B
0x2C
0x2D
0x2E
0x2F
0x30
0x31
0x32
0x33
0x34
0x35
0x36
0x37
0x38
0x39
0x3A
0x3B
0x3C
0x3D
0x3E
0x3F
Read
Burst
+0x40
PARTNUM
VERSION
FREQEST
LQI
RSSI
MARCSTATE
WORTIME1
WORTIME0
PKTSTATUS
VCO_VC_DAC
TXBYTES
RXBYTES
RCCTRL1_STATUS
RCCTRL0_STATUS
PATABLE
RX FIFO
Command Strobes, Status registers
(read only) and multi byte registers
Write
Single Byte
+0x00
Table 38: SPI Address Space
SWRS038D
Page 63 of 92
CC1100
33.1 Configuration Register Details – Registers with preserved values in SLEEP state
0x00: IOCFG2 – GDO2 Output Pin Configuration
Bit
Field Name
Reset
R/W
Description
7
Reserved
6
GDO2_INV
0
R/W
Invert output, i.e. select active low (1) / high (0)
5:0
GDO2_CFG[5:0]
41 (0x29)
R/W
Default is CHP_RDYn (See Table 34 on page 56).
R0
0x01: IOCFG1 – GDO1 Output Pin Configuration
Bit
Field Name
7
Reset
R/W
Description
GDO_DS
0
R/W
Set high (1) or low (0) output drive strength on the GDO pins.
6
GDO1_INV
0
R/W
Invert output, i.e. select active low (1) / high (0)
5:0
GDO1_CFG[5:0]
46 (0x2E)
R/W
Default is 3-state (See Table 34 on page 56).
0x02: IOCFG0 – GDO0 Output Pin Configuration
Bit
Field Name
Reset
R/W
Description
7
TEMP_SENSOR_ENABLE
0
R/W
Enable analog temperature sensor. Write 0 in all other register
bits when using temperature sensor.
6
GDO0_INV
0
R/W
Invert output, i.e. select active low (1) / high (0)
5:0
GDO0_CFG[5:0]
63 (0x3F)
R/W
Default is CLK_XOSC/192 (See Table 34 on page 56).
It is recommended to disable the clock output in initialization,
in order to optimize RF performance.
SWRS038D
Page 64 of 92
CC1100
0x03: FIFOTHR – RX FIFO and TX FIFO Thresholds
Bit
Field Name
Reset
R/W
Description
7:4
Reserved
0
R/W
Write 0 for compatibility with possible future extensions
3:0
FIFO_THR[3:0]
7 (0111)
R/W
Set the threshold for the TX FIFO and RX FIFO. The threshold is
exceeded when the number of bytes in the FIFO is equal to or higher
than the threshold value.
Setting
Bytes in TX FIFO
Bytes in RX FIFO
0 (0000)
61
4
1 (0001)
57
8
2 (0010)
53
12
3 (0011)
49
16
4 (0100)
45
20
5 (0101)
41
24
6 (0110)
37
28
7 (0111)
33
32
8 (1000)
29
36
9 (1001)
25
40
10 (1010)
21
44
11 (1011)
17
48
12 (1100)
13
52
13 (1101)
9
56
14 (1110)
5
60
15 (1111)
1
64
0x04: SYNC1 – Sync Word, High Byte
Bit
Field Name
Reset
R/W
Description
7:0
SYNC[15:8]
211 (0xD3)
R/W
8 MSB of 16-bit sync word
0x05: SYNC0 – Sync Word, Low Byte
Bit
Field Name
Reset
R/W
Description
7:0
SYNC[7:0]
145 (0x91)
R/W
8 LSB of 16-bit sync word
0x06: PKTLEN – Packet Length
Bit
Field Name
Reset
R/W
Description
7:0
PACKET_LENGTH
255 (0xFF)
R/W
Indicates the packet length when fixed packet length mode is enabled.
If variable packet length mode is used, this value indicates the
maximum packet length allowed.
SWRS038D
Page 65 of 92
CC1100
0x07: PKTCTRL1 – Packet Automation Control
Bit
Field Name
Reset
R/W
Description
7:5
PQT[2:0]
0 (0x00)
R/W
Preamble quality estimator threshold. The preamble quality estimator
increases an internal counter by one each time a bit is received that is
different from the previous bit, and decreases the counter by 8 each time
a bit is received that is the same as the last bit.
A threshold of 4·PQT for this counter is used to gate sync word detection.
When PQT=0 a sync word is always accepted.
4
Reserved
0
R0
3
CRC_AUTOFLUSH
0
R/W
Enable automatic flush of RX FIFO when CRC in not OK. This requires
that only one packet is in the RXIFIFO and that packet length is limited to
the RX FIFO size.
2
APPEND_STATUS
1
R/W
When enabled, two status bytes will be appended to the payload of the
packet. The status bytes contain RSSI and LQI values, as well as CRC
OK.
1:0
ADR_CHK[1:0]
0 (00)
R/W
Controls address check configuration of received packages.
Setting
Address check configuration
0 (00)
No address check
1 (01)
Address check, no broadcast
2 (10)
Address check and 0 (0x00) broadcast
3 (11)
Address check and 0 (0x00) and 255 (0xFF)
broadcast
SWRS038D
Page 66 of 92
CC1100
0x08: PKTCTRL0 – Packet Automation Control
Bit
Field Name
7
Reserved
6
WHITE_DATA
Reset
R/W
Description
R0
1
R/W
Turn data whitening on / off
0: Whitening off
1: Whitening on
5:4
PKT_FORMAT[1:0]
0 (00)
R/W
3
Reserved
0
R0
2
CRC_EN
1
R/W
1:0
LENGTH_CONFIG[1:0]
1 (01)
R/W
Format of RX and TX data
Setting
Packet format
0 (00)
Normal mode, use FIFOs for RX and TX
1 (01)
Synchronous serial mode, used for backwards
compatibility. Data in on GDO0
2 (10)
Random TX mode; sends random data using PN9
generator. Used for test.
Works as normal mode, setting 0 (00), in RX.
3 (11)
Asynchronous serial mode. Data in on GDO0 and
Data out on either of the GDO0 pins
1: CRC calculation in TX and CRC check in RX enabled
0: CRC disabled for TX and RX
Configure the packet length
Setting
Packet length configuration
0 (00)
Fixed packet length mode. Length configured in
PKTLEN register
1 (01)
Variable packet length mode. Packet length
configured by the first byte after sync word
2 (10)
Infinite packet length mode
3 (11)
Reserved
0x09: ADDR – Device Address
Bit
Field Name
Reset
R/W
Description
7:0
DEVICE_ADDR[7:0]
0 (0x00)
R/W
Address used for packet filtration. Optional broadcast addresses are 0
(0x00) and 255 (0xFF).
