Texas Instruments | CC1190 Evaluation Module for 868 MHz | Application notes | Texas Instruments CC1190 Evaluation Module for 868 MHz Application notes

Texas Instruments CC1190 Evaluation Module for 868 MHz Application notes
Application Report
SWRA477 – February 2015
CC1190 Evaluation Module for 868 MHz
Torstein Ermesjø
ABSTRACT
The CC1190 is a range extender for 850-950 MHz RF transceivers, transmitters, and wireless
microcontrollers (MCUs). It increases the link budget by providing a power amplifier (PA) for increased
output power and a low-noise amplifier (LNA) with low noise figure for improved receiver sensitivity, in
addition to switches and RF matching for simple design of high performance wireless systems.
Contents
1
Absolute Ratings .............................................................................................................
2
Operating Conditions .......................................................................................................
3
Electrical Characteristics ....................................................................................................
4
Design Details ................................................................................................................
5
Radiated Performance ......................................................................................................
6
Control Pins...................................................................................................................
7
References ...................................................................................................................
Appendix A
Schematic ............................................................................................................
2
2
2
3
4
4
4
5
List of Tables
1
Operating Conditions ........................................................................................................ 2
2
Electrical Characteristics With SAW Filter in Rx and Tx Path
2
3
Electrical Characteristics Without SAW Filter in Rx and Tx Path
3
4
........................................................
.....................................................
CC1190 Control Pins ........................................................................................................
4
All trademarks are the property of their respective owners.
SWRA477 – February 2015
Submit Documentation Feedback
CC1190 Evaluation Module for 868 MHz
Copyright © 2015, Texas Instruments Incorporated
1
Absolute Ratings
1
www.ti.com
Absolute Ratings
The absolute maximum ratings and operating conditions listed in the CC1190 data sheet [1] must be
followed at all times. Stress exceeding one or more of these limiting values may cause permanent
damage to any of the devices.
2
Operating Conditions
Table 1. Operating Conditions
3
Parameter
Min
Max
Unit
Operating Frequency
850
950
MHz
Operating Supply Voltage
2.0
3.7
V
Operating Temperature
-40
+85
°C
Electrical Characteristics
Table 2. Electrical Characteristics With SAW Filter in Rx and Tx Path
Parameter
Test Conditions
Typ
Unit
Tc=25°C, VDD = 3 V, fRF = 869.525 MHz, HGM = ‘1’ unless otherwise noted.
Receive current
PIN = -40 dBm
3.7
mA
Transmit current
PIN = 10 dBm, POUT = 25.5 dBm
358
mA
PIN = 13 dBm, POUT = 25.8 dBm
379
mA
RF Receive with SAW filter
Gain PIN= -40 dBm
7.1
dB
2.0 V – 3.6 V, PIN = -40 dBm
0.5
dB
Gain
PIN = -20 dBm
23
dB
Maximum output power
PIN = 13 dBm, VDD = 3.6 V
27
dBm
Output power, POUT
PIN = -10 dBm
13.5
dBm
PIN = 0 dBm
22.4
dBm
PIN = 6 dBm
24.9
dBm
PIN = 10 dBm
25.5
dBm
dBm
Gain variation over power supply
RF Transmit with SAW filter
2
PIN = 13 dBm
25.8
Power Added Efficiency, PAE
PIN = 10 dBm
30
%
Output power variation over power supply
2.0 V – 3.6 V, PIN = 10 dBm
5.1
dB
Output power variation over temperature
-40° - 85°, PIN = 10 dBm
1.8
dB
Second harmonic power
PIN = 13 dBm
-38
dBm
Third harmonic power
PIN = 13 dBm
-42
dBm
CC1190 Evaluation Module for 868 MHz
SWRA477 – February 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
Design Details
www.ti.com
Table 3. Electrical Characteristics Without SAW Filter in Rx and Tx Path
Parameter
Test Conditions
Typ
Unit
Tc=25°C, VDD = 3 V, fRF = 869.525 MHz, HGM = ‘1’ unless otherwise noted.
Receive current
PIN = -40 dBm
3.7
mA
Transmit current
PIN = 10 dBm, POUT = 25.5 dBm
375
mA
Gain
PIN= -40 dBm
10.5
dB
Gain variation over power supply
2.0 V – 3.6 V, PIN = -40 dBm
0.5
dB
Gain
PIN = -20 dBm
25.7
dB
Maximum output power
PIN = 13 dBm, VDD = 3.6 V
26.9
dBm
Output power, POUT
PIN = -10 dBm
15.7
dBm
PIN = 0 dBm
23.4
dBm
PIN = 6 dBm
25.1
dBm
dBm
RF Receive without SAW filter
RF Transmit without SAW filter
PIN = 10 dBm
25.5
Power added efficiency, PAE
PIN = 10 dBm
30
%
Output power variation over power supply
2.0 V – 3.6 V, PIN = 10 dBm
5.1
dB
Output power variation over temperature
-40° - 85°, PIN = 10 dBm
1.8
dB
Second harmonic power
PIN = 10 dBm
-38
dBm
Third harmonic power
PIN = 10 dBm
-41
dBm
When a SAW filter is used the input power to the board could be higher than without due to the
attenuation in the SAW filter. Max input power on the CC1190 pins is 10 dBm.
The Tx measurements were done with a signal generator. The harmonics are then generated by the
CC1190 PA going into compression and the SAW filter at the input will not influence this.
4
Design Details
For information on the schematic, see Appendix A.
• You can select whether an SMA (mount R21) or a PCB antenna (mount R22) should be used as
output.
