Texas Instruments | Mod Reliability for CC2564MODx, CC3x00MOD, CC3x20MODx, CC3x2MODAx, and WL18xxMOD | Application notes | Texas Instruments Mod Reliability for CC2564MODx, CC3x00MOD, CC3x20MODx, CC3x2MODAx, and WL18xxMOD Application notes

Texas Instruments Mod Reliability for CC2564MODx, CC3x00MOD, CC3x20MODx, CC3x2MODAx, and WL18xxMOD Application notes
Application Report
SWRA570 – August 2019
Module Reliability for CC2564MODx, CC2650MODA,
CC3x00MOD, CC3x20MODx, CC3x20MODAx,
CC3x35MODx, and WL18xxMOD Devices
Seong Kim/Rizwan Murji
ABSTRACT
The purpose of this application note is to present Texas Instruments™ module reliability data based on an
independent assessment of MTBF and FIT rates using the Telcordia SR-332 Reliability Prediction
Procedure for Electronic Equipment methodology.
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Contents
Introduction ...................................................................................................................
Reliability ......................................................................................................................
Considerations for Specific Components in the Module ................................................................
References ...................................................................................................................
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Reliability Curve .............................................................................................................. 2
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FIT Rate as a Function of Temperature .................................................................................. 2
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List of Figures
List of Tables
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MTBF and FIT Rate Links for CC3x00MOD Modules .................................................................. 3
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MTBF and FIT Rate Links for CC3120MOD, CC3x20MODx, and CC3x20MODAx Modules ..................... 4
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MTBF and FIT Rate Links for CC3135MOD and CC3x35MODx Modules
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..........................................
MTBF and FIT Rate Links for CC2564MODx Modules ................................................................
MTBF and FIT Rate Links for the CC2650MODA Module ............................................................
MTBF and FIT Rate Links for WL18xxMOD Modules ..................................................................
MTBF and FIT Rate Links for WL18x7MOD Modules ..................................................................
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Trademarks
Texas Instruments, SimpleLink are trademarks of Texas Instruments.
Bluetooth is a registered trademark of Bluetooth SIG, Inc.
All other trademarks are the property of their respective owners.
SWRA570 – August 2019
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Module Reliability for CC2564MODx, CC2650MODA, CC3x00MOD,
CC3x20MODx, CC3x2MODAx, CC3x35MODx, and WL18xxMOD Devices
Copyright © 2019, Texas Instruments Incorporated
1
Introduction
1
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Introduction
The purpose of this application note is to present Texas Instruments™ module reliability data based on an
independent assessment of MTBF and FIT rates using the Telcordia SR-332 Reliability Prediction
Procedure for Electronic Equipment methodology.
2
Reliability
Failure Rate
Reliability is the probability of meeting specifications or requirements over time. This is often measured in
failure in time (FIT). The FIT rate is the number of failures in 1,000,000,000 device operating hours and is
a time-dependent value. Figure 1 shows a reliability curve.
Early life
failure region
Useful life region
Wear-out region
Time
Figure 1. Reliability Curve
FIT
Application temperature, voltage, and activity can have a large impact on the intrinsic or wear-out
associated with an electronic system. As the temperature, voltage, and activity level increases, the overall
product life expectancy would be expected to decrease (see Figure 2). Finding the proper balance in
product performance versus reliability expectations is critical in optimizing the application goals.
-40
-20
0
20
40
Temperature (qC)
60
80
100
Figure 2. FIT Rate as a Function of Temperature
2
Module Reliability for CC2564MODx, CC2650MODA, CC3x00MOD,
CC3x20MODx, CC3x2MODAx, CC3x35MODx, and WL18xxMOD Devices
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Considerations for Specific Components in the Module
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3
Considerations for Specific Components in the Module
TI and non-TI components are included in the modules' bill of materials and were selected based on their
ambient operating temperature range requirements.
In addition, TI performed reliability testing on all TI ICs and their modules. Qualification reports for
products are available upon request.
As an independent assessment of MTBF and FIT rates, Telcordia SR-332 Reliability Prediction Procedure
for Electronic Equipment methodology was applied to the modules' bill of materials. The Telcordia method
is based on generic fail rate data based on component types. Limitations of this model are:
• It is based on generic data for component types used in the module
• It is not specific to the actual end equipment design and application
NOTE: This information is provided solely for convenience and does not extend or modify the
warranty provided under TI’s standard terms and conditions for semiconductor products.
3.1
3.1.1
SimpleLink™ Wi-Fi Modules
CC3x00 Modules
The CC3x00 modules are designed to operate in an ambient temperature range of –20°C to +70°C.