0x0A: CHANNR – Channel Number
Bit
Field Name
Reset
R/W
Description
7:0
CHAN[7:0]
0 (0x00)
R/W
The 8-bit unsigned channel number, which is multiplied by the
channel spacing setting and added to the base frequency.
SWRS038D
Page 67 of 92
CC1100
0x0B: FSCTRL1 – Frequency Synthesizer Control
Bit
Field Name
7:5
Reserved
4:0
FREQ_IF[4:0]
Reset
R/W
Description
R0
15 (0x0F)
R/W
The desired IF frequency to employ in RX. Subtracted from FS base
frequency in RX and controls the digital complex mixer in the demodulator.
f IF =
f XOSC
⋅ FREQ _ IF
210
The default value gives an IF frequency of 381kHz, assuming a 26.0 MHz
crystal.
0x0C: FSCTRL0 – Frequency Synthesizer Control
Bit
Field Name
Reset
R/W
Description
7:0
FREQOFF[7:0]
0 (0x00)
R/W
Frequency offset added to the base frequency before being used by the
frequency synthesizer. (2s-complement).
14
Resolution is FXTAL/2 (1.59kHz-1.65kHz); range is ±202 kHz to ±210 kHz,
dependent of XTAL frequency.
0x0D: FREQ2 – Frequency Control Word, High Byte
Bit
Field Name
Reset
R/W
Description
7:6
FREQ[23:22]
0 (00)
R
FREQ[23:22] is always 0 (the FREQ2 register is less than 36 with 26-27
MHz crystal)
5:0
FREQ[21:16]
30 (0x1E)
R/W
FREQ[23:22] is the base frequency for the frequency synthesiser in
16
increments of FXOSC/2 .
f carrier =
f XOSC
⋅ FREQ [23 : 0]
216
0x0E: FREQ1 – Frequency Control Word, Middle Byte
Bit
Field Name
Reset
R/W
Description
7:0
FREQ[15:8]
196 (0xC4)
R/W
Ref. FREQ2 register
0x0F: FREQ0 – Frequency Control Word, Low Byte
Bit
Field Name
Reset
R/W
Description
7:0
FREQ[7:0]
236 (0xEC)
R/W
Ref. FREQ2 register
SWRS038D
Page 68 of 92
CC1100
0x10: MDMCFG4 – Modem Configuration
Bit
Field Name
Reset
R/W
7:6
CHANBW_E[1:0]
2 (0x02)
R/W
5:4
CHANBW_M[1:0]
0 (0x00)
R/W
Description
Sets the decimation ratio for the delta-sigma ADC input stream and thus
the channel bandwidth.
BWchannel =
f XOSC
8 ⋅ (4 + CHANBW _ M )·2CHANBW _ E
The default values give 203 kHz channel filter bandwidth, assuming a 26.0
MHz crystal.
3:0
DRATE_E[3:0]
12 (0x0C)
R/W
The exponent of the user specified symbol rate
0x11: MDMCFG3 – Modem Configuration
Bit
Field Name
Reset
R/W
Description
7:0
DRATE_M[7:0]
34 (0x22)
R/W
The mantissa of the user specified symbol rate. The symbol rate is
configured using an unsigned, floating-point number with 9-bit mantissa
th
and 4-bit exponent. The 9 bit is a hidden ‘1’. The resulting data rate is:
RDATA =
(256 + DRATE _ M ) ⋅ 2 DRATE _ E ⋅ f
2 28
XOSC
The default values give a data rate of 115.051 kBaud (closest setting to
115.2 kBaud), assuming a 26.0 MHz crystal.
SWRS038D
Page 69 of 92
CC1100
0x12: MDMCFG2 – Modem Configuration
Bit
Field Name
Reset
R/W
Description
7
DEM_DCFILT_OFF
0
R/W
Disable digital DC blocking filter before demodulator.
0 = Enable (better sensitivity)
1 = Disable (current optimized). Only for data rates
≤ 250 kBaud
The recommended IF frequency changes when the DC blocking is
disabled. Please use SmartRF® Studio [7] to calculate correct register
setting.
6:4
MOD_FORMAT[2:0]
0 (000)
R/W
The modulation format of the radio signal
Setting
Modulation format
0 (000)
2-FSK
1 (001)
GFSK
2 (010)
-
3 (011)
ASK/OOK
4 (100)
-
5 (101)
-
6 (110)
-
7 (111)
MSK
ASK is only supported for output powers up to -1 dBm
MSK is only supported for datarates above 26 kBaud
3
MANCHESTER_EN
0
R/W
Enables Manchester encoding/decoding.
0 = Disable
1 = Enable
2:0
SYNC_MODE[2:0]
2 (010)
R/W
Combined sync-word qualifier mode.
The values 0 (000) and 4 (100) disables preamble and sync word
transmission in TX and preamble and sync word detection in RX.
The values 1 (001), 2 (010), 5 (101) and 6 (110) enables 16-bit sync word
transmission in TX and 16-bits sync word detection in RX. Only 15 of 16
bits need to match in RX when using setting 1 (001) or 5 (101). The values
3 (011) and 7 (111) enables repeated sync word transmission in TX and
32-bits sync word detection in RX (only 30 of 32 bits need to match).
Setting
Sync-word qualifier mode
0 (000)
No preamble/sync
1 (001)
15/16 sync word bits detected
2 (010)
16/16 sync word bits detected
3 (011)
30/32 sync word bits detected
4 (100)
No preamble/sync, carrier-sense
above threshold
5 (101)
15/16 + carrier-sense above threshold
6 (110)
16/16 + carrier-sense above threshold
7 (111)
30/32 + carrier-sense above threshold
SWRS038D
Page 70 of 92
CC1100
0x13: MDMCFG1– Modem Configuration
Bit
Field Name
Reset
R/W
Description
7
FEC_EN
0
R/W
Enable Forward Error Correction (FEC) with interleaving for
packet payload
0 = Disable
1 = Enable (Only supported for fixed packet length mode, i.e.
PKTCTRL0.LENGTH_CONFIG=0)
6:4
NUM_PREAMBLE[2:0]
3:2
Reserved
1:0
CHANSPC_E[1:0]
2 (010)
R/W
Sets the minimum number of preamble bytes to be transmitted
Setting
Number of preamble bytes
0 (000)
2
1 (001)
3
2 (010)
4
3 (011)
6
4 (100)
8
5 (101)
12
6 (110)
16
7 (111)
24
R0
2 (10)
R/W
2 bit exponent of channel spacing
0x14: MDMCFG0– Modem Configuration
Bit
Field Name
Reset
R/W
Description
7:0
CHANSPC_M[7:0]
248 (0xF8)
R/W
8-bit mantissa of channel spacing. The channel spacing is
multiplied by the channel number CHAN and added to the base
frequency. It is unsigned and has the format:
∆f CHANNEL =
f XOSC
⋅ (256 + CHANSPC _ M ) ⋅ 2 CHANSPC _ E
218
The default values give 199.951 kHz channel spacing (the
closest setting to 200 kHz), assuming 26.0 MHz crystal
frequency.