• J1 (SMA connector) is intended to be used as input when a SAW filter is needed at the PA input/LNA
output. This is dependent on the phase noise of the device using CC1190 as a PA in Tx and the
blocking requirements for the system in Rx. (1)
• J2 (SMA connector) should be used when a SAW filter is not needed.
• R103 can be removed in cases where PA_IN and LNA_OUT are used independent of each other.
• C111 and L111 are added to provide better matching to the selected SAW filter.
• The mounted SAW filter has a center frequency equal to 869 MHz.
• The shield is required to pass radiated testing.
• In a final product, it is recommended to consider system ESD protection and, as a minimum, add an
ESD diode to the antenna input if it is possible for you to touch the antenna.
(1)
The maximum output power depends on the regulation the system has to comply to and the modulation, frequency, data rate and phase
noise of the source used as input to the CC1190 PA.
SWRA477 – February 2015
Submit Documentation Feedback
CC1190 Evaluation Module for 868 MHz
Copyright © 2015, Texas Instruments Incorporated
3
Radiated Performance
5
www.ti.com
Radiated Performance
For radiated testing, it is possible to use either an external antenna connected to the SMA connector or
the PCB antenna.
The radiated performance was tested in an anechoic chamber with the W5017 antenna from Pulse, which
is part of the CC1120DK, as well the PCB antenna. The PCB antenna is tuned to resonate @869 MHz
when the board is positioned in RF neutral surroundings. The antenna needs to be retuned in a final
product as the board surroundings (for example, plastic enclosure, casing) will detune the antenna. The
efficiency of the PCB antenna is dependent on the size of the ground plane and efficiency equal to [3] is
possible given a ground plane with dimensions larger than ¼ wave length.
A +7.2 dBm CW was applied from a signal generator directly to the CC1190 input. With the W5017
antenna, this gave 24.7 dBm total radiated power; for the PCB antenna, the total radiated power is 21.0
dBm. In both cases, the second and third harmonics are below –30 dBm.
6
Control Pins
The three digital control pins (PA_EN, LNA_EN, HGM) have built-in level-shifting functionality, meaning
that if CC1190 is operating from a 3.6 V supply voltage, the control pins will still sense > 1.6 V signals as
logical '1'.
Table 4. CC1190 Control Pins
7
PA_EN
LNA_EN
HGM
0
0
Don’t care
Mode of operation
0
1
0
Rx Low Gain Mode
0
1
1
Rx High Gain Mode
1
0
0
Tx Low Gain Mode
1
0
1
Tx High Gain Mode
Power down
References
1. CC1190 850–950 MHz RF Front End Data Sheet (SWRS089)
2. ETSI EN 300 220-1 v2.4.1:
http://www.etsi.org/deliver/etsi_en/300200_300299/30022001/02.04.01_60/en_30022001v020401p.pdf
3. Miniature Helical PCB Antenna for 868 MHz or 915/920 MHz:
http://www.ti.com/lit/an/swra416/swra416.pdf
4
CC1190 Evaluation Module for 868 MHz
Copyright © 2015, Texas Instruments Incorporated
SWRA477 – February 2015
Submit Documentation Feedback
SWRA477 – February 2015
Submit Documentation Feedback
1
2
5
2
5
3
4
3
4
2
1
J2
SMA-10V21-TGG
1
0
Copyright © 2015, Texas Instruments Incorporated
FIDU5
FIDU4
0
FIDU2
R101
DNM
R102
R112
DNM
C2
10uF
FIDU1
R111
BLM15HG102SN1
L1
J1
SMA-10V21-TGG
C1
DNM_0402
VDD_EXTERNAL
1
3
2
GND
4
6
5
FIDU6
FIDU3
B39871B3725U410
FL1
DNM
R113
VDD_CC1190
PA_EN_CC1190
LNA_EN_CC1190
HGM_CC1190
2
4
6
8
10
12
14
16
18
20
10nH
L111
2
1
3
5
7
9
11
13
15
17
19
1
3
9
12
17
10
14
11
BMIS-202
1 2 3 4 5 6 7 8
SC1
PA_EN
LNA_EN
HGM
LNA_IN
TR_SW
PA_OUT
VDD_LNA
VDD_PA2
VDD_PA1
8
7
6
5
4
2
13
15
16
PA_EN_EXTERNAL
LNA_EN_EXTERNAL
HGM_EXTERNAL
CC1190
GND
GND
GND
GND
GND
LNA_OUT
BIAS
PA_IN
U1
VDD_EXTERNAL
3.3k
R141
R103
0
BB02-HP201-KB3-060A00
P1
0.8pF
C111
1
C131
15pF
R61
10k
15nH
L161
47
R151
1.5nH
L131
R71
10k
1
1
R81
10k
2
2
12pF
C52
C161
27pF
2
47pF
C21
L21
22nH
1
VDD_CC1190
2.7nH
L25
2
12pF
C22
L22
7.5nH
1
1
2
C27
47pF
C23
3.3pF
C29
1uF
1
2.9nH
L23
2.4pF
C24
2.7pF
C210
C28
1nF
2
C25
7.5pF
1
9.1nH
L24
2
5
4
R21
0
DNM
R22
2
C26
DNM_0402
1
J3
SMA-10V21-TGG
3
1pF
C211
2
L26
10nH
1
1
ANTENNA
A1
Appendix A
SWRA477 – February 2015
Schematic
Figure 1. CC1190EM_868 MHz Schematic
CC1190 Evaluation Module for 868 MHz
5
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
Was this manual useful for you? yes no
Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Download PDF

advertising