Design analysis of the CC3x00 SimpleLink™ integrated circuit in the CC3x00 modules shows that the
silicon is capable of operating for up to 17,500 hours at an ambient temperature of up to +85°C. During
this analysis, the TX duty cycle (power amplifier ON time) is assumed to be 20% of the time. For the
remaining 80% of the time, the device is assumed to be in sleep mode (refer to CC3100 SimpleLink™ WiFi® Network Processor, Internet-of-Things Solution for MCU Applications and CC3200 SimpleLink™ WiFi® and Internet-of-Things Solution, a Single-Chip Wireless MCU for further information).
Note that the IC contains an internal temperature sensor to monitor the critical junction temperatures
within the IC for excessive temperatures. At 120°C ±5°C, Wi-Fi activity will reduce to maintain reliability of
the IC.
Table 1 lists the links to the steady-state MTBF and FIT rates for the CC3x00MOD modules.
Table 1. MTBF and FIT Rate Links for CC3x00MOD Modules
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Module
Document Link
CC3100MOD
CC3100MOD Reliability Data - Reliability Estimate
CC3200MOD
CC3200MOD Reliability Data - Reliability Estimate
Module Reliability for CC2564MODx, CC2650MODA, CC3x00MOD,
CC3x20MODx, CC3x2MODAx, CC3x35MODx, and WL18xxMOD Devices
Copyright © 2019, Texas Instruments Incorporated
3
Considerations for Specific Components in the Module
3.1.2
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CC3x20 Modules
The CC3x20 modules are designed to operate in an ambient temperature range of –40°C to +85°C.
Design analysis of the CC3x20 SimpleLink™ integrated circuit in the CC3x20 modules shows that the
silicon is capable of operating for up to 87,600 hours at an ambient temperature of up to +85°C. During
this analysis, the TX duty cycle (power amplifier ON time) is assumed to be 10% of the time. For the
remaining 90% of the time, the device is assumed to be in sleep, hibernate, or shutdown mode (refer to
CC3120 SimpleLink™ Wi-Fi® Wireless Network Processor, Internet-of-Things Solution for MCU
Applications and CC3220 SimpleLink™ Wi-Fi® Wireless and Internet-of-Things Solution, a Single-Chip
Wireless MCU for further information).
Note that the IC contains an internal temperature sensor to monitor the critical junction temperatures
within the IC for excessive temperatures. At 120°C ±5°C, Wi-Fi activity will reduce to maintain reliability of
the IC.
Table 2 lists the links to the steady-state MTBF and FIT rates for the CC3x20MOD, CC3x20MODx, and
CC3x20MODAx modules.
Table 2. MTBF and FIT Rate Links for CC3120MOD, CC3x20MODx, and CC3x20MODAx Modules
3.1.3
Module
Document Link
CC3120MOD
CC3120MOD Reliability Data - Reliability Estimate
CC3220MODS
CC3220MODS Reliability Data - Reliability Estimate
CC3220MODAS
CC3220MODAS Reliability Data - Reliability Estimate
CC3220MODSF
CC3220MODSF Reliability Data - Reliability Estimate
CC3220MODASF
CC3220MODASF Reliability Data - Reliability Estimate
CC3x35 Modules
The CC3x35 modules are designed to operate in an ambient temperature range of –40°C to +85°C.
Design analysis of the CC3x35 SimpleLink™ integrated circuit in the CC3x35 modules shows that the
silicon is capable of operating for up to 87,600 hours at an ambient temperature of up to +85°C. During
this analysis, the TX duty cycle (power amplifier ON time) is assumed to be 10% of the time. For the
remaining 90% of the time, the device is assumed to be in sleep, hibernate, or shutdown mode (refer to
CC3135 SimpleLink™ Wi-Fi® Dual-Band Network Processor, Internet-of-Things Solution for MCU
Applications and CC3235 SimpleLink™ Wi-Fi® Dual-Band Single-Chip Wireless MCU for further
information).
Note that the IC contains an internal temperature sensor to monitor the critical junction temperatures
within the IC for excessive temperatures. At 120°C ±5°C, Wi-Fi activity will reduce to maintain reliability of
the IC.