SWRS038D
Page 71 of 92
CC1100
0x15: DEVIATN – Modem Deviation Setting
Bit
Field Name
7
Reserved
6:4
DEVIATION_E[2:0]
3
Reserved
2:0
DEVIATION_M[2:0]
Reset
R/W
Description
R0
4 (0x04)
R/W
Deviation exponent
R0
7 (111)
R/W
When MSK modulation is enabled:
Sets fraction of symbol period used for phase change. Refer to the
SmartRF® Studio software [7] for correct deviation setting when using
MSK.
When 2-FSK/GFSK modulation is enabled:
Deviation mantissa, interpreted as a 4-bit value with MSB implicit 1. The
resulting frequency deviation is given by:
f dev =
f xosc
⋅ (8 + DEVIATION _ M ) ⋅ 2 DEVIATION _ E
217
The default values give ±47.607 kHz deviation, assuming 26.0 MHz crystal
frequency.
SWRS038D
Page 72 of 92
CC1100
0x16: MCSM2 – Main Radio Control State Machine Configuration
Bit
Field Name
Reset
R/W
Description
7:5
Reserved
R0
Reserved
4
RX_TIME_RSSI
0
R/W
Direct RX termination based on RSSI measurement (carrier sense). For
ASK/OOK modulation, RX times out if there is no carrier sense in the first 8
symbol periods.
3
RX_TIME_QUAL
0
R/W
When the RX_TIME timer expires, the chip checks if sync word is found
when RX_TIME_QUAL=0, or either sync word is found or PQI is set when
RX_TIME_QUAL=1.
2:0
RX_TIME[2:0]
7 (111)
R/W
Timeout for sync word search in RX for both WOR mode and normal RX
operation. The timeout is relative to the programmed EVENT0 timeout.
The RX timeout in µs is given by EVENT0·C(RX_TIME, WOR_RES) ·26/X, where C is given by the table below and X is
the crystal oscillator frequency in MHz:
Setting
WOR_RES = 0
WOR_RES = 1
WOR_RES = 2
WOR_RES = 3
0 (000)
3.6058
18.0288
32.4519
46.8750
1 (001)
1.8029
9.0144
16.2260
23.4375
2 (010)
0.9014
4.5072
8.1130
11.7188
3 (011)
0.4507
2.2536
4.0565
5.8594
4 (100)
0.2254
1.1268
2.0282
2.9297
5 (101)
0.1127
0.5634
1.0141
1.4648
6 (110)
0.0563
0.2817
0.5071
0.7324
7 (111)
Until end of packet
As an example, EVENT0=34666, WOR_RES=0 and RX_TIME=6 corresponds to 1.96 ms RX timeout, 1 s polling interval
and 0.195% duty cycle. Note that WOR_RES should be 0 or 1 when using WOR because using WOR_RES > 1 will give a
very low duty cycle. In applications where WOR is not used all settings of WOR_RES can be used.
The duty cycle using WOR is approximated by:
Setting
WOR_RES=0
WOR_RES=1
0 (000)
12.50%
1.95%
1 (001)
6.250%
9765ppm
2 (010)
3.125%
4883ppm
3 (011)
1.563%
2441ppm
4 (100)
0.781%
NA
5 (101)
0.391%
NA
6 (110)
0.195%
NA
7 (111)
NA
Note that the RC oscillator must be enabled in order to use setting 0-6, because the timeout counts RC oscillator
periods. WOR mode does not need to be enabled.
The timeout counter resolution is limited: With RX_TIME=0, the timeout count is given by the 13 MSBs of EVENT0,
decreasing to the 7MSBs of EVENT0 with RX_TIME=6.
SWRS038D
Page 73 of 92
CC1100
0x17: MCSM1– Main Radio Control State Machine Configuration
Bit
Field Name
7:6
Reserved
5:4
CCA_MODE[1:0]
3:2
RXOFF_MODE[1:0]
Reset
R/W
Description
R0
3 (11)
0 (00)
R/W
R/W
Selects CCA_MODE; Reflected in CCA signal
Setting
Clear channel indication
0 (00)
Always
1 (01)
If RSSI below threshold
2 (10)
Unless currently receiving a packet
3 (11)
If RSSI below threshold unless currently
receiving a packet
Select what should happen when a packet has been received
Setting
Next state after finishing packet reception
0 (00)
IDLE
1 (01)
FSTXON
2 (10)
TX
3 (11)
Stay in RX
It is not possible to set RXOFF_MODE to be TX or FSTXON and at the same
time use CCA.
1:0
TXOFF_MODE[1:0]
0 (00)
R/W
Select what should happen when a packet has been sent (TX)
Setting
Next state after finishing packet transmission
0 (00)
IDLE
1 (01)
FSTXON
2 (10)
Stay in TX (start sending preamble)
3 (11)
RX
SWRS038D
Page 74 of 92
CC1100
0x18: MCSM0– Main Radio Control State Machine Configuration
Bit
Field Name
7:6
Reserved
5:4
FS_AUTOCAL[1:0]
Reset
R/W
Description
R0
0 (00)
R/W
Automatically calibrate when going to RX or TX, or back to IDLE
Setting
When to perform automatic calibration
0 (00)
Never (manually calibrate using SCAL strobe)
1 (01)
When going from IDLE to RX or TX (or FSTXON)
2 (10)
When going from RX or TX back to IDLE
automatically
3 (11)
Every 4 time when going from RX or TX to IDLE
automatically
th
In some automatic wake-on-radio (WOR) applications, using setting 3 (11)
can significantly reduce current consumption.
3:2
PO_TIMEOUT
1 (01)
R/W
Programs the number of times the six-bit ripple counter must expire after
XOSC has stabilized before CHP_RDYn goes low.
If XOSC is on (stable) during power-down, PO_TIMEOUT should be set so
that the regulated digital supply voltage has time to stabilize before
CHP_RDYn goes low (PO_TIMEOUT=2 recommended). Typical start-up
time for the voltage regulator is 50 us.
If XOSC is off during power-down and the regulated digital supply voltage
has sufficient time to stabilize while waiting for the crystal to be stable,
PO_TIMEOUT can be set to 0. For robust operation it is recommended to
use PO_TIMEOUT=2.
