Texas Instruments | RI-R6C-001A | Datasheet | Texas Instruments RI-R6C-001A Datasheet

Texas Instruments RI-R6C-001A Datasheet
RADIO FREQUENCY IDENTIFICATION SYSTEMS
HF Reader System Series 6000
S6700 Multi-Protocol Transceiver IC
The S6700 Multi Protocol T ransceiver IC enables a bro ad range of 13.56MHz
RFID interrogator designs for po rtable and stationar y readers. This low power
consumption device supports multiple RF communication protocols, minim izes
onboard power requirements and reduces parts count in a final reader product.
Part number
RI-R6C-001A
Operating Frequency
13.56MHz
Supported RF Communication Protocols
-
Operating Voltage
3.3V - 5V DC ± 10%
Current Consumption
Transmit:
< 200 mA
Stand-by: - Oscillator on < 15 mA
- Oscillator off < 50 µA
Transmitter power
200mW at 5V DC operating voltage
Transmitter modulation
ASK, 10% to 100% selectable through external components
Antenna Impedance
50 Ohm at 13.56MHz
Receive channels
ASK 423.75kHz, ASK 847kHz, FSK 423.75kHz/484.29kHz selectable
Communication Interface
Serial interface, CMOS compatible
Operating Temperature
-40°C to +85°C
Storage Temperature
-55°C to +125°C
Package / Pincount
SSOP 20
Packing / Delivery
Tape-on-Reel, 2000 units per reel
Tag-it HF
ISO 15693-2 (e.g. Tag-it HF-I)
ISO 14443-2 (Type A)
Transparent (directly switched according to input pin)
Recommended application schematic
ANTENNA
L1
L2
Pin description
L3
COAX
R1
C1
C2
C3
C4
VCC
1
L4
C5
C1
C2
C3
C4
C5
C6
C7
C8
C9
C10
L1
L2
L3
L4
R1
R2
47pF
10pF
10nF
47pF
10µF Tantalum
100nF
22pF
100nF
22pF
100nF
2.7µH (Q-60)
2.7µH (Q-60)
5.6µH (Q-60)
3.3µH (Q-60)
2.2kΩ
18Ω
2
C6
3
C7
R2
4
5
6
XTAL 13.56 MHz
7
C9
8
9
10
VDD_TX
RX_IN
TX_OUT
VSS_RX
VDD_RX
VSS_DIG
XTAL_CLK
C8
17
16
XTAL1
XTAL2
19
18
R_MOD
VSS_TX
20
SCLOCK
M_ERR
DIN
VDD_DIG
DOUT
15
VCC
14
µC
13
12
VCC
11
C10
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
Symbol
VDD_TX
TX_OUT
R_MOD
VSS_TC
XTAL1
XTAL2
VSS_DIG
XTAL_CLK
Not used
Not used
DOUT
VDD_DIG
DIN
M_ERR
SCLOCK
Not used
VDD_RX
Not used
VSS_RX
RX_IN
Description
Transmitter power supply
Output transistor drain connection
External resistor to set 10% modulation depth mode
Transmitter section ground
Pin 1 of Xtal resonator
Pin 2 of Xtal resonator, external clock input
Digital section ground
Buffered output of Xtal oscillator
Grounded for normal operation
Grounded for normal operation
Data output for serial link
Digital section power supply
Data input for serial link
Manchester Protocol error flag
Serial link clock
Leave open for normal operation
Receiver section power supply
Leave open for normal operation
Receiver section ground
Receiver input
For more information, contact the sales office or distributor nearest you. This contact information can be found
on our web site at:
http://www.ti-rfid.com
Texas Instruments reserves the right to change its products and services at any time without notice. TI provides customer assistance in various
technical areas, but does not have full access to data concerning the uses and applications of customers products. Therefore, TI assumes no
responsibility for customer product design or for infringement of patents and/or the rights of third parties, which may result from assistance
provided by TI.
© Copyright 2002 Texas Instruments Incorporated.
11-07-22-001 09/02
SCBS856
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
RI-R6C-001A-03
ACTIVE
Package Type Package Pins Package
Drawing
Qty
SSOP
DB
20
2000
Eco Plan
Lead/Ball Finish
(2)
TBD
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
Call TI
Call TI
(4)
-40 to 85
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE OUTLINE
DB0020A
SSOP - 2 mm max height
SCALE 2.000
SMALL OUTLINE PACKAGE
C
8.2
TYP
7.4
A
0.1 C
PIN 1 INDEX AREA
SEATING
PLANE
18X 0.65
20
1
2X
7.5
6.9
NOTE 3
5.85
10
11
20X
B
5.6
5.0
NOTE 4
SEE DETAIL A
(0.15) TYP
0.38
0.22
0.1
C A B
2 MAX
0.25
GAGE PLANE
0 -8
0.95
0.55
0.05 MIN
DETAIL A
A 15
TYPICAL
4214851/B 08/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-150.
www.ti.com
EXAMPLE BOARD LAYOUT
DB0020A
SSOP - 2 mm max height
SMALL OUTLINE PACKAGE
SYMM
20X (1.85)
(R0.05) TYP
1
20
20X (0.45)
SYMM
18X (0.65)
11
10
(7)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 10X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
EXPOSED METAL
EXPOSED METAL
0.07 MAX
ALL AROUND
NON-SOLDER MASK
DEFINED
(PREFERRED)
0.07 MIN
ALL AROUND
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
15.000
4214851/B 08/2019
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DB0020A
SSOP - 2 mm max height
SMALL OUTLINE PACKAGE
20X (1.85)
SYMM
(R0.05) TYP
1
20
20X (0.45)
SYMM
18X (0.65)
10
11
(7)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 10X
4214851/B 08/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
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