Table 3. MTBF and FIT Rate Links for CC3135MOD and CC3x35MODx Modules
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Module
Document Link
CC3135MOD
CC3135MOD Reliability Data - Reliability Estimate
CC3235MODS
CC3235MODS Reliability Data - Reliability Estimate
CC3235MODSF
CC3235MODSF Reliability Data - Reliability Estimate
Module Reliability for CC2564MODx, CC2650MODA, CC3x00MOD,
CC3x20MODx, CC3x2MODAx, CC3x35MODx, and WL18xxMOD Devices
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Considerations for Specific Components in the Module
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3.2
3.2.1
Dual-Mode Bluetooth® Modules
CC2564 Modules
The CC2564MODx modules are designed to operate in an ambient temperature range of –30°C to
+85°C. The modules are capable of operating for up to 15,400 hours at an ambient temperature of up
to +85°C. During this analysis, the TX duty cycle (power amplifier ON time) is assumed to be 25% of
the time. For the remaining 75% of the time, the device is assumed to be in sleep mode. Refer to
CC2564MODx Dual-Mode Bluetooth® Module for further information.
Table 4 lists the links to the steady-state MTBF and FIT rates for the CC2564MODx modules.
Table 4. MTBF and FIT Rate Links for CC2564MODx Modules
3.2.2
Module
Document Link
CC2564MODN
CC2564MODN MTBF Estimate
CC2564MODA
CC2564MODA MTBF Estimate
CC2650MODA Modules
The CC2650MODA modules are designed to operate in an ambient temperature range of –40°C to +85°C.
The modules are capable of operating for up to 15,400 hours at an ambient temperature of up to +85°C.
During this analysis, the TX duty cycle (power amplifier ON time) is assumed to be 25% of the time. For
the remaining 75% of the time, the device is assumed to be in sleep mode. Refer to CC2650MODA
SimpleLink™ Bluetooth® low energy Wireless MCU Module for further information.
Table 5 lists the link to the steady-state MTBF and FIT rates for the CC2650MODA module.
Table 5. MTBF and FIT Rate Links for the CC2650MODA Module
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Module
Document Link
CC2650MODA
CC2650MODA MTBF Estimate
Module Reliability for CC2564MODx, CC2650MODA, CC3x00MOD,
CC3x20MODx, CC3x2MODAx, CC3x35MODx, and WL18xxMOD Devices
Copyright © 2019, Texas Instruments Incorporated
5
Considerations for Specific Components in the Module
3.3
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WiLink 8 Modules
The WL18xxMOD modules are designed to operate in an ambient temperature range of –20°C to +70°C.
The modules are capable of operating for up to 20,000 hours at when the internal junction temperature of
the WL18xx IC is at 120°C. Refer to WL18xxMOD WiLink™ 8 Single-Band Combo Module – Wi-Fi® ,
Bluetooth® , and Bluetooth Low Energy (LE) for further information.
Table 6 lists the links to the steady-state MTBF and FIT rates for the WL18xxMOD modules.
Table 6. MTBF and FIT Rate Links for WL18xxMOD Modules
Module
Document Link
WL1801MOD
WL1801MOD MTBF Estimate
WL1805MOD
WL1805MOD MTBF Estimate
WL1831MOD
WL1831MOD MTBF Estimate
WL1835MOD
WL1835MOD MTBF Estimate
Note that the IC contains an internal temperature sensor to monitor the critical junction temperatures
within the IC for excessive temperatures. At 120°C ±5°C, Wi-Fi activity will reduce to maintain reliability of
the IC.
3.3.1
WL18x7MOD Industrial Dual-Band Modules
The WL18x7MOD modules are designed to operate in an ambient temperature range of –40°C to +85°C.
The modules are capable of operating for up to 20,000 hours at when the internal junction temperature of
the WL18x7 IC is at 120°C. During this analysis, the TX duty cycle (power amplifier ON time) is assumed
to be 25% of the time. For the remaining 75% of the time, the device is assumed to be in sleep mode.
Additional operating hours for other junction temperatures can be found at WL18x7MOD WiLink™ 8 DualBand Industrial Module – Wi-Fi® , Bluetooth® , and Bluetooth Low Energy (LE).
Table 7 lists the links to the steady-state MTBF and FIT rates for the WL18x7MOD modules.
Table 7. MTBF and FIT Rate Links for WL18x7MOD Modules
Module
Document Link
WL1807MOD
WL1807MOD Reliability Data - Reliability Estimate
WL1837MOD
WL1837MOD Reliability Data - Reliability Estimate
Note that the IC contains an internal temperature sensor to monitor the critical junction temperatures
within the IC for excessive temperatures. At 120°C ±5°C, Wi-Fi activity will reduce to maintain reliability of
the IC.
4
References
Reliability Prediction Methods for Electronic Products
6
Module Reliability for CC2564MODx, CC2650MODA, CC3x00MOD,
CC3x20MODx, CC3x2MODAx, CC3x35MODx, and WL18xxMOD Devices
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Revision History
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Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Date
Revision
August 2019
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Description
Initial release
Revision History
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