Setting
Expire count
Timeout after XOSC start
0 (00)
1
Approx. 2.3 – 2.4 µs
1 (01)
16
Approx. 37 – 39 µs
2 (10)
64
Approx. 149 – 155 µs
3 (11)
256
Approx. 597 – 620 µs
Exact timeout depends on crystal frequency.
1
PIN_CTRL_EN
0
R/W
Enables the pin radio control option
0
XOSC_FORCE_ON
0
R/W
Force the XOSC to stay on in the SLEEP state.
SWRS038D
Page 75 of 92
CC1100
0x19: FOCCFG – Frequency Offset Compensation Configuration
Bit
Field Name
7:6
Reserved
5
FOC_BS_CS_GATE
1
R/W
If set, the demodulator freezes the frequency offset compensation and clock
recovery feedback loops until the CS signal goes high.
4:3
FOC_PRE_K[1:0]
2 (10)
R/W
The frequency compensation loop gain to be used before a sync word is
detected.
2
1:0
FOC_POST_K
FOC_LIMIT[1:0]
Reset
R/W
Description
R0
1
2 (10)
R/W
R/W
Setting
Freq. compensation loop gain before sync word
0 (00)
K
1 (01)
2K
2 (10)
3K
3 (11)
4K
The frequency compensation loop gain to be used after a sync word is
detected.
Setting
Freq. compensation loop gain after sync word
0
Same as FOC_PRE_K
1
K/2
The saturation point for the frequency offset compensation algorithm:
Setting
Saturation point (max compensated offset)
0 (00)
±0 (no frequency offset compensation)
1 (01)
±BWCHAN/8
2 (10)
±BWCHAN/4
3 (11)
±BWCHAN/2
Frequency offset compensation is not supported for ASK/OOK; Always use
FOC_LIMIT=0 with these modulation formats.
SWRS038D
Page 76 of 92
CC1100
0x1A: BSCFG – Bit Synchronization Configuration
Bit
Field Name
Reset
R/W
Description
7:6
BS_PRE_KI[1:0]
1 (01)
R/W
The clock recovery feedback loop integral gain to be used before a sync word
is detected (used to correct offsets in data rate):
5:4
3
2
1:0
BS_PRE_KP[1:0]
BS_POST_KI
BS_POST_KP
BS_LIMIT[1:0]
2 (10)
1
1
0 (00)
R/W
R/W
R/W
R/W
Setting
Clock recovery loop integral gain before sync word
0 (00)
KI
1 (01)
2KI
2 (10)
3KI
3 (11)
4KI
The clock recovery feedback loop proportional gain to be used before a sync
word is detected.
Setting
Clock recovery loop proportional gain before sync word
0 (00)
KP
1 (01)
2KP
2 (10)
3KP
3 (11)
4KP
The clock recovery feedback loop integral gain to be used after a sync word is
detected.
Setting
Clock recovery loop integral gain after sync word
0
Same as BS_PRE_KI
1
KI /2
The clock recovery feedback loop proportional gain to be used after a sync
word is detected.
Setting
Clock recovery loop proportional gain after sync word
0
Same as BS_PRE_KP
1
KP
The saturation point for the data rate offset compensation algorithm:
Setting
Data rate offset saturation (max data rate difference)
0 (00)
±0 (No data rate offset compensation performed)
1 (01)
±3.125% data rate offset
2 (10)
±6.25% data rate offset
3 (11)
±12.5% data rate offset
SWRS038D
Page 77 of 92
CC1100
0x1B: AGCCTRL2 – AGC Control
Bit
Field Name
Reset
R/W
Description
7:6
MAX_DVGA_GAIN[1:0]
0 (00)
R/W
Reduces the maximum allowable DVGA gain.
5:3
2:0
MAX_LNA_GAIN[2:0]
MAGN_TARGET[2:0]
0 (000)
3 (011)
R/W
R/W
Setting
Allowable DVGA settings
0 (00)
All gain settings can be used
1 (01)
The highest gain setting can not be used
2 (10)
The 2 highest gain settings can not be used
3 (11)
The 3 highest gain settings can not be used
Sets the maximum allowable LNA + LNA 2 gain relative to the
maximum possible gain.
Setting
Maximum allowable LNA + LNA 2 gain
0 (000)
Maximum possible LNA + LNA 2 gain
1 (001)
Approx. 2.6 dB below maximum possible gain
2 (010)
Approx. 6.1 dB below maximum possible gain
3 (011)
Approx. 7.4 dB below maximum possible gain
4 (100)
Approx. 9.2 dB below maximum possible gain
5 (101)
Approx. 11.5 dB below maximum possible gain
6 (110)
Approx. 14.6 dB below maximum possible gain
7 (111)
Approx. 17.1 dB below maximum possible gain
These bits set the target value for the averaged amplitude from the
digital channel filter (1 LSB = 0 dB).
Setting
Target amplitude from channel filter
0 (000)
24 dB
1 (001)
27 dB
2 (010)
30 dB
3 (011)
33 dB
4 (100)
36 dB
5 (101)
38 dB
6 (110)
40 dB
7 (111)
42 dB
SWRS038D
Page 78 of 92
CC1100
0x1C: AGCCTRL1 – AGC Control
Bit
Field Name
7
Reserved
6
AGC_LNA_PRIORITY
1
R/W
Selects between two different strategies for LNA and LNA 2
gain adjustment. When 1, the LNA gain is decreased first.
When 0, the LNA 2 gain is decreased to minimum before
decreasing LNA gain.
5:4
CARRIER_SENSE_REL_THR[1:0]
0 (00)
R/W
Sets the relative change threshold for asserting carrier sense
3:0
CARRIER_SENSE_ABS_THR[3:0]
Reset
R/W
Description
R0
0
(0000)
R/W
Setting
Carrier sense relative threshold
0 (00)
Relative carrier sense threshold disabled
1 (01)
6 dB increase in RSSI value
2 (10)
10 dB increase in RSSI value
3 (11)
14 dB increase in RSSI value
Sets the absolute RSSI threshold for asserting carrier sense.
The 2-complement signed threshold is programmed in steps of
1 dB and is relative to the MAGN_TARGET setting.
Setting
Carrier sense absolute threshold
(Equal to channel filter amplitude when AGC
has not decreased gain)
-8 (1000)
Absolute carrier sense threshold disabled
-7 (1001)
7 dB below MAGN_TARGET setting
…
…
-1 (1111)
1 dB below MAGN_TARGET setting
0 (0000)
At MAGN_TARGET setting
1 (0001)
1 dB above MAGN_TARGET setting
…
…
7 (0111)
7 dB above MAGN_TARGET setting
SWRS038D
Page 79 of 92
CC1100
0x1D: AGCCTRL0 – AGC Control
Bit
Field Name
Reset
R/W
Description
7:6
HYST_LEVEL[1:0]
2 (10)
R/W
Sets the level of hysteresis on the magnitude deviation (internal AGC
signal that determine gain changes).
Setting
5:4
3:2
WAIT_TIME[1:0]
AGC_FREEZE[1:0]
1 (01)
0 (00)
R/W
R/W
0 (00)
No hysteresis, small symmetric dead zone, high gain
1 (01)
Low hysteresis, small asymmetric dead zone, medium
gain
2 (10)
Medium hysteresis, medium asymmetric dead zone,
medium gain
3 (11)
Large hysteresis, large asymmetric dead zone, low
gain
Sets the number of channel filter samples from a gain adjustment
has been made until the AGC algorithm starts accumulating new
samples.
Setting
Channel filter samples
0 (00)
8
1 (01)
16
2 (10)
24
3 (11)
32
Control when the AGC gain should be frozen.
Setting
1:0
FILTER_LENGTH[1:0]
1 (01)
R/W
Description
Function
0 (00)
Normal operation. Always adjust gain when required.
1 (01)
The gain setting is frozen when a sync word has been
found.
2 (10)
Manually freeze the analogue gain setting and
continue to adjust the digital gain.
3 (11)
Manually freezes both the analogue and the digital
gain setting. Used for manually overriding the gain.
Sets the averaging length for the amplitude from the channel filter.
Sets the OOK/ASK decision boundary for OOK/ASK reception.
Setting
Channel filter
samples
OOK decision
0 (00)
8
4 dB
1 (01)
16
8 dB
2 (10)
32
12 dB
3 (11)
64
16 dB
0x1E: WOREVT1 – High Byte Event0 Timeout
Bit
Field Name
Reset
R/W
Description
7:0
EVENT0[15:8]
135 (0x87)
R/W
High byte of EVENT0 timeout register
t Event 0 =
SWRS038D
750
⋅ EVENT 0 ⋅ 2 5⋅WOR _ RES
f XOSC
Page 80 of 92
CC1100
0x1F: WOREVT0 –Low Byte Event0 Timeout
Bit
Field Name
Reset
R/W
Description
7:0
EVENT0[7:0]
107 (0x6B)
R/W
Low byte of EVENT0 timeout register.
The default EVENT0 value gives 1.0s timeout, assuming a 26.0 MHz
crystal.
0x20: WORCTRL – Wake On Radio Control
Bit
Field Name
Reset
R/W
Description
7
RC_PD
1
R/W
Power down signal to RC oscillator. When written to 0, automatic initial
calibration will be performed
6:4
EVENT1[2:0]
7 (111)
R/W
Timeout setting from register block. Decoded to Event 1 timeout. RC
oscillator clock frequency equals FXOSC/750, which is 34.7 – 36 kHz,
depending on crystal frequency. The table below lists the number of clock
periods after Event 0 before Event 1 times out.
3
RC_CAL
2
Reserved
1:0
WOR_RES
1
R/W
Setting
tEvent1
0 (000)
4 (0.111 – 0.115 ms)
1 (001)
6 (0.167 – 0.173 ms)
2 (010)
8 (0.222 – 0.230 ms)
3 (011)
12 (0.333 – 0.346 ms)
4 (100)
16 (0.444 – 0.462 ms)
5 (101)
24 (0.667 – 0.692 ms)
6 (110)
32 (0.889 – 0.923 ms)
7 (111)
48 (1.333 – 1.385 ms)
Enables (1) or disables (0) the RC oscillator calibration.
R0
0 (00)
R/W
Controls the Event 0 resolution as well as maximum timeout of the WOR
module and maximum timeout under normal RX operation::
Setting
Resolution (1 LSB)
Max timeout
0 (00)
1 period (28µs – 29µs)
1.8 – 1.9 seconds
5
58 – 61 seconds
10
31 – 32 minutes
15
16.5 – 17.2 hours
1 (01)
2 periods (0.89ms –0.92 ms)
2 (10)
2 periods (28 – 30 ms)
3 (11)
2 periods (0.91 – 0.94 s)
Note that WOR_RES should be 0 or 1 when using WOR because
WOR_RES > 1 will give a very low duty cycle.
In normal RX operation all settings of WOR_RES can be used.
SWRS038D
Page 81 of 92
CC1100
0x21: FREND1 – Front End RX Configuration
Bit
Field Name
Reset
R/W
Description
7:6
LNA_CURRENT[1:0]
1 (01)
R/W
Adjusts front-end LNA PTAT current output
5:4
LNA2MIX_CURRENT[1:0]
1 (01)
R/W
Adjusts front-end PTAT outputs
3:2
LODIV_BUF_CURRENT_RX[1:0]
1 (01)
R/W
Adjusts current in RX LO buffer (LO input to mixer)
1:0
MIX_CURRENT[1:0]
2 (10)
R/W
Adjusts current in mixer
0x22: FREND0 – Front End TX Configuration
Bit
Field Name
Reset
7:6
Reserved
5:4
LODIV_BUF_CURRENT_TX[1:0]
3
Reserved
2:0
PA_POWER[2:0]
R/W
Description
R0
1 (0x01)
R/W
Adjusts current TX LO buffer (input to PA). The value to
use in this field is given by the SmartRF® Studio software
[7].
R0
0 (0x00)
R/W
Selects PA power setting. This value is an index to the
PATABLE, which can be programmed with up to 8 different
PA settings. In OOK/ASK mode, this selects the PATABLE
index to use when transmitting a ‘1’. PATABLE index zero
is used in OOK/ASK when transmitting a ‘0’. The PATABLE
settings from index ‘0’ to the PA_POWER value are used for
ASK TX shaping, and for power ramp-up/ramp-down at the
start/end of transmission in all TX modulation formats.
0x23: FSCAL3 – Frequency Synthesizer Calibration
Bit
Field Name
Reset
R/W
Description
7:6
FSCAL3[7:6]
2 (0x02)
R/W
Frequency synthesizer calibration configuration. The value
to write in this field before calibration is given by the
SmartRF® Studio software.
5:4
CHP_CURR_CAL_EN[1:0]
2 (0x02)
R/W
Enable charge pump calibration stage when 1
3:0
FSCAL3[3:0]
9 (1001)
R/W
Frequency synthesizer calibration result register. Digital bit
vector defining the charge pump output current, on an
FSCAL3[3:0]/4
exponential scale: IOUT = I0·2
Fast frequency hopping without calibration for each hop
can be done by calibrating upfront for each frequency and
saving the resulting FSCAL3, FSCAL2 and FSCAL1 register
values. Between each frequency hop, calibration can be
replaced by writing the FSCAL3, FSCAL2 and FSCAL1
register values corresponding to the next RF frequency.
SWRS038D
Page 82 of 92
CC1100
0x24: FSCAL2 – Frequency Synthesizer Calibration
Bit
Field Name
Reset
R/W
Description
7:6
Reserved
5
VCO_CORE_H_EN
0
R/W
Choose high (1) / low (0) VCO
4:0
FSCAL2[4:0]
10 (0x0A)
R/W
Frequency synthesizer calibration result register. VCO current calibration
result and override value
Fast frequency hopping without calibration for each hop can be done by
calibrating upfront for each frequency and saving the resulting FSCAL3,
FSCAL2 and FSCAL1 register values. Between each frequency hop,
calibration can be replaced by writing the FSCAL3, FSCAL2 and FSCAL1
register values corresponding to the next RF frequency.
R0
0x25: FSCAL1 – Frequency Synthesizer Calibration
Bit
Field Name
7:6
Reserved
5:0
FSCAL1[5:0]
Reset
R/W
Description
R0
32 (0x20)
R/W
Frequency synthesizer calibration result register. Capacitor array setting
for VCO coarse tuning.
Fast frequency hopping without calibration for each hop can be done by
calibrating upfront for each frequency and saving the resulting FSCAL3,
FSCAL2 and FSCAL1 register values. Between each frequency hop,
calibration can be replaced by writing the FSCAL3, FSCAL2 and FSCAL1
register values corresponding to the next RF frequency.
0x26: FSCAL0 – Frequency Synthesizer Calibration
Bit
Field Name
7
Reserved
6:0
FSCAL0[6:0]
Reset
R/W
Description
R0
13 (0x0D)
R/W
Frequency synthesizer calibration control. The value to use in this
register is given by the SmartRF® Studio software [7].
0x27: RCCTRL1 – RC Oscillator Configuration
Bit
Field Name
Reset
R/W
7
Reserved
0
R0
6:0
RCCTRL1[6:0]
65 (0x41)
R/W
Description
RC oscillator configuration.
0x28: RCCTRL0 – RC Oscillator Configuration
Bit
Field Name
Reset
R/W
7
Reserved
0
R0
6:0
RCCTRL0[6:0]
0 (0x00)
R/W
Description
RC oscillator configuration.
SWRS038D
Page 83 of 92
CC1100
33.2 Configuration Register Details – Registers that Lose Programming in SLEEP State
0x29: FSTEST – Frequency Synthesizer Calibration Control
Bit
Field Name
Reset
R/W
Description
7:0
FSTEST[7:0]
89 (0x59)
R/W
For test only. Do not write to this register.
0x2A: PTEST – Production Test
Bit
Field Name
Reset
R/W
Description
7:0
PTEST[7:0]
127 (0x7F)
R/W
Writing 0xBF to this register makes the on-chip temperature sensor
available in the IDLE state. The default 0x7F value should then be
written back before leaving the IDLE state.
Other use of this register is for test only.
0x2B: AGCTEST – AGC Test
Bit
Field Name
Reset
R/W
Description
7:0
AGCTEST[7:0]
63 (0x3F)
R/W
For test only. Do not write to this register.
0x2C: TEST2 – Various Test Settings
Bit
Field Name
Reset
R/W
Description
7:0
TEST2[7:0]
136 (0x88)
R/W
The value to use in this register is given by the SmartRF® Studio
software [7].
0x2D: TEST1 – Various Test Settings
Bit
Field Name
Reset
R/W
Description
7:0
TEST1[7:0]
49 (0x31)
R/W
The value to use in this register is given by the SmartRF® Studio
software [7].
0x2E: TEST0 – Various Test Settings
Bit
Field Name
Reset
R/W
Description
7:2
TEST0[7:2]
2 (0x02)
R/W
The value to use in this register is given by the SmartRF® Studio
software [7].
1
VCO_SEL_CAL_EN
1
R/W
Enable VCO selection calibration stage when 1
0
TEST0[0]
1
R/W
The value to use in this register is given by the SmartRF® Studio
software [7].
SWRS038D
Page 84 of 92
CC1100
33.3 Status Register Details
0x30 (0xF0): PARTNUM – Chip ID
Bit
Field Name
Reset
R/W
Description
7:0
PARTNUM[7:0]
0 (0x00)
R
Chip part number
0x31 (0xF1): VERSION – Chip ID
Bit
Field Name
Reset
R/W
Description
7:0
VERSION[7:0]
3 (0x03)
R
Chip version number.
0x32 (0xF2): FREQEST – Frequency Offset Estimate from Demodulator
Bit
Field Name
Reset
7:0
FREQOFF_EST
R/W
Description
R
The estimated frequency offset (2’s complement) of the carrier. Resolution is
14
FXTAL/2 (1.59 - 1.65 kHz); range is ±202 kHz to ±210 kHz, dependent of XTAL
frequency.
Frequency offset compensation is only supported for 2-FSK, GFSK, and MSK
modulation. This register will read 0 when using ASK or OOK modulation.
0x33 (0xF3): LQI – Demodulator Estimate for Link Quality
Bit
Field Name
7
6:0
Reset
R/W
Description
CRC OK
R
The last CRC comparison matched. Cleared when entering/restarting RX
mode.
LQI_EST[6:0]
R
The Link Quality Indicator estimates how easily a received signal can be
demodulated. Calculated over the 64 symbols following the sync word
0x34 (0xF4): RSSI – Received Signal Strength Indication
Bit
Field Name
7:0
RSSI
Reset
R/W
Description
R
Received signal strength indicator
SWRS038D
Page 85 of 92
CC1100
0x35 (0xF5): MARCSTATE – Main Radio Control State Machine State
Bit
Field Name
Reset
R/W
7:5
Reserved
R0
4:0
MARC_STATE[4:0]
R
Description
Main Radio Control FSM State
Value
State name
State (Figure 16, page 42)
0 (0x00)
SLEEP
SLEEP
1 (0x01)
IDLE
IDLE
2 (0x02)
XOFF
XOFF
3 (0x03)
VCOON_MC
MANCAL
4 (0x04)
REGON_MC
MANCAL
5 (0x05)
MANCAL
MANCAL
6 (0x06)
VCOON
FS_WAKEUP
7 (0x07)
REGON
FS_WAKEUP
8 (0x08)
STARTCAL
CALIBRATE
9 (0x09)
BWBOOST
SETTLING
10 (0x0A)
FS_LOCK
SETTLING
11 (0x0B)
IFADCON
SETTLING
12 (0x0C)
ENDCAL
CALIBRATE
13 (0x0D)
RX
RX
14 (0x0E)
RX_END
RX
15 (0x0F)
RX_RST
RX
16 (0x10)
TXRX_SWITCH
TXRX_SETTLING
17 (0x11)
RXFIFO_OVERFLOW
RXFIFO_OVERFLOW
18 (0x12)
FSTXON
FSTXON
19 (0x13)
TX
TX
20 (0x14)
TX_END
TX
21 (0x15)
RXTX_SWITCH
RXTX_SETTLING
22 (0x16)
TXFIFO_UNDERFLOW
TXFIFO_UNDERFLOW
Note: it is not possible to read back the SLEEP or XOFF state numbers
because setting CSn low will make the chip enter the IDLE mode from the
SLEEP or XOFF states.
0x36 (0xF6): WORTIME1 – High Byte of WOR Time
Bit
Field Name
7:0
TIME[15:8]
Reset
R/W
Description
R
High byte of timer value in WOR module
0x37 (0xF7): WORTIME0 – Low Byte of WOR Time
Bit
Field Name
7:0
TIME[7:0]
Reset
R/W
Description
R
Low byte of timer value in WOR module
SWRS038D
Page 86 of 92
CC1100
0x38 (0xF8): PKTSTATUS – Current GDOx Status and Packet Status
Bit
Field Name
7
Reset
R/W
Description
CRC_OK
R
The last CRC comparison matched. Cleared when entering/restarting RX
mode.
6
CS
R
Carrier sense
5
PQT_REACHED
R
Preamble Quality reached
4
CCA
R
Channel is clear
3
SFD
R
Sync word found
2
GDO2
R
Current GDO2 value. Note: the reading gives the non-inverted value
irrespective of what IOCFG2.GDO2_INV is programmed to.
It is not recommended to check for PLL lock by reading PKTSTATUS[2]
with GDO2_CFG=0x0A.
1
Reserved
R0
0
GDO0
R
Current GDO0 value. Note: the reading gives the non-inverted value
irrespective of what IOCFG0.GDO0_INV is programmed to.
It is not recommended to check for PLL lock by reading PKTSTATUS[0]
with GDO0_CFG=0x0A.
0x39 (0xF9): VCO_VC_DAC – Current Setting from PLL Calibration Module
Bit
Field Name
Reset
7:0
VCO_VC_DAC[7:0]
R/W
Description
R
Status register for test only.
0x3A (0xFA): TXBYTES – Underflow and Number of Bytes
Bit
Field Name
Reset
R/W
7
TXFIFO_UNDERFLOW
R
6:0
NUM_TXBYTES
R
Description
Number of bytes in TX FIFO
0x3B (0xFB): RXBYTES – Overflow and Number of Bytes
Bit
Field Name
Reset
R/W
7
RXFIFO_OVERFLOW
R
6:0
NUM_RXBYTES
R
Description
Number of bytes in RX FIFO
0x3C (0xFC): RCCTRL1_STATUS – Last RC Oscillator Calibration Result
Bit
Field Name
Reset
R/W
7
Reserved
R0
6:0
RCCTRL1_STATUS[6:0]
R
Description
Contains the value from the last run of the RC oscillator calibration
routine.
For usage description refer to AN047 [4]
SWRS038D
Page 87 of 92
CC1100
0x3D (0xFC): RCCTRL0_STATUS – Last RC Oscillator Calibration Result
Bit
Field Name
Reset
R/W
7
Reserved
R0
6:0
RCCTRL0_STATUS[6:0]
R
Description
Contains the value from the last run of the RC oscillator calibration
routine.
For usage description refer to Aplication Note AN047 [4].
34
Package Description (QLP 20)
34.1 Recommended PCB Layout for Package (QLP 20)
Figure 31: Recommended PCB Layout for QLP 20 Package
Note: Figure 31 is an illustration only and not to scale. There are five 10 mil via holes distributed
symmetrically in the ground pad under the package. See also the CC1100EM reference designs
([5] and [6]).
34.2 Soldering Information
The recommendations for lead-free reflow in IPC/JEDEC J-STD-020 should be followed.
SWRS038D
Page 88 of 92
CC1100
35
Ordering Information
Orderable
Device
Status
(1)
Package
Type
Package
Drawing
Pins
Package
Qty
Eco Plan (2)
Lead
Finish
CC1100RTKR
NRND
QLP
RTK
20
3000
Green (RoHS &
no Sb/Br)
Cu NiPdAu
CC1100RTK
NRND
QLP
RTK
20
92
Green (RoHS &
no Sb/Br)
Cu NiPdAu
MSL Peak
Temp (3)
LEVEL3-260C
1 YEAR
LEVEL3-260C
1 YEAR
Table 39: Ordering Information
SWRS038D
Page 89 of 92
CC1100
36 References
[1] CC1100 Errata Notes (swrz012.pdf)
[2] AN001 SRD Regulations for Licence Free Transceiver Operation (swra090.pdf)
[3] AN039 Using the CC1100 in the European 433 and 868 MHz ISM Bands (swra054.pdf)
[4] AN047 CC1100/CC2500 – Wake-On-Radio (swra126.pdf)
[5] CC1100EM 315 - 433 MHz Reference Design 1.0 (swrr037.zip)
[6] CC1100EM 868 – 915 MHz Reference Design 2.0 (swrr038.zip)
[7] SmartRF® Studio (swrc046.zip)
[8] CC1100 CC2500 Examples Libraries (swrc021.zip)
[9] CC1100/CC1150DK, CC1101DK, and CC2500/CC2550DK Examples and Libraries User
Manual (swru109.pdf)
SWRS038D
Page 90 of 92
CC1100
37
General Information
37.1 Document History
Revision
Date
Description/Changes
SWRS038D
2009-05-26
Updated packet and ordering information.
Removed Product Status Definition, Address Information and TI World Wide Support section.
Removed Low-Cost from datasheet title.
Added product information on front page
Added info to ordering information
Changes in the General Principle of Matrix Interleaving figure.
Changes in Table: Bill Of Materials for the Application Circuit
Changes in Figure: Typical Application and Evaluation Circuit 868/915 MHz
Changed the equation for channel spacing in the MDMCFG0 register.
kbps replaced by kBaud throughout the document.
Some of the sections have been re-written to be easier to read without having any new info
added.
Absolute maximum supply voltage rating increased from 3.6 V to 3.9 V.
Changed the frequency accuracy after calibration for the low power RC oscillator from ±0.3 to
±1 %.
Updates to sensitivity and current consumption numbers listed under Key Features.
FSK changed to 2-FSK throughout the document.
Updates to the Abbreviation table.
Updates to the Electrical Specifications section.
Added info about RX and TX latency.
Added info in the Pinout Overview table regarding GDO0 and GDO2.
Changed current consumption in RX and TX in the simplified state diagram.
Added info about default values after reset vs. optimum register settings in the Configuration
Software section
Changes to the SPI Interface Timing Requirements.
Info added about tsp,pd
The following figures have been changed: Configuration Registers Write and Read Operations,
SRES Command Strobe, and Register Access Types.
In the Register Access section, the address range is changed.
In the PATABLE Access section, info is added regarding limitations on output power
programming when using PA ramping.
In the Packet Format section, preamble pattern is changed to 10101010 and info about bug
related to turning off the transmitter in infinite packet length mode is added.
Added info to the Frequency Offset Compensation section.
Added info about the initial value of the PN9 sequence in the Data Whitening section.
In the Packet Handling in Transmit Mode section, info about TX FIFO underflow state is added.
Added section Packet Handling in Firmware.
0x00 is added as a valid PATABLE setting in addition to 0x30-0x3F when using ASK.
In the PQT section a change is made as to how much the counter decreases.
The RSSI value is in dBm and not dB.
The whole CS Absolute Threshold section has been re-written and the equation calculating the
threshold has been removed.
Added info in the CCA section on what happens if the channel is not clear.
Added info to the LQI section for better understanding.
Removed all references to the voltage regulator in relation with the CHP_RDYn signal, as this
signal is only related to the crystal.
Removed references to the voltage regulator in the figures: Power-On Reset and Power-On
Reset with SRES. Changes to the SI line in the Power-On Reset with SRES figure
Added info on the three automatic calibration options.
Removed the autosync feature from the WOR section and added info on how to exit WOR
mode. Also added info about minimum sleep time and references to App. Note 047 together
with info about calibration of the RC oscillator.
The figure: Event 0 and Event 1 Relationship is changed for better readability.
Info added to the Timing section related to reduced calibration time.
The Output Power Programming section is divided into 2 new sections; Output Power
Programming and Shaping and PA Ramping.
Added info on programming of PATABLE when using OOK, and about PATABLE when entering
SLEEP mode.
2 new figures added to the Shaping and PA Ramping section: Shaping of ASK Signal and PA
Ramping, together with one new table: PATABLE Settings Used Together with ASK Shaping
and PA Ramping.
Changed made to current consumption in the Optimum PATABLE Settings for Various Output
Power Levels and Frequency Bands table.
Added section Layout Recommendations.
In section General Purpose / Test Output Control Pins: Added info on GDO pins in SLEEP
SWRS038C
2008-05-22
SWRS038B
2007-07-09
SWRS038D
Page 91 of 92
CC1100
Revision
Date
SWRS038A
2006-06-20
1.0
2005-04-25
Description/Changes
state.
Better explanation of some of the signals in the GDOx Signal Selection table. Also added some
more signals.
Asynchronous transparent mode is called asynchronous serial mode throughout the document.
Removed comments about having to use NRZ coding in synchronous serial mode. Added info
that Manschester encoding cannot be used in this mode.
Added a third calibration method plus additional info about the 3 methods in the Frequency
Hopping and Multi-Channel Systems section.
Added info about differential antenna in the Low Cost Systems section.
Changes number of commands strobes from 14 to 13.
Changed description of SFRX, SFTX, SWORRST, and SNOP in the Command Strobes table.
Added two new registers; RCCTRL1_STATUS and RCCTRL0_STATUS
Changed field name and/or description of the following registers:
PKTCTRL1, MCSM2, MCSM0, WORCTRL, FSCAL3, FSCAL2, FSCAL1, and TEST0.
Changed tray width in the Tray Specification table.
Added references.
Updates to Electrical Specifications due to increased amount of measurement data.
Updated application circuit for 868 MHz. Updated balun component values.
Updated current consumption figures in state diagrams.
Added figures to table on SPI interface timing requirements.
Added information about SPI read.
Added table for channel filter bandwidths.
Added figure showing data whitening.
Updates to text and included new figure in section on arbitrary length configuration.
References to SAFC strobe removed.
Added additional information about support of ASK modulation.
Added information about CRC filtering.
Added information about sync word qualifier.
Added information on RSSI offset, RSSI update rate, RSSI calculation and typical RSSI curves.
Added information on CS and tables with register settings versus CS threshold.
Updates to text and included new figures in section on power-on start-up sequence.
Changes to wake-on-radio current consumption figures under electrical specifications.
Updates to text in section on data FIFO.
Corrected formula for calculation of output frequency in Frequency Programming section.
Added information about how to check for PLL lock in section on VCO.
Corrected table with PATABLE setting versus output power.
Added typical selectivity curves for selected datarates.
Added information on how to interface external clock signal.
Added optimal match impedances in RF match section.
Better explanation of some of the signals in table of GDO signal selection. Also added some
more signals.
Added information on system considerations.
Added CRC_AUTOFLUSH option in PCTRL1 register.
Added information on timeout for sync word search in RX in register MCSM2.
Changes to wake-on-radio control register WORCTRL. WOR_RES[1:0] settings 10 b and 11b
changed to NA.
Added more detailed information on PO_TIMEOUT in register MCSM0.
Added description of programming bits in registers FOCCFG, BSCFG, AGCCTRL2,
AGCCTRL1, AGCCTRL0, FREND1, FSCAL3.
First preliminary Data Sheet release
Table 40: Document History
SWRS038D
Page 92 of 92
PACKAGE OPTION ADDENDUM
www.ti.com
24-Apr-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
CC1100-RTR1
NRND
VQFN
RTK
20
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 85
CC1100
CC1100-RTY1
NRND
VQFN
RTK
20
92
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 85
CC1100
CC1100RTK
NRND
VQFN
RTK
20
92
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 85
CC1100
CC1100RTKG3
NRND
VQFN
RTK
20
92
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 85
CC1100
CC1100RTKR
NRND
VQFN
RTK
20
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 85
CC1100
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
24-Apr-2014
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
29-Sep-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
CC1100RTKR
Package Package Pins
Type Drawing
VQFN
RTK
20
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
3000
330.0
12.4
Pack Materials-Page 1
4.3
B0
(mm)
K0
(mm)
P1
(mm)
4.3
1.5
8.0
W
Pin1
(mm) Quadrant
12.0
Q2
PACKAGE MATERIALS INFORMATION
www.ti.com
29-Sep-2019
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CC1100RTKR
VQFN
RTK
20
3000
350.0
350.0
43.0
Pack Materials-Page 2
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
permission to use these resources only for development of an application that uses the TI products described in the resource. Other
reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third
party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims,
damages, costs, losses, and liabilities arising out of your use of these resources.
TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on
ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable
warranties or warranty disclaimers for TI products.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2019, Texas Instruments Incorporated
Was this manual useful for you? yes no
Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Download PDF

